MAX16000ETC-T中文资料
MEMORY存储芯片MAX1680ESA+T中文规格书
M A X 1680/M A X 16812_______________________________________________________________________________________ABSOLUTE MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS (Typical Operating Circuits (inverter configuration), FSEL = LV = GND, V IN = 5V, C1 = C2 = 10µF (MAX1680), C1 = C2 = 2.2µF (MAX1681), T A = 0°C to +85°C , unless otherwise noted. Typical values are at T A = +25°C.)Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.IN..............................................................................-0.3V to +6V LV....................................................(V OUT - 0.3V) to (V IN + 0.3V)CAP+...........................................................-0.3V to (V IN + 0.3V)SHDN, FSEL......................................(V LV - 0.3V) to (V IN + 0.3V)OUT, CAP-..................................................................-6V to 0.3V Continuous Output Current ..............................................135mA Output Short-Circuit Duration to GND (Note 1) ...................1sec Continuous Power Dissipation (T A = +70°C)SO (derate 5.88mW/°C above +70°C)..........................471mW Operating Temperature Range ...........................-40°C to +85°C Junction Temperature......................................................+150°C Storage Temperature Range.............................-65°C to +160°C Lead Temperature (soldering, 10sec).............................+300°C Note 1:Shorting OUT to IN may damage the device and should be avoided.找MEMORY 、二三极管上美光存储ELECTRICAL CHARACTERISTICS(Typical Operating Circuits (inverter configuration), FSEL = LV = GND, V IN = 5V, C1 = C2 = 10µF (MAX1680), C1 = C2 = 2.2µF (MAX1681), T A = -40°C to +85°C , unless otherwise noted.) (Note 4)MAX1680/MAX1681125mA, Frequency-Selectable, Switched-Capacitor Voltage Converters_______________________________________________________________________________________3ELECTRICAL CHARACTERISTICS (continued)(Typical Operating Circuits (inverter configuration), FSEL = LV = GND, V IN = 5V, C1 = C2 = 10µF (MAX1680), C1 = C2 = 2.2µF (MAX1681), T A = 0°C to +85°C , unless otherwise noted. Typical values are at T A = +25°C.)Note 2:C1 and C2 are low-ESR (<0.2Ω) capacitors. Capacitor ESR adds to the circuit’s output resistance. Using capacitors withhigher ESR reduces output voltage and efficiency. The specified output resistance includes the C1 and C2 0.2ΩESR. Note 3:The typical threshold for V INPUT other than +5V is 0.35V INPUT (V IL = V IH ).Note 4:Specifications to -40°C are guaranteed by design, not production tested.。
MAX1667EAP-T中文资料
General DescriptionThe MAX1667 provides the power control necessary to charge batteries of any chemistry. All charging functions are controlled through the Intel System Management Bus (SMBus™) interface. The SMBus 2-wire serial interface sets the charge voltage and current and provides thermal status information. The MAX1667 functions as a Level 2charger, compliant with the Duracell/Intel Smart Battery Charger Specification.In addition to the feature set required for a Level 2 charg-er, the MAX1667 generates interrupts to signal the host when power is applied to the charger or when a battery is installed or removed. Additional status bits allow the host to check whether the charger has enough input voltage,and whether the voltage on or current into the battery is being regulated. This allows the host to determine when lithium-ion (Li+) batteries have completed the charge with-out interrogating the battery.The MAX1667 is available in a 20-pin SSOP with a 2mm profile height.________________________ApplicationsNotebook Computers Charger Base Stations Personal Digital AssistantsPhones____________________________Featureso Charges Any Battery Chemistry: Li+, NiCd, NiMH, Lead Acid, etc.o SMBus 2-Wire Serial Interfaceo Compliant with Duracell/Intel Smart Battery Charger Specification Rev. 1.0o 4A, 3A, or 1A (max) Battery Charge Current o 5-Bit Control of Charge Current o Up to 18.4V Battery Voltage o 11-Bit Control of Voltage o ±1% Voltage Accuracy o Up to +28V Input Voltageo Battery Thermistor Fail-Safe Protection o Greater than 95% Efficiency o Synchronous RectifierMAX1667Chemistry-Independent,Level 2 Smart Battery Charger________________________________________________________________Maxim Integrated Products1Typical Operating CircuitSMBus is a trademark of Intel Corp.19-1488; Rev 1; 5/03Pin Configuration appears at end of data sheet.For pricing, delivery, and ordering information,please contact Maxim/Dallas Direct!at 1-888-629-4642, or visit Maxim’s website at .M A X 1667Chemistry-Independent,Level 2 Smart Battery Charger 2_______________________________________________________________________________________ABSOLUTE MAXIMUM RATINGSELECTRICAL CHARACTERISTICS(V DCIN = 18V, internal reference, 1µF capacitor at REF, 1µF capacitor at VL, T A = 0°C to +85°C , unless otherwise noted. Typical values are at T A = +25°C, unless otherwise noted.)Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.DCIN to AGND .......................................................-0.3V to +30V BST to AGND..........................................................-0.3V to +36V BST, DHI to LX..........................................................-0.3V to +6V LX, IOUT to AGND..................................................-0.3V to +30V THM, CCI, CCV, DACV, REF,DLO to AGND.............................................-0.3V to (VL + 0.3V)VL, SEL, INT , SDA, SCL to AGND............................-0.3V to +6V BATT, CS+ to AGND..............................................-0.3V to +20VPGND to AGND.....................................................-0.3V to +0.3V SDA, INT Current................................................................50mA VL Current...........................................................................50mA Continuous Power Dissipation (T A = +70°C)SSOP (derate 8mW/°C above +70°C)..........................640mW Operating Temperature Range ...........................-40°C to +85°C Storage Temperature Range.............................-60°C to +150°C Lead Temperature (soldering, 10s).................................+300°CMAX1667Chemistry-Independent,Level 2 Smart Battery Charger_______________________________________________________________________________________3ELECTRICAL CHARACTERISTICS (continued)(V DCIN = 18V, internal reference, 1µF capacitor at REF, 1µF capacitor at VL, T A = 0°C to +85°C , unless otherwise noted. Typical valuesNote 1:When DCIN is less than 4V, VL is less than 3.2V, causing the battery current to be typically 2µA (CS plus BATT inputcurrent).M A X 1667Chemistry-Independent,Level 2 Smart Battery Charger 4_______________________________________________________________________________________ELECTRICAL CHARACTERISTICS(V DCIN = 18V, internal reference, 1µF capacitor at REF, 1µF capacitor at VL, T A = -40°C to +85°C ,unless otherwise noted.Typical values are at T A = +25°C. Limits over this temperature range are guaranteed by design.)MAX1667Chemistry-Independent,Level 2 Smart Battery Charger_______________________________________________________________________________________5TIMING CHARACTERISTICS (Figures 1 and 2)(T A = 0°C to +85°C , unless otherwise noted.)TIMING CHARACTERISTICS (Figures 1 and 2)(T= -40°C to +85°C , unless otherwise noted. Limits over this temperature range are guaranteed by design.)M A X 1667Chemistry-Independent,Level 2 Smart Battery Charger 6_______________________________________________________________________________________Figure 2. SMBus Serial-Interface Timing—AcknowledgeFigure 1. SMBus Serial-Interface Timing—AddressMAX1667Chemistry-Independent,Level 2 Smart Battery Charger_______________________________________________________________________________________75.205.305.255.405.355.455.50105152025VL LOAD REGULATIONLOAD CURRENT (mA)V L (V )5.355.385.375.365.405.395.445.435.425.415.45-40-2020406080100VL vs. TEMPERATURETEMPERATURE (°C)V L (V ) 4.064.104.074.084.094.1100.80.60.20.4 1.0 1.2 1.4 1.6 1.8 2.0V REF LOAD REGULATIONM A X 1667 T O C 06LOAD CURRENT (mA)V R E F (V )5.3505.3755.4005.4255.450VL LINE REGULATIONV DCIN (V)V L (V )101552025305V/div10V LOAD TRANSIENT(WITH CHANGE IN REGULATION LOOP)MAX1667TOC02V DCIN = 18VChargingVoltage() = 12,000mV ChargingCurrent() = 1500mA1ms/divV BATTCCICCI CCI50mV/div2V1A500mA/divCCV CCVCCV I LOADAVERAGED MEASUREMENT 5V/div10V LOAD TRANSIENT(VOLTAGE REGULATION WITH CURRENT LIMIT)V DCIN = 18VChargingVoltage() = 12,000mV ChargingCurrent() = 1500mA500µs/div200mV/div1.4V1A 1A/div__________________________________________Typical Operating Characteristics(Circuit of Figure 7, T A = +25°C, unless otherwise noted.)M A X 1667Chemistry-Independent,Level 2 Smart Battery Charger 8_______________________________________________________________________________________-1.0-0.6-0.8-0.2-0.40.200.40.80.61.004k 6k 8k 2k 10k 12k 14k 18k 16k 20kBATT VOLTAGE ERROR vs. ChargingVoltage() CODEChargingVoltage() CODEB A T T V O L T A G E E R R O R (%)-5510151000200030005001500250035004000LOAD CURRENT ERRORCODEB A T TC U R R E N T E R R O R (%)Typical Operating Characteristics (continued)(Circuit of Figure 7, T A = +25°C, unless otherwise noted.)1000.01101.00.10.001OUTPUT V-I CHARACTERISTIC (SWITCHING REGULATOR)LOAD CURRENT (mA)D R O P I N B A T T O U T P U T V O L T A GE (%)051348OUTPUT V-I CHARACTERISTIC(LINEAR SOURCE)V IOUT (V)I I O U T (m A)2674.0804.1004.0854.0904.0954.110-404020-206080100V REF vs. TEMPERATURETEMPERATURE (°C)V R E F (V )4.105507055606510002000100030004000EFFICIENCY vs. LOAD CURRENT(VOLTAGE REGULATION)LOAD CURRENT (mA)E F F I C I E N C Y (%)758085909550705560651008624101218EFFICIENCY vs. BATT VOLTAGE (CURRENT REGULATION)BATT VOLTAGE (V)E F F I C I E N C Y (%)75808590951416MAX1667Chemistry-Independent,Level 2 Smart Battery Charger_______________________________________________________________________________________9Pin DescriptionM A X 1667Chemistry-Independent,Level 2 Smart Battery Charger Smart Battery Charging SystemA smart battery charging system, at a minimum, con-sists of a smart battery and smart battery charger com-patible with the Smart Battery System specifications using Intel’s system management bus (SMBus).Smart Battery System Block DiagramsA system may use one or more smart batteries. The block diagram of a smart battery charging system shown in Figure 3 depicts a single battery system. This is typically found in notebook computers, video cam-eras, cellular phones, and other portable electronic equipment.Another possibility is a system that uses two or more smart batteries. A block diagram for a system featuring multiple batteries is shown in Figure 4. The smart bat-tery selector is used to connect batteries to either the smart battery charger or the system, or to disconnect them, as appropriate. For a standard smart battery, the following connections must be made: power (the bat-tery’s positive and negative terminals), SMBus (clock and data), and safety signal (resistance, typically tem-perature dependent). Additionally, the system host must be able to query any battery in the system so it can display the state of all batteries present in the sys-tem.Figure 4 shows a two-battery system where Battery 2 is being charged while Battery 1 is powering the system.This configuration may be used to “condition” Battery 1, allowing it to be fully discharged prior to recharge.Smart Battery Charger TypesTwo types of smart battery chargers are defined: Level 2 and Level 3. All smart battery chargers communicate with the smart battery using the SMBus; the two types differ in their SMBus communication mode and in whether they modify the charging algorithm of the smart battery as shown in Table 1. Level 3 smart bat-tery chargers are supersets of Level 2 chargers and as such support all Level 2 charger commands.Figure 3. Typical Single Smart Battery System10______________________________________________________________________________________MAX1667Chemistry-Independent,Level 2 Smart Battery ChargerLevel 2 Smart Battery ChargerThe Level 2 or “smart-battery-controlled” smart battery charger interprets the smart battery’s critical warningmessages, and operates as an SMBus slave device that responds to ChargingVoltage() and Charging-Current() messages sent to it by a smart battery. The charger is obliged to adjust its output characteristics in direct response to the messages it receives from the battery. In Level 2 charging, the smart battery is com-pletely responsible for initiating communication and for providing the charging algorithm to the charger. The smart battery is in the best position to tell the smart bat-tery charger how it needs to be charged. The charging algorithm in the battery may request a static charge condition or may choose to periodically adjust the smart battery charger’s output to meet its present needs. A Level 2 smart battery charger is truly chem-istry independent, and since it is defined as an SMBus slave device only, it is relatively inexpensive and easy to implement.Table 1. Charger Type by SMBus Mode and Charge Algorithm SourceNote:Level 1 smart battery chargers are defined in the ver-sion 0.95a specification. While they can correctly interpret smart battery end-of-charge messages minimizing over-charge, they do not provide truly chemistry-independent charging. They are no longer defined by the Smart Battery Charger specification and are explicitly not compliant with this and subsequent Smart Battery Charger specifications.Figure 4. Typical Multiple Smart Battery SystemM A X 1667Chemistry-Independent,Level 2 Smart Battery Charger_______________Detailed DescriptionOutput CharacteristicsThe MAX1667 contains both a voltage-regulation loop and a current-regulation loop. Both loops operate inde-pendently of each other. The voltage-regulation loop monitors BATT to ensure that its voltage never exceeds the voltage set point (V0). The current-regulation loop monitors current delivered to BATT to ensure that it never exceeds the current-limit set point (I0). The cur-rent-regulation loop is in control as long as BATT volt-age is below V0. When BATT voltage reaches V0, the current loop no longer regulates, and the voltage-regu-lation loop takes over. Figure 5 shows the V-I character-istic at the BATT pin.Setting V0 and I0Set the MAX1667’s voltage and current-limit set points via the Intel SMBus 2-wire serial interface. The MAX1667’s logic interprets the serial-data stream from the SMBus interface to set internal digital-to-analog con-verters (DACs) appropriately. The power-on-reset value for V0 and I0 is 18.4V and 7mA, respectively. See Digital Section for more information._____________________Analog SectionThe MAX1667 analog section consists of a current-mode pulse-width-modulated (PWM) controller and two transconductance error amplifiers—one for regulating current and the other for regulating voltage. The device uses DACs to set the current and voltage level, which are controlled via the SMBus interface. Since separate amplifiers are used for voltage and current control, bothcontrol loops can be compensated separately for opti-mum stability and response in each state.Whether the MAX1667 is controlling the voltage or cur-rent at any time depends on the battery’s state. If the battery has been discharged, the MAX1667’s output reaches the current-regulation limit before the voltage limit, causing the system to regulate current. As the bat-tery charges, the voltage rises until the voltage limit is reached, and the charger switches to regulating voltage.The transition from current to voltage regulation is done by the charger and need not be controlled by the host.Figure 6 shows the MAX1667 block diagram.Voltage ControlThe internal GMV amplifier controls the MAX1667’s out-put voltage. The voltage at the amplifier’s noninverting input is set by an 11-bit DAC, which is controlled by a ChargingVoltage() command on the SMBus (see Digital Section for more information). The battery voltage is fed to the GMV amplifier through a 5:1 resistive voltage divider. The set voltage ranges between 0 and 18.416V with 16mV resolution. This allows up to four Li+ cells in series to be charged.The GMV amplifier’s output is connected to the CCV pin, which compensates the voltage-regulation loop.Typically, a series-resistor/capacitor combination can be used to form a pole-zero doublet. The pole intro-duced rolls off the gain starting at low frequencies. The zero of the doublet provides sufficient AC gain at mid-frequencies. The output capacitor then rolls off the mid-frequency gain to below 1 to guarantee stability before encountering the zero introduced by the output capaci-tor’s equivalent series resistance (ESR). The GMV amplifier’s output is internally clamped to between one-fourth and three-fourths of the voltage at REF.Current ControlAn internal 7mA linear current source is used in con-junction with the PWM regulator to set the battery charge current. When the current is set to 0, the voltage regulator is on but no current is available. A current set-ting between 1mA and 127mA turns on the linear cur-rent source, providing a maximum of 7mA for trickle charging. For current settings above 127mA, the linear current source is disabled and the charging current is provided by the switching regulator set by the 5-bit cur-rent-control DAC.The GMI amplifier’s noninverting input is driven by a 4:1resistive voltage divider, which is driven by the 5-bit DAC. With the internal 4.096V reference, this input is approximately 1.0V at full scale, and the resolution is 31mV. The current-sense amplifier drives the inverting input to the GMI amplifier. It measures the voltageMAX1667Chemistry-Independent,Level 2 Smart Battery ChargerFigure 6. Functional DiagramM A X 1667Chemistry-Independent,Level 2 Smart Battery Charger across the current-sense resistor (R SEN ) (which is between the CS and BATT pins), amplifies it by approx-imately 5.45, and level shifts it to ground. The full-scale current is approximately 0.16V/R SEN , and the resolution is 5mV/R SEN .The current-regulation loop is compensated by adding a capacitor to the CCI pin. This capacitor sets the current-feedback loop’s dominant pole. The GMI amplifier’s out-put is clamped to between approximately one-fourth and three-fourths of the REF voltage. While the current is in regulation, the CCV voltage is clamped to within 80mV of the CCI voltage. This prevents the battery volt-age from overshooting when the DAC voltage setting is updated. The converse is true when the voltage is in regulation and the current is not at the current DAC set-ting. Since the linear range of CCI or CCV is about 1.5V to 3.5V (about 2V), the 80mV clamp results in a relatively negligible overshoot when the loop switches from volt-age to current regulation or vice versa.PWM ControllerThe battery voltage or current is controlled by the cur-rent-mode, PWM, DC-DC converter controller. This con-troller drives two external N-channel MOSF ETs, which switch the voltage from the input source. This switched voltage feeds an inductor, which filters the switched rec-tangular wave. The controller sets the pulse width of the switched voltage so that it supplies the desired voltage or current to the battery.The heart of the PWM controller is the multi-input com-parator. This comparator sums three input signals to determine the pulse width of the switched signal, set-ting the battery voltage or current. The three signals are the current-sense amplifier’s output, the GMV or GMI error amplifier’s output, and a slope-compensation sig-nal, which ensures that the controller’s internal current-control loop is stable.The PWM comparator compares the current-sense amplifier’s output to the lower output voltage of either the GMV or the GMI amplifier (the error voltage). This current-mode feedback corrects the duty ratio of the switched voltage, regulating the peak battery current and keeping it proportional to the error voltage. Since the average battery current is nearly the same as the peak current, the controller acts as a transconductance amplifier, reducing the effect of the inductor on the out-put filter LC formed by the output inductor and the bat-tery’s parasitic capacitance. This makes stabilizing the circuit easy, since the output filter changes from a com-plex second-order RLC to a first-order RC. To preserve the inner current-control loop’s stability, slope compen-sation is also fed into the comparator. This damps outperturbations in the pulse width at duty ratios greater than 50%.At heavy loads, the PWM controller switches at a fixed frequency and modulates the duty cycle to control the battery voltage or current. At light loads, the DC current through the inductor is not sufficient to prevent the cur-rent from going negative through the synchronous recti-fier (F igure 7, M2). The controller monitors the current through the sense resistor R SEN ; when it drops to zero,the synchronous rectifier turns off to prevent negative current flow.MOSFET DriversThe MAX1667 drives external N-channel MOSF ETs to regulate battery voltage or current. Since the high-side N-channel MOSFET’s gate must be driven to a voltage higher than the input source voltage, a charge pump is used to generate such a voltage. The capacitor C7(F igure 7) charges to approximately 5V through D2when the synchronous rectifier turns on. Since one side of C7 is connected to the LX pin (the source of M1), the high-side driver (DHI) can drive the gate up to the volt-age at BST (which is greater than the input voltage)when the high-side MOSFET turns on.The synchronous rectifier may not be completely replaced by a diode because the BST capacitor charges while the synchronous rectifier is turned on.Without the synchronous rectifier, the BST capacitor may not fully charge, leaving the high-side MOSF ET with insufficient gate drive to turn on. Use a small MOS-F ET, such as a 2N7002, to guarantee that the BST capacitor is allowed to charge. In this case, most of the current at high currents is carried by the Schottky diode and not by the synchronous rectifier.Internal Regulator and ReferenceThe MAX1667 uses an internal low-dropout linear regula-tor to create a 5.4V power supply (VL), which powers its internal circuitry. VL can supply up to 20mA, less than 10mA powers the internal circuitry, and the remaining current can power the external circuitry. The current used to drive the MOSF ETs comes from this supply,which must be considered when calculating how much power can be drawn. To estimate the current required to drive the MOSF ETs, multiply the total gate charge of each MOSF ET by the switching frequency (typically 250kHz). To ensure VL stability, bypass the VL pin with a 1µF or greater capacitor.The MAX1667 has an internal, accurate 4.096V refer-ence voltage. This guarantees a voltage-setting accu-racy of ±1% max. Bypass the reference with a 1µF or greater capacitor.MAX1667Chemistry-Independent,Level 2 Smart Battery ChargerFigure 7. Typical Application CircuitM A X 1667Chemistry-Independent,Level 2 Smart Battery Charger_____________________Digital SectionSMBus InterfaceThe MAX1667 uses serial data to control its operation. The serial interface complies with the SMBus specification (see System Management Bus Specification , from the SBS forum at or from Intel Architecture Labs: 800-253-3696). Charger functionality complies with the Duracell/Intel Smart Charger Specification for a Level 2charger.The MAX1667 uses the SMBus Read-Word and Write-Word protocols to communicate with the battery it is charging, as well as with any host system that monitors the battery to charger communications. The MAX1667acts only as a slave device and never initiates communi-cation on the bus; it receives commands and responds to queries for status information. Figures 8a and 8b show the SMBus Write-Word and Read-Word protocols.Each communication with the MAX1667 begins with the master issuing a START condition, which is a high-to-low transition on SDA while SCL is high (F igure 1).MAX1667Chemistry-Independent,Level 2 Smart Battery ChargerWhen the master has finished communicating with the slave, the master issues a STOP condition, which is a low-to-high transition on SDA while SCL is high. The bus is then free for another transmission. Figures 1 and 2 show timing diagrams for signals on the SMBus inter-face. The address byte, control byte, and data bytes are transmitted between the START and STOP condi-tions. Data is transmitted in 8-bit words, and after each byte either the slave or the master issues an acknowl-edgment (F igure 2); therefore, nine clock cycles are required to transfer each byte. The SDA state is allowed to change only while SCL is low, except for the START and STOP conditions.The MAX1667 7-bit address is preset to 0b0001001.The eighth bit indicates a Write-Word (W = 0) or a Read-Word (R = 1) command. This can also be denot-ed by the hexadecimal number 0x12 for a Write-Word command or a 0x13 for a Read-Word command.The following commands use the Write-Word protocol (F igure 8a): ChargerMode(), ChargingVoltage(),ChargingCurrent(), and AlarmWarning(). The ChargerStatus command uses the Read-Word protocol (Figure 8b).ChargerMode()The ChargerMode() command uses Write-Word protocol (F igure 8a). The command code for ChargerMode() is 0x12 (0b00010010). Table 3 describes the functions of the 16 data bits (D0–D15). Bit 0 refers to the D0 bit in the Write-Word protocol.Whenever the BATTERY_PRESENT status bit (bit 14) of ChargerStatus() is clear, the HOT_STOP bit is set,regardless of any previous ChargerMode() command.To charge a battery that has a thermistor impedance in the HOT range (i.e., THERMISTOR_HOT = 1 and THERMISTOR_UR = 0), the host must use the ChargerMode() command to clear HOT_STOP after the battery is inserted. The HOT_STOP bit returns to its default power-up condition (‘1’) whenever the battery is removed.ChargingVoltage()The ChargingVoltage() command uses Write-Word proto-col (Figure 8a). The command code for ChargingVoltage()is 0x15 (0b00010101). The 16-bit binary number formed by D15–D0 represents the voltage set point (V0) in milli-volts; however, since the MAX1667 has only 16mV of reso-lution in setting V0, the D0, D1, D2, and D3 bits are ignored.The maximum voltage delivered by the MAX1667 is 18.416V, corresponding to a ChargingVoltage() value of 0x47F 0. This is also the floating voltage set by the power-on reset (POR). ChargingVoltage() values above 0x47F 0 deliver the floating voltage and set the VOLT-AGE_OR status bit. Any time the BATTERY_PRESENT status bit is clear, the ChargingVoltage() register returns to its POR state.Figure 9 shows the mapping between V0 (the voltage-regulation-loop set point) and the ChargingVoltage()data.ChargingCurrent()The ChargingCurrent() command uses Write-Word proto-col (Figure 8a). The command code for ChargingCurrent()is 0x14 (0b00010100). The 16-bit binary number formed by D15–D0 represents the current-limit set point (I0) in milliamps (Table 4). Connecting SEL to AGND selects a 0.896A maximum setting for I0. Leaving SEL open selects a 2.944A maximum setting for I0. Connecting SEL to VL selects a 3.968A maximum setting for I0.Two sources of current in the MAX1667 charge the bat-tery: a linear current source begins from IOUT, and a switching regulator controls the current flowing through the current-sense resistor (R1). IOUT provides a trickle-charge current to compensate for battery self-discharge,while the switching regulator provides large currents for fast charging.IOUT sources 7mA, while the switching regulator sources from 128mA to 3968mA with a 5-bit resolution (LSB = 5.12mV /RSENSE = 128mA with a 40m Ωsense resistor). In Table 4, DA4–DA0 denotes the bits in the current DAC code. Table 5 shows the relationship between the value programmed with the Charging-Current() command and IOUT source current. The CCV_LOW comparator checks to see if the output volt-M A X 1667Chemistry-Independent,Level 2 Smart Battery Charger age is too high by comparing CCV to REF /4. If CCV_LOW = 1 (when CCV < REF /4), IOUT shuts off.This prevents the output voltage from exceeding the voltage set point specified by the ChargingVoltage()register. VOLTAGE_NOTREG = 1 whenever the internal clamp pulls down on CCV. (The internal clamp pulls down on CCV to keep its voltage close to CCI’s volt-age.)With the switching regulator on, the current through R1(Figure 7) is regulated by sensing the average voltage between CS and BATT. F igure 10 shows the relation-ship between the ChargingCurrent() data and the aver-age voltage between CS and BATT.When the switching regulator is off, DHI is forced to LX and DLO is forced to ground. This prevents current from flowing through inductor L1. Table 6 shows the relationship between the ChargingCurrent() register value and the switching regulator current DAC code (DA4–DA0).To ensure that the actual output current matches the data value programmed with the ChargingCurrent()command, R1 should be as close as possible to 40m Ω.The SEL pin setting affects the full-scale current but not the step size. ChargingCurrent() values above the full-scale setting set the CURRENT_OR status bit. Note that whenever any current DAC bits are set, the linear-cur-rent source is turned off.The power-on reset value for the ChargingCurrent() reg-ister is 0x0007. Any time the BATTERY_PRESENT status bit is clear (battery removed), the ChargingCurrent()register returns to its power-on reset state. This ensures that upon insertion of a battery, the initial charging cur-rent is 7mA.AlarmWarning()The AlarmWarning() command uses Write-Word protocol (Figure 8a). The command code for AlarmWarning() is 0x16 (0b00010110). The AlarmWarning() command sets the ALARM_INHIBITED status bit. The MAX1667 responds to the following alarms: OVER_CHARGED_ALARM (D15),TERMINATE_CHARGE_ALARM (D14), and OVER_TEMP_ALARM (D12). Table 7 summarizes the AlarmWarning()command’s function. The ALARM_INHIBITED status bit remains set until BATTERY_PRESENT = 0 (battery removed), a ChargerMode() command is written with the POR_RESET bit set, or a new ChargingVoltage() or ChargingCurrent() is written.N/A = Not applicable。
MAX809SN160T1资料
MAX809 Series,MAX810 SeriesVery Low Supply Current 3-Pin Microprocessor Reset MonitorsThe MAX809 and MAX810 are cost–effective system supervisor circuits designed to monitor V CC in digital systems and provide a reset signal to the host processor when necessary. No external components are required.The reset output is driven active within 10 µsec of V CC falling through the reset voltage threshold. Reset is maintained active for a minimum of 140 msec after V CC rises above the reset threshold. The MAX810 has an active–high RESET output while the MAX809 has an active–low RESET output. The output of the MAX809 is guaranteed valid down to V CC = 1.0 V. Both devices are available in a SOT–23 package.The MAX809/810 are optimized to reject fast transient glitches on the V CC line. Low supply current of 1.0 µA (V CC= 3.2 V) makes these devices suitable for battery powered applications.Features•Precision V CC Monitor for 2.5 V, 3.0 V, 3.3 V, and 5.0 V Supplies •Precision Monitoring V oltages from 1.6 V to 4.9 V Availablein 100 mV Steps•140 msec Guaranteed Minimum RESET Output Duration •RESET Output Guaranteed to V CC = 1.0 V•Low Supply Current•V CC Transient Immunity•Small SOT–23 Package•No External Components•Wide Operating Temperature: –40°C to 105°CTypical Applications•Computers•Embedded Systems•Battery Powered Equipment•Critical µP Power Supply MonitoringV CCFigure 1. Typical Application DiagramDevice Package ShippingORDERING INFORMATIONMAX809xTR SOT–233000 Tape/Reel MAX809SNxxxT1SOT–233000 Tape/Reel NOTE:*SOT–23 is equivalent to JEDEC (TO–236) **RESET is for MAX809***RESET is for MAX810SOT–23(TO–236)CASE 318PIN CONFIGURATION312V CCGNDRESET**SOT–23*(Top View)xx, xxx= Specific Device Codem= Date Codey= Yearw= Work WeekMARKINGDIAGRAMS32xxxm1(RESET)***MAX810xTR SOT–233000 Tape/ReelSee general marking information in the device marking section on page 8 of this data sheet.DEVICE MARKING INFORMATION NOTE: The “x” and “xxx” denotes a suffix for V cc voltage threshold options – see page 8 for more details.32xxyw1See specific device markinginformation on page 8.PIN DESCRIPTIONABSOLUTE MAXIMUM RATINGS* (Note 1)1.This device series contains ESD protection and exceeds the following tests:Human Body Model 2000 V per MIL–STD–883, Method 3015. Machine Model Method 350 V.2.The maximum package power dissipation limit must not be exceeded.P D +T J(max)*T Aq JAwith T J(max) = 150°C ELECTRICAL CHARACTERISTICS T A = –40°C to +105°C unless otherwise noted. Typical values are at T A = +25°C. (Note 3)The following data is given for MAX809 threshold levels: 1.60 V, 2.32 V, 2.93 V, 4.63 V and 4.90 V.AELECTRICAL CHARACTERISTICS(continued) T A = –40°C to +105°C unless otherwise noted. Typical values are at T A = +25°C. (Note 4) The following data is given for MAX809 threshold levels: 1.60 V, 2.32 V, 2.93 V, 4.63 V and 4.90 V.A5.Contact your ON Semiconductor sales representative for other threshold voltage options.ELECTRICAL CHARACTERISTICS (V CC = Full Range, T A = –40°C to +85°C unless otherwise noted. Typical values are at T A = +25°C, V CC = 5.0 V for L/M/J, 3.3 V for T/S, 3.0 V for R) (Note 6) The following data is given for MAX809 threshold levels: 2.63 V, 3.08 V, 4.00 V and 4.38 V; MAX810 threshold levels: 2.63 V, 2.93 V, 3.08 V, 4.38 V and 4.63 V.AAPPLICATIONS INFORMATIONV CC Transient RejectionThe MAX809 provides accurate V CC monitoring and reset timing during power–up, power–down, and brownout/sag conditions, and rejects negative–going transients (glitches)on the power supply line. Figure 2 shows the maximum transient duration vs. maximum negative excursion (overdrive) for glitch rejection. Any combination of duration and overdrive which lies under the curve will not generate a reset signal. Combinations above the curve are detected as a brownout or power–down. Typically, transient that goes 100 mV below the reset threshold and lasts 5 µs or less will not cause a reset pulse. Transient immunity can be improved by adding a capacitor in close proximity to the V CC pin of the MAX809.Figure 2. Maximum Transient Duration vs. Overdrivefor Glitch Rejection at 25°CV CC10.010080110.060.0M A X I M U M T R A N S I E N T D U R A T I O N (µs e c )20120RESET COMPARATOR OVERDRIVE (mV)160.06040RESET Signal Integrity During Power–DownThe MAX809 RESET output is valid to V CC = 1.0 V .Below this voltage the output becomes an “open circuit” and does not sink current. This means CMOS logic inputs to the µP will be floating at an undetermined voltage. Most digital systems are completely shutdown well above this voltage.However, in situations where RESET must be maintainedvalid to V CC = 0 V , a pull–down resistor must be connected from RESET to ground to discharge stray capacitances and hold the output low (Figure 3). This resistor value, though not critical, should be chosen such that it does not appreciably load RESET under normal operation (100 k W will be suitable for most applications).Figure 3. Ensuring RESET Valid to V CC = 0 VProcessors With Bidirectional I/O PinsSome µP’s (such as Motorola 68HC11) have bi–directional reset pins. Depending on the current drive capability of the processor pin, an indeterminate logic level may result if there is a logic conflict. This can be avoided by adding a 4.7 k W resistor in series with the output of the MAX809 (Figure 4). If there are other components in the system which require a reset signal, they should be buffered so as not to load the reset line. If the other components are required to follow the reset I/O of the µP, the buffer should be connected as shown with the solid line.Figure 4. Interfacing to Bidirectional Reset I/OBUFFERED RESETThe following data is given for MAX809 threshold levels: 1.60 V, 2.32 V, 2.93 V, 4.63 V and 4.90 V.1.10S U P P L Y C U R R E N T I N M I C R O A M PTEMPERATURE (°C)N O R M A L I Z E D P O W E R –U P R E S E T T I M E O U T–404020–206080Figure 7. Normalized Power–Up Reset vs.Temperature Figure 8. Normalized Reset Threshold Voltagevs. TemperatureTEMPERATURE (°C)–404020–206080The following data is given for MAX809 threshold levels: 2.63 V, 3.08 V, 4.00 V and 4.38 V;MAX810 threshold levels: 2.63 V, 2.93 V, 3.08 V, 4.38 V and 4.63 V.S U P P L Y C U R R E N T ( A )m 040206080100P O W E R -D O W N R E S E T D E L A Y ( s e c )m TEMPERATURE (C °)-40-200204085Figure 13. Power–Up Reset Timeout vs.Temperature TEMPERATURE (C °)-40-20020406085225235230240245250P O W E R -U P R E S E T T I M E O U T (m s e c )60Figure 14. Normalized Reset Threshold vs.TemperatureTAPING FORMComponent Taping Orientation for 3L SOT–23 (JEDEC–236) Devices(Mark Right Side Up)SOT–23Package Carrier Width (W)Pitch (P)Part Per Full ReelReel Size 8 mm4 mm30007 inchesTape & Reel Specifications TableMARKING AND THRESHOLD INFORMATIONm = Date Codey = Yearw = Work WeekPACKAGE DIMENSIONSSOT–23PLASTIC PACKAGE (TO–236)CASE 318–08ISSUE AHNOTES:1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.2.CONTROLLING DIMENSION: INCH.3.MAXIMUM LEAD THICKNESS INCLUDES LEADNotesNotes11ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. PUBLICATION ORDERING INFORMATIONJAPAN: ON Semiconductor, Japan Customer Focus Center4–32–1 Nishi–Gotanda, Shinagawa–ku, Tokyo, Japan 141–0031Phone: 81–3–5740–2700Email: r14525@。
T-16000M摇杆产品使用手册
T-16000M摇杆产品使用手册按钮及功能特点：1、“number trigger”数字发射器2.、“point of view hat switch”多向视角帽开关3、“right handed screw cover”右利手用螺旋握手盖4、“hand rest”通过旋转带靠手板把手实现方向舵控制5、“throttle”油门6、“15 action buttons”15个动作按钮7、“hand rest rotation screw”调节靠手板适应左利手或右利手的螺钉8、“right handed thumb rest”右利手使用者放置大拇指的地方9、“PC USB connector”PC的USB连接器10、“left handed thumb rest”左利手使用者放置大拇指用的配件11、“left handed screw cover”左利手用螺旋握手盖（手握握杆时手掌握住地方的配件）12、“right handed or left handed buttons selector switch”右利手或左利手按钮选择开关了解你的摇杆：专业级霍尔效应高精度技术你的T-16000M摇杆是全世界唯一采用霍尔效应高精度技术的一款专业摇杆，其特点如下：➢手柄上的3D霍尔效应传感器分辨率参数值高达2.68亿values, X轴和Y轴（16384*16384values），而目前其它型号的高精度的同类产品的分辨率指也不过1百万values,精度相差达256倍；➢磁性大大减小了活动的摩擦力，使其精度和灵敏度得以大幅提高；➢操纵杆中的螺旋弹簧（直径2.8mm）使操纵杆坚固，并且具有平稳的线性张力。
背光效果：尽管该游戏摇杆有着极高的精确度，但其并不存在“盲区”现象。
为体现这一点，只要摇杆发生非常轻微的晃动，摇杆底座的中央就会显出绿色背光，直到摇杆返回静止3秒后，绿色背光才会消失。
油门：该摇杆还具有一个油门（见上图标示5），以方便你在游戏的过程中控制速度。
MAX490ESA+T中文资料
For pricing, delivery, and ordering information,please contact Maxim/Dallas Direct!at 1-888-629-4642, or visit Maxim’s website at .General DescriptionThe MAX481, MAX483, MAX485, MAX487–MAX491, and MAX1487 are low-power transceivers for RS-485 and RS-422 communication. Each part contains one driver and one receiver. The MAX483, MAX487, MAX488, and MAX489feature reduced slew-rate drivers that minimize EMI and reduce reflections caused by improperly terminated cables,thus allowing error-free data transmission up to 250kbps.The driver slew rates of the MAX481, MAX485, MAX490,MAX491, and MAX1487 are not limited, allowing them to transmit up to 2.5Mbps.These transceivers draw between 120µA and 500µA of supply current when unloaded or fully loaded with disabled drivers. Additionally, the MAX481, MAX483, and MAX487have a low-current shutdown mode in which they consume only 0.1µA. All parts operate from a single 5V supply.Drivers are short-circuit current limited and are protected against excessive power dissipation by thermal shutdown circuitry that places the driver outputs into a high-imped-ance state. The receiver input has a fail-safe feature that guarantees a logic-high output if the input is open circuit.The MAX487 and MAX1487 feature quarter-unit-load receiver input impedance, allowing up to 128 MAX487/MAX1487 transceivers on the bus. Full-duplex communi-cations are obtained using the MAX488–MAX491, while the MAX481, MAX483, MAX485, MAX487, and MAX1487are designed for half-duplex applications.________________________ApplicationsLow-Power RS-485 Transceivers Low-Power RS-422 Transceivers Level TranslatorsTransceivers for EMI-Sensitive Applications Industrial-Control Local Area Networks__Next Generation Device Features♦For Fault-Tolerant ApplicationsMAX3430: ±80V Fault-Protected, Fail-Safe, 1/4Unit Load, +3.3V, RS-485 TransceiverMAX3440E–MAX3444E: ±15kV ESD-Protected,±60V Fault-Protected, 10Mbps, Fail-Safe, RS-485/J1708 Transceivers♦For Space-Constrained ApplicationsMAX3460–MAX3464: +5V, Fail-Safe, 20Mbps,Profibus RS-485/RS-422 TransceiversMAX3362: +3.3V, High-Speed, RS-485/RS-422Transceiver in a SOT23 PackageMAX3280E–MAX3284E: ±15kV ESD-Protected,52Mbps, +3V to +5.5V, SOT23, RS-485/RS-422,True Fail-Safe ReceiversMAX3293/MAX3294/MAX3295: 20Mbps, +3.3V,SOT23, RS-855/RS-422 Transmitters ♦For Multiple Transceiver ApplicationsMAX3030E–MAX3033E: ±15kV ESD-Protected,+3.3V, Quad RS-422 Transmitters ♦For Fail-Safe ApplicationsMAX3080–MAX3089: Fail-Safe, High-Speed (10Mbps), Slew-Rate-Limited RS-485/RS-422Transceivers♦For Low-Voltage ApplicationsMAX3483E/MAX3485E/MAX3486E/MAX3488E/MAX3490E/MAX3491E: +3.3V Powered, ±15kV ESD-Protected, 12Mbps, Slew-Rate-Limited,True RS-485/RS-422 TransceiversMAX481/MAX483/MAX485/MAX487–MAX491/MAX1487Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers______________________________________________________________Selection Table19-0122; Rev 8; 10/03Ordering Information appears at end of data sheet.M A X 481/M A X 483/M A X 485/M A X 487–M A X 491/M A X 1487Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers 2_______________________________________________________________________________________ABSOLUTE MAXIMUM RATINGSSupply Voltage (V CC ).............................................................12V Control Input Voltage (RE , DE)...................-0.5V to (V CC + 0.5V)Driver Input Voltage (DI).............................-0.5V to (V CC + 0.5V)Driver Output Voltage (A, B)...................................-8V to +12.5V Receiver Input Voltage (A, B).................................-8V to +12.5V Receiver Output Voltage (RO).....................-0.5V to (V CC +0.5V)Continuous Power Dissipation (T A = +70°C)8-Pin Plastic DIP (derate 9.09mW/°C above +70°C)....727mW 14-Pin Plastic DIP (derate 10.00mW/°C above +70°C)..800mW 8-Pin SO (derate 5.88mW/°C above +70°C).................471mW14-Pin SO (derate 8.33mW/°C above +70°C)...............667mW 8-Pin µMAX (derate 4.1mW/°C above +70°C)..............830mW 8-Pin CERDIP (derate 8.00mW/°C above +70°C).........640mW 14-Pin CERDIP (derate 9.09mW/°C above +70°C).......727mW Operating Temperature RangesMAX4_ _C_ _/MAX1487C_ A...............................0°C to +70°C MAX4__E_ _/MAX1487E_ A.............................-40°C to +85°C MAX4__MJ_/MAX1487MJA...........................-55°C to +125°C Storage Temperature Range.............................-65°C to +160°C Lead Temperature (soldering, 10sec).............................+300°CDC ELECTRICAL CHARACTERISTICS(V CC = 5V ±5%, T A = T MIN to T MAX , unless otherwise noted.) (Notes 1, 2)Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.V V IN = -7VV IN = 12V V IN = -7V V IN = 12V Input Current (A, B)I IN2V TH k Ω48-7V ≤V CM ≤12V, MAX487/MAX1487R INReceiver Input Resistance -7V ≤V CM ≤12V, all devices except MAX487/MAX1487R = 27Ω(RS-485), Figure 40.4V ≤V O ≤2.4VR = 50Ω(RS-422)I O = 4mA, V ID = -200mV I O = -4mA, V ID = 200mV V CM = 0V-7V ≤V CM ≤12V DE, DI, RE DE, DI, RE MAX487/MAX1487,DE = 0V, V CC = 0V or 5.25VDE, DI, RE R = 27Ωor 50Ω, Figure 4R = 27Ωor 50Ω, Figure 4R = 27Ωor 50Ω, Figure 4DE = 0V;V CC = 0V or 5.25V,all devices except MAX487/MAX1487CONDITIONSk Ω12µA ±1I OZRThree-State (high impedance)Output Current at ReceiverV 0.4V OL Receiver Output Low Voltage 3.5V OH Receiver Output High Voltage mV 70∆V TH Receiver Input Hysteresis V -0.20.2Receiver Differential Threshold Voltage-0.2mA 0.25mA-0.81.01.55V OD2Differential Driver Output (with load)V 2V 5V OD1Differential Driver Output (no load)µA±2I IN1Input CurrentV 0.8V IL Input Low Voltage V 2.0V IH Input High Voltage V 0.2∆V OD Change in Magnitude of Driver Common-Mode Output Voltage for Complementary Output States V 0.2∆V OD Change in Magnitude of Driver Differential Output Voltage for Complementary Output States V 3V OC Driver Common-Mode Output VoltageUNITS MINTYPMAX SYMBOL PARAMETERMAX481/MAX483/MAX485/MAX487–MAX491/MAX1487Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers_______________________________________________________________________________________3SWITCHING CHARACTERISTICS—MAX481/MAX485, MAX490/MAX491, MAX1487(V CC = 5V ±5%, T A = T MIN to T MAX , unless otherwise noted.) (Notes 1, 2)DC ELECTRICAL CHARACTERISTICS (continued)(V CC = 5V ±5%, T A = T MIN to T MAX , unless otherwise noted.) (Notes 1, 2)ns 103060t PHLDriver Rise or Fall Time Figures 6 and 8, R DIFF = 54Ω, C L1= C L2= 100pF ns MAX490M, MAX491M MAX490C/E, MAX491C/E2090150MAX481, MAX485, MAX1487MAX490M, MAX491MMAX490C/E, MAX491C/E MAX481, MAX485, MAX1487Figures 6 and 8, R DIFF = 54Ω,C L1= C L2= 100pF MAX481 (Note 5)Figures 5 and 11, C RL = 15pF, S2 closedFigures 5 and 11, C RL = 15pF, S1 closed Figures 5 and 11, C RL = 15pF, S2 closed Figures 5 and 11, C RL = 15pF, S1 closed Figures 6 and 10, R DIFF = 54Ω,C L1= C L2= 100pFFigures 6 and 8,R DIFF = 54Ω,C L1= C L2= 100pF Figures 6 and 10,R DIFF = 54Ω,C L1= C L2= 100pF CONDITIONS ns 510t SKEW ns50200600t SHDNTime to ShutdownMbps 2.5f MAX Maximum Data Rate ns 2050t HZ Receiver Disable Time from High ns 103060t PLH 2050t LZ Receiver Disable Time from Low ns 2050t ZH Driver Input to Output Receiver Enable to Output High ns 2050t ZL Receiver Enable to Output Low 2090200ns ns 134070t HZ t SKD Driver Disable Time from High |t PLH - t PHL |DifferentialReceiver Skewns 4070t LZ Driver Disable Time from Low ns 4070t ZL Driver Enable to Output Low 31540ns51525ns 31540t R , t F 2090200Driver Output Skew to Output t PLH , t PHL Receiver Input to Output4070t ZH Driver Enable to Output High UNITS MIN TYP MAX SYMBOL PARAMETERFigures 7 and 9, C L = 100pF, S2 closed Figures 7 and 9, C L = 100pF, S1 closed Figures 7 and 9, C L = 15pF, S1 closed Figures 7 and 9, C L = 15pF, S2 closedM A X 481/M A X 483/M A X 485/M A X 487–M A X 491/M A X 1487Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers 4_______________________________________________________________________________________SWITCHING CHARACTERISTICS—MAX483, MAX487/MAX488/MAX489(V CC = 5V ±5%, T A = T MIN to T MAX , unless otherwise noted.) (Notes 1, 2)SWITCHING CHARACTERISTICS—MAX481/MAX485, MAX490/MAX491, MAX1487 (continued)(V CC = 5V ±5%, T A = T MIN to T MAX , unless otherwise noted.) (Notes 1, 2)3001000Figures 7 and 9, C L = 100pF, S2 closed Figures 7 and 9, C L = 100pF, S1 closed Figures 5 and 11, C L = 15pF, S2 closed,A - B = 2VCONDITIONSns 40100t ZH(SHDN)Driver Enable from Shutdown toOutput High (MAX481)nsFigures 5 and 11, C L = 15pF, S1 closed,B - A = 2Vt ZL(SHDN)Receiver Enable from Shutdownto Output Low (MAX481)ns 40100t ZL(SHDN)Driver Enable from Shutdown toOutput Low (MAX481)ns 3001000t ZH(SHDN)Receiver Enable from Shutdownto Output High (MAX481)UNITS MINTYP MAX SYMBOLPARAMETERt PLH t SKEW Figures 6 and 8, R DIFF = 54Ω,C L1= C L2= 100pFt PHL Figures 6 and 8, R DIFF = 54Ω,C L1= C L2= 100pFDriver Input to Output Driver Output Skew to Output ns 100800ns ns 2000MAX483/MAX487, Figures 7 and 9,C L = 100pF, S2 closedt ZH(SHDN)Driver Enable from Shutdown to Output High2502000ns2500MAX483/MAX487, Figures 5 and 11,C L = 15pF, S1 closedt ZL(SHDN)Receiver Enable from Shutdown to Output Lowns 2500MAX483/MAX487, Figures 5 and 11,C L = 15pF, S2 closedt ZH(SHDN)Receiver Enable from Shutdown to Output Highns 2000MAX483/MAX487, Figures 7 and 9,C L = 100pF, S1 closedt ZL(SHDN)Driver Enable from Shutdown to Output Lowns 50200600MAX483/MAX487 (Note 5) t SHDN Time to Shutdownt PHL t PLH , t PHL < 50% of data period Figures 5 and 11, C RL = 15pF, S2 closed Figures 5 and 11, C RL = 15pF, S1 closed Figures 5 and 11, C RL = 15pF, S2 closed Figures 5 and 11, C RL = 15pF, S1 closed Figures 7 and 9, C L = 15pF, S2 closed Figures 6 and 10, R DIFF = 54Ω,C L1= C L2= 100pFFigures 7 and 9, C L = 15pF, S1 closed Figures 7 and 9, C L = 100pF, S1 closed Figures 7 and 9, C L = 100pF, S2 closed CONDITIONSkbps 250f MAX 2508002000Maximum Data Rate ns 2050t HZ Receiver Disable Time from High ns 25080020002050t LZ Receiver Disable Time from Low ns 2050t ZH Receiver Enable to Output High ns 2050t ZL Receiver Enable to Output Low ns ns 1003003000t HZ t SKD Driver Disable Time from High I t PLH - t PHL I DifferentialReceiver SkewFigures 6 and 10, R DIFF = 54Ω,C L1= C L2= 100pFns 3003000t LZ Driver Disable Time from Low ns 2502000t ZL Driver Enable to Output Low ns Figures 6 and 8, R DIFF = 54Ω,C L1= C L2= 100pFns 2502000t R , t F 2502000Driver Rise or Fall Time ns t PLH Receiver Input to Output2502000t ZH Driver Enable to Output High UNITS MIN TYP MAX SYMBOL PARAMETERMAX481/MAX483/MAX485/MAX487–MAX491/MAX1487Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers_______________________________________________________________________________________530002.5OUTPUT CURRENT vs.RECEIVER OUTPUT LOW VOLTAGE525M A X 481-01OUTPUT LOW VOLTAGE (V)O U T P U T C U R R E N T (m A )1.515100.51.02.0203540450.90.1-50-252575RECEIVER OUTPUT LOW VOLTAGE vs.TEMPERATURE0.30.7TEMPERATURE (°C)O U T P U TL O W V O L T A G E (V )500.50.80.20.60.40100125-20-41.5 2.0 3.0 5.0OUTPUT CURRENT vs.RECEIVER OUTPUT HIGH VOLTAGE-8-16M A X 481-02OUTPUT HIGH VOLTAGE (V)O U T P U T C U R R E N T (m A )2.5 4.0-12-18-6-14-10-203.54.5 4.83.2-50-252575RECEIVER OUTPUT HIGH VOLTAGE vs.TEMPERATURE3.64.4TEMPERATURE (°C)O U T P UT H I G H V O L T A G E (V )0504.04.63.44.23.83.01001259000 1.0 3.0 4.5DRIVER OUTPUT CURRENT vs.DIFFERENTIAL OUTPUT VOLTAGE1070M A X 481-05DIFFERENTIAL OUTPUT VOLTAGE (V)O U T P U T C U R R E N T (m A )2.0 4.05030806040200.5 1.5 2.53.5 2.31.5-50-2525125DRIVER DIFFERENTIAL OUTPUT VOLTAGEvs. TEMPERATURE1.72.1TEMPERATURE (°C)D I F FE R E N T I A L O U T P U T V O L T A G E (V )751.92.21.62.01.8100502.4__________________________________________Typical Operating Characteristics(V CC = 5V, T A = +25°C, unless otherwise noted.)NOTES FOR ELECTRICAL/SWITCHING CHARACTERISTICSNote 1:All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to deviceground unless otherwise specified.Note 2:All typical specifications are given for V CC = 5V and T A = +25°C.Note 3:Supply current specification is valid for loaded transmitters when DE = 0V.Note 4:Applies to peak current. See Typical Operating Characteristics.Note 5:The MAX481/MAX483/MAX487 are put into shutdown by bringing RE high and DE low. If the inputs are in this state for lessthan 50ns, the parts are guaranteed not to enter shutdown. If the inputs are in this state for at least 600ns, the parts are guaranteed to have entered shutdown. See Low-Power Shutdown Mode section.M A X 481/M A X 483/M A X 485/M A X 487–M A X 491/M A X 1487Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers 6___________________________________________________________________________________________________________________Typical Operating Characteristics (continued)(V CC = 5V, T A = +25°C, unless otherwise noted.)120008OUTPUT CURRENT vs.DRIVER OUTPUT LOW VOLTAGE20100M A X 481-07OUTPUT LOW VOLTAGE (V)O U T P U T C U R R E N T (m A )6604024801012140-1200-7-5-15OUTPUT CURRENT vs.DRIVER OUTPUT HIGH VOLTAGE-20-80M A X 481-08OUTPUT HIGH VOLTAGE (V)O U T P U T C U R R E N T (m A )-31-603-6-4-2024-100-40100-40-60-2040100120MAX1487SUPPLY CURRENT vs. TEMPERATURE300TEMPERATURE (°C)S U P P L Y C U R R E N T (µA )20608050020060040000140100-50-2550100MAX481/MAX485/MAX490/MAX491SUPPLY CURRENT vs. TEMPERATURE300TEMPERATURE (°C)S U P P L Y C U R R E N T (µA )257550020060040000125100-50-2550100MAX483/MAX487–MAX489SUPPLY CURRENT vs. TEMPERATURE300TEMPERATURE (°C)S U P P L Y C U R R E N T (µA )257550020060040000125MAX481/MAX483/MAX485/MAX487–MAX491/MAX1487Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers_______________________________________________________________________________________7______________________________________________________________Pin DescriptionFigure 1. MAX481/MAX483/MAX485/MAX487/MAX1487 Pin Configuration and Typical Operating CircuitM A X 481/M A X 483/M A X 485/M A X 487–M A X 491/M A X 1487__________Applications InformationThe MAX481/MAX483/MAX485/MAX487–MAX491 and MAX1487 are low-power transceivers for RS-485 and RS-422 communications. The MAX481, MAX485, MAX490,MAX491, and MAX1487 can transmit and receive at data rates up to 2.5Mbps, while the MAX483, MAX487,MAX488, and MAX489 are specified for data rates up to 250kbps. The MAX488–MAX491 are full-duplex trans-ceivers while the MAX481, MAX483, MAX485, MAX487,and MAX1487 are half-duplex. In addition, Driver Enable (DE) and Receiver Enable (RE) pins are included on the MAX481, MAX483, MAX485, MAX487, MAX489,MAX491, and MAX1487. When disabled, the driver and receiver outputs are high impedance.MAX487/MAX1487:128 Transceivers on the BusThe 48k Ω, 1/4-unit-load receiver input impedance of the MAX487 and MAX1487 allows up to 128 transceivers on a bus, compared to the 1-unit load (12k Ωinput impedance) of standard RS-485 drivers (32 trans-ceivers maximum). Any combination of MAX487/MAX1487 and other RS-485 transceivers with a total of 32 unit loads or less can be put on the bus. The MAX481/MAX483/MAX485 and MAX488–MAX491 have standard 12k ΩReceiver Input impedance.Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers 8_______________________________________________________________________________________Figure 2. MAX488/MAX490 Pin Configuration and Typical Operating CircuitFigure 3. MAX489/MAX491 Pin Configuration and Typical Operating CircuitMAX483/MAX487/MAX488/MAX489:Reduced EMI and ReflectionsThe MAX483 and MAX487–MAX489 are slew-rate limit-ed, minimizing EMI and reducing reflections caused by improperly terminated cables. Figure 12 shows the dri-ver output waveform and its Fourier analysis of a 150kHz signal transmitted by a MAX481, MAX485,MAX490, MAX491, or MAX1487. High-frequency har-monics with large amplitudes are evident. Figure 13shows the same information displayed for a MAX483,MAX487, MAX488, or MAX489 transmitting under the same conditions. Figure 13’s high-frequency harmonics have much lower amplitudes, and the potential for EMI is significantly reduced.MAX481/MAX483/MAX485/MAX487–MAX491/MAX1487Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers_______________________________________________________________________________________9_________________________________________________________________Test CircuitsFigure 4. Driver DC Test Load Figure 5. Receiver Timing Test LoadFigure 6. Driver/Receiver Timing Test Circuit Figure 7. Driver Timing Test LoadM A X 481/M A X 483/M A X 485/M A X 487–M A X 491/M A X 1487Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers 10_______________________________________________________Switching Waveforms_________________Function Tables (MAX481/MAX483/MAX485/MAX487/MAX1487)Figure 8. Driver Propagation DelaysFigure 9. Driver Enable and Disable Times (except MAX488 and MAX490)Figure 10. Receiver Propagation DelaysFigure 11. Receiver Enable and Disable Times (except MAX488and MAX490)Table 1. TransmittingTable 2. ReceivingLow-Power Shutdown Mode (MAX481/MAX483/MAX487)A low-power shutdown mode is initiated by bringing both RE high and DE low. The devices will not shut down unless both the driver and receiver are disabled.In shutdown, the devices typically draw only 0.1µA of supply current.RE and DE may be driven simultaneously; the parts are guaranteed not to enter shutdown if RE is high and DE is low for less than 50ns. If the inputs are in this state for at least 600ns, the parts are guaranteed to enter shutdown.For the MAX481, MAX483, and MAX487, the t ZH and t ZL enable times assume the part was not in the low-power shutdown state (the MAX485/MAX488–MAX491and MAX1487 can not be shut down). The t ZH(SHDN)and t ZL(SHDN)enable times assume the parts were shut down (see Electrical Characteristics ).It takes the drivers and receivers longer to become enabled from the low-power shutdown state (t ZH(SHDN ), t ZL(SHDN)) than from the operating mode (t ZH , t ZL ). (The parts are in operating mode if the –R —E –,DE inputs equal a logical 0,1 or 1,1 or 0, 0.)Driver Output ProtectionExcessive output current and power dissipation caused by faults or by bus contention are prevented by two mechanisms. A foldback current limit on the output stage provides immediate protection against short cir-cuits over the whole common-mode voltage range (see Typical Operating Characteristics ). In addition, a ther-mal shutdown circuit forces the driver outputs into a high-impedance state if the die temperature rises excessively.Propagation DelayMany digital encoding schemes depend on the differ-ence between the driver and receiver propagation delay times. Typical propagation delays are shown in Figures 15–18 using Figure 14’s test circuit.The difference in receiver delay times, | t PLH - t PHL |, is typically under 13ns for the MAX481, MAX485,MAX490, MAX491, and MAX1487 and is typically less than 100ns for the MAX483 and MAX487–MAX489.The driver skew times are typically 5ns (10ns max) for the MAX481, MAX485, MAX490, MAX491, and MAX1487, and are typically 100ns (800ns max) for the MAX483 and MAX487–MAX489.MAX481/MAX483/MAX485/MAX487–MAX491/MAX1487Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers______________________________________________________________________________________1110dB/div0Hz5MHz500kHz/div10dB/div0Hz5MHz500kHz/divFigure 12. Driver Output Waveform and FFT Plot of MAX481/MAX485/MAX490/MAX491/MAX1487 Transmitting a 150kHz SignalFigure 13. Driver Output Waveform and FFT Plot of MAX483/MAX487–MAX489 Transmitting a 150kHz SignalM A X 481/M A X 483/M A X 485/M A X 487–M A X 491/M A X 1487Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers 12______________________________________________________________________________________V CC = 5V T A = +25°CV CC = 5V T A = +25°CV CC = 5V T A = +25°CV CC = 5V T A = +25°CFigure 14. Receiver Propagation Delay Test CircuitFigure 15. MAX481/MAX485/MAX490/MAX491/MAX1487Receiver t PHLFigure 16. MAX481/MAX485/MAX490/MAX491/MAX1487Receiver t PLHPHL Figure 18. MAX483, MAX487–MAX489 Receiver t PLHLine Length vs. Data RateThe RS-485/RS-422 standard covers line lengths up to 4000 feet. For line lengths greater than 4000 feet, see Figure 23.Figures 19 and 20 show the system differential voltage for the parts driving 4000 feet of 26AWG twisted-pair wire at 110kHz into 120Ωloads.Typical ApplicationsThe MAX481, MAX483, MAX485, MAX487–MAX491, and MAX1487 transceivers are designed for bidirectional data communications on multipoint bus transmission lines.Figures 21 and 22 show typical network applications circuits. These parts can also be used as line repeaters, with cable lengths longer than 4000 feet, as shown in Figure 23.To minimize reflections, the line should be terminated at both ends in its characteristic impedance, and stub lengths off the main line should be kept as short as possi-ble. The slew-rate-limited MAX483 and MAX487–MAX489are more tolerant of imperfect termination.MAX481/MAX483/MAX485/MAX487–MAX491/MAX1487Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers______________________________________________________________________________________13DIV Y -V ZRO5V 0V1V0V -1V5V 0V2µs/divFigure 19. MAX481/MAX485/MAX490/MAX491/MAX1487 System Differential Voltage at 110kHz Driving 4000ft of Cable Figure 20. MAX483, MAX487–MAX489 System Differential Voltage at 110kHz Driving 4000ft of CableFigure 21. MAX481/MAX483/MAX485/MAX487/MAX1487 Typical Half-Duplex RS-485 NetworkM A X 481/M A X 483/M A X 485/M A X 487–M A X 491/M A X 1487Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers 14______________________________________________________________________________________Figure 22. MAX488–MAX491 Full-Duplex RS-485 NetworkFigure 23. Line Repeater for MAX488–MAX491Isolated RS-485For isolated RS-485 applications, see the MAX253 and MAX1480 data sheets.MAX481/MAX483/MAX485/MAX487–MAX491/MAX1487Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers______________________________________________________________________________________15_______________Ordering Information_________________Chip TopographiesMAX481/MAX483/MAX485/MAX487/MAX1487N.C. RO 0.054"(1.372mm)0.080"(2.032mm)DE DIGND B N.C.V CCARE * Contact factory for dice specifications.__Ordering Information (continued)M A X 481/M A X 483/M A X 485/M A X 487–M A X 491/M A X 1487Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers 16______________________________________________________________________________________TRANSISTOR COUNT: 248SUBSTRATE CONNECTED TO GNDMAX488/MAX490B RO 0.054"(1.372mm)0.080"(2.032mm)N.C. DIGND Z A V CCYN.C._____________________________________________Chip Topographies (continued)MAX489/MAX491B RO 0.054"(1.372mm)0.080"(2.032mm)DE DIGND Z A V CCYREMAX481/MAX483/MAX485/MAX487–MAX491/MAX1487Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers______________________________________________________________________________________17Package Information(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to /packages .)S O I C N .E P SM A X 481/M A X 483/M A X 485/M A X 487–M A X 491/M A X 1487Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers 18______________________________________________________________________________________Package Information (continued)(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to /packages .)MAX481/MAX483/MAX485/MAX487–MAX491Low-Power, Slew-Rate-Limited RS-485/RS-422 TransceiversMaxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________19©2003 Maxim Integrated ProductsPrinted USAis a registered trademark of Maxim Integrated Products.M A X 481/M A X 483/M A X 485/M A X 487–M A X 491/M A X 1487P D I P N .E PSPackage Information (continued)(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to /packages .)。
MAXTRAC 系列产品部件清单说明书
REF.NO.PART NO.DESCRIPTIONREF.NO.PART NO.DESCRIPTIONMAXTRAC 50/100 AND 820 SERIES202680223M05Shield, PA, VHF &UHF 202680223M05Shield, PA, 800 MHz 210980131M01Connector, antenna 222680124L03Heatsink, UHF &VHF 222680124L02Heatsink, 800 MHz 230980255E01Connector, power240310943M10Taptite Screw (M3 x 8); 8 used 250380271L01Machine Screw (M4 x 17); 2 used 260380043L01Taptite Screw (M3 x 10); 2 used 270400131974Washer; 2 used281580076M01Housing, accessory connector 297580918T02Pad, shock insulating; 5 used 300400002636Washer, int loc313280014N02Gasket, accessory connector 321380276L02Escutcheon, 2 frequencyNON-REFERENCED ITEMS:HLN5184B Switchboard 3380017N14Nameplate10380270L01Front Mounting Screws; 2 used 21580129L01Control Head Housing 33680144M01Control Knob 45080085D02Speaker54280253L01Speaker Retainer; 4 used 60310945A11Plastic Screw; 9 used 73880272L02Push Button; 2 used 84380273L01Push Button Spacer 97580200L01Keypad102900129883Wire Wrap; 2 used 110780037M01Bracket, switch board 122780128L04Chassis Frame 131580953T01Cover, VCO shield 142680038M03Shield, chassis RF150310943M09Taptite Screw (M3 x 6); 12 used 161580127L01Cover, housing; 2 used 171580124M01Cover, logic shield180310943R55Taptite Screw (M3 x 8, flathead); 4 used190310943R04Taptite Screw (M2.5 x 8, flathead); 2 usedREF.NO.PART NO.DESCRIPTIONREF.NO.PART NO.DESCRIPTIONMAXTRAC 300 AND 840 SERIES232680223M05Shield, PA, VHF&UHF232680223M05Shield, PA, 800 MHz240980131M01Connector, antenna252680124L03Heatsink, UHF &VHF252680124L02Heatsink, 800 MHz260980255E01Connector, power270310943M10Taptite Screw (M3 x 3); 8 used280380271L01Machine Screw (M4 x 27); 2 used290380043L01Taptite Screw (M3 x 10); 2 used300400131974Washer; 2 used313280039M01Gasket321580076M01Housing, accessory connector337580918T02Pad, shock insulating; 5 used340400002636Washer, int loc353280014N02Gasket, accessory connector361380277L01Escutcheon (16 freq. models)NON-REFERENCED ITEMS:HLN5184B Switchboard3380017N14NameplateNOTE: The part number for the speaker lead assembly,including connector P10 and two lugs, is 0180747T30.10380270L01Front Mounting Screws; 2 used 21580129L01Control Head Housing33680144M01Control Knob45080085D02Speaker54280253L01Speaker Retainer; 4 used 60310945A11Plastic Screw; 9 used73880272L02Push Button(6 freq. models); 3 used(16 freq. models); 5 used 84380274L01Push Button Spacer (1 x 2) 94380275L01Push Button Spacer (1 x 3) 107580201L01Keypad113880077N01Button Plug; 2 used123280907T01Gasket (6 freq. models only); 2 used 132900129883Wire Wrap; 2 used140780037M01Bracket Switch Board152780128L04Chassis Frame161580953T01Cover, VCO shield172680038M03Shield, chassis, RF180310943M09Taptite Screw (M3 x 6); 12 used 191580127L01Cover, housing; 2 used 201580124M01Cover, logic shield210310943R55Taptite Screw (M3 x 8, flathead);4 used220310943R04Taptite Screw (M2.5 x 8, flathead);2 usedMICROPHONESHSN4019B HMN1035CMOUNTING HARDWARE HLN4426AIGNITION SWITCH CABLEAccessories, Antennas ANTENNA ADAPTERHAD4008AHAD4006AVHF ANTENNASHAD4010ARAD4002ARA HAD4013AVHF ANTENNAHAE4003ARAE4022ARAUHF ANTENNAS800 MHZ ANTENNASRAF4011ARLRRA4933ASERVICE TOOLSRLN4008B RSX4043A6680163F010180357A57Service Aids, Manuals SERVICE AIDSHMN1035CHLN4426AHSN4019BHKN9327AEmergency Alarm 3dB, roof top w/14 ft. cable (890-960 MHz)3dB, roof top w/22 ft. cable 1/4 Wave, roof top (136-144 MHz)1/4 Wave, roof top (144-152 MHz)1/4 Wave, roof top (150.8-162 MHz)1/4 Wave, roof top (162-174 MHz)3dB, roof top (136-174 MHz)1/4 Wave, roof top (403-430 MHz)1/4 Wave, roof top (450-470 MHz)1/4 Wave, roof top (470-512 MHz)3.5dB, roof top (406-420 MHz)3.5dB, roof top (450-470 MHz)3.5dB, roof top (470-495 MHz)3.5dB, roof top (494-512 MHz)1/4 Wave Base Loaded Antenna 1/4 Wave Base Loaded Antenna 1/4 Wave Base Loaded Antenna HMN3000BHLN9330BHPN4002B HAE4013A。
MAX1680ESA+T中文资料
PART MAX1680C/D MAX1680ESA MAX1681C/D MAX1681ESA
TEMP. RANGE 0°C to +70°C -40°C to +85°C 0°C to +70°C -40°C to +85°C
*Contact factory for dice specifications.
Note 1: Shorting OUT to IN may damage the device and should be avoided.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
2.0
MAX1681
3.0
MAX1680
2.5
MAX1681
4.0
5.5 5.5
V 5.5
V 5.5
Supply Current
MAX1680 I+
MAX3656ETG中文资料
IN+ SERIAL DATA SOURCE 100Ω IN-
BIASMAX
VCC OUTOUT+ BIAS+ VCC BIASLONGB MD
VCC
MD
TOP VIEW
BIASMAX
MODSET
APCSET
MAX3656
BEN+ BURST CONTROL 100Ω BEN-
MAX3656
15 14 13
MAX3656
Ordering Information
PART MAX3656E/D MAX3656ETG TEMP RANGE — PIN-PACKAGE Dice* PKG CODE — T2444-1 —
-40°C to +85°C 24 Thin QFN-EP**
MAX3656ETG+ -40°C to +85°C 24 Thin QFN-EP**
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
ATmega16中文数据手册
PORTA DRIVERS/BUFFERS
PORTC DRIVERS/BUFFERS
GND
PORTA DIGITAL INTERFACE
PORTC DIGITAL INTERFACE
AVCC
MUX & ADC
AREF PROGRAM COUNTER
ADC INTERFACE
100000次1k字节的片内sram微控制器可以对锁定位进行编程以实现用户程序的加密?jtag接口与ieee11491标准兼容符合jtag标准的边界扫描功能支持m熔丝位和锁定位的编程atmega16?外设特点两个具有独立预分频器和比较器功能的8位定时器计数器atmega16l一个具有预分频器比较功能和捕捉功能的16位定时器计数器具有独立振荡器的实时计数器rtc四通道pwm8路10位adc8个单端通道tqfp封装的7个差分通道2个具有可编程增益1x10x或200x的差分通道面向字节的两线接口两个可编程的串行usart可工作于主机从机模式的spi串行接口具有独立片内振荡器的可编程看门狗定时器片内模拟比较器?特殊的处理器特点上电复位以及可编程的掉电检测片内经过标定的rc振荡器片内片外中断源6种睡眠模式
PA4 (ADC4) PA5 (ADC5) PA6 (ADC6) PA7 (ADC7) AREF GND AVCC PC7 (TOSC2) PC6 (TOSC1) PC5 (TDI) PC4 (TDO)
声明
本数据手册的典型值来源于对器件的仿真，以及其他基于相同产生工艺的 AVR 微控制器 的标定特性。本器件经过特性化之后将给出实际的最大值和最小值。
4
ATmega16(L)
2466G–AVR–10/03
CITECT工程手册范本
CITECT工程师手册(V1.3)点击文字进入相应的页面一、硬件配置要求二、软件配置要求三、工程设计规四、当地功能软件备份五、当地功能软件安装(恢复)标准六、附录：SOE卩时打印配置步骤SO配置说明DN版本使用规则网卡注册步骤注意本手册所规定事项均为公司开发XCEL-NT系统所必要的容，施行统一标准是为了便于规开发和不同工程师对同一工程的维护。
基于以上目的，本手册必须严格执行。
当地功能设备具体指惠安公司XCEL-NT软件运行所需要的计算机硬件及相关的软件。
我们制定以下的标准是为了让XCEL-NT软件有更好的运行环境，便于工程的产生和维护。
公司为客户购置计算机属于品牌机，其配置在一定程度上是无法随意改变的，这里的规定只是一个适用于XCEL-NT软件的底线配置。
CPU：Intel 系列中央处理器，PIII800 以上型号；存：256MB彩显：按用户要求选择尺寸，但是至少能在1280X 102475Hz的条件下正常显示；显卡：至少能工作在1280 X 1024256色的分辨率下；网卡：使用3Com的3C905系列(Ethernet PCI 10/100 )及以上型号；声卡：主板集成或Creative公司的SB系列PCI声卡；当CPU配置较低(工作频率1.4GHz以下)时，不得使用主板集成声卡。
硬盘：20G以上。
MODEMS用户不反对的情况下，安装置Modem1、硬盘的分区要求分四个区，盘号分别为C D E、F,其中C F盘为FAT格式，大小均为2G, D E盘为NTFS格式，大小为减去C F盘占用空间后，硬盘剩余空间的50%。
（例如硬盘为20G贝U D盘大小为（20-2X2）/2 = 8G）。
2、软件的安装为了便于调试，新装机的NT进入用户名必须为Administrator ，无密码。
设备到现场后，根据用户要求再作修改，以保证系统安全。
我们应该提供给用户一Windows98DO模式启动盘和一Ghost软盘，其作用是在硬盘遭到逻辑损害而无法自启动时，使用软盘启动，再使用ghost软件恢复C、D E 盘的数据。
MAX4600EWE+T中文资料
General DescriptionThe MAX4580/MAX4590/MAX4600 dual analog switches feature low on-resistance of 1.25Ωmax. On-resistance is matched between switches to 0.25Ωmax and is flat (0.3Ωmax) over the specified signal range. Each switch can handle Rail-to-Rail ®analog signals. The off-leakage current is only 2.5nA max at +85°C. These analog switches are ideal in low-distortion applications and are the preferred solution over mechanical relays in automat-ic test equipment or applications where current switching is required. They have low power requirements, require less board space, and are more reliable than mechanical relays.The MAX4580 has two NC (normally closed) switches,the MAX4590 has two NO (normally open) switches,and the MAX4600 has one NC (normally closed) and one NO (normally open) switch.These switches operate from a +4.5V to +36V single supply or from ±4.5V to ±20V dual supplies. All digital inputs have +0.8V and +2.4V logic thresholds, ensuring TTL/CMOS-logic compatibility when using a +12V sin-gle supply or ±15V dual supplies.ApplicationsReed Relay Replacement Test EquipmentCommunication Systems PBX, PABX SystemsFeatureso Low On-Resistance (1.25Ωmax)o Guaranteed R ON Match Between Channels (0.25Ωmax)o Guaranteed R ON Flatness Over Specified Signal Range (0.3Ωmax)o Rail-to-Rail Signal Handlingo Guaranteed ESD Protection >2kV per Method 3015.7o Single-Supply Operation: +4.5V to +36V Dual-Supply Operation: ±4.5V to ±20V o TTL/CMOS-Compatible Control InputsMAX4580/MAX4590/MAX46001.25Ω, Dual SPST,CMOS Analog Switches________________________________________________________________Maxim Integrated Products119-1394; Rev 1; 6/03Ordering Information continued at end of data sheet.Rail-to-Rail is a registered trademark of Nippon Motorola, Ltd.Pin Configurations/Functional Diagrams/Truth TablesOrdering InformationFor pricing, delivery, and ordering information,please contact Maxim/Dallas Direct!at 1-888-629-4642, or visit Maxim’s website at .M A X 4580/M A X 4590/M A X 46001.25Ω, Dual SPST,CMOS Analog Switches 2_______________________________________________________________________________________ABSOLUTE MAXIMUM RATINGSStresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.V+ to GND..............................................................-0.3V to +44V V- to GND...............................................................+0.3V to -44V V+ to V-...................................................................-0.3V to +44V V L to GND....................................................-0.3V to (V+ + 0.3V)All Other Pins to GND (Note 1) ...........(V- - 0.3V) to (V+ + 0.3V)Continuous Current (COM_, NO_, NC_) .......................±200mA Peak Current (COM_, NO_, NC_)(pulsed at 1ms, 10% duty cycle) ..............................±300mAContinuous Power Dissipation (T A = +70°C)16 SSOP (derate 7.1mW/°C above +70°C).................571mW 16 Wide SO (derate 9.52mW/°C above +70°C) ..........762mW 16 Plastic DIP (derate 10.53mW/°C above +70°C).....842mW Operating Temperature RangesMAX4_ _0C_E ....................................................0°C to +70°C MAX4_ _0E_E ..................................................-40°C to +85°C Storage Temperature Range ...........................-65°C to +160°C Lead Temperature (soldering, 10sec) ............................+300°CELECTRICAL CHARACTERISTICS–Dual Supplies(V+ = +15V, V- = -15V, V L = +5V, V IN_H = +2.4V, V IN_L = +0.8V, T A = T MIN to T MAX , unless otherwise noted. Typical values are at T A = +25°C.)Note 1:Signals on NC_, NO_, COM_, or IN_ exceeding V+ or V- are clamped by internal diodes. Limit forward diode current tomaximum current rating.ELECTRICAL CHARACTERISTICS–Dual Supplies (continued)MAX4580/MAX4590/MAX46001.25Ω, Dual SPST,CMOS Analog Switches (V+ = +15V, V- = -15V, V L= +5V, V IN_H= +2.4V, V IN_L= +0.8V, T A = T MIN to T MAX, unless otherwise noted. Typical values are atT A= +25°C.)_______________________________________________________________________________________3M A X 4580/M A X 4590/M A X 46001.25Ω, Dual SPST,CMOS Analog Switches 4_______________________________________________________________________________________ELECTRICAL CHARACTERISTICS–Single Supply(V+ = +12V, V- = 0, V L = +5V, V INH = 2.4V, V INL = 0.8V, T A = T MIN to T MAX , unless otherwise noted. Typical values are at T = +25°C.)MAX4580/MAX4590/MAX46001.25Ω, Dual SPST,CMOS Analog Switches_______________________________________________________________________________________5ELECTRICAL CHARACTERISTICS—Single Supply (continued)(V+ = +12V, V- = 0, V L = +5V, V IN_H = 2.4V, V IN_L = 0.8V, T A = T MIN to T MAX , unless otherwise noted. Typical values are at T A = +25°C.)Note 2:The algebraic convention, where the most negative value is a minimum and the most positive value a maximum, is used inthis data sheet.Note 3:Guaranteed by design.Note 4:∆R ON = R ON(MAX)- R ON(MIN).Note 5:Flatness is defined as the difference between the maximum and minimum value of on-resistance as measured over thespecified analog signal range.Note 6:Leakage parameters are 100% tested at maximum-rated hot temperature and guaranteed by correlation at +25°C.Note 7:Off-isolation = 20 log 10[V COM / (V NC or V NO )], V COM = output, V NC or V NO = input to off switch.Note 8:Between any two switches.Note 9:Leakage testing at single supply is guaranteed by testing with dual supplies.0.51.01.52.02.5-20-12-8-16-448121620ON-RESISTANCE vs. V COM(DUAL SUPPLIES)V COM (V)R O N (Ω)ON-RESISTANCE vs. V COMAND TEMPERATURE (DUAL SUPPLIES)V COM (V)R O N (Ω)129-12-9-63-360.50.60.70.80.91.01.11.20.4-1515ON-RESISTANCE vs. V COM(SINGLE SUPPLY)V COM (V)R O N (Ω)2220181614121086421234524Typical Operating Characteristics(Circuit of Figure 1, T A = +25°C, unless otherwise noted.)Typical Operating Characteristics (continued)(Circuit of Figure 1, T A = +25°C, unless otherwise noted.)M A X 4580/M A X 4590/M A X 46001.25Ω, Dual SPST,CMOS Analog Switches 6_______________________________________________________________________________________ON-RESISTANCE vs. V COMAND TEMPERATURE (SINGLE SUPPLY)V COM (V)R O N (Ω)11108923456710.250.500.751.001.251.501.752.002.2500120.0010.010.11100101000-4020-20406080100POWER-SUPPLY CURRENTvs. TEMPERATURETEMPERATURE (°C)I +, I - (n A )10,0000.0010.01110-4020-20406080100ON/OFF-LEAKAGE vs. TEMPERATURETEMPERATURE (°C)L E A K A G E (n A )-500-3000200400-400-100100300500-15-50-10515CHARGE INJECTIONvs. V COMV COM (V)Q (p C )10-2000-1000.011100.1100-80FREQUENCY (MHz)L O S S (d B )P H A S E (d e g r e e s )-60-40-20-90-70-50-30-10+180-720-540-360-1800-630-450-270-90+9050100150250300-4010-15356085TURN-ON/TURN-OFF TIME vs. TEMPERATURETEMPERATURE (°C)t O N , t O F F (n s )MAX4580/MAX4590/MAX46001.25Ω, Dual SPST,CMOS Analog Switches_______________________________________________________________________________________7801202001602402801012111314151617181920TURN-ON/TURN-OFF TIME vs. SUPPLY VOLTAGEV+, V- (V)t O N , t O F F (n s )Typical Operating Characteristics (continued)(Circuit of Figure 1, T A = +25°C, unless otherwise noted.)TURN-ON/TURN-OFF TIME vs. V COMV COM (V)t O N , t O F F (n s )8642-2-4-6-8120140160180200220100-1010Pin DescriptionM A X 4580/M A X 4590/M A X 46001.25Ω, Dual SPST,CMOS Analog Switches8__________________________________________________________________________________________________Applications InformationOvervoltage ProtectionProper power-supply sequencing is recommended for all CMOS devices. Do not exceed the absolute maxi-mum ratings, because stresses beyond the listed rat-ings can cause permanent damage to the devices.Always sequence V+ on first, then V-, followed by the logic inputs, NO, or COM. If power-supply sequencing is not possible, add two small signal diodes (D1, D2) in series with supply pins for overvoltage protection (Figure 1). Adding diodes reduces the analog signal range to one diode drop below V+ and one diode drop above V-, but does not affect the devices’ low switch resistance and low leakage characteristics. Device operation is unchanged, and the difference between V+and V- should not exceed 44V. These protection diodes are not recommended when using a single supply.Figure 1. Overvoltage Protection Using External Blocking DiodesFigure 2. Switching-Time Test CircuitMAX4580/MAX4590/MAX46001.25Ω, Dual SPST,CMOS Analog Switches_______________________________________________________________________________________9Figure 4. Off-Isolation Test Circuit Figure 5. Crosstalk Test CircuitM A X 4580/M A X 4590/M A X 46001.25Ω, Dual SPST,CMOS Analog Switches 10______________________________________________________________________________________Ordering Information (continued)___________________Chip InformationTRANSISTOR COUNT: 100Figure 6. Switch Off-Capacitance Test CircuitFigure 7. Switch On-Capacitance Test CircuitPackage InformationMAX4580/MAX4590/MAX46001.25Ω, Dual SPST,CMOS Analog Switches (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline informationgo to /packages.) Array______________________________________________________________________________________11M A X 4580/M A X 4590/M A X 46001.25Ω, Dual SPST,CMOS Analog Switches S O I C W .E P SPackage Information (continued)(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to /packages .)Ma xim ca nnot a ssume responsibility for use of a ny circuitry other tha n circuitry entirely embodied in a Ma xim product. No circuit pa tent licenses a re implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.12____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600©2003 Maxim Integrated ProductsPrinted USAis a registered trademark of Maxim Integrated Products.。
MAX803SEXR中文资料
MAX803SEXRRev. ARELIABILITY REPORTFORMAX803SEXRPLASTIC ENCAPSULATED DEVICESAugust 3, 2006MAXIM INTEGRATED PRODUCTS120 SAN GABRIEL DR.SUNNYVALE, CA 94086byWrittenPedicordJimQualityAssuranceManager, Reliability LabConclusionThe MAX803 successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim’s continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim’s quality and reliability standards.Table of ContentsI. ........Device Description V. ........Quality Assurance InformationII. ........Manufacturing Information VI. .......Reliability EvaluationIII. .......Packaging Information IV. .......Die Information.....AttachmentsI. Device DescriptionA. GeneralThe MAX803 is a microprocessor (µP) supervisory circuit used to monitor the power supplies in µP and digital systems. It provides excellent circuit reliability and low cost by eliminating externalcomponents and adjustments when used with +5V, +3.3V, +3.0V, or +2.5V powered circuits.This circuit performs a single function: it asserts a reset signal whenever the V CC supply voltage declines below a preset threshold, keeping it asserted for at least 140ms after V CC has risen above the reset threshold. Reset thresholds suitable for operation with a variety of supply voltages are available.The MAX803 has an open-drain output stage. The MAX803's open-drain RESET-bar output requiresa pull-up resistor that can be connected to a voltage higher than V CC. The MAX803 has an active-low RESET-bar output. The reset comparator is designed to ignore fast transients on V CC, and the outputs are guaranteed to be in the correct logic state for V CC down to 1V.Low supply current makes the MAX803 ideal for use in portable equipment. The MAX803 isavailable in a 3-pin SC70 package.B. Absolute Maximum RatingsItem RatingTerminal Voltage (with respect to GND)VCC -0.3V to +6.0VRESET, RESET (push-pull) -0.3V to (VCC + 0.3V)to-0.3V+6.0VRESETdrain)(open20mAVCCInputCurrent,Output Current, RESET, RESET 20mAVCC 100V/µsRateRise,ofContinuous Power Dissipation (TA = +70°C)3-Pin SC70 (derate 2.17mW/°C above +70°C) 174mW3-Pin SOT23 (derate 4mW/°C above +70°C) 320mWOperating Temperature Range+125°Cto-40°C3-PinSC70+105°Cto3-Pin-40°CSOT23Storage Temperature Range -65°C to +150°CLead Temperature (soldering, 10s) +300°CII. Manufacturing InformationA. Description/Function: 3-Pin Microprocessor Reset CircuitsB. Process: B8 (Standard 0.8 micron silicon gate CMOS)C. Number of Device Transistors: 380D. Fabrication Location: California, USAE. Assembly Location: MalaysiaF. Date of Initial Production: January, 2000III. Packaging InformationSC70-3A. Package Type: 3-PinB. Lead Frame: Alloy 42C. Lead Finish: Solder Plate or 100% Matte TinD. Die Attach: Nonconductive EpoxyE. Bondwire: Gold (1 mil dia.)F. Mold Material: Epoxy with silica fillerG. Assembly Diagram: # 05-1601-0082H. Flammability Rating: Class UL94-V0I. Classification of Moisture Sensitivityper JEDEC standard J-STD-020-C: Level 1IV. Die InformationA. Dimensions: 30 x 30 milsPassivation: Si3N4/SiO2 (Silicon nitride/ Silicon dioxide)B.C. Interconnect: Aluminum/Si (Si = 1%)D. Backside Metallization: NoneE. Minimum Metal Width: 0.8 microns (as drawn)F. Minimum Metal Spacing: 0.8 microns (as drawn)G. Bondpad Dimensions: 5 mil. Sq.H. Isolation Dielectric: SiO2I. Die Separation Method: Wafer SawV. Quality Assurance InformationA. Quality Assurance Contacts: Jim Pedicord (Manager, Reliability Operations)Bryan Preeshl (Managing Director of QA)B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet.0.1% For all Visual Defects.C. Observed Outgoing Defect Rate: < 50 ppmD. Sampling Plan: Mil-Std-105DVI. Reliability EvaluationA. Accelerated Life TestThe results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure Rate (λ) is calculated as follows:λ = 1 = 1.83 (Chi square value for MTTF upper limit)MTTFλ = 6.87 x 10-9λ = 6.87 F.I.T. (60% confidence level @ 25°C)This low failure rate represents data collected from Maxim’s reliability monitor program. In addition to routine production Burn-In, Maxim pulls a sample from every fabrication process three times per week and subjects it to an extended Burn-In prior to shipment to ensure its reliability. The reliability control level for each lot to be shipped as standard product is 59 F.I.T. at a 60% confidence level, which equates to 3 failures in an 80 piece sample. Attached Burn-In Schematic (Spec. #06-5033) shows the static Burn-In circuit. Maxim performs failure analysis on any lot that exceeds this reliability control level. Maxim also performs quarterly 1000 hour life test monitors. This data is published in the Product Reliability Report (RR-1N). Current monitor data for the B8/S8 Process results in a FIT rate of 0.17 @ 25°C and 2.92 @ 55°C (eV = 0.8, UCL = 60%).B. Moisture Resistance TestsMaxim pulls pressure pot samples from every assembly process three times per week. Each lot sample must meet an LTPD = 20 or less before shipment as standard product. Additionally, the industry standard 85°C/85%RH testing is done per generic device/package family once a quarter.C. E.S.D. and Latch-Up TestingThe MS42 die type has been found to have all pins able to withstand a transient pulse of ±2500V, per Mil-Std-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device withstands a current of ±250mA.Table 1Reliability Evaluation Test ResultsMAX803S EXRTEST ITEM TEST CONDITION FAILURE SAMPLE NUMBER OFSIZEFAILURES IDENTIFICATION PACKAGEStatic Life Test (Note 1)160DCParametersTa = 135°CBiased & functionalityTime = 192 hrs.Moisture Testing (Note 2)77SC70ParametersPressure Pot Ta = 121°CDCP = 15 psi. & functionality100%RH=Time = 168hrs.77ParametersTa85°C DC85/85=85% &functionality=RHBiased1000hrs.=TimeMechanical Stress (Note 2)77 0ParametersTemperature -65°C/150°CDCfunctionalityCycles&1000Cycle1010MethodNote 1: Life Test Data may represent plastic DIP qualification lots.Note 2: Generic Package/Process dataAttachment #1TABLE II. Pin combination to be tested. 1/ 2/1/ Table II is restated in narrative form in 3.4 below. 2/ No connects are not to be tested. 3/ Repeat pin combination I for each named Power supply and for ground (e.g., where V PS1 is V DD , V CC , V SS , V BB , GND, +V S, -V S , V REF , etc). 3.4 Pin combinations to be tested. a.Each pin individually connected to terminal A with respect to the device ground pin(s) connected to terminal B. All pins except the one being tested and the ground pin(s) shall be open. b. Each pin individually connected to terminal A with respect to each different set of a combination of all named power supply pins (e.g., V SS1, or V SS2 or V SS3 or V CC1, or V CC2) connected to terminal B. All pins except the one being tested and the power supply pin or set of pins shall be open.c.Each input and each output individually connected to terminal A with respect to a combination of all the other input and output pins connected to terminal B. All pins except the input or output pin being tested and the combination of all the other input and output pins shall be open.Terminal A (Each pin individually connected to terminal A with the other floating) Terminal B (The common combination of all like-named pins connected to terminal B) 1. All pins except V PS1 3/ All V PS1 pins 2. All input and output pinsAll other input-output pinsMil Std 883DMethod 3015.7Notice 8 TERMINAL BTERMINAL APROBE (NOTE 6) R = 1.5k ΩC = 100pf。
诺西参数对照
er 本参数定义了RRU每个通道的最大发射功率 to 中的设置范围）
44.8 dBm, dlCellPwrRed PMAX 物理取值范围：37.0 最大输出功率 maximum 信道功率配置； value (0), 小区内所有
39.0 is 6.5 (1), 下 dB
行物理通道的线性总功率要计算得出。例如:2x2的小区最大发射功率为
maxNumR = 200
(
：1„3, step MAXNRSYMPDCCH 1（在NSN PDCCH eNB 在每一个TTI 最大占用的OFDM 系统中site 里使用相同的符号数用于PDCCH manager 小区配置； 符号数量 中的设置范围）
如果phichDur 物理取值范围：1„3,（实际参数在系统中起作用的范围）
eNodeB 物理取值范围：false 建议设置为true(1)，开启基于覆盖切换功能。 true(1) , true
物理单位：无 无
值范围：0„8（在NSN TDDSPECSUBFCONF 该参数用于配置DwPTS、GP 系统中site 特殊子帧配置 manager 帧、信道配置类； 和UpPTS 中的设置范围）
物理取值范围：0...6（实际参数在系统中起作用的范围）
中只支持配置为1、2；
CELL 中通知UE； 参数变更需重启eNB 1 转 生效；
换周期为10ms TDD 物 系统下帧结构的改变会与邻近的小 理单位：1（实际参数的物理单位 表示每10ms 有一个特殊时隙 ENABLECOVHO INIPRBSUL 0 eNodeB 本参数功能是开启基于覆盖的切换功能 属性参数/切换 参数取值范围：0,1
CELL 根据规划的最大小区半径及复用距离进行设置。 无物理单位：无 需要重启小区
maxtec maxventuri 用户手册 - 中文（简体）说明书
866.4.Maxtec
I
警告
表示潜在的危险情况，如果不避免，可能导致死亡或严重损伤。
» 本器械不适于与生命支持器械／系统联用。 » 未遵从本手册中的警告或预防措施可能导致仪器损坏并威胁到患者和／或医护人员的福祉。 » 不正确使用本器械可能造成流量和氧气读数不准确，从而导致不正确的治疗、缺氧症或高氧
症、以及其他患者损伤或不适。请遵照本用户手册中概括的流程。
» 请勿在火焰、易燃／易爆物质、蒸气或氛围附近使用本器械。 在上述环境中操作氧气分析器
可能导致火灾或爆炸。 » 请勿在 MRI 环境中使用本器械。 » 本器械整体（包括电极）不适于在易燃麻醉剂混合物存在下或在易爆气体氛围中使用。 在上
述环境中操作氧气分析器可能导致火灾或爆炸。 » 如果 O2% 偏离了设定的水平，请检查患者界面的鼻腔插管未被痰液或鼻中隔堵塞。对回路或
患者界面的流量限制将导致氧气水平的升高。 对喉管的流量限制将不能被流量计检测出。 » 本器械在氧气供应中断时不会发出警报。 » 在调整氧气含量前确保氧气读数稳定。 » 本器械在氧气水平过高或过低时不会发出警报。 » 请勿在患者头部或颈部附近保留过长导管，以避免导致窒息。 » 请仅使用 Maxtec 替换传感器。 使用其他任何传感器将导致保修失效并可能导致产品损坏、
Maxtec 建议控制阀的 o 型环每 2 年更换或保养一次。
本保修不包含常规维护项目，如电池。对因使用后或因设备的滥用、误用、错误应用、改造、疏 忽或意外而造成的购买者或其他人的附带或后果损害，Maxtec 概不负责。
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MAX1978ETM+中文资料
________________________________________________________________ Maxim Integrated Products
AIN+ AINAOUT
UT
1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at .
元器件交易网
Integrated Temperature Controllers for Peltier Modules MAX1978/MAX1979
ABSOLUTE MAXIMUM RATINGS
VDD to GND ..............................................................-0.3V to +6V SHDN, MAXV, MAXIP, MAXIN, CTLI, OT, UT to GND............................................-0.3V to +6V FREQ, COMP, OS1, OS2, CS, REF, ITEC, AIN+, AIN-, AOUT, INT-, INTOUT, BFB+, BFB-, FB+, FB-, DIFOUT to GND......................................-0.3V to (VDD + 0.3V) PVDD1, PVDD2 to VDD ...........................................-0.3V to +0.3V PVDD1, PVDD2 to GND...............................-0.3V to (VDD + 0.3V) PGND1, PGND2 to GND .......................................-0.3V to +0.3V COMP, REF, ITEC, OT, UT, INTOUT, DIFOUT, BFB-, BFB+, AOUT Short to GND .............................Indefinite Peak LX Current (MAX1978) (Note 1).................................±4.5A Peak LX Current (MAX1979) (Note 1)....................................+9A Continuous Power Dissipation (TA = +70°C) 48-Lead Thin QFN-EP (derate 26.3mW/°C above +70°C) (Note 2) .................2.105W Operating Temperature Ranges MAX1978ETM ..................................................-40°C to +85°C MAX1979ETM ..................................................-40°C to +85°C Maximum Junction Temperature .....................................+150°C Storage Temperature Range .............................-65°C to +150°C Lead Temperature (soldering, 10s) .................................+300°C
MAX1968EUI-T中文资料
ELECTRICAL CHARACTERISTICS
(VDD = PVDD1 = PVDD2 = SHDN = 5V, PGND1 = PGND2 = FREQ = GND, CTLI = MAXV = MAXIP = MAXIN = REF, CREF = 1µF, CCOMP = 0.1µF, LLX_ = 3.3µH, CCS = COS2 = 1µF, ITEC < 3ARMS (MAX1968), ITEC < 6ARMS (MAX1969), TA = 0°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.)
Peak LX Current (MAX1968) (Note 1).................................±4.5A Peak LX Current (MAX1969) (Note 1)....................................+9A Continuous Power Dissipation (TA = +70°C)
元器件交易网
19-2447; Rev 2; 2/07 EVAALVUAAILTAIOBNLEKIT
Power Drivers for Peltier TEC Modules
MAX1968/MAX1969
General Description
The MAX1968/MAX1969 are highly integrated and costeffective, high-efficiency, switch-mode drivers for Peltier thermoelectric cooler (TEC) modules. Both devices utilize direct current control to eliminate current surges in the TEC. On-chip FETs minimize external components while providing high efficiency. A 500kHz/1MHz switching frequency and a unique ripple cancellation scheme reduce component size and noise.
C16000中文操作手册
试剂条码：为二维条型码，包含信息有：名称，序列号，批号，容器尺寸，效期， 上机稳定时间。在试剂盒顶部标明 1 或 2 试剂，便于放置。
试剂容器：试剂容器放置于试剂转盘中，容器除放置检测试剂外，还可以放置稀释 清洗液，样本稀释液和水浴添加剂。容量和形状包括：20ml，55ml，90ml，100ml 盒状和 20ml 瓶状。
1.1.4 分样系统的组成和功能 分样系统包括： 1）机上样本转盘：有冷藏功能，除 2 个位置放置探针清洗液，用于探针的清洗保养 （31 号位放置 0.5%酸洗液，32 号位放置去污液 A）外，其余 30 个位置可放置样本、 标准品或质控品，1 号位在日保养时放置 ICT 清洗液。机上转盘中样本将优先于 RSH 轨道上的样本进行检测。
1.2.8 机上溶液：机上溶液为吸样探针，试剂探针，混匀器和反应杯清洗用的去污液。主要 在一些特殊的清洗（SmartWash）模式使用。有些是用于保养程序。自定义放置于 R1 （C1、C2、C3 和 D1、D2、D3）或 R2（C1、C2、C3 和 D1、D2、D3），主要有：
0.5%酸洗液（用酸洗液进行 0.5%稀释） 去污液 A，主要成份为 2-氨基乙醇 10%去污液 B（用去污液 B 进行 10%稀释），主要成份为 NaOH
ARCHITECT C16000 中文操作手册
美国雅培诊断产品中国部
第一章 C16000 系统组成和检测原理
1.1 系统总览 1.1.1 仪器主要组成 系统主要由三个部分组成：系统控制中心（SCC），运行模块（PM）和样本轨道（RSH）
1.1.2 系统控制中心（SCC）的标准配置 17 寸平面触摸式彩色显示屏 P III 以上的 CPU 1.44MM 软盘驱动器，CD-RW 可读写式光盘驱动器 标准键盘，鼠标，网络 HUB，各类以太网接口 另可选配打印机，条码阅读器，UPS 等。
锐捷网络RG-ENT16000系列以太网终端设备说明书
Comply with IEEE 802.3, 802.3u, 802.3ab and 802.3z Ethernet StandardSupport IEEE 802.3ah In-band and TS 1000 OAM management Front panel test button to trigger auto loopback testComply with SFF-8472 industry-standard and support SFP DDM (Digital Diagnostics Monitoring)Support WDM Bi-directional SFP module with specific wavelength for various distanceSupport copper line cable diagnostics feature Comply with IEEE 802.1q Tag VLAN Support Q-in-Q function Maximum Frame size 9K bytes Ethernet bandwidth ControlSupport 10/100BASE-TX and 10/100/1000BASE-T, Flow Control, Auto MDI/MDIX, and Manual settingLED indicators for ease of network diagnosticSupport Link Status TransparentAlarm : Interruption to Electrical / optical interface 、Power failure 、Thermal failure on Chassis and Login UNMS system failed 、SFP DDM Firmware upgrade via HTTP In- band IP NMS Interface supportedCentralized management for CO-side equipment iEAC-16 chassis supports 16 Line cardsReport all alarm status to the designated NMS and computer terminal interfaceTAINET’s new Ethernet Network Terminal Unit Series allows the operator to separate each user's traffic and offer services such as inter-office LAN connectivity, Internet access and secure virtual private networks (VPNs). This approach extends the service over fiber, facilitating management of differentiated services up to the customer premises while ensuring service level agreement (SLA) enforcement.ENTU 763S/FE and GE are so called Ethernet Media Data Converter (MDC), It can convert 10/100/1000 BASE-TX to 1000BASE-X or 1000BASE-T to 10/100/1000 BASE-X via optical fiber cable to extend transmission distance. At the customer premise which allows the operator to reach customer over fiber, while still providing a standard Ethernet copper connection, and being part of the operator’s network, enables the converter to act as a demarcation point between the operator and the customer. Ethernet in the Local Loop reduces carrier expenses, since Ethernet ports are far less expensive than other options, TAINET’s cost-effective, remotely-managed ENTU series is an ideal fiber solution for every carrier's Local Loop because it provides access regardless of the backbone technology, and cost saving which can be passed on by the carrier to consumers.TAINET’s iEAC-16 is a 2U high 19” rack containing a controller MCU-16, redundant AC/DC power modules and 16 slots with ENTU763C+ types of line cards. Therefore, iEAC-16 is able to extend Ethernet traffic over optical fiber, copper line such as G.SHDSL.bis line with 2w/4w/8w and VDSL line with 2-wire copper or coaxial cable. iEAC-16 is an ideal product to provide high density Ethernet extender installation in central offices or enterprises.TAINET COMMUNICATION SYSTEM CORP.ENTU 763HS+Headquarters3F., No.108, Ruiguang Rd., Neihu Dist., Taipei City 114, TaiwanModel-ENTU 763HS+/GE, industrial standalone Gigabit Ethernet NTU Standalone and card type versions can be placed in CPE and CO equipment.Network Interface- Connector type: SFP-LC- 100Base-FX or 1000Base-X SFP portPSupport SFP DDM (Digital Diagnostic Monitoring): Compliant with SFF-8472 SFP DDM (Digital Diagnostic Monitoring),temperature, supply voltage, bias current, transmitted power, received power-100BASE-FX with the transmission speed of 100Mbps,1000BASE-FX with the transmission speed of 1000Mbps, single-core bidirectional SFP module-For detailed wavelength and distance of SFP modules, please refer to SFP Transceivers datasheetUser Interface- Connector type: Shield RJ-45 jack - 10/100Base-Tx / 1000Base-T- Auto-MDI/MDIX detection and Manual setting- Auto-negotiation 10/100Base-TX for speed and Full duplex / Half - Support 10/100/1000Base-T for speed and Full duplex - Support copper line cable diagnostics feature- Complies with IEEE 802.1q Tag VLAN (including Q-in-Q) -Ethernet bandwidth control and support Jumbo frameManagement & OAM Functions- Configuration via DIP switch- Configuration via craft port VT-100 and WEB GUI - Console: RJ45 connector (RS232C) - HTTP firmware upgrade - RMON counter- Front panel test button for easy loop healthy testing - Reset button back to factory default-Support warning threshold for setting the upper and lower limit of optical parameters. When parameters monitor reaches the limit, it will send a warning messageTEL: +886-2-26583000 FAX: +886-2-27938000 E-mail: ****************-Support IEEE 802.3ah Link Layer OAM P Auto discovery P Link monitoring P Remote loopback test P Remote fault detectionLink Fault Reflection Dying Gasp Critical Event-Support TS-1000 OAM P Loopback testP Reset remote deviceP Get remote device information P Remote port settingLED Indicators-ENTU 763+ s eries:P PWR, LNK, CO, TST, DPX, RF, LAN LNK/SPD Power Requirement- AC/DC, DC/DC external power adapter (12V, 0.5A) -Power consumption:P ENTU 763HS+/GE = 3.3WDimension- ENTU 763HS+: 87(W) x 172(D) x 24(H) mm Operating Environment- Operating temperature: 0 oC ~ 65 oC- Storage Temperature: -20 o C ~ 70 oC -Humidity: 90%, non-condensingFiberiEAC-16ENTU 763S+FE/GEsENTU 763SFE/GEENTU 763HS+FE/GEENTU 763S+FE/GEFiber802.3ah & TS-1000 OAM SupportingIP, Metro EthernetNetworkInternet ServiceUNMSPrivate NetworkCarrier/ Service Provider/ Campus/ Enterprise/ Utility。
T16000M硬件使用说明书
技术特点：1. 数字按键2. 多方向苦力帽3. 右手橡胶托4. 通过旋转摇杆操作尾舵5. 油门6. 15个按钮7. 通过螺丝来固定适应左手或右手的掌托8.右拇指橡胶托9. PC USB接口10.左手拇指橡胶托11.左手橡胶托12.左右手按键习惯，选择开关硬件使用说明书飞行摇杆基础问题独有精密技术："H.E.A.R.T™: 霍尔磁感应技术你的T-16000M摇杆功能技术，是目前无与伦比的飞行摇杆，包括：- 摇杆采用3D（霍尔效应）磁传感器，分辨率为超过268万，在X和Y轴（16384 x16384）的值，而目前的同类系统（甚至高端系统）提供只有100万值的分辨率（1024×1024的值）。
- 磁感无摩擦，确保无限精度和令人难以置信的响应。
- 线圈弹簧棒（高度仅2.8mm）：稳定，线性和超平和的张力。
背光T-16000M中间死区设置了绿色背光。
只要你移动操纵杆（即使非常轻微），绿色背光就会亮起。
在静止状态下背光会在3秒后自动关闭.油门你的摇杆油门(5), 可以轻松的控制你游戏中的速度尾舵功能您的摇杆具备尾舵功能（4），与飞机上的脚踏板相对应的方式。
通过水平转动摇杆向左或者向右来控制飞机舵面（向左转或向右转）多方向苦力帽您的摇杆设有多方向苦力帽（2），正如其名称所示，允许您即刻查看飞机周边的状态（游戏中支持的情况下）。
大多数游戏此功能为默认。
如未默认，只需进入游戏的按键设置菜单进行设置。
当然你也可以将苦力帽设置为其他功能。
但不建议设置为（开火键等）灵活的设计你的T-16000M摇杆完全适应所有的左右手不同习惯的人，你可以通过调整拇指橡胶托，来适应你的需求。
一共提供三种方式的调整。
右手模式左手模式右手模式配置 左手模式按钮配置在右手的模式要设置的12个按钮的位置位于右手模式的基础上，在摇杆底座下方，设置选择器开关: RIGHT HANDED右手模式按钮配置在右手的模式要设置的12个按钮的位置位于左手模式的基础上，在摇杆底座下方，设置选择器开关: "LEFT HANDED":左手模式配置调整手休息区左手或右手模式默认为适应右手模式，如调整为左手模式:A) 使用一个小螺丝刀，小心松开小的掌托，位于左侧的手托。
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General DescriptionThe MAX16000–MAX16007 are low-voltage, quad-/hex-/octal-voltage µP supervisors in a small thin QFN pack-age. These devices provide supervisory functions for complex multivoltage systems.The MAX16000/MAX16001/MAX16002 monitor four voltages, the MAX16003/MAX16004/MAX16005 monitor six voltages,and the MAX16006/MAX16007 monitor eight voltages.The MAX16000/MAX16001/MAX16003/MAX16004/MAX16006 offer independent outputs for each moni-tored voltage. The MAX16001/MAX16002/MAX16004–MAX16007 offer a reset output that asserts whenever any of the monitored voltages fall below their respective thresholds or the manual reset input is asserted. The reset output remains asserted for the reset timeout after all voltages are above their respective thresholds and the manual reset input is deasserted. The minimum reset timeout is internally set to 140ms or can be adjust-ed with an external capacitor.All open-drain outputs have internal 30µA pullups that eliminate the need for external pullup resistors.However, each output can be driven with an external voltage up to 5.5V. Other features offered include a manual reset input, a tolerance pin for selecting 5% or 10% input thresholds, and a margin enable function for deasserting the outputs during margin testing.The MAX16001/MAX16002/MAX16004–MAX16007 offer a watchdog timer that asserts RESET or an indepen-dent watchdog output (MAX16005) when the watchdog timeout period (1.6s typ) is exceeded. The watchdog timer can be disabled by floating the input.These devices are offered in 12-, 16-, 20-, and 24-lead thin QFN packages (4mm x 4mm) and are fully speci-fied from -40°C to +125°C.ApplicationsStorage Equipment ServersNetworking/Telecommunication Equipment Multivoltage ASICsFeatures♦Fixed Thresholds for 5V, 3.3V, 3V, 2.5V, 1.8V,1.5V, 1.2V, and 0.9V Systems♦Adjustable Thresholds Monitor Voltages Down to 0.4V♦Open-Drain Outputs with Internal Pullups Reduce the Number of External Components♦Fixed 140ms (min) or Capacitor-Adjustable Reset Timeout♦Manual Reset, Margin Enable, and Tolerance Select Inputs ♦Watchdog Timer1.6s (typ) Timeout Period54s Startup Delay After Reset (Except MAX16005)♦Independent Watchdog Output (MAX16005)♦RESET Output Indicates All Voltages Present ♦Independent Voltage Monitors♦Guaranteed Correct Logic State Down to V CC = 1V ♦Small (4mm x 4mm) Thin QFN PackageMAX16000–MAX16007Low-Voltage, Quad-/Hex-/Octal-Voltage µPSupervisors in TQFN________________________________________________________________Maxim Integrated Products 1Ordering InformationTypical Operating Circuit19-3870; Rev 2; 7/06For pricing, delivery, and ordering information,please contact Maxim/Dallas Direct!at 1-888-629-4642, or visit Maxim’s website at .Note: The “_” is a placeholder for the input voltage threshold.See Table 1.+Denotes lead-free package.For tape-and-reel, add a “T” after the “+.” Tape-and-reel are offered in 2.5k increments. *EP = Exposed paddle.Ordering Information continued at end of data sheet.Selector Guide appears at end of data sheet.M A X 16000–M A X 16007Low-Voltage, Quad-/Hex-/Octal-Voltage µP Supervisors in TQFN 2_______________________________________________________________________________________ABSOLUTE MAXIMUM RATINGSELECTRICAL CHARACTERISTICS(V CC = 2.0V to 5.5V, T A = -40°C to +125°C, unless otherwise specified. Typical values are at V CC = 3.3V, T A = +25°C.) (Note 1)Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.V CC , OUT_, IN_, RESET , WDO to GND....................-0.3V to +6V TOL, MARGIN , MR , SRT, WDI, to GND..........-0.3V to V CC + 0.3Input/Output Current (RESET , MARGIN ,SRT, MR , TOL, OUT_, WDO , WDI)..............................±20mA Continuous Power Dissipation (T A = +70°C)12-Pin TQFN (derate 16.9mW/°C above +70°C)......1349mW 16-Pin TQFN (derate 16.9mW/°C above +70°C)......1349mW 20-Pin TQFN (derate 16.9mW/°C above +70°C)......1355mW 24-Pin TQFN (derate 16.9mW/°C above +70°C)......1666mWOperating Temperature Range .........................-40°C to +125°C Junction Temperature .....................................................+150°C Storage Temperature Range.............................-65°C to +150°C Lead Temperature (soldering, 10s).................................+300°CMAX16000–MAX16007Low-Voltage, Quad-/Hex-/Octal-Voltage µPSupervisors in TQFN_______________________________________________________________________________________3ELECTRICAL CHARACTERISTICS (continued)M A X 16000–M A X 16007Low-Voltage, Quad-/Hex-/Octal-Voltage µP Supervisors in TQFN 4_______________________________________________________________________________________ELECTRICAL CHARACTERISTICS (continued)Note 2:The outputs are guaranteed to be in the correct logic state down to V CC = 1V.Note 3:Measured with WDI, MARGIN , and MR unconnected.Note 4:The minimum and maximum specifications for this parameter are guaranteed by using the worst case of the SRT ramp cur-rent and SRT threshold specifications.Note 5:Guaranteed by design and not production tested.Note 6:Amount of time required for logic to lock/unlock outputs from margin testing.Typical Operating Characteristics(V CC = 3.3V, T A = +25°C, unless otherwise noted.)SUPPLY CURRENT vs. SUPPLY VOLTAGESUPPLY VOLTAGE (V)S U P P L Y C U R R E N T (µA )1.52.02.53.0 3.54.0 4.55.05.530354045505560SUPPLY CURRENT vs. TEMPERATURETEMPERATURE (°C)S U P P L Y C U R R E N T (µA )-40-25-10520355065809511012530354045505560NORMALIZED THRESHOLD 2.5vs. SUPPLY VOLTAGESUPPLY VOLTAGE (V)N O R M A L I Z E D T H R E S H O L DM A X 16000 t o c 031.52.03.0 3.54.0 4.55.0 5.50.9900.9930.9950.9981.0001.0031.0051.0081.010NORMALIZED THRESHOLD vs. TEMPERATURETEMPERATURE (°C)N O R M A L I Z E D T H R E S H O L DM A X 16000 t o c 04-40-25-1052035506580951101250.9950.9960.9970.9980.9991.0001.001OUTPUT VOLTAGE vs. SINK CURRENTSINK CURRENT (mA)V O U T _ (m V )123456780255075100OUTPUT VOLTAGE vs. SOURCE CURRENTSOURCE CURRENT (µA)V C C - V O U T _ (m V )5101520253002004006008001000RESET TIMEOUT PERIOD vs. TEMPERATURETEMPERATURE (°C)T I M E O U T P E R I O D (m s )M A X 16000 t o c 08-40-25-1052035506580951101251901911921931941951961971981101001000MAXIMUM TRANSIENT DURATIONvs. INPUT OVERDRIVEINPUT OVERDRIVE (mV)M A X I M U M T R A N S I E N T D U R A T I O N (µs )6000100200300400500RESET TIMEOUT DELAYOUT12V/div IN15V/div40ms/divRESET 2V/divMAX16000–MAX16007Low-Voltage, Quad-/Hex-/Octal-Voltage µPSupervisors in TQFN_______________________________________________________________________________________5Typical Operating Characteristics (continued)(V CC = 3.3V, T A = +25°C, unless otherwise noted.)10000.010.111010010001001010.10.01RESET TIMEOUT PERIODvs. C SRTM A X 16000 t o c 10C SRT (nF)t R P (m s )WATCHDOG TIMEOUT PERIODvs. TEMPERATURETEMPERATURE (°C)W A T C H D O G T I M E O U T P E R I O D (s )M A X 16000 t o c 11-40-25-1052035506580951101251.501.511.521.531.541.551.561.571.581.591.60MARGIN ENABLE FUNCTIONMAX16000 toc12OUT_2V/divMARGIN 2V/div100µs/divRESET 2V/divOUT_ AND RESET ARE BELOW RESPECTIVE THRESHOLDS MARGIN DISABLE FUNCTIONMAX16000 toc13OUT_2V/div MARGIN 2V/div100µs/divRESET 2V/divOUT_ AND RESET ARE BELOW RESPECTIVE THRESHOLDSREFERENCE VOLTAGE vs. SOURCE CURRENTSOURCE CURRENT (µA)V R E F (V )1002003004005006001.2201.2251.2301.2351.2401.2451.2501.2551.260REFERENCE VOLTAGE vs. SUPPLY VOLTAGESUPPLY VOLTAGE (V)R E F E R E N C E V O L T A G E (V )1.52.02.53.0 3.54.0 4.55.05.51.2201.2251.2301.2351.2401.2451.2501.2551.260REFERENCE VOLTAGE vs. TEMPERATURETEMPERATURE (°C)R E F E R E N C E V O L T A G E (V )-40-25-1052035506580951101251.201.211.221.231.241.251.261.271.28M A X 16000–M A X 16007Low-Voltage, Quad-/Hex-/Octal-Voltage µP Supervisors in TQFN 6_______________________________________________________________________________________MAX16000–MAX16007Low-Voltage, Quad-/Hex-/Octal-Voltage µPSupervisors in TQFN_______________________________________________________________________________________7Pin Description (MAX16000/MAX16001/MAX16002)M A X 16000–M A X 16007Low-Voltage, Quad-/Hex-/Octal-Voltage µP Supervisors in TQFN 8_______________________________________________________________________________________Pin Description (MAX16003/MAX16004/MAX16005)MAX16000–MAX16007Low-Voltage, Quad-/Hex-/Octal-Voltage µPSupervisors in TQFN_______________________________________________________________________________________9Pin Description (MAX16003/MAX16004/MAX16005) (continued)M A X 16000–M A X 16007Low-Voltage, Quad-/Hex-/Octal-Voltage µP Supervisors in TQFN 10______________________________________________________________________________________Pin Description (MAX16006/MAX16007)Supervisors in TQFNPin Description (MAX16006/MAX16007) (continued)MAX16000–MAX16007M A X 16000–M A X 16007Supervisors in TQFNMAX16000–MAX16007Supervisors in TQFNFigure 1. MAX16000D Functional DiagramFunctional DiagramsM A X 16000–M A X 16007Supervisors in TQFNFunctional Diagrams (continued)MAX16000–MAX16007Supervisors in TQFNFigure 3. MAX16003C/MAX16004C Functional DiagramFunctional Diagrams (continued)M A X 16000–M A X 16007Supervisors in TQFNFigure 4. MAX16005C Functional DiagramFunctional Diagrams (continued)MAX16000–MAX16007Supervisors in TQFNFigure 5. MAX16006C/MAX16007C Functional DiagramFunctional Diagrams (continued)M A X 16000–M A X 16007Supervisors in TQFN Detailed DescriptionThe MAX16000–MAX16007 are low-voltage, quad-/hex-/octal-voltage µP supervisors in a small thin QFN pack-age. These devices provide supervisory functions for complex multivoltage systems. The MAX16000/MAX16001/MAX16002 monitor four voltages, the MAX16003/MAX16004/MAX16005 monitor six voltages,and the MAX16006/MAX16007 monitor eight voltages.The MAX16000/MAX16001/MAX16003/MAX16004/MAX16006 offer independent outputs for each moni-tored voltage. The MAX16001/MAX16002/MAX16004–MAX16007 offer a reset output that asserts whenever any of the monitored voltages fall below their respective thresholds or the manual reset input is asserted. The reset output remains asserted for the reset timeout after all voltages are above their respective thresholds and the manual reset input is deasserted. The minimum reset timeout is internally set to 140ms or can be adjusted with an external capacitor.All open-drain outputs have internal 30µA pullups that eliminate the need for external pullup resistors.However, each output can be driven with an external voltage up to 5.5V. Other features offered include a manual reset input, a tolerance pin for selecting 5% or 10% input thresholds, and a margin enable function for deasserting the outputs during margin testing.The MAX16001/MAX16002/MAX16004–MAX16007 offer a watchdog timer that asserts RESET or an indepen-dent watchdog output (MAX16005) when the watchdog timeout period (1.6s typ) is exceeded. The watchdog timer can be disabled by floating the input.Applications InformationUndervoltage-Detection CircuitThe open-drain outputs of the MAX16000–MAX16007can be configured to detect an undervoltage condition.Figure 6 shows a configuration where an LED turns on when the comparator output is low, indicating an undervoltage condition. These devices can also be used in applications such as system supervisory moni-toring, multivoltage level detection, and V CC bar-graph monitoring (Figure 7).Tolerance (TOL)The MAX16000–MAX16007 feature a pin-selectable threshold tolerance. Connect TOL to GND to select 5%threshold tolerance. Connect TOL to V CC to select 10%threshold tolerance.Window DetectionA window detector circuit uses two auxiliary inputs in the configuration shown in Figure 8. External resistors set the two threshold voltages of the window detector circuit. External logic gates create the OUT signal. The window detection width is the difference between the threshold voltages (Figure 9).Figure 6. Quad Undervoltage Detector with LED IndicatorsFigure 7. V CC Bar-Graph MonitoringMAX16000–MAX16007Supervisors in TQFNAdjustable InputThese devices offer several monitor options with adjustable input thresholds (see Table 1). The threshold voltage at each adjustable IN_ input is typically 0.394V (TOL = GND) or 0.372 (TOL = V CC ). To monitor a voltage V INTH , connect a resistive-divider network to the circuit as shown in Figure 10.V INTH = V TH ((R1 / R2) + 1)R1 = R2 ((V INTH / V TH ) - 1)Large resistors can be used to minimize current through the external resistors. For greater accuracy, use lower-value resistors.Unused InputsConnect any unused IN_ inputs to a voltage above its threshold.OUT_Outputs(MAX16000/MAX16001/MAX16003/MAX16004/MAX16006)The OUT_ outputs go low when their respective IN_inputs drop below their specified thresholds. The output is open drain with a 30µA internal pullup to V CC . For many applications, no external pullup resistor is required to interface with other logic devices. An external pullupresistor to any voltage from 0 to 5.5V overrides the inter-nal pullup if interfacing to different logic supply voltages.Internal circuitry prevents reverse current flow from the external pullup voltage to V CC (Figure 11).Figure 10. Setting the Adjustable InputFigure 9. Output Response of Window Detector CircuitM A X 16000–M A X 16007Supervisors in TQFN RESET Output (MAX16001/MAX16002/MAX16004–MAX16007)RESET asserts low when any of the monitored voltages fall below their respective thresholds or MR is asserted.RESET remains asserted for the reset timeout period after all monitored voltages exceed their respective thresholds and MR is deasserted (see Figure 12). This open-drain output has a 30µA internal pullup. An exter-nal pullup resistor to any voltage from 0 to 5.5V overrides the internal pullup if interfacing to different logic supply voltages. Internal circuitry prevents reverse current flow from the external pullup voltage to V CC (Figure 11).WDO (MAX16005 Only)WDO asserts low whenever the watchdog timer times out or any of the IN_ inputs falls below its respective threshold. WDO deasserts after a valid WDI transition without a reset timeout period. WDO deasserts withouta timeout delay when all the IN_ inputs rise above their thresholds. Pull MR low to deassert WDO . WDO remains deasserted while MR is low. The watchdog timer begins counting after the reset timeout period after MR goes high. Pull MARGIN to deassert WDO .Reset Timeout CapacitorThe reset timeout period can be adjusted to accommo-date a variety of µP applications from 50µs to 1.12s.Adjust the reset timeout period (t RP ) by connecting a capacitor (C SRT ) between SRT and GND. Calculate the reset timeout capacitor as follows:Connect SRT to V CC for a factory-programmed reset timeout of 140ms (min).Figure 11. Interfacing to a Different Logic Supply Voltage Figure 12. Output Timing DiagramMAX16000–MAX16007Supervisors in TQFN______________________________________________________________________________________21Manual Reset Input (MR )(MAX16001/MAX16002/MAX16004–MAX16007)Many µP-based products require manual reset capabil-ity, allowing the operator, a test technician, or external logic circuitry to initiate a reset. A logic-low on MR asserts RESET low. RESET remains asserted while MR is low, and during the reset timeout period (140ms min)after MR returns high. The MR input has an internal 20k Ωpullup resistor to V CC , so it can be left uncon-nected if not used. MR can be driven with TTL or CMOS-logic levels, or with open-drain/collector out-puts. Connect a normally open momentary switch from MR to GND to create a manual reset function. External debounce circuitry is not required. If MR is driven from long cables or if the device is used in a noisy environ-ment, connecting a 0.1µF capacitor from MR to GND provides additional noise immunity.Margin Output Disable (MARGIN )MARGIN allows system-level testing while power sup-plies are adjusted from their nominal voltages. Drive MARGIN low to force RESET , WDO,and OUT_ high,regardless of the voltage at any monitored input. The state of each output does not change while MARGIN =GND. The watchdog timer continues to run when MARGIN is low, and if a timeout occurs, WDO /RESET will assert t MD after MARGIN is deasserted.The MARGIN input is internally pulled up to V CC . Leave MARGIN unconnected or connect to V CC if unused.Power-Supply BypassingThe MAX16000–MAX16007 operate from a 2.0V to 5.5V supply. An undervoltage lockout ensures that the out-puts are in the correct states when the UVLO is exceed-ed. In noisy applications, bypass V CC to ground with a 0.1µF capacitor as close to the device as possible. The additional capacitor improves transient immunity. For fast-rising V CC transients, additional capacitance may be required.Ordering Information (continued)Chip InformationPROCESS:BiCMOSNote: The “_” is a placeholder for the input voltage threshold.See Table 1.+Denotes lead-free package.For tape-and-reel, add a “T” after the “+.” Tape-and-reel are offered in 2.5k increments. *EP = Exposed paddle.Selector GuideRevision HistoryPages changed at Rev 2: 1, 4, 7, 9, 10, 20-24M A X 16000–M A X 16007Supervisors in TQFNPin ConfigurationsMAX16000–MAX16007Supervisors in TQFNPin Configurations (continued)M A X 16000–M A X 16007Supervisors in TQFN Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.24____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600©2006 Maxim Integrated Productsis a registered trademark of Maxim Integrated Products. Inc.Package Information(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to /packages .)。