CF5010AK1中文资料
cf武器大全
cf武器大全CF武器大全。
CF(CrossFire)是一款枪战类游戏,拥有丰富多样的武器装备,让玩家在游戏中体验到不同的战斗乐趣。
在这篇文档中,我们将为大家详细介绍CF中常见的武器大全,帮助玩家更好地了解游戏中的武器装备。
1. 步枪类武器。
步枪是CF游戏中最常见的武器之一,包括AK47、M4A1、SCAR-L等。
这些步枪在射程、威力和稳定性上各有特点,玩家可以根据自己的喜好和游戏需求进行选择。
AK47以其高威力和稳定性而受到玩家的喜爱,而M4A1则以其射速和精准度成为不少玩家的首选。
2. 冲锋枪类武器。
冲锋枪在CF游戏中是非常灵活的武器,适合近距离作战。
常见的冲锋枪包括UMP45、MP5、PP19等,它们在射速和便携性上有着显著优势。
UMP45以其稳定的射击和高威力成为不少玩家的选择,而MP5则以其射速和精准度在近距离作战中表现出色。
3. 狙击枪类武器。
狙击枪在CF游戏中是远程射击的利器,能够在较远的距离上精准打击敌人。
常见的狙击枪包括AWM、DSR-1、Blaser R93等,它们在射程和精准度上有着明显的优势。
AWM以其高威力和精准度成为众多玩家的首选,而DSR-1则以其快速的换弹速度和稳定的射击在游戏中大放异彩。
4. 散弹枪类武器。
散弹枪在CF游戏中是近距离作战的利器,能够对敌人造成大范围的伤害。
常见的散弹枪包括M37、SPAS-12、KSG-15等,它们在近距离作战中有着出色的表现。
M37以其稳定的射击和高威力成为不少玩家的选择,而SPAS-12则以其快速的射击和大范围的伤害在游戏中备受青睐。
5. 特种武器。
除了以上常见的武器类型外,CF游戏中还有一些特种武器,如火箭筒、雷神之锤等。
这些特种武器在游戏中拥有独特的作用,能够对敌人造成毁灭性的打击。
火箭筒以其高威力和范围性伤害在游戏中具有重要的地位,而雷神之锤则能够对敌人造成持续性的伤害,是游戏中不可或缺的武器之一。
在CF游戏中,不同类型的武器都有着各自的特点和用途,玩家可以根据游戏场景和个人喜好进行选择。
KG510中文说明书
3. 低发射功率调整 作为经销商调试发射功率用,使用者不得自行调动。
4. 扬声器 可听到所接收的音频信号(可用来证实音量设置是否足够大和是否被静音)。
5. 中转指示灯(REP) 机器所在信道设定为中转(Repeater)模式时,指示灯(REP)亮黄色。机器所在信道 设定为其他模式时 REP 指示灯不亮。
4.2.2 音量调节 旋转音量旋钮,调整到合适的音量。
4.2.3 噪音调整 顺时针慢慢旋转噪音旋钮,直到背景噪音最小时为止。将旋钮沿顺时针方向再 旋一个小角度以避免变化的背景噪音“冲破”静噪设置而产生噪声。
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4.2.4
频道选择 按下【CH】紧接着按频道数字键,选择要求的频道。例如: 【CH】+ 【0】 +【1】表示选择频道 1 。液晶面板显示为:CH01 ,同时显示频道名称: CH01 Kyodo-co。
扫描 全频段扫描操作 预置频段扫描操作 退出频道扫描 优先信道扫描 从扫描清单中删除当前频道 增加频道到扫描清单 键盘锁 改变音频信令系统
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δ
d. 扫描模式状态 ――――符号:
∞
e. 高发射功率状态――――符号:
f. [SHIFT]―――― 当[SHIFT]按下时,液晶显示为
第四行:正常使用情况下,左边四个字符显示用户选择的音频信令系统,如:显示“5
TON”表示用户选择 5 Tone 系统,若显示“DTMF”表示双音多频系统。右边的 16
cf武器大全
cf武器大全CF武器大全。
CF(CrossFire)是一款备受玩家喜爱的第一人称射击游戏,游戏中有各种各样的武器,每一把武器都有其独特的特点和用途。
在这篇文档中,我们将为大家详细介绍CF中的各种武器,希望能够帮助玩家更好地了解和选择适合自己的武器。
手枪。
手枪是CF中最基本的武器之一,适合近距离作战。
其中,沙漠之鹰是最为经典的手枪之一,其威力强大,精准度高,是近距离作战的不二选择。
另外,沙漠之鹰还具有较高的穿透力,可以轻松击穿敌人的防具。
冲锋枪。
冲锋枪是适合近中距离作战的武器,射速快,威力适中。
其中,AK-47是备受玩家喜爱的冲锋枪之一,其威力强大,射程较远,适合各种战术需求。
另外,UMP45也是一把性能稳定的冲锋枪,射速快,精准度高,适合近距离连续射击。
步枪。
步枪是适合中远距离作战的武器,射程较远,威力较大。
其中,M4A1是备受玩家喜爱的步枪之一,其稳定的性能和高精准度使其成为中远距离作战的不二选择。
另外,AK-47也是一把备受推崇的步枪,其威力强大,射程远,适合各种作战环境。
狙击枪。
狙击枪是适合远距离作战的武器,射程极远,威力极大。
其中,AWM是备受玩家喜爱的狙击枪之一,其极高的威力和精准度使其成为远距离作战的首选。
另外,DSR-1也是一把备受推崇的狙击枪,其快速的换弹速度和稳定的性能使其在战场上独具优势。
霰弹枪。
霰弹枪是适合近距离作战的武器,威力极大,射程较短。
其中,SPAS-12是备受玩家喜爱的霰弹枪之一,其强大的威力和较远的射程使其成为近距离作战的不二选择。
另外,M1887也是一把备受推崇的霰弹枪,其快速的射击速度和稳定的性能使其在近距离作战中大放异彩。
总结。
在CF中,不同类型的武器各有其特点和用途,玩家可以根据自己的战术需求和操作习惯来选择适合自己的武器。
希望本文对玩家在游戏中选择武器有所帮助,祝大家游戏愉快!。
肯纳最新材质说明
肯纳最新材质说明发布日期:[2007-8-15] 共阅[2536]次肯纳最新材质说明K1025 该材质为中等硬度,粘结剂含量中等,非合金W C/C o 细晶粒材质。
应用:适用于切削高温合金,钛合金以及在切削条件不利的情况下加工非铁金属材料的工件。
K D081一种低含量,在硬质合金刀片焊接P C B N刀类的材质。
应用:专为粗加工和精加工硬钢(>45HR C)而设计。
用于切削轴承钢、热轧和冷轧工具钢、高速钢、模具钢、冷硬钢、渗碳和氮化铁和一些硬化层材料。
K313 材质结构:基体较硬,含少量粘结物。
为非合金的W C/C O精细颗粒硬质合金材质。
应用:刃口的耐磨性好,同时具有很强的韧性,用于加工钛合金。
铸铁,奥氏体不锈钢和非铁金属,非金属和大多数的高温合金。
具有很好的抗热变形能力和耐切深处磨损能力,晶体细化的材质可以减少加工中的裂纹和剥落,使刀片寿命长而且安全可靠。
K68 材质结构:基体较硬,含少量粘结物。
为非合金的WC/C o精细颗粒硬质合金材质。
应用:K68材质具有极强的耐磨性,特别适合于加工铸铁,奥氏体不锈钢,非铁金属,非金属,它作为K313的补充也适合加工大多数的高温合金。
它是非铁金属加工的通用材质。
K C5010(全新)材质结构:PV D T iA l N涂层刀片。
这是最新的刀片材质,非合金硬质合金基体的抗变形能最强。
KC5010的最新涂层可使切削速度提高50%甚至100%。
应用:KC5010适合于高速度精加工大多数工件材料,效果非常理想。
在加工状况稳定的情况下。
适用于大多数钢,不锈钢,铸铁,非铁金属和高温合金,在加工淬硬和短屑材料时也表现不俗。
K C5025(全新)材质结构:极细化晶粒非合金基体。
配以最先进的PV DT iA lN涂层。
应用:通用加工刀片应用于大多数钢,不锈钢,铸铁,非铁金属。
可以用于断续切削和高进给量的加工,而且切削速度可高可低。
K C5410 材质结构:非合金硬质合金基体,配以PV D T iB2涂层使刀片的抗变形性能极强。
NETGEAR G54 N150 无线路由器 WNR1000 说明书
Performance & UseThe NETGEAR Difference - WNR1000Overview• G54 & N150 WiFi Speed• Wirelessly share an Internet connection• Ideal for web, email, & social networking • Vertical stand for flexible placement• NETGEAR ® genie ®• Live Parental Controls• Faster N150 WiFi speed—works with 802.11gG54/N150 Wireless RouterData Sheet WNR1000The NETGEAR G54/N150 Wireless Router (WNR1000) offers a simple and secure way to share your Internet connection for web, email and social networking. This router delivers good wireless speeds of up to 150 Mbps and is a good router for small to medium-sized homes. And, the WNR1000 is backward compatible with Wireless-G (G54) networks for a hassle-free connection. TheWNR1000 includes features such as Live Parental Controls for safer web surfing on connected devices and NETGEAR genie ® home network manager for easy installation and home network management.• Home network manager• Makes any printer AirPrint ® compatible to print from an iPad ® or iPhone ®• MyMedia ™—Find & play media files in your network• EZ Mobile connect—Scan QR code to connect to your home network • For PC, Mac ®, iPhone ®, iPad ®, & Android ™ devicesNETGEAR genie ® Home Networking SimplifiedG54/N150 Wireless RouterData Sheet WNR1000Relive memories and share them with others. Find photos, videos and music stored on a shared USB hard drive. If it's secure and shared storage access you want NETGEAR has easy ways to do it.SharingWiFi RangeWIRELESS-G/N —Email, chat, surf, m usic, videoRANGE—For small to medium-sized homesGood WiFi Range Share & stream your movies, music, photos Homes come in all shapes and sizes. The NETGEAR G54/N150 Wireless Router provides good WiFi connectivity throughout your home for your Internet enabled devices.G54/N150 Wireless RouterData Sheet WNR1000NETGEAR makes it easy to do more with your digital devices. Manage your network with genie ® App—a personal, icon-based dashboard that can control and monitor all your devices. Or, use Push ‘N’ Connect to add devices to your WiFi network with a push of a button. And the simple browser-based installation with no CD makes router installation easy using an iPad, tablet, smartphone, or computer.Keep your Internet browsing experience safe and secure with the free parental controls. It allows you to limit access to certain web sites at certain times. For example no social networking or gaming site access after dinner time. Guest networks create a completely separate WiFi network for your guests’ devices so they do not have accessto your home network or to the shared USB hard drive with all your personal data. Secure WiFi connections offer high level WPA/WPA2 security.With the G54/N150 Wireless Router create a good home network for applications such a fast reliable connection to the Internet and a secure wireless connection.Ease Of UseSecurityApplicationsEASY INSTALL—Easy setup for iPad ®, tablets, smartphones & computersPARENTAL CONTROLS—Safer web surfing for all your connected devicesEMAIL, CHAT, SURF, MUSIC, VIDEO—Enjoy a fast, reliable and secure wireless connection to the InternetNETGEAR GENIE ® APP—Personal dashboard to monitor, control & repair your home networkGUEST NETWORK ACCESS—Separate & secure access for guests PUSH ‘N’ CONNECT —Easy push button WiFi connections (WPS) SCHEDULED WIFI ON/OFF—Conveniently program access timesand conserve up to 30% of powerSECURE WIFI CONNECTIONS—High level wireless security with WPA/WPA2Simple network management Safeguard your network Ideal UsesG54/N150 Wireless RouterData Sheet WNR1000Connection DiagramInternetPower Reset/WPSFast Ethernet*24/7 basic technical phone support provided for 90 days from purchase date when purchased from a NETGEAR authorized reseller.†Maximum wireless signal rate derived from IEEE standard 802.11 specifications. Actual data throughput and wireless coverage will vary. Network conditions and environmentalfactors, including volume of network traffic, interference, and building construction may lower actual data throughput and wireless coverage. NETGEAR makes no express or implied representations or warranties about this product’s compatibility with any future standards.‡This product comes with a limited warranty that is valid only if purchased from a NETGEAR authorized reseller. For full warranty details, please go to /about/warranty.NETGEAR, the NETGEAR Logo, ReadySHARE, and NETGEAR genie, are trademarks and/or registered trademarks of NETGEAR, Inc. and/or subsidiaries in the United States and/or other countries. Other brand names mentioned herein are for identification purposes only and may be trademarks of their respective holder(s). Information is subject to change without notice. ©2016 NETGEAR, Inc. All rights reserved.NETGEAR,Inc.350E.PlumeriaDrive,SanJose,CA95134-1911USA,1-888-NETGEAR(638-4327),E-mail:****************,D-WNR1000v4-2G54/N150 Wireless RouterData Sheet Package Contents• G54/N150 Wireless Router (WNR1000v4)• Stand• Quick Install Guide • Ethernet cable • Power adapterPhysical Specifications• Dimensions: 172.74 x 139.98 x 34.6 mm(6.8 x 5.5 x 1.36 in)• Weight: 242 g (0.534 lb)Warranty• F or warranty details visit/about/warrantySupport• 24/7 basic technical phone support for 90 days from date of purchaseTechnical Specifications• G 54/N150 WiFi Speed• S upports Wireless Multimedia (WMM) based QoSStandards• IEEE 802.11 b/g 2.4GHz with 11n features• F ive (5) 10/100 (1 WAN and 4 LAN) Ethernet portswith auto-sensing technologySystem Requirements• B roadband (cable, DSL) modem with Ethernet port • 802.11 b/g/n 2.4GHz wireless adapter or Ethernet adapter and cable for each computer •M icrosoft ® Windows ® 7, 8, Vista ®, XP, 2000, Mac ® OS, UNIX ®, or Linux ®•M icrosoft ® Internet Explorer ® 5.0, Firefox ® 2.0 or Safari 1.4 or higher• U se with an N150 Wireless USB Adapter (WNA1100 or WNA1000M) for maximum performance Security• W i-Fi Protected Access ® (WPA/WPA2—PSK) and WEP• D ouble firewall protection (SPI and NAT firewall)• D enial-of-service (DoS) attack preventionWNR1000。
CF中英文介绍
一·CF中英语知识介绍1.口号语音:OK, let's going on ! (出发!)Fire in the hole ! (开火!)2.杀敌语音(以男性为准):命中头部 Head shot(爆头)连杀2人 Double kill(双杀)连杀3人 Multi kll (多杀)连杀4人 Occur kill(突然杀)连杀5人 Nnbreakble !(坚不可摧!)连杀6人 Nnbelievable!(难以置信!)连杀7人 You wanna a piece of me?(你想修理我吗?)连杀8人 Come get some !(再来些吧!)雷杀Yeah!!!(耶!!!)刀杀 Ha~Ha~Ha~(哈哈哈…)3.无线电消息(飞虎队有中文语音):Z键: 1.Roger that /Copy that 肯定/收到2.Negative 否定3.Anemy site 发现敌人4.Bombs on the ground here 发现炸弹5.Sector clear 这里无异常X键: 1.Nice shoot\Good job 干得漂亮2.Keep going and stay strong,team 坚持到底3.Follow me 跟我来4.Cover me 掩护我/我需要支援5.Waiting for 前锋队员请等待C键: 1.A side A点集合2.B side B点集合3.Hold position 坚守阵地4.Stick together, team全体集合5.Storm the front 突破4.角色:保卫者 Global Risk ,潜伏者 Black List ,生化幽灵 Ghost .男性:斯沃特SWAT 赛斯SAS奥摩OMOH飞虎队女性:猎狐者夜玫瑰CSOL灵狐者二·CF中武器知识介绍(以GP武器为主)1.主武器:CF中的主武器有五大类:突击步枪,冲锋枪,狙击步枪,机关枪,散弹枪(喷子)。
飞瑞公司产品说明书:FESX型号电子管动量阀
1/18Proportional cartridge throttle valve, with inductive position transducer, pilot operatedType FESXNominal size 16, 25, 32, 40, 50Unit series 1XMaximum working pressure A, B, X 315 bar, Y 100 bar Nominal flow rate Q nom 980 l/minRE 29215/09.05Overview of ContentsContents PageFeatures 1Ordering data 2Preferred types2Symbol 2Function, sectional diagram 3T echnical data4 and 5External trigger electronics 6 to 8Characteristic curves 9 and 10Unit dimensions 11 to 15Installation dimensions16 and 17Features– P ilot operated throttle valves with inductive position transducer – D esign: cartridge type DIN 24342, ISO/DIS 7368Control oil external X and Y– A djustable via the position-controlled main stage by means of the position transducer and the external valve electronics – H ysteresis < 0.2 %, positioning accuracy > 0.5 %, see T echnical Data– P lug-in connector to DIN 43650-AM2 for the solenoidand plug-in connector for the position transducer, included in scope of delivery– D ata for the external trigger electronics • U B = 24 V nom DC• Adjustment of valve curve Np and gain, with and without ramp generator• Europe card format, setpoint 0...+10 V (order separately)o u r t e s y o f C M A /F l o d y n e /H y d r a d y n e ▪ M o t i o n C o n t r o l ▪ H y d r a u l i c ▪ P n e u m a t i c ▪ E l e c t r i c a l ▪ M e c h a n i c a l ▪ (800) 426-5480 ▪ w w w .c m a f h .c o mOrdering dataProportional throttle valve with inductive position transducer (pilot operated)Nominal size= 16Mounting hole configuration = 25DIN 24342, ISO/DIS 7368 = 32 = 40= 50Connection type = C(cartridge)Direction of flow A Ǟ B= A(customer may implement B Ǟ A) Unit series 10 to 19= 1X(10 to 19: installation and connection dimensions unchanged)Further informationin plain textM =NBR seals, suitablefor mineral oils(HL, HLP) to DIN 51524 Z4 =Electrical connection Unit plug to DIN 43650-AM2Plug-in connector includedin scope of deliveryL = Flow characteristicLinear 125 = Nominal flow rate210 = Q nom in l/min 320 = ∆p = 5 bar500 = 980 =FESXC A 1X L Z4M *Preferred typesTypeMaterial Number FESX16CA–1X/125LZ4M 0 811 402 452FESX25CA–1X/210LZ4M 0 811 402 515FESX32CA–1X/320LZ4M 0 811 402 614FESX40CA–1X/500LZ4M 0 811 402 620FESX50CA–1X/980LZ4M0 811 402 633SymbolFor external trigger electronicso u r t e s y o f C M A /F l o d y n e /H y d r a d y n e ▪ M o t i o n C o n t r o l ▪ H y d r a u l i c ▪ P n e u m a t i c ▪ E l e c t r i c a l ▪ M e c h a n i c a l ▪ (800) 426-5480 ▪ w w w .c m a f h .c o mFunction, sectional diagramTesting and service equipmentT est box type VT-PE-TB2, see RE 30064Europe card Plug-in connectors4P2P+PEo u r t e s y o f C M A /F l o d y n e /H y d r a d y n e ▪ M o t i o n C o n t r o l ▪ H y d r a u l i c ▪ P n e u m a t i c ▪ E l e c t r i c a l ▪ M e c h a n i c a l ▪ (800) 426-5480 ▪ w w w .c m a f h .c o mTechnical data1) T he purity classes stated for the components must be complied with in hydraulic systems. Effective filtration prevents problemsand also extends the service life of components.For a selection of filters, see catalog sheets RE 50070, RE 50076 and RE 50081.o u r t e s y o f C M A /F l o d y n e /H y d r a d y n e ▪ M o t i o n C o n t r o l ▪ H y d r a u l i c ▪ P n e u m a t i c ▪ E l e c t r i c a l ▪ M e c h a n i c a l ▪ (800) 426-5480 ▪ w w w .c m a f h .c o mStatic/Dynamic 1)NG16NG25NG32NG40NG50Spool stroke/characteristic curve + mm 4571012.5Overlap on shutdown– mm 33333Control oil volume of main stage cm 3100 %1.022.66 6.3612.5724.54Required control oil 0...100 %, l/min x = 100 bar 35799Hysteresis%< 0.2< 0.2< 0.2< 0.2< 0.2Positioning accuracy %< 0.5< 0.5< 0.5< 0.5< 0.5Manufacturing tolerance See flow curves, adjustable via external trigger electronicsResponse time (x = 100 bar) ms Signal change 0...100 % “open”< 70< 70< 90< 90< 110Signal change 100... 0 % “close”< 70< 70< 90< 130< 300Signal change 0... 10 % “open”< 50< 50< 70< 70< 80Signal change 10... 0 % “close”< 40< 40< 50< 70< 100Switch-off behavior, enable “OFF”After electrical shutdown (pilot valve opens “X” to the main stage),main stage moves to closed end position Thermal drift< 1 % at ∆T = 40 °CElectricalCyclic duration factor %100Degree of protection IP 65 to DIN 40050 and IEC 14434/5Solenoid connectionUnit plug DIN 43650/ISO 4400, M16x 1.5 (2P+PE)Position transducer connection Special plug (4P/Pg7)Max. solenoid current I max 2.7 A Coil resistance R 20Ω 2.5Max. power consumption at 100 % VA load and operating temperature 40Position transducer DC/DC technologySupply: +15 V/35 mA Supply: –15 V/25 mASignal: 0...±10 V (R L Ն10 k Ω)1) A ll characteristic values ascertained using amplifier 0 811 405 076 (without ramp).Technical datao u r t e s y o f C M A /F l o d y n e /H y d r a d y n e ▪ M o t i o n C o n t r o l ▪ H y d r a u l i c ▪ P n e u m a t i c ▪ E l e c t r i c a l ▪ M e c h a n i c a l ▪ (800) 426-5480 ▪ w w w .c m a f h .c o mValve with external trigger electronics (europe card without ramp, RE 30055)Circuit diagram/pin assignmento u r t e s y o f C M A /F l o d y n e /H y d r a d y n e ▪ M o t i o n C o n t r o l ▪ H y d r a u l i c ▪ P n e u m a t i c ▪ E l e c t r i c a l ▪ M e c h a n i c a l ▪ (800) 426-5480 ▪ w w w .c m a f h .c o mValve with external trigger electronics (europe card without ramp, RE 30053)Circuit diagram/pin assignmentS e e f u n c t i o n a l d i a g r a m o f r a m p c o n t r o l o n p a g e 8o u r t e s y o f C M A /F l o d y n e /H y d r a d y n e ▪ M o t i o n C o n t r o l ▪ H y d r a u l i c ▪ P n e u m a t i c ▪ E l e c t r i c a l ▪ M e c h a n i c a l ▪ (800) 426-5480 ▪ w w w .c m a f h .c o mValve with external trigger electronics (europe card with ramp, RE 30053)Functional diagram of ramp controlo u r t e s y o f C M A /F l o d y n e /H y d r a d y n e ▪ M o t i o n C o n t r o l ▪ H y d r a u l i c ▪ P n e u m a t i c ▪ E l e c t r i c a l ▪ M e c h a n i c a l ▪ (800) 426-5480 ▪ w w w .c m a f h .c o mCharacteristic curves (measured with HLP 46,oil = 40 °C ±5 °C)∆p = 5 bar υ = 36 mm 2/sNG16NG25NG32Enable OFFEnable OFFEnable OFFo u r t e s y o f C M A /F l o d y n e /H y d r a d y n e ▪ M o t i o n C o n t r o l ▪ H y d r a u l i c ▪ P n e u m a t i c ▪ E l e c t r i c a l ▪ M e c h a n i c a l ▪ (800) 426-5480 ▪ w w w .c m a f h .c o mCharacteristic curves (measured with HLP 46,oil = 40 °C ±5 °C)∆p = 5 bar υ = 36 mm 2/sNG40NG50Enable OFFEnable OFF* Amplifiero u r t e s y o f C M A /F l o d y n e /H y d r a d y n e ▪ M o t i o n C o n t r o l ▪ H y d r a u l i c ▪ P n e u m a t i c ▪ E l e c t r i c a l ▪ M e c h a n i c a l ▪ (800) 426-5480 ▪ w w w .c m a f h .c o mUnit dimensions NG16 (nominal dimensions in mm)See installation dimensions on page 16o u r t e s y o f C M A /F l o d y n e /H y d r a d y n e ▪ M o t i o n C o n t r o l ▪ H y d r a u l i c ▪ P n e u m a t i c ▪ E l e c t r i c a l ▪ M e c h a n i c a l ▪ (800) 426-5480 ▪ w w w .c m a f h .c o mUnit dimensions NG25 (nominal dimensions in mm)See installation dimensions on page 16o u r t e s y o f C M A /F l o d y n e /H y d r a d y n e ▪ M o t i o n C o n t r o l ▪ H y d r a u l i c ▪ P n e u m a t i c ▪ E l e c t r i c a l ▪ M e c h a n i c a l ▪ (800) 426-5480 ▪ w w w .c m a f h .c o mUnit dimensions NG32 (nominal dimensions in mm)See installation dimensions on page 16o u r t e s y o f C M A /F l o d y n e /H y d r a d y n e ▪ M o t i o n C o n t r o l ▪ H y d r a u l i c ▪ P n e u m a t i c ▪ E l e c t r i c a l ▪ M e c h a n i c a l ▪ (800) 426-5480 ▪ w w w .c m a f h .c o mUnit dimensions NG40 (nominal dimensions in mm)See installation dimensions on page 17o u r t e s y o f C M A /F l o d y n e /H y d r a d y n e ▪ M o t i o n C o n t r o l ▪ H y d r a u l i c ▪ P n e u m a t i c ▪ E l e c t r i c a l ▪ M e c h a n i c a l ▪ (800) 426-5480 ▪ w w w .c m a f h .c o mUnit dimensions NG50 (nominal dimensions in mm)See installation dimensions on page 17o u r t e s y o f C M A /F l o d y n e /H y d r a d y n e ▪ M o t i o n C o n t r o l ▪ H y d r a u l i c ▪ P n e u m a t i c ▪ E l e c t r i c a l ▪ M e c h a n i c a l ▪ (800) 426-5480 ▪ w w w .c m a f h .c o mInstallation dimensions DIN 24342, ISO/DIS 7368 (nominal dimensions in mm)NG16NG25NG32o u r t e s y o f C M A /F l o d y n e /H y d r a d y n e ▪ M o t i o n C o n t r o l ▪ H y d r a u l i c ▪ P n e u m a t i c ▪ E l e c t r i c a l ▪ M e c h a n i c a l ▪ (800) 426-5480 ▪ w w w .c m a f h .c o mInstallation dimensions DIN 24342, ISO/DIS 7368 (nominal dimensions in mm)NG40NG50o u r t e s y o f C M A /F l o d y n e /H y d r a d y n e ▪ M o t i o n C o n t r o l ▪ H y d r a u l i c ▪ P n e u m a t i c ▪ E l e c t r i c a l ▪ M e c h a n i c a l ▪ (800) 426-5480 ▪ w w w .c m a f h .c o mBosch Rexroth AG HydraulicsZum Eisengießer 197816 Lohr am Main, Germany T elefon +49 (0) 93 52 / 18-0T elefax +49 (0) 93 52 / 18-23 58*****************************www.boschrexroth.de© This document, as well as the data, specifications and other information set forth in it, are the exclusive property of Bosch Rexroth AG. It may not be reproduced or given to third parties without its consent.The data specified above only serve to describe the product. No state-ments concerning a certain condition or suitability for a certain application can be derived from our information. The information given does not release the user from the obligation of own judgement and verification. It must be remembered that our products are subject to a natural process of wear and aging.Noteso u r t e s y o f C M A /F l o d y n e /H y d r a d y n e ▪ M o t i o n C o n t r o l ▪ H y d r a u l i c ▪ P n e u m a t i c ▪ E l e c t r i c a l ▪ M e c h a n i c a l ▪ (800) 426-5480 ▪ w w w .c m a f h .c o mBosch Rexroth AG HydraulicsZum Eisengießer 197816 Lohr am Main, Germany T elefon +49 (0) 93 52 / 18-0T elefax +49 (0) 93 52 / 18-23 58*****************************www.boschrexroth.de© This document, as well as the data, specifications and other information set forth in it, are the exclusive property of Bosch Rexroth AG. It may not be reproduced or given to third parties without its consent.The data specified above only serve to describe the product. No state-ments concerning a certain condition or suitability for a certain application can be derived from our information. The information given does not release the user from the obligation of own judgement and verification. It must be remembered that our products are subject to a natural process of wear and aging.Noteso u r t e s y o f C M A /F l o d y n e /H y d r a d y n e ▪ M o t i o n C o n t r o l ▪ H y d r a u l i c ▪ P n e u m a t i c ▪ E l e c t r i c a l ▪ M e c h a n i c a l ▪ (800) 426-5480 ▪ w w w .c m a f h .c o mBosch Rexroth AG HydraulicsZum Eisengießer 197816 Lohr am Main, Germany T elefon +49 (0) 93 52 / 18-0T elefax +49 (0) 93 52 / 18-23 58*****************************www.boschrexroth.de© This document, as well as the data, specifications and other information set forth in it, are the exclusive property of Bosch Rexroth AG. It may not be reproduced or given to third parties without its consent.The data specified above only serve to describe the product. No state-ments concerning a certain condition or suitability for a certain application can be derived from our information. The information given does not release the user from the obligation of own judgement and verification. It must be remembered that our products are subject to a natural process of wear and aging.Noteso u r t e s y o f C M A /F l o d y n e /H y d r a d y n e ▪ M o t i o n C o n t r o l ▪ H y d r a u l i c ▪ P n e u m a t i c ▪ E l e c t r i c a l ▪ M e c h a n i c a l ▪ (800) 426-5480 ▪ w w w .c m a f h .c o m。
CF500 中文手册
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1......基本说明 ...........................................................................................................................................................1-1 1.1......这是为了确保您自身的安全 ........................................................................................................................1-1 1.2......机器可能造成的危险 ....................................................................................................................................1-1 1.3......正确使用设备 ................................................................................................................................................1-2 1.4......工作场所..........................................................................................................................................................1-2 1.5......防护装置..........................................................................................................................................................1-2 1.6......授权操作人员 ................................................................................................................................................1-3 1.7......保证 ................................................................................................................................................................1-3
AK100_01_05
AK100/S Technical Handbook 779-0187/01.05Audio Console for ATC applicationsOTE S.p.A. - Via E. Barsanti 8, 50127 – Firenze, Italy779-0187/01Issue 05 –Marchy 2004b 779-0187/01Issue 05 – March 2004© OTE S.p.A. 2004All copyright and industrial rights in this document and in the technical knowledge it contains are owned by OTE and/or the third parties rightfully concerned. No part of this document nor any data herein shall be disclosed, reproduced or used for any purpose whatsoever without the prior written consent of OTE as foreseen by the law. Drawings and specifications are subject to change.All trademarks and registered trademarks are the property of their respective holders.This document has been prepared to provide technical information on the product concerned. Whilst care has been taken in compiling the material, no responsibility can be accepted for errors or omissions in the text or in associated diagrams or tables. OTE reserves the right to change specifications, performance or features relevant to the product described without notice. Where this document is furnished in association with a quotation, tender or contract, the specifications, features, performance and availability dates which are relevant to such quotation, tender or contract shall be those specified in the schedule(s), specification(s), statement(s) of compliance or other documents specifically prepared for such purpose and shall not be assumed to be those stated or implied within this document.779-0187/01Issue 05 – March 2004779-0187/01Issue 05 – March 2004cInformation for the handbook user:B efore using the equipment, read all of the instructions contained in the manual and read those relative to safety with special care.L ue käyttöohjeet ja erityisesti turvallisuuteen liittyvat ohjeet ennen laitteen käyttöä.A lvorens over te gaan tot het gebruik van het apparaat lees met aandacht al de instructies van het handboek en let vooral op die die de veiligheidbetreffen. Alvorens het apparaat in gebruik te nemen lees alle instructies van hethandboek en vooral de voorschriften betreffende de veiligheid.A vant toute utilisation de l’appareil, lire toutes les indications contenues dans le Manuel et avec une attention particulière celles relatives à lasécurité. L äs alla instruktioner i denna manual innan ni använder apparaten och dåsärskilt noggrannt de anvisningar som gäller säkerheten.L æs alle de vejledninger, der er indeholdt i manualen med særlig opmærksomhed på de vejledninger, der vedrører sikkerheden, førapparatet tages i brug.Vor Gebrauch des Geräts alle in dieser Bedienungsanleitung enthaltenen Anweisungen und Vorschriften lesen.Den Sicherheitsbestimmungen ist dabei besondere Aufmerksamkeit zu widmen.Πριν χρησιµοποιήσετετη συσκευή διαβάστε όλες τις οδηγίες πουπεριέχονται στο εγχειρίδιο και δώστε ιδιαίτερη προσοχή στης οδηγίεςασφαλείας. P rima di utilizzare l’apparecchiatura leggere tutte le indicazioni contenute nel manuale e con particolare attenzione quelle relative alla sicurezza.779-0187/01Issue 05 –Marchy 2004d 779-0187/01Issue 05 – March 2004A ntes de utilizar el equipo leer todas las instrucciones contenidas en el manual, poniendo particular atención a las de seguridad.A ntes de utilizar o aparelho, leia todas as instruções que constam no manual e com muita atenção as instruções relativas à segurança.779-0187/01Issue 05 – March 2004779-0187/01Issue 05 – March 2004e Table of contents1.GENERAL (3)1.1PURPOSE OF THIS HANDBOOK (3)1.2INTRODUCTION (4)1.3DECLARATION OF CE MARK CONFORMANCE (4)1.4ECO-COMPATIBILITY (4)1.5HANDBOOK ORGANISATION (5)1.6GLOSSARY OF ACRONYMS (6)2.FEATURES AND SAFETY (9)2.1FEATURES (9)2.2SAFETY RECOMMENDATIONS (11)2.3ESD PRECAUTIONS (14)2.3.1ESD Precautions in Maintenance/Installation (14)3.OPERATION (17)3.1CONTROL INDICATORS AND CONNECTORS (17)3.1.1Front Connectors Description (21)3.1.2Controls and Indicators Description (22)3.2START-UP PROCEDURE (22)3.3ANCILLARY DEVICES (23)3.3.1Handset (23)3.3.2Handheld Microphone (24)3.3.3Headset (25)3.3.4Foot PTT (27)3.3.5Connection Cable for DTR100 Connection (28)3.3.6Connection Cable for Connection with DT100 + DR100 (30)3.3.7External Power Supply (32)4.TECHNICAL DESCRIPTION (35)4.1ARCHITECTURE OVERVIEW (35)4.2MECHANICAL DESCRIPTION (36)4.3SIGNAL EXCHANGE (36)4.4FUNCTIONAL DESCRIPTION (38)4.4.1AK100/S console (38)4.4.2Connectors board (chassis version) (40)5.MAINTENANCE (43)5.1PREVENTIVE MAINTENANCE (43)5.1.1Tasks (43)5.1.2Equipment and Tools (43)5.1.3Procedures (44)5.1.3.1Equipment Cleaning (44)5.1.3.2External Connectors Inspection (44)5.2CORRECTIVE MAINTENANCE (45)5.2.1List of Repleceable Parts (45)779-0187/01Issue 05 –Marchy 2004f 779-0187/01Issue 05 – March 20045.2.2AK100/S Replacement (45)5.2.3Troubleshooting Procedures (47)6.MODIFICATION INSTRUCTION (55)6.1HARDWARE UPGRADE................................................................................556.2SOFTWARE UPGRADE (55)7.INSTALLATION AND SETTING-UP (59)7.1RECOMMENDATIONS (59)7.2MINIMUM INSTALLATION REQUIREMENTS (59)7.2.1Environmental (60)7.2.2Mechanical (60)7.2.3Power and Grounding (60)7.2.4Supply Lines Protections (60)7.3MECHANICAL INSTALLATION (61)7.3.1Installation Tools and Hardware (61)7.3.2Transportation at the Site (62)7.3.3Unpacking (62)7.3.4Packing (62)7.3.5Console Fitting (62)7.3.6Rack Fitting (63)7.4DISPOSAL (63)7.4.1Disposal for Re-use (64)7.5INTERFACE CONNECTORS (64)7.5.1Front Panel Connectors (64)7.5.2Rear Panel Connectors (65)7.6SETTING-UP (69)7.6.1Alarm Setting (69)7.6.1.1Alarm Controller card (version A) (69)7.6.1.2Embedded alarm section (version B) (70)779-0187/01Issue 05 – March 2004779-0187/01Issue 05 – March 2004g List of figuresFigure 1.1 – AK100/S equipment (3)Figure 3.1 – Devices (17)Figure 3.2 – AK100/S Rack-fitting version devices (19)Figure 3.3 – Handset (23)Figure 3.4 – Handheld microphone (24)Figure 3.5 – Headset (25)Figure 3.6 – Foot PTT (27)Figure 3.7 – Power Supply (32)Figure 4.1 – AK100/S layout (35)Figure 4.2 – AK100/S rack-fitting version - layout (35)Figure 4.3 – AK100/S console version signal exchange (36)Figure 4.4 – AK100/S chassis version signal exchange (37)Figure 4.5 – Block scheme (38)Figure 6 – Connectors Board block diagram (40)Figure 5.1 – Module extraction (46)Figure 7.1 – Installation into standard rack (63)Figure 7.2 – Front side connectors (64)Figure 7.3 – Rear side connectors (65)Figure 7.4 – Alarm controller card location (69)Figure 7.5 – Alarm controller card location (70)779-0187/01Issue 05 –Marchy 2004h 779-0187/01Issue 05 – March 2004List of tablesTable 3.1 – Devices list (18)Table 3.2 – AK100/S Rack-fitting version devices (20)Table 3.3 – Handset features (23)Table 3.4 – Handset connector pin function (24)Table 3.5 – Handheld microphone features (24)Table 3.6 – Handheld microphone connector pin function (25)Table 3.7 – Headset features (26)Table 3.8 – Headset connector pin function (26)Table 3.9 – Foot PTT features (27)Table 3.10 – Foot PTT connector pin function (27)Table 3.11 – Power Supply features (32)Table 3.12 – Power Supply DC connector pin function (32)Table 4.1 – Mechanical characteristic (36)Table 5.1 – Periodic maintenance basic operations (43)Table 5.2 – Periodic maintenance tools (43)Table 5.3 - Replaceable parts (45)Table 5.4 – Failure event index (47)Table 7.1 – Installation tools (61)Table 7.2 – Front side connectors pin function (65)Table 7.3 – Power supplies connectors (66)Table 7.4 – Foot PTT connector (66)Table 7.5 – Ext LSD connector (66)Table 7.6 – IN/OUT REC (AK 100/S rack version) (67)Table 7.7 – DTR100 (P7) (AK 100/S console) (68)779-0187/01Issue 05 – March 2004779-0187/01Issue 05 – March 2004i Document historyTitle:OTE AK100/S –Technical HandbookDocument code:779-0187/01Date Variations Rev. July 2000First issue01 September 2002Major revision in all section02 May 2003Alarm controller card insertion and Squelch OFF commandremoval03 January 2004Pin function of external connector modification04March 2004Equipment dimensions and connection cables modification.Different functional description between console and rackversions. Connectors board functional description, AK100/Schassis version signal exchange and Alarm setting version Badded.05779-0187/01Issue 05 –Marchy 2004 THIS PAGE HAS BEEN INTENTIONALLY LEFT BLANKj779-0187/01Issue 05 – March 20041 - GENERALTHIS PAGE HAS BEEN INTENTIONALLY LEFT BLANK1.GENERALThis section introduces the AK100/S module and the handbook itself, by describing their tasks, operating modes and scenarios.The following figure shows the AK100/S layout.AK100/SAK100/S – Rack-fitting versionFigure 1.1 – AK100/S equipment1.1PURPOSE OF THIS HANDBOOKThe purpose of this handbook is to provide operators and technical staff with the necessary knowledge of the equipment architecture and operating, in order to make possible daily activity (e.g. normal use and routine operations), as well as installation, maintenance, etc.Handbook user is supposed to have a good skill in telecommunications and RF basics, to understand the given terms and parameters.Only trained and qualified personnel may operate the equipment. Non-observance of these conditions and the safety instructions can result in personnel injury or in property damage.1.2INTRODUCTIONThe AK100/S is a state-of-the-art communication unit specifically designed to operate as audio control equipment for a DTR 100 radio device or for a couple of DT100 DR100.The equipment has function of handling audio line and displaying the PTT and SQUELCH status.1.3DECLARATION OF CE MARK CONFORMANCEThe equipment described in this manual has been designed according the following international standards:Safety:•EN 60950 specificationsEMI:• CEI-EN specifications for CE marking•ETSI 300 339 specifications•ETSI EN 300 676 V1.2.1 (2000-05)Any connected device has to comply with the applicable safety standards.In addition, all installation activities must be performed in such a way to not compromise or lower the equipment degree safety; this must also be taken in account whenever designing system architecture and choosing installation arrangement.1.4ECO-COMPATIBILITYThe equipment described in this handbook has been designed and realized under criteria of eco-compatibility, which are also applied to the manufacturing process.1.5HANDBOOK ORGANISATIONThis handbook is organized into following sections:•Section 1 – General. Introduces the equipment, also providing a description of the equipment operating modes.•Section 2 – Features and safety. This section contains a list of the main technical data, and gives to operator all necessary information for a correct and safe use of the equipment.•Section 3 – Operation. This section describes all the aspects related to the normal use of equipment, e.g. showing function of each of the front panels controls and indicators.•Section 4 – Technical description. Contains a technical description of the equipment: this includes an overall HW description. Block diagrams indicating circuit operations are given, as well as external and internal I/Fs.•Section 5 – Maintenance. Gives useful information about preventive actions to be undertaken periodically in order to maintain the equipment. In addition contains information about fault detection and helpful information about troubleshooting. This section also givesa list of LRU (Line Replacement Unit).•Section 6 – Modification instructions. Gives information about modification activities that can be carried out on the equipment, such as the installation of additional hardware units or sub-units, or software/firmware upgrading.•Section 7 – Installation and Setting-up. Gives a detailed description of the installation procedure. In addition this section gives step-by-step procedures for the configuration and start-up of the equipment.1.6GLOSSARY OF ACRONYMSACRONYM MEANINGAC Alternate CurrentATC Air Traffic ControlAWG American Wire GaugeCE Conformité Européene / Certified EuropeCEI Comitato Elettrotecnico InternazionaleCEI-EN CEI_European NormDC Direct CurrentEEC European Economic CommunityEMC ElectroMagnetic ComplianceEMI ElectroMagnetic InterferenceEN European NormESD ElectroStatic DischargeETS European Telecommunications StandardETSI European Telecommunications Standards InstituteGND GroundHE HöhenEinheit ( 44.45 mm, 19'' System )IEC International Electrotechnical Committee/CommissionLCD Liquid Crystal DisplayLED Light Emitting DiodeMTTR Mean Time To RepairNC Normally CloseNO Normally OpenP/N Part NumberPCB Printed Circuit BoardPTT Push to TalkRAL Color standard by "Deutsches Institut für Gütesicherung undKennzeichnung"RF Radio FrequencyRX ReceiverTX Transmitterwrt with respect to2 - FEATURES AND SAFETYTHIS PAGE HAS BEEN INTENTIONALLY LEFT BLANK2.FEATURES AND SAFETYThis section of the handbook describes the equipment technical features, and gives all the instructions and warning for a correct and safe use of the equipment.Operators are strongly recommended to respect given indications; non-observance of these instructions can result in personnel injury or in property damage.2.1FEATURESHere below listed equipment technical features.Equipment - General, mechanical, environmental, safetyFeature Description and ValueMain power90 to 264 VAC, 50 to 60 Hz (external power supply)Vdc supply11 / 13VDC, 3,80 A max (external power supply)Emergency power supply Available as 12VDC ± 10%Power consumption:max 7 Va @ 220VACMax. current absorption:max 400mA @ 12 VDCI/O accessories audio linesHandset Microphone : electret-typeType:unbalancedAudio band : 300 ÷ 3400 HzNominal input level :7 mV r.m.s. @ 1 kHzEarphone : dynamic-typeImpedance : 200 OhmAudio band : 300 ÷ 3400 HzNominal output level: 10 mW @ 1 kHzHook: NC contact with standing Microtelephone.NO contact with hold-on Microtelephone.I/O accessories audio linesHeadset Microphone: electret-typeType: unbalancedAudio band: 300 ÷ 3400 Hz Nominal input level:11.5 mV r.m.s. @ 1 kHz Earphones: dynamic-type Impedance: 16OhmAudio band: 300 ÷ 3400 Hz Nominal output level: 10 mW. @ 1 kHzI/O accessories audio lines Microphone (dynamic)Type: unbalancedAudio band: 300 ÷ 3400 Hz Nominal input level: 3.5 mV r.m.s. @ 1kHzI/O accessories audio lines Microphone (electret)Type: unbalanced Audio band: 300 ÷ 3400 Hz Nominal input level: 7 mV r.m.s. @ 1kHzI/O transceiver audio lines Type: balancedImpedance: 600OhmAudio band response: 300 ÷ 3400 Hz , ± 3 dB, ref.0dB @ 1kHzNominal Tx output level: -10 dBm, ± 3 dB @ 1kHzNominal Rx input level: -10 dBm, ± 3 dB @ 1kHzRecording audio level> -13dBm , 600 OHM load @ 1kHzS/N (CCITT weighted I/O nominal levels)> 45 dB for loudspeaker, earphones outputs> 35 db for microphone outputsI/O Logic Output Line (SQL OFF out)Active with GND (negative pole)Feature Description and ValueI/O Logic Output Line (PTT out)Active with GND (negative pole)I/O Logic Input Line (SQL in signaling)Active with GND (negative pole)Audio and signalling cable Maximum length 200 m, standard length 50 mLoudspeaker output power Nominal 2W , max 3 W @ 1kHz, 12.5 VDC power supplyMaximum audio distortion At nominal power level 3% @ 1kHzExternal Dimensions AK 100 Console: H=128.5mm; W=213.1mm;..D=140mmAK100 – Rack-fitting version: H=133.35mm; W=482.72mm; D=245mm (3HE/84TE for19” rack standard according to Eurocard IEC297 standard)Shipping external dimensions AK 100 Console: H=215mm; W=390mm;..D=290mm 1AK100 – Rack-fitting version: H=210mm; W=590mm; D=345 mm 2Weight 2 Kg (3 Kg if mounted in a console or in a shelf)Color RAL 5005 light blueOperating environmental range Temperature range + 5° to + 40°CAccording to ETSI ETS 300 019-1-3 class 3.13 Non Operating storage environmental range Temperature range - 5° to + 45°CAccording to ETSI ETS 300 019-1-1 class 1.24 Transport environmental range Temperature range - 25° to + 70°CAccording to ETSI ETS 300 019-1-2 class 2.25EMI/RFI:According to CEI-EN specifications for CE marking According to ETSI 301 489-226 specificationsEMC & Safety standard CE markAccording to EN 300 3397 specifications Safety class:According to EN 609508 (4th edition 2001-02)Protection class Class III (According to IEC 664) 9Class I (rack-fitting version) (According to IEC 664)10Installation category II in accordance with IEC 66411IP class IP201 Standard shipping, may change on different requirements.2 Standard shipping, may change on different requirements.3 Ref: ETSI ETS 300 019 - Environmental conditions and environmental tests for telecommunications equipment.4 Ref: ETSI ETS 300 019 - Environmental conditions and environmental tests for telecommunications equipment.5 Ref: ETSI ETS 300 019 - Environmental conditions and environmental tests for telecommunications equipment.6 Ref: ETSI 301 489-22 - Electromagnetic compatibility and Radio spectrum Matters (ERM); General ElectroMagnetic Compatibility (EMC) standard for radio equipment and services; Part 22: Specific conditions for ground based VHF aeronautical mobile and fixed radio equipment.7 Ref: ETSI EN 300 339 - Electromagnetic compatibility and Radio spectrum Matters (ERM);General ElectroMagnetic Compatibility (EMC) for radio communications equipment.8 Ref: CEI EN 60950 (1997-10) - Safety for information technology equipment including electrical business equipment.9 Class III : The equipment satisfies the severe requirements of reliability and availability corresponding to industrial and domestic permanent installations.10 Class I : The equipment safety is based on the integrity of the connection to the general ground system. Active parts(e.g. parts under voltage) are protected by fundamental isolation; accessible conductive parts (e.g the chassis) must be connected in reliable and safe way to a safety grounding point.11 Ref: IEC 664 - Insulation coordination for equipment within low-voltage systems - Principles, requirements and tests.2.2 SAFETY RECOMMENDATIONSCarefully read all the following cautions and warnings before using the equipment.WARNINGDo not use the equipment for uses different than those indicated in thehandbook.WARNINGFor correct use of equipment, refer to the relevant section within thishandbook.WARNINGProtect the equipment from rainfalls, sprinkling of water and/or otherliquids, and from dust.WARNINGDo not set any object on equipment.WARNINGConnect the equipment to the equipment room ground bar through dedicated connection, and not through physical contact with otherframes.WARNINGDo not use the equipment if it is not appropriately grounded or if ground isabsent.WARNINGThe electric shock can cause the interruption of the natural breathing. An immediate action is necessary in order to restore breathing. It is therefore necessary that the staff be familiarized with the various methods of artificial breathing and cardiac massage. In case of incidents,caused from high tension, an urgent medical aid is necessary to deal the possible effects of the body poisoning caused from burns. In all the cases, proper medical assistance must be requested. It is necessary to make sure that any person who uses or takes care itself of the maintenance of the equipment having parts under dangerous voltages is able of performing artificial breathing, and it is necessary to instruct the staff on first aid measures in case the need arises.WARNINGDo not use the equipment if the power cable and/or the power supplyoutlet are damaged.WARNINGInstall the equipment following the instructions given in this handbook.The equipment must be installed in such a way complies with the nationalregulations in effect.WARNINGWear protection gloves when handling the equipment.WARNINGWhen handling the equipment be sure that all internal modules and cardsare safely screwed in their position into the chassis.WARNINGPosition the equipment in such a way as to guarantee its correct aeration as well as safe accessibility to the front side controls, and rear side powersupply outlets, signal and data connections.WARNINGDo not position the equipment standing on its rear side, since this candamage rear panel parts.WARNINGCarry out the maintenance interventions on the equipment following theinstructions given in this handbook.WARNINGFollow all accident prevention standards when carrying out maintenanceinterventions on the equipment.WARNINGDisconnect the power supply before carrying out maintenance interventions on the equipment.WARNINGUse only accessories or replacement parts approved by the manufacturerfor the equipment.WARNINGOnly authorized technical personnel may carry out maintenance interventions on the equipment.OTE S.p.A. VIA BARSANTI, 850127 FIRENZE ITALY TELEPHONE FAX TELEX TELEFAX E-MAIL+39 05543811+39 0554381426+39 570276+39 0554381321helpdesk.mobile@The equipment complies with all product specification and the greatest care is taken by the manufacturer so that user safety, as far as the effects of electromagnetic waves on health are concerned, is guaranteed within the limits established by the international specifications.2.3ESD PRECAUTIONSNo ESD precautions have to be taken by the operator in the daily use of the equipment. The equipment is designed and manufactured in such a way to not be sensible to electrostatic discharges.2.3.1ESD Precautions in Maintenance/InstallationThe equipment includes many electrostatic-sensitive parts that must be handled at a static-safeguarded working area. Furthermore, they must be arranged in static-safeguarded packages, either in the case of storing, or in the case of shipment.These recommendations should be followed with the maximum care, especially in the case of modules or board extraction and handling, for installation or maintenance activity, etc.A static safeguard area may be intended as:•Grounded static dissipating wrist-strap that drains static charge from the operator wearing it.• A work surface covered with or composed of a grounded, static-dissipating material that drains electrical charges from devices placed on the surface.In the AK100/S rack version, the rack surface should provide a standard-size ESD-safeguard snap suitable for snap-stacking wrist-strap connection. It should be used as a convenient ESD caution, whenever handling modules and boards. These recommendations are to be extended also to activity not strictly performed in close equipment surrounding. If removed, replaced, or located inside workshop, any board should be handled by means of convenient ESD cautions. WARNING Please note that OTE disclaims any responsibility for problems due to poor ESD protection during installation/maintenance activity.3 - OPERATIONTHIS PAGE HAS BEEN INTENTIONALLY LEFT BLANK3.OPERATIONThe purpose of this section is to describe the operational management of the AK100/S equipment specifically control and indicator devices.3.1CONTROL INDICATORS AND CONNECTORSAll the controls and indicators of the equipment are located on the front side of equipment. The rear panel is devoted to external signals and power connections.Here below the figure shows the equipment front and rear view and the table gives a description of all indicators, switches and connectors.Figure 3.1 – DevicesTable 3.1 – Devices listFront sideItem Name Type1Loudspeaker2SPEAKER VOLUME Potentiometer3PWR Green LED indicator4HEADSET/ HANDSET VOLUME Potentiometer5HEADSET RP17-13R-12SC connector6PTT Red LED indicator7OFF (headset)Pushbutton/Yellow LED Indicator 8SQL Green LED indicator9ALM Red LED indicator10MICROPHONE RP17-13R-12SC connector11OFF (loudspeaker)Pushbutton/Yellow LED indicator 12HANDSET RP17-13R-12SC connectorRear sideItem Name Type1I / O Switch2EXT LDS Connector3FOOT PTT - J6Connector412 Vdc PSU - P4Connector5FUSE F1 1 A Fuse (fast acting)612 Vdc BATTERY - P5Connector7GTR 100 DTR100 REC - P7ConnectorThe AK100/S can be mounted in a shelf suitable for Eurostandard-rack-fitting. Here below the figure shows the equipment front and rear view and the table gives a description of all indicators, switches and connectors.Figure 3.2 – AK100/S Rack-fitting version devicesTable 3.2 – AK100/S Rack-fitting version devicesFront sideItem Name Type1Loudspeaker2SPEAKER VOLUME Potentiometer3PWR Green LED indicator4HEADSET/ HANDSET VOLUME Potentiometer5HEADSET RP17-13R-12SC connector6PTT Red LED indicator7OFF (headset)Pushbutton/Yellow LED Indicator 8SQL Green LED indicator9ALM Red LED indicator10MICROPHONE RP17-13R-12SC connector11OFF (loudspeaker)Pushbutton/Yellow LED indicator 12HANDSET RP17-13R-12SC connectorRear sideItem Name Type1I / O Switch2EXT LDS Connector3FOOT PTT Connector412 Vdc PSU Connector5FUSE F1 1 A Fuse (fast acting)612 Vdc BATTERY Connector7IN OUT REC Connector3.1.1 Front Connectors DescriptionHandset connector. It is a RP12 12-pin socket; it is located on the front side and it is used to connect the local handset.Microphone connector. It is a RP12 12-pin socket; it is located on the front side and it is used to connect the local microphone.Headset connector. It is a RP12 12-pin socket; it is located on the front side and it is used to connect the local headset.The following table gives the connectors pin function.RP17-13R-12SCPin Handset (J1)Microphone (J2)Headset (J3)Function1MIC (electret+)MIC (electret+)MIC (electret+)Microphone input 122n.c.n.c.n.c.Not Used3PTTPTT PTTPTT command(active with low level)4GND(microphone)GNDGND(microphone)Ground 5GND(earphone)GND(microphone, PTT)GND(earphone)Ground6n.c.n.c.n.c.Not used 7n.c.n.c.n.c.Not used 8n.c.n.c.n.c.Not used9GND (Ear on)n.c.GND (Ear on)Ground (J1, J3 only)10Earphone n.c.Earphone Earphone output 13 (J1, J3 only)11EAR ON n.c.EAR ON Speaker muting, when the headset is connected (J1, J3 only)12n.c.MIC (dynamic)n.c.Microphone input (J2 only)12 Electrete microphone with 2 KOhm nominal impedance, also brings +2.5 VDC.13Stereo earphone, 32 Ohm impedance3.1.2Controls and Indicators DescriptionControls are located on the front side of the equipment. They consist in two potentiometers, which allow for volume regulation of loudspeaker and headphone/handphone. In addition, three pushbuttons that switch on/off the squelch, loudspeaker and headphone/handphone sets.All controls are listed in the following table.Name Type FunctionSPEAKER VOLUME Potentiometer Loudspeaker volume adjustingHEADSET/HANDSET VOLUME Potentiometer Headset/handset volume adjustingOFF (loudspeaker)Pushbutton / Indicator When pressed is active (yellow LED lit up) and disables the signal which goes at the loudspeaker.OFF (headset/handset)Pushbutton / Indicator When pressed is active (yellow LED lit up) and disables the signal which goes at the headset.Indicators are suitable to indicate the equipment operative, status and alarm signaling from the transceiver.All indicators are listed in the following table.Name FunctionPWR When active, indicates that the AK 100 is on.PTT When active, indicates that the PTT signal is active.SQL When active, indicates that a communication is incoming. It enables the loudspeaker or the earphones.ALM When active, indicates that is present a malfunction on transceiver or it is OFF.3.2 START-UP PROCEDUREThe AK100/S equipment doesn't need of any particular switching on procedure as the equipment continuously operating.Anyway, it is necessary to connect the external power supply and set the magnetothermal switch in I (ON) position.。
CF5011ALC中文资料
CF5011 series1.8V Crystal Oscillator Module ICsOVERVIEWThe CF5011 series are low-voltage crystal oscillator module ICs that operate at 1.8V . The crystal oscillator cir-cuit and output buffer employ a low-voltage CMOS process operating at 1.8V . The crystal oscillator circuit has a built-in thin-film feedback resistor with good temperature characteristics and built-in capacitors with excel-lent frequency response, making possible a stable 3rd-harmonic oscillator with only the addition of a crystal element.FEATURESI 3rd-harmonic oscillationI 1.6 to 2.0V operating supply voltage rangeI30 to 70MHz recommended operating frequency rangeI Inverter amplifier feedback resistor built-in IOscillator capacitors C G , C D built-inI Standby functionI f O output frequency (oscillator frequency) I 8mA output drive capability (V DD = 1.6V) I CMOS output duty level IChip form (CF5011 ××× )SERIES CONFIGURATIONNote: Recommended operating frequency is not the guaranteed value but is measured using NPC’s standard crystal.ORDERING INFORMATIONVersion Recommended operating frequency [MHz]gm ratio Built-in capacitance [pF]R f [k Ω ]Standby functionC G CD CF5011ALA 30 to 40 1.01416 4.0Yes CF5011ALB 1 1. Under development40 to 50 1.0816 3.9Yes CF5011ALC 1 50 to 60 1.0816 2.2Yes CF5011ALD 1 60 to 70 1.5816 2.7Yes CF5011ANA 30 to 40 1.01416 4.0No CF5011ANB 40 to 50 1.0816 3.9No CF5011ANC 50 to 60 1.0816 2.2No CF5011AND 60 to 701.58162.7NoDevice Package CF5011 ×××–1Chip formCF5011 seriesPAD LAYOUT(Unit:µm)BLOCK DIAGRAMCF5011AL×CF5011AN×Substrate potential: V DDSubstrate potential: V DDCF5011 seriesSPECIFICATIONSAbsolute Maximum RatingsV SS = 0VRecommended Operating ConditionsV SS = 0V , f ≤ 70MHz, C L = 15pF unless otherwise noted.Electrical CharacteristicsV DD = 1.6 to 2.0V , V SS = 0V , Ta = − 20 to +80 ° C unless otherwise noted.ParameterSymbol ConditionRating Unit Supply voltage range V DD − 0.5 to +3.6V Input voltage range V IN − 0.5 to V DD + 0.5V Output voltage range V OUT − 0.5 to V DD + 0.5V Operating temperature range T opr − 40 to +85 ° C Storage temperature range T stg − 65 to +150° C Output currentI OUT25mAParameterSymbol ConditionRatingUnit min typ max Supply voltage V DD 1.6– 2.0V Input voltage V IN V SS –V DD V Operating temperatureT OPR− 20–+80° CParameter Symbol ConditionRatingUnit min typ max HIGH-level output voltage V OH Q: Measurement cct 1, V DD = 1.6V, I OH = 8mA 1.1 1.3–V LOW-level output voltage V OL Q: Measurement cct 2, V DD = 1.6V, I OL = 8mA –0.30.4V Output leakage current I Z Q: Measurement cct 2, INHN = LOW, V DD = 2.0V V OH = V DD ––10µA V OL = V SS––10µA HIGH-level input voltage V IH INHN 0.7V DD ––V LOW-level input voltage V IL INHN––0.3V DD V Current consumption I DD Measurement cct 3, load cct 1, INHN = open, C L = 15pF , f = 70MHz–918mA Standby current I ST Measurement cct 3, INHN = LOW CF5011AL × ––100µA INHN pull-up resistanceR UP1 Measurement cct 4, INHN = LOW CF5011AL × 0.4–8M Ω R UP2Measurement cct 4, INHN = 0.7V DDCF5011AL × CF5011AN × 50–150k Ω AC feedback resistanceR f1Design value, determined by the internal wafer patternCF5011ALA, ANA3.204.0 4.80k Ω CF5011ALB, ANB 3.12 3.9 4.68k Ω CF5011ALC, ANC 1.76 2.2 2.64k Ω CF5011ALD, AND2.16 2.73.24k Ω DC feedback resistance R f2 Measurement cct 550–150k Ω AC feedback capacitanceC f Design value, determined by the internal wafer pattern 9.31010.7pF Built-in capacitanceC GDesign value, determined by the internal wafer patternCF5011ALA, ANA 13.021414.98pF CF5011ALB, ALC, ALD CF5011ANB, ANC, AND 7.4488.56pF C DDesign value, determined by the internal wafer pattern CF5011ALA, ANA 14.881617.12pF CF5011ALB, ALC, ALD CF5011ANB, ANC, AND14.881617.12pFCF5011 seriesSwitching CharacteristicsV DD = 1.6 to 2.0V, V SS = 0V, Ta = −20 to +80°C unless otherwise noted.MEASUREMENT CIRCUITSMeasurement cct 11.0V P −P , 10MHz sine wave input signal C1 : 0.001µF R1 : 50ΩR2 : 137.5ΩMeasurement cct 4Measurement cct 2Measurement cct 5Measurement cct 3Load cct 1C L = 15pFQ outputC L(Including probe capacitance)Switching Time Measurement WaveformT r , T f , DutyOutput duty cycleOutput Enable/Disable DelayThe following figure shows the oscillator timing during normal operation (CF5011AN × only).In case of CF5011AL ×, the oscillator stops when the device is in standby. When standby is released, the oscil-lator starts and stable oscillator output occurs after a short delay.Q outputDUTY measurement voltage (0.5VDD )DUTY measurement voltage (0.5VDD )Q outputW / T 100 (%)Q outputINHNINHN input waveform t r = t f 10nsNC0110AE2002.01。
CWT5010用户手册V2.51
1.1 版权声明
本手册指所有权由深圳市盈科互动科技有限公司独家拥有。未经本公司之书面许可,任何单位 和个人无权以任何形式复制、传播和转载本手册之任何部分,否则一切后果由违者自负。
深圳市盈科互动科技有限公司 电话:0755-26719954
CWT5010 用户手册
3
一、 前 言
感谢您使用深圳市盈科互动科技有限公司的 CWT5010 GSM 网络短信报警控制器,阅读本产品 说明书能让您快速掌握本产品的功能和使用方法。
本产品主要用于基于 GSM 网络的远程报警和控制应用,请按照说明书提供的参数和技术规格 使用,同时请注意无线电产品特别是 GSM 产品使用时应该关注的注意事项,本公司不承担由于不 正常使用或不恰当使用本产品造成的财产或人身伤害。
2.3 主要技术参数
参数项目 DC 电源 功耗 频段
SIM 卡 天线 串口 温度范围 湿度范围 输出驱动电压 输出驱动功率 输入导通电流 输入信号 外观尺寸 重量
参考范围
标准适配器:DC12V/1.5A 参考范围 9-28V DC 12V输入@最大 150mA/平均 50mA 双频 900/1800,兼容 GSM Phase 2/2+ RF power @ ARP with 50Ω load / 最大发送功率 1W 左右 支持 3V SIM 卡 50 欧 SMA 天线接口 RS-232C, 默认通讯参数 9600,n,8,0,1 -25-+70 摄氏度 相对湿度 95% (无凝结) 等于输入 DC 电压 驱动电压≤35V、驱动电流≤500mA 最大 0.33mA 干结点或者 0V-3.3V电平信号 95×64×25mm 225 克
CF5010FNC中文资料
SM5010 seriesCrystal Oscillator Module ICs OVERVIEWThe SM5010 series are crystal oscillator module ICs. They incorporate oscillator and output buffer circuits, employing built-in oscillator capacitors and feedback resistors with excellent frequency response, eliminating the need for external components to form a stable crystal oscillator. There are 7 oscillator configurations available for design and application optimization.FEATURESI7 types of oscillation circuit structureFor fundamental oscillator•5010A××:Simple structure with low frequency vari-ation•5010B××:Low crystal current type with R D built-inoscillation circuit•5010CL×:Oscillation stop function built-in •5010DN×:External capacitors, C G and C D required •5010EA×:Low current consumption typeFor 3rd overtone oscillator•5010F××:Suitable for round blank•5010H××:External resistor, R f required I 2.7 to 5.5V operating supply voltageI Capacitors C G, C D built-inI Inverter amplifier feedback resistor built-inI Output duty level•TTL level: AK×, BK×, HKוCMOS level:AN×, AH×, BN×, BH×, CL×, DN×,EA×, FN×, FH×, HN×I Oscillator frequency output (f O, f O/2, f O/4, f O/8, f O/16determined by internal connection)I Standby functionI Pull-up resistor built-inI8-pin SOP (SM5010×××S)I Chip form (CF5010×××)SERIES CONFIGURATION For Fundamental OscillatorVersion1Operatingsupplyvoltage range[V]Built-incapacitance RD[Ω]Outputcurrent(V DD = 5V)[mA]Output dutylevelOutputfrequencyINHN inputlevel(V DD = 5V)Standby modeC G[pF]C D[pF]Oscillatorstop function Output stateCF5010AN12.7 to 5.52929–16CMOS f OTTL No High impedanceCF5010AN2CMOS/TTL f O/2CF5010AN3f O/4CF5010AN4f O/8CF5010AK1 4.5 to 5.52929–16TTL f O TTL No High impedanceCF5010AH12.7 to 5.52929–4CMOS f OTTL No High impedanceCF5010AH2f O/2 CF5010AH3f O/4 CF5010AH4f O/8CF5010BN12.7 to 5.5222282016CMOS f OTTL No High impedanceCF5010BN2CMOS/TTL f O/2CF5010BN3f O/4CF5010BN4f O/8CF5010BN5f O/16CF5010BK1 4.5 to 5.5222282016TTL f O TTL No High impedanceCF5010BH12.7 to 5.522228204CMOS f OTTL No High impedanceCF5010BH2f O/2 CF5010BH3f O/4 CF5010BH4f O/8CF5010CL12.7 to 5.51818–16CMOS f OCMOS Yes High impedanceCF5010CL2f O/2CF5010CL3f O/4CF5010CL4f O/8CF5010CL5f O/16CF5010DN1 2.7 to 5.5––82016CMOS f O TTL No High impedanceCF5010EA12.7 to 5.510158204CMOS f OTTL Yes LOWCF5010EA2f O/21. Package devices have designation SM5010×××S.元器件交易网SM5010 seriesSERIES CONFIGURATIONFor 3rd Overtone OscillatorORDERING INFORMATIONPACKAGE DIMENSIONS(Unit: mm) • 8-pin SOPVersion Operating supply voltage range [V]gm ratioBuilt-in capacitanceR f [k Ω ]Output current (V DD = 5V) [mA]Output duty levelC G [pF]CD [pF] CF5010FNA 2.7 to 5.51.001315 4.216CMOSCF5010FNC 1117 3.1CF5010FND 1317 2.2CF5010FNE 4.5 to 5.5815 2.2CF5010FHA 4.5 to 5.51.001315 4.24CMOSCF5010FHC 1117 3.1CF5010FHD 1317 2.2CF5010FHE 815 2.2CF5010HN1 4.5 to 5.5 1.17131720016CMOS CF5010HK14.5 to5.51.17131720016TTLDevice Package SM5010 ××× S 8-pin SOP CF5010 ×××–1Chip form元器件交易网SM5010 seriesPAD LAYOUT(Unit: µ m)PINOUT(Top view)PIN DESCRIPTION and PAD DIMENSIONSNumberNameI/ODescriptionPad dimensions [µm]X Y 1INHN I Output state control input. Standby mode when LOW, pull-up resistor built in. In the case of the 5010CL × , the oscillator stops and Power-saving pull-up resistor is built-in to reduce current consumption at standby mode.195174.42XT I Amplifier input.Crystal oscillator connection pins.Crystal oscillator connected between XT and XTN385174.43XTN O Amplifier output.575174.44VSS –Ground765174.45Q O Output. Output frequency (f O , f O /2, f O /4, f O /8, f O/16) determined by internal connection 757.61017.66NC –No connection ––7NC –No connection ––8VDD–Supply voltage165.41014.6元器件交易网元器件交易网SM5010 series BLOCK DIAGRAMFor Fundamental OscillatorI5010A××, B××, CL×, DN×, EA× seriesFor 3rd Overtone OscillatorI5010F××, H×× seriesSM5010 seriesFUNCTIONAL DESCRIPTIONStandby Function5010AH × , AK × , AN × , BH × , BK × , BN × , DN×, FN ×, FH ×, HN ×, HK × seriesWhen INHN goes LOW, the output on Q becomes high impedance, but internally the oscillator does not stop.5010CL × seriesWhen INHN goes LOW, the oscillator stops and the oscillator output on Q becomes high impedance.5010EA × seriesWhen INHN goes LOW, the oscillator stops and the oscillator output on Q becomes LOW.Power-saving Pull-up Resistor (CL series only)The INHN pull-up resistance changes in response to the input level (HIGH or LOW). When INHN goes LOW (standby state), the pull-up resistance becomes large to reduce the current consumption during standby.Version INHN QOscillator AH ×, AK ×, AN ×, BH ×, BK ×, BN ×, DN ×, FH ×, FH ×, HN ×, HK × seriesHIGH (or open)Any f O , f O /2, f O /4, f O /8 or f O /16 output frequencyNormal operation LOW High impedanceNormal operation CL × seriesHIGH (or open)Any f O , f O /2, f O /4, f O /8 or f O /16 output frequencyNormal operationLOW High impedanceStopped EA × seriesHIGH (or open)Either f O or f O /2 output frequencyNormal operationLOWLOWStopped元器件交易网SPECIFICATIONSAbsolute Maximum RatingsV SS = 0VRecommended Operating Conditions3V operation V SS = 0VParameterSymbol ConditionRating Unit Supply voltage range V DD −0.5 to +7.0V Input voltage range V IN −0.5 to V DD + 0.5V Output voltage range V OUT −0.5 to V DD + 0.5V Operating temperature range T opr −40 to +85°C Storage temperature rangeT stgChip form −65 to +150°C8-pin SOP−55 to +125Output currentI OUT AH ×, BH ×, FH ×, EA ×10mA AN ×, AK ×, BN ×, BK ×, CL ×, DN ×, FN ×, HN ×, HK ×25Power dissipation P D8-pin SOP500mWParameter Symbol Version ConditionRating Unit Operating supply voltage V DD All version 2.7 to 3.6V Input voltageV INAll version V SS to V DDVOperating temperatureT OPR5010AN ×−10 to +70°C5010AH ×5010BN ×5010BH ×5010CL ×−20 to +805010DN1−10 to +705010EA ×5010FN ×Operating frequencyf5010AN ×C L ≤ 15pF2 to 30MHz5010AH × 2 to 165010BN ×2 to 305010BH × 2 to 165010CL × 2 to 305010DN15010EA ×5010FN ×22 to 405V operationV SS = 0VParameter Symbol Version Condition Rating Unit Operating supply voltage V DD All version 4.5 to 5.5V Input voltage V IN All version V SS to V DD VOperating temperature T OPR 5010AN×−40 to +85°C 5010AK×5010AH×5010BN×5010BK×5010BH×5010CL×5010DN15010EA×C L≤ 15pF, f = 2 to 30MHzC L≤ 15pF, f = 2 to 40MHz−10 to +705010FN×C L≤ 50pF, 30MHz ≤ f ≤ 50MHz−20 to +80C L≤ 15pF, 50MHz ≤ f ≤ 70MHz−15 to +755010FH×C L≤ 15pF, 30MHz ≤ f ≤ 50MHz−20 to +80C L≤ 15pF, 50MHz ≤ f ≤ 60MHz−15 to +755010HN1−40 to +855010HK1Operating frequency f 5010AN×C L≤ 50pF2 to 30MHz 5010AK×C L≤ 15pF5010AH×5010BN×C L≤ 50pF5010BK×C L≤ 15pF5010BH×5010CL×C L≤ 50pF5010DN15010EA×C L≤ 15pF, Ta =− 40 to + 85°C 2 to 405010FN×C L≤ 50pF, Ta =− 20 to + 80°C30 to 50C L≤ 15pF, Ta =− 15 to + 75°C50 to 705010FH×C L≤ 15pF, Ta =− 20 to + 80°C30 to 50C L≤ 15pF, Ta =− 15 to + 75°C50 to 605010HN1C L≤ 50pF22 to 505010HK1C L≤ 15pFElectrical Characteristics5010AN ×, BN ×, DN × series3V operation: V DD = 2.7 to 3.6V , V SS = 0V , Ta = −10 to +70°C unless otherwise noted.5010AN ×, AK ×, BN ×, BK ×, DN × series5V operation: V DD = 4.5 to 5.5V , V SS = 0V , Ta = −40 to +85°C unless otherwise noted.Parameter Symbol ConditionRatingUnit min typ max HIGH-level output voltage V OH Q: Measurement cct 1, V DD = 2.7V, I OH = 8mA 2.1 2.4–V LOW-level output voltage V OL Q: Measurement cct 2, V DD = 2.7V, I OL = 8mA –0.30.4V HIGH-level input voltage V IH INHN 2.0––V LOW-level input voltage V IL INHN––0.5V Output leakage currentI ZQ: Measurement cct 2, INHN = LOW, V DD = 3.6VV OH = V DD ––10µAV OL = V SS ––10Current consumptionI DDMeasurement cct 3, load cct 1,INHN = open, C L = 15pF , f = 30MHz5010×N1–510mA 5010×N2– 3.575010×N3– 2.555010×N4–245010×N5–24INHN pull-up resistance R UP2Measurement cct 440100250k ΩFeedback resistance R f Measurement cct 580200500k ΩOscillator amplifier output resistanceR D Design value5010B ××690820940ΩBuilt-in capacitanceC GDesign value. A monitor pattern on a wafer is tested.5010A ××262932pF 5010B ××202224C D5010A ××2629325010B ××202224Parameter Symbol ConditionRatingUnit min typ max HIGH-level output voltage V OH Q: Measurement cct 1, V DD = 4.5V, I OH = 16mA 3.9 4.2–V LOW-level output voltage V OL Q: Measurement cct 2, V DD = 4.5V, I OL = 16mA –0.30.4V HIGH-level input voltage V IH INHN 2.0––V LOW-level input voltage V IL INHN––0.8V Output leakage currentI ZQ: Measurement cct 2, INHN = LOW, V DD = 5.5VV OH = V DD ––10µAV OL = V SS ––10Current consumptionI DDMeasurement cct 3, load cct 1, INHN = open, C L = 50pF , f = 30MHz5010×N1–1530mA 5010×N2–9185010×N3–6125010×N4–5105010×N5–510Measurement cct 3, load cct 2,INHN = open, C L = 15pF , f = 30MHz5010×K1–1020INHN pull-up resistance R UP2Measurement cct 440100250k ΩFeedback resistance R f Measurement cct 580200500k ΩOscillator amplifier output resistanceR D Design value5010B ××690820940ΩBuilt-in capacitanceC GDesign value. A monitor pattern on a wafer is tested.5010A ××262932pF 5010B ××202224C D5010A ××2629325010B ××2022245010AH ×, BH × series3V operation: V DD = 2.7 to 3.6V , V SS = 0V , Ta = −10 to +70°C unless otherwise noted.5V operation: V DD = 4.5 to 5.5V , V SS = 0V , Ta = −40 to +85°C unless otherwise noted.Parameter Symbol ConditionRatingUnit min typ max HIGH-level output voltage V OH Q: Measurement cct 1, V DD = 2.7V, I OH = 2mA 2.1 2.4–V LOW-level output voltage V OL Q: Measurement cct 2, V DD = 2.7V, I OL = 2mA –0.30.5V HIGH-level input voltage V IH INHN 2.0––V LOW-level input voltage V IL INHN––0.5V Output leakage currentI ZQ: Measurement cct 2, INHN = LOW, V DD = 3.6VV OH = V DD ––10µAV OL = V SS ––10Current consumptionI DDMeasurement cct 3, load cct 1,INHN = open, C L = 15pF , f = 16MHz5010×H1–36mA 5010×H2–245010×H3– 1.535010×H4– 1.5 2.5INHN pull-up resistance R UP2Measurement cct 440100250k ΩFeedback resistance R f Measurement cct 580200500k ΩOscillator amplifier output resistanceR D Design value5010B ××690820940ΩBuilt-in capacitanceC GDesign value. A monitor pattern on a wafer is tested.5010A ××262932pF 5010B ××202224C D5010A ××2629325010B ××202224Parameter Symbol ConditionRatingUnit min typ max HIGH-level output voltage V OH Q: Measurement cct 1, V DD = 4.5V, I OH = 4mA 3.9 4.2–V LOW-level output voltage V OL Q: Measurement cct 2, V DD = 4.5V, I OL = 4mA –0.30.5V HIGH-level input voltage V IH INHN 2.0––V LOW-level input voltage V IL INHN––0.8V Output leakage currentI ZQ: Measurement cct 2, INHN = LOW, V DD = 5.5VV OH = V DD ––10µAV OL = V SS ––10Current consumptionI DDMeasurement cct 3, load cct 1,INHN = open, C L = 15pF , f = 30MHz5010×H1–918mA 5010×H2–6125010×H3–5105010×H4–48INHN pull-up resistance R UP2Measurement cct 440100250k ΩFeedback resistance R f Measurement cct 580200500k ΩOscillator amplifier output resistanceR D Design value5010B ××690820940ΩBuilt-in capacitanceC GDesign value. A monitor pattern on a wafer is tested.5010A ××262932pF 5010B ××202224C D5010A ××2629325010B ××2022245010CL × series3V operation: V DD = 2.7 to 3.6V , V SS = 0V , Ta = −20 to +80°C unless otherwise noted.5V operation: V DD = 4.5 to 5.5V , V SS = 0V , Ta = −40 to +85°C unless otherwise noted.Parameter Symbol ConditionRatingUnit min typ max HIGH-level output voltage V OH Q: Measurement cct 1, V DD = 2.7V, I OH = 8mA 2.2 2.4–V LOW-level output voltage V OL Q: Measurement cct 2, V DD = 2.7V, I OL = 8mA –0.30.4V HIGH-level input voltage V IH INHN 0.7V DD ––V LOW-level input voltage V IL INHN––0.3V DD V Output leakage currentI ZQ: Measurement cct 2, INHN = LOW, V DD = 3.6VV OH = V DD ––10µAV OL = V SS ––10Current consumptionI DDMeasurement cct 3, load cct 1,INHN = open, C L = 15pF , f = 30MHz5010CL1–510mA 5010CL2– 3.575010CL3– 2.555010CL4–245010CL5–24Standby current I ST Measurement cct 6, INHN = LOW ––5µA INHN pull-up resistance R UP1Measurement cct 42415M ΩR UP240100250k ΩFeedback resistance R f Measurement cct 580200500k ΩBuilt-in capacitanceC G Design value. A monitor pattern on a wafer is tested.161820pF C D161820Parameter Symbol ConditionRatingUnit min typ max HIGH-level output voltage V OH Q: Measurement cct 1, V DD = 4.5V, I OH = 16mA 4.0 4.2–V LOW-level output voltage V OL Q: Measurement cct 2, V DD = 4.5V, I OL = 16mA –0.30.4V HIGH-level input voltage V IH INHN 0.7V DD ––V LOW-level input voltage V IL INHN––0.3V DD V Output leakage currentI ZQ: Measurement cct 2, INHN = LOW, V DD = 5.5VV OH = V DD ––10µAV OL = V SS ––10Current consumptionI DDMeasurement cct 3, load cct 1,INHN = open, C L = 50pF , f = 30MHz5010CL1–1530mA 5010CL2–9185010CL3–6125010CL4–5105010CL5–510Standby current I ST Measurement cct 6, INHN = LOW ––10µA INHN pull-up resistance R UP1Measurement cct 4128M ΩR UP240100250k ΩFeedback resistance R f Measurement cct 580200500k ΩBuilt-in capacitanceC G Design value. A monitor pattern on a wafer is tested.161820pF C D1618205010EA × series3V operation: V DD = 2.7 to 3.6V , V SS = 0V , Ta = −10 to +70°C unless otherwise noted.5V operation: V DD = 4.5 to 5.5V , V SS = 0V , Ta = −40 to +85°C unless otherwise noted.Parameter Symbol ConditionRatingUnit min typ max HIGH-level output voltage V OH Q: Measurement cct 1, V DD = 2.7V, I OH = 2mA 2.1 2.4–V LOW-level output voltage V OL Q: Measurement cct 2, V DD = 2.7V, I OL = 2mA –0.30.5V HIGH-level input voltage V IH INHN 2.0––V LOW-level input voltage V IL INHN––0.5V Current consumption I DD Measurement cct 3, load cct 1,INHN = open, C L = 15pF , f = 30MHz 5010EA1–48mA 5010EA2– 2.55INHN pull-up resistance R UP2Measurement cct 440100250k ΩFeedback resistance R f Measurement cct 580200500k ΩOscillator amplifier output resistance R D Design value690820940ΩBuilt-in capacitanceC G Design value. A monitor pattern on a wafer is tested.91011pFC D131517Parameter Symbol ConditionRatingUnit min typ max HIGH-level output voltage V OH Q: Measurement cct 1, V DD = 4.5V, I OH = 3.2mA 3.9 4.2–V LOW-level output voltage V OL Q: Measurement cct 2, V DD = 4.5V, I OL = 3.2mA –0.30.4V HIGH-level input voltage V IH INHN 2.0––V LOW-level input voltageV IL INHN––0.8VCurrent consumptionI DD1Measurement cct 3, load cct 1,INHN = open, C L = 15pF , f = 30MHz5010EA1–612mA 5010EA2–510I DD2Measurement cct 3, load cct 1,INHN = open, C L = 15pF , f = 40MHz 5010EA1–9185010EA2–612INHN pull-up resistance R UP2Measurement cct 440100250k ΩFeedback resistance R f Measurement cct 580200500k ΩOscillator amplifier output resistance R D Design value690820940ΩBuilt-in capacitanceC G Design value. A monitor pattern on a wafer is tested.91011pFC D1315175010FN× series3V operation: V DD = 2.7 to 3.6V, V SS = 0V, Ta = −10 to +70°C unless otherwise noted.Parameter Symbol ConditionRatingUnit min typ maxHIGH-level output voltage V OH Q: Measurement cct 1, V DD = 2.7V, I OH = 8mA 2.2 2.4–V LOW-level output voltage V OL Q: Measurement cct 2, V DD = 2.7V, I OL = 8mA–0.30.4V HIGH-level input voltage V IH INHN 2.0––V LOW-level input voltage V IL INHN––0.5VOutput leakage current I Z Q: Measurement cct 2, INHN = LOW,V DD = 3.6VV OH = V DD––10µAV OL = V SS––10Current consumption I DD Measurement cct 3, load cct 1,INHN = open, C L = 15pF5010FNA, FNCf = 30MHz–816mA5010FNDf = 40MHz–1020INHN pull-up resistance R UP Measurement cct 440100250kΩFeedback resistance R f Measurement cct 55010FNA 3.57 4.2 4.83kΩ5010FNC 2.63 3.1 3.575010FND 1.87 2.2 2.53Built-in capacitance C GDesign value. A monitor pattern on awafer is tested.5010FNA11.71314.3pF5010FNC9.91112.15010FND11.71314.3C D5010FNA13.51516.55010FNC15.31718.75010FND15.31718.75V operation:V DD = 4.5 to 5.5V, V SS = 0V30 ≤ f ≤ 50MHz: Ta = −20 to +80°C, 50 < f ≤ 70MHz: Ta = −15 to +75°C unless otherwise noted.Parameter Symbol ConditionRatingUnit min typ maxHIGH-level output voltage V OH Q: Measurement cct 1, V DD = 4.5V, I OH = 16mA 3.9 4.2–V LOW-level output voltage V OL Q: Measurement cct 2, V DD = 4.5V, I OL = 16mA–0.30.4V HIGH-level input voltage V IH INHN 2.0––V LOW-level input voltage V IL INHN––0.8VOutput leakage current I Z Q: Measurement cct 2, INHN = LOW,V DD = 5.5VV OH = V DD––10µAV OL = V SS––10Current consumption I DD1Measurement cct 3, load cct 1,INHN = open, C L = 15pF5010FNEf = 70MHz–2550mA I DD2Measurement cct 3, load cct 1,INHN = open, C L = 50pF5010FNA, FNCf = 40MHz–23455010FNDf = 50MHz–2550INHN pull-up resistance R UP Measurement cct 440100250kΩFeedback resistance R f Measurement cct 55010FNA 3.57 4.2 4.83kΩ5010FNC 2.63 3.1 3.575010FND 1.87 2.2 2.535010FNE 1.87 2.2 2.53Built-in capacitance C GDesign value. A monitor pattern on awafer is tested.5010FNA11.71314.3pF5010FNC9.91112.15010FND11.71314.35010FNE7.288.8C D5010FNA13.51516.55010FNC15.31718.75010FND15.31718.75010FNE13.51516.55010FH × series5V operation:V DD = 4.5 to 5.5V , V SS = 0V30 ≤ f ≤ 50MHz: Ta = −20 to +80°C, 50 < f ≤ 60MHz: Ta = −15 to +75°C unless otherwise noted.5010HN ×, HK × series5V operation: V DD = 4.5 to 5.5V , V SS = 0V , Ta = −40 to +85°C unless otherwise noted.Parameter Symbol ConditionRatingUnit min typ max HIGH-level output voltage V OH Q: Measurement cct 1, V DD = 4.5V, I OH = 4mA 3.9 4.2–V LOW-level output voltage V OL Q: Measurement cct 2, V DD = 4.5V, I OL = 4mA –0.30.5V HIGH-level input voltage V IH INHN 2.0––V LOW-level input voltage V IL INHN––0.8V Output leakage currentI ZQ: Measurement cct 2, INHN = LOW, V DD = 5.5VV OH = V DD ––10µAV OL = V SS ––10Current consumptionI DDMeasurement cct 3, load cct 1,INHN = open, C L = 15pF5010FHA, FHC f = 40MHz–1326mA 5010FHD f = 50MHz –15305010FHE f = 60MHz–1734INHN pull-up resistanceR UPMeasurement cct 440100250k ΩFeedback resistanceR fMeasurement cct 55010FHA3.574.2 4.83k Ω5010FHC 2.63 3.1 3.575010FHD 1.87 2.2 2.535010FHE 1.87 2.2 2.53Built-in capacitanceC GDesign value. A monitor pattern on a wafer is tested.5010FHA11.71314.3pF 5010FHC 9.91112.15010FHD 11.71314.35010FHE 7.288.8C D5010FHA 13.51516.55010FHC 15.31718.75010FHD 15.31718.75010FHE13.51516.5Parameter Symbol ConditionRatingUnit min typ max HIGH-level output voltage V OH Q: Measurement cct 1, V DD = 4.5V, I OH = 16mA 3.9 4.2–V LOW-level output voltage V OL Q: Measurement cct 2, V DD = 4.5V, I OL = 16mA –0.30.4V HIGH-level input voltage V IH INHN 2.0––V LOW-level input voltage V IL INHN––0.8V Output leakage currentI Z Q: Measurement cct 2, INHN = LOW, V DD = 5.5VV OH = V DD ––10µAV OL = V SS ––10Current consumptionI DD1Measurement cct 3, load cct 2,INHN = open, C L = 15pF , f = 50MHz 5010HK1–2040mAI DD2Measurement cct 3, load cct 1,INHN = open, C L = 50pF , f = 50MHz 5010HN1–2550INHN pull-up resistance R UP Measurement cct 440100250k ΩFeedback resistance R f Measurement cct 580200500k ΩBuilt-in capacitanceC G Design value. A monitor pattern on a wafer is tested.11.71314.3pF C D15.31718.7Switching Characteristics5010AN ×, BN ×, DN × series3V operation/Duty level: CMOSV DD = 2.7 to 3.6V , V SS = 0V , Ta = −10 to +70°C unless otherwise noted.5010AN ×, AK ×, BN ×, BK ×, DN × series5V operation/Duty level: CMOS (5010AN ×, BN ×, DN1)V DD = 4.5 to 5.5V , V SS = 0V , Ta = −40 to +85°C unless otherwise noted.5V operation/Duty level: TTL (5010×K1, AN2, AN3, AN4, BN2, BN3, BN4, BN5)V DD = 4.5 to 5.5V , V SS = 0V , Ta = −40 to +85°C unless otherwise noted.Parameter Symbol ConditionRatingUnit min typ max Output rise time t r1Measurement cct 6, load cct 1, C L = 15pF , 0.1V DD to 0.9V DD – 3.0 6.0ns Output fall time t f1Measurement cct 6, load cct 1, C L = 15pF , 0.9V DD to 0.1V DD – 3.0 6.0ns Output duty cycle 11. The duty cycle characteristic is checked the sample chips of each production lot.Duty Measurement cct 6, load cct 1, V DD = 3.0V, Ta = 25°C, C L = 15pF , f = 30MHz40–60%Output disable delay time t PLZ Measurement cct 7, load cct 1, V DD = 3.0V, Ta = 25°C, C L = 15pF––100ns Output enable delay timet PZL––100nsParameterSymbol ConditionRatingUnitmin typ max Output rise time t r1Measurement cct 6, load cct 1, 0.1V DD to 0.9V DDC L = 15pF – 2.0 4.0nst r2C L = 50pF – 4.08.0Output fall time t f1Measurement cct 6, load cct 1, 0.9V DD to 0.1V DDC L = 15pF – 2.0 4.0nst f2C L = 50pF– 4.08.0Output duty cycle 11. The duty cycle characteristic is checked the sample chips of each production lot.Duty Measurement cct 6, load cct 1, V DD = 5.0V, Ta = 25°C, C L = 50pF , f = 30MHz45–55%Output disable delay time t PLZ Measurement cct 7, load cct 1, V DD = 5.0V, Ta = 25°C, C L = 15pF––100ns Output enable delay timet PZL––100nsParameter Symbol ConditionRatingUnit min typ max Output rise time t r3Measurement cct 6, load cct 2, C L = 15pF , 0.4V to 2.4V – 1.5 3.0ns Output fall time t f3Measurement cct 6, load cct 2, C L = 15pF , 2.4V to 0.4V – 1.5 3.0ns Output duty cycle 11. The duty cycle characteristic is checked the sample chips of each production lot.Duty Measurement cct 6, load cct 2, V DD = 5.0V, Ta = 25°C, C L = 15pF , f = 30MHz45–55%Output disable delay time t PLZ Measurement cct 7, load cct 2, V DD = 5.0V, Ta = 25°C, C L = 15pF––100ns Output enable delay timet PZL––100ns5010AH ×, BH × series3V operation/Duty level: CMOSV DD = 2.7 to 3.6V , V SS = 0V , Ta = −10 to +70°C unless otherwise noted.5V operation/Duty level: CMOSV DD = 4.5 to 5.5V , V SS = 0V , Ta = −40 to +85°C unless otherwise noted.Parameter Symbol ConditionRatingUnit min typ max Output rise time t r1Measurement cct 6, load cct 1, C L = 15pF , 0.1V DD to 0.9V DD –816ns Output fall time t f1Measurement cct 6, load cct 1, C L = 15pF , 0.9V DD to 0.1V DD –816ns Output duty cycle 11. The duty cycle characteristic is checked the sample chips of each production lot.Duty Measurement cct 6, load cct 1, V DD = 3.0V, Ta = 25°C, C L = 15pF , f = 16MHz40–60%Output disable delay time t PLZ Measurement cct 7, load cct 1, V DD = 3.0V, Ta = 25°C, C L = 15pF––100ns Output enable delay timet PZL––100nsParameterSymbol ConditionRatingUnitmin typ max Output rise time t r1Measurement cct 6, load cct 1, 0.1V DD to 0.9V DDC L = 15pF –510nst r2C L = 50pF –1326Output fall time t f1Measurement cct 6, load cct 1, 0.9V DD to 0.1V DDC L = 15pF –510nst f2C L = 50pF–1326Output duty cycle 11. The duty cycle characteristic is checked the sample chips of each production lot.Duty Measurement cct 6, load cct 1, V DD = 5.0V, Ta = 25°C, C L = 15pF , f = 30MHz45–55%Output disable delay time t PLZ Measurement cct 7, load cct 1, V DD = 5.0V, Ta = 25°C, C L = 15pF––100ns Output enable delay timet PZL––100ns5010CL × series3V operation/Duty level: CMOSV DD = 2.7 to 3.6V , V SS = 0V , Ta = −20 to +80°C unless otherwise noted.5V operation/Duty level: CMOSV DD = 4.5 to 5.5V , V SS = 0V , Ta = −40 to +85°C unless otherwise noted.ParameterSymbol ConditionRatingUnitmin typ max Output rise time t r1Measurement cct 6, load cct 1, 0.1V DD to 0.9V DDC L = 15pF – 2.0 4.0nst r4C L = 30pF – 3.0 6.0Output fall time t f1Measurement cct 6, load cct 1, 0.9V DD to 0.1V DDC L = 15pF – 2.0 4.0nst f4C L = 30pF– 3.0 6.0Output duty cycle 11. The duty cycle characteristic is checked the sample chips of each production lot.Duty Measurement cct 6, load cct 1, V DD = 3.0V, Ta = 25°C, C L = 15pF , f = 30MHz45–55%Output disable delay time 22. Oscillator stop function is built-in. When INHN goes LOW, normal output stops. When INHN goes HIGH, normal output is not resumed until after the oscillator start-up time has elapsed.t PLZ Measurement cct 7, load cct 1, V DD = 3.0V, Ta = 25°C, C L = 15pF––100ns Output enable delay time 2t PZL––100nsParameterSymbol ConditionRatingUnitmin typ max Output rise time t r1Measurement cct 6, load cct 1, 0.1V DD to 0.9V DDC L = 15pF – 1.5 3.0nst r2C L = 50pF – 4.08.0Output fall time t f1Measurement cct 6, load cct 1, 0.9V DD to 0.1V DDC L = 15pF – 1.5 3.0nst f2C L = 50pF– 4.08.0Output duty cycle 11. The duty cycle characteristic is checked the sample chips of each production lot.Duty Measurement cct 6, load cct 1, V DD = 5.0V, Ta = 25°C, C L = 50pF , f = 30MHz40–60%Output disable delay time 22. Oscillator stop function is built-in. When INHN goes LOW, normal output stops. When INHN goes HIGH, normal output is not resumed until after the oscillator start-up time has elapsed.t PLZ Measurement cct 7, load cct 1, V DD = 5.0V, Ta = 25°C, C L = 15pF––100ns Output enable delay time 2t PZL––100ns5010EA × series3V operation/Duty level: CMOSV DD = 2.7 to 3.6V , V SS = 0V , Ta = −10 to +70°C unless otherwise noted.5V operation/Duty level: CMOSV DD = 4.5 to 5.5V , V SS = 0V , Ta = −40 to +85°C unless otherwise noted.Parameter Symbol ConditionRatingUnit min typ max Output rise time t r1Measurement cct 6, load cct 1, C L = 15pF , 0.1V DD to 0.9V DD –816ns Output fall time t f1Measurement cct 6, load cct 1, C L = 15pF , 0.9V DD to 0.1V DD –816ns Output duty cycle 11. The duty cycle characteristic is checked the sample chips of each production lot.Duty Measurement cct 6, load cct 1, V DD = 3.0V, Ta = 25°C, C L = 15pF , f = 30MHz40–60%Output disable delay time 22. Oscillator stop function is built-in. When INHN goes LOW, normal output stops. When INHN goes HIGH, normal output is not resumed until after the oscillator start-up time has elapsed.t PLZ Measurement cct 7, load cct 1, V DD = 3.0V, Ta = 25°C, C L = 15pF––100ns Output enable delay time 2t PZL––100nsParameterSymbol ConditionRatingUnitmin typ max Output rise time t r1Measurement cct 6, load cct 1, 0.1V DD to 0.9V DDC L = 15pF –510nst r2C L = 50pF –1326Output fall time t f1Measurement cct 6, load cct 1, 0.9V DD to 0.1V DDC L = 15pF –510nst f2C L = 50pF –1326Output duty cycle 11. The duty cycle characteristic is checked the sample chips of each production lot.Duty1Measurement cct 6, load cct 1, V DD = 5.0V, Ta = 25°C, C L = 15pFf = 30MHz 45–55%Duty2 f = 40MHz40–60Output disable delay time 22. Oscillator stop function is built-in. When INHN goes LOW, normal output stops. When INHN goes HIGH, normal output is not resumed until after the oscillator start-up time has elapsed.t PLZ Measurement cct 7, load cct 1, V DD = 5.0V, Ta = 25°C, C L = 15pF––100ns Output enable delay time 2t PZL––100ns。
AK100说明书
安装 iriver iriver plus 4 是一款集成软件,可管理多种多媒体文件。
plus 4
使用 iriver plus 4 将 PC 文件保存在 iriver 设备中或自动 升级固件。
入门指南 09
用户指南
安装
1. 运行存储在内部存储器中的 iriver plus 4 安装程序后, 将显示程序安装说明对话框。
入门指南 12
用户指南
基本操作
使用触摸 LCD
1. 此 iriver 设备具有一个触摸 LCD 系统,触摸屏幕即可 运行。 只需在屏幕上触摸所需图标即可执行该图标对应的功能。
断开与计算机的连接 1. 单击计算机屏幕的任务栏中显示的图标以安全删除它。 2. 单击 [确定] 以确保可安全删除 iriver 设备。
任务栏中的图标可能会隐藏,具体取决于操作系统,如 Windows XP。单击该图标将其显示在屏幕上。 在使用如 Windows 资源管理器或 Windows Media Player 等应用程序时,删除 iriver 设备可能不安全。 只有在退出所有应用程序后才能删除 iriver 设备。如果没 有这样做,则可能导致存储的数据丢失。
AK100
保护袋
Micro USB 电缆
快速入门指南和 产品质量保证书
保护袋:可以保护产品免受擦损。 Micro USB 电缆:您可以将本产品连接到计算机并对其充电。 快速入门指南:介绍使用本产品的基本方法。 产品质量保证书:请将产品质量保证书放在安全的位置, 万一您的 iriver 设备需要维修,您需要使用它。 手册:在使用之前,请先阅读在产品中保存为 PDF 文件的手册(pdf 文件)。
向库添加媒体
1. 首次运行 iriver plus 4 时,请按照媒体向导执行操作。 2. 按照屏幕上的说明将计算机中的媒体文件(如音乐、
2018年cf英雄武器哪个最好用_cf英雄武器排行榜201Xword版本 (6页)
本文部分内容来自网络整理,本司不为其真实性负责,如有异议或侵权请及时联系,本司将立即删除!== 本文为word格式,下载后可方便编辑和修改! ==cf英雄武器哪个最好用_cf英雄武器排行榜201Xcf到目前为止已经推出了一系列的英雄武器,武器多了选择的范围也就大了,玩家们对于那个武器最好有每个人都有不同的看法,其实每一把英雄武器都有独属于自己的优点,当然也是会有缺点的,下面本文将为从枪械性能未大家列出哪个武器最好用,一起来看看吧!第九名:M4A1-黑骑士【额外属性】1、增加装备中的所有步枪子弹数2、幸运经验值,GP加成3、致命一击挑战模式下有几率使普通攻击变成致命攻击,可以叠加。
触发致命一击会恢复少量的生命值,不能叠加。
世界顶级武器收藏家制作的英雄级“M4A1”!冷酷的黑色盔甲,若隐若现的红色微光,如黑夜中的骑士一般静静的等待出征!武器特点:1、射速快;2、额外子弹数;3、挑战模式下可以打出致命一击;(在屏幕中出现一道闪电线)【总结:现在挑战如此不堪一击,验证了致命一击有多鸡肋。
这把枪的性能更渣。
速点不如雷神,扫射不如黑龙。
有雷神,黑龙的光芒在,黑骑士注定一无是处。
】第八名:汤姆逊-烈龙全新英雄级武器“汤姆逊-烈龙”震撼登场,枪身被一只飞翔的银龙缠绕,超大的携弹量,霸气的外观,绝对是收藏的不二选择。
1.经验值增加150% 增加装备中的所有冲锋枪子弹数 2.活力值系统填充速度增加20% 挑战模式分数增加50% 3.同房间玩家经验值增加30% 同房间玩家GP增加20% 4.挑战模式同房间玩家获得分数增加20%【点评:汤姆逊烈龙射速快这是毋庸置疑的,爆破吗,根本打不死人,这枪适用于生化,团队,挑战,小学僧最爱的一把。
】第七名:尼泊尔-屠龙世界顶级武器收藏家制作的英雄级“尼泊尔”!暗金色的龙骨刀身,鲜红的龙爪握把,这是屠龙勇者的神兵!1、快手:使用该武器切换为其它武器,或使用其它武器切换为该武器时,加快武器切换速度。
海尔海翔5机型气速数据配件套说明书
AIR DATA ACCESSORIES KIT MODEL No. ADAG5-834HT GULFSTREAM 5 AIRCRAFT/Nav-Aids-Ltd-ADAG5-834HT-RVSM-Air-Data-Accessories-Kit-for-Gulfstream-G5-and-G500.aspxTo buy, sell, rent or trade-in this product please click on the link below:AIR DATA ACCESSORIES KIT MODEL No. ADAG5-834HT GULFSTREAM 5 AIRCRAFTJanuary 20, 2009Page 2 of 2The kit contains all the equipment required to test from source the complete pitot and static air data system on the Gulfstream 5 aircraft, as well as the means of pre-testing alladaptors and hoses prior the being fitted to the aircraft.Pitot & Dual Static Test Adaptor Part No. PSS99451HT-3-4-4 (4 req’d.) These units fit the pitot static probes 0856TK located on the nose and when installed they will isolate and test each system separately or simultaneously. Pre-Test ProbePart No. PT421-451 (4 req’d.)When it becomes necessary to test the integrity of the pitot & dual static adaptors and/or hoses and test set, these units are used in place of the pitot & dual static probe. Pitot Test Hose Assembly Part No. G5-20-3P (4 req’d.)These hoses connect to each pitot inlet of the adaptors from the designated control console outlets.Static Test Hose Assembly Part No. G5-20-4S (8 req’d.)These assemblies attach to the staticpositions on the pitot & dual static adaptors as designated on the control console. Inlet Hose Assembly Part No. 757-211 (2 req’d.)These assemblies are used to connect the static & pitot outlets of the pneumatic signal generator to the top connections on the control console.Reducer Hose Assembly Part No. A352-3-4 (1 req’d.)This hose is supplied to increase the flexibility of the hose assembly to the test set. Pitot System Control Console Part No. 421-G5-P4 (1 req’d.) andStatic System Control Console Part No. 421-G5-ST8 (1 req’d.)These units contain all necessary inlets and outlets required to connect the pneumatic generator and the adaptors and hoses to the aircraft sensing system.Note: Care should be taken to ensure that the control valves are open when required before beginning the tests to avoid surges.All inlets etc. are identified on the photo etched panel.The hoses connected to console and adaptors are color coded at each end for easy system identification. Lubricating Fluid Part No. LF5050 (1 req’d.)This fluid is used to lubricate the glands of the pitot & dual static adaptors. It isrecommended that a small amount be placed on the glands before installing adaptor on pitot head. This will ensure smooth installation onto the pitot probe. Seal Kit - Part No. SK451HTTwo sets of spare seals are supplied with each kit.Manual - Part No. 444M-G5-834HT One manual is supplied with each kit. The equipment is enclosed in case assembly Model No. 129XD-G5-834HT.。
本说明书详细介绍了春风CF150-2B型两轮摩托车的基本操作和保养
前 言本说明书详细介绍了春风CF150-2B型两轮摩托车的基本操作和保养方法,驾驶前请您仔细阅读。
正确地使用、保养和维护,能有效的保障行车安全,减少摩托车的故障,保持该车最佳性能,并延长该车的使用寿命。
本公司的“春风维修站”将为您提供优质的售后服务。
本说明书所标明的数据、规格和说明,是根据公司目前最新设计而确定的,浙江春风动力股份有限公司随时都有更新的权力。
对此,凡是本公司今后对该车的技术变更,将不再另行通知。
感谢您选购了“春风”牌摩托车!祝愿您在未来行程中,享受它给您带来的舒适、快捷和愉悦。
本产品(CF150-2B)执行标准为:Q/CFD 013-2011注 意请遵照交通法规和按本使用保养说明书的规定进行操作。
本使用保养说明书是本车的必备附件之一,当车转卖给他人时,请随车附上。
本使用保养说明书版权归浙江春风动力股份有限公司所有,未经本公司书面同意不准翻印,违者必究。
本使用说明书的编写符合:GB9969.1-1998及GB/T19678-2005标准的规定。
本使用说明书的最终解释权为浙江春风动力股份有限公司。
目 录一、CF150-2B 型两轮摩托车简介二、用户须知三、摩托车的运输、贮存和开箱安装四、摩托车的安全驾驶(一)安全驾驶规则……………………………………………………………( 2 )(二)安全防护用品……………………………………………………………(3 ) (三)车辆的改装………………………………………………………………(4 )(四)货物的装载………………………………………………………………(4 )(五)附件………………………………………………………………………(4 )五、使用说明(一)零件的位置………………………………………………………………(5 )(二)仪表和点火开关…………………………………………………………( 6 )(三)右手把开关组合…………………………………………………………( 7 )(四)左手把开关组合…………………………………………………………( 8 )(五)燃油和油箱盖……………………………………………………………( 8 )六)润滑油的选用……………………………………………………………( 9 )(七)轮胎………………………………………………………………………( 9)六、操作指导(一)磨合期 (10)(二)驾驶前的检查 (10)(………………………………………………………………………………………………………………………( )2……………………………………………( )1(3 )... 三)摩托车的起动 (11)(四)摩托车的驾驶 (11)七、保养与维护(一)保养周期表........................................................................(13) (二)发动机润滑油的检查与更换 (14)(三)火花塞的选用与更换 (14)(四)空气滤清器的清洗与装配......................................................(14) (五)油门把手的检查和调整.........................................................(15) (六)离合器的调整.....................................................................(16) (七)驱动链条的检查、调整及润滑................................................(16) (八)前制动器的检查与调整 (17)(九)后制动器的检查与调整 (18)(十)蓄电池的保养 (19)(十一)电子燃油喷射系统、燃油蒸发回收系统使用保养说明………… (20)(十二)发动机水冷系统使用保养说明……………………………………(21)十三)车辆清洁及存放 ……………………………………………………(22)(十四)车辆的使用期限及车辆处理 ………………………………………(23)(十五)摩托车的有关调整数据 (23)(十六)CF150-2B 的主要技术参数表 (24)(十七)CF150-2B 型两轮摩托车电气系统图 (26)(十八)摩托车的常见故障及原因 (25)((……………………一、CF150-2B型两轮摩托车简介CF150-2B型两轮摩托车结构紧凑,具有风格独特的新颖外观。
穿越火线:枪战王者scar小米厉害吗新武器属性图片曝光
逗游网——中国2亿游戏用户一致选择的”一站式“游戏服务平台
穿越火线:枪战王者-scar小米厉害吗 新武器属性图片曝光
scar小米属性 威力 50 便携 33 精准 38 稳定 61 射速 18 换弹 22 穿透 71 载弹 36/108
CFM与小米联合推出的高性能SCAR步枪,专属小米配色配以优良属 性,只为发烧而生。这把scaபைடு நூலகம்小米外形看起来还不错,枪身整体是黄色得 到,上面印着“M”小米的标志,是一把皮肤枪。 但是这种广告商合作的枪一般都不是那么好得的,通常都是要参与某 些活动才能获取呢。那这把武器究竟怎么获取,目前没有给出任何途径说 明,CFer们还是静待它的正式上线吧。
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SM5010 seriesCrystal Oscillator Module ICs OVERVIEWThe SM5010 series are crystal oscillator module ICs. They incorporate oscillator and output buffer circuits, employing built-in oscillator capacitors and feedback resistors with excellent frequency response, eliminating the need for external components to form a stable crystal oscillator. There are 7 oscillator configurations available for design and application optimization.FEATURESI7 types of oscillation circuit structureFor fundamental oscillator•5010A××:Simple structure with low frequency vari-ation•5010B××:Low crystal current type with R D built-inoscillation circuit•5010CL×:Oscillation stop function built-in •5010DN×:External capacitors, C G and C D required •5010EA×:Low current consumption typeFor 3rd overtone oscillator•5010F××:Suitable for round blank•5010H××:External resistor, R f required I 2.7 to 5.5V operating supply voltageI Capacitors C G, C D built-inI Inverter amplifier feedback resistor built-inI Output duty level•TTL level: AK×, BK×, HKוCMOS level:AN×, AH×, BN×, BH×, CL×, DN×,EA×, FN×, FH×, HN×I Oscillator frequency output (f O, f O/2, f O/4, f O/8, f O/16determined by internal connection)I Standby functionI Pull-up resistor built-inI8-pin SOP (SM5010×××S)I Chip form (CF5010×××)SERIES CONFIGURATION For Fundamental OscillatorVersion1Operatingsupplyvoltage range[V]Built-incapacitance RD[Ω]Outputcurrent(V DD = 5V)[mA]Output dutylevelOutputfrequencyINHN inputlevel(V DD = 5V)Standby modeC G[pF]C D[pF]Oscillatorstop function Output stateCF5010AN12.7 to 5.52929–16CMOS f OTTL No High impedanceCF5010AN2CMOS/TTL f O/2CF5010AN3f O/4CF5010AN4f O/8CF5010AK1 4.5 to 5.52929–16TTL f O TTL No High impedanceCF5010AH12.7 to 5.52929–4CMOS f OTTL No High impedanceCF5010AH2f O/2 CF5010AH3f O/4 CF5010AH4f O/8CF5010BN12.7 to 5.5222282016CMOS f OTTL No High impedanceCF5010BN2CMOS/TTL f O/2CF5010BN3f O/4CF5010BN4f O/8CF5010BN5f O/16CF5010BK1 4.5 to 5.5222282016TTL f O TTL No High impedanceCF5010BH12.7 to 5.522228204CMOS f OTTL No High impedanceCF5010BH2f O/2 CF5010BH3f O/4 CF5010BH4f O/8CF5010CL12.7 to 5.51818–16CMOS f OCMOS Yes High impedanceCF5010CL2f O/2CF5010CL3f O/4CF5010CL4f O/8CF5010CL5f O/16CF5010DN1 2.7 to 5.5––82016CMOS f O TTL No High impedanceCF5010EA12.7 to 5.510158204CMOS f OTTL Yes LOWCF5010EA2f O/21. Package devices have designation SM5010×××S.元器件交易网SM5010 seriesSERIES CONFIGURATIONFor 3rd Overtone OscillatorORDERING INFORMATIONPACKAGE DIMENSIONS(Unit: mm) • 8-pin SOPVersion Operating supply voltage range [V]gm ratioBuilt-in capacitanceR f [k Ω ]Output current (V DD = 5V) [mA]Output duty levelC G [pF]CD [pF] CF5010FNA 2.7 to 5.51.001315 4.216CMOSCF5010FNC 1117 3.1CF5010FND 1317 2.2CF5010FNE 4.5 to 5.5815 2.2CF5010FHA 4.5 to 5.51.001315 4.24CMOSCF5010FHC 1117 3.1CF5010FHD 1317 2.2CF5010FHE 815 2.2CF5010HN1 4.5 to 5.5 1.17131720016CMOS CF5010HK14.5 to5.51.17131720016TTLDevice Package SM5010 ××× S 8-pin SOP CF5010 ×××–1Chip form元器件交易网SM5010 seriesPAD LAYOUT(Unit: µ m)PINOUT(Top view)PIN DESCRIPTION and PAD DIMENSIONSNumberNameI/ODescriptionPad dimensions [µm]X Y 1INHN I Output state control input. Standby mode when LOW, pull-up resistor built in. In the case of the 5010CL × , the oscillator stops and Power-saving pull-up resistor is built-in to reduce current consumption at standby mode.195174.42XT I Amplifier input.Crystal oscillator connection pins.Crystal oscillator connected between XT and XTN385174.43XTN O Amplifier output.575174.44VSS –Ground765174.45Q O Output. Output frequency (f O , f O /2, f O /4, f O /8, f O/16) determined by internal connection 757.61017.66NC –No connection ––7NC –No connection ––8VDD–Supply voltage165.41014.6元器件交易网元器件交易网SM5010 series BLOCK DIAGRAMFor Fundamental OscillatorI5010A××, B××, CL×, DN×, EA× seriesFor 3rd Overtone OscillatorI5010F××, H×× seriesSM5010 seriesFUNCTIONAL DESCRIPTIONStandby Function5010AH × , AK × , AN × , BH × , BK × , BN × , DN×, FN ×, FH ×, HN ×, HK × seriesWhen INHN goes LOW, the output on Q becomes high impedance, but internally the oscillator does not stop.5010CL × seriesWhen INHN goes LOW, the oscillator stops and the oscillator output on Q becomes high impedance.5010EA × seriesWhen INHN goes LOW, the oscillator stops and the oscillator output on Q becomes LOW.Power-saving Pull-up Resistor (CL series only)The INHN pull-up resistance changes in response to the input level (HIGH or LOW). When INHN goes LOW (standby state), the pull-up resistance becomes large to reduce the current consumption during standby.Version INHN QOscillator AH ×, AK ×, AN ×, BH ×, BK ×, BN ×, DN ×, FH ×, FH ×, HN ×, HK × seriesHIGH (or open)Any f O , f O /2, f O /4, f O /8 or f O /16 output frequencyNormal operation LOW High impedanceNormal operation CL × seriesHIGH (or open)Any f O , f O /2, f O /4, f O /8 or f O /16 output frequencyNormal operationLOW High impedanceStopped EA × seriesHIGH (or open)Either f O or f O /2 output frequencyNormal operationLOWLOWStopped元器件交易网SPECIFICATIONSAbsolute Maximum RatingsV SS = 0VRecommended Operating Conditions3V operation V SS = 0VParameterSymbol ConditionRating Unit Supply voltage range V DD −0.5 to +7.0V Input voltage range V IN −0.5 to V DD + 0.5V Output voltage range V OUT −0.5 to V DD + 0.5V Operating temperature range T opr −40 to +85°C Storage temperature rangeT stgChip form −65 to +150°C8-pin SOP−55 to +125Output currentI OUT AH ×, BH ×, FH ×, EA ×10mA AN ×, AK ×, BN ×, BK ×, CL ×, DN ×, FN ×, HN ×, HK ×25Power dissipation P D8-pin SOP500mWParameter Symbol Version ConditionRating Unit Operating supply voltage V DD All version 2.7 to 3.6V Input voltageV INAll version V SS to V DDVOperating temperatureT OPR5010AN ×−10 to +70°C5010AH ×5010BN ×5010BH ×5010CL ×−20 to +805010DN1−10 to +705010EA ×5010FN ×Operating frequencyf5010AN ×C L ≤ 15pF2 to 30MHz5010AH × 2 to 165010BN ×2 to 305010BH × 2 to 165010CL × 2 to 305010DN15010EA ×5010FN ×22 to 405V operationV SS = 0VParameter Symbol Version Condition Rating Unit Operating supply voltage V DD All version 4.5 to 5.5V Input voltage V IN All version V SS to V DD VOperating temperature T OPR 5010AN×−40 to +85°C 5010AK×5010AH×5010BN×5010BK×5010BH×5010CL×5010DN15010EA×C L≤ 15pF, f = 2 to 30MHzC L≤ 15pF, f = 2 to 40MHz−10 to +705010FN×C L≤ 50pF, 30MHz ≤ f ≤ 50MHz−20 to +80C L≤ 15pF, 50MHz ≤ f ≤ 70MHz−15 to +755010FH×C L≤ 15pF, 30MHz ≤ f ≤ 50MHz−20 to +80C L≤ 15pF, 50MHz ≤ f ≤ 60MHz−15 to +755010HN1−40 to +855010HK1Operating frequency f 5010AN×C L≤ 50pF2 to 30MHz 5010AK×C L≤ 15pF5010AH×5010BN×C L≤ 50pF5010BK×C L≤ 15pF5010BH×5010CL×C L≤ 50pF5010DN15010EA×C L≤ 15pF, Ta =− 40 to + 85°C 2 to 405010FN×C L≤ 50pF, Ta =− 20 to + 80°C30 to 50C L≤ 15pF, Ta =− 15 to + 75°C50 to 705010FH×C L≤ 15pF, Ta =− 20 to + 80°C30 to 50C L≤ 15pF, Ta =− 15 to + 75°C50 to 605010HN1C L≤ 50pF22 to 505010HK1C L≤ 15pFElectrical Characteristics5010AN ×, BN ×, DN × series3V operation: V DD = 2.7 to 3.6V , V SS = 0V , Ta = −10 to +70°C unless otherwise noted.5010AN ×, AK ×, BN ×, BK ×, DN × series5V operation: V DD = 4.5 to 5.5V , V SS = 0V , Ta = −40 to +85°C unless otherwise noted.Parameter Symbol ConditionRatingUnit min typ max HIGH-level output voltage V OH Q: Measurement cct 1, V DD = 2.7V, I OH = 8mA 2.1 2.4–V LOW-level output voltage V OL Q: Measurement cct 2, V DD = 2.7V, I OL = 8mA –0.30.4V HIGH-level input voltage V IH INHN 2.0––V LOW-level input voltage V IL INHN––0.5V Output leakage currentI ZQ: Measurement cct 2, INHN = LOW, V DD = 3.6VV OH = V DD ––10µAV OL = V SS ––10Current consumptionI DDMeasurement cct 3, load cct 1,INHN = open, C L = 15pF , f = 30MHz5010×N1–510mA 5010×N2– 3.575010×N3– 2.555010×N4–245010×N5–24INHN pull-up resistance R UP2Measurement cct 440100250k ΩFeedback resistance R f Measurement cct 580200500k ΩOscillator amplifier output resistanceR D Design value5010B ××690820940ΩBuilt-in capacitanceC GDesign value. A monitor pattern on a wafer is tested.5010A ××262932pF 5010B ××202224C D5010A ××2629325010B ××202224Parameter Symbol ConditionRatingUnit min typ max HIGH-level output voltage V OH Q: Measurement cct 1, V DD = 4.5V, I OH = 16mA 3.9 4.2–V LOW-level output voltage V OL Q: Measurement cct 2, V DD = 4.5V, I OL = 16mA –0.30.4V HIGH-level input voltage V IH INHN 2.0––V LOW-level input voltage V IL INHN––0.8V Output leakage currentI ZQ: Measurement cct 2, INHN = LOW, V DD = 5.5VV OH = V DD ––10µAV OL = V SS ––10Current consumptionI DDMeasurement cct 3, load cct 1, INHN = open, C L = 50pF , f = 30MHz5010×N1–1530mA 5010×N2–9185010×N3–6125010×N4–5105010×N5–510Measurement cct 3, load cct 2,INHN = open, C L = 15pF , f = 30MHz5010×K1–1020INHN pull-up resistance R UP2Measurement cct 440100250k ΩFeedback resistance R f Measurement cct 580200500k ΩOscillator amplifier output resistanceR D Design value5010B ××690820940ΩBuilt-in capacitanceC GDesign value. A monitor pattern on a wafer is tested.5010A ××262932pF 5010B ××202224C D5010A ××2629325010B ××2022245010AH ×, BH × series3V operation: V DD = 2.7 to 3.6V , V SS = 0V , Ta = −10 to +70°C unless otherwise noted.5V operation: V DD = 4.5 to 5.5V , V SS = 0V , Ta = −40 to +85°C unless otherwise noted.Parameter Symbol ConditionRatingUnit min typ max HIGH-level output voltage V OH Q: Measurement cct 1, V DD = 2.7V, I OH = 2mA 2.1 2.4–V LOW-level output voltage V OL Q: Measurement cct 2, V DD = 2.7V, I OL = 2mA –0.30.5V HIGH-level input voltage V IH INHN 2.0––V LOW-level input voltage V IL INHN––0.5V Output leakage currentI ZQ: Measurement cct 2, INHN = LOW, V DD = 3.6VV OH = V DD ––10µAV OL = V SS ––10Current consumptionI DDMeasurement cct 3, load cct 1,INHN = open, C L = 15pF , f = 16MHz5010×H1–36mA 5010×H2–245010×H3– 1.535010×H4– 1.5 2.5INHN pull-up resistance R UP2Measurement cct 440100250k ΩFeedback resistance R f Measurement cct 580200500k ΩOscillator amplifier output resistanceR D Design value5010B ××690820940ΩBuilt-in capacitanceC GDesign value. A monitor pattern on a wafer is tested.5010A ××262932pF 5010B ××202224C D5010A ××2629325010B ××202224Parameter Symbol ConditionRatingUnit min typ max HIGH-level output voltage V OH Q: Measurement cct 1, V DD = 4.5V, I OH = 4mA 3.9 4.2–V LOW-level output voltage V OL Q: Measurement cct 2, V DD = 4.5V, I OL = 4mA –0.30.5V HIGH-level input voltage V IH INHN 2.0––V LOW-level input voltage V IL INHN––0.8V Output leakage currentI ZQ: Measurement cct 2, INHN = LOW, V DD = 5.5VV OH = V DD ––10µAV OL = V SS ––10Current consumptionI DDMeasurement cct 3, load cct 1,INHN = open, C L = 15pF , f = 30MHz5010×H1–918mA 5010×H2–6125010×H3–5105010×H4–48INHN pull-up resistance R UP2Measurement cct 440100250k ΩFeedback resistance R f Measurement cct 580200500k ΩOscillator amplifier output resistanceR D Design value5010B ××690820940ΩBuilt-in capacitanceC GDesign value. A monitor pattern on a wafer is tested.5010A ××262932pF 5010B ××202224C D5010A ××2629325010B ××2022245010CL × series3V operation: V DD = 2.7 to 3.6V , V SS = 0V , Ta = −20 to +80°C unless otherwise noted.5V operation: V DD = 4.5 to 5.5V , V SS = 0V , Ta = −40 to +85°C unless otherwise noted.Parameter Symbol ConditionRatingUnit min typ max HIGH-level output voltage V OH Q: Measurement cct 1, V DD = 2.7V, I OH = 8mA 2.2 2.4–V LOW-level output voltage V OL Q: Measurement cct 2, V DD = 2.7V, I OL = 8mA –0.30.4V HIGH-level input voltage V IH INHN 0.7V DD ––V LOW-level input voltage V IL INHN––0.3V DD V Output leakage currentI ZQ: Measurement cct 2, INHN = LOW, V DD = 3.6VV OH = V DD ––10µAV OL = V SS ––10Current consumptionI DDMeasurement cct 3, load cct 1,INHN = open, C L = 15pF , f = 30MHz5010CL1–510mA 5010CL2– 3.575010CL3– 2.555010CL4–245010CL5–24Standby current I ST Measurement cct 6, INHN = LOW ––5µA INHN pull-up resistance R UP1Measurement cct 42415M ΩR UP240100250k ΩFeedback resistance R f Measurement cct 580200500k ΩBuilt-in capacitanceC G Design value. A monitor pattern on a wafer is tested.161820pF C D161820Parameter Symbol ConditionRatingUnit min typ max HIGH-level output voltage V OH Q: Measurement cct 1, V DD = 4.5V, I OH = 16mA 4.0 4.2–V LOW-level output voltage V OL Q: Measurement cct 2, V DD = 4.5V, I OL = 16mA –0.30.4V HIGH-level input voltage V IH INHN 0.7V DD ––V LOW-level input voltage V IL INHN––0.3V DD V Output leakage currentI ZQ: Measurement cct 2, INHN = LOW, V DD = 5.5VV OH = V DD ––10µAV OL = V SS ––10Current consumptionI DDMeasurement cct 3, load cct 1,INHN = open, C L = 50pF , f = 30MHz5010CL1–1530mA 5010CL2–9185010CL3–6125010CL4–5105010CL5–510Standby current I ST Measurement cct 6, INHN = LOW ––10µA INHN pull-up resistance R UP1Measurement cct 4128M ΩR UP240100250k ΩFeedback resistance R f Measurement cct 580200500k ΩBuilt-in capacitanceC G Design value. A monitor pattern on a wafer is tested.161820pF C D1618205010EA × series3V operation: V DD = 2.7 to 3.6V , V SS = 0V , Ta = −10 to +70°C unless otherwise noted.5V operation: V DD = 4.5 to 5.5V , V SS = 0V , Ta = −40 to +85°C unless otherwise noted.Parameter Symbol ConditionRatingUnit min typ max HIGH-level output voltage V OH Q: Measurement cct 1, V DD = 2.7V, I OH = 2mA 2.1 2.4–V LOW-level output voltage V OL Q: Measurement cct 2, V DD = 2.7V, I OL = 2mA –0.30.5V HIGH-level input voltage V IH INHN 2.0––V LOW-level input voltage V IL INHN––0.5V Current consumption I DD Measurement cct 3, load cct 1,INHN = open, C L = 15pF , f = 30MHz 5010EA1–48mA 5010EA2– 2.55INHN pull-up resistance R UP2Measurement cct 440100250k ΩFeedback resistance R f Measurement cct 580200500k ΩOscillator amplifier output resistance R D Design value690820940ΩBuilt-in capacitanceC G Design value. A monitor pattern on a wafer is tested.91011pFC D131517Parameter Symbol ConditionRatingUnit min typ max HIGH-level output voltage V OH Q: Measurement cct 1, V DD = 4.5V, I OH = 3.2mA 3.9 4.2–V LOW-level output voltage V OL Q: Measurement cct 2, V DD = 4.5V, I OL = 3.2mA –0.30.4V HIGH-level input voltage V IH INHN 2.0––V LOW-level input voltageV IL INHN––0.8VCurrent consumptionI DD1Measurement cct 3, load cct 1,INHN = open, C L = 15pF , f = 30MHz5010EA1–612mA 5010EA2–510I DD2Measurement cct 3, load cct 1,INHN = open, C L = 15pF , f = 40MHz 5010EA1–9185010EA2–612INHN pull-up resistance R UP2Measurement cct 440100250k ΩFeedback resistance R f Measurement cct 580200500k ΩOscillator amplifier output resistance R D Design value690820940ΩBuilt-in capacitanceC G Design value. A monitor pattern on a wafer is tested.91011pFC D1315175010FN× series3V operation: V DD = 2.7 to 3.6V, V SS = 0V, Ta = −10 to +70°C unless otherwise noted.Parameter Symbol ConditionRatingUnit min typ maxHIGH-level output voltage V OH Q: Measurement cct 1, V DD = 2.7V, I OH = 8mA 2.2 2.4–V LOW-level output voltage V OL Q: Measurement cct 2, V DD = 2.7V, I OL = 8mA–0.30.4V HIGH-level input voltage V IH INHN 2.0––V LOW-level input voltage V IL INHN––0.5VOutput leakage current I Z Q: Measurement cct 2, INHN = LOW,V DD = 3.6VV OH = V DD––10µAV OL = V SS––10Current consumption I DD Measurement cct 3, load cct 1,INHN = open, C L = 15pF5010FNA, FNCf = 30MHz–816mA5010FNDf = 40MHz–1020INHN pull-up resistance R UP Measurement cct 440100250kΩFeedback resistance R f Measurement cct 55010FNA 3.57 4.2 4.83kΩ5010FNC 2.63 3.1 3.575010FND 1.87 2.2 2.53Built-in capacitance C GDesign value. A monitor pattern on awafer is tested.5010FNA11.71314.3pF5010FNC9.91112.15010FND11.71314.3C D5010FNA13.51516.55010FNC15.31718.75010FND15.31718.75V operation:V DD = 4.5 to 5.5V, V SS = 0V30 ≤ f ≤ 50MHz: Ta = −20 to +80°C, 50 < f ≤ 70MHz: Ta = −15 to +75°C unless otherwise noted.Parameter Symbol ConditionRatingUnit min typ maxHIGH-level output voltage V OH Q: Measurement cct 1, V DD = 4.5V, I OH = 16mA 3.9 4.2–V LOW-level output voltage V OL Q: Measurement cct 2, V DD = 4.5V, I OL = 16mA–0.30.4V HIGH-level input voltage V IH INHN 2.0––V LOW-level input voltage V IL INHN––0.8VOutput leakage current I Z Q: Measurement cct 2, INHN = LOW,V DD = 5.5VV OH = V DD––10µAV OL = V SS––10Current consumption I DD1Measurement cct 3, load cct 1,INHN = open, C L = 15pF5010FNEf = 70MHz–2550mA I DD2Measurement cct 3, load cct 1,INHN = open, C L = 50pF5010FNA, FNCf = 40MHz–23455010FNDf = 50MHz–2550INHN pull-up resistance R UP Measurement cct 440100250kΩFeedback resistance R f Measurement cct 55010FNA 3.57 4.2 4.83kΩ5010FNC 2.63 3.1 3.575010FND 1.87 2.2 2.535010FNE 1.87 2.2 2.53Built-in capacitance C GDesign value. A monitor pattern on awafer is tested.5010FNA11.71314.3pF5010FNC9.91112.15010FND11.71314.35010FNE7.288.8C D5010FNA13.51516.55010FNC15.31718.75010FND15.31718.75010FNE13.51516.55010FH × series5V operation:V DD = 4.5 to 5.5V , V SS = 0V30 ≤ f ≤ 50MHz: Ta = −20 to +80°C, 50 < f ≤ 60MHz: Ta = −15 to +75°C unless otherwise noted.5010HN ×, HK × series5V operation: V DD = 4.5 to 5.5V , V SS = 0V , Ta = −40 to +85°C unless otherwise noted.Parameter Symbol ConditionRatingUnit min typ max HIGH-level output voltage V OH Q: Measurement cct 1, V DD = 4.5V, I OH = 4mA 3.9 4.2–V LOW-level output voltage V OL Q: Measurement cct 2, V DD = 4.5V, I OL = 4mA –0.30.5V HIGH-level input voltage V IH INHN 2.0––V LOW-level input voltage V IL INHN––0.8V Output leakage currentI ZQ: Measurement cct 2, INHN = LOW, V DD = 5.5VV OH = V DD ––10µAV OL = V SS ––10Current consumptionI DDMeasurement cct 3, load cct 1,INHN = open, C L = 15pF5010FHA, FHC f = 40MHz–1326mA 5010FHD f = 50MHz –15305010FHE f = 60MHz–1734INHN pull-up resistanceR UPMeasurement cct 440100250k ΩFeedback resistanceR fMeasurement cct 55010FHA3.574.2 4.83k Ω5010FHC 2.63 3.1 3.575010FHD 1.87 2.2 2.535010FHE 1.87 2.2 2.53Built-in capacitanceC GDesign value. A monitor pattern on a wafer is tested.5010FHA11.71314.3pF 5010FHC 9.91112.15010FHD 11.71314.35010FHE 7.288.8C D5010FHA 13.51516.55010FHC 15.31718.75010FHD 15.31718.75010FHE13.51516.5Parameter Symbol ConditionRatingUnit min typ max HIGH-level output voltage V OH Q: Measurement cct 1, V DD = 4.5V, I OH = 16mA 3.9 4.2–V LOW-level output voltage V OL Q: Measurement cct 2, V DD = 4.5V, I OL = 16mA –0.30.4V HIGH-level input voltage V IH INHN 2.0––V LOW-level input voltage V IL INHN––0.8V Output leakage currentI Z Q: Measurement cct 2, INHN = LOW, V DD = 5.5VV OH = V DD ––10µAV OL = V SS ––10Current consumptionI DD1Measurement cct 3, load cct 2,INHN = open, C L = 15pF , f = 50MHz 5010HK1–2040mAI DD2Measurement cct 3, load cct 1,INHN = open, C L = 50pF , f = 50MHz 5010HN1–2550INHN pull-up resistance R UP Measurement cct 440100250k ΩFeedback resistance R f Measurement cct 580200500k ΩBuilt-in capacitanceC G Design value. A monitor pattern on a wafer is tested.11.71314.3pF C D15.31718.7Switching Characteristics5010AN ×, BN ×, DN × series3V operation/Duty level: CMOSV DD = 2.7 to 3.6V , V SS = 0V , Ta = −10 to +70°C unless otherwise noted.5010AN ×, AK ×, BN ×, BK ×, DN × series5V operation/Duty level: CMOS (5010AN ×, BN ×, DN1)V DD = 4.5 to 5.5V , V SS = 0V , Ta = −40 to +85°C unless otherwise noted.5V operation/Duty level: TTL (5010×K1, AN2, AN3, AN4, BN2, BN3, BN4, BN5)V DD = 4.5 to 5.5V , V SS = 0V , Ta = −40 to +85°C unless otherwise noted.Parameter Symbol ConditionRatingUnit min typ max Output rise time t r1Measurement cct 6, load cct 1, C L = 15pF , 0.1V DD to 0.9V DD – 3.0 6.0ns Output fall time t f1Measurement cct 6, load cct 1, C L = 15pF , 0.9V DD to 0.1V DD – 3.0 6.0ns Output duty cycle 11. The duty cycle characteristic is checked the sample chips of each production lot.Duty Measurement cct 6, load cct 1, V DD = 3.0V, Ta = 25°C, C L = 15pF , f = 30MHz40–60%Output disable delay time t PLZ Measurement cct 7, load cct 1, V DD = 3.0V, Ta = 25°C, C L = 15pF––100ns Output enable delay timet PZL––100nsParameterSymbol ConditionRatingUnitmin typ max Output rise time t r1Measurement cct 6, load cct 1, 0.1V DD to 0.9V DDC L = 15pF – 2.0 4.0nst r2C L = 50pF – 4.08.0Output fall time t f1Measurement cct 6, load cct 1, 0.9V DD to 0.1V DDC L = 15pF – 2.0 4.0nst f2C L = 50pF– 4.08.0Output duty cycle 11. The duty cycle characteristic is checked the sample chips of each production lot.Duty Measurement cct 6, load cct 1, V DD = 5.0V, Ta = 25°C, C L = 50pF , f = 30MHz45–55%Output disable delay time t PLZ Measurement cct 7, load cct 1, V DD = 5.0V, Ta = 25°C, C L = 15pF––100ns Output enable delay timet PZL––100nsParameter Symbol ConditionRatingUnit min typ max Output rise time t r3Measurement cct 6, load cct 2, C L = 15pF , 0.4V to 2.4V – 1.5 3.0ns Output fall time t f3Measurement cct 6, load cct 2, C L = 15pF , 2.4V to 0.4V – 1.5 3.0ns Output duty cycle 11. The duty cycle characteristic is checked the sample chips of each production lot.Duty Measurement cct 6, load cct 2, V DD = 5.0V, Ta = 25°C, C L = 15pF , f = 30MHz45–55%Output disable delay time t PLZ Measurement cct 7, load cct 2, V DD = 5.0V, Ta = 25°C, C L = 15pF––100ns Output enable delay timet PZL––100ns5010AH ×, BH × series3V operation/Duty level: CMOSV DD = 2.7 to 3.6V , V SS = 0V , Ta = −10 to +70°C unless otherwise noted.5V operation/Duty level: CMOSV DD = 4.5 to 5.5V , V SS = 0V , Ta = −40 to +85°C unless otherwise noted.Parameter Symbol ConditionRatingUnit min typ max Output rise time t r1Measurement cct 6, load cct 1, C L = 15pF , 0.1V DD to 0.9V DD –816ns Output fall time t f1Measurement cct 6, load cct 1, C L = 15pF , 0.9V DD to 0.1V DD –816ns Output duty cycle 11. The duty cycle characteristic is checked the sample chips of each production lot.Duty Measurement cct 6, load cct 1, V DD = 3.0V, Ta = 25°C, C L = 15pF , f = 16MHz40–60%Output disable delay time t PLZ Measurement cct 7, load cct 1, V DD = 3.0V, Ta = 25°C, C L = 15pF––100ns Output enable delay timet PZL––100nsParameterSymbol ConditionRatingUnitmin typ max Output rise time t r1Measurement cct 6, load cct 1, 0.1V DD to 0.9V DDC L = 15pF –510nst r2C L = 50pF –1326Output fall time t f1Measurement cct 6, load cct 1, 0.9V DD to 0.1V DDC L = 15pF –510nst f2C L = 50pF–1326Output duty cycle 11. The duty cycle characteristic is checked the sample chips of each production lot.Duty Measurement cct 6, load cct 1, V DD = 5.0V, Ta = 25°C, C L = 15pF , f = 30MHz45–55%Output disable delay time t PLZ Measurement cct 7, load cct 1, V DD = 5.0V, Ta = 25°C, C L = 15pF––100ns Output enable delay timet PZL––100ns5010CL × series3V operation/Duty level: CMOSV DD = 2.7 to 3.6V , V SS = 0V , Ta = −20 to +80°C unless otherwise noted.5V operation/Duty level: CMOSV DD = 4.5 to 5.5V , V SS = 0V , Ta = −40 to +85°C unless otherwise noted.ParameterSymbol ConditionRatingUnitmin typ max Output rise time t r1Measurement cct 6, load cct 1, 0.1V DD to 0.9V DDC L = 15pF – 2.0 4.0nst r4C L = 30pF – 3.0 6.0Output fall time t f1Measurement cct 6, load cct 1, 0.9V DD to 0.1V DDC L = 15pF – 2.0 4.0nst f4C L = 30pF– 3.0 6.0Output duty cycle 11. The duty cycle characteristic is checked the sample chips of each production lot.Duty Measurement cct 6, load cct 1, V DD = 3.0V, Ta = 25°C, C L = 15pF , f = 30MHz45–55%Output disable delay time 22. Oscillator stop function is built-in. When INHN goes LOW, normal output stops. When INHN goes HIGH, normal output is not resumed until after the oscillator start-up time has elapsed.t PLZ Measurement cct 7, load cct 1, V DD = 3.0V, Ta = 25°C, C L = 15pF––100ns Output enable delay time 2t PZL––100nsParameterSymbol ConditionRatingUnitmin typ max Output rise time t r1Measurement cct 6, load cct 1, 0.1V DD to 0.9V DDC L = 15pF – 1.5 3.0nst r2C L = 50pF – 4.08.0Output fall time t f1Measurement cct 6, load cct 1, 0.9V DD to 0.1V DDC L = 15pF – 1.5 3.0nst f2C L = 50pF– 4.08.0Output duty cycle 11. The duty cycle characteristic is checked the sample chips of each production lot.Duty Measurement cct 6, load cct 1, V DD = 5.0V, Ta = 25°C, C L = 50pF , f = 30MHz40–60%Output disable delay time 22. Oscillator stop function is built-in. When INHN goes LOW, normal output stops. When INHN goes HIGH, normal output is not resumed until after the oscillator start-up time has elapsed.t PLZ Measurement cct 7, load cct 1, V DD = 5.0V, Ta = 25°C, C L = 15pF––100ns Output enable delay time 2t PZL––100ns5010EA × series3V operation/Duty level: CMOSV DD = 2.7 to 3.6V , V SS = 0V , Ta = −10 to +70°C unless otherwise noted.5V operation/Duty level: CMOSV DD = 4.5 to 5.5V , V SS = 0V , Ta = −40 to +85°C unless otherwise noted.Parameter Symbol ConditionRatingUnit min typ max Output rise time t r1Measurement cct 6, load cct 1, C L = 15pF , 0.1V DD to 0.9V DD –816ns Output fall time t f1Measurement cct 6, load cct 1, C L = 15pF , 0.9V DD to 0.1V DD –816ns Output duty cycle 11. The duty cycle characteristic is checked the sample chips of each production lot.Duty Measurement cct 6, load cct 1, V DD = 3.0V, Ta = 25°C, C L = 15pF , f = 30MHz40–60%Output disable delay time 22. Oscillator stop function is built-in. When INHN goes LOW, normal output stops. When INHN goes HIGH, normal output is not resumed until after the oscillator start-up time has elapsed.t PLZ Measurement cct 7, load cct 1, V DD = 3.0V, Ta = 25°C, C L = 15pF––100ns Output enable delay time 2t PZL––100nsParameterSymbol ConditionRatingUnitmin typ max Output rise time t r1Measurement cct 6, load cct 1, 0.1V DD to 0.9V DDC L = 15pF –510nst r2C L = 50pF –1326Output fall time t f1Measurement cct 6, load cct 1, 0.9V DD to 0.1V DDC L = 15pF –510nst f2C L = 50pF –1326Output duty cycle 11. The duty cycle characteristic is checked the sample chips of each production lot.Duty1Measurement cct 6, load cct 1, V DD = 5.0V, Ta = 25°C, C L = 15pFf = 30MHz 45–55%Duty2 f = 40MHz40–60Output disable delay time 22. Oscillator stop function is built-in. When INHN goes LOW, normal output stops. When INHN goes HIGH, normal output is not resumed until after the oscillator start-up time has elapsed.t PLZ Measurement cct 7, load cct 1, V DD = 5.0V, Ta = 25°C, C L = 15pF––100ns Output enable delay time 2t PZL––100ns。