BSC019N02KS G中文资料
无线对刀器XHC-NC02说明书
数控全向无线对刀器XHC-NC02说明书Precision Wireless Instrument on the knife Handle Model:XHC-NC02版本号(Version):V1。
0一.外观结构说明(Structure Description)对刀器:备注:当低压指示灯亮的时候,表示电池电量快用完了,建议更换电池。
对刀器接收器:二.装箱配件说明(Packing Parts)1.接收器(Wireless Receiver):1只2.无线对刀器(Wireless Handle):1只3.说明书(Manual):1份三.直流电气特性(DC Description)注意: 无线对刀器采用3V纽扣锂电池工作,当低压指示灯亮的时候,表示电池电量快用完了,建议更换电池。
更换电池:用十字螺丝刀把对刀器底盖拆下来,然后更换电池,再安装上对刀器底盖。
四. 无线性能描述(RF Performance Description)五. 操作使用步骤说明(Use the steps Description)第1步:(Step 1)将对刀器接收器插入运动控制卡的DB15芯接口,另外一端通过DB15芯线连接上机床。
第2步:(Step 2)将系统中对刀块高度设定为38.27mm,将对刀器安装在机床上,并用螺丝固定对刀器(也可以不固定,用时将对刀器放于工件表面,)第4步:(Step 3)到此,安装已经完成,将对刀器电源开关拨动到开的位置;对刀器就开始工作,工作指示灯亮,启动机床,对刀,开始对刀工作。
当机床到达指定位置,对刀器会停止机床移动,完成对刀操作对刀完成后,进行首次误差修正,在当前对刀点,将Z轴降到工件表面,使刀尖刚好接触工件表面,记录当前工件坐标,比如当前工件坐标为0.05,则系统中的对刀块高度修改为38.27-0.05=38.22,再比如当前工件坐标-0.04,则系统中的对刀块高度修改为38.27-(-0.04)=38.31。
BSC介绍
BIE框
主控框(上框) 主控框(下框)
BM机柜配置
BM的主控框
0 1
2 3 4 5 6 7 8
9 10
11 12
13 14
15 16 17 18 19 20 21 22 23
24 25
P W C P W C
N N N O O O D D D
E M A
M P U M P U
N
E T
N E
L P N 7 L A P D
主机程序和数据的加载路径:
Flash Memory DRAM
程 序 数 据 C P U
由BAM直接向DRAM中加载程序和数 据; 由Flash Memory向DRAM中加载程序 和数据。
程序
MPU
数据
BAM
MPU开关
MPU板正面有2个拨码开 关: S1(8位拨码开关); S2(4位拨码开关)。
MPU开关——S1
SNT信令交换网板 完成各模块间控制信号和内信息的交换,并 提供主机向各个模块加载的通道,2块SNT 互为主备用
ALM告警板 负责各种机架内告警信号的采集与告警灯 的驱动输出
传输接口框
0 2 3 4 5 6 7 8 9 1 1 1 1 1 1 1 1 2 2 2 2 2 1 0 1 3 5 6 7 8 9 0 1 2 3 4 1 1 2 4 上 P E E E E E E E E 框 W 3 3 3 3 3 3 3 3 C M M M M M M M M 2 5 E E E E E E E E P 3 3 3 3 3 3 3 3 W M M M M M M M M C
CTN中心交换网板
CTN是AM/CM的中心话路交换系统 CTN占 2个槽位,跨2个机框 2块 CTN 互为主备用
SCALANCE X101-1 商品说明书
24 V
6GK5101-1BB00-2AA3 Page 1/4
06/28/2018
Subject to change without notice © Copyright Siemens
● at DC / maximum
Supply voltage, current consumption, power loss Supply voltage ● external ● external Type of voltage / of the supply voltage Product component / fusing at power supply input Fuse protection type / at input for supply voltage Consumed current ● maximum Power loss [W] ● at DC / at 24 V
Compact 40 mm 125 mm 124 mm 0.55 kg
Yes Yes Yes
No No
FM3611: Class 1, Divison 2, Group A, B, C, D / T.., Class 1, Zone 2, Group IIC, T.. EN 600079-15 II 3 G EEx nA II T.. KEMA 06 ATEX 0021 X
Yes
Yes Yes Yes Yes Yes No 134 y
/snst
/simatic-net https:// /industry/infocenter /bilddb /cax https://
Security information
UL 60950-1, CSA C22.2 No. 60950-1 UL 1604 and UL 2279-15 (Hazardous Location), Class 1 / Division 2 / Group A, B, C, D / T.., Class 1 / Zone 2 / Group IIC / T.. EN 61000-6-3 EN 61000-6-4:2001 EN 61000-6-2:2001, EN 61000-6-4:2001 Yes Yes Yes
ProductTypeList-optiMOS(20-250V)
N-Channel MOSFETs: OptiMOS™ (20V…250V) Product TypeProduct TypeBSN045NE2LSBSN011NE2LSBSN011NE2LSIBSN012N03LSBSN012N03LSIBSN048N03LSBSB012NE2LXBSB014N04LX3 GBSB015N04NX3 GBSB017N03LX3 GBSB012N03LX3 GBSB028N06NN3 GBSB044N08NN3 GBSB056N10NN3 GBSB013NE2LXIBSB008NE2LXBSB280N15NZ3 G BSB165N15NZ3 G BSB012NE2LXI BSF024N03LT3 G BSF050N03LQ3 G BSF030NE2LQ BSF134N10NJ3 G BSF110N06NT3 G BSF450NE7NH3 G BSF035NE2LQ IPB015N04L G IPB027N10N3 G IPB035N08N3 G IPB015N04N G IPB019N06L3 G IPB083N10N3 G IPB042N10N3 G IPB054N06N3 GIPB037N06N3 G IPB097N08N3 G IPB055N03L G IPB054N08N3 G IPB042N03L G IPB022N04L G IPB065N03L G IPB072N15N3 G IPB025N08N3 G IPB080N03L G IPB081N06L3 G IPB147N03L G IPB096N03L G IPB136N08N3 GIPB090N06N3 G IPB029N06N3 G IPB049NE7N3 G IPB031NE7N3 G IPB020NE7N3 G IPB123N10N3 G IPB038N12N3 G IPB144N12N3 G IPB320N20N3 G IPB107N20N3 G IPB200N25N3 G IPB600N25N3 G BUZ32 H3045A BUZ31 H3045A IPB108N15N3 G BUZ30A H3045AIPB107N20NA IPB057N06N IPB026N06N IPB230N06L3 G IPB067N08N3 G IPB034N03L G IPB009N03L G IPB011N04L G IPB011N04N G IPB016N06L3 G IPB017N06N3 G IPB019N08N3 G IPB020N04N G IPB025N10N3 G IPB030N08N3 GIPB036N12N3 G IPB065N15N3 G IPB010N06NIPB014N06NSPD07N20 GIPD031N06L3 G IPD034N06N3 G IPD035N06L3 G IPD036N04L GIPD038N06N3 G IPD048N06L3 G IPD053N08N3 G SPD50N03S2L-06 G SPD30N03S2L-07 G IPD068N10N3 G SPD50N03S2-07 GIPD082N10N3 G IPD088N06N3 G IPD096N08N3 G SPD30N03S2L-10 G IPD127N06L GIPD135N08N3 G IPD160N04L GIPD170N04N GIPD200N15N3 G SPD30N03S2L-20 G IPD220N06L3 G IPD25CN10N GIPD250N06N3 G IPD33CN10N GIPD350N06L GIPD640N06L G IPD78CN10N G IPD800N06N G IPD122N10N3 G IPD180N10N3 G IPD110N12N3 G IPD031N03L G IPD040N03L G IPD050N03L G IPD060N03L G IPD075N03L G IPD090N03L G IPD320N20N3 G IPD600N25N3 G IPD530N15N3 G IPD105N03L G IPD135N03L GIPD025N06N IPD053N06N IPI023NE7N3 G IPI034NE7N3 G IPI052NE7N3 G IPI126N10N3 G IPI180N10N3 G IPI041N12N3 G IPI076N12N3 G IPI147N12N3 G IPI045N10N3 G IPI086N10N3 G IPI030N10N3 G IPI04CN10N G IPI072N10N3 G IPI26CN10N G IPI35CN10N 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BSZ042N06NS BSZ023N04LS BSZ150N10LS3 G BSO615N GBSO033N03MS GBSO083N03MS G BSO110N03MS G BSO330N02K G BSO150N03MD G BSO220N03MD G BSC010NE2LS BSC050NE2LS BSC046N02KS G BSC019N02KS G BSC014N03LS G BSC016N03LS G BSC014N03MS G BSC016N04LS G BSC016N03MS G BSC017N04NS G BSC018N04LS GBSC020N03MS G BSC020N03LS G BSC025N03MS G BSC027N04LS G BSC025N03LS G BSC028N06LS3 G BSC030N03MS G BSC030N04NS G BSC030N03LS G BSC031N06NS3 G BSC034N03LS G BSC035N04LS G BSC042N03MS G BSC042N03LS GBSC050N03MS G BSC050N04LS G BSC050N03LS G BSC054N04NS G BSC057N03MS G BSC057N03LS G BSC057N08NS3 G BSC059N04LS G BSC060N10NS3 G BSC067N06LS3 G BSC076N06NS3 G BSC079N10NS GBSC080N03LS G BSC082N10LS G BSC090N03MS G BSC090N03LS G BSC093N04LS G BSC100N03MS G BSC100N10NSF G BSC100N06LS3 G BSC105N10LSF G BSC110N06NS3 G BSC118N10NS G BSC120N03MS G BSC120N03LS GBSC123N10LS G BSC152N10NSF G BSC190N15NS3 G BSC159N10LSF G BSC196N10NS G BSC205N10LS G BSC252N10NSF G BSC265N10LSF G BSC340N08NS3 G BSC042NE7NS3 G BSC160N10NS3 G BSC440N10NS3 G BSC077N12NS3 G BSC190N12NS3 G BSC520N15NS3 GBSC600N25NS3 G BSC026N02KS G BSC070N10NS3 G BSC109N10NS3 G BSC0909NSBSC360N15NS3 G BSC0908NSBSC240N12NS3 G BSC900N20NS3 G BSC12DN20NS3 G BSC16DN25NS3 G BSC22DN20NS3 G BSC018NE2LS BSC024NE2LS BSC011N03LS BSC052N03LSBSC0902NSBSC032NE2LS BSC0901NSIBSC0904NSIBSC010NE2LSI BSC0902NSIBSC014NE2LSI BSC018NE2LSI BSC011N03LSI BSC0906NSBSC009NE2LS BSC036NE7NS3 G BSC046N10NS3 G BSC028N06NS BSC010N04LSI BSC014N04LS BSC014N04LSIBSC039N06NS BSC014N06NS BSC010N04LS BSC500N20NS3 G BSC022N04LS BSC072N03LD G BSC150N03LD G BSC750N10ND G IPP023NE7N3 G IPP034NE7N3 G IPP052NE7N3 G BUZ31L HBUZ73 HBUZ73A HBUZ73AL HBUZ73L HIPP180N10N3 G IPP041N12N3 G IPP048N12N3 G IPP076N12N3 G IPP114N12N3 G IPP147N12N3 G IPP030N10N3 G IPP045N10N3 G IPP04CN10N G IPP05CN10N G IPP072N10N3 G IPP086N10N3 G IPP12CN10L G IPP16CN10N G IPP075N15N3 G IPP200N15N3 G IPP034N03L GIPP055N03L G IPP065N03L G IPP080N03L G IPP096N03L G IPP114N03L G IPP015N04N G IPP023N04N G IPP039N04L G IPP041N04N G IPP024N06N3 G IPP032N06N3 G IPP037N06L3 G IPP040N06N3 G IPP052N06L3 G IPP057N06N3 G IPP084N06L3 G IPP093N06N3 GIPP028N08N3 G IPP037N08N3 G IPP057N08N3 G IPP070N08N3 G IPP100N08N3 G IPP139N08N3 G IPP320N20N3 G IPP110N20N3 G IPP200N25N3 G IPP600N25N3 G BUZ31 HBUZ32 HIPP111N15N3 G BUZ30A HIPP065N04N G IPP530N15N3 GIPP048N04N G IPP110N20NA IPP147N03L G IPP029N06N IPP020N06N IPP040N06N IPP060N06N IPA028N08N3 G IPA037N08N3 G IPA057N08N3 G IPA100N08N3 G IPA045N10N3 G IPA086N10N3 G IPA126N10N3 G IPA180N10N3 G IPA030N10N3 GIPA105N15N3 G IPA032N06N3 G IPA057N06N3 G IPA093N06N3 G IPT004N03L IPT007N06N IPT020N10N3 IPT059N15N3Datasheet Group Product Status /dgdl/BSN045NE2LS_rev1.0.pdf?fBlade 3x3 (USON-6)in production olderId=db3a304313b8b5a60113cee8763b02d7&fileId=db3a30433d68e984013d7ca959855780/dgdl/BSN011NE2LS_rev1.3.pdf?fBlade 3x3 (USON-6)in production olderId=db3a304313b8b5a60113cee8763b02d7&fileId=db3a30433d68e984013d7cbfeef05815Blade 3x3 (USON-6)in production 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Datasheet MLX90614 中文 数据手册 rev008
10-位 PWM 输出模式是连续输出所测物体温度的标准配置,测量物体的温度范围为-20…120 °C,分辨 率为 0.14 °C。PWM 通过修改 EEPROM 内 2 个单元的值,实际上可以根据需求调整至任何温度范围,而这对 出厂校准结果并无影响。
传感器的测量结果均出厂校准化,数据接口为数字式的 PWM 和 SMBus(System Management Bus) 输出。
作为标准,PWM 为 10 位,且配置为-20˚C 至 120 ˚C 内,分辨率为 0.14 ˚C 的连续输出。
传感器出厂默认,上电复位时为 SMBus 通信。
3901090614 Rev 008
PWM 引脚也可配置为热继电器(输入是 To),这样可以实现简单且性价比高的恒温控制器或温度报警(冰 点/沸点)应用,其中的温度临界值是用户可编程的。在 SMBus 系统里,这个功能可以作为处理器的中断信号, 以此触发读取主线上从动器的值,并确定精度条件。
传感器有两种供电电压选择:5V 或 3V(电池供电)。其中,5V 也可简便的从更高供电电压(例如 8 至 16V)上通过外接元件调制。(具体请参考“应用信息”)
MLX90614 connection to SMBus
图 1: 典型应用电路
2 概述
MLX90614 是一款用于非接触式的红外温度传感器,集成 了红外探测热电堆芯片与信号处理专用集成芯片,全部封装 在 TO-39。
低噪声放大器、17 位 ADC 和强大的 DSP 处理单元的全 集成,使传感器实现了高精度,高分辨率的测量。
创维高压包型号代换物料编号查询表
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140V29旧(051209-00通用)5100-051409-01CRT-高压包29"5D20/5D26(JF2801-2802A)-停产5100-051409-02CRT-高压包29"140V5P10/5P20/5P21(JF0501-2112)(051405-00通用)5100-051409-05CRT-高压包29"5S01/5S10(BSC25-2606S)-停产5100-051409-11CRT-高压包29"5D60(BSC27-0501Q)5100-051409-15CRT-高压包29"5D60/5D66(BSC29-0162E)–停产物料5100-051409-16CRT-高压包29"(6174Z-6005T)5100-051409-28CRT-高压包29"5N10/5N20(JF0101-2708)5100-051409-30CRT-高压包29"5Y30(JF0101-2709)5100-051409-32CRT-高压包29"5P10/5P20(JF0101-2713)5100-051409-35CRT-高压包29"5M10/5M18(JF29-03R)-停产5100-051409-36CRT-高压包29"5P30单聚集(BSC29-0154C)5100-051409-40CRT-高压包29"140V5I01(JF2801-2811)-停产5100-051409-45CRT-高压包29"5I01(JF2801-2811A)5100-051409-46CRT-高压包29"5P30(JF0101-2729)(051409-36通用)-停产5100-051409-50CRT-高压包29"5I30(BSC29-0104A)5100-051409-51CRT-高压包29"5T36(BSC25-N0838)5100-051409-52CRT-高压包29"6T18(BSC29-0156W)–停产物料5100-051409-54CRT-高压包29"(BSC29-0119R)5100-051409-55CRT-高压包29"(BSC29-3935M)5100-051409-56CRT-高压包29"6P18/29T92ht(BSC29-3807-35)5100-051409-61CRT-高压包29D98HT/6D85(BSC29-0131T)(051459-01通用)5100-051425-00CRT-高压包25"通用(BSC27-0123S)-停产5100-051429-11CRT-高压包29"5D20/5D26(通用1429-10)(BSC29-0172B)5100-051429-13CRT-高压包29"5D76(BSC29-0104C)5100-051429-15CRT-高压包29"5D01单聚焦(BSC29-0102C)5100-051429-18CRT-高压包29"6D72(BSC29-0141Z)5100-051429-24CRT-高压包29"6P30(BSC29-3807-22)5100-051431-00CRT-高压包31"通用(BSC29-0107W)–停产物料5100-051432-01CRT-高压包32"(BSC29-3807-17)5100-051432-02CRT-高压包32"6T19(BSC29-0115Q)5100-051434-00CRT-高压包34"5D01/5D10(JF2801-2806)-停产5100-051434-04CRT-高压包34"140V5M10(BSC30-5540)–停产物料5100-051434-13CRT-高压包34"5P10/5P21/5P20(BSC25-2603S)-停产物料5100-051434-18CRT-高压包34"5P21双聚焦(JF0101-2725)-停产5100-051434-26CRT-高压包34"5P30(BSC29-0170C)(行变后通用051434-34)5100-051434-31CRT-高压包34"5D20/5D25(051434-20/1434-25/1434-27/1434-29/051434-37通用)BSC29-0187E)5100-051434-34CRT-高压包34SP/5P30(BSC29-0172E)-停产5100-051434-40CRT-高压包34TPHD/6M20(BSC29-0184T)5100-051438-01CRT-高压包38"140V5N10/5P01/5P03/5S01(BSC29-0194S)5100-051452-00CRT-高压包BSC29-0120Z(实际是三和厂家5132-051452-005100-051454-03CRT-高压包34"5D20/5D26(JF2801-2802E)5100-051455-05CRT-高压包25"6D91/6D92(BSC27-0122W)5100-051459-00CRT-高压包 25"/29"140V 5T02/5T105100-051459-01CRT-高压包29"6D50(BSC28-N2371)(051459-02通用)5100-051459-04CRT-高压包29"(BSC29-0135X)5100-051502-00CRT-高压包32D98HP/6D66(051402-00通用)5131-051402-00CRT-高压包32"(BSC30)5131-051452-00CRT-高压包29D18HT/6D66(银洋厂家生产,实物编号5100-051452-00)机芯行包型号高频头公司编号/基本电性能描述4A01/02/ 5101-051101-00 5200-380653-005A01(25寸)5101-051405-015A01(29寸)5100-051029-005K01 5101-051409-015D01(29寸)5100-051406-01 5200-380WO5-005D01(34寸)5100-051434-005D01(38寸)5100-051429-005D20(25/ 5100-051429-11 5200-380W18-0026/29寸)5100-051429-105D20(34寸)5100-051434-205D25(34寸)5100-051434-275100-051434-315D26(34寸)5100-051454-035D28 510-051309-16 5200-380W18-105D60 PHILPS 5100-051409-06 5200-380W10-005D60 LG 5100-051409-155D66 5100-051409-15 5200-380W08-005D70 5100-051309-07 5200-380W23-005D90 5100-051309-116D72 5100-051209-136D72 5100-051429-186D72 5100-051434-00 5200-380W20-006D72 5100-051434-395D75 5100-051309-055D76 5100-051429-135D76 5100-051309-206D91 5109-051309-33 5200-380W19-11 6D92 5100-051309-326D92 5100-051434-416D92 5100-051455-056D95 5100-051309-296D96 5100-051209-186D96 5100-051234-006D96 5109-051209-163I30 5100-051101-093P10 5100-051120-003P20 5100-051120-003P21 5100-051120-003P30 5100-051101-113P30 5100-051101-043P30 5100-051101-134P01 5101-051101-004P02 5100-051101-004P30 5100-051101-064P30 5109-051405-034P36 5100-051309-275P30(29寸)5100-051409-465P30(34寸)5100-051434-265P30 5100-051409-365P30 5100-051434-343Y20(21寸)5100-051100-003Y20(14寸)5100-050014-003Y01(14寸)5100-050014-003Y01(21寸)5100-051100-005I30 5100-051409-505M18 5100-051409-355M10 5100-051409-355N10(25寸)5100-051025-005N10(29寸)5100-051409-285N10(34寸)5100-051403-005N10(38寸)5100-051438-005N20(25寸)5100-051025-005N20(29寸)5100-051029-005N20(34寸)5100-051403-005N20(38寸)5100-051038-005N28(29寸)5100-051029-005N28(34寸)5100-051403-004N10 5100-051101-004N01 5100-051101-00 5200-380W11-00 3N01(14“)5100-050014-003N01(21”)5100-051101-003N20 5100-051100-203N10(14寸)5100-050014-003N10(21寸)5100-051100-204N02 5100-051101-004N03 5100-051101-005N01(25”)5100-050025-005N01(29“)5100-051029-005N01(34”)5100-051034-005S10 5100-051409-055Y01 5100-051025-005Y30(25寸)5100-051405-045Y30(29寸)5100-051405-045Y21(25寸)5100-051405-045Y21(29寸)5100-051209-034Y01 5100-051101-005M01(29寸)5100-051409-305M01(34寸)5100-051434-085M20 5100-051850-015M21 5100-051850-016M20 5100-051850-016M21 5100-051850-013I01 5100-050901-01 5200-380W07-005I01(29“)5100-051409-455I01(34”)5100-051434-155P01(25“)5100-050025-005P01(29”)5100-050029-005P01(34“)5100-051403-005P01(38”)5100-051438-003P01(14”)5100-050014-003P01(20“)5101-051100-003P10(14”)5100-050501-003P10(21“)5100-051120-004P10 5100-051101-005P03(25”)5100-050025-005P03(29“)5100-051029-005P03(34”)5100-051403-005P03(38“)5100-051438-005P10(25“)5100-051405-005P10(29”)5100-051409-025P10(34“)5100-051434-135P20(25”)5100-051405-005P20(29“)5100-051409-025P20(34”)5100-051434-135P21(25“)5100-051405-005P21(29”)5100-051409-025P21(34“)5100-051434-135P36 5100-51409-38 5200-380W29-01 5P21(29“)5100-051409-025P21(34”)5100-051434-135P30 (29”) 5109-051309-274S01 5101-051101-004S02 5100-051101-004S10 5101-051100-003S30 5100-051101-063S28 5100-051101-065S01(25“)5100-051025-05 5S01(29”)5100-051409-035S01(34“)5100-051434-035S01(38”)5100-051438-003S30 5100-051100-063S01(14”)5100-050014-003S01(14“)5101-051100-003S02 5100-050014-005S01(25”)5100-051405-005S28(25”)5100-051305-00 5200-380W25-00/D/KWORLD5S28(29“)5100-051209-045S30 5100-051305-003T20(14寸)5100-050014-003T20(21寸)5101-051100-003T21 5101-051100-003T30 5100-051101-053T36 5100-051101-154T01 5100-051101-004T30 5100-051405-104T36 5100-051409-514T36 5100-051305-065T03(25“)5100-051025-005T03(29”)5100-051029-005T02 5100-051459-005T10(25寸)5100-051459-005T10(29寸)5100-051029-005T21(29寸)5100-051229-005T20 5100-051229-005T25(25寸)5100-051229-005T25(29寸)5100-051229-055T25(34寸)5100-051134-005T26 5100-051229-005T28(295T30(25”)5100-051405-10 5200-380W24-005T30(29“)5100-051309-135T30(34”)5100-051434-385T32 5100-051309-145T30 5100-051334-005T36 LG 5100-051309-175T36 三星 5100-051334-02。
BSC090N03LS G中文资料
ValueUnit 48ABSC090N03LS GMaximum ratings, at T j=25 °C, unless otherwise specifiedParameter Symbol Conditions Unit Power dissipation P tot T C=25 °C32WT A=25 °C,R thJA=50 K/W2)2.5Operating and storage temperature T j, T stg-55 ... 150°C IEC climatic category; DIN IEC 68-155/150/56Parameter Symbol Conditions Unitmin.typ.max. Thermal characteristicsThermal resistance, junction - case R thJC bottom-- 3.9K/Wtop--20Device on PCB R thJA 6 cm2 cooling area2)--50 Electrical characteristics, at T j=25 °C, unless otherwise specifiedStatic characteristicsDrain-source breakdown voltage V(BR)DSS V GS=0 V, I D=1 mA30--V Gate threshold voltage V GS(th)V DS=V GS, I D=250 µA1- 2.2Zero gate voltage drain current I DSS V DS=30 V, V GS=0 V,T j=25 °C-0.11µAV DS=30 V, V GS=0 V,T j=125 °C-10100Gate-source leakage current I GSS V GS=20 V, V DS=0 V-10100nA Drain-source on-state resistance R DS(on)V GS=4.5 V, I D=30 A-10.613.3mΩV GS=10 V, I D=30 A-7.59Gate resistance R G0.5 1.0 1.8ΩTransconductance g fs |V DS|>2|I D|R DS(on)max,I D=30 A2856-SValueValues2) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drainBSC090N03LS GParameter Symbol Conditions Unitmin.typ.max. Dynamic characteristicsInput capacitance C iss-11001500pF Output capacitance C oss-460610 Reverse transfer capacitance C rss-22-Turn-on delay time t d(on)- 3.1-ns Rise time t r- 2.6-Turn-off delay time t d(off)-14-Fall time t f- 2.4-Gate Charge Characteristics5)Gate to source charge Q gs- 3.7 4.9nC Gate charge at threshold Q g(th)- 1.7 2.3Gate to drain charge Q gd- 1.6 2.7 Switching charge Q sw- 3.6 5.3Gate charge total Q g- 6.78.9Gate plateau voltage V plateau- 3.4-VGate charge total Q g V DD=15 V, I D=30 A,V GS=0 to 10 V-1418Gate charge total, sync. FET Q g(sync)V DS=0.1 V,V GS=0 to 4.5 V-67.7nCOutput charge Q oss V DD=15 V, V GS=0 V-1216 Reverse DiodeDiode continuous forward current I S--29A Diode pulse current I S,pulse--192Diode forward voltage V SD V GS=0 V, I F=30 A,T j=25 °C-0.89 1.1VReverse recovery charge Q rr V R=15 V, I F=I S,d i F/d t=400 A/µs--10nC T C=25 °CValuesV GS=0 V, V DS=15 V,f=1 MHzV DD=15 V, V GS=10 V,I D=30 A, R G=1.6 ΩV DD=15 V, I D=30 A,V GS=0 to 4.5 VBSC090N03LS G Package Outline PG-TDSON-8PG-TDSON-8: OutlineFootprintBSC090N03LS G Package OutlinePG-TDSON-8: TapeBSC090N03LS GPublished byInfineon Technologies AG81726 Munich, Germany© 2008 Infineon Technologies AGAll Rights Reserved.Legal DisclaimerThe information given in this document shall in no event be regarded as a guarantee ofconditions or characteristics. With respect to any examples or hints given herein, any typicalvalues stated herein and/or any information regarding the application of the device,Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind,including without limitation, warranties of non-infringement of intellectual property rightsof any third party.InformationFor further information on technology, delivery terms and conditions and prices, pleasecontact the nearest Infineon Technologies Office().WarningsDue to technical requirements, components may contain dangerous substances. For informationon the types in question, please contact the nearest Infineon Technologies Office.Infineon Technologies components may be used in life-support devices or systems only withthe express written approval of Infineon Technologies, if a failure of such components canreasonably be expected to cause the failure of that life-support device or system or to affectthe safety or effectiveness of that device or system. Life support devices or systems areintended to be implanted in the human body or to support and/or maintain and sustain。
GSM BSS工程师MSCBSC
1. BSC和XCDR每个机架的工作电压是-48v or 27v,工作电流是50A,最大电流是63A ,正常消耗功率是1500W,最大消耗功率是2400W。
KSW/TSW:时隙交换处理。移动通信,通信工程师的家园,通信人才,求职招聘,网络优化,通信工程,出差住宿,通信企业黑名单8q(p!w+@:F2R
MSI:提供与外界联系接口。
)R6U.c(v(p#U'k#H-Xmscbsc 移动通信论坛拥有30万通信专业人员,超过50万份GSM/3G等通信技术资料,是国内领先专注于通信技术和通信人生活的社区。XCDR/GDP:提供信令信道,64K与13K语音信号的处理。"P8H-Q$~#T5a
LANX 局域网连接,相当于网卡
3J-e+s9C/p;G/|,X0c%P5iMSCBSC 移动通信论坛PIX 用户外部告警接口mscbsc 移动通信论坛拥有30万通信专业人员,超过50万份GSM/3G等通信技术资料,是国内领先专注于通信技术和通信人生活的社区。4J.P9A'~9i2n3r;}
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11. 在新的BSC安装时,上电测试前须做那些准备工作?MSCBSC 移动通信论坛"d$X+G8{0r8a9o%N4O
测试输入电压-40 to –72V;检查连接机柜的地线要符合要求;所有开头位置在OFF状态,所有全尺寸板开关全部打到Disable状态,半尺寸板全部抜出;检查机柜里是否有金属之类的东西在板子之间,防止引起短路.mscbsc 移动通信论坛拥有30万通信专业人员,超过50万份GSM/3G等通信技术资料,是国内领先专注于通信技术和通信人生活的社区。5S-q;Q7\0g!f6o%D
BSC数据配-数据配置基础知识(PDF 67页)
配置 BSC 数据的设定应该遵循从全局到局部的原则。BSC 的数据配置可分为 AM/CM 数据、BM 数据两大块。在每一块中,又遵循模块→机架→机框→单板→系 统资源的配置顺序,如图 B-1所示。
GSM-R 基站控制器 数据配置手册 初始配置分册
目录
目录
附录 B 数据配置基础知识 ........................................................................................................ B-1 B.1 BSC 数据 ........................................................................................................................... B-1 B.1.1 配置原则与流程 ...................................................................................................... B-1 B.1.2 编号原则................................................................................................................. B-2 B.1.3 AM/CM 数据配置..................................................................................................... B-4 B.1.4 BM 数据配置 ........................................................................................................... B-6 B.2 时钟系统 ......................................................................................................................... B-10 B.3 A 接口中继与信令 ............................................................................................................ B-12 B.4 基站组网 ......................................................................................................................... B-13 B.4.1 编号原则............................................................................................................... B-13 B.4.2 BIE 介绍 ................................................................................................................ B-14 B.4.3 星型组网............................................................................................................... B-17 B.4.4 链型组网............................................................................................................... B-23 B.4.5 树型组网............................................................................................................... B-45 B.4.6 半速率组网 ........................................................................................................... B-46 B.4.7 环型组网............................................................................................................... B-49
诺基亚基站设备参数说明
2GSM无线参数调整空页3GSM无线参数调整目录1. 前言 (11)2. 本文的研究内容 (14)3. BSC参数 (15)3.1 BSC呼叫号 (15)3.2 由于BTS机房后备电源引起的强制切换定时器 (15)3.3 DCS宏蜂窝门限 (15)3.4 DCS微蜂窝门限 (15)3.5 被叫用户特别早指配允许 (15)3.6 呼叫重建过程中特别早指配允许 (17)3.7 紧急呼叫过程中特别早指配允许 (18)3.8 主叫用户特别早指配允许 (20)3.9 GSM宏蜂窝门限 (21)3.10 GSM微蜂窝门限 (22)3.11 由于下行干扰引起切换的优先顺序 (22)3.12 由于上行干扰引起切换的优先顺序 (23)3.13 BSC全速率TCH资源的下限 (24)3.14 移动台距离处理 (25)3.15 预选小区数 (27)3.16 优先级 (28)3.17 用户类型 (28)3.18 切换时的TCH类型 (28)3.19 BSC全速率TCH资源的上限 (30)4. 移动分配频率表 (31)4.1 频率 (31)4.2 移动分配频率表识别 (32)4GSM无线参数调整4.3 BCCH频率表类型 (32)5. BCCH分配频率表 (33)5.1 频率 (33)5.2 BCCH频率表识别 (34)5.3 BCCH频率表类型 (34)6. BTS参数 (35)6.1 管理状态 (35)6.2 IMSI结合和分离允许 (35)6.3 平均周期 (36)6.4 备用的BTS色码 (37)6.5 备用的BTS跳频模式 (37)6.6 备用的跳频序列号1 (37)6.7 备用的跳频序列号2 (37)6.8 备用的MAIO偏置 (38)6.9 备用的移动分配频率表 (38)6.10 备用的网络色码 (38)6.11 对于激活MS的BCCH分配应用 (38)6.12 干扰带边界1~4 (39)6.13 基站色码 (40)6.14 BTS识别 (41)6.15 BTS跳频模式 (42)6.16 BTS负荷门限 (43)6.17 BTS测量平均周期 (44)6.18 BTS名称 (45)6.19 呼叫重建允许 (45)6.20 小区禁止限制 (46)6.21 小区接入禁止 (49)6.22 小区识别 (50)6.23 小区重选滞后 (51)6.24 小区重选偏置 (53)6.25 小区重选参数指示 (54)6.26 小区类型 (55)5GSM无线参数调整6.27 载噪比门限 (55)6.28 直接重试 (55)6.29 非连续发送 (56)6.30 双频小区 (57)6.31 早送指示 (57)6.32 紧急呼叫限制 (58)6.33 应用的频率段 (59)6.34 跳频序列号1 (59)6.35 跳频序列号2 (61)6.36 对空闲状态MS的BCCH频率表标识 (62)6.37 智能直接从事 (63)6.38 空闲TCH限制 (63)6.39 位置区码 (64)6.40 全速率TCH资源的下限 (65)6.41 移动分配索引偏置 (66)6.42 最大重复次数 (67)6.43 最大重发次数 (68)6.44 最大队列长度 (69)6.45 定向重试的最大时限 (71)6.46 定向重试的最小时限 (72)6.47 移动分配频率表 (73)6.48 移动国家号 (73)6.49 移动网号 (74)6.50 呼叫建立过程中移动台的最大距离 (76)6.51 移动台优先级应用 (77)6.52 移动台最大发射功率 (78)6.53 控制信道最大功率电平 (79)6.54 移动台最小发射功率 (81)6.55 多频段指示 (82)6.56 网络色码 (83)6.57 新建原因指示 (84)6.58 不允许接入的等级 (85)6.59 接入准许保留块数 (87)6GSM无线参数调整6.60 寻呼信道复帧数 (88)6.61 发送分布时隙数 (90)6.62 仅保留给优先用户的业务信道数 (92)6.63 惩罚时间 (92)6.64 允许的网络色码 (94)6.65 功率偏置 (95)6.66 排队优先级应用 (95)6.67 呼叫原因指配请求的排队优先级 (97)6.68 一般切换原因指配请求的排队优先级 (98)6.69 紧急切换原因指配请求的排队优先级 (99)6.70 无线链路超时 (100)6.71 半径扩展 (101)6.72 用于干线预留的保留方式 (101)6.73 优先信道对切换接入的限制应用 (101)6.74 允许接入的最小接收电平 (102)6.75 广播短消息允许 (103)6.76 干线保留门限表识别 (104)6.77 小区内切换时的TCH类型 (104)6.78 临时配置 (105)6.79 呼叫时间限制 (106)6.80 切换时间限制 (107)6.81 周期位置更新定时器 (108)6.82 业务类型 (109)6.83 干线保留算法应用 (110)6.84 TCH分配过程中的TRX优先级 (110)6.85 BTS全速率TCH资源的上限 (110)7. 邻区参数 (112)7.1 邻小区识别 (112)7.2 相邻小区层 (114)7.3 后备BCCH频率 (114)7.4 后备BTS色码 (114)7.5 后备网络色码 (115)7GSM无线参数调整7.6 BCCH频率 (115)7.7 BTS色码 (116)7.8 参考小区的小区识别 (116)7.9 小区类型 (117)7.10 链接相邻小区 (117)7.11 载干比估算加权 (117)7.12 信号电平与信号质量的切换边界 (117)7.13 快速移动门限 (117)7.14 切换负荷因子 (118)7.15 切换优先级 (118)7.16 切入伞形邻区的最低电平 (118)7.17 信号电平的切换边界 (118)7.18 功率预算的切换边界 (118)7.19 信号质量的切换边界 (119)7.20 切换目标区 (119)7.21 电平调整 (119)7.22 参考小区的位置区码 (119)7.23 移动台最佳功率电平 (119)7.24 邻区的移动台最大发射功率 (120)7.25 邻区网络色码 (120)7.26 允许切入的最小邻区接收电平 (120)7.27 同步 (121)7.28 业务原因切换的目标电平 (121)8. 切换控制参数 (123)8.1 邻区均化窗口尺寸 (123)8.2 所有邻小区平均 (124)8.3 所有干扰小区平均 (124)8.4 载干比估算方法 (124)8.5 连续快速超越门限场强的计数 (124)8.6 启用快速平均呼叫建立 (124)8.7 启用快速平均切换 (125)8.8 启用快速平均功率控制 (125)8GSM无线参数调整8.9 启用由于上行干扰引起的小区内切换 (125)8.10 启用由于下行干扰引起的小区内切换 (126)8.11 启用移动台距离处理过程 (127)8.12 启用功率预算切换 (128)8.13 启用SDCCH信道上的切换 (129)8.14 启用TCH指配超级IUO (130)8.15 允许伞状切换 (131)8.16 功率预算切换的间隔时间 (131)8.17 伞状切换的间隔时间 (132)8.18 干扰小区平均窗口尺寸 (132)8.19 干扰小区可忽略的0结果数目 (132)8.20 下行接收电平平均的窗口尺寸、权值 (132)8.21 上行接收电平平均的窗口尺寸、权值 (132)8.22 分段的载干比低限 (133)8.23 速度低限 (133)8.24 连续切换间的最小间隔时间 (134)8.25 不成功的切换请求的最小间隔 (135)8.26 从普通TRX到超级TRX切换的最小时间间隔 (136)8.27 不成功的IUO切换间的最小时间间隔 (136)8.28 最小的BSIC译码时间 (136)8.29 移动台距离平均窗口尺寸 (136)8.30 由于移动台距离原因引起的切换至扩展小区的最大门限 (137)8.31 移动台距离原因由扩展小区切换到普通小区的切换最低门限 (137)8.32 ms距离参数 (138)8.33 移动台速度平均 (139)8.34 移动台速度门限nx (139)8.35 移动台速度门限 (139)8.36 0结果数 (139)8.37 分段的优先调整步骤 (139)8.38 下行质量平均窗口尺寸、权值 (140)8.39 上行质量平均窗口尺寸、权值 (140)8.40 超级重用最低载干比门限 (140)8.41 超级重用估算方法 (140)9GSM无线参数调整8.42 超级重用最佳载干比门限 (140)8.43 下行接收干扰电平门限 (141)8.44 上行接收干扰电平门限 (141)8.45 下行接收电平门限 (141)8.46 threshold level uplink for rapid field drop(RPD)。
实创兴SEW270模块用户技术手册V2.0
2
SEW270 WCDMA 模块
前言
概述
本文档适用的产品是:实创兴 SEW270 模块。本文档通过对 SEW270 模块的介绍,用以指导用户 对该模块进行硬件设计并获取软件技术支持,并在该模块基础上更方便快捷的进行各种终端无线产品 的设计。
阅读对象
本文档主要适用于以下工程师: � � � � � 系统设计工程师 结构工程师 硬件工程师 软件工程师 测试工程师
内容简介
本文档包含 5 章,内容如下: 章节 1 概述 2 产品介绍 3 引脚描述 4 硬件接口描述 5 结构 内容 介绍 SEW270 模块的基本技术规格、参考涉及的相关文档和缩略语。 简要介绍 SEW270 模块的电路原理图和应用方框图。 介绍 SEW270 模块引脚名称和功能。 介绍 SEW270 模块各部分的硬件接口参考设计。 介绍 SEW270 模块的外观图、装配图、天线连接器规格和模块固定方式。
侵权必究。 实创兴电子保留修改本手册技术参数及规格的权力,对本手册中的印刷错误及与最新资料不符之处我 们 会及时改进。所有这些改动不再事先通知,但会编入新版手册中。 实创兴电子拥有本手册的最终解释权。
1
SEW270 WCDMA 模块
实创兴是国内领先的移动通讯企业,以数据卡、移动手持终端、无线通讯模块解决方案为主营业务, 可为 WCDMA/EDGE/cdma2000 等通讯模块用户提供技术支持。 实创兴电子为客户提供现场、电话、网站、即时通讯、E-MAIL 等多种支持方式。 实创兴电子网站 ,提供相关的行业信息和模块相关技术资料。 全国技术支持您想获得实创兴电子产品的技术支持信息,您可以进入在线帮助,通过网络的方式与技 术支持进行交流。如有疑问可发送邮件至 support_Module@ 来获得技术支持。 技术支持热(2012-07-28) 第一次正式发布。 V2.0(2012-9-8) 修改 UIM 卡接口电路,修改模块复位功能实现方式,更新规格参数表。
BSCC-N2仪表操作说明书
仪表说明书 中诺一、简介:该仪表采用24位A/D转换器,与各类传感器、变送器配合,实现对压力、流量、物位、成份分析以及力和机械量等物理参数的测量、显示、报警监控、数据采集和记录。
“SET”键:设置键 “>”键:移位键或去皮键(峰值仪表)“∧”键:上升键“CLR”键:峰值清零键或去皮键(上下限仪表)1.按“SET”键三秒以上显示“SAL”可进行OUT1继电器设置,再按“SET”键显示“SPL”,这时可设置OUT1的偏差。
偏差解释当SPL=0时如果当前显示值>SAL,则OUT1吸合;如果当前显示值<SAL,则OUT1释放。
当SPL≠0时如果当前显示值>SAL+SPL,则OUT1吸合;如果当前显示值<SAL—SPL,则OUT1释放。
2.按“SET”键显示“SAH”, 可进行OUT2继电器设置,再按“SET”键显示“SPH”可设置OUT2的偏差,设置方法同上。
3.按“SET”键显示“CIN”,表示输入密码,密码错误自动退出(出厂时密码为“00000”)。
密码正确后,如不更换密码按“SET”键进入下一步,如更换密码,按“CLR”键显示“CON”,输入5位数字可作为新的密码,按“SET”键可进入下一步。
4.按“SET”键显示“SL”,不加负载,可进行零点标定5.按“SET”键显示“SH”,可进行加载标定,加上负载(至少满量程一半),输入对应的显示值后。
6.按“SET”键出现“Sd”时,这时表示调节小数点设置,按上升键可改变小数点的设置,7.按“SET”键显示“Id”可设置仪表的分度值;8.按“SET”键显示“CLTF”可对去皮键选择,当“CLTF”为0时按“CLR”键可对仪表去皮,当为1时按“CLR”不可对仪表去皮;9.按“SET”键显示“FIL”可设置重量滤波程度,该程度可选择1~9,值越大,显示越慢,此值影响稳定度标志,值越大,稳定标志也越慢。
在按“SET”键回到工作状态。
MOTO摩托罗拉BSCBSSoverview系统设备硬件简介
MMI_RAM_0115-->del_nei <cell_id> <cell_id>
21:加载频设备 MMI_RAM_0115-->equip 站号 dri 载频识别号
3 CAGE BSC 光纤连接图
BSC/XCDR操作常用指令
基本指令
1:显示当前BSC下所有BTS的状态
MMI_RAM_0115-->state 0 site * * 2:显示当前BSC下所有BTS的信令链路RSL的状态
MMI_RAM_0115-->state 0 rsl * *
3:显示当前BSC或BTS下所有MMS的状态 MMI_RAM_0115-->state 0 mms * * MMI_RAM_0115--> state 站号 mms * *
BTC
总线终端板(BTC)不参与BSC/RXCDR的具体工作,它的作用是背板总 线阻容适配,保持总线的稳定,防止总线上引入干扰,影响BSC/RXCDR正 常工作。 每个机箱应配两块BTC板,分别放在左边第一个和右边第一个槽位。
GCLK
GCLK产生基站需要的所有定时参考 信号,包括
1、16.384MHz TDM时钟 2、125US TDM高速总线帧参考 时钟 3、60MS 同步参考时钟 4、6.12S 超帧计数
摩托罗拉BSC设备介绍
(GSMBSS)
摩托罗拉GSM BSS系统概述
内容
摩托罗拉GSM BSS 系统概述
-摩托罗拉GSM BSS系统结 构 -摩托罗拉BSS系统互连
BSC082N10LS G中文资料
Opti MOS®ValueUnitBSC082N10LS GParameterSymbol ConditionsUnitmin.typ.max.Thermal characteristicsThermal resistance, junction - caseR thJCbottom --0.8K/Wtop--18R thJAminimal footprint --626 cm 2 cooling area 2)--45Electrical characteristics, at T j =25 °C, unless otherwise specified Static characteristicsDrain-source breakdown voltage V (BR)DSS V GS =0 V, I D =1 mA 100--VGate threshold voltage V GS(th)V DS =V GS , I D =110 µA 1.2 1.85 2.4Zero gate voltage drain currentI DSSV DS =100 V, V GS =0 V, T j =25 °C-0.011µA V DS =100 V, V GS =0 V, T j =125 °C-10100Gate-source leakage current I GSS V GS =20 V, V DS =0 V -1100nA Drain-source on-state resistanceR DS(on)V GS =4.5 V, I D =50 A -8.211m ΩV GS =10 V, I D =100 A- 6.88.2Gate resistance R G -1-ΩTransconductanceg fs|V DS |>2|I D |R DS(on)max , I D =50 A60119-S Values 2)Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm 2(one layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air.Thermal resistance, junction - ambient3)see figure 3BSC082N10LS GParameterSymbol ConditionsUnitmin.typ.max.Dynamic characteristics Input capacitance C iss -56007400pFOutput capacitanceC oss -710940Reverse transfer capacitance C rss -3857Turn-on delay time t d(on)-1928nsRise timet r -2436Turn-off delay time t d(off)-5380Fall timet f-1217Gate Charge Characteristics 4)Gate to source charge Q gs -1823nCGate to drain charge Q gd -1319Switching charge Q sw -2130Gate charge total Q g -78104Gate plateau voltage V plateau - 3.1-V Output charge Q ossV DD =50 V, V GS =0 V -7397nCReverse DiodeDiode continous forward current I S --100ADiode pulse current I S,pulse --400Diode forward voltage V SD V GS =0 V, I F =50 A, T j =25 °C-0.9 1.2V Reverse recovery time t rr -107-ns Reverse recovery chargeQ rr-226-nC4)See figure 16 for gate charge parameter definitionV R =50 V, I F =25 A, d i F /d t =100 A/µsT C =25 °CValues V GS =0 V, V DS =50 V, f =1 MHzV DD =50 V, V GS =10 V, I D =25 A, R G =2.7 ΩV DD =50 V, I D =25 A, V GS =0 to 10 V1 Power dissipation5 Typ. output characteristics9 Drain-source on-state resistance13 Avalanche characteristicsBSC082N10LS G Package Outline: PG-TDSON-8BSC082N10LS GDimensions in mmBSC082N10LS GPublished byInfineon Technologies AG81726 Munich, Germany© 2008 Infineon Technologies AGAll Rights Reserved.Legal DisclaimerThe information given in this document shall in no event be regarded as a guarantee ofconditions or characteristics. With respect to any examples or hints given herein, any typicalvalues stated herein and/or any information regarding the application of the device,Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind,including without limitation, warranties of non-infringement of intellectual property rightsof any third party.InformationFor further information on technology, delivery terms and conditions and prices, pleasecontact the nearest Infineon Technologies Office ().WarningsDue to technical requirements, components may contain dangerous substances. For informationon the types in question, please contact the nearest Infineon Technologies Office.Infineon Technologies components may be used in life-support devices or systems only withthe express written approval of Infineon Technologies, if a failure of such components canreasonably be expected to cause the failure of that life-support device or system or to affectthe safety or effectiveness of that device or system. Life support devices or systems areintended to be implanted in the human body or to support and/or maintain and sustainand/or protect human life. If they fail, it is reasonable to assume that the health of the useror other persons may be endangered.。
BSC027N04LS G中文资料
ValueUnit 100ABSC027N04LS GMaximum ratings, at T j=25 °C, unless otherwise specifiedParameter Symbol Conditions Unit Power dissipation P tot T C=25 °C83WT A=25 °C,R thJA=50 K/W2)2.5Operating and storage temperature T j, T stg-55 ... 150°C IEC climatic category; DIN IEC 68-155/150/56Parameter Symbol Conditions Unitmin.typ.max. Thermal characteristicsThermal resistance, junction - case R thJC bottom-- 1.5K/Wtop18Device on PCB R thJA 6 cm2 cooling area2)--50 Electrical characteristics, at T j=25 °C, unless otherwise specifiedStatic characteristicsDrain-source breakdown voltage V(BR)DSS V GS=0 V, I D=1 mA40--V Gate threshold voltage V GS(th)V DS=V GS, I D=49 µA 1.2-2Zero gate voltage drain current I DSS V DS=40 V, V GS=0 V,T j=25 °C-0.11µAV DS=40 V, V GS=0 V,T j=125 °C-10100Gate-source leakage current I GSS V GS=20 V, V DS=0 V-10100nA Drain-source on-state resistance R DS(on)V GS=4.5 V, I D=50 A- 3.3 4.1mΩV GS=10 V, I D=50 A- 2.3 2.7Gate resistance R G- 1.6-ΩTransconductance g fs |V DS|>2|I D|R DS(on)max,I D=50 A70140-S3) See figure 3 for more detailed informationValue Values2) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air.BSC027N04LS GParameter Symbol Conditions Unitmin.typ.max. Dynamic characteristicsInput capacitance C iss-51006800pF Output capacitance C oss-11001500 Reverse transfer capacitance C rss-59-Turn-on delay time t d(on)-9.8-ns Rise time t r- 5.6-Turn-off delay time t d(off)-39-Fall time t f- 6.2-Gate Charge Characteristics5)Gate to source charge Q gs-15-nC Gate charge at threshold Q g(th)-8.1-Gate to drain charge Q gd- 6.5-Switching charge Q sw-14-Gate charge total Q g-6485Gate plateau voltage V plateau- 3.0-VGate charge total Q g V DD=20 V, I D=30 A,V GS=0 to 4.5 V-3141nCGate charge total, sync. FET Q g(sync)V DS=0.1 V,V GS=0 to 10 V-60-Output charge Q oss V DD=20 V, V GS=0 V-40-Reverse DiodeDiode continuous forward current I S--69A Diode pulse current I S,pulse--400Diode forward voltage V SD V GS=0 V, I F=50 A,T j=25 °C-0.83 1.2VReverse recovery charge Q rr V R=20 V, I F=I S,d i F/d t=400 A/µs-45-nC T C=25 °CValuesV GS=0 V, V DS=20 V,f=1 MHzV DD=20 V, V GS=10 V,I D=30 A, R G=1.6 ΩV DD=20 V, I D=30 A,V GS=0 to 10 VBSC027N04LS G Package Outline PG-TDSON-8PG-TDSON-8: OutlineFootprintBSC027N04LS G Package OutlinePG-TDSON-8: TapeBSC027N04LS GPublished byInfineon Technologies AG81726 Munich, Germany© 2008 Infineon Technologies AGAll Rights Reserved.Legal DisclaimerThe information given in this document shall in no event be regarded as a guarantee ofconditions or characteristics. With respect to any examples or hints given herein, any typicalvalues stated herein and/or any information regarding the application of the device,Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind,including without limitation, warranties of non-infringement of intellectual property rightsof any third party.InformationFor further information on technology, delivery terms and conditions and prices, pleasecontact the nearest Infineon Technologies().WarningsDue to technical requirements, components may contain dangerous substances. For informationon the types in question, please contact the nearest Infineon Technologies Office.Infineon Technologies components may be used in life-support devices or systems only withthe express written approval of Infineon Technologies, if a failure of such components canreasonably be expected to cause the failure of that life-support device or system or to affectthe safety or effectiveness of that device or system. Life support devices or systems areintended to be implanted in the human body or to support and/or maintain and sustainand/or protect human life. If they fail, it is reasonable to assume that the health of the useror other persons may be endangered.。
BSC板位图
济南BSC板位图APZ212 33C(CP中央处理机柜前面板)CDU69/BYB 501/33(SHELF) 空框—可扩容69/BYB 501/33(SHELF) 空框—可扩容69/BYB 501/33(SHELF) 空框—可扩容69/BYB 501/33(SHELF) 空框—可扩容GDM----H框AXE81 0 RP64RP4-H单板0槽DLHB1槽RP66C7STAH-2RPP单板RP67C7STAH-3RPP单板C7STAH处理高速C7信令的剩余单板槽位可以根据情况共可扩容8块RPP单板2-17槽位DLHB18槽RP65RP4-H19槽RPB--269/BYB 501/33(SHELF)GDM----H框AXE81 0 RP32RP4-H0槽DLHB1槽RP34C7STAH-0RPP单板RP35C7STAH-1RPP单板C7STAH处理高速信令的剩余槽位可根据情况扩容8块RPP单板,2-17槽位DLHB18槽RP33RP4-H19槽RPB--173/BYB 501/33(SHELF)BFD509 08/4(FAN)CPUM框CP 中央处理器BFD 508 006/4(APZ212 33C)RPBI-SRPBI-SIPNAXPOWCSPUIPUDSU-1GWMAUDSU-1GWIPUSPUPOWCIPNAXRPBI-SRPBI-S71/BYB 501/33(SHELF)BFD509 08/4(FAN)59/BYB 501/7(FILTER)POWC单板从上往下4个开关:POW,PHCI,LAMP,PWR;MAU单板两个开关:POU,PWR;DLHB单板提供一个DL3接口,连接到CP机柜后面框中的DLEB单板,每个DLEB单板提供1个DL3 P接口和4个DL3接口连接DLHB单板.RPP单板有一个TEST接口和一个100BASETX接口.RP4-H单板提供1个-48V电源接口和2个RPBI-S接口,0口不用,1接口和RPBI-S单板连接. IPNAX提供7个IPN口,从下往上为0—6,左右两0口连接NODE B的CPCI板的LAN0和LAN1口;左右1口连接NODE A的CPCI的LAN0和LAN1;6口连接MAU中的两个PTB-EA和EB口. RPBI-S提供10个RPBS接口连接RPS线.分别连接到其他框的RP4-H板的RPBI-S1口.注意中继框共用一对RPB线和APG前面板的下面两框和后面两框也共用一对RPB线.SPU提供一个FAN和一个CDU接口CDB线.和每个框FAN串连接,CDB线连接到一块单独的CDB单板,显示CP状态的.MAU单板有一个POU开关,一个PWR开关,两个PTB.EA和PTB.EB接口连接IPNAX接口,一个ETH接口,一个TEST接口,一个PTB接口出CPT线做应急通道.选组框有槽位为26个,序号为0—25;其他框有槽位为20个,序号0-19;3GEM(中央处理机柜后面板)---此柜实现交换选组功能,和提供光纤口空框—可扩容0 1 2 3 4 5 6 7 8 9 10 11121314151617181922122232425G E M K U 框RP288SCB-RP单板XDB(HW4,3/CLK10/9)CSPB(16)ET155(4)CSPB(18)CSPB(17)ET155(9)CSPB(19)XDB(HW6,5/CLK12/11)RP289SCB-RP单板RPB--9 三个CLM的同一位置的CDB合成一路后连去GSS,一条CDB可以控制四个TSM.G E M K U 框RP256SCB-RP单板XDB(HW4,1/CLK4/2)CSPB(8)DLEB(11,3)(11/10/9/8)ET155(1)CSPB(10)CSPB(12)DLEB(7)(15/14/13/12)ET155(3)CSPB(14)IRBCL890CGBCSPB(9)DLEB(12,4)ET155(6)CSPB(11)CSPB(13)DLEB(8) ET155(8)CSPB(15)CDB(CLD/10/4/3)CDB(CLD/12/8/7) XDB(HW6,2/CLK8/6)RP257SCB-RP单板RPB--8G E M K U 框RP224SCB-RP单板XDB(HW3,1/CLK3/1)CSPB()DLEB(9,1)(3/2/1/0)ET155()CSPB(2)CSPB(4)DLEB(5)(7/6/5/4)ET155(2)CSPB(6)IRBCL890CGBCSPB(1)DLEB(10,2)ET155(5)CSPB(3)CSPB(5)DLEB(6) ET155(7)CSPB(7)CDB(CLD/9/2/1)CDB(CLD/11/6/5) XDB(HW5,2/CLK7/5)RP225SCB-RP单板RPB-7SCB-RP单板提供一个EXT ALARM接口,一个V24V SCB-RP接口连接 ;和两个RPB-S接口其中1连接RPB 线,2个-48V电源接口.1个ET155只需2条光纤(现在没有备用,两条互为收发)连至SDH传输设备。
NOKIABSC简介
PPT文档演模板
2024/2/8
NOKIABSC简介
BSC3000设备说明
BSC3000设备容量 可带载频3000块 最大处理18000erl TC单元最大容量96 PCU单元最大容量60个新型PCU 可提供16个STM-1/OC-3 接口 或800个E1/T1 接口 最大支持30720个16kbit/s GPRS信 道
Exchange Terminal (ET单元)
根据传输数据不同分为Abis,A(Ater),GB接口
PPT文档演模板
NOKIABSC简介
BSC设备组成(TC部分)
TCSM2机柜
✓一个TC机柜最多容纳8个TC单 元,即在BSC上看到的TCSM单 元。
✓每个TC单元由ET部分和TCIC 组成。
✓TCSM单元有5对传输线,其中 第一对是到BSC端(Ater口), 剩余4对连接到MSC或者MGW( A口)
查询单元板件类型 查询GB口NSEI状态
查询GB口NSVCI配置 查询ET用于何种接口(A,Abis或者GB)
PPT文档演模板
NOKIABSC简介
常用的BSC操作命令
常用的BSC操作命令:ZEEI、ZEEL、ZERO、ZEQO、ZEAO、 ZAHO、ZERS、ZEQS、ZERM、ZEQM、ZEHO、ZDSB等
MCMU GSWB
BSC
BCSU
LANU
GTIC TC2C
TC
SGSN
MGW
交换
PPT文档演模板
NOKIABSC简介
BSC容量以及负荷要求
BSC容量主要有三方面:
A口 信令负荷 话务负荷
可以用ZOLT命令查询,查询值小于1为正常,由网优规划 由A口话务电路数和BSC用户接入数决定
NBXDPA019LN1TAG;NBXDPA019LNHTAG;中文规格书,Datasheet资料
NBXDPA0192.5 V /3.3 V , 125 MHz /250 MHz LVDS Clock OscillatorThe NBXDPA019 dual frequency crystal oscillator (XO) is designed to meet today’s requirements for 2.5 V and 3.3V LVDS clock generation applications. The device uses a high Q fundamental crystal and Phase Lock Loop (PLL) multiplier to provide selectable 125 MHz or 250MHz, ultra low jitter and phase noise LVDS differential output.This device is a member of ON Semiconductor’s PureEdge t clock family that provides accurate and precision clock solutions.Available in 5 mm x 7 mm SMD (CLCC) package on 16 mm tape and reel in quantities of 1000.Features•LVDS Differential Output•Uses High Q Fundamental Mode Crystal and PLL Multiplier •Ultra Low Jitter and Phase Noise − 0.5 ps (12 kHz − 20 MHz)•Selectable Output Frequency − 125 MHz (default) / 250 MHz •Hermetically Sealed Ceramic SMD Package •Operating Range: 2.5 V ±5% 3.3 V ±10%•Total Frequency Stability − $50 ppm•These Devices are Pb −Free, Halogen Free/BFR Free and are RoHS CompliantApplications•Ethernet, Gigabit Ethernet •Infiniband •Base StationsFigure 1. Simplified Logic DiagramCLK CLKV MARKING DIAGRAMNBXDPA019= NBXDPA019 (±50 PPM)125.00/250.00= Output Frequency (MHz)AA = Assembly Location WL = Wafer Lot YY = YearWW = Work WeekG= Pb −Free Package6 PIN CLCC LN SUFFIXCASE 848ABDevice Package Shipping †ORDERING INFORMATION†For information on tape and reel specifications,including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.NBXDPA019LN1TAG CLCC −6(Pb −Free)1000/Tape & Reel NBXDPA019LNHTAG CLCC −6(Pb −Free)100/Tape & Reel 6 PIN CLCC LU SUFFIX CASE 848AC *Contact factory for availability.NBXDPA019LU1TAG*CLCC −6(Pb −Free)1000/Tape & Reel NBXDPA019LUHTAG*CLCC −6(Pb −Free)100/Tape & ReelFSEL OE GND CLK V DD CLKFigure 2. Pin Connections (Top View)Table 1. PIN DESCRIPTIONPin No.Symbol I/O Description1OE LVTTL/LVCMOSControl Input Output Enable Pin. When left floating pin defaults to logic HIGH and output is active. See OE pin description Table 2.2FSEL LVTTL/LVCMOSControl Input Output Frequency Select Pin. Pin will default to logic HIGH when left open. See Output Frequency Select pin description Table 3.3GND Power Supply Ground 0 V4CLK LVDS Output Non−Inverted Clock Output. Typically loaded with 100 W receiver termination resistoracross differential pair.5CLK LVDS Output Inverted Clock Output. Typically loaded with 100 W receiver termination resistor acrossdifferential pair.6V DD Power Supply Positive power supply voltage. Voltage should not exceed 2.5 V ±5% or 3.3 V ±10%.Table 2. OUTPUT ENABLE TRI−STATE FUNCTION OE Pin Output PinsOpen ActiveHIGH Level ActiveLOW Level High Z Table 3. OUTPUT FREQUENCY SELECTFSEL Pin Output Frequency (MHz)Open(pin will float high)125HIGH Level125LOW Level250Table 4. ATTRIBUTESCharacteristic Value Input Default State Resistor170 k WESD Protection Human Body ModelMachine Model 2 kV 200 VMeets or Exceeds JEDEC Standard EIA/JESD78 IC Latchup Test1.For additional Moisture Sensitivity information, refer to Application Note AND8003/D.Table 5. MAXIMUM RATINGSSymbol Parameter Condition 1Condition 2Rating Units V DD Positive Power Supply GND = 0 V 4.6VI out LVDS Output Current ContinuousSurge 2550mAT A Operating Temperature Range−40 to +85°C T stg Storage Temperature Range−55 to +120°C T sol Wave Solder See Figure 6260°C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.I DD Power Supply Current78105mA V IH OE and FSEL Input HIGH Voltage2000V DD mV V IL OE and FSEL Input LOW Voltage GND − 300800mVI IH Input HIGH Current OEFSEL −100−100+100+100m AI IL Input LOW Current OEFSEL −100−100+100+100m AD V OD Change in Magnitude of V OD forComplementary Output States(Note 3)0125mVV OS Offset Voltage11251375mVD V OS Change in Magnitude of V OS forComplementary Output States(Note 3)0125mVV OH Output HIGH Voltage V DD = 2.5 VV DD = 3.3 V14251600mVV OL Output LOW Voltage V DD = 2.5 VV DD = 3.3 V9001075mV V OD Differential Output Voltage250450mVNOTE:Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 Ifpm. Electrical parameters are guaranteed only over the declaredoperating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously.2.Measurement taken with outputs terminated with 100 ohm across differential pair. See Figure 5.3.Parameter guaranteed by design verification not tested in production.f CLKOUT Output Clock Frequency FSEL = HIGH125MHzFSEL = LOW250D f Frequency Stability − NBXDPA019(Note 5)±50ppm F NOISE Phase−Noise Performance100 Hz of Carrier−108/−103dBc/Hzf CLKout = 125 MHz/250 MHz (See Figures 3 and 4)1 kHz of Carrier−122/−116dBc/Hz 10 kHz of Carrier−129/−123dBc/Hz 100 kHz of Carrier−129/−124dBc/Hz 1 MHz of Carrier−136/−131dBc/Hz 10 MHz of Carrier−159/−156dBc/Hzt jit(F)RMS Phase Jitter12 kHz to 20 MHz0.50.75ps t jitter Cycle to Cycle, RMS1000 Cycles48ps Cycle to Cycle, Peak−to−Peak1000 Cycles1735psPeriod, RMS10,000 Cycles24psPeriod, Peak−to−Peak10,000 Cycles720ps t OE/OD Output Enable/Disable Time200nst DUTY_CYCLE Output Clock Duty Cycle(Measured at Cross Point)485052% t R Output Rise Time (20% and 80%)250400ps t F Output Fall Time (80% and 20%)250400ps t start Start−up Time15ms Aging1st Year3ppmEvery Year After 1st1ppm NOTE:Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 Ifpm. Electrical parameters are guaranteed only over the declaredoperating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously.4.Measurement taken with outputs terminated with 100 ohm across differential pair. See Figure5.5.Parameter guarantees 10 years of aging. Includes initial stability at 25°C, shock, vibration and first year aging.Figure 3. Typical Phase Noise Plot at 125 MHzFigure 4. Typical Phase Noise Plot at 250 MHzTable 8. RELIABILITY COMPLIANCEParameterStandardMethodShockMechanical MIL −STD −833, Method 2002, Condition B Solderability Mechanical MIL −STD −833, Method 2003VibrationMechanical MIL −STD −833, Method 2007, Condition ASolvent ResistanceMechanical MIL −STD −202, Method 215Resistance to Soldering Heat MechanicalMIL −STD −203, Method 210, Condition I or J Thermal ShockEnvironment MIL −STD −833, Method 1001, Condition A Moisture ResistanceEnvironmentMIL−STD −833, Method 1004Figure 5. Typical Termination for Output Driver and Device Evaluation260217175150temp. 260°CcoolingFigure 6. Recommended Reflow Soldering Profile6 PIN CLCC, 7x5, 2.54PCASE 848AB −01ISSUE CNOTES:1.DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.2.CONTROLLING DIMENSION: MILLIMETERS.DIM A MIN NOM MAX MILLIMETERS1.70 1.80 1.90A10.70 REF b 1.30 1.40 1.50D1 6.17 6.20 6.23D2 6.66 6.81 6.96E1 4.37 4.40 4.43R0.70 REFL 1.171.27 1.37A20.36 REF A30.080.100.12D 7.00 BSC D3 5.08 BSC E 5.00 BSC E2 4.654.80 4.95E3 3.49 BSC e 2.54 BSC 4X*For additional information on our Pb −Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.SOLDERING FOOTPRINT*6XDIMENSION: MILLIMETERSH 1.80 REF6 PIN CLCC, 5x3.2, 1.27PCASE 848AC −01ISSUE ONOTES:1.DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.2.CONTROLLING DIMENSION: MILLIMETERS.SIDE VIEWL6XDIM A MIN MAX MILLIMETERS 1.05 1.35A30.90 REF b 0.500.80D1 4.25 4.55E1 2.45 2.75L0.75 1.05A10.350.65D 5.00 BSC E 3.20 BSC E2 2.90 3.20e 1.27 BSC 2X *For additional information on our Pb −Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.SOLDERING FOOTPRINT*DIMENSION: MILLIMETERS2XON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.PUBLICATION ORDERING INFORMATIONPureEdge is a trademark of Semiconductor Components Industries, LLC (SCILLC).分销商库存信息:ONSEMINBXDPA019LN1TAG NBXDPA019LNHTAG。
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Value
Unit 100A
BSC019N02KS G
Maximum ratings, at T j=25 °C, unless otherwise specified
Parameter Symbol Conditions Unit Power dissipation P tot T C=25 °C104W
T A=25 °C,
R thJA=45 K/W2)
2.8
Operating and storage temperature T j, T stg-55 ... 150°C IEC climatic category; DIN IEC 68-155/150/56
Parameter Symbol Conditions Unit
min.typ.max. Thermal characteristics
Thermal resistance, junction - case R thJC bottom-- 1.2K/W
top18
SMD version, device on PCB R thJA minimal footprint--62
6 cm2 cooling area2)--45 Electrical characteristics, at T j=25 °C, unless otherwise specified
Static characteristics
Drain-source breakdown voltage V(BR)DSS V GS=0 V, I D=1 mA20--V Gate threshold voltage V GS(th)V DS=V GS, I D=350 µA0.70.95 1.2
Zero gate voltage drain current I DSS V DS=20 V, V GS=0 V,
T j=25 °C
--1µA
V DS=20 V, V GS=0 V,
T j=125 °C
--100
Gate-source leakage current I GSS V GS=12 V, V DS=0 V--100nA Drain-source on-state resistance R DS(on)V GS=2.5 V, I D=50 A- 2.3 3.0mΩ
V GS=4.5 V, I D=50 A- 1.6 1.95
Gate resistance R G- 1.9-Ω
Transconductance g fs |V DS|>2|I D|R DS(on)max,
I D=50 A
100210-S
Value
Values
2) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air.
BSC019N02KS G
Parameter Symbol Conditions Unit
min.typ.max. Dynamic characteristics
Input capacitance C iss-960013000pF Output capacitance C oss-27003600 Reverse transfer capacitance C rss-410620
Turn-on delay time t d(on)-15-ns Rise time t r-187-
Turn-off delay time t d(off)-95-
Fall time t f-8-
Gate Charge Characteristics4)
Gate to source charge Q gs-1925.1nC Gate charge at threshold Q g(th)-912.1
Gate to drain charge Q gd-1116.9 Switching charge Q sw-2129.8
Gate charge total Q g-6485.0
Gate plateau voltage V plateau- 2.0-V
Gate charge total, sync. FET Q g(sync)V DS=0.1 V,
V GS=0 to 4.5 V
-5978.5nC
Output charge Q oss V DD=10 V, V GS=0 V-37-Reverse Diode
Diode continuous forward current I S--100A Diode pulse current I S,pulse--400
Diode forward voltage V SD V GS=0 V, I F=50 A,
T j=25 °C
-0.8 1.2V
Reverse recovery charge Q rr V R=10 V, I F=50 A,
d i F/d t=100 A/µs
-55.6-nC
4) See figure 16 for gate charge parameter definition T C=25 °C
Values
V GS=0 V, V DS=10 V,
f=1 MHz
V DD=10 V, V GS=4.5 V,
I D=50 A, R G=1.6 Ω
V DD=10 V, I D=50 A,
V GS=0 to 4.5 V
5 Typ. output characteristics
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BSC019N02KS G
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