PL03-WCY01中文资料

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全自动钢坯喷码机PLC控制系统设计

全自动钢坯喷码机PLC控制系统设计目录摘要------------------------------------------------------------------------1 英文摘要-----------------------------------------------------------------------1 1 绪论-------------------------------------------------------------------------2 1.1 项目研究的背景-------------------------------------------------------------21.1.1国外打标机的发展-----------------------------------------------------21.1.2我国打号机的发展现状------------------------------------------------4 1.2钢坯打标机在炼钢生产中的作用----------------------------------------------51.3课题的提出及意义-----------------------------------------------------------52 气动回路设计-------------------------------------------------------6 2.1气动回路设计-----------------------------------------------------------------62.1.1气动回路的设计思路--------------------------------------------------62.1.2气动回路图的设计----------------------------------------------------62.2气动回路图各元件型号选择及其性能分析----------------------------------------73 硬件系统设计--------------------------------------------------------13 3.1 PLC型号选择及其性能分析--------------------------------------------------133.1.1可编程控制器的应用和发展-----------------------------------------------133.1.2 PLC的工作原理及其性能分析--------------------------------------------- 17 3.2 PLC中CPU的选择----------------------------------------------------------- 18 3.3电机的选择及其分析-----------------------------------------------------193.3.1步进电机的选用及分析-------------------------------------------------193.3.2三相异步电动机的选用及分析---------------------------------------------- 20 3.4传感器型号选择及其性能分析-------------------------------------------------- 223.4.1激光测距传感器------------------------------------------------------ 223.4.2 透射式电涡流测厚传感器---------------------------------------------- 224 软件设计部分-----------------------------------------------------25 4.1各运行部分之间距离与延时时间的设定--------------------------------------254.1.1各零件距离设定----------------------------------------------------254.1.2各运行速度设定----------------------------------------------------254.1.3其他值的计算------------------------------------------------------25 4.2 PLC控制系统流程的设计--------------------------------------------------264.2.1系统描述----------------------------------------------------------264.2.2 PLC控制系统------------------------------------------------------274.2.3PLC控制系统的扩展配置-------------------------------------------274.2.4程序主流程-------------------------------------------------------28 4.3 PLC的I/O地址分配-----------------------------------------------------31 4.4设计PLC的外部接线图---------------------------------------------------31 4.5电机控制电路主回路-----------------------------------------------------32 4.6设计梯形图程序------------------------------------------------------------334.6.1编写梯形图的软件介绍------------------------------------------------334.6.2用PLC对步进电机的控制方式描述-------------------------------------344.6.3采用多段管线PTO输出控制步进电机-----------------------------------374.6.4 PLC的抗干扰措施----------------------------------------------------465 研究工作的总结----------------------------------------------------476 致谢--------------------------------------------------------------487 参考文献----------------------------------------------------------498 附录--------------------------------------------------------------50附录一：气动回路设计图附录二：PLC编程程序梯形图全自动钢坯喷码机PLC控制系统设计摘要：工业自动化技术在近年来发展十分迅猛，当前工业自动化三大支柱技术之一的PLC技术以其很高的可靠性和抗干扰能力受到广泛的欢迎，在各行各业的技术改造过程中被大量地应用。

PC3SF21YVZB中文资料

NOTICEq The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices.q Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice.q Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions:(i)The devices in this publication are designed for use in general electronic equipment designs such as:--- Personal computers--- Office automation equipment--- Telecommunication equipment [terminal]--- Test and measurement equipment--- Industrial control--- Audio visual equipment--- Consumer electronics(ii)Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliability such as:--- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.)--- Traffic signals--- Gas leakage sensor breakers--- Alarm equipment--- Various safety devices, etc.(iii)SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as:--- Space applications--- Telecommunication equipment [trunk lines]--- Nuclear power control equipment--- Medical and other life support equipment (e.g., scuba).q Contact a SHARP representative in advance when intending to use SHARP devices for any "specific" applications other than those recommended by SHARP or when it is unclear which category mentioned above controls the intended use.q If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Control Law of Japan, it is necessary to obtain approval to export such SHARP devices. q This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party.q Contact and consult with a SHARP representative if there are any questions about the contents of this publication.。

OC-3中文资料

OC-3中⽂资料Headquarters :No. 669, Sec. 4 Chung Hsing RoadFeaturesCompliant with 155 Mbps ATM and SONET OC-3SDH STM-1 (S1.1) Industry standard 1×9 footprint SC duplex connector Single power supply 3.3 VDifferential LVPECL inputs and outputsCompatible with solder and aqueous wash processes Class 1 laser product complies with EN 60825-1 DescriptionThe TS3-0155-32S-P1-X transceivers utilizing 1310 nm MQW laser diodes are fully compliance to the 155 Mbps ATM and SONET OC-3 SDH STM-1 standard, anddesigned in industry standard 1×9 package with SC duplex connector. The transmitter section is a class 1 laser which is compliant to International Safety Standard EN 60825-1.Ordering InformationPART NUMBER INPUT/OUTPUTSIGNAL DETECTVOLTAGE TEMPERATURE TS3-0155-32S-P1 DC/DC LVPECL 3.3 V 0°C to 70 °C TS3-0155-32S-P1-E DC/DC LVPECL3.3 V40°C to 85°CAbsolute Maximum RatingsPARAMETER SYMBOL MIN MAX UNITS NOTEStorage Temperature T S ?40 85°CSupply V oltage Vcc ?0.5 6.0 V Input V oltage V IN ?0.5Vcc VOutput Current I o --- 50 mA Operating Current I OP --- 400 mA Soldering Temperature T SOLD--- 260 °C10 seconds on leadsHeadquarters :No. 669, Sec. 4 Chung Hsing RoadOperating EnvironmentPARAMETER SYMBOL MIN MAX UNITS NOTEAmbient Operating Temperature(TS3-0155-32S-P1)T AMB 0 70°C Ambient Operating Temperature (TS3-0155-32S-P1-E) T AMB ?40 85°CSupply V oltageVcc3.1 3.5 VTransmitter Electro-optical Characteristics(Vcc = 3.1 V to 3.5 V , TS3-0155-32S-P1: T A = 0°C to 70°C, TS3-0155-32S-P1-E: T A = ?40°C to 85°C)PARAMETER SYMBOL MIN TYP . MAX UNITS NOTEData RateB 50 155 200 Mb/sOutput Optical Power 9/125 µm fiber Pout ?15---8dBm AverageExtinction Ratio ER8.2 --- --- dB Center Wavelength λC 1261 1310 1360 nm Spectral Width (RMS) ?λ --- --- 4 nm Rise/Fall Time (10?90%) T r , f --- 1 2 nsOutput EyeCompliant with Telcordia GR-253-CORE Issue 3 and ITU-T recommendation G-957Power Supply Current I CC --- --- 140 mA Note 1 Data Input Current-Low I IL ?350--- --- µAData Input Current-HighI IH --- --- 350 µATransmitter Data Input V oltage-High V IH ? V CC ?1.1 --- ?0.74 V Note 2 Transmitter Data Input V oltage-LowV IL ? V CC2.0---1.58V Note 2Transmitter Data Input DifferentialV oltage V DIFF 0.3 --- 1.6 VNote 2Note 1: Not including the terminations.Note 2: These inputs are compatible with 10K, 10KH and 100K ECL and PECL input.Headquarters :No. 669, Sec. 4 Chung Hsing RoadReceiver Electro-optical Characteristics(Vcc = 3.1 V to 3.5 V , TS3-0155-32S-P1: T A = 0°C to 70°C, TS3-0155-32S-P1-E: T A = ?40°C to 85°C)PARAMETER SYMBOLMIN TYP . MAX UNITS NOTE Data RateB 50 155 200 Mb/sOptical Input Power-maximum P IN 0 --- --- dBm Note 1 Optical Input Power-minimum (Sensitivity)P IN--- --- ?34dBm Note 1Operating Center Wavelength λC 1100 --- 1600 nmSignal Detect-Asserted P A --- --- ?34 dBm AverageSignal Detect-Deasserted P D ?47--- --- dBm AverageSignal Detect-Hysteresis P A ? P D 1.0 --- --- dB Signal Detect Assert Time T SD + --- --- 100 µs Signal Detect Desssert Time T SD ? --- --- 100 µsSignal Detect Output voltage-High V OH ? V CC ?1.1 --- ?0.74 V Note 2 Signal Detect Output voltage-Low V OL ? V CC2.0---1.58V Note 2Power Supply CurrentI CC --- --- 100 mA Note 3 Data Output Rise, Fall Time (10?90%) T r, f --- 1 2 nsData Output V oltage-High V OH ? V CC ?1.1 --- ?0.74 V Note 2 Data Output V oltage-LowV OL ? V CC2.0---1.58V Note 2Note 1: The input data is at 155.52 Mbps, 223?1 PRBS data pattern with 72 “1”s and 72 “0”s inserted per the ITU-T recommendation G .958 Appendix 1. The receiver is guaranteed to provide output data with Bit Error Rate (BER) better than or equal to 1×10?10.Note 2: These outputs are compatible with 10K, 10KH and 100K ECL and PECL input. Note 3: The current exclude the output load current.Headquarters :No. 669, Sec. 4 Chung Hsing RoadTransmitter SectionThe transmitter section consists of a 1310 nm InGaAsP laser in an eye safe optical subassembly (OSA) which mates to the fiber cable. The laser OSA is driven by a LD driver IC which converts differential input LVPECL logic signals into an analog laser driving current. Receiver SectionThe receiver utilizes an InGaAs PIN photodiode mounted together with a trans-impedance preamplifier IC in an OSA. This OSA is connected to a circuit providing post-amplification quantization, and optical signal detection. Receiver Signal DetectSignal Detect is a basic fiber failure indicator. This is a single-ended LVPECL output. As the input optical power is decreased, Signal Detect will switch from high to low (deassert point) somewhere between sensitivity and the no light input level. As the input optical power is increased from very low levels, Signal Detect will switch back from low to high (assert point). The assert level will be at least 1.0 dB higher than the deassert level.Headquarters :No. 669, Sec. 4 Chung Hsing RoadEye DiagramTransmitter ReceiverSignal pattern: PRBS 23Signal pattern: PRBS 23 Input Power: ?35 dBmHeadquarters :No. 669, Sec. 4 Chung Hsing RoadPIN SYMBOL DESCRIPTION1 RX GNDReceiver Signal Ground.Directly connect this pin to the receiver ground plane. 2 RD +RD+ is an open-emitter output circuit.Terminate this high-speed differential LVPECL output with standard LVPECL techniques at the follow-on device input pin. (See recommended circuit schematic) 3RD ?RD – is an open-emitter output circuit.Terminate this high-speed differential LVPECL output with standard LVPECL techniques at the follow-on device input pin. (See recommended circuit schematic) 4SDSignal Detect.Normal optical input levels to the receiver result in a logic “1” output, V OH , asserted. Low input optical levels to the receiver result in a fault condition indicated by a logic “0” output V OL , deasserted Signal Detect is a single-ended LVPECL output. SD can be terminated with LVPECL techniques via 50 ?toV CCR ? 2 V. Alternatively, SD can be loaded with a 180 ? resistor to RX GND to conserve electrical power with small compromise to signal quality. If Signal Detect output is not used, leave it open-circuited. This Signal Detect output can be used to drive a LVPECL input on an upstream circuit,such as, Signal Detect input or Loss of Signal-bar. 5 V CCR Receiver Power Supply.Provide +3.3 Vdc via the recommended receiver power supply filter circuit. Locate the power supplyfilter circuit as close as possible to the V CCR pin. 6 V CCT Transmitter Power Supply.Provide +3.3 Vdc via the recommended transmitter power supply filter circuit. Locate the power supplyfilter circuit as close as possible to the V CCT pin. 7 TD ?Transmitter Data In-Bar.Terminate this high-speed differential LVPECL input with standard LVPECL techniques at the transmitter input pin. (See recommended circuit schematic) 8 TD +Transmitter Data In.Terminate this high-speed differential LVPECL input with standard LVPECL techniques at the transmitter input pin. (See recommended circuit schematic) 9TX GND Transmitter Signal Ground.Directly connect this pin to the transmitter signal ground plane. Directly connect this pin to thetransmitter ground plane.Headquarters :No. 669, Sec. 4 Chung Hsing RoadIn order to get proper functionality, a recommended circuit is provided in above recommended circuit schematic. When designing the circuit interface, there are a few fundamental guidelines to follow.(1) The differential data lines should be treated as 50 ? Micro strip or strip line transmission lines. This will help to minimize the parasitic inductance and capacitance effects. Locate termination at the received signal end of the transmission line. The length of these lines should be kept short and of equal length.(2) For the high speed signal lines, differential signals should be used, not single-ended signals, and these differential signals need to be loaded symmetrically to prevent unbalanced currents which will cause distortion in the signal.(3) Multi layer plane PCB is best for distribution of V CC , returning ground currents, forming transmission lines and shielding, Also, it is important to suppress noise from influencing the fiber-optic transceiver performance, especially the receiver circuit. (4) A separate proper power supply filter circuits shown in Figure for the transmitter and receiver sections. These filter circuits suppress Vcc noise over a broad frequency range, this prevents receiver sensitivity degradation due to V CC noise. (5) Surface-mount components are recommended. Use ceramic bypass capacitors for the 0.1 µF capacitors and a surface-mount coil inductor for 1 µH inductor. Ferrite beads can be used to replace the coil inductors when using quieter V CC supplies, but a coil inductor is recommended over a ferrite bead. All power supply components need to be placed physically next to the V CC pins of the receiver and transmitter.(6) Use a good, uniform ground plane with a minimum number of holes to provide a low-inductance ground current return for the power supply currents.Headquarters :No. 669, Sec. 4 Chung Hsing Roadmust be completely remove from the module. The transceiver is supplied with a process plug to prevent contamination during wave solder and aqueous rinse as well as during handling, shipping or storage.Solder fluxes should be water-soluble, organic solder fluxes. Recommended cleaning and degreasing chemicals for these transceivers are alcohol’s (methyl, isopropyl, isobutyl), aliphatics (hexane, heptane) and other chemicals, such as soap solution or naphtha. Do not use partially halogenated hydrocarbons for cleaning/degreasing.Headquarters :No. 669, Sec. 4 Chung Hsing RoadHeadquarters :No. 669, Sec. 4 Chung Hsing RoadRegulatory ComplianceFEATURE TEST METHOD PERFORMANCEElectrostatic discharge (ESD) to the electrical pinsMIL-STD-883D Method 3015.7 Class 1(>1 kV) – Human Body Model Electromagnetic interference (EMI)FCC Class B EN55022 Class BThe transceiver is mounded on a circuit card without a chassis enclosure at frequencies up to 1000 MHz. Margins will be dependent on customer’s board and chassis designs.Immunity Variation of IEC801-3 Typically show no measurable effect from a 10 V/mfiled swept from 30 MHz to 1000 MHz applied tothe transceiver without a chassis enclosure.FDA 21 CFR 1040.10 and 1040.11 Class 1FDA Accession Number: 0012715-01Eye safetyEN 60825-1:1994+A11EN 60950: 1992+A1+A2+A3+A4+A11EN 60825-2: 1994+A1TUV certificated Number: R 3-50005227Note : All information contained in this document is subject to change without notice.。

电力线_PL_载波通信芯片组SS_省略_P300_SSCP111及其应用_邓海洋

2 .SSC P111 技术性能、引脚功能及工作原理
SSC P 111 媒介接口芯片的主要性能如下 : ○将功率放大器和三态功能集合为 C EBus 的电力线(P L)物理接口 ; ○可替代 30 多个分立元件 , 节省了印制电路板 50 %以上空间 , 提高了可靠性 ; ○提供了高驱动能力的输出功率放大器 (10Ψ 负载下 , 峰 -峰电压为 6V), 增强了低阻抗条件下的性能 ; ○提供了内部过温保护电路以确保系统的可靠性。 SSC P 111 采用 16 脚 SOIC 封装。如图 3 所示 , 引脚功能如下 : 1 脚、3 脚及 5 脚(VSS):模拟信号地 ; 2 脚、 6 脚及 10 脚 (VDD):模拟信号电源 , 接 10V DC ; 4 脚(T XO):功率信号放大输出 , T S =0 , 发送使能 ; 7 脚(T P 0):测试端点 0 , 接 V DD ; 8 脚(T S):三态输出 , T T L 电平 , 信号由收发器驱动 , T S =1, 功放处于三态模式 ; 9 脚(T XI):功率信号放大器输入 ; 11 脚(BIAS):BIAS 输入 , 与 75k Ψ相连接地 ; 12 脚 , 14 脚及 16 脚(NC):悬空保留 ;
发送时 , 将要发送的数据包通过主机送到内部数据链路层(DL L)微处理器 , DL L 将数据送到数字信号处理单元块 , 该功能块通过存储 ROM 上的 300 个点的查找图产生扩频载波的高低状态 , 再经过一个八位的数模转换器 D/A 将数字信号转换为模拟形式的 chi rp 波送到缓冲器 , 当三态信号 T S 为低时 , 信号从 SO 脚发送出去。
电力线(P L)载波通信芯片组 SSC P 300/SSC P 111 及其应用

PLY300使用说明书(打印版)

目录一、概述 (2)二、技术规格 (2)三、控制器前面板说明 (3)四、控制器后面板说明 (4)五、控制器配置设定 (6)六、控制器校称操作 (7)七、控制器定值设定 (9)八、控制器测试功能的操作 (9)九、常见故障处理 (10)十、控制器尺寸 (11)十一、配件清单 (12)一、概述1、简介PLY300 是由单片微机控制，集称重、控制于一体的智能仪表。

独特的抗干扰措施，使该控制器能在恶劣的现场环境中可靠的使用。

该控制器的关键零部件采用国内外的专业生产厂家设计制造，可靠性高。

如：AD转换器采用美国ADI公司的AD7798；变压器采用宏伟变压器厂的DB-57。

该控制器能适应建筑、冶金、包装、饲料等各种行业自动配料的需要。

仪表设计执行标准：GB/T 7724－2008 电子称重仪表依据检定规程：JJG 649-1990。

2、主要功能* 集称重显示器与称重控制器为一体；* 提供完整的干粉砂浆罐控制功能；* 提供两种显示方式：料重与料位；* 搅拌时间控制功能；* 自动破拱振动功能，振动时间易于调整；* 提供GPRS无线通讯功能，易于设备的远程监控与维护；* 提供GPS卫星定位接口，易于控制设备的定位；* 免砝码标定功能；* 使用软件全数字式调校功能；* 独特的测试功能，便于现场调试。

3、工作原理PLY300为传感器提供精密桥源，并接受传感器的输出信号，经内部采集处理后计算并显示出称量斗内物料的重量值。

在连接GPRS模块的情况下，可以通过GPRS接口远程连接服务器，达到远程监控与远程维护的目的。

在PLY300启动运行后，通过对计量斗内物料的重量值与流量设定值的比较，自动实现干粉砂浆罐的破拱振动控制，在搅拌时间到达后，自动停止运行。

二、技术规格1、计量特性参数1.1 准确度等级：1.2 最大检定分度数：2000。

1.3 工作温度范围：0～40℃。

1.4 误差分配系数pi：0.5。

2、一般规格2.1 电源：交流220V±10%15%，50Hz±2％。

芯片手册

3) 载波通信 ............................................................... 26
功能简述 ............................................................................ 26 编程指南 ............................................................................ 26 载波通信的工作步骤 .................................................................. 27 寄存器 .............................................................................. 28
9) ISO7816 功能 ........................................................... 41
功能简述 ............................................................................ 41 编程指南 ............................................................................ 41 寄存器 .............................................................................. 42
4) LCD/LED显示驱动 ........................................................ 32

Avionics Systems L-3 Communications产品手册说明书

ATA
Revision
Number Level
7100
165E6496-00
03
7100 CVDR
7200
CVDR
FA2100
FA2200
FA2300
FA5000
RDI
RIU
RAU
165E1696-02
03
RI
ROC
ROC/5
ROC/6
ROSE
RAU
165E1696-04
01
ROC/7
ROSE
Revision Date
905E5389-22
1
TP-344
22-00-01 C1
0040-34002-01
H
5/13/2015 4/19/2013
9/16/2015
LearJet Updates CVR AUTOMATED TEST STATION/ RECORDER INTERFACE UNIT (CATS/RIU) Accident Investigation Procedure
1/25/2015 ACCIDENT INVESTIGATION PROCEDURE
11/4/2010 Maintenance Manual with IPL 6/26/2017 GH-3900 Aircraft Configuration Module Tool
Avionics Systems L-3 Communications
Document Index
Last Updated: 8/15/2022 9:11:46 AM
Model Number
Publication Number
ATA Number

(整理)常见机床资料缩写

常见机床资料缩写AC 交流电AMP 安培APC 自动托盘交换装置APL 自动部件装载机ASCII 美国信息交换标准法规ATC 自动刀具交换装置ATC FWD 自动刀具交换装置前进ATC REV 自动刀具交换装置后退AWG 美国线规BHCS 圆头帽螺钉CAD 计算机辅助设计CAM 计算机辅助制造（辅助加工）CB 断路开关CC 立方厘米CCW 逆时针CFM 每分钟立方英尺CNC 计算机数控CNCR SPINDLE 与轴运动同步的芯轴CRC 循环冗余码校验数字CRT 阴极射线管CTS 清除发送CW 顺时针DB 牵引杆DC 直流电DGNOS 诊断DHCP 动态主机配置协议DIR 目录DNC 直接数字控制DOS 磁盘操作系统DTE 数据终端设备ENA CNVR 启动输送机EOB 块结束EOF 文件结束EPROM 可擦可编程只读存储器E-STOP 紧急停机FADAL 其他人FHCS 平头帽螺钉FT 英尺FU 保险丝FWD 前进GA 量规HAAS 正确的刀具HHB 六角头螺钉HP 马力HS 卧式系列加工中心ID 内径IGBT 隔离栅双极晶体管IN 英寸IOPCB 输入输出印刷电路板LAN 局域网LB 磅LED 发光二极管LO CLNT 冷却剂低压LOW AIR PR 低气压LVPS 低电压电源MB 兆字节(1百万)MCD RLY BRD M-代码继电器盘MDI 手动数据输入MEM 存储器M-FIN M-代码完成MM 毫米MOCON 电动机控制器MOTIF 电动机接口MSG 信息MSHCP 公制插座帽螺钉NC 数字控制NC 常闭合NO 常开OD 外径OPER 操作员P 袋PARAM 参数PCB 印制电路板PGM 程序POR 通电复位POSIT 位置PROG 程序PSI 每平方英寸磅PWM 脉冲宽度调制RAM 随机存取存储器REPT RIG TAP 围盘轧制刚性螺丝攻RET 返回，回车REV CNVR 回动输送机RJH 遥控摇柄RPDBDN 旋转式托盘拉杆放下RPDBUP 旋转式托盘拉杆提起RPM 每分钟转数RIS 请求输送RXD 接收数据S 芯轴转速SDIST 伺服机构分配印制电路板SFM 每分钟平方英尺SHCS 套筒扳手头帽螺钉SIO 串行输入／输出SKBIF 串行键盘接口印制电路板SMTC 侧挂式刀具交换装置SP 芯轴T 刀具编号TC 刀具交换装置TIR 总指示偏转TNC 刀尖偏差TRP 刀具释放活塞IS 尾架ISC 通过芯轴的冷却剂TXD 发送数据VDI 德国工程师协会VF 立式铣床（第一台）VF-E 立式铣床－扩展型VMC 立式加工中心WAN 广域网红色骑警游民积分: 85 发帖数: 55主题：润滑油脂专业术语润滑油脂专业术语一、密度与相对密度密度是批在规定温度下，单位体积内所含物质的质量数，以g/cm3或g/mL表示。

西門子PRC-CM03無熔絲開關說明書说明书

使用說明書PRC-CM03為充分發揮本機功能,在您使用前請詳細閱讀本說明書,並妥善保存,作為日後參考手提MP3/CD音響目錄(一)本機特點及緊急處理方法＆警告 (2)(二)安全注意事項 (3)(三)免責聲明 (3)(四)外型及各部位名稱 (4)(五)安裝方法 (5)(六)規格 (5)(七)功能操作 (6)功能選擇 (6)音量調整 (6)調諧電台 (6)CD/MP3唱片的使用 (7)CD/MP3唱片的播放 (7)搜尋特定樂曲 (7)搜尋特定歌曲片段 (8)重複播放 (8)低音加強功能 (8)程序播放記憶 (9)外部音源功能 (9)耳機使用 (9)(八)保養 (10)(九)故障排除 (10)1˙HI/FI立體聲˙具播放CD/MP3/收音機功能˙AM(MONO)/FM立體聲收音˙具有耳機插孔˙CD 20首及MP3 99首曲目編輯播放功能。

˙具重複播放、資料夾重複播放、單曲重複播放及隨機播放功能˙具外部音源輸入擴音功能˙具低音加強功能2在使用本機之前，應仔細閱讀下列事項及使用說明，閱後並請妥為收存，以備將來參考：1.本機請勿置於雨中、濕氣中或避免陽光直射及遠離其他會產生熱能的裝置。

2.本機放置位置請勿太靠近電視、電腦、錄影機及手機，以免遭受干擾，產生誤動作。

003.使用本機的工作溫度為5～35C。

4.長期不使用本機時，應將其電源線插頭從插座內拔出。

5.請勿將雜物或液體從機身開口處進入機身內部。

6.當本機出現下列情況時，應請合格的維修人員進行維修：A：故障或液體落入本機內。

B：雜物或液體落入本機內。

C：受到雨淋。

D：無法正常操作或性能出現明顯變化。

E：不慎跌落或外殼受損。

7.請勿擅自拆下任何蓋子、內部裝置或調校內部裝置，請交由本公司專業人員進行維修。

8.使用耳機時，請勿將音量調太大聲，以免聽力受損。

9.當耳朵產生耳鳴時，應將音量調小或取消耳機使用。

10.當使用開放式耳機時，請勿將音量調太大聲，以避免聽不到周遭的聲音。

LP-200-3 Pita Oven 零件清单说明书

ME77-0011
ME84-0011 TUN31904 TUN31920 VE68-0036
FO75-0015
FO75-00XX
Qty 2 6 2.9 1
2.63 1
13
2 2 4 2 2 1 4 1 1 1
2.1
15 1 1 1
A/R
A/R
Mechanical parts Description Split chain link #35 129033/012 Main Conveyor graphite bushing #40 riveted rollers Chain (Sold per Foot length) Connecting link #40 #35 riveted rollers Chain (Sold per Foot length) Connecting link #35 Chain Z-40-P76.2 (over size roller flange type) A2 attachment ( LP200 ) P/M SLEEVE .502 X .753 X 3/4 Pillow block with bearing UC202 5/8" (pita) Y HUB 1'' kw & 2ss (pita) 4" white nylon pivoting wheel with brake 330LBS (pita) 4" white nylon pivoting wheel 330LBS (pita) Sprocket #35, type B, 12 teeth x 5/8 Sprocket for metallic conveyor belt #1245 Conveyor Oven Sprocket #35 type B 48 teeth x 3/4" (with key way + set screw) Sprocket #40 type B 26 teeth x 3/4" (with key way + set screw) Sprocket #40 type B 13 teeth x 3/4" (with key way + set screw) Stainless steel mesh conveyor 48x0.50,22.00w,9sp,sle,ss(pita) (Sold per Foot length) Hard stone brick 9” x 4” x 1¼” Tempered glass door 6 '' x 20 '' x 10mm (pita) Tempered glass door 17 '' x 23-7/8 '' x 10mm (pita) Small fan 4 "dia 230v 110cfm (axial fan) White food grease high temperature Haynes 500 (10 cartridges (tube) x 14 Oz / cs) (Chain grease for #35 and #40 chains) (Can be sold as a single cartridge as 0.1 Qty) Food grade high temperature smokeless oil for main conveyor (chain oil for Z-40-P76.2 chain)

气动不锈钢内螺纹三片式二片式球阀说明书

上海宇行气动阀门成套有限公司
专业从事气动执行装置的研究和开发，有着丰富的生产经验及配套经验，所销售产品一律严格按照ISO9000 质量认证体系标准执行，质量稳定可靠，测试手段完善。公司专产各类型气动执行器，气动球阀、蝶阀、闸阀、截止阀、放料阀、隔膜阀、调节阀等各种阀门。产品可装配：防爆电磁阀、反馈信号、阀门定位器及其它元件。作为管道远距离单独和集中控制，可通过计算机操作，是实现工业自动化的先驱装置。公司在生产执行机构的同时，还和其他许多著名的电磁阀、位置反馈开关、过滤器、定位器生产厂家有着良好的合作关系，可为用户提供多种配套服务。
40
11/2 185 238 129 38
49
50
2 185 245 148 50
62
气动执行器
AT1 AT1 AT1 AT1 AT2 AT2 AT2
Q6（1、6）1F 气动（内螺纹、对焊式）球阀
概述
气动内螺纹（对焊式）球阀是由双（单）作用气动活
塞式执行器和内螺纹（对焊式）球阀组成。其阀体可分为
整体式、二段式、三段式。阀座采用弹性密封结构，密封
气动执行器主要技术参数
气动执行器
型号控制形式作用形式气源压力最大回转角度回信器控制信号
控制气源工作温度
QW-TZ 精小型系列、AT 单作用系列双作用/单作用切断/调节 0.4 ～ 0.8 MPa 90°～92° AC220V AC110V DC24V 电信号：0～0Ma 4 ～20Ma 气信号：0.02 ～0.1 MP a 洁净、干燥压缩空气 -20℃ ～ +90℃
车间展示：
图片展示：
阀门用料足品质高价格底欢迎咨询选购
简单描述：详细请看最下面参数介绍三片式气动球阀 Q611F 口径：6~100

欧姆龙plc的入门学习

台（3）编程通信接口电缆一根 3．训练内容
（1）三相异步电动机主电路的设计。（2）PLC的I/O接线图。
Date:
2013-4-25
Page: 25
Date:
2013-4-25
Page: 4
欧姆龙C系列P型PLC简介
1.3 内部继电器
PLC的内部继电器与输入、输出继电器不同，它们既不能被外部信号所驱动，也不能直接驱动外部设备，但可以由可编程序控制器中各种触点来驱动。内部继电器包括
➢1.内部辅助继电器（AR） ➢2.保持继电器(HR) ➢3.暂存继电器(TR) ➢4.数据存储继电器(DM)
0100
T IM 01
0600 0100
T IM 02
0100
TIM 01
0600
S KEEP
0600
5s
3s
TIM 02
R
Date:
2013-4-25
图11.13
Page: 23
欧姆龙C系列P型PLC简介
2 功能指令
➢ MOV (FUN21)指令:是将一个指定通道的内容或一个四位十六进常数（Ｓ）传送到另一个通道中去。格式：ＭＯＶ S D
Date:
2013-4-25
Page: 2
欧姆龙C系列P型PLC简介
1.1．输入继电器输入继电器是用来接收PLC外部开关(或模拟)信号的“窗
口”，只能由外部信号驱动，不能被程序指令驱动。P型机的输入继电器加装I/0 扩展后最多可占有5个通道，其编号为00～ 04，每个通道有16个继电器。如表所示。
它们分别对应逻辑行从常开或常闭开始。 ➢ (2)OUT指令和OUT-NOT指令不能用于驱动输入继电
器。 ➢ (3)OUT指令和OUT-NOT指令可以连续并联使用，次

HCPL-0302中文资料

HCPL-0302中⽂资料The HCPL-3020 in DIP-8 and HCPL-0302 in SO-8 package complement Agilent’s existing family of gate drive optocouplers. The new 0.2 A devices consist of GaAsP LEDs optically coupled toan integrated circuit witha power output stage. The current rating, combined with the high commonmode rejection (CMR),fast switching and latch-up performance uniquely qualify these optocouplers for low-power inverter gate drive applications. The high operating voltage ranges of the HCPL-3020 and HCPL-0302 output stages provide the drive voltages required by MOS-gated devices like IGBTs or MOSFETs. The voltage and current provided by these optocouplers make it suitable for driving IGBTs with rating up to 1200 V/20 A. For IGBTs with higher ratings, the HCPL-0314/3140 (0.4 A), HCPL-3150 (0.5 A) or HCPL-3120 (2 A) can be used. The HCPL-3020 and HCPL-0302 are among the cheapest solutions available for driving MOS-gated devices in a safe, ef? cient, reliable and cost-effective way. Besides ease of implementation,the HCPL-3020 and HCPL-0302 also excel in power consumption. The low supply current of 3 mA allows bootstrap techniques, thuseliminating additionalisolated power supplies forgate drive circuitry. Usingdiscrete power IGBTs orMOSFETs together with gatedrive optoisolators insteadof integrated modulesallows the designer tocontrol the gate signal ? ow.This makes it possible tochange the switching speedand related EMI behavior.Compared with high-voltageintegrated circuits (HVICs)Agilent’s optocouplers offersuperior galvanic isolation.The optoisolators feature aproprietary internal Faradayshield, which provides thebest common-mode rejection(CMR) performance of anycompeting isolation solution.Features0.2 A min. peakoutput currentH igh-speed response:0.7 µs max. propagation delay over temp. rangeU ltra-high CMR: min.10 kV/µs @ VCM= 1000 VB ootstrappable supply current: max. 3 mAW ide operating temp. range: -40…+100 °CW ide VCCoperating range:10…30 V overtemp. range D IP-8 and SO-8 packages U L approval: 2500 V RMSfor 1 minuteC SA approval pendingV DE approval pending: V IORM = 630 V PEAK (HCPL-3020)V IORM = 566 V PEAK (HCPL-0302) ApplicationsI solated IGBT/power MOSFET gate driveA C and brushlessDC motor drivesI ndustrial invertersA ir conditionersW ashing machinesI nduction heatersfor cookersS witching powersupplies (SPS)0.2 A Output Current Gate Drive Optocoupler from Agilent Technologies Michael Prangs, EBV Kaarst24MIP Edition 3/2003。

PL03中文资料

Absolute Maximum Ratings at TA = 25 °C
Reverse Voltage (<100 µA)..…………………...…………………………………………......……..4.0V Max Forward Current…………..………………..………………………………………….……20mA Peak Forward Current (1/10 Duty Cycle, 0.1ms Pulse Width)….……………………………………....100mA Operating Temperature Range………………………………………………………..-25°C to + 85°C Storage Temperature Range..………….……………………………………………...-25°C to +100°C Soldering Temperature (1.6mm below body)……………………………………………………....260° for 5 seconds
Electrical & Optical Characteristics at TA = 25 °C
Part Number Color Diffused PL03-CDR24-5V PL03-CDR12-5V PL03-CDG13-5V PL03-CDG14-5V PL03-CDY01-5V PL03-CDA02-5V PL03-CDO12-5V Color Transparent PL03-CTR24-5V PL03-CTR12-5V PL03-CTG13-5V PL03-CTG14-5V PL03-CTY01-5V PL03-CTA02-5V PL03-CTO12-5V White Diffused PL03-WDR24-5V PL03-WDR12-5V PL03-WDG13-5V PL03-WDG14-5V PL03-WDY01-5V PL03-WDA02-5V PL03-WDO12-5V Water Clear PL03-WCR24-5V PL03-WCR12-5V PL03-WCG13-5V PL03-WCG14-5V PL03-WCY01-5V PL03-WCA02-5V PL03-WCO12-5V Bright Red Hi-Eff Red Green HI-Eff Green Yellow Amber Orange GaP GaAsP on GaP GaP GaP GaAsP on GaP GaAsP on GaP GaAsP on GaP Bright Red Hi-Eff Red Green HI-Eff Green Yellow Amber Orange GaP GaAsP on GaP GaP GaP GaAsP on GaP GaAsP on GaP GaAsP on GaP Emitting Color Material Peak Wave Length (nm) 700 635 567 567 585 610 635 (nm) 700 635 567 567 585 610 635 View Angle 2θ ½ Deg Forward Voltage @20mA (V) Typ 5.0 5.0 5.0 5.0 5.0 5.0 5.0 Typ 5.0 5.0 5.0 5.0 5.0 5.0 5.0 Max 7.0 7.0 7.0 7.0 7.0 7.0 7.0 Max 7.0 7.0 7.0 7.0 7.0 7.0 7.0 Luminous Intensity @20mA (mcd) Min 1.6 9.3 8.0 10.4 6.6 9.3 9.3 Min 5.5 31.7 27.0 35.1 22.6 31.7 31.7 Typ 2.7 15.5 13.3 17.3 11.0 15.5 15.5 Typ 9.2 52.9 45.0 58.5 37.6 52.9 52.9

三位元阀门说明书

C140044฀(3) C140043 V C140047 E
basic฀number
230V / 50฀Hz 230V / 50฀Hz
24V / DC 24V / DC 230V / 50฀Hz
voltage suffix
suffix
80017GB-2016/R01
All leaﬂets are available on: www.asconumatics.eu 2-20-2
- SC
basic catalogue
number
brass stainless฀st.
0
16
16 10,5 11,2 l
l
l
-
l 370A016 370A046
0
10
10 10,5 11,2 l
l
l
-
l 370A017 370A047
0
5
5
10,5 11,2 l
l
l
-
l 370A018 370A048
SERIES 370
PREFIX TABLE
prefix 1234567
description
power฀level LP RP IP66/67 - Metal enclosure (EN/IEC 60079-7,-18 and -31)* - - - l(1)
GENERAL
Differential pressure Maximum viscosity Response time
See฀"SPECIFICATIONS"฀฀[1฀bar฀=100฀฀kPa]฀ 40฀cSt฀(mm2/s)฀
5฀-฀20฀ms
ﬂuids ()

KL03 芯片系列参考手册说明书

KL03 Sub-Family Reference Manual Supports: MKL03Z8VFG4(R), MKL03Z16VFG4(R), MKL03Z32VFG4(R), MKL03Z32CAF4R, MKL03Z8VFK4(R),MKL03Z16VFK4(R), and MKL03Z32VFK4(R)Document Number: KL03P24M48SF0RMRev 3, June, 2014ContentsSection number Title PageChapter 1About This Document1.1Overview (27)1.1.1Purpose (27)1.1.2Audience (27)1.2Conventions (27)1.2.1Numbering systems (27)1.2.2Typographic notation (28)1.2.3Special terms (28)Chapter 2Introduction2.1KL03 sub-family introduction (29)2.2Module functional categories (29)2.2.1ARM Cortex-M0+ core modules (30)2.2.2System modules (31)2.2.3Memories and memory interfaces (32)2.2.4Clocks (32)2.2.5Analog modules (32)2.2.6Timer modules (33)2.2.7Communication interfaces (33)2.2.8Human-machine interfaces (34)2.3Module to module interconnects (34)2.3.1Interconnection overview (34)2.3.2Analog reference options (35)2.4Orderable part numbers (36)Chapter 3Core Overview3.1ARM Cortex-M0+ core introduction (37)3.1.1Buses, interconnects, and interfaces (37)3.1.2System tick timer (37)3.1.3Debug facilities (37)3.1.4Core privilege levels (38)3.2Nested vectored interrupt controller (NVIC) (38)3.2.1Interrupt priority levels (38)3.2.2Non-maskable interrupt (38)3.2.3Interrupt channel assignments (38)3.3AWIC introduction (41)3.3.1Wake-up sources (41)Chapter 4Memory and Memory Map4.1Flash memory (43)4.1.1Flash memory map (43)4.1.2Flash security (44)4.1.3Flash modes (44)4.1.4Erase all flash contents (44)4.1.5FTFA_FOPT register (44)4.2SRAM (45)4.2.1SRAM sizes (45)4.2.2SRAM ranges (45)4.2.3SRAM retention in low power modes (46)4.3System Register file (46)4.4Memory map (47)4.4.1Introduction (47)4.4.2System memory map (47)4.4.3Flash memory map (48)4.4.4SRAM memory map (48)4.4.5Bit Manipulation Engine (49)4.4.6Peripheral bridge (AIPS-Lite) memory map (49)4.4.7Private Peripheral Bus (PPB) memory map (54)Chapter 5Clock Distribution5.1Introduction (55)5.2Programming model (55)5.3High-level device clocking diagram (55)5.4Clock definitions (56)5.4.1Device clock summary (57)5.5Internal clocking requirements (59)5.5.1Clock divider values after reset (59)5.5.2VLPR mode clocking (60)5.6Clock gating (60)5.7Module clocks (60)5.7.1PMC 1-kHz LPO clock (61)5.7.2COP clocking (62)5.7.3RTC clocking (62)5.7.4RTC_CLKOUT and CLKOUT32K clocking (63)5.7.5LPTMR clocking (63)5.7.6TPM clocking (64)5.7.7LPUART clocking (64)Chapter 6Reset and Boot6.1Introduction (67)6.2Reset (67)6.2.1Power-on reset (POR) (68)6.2.2System reset sources (68)6.2.3MCU resets (71)6.2.4RESET pin (72)6.3Boot (72)6.3.1Boot sources (72)6.3.2FOPT boot options (73)6.3.3Boot sequence (75)Chapter 7Power Management7.1Introduction (77)7.2Clocking modes (77)7.2.1Partial Stop (77)7.2.2Compute Operation (78)7.2.3Peripheral Doze (79)7.2.4Clock gating (79)7.3Power modes (80)7.4Entering and exiting power modes (82)7.5Module operation in low-power modes (82)Chapter 8Security8.1Introduction (87)8.1.1Flash security (87)8.1.2Security interactions with other modules (87)Chapter 9Debug9.1Introduction (89)9.2Debug port pin descriptions (89)9.3SWD status and control registers (90)9.3.1MDM-AP Control Register (91)9.3.2MDM-AP Status Register (92)9.4Debug resets (94)9.5Micro Trace Buffer (MTB) (94)9.6Debug in low-power modes (95)9.7Debug and security (96)Chapter 10Signal Multiplexing and Signal Descriptions10.1Introduction (97)10.2Signal multiplexing integration (97)10.2.1I/O Port control and interrupt module features (98)10.2.2Clock gating (98)10.2.3Signal multiplexing constraints (98)10.3Pinout (98)10.3.1KL03 signal multiplexing and pin assignments (98)10.3.2KL03 pinouts (100)10.4Module Signal Description Tables (101)10.4.1Core modules (101)10.4.2System modules (102)10.4.3Clock modules (102)10.4.4Memories and memory interfaces (103)10.4.5Analog (103)10.4.6Timer Modules (103)10.4.7Communication interfaces (104)10.4.8Human-machine interfaces (HMI) (105)Chapter 11Kinetis ROM Bootloader11.1Introduction (107)11.2Functional Description (108)11.2.1Memory Maps (108)11.2.2The Kinetis Bootloader Configuration Area (BCA) (109)11.2.3Start-up Process (110)11.2.4Clock Configuration (112)11.2.5Bootloader Entry Point (113)11.2.6Bootloader Protocol (114)11.2.7Bootloader Packet Types (117)11.2.8Bootloader Command API (123)11.2.9Bootloader Exit state (135)11.3Peripherals Supported (136)11.3.1I2C Peripheral (136)11.3.2SPI Peripheral (138)11.3.3UART Peripheral (140)11.4Get/SetProperty Command Properties (143)11.4.1Property Definitions (144)11.5Kinetis Bootloader Status Error Codes (145)Chapter 12Port Control and Interrupts (PORT)12.1Chip-specific PORT information (147)12.1.1GPIO instantiation information (147)12.1.2Port control and interrupt summary (148)12.2Introduction (149)12.3Overview (149)12.3.1Features (149)12.3.2Modes of operation (149)12.4External signal description (150)12.5Detailed signal description (150)12.6Memory map and register definition (151)12.6.1Pin Control Register n (PORT x_PCR n) (154)12.6.2Global Pin Control Low Register (PORT x_GPCLR) (156)12.6.3Global Pin Control High Register (PORT x_GPCHR) (157)12.6.4Interrupt Status Flag Register (PORT x_ISFR) (157)12.7Functional description (158)12.7.1Pin control (158)12.7.2Global pin control (159)12.7.3External interrupts (159)Chapter 13General-Purpose Input/Output (GPIO)13.1Chip-specific GPIO information (161)13.2Introduction (161)13.2.1Features (161)13.2.2Modes of operation (162)13.2.3GPIO signal descriptions (162)13.3Memory map and register definition (163)13.3.1Port Data Output Register (GPIO x_PDOR) (164)13.3.2Port Set Output Register (GPIO x_PSOR) (165)13.3.3Port Clear Output Register (GPIO x_PCOR) (165)13.3.4Port Toggle Output Register (GPIO x_PTOR) (166)13.3.5Port Data Input Register (GPIO x_PDIR) (166)13.3.6Port Data Direction Register (GPIO x_PDDR) (167)13.4FGPIO memory map and register definition (167)13.4.1Port Data Output Register (FGPIO x_PDOR) (168)13.4.2Port Set Output Register (FGPIO x_PSOR) (169)13.4.3Port Clear Output Register (FGPIO x_PCOR) (169)13.4.4Port Toggle Output Register (FGPIO x_PTOR) (170)13.4.5Port Data Input Register (FGPIO x_PDIR) (170)13.4.6Port Data Direction Register (FGPIO x_PDDR) (171)13.5Functional description (171)13.5.1General-purpose input (171)13.5.2General-purpose output (171)13.5.3IOPORT (172)Chapter 14System Integration Module (SIM)14.1Chip-specific COP information (173)14.2COP clocks (173)14.3COP watchdog operation (173)14.4Introduction (175)14.4.1Features (175)14.5Memory map and register definition (176)14.5.1System Options Register 1 (SIM_SOPT1) (177)14.5.2System Options Register 2 (SIM_SOPT2) (178)14.5.3System Options Register 4 (SIM_SOPT4) (180)14.5.4System Options Register 5 (SIM_SOPT5) (181)14.5.5System Options Register 7 (SIM_SOPT7) (182)14.5.6System Device Identification Register (SIM_SDID) (184)14.5.7System Clock Gating Control Register 4 (SIM_SCGC4) (186)14.5.8System Clock Gating Control Register 5 (SIM_SCGC5) (187)14.5.9System Clock Gating Control Register 6 (SIM_SCGC6) (189)14.5.10System Clock Divider Register 1 (SIM_CLKDIV1) (190)14.5.11Flash Configuration Register 1 (SIM_FCFG1) (192)14.5.12Flash Configuration Register 2 (SIM_FCFG2) (193)14.5.13Unique Identification Register Mid-High (SIM_UIDMH) (194)14.5.14Unique Identification Register Mid Low (SIM_UIDML) (194)14.5.15Unique Identification Register Low (SIM_UIDL) (195)14.5.16COP Control Register (SIM_COPC) (195)14.5.17Service COP (SIM_SRVCOP) (197)14.6Functional description (197)Chapter 15System Mode Controller (SMC)15.1Chip-specific SMC information (199)15.2Introduction (199)15.3Modes of operation (199)15.4Memory map and register descriptions (201)15.4.1Power Mode Protection register (SMC_PMPROT) (202)15.4.2Power Mode Control register (SMC_PMCTRL) (203)15.4.3Stop Control Register (SMC_STOPCTRL) (204)15.4.4Power Mode Status register (SMC_PMSTAT) (206)15.5Functional description (206)15.5.1Power mode transitions (206)15.5.2Power mode entry/exit sequencing (209)15.5.3Run modes (211)15.5.4Wait modes (212)15.5.5Stop modes (213)15.5.6Debug in low power modes (215)Chapter 16Power Management Controller (PMC)16.1Introduction (217)16.2Features (217)16.3Low-voltage detect (LVD) system (217)16.3.1LVD reset operation (218)16.3.2LVD interrupt operation (218)16.3.3Low-voltage warning (LVW) interrupt operation (218)16.4I/O retention (219)16.5Memory map and register descriptions (219)16.5.1Low Voltage Detect Status And Control 1 register (PMC_LVDSC1) (220)16.5.2Low Voltage Detect Status And Control 2 register (PMC_LVDSC2) (221)16.5.3Regulator Status And Control register (PMC_REGSC) (222)Chapter 17Miscellaneous Control Module (MCM)17.1Introduction (225)17.1.1Features (225)17.2Memory map/register descriptions (225)17.2.1Crossbar Switch (AXBS) Slave Configuration (MCM_PLASC) (226)17.2.2Crossbar Switch (AXBS) Master Configuration (MCM_PLAMC) (226)17.2.3Platform Control Register (MCM_PLACR) (227)17.2.4Compute Operation Control Register (MCM_CPO) (229)Chapter 18Crossbar Switch Lite (AXBS-Lite)18.1Introduction (231)18.1.1Features (231)18.2Memory Map / Register Definition (231)18.3Functional Description (232)18.3.1General operation (232)18.3.2Arbitration (233)18.4Initialization/application information (234)Chapter 19Low-Leakage Wakeup Unit (LLWU)19.1Chip-specific LLWU information (235)19.2Introduction (235)19.2.1Features (235)19.2.2Modes of operation (236)19.2.3Block diagram (237)19.3LLWU signal descriptions (238)19.4Memory map/register definition (238)19.4.1LLWU Pin Enable 1 register (LLWU_PE1) (239)19.4.2LLWU Pin Enable 2 register (LLWU_PE2) (240)19.4.3LLWU Module Enable register (LLWU_ME) (241)19.4.4LLWU Flag 1 register (LLWU_F1) (243)19.4.5LLWU Flag 3 register (LLWU_F3) (244)19.4.6LLWU Pin Filter 1 register (LLWU_FILT1) (246)19.4.7LLWU Pin Filter 2 register (LLWU_FILT2) (247)19.5Functional description (248)19.5.1VLLS modes (249)19.5.2Initialization (249)Chapter 20Peripheral Bridge (AIPS-Lite)20.1Introduction (251)20.1.1Features (251)20.1.2General operation (251)20.2Functional description (252)20.2.1Access support (252)Chapter 21Reset Control Module (RCM)21.1Introduction (253)21.2Reset memory map and register descriptions (253)21.2.1System Reset Status Register 0 (RCM_SRS0) (254)21.2.2System Reset Status Register 1 (RCM_SRS1) (255)21.2.3Reset Pin Filter Control register (RCM_RPFC) (256)21.2.4Reset Pin Filter Width register (RCM_RPFW) (257)21.2.5Force Mode Register (RCM_FM) (259)21.2.6Mode Register (RCM_MR) (259)21.2.7Sticky System Reset Status Register 0 (RCM_SSRS0) (260)21.2.8Sticky System Reset Status Register 1 (RCM_SSRS1) (261)Chapter 22Bit Manipulation Engine (BME)22.1Introduction (263)22.1.1Overview (264)22.1.2Features (264)22.1.3Modes of operation (265)22.2Memory map and register definition (265)22.3Functional description (266)22.3.1BME decorated stores (266)22.3.2BME decorated loads (273)22.3.3Additional details on decorated addresses and GPIO accesses (279)22.4Application information (280)Chapter 23Micro Trace Buffer (MTB)23.1Introduction (283)23.1.1Overview (283)23.1.2Features (286)23.1.3Modes of operation (287)23.2External signal description (287)23.3Memory map and register definition (288)23.3.1MTB_RAM Memory Map (288)23.3.2MTB_DWT Memory Map (301)23.3.3System ROM Memory Map (311)Chapter 24Multipurpose Clock Generator Lite (MCG_Lite)24.1Introduction (317)24.1.1Features (317)24.1.2Block diagram (317)24.2Memory map and register definition (318)24.2.1MCG Control Register 1 (MCG_C1) (319)24.2.2MCG Control Register 2 (MCG_C2) (319)24.2.3MCG Status Register (MCG_S) (320)24.2.4MCG Status and Control Register (MCG_SC) (321)24.2.5MCG Miscellaneous Control Register (MCG_MC) (321)24.3Functional description (322)24.3.1Clock mode switching (322)24.3.2LIRC divider 1 (323)24.3.3LIRC divider 2 (323)24.3.4Enable LIRC in Stop mode (324)24.3.5MCG-Lite in Low-power mode (324)Chapter 25Oscillator (OSC)25.1OSC modes of operation with MCG_Lite and RTC (325)25.2Introduction (325)25.3Features and Modes (325)25.4Block Diagram (326)25.5OSC Signal Descriptions (327)25.6External Crystal / Resonator Connections (327)25.7External Clock Connections (328)25.8Memory Map/Register Definitions (329)25.8.1OSC Memory Map/Register Definition (329)25.9Functional Description (330)25.9.1OSC module states (330)25.9.2OSC module modes (332)25.9.3Counter (333)25.9.4Reference clock pin requirements (333)25.10Reset (334)25.11Low power modes operation (334)25.12Interrupts (334)Chapter 26Flash Memory Controller (FMC)26.1Introduction (335)26.1.1Overview (335)26.1.2Features (335)26.2Modes of operation (336)26.3External signal description (336)26.4Memory map and register descriptions (336)26.5Functional description (336)Chapter 27Flash Memory Module (FTFA)27.1Introduction (339)27.1.1Features (339)27.1.2Block Diagram (340)27.1.3Glossary (341)27.2External Signal Description (342)27.3Memory Map and Registers (342)27.3.1Flash Configuration Field Description (342)27.3.2Program Flash IFR Map (343)27.3.3Register Descriptions (343)27.4Functional Description (352)27.4.1Flash Protection (352)27.4.2Interrupts (353)27.4.3Flash Operation in Low-Power Modes (354)27.4.4Functional Modes of Operation (354)27.4.5Flash Reads and Ignored Writes (354)27.4.6Read While Write (RWW) (355)27.4.7Flash Program and Erase (355)27.4.8Flash Command Operations (355)27.4.9Margin Read Commands (360)27.4.10Flash Command Description (361)27.4.11Security (375)27.4.12Reset Sequence (377)Chapter 28Analog-to-Digital Converter (ADC)28.1Chip-specific ADC information (379)28.1.1ADC0 connections/channel assignment (379)28.1.2ADC analog supply and reference connections (380)28.1.3ADC Reference Options (380)28.1.4Alternate clock (381)28.2Introduction (381)28.2.1Features (381)28.2.2Block diagram (382)28.3ADC signal descriptions (383)28.3.1Analog Power (VDDA) (384)28.3.2Analog Ground (VSSA) (384)28.3.3Analog Channel Inputs (ADx) (384)28.4Memory map and register definitions (384)28.4.1ADC Status and Control Registers 1 (ADC x_SC1n) (385)28.4.2ADC Configuration Register 1 (ADC x_CFG1) (389)28.4.3ADC Configuration Register 2 (ADC x_CFG2) (390)28.4.4ADC Data Result Register (ADC x_R n) (391)28.4.5Compare Value Registers (ADC x_CV n) (392)28.4.6Status and Control Register 2 (ADC x_SC2) (393)28.4.7Status and Control Register 3 (ADC x_SC3) (395)28.4.8ADC Offset Correction Register (ADC x_OFS) (397)28.4.9ADC Plus-Side Gain Register (ADC x_PG) (397)28.4.10ADC Plus-Side General Calibration Value Register (ADC x_CLPD) (398)28.4.11ADC Plus-Side General Calibration Value Register (ADC x_CLPS) (398)28.4.12ADC Plus-Side General Calibration Value Register (ADC x_CLP4) (399)28.4.13ADC Plus-Side General Calibration Value Register (ADC x_CLP3) (399)28.4.14ADC Plus-Side General Calibration Value Register (ADC x_CLP2) (400)28.4.15ADC Plus-Side General Calibration Value Register (ADC x_CLP1) (400)28.4.16ADC Plus-Side General Calibration Value Register (ADC x_CLP0) (401)28.5Functional description (401)28.5.1Clock select and divide control (402)28.5.2Voltage reference selection (403)28.5.3Hardware trigger and channel selects (403)28.5.4Conversion control (404)28.5.5Automatic compare function (411)28.5.6Calibration function (412)28.5.7User-defined offset function (414)28.5.8Temperature sensor (415)28.5.9MCU wait mode operation (416)28.5.10MCU Normal Stop mode operation (416)28.5.11MCU Low-Power Stop mode operation (417)28.6Initialization information (418)28.6.1ADC module initialization example (418)28.7Application information (420)28.7.1External pins and routing (420)28.7.2Sources of error (422)Chapter 29Comparator (CMP)29.1Chip-specific CMP information (427)29.1.1CMP input connections (427)29.1.2CMP external references (428)29.1.3CMP trigger mode (428)29.2Introduction (429)29.2.1CMP features (429)29.2.26-bit DAC key features (430)29.2.3ANMUX key features (430)29.2.4CMP, DAC and ANMUX diagram (430)29.2.5CMP block diagram (431)29.3Memory map/register definitions (432)29.3.1CMP Control Register 0 (CMP x_CR0) (433)29.3.2CMP Control Register 1 (CMP x_CR1) (434)29.3.3CMP Filter Period Register (CMP x_FPR) (435)29.3.4CMP Status and Control Register (CMP x_SCR) (436)29.3.5DAC Control Register (CMP x_DACCR) (437)29.3.6MUX Control Register (CMP x_MUXCR) (437)29.4Functional description (438)29.4.1CMP functional modes (438)29.4.2Power modes (442)29.4.3Startup and operation (443)29.4.4Low-pass filter (443)29.5CMP interrupts (445)29.6Digital-to-analog converter (446)29.7DAC functional description (446)29.7.1Voltage reference source select (446)29.8DAC resets (447)29.9DAC clocks (447)29.10DAC interrupts (447)29.11CMP Trigger Mode (447)Chapter 30Voltage Reference (VREF)30.1Chip specific VREF information (449)30.1.1Clock Gating (449)30.2Introduction (449)30.2.1Overview (450)30.2.2Features (450)30.2.3Modes of Operation (451)30.2.4VREF Signal Descriptions (451)30.3Memory Map and Register Definition (452)30.3.1VREF Trim Register (VREF_TRM) (452)30.3.2VREF Status and Control Register (VREF_SC) (453)30.4Functional Description (454)30.4.1Voltage Reference Disabled, SC[VREFEN] = 0 (455)30.4.2Voltage Reference Enabled, SC[VREFEN] = 1 (455)30.4.3Internal voltage regulator (456)30.5Initialization/Application Information (457)Chapter 31Timer/PWM Module (TPM)31.1Chip-specific TPM information (459)31.1.1Clock options (459)31.1.2Trigger options (460)31.1.3Global timebase (460)31.1.4TPM interrupts (460)31.2Introduction (461)31.2.1TPM Philosophy (461)31.2.2Features (461)31.2.3Modes of operation (462)31.2.4Block diagram (462)31.3TPM Signal Descriptions (463)31.3.1TPM_EXTCLK — TPM External Clock (463)31.3.2TPM_CHn — TPM Channel (n) I/O Pin (464)31.4Memory Map and Register Definition (464)31.4.1Status and Control (TPM x_SC) (465)31.4.2Counter (TPM x_CNT) (466)31.4.3Modulo (TPM x_MOD) (467)31.4.4Channel (n) Status and Control (TPM x_C n SC) (468)31.4.5Channel (n) Value (TPM x_C n V) (469)31.4.6Capture and Compare Status (TPM x_STATUS) (470)31.4.7Configuration (TPM x_CONF) (472)31.5Functional description (473)31.5.1Clock domains (474)31.5.2Prescaler (474)31.5.3Counter (475)31.5.4Input Capture Mode (478)31.5.5Output Compare Mode (478)31.5.6Edge-Aligned PWM (EPWM) Mode (480)31.5.7Center-Aligned PWM (CPWM) Mode (481)31.5.8Registers Updated from Write Buffers (483)31.5.9Output triggers (484)31.5.10Reset Overview (484)31.5.11TPM Interrupts (484)Chapter 32Low-Power Timer (LPTMR)32.1Chip-specific LPTMR information (487)32.1.1LPTMR pulse counter input options (487)32.1.2LPTMR prescaler/glitch filter clocking options (487)32.2Introduction (488)32.2.1Features (488)32.2.2Modes of operation (488)32.3LPTMR signal descriptions (489)32.3.1Detailed signal descriptions (489)32.4Memory map and register definition (489)32.4.1Low Power Timer Control Status Register (LPTMR x_CSR) (490)32.4.2Low Power Timer Prescale Register (LPTMR x_PSR) (491)32.4.3Low Power Timer Compare Register (LPTMR x_CMR) (493)32.4.4Low Power Timer Counter Register (LPTMR x_CNR) (493)32.5Functional description (494)32.5.1LPTMR power and reset (494)32.5.2LPTMR clocking (494)32.5.3LPTMR prescaler/glitch filter (494)32.5.4LPTMR compare (496)32.5.5LPTMR counter (496)32.5.6LPTMR hardware trigger (497)32.5.7LPTMR interrupt (497)Chapter 33Real Time Clock (RTC)33.1Chip-specific RTC information (499)33.1.1RTC_CLKOUT options (499)33.2Introduction (499)33.2.1Features (499)33.2.2Modes of operation (500)33.2.3RTC signal descriptions (500)33.3Register definition (500)33.3.1RTC Time Seconds Register (RTC_TSR) (501)33.3.2RTC Time Prescaler Register (RTC_TPR) (501)33.3.3RTC Time Alarm Register (RTC_TAR) (502)33.3.4RTC Time Compensation Register (RTC_TCR) (502)33.3.5RTC Control Register (RTC_CR) (504)33.3.6RTC Status Register (RTC_SR) (506)33.3.7RTC Lock Register (RTC_LR) (507)33.3.8RTC Interrupt Enable Register (RTC_IER) (508)33.4Functional description (509)33.4.1Power, clocking, and reset (509)33.4.2Time counter (510)33.4.3Compensation (510)33.4.4Time alarm (511)33.4.5Update mode (511)33.4.6Register lock (512)33.4.7Interrupt (512)Chapter 34Serial Peripheral Interface (SPI)34.1Chip-specific SPI information (513)34.2Introduction (513)34.2.1Features (513)34.2.2Modes of operation (514)34.2.3Block diagrams (515)34.3External signal description (517)34.3.1SPSCK — SPI Serial Clock (517)34.3.2MOSI — Master Data Out, Slave Data In (518)34.3.3MISO — Master Data In, Slave Data Out (518)34.3.4SS — Slave Select (518)34.4Memory map/register definition (519)34.4.1SPI Status Register (SPI x_S) (519)34.4.2SPI Baud Rate Register (SPI x_BR) (520)34.4.3SPI Control Register 2 (SPI x_C2) (521)34.4.4SPI Control Register 1 (SPI x_C1) (523)34.4.5SPI Match Register (SPI x_M) (524)34.4.6SPI Data Register (SPI x_D) (525)34.5Functional description (525)34.5.1General (525)34.5.2Master mode (526)34.5.3Slave mode (527)34.5.4SPI clock formats (529)34.5.5SPI baud rate generation (532)34.5.6Special features (532)34.5.7Error conditions (534)34.5.8Low-power mode options (535)34.5.9Reset (536)34.5.10Interrupts (537)34.6Initialization/application information (538)34.6.1Initialization sequence (538)34.6.2Pseudo-Code Example (539)Chapter 35Inter-Integrated Circuit (I2C)35.1Chip-specific I2C information (543)35.2Introduction (543)35.2.1Features (543)35.2.2Modes of operation (544)35.2.3Block diagram (544)35.3I2C signal descriptions (545)35.4Memory map/register definition (546)35.4.1I2C Address Register 1 (I2C x_A1) (546)35.4.2I2C Frequency Divider register (I2C x_F) (547)35.4.3I2C Control Register 1 (I2C x_C1) (548)35.4.4I2C Status register (I2C x_S) (549)35.4.5I2C Data I/O register (I2C x_D) (551)35.4.6I2C Control Register 2 (I2C x_C2) (552)35.4.7I2C Programmable Input Glitch Filter Register (I2C x_FLT) (553)35.4.8I2C Range Address register (I2C x_RA) (554)35.4.9I2C SMBus Control and Status register (I2C x_SMB) (555)35.4.10I2C Address Register 2 (I2C x_A2) (556)35.4.11I2C SCL Low Timeout Register High (I2C x_SLTH) (557)35.4.12I2C SCL Low Timeout Register Low (I2C x_SLTL) (557)35.4.13I2C Status register 2 (I2C x_S2) (558)35.5Functional description (558)35.5.1I2C protocol (558)35.5.210-bit address (564)35.5.3Address matching (565)35.5.4System management bus specification (566)35.5.5Resets (569)35.5.6Interrupts (569)35.5.7Programmable input glitch filter (571)35.5.8Address matching wake-up (572)35.5.9Double buffering mode (573)35.6Initialization/application information (574)Chapter 36Low Power Universal Asynchronous Receiver/Transmitter (LPUART)36.1Chip-specific LPUART information (579)36.2Introduction (579)36.2.1Features (579)36.2.2Modes of operation (580)36.2.3Signal Descriptions (581)36.2.4Block diagram (581)36.3Register definition (583)36.3.1LPUART Baud Rate Register (LPUART x_BAUD) (584)36.3.2LPUART Status Register (LPUART x_STAT) (586)36.3.3LPUART Control Register (LPUART x_CTRL) (590)36.3.4LPUART Data Register (LPUART x_DATA) (595)36.3.5LPUART Match Address Register (LPUART x_MATCH) (597)36.4Functional description (597)36.4.1Baud rate generation (597)36.4.2Transmitter functional description (598)36.4.3Receiver functional description (600)36.4.4Additional LPUART functions (605)36.4.5Interrupts and status flags (607)Chapter 1About This Document1.1Overview1.1.1PurposeThis document describes the features, architecture, and programming model of the Freescale microcontroller.1.1.2AudienceA reference manual is primarily for system architects and software application developers who are using or considering using a Freescale product in a system.1.2Conventions1.2.1Numbering systemsThe following suffixes identify different numbering systems:1.2.2Typographic notationThe following typographic notation is used throughout this document:1.2.3Special termsThe following terms have special meanings:Chapter 2Introduction2.1KL03 sub-family introductionThe device is highly-integrated, market leading ultra low-power 32-bit microcontroller based on the enhanced Cortex-M0+ (CM0+) core platform. The features of the KL03 family derivatives are as follows.•Core platform clock up to 48 MHz, bus clock up to 24 MHz•Memory option is up to 32 KB flash, 2 KB RAM and 8 KB ROM with build-in boot loader•Wide operating voltage ranges from 1.71–3.6 V with fully functional flash program/ erase/read operations•Multiple package options from 16-pin to 24-pin•Ambient operating temperature ranges from –40 °C to 85 °C for WLCSP package and –40 °C to 105 °C for all the other packages.The family acts as an ultra low-power, cost-effective microcontroller to provide developers an appropriate entry-level 32-bit solution. The family is the next-generation MCU solution for low-cost, low-power, high-performance devices applications. It’s valuable for cost-sensitive, portable applications requiring long battery life-time.2.2Module functional categoriesThe modules on this device are grouped into functional categories. Information found here describes the modules assigned to each category in more detail.2.2.1ARM Cortex-M0+ core modules The following core modules are available on this device.2.2.2System modulesThe following system modules are available on this device.2.2.3Memories and memory interfacesThe following memories and memory interfaces are available on this device.2.2.4ClocksThe following clock modules are available on this device.2.2.5Analog modulesThe following analog modules are available on this device:。

Series WE03 3-Piece Tri-Clamp 钢球阀设备说明书

The Series WE03incorporates a full port 3-piece tri-clamp SS ball valve for great flow rates with minimal pressure drop.The valve features a blowout proof stem for added safety, reinforced PTFE seats and seals for longer life, and a 316 SS (ASTM CF8M) ball for better performance. Actuators are direct mounted creating a compact assembly for tight spaces. Limit switches are able to be mounted directly to the valves allowing for remote position indication. The Series WE03 can be configured with either an electric or pneumatic actuator.Electric actuators are available in weatherproof or explosion-proof, a variety of supply voltages and two-position or modulating control. Two-position actuators use the supply voltage to drive the valve open or closed, whilethe modulating actuator accepts a 4 to 20mA input for valve positioning. Actuators feature thermal overload protection and permanently lubricated gear train.The pneumatic double acting actuator uses an air supply to drive the valve open and closed. The actuator has two supply ports with one driving the valve open and the other driving the valve closed. Spring return pneumatic actuators use the air supply to open the valve and internally loaded springs return the valve to the closed position. Also available is the SN solenoid valve to electrically switch the air supply pressure between the air supply ports for opening and closing the valve. Actuators are constructed of anodized and epoxy coated aluminum for years of corrosion free service.SPECIFICATIONSVALVE Service:Compatible liquids and gases.Body: 3-piece.Line Sizes:1/2 to 2˝ .End Connections: Tri-clamp ends.Pressure Limits:20˝ Hg to 1000 psi(-0.7 to 69 bar).Wetted Materials:Body and ball: 316 SS (CF8M);Stem: 316 SS;Seat: RTFE/PTFE;Seal, Washer, and Packing: PTFE.Temperature Limits:-20 to 392°F(-29 to 200°C).Other Materials:O-ring: Fluoroelastomer;Handle: 304 SS;Washer: 301 SS;Stem Nut, Locking Device,Gland Ring: 304 SS;Handle Sleeve: PVC.ACTUATORSPneumatic “DA” and “SR” SeriesType:DA series is double acting andSR series is spring return (rack andpinion).Normal Supply Pressure:DA: 40 to 115 psi (2.7 to 7.9 bar);SR: 80 psi (5.5 bar).Maximum Supply Pressure:120 psi(8.6 bar).Air Connections:DA01: 1/8˝ female NPT ;DA02: 1/4˝ female NPT ;SR02 to SR04: 1/4˝ female NPT .Housing Material:Anodized aluminum body and epoxy coated aluminum end caps. Temperature Limits:-40 to 176°F (-40to 80°C).Accessory Mounting:NAMUR standard.Electric “TD” and “MD” Series Power Requirements: 110 VAC, 220 VAC, 24 VAC or 24 VDC (MD models not available in 24 VDC).Power Consumption:See page 8.Cycle Time (per 90°): TD01: 4 s;MD01: 10 s; TD02 and MD02: 20 s.Duty Rating:85%.Enclosure Rating:NEMA 4X (IP67).Housing Material:Powder coated aluminum.Temperature Limits: -22 to 140°F (-30 to 60°C).Electrical Connection:1/2˝ female NPT .Modulating Input:4 to 20 mA.Standard Features:Manual override,position indicator, and TD models come with two limit switches. Electric “TI” and “MI” Series Power Requirements: 110 VAC, 220 VAC, 24 VAC or 24 VDC.Power Consumption:See page 8.Cycle Time (per 90°): TI01 and MI01: 2.5 s; TI02 and MI02: 5 s.Duty Rating:Two-Position:TI01-TI02: 25%;Modulating:MI01-MI02: 75%.Enclosure Rating:NEMA 7.Housing Material:Powder coated aluminum.Temperature Limits:-40 to 140°F (-40 to 60°C).Electrical Connection:1/2˝ female NPT .Modulating Input:4 to 20 mA.Standard Features:Position indicator and two limit switches.WE03-DDA01-0000WE03-DDA01-AA07WE03-DH00WE03-DTD01-AWE03-DDA01-AA06WE03-DTI01-AVALVE BILL OF MATERIALSItem 123456789101112131415161718Description Body Cap BallBall Seat StemThrust Washer Stem Packing Gland RingBelleville Washer NutLock Washer Flat Washer Stop Pin HandleHandle Cover Spring Washer Nut BoltMaterialASTM A351-CF8M PTFEASTM A276-316PTFE AISI 304AISI 301AISI 304PVC AISI 304Model Number WE03-CHD00WE03-DHD00WE03-EHD00WE03-GHD00WE03-HHD00WE03-IHD00WE03-JHD00WE03-KHD00Size 1/2˝3/4˝1˝1-1/2˝2˝2-1/2˝3˝4˝ØD1in(mm)1-27/32˝(36)1-27/32˝(36)1-21/32˝(42)1-31/32˝(50)1-31/32˝(50)2-49/64˝ (70)2-49/64˝ (70)4-1/64˝(102)ØD2in(mm)1-21/32˝(42)1-21/32˝(42)1-31/32˝(50)2-49/64˝(70)2-49/64˝(70)2-49/64˝(70)4-1/64˝(102)4-59/64˝(125)ISO F03/04F03/04F04/05F05/07F05/07F07/10F07/10F10/12ØCin(mm)1-51/64˝(45.5)1-55/64˝(47)2-17/64˝(57.5)3-9/32˝(83)3-15/16˝(100)4-31/32˝(126)5-53/64˝(148)7-7/32˝(183)ØA in(mm)25/64˝(9.6)5/8˝(15.8)7/8˝(22.1)1-3/8˝(34.8)1-57/64˝(47.7)2-3/8˝(60.3)2-7/8˝(72.9)3-27/32˝(97.5)ØA1in(mm)1˝(25.4)1˝(25.4)2˝(50.5)2˝(50.5)2-17/32˝(64)3-1/16˝(77.5)3-19/32˝(91)4-11/16˝(119)ØRa in(mm)7/64˝(2.75)7/64˝(2.75)9/64˝(3.5)3/16˝(4.5)3/16˝(4.5)7/32˝(5.5)7/32˝(5.5)17/64˝(6.5)ØRb in(mm)7/64˝(2.75)7/64˝(2.75)7/64˝(2.75)9/64˝(3.5)9/64˝(3.5)3/16˝(4.5)3/16˝(4.5)7/32˝(5.5)Sin(mm)23/64˝(9)23/64˝(9)7/16˝(11)9/16˝(14)9/16˝(14)43/64˝(17)43/64˝(17)7/8˝(22)Lin(mm)3-37/64˝(90.7)4-1/16˝(103)4-17/32˝(115)5-31/64˝(139)6-15/64˝(158)7-49/64˝(197)8-63/64˝(228)9-17/32˝(241.8)Hin(mm)4-25/32˝(121.3)4-25/32˝(121.3)5-29/32˝(150)5-29/32˝(150)7-3/32˝(180)7-3/32˝(180)9-19/32˝(243.5)11-15/64˝(285)H1in(mm)23/64˝(9)7/16˝(11)7/16˝(11)9/16˝(14)9/16˝(14)43/64˝(17)43/64˝(17)7/8˝(22)H2in(mm)1-11/32˝(34)1-25/64˝(35.3)1-55/64˝(47)2-1/2˝(63.5)2-53/64˝(72)3-35/64˝(90)3-29/32˝(99)5-1/32˝(127.5)VALVE DIMENSIONAL DRAWINGPOPULAR MODELSSize 1/2˝3/4˝1˝1-1/2˝2˝Cv(gal/min)14.3942.2586.17223.61437.98Hand Operated ModelWE03-CHD00WE03-DHD00WE03-EHD00WE03-GHD00WE03-HHD00Double Acting Pneumatic Model WE03-CDA01WE03-DDA01WE03-EDA02WE03-GDA02WE03-HDA02Spring Return Pneumatic Model WE03-CSR02WE03-DSR02WE03-ESR03WE03-GSR04WE03-HSR04NEMA 4X Two Position Electric (110 VAC) Model WE03-CTD01-A WE03-DTD01-A WE03-ETD01-A WE03-GTD01-A WE03-HTD02-ANEMA 4XModulating Electric (110 VAC) Model WE03-CMD01-A WE03-DMD01-A WE03-EMD01-A WE03-GMD01-A WE03-HMD02-AWin(mm)2-35/64˝(64.7)2-35/64˝(64.7)3-1/8˝(79)3-13/16˝(96.5)4-3/32˝(104)5-19/32˝(142)5-29/32˝(150)7-19/64˝(185)M1M12x1.25M12x1.25M14x1.5M18x1.5M18x1.5M22x1.5M22x1.5M28x2.0Cv(gal/min)14.3942.2586.17223.61437.98725.171059.891950.87AUTOMATED VALVE DRAWINGSSize B C D E F 1/2˝5-3/8˝136.5 mm 4-1/2˝113 mm 3-5/8˝90.7 mm 6-1/4˝160 mm 3˝77 mm 3/4˝5-3/8˝136.5 mm 4-1/2˝113 mm 4˝103 mm 6-1/4˝160 mm 3˝77 mm 1˝5-7/8˝149.5 mm 4-1/2˝113 mm 4-1/2˝115 mm 6-1/4˝160 mm 3˝77 mm 1-1/2˝6-1/2˝166 mm 4-1/2˝113 mm 5-1/2˝139 mm 6-1/4˝160 mm 3˝77 mm 2˝6-7/8˝174.5 mm 4-1/2˝113 mm 6-1/4˝158 mm 6-1/4˝160 mm 3˝77 mmSize B C D E F 1/2˝4-1/2˝114 mm 2-3/8˝60.5 mm 3-5/8˝90.7 mm 4-5/8˝116 mm 1-3/8˝36.5 mm 3/4˝4-1/2˝114 mm 2-3/8˝60.5 mm 4˝103 mm 4-5/8˝116 mm 1-3/8˝36.5 mm 1˝5-1/2˝139 mm 2-3/4˝71 mm 4-1/2˝115 mm 5-3/4˝145 mm 1-5/8˝41 mm 1-1/2˝6-1/8˝155.5 mm 2-3/4˝71 mm 5-1/2˝139 mm 5-3/4˝145 mm 1-5/8˝41 mm 2˝6-1/2˝164 mm 2-3/4˝71 mm 6-1/4˝158 mm 5-3/4˝145 mm 1-5/8˝41 mmDouble Acting Pneumatic Actuator Size B C D E F 1/2˝5-1/8˝126 mm 2-3/4˝71 mm 3-5/8˝90.7 mm 5-3/4˝145 mm 1-5/8˝41 mm3/4˝5-1/8˝126 mm 2-3/4˝71 mm 4˝103 mm 5-3/4˝145 mm 1-5/8˝41 mm1˝6-1/4˝155 mm 3-1/4˝82 mm 4-1/2˝115 mm 6-5/8˝169 mm 1-3/4˝46 mm1-1/2˝7-1/4˝184.6 mm 3-3/4˝94 mm 5-1/2˝139 mm 7-7/8˝201 mm 2˝52 mm2˝8˝192 mm 3-3/4˝94 mm 6-1/4˝158 mm 7-7/8˝201 mm 2˝52 mmSpring Return Pneumatic ActuatorPneumatic Actuators Bill of MaterialsELECTRIC ACTUATORSElectric Installation1. Operate valve manually and place in the open position.2. Remove any mechanical stops the valve might have. (DO NOT REMOVE ANY PARTS NECESSARY FOR THE PROPER OPERATION OF THE VALVE, SUCH AS THE PACKING GLAND, PACKING NUT, ETC.)3. Ensure that the actuator output shaft and valve stem are aligned properly. If they are not, operate the valve manually until they are correct.4. Remove actuator cover.5. Bring power to the actuator. CAUTION: Make sure power is OFF at the main box.6. Wire the actuator per the diagram attached to the inside of the cover. Special actuators (those with positioner boards, etc.) will have diagrams enclosed inside the cover.7. Securely tighten bolts used to mount the actuator to a mounting bracket or directly to the valve mounting pad if it is ISO5211 compliant.8. Cycle the unit several times and check the open and closed positions of the valve. Cams are pre-adjusted at the factory; due to the variety of valve designs and types however, slight adjustments might be required.9. Replace cover and tighten screws.To Set The Open Position1. Cycle the valve to the open position by applying power to terminals. The top cam and switch control this position. In the open position, the set screw in the top cam will be accessible.2. If the valve is not open completely:A. Slightly loosen the set screw on the top cam.B. Rotate the cam clockwise (CW) by hand until the switch makes contact.Contact is made when a slight click can be heard. By making incremental CW movements of the top cam, the valve can be positioned precisely in the desired position.C. When the top cam is set, tighten the set screw securely.3. If the valve opens too far:A. Apply power to terminals. This will begin to rotate valve CW. Whenvalve is fully open and in the exact position desired, remove power from actuator.B. Loosen the set screw in the top cam.C. Rotate the top cam counterclockwise (CCW) until the switch arm drops off theround portion of the cam onto the flat section. A slight click can be heard as the switch changes state.D. Continue applying power to terminals until valve is in the desired position.To Set The Closed Position1. Apply power to terminals to move the valve toward the closed position. The bottom cam and switch control the closed position. In the closed position, the set screw in the bottom cam will be accessible.2. If the valve is not closed completely:A. Slightly loosen the set screw on the bottom cam.B. Rotate the cam counter-clockwise (CCW) by hand until the switch makescontact. Contact is made when a slight click can be heard. By making incremental CCW movements of the bottom cam, the valve can be positioned precisely in the desired position.C. When the top cam is set, tighten the set screw securely.3. If the valve closes too far:A. Apply power to terminals. This will begin to rotate valve CCW. Whenvalve is fully closed and in the exact position desired, remove power fromactuator.B. Loosen the set screw in the top cam.C. Rotate the top cam clockwise (CW) until the switch arm drops off the roundportion of the cam onto the flat section. A slight click can be heard as the switch is no longer making contact with the round part of the cam.D. Continue applying power to terminals until valve is in the desired position.Model ACT-DA01 ACT-DA02 ACT-DA03 ACT-DA04 ACT-DA05 ACT-DA06 ACT-DA07 ACT-DA08 ACT-DA0940 psi491041823023965678451497225350 psi6113022837749570910561871281660 psi7415527445359485112672245337970 psi8618131952869399314782619394280 psi98207365603792113516902993450690 psi1102334116798911277190133675069100 psi1232594567549901419211237425632110 psi13528550283010891561232341166195115 psi14230052987511481649245043406533Air PressureDA Double-Action Output Torque (lb-in)Model ACT-SR02 ACT-SR03 ACT-SR04 ACT-SR05 ACT-SR06 ACT-SR07 ACT-SR08 ACT-SR09 ACT-SR10SpringQuantity101010101010101010Air PressureSR Single Acting Pneumatic Actuator (lb-in)0°Start11119934843060878316822303347990°End861432543124586631208148322740°Start13724542452975099420562866433790°End1121893304115998741583204631330°Start163291499628891120624303429519590°End13823540551074110851957260939910°Start1893365757271033141728043992605390°End16428048160988312972331317348490°Start2153826508261175162831784556691190°End189326556708102515082705373657070°Start2314096958851260175534034894742690°End2053536017671110163529304074622290°Start961762743815368171416236335490°End701201802633866969381575240770 psi80 psi90 psi100 psi110 psi115 psi Spring TorqueDouble Acting Actuator Torque Spring Return Actuator TorqueTD01-TD09: 120 VAC, TD01-TD09: 220 VAC, TD01-TD09: 24 VACWiring Diagrams forTD01-TD06: 24 VDCWiring Diagrams forMD01-MD09: 120 VAC, MD01-MD09: 220 VAC, MD01-MD09: 24 VACElectric Actuators Performance Rating MAINTENANCE/REPAIRUpon final installation of the Series WE, only routine maintenance is required. The Series WE is not field serviceable and should be returned if repair is needed. Field repair should not be attempted and may void warranty.WARRANTY/RETURNRefer to “Terms and Conditions of Sale” in our catalog and on our website. Contact customer service to receive a Return Goods Authorization number before shipping the product back for repair. Be sure to include a brief description of the problem plus any additional application notesTI03 and MI03Voltage Cycle TimeDuty Cycle (Two-Position)Duty Cycle (Modulating)AMP Draw Torque110 VAC 5 s 25%75%0.75 A 300 in-lb 220 VAC 5 s 25%75%0.38 A 300 in-lb 24 VAC 5 s 25%75%3.2 A 300 in-lb 24 VDC 5 s 25%75%3.2 A 300 in-lb TI04 and MI04Voltage Cycle TimeDuty Cycle (Two-Position)Duty Cycle (Modulating)AMP Draw Torque110 VAC 10 s 25%75%0.75 A 400 in-lb 220 VAC 10 s 25%75%0.38 A 400 in-lb 24 VAC 10 s 25%75%3.2 A 400 in-lb 24 VDC 10 s 25%75%3.2 A 400 in-lb TI05 and MI05Voltage Cycle TimeDuty Cycle (Two-Position)Duty Cycle (Modulating)AMP Draw Torque110 VAC 15 s 25%75%0.75 A 625 in-lb 220 VAC 15 s 25%75%0.38 A 625 in-lb 24 VAC 15 s 25%75%3.2 A 625 in-lb 24 VDC 15 s 25%75%3.2 A 625 in-lb TI06 and MI06Voltage Cycle TimeDuty Cycle (Two-Position)Duty Cycle (Modulating)AMP Draw Torque110 VAC 15 s 25%75%1.1 A1000 in-lb 220 VAC 15 s 25%75%0.38 A 1000 in-lb 24 VAC 15 s 25%75%3.2 A1000 in-lb 24 VDC 15 s 25%75%3.2 A1000 in-lb TI07 and MI07Voltage Cycle TimeDuty Cycle (Two-Position)Duty Cycle (Modulating)AMP Draw Torque110 VAC 30 s 25%75%1.1 A1500 in-lb 220 VAC 30 s 25%75%0.38 A 1500 in-lb 24 VAC 30 s 25%75%3.2 A1500 in-lb 24 VDC 30 s 25%75%3.2 A1500 in-lb TI08 and MI08Voltage Cycle TimeDuty Cycle (Two Position)Duty Cycle (Modulating)AMP Draw Torque110 VAC 12 s 100%100%2.6 A2000 in-lb 220 VAC 12 s 100%100%2.4 A2000 in-lb 24 VAC 12 s 100%100%20 A2000 in-lb 24 VDC 12 s 100%100%20 A2000 in-lb TI09 and MI09Voltage Cycle TimeDuty Cycle (Two-Position)Duty Cycle (Modulating)AMP Draw Torque110 VAC 14 s 100%100%2.99 A 3840 in-lb220 VAC 14 s 100%100%2.4 A3840 in-lb24 VAC 14 s 100%100%20 A3840 in-lb24 VDC 14 s 100%100%20 A3840 in-lbTI10 and MI10Voltage Cycle TimeDuty Cycle (Two-Position)Duty Cycle (Modulating)AMP Draw Torque110 VAC68 s 100%100%2.99 A 5000 in-lb 220 VAC 68 s 100%100%2.4 A5000 in-lb 24 VAC 68 s 100%100%20 A5000 in-lb 24 VDC 68 s 100%100%20 A5000 in-lbTI01 and MI01Voltage Cycle TimeDuty Cycle (Two-Position)Duty Cycle (Modulating)AMP Draw Torque110 VAC 2.5 s 25%75%0.55 A 100 in-lb220 VAC 2.5 s 25%75%0.38 A 100 in-lb24 VDC 2.5 s 25%75%2.44 A 100 in-lbTD01Voltage Cycle TimeDuty Cycle (Two-Position)AMP Draw Torque110 VAC 4 s 85%0.24 A 177 in-lb220 VAC 4 s 85%0.16 A 177 in-lb24 VDC 4 s 85%1.28 A 177 in-lb TD02 and MD02VoltageCycle Time Duty Cycle (Two-Position)Duty Cycle (Modulating)AMP Draw Torque110 VAC 20 s 85%85%0.24 A 442 in-lb 220 VAC 20 s 85%85%0.16 A 442 in-lb 24 VDC 20 s 85%1.28 A 442 in-lb TD03 and MD03VoltageCycle Time Duty Cycle (Two-Position)Duty Cycle (Modulating)AMP Draw Torque110 VAC 30 s 85%85%0.57 A 885 in-lb 220 VAC 30 s 85%85%0.35 A 885 in-lb 24 VDC 30 s 85%2.03 A 885 in-lb TD04 and MD04VoltageCycle TimeDuty Cycle (Two-Position)Duty Cycle (Modulating)AMP DrawTorque110 VAC 30 s 85%85%0.65 A 1770 in-lb 220 VAC 30 s 85%85%0.37 A 1770 in-lb 24 VDC 30 s 85%3.57 A 1770 in-lb TD05 and MD05VoltageCycle TimeDuty Cycle (Two-Position)Duty Cycle (Modulating)AMP DrawTorque110 VAC 30 s 85%85%1.12 A 3540 in-lb 220 VAC 30 s 85%85%0.57 A 3540 in-lb 24 VDC 30 s 85%5.13 A 3540 in-lb TD06 and MD06VoltageCycle TimeDuty Cycle (Two-Position)Duty Cycle (Modulating)AMP DrawTorque110 VAC 45 s 85%85%1.18 A 5210 in-lb 220 VAC 45 s 85%85%0.60 A 5210 in-lb 24 VDC 45 s 85%6.04 A 5210 in-lb MD01Voltage Cycle TimeMD01 Duty Cycle (Modulating)AMP Draw Torque110 VAC 10 s 85%0.24 A 265 in-lb 220 VAC 10 s 85%0.16 A 265 in-lb24 VAC 10 s 85%1.28 A 265 in-lb TI02 and MI02VoltageCycle TimeTI01 Duty Cycle (Two-Position)MI01 Duty Cycle (Modulating)AMP DrawTorque110 VAC 5 s 25%75%0.75 A 200 in-lb 220 VAC 5 s 25%75%0.38 A 200 in-lb 24 VAC 5 s 25%75%3.2 A 200 in-lb24 VDC 5 s 25%75%3.2 A 200 in-lb(MD Not Available in 24 VDC)(MD Not Available in 24 VDC)(MD Not Available in 24 VDC)(MD Not Available in 24 VDC)(MD Not Available in 24 VDC)24 VAC 4 s 85%0.28 A 177 in-lb24 VAC 20 s 85%85%1.28 A442 in-lb 24 VAC 30 s 85%85%2.03 A885 in-lb 24 VAC 30 s 85%85%3.57 A 1770 in-lb 24 VAC 30 s 85%85%5.13 A 3540 in-lb 24 VAC 45 s 85%85%6.04 A 5210 in-lb 24 VAC 2.5 s 25%75%2.44 A 100 in-lbPage 10©Copyright 2014 Dwyer Instruments, Inc.Printed in U.S.A. 2/14FR#VA-444173-00 Rev.2。