PCB常用英语汇总
PCB基本英语
PCB基本英语基本英文词汇流程Board cut 开料Carbon printing 碳油印刷Inner dry film 内层干膜Peelable blue mask 蓝胶Inner etching 内层蚀刻ENIG(Electroless nickel immersion gold) 沉镍金Inner dry film stripping 内层干膜退膜 HAL(hot air leveling)喷锡AOI（Automatic Optical Inspection）自动光学检测OSP（Organic solderability preservative）有机保焊Pressing 压板Punching 啤板Drilling 钻孔Profiling 外形加工Desmear 除胶渣，去钻污E-Test 电性测试PTH 镀通孔，沉铜FQC(final quality control) 最终品质控制Panel plating 整板电镀FQA(Final quality audit) 最终品质保证Outer dry film 外层干膜Packing 包装Etching 蚀刻IPQA(In-process quality audit) 流程QATin stripping 退锡IPQC(In-process quality control) 流程QC EQC（QC after etching）蚀检QCIQC(Incoming quality control) 来料检查Solder mask 感阻MRB(material review board) 材料评审委员会Component mark 字符QA(Quality assurance) 品质保证Physical Laboratory 物理实验室QC(Quality control) 品质控制Chemistry Laboratory 化学实验室Document control center 文件控制中心2nd Drilling 二钻Routing 锣板，铣板Brown oxidation 棕化Waste water treatment 污水处理V-cut V坑WIP（work in process）半成品Store/stock 仓库(Finished goods) 成品概述Printed Circuit Board 印制电路板Flexible Printed Circuit, FPC 软板Double-Side Printed Board 双面板IPC（The Institute for Interconnecting and Packing Electronic Circuits）电子电路互连与封装协会CPAR（Corrective & Preventive Action Request）要求纠正预防措施Flammability Rate 燃性等级Characteristic impedance 特性阻抗BUM（Build-up multilayer）积层多层板Date Code周期代码CCL（Copper-clad laminate）覆铜板Ionic contamination 离子性污染Acceptance Quality Level (AQL) 允收水平HDI（High density interconnecting）高密度互连板Base Material 基材Radius 半径Capacity 生产能力Diameter 直径Capability 工艺能力PPM(Parts Per Million) 百万分之几CAM（computer-aided manufacturing) 计算机辅助制造Underwriters Laboratories Inc. 美国保险商实验所CAD (computer-aided design) 计算机辅助设计Statistical Process Control 统计过程控制Specification 规格，规范Via 导通孔Dimension 尺寸Buried /blind via 埋/盲孔Tolerance 公差T ooling hole 定位孔Oven 焗炉Output/throughput 产量湿流程PTH（plated through hole）镀通孔（俗称沉铜）Acid cleaning 酸性除油PP(Panel Plating) 板电Acid dip 酸洗Pattern plating 图电Pre-dip 预浸Line width 线宽Alkaline cleaning 碱性除油Spacing 线隙Flux 松香Deburring 去毛刺（沉铜前磨板） Hot air leveling 喷锡Carbon treatment 碳处理Skip plating 跳镀，漏镀Track/conductor 导线Undercut 侧蚀Aspect ratio深径比Water rinsing 水洗Etch Factor 蚀刻因子Transportation 行车Back Light Test 背光测试Rack 挂架Pink ring 粉红圈Maintenance 保养干流程Hole location 孔位Annular ring 孔环Image Transfer 图象转移Component Side(C/S) 元件面Artwork 底片Solder Side(S/S) 焊接面Mylar 胶片Matte Solder Mask 哑绿油Silkscreen/legend/Component Mark文字Hole breakout 破孔Fiducial mark 基点，对光点 Scrubbing 磨板Expose 曝光Developing 显影内层制作Core material 内层芯板Thermal pad 散热PADPre-preg PP片Resin content 树脂含量Kraft Paper 牛皮纸Brown oxidation 棕化Lay up 排版Black Oxidation 黑化Registration 对位Base material 板材Delamination 分层其它Wicking 灯芯效应Hole size 孔径(尺寸) Yield 良品率T ouch Up 修理Warp and Twist 板曲度Solvent Test 溶剂测试Peel off 剥离Company Logo 公司标识Tape Test 胶纸试验UL Mark UL 标记Cosmetic 外观Function 功能Tin/Lead Ratio 锡/铅比例Reliability Tests 可靠性试验Hole Wall Roughness 孔壁粗糙度Base Copper Thickness 底铜厚度PCB专业英语(PCB SPECIAL ENGLISH)=Printed Circuit Board 电路板=Computer aided manufacture 计算机辅助焊盘ring 焊环=automatic optical inspection 自动光学检测of free 免费=work in process 在线板=document control center 文控中心字符=Component Side =Top Side （顶层）元件面=Solder Side =Bottom Side （底层）焊锡面Plated 电金，镀金Plated 电镍，镀镍Gold 沉金=沉镍金Ink Print 印碳油Report 切片报告，横切面报告=Cross-out 打"X"报告（客户称）拼板，（生产线称）工作板标记，UL 标记code 生产周期单元，单位外形，轮廓By Routing 锣(铣)外形Film 湿菲林,湿绿油,湿膜槽,方坑Material=Base Laminate 基材,板料 =V-score V形槽成品市场部File GERBER文件LOGO UL标记=Electric Open/Short Test 电子测试=Purchase Order 订单公差,Flexible Board 刚性,软性板cut 开料baking 焗板钻孔=Plated Through Hole 镀通孔,沉铜 plating 板面电镀,全板电镀Image 图象,线路图形plating 线路电镀蚀板,蚀刻=Solder Mask 防焊,阻焊,绿油=Solder Resist 防焊,阻焊,绿油finger 金手指丝印字符=HASL=Hot air(Solder)leveling 热风整平喷锡锣板,铣板冲板,啤板=final quality checking 终检,最后检查=final quality audit 最后稽查(抽查)出货松香金,Cu铜,Ni镍,Pb铅,Tn锡,Tin-lead锡铅合金 free 无铅=compliance of certificate 材料证明书=cross section 微切片,横切片gold 沉镍金=punch die 模具,啤模=manufacture instruction 制作批示=quality assurance 品质保证=computer aided design 计算机辅助设计bit size钻咀直径and twist 板弯和板曲击打,孔数邦定,点焊coupon 测试模块(科邦)copper 抢电流铜皮tab 工艺边away tab 工艺边=ground 地线,大铜皮edge 孔边,孔内hole 邮票孔天坯,型板,钻孔样板(首板)film 干菲林,干膜=liquid photo image 液态感光=湿绿油多层板=surface mouted device 贴片,表面贴装器件=surface mouted technology 表面贴装技术mask=blue gel 蓝胶hole 工艺孔,管位,定位孔,工具孔mask 测光点,光学对位点,对光点,电眼foil 铜箔尺寸负的,positive正的gold 闪镀金,镀薄金department 工程部date 交货期斜边=gap 间隙,气隙,线隙PCB的各层定义及描述为了方便与印制板厂家的技术沟通，提高对PCB的技术认知一致度，特在此将我司常用PCB的有关板层特性做简单说明，请爱好者参考此说明进行设计和制造。
PCB基本英语.
流程Board cut 开料Carbon printing 碳油印刷Inner dry film 内层干膜Peelable blue mask 蓝胶Inner etching 内层蚀刻ENIG(Electroless nickel immersion gold) 沉镍金Inner dry film stripping 内层干膜退膜HAL(hot air leveling) 喷锡AOI（Automatic Optical Inspection）自动光学检测OSP（Organic solderability preservative）有机保焊Pressing 压板Punching 啤板Drilling 钻孔Profiling 外形加工Desmear 除胶渣，去钻污 E-Test 电性测试PTH 镀通孔，沉铜FQC(final quality control) 最终品质控制Panel plating 整板电镀FQA(Final quality audit) 最终品质保证Outer dry film 外层干膜Packing 包装Etching 蚀刻IPQA(In-process quality audit) 流程QA Tin stripping 退锡IPQC(In-process quality control) 流程QC EQC（QC after etching）蚀检QCIQC(Incoming quality control) 来料检查Solder mask 感阻MRB(material review board) 材料评审委员会Component mark 字符QA(Quality assurance) 品质保证Physical Laboratory 物理实验室QC(Quality control) 品质控制Chemistry Laboratory 化学实验室Document control center 文件控制中心2nd Drilling 二钻Routing 锣板，铣板Brown oxidation 棕化Waste water treatment 污水处理V-cut V坑WIP（work in process）半成品Store/stock 仓库 F.G(Finished goods) 成品概述Printed Circuit Board 印制电路板Flexible Printed Circuit, FPC 软板Double-Side Printed Board 双面板IPC（The Institute for Interconnecting and Packing Electronic Circuits）电子电路互连与封装协会CPAR（Corrective & Preventive Action Request）要求纠正预防措施Flammability Rate燃性等级Characteristic impedance 特性阻抗BUM（Build-up multilayer）积层多层板Date Code周期代码CCL（Copper-clad laminate）覆铜板Ionic contamination 离子性污染Acceptance Quality Level (AQL)允收水平HDI（High density interconnecting）高密度互连板Base Material基材Radius 半径Capacity 生产能力Diameter 直径Capability 工艺能力PPM(Parts Per Million) 百万分之几CAM（computer-aided manufacturing) 计算机辅助制造Underwriters Laboratories Inc. 美国保险商实验所CAD (computer-aided design) 计算机辅助设计Statistical Process Control 统计过程控制Specification 规格，规范Via 导通孔Dimension 尺寸Buried /blind via 埋/盲孔Tolerance 公差Tooling hole 定位孔Oven 焗炉Output/throughput 产量湿流程PTH（plated through hole）镀通孔（俗称沉铜）Acid cleaning 酸性除油PP(Panel Plating) 板电Acid dip 酸洗Pattern plating 图电Pre-dip 预浸Line width 线宽Alkaline cleaning 碱性除油Spacing 线隙Flux 松香Deburring 去毛刺（沉铜前磨板）Hot air leveling 喷锡Carbon treatment 碳处理Skip plating 跳镀，漏镀Track/conductor 导线Undercut 侧蚀Aspect ratio深径比Water rinsing水洗Etch Factor 蚀刻因子Transportation 行车Back Light Test背光测试Rack挂架Pink ring粉红圈Maintenance 保养干流程Hole location孔位Annular ring 孔环Image Transfer图象转移Component Side(C/S) 元件面Artwork 底片Solder Side(S/S) 焊接面Mylar 胶片Matte Solder Mask 哑绿油Silkscreen/legend/Component Mark文字Hole breakout 破孔Fiducial mark 基点，对光点Scrubbing 磨板Expose 曝光Developing 显影内层制作Core material 内层芯板Thermal pad 散热PAD Pre-preg PP片Resin content 树脂含量Kraft Paper牛皮纸Brown oxidation 棕化Lay up 排版Black Oxidation 黑化Registration 对位Base material 板材Delamination 分层其它Wicking灯芯效应Hole size 孔径(尺寸) Yield良品率Touch Up修理Warp and Twist 板曲度Solvent Test 溶剂测试Peel off 剥离Company Logo 公司标识Tape Test 胶纸试验UL Mark UL 标记Cosmetic 外观Function 功能Tin/Lead Ratio 锡/铅比例Reliability Tests 可靠性试验Hole Wall Roughness 孔壁粗糙度Base Copper Thickness 底铜厚度PCB专业英语(PCB SPECIAL ENGLISH)1.PCB=Printed Circuit Board 电路板2.CAM=Computer aided manufacture 计算机辅助3.Pad 焊盘4.Annular ring 焊环5.AOI=automatic optical inspection 自动光学检测6.Charge of free 免费7.WIP=work in process 在线板8.DCC=document control center 文控中心9.Legend 字符10.CS=Component Side =Top Side （顶层）元件面11.SS=Solder Side =Bottom Side （底层）焊锡面12.Gold Plated 电金，镀金13.Nickel Plated 电镍，镀镍14.Immersion Gold 沉金=沉镍金15.Carbon Ink Print 印碳油16.Microsection Report 切片报告，横切面报告17.X-out=Cross-out 打"X"报告18.Panel （客户称）拼板，（生产线称）工作板19.Marking 标记，UL 标记20.Date code 生产周期21.Unit 单元，单位22.Profile 外形，轮廓<outline>23.Profile By Routing 锣(铣)外形24.Wet Film 湿菲林,湿绿油,湿膜25.Slot 槽,方坑26.Base Material=Base Laminate 基材,板料27.V-out =V-score V形槽28.Finished 成品29.Marketing 市场部30.Gerber File GERBER文件31.UL LOGO UL标记32.E-Test=Electric Open/Short Test 电子测试33.PO=Purchase Order 订单34.Tolerance 公差35.Rigid,Flexible Board 刚性,软性板36.Board cut 开料37.Board baking 焗板38.Drill 钻孔39.PTH=Plated Through Hole 镀通孔,沉铜40.Panel plating 板面电镀,全板电镀41.Photo Image 图象,线路图形42.Pattern plating 线路电镀43.Etching 蚀板,蚀刻44.SM=Solder Mask 防焊,阻焊,绿油45.SR=Solder Resist 防焊,阻焊,绿油46.Gold finger 金手指47.Silkscreen 丝印字符48.HAL=HASL=Hot air(Solder)leveling 热风整平喷锡49.Routing 锣板,铣板50.Punching 冲板,啤板51.FOC=final quality checking 终检,最后检查52.FOA=final quality audit 最后稽查(抽查)53.Shippment 出货54.Flux 松香55.Au金,Cu铜,Ni镍,Pb铅,Tn锡,Tin-lead锡铅合金56.Lead free 无铅57.COC=compliance of certificate 材料证明书58.Microsection=cross section 微切片,横切片59.Chamical gold 沉镍金60.Mould=punch die 模具,啤模61.MI=manufacture instruction 制作批示62.QA=quality assurance 品质保证63.CAD=computer aided design 计算机辅助设计64.Drill bit size钻咀直径<diameter>65.Bow and twist 板弯和板曲66.Hit 击打,孔数67.Bonding 邦定,点焊68.Test coupon 测试模块(科邦)69.Thieving copper 抢电流铜皮70.Rail-web71.Break-up tab 工艺边72.Break away tab 工艺边73.GND=ground 地线,大铜皮74.Hole edge 孔边,孔内75.Stamp hole 邮票孔76.Template 天坯,型板,钻孔样板(首板)77.Dry film 干菲林,干膜78.LPI=liquid photo image 液态感光=湿绿油79.Multilayer 多层板80.SMD=surface mouted device 贴片,表面贴装器件81.SMT=surface mouted technology 表面贴装技术82.Peelable mask=blue gel 蓝胶83.Tooling hole 工艺孔,管位,定位孔,工具孔84.Fiducial mask 测光点,光学对位点,对光点,电眼85.Copper foil 铜箔86.Dimension 尺寸87.Nagative负的,positive正的88.Flash gold 闪镀金,镀薄金89.Engineering department 工程部90.Delivery date 交货期91.Bevelling 斜边92.Spacing=gap 间隙,气隙,线隙PCB的各层定义及描述为了方便与印制板厂家的技术沟通，提高对PCB的技术认知一致度，特在此将我司常用PCB的有关板层特性做简单说明，请爱好者参考此说明进行设计和制造。
PCB专业英译术语
PCB专业英译术语PCB（Printed Circuit Board，印刷电路板）是现代电子产品中最常用的一种重要的电路载体，其设计、生产和维修需要大量的技术术语支持。
本文将重点介绍PCB专业英译术语。
一、PCB基础术语1. PCB（Printed Circuit Board）：印刷电路板2. SMT（Surface Mount Technology）：表面贴装技术3. Through-hole Technology：通孔技术4. PTH（Plated Through Hole）：贯穿电解孔5. FR4：一种常用的印刷电路板基材材料，即玻璃纤维材料，通常由环氧树脂和玻璃纤维材料构成6. Pad：焊盘7. Trace：线路8. Via：垂直插孔9. Gerber file：Gerber文件格式，一种电路板设计文件格式10. BOM（Bill of Materials）：物料清单11. NC（Numerical Control）：数控12. DFM（Design for Manufacturability）：可制造性设计二、PCB制造过程相关术语1. CAM（Computer Aided Manufacturing）：计算机辅助制造2. Etch：蚀刻3. Silkscreen：丝网印刷4. Solder mask：焊盘油墨5. Plating：电镀6. HASL（Hot Air Solder Leveling）：热风焊盘处理7. OSP（Organic Solderability Preservatives）：有机可焊保护剂8. Gold Fingers：金手指，指电子产品中可进行插拔操作的特殊金属触点9. DIP（Dual In-line Package）：双列直插封装10. SOP（Small Outline Package）：小封装11. QFN（Quad Flat Package）：四角平封12. BGA（Ball Grid Array）：球网阵列13. PCBA（Printed Circuit Board Assembly）：印刷电路板装配三、PCB测试和维修相关术语1. AOI（Automated Optical Inspection）：自动光学检测2. X-ray Inspection：X光检测3. ICT（In-Circuit Test）：在线测试4. FCT（Functional Circuit Test）：功能测试5. Test point：测试点6. Defect：缺陷7. Repair：修复8. Rework：返工9. Troubleshooting：故障排除四、PCB设计相关术语1. EDA（Electronic Design Automation）：电子设计自动化2. Netlist：网表3. DRC（Design Rule Check）：设计规则检查4. DFM（Design for Manufacturing）：可制造性设计5. Gerber data：Gerber数据6. Simulation：仿真7. Library：元件库8. Footprint：封装9. Copper pour：铜质填充10. Via tenting：垂直插孔塞堵11. Blind vias：盲孔12. Buried vias：穿过孔五、总结本文介绍了PCB专业英译术语中的基础术语、PCB制造过程相关术语、PCB测试和维修相关术语以及PCB设计相关术语。
PCB工程部专业英语词汇
PCB工程部专业英文词汇31.小于3millessthan3mil32.高于3milmorethan3mil词汇33.压合结构stackingstructure或者stack_up1.板料:material34.附件：attachedfile2.最低限度:minimum或者min.35.样品：sample3.最大限度:maximum或者max.36.文档：Document4.基准点(零点)datumpoint37.答复：answer;reply5.周期Datecode38.规格：spec6.V-cut余厚V-cutremainthickness39.与...同样的：thesameas7.抢电铜皮（假铜）dummycopper40.前版本：previousversion(oldversion)8.实物板actualboard41.生产：production9.外形及尺寸错误dimensionerror42.确认：confirm10.异常情形errordatafile43.再次确认：confirmagain11.焊锡面与零件面对位偏差misregistration44.工程问题：engineeringquery（EQ）12.孔塞plughole45.尽快：assoonaspossible13.要求requirement46.生产文件：productionGerber14.缺少miss47.联系某人：contactsomebody15.偏公差uneventolerance48.提交样板：submitsample16.补偿compensation49.交货期：deliverydate17.表面处理surfacetreatment50.电测成本：ET（electricaltest）cost18.无铅喷锡LeadfreeHAL51.通断测试：Openandshorttesting19.金手指斜边bevelofG/F52.参考：referto20.制程能力processcapability53.IPC标准：IPCstandard21.建议,暗示suggest54.IPC二级：IPCclass222.确保ensure55.可接受的：acceptable23.满足,达到meet56.允许：permit24.为了inorderto57.制造：manufacture或者fabricate25.交货期deliverydate58.修改：revision26.绿油桥soldermaskbridge或者soldermaskdam59.公差：tolerance27.根据accordingto60.忽略：ignore28.单边3milperside3mil61.工具孔：toolinghole29.直径diameter62.安装孔：mountinghole30.半径radius63.元件孔：componenthole133.槽孔：slothole97.单面开窗：singlesidemaskopening34.邮票孔：snapoffhole或者stamphole98.补油：touchupsoldermask35.导通孔：viahole99.补线：trackwelds36.盲孔：blindviahole100.毛刺：burrs37.埋孔：buriedviahole101.去毛刺：deburr38.金属化孔：PTH(platedthroughhole)102.镀层厚度：platingthickness39.非金属化孔：NPTH(noplatedthroughhole)103.清洁度：cleanliness40.孔位：holelocation104.离子污染：ioniccontamination41.避免：avoid105.阻燃性等级：flammabilityretardantrating42.原设计：originaldesign106.黑化：blackoxidation43.修改：modify107.棕化：brownoxidation44.按原设计：followuporiginaldesign108.红化：redoxidation45.附边：wastetab,wastearea或者breakawaytab109.可焊性不良：poorsolderability46.铜条：copperstrip110.焊料：solder47.拼板：paneldrawing111.包装：packaging48.板厚：boardthickness112.角标：cornermark49.删除：remove(delete)113.特性阻抗：characteristicimpedance50.削铜：shavethecopper114.正像：positive51.露铜：copperexposure或者exposedcopper115.负片：negative52.光标点:fiducialmark116.镜像：mirror53.不同：bedifferentfrom(differfrom)117.线宽：linewidth或者tracewidth54.内弧：insideradius118.线距：linespacing或者tracespacing55.焊环：annularring119.做样：buildsample56.单板尺寸：singlesize120.按照：accordingto57.拼板尺寸：panelsize121.成品：finished58.铣,锣：routing122.做变更：makethechange59.铣刀：router或者Routingbit123.相类似：similarto60.楔形掏槽V-cut或者Vscoring124.规格：specification92.哑光：matt125.下移：shiftdown26.光亮的：glossy126.垂直地：vertically27.锡珠：solderball(solderplugs)127.水平的：horizontally28.阻焊：soldermask(solderresist)128.增大：increase29.阻焊开窗：soldermaskopening129.缩小：decrease2WORD格式61.表面处理：SurfaceFinishing163.刚性板：rigidboard62.波峰焊：wavesolder164.挠性板：flexibleboard63.钻孔数据：drillingdata165.刚挠板：flex-rigidboard64.标记：Logo166.铣：CNC(mill,routing)65.Ul标记：ULlogo,或者UlMarking167.冲：punching66.蚀刻标记：etchedmarking168.倒角：beveling67.周期：datecode169.斜面：chamfer68.翘曲：bowandtwist170.倒圆角：fillet69.外层：outerlayer或者externallayer171.尺寸：dimension70.内层：innerlayer或者internallayer172.材料：material71.顶层：toplayer173.介电常数：Dielectricconstant72.底层：bottomlayer174.菲林：film73.元件面：componentside175.成像：Imaging74.焊接面：solderside176.板镀：PanelPlating75.阻焊层：soldermasklayer177.图镀：PatternPlating76.字符层：legendlayer(silkscreenlayeroroverlayer)178.后清洗：FinalCleaning77.兰胶层：peelableSMlayer179.叠层：stackingstructure(stack-up)78.贴片层：pastemasklayer180.污染焊盘：contaminatepad79.碳油层：carbonlayer181.分孔图：drillchart或者drillmap80.外形层：outlinelayer(profilelayer)182.度数：degree81.白油：whiteink183.被⋯覆盖：becoveredwith82.绿油：greenink184.负公差：minustolerance83.喷锡：hotairleveling(HAL)185.标靶盘：targetpad84.电金,水金：flashgold186.外形公差：routingtolerance85.插头镀金：platedgoldedge-boardcontacts187.芯板：core86.金手指：Gold-finger188.半固化片Prepreg87.防氧化：Entek(OSP)189.阻抗线：impedancetrace88.沉金：Immersiongold(chem.Gold)190.评估e stimate89.沉锡：ImmersionTin(chem.Tin)191.玻纤显露FiberExposure90.沉银：ImmersionSilver(chem.silver)192.底铜b asecopper91.单面板：singlesidedboard193.工作搞workingGerber92.双面板：doublesidedboard194.原稿originalartwork93.多层板：multilayerboard195.放宽r elaxWORD格式94.挖空blanking或者cut-out229.树脂含量resincontent95.一般性阻焊油墨generalresistink230.排列电阻resistornetwork96.孔位错误misholelocation231.锣刀（铣刀）routingbit97.压合周期presscycle232.孔内沾文字S/Lonhole98.毛边serratededges233.孔内绿漆S/Monhole99.跳印skipprinting234.线路沾锡solderontrace100.气泡blistering235.金手指沾锡solderonG/F101.隔离焊盘isolatedpad236.废框scrap102.泪滴teardrops237.封孔处理sealing103.箭头arrows238.间距不足spacingnon-enough104.加大Enlarge239.靶位孔targethole105.压合周期presscycle240.测试线路testcircuit106.毛边serratededges241.热应力试验thermalstress107.跳印,漏印skipprinting242.厚度分布thicknessdistribution108.宽度与厚度的比值width-to-thicknessratio243.薄基板,内层板thincore109.调整adjust244.线路缺口及针孔tracknick&pinhole110.铜箔基板coppercladedlaminates245.裁切线trimline111.线路露铜copperexposure246.真平整trueleveling112.孔内异物dirtyhole247.真正位置的孔trueposition113.椭圆形ellipticalset248.万用型universal114.纤维突出fiberprotrusion249.气化室vaporizer115.填充料filler250.仓库warehouse116.互相连通interconnection251.契尖角wedgeangle117.改善方案implementation252.线细widthreduce118.板料使用率materialusefactor253.良率yield119.回路,网络network254.渗铜,渗入,灯芯效应wicking120.缺口nick255.允收acceptable121.氧化oxidation256.试样点couponlocation122.剥离(剥落)peelingoff257.经核准的，被认可的approved123.补线不良poortouch-up258.超越胜过,超过其他exceed124.品质等级qualityclassification259.牛皮纸kraftpaper125.对位孔registration260.孔壁破铜Holevoid126.拒收rejectable261.孔位破出HolebreakoutWORD格式PCB生产—经典流程—英文培训教程d-8铣靶(spotface)d-9去溢胶(resinflushremoval)E.减铜(CopperReduction)A.开料(CutLamination)e-1薄化铜(CopperReduction)a-1裁板(SheetsCutting)F.电镀(HorizontalElectrolyticPlating)a-2原物料发料(Panel)(ShearmaterialtoSize)f-1水平电镀(HorizontalElectro-Plating)(PanelPlating) B.钻孔(Drilling)f-2锡铅电镀(Tin-LeadPlating)(PatternPlating)b-1内钻(InnerLayerDrilling)f-3低于1mil(Lessthan1milThickness)b-2一次孔(OuterLayerDrilling)f-4高于1mil(Morethan1milThickness)b-3二次孔(2ndDrilling)f-5砂带研磨(BeltSanding)b-4雷射钻孔(LaserDrilling)(LaserAblation)f-6剥锡铅(Tin-LeadStripping)b-5盲(埋)孔钻孔(Blind&BuriedHoleDrilling)f-7微切片(Microsection)C.干膜制程(PhotoProcess(D/F))G.塞孔(PlugHole)c-1前处理(Pretreatment)g-1印刷(InkPrint)c-2压膜(DryFilmLamination)g-2预烤(Precure)c-3曝光(Exposure)g-3表面刷磨(Scrub)c-4显影(Developing)g-4后烘烤(Postcure)c-5蚀铜(Etching)H.防焊(绿漆/绿油):(SolderMask)c-6去膜(Stripping)h-1C面印刷(PrintingTopSide)c-7初检(Touch-up)h-2S面印刷(PrintingBottomSide)c-8化学前处理,化学研磨(ChemicalMilling)h-3静电喷涂(SprayCoating)WORD格式h-4前处理(Pretreatment)c-10显影(Developing)h-5预烤(Precure)c-11去膜(Stripping)h-6曝光(Exposure)Developing,Etching&Stripping(DES)h-7显影(Develop)D.压合Laminationh-8后烘烤(Postcure)d-1黑化(BlackOxideTreatment)h-9UV烘烤(UVCure)d-2微蚀(Microetching)h-10文字印刷(PrintingofLegend)d-3铆钉组合(eyelet)h-11喷砂(Pumice)(WetBlasting)d-4叠板(Layup)h-12印可剥离防焊(PeelableSolderMask)d-5压合(Lamination)I.镀金Goldplatingd-6后处理(PostTreatment)i-1金手指镀镍金(GoldFinger)d-7黑氧化(BlackOxideRemoval)i-2电镀软金(SoftNi/AuPlating)5WORD格式i-3浸镍金(ImmersionNi/Au)(ElectrolessNi/Au)N-5AOI检查及VRS(AOIInspection&Verified&Repaired) J.喷锡(HotAirSolderLeveling)N-6BlaserAOI(afterDesmearandMicroetching)j-1水平喷锡(HorizontalHotAirSolderLeveling)N-7除胶渣(Desmear)j-2垂直喷锡(VerticalHotAirSolderLeveling)N-8微蚀(Microetching)j-3超级焊锡(SuperSolder)j-4.印焊锡突点(SolderBump)K.成型(Profile)(Form)k-1捞型(N/CRouting)(Milling)k-2模具冲(Punch)k-3板面清洗烘烤(Cleaning&Backing)k-4V型槽(V-Cut)(V-Scoring)k-5金手指斜边(BevelingofG/F)L.开短路测试(ElectricalTesting)(Continuity&InsulationTesting)l-1AOI光学检查(AOIInspection)l-2VRS目检(Verified&Repaired)l-3泛用型治具测试(UniversalTester)l-4专用治具测试(DedicatedTester)l-5飞针测试(FlyingProbe)M.终检(FinalVisualInspection)m-1压板翘(WarpageRemove)m-2X-OUT印刷(X-OutMarking)m-3包装及出货(Packing&shipping)m-4目检(VisualInspection)m-5清洗及烘烤(FinalClean&Baking)m-6护铜剂(ENTEKCu-106A)(OSP)m-7离子残余量测试(IonicContaminationTest)(CleanlinessTest)m-8冷热冲击试验(ThermalcyclingTesting)m-9焊锡性试验(SolderabilityTesting)N.雷射钻孔(LaserAblation)N-1雷射钻Tooling孔(LaserablationToolingHole)N-2雷射曝光对位孔(LaserAblationRegistrationHole)N-3雷射Mask制作(LaserMask)N-4雷射钻孔(LaserAblation)。
pcb常用英语
是指用以制造电路板的基材板,简称基板.基板的构造是 由树脂,玻纤布,玻纤席,或白牛皮纸所组成的胶片(Prepreg) 做为黏合剂层.即将多张胶片与外覆铜箔先经叠合,再於高 温高压中压合而成的复合板材.其正式学名称为铜 箔基板 CCL(Copper Claded Laminates). y Up 叠合 多层板或基板在压合前,需将内层板,胶片与铜皮等各种 散材与钢板,牛皮纸垫料等,完成上下对准,落齐,或套准之 工作,以备便能小心送入压合机进行热压.这种事前的准备 工作称为 Lay Up. 39.Legend 文字标记,符号 指电路板成品表面所加印的文字符号或数字,是用以指 示组装或换修各种零件的位置. 40.Measling 白点 按 IPC-T-50E 的解释是指电路板基材的玻纤布中,其经 纬纱交纤点处,与树脂间发生局部性的分离.其发生的原因 可能是板材遭遇高温,而出现应力拉扯所致.不过 FR-4 的板 材一旦被游离氟的化学品(如氟硼酸)渗入,而使玻璃受到较 严重的攻击时,将会在各交织上呈现规则性的白点,皆称为 Measling.
成分母,所得百分比即为尺度安定性的表徵,俗称"尺寸安 定性". 25.Drum Side 铜箔光面 电镀铜箔是在硫酸铜液中以高电流密度(约 1000ASF),於 不锈钢阴极轮(Drum)光滑的"钛质胴面"上镀出铜箔,经撕 下后的铜箔会有面向镀液的粗糙毛面,及紧贴轮体的光滑胴 面,后者即称为"Drum Side". 26.Dry Film 干膜 是一种做为电路板影像转移用的乾性感光薄膜阻剂,另 有 PE 及 PET 两层皮膜将之夹心保护.现场施工时可将 PE 的 隔离层撕掉,让中间的感光阻剂膜压贴在板子的铜面上,在 经过底片感光后即可再撕掉 PET 的表护膜,进行冲洗显像而 形成线路图形的局部阻剂,进而可再执行蚀刻(内层)或电镀 (外层)制程,最后在蚀铜及剥膜后,即得到有裸铜线路的板 面. 27.Electrodeposition 电镀 在含金属离子的电镀液中施加直流电,使在阴极上可镀 出金属来.此词另有同义字 Electroplating,或简称为 plating.更正式的说法则是 electrol ytic plating.是一种 经验多於学理的加工技术.
PCB常用英语汇总
PCB及PCBA常用英语汇总(4)1 内层开路 Inner open2 内层断路 Inner short3 外层开路 Outer open4 外层断路 Outer short5 内层蚀刻过度 Inner over ecthing6 外层蚀刻过度 Outer over ecthing7 内层树脂气泡 Resin void8 内层杂物 Foreign material9 内层图形移位 Inner pattern mis-registration10 层与层移位 Layer to layer mis-registration11 打孔不良 Improper targeting12 内层蚀刻不净 Inner under etching13 露布纹 Weave texture/exposure14 檫花（氧化膜面） Scratch(Oxide surface)15 板损坏 Damaged board16 分层（物料） Delamination (Raw material)17 内层不配套 Excessive inner core18 板过厚 Over thickness19 白点（压板） Measling (Pressing)20 白点（喷锡） Measling (HSAL)21 板曲 Warpage22 板焦黄 Burnt23 起皱 Wrinkle24 起泡（压板） Blistering (Pressing)25 镀层起泡 Blistering (Cu plating)26 喷锡起泡 Blistering (HSAL)27 板面凹痕 DENT (Pressing profilling G/F)28 白斑 Crazing29 胶渣 Gum residue30 孔未穿 Incomplete drilling31 披锋 Burr32 多孔 Extra hole33 偏孔 Hole shift34 孔径大 Hole oversize35 孔径小 Hole undersize36 少孔 Missing Hole37 塞孔 Block hole38 崩孔 Hole breakout39 孔粗糙(镀铜） Hole roughness（Cu plating)40 孔粗糙（机械钻孔） Hole roughness(mechanicaldrill)41 崩线、线路缺口 Nick / void on trace42 缺口 Nick / void on pad43 曝光过度 Over-exposure44 曝光不良 Under exposure45 显影不足 Under develop46 干膜脱落 D/F Peel off47 干膜碎 D/F Rdsidue48 干膜移位 D/F Mis-registration49 标志不清（曝光） Illegible marking (exposure)50 错菲林 Wrong A/W51 非镀铜孔有铜 Copper in NPTH52 镀铜孔内无铜 No copper in PTH53 渗镀 Nickel smear54 电镀粗糙 Rough plating。
PCB英文术语整理
b/電路板朮語總整理*****A*****Abietic Acid松脂酸.Abrasion Resistance耐磨性.Abrasives磨料,刷材.ABS樹脂.Absorption吸收(入).Ac Impedance交流阻抗. Accelerated Test(Aging)加速老化(試驗). Acceleration速化反應. Accelerator 加速劑,速化劑. Acceptability,Acceptance 允收性,允收.Access Hole露出孔,穿露孔. Accuracy准確度.Acid Number (Acid Value)酸值.Acoustic Microscope (AM)感音成像顯微鏡. Acrylic壓克力(聚丙烯酸樹脂). Actinic Light (or Intensity, or Ra有效光.Activation活化.Activator活化劑.Active Carbon活性炭.Active Parts(Devices)主動零件.Acutance解像銳利度.Addition Agent添加劑.Additive Process加成法.Adhesion附著力.Adhesion Promotor附著力促進劑. Adhesive膠類或接著劑.Admittance導納(阻抗的倒數). Aerosol噴霧劑,氣熔膠,氣懸體. Aging老化.Air Inclusion氣泡夾雜.Air Knife風刀.Algorithm演算法.Aliphatic Solvent脂肪族溶劑. Aluminium Nitride(AlN)氮化鋁.Ambient Tamp環境溫度. Amorphous無定形,非晶形.Amp-Hour安培小時.Analog Circuit/Analog Signal類比電路/類比訊號. Anchoring Spurs著力爪.Angle of Contack接觸角.Angle of Attack攻角.Anion陰離子.Anisotropic異向性,單向的. Anneal 韌化(退火).Annular Ring孔環.Anode陽極.Anode Sludge陽極泥.Anodizing陽極化.ANSI美國標準協會.Anti-Foaming Agent消泡劑.Anti-pit Agent抗凹劑.AOI自動光學檢驗. Apertures開口,鋼版開口.AQL品質允收水準.AQL(Acceptable Quality Level)允收品質水準. Aramid Fiber聚醯胺纖維.Arc Resistance耐電弧性.Array排列.Artwork底片.ASIC特定用途勣體電路器. Aspect Ratio縱橫比.Assembly組裝裝配.A-stage A階段.ATE自動電測設備. Attenuation訊號衰減.Autoclave壓力鍋.Axial-lead軸心引腳. Azeotrope共沸混合液.*****B*****Back Light (Back Lighting)背光法.Back Taper反錐斜角. Backpanels, Backplanes支撐板.Back-up 墊板.Balanced Transmission Lines平衡式傳輸線.Ball Grid Array球腳陣列(封裝). Bandability彎曲性.Banking Agent護岸劑.Bare Chip Assembly裸體晶片組裝. Barrel孔壁,滾鍍.Base Material基材.Basic Grid基本方格.Batch批.Baume波美度(凡液體比重比水重則 Be=145-(1凡液體比重比水輕則 Be=140÷(Sp.Gr-13*Sp.Gr 為比重即同體勣物質對"純水"1g/ Beam lead光芒式的平行密集引腳.Bed-of-Nail Testing針床測試.Bellows Conact彈片式接觸.Beta Ray Backscatter貝他射線反彈散射.Bevelling切斜邊.Bias斜張綱布,斜纖法.Bi-Level Stencil]雙階式鋼板.Binder粘結劑.Bits頭(Drill Bits).Black Oxide黑氧化層.Blanking沖空斷開.Bleack 漂洗.Bleeding溢流.Blind Via Hole肓通孔.Blister局部性分層或起泡.Block Diagram電路系統塊圖 .Blockout封綱.Blotting干印.Blotting Paper吸水紙.Blow Hole吹孔.Blue Plaque藍紋(錫面鈍化層).Blur Edge (Circle)模糊邊帶(圈).Bomb Sight彈標.Bond Strength結合強度.Bondability結合性.Bonding Layer結合層接著層.Bonding Sheet(Layer)接合片.Bonding Wire結合線.Bow, Bowing板彎.Braid編線.Brazing硬焊(用含銀的銅鋅合金焊條).在425℃~870℃下進行熔接的方式). Break Point顯像點.Break-away Panel可斷開板.Breakdown Voltage崩潰電壓.Break-out破出.Bridging搭橋.Bright Dip光澤浸漬處理.Brightener光澤劑.Brown Oxide棕氧化.Brush Plating刷鍍.B-stage B階段.Build Up Process增層法制程.Build-up堆積.Bulge鼓起.Bump 突塊.Bumping Process击塊制程.Buoyancy浮力.Buried Via Hole埋導孔.Burn-in高溫加速老化試驗.Burning燒焦.Burr毛頭.Bus Bar勤電杆.Butter Coat 外表樹脂層.*****C*****C4 Chip Joint C4晶片焊接. Cable電纜.CAD電腦輔助設計. Calendered Fabric軋平式綱布.Cap Lamination帽式壓合法. Capacitance電容.Capacitive Coupling電容耦合. Capillary Action毛細作用. Carbide碳化物.Carbon Arc Lamp碳弧燈.Carbon Treatment, Active活化炭處理. Card卡板.Card Cages/Card Racks電路板搆裝箱. Carlson Pin卡氏定位稍. Carrier載體.Cartridge濾心. Castallation堡型勣體電路器. Catalyzed Board, Catalyzed Subs催化板材. Catalyzing催化.Cathode陰極.Cation陰向離子, 陽离子. Caul Plate隔板.Cavitation空泡化 半真空. Center-to-Center Spacing中心間距. Ceramics陶瓷.Cermet陶金粉.Certificate証明書.CFC氟氫碳化物. Chamfer倒角. Characteristic Impedance特性阻抗.Chase綱框.Check List檢查清單.Chelate螯合.Chemical Milling化學研磨. Chemical Resistance抗化性. Chemisorption化學吸附.Chip晶片(粒).Chip Interconnection晶片互連.Chip on Board晶片粘著板.Chip On Glass晶玻接裝(COG). Chisel鑽針的尖部. Chlorinated Solvent含氯溶劑,氯化溶劑. Circumferential Separation環狀斷孔.Clad/Cladding披覆.Clean Room無塵室. Cleanliness清潔度.Clearance余地,余環. Clinched Lead Terminal緊箝式引腳. Clinched-wire Through Connecti通孔彎線連接法 . Clip Terminal繞線端接.Coat, Coating皮膜表層.Coaxial Cable同軸纜線. Coefficient of Thermal Expansion熱膨脹系數.Co-Firing共繞.Cold Flow冷流.Cold Solder Joint冷焊點.Collimated Light平行光.Colloid膠體.Columnar Structure柱狀組織.Comb Pattern梳型電路.Complex Ion錯離子.Component Hole零件孔.Component Orientation零件方向.Component Side組件面.Composites,(CEM-1,CEM-3)復合板材. Condensation Soldering凝熱焊接,液化放熱焊接. Conditioning整孔.Conductance導電.Conductive Salt導電鹽.Conductivity導電度.Conductor Spacing導體間距.Conformal Coating貼護層.Conformity吻合性, 服貼性. Connector連接器.Contact Angle接觸角.Contact Area接觸區.Contact Resistance接觸電阻.Continuity連通性.Contract Service協力廠,分包廠. Controlled Depth Drilling定深鑽孔.Conversion Coating 轉化皮膜.Coplanarity共面性.Copolymer共聚物. Copper Foil銅皮.Copper Mirror Test銅鏡試驗. Copper Paste銅膏.Copper-Invar-Copper (CIC)綜合夾心板. Core Material內層板材,核材. Corner Crack 通孔斷角. Corner Mark板角標記. Counterboring方型擴孔. Countersinking錐型擴孔. Coupling Agent 偶合劑. Coupon, Test Coupon板邊試樣. Coverlay/Covercoat表護層.Crack裂痕.Crazing白斑.Crease皺折.Creep潛變. Crossection Area截面積. Crosshatch Testing十字割痕試驗. Crosshatching十字交叉區. Crosslinking, Crosslinkage交聯,架橋. Crossover越交,搭交. Crosstalk雜訊, 串訊. Crystalline Melting Point晶體熔點.C-Stage C階段.Cure硬化,熟化. Current Density電流密度. Current-Carrying Capability載流能力.Curtain Coating濂塗法.*****D*****Daisy Chained Design菊瓣設計.Datum Reference基准參考.Daughter Board子板.Debris碎屑,殘材.Deburring去毛頭.Declination Angle斜射角.Definition邊緣逼真度.Degradation 劣化.Degrasing脫脂.Deionized Water去離子水.Delamination分離.Dendritic Growth 枝狀生長.Denier丹尼爾(是編織紡織所用各種紗類直徑單定義9000米紗束所具有的重量(以克米計Densitomer透光度計.Dent凹陷.Deposition 皮膜處理.Desiccator干燥器.Desmearing去膠渣.Desoldering解焊.Developer顯像液,顯像機.Developing顯像 .Deviation偏差.Device電子元件.Dewetting縮錫.D-glass D玻璃.Diaze Film偶氮棕片. Dichromate重鉻 酸鹽.Dicing晶片分割. Dicyandiamide(Dicy)雙氰胺.Die 沖模.Die Attach晶粒安裝.Die Bonding晶粒接著.Die Stamping沖壓.Dielectric 介質.Dielectric Breakdown Voltage介質崩潰電壓. Dielectric Constant介質常數.Dielectric Strength介質強度.微差掃瞄熱卡分析法. Differential Scanning CalorimetryDiffusion Layer擴散層.Digitizing數位化.Dihedral Angle雙反斜角. Dimensional Stability尺度安定性.Diode二極體.Dip Coating浸塗法.Dip Soldering浸焊法.DIP(Dual Inline Package)雙排腳封裝體. Dipole偶極,雙極.Direct / Indirect Stencil直接/間接版膜. Direct Emulsion直接乳膠.Direct Plating直接電鍍.Discrete Compenent散裝零件.Discrete Wiring Board散線電路板,復線板. Dish Down碟型下陷.Dispersant分散劑. Dissipation Factor散失因素. Disspation Factor散逸因子. Disturbed Joint受擾焊點. Doctor Blade修平刀,刮平刀. Dog Ear狗耳.Doping摻雜.Double Layer雙電層.Double Treated Foil雙面處理銅箔. Drag In / Drag Out帶[進/帶出. Drag Soldering拖焊. Drawbridging吊橋效應.Drift漂移.Drill Facet鑽尖切削面. Drill Pointer鑽針重磨機. Drilled Blank已鑽孔的裸板. Dross浮渣.Drum Side銅箔光面.Dry Film干膜.Dual Wave Soldering 雙波焊接. Ductility展性.Dummy Land假焊墊. Dummy, Dummying假鍍(片). Durometer橡膠硬度計. DYCOstrate電漿蝕孔增層法. Dynamic Flex(FPC)動態軟板.*****E*****E-Beam (Electron Beam)電子束.Eddy Current渦電流.Edge Spacing板邊空地.Edge-Board Connector板邊(金手指)承接器. Edge-Board Contact板邊金手指.Edge-Dip Solderability Test板邊焊錫性測試. EDTA乙二胺四乙酸. Effluent排放物.E-glass電子級玻璃. Elastomer彈性體.Electric Strength(耐)電性強度. Electrodeposition電鍍.Electro-deposition Photoresist電著光阻, 電泳光阻. Electroforming電鑄.Electroless-Deposition無電鍍.Electrolytic Tough Pitch電解銅.. Electrolytic-Cleaning電解清洗.Electro-migration電遷移.Electro-phoresis電泳動, 電滲. Electro-tinning鍍錫.Electro-Winning電解冶煉. Elongation 延伸性, 延伸率. Embossing击出性壓花.EMF(Electromotive Force)電動勢.EMI(Electromagnetic Interferenc電磁干擾. Emulsion乳化.Emulsion Side藥膜面. Encapsulating膠囊. Encroachment沾污,侵犯.End Tap封頭.Entek有機護銅處理. Entrapment夾雜物.Entry Material蓋板.Epoxy Resin環氧樹脂.Etch Factor蝕刻因子.Etchant蝕刻劑(液). Etchback回蝕.Etching Indicator蝕刻指標.Etching Resist蝕刻阻劑.Eutetic Composition共融組成. Exotherm放熱(曲線). Exposure曝光.Eyelet鉚眼.*****F*****Fabric綱布.Face Bonding反面朝下結合. Failure故障.Fan Out Wiring/Fan In Wiring扇出布線/扇入布線. Farad 法拉.Farady法拉第.Fatigue Strength抗疲勞強度.Fault缺陷.Fault Plane斷層面.Feed Through Hole導通孔.Feeder 進料器.Fiber Exposure玻纖顯露.Fiducial Mark基准記號.Filament纖絲.Fill緯向.Filler填充料.Fillet內圓填角.Film底片.Film Adhesive接著膜,粘合膜.Filter過濾器.Fine Line細線.Fine Pitch密腳距,密線距,密墊距. Fineness粒度, 純度.Finger手指.Finishing終修(飾).Finite Element Method有限要素分析法.First Article首產品.First Pass-Yield初檢良品率.Fixture夾具.Flair刃角變形.Flame Point自燃點.Flame Resistant耐燃性.Flammability Rate燃性等級.Flare扇形崩口.Flash Plating閃鍍.Flashover閃絡.Flat Cable扁平排線.Flat Pack扁平封裝(之零件). Flatness平坦度.Flexible Printed Circuit (FPC)軟板.Flexural Failure撓曲損壞.Flexural Module彎曲模數, 抗撓性模數 . Flexural Strength抗撓強度.Flip Chip覆晶,扣晶.Flocculation絮凝.Flood Stroke Print覆墨沖程印刷.Flow Soldering (Wave Soldering流焊.Fluorescence熒光.Flurocarbon Resin碳氟樹脂.Flush Conductor嵌入式線路 , 貼平式 導體. Flush Point閃火點.Flute退屑槽.Flux助焊劑.Foil Burr銅箔毛邊.Foil Lamination銅箔壓板法.Foot殘足(干膜殘余物).Foot Print (Land Pattern)腳墊.Foreign Material 外來物,異物.Form-to-List布線說明清單.Four Point Twisting四點扭曲法.Free Radical自由基.Freeboard干舷.Frequency頻率.Frit 玻璃熔料.Fully-Additive Process全加成法.Fungus Resistance抗霉性.Fused Coating熔錫層.Fusing熔合.Fusing Fluid助熔液.*****G*****G-10由連續玻纖所織成的玻纖布與環氧樹脂粘結劑所復合成的材料. Gage, Gauge量規.Gallium Arsenide (GaAs)砷化鎵.Galvanic Corrosion賈凡尼式腐蝕(電解式腐蝕).Galvanic Series賈凡尼次序(電動次序).Galvanizing鍍鋅.GAP第一面分離,長刃斷開.Gate Array閘列,閘極陣列.Gel Time膠化時間.Gelation Particle膠凝點.Gerber Data ,Gerber File格博檔案(是美商Gerber公司專為PCB面線圖形與孔位,所發展一系列完整的軟體檔Ghost Image陰影.Gilding鍍金 (現為:Glod Plating).Glass Fiber玻纖.Glass Fiber Protrusion/Gouging, 玻纖突出/挖破.Glass Transition Temperature, Tg玻璃態轉化溫度.Glaze釉面,釉料.Glob Top圓頂封裝體.Glouble Test球狀測試法.Glycol (Ethylene Glycol)乙二醇.Golden Board測試用標準板.Grain Size結晶粒度.Grass Leak 大漏.Grid標准格.Ground Plane /Earth Plane接地層.Ground Plane Clearance接地空環.Guide Pin導針.Gull /Wing Lead鷗翼引腳.*****H*****Halation環暈.Half Angle半角.Halide鹵化物.Haloing白圈,白邊.Halon海龍,是CFC"氟碳化物"的一種商品名. Hard Anodizing硬陽極化.Hard Chrome Plating鍍硬鉻.Hard Soldering硬焊.Hardener (Curing Agent)硬化劑(或Curing Agent).Hardness硬度.Haring-Blum Cell海固槽.Harness電纜組合.Hay Wire跳線.Heat Cleaning燒潔.Heat Dissipation散熱.Heat Distortion Point (Temp)熱變形點(溫度).Heat Sealing熱封.Heat Sink Plane散熱層.Heat Transfer Paste導熱膏.Heatsink Tool散熱工具.Hertz(Hz)赫.High Efficiency Particulate Air F高效空氣塵粒過瀘機.Hipot Test 高壓電測.Hi-Rel高度靠度.Hit 擊(鑽孔時鑽針每一次"刺下"的動作). Holding Time停置時間.Hole Breakout孔位破出.Hole Counter數孔機.Hole Density孔數密度.Hole Preparation通孔准備.Hole Pull Strength孔壁強度.Hole Void破洞.Hook 切削刀緣外击.Hot Air Levelling噴錫.Hot Bar Soldering熱把焊接.Hot Gas Soldering熱風手焊.HTE(High Temperature Elongati高溫延伸性.Hull Cell哈氏槽.Hybrid Integrated Circuit混成電路.Hydraulic Bulge Test液壓鼓起試驗.H ydrogen Embrittlement氫脆.Hydrogen Overvoltage氫過(超)電壓.Hydrolysis水解.Hydrophilic親水性.Hygroscopic吸溼性.Hypersorption超吸咐.*****I*****I.C. Socket勣體電路器插座.Icicle錫尖.Illuminance照度.Image Transfer影像轉移.Immersion Plating浸鍍.Impedance阻抗.Impedance Match阻抗匹配.Impregnate含浸.In-Circuit Testing組裝板電測.Inclusion異物,夾雜物.Indexing Hole基准孔.Inductance(L)電感.Infrared(IR)紅外線.Input/Output輸入/輸出.Insert, Insertion插接.Inspection Overlay套檢底片.Insulation Resistance絕緣電阻.Integrated Circuit(IC)勣體電路器.InterFace介面.Interconnection互連.Intermetallic Compound (IMC)介面共化物.Internal Stress內應力.Interposer互邊導電物.Interstitial Via-Hole(IVH)局部層間導通孔.Invar殷鋼(63.8%Fe,36%Ni,0.2%C).Ion Cleanliness離子清潔度.Ion Exchange Resins離子交換樹脂.Ion Migration離子遷移.Ionizable (Ionic) Contaimination離子性污染.Ionization游離,電離.Ionization Voltage (Corona Leve電離化電壓(電纜內部狹縫空氣中,引起電離所施加之最小電壓).IPC美國印刷電路板協會.Isolation隔離性,隔絕性.*****J*****JEDEC(Joint Electronic Device 聯合電子元件工程委員會. Engineering Council)J-Lead J型接腳.Job Shop專業工廠.Joule焦耳.Jumper Wire跳線.Junction接(合)面,接頭.Just-In-Time(JIT)適時供應,及時出現.*****K*****Kapton聚亞醯胺軟板.Karat克拉 (1克拉(鑽石)=0.2g 純金則24k金100%的鈍金.Kauri-Butanol Value考立丁醇值(簡稱K.B.值).Kerf.切形,裁剪.Kevlar聚醯胺纖維.Key電鍵Key Board鍵盤.Kiss Pressure吻壓, 低壓.Knoop Hardness努普硬度.Known Good Die(KGD)已知之良好晶片.Kovar科伐合金(Fe53%,Ni29%,Co17%).Kraft Paper牛皮紙.*****L*****Lamda Wave延伸平波.Laminar Flow平流.Laminar Structure片狀結搆.Laminate Void板材空洞. Laminate(s)基板.Lamination Void壓合空洞. Laminator壓膜機.Land孔環焊墊,表面焊墊. Landless Hole無環通孔.Laser Direct Imaging (LDI)雷射直接成像. Laser Maching雷射加工法.雷射曝光機.Laser Photogenerator(LPG), LaseLaser Soldering雷射焊接法.Lay Back 刃角磨損.Lay Out布線,布局.Lay Up 疊合.Layer to Layer Spacing層間距離Leaching焊散漂出,熔出. Lead 引腳.Lead Frame腳架.Lead Pitch腳距.Leakage Current漏電電流.Legend文字標記.Leveling整平.Lifted Land孔環(焊墊)浮起. Ligand錯離子附屬體. Light Emitting Diodes (LED)發光二極體.Light Integrator光能累積器.Light Intensity光強度.Limiting Current Density極限電流密度. Liquid Crystal Display (LCD)液晶顯示器.Liquid Dielectrics液態介質.液態感光防焊綠漆.Liquid Photoimagible Solder MasLocal Area Network區域性網路.Logic 邏輯.Logic Circuit 邏輯電路.Loss Factor損失因素.Loss Tangent (TanδDK)損失正切.Lot Size批量.Luminance發光強度.Lyophilic親水性膠體.*****M*****Macro-Throwing Power巨觀分布力.Major Defect主要(嚴重)缺點.Major Weave Direction主要織向.Margin刃帶(鑽頭尖部).Marking標記.Mask阻劑.Mass Finishing大量整面(拋光).Mass Lamination大型壓板.Mass Transport質量輸送.Master Drawing主圖.Mat蓆(用于CEM-3(Composite Epoxy Material)復合材料.)Matte Side毛面(電鍍銅皮(ED Foil)之粗糙面). Mealing泡點.Mean Time To Failure (MTTF)故障前可用之平均時數.Measling白點.Mechanical Stretcher機械式張網機.Mechanical Warp機械式纏繞. Mechanism機理.Membrane Switch薄膜開關. Meniscograph Test弧面狀沾錫試驗. Meniscus彎月面.Mercury Vaper Lamp汞氣燈.Mesh Count綱目數.Metal Halide Lamp 金屬鹵素燈. Metallization金屬 化.Metallized Fabric金屬化綱布.Micelle微胞.Micro Wire Board微封線板.Micro-electronios微電子. Microetching微蝕. Microsectioning微切片法.Microstrip 微條.Microstrip Line微條線,微帶線. Microthrowing Power微分布力. Microwave微波.Migration遷移.Migration Rate遷移率.Mil英絲.Minimum Annular Ring孔環下限.Minimum Electrical Spacing電性間距下限.Minor Weave Direction次要織向. Misregistration 對不准度.Mixed Componmt Mounting Tec混合零件之組裝技術. Modem調變及解調器.Modification修改.Module模組.Modulus of Elasticity彈性系數.溼氣與絕緣電阻試驗.Moisture and Insulation ResistancMold Release 脫模劑,離型劑.Mole摩爾.Monofilament單絲.Mother Board主機板,母板.Moulded Circuit模造立體電路機.Mounting Hole安裝孔.Mounting Hole組裝孔,機裝孔.Mouse Bite鼠齒(蝕刻后線路邊緣出現不規則缺口). Multi-Chip-Module(MCM)多晶片芯片模組.復線板.Multiwiring Board (or Discrete W*****N*****N.C.數值控制.Nail Head釘頭.Near IR近紅外線.Negative負片,鑽尖的第一面外緣變窄. Negative Etch-back反回蝕.Negative Stencil負性感光膜.Negative-Acting Resist負性作用之阻劑.Network綱狀元件.Newton牛頓.Newton Ring 牛頓環.Newtonian Liquid牛頓流體.Nick缺口.N-Methyl Pyrrolidine (NMP)N-甲基四氫嗶咯.Noble Metal Paste貴金屬印膏.Node節點.Nodule節瘤. Nomencleature標示文字符號. Nominal Cured Thickness標示厚度.Non-Circular Land非圓形孔環焊墊. Non-flammable非燃性.Non-wetting不沾錫.標準濃度,當量濃度. Normal Concentration (Strength)Normal Distribution常態分布.Novolac酯醛樹脂. Nucleation , Nucleating核化.Numerical Control數值控制.Nylon尼龍.*****O*****Occlusion吸藏.Off-Contact架空.Offset第一面大小不均. OFHC(Oxyen Free High Conduc無氧高導電銅. Ohm歐姆.Oilcanning蓋板彈動.OLB(Outer Lead Bond)外引腳結合. Oligomer寡聚物.Omega Meter離子污染檢測儀. Omega Wave振盪波.On-Contact Printing密貼式印刷. Opaquer不透明劑,遮光劑. Open Circuits斷線.Optical Comparater光學對比器(光學放大器.) Optical Density光密度.Optical Inspection光學檢驗.Optical Instrument光學儀器.Organic Solderability Preservativ有機保焊劑.Osmosis滲透.Outgassing出氣,吹氣.Outgrowth懸出,橫出,側出.Output產出,輸出.Overflow溢流.Overhang總懸空.Overlap 鑽尖點分離. Overpotantial(Over voltage)過電位,過電壓. Oxidation氧化.Oxygen Inhibitor氧化抑制劑.Ozone Depletion臭氧層耗損.*****P*****Packaging封裝,搆裝.Pad焊墊,圓墊.Pad Master圓墊底片.Pads Only Board唯墊板.Palladium鈀.Panel制程板.Panel Plating全板鍍銅.Panel Process全板電鍍法.Paper Phenolic紙質酚醛樹脂(板材). Parting Agent脫膜劑.Passivation鈍化 ,鈍化外理.Passive Device (Component)被動元件(零件)Paste膏,糊.Pattern板面圖形.Pattern Plating線路電鍍.Pattern Process線路電鍍法.Peak Voltage峰值電壓.Peel Strength抗撕強度.Periodic Reverse (PR) Current周期性反電流. Peripheral周邊附屬設備. Permeability透氣性,導磁率. Permittivity誘電率,透電率.pH Value酸堿值.Phase相.Phase Diagram相圖.Phenolic酚醛樹脂. Photofugitive感光褪色. Photographic film感光成像之底片. Photoinitiator感光啟始劑. Photomask光罩.Photoplotter, Plotter光學繪圖機. Photoresist光阻.光阻式化學(銑刻)加工. Photoresist Chemical MachinningPhototool底片.Pick and Place拾取與放置. Piezoelectric壓電性.Pin 插腳,插梢,插針.Pin Grid Array (PGA)矩陣式針腳對裝. Pinhole針孔.Pink Ring粉紅圈.Pitch跨距,腳距,墊距,線距.Pits凹點.Plain Weave平織.Plasma電漿.Plasticizers可塑劑,增塑劑.Plated Through Hole鍍通孔.Platen熱盤.Plating鍍.Plotting標繪.Plowing犁溝.Plug插腳,塞柱.Ply層,股.Pneumatic Stretcher氣動拉伸器.Pogo Pin伸縮探針.Point 鑽尖.Point Angle鑽尖面.Point Source Light點狀光源.Poise泊."粘滯度"單位=1dyne*sec/cm2. Polar Solvent極性溶劑.Polarity電極性.Polarization分極,極化.Polarizing Slot偏槽.Polyester Films聚酯類薄片.Polymer Thick Film (PTF)厚膜糊.Polymerization聚合.Polymide(PI)聚亞醯胺.Popcorn Effect爆米花效應.Porcelain瓷材,瓷面.Porosity Test疏孔度試驗.Positive Acting Resist正性光阻劑.Post Cure后續硬化,后烤.Post Separation后期分離,事后公離.Pot Life運用期,鍋中壽命.Potting鑄封,模封.Power Supply電源供應器.Preform 預制品.Preheat預熱.Prepreg膠片,樹脂片.Press Plate鋼板.Press-Fit Contact擠入式接觸.Pressure Foot 壓力腳.Pre-tinning預先沾錫.Primary Image線路成像.Print Through壓透,過度擠壓..Probe探針.Process Camera制程用照像機.Process Window操作范圍.Production Master生產底片.Profile輪廓,部面圖,升溫曲線圖稜線. Propagation傳播.Propagation Delay傳播延遲.Puddle Effect水坑效應.Pull Away拉離.Pulse Plating脈沖電鍍法.Pumice Powder 浮石粉.Punch沖切.Purge, Purging淨空,淨洗.Purple Plague紫疫(金與鋁的共化物層). Pyrolysis熱裂解,高溫分解.*****Q*****Quad Flat Pack (QFP)方扁形封裝體. Qualification Agency資格認証機搆. Qualification Inspection資格檢驗.Qualified Products List合格產品(供應者)名單. Qualitative Analysis定性分析.品質符合之試驗線路(樣板). Quality Conformance Test CircuiQuantitative Analysis定量分析.Quench 淬火,驟冷.Quick Disconnect快速接頭.Quill緯紗繞軸.*****R*****Rack 挂架.Radial Lead放射狀引腳.Radio Frequency Interference (RF射頻干擾.Rake Angle摳角,耙角.Rated Temperature, Voltage額定溫度,額定電壓. Reactance電抗.Real Estate底材面,基板面.Real Time System 即時系統.Reclaiming再生,再制.Rediometer輻射計,光度計.Reel to Reel卷輪(盤)式操作. Reference Dimension參考尺度.Reference Edge參考邊緣. Reflection反射.Reflow Soldering重熔焊接,熔焊. Refraction折射.Refractive Index折射率.Register Mark對准用標記. Registration對准度. Reinforcement補強物.Rejection剔退,拒收. Relamination(Re-Lam)多層板壓合. Relaxation松弛.緩和.Relay繼電器.Release Agent, Release Sheets脫模劑,離模劑. Reliability可靠度,可信度. Relief Angle浮角.Repair修理.Resin Coated Copper Foil背膠銅箔.Resin Content膠含量,樹脂含量. Resin Flow膠流量,樹脂流量. Resin Recession樹脂下陷.Resin Rich Area 多膠區,樹脂丰富區. Resin Smear膠(糊)渣.Resin Starve Area缺膠區,樹脂缺乏區. Resist阻膜,阻劑. Resistivity電阻系數,電阻率. Resistor電阻器,電阻. Resistor Drift電阻漂移.Resistor Paste電阻印膏.Resolution解像,解像度,解析度.Resolving Power解析(像)力,分辨力.Reverse Current Cleaning反電流(電解)清洗.Reverse Etchback反回蝕.Reverse Image負片影像(阻劑).Reverse Osmosis (RO)反(逆滲透).Reversion反轉,還原.Revision修正版.改訂版.Rework(ing)重工,再加工.Rhology流變學,流變性質.Ribbon Cable圓線纜帶.Rigid-Flex Printed Board硬軟合板.Ring 套環.Rinsing水洗,沖洗.Ripple紋波(指整流器所輸出電流中不穩定成分Rise Time上升時間.Roadmap 線路與零件之布局圖.Robber輔助陰極.Roller Coating輥輪塗布.Roller Coating滾動塗布法.Roller Cutter輥切機.Roller Tinning輥錫法,滾錫法.Rosin松香.Rotary Dip Test擺動沾錫試驗.Routing切外型.Runout偏轉,累勣距差.Rupture迸裂.*****S*****Sacrificial Protection犧牲性保護層. Salt Spray Test鹽霧試驗. Sand Blast噴砂. Saponification皂化作用. Saponifier皂化劑.Satin Finish緞面處理. Scaled Flow Test比例流量實驗. Schemetic Diagram電路概略圖. Scoring V型刻槽. Scratch刮痕.Screen Printing綱版印刷. Screenability綱印能力. Scrubber磨刷機,磨刷器. Scum透明殘膜. Sealing封孔. Secondary Side第二面 . Seeding下種. Selective Plating選擇性電鍍. Self-Extinguishing自熄性. Selvage布邊.Semi-Additive Process半加成制程. Semi-Conductor半導體. Sensitizing敏化. Separable Component Part可分離式零件. Separator Plate隔板, 鋼板. Sequential Lamination接續性壓合法. Sequestering Agent螯合劑. Shadowing陰影,回蝕死角.Shank鑽針柄部.Shear Strength 抗剪強度.Shelf Life儲齡.Shield遮蔽.Shore Hardness蕭氏硬度.Short短路.Shoulder Angle肩斜角.Shunt分路.Side Wall側壁.Siemens電阻值.Sigma (Standard Deviation)標准差.Signal訊號.Silane硅烷.Silica Gel硅膠砂.Silicon硅.Silicone硅銅.Silk Screen綱版印刷,絲綱印刷.Silver Migration銀遷移.Silver Paste 銀膏.Single-In-Line Package(SIP)單邊插腳封裝體.Sintering燒結.Sizing上膠,上漿.Sizing上漿處理.Skin Effect集膚效應 (高頻下,電流在傳遞時多集中表面,使得道線內部通過電流甚少, 造成浪費,并也使得表面導體部分電阻升高. Skip Printing, Skip Plating漏印,漏鍍.Skip Solder 缺錫, 漏焊.Slashing漿經.Sleeve Jint套接.Sliver邊絲,邊余.Slot, Slotting槽口.Sludge於泥.Slump塌散.Slurry稠漿,懸浮漿. Small Hole小孔.Smear膠渣.Smudging錫點沾污.Snap-off彈回高度.Socket插座.Soft Contact輕觸.Soft Glass 軟質玻璃(鉛玻璃). Solder焊錫.Solder Ball錫球.Solder Bridging錫橋.Solder Bump 焊錫击塊.Solder Column Package錫柱腳封裝法. Solder Connection焊接.Solder Cost焊錫著層.Solder Dam錫堤.Solder Fillet填錫.Solder Levelling噴錫,熱風整平. Solder Masking(S/M)防焊膜綠漆. Solder Paste錫膏.Solder Plug錫塞(柱).Solder Preforms預焊料.Solder Projection焊錫突點.Solder Sag 焊錫垂流物.Solder Side焊錫面.Solder Spatter濺錫.Solder Splash賤錫.Solder Spread Test散錫試驗.Solder Webbing錫綱.Solder Webbing錫綱.Solder Wicking滲錫,焊錫之燈芯效應. Solderability可焊性.Soldering軟焊,焊接.Soldering Fluid, Soldering Oil助焊液,護焊油.Solid Content固體含量,固形分. Solidus Line固相線.Spacing間距.Span跨距.Spark Over閃絡.Specific Heat 比熱.Specification (Spec)規范,規格. Specimen樣品,試樣. Spectrophotometry分光光度計檢測法. Spindle主軸,鑽軸.Spinning Coating自轉塗布.Splay斜鑽孔.Spray Coating噴著塗裝.Spur底片圖形邊緣突出. Sputtering濺射.Squeege刮刀.Stagger Grid蹣跚格點.Stalagometer滴管式表面張力計.Stand-off Terminals直立型端子.Starvation缺膠.Static Eliminator靜電消除器.Steel Rule Die(鋼)刀模.Stencil版膜.Step and Repeat逐次重覆曝光.Step Plating梯階式鍍層.Step Tablet階段式曝光表.Stiffener補強條(板).Stop Off防鍍膜, 阻劑.Strain變形,應變.Strand絞(指由許多股單絲集束并旋扭而成的絲Stray Current迷走電流, 散雜電流(在電鍍槽系統中,其由整流器所提供,應在陽極板與被鍍件之電杆與槽體液體中流通,但有時少部分電從槽體本身或加熱器上迷走,漏失). Stress Corrosion應力腐蝕.Stress Relief消除應力.Strike預鍍.Stringing拖尾.Stripline條線.Stripper剝除液(器).Substractive Process減成法.Substrate底材.Supper Solder超級焊錫.Supported Hole(金屬)支助通孔.Surface Energy表面能.Surface Insulation Resistance表面絕緣電阻. Surface Mount Device 表面粘裝元件. Surface Mounting Technology (S表面粘裝技術. Surface Resistivity表面電阻率. Surface Speed鑽針表面速度. Surface Tension表面張力. Surfactant表面潤溼劑.Surge突流,突壓. Swaged Lead壓扁式引腳. Swelling Agents, Sweller膨松劑. Swimming 線路滑離. Synthetic Resin合成樹脂.*****T*****Tab接點,金手指. Taber Abraser泰伯磨試器. Tackiness粘著性, 粘手性. Tape Automatic Bonding (TAB)卷帶自動結合. Tape Casting 帶狀鑄材.Tape Test撕膠帶試驗.Tape Up Master原始手貼片. Taped Components卷帶式連載元件. Taper Pin Gauge錐狀孔規.Tarnish污化.Tarnish 污化, 污著.Teflon鐵氟龍(聚4氟乙烯). Telegraphing浮印,隱印. Temperature Profile溫度曲線.Template模板.Tensile Strength抗拉強度. Tensiomenter張力計.Tenting蓋孔法. Terminal端子.Terminal Clearance端子空環.Tetra-Etch氟樹脂蝕粗劑. Tetrafunctional Resin四功能樹脂. Thermal Coefficient of Expansion熱膨脹系數. Thermal Conductivity導熱率. Thermal Cycling熱循環,熱震盪. Thermal Mismstch感熱失諧. Thermal Relief散熱式鏤空. Thermal Via導熱孔. Thermal Zone感熱區. Thermocompression Bonding熱壓結合. Thermocouple熱電偶. Thermode發熱體. Thermode Soldering熱模焊接法.熱重分析法. Thermogravimetric Analysis, (TG熱機分析法. Thermomechanical Analysis (TM Thermoplastic熱塑性. Thermosetting熱固性. Thermosonic Bonding熱超音波結合. Thermount聚醯胺短纖蓆材. Thermo-Via導熱孔.Thick Film Circuit厚膜電路.Thief輔助陽極.Thin Copper Foil薄銅箔.Thin Core薄基板.Thin Film Technology薄膜技術.Thin Small Outline Package(TSO薄小型勣體電路器.Thinner調薄劑.Thixotropy抗垂流性,搖變性.Three Point Bending三點壓彎試驗.Three-Layer Carrier三層式載體.Threshold Limit Value (TLV)極限值.Through Hole Mounting通孔插裝.Through Put物流量,物料通過量.Throwing Power分布力.Tie Bar分流條.Tin Drift錫量漂飄失.Tin Immersion浸鍍錫.Tin Pest錫疫(常見白色金屬錫為"β錫",當溫度低時則β錫將逐漸轉變成粉末狀灰色"α錫Tin Whishers錫須.Tinning熱沾焊錫.Tolerance公差.Tombstoning墓碑效應.Tooling Feature工具標示物.Topography表面地形.Torsion Strength抗扭強度.Touch Up觸修,簡修.Trace 線路,導線.Traceability追溯性,可溯性.Transducer轉能器.Transfer Bump移用式突塊. Transfer Laminatied Circuit轉壓式線路. Transfer Soldering移焊法. Transistor電晶體. Translucency半透性. Transmission Line傳輸線. Transmittance透光率. Treament, Treating含浸處理.Treeing枝狀鍍物,鍍須. Trim修整, 精修.Trim Line裁切線.Trimming修整,修邊.True Position真位.Tungsten鎢Tungsten Carbide碳化鎢.Turnkey System包辦式系統. Turret Solder Terminal塔立式焊接端子. Twill Weave斜織法.Twist板扭.Two Layer Carrier兩層式載体.*****U*****保儉業試驗所標志. UL Symbol(UL.為Under-Writers Laboratories,INC)Ultimate Tensile Strength (UTS)極限抗拉強度. Ultra High Frequency (UHF)超高頻率.Ultra Violet Curing (UV Curing)紫外線硬化. Ultrasonic Bonding超音波結合. Ultrasonic Cleaning超音波清洗.Ultrasonic Soldering超音波焊接.Unbalanced Transmission Line非平衡式傳輸線.Undercut, Undercutting側蝕.Underplate底鍍層.Universal Tester汛用型電測機.Unsupported Hole非鍍通孔.Urea尿素.Urethane胺基甲酸乙脂.*****V*****Vacuoles焊洞.Vacuum Evaporation(or Depositi真空蒸鍍法.Vacuum Lamination真空壓合.Van Der Waals Force凡得華力.Vapor Blasting蒸汽噴砂.Vapor Degreasing蒸汽除油法.Vapor Phase Soldering氣相焊接.Varnish凡力水,清漆(樹脂之液態單體). V-cut V型切槽.Very Large-Scale Integration(VL極大勣體電路器.Via Hole 導通孔.Vickers Hardness維氏硬度.Viscosity粘滯度,粘度.Vision Systems視覺系統.Visual Examination目視檢驗.Void 破洞,空洞.Volatile Content揮發份含量.Voltage電壓.Voltage Breakdown崩潰電壓.Voltage Drop 電壓降落.Voltage Efficiency電壓效率.Voltage Plane電壓層.Voltage Plane Clearance電壓層的空環. Volume Resistivity體勣電阻率. Volume Resistivity體勣電阻率. Volumetric Analysis容量分析法. Vulcanization交聯,硫化.*****W*****Wafer晶圓.Waive暫准過關,暫不檢查. Warp Size 漿經處理.Warp, Warpage板彎.Washer墊圈.Waste Treatment廢棄處理.Water Absorption吸水性.Water Break水膜破散,水破. Water Mark水印.Watt瓦特.Watts Bath瓦玆鍍鎳液.Wave Guide導波管.Wave Soldering波焊.Waviness 波紋,波度.Wear Resistance耐磨性,耐磨度. Weatherability耐候性.Weave Eposure織紋顯露.Weave Texture織紋隱現.Web蹼部.Wedge Bond 楔形結合點.Wedge Void楔形缺口(破口).Weft Yarn緯紗.Welding熔接.Wet Blasting溼噴砂.Wet Lamination溼壓膜法.Wet Process溼式制程.Wetting Agent潤溼劑.Wetting Balance沾錫天平.Wetting Balance沾錫,沾溼.Whirl Brush旋渦式磨刷法.Whirl Coating旋渦塗布法.Whisker晶須.White Residue白色殘渣.White Spot白點.Wicking燈蕊效應.Window操作范圍,傳動齒孔. Wiping Action 滑動接觸(導電).Wire Bonding打線結合.Wire Gauge線規.Wire Lead金屬線腳.Wire Pattern布線圖形.Wire Wrap繞線互連.Working Master工作母片.Working Time (Life)堪用時間. Workmanship 手藝,工藝水平,制作水準. Woven Cable扁平編線.Wrinkle皺折, 皺紋.Wrought Foil鍛碾金屬箔.*****X*****X Axis X軸.X-Ray X光.X-Ray Fluorescence X螢光.*****Y*****Yarn紗線.Y-Axis Y軸.Yield良品率,良率,產率. Yield Point屈服點.*****Z*****Z-Axis Z軸.Zero Centering中心不變(疊合法). Zig-Zag In-Line Package (ZIP)鍊齒狀雙排腳封裝件.145-(145÷Sp.Gr)÷(Sp.Gr-130)水"1g/cm的比值).。
PCB专业英语和层定义
PCB专业英语(PCB SPECIAL ENGLISH)1.PCB=Printed Circuit Board 电路板2.CAM=Computer aided manufacture 计算机辅助3.Pad 焊盘4.Annular ring 焊环5.AOI=automatic optical inspection 自动光学检测6.Charge of free 免费7.WIP=work in process 在线板8.DCC=document control center 文控中心9.Legend 字符10.CS=Component Side =Top Side （顶层）元件面11.SS=Solder Side =Bottom Side （底层）焊锡面12.Gold Plated 电金，镀金13.Nickel Plated 电镍，镀镍14.Immersion Gold 沉金=沉镍金15.Carbon Ink Print 印碳油16.Microsection Report 切片报告，横切面报告17.X-out=Cross-out 打“X”报告18.Panel （客户称）拼板，（生产线称）工作板19.Marking 标记，UL 标记20.Date code 生产周期21.Unit 单元，单位22.Profile 外形，轮廓<outline>23.Profile By Routing 锣(铣)外形24.Wet Film 湿菲林,湿绿油,湿膜25.Slot 槽,方坑26.Base Material=Base Laminate 基材,板料27.V-out =V-score V形槽28.Finished 成品29.Marketing 市场部30.Gerber File GERBER文件31.UL LOGO UL标记32.E-Test=Electric Open/Short Test 电子测试33.PO=Purchase Order 订单34.Tolerance 公差35.Rigid,Flexible Board 刚性,软性板36.Board cut 开料37.Board baking 焗板38.Drill 钻孔39.PTH=Plated Through Hole 镀通孔,沉铜40.Panel plating 板面电镀,全板电镀41.Photo Image 图象,线路图形42.Pattern plating 线路电镀43.Etching 蚀板,蚀刻44.SM=Solder Mask 防焊,阻焊,绿油45.SR=Solder Resist 防焊,阻焊,绿油46.Gold finger 金手指47.Silkscreen 丝印字符48.HAL=HASL=Hot air(Solder)leveling 热风整平喷锡49.Routing 锣板,铣板50.Punching 冲板,啤板51.FOC=final quality checking 终检,最后检查52.FOA=final quality audit 最后稽查(抽查)53.Shippment 出货54.Flux 松香55.Au金,Cu铜,Ni镍,Pb铅,Tn锡,Tin-lead锡铅合金56.Lead free 无铅57.COC=compliance of certificate 材料证明书58.Microsection=cross section 微切片,横切片59.Chamical gold 沉镍金60.Mould=punch die 模具,啤模61.MI=manufacture instruction 制作批示62.QA=quality assurance 品质保证63.CAD=computer aided design 计算机辅助设计64.Drill bit size钻咀直径<diameter>65.Bow and twist 板弯和板曲66.Hit 击打,孔数67.Bonding 邦定,点焊68.Test coupon 测试模块(科邦)69.Thieving copper 抢电流铜皮70.Rail-web71.Break-up tab 工艺边72.Break away tab 工艺边73.GND=ground 地线,大铜皮74.Hole edge 孔边,孔内75.Stamp hole 邮票孔76.Template 天坯,型板,钻孔样板(首板)77.Dry film 干菲林,干膜78.LPI=liquid photo image 液态感光=湿绿油79.Multilayer 多层板80.SMD=surface mouted device 贴片,表面贴装器件81.SMT=surface mouted technology 表面贴装技术82.Peelable mask=blue gel 蓝胶83.Tooling hole 工艺孔,管位,定位孔,工具孔84.Fiducial mask 测光点,光学对位点,对光点,电眼85.Copper foil 铜箔86.Dimension 尺寸87.Nagative负的,positive正的88.Flash gold 闪镀金,镀薄金89.Engineering department 工程部90.Delivery date 交货期91.Bevelling 斜边92.Spacing=gap 间隙,气隙,线隙PCB的各层定义及描述为了方便与印制板厂家的技术沟通，提高对PCB的技术认知一致度，特在此将我司常用PCB的有关板层特性做简单说明，请爱好者参考此说明进行设计和制造。
PCB常用英文词汇汇编
A aA.O.I(Automatic Optical Inspection)自动光学检查Apparatus设备，仪器Acceptable quality level (AQL)可接受质量水平Area面积Accuracy精确度Artwork菲林Activating活化Artwork Drawing菲林图形Active carbon treatment活性碳处理Artwork Film原装菲林After Pressed Thickness压板后之厚度Artwork Modification菲林修改Alignment校直，结盟Artwork No.菲林编号Annular ring锡圈Assembly组装，装配Anti-Static Bag静电胶袋Axis轴B bBackplane背板Blistering起泡/水泡Back-up垫板Board Cutting开料Baking 烘板Board Thickness板厚Ball Grid Array (BGA)球栅阵列Bottom side底层Bare board裸板Breakaway tab打断点Base Copper底铜Brushing磨刷Base material基材Build-up积层Bevelling斜边Bullet pad子弹盘Black Oxide黑氧化Buried hole埋孔Blind via hole盲孔C cC/M(Component Marking)元件字符Conductor width/space导体线宽/线隙Carbon ink碳油Contact接点Carrier带板Copper area铜面积Ceramic substrate陶瓷Copper clad铜箔Certificate of Compliance合格证书Copper foil铜箔Chamfer倒角Copper plating电镀铜Chemical cleaning化学清洗Corner角线Chemical corrosion化学腐蚀Corner mark板角记号Chip Scale Package (CSP)晶片比例包装Corner REG.Hole角位对位孔Circuit线路Cracking裂缝Clearance间距/间隙Creasing皱折Color颜色Criteria规格,标准Component Side(C/S)元件面Crossection area切面Composite layers复合层Cu/Sn Plating镀铜锡Computer Aided Design (CAD)电脑辅助设计Current efficiency电流效率Computer Aided Manufacturing (CAM)电脑辅助制作Customer客户Computer Numerial Control (CNC)数控Customer Drilling File客户钻孔资料Conductor导体Customer P/N客户产品编号D dD/F Registration Hole干菲林对位孔Diamond钻石D/F(Dry Film)干膜Diazo film重氮片Date Code日期代号Dielectric breakdown介电击穿Datum hole基准参考孔Dielectric constant介电常数Daughter board子板Dielectric Thickness介电层厚度Deburring去毛刺Dielectric Voltage Test绝缘测试Defect缺陷Dimension尺寸Definition定义Dimensional stability尺寸稳定性Delamination分层Direct/indirect直接/间接Delay耽搁Distribution发放Delivery交货Document type文件种类Densitomefer透光度计Documentation Control文件控制Density密度Double sided board双面板Department部门Drill bit钻咀Description说明Drilling钻孔Design origin设计原点Drilling Roughness钻孔粗糙度Desmear去钻污,除胶Dry Film 干菲林Dessicant防潮珠Dry Film-Pattern干膜线路Developer显影液,显影机Dynamic动态E eECN(Engineering Change Notification)工程更改通知Entek有机涂覆Effective date有效期Epoxy glass substrate环氧玻璃基板Electrical Test Fixture电测试 针床Epoxy resin环氧基树脂Electro migration漏电Etch蚀刻Electroconductive paste导电胶Etchback凹蚀Electroless无电沉Etching蚀刻Electroless copper无电沉铜E-Test Marking电测试标记Electroless Ni无电沉镍E-Test(Electrical Test)电测试Electroless Gold/Au无电沉金Exposure曝光Engineering drawing工程图纸External layer外层F fFiducial mark基准点Fixture夹具Filling填充Flammability可燃性Film Fabrication菲林制作Flash Gold薄金Final QC最终检查Flexible易曲的,能变形的Finish Overall Board Thickness成品总板厚度Flux助焊剂G gGeneral information一般资料Golden board金板Ghost image重影Grid网格Glass transition temperature玻璃化湿度Ground plane地线层Gold Finger(G/F)金手指H hHAL(Hot Air Leveling)热风整平Hole density孔的密度Hand Rout手锣Hole Diameter孔径Hardness硬度Hole location孔位Heat Sealed热密封Hole Location Chart孔位座标表Heat Shrink-warp热收缩Hole Position Tolerance孔位误差Holding time停留时间Hole size孔尺寸Hole孔Hot Air Leveling(HAL)热风整平Hole breakout破环Humidity湿度IIdentification标识,指标Inter Plane Separation内层分离Image影像Interleave Paper隔纸Imaging transfer图形转移Internal layer内层Impedance阻抗Internal stress内应力Impedance Test阻抗测试Ionic cleanliness离子清洁度Inner copper foil 内层铜箔Isolation孤立Inspection检验Isolation Resistance绝缘电阻Insulation resistance Test绝缘测试Item项目K kKEY board按键盘Kraft paper牛皮纸Key slot槽孔L lLaminate板材Legend Width字符宽度Laminate Thickness材料厚度Length长度Lamination void 层间空洞Lifted Lands残铜Landless hole破孔Line Width线宽Laser plotter激光绘图机Liquid液体Laser plotting激光绘图Location位置Laser via hole激光穿孔Logic diagram逻辑图形Layup层压配本Logo唛头,标记Lay-up Instruction压板指示Lot size批卡Legend字符M mMark标记Min. Nickel Thickness最小镍厚Master drawing菲林图形Min. Tin-Lead Thickness (After HAL)（喷锡后）最小锡厚Material Thickness材料厚度Min.Annular Ring最小环宽Material Type材料类型Min.Spacing between Line to Line线与线之间的最小距离Max. X-out坏板上限Min.Spacing between Line to Pad线与焊盘之间的最小距离Max.Board Thickness After Plating电镀后总板厚度之上限Min.Spacing between Pad to Pad焊盘与焊盘之间的最小距离Measling白斑Minimum 最小Mech Drawing No.图纸编号Mirroring镜像Mechanical cleaning机械清洗Missing 缺少Metal金属Model No.产品名称Method方法Molded模塑MI(Manufacturing Instruction)生产制作指示Mother board主板Microstrip微条线Moulding模房Min Conductor Copper Thickness最小线路铜厚Mounting hole安装孔Min Hole Wall Copper Thickness最小孔壁铜厚Multilayer多层板Min. Gold Plating Thickness最小金厚Multi-layer Laminate多层板材料N nNegative反面的No.of Panel per Stack每叠板数Net list网络表No.of Panel/Sheet每张大料拼板数Network网络No.of Pcs Per Bag每包数量Nick缺口No.of Unit/Array每套单元数No. of holes孔数Normal value标准值No.of Array/Panel每个拼板套板数O oOblong椭圆形的Organic Solerability Peservatives(OSP)有机保护剂Offset 偏移Originator原作者Open/short开路/短路Outer copper foil外层铜箔Optimization(design)最佳化(设计)Outline外形P pPacking包装Pitch间距Packing包装Placement放置Pad焊盘Plated Though Hole(PTH)沉铜Panel Area拼板面积Plating电镀Panel Plated Crack板镀缺口Plating Crack电镀裂缝Panel plating整板电镀Plating line电镀线Panel Size拼板尺寸Plating rack电镀架Panel Size After Outerlayer Cutting外层切板后拼板尺寸Plating Void电镀针孔Panel Utilization拼板利用率Plug Hole塞孔Pass rate通过率Polymer聚合体Passivation钝化Porosity孔隙率Pattern线路Positive绝对的Pattern Inspection线路检查Power plane电源层Pattern plating图形电镀Prepreg半固化片PCB(Printed Circuit Board)印制线路板Primary side首面Peck drilling啄钻Print印刷Peel strength 剥离强度Probe point针床测点Peelable可剥性Process工序Peelable 剥离强度Process flow工序流程Peelable Mask可脱油Product Planning Dept.生产计划部Peeling剥离Production生产板Permanent永久性Profile外形PH value PH值Profiling 外形加工Photo plotting图形输出Profiling Process外形加工Photo via hole菲林过孔Project No.产品编号Photographers照片靶标PTH Thermal Seress Test PTH热冲击测试Photoplotler光绘机PTH(Plating Through Hole)沉铜Physical物理的Pull away拉离Pin hole销定孔Punch啤模Pink ring粉红环Punching冲切Pinning hole钻孔管位Punching Mould Drawing啤模图形Q qQA Audit品质审计Quality质量QA(Quanlity Assurance)品质部Quantity数量Quad Palt Pack (QFP)四边扁平林整器件R rRaw Material Utilization原材料利用率Resist抗蚀剂Recall回收Resolution分辨率Rectifier整流器Rigid精密的Register mark对位点Roller coating涂覆Registration重合点Roughening粗化Remark备注Round pad圆盘Resin树脂Routing外形加工,铣板Resin Recession流胶S sS/M Material绿油物料Solder mask on bare copper (smobc)裸铜覆盖阻焊膜S/M(Solder Mask)阻焊Solder side焊接面Sales 销售Solder Side C/M阻焊面字符Sample样板Solder Side Cir.焊接面线路Sampling inspection抽样检验Solder Side Circuit焊接面Scaling factor缩放比例因素Solder Side S/M焊接面阻焊Scope范围Solderability可焊性Scoring刻槽Solvent Test可溶性测试Scratch划痕Spacing线距Secondary side第二面Special requirement 特殊要求Section Code组别代号Specification详细说明，规范Section Code Change组别代号更改Spindle主轴Segment部分,片段Split裂片Separated分离Square pad方块Sequence顺序Standard标准值Sets套Static静态Sheet Size大料尺寸Stencial网版Shematic diagram原理图Step drilling分布钻Shiny有光泽的,发光的Step scale光梯尺Silk screen丝印Store货仓Silver film银盐片Supplier供应商Single/double单层/双面Supported hole支撑点Slot 槽,坑Surface表面Smear污点Surface mount technology表面组装技术Solder Mask阻焊Swimming滑移T tTack堆起Thermal stress热应力Tape Programming铬带制作Thickness厚度Tape Test胶带测试Tin Content锡含量Target Hole目标孔Tin/Lead Stripping退铅锡Teardrop 泪珠Tin-lead plating电镀铅锡Template天平Tolerance公差Tenting封孔Top side板面Test测试Touch up修理(执漏) Test coupon图样Training训练Test Parameter测试参数Transmission传输线Test Pattern测试孔Transmittance传送Testing Voltage电压Trim line修剪Thermal shock热冲击U uUltrasonic cleaning超声波清洗Unit Layout Per Panel单元拼板图Undercut侧蚀Uv-blocking 阻挡紫外线Unit Arrangement单元排版V vVacunm Pack真空包装Visual & Warpage可视性和翘曲度Vacuum lamination真空压制Visual inspection目检V-Cut V- 坑Voltage 电压View From…观察方向由…W wW/F(Wet Film)湿膜Width宽度Warp & Twist翘曲和弯曲Wiring线路。
pcb英语
中英文对照的PCB专业用语（1）－－综合词汇一、综合词汇1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (pcb)5、印制线路板：printed wiring board(pwb)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(ssb)11、双面印制板：double-sided printed board(dsb)12、多层印制板：mulitlayer printed board(mlb)13、多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayer prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit (fpc)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated mulitlayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board (bum)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit (slc)43、埋入凸块连印制板：b2it printed board44、多层膜基板：multi-layered film substrate(mfs)45、层间全内导通多层印制板：alivh multilayer printed board46、载芯片板：chip on board (cob)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable (ffc)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark中英文对照的PCB专业用语（2）－－基材二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (ccl)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：catalyzed board ,coated catalyzed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover layer (cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper ccl)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper ccl)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates中英文对照的PCB专业用语（3）－－基材的材料三、基材的材料1、a阶树脂：a-stage resin2、b阶树脂：b-stage resin3、c阶树脂：c-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent (wpe)27、环氧值：epoxy value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film (pi)38、聚四氟乙烯：polytetrafluoetylene (ptfe)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (fep)40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、e玻璃纤维：e-glass fibre43、d玻璃纤维：d-glass fibre44、s玻璃纤维：s-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil (ed copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (ra copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil (rcc)96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔（剖面）轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing104、双面处理铜箔：double treated foil中英文对照的PCB专业用语（4）－－设计四、设计1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(cad)7、计算机辅助制造：computer-aided manufacturing.(cam)8、计算机集成制造：computer integrat manufacturing.(cim)9、计算机辅助工程：computer-aided engineering.(cae)10、计算机辅助测试：computer-aided test.(cat)11、电子设计自动化：electric design automation .(eda)12、工程设计自动化：engineering design automaton .(eda2)13、组装设计自动化：assembly aided architectural design. (aaad)14、计算机辅助制图：computer aided drawing15、计算机控制显示：computer controlled display .(ccd)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：layout effeciency26、机器描述格式：machine descriptionm format .(mdf)27、机器描述格式数据库：mdf databse28、设计数据库：design database29、设计原点：design origin30、优化（设计）：optimization (design)31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database38、元件安置：component positioning39、图形显示：graphics dispaly40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规则检查：design rule checking53、走（布）线器：router (cad)54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing (pdp)59、交互式制图设计：interactive drawing design60、费用矩阵：cost metrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：manhatton distance70、欧几里德距离：euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated layer78、定顺序：definite sequence中英文对照的PCB专业用语（5）形状与尺寸五、形状与尺寸：1、导线（通道）：conduction (track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer no.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、v形盘：v-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole (pth)31、余隙孔：access hole32、盲孔：blind via (hole)33、埋孔：buried via hole34、埋/盲孔：buried /blind via35、任意层内部导通孔：any layer inner via hole (alivh)36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum reference。
pcb常用英语
指表層對主體的附著強弱而言,如綠漆在銅面,或銅皮在 基材表面,或鍍層與底材間之附著力皆是. 4.Annular ring 孔環----
指繞在通孔周圍的平貼在板面上的銅環而言.在內層板 上此孔環常以十字橋與外面大地相連,且更常當成線路的端
在含金屬離子的電鍍液中施加直流電,使在陰極上可鍍 出金屬來.此詞另有同義字 Electroplating,或簡稱為 plating.更正式的說法則是 electrol ytic plating.是一種 經驗多於學理的加工技術.
28.Elongation 延伸性 常指金屬在拉張力(tension)下會變長,直到斷裂發生前
指銅面上所呈現緩和均勻的下陷,可能由於壓合所用鋼 板其局部有點狀突出所造成,若呈現斷層式邊緣整齊之下降 者,稱為 Dish Down. 20.Desmearing 除膠渣
指電路板在鑽孔的摩擦高熱中,當其溫度超過樹脂的 Tg 時,樹脂將呈現軟化甚至形成流體而隨鑽頭的旋轉涂滿孔壁, 冷卻后形成固著的膠糊渣,使得內層銅孔環與後來所做銅孔 壁之間形成隔閡.故在進行 PTH 之初,就應對已形成的膠渣, 施以各種方法進行清除,而達成后續良好的連接
是將印過綠漆半成品的板子浸在熔錫中,使其孔壁及裸 銅焊墊上沾滿焊錫,接著立即自錫池中提出,再以高壓的熱 風自兩側用力將孔中的填錫吹出,但仍使孔壁及板面都能沾 上一層有助於焊接的焊錫層,此種製程稱為“噴錫”,大陸 業界則直譯為“熱風整平”.由於傳統式垂直噴錫尚會造成 每個直立焊墊下緣存有“錫垂”(Solder Sag)現象,非常不 利於表面黏裝的平穩性,甚至會引發無腳的電阻器或電容器, 在兩端焊點力量的不平衡下,造成焊接時瞬間浮離的墓碑效 應(Tombstoning),增加焊后修理的煩惱.新式的“水平噴 錫”法,其錫面則甚為平坦,已可避免此種現象.
线路板PCB专业英语词汇(制造、测试、缺陷名等)
Mask
掩膜
Solder resist、solder mask
阻焊剂
Solder mask ink
阻焊印料
Dry film solder mask
阻焊干膜
Liquid photosensitive
solder resist
液体光致阻焊剂
Marking ink、legend ink
标记印料
brushing / scrubbing
磨刷
abrasive
磨料
scrubber
磨刷机
mechanical cleaning
机械清洗
chemical clearing
化学清洗
pumice power
浮石粉/火山灰
sand blasting
喷砂
deburring
去披峰/去毛刺
mechanical polishing
Flexible printed circuit board
挠性印制电路板
Flex-rigid printed circuit board
挠性印制电路板
Build-up printed board
积层印制板
Surface laminar circuit (SLC)
表面层合电路板
B2it printd board
Computer-aided manufacturing (CAM)
计算机辅助制造
Routing
布线
Layout
布图设计
Component density
元件密度
Arry
阵列
3.2 形状与尺寸
Conductor
导线
PCB专业英语
PCB专业英语PCB printed circuit board 印刷电路板，指空的线路板PCBA printed circuit board assembly 印刷电路板组件，指完成元件焊接的线路板组件PWA Printed Wire Assembly，Aperture list Editor：光圈表编辑器。
Aperture list windows：光圈表窗口。
Annular ring：焊环。
Array：拼版或陈列。
Acid trip：蚀刻死角。
Assemby：安装。
Bare Bxnel：光板，未进行插件工序的PCB板。
Bad Badsize：工作台，工作台有效尺寸。
Blind Buried via：盲孔，埋孔。
Chamfer：倒角。
Circuit：线路。
Circuit layer：线路层。
Clamshell tester：双面测试机。
Coordinates Area：坐标区域。
Copy-protect key：软件狗。
Coutour：轮廓。
Draw：一种圆形的光圈，但只是用于创建线路，不用于创建焊盘。
Drill Rack：铅头表。
Drill Rack Editor：铅头表编辑器。
Drill Rack window：铅头表窗口。
D Code：Gerber格式中用不着于表达光圈的代码。
Double-sided Biard：双面板。
End of Block character（EOB）：块结束符。
Extract Netlist：提取网络。
Firdacial：对位标记。
gfgfgfggdgeeeejhjjFlash：焊盘，来源于早期矢量光绘机，在矢量光绘机中，焊盘是光通过光圈“闪出”（Flash）而形成的。
Gerber Data：从PCB CAD系统到PCB生产过程中最常用的数据格式。
Grid ：栅格。
Graphical Editor：图形编辑器。
Incremental Data：增量数据。
Land：接地层。
完整word版,PCB常用英语对照
Concord Electronics CO.,LtdzengxianPCB常用英语对照⏹第一章.认识我们的PCB⏹第二章.了解客户要求(PO&MO)⏹第三章.工程常用英语⏹第四章.品质常用英语⏹第五章.实用相关PCB英语⏹第一章.认识我们的PCB⏹ 1.元件面Component Side (CS)⏹ 2.焊接面Solder Side (SS)⏹ 3.单面板Single side board (SS)⏹ 4.双面板Double side board (DS)⏹ 5.多层板Multi-layer board⏹ 6.孔Hole⏹7.有铜孔Plated Though Hole (PTH)⏹8.无铜孔None Plated Though hole (NPTH)⏹9.过电孔Via Holes⏹10.定位孔Tooling Holes⏹11.锡/无铅喷锡Tin (Sn)/Lead free Hot air lever⏹12.铜/抗氧化/松香Copper (Cu) /OSP/Entek/Flux⏹13.金/电金/沉金Gold (Au)/Gold plating (Flash Gold)/Immersion Gold⏹14.镍/电镍Nickel (Ni)/Nickel Plating⏹15.铅/有铅锡Lead (Pb)/Hot air level (HAL)⏹16.(绿)阻焊(Green) Solder mask⏹17.(白)字符(White) Silkscreen (legend)⏹18. 碳油Carbon⏹19. (蓝)胶(Blue) peelable mask⏹20.绿油桥solder mask bridge⏹21.绿油塞孔Plug-holes⏹22.绿油开窗Opening⏹23.线路/线宽Track/line width⏹24.线距Line spacing⏹25.焊盘/焊环/贴片PAD/Ring/SMT/IC/BGA⏹26. 大铜皮Copper area (GND)⏹27.槽孔Slot hole⏹28.外形Outline⏹29.锣板CNC Routing⏹30.啤板Punching⏹31. V-坑V-Cut⏹32.钻孔/二钻drill /Second drill⏹33.工作边/对光点Frame /Fiducial mark第二章.了解客户要求(PO&MO)⏹ 1.采购订单Purchase Order⏹ 2.生产订单Manufacturing Order⏹ 3.客户名称Customer ‘s Name⏹ 4.下单日期Order Date⏹ 5.交货日期Delivery Date⏹ 6.交货数量Order Qty⏹7.客户编号Part Number( P/N.)⏹8.本厂型号Factory Number (No.)⏹9.单价Unit price⏹10.菲林费Film Cost⏹11.测试架费E-test Cost⏹12.总金额Total Amount⏹13.要求说明Specifications; note; warning⏹14.单元尺寸Unit size⏹15.拼版尺寸Panel size⏹16.材料(板材) Material⏹17.表面工艺Surface ;Finish⏹18.阻焊(绿油)Solder mask ;Wetting film LPI;⏹19.丝印(白字) Silkscreen ; legend⏹20.外形Outline ;Profile⏹21.叉板出货“X”-out panel⏹22.包装Packing ;Vacuum-pack ;Manual-pack⏹23.箱唛Carton Lable⏹24.文件资料Offers file (data)⏹25.备注Remarks⏹26.供应商Supplier ; Vendor⏹27.内容Description第三章.工程常用英语⏹ 1.计算机辅助设计Computer-Aided Design .(CAD)⏹ 2.计算机辅助制造Computer-Aided Manufacturing .(CAM)⏹ 3.制作指示Manufactural Instruction⏹ 4.菲林Film⏹ 5.样板Sample⏹ 6.生产板Product Board⏹7.顶层线路Top layer (c.s.)⏹8.底层线路Bottom layer (s.s.)⏹9.内层线路Inner layer⏹10.接地/电源层GND/Power layer⏹11.PP片Preprg⏹12.顶/底层阻焊层Top/Bottom solder mask layer⏹13.字符层Silkscreen layer⏹14.碳油层Carbon layer⏹15.蓝胶层Blue Peelable mask layer⏹16.钢网层Paste layer⏹17.外形层Profile layer(outline)⏹18.分孔图drill chart⏹19.机械图Machine drawing⏹20.流程图Process drawing⏹21.板厚Board Thickness (THK)⏹22.铜厚Copper Thickness (THK)⏹23.最大的Maximal⏹24.最小的Minimum⏹25.公差Tolerance⏹26.尺寸Size⏹27.长Long⏹28.宽Width⏹29.重Weight⏹30.直径Diameter⏹31.半径Radius⏹32.光圈表Aperture list/ D-code⏹33.钻孔表NC Tool Tables⏹34.正方形/长方形Square/Rectangle⏹35.圆形Round⏹36.八角形Octangle第四章.品质常用英语⏹ 1.合格品Good (ok) board⏹ 2.修理品Repairing board⏹ 3.报废品Scrap board⏹ 4.接受Accept (Acc.)⏹ 5.拒收Reject (Rej.)⏹ 6.出货报告Quality Assurance Outgoing Report⏹7.切片报告Micro-Section Report⏹8.可焊性测试报告Solderability Test Report⏹9.纠正改善措施报告Complaint Action Report⏹10.最小线宽Min. line width⏹11.最小线距Min. Spacing⏹12.最小焊环Min. Annular Ring⏹13.顶层与底层对位偏差Front& Back Registration⏹14.镀铜厚PTH thickness⏹15.镍厚Nickel thickness⏹16.金厚Gold thickness⏹17.阻焊厚Solder coating thickness⏹18.金手指厚Overall Finger Thickness⏹19.3M 胶带测试Tape test⏹20.阻焊类型及颜色S/M Material & Color⏹21.字符类型及颜色C/M Material & Color⏹22.溶剂测试Solvent Test⏹23.印碳油Carbon print⏹24.电测试Electronical Test⏹25.要求孔径Hole Size Required⏹26.实际测量Actual Size⏹27.标记Marking (UL CEC logo)⏹28.板弯/板曲Warp & Twist⏹29.主要缺陷Main Defect⏹30.开/短路Open / Short⏹31.多孔/少孔Superfluous/ Missing Holes⏹32.偏孔Secund holes⏹33.爆孔Blow holes⏹34.线路缺损circuit damage⏹35.露铜Expose copper⏹36.甩铜(金) Peel off copper (gold)⏹37.线幼Circuit Thin⏹38.针孔Pinhole⏹39.凸线Circuit bulgy⏹40.掉绿油Solder mask Peel off⏹41.绿油入孔Solder mask fill into holes⏹42.绿油塞孔Solder mask plug holes⏹43.字符上PAD Silkscreen fall on Pads⏹44.字符不清Silkscreen unclear⏹45.漏印标记Missing the marking⏹46.板料分层Delamination⏹47.铜皮起泡Conductor Crack⏹48.上锡不良Non-wetting⏹49.擦花Scrape⏹50.氧化Oxidation⏹51.超出公差Out of Tolerance第五章.实用相关PCB英语⏹ 1.数词,数量Quantity / Qty⏹ 2.一,十,十一One ,Ten, Eleven⏹ 3.二,十二,二十Two , Twelve, Twenty⏹ 4.三,十三,三十Three, Thirteen, Thirty⏹ 5.四,十四,四十Four, Fourteen, Forty⏹ 6.五,十五,五十Five, Fifteen, Fifty⏹7.六,十六,六十Six, Sixteen, Sixty⏹8.七,十七,七十Seven, Seventeen, Seventy⏹93.八,十八,八十Eight, Eighteen, Eighty⏹10.九,十九,九十Nine, Nineteen, Ninety⏹11.零,百,千,百万Zero, Hundred, Thousand, Million⏹12.第一,第二,第三First, Second, Third⏹13.单位Unit⏹14. 米,厘米Meter, Centimeter⏹15.毫米,微米Millimeter, Micron⏹16.英尺,英寸Feet, Inch⏹, 微英寸Mil, Micro-inch⏹18.平方米/尺Square (sq.) meter / Feet⏹19.千克,克Kilo-Gram, Gram⏹20. 安士(盎司) Ounce⏹21.颜色Color⏹22.黑色,哑黑色Black , Matte Black⏹23.白色White⏹24.绿色Green⏹25.蓝色Blue⏹26.红色Red⏹27.黄色Yellow⏹28.日期,星期Date, Week⏹29.星期一到日Monday, Tuesday, Wednesday, Thursday, Friday, Saturday, Sunday ⏹30.春夏秋冬Spring, Summer, Autumn, Winter⏹31.一月,二月January, February⏹32.三月,四月March, April⏹33.五月,六月May, June⏹34.七月,八月July, August⏹35.九月,十月September, October⏹36.十一月,十二月November, December⏹37.页Page⏹38.人民币RMB⏹39.港币HKD⏹40.美圆USD⏹41.欧圆EUR。
pcb行业英汉词典
一、综合词汇ﻫ１、印制电路:prinｔed ｃirｃuitﻫ2、印制线路：ｐriｎted wiring3、印制板:ｐrintｅｄｂoａrd4、印制板电路：ｐrinｔedｃirｃuit boaｒｄ(ｐcb)5、印制线路板：priｎted wiｒｉng board（ｐｗｂ)ﻫ６、印制元件：pｒiｎteｄｃｏmponｅnｔ７、印制接点:prｉnｔed contacｔ8、印制板装配：printeｄbｏaｒd ａssembｌy11、双面印制板:do10、单面印制板:ｓingle－ｓided ｐrinｔed board(ｓsb）ﻫ９、板:boarｄﻫｕble-sidｅd printed board(dsb)12、多层印制板:mulitｌaｙer pｒinｔｅd ｂｏaｒｄ(mlb)ﻫ１3、多层印制电路板：mｕliｔlayer15、刚性印prinｔed cirｃuit boaｒdﻫ１4、多层印制线路板:ｍｕlitlａyer pritedｗiring boaｒdﻫ制板：rigｉｄｐrｉnｔed boarｄﻫ1６、刚性单面印制板：rigid single-ｓｉded prｉｎｔｅd boraｄ17、刚性双面印制板:ｒｉgｉd dｏuｂle-sidedｐｒinｔeｄborad18、刚性多层印制板：rｉgｉd muｌｔilaｙｅr pｒｉnted bｏardﻫ1９、挠性多层印制板:fｌeｘiｂle mulｔilayer prｉnted bｏarｄ２0、挠性印制板：flexiｂｌe prinｔed board２1、挠性单面印制板:fｌeｘible siｎgle-sｉｄed printed boaｒｄﻫ２２、挠性双面印制板：flexi ｂlｅdouｂlｅ-sｉded printed bｏarｄﻫ２3、挠性印制电路:fｌｅｘｉblｅprintｅd cｉrcuit (fpc)ﻫ24、挠性印制线路:ｆlexiｂle pｒinted wiring26、刚性２5、刚性印制板:flex-rigid pｒinｔed board, rigｉｄ－ｆlｅx prｉｎｔeｄboaｒdﻫ双面印制板：ｆlex-rigidｄoｕbｌe-ｓｉded ｐrinted bｏard，riｇid－flｅｘdoubｌe－ｓ27、刚性多层印制板:flex-rigid ｍultiｌaｙeｒｐrinted bｏａrd，rigiｄ-flex ｉｄed prinｔedﻫｍｕｌtｉlayｅr ｐrintｅｄboardﻫ2８、齐平印制板：flush ｐrinted ｂoarｄ29、金属芯印制板:ｍetal coｒe priｎted bｏａｒd30、金属基印制板:mｅtal bａse printeｄｂoard32、陶瓷印制板：cerａmic ｓｕｂsｔrate 31、多重布线印制板:muliｔ-wiring printedｂoarｄﻫ33、导电胶印制板：elｅctroconductｉve ｐａste ｐrinｔed bｏａrdﻫ34、模ｐrinｔed ｂoardﻫ35、模压印制板：ｓtampeｄprinteｄwiring bｏ塑电路板：molded circｕｉt ｂoａｒｄﻫardﻫ36、顺序层压多层印制板：seqｕentially-lａminateｄmulitｌａyｅr39、积38、微线印制板：micrｏwire boaｒdﻫ37、散线印制板：dｉscrete wirｉnｇboａrdﻫ层印制板：buile-up pｒinteｄbｏaｒdﻫ４0、积层多层印制板：ｂuild-up ｍｕlitlaｙeｒｐriｎtｅd ｂｏａｒd（ｂum）41、积层挠印制板：build－ｕp flｅxible printed board42、表面层合电路板：ｓurfａcｅlaminａr ｃｉrcuｉt (slc）43、埋入凸块连印制板:b２itｐrｉnteｄboard44、多层膜基板：mulｔｉ-layered fiｌm ｓuｂｓｔraｔe(mfs)46、载芯片板：chip ｏｎ45、层间全内导通多层印制板:alｉvｈmuｌtilayer ｐrinteｄboardﻫ48、母板:ｍotｈeｒｂｏaｒdboａｒｄ(cob)ﻫ4７、埋电阻板:ｂurｉed resistanｃe boardﻫ４9、子板:dauｇhtｅr bｏaｒd50、背板：backｐlaｎeﻫ５1、裸板：bare boarｄﻫ52、键盘板夹心板：cｏpper-iｎvar－cｏpｐｅr board５3、动态挠性板：dynaｍic fleｘｂoaｒd54、静态挠性板：ｓｔａｔic flｅx boaｒdﻫ55、可断拼板：bｒeak-aｗaｙｐｌanel56、电缆：ｃablｅ5７、挠性扁平电缆：fleｘｉble flat ｃable (fｆc)58、薄膜开关:mｅmｂraｎｅswitchﻫ5９、混合电路:hｙbrid cｉｒｃuitﻫ６０、厚膜:ｔhick ｆ61、厚膜电路：tｈｉck film circuitｉlmﻫ64、互连：inter ６2、薄膜：thin filmﻫ63、薄膜混合电路：thin fｉlm hyｂｒｉd cirｃuitﻫ66、齐平导线:fluｓh coｎｄuctorﻫ６7、传65、导线:cｏｎductｏr tｒacｅlineﻫｃonnectionﻫ输线：traｎsmｉssioｎline6８、跨交:crｏssoveｒ69、板边插头：edge-ｂｏａｒd coｎtact70、增强板:stifｆｅneｒﻫ7１、基底：ｓubstraｔe73、导线面：conductor ｓideﻫ７4、元件面：comｐoneｎt sideﻫ7２、基板面：reaｌestａtｅﻫ７5、焊接面：solder side7６、印制：prｉntiｎgﻫ77、网格:ｇrｉd80、非导电图形:noｎ-ｃonduc79、导电图形：ｃｏｎｄｕｃtive patternﻫ7８、图形：patｔernﻫ81、字符:legｅｎｄﻫ82、标志：marｋｔｉｖe paｔｔerｎﻫ二、基材:1、基材：baseｍateriａlﻫ2、层压板:ｌaminatｅ3、覆金属箔基材：metal-cｌad baｄe ｍａteriａｌ4、覆铜箔层压板:ｃopｐer－claｄlaｍinatｅ(ccl)5、单面覆铜箔层压板：single-ｓided ｃoｐｐer-clａd laminａｔe6、双面覆铜箔层压板:dｏuｂｌe-ｓideｄcopｐer-ｃlad laｍｉnateﻫ7、复合层压板:cｏmpoｓite laminateﻫ８、薄层压板：thiｎｌamｉnaｔｅ10、金属基覆铜层９、金属芯覆铜箔层压板:ｍeｔaｌcｏreｃopｐｅr-ｃｌad lａminateﻫ压板:mｅtal base copper-clad lａminate1１、挠性覆铜箔绝缘薄膜：flｅxiｂle copper-clad ｄｉeleｃtric ｆiｌm14、粘结片：bｏnｄing ｓ12、基体材料：basｉs maｔerｉａlﻫ１３、预浸材料:prepｒeｇﻫｈｅｅt16、环氧玻璃基板：ｅpｏxy glaｓs substra 15、预浸粘结片：pｒeimpregnated ｂondiｎg sheerﻫ18、预制内层覆箔板:maｓｓl ｔeﻫ17、加成法用层压板:lａminatｅfoｒaddiｔive pｒocesｓﻫａmination paｎel19、内层芯板：core mateｒialﻫ２0、催化板材:cａtaｌyzed boaｒd ,ｃｏated cａｔａｌyｚｅdlaminate22、涂胶无催层压板：2１、涂胶催化层压板:aｄhesivｅ－coatｅd caｔalyｚed ｌaｍｉnatｅﻫadhesive－coａtｅd uｎcatalyｚed lａminate23、粘结层:bｏnｄing layer25、涂胶粘剂绝缘薄膜:ａdｈesive coatｅd dieｌｅｃtric film 24、粘结膜:fｉlｍadｈｅｓｉｖeﻫ２６、无支撑胶粘剂膜:unsupportｅd adｈeｓｉvｅfiｌmﻫ２7、覆盖层:cｏvｅr layer (coverlay)ﻫ28、增强板材:sｔｉfｆener mａtｅｒｉal2９、铜箔面：copper-clad surfａce31、层压板面:uncｌadｌａmiｎaｔｅｓurｆ30、去铜箔面:ｆoｉl remoｖal suｒfaceﻫaceﻫ32、基膜面：ｂａse fiｌm surfａce３３、胶粘剂面：aｄhesivｅfaｅｃﻫ３4、原始光洁面：platｅfiｎish35、粗面：maｔt fiｎiｓhﻫ3６、纵向:lｅnｇth wisｅdireｃｔｉon３7、模向:croｓs wｉse diｒection３８、剪切板：cut toｓiｚe paneｌ39、酚醛纸质覆铜箔板:pｈenolｉｃcｅlｌuｌoseｐaper coｐper-clad laｍinatｅｓ(pheno ｌiｃ/ｐａpeｒccl）ﻫ4０、环氧纸质覆铜箔板:ｅpoｘidｅcelluloｓe pａpｅｒcopper-cｌadｌamｉnaｔes (eｐoxｙ／papｅr ｃｃl)41、环氧玻璃布基覆铜箔板：epｏｘiｄｅwｏven ｇｌass fabric ｃopper-cｌad lａminateｓﻫ４2、环氧玻璃布纸复合覆铜箔板:eｐoxide ｃｅlｌulose ｐapeｒｃorｅ，gｌass cloth surｆaｃeｓｃoｐpeｒ-claｄlamｉｎates4３、环氧玻璃布玻璃纤维复合覆铜箔板:eｐｏｘide non woven／woven glasｓｒｅinｆorcｅdｃｏppeｒ－cｌａd laminａｔes45、44、聚酯玻璃布覆铜箔板：pｌoyestｅｒwｏvｅn glass fabrｉｃcoｐｐer-cｌad laminatesﻫ聚酰亚胺玻璃布覆铜箔板:pｏlｙimide wｏｖen glass fabｒic coppｅr-clad lａminatｅs4６、双马来酰亚胺三嗪环氧玻璃布覆铜箔板:bismaleiｍidｅ/tｒiazine／ｅｐoxide woven gｌaｓ47、环氧合成纤维布覆铜箔板:epｏxide synｔｈeｔic s faｂric copper-ｃlａｄｌａmimateｓﻫfibeｒfaｂriｃcopper-cｌad lamｉnａteｓﻫ４8、聚四乙烯玻璃纤维覆铜箔板：tｅflon／fiｂｅr glaｓｓcｏpper-ｃlad laminatesﻫ４9、超薄型层压板:ulｔrａｔhin laminate50、陶瓷基覆铜箔板:cｅｒamicｓbase copｐer-cｌａd lａminatesﻫ5１、紫外线阻挡型覆铜箔板：ｕｖbｌockｉnｇcopper-ｃlad lamｉnateｓ三、基材的材料ﻫ1、ａ阶树脂：a－stage ｒesinﻫ2、ｂ阶树脂：b-sｔａge rｅsｉnﻫ３、c阶树脂：ｃ-sｔaｇeｒesinﻫ4、环氧树脂：epoxy resiｎ5、酚醛树脂:phenｏｌiｃｒｅsin6、聚酯树脂:polｙesteｒｒesin7、聚酰亚胺树脂：polyｉｍｉde resｉn８、双马来酰亚胺三嗪树脂:biｓmaｌeimｉdｅ－triaｚｉne resiｎﻫ9、丙烯酸树脂：ａcryli10、三聚氰胺甲醛树脂:meｌamineｆoｒmaｌｄehyde resｉnｃresinﻫ11、多官能环氧树脂:pｏlｙfｕnctiｏnal epｏxy ｒeｓin1２、溴化环氧树脂:ｂｒomｉｎated epoxy resin１3、环氧酚醛:eｐoxy nｏvｏlacﻫ１4、氟树脂：fｌuｒｏｒesin15、硅树脂：silicone resin１6、硅烷：silaｎeﻫ１７、聚合物:ｐolyｍeｒﻫ1８、无定形聚合物:amorphｏｕs pｏlymｅrﻫ19、结晶现象：cryｓtallｉne pｏlａmer20、双晶现象：dｉｍorphiｓm２１、共聚物:ｃopolymeｒ22、合成树脂:syｎtheticﻫ2３、热固性树脂：theｒmosｅttinｇｒesin25、感光性树脂:ｐhotosensｉｔive resｉnﻫ2６、环2４、热塑性树脂:therｍｏｐlastic resinﻫ氧当量：weiｇht per epoｘy equｉvalenｔ（wpe)27、环氧值:epoｘy vaｌuｅ2８、双氰胺:diｃyandiaｍｉde2９、粘结剂：binｄeｒ32、阻燃剂：flameｒeｔardaｎtﻫ３３、31、固化剂:ｃurｉng agｅｎtﻫ30、胶粘剂:adesiveﻫ遮光剂：opａquer３4、增塑剂:plastiｃiｚers36、聚酯薄膜：ｐolyester35、不饱和聚酯:uｎsatuｉatedｐoｌyｅsteｒﻫ38、聚四氟乙烯：ｐolytetrafｌuoetylene (pｔfe) 3７、聚酰亚胺薄膜：poｌyimiｄe film (pｉ)ﻫ3９、聚全氟乙烯丙烯薄膜：ｐerfluｏrｉnａted eｔhylene-proｐylｅne coｐｏｌymer filｍ（ｆep）40、增强材料:reinｆorｃｉng ｍａteriａl41、玻璃纤维：glａｓs fibｅｒ４2、e玻璃纤维：ｅ-glass fiｂre45、玻璃布：ｇｌass fabric ４３、ｄ玻璃纤维:d-glass fibreﻫ44、s玻璃纤维：s－gｌass fibｒeﻫ４６、非织布:nｏｎ－ｗoｖen fａbriｃ47、玻璃纤维垫：gｌass mats4８、纱线：yａｒn50、绞股:ｓｔrandﻫ51、纬纱:wｅft yａｒnﻫ5２、经纱：warp yar ４9、单丝:ｆilameｎｔﻫｎ53、但尼尔:denｉeｒﻫ5４、经向：waｒp－ｗiｓｅ５５、纬向:weｆｔ－wisｅ, fillinｇ-wiｓe5６、织物经纬密度:thｒead cｏunｔﻫ5７、织物组织：weave strucｔuｒeﻫ5８、平纹组织:ｐlaiｎｓtrucｔｕre59、坏布：gｒｅy fabric61、弓纬:ｂow of weaｖｅﻫ6２、断经：ｅｎdｍiｓsｉｎ60、稀松织物：wovｅn sｃriｍﻫg65、折痕：creaｓｅﻫ6６、云织:wavineｓｓ63、缺纬:miｓ-picｋsﻫ6４、纬斜：bｉａsﻫ68、毛圈长：feather lengthﻫ6９、厚薄段:mark6７、鱼眼:ｆｉｓｈeyeﻫ70、裂缝:sｐlit71、捻度：twisｔof ｙaｒｎ７2、浸润剂含量:ｓize contentﻫ7３、浸润剂残留量：size residｕeﻫ74、处理剂含量:fiｎish l ｅvelﻫ７5、浸润剂:ｓizeﻫ７６、偶联剂:cｏuplｉnt ageｎｔﻫ７7、处理织物:fiｎiｓhed ｆａ78、聚酰胺纤维:ｐｏｌyarmide fiberﻫ7９、聚酯纤维非织布：noｎ-ｗｏven polyeste bｒicﻫ80、浸渍绝缘纵纸:imｐｒegnａｔiｎg ｉnsulaｔiｏｎpapｅrｒfａｂrｉcﻫ81、聚芳酰胺纤维纸：ａｒｏｍatic poｌｙamide paｐer82、断裂长：breaｋｉng lｅｎgtｈﻫ8３、吸水高度:ｈeighｔof cａpｉllary risｅﻫ84、湿强度保留率：wｅｔｓｔrenｇth retentｉon８５、白度:whitennｅss8６、陶瓷：ceramics8７、导电箔:conduｃtive foil89、电解铜箔：eｌectroｄｅposited ｃoppｅrｆｏil (ed copper ｆoi 8８、铜箔:coppeｒfoilﻫｌ)90、压延铜箔：rolled cｏpper fｏil９1、退火铜箔:aｎnealｅd copper fｏｉｌ９２、压延退火铜箔:rｏｌled annealed copper ｆoil （ra cｏｐｐer foiｌ）93、薄铜箔:tｈin cｏpper fｏil95、涂胶脂铜箔：resｉn ｃoaｔｅd cｏｐｐer foiｌ９4、涂胶铜箔：adhesｉve coａted foilﻫ(rcc)ﻫ96、复合金属箔：coｍpoｓitｅｍetａllic materiａl98、殷瓦：inｖar9７、载体箔：caｒriｅr fｏilﻫ99、箔（剖面)轮廓:foｉlｐro、光面：ｓｈｉnｙside101、粗糙面:maｔtｅsidｅ102、处理面:treated sidｅ1０3、防锈处理：ｓtain proｏfinｇﻫ1０4、双面处理铜箔：dｏuble treaｔｅd fｏilﻫ四、设计１、原理图：shematic dｉａgram2、逻辑图:lｏgｉc dｉａgramﻫ3、印制线路布设：prｉntｅｄwｉreｌaｙoｕt4、布设总图：mａstｅｒdrａｗｉnｇ5、可制造性设计:desｉｇn－fｏr－manuｆacturabiliｔｙ6、计算机辅助设计:computｅr-aｉｄeｄｄesigｎ.（ｃａｄ)ﻫ7、计算机辅助制造：ｃｏmputer-aiｄｅｄmanufａｃturing.(cam)ﻫ８、计算机集成制造:comｐｕter integｒat mａnufacturin ｇ.(cim)ﻫ9、计算机辅助工程：ｃompｕter-ａｉded enｇｉneerｉｎg.（cae)１0、计算机辅助测试：cｏmputｅr-aidｅｄtｅｓt.(ｃaｔ)ﻫ１1、电子设计自动化:ｅlectrｉc ｄｅsｉgn aｕtｏmation .(eｄa)ﻫ12、工程设计自动化:ｅngineeｒing design ａutomaton .（ｅda2)1３、组装设计自动化:asｓembly aidｅd ａrcｈiｔectｕraｌdｅsiｇｎ．(ａaad)１4、计算机辅助制图：computeｒaided drawing１5、计算机控制显示：coｍpｕter conｔroｌｌｅd dｉspｌay ．(ccd)17、布线:ｒouting16、布局:pｌａcemeｎtﻫ20、模拟：siｍulationﻫ2１、逻辑模拟：18、布图设计：layｏutﻫ１9、重布：rerouｔｉｎｇﻫ23、时序模拟:tｉming ｓｉlogiｃsimulationﻫ２2、电路模拟:ｃｉrcｉｔsiｍｕlａｔiｏｎﻫmulatiｏｎ24、模块化：moｄｕlａrｉzatｉoｎﻫ2５、布线完成率：lａyoｕt ｅｆｆeciｅnｃy2６、机器描述格式：mａchｉne desｃｒiptｉｏnm fｏrmａt ．（mｄf）２7、机器描述格式数据库:mdｆdaｔabseﻫ2８、设计数据库：desigｎdatabaseﻫ2９、设计原30、优化(设计)：opｔiｍizaｔiｏn (desｉgn)点:desｉgn origｉｎﻫ32、表格原点:table ｏｒiｇｉn31、供设计优化坐标轴：pｒedoｍinant ａxisﻫ３3、镜像:mirrorinｇ3４、驱动文件:drive 、中间文件:ｉnterｍｅdiaｔｅ、制造文件：ｍanｕfacturingｄｏcｕmｅntatｉoｎ3７、队列支撑数据库:queue support dａtabasｅ40、比例因子:sc 38、元件安置:coｍpｏnent positioｎingﻫ3９、图形显示：ｇraphiｃs diｓpaｌyﻫａlｉnｇfactor４1、扫描填充：scan ｆillinｇ43、填充域:regioｎfillinｇ42、矩形填充:rｅcｔaｎｇlｅfｉｌlingﻫ4４、实体设计:pｈysicａl dｅｓｉgn45、逻辑设计:lｏｇiｃdｅｓign48、自顶向下设计:47、层次设计：hiｅrarchicaｌdesｉgｎﻫ４6、逻辑电路:ｌogic circｕｉｔﻫｔop-ｄown desｉgｎ４9、自底向上设计：botｔom-up desigｎ5０、线网：net５1、数字化：dｉgiｔzｉng５２、设计规则检查：ｄｅsiｇn ｒuleｃheckiｎg5３、走(布)线器：rｏuteｒ(cａd)54、网络表：netｌiｓtﻫ５5、计算机辅助电路分析：ｃｏｍpｕter-ａiｄｅd circuit analysisﻫ56、子线网：sｕｂnｅｔ57、目标函数:ｏbjｅctive funｃｔionﻫ5８、设计后处理:ｐｏsｔdesｉｇn prｏcｅssiｎｇ(ｐdp)60、费用矩阵:costｍetrｉ5９、交互式制图设计：ｉｎteｒａcｔiｖｅdｒawinｇｄesignﻫxﻫ６1、工程图:engineeriｎg dｒawing65、64、元件密度:componeｎｔｄｅnｓityﻫ62、方块框图：ｂｌock diａgｒamﻫ63、迷宫:mozeﻫ66、自由度:dｅgrees fｒeｅdom巡回售货员问题：ｔraｖｅling ｓaｌesｍａn probleｍﻫ69、曼哈顿距离：manhａｔton 6７、入度:out going degrｅeﻫ68、出度：ｉｎcoｍing degreｅﻫｄistaｎce70、欧几里德距离:eｕclｉｄean distancｅﻫ7１、网络：netwｏrk72、阵列：arｒay73、段：sｅgmeｎt76、分线：separaｔeｄti75、逻辑设计自动化:loｇic design automaｔionﻫ７4、逻辑：logｉcﻫ78、定顺序：definite sequeｎceﻫ五、形状与尺寸:ｍeﻫ７７、分层:ｓeparaｔed layeｒﻫ1、导线（通道):ｃonｄｕｃｔion (track)2、导线(体)宽度：cｏnductor wｉdthﻫ3、导线距离:conduｃtor ｓｐaciｎｇ４、导线层:conｄuctor layer５、导线宽度/间距:condｕctor liｎe/sｐace6、第一导线层:ｃｏndｕｃｔｏr ｌａyer no.１7、圆形盘：rｏｕｎd padﻫ8、方形盘:squarｅpadﻫ９、菱形盘:diamond paｄﻫ10、长方形焊盘：oblong ｐad12、泪滴盘:ｔeａrdropｐadﻫ１3、雪人盘:ｓnowman pad 11、子弹形盘:bｕｌleｔｐadﻫ1４、v形盘:v-ｓhaｐed pad16、非圆形盘:non－cｉrcｕlarｐadﻫ17、隔离盘:isｏｌatｉｏ1５、环形盘：aｎnｕlar padﻫn pad18、非功能连接盘：mｏnｆunｃtｉｏnal ｐａｄ21、盘址:anchoring １9、偏置连接盘：oｆfsｅt ｌanｄﻫ20、腹（背）裸盘：ｂack-ｂarｄlａnｄﻫspauｒ22、连接盘图形:ｌand ｐatterｎﻫ2３、连接盘网格阵列:lａnd ｇrid array2４、孔环:annular ring２5、元件孔:component ｈolｅ27、支撑孔：supporteｄhｏｌe2６、安装孔:mouｎｔing hｏleﻫ２８、非支撑孔：ｕnsupｐortedｈole31、余隙孔:access ｈolｅ30、镀通孔:ｐlatｅｄthｒｏugh hole(pth)ﻫ２9、导通孔:viａﻫ33、埋孔：buried vｉa hｏlｅ32、盲孔：blｉnd via (holｅ)ﻫ34、埋／盲孔：buried/ｂlind via36、全部钻孔：ａll ｄri ３５、任意层内部导通孔:any lａｙer iｎnerｖｉａholｅ(alivh)ﻫｌｌeｄhｏlｅ37、定位孔：ｔoａling hｏle39、中间孔:ｉntｅrｓtｉtial ｈｏｌe3８、无连接盘孔:landleｓs holeﻫ4０、无连接盘导通孔:landlesｓvia holｅ4１、引导孔：ｐiｌot hole43、准表面间镀覆孔：quasi-iｎｔerｆaci ４2、端接全隙孔：terｍｉnal clearｏmee hoｌeﻫｎgｐlaｔed-thrｏuｇh hole44、准尺寸孔：dｉmｅnsioned hoｌｅﻫ４５、在连接盘中导通孔:ｖia-iｎ-pad46、孔位:hole locatｉoｎ47、孔密度：ｈoｌe densiｔyﻫ4８、孔图:hole ｐattｅrｎ49、钻孔图：dｒill drawｉngﻫ５0、装配图:ａｓsｅmbly draｗing5１、印制板组装图：printｅd bｏaｒd assｅmbｌｙdrawing52、参考基准：datum referancｅﻫﻫ【印制线路板术语中英对照简表】排序英语简称注解A Aｃceｌeｒate Ａging加速老化使用人工的方法,加速正常的老化过程。
PCB专业英语汇总持续更新
PCB专业英语汇总持续更新1产品类型刚性板 Rigid board挠性板柔性板刚挄板刚柔结合板印刷电路印制电路板金属基板金属基板 PCB铝基板铝基印制板铜基板铜基印制板高频板高频PCB盲孔板盲板埋孔板埋地板裸板裸板样板快转原型批发订单量产2 物料描述·覆铜板（CCL）（覆铜板）（芯）·prepreg(半固化片)·环氧树脂（环保树脂）·非导电环氧树脂（非导电树脂）·导电环氧树脂（导电树脂）·铜箔（铜箔）·介质（介质）·ptfe (Polytetralluoetylene) 聚四氟乙烯·介电常数（介电常数）3 设备描述·阻抗控制测试系统（阻抗控制测试仪）·飞针测试FPT （飞针检测仪器）·夹具测试（夹具测试）·自动光学仪器AOI（自动光学检测仪器）4表面工艺描述沉金Immersion Gold =Chemical Gold=Immersion Ni/Au=electroless Gold Plating ENIG= electroless Nickel 沉锡（IMSn）:Immersion Sn沉银（IMAg）:Immersion Ag有机保焊膜（OSP）：Organic SolderabilityPreservatives=Entek 106电镀金electroplated gold plating =Electrical Goldplating金手指Gold Fingers=Edge Connector Plating=Tab connector 无铅喷锡Lead Free HASL=HASL LF=HASL for Pb Free=SN100C=RoHS HAL有铅喷锡（HASL/HAL）HAL=Hot Air Leveling HASL=Hot Air Solder Leveling Sn/Pb(63/36) Tin-Lead solder裸铜Bare copper Blank Copper拼板和外形的相关描述倒角 Chamfer桥连 Bridge Connecting/TabConnecting桥连邮票孔 Connecting tabs with Stamp holesConnecting tabs with Mouse(Mice)Bite holes工艺边 Rails(Tooling Rails)/T ooling StripFrames/Panel Frame/HoldingFrame/Waste Edge/scrap学习学习了学习了支持小编继续品质缺陷常见英语•偏孔hole misregistration•披锋毛刺Burr•多孔Extra hole•破孔Hole breakout•分层 delamination•绿油上焊盘 S/M on pad•开窗露线 Expose trace•绿油入孔 S/M in hole•绿油脱落 S/M peel off•多开绿油窗 Extra opening•漏印字符 Missing legend/silkscreen•字符入孔 Legend in Hole•字符脱落 Legend peel off•字符上焊盘 Legend on pad•字符不清 Illegible legend•锡上金手指 Solder on G/F•锡珠 Solder ball/lump•可焊性不良 bad SolderabilityLaminates (cores ,C-Stage) 覆铜板(芯板)1.Fully cured fiberglass-resin system 完全胶连的玻璃树脂系2.Identified by core thickness, copper weight 由芯板厚度、铜箔重量区分3.Flammability rating/Flame retardant class阻燃等级、4.Dielectric constant 介电常数、5.Glass transition temperature (Tg) 玻璃转化温度6.Coefficient of thermal expansion (CTE) 热膨胀系数Prepreg(B-stage) 半固化片1.Partially cured fiberglass-resin system 部分胶连的玻璃布树脂系统2.Flow and no flow 流动与非流动3.Identified by glass type(Pressed Thickness、Resin Content、Gel time) 依据玻璃布类型区分、鉴别学习~~！生产工程设计英语•PCB Specifications(PCB说明)•CAD (computer aided design) (计算机辅助设计)•lay out(布线)•CAM (computer aided[eidid] manufacture) (计算机辅助制造)•EDA (Electronic design automatic) (电子设计自动化)•MI (manufacture information) (制造说明)•NOPE ( no process engineering ) (重订单)•external layer(外层)•internal layer(内层)•power layer(电源层)•ground layer(接地层)•signal layer(信号层)•conductor track/line(导线)•gap spacing(间隙)•tear pad/teardrop (泪滴焊盘)•isolation pad(隔离焊盘)•thermal pad(热焊盘)•annular ring(孔环)好哎，支持小编学习了，支持小编生产工程设计英语target(标靶)Golden board(黄金板、测试标准板) photo /laser plotting)(激光光绘) positive(正片)negative(负片)origin(原点)datum reference (参考基准) 、offset (偏移)基准（反光点）网格（网格）铜条（残铜）钻头图(钻符图)装配图(装配图)面板图(拼板图)层楼上图(层叠图)纵横比（厚径比）半径(半径，范围)diameter (dia.直线)补偿（补偿）埋头孔尺寸稳定性（尺寸稳定性）misregistration (焊锡面与零件面对位偏差) 收益率(利用率 )。
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PCB及PCBA常用英语汇总(4)
1 内层开路 Inner open
2 内层断路 Inner short
3 外层开路 Outer open
4 外层断路 Outer short
5 内层蚀刻过度 Inner over ecthing
6 外层蚀刻过度 Outer over ecthing
7 内层树脂气泡 Resin void
8 内层杂物 Foreign material
9 内层图形移位 Inner pattern mis-registration
10 层与层移位 Layer to layer mis-registration
11 打孔不良 Improper targeting
12 内层蚀刻不净 Inner under etching
13 露布纹 Weave texture/exposure
14 檫花（氧化膜面） Scratch(Oxide surface)
15 板损坏 Damaged board
16 分层（物料） Delamination (Raw material)
17 内层不配套 Excessive inner core
18 板过厚 Over thickness
19 白点（压板） Measling (Pressing)
20 白点（喷锡） Measling (HSAL)
21 板曲 Warpage
22 板焦黄 Burnt
23 起皱 Wrinkle
24 起泡（压板） Blistering (Pressing)
25 镀层起泡 Blistering (Cu plating)
26 喷锡起泡 Blistering (HSAL)
27 板面凹痕 DENT (Pressing profilling G/F)
28 白斑 Crazing
29 胶渣 Gum residue
30 孔未穿 Incomplete drilling
31 披锋 Burr
32 多孔 Extra hole
33 偏孔 Hole shift
34 孔径大 Hole oversize
35 孔径小 Hole undersize
36 少孔 Missing Hole
37 塞孔 Block hole
38 崩孔 Hole breakout
39 孔粗糙(镀铜） Hole roughness（Cu plating)
40 孔粗糙（机械钻孔） Hole roughness(mechanical
drill)
41 崩线、线路缺口 Nick / void on trace
42 缺口 Nick / void on pad
43 曝光过度 Over-exposure
44 曝光不良 Under exposure
45 显影不足 Under develop
46 干膜脱落 D/F Peel off
47 干膜碎 D/F Rdsidue
48 干膜移位 D/F Mis-registration
49 标志不清（曝光） Illegible marking (exposure)
50 错菲林 Wrong A/W
51 非镀铜孔有铜 Copper in NPTH
52 镀铜孔内无铜 No copper in PTH
53 渗镀 Nickel smear
54 电镀粗糙 Rough plating。