Diode Laser Soldering Technology of Fine Pitch QFP Devices
SMT英文缩写词汇解析和部分SMT术语详解
SMT英文缩写词汇解析AI :Auto-Insertion 自动插件AQL :acceptable quality level 允收水准ATE :automatic test equipment 自动测试ATM :atmosphere 气压BGA :ball grid array 球形矩阵CCD :charge coupled device 监视连接组件(摄影机)CLCC :Ceramic leadless chip carrier 陶瓷引脚载具COB :chip-on-board 芯片直接贴附在电路板上cps :centipoises(黏度单位) 百分之一CSB :chip scale ball grid array 芯片尺寸BGACSP :chip scale package 芯片尺寸构装CTE :coefficient of thermal expansion 热膨胀系数DIP :dual in-line package 双内线包装(泛指手插组件)FPT :fine pitch technology 微间距技术FR-4 :flame-retardant substrate 玻璃纤维胶片(用来制作PCB材质) IC :integrate circuit 集成电路IR :infra-red 红外线Kpa :kilopascals(压力单位)LCC :leadless chip carrier 引脚式芯片承载器MCM :multi-chip module 多层芯片模块MELF :metal electrode face 二极管MQFP :metalized QFP 金属四方扁平封装NEPCON :National Electronic Package andProduction Conference 国际电子包装及生产会议PBGA:plastic ball grid array 塑料球形矩阵PCB:printed circuit board 印刷电路板PFC :polymer flip chipPLCC:plastic leadless chip carrier 塑料式有引脚芯片承载器Polyurethane 聚亚胺酯(刮刀材质)ppm:parts per million 指每百万PAD(点)有多少个不良PAD(点)psi :pounds/inch2 磅/英吋2PWB :printed wiring board 电路板QFP :quad flat package 四边平坦封装SIP :single in-line packageSIR :surface insulation resistance 绝缘阻抗SMC :Surface Mount Component 表面黏着组件SMD :Surface Mount Device 表面黏着组件SMEMA :Surface Mount EquipmentManufacturers Association 表面黏着设备制造协会SMT :surface mount technology 表面黏着技术SOIC :small outline integrated circuitSOJ :small out-line j-leaded packageSOP :small out-line package 小外型封装SOT :small outline transistor 晶体管SPC :statistical process control 统计过程控制SSOP :shrink small outline package 收缩型小外形封装TAB :tape automaticed bonding 带状自动结合TCE :thermal coefficient of expansion 膨胀(因热)系数Tg :glass transition temperature 玻璃转换温度THD :Through hole device 须穿过洞之组件(贯穿孔)TQFP :tape quad flat package 带状四方平坦封装UV :ultraviolet 紫外线uBGA :micro BGA 微小球型矩阵cBGA :ceramic BGA 陶瓷球型矩阵PTH :Plated Thru Hole 导通孔IA Information Appliance 信息家电产品MESH 网目OXIDE 氧化物FLUX 助焊剂LGA (Land Grid Arry)封装技术 LGA封装不需植球，适合轻薄短小产品应用。
半导体激光器相关的英语单词
半导体激光器相关的英语单词Semiconductor lasers are a pretty cool technology. They use materials like silicon and germanium to create focused beams of light. And you know what? They're tiny! You canfit a whole laser in your palm.When it's about efficiency, semiconductor lasers really shine. They convert electricity to light with hardly any waste. That's why they're used in so many applications, from medical devices to communications.Talking about communications, did you know that semiconductor lasers are the backbone of fiber-optic networks? They send signals over long distances with almost no loss. Imagine all that data flowing through tiny beams of light!And when it's about precision, these lasers are unmatched. They can cut materials with extreme accuracy, making them indispensable in manufacturing. Whether it's amicrochip or a piece of jewelry, semiconductor lasersensure perfect cuts.But did you know they're also fun? With the right setup, you can create amazing light displays with semiconductor lasers. They're often used in concerts and events to create stunning visual effects.So there you have it – a quick peek into the world of semiconductor lasers. From efficiency to precision to entertainment, they're truly remarkable pieces of technology.。
半导体激光器 折射率 电流
半导体激光器折射率电流英文回答：Semiconductor lasers, also known as diode lasers, are devices that generate coherent light through the process of stimulated emission. These lasers are widely used in various applications such as telecommunications, optical storage, and laser printing. One of the important factors that affect the performance of semiconductor lasers is the refractive index.The refractive index of a material determines how light propagates through it. In the case of semiconductor lasers, the refractive index of the active region, where the laser light is generated, plays a crucial role in determining the laser's characteristics. By adjusting the refractive index, one can control the wavelength and output power of the laser.The refractive index of a semiconductor material can bemodified by changing the composition of the material or by applying an external electric field. For example, by varying the concentration of dopants in the active region, one can change the refractive index and thus the wavelength of the emitted light. This is the principle behind tunable semiconductor lasers.Another important parameter that affects the performance of semiconductor lasers is the current. The current flowing through the laser diode determines the number of electrons and holes that are available for the process of stimulated emission. By increasing the current, one can increase the population inversion and thus the output power of the laser.However, increasing the current beyond a certain point can also lead to undesirable effects such as thermal runaway and catastrophic optical damage. Thermal runaway occurs when the heat generated by the laser exceeds its ability to dissipate heat, leading to a rapid increase in temperature and a decrease in performance. Catastrophic optical damage occurs when the laser is operated at highcurrents for an extended period, leading to irreversible damage to the laser diode.To optimize the performance of semiconductor lasers, it is important to carefully control the current and monitor the temperature. This can be achieved through the use of feedback control systems that adjust the current and temperature based on the laser's operating conditions. By maintaining the laser within its safe operating range, one can ensure reliable and efficient operation.中文回答：半导体激光器，也被称为二极管激光器，是通过受激辐射的过程产生相干光的装置。
半导体激光基本原理
半导体激光基本原理English:Semiconductor lasers, also known as diode lasers, operate by using the principle of stimulated emission to generate coherent light. They are typically constructed from a semiconductor diode structure, and when a current is applied to the diode, it generates a population inversion of electrons and holes in the active region. This results in the emission of photons as the electrons transition from the higher energy state to the lower energy state. The photons then bounce back and forth between the mirrors at either end of the diode, stimulating further emission and amplifying the light. This process ultimately leads to the production of a highly concentrated, directional, and monochromatic beam of light, which is the defining characteristic of a laser.中文翻译:半导体激光器，也称为二极管激光器，通过使用受激发射原理来产生相干光。
SMT术语英语
Smt属于转换英语THT（Through Hole Technology）：通孔安装技术SMT（Surface Mounted Technology）：表面安装技术PTH （Pin Through the Hole）：通孔安装THT (Through Hole Component) ：通孔插装元件SMB (Surface Mount Printed Circuit Board)：表面安装PCB板SMC (Surface Mount Component)：表面安装元件SMD (Surface Mount Device)：表面安装器件SMA (Surface Mount Assembly)：表面安装组件Component：元件Device：器件Assembly：组件CTE（coefficient of thermal expansion）：热膨胀系数In-circuit test：在线测试Lead configuration：引脚外形Placement equipment：贴装设备Reflow soldering：回流焊接Repair：修理Rework：返工Solderability：可焊性Soldermask：阻焊Yield：产出率Packaging density：装配密度Chip：片状元件melf：圆柱形元件PCB（Printed circuit board）：印刷电路板DIP：双列直插SIP：单列直插SOT（Small Outline Transistor）：小外形晶体管SOIC（Small outline IC）：小外形集成电路，SOP(Small outline Package)：小外型封装PLCC（Plastic Leaded Chip Carrier）：塑型有引脚芯片载体LCCC（Leadless Ceramic Chip Carrier）：无引脚陶瓷芯片载体QFP（Quad Flat Package）：多引脚方形扁平封装BGA（Ball grid array）球栅列阵CSP（Chip Scale Package）：芯片规模的封装Bare Chip：裸芯片Accuracy：精度ATE（Automated test equipment）：自动测试设备AOI（Automatic optical inspection）：自动光学检查Blind via：盲孔Buried via：埋孔through via：通孔Bridge：锡桥Circuit tester：电路测试机CTE（Coefficient of the thermal expansion）：温度膨胀系数Cold solder joint：冷焊锡点Component density：元件密度Copper foil：铜箔Copper mirror test：铜镜测试Cure：烘焙固化Cycle rate：循环速率Defect：缺陷Desoldering：卸焊Downtime：停机时间FPT（Fine-pitch technology）：密脚距技术Flip chip：倒装芯片FCT（Functional test）：功能测试Golden boy：金样ICT（In-circuit test）：在线测试JIT（Just-in-time）：刚好准时Lead configuration：引脚外形Packaging density：装配密度Pick-and-place：拾取-贴装设备Placement equipment：贴装设备Reflow soldering：回流焊接Repair：修理Rework：返工Defect SoldeR少锡Schematic：原理图Solder bump：焊锡球Solderability：可焊性Soldermask：阻焊Tape-and-reel：带和盘Tombstoning：元件立起Ultra-fine-pitch：超密脚距Yield：产出率solder mask：阻焊漆silk screen：丝印面via：导孔Copper Clad Laminates：覆铜箔层压板past mask：焊膏膜(漏板）solder mask：焊接掩摸(阻焊膜）Solding Pasts：焊锡膏Stencils：模板、漏板、钢板Bridging：搭锡Cursting：发生皮层Excessive Paste：膏量太多Insufficient Paste：膏量不足Poor Tack Retention：粘着力不足Slumping：坍塌Smearing：模糊Dpm（defects per million）：百万缺陷率Flexibility：柔性Modularity：模块化Component Pick-Up：元件拾取Component Check：元件检查Component Transport：元件传送Placement Procedure：元件放置Chamber System：炉膛系统Blowholes：吹孔Voids：空洞Movement：移位Misalignment：偏斜Dewetting：缩锡Dull Joint：焊点灰暗Non-Dewetting：不沾锡Accuracy：精度Additive Process：加成工艺Adhesion：附着力Aerosol：气溶剂Angle of attack：迎角Anisotropic adhesive：各异向性胶Annular ring：环状圈Application specific integrated circuit ：ASIC特殊应用集成电路Array：列阵Artwork：布线图Automated test equipment：ATE自动测试设备Bond lift-off：焊接升离Bonding agent：粘合剂CAD/CAM system：计算机辅助设计与制造系统Capillary action：毛细管作用Chip on board ：COB板面芯片Circuit tester：电路测试机Cladding：覆盖层Cold cleaning：冷清洗Cold solder joint：冷焊锡点Conductive epoxy：导电性环氧树脂Conductive ink：导电墨水Conformal coating：共形涂层Copper foil：铜箔Copper mirror test：铜镜测试Cure：烘焙固化nought materiel 无料Cycle rate：循环速率Data recorder：数据记录器Defect：缺陷Delamination：分层Desoldering：卸焊Dewetting：去湿DFM：为制造着想的设计Dispersant：分散剂Documentation：文件编制Downtime：停机时间Durometer：硬度计Environmental test：环境测试Eutectic solders：共晶焊锡Fiducial：基准点Fillet：焊角Fine-pitch technology ：FPT密脚距技术Fixture：夹具Full liquidus temperature：完全液化温度Golden boy：金样Halides：卤化物Hard water：硬水Hardener：硬化剂Line certification：生产线确认Machine vision：机器视觉Mean time between failure ：MTBF平均故障间隔时间Nonwetting：不熔湿的Organic activated ：OA有机活性的Packaging density：装配密度Photoploter：相片绘图仪Placement equipment：贴装设备Repeatability：可重复性Rheology：流变学Schematic：原理图Semi-aqueous cleaning：不完全水清洗Shadowing：阴影Silver chromate test：铬酸银测试Slump：坍落Solder bump：焊锡球Solderability：可焊性Soldermask：阻焊Solids：固体Solidus：固相线Statistical process control ：SPC统计过程控制Storage life：储存寿命Subtractive process：负过程Surfactant：表面活性剂Syringe：注射器Tape-and-reel：带和盘Thermocouple：热电偶Tombstoning：元件立起Vapor degreaser：汽相去油器paste working 1ife：焊膏工作寿命paste shelf life：焊膏贮存寿命slump：塌落no-clean solder paste：免清洗焊膏low temperature paste：低温焊膏screen printing：丝网印刷screen printing plate：网版squeegee：刮板screen printer：丝网印刷机stencil printing：漏版印刷metal stencil：金属漏版flexible stencil：柔性金属漏版feeders：供料器tape feeder：带式供料器stick feeder：杆式供料器tray feeder：盘式供料器bulk feeder：散装式供料器feeder holder：供料器架placement accuracy：贴装精度shifting deviation：平移偏差rotating deviation：旋转偏差resolution：分辨率repeatability：重复性placement speed：贴装速度low speed placement equipment：低速贴装机general placement equipment：中速贴装机high speed placement equipment：高速贴装机precise placement equipment：精密贴装机optic correction system ：光学校准系统sequential placement：顺序贴装placement pressure：贴装压力placement direction：贴装方位flying：飞片flux bubbles：焊剂气泡dual wave soldering：双波峰焊self alignment：自定位skewing：偏移tomb stone effect：墓碑现象Manhattan effect：曼哈顿现象hot air reflow soldering：热风再流焊convection reflow soldering：热对流再流焊laser reflow soldering：激光再流焊vapor phase soldering(VPS)：气相再流焊located soldering：局部软钎焊cleaning after soldering：焊后清洗AI :Auto-Insertion 自動插件AQL :acceptable quality level 允收水準ATE :automatic test equipment 自動測試ATM :atmosphere 氣壓BGA :ball grid array 球形矩陣CCD :charge coupled device 監視連接元件(攝影機)CLCC :Ceramic leadless chip carrier 陶瓷引腳載具COB :chip-on-board 晶片直接貼附在電路板上cps :centipoises(黏度單位) 百分之一CSB :chip scale ball grid array 晶片尺寸BGACSP :chip scale package 晶片尺寸構裝CTE :coefficient of thermal expansion 熱膨脹系數DIP :dual in-line package 雙內線包裝(泛指手插元件)FPT :fine pitch technology 微間距技術FR-4 :flame-retardant substrate 玻璃纖維膠片(用來製作PCB材質) IC :integrate circuit 積體電路IR :infra-red 紅外線Kpa :kilopascals(壓力單位)LCC :leadless chip carrier 引腳式晶片承載器MCM :multi-chip module 多層晶片模組MELF :metal electrode face 二極體MQFP :metalized QFP 金屬四方扁平封裝NEPCON :National Electronic Package andProduction Conference 國際電子包裝及生產會議PBGA:plastic ball grid array 塑膠球形矩陣PCB:printed circuit board 印刷電路板PFC :polymer flip chipPLCC:plastic leadless chip carrier 塑膠式有引腳晶片承載器Polyurethane 聚亞胺酯(刮刀材質)ppm:parts per million 指每百萬PAD(點)有多少個不良PAD(點)psi :pounds/inch2 磅/英吋2PWB :printed wiring board 電路板QFP :quad flat package 四邊平坦封裝SIP :single in-line packageSIR :surface insulation resistance 絕緣阻抗SMC :Surface Mount Component 表面黏著元件SMD :Surface Mount Device 表面黏著元件SMEMA :Surface Mount EquipmentManufacturers Association 表面黏著設備製造協會SMT :surface mount technology 表面黏著技術SOIC :small outline integrated circuitSOJ :small out-line j-leaded packageSOP :small out-line package 小外型封裝SOT :small outline transistor 電晶體SPC :statistical process control 統計過程控制SSOP :shrink small outline package 收縮型小外形封裝TAB :tape automaticed bonding 帶狀自動結合TCE :thermal coefficient of expansion 膨脹(因熱)係數Tg :glass transition temperature 玻璃轉換溫度THD :Through hole device 須穿過洞之元件(貫穿孔)TQFP :tape quad flat package 帶狀四方平坦封裝UV :ultraviolet 紫外線uBGA :micro BGA 微小球型矩陣cBGA :ceramic BGA 陶瓷球型矩陣PTH :Plated Thru Hole 導通孔IA Information Appliance 資訊家電產品MESH 網目OXIDE 氧化物FLUX 助焊劑LGA (Land Grid Arry)封裝技術LGA封裝不需植球，適合輕薄短小產品應用。
SMT专业术语
SMT专业术语我这里有一些关于SMT的专业术语，和大家分享。
AI :Auto-Insertion 自動插件AQL :acceptable quality level 允收水準ATE :autom atic test equipment 自動測試ATM :atm osphere 氣壓BGA :ball grid array 球形矩陣CCD :charge coupled device 監視連接元件(攝影機)CLCC :Ceramic leadless chip carrier 陶瓷引腳載具COB :chip-on-board 晶片直接貼附在電路板上cps :centipoises(黏度單位) 百分之一CSB :chip scale ball grid array 晶片尺寸BGACSP :chip scale package 晶片尺寸構裝CTE :coefficient of therm al expansion 熱膨脹系數DIP :dual in-line package 雙內線包裝(泛指手插元件)FPT :fine pitch technology 微間距技術FR-4 :flame-retardant substrate 玻璃纖維膠片(用來製作PCB材質) IC :integrate circuit 積體電路IR :infra-red 紅外線Kpa :kilopascals(壓力單位)LCC :leadless chip carrier 引腳式晶片承載器MCM :multi-chip m odule 多層晶片模組MELF :m etal electrode face 二極體MQFP :m etalized QFP 金屬四方扁平封裝NEPCON :National Electronic Package andProduction Conference 國際電子包裝及生產會議PBGA lastic ball grid array 塑膠球形矩陣PCB rinted circuit board 印刷電路板PFC olym er flip chipPLCC lastic leadless chip carrier 塑膠式有引腳晶片承載器Polyurethane 聚亞胺酯(刮刀材質)ppm arts per m illion 指每百萬PAD(點)有多少個不良PAD(點)psi ounds/inch2 磅/英吋2PWB rinted wiring board 電路板QFP :quad flat package 四邊平坦封裝SIP :single in-line packageSIR :surface insulation resistance 絕緣阻抗SMC :Surface Mount Com ponent 表面黏著元件SMD :Surface Mount Device 表面黏著元件SMEMA :Surface Mount EquipmentManufacturers Association 表面黏著設備製造協會SMT :surface m ount technology 表面黏著技術SOIC :sm all outline integrated circuitSOJ :sm all out-line j-leaded packageSOP :sm all out-line package 小外型封裝SOT :sm all outline transistor 電晶體SPC :statistical process control 統計過程控制SSOP :shrink sm all outline package 收縮型小外形封裝TAB :tape autom aticed bonding 帶狀自動結合TCE :therm al coefficient of expansion 膨脹(因熱)係數Tg :glass transition temperature 玻璃轉換溫度THD :Through hole device 須穿過洞之元件(貫穿孔)TQFP :tape quad flat package 帶狀四方平坦封裝UV :ultraviolet 紫外線uBGA :micro BGA 微小球型矩陣cBGA :ceramic BGA 陶瓷球型矩陣PTH :Plated Thru Hole 導通孔IA Information Appliance 資訊家電產品MESH 網目OXIDE 氧化物FLUX 助焊劑LGA (Land Grid Arry)封裝技術LGA封裝不需植球，適合輕薄短小產品應用。
铝合金焊接接头的力学性能测试
铝合金焊接接头的力学性能测试乔及森 , 周清林 , 朱 亮 , 陈剑虹(兰州理工大学 甘肃省有色金属新材料省部共建国家重点实验室 , 兰州 730050)摘 要 : 采用穿孔剪切法对材料局部力学性能进行了研究 ,提出了利用穿孔剪切试验 获得材料拉伸力学性能的基本方法 ,并采用穿孔剪切法对车用铝合金材料 Al6063 及其 焊接接头的力学性能进行了测试 ,得出了离焊缝中心线不同距离的抗拉强度 ,屈服强度 和加工硬化指数的关系 。
试验表明 ,穿孔剪切试验可以准确的表征力学性能不均匀焊 接接头的各微区性能参数和本构关系 ,可为铝合金汽车焊接构件的碰撞模拟提供接头 变形及失效数据 。
关键词 : 穿孔剪切法 ; 局部力学性能 ; 焊接接头 乔及森中图分类号 : TG 146文献标识码 : A文章编号 : 0253 - 360X (2006) 11 - 041 - 05所示 ,其中的平头探针是由 Φ115 mm 的钻头改装而0 序 言在汽车制造中 ,为了提高汽车车架的刚度 ,在减 轻汽车重量的同时提高汽车的碰撞性能 ,大量使用 铝合金材料 。
随着全铝车身汽车的使用 ,焊接结构 的性能测试成为一个重要的研究内容 。
铝合金的焊 接接头的力学性能是 由 焊 缝 、热 影 响 区 、母 材 决 定 的 ,而且焊缝和热影响区存在严重的不均匀性 ,所以 国内外都进行了一系列的研究 ,文献 1 对焊接接头 的力学性能提出了微剪韧性的概念 ,为微接头的局 部力学性能的测定提供了很好的依据 ;文献 2 也对 焊接接头的力学性能进行了研究 ,提出了焊缝区与 母材的拟合关系式 ;文献 3 采用试验和有限元回归 的方法 对 材 料 的 力 学 性 能 测 试 方 法 做 了 研 究 , 文 献 4 在前人的基础上对管线钢材料拉伸特征值进 行了研究 ,得出管线钢焊缝的屈服点和最大载荷处 的真应力与真应变的特征值 。
作者采用穿孔剪切的 方法对材料的焊接接头的力学性能进行了测试 ,为 汽车部件的碰撞模拟中焊缝的行为提供有效的材料 表征方法 。
SMT行业常用名词缩写中英文对照
SMT行业常用名词缩写中英文对照AI ：Auto—Insertion 自動插件AQL ：acceptable quality level 允收水準ATE :automatic test equipment 自動測試ATM :atmosphere 氣壓BGA :ball grid array 球形矩陣CCD :charge coupled device 監視連接元件(攝影機）CLCC :Ceramic leadless chip carrier 陶瓷引腳載具COB ：chip-on—board 晶片直接貼附在電路板上cps :centipoises(黏度單位) 百分之一CSB ：chip scale ball grid array 晶片尺寸BGACSP :chip scale package 晶片尺寸構裝CTE ：coefficient of thermal expansion 熱膨脹系數DIP ：dual in-line package 雙內線包裝（泛指手插元件）FPT ：fine pitch technology 微間距技術FR-4 :flame—retardant substrate 玻璃纖維膠片(用來製作PCB材質) IC ：integrate circuit 積體電路IR ：infra—red 紅外線Kpa ：kilopascals（壓力單位)LCC ：leadless chip carrier 引腳式晶片承載器MCM ：multi—chip module 多層晶片模組MELF ：metal electrode face 二極體MQFP ：metalized QFP 金屬四方扁平封裝NEPCON :National Electronic Package andProduction Conference 國際電子包裝及生產會議PBGA:plastic ball grid array 塑膠球形矩陣PCB：printed circuit board 印刷電路板PFC :polymer flip chipPLCC:plastic leadless chip carrier 塑膠式有引腳晶片承載器Polyurethane 聚亞胺酯（刮刀材質)ppm：parts per million 指每百萬PAD(點)有多少個不良PAD（點）psi :pounds/inch2 磅/英吋2PWB ：printed wiring board 電路板QFP ：quad flat package 四邊平坦封裝SIP ：single in—line packageSIR :surface insulation resistance 絕緣阻抗SMC :Surface Mount Component 表面黏著元件SMD ：Surface Mount Device 表面黏著元件SMEMA :Surface Mount EquipmentManufacturers Association 表面黏著設備製造協會SMT ：surface mount technology 表面黏著技術SOIC :small outline integrated circuitSOJ ：small out—line j—leaded packageSOP :small out—line package 小外型封裝SOT ：small outline transistor 電晶體SPC ：statistical process control 統計過程控制SSOP :shrink small outline package 收縮型小外形封裝TAB :tape automaticed bonding 帶狀自動結合TCE :thermal coefficient of expansion 膨脹（因熱)係數Tg :glass transition temperature 玻璃轉換溫度THD ：Through hole device 須穿過洞之元件(貫穿孔）TQFP :tape quad flat package 帶狀四方平坦封裝UV :ultraviolet 紫外線uBGA :micro BGA 微小球型矩陣cBGA ：ceramic BGA 陶瓷球型矩陣PTH ：Plated Thru Hole 導通孔IA Information Appliance 資訊家電產品MESH 網目OXIDE 氧化物FLUX 助焊劑LGA （Land Grid Arry）封裝技術LGA封裝不需植球，適合輕薄短小產品應用.TCP (Tape Carrier Package）ACF Anisotropic Conductive Film 異方性導電膠膜製程Solder mask 防焊漆Soldering Iron 烙鐵Solder balls 錫球Solder Splash 錫渣Solder Skips 漏焊Through hole 貫穿孔Touch up 補焊Briding 穚接(短路)Solder Wires 焊錫線Solder Bars 錫棒Green Strength 未固化強度(紅膠)Transter Pressure 轉印壓力（印刷)Screen Printing 刮刀式印刷Solder Powder 錫顆粒Wetteng ability 潤濕能力Viscosity 黏度Solderability 焊錫性Applicability 使用性Flip chip 覆晶Depaneling Machine 組裝電路板切割機Solder Recovery System 錫料回收再使用系統Wire Welder 主機板補線機X-Ray Multi-layer Inspection System X—Ray孔偏檢查機BGA Open/Short X—Ray Inspection Machine BGA X—Ray檢測機Prepreg Copper Foil Sheeter P.P。
SMT专用术语中英文对照表
SMT常用术语中英文对照简称英文全称中文解释SMT Surface Mounted Technology 表面贴装技术SMD Surface Mount Device表面安装设备(元件)DIP Dual In-line Package 双列直插封装QFP Quad Flat Package 四边引出扁平封装PQFP Plastic Quad Flat Package 塑料四边引出扁平封装SQFP Shorten Quad Flat Package 缩小型细引脚间距QFPBGA Ball Grid Array Package 球栅阵列封装PGA Pin Grid Array Package 针栅阵列封装CPGA Ceramic Pin Grid Array陶瓷针栅阵列矩阵PLCC Plastic Leaded Chip Carrier 塑料有引线芯片载体CLCC Ceramic Leaded Chip Carrier 塑料无引线芯片载体SOP Small Outline Package 小尺寸封装TSOP Thin Small Outline Package 薄小外形封装SOT Small Outline Transistor 小外形晶体管SOJ Small Outline J-lead Package J形引线小外形封装SOIC Small Outline Integrated Circuit Package小外形集成电路封装MCM Multil Chip Carrier 多芯片组件MELF 圆柱型无脚元件D Diode 二极管R Resistor 电阻SOC System On Chip 系统级芯片CSP Chip Size Package 芯片尺寸封装COB Chip On Board 板上芯片SMT基本名词解释AAccuracy(精度)：测量结果与目标值之间的差额。
Additive Process(加成工艺)：一种制造PCB导电布线的方法，通过选择性的在板层上沉淀导电材料(铜、锡等)。
半导体激光在伤口照射上的应用
半导体激光在伤口照射上的应用英文版The Application of Semiconductor Lasers in Wound IrradiationSemiconductor lasers, a type of laser technology, have found numerous applications in various fields, including wound irradiation. The unique properties of semiconductor lasers make them highly suitable for wound treatment, promoting faster healing and reducing the risk of infection.How Semiconductor Lasers WorkSemiconductor lasers emit coherent light in a specific wavelength range. This light interacts with the tissue, stimulating cellular activity and promoting healing. The laser energy is absorbed by the cells, increasing metabolism and blood flow, which in turn enhances the healing process.Advantages of Using Semiconductor Lasers in Wound IrradiationFaster Healing: Laser irradiation stimulates fibroblasts, the cells responsible for collagen production, resulting in faster wound closure.Reduced Risk of Infection: The laser's antibacterial effect helps kill harmful microorganisms, thus reducing the risk of infection.Minimal Side Effects: Semiconductor lasers are non-invasive and have minimal side effects, making them safe for patients.Pain Relief: Laser treatment can also provide temporary pain relief, allowing patients to undergo wound treatment with less discomfort.ConclusionSemiconductor lasers have emerged as a promising tool in wound irradiation, offering faster healing, reduced risk of infection, and minimal side effects. As technology continues to evolve, the role of semiconductor lasers in wound care is expected to expand further.中文版半导体激光在伤口照射上的应用半导体激光作为激光技术的一种，已经在多个领域找到了应用，其中包括伤口照射。
SMT术语英语
S M T术语英语(总11页) -CAL-FENGHAI.-(YICAI)-Company One1-CAL-本页仅作为文档封面，使用请直接删除Smt属于转换英语THT（ThroughHoleTechnology）：通孔安装技术SMT（Surface Mounted Technology）：表面安装技术PTH （PinThroughthe Hole）：通孔安装THT(ThroughHoleComponent) ：通孔插装元件SMB(SurfaceMountPrintedCircuitBoard)：表面安装PCB板SMC(SurfaceMountComponent)：表面安装元件SMD(SurfaceMountDevice)：表面安装器件SMA(SurfaceMountAssembly)：表面安装组件Component：元件Device：器件Assembly：组件CTE（coefficient of thermal expansion）：热膨胀系数In-circuit test：在线测试Lead configuration：引脚外形Placement equipment：贴装设备Reflow soldering：回流焊接Repair：修理Rework：返工Solderability：可焊性Soldermask：阻焊Yield：产出率Packaging density：装配密度Chip：片状元件melf：圆柱形元件PCB（Printed circuit board）：印刷电路板DIP：双列直插SIP：单列直插SOT（SmallOutlineTransistor）：小外形晶体管SOIC（SmalloutlineIC）：小外形集成电路，SOP(SmalloutlinePackage)：小外型封装PLCC（PlasticLeadedChipCarrier）：塑型有引脚芯片载体LCCC（LeadlessCeramicChipCarrier）：无引脚陶瓷芯片载体QFP（QuadFlatPackage）：多引脚方形扁平封装BGA（ Ball grid array）球栅列阵CSP（ChipScalePackage）：芯片规模的封装Bare?Chip：裸芯片Accuracy：精度ATE（Automated test equipment）：自动测试设备AOI（Automatic optical inspection）：自动光学检查Blind via：盲孔Buried via：埋孔through via：通孔Bridge：锡桥Circuit tester：电路测试机CTE（Coefficient of the thermal expansion）：温度膨胀系数Cold solder joint：冷焊锡点Component density：元件密度Copper foil：铜箔Copper mirror test：铜镜测试Cure：烘焙固化Cycle rate：循环速率Defect：缺陷Desoldering：卸焊Downtime：停机时间FPT（Fine-pitch technology）：密脚距技术Flip chip：倒装芯片FCT（Functional test）：功能测试Golden boy：金样ICT（In-circuit test）：在线测试JIT（Just-in-time）：刚好准时Lead configuration：引脚外形Packaging density：装配密度Pick-and-place：拾取-贴装设备Placement equipment：贴装设备Reflow soldering：回流焊接Repair：修理Rework：返工Defect SoldeR少锡Schematic：原理图Solder bump：焊锡球Solderability：可焊性Soldermask：阻焊Tape-and-reel：带和盘Tombstoning：元件立起Ultra-fine-pitch：超密脚距Yield：产出率solder mask：阻焊漆silk screen：丝印面via：导孔Copper Clad Laminates：覆铜箔层压板past mask：焊膏膜(漏板）solder mask：焊接掩摸(阻焊膜）Solding?Pasts：焊锡膏Stencils：模板、漏板、钢板Bridging：搭锡?Cursting：发生皮层?ExcessivePaste：膏量太多Insufficient Paste：膏量不足?Poor Tack Retention：粘着力不足? Slumping：坍塌?Smearing：模糊?Dpm（defects per million）：百万缺陷率Flexibility：柔性Modularity：模块化Component Pick-Up：元件拾取Component Check：元件检查Component Transport：元件传送Placement Procedure：元件放置Chamber System：炉膛系统Blowholes：吹孔?Voids：空洞?Movement：移位?Misalignment：偏斜Dewetting：缩锡?Dull Joint：焊点灰暗?Non-Dewetting：不沾锡?Accuracy：精度Additive Process：加成工艺Adhesion：附着力Aerosol：气溶剂Angle of attack：迎角Anisotropic adhesive：各异向性胶Annular ring：环状圈Application specific integrated circuit ：ASIC特殊应用集成电路Array：列阵Artwork：布线图Automated test equipment：ATE自动测试设备Bond lift-off：焊接升离Bonding agent：粘合剂CAD/CAM system：计算机辅助设计与制造系统Capillary action：毛细管作用Chip on board ：COB板面芯片Circuit tester：电路测试机Cladding：覆盖层Cold cleaning：冷清洗Cold solder joint：冷焊锡点Conductive epoxy：导电性环氧树脂Conductive ink：导电墨水Conformal coating：共形涂层Copper foil：铜箔Copper mirror test：铜镜测试Cure：烘焙固化nought materiel 无料Cycle rate：循环速率Data recorder：数据记录器Defect：缺陷Delamination：分层Desoldering：卸焊Dewetting：去湿DFM：为制造着想的设计Dispersant：分散剂Documentation：文件编制Downtime：停机时间Durometer：硬度计Environmental test：环境测试Eutectic solders：共晶焊锡Fiducial：基准点Fillet：焊角Fine-pitch technology ：FPT密脚距技术Fixture：夹具Full liquidus temperature：完全液化温度Golden boy：金样Halides：卤化物Hard water：硬水Hardener：硬化剂Line certification：生产线确认Machine vision：机器视觉Mean time between failure ：MTBF平均故障间隔时间Nonwetting：不熔湿的Organic activated ：OA有机活性的Packaging density：装配密度Photoploter：相片绘图仪Placement equipment：贴装设备Repeatability：可重复性Rheology：流变学Schematic：原理图Semi-aqueous cleaning：不完全水清洗Shadowing：阴影Silver chromate test：铬酸银测试Slump：坍落Solder bump：焊锡球Solderability：可焊性Soldermask：阻焊Solids：固体Solidus：固相线Statistical process control ：SPC统计过程控制Storage life：储存寿命Subtractive process：负过程Surfactant：表面活性剂Syringe：注射器Tape-and-reel：带和盘Thermocouple：热电偶Tombstoning：元件立起Vapor degreaser：汽相去油器paste working 1ife：焊膏工作寿命paste shelf life：焊膏贮存寿命slump：塌落no-clean solder paste：免清洗焊膏low temperature paste：低温焊膏screen printing：丝网印刷screen printing plate：网版squeegee：刮板screen printer：丝网印刷机stencil printing：漏版印刷metal stencil：金属漏版flexible stencil：柔性金属漏版feeders：供料器tape feeder：带式供料器stick feeder：杆式供料器tray feeder：盘式供料器bulk feeder：散装式供料器feeder holder：供料器架placement accuracy：贴装精度shifting deviation：平移偏差rotating deviation：旋转偏差resolution：分辨率repeatability：重复性placement speed：贴装速度low speed placement equipment：低速贴装机general placement equipment：中速贴装机high speed placement equipment：高速贴装机precise placement equipment：精密贴装机optic correction system ：光学校准系统sequential placement：顺序贴装placement pressure：贴装压力placement direction：贴装方位flying：飞片flux bubbles：焊剂气泡dual wave soldering：双波峰焊self alignment：自定位skewing：偏移tomb stone effect：墓碑现象Manhattan effect：曼哈顿现象hot air reflow soldering：热风再流焊convection reflow soldering：热对流再流焊laser reflow soldering：激光再流焊vapor phase soldering(VPS)：气相再流焊located soldering：局部软钎焊cleaning after soldering：焊后清洗AI :Auto-Insertion 自动插件?AQL :acceptable quality level 允收水准ATE :automatic test equipment 自动测试ATM :atmosphere 气压BGA :ball grid array 球形矩阵CCD :charge coupled device 监视连接元件(摄影机) CLCC :Ceramic leadless chip carrier 陶瓷引脚载具COB :chip-on-board 晶片直接贴附在电路板上cps :centipoises(黏度单位) 百分之一CSB :chip scale ball grid array 晶片尺寸BGACSP :chip scale package 晶片尺寸构装CTE :coefficient of thermal expansion 热膨胀系数DIP :dual in-line package 双内线包装(泛指手插元件)FPT :fine pitch technology 微间距技术FR-4 :flame-retardant substrate 玻璃纤维胶片(用来制作PCB材质) IC :integrate circuit 积体电路IR :infra-red 红外线Kpa :kilopascals(压力单位)LCC :leadless chip carrier 引脚式晶片承载器MCM :multi-chip module 多层晶片模组MELF :metal electrode face 二极体MQFP :metalized QFP 金属四方扁平封装NEPCON :National Electronic Package andProduction Conference 国际电子包装及生产会议PBGA:plastic ball grid array 塑胶球形矩阵PCB:printed circuit board 印刷电路板PFC :polymer flip chipPLCC:plastic leadless chip carrier 塑胶式有引脚晶片承载器Polyurethane 聚亚胺酯(刮刀材质)ppm:parts per million 指每百万PAD(点)有多少个不良PAD(点)psi :pounds/inch2 磅/英寸2PWB :printed wiring board 电路板QFP :quad flat package 四边平坦封装SIP :single in-line packageSIR :surface insulation resistance 绝缘阻抗SMC :Surface Mount Component 表面黏着元件SMD :Surface Mount Device 表面黏着元件SMEMA :Surface Mount EquipmentManufacturers Association 表面黏着设备制造协会SMT :surface mount technology 表面黏着技术SOIC :small outline integrated circuitSOJ :small out-line j-leaded packageSOP :small out-line package 小外型封装SOT :small outline transistor 电晶体SPC :statistical process control 统计过程控制SSOP :shrink small outline package 收缩型小外形封装TAB :tape automaticed bonding 带状自动结合TCE :thermal coefficient of expansion 膨胀(因热)系数Tg :glass transition temperature 玻璃转换温度THD :Through hole device 须穿过洞之元件(贯穿孔)TQFP :tape quad flat package 带状四方平坦封装UV :ultraviolet 紫外线uBGA :micro BGA 微小球型矩阵cBGA :ceramic BGA 陶瓷球型矩阵PTH :Plated Thru Hole 导通孔IA Information Appliance 资讯家电产品MESH 网目OXIDE 氧化物FLUX 助焊剂LGA (Land Grid Arry)封装技术 LGA封装不需植球，适合轻薄短小产品应用。
半导体一些术语的中英文对照
半导体一些术语的中英文对照半导体一些术语的中英文对照离子注入机ion implanterLSS理论Lindhand Scharff and Schiott theory 又称“林汉德-斯卡夫-斯高特理论”。
沟道效应channeling effect射程分布range distribution深度分布depth distribution投影射程projected range阻止距离stopping distance阻止本领stopping power标准阻止截面standard stopping cross section退火annealing激活能activation energy等温退火isothermal annealing激光退火laser annealing应力感生缺陷stress-induced defect择优取向preferred orientation制版工艺mask-making technology图形畸变pattern distortion初缩first minification精缩final minification母版master mask铬版chromium plate干版dry plate乳胶版emulsion plate透明版see-through plate高分辨率版high resolution plate, HRP超微粒干版plate for ultra-microminiaturization 掩模mask掩模对准mask alignment对准精度alignment precision光刻胶photoresist又称“光致抗蚀剂”。
负性光刻胶negative photoresist正性光刻胶positive photoresist无机光刻胶inorganic resist多层光刻胶multilevel resist电子束光刻胶electron beam resistX射线光刻胶X-ray resist刷洗scrubbing甩胶spinning涂胶photoresist coating后烘postbaking光刻photolithographyX射线光刻X-ray lithography电子束光刻electron beam lithography离子束光刻ion beam lithography深紫外光刻deep-UV lithography光刻机mask aligner投影光刻机projection mask aligner曝光exposure接触式曝光法contact exposure method接近式曝光法proximity exposure method光学投影曝光法optical projection exposure method 电子束曝光系统electron beam exposure system分步重复系统step-and-repeat system显影development线宽linewidth去胶stripping of photoresist氧化去胶removing of photoresist by oxidation等离子［体］去胶removing of photoresist by plasma 刻蚀etching干法刻蚀dry etching反应离子刻蚀reactive ion etching, RIE各向同性刻蚀isotropic etching各向异性刻蚀anisotropic etching反应溅射刻蚀reactive sputter etching离子铣ion beam milling又称“离子磨削”。
SMT常见名词中英文解释(最全)
SMT常见名词中英文解释(最全)SMT:Surface Mounting Technology.表面贴装技术.Accuracy:精度.Adhesive:胶水.用于粘接元件.Array:列阵.常用于机器中作为元件的摆放位置。
AOI:Automatic Optical inspection.自动光学检测.一种可以检查元件外观的设备。
BGA:Ball grid array.球型栅状列阵。
一种集成电路的包装形式。
Bridge:桥接。
在生产中出的一种不良现象。
俗称短路。
COB:Chip On Board:一种混合技术，它使用了面朝上胶着的芯片元件，传统上通过飞线专门的连接于电路板的底层。
Component density:元件密度。
PCB板上的元件数量除以板的面积。
Data recorder:数据记录器。
以特定的时间间隔，从着附于PCB板上热电偶上测量和采集温度的设备。
Defect:缺陷。
元件或电路单元偏离了正常接受的特征。
DFM:Design for manufactory.为制造着想的设计。
以最有效的方式生产产品的方法，将时间，成本和可用资源考虑在内。
Downtime:停机时间。
设备由于维护或失效而不能进行生产产品的时间。
Flip chip:倒装芯片。
一种无引脚结构，一般含有电路单元。
设计用于通过适当数量的位于其面上的锡球，在电气上和在机械上连接于电路。
Reflow soldering:回流焊接。
通过各个阶段，包括：预热，保温，回流和冷却把表面贴装的元件放入锡膏中以达到永久焊接的工艺过程。
Rework:返工。
把不正确装配带回到符合规格或合约要求的一个重复过程。
Slump:塌陷。
在摸板印刷后进行固化前，锡膏或胶水等材料的扩散。
Pitch:间距。
指元件引脚之间的距离。
Fine pitch:细间距。
主要指元件引脚之间的距离小于0.5MM的元件。
SOP:一种两边有引脚的IC封装形式。
SOJ:一种两边有引脚的IC封装形式，但是其引脚是向内弯曲的。
可调谐二极管激光吸收光谱技术英文
可调谐二极管激光吸收光谱技术英文When it comes to the field of spectroscopy, tunable diode laser absorption spectroscopy (TDLAS) is a cutting-edge technique that's got researchers excited. It's kind of like having a super-sensitive ear for chemicals in the airor gases in a pipe.TDLAS uses lasers that can be tuned to specific wavelengths, which is cool because different gases absorb light at different wavelengths. So, by tuning the laser,you can target a specific gas and measure its concentration. It's like using a laser pointer to find a needle in a haystack, but in this case, the "needle" is a gas molecule.One of the coolest things about TDLAS is that it'sreal-time. You can monitor gas concentrations continuously, which is great for safety applications or process control. And because it's so sensitive, it can detect even tiny amounts of gases.The setup for TDLAS isn't too complicated. You have your tunable laser, some optics to direct the laser beam, and a detector to measure the light that's absorbed. But don't let the simplicity fool you, it's a powerful tool.TDLAS has applications in a wide range of fields, from environmental monitoring to industrial process control.It's a great way to keep an eye on emissions from factories or monitor.。
LD激光二极管重要参数与特征
1550nm左右，与FP的结构不同处，是DFB沿着共振腔体外部加上一层
光栅(Grating)，使雷射光仅允许单一波长光源存在于腔体中，我们称为
单一纵向模态(SLM Single Longitudinal Mode)，此一特性，使得产生的
功率(3~50mW)及线宽(0.8~0.08pm)方面较FP雷射更为优越，但价格也
>0.1
光学参数
阈值电流(mA） 斜率效率（mw/mA）
光谱宽度（nm）
d(wavelength)/dT(nm/K) 光束特性（FWHM，degree）
NA 0.001
50 0.3 180
像散（μm）
0
IPL/ELL/CD激 光器
30
3
<2
25 0.3 0.3 0.3 40perpendicular 15parallel
内容目录
¾ 激光的基本原理 ¾ 常见激光器介绍 ¾ 激光器结构介绍
二、激光产生原理
原子和分子内部都有能量，其大小为一些离散的值， 也称为能级，图1所示为一种典型的原子能级图，电子总会 以某种特定的能级状态出现，当电子完成从一个能级到另 一个能级的跃迁时，就有可能产生光的吸收或者发射。光 的吸收和发射都是以一种叫光子的形式完成。光子是一种 具有特定波长并沿特定方向传播的电磁波。对于电子在图1 所示的能级E1和E2之间的跃迁，如果是从E1到E2，就吸收 一个光子，相反则发射一个光子。
Laser Diode的构成(一)
1. 基座(Header) 2. 热沉(Submount) 3. 激光二极管(LD) 4. 背光探测器(PD) 5. 封盖(Cap) 6. 窗口(Window)
消光比与啁啾
光发送机的消光比一般要求大于8.2dB，即“0”码光脉冲功率是“1” 码光脉冲功率的七分之一。
激光专业知识英语作文
激光专业知识英语作文英文：Laser technology is a fascinating field that has revolutionized many industries. As a laser professional, I have gained a lot of knowledge about the principles and applications of lasers.Firstly, lasers work by emitting a coherent beam of light that is highly concentrated and focused. This makes them ideal for precision cutting, welding, and drilling in industries such as manufacturing and construction. They are also used in medical procedures such as eye surgery and tattoo removal.Secondly, there are different types of lasers, each with its unique properties. For example, gas lasers such as carbon dioxide (CO2) lasers are commonly used in industrial applications, while solid-state lasers such as neodymium-doped yttrium aluminum garnet (Nd:YAG) lasers are used inmedical procedures. Fiber lasers are also gainingpopularity due to their high efficiency and low maintenance costs.Lastly, laser safety is a crucial aspect of laser technology. It is essential to follow safety protocols and wear protective gear such as goggles and gloves whenworking with lasers. Failure to do so can result in serious injuries such as burns and eye damage.In conclusion, laser technology is a fascinating field with many applications and safety considerations. As alaser professional, I am constantly learning about new developments and advancements in the field.中文：激光技术是一个迷人的领域，已经彻底改变了许多行业。
英语D2
diagnose instruction 诊断指令diagnose interface 诊断接口diagnosis 诊断diagnostic analysis 诊断分析diagnostic check 诊断校验diagnostic disk 诊断软盘diagnostic features 诊断功能diagnostic function test 诊断功能测试diagnostic message 错误报文diagnostic program 诊断程序diagnostic routine 诊断程序diagnostic system 诊断系统diagnostic test 诊断试验diagnostics 诊断diagnostor 诊断程序diagnotor 诊断记录程序diagonal microprogramming 对角线型微程序设计diagram 图dial exchange 自动电话交换机dial indicator 拔号指示器dial line 拔号线dial pulse 拨号脉冲dial pulsing 拔号脉冲dial signal 拨号音dial telephone system 自动电话系统dial tone 拨号音dial up 拔号dial up network 拔号网路dialed network 交换网络dialing 拔号dialog 对话dialog box 对话窗口dialoging 对话dialup network 交换网络dib 数据输入总线dibit 二组位dichotomizing search 对分检索二分法搜索dichotomy 对分dictionary 字典dictionary technique 字典技术dielectric constant 介电常数dielectric waveguide 介质波导管difference 差分difference engine 差分机difference equation 差分方程difference gate 异门difference machine 微分机differential amplifier 差动放大器differential analyzer 微分分析器differential bridge 差动电桥differential circuit 微分电路differential coefficient 微分系数differential element 微分元件differential file 勘误文件differential measuring instrument 差动式测量仪表differential pulse code modulation 微分脉冲码灯differential unit 微分组件differentiating amplifier 差动放大器differentiator 微分器diffused junction 扩散结diffusion 扩散diffusion coefficient 扩散系数diffusion length 扩散距离diffusion technique 扩散技术digit 数字digit compression 数位压缩digit delay 数字延迟digit line 位线digit period 数位时间digit place 数位digit position 数位digit pulse 数字脉冲digit punch 数字穿孔digit selection 数位选择digit selector 数位选择器digit time 数位时间digital 数字的digital analog converter 数字模拟转换器数模转换器digital automaton 数字自动机digital cash 数字货币digital cassette 数字盒式磁带机digital chip 数字式芯片digital clock 数字钟digital code 数字码digital coding 数字编码digital computer 数字计算机digital control 数字控制digital converter 数字转换器digital data 数字数据digital data processing 数字数据处理digital data processing computer 数字计算机digital data processing system 数字数据处理系统digital device 数字装置digital differential analyzer 数字微分分析机digital display 数字显示digital electronics 数字电子学digital filter 数字滤波器digital filtering 数字滤波digital form 数字形式digital input 数字输入digital library 数字图书馆digital microcircuit 数字式芯片digital modulation 数字灯digital output 数字输出digital point plotter 数字点式绘图机digital printer 数字打印机digital readout 数字读出digital representation 数字表示digital servomechanism 数字伺服机构digital signal 数字信号digital signal processing 数字信号处理digital signature 数字签字digital sort 数字分类digital sorting method 数字分类法digital subtracter 数字减法器digital subtractor 数字减法器digital technology 数字技术digital television 数字电视digital time 数字钟digital time unit 数字时钟digital to analog conversion 数模转换digital transmission 数字传输digitalized data 数字化数据digitization 数字化digitizer 数字化器digraph 有向图dimension 维数dimension statement 维数语句diminished radix complement 基数减1补码diode 二极管diode capacitor storage 二极管电容存储器diode circuit 二极管电路diode counter 二极管计数器diode decoder 二极管译码器diode laser 二极管激光器diode logic 二极管逻辑diode matrix 二极管译码器diode switch 二极管开光关diode transistor logic 二极管晶体管逻辑dip 双列直插式组件dip soldering 浸焊dipole 偶极子direct access 立即访问direct access file 直接存取文件direct access hashing 直接存取散列法direct access library 直接存取库direct access memory 直接存取存储器direct access method 直接存取方法direct access storage 直接存取存储器direct access unit 直接存取存储器direct access volume 直接存取卷direct acting recording instrument 直接酌记录器direct action 直接酌direct address 直接地址direct addressing 直接定址direct beam display 随机扫描显示器direct channel 直接通道direct code 绝对代码direct coding 直接编码direct command 直接命令direct control 直接控制direct control feature 直接控制性能direct coupled amplifier 直接耦合放大器direct coupled flip flop 直接耦合触収器direct coupled transistor logic 直接耦合晶体管逻辑direct coupling 直接耦合direct current 直流direct current telegraphy 直羚报direct data capture 直接数据俘获direct data processing 联机数据处理direct data set 直接数据集direct digital control 直接数字控制direct distance dialing 直接长途拨号direct execution 直接执行direct execution computer 高级语言计算机direct feedback 直接反馈direct file 直接文件direct input 直接输入direct insert routine 直接插入程序direct insert subroutine 直接插入子程序direct instruction 立即指令direct keyboard execution 直接键盘执行direct list database 直接列表数据库direct measurement 直接测量direct memory access 直接存储存取direct memory access channel 存储票接存取通道direct mode 立即方式direct modeimmediate mode 直接方式direct organization 直接编制direct output 直接输出direct processing 直接处理direct reading 直接读出direct reading instrument 直接读出仪器direct relation 直接关系direct transmission 直接传输direct transmitter 直接収送器directe code 机弃码directed beam display 定向射线显示器directed edge 定向边directed graph 有向图direction 方向direction finding problem 测向问题directional antenna 指向天线directive 指示directive statement 指示语句directory 目录directory device 目录装置directory file 目录文件directory lookup 目录查询directory routing 目录式路由选择disable 禁止disable pulse 禁止脉冲disabled interrupt 禁止中断disabled state 禁止状态disarray 混乱disassembler 反汇编程序disassembling 反汇编disassembly instruction 分解指令disaster dump 大错转储discharge 放电disconnect graph 非连通图disconnection 断开discontinuous control 断续控制discontinuous function 不连续函数discrete component 分立元件discrete component circuit 分立元件电路discrete data 离散数据discrete programming 离散规划discrete range 离散范围discrete simulation 离散模拟discretization 离散化discriminant 判别式discrimination instruction 判别指令discriminator 鉴别器disjunction 或disjunctive normal form 析取范式disjunctive search 按或检索disk 盘disk address 盘地址disk antenna 盘形天线disk cache 高速盘缓冲存储器disk capacity 盘存储容量disk cartridge 磁盘盒disk controller 盘控制器disk drive 磁盘驱动器disk dump 磁盘转储disk face 磁盘面disk file 磁盘文件disk format 磁盘格式disk formatter 磁盘格式程序disk interleaving 磁盘交叉disk laser 盘形激光器disk memory 磁盘存储器disk operating system 盘操椎统disk pack 磁盘组disk sorting 磁盘分类disk storage 磁盘存储器disk system 磁盘系统disk track 磁盘道disk unit 磁盘机disk work file 磁盘工啄件diskette 软盘diskette drive 软盘机diskette storage 软盘存储dislocation 位错dismount 拆卸dispatch 翰送dispatch control 等控制dispatcher 等程序dispatching 等dispatching priority 等优先权disperse array 分散数组dispersion 分散dispersion gate 与非门displacement 位移displacement address 位移地址displacement constant 位移常数display 显示器display attribute 显示属性display capacity 显示容量display character generator 显示字符収生器display command 显示命令display console 显示控制台display control 显示控制display controller 显示控制器display copier 显示拷贝机display device 显示器display element 显示单元display file 显示文件display group 显示组display image 显示图象display line 显示行display list 显示表display panel 显示板display position 显示位置display processor 显示处理机display refreshing 显示更新display register 显示寄存器display screen 显示屏display segment 显示段display statement 显示语句display suppression 显示取消display surface 显示面display system 显示系统display terminal 显示终端display window 显示窗口displayed line 显示线disposition 配置dissemination 传播dissipation 损耗distance gate 异门distance measuring equipment 测距设备distant control 遥控distortion 失真distributed access 分布式存取distributed architecture 分布结构distributed array processor 分布式阵列处理机distributed calculating 分布式计算distributed capacitance 分布电容distributed data processing 分布式数据处理distributed database 分布式数据库distributed database system 分布数据库系统distributed file system 分布式文件系统distributed function system 分布式功能系统distributed intelligence 分布式智能distributed logic 分布逻辑distributed network 分散式网络distributed processing 分布式处理distributed processing system 分布式处理系统distributed query 分布式查询distributed system 分布式系统distribution 分布distribution cabinet 接线箱distribution function 分布函数distribution list 分布表distribution network 分散式网络distributive medium 分布媒体distributive tape 分配带distributor 分配器disturbance 干扰disturbance control 干扰控制disturbed one 干扰1disturbed one output signal 干扰1输出信号disturbed zero 干扰0disturbed zero output signal 干扰0输出信号disturbing pulse 干扰脉冲ditch 通道dither 高频脉动diversity gate 异门divide overflow 除法溢出dividend 被除数divider 除法器division 除division header 部分标题division name 部分名称division subroutine 除法子程序divisor 除数dlc 数据链路控制dma 直接存储存取dma channel 存储票接存取通道dma controller 存储票接存取控制器dma interface 存储票接存取接口dnf 析取范式do loop 循环语句do nothing instruction 空指令do nothing operation 空操作do statement 循环语句do variable 循环变量do while loop d0 while循环document 文档document compiler 文件编辑机document generator 文件生成程序document handling 资科处理document information content 文献信息资源document merge 归并document reader 文档阅读机document reference edge 文件基准边缘document section 文件小节documentation 文件编制documentation center 文件编制中心documentation components 文件编制成分documenting 文件制作documentor 文件编制程序domain 定义域domain expert 领域专家domain knowledge 领域知识domestic consumer 家庭用户donor 施主施钟质donor atom 施汁子donor type 施滞dope 添加剂dope vector 内情向量doped zener transistor logic 齐纳二极管晶体管逻辑dormant task 静止任务dos 盘操椎统dot 点dot addressable graphics 点式寻址图形dot chart 点阵图dot cycle 打点周期dot mark 点标志dot matrix 点阵dot matrix character generator 点阵字符収生器dot matrix digit 点阵数字dot matrix display 点阵显示dot matrix printer 点阵打印机dot pattern 点模式dot printer 点式打印机dot printing 点打印dotted pair 点对double address instruction 双地址指令double calculation 复算double current cable code 双廉线电码double density 双倍密度double density disk 双倍密度磁盘double density recording 双倍密度记录double error correction 双错校正double face floppy disk 双面软盘double input gate 双输入门double length number 双倍长数double length operation 倍长运算double length word 倍长字double level grammar 双层文法double linked list 双链表double modulation 双重灯double precision 倍精度double precision arithmetic 倍精度运算double precision computation 双精度计算double precision number 双精度数double punch 双穿孔double rail logic 双线逻辑double register addressing 双寄存瓢址double side floppy disk 双面软盘double sided disk 双面磁盘double word 双字double word boundary 双字界double word instruction 双字长指令double word register 双字长寄存器down counter 减法计数器down operation 停机操作停止操作downline loading 向下装入downtime 故障时间downtime log 故障时间日志downtime ratio 故障时间比率downward compatibility 反向兼容性downward reference 向下引用dpcm 微分脉冲码灯drafting machine 绘图机dragging 拖动drift 漂移drift error 漂移误差drift transistor 漂移晶体管drive 驱动drive pulse 驱动脉冲drive wire 驱动线driver 驱动器driving arm 驱动支架driving element 驱动元素drop in 冒码drop out 漏失dropping 漏失drum 鼓drum controller 磁鼓控制器drum mark 磁鼓标志drum memory 磁鼓存储器drum plotter 滚筒绘图机drum printer 鼓式打印机drum storage 磁鼓存储器dry run 预检ds 数据集dscb 数据集控制块dsl 数据集标号dsp 数字信号处理dss 动态支持系统dte 数据终端设备dtl 二极管晶体管逻辑dtp 桌面出版dual boolean operation 对偶布尔运算dual coding 双编码dual component 双重部件dual computer system 双计算机系统dual in line package 双列直插式组件dual operation 对偶运算dual ported memory 双端口存储器dual processor configuration 双处理机配置dual processor mode 双处理机方式dual punch card 双穿孔卡片dual recording 双重记录dual system 双系统duality 二元性duct 波道dumb antenna 失奠线dumb terminal 哑终端dummy 伪的dummy activity 虚活动dummy address 伪地址dummy argument 空变元dummy control section 哑控制段dummy instruction 空指令dummy module 哑模块dummy record 伪记录dummy section 哑节dummy statement 空语句dummy variable 哑变量dump 转储dump check 转储检验dump routine 转储程序duodecimal digit 十二进制数字duodecimal notation 十二进制duplex 全双工duplex channel 双向通道duplex circuit 双工电路duplex communication 双工通信duplex line 双工线路duplex operation 双工工作双工运行duplex printing 双向印刷duplex transmission 双工传输duplexed system 双套系统duplexing 双工工作双工运行duplicate circuitry 重工电路duplicate record 备份记录。
LASER DIODE
专利名称：LASER DIODE发明人：TAKAMYA SABURO,NAMISAKI HIROBUMI,SUZAKI WATARU 申请号：JP12763679申请日：19791002公开号：JPS6022838B2公开日：19850604专利内容由知识产权出版社提供摘要：PURPOSE:To readily form a distributed feedback type laser by forming a stress field formed periodically along the laser light popagating direction. CONSTITUTION:Grooves 7 are formed at constant interval at the side of soldering portion 5 of a contact layer 3 in a distributed feedback type laser having an active layer 1, a clad layer 2, a contact layer 3, and a head sink 4 and the like, thermal expansion coefficient difference between the layer 3 and the heat sink 4 and stress caused by high temperature at the time of soldering is retained, and a stress field is formed thereat. A periodical refractive index distribution is formed along the light propagating direction in a waveguide, so that the resonant spectrum coincident to the resonant mode is strongly excited. A metallic electrode 8 and an insulator 9 are disposed on the layer 3, and stress caused by the thermal expansion coefficient difference is formed thereat, or the thickness of the clad layer 3 is periodically varied, and a stress field may be formed.申请人：MITSUBISHI ELECTRIC CORP更多信息请下载全文后查看。
激光焊接原理及实践应用
光 Light
光是一种电磁辐射 Light is electro-magnetic radiation
我们听不到.Waves that you cannot hear
可见光的波长在0.4-0.7微米之间。Visible from 0.4-0.7
micron wavelength
波长小于0.4微米是紫外线和X光Below 0.4 – ultraviolet
Time Share
Mirrors (100% Reflective)全反镜
A single laser can be used for multiple applications on a time shared basis基于同一个理论,单雷射可以一次性用于多种应 用. Most convenient with transmission through optical fiber 通过可见纤维的转换是最方便的. Processing stations can be in different rooms 工作台可以放在不同的房间.
物体的颜色来源于它反射的光的波长
Color of an object (wavelength that it reflects)
颜色和光的波长是相关联的。
Color is associated with particular wavelength
黑色和白色代表着什么？
What is the meaning of black or white color?
单频的（单波长）
Monochromatic (single wavelength)
校准的（平行光）
Collimated (parallel)