GBA-3 GRAPH分析

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pb graph的用法

pb graph的用法
PB Graph(Probabilistic Graph)是一种基于概率的图模型，用于描述和分析随机变量之间的关系。

它是一种有向无环图(Directed Acyclic Graph, DAG)，在图中的节点表示随机变量，边表示变量之间的依赖关系。

PB Graph常用于概率推理、机器学习和人工智能领域。

它可以用来建模复杂的概率分布，并进行概率推断、概率预测和决策分析。

PB Graph的用途包括：
1. 概率推断：通过给定一些已知变量的取值，推断其他变量的概率分布。

PB Graph可以进行贝叶斯推断和马尔可夫链推断等。

2. 概率预测：通过观察一些变量的取值，预测其他变量的概率分布。

PB Graph可以用于预测未来的事件、分类问题、回归问题等。

3. 参数估计：通过已知数据来估计PB Graph中变量之间的关系和概率分布。

参数估计可以用于模型训练和模型选择。

4. 解释分析：通过分析PB Graph的结构和参数，了解变量之间的因果关系、共享信息和相关性。

解释分析可以帮助理解数据生成过程和理解模型预测结果。

PB Graph的建模过程包括确定图的结构、选择变量间的依赖
关系、估计参数和进行推断。

常用的建模工具包括PGM库如Pyro、Pomegranate和Stan等。

总的来说，PB Graph是一种强大的建模工具，可以用于处理复杂的随机变量之间的关系和不确定性。

它在概率推理、机器学习和人工智能领域具有广泛的应用。

MetaDynMin3D：一种用于读取、分析和可视化'Plumed'中3D HILLS文件的工具说明

Package‘metadynminer3d’October13,2022Type PackageTitle Tools to Read,Analyze and Visualize Metadynamics3D HILLS Files from'Plumed'Version0.0.2Date2022-04-14Depends R(>=3.3.0),metadynminer,rglLinkingTo RcppDescription Metadynamics is a state of the art biomolecular simulation technique.'Plumed'Tribello,G.A.et al.(2014)<doi:10.1016/j.cpc.2013.09.018>program makes it possible to perform metadynamics using various simulation codes.The results ofmetadynamics done in'Plumed'can be analyzed by'metadynminer'.The package'metadynminer'reads1D and2D metadynamics hillsﬁles from'Plumed'package.As an addendum,'metadynaminer3d'is used to visualize3D hills.It usesa fast algorithm by Hosek,P.and Spiwok,V.(2016)<doi:10.1016/j.cpc.2015.08.037>to calculate a free energy surface from hills.Minima can be located and plotted onthe free energy surface.Free energy surfaces and minima can be plotted to producepublication quality images.LazyData trueLicense GPL-3RoxygenNote6.1.0Imports Rcpp,misc3dSuggests testthatURL https://metadynamics.cz/metadynminer3d/NeedsCompilation yesAuthor V ojtech Spiwok[aut,cre](<https:///0000-0001-8108-2033>) Maintainer V ojtech Spiwok<****************>Repository CRANDate/Publication2022-04-1414:32:34UTC12acealanme3d R topics documented:acealanme3d (2)feprof.minima3d (3)fes.hillsﬁle3d (3)fes2.hillsﬁle3d (4)fesminima.fes3d (5)fespoint.hillsﬁle3d (5)head.hillsﬁle3d (6)max.fes3d (7)min.fes3d (7)oneminimum.fes3d (8)plot.fes3d (8)plot.hillsﬁle3d (9)plot.minima3d (10)plotheights.hillsﬁle3d (11)print.fes3d (12)print.hillsﬁle3d (12)print.minima3d (13)read.hills3d (13)read.plumed3d (14)summary.fes3d (15)summary.hillsﬁle3d (16)summary.minima3d (16)tail.hillsﬁle3d (17)Index18 acealanme3d Hills from30ns metadynamics of AceAlaNme in water with three col-lective variableDescriptionHills from30ns metadynamics of AceAlaNme(Amber99SB-ILDN)in water(TIP3P)with a Ra-machandran dihedral phi and psi and peptide bond torsion omega as the collective variable.Usageacealanme3dFormathillsﬁle3d objectSourcehttp://www.metadynamics.cz/metadynminer/data/HILLS3dfeprof.minima3d3 feprof.minima3d Calculate free energy proﬁle for minima3d objectDescription‘feprof.minima3d‘calculates free energy proﬁles for free energy minima.Itﬁnds the global mini-mum at the‘imax‘and calculates the evolution of free energies of a local vs.the global free energy minimum.The free energy of the global minimum is constant(zero).Usage##S3method for class minima3dfeprof(minims,imax=NULL)Argumentsminims minima3d object.imax index of a hill from which summation stops(default the rest of hills). Exampleslibrary(metadynminer3d)tfes<-fes(acealanme3d,imax=5000)minima<-fesminima(tfes)prof<-feprof(minima)proffes.hillsfile3d Calculate3D free energy surface by Bias Sum algorithmDescription‘fes.hillsﬁle3d‘sums up hills using fast Bias Sum algorithm.Usage##S3method for class hillsfile3dfes(hills,imin=1,imax=NULL,xlim=NULL,ylim=NULL,zlim=NULL,npoints=NULL)4fes2.hillsﬁle3dArgumentshills hillsﬁle3d object.imin index of a hill from which summation starts(default1).imax index of a hill from which summation stops(default the rest of hills).xlim numeric vector of length1,giving the CV2coordinates range.ylim numeric vector of length2,giving the CV2coordinates range.zlim numeric vector of length2,giving the CV3coordinates range.npoints resolution of the free energy surface in number of points.Valuefes object.Examplestfes<-fes(acealanme3d,imax=5000)fes2.hillsfile3d Calculate3D free energy surface by conventional algorithmDescription‘fes2.hills3d‘sums up hills using slow conventional algorithm.It can be used as a reference or when hill widths are variable.Usage##S3method for class hillsfile3dfes2(hills,imin=1,imax=NULL,xlim=NULL,ylim=NULL,zlim=NULL,npoints=NULL)Argumentshills hillsﬁle3d object.imin index of a hill from which summation starts(default1).imax index of a hill from which summation stops(default the rest of hills).xlim numeric vector of length2,giving the CV1coordinates range.ylim numeric vector of length2,giving the CV2coordinates range.zlim numeric vector of length2,giving the CV3coordinates range.npoints resolution of the free energy surface in number of points.Valuefes object.fesminima.fes3d5Examplestfes<-fes2(acealanme3d,imax=100)fesminima.fes3d Find free energy minima in the fes3d objectDescription‘fesminima.fes3d‘ﬁnds free energy minima on3D free energy surface.The surface is divided by a3D grid and minima are found for each bin.Next the program determines whether the minimum of a bin is a local minimum of the whole free energy surface.Free energy minima are labeled constitutively by capital letters.Usage##S3method for class fes3dfesminima(inputfes,nbins=8)Argumentsinputfes fes3d object.nbins number of bins for each CV(default8).Valueminima object.Examplestfes<-fes(acealanme3d,imax=5000)minima<-fesminima(tfes)minimafespoint.hillsfile3d Calculate free energy at given point in the CV spaceDescription‘fespoint‘calculates free energy at given point in the CV space’coord’.Hills are summed from ’imin’to‘imax‘.Printed output can be suppressed by setting’verb’to TRUE.Usage##S3method for class hillsfile3dfespoint(hills,coord=NULL,imin=1,imax=NULL,verb=T)6head.hillsﬁle3d Argumentshills hillsﬁle3d object.coord coordinates of the point in the CV space.imin index of a hill from which calculation of difference starts(default1).imax index of a hill from which summation stops(default the rest of hills).verb if TRUE,the output is verbose(default TRUE).Examplesfespoint(acealanme3d,c(0,0,0),imax=5000)head.hillsfile3d Printﬁrst n lines of hillsﬁle3dDescription‘head.hillsﬁle3d‘printsﬁrst n lines of a hillsﬁle3d object.Usage##S3method for class hillsfile3dhead(x,n=10,...)Argumentsx hillsﬁle3d object.n number of lines(default10)....further arguments passed to or from other methods.Exampleshead(acealanme3d)max.fes3d7 max.fes3d Calculate maximum of3D free energy surfaceDescription‘max.fes3d‘calculates maximum of free energy in a fes3d object.Usage##S3method for class fes3dmax(inputfes,na.rm=NULL,...)Argumentsinputfes fes3d object.na.rm a logical indicating whether missing values should be removed....further arguments passed to or from other methods.Examplestfes<-fes(acealanme3d,imax=5000)max(tfes)min.fes3d Calculate minimum of3D free energy surfaceDescription‘min.fes3d‘calculates minimum of free energy in a fes3d object.Usage##S3method for class fes3dmin(inputfes,na.rm=NULL,...)Argumentsinputfes fes3d object.na.rm a logical indicating whether missing values should be removed....further arguments passed to or from other methods.Examplestfes<-fes(acealanme3d,imax=5000)min(tfes)8plot.fes3d oneminimum.fes3d Creates one ad hoc3D free energy minimum for a fes objectDescription‘oneminimum.fes3d‘creates an ad hoc3D free energy minimum on free energy surface.This can be used to calculate3D free energy surface evolution at arbitrary point of free energy surface. Usage##S3method for class fes3doneminimum(inputfes,cv1,cv2,cv3)Argumentsinputfes fes3d object.cv1the value of collective variable1.cv2the value of collective variable2.cv3the value of collective variable3.Valueminima object.Examplestfes<-fes(acealanme3d,imax=1000)minima<-fesminima(tfes)minima<-minima+oneminimum(tfes,cv1=0,cv2=0,cv3=0)minimaplot.fes3d Plot3D free energy surface objectDescription‘plot.fes3d‘plots3D free energy surface using.Usage##S3method for class fes3dplot(x,xlab=NULL,ylab=NULL,zlab=NULL,xlim=NULL,ylim=NULL,zlim=NULL,level=NULL,col=NULL,alpha=NULL,main=NULL,sub=NULL,fill=TRUE,...)plot.hillsﬁle3d9 Argumentsx fes3d object.xlab a title for the x axis:see’title’.ylab a title for the y axis:see’title’.zlab a title for the z axis:see’title’.xlim numeric vector of length2,giving the x coordinates range.ylim numeric vector of length2,giving the y coordinates range.zlim numeric vector of length2,giving the z coordinates range.main an overall title for the plot:see’title’.sub a sub title for the plot:see’title’.level number or numeric vector of levels at which to draw3D isosurface.col color of the free energy surface.It can be a single color or a vector with multiple colors for multiple3D isosurfaces.alpha number or numeric vector of alpha levels(transparency)of3D isosurfaces.fill a logical value indicating whether3D isosurface is ploted as solid surface(True) or wireframe(False)....further arguments passed to or from other methods.Examplestfes3d<-fes(acealanme3d,imax=5000)plot(tfes3d)plot.hillsfile3d Plot hillsﬁle3d objectDescription‘plot.hillsﬁle3d‘plots hillsﬁle object.It plots CV1vs CV2vs CV3.Usage##S3method for class hillsfile3dplot(x,xlab="CV1",ylab="CV2",zlab="CV3",main=NULL,sub=NULL,col="orange",...)10plot.minima3dArgumentsx hillsﬁle object.xlab a title for the x axis:see’title’.ylab a title for the y axis:see’title’.zlab a title for the z axis:see’title’.main an overall title for the plot:see’title’.sub a sub title for the plot:see’title’.col color code or name,see’par’....further arguments passed to or from other methods.Examplesplot(acealanme3d)plot.minima3d Plot minima3d objectDescription‘plot.minima3d‘plots3D free energy surface with minima.The free energy surface is plotted the same way as by plot.fes3d with additional minima labels.Usage##S3method for class minima3dplot(x,xlab="CV1",ylab="CV2",zlab="CV3",level=NULL,col=NULL,alpha=NULL,main=NULL,sub=NULL,fill=TRUE,...) Argumentsx minima3d object.main an overall title for the plot:see’title’.sub a sub title for the plot:see’title’.xlab a title for the x axis:see’title’.ylab a title for the y axis:see’title’.zlab a title for the z axis:see’title’.level number or numeric vector of levels at which to draw3D isosurface.col color of the free energy surface.It can be a single color or a vector with multiple colors for multiple3D isosurfaces.alpha number or numeric vector of alpha levels(transparency)of3D isosurfaces.fill a logical value indicating whether3D isosurface is ploted as solid surface(True) or wireframe(False)....further arguments passed to or from other methods.plotheights.hillsﬁle3d11Examplestfes<-fes(acealanme3d,imax=5000)minima<-fesminima(tfes)plot(minima)plotheights.hillsfile3dPlot evolution of heights of hills in hillsﬁle3d objectDescription‘plotheights.hillsﬁle3d‘plots evolution of heights of hills.In well tempered metadynamics hill heights decrees withﬂooding of the free energy surface.Evolution of heights may be useful to evaluate convergence of the simulation.Usage##S3method for class hillsfile3dplotheights(hills,ignoretime=FALSE,xlab=NULL,ylab=NULL,xlim=NULL,ylim=NULL,main=NULL,sub=NULL,col="black",asp=NULL,lwd=1,axes=TRUE)Argumentshills hillsﬁle object.ignoretime time in theﬁrst column of the HILLSﬁle will be ignored.xlab a title for the x axis:see’title’.ylab a title for the y axis:see’title’.xlim numeric vector of length2,giving the x coordinates range.ylim numeric vector of length2,giving the y coordinates range.main an overall title for the plot:see’title’.sub a sub title for the plot:see’title’.col color code or name,see’par’.asp the y/x aspect ratio,see’plot.window’.lwd line width for drawing symbols see’par’.axes a logical value indicating whether both axes should be drawn on the plot. Examplesplotheights(acealanme3d)12print.hillsﬁle3d print.fes3d Print minimum and maximum of3D free energy surfaceDescription‘print.fes3d‘prints dimensionality,minimum and maximum of free energy in a fes objectUsage##S3method for class fes3dprint(x,...)Argumentsx fes3d object...further arguments passed to or from other methods.Examplestfes<-fes(acealanme3d,imax=5000)tfesprint.hillsfile3d Print hillsﬁle3dDescription‘print.hillsﬁle3d‘prints dimensionality and size of a hillsﬁle object.Usage##S3method for class hillsfile3dprint(x,...)Argumentsx hillsﬁle3d object....further arguments passed to or from other methods.Examplesacealanme3dprint.minima3d13 print.minima3d Print minima3d objectDescription‘print.minima3d‘prints3D free energy minima(identiﬁer,values of bins and collective variables and free energy).Usage##S3method for class minima3dprint(x,...)Argumentsx minima object....further arguments passed to or from other methods.Examplestfes<-fes(acealanme3d,imax=5000)minima<-fesminima(tfes)minimaread.hills3d Read3D HILLS from PlumedDescription‘read.hills3d‘reads a HILLSﬁle generated by Plumed and returns a hillsﬁle3d er can specify whether some collective variables are periodic.Usageread.hills3d(file="HILLS",per=c(FALSE,FALSE,FALSE),pcv1=c(-pi,pi),pcv2=c(-pi,pi),pcv3=c(-pi,pi),ignoretime=FALSE)Argumentsfile HILLSﬁle from Plumed.per logical vector specifying periodicity of collective variables.pcv1periodicity of CV1.pcv2periodicity of CV2.pcv3periodicity of CV3.ignoretime time in theﬁrst column of the HILLSﬁle will be ignored.14read.plumed3dValuehillsﬁle object.Examplesl1<-"1-1.587-2.969 3.0130.30.30.31.11110"l2<-"2-1.067 2.745 2.9440.30.30.31.10910"l3<-"3-1.376 2.697 3.0490.30.30.31.08010"l4<-"4-1.663 2.922-3.0650.30.30.31.07210"fourhills<-c(l1,l2,l3,l4)tf<-tempfile()writeLines(fourhills,tf)read.hills3d(tf,per=c(TRUE,TRUE))read.plumed3d Read3D free energy surface from PLUMED sum_hillsDescription‘read.plumed3d‘reads3D free energy surface from PLUMED sum_hills.The grid in the inputﬁle must contain the same number of points for CV1,CV2and CV3.It does not use the header of the ﬁle.Periodicity must be speciﬁed.Usageread.plumed3d(file="fes.dat",per=c(FALSE,FALSE,FALSE))Argumentsfile inputﬁle from PLUMED sum_hills.per logical vector specifying periodicity of collective variables.Valuefes3d object.Examplesl1<-"-3.14-3.14-3.14-61.13-47.4319.00 2.04"l2<-"-1.05-3.14-3.14-70.7225.9525.78 2.43"l3<-" 1.05-3.14-3.14-65.588.34 2.82-3.09"l4<-"-3.14-1.05-3.14-51.31-43.88-19.91 1.51"l5<-"-1.05-1.05-3.14-66.437.67-22.45-0.39"l6<-" 1.05-1.05-3.14-61.08-7.50-7.36-0.83"l7<-"-3.14 1.05-3.14-53.07-55.120.19-0.28"l8<-"-1.05 1.05-3.14-62.8136.19 1.650.45"l9<-" 1.05 1.05-3.14-65.2822.8411.470.59"l10<-"-3.14-3.14-1.05-13.03-32.178.24-35.25"summary.fes3d15 l11<-"-1.05-3.14-1.05-21.8817.8921.91-51.20"l12<-" 1.05-3.14-1.05-14.49 3.60 6.04-44.05"l13<-"-3.14-1.05-1.05-2.26-7.00-7.01-10.65"l14<-"-1.05-1.05-1.05-8.21 3.69-22.89-28.48"l15<-" 1.05-1.05-1.05-1.100.52 3.59-1.99"l16<-"-3.14 1.05-1.05-3.75-11.70-5.65-15.36"l17<-"-1.05 1.05-1.05-1.15 5.75 1.05-2.42"l18<-" 1.05 1.05-1.05-10.678.23-10.42-36.77"l19<-"-3.14-3.14 1.05-4.64-13.7910.5114.96"l20<-"-1.05-3.14 1.05-7.8012.2420.5923.03"l21<-" 1.05-3.14 1.05-5.32 3.46 3.1721.99"l22<-"-3.14-1.05 1.05-2.06-6.590.1710.04"l23<-"-1.05-1.05 1.05-9.698.43-0.9736.97"l24<-" 1.05-1.05 1.05-0.19-0.44-0.260.91"l25<-"-3.14 1.05 1.05-7.98-23.02 3.9726.98"l26<-"-1.05 1.05 1.05-4.6413.66-9.7410.15"l27<-" 1.05 1.05 1.05-13.4215.7816.3641.60"twentysevenpoints<-c(l1,l2,l3,l4,l5,l6,l7,l8,l9,l10,l11,l12,l13,l14,l15,l16,l17,l18,l19,l20,l21,l22,l23,l24,l25,l26,l27)tf<-tempfile()writeLines(twentysevenpoints,tf)read.plumed3d(tf,per=c(TRUE,TRUE,TRUE))summary.fes3d Print summary of3D free energy surfaceDescription‘summary.fes3d‘prints minimum and maximum of free energy in a fes object.Usage##S3method for class fes3dsummary(object,...)Argumentsobject fes3d object....further arguments passed to or from other methods.Examplestfes<-fes(acealanme3d,imax=5000)summary(tfes)16summary.minima3d summary.hillsfile3d Print summary for hillsﬁle3dDescription‘summary.hillsﬁle3d‘prints dimensionality,size and collective variable ranges of a hillsﬁle3d ob-ject.Usage##S3method for class hillsfile3dsummary(object,...)Argumentsobject hillsﬁle3d object....further arguments passed to or from other methods.Examplessummary(acealanme3d)summary.minima3d Print minima3d object summaryDescription‘summary.minima3d‘prints summary for3D free energy minima(identiﬁer,values of bins and collective variables,free energy and equilibrium populations).Usage##S3method for class minima3dsummary(object,temp=300,eunit="kJ/mol",...)Argumentsobject minima3d objecttemp temperature in Kelvinseunit energy units(kJ/mol or kcal/mol,kJ/mol is default)...further arguments passed to or from other methods.Examplestfes<-fes(acealanme3d,imax=5000)minima<-fesminima(tfes)summary(minima)tail.hillsﬁle3d17 tail.hillsfile3d Print last n lines of hillsﬁle3dDescription‘tail.hillsﬁle3d‘prints last n lines of a hillsﬁle3d object.Usage##S3method for class hillsfile3dtail(x,n=10,...)Argumentsx hillsﬁle3d object.n number of lines(default10)....further arguments passed to or from other methods.Examplestail(acealanme3d)Index∗datasetsacealanme3d,2acealanme3d,2feprof.minima3d,3fes.hillsfile3d,3fes2.hillsfile3d,4fesminima.fes3d,5fespoint.hillsfile3d,5head.hillsfile3d,6max.fes3d,7min.fes3d,7oneminimum.fes3d,8plot.fes3d,8plot.hillsfile3d,9plot.minima3d,10plotheights.hillsfile3d,11print.fes3d,12print.hillsfile3d,12print.minima3d,13read.hills3d,13read.plumed3d,14summary.fes3d,15summary.hillsfile3d,16summary.minima3d,16tail.hillsfile3d,1718。

s-log3伽玛曲线

s-log3伽玛曲线
S-Log3伽马曲线是索尼公司开发的一种伽马曲线，用于视频拍摄和后期调色。

S-Log3伽马曲线是一种高动态范围（High Dynamic Range，HDR）的曲线，旨在提供更广泛的亮度范围和更多的细节。

S-Log3伽马曲线的设计目的是为了最大程度地保留图像的高光和阴影细节，并在后期调色时提供更大的灵活性。

它适用于拍摄场景中有高对比度的情况，例如明亮的阳光下或者暗处的细节。

使用S-Log3伽马曲线拍摄的视频通常看起来比较平淡，缺乏对比度和饱和度。

这是因为S-Log3曲线在拍摄时将亮度范围压缩到较低的范围内，以便在后期调色时进行还原。

因此，在拍摄过程中，通常需要进行曝光补偿，以确保图像的正确曝光。

在后期制作中，使用专业的调色软件，可以利用S-Log3伽马曲线提供的更多信息进行调整。

通过调整曝光、对比度、色彩饱和度等参数，可以将S-Log3拍摄的素材还原到更接近人眼所见的效果，并且可以根据需要进行艺术处理。

需要注意的是，使用S-Log3伽马曲线拍摄需要较高的技术要求
和后期处理能力。

对于不熟悉后期调色的用户来说，可能需要花费更多的时间和精力来学习和处理S-Log3素材。

总结而言，S-Log3伽马曲线是一种用于高动态范围视频拍摄和后期调色的曲线，它可以提供更广泛的亮度范围和更多的细节。

然而，使用S-Log3曲线需要注意曝光补偿和后期处理的技术要求。

mega3使用指南

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!Title This is an example title; 标题不可以占据多行，且中间不能出现冒号。描述书写的规则：描述书写于标题行之后，必须以!Description 开始，以冒号结尾。如：
#mega !Title This is an example title; !Description This is detailed information the data file;
描述可以占据多行，但是中间同样不能出现冒号。格式书写规则：格式描述可以包含一个或多个命令语句；一个命令语句包含一个命令和
一个有效的设定关键词（采用“命令=关键词”形式）。譬如，命令语句“DataType=Nucleotide”
告诉 MEGA 文件中是核苷序列数据。依据数据类型的设定，序列数据、距离数据和系统树数据格式描述中通常有不同的游戏关键词。
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三、MEGA3 中的主要菜单
MEGA 主界面中含有 Menu Bar、Toolbar 和 Data Description window，菜单栏里存在下列菜单、File menu、Data menu、Distances menu、Pattern menu、Selection menu、Phylogeny menu、 Alignment menu、Help menu。
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MEGA3 指南
一、前言
MEGA 系列软件用于检验和分析 DNA、蛋白质序列的演化。MEGA1 是基于 20 世纪 90 年代早期个人计算机平均水平设计的，在 DOS 操作系统下运行。90 年代晚期开发的 MEGA2 加强了运算能力和图形界面，满足了日益增长的大数据量分析的要求；MEGA2 的最终版本能对多个序列数据进行分析、对类群内和类群间的遗传多样性进行估计，还可以推断高等级水平的物种、基因的演化关系。MEGA2 内嵌了很多用于估计演化距离、计算类群内和类群间分子序列和遗传多样性、以及最小演化和最大简约标准下推断系统发育关系的方

g-dis3 用法

g-dis3 用法摘要g-dis3是一个用于处理数字图像的软件工具。

它提供了丰富的功能，包括图像导入、编辑、分析和可视化。

本文详细介绍了g-dis3的用法，旨在帮助用户更好地理解和使用该软件。

引言随着数字图像技术的不断发展，数字图像处理已成为许多领域中不可或缺的一部分。

g-dis3作为一种功能强大的数字图像处理软件，广泛应用于科学研究、工程应用和商业领域。

本文将介绍g-dis3的基本用法，帮助用户更好地利用该软件进行数字图像处理。

软件安装与启动首先，您需要从官方网站下载并安装g-dis3软件。

安装完成后，双击桌面上的g-dis3图标即可启动软件。

图像导入在g-dis3中，您可以通过多种方式导入数字图像。

最简单的方法是直接将图像文件拖拽到软件窗口中。

此外，您还可以使用菜单栏中的“文件”->“打开”选项，通过文件浏览器选择图像文件。

图像编辑g-dis3提供了丰富的图像编辑功能，包括裁剪、旋转、缩放、亮度/对比度调整等。

您可以通过菜单栏中的“编辑”选项或工具栏中的相关按钮来访问这些功能。

图像分析g-dis3提供了多种图像分析工具，如直方图分析、边缘检测、特征提取等。

您可以通过菜单栏中的“分析”选项或工具栏中的相关按钮来使用这些工具。

图像可视化在完成图像处理和分析后，g-dis3还提供了丰富的可视化选项，让您更好地展示和呈现处理结果。

您可以通过菜单栏中的“可视化”选项或工具栏中的相关按钮来使用这些功能。

结论g-dis3是一个功能强大的数字图像处理软件，具有广泛的应用前景。

本文详细介绍了g-dis3的用法，包括软件安装与启动、图像导入、编辑、分析和可视化等方面的内容。

希望通过本文的介绍，能够帮助用户更好地理解和使用g-dis3进行数字图像处理。

empower3 报告解读

empower3 报告解读English Answer:Empower3 Report Interpretation.The Empower3 report provides a comprehensive overview of the current state and future prospects of the global energy system. The report is divided into three main sections:The Current State of the Global Energy System.The Future of the Global Energy System.Policy Recommendations.The Current State of the Global Energy System.The Empower3 report finds that the global energy system is facing a number of challenges, including:Climate change: The burning of fossil fuels is a major contributor to climate change, and the global community is committed to transitioning to a low-carbon future.Energy poverty: Over 1 billion people worldwide do not have access to electricity, and nearly 3 billion peoplerely on traditional biomass for cooking.Air pollution: Air pollution from the burning offossil fuels is a major public health concern, and it is estimated to cause over 7 million premature deaths each year.The Future of the Global Energy System.The Empower3 report projects that the global energy system will undergo a significant transformation over the coming decades. The report finds that:Renewables will become the dominant source of energy.Energy efficiency will improve significantly.The role of fossil fuels will decline.Policy Recommendations.The Empower3 report makes a number of policy recommendations to help accelerate the transition to a sustainable energy future. These recommendations include:Investing in renewable energy.Improving energy efficiency.Phasing out fossil fuels.Investing in research and development.中文回答：Empower3 报告解读。

VBO软件操作手册

1.硬件 (4)1.1硬件` (4)1.2新手上路 (5)1.3LED 解释 (7)1.4电池 (7)1.5连接图 (8)1.6蜂鸣器声音 (10)2.使用技巧 (11)3.操作手则 (12)4.设置 VBOX (15)VBOX安装 (15)4.2Misc Channels其它通道 (16)4.4设置 (17)4.5Info (19)5.软件—新手上路 (20)5.1怎样做加速试验 (20)5.2怎样做制动实验 (20)5.3怎样通过图形化的界面查看测试结果 (20)5.5怎样在没有手提计算机连接的情况下进行试验 (21)6.软件–开始使用 (22)6.1主屏幕 (22)6.1.1用户设置前面板 (23)7.软件主菜单 (24)7.1File 文件 (24)7.1.1File load 文件载入 (24)7.1.2File save 文件保存 (24)7.1.3Replay file 文件回放 (24)7.1.4Repair/expand file 修补/扩充文件 (24)7.1.5Language语言 (24)7.2Options 选项 (24)7.2.1Unit of measurement测量单位 (24)7.2.2GPS cold start GPS 冷启动 (24)7.2.3 com口选择 (25)7.2.4Lock results until manually reset锁定结果直到手动复位 (25)7.2.5VBOX II & Pro Rev 4 (25)7.2.6 Measure distance using external trigger 使用外部触发器测量距离 (25)7.2.7Accel table columns 加速表纵列 (26)7.2.8Reset time when stationary 停止时把时间复位 (26)7.2.9Enable Slip angle calculations on Yaw sensor data 允许在偏航传感器数据上进行偏离角计算 (26)7.2.10Show Real Time Scope 显示实时范围 (26)7.2.11Put radius of turn in channel data 把转弯半径放到通道数据中 (26)7.2.12Delimiter for text files 文本文件的分隔符 (26)7.2.13Use target speed 1 for MFDD 使用的目标速度给MFDD (26)7.3Target speeds 目标速度 (26)7.3.1Test range 1 试验范围1 (26)7.3.2Test range 2试验范围2 (26)7.3.30 to 100 to 0 range 零到100到零范围 (27)7.4Real time plot 实时绘图 (27)7.5Select Run 选择运行 (28)7.5.1Default setups 缺省设置 (29)7.5.2Manual setup 手动设置 (31)7.6VBOX Setup VBOX 设置 (31)7.7Graph 图形 (31)7.8Start Finish 起点终点 (31)7.8.1Load start finish line and splits载入起/终点线和分离位置 (31)7.8.2Save start/finish line and splits保存起/终点线和分离位置 (32)7.8.3Start finish line length起/终点线的长度 (32)7.8.4Start finish line tolerance起终点线的公差 (32)7.8.5Accumulative split times 累计分离时间 (32)7.9.1Enable log file creation 允许记录文件产生 (32)7.9.2Include MFDD in logfile 在记录文件中包括MFDD (32)7.9.3Include test range 2 in logfile 在记录文件中包括试验范围2 (32)7.10Help 帮助 (32)8.GRAPH图形 (33)8.1概述 (33)8.2选择通道 (34)8.3设置外部输入信号的比例大小 (35)8.4键盘和鼠标指令 (36)8.5快捷键 (36)8.6定义起点/终点线和分离点。

d3graph用法

d3graph用法D3.js是一个强大的JavaScript库，用于创建交互式数据可视化图表。

其中，D3graph是基于D3.js开发的一个图表库，用于绘制各种类型的图表，如折线图、柱状图、散点图等。

下面我将从多个角度介绍D3graph的用法。

1. 安装和引入：首先，在使用D3graph之前，你需要将D3.js和D3graph库引入到你的项目中。

你可以通过下载它们的源文件，也可以使用CDN链接。

在HTML文件中，使用`<script>`标签引入D3.js和D3graph库。

2. 创建容器：在HTML文件中，创建一个容器元素，用于承载你的图表。

可以使用`<div>`标签，并为其设置一个唯一的ID作为选择器。

3. 数据准备：在使用D3graph绘制图表之前，你需要准备好要展示的数据。

可以是一个数组，也可以是一个JSON对象。

确保数据的格式符合D3graph的要求。

4. 初始化图表：在JavaScript文件中，使用D3graph提供的初始化函数来创建图表。

根据你想要绘制的图表类型，选择相应的初始化函数，并传入容器的选择器和数据。

例如，如果你要绘制折线图，可以使用`d3graph.lineChart()`函数来初始化。

5. 配置图表属性：D3graph提供了丰富的配置选项，用于自定义图表的样式和行为。

可以通过链式调用配置函数来设置图表的属性，如标题、坐标轴、颜色、图例等。

根据需要，设置相应的属性以满足你的需求。

6. 渲染图表：在配置完成后，调用图表对象的`render()`方法来渲染图表。

这将根据你的配置生成相应的SVG元素，并将其插入到容器中。

7. 交互和动画：D3graph支持各种交互和动画效果，以增强用户体验。

你可以通过调用相应的方法来实现，如添加鼠标事件、过渡效果等。

8. 响应式设计：D3graph还支持响应式设计，使图表能够自适应不同的屏幕大小。

你可以使用D3.js提供的方法来实现响应式布局，以确保图表在不同设备上都能正常显示。

自动控制原理(Ⅰ型二阶系统的典型分析与综合设计)课程设计

指导教师评定成绩：审定成绩：重庆邮电大学移通学院自动化系课程设计报告设计题目：Ⅰ型二阶系统的典型分析与综合设计学生姓名：专业：班级：学号：指导教师：设计时间：2010 年 12 月重庆邮电大学移通自动化系制重庆邮电大学移通学院《自动控制原理》课程设计（简明）任务书-供08级自动化专业、电气工程与自动化专业本科生用引言：《自动控制原理》课程设计是该课程的一个重要教学环节，它有别于毕业设计，更不同于课堂教学。

它主要是培养学生统筹运用自动控制原理课程中所学的理论知识，掌握反馈控制系统的基本理论和基本方法，对工程实际系统进行完整的全面的分析和综合。

一、设计题目：Ⅰ型二阶系统的典型分析与综合设计二、系统说明：该Ⅰ型系统物理模拟结构如下图：其中R0=100KΩ; C1=C2=10-5F；R2=1/2 R0R f为线性滑动电位器，可调范围为：10-1R0~ 104R0 ，设计过程中可忽略各种干扰，比如：运算放大器的零点漂移，环节间的负载效应，外界强力电力设备产生的电磁干扰等，均可忽略。

三、系统参量：系统输入信号：r（t）；系统输出信号：y（t）；四、设计指标：设定：输入为r（t）=a+bt（其中：a=5rad/secb=4rad/sec）在保证静态指标K v=5（e ss≤0.8）的前提下，要求动态期望指标：σp% ≤8.5% ；t s≤2sec五、基本要求：1. 建立系统数学模型——传递函数；2. 利用频率特性法分析和综合系统（学号为单号同学做）；3. 利用根轨迹法分析和综合系统（学号位双号同学做）;4. 完成系统综合前后的有源物理模拟（验证）实验；5. 完成系统综合前后的计算机仿真（验证）实验;六、设计缴验：1. 课程设计计算说明书一份；2. 原系统组成结构原理图一张（自绘）；3. 系统分析，综合用BODE图（或根轨迹图）各一张；4. 系统综合前后的模拟图各一张（附实验结果图）各一张；5. 计算机仿真程序框图一张；6. 计算机仿真程序清单一份（附仿真实验结果图）；7. 封面装帧成册；移通学院自动化系指导教师：汪纪峰2010-12-15目录引言 (2)一、系统概述 (7)1.1 设计目的 (7)1.2 系统的工作原理 (7)1.3 系统设计基本要求 (8)二、系统建模 (9)2.1 各环节建模 (9)2.1.1 比较器 (9)2.1.2 比例环节 (9)2.1.3 积分环节 (10)2.1.4 惯性环节 (11)2.1.5 反馈环节 (12)2.2 系统模型 (12)2.2.1 系统框图模型 (12)2.2.2 系统等价框图 (12)2.2.3 系统频域模型 (13)2.2.4 小结 (13)三、系统分析 (14)3.1 稳定性分析 (14)3.1.1 时域分析 (14)3.1.2 根轨迹映证 (14)3.1.2.1 绘制根轨迹 (15)3.2静态精度分析 (16)3.2.1Ⅰ型系统的典型分析 (16)3.2.1.1 跟踪能力 (16)3.2.1.2 ess计算 (16)3.2.2 根轨迹映证 (16)3.3 动态分析K 1 (17)3.3.1 作根轨迹 (18)3.3.2 指标分析 (19)四、系统综合 (20)4.1 校正方案的设计 (20)4.2 ts问题 (20)4.3τ的确定 (21)4.3.1 绘制校正后系统—τ参数根轨迹 (21)4.3.2 绘制τ参数根轨迹 (22)4.3.3 确定满足的σp%的ξ (24)4.3.4 做等ξ线 (24)4.4 确定τA (24)五、系统模拟 (25)5.1 原系统的物理模拟 (25)5.2校正后系统的物理模拟 (26)六、设计小结 (27)6.1心得体会 (27)6.2致谢 (28)七、参考文献 (29)《自动控制原理》课程设计第一章系统概述1.1设计目的主要是培养学生的统筹运用自动控制原理课程中所学的理论知识，掌握反馈控制系统的基本理论和方法，对工程实际系统进行完整全面分析和综合。

BB-module解析

甲烷:MOL_CH4 乙烷:MOL_C2H6 丙烷:MOL_C3H8 二甲基丁烷:MOL_2C4H8 丁烷:MOL_nC4H10 正戊烷:MOL_nC5H12 正己烷:MOL_nC6H14 正庚烷:MOL_nC7H16 正辛烷:MOL_nC8H18 硫化氢:MOL_H2S 二氧化碳:MOL_CO2 氮气:MOL_N2 氢气:MOL_H2 水:MOL_H2O 氩气:MOL_Ar 氦气:MOL_He 氧气:MOL_O2 一氧化碳:MOL_CO Q_Nm3hour
Component Name
1 Methane(甲烷) 2 Nitrogen(氮) 3 Carbon Dioxide(二氧化碳)
4 Ethane(乙烷) 5 Propane(丙烷) 6 Water(水)
7 Hydrogen Sulfide(硫化氢) 8 Hydrogen(氢) 9 Carbon Monoxide(一氧化碳) 10 Oxygen (氧) 11 i-Butane(异丁烷) 14 n-Pentane(正戊烷) 17 n-Octane (辛烷) 12 n-Butane (正丁烷) 15 n-Hexane(正己烷) 18 n-Nonane(正壬烷) 21 Argon(氩气)
Function Module page 9
平均值计算模块AVERAGER
Track=ON , Reset=OFF 算法正常运行 Track=OFF OUTPUT1、OUTPUT2、TIME输出停止 Reset=ON , OUTPUT1=INPUT*SPAN, OUTPUT2=0 ,Time=0 SPAN 输入与输出的单位换算值 Output 1 平均值 Output 2 累计值 Time 上次复位到目前累计时间
Function Module page 12

硕士论文题目

硕士论文题目基于内容的声音检索方法研究及多媒体数据库eBase3.1系统实现作者姓名：胡煜导师姓名：李磊教授专业名称：应用数学答辩委员会委员（签名）主席：委员：目录摘要 (4)ABSTRACT (5)第一章前言 (6)论文贡献和内容 (6)第二章语音数字处理方法 (8)2．1前言 (8)2．1．1 语音识别的意义 (8)2．1．2 语音识别模型 (9)2．1．3 语音识别的类型和问题 (9)2．2语音信号处理方法研究 (10)2．2．1 语音信号处理基础 (10)2．2．2 语音分析 (15)2．2．3 特征匹配及识别 (21)2．3语音识别系统现状 (27)第三章语音识别策略 (29)3．1策略概要 (29)3．2特征抽取方法 (29)3．2．1 概述 (29)3．2．2 线性预测编码LPC (29)3．2．3 倒谱Cepstrum (31)3．2．4 Gabor滤波 (33)3．3索引 (33)3．3．1 概述 (33)3．3．2 基于SOM和统计检验的索引算法 (34)3．3．3 分段索引 (39)3．3．4 二重索引 (40)3．3．5 小结 (40)3．4实验结果与分析 (41)3．4．1 AudioHouse系统 (41)3．4．2 测试配置 (41)3．4．3 测试结果 (42)第四章多媒体数据库EBASE3.1 (46)4．1多媒体数据库E B ASE简介 (46)4．2多媒体数据库的系统实现 (47)4．2．1 数据建模 (47)4．2．2 逻辑框架 (48)4．2．3 功能框架 (53)4．2．4 eBase的特点 (53)4．3小结 (55)第五章前景展望 (56)第六章总结 (58)致谢 (59)参考文献 (60)摘要声音的机器识别成为一个科研课题已有四十年之久。

尽管设计可以识别语音并能辨别其含义的智能机器有不可抗拒的魅力，尽管已经投入了大量的力量去研制这样的机器，但是可以在任何环境下识别任意讲演者关于任何话题的讲演仍未实现。

IPC-7351B & PCBL Land Pattern Naming Convention

I P C-7351B N a m i n g C o n v e n t i o n f o r S t a n d a r d S M T L a n d P a t t e r n sSurface Mount Land PatternsComponent, Category Land Pattern Name Ball Grid Array’s...............................BGA + Pin Qty + C or N + Pitch P + Ball Columns X Ball Rows _ Body Length X Body Width X Height BGA w/Dual Pitch.BGA + Pin Qty + C or N + Col Pitch X Row Pitch P + Ball Columns X Ball Rows _ Body Length X Body Width X Height BGA w/Staggered Pins..................BGAS + Pin Qty + C or N + Pitch P + Ball Columns X Ball Rows _ Body Length X Body Width X Height BGA Note: The C or N = Collapsing or Non-collapsing BallsCapacitors, Chip, Array, Concave..........................................................CAPCAV + Pitch P + Body Length X Body Width X Height - Pin Qty Capacitors, Chip, Array, Flat..................................................................CAPCAF + Pitch P + Body Length X Body Width X Height - Pin Qty Capacitors, Chip, Non-polarized.................................................................................................CAPC + Body Length + Body Width X Height Capacitors, Chip, Polarized.....................................................................................................CAPCP + Body Length + Body Width X Height Capacitors, Chip, Wire Rectangle........................................................................................CAPCWR + Body Length + Body Width X Height Capacitors, Molded, Non-polarized...........................................................................................CAPM + Body Length + Body Width X Height Capacitors, Molded, Polarized.................................................................................................CAPMP + Body Length + Body Width X Height Capacitors, Aluminum Electrolytic ............................................................................................................CAPAE + Base Body Size X Height Ceramic Flat Packages.....................................................................................................CFP127P + Lead Span Nominal X Height - Pin Qty Column Grid Array’s.....................................................CGA + Pitch P + Number of Pin Columns X Number of Pin Rows X Height - Pin Qty Crystals (2 leads)........................................................................................................................XTAL + Body Length X Body Width X Height Dual Flat No-lead..........................................................................................................DFN + Body Length X Body Width X Height – Pin Qty Diodes, Chip................................................................................................................................DIOC + Body Length + Body Width X Height Diodes, Molded...........................................................................................................................DIOM + Body Length + Body Width X Height Diodes, MELF................................................................................................................................DIOMELF + Body Length + Body Diameter Fuses, Molded............................................................................................................................FUSM + Body Length + Body Width X Height Inductors, Chip.............................................................................................................................INDC + Body Length + Body Width X Height Inductors, Molded........................................................................................................................INDM + Body Length + Body Width X Height Inductors, Precision Wire Wound................................................................................................INDP + Body Length + Body Width X Height Inductors, Chip, Array, Concave..............................................................INDCAV + Pitch P + Body Length X Body Width X Height - Pin Qty Inductors, Chip, Array, Flat......................................................................INDCAF + Pitch P + Body Length X Body Width X Height - Pin Qty Land Grid Array, Round Lead............................LGA + Pin Qty - Pitch P + Pin Columns X Pin Rows _ Body Length X Body Width X Height Land Grid Array, Square Lead........................LGAS + Pin Qty - Pitch P + Pin Columns X Pin Rows _ Body Length X Body Width X Height LED’s, Molded............................................................................................................................LEDM + Body Length + Body Width X Height Oscillators, Side Concave........................................................................OSCSC + Pitch P + Body Length X Body Width X Height - Pin Qty Oscillators, J-Lead.......................................................................................OSCJ + Pitch P + Body Length X Body Width X Height - Pin Qty Oscillators, L-Bend Lead.............................................................................OSCL + Pitch P + Body Length X Body Width X Height - Pin Qty Oscillators, Corner Concave....................................................................................................OSCCC + Body Length X Body Width X Height Plastic Leaded Chip Carriers..................................................PLCC + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height - Pin Qty Plastic Leaded Chip Carrier Sockets Square.......................PLCCS + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height - Pin Qty Quad Flat Packages..................................................................QFP + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height - Pin Qty Ceramic Quad Flat Packages.................................................CQFP + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height - Pin Qty Quad Flat No-lead................................................................QFN + Pitch P + Body Width X Body Length X Height - Pin Qty + Thermal Pad Pull-back Quad Flat No-lead..............................................PQFN + Pitch P + Body Width X Body Length X Height - Pin Qty + Thermal Pad Quad Leadless Ceramic Chip Carriers..........................................................LCC + Pitch P + Body Width X Body Length X Height - Pin Qty Quad Leadless Ceramic Chip Carriers (Pin 1 on Side)...............................LCCS + Pitch P + Body Width X Body Length X Height - Pin Qty Resistors, Chip...........................................................................................................................RESC + Body Length + Body Width X Height Resistors, Molded......................................................................................................................RESM + Body Length + Body Width X Height Resistors, MELF...........................................................................................................................RESMELF + Body Length + Body Diameter Resistors, Chip, Array, Concave............................................................RESCAV + Pitch P + Body Length X Body Width X Height - Pin Qty Resistors, Chip, Array, Convex, E-Version (Even Pin Size)...............RESCAXE + Pitch P + Body Length X Body Width X Height - Pin Qty Resistors, Chip, Array, Convex, S-Version (Side Pins Diff)................RESCAXS + Pitch P + Body Length X Body Width X Height - Pin Qty Resistors, Chip, Array, Flat.....................................................................RESCAF + Pitch P + Body Length X Body Width X Height - Pin Qty Small Outline Diodes, Flat Lead...................................................................................SODFL + Lead Span Nominal + Body Width X Height Small Outline IC, J-Leaded........................................................................................SOJ + Pitch P +Lead Span Nominal X Height - Pin Qty Small Outline Integrated Circuit, (50 mil Pitch SOIC)......................................................SOIC127P +Lead Span Nominal X Height - Pin Qty Small Outline Packages............................................................................................SOP + Pitch P +Lead Span Nominal X Height - Pin Qty Small Outline No-lead...........................................................SON + Pitch P + Body Width X Body Length X Height - Pin Qty + Thermal Pad Pull-back Small Outline No-lead.........................................PSON + Pitch P + Body Width X Body Length X Height - Pin Qty + Thermal Pad Small Outline Transistors, Flat Lead....................................................................SOTFL + Pitch P + Lead Span Nominal X Height - Pin Qty SOD (Example: SOD3717X135 = JEDEC SOD123)........................................................SOD + Lead Span Nominal + Body Width X Height SOT89 (JEDEC Standard Package).......................................................................................................................................................SOT89 SOT143 & SOT343 (JEDEC Standard Package)..............................................................................................................SOT143 & SOT343 SOT143 & SOT343 Reverse (JEDEC Standard Package)...........................................................................................SOT143R & SOT343R SOT23 & SOT223 Packages (Example: SOT230P700X180-4)...............................SOT + Pitch P + Lead Span Nominal X Height - Pin Qty TO (Generic DPAK - Example: TO228P970X238-3).................................................................TO + Pitch P + Lead Span X Height - Pin QtyI P C-7351B L a n d P a t t e r n N a m i n g C o n v e n t i o n N o t e s•All dimensions are in Metric Units•All Lead Span and Height numbers go two places past the decimal point and “include” trailing Zeros•All Lead Span and Body Sizes go two place before the decimal point and “remove” leading Zeros•All Chip Component Body Sizes are one place to each side of the decimal point•Pitch Values are two places to the right & left of decimal point with no leading Zeros but include trailing zeros N a m i n g C o n v e n t i o n S p e c i a l C h a r a c t e r U s e f o r L a n d P a t t e r n sThe _ (underscore) is the separator between pin Qty in Hidden & Deleted pin componentsThe – (dash) is used to separate the pin qty.The X (capital letter X) is used instead of the word “by” to separate two numbers such as height X width like “Quad Packages”.P C B L i b r a r i e s S u f f i x N a m i n g C o n v e n t i o n f o r L a n d P a t t e r n sCommon SMT Land Pattern to Describe Environment Use (This is the last character in every name)Note: This excludes the BGA component family as they only come in the Nominal Environment Condition •M.................Most Material Condition (Level A)•N..................Nominal Material Condition (Level B)•L.................Least Material Condition (Level C)Alternate Components that do not follow the JEDEC, EIA or IEC Standard•A..................Alternate Component (used primarily for SOP & QFP when Component Tolerance or Height is different) •B..................Second Alternate ComponentReverse Pin Order•-20RN..........20 pin part, Reverse Pin Order, Nominal EnvironmentHidden Pins•-20_24N......20 pin part in a 24 pin package. The pins are numbered 1 – 24 the hidden pins are skipped. The schematic symbol displays up to 24 pins.Deleted Pins•-24_20N......20 pin part in a 24 pin package. The pins are numbered 1 – 20. The schematic symbol displays 20 pins. JEDEC and EIA Standard parts that have several alternate packages•AA, AB, AC.JEDEC or EIA Component IdentifierGENERAL SUFFIXES_HS.........................HS = Land Pattern with Heat Sink attachment requiring additional holes or padsExample: TO254P1055X160_HS-6N_BEC......................BEC = Base, Emitter and Collector (Pin assignments used for three pin Transistors)Example: SOT95P280X160_BEC-3N_SGD......................SGD = Source, Gate and Drain (Pin assignments used for three pin Transistors)Example: SOT95P280X160_SGD-3N_213........................213 = Alternate pin assignments used for three pin TransistorsExample: SOT95P280X160_213-3NP C B L i b r a r i e s N a m i n g C o n v e n t i o n f o r N o n-S t a n d a r d S M T L a n d P a t t e r n s Surface Mount Land PatternsComponent, Category Land Pattern Name Amplifiers....................................................................................................................................................AMP_ Mfr.’s Part Number Batteries......................................................................................................................................................BAT_ Mfr.’s Part Number Capacitors, Variable..................................................................................................................................CAPV_Mfr.’s Part Number Capacitors, Chip, Array, Concave (Pins on 2 or 4 sides)..............................................................CAPCAV_Mfr Series No. - Pin Qty Capacitors, Chip, Array, Flat (Pins on 2 sides)..............................................................................CAPCAF_Mfr Series No. - Pin Qty Capacitors, Miscellaneous............................................................................................................................CAP_Mfr.’s Part Number Crystals......................................................................................................................................................XTAL_Mfr.’s Part Number Diodes, Miscellaneous...................................................................................................................................DIO_Mfr.’s Part Number Diodes, Bridge Rectifiers............................................................................................................................DIOB_Mfr.’s Part Number Ferrite Beads..................................................................................................................................................FB_Mfr.’s Part Number Fiducials......................................................................................................................................FID + Pad Size X Solder Mask Size Filters..............................................................................................................................................................FIL_Mfr.’s Part Number Fuses..........................................................................................................................................................FUSE_Mfr.’s Part Number Fuse, Resettable.....................................................................................................................................FUSER_Mfr.’s Part Number Inductors, Miscellaneous...............................................................................................................................IND_Mfr.’s Part Number Inductors, Chip, Array, Concave (Pins on 2 or 4 sides)..................................................................INDCAV_Mfr Series No. - Pin Qty Inductors, Chip, Array, Flat (Pins on 2 sides).................................................................................INDCAF_Mfr Series No. - Pin Qty Keypad.................................................................................................................................................KEYPAD_Mfr.’s Part Number LEDS............................................................................................................................................................LED_Mfr.’s Part Number LEDS, Chip...................................................................................................................................................LED_Mfr.’s Part Number Liquid Crystal Display...................................................................................................................................LCD_Mfr.’s Part Number Microphones..................................................................................................................................................MIC_Mfr.’s Part Number Opto Isolators............................................................................................................................................OPTO_Mfr.’s Part Number Oscillators......................................................................................................................................OSC_Mfr.’s Part Number - Pin Qty Quad Flat Packages w/Bumper Corners, Pin 1 Side.............BQFP + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height - Pin Qty Quad Flat Packages w/Bumper Corners, 1 Center..............BQFPC + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height - Pin Qty Resistors, Chip, Array, Concave (Pins on 2 or 4 sides).................................................................RESCAV_Mfr Series No. - Pin Qty Resistors, Chip, Array, Convex Type E (Pins on 2 sides)...........................................................RESCAXE_Mfr Series No. - Pin Qty Resistors, Chip, Array, Convex Type S (Pins on 2 sides)...........................................................RESCAXS_Mfr Series No. - Pin Qty Resistors, Chip, Array, Flat (Pins on 2 sides)................................................................................RESCAF_Mfr Series No. - Pin Qty Relays.....................................................................................................................................................RELAY_Mfr.’s Part Number Speakers....................................................................................................................................................SPKR_Mfr’s Part Number Switches........................................................................................................................................................SW_Mfr.’s Part Number Test Points, Round......................TP + Pad Size (1 place left of decimal and 2 places right of decimal, Example TP100 = 1.00mm) Test Points, Square...............................................................TPS + Pad Size (1 place left of decimal and 2 places right of decimal) Test Points, Rectangle....................................TP + Pad Length X Pad Width (1 place left of decimal and 2 places right of decimal) Thermistors.............................................................................................................................................THERM_Mfr.’s Part Number Transceivers.............................................................................................................................................XCVR_ Mfr.’s Part Number Transducers (IRDA’s)................................................................................................................................XDCR_Mfr.’s Part Number Transient Voltage S_Mfr.’s Part Number Transient Voltage Suppressors, SP_Mfr.’s Part Number Transistor Outlines, Custom....................................................................................................................TRANS_Mfr.’s Part Number Transformers.............................................................................................................................................XFMR_Mfr.’s Part Number Trimmers & Potentiometers........................................................................................................................TRIM_Mfr.’s Part Number Tuners.....................................................................................................................................................TUNER_Mfr.’s Part Number Varistors.......................................................................................................................................................VAR_Mfr.’s Part Number Voltage Controlled Oscillators.....................................................................................................................VCO_Mfr.’s Part Number Voltage Regulators, Custom......................................................................................................................VREG_Mfr.’s Part NumberI P C-7251N a m i n g C o n v e n t i o n f o r T h r o u g h-H o l e L a n d P a t t e r n sThe land pattern naming convention uses component dimensions to derive the land pattern name.The first 3 – 6 characters in the land pattern name describe the component family.The first number in the land pattern name refers to the Lead Spacing or hole to hole location to insert the component lead.All numbers that follow the Lead Spacing are component dimensions.These characters are used as component body identifiers that precede the value and this is the priority order of the component body identifiers –P = Pitch for components with more than two leadsW = Maximum Lead Width (or Component Lead Diameter)L = Body Length for horizontal mountingD = Body Diameter for round component bodyT = Body Thickness for rectangular component bodyH = Height for vertically mounted componentsQ = Pin Quantity for components with more than two leadsR = Number of Rows for connectorsA, B & C = the fabrication complexity level as defined in the IPC-2221 and IPC-2222Notes:All component body values are in millimeters and go two places to the right of the decimal point and no leading zeros.All Complexity Levels used in the examples are “B”.Component, Category Land Pattern Name Capacitors, Non Polarized Axial Diameter Horizontal Mounting.........CAPAD + Lead Spacing + W Lead Width + L Body Length + D Body Diameter Example: CAPAD800W52L600D150BCapacitors, Non Polarized Axial Diameter; Lead Spacing 8.00; Lead Width 0.52; Body Length 6.00; Body Diameter 1.50Capacitors, Non Polarized Axial Rectangular.........CAPAR + Lead Spacing + W Lead Width + L Body Length + T Body thickness + H Body Height Example: CAPAR800W52L600T50H70BCapacitors, Non Polarized Axial; Lead Spacing 8.00; Lead Width 0.52; Body Length 6.00; Body Thickness 0.50; Body Height 0.70Capacitors, Non Polarized Axial Diameter Vertical Mounting .........CAPADV + Lead Spacing + W Lead Width + L Body Length + D Body Diameter Example: CAPADV300W52L600D150BCapacitors, Non Polarized Axial; Lead Spacing 3.00; Lead Width 0.52; Body Length 6.00; Body Diameter 1.50mmCapacitors, Non Polarized Axial Rect. Vert. Mtg.CAPARV + Lead Spacing + W Lead Width + L Body Length + T Body Thickness + H Body Height Example: CAPARV300W52L600T50H70BCapacitors, Non Polarized Axial Rect. Vertical; Lead Spacing 8.00; Lead Width 0.52; Body Length 6.00; Body Thickness 0.50; Body Height 0.70 Capacitors, Non Polarized Radial Diameter.......................................CAPRD + Lead Spacing + W Lead Width + D Body Diameter + H Body Height Example: CAPRD200W52D300H550BCapacitors, Non Polarized Radial Diameter; lead spacing 2.00; lead width 0.52; Body Diameter 3.00; Height 5.50Capacitors, Non Polarized Radial Rectangular.......CAPRR + Lead Spacing + W Lead Width + L Body Length + T Body thickness + H Body Height Example: CAPRR200W52L50T70H550BCapacitors, Non Polarized Radial Rectangular; lead spacing 2.00; lead width 0.52; Body Length 0.50; Body thickness 0.70; Height 5.50 Capacitors, Non Polarized Radial Disk Button........CAPRB + Lead Spacing + W Lead Width + L Body Length + T Body thickness + H Body Height Example: CAPRB200W52L50T70H550BCapacitors, Non Polarized Radial Rectangular; lead spacing 2.00; lead width 0.52; Body Length 0.50; Body thickness 0.70; Height 5.50 Capacitors, Polarized Axial Diameter Horizontal Mounting................CAPPA + Lead Spacing + W Lead Width + L Body Length + D Body Diameter Example: CAPPAD800W52L600D150BCapacitors, Polarized Axial Diameter; Lead Spacing 8.00; Lead Width 0.52; Body Length 6.00; Body Diameter 1.50Capacitor, Polarized Radial Diameter.................................................CAPPR + Lead Spacing + W Lead Width + D Body Diameter + H Body Height Example: CAPPRD200W52D300H550BCapacitors, Polarized Radial Diameter; lead spacing 2.00; lead width 0.52; Body Diameter 3.00; Height 5.50Diodes, Axial Diameter Horizontal Mounting.......................................DIOAD + Lead Spacing + W Lead Width + L Body Length + D Body Diameter Example: DIOAD800W52L600D150BCapacitors, Non Polarized Axial Diameter; Lead Spacing 8.00; Lead Width 0.52; Body Length 6.00; Body Diameter 1.50Diodes, Axial Diameter Vertical Mounting .........................................DIOADV + Lead Spacing + W Lead Width + L Body Length + D Body Diameter Example: DIOADV300W52L600D150BCapacitors, Non Polarized Axial; Lead Spacing 8.00; Lead Width 0.52; Body Length 6.00; Body Diameter 1.50Dual-In-Line Packages...................................DIP + Lead Span + W Lead Width + P Pin Pitch + L Body Length + H Component Height + Q Pin Qty Example: DIP762W52P254L1905H508Q14BDual-In-Line Package: Lead Span 7.62; Lead Width 0.52; Pin Pitch 2.54; Body Length 19.05; Body Height 5.08; Pin Qty 14Component, Category Land Pattern Name Dual-In-Line Sockets....................................DIPS + Lead Span + W Lead Width + P Pin Pitch + L Body Length + H Component Height + Q Pin Qty Example: DIPS762W52P254L1905H508Q14BDual-In-Line Package Socket: Lead Span 7.62; Lead Width 0.52; Pin Pitch 2.54; Body Length 19.05; Body Height 5.08; Pin Qty 14Headers, Vertical....... HDRV + Lead Span + W Lead Width + P Pin Pitch + R Pins per Row + L Body Length + T Body Thickness + H Component HeightExample: HDRV200W52P200R2L4400T400H900BHeader, Vertical: Lead Span 2.00; Lead Width 0.52; Pin Pitch 2.00; 2 Rows; Body Length 44.00; Body Thickness 4.00; Body Height 9.00 Headers, Right Angle...............HDRRA + Lead Span + W Lead Width + P Pin Pitch + R Pins per Row + L Body Length + T Body Thickness + H Component HeightExample: HDRRA200W52P200R2L4400T400H900BHeader, Vertical: Lead Span 2.00; Lead Width 0.52; Pin Pitch 2.00; 2 Rows; Body Length 44.00; Body Thickness 4.00; Body Height 9.00 Inductors, Axial Diameter Horizontal Mounting....................................INDAD + Lead Spacing + W Lead Width + L Body Length + D Body Diameter Example: INDAD800W52L600D150BInductors, Axial Diameter; Lead Spacing 8.00; Lead Width 0.52; Body Length 6.00; Body Diameter 1.50Inductors, Axial Diameter Vertical Mounting .....................................INDADV + Lead Spacing + W Lead Width + L Body Length + D Body Diameter Example: INDADV300W52L600D150BInductors, Axial Diameter Vertical Mounting; Lead Spacing 3.00; Lead Width 0.52; Body Length 6.00; Body Diameter 1.50Jumpers, Wire...................................................................................................................................................JUMP + Lead Spacing + W Lead Width Example: JUMP500W52BJumper; Lead Spacing 5.00; Lead Width 0.52Mounting Holes Plated With Support Pad..........................................................................MTGP + Pad Size + H Hole Size + Z Inner Layer Pad Size Example: MTGP700H400Z520This is a Mounting hole for a #6-32 screw using a circular 7.00 land on the primary and secondary side of the board, a 4.00 diameter hole with the internal lands are smaller that the external and are also circular 5.20 in diameter.Mounting Holes Non-Plated With Support Pad................................................................MTGNP + Pad Size + H Hole Size + Z Inner Layer Pad Size Example: MTGNP700H400Z520This is a Mounting hole for a #6-32 screw using a circular 7.00 land on the primary and secondary side of the board, a 4.00 diameter hole with the internal lands are smaller that the external and are also circular 5.20 in diameter.Mounting Holes Non-Plated Without Support Pad.....................MTGNP + Pad Size + H Hole Size + Z Inner Layer Pad Size + K Keep-out Diameter Example: MTGNP100H400Z520K700This is a Mounting hole for a #6-32 screw using a circular 1mm land on the primary and secondary side of the board, a 4.00 diameter hole with the internal lands are smaller that the external and are also circular 5.20 in diameter and a 7.00 diameter keep-out.Mounting Holes Plated with 8 Vias .....................................................................MTGP + Pad Size + H Hole Size + Z Inner Layer Pad Size + 8 Vias Example: MTGP700H400Z520V8This is a Mounting hole for a #6-32 screw using a circular 7mm land on the primary and secondary side of the board, a 4mm diameter hole with the internal lands are smaller that the external and are also circular 5.2mm in diameter, with 8 vias.Pin Grid Array’s.............................PGA + Pin Qty + P Pitch + C Pin Columns + R Pin Rows + L Body Length X Body Width + H Component Height Example: PGA84P254C10R10L2500X2500H300BPin Grid Array: Pin Qty 84; Pin Pitch 2.54; Columns 10; Rows 10; Body Length 25.00 X 25.00; Component Height 3.00Resistors, Axial Diameter Horizontal Mounting...................................RESAD + Lead Spacing + W Lead Width + L Body Length + D Body Diameter Example: RESAD800W52L600D150BResistors, Axial Diameter; Lead Spacing 8.00; Lead Width 0.52; Body Length 6.00; Body Diameter 1.50Resistors, Axial Diameter Vertical Mounting ....................................RESADV + Lead Spacing + W Lead Width + L Body Length + D Body Diameter Example: RESADV300W52L600D150BResistors, Axial Diameter Vertical Mounting; Lead Spacing 3.00; Lead Width 0.52; Body Length 6.00; Body Diameter 1.50Resistors, Axial Rectangular Horizontal Mounting...RESAR + Lead Spacing + W Lead Width + L Body Length + T Body thickness + H Body Height Example: RESAR800W52L600T50H70BResistors, Axial Rectangular; Lead Spacing 8.00; Lead Width 0.52; Body Length 6.00; Body Thickness 0.50; Body Height 0.70Test Points, Round Land......................................................................................................................................................................TP + Lead Width Example: TP52Test Points, Square Land..................................................................................................................................................................TPS + Lead Width Example: TPS52Test Points, Top Land Round & Bottom Land Square.....................................................................................................................TPRS + Lead Width Example: TPRS52 Wire....................................................................................................................................................................................................PAD + Wire Width Example: PAD52。

three field plot analysis -回复

three field plot analysis -回复[三字段图分析] 是一种常用于解释数据关系和趋势的分析方法。

它通过可视化的方式将三个相关的字段或变量在同一图表中呈现，帮助我们更好地理解数据。

这种分析方法广泛应用于不同领域，如经济学、市场研究、环境科学等等。

本文将一步一步回答关于三字段图分析的问题，并探讨其实际应用。

第一步：选择合适的数据集和变量在进行三字段图分析之前，我们需要选择合适的数据集和要研究的变量。

数据集应该具有足够数量的数据点，并且包含我们感兴趣的字段。

例如，如果我们想研究销售数据，那么我们需要一个包含销售额、销售员和时间的数据集。

第二步：绘制三字段图绘制三字段图时，我们需要选择合适的图表类型。

常用的图表类型包括散点图、线图和柱状图等。

根据数据的特点和我们关注的变量之间的关系，选择最合适的图表类型进行绘制。

例如，如果我们想研究销售员的销售额随时间的变化趋势，那么可以选择绘制线图。

第三步：分析数据通过观察三字段图，我们可以进行一些简单的数据分析。

首先，我们可以判断变量之间的关系是正相关还是负相关。

如果数据点呈线性或近似线性分布，且斜率为正，那么变量之间可能存在正相关关系。

相反，如果斜率为负，那么变量之间可能存在负相关关系。

其次，我们可以观察数据的分布模式。

如果数据点较为集中，形成一个紧密的群组，那么可以认为变量之间的关系较为密切。

如果数据点分散在图表中不同的位置，那么变量之间可能不存在明显的关系。

第四步：进一步分析和解读结果三字段图只是一个初步的数据分析工具，我们还可以通过进一步的分析和解读来深入理解数据。

例如，我们可以计算相关系数来度量变量之间的相关性强度。

相关系数的值范围从-1到1，接近1表示强正相关，接近-1表示强负相关，接近0表示无相关性。

此外，我们还可以利用回归分析来预测和解释数据变量之间的关系。

通过建立数学模型，我们可以根据已有的数据点来预测未来的趋势和结果。

实际应用：三字段图分析可以适用于许多领域。

实习五应用Grapher绘制岩石矿物成分三角图

实习五应用Grapher绘制岩石矿物成分三角图实习五应用Grapher绘制岩石矿物成分三角图实验报告学生姓名:专业班级:指导教师:时间: 2014-5-131(实验目的三角图是石油地质学中用于确定岩石分类、石油分类、组分分区等常用的图件之一。

三角图中的任意一点由三个代表不同含义的数值构成，如岩石学分类中的三端元一般是石英、长石和岩屑。

本次实习要求掌握应用Grapher软件绘制岩石矿物成分三角图的方法。

2(实验方案由于各家采用的分类准则不同，所选的三角图的端元也就不一样，成因解释也就不同。

目前在国内较为流行的是曾允孚等的成分一成因分类方案，现概述如下:首先，根据杂基占全岩的百分含量分为两大类，即杂基少于15% 的净砂岩(简称砂岩)和杂基大于15% 的杂砂岩。

再把碎屑颗粒的总含量视为100% ，通过三个端元在三角图中的投点来细分砂岩类型。

其三个端元所代表的碎屑物质组分为:Q(石英)端元、F(长石)端元、R(岩屑)端元。

砂岩分类三角图被进一步划分为三个大区、七种砂岩类型，即首先根据Q端元的含量95% 和75% 值为界分为三大区，依次为石英砂岩区(I)、过渡区(?,IlI)、长石砂岩一岩屑砂岩区(?, ?)。

然后再根据F端元和R端元的相对含量将后两个区加以细分，总共划分了七种类型(I(石英(杂)砂岩;?(长石石英(杂)砂岩;?(岩屑石英(杂)砂岩;lV(长石(杂)砂岩;V(岩屑长石(杂)砂岩;VI(长石岩屑(杂)砂岩;?(岩屑(杂)砂岩)。

3、关键步骤描述- 2 -3.1 步骤一打开Grapher，依次选择【File】-【New】-【Worksheet】选项，新建一个Worksheet。

将鼠标选定Worksheet的某个单元格，通过【File】-【import】将所要用到的Excel文件中的数据导入到Worksheet中，保存Worksheet文件。

3.2 步骤二从【Graph】菜单的下拉菜单中选择【Specialty Graph】–【Ternary Diagram… 】命令，软件会自动弹出打开文件对话框，从打开文件对话框中打开步骤一中保存的Worksheet文件，软件就会根据所提供的数据绘制一个三角图。

gba洛克人zero3完全攻略

=全装甲解说=头部自动蓄力 (001号磁碟)站着不动会自动补血 (002号磁碟)蓄力时间缩短(003号磁碟)身体雷电属性（打败蝙蝠后得到）冰冻属性（打败冰兔后得到）火焰属性（打败火花龙后得到）重力装甲，受伤不会后退（打败机械狗后得到）站在流沙上不会沉陷（打败螳螂后得到）脚部贴在墙上的下滑速度减慢(004号磁碟)在冰的地面不打滑移动速度加快冲刺时无敌（注意也加不到东西）二段跳水上飘，可以踩水面跳(005号磁碟)全能鞋，上述能力都有(打败隐将后得到,006号磁碟)未标明的游戏流程中可得到=全EX技解说=(评价为A或以上才可到手)枪技能,蓄力,可以放出能反弹的激光。

枪技能,装备雷电芯片,可射出两个方向的V型弹.枪技能,装备火焰芯片,蓄力可以放出火球,遇敌或障碍爆炸.枪技能,装备冰冻芯片,蓄力可以放出三支冰针.剑技能,冲刺时按B,向前突刺攻击.剑技能,下+B(空中),垂直向下攻击.装被雷电芯片有特殊效果剑技能,在地面,上+B,可以向上攻击,升龙斩!装备火焰芯片有特殊效果=金手指=体力 02038044:10 人数 020372B0:09 无敌 02038034:50 S级 020372B1:06 E-C 0203805A:270F E罐 0203805C:EX特技 02038068:FFFF全装备0203806A:FFFF0203806C:FFFF全精灵 Codebreaker码01010000004A 0001全磁卡 Codebreaker码420371B8 0F0F0000002D 0001 BOSS体力 0203BE44:00 传送全开 020372C4:FFFF 小游戏全开0200244A:443E0200244C:5C56504A02002450:61剑技能,在地面,下+B,可放出剑气.装备冰冻芯片有特殊效果拐技能,连按B,可以用拐连续攻击.拐技能,蓄力后按上+B,可以向上放出母弹,并分裂出四个子弹.装备火焰芯片有特殊效果盾技能,蓄力后放开,盾会沿地面飞出.装备雷电芯片会有特殊效果.盾技能,蓄力后按下放开,盾会围绕身体转动=隐藏模式=HARD模式通关一次后按住L重新开始,可进入HARD模式具体:光剑和枪蓄力不可,且光剑无三段斩,没有异空间传送门（倒数第2关除外）究级模式集齐磁碟通关后按住R重新开始,可进入超级模式可用搓招方法出蓄力技,一开始即有2层HP(64点),四头盔,四腿部,2E罐,且无须收集磁碟所有永久效果的精灵全部使用--究级ZERO出招表--光剑: 下+B,B,B 三连斩第三斩变为剑气上+B,B,B 三连斩第三斩变为向上砍41236+B or 632+B 剑蓄力斩跳跃中上+B 空圆斩冲刺中上or下+B 土龙斩枪: 236+B 一级蓄力236236+B 二级蓄力拐: 236+B 蓄力击向前632+B 蓄力击向下698+B 蓄力击向上盾236+B 蓄力盾飞出632+B EX蓄力旋转盾=全小游戏取得方法=单机下ZERO：任意通关一次雪儿：任意模式S级通关得到COPY-X：HARD模式S级通关得到贤将：任意模式只用剑S级通关隐将：任意模式只用枪S级通关斗将和妖将：任意模式全100分通关-__-!PS：只用枪剑的，用其他武器只要不对敌人造成伤害，不影响结果=磁盘=这次ZERO3的收集要素不再是精灵了，而是磁盘，共有180张。

Harmony 分析方法

目录完成一个分析 (5)Analytical解析法 (5)Custom用户自定义分析 (5)Decline常规递减分析 (5)FMB流动物质平衡法 (6)Forecast生产预测 (6)Gas AOF/TPC气体无阻流量/油管性能曲线 (6)Material Balance物质平衡 (7)Numerical数值法 (7)PSS ModelPSS模型 (7)Ratio Analysis比率分析 (8)Risk & Sensitivity风险和敏感性分析 (8)Type Well特征井 (8)Typecurve特征曲线 (8)Unconventional Reservoir非常规油气藏模块 (9)Volumetrics容量法 (9)完成一个解析法分析 (10)创建一个解析模型 (10)配置模型 (11)历史拟合 (11)生产预测 (11)模拟和测试设计 (11)模拟复杂多层系统 (11)建立用户自定义工作表 (12)完成一个递减分析 (13)传统递减分析 (14)致密气/页岩气递减分析 (15)完成一个流动物质平衡分析 (18)创建一个流动物质平衡分析 (19)单一油气藏的井组分析 (19)水侵的油气藏分析 (19)考虑压力对渗透率影响及岩石渗透率的物质平衡分析 (19)考虑页岩气吸附气的物质平衡分析 (19)创建一个预测工作表 (19)比率预测 (20)水油比预测 (22)自定义预测 (24)合并预测 (27)采用预测工作表 (29)完成一个气藏AOF/TPC 分析 (30)简单气体导流能力模型(C,n) (31)Forchheimer气体导流模型(LIT) (34)自定义导流分析 (35)气体油管性能曲线 (37)AOF/TPC处理选项 (38)概况窗口 (39)TPC 概况窗口 (39)AOF概况窗口 (40)工作点概况窗口 (40)完成一个物质平衡分析 (44)油的物质平衡(OMB) (44)创建一个油的物质平衡分析 (44)图，参数和数据展示 (46)气体物质平衡（GMB） (47)创建一个气体物质平衡分析 (48)视图和参数 (50)高级选项 (51)CBM物质平衡 (53)创建一CBM物质平衡分析 (53)King CBM 物质平衡分析 (54)Seidle CBM 物质平衡分析 (55)Jensen & Smith CBM物质平衡分析 (55)创建一个数值模型 (41)创建一个数值模型 (42)应用数值模型 (42)数值模型的局限性 (43)数值模型在F.A.S.T. RTA™ and F.A.S.T. CBM™中的不同 (43)完成一个压力梯度分析 (44)创建一个压力梯度分析 (56)数据诊断 (58)创建一个PSS 模型 (59)整合参数 (59)创建一个PSS 模型预测 (60)附加预测特性 (61)表皮随时间变化 (61)裂缝 (62)各向异性 (62)预测CO2生产 (63)负荷系数 (64)增速特性 (65)水体 (65)预测细节 (65)历史拟合 (66)完成一个历史拟合 (66)历史拟合方法 (66)历史拟合预测 (66)完成一个比率分析 (66)水油比(WOR) (67)含油率 (68)完成一个风险&敏感性分析 (69)风险分析 (69)参数标签栏 (70)视图类型 (74)相关性标签 (75)定义运行次数 (75)计算和结果标签栏 (76)百分数 (77)综合图表标签栏 (77)敏感性分析 (78)定义最高及最低限 (79)敏感性分析结论Sensitivity Results (80)计算 (81)完成一个监测分析 (81)霍尔图分析 (82)孔隙替代率(VRR)分析 (85)VRR 分析参数 (87)比较VRR模型 (88)完成一个特征井分析 (90)创建一个特征井分析 (91)在井面板中移除异常井 (93)设置初试日期与极值的偏移 (94)数据设置视图选项 (96)X-轴 (97)Y-轴 (97)其他 (98)完成一个特征曲线分析 (98)创建一个特征曲线分析 (99)共同特性 (99)模型 (99)吸附性、岩石力学性质、拟稳态水驱和多层井分析 (100)特征曲线图 (100)Agarwal-Gardner特征曲线分析 (101)边界流拟合 (102)瞬态流拟合 (102)Blasingame 特征曲线分析方法 (102)边界流拟合 (102)瞬态流拟合 (103)Fetkovich特征曲线分析方法 (103)边界流拟合 (103)瞬态流拟合 (104)时间重新初始化 (104)无因次压力积分(NPI)特征曲线分析方法 (105)边界流拟合 (106)瞬态流拟合 (106)瞬时特征曲线分析方法 (106)边界流拟合 (106)瞬态流拟合 (107)Wattenbarger 特征曲线分析方法 (107)边界流拟合 (107)瞬态流拟合 (107)创建一个非常规储藏模型 (108)创建一个非常规储藏分析 (108)视图和参数 (111)视图 (111)参数 (116)垂直和水平井 (117)常压和变压 (117)完成一个容量法分析 (118)油的容量法 (118)气体容量法 (120)CBM 容量法 (121)完成一个分析Analytical解析法Custom用户自定义分析Decline常规递减分析FMB流动物质平衡法Forecast生产预测Gas AOF/TPC气体无阻流量/油管性能曲线Material Balance物质平衡Numerical数值法PSS Model PSS模型Ratio Analysis比率分析Risk & Sensitivity风险和敏感性分析Type Well特征井特征曲线TypecurveUnconventional Reservoir非常规油气藏模块Volumetrics容量法完成一个解析法分析子标题:建立一个解析模型配置模型历史数据拟合预测模拟和测试设计模拟复杂多层系统解析法模型用于验证对于生产的解释和预测。

基于Grapher实现岩石地球化学常用图解

基于Grapher实现岩石地球化学常用图解梁飞达;徐小强;荣飞;高玉丹;刘志洁;苏小雨【摘要】岩石地球化学图解在岩石学及地球化学研究过程中具有重要意义。

通过Grapher软件中的散点图、折线图、三元散点图可以完成岩石地球化学常用图解的绘制。

完成的图解有二元成分变异图解、三元成分变异图解以及球粒陨石标准化稀土元素的配分模式图。

其操作简单又能很好的表达出地质工作者想要的岩石地球化学图解。

【期刊名称】《黑龙江科技信息》【年(卷),期】2016(000)001【总页数】3页(P57-59)【关键词】Grapher;岩石地球化学图解;数据【作者】梁飞达;徐小强;荣飞;高玉丹;刘志洁;苏小雨【作者单位】石家庄经济学院资源学院，河北石家庄 050031;石家庄经济学院资源学院，河北石家庄 050031;石家庄经济学院资源学院，河北石家庄 050031;石家庄经济学院资源学院，河北石家庄 050031;石家庄经济学院资源学院，河北石家庄 050031;石家庄经济学院资源学院，河北石家庄 050031【正文语种】中文Grapher是Golden Software公司发行的一款绘图软件，具有强大的数理统计功能和数十种基于二维或三维数据的图形类型[1]。

Grapher能绘制的图形有散点图，折线图、柱状图，饼状图、箱线图、Q-Q图、极线图，玫瑰图和三元图等。

岩石化学图解和地球化学图解充分利用主量元素、微量元素以及同位素的地球化学行为，从不同的方面揭示和诠释了岩石特征及其成因联系、岩石分类及其组合、成岩成矿过程等，为岩石学、构造地质学、地球化学、矿床学等研究领域的研究提供了重要的途径和手段[2]。

本文试着用Grapher10软件中的散点图、折线图和三元图等实现对二元成分变异图解、三元系图解和稀土元素标准化图解。

二元成分变异图解是选用两个相关岩石化学或地球化学变量进行投影，其主要说明主量之间的相关性，其主要目的是要说明样品之间的变化特征和识别变化趋势，并利用图中展示的变化趋势阐明某种可能导致这种主量元素之间关联性的地质过程。