HLMP-K101-LM0A2中文资料

合集下载

HLMP-Q106HE000中文资料

Agilent Subminiature High Performance TS AlGaAs Red LED Lamps Data SheetFeatures•Subminiature flat top package Ideal for backlighting and light piping applications•Subminiature dome package Diffused dome for wide viewing angleNon-diffused dome for high brightness•Wide range of drive currents500 µA to 50 mA •Ideal for space limited Applications •Axial leads•Available with lead configurations for surface mount and through hole PC board mountingDescriptionFlat Top PackageThe HLMP-Pxxx Series flat top lamps use an untinted, non-diffused, truncated lens toprovide a wide radiation pattern that is necessary for use in backlighting applications. The flat top lamps are also ideal for use as emitters in light pipe applications.Dome PackagesThe HLMP-Qxxx Series dome lamps, for use as indicators, use a tinted, diffused lens to provide a wide viewing angle with high on-off contrast ratio. High brightness lamps use anuntinted, nondiffused lens to provide a high luminous inten-sity within a narrow radiation pattern.Lead ConfigurationsAll of these devices are made by encapsulating LED chips onaxial lead frames to form molded epoxy subminiature lamppackages. A variety of package configuration options isavailable. These include special surface mount lead configura-tions, gull wing, yoke lead, or Z-bend. Right angle lead bends at 2.54 mm (0.100 inch) and 5.08mm (0.200 inch) center spacing are available for through hole mounting. For more information refer to Standard SMT and Through Hole Lead BendOptions for Subminiature LED Lamps data sheet.TechnologyThese subminiature solid state lamps utilize a highly optimized LED material technology,transparent substrate aluminum gallium arsenide (TS AlGaAs).This LED technology has a very high luminous efficiency,capable of producing high light output over a wide range of drive currents (500 µA to 50mA). The color is deep red at a dominant wavelength of 644nm deep red. TS AlGaAs is a flip-chip LED technology, dieattached to the anode lead and wire bonded to the cathode lead.Available viewing angles are 75°, 35°, and 15°.HLMP-P106/P156HLMP-Q102/Q152HLMP-Q106/Q156Device Selection GuideViewing Angle Deep Red Typical Iv Typical IvPackage Description 2 q1/2R d = 644 nm I F = 500 µa I F = 20 mA Package Outline Domed, Diffused Tinted,35HLMP-Q102100BStandard CurrentDomed, Diffused Tinted,35HLMP-Q1522BLow CurrentDomed, Nondiffused15HLMP-Q106400BUntinted, Standard CurrentDomed, Nondiffused15HLMP-Q1567BUntinted, Low CurrentFlat Top, Nondiffused,75HLMP-P106130AUntinted, Standard CurrentFlat Top, Nondiffused75HLMP-P1562AUntinted, Low CurrentOrdering InformationHLMX-XXXX-X X X X XPackagingOptionColor BinSelectionMax. Iv BinMin. Iv Bin4 x 4 Prod.PartNumberFigure 1. Proper right angle mounting to a PC board to prevent protruding anode tab from shorting to cathode c onnection.Package Dimensions A) Flat Top LampsB) Diffused and Nondiffused Dome LampsNO. CATHODE DOWN.YES. ANODE DOWN.* REFER TO FIGURE 1 FOR DESIGN CONERNS.2.082.34(0.082)(0.092)2.082.34(0.082)(0.092)0.53 (0.021)2.211.96(0.087)(0.077)NOTES:1. ALL DIMENSIONS ARE IN MILLIMETRES (INCHES).2. PROTRUDING SUPPORT TAB IS CONNECTED TO ANODE LEAD.3. LEAD POLARITY FOR THESE TS AlGaAs SUBMINIATURE LAMPS IS OPPOSITE TO THE LEAD POLARITY OF SUBMINIATURE LAMPS USING OTHER LED TECHNOLOGIES.Absolute Maximum Ratings at T A = 25°CParameters TitleDC Forward Current[1]50 mAPeak Forward Current[2]300 mAAverage Forward Current[2,3]30 mATransient Forward Current (10 µs Pulse)[4]500 mAPower Dissipation100 mWReverse Voltage 5 VJunction Temperature110°COperating Temperature-55°C to +100°CStorage Temperature-55°C to +100°CLead Soldering Temperature260°C for 5 seconds[1.6 mm (0.063 in.) from body]Reflow Soldering Temperature260°C for 20 secondsNotes:1. Derate linearly as shown in Figure 6.2. Refer to Figure 7 to establish pulsed operating conditions.3. Maximum IAVG at f = 1 kHz, DF = 10%.4. The transient peak current is the maximum non-recurring peak current the device can withstandwithout damaging the LED die and wire bonds. It is not recommended that the device beoperated at peak currents above the Absolute Maximum Peak Forward Current.Optical Characteristics at T A = 25°CLuminous Intensity Total Flux Peak Color, Dominant Viewing Angle LuminousI V (mcd)f V (mlm)Wavelength Wavelength2q1/2Efficacy Part Number@ 20 mA[1]@ 20 mA[2]l peak (nm)l d[3] (nm)Degrees[4]h v[5] HLMP-Min.Typ.Typ.Typ.Typ.Typ.(lm/w) Q106-R00xx1004002806546441585Q102-N00xx25100-6546443585P106-Q00xx631302806546447585Optical Characteristics at T A = 25°CLuminous Intensity Total Flux Peak Color, Dominant Viewing Angle Luminous Part Number I V (mcd)f V (mlm)Wavelength Wavelength2f1/2Efficacy (Low Current)@ 0.5 mA[1]@ 0.5 mA[2]l peak (nm)l d[3] (nm)Degrees[4]h v[5] HLMP-Min.Typ.Typ.Typ.Typ.Typ.(lm/w) Q156-H00xx 2.5710.56546441585Q152-G00xx 1.62-6546443585P156-EG0xx0.63210.56546447585 Notes:1. The luminous intensity, Iv, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not bealigned with this axis.2. f v is the total luminous flux output as measured with an integrating sphere.3. The dominant wavelength, l d, is derived from the CIE Chromaticity Diagram and represents the color of the device.4. q1/2 is the off-axis angle where the liminous intensity is 1/2 the peak intensity.5. Radiant intensity, I v, in watts/steradian, may be calculated from the equation I v = I v/h v, where I v is the luminous intensity in candelas and h v is theluminous efficacy in lumens/watt.Electrical Characteristics at T A = 25°CCapacitanceSpeed of Response Forward Voltage Reverse Breakdown C (pF)t s (ns)Part V F (Volts)V R (Volts)V F = 0,Thermal Time Constant Number @ I F = 20 mA @ I R = 100 µA f = 1 MHz Resistance e -t/t s HL MP-Typ. M ax.Min. Typ.Typ.R q J-PIN (°C/W)Typ.Q106 1.9 2.45202017045Q102 1.9 2.45202017045P1061.92.45202017045Electrical Characteristics at T A = 25°C Part CapacitanceSpeed of Response Number Forward Voltage Reverse Breakdown C (pF)t s (ns)(Low V F (Volts)V R (Volts)V F = 0,Thermal Time Constant Current)@ I F = 0.5 mA @ I R = 100 µA f = 1 MHz Resistance e -t/t s HL M P-Typ. M ax.M in. Typ.Typ.R q J-PIN (°C/W)Typ.Q156 1.6 1.95202017045Q152 1.6 1.95202017045P1561.61.95202017045Figure 5. Relative efficiency vs. peak forward current.Figure 7. Maximum average current vs. peak forward current.Figure 6. Maximum forward DC current vs.ambient temperature. Derating based on T J MAX = 110°C.ηV – R E L A T I V E E F F I C I E N C Y (N O R M A L I Z E D A T 20 m A )53000.0I PEAK – PEAK FORWARD CURRENT – mA 102050100212000.10.20.30.40.50.60.70.80.91.01.11.2Figure2. Relative intensity vs. wavelength.Figure 4. Relative luminous intensity vs. DC forward current.Figure 3. Forward current vs. forward voltage.R E L A T I V E I N T E N S I T Y 600100010-3WAVELENGTH – nm70050010-210-11.0R E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D A T 20 m A )20.50.01I F – DC FORWARD CURRENT – mA51020502.42.01.00.20.10.0510.5I F – F O R W A R D C U R R E N T – m A1.03.5300201V F – FORWARD VOLTAGE – V1.52.02.53.02001005010520.5I A V G = A V E R A G E F O R W A R D C U R R E N T – m AI PEAK – PEAK FORWARD CURRENT – mAI F – F O R W A R D C U R R E N T – m AT A – AMBIENT TEMPERATURE – °CN O R M A L I Z E D I N T E N S I T Y1.00ANGULAR DISPLACEMENT – DEGREES0.80.60.50.70.2100°90°0.10.30.480°70°60°50°40°20°10°0°30°10°20°30°40°50°60°70°80°90°100°0.9Figure 8. HLMP-Q106/-Q156.N O R M A L I Z E D I N T E N S I T Y1.00ANGULAR DISPLACEMENT – DEGREES0.80.60.50.70.2100°90°0.10.30.480°70°60°50°40°20°10°0°30°10°20°30°40°50°60°70°80°90°100°0.9Figure 9. HLMP-Q102/-Q152N O R M A L I Z E D I N T E N S I T Y1.00ANGULAR DISPLACEMENT – DEGREES0.80.60.50.70.2100°90°0.10.30.480°70°60°50°40°20°10°0°30°10°20°30°40°50°60°70°80°90°100°0.9Figure 10. HLMP-P106/-P156.Intensity Bin LimitsBin Min.Max.E0.63 1.25F 1.00 2.00G 1.60 3.20H 2.50 5.00J 4.008.00K 6.3012.50L10.0020.00M16.0032.00N25.0050.00P40.0080.00Q63.00125.00R100.00200.00S160.00320.00T250.00500.00U400.00800.00V630.001250.00W1000.002000.00X1600.003200.00Y2500.005000.00Color Bin LimitsPackage Bin Min.Max.Red0Full DistributionMechanical Option00Straight Leads, Bulk Packaging, Quantity of 500 Parts11Gull Wing Leads, 12 mm Tape on 7 in. Dia. Reel, 1500 Parts per Reel 12Gull Wing Lead, Bulk Packaging, Quantity of 500 Parts14Gull Wing Leads, 12 mm Tape on 13 in. Dia. Reel, 6000 Parts per Reel 21Yoke Leads, 12 mm Tape on 7 in. Dia. Reel, 1500 Parts per Reel22Yoke Leads, Bulk Packaging, Quantity of 500 Parts24Yoke Leads, 12 mm Tape on 13 in. Dia. Reel, 6000 Parts per Reel31Z-Bend Leads, 12 mm Tape on 7 in. Dia. Reel, 1500 Parts per Reel32Z-Bend Leads, Bulk Packaging, Quantity of 500 Parts34Z-Bend Leads, 12 mm Tape on 13 in. Dia. Reel, 6000 Parts per Reel Note:All Categories are established for classification of products. Products may not be available in all categories. Please contact your local Agilent representative for further clarification/information./semiconductors For product information and a complete list of distributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or (916) 788-6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6756 2394India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152(Domestic/Interna-tional), or 0120-61-1280(Domestic Only) Korea: (+65) 6755 1989Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843Data subject to change.Copyright © 2005 Agilent Technologies, Inc. Obsoletes 5930-2437EJanuary 18, 20055989-1711EN。

HLMP-K101-LM002中文资料

AgilentT-13/4 (5 mm), T-1 (3 mm),High Intensity, Double Heterojunction AlGaAs Red LED LampsData SheetHLMP-D101/D105, HLMP-K101/K105DescriptionThese solid state LED lamps utilize newly developed doubleheterojunction (DH) AlGaAs/GaAs material technology. This LED material has outstanding lightoutput efficiency over a wide rangeFeatures• Exceptional brightness • Wide viewing angle• Outstanding material efficiency • Low forward voltage • CMOS/MOS compatible • TTL compatible • Deep red colorApplications• Bright ambient lighting conditions • Moving message panels • Portable equipment • General useof drive currents. The color is deep red at the dominantwavelength of 637 nanometres.These lamps may be DC or pulse driven to achieve desired light output.Package DimensionsA B CSelection GuideLuminous IntensityIv (mcd) at 20 mA2θ1/2[1]Package Package Description Device HLMP-Min.Typ.Max.Degree Outline T-1 3/4 Red Tinted Diffused D10135.270.0–65AD101-J00xx35.270.0–65AD101-JK0xx35.270.0112.865AT-1 3/4 Red Untinted Non-diffused D105138.0240.0–24BD105-M00xx138.0240.0–24BD105-NO0xx200.0290.0580.024BT-1 Red Tinted Diffused K10122.045.0–60CK101-100xx22.045.0–60CK101-IJ0xx22.045.070.460CT-1 Red Untinted Non-diffused K10535.265.0–45CK105-J00xx35.265.0–45CK105-KL0xx56.4110.0180.445CNote:1. θ1/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 the on-axis value.Part Numbering SystemHLMP - x x xx - x x x xxMechanical Option00: Bulk01: Tape & Reel, Crimped Leads02: Tape & Reel, Straight LeadsA1: Right Angle Housing, Uneven Leads, T1A2: Right Angle Housing, Even Leads, T1B1: Right Angle Housing, Uneven Leads, T-1 3/4B2: Right Angle Housing, Even Leads, T-1 3/4DD, UQ: Ammo PackColor Bin Options0: Full Color Bin DistributionMaximum Iv Bin Options0: Open (no max. limit)Others: Please refer to the Iv Bin TableMinimum Iv Bin OptionsPlease refer to the Iv Bin TableLens Type01: Tinted, Diffused05: Untinted, NondiffusedColor Options1: AlGaAs RedPackage OptionsD: T-1 3/4K: T-1Absolute Maximum Ratings at T A = 25°CParameter ValuePeak Forward Current[1,2]300 mAAverage Forward Current[2]20 mADC Current[3]30 mAPower Dissipation87 mWReverse Voltage (I R = 100 µA) 5 VTransient Forward Current (10 µs Pulse)[4]500 mALED Junction Temperature110°COperating Temperature Range-20 to +100°C Storage Temperature Range-55 to +100°C Wave Soldering Temperature [1.59 mm (0.063 in.) from body]250°C for 3 seconds Lead Solder Dipping Temperature [1.59 mm (0.063 in.) from body]260°C for 5 seconds Notes:1.Maximum I PEAK at f = 1 kHz, DF = 6.7%.2.Refer to Figure 6 to establish pulsed operating conditions.3.Derate linearly as shown in Figure 5.4.The transient peak current is the maximum non-recurring peak current the device can withstand without damaging the LED die and wire bonds. It isnot recommended that the device be operated at peak currents beyond the Absolute Maximum Peak Forward Current.Electrical/Optical Characteristics at T A = 25°CSymbol Description Min.Typ.Max.Unit Test ConditionV F Forward Voltage 1.8 2.2V I F = 20 mAV R Reverse Breakdown Voltage 5.015.0V I R = 100 µAλp Peak Wavelength645nm Measurement at Peakλd Dominant Wavelength637nm Note 1∆λ1/2Spectral Line Halfwidth20nmτS Speed of Response30ns Exponential TimeConstant, e-t/T SC Capacitance30pF V F = 0, f = 1 MHzRθJ-PIN Thermal Resistance260[3]°C/W Junction to Cathode Lead210[4]290[5]ηV Luminous Efficacy80Im/W Note 2Notes:1.The dominant wavelength, λd, is derived from the CIE chromaticity diagram and represents the color of the device.2.The radiant intensity, I e, in watts per steradian, may be found from the equation I e = l V/ηV, where I V is the luminous intensity in candelas and ηV isluminous efficacy in lumens/watt.3.HLMP-D101.4.HLMP-D105.5.HLMP-K101/-K105.Figure 3. Relative luminous intensity vs. dc forward current.Figure 4. Relative efficiency vs. peak forward current.Figure 7. Relative luminous intensity vs. angular displacement. HLMP-D101.Figure 8. Relative luminous intensity vs. angular displacement. HLMP-K101.Intensity Bin LimitsIntensity Range (mcd)Color Bin Min.Max.Red I24.839.6J39.663.4K63.4101.5L101.5162.4M162.4234.6N234.6340.0O340.0540.0P540.0850.0Q850.01200.0R1200.01700.0S1700.02400.0T2400.03400.0U3400.04900.0V4900.07100.0W7100.010200.0X10200.014800.0Y14800.021400.0Z21400.030900.0Maximum tolerance for each bin limit is ± 18%.Mechanical Option MatrixMechanical Option Code Definition00Bulk Packaging, minimum increment 500 pcs/bag01Tape & Reel, crimped leads, minimum increment 1300 pcs (T-1 3/4)/1800 pcs (T-1) 02Tape & Reel, straight leads, minimum increment 1300 pcs (T-1 3/4)/1800 pcs (T-1) A1Right Angle Housing, uneven leads, minimum increment 500 pcs/bagA2Right Angle Housing, even leads, minimum increment 500 pcs/bagB1Right Angle Housing, uneven leads, minimum increment 500 pcs/bagB2Right Angle Housing, even leads, minimum increment 500 pcs/bagDD Ammo Pack, straight leads in 2K incrementUQ Ammo Pack, horizontal leads in 2K incrementNote:All categories are established for classification of products. Products may not be available in all categories. Please contact your local Agilent representative for further clarification/information./semiconductors For product information and a complete list of distributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or (916) 788-6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6756 2394India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152 (Domestic/Interna-tional), or 0120-61-1280 (Domestic Only) Korea: (+65) 6755 1989Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843Data subject to change.Copyright © 2004 Agilent Technologies, Inc. Obsoletes 5968-1440ENovember 12, 20045988-2230EN。

第二章LMK-101系列装置使用说明-电气自动化

LMK-101 数字式通用型综合保护装置技术使用说明书V2.0江苏南自继保电力科技有限公司用户须知尊敬的用户：感谢您使用江苏南自继保电力科技有限公司生产的LMK-101数字式通用型综合保护装置。

在安装和使用本系列产品前，请您注意以下提示：◆在您收到产品后，请核对产品标签与您所订购的型号、规格是否相符，产品的额定电压、额定电流是否符合使用要求；◆请检查产品是否存在外观损伤；◆请检查配套物品是否齐全，包装箱内应包括以下物品：●LMK-101系列数字式综合保护装置 1台●产品调试及检验报告 1份●产品合格证 1份◆在安装、使用产品前请仔细阅读本说明书，严格按照本说明书所述进行安装连线，并设置使用。

本说明书无法涵盖所有场合或包含所有细节，如有特殊情况或疑问，在没有得到正确的指导前请不要做任何举措，请先联系我公司技术部询问相关信息，在得到确认后方可操作；◆该产品在测试和使用时，接地端子（120）及外壳要可靠接地；◆本产品在运行状态时，请勿用尖锐及细长的金属物品接触产品的空隙部分，以免触电、造成产品的损坏或保护误动作；◆请使用合格的测试仪器和设备对装置进行试验和检测；◆产品安装完毕后，请仔细检查接线，确定正确后方可通电调试，以免造成产品的损坏；◆产品出厂时的预置密码是“0000”，此密码可在“装置参数→修改密码”菜单中修改，修改后请注意保存，以免遗失；◆不可在产品运行状态下进行出口传动或修改保护定值的操作，以免造成装置误动作；◆定值整定时要按照“先整定定值,后投入保护功能”的顺序进行；◆本说明书由江苏南自继保电力科技有限公司出版，并对所示产品保留最终解释权；◆本说明书所示产品日后会有小改动，请注意核对实际产品及相关说明书；江苏南自继保电力科技有限公司 2012 年12月1目录第一章LMK-101数字式通用型综合保护装置 (4)1.1简介 (4)1.2装置功能 (4)1.3装置原理 (4)1.3.1速断保护功能 (4)1.3.2 过流保护功能 (5)1.3.3 过流加速保护 (5)1.3.4 过负荷报警 (6)1.3.5 过流反时限保护 (6)1.3.6 负序过流保护 (6)1.3.7 零序保护 (7)1.3.8 过电压保护 (7)1.3.9 低电压保护元件 (7)1.3.10 非电量保护 (8)1.3.11 CT断线告警 (8)1.3.12 相序报警 (8)1.3.13 PT断线告警 (8)1.3.14 开关位置异常告警 (8)1.3.15 弹簧未储能报警 (8)1.3.16 通信 (8)1.4定值及整定说明 (9)1.4.1 LMK-101整定值清单及说明 (9)1.4.2 LMK-101参数清单及说明 (10)21.4端子及接线原理图 (11)第二章LMK-101系列装置使用说明 (14)2.1装置外观说明 (14)2.1.1 面板布局 (14)2.1.2 液晶 (14)2.1.3 指示灯 (14)2.1.4 键盘按键 (15)2.1.5 装置机箱开孔尺寸图 (15)2.2菜单操作说明 (17)2.2.1 菜单说明 (17)2.2.2 中文主菜单 (17)2.2.3正常显示画面 (19)2.2.4主菜单操作说明 (19)2.2.5状态显示 (20)2.2.6装置参数 (20)2.2.7装置记录 (23)2.2.8就地控制 (24)2.2.9版本信息 (25)2.2.10复位装置 (25)3第一章LMK-101数字式通用型综合保护装置1.1简介LMK-101数字式通用型综合保护装置是我公司为适应我国电气成套事业发展的需要，积累多年电力自动化产品开发经验，吸收国内外先进技术，向广大电力成套厂商推出的一款经济性综合保护装置。

南京苏曼电子有限公司科罗纳实验室产品说明书

科罗纳实验室（CORONA LAB．）Please refer to the manual in detail before installing, operating and debugging.安装，操作或调试设备前，请先详细阅读本说明一.概述南京苏曼电子有限公司始建于1983年。

二十几年来一直致力于低温等离子体（电浆）技术的理论研究和材料表面改性处理技术的产品开发，成熟的掌握了各种低温等离子体的实现方法和辉光放电、电晕放电、电弧放电、等产生低温等离子体的工艺技术和知识产权。

并将谐振型脉宽调制技术、微程序控制技术、数字信号处理技术、模糊程序控制等现代先进技术融合在苏曼公司的系列产品之中。

使苏曼公司推出的相关产品实现了电路数字化、软件模糊化、结构模块化、产品系列化。

在体积、效率、功率、可靠性、外观、可操作性及系列方面在国内都处于领先水平。

尤其在价格和易用性方面更具中国特色。

苏曼公司创建的科罗纳实验室（CORONA Lab.）现在已经成为国内最具技术实力的低温等离子体技术和表面处理技术相关产品的研发基地。

推出了十几款用于各种材料和形状的表面改性处理系列产品和大功率臭氧电源，成功的推动了我国高分子材料表面改性处理技术的发展和设备的更新换代。

苏曼公司对各种高分子和金属材料所制成的薄膜、片材、二维和三维零件、高分子和金属材料的复合零件都有对应的表面处理产品。

对印刷、吹膜、复合、流延、涂覆、胶结、真空镀铝、编织布、化纤布、无纺布、片材、管材、合成纸、粉粒等表面处理也有其对应的解决方案。

另外，我们还可为高等院校和研究院所设计和定制用于表面聚合、表面接枝、金属渗氮、冶金、表面催化、化学合成和气液态污染物的处理等各种低温等离子体的处理设备和实验装置。

目前在线生产的系列产品有、ZW-A，CTE-K，CTR（薄膜表面处理系列）、CTT-K，CTT-F （供暖管，天然气管，石油管等内外管壁PE表面处理系列）、CTB(冰箱盖处理)，CTD，CTD-K，RFD，RFD-F（二维和三维零件表面处理系列）、CTP（低温等离子体实验仪器仪表系列）、CTK （片材处理系列）、HPD系列次大气辉光放电低温等离子表面处理系统、CTO（大功率臭氧电源系列）等产品系列。

HN catalog2

HNLM79D10
-36
-10
0.5
2
8
60
LM79D10
HNLM79D12
-36
-12
0.5
2
8
60
LM79D12
HNLM79M05
-40
-5
1
2
4
45
LM79M05
HNLM79M08
-40
-8
1
2
4
45
LM79M08
HNLM79M09
-40
-9
1
2
4
45
LM79M09
HNLM79M10
-40
-10
±30
4
2200
2500
2
4
ST4N60
HNST5N60
600
±30
5
1800
2200
2
4
ST5N60
HNST6N60
600
±30
6
1000
1500
2
4
ST6N60
HNST7N60
600
±30
7
920
1200
2
4
ST7N60
HNST8N60
600
±30
8
1000
1200
2
4
ST8N60
HNST9N60
(A)
RDS(on)Ω
兼容
@VGS=10V
@VVGS=1.8V
TYP
Max
TYP
Max
HNST1N60
600
±30
1
11000
15000
2
4.2

霍尔101A资料

3 2
T1 = 20˚C, T2 = 0˚C, T3 = 40˚C
0 – 40
– 20
0
20 40 60 80 Ambient Temperature.(˚C)
100
120
•Dimensional Drawing (mm)
2.9±0.1 0.5 1.9 0.5 0.4 0.35
Note : Rin of Hall element decreases rapidly as ambient temperature increases. Ensure compliance with input current derating curve envelope, throughout the operating temperature range.
VOS-Vc, VOS-Ic
20 18 Offset Voltage:Vos(mV) 16 14 12 10 8 6 4 2 5 0.5 10 1.0 Ic (mA) Input Current Vc (V) Input Voltage 15 1.5 20 Ic:(mA) 2.0 Vc:(V) Vc Ic const Vc const B = 0 (mT) Ta = 25 (˚C) Ic
a
•Characteristic Curves
Rin-T
2000 1800 Input Resistance:Rin( ) Output Voltage:VH(mV) 1600 1400 1200 1000 800 600 400 200 0 –50 0 50 100 Ambient Temperature(˚C) 150 0.0 0 10 20 30 Magnetic Flux Density B (mT) 40 50 500.0 400.0 300.0 Vc 200.0 100.0

HLMP-KW50 T-1 高精度白LED数据表说明书

HLMP-KW50T-1 Precision Optical Performance White LEDData SheetPackage DimensionsNotes :1. All dimensions are in milimetres /inches.2. Epoxy meniscus may extend about 1mm (0.040”) down the leads.CAUTION : These devices are Class 1C ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details.NOM.DescriptionThis high intensity white LED lamp is based on InGaN material technology. A blue LED die is coated by a phosphor to produce white. The typical resulting color is described by the coordinates x = 0.27, y = 0.25 using the 1931 CIE Chromaticity Diagram.This T-1 lamp is untinted, nondiffused, and incorpo-rate precise optics which produce well defined spatial radiation patterns at specific viewing cone angle.Features• Highly Luminous White Emission • Viewing Angle : 45°Applications• Indoor Electronic Signs and Signals • Small Area Illumination • Legend Backlighting • General Purpose IndicatorsBenefit• Reduced Power Consumption, Higher Reliability, and Increased Optical/Mechanical Design Flexibility Compared to Incandescent Bulbs and Other Alternative White Light SourcesDevice Selection GuidePart Number Typical Viewing Angle Min Iv (mcd) @ 20mA Max Iv (mcd) @ 20mA Typical Chromaticity Coordinates (x,y)HLMP-KW50-QS00045°115025000.27, 0.25 Notes:1. The chromaticity coordinates are derived from the CIE 1931 Chromaticity Diagram and represent the perceived color of the device.2. θ1/2 is the off-axis angle where the luminous intensity is ½ the peak intensity.3. Tolerance for intensity bin limit is +/- 15%Absolute Maximum Ratings (T A = 25°C)Parameter Value UnitsDC Forward Current [1]30mAPeak Forward Current [2]100mAPower Dissipation111mWReverse Voltage (I R = 10μA)5VLED Junction Temperature110°COperating Temperature Range-40 to +85°CStorage Temperature Range-40 to +100°CNotes:1. Derate linearly as shown in Figure 5.2. Duty factor 10%, Frequency = 1KHz.Electrical Characteristics (T A = 25°C)Forward Voltage, V F (V) @ I F = 20 mA Reverse Breakdown,VR (V) @ I R = 10μACapacitance,C (pF), V F = 0,f = 1 MHzThermal ResistanceRθJ-PIN (°C/W)Typ.Max.Min.Typ.Typ.3.2 3.7570290WAVELENGTH –nmR E L A T I V E L U M I N O U S I N T E N S I T Y3807801.00.606805804800.40.80.201.50.3R E L A T I V E L U M I N O U S I N T EN S I T YFORWARD CURRENT -mA1.20.90.6-0.0100.02500.005-0.005Y -C O O R D I N A T E SX-COORDINATES(X,Y)VALUES @20mA REFERENCE TO (0,0)0.0150.0100.020F O R W A R D C U R R E N T -m A0FORWARD VOLTAGE -V2015353051025I F M A X .-M A X I M U M F O R W A R D C U R R E N T -m AT A -AMBIENT TEMPERATURE -C4080353010206010015255200302010Figure 1. Relative Intensity vs Wavelength Figure 2. Forward Current vs Forward VoltageFigure 3. Relative Iv vs. Forward Current Figure 4. Chromaticity shift vs. currentFigure 5. Maximum Fwd. Current vs TemperatureFigure 6. Spatial Radiation Pattern00.20.40.60.81.0SPATIAL DISPLACEMENT -DEG.R E L A T I V E I N T E N S I T YIntensity Bin Limits (mcd at 20 mA) Bin Min.Max.Q11501500R15001900S1******* Tolerance for each bin limit is ± 15%.Color Bin Limit TablesRank Limits(Chromaticity Coordinates)1xy0.3300.3600.3300.3180.3560.3510.3610.3852xy0.2870. 2950.2960.2760.3300.3180.3300.3393xy0.2640.2670.2800.2480.2960.2760.2830.3054 xy0.2830.3050.2870.2950.3300.3390.3300.360Tolerance for each color bin limit is ± 0.01Color Bin Limits with Respect to CIE 1931 Chromaticity Diagram0.260.30.340.38X-COORDINATEY-COORDINATENote:1. Bin categories are established for classification of products. Products may not be available in allbin categories. Please contact your Avago representative for information on currently availableRelative Light Output vs. Junction Temperature0.1110T J-JUNCTION TEMPERATURE-°CRELATIVELIGHTOUTPUT(NORMALIZEDATTJ=25ºC)InGaN DevicePrecautions:Lead Forming:• The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board.• For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually.• If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into LED package. This is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink.Soldering and Handling:• Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. • LED component may be effectively hand soldered to PCB. However, it is only recommended under unavoidable circumstances such as rework. The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59mm. Soldering the LED using soldering iron tip closer than1.59mm might damage the LED.• ESD precaution must be properly applied on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Do refer to Avago application note AN 1142 for details. The soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded.• Recommended soldering condition:WaveSoldering [1, 2]Manual Solder DippingPre-heat temperature 105 °C Max.-Preheat time 60 sec Max -Peak temperature 250 °C Max.260 °C Max.Dwell time3 sec Max.5 sec MaxNote:1) Above conditions refers to measurement with thermocouple mounted at the bottom of PCB.2) It is recommended to use only bottom preheaters in order to reduce thermal stress experienced by LED.• Wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. Customer is advised to perform daily check on the soldering profile to ensure that it is always conforming to recommended soldering conditions.Note: Electrical connection between bottom surface of LED die and the lead frame is achieved through conductive paste.• Any alignment fixture that is being applied during wave soldering should be loosely fitted and should not apply weight or force on LED. Non metal material is recommended as it will absorb less heat during wave soldering process.• At elevated temperature, LED is more susceptible to mechanical stress. Therefore, PCB must allowed to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet.• If PCB board contains both through hole (TH) LED and other surface mount components, it is recommended that surface mount components be soldered on the top side of the PCB. If surface mount need to be on the bottom side, these components should be soldered using reflow soldering prior to insertion the TH LED.• Recommended PC board plated through holes (PTH) size for LED component leads.LED component lead sizeDiagonalPlated through hole diameter0.45 x 0.45 mm (0.018x 0.018 inch)0.636 mm (0.025 inch)0.98 to 1.08 mm (0.039 to 0.043 inch)0.50 x 0.50 mm (0.020x 0.020 inch)0.707 mm (0.028 inch)1.05 to 1.15 mm (0.041 to 0.045 inch)• Over-sizing the PTH can lead to twisted LED after clinching. On the other hand under sizing the PTH can cause difficulty inserting the TH LED.Note:1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again before loading a new type of PCB.2. Avago Technologies’ high brightness LED are using high efficiency LED die with single wire bond as shown below. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 250°C and the solder contact time does not exceeding 3sec. Over-stressing the LED during soldering process might cause premature failure to the LED due to delamination.Avago Technologies LED configurationExample of Wave Soldering Temperature Profile for TH LED25020015050TIME (MINUTES)Recommended solder:Sn63(Leaded solder alloy)SAC305(Lead free solder alloy)Flux:Rosin fluxSolder bath temperature:245°C±5°C (maximum peak temperature =250°C)Dwell time:1.5sec -3.0sec (maximum =3sec)Note:Allow for board to be sufficiently cooled to room temperature before exerting mechanical force.T E M P E R A T U R E (°C )Packaging Box for Ammo PacksNote: For InGaN device, the ammo pack packaging box contains ESD logo.Packaging Label(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)Acronyms and Definition:BIN:(i) Color bin only or VF bin only(Applicable for part number with color bins but without VF bin OR part number with VF bins and no color bin)OR(ii) Color bin incorporated with VF Bin(Applicable for part number that have both color bin and VF bin)(ii) Avago Baby Label (Only available on bulk packaging)Example:(i) Color bin only or VF bin only BIN: 2 (represent color bin 2 only) BIN: VB (represent VF bin “VB” only)(ii) Color bin incorporate with VF BinVB: VF bin “VB”2: Color bin 2 onlyDISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFAC-TURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CON-STRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNEC-TION WITH SUCH USE.For product information and a complete list of distributors, please go to our web site: Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.Data subject to change. Copyright © 00 - 008 Avago Technologies Limited. All rights reserved. Obsoletes 989- 1 EN AV0 -0 EN - April 8, 008。

北京科慧铭远自控技术有限公司LORA无线室温采集系统说明书

LORA无线室内测温仪KH-LR-T1LORA无线接收器KH-LR-R128目录目录 (3)第1章概述 (4)1.1 “无线室温采集系统”概述 (4)1.2 “无线室温采集系统”组成 (5)第2章LORA无线室内测温仪 (6)2.1 简介 (6)2.2 功能特点 (7)2.3 界面说明 (8)2.4 安装方式 (9)2.5 技术参数 (11)2.6 简要操作说明 (12)2.7 应用场合 (13)第3章LORA无线接收器 (14)3.1 简介 (14)3.2 组合应用 (15)3.3 技术特点 (16)3.4 技术参数 (17)3.5 指示灯和引脚说明 (18)3.6 配置软件使用说明 (20)3.7 通信协议 (23)第1章概述1.1“无线室温采集系统”概述在集中采暖系统中，保证用户室内的温度满足要求，是最终的服务目标。

随着供热系统调节精细度的提升，在楼口（单元口）加装进回水温度测量等装置，在用户室内使用“无线测温仪”获取温度，并将这些数据汇总到数据中心，是高水平的供热系统必备的措施。

这些反馈信息能极大的提高调控的有效性和实时性，在提高用户满意度的同时，可以显著降低系统能耗，对于解决供热系统末端的运行工况调节问题有着极为重要的价值。

以上举措，可以称为“集中供热末端监控系统”，与“热源监控系统”、“管网监控系统”、“无人值守换热站监控系统”并列，是整个集中供热系统重要的组成部分。

“无线室温采集系统”是“集中供热末端监控系统”的一个重要的组成部分，其使用安放在用户室内的“无线测温仪”和安放在楼宇内的“无线采集器”，定时的采集用户室温数据，并将测温数据汇集到数据中心。

数据中心可以实时掌握用户室内温度变化情况，并根据实际情况调节供热参数，实现精细化管理，并降低系统能耗。

如上图所示【图中虚线部分是“楼口监控系统”】在“无线室温采集系统”中，本地无线通信使用LORA 技术，具有极低功耗和极强的穿透能力，并通过“采集云”技术，实现组网和数据融合，极大提高数据采集的成功率。

力科产品手册说明书

力科产品手册关注我们，了解更多信息:LabMaster 10 Zi-A (SDA Models)WaveMaster 8 Zi-B (SDA/DDA 8 Zi-B)带宽20 GHz to 65 GHz 4 GHz to 30 GHz 分辨率8-bit resolution,11-bit with enhanced resolution8-bit resolution,11-bit with enhanced resolution上升时间 6.5 ps to 19.3 ps15.5 ps to 95 ps通道(模拟+数字)Up to 80, 80 + 184, 4 + 18显示15.3" WXGA Touch Screen15.3" WXGA Touch Screen标配存储深度32 Mpts/Ch (64 Mpts/Ch)32 Mpts/Ch (64 Mpts/Ch)最大存储深度†Up to 1024 Mpts Up to 512 Mpts 采样率Up to 160 GS/sUp to 80 GS/sMSO 特性†(数字通道) 3 GHz, 12.5 GS/s,18 Ch3 GHz, 12.5 GS/s,18 Ch触发类型Edge, Width, Glitch, Pattern, Runt, Slew Rate,Interval (Period), Dropout, Qualified, Cascade (Sequence) Trigger,High-speed Serial Trigger †Edge, Width, Glitch, Pattern, Video, HDTV,Runt, Slew Rate, Interval (Period), Dropout, Qualified, Cascade(Sequence) Trigger, High-speed Serial Trigger †串行数据† 触发 (T) 解码 (D)测量/图形 (M)眼图 (E)仅图形 (G)物理层 (P)TD: 80-bit NRZ, 8b/10b, 64b/66b D: 64b66b, 8b/10b, ARINC 429, Audio,CAN, CAN FD, CAN FD Symbolic, DigRF 3G, DigRF v4,ENET, ENET 10G, Fibre Channel, I 2C , LIN,Manchester, MDIO, MIL-STD-1553, NRZ, PCIe, RS-232. SAS, SATA,SENT, SpaceWire, SPI, UART, UniPro, USB 1.0/1.1/2.0,USB 3.2 (Gen1, Gen2, Gen2x2)DP : D-PHY, Fibre Channel, FlexRay, M-PHYDG: AudioTD: 80-bit NRZ, 8b/10b, 64b/66b, RS-232, UARTTD or TDME: 100Base-T1, CAN, CAN FD, CAN FD Symbolic,I 2C , LIN, MIL-STD-1553, SPI,TD or TDxx: Audio (TDG), FlexRay (TDMP)D: DigRF 3G, DigRF v4, ENET, ENET 10G, Fibre Channel,Manchester, MDIO, NRZ, PCIe, SAS, SATA, SENT, SpaceWire, SPMI,UniPro, USB 2.0-HSIC, USB 3.2 (Gen1, Gen2, Gen2x2),64b / 66b, 8b/10b DP : D-PHY, M-PHYDME: ARINC 429, USB 1.0/1.1/2.0串行数据分析Eye Jitter and Noise Analysis (SDAIII-CompleteLINQ), Virtual Probe, Eye Doctor II, PAM4 Signal Analysis, Serial Data Mask,Cable De-Embedding串行数据一致性测试DDR 3/4/5, LPDDR 3/4/5, DisplayPort 1.4, eDP , Automotive Ethernet 100Base-T1, 1000Base-T1 Ethernet 10GBase-T, 10GBase-KR, HDMI 2.1/2.0/1.4b, MIPI M-PHY, PAM4-56G, PCI Express 1.0/2.0/3.0/4.0/5.0, SAS 2/3, SATA, SFI, USB 3.2 (Gen1, Gen2, Gen2x2), USB4/TBT4DDR 2/3/4/5, LPDDR 2/3/4/5, DisplayPort 1.4, eDP , Automotive Ethernet 10Base-T1S, 100Base-T1, 1000Base-T1,Ethernet 10/100/1000Base-T, Ethernet 10GBase-T, 10GBase-KR, HDMI 2.1/2.0/1.4b, MIPI D-PHY, MIPI M-PHY, MOST 50/150, PAM4-56G, PCI Express 1.0/2.0/3.0, SAS 2/3, SATA, SFI,USB 1.1/2.0, USB 3.2 (Gen1, Gen2, Gen2x2), USB4/TBT4应用软件选项Spectrum Analyzer (Single, Dual+Reference), Clock and Clock-Data Jitter Analysis, Automotive Ethernet Debug, CrossSync PHY, DDR Debug Toolkit, Switch-mode Power Supply and Device Analysis, Advanced Customization (Standard with LabMaster 10 Zi-A),EMC Pulse Parameters, Digital Filter Package, Protocol Analyzer Synch (ProtoSync), Advanced Vector Signal Analysis, Vector Signal Analysis, Advanced Optical Recording, Disk Drive Analysis, Disk Drive Measurements, Coherent Optical Analysis,Electrical Telecom Pulse Mask Test外设接口USB Host for Storage, LAN for PC, LXI for PC, GPIB for PC †函数+, -, x, /, FFT, Absolute Value, Average, Copy, Correlation, Derivative, Deskew, Envelope, Enhanced Resolution, Exponent, Floor, Histogram, Integral, Invert, Log, Phistogram, Ptrace Mean, Ptrace Range, Ptrace Sigma, Reciprocal, Rescale, Roof,Segment, Sparse, Square, Square Root, Track, Trend, Zoom尺寸 (HWD)MCM-Zi-A: 277 x 462 x 396 mm(10.9” x 18.2” x 15.6”)LabMaster 10-xxZi Acq. Module:202 x 462 x 660 mm (8.0” x 18.2” x 26”)355 x 467 x 406 mm (14” x 18.4” x 16” )重量MCM-Zi-A: 47 lbs. (21.4 kg)LabMaster 10-xxZi-A Acq. Module - 58 lbs. (24 kg)58 lbs. (26.4 kg)保修3 yr3 yrWavePro HD WaveRunner 8000HD/MDA 8000HDWaveRunner 9000/9000-MS带宽 2.5 GHz to 8 GHz 350 MHz to 2 GHz 500 MHz to 4 GHz 分辨率12-bit resolution,15-bit with enhanced resolution12-bit resolution,15-bit with enhanced resolution8-bit resolution,11-bit with enhanced resolution上升时间57.5 ps to 166 ps1 ns to 235 ps700 ps to 100 ps通道(模拟+数字)4, 4 + 168, 8 + 164, 4 + 16显示15.6” Widescreen Capacitive Touch Screen15.6” Widescreen Capacitive Touch Screen15.4” WXGA Multi-Touch Screen 标配存储深度50 Mpts/Ch 100 Mpts Interleaved50 Mpts/Ch100 / 200 Mpts Interleaved16 Mpts/Ch; M Models: 64 Mpts/Ch32 Mpts Interleaved; M Models: 128 Mpts 最大存储深度†Up to 5 Gpts Up to 5 Gpts Up to 128 Mpts 采样率Up to 20 GS/sUp 10 GS/sUp to 20 GS/s; M Models: Up to 40 GS/s MSO 特性†(数字通道)250 MHz, 1.25 GS/s16 Ch500 MHz, 2.5 GS/s16 Ch250 MHz, 1.25 GS/s,16 Ch触发类型Edge, Width, Glitch, Pattern, Runt, Slew Rate,Interval (Period), Dropout, Qualified,Edge, Width, Glitch, Pattern, Runt, Slew Rate, Interval (Period), Dropout, Qualified,Measurement, WindowEdge, Width, Glitch, Pattern, Video, HDTV, Runt, Timeout, Slew Rate, Interval (Period), Dropout, Qualified, Measurement, Window,Cascade 串行数据† 触发 (T) 解码 (D)测量/图形 (M)眼图 (E)仅图形 (G)物理层 (P)TD or TDME: 100Base-T1, CAN, CAN FD,CAN FD Symbolic, SPMI, I 3C, I 2C , LIN, MIL-STD-1553, RS-232, SENT, PMBus, SMBus, SPI, UART, USB 1.0/1.1/2.0, USB-PDTD or TDxx: Audio (TDG), FlexRay (TDMP)D: DigRF 3G, DigRF v4, ENET, Fibre Channel,Manchester, MDIO, NRZ, PCIe, SATA, SAS,SpaceWire, UniPro, USB 2.0-HSIC,USB 3.2 (Gen1), 8b/10bDP : D-PHY, M-PHY DME: ARINC 429TD or TDME: 100Base-T1, CAN, CAN FD, CAN FD Symbolic, SPMI, I 3C, I 2C , LIN, MIL-STD-1553, RS-232, SENT, PMBus,SMBus, SPI, UART, USB 1.0/1.1/2.0, USB-PD TD or TDxx: Audio (TDG), FlexRay (TDMP) D: DigRF 3G, DigRF v4, D-PHY, ENET, Manchester, MDIO, NRZ, SpaceWire, USB 2.0-HSIC, 8b/10b DME: ARINC 429TD: SATA, 8b/10bTD or TDME: 100Base-T1, CAN, CAN FD, CAN FD Symbolic, SPMI, I 3C, I 2C , LIN, MIL-STD-1553, RS-232, SENT, PMBus, SMBus, SPI, UART, USB 1.0/1.1/2.0, USB-PD TD or TDxx: Audio (TDG), FlexRay (TDMP) D: DigRF 3G, DigRF v4, ENET, Fibre Channel,Manchester, MDIO, NRZ, PCIe, SAS, SpaceWire, UniPro, USB 2.0-HSIC DP : D-PHY, M-PHY DME: ARINC 429 串行数据分析Eye Jitter and Noise Analysis (SDAIII-CompleteLINQ), Virtual Probe, Eye Doctor II,Serial Data Mask, Cable De-EmbeddingEye and Jitter Analysis (SDAIII), Virtual Probe, Eye Doctor II, Serial Data Mask, Cable De-Embedding Eye Jitter, Virtual Probe, Eye Doctor II, SerialData Mask, Cable De-Embedding 串行数据一致性测试DDR 2/3, LPDDR 2/3, Automotive Ethernet 10Base-T1S, 100Base-T1, 1000Base-T1,Ethernet 10/100/1000Base-T , MIPI D-PHY ,MOST 50/150, PCI Express 1.0, USB 1.1/2.0Automotive Ethernet 10Base-T1S, 100Base-T1,1000Base-T1, Ethernet 10/100/1000Base-T , MOST 50/150, USB 1.1/2.0DDR 2/3, LPDDR 2/3, Automotive Ethernet 10Base-T1S, 100Base-T1, 1000Base-T1, Ethernet 10/100/1000Base-T , MIPI D-PHY ,MOST 50/150, USB 1.1/2.0应用软件选项Spectrum Analyzer (Single, Dual+Reference), Clock and Clock-Data Jitter Analysis, DDRDebug Toolkit, Switch-mode Power Supplyand Device Analysis, Three-phase ElectricalPower, Harmonic, and Vector Analysis, Digital Power Management, Advanced Customization, EMC Pulse Parameters, Digital Filter Package,Protocol Analyzer Synch (ProtoSync), Vector Signal Analysis, Advanced Optical Recording, Disk Drive Analysis, Disk Drive Measurements,Electrical Telecom Pulse Mask TestSpectrum Analyzer (Single, Dual+Reference), Clock and Clock-Data Jitter Analysis, Automotive Ethernet Debug, Switch-mode Power Supply and Device Analysis, Three-phase Electrical Power, Harmonic, and Vector Analysis, Digital Power Management, Advanced Customization, EMC Pulse Parameters, Digital Filter Package, Vector Signal Analysis, Three-phase Electrical and Mechanical PowerAnalysis (included with MDA Models)Spectrum Analyzer (Single, Dual+Reference),Clock and Clock-Data Jitter Analysis, DDR Debug Toolkit, Switch-mode Power Supply and Device Analysis, Advanced Customization, EMC Pulse Parameters, Digital Filter Package, Protocol Analyzer Synch (ProtoSync), VectorSignal Analysis, Advanced Optical Recording, Disk Drive Analysis, Disk Drive Measurements,Electrical Telecom Pulse Mask Test 外设接口USB Host for Storage, USB Device for PC, LAN for PC, GPIB for PC†函数+, -, x, /, FFT, Absolute Value, Average, Copy, Correlation, Derivative, Deskew, Envelope,Enhanced Resolution, Exponent, Floor, Histogram, Integral, Invert, Log, Phistogram, Ptrace Mean, Ptrace Range, Ptrace Sigma, Reciprocal, Rescale, Roof,Segment, Sparse, Square, Square Root, Track, Trend, Zoom +, -, x, /, FFT, Absolute Value, Average, Copy, Correlation, Derivative, Deskew, Envelope,Enhanced Resolution, Exponent, Floor, Histogram, Integral, Invert, Log,Phistogram, Ptrace Mean, Ptrace Range, Ptrace Sigma, Reciprocal, Rescale, Roof, Segment, Sparse, Square, Square Root,Track, Trend, Zoom尺寸 (HWD)345 x 445 x 196 mm (13.6” H x 17.5” W x 7.7” D)345 x 445 x 196 mm (13.6” H x 17.5” W x 7.7” D)358 x 445 x 242 mm (14.1” x 17.5” x 9.5”)重量24.4 lbs (11.1kg)24.4 lbs (11.1kg)25.8 lbs. (11.7 kg)保修3 yr3 yr3 yrHDO6000B/ HDO6000B-MSHDO4000A-MS WaveSurfer 4000HD 带宽350 MHz to 1 GHz 200 MHz to 1 GHz 200 MHz to 1 GHz 分辨率12-bit resolution,15-bit with enhanced resolution12-bit resolution,15-bit with enhanced resolution12-bit resolution,15-bit with enhanced resolution上升时间 1 ns to 450 ps 1.75 ns to 450 ps1.75 ns to 450 ps通道(模拟+数字)4, 4 + 16, 4 + 16 + 244, 4 + 16, 4 + 16 + 244, 4 + 16, 4 + 16 + 24显示15.6” Widescreen Capacitive Touch Screen12.1” WXGA Multi-Touch Screen12.1” Widescreen Capacitive Touch Screen标配存储深度50 Mpts/Ch12.5 Mpts/Ch 25 Mpts Interleaved 12.5 Mpts/Ch 25 Mpts Interleaved 最大存储深度†Up to 250 Mpts Up to 50 Mpts Up to 25 Mpts 采样率Up to 10 GS/sUp to 10 GS/sUp to 5 GS/sMSO 特性†(数字通道)250 MHz, 1.25 GS/s 16 Ch 250 MHz, 1.25 GS/s 16 Ch 125 MHz, 500 MS/s16 Ch触发类型Edge, Width, Glitch, Pattern, Video, HDTV, Runt, Timeout, Slew Rate, Interval (Period), Dropout, Qualified, Measurement, Window, CascadeEdge, Width, Glitch, Pattern, Video, HDTV, Runt, Slew Rate, Interval (Period), Dropout, Qualified, Window Edge, Width, Pattern, Video, HDTV, Runt, Slew Rate, Interval (Period), Dropout, Qualified串行数据† 触发 (T) 解码 (D)测量/图形 (M)眼图 (E)仅图形 (G)物理层 (P)TD or TDME: 100Base-T1, CAN, CAN FD, CAN FD Symbolic, SPMI, I 3C, I 2C , LIN, MIL-STD-1553, RS-232, SENT, PMBus, SMBus, SPI, UART, USB-PD TD or TDxx: Audio (TDG), FlexRay (TDMP) D: DigRF 3G, DigRF v4, D-PHY, ENET, Manchester, MDIO, NRZ, SpaceWire, USB 1.0/1.1/2.0, USB-PD, USB 2.0-HSICDME: ARINC 429TD: 100Base-T1, Audio, CAN, CAN FD, FlexRay, SPMI, I 3C, I 2C , LIN, MIL-STD-1553, RS-232, SENT, PMBus, SMBus, SPI, UART,USB-PDD: ARINC 429, DigRF 3G, DigRF v4, D-PHY, ENET, Manchester, MDIO, NRZ, SpaceWire, USB 1.0/1.1/2.0, USB-PD, USB 2.0-HSIC TD: Audio, CAN, CAN FD, LIN, FlexRay, I2C,SPI, UART, RS232串行数据分析Serial Data Mask ––串行数据一致性测试Automotive Ethernet 10Base-T1S, 100Base-T1, 1000Base-T1, Ethernet 10/100/1000Base-T ,MOST 50/150––应用软件选项Spectrum Analyzer (Single, Dual+Reference), Clock and Clock-Data Jitter Analysis, Switch-mode Power Supply and Device Analysis, Three-phase Electrical Power, Harmonic, and Vector Analysis, Digital Power Management, Advanced Customization, EMC Pulse Parameters, Digital Filter Package, Vector Signal Analysis, Electrical Telecom PulseMask TestSpectrum Analyzer (Single), Switch-mode Power Supply and Device Analysis , Electrical Telecom Pulse Mask Test Spectrum Analyzer (Single), Switch-mode Power Supply and Device Analysis ,Arbitrary Waveform Generator, Digital Voltmeter (Included standard with registration)外设接口USB Host for Storage, USB Device for PCLAN for PC, GPIB for PC†函数+, -, x, /, FFT, Absolute Value, Average, Copy, Correlation, Derivative, Deskew, Envelope, Enhanced Resolution, Exponent, Floor, Histogram, Integral, Invert, Log, Phistogram, Ptrace Mean, Ptrace Range, Ptrace Sigma, Reciprocal, Rescale, Roof, Segment, Sparse, Square, Square Root, Track, Trend, Zoom +, -, x, /, FFT, Absolute Value, Average, Derivative, Deskew, Envelope, Enhanced Resolution, Floor, Integral, Invert, Reciprocal, Rescale, Roof, Square, Square Root, Trend, Zoom +, -, x, /, FFT, Absolute Value, Average, Derivative, Deskew, Envelope, Enhanced Resolution, Floor, Integral, Invert, Reciprocal, Rescale, Roof, Square, Square Root,Trend, Zoom尺寸 (HWD)352 mm x 445 mm x 170 mm (13.8” x 17.5” x 6.7”)291.7 x 399.4 x 131.31 mm (11.48”x 15.72”x 5.17“)273 x 380 x 160 mm (10.7” x 14.9” x 6.3”)重量21 lbs (9.8 kg)12.6 lbs (5.71 kg)11.7 lbs (5.3 kg)保修3 yr3 yr3 yrWaveSurfer 3000z T3DSO2000AT3DSO1000 / T3DSO1000A带宽100 MHz to 1 GHz 100 MHz to to 500 MHz100 MHz to 350 MHz 分辨率8-bit resolution,11-bit with enhanced resolution8-bit resolution,11-bit with enhanced resolution8-bit resolution,11-bit with enhanced resolution上升时间 3.5 ns to 430 ps3.5 ns to 800 ps3.5 ns to 1 ns通道(模拟+数字)4, 4+162 or 4, 2 or 4 + 16 2 or 4,2 or 4 + 16显示10.1” Capacitive Touch Screen10.1” CapacitiveTouch Screen 1024 x 6007" 800 x 480标配存储深度10 Mpts/Ch, 20 Mpts Interleaved 100 Mpts/Ch,200 Mpts interleavedT3DSO1000:7 Mpts/Ch, 14 Mpts interleaved,T3DSO1000A:14 Mpts/Ch, 28 Mpts interleaved最大存储深度†Up to 20 Mpts Up to 200 Mpts Up to 28 Mpts采样率Up to 4 GS/s100 MHz models: Up to 2 GS/sUp to 2 GS/sT3DSO1000: Up to 1 GS/s T3DSO1000A: Up to 2 GS/sMSO 特性†(数字通道)125 MHz, 500 MS/s 500 MS/s, 3.3 ns min detectable pulse width250 MHz, 1 GS/s 触发类型Edge, Width, Pattern, TV , Runt, Slew Rate, Interval (Period), Dropout, QualifiedEdge, Pulse, Pattern, Video, Runt, Slope, Interval, Dropout, Window / Zone Edge,Pulse, Pattern, Video, Runt, Slope,Interval, Dropout, Window 串行数据† 触发 (T) 解码 (D)测量/图形 (M)眼图 (E)仅图形 (G)物理层 (P)TD: Audio, CAN, CAN FD, FlexRay, I 2C , LIN,RS-232, SPI, UARTTD: I 2C, SPI, UART- RS232, CAN, LIND: CAN FD, FlexRay, I 2S,MILSTD-1553BTD: I 2C, SPI, UART-RS232, CAN, LIN串行数据分析–––串行数据一致性测试–––应用软件选项Switch-mode Power Supply and Device Analysis , Function Generator , Digital Voltmeter (Included standard withregistration)Arbitrary Waveform Generator, Switchmode Power Supply and DeviceAnalysis, Bode Plot, 10-bit mode, Mask TestArbitrary Waveform Generator, WiFi, BodePlot外设接口USB Host, USB Device, LAN, GPIB, and LXICompatibleUSB Host, USB Device, LAN USB Host, USB Device, LAN 函数+, -, x, /, FFT, Absolute Value, Average, Derivative, Envelope, Floor, Integral, Invert, Reciprocal, Rescale, Roof, SinX/x, Square,Square Root, Trend, Zoom+, -, x, /, FFT, Derivative, Integral, Square Root / Formula Editor+, -, x, /, FFT, Derivative, Integral,Square Root尺寸 (HWD)270 x 380 x 125 mm (10.63” x 14.96” x 4.92”)224 x 352 x 111 mm (8.81” x 13.86” x 4.37”)150 x 312 x 133 mm (5.91"x 12.28" x 5.94")重量10.6 lbs (4.81 kg)7.92 lbs. (3.6 kg)/ 8.6 lbs. (3.9 kg)5.72 lbs. (2.6 kg)保修3 yr3 yr3 yrMDA 8000HD 电机驱动分析仪三相电机功率分析电机驱动工程师需要了解驱动系统运行的每个部分，需要查看控制、传感器、功率器件和功率的波形，需要了解动态事件，并且需要灵活地调试任何异常，电机驱动分析仪可以完成所有工作。

Haiwell_PLC选型手册

Haiwell 厦门海为科技有限公司1、产品简介及型号说明1.1 Haiwell PLC简介Haiwell PLC是一款通用型高性价比的小型可编程控制器，产品广泛应用于塑料、包装、纺织、食品、医疗、制药、环保、市政、印刷、建材、电梯、中央空调、数控机床等领域的系统和控制设备。

Haiwell PLC除自身带有各种外设接口（开关量输入、开关量输出、模拟量输入、模拟量输出、高速计数器、高速脉冲输出通道、电源、通信端口等）外，还可扩展各种类型的扩展模块，进行灵活的配置。

海为公司拥有Haiwell PLC的全部软硬件知识产权，可以针对您的特殊要求提供定制服务，以满足各个行业不同场合的需求。

Haiwell 系列PLC已通过CE认证1.2 Haiwell PLC的特点●硬件升级功能：无论是CPU或扩展模块，您都可以通过硬件升级功能对硬件进行免费升级，享受海为公司不断推出的各种最新功能，充分体现您的尊贵和价值。

●丰富的网络通讯功能：CPU主机内置2个通讯口，可扩展至5个通讯口，每个通讯口都可以进行编程和联网，都可作为主站或从站。

支持1：N、N：1、N：N联网方式，支持各种人机界面和组态软件，可与任何带通讯功能的第三方设备（如变频器、仪表、条码阅读器等）联网。

●支持多种通讯协议：内置Modbus RTU/ASCII协议、自由通讯协议以及海为公司的HaiwellBus高速通讯协议。

极为便利的通讯指令系统，使您无论使用何种通讯协议都只需一条通讯指令便可完成复杂的通讯功能，您无须再为通讯端口冲突、发送接收控制、通讯中断处理等问题烦恼，您可以在程序中混合使用各种协议轻松完成您所需的各种数据交换。

保护您原有的各项投资。

●高速并行总线：Haiwell PLC采用高速并行总线进行扩展，丰富的扩展模块类型充分满足您的各种应用需求。

●高速计数功能：支持8段比较设定值，7种计数模式（脉冲/方向1倍频、脉冲/方向2倍频、正/反转脉冲1倍频、正/反转脉冲2倍频、A/B相脉冲1倍频、A/B相脉冲2倍频、A/B相脉冲4倍频），3种比较方式（单段比较、绝对方式比较、相对方式比较），带自学习功能。

龙芯 2K1000LA 处理器用户手册说明书

未经书面许可，任何公司和个人不得将此文档中的任何部分公开、转载或以其他方式散发给第三方。

否则，必将追究其法律责任。

免责声明本文档仅提供阶段性信息，所含内容可根据产品的实际情况随时更新，恕不另行通知。

如因文档使用不当造成的直接或间接损失，本公司不承担任何责任。

龙芯中科技术股份有限公司Loongson Technology Corporation Limited地址：北京市海淀区中关村环保科技示范园龙芯产业园2号楼Building No.2, Loongson Industrial Park, Zhongguancun Environmental Protection Park电话(Tel)：************传真(Fax)：************阅读指南《龙芯2K1000LA处理器用户手册》主要介绍龙芯2K1000LA架构与寄存器描述，对芯片系统架构、主要模块的功能与配置、寄存器列表及位域进行详细说明。

版本信息手册信息反馈: *******************。

目录目录....................................................................................................................................... I 图目录 ................................................................................................................................. I X 表目录 .................................................................................................................................. X 1 概述 . (1)1.1体系结构框图 (1)1.2芯片主要功能 (2)1.2.1 处理器核 (2)1.2.2 内存接口 (2)1.2.3 PCIE接口 (3)1.2.4 GPU (3)1.2.5 显示控制器 (3)1.2.6 SATA控制器 (3)1.2.7 USB2.0 控制器 (3)1.2.8 GMAC控制器 (3)1.2.9 VPU解码器 (4)1.2.10 CAMERA控制器 (4)1.2.11 HDA控制器 (4)1.2.12 I2S控制器 (4)1.2.13 NAND控制器 (5)1.2.14 SPI控制器 (5)1.2.15 UART (5)1.2.16 I2C总线 (5)1.2.17 PWM (6)1.2.18 HPET (6)1.2.19 RTC (6)1.2.20 Watchdog (6)1.2.21 中断控制器 (6)1.2.22 CAN (6)1.2.23 ACPI功耗管理 (6)1.2.24 GPIO (7)1.2.25 加解密模块 (7)1.2.26 SDIO控制器 (7)2 引脚定义 (8)2.1约定 (8)2.2DDR3接口 (8)2.3PCIE接口 (9)2.4DVO显示接口 (9)2.5GMAC接口 (11)2.6SATA接口 (12)2.7USB接口 (12)2.8CAMERA接口 (12)2.9HDA接口 (13)2.10SPI接口 (14)2.11I2C接口 (14)2.12UART接口 (14)2.13CAN接口 (15)2.14NAND接口 (16)2.15SDIO接口 (16)2.16GPIO (16)2.17PWM (17)2.18PLL电源接口 (17)2.19电源管理接口 (17)2.20测试接口 (18)2.21JTAG接口 (18)2.22时钟信号 (18)2.23RTC相关信号 (18)2.24系统相关信号 (19)2.25外设功能复用表 (20)3 时钟结构 (21)3.1NODE PLL (21)3.2PIX PLL (21)3.3DDR PLL (22)3.4DC PLL (22)3.5内部PLL配置方法 (23)3.5.1 硬件配置 (23)3.5.2 软件配置 (23)3.6BOOT时钟 (24)3.7USB参考时钟 (24)3.8PCIE参考时钟 (24)3.9SATA参考时钟输入 (24)4 电源管理 (25)4.1电源管理模块介绍 (25)4.2电源级别 (25)4.3控制引脚说明 (25)5 芯片配置寄存器 (27)5.1通用配置寄存器0 (34)5.2通用配置寄存器1 (36)5.3通用配置寄存器2 (37)5.4APBDMA配置寄存器 (39)5.5USB PHY0/1配置寄存器 (40)5.6USB PHY2/3配置寄存器 (44)5.7SATA配置寄存器 (45)5.8NODE PLL低64位配置寄存器 (46)5.9NODE PLL高64位配置寄存器 (47)5.10DDR PLL低64位配置寄存器 (47)5.11DDR PLL高64位配置寄存器 (48)5.12DC PLL低64位配置寄存器 (48)5.13DC PLL高64位配置寄存器 (49)5.14PIX0PLL低64位配置寄存器 (49)5.15PIX0PLL高64位配置寄存器 (50)5.16PIX1PLL低64位配置寄存器 (51)5.17PIX1PLL高64位配置寄存器 (51)5.18FREQSCALE配置寄存器 (52)5.19PCIE0配置寄存器0 (52)5.20PCIE0配置寄存器1 (53)5.21PCIE0PHY配置控制寄存器 (54)5.22PCIE1配置寄存器0 (54)5.23PCIE1配置寄存器1 (55)5.24PCIE1PHY配置控制寄存器 (56)5.25DMA命令控制寄存器(DMA_ORDER) (56)5.26PCICFG2_RECFG寄存器 (57)5.27PCICFG30_RECFG寄存器 (57)5.28PCICFG31_RECFG寄存器 (58)5.29PCICFG40_RECFG寄存器 (59)5.30PCICFG41_RECFG寄存器 (59)5.31PCICFG42_RECFG寄存器 (60)5.32PCICFG5_RECFG寄存器 (60)5.33PCICFG6_RECFG寄存器 (61)5.34PCICFG7_RECFG寄存器 (61)5.35PCICFG8_RECFG寄存器 (62)5.36PCICFG F_RECFG寄存器 (63)5.37PCICFG10_RECFG寄存器 (63)5.38PCICFG11_RECFG寄存器 (64)6 地址空间分配 (65)6.1一级交叉开关 (66)6.2二级交叉开关 (66)6.3IO互连网络 (69)6.3.1 IO设备的配置空间 (70)6.3.2 APB配置头 (77)6.3.3 GMAC0/1 配置头 (78)6.3.4 USB OTG配置头 (78)6.3.5 USBEHCI配置头 (79)6.3.6 USB OHCI 配置头 (79)6.3.7 GPU配置头 (79)6.3.8 DC配置头 (80)6.3.9 HDA配置头 (80)6.3.10 SATA配置头 (81)6.3.11 PCIE配置头 (81)6.3.12 DMA配置头 (82)6.3.13 VPU配置头 (82)6.3.14 CAMERA配置头 (83)6.3.15 N/A处理 (83)6.4IODMA请求 (83)6.5APB设备路由 (86)7 处理器核间中断与通信 (88)8 温度传感器 (90)8.1实时温度采样 (90)8.2高低温中断触发 (90)8.3高温自动降频设置 (91)9 I/O中断 (93)9.1中断触发类型 (94)9.2中断分发模式 (94)9.3中断相关寄存器描述 (94)9.4GPIO中断 (99)9.5MSI中断 (99)9.6硬件中断负载均衡功能举例 (100)10 SPI控制器 (103)10.1访问地址 (103)10.2SPI控制器结构 (103)10.3配置寄存器 (103)10.3.1 控制寄存器(SPCR) (103)10.3.2 状态寄存器(SPSR) (104)10.3.3 数据寄存器(TxFIFO/RxFIFO) (104)10.3.4 外部寄存器(SPER) (104)10.3.5 参数控制寄存器(SFC_PARAM) (105)10.3.6 片选控制寄存器(SFC_SOFTCS) (105)10.3.7 时序控制寄存器(SFC_TIMING) (105)10.4接口时序 (106)10.4.1 SPI主控制器接口时序 (106)10.4.2 SPI Flash访问时序 (106)10.5软件编程指南 (107)10.5.1 SPI主控制器的读写操作 (107)10.5.2 硬件SPI Flash读 (107)10.5.3 混合访问SPI Flash和SPI主控制器 (108)11 LocalIO控制器 (109)11.1访问地址及引脚复用 (109)11.2L OCAL IO控制器功能概述 (109)12 DDR3控制器 (111)12.1访问地址 (111)12.2DDR3SDRAM控制器功能概述 (111)12.3DDR3SDRAM读操作协议 (111)12.4DDR3SDRAM写操作协议 (112)12.5DDR3控制器寄存器 (112)13 GPIO (116)13.1GPIO方向控制 (116)13.2GPIO输出设置 (116)13.3GPIO输入采样 (116)13.4GPIO中断使能 (116)13.5GPIO复用关系 (117)14 APB设备（Dev 2） (119)14.1内部设备地址路由 (119)15 UART控制器 (121)15.1概述 (121)15.2访问地址及引脚复用 (121)15.3控制器结构 (121)15.4寄存器描述 (122)15.4.1 数据寄存器（DAT） (122)15.4.2 中断使能寄存器（IER） (122)15.4.3 中断标识寄存器（IIR） (123)15.4.4 FIFO控制寄存器（FCR） (123)15.4.5 线路控制寄存器（LCR） (124)15.4.6 MODEM控制寄存器（MCR） (124)15.4.7 线路状态寄存器（LSR） (125)15.4.8 MODEM状态寄存器（MSR） (126)15.4.9 分频锁存器 (126)16 CAN (127)16.1访问地址及引脚复用 (127)16.2标准模式 (127)16.2.1 控制寄存器（CR） (128)16.2.2 命令寄存器（CMR） (129)16.2.3 状态寄存器（SR） (129)16.2.4 中断寄存器（IR） (130)16.2.5 验收代码寄存器（ACR） (130)16.2.6 验收屏蔽寄存器（AMR） (130)16.2.7 发送缓冲区列表 (131)16.2.8 接收缓冲区列表 (131)16.3扩展模式 (131)16.3.1 模式寄存器（MOD） (134)16.3.2 命令寄存器（CMR） (134)16.3.3 状态寄存器（SR） (135)16.3.4 中断寄存器（IR） (135)16.3.5 中断使能寄存器（IER） (136)16.3.6 仲裁丢失捕捉寄存器 (136)16.3.7 错误警报限制寄存器（EMLR） (137)16.3.8 RX错误计数寄存器（RXERR） (138)16.3.9 TX错误计数寄存器（TXERR） (138)16.3.10 验收滤波器 (138)16.3.11 RX信息计数寄存器（RMCR） (138)16.4公共寄存器 (138)16.4.1 总线定时寄存器0（BTR0） (138)16.4.2 总线定时寄存器1（BTR1） (139)16.4.3 输出控制寄存器（OCR） (139)17 I2C控制器 (140)17.1概述 (140)17.2访问地址及引脚复用 (140)17.3I2C控制器结构 (140)17.4I2C控制器寄存器说明 (141)17.4.1 分频锁存器低字节寄存器（PRERlo） (141)17.4.2 分频锁存器高字节寄存器（PRERhi） (141)17.4.3 控制寄存器（CTR） (141)17.4.4 发送数据寄存器（TXR） (142)17.4.5 接受数据寄存器（RXR） (142)17.4.6 命令控制寄存器（CR） (142)17.4.7 状态寄存器（SR） (143)18 PWM控制器 (144)18.1概述 (144)18.2访问地址及引脚复用 (144)18.3寄存器描述 (144)18.4功能说明 (145)18.4.1 脉宽调制功能 (145)18.4.2 脉冲测量功能 (145)18.4.3 防死区功能 (146)19 HPET控制器 (147)19.1概述 (147)19.2访问地址 (147)19.3寄存器描述 (147)20 NAND控制器 (151)20.1NAND控制器结构描述 (151)20.2访问地址及引脚复用 (151)20.3NAND寄存器配置描述 (151)20.3.1 命令寄存器NAND_CMD (偏移地址0x00) (151)20.3.2 页内偏移地址寄存器ADDR_C (偏移地址0x04) (152)20.3.3 页地址寄存器ADDR_R (偏移地址0x08) (152)20.3.4 时序寄存器NAND_TIMING (偏移地址0x0C) (152)20.3.5 ID寄存器ID_L (偏移地址0x10) (153)20.3.6 ID和状态寄存器STATUS & ID_H (偏移地址0x14) (153)20.3.7 参数配置寄存器NAND_PARAMETER (偏移地址0x18) (153)20.3.8 操作数量寄存器NAND_OP_NUM (偏移地址0x1C) (153)20.3.9 映射寄存器CS_RDY_MAP (偏移地址0x20) (154)20.3.10 DMA读写数据寄存器DMA_ADDRESS (偏移地址0x40) (154)20.4NAND ADDR说明 (154)20.5NAND-FLASH读写操作举例 (157)20.6NAND ECC说明 (157)20.7支持NAND型号 (159)21 电源管理模块 (160)21.1概述 (160)21.2访问地址 (160)21.3寄存器描述 (160)22 RTC (170)22.1概述 (170)22.2访问地址 (170)22.3寄存器描述 (170)22.3.1 寄存器地址列表 (170)22.3.2 SYS_TOYWRITE0 (171)22.3.3 SYS_TOYWRITE1 (171)22.3.4 SYS_TOYREAD0 (171)22.3.5 SYS_TOYREAD1 (171)22.3.6 SYS_TOYMATCH0/1/2 (172)22.3.7 SYS_RTCCTRL (172)22.3.8 SYS_RTCWRITE (173)22.3.9 SYS_RTCREAD (173)22.3.10 SYS_RTCMA TCH0/1/2 (173)23 加解密 (174)23.1DES (174)23.1.1 DES功能概述 (174)23.1.2 DES访问地址： (174)23.1.3 DES寄存器描述 (174)23.2AES (175)23.2.1 AES功能概述 (175)23.2.2 AES访问地址： (176)23.2.3 AES寄存器描述 (176)23.3RSA (178)23.3.1 RSA访问地址： (178)23.4RNG (178)23.4.1 RNG访问地址： (178)24 SDIO控制器 (179)24.1功能概述 (179)24.2访问地址及引脚复用 (179)24.3SDIO协议概述 (179)24.4寄存器描述 (180)24.5软件编程指南 (186)24.5.1 SD Memory卡软件编程说明 (186)24.5.2 SDIO卡软件编程说明 (188)24.6支持SDIO型号 (189)25 I2S控制器 (190)25.1概述 (190)25.2访问地址及引脚复用 (190)25.3接口协议 (190)25.4专用寄存器 (191)25.5配置操作 (192)26 GMAC控制器（Dev 3） (194)26.1访问地址及引脚复用 (194)27 OTG控制器（Dev 4, Fun 0） (195)27.1概述 (195)27.2访问地址 (195)28 USB控制器（Dev 4, Fun 1/2） (196)28.1总体概述 (196)28.2访问地址 (196)29 图形处理器（Dev 5） (198)29.1访问地址 (198)30 显示控制器（Dev 6） (199)30.1概述 (199)30.2访问地址及引脚复用 (199)31 HDA控制器（Dev 7） (200)31.1功能概述 (200)31.2访问地址 (200)32 SATA控制器（Dev 8） (201)32.1SATA总体描述 (201)32.2访问地址 (201)32.3SATA控制器内部寄存器描述 (201)33 PCIE控制器（Dev 9/A/B/C/D/E） (203)33.1总体结构 (203)33.2访问地址 (203)33.3地址空间划分 (204)33.4软件编程指南 (205)33.4.1 PCIE控制器使能 (205)33.4.2 PCIE配置头访问 (205)33.4.3 PCIE链路建立(Linkup) (205)33.4.4 TYPE1类型配置访问 (206)33.4.5 PCIE PHY配置方法 (206)33.5常用例程 (206)34 DMA控制器（Dev F） (209)34.1DMA控制器结构描述 (209)34.2访问地址 (209)34.3DMA控制器与APB设备的交互 (210)34.4DMA描述符 (210)34.4.1 DMA_ORDER_ADDR_LOW (210)34.4.2 DMA_SADDR (210)34.4.3 DMA_DADDR (211)34.4.4 DMA_LENGTH (211)34.4.5 DMA_STEP_LENGTH (211)34.4.6 DMA_STEP_TIMES (212)34.4.7 DMA_CMD (212)34.4.8 DMA_ORDER_ADDR_HIGH (213)34.4.9 DMA_SADDR_HIGH (213)35 VPU控制器（Dev 16） (214)35.1访问地址 (214)36 CAMERA接口控制器（Dev 17） (215)36.1功能概述 (215)36.2访问地址 (215)图1-1 龙芯2K1000结构图 (2)图3-1 NODE PLL结构图 (21)图3-2 PIX PLL结构图 (22)图3-3 DDR PLL结构图 (22)图3-4 DC PLL结构图 (23)图3-5 BOOT时钟结构图 (24)图6-1 二级交叉开关地址路由示意图 (66)图6-2 IO互连结构图 (70)图6-3 64位配置访问地址格式 (70)图6-4 32位配置访问地址格式 (71)图9-1 龙芯2K1000处理器中断路由示意图 (93)图10-1 SPI主控制器接口时序 (106)图10-2 SPI Flash标准读时序 (106)图10-3 SPI Flash快速读时序 (106)图10-4 SPI Flash双向I/O读时序 (107)图11-1 LocalIO读时序 (109)图11-2 LocalIO写时序 (110)图12-1 DDR3 SDRAM读操作协议 (112)图12-2 DDR3 SDRAM写操作协议 (112)图15-1 UART控制器结构 (122)图17-1 I2C主控制器结构 (141)图18-1 防死区功能 (146)图24-1 SD卡多块写操作示意图 (180)图24-2 SD卡多块读操作示意图 (180)图24-3 SD Memory卡初始化流程示意图 (187)图25-1 I2S传输协议 (191)图28-1 USB主机控制器模块图 (196)图33-1 PCIE控制器结构 (203)表2-1 信号类型代码 (8)表2-2 DDR3SDRAM控制器接口信号 (8)表2-3 PCIE总线信号 (9)表2-4 DVO接口信号 (9)表2-5 DVO接口RGB对应关系 (10)表2-6 DVO0与LIO复用关系 (10)表2-7 DVO0与UART复用关系 (10)表2-8 GMAC接口信号 (11)表2-9 GMAC1与GPIO复用关系 (11)表2-10 SATA接口信号 (12)表2-11 SATA与GPIO复用关系 (12)表2-12 USB接口信号 (12)表2-13 CAMERA接口信号 (12)表2-14 CAMERA与DVO1复用关系 (13)表2-15 HDA接口信号 (13)表2-16 HDA与I2S复用关系 (13)表2-17 HDA与GPIO复用关系 (13)表2-18 SPI接口信号 (14)表2-19 I2C接口信号 (14)表2-20 I2C与GPIO复用关系 (14)表2-21 UART接口信号 (14)表2-22 UART接口复用关系 (15)表2-23 CAN接口信号 (15)表2-24 CAN与GPIO复用关系 (15)表2-25 NAND接口信号 (16)表2-26 NAND与GPIO复用关系 (16)表2-27 SDIO接口信号 (16)表2-28 SDIO与GPIO复用关系 (16)表2-29 GPIO信号 (17)表2-30 PWM信号 (17)表2-31 PWM与GPIO复用关系 (17)表2-32 PLL电源接口 (17)表2-33 电源管理接口 (17)表2-34 测试接口 (18)表2-35 JTAG接口 (18)表2-36 时钟信号 (18)表2-37 时钟信号 (18)表2-38 系统相关信号 (19)表2-39 外设功能复用表 (20)表3-1 PLL硬件配置 (23)表4-1 ACPI状态说明 (25)表4-2 控制引脚说明 (25)表5-1 芯片配置寄存器列表 (27)表5-2 通用配置寄存器0 (34)表5-3 通用配置寄存器1 (36)表5-4 通用配置寄存器2 (37)表5-5 APBDMA配置寄存器 (39)表5-6 USB 0/1 PHY配置寄存器 (40)表5-7 USB 2/3 PHY配置寄存器 (44)表5-8 SATA配置寄存器 (45)表5-9 NODE PLL低64位配置寄存器 (46)表5-10 NODE PLL高64位配置寄存器 (47)表5-11 DDR PLL低64位配置寄存器 (47)表5-12 DDR PLL高64位配置寄存器 (48)表5-13 DC PLL低64位配置寄存器 (48)表5-14 DC PLL高64位配置寄存器 (49)表5-15 PIX0 PLL低64位配置寄存器 (49)表5-16 PIX0 PLL高64位配置寄存器 (50)表5-17 PIX1 PLL低64位配置寄存器 (51)表5-18 PIX1 PLL高64位配置寄存器 (51)表5-19 FRESCALE配置寄存器 (52)表5-20 PCIE0配置寄存器0 (52)表5-21 PCIE0配置寄存器1 (53)表5-22 PCIE0 PHY配置寄存器 (54)表5-23 PCIE1配置寄存器0 (54)表5-24 PCIE1配置寄存器1 (55)表5-25 PCIE1 PHY配置寄存器 (56)表5-26 DMA命令控制寄存器 (56)表5-27 PCICFG2_RECFG配置寄存器 (57)表5-28 PCICFG30_RECFG配置寄存器 (57)表5-29 PCICFG31_RECFG配置寄存器 (58)表5-30 PCICFG40_RECFG配置寄存器 (59)表5-31 PCICFG41_RECFG配置寄存器 (59)表5-32 PCICFG42_RECFG配置寄存器 (60)表5-33 PCICFG5_RECFG配置寄存器 (60)表5-34 PCICFG6_RECFG配置寄存器 (61)表5-35 PCICFG7_RECFG配置寄存器 (61)表5-36 PCICFG8_RECFG配置寄存器 (62)表5-37 PCICFGf_RECFG配置寄存器 (63)表5-38 PCICFG10_RECFG配置寄存器 (63)表5-39 PCICFG11_RECFG配置寄存器 (64)表6-1 芯片地址空间划分 (65)表6-2 一级交叉开关路由规则 (66)表6-3 二级交叉开关处标号与所述模块的对应关系 (67)表6-4 MMAP字段对应的该空间访问属性 (67)表6-5 二级交叉开关地址窗口转换寄存器表 (67)表6-6 各个设备的配置头访问对应关系 (71)表6-7 Type0类型配置头 (72)表6-8 Type0的配置头寄存器 (72)表6-9 Type1类型配置头 (74)表6-10 Type1的配置头寄存器 (75)表6-11 APB总线控制器的配置头缺省值 (77)表6-12 GMAC0控制器的配置头缺省值 (78)表6-13 USB-OTG控制器的配置头缺省值 (78)表6-14 USB-EHCI控制器的配置头缺省值 (79)表6-15 USB-OHCI控制器的配置头缺省值 (79)表6-16 GPU控制器的配置头缺省值 (80)表6-17 DC控制器的配置头缺省值 (80)表6-18 HDA控制器的配置头缺省值 (80)表6-19 SATA控制器的配置头缺省值 (81)表6-20 PCIE0 Port0的配置头缺省值 (81)表6-21 DMA控制器的配置头缺省值 (82)表6-22 VPU解码器的配置头缺省值 (82)表6-23 CAMERA控制器的配置头缺省值 (83)表6-24 MMAP字段对应的该空间访问属性 (84)表6-25 IO设备DMA访存地址转换寄存器表 (84)表6-26 APB设备地址译码 (86)表7-1 处理器核间中断相关的寄存器及其功能描述 (88)表7-2 0号处理器核核间中断与通信寄存器列表 (88)表7-3 1号处理器核的核间中断与通信寄存器列表 (88)表8-1 温度采样寄存器说明 (90)表8-2 高低温中断寄存器说明 (91)表8-3 高温降频控制寄存器说明 (92)表9-1 中断控制寄存器属性 (94)表9-2 中断控制寄存器地址 (96)表9-3 中断路由寄存器的说明 (97)表9-4 中断路由寄存器地址 (97)表9-5 GPIO中断 (99)表9-6 MSI中断相关寄存器 (100)表10-1 SPI控制器地址空间分配 (103)表10-2 SPI配置寄存器列表 (103)表10-3 SPI控制寄存器(SPCR) (103)表10-4 SPI状态寄存器(SPSR) (104)表10-5 SPI数据寄存器(TxFIFO/RXFIFO) (104)表10-6 SPI外部寄存器(SPER) (104)表10-7 SPI分频系数 (104)表10-8 SPI参数控制寄存器(SFC_PARAM) (105)表10-9 SPI片选控制寄存器(SFC_SOFTCS) (105)表10-10 SPI时序控制寄存器(SFC_TIMING) (105)表11-1 LocalIO地址空间分配 (109)表12-1 内存控制器地址空间分配 (111)表12-2 DDR3控制器配置寄存器 (112)表13-1 GPIO配置寄存器 (116)表13-2 GPIO方向控制 (116)表13-3 GPIO输出设置 (116)表13-4 GPIO输入采样 (116)表13-5 GPIO中断使能 (116)表13-6 GPIO复用关系 (117)表14-1 APB配置访问信息 (119)表14-2 APB设备地址译码 (119)表15-1 UART控制器物理地址构成 (121)表15-2 UART数据寄存器 (122)表15-3 UART中断使能寄存器 (123)表15-4 UART中断标识寄存器 (123)表15-5 UART中断控制功能表 (123)表15-6 UART的FIFO控制寄存器 (124)表15-7 UART线路控制寄存器 (124)表15-8 UART的MODEM控制寄存器 (125)表15-9 UART线路状态寄存器 (125)表15-10 UART的MODEM状态寄存器 (126)表15-11 UART分频锁存器1 (126)表15-12 UART 分频锁存器2 (126)表16-1 CAN内部寄存器物理地址构成 (127)表18-1 PWM寄存器列表 (144)表18-2 PWM控制寄存器设置 (144)表25-1 寄存器定义 (191)表25-2 标识寄存器 (191)表25-3 配置寄存器 (191)表25-4 控制寄存器 (192)表34-1 DMA ORDER寄存器 (209)1概述龙芯2K1000LA处理器（简称龙芯2K1000）主要面向于网络应用，兼顾平板应用及工控领域应用。

尔零磁通直流大电流传感器

尔零磁通直流大电流传感器[点击数：3192 更新时间：2006年06月06日]一、概述HLZ系列测量仪是一种先进的工业用直流大电流测量仪。

仪表能够同时输出直流电流电压两钟信号，可与各种直流电流二次仪表配合使用，可广泛应用于冶金、化工、炭素等工业对现场直流大电流进行测量和控制。

HLZ系列测量仪为电流比较式仪表、采用多通道闭环检测原理，具有高准确度高重复性、高分辨率等特点。

其各项技术指标均达到美国哈尔马公司精密型产品的技术标准。

该仪表全部采用集成电路，性能稳定可靠，测量头开口方式安装，使用维修方便。

二、产品技术指标及性能产品型号：HLZ系列测量范围：6-360KA测量原理：霍尔零磁通比较式原理出厂检测精度：±0.1%现场使用精度：±0.2%线形误差：±0.05%响应时间：±5.5ms功耗：1VA/KA外磁场影响：100高斯误差小于0.1%电源电压：220V（50H Z-60H Z）输出方式：1、电流输出1A/5000A 0-26mA2、电压输出0-1V 0-5V 0-10V使用条件：环境温度-450C-550C地震烈度小于9度户外使用防腐防水结构特点：开口方式，安装方便，安装时不必停电。

四、霍尔电流传感器的原理霍尔电流传感器是利用霍尔效应原理制成的检测电流装置，它突出的特点是能测量直流、工频、高频等各种波形的电流，而且是电隔离的。

输出为电压信号或电流信号，精度普遍较高，虽说要辅助电源，但功耗很小，重量轻。

使用方便可靠，是新一代电流传感器。

一、霍尔效应与电流传感器的联系霍尔效应是1879年由美国物理学家EHHall首先在金属材料中发现的。

至今，霍尔效应已在很多领域得到应用。

随着半导体工业的进步，早期利用锗、铋等材料制成的霍尔效应元件（简称霍尔元件），也逐步发展到了现在的硅、砷化镓、锑化钿等霍尔元件，性能有很大的提高，并进入了实用阶段，成为科技领域中不可缺少的新型器件之一。

LM301AHNOPB,LM101AHNOPB,LM301ANNOPB,LM201AH,LM101AJ, 规格书,Datasheet 资料

LM101A,LM201A,LM301ALM101A/LM201A/LM301A Operational AmplifiersLiterature Number: SNOSBS0C 芯天下--/LM101A/LM201A/LM301A Operational AmplifiersGeneral DescriptionThe LM101A series are general purpose operational ampli-fiers which feature improved performance over industry stan-dards like the LM709.Advanced processing techniques make possible an order of magnitude reduction in input currents,and a redesign of the biasing circuitry reduces the temperature drift of input current.Improved specifications include:•Offset voltage 3mV maximum over temperature (LM101A/LM201A)•Input current 100nA maximum over temperature (LM101A/LM201A)•Offset current 20nA maximum over temperature (LM101A/LM201A)•Guaranteed drift characteristics•Offsets guaranteed over entire common mode and sup-ply voltage ranges•Slew rate of 10V/µs as a summing amplifierThis amplifier offers many features which make its appli-cation nearly foolproof:overload protection on the inputand output,no latch-up when the common mode range is exceeded,and freedom from oscillations and compensa-tion with a single 30pF capacitor.It has advantages over internally compensated amplifiers in that the frequency compensation can be tailored to the particular applica-tion.For example,in low frequency circuits it can be overcompensated for increased stability margin.Or the compensation can be optimized to give more than a factor of ten improvement in high frequency performance for most applications.In addition,the device provides better accuracy and lower noise in high impedance circuitry.The low input currents also make it particularly well suited for long interval integrators or timers,sample and hold circuits and low frequency waveform generators.Further,replac-ing circuits where matched transistor pairs buffer the inputs of conventional IC op amps,it can give lower offset voltage and a drift at a lower cost.The LM101A is guaranteed over a temperature range of −55˚C to +125˚C,the LM201A from −25˚C to +85˚C,and the LM301A from 0˚C to +70˚C.Fast AC/DC Converter00775233Note 1:Feedforward compensation can be used to make a fast full wave rectifier without a filter.August 2000LM101A/LM201A/LM301A Operational Amplifiers©2004National Semiconductor Corporation Absolute Maximum Ratings (Note 2)If Military/Aerospace specified devices are required,please contact the National Semiconductor Sales Office/Distributors for availability and specifications.LM101A/LM201ALM301ASupply Voltage±22V ±18V Differential Input Voltage ±30V ±30V Input Voltage (Note 3)±15V±15VOutput Short Circuit Duration (Note 4)ContinuousContinuous Operating Ambient Temp.Range −55˚C to +125˚C (LM101A)0˚C to +70˚C−25˚C to +85˚C (LM201A)T J Max H-Package 150˚C 100˚C N-Package 150˚C 100˚C J-Package150˚C100˚C Power Dissipation at T A =25˚C H-Package (Still Air)500mW 300mW (400LF/Min Air Flow)1200mW 700mW N-Package 900mW 500mW J-Package1000mW 650mW Thermal Resistance (Typical)θjAH-Package (Still Air)165˚C/W 165˚C/W (400LF/Min Air Flow)67˚C/W 67˚C/W N Package 135˚C/W 135˚C/W J-Package 110˚C/W 110˚CmW (Typical)θjCH-Package25˚C/W 25˚C/W Storage Temperature Range−65˚C to +150˚C−65˚C to +150˚CLead Temperature (Soldering,10sec.)Metal Can or Ceramic 300˚C 300˚C Plastic260˚C 260˚C ESD Tolerance (Note 7)2000V 2000VElectrical Characteristics (Note 5)T A =T JParameterConditionsLM101A/LM201A LM301A UnitsMinTyp Max Min Typ Max Input Offset Voltage T A =25˚C,R S ≤50k Ω0.7 2.0 2.07.5mV Input Offset Current T A =25˚C 1.510 3.050nA Input Bias Current T A =25˚C 307570250nA Input Resistance T A =25˚C 1.54.00.52.0M ΩSupply CurrentT A =25˚CV S =±20V 1.83.0mA V S =±15V1.8 3.0mA Large Signal Voltage Gain T A =25˚C,V S =±15V 5016025160V/mV V OUT =±10V,R L ≥2k ΩInput Offset VoltageR S ≤50k Ω 3.010mV Average Temperature Coefficient R S ≤50k Ω3.0156.030µV/˚Cof Input Offset Voltage Input Offset Current2070nA Average Temperature Coefficient 25˚C ≤T A ≤T MAX 0.010.10.010.3nA/˚C of Input Offset Current T MIN ≤T A ≤25˚C0.020.20.020.6nA/˚C Input Bias Current0.10.3µAL M 101A /L M 201A /L M 301A 2Electrical Characteristics(Note5)(Continued)T A=T JParameter Conditions LM101A/LM201A LM301A UnitsMin Typ Max Min Typ Max Supply Current T A=T MAX,V S=±20V 1.2 2.5mA Large Signal Voltage Gain V S=±15V,V OUT=±10V2515V/mVR L≥2kOutput Voltage Swing V S=±15V R L=10kΩ±12±14±12±14VR L=2kΩ±10±13±10±13V Input Voltage Range V S=±20V±15VV S=±15V+15,−13±12+15,−13V Common-Mode Rejection Ratio R S≤50kΩ80967090dB Supply Voltage Rejection Ratio R S≤50kΩ80967096dBNote2:Absolute Maximum Ratings indicate limits beyond which damage to the device may occur.Operating ratings indicate for which the device is functional,but do no guarantee specific performance limits.Electrical Characteristics state DC and AC electrical specifications under particular test conditions which guarantee specific limits.This assumes that the device is within the Operating Ratings.Specifications are not guaranteed for parameters where no limit is given,however,the typical value is a good indication of device performance.Note3:For supply voltages less than±15V,the absolute maximum input voltage is equal to the supply voltage.Note4:Continuous short circuit is allowed for case temperatures to125˚C and ambient temperatures to75˚C for LM101A/LM201A,and70˚C and55˚C respectively for LM301A.Note5:Unless otherwise specified,these specifications apply for C1=30pF,±5V≤V S≤±20V and−55˚C≤T A≤+125˚C(LM101A),±5V≤V S≤±20V and−25˚C ≤T A≤+85˚C(LM201A),±5V≤V S≤±15V and0˚C≤T A≤+70˚C(LM301A).Note6:Refer to RETS101AX for LM101A military specifications and RETS101X for LM101military specifications.Note7:Human body model,100pF discharged through1.5kΩ.Typical Performance CharacteristicsLM101A/LM201AInput Voltage Range Output Swing0077524100775242LM101A/LM201A/LM301A3Typical Performance CharacteristicsLM101A/LM201A (Continued)Voltage Gain00775243Guaranteed Performance CharacteristicsLM301AInput Voltage RangeOutput Swing0077524400775245Voltage Gain00775246L M 101A /L M 201A /L M 301A 4Typical Performance CharacteristicsSupply CurrentVoltage Gain0077524700775248Maximum Power DissipationInput Current,LM101A/LM201A/LM301A0077524900775250Current Limiting Input Noise Voltage0077525100775252LM101A/LM201A/LM301A5Typical Performance Characteristics(Continued)Input Noise CurrentCommon Mode Rejection0077525300775254Power Supply RejectionClosed Loop OutputImpedance0077525500775256L M 101A /L M 201A /L M 301A 6Typical Performance Characteristics for Various Compensation Circuits(Note9)Single Pole Compensation Two Pole Compensation00775208C S=30pF00775212C S=30pFC2=10C1Feedforward CompensationOpen Loop FrequencyResponse00775216f o=3MHz00775209Open Loop FrequencyResponseOpen Loop FrequencyResponse0077521300775217LM101A/LM201A/LM301A7Typical Performance Characteristics for Various Compensation Circuits(Note 9)(Continued)Large Signal FrequencyResponseLarge Signal FrequencyResponse0077521000775214Large Signal FrequencyResponse Voltage Follower PulseResponse0077521800775211Voltage Follower PulseResponseInverter Pulse Response0077521500775219L M 101A /L M 201A /L M 301A 8Typical Applications(Note9)Variable Capacitance Multiplier00775220Simulated Inductor00775221L.R1R2C1R S=R2R P=R1Fast Inverting Amplifierwith High Input Impedance00775222Inverting Amplifierwith Balancing Circuit00775223†May be zero or equal to parallel combination of R1and R2for minimumoffset.Sine Wave Oscillator00775224f o=10kHzIntegrator with Bias Current Compensation00775225*Adjust for zero integrator drift.Current drift typically0.1nA/˚C over−55˚Cto+125˚C temperature range.LM101A/LM201A/LM301A9Application Hints (Note 9)Protecting Against GrossFault Conditions00775226*Protects input †Protects output‡Protects output —not needed when R4is used.Compensating for Stray Input Capacitancesor Large Feedback Resistor00775227Isolating Large Capacitive Loads00775228Although the LM101A is designed for trouble free operation,experience has indicated that it is wise to observe certainprecautions given below to protect the devices from abnor-mal operating conditions.It might be pointed out that theL M 101A /L M 201A /L M 301A10advice given here is applicable to practically any IC op amp, although the exact reason why may differ with different de-vices.When driving either input from a low-impedance source,a limiting resistor should be placed in series with the input lead to limit the peak instantaneous output current of the source to something less than100mA.This is especially important when the inputs go outside a piece of equipment where they could accidentally be connected to high voltage sources. Large capacitors on the input(greater than0.1µF)should be treated as a low source impedance and isolated with a resistor.Low impedance sources do not cause a problem unless their output voltage exceeds the supply voltage.How-ever,the supplies go to zero when they are turned off,so the isolation is usually needed.The output circuitry is protected against damage from shorts to ground.However,when the amplifier output is connected to a test point,it should be isolated by a limiting resistor,as test points frequently get shorted to bad places.Further, when the amplifer drives a load external to the equipment,it is also advisable to use some sort of limiting resistance to preclude mishaps.Precautions should be taken to insure that the power sup-plies for the integrated circuit never become reversed—even under transient conditions.With reverse voltages greater than1V,the IC will conduct excessive cur-rent,fusing internal aluminum interconnects.If there is a possibility of this happening,clamp diodes with a high peak current rating should be installed on the supply lines.Rever-sal of the voltage between V+and V−will always cause a problem,although reversals with respect to ground may also give difficulties in many circuits.The minimum values given for the frequency compensation capacitor are stable only for source resistances less than 10kΩ,stray capacitances on the summing junction less than 5pF and capacitive loads smaller than100pF.If any of these conditions are not met,it becomes necessary to over-compensate the amplifier with a larger compensation capaci-tor.Alternately,lead capacitors can be used in the feedback network to negate the effect of stray capacitance and large feedback resistors or an RC network can be added to isolate capacitive loads.Although the LM101A is relatively unaffected by supply by-passing,this cannot be ignored altogether.Generally it is necessary to bypass the supplies to ground at least once on every circuit card,and more bypass points may be required if more than five amplifiers are used.When feed-forward compensation is employed,however,it is advisable to by-pass the supply leads of each amplifier with low inductance capacitors because of the higher frequencies involved.Typical Applications(Note9)Standard Compensation andOffset Balancing Circuit00775229Fast Voltage Follower00775231Power Bandwidth:15kHzSlew Rate:1V/µsFast Summing Amplifier00775230 Power Bandwidth:250kHzSmall Signal Bandwiidth:3.5MHzSlew Rate:10V/µsLM101A/LM201A/LM301A11Typical Applications (Note 9)(Continued)Bilateral Current Source00775232R3=R4+R5R1=R2Fast AC/DC Converter (Note 8)00775233Note 8:Feedforward compensation can be used to make a fast full wave rectifier without a filter.L M 101A /L M 201A /L M 301A 12Typical Applications (Note 9)(Continued)Instrumentation Amplifier00775234R1=R4;R2=R3*,†Matching determines CMRR.Integrator with Bias Current Compensation00775235*Adjust for zero integrator drift.Current drift typically 0.1nA/˚C over 0˚C to +70˚C temperature range.Voltage Comparator for Driving RTL Logic or HighCurrent Driver00775237LM101A/LM201A/LM301A13Typical Applications (Note 9)(Continued)Low Frequency Square Wave Generator00775236Low Drift Sample and Hold00775238*Polycarbonate-dielectric capacitorVoltage Comparator for Driving DTL or TTL Integrated Circuits00775239L M 101A /L M 201A /L M 301A 14Schematic(Note9)00775201Note9:Pin connections shown are for8-pin packages.Connection Diagrams(Top View)Dual-In-Line Package00775204Order Number LM101AJ,LM101J/883(Note10),LM201AN or LM301ANSee NS Package Number J08A or N08ECeramic Flatpack Package00775240Order Number LM101AW/883or LM101W/883See NS Package Number W10ALM101A/LM201A/LM301A15Connection Diagrams(TopView)(Continued)Metal Can Package00775202Note:Pin 4connected to case.Order Number LM101AH,LM101AH/883(Note 10),LM201AH or LM301AHSee NS Package Number H08CDual-In-Line Package00775203Order Number LM101AJ-14/883(Note 10)See NS Package Number J14ANote 10:Available per JM38510/10103.L M 101A /L M 201A /L M 301A 16LM101A/LM201A/LM301A Physical Dimensions inches(millimeters)unless otherwise noted ArrayMetal Can Package(H)Order Number LM101AH,LM101AH/883LM201AH or LM301AHNS Package Number H08C17Physical Dimensionsinches (millimeters)unless otherwise noted (Continued)Ceramic Dual-In-Line Package (J)Order Number LM101J/883or LM101AJNS Package Number J08ACeramic Dual-In-Line Package (J)Order Number LM101AJ-14/883NS Package Number J14AL M 101A /L M 201A /L M 301A 18Physical Dimensionsinches (millimeters)unless otherwise noted (Continued)Molded Dual-In-Line Package (N)Order Number LM201AN or LM301ANNS Package Number N08ECeramic Flatpack Package (W)Order Number LM101AW/883or LM101W/883NS Package Number W10ALM101A/LM201A/LM301A19NotesLIFE SUPPORT POLICYNATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION.As used herein:1.Life support devices or systems are devices or systems which,(a)are intended for surgical implant into the body,or (b)support or sustain life,and whose failure to perform when properly used in accordance with instructions for use provided in the labeling,can be reasonably expected to result in a significant injury to the user. 2.A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system,or to affect its safety or effectiveness.BANNED SUBSTANCE COMPLIANCENational Semiconductor certifies that the products and packing materials meet the provisions of the Customer Products Stewardship Specification (CSP-9-111C2)and the Banned Substances and Materials of Interest Specification (CSP-9-111S2)and contain no ‘‘Banned Substances’’as defined in CSP-9-111S2.National Semiconductor Americas Customer Support CenterEmail:new.feedback@ Tel:1-800-272-9959National SemiconductorEurope Customer Support CenterFax:+49(0)180-5308586Email:europe.support@Deutsch Tel:+49(0)6995086208English Tel:+44(0)8702402171Français Tel:+33(0)141918790National Semiconductor Asia Pacific Customer Support CenterEmail:ap.support@National SemiconductorJapan Customer Support Center Fax:81-3-5639-7507Email:jpn.feedback@ Tel:81-3-5639-7560L M 101A /L M 201A /L M 301A O p e r a t i o n a l A m p l i f i e r sNational does not assume any responsibility for use of any circuitry described,no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right, or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use any non-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAudio /audio Communications and Telecom /communicationsAmplifiers Computers and Peripherals /computersData Converters Consumer Electronics /consumer-appsDLP®Products Energy and Lighting /energyDSP Industrial /industrialClocks and Timers /clocks Medical /medicalInterface Security /securityLogic Space,Avionics and Defense /space-avionics-defense Power Mgmt Transportation and Automotive /automotiveMicrocontrollers Video and Imaging /videoRFID OMAP Mobile Processors /omapWireless Connectivity /wirelessconnectivityTI E2E Community Home Page Mailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2011,Texas Instruments Incorporated。

K110中文资料

ELECTRICAL CHARACTERISTICS (AT TA =25°C UNLESS OTHERWISE NOTED)
BREAKOVER VOLTAGE @IBO0.5ma
VBO 95-113 104-118 110-125 120-138 190-215 200-230 220-250 240-270
RS
0.1
TYPICAL THERMAL RESISTANCE, JUNCTION TO LEAD
θJL
20.0
NOTE ：
SIDAC IS A SILICON BILATERAL VOLTAGE TRIGGERED DEVICE.
WHILE THE APPLICATION VOLTAGE EXCEEDING THE DEVICE
元器件交易网
FRONTIER ELECTRONICS CO., LTD.
SIDAC (95 – 270 VOLTS)
K105 THRU K260
FEATURES ! GLASS PASSIVATED JUNCTIONS ! HIGH SURGE CURRENT CAPABILITY ! DO-15 PACKAGE
BREAKOVER VOLTAGE POINT, THE DEVICE SWITCHES ON TO A LOW ON-STATE
VOLTAGE THRU A NEGATIVE RESISTANCE REGION. ON-STATE CONTINUES UNTIL
CURRENT DROPS BELOW DEVICE HOLDING CURRENT LEVEL.
UNITS µA mA mA V
Kohm
℃/W
17-1
元器件交易网

INA101HP,INA101AG,INA101AM,INA101CM,INA101KU1K,INA101KU1KE4,INA101KUE4, 规格书,Datasheet 资料

±5
±10
0.2
1000
*
*
*
*
*
*
V
*
*
*
*
*
*
mA
*
*
*
Ω
*
*
*
pF
INPUT OFFSET VOLTAGE Initial Offset at +25°C
vs Temperature
vs Supply vs Time
±(25 + 200/G)
±(1 + 20/G) ±(1 + 20/G)
±(50 + 400/G) ±(2 + 20/G)
SOL-16, AND TO-100 PACKAGES
APPLICATIONS
q STRAIN GAGES q THERMOCOUPLES q RTDs q REMOTE TRANSDUCERS q LOW-LEVEL SIGNALS q MEDICAL INSTRUMENTATION
DESCRIPTION
Gain Set 1 5
16 Common 15 –VCC 14 +Input
Offset Adj. 6 Offset Adj. 7
13 Gain Sense 2
12 Gain Set 2
11 A2 Output
10 A1 Output
9 NC
14 Common 13 –VCC 12 +Input 11 Gain Sense 2 10 Gain Set 2 9 A2 Output 8 A1 Output
–Input 10 1kΩ 1
RG 4
1kΩ 5 +Input

APC Back-UPS Pro BX850 1000 1350 1500M M-LM60 用户手册

Safety and General InformationInspect the package contents upon receipt. Notify the carrier and dealer if there is any damage.SAVE THESE INSTRUCTIONS - This section contains importantinstructions that should be followed during installation and maintenance of the UPS and batteries.InventoryConnect the BatteryThe UPS is shipped with the battery disconnected.BX850/1000M/M-LM60Remove the battery door.Remove the battery. Connect the wire.Back-UPS Pro BX850/1000/1350/1500M/M-LM602BX1350/1500M/M-LM60Install PowerChute ™ Personal Edition SoftwareUse PowerChute Personal Edition software to configure the UPS settings. During a power outage, PowerChute will save any open files on your computer and shut it down. When power is restored, it will restart the computer.Note: PowerChute is only compatible with a Windows operating system. If you are using Mac OSX, use the native shutdown feature to protect your system. See the documentation provided with your computer.InstallationUse the cable supplied with the Back-UPS to connect the data port on the Back-UPS to the USB port on your computer. On the computer, go to Search for “PowerChute Personal Edition” then click on “View Details” to download the latest version of PCPE software . Click the download link and select Software product. Select the appropriate operating system. Follow directions to download the software.Replace the battery door.Flip or turn the battery 180 degrees upward/downward to let green side of the label face up.Back-UPS Pro BX850/1000/1350/1500M/M-LM603Connect the EquipmentBattery Backup and Surge Protected outletsWhen the Back-UPS is receiving input power, the Battery Backup with Surge Protection outlets will supply power to connected equipment. During a power outage or other AC problems, the Battery Backup outlets receive power for a limited time from the Back-UPS.Connect equipment such as printers, fax machines, scanners, or other peripherals that do not need battery backup power to the Surge Protection Only outlets. These outlets provide full-time protection from surges even if the Back-UPS is switched OFF.BX850/1000M/M-LM60BX1350/1500M/M-LM60USB and Serial Data port To use PowerChute Personal Edition, connect the supplied USBcable or an optional serial cable (not supplied).BuildingWiring Fault indicator If this indicator is illuminated, there is a problem with the wiring in the building. Contact an electrician immediately and do not use the Back-UPS.Surge Protected outletsThese outlets provide full-time protection from surges, even if theBack-UPS is off. Connect equipment such as printers and scanners that do not require battery backup protection.Battery Backup outlets withSurgeProtectionDuring a power outage or other AC problems, the Battery Backupoutlets receive power for a limited time from the Back-UPS. Connect critical equipment such as desktop computer, computer monitor, modem or other data sensitive devices into these outlets. Circuit Breaker Use to reset the system after an overload condition has occurredcausing the circuit breaker to trip.Back-UPS Pro BX850/1000/1350/1500M/M-LM604OperationPower Saving DisplayThe display interface can be configured to be continuously illuminated, or to save energy, it can be configured to darken after a period of inactivity.1. Full Time Mode: Press and hold DISPLAY for two seconds. The display willilluminate and the Back-UPS will beep to confirm the Full Time mode.2. Power Saving Mode: Press and hold DISPLAY for two seconds. The display willdarken and the Back-UPS will beep to confirm the Power Saving mode. While in Power Saving Mode, the display will illuminate if a button is pressed, it then darkens after 60 seconds of no activity.Unit sensitivityAdjust the sensitivity of the Back-UPS to control when it will switch to battery power; the higher the sensitivity, the more often the Back-UPS will switch to battery power. 1. Ensure the Back-UPS is connected to AC power, but is OFF.2. Press and hold the P OWER button for six seconds. The L OAD C APACITY bar willflash on and off, indicating that the Back-UPS is in programming mode.3. Press P OWER again to rotate through the menu options. Stop at selectedsensitivity. The Back-UPS will beep to confirm the selection.In/Out Ethernet surge-protected portsUse an Ethernet cable to connect a cable modem to the I N port,and connect a computer to the O UT port. Coaxial ports with surge protectionConnect a cable modem or other equipment with coaxial jacks.Generator SensitivityDefaultSensitive LoadsLow sensitivityMedium sensitivity (Default)High sensitivity 78-142 Vac 88-139 Vac 88-136 VacInput voltage is extremely low or high. (Not recommended for computer loads.)The Back-UPS frequently switches to battery power.The connected equipment is sensitive to voltagefluctuations.Front Panel Buttons and Display InterfaceUse the three buttons on the front panel of the Back-UPS and the display interface to configure the Back-UPS.Front panelPower On/OffbuttonDisplay buttonDisplay interfaceBattery Charge: The battery charge level is indicated by the number ofsections illuminated. When all five blocks are illuminated, the Back-UPS is atfull charge. When one block is filled, the Back-UPS is near the end of its batterycapacity, the indicator will flash and the Back-UPS will beep continuously.Back-UPS Pro BX850/1000/1350/1500M/M-LM605Back-UPS Pro BX850/1000/1350/1500M/M-LM606Alarms and System ErrorsAudible IndicatorsStatus IconsFour Beeps Every 30 SecondsBack-UPS is running on battery. You should consider saving any work in progress.Continuous Beeping Low battery condition and battery run-time is very low.Promptly save any work in progress, exit all openapplications, and shut down the operating system.Continuous tone Battery Backup outputs are overloaded. Chirps every 2 Seconds with the Load Capacity Bar flashingBattery is disconnected. Continuous chirping with the LoadCapacity Bar and Replace Battery iconalternately flashing Battery did not pass the automatic diagnostic test and should be replaced as early as possible. Pressing the MUTE button pauses the chirping.If these icons areilluminated...This may be the problem.Back-UPS Pro BX850/1000/1350/1500M/M-LM607System ErrorsThe Back-UPS will display these error messages. Except for errors F01 and F02, contact SEIT Technical Support.Function Button Quick ReferenceF01On-Battery Overload Turn the Back-UPS off. Disconnect non-essentialequipment from the BatteryBackup outlets and the turn Back-UPS on.F02On-Battery Output Short Turn the Back-UPS off.Disconnect all equipment from the Battery Backup outlets andthe turn Back-UPS on. Re-connect equipment one itemat a time. If the output is tripped again, disconnect the device that caused the error.F03On-Battery Xcap Overload Errors F03-F09 cannot becorrected by the user, contact SEIT Technical Support forassistance.F04Clamp Short F05Charge ErrorF06Relay Welding F07Temperature F09Internal ErrorFunction ButtonTiming (seconds)UPS StatusDescriptionPower Power On 0.2Off Press P OWER to start receiving input AC power. If AC input power is not available, the Back-UPS will run on battery power.Power Off 2OnThe Back-UPS is not receiving input AC power, but is providing surge protection.Display Status Inquiry 0.2OnVerify the status or condition of the Back-UPS. The LCD will illuminate for 60 seconds. Press the button the toggle into various information.Full-Time/Power-Saving mode 2OnThe LCD will illuminate and the Back-UPS will beep to confirm the Full-Time mode. The LCD will darken and the Back-UPS will beep to confirm the Power-Saving mode. While in Power-Saving Mode, the LCD will illuminate if a button is pressed, then darkens after 60 seconds of no activity.Mute General Status Enable/Disable2OnEnable or disable the audible alarms. The Mute icon will illuminate and the Back-UPS will beep one time. The Mute function will not activate unless the Back-UPS is operating on battery power.Back-UPS Pro BX850/1000/1350/1500M/M-LM608TroubleshootingSensitivity 6OffThe Load Capacity icon will blink, indicating that the Back-UPS is in programming mode. Use the P OWER button to scroll through Low, Medium, and High, stop at selected sensitivity. The Back-UPS will beep to confirm selection. See "Unit sensitivity" for details.Self-Test (manual)6OnThe Back-UPS will perform a test of the internalbattery. Note: This will happen automatically when the Back-UPS is turned ON or when the Back-UPS previously detected a bad battery.Event Reset 0.2OnWhen the Event screen is visible, press and holdD ISPLAY , then press POWER , to clear the detected error event counter.Error Reset2ErrorAfter an error has been identified, press P OWER to remove the visual indication and return to standby status.ProblemPossible CauseCorrective ActionBack-UPS will notswitch on.The Back-UPS is not connected to AC power.Ensure that the Back-UPS is securely connected to an AC outlet.The circuit breaker has been tripped.Disconnect non-essential equipment from the Back-UPS. Reset the circuit breaker. Re-connect equipment one item at a time. If the circuit breaker is tripped again, disconnect the device that caused the trip.The internal battery is not connected.Connect the battery.The AC input voltage is out of range.Adjust the transfer voltage andsensitivity range.The Back-UPS does not provide power during a AC poweroutage.Ensure that essential equipment is not plugged into a S URGE O NLY outlet.Disconnect equipment from the S URGEO NLY outlet and re-connect to a Battery Backup outlet.The Back-UPS isoperating on battery power, while connected to AC power.The plug has partially pulled out of the wall outlet, the wall outlet is no longer receiving AC power, or thecircuit breaker has been tripped.Ensure that the plug is fully inserted into the wall outlet. Ensure that the wall outlet is receiving AC power by checking it with another device.The Back-UPS is performing an automatic self test.No action is necessary.The AC input voltage is out of range, the frequency is out of range, or the waveform is distorted.Adjust the transfer voltage and sensitivity range.The Back-UPS does not provide theexpected amount of backup time.Battery Backup outlets may be fully or improperly loaded.Disconnect non-essential equipment from the Battery Backup outlets andconnect the equipment to S URGEoutlets.The battery was recently discharged due to a power outage and has not fully recharged.Charge the battery cartridge for 16hours.The battery has reached the end of its useful life.Replace the battery.Function ButtonTiming (seconds)UPS StatusDescriptionBack-UPS Pro BX850/1000/1350/1500M/M-LM609SpecificationsReplacement BatteryThe battery typically lasts for 3 to 5 years, a shorter period if subjected to frequent outages or elevated temperatures. Battery replacement parts for Back-UPS B X850M/M-LM60 is RBC17, for BX1000M/M-LM60 is APCRBC158, for BX1350M/M-LM60 is APCRBC123, and for BX1500M/M-LM60 is APCRBC124. Delaying thereplacement of parts may corrode the batteries in the cartridge. Recycle spent battery cartridges.The R EPLACE B ATTERY indicator is illuminated.The battery has reached the end of its useful life.Replace the battery as early as possible.The O VERLOAD indicator is illuminated.The equipment connected to the Back-UPS is drawing more power than the Back-UPS can provide.Disconnect non-essential equipment from the Battery Backup outlets and connect the equipment to S URGE outlets.The S YSTEM E RROR indicator isilluminated, all the front panel indicators are flashing.There is an internal error.Determine which internal errormessage is displayed by matching the number displayed on the LCD with the corresponding Error Message (see "System Errors") and contact SEIT Technical Support.Model BX850M BX850M-LM60BX1000M BX1000M-LM60BX1350M BX1350M-LM60BX1500M BX1500M-LM60V A850 V A 1000 V A 1350 V A 1500 V A Maximum Load 510 W600 W810 W900 WNominal Input Voltage 120 Vac Online Input Voltage Range 88 - 139 VacAutomatic Voltage Regulation (88-107) +11.2% (compensate for low input voltage)Frequency Range 60 Hz ± 1 HzBattery TypeLead acid, 12V with 1 batteryLead acid, 24V with 2 batteriesOn-battery Waveshape Step-approximated sine-wave Typical Recharge Time 12 hours16 hoursTransfer Time 8 ms (typical), 10 ms (maximum)On Battery Runtime Go to: InterfaceUSBOperating Temperature 0 to 40 C (32 to 104 F) Storage Temperature -5 to 45 C (23 to 113 F)Unit Dimensions 19 x 9.1 x 31 cm (7.5 x 3.6 x 12.2 in)25 x 10 x 38.2 cm (9.8 x 3.9 x 15 in)Unit Weight6.8 kg (15 lbs)7.2 kg (15.9 lbs)10.2 kg (22.5 lbs)11.0 kg (24.3 lbs)Problem Possible Cause Corrective Action© 2017 APC by Schneider Electric. APC, the APC logo, and Back-UPS are ownedby Schneider Electric Industries S.A.S. or their affiliated companies. All other trademarks are property of their respective owners.EN 990-5813A07/2017WarrantyThe standard warranty is three (3) years from the date of purchase. Schneider Electric IT (SEIT) standard procedure is to replace the original unit with a factory reconditioned unit. Customers who must have the original unit back due to the assignment of asset tags and set depreciation schedules must declare such a need at first contact with an SEIT Technical Support representative. SEIT will ship the replacement unit once the defective unit has been received by the repair department, or cross ship upon the receipt of a valid credit card number. The customer pays for shipping the unit to SEIT. SEIT pays ground freight transportation costs to ship the replacement unit to the customer.APC by Schneider Electric IT Customer Support WorldwideFor country specific customer support, go to the APC by Schneider Electric Web site, .Select models are ENERGY STAR® qualified.For more information on your specific model go to .This UPS is certified to comply with California Battery Charger Systemregulations. For more information go to/company/us/en/sustainability/energy-efficiency/california-battery-charger-regulations/EMC ComplianceThis equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to providereasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:• Reorient or relocate the receiving antenna.• Increase the separation between the equipment and receiver.• Connect the equipment into an outlet on a circuit different from that to which thereceiver is connected.• Consult the dealer or an experienced radio/TV technician for help.。

海利普变频器A、M、F、H说明书中文版

HLPA0D7523C 单三相220V 50Hz 0.75 2.0
HLPA01D523C 单三相220V 50Hz 1.5 2.8
HLPA02D223B 单三相220V 50Hz 2.2 4.4
HLPA03D723B 单三相220V 50Hz 3.7 6.8
HLPA05D523B 单三相220V 50Hz 5.5 10
● 主回路端子配线必须正确，R.S.T为电源输入端子，绝对不可与 U.V.W混用，否则，则在送电时，将造成变频器的损坏。
● E 端子必须单独接地，绝对不可接零线，否则，易引起变频器保护或故障。
注意
● 搬运变频器时，请勿直接提取前盖，应由变频器底座搬运，以防前盖脱落，避免变频器掉落，造成人员受伤或变频器损坏。
适用电机 (KW) 0.4 0.75 1.5 2.2 3.7 5.5 7.5 11 15 18.5 22 30 37 45 55 75 90 0.75 1.5 2.2 3.7 5.5 7.5 11 15
--
HLP-A 系列使用说明书
HLP-A系列
型号
输入电压
HLPA18D543B HLPA002243B HLPA003043B HLPA003743B HLPA004543B HLPA005543B HLPA007543B HLPA009043B HLPA011043B HLPA013243B HLPA016043B HLPA018543B HLPA020043B HLPA022043B HLPA025043B HLPA028043B HLPA030043B HLPA031543B HLPA034543B HLPA037543B HLPA040043B HLPA041543B
低于40℃，以防止过热或火灾等发生。 ● 请确认切断电源后，再拆卸或装入操作键盘，并固定前盖，以免接