MAX3070EEPD+中文资料
OP07中文资料_数据手册_参数
绝对大额定值超过工作自由空气温度范围（除非另有说明） （1） MIN MAX单元 V CC + （2） 0 22电源电压 V V CC- （2） -22 0 差 分输入电压 （3） ±30 V V 我 输入电压范围（任一输入） （4） ±22 V 输出短路持续时间 （5）无限 T J操作虚拟结温度 150 C引线温 度距离壳体1.6毫米（1/16英寸），持续10秒 260 C （1）强调绝对大额定值以外列出的可能会导致设备永久性损坏.这些是压力评级只 有在这些或任何其他超出建议的操作条件下的条件下才能操作设备不暗示条件.暴露在绝对大额定条件下可能会影响器件的可靠性. （2） 除非另有说明，所有的电压值都是相对于V CC + 和V CC- 之间的中点 . （3）差分电压相对于IN处于IN + - . （4）输入电压的 大小决不能超过电源电压的大小或15 V，取其小者. （5）输出可能短路到地或任何一个电源. 7.2处理评级参数定义 MIN MAX单元 T STG存储温度范围 -65 150 C人体模型（HBM），根据ANSI / ESDA / JEDEC JS-001，全部 0 1000 （1）静电的 V （ESD） V卸货带电器 件型号（CDM），根据JEDEC规范JESD22- 0 1000 C101，所有引脚 （2） （1） JEDEC文件JEP??155指出，500V HBM允许采用标准 ESD控制过程进行安全制造. （2） JEDEC文件JEP??157指出，250V CDM允许使用标准ESD控制过程进行安全制造. 7.3推荐的操作条件 超过工作自由空气温度范围（除非另有说明） MIN MAX单元 V CC + 3 18电源电压 V CC- -3 -18 V V IC共模输入电压 V CC± =±15 V -13 13 T A.操作自由空气温度 0 70 C 7.4热量信息 温度计 （1） D P单元 RθJA结到环境热阻 97 85 °C / W （1）有关传统和新型散热指 标的更多信息 OP07Y精密运算放大器 SLOS099B - 1983年10月 - 修订于1996年8月五邮政信箱655303 ? 达拉斯，得克萨斯州75265 经营特色，V CC ±= ± 15 V，T A = 25°C参数测试 OP07C OP07D单元参数条件? MIN TYP MAX MIN TYP MAX单元 F = 10HZ 10.5 10.5 √ VN等效输入噪 声电压 F = 100HZ 10.2 10.3内华达州/ √HZ的 F = 1KHZ 9.8 9.8 VN（PP）峰峰值等效输入噪声电压 F = 0.1HZ至10HZ 0.38 0.38 μV F = 10HZ 0.35 0.35 √在等效输入噪声电流 F = 100HZ 0.15 0.15 PA / √HZ的 F = 1KHZ 0.13 0.13 IN（PP）峰峰值等效输入噪声电流 F = 0.1HZ 至10HZ 15 15 PA的 SR摆率 RL≥2KΩ 0.3 0.3 V /微秒 ?除非另有说明，所有特性均在开环条件下以零共模输入电压进行测量. 电气特 性，V CC ±= ± 15 V，T A = 25°C（除非另有说明）参数测试条件? OP07Y单元参数测试条件? MIN TYP MAX单元 VIO输入失调电 压 RS = 50Ω 60 150 μV输入失调电压的长期漂移见注6 0.5 μV/月偏移调整范围 RS = 20KΩ，见图1 ±4毫伏 IIO输入失调电流 0.8 6 NA 的 IIB输入偏置电流 ±2 ±12 NA的 VICR共模输入电压范围 ±13 ±14 V RL≤10KΩ ±12 ±13 VOM峰值输出电压 RL≤2KΩ ±11.5 ±12.8 V RL≤1KΩ ±12 AVD大信号L≤500KΩ 400 AVD大信号差分电压放大 VO = ±10 V， RL = 2KΩ 120 400 B1单位增益带宽 0.4 0.6兆赫 RI输入电阻 7 31中号 Ω CMRR共模输入电阻 VIC =±13 V， RS = 50Ω 94 110 D B KSVS电源电压抑制比（ ΔVCC/ΔVIO） VCC ±=±3 V至±18 V， RS = 50Ω 7 32 μV/ V PD功
MAX2870中文规格书
PARAMETER
CONDITIONS
REFERENCE OSCILLATOR INPUT (REF_IN)
REF_IN Input Frequency Range
REF_IN Input Sensitivity
REF_IN Input Capacitance
REF_IN Input Current
CONDITIONS
CP[3:0] = 1111, RSET = 5.1kI CP[3:0] = 0000, RSET = 5.1kI
With output dividers (1/2/4/8/16/32/64/128)
Open loop Open loop into 2:1 VSWR Fundamental VCO output Fundamental VCO output VCO output divided-by-2 VCO output divided-by-2
定购信息在数据资料的最后给出。 典型应用电路在数据手资料的最后给出。
相关型号以及配合该器件使用的推荐产品，请参见：china.maximintegrated. com/MAX2870.related。
功能框图
MAX2870
REF_IN
CLK DATA
LE
MUX
R COUNTER
X2
SPI AND REGISTERS
Both channels enabled, maximum output power
Total, including RFOUT, both channel (Note 3)
Each output divide-by-2 ICCVCO + ICCRF (Note 3) Low-power sleep mode
MAX708ESA-TG中文资料
6.0 −Leabharlann .3 to (VCC + 0.3)
20 20
248 187
V V mA mA °C/W
Operating Ambient Temperature Storage Temperature Range LatchUp Performance
Positive Negative
TA Tstg ILATCHUP
Features
• Precision Supply−Voltage Monitor
MAX707: 4.63 V Reset Threshold Voltage MAX708: Standard Reset Threshold Voltages (Typical): 4.38 V, 3.08 V, 2.93 V, 2.63 V
ELECTRICAL CHARACTERISTICS (VCC = 1.0 V to 5.5 V, TA = −40°C to +85°C, unless otherwise noted. Typical values are at TA = 25°C, VCC = 3.3 V.)
Characteristics
MAX707, MAX708
VCC
MR
VCC
+
−
RESET GENERATOR
VTH
PFI
+
−
1.25 V
RESET RESET
PFO
GND Figure 1. Representative Block Diagram
MAXIMUM RATINGS (Note 1)
Rating
Symbol
Value
G
MAX3072EASA中文资料
Continuous Power Dissipation (TA = +70°C) 8-Pin SO (derate 5.88mW/°C above +70°C) .................471mW 8-Pin Plastic DIP (derate 9.09mW/°C above +70°C) .....727mW 14-Pin SO (derate 8.33mW/°C above +70°C) ...............667mW 14-Pin Plastic DIP (derate 10.0mW/°C above +70°C) ...800mW
H/F, TXP, RXP)......................................................-0.3V to +6V Driver Input Voltage (DI)...........................................-0.3V to +6V Driver Output Voltage (Z, Y, A, B) .............................-8V to +13V Receiver Input Voltage (A, B)....................................-8V to +13V Receiver Input Voltage
MAX13089EEPD中文资料
General DescriptionThe MAX13080E–MAX13089E +5.0V, ±15kV ESD-protect-ed, RS-485/RS-422 transceivers feature one driver and one receiver. These devices include fail-safe circuitry,guaranteeing a logic-high receiver output when receiver inputs are open or shorted. The receiver outputs a logic-high if all transmitters on a terminated bus are disabled (high impedance). The MAX13080E–MAX13089E include a hot-swap capability to eliminate false transitions on the bus during power-up or hot insertion.The MAX13080E/MAX13081E/MAX13082E feature reduced slew-rate drivers that minimize EMI and reduce reflections caused by improperly terminated cables, allowing error-free data transmission up to 250kbps. The MAX13083E/MAX13084E/MAX13085E also feature slew-rate-limited drivers but allow transmit speeds up to 500kbps. The MAX13086E/MAX13087E/MAX13088E driver slew rates are not limited, making transmit speeds up to 16Mbps possible. The MAX13089E slew rate is pin selectable for 250kbps,500kbps, and 16Mbps.The MAX13082E/MAX13085E/MAX13088E are intended for half-duplex communications, and the MAX13080E/MAX13081E/MAX13083E/MAX13084E/MAX13086E/MAX13087E are intended for full-duplex communica-tions. The MAX13089E is selectable for half-duplex or full-duplex operation. It also features independently programmable receiver and transmitter output phase through separate pins.The MAX13080E–MAX13089E transceivers draw 1.2mA of supply current when unloaded or when fully loaded with the drivers disabled. All devices have a 1/8-unit load receiver input impedance, allowing up to 256transceivers on the bus.The MAX13080E/MAX13083E/MAX13086E/MAX13089E are available in 14-pin PDIP and 14-pin SO packages.The MAX13081E/MAX13082E/MAX13084E/MAX13085E/MAX13087E/MAX13088E are available in 8-pin PDIP and 8-pin SO packages. The devices operate over the com-mercial, extended, and automotive temperature ranges.ApplicationsUtility Meters Lighting Systems Industrial Control Telecom Security Systems Instrumentation ProfibusFeatures♦+5.0V Operation♦Extended ESD Protection for RS-485/RS-422 I/O Pins±15kV Human Body Model ♦True Fail-Safe Receiver While Maintaining EIA/TIA-485 Compatibility ♦Hot-Swap Input Structures on DE and RE ♦Enhanced Slew-Rate Limiting Facilitates Error-Free Data Transmission(MAX13080E–MAX13085E/MAX13089E)♦Low-Current Shutdown Mode (Except MAX13081E/MAX13084E/MAX13087E)♦Pin-Selectable Full-/Half-Duplex Operation (MAX13089E)♦Phase Controls to Correct for Twisted-Pair Reversal (MAX13089E)♦Allow Up to 256 Transceivers on the Bus ♦Available in Industry-Standard 8-Pin SO PackageMAX13080E–MAX13089E+5.0V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers________________________________________________________________Maxim Integrated Products 1Ordering Information19-3590; Rev 1; 4/05For pricing, delivery, and ordering information,please contact Maxim/Dallas Direct!at 1-888-629-4642, or visit Maxim’s website at .Selector Guide, Pin Configurations, and Typical Operating Circuits appear at end of data sheet.Ordering Information continued at end of data sheet.M A X 13080E –M A X 13089E+5.0V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers 2_______________________________________________________________________________________ABSOLUTE MAXIMUM RATINGSDC ELECTRICAL CHARACTERISTICS(V CC = +5.0V ±10%, T A = T MIN to T MAX , unless otherwise noted. Typical values are at V CC = +5.0V and T A = +25°C.) (Note 1)Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.(All Voltages Referenced to GND)Supply Voltage (V CC ).............................................................+6V Control Input Voltage (RE , DE, SLR,H/F , TXP, RXP)......................................................-0.3V to +6V Driver Input Voltage (DI)...........................................-0.3V to +6V Driver Output Voltage (Z, Y, A, B).............................-8V to +13V Receiver Input Voltage (A, B)....................................-8V to +13V Receiver Input VoltageFull Duplex (A, B)..................................................-8V to +13V Receiver Output Voltage (RO)....................-0.3V to (V CC + 0.3V)Driver Output Current.....................................................±250mAContinuous Power Dissipation (T A = +70°C)8-Pin SO (derate 5.88mW/°C above +70°C).................471mW 8-Pin Plastic DIP (derate 9.09mW/°C above +70°C).....727mW 14-Pin SO (derate 8.33mW/°C above +70°C)...............667mW 14-Pin Plastic DIP (derate 10.0mW/°C above +70°C)...800mW Operating Temperature RangesMAX1308_EC_ _.................................................0°C to +75°C MAX1308_EE_ _..............................................-40°C to +85°C MAX1308_EA_ _............................................-40°C to +125°C Junction Temperature......................................................+150°C Storage Temperature Range.............................-65°C to +150°C Lead Temperature (soldering, 10s).................................+300°CMAX13080E–MAX13089E+5.0V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers_______________________________________________________________________________________3DC ELECTRICAL CHARACTERISTICS (continued)(V CC = +5.0V ±10%, T A = T MIN to T MAX , unless otherwise noted. Typical values are at V CC = +5.0V and T A = +25°C.) (Note 1)M A X 13080E –M A X 13089E+5.0V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers 4_______________________________________________________________________________________DRIVER SWITCHING CHARACTERISTICSMAX13080E/MAX13081E/MAX13082E/MAX13089E WITH SRL = UNCONNECTED (250kbps)(V CC = +5.0V ±10%, T A = T MIN to T MAX , unless otherwise noted. Typical values are at V CC = +5.0V and T A = +25°C.)RECEIVER SWITCHING CHARACTERISTICSMAX13080E/MAX13081E/MAX13082E/MAX13089E WITH SRL = UNCONNECTED (250kbps)(V CC = +5.0V ±10%, T A = T MIN to T MAX , unless otherwise noted. Typical values are at V CC = +5.0V and T A = +25°C.)MAX13080E–MAX13089E+5.0V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers_______________________________________________________________________________________5DRIVER SWITCHING CHARACTERISTICSMAX13083E/MAX13084E/MAX13085E/MAX13089E WITH SRL = V CC (500kbps)(V CC = +5.0V ±10%, T A = T MIN to T MAX , unless otherwise noted. Typical values are at V CC = +5.0V and T A = +25°C.)RECEIVER SWITCHING CHARACTERISTICSMAX13083E/MAX13084E/MAX13085E/MAX13089E WITH SRL = V CC (500kbps)(V CC = +5.0V ±10%, T A = T MIN to T MAX , unless otherwise noted. Typical values are at V CC = +5.0V and T A = +25°C.)M A X 13080E –M A X 13089E+5.0V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers 6_______________________________________________________________________________________DRIVER SWITCHING CHARACTERISTICSMAX13086E/MAX13087E/MAX13088E/MAX13089E WITH SRL = GND (16Mbps)(V CC = +5.0V ±10%, T A = T MIN to T MAX , unless otherwise noted. Typical values are at V CC = +5.0V and T A = +25°C.)RECEIVER SWITCHING CHARACTERISTICSMAX13086E/MAX13087E/MAX13088E/MAX13089E WITH SRL = GND (16Mbps)(V CC = +5.0V ±10%, T A = T MIN to T MAX , unless otherwise noted. Typical values are at V CC = +5.0V and T A = +25°C.)Note 2:∆V OD and ∆V OC are the changes in V OD and V OC , respectively, when the DI input changes state.Note 3:The short-circuit output current applies to peak current just prior to foldback current limiting. The short-circuit foldback outputcurrent applies during current limiting to allow a recovery from bus contention.MAX13080E–MAX13089E+5.0V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers_______________________________________________________________________________________70.800.901.501.101.001.201.301.401.60-40-10520-253550958011065125SUPPLY CURRENT vs. TEMPERATURETEMPERATURE (°C)S U P P L Y C U R R E N T (m A )0201040305060021345OUTPUT CURRENTvs. RECEIVER OUTPUT-HIGH VOLTAGEM A X 13080E -89E t o c 02OUTPUT HIGH VOLTAGE (V)O U T P U T C U R R E N T (m A )20104030605070021345OUTPUT CURRENTvs. RECEIVER OUTPUT-LOW VOLTAGEM A X 13080E -89E t o c 03OUTPUT LOW VOLTAGE (V)O U T P U T C U R R E N T (m A )4.04.44.24.84.65.25.05.4RECEIVER OUTPUT-HIGH VOLTAGEvs. TEMPERATURETEMPERATURE (°C)O U T P U T H I G H V O L T A G E (V )-40-10520-2535509580110651250.10.70.30.20.40.50.60.8RECEIVER OUTPUT-LOW VOLTAGEvs. TEMPERATURETEMPERATURE (°C)O U T P U T L O W V O L T A G E (V )-40-10520-25355095801106512502040608010012014016012345DRIVER DIFFERENTIAL OUTPUT CURRENT vs. DIFFERENTIAL OUTPUT VOLTAGEDIFFERENTIAL OUTPUT VOLTAGE (V)D I F FE R E N T I A L O U T P U T C U R R E N T (m A )2.02.82.43.63.24.44.04.8DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs. TEMPERATURED I F FE R E N T I A L O U T P U T V O L T A G E (V )-40-10520-253550958011065125TEMPERATURE (°C)40201008060120140180160200-7-5-4-6-3-2-1012354OUTPUT CURRENT vs. TRANSMITTEROUTPUT-HIGH VOLTAGEOUTPUT HIGH VOLTAGE (V)O U T P U T C U R R E N T (m A )60402080100120140160180200042681012OUTPUT CURRENT vs. TRANSMITTEROUTPUT-LOW VOLTAGEOUTPUT-LOW VOLTAGE (V)O U T P U T C U R R E N T (m A )Typical Operating Characteristics(V CC = +5.0V, T A = +25°C, unless otherwise noted.)M A X 13080E –M A X 13089E+5.0V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers 8_______________________________________________________________________________________21543679810SHUTDOWN CURRENT vs. TEMPERATUREM A X 13080E -89E t o c 10S H U T D O W N C U R R E N T (µA )-40-10520-253550958011065125TEMPERATURE (°C)600800700100090011001200DRIVER PROPAGATION DELAY vs. TEMPERATURE (250kbps)D R I VE R P R O P A G A T I O N D E L A Y (n s )-40-10520-253550958011065125TEMPERATURE (°C)300400350500450550600DRIVER PROPAGATION DELAY vs. TEMPERATURE (500kbps)D R I VE R P R O P A G A T I O N D E L A Y (n s )-40-10520-253550958011065125TEMPERATURE (°C)1070302040506080DRIVER PROPAGATION DELAY vs. TEMPERATURE (16Mbps)D R I VE R P R O P A G A T I O N D E L A Y (n s )-40-10520-253550958011065125TEMPERATURE (°C)40201008060120140160180RECEIVER PROPAGATION DELAYvs. TEMPERATURE (250kpbs AND 500kbps)R E C E I V E R P R O P A G A T I O N D E L A Y (n s )-40-10520-253550958011065125TEMPERATURE (°C)40201008060120140160180RECEIVER PROPAGATION DELAYvs. TEMPERATURE (16Mbps)R EC E I V E R P R O P A G AT I O N D E L A Y (n s )-40-10520-253550958011065125TEMPERATURE (°C)2µs/div DRIVER PROPAGATION DELAY (250kbps)DI 2V/divV Y - V Z 5V/divR L = 100Ω200ns/divRECEIVER PROPAGATION DELAY(250kbps AND 500kbps)V A - V B 5V/divRO 2V/divTypical Operating Characteristics (continued)(V CC = +5.0V, T A = +25°C, unless otherwise noted.)MAX13080E–MAX13089E+5.0V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers_______________________________________________________________________________________9Test Circuits and Waveforms400ns/divDRIVER PROPAGATION DELAY (500kbps)DI 2V/divR L = 100ΩV Y - V Z 5V/div10ns/div DRIVER PROPAGATION DELAY (16Mbps)DI 2V/divR L = 100ΩV Y 2V/divV Z 2V/div40ns/divRECEIVER PROPAGATION DELAY (16Mbps)V B 2V/divR L = 100ΩRO 2V/divV A 2V/divTypical Operating Characteristics (continued)(V CC = +5.0V, T A = +25°C, unless otherwise noted.)Figure 2. Driver Timing Test CircuitM A X 13080E –M A X 13089E+5.0V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers 10______________________________________________________________________________________Test Circuits and Waveforms (continued)Figure 4. Driver Enable and Disable Times (t DHZ , t DZH , t DZH(SHDN))DZL DLZ DLZ(SHDN)MAX13080E–MAX13089E+5.0V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 TransceiversTest Circuits and Waveforms (continued)Figure 6. Receiver Propagation Delay Test CircuitM A X 13080E –M A X 13089E+5.0V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 TransceiversMAX13080E–MAX13089E+5.0V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 TransceiversMAX13080E/MAX13083E/MAX13086EMAX13081E/MAX13084E/MAX13086E/MAX13087EFunction TablesM A X 13080E –M A X 13089E+5.0V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers MAX13082E/MAX13085E/MAX13088EFunction Tables (continued)MAX13089EDetailed Description The MAX13080E–MAX13089E high-speed transceivers for RS-485/RS-422 communication contain one driver and one receiver. These devices feature fail-safe circuit-ry, which guarantees a logic-high receiver output when the receiver inputs are open or shorted, or when they are connected to a terminated transmission line with all dri-vers disabled (see the Fail-Safe section). The MAX13080E/MAX13082E/MAX13083E/MAX13085E/ MAX13086E/MAX13088E/MAX13089E also feature a hot-swap capability allowing line insertion without erroneous data transfer (see the Hot Swap Capability section). The MAX13080E/MAX13081E/MAX13082E feature reduced slew-rate drivers that minimize EMI and reduce reflec-tions caused by improperly terminated cables, allowing error-free data transmission up to 250kbps. The MAX13083E/MAX13084E/MAX13085E also offer slew-rate limits allowing transmit speeds up to 500kbps. The MAX13086E/MAX13087E/MAX13088Es’ driver slew rates are not limited, making transmit speeds up to 16Mbps possible. The MAX13089E’s slew rate is selectable between 250kbps, 500kbps, and 16Mbps by driving a selector pin with a three-state driver.The MAX13082E/MAX13085E/MAX13088E are half-duplex transceivers, while the MAX13080E/MAX13081E/ MAX13083E/MAX13084E/MAX13086E/MAX13087E are full-duplex transceivers. The MAX13089E is selectable between half- and full-duplex communication by driving a selector pin (H/F) high or low, respectively.All devices operate from a single +5.0V supply. Drivers are output short-circuit current limited. Thermal-shutdown circuitry protects drivers against excessive power dissi-pation. When activated, the thermal-shutdown circuitry places the driver outputs into a high-impedance state.Receiver Input Filtering The receivers of the MAX13080E–MAX13085E, and the MAX13089E when operating in 250kbps or 500kbps mode, incorporate input filtering in addition to input hysteresis. This filtering enhances noise immunity with differential signals that have very slow rise and fall times. Receiver propagation delay increases by 25% due to this filtering.Fail-Safe The MAX13080E family guarantees a logic-high receiver output when the receiver inputs are shorted or open, or when they are connected to a terminated transmission line with all drivers disabled. This is done by setting the receiver input threshold between -50mV and -200mV. If the differential receiver input voltage (A - B) is greater than or equal to -50mV, RO is logic-high. If (A - B) is less than or equal to -200mV, RO is logic-low. In the case of a terminated bus with all transmitters disabled, the receiv-er’s differential input voltage is pulled to 0V by the termi-nation. With the receiver thresholds of the MAX13080E family, this results in a logic-high with a 50mV minimumnoise margin. Unlike previous fail-safe devices, the-50mV to -200mV threshold complies with the ±200mVEIA/TIA-485 standard.Hot-Swap Capability (Except MAX13081E/MAX13084E/MAX13087E)Hot-Swap InputsWhen circuit boards are inserted into a hot or powered backplane, differential disturbances to the data buscan lead to data errors. Upon initial circuit board inser-tion, the data communication processor undergoes itsown power-up sequence. During this period, the processor’s logic-output drivers are high impedanceand are unable to drive the DE and RE inputs of these devices to a defined logic level. Leakage currents up to±10µA from the high-impedance state of the proces-sor’s logic drivers could cause standard CMOS enableinputs of a transceiver to drift to an incorrect logic level. Additionally, parasitic circuit board capacitance couldcause coupling of V CC or GND to the enable inputs. Without the hot-swap capability, these factors could improperly enable the transceiver’s driver or receiver.When V CC rises, an internal pulldown circuit holds DElow and RE high. After the initial power-up sequence,the pulldown circuit becomes transparent, resetting thehot-swap tolerable input.Hot-Swap Input CircuitryThe enable inputs feature hot-swap capability. At theinput there are two NMOS devices, M1 and M2 (Figure 9). When V CC ramps from zero, an internal 7µstimer turns on M2 and sets the SR latch, which alsoturns on M1. Transistors M2, a 1.5mA current sink, andM1, a 500µA current sink, pull DE to GND through a5kΩresistor. M2 is designed to pull DE to the disabledstate against an external parasitic capacitance up to100pF that can drive DE high. After 7µs, the timer deactivates M2 while M1 remains on, holding DE low against three-state leakages that can drive DE high. M1 remains on until an external source overcomes the required input current. At this time, the SR latch resetsand M1 turns off. When M1 turns off, DE reverts to a standard, high-impedance CMOS input. Whenever V CCdrops below 1V, the hot-swap input is reset.For RE there is a complementary circuit employing two PMOS devices pulling RE to V CC. MAX13080E–MAX13089E+5.0V, ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 TransceiversM A X 13080E –M A X 13089EMAX13089E ProgrammingThe MAX13089E has several programmable operating modes. Transmitter rise and fall times are programma-ble, resulting in maximum data rates of 250kbps,500kbps, and 16Mbps. To select the desired data rate,drive SRL to one of three possible states by using a three-state driver: V CC , GND, or unconnected. F or 250kbps operation, set the three-state device in high-impedance mode or leave SRL unconnected. F or 500kbps operation, drive SRL high or connect it to V CC .F or 16Mbps operation, drive SRL low or connect it to GND. SRL can be changed during operation without interrupting data communications.Occasionally, twisted-pair lines are connected backward from normal orientation. The MAX13089E has two pins that invert the phase of the driver and the receiver to cor-rect this problem. F or normal operation, drive TXP and RXP low, connect them to ground, or leave them uncon-nected (internal pulldown). To invert the driver phase,drive TXP high or connect it to V CC . To invert the receiver phase, drive RXP high or connect it to V CC . Note that the receiver threshold is positive when RXP is high.The MAX13089E can operate in full- or half-duplex mode. Drive H/F low, leave it unconnected (internal pulldown), or connect it to GND for full-duplex opera-tion. Drive H/F high for half-duplex operation. In full-duplex mode, the pin configuration of the driver and receiver is the same as that of a MAX13080E. In half-duplex mode, the receiver inputs are internally connect-ed to the driver outputs through a resistor-divider. This effectively changes the function of the device’s outputs.Y becomes the noninverting driver output and receiver input, Z becomes the inverting driver output and receiver input. In half-duplex mode, A and B are still connected to ground through an internal resistor-divider but they are not internally connected to the receiver.±15kV ESD ProtectionAs with all Maxim devices, ESD-protection structures are incorporated on all pins to protect against electro-static discharges encountered during handling and assembly. The driver outputs and receiver inputs of the MAX13080E family of devices have extra protection against static electricity. Maxim’s engineers have devel-oped state-of-the-art structures to protect these pins against ESD of ±15kV without damage. The ESD struc-tures withstand high ESD in all states: normal operation,shutdown, and powered down. After an ESD event, the MAX13080E–MAX13089E keep working without latchup or damage.ESD protection can be tested in various ways. The transmitter outputs and receiver inputs of the MAX13080E–MAX13089E are characterized for protec-tion to the following limits:•±15kV using the Human Body Model•±6kV using the Contact Discharge method specified in IEC 61000-4-2ESD Test ConditionsESD performance depends on a variety of conditions.Contact Maxim for a reliability report that documents test setup, test methodology, and test results.Human Body ModelFigure 10a shows the Human Body Model, and Figure 10b shows the current waveform it generates when dis-charged into a low impedance. This model consists of a 100pF capacitor charged to the ESD voltage of interest,which is then discharged into the test device through a 1.5k Ωresistor.IEC 61000-4-2The IEC 61000-4-2 standard covers ESD testing and performance of finished equipment. However, it does not specifically refer to integrated circuits. The MAX13080E family of devices helps you design equip-ment to meet IEC 61000-4-2, without the need for addi-tional ESD-protection components.+5.0V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 TransceiversThe major difference between tests done using the Human Body Model and IEC 61000-4-2 is higher peak current in IEC 61000-4-2 because series resistance is lower in the IEC 61000-4-2 model. Hence, the ESD with-stand voltage measured to IEC 61000-4-2 is generally lower than that measured using the Human Body Model. Figure 10c shows the IEC 61000-4-2 model, and Figure 10d shows the current waveform for IEC 61000-4-2 ESD Contact Discharge test.Machine Model The machine model for ESD tests all pins using a 200pF storage capacitor and zero discharge resis-tance. The objective is to emulate the stress caused when I/O pins are contacted by handling equipment during test and assembly. Of course, all pins require this protection, not just RS-485 inputs and outputs.Applications Information256 Transceivers on the BusThe standard RS-485 receiver input impedance is 12kΩ(1-unit load), and the standard driver can drive up to 32-unit loads. The MAX13080E family of transceivers has a1/8-unit load receiver input impedance (96kΩ), allowingup to 256 transceivers to be connected in parallel on one communication line. Any combination of these devices,as well as other RS-485 transceivers with a total of 32-unit loads or fewer, can be connected to the line.Reduced EMI and ReflectionsThe MAX13080E/MAX13081E/MAX13082E feature reduced slew-rate drivers that minimize EMI and reduce reflections caused by improperly terminated cables, allowing error-free data transmission up to250kbps. The MAX13083E/MAX13084E/MAX13085Eoffer higher driver output slew-rate limits, allowing transmit speeds up to 500kbps. The MAX13089E withSRL = V CC or unconnected are slew-rate limited. WithSRL unconnected, the MAX13089E error-free data transmission is up to 250kbps. With SRL connected toV CC,the data transmit speeds up to 500kbps. MAX13080E–MAX13089E+5.0V, ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 TransceiversM A X 13080E –M A X 13089ELow-Power Shutdown Mode (Except MAX13081E/MAX13084E/MAX13087E)Low-power shutdown mode is initiated by bringing both RE high and DE low. In shutdown, the devices typically draw only 2.8µA of supply current.RE and DE can be driven simultaneously; the devices are guaranteed not to enter shutdown if RE is high and DE is low for less than 50ns. If the inputs are in this state for at least 700ns, the devices are guaranteed to enter shutdown.Enable times t ZH and t ZL (see the Switching Characteristics section) assume the devices were not in a low-power shutdown state. Enable times t ZH(SHDN)and t ZL(SHDN)assume the devices were in shutdown state. It takes drivers and receivers longer to become enabled from low-power shutdown mode (t ZH(SHDN), t ZL(SHDN))than from driver/receiver-disable mode (t ZH , t ZL ).Driver Output ProtectionTwo mechanisms prevent excessive output current and power dissipation caused by faults or by bus contention.The first, a foldback current limit on the output stage,provides immediate protection against short circuits over the whole common-mode voltage range (see the Typical Operating Characteristics ). The second, a thermal-shut-down circuit, forces the driver outputs into a high-imped-ance state if the die temperature exceeds +175°C (typ).Line LengthThe RS-485/RS-422 standard covers line lengths up to 4000ft. F or line lengths greater than 4000ft, use the repeater application shown in Figure 11.Typical ApplicationsThe MAX13082E/MAX13085E/MAX13088E/MAX13089E transceivers are designed for bidirectional data commu-nications on multipoint bus transmission lines. F igures 12 and 13 show typical network applications circuits. To minimize reflections, terminate the line at both ends in its characteristic impedance, and keep stub lengths off the main line as short as possible. The slew-rate-lim-ited MAX13082E/MAX13085E and the two modes of the MAX13089E are more tolerant of imperfect termination.Chip InformationTRANSISTOR COUNT: 1228PROCESS: BiCMOS+5.0V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 TransceiversFigure 11. Line Repeater for MAX13080E/MAX13081E/MAX13083E/MAX13084E/MAX13086E/MAX13087E/MAX13089E in Full-Duplex Mode+5.0V, ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 TransceiversMAX13080E–MAX13089EM A X 13080E –M A X 13089E+5.0V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 TransceiversPin Configurations and Typical Operating CircuitsMAX13080E–MAX13089E+5.0V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers______________________________________________________________________________________21Pin Configurations and Typical Operating Circuits (continued)M A X 13080E –M A X 13089E+5.0V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers 22______________________________________________________________________________________Ordering Information (continued)MAX13080E–MAX13089E+5.0V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers______________________________________________________________________________________23Package Information (continued)(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,go to /packages .)。
MAX706中文资料_数据手册_参数
UNREGULATED DC
MAX667 +5V DC LINEAR
REGULATOR
PUSHBUTTON SWITCH
VCC
RESMR
MAX706 MAX813L
PFO
µP
VCC RESET I/O LINE NMI INTERRUPT
___________________________Features
o Available in Tiny µMAX Package
o Guaranteed RESET Valid at VCC = 1V o Precision Supply-Voltage Monitor
4.65V in MAX705/MAX707/MAX813L 4.40V in MAX706/MAX708
Output Current (all outputs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20mA Continuous Power Dissipation (TA = +70°C)
Plastic DIP (derate 9.09mW/°C above +70°C) . . . . . . . 727mW SO (derate 5.88mW/°C above +70°C) . . . . . . . . . . . . . . . 471mW µMAX (derate 4.10mW/°C above +70°C) . . . . . . . . . . . . 330mW
3) A 1.25V threshold detector for power-fail warning, low-battery detection, or for monitoring a power supply other than +5V.
3070操作指南
Proprietary and ConfidentialChecked by: 27 Feb 2002 Tatu Qvist Approved by:27 Feb 2002Marko GrundströmVersion:2.0.0Revision:NET/PO B 6W 068312 AEAGILENT3070 ICT GUIDEHISTORYDate Version Author Change Note No./Notes24 Aug 99 0.0.1 MG First Draft8 Jan 00 0.0.2 MG Second Draft18 Feb 00 0.1.0 MG Reviewed by production personneland APK22 Feb 01 1.0.0 MG Approved version19 Dec 01 1.0.1 JM First Draft03 Jan 02 2.0.0 JM Approved versionCONTENTS1. HARDWARE (8)1.1. Agilent3070 In-Circuit tester (8)1.2. J401-03 PCB handler (8)1.3. Bed of nails (9)1.3.1. The JOT bed of nails (9)1.3.2. Vacuum bed of nails (11)1.4. ICT cell (12)SYSTEM (13)2. TESTING2.1. Automated testing system (13)2.2. Manual testing system (13)3. TESTING WITH THE AUTOMATED SYSTEM (14)3.1. J401-03 user interface (16)3.1.1. Menu interface (19)3.1.2. Panel board testing (20)3.1.3. The most common failures (21)3.1.4. Incorrect board (21)4. TESTING WITH THE MANUAL TEST SYSTEM (22)4.1. Manual user interface (22)4.1.1. Menu interface (23)4.1.2. Panel board testing (25)4.1.3. The most common failures (25)4.1.4. Incorrect board (25)4.1.5. Leaking bed of nails (26)5. TESTPROGRAM (26)5.1. Pins test (26)5.2. Preshorts test (26)5.3. Shorts test (26)5.4. Analog unpowered tests (27)5.5. Testjet tests (27)5.6. Power Supplies test (27)5.7. Boundary Scan tests (28)5.8. Digital in-circuit and digital functional tests (28)5.9. Analog functional and mixed tests (28)5.10. Other tests (28)TESTED BOARD (30)THE6. TROUBLESHOOTING6.1. Measurement (30)6.2. Board Graphics or GWS programs use (30)6.2.1. Board Graphics program (30)6.2.2. GWS program (32)6.3. Preshort failure (32)6.4. Shorts/Opens failure (33)6.5. Analog incircuit failure (35)6.5.1. Resistors (35)6.5.2. Capacitors (36)6.5.3. Coils (36)6.5.4. Transistors (37)6.5.5. Diodes (37)6.5.6. FETs (38)6.6. Testjet fault (38)6.7. Power Supplies fault (39)6.8. Boundary Scan fault (39)6.9. Digital in-circuit fault (40)6.10. Analog functional and mixed fault (40)6.11. Pins fault (41)7. BED OF NAILS MAINTENANCE (41)7.1. Changing probes (41)7.2. Changing the probe with Probefinder and Fixture Consultant (43)7.3. Changing the probe with Probefinder and Fixture Graphics (47)7.4. Cleaning the probes (50)7.5. Checking the tooling pins (50)MAINTENANCE (50)8. TESTER8.1. Autoadjust (51)GLOSSARYAD Analog to DigitalTechnologies Agilent AgilentCB CimbridgeDA Digital to AnalogFET Field Effect Transistor GWS Graphical Work StationCircuitIC IntegratedICT In Circuit TestJOT JOT AutomationIntroductionThe purpose of this document is to clarify the ICT testing concept for production personnel. The document is intended for both experienced and inexperienced ICT operators.ICT testing is a part of the PCB testing carried out in the base station plant production lines of Nokia Networks, Product Operations, located in Oulu. Some of the PCBs produced are tested with the Agilent Technologies 3070 series ICT tester. The boards are tested with a bed of nails. The test board is either pressed against the bed of nails or kept affixed by a vacuum. On an automated line, the board is transferred over the bed of nails and it is pressed against the bed of nails by an automatic PCB handler (J401-03). On a manual line, the board is manually placed on the bed of nails and kept on the bed of nails by a vacuum.1. HARDWARE1.1. Agilent3070 In-Circuit testerThe testing device of the ICT testing system is an Agilent Technologies 3070 series tester, which can carry out both analogue and digital measurements directly from the components placed on the board via test points. Figure 1 shows this kind oftester.Figure 1: Agilent3070 tester.1.2. J401-03 PCB handlerThe JOT Automation J401-03 PCB handler is used for moving the PCBs to andfrom the tester. This device transports the board to the correct position on the bed of nails and presses the board being tested against the test probes. Figure 2 shows this kind of device.Figure 2: J401-03 PCB handler and Agilent3070 tester.1.3. Bed of nailsThe most important part of ICT testing, and also the part most subject todisturbance is the measuring instrument, that is the bed of nails. The bed of nails consists of upper and lower sections. Occasionally, the upper section of the bed of nails is merely a tool that presses the board being tested against the needles in the lower section. In some cases, the upper section also includes measuring probes.1.3.1. The JOT bed of nailsThe bed of nails used in the J401-03 PCB handler consists of a separate lowersection (Figure 3) and an upper section (Figure 4). When the bed of nails is not in use, it can be stored by placing the upper section over the lower section using aseparate transportation support.1.3.1.1 Bed of nails settingsThe switches in the upper section of the bed of nails must be set in accordance with the orientation of the boards and the board handler.LTR = left to rightRTL = right to leftFigure 3: The lower section of the JOT bed of nails.Figure 4 :The upper section of the JOT bed of nails.Figure 5: JOT bed of nails with a transportation support.1.3.2. Vacuum bed of nailsThe vacuum bed of nails consists of upper and lower sections, which are joined together by a hinge at the back of the bed of nails. Figure 6 shows the bed of nails with the cover closed and Figure 7 shows it with the cover open.Figure 6: vacuum bed of nails with cover closed.Figure 7: vacuum bed of nails with cover open.1.4. ICT cellIn addition to the tester, PCB handler and bed of nails, various releasers, buffers and conveyors are used in PCB handling. Figure 8 shows all this equipment, which together forms an ICT cell.Figure 8: ICT cell.2. TESTINGSYSTEM2.1. Automated testing systemThe automated testing system is a combination of the J401-03 PCB handler and the Agilent3070 tester (Figure 2). The bed of nails is manually switched. The faultsfound in the boards are printed out on paper and sent to the GWS system.2.2. Manual testing systemThe manual testing system refers to the combination of the Agilent3070 tester(Figure 1), vacuum pump, vacuum container and vacuum control unit (Figure 9).The bed of nails is manually switched. The faults found in the boards are printedout on paper and sent to the GWS system.Figure 9 Vacuum pump, vacuum container and vacuum control unit.3. TESTING WITH THE AUTOMATED SYSTEMBefore starting testing, it is advisable to check that the tester and the J401-03 have their power switched on. In the J401-03, the power switch (Figure 10) is located on the back wall of the left leg.The power switch of the tester is located behind the tester, on the left lower edge, when looked at from behind. The switch is a small tumbler switch (Figure 11). In later tumbler switch models, there is also a LED that indicates the power beside the switch. In the older model, the texts ‘OFF’ and ‘ON’ on the switch indicate thepower.Figure 10: J401-03 power switch.Figure 11: ICT tester power switch.3.1. J401-03 user interfaceYou can access the operating mode of the tester by entering ‘operator’ in the login window of the welcome dialog (Figure 12) and by pressing Enter. This useraccount does not have a password and thus pressing Enter is enough.Figure 12 :Logging in to the tester.After this, the tester enters the operating mode and switches to test mode.The following message appears on the screen (Figure 13).Figure 13: Starting the operating environment.In addition, the upper part of the opened user window shows the message ”booting testhead”. It takes about two minutes to start the tester.The tester is automatically started in the J401-03 user interface. The main menu of the user interface appears in the lower part of the opening Basic window. The main menu has the following options (shortcut key):Runtestplan (F1)Fixturelock (F2)Fixtureunlock (F3)Poweron (F4)Fixture change (F5)(F8)QuitRuntestplan (F1)Starts the testing when the bed of nails has been installed. The Runtestplan option automatically loads and starts the testing program of the bed of nails concerned. After the test program starts, the options Start, Yes, No, Faon, Faoff, Stop and Exit appear on the task bar (Figure 14). Some test programs may also include additional options such as different board options. The user responds to the options concerned before starting the test program.Figure 14: The option bar of the test program.Start restarts the testing if the test has first been stopped by the Stop option. The boards inside the tester have to be removed before starting.The Yes button is used to confirm the ‘Press Yes to continue’ message. Before confirmation, you must check that there are no boards in the tester.The No, Faon and Faoff options are not used.The Stop option switches off the test program. You can use this function for stopping the test program instead of the Emergency – stop switch.The Exit option leads back to the main menu of the J401-03 user interface. Fixturelock (F2)Locks the lower section of the bed of nails to the tester.Fixtureunlock (F3)Unlocks a locked down lower section of the bed of nails.Poweron (F4)Switches on the tester. The upper part of the user window shows themessage ”booting testhead”.Fixture change (F5):The bed of nails change function. When this option is selected, the menu on the lower part of the Basic window changes as follows:YES (F2)NO (F3)Quit (F7)Select Quit (F7), to return to the main menu.The sequence for changing the bed of nails:1. Set the PCB handler switch to position 1 and remove the boards from thehandler. Press YES(F2) when ready.The PCB handler is reset, opens the lock in the upper section of the bed of nails, opens the tracks, presses the front track down and opens the lock in the lower section of the bed of nails.2. Is the lock in the lower section of the bed of nails open? If it is, press YES(F2),if not press NO(F3). NOTE! If you answer YES, and the bed of nails is locked to the tester, the bed of nails, tester or PCB handler may be damaged.If you answer YES(F2), the PCB handler lifts the lower section of the bed of nails.3. Remove the old bed of nails, set the new bed of nails on the handler and pressYES(F2).The PCB handler locks the upper section of the bed of nails and lowers the lower section of the bed of nails.4. Have you placed the lower section of the bed of nails against the tester? If so, press YES(F2); if not, press NO(F3).The lower section of the bed of nails is locked to the tester, the front track is lifted up and the tracks are closed. The J401-03 user interface opens.Quit (F8)Switches off the operating mode of the tester. The start window of the tester appears on the screen (Figure 13)3.1.1. Menu interfaceWhen the tester starts, a Windows-style user interface menu appears on the lower part of the screen. The toolbar of the user interface has a START button and a selection for testing panels of boards. By clicking START with the mouse, a menu appears through which you can start various applications that assist testing.Figure 15: The menu user interface toolbar.When you click the START button, a menu opens containing the following additional options and applications.Clock : Clock application. This application shows a clock on the screen, digital or analogue, depending on your choice. You can move the clock on the screen by pressing the Alt key and by dragging the frame of the clock with the left mouse button.PostIt : Messaging application. This application can be used for creating messages on screen for the following shift, among other possible recipients. The desired message is typed into the Message field and by pressing the Postit button, you can view it on the tester screen. The message on the screen can be removed by the Clear button in the message. You can modify the appearance of the message in the Font and Colour menus.Probe-Finder : An application that prints out the test probes related to the given test. There is more information on using the application in the Chapter ‘Changing the probe by using the probefinder and fixture consultant’.Fixture-Cons : Starts the Fixture Consultant application, with which you can search for the desired test probes. There is more information on using the application in the Chapter ‘Changing the probe by using the probefinder and fixture consultant’.Fixture Graphics : A slightly more easy-to-use version of the Fixture Consultant. There is more information on using the application in the Chapter ‘Changing the probe by using the probefinder and fixture consultant’.Board Graphics : Starts the desired board graphics through an option list in the Basic window. The same application automatically starts with most of the test applications.I-Mandis : Starts the telnet program through which you can connect to the QC2 fault report database. The user interface works in the same way as the report user interface of the PC.Help Submenu: You can find the ICT-Help and Man-Page text files in this menu.ICT-Help opens the installed ICT-Help file in the Acrobat program, where you can search for tips in problem situations. This document is found via this button.Man-Page opens the description for a Unix command in its own window. On this page, you enter a command (for example, ll) and the application showsthe Unix manual page concerned on the screen.Utilities Submenu: The menu consists of various applications.Calculator: Calculator applicationCalendar : Calendar applicationReport : Report application. You can make a report on the tested boards on the tester printer. You enter the name of the operator in the application,choose the desired board, the number of boards tested, the number of boards passed, the number of boards failed and the number of other boards. Thesupplied information is accepted with the Accept button and you can print it with the Print button. You can clear the information with the Clear button.Phone Search : With this application, you can search for phone numbers on the Nokia intranet. You enter the name of the person to be searched for in the application, and the application prints out the information found.3.1.2. Panel board testingOn a panel of boards, there is more than one card on the same panel. In some cases it is not necessary to test all the boards on the panel. Scrapped boards, which means that one of the four boards on the panel is faulty, are an example. In this case, the test boards can be selected either by the test program which asks at the beginning of the testing which of the boards on the panel you want to test, or you can switch on the graphical option mode by pressing ‘on’ on the lower part of the tester user interface (Figure 16). You can change the option mode back to testing all boards on the panel by selecting ‘off’ even in the middle of running the program.Figure 16: The graphical option mode buttons for the panel of boards.If the option is selected, the test program shows the following text on the screen (Note: Check the boards to be tested before the board goes to the press):"All boards on the panel are selected for testing. The current board is #1. Use softkeys to traverse the board and toggle their testability.Hit the "Done" softkey (f8) when you have finished.If all boards on the panel should be tested, you can hit "Done" now."In other words, you can select the desired boards for testing with the function keys f2 (next board), f3 (previous board) and f4 (Select/do not select the board). By pressing function key f8, the testing for the selected boards starts. The selected boards are highlighted by guide lines on the Board Graphics screen. You can also click the key functions at the bottom of the Basic window with the mouse. Alternatively, you can select the boards to be tested directly by clicking with the mouse in the Board Graphics window.3.1.3. The most common failuresSometimes, failures may occur in the interaction between the J401-03 and the tester. For example, a board enters the tester in an incorrect orientation or an incorrect board enters the tester, and thus, the board and the bed of nails do not match. Various security sensors are used to prevent possible damage to the board and bed of nails in these kinds of situations. Although several different failure conditions may occur, the working principle is practically the same in all kinds of failures. The incorrect board case is presented as an example of a failure below.3.1.4. Incorrect boardIf an incorrect board enters the tester, and you notice it before the board is pressed against the bed of nails, you can press the Emergency-Stop button on the side of the J401-03 To continue testing after such a stop, you have to start the tester all over again, which means that you exit the test mode in the usual way and start the tester according to Section 2.2. Alternatively, you can use the Stop function for stopping the test program instead of the Emergency-Stop switch.In ICT testers, bar code readers are used to prevent an incorrect board from entering the bed of nails In other words, the fixed part of the board's panel label tells the test program that the board entering the tester is of the correct type. In this way, it is also possible to prevent the board from entering the tester in an incorrect orientation.However, if the incorrect board remains unnoticed, the J401-03 automatic stopping mechanism behaves as follows:1. If the bar code cannot be read, the tester provides a failure printout ‘no read’ tothe board and takes the board to the failed buffer.2. If the bar code can be read, but it does not correspond with the bar code definedin the test plan, the test program stops and the program provides a failuremessage which contains the bar code read and the expected bar code. Thefailure message prompts you to either change the bed of nails or press Enter to continue testing with the same bed of nails. The board is taken to the failedbuffer.4. TESTING WITH THE MANUAL TEST SYSTEMBefore starting testing, it is advisable to check that the tester and vacuum pumphave their power switched on. The power switch (Figure 17) of the vacuum pump is located in a separate switch case placed on top of the tester.Figure 17: The power switch of the vacuum pump.The power switch of the tester is located behind the tester, on the left lower edge, when looked at from behind. The switch is a small tumbler switch (Figure 11). In later tumbler switch models, there is also a LED that indicates the power beside the switch. In the older model, the texts ‘OFF’ and ‘ON’ on the switch indicate thepower.4.1. Manual user interfaceYou can access the operating mode of the tester by entering ‘operator’ in the login window of the welcome dialog (Figure 12) and by pressing Enter. This useraccount does not have a password and thus pressing Enter is enough.After this, the tester enters the operating mode and switches to test mode. Themessage shown in Figure 13 appears on the screen.In addition, the upper part of the opened user window shows the message ”booting testhead”. It takes about two minutes to start the tester.The tester is automatically started in the testing user interface. The main menu of the user interface appears in the lower part of the opening Basic window. The main menu has the following options (shortcut key):Runtestplan (F1)Fixturelock (F2)Fixtureunlock (F3)Poweron (F4)(F8)QuitRuntestplan (F1)Starts the testing when the bed of nails has been installed. The Runtestplan option automatically loads and starts the testing program of the bed of nails concerned. After the test program starts, the options Start, Yes, No, Faon, Faoff, Stop and Exit appear on the task bar (Figure 14). Some test programs may also include additional options such as different board options. The user responds to these options before starting the test program.Start restarts the testing if the test has first been stopped by the Stop option. The boards inside the tester have to be removed before starting.The Yes button is used to confirm the ‘Press Yes to continue’ message. Before confirmation, you must check that there are no boards in the tester.The No, Faon and Faoff options are not used.The Stop option switches off the test program. You can use this function for stopping the test program instead of the Emergency – stop switch.The Exit option leads back to the main menu of the J401-03 user interface. Fixturelock (F2)Locks the lower section of the bed of nails to the tester.Fixtureunlock (F3)Unlocks the locked down lower section of the bed of nails.Poweron (F4)Switches on the tester. The upper part of the user window shows themessage ”booting testhead”.Quit (F8)Switches off the operating mode of the tester. The start window of the tester appears on the screen (Figure 13)4.1.1. Menu interfaceWhen the tester starts, a Windows-style user interface menu appears on the lower part of the screen. The toolbar of the user interface has a START button and a selection for testing panels of boards. By clicking START with the mouse, a menu appears through which you can start various applications that assist testing. When you click the START button, a menu opens containing the following additional options and applications.Clock : Clock application. This application shows a clock on the screen, digital or analogue, depending on your choice. You can move the clock on the screen by pressing the Alt key and by dragging the frame of the clock with the left mouse button.PostIt : Messaging application. This application can be used for creating messages on the screen for the following shift, among other possible recipients. The desired message is typed into the Message field and by pressing the Postit button, you can view it on the tester screen. The message on the screen can be removed by the Clear button in the message. You can modify the appearance of the message in the Font and Colour menus.Probe-Finder : An application that prints out the test probes related to the test. There is more information on using the application in the Chapter ‘Changing the probe by using the probefinder and fixture consultant’.Fixture-Cons : Starts the Fixture Consultant application, with which you can search for the desired test probes. There is more information on using the application in the Chapter ‘Changing the probe by using the probefinder and fixture consultant’.Fixture Graphics : A slightly more easy-to-use version of the Fixture Consultant. There is more information on using the application in the Chapter ‘Changing the probe by using the probefinder and fixture consultant’.Board Graphics : Starts the desired board graphics through an option list in the Basic window. The same application automatically starts with most of the test programs.I-Mandis : Starts the telnet program through which you can connect to the QC2 fault report database. The user interface works in the same way as the report user interface of the PC.Help Submenu: You can find the ICT-Help and Man-Page text files in this menu.ICT-Help opens the installed ICT-Help file in the Acrobat program, where you can search for tips in problem situations. This document is found via this button.Man-Page opens the description for a Unix command in its own window. On this page, you enter a command (for example, ll) and the application showsthe Unix manual page concerned on the screen.Utilities Submenu: The menu consists of various applications.Calculator: Calculator applicationCalendar : Calendar applicationReport : Report application. You can make a report on the boards tested on the tester printer. You enter the name of the operator in the application,choose the desired board, the number of boards tested, the number of boards passed, the number of boards failed and the number of other boards. Thesupplied information is accepted with the Accept button and you can print it with the Print button. You can clear the information with the Clear button.Phone Search : With this application, you can search for phone numbers on the Nokia intranet. You enter the name of the person to be searched for in the application, and the application prints out the information found.4.1.2. Panel board testingOn a panel of boards, there is more than one card on the same panel. In some cases it is not necessary to test all the boards on the panel. Scrapped boards which means that one of the four boards on the panel is faulty, are an example. In this case, the test boards can be selected either by the test program which asks at the beginningof the testing which of the boards on the panel you want to test, or you can switch on the graphical option mode by pressing ‘on’ on the lower part of the tester user interface (Figure 16). You can change the option mode back to testing all boards on the panel by selecting ‘off’ even in the middle of running the program.If the option is selected, the test program shows the following text on the screen (Note: Check the boards to be tested before the board goes to the press):"All boards on the panel are selected for testing. The current board is #1. Use softkeys to traverse the board and toggle their testability.Hit the "Done" softkey (f8) when you have finished.If all boards on the panel should be tested, you can hit "Done" now."In other words, you can select the desired boards for testing with the function keys f2 (next board), f3 (previous board) and f4 (Select/do not select the board). By pressing function key f8, the testing for the selected boards starts. The selected boards are highlighted by guide lines on the Board Graphics screen. You can also click the key functions at the bottom of the Basic window with the mouse. Alternatively, you can select the boards to be tested directly by clicking with the mouse in the Board Graphics window.4.1.3. The most common failuresThe operator is a significant factor in failure occurrences in a manual testing system, because the boards are manually placed for testing and the tested boards are manually removed from the bed of nails. In addition, scanning the bar code of the board is one of the operator’s tasks. Due to the considerations mentioned above, a board may be placed in the tester in an incorrect orientation or an incorrect board may be placed in the tester, and thus the board and bed of nails will not match. Although several different failures may occur, the working principle is practically the same in all kinds of failures. An incorrect board and a leaking bed of nails are presented as examples of a failure below.4.1.4. Incorrect boardIn ICT testers, bar code readers are used to prevent an incorrect board from entering the bed of nails In other words, the fixed part of the board's panel label informs the test program that the board entering the tester is of the correct type.If the bar code read does not match the bar code defined in the test plan, the testprogram asks for the bar code to be rescanned.However, if an incorrect board still enters the tester or the board is placed on the bed of nails in an incorrect orientation, you can stop the test program with the Stop button in the option bar (Figure 14) of the test program. After this, when you first have checked that the bed of nails is not damaged, and that any potential damage has been repaired, you can continue the test program by pressing the Start button.4.1.5. Leaking bed of nailsIf you receive a long failure list in the pins test, it is worth checking the meter of the vacuum control unit and ensuring that it shows >20 when not testing, or >10 when testing. If the meter shows values below these, there is a leakage in thetesting system, the most common cause for the leakage being the bed of nails.Contact the ICT service desk.PROGRAM5. TESTAll board test programs mostly follow the order of the following subheadings. If one of the test phases locates a fault, a so-called Pins test is always carried outautomatically. This test checks the probe contacts of the bed of nails to the board being tested. The Pins test can also be the first test carried out. All subsequent test phases are skipped if one of the first test phases locates a fault on the board. Thus, after corrective actions, the board has to always be retested to ensure the condition of the board. Figure 19 shows the flow of the test program as a flow chart.5.1. Pins testThe Pins test is usually the first test carried out. The test checks the contacts of the probes in the bed of nails to the board being tested. This tests the condition of the bed of nails. In the flowchart in Figure 19, the Pins test is the last phase, but weusually carry out the Pins test at the beginning of the program in order to locate the potential faults resulting from the condition of the bed of nails at once.5.2. Preshorts testThe Preshorts test phase is the first subprogram of the test program. During thisphase, fuses, small resistors, jumpers, switches and other components with low-ohm values can be tested. The passing of the tests depends on the impedancethreshold. The test result has to remain below the threshold concerned in order for the test result to be a so-called Preshort result, that is pre-short-circuit.5.3. Shorts testAs the name implies, the Shorts subprogram checks the board for potential short-circuits. In the same test, Shorts also checks for potential ‘opens’, that is open。
max538中文资料
_______________General DescriptionThe MAX531/MAX538/MAX539 are low-power, voltage-output, 12-bit digital-to-analog converters (DACs) speci-fied for single +5V power-supply operation. The MAX531can also be operated with ±5V supplies. The MAX538/MAX539 draw only 140µA, and the MAX531(with internal reference) draws only 260µA. The MAX538/MAX539 come in 8-pin DIP and SO packages,while the MAX531 comes in 14-pin DIP and SO pack-ages. All parts have been trimmed for offset voltage,gain, and linearity, so no further adjustment is necessary.The MAX538’s buffer is fixed at a gain of +1 and the MAX539’s buffer at a gain of +2. The MAX531’s internal op amp may be configured for a gain of +1 or +2, as well as for unipolar or bipolar output voltages. The MAX531 can also be used as a four-quadrant multiplier without external resistors or op amps.For parallel data inputs, see the MAX530 data sheet._______________________ApplicationsBattery-Powered Test Instruments Digital Offset and Gain AdjustmentBattery-Operated/Remote Industrial Controls Machine and Motion Control Devices Cellular Telephones___________________________Featureso Operate from Single +5V Supply o Buffered Voltage Outputo Internal 2.048V Reference (MAX531)o 140µA Supply Current (MAX538/MAX539)o INL = ±1/2LSB (max)o Guaranteed Monotonic over Temperature o Flexible Output Ranges:0V to V DD (MAX531/MAX539)V SS to V DD (MAX531)0V to 2.6V (MAX531/MAX538)o 8-Pin SO/DIP (MAX538/MAX539)o Power-On Reseto Serial Data Output for Daisy-Chaining______________Ordering InformationMAX531/MAX538/MAX539+5V , Low-Power, Voltage-Output,Serial 12-Bit DACs________________________________________________________________Maxim Integrated Products 1_________________Pin Configurations________________Functional DiagramFor free samples & the latest literature: , or phone 1-800-998-880019-0172; Rev 6; 2/97PART TEMP. RANGE PIN-PACKAGE MAX531ACPD 0°C to +70°C 14 Plastic DIP MAX531BCPD 0°C to +70°C 14 Plastic DIP MAX531ACSD 0°C to +70°C 14 SO MAX531BCSD 0°C to +70°C 14 SO ERROR (LSB)±1/2±1±1/2±1MAX531BC/D0°C to +70°CDice*±1Ordering Information continued at end of data sheet.*Dice are specified at T A = +25°C only.M A X 531/M A X 538/M A X 539+5V , Low-Power, Voltage-Output Serial 12-Bit DACs 2_______________________________________________________________________________________ABSOLUTE MAXIMUM RATINGSV DD to DGND and V DD to AGND................................-0.3V, +6V V SS to DGND and V SS to AGND .................................-6V, +0.3V V DD to V SS .................................................................-0.3V, +12V AGND to DGND........................................................-0.3V, +0.3V Digital Input Voltage to DGND ......................-0.3V, (V DD + 0.3V)REFIN..................................................(V SS - 0.3V), (V DD + 0.3V)REFOUT to AGND.........................................-0.3V, (V DD + 0.3V)RFB .....................................................(V SS - 0.3V), (V DD + 0.3V)BIPOFF................................................(V SS - 0.3V), (V DD + 0.3V)V OUT (Note 1)................................................................V SS , V DD Continuous Current, Any Pin................................-20mA, +20mAContinuous Power Dissipation (T A = +70°C)8-Pin Plastic DIP (derate 9.09mW/°C above +70°C)....727mW 8-Pin SO (derate 5.88mW/°C above +70°C)................471mW 14-Pin Plastic DIP (derate 10.00mW/°C above +70°C)...800mW 14-Pin SO (derate 8.33mW/°C above +70°C)..............667mW Operating Temperature RangesMAX53__C__.....................................................0°C to +70°C MAX53__E__..................................................-40°C to +85°C Storage Temperature Range.............................-65°C to +165°C Lead Temperature (soldering, 10sec).............................+300°CELECTRICAL CHARACTERISTICS—Single +5V Supply(V DD = +5V ±10%, V SS = 0V, AGND = DGND = 0V, REFIN = 2.048V (external), RFB = BIPOFF = VOUT (MAX531), C REFOUT = 33µF (MAX531), R L = 10k Ω, C L = 100pF, T A = T MIN to T MAX , unless otherwise noted.)Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.Note 1:The output may be shorted to V DD , V SS ,or AGND if the package power dissipation limit is not exceeded.MAX531/MAX538/MAX539+5V , Low-Power, Voltage-Output,Serial 12-Bit DACsELECTRICAL CHARACTERISTICS—Single +5V Supply (continued)(V DD = +5V ±10%, V SS = 0V, AGND = DGND = 0V, REFIN = 2.048V (external), RFB = BIPOFF = VOUT (MAX531), C REFOUT = 33µF (MAX531), R L = 10k Ω, C L = 100pF, T A = T MIN to T MAX , unless otherwise noted.)M A X 531/M A X 538/M A X 539+5V , Low-Power, Voltage-Output,Serial 12-Bit DACs 4_______________________________________________________________________________________ELECTRICAL CHARACTERISTICS—Dual Supplies (MAX531 Only)(V DD = +5V ±10%, V SS = -5V ±10%, AGND = DGND = 0V, REFIN = 2.048V (external), RFB = BIPOFF = VOUT, C REFOUT = 33µF, R L = 10k Ω, C L = 100pF, T A = T MIN to T MAX , unless otherwise noted.)MAX531/MAX538/MAX539+5V , Low-Power, Voltage-Output,Serial 12-Bit DACs_______________________________________________________________________________________5Note 2:In single-supply operation, INL and GE calculated from code 11 to code 4095. Tested at V DD = +5V.Note 3:This specification applies to both gain-error power-supply rejection ratio and offset-error power-supply rejection ratio.Note 4:Guaranteed by design.Note 5:Tested at I OUT = 100µA. The reference can typically source up to 5mA (see Typical Operating Characteristics ).ELECTRICAL CHARACTERISTICS—Dual Supplies (MAX531 Only) (continued)(V DD = +5V ±10%, V SS = -5V ±10%, AGND = DGND = 0V, REFIN = 2.048V (external), RFB = BIPOFF = VOUT, C REFOUT = 33µF, R L = 10k Ω, C L = 100pF, T A = T MIN to T MAX , unless otherwise noted.)M A X 531/M A X 538/M A X 539+5V , Low-Power, Voltage-Output,Serial 12-Bit DACs 6_______________________________________________________________________________________120-60SUPPLY CURRENT vs. TEMPERATURE140TEMPERATURE (°C)S U P P L Y C U R R E N T (µA )60240180-202080300-40401002802602202001604-141100100kMAX531GAIN vs. FREQUENCY-12FREQUENCY (Hz)G A I N (d B )-8-402-2-6-101k 10k800101k 100kMAX531AMPLIFIER SIGNAL-TO-NOISE RATIO10FREQUENCY (Hz)S I G N A L -T O -N O I S E R A T I O (d B )20406030507010k1002.0552.045-60MAX531REFERENCE VOLTAGE vs.TEMPERATUREM A X 531-6TEMPERATURE (°C)R E F E R E N C E V O L T A G E (V )602.050-202080100400-40-11001101k100kANALOG FEEDTHROUGH vs.FREQUENCY-30-70FREQUENCY (Hz)A N A L O G F E E D T H R O U G H (d B )10010k1M-100-90-80-60-50-40-20-1028V DD -5V DD -1OUTPUT SOURCE CAPABILITY vs. OUTPUT PULL-UP VOLTAGE73M A X 531-4OUTPUT PULL-UP VOLTAGE (V)O U T P U T S OU R C E C A P A B I L I T Y (m A )V DD -256V DD -4V DD -34V DD -0100.25-1.2512INTEGRAL NONLINEARITY vs. DIGITAL INPUT CODE (FIRST 12 CODES)-1.00DIGITAL INPUT CODE (DECIMAL)I N T E G R A L N O N L I N E A R I T Y (L S B )8-0.50-0.75-0.25261004INTEGRAL NONLINEARITY vs. DIGITALINPUT CODE (ALL CODES)5121024153620482560307235844095-0.250.25I N T E G R A L N O N L I N E A R I T Y (L S B )DIGITAL INPUT CODE (DECIMAL)1200.8OUTPUT SINK CAPABILITY vs. OUTPUT PULL-DOWN VOLTAGE210M A X 531-3OUTPUT PULL-DOWN VOLTAGE (V)O U T P U T S I N K C A P A B I L I T Y (m A )0.6640.20.48 1.01416__________________________________________Typical Operating Characteristics(V DD = +5V, V REFIN = 2.048V, T A = +25°C, unless otherwise noted.)MAX531/MAX538/MAX539+5V , Low-Power, Voltage-Output,Serial 12-Bit DACs_______________________________________________________________________________________7____________________________Typical Operating Characteristics (continued)(V DD = +5V, V REFIN = 2.048V, T A = +25°C, unless otherwise noted.)20-301MAX531GAIN AND PHASE vs. FREQUENCY-1010FREQUENCY (kHz)G A I N (d B )10100-208002.05202.04905.0MAX531 REFERENCE OUTPUT VOLTAGEvs. REFERENCE LOAD CURRENT2.04952.0515M A X 531-14REFERENCE LOAD CURRENT (mA)R E F E R E N C E O U T P U T (V )3.02.05052.0500 1.0 2.04.02.05100.5 1.5 2.5 3.5 4.5V DD = ±5V, V REFIN = 2V, BIPOLAR CONFIGURATION A: CS RISING EDGE, 5V/div B: VOUT, NO LOAD, 1V/div ABNEGATIVE SETTLING TIME (MAX531)5µs/divDIGITAL FEEDTHROUGHABCS = HIGHA: DIN = 4Vp-p, 100kHz B: VOUT, 10mV/div 2µs/divABPOSITIVE SETTLING TIME (MAX531)V DD = ±5V, V REFIN = 2V, BIPOLAR CONFIGURATION A: CS RISING EDGE, 5V/div B: VOUT, NO LOAD, 1V/div 5µs/divM A X 531/M A X 538/M A X 539+5V , Low-Power, Voltage-Output Serial 12-Bit DACs 8_______________________________________________________________________________________10FUNCTION1BIPOFF Bipolar Offset/Gain Resistor 2DIN Serial Data Input 3CLR Clear. Asynchronously sets DAC register to 000 hex.PIN—14SCLK Serial Clock Input 5CS Chip Select, active low 6DOUT Serial Data Output for daisy-chaining 7DGND Digital Ground —238AGND Analog Ground 9REFIN Reference Input 4—56—REFOUT Reference Output,2.048V11—V SS Negative Power Supply 127VOUT DAC Output138V DD Positive Power Supply 14—RFBFeedback ResistorMAX531MAX538MAX539NAME____________________Pin Description_______________Detailed DescriptionGeneral DAC DiscussionThe MAX531/MAX538/MAX539 use an “inverted” R-2R ladder network with a single-supply CMOS op amp to con-vert 12-bit digital data to analog voltage levels (see Functional Diagram). The term “inverted” describes the ladder network because the REFIN pin in current-output DACs is the summing junction, or virtual ground, of an op amp. However, such use would result in the output voltage being the inverse of the reference voltage. The MAX531/MAX538/MAX539’s topology makes the output the same polarity as the reference input.An internal reset circuit forces the DAC register to reset to 000 hex on power-up. Additionally, a clear CLR pin, when held low, sets the DAC register to 000 hex. CLR operates asynchronously and independently from the chip-select (CS)pin.Buffer AmplifierThe output buffer is a unity-gain stable, rail-to-rail output,BiCMOS op amp. Input offset voltage and CMRR are trimmed to achieve better than 12-bit performance.Settling time is 25µs to 0.01% of final value. The settling time is considerably longer when the DAC code is initially set to 000 hex, because at this code the op amp is com-pletely debiased. Start from code 001 hex if necessary.The output is short-circuit protected and can drive a 2k Ωload with more than 100pF load capacitance.Figure 1. Timing DiagramInternal Reference (MAX531 only)The on-chip reference is lesser trimmed to generate 2.048V at REFOUT. The output stage can source and sink current,so REFOUT can settle to the correct voltage quickly in response to code-dependent loading changes. Typically,source current is 5mA and sink current is 100µA.REFOUT connects the internal reference to the R-2R DAC ladder at REFIN. The R-2R ladder draws 50µA maximum load current. If any other connection is made to REFOUT,ensure that the total load current is less than 100µA to avoid gain errors.For applications requiring very low-noise performance,connect a 33µF capacitor from REFOUT to AGND. If noise is not a concern, a lower value capacitor (3.3µF min) may be used. To reduce noise further, insert a buffered RC filter between REFOUT and REFIN (Figure 2). The reference bypass capacitor, C REFOUT , is still required for reference stability. In applications not requiring the reference, con-nect REFOUT to V DD or use the MAX538 or MAX539 (no internal reference).External ReferenceAn external reference in the range (V SS + 2V) to (V DD - 2V)may be used with the MAX531 in dual-supply operation.With the MAX538/MAX539 or the MAX531 in single-supply use, the reference must be positive and may not exceed V DD - 2V. The reference voltage determines the DAC’s full-scale output. The DAC input resistance is code dependent and is minimum (40k Ω) at code 555 hex and virtually infi-nite at code 000 hex. REFIN’s input capacitance is also code dependent and has a 50pF maximum value at sever-al codes. Because of the code-dependent nature of refer-ence input impedances, a high-quality, low-output-imped-ance amplifier (such as the MAX480 low-power, precision op amp) should be used.If an upgrade to the internal reference is required, the 2.5V MAX873A is suitable: ±15mV initial accuracy, TCV OUT =7ppm/°C (max).Logic InterfaceThe MAX531/MAX538/MAX539 logic inputs are designed to be compatible with TTL or CMOS logic levels. However, to achieve the lowest power dissipation, drive the digital inputs with rail-to-rail CMOS logic. With TTL logic levels, the power requirement increases by a factor of approximately 2.Serial Clock and Update RateFigure 1 shows the MAX531/MAX538/MAX539 timing. The maximum serial clock rate is given by 1 / (t CH + t CL ),approximately 14MHz. The digital update rate is limited by the chip-select period, which is 16 x (t CH + t CL ) + t CSW .This equals a 1.14µs, or 877kHz, update rate. However, the DAC settling time to 12 bits is 25µs, which may limit the update rate to 40kHz for full-scale step transitions.____________Applications InformationRefer to Figures 3a and 3b for typical operating connec-tions.Serial InterfaceThe MAX531/MAX538/MAX539 use a three-wire serial interface that is compatible with SPI™, QSPI™(CPOL = CPHA = 0), and Microwire™ standards as shown in Figures 4 and 5. The DAC is programmed by writing two 8-bit words (see Figure 1 and the Functional Diagram ).Sixteen bits of serial data are clocked into the DAC MSB first with the MSB preceded by four fill (dummy) bits. The four dummy bits are not normally needed. They are required only when DACs are daisy-chained. Data is clocked in on SCLK’s rising edge while CS is low. The seri-al input data is held in a 16-bit serial shift register. On CS’s rising edge, the 12 least significant bits are transferred to the DAC register and update the DAC. With CS high, data cannot be clocked into the MAX531/MAX538/MAX539.The MAX531/MAX538/MAX539 input data in 16-bit blocks.The SPI and Microwire interfaces output data in 8-bit blocks, thereby requiring two write cycles to input data to the DAC. The QSPI interface allows variable data input from eight to 16 bits, and can be loaded into the DAC in one write cycle.MAX531/MAX538/MAX539+5V , Low-Power, Voltage-Output,Serial 12-Bit DACs_______________________________________________________________________________________9Figure 2. Reference Noise vs. FrequencySPI and QSPI are trademarks of Motorola, Inc.Microwire is a trademark of National Semiconductor Corp.M A X 531/M A X 538/M A X 539Daisy-Chaining DevicesThe serial output, DOUT, allows cascading of two or more DACs. The data at DIN appears at DOUT,delayed by 16 clock cycles plus one clock width. For low power, DOUT is a CMOS output that does not require an external pull-up resistor. DOUT does not go into a high-impedance state when CS is high. DOUT changes on SCLK’s falling edge when CS is low. When CS is high, DOUT remains in the state of the last data bit.Any number of MAX531/MAX538/MAX539 DACs can be daisy-chained by connecting the DOUT of one device to the DIN of the next device in the chain. For proper timing, ensure that t CL (CS low to SCLK high) is greater than t DO + t DS .Unipolar ConfigurationThe MAX531 is configured for a gain of +1 (0V to V REFIN unipolar output) by connecting BIPOFF and RFB to VOUT (Figure 6). The converter operates from either sin-gle or dual supplies in this configuration. See Table 1 for the DAC-latch contents (input) vs. the analog VOUT (output). In this range, 1LSB = V REFIN (2-12). The MAX538 is internally configured for unipolar gain = +1operation.A gain of +2 (0V to 2V REFIN unipolar output) is set up by connecting BIPOFF to AGND and RFB to VOUT (Figure 7). Table 2 shows the DAC-latch contents vs.VOUT. The MAX531 operates from either single or dualsupplies in this mode. In this range, 1LSB = (2)(V REFIN )(2-12) = (V REFIN )(2-11). The MAX539 is internally config-ured for unipolar gain = +2 operation.Bipolar ConfigurationA bipolar range is set up by connecting BIPOFF to REFIN and RFB to VOUT, and operating from dual (±5V) supplies (Figure 8). Table 3 shows the DAC-latch contents (input) vs. VOUT (output). In this range,1LSB = V REFIN (2-11).Four-Quadrant MultiplicationThe MAX531 can be used as a four-quadrant multiplier by connecting BIPOFF to REFIN and RFB to VOUT,using (1) an offset binary digital code, (2) bipolar power supplies, using dual power supplies, and (3) a bipolar analog input at REFIN within the range V SS + 2V to V DD - 2V, as shown in Figure 9.In general, a 12-bit DAC’s output is (D) (V REFIN)(G),where “G” is the gain (+1 or +2) and “D” is the binary representation of the digital input divided by 212or 4096. This formula is precise for unipolar operation.However, for bipolar, offset binary operation, the MSB is really a polarity bit. No resolution is lost, as there are the same number of steps. The output voltage, howev-er, has been shifted from a range of, for example, 0V to 4.096V (G = +2) to a range of -2.048V to +2.048V.Keep in mind that when using the DAC as a four-quad-rant multiplier, the scale is skewed. Negative full scale is -V REFIN , while positive full scale is +V REFIN - 1LSB.+5V , Low-Power, Voltage-Output,Serial 12-Bit DACs 10______________________________________________________________________________________Figure 3a. MAX531 Typical Operating CircuitMAX531/MAX538/MAX539+5V , Low-Power, Voltage-Output,Serial 12-Bit DACs11Figure 4. Microwire ConnectionFigure 5. SPI/QSPI ConnectionFigure 6. Unipolar Configuration (0V to +2.048V Output)Table 1. Unipolar Binary Code Table (0V to V REFIN Output), Gain = +1Figure 7. Unipolar Configuration (0V to +4.096V Output)Table 2. Unipolar Binary Code Table (0V to 2V REFIN Output), Gain = +2INPUT OUTPUT 111111111111100000000001100000000000011111111111000000000001000000000000+2 (V REFIN )40954096+2 (V REFIN )20494096+2 (V REFIN ) 20484096+2 (V REFIN )20474096+2 (V REFIN )1 4096OV= +V REFINM A X 531/M A X 538/M A X 539Single-Supply LinearityAs with any amplifier, the MAX531/MAX538/MAX539’s output buffer can be positive or negative. When the off-set is positive, it is easily accounted for (Figure 10).However, when the offset is negative, the buffer output cannot follow linearly when there is no negative supply.In that case, the amplifier output (VOUT) remains at ground until the DAC voltage is sufficient to overcome the offset and the output becomes positive.Normally, linearity is measured after accounting for zero error and gain error. Since, in single-supply opera-tion, the actual value of a negative offset is unknown, it cannot be accounted for during test. Additionally, the output buffer amplifier exhibits a nonlinearity near-zero output when operating with a single supply. To account for this nonlinearity in the MAX531/MAX538/MAX539,linearity and gain error are measured from code 11 to code 4095. The output buffer’s offset and nonlinear behavior do not affect monotonicity, and these DACs are guaranteed monotonic starting with code zero. In dual-supply operation, linearity and gain error are mea-sured from code 0 to 4095.Power-Supply Bypassing andGround ManagementBest system performance is obtained with printed cir-cuit boards that use separate analog and digital ground planes. Wire-wrap boards are not recommend-ed. The two ground planes should be connected together at the low-impedance power-supply source.DGND and AGND should be connected together at the chip. For the MAX531 in single-supply applications,connect V SS to AGND at the chip. The best ground connection may be achieved by connecting the DAC’s DGND and AGND pins together and connecting that point to the system analog ground plane. If the DAC’s DGND is connected to the system digital ground, digi-tal noise may get through to the DAC’s analog portion. Bypass V DD (and V SS in dual-supply mode) with a 0.1µF ceramic capacitor, connected between V DD and AGND (and between V SS and AGND). Mount with short leads close to the device. Ferrite beads may also be used to further isolate the analog and digital power supplies.Figures 11a and 11b illustrate the grounding and bypassing scheme described.Saving PowerWhen the DAC is not being used by the system, mini-mize power consumption by setting the appropriate code to minimize load current. For example, in bipolar mode, with a resistive load to ground, set the DAC code to mid-scale (Table 3). If there is no output load,minimize internal loading on the reference by setting the DAC to all 0s (on the MAX531, use CLR ). Under this condition, REFIN is high impedance and the op amp operates at its minimum quiescent current. Due to these low current levels, the output settling time for an input code close to 0 typically increases to 60µs (no more than 100µs).+5V , Low-Power, Voltage-Output,Serial 12-Bit DACs 12______________________________________________________________________________________Figure 8. Bipolar Configuration (-2.048V to +2.048V Output)Table 3. Bipolar (Offset Binary) Code Table (-V REFIN to +V REFIN Output)INPUTOUTPUT111111111111100000000001100000000000011111111111000000000001000000000000(+V REFIN )20472048(+V REFIN )12048(-V REFIN )12048(-V REFIN )204720480V(-V REFIN ) 20482048= -V REFINAC ConsiderationsDigital FeedthroughHigh-speed serial data at any of the digital input or output pins may couple through the DAC package and cause internal stray capacitance to appear at the DAC output as noise, even though CS is held high (see Typical Operating Characteristics ). This digital feedthrough is tested by hold-ing CS high, transmitting 555 hex from DIN to DOUT. Analog FeedthroughBecause of internal stray capacitance, higher frequency analog input signals may couple to the output as shown in the Analog Feedthrough vs. Frequency graph in the Typical Operating Characteristics . It is tested by holding CS high, setting the DAC code to all 0s, and sweeping REFIN.MAX531/MAX538/MAX539+5V , Low-Power, Voltage-Output,Serial 12-Bit DACs______________________________________________________________________________________13Figure 9. MAX531 Connected as Four-Quadrant Multiplier. The unused REFOUT is connected to V DD .Figure 10. Single-Supply OffsetM A X 531/M A X 538/M A X 539+5V , Low-Power, Voltage-Output,Serial 12-Bit DACs 14________________________________________________________________________________________Ordering Information (continued)*Dice are specified at T A = +25°C only.____Pin Configurations (continued)___________________Chip TopographyREFINDOUT( ) ARE FOR MAX531 ONLY.0.120" (3.048mm)0.080" (2.032mm)SCLK CSAGND(DGND)(REFOUT)(V SS )VOUTDD(CLR)TRANSISTOR COUNT: 922SUBSTRATE CONNECTED TO V DD±18 SO 0°C to +70°C MAX539BCSA ±18 SO-40°C to +85°CMAX539BESA±1/28 SO -40°C to +85°C MAX539AESA ±18 Plastic DIP -40°C to +85°C MAX539BEPA ±1/28 Plastic DIP -40°C to +85°C MAX539AEPA ±1Dice*0°C to +70°C MAX539BC/D ±1/28 SO 0°C to +70°C MAX539ACSA ±18 Plastic DIP 0°C to +70°C MAX539BCPA ±1/28 Plastic DIP 0°C to +70°C MAX539ACPA ±18 SO-40°C to +85°C MAX538BESA ±1/28 SO -40°C to +85°C MAX538AESA ±18 Plastic DIP -40°C to +85°C MAX538BEPA ±1/28 Plastic DIP -40°C to +85°C MAX538AEPA ±18 SO 0°C to +70°C MAX538BCSA ±1/28 SO 0°C to +70°C MAX538ACSA ±18 Plastic DIP 0°C to +70°C MAX538BCPA ±1/28 Plastic DIP 0°C to +70°C MAX538ACPA ±114 SO-40°C to +85°C MAX531BESD ±1/2±114 SO -40°C to +85°C MAX531AESD ±1/2ERROR (LSB)±114 Plastic DIP -40°C to +85°C MAX531BEPD 14 Plastic DIP -40°C to +85°C MAX531AEPD PIN-PACKAGE TEMP. RANGE PART Dice*0°C to +70°C MAX538BC/DMAX531/MAX538/MAX539+5V , Low-Power, Voltage-Output,Serial 12-Bit DACs______________________________________________________________________________________15________________________________________________________Package InformationMaxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.16__________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 (408) 737-7600©1997 Maxim Integrated ProductsPrinted USAis a registered trademark of Maxim Integrated Products.M A X 531/M A X 538/M A X 539+5V , Low-Power, Voltage-Output,Serial 12-Bit DACs__________________________________________Package Information (continued)。
MAX1978中文数据手册
用于Peltier模块的集成温度控制器概论MAX1978 / MAX1979是用于Peltier热电冷却器（TEC）模块的最小, 最安全, 最精确完整的单芯片温度控制器。
片上功率FET和热控制环路电路可最大限度地减少外部元件, 同时保持高效率。
可选择的500kHz / 1MHz开关频率和独特的纹波消除方案可优化元件尺寸和效率, 同时降低噪声。
内部MOSFET的开关速度经过优化, 可降低噪声和EMI。
超低漂移斩波放大器可保持±0.001°C的温度稳定性。
直接控制输出电流而不是电压, 以消除电流浪涌。
独立的加热和冷却电流和电压限制提供最高水平的TEC保护。
MAX1978采用单电源供电, 通过在两个同步降压调节器的输出之间偏置TEC, 提供双极性±3A输出。
真正的双极性操作控制温度, 在低负载电流下没有“死区”或其他非线性。
当设定点非常接近自然操作点时, 控制系统不会捕获, 其中仅需要少量的加热或冷却。
模拟控制信号精确设置TEC 电流。
MAX1979提供高达6A的单极性输出。
提供斩波稳定的仪表放大器和高精度积分放大器, 以创建比例积分（PI）或比例积分微分（PID）控制器。
仪表放大器可以连接外部NTC或PTC热敏电阻, 热电偶或半导体温度传感器。
提供模拟输出以监控TEC温度和电流。
此外, 单独的过热和欠温输出表明当TEC温度超出范围时。
片上电压基准为热敏电阻桥提供偏置。
MAX1978 / MAX1979采用薄型48引脚薄型QFN-EP 封装, 工作在-40°C至+ 85°C温度范围。
采用外露金属焊盘的耐热增强型QFN-EP封装可最大限度地降低工作结温。
评估套件可用于加速设计。
应用光纤激光模块典型工作电路出现在数据手册的最后。
WDM, DWDM激光二极管温度控制光纤网络设备EDFA光放大器电信光纤接口ATE特征♦尺寸最小, 最安全, 最精确完整的单芯片控制器♦片上功率MOSFET-无外部FET♦电路占用面积<0.93in2♦回路高度<3mm♦温度稳定性为0.001°C♦集成精密积分器和斩波稳定运算放大器♦精确, 独立的加热和冷却电流限制♦通过直接控制TEC电流消除浪涌♦可调节差分TEC电压限制♦低纹波和低噪声设计♦TEC电流监视器♦温度监控器♦过温和欠温警报♦双极性±3A输出电流（MAX1978）♦单极性+ 6A输出电流（MAX1979）订购信息* EP =裸焊盘。
NXPXXXXXX中文资料
SPECIFICATIONS FOR NICHIA WHITE LED MODEL : NSPW570DSNICHIA CORPORATION1.SPECIFICATIONS(1) Absolute Maximum Ratings (Ta=25°C)Item Symbol Absolute Maximum Rating UnitForward Current I F 30 mA Pulse Forward Current I FP 100 mA Reverse Voltage V R 5 V Power Dissipation P D 105 mW Operating Temperature T opr -30 ~ + 85 °C Storage Temperature T stg -40 ~ +100 °C Soldering Temperature T sld 265°C for 10sec.I FP Conditions : Pulse Width 10msec. and Duty 1/10(2) Initial Electrical/Optical Characteristics (Ta=25°C)Item Symbol Condition Typ. Max. UnitForward Voltage V F I F =20[mA](3.2) 3.5 V Reverse Current I R V R = 5[V] - 50 µA Luminous Intensity Iv I F =20[mA](1.7) - cdx - I F =20[mA]0.31 - -Chromaticity Coordinatey - I F =20[mA]0.32 - -½ Please refer to CIE 1931 chromaticity diagram.(3) Ranking(Ta=25°C)Item SymbolCondition Min. Max. Unit Rank W IvI F =20[mA] 1.75 2.53 cd Rank V IvI F =20[mA] 1.24 1.75 cd Luminous Intensity Rank U IvI F =20[mA]0.88 1.24 cd½ Luminous Intensity Measurement allowance is ± 10%.Color Ranks (I F =20mA,Ta=25°C)Rank a0 Rank b1 x 0.280 0.264 0.283 0.296x 0.287 0.283 0.330 0.330y 0.248 0.267 0.305 0.276y 0.295 0.305 0.360 0.339Rank b2Rank c0x 0.296 0.287 0.330 0.330x 0.330 0.330 0.361 0.356 y 0.276 0.295 0.339 0.318y 0.318 0.360 0.385 0.351½ Color Coordinates Measurement allowance is ± 0.01.½ Basically, a shipment shall consist of the LEDs of a combination of the above ranks.The percentage of each rank in the shipment shall be determined by Nichia.2.INITIAL OPTICAL/ELECTRICAL CHARACTERISTICSPlease refer to “CHARACTERISTICS” on the following pages.<= <=½Epoxy Resin (over Phosphor) Ag plating Copper Alloy 3.OUTLINE DIMENSIONS AND MATERIALSPlease refer to “OUTLINE DIMENSIONS” on the following page. Material as follows ;4.PACKAGING· The LEDs are packed in cardboard boxes after packaging in anti-electrostatic bags. Please refer to “PACKING” on the following pages.The label on the minimum packing unit shows ; Part Number, Lot Number, Ranking, Quantity· In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation. · The LEDs may be damaged if the boxes are dropped or receive a strong impact against them, so precautions must be taken to prevent any damage.· The boxes are not water resistant and therefore must be kept away from water and moisture.· When the LEDs are transported, we recommend that you use the same packing method as Nichia.5.LOT NUMBERThe first six digits number shows lot number .The lot number is composed of the following characters; - U- Year ( 7 for 2007, 8 for 2008 ) - Month ( 1 for Jan., 9 for Sep., A for Oct., B for Nov. )- Nichia's Product Number U - Rankingby Color Coordinates - Ranking by Luminous IntensityResin Leadframe ::6.RELIABILITY(1) TEST ITEMS AND RESULTSTest Item StandardTest Method Test Conditions NoteNumber ofDamagedResistance to Soldering Heat JEITA ED-4701300 302Tsld=260 ± 5°C, 10sec.3mm from the base of the epoxy bulb1 time 0/50Solderability JEITA ED-4701300 303 Tsld=235 ± 5°C, 5sec.(using flux)1 timeover 95%0/50Temperature Cycle JEITA ED-4701100 105-40°C ~ 25°C ~ 100°C ~ 25°C30min.5min.30min.5min.100 cycles0/50Moisture Resistance Cyclic JEITA ED-4701200 203 25°C ~ 65°C ~ -10°C90%RH 24hrs./1cycle10 cycles 0/50Terminal Strength (bending test) JEITA ED-4701400 401Load 5N (0.5kgf)0° ~ 90° ~ 0° bend 2 timesNo noticeabledamage0/50Terminal Strength (pull test) JEITA ED-4701400 401Load 10N (1kgf)10 ± 1 sec.No noticeabledamage0/50High Temperature Storage JEITA ED-4701200 201Ta=100°C 1000hrs. 0/50Temperature Humidity Storage JEITA ED-4701100 103Ta=60°C, RH=90% 1000hrs. 0/50Low Temperature Storage JEITA ED-4701200 202Ta=-40°C 1000hrs. 0/50Steady State Operating Life Ta=25°C, I F=30mA 1000hrs.0/50Steady State Operating Life of High Humidity Heat 60°C, RH=90%, I F=20mA 500hrs.0/50Steady State Operating Life of Low Temperature Ta=-30°C, I F=20mA 1000hrs.0/50(2) CRITERIA FOR JUDGING DAMAGECriteria for JudgementItem Symbol Test Conditions Min. Max. Forward Voltage V F I F=20mA - U.S.L.*) 1.1 Reverse Current I R V R=5V -U.S.L.*) 2.0 Luminous Intensity I V I F=20mA L.S.L.**) 0.7 - *) U.S.L.:Upper Standard Level **) L.S.L.:Lower Standard Level7.CAUTIONSThe LEDs are devices which are materialized by combining Blue LEDs and special phosphors. Consequently, the color of the LEDs is changed a little by an operating current.Care should be taken after due consideration when using LEDs.(1) Lead Forming· When forming leads, the leads should be bent at a point at least 3mm from the base of the epoxy bulb.Do not use the base of the leadframe as a fulcrum during lead forming.· Lead forming should be done before soldering.· Do not apply any bending stress to the base of the lead. The stress to the base may damage the LED’s characteristics or it may break the LEDs.· When mounting the LEDs onto a printed circuit board, the holes on the circuit board should be exactly aligned with the leads of the LEDs. If the LEDs are mounted with stress at the leads, it causesdeterioration of the epoxy resin and this will degrade the LEDs.(2) Storage· The LEDs should be stored at 30°C or less and 70%RH or less after being shipped from Nichia and the storage life limits are 3 months. If the LEDs are stored for 3 months or more, they can be stored for a year in a sealed container with a nitrogen atmosphere and moisture absorbent material.· Nichia LED leadframes are silver plated copper alloy. The silver surface may be affected byenvironments which contain corrosive substances. Please avoid conditions which may cause the LED to corrode, tarnish or discolor. This corrosion or discoloration may cause difficulty during soldering operations. It is recommended that the LEDs be used as soon as possible.· Please avoid rapid transitions in ambient temperature, especially, in high humidity environments where condensation can occur.(3) Static Electricity· Static electricity or surge voltage damages the LEDs.It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs. · All devices, equipment and machinery must be properly grounded. It is recommended that precautions be taken against surge voltage to the equipment that mounts the LEDs.· When inspecting the final products in which LEDs were assembled, it is recommended to checkwhether the assembled LEDs are damaged by static electricity or not. It is easy to findstatic-damaged LEDs by a light-on test or a VF test at a lower current (below 1mA is recommended). · Damaged LEDs will show some unusual characteristics such as the leak current remarkablyincreases, the forward voltage becomes lower, or the LEDs do not light at the low current.Criteria : (V F> 2.0V at I F=0.5mA)(4) Soldering Conditions· Nichia LED leadframes are silver plated copper alloy. This substance has a lowthermal coefficient (easily conducts heat). Careful attention should be paid during soldering. · Solder the LED no closer than 3mm from the base of the epoxy bulb. Soldering beyond the base of the tie bar is recommended.· Recommended soldering conditionsDip Soldering Hand SolderingPre-HeatPre-Heat Time Solder BathTemperature Dipping Time Dipping Position 120°C Max.60 seconds Max.260°C Max.10 seconds Max.No lower than 3 mm from thebase of the epoxy bulb.TemperatureSoldering TimePosition350°C Max.3 seconds Max.No closer than 3 mm from thebase of the epoxy bulb.· Although the recommended soldering conditions are specified in the above table, dip or handsoldering at the lowest possible temperature is desirable for the LEDs.· A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.· Dip soldering should not be done more than one time.· Hand soldering should not be done more than one time.· Do not apply any stress to the lead particularly when heated.· The LEDs must not be repositioned after soldering.· After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or vibration until the LEDs return to room temperature.· Direct soldering onto a PC board should be avoided. Mechanical stress to the resin may be caused from warping of the PC board or from the clinching and cutting of the leadframes. When it isabsolutely necessary, the LEDs may be mounted in this fashion but the User will assume responsibility for any problems. Direct soldering should only be done after testing has confirmed that no damage, such as wire bond failure or resin deterioration, will occur. Nichia’s LEDs should not be soldered directly to double sided PC boards because the heat will deteriorate the epoxy resin.· When it is necessary to clamp the LEDs to prevent soldering failure, it is important to minimizethe mechanical stress on the LEDs.· Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures may cause failure of the LEDs.(5) Heat Generation· Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when making the system design. The coefficient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of LEDplacement on the board, as well as other components. It is necessary to avoid intense heat generation and operate within the maximum ratings given in this specification.· The operating current should be decided after considering the ambient maximum temperature of LEDs.(6) Cleaning· It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs. When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the resin or not.Freon solvents should not be used to clean the LEDs because of worldwide regulations.· Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition.Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur. (7) Safety Guideline for Human Eyes· In 1993, the International Electric Committee (IEC) issued a standard concerning laser product safety (IEC 825-1). Since then, this standard has been applied for diffused light sources (LEDs) as well as lasers. In 1998 IEC 60825-1 Edition 1.1 evaluated the magnitude of the light source.In 2001 IEC 60825-1 Amendment 2 converted the laser class into 7 classes for end products.Components are excluded from this system. Products which contain visible LEDs are now classified as class 1. Products containing UV LEDs are class 1M. Products containing LEDs can be classified as class 2 in cases where viewing angles are narrow, optical manipulation intensifies the light, and/or the energy emitted is high. For these systems it is recommended to avoid long term exposure.It is also recommended to follow the IEC regulations regarding safety and labeling of products.(8) Others· NSPW570DS complies with RoHS Directive.· Care must be taken to ensure that the reverse voltage will not exceed the absolute maximum rating when using the LEDs with matrix drive.· Flashing lights have been known to cause discomfort in people; you can prevent this by takingprecautions during use. Also, people should be cautious when using equipment that has had LEDsincorporated into it.· The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment, communications equipment, measurement instruments and household appliances).Consult Nichia’s sales staff in advance for information on the applications in which exceptional quality and reliability are required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactorcontrol systems, automobiles, traffic control equipment, life support systems and safety devices).· User shall not reverse engineer by disassembling or analysis of the LEDs without having prior written consent from Nichia. When defective LEDs are found, the User shall inform Nichia directly before disassembling or analysis.· The formal specifications must be exchanged and signed by both parties before large volume purchase begins. · The appearance and specifications of the product may be modified for improvement without notice.½Color Coordinates Measurement allowance is ± 0.01.-8-Nichia STS-DA1-0089Nichia STS-DA1-0089Nichia STS-DA1-0089Nichia STS-DA1-0089Nichia STS-DA1-0089Nichia STS-DA1-0089Nichia STS-DA1-0089。
MOTOROLA MC3090 MC3070 MC3000 中文操作手册 附故障分析表
MOTOROLA /Symbol MC3000 系列手持移动终端操作手册本文主要介绍MC3000 系列手持移动终端硬件方面的操作方法，各种功能键的说明，扫描器的使用等等本操作手册使用了下列指示图标1.0 设备简介MC3000系列手持移动终端包括MC3000，MC3070以及MC3090，根据其型号的更新，目前使用较多的是MC3090，由于MC3000系列是一款功能强大，适用性广的设备，因此在型号后面有 “R ”和“G ”作为后缀，“R ”代表旋转扫描头，“G ”代表固定式扫描头带手柄，以下将以较常见的 MC3090R 38键手持移动终端作为案例讲解。
设备正面包括：激光扫描头，扫描指示灯，充电指示灯，屏幕，键盘，话筒设备背面包括；扫描器（旋转头），手挽带及笔套，触摸笔，电池后盖点击开机按钮即可开机，同样，关机也是此按钮。
在开机状态下，点按关机按钮，虽然屏幕关闭了，但是运行的程序并没有关闭，而是挂起3.0 安装电池操作步骤：（如右图）3.1 打开后盖锁扣3.2 拉开后盖3.3 按照指示放入电池3.4 盖上后盖3.5 扣住锁扣4.0 电池充电MC3000充电有两种方式：直冲或座充直冲是直接把电池放在底座后面电池仓中，连接好电源线即可，如右图右上角所示。
座充是可以直接把MC3000插在底座中充电。
只要电源指示灯跳动即可，一旦充电结束，指示灯则会长亮。
5.0 扫描器的使用MC3000 的扫描器设计非常出色，可以 270°旋转，对于一些特殊位置的条码，可以调节扫描头的位置，方便准确的扫描条码内容。
扫描条码时必须使扫描器发出的激光束完全覆盖条码，不能斜着或者是没有整个覆盖，这样是无法准确扫描条码内容的。
扫描条码时还要注意一个角度的问题，即不能90°正对着扫描，这样会产生镜面反射，影响扫描效果，最好的角度是65°，如下图所示。
同时角度过小，也会导致无法识别。
6.0SD 卡安装方法 打开电池后盖，取出电池，会看到如右图1所示，按图中箭头方向打开SD 卡扣，然后按图2方式放入SD 卡，放好后关闭SD 卡扣即可，再装入电池，盖好后盖即可使用SD 卡，在系统下会多出一个7.0键盘按键说明这里先把MC3000 的38个按键分成47.1一区主要是方向键，从左往右依次是: 向左，向上，向下，向右四个方向7.2二区主要是功能键,实现系统级的操作，从左往右依次是ALPHA 组合键,BACK后退键，SHIFT功能键，ENT回车键7.3三区主要是数字键,实现0-9 十个数字的输入，以及小数点和逗号键。
MAX3074EAPA中文资料
Continuous Power Dissipation (TA = +70°C) 8-Pin SO (derate 5.88mW/°C above +70°C) .................471mW 8-Pin Plastic DIP (derate 9.09mW/°C above +70°C) .....727mW 14-Pin SO (derate 8.33mW/°C above +70°C) ...............667mW 14-Pin Plastic DIP (derate 10.0mW/°C above +70°C) ...800mW
MAX3030EESE+中文资料
Continuous Power Dissipation (TA = +70°C) 16-Pin SO (derate 8.70mW/°C above +70°C)..............696mW 16-Pin TSSOP (derate 9.40mW/°C above +70°C) .......755mW
Telecom Backplanes V.11/X.21 Interface Industrial PLCs Motor Control
Applications
Pin Configurations
TOP VIEW
DI1 1 DO1+ 2 DO1- 3
EN 4 DO2- 5 DO2+ 6
DI2 7 GND 8
MAX3030E–MAX3033E
元器件交易网
19-2671; Rev 0; 10/02
±15kV ESD-Protected, 3.3V Quad RS-422 Transmitters
General Description
The MAX3030E–MAX3033E family of quad RS-422 transmitters send digital data transmission signals over twisted-pair balanced lines in accordance with TIA/EIA422-B and ITU-T V.11 standards. All transmitter outputs are protected to ±15kV using the Human Body Model. The MAX3030E–MAX3033E are available with either a 2Mbps or 20Mbps guaranteed baud rate. The 2Mbps baud rate transmitters feature slew-rate-limiting to minimize EMI and reduce reflections caused by improperly terminated cables.
MAX3077EESA中文资料
The MAX3072E/MAX3075E/MAX3078E are intended for half-duplex communications, and the MAX3070E/ MAX3071E/MAX3073E/MAX3074E/MAX3076E/MAX307 7E are intended for full-duplex communications. The MAX3079E is selectable for half-duplex or full-duplex operation. It also features independently programmable receiver and transmitter output phase through separate pins.
MAX266中文数据手册
MAX266中文数据手册MAX266/265中文数据手册By Hi_Cracker @whu引脚电阻可编程通用高效滤波器-----MAX266/265General Description和MAX265是高效的容滤波器，专门设计用于需要高精度滤波的应用MAX266场合。
内置了两个独立的滤波模块，可以配置成低通，高通，带通，带阻，全通滤波器。
中心频率或者截止频率的控制需要外接电阻以及6 Pin-Strapped 的输入特性来编程实现，然而，Q值仅用电阻连接实现。
各种各样类型的滤波器都可以实现（巴特沃斯，切比雪夫，椭圆滤波器等等）。
内部集成了两个运算放大器。
MAX265可以将中心/截止频率可以最高调到40Khz，然而，MAX266，通过使用一个低范围的fclk/fo比例系数，可以将fos 调到140Khz。
4MHZ系统时钟，可以通过一个晶振或是额外的源获得。
滤波器的操作电压为从±2.37v到±6.3v或者+5V的单电源供电。
Application：声纳电子设备Anti-Aliasing 滤波器数字信号处理震动音频分析远程通信测试仪器Features滤波器参数设置软件化256bit的频率控制字电阻调整Q值和fo140Khz频率调节范围±5V或者单电源﹢5V操作电压Introduction每个MAX266/265都包含的两个可配置滤波器模块已经显示在数据手册前面的功能框图上。
fclk/fo编程输入（F0-F5）被两个滤波模块共用,然而，每个部分的fo仍然受到各自外接电阻的独立调节。
各个模块的的Q值也是受到各自的外接电阻的独立调节的。
MAX266使用比MAX265更低范围的取样比率（fclk/fo），这样就可以产生更高的信号带宽以及fo的可编程范围。
降低fclk/fo产生的影响主要就是比MAX265的滤波器参数的连续性稍微差了一些，但是这些不同可以通过使用图23所示的图形或是美信得滤波器软件来补偿。
MAX3081ECPA+中文资料
General Description
The MAX3080E–MAX3089E are ±15kV electrostatic discharge (ESD)-protected, high-speed transceivers for RS485/RS-422 communication that contain one driver and one receiver. These devices feature fail-safe circuitry, which guarantees a logic-high receiver output when the receiver inputs are open or shorted. This means that the receiver output will be a logic high if all transmitters on a terminated bus are disabled (high impedance). The MAX3080E/MAX3081E/MAX3082E feature reduced slew-rate drivers that minimize EMI and reduce reflections caused by improperly terminated cables, allowing error-free data transmission up to 115kbps. The MAX3083E/MAX3084E/MAX3085E offer higher driver output slew-rate limits, allowing transmit speeds up to 500kbps. The MAX3086E/MAX3087E/ MAX3088Es’ driver slew rates are not limited, making transmit speeds up to 10Mbps possible. The MAX3089E’s slew rate is selectable between 115kbps, 500kbps, and 10Mbps by driving a selector pin with a single three-state driver. All devices feature enhanced ESD protection. All transmitter outputs and receiver inputs are protected to ±15kV using the Human Body Model. These transceivers typically draw 375µA of supply current when unloaded, or when fully loaded with the drivers disabled. All devices have a 1/8-unit-load receiver input impedance that allows up to 256 transceivers on the bus. The MAX3082E/MAX3085E/MAX3088E are intended for halfduplex communications, while the MAX3080E/MAX3081E/ MAX3083E/MAX3084E/MAX3086E/MAX3087E are intended for full-duplex communications. The MAX3089E is selectable between half-duplex and full-duplex operation. It also features independently programmable receiver and transmitter output phase via separate pins.
SP3070-3078E中文资料
ELEess otherwise noted VCC = +3.3 ±0.3V, ambient temperature TMIN < TA < TMAX. Typical values are at VCC = 3.3, ambient temperature TA = +25ºC. The ♦ denotes the specifications which apply over the full operating range unless otherwise noted.
5 GND
8 Pin Half Duplex: SP3072E, 250kbps slew limited SP3075E, 500kbps slew limited SP3078E, 16Mbps
Date: 03/28/05
SP3070E - SP3078E Family, ±15kV ESD-Protected, Failsafe RS-485/RS422 Transceivers
■ SP3072E, 3075 and 3078 in Half-Duplex (8 pin)
■ Three applications-optimized speed grades
■ SP3070-72E: 250kbps slew-limited
■ SP3073-75E: 500kbps slew-limited
ABSOLUTE MAXIMUM RATINGS
Continuous Power Dissipation at Ta = 70oC 8-pin SO (derate 5.88mW/oC above +70oC)................................471mW 8-pin PDIP (derate 9.29mW/oC above +70oC)............................727mW 14-pin SO (derate 8.33mW/oC above +70oC).............. .............667mW 14-pin PDIP (derate 10mW/oC above +70oC).................. ..........800mW
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General DescriptionThe MAX3070E–MAX3079E 3.3V, ±15kV ESD-protected,RS-485/RS-422 transceivers feature one driver and one receiver. These devices include fail-safe circuitry, guar-anteeing a logic-high receiver output when receiver inputs are open or shorted. The receiver outputs a logic high if all transmitters on a terminated bus are disabled (high impedance). The MAX3070E–MAX3079E include a hot-swap capability to eliminate false transitions on the bus during power-up or hot insertion.The MAX3070E/MAX3071E/MAX3072E feature reduced slew-rate drivers that minimize EMI and reduce reflec-tions caused by improperly terminated cables, allowing error-free data transmission up to 250kbps. The MAX3073E/MAX3074E/MAX3075E also feature slew-rate-limited drivers but allow transmit speeds up to 500kbps. The MAX3076E/MAX3077E/MAX3078E driver slew rates are not limited, making transmit speeds up to 16Mbps possible. The MAX3079E slew rate is pin selectable for 250kbps, 500kbps, and 16Mbps.The MAX3072E/MAX3075E/MAX3078E are intended for half-duplex communications, and the MAX3070E/MAX3071E/MAX3073E/MAX3074E/MAX3076E/MAX3077E are intended for full-duplex communications. The MAX3079E is selectable for half-duplex or full-duplex operation. It also features independently programmable receiver and transmitter output phase through separate pins.The MAX3070E–MAX3079E transceivers draw 800µA of supply current when unloaded or when fully loaded with the drivers disabled. All devices have a 1/8-unit load receiver input impedance, allowing up to 256transceivers on the bus.ApplicationsLighting Systems Industrial Control Telecom Security Systems InstrumentationFeatureso 3.3V Operationo Electrostatic Discharge (ESD) Protection for RS-485 I/O Pins±15kV Human Body Model o True Fail-Safe Receiver While Maintaining EIA/TIA-485 Compatibility o Hot-Swap Input Structure on DE and RE o Enhanced Slew-Rate Limiting Facilitates Error-Free Data Transmission(MAX3070E–MAX3075E/MAX3079E)o Low-Current Shutdown Mode (Except MAX3071E/MAX3074E/MAX3077E)o Pin-Selectable Full-/Half-Duplex Operation (MAX3079E)o Phase Controls to Correct for Twisted-Pair Reversal (MAX3079E)o Allow Up to 256 Transceivers on the Bus o Available in Industry-Standard 8-Pin SO PackageMAX3070E–MAX3079E+3.3V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers________________________________________________________________Maxim Integrated Products 1Ordering Information19-2668; Rev 1; 1/03For pricing, delivery, and ordering information,please contact Maxim/Dallas Direct!at 1-888-629-4642, or visit Maxim’s website at .Selector Guide, Pin Configurations, and Typical Operating Circuits appear at end of data sheet.Ordering Information continued at end of data sheet.M A X 3070E –M A X 3079E+3.3V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers 2_______________________________________________________________________________________ABSOLUTE MAXIMUM RATINGSDC ELECTRICAL CHARACTERISTICSStresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.(All voltages referenced to GND)Supply Voltage (V CC ).............................................................+6V Control Input Voltage (RE , DE, SLR,H/F , TXP, RXP)......................................................-0.3V to +6V Driver Input Voltage (DI)...........................................-0.3V to +6V Driver Output Voltage (Z, Y, A, B).............................-8V to +13V Receiver Input Voltage (A, B)....................................-8V to +13V Receiver Input VoltageFull Duplex (A, B)..................................................-8V to +13V Receiver Output Voltage (RO)....................-0.3V to (V CC + 0.3V)Driver Output Current.....................................................±250mAContinuous Power Dissipation (T A = +70°C)8-Pin SO (derate 5.88mW/°C above +70°C).................471mW 8-Pin Plastic DIP (derate 9.09mW/°C above +70°C).....727mW 14-Pin SO (derate 8.33mW/°C above +70°C)...............667mW 14-Pin Plastic DIP (derate 10.0mW/°C above +70°C)...800mW Operating Temperature RangesMAX307_EE_ _................................................-40°C to +85°C MAX307_EA_ _..............................................-40°C to +125°C Junction Temperature......................................................+150°C Storage Temperature Range.............................-65°C to +150°C Lead Temperature (soldering, 10s).................................+300°CMAX3070E–MAX3079E+3.3V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers_______________________________________________________________________________________3DC ELECTRICAL CHARACTERISTICS (continued)Note 1:All currents into the device are positive. All currents out of the device are negative. All voltages are referred to deviceground, unless otherwise noted.Note 2:∆V OD and ∆V OC are the changes in V OD and V OC , respectively, when the DI input changes state.Note 3:The short-circuit output current applies to peak current just prior to foldback current limiting. The short-circuit foldback out-put current applies during current limiting to allow a recovery from bus contention.M A X 3070E –M A X 3079E+3.3V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers 4_______________________________________________________________________________________DRIVER SWITCHING CHARACTERISTICSMAX3070E/MAX3071E/MAX3072E/MAX3079E with SRL = UNCONNECTED (250kbps)RECEIVER SWITCHING CHARACTERISTICSMAX3070E/MAX3071E/MAX3072E/MAX3079E with SRL = UNCONNECTED (250kbps)(V CC = 3.3V ±10%, T A = T MIN to T MAX , unless otherwise noted. Typical values are at V CC = 3.3V and T A = +25°C.)MAX3070E–MAX3079E+3.3V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers_______________________________________________________________________________________5DRIVER SWITCHING CHARACTERISTICSMAX3073E/MAX3074E/MAX3075E/MAX3079E with SRL = V CC (500kbps)RECEIVER SWITCHING CHARACTERISTICSMAX3073E/MAX3074E/MAX3075E/MAX3079E with SRL = V CC (500kbps)M A X 3070E –M A X 3079E+3.3V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers 6_______________________________________________________________________________________DRIVER SWITCHING CHARACTERISTICSMAX3076E/MAX3077E/MAX3078E/MAX3079E with SRL = GND (16Mbps)RECEIVER SWITCHING CHARACTERISTICSMAX3076E/MAX3077E/MAX3078E/MAX3079E with SRL = GND (16Mbps)MAX3070E–MAX3079E+3.3V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers_______________________________________________________________________________________7SUPPLY CURRENT vs. TEMPERATURETEMPERATURE (°C)S U P P L Y C U R R E N T (m A )100755025-250.60.70.80.91.00.5-50125OUTPUT CURRENTvs. RECEIVER OUTPUT HIGH VOLTAGEM A X 3070E t o c 02OUTPUT HIGH VOLTAGE (V)O U T P U T C U R R E N T (m A )3.02.52.01.51.00.55101520253000 3.5OUTPUT CURRENTvs. RECEIVER OUTPUT LOW VOLTAGEM A X 3070E t o c 03OUTPUT HIGH VOLTAGE (V)O U T P U T C U R R E N T (m A )3.02.52.01.51.00.551015202530350 3.5RECEIVER OUTPUT HIGH VOLTAGEvs. TEMPERATURETEMPERATURE (°C)O U T P U T H I G H V O L T A G E (V )100755025-253.053.103.153.203.253.303.00-50125RECEIVER OUTPUT LOW VOLTAGEvs. TEMPERATURETEMPERATURE (°C)O U T P U T L O W V O L T A G E (V )10075-25025500.10.20.30.40.50.60.70.8-50125DRIVER OUTPUT CURRENTvs. DIFFERENTIAL OUTPUT VOLTAGEM A X 3070E t o c 06DIFFERENTIAL OUTPUT VOLTAGE (V)O U T P U T C U R R E N T (m A )3.02.51.5 2.01.00.51020304050607080901000 3.5DRIVER DIFFERENTIAL OUTPUT VOLTAGEvs. TEMPERATURETEMPERATURE (°C)D I F FE R E N T I A L O U T P U T V O L T A G E (V )100752550-251.701.801.902.002.102.202.302.402.502.601.60-50125OUTPUT CURRENTvs. TRANSMITTER OUTPUT HIGH VOLTAGEOUTPUT HIGH VOLTAGE (V)O U T P U T C U R R E N T (m A )32-6-5-4-2-10-31204060801001201401600-74OUTPUT CURRENTvs. TRANSMITTER OUTPUT LOW VOLTAGEOUTPUT LOW VOLTAGE (V)O U T P U T C U R R E N T (m A )10864220406080100120140160180012Typical Operating Characteristics(V CC = 3.3V, T A = +25°C, unless otherwise noted.)M A X 3070E –M A X 3079E+3.3V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers 8_______________________________________________________________________________________SHUTDOWN CURRENT vs. TEMPERATURETEMPERATURE (°C)S H U T D O W N C U R R E N T (µA )100752550-250.20.40.60.81.01.21.41.61.82.00-50125DRIVER PROPAGATION DELAY vs. TEMPERATURE (250kbps)TEMPERATURE (°C)D R I VE R P R O P A G A T I O N D E L A Y (n s )100755025-256007008009001000500-50125DRIVER PROPAGATION DELAY vs. TEMPERATURE (500kbps)TEMPERATURE (°C)D R I V ER P R O P A G A T I O N D E L A Y (n s )100755025-25250300350400450500200-50125DRIVER PROPAGATION DELAY vs. TEMPERATURE (16Mbps)TEMPERATURE (°C)D R I VE R P R O P A G A T I O N D E L A Y (n s )100755025-25510152025300-50125RECEIVER PROPAGATION DELAYvs. TEMPERATURE (250kbps AND 500kbps)TEMPERATURE (°C)D R IV E R P R O P A G A T I O N D E L A Y (n s )100755025-253060901201500-50125RECEIVER PROPAGATION DELAY vs. TEMPERATURE (16Mbps)TEMPERATURE (°C)R E C E I V E R P R O P A G A T I O N D E L A Y (n s )1007550250-25102030405060700-50125DRIVER PROPAGATION DELAY (250kbps)MAX3070E toc161µs/div V Y - V Z 2V/div DI 2V/divRECEIVER PROPAGATION DELAY(250kbps AND 500kbps)MAX3070E toc17200ns/divV A - V B 1V/divRO 2V/divTypical Operating Characteristics (continued)(V CC = 3.3V, T A = +25°C, unless otherwise noted.)MAX3070E–MAX3079E+3.3V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers_______________________________________________________________________________________9Test Circuits and WaveformsDRIVER PROPAGATION DELAY (500kbps)MAX3070E toc18400ns/div V Y - V Z 2V/divDI 2V/divDRIVER PROPAGATION DELAY (16Mbps)MAX3070E toc1910ns/div V Z 1V/divV Y 1V/divDI 2V/divRECEIVER PROPAGATION DELAY (16Mbps)MAX3070E toc2020ns/divV A 1V/divV B 1V/divRO 2V/divTypical Operating Characteristics (continued)(V CC = 3.3V, T A = +25°C, unless otherwise noted.)Figure 2. Driver Timing Test CircuitFigure 3. Driver Propagation DelaysM A X 3070E –M A X 3079E+3.3V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers 10______________________________________________________________________________________Test Circuits and Waveforms (continued)DHZ DZH DZH(SHDN)Figure 5. Driver Enable and Disable Times (t DZL , t DLZ , t DLZ(SHDN))MAX3070E–MAX3079E+3.3V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 TransceiversTest Circuits and Waveforms (continued)Figure 6. Receiver Propagation Delay Test CircuitFigure 8. Receiver Enable and Disable TimesM A X 3070E –M A X 3079E+3.3V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 TransceiversMAX3070E–MAX3079E+3.3V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 TransceiversMAX3070E/MAX3073E/MAX3076EPin Description (continued)MAX3071E/MAX3074E/MAX30767EFunction TablesM A X 3070E –M A X 3079E+3.3V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers MAX3072E/MAX3075E/MAX3078EFunction Tables (continued)MAX3079EDetailed Description The MAX3070E–MAX3079E high-speed transceivers for RS-485/RS-422 communication contain one driver and one receiver. These devices feature fail-safe circuitry, which guarantees a logic-high receiver output when the receiver inputs are open or shorted, or when they are connected to a terminated transmission line with all dri-vers disabled (see the Fail-Safe section). The MAX3070E/MAX3072E/MAX3073E/MAX3075E/ MAX3076E/MAX3078E/MAX3079E also feature a hot-swap capability allowing line insertion without erro-neous data transfer (see the Hot Swap Capability section). The MAX3070E/MAX3071E/MAX3072E feature reduced slew-rate drivers that minimize EMI and reduce reflections caused by improperly terminated cables, allowing error-free data transmission up to 250kbps. The MAX3073E/MAX3074E/MAX3075E also offer slew-rate limits allowing transmit speeds up to 500kbps. The MAX3076E/MAX3077E/MAX3078Es’ dri-ver slew rates are not limited, making transmit speeds up to 16Mbps possible. The MAX3079E’s slew rate is selectable between 250kbps, 500kbps, and 16Mbps by driving a selector pin with a three-state driver.The MAX3072E/MAX3075E/MAX3078E are half-duplex transceivers, while the MAX3070E/MAX3071E/ MAX3073E/MAX3074E/MAX3076E/MAX3077E are full-duplex transceivers. The MAX3079E is selectable between half- and full-duplex communication by driving a selector pin (SRL) high or low, respectively.All devices operate from a single 3.3V supply. Drivers are output short-circuit current limited. Thermal-shutdown cir-cuitry protects drivers against excessive power dissipa-tion. When activated, the thermal-shutdown circuitry places the driver outputs into a high-impedance state.Receiver Input Filtering The receivers of the MAX3070E–MAX3075E, and the MAX3079E when operating in 250kbps or 500kbps mode, incorporate input filtering in addition to input hysteresis. This filtering enhances noise immunity with differential signals that have very slow rise and fall times. Receiver propagation delay increases by 25% due to this filtering.Fail-Safe The MAX3070E family guarantees a logic-high receiver output when the receiver inputs are shorted or open, or when they are connected to a terminated transmission line with all drivers disabled. This is done by setting the receiver input threshold between -50mV and -200mV. If the differential receiver input voltage (A - B) is greater than or equal to -50mV, RO is logic high. If A - B is less than or equal to -200mV, RO is logic low. In the case ofa terminated bus with all transmitters disabled, the receiver’s differential input voltage is pulled to 0V bythe termination. With the receiver thresholds of theMAX3070E family, this results in a logic high with a50mV minimum noise margin. Unlike previous fail-safe devices, the -50mV to -200mV threshold complies withthe ±200mV EIA/TIA-485 standard.Hot-Swap Capability (Except MAX3071E/MAX3074E/MAX3077E)Hot-Swap InputsWhen circuit boards are inserted into a hot, or pow-ered, backplane, differential disturbances to the databus can lead to data errors. Upon initial circuit board insertion, the data communication processor under-goes its own power-up sequence. During this period,the processor’s logic-output drivers are high imped-ance and are unable to drive the DE and RE inputs ofthese devices to a defined logic level. Leakage cur-rents up to ±10µA from the high-impedance state of the processor’s logic drivers could cause standard CMOS enable inputs of a transceiver to drift to an incorrectlogic level. Additionally, parasitic circuit board capaci-tance could cause coupling of V CC or GND to the enable inputs. Without the hot-swap capability, these factors could improperly enable the transceiver’s driveror receiver.When V CC rises, an internal pulldown circuit holds DElow and RE high. After the initial power-up sequence,the pulldown circuit becomes transparent, resetting thehot-swap tolerable input.Hot-Swap Input CircuitryThe enable inputs feature hot-swap capability. At theinput there are two NMOS devices, M1 and M2 (Figure 9). When V CC ramps from zero, an internal 10µstimer turns on M2 and sets the SR latch, which alsoturns on M1. Transistors M2, a 500µA current sink, andM1, a 100µA current sink, pull DE to GND through a5kΩresistor. M2 is designed to pull DE to the disabledstate against an external parasitic capacitance up to100pF that can drive DE high. After 10µs, the timer deactivates M2 while M1 remains on, holding DE low against three-state leakages that can drive DE high. M1 remains on until an external source overcomes the required input current. At this time, the SR latch resetsand M1 turns off. When M1 turns off, DE reverts to a standard, high-impedance CMOS input. Whenever V CCdrops below 1V, the hot-swap input is reset.For RE there is a complementary circuit employing two PMOS devices pulling RE to V CC.MAX3070E–MAX3079E+3.3V, ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 TransceiversM A X 3070E –M A X 3079EMAX3079E ProgrammingThe MAX3079E has several programmable operating modes. Transmitter rise and fall times are programma-ble, resulting in maximum data rates of 250kbps,500kbps, and 16Mbps. To select the desired data rate,drive SRL to one of three possible states by using a three-state driver: V CC , GND, or unconnected. F or 250kbps operation, set the three-state device in high-impedance mode or leave SRL unconnected. F or 500kbps operation, drive SRL high or connect it to V CC .F or 16Mbps operation, drive SRL low or connect it to GND. SRL can be changed during operation without interrupting data communications.Occasionally, twisted-pair lines are connected backward from normal orientation. The MAX3079E has two pins that invert the phase of the driver and the receiver to correct this problem. F or normal operation, drive TXP and RXP low, connect them to ground, or leave them unconnect-ed (internal pulldown). To invert the driver phase, drive TXP high or connect it to V CC . To invert the receiver phase, drive RXP high or connect it to V CC . Note that the receiver threshold is positive when RXP is high.The MAX3079E can operate in full- or half-duplex mode. Drive the H/F pin low, leave it unconnected (internal pulldown), or connect it to GND for full-duplexoperation. Drive H/F high for half-duplex operation. In full-duplex mode, the pin configuration of the driver and receiver is the same as that of a MAX3070E. In half-duplex mode, the receiver inputs are switched to the driver outputs, connecting outputs Y and Z to inputs A and B, respectively. In half-duplex mode, the internal full-duplex receiver input resistors are still connected to pins 11 and 12.±15kV ESD ProtectionAs with all Maxim devices, ESD-protection structures are incorporated on all pins to protect against electro-static discharges encountered during handling and assembly. The driver outputs and receiver inputs of the MAX3070E family of devices have extra protection against static electricity. Maxim ’s engineers have devel-oped state-of-the-art structures to protect these pins against ESD of ±15kV without damage. The ESD struc-tures withstand high ESD in all states: normal operation,shutdown, and powered down. After an ESD event, the MAX3070E –MAX3079E keep working without latchup or damage.ESD protection can be tested in various ways. The transmitter outputs and receiver inputs of the MAX3070E –MAX3079E are characterized for protection to the following limits:•±15kV using the Human Body Model•±6kV using the Contact Discharge method specified in IEC 1000-4-2ESD Test ConditionsESD performance depends on a variety of conditions.Contact Maxim for a reliability report that documents test setup, test methodology, and test results.Human Body ModelFigure 10a shows the Human Body Model, and Figure 10b shows the current waveform it generates when dis-charged into a low impedance. This model consists of a 100pF capacitor charged to the ESD voltage of interest,which is then discharged into the test device through a 1.5k Ωresistor.IEC 1000-4-2The IEC 1000-4-2 standard covers ESD testing and performance of finished equipment. However, it does not specifically refer to integrated circuits. The MAX3070E family of devices helps you design equip-ment to meet IEC 1000-4-2, without the need for addi-tional ESD-protection components.The major difference between tests done using the Human Body Model and IEC 1000-4-2 is higher peak+3.3V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceiverscurrent in IEC 1000-4-2, because series resistance is lower in the IEC 1000-4-2 model. Hence, the ESD with-stand voltage measured to IEC 1000-4-2 is generally lower than that measured using the Human Body Model.F igure 10c shows the IEC 1000-4-2 model, and F igure 10d shows the current waveform for IEC 1000-4-2 ESD Contact Discharge test.The air-gap test involves approaching the device with a charged probe. The contact-discharge method connects the probe to the device before the probe is energized.Machine Model The machine model for ESD tests all pins using a 200pF storage capacitor and zero discharge resis-tance. The objective is to emulate the stress caused when I/O pins are contacted by handling equipment during test and assembly. Of course, all pins require this protection, not just RS-485 inputs and outputs.Applications Information256 Transceivers on the BusThe standard RS-485 receiver input impedance is 12kΩ(1-unit load), and the standard driver can drive up to 32-unit loads. The MAX3070E family of transceivers has a1/8-unit load receiver input impedance (96kΩ), allowingup to 256 transceivers to be connected in parallel on one communication line. Any combination of these devicesas well as other RS-485 transceivers with a total of 32-unit loads or fewer can be connected to the line.Reduced EMI and ReflectionsThe MAX3070E/MAX3071E/MAX3072E feature reducedslew-rate drivers that minimize EMI and reduce reflec-tions caused by improperly terminated cables, allowingerror-free data transmission up to 250kbps. TheMAX3073E/MAX3074E/MAX3075E offer higher driver output slew-rate limits, allowing transmit speeds up to500kbps. The MAX3079E with SRL = V CC or uncon-nected, are slew-rate limited. With SRL unconnected,the MAX3079E error-free data transmission is up to250kbps; with SRL connected to V CC the data transmit speeds up to 500kbps.MAX3070E–MAX3079E+3.3V, ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 TransceiversM A X 3070E –M A X 3079ELow-Power Shutdown Mode (Except MAX3071E/MAX3074E/MAX3077E)Low-power shutdown mode is initiated by bringing both RE high and DE low. In shutdown, the devices typically draw only 50nA of supply current.RE and DE can be driven simultaneously; the parts are guaranteed not to enter shutdown if RE is high and DE is low for less than 50ns. If the inputs are in this state for at least 600ns, the parts are guaranteed to enter shutdown.Enable times t ZH and t ZL (see the Switching Characteristics section) assume the part was not in a low-power shutdown state. Enable times t ZH(SHDN)and t ZL(SHDN)assume the parts were shut down. It takes drivers and receivers longer to become enabled from low-power shutdown mode (t ZH(SHDN), t ZL(SHDN)) than from driver/receiver-disable mode (t ZH , t ZL ).Driver Output ProtectionTwo mechanisms prevent excessive output current and power dissipation caused by faults or by bus contention.The first, a foldback current limit on the output stage,provides immediate protection against short circuits over the whole common-mode voltage range (see the Typical Operating Characteristics ). The second, a thermal-shut-down circuit, forces the driver outputs into a high-imped-ance state if the die temperature becomes excessive.Line LengthThe RS-485/RS-422 standard covers line lengths up to 4000ft. F or line lengths greater than 4000ft, use the repeater application shown in Figure 11.Typical ApplicationsThe MAX3072E/MAX3075E/MAX3078E/MAX3079E transceivers are designed for bidirectional data commu-nications on multipoint bus transmission lines. F igures 12 and 13 show typical network applications circuits. To minimize reflections, terminate the line at both ends in its characteristic impedance, and keep stub lengths off the main line as short as possible. The slew-rate-lim-ited MAX3072E/MAX3075E and the two modes of the MAX3079E are more tolerant of imperfect termination.Chip InformationTRANSISTOR COUNT: 1228PROCESS: BiCMOS+3.3V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 TransceiversFigure 11. Line Repeater for MAX3070E/MAX3071E/MAX3073E/MAX3074E/MAX3076E/MAX3077E/MAX3079E in Full-Duplex Mode+3.3V, ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 TransceiversMAX3070E–MAX3079EM A X 3070E –M A X 3079E+3.3V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 TransceiversPin Configurations and Typical Operating CircuitsMAX3070E–MAX3079E+3.3V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers______________________________________________________________________________________21Pin Configurations and Typical Operating Circuits (continued)M A X 3070E –M A X 3079E+3.3V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers 22______________________________________________________________________________________Ordering Information (continued)MAX3070E–MAX3079E+3.3V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers______________________________________________________________________________________23Package Information(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,go to /packages .)M A X 3070E –M A X 3079E+3.3V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers 24______________________________________________________________________________________Package Information (continued)(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,go to /packages .)MAX3070E–MAX3079E+3.3V , ±15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 TransceiversMaxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. N o circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________25©2003 Maxim Integrated ProductsPrinted USAis a registered trademark of Maxim Integrated Products.Package Information (continued)(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,go to /packages .)。