英文参考文献

英文参考文献
英文参考文献

Progress in Computers

Prestige Lecture delivered to IEE, Cambridge, on 5 February 2004

Maurice Wilkes

Computer Laboratory

University of Cambridge

The first stored program computers began to work around 1950. The one we built in Cambridge, the EDSAC was first used in the summer of 1949.

These early experimental computers were built by people like myself with varying backgrounds. We all had extensive experience in electronic engineering and were confident that that experience would stand us in good stead. This proved true, although we had some new things to learn. The most important of these was that transients must be treated correctly; what would cause a harmless flash on the screen of a television set could lead to a serious error in a computer.

As far as computing circuits were concerned, we found ourselves with an embarass de richess. For example, we could use vacuum tube diodes for gates as we did in the EDSAC or pentodes with control signals on both grids, a system widely used elsewhere. This sort of choice persisted and the term families of logic came into use. Those who have worked in the computer field will remember TTL, ECL and CMOS. Of these, CMOS has now become dominant.

In those early years, the IEE was still dominated by power engineering and we had to fight a number of major battles in order to get radio engineering along with the rapidly developing subject of electronics.dubbed in the IEE light current electrical engineering.properly recognised as an activity in its own right. I remember that we had some difficulty in organising a conference because the power engineers’ ways of doing things were not our ways. A minor source of irritation was that all IEE published papers were expected to start with a lengthy statement of earlier practice, something difficult to do when there was no earlier practice

Consolidation in the 1960s

By the late 50s or early 1960s, the heroic pioneering stage was over and the computer field was starting up in real earnest. The number of computers in the world had increased and they were much more reliable than the very early ones . To those years we can ascribe the first steps in high level languages and the first operating systems. Experimental time-sharing was beginning, and ultimately computer graphics was to come along.

Above all, transistors began to replace vacuum tubes. This change presented a formidable challenge to the engineers of the day. They had to forget what they knew about circuits and start again. It can only be said that they measured up superbly well to the challenge and that the change could not have gone more smoothly.

Soon it was found possible to put more than one transistor on the same bit of silicon, and this was the beginning of integrated circuits. As time went on, a sufficient level of integration was reached for one chip to accommodate enough transistors for a small number of gates or flip flops. This led to a range of chips known as the 7400 series. The gates and flip flops were independent of one another and each had its own pins. They could be connected by off-chip wiring to make a

computer or anything else.

These chips made a new kind of computer possible. It was called a minicomputer. It was something less that a mainframe, but still very powerful, and much more affordable. Instead of having one expensive mainframe for the whole organisation, a business or a university was able to have a minicomputer for each major department.

Before long minicomputers began to spread and become more powerful. The world was hungry for computing power and it had been very frustrating for industry not to be able to supply it on the scale required and at a reasonable cost. Minicomputers transformed the situation.

The fall in the cost of computing did not start with the minicomputer; it had always been that way. This was what I meant when I referred in my abstract to inflation in the computer industry

‘going the other way’. As time goes on people get more for their money, not less.

Research in Computer Hardware.

The time that I am describing was a wonderful one for research in computer hardware. The user of the 7400 series could work at the gate and flip-flop level and yet the overall level of integration was sufficient to give a degree of reliability far above that of discreet transistors. The researcher, in a university or elsewhere, could build any digital device that a fertile imagination could conjure up. In the Computer Laboratory we built the Cambridge CAP, a full-scale minicomputer with fancy capability logic.

The 7400 series was still going strong in the mid 1970s and was used for the Cambridge Ring, a pioneering wide-band local area network. Publication of the design study for the Ring came just before the announcement of the Ethernet. Until these two systems appeared, users had mostly been content with teletype-based local area networks.

Rings need high reliability because, as the pulses go repeatedly round the ring, they must be continually amplified and regenerated. It was the high reliability provided by the 7400 series of chips that gave us the courage needed to embark on the project for the Cambridge Ring.

The RISC Movement and Its Aftermath

Early computers had simple instruction sets. As time went on designers of commercially available machines added additional features which they thought would improve performance. Few comparative measurements were done and on the whole the choice of features depended upon the designer’s intuition.

In 1980, the RISC movement that was to change all this broke on the world. The movement opened with a paper by Patterson and Ditzel entitled The Case for the Reduced Instructions Set Computer.

Apart from leading to a striking acronym, this title conveys little of the insights into instruction set design which went with the RISC movement, in particular the way it facilitated pipelining, a system whereby several instructions may be in different stages of execution within the processor at the same time. Pipelining was not new, but it was new for small computers The RISC movement benefited greatly from methods which had recently become available for estimating the performance to be expected from a computer design without actually implementing it. I refer to the use of a powerful existing computer to simulate the new design. By the use of simulation, RISC advocates were able to predict with some confidence that a good RISC design would be able to out-perform the best conventional computers using the same circuit technology. This prediction was ultimately born out in practice.

Simulation made rapid progress and soon came into universal use by computer designers. In consequence, computer design has become more of a science and less of an art. Today, designers

expect to have a roomful of, computers available to do their simulations, not just one. They refer

to such a roomful by the attractive name of computer farm.

The x86 Instruction Set

Little is now heard of pre-RISC instruction sets with one major exception, namely that of the Intel 8086 and its progeny, collectively referred to as x86. This has become the dominant instruction set and the RISC instruction sets that originally had a considerable measure of success are having to put up a hard fight for survival.

This dominance of x86 disappoints people like myself who come from the research

wings.both academic and industrial.of the computer field. No doubt, business considerations have a lot to do with the survival of x86, but there are other reasons as well. However much we research oriented people would like to think otherwise. high level languages have not yet eliminated the use of machine code altogether. We need to keep reminding ourselves that there is much to be said for strict binary compatibility with previous usage when that can be attained. Nevertheless, things might have been different if Intel’s major attempt to produce a good RISC chip had been more successful. I am referring to the i860 (not the i960, which was something different). In many ways the i860 was an excellent chip, but its software interface did not fit it to be used in a workstation.

There is an interesting sting in the tail of this apparently easy triumph of the x86 instruction set. It proved impossible to match the steadily increasing speed of RISC processors by direct implementation of the x86 instruction set as had been done in the past. Instead, designers took a leaf out of the RISC book; although it is not obvious, on the surface, a modern x86 processor chip contains hidden within it a RISC-style processor with its own internal RISC coding. The incoming x86 code is, after suitable massaging, converted into this internal code and handed over to the RISC processor where the critical execution is performed.

In this summing up of the RISC movement, I rely heavily on the latest edition of Hennessy and Patterson’s books on computer design as my supporting authority; see in particular Computer Architecture, third edition, 2003, pp 146, 151-4, 157-8.

The IA-64 instruction set.

Some time ago, Intel and Hewlett-Packard introduced the IA-64 instruction set. This was primarily intended to meet a generally recognised need for a 64 bit address space. In this, it followed the lead of the designers of the MIPS R4000 and Alpha. However one would have thought that Intel would have stressed compatibility with the x86; the puzzle is that they did the exact opposite.

Moreover, built into the design of IA-64 is a feature known as predication which makes it incompatible in a major way with all other instruction sets. In particular, it needs 6 extra bits with each instruction. This upsets the traditional balance between instruction word length and information content, and it changes significantly the brief of the compiler writer.

In spite of having an entirely new instruction set, Intel made the puzzling claim that chips based on IA-64 would be compatible with earlier x86 chips. It was hard to see exactly what was meant.

Chips for the latest IA-64 processor, namely, the Itanium, appear to have special hardware for compatibility. Even so, x86 code runs very slowly.

Because of the above complications, implementation of IA-64 requires a larger chip than is required for more conventional instruction sets. This in turn implies a higher cost. Such at any rate, is the received wisdom, and, as a general principle, it was repeated as such by Gordon Moore

when he visited Cambridge recently to open the Betty and Gordon Moore Library. I have, however, heard it said that the matter appears differently from within Intel. This I do not understand. But I am very ready to admit that I am completely out of my depth as regards the economics of the semiconductor industry.

AMD have defined a 64 bit instruction set that is more compatible with x86 and they appear to be making headway with it. The chip is not a particularly large one. Some people think that this is what Intel should have done. [Since the lecture was delivered, Intel have announced that they will market a range of chips essentially compatible with those offered by AMD.] The Relentless Drive towards Smaller Transistors

The scale of integration continued to increase. This was achieved by shrinking the original transistors so that more could be put on a chip. Moreover, the laws of physics were on the side of the manufacturers. The transistors also got faster, simply by getting smaller. It was therefore possible to have, at the same time, both high density and high speed.

There was a further advantage. Chips are made on discs of silicon, known as wafers. Each wafer has on it a large number of individual chips, which are processed together and later separated. Since shrinkage makes it possible to get more chips on a wafer, the cost per chip goes down.

Falling unit cost was important to the industry because, if the latest chips are cheaper to make as well as faster, there is no reason to go on offering the old ones, at least not indefinitely. There can thus be one product for the entire market.

However, detailed cost calculations showed that, in order to maintain this advantage as shrinkage proceeded beyond a certain point, it would be necessary to move to larger wafers. The increase in the size of wafers was no small matter. Originally, wafers were one or two inches in diameter, and by 2000 they were as much as twelve inches. At first, it puzzled me that, when shrinkage presented so many other problems, the industry should make things harder for itself by going to larger wafers. I now see that reducing unit cost was just as important to the industry as increasing the number of transistors on a chip, and that this justified the additional investment in foundries and the increased risk.

The degree of integration is measured by the feature size, which, for a given technology, is best defined as the half the distance between wires in the densest chips made in that technology. At the present time, production of 90 nm chips is still building up

Suspension of Law

In March 1997, Gordon Moore was a guest speaker at the celebrations of the centenary of the discovery of the electron held at the Cavendish Laboratory. It was during the course of his lecture that I first heard the fact that you can have silicon chips that are both fast and low in cost described as a violation of Murphy’s law.or Sod’s law as it is usually called in the UK. Moore said that experience in other fields would lead you to expect to have to choose between speed and cost, or

to compromise between them. In fact, in the case of silicon chips, it is possible to have both.

In a reference book available on the web, Murphy is identified as an engineer working on human acceleration tests for the US Air Force in 1949. However, we were perfectly familiar with the law in my student days, when we called it by a much more prosaic name than either of those mentioned above, namely, the Law of General Cussedness. We even had a mock examination question in which the law featured. It was the type of question in which the first part asks for a definition of some law or principle and the second part contains a problem to be solved with the aid of it. In our case the first part was to define the Law of General Cussedness and the second

was the problem;A cyclist sets out on a circular cycling tour. Derive an equation giving the direction of the wind at any time.

The single-chip computer

At each shrinkage the number of chips was reduced and there were fewer wires going from one chip to another. This led to an additional increment in overall speed, since the transmission of signals from one chip to another takes a long time.

Eventually, shrinkage proceeded to the point at which the whole processor except for the caches could be put on one chip. This enabled a workstation to be built that out-performed the fastest minicomputer of the day, and the result was to kill the minicomputer stone dead. As we all know, this had severe consequences for the computer industry and for the people working in it.

From the above time the high density CMOS silicon chip was Cock of the Roost. Shrinkage went on until millions of transistors could be put on a single chip and the speed went up in proportion.

Processor designers began to experiment with new architectural features designed to give extra speed. One very successful experiment concerned methods for predicting the way program branches would go. It was a surprise to me how successful this was. It led to a significant speeding up of program execution and other forms of prediction followed

Equally surprising is what it has been found possible to put on a single chip computer by way of advanced features. For example, features that had been developed for the IBM Model 91.the giant computer at the top of the System 360 range.are now to be found on microcomputers Murphy’s Law remained in a state of suspension. No longer did it make sense to build experimental computers out of chips with a small scale of integration, such as that provided by the 7400 series. People who wanted to do hardware research at the circuit level had no option but to design chips and seek for ways to get them made. For a time, this was possible, if not easy Unfortunately, there has since been a dramatic increase in the cost of making chips, mainly because of the increased cost of making masks for lithography, a photographic process used in the manufacture of chips. It has, in consequence, again become very difficult to finance the making of research chips, and this is a currently cause for some concern.

The Semiconductor Road Map

The extensive research and development work underlying the above advances has been made possible by a remarkable cooperative effort on the part of the international semiconductor industry.

At one time US monopoly laws would probably have made it illegal for US companies to participate in such an effort. However about 1980 significant and far reaching changes took place in the laws. The concept of pre-competitive research was introduced. Companies can now collaborate at the pre-competitive stage and later go on to develop products of their own in the regular competitive manner.

The agent by which the pre-competitive research in the semi-conductor industry is managed is known as the Semiconductor Industry Association (SIA). This has been active as a US organisation since 1992 and it became international in 1998. Membership is open to any organisation that can contribute to the research effort.

Every two years SIA produces a new version of a document known as the International Technological Roadmap for Semiconductors (ITRS), with an update in the intermediate years. The first volume bearing the title ‘Roadmap’ was issued in 1994 but two reports, written in 1992 and distributed in 1993, are regarded as the true beginning of the series.

Successive roadmaps aim at providing the best available industrial consensus on the way that the industry should move forward. They set out in great detail.over a 15 year horizon. the targets that must be achieved if the number of components on a chip is to be doubled every eighteen months.that is, if Moore’s law is to be maintained.-and if the cost per chip is to fall.

In the case of some items, the way ahead is clear. In others, manufacturing problems are foreseen and solutions to them are known, although not yet fully worked out; these areas are coloured yellow in the tables. Areas for which problems are foreseen, but for which no manufacturable solutions are known, are coloured red. Red areas are referred to as Red Brick Walls.

The targets set out in the Roadmaps have proved realistic as well as challenging, and the progress of the industry as a whole has followed the Roadmaps closely. This is a remarkable achievement and it may be said that the merits of cooperation and competition have been combined in an admirable manner.

It is to be noted that the major strategic decisions affecting the progress of the industry have been taken at the pre-competitive level in relative openness, rather than behind closed doors. These include the progression to larger wafers.

By 1995, I had begun to wonder exactly what would happen when the inevitable point was reached at which it became impossible to make transistors any smaller. My enquiries led me to visit ARPA headquarters in Washington DC, where I was given a copy of the recently produced Roadmap for 1994. This made it plain that serious problems would arise when a feature size of 100 nm was reached, an event projected to happen in 2007, with 70 nm following in 2010. The year for which the coming of 100 nm (or rather 90 nm) was projected was in later Roadmaps moved forward to 2004 and in the event the industry got there a little sooner.

I presented the above information from the 1994 Roadmap, along with such other information that I could obtain, in a lecture to the IEE in London, entitled The CMOS end-point and related topics in Computing and delivered on 8 February 1996.

The idea that I then had was that the end would be a direct consequence of the number of electrons available to represent a one being reduced from thousands to a few hundred. At this point statistical fluctuations would become troublesome, and thereafter the circuits would either fail to work, or if they did work would not be any faster. In fact the physical limitations that are now beginning to make themselves felt do not arise through shortage of electrons, but because the insulating layers on the chip have become so thin that leakage due to quantum mechanical tunnelling has become troublesome.

There are many problems facing the chip manufacturer other than those that arise from fundamental physics, especially problems with lithography. In an update to the 2001 Roadmap published in 2002, it was stated that the continuation of progress at present rate will be at risk as we approach 2005 when the roadmap projects that progress will stall without research

break-throughs in most technical areas “. This was the most specific statement about the Red Brick Wall, that had so far come from the SIA and it was a strong one. The 2003 Roadmap reinforces this statement by showing many areas marked red, indicating the existence of problems for which no manufacturable solutions are known.

It is satisfactory to report that, so far, timely solutions have been found to all the problems encountered. The Roadmap is a remarkable document and, for all its frankness about the problems looming above, it radiates immense confidence. Prevailing opinion reflects that confidence and there is a general expectation that, by one means or another, shrinkage will continue, perhaps

down to 45 nm or even less.

However, costs will rise steeply and at an increasing rate. It is cost that will ultimately be seen as the reason for calling a halt. The exact point at which an industrial consensus is reached that the escalating costs can no longer be met will depend on the general economic climate as well as on the financial strength of the semiconductor industry itself.。

Insulating layers in the most advanced chips are now approaching a thickness equal to that of 5 atoms. Beyond finding better insulating materials, and that cannot take us very far, there is nothing we can do about this. We may also expect to face problems with on-chip wiring as wire cross sections get smaller. These will concern heat dissipation and atom migration. The above problems are very fundamental. If we cannot make wires and insulators, we cannot make a computer, whatever improvements there may be in the CMOS process or improvements in semiconductor materials. It is no good hoping that some new process or material might restart the merry-go-round of the density of transistors doubling every eighteen months.

I said above that there is a general expectation that shrinkage would continue by one means or another to 45 nm or even less. What I had in mind was that at some point further scaling of CMOS as we know it will become impracticable, and the industry will need to look beyond it.

Since 2001 the Roadmap has had a section entitled emerging research devices on

non-conventional forms of CMOS and the like. Vigorous and opportunist exploitation of these possibilities will undoubtedly take us a useful way further along the road, but the Roadmap rightly distinguishes such progress from the traditional scaling of conventional CMOS that we have been used to.

Advances in Memory Technology

Unconventional CMOS could revolutionalize memory technology. Up to now, we have relied on DRAMs for main memory. Unfortunately, these are only increasing in speed marginally as shrinkage continues, whereas processor chips and their associated cache memory continue to double in speed every two years. The result is a growing gap in speed between the processor and the main memory. This is the memory gap and is a current source of anxiety. A breakthrough in memory technology, possibly using some form of unconventional CMOS, could lead to a major advance in overall performance on problems with large memory requirements, that is, problems which fail to fit into the cache.

Perhaps this, rather than attaining marginally higher basis processor speed will be the ultimate role for non-conventional CMOS.

Shortage of Electrons

Although shortage of electrons has not so far appeared as an obvious limitation, in the long term it may become so. Perhaps this is where the exploitation of non-conventional CMOS will lead us. However, some interesting work has been done.notably by Haroon Amed and his team working in the Cavendish Laboratory.on the direct development of structures in which a single electron more or less makes the difference between a zero and a one. However very little progress has been made towards practical devices that could lead to the construction of a computer. Even with exceptionally good luck, many tens of years must inevitably elapse before a working computer based on single electron effects can be contemplated.

英文参考文献标准格式

英文参考文献标准格式:论文参考文献格式规范 也可以在标点.之后加上一个空格,但一定要保证所有的项目空格个数一致一、参考文献的类型 参考文献(即引文出处)的类型以单字母方式标识,具体如下: [M]--专著,著作 [C]--论文集(一般指会议发表的论文续集,及一些专题论文集,如《***大学研究生学术论文集》 [N]-- 报纸文章 [J]--期刊文章:发表在期刊上的论文,尽管有时我们看到的是从网上下载的(如知网),但它也是发表在期刊上的,你看到的电子期刊仅是其电子版 [D]--学位论文:不区分硕士还是博士论文 [R]--报告:一般在标题中会有"关于****的报告"字样 [S]-- 标准 [P]--专利 [A]--文章:很少用,主要是不属于以上类型的文章 [Z]--对于不属于上述的文献类型,可用字母"Z"标识,但这种情况非常少见 常用的电子文献及载体类型标识: [DB/OL] --联机网上数据(database online) [DB/MT] --磁带数据库(database on magnetic tape) [M/CD] --光盘图书(monograph on CDROM) [CP/DK] --磁盘软件(computer program on disk)

[J/OL] --网上期刊(serial online) [EB/OL] --网上电子公告(electronic bulletin board online) 很显然,标识的就是该资源的英文缩写,/前面表示类型,/后面表示资源的载体,如OL表示在线资源 二、参考文献的格式及举例 1.期刊类 【格式】[序号]作者.篇名[J].刊名,出版年份,卷号(期号)起止页码. 【举例】 [1] 周融,任志国,杨尚雷,厉星星.对新形势下毕业设计管理工作的思考与实践[J].电气电子教学学报,2003(6):107-109. [2] 夏鲁惠.高等学校毕业设计(论文)教学情况调研报告[J].高等理科教育,2004(1):46-52. [3] Heider, E.R.& D.C.Oliver. The structure of color space in naming and memory of two languages [J]. Foreign Language Teaching and Research, 1999, (3): 62 67. 2.专著类 【格式】[序号]作者.书名[M].出版地:出版社,出版年份:起止页码. 【举例】 [4] 刘国钧,王连成.图书馆史研究[M].北京:高等教育出版社,1979:15-18,31. [5] Gill, R. Mastering English Literature [M]. London: Macmillan, 1985: 42-45. 3.报纸类 【格式】[序号]作者.篇名[N].报纸名,出版日期(版次). 【举例】 [6] 李大伦.经济全球化的重要性[N]. 光明日报,1998-12-27(3).

中英文论文参考文献标准格式 超详细

超详细中英文论文参考文献标准格式 1、参考文献和注释。按论文中所引用文献或注释编号的顺序列在论文正文之后,参考文献之前。图表或数据必须注明来源和出处。 (参考文献是期刊时,书写格式为: [编号]、作者、文章题目、期刊名(外文可缩写)、年份、卷号、期数、页码。参考文献是图书时,书写格式为: [编号]、作者、书名、出版单位、年份、版次、页码。) 2、附录。包括放在正文内过份冗长的公式推导,以备他人阅读方便所需的辅助性数学工具、重复性数据图表、论文使用的符号意义、单位缩写、程序全文及有关说明等。 参考文献(即引文出处)的类型以单字母方式标识,具体如下: [M]--专著,著作 [C]--论文集(一般指会议发表的论文续集,及一些专题论文集,如《***大学研究生学术论文集》[N]-- 报纸文章 [J]--期刊文章:发表在期刊上的论文,尽管有时我们看到的是从网上下载的(如知网),但它也是发表在期刊上的,你看到的电子期刊仅是其电子版 [D]--学位论文:不区分硕士还是博士论文 [R]--报告:一般在标题中会有"关于****的报告"字样 [S]-- 标准 [P]--专利 [A]--文章:很少用,主要是不属于以上类型的文章 [Z]--对于不属于上述的文献类型,可用字母"Z"标识,但这种情况非常少见 常用的电子文献及载体类型标识: [DB/OL] --联机网上数据(database online) [DB/MT] --磁带数据库(database on magnetic tape) [M/CD] --光盘图书(monograph on CDROM) [CP/DK] --磁盘软件(computer program on disk) [J/OL] --网上期刊(serial online) [EB/OL] --网上电子公告(electronic bulletin board online) 很显然,标识的就是该资源的英文缩写,/前面表示类型,/后面表示资源的载体,如OL表示在线资源 二、参考文献的格式及举例 1.期刊类 【格式】[序号]作者.篇名[J].刊名,出版年份,卷号(期号)起止页码. 【举例】 [1] 周融,任志国,杨尚雷,厉星星.对新形势下毕业设计管理工作的思考与实践[J].电气电子教学学报,2003(6):107-109. [2] 夏鲁惠.高等学校毕业设计(论文)教学情况调研报告[J].高等理科教育,2004(1):46-52. [3] Heider, E.R.& D.C.Oliver. The structure of color space in naming and memory of two languages [J]. Foreign Language Teaching and Research, 1999, (3): 62 67. 2.专著类

中英文参考文献格式

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英语论文参考文献精选3篇 英语论文参考文献精选1篇 英文及其它语种的文献在前,中文文献在后,参照以下标准执行。 期刊论文 Bolinger, D. 1965. The atomization of word meaning [J]. Language 41 (4): 555-573. 朱永生,2006,名词化、动词化与语法隐喻[J],《外语教学与研究》(2):83-90。 论文集论文 Bybee, J. 1994. The grammaticization of zero: Asymmetries in tense and aspect systems [A]. In W. Pagliuca (ed.). Perspectives on Grammaticalization [C]. Amsterdam: John Benjamins. 235-254. 文秋芳,2003a,英语学习者动机、观念、策略的变化规律与特点 [A]。载文秋芳、王立非(编),《英语学习策略实证研究》[C]。西安:陕西师范大学出版社。255-259。 网上文献 Jiang, Yan. 2000. The Tao of verbal communication: An Elementary textbook on pragmatics and discourse analysis [OL]. (accessed 30/04/2006). 王岳川,2004,当代传媒中的网络文化与电视批评[OL], (2005年11月18日读取)。 专著 Bloomfield, L. 1933. Language [M]. New York: Holt. 吕叔湘、朱德熙,1952,《语法修辞讲话》[M]。北京:中国青年出版社。 译著 Nedjalkov, V. P. (ed.). 1983/1988. Typology of Resultative Constructions, trans. Bernard Comrie [C]. Amsterdam: John Benjamins. 赵元任,1968/1980,《中国话的文法》(A Grammar of Spoken Chinese)[M],丁邦新译。英语论文参考文献精选3篇英语论文参考文献精选3篇。香港:香港中文大学出版社。 编著/论文集

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参考文献建议 1、资料查询建议大家可以利用图书馆数据库: 中文资料查阅中文数据库:中国知识资源总库、读秀学术搜索、万方医药信息系统等相对权威的学术资源; 英文资料查阅英文数据库:Science Direct, EBSCO, PUBMED, MOSBY’S Nursing Consult(护理人员专用库),Springer LINk等,(读秀也有英文资料) 2、若是网络资源,可以参考一些官方的网站,如卫生部,卫生厅等政府网站, 其中会有一些政府政策文件、统计数据等。 参考文献格式要求(注意:红色字体显示是较常用的) 一、参考文献的类型及其标识 参考文献类型专 著 论 文 集 报 纸 文 章 期 刊 文 章 学 位 论 文 报 告 标 准 专 利 析出 文献 其 它 数据 库 计算机 程序 电子 公告 文献类 型标识 M C N J D R S P A Z DB CP EB 二、各类参考文献条目的编排格式和示例 a.专著、论文集、学位论文、报告 [序号]主要责任者.文献题名[文献类型标识].出版地:出版者,出版年.起止页码(任选). [1]刘国钧,陈绍业,王凤翥.图书馆目录[M].北京:高等教育出版社,1957.15-18. [2]辛希孟.信息技术和信息服务国际研讨会论文集:A集[C].北京:中国社会科学出版社,1994. [3]张筑生.微分半动力系统的不变集[D].北京:北京大学数学系数学研究所,1983. [4]冯西桥.核反应堆压力管道和压力容器的LBB分析[R].北京:清华大学核能技术设计研究院,1997.

b.期刊文章 [序号]主要责任者.文献题名[J].刊名,年,卷(期):起止页码. [5]何龄修.读顾城《南明史》[J].中国史研究,1998,(3):167-173. [6]金显贺,王昌长,王忠东,等.一种用于在线检测局部放电的数字滤波技术[J].清华大学学报(自然科学版),1993,33(4):62-67. c.论文集中的析出文献 [序号]析出文献主要责任者.析出文献题名[A].原文献主要责任者(任选).原文献题名[C].出版地:出版者,出版年.析出文献起止页码. [7]钟文发.非线性规划在可燃毒物配置中的应用[A].赵玮.运筹学的理论和应用——中国运筹学会第五届大会论文集[C].西安:西安电子科技大学出版社,1996. 468-471 d.报纸文章 [序号]主要责任者.文献题名[N].报纸名,出版日期(版次) [8]谢希德.创造学习的新思路[N].人民日报,1998-12-25(10) e.国际、国家标准 [序号]标准编号,标准名称[S]. [9]GB/T 16159-1996,汉语拼音正词法基本规则[S]. f.专利 [序号]专利所有者.专利题名[P].专利国别:专利号,出版日期 [10]姜锡洲.一种温热外敷药制备方案[P].中国专利:881056073,1989-07-26 g.电子文献 [序号]主要责任者.电子文献题名[电子文献和载体类型标识].电子文献的出处或可获得地址,发表或更新日期/引用日期(任选) [11]王明亮.关于中国学术期刊标准化数据库系统工程的进展[EB/OL].https://www.360docs.net/doc/9114053257.html,/pub/wml.txt/980810-2.html'1998-08-16/1998-10-04 [12]万锦坤.中国大学学报论文文摘(1983-1993).英文版[DB/CD].北京:中国大百科全书出版社,1996 h.各种未定义类型的文献 [序号]主要责任者.文献题名[Z].出版地:出版者,出版年.

英文引用及参考文献格式要求

英文引用及参考文献格式要求 一、参考文献的类型 参考文献(即引文出处)的类型以单字母方式标识,具体如下: M——专著C——论文集N——报纸文章 J——期刊文章D——学位论文R——报告 对于不属于上述的文献类型,采用字母“Z”标识。 对于英文参考文献,还应注意以下两点: ①作者姓名采用“姓在前名在后”原则,具体格式是:姓,名字的首字母.如:MalcolmRichardCowley应为:Cowley,M.R.,如果有两位作者,第一位作者方式不变,&之后第二位作者名字的首字母放在前面,姓放在后面,如:FrankNorris与IrvingGordon应为:Norris,F.&I.Gordon.; ②书名、报刊名使用斜体字,如:MasteringEnglishLiterature,EnglishWeekly。 二、参考文献的格式及举例 1.期刊类 【格式】[序号]作者.篇名[J].刊名,出版年份,卷号(期号):起止页码. 【举例】 [1]王海粟.浅议会计信息披露模式[J].财政研究,2004,21(1):56-58. [2]夏鲁惠.高等学校毕业论文教学情况调研报告[J].高等理科教育,2004(1):46-52. [3]Heider,E.R.&D.C.Oliver.Thestructureofcolorspaceinnamingandmemo ryoftwolanguages[J].ForeignLanguageTeachingandResearch,1999,(3):62–6 7. 2.专著类 【格式】[序号]作者.书名[M].出版地:出版社,出版年份:起止页码. 【举例】[4]葛家澍,林志军.现代西方财务会计理论[M].厦门:厦门大学出版社,2001:42. [5]Gill,R.MasteringEnglishLiterature[M].London:Macmillan,1985:42-45. 3.报纸类 【格式】[序号]作者.篇名[N].报纸名,出版日期(版次). 【举例】 [6]李大伦.经济全球化的重要性[N].光明日报,1998-12-27(3). [7]French,W.BetweenSilences:AVoicefromChina[N].AtlanticWeekly,198 715(33). 4.论文集 【格式】[序号]作者.篇名[C].出版地:出版者,出版年份:起始页码. 【举例】 [8]伍蠡甫.西方文论选[C].上海:上海译文出版社,1979:12-17. [9]Spivak,G.“CantheSubalternSpeak?”[A].InC.Nelson&L.Grossberg(e ds.).VictoryinLimbo:Imigism[C].Urbana:UniversityofIllinoisPress,1988, pp.271-313.

中英文论文参考文献标准格式

中英文论文参考文献标准格式 参考文献(即引文出处)的类型以单字母方式标识,具体如下:? [M]--专着,着作? [C]--论文集(一般指会议发表的论文续集,及一些专题论文集,如《***大学研究生学术论文集》? [N]-- 报纸文章? [J]--期刊文章:发表在期刊上的论文,尽管有时我们看到的是从网上下载的(如知网),但它也是发表在期刊上的,你看到的电子期刊仅是其电子版? [D]--学位论文:不区分硕士还是博士论文? [R]--报告:一般在标题中会有"关于****的报告"字样? [S]-- 标准? [P]--专利? [A]--文章:很少用,主要是不属于以上类型的文章? [Z]--对于不属于上述的文献类型,可用字母"Z"标识,但这种情况非常少见? 常用的电子文献及载体类型标识:? [DB/OL] --联机网上数据(database online)? [DB/MT] --磁带数据库(database on magnetic tape)? [M/CD] --光盘图书(monograph on CDROM)? [CP/DK] --磁盘软件(computer program on disk)? [J/OL] --网上期刊(serial online)? [EB/OL] --网上电子公告(electronic bulletin board online)? 很显然,标识的就是该资源的英文缩写,/前面表示类型,/后面表示资源的载体,如OL表示在线资源? 二、参考文献的格式及举例? 1.期刊类? 【格式】[序号]作者.篇名[J].刊名,出版年份,卷号(期号)起止页码.? 【举例】? [1] 周融,任志国,杨尚雷,厉星星.对新形势下毕业设计管理工作的思考与实践[J].电气电子教学学报,2003(6):107-109.? [2] 夏鲁惠.高等学校毕业设计(论文)教学情况调研报告[J].高等理科教育,2004(1):46-52.? ? 2.专着类? 【格式】[序号]作者.书名[M].出版地:出版社,出版年份:起止页码.? 【举例】? [4] 刘国钧,王连成.图书馆史研究[M].北京:高等教育出版社,1979:15-18,31.? [5] Gill, R. Mastering English Literature [M]. London: Macmillan, 1985: 42-45.? 3.报纸类? 【格式】[序号]作者.篇名[N].报纸名,出版日期(版次).? 【举例】? [6] 李大伦.经济全球化的重要性[N]. 光明日报,1998-12-27(3).? [7] French, W. Between Silences: A Voice from China[N]. Atlantic Weekly, 1987-8-15(33).?

英语论文参考文献格式

用Times New Roman。每一条目顶格, 如某一条目超过一行,从第二行起“悬挂缩进”2字符。参考文献中所有标点与符号均在英文状态下输入,标点符号后空一格。 参考文献条目排列顺序:英文文献、中文文献、网络文献。分别按作者姓氏字母顺序排列。文献前不用序号。 1)英文参考文献 (1)专著与编著 排列顺序为:作者姓、名、专著名、出版地、出版社、出版年。 例如: Brinkley, Alan. The Unfinished Nation. New York: Knopf, 1993. 专著名中如果还包含其他著作或作品名,后者用斜体。 例如: Dunn, Richard J ed. Charlotte Bront?: Jane Eyre. New York: Norton, 1971. A.两个至三个作者 第一作者的姓在前,名在后,中间用逗号隔开;其余作者名在前,姓在后,中间无逗号;每个作者之间用逗号隔开,最后一个作者的姓名前用“and”,后用句号。 例如: Rowe, Richard, and Larry Jeffus. The Essential Welder: Gas Metal Arc Welding Classroom Manual. Albany: Delmar, 2000. B. 三个以上作者 第一作者姓名(姓在前,名在后,中间加逗号)后接“et al.”,其他作者姓名省略。 例如: Randall, John et al. Fishes of the Great Barrier Reef and Coral Sea. Honolulu: University of Hawaii Press, 1997. C. 同一作者同一年出版的不同文献,参照下例: Widdowson, Henry G. EIL: Squaring the Circles. A Reply. London: Lomgman, 1998a. Widdowson, Henry G. Communication and Community. Cambridge: Cambridge University Press, 1998b. (2)论文集 参照下例: Thompson, Pett. “Modal Verbs in Academic Writing”. In Ben Kettlemann & Marko, Henry ed. Teaching and Learning by Doing Corpus Analysis. New York: Rodopi, 2002: 305-323. (3)百科全书等参考文献 参照下例: Fagan, Jeffrey. “Gangs and Drugs”.Encyclopedia of Drugs, Alcohol and Addictive Behavior. New York: Macmillan, 2001. (4)学术期刊论文 参照下例: Murphy, Karen. “Meaningful Connections: Using Technology in Primary Classrooms”. Young Children. 2003, (6): 12-18. (5)网络文献 参照下例: ----“Everything You Ever Wanted to Know About URL” . . 2)中文参考文献

英语优秀论文参考文献格式要求

英语优秀论文参考文献格式要求

————————————————————————————————作者:————————————————————————————————日期:

英语专业本科毕业论文 参考文献格式要求 I.文内引用 (一)直接引用 1.引用中的省略 原始资料的引用:在正文中直接引用时,应给出作者、年份,并用带括号的数字标出页码。若有任何资料省略,使用英文时,应用3个省略号在句中标出(…),中文用6个(……);若两句间的资料省略,英文应用4个省略号标出(‥‥),中文用6个(……)。若要在直接引用插入自己的解释,应使用方括号[ ]。若在资料中有什么错误拼写、错误语法或标点错误会使读者糊涂,应在引用后立即插入[sic],中文用[原文如此]。下面是一些示例: 例一:The DSM IV defines the disorder [dysthymic] as being in a chronically depressed mood that occurs for "most of the day more days than not for at least two years (Criterion A) .... In children, the mood may be irritable rather than depressed, and the required minimum duration is only one year" (APA, 1994, p. 345). 例二:Issac (1995) states that bipolar disorder "is not only uncommon but may be the most diagnostic entity in children and adolescents in similar settings .... and may be the most common diagnosis in adolescents who are court-remanded to such settings" (p.275). 2.大段落引用 当中文引用超过160字时,不使用引号,而使用“块”的形式(引用起于新的一行,首行缩进4个空格,两端对齐,之后每行都缩进)。 当英文引用超过40字时,不使用引号,而使用“块”的形式(引用起于新的一行,首行缩进5个空格,左对齐,之后每行都缩进)。 Elkind (1978) states:

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