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Thiele-Small参数
Thiele/SmallFrom Wikipedia, the free encyclopedia"Thiele/Small " commonly refers to a set of electromechanical parameters that define the specified low frequency performance of a loudspeaker driver. These parameters are published in specification sheets by driver manufacturers so that designers have a guide in selecting off-the-shelf drivers for loudspeaker designs. Many of the parameters are strictly defined only at the resonant frequency, but the approach is generally applicable in the frequency range where the diaphragm motion is largely pistonic, i.e. when the entire cone moves in and out as a unit without cone breakup.Using these parameters, a loudspeaker designer may simulate the position, velocity and acceleration of the diaphragm, the input impedance and the sound output of a system comprising a loudspeaker and enclosure. Rather than purchase off-the-shelf components, loudspeaker design engineers often define desired performance and work backwards to a set of parameters and manufacture a driver with said characteristics or order it from a driver manufacturer. This process of generating parameters from a target response is known as synthesis. Thiele/Small parameters are named after A. Neville Thiele of the Australian Broadcasting Commission, and Richard H. Small of the University of Sydney, who pioneered this line of analysis for loudspeakers.HistoryThe 1925 paper of Chester W. Rice and Edward W. Kellogg, fueled by advances in radio and electronics, increased interest in direct radiator loudspeakers. In 1930, A. J. Thuras of Bell Labs patented (US Patent No. 1869178) his "Sound Translating Device" (essentially a vented box) which was evidence of the interest in many types of enclosure design at the time.Progress on loudspeaker enclosure design and analysis using acoustic analogous circuits by academic acousticians like Harry F. Olson continued until 1954 when Leo L. Beranek of the Massachusetts Institute of Technology published "Acoustics", a book summarizing and extending the electroacoustics of the era. J. F. Novak used novel simplifying assumptions in an analysis in a 1959 paper which led to a practical solution for the response of a given loudspeaker in a box, and also established their applicability by empirical measurement. In 1961, leaning heavily on Novak's work, A. N. Thiele described a series of sealed and vented box "alignments" (i.e., enclosure designs based on electrical filter theory with well-characterized behavior, including frequency response, power handling, cone excursion, etc) in a publication in an Australian Journal. This paper remained relatively unknown outside Australia until it was re-published in the Journal of the Audio Engineering Society in 1971. It is important to note that Thiele's work neglected enclosure losses, and though a breakthrough at the time his alignment tables now have little real-world utility.Contents1 History2 Fundamental small signal mechanical parameters3 Small signal parameters4 Large signal parameters5 Other parameters6 Qualitative descriptions7 Measurement notes—large signal behavior8 Lifetime changes in driver behavior9 Measurement techniques10 See also11 References 12 External linksMany others continued to develop various aspects of loudspeaker enclosure design in the 1960s and early 1970s. From 1968-1972 J. E. Benson published three articles in an Australian journal that thoroughly analyzed sealed, vented and passive radiator designs. Beginning in June 1972, Richard H. Small published a series of very influential articles in the Journal of the Audio Engineering Society restating and extending Thiele's work. These articles were also originally published in Australia, where he had attended graduate school, and where his thesis supervisor was J.E. Benson. The work of Benson and Small overlapped considerably, but differed in that Benson did his work using computer programs and Small used analog simulators. Both researchers analyzed the systems including enclosure losses.Fundamental small signal mechanical parametersThese are the physical parameters of a loudspeaker driver, as measured at small signal levels, used in the equivalent electrical circuit models. Some of these values are neither easy nor convenient to measure in a finished loudspeaker driver, so when designing speakers using existing drive units (which is almost always the case), the more easily measured parameters listed under Small Signal Parameters are more practical.S d- Projected area of the driver diaphragm, in square metres.M ms - Mass of the diaphragm/coil, including acoustic load, in kilograms. Mass of thediaphragm/coil alone is known as M mdC ms - Compliance of the driver's suspension, in metres per newton (the reciprocal of its 'stiffness').R ms - The mechanical resistance of a driver's suspension (ie, 'lossiness') in N·s/mL e- Voice coil inductance measured in millihenries (mH) (Frequency dependent, usually measured at 1 kHz).R e- DC resistance of the voice coil, measured in ohms. Bl - The product of magnet field strength in the voice coil gap and the length of wire in the magnetic field, in tesla-metres (T·m).Small signal parametersThese values can be determined by measuring the input impedance of the driver, near the resonance frequency, at small input levels for which the mechanical behavior of the driver is effectively linear (ie, proportional to its input). These values are more easily measured than the fundamental ones above.F s– Resonant frequency of the driverQ es – Electrical Q of the driver at F sQ ms – Mechanical Q of the driver at F sQ ts – Total Q of the driver at F sV as – Equivalent Compliance Volume, i.e. the volume of air which, when acted upon by a piston of area S d , has the same compliance as the driver's suspension:where ρ is the density of air (1.184 kg/m 3 at 25 °C), and c is the speed of sound (346.1 m/s at 25 °C). Using SI units, the result will be in cubic meters. To get V as in litres,multiply by 1000.Large signal parametersThese parameters are useful for predicting the approximate output of a driver at high input levels, though they are harder to accurately measure.X max - Maximum linear peak (or sometimes peak-to-peak) excursion (in mm) of the cone. Note that, because of mechanical issues, the motion of a driver cone becomes non-linear with large excursions, especially those in excess of this parameter.X mech - Maximum physical excursion of the driver before physical damage. With a sufficiently large input, the excursion will cause damage to the voice coil or other moving part of the driver.P e - Thermal power handling capacity of the driver, in watts. This value is difficult to characterize and is often overestimated, by manufacturers and others. V d - Peak displacement volume, calculated by V d = S d ·X maxOther parametersZ max - The impedance of the driver at F s , used when measuring Q es and Q ms .EBP - The efficiency bandwidth product, a rough indicator measure. A common rule of thumb indicates that for EBP>100, a driver is perhaps best used in a vented enclosure, while EBP<50 indicates a sealed enclosure. For 50<EBP<100, either enclosure may be used effectively.Z nom - The nominal impedance of the loudspeaker, typically 4, 8 or 16 ohms. η- The reference or "power available" efficiency of the driver, in percent.The expression ρ/2πc can be replaced by the value 5.445×10-4 m²·s/kg for dry air at 25 °C. For 25 °C air with 50% relative humidity the expression evaluates to 5.365×10-4 m²·s/kg.A version more easily calculated with typical published parameters is:The expression 4π2/c 3 can be replaced by the value 9.523×10–7 s³/m³ for dry air at 25 °C. For 25 °C air with 50% relative humidity the expression evaluates to 9.438×10−7 s³/m³.From the efficiency, we may calculate sensitivity, which is the sound pressure level a speaker produces for a given input:A speaker with an efficiency of 100% (1.0) would output a watt of energy for every watt of input. Considering the driver as a point source in an infinite baffle, at one meter this would be distributed over a hemisphere with area 2π m² for an intensity of (1/(2π))=0.159154 W/m², which gives an SPL of 112.1 dB in reference to the reference pressure of 2e-5 Pascals. SPL at 1 meter for an input of 1 watt is then: dB (1 watt) = 112.1 + 10*log(η0)SPL at 1 meter for an input of 2.83 volts is then: dB (2.83 V) = dB (1 watt) + 10*log(8/R e ) = 112.1 + 10*log(η0) + 10*log(8/R e )Qualitative descriptions F sAlso called F 0,resonance frequencymeasured in hertz (Hz). The frequencyat which the combination of theenergy stored in the moving mass andsuspension compliance is maximum, andresults in maximum cone velocity. Amore compliant suspension or a largermoving mass will cause a lower resonance frequency, and vice versa. Usually it is less efficient to produce output at frequencies below F s , and input signals significantly below F s can cause large excursions, mechanically endangering the driver. Woofers typically have an F s in the range of 13–60 Hz. Midranges usually have an F s in the range of 60–500 Hz and tweeters between 500 Hz and 4 kHz. A typical factory tolerance for Fsspec is ±15%.Cross-section of a dynamic cone loudspeaker.Image not to scale.Q tsA unitless measurement, characterizing the combined electric and mechanical damping of thedriver. In electronics, Q is the inverse of the damping ratio. The value of Q ts is proportional to the energy stored, divided by the energy dissipated, and is defined at resonance (F s). Mostdrivers have Q ts values between 0.2 and 0.5, but there are valid (if unusual) reasons to have a value outside this range.Q msA unitless measurement, characterizing the mechanical damping of the driver, that is, the lossesin the suspension (surround and spider.) It varies roughly between 0.5 and 10, with a typical value around 3. High Q ms indicates lower mechanical losses, and low Q ms indicates higherlosses. The main effect of Q ms is on the impedance of the driver, with high Q ms driversdisplaying a higher impedance peak. One predictor for low Q ms is a metallic voice coil former.These act as eddy-current brakes and increase damping, reducing Q ms. They must be designed with an electrical break in the cylinder (so no conducting loop). Some speaker manufacturers have placed shorted turns at the top and bottom of the voice coil to prevent it leaving the gap, but the sharp noise created by this device when the driver is overdriven is alarming and wasperceived as a problem by owners. Low Qms drivers are often built with nonconductive formers, made from paper, or various plastics.Q esA unitless measurement, describing the electrical damping of the loudspeaker. As the coil ofwire moves through the magnetic field, it generates a current which opposes the motion of the coil. This so-called "Back-EMF" (proportional to Bl * velocity) decreases the total currentthrough the coil near the resonance frequency, reducing cone movement and increasingimpedance. In most drivers, Q es is the dominant factor in the voice coil damping. Q es depends on amplifier output impedance. The formula above assumes zero output impedance. When anamplifier with nonzero output impedance is used, its output impedance should be added to R e for calculations involving Q es.BlMeasured in tesla-metres (T·m). Technically this is B×l or B×l sin(θ) (a vector cross product), but the standard geometry of a circular coil in an annular voice coil gap gives sin(θ)=1. B×l is also known as the 'force factor' because the force on the coil imposed by the magnet is B×lmultiplied by the current through the coil. The higher the B×l value, the larger the forcegenerated by a given current flowing through the voice coil. B×l has a very strong effect on Q es. V asMeasured in litres (L) or cubic metres, is a measure of the 'stiffness' of the suspension with the driver mounted in free air. It represents the volume of air that has the same stiffness as thedriver's suspension when acted on by a piston of the same area (S d) as the cone. Larger values mean lower stiffness, and generally require larger enclosures. V as varies with the square of the diameter. A typical factory tolerance for V as spec is ±20–30%.M msMeasured in grams (g) or kilograms (kg), this is the mass of the cone, coil and other moving parts of a driver, including the acoustic load imposed by the air in contact with the driver cone.M md is the cone/coil mass without the acoustic load, and the two should not be confused. Somesimulation software calculates M ms when M md is entered. M md can be very closely controlled by the manufacturer.R msUnits are not usually given for this parameter, but it is in mechanical 'ohms'. R ms is ameasurement of the losses, or damping, in a driver's suspension and moving system. It is the main factor in determining Q ms. R ms is influenced by suspension topology, materials, and by the voice coil former (bobbin) material.C msMeasured in metres per newton (m/N). Describes the compliance (ie, the inverse of stiffness) of the suspension. The more compliant a suspension system is, the lower its stiffness, so the higher the V as will be. Cms is proportional to Vas and thus has the same tolerance ranges.R eMeasured in ohms (Ω), this is the DC resistance (DCR) of the voice coil, best measured with the cone blocked, or prevented from moving or vibrating because otherwise the pickup of ambient sounds can cause the measurement to be unreliable. R e should not be confused with the rated driver impedance, Re can be tightly controlled by the manufacturer, while rated impedance values are often approximate at best.. American EIA standard RS-299A specifies that R e (or DCR) should be at least 80% of the rated driver impedance, so an 8-ohm rated driver should have a DC resistance of at least 6.4 ohms, and a 4-ohm unit should measure 3.2 ohms minimum.This standard is voluntary, and many 8 ohm drivers have resistances of ~5.5 ohms, andproportionally lower for lower rated impedances.L eMeasured in millihenries (mH), this is the inductance of the voice coil. The coil is a lossyinductor, in part due to losses in the pole piece, so the apparent inductance changes withfrequency. Large L e values limit the high frequency output of the driver and cause response changes near cutoff. Simple modeling software often neglects L e, and so does not include its consequences. Inductance varies with excursion because the voice coil moves relative to the polepiece, which acts as a sliding inductor core, increasing inductance on the inward stroke and decreasing it on the outward stroke in typical overhung magnet arrangements. This inductance modulation is an important source of nonlinearity (distortion) in loudspeakers. Including acopper cap on the pole piece or a copper shorting ring on it, can reduce the increase inimpedance seen at higher frequencies in typical drivers, and also reduce the nonlinearity due to inductance modulation.S dMeasured in square metres (m²). The effective projected area of the cone or diaphragm. It is difficult to measure and depends largely on the shape and properties of the surround. Generally accepted as the cone body diameter plus one third to one half the width of the annulus(surround). Drivers with wide roll surrounds can have significantly less S d than conventional types with the same frame diameter.X maxSpecified in millimeters (mm). In the simplest form, subtract the height of the voice coil winding from the height of the magnetic gap, take the absolute value and divide by 2. This technique was suggested by JBL's Mark Gander in a 1981 AES paper, as an indicator of a loudspeaker motor's linear range. Although easily determined, it neglects magnetic and mechanical non-linearitiesand asymmetry, which are substantial for some drivers. Subsequently, a combinedmechanical/acoustical measure was suggested, in which a driver is progressively driven to high levels at low frequencies, with X max determined by measuring excursion at a level where 10% THD is measured in the output. This method better represents actual driver performance, but is more difficult and time-consuming to determine.P eSpecified in watts. Frequently two power ratings are given, an "RMS" rating and a "music" (or "peak", or "system") rating, usually peak is given as ~2 times the RMS rating. Loudspeakers have complex behavior, and a single number is really unsatisfactory. There are two aspects of power handling, thermal and mechanical. The Thermal capacity is related to coil temperature and the point where adhesives and coil insulation melt or change shape. The Mechanical limit comes into play at low frequencies, where excursions are largest, and involves mechanical failure of some component. A speaker that can handle 200Watts thermally at 200Hz, may sometimes be damaged by only a few Watts at some very low frequency, like 10Hz. Power handlingspecifications are usually generated destructively, by long term industry standard noise signals (IEC 268, for example) that filter out low frequencies and test only the thermal capability of the driver. Actual mechanical power handling depends greatly on the enclosure in which the driver is installed.V dSpecified in litres (L). The volume displaced by the cone, equal to the cone area (S d) multiplied by X max. A particular value may be achieved in any of several ways. For instance, by having a small cone with a large Xmax, or a large cone with a small X max. Comparing V d values will give an indication of the maximum output of a driver at low frequencies. High X max, small conediameter drivers are likely to be inefficient, since much of the voice coil winding will be outside the magnetic gap at any one time and will therefore contribute little or nothing to cone motion.Likewise, large cone diameter, small X max drivers are likely to be more efficient as they will not need, and so may not have, long voice coils.η0 - Reference EfficiencySpecified in percent (%). Comparing drivers by their calculated reference efficiency is often more useful than using 'sensitivity' since manufacturer sensitivity figures are too often optimistic.SensitivityThe sound pressure, in dB, produced by a speaker in response to a specified stimulus. Usually this is specified at an input of 1 watt or 2.83 volts (2.83 volts = 1 watt into an 8 ohm load) at a distance of one metre.Measurement notes—large signal behaviorSome caution is required when using and interpreting T/S parameters. It is important to mention that individual units may not match manufacturer specifications. Parameters values are almost never individually taken, but are at best averages across a production run, due to inevitable manufacturing variations. Driver characteristics will generally lie within a (sometimes specified) tolerance range. Cms is the least controllable parameter, but typical variations in Cms do not have large effects on the final response.It is also important to understand that most T/S parameters are linearized small signal values. An analysis based on them is an idealized view of driver behavior, since the actual values of these parameters vary in all drivers according to drive level, voice coil temperature, over the life of thedriver, etc. C ms decreases the farther the coil moves from rest. B l is generally maximum at rest, and drops as the voice coil approaches X max. Re increases as the coil heats and the value will typically double by 270 °C, at which many voice coils are approaching (or have already reached) thermalfailure.As an example, F s and V as may vary considerably with input level, due to nonlinear changes in C ms.A typical 110 mm diameter full-range driver with an F s of 95 Hz at 0.5 V signal level, might drop to64 Hz when fed a 5 V input. A driver with a measured V as of 7 L at 0.5 V, may show a V as increase to 13 L when tested at 4 V. Q ms is typically stable within a few percent, regardless of drive level. Q es and Q ts decrease <13% as the drive level rises from 0.5 V to 4 V, due to the changes in B l. Because V as can rise significantly and F s can drop considerably, with a trivial change in measured M ms, the calculated sensitivity value (η0) can appear to drop by >30% as the level changes from 0.5 V to 4 V. Of course, the driver's actual sensitivity has not changed at all, but the calculated sensitivity is correct only under some conditions. From this example, it is seen that the measurements to be preferred whilst designing an enclosure or system are those likely to represent typical operating conditions. Unfortunately, this level must be arbitrary, since the operating conditions are continually changing when reproducing music. Level-dependent nonlinearities typically cause lower than predicted output, or small variations in frequency response.Level shifts caused by resistive heating of the voice coil are termed power compression. Design techniques which reduce nonlinearities may also reduce power compression, and possibly distortions not caused by power compression. There have been several commercial designs that have included cooling arrangements for driver magnetic structures, intended to mitigate voice coil temperature rise, and the attendant rise in resistance that is the cause of the power compression. Elegant magnet and coil designs have been used to linearize B l and reduce the value and modulation of L e. Large, linear spiders can increase the linear range of C ms, but the large signal values of B l and C ms must be balanced to avoid dynamic offset.Lifetime changes in driver behaviorThe mechanical components in typical speaker drivers may change over time. Paper, a popular material in cone fabrication, absorbs moisture easily and unless treated may lose some structural rigidity over time. This may be reduced by coating with water-impregnable material such as resins. Cracks compromise structural rigidity and are generally non-repairable. Temperature has a strong, generally reversible effect; suspension materials become stiffer at lower temperatures. The suspension also undergoes changes from chemical and environmental effects associated with aging such as exposure to ultraviolet light, and oxidation which affect foam and natural rubber badly, though butyl, nitrile, SBR rubber, and rubber-plastic alloys (such as Santoprene) are more stable. Foam is highly prone to disintegration after 10 to 15 years. The changes in behavior from aging are rarely positive, and since the environment that they are used in is a major factor, the effects are not easily predicted. Gilbert Briggs, founder of Wharfedale Loudspeakers in the UK, undertook several studies of aging effects in speaker drivers in the 1950s and 1960s, publishing some of the data in his book, Loudspeakers.There are also mechanical changes which occur in the moving components during use. In this case, however, most of the changes seem to occur early in the life of the driver, and are almost certainly due to relaxation in flexing mechanical parts of the driver (e.g., surround, spider, etc). Several studies have been published documenting substantial changes in the T/S parameters over the first few hours of use, some parameters changing as much as 15%+ over these initial periods. Other studies suggest little change, or reversible changes after only the first few minutes. This variability is largely related to the particular characteristics of specific materials, and reputable manufacturers take them intoaccount. While there are a great many anecdotal reports of the audible effects of such changes inpublished speaker reviews, the relationship of such early changes to subjective sound quality reports is not completely clear. Some changes early in driver life are complementary (such as a reduction inFs accompanied by a rise in Vas) and result in minimal net changes (small fractions of a dB) in frequency response. If the performance of speaker system is critical, as with high order (complex) or heavily equalized systems, it is sensible to measure T/S parameters after a period of run-in, and to model the effects of normal parameter changes.Measurement techniquesThere are numerous methods to measure T/S parameters,but the simplest use the input impedance of the driver, measured near resonance. The impedance may be measured in free air (with the driver unhoused and either clamped to a fixture or hanging from a wire, or sometimes resting on the magnet on a surface) and/or in test baffles, sealed or vented boxes or with varying amounts of mass added to the diaphragm. Noise in the measurement environment can have an effect on the measurement, so one should measure parameters in an quiet acoustic environment.The most common (DIY-friendly) method before the advent of computer-controlled measurement techniques is the classic free air constant current method, described by Thiele in 1961. This method uses a large resistance (e.g., 500 to 1000 ohms) in series with the driver and a signal generator is used to vary the excitation frequency. The voltage across the loudspeaker terminals is measured and considered proportional to the impedance. It is assumed that variations in loudspeaker impedance will have little effect on the current through the loudspeaker. This is an approximation, and the method results in Q measurement errors for drivers with a high Z max.A second method is the constant voltage measurement, where the driver is excited by a constant voltage, and the current passing through the coil is measured. The excitation voltage divided by the measured current equals the impedance.A common source of error using these first two methods is the use of inexpensive AC meters. Most inexpensive meters are designed to measure residential power frequencies (50–60 Hz) and are increasingly inaccurate at other frequencies (e.g., below 40 Hz or above a few hundred hertz). In addition, distorted or non–sine wave signals can cause measurement inaccuracies. Inexpensive voltmeters are also not very accurate or precise at measuring current and can introduce appreciable series resistance, which causes measurement errors.A third method is a response to the deficiencies of the first two methods. It uses a smaller (e.g., 10 ohm) series resistor and measurements are made of the voltage across the driver, the signal generator, and/or series resistor for frequencies around resonance. Although tedious, and not often used in manual measurements, simple calculations exist which allow the true impedance magnitude and phase to be determined. This is the method used by many computer loudspeaker measurement systems. When this method is used manually, the result of taking the three measurements is that their ratios are more important than their actual value, removing the effect of poor meter frequency responseSee alsoElectrical characteristics of a dynamic loudspeakerAcoustical engineeringReferencesRice, Chester W. and Edward W. Kellogg, "Notes on the Development of a New Type ofHornless Loudspeaker", Transactions of the American Institute of Electrical Engineers, vol. 44, pp. 461-475 (1925).(1954) Beranek, Leo L., "Acoustics", New York : McGraw-Hill, ISBN 0-88318-494-XBriggs, Gilbert, "Loudspeakers", Wharfedale Ltd.J.F. Novak, "Performance of Enclosures for Low-Resonance High-Compliance Loudspeakers", J. Audio Eng. Soc., vol. 7, p 29 (Jan. 1959)(1996) Benson, J.E., "Theory and Design of Loudspeaker Enclosures", Indianapolis, Howard Sams & Company ISBN 0-7906-1093-0 ( book is a collection of three papers originallypublished in Australia, 1968-1971)Thiele, A.N., "Loudspeakers in Vented Boxes, Parts I and II", J. Audio Eng. Soc., vol. 19,pp. 382-392 (May 1971); pp. 471-483 (June 1971).Small, R.H., "Direct-Radiator Loudspeaker System Analysis", J. Audio Eng. Soc., vol. 20,pp. 383-395 (June 1972).Small, R.H., "Closed-Box Loudspeaker Systems", J. Audio Eng. Soc., vol. 20, pp. 798-808 (Dec.1972); vol. 21, pp. 11-18 (Jan./Feb. 1973).Small, R.H., "Vented-Box Loudspeaker Systems", J. Audio Eng. Soc., vol. 21, pp. 363-372 (June 1973); pp. 438-444 (July/Aug. 1973); pp. 549-554 (Sept. 1973); pp. 635-639 (Oct. 1973).External linksMeasuring Thiele Small Parameters (method 1 - the classic method)Measuring parameters (method 2)Fast Bass, Slow Bass - Myth vs. FactUnderstanding Power CompressionAcoustic Analogous Circuits - the method behind the formulasA database of more than 5000 Loudspeakers - Both Published and MeasuredRetrieved from "/wiki/Thiele/Small"Categories: Audio engineering | LoudspeakersThis page was last modified on 10 August 2011 at 23:42.Text is available under the Creative Commons Attribution-ShareAlike License; additional terms may apply. See Terms of use for details.Wikipedia® is a registered trademark of the Wikimedia Foundation, Inc., a non-profitorganization.。
国内外歌剧院扬声器布置方式的对比分析
2021年第3期总第179期 月刊No. 03 2021 monthly No. 179国内外歌剧院扬声器布置方式的对比分析杨志刚(华东建筑设计研究院有限公司,上海 200070)【摘 要】 对国内外歌剧院扬声器布置的方式进行总结,分析影响扬声器布置方式的要素,结合实例讨论扬声器的明 装和暗装两种情形。
【关键词】 歌剧院;扬声器;布置方式;点声源;线阵列;音柱;明装;暗装DOI:10.3969/j.issn.1674-8239.2021.03.008Comparative Analysis of the Arrangement of Loudspeakers in Opera Houses at Home and AbroadYANG Zhi-gang(East China Architectural Design & Research Institute Co., Ltd., Shanghai 200070, China)【Abstract】This article summarizes the layout of loudspeakers in opera houses at home and abroad, analyzes the factors that affect the layout of loudspeakers, and discusses the two situations of loudspeaker installation and concealed installation with examples.【Key Words】opera house; loudspeaker; layout; point sound source; line array; sound column; exposed installation; concealed installation歌剧(opera)是将音乐(声乐与器乐)、文本、诗歌、舞蹈、舞台美术等融为一体的综合性艺术,于15世纪末至16世纪初在意大利宫廷中发展起来。
猜字谜英文版
猜字谜英文版Guessing Riddles: English EditionRiddles are a popular form of entertainment that can be found in various cultures around the world. They challenge our thinking and creativity by presenting us with a puzzle that requires us to think outside the box. In this article, we will explore some interesting English riddles that will put your mind to the test.1. I speak without a mouth and hear without ears. I have no body, but I come alive with wind. What am I?The answer to this riddle is an echo. Echoes are created when sound waves bounce off surfaces and return to our ears. They can be heard in caves, mountains, and even in large empty rooms.2. I have keys but no locks. I have space but no room. You can enter but can't go outside. What am I?The answer to this riddle is a keyboard. A keyboard has keys that we press to input characters into a computer, but there are no physical locks on the keys. It also has spaces between the keys but no actual rooms. You can enter the keys but can't physically go outside of the keyboard.3. I have cities but no houses, forests but no trees, and rivers but no water. What am I?The answer to this riddle is a map. A map shows us the layout of cities, forests, and rivers, but it doesn't have actual houses, trees, or water. It is a visual representation of geographical features.4. I have a heart that doesn't beat. I have a home but I don't live. I can travel but I have no feet. What am I?The answer to this riddle is a deck of cards. A deck of cards has a heart suit, but the heart doesn't beat. It is also a part of a game that has a home, but the cards themselvesdon't live. Lastly, a deck of cards can be shuffled and dealt, which can be seen as a form of travel, but the cards have no physical feet.5. I am taken from a mine and shut in a wooden case, from which I am never released, and yet I am used by almost every person. What am I?The answer to this riddle is a pencil lead. Pencil leads are made from graphite, which is mined from the earth. They are then placed inside a wooden case, commonly known as a pencil, and are never released from it. Despite this, pencils are widely used by almost everyone for writing and drawing.6. I am always hungry, I must always be fed. The finger I touch will soon turn red. What am I?The answer to this riddle is fire. Fire is always hungry for fuel, and it must be continuously fed with wood, gas, or other combustible materials to keep it burning. When you touch fire, it can burn your finger and turn it red.Riddles provide a fun and challenging way to exercise our brains. They require us to think creatively, use our knowledge, and sometimes even think metaphorically. The English riddles mentioned above are just a few examples of the countless riddles that exist. So, next time you are looking for a mental challenge, try solving some riddles and see if you can crack the code.。
Native Instruments MASCHINE MK3 用户手册说明书
The information in this document is subject to change without notice and does not represent a commitment on the part of Native Instruments GmbH. The software described by this docu-ment is subject to a License Agreement and may not be copied to other media. No part of this publication may be copied, reproduced or otherwise transmitted or recorded, for any purpose, without prior written permission by Native Instruments GmbH, hereinafter referred to as Native Instruments.“Native Instruments”, “NI” and associated logos are (registered) trademarks of Native Instru-ments GmbH.ASIO, VST, HALion and Cubase are registered trademarks of Steinberg Media Technologies GmbH.All other product and company names are trademarks™ or registered® trademarks of their re-spective holders. Use of them does not imply any affiliation with or endorsement by them.Document authored by: David Gover and Nico Sidi.Software version: 2.8 (02/2019)Hardware version: MASCHINE MK3Special thanks to the Beta Test Team, who were invaluable not just in tracking down bugs, but in making this a better product.NATIVE INSTRUMENTS GmbH Schlesische Str. 29-30D-10997 Berlin Germanywww.native-instruments.de NATIVE INSTRUMENTS North America, Inc. 6725 Sunset Boulevard5th FloorLos Angeles, CA 90028USANATIVE INSTRUMENTS K.K.YO Building 3FJingumae 6-7-15, Shibuya-ku, Tokyo 150-0001Japanwww.native-instruments.co.jp NATIVE INSTRUMENTS UK Limited 18 Phipp StreetLondon EC2A 4NUUKNATIVE INSTRUMENTS FRANCE SARL 113 Rue Saint-Maur75011 ParisFrance SHENZHEN NATIVE INSTRUMENTS COMPANY Limited 5F, Shenzhen Zimao Center111 Taizi Road, Nanshan District, Shenzhen, GuangdongChina© NATIVE INSTRUMENTS GmbH, 2019. All rights reserved.Table of Contents1Welcome to MASCHINE (25)1.1MASCHINE Documentation (26)1.2Document Conventions (27)1.3New Features in MASCHINE 2.8 (29)1.4New Features in MASCHINE 2.7.10 (31)1.5New Features in MASCHINE 2.7.8 (31)1.6New Features in MASCHINE 2.7.7 (32)1.7New Features in MASCHINE 2.7.4 (33)1.8New Features in MASCHINE 2.7.3 (36)2Quick Reference (38)2.1Using Your Controller (38)2.1.1Controller Modes and Mode Pinning (38)2.1.2Controlling the Software Views from Your Controller (40)2.2MASCHINE Project Overview (43)2.2.1Sound Content (44)2.2.2Arrangement (45)2.3MASCHINE Hardware Overview (48)2.3.1MASCHINE Hardware Overview (48)2.3.1.1Control Section (50)2.3.1.2Edit Section (53)2.3.1.3Performance Section (54)2.3.1.4Group Section (56)2.3.1.5Transport Section (56)2.3.1.6Pad Section (58)2.3.1.7Rear Panel (63)2.4MASCHINE Software Overview (65)2.4.1Header (66)2.4.2Browser (68)2.4.3Arranger (70)2.4.4Control Area (73)2.4.5Pattern Editor (74)3Basic Concepts (76)3.1Important Names and Concepts (76)3.2Adjusting the MASCHINE User Interface (79)3.2.1Adjusting the Size of the Interface (79)3.2.2Switching between Ideas View and Song View (80)3.2.3Showing/Hiding the Browser (81)3.2.4Showing/Hiding the Control Lane (81)3.3Common Operations (82)3.3.1Using the 4-Directional Push Encoder (82)3.3.2Pinning a Mode on the Controller (83)3.3.3Adjusting Volume, Swing, and Tempo (84)3.3.4Undo/Redo (87)3.3.5List Overlay for Selectors (89)3.3.6Zoom and Scroll Overlays (90)3.3.7Focusing on a Group or a Sound (91)3.3.8Switching Between the Master, Group, and Sound Level (96)3.3.9Navigating Channel Properties, Plug-ins, and Parameter Pages in the Control Area.973.3.9.1Extended Navigate Mode on Your Controller (102)3.3.10Navigating the Software Using the Controller (105)3.3.11Using Two or More Hardware Controllers (106)3.3.12Touch Auto-Write Option (108)3.4Native Kontrol Standard (110)3.5Stand-Alone and Plug-in Mode (111)3.5.1Differences between Stand-Alone and Plug-in Mode (112)3.5.2Switching Instances (113)3.5.3Controlling Various Instances with Different Controllers (114)3.6Host Integration (114)3.6.1Setting up Host Integration (115)3.6.1.1Setting up Ableton Live (macOS) (115)3.6.1.2Setting up Ableton Live (Windows) (116)3.6.1.3Setting up Apple Logic Pro X (116)3.6.2Integration with Ableton Live (117)3.6.3Integration with Apple Logic Pro X (119)3.7Preferences (120)3.7.1Preferences – General Page (121)3.7.2Preferences – Audio Page (126)3.7.3Preferences – MIDI Page (130)3.7.4Preferences – Default Page (133)3.7.5Preferences – Library Page (137)3.7.6Preferences – Plug-ins Page (145)3.7.7Preferences – Hardware Page (150)3.7.8Preferences – Colors Page (154)3.8Integrating MASCHINE into a MIDI Setup (156)3.8.1Connecting External MIDI Equipment (156)3.8.2Sync to External MIDI Clock (157)3.8.3Send MIDI Clock (158)3.9Syncing MASCHINE using Ableton Link (159)3.9.1Connecting to a Network (159)3.9.2Joining and Leaving a Link Session (159)3.10Using a Pedal with the MASCHINE Controller (160)3.11File Management on the MASCHINE Controller (161)4Browser (163)4.1Browser Basics (163)4.1.1The MASCHINE Library (163)4.1.2Browsing the Library vs. Browsing Your Hard Disks (164)4.2Searching and Loading Files from the Library (165)4.2.1Overview of the Library Pane (165)4.2.2Selecting or Loading a Product and Selecting a Bank from the Browser (170)4.2.2.1[MK3] Browsing by Product Category Using the Controller (174)4.2.2.2[MK3] Browsing by Product Vendor Using the Controller (174)4.2.3Selecting a Product Category, a Product, a Bank, and a Sub-Bank (175)4.2.3.1Selecting a Product Category, a Product, a Bank, and a Sub-Bank on theController (179)4.2.4Selecting a File Type (180)4.2.5Choosing Between Factory and User Content (181)4.2.6Selecting Type and Character Tags (182)4.2.7List and Tag Overlays in the Browser (186)4.2.8Performing a Text Search (188)4.2.9Loading a File from the Result List (188)4.3Additional Browsing Tools (193)4.3.1Loading the Selected Files Automatically (193)4.3.2Auditioning Instrument Presets (195)4.3.3Auditioning Samples (196)4.3.4Loading Groups with Patterns (197)4.3.5Loading Groups with Routing (198)4.3.6Displaying File Information (198)4.4Using Favorites in the Browser (199)4.5Editing the Files’ Tags and Properties (203)4.5.1Attribute Editor Basics (203)4.5.2The Bank Page (205)4.5.3The Types and Characters Pages (205)4.5.4The Properties Page (208)4.6Loading and Importing Files from Your File System (209)4.6.1Overview of the FILES Pane (209)4.6.2Using Favorites (211)4.6.3Using the Location Bar (212)4.6.4Navigating to Recent Locations (213)4.6.5Using the Result List (214)4.6.6Importing Files to the MASCHINE Library (217)4.7Locating Missing Samples (219)4.8Using Quick Browse (221)5Managing Sounds, Groups, and Your Project (225)5.1Overview of the Sounds, Groups, and Master (225)5.1.1The Sound, Group, and Master Channels (226)5.1.2Similarities and Differences in Handling Sounds and Groups (227)5.1.3Selecting Multiple Sounds or Groups (228)5.2Managing Sounds (233)5.2.1Loading Sounds (235)5.2.2Pre-listening to Sounds (236)5.2.3Renaming Sound Slots (237)5.2.4Changing the Sound’s Color (237)5.2.5Saving Sounds (239)5.2.6Copying and Pasting Sounds (241)5.2.7Moving Sounds (244)5.2.8Resetting Sound Slots (245)5.3Managing Groups (247)5.3.1Creating Groups (248)5.3.2Loading Groups (249)5.3.3Renaming Groups (251)5.3.4Changing the Group’s Color (251)5.3.5Saving Groups (253)5.3.6Copying and Pasting Groups (255)5.3.7Reordering Groups (258)5.3.8Deleting Groups (259)5.4Exporting MASCHINE Objects and Audio (260)5.4.1Saving a Group with its Samples (261)5.4.2Saving a Project with its Samples (262)5.4.3Exporting Audio (264)5.5Importing Third-Party File Formats (270)5.5.1Loading REX Files into Sound Slots (270)5.5.2Importing MPC Programs to Groups (271)6Playing on the Controller (275)6.1Adjusting the Pads (275)6.1.1The Pad View in the Software (275)6.1.2Choosing a Pad Input Mode (277)6.1.3Adjusting the Base Key (280)6.1.4Using Choke Groups (282)6.1.5Using Link Groups (284)6.2Adjusting the Key, Choke, and Link Parameters for Multiple Sounds (286)6.3Playing Tools (287)6.3.1Mute and Solo (288)6.3.2Choke All Notes (292)6.3.3Groove (293)6.3.4Level, Tempo, Tune, and Groove Shortcuts on Your Controller (295)6.3.5Tap Tempo (299)6.4Performance Features (300)6.4.1Overview of the Perform Features (300)6.4.2Selecting a Scale and Creating Chords (303)6.4.3Scale and Chord Parameters (303)6.4.4Creating Arpeggios and Repeated Notes (316)6.4.5Swing on Note Repeat / Arp Output (321)6.5Using Lock Snapshots (322)6.5.1Creating a Lock Snapshot (322)6.5.2Using Extended Lock (323)6.5.3Updating a Lock Snapshot (323)6.5.4Recalling a Lock Snapshot (324)6.5.5Morphing Between Lock Snapshots (324)6.5.6Deleting a Lock Snapshot (325)6.5.7Triggering Lock Snapshots via MIDI (326)6.6Using the Smart Strip (327)6.6.1Pitch Mode (328)6.6.2Modulation Mode (328)6.6.3Perform Mode (328)6.6.4Notes Mode (329)7Working with Plug-ins (330)7.1Plug-in Overview (330)7.1.1Plug-in Basics (330)7.1.2First Plug-in Slot of Sounds: Choosing the Sound’s Role (334)7.1.3Loading, Removing, and Replacing a Plug-in (335)7.1.3.1Browser Plug-in Slot Selection (341)7.1.4Adjusting the Plug-in Parameters (344)7.1.5Bypassing Plug-in Slots (344)7.1.6Using Side-Chain (346)7.1.7Moving Plug-ins (346)7.1.8Alternative: the Plug-in Strip (348)7.1.9Saving and Recalling Plug-in Presets (348)7.1.9.1Saving Plug-in Presets (349)7.1.9.2Recalling Plug-in Presets (350)7.1.9.3Removing a Default Plug-in Preset (351)7.2The Sampler Plug-in (352)7.2.1Page 1: Voice Settings / Engine (354)7.2.2Page 2: Pitch / Envelope (356)7.2.3Page 3: FX / Filter (359)7.2.4Page 4: Modulation (361)7.2.5Page 5: LFO (363)7.2.6Page 6: Velocity / Modwheel (365)7.3Using Native Instruments and External Plug-ins (367)7.3.1Opening/Closing Plug-in Windows (367)7.3.2Using the VST/AU Plug-in Parameters (370)7.3.3Setting Up Your Own Parameter Pages (371)7.3.4Using VST/AU Plug-in Presets (376)7.3.5Multiple-Output Plug-ins and Multitimbral Plug-ins (378)8Using the Audio Plug-in (380)8.1Loading a Loop into the Audio Plug-in (384)8.2Editing Audio in the Audio Plug-in (385)8.3Using Loop Mode (386)8.4Using Gate Mode (388)9Using the Drumsynths (390)9.1Drumsynths – General Handling (391)9.1.1Engines: Many Different Drums per Drumsynth (391)9.1.2Common Parameter Organization (391)9.1.3Shared Parameters (394)9.1.4Various Velocity Responses (394)9.1.5Pitch Range, Tuning, and MIDI Notes (394)9.2The Kicks (395)9.2.1Kick – Sub (397)9.2.2Kick – Tronic (399)9.2.3Kick – Dusty (402)9.2.4Kick – Grit (403)9.2.5Kick – Rasper (406)9.2.6Kick – Snappy (407)9.2.7Kick – Bold (409)9.2.8Kick – Maple (411)9.2.9Kick – Push (412)9.3The Snares (414)9.3.1Snare – Volt (416)9.3.2Snare – Bit (418)9.3.3Snare – Pow (420)9.3.4Snare – Sharp (421)9.3.5Snare – Airy (423)9.3.6Snare – Vintage (425)9.3.7Snare – Chrome (427)9.3.8Snare – Iron (429)9.3.9Snare – Clap (431)9.3.10Snare – Breaker (433)9.4The Hi-hats (435)9.4.1Hi-hat – Silver (436)9.4.2Hi-hat – Circuit (438)9.4.3Hi-hat – Memory (440)9.4.4Hi-hat – Hybrid (442)9.4.5Creating a Pattern with Closed and Open Hi-hats (444)9.5The Toms (445)9.5.1Tom – Tronic (447)9.5.2Tom – Fractal (449)9.5.3Tom – Floor (453)9.5.4Tom – High (455)9.6The Percussions (456)9.6.1Percussion – Fractal (458)9.6.2Percussion – Kettle (461)9.6.3Percussion – Shaker (463)9.7The Cymbals (467)9.7.1Cymbal – Crash (469)9.7.2Cymbal – Ride (471)10Using the Bass Synth (474)10.1Bass Synth – General Handling (475)10.1.1Parameter Organization (475)10.1.2Bass Synth Parameters (477)11Working with Patterns (479)11.1Pattern Basics (479)11.1.1Pattern Editor Overview (480)11.1.2Navigating the Event Area (486)11.1.3Following the Playback Position in the Pattern (488)11.1.4Jumping to Another Playback Position in the Pattern (489)11.1.5Group View and Keyboard View (491)11.1.6Adjusting the Arrange Grid and the Pattern Length (493)11.1.7Adjusting the Step Grid and the Nudge Grid (497)11.2Recording Patterns in Real Time (501)11.2.1Recording Your Patterns Live (501)11.2.2The Record Prepare Mode (504)11.2.3Using the Metronome (505)11.2.4Recording with Count-in (506)11.2.5Quantizing while Recording (508)11.3Recording Patterns with the Step Sequencer (508)11.3.1Step Mode Basics (508)11.3.2Editing Events in Step Mode (511)11.3.3Recording Modulation in Step Mode (513)11.4Editing Events (514)11.4.1Editing Events with the Mouse: an Overview (514)11.4.2Creating Events/Notes (517)11.4.3Selecting Events/Notes (518)11.4.4Editing Selected Events/Notes (526)11.4.5Deleting Events/Notes (532)11.4.6Cut, Copy, and Paste Events/Notes (535)11.4.7Quantizing Events/Notes (538)11.4.8Quantization While Playing (540)11.4.9Doubling a Pattern (541)11.4.10Adding Variation to Patterns (541)11.5Recording and Editing Modulation (546)11.5.1Which Parameters Are Modulatable? (547)11.5.2Recording Modulation (548)11.5.3Creating and Editing Modulation in the Control Lane (550)11.6Creating MIDI Tracks from Scratch in MASCHINE (555)11.7Managing Patterns (557)11.7.1The Pattern Manager and Pattern Mode (558)11.7.2Selecting Patterns and Pattern Banks (560)11.7.3Creating Patterns (563)11.7.4Deleting Patterns (565)11.7.5Creating and Deleting Pattern Banks (566)11.7.6Naming Patterns (568)11.7.7Changing the Pattern’s Color (570)11.7.8Duplicating, Copying, and Pasting Patterns (571)11.7.9Moving Patterns (574)11.7.10Adjusting Pattern Length in Fine Increments (575)11.8Importing/Exporting Audio and MIDI to/from Patterns (576)11.8.1Exporting Audio from Patterns (576)11.8.2Exporting MIDI from Patterns (577)11.8.3Importing MIDI to Patterns (580)12Audio Routing, Remote Control, and Macro Controls (589)12.1Audio Routing in MASCHINE (590)12.1.1Sending External Audio to Sounds (591)12.1.2Configuring the Main Output of Sounds and Groups (596)12.1.3Setting Up Auxiliary Outputs for Sounds and Groups (601)12.1.4Configuring the Master and Cue Outputs of MASCHINE (605)12.1.5Mono Audio Inputs (610)12.1.5.1Configuring External Inputs for Sounds in Mix View (611)12.2Using MIDI Control and Host Automation (614)12.2.1Triggering Sounds via MIDI Notes (615)12.2.2Triggering Scenes via MIDI (622)12.2.3Controlling Parameters via MIDI and Host Automation (623)12.2.4Selecting VST/AU Plug-in Presets via MIDI Program Change (631)12.2.5Sending MIDI from Sounds (632)12.3Creating Custom Sets of Parameters with the Macro Controls (636)12.3.1Macro Control Overview (637)12.3.2Assigning Macro Controls Using the Software (638)12.3.3Assigning Macro Controls Using the Controller (644)13Controlling Your Mix (646)13.1Mix View Basics (646)13.1.1Switching between Arrange View and Mix View (646)13.1.2Mix View Elements (647)13.2The Mixer (649)13.2.1Displaying Groups vs. Displaying Sounds (650)13.2.2Adjusting the Mixer Layout (652)13.2.3Selecting Channel Strips (653)13.2.4Managing Your Channels in the Mixer (654)13.2.5Adjusting Settings in the Channel Strips (656)13.2.6Using the Cue Bus (660)13.3The Plug-in Chain (662)13.4The Plug-in Strip (663)13.4.1The Plug-in Header (665)13.4.2Panels for Drumsynths and Internal Effects (667)13.4.3Panel for the Sampler (668)13.4.4Custom Panels for Native Instruments Plug-ins (671)13.4.5Undocking a Plug-in Panel (Native Instruments and External Plug-ins Only) (675)13.5Controlling Your Mix from the Controller (677)13.5.1Navigating Your Channels in Mix Mode (678)13.5.2Adjusting the Level and Pan in Mix Mode (679)13.5.3Mute and Solo in Mix Mode (680)13.5.4Plug-in Icons in Mix Mode (680)14Using Effects (681)14.1Applying Effects to a Sound, a Group or the Master (681)14.1.1Adding an Effect (681)14.1.2Other Operations on Effects (690)14.1.3Using the Side-Chain Input (692)14.2Applying Effects to External Audio (695)14.2.1Step 1: Configure MASCHINE Audio Inputs (695)14.2.2Step 2: Set up a Sound to Receive the External Input (698)14.2.3Step 3: Load an Effect to Process an Input (700)14.3Creating a Send Effect (701)14.3.1Step 1: Set Up a Sound or Group as Send Effect (702)14.3.2Step 2: Route Audio to the Send Effect (706)14.3.3 A Few Notes on Send Effects (708)14.4Creating Multi-Effects (709)15Effect Reference (712)15.1Dynamics (713)15.1.1Compressor (713)15.1.2Gate (717)15.1.3Transient Master (721)15.1.4Limiter (723)15.1.5Maximizer (727)15.2Filtering Effects (730)15.2.1EQ (730)15.2.2Filter (733)15.2.3Cabinet (737)15.3Modulation Effects (738)15.3.1Chorus (738)15.3.2Flanger (740)15.3.3FM (742)15.3.4Freq Shifter (743)15.3.5Phaser (745)15.4Spatial and Reverb Effects (747)15.4.1Ice (747)15.4.2Metaverb (749)15.4.3Reflex (750)15.4.4Reverb (Legacy) (752)15.4.5Reverb (754)15.4.5.1Reverb Room (754)15.4.5.2Reverb Hall (757)15.4.5.3Plate Reverb (760)15.5Delays (762)15.5.1Beat Delay (762)15.5.2Grain Delay (765)15.5.3Grain Stretch (767)15.5.4Resochord (769)15.6Distortion Effects (771)15.6.1Distortion (771)15.6.2Lofi (774)15.6.3Saturator (775)15.7Perform FX (779)15.7.1Filter (780)15.7.2Flanger (782)15.7.3Burst Echo (785)15.7.4Reso Echo (787)15.7.5Ring (790)15.7.6Stutter (792)15.7.7Tremolo (795)15.7.8Scratcher (798)16Working with the Arranger (801)16.1Arranger Basics (801)16.1.1Navigating Song View (804)16.1.2Following the Playback Position in Your Project (806)16.1.3Performing with Scenes and Sections using the Pads (807)16.2Using Ideas View (811)16.2.1Scene Overview (811)16.2.2Creating Scenes (813)16.2.3Assigning and Removing Patterns (813)16.2.4Selecting Scenes (817)16.2.5Deleting Scenes (818)16.2.6Creating and Deleting Scene Banks (820)16.2.7Clearing Scenes (820)16.2.8Duplicating Scenes (821)16.2.9Reordering Scenes (822)16.2.10Making Scenes Unique (824)16.2.11Appending Scenes to Arrangement (825)16.2.12Naming Scenes (826)16.2.13Changing the Color of a Scene (827)16.3Using Song View (828)16.3.1Section Management Overview (828)16.3.2Creating Sections (833)16.3.3Assigning a Scene to a Section (834)16.3.4Selecting Sections and Section Banks (835)16.3.5Reorganizing Sections (839)16.3.6Adjusting the Length of a Section (840)16.3.6.1Adjusting the Length of a Section Using the Software (841)16.3.6.2Adjusting the Length of a Section Using the Controller (843)16.3.7Clearing a Pattern in Song View (843)16.3.8Duplicating Sections (844)16.3.8.1Making Sections Unique (845)16.3.9Removing Sections (846)16.3.10Renaming Scenes (848)16.3.11Clearing Sections (849)16.3.12Creating and Deleting Section Banks (850)16.3.13Working with Patterns in Song view (850)16.3.13.1Creating a Pattern in Song View (850)16.3.13.2Selecting a Pattern in Song View (850)16.3.13.3Clearing a Pattern in Song View (851)16.3.13.4Renaming a Pattern in Song View (851)16.3.13.5Coloring a Pattern in Song View (851)16.3.13.6Removing a Pattern in Song View (852)16.3.13.7Duplicating a Pattern in Song View (852)16.3.14Enabling Auto Length (852)16.3.15Looping (853)16.3.15.1Setting the Loop Range in the Software (854)16.4Playing with Sections (855)16.4.1Jumping to another Playback Position in Your Project (855)16.5Triggering Sections or Scenes via MIDI (856)16.6The Arrange Grid (858)16.7Quick Grid (860)17Sampling and Sample Mapping (862)17.1Opening the Sample Editor (862)17.2Recording Audio (863)17.2.1Opening the Record Page (863)17.2.2Selecting the Source and the Recording Mode (865)17.2.3Arming, Starting, and Stopping the Recording (868)17.2.5Using the Footswitch for Recording Audio (871)17.2.6Checking Your Recordings (872)17.2.7Location and Name of Your Recorded Samples (876)17.3Editing a Sample (876)17.3.1Using the Edit Page (877)17.3.2Audio Editing Functions (882)17.4Slicing a Sample (890)17.4.1Opening the Slice Page (891)17.4.2Adjusting the Slicing Settings (893)17.4.3Live Slicing (898)17.4.3.1Live Slicing Using the Controller (898)17.4.3.2Delete All Slices (899)17.4.4Manually Adjusting Your Slices (899)17.4.5Applying the Slicing (906)17.5Mapping Samples to Zones (912)17.5.1Opening the Zone Page (912)17.5.2Zone Page Overview (913)17.5.3Selecting and Managing Zones in the Zone List (915)17.5.4Selecting and Editing Zones in the Map View (920)17.5.5Editing Zones in the Sample View (924)17.5.6Adjusting the Zone Settings (927)17.5.7Adding Samples to the Sample Map (934)18Appendix: Tips for Playing Live (937)18.1Preparations (937)18.1.1Focus on the Hardware (937)18.1.2Customize the Pads of the Hardware (937)18.1.3Check Your CPU Power Before Playing (937)18.1.4Name and Color Your Groups, Patterns, Sounds and Scenes (938)18.1.5Consider Using a Limiter on Your Master (938)18.1.6Hook Up Your Other Gear and Sync It with MIDI Clock (938)18.1.7Improvise (938)18.2Basic Techniques (938)18.2.1Use Mute and Solo (938)18.2.2Use Scene Mode and Tweak the Loop Range (939)18.2.3Create Variations of Your Drum Patterns in the Step Sequencer (939)18.2.4Use Note Repeat (939)18.2.5Set Up Your Own Multi-effect Groups and Automate Them (939)18.3Special Tricks (940)18.3.1Changing Pattern Length for Variation (940)18.3.2Using Loops to Cycle Through Samples (940)18.3.3Using Loops to Cycle Through Samples (940)18.3.4Load Long Audio Files and Play with the Start Point (940)19Troubleshooting (941)19.1Knowledge Base (941)19.2Technical Support (941)19.3Registration Support (942)19.4User Forum (942)20Glossary (943)Index (951)1Welcome to MASCHINEThank you for buying MASCHINE!MASCHINE is a groove production studio that implements the familiar working style of classi-cal groove boxes along with the advantages of a computer based system. MASCHINE is ideal for making music live, as well as in the studio. It’s the hands-on aspect of a dedicated instru-ment, the MASCHINE hardware controller, united with the advanced editing features of the MASCHINE software.Creating beats is often not very intuitive with a computer, but using the MASCHINE hardware controller to do it makes it easy and fun. You can tap in freely with the pads or use Note Re-peat to jam along. Alternatively, build your beats using the step sequencer just as in classic drum machines.Patterns can be intuitively combined and rearranged on the fly to form larger ideas. You can try out several different versions of a song without ever having to stop the music.Since you can integrate it into any sequencer that supports VST, AU, or AAX plug-ins, you can reap the benefits in almost any software setup, or use it as a stand-alone application. You can sample your own material, slice loops and rearrange them easily.However, MASCHINE is a lot more than an ordinary groovebox or sampler: it comes with an inspiring 7-gigabyte library, and a sophisticated, yet easy to use tag-based Browser to give you instant access to the sounds you are looking for.What’s more, MASCHINE provides lots of options for manipulating your sounds via internal ef-fects and other sound-shaping possibilities. You can also control external MIDI hardware and 3rd-party software with the MASCHINE hardware controller, while customizing the functions of the pads, knobs and buttons according to your needs utilizing the included Controller Editor application. We hope you enjoy this fantastic instrument as much as we do. Now let’s get go-ing!—The MASCHINE team at Native Instruments.MASCHINE Documentation1.1MASCHINE DocumentationNative Instruments provide many information sources regarding MASCHINE. The main docu-ments should be read in the following sequence:1.MASCHINE Getting Started: This document provides a practical approach to MASCHINE viaa set of tutorials covering easy and more advanced tasks in order to help you familiarizeyourself with MASCHINE.2.MASCHINE Manual (this document): The MASCHINE Manual provides you with a compre-hensive description of all MASCHINE software and hardware features.Additional documentation sources provide you with details on more specific topics:▪Controller Editor Manual: Besides using your MASCHINE hardware controller together withits dedicated MASCHINE software, you can also use it as a powerful and highly versatileMIDI controller to pilot any other MIDI-capable application or device. This is made possibleby the Controller Editor software, an application that allows you to precisely define all MIDIassignments for your MASCHINE controller. The Controller Editor was installed during theMASCHINE installation procedure. For more information on this, please refer to the Con-troller Editor Manual available as a PDF file via the Help menu of Controller Editor.▪Online Support Videos: You can find a number of support videos on The Official Native In-struments Support Channel under the following URL: https:///NIsupport-EN. We recommend that you follow along with these instructions while the respective ap-plication is running on your computer.Other Online Resources:If you are experiencing problems related to your Native Instruments product that the supplied documentation does not cover, there are several ways of getting help:▪Knowledge Base▪User Forum▪Technical Support▪Registration SupportYou will find more information on these subjects in the chapter Troubleshooting.1.2Document ConventionsThis section introduces you to the signage and text highlighting used in this manual. This man-ual uses particular formatting to point out special facts and to warn you of potential issues. The icons introducing these notes let you see what kind of information is to be expected:This document uses particular formatting to point out special facts and to warn you of poten-tial issues. The icons introducing the following notes let you see what kind of information can be expected:Furthermore, the following formatting is used:▪Text appearing in (drop-down) menus (such as Open…, Save as… etc.) in the software and paths to locations on your hard disk or other storage devices is printed in italics.▪Text appearing elsewhere (labels of buttons, controls, text next to checkboxes etc.) in the software is printed in blue. Whenever you see this formatting applied, you will find the same text appearing somewhere on the screen.▪Text appearing on the displays of the controller is printed in light grey. Whenever you see this formatting applied, you will find the same text on a controller display.▪Text appearing on labels of the hardware controller is printed in orange. Whenever you see this formatting applied, you will find the same text on the controller.▪Important names and concepts are printed in bold.▪References to keys on your computer’s keyboard you’ll find put in square brackets (e.g.,“Press [Shift] + [Enter]”).►Single instructions are introduced by this play button type arrow.→Results of actions are introduced by this smaller arrow.Naming ConventionThroughout the documentation we will refer to MASCHINE controller (or just controller) as the hardware controller and MASCHINE software as the software installed on your computer.The term “effect” will sometimes be abbreviated as “FX” when referring to elements in the MA-SCHINE software and hardware. These terms have the same meaning.Button Combinations and Shortcuts on Your ControllerMost instructions will use the “+” sign to indicate buttons (or buttons and pads) that must be pressed simultaneously, starting with the button indicated first. E.g., an instruction such as:“Press SHIFT + PLAY”means:1.Press and hold SHIFT.2.While holding SHIFT, press PLAY and release it.3.Release SHIFT.Unlabeled Buttons on the ControllerThe buttons and knobs above and below the displays on your MASCHINE controller do not have labels.。
PlayStation 无线耳机说明书
For more instructions about the use of this product (including the Headset Companion app), visit /helpme.ENPrecautionsBefore using this product, carefully read this manual and any manuals for compatible hardware. Retain instructions for future reference.SafetyˎObserve all warnings, precautions, and instructions.ˎCHOKING HAZARD - Small parts. Keep out of the reach of small children.Use and handlingˎStop using the wireless headset immediately if you begin to feel tired or if you experiencediscomfort or pain in your head while operating the wireless headset. If the condition persists, consult a doctor.ˎAvoid prolonged use of the wireless headset. Take a break at about 30-minute intervals. ˎPermanent hearing loss may occur if the headset is used at high volume. Set the volume to asafe level. Over time, increasingly loud audio may start to sound normal but can actually be damaging your hearing. If you experience ringing in your ears or muffled speech, stop listening and have your hearing checked. The louder the volume, the sooner your hearing could be affected. To protect your hearing:ˋLimit the amount of time you use the headset at high volume. ˋAvoid raising the volume to block out noisy surroundings.ˋLower the volume if you can’t hear people speaking near you.ˎIf you feel that the headset is irritating your skin, stop using it immediately. ˎDo not expose the headset to high temperatures, high humidity or direct sunlight. ˎDo not put heavy objects on the headset.ˎDo not allow liquid or small particles to get into the headset.ˎDo not throw or drop the headset, or subject it to strong physical shock.ˎDo not place any rubber or vinyl materials on the headset exterior for an extended period oftime.ˎUse a soft, dry cloth to clean the headset. Do not use solvents or other chemicals. Do not wipewith a chemically treated cleaning cloth.ˎDo not disassemble or insert anything into the headset because this may cause damage to theinternal components or cause injury to you.ˎObserve all signs and instructions that require an electrical device or radio product to beswitched off in designated areas, such as gas/refueling stations, hospitals, blasting areas, potentially explosive atmospheres or aircraft.ˎThe battery used in this device may present a risk of fire or chemical burn if mistreated. Do notdisassemble, heat above 60 °C / 140 °F, or incinerate.Wireless headsetHeadset: CUHYA-0080Wireless Adaptor: CUHYA-0081Instruction Manual Part names and functionsPower/audio mode switchSets the audio mode or turns off headset.Positions:OFF - turns off the headset 1 - Standard Mode2 - Bass Boost Mode (default)This mode can be replaced with audio modes from the Headset Companion app.Adjusts the volume of the headset.MUTE buttonˎPress to switch microphone MUTE on and off. ˎTo engage the sidetone feature, hold down the MUTE button until a beep is heard. Then cycle through the sidetone volume settings (high, medium, off) by holding the MUTE button.Sidetone is a feature that allows you to hear your own voice from the headset. The sidetone volume is adjusted here, and not on the PS4™ system or other devices. When MUTE is on, the sidetone feature is turned off.L markingWhen the included audio cable is connected to the headset for use with mobile devices, the wireless function is turned off.Wireless adaptorReset button Status indicatorˎOn PlayStation®Vita systems, you can listen to audio in standard stereo formatand use the voice chat feature.ˎOn other mobile devices, you can listen to audio in standard stereo format only.HintsˎWhen the included audio cable is connected to the headset, the VSS (Virtual Surround Sound) button and the SOUND/CHAT buttons cannot be used. ˎOutput volume varies depending on the portable device that is connected. Adjust volume accordingly.ˎYou can use the supplied audio cable to connect the headset to your mobile device to listen to audio content and talk on the phone. ˋ I f you are unable to hear audio content using the cable with your mobile device, turn off headset power. ˋ Y our device may only support use of a standard audio cable (not included) to listen to audio content using the headset. Note that standard audio cables do not support voice communication. ˋ T his product is not compatible with all mobile devices. Some features may not work on all mobile devices.Charging the headsetWhen remaining battery level is low, the status indicator flashes red and a beep is heard. Charge the battery by connecting the headset to a supported USB device such as a PC. While the battery is charging, the status indicator lights up red. The status indicator light turns off when the battery is fully charged.HintsˎYou can view the remaining battery charge on a PS4™ system. It is shown on the status display that appears when you change the headset settings.ˎYou might not be able to charge the battery if the USB device or the USB hub does not provide enough power for charging. Try connecting the headset to a different USB device or a different USB connector on the device.ˎCharging takes approximately 3.5 hours when starting with no battery charge left. ˎWhen the remaining battery charge is low, the headset beeps while it is connected and receiving an audio signal.ˎIt is recommended that you charge the battery in an environment with atemperature of 5 °C - 35 °C / 41 °F - 95 °F. Charging in other environments might not be as effective.ˎIf you do not plan to use the wireless headset for an extended period of time, it is recommended that you fully charge it at least once a year to help maintain battery functionality.Status indicator displayHeadset1 F or repair options, visit /helpme.2 I f you see the flashing error light, retry the steps to Restore Headset again. If you continue to see the error after the Restore attempt, then visit /support/wirelessstereoheadset.Wireless adaptorInitial setup1 Charge the headset by connecting it to a USB port with a USB cable.The headset may need up to 3.5 hours to charge fully.2 Insert the wireless adaptor into the USB port.3 Slide the power switch on the headset to position “1” or “2”.Using the headset with PlayStation ®4 systemsThis headset is compatible with PS4™ system software version 5.00 or later. More than one headset can be used with a PS4™ system.Always update your system software to the latest version.Status displayWhen first connecting to a PS4™ system or when changing the settings, thefollowing status information is displayed in the upper left corner of the screen:Stereo Headset Audio Extension is a system setting that controls the type of audio output to the wireless headset. It is available only when the wireless adaptor is inserted.Audio output selectionWith the wireless headset you can listen to audio from the PS4™ system—including music, videos, and games—in Virtual Surround Sound.ˋYou can listen to both game audio and chat audio simultaneously.Use the SOUND/CHAT buttons to adjust the relative volume of game audio versus chat audio.ˋYou can change the audio output to the headset so that you can hear only chat audio.To change the audio output select (Settings)(Devices)[AudioDevices] [Output to Headphones]. NOTE:O n a PS4™ system, the wireless headset defaults to “ON” [All Audio].Using the headset with a computerYou can use the headset with a PC (with Windows® or macOS) that has a USB port. Insert the wireless adaptor into a USB port on the computer you want to use and then turn on the headset.HintsˎThe headset might not work with some computers.ˎThe VSS (Virtual Surround Sound) button and SOUND/CHAT buttons can be used only when the headset is connected to a PS4™ system .Using your headset with PlayStation ®VRYou can use an audio cable to connect your headset to the stereo headphone jack of PlayStation ®VR. This will output all game audio processed by the PlayStation ®VR,including 3D audio if supported by the game title.NoteThis headset only supports stereo or 7.1 virtual surround sound. 3D audio is supported on this headset only when plugged into the PS VR, while playing a PS VR game that supports 3D audio.Using the headset with a portable deviceYou can use an audio cable to connect your headset to the headphone jack of compatible devices.Headset Companion appWith the Headset Companion app, you can select an additional audio mode for your headset. There are several modes to choose from, each optimized to enhance different audio characteristics. These modes are developed exclusively for use with PS4™ systems.To get one of these audio modes, download the Headset Companion app from PlayStation™Store and follow the on-screen instructions.Once this process is complete, you can experience your selected mode on your headset by sliding the power/audio mode switch to position “2”.Resetting the headsetIf the headset does not respond when you try to operate it, reset it by doing the following:1Connect the wireless adaptor to a PS4™ system or other powered USB port.2 Insert a small pin or similar object (not included) into the hole surrounding the reset button in the wireless adaptor, and push in for at least one second.3 On the headset, hold down the MUTE button and the VSS button.4 While still holding down the MUTE button and the VSS button, slide thepower/audio mode switch to position “1” or “2”.Rating labelThe rating label contains specific model, manufacture and compliance information. It is located under the right earpad.To remove the earpad and access the rating label:1 Use one hand to hold the headset in place.2 With your other hand, grip the earpad frame.3 P ull the earpad out.To replace the earpad, align the earpad with the inner frame. Push it back onto the frame until it clicks.End of life product recyclingThe wireless headset is made of plastics, metals, and a lithium-ion battery. Follow localregulations when disposing of the wireless headset. Sony products can be recycled for free in the United States and Canada by dropping the product off at a number of nationwide locations. For details, visit /SonyInfo/csr/SonyEnvironment/spotlight/.VSS (Virtual Surround Sound) buttonThe Virtual Surround Sound effect is on by default. Press and hold for more than one second to turn the VSS on or off.繁體中文使用前須知事項使用本產品前,請先詳細閱讀本說明書及對應裝置的說明書,並妥善保存,以備將來參考之用。
管弦乐音色表及术语
管弦乐⾳⾊表及术语讨论黄⾦版管弦乐,附⾳⾊表及术语CELLOS⼤提琴VIOLAS⼩提琴VIOLINS中提琴CLARINTS单簧管,⿊管FLUTES长笛OBOES双簧管TROMBINES长号TRUMPETS军号FRENCHHORNS法国号DOUBLEBASSES低⾳提琴ALTOFLUTE⾼⾳长笛BASSCLARINET低⾳⿊管BASSOON低⾳管,巴颂管CELLO⼤提琴CLARINET竖笛CONCERFLUTE⾳乐会长笛CONTRABASSOON低⾳单簧管ENGLISHHORN英国管FRENCHHORN法国号HARP竖琴OBOE双簧管ORCHESTRALPERC交响乐中的打击乐PICCOLOFLUTE短笛TROMBONE长号TRUMPET⼩号TUBA⼤号VOLIN⼩提琴表现术语EWQLSO技巧与表情术语缩写:QUICK-快速的UPDN-提琴上、下分⼸SLOW-慢的SHORT(SHRT)-短促的EXP-有表现⼒的STAC-管乐断奏LEG-提琴的连⼸RIPS-圆号撕裂奏法SORD-柔美SLIDE-圆号滑⾳奏法ACCENT-重⾳SHAKE-圆号颤抖奏法LYR-抒情的LAY-圆号平缓奏法MARC-断⼸SMOOTH-圆号平滑奏法MART-短促⽽有⼒的断⼸(顿⼸)ADVENTURE-圆号冒险奏法(⾳头裂开,余⾳平缓)NON-VIB-不是很多的颤⾳MELLOW-柔美、温暖的奏法TREM-提琴⼸震⾳FLUTTER-长号烦躁、沙哑的奏法TRILL-指震⾳(分半⾳和全⾳)FALL-半⾳下滑奏法PIZZ-提琴拨奏GRACE-两个短促的半⾳奏法SPIC-提琴跳⼸HARD-⽣硬的奏法SUS-长⾳、持续⾳SOFT-柔软的奏法CLSTRA&AIR-⼩提琴上的怪异⾳GLISS-双簧管半⾳上⾏奏法PORT-次重⾳SLR(SLUR)-⼩号上怪异的奏法FORTE-极强⾳PIANO-微弱SFZ-强弱强CREC-强F就是Front--前置F,乐器前.C,舞台前.S,舞台观众席后⽅.C就是Center--中间S就是Sourround--环绕1,如何让其受MIDI控制器控制;2,如何在⼀轨中改变演奏法;3,如何去除混响声?。
机械专利翻译词汇三千个
garbage can 垃圾箱
garbage bag 垃圾袋
chain 链条
jack 升降机
production line 流水线
chain 链条槽
discoloration 羿色
water spots 水渍
polishing/surface processing 表面处理
exposed metal/bare metal 金属裸露
glove(s) 手套
glove(s) with exposed fingers 割手套
thumb 大拇指
forefinger 食指
midfinger 中指
ring finger 无名指
little finger 小指
barcode 条码
barcode scanner 条码扫描器
fuse together 熔合
fuse machine 热熔机
repair 修理
operator 作业员
QC 品管
supervisor 课长
not up to standard 不合规格
dimension/size is a little bigger 尺寸偏大(小)
cosmetic defect 外观不良
slipped screwhead/slippery screw head 螺丝滑头
slipped screwhead/shippery screw thread 滑手
speckle 斑点
mildewed=moldy=mouldy 发霉
rust 生锈
deformation 变形
DENON 收音环绕扩音机 AVR-3806 操作说明书
II
序言
序言
欢迎选购DENON AVR-3806数码环绕收音扩音机。经过我们的精心设计,本品能通过您的家庭影院音源,如DVD产生无与伦比的超值的环绕试听享 受,同时还能高保真地重现您所喜爱的音乐。 由于本品提供了阵容强大的功能,我们建议您在安装和使用前,请仔细阅读本说明书的内容。
目录
序言 附件 .....................................................2 使用前须知 ...............................................2 安装注意事项 .............................................3 操作注意事项 .............................................3 准备遥控器 ...............................................3 安装电池 .................................................3 遥控器的操作范围 .........................................3 部件名称与功能 前面板.................................................4 显示屏.................................................4 后面板.................................................5 遥控器.................................................5 简易设置与操作 简易设置流程 .............................................6 扬声器系统布置 ...........................................6 扬声器连接系统 ...........................................7 连接DVD播放机和电视监视器 ................................8 自动设置/视听室均衡器 ....................................9 连接麦克风............................................10 接通电源..............................................10 启动自动设置..........................................11 功率放大器分配........................................11 初步检测..........................................11,12 扬声器系统检测........................................12 检查检测结果......................................12,13 关于错误信息..........................................13 播放环绕声DVD ...........................................13 连接其它音源 电缆使用说明 ............................................14 视频转换功能 ............................................15 色差视频输出和HDMI输出的屏幕显示 ........................15 通过HDMI(高清晰度多媒体接口) 端子连接设备 [将模拟视频信号转换为HDMI信号] ..........................16 连接电视机(TV)调谐器 ....................................16 连接DBS调谐器 ...........................................16 连接外接输入(EXT.IN)端子 ................................17 连接摄像机或视频游戏 ....................................17 连接DVD录像机 ...........................................17 连接VCR .................................................18 连接CD播放机 ............................................18 连接普通唱盘 ............................................18 连接CD录音机或MD录音机 ..................................19 连接录音座 ..............................................19 DENON LINK连接..........................................19 通过HDMI(高清晰度多媒体接口)端子连接设备 ................20 连接天线端子 ............................................21 连接控制(CONTROL)端子 ...................................21 连接触发器输出(TRIGGER OUT)端子.........................21 连接多重区域(MULTI ZONE)端子............................22 区域(ZONE)2(或区域(ZONE)3)前置输出连接................22 区域(ZONE)2/区域(ZONE)3扬声器输出连接.................22 连接前置输出端子 ........................................23 连接电源线 ..............................................23 基本操作 播放 操作遥控器............................................24 播放输入音源..........................................25 使用外接输入(EXT.IN)端子播放..........................26 暂时关闭声音(静音)....................................26 通过耳机试听..........................................26 音像混合(视频选择(VIDEO SELECT))......................26 切换环绕扬声器........................................26 检查正在播放的节目....................................27 输入模式..........................................27,28 视听室均衡器(Room EQ)功能.............................28 环绕 不同音源的播放模式....................................29 播放音频源(CD和DVD) 2声道播放模式.........................................30 杜比数码模式和DTS环绕(只限数码输入)...............31,32
杰美乐 8020d 操作手册说明书
8020DQuick Setup Guide 2-3 Operating Manual 4-9Käyttöohje 10-15操作手册16-21General descriptionThe bi-amplified GENELEC 8020D is a compact two way active monitoring loudspeaker designed for near field monitoring, mobile vans, broadcast and TV control rooms, surround sound systems, home studios, multimedia applications and also for use with computer soundcards. As an active loudspeaker, it contains drivers, power amplifiers, active crossover filters and protection circuitry. The MDE™ (Minimum Diffraction Enclosure™) loudspeaker enclosure is made of die-cast aluminium and shaped to reduce edge diffraction. Combined with the advanced Directivity Control Waveguide TM (DCW TM), this design provides excellent frequency balance in difficult acoustic environments. If necessary, the bass response of the 8020D can be extended with a Genelec subwoofer.Positioning the loudspeakerEach 8020D is supplied with an integrated amplifier unit, mains cable and an operating manual. After unpacking, place the loudspeaker in its required listening position, taking note of the line of the acoustic axis. The axes of all loudspeakers should converge at ear height at the listening position (see Figure 1).ConnectionsBefore connecting up, ensure that the loudspeakers and the signal source have been switched off. The power switch of the 8020D is located on the back panel (see Figure 3). Connect the loudspeaker to an earthed mains connection with the supplied mains cable. Never connect the loudspeaker to an unearthed mains supply or using an unearthed mains cable. The mains input accepts a wide range of voltages: 100-240 V AC 50-60 Hz.Audio input is via a 10 kOhm balanced female XLR connector. An unbalanced source may be used as long as pin 3 is grounded to pin 1 at the unbalanced source connector (see Figure 2). Never connect the 8020D to the loudspeaker outputs of a power amplifier or an integrated amplifier or receiver.Once the connections have been made, the loudspeakers are ready to be switched on.ISS TM autostart functionWhen the power switch and the “ISS” switch on the back panel of the loudspeaker are set to “ON”, the Intelligent Signal Sensing TM (ISS TM) autostart function of the 8020D is active. Automatic powering down to standby mode happens after a certain time when playback has ended. The power consumption in standby mode is typically less than 0.5 watts. The playback will automatically resume once an input signal is detected from the source.There is a slight delay in the automatic powering up. If this is undesirable, the ISS TM function can be disabled by setting the “ISS” switch on the back panel to the “OFF” position. In this mode, the monitor is powered on and off using the power switch on the back panel.Sensitivity controlThe input sensitivity of the 8020D can be matched to the output of the signal source by adjusting the rotary sensitivity control on the back panel.Setting the tone controlsThe frequency response of the Genelec 8020D can8020D Active Monitoring System Operating Manual4 EnglishEnglish 5be adjusted to match the acoustic environment by setting the tone control switches on the rear panel. The controls are “Desktop 200 H z”, “Treble Tilt”, “Bass Tilt” and “Bass Roll-Off”. An acoustic measuring system is recommended for analyzing the effects of the adjustments, however, careful listening with suitable test recordings can also lead to good results. Table 1 shows some examples of typical settings in various situations. Figure 4 shows the effect of the controls on the anechoic response.Desktop 200 HzThe desktop low frequency control (Switch 2) attenuates the bass frequencies around 200 Hz by 4 dB. This feature is designed to compensate for the boost often occurring at this frequency range when the loudspeaker is placed upon a meter bridge, table or similar reflective surface.Treble TiltTreble Tilt control (switch 3) attenuates the treble response of the loudspeaker at frequencies above 5 kHz by 2 dB, which can be used for smoothening down an excessively bright sounding system.Bass TiltBass Tilt control offers three attenuation levels for the bass response of the loudspeaker below 2 kHz, usually necessary when the loudspeakers are placed near a wall or other room boundaries. The attenuation levels are -2 dB (switch 6 “ON”), -4 dB (switch 7 “ON”) and -6 dB (both switches “ON”).Bass Roll-OffBass Roll-Off (switch 4) activates a -4 dB filter to thelowest bass frequencies (65 Hz). This can be used for6 Englishcompensating excessively heavy bass reproduction typically caused by loudspeaker placement near room boundaries.The factory setting for all tone controls is “OFF” to give a flat anechoic response. Always start adjustment by setting all switches to “OFF” position. Measure or listen systematically through the different combinations of settings to find the best frequency balance.Mounting considerationsAlign the loudspeakers correctlyAlways place the loudspeakers so that their acoustic axes (see figure 1) are aimed towards the listening position. Vertical placement is preferred, as it minimises acoustical cancellation problems around the crossover frequency.Maintain symmetryCheck that the loudspeakers are placed symmetrically and at an equal distance from the listening position. If possible, place the system so that the listening position is on the centerline of the room and the loudspeakers are placed at an equal distance from the centerline. Minimise reflectionsAcoustic reflections from objects close to theloudspeakers like desks, cabinets, computer monitors etc. can cause unwanted colouration of the sound image. This can be minimised by placing the loudspeaker clear of reflective surfaces. For instance, putting the loudspeakers on stands behind and above the mixing console and tilting them down to point the acoustic axes to ear level at the listening position usually gives a better result than placing the loudspeakers on the meter bridge.Minimum clearancesSufficient clearance for cooling of the amplifier and functioning of the reflex port must be ensured if the loudspeaker is installed in a restricted space such as a cabinet or integrated into a wall structure. The surroundings of the loudspeaker must always be open to the listening room with a minimum clearance of 3 centimeters (13/16”) behind, above and on both sides of the loudspeaker. The space adjacent to the amplifier must either be ventilated or sufficiently large to dissipate heat so that the ambient temperature does not rise above 35 degrees Celsius (95°F .)Mounting optionsThe Genelec 8020D offers several mounting options: The Iso-Pod™ (Isolation Positioner/Decoupler™) vibration insulating table stand allows tilting theloudspeaker for correct alignment of the acousticTable 1: Suggested tone control settings for differing acoustical environmentsLoudspeaker Mounting Position Desktop Treble Tilt Bass Tilt Bass Roll-OffFlat anechoic responseOFF OFF OFF OFF Free standing in a damped room OFF OFF OFF OFF Free standing in a reverberant room OFF OFF -2 dB OFF Near field or console bridge ON OFF OFF OFF Near to a wall OFF OFF -4 dB OFF On a deskONOFF-2 dBOFFaxis. On the base of the loudspeaker is a 3/8 in UNC threaded hole compatible with a standard microphone stand. On the rear there are two M6x10 mm threaded holes for wall or ceiling brackets or the keyhole wall mount adapter provided with the loudspeaker.MaintenanceNo user serviceable parts are to be found within the loudspeaker. Any maintenance or repair of the 8020D must only be undertaken by qualified service personnel.Safety considerationsAlthough the 8020D has been designed in accordance with international safety standards, the following warnings and cautions should be observed to ensure safe operation and to maintain the loudspeaker under safe operating conditions:• Servicing and adjustment must only be performed by qualified service personnel. The loudspeakermust not be opened.• Do not use the loudspeaker with an unearthed mains cable or an unearthed mains connection as this may compromise electrical safety.• Do not expose the loudspeaker to water or moisture. Do not place any objects filled withliquid, such as vases on the loudspeaker or near it. • This loudspeaker is capable of producing sound pressure levels in excess of 85 dB, which maycause permanent hearing damage.• Free flow of air behind the loudspeaker is necessary to maintain sufficient cooling. Do notobstruct airflow around the loudspeaker.• Note that the amplifier is not completelydisconnected from the AC mains service unless themains power cord is removed from the amplifier orthe mains outlet.GuaranteeThis product is guaranteed for a period of two years against faults in materials or workmanship. Refer to supplier for full sales and guarantee terms.Compliance to FCC rulesThis device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:This device may not cause harmful interference, and this device must accept any interference received, including interference that may cause undesired operation.Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:• Reorient or relocate the receiving antenna.• Increase the separation between the equipment and receiver. • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.• Consult the dealer or an experienced radio/TV technician for helpModifications not expressly approved by the manufacturer could void the user’s authority to operate the equipment under FCC rules.English 78 EnglishEnglish 9AMPLIFIER SECTIONBass amplifier output power: 50 W Treble amplifier output power: 50 W Long term output power is limited by driver unit protection circuitry._____________________________________________ Amplifier system distortion at nominal output: T H D < 0.05 % _____________________________________________ Mains voltage: 100-240 V AC, 50-60 Hz Voltage operating range:±10 %Power consumption: Idle3 W Standby <0.5 WFull output60 WSYSTEM SPECIFICATIONSLower cut-off frequency, –6 dB: < 56 Hz _____________________________________________Upper cut-off frequency, –6 dB: > 25 kHz _____________________________________________Accuracy of frequency response (± 2.5 dB): 62 Hz – 20 kHz _____________________________________________Maximum short term sine wave acoustic output on axis in half space, averaged from 100 Hz to 3 kHz: at 1 m > 100 dB SPL _____________________________________________Maximum long term RMS acoustic output in same conditions with IEC weighted noise (limited by driver unit protection circuit): at 1 m > 93 dB SPL _____________________________________________Maximum peak acoustic output per pair, at 1 m distance with music material: > 107 dB _____________________________________________Self generated noise level in free field at 1 m on axis: < 5 dB (A-weighted)_____________________________________________Harmonic distortion at 85 dB SPL at 1 m on axis: Freq: 50…200 Hz < 3 % >200 Hz < 0.5 %_____________________________________________Drivers: Bass 105 mm (4 in) cone Treble 19 mm (3/4 in) metal dome Both drivers are magnetically shielded_____________________________________________Weight: 3.2 kg (7.0 lb)_____________________________________________Dimensions: Height 242 mm (91/2 in) (including Iso-Pod™ table stand)H eight 230 mm (91/16 in) (without Iso-Pod™ table stand)Width 151 mm (6 in)Depth 142 mm (55/8 in)CROSSOVER SECTIONInput connector: Input: XLR female, balanced 10 kOhm,pin 1 gnd, pin 2 +, pin 3 -_____________________________________________Input level for 100 dB SPL output at 1 m: -6 dBu at volume control max _____________________________________________Sensitivity control range relative to max output: -12 dB (constantly variable) _____________________________________________Crossover frequency, Bass/Treble: 3.0 kHz _____________________________________________Treble tilt control operating range: 0 to –2 dB at 15 kHz _____________________________________________Desktop 200 Hz control: -4 dB at 200 Hz _____________________________________________Bass roll-off control: -4 dB at 65 Hz _____________________________________________Bass tilt control operating range in –2 dB steps: 0 to –6 dB at 100 Hz _____________________________________________The ‘CAL’ position is with all tone controls set to ‘off’ and the input sensitivity control to maximum (fully clockwise).YleistäGENELEC 8020D on pienikokoinen, mutta erittäin suo-rituskykyinen aktiivikaiutin. Se soveltuu lähikenttämo-nitoriksi äänitysstudioihin, ulkolähetysautoihin, radio– ja TV–lähetysten äänen tarkkailuun, julkisiin tiloihin, installaatioihin, kotistudioihin, multimediatuotantoon, tietokoneiden audiojärjestelmiin ja kotiteattereihin. Kai-uttimeen on integroitu päätevahvistimet, säädettävä aktiivinen jakosuodin ja kaiutinelementtien ylikuormi-tussuojauspiirit. Uusi Minimum Diffraction Enclosure™ (MDE™)–kotelorakenne ja edelleen kehitetty Directivity Control Waveguide™ (DCW™)–suuntain takaavat tasa-painoisen toiston vaikeissakin akustisissa ympäristöis-sä. Tarvittaessa 8020D:n bassotoistoa voidaan tukea Genelec-subwooferilla.LiitännätKaiuttimien mukana toimitetaan suojamaadoitetut verk-kovirtajohdot. Älä kytke kaiutinta suojamaadoittamatto-maan pistorasiaan.Ennen kuin teet mitään kytkentöjä, varmista, että kai-kista laitteista on kytketty virta pois. Kaiuttimen virtakytkin on sijoitettu liittimien väliin kaiuttimen takalevyyn. Audio-signaalia varten kaiuttimissa on balansoitu 10 kOhm:in XLR–liitin, johon äänilähteeltä tuleva signaalijohto kytke-tään. Ellei äänilähteessä ole balansoitua antoliitäntää, voi-daan käyttää kuvan 2 mukaisesti kytkettyä signaalijohtoa. Genelec 8020D–aktiivikaiuttimet saa kytkeä ainoas-taan linjatasoista signaalia antavaan äänilähteeseen, ei milloinkaan päätevahvistimen tai integroidun vahvisti-men kaiutinliittimiin.Kytke virta päälle kun kaikki liitännät on tehty.8020DAktiivikaiutin10 SuomiAutomaattinen virrankytkentä (ISS TM Autostart)Kun kaiuttimen takapaneelissa oleva ”ISS”-kytkin on asennossa ”ON”, kaiuttimen automaattinen virrankyt-kentä on käytössä. Tällöin kaiutin tunnistaa siihen syö-tetyn äänisignaalin ja kytkeytyy päälle automaattisesti. Vastaavasti kaiutin menee valmiustilaan, kun signaalin päättymisestä on kulunut noin tunti. Valmiustilassa kai-uttimien tehonkulutus on alle 0,5 W. Automaattisessa käynnistymisessä on pieni viive. Jos tämä ei ole hyväksyttävää, automaattinen vir-rankytkentä voidaan poistaa toiminnasta kääntämäl-lä ”ISS”-kytkin kaiuttimen takapaneelissa asentoon ”OFF.” Tällöin kaiutin käynnistyy ja sammuu ainoas-taan virtakytkintä käyttäen.Herkkyyden säätöKaiuttimen ottoliitännän herkkyys (äänenvoimakkuus) voidaan säätää sopivaksi takapaneelissa olevalla sää-timellä (kuva 3).Taajuusvastesäätöjen käyttöKaiuttimen taajuusvastetta voidaan muokata kuun-telutilan akustisista ominaisuuksista ja kaiuttimien sijoituksesta johtuvien toistovirheiden kompensoi-miseksi. Säätö tehdään kaiuttimen takapaneelissa olevien ”Desktop 200 Hz”-, “Treble tilt”–, “Bass tilt”– ja “Bass roll–off”–kytkimien avulla. Kaikki säädöt on asetettu tehtaalla asentoon “OFF”, mikä antaa tasai-sen taajuusvasteen kaiuttomassa tilassa. Säätöjen vaikutus toistovasteeseen on esitetty kuvassa 4.Suomi 1112 SuomiSuosittelemme akustisen mittausjärjestelmän (esim. WinMLS) käyttöä kaiuttimien säätämisessä. Ellei täl-laista ole käytettävissä, säätö voidaan tehdä myös korvakuulolta sopivia testiäänitteitä ja -signaaleja hy-väksikäyttäen. Taulukko 1 sisältää muutamia suuntaa-antavia säätöesimerkkejä. Kaiuttimien sijoitus ja akusti-nen ympäristö vaikuttaa ratkaisevasti säätötarpeeseen, joten säätöön kannattaa ryhtyä vasta kun kuuntelutilan järjestys on saatu lopulliseen muotoonsa.Desktop 200 HzDesktop-säätö (kytkin 2) aktivoi 4 dB:n vaimennuksen 200 hertsin kohdalle kompensoimaan äänipöydän, pöy-tätason tai muun kaiuttimen ja kuuntelijan välissä sijaitse-van vaakasuoran tason aiheuttaman korostuman.Treble tiltTreble tilt–säätö (kytkin 3) vaimentaa kaiuttimen diskant-titoistoa 5 kHz:n yläpuolella 2 dB, mitä voidaan käyttää liian kirkkaalta tuntuvan toiston korjaamiseen.Bass tiltBass tilt–säädön avulla voidaan vaimentaa kaiuttimen bassotoistoa 2 kHz:n alapuolella. Tämä on usein tarpeen,kun kaiutin sijoitetaan lähelle seinää tai muuta rajapintaa. Vaimennustasoja on kolme: –2 dB (kytkin 6 “ON”), –4 dB (kytkin 7 “ON”) ja –6 dB (kytkimet 6 ja 7 “ON”).Bass roll–offBass roll–off–säätö (kytkin 4) aktivoi 4 desibelin vai-mennuksen alimmille taajuuksille (65 Hz). Tätä voidaan käyttää seinän tai muun rajapinnan aiheuttaman basso-korostuksen vaimentamiseen.Kaiuttimien sijoitusKohdista kuuntelupisteeseenSuuntaa kaiuttimet kuuntelualueen keskipisteeseen pään korkeudelle. Suuntaus on tehty oikein, kun kaik-kien kaiuttimien akustiset akselit (kuva 1) leikkaavat kuuntelupisteessä. Kaiuttimet kannattaa sijoittaa pysty-asentoon, sillä se minimoi vaihevirheet jakotaajuudella.Sijoita symmetrisestiSijoita kaiuttimet samalle etäisyydelle kuuntelupistees-tä ja mahdollisimman symmetrisesti sekä toistensa, että huoneen rajapintojen suhteen. Tämä toteutuu, kun kuuntelupiste on huoneen keskilinjalla ja kaiuttimet sijoi-tetaan symmetrisesti keskilinjan suhteen.Taulukko 1: Suositeltavat taajuusvastesäätimien (tone control) asetukset kaiuttimien sijoituksen mukaanKaiuttimien sijoitus Desktop Treble tilt Bass tilt Bass roll–offKaiuttomassa tilassaOFF OFF OFF OFF Vapaasti seisovana vaimennetussa tilassa OFF OFF OFF OFF Vapaasti seisovana kaikuvassa tilassa OFF OFF –2 dB OFF Lähikentässä, heijastavan tason päälläON OFF –4 dB OFF Lähellä seinääOFF OFF –6 dB OFF Pöydän tai muun tason päälläONOFF-2 dBOFFMinimoi heijastuksetKaiuttimen lähellä sijaitsevista esineistä ja pinnoista tulevat akustiset heijastukset voivat aiheuttaa toiston värittymistä ja sumentaa äänikuvaa. Tämä kannattaa ottaa huomioon kaiuttimia sijoitettaessa ja mahdollisuuksien mukaan siir-tää heijastuksia aiheuttavat tietokoneen näytöt, kaapit tms. pois kaiuttimien läheltä. Kaiuttimet tulee sijoittaa mahdolli-simman kauas heijastuksia aiheuttavista pinnoista. T ark-kailukaiuttimia ei esimerkiksi kannata sijoittaa äänipöydän päälle, vaan riittävän korkeille lattiajalustoille äänipöydän taakse, josta ne voidaan suunnata alas äänitarkkailijaa kohti.VähimmäisetäisyydetVahvistimien jäähdytyksen ja refleksiputken toimin-nan takaamiseksi pitää kaiuttimien taakse, sivuille ja päälle jäädä kuunteluhuoneeseen avautuva, vähintään kolmen senttimetrin vapaatila. Kaiutinta ei saa käyttää tilassa, jonka lämpötila on yli 35° C.Pöytäjalusta ja kiinnitysmahdollisuudetKaiuttimien mukana toimitettava Isolation Positioner/De-coupler™ (Iso-Pod™) -jalusta mahdollistaa kaiuttimen kallistamisen ylä- tai alaviistoon. Genelec 8020D voidaan kiinnittää Omnimount® Series 20.5–kaiutintelineisiin kaiu-tinkotelon takaseinässä olevien M6x10 -mutterikierteiden avulla. Kotelon pohjassa on 3/8 in UNC -mutterikierre, jolla kaiutin voidaan kiinnittää mikrofonitelineeseen.TurvallisuusohjeitaGenelec-aktiivikaiuttimet on suunniteltu ja valmistettu täyttämään kansainväliset turvallisuusnormit. Virheellisestä käytöstä saattaa kuitenkin seurata vaaratilanne, joten seuraavia ohjeita on aina noudatettava:• Laitetta ei saa asettaa alttiiksi kosteudelle tai roiskevedelle. Se on tarkoitettu käytettäväksiainoastaan kuivassa huonetilassa.• Huolto- ja korjaustoimia saa suorittaa vain valmistajanvaltuuttama huoltohenkilöstö.• Älä avaa kaiutinkoteloa tai irrota laitteesta mitään osia.• Laitteen saa kytkeä ainoastaan maadoitettuunpistorasiaan.• Huomaa, että kaiutin ei ole täysin jännitteetön ellei virtajohtoa ole irrotettu pistokkeesta.VAROITUS!Genelec 8020D-aktiivikaiuttimet pystyvät tuottamaan yli 85 desibelin äänenpaineen, mikä voi aiheuttaa pysyvän kuulovaurion.HuoltoKaikki huolto- ja korjaustoimet on annettava valmistajan tai valmistajan valtuuttaman huoltohenkilöstön suoritettaviksi. Älä avaa laitetta itse.TakuuGenelec Oy antaa tuotteilleen kahden vuoden takuun ostopäivästä lukien. Takuu kattaa valmistusvirheet ja materiaaliviat.Suomi 1314 SuomiSuomi 15VAHVISTIMETBassoelementin vahvistimen teho: 50 W Diskanttielementin vahvistimen teho: 50 W Kaiutinelementtien suojauselektroniikka rajoittaa vahvistimien jatkuvaa tehoa ._____________________________________________ Vahvistimien särö nimellisteholla:THD < 0,05 % _____________________________________________ Kohinaetäisyys täydellä teholla:Basso > 95 dB Diskantti > 95 dB ____________________________________________Käyttöjännite: 100-240 V AC 50-60 Hz Sallittu jännitteen vaihtelu: ±10 %Tehonkulutus:Ilman kuormaa 3 W Valmiustilassa (ISS) <0,5 W Maksimikuormalla 60 WTEKNISET TIEDOTAlarajataajuus, –6 dB: < 56 Hz _____________________________________________Ylärajataajuus, –6 dB: > 25 kHz _____________________________________________Taajuusvaste vapaakentässä: 62 Hz – 20 kHz (± 2,5 dB)_____________________________________________Hetkellinen maksimiäänenpaine mitattuna sinisignaalilla puoliavaruuteen. Keskiarvo taajuusalueella 100 Hz...3 kHz: @ 1 m > 100 dB SPL _____________________________________________Suurin jatkuva (RMS) äänenpaine IEC-painotetulla kohinalla mitattuna (elementtien suojapiirin rajoittama): @ 1 m > 93 dB SPL _____________________________________________Kaiutinparin tuottama äänenpaineen huippuarvo (peak) musiikkimateriaalilla 1 metrin mittausetäisyydellä: > 107 dB _____________________________________________Akustinen pohjakohinataso 1 m:n etäisyydellä: < 10 dBA _____________________________________________Harmoninen särö 85 dB 1m mittausakselilla::Taajuus: 50…100 Hz < 3 % >100 Hz < 0.5 %_____________________________________________Kaiutinelementit: Basso 105 mm (4 in) kartio Diskantti 19 mm (3/4 in) metallikalotti Molemmat elementit ovat magneettisuojattuja_____________________________________________Paino: 3,2 kg (7.0 lb)_____________________________________________Mitat K orkeus 242 mm (91/2 in) (mukaanlukien Iso–Pod™ pöytäjalusta) Korkeus 230 mm (91/16 in) (ilman Iso–Pod™ pöytäjalustaa)Leveys 151 mm (6 in)Syvyys 142 mm (55/8 in)JAKOSUODINOttoliitin: XLR naaras, balansoitu 10 kOhmnapa 1 maa, napa 2 +, napa 3 –_____________________________________________Tarvittava signaalitaso 100 dB SPL äänenpaineen tuottamiseen 1 m:n mittausetäisyydellä:–6 dBu herkkyyssäädön maksimiasetuksella _____________________________________________Herkkyyssäätimen vaikutus (vaimennusmaksimiäänenpaineesta): –12 dB (liukuva) _____________________________________________Jakotaajuus: 3,0 kHz _____________________________________________Treble tilt-säädön vaikutus: 0 ... –2 dB @ 15 kHz _____________________________________________Desktop 200 Hz-säädön vaikutus:0 ... –4 dB @ 200 Hz _____________________________________________Bass roll–off-säädön vaikutus: -4 dB @ 65 Hz _____________________________________________Bass tilt-säädön vaikutus: 0, -2, -4 tai -6 dB @ 100 Hz _____________________________________________Säätimien ‘CAL’ asento: Kaikki tajuusvastesäätimetasennossa “off” ja herkkyyden säätö maksimiasennossa.16 China概述8020D 是一款紧凑型有源监听音箱,它适用于近场监听、移动转播车、电视台控制室。
SL Loudspeaker 52 A W 产品说明说明书
FEATURESActive loudspeaker with inbuilt power supplyOptimized for speech intelligibilityIntegrated DSP with frequency adjust-ments and high pass filterAuto sleep modeFlexible wallmount included in deliveryARCHITECT’S SPECIFICATIONSSL Loudspeaker 52 A WThe loudspeaker shall be optimized for speech intelligibility and shall be suitable for meeting rooms with up to 16 partici-pants on site.The loudspeaker shall feature two input sockets for connecting audio signals: one balanced input terminal (e.g. Phoenix Con-tact MC 1.5/3-ST-3.5 or similar) and one unbalanced RCA input.The loudspeaker shall feature three 3-posi-tion adjustment switches for adjusting its high, medium and low frequency levels for optimum sound quality depending on the mounting position and the room charac-teristics. The loudspeaker‘s high pass filter shall be adjustable to 50 Hz, 70 Hz or 100 Hz. The input sensitivity shall be selectable between −6 dBu, 0 dBu or +10 dBu. Input impedance (balanced and unbalanced) shall be > 10 k O.TECHNICAL DATAACOuSTICSFrequency response ± 3 dB .................................53 − 30,000 Hz Max. SPL at 1 m (150 − 5,000 Hz) .....................97 dB SPLTHD at 90 dB SPL at 1 m > 200 Hz ....................< 1 % ELECTROnICSnominal output power woofer ............................40 WRMS at 1 % THD(with deactivated limiter)nominal output power tweeter ...........................40 WRMS at 1 % THD(with deactivated limiter)THD + n vs. frequency at 1 W output ................0.16 %SnR at 1 kHz ............................................................95 dBCMRR ..........................................................................71 dBCrossover frequency ...............................................4.5 kHzSlope low pass woofer ...........................................12 dB/oct. (2nd order) Slope high pass tweeter ........................................24 dB/oct. (4th order) Resonance frequency high pass woofer ............55 Hz; 75 Hz; 100 Hz Slope high pass woofer ........................................24 dB/oct. (4th order)SL Loudspeaker 52 A W2Bass reflex portContinued on page 2 Continued on page 2The loudspeaker shall have a frequency response (+-3 dB) of 53 – 30,000 Hz. Ma-ximum sound pressure level at 1 m (150 to 5,000 Hz) shall be 97 dB SPL. THD at 90 dB SPL at 1 m > 200 Hz shall be < 1 %. nominal output power of the woofer and the tweeter (RMS at 1% THD and with deactivated limiter) shall be 40 W, respec-tively. THD plus noise vs. frequency at 1 W output power shall be 0.16 %. Signal-to-noise ratio at 1 kHz shall be 95 dB. Com-mon mode rejection ratio shall be 71 dB. The loudspeaker shall operate on 100−240 V AC, 50 – 60 Hz. The loudspeaker shall have an On/OFF power switch and shall feature a second switch for activating/ deactivating the auto standby mode.If enabled, the auto standby mode shall become active after 20 minutes without audio signal.The loudspeaker shall have a housing with pre-drilled mounting points and shall be supplied complete with a wall mounting kit (consisting of a wall bracket, a loudspeaker bracket, 2 spacers, a safety wire, screws and anchors).The loudspeaker’s dimensions shall be approximately 240mm x 140mm x 161mm (9.45" x 5.51" x 6,34"); its weight shall be approximately 3.1kgThe loudspeaker shall be the Sennheiser SL Loudspeaker 52 A W.TECHNICAL DATAPOSITIOn ADJuSTMEnTSHF ................................................................................ f = 2800 Hz, Gain +1.4dBflatf = 2800 Hz, Gain −1.5dBMF ............................................................................... fl atf = 100 Hz, Gain −2.7dBf = 230 Hz, Gain −3.7dBLF ................................................................................ fl atf = 800 Hz, Gain −2.0dB, 6dB Lowshelff = 800 Hz, Gain −4.0dB, 6dB Lowshelf Input sensitivity at 97 dB SPL .............................. S witch positions−6 dBu0 dBu10 dBuSwitch−on level switch–on automatics .............1.4 mVRMSAuto standby ...........................................................20 minInput impedance: .................................................... b alanced > 10 k Ounbalanced > 10 k OPRODuCT PROPERTIESPower consumption (standby) ............................ 230 V AC; 0.47 W /110 V AC; 0.34 WPower consumption (idle) .................................... 230 V AC; 4.75 W /110 V AC; 4.53 WPower consumption (max) ................................... 230 V AC; 95 W /110 V AC; 91 WDimensions (H x W x D) .........................................240mm x 140mm x 161mm Weight .......................................................................3.1 kgMounting points ...................................................... 2 x M6 on rear panel with depth10mmDELIVERY INCLUDES1 SL Loudspeaker 52 A W1 SpeakerMount 1001 wall bracket1 loudspeaker bracket2 spacers1 set of safety wire, screws and anchors1 quick guide1 safety guideThe mains cable is not included in the delivery.Mains cables with different lengths and for different countries are available as an accessory.Sennheiser electronic GmbH & Co. KG Am Labor 1, 30900 Wedemark, Germany 0 1 / 1 4 S e n n h e i s e r i s a r e g i s t e r e d t r a d e m a r k o f S e n n h e i s e r e l e c t r o n i c G m b H & C o . K G . w w w . s e n n h e i s e r . c o m . C o p y r i g h t ©0 5 / 2 0 1 3 . A l l r i g h t s r e s e r v e d . E r r o r s a n d o m i s s i o n s e x c e p t e d .。
PIONEER 音频扬声器系统说明书
BEFORE OPERATIONThank you for buying this PIONEER product.Read the Instruction Manual carefully before using this speaker system so that you can operate it properly. After you have finished, put this manual away in a safe place for future reference.The rated impedance of this speaker system is 6 . It must be connected to a amplifier which accepts this type of load (miminum and maximum impedancesaccepted by the amplifier are generally indicated near the loudspeaker outlets: for example "4 -16 " or "6 -16 ").To guard against damage to this speaker system due to an electric power overload, take the following precautions:system (see Specifications).Any connection or switching on or off of part of the audio system (CD player, tuner etc.) must be carried out after switching off the amplifier or at least with the loudspeaker outlets disconnected (if the amplifier allows). Interference caused by these operations will otherwise reach the speaker and may damage the treble loudspeaker units.and treble correctors, make sure that you do not increase the amplifier volume excessively, as the speaker will be overloaded more quickly.harmonic distortion increases rapidly in this situation and may pose a danger to the treble speaker units.Avoid touching the diaphragms and suspensions of speakers units as they arefragile.CONNECTIONSSwitch off the amplifier power supply (OFF).Connect the cables to the input terminals on the rear of the speaker: Connectthe neutral cable to the terminal and the live cable to the terminal. Do not+REMARKS :Check that the cables are securely connected to the terminals. A loose connection may cause not just intermittent or distorted sound but short-circuiting and breakdown of the amplifier.If the cables of one of the speakers have been connected with the wrong polarities, you will find when listening to a stereo recording that bass sounds are weakened and the stereo effect normally obtained between the two speakers does not exist.the live cable to the terminal and the neutral cable to the terminal. +ADVICES AND PRECAUTIONS :For optimum sound reproduction of high frequencies, the treble speaker units must be at the same height as the listener's ears.For low frequencies, it is possible to increase the level of bass sounds by positioning the speakers close to a wall (the maximum increase being obtained for a position in a corner of the listening room).INSTALLATIONDo not install the speakers close to an oven or heating appliance. Avoid exposing them to direct sunlight. High temperatures can distort the structure of the enclosure and adversely affect the sound.This speaker system is heavy and fragile, and it is therefore dangerous to install it in an unstable position.Speaker System Operating InstructionsCAUTION : INSTALLATIONDo not place the speaker on an unstable surface. It could present a hazard if it falls, as well as damaging the equipment. If placing the speaker on a thick carpet, we recommend using the supplied speaker spikes for stability.Switch off and unplug your AV equipment and consult the instructions when connecting up components. Make sure you use the correct connecting cables.Do not put a TV or other AV equipment on top of this speaker. It could present a hazard if it falls, as well as damaging the equipment.Do not install your speakers overhead on the ceiling or wall. If improperly attached, the speaker grille can fall and cause damage or personal injury.Do not attach these speakers to the wall or ceiling. They may fall off and cause injury.CAUTION : IN USEDo not use the speaker to output distorted sound for long periods of times. This can result in a fire hazard.Do not sit or stand on the speaker, or let children play on the speaker.Do not put large or heavy objects on top of the speaker.PIONEER CORPORATION4-1, Meguro 1-Chome, Meguro-ku, Tokyo 153-8654, JapanPIONEER ELECTRONICS (USA) INC.P.O. BOX 1540, Long Beach, California 90810-1540, U.S.A. TEL: (800) 421-1404PIONEER ELECTRONICS OF CANADA, INC.300 Allstate Parkway, Markham, Ontario L3R OP2, Canada TEL: 1-877-283-5901PIONEER EUROPE NVHaven 1087, Keetberglaan 1, B-9120 Melsele, Belgium TEL: 03/570.05.11PIONEER ELECTRONICS ASIACENTRE PTE. LTD.253 Alexandra Road, #04-01, Singapore 159936 TEL: 65-6472-7555PIONEER ELECTRONICS AUSTRALIA PTY. LTD.178-184 Boundary Road, Braeside, Victoria 3195, Australia, TEL: (03) 9586-6300PIONEER ELECTRONICS DE MEXICO S.A. DE C.V.Blvd.Manuel Avila Camacho 138 10 piso Col.Lomas de Chapultepec, Mexico,D.F. 11000 TEL: 55-9178-4270K002_A_EnPrinted in China <SRD6059-A>REMEMBERReal, natural wood is used in the construction of the speaker system cabinets. They feature a wonderful color and depth that is much more attractive than plastic veneers and similar materials.No two pieces of natural wood are exactly alike. Keep this point in mind as you enjoy these speakers.2006 Pioneer Corporation.All reproduction and translation rights reserved.c REMARK : The specifications and design of this product are subject to change without notice, in the interests of improvements.Speaker units :SPECIFICATIONSSpeaker ....................................................................... Bookshelf type, bass-reflex (magnetically shielded)System ............................................................................. 2 ways, 2 speaker units Woofer........................................................... Cone type, 130 mmTweeter ......................................................... Dome type, 25 mmNominal Impedance ........................................................................................ 6Frequency range ...................................................................... 50 Hz - 50 000 Hz Sensitivity ....................................................................... 88 dB/W at 1m distance Maximum power ......................................................................................... 130 W ........................................190 (W) mm x 350 (H) mm x 300 (D) mm Weight ........................................................................................................ 7.3 kg Dimensions :MAINTENANCE OF THE ENCLOSUREUse a cloth to wipe away dust and dirt.If the enclosure is very dirty, wipe with a soft cloth dipped in a neutral detergent diluted five to six times with water, then wipe again with the dry cloth. Do not use thinner, benzene, cleaning sprays or other chemical products on or near the enclosures as the surfaces could be adversely affected.This product may be covered by one or more of the following patents owned by GP Acoustics (UK) Ltd. and its affiliates: [Japanese Patent No. 2766862, United Kingdom Patent No. GB 2 236 929 A, and the United States Patent No. 5,548,657]. To the extent of such coverage, this product has been licensed by GP Acoustics (UK) Ltd. KEF and UNI-Q are registered trademarks of the GP Acoustics family of companies.Accessory partsInstruction Manual ................................................................................................. 1Decoupling spikes + metal bases.......................................................................... 8Foam cushions (8)。
Glider Flying Handbook说明书
Glider Flying Handbook2013U.S. Department of TransportationFEDERAL AVIATION ADMINISTRATIONFlight Standards Servicei iPrefaceThe Glider Flying Handbook is designed as a technical manual for applicants who are preparing for glider category rating and for currently certificated glider pilots who wish to improve their knowledge. Certificated flight instructors will find this handbook a valuable training aid, since detailed coverage of aeronautical decision-making, components and systems, aerodynamics, flight instruments, performance limitations, ground operations, flight maneuvers, traffic patterns, emergencies, soaring weather, soaring techniques, and cross-country flight is included. Topics such as radio navigation and communication, use of flight information publications, and regulations are available in other Federal Aviation Administration (FAA) publications.The discussion and explanations reflect the most commonly used practices and principles. Occasionally, the word “must” or similar language is used where the desired action is deemed critical. The use of such language is not intended to add to, interpret, or relieve a duty imposed by Title 14 of the Code of Federal Regulations (14 CFR). Persons working towards a glider rating are advised to review the references from the applicable practical test standards (FAA-G-8082-4, Sport Pilot and Flight Instructor with a Sport Pilot Rating Knowledge Test Guide, FAA-G-8082-5, Commercial Pilot Knowledge Test Guide, and FAA-G-8082-17, Recreational Pilot and Private Pilot Knowledge Test Guide). Resources for study include FAA-H-8083-25, Pilot’s Handbook of Aeronautical Knowledge, FAA-H-8083-2, Risk Management Handbook, and Advisory Circular (AC) 00-6, Aviation Weather For Pilots and Flight Operations Personnel, AC 00-45, Aviation Weather Services, as these documents contain basic material not duplicated herein. All beginning applicants should refer to FAA-H-8083-25, Pilot’s Handbook of Aeronautical Knowledge, for study and basic library reference.It is essential for persons using this handbook to become familiar with and apply the pertinent parts of 14 CFR and the Aeronautical Information Manual (AIM). The AIM is available online at . The current Flight Standards Service airman training and testing material and learning statements for all airman certificates and ratings can be obtained from .This handbook supersedes FAA-H-8083-13, Glider Flying Handbook, dated 2003. Always select the latest edition of any publication and check the website for errata pages and listing of changes to FAA educational publications developed by the FAA’s Airman Testing Standards Branch, AFS-630.This handbook is available for download, in PDF format, from .This handbook is published by the United States Department of Transportation, Federal Aviation Administration, Airman Testing Standards Branch, AFS-630, P.O. Box 25082, Oklahoma City, OK 73125.Comments regarding this publication should be sent, in email form, to the following address:********************************************John M. AllenDirector, Flight Standards Serviceiiii vAcknowledgmentsThe Glider Flying Handbook was produced by the Federal Aviation Administration (FAA) with the assistance of Safety Research Corporation of America (SRCA). The FAA wishes to acknowledge the following contributors: Sue Telford of Telford Fishing & Hunting Services for images used in Chapter 1JerryZieba () for images used in Chapter 2Tim Mara () for images used in Chapters 2 and 12Uli Kremer of Alexander Schleicher GmbH & Co for images used in Chapter 2Richard Lancaster () for images and content used in Chapter 3Dave Nadler of Nadler & Associates for images used in Chapter 6Dave McConeghey for images used in Chapter 6John Brandon (www.raa.asn.au) for images and content used in Chapter 7Patrick Panzera () for images used in Chapter 8Jeff Haby (www.theweatherprediction) for images used in Chapter 8National Soaring Museum () for content used in Chapter 9Bill Elliot () for images used in Chapter 12.Tiffany Fidler for images used in Chapter 12.Additional appreciation is extended to the Soaring Society of America, Inc. (), the Soaring Safety Foundation, and Mr. Brad Temeyer and Mr. Bill Martin from the National Oceanic and Atmospheric Administration (NOAA) for their technical support and input.vv iPreface (iii)Acknowledgments (v)Table of Contents (vii)Chapter 1Gliders and Sailplanes ........................................1-1 Introduction....................................................................1-1 Gliders—The Early Years ..............................................1-2 Glider or Sailplane? .......................................................1-3 Glider Pilot Schools ......................................................1-4 14 CFR Part 141 Pilot Schools ...................................1-5 14 CFR Part 61 Instruction ........................................1-5 Glider Certificate Eligibility Requirements ...................1-5 Common Glider Concepts ..............................................1-6 Terminology...............................................................1-6 Converting Metric Distance to Feet ...........................1-6 Chapter 2Components and Systems .................................2-1 Introduction....................................................................2-1 Glider Design .................................................................2-2 The Fuselage ..................................................................2-4 Wings and Components .............................................2-4 Lift/Drag Devices ...........................................................2-5 Empennage .....................................................................2-6 Towhook Devices .......................................................2-7 Powerplant .....................................................................2-7 Self-Launching Gliders .............................................2-7 Sustainer Engines .......................................................2-8 Landing Gear .................................................................2-8 Wheel Brakes .............................................................2-8 Chapter 3Aerodynamics of Flight .......................................3-1 Introduction....................................................................3-1 Forces of Flight..............................................................3-2 Newton’s Third Law of Motion .................................3-2 Lift ..............................................................................3-2The Effects of Drag on a Glider .....................................3-3 Parasite Drag ..............................................................3-3 Form Drag ...............................................................3-3 Skin Friction Drag ..................................................3-3 Interference Drag ....................................................3-5 Total Drag...................................................................3-6 Wing Planform ...........................................................3-6 Elliptical Wing ........................................................3-6 Rectangular Wing ...................................................3-7 Tapered Wing .........................................................3-7 Swept-Forward Wing ..............................................3-7 Washout ..................................................................3-7 Glide Ratio .................................................................3-8 Aspect Ratio ............................................................3-9 Weight ........................................................................3-9 Thrust .........................................................................3-9 Three Axes of Rotation ..................................................3-9 Stability ........................................................................3-10 Flutter .......................................................................3-11 Lateral Stability ........................................................3-12 Turning Flight ..............................................................3-13 Load Factors .................................................................3-13 Radius of Turn ..........................................................3-14 Turn Coordination ....................................................3-15 Slips ..........................................................................3-15 Forward Slip .........................................................3-16 Sideslip .................................................................3-17 Spins .........................................................................3-17 Ground Effect ...............................................................3-19 Chapter 4Flight Instruments ...............................................4-1 Introduction....................................................................4-1 Pitot-Static Instruments ..................................................4-2 Impact and Static Pressure Lines................................4-2 Airspeed Indicator ......................................................4-2 The Effects of Altitude on the AirspeedIndicator..................................................................4-3 Types of Airspeed ...................................................4-3Table of ContentsviiAirspeed Indicator Markings ......................................4-5 Other Airspeed Limitations ........................................4-6 Altimeter .....................................................................4-6 Principles of Operation ...........................................4-6 Effect of Nonstandard Pressure andTemperature............................................................4-7 Setting the Altimeter (Kollsman Window) .............4-9 Types of Altitude ......................................................4-10 Variometer................................................................4-11 Total Energy System .............................................4-14 Netto .....................................................................4-14 Electronic Flight Computers ....................................4-15 Magnetic Compass .......................................................4-16 Yaw String ................................................................4-16 Inclinometer..............................................................4-16 Gyroscopic Instruments ...............................................4-17 G-Meter ........................................................................4-17 FLARM Collision Avoidance System .........................4-18 Chapter 5Glider Performance .............................................5-1 Introduction....................................................................5-1 Factors Affecting Performance ......................................5-2 High and Low Density Altitude Conditions ...........5-2 Atmospheric Pressure .............................................5-2 Altitude ...................................................................5-3 Temperature............................................................5-3 Wind ...........................................................................5-3 Weight ........................................................................5-5 Rate of Climb .................................................................5-7 Flight Manuals and Placards ..........................................5-8 Placards ......................................................................5-8 Performance Information ...........................................5-8 Glider Polars ...............................................................5-8 Weight and Balance Information .............................5-10 Limitations ...............................................................5-10 Weight and Balance .....................................................5-12 Center of Gravity ......................................................5-12 Problems Associated With CG Forward ofForward Limit .......................................................5-12 Problems Associated With CG Aft of Aft Limit ..5-13 Sample Weight and Balance Problems ....................5-13 Ballast ..........................................................................5-14 Chapter 6Preflight and Ground Operations .......................6-1 Introduction....................................................................6-1 Assembly and Storage Techniques ................................6-2 Trailering....................................................................6-3 Tiedown and Securing ................................................6-4Water Ballast ..............................................................6-4 Ground Handling........................................................6-4 Launch Equipment Inspection ....................................6-5 Glider Preflight Inspection .........................................6-6 Prelaunch Checklist ....................................................6-7 Glider Care .....................................................................6-7 Preventive Maintenance .............................................6-8 Chapter 7Launch and Recovery Procedures and Flight Maneuvers ............................................................7-1 Introduction....................................................................7-1 Aerotow Takeoff Procedures .........................................7-2 Signals ........................................................................7-2 Prelaunch Signals ....................................................7-2 Inflight Signals ........................................................7-3 Takeoff Procedures and Techniques ..........................7-3 Normal Assisted Takeoff............................................7-4 Unassisted Takeoff.....................................................7-5 Crosswind Takeoff .....................................................7-5 Assisted ...................................................................7-5 Unassisted...............................................................7-6 Aerotow Climb-Out ....................................................7-6 Aerotow Release.........................................................7-8 Slack Line ...................................................................7-9 Boxing the Wake ......................................................7-10 Ground Launch Takeoff Procedures ............................7-11 CG Hooks .................................................................7-11 Signals ......................................................................7-11 Prelaunch Signals (Winch/Automobile) ...............7-11 Inflight Signals ......................................................7-12 Tow Speeds ..............................................................7-12 Automobile Launch ..................................................7-14 Crosswind Takeoff and Climb .................................7-14 Normal Into-the-Wind Launch .................................7-15 Climb-Out and Release Procedures ..........................7-16 Self-Launch Takeoff Procedures ..............................7-17 Preparation and Engine Start ....................................7-17 Taxiing .....................................................................7-18 Pretakeoff Check ......................................................7-18 Normal Takeoff ........................................................7-19 Crosswind Takeoff ...................................................7-19 Climb-Out and Shutdown Procedures ......................7-19 Landing .....................................................................7-21 Gliderport/Airport Traffic Patterns and Operations .....7-22 Normal Approach and Landing ................................7-22 Crosswind Landing ..................................................7-25 Slips ..........................................................................7-25 Downwind Landing ..................................................7-27 After Landing and Securing .....................................7-27viiiPerformance Maneuvers ..............................................7-27 Straight Glides ..........................................................7-27 Turns.........................................................................7-28 Roll-In ...................................................................7-29 Roll-Out ................................................................7-30 Steep Turns ...........................................................7-31 Maneuvering at Minimum Controllable Airspeed ...7-31 Stall Recognition and Recovery ...............................7-32 Secondary Stalls ....................................................7-34 Accelerated Stalls .................................................7-34 Crossed-Control Stalls ..........................................7-35 Operating Airspeeds .....................................................7-36 Minimum Sink Airspeed ..........................................7-36 Best Glide Airspeed..................................................7-37 Speed to Fly ..............................................................7-37 Chapter 8Abnormal and Emergency Procedures .............8-1 Introduction....................................................................8-1 Porpoising ......................................................................8-2 Pilot-Induced Oscillations (PIOs) ..............................8-2 PIOs During Launch ...................................................8-2 Factors Influencing PIOs ........................................8-2 Improper Elevator Trim Setting ..............................8-3 Improper Wing Flaps Setting ..................................8-3 Pilot-Induced Roll Oscillations During Launch .........8-3 Pilot-Induced Yaw Oscillations During Launch ........8-4 Gust-Induced Oscillations ..............................................8-5 Vertical Gusts During High-Speed Cruise .................8-5 Pilot-Induced Pitch Oscillations During Landing ......8-6 Glider-Induced Oscillations ...........................................8-6 Pitch Influence of the Glider Towhook Position ........8-6 Self-Launching Glider Oscillations During Powered Flight ...........................................................8-7 Nosewheel Glider Oscillations During Launchesand Landings ..............................................................8-7 Tailwheel/Tailskid Equipped Glider Oscillations During Launches and Landings ..................................8-8 Aerotow Abnormal and Emergency Procedures ............8-8 Abnormal Procedures .................................................8-8 Towing Failures........................................................8-10 Tow Failure With Runway To Land and Stop ......8-11 Tow Failure Without Runway To Land BelowReturning Altitude ................................................8-11 Tow Failure Above Return to Runway Altitude ...8-11 Tow Failure Above 800' AGL ..............................8-12 Tow Failure Above Traffic Pattern Altitude .........8-13 Slack Line .................................................................8-13 Ground Launch Abnormal and Emergency Procedures ....................................................................8-14 Abnormal Procedures ...............................................8-14 Emergency Procedures .............................................8-14 Self-Launch Takeoff Emergency Procedures ..............8-15 Emergency Procedures .............................................8-15 Spiral Dives ..................................................................8-15 Spins .............................................................................8-15 Entry Phase ...............................................................8-17 Incipient Phase .........................................................8-17 Developed Phase ......................................................8-17 Recovery Phase ........................................................8-17 Off-Field Landing Procedures .....................................8-18 Afterlanding Off Field .............................................8-20 Off-Field Landing Without Injury ........................8-20 Off-Field Landing With Injury .............................8-20 System and Equipment Malfunctions ..........................8-20 Flight Instrument Malfunctions ................................8-20 Airspeed Indicator Malfunctions ..........................8-21 Altimeter Malfunctions .........................................8-21 Variometer Malfunctions ......................................8-21 Compass Malfunctions .........................................8-21 Glider Canopy Malfunctions ....................................8-21 Broken Glider Canopy ..........................................8-22 Frosted Glider Canopy ..........................................8-22 Water Ballast Malfunctions ......................................8-22 Retractable Landing Gear Malfunctions ..................8-22 Primary Flight Control Systems ...............................8-22 Elevator Malfunctions ..........................................8-22 Aileron Malfunctions ............................................8-23 Rudder Malfunctions ............................................8-24 Secondary Flight Controls Systems .........................8-24 Elevator Trim Malfunctions .................................8-24 Spoiler/Dive Brake Malfunctions .........................8-24 Miscellaneous Flight System Malfunctions .................8-25 Towhook Malfunctions ............................................8-25 Oxygen System Malfunctions ..................................8-25 Drogue Chute Malfunctions .....................................8-25 Self-Launching Gliders ................................................8-26 Self-Launching/Sustainer Glider Engine Failure During Takeoff or Climb ..........................................8-26 Inability to Restart a Self-Launching/SustainerGlider Engine While Airborne .................................8-27 Self-Launching Glider Propeller Malfunctions ........8-27 Self-Launching Glider Electrical System Malfunctions .............................................................8-27 In-flight Fire .............................................................8-28 Emergency Equipment and Survival Gear ...................8-28 Survival Gear Checklists ..........................................8-28 Food and Water ........................................................8-28ixClothing ....................................................................8-28 Communication ........................................................8-29 Navigation Equipment ..............................................8-29 Medical Equipment ..................................................8-29 Stowage ....................................................................8-30 Parachute ..................................................................8-30 Oxygen System Malfunctions ..................................8-30 Accident Prevention .....................................................8-30 Chapter 9Soaring Weather ..................................................9-1 Introduction....................................................................9-1 The Atmosphere .............................................................9-2 Composition ...............................................................9-2 Properties ....................................................................9-2 Temperature............................................................9-2 Density ....................................................................9-2 Pressure ...................................................................9-2 Standard Atmosphere .................................................9-3 Layers of the Atmosphere ..........................................9-4 Scale of Weather Events ................................................9-4 Thermal Soaring Weather ..............................................9-6 Thermal Shape and Structure .....................................9-6 Atmospheric Stability .................................................9-7 Air Masses Conducive to Thermal Soaring ...................9-9 Cloud Streets ..............................................................9-9 Thermal Waves...........................................................9-9 Thunderstorms..........................................................9-10 Lifted Index ..........................................................9-12 K-Index .................................................................9-12 Weather for Slope Soaring .......................................9-14 Mechanism for Wave Formation ..............................9-16 Lift Due to Convergence ..........................................9-19 Obtaining Weather Information ...................................9-21 Preflight Weather Briefing........................................9-21 Weather-ReIated Information ..................................9-21 Interpreting Weather Charts, Reports, andForecasts ......................................................................9-23 Graphic Weather Charts ...........................................9-23 Winds and Temperatures Aloft Forecast ..............9-23 Composite Moisture Stability Chart .....................9-24 Chapter 10Soaring Techniques ..........................................10-1 Introduction..................................................................10-1 Thermal Soaring ...........................................................10-2 Locating Thermals ....................................................10-2 Cumulus Clouds ...................................................10-2 Other Indicators of Thermals ................................10-3 Wind .....................................................................10-4 The Big Picture .....................................................10-5Entering a Thermal ..............................................10-5 Inside a Thermal.......................................................10-6 Bank Angle ...........................................................10-6 Speed .....................................................................10-6 Centering ...............................................................10-7 Collision Avoidance ................................................10-9 Exiting a Thermal .....................................................10-9 Atypical Thermals ..................................................10-10 Ridge/Slope Soaring ..................................................10-10 Traps ......................................................................10-10 Procedures for Safe Flying .....................................10-12 Bowls and Spurs .....................................................10-13 Slope Lift ................................................................10-13 Obstructions ...........................................................10-14 Tips and Techniques ...............................................10-15 Wave Soaring .............................................................10-16 Preflight Preparation ...............................................10-17 Getting Into the Wave ............................................10-18 Flying in the Wave .................................................10-20 Soaring Convergence Zones ...................................10-23 Combined Sources of Updrafts ..............................10-24 Chapter 11Cross-Country Soaring .....................................11-1 Introduction..................................................................11-1 Flight Preparation and Planning ...................................11-2 Personal and Special Equipment ..................................11-3 Navigation ....................................................................11-5 Using the Plotter .......................................................11-5 A Sample Cross-Country Flight ...............................11-5 Navigation Using GPS .............................................11-8 Cross-Country Techniques ...........................................11-9 Soaring Faster and Farther .........................................11-11 Height Bands ..........................................................11-11 Tips and Techniques ...............................................11-12 Special Situations .......................................................11-14 Course Deviations ..................................................11-14 Lost Procedures ......................................................11-14 Cross-Country Flight in a Self-Launching Glider .....11-15 High-Performance Glider Operations and Considerations ............................................................11-16 Glider Complexity ..................................................11-16 Water Ballast ..........................................................11-17 Cross-Country Flight Using Other Lift Sources ........11-17 Chapter 12Towing ................................................................12-1 Introduction..................................................................12-1 Equipment Inspections and Operational Checks .........12-2 Tow Hook ................................................................12-2 Schweizer Tow Hook ...........................................12-2x。
汽车配件说明书
Indicators................................ 131 Shift Lever Positions ................. 131 Shift Lock Release..................... 134
Eden David Series Bass Enclosures操作手册说明书
Bass Guitar Speaker Enclosures Maual For All David Series ProductsCovering All ModelsIn the XL, XLT and XST LinesTHE LEADER IN BASS AMPLIFICATION.©06-14-2005 by U.S. Music Corp.Eden David SeriesBass EnclosuresOperation ManualPublishing Date 06-14-2005ForewordThank you for your purchase of an Eden David Series loudspeaker enclosure. This cabinet has been designed and constructed to give you years of trouble-free service. Please take the time to review this manual and to send in your warranty registration card.We are proud that we are the only bass amplifier manufacturer to design, engineer and manufacture its own speakers and hi-frequency devices, all in our own facility. This not only gives us much greater quality control, we can also make exactly what we need for any given design. We design and engineer all of the individual loudspeakers and all of the enclosures to work well with each other so that the synergy of the overall design is greater than the sum of the parts.We have used only AA void-free plywood in the construction of your enclosure. Other manufacturers may use C or D grade, which allows for voids and patches that can degrade over time, causing rattles, or fall apart completely. Your cabinet has been constructed using the finest craftsmanship. We use a special glue and use Dado and Rabbet interlocking joins to ensure you a lifetime of use. Your enclosure features massive internal bracing and has been computer designed and hand-tuned to perfectly match with our hand-built speakers and high-frequency drivers to ensure maximum transient response and best overall sound.Please read this manual in its entirety before operating your new speaker system. Failure to do so could result in misuse or damage. We’ve taken the time to write it, which was a lot longer than the time it will take for you to read it. Help us help you by taking a few moments to learn how to properly use your new cabinet. You’ll be glad you did!CAUTION!Your ears are your most important piece of equipment. Unfortunately, they cannot be replaced as easily as your other gear. Please take the following warning seriously.This product, when used in combination with amplification and/or additional loudspeakers may be capable of producing sound levels that could cause permanent hearing loss. DO NOT operate at high volume levels or at a level that is uncomfortable. If you experience any discomfort or ringing in the ears or suspect hearing loss, you should consult an audiologist.Thank you for your purchase of an Eden bass guitar product. This unit has been designed and constructed to give you years of trouble-free service.Please take the time to review this manualand to send in your warranty registration card. Please complete for your records:Date of Purchase: __________________________Model: ___________________________________Serial Number: _____________________________Dealer: ___________________________________OPERATING INSTRUCTIONSAs previously mentioned, Eden is the only bass amplifier manufacturer to design, engineer and build its own drivers. Designing and building our own speakers and high-frequency drivers allows us an opportunity to create far greater synergy between our drivers and cabinets than any other manufacturer can achieve. We can create several speaker and/or cabinet prototypes and then test them together to find the best possible combination. No other manufacturer has this capability, which is why no other manufacturer can equal Eden’s sound and reliability.Eden loudspeakers feature a cast frame (except for the EC1560ES in our D-215XL(T) cabinet) and edge-wound voice coils. Our horn-loaded, cast aluminum bullet tweeter is the standard in the industry. We use a 6/18db crossover with level control, as well as a finely calibrated limiter for protection in high-volume situations.TYPES OF ENCLOSURESWe manufacture a broad array of enclosures to ensure the every bassist on the planet can find the perfect cabinets to match his or her playing style and personal tonal requirements. Our enclosures are grouped into the product lines outlined below. Each product group has its own tonal characteristics. For complete specifications on your particular cabinet, refer to Appendix A at the end of this manual.XLT SERIESThis is our best-selling line of speakers, with numerous models from which to choose. The XLT series cabinets have a low-mid bump that gives them their authoritative growl. This helps the bass cut through even the muddiest mix. Our D410XLT is the touring standard around the world. Product offerings in this group include:Model Impedance RMS power handlingD810XLT 4 or 8 ohms1400wD610XLT 6 ohms1050wD410XLT 4 or 8 ohms700wD210XLT 4 or 8 ohms350wD210MBX8 ohms350wD212XLT 4 or 8 ohms400wD112XLT8 ohms only250WD115XLT8 ohms only400wD215XLT 4 or 8 ohms400wD118XLT8 ohms only500wXL SERIESFor those desiring a cabinet with less highs and more of an old-school or traditional tone, we offer the XL series. These are the same as our XLTs except they have no high-frequency driver. Available in single or dual 15, and single 18 configurations, these cabinets are an excellent choice for bassists desiring a cabinet steeped in the tradition of 60s and early 70s.XST SERIESOur newest line of enclosures, the XST series features a deeper bottom end that is tighter and more focused, combined with a smoother midrange. These cabinets were designed with the hi-fi, hi-tech player in mind. They are also excellent for Pedal and Synth bass, as well as keyboards. Currently there are two models in the XST line:410XST8 ohms only1000w210XST 4 or 8 ohms500wBASIC CONNECTIONS AND OPERATIONThere are three speaker connections on the connection panel: two standard _ inch jacks and one NL4 connector. These connections are all wired together in parallel. This means that any of the connections can accept the input from your amplifier and that the remaining two connections can be used to connect to additional speaker cabinets if desired.NEVER CONNECT TWO AMPLIFIERS TO ONE CABINET!Let us repeat this: NEVER connect two amplifiers, or two channels of the SAME amplifier, to one cabinet. This is a Very Bad Thing which will damage your amplifiers and possibly the enclosure. It may also result in an impressive pyrotechnical display – once.You should make all your connections before turning your amplifier on. Standard _ inch plugs are less than ideal in their ability to transfer the signal from your amplifier. This is due to the limited amount of actual contact area in these connections. For best performance, we recommend using NL4 style speaker connectors. We also recommend using high quality speaker cables of at least 16 gauge min. (smaller numbers indicate larger cable). IMPROTANT NOTE:Using a shielded instrument cable to connect your amplifier and speakers is a Very Bad Thing. DO NOT use shielded instrument cable for speaker connections unless you want to cause serious damage to your amplifier.TWEETER LEVEL CONTROLThe Tweeter Level control is located on the connection panel on the back of your cabinet. In general we recommend you initially set the control to its 12:00 (or flat) position. Users who aren’t used to having a tweeter in their bass enclosure may want to turn the tweeter down to the point that it is barely operating and, over time, slowly adding more tweeter into the mix. The rear (inside) of the connection panel also houses the crossover and tweeter protection system. This system uses an aircraft-grade light bulb in a circuit that is designed to absorb current that is in excess of the power-handling ability of the tweeter.In cases of very high levels of high frequency information (such as feedback from facing the cabinet with your instrument turned up), the bulb can glow brightly enough to illuminate the interior of the cabinet and shine through the speaker surrounds. While this is a rather dramatic display of the protection circuit, it should not be done intentionally. It’s much better to find another way to impress your drummer!Excessive amounts of current will cause the bulb to act like a fuse and fail, requiring replacement before the tweeter will function. Replacement bulbs are available from our factory. In an emergency, an automobile dome light bulb can be used to restore the system. To replace the bulb, simply remove the screws that secure the connection plate to the back of the cabinet. Gently pull the plate out and replace the bulb in its connection clips.BREAK-IN PERIODWe recommend that you use your David Series cabinet at low to moderate volume levels for approximately ten hours before using it in a high volume situation. This will allow the suspension components to “seat” themselves and the speaker to break in. This is very similar in concept to breaking in the engine of a new car. It will actually take about 24 to 50 hours of total playing time to fully break in your speaker system. If desired, you can plug a CD player into your amplifier and play a CD through your enclosure to accomplish this break-in.CONNECTIONS WITH ADDITIONAL CABINETSIt is important to keep two issues in mind when connecting your David Series cabinet with other cabinets: phase relationships and impedance. Proper parallel connections require the positive and negative speaker terminals to maintain their relationships throughout the system. This means that the positive connection (tip on _ in. plugs; the red binding post) on one cabinet must connect to the positive connection on additional cabinets. The negative connections should be made in a similar manner. Unless you have defective cables, _ in. connections make incorrect connections highly unlikely. If you are using NL4 plugs to connect there should also be not problem with phase relationships. If you wish to connect multiple cabinets in SERIES, you will need to use special single wire cables with individual banana plugs, attaching them to the cabinets as shown below. (You can purchase _-banana adapters for this purpose, if necessary.)Parallel Connection Series Connection`Impedance is a measure of the load your speaker system places on your amplifier. Too great a load (indicated by a lower impedance figure) can damage your amplifier. Too small a load (indicated by a higher impedance figure) can fail to draw adequate power from your amplifier. Please consult your amplifier manufacturer’s literature for impedance recommendations.We hope this means you’ll be consulting another one of our manuals, by the way. If this is not the case, may we humbly suggest you trade up to a better amplifier?When you connect speakers in parallel, the load increases as shown below: Parallel speaker configurations Total system impedance Two 8 ohm cabinets4 ohms One 8 ohm cabinet and one 4 ohm cabinet2.6 ohms Two 4 ohm cabinets2 ohms Three 8 ohm cabinets2.6 ohms Two 8 ohm cabinets and one 4 ohm cabinet2 ohms One 8 ohm cabinet and two 4 ohm cabinets 1.6 ohmsWhen you connect speakers in series, the load decreases as shown below: Series speaker configurations Total system impedanceTwo 8 ohm cabinets 16 ohmsOne 8 ohm cabinet and one 4 ohm cabinet 12 ohmsTwo 4 ohm cabinets 8 ohmsThree 8 ohm cabinets24 ohmsTwo 8 ohm cabinets and one 4 ohm cabinet 20 ohmsOne 8 ohm cabinet and two 4 ohm cabinets 16 ohmsAs you can see, problems tend to arise when using more than two cabinets. In these cases, a combination of parallel and series wiring may be helpful. Speaker configurations Total system impedanceTwo 4 ohm cabinets in series plus one 8ohm cabinet in parallel. 4 ohmsTwo 8 ohm cabinets in parallel plus one 4ohm cabinet in series 8 ohmsPOWER HANDLINGYour speaker system can be damaged by too much or too little amplifier power. While the amount of amplifier power reflects the potential for damage, how that power is used (your playing style) is the critical variable. Too small an amplifier, when pushed to its limit too often, can generate excessive clipping. This can generate a signal with enough extra high frequency distortion to eventfully overheat and burn up a voice coil. Too large an amplifier, when pushed near its limit, can push the speaker beyond its physical limits. Your playing style determines how much headroom (reserve amplifier power needed to handle short bursts of sound) you will need. Slap style playing is particularly demanding, as short bursts of low frequency information require a great deal of power to be produced accurately without distortion. You should choose an amplifier that delivers adequate power for your playing style without frequent clipping and without exceeding the cabinet’s power handling maximum during normal usage. It is OK to have extra power for added headroom. Just be careful to use it for that purpose.Also, keep in mind that simply adding amplifier power will not necessarily increase your volume significantly. The addition of more speakers will usually have more impact on your overall volume level and improve your overall presence and tone.CABINET PLACEMENTThe placement of your cabinet can also have an impact on the amount of bass it produces. Placing the unit on the floor increases the amount of Bass you get by an additional +3dB . With each additional wall surface placement you get another 3 dB increase. This is due to the reinforcement of bass frequencies by the adjacent surfaces.The absence of reinforcing surfaces is the reason why outside settings are so problematic for bass amplification. A system that may be perfectly adequate in a fairly large club can be rather disappointing on an outdoor stage. If you have plans to perform in such a setting and are not confident that the P.A. system can provide you with sufficient reinforcement (both out front and via monitors), you should consider using additional equipment to support your own sound.MAINTENANCEYour speaker system is designed to be trouble-free and to require very little maintenance. You should remember that the weakest links in most systems are the solderless connection points where your plugs and jacks come together. These connections are quite vulnerable to contamination and /or corrosion, which can lead to Wimpy Bass Tone. And if you wanted that, you wouldn’t have bought an Eden speaker system, now would you?Your input jacks, as well as your speaker cable plugs, should be periodically cleaned using a cotton swab with a solvent such as denatured alcohol. On cabinets equipped with casters, you should check to make sure that the screws the hold the caster sockets in place are tight.IMPORTANT NOTE: Speakers are not waterproof. The cones themselves are made of special high-strength paper. If your speakers get wet, make sure they dry out completely before using them again. If you do not, you may cause mechanical damage to the speaker, and this is a Very Bad Thing. You can keep the carpet covering on your enclosure clean by using a Lint Roller (the masking tape style). If you need to remove ground-in dirt, use a commercially available carpet cleaner. Make sure, however, to protect the connection panel and speaker grill during cleaning.To remove the odor of airborne contaminants (smoke, e.g.) or the beer your drummer spilled on your cabinet during the last gig, use a commercially available fabric freshening spray.CLIMATE AND TRANSPORTATIONRoutine temperature extremes (such as cold garages) will not harm your Eden cabinet. You should, however, allow the system to adjust to room temperature before playing it at loud volumes. If your cabinet is going to be bounced around severely during transportation, it is best to avoid loading it with the speaker cones facing down, as this puts added stress on the screws that secure the speakers in the cabinet.THE MAGIC SMOKEFew people realize just how much magic goes into creating Great Bass Tone. It isn’t something you normally need worry about. Just have fun and leave all that to us. However – and this is very important – if you ever release the Magic Smoke from your speaker, this is indeed a Very Bad Thing, perhaps the worst thing you can do. If you see any smoke (Magic or otherwise) coming out of your cabinet, immediately turn it off and seek the services of a qualified magician…uhm, we mean…technician. DO NOT continue to use the speaker system in this condition.LEARN MOREIf you’d like to learn more about your speaker system (or about our company and its activities), we invite you to visit our website – . There you’ll find articles to help you better understand our products and the technical stuff some people find so interesting. You’ll also find our FAQ (Frequently Asked Questions) file, which is updated regularly.While you’re there, check out our on-line forum. There you can meet hundreds of other Edenites who’ll be glad to help you with any questions you may have about our gear. Not to brag too much, but we think our forum is a Really Neat Thing, filled with Really Neat People. We’re pretty sure you’ll think so, too.SERVICEIn the event of speaker malfunction, or questions about your unit’s operating features that aren’t answered in this manual or on our website, you should contact your Dealer. Once you and your dealer have determined it’s definitely a malfunction (and not an operator error) you must call our Customer Service Department and obtain a Return Merchandise Authorization (RMA). We WILL NOT accept any gear sent without an RMA, so save the time and money by calling first, ok?Please call the USM Customer Service Dept. at:1-800-USSOUND (1-800-877-6863)When you hear the voice prompt, Press 1 on your phone’s keypad.Please ship Authorized Returns for service to:Eden ElectronicsP.O. Box 338115 2nd StreetMontrose, Minnesota 55363Email Website*************************Eden ElectronicsC/O U.S. Music Corp.444 E. Courtland Rd.Mundelein, IL 60060(847) 949-0444(847) 949-8444(fax)Eden Never Compromise Note for those who care: This manual was written by David (Eden) Nordschow, Eden’s Chief Propellerhead & Master of All Things Technical, and Lane Baldwin, Eden’s Special Projects Coordinator (Many Other Functions). Any grammar errors are David and Lane’s fault, as are the attempts at humor. Please don’t blame anyone else for any weirdness, as we were warned several times. Really.。
jstd035声学扫描
JOINT INDUSTRY STANDARDAcoustic Microscopy for Non-HermeticEncapsulatedElectronicComponents IPC/JEDEC J-STD-035APRIL1999Supersedes IPC-SM-786 Supersedes IPC-TM-650,2.6.22Notice EIA/JEDEC and IPC Standards and Publications are designed to serve thepublic interest through eliminating misunderstandings between manufacturersand purchasers,facilitating interchangeability and improvement of products,and assisting the purchaser in selecting and obtaining with minimum delaythe proper product for his particular need.Existence of such Standards andPublications shall not in any respect preclude any member or nonmember ofEIA/JEDEC or IPC from manufacturing or selling products not conformingto such Standards and Publications,nor shall the existence of such Standardsand Publications preclude their voluntary use by those other than EIA/JEDECand IPC members,whether the standard is to be used either domestically orinternationally.Recommended Standards and Publications are adopted by EIA/JEDEC andIPC without regard to whether their adoption may involve patents on articles,materials,or processes.By such action,EIA/JEDEC and IPC do not assumeany liability to any patent owner,nor do they assume any obligation whateverto parties adopting the Recommended Standard or ers are alsowholly responsible for protecting themselves against all claims of liabilities forpatent infringement.The material in this joint standard was developed by the EIA/JEDEC JC-14.1Committee on Reliability Test Methods for Packaged Devices and the IPCPlastic Chip Carrier Cracking Task Group(B-10a)The J-STD-035supersedes IPC-TM-650,Test Method2.6.22.For Technical Information Contact:Electronic Industries Alliance/ JEDEC(Joint Electron Device Engineering Council)2500Wilson Boulevard Arlington,V A22201Phone(703)907-7560Fax(703)907-7501IPC2215Sanders Road Northbrook,IL60062-6135 Phone(847)509-9700Fax(847)509-9798Please use the Standard Improvement Form shown at the end of thisdocument.©Copyright1999.The Electronic Industries Alliance,Arlington,Virginia,and IPC,Northbrook,Illinois.All rights reserved under both international and Pan-American copyright conventions.Any copying,scanning or other reproduction of these materials without the prior written consent of the copyright holder is strictly prohibited and constitutes infringement under the Copyright Law of the United States.IPC/JEDEC J-STD-035Acoustic Microscopyfor Non-Hermetic EncapsulatedElectronicComponentsA joint standard developed by the EIA/JEDEC JC-14.1Committee on Reliability Test Methods for Packaged Devices and the B-10a Plastic Chip Carrier Cracking Task Group of IPCUsers of this standard are encouraged to participate in the development of future revisions.Contact:EIA/JEDEC Engineering Department 2500Wilson Boulevard Arlington,V A22201 Phone(703)907-7500 Fax(703)907-7501IPC2215Sanders Road Northbrook,IL60062-6135 Phone(847)509-9700Fax(847)509-9798ASSOCIATION CONNECTINGELECTRONICS INDUSTRIESAcknowledgmentMembers of the Joint IPC-EIA/JEDEC Moisture Classification Task Group have worked to develop this document.We would like to thank them for their dedication to this effort.Any Standard involving a complex technology draws material from a vast number of sources.While the principal members of the Joint Moisture Classification Working Group are shown below,it is not possible to include all of those who assisted in the evolution of this Standard.To each of them,the mem-bers of the EIA/JEDEC and IPC extend their gratitude.IPC Packaged Electronic Components Committee ChairmanMartin FreedmanAMP,Inc.IPC Plastic Chip Carrier Cracking Task Group,B-10a ChairmanSteven MartellSonoscan,Inc.EIA/JEDEC JC14.1CommitteeChairmanJack McCullenIntel Corp.EIA/JEDEC JC14ChairmanNick LycoudesMotorolaJoint Working Group MembersCharlie Baker,TIChristopher Brigham,Hi/FnRalph Carbone,Hewlett Packard Co. Don Denton,TIMatt Dotty,AmkorMichele J.DiFranza,The Mitre Corp. Leo Feinstein,Allegro Microsystems Inc.Barry Fernelius,Hewlett Packard Co. Chris Fortunko,National Institute of StandardsRobert J.Gregory,CAE Electronics, Inc.Curtis Grosskopf,IBM Corp.Bill Guthrie,IBM Corp.Phil Johnson,Philips Semiconductors Nick Lycoudes,MotorolaSteven R.Martell,Sonoscan Inc. Jack McCullen,Intel Corp.Tom Moore,TIDavid Nicol,Lucent Technologies Inc.Pramod Patel,Advanced Micro Devices Inc.Ramon R.Reglos,XilinxCorazon Reglos,AdaptecGerald Servais,Delphi Delco Electronics SystemsRichard Shook,Lucent Technologies Inc.E.Lon Smith,Lucent Technologies Inc.Randy Walberg,NationalSemiconductor Corp.Charlie Wu,AdaptecEdward Masami Aoki,HewlettPackard LaboratoriesFonda B.Wu,Raytheon Systems Co.Richard W.Boerdner,EJE ResearchVictor J.Brzozowski,NorthropGrumman ES&SDMacushla Chen,Wus Printed CircuitCo.Ltd.Jeffrey C.Colish,Northrop GrummanCorp.Samuel J.Croce,Litton AeroProducts DivisionDerek D-Andrade,Surface MountTechnology CentreRao B.Dayaneni,Hewlett PackardLaboratoriesRodney Dehne,OEM WorldwideJames F.Maguire,Boeing Defense&Space GroupKim Finch,Boeing Defense&SpaceGroupAlelie Funcell,Xilinx Inc.Constantino J.Gonzalez,ACMEMunir Haq,Advanced Micro DevicesInc.Larry A.Hargreaves,DC.ScientificInc.John T.Hoback,Amoco ChemicalCo.Terence Kern,Axiom Electronics Inc.Connie M.Korth,K-Byte/HibbingManufacturingGabriele Marcantonio,NORTELCharles Martin,Hewlett PackardLaboratoriesRichard W.Max,Alcatel NetworkSystems Inc.Patrick McCluskey,University ofMarylandJames H.Moffitt,Moffitt ConsultingServicesRobert Mulligan,Motorola Inc.James E.Mumby,CibaJohn Northrup,Lockheed MartinCorp.Dominique K.Numakura,LitchfieldPrecision ComponentsNitin B.Parekh,Unisys Corp.Bella Poborets,Lucent TechnologiesInc.D.Elaine Pope,Intel Corp.Ray Prasad,Ray Prasad ConsultancyGroupAlbert Puah,Adaptec Inc.William Sepp,Technic Inc.Ralph W.Taylor,Lockheed MartinCorp.Ed R.Tidwell,DSC CommunicationsCorp.Nick Virmani,Naval Research LabKen Warren,Corlund ElectronicsCorp.Yulia B.Zaks,Lucent TechnologiesInc.IPC/JEDEC J-STD-035April1999 iiTable of Contents1SCOPE (1)2DEFINITIONS (1)2.1A-mode (1)2.2B-mode (1)2.3Back-Side Substrate View Area (1)2.4C-mode (1)2.5Through Transmission Mode (2)2.6Die Attach View Area (2)2.7Die Surface View Area (2)2.8Focal Length(FL) (2)2.9Focus Plane (2)2.10Leadframe(L/F)View Area (2)2.11Reflective Acoustic Microscope (2)2.12Through Transmission Acoustic Microscope (2)2.13Time-of-Flight(TOF) (3)2.14Top-Side Die Attach Substrate View Area (3)3APPARATUS (3)3.1Reflective Acoustic Microscope System (3)3.2Through Transmission AcousticMicroscope System (4)4PROCEDURE (4)4.1Equipment Setup (4)4.2Perform Acoustic Scans..........................................4Appendix A Acoustic Microscopy Defect CheckSheet (6)Appendix B Potential Image Pitfalls (9)Appendix C Some Limitations of AcousticMicroscopy (10)Appendix D Reference Procedure for PresentingApplicable Scanned Data (11)FiguresFigure1Example of A-mode Display (1)Figure2Example of B-mode Display (1)Figure3Example of C-mode Display (2)Figure4Example of Through Transmission Display (2)Figure5Diagram of a Reflective Acoustic MicroscopeSystem (3)Figure6Diagram of a Through Transmission AcousticMicroscope System (3)April1999IPC/JEDEC J-STD-035iiiIPC/JEDEC J-STD-035April1999This Page Intentionally Left BlankivApril1999IPC/JEDEC J-STD-035 Acoustic Microscopy for Non-Hermetic EncapsulatedElectronic Components1SCOPEThis test method defines the procedures for performing acoustic microscopy on non-hermetic encapsulated electronic com-ponents.This method provides users with an acoustic microscopy processflow for detecting defects non-destructively in plastic packages while achieving reproducibility.2DEFINITIONS2.1A-mode Acoustic data collected at the smallest X-Y-Z region defined by the limitations of the given acoustic micro-scope.An A-mode display contains amplitude and phase/polarity information as a function of time offlight at a single point in the X-Y plane.See Figure1-Example of A-mode Display.IPC-035-1 Figure1Example of A-mode Display2.2B-mode Acoustic data collected along an X-Z or Y-Z plane versus depth using a reflective acoustic microscope.A B-mode scan contains amplitude and phase/polarity information as a function of time offlight at each point along the scan line.A B-mode scan furnishes a two-dimensional(cross-sectional)description along a scan line(X or Y).See Figure2-Example of B-mode Display.IPC-035-2 Figure2Example of B-mode Display(bottom half of picture on left)2.3Back-Side Substrate View Area(Refer to Appendix A,Type IV)The interface between the encapsulant and the back of the substrate within the outer edges of the substrate surface.2.4C-mode Acoustic data collected in an X-Y plane at depth(Z)using a reflective acoustic microscope.A C-mode scan contains amplitude and phase/polarity information at each point in the scan plane.A C-mode scan furnishes a two-dimensional(area)image of echoes arising from reflections at a particular depth(Z).See Figure3-Example of C-mode Display.1IPC/JEDEC J-STD-035April1999IPC-035-3 Figure3Example of C-mode Display2.5Through Transmission Mode Acoustic data collected in an X-Y plane throughout the depth(Z)using a through trans-mission acoustic microscope.A Through Transmission mode scan contains only amplitude information at each point in the scan plane.A Through Transmission scan furnishes a two-dimensional(area)image of transmitted ultrasound through the complete thickness/depth(Z)of the sample/component.See Figure4-Example of Through Transmission Display.IPC-035-4 Figure4Example of Through Transmission Display2.6Die Attach View Area(Refer to Appendix A,Type II)The interface between the die and the die attach adhesive and/or the die attach adhesive and the die attach substrate.2.7Die Surface View Area(Refer to Appendix A,Type I)The interface between the encapsulant and the active side of the die.2.8Focal Length(FL)The distance in water at which a transducer’s spot size is at a minimum.2.9Focus Plane The X-Y plane at a depth(Z),which the amplitude of the acoustic signal is maximized.2.10Leadframe(L/F)View Area(Refer to Appendix A,Type V)The imaged area which extends from the outer L/F edges of the package to the L/F‘‘tips’’(wedge bond/stitch bond region of the innermost portion of the L/F.)2.11Reflective Acoustic Microscope An acoustic microscope that uses one transducer as both the pulser and receiver. (This is also known as a pulse/echo system.)See Figure5-Diagram of a Reflective Acoustic Microscope System.2.12Through Transmission Acoustic Microscope An acoustic microscope that transmits ultrasound completely through the sample from a sending transducer to a receiver on the opposite side.See Figure6-Diagram of a Through Transmis-sion Acoustic Microscope System.2April1999IPC/JEDEC J-STD-0353IPC/JEDEC J-STD-035April1999 3.1.6A broad band acoustic transducer with a center frequency in the range of10to200MHz for subsurface imaging.3.2Through Transmission Acoustic Microscope System(see Figure6)comprised of:3.2.1Items3.1.1to3.1.6above3.2.2Ultrasonic pulser(can be a pulser/receiver as in3.1.1)3.2.3Separate receiving transducer or ultrasonic detection system3.3Reference packages or standards,including packages with delamination and packages without delamination,for use during equipment setup.3.4Sample holder for pre-positioning samples.The holder should keep the samples from moving during the scan and maintain planarity.4PROCEDUREThis procedure is generic to all acoustic microscopes.For operational details related to this procedure that apply to a spe-cific model of acoustic microscope,consult the manufacturer’s operational manual.4.1Equipment Setup4.1.1Select the transducer with the highest useable ultrasonic frequency,subject to the limitations imposed by the media thickness and acoustic characteristics,package configuration,and transducer availability,to analyze the interfaces of inter-est.The transducer selected should have a low enough frequency to provide a clear signal from the interface of interest.The transducer should have a high enough frequency to delineate the interface of interest.Note:Through transmission mode may require a lower frequency and/or longer focal length than reflective mode.Through transmission is effective for the initial inspection of components to determine if defects are present.4.1.2Verify setup with the reference packages or standards(see3.3above)and settings that are appropriate for the trans-ducer chosen in4.1.1to ensure that the critical parameters at the interface of interest correlate to the reference standard uti-lized.4.1.3Place units in the sample holder in the coupling medium such that the upper surface of each unit is parallel with the scanning plane of the acoustic transducer.Sweep air bubbles away from the unit surface and from the bottom of the trans-ducer head.4.1.4At afixed distance(Z),align the transducer and/or stage for the maximum reflected amplitude from the top surface of the sample.The transducer must be perpendicular to the sample surface.4.1.5Focus by maximizing the amplitude,in the A-mode display,of the reflection from the interface designated for imag-ing.This is done by adjusting the Z-axis distance between the transducer and the sample.4.2Perform Acoustic Scans4.2.1Inspect the acoustic image(s)for any anomalies,verify that the anomaly is a package defect or an artifact of the imaging process,and record the results.(See Appendix A for an example of a check sheet that may be used.)To determine if an anomaly is a package defect or an artifact of the imaging process it is recommended to analyze the A-mode display at the location of the anomaly.4.2.2Consider potential pitfalls in image interpretation listed in,but not limited to,Appendix B and some of the limita-tions of acoustic microscopy listed in,but not limited to,Appendix C.If necessary,make adjustments to the equipment setup to optimize the results and rescan.4April1999IPC/JEDEC J-STD-035 4.2.3Evaluate the acoustic images using the failure criteria specified in other appropriate documents,such as J-STD-020.4.2.4Record the images and thefinal instrument setup parameters for documentation purposes.An example checklist is shown in Appendix D.5IPC/JEDEC J-STD-035April19996April1999IPC/JEDEC J-STD-035Appendix AAcoustic Microscopy Defect Check Sheet(continued)CIRCUIT SIDE SCANImage File Name/PathDelamination(Type I)Die Circuit Surface/Encapsulant Number Affected:Average%Location:Corner Edge Center (Type II)Die/Die Attach Number Affected:Average%Location:Corner Edge Center (Type III)Encapsulant/Substrate Number Affected:Average%Location:Corner Edge Center (Type V)Interconnect tip Number Affected:Average%Interconnect Number Affected:Max.%Length(Type VI)Intra-Laminate Number Affected:Average%Location:Corner Edge Center Comments:CracksAre cracks present:Yes NoIf yes:Do any cracks intersect:bond wire ball bond wedge bond tab bump tab leadDoes crack extend from leadfinger to any other internal feature:Yes NoDoes crack extend more than two-thirds the distance from any internal feature to the external surfaceof the package:Yes NoAdditional verification required:Yes NoComments:Mold Compound VoidsAre voids present:Yes NoIf yes:Approx.size Location(if multiple voids,use comment section)Do any voids intersect:bond wire ball bond wedge bond tab bump tab lead Additional verification required:Yes NoComments:7IPC/JEDEC J-STD-035April1999Appendix AAcoustic Microscopy Defect Check Sheet(continued)NON-CIRCUIT SIDE SCANImage File Name/PathDelamination(Type IV)Encapsulant/Substrate Number Affected:Average%Location:Corner Edge Center (Type II)Substrate/Die Attach Number Affected:Average%Location:Corner Edge Center (Type V)Interconnect Number Affected:Max.%LengthLocation:Corner Edge Center (Type VI)Intra-Laminate Number Affected:Average%Location:Corner Edge Center (Type VII)Heat Spreader Number Affected:Average%Location:Corner Edge Center Additional verification required:Yes NoComments:CracksAre cracks present:Yes NoIf yes:Does crack extend more than two-thirds the distance from any internal feature to the external surfaceof the package:Yes NoAdditional verification required:Yes NoComments:Mold Compound VoidsAre voids present:Yes NoIf yes:Approx.size Location(if multiple voids,use comment section)Additional verification required:Yes NoComments:8Appendix BPotential Image PitfallsOBSERV ATIONS CAUSES/COMMENTSUnexplained loss of front surface signal Gain setting too lowSymbolization on package surfaceEjector pin knockoutsPin1and other mold marksDust,air bubbles,fingerprints,residueScratches,scribe marks,pencil marksCambered package edgeUnexplained loss of subsurface signal Gain setting too lowTransducer frequency too highAcoustically absorbent(rubbery)fillerLarge mold compound voidsPorosity/high concentration of small voidsAngled cracks in package‘‘Dark line boundary’’(phase cancellation)Burned molding compound(ESD/EOS damage)False or spotty indication of delamination Low acoustic impedance coating(polyimide,gel)Focus errorIncorrect delamination gate setupMultilayer interference effectsFalse indication of adhesion Gain set too high(saturation)Incorrect delamination gate setupFocus errorOverlap of front surface and subsurface echoes(transducerfrequency too low)Fluidfilling delamination areasApparent voiding around die edge Reflection from wire loopsIncorrect setting of void gateGraded intensity Die tilt or lead frame deformation Sample tiltApril1999IPC/JEDEC J-STD-0359Appendix CSome Limitations of Acoustic MicroscopyAcoustic microscopy is an analytical technique that provides a non-destructive method for examining plastic encapsulated components for the existence of delaminations,cracks,and voids.This technique has limitations that include the following: LIMITATION REASONAcoustic microscopy has difficulty infinding small defects if the package is too thick.The ultrasonic signal becomes more attenuated as a function of two factors:the depth into the package and the transducer fre-quency.The greater the depth,the greater the attenuation.Simi-larly,the higher the transducer frequency,the greater the attenu-ation as a function of depth.There are limitations on the Z-axis(axial)resolu-tion.This is a function of the transducer frequency.The higher the transducer frequency,the better the resolution.However,the higher frequency signal becomes attenuated more quickly as a function of depth.There are limitations on the X-Y(lateral)resolu-tion.The X-Y(lateral)resolution is a function of a number of differ-ent variables including:•Transducer characteristics,including frequency,element diam-eter,and focal length•Absorption and scattering of acoustic waves as a function of the sample material•Electromechanical properties of the X-Y stageIrregularly shaped packages are difficult to analyze.The technique requires some kind offlat reference surface.Typically,the upper surface of the package or the die surfacecan be used as references.In some packages,cambered packageedges can cause difficulty in analyzing defects near the edgesand below their surfaces.Edge Effect The edges cause difficulty in analyzing defects near the edge ofany internal features.IPC/JEDEC J-STD-035April1999 10April1999IPC/JEDEC J-STD-035Appendix DReference Procedure for Presenting Applicable Scanned DataMost of the settings described may be captured as a default for the particular supplier/product with specific changes recorded on a sample or lot basis.Setup Configuration(Digital Setup File Name and Contents)Calibration Procedure and Calibration/Reference Standards usedTransducerManufacturerModelCenter frequencySerial numberElement diameterFocal length in waterScan SetupScan area(X-Y dimensions)Scan step sizeHorizontalVerticalDisplayed resolutionHorizontalVerticalScan speedPulser/Receiver SettingsGainBandwidthPulseEnergyRepetition rateReceiver attenuationDampingFilterEcho amplitudePulse Analyzer SettingsFront surface gate delay relative to trigger pulseSubsurface gate(if used)High passfilterDetection threshold for positive oscillation,negative oscillationA/D settingsSampling rateOffset settingPer Sample SettingsSample orientation(top or bottom(flipped)view and location of pin1or some other distinguishing characteristic) Focus(point,depth,interface)Reference planeNon-default parametersSample identification information to uniquely distinguish it from others in the same group11IPC/JEDEC J-STD-035April1999Appendix DReference Procedure for Presenting Applicable Scanned Data(continued) Reference Procedure for Presenting Scanned DataImagefile types and namesGray scale and color image legend definitionsSignificance of colorsIndications or definition of delaminationImage dimensionsDepth scale of TOFDeviation from true aspect ratioImage type:A-mode,B-mode,C-mode,TOF,Through TransmissionA-mode waveforms should be provided for points of interest,such as delaminated areas.In addition,an A-mode image should be provided for a bonded area as a control.12Standard Improvement FormIPC/JEDEC J-STD-035The purpose of this form is to provide the Technical Committee of IPC with input from the industry regarding usage of the subject standard.Individuals or companies are invited to submit comments to IPC.All comments will be collected and dispersed to the appropriate committee(s).If you can provide input,please complete this form and return to:IPC2215Sanders RoadNorthbrook,IL 60062-6135Fax 847509.97981.I recommend changes to the following:Requirement,paragraph number Test Method number,paragraph numberThe referenced paragraph number has proven to be:Unclear Too RigidInErrorOther2.Recommendations forcorrection:3.Other suggestions for document improvement:Submitted by:Name Telephone Company E-mailAddress City/State/ZipDate ASSOCIATION CONNECTING ELECTRONICS INDUSTRIESASSOCIATION CONNECTINGELECTRONICS INDUSTRIESISBN#1-580982-28-X2215 Sanders Road, Northbrook, IL 60062-6135Tel. 847.509.9700 Fax 847.509.9798。
3GPP TS 26-132 -520
3GPP TS 26.132 V5.2.0 (2002-03)Technical Specification3rd Generation Partnership Project; Technical Specification Group Services and System Aspects;Speech and video telephony terminal acoustic testspecification(Release 5)The present document has been developed within the 3rd Generation Partnership Project (3GPP TM) and may be further elaborated for the purposes of 3GPP. The present document has not been subject to any approval process by the 3GPP Organizational Partners and shall not be implemented.This Specification is provided for future development work within 3GPP only. The Organizational Partners accept no liability for any use of this Specification.Specifications and reports for implementation of the 3GPP TM system should be obtained via the 3GPP Organizational Partners' Publications Offices.KeywordsUMTS, 3,1kHz, telephony, acoustic, testing,video3GPPPostal address3GPP support office address650 Route des Lucioles - Sophia AntipolisValbonne - FRANCETel.: +33 4 92 94 42 00 Fax: +33 4 93 65 47 16InternetCopyright NotificationNo part may be reproduced except as authorized by written permission. The copyright and the foregoing restriction extend to reproduction in all media.© 2002, 3GPP Organizational Partners (ARIB, CWTS, ETSI, T1, TTA, TTC).All rights reserved.ContentsForeword (5)Introduction (5)1Scope (6)2References (6)3Definitions, symbols and abbreviations (7)3.1Definitions (7)3.2Abbreviations (7)4Interfaces (8)5Test configurations (8)5.1Test setup for terminals (8)5.1.1Setup for handset terminals (8)5.1.2Setup for headset terminals (9)5.1.3Setup for hands-free terminals (10)5.1.3.1Vehicle mounted hands-free (10)5.1.3.2Desktop operated hands-free (11)5.1.3.3Handheld hands-free (11)5.1.4Position and calibration of HATS (12)5.2Setup of the electrical interfaces (12)5.2.1Codec approach and specification (12)5.2.2Direct digital processing approach (13)5.3Accuracy of test equipment (13)5.4Test signals (14)6Test conditions (14)6.1Environmental conditions (14)6.1.1Handset and headset terminals (14)6.1.2Hands-free terminals (14)6.2System Simulator conditions (15)7Telephony transmission performance test methods (15)7.1Applicability (15)7.2Overall loss/loudness ratings (15)7.2.1General (15)7.2.2Connections with handset UE (16)7.2.2.1Sending Loudness Rating (SLR) (16)7.2.2.2Receiving Loudness Rating (RLR) (16)7.2.3Connections with Vehicle Mounted & Desk-Top hands-free UE (16)7.2.3.1Sending Loudness Rating (SLR) (16)7.2.3.2Receiving Loudness Rating (RLR) (17)7.2.4Connections with Handheld hands-free UE (17)7.2.4.1Sending Loudness Rating (SLR) (17)7.2.4.2Receiving Loudness Rating (RLR) (18)7.2.5Connections with headset UE (18)7.3Idle channel noise (handset and headset UE) (18)7.3.1Sending (18)7.3.2Receiving (18)7.4Sensitivity/frequency characteristics (19)7.4.1Handset UE sending (19)7.4.2Handset UE receiving (19)7.4.3Vehicle Mounted & Desk-Top hands-free UE sending (19)7.4.4Vehicle Mounted & Desk-Top hands-free UE receiving (20)7.4.5Hand-Held hands-free UE sending (20)7.4.6Hand-Held hands-free UE receiving (20)7.5Sidetone characteristics (21)7.5.1Connections with Handset UE (21)7.5.2 Headset UE (21)7.5.3Hands-free UE (all categories) (21)7.6Stability loss (21)7.7Acoustic echo control (22)7.7.1General (22)7.7.2Acoustic echo control in a Hands-free UE (22)7.7.3Acoustic echo control in a handset UE (23)7.7.4Acoustic echo control in a headset UE (23)7.8Distortion (24)7.8.1Sending Distortion (24)7.8.2Receiving (24)7.9Ambient Noise Rejection (25)Annex A (informative): Change history (27)ForewordThis Technical Specification has been produced by the 3GPP.The contents of the present document are subject to continuing work within the TSG and may change following formal TSG approval. Should the TSG modify the contents of this TS, it will be re-released by the TSG with an identifying change of release date and an increase in version number as follows:Version x.y.zwhere:x the first digit:1 presented to TSG for information;2 presented to TSG for approval;3 or greater indicates TSG approved document under change control.y the second digit is incremented for all changes of substance, i.e. technical enhancements, corrections, updates, etc.z the third digit is incremented when editorial only changes have been incorporated in the specification.IntroductionThe present document specifies test methods to allow the minimum performance requirements for the acoustic characteristics of 3G terminals when used to provide narrow-band or wideband telephony to be assessed.The objective for narrow-band services is to reach a quality as close as possible to ITU-T standards for PSTN circuits. However, due to technical and economic factors, there cannot be full compliance with the general characteristics of international telephone connections and circuits recommended by the ITU-T.The performance requirements are specified in TS26.131; the test methods and considerations are specified in the main body of the text.1 ScopeThe present document is applicable to any terminal capable of supporting narrow-band or wideband telephony, either as a stand-alone service or as the telephony component of a multimedia service. The present document specifies test methods to allow the minimum performance requirements for the acoustic characteristics of 3G terminals when used to provide narrow-band or wideband telephony to be assessed.2 ReferencesThe following documents contain provisions which, through reference in this text, constitute provisions of the present document.∙References are either specific (identified by date of publication, edition number, version number, etc.) or non-specific.∙For a specific reference, subsequent revisions do not apply.∙For a non-specific reference, the latest version applies. In the case of a reference to a 3GPP document (includinga GSM document), a non-specific reference implicitly refers to the latest version of that document in the sameRelease as the present document.[1] 3GPP TS 26.131: "Terminal Acoustic Characteristics for Telephony; Requirements".[2] ITU-T Recommendation B.12 (1988): "Use of the decibel and the neper intelecommunications".[3] ITU-T Recommendation G.103 (1998): "Hypothetical reference connections".[4] ITU-T Recommendation G.111 (1993): "Loudness ratings (LRs) in an international connection".[5] ITU-T Recommendation G.121 (1993): "Loudness ratings (LRs) of national systems".[6] ITU-T Recommendation G.122 (1993): "Influence of national systems on stability, talker echo, andlistener echo in international connections".[7] ITU-T Recommendation G.711 1988): "Pulse code modulation (PCM) of voice frequencies".[8] ITU-T Recommendation P.11 (1993): "Effect of transmission impairments".[9] ITU-T Recommendation P.38 (1993): "Transmission characteristics of operator telephone systems(OTS)".[10] ITU-T Recommendation P.50 (1993): "Artificial voices".[11] 3GPP TS 03.58 (Release 1997): "Digital Cellular Telecommunications System (Phase 2+)Characterization test methods and quality assessment for hands-free mobiles".[12] IEC Publication 60651: “Sound Level Meters”.[13] ITU-T Recommendation P.51 (1996): "Artificial mouth".[14] ITU-T Recommendation P.57 (1996): "Artificial ears".[15] ITU-T Recommendation P.58 (1996): "Head and torso simulator for telephonometry."[16] ITU-T Recommendation P.79 (1999): "Calculation of loudness ratings for telephone sets."[17] 3GPP TS 06.77 R99 Minimum Performance Requirements for Noise Suppresser Application to theAMR Speech Encoder.[18] ITU-T Recommendation P.64: "Determination of sensitivity/frequency characteristics of localtelephone systems".[19] ITU-T Recommendation P.581: "Use of head and torso simulator (HATS) for hands-free terminaltesting".[20] ITU-T Recommendation P.340: "Transmission characteristics of hands-free telepones".[21] ITU-T Recommendation G.712: "Transmission performance characteristics of pulse codemodulation channels".[22] ITU-T Recommendation P.501: "Test signals for use in telephonometry".[23] ITU-T Recommendation O.41: "Psophometer for use on telephone-type circuits".[24] ITU-T Recommendation O.131: "Psophometer for use on telephone-type circuits".[25] ISO 9614: "Acoustics - Determination of sound power levels of noise sources using soundintensity".[26] ISO 3745: "Acoustics - Determination of sound power levels of noise sources - Precision methodsfor anechoic and semi-anechoic rooms".[27] ITU-T Recommendation O.132: "Quantizing distortion measuring equipment using a sinusoidaltest signal".3 Definitions, symbols and abbreviations3.1 DefinitionsFor the purposes of the present document the term narrow-band refers to signals sampled at 8 kHz; wideband refers to signals sampled at 16 kHz.For the purposes of the present document, the following terms: dB, dBr, dBm0, dBm0p and dBA, shall be interpreted as defined in ITU-T Recommendation B.12; the term dBPa shall be interpreted as the sound pressure level relative to1 pascal expressed in dB (0 dBPa is equivalent to 94 dB SPL).3.2 AbbreviationsFor the purposes of the present document, the following abbreviations apply:ADC Analogue to Digital ConverterDAC Digital to Analogue ConverterDTX Discontinuous TransmissionEEC Electrical Echo ControlEL Echo LossERP Ear Reference PointHATS Head and Torso SimulatorLSTR Listener Sidetone RatingLRGP Loudness Rating Guardring PositionMRP Mouth Reference PointOLR Overall Loudness RatingPCM Pulse Code ModulationPOI Point of Interconnection (with PSTN)PSTN Public Switched Telephone NetworkRLR Receive Loudness RatingSLR Send Loudness RatingSTMR Sidetone Masking RatingSS System SimulatorTX TransmissionUE User Equipment4 InterfacesAccess to terminals for acoustic testing is always made via the acoustic or air interfaces. The Air Interface is specified by the 3G 25 series specifications and is required to achieve user equipment (UE) transportability. Measurements can be made at this point using a system simulator (SS) comprising the appropriate radio terminal equipment and speech transcoder. The losses and gains introduced by the test speech transcoder will need to be specified.The POI with the public switched telephone network (PSTN) is considered to have a relative level of 0 dBr, where signals will be represented by 8-bit A-law, according to ITU-T Recommendation G.711. Measurements may be made at this point using a standard send and receive side, as defined in ITU-T Recommendations.Five classes of acoustic interface are considered in this specification:Handset UE;Headset UE;Vehicle Mounted Hands-free UEDesk Top Operated Hands-free UE .Hand-Held Hands-free UE5 Test configurationsThis section describes the test setups for terminal acoustic testing.5.1 Test setup for terminalsThe general access to terminals is described in Figure 1. The preferred acoustic access to 3G terminals is the most realistic simulation of the “average” subscriber. This can be made by using HATS (head and torso simulator) or LRGP (Loudness Rating Guardring Position), with appropriate ear simulation and appropriate mountings for handset terminals in a realistic but reproducible, way to the HATS / LRGP. . Hands-free terminals shall use the HATS or free field microphone techniques in a realistic but reproducible way. Headset measurement methods are for further study, awaiting input from ETSI TC-STQ.HATS is described in ITU-T Recommendation P.58, appropriate ears are described in ITU-T Recommendation P.57 (type 3.3 and type 3.4 ear), a proper positioning of handsets in realistic conditions is found in ITU-T Recommendation P.64 , the test setups for various types of hands-free terminals can be found in ITU-T Recommendation P.581.LRGP is described in ITU-T Recommendation P.64, appropriate ears are described in ITU-T Recommendation P.57 (type 3.2).The preferred way of testing is the connection of a terminal to the system simulator with exact defined settings and access points. The test sequences are fed ineither, electrically using a reference codec or using hedirect signal processing approach or acoustically using ITU-T specified devices.5.1.1 Setup for handset terminalsHATS Method : When using a handset telephone the handset is placed in the HATS position as described in ITU-T Recommendation P.64 . The artificial mouth shall conform with P.58 when HATS is used. The artificial ear shall conform with Rec. P.57, type 3.3 or type 3.4 ears shall be used.LRGP Method : When using a handset telephone the handset is placed in the LRGP position as described in ITU-T Recommendation P.64 . The artificial mouth shall conform with P.51 when LRGP is used. The artificial ear shall conform with Rec. P.57, type 3.2 ear shall be used. Either the high leak or low leak version may be used.5.1.2 Setup for headset terminalsFor further study.NOTE 1: I ncludes DTX functionality.NOTE 2: C onnection to PSTN should include electrical echo control (EEC).Figure 1: 3G Interfaces for specification and testing of terminal narrow-band acoustic characteristics5.1.3 Setup for hands-free terminals5.1.3.1 Vehicle mounted hands-freeVehicle mounted hands-free may be measured either in a vehicle or in an anechoic room. For both of these two types of test environments, the setup will depend on whether HATS or a discrete artificial mouth and discrete microphone are used as the acoustic test equipment.For in-vehicle measurements, if HATS test equipment is used, it should be positioned in the car as per ITU-T Recommendation P. 581. If in-vehicle measurements are made with a discrete microphone and discrete artificial mouth, they should be positioned in the car as per Figure 2 and Figure 3, respectively. The artificial mouth should comply with ITU-T Recommendation P. 51. The microphone should be a pressure-field microphone complying with IEC 60651. The microphone should preferably be fitted with a random incidence corrector. A vehicle simulator may be used instead of an actual car. A standard vehicle simulator is described in ETSI 0358 601 (TR101110) Digital Cellular Telecommunications System (Phase 2+) Charactersation test methods and quality assessment for hands-free mobiles. The hands-free equipment is mounted in the car as specified by the manufacturer.Figure 2: Test Configuration for Vehicle mounted hands-free, receiving characteristics, with discretemeasurement microphone.Figure 3: Test Configuration for Vehicle mounted hands-free, sending characteristics, with discrete P.51 artificial mouth.Specification testing of vehicle-mounted hands-free equipment in an anechoic room is for further study.5.1.3.2 Desktop operated hands-freeFor HATS test equipment, definition of hands-free terminals and setup for desktop hands-free terminals can be found in ITU-T Recommendation P.581. Measurement setup using a free field microphone and a discrete P.51 artificial mouth for desktop hands-free terminals can be found in ITU-T Recommendation P.340.5.1.3.3 Handheld hands-freeEither HATS or a free-field microphone with a discrete P. 51 artificial mouth may be used to measure Hand-Held Hands-free type UE.If HATS measurement equipment is used, it should be configured to the Hand-Held Hands-free UE according to Figure 4. The HATS should be positioned so that the HATS Reference Point is at a distance d HF from the centre point of the visual display of the Mobile Station. The distance d HF is specified by the manufacturer. A vertical angle HF may be speicfied by the manufacturer.Figure 4: Configuration of Hand-Held Hands-free UE relative to the HATS.If a free-field microphone with a discrete P. 51 mouth are used, they should be configured to the Hand-Held Hands-free UE as per Figure 5 for receiving measurements and Figure 6 for sending measurements. The measurement instrument should be located at a distance d HF from the centre of the visual display of the Mobile Station. The distance d HF is specified by the manufacturer.Figure 5: Configuration of Hand-Held Hands-free UE, free-field microphone for receivingmeasurements.Figure 6: Configuration of Hand-Held Hands-free UE, discrete P. 51 artificial mouth for sendingmeasurements.5.1.4 Position and calibration of HATSThe horizontal positioning of the HATS reference plane shall be guaranteed within ±2︒ for testing hands-free equipment.The HATS shall be equipped with either Type 3.3 or 3.4 Artificial Ear. For hands-free measurements the HATS shall always be equipped with two artificial ears. The pinnas are specified in Recommendation P.57 for Types 3.3 and 3.4 artificial ears. The pinna shall be positioned on HATS according to ITU-T Recommendation P.58 .The exact calibration and equalization procedures as well as the combination of the two ear signals for the purpose of measurements can be found in ITU-T Recommendation P.581. For Handheld hands-free UE, the set-up corresponding to 'portable hands-free' in P. 581 should be used.5.2 Setup of the electrical interfaces5.2.1 Codec approach and specificationCodec approach: In this approach, a codec is used to convert the companded digital input/output bit-stream of the system simulator to the equivalent analogue values. With this approach a system simulator, simulating the radio link to the terminal under controlled and error free conditions is required. The system simulator has to be equipped with a high-quality codec whose characteristics are as close as possible to ideal.Definition of 0 dBr point:D/A converter - a Digital Test Sequence (DTS) representing the codec equivalent of an analogue sinusoidal signal whose rms value is 3,14 dB below the maximum full-load capacity of the codec shall generate 0dBm across a 600 ohm load;A/D converter - a 0 dBm signal generated from a 600 ohm source shall give the digital test sequence (DTS) representing the codec equivalent of an analogue sinusoidal signal whose RMS value is 3,14 dBbelow the maximum full-load capacity of the codec.Narrow band telephony testingFor testing a 3G terminal supporting narrow-band telephony, the system simulator shall use the AMR speech codec as defined in 3GPP TS 26 series specifications, at the source coding bit rate of 12,2kbit/s. The transcoding from the output of the AMR speech coding in the system simulator to analogue signals shall be carried out using an ITU-T G.711 codec performing to ITU-T G.712 (4-wire analogue).Wide band telephony testingFor testing a 3G terminal supporting wide-band telephony, the system simulator shall use the AMR-WB speech codec as defined in 3GPP TS26 series specifications, at the source coding bit rate of 19,85kbit/s. The transcoding from the outputof the AMR-WB speech coding in the system simulator to analogue signals shall be carried out using an ITU-T G.711 codec performing to ITU-T G.712 (4-wire analogue).5.2.2 Direct digital processing approachIn this approach, the companded digital input/output bit-stream of the terminal connected through the radio link to the system simulator is operated upon directly. For the purposes of 3G acoustic testing, the direct digital processing shall use the default speech codec, the AMR speech codec as defined in 3GTS26 series specifications, at it‟s highest source coding bit rate of 12,2kbit/s.Narrow band telephony testingFor testing a 3G terminal supporting narrow-band telephony, the system simulator shall use the AMR speech codec as defined in 3GPP TS 26 series specifications, at the source coding bit rate of 12,2kbit/s.Wide band telephony testingFor testing a 3G terminal supporting wide-band telephony, the system simulator shall use the AMR-WB speech codec as defined in 3GPP TS26 series specifications, at the source coding bit rate of 19,85kbit/s.5.3 Accuracy of test equipmentUnless specified otherwise, the accuracy of measurements made by test equipment shall be better than:Unless specified otherwise, the accuracy of the signals generated by the test equipment shall be better than:The measurements results shall be corrected for the measured deviations from the nominal level.The sound level measurement equipment shall conform to IEC 651 Type 1.5.4 Test signalsDue to the coding of the speech signals, standard sinusoidal test signals are not applicable for 3G acoustic tests, appropriate test signals (general description) are defined in ITU-T Recommendation P.50 and P.501. Normative requirements for the use of test signals from P.501 are for further study. For the time being, if test signals from P.501 are used, a multisine signal is recommended. More information can be found in the test procedures described below.For testing the narrow-band telephony service provided by a terminal the test signal used shall be band limited between 100 Hz and 4 kHz with a bandpass filter providing a minimum of 24 dB/Oct. filter roll off, when feeding into the receiving direction.For testing the wide-band telephony service provided by a terminal the test signal used shall be band limited between 100 Hz and 8 kHz with a bandpass filter providing a minimum of 24 dB/Oct. filter roll off, when feeding into the receiving direction.The test signal levels are referred to the average level of the (band limited in receiving direction) test signal, averaged over the complete test sequence . unless specified otherwise.6 Test conditions6.1 Environmental conditions6.1.1 Handset and headset terminalsThe environmental conditions for testing handset and headset UE is specified in §6.1.1 TS 26.132, as follows:For handset and headset measurements the test room shall be practically free-field down to a lowest frequency of275 Hz, the handset or the headset including the HATS / LRGP shall lie totally within this free-field volume.This shall be met if deviations of the ideal free-field conditions are less than +/- 1 dB. Qualification of the testroom may be performed using the method described in either ISO 3745 Annex A, or ITU-T P. 340 §5.4.Alternatively, a test room may be used which meets the following two criteria:1.The relationship between the pressure at the mouth opening and that at 5,0, 7,5 and 10 cm in front of the centre ofthe lip ring is within ±0.5dB of that which exists in a known acoustic free-field.2.The relationship between the pressure at the mouth opening and at the Ear canal Entrance Point (EEP) at both theleft and right ears of the HATS does not differ by more than ±1dB from that which exists in a known free-field.The ambient noise level shall be less than -30 dBPa(A), for idle channel noise measurements the ambient noise level shall be less than –64dBPa(A).Echo measurements shall be conducted in realistic rooms with an ambient noise level less then -64 dBPa(A).6.1.2 Hands-free terminalsHands-free terminals generally should be tested in their typical environment of application. Care must be taken, that e.g. noise levels are sufficiently low in order not to interfere with the measurements.For Desk-Top hands-free terminals the appropriate requirements shall be taken from ITU-Recommendation P.340. The broadband noise level shall not exceed –70 dBPa(A). The octave band noise level shall not exceed the values specified in Table 2.TABLE 2/P.340 Noise levelEcho measurements shall be conducted in realistic rooms with an ambient noise level less then -70 dBPa(A).6.2 System Simulator conditionsThe system simulator should provide an error free radio connection to the UE under test. The default speech codec, the AMR speech codec, s hall be used at it‟s highest bit rate of 12,2kbit/s. Discontinuous Transmission, DTX, (silence suppression) shall be disabled for the purposes of 3G acoustic testing.7 Telephony transmission performance test methods 7.1 ApplicabilityThe test methods in this sub-clause shall apply when testing a UE which is used to provide narrow-band or wideband telephony, either as a stand-alone service, or as part of a multimedia service.7.2 Overall loss/loudness ratings7.2.1 GeneralThe SLR and RLR values for the 3G network apply up to the POI. However, the main determining factors are the characteristics of the UE, including the analogue to digital conversion (ADC) and digital to analogue conversion (DAC). In practice, it is convenient to specify loudness ratings to the Air Interface. For the normal case, where the 3G network introduces no additional loss between the Air Interface and the POI, the loudness ratings to the PSTN boundary (POI) will be the same as the loudness ratings measured at the Air Interface.7.2.2 Connections with handset UE7.2.2.1 Sending Loudness Rating (SLR)a) The test signal to be used for the measurements shall be the artificial voice according to ITU-Recommendation P.50 or a speech like test signal as described in ITU-T Recommendation P.501. The type of test signal used shallbe stated in the test report. The spectrum of acoustic signal produced by the artificial mouth is calibrated under free field conditions at the MRP. The test signal level shall be –4,7 dBPa, measured at the MRP. The test signal level is averaged over the complete test signal sequence.b) The handset terminal is setup as described in subclause 5. The handset is mounted at the HATS or LRGPposition (see ITU-T Recommendation P.64). The application force used to apply the handset against the artificial ear shall be within the range specified in ITU-T Recommendation P.64.The sending sensitivity shall be calculated from each band of the 14 frequencies given in table 1 of ITU-TRecommendation P.79, bands 4 to 17. For the calculation the averaged measured level at the electrical reference point for each frequency band is referred to the averaged test signal level measured in each frequency band at the MRP.c) The sensitivity is expressed in terms of dBV/Pa and the SLR shall be calculated according to ITU-TRecommendation P.79, formula (A-23b), over bands 4 to 17, using m = 0,175 and the sending weighting factors from ITU-T Recommendation P.79, table 1.7.2.2.2 Receiving Loudness Rating (RLR)a) The test signal to be used for the measurements shall be the artificial voice according to ITU-Recommendation P.50 or a speech like test signal as described in ITU-T Recommendation P.501. The type of test signal used shallbe stated in the test report. The test signal level shall be –16 dBm0, measured at the digital reference point or the equivalent analogue point. The test signal level is averaged over the complete test signal sequence.b) The handset terminal is setup as described in subclause 5. The handset is mounted at the HATS or LRGPposition (see ITU-T Recommendation P.64). The application force used to apply the handset against the artificial ear shall be within the range specified in ITU-T Recommendation P.64. The receiving sensitivity shall becalculated from each band of the 14 frequencies given in table 1 of ITU-T Recommendation P.79, bands 4 to 17.For the calculation, the averaged measured level at each frequency band is referred to the averaged test signal level measured in each frequency band.c) The sensitivity is expressed in terms of dBPa/V and the RLR shall be calculated according to ITU-TRecommendation P.79 [16], formula (A-23c), over bands 4 to 17, using m = 0,175 and the receiving weighting factors from table 1 of ITU-T Recommendation P.79 [16].d) No leakage correction shall be applied.7.2.3 Connections with Vehicle Mounted & Desk-Top hands-free UEVehicle mounted hands-free should be tested in the vehicle (for the totally integrated vehicle hands-free systems) or in a vehicle simulator, ref ETSI 0358 601 (TR101110) Digital Cellular Telecommunications System (Phase 2+) Characterization test methods and quality assessment for hands-free mobiles.Free Field measurements for vehicle mounted hands-free are for further study.7.2.3.1 Sending Loudness Rating (SLR)a) The test signal to be used for the measurements shall be the artificial voice according to ITU-Recommendation P.50 or a speech like test signal as described in ITU-T Recommendation P.501. The type of test signal used shallbe stated in the test report. The spectrum of acoustic signal produced by the artificial mouth is calibrated under free field conditions at the MRP. The test signal level shall be –4,7 dBPa, measured at the MRP. The test signal level is averaged over the complete test signal sequence. The broadband signal level then is adjusted to –28,7 dBPa at the HFRP or the HATSHFRP (as defined in P.581) and the spectrum is not altered.。
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PMP21BL - PMP22GR - PMP23SL - PMP24PKCompact Megaphone Speaker Compact Megaphone Speaker with Siren Alarm Mode This user manual contains important information for safe operation and optimal megaphone performance.Please carefully read and follow safety notes and instructions. Save this manual for future reference.Make sure that it is available to all persons using this device.SAFETYThis megaphone is intended to be used only as described in this user manual. Any other use or use under other operating conditions is considered to be improper and may result in personal injury or device damage. Please use the megaphone as described and under supervision if used by children or minors.• Ensure that plastic bags, packaging, etc.• Never let children unattended use electrical devices.• Use proper polarity is observed when inserting batteries. Incorrectly inserted batteries may cause damage and risk of re. • Leaking batteries can cause permanent damage to the device.• Remove batteries if the megaphone will not be used for long periods of time.OPERATING INSTRUCTIONSVoice Mode:• (1) Slide the switch on the rear of the megaphone to voice• (2) Adjust the desired volume level using the rear of the megaphoneSiren Mode:• (1) Slide the switch on the rear of the megaphone to siren• (2) Adjust the desired volume level using the rear slider switchPress the button located near the back, underside of the megaphone. The button will release the lid to reveal the battery compartment. Please see correct battery direction placement on the top side of the opening battery compartment lid. Insert batteries, close the cover and fasten clip until locked.NOTE: Make sure the batteries are inserted correctly observing correct polarity.Features:• Compact Megaphone Speaker• (2) Audio Projection Modes: Voice Talking & Siren Alert • Voice Mode: Ampli es Your Voice as Spoken intothe Microphone• Siren Alert Mode: Ampli es an Emergency tonethrough the Megaphone Speaker• Battery Operated, Requires (4) x ‘C’ Batteries, Not Included • Ergonomic Pistol Grip and Light-Weight Chassis• Quick Folding Handle for Portability• Adjustable Volume Control• Power Saving OFF Switch• For Indoor/Outdoor Use Technical Specs:• Power Output: 20 Watt MAX• Audio Projection Range: Up to 400+ Yards• Battery Operated: Requires (4) x ‘C’ Batteries, Not Included • Dimensions (D x H): 5.40'' x 8.60'' -inches• Weight: 0.96 lbs.。
简单侦探类小说英语作文
In the heart of the bustling city,a mysterious case unfolded,captivating the attention of its citizens and the local police force.The story revolves around a renowned art gallery owner,Mr.Pierre Dupont,who was found murdered in his own gallery one fateful evening.The crime scene was meticulously arranged,with no signs of struggle or forced entry,leading the investigators to believe that the murderer was someone close to Mr. Dupont.The protagonist of our story is Detective Jean Leclair,a seasoned investigator with a keen eye for detail and an uncanny ability to unravel the most complex of mysteries.Upon arriving at the crime scene,Detective Leclair immediately noticed the peculiar arrangement of the art pieces,which seemed to be a clue in itself.The painting of a solitary figure standing on a bridge was slightly askew,and a small,seemingly insignificant,note was found tucked beneath the frame.The note read,The truth lies beneath the eyes of the beholder.Intrigued,Detective Leclair began to scrutinize the gallerys visitors and employees,each with their own motives and alibis.Among them were:1.Madeleine Rousseau,the gallerys curator,who had a tumultuous relationship with Mr. Dupont due to disagreements over the curation of the art collection.2.Lucien Moreau,a struggling artist whose work had been rejected by Mr.Dupont multiple times,harboring a deep resentment towards the gallery owner.3.Henrietta Dubois,a wealthy patron of the arts who had a secret affair with Mr.Dupont, and was rumored to have been involved in some shady dealings with him.4.Gaston Lefèvre,the gallerys security guard,who had access to the premises and was known to have gambling debts that he could not repay.As the investigation progressed,Detective Leclair discovered that the painting with the note was not an original piece but a forgery.This revelation led him to the underground world of art forgery,where he found a connection between Mr.Dupont and a notorious forgery ring.The ringleader,known only as The Master,had a reputation for ruthlessly eliminating anyone who threatened to expose their operation.Through a series of clever deductions and a bit of luck,Detective Leclair managed to piece together the puzzle.The truth was that Mr.Dupont had discovered the forgery ring and was planning to expose it to the authorities.In a desperate attempt to protect their operation,The Master had orchestrated Mr.Duponts murder,using one of the gallery employees as an unwitting accomplice.The climax of the story occurs when Detective Leclair confronts The Master during ahighstakes art auction,where a rare and valuable painting is being sold.With the help of his trusted partner,Detective Leclair manages to apprehend the elusive criminal,bringing an end to the forgery ring and avenging Mr.Duponts death.The story concludes with a sense of justice served,as the truth behind the murder is revealed,and the guilty parties are brought to justice.Detective Leclairs reputation as a brilliant investigator is further solidified,and he is celebrated for his unwavering commitment to uncovering the truth,no matter how deeply it is buried.。
JBL HTI6、HTI8、HTI55和HTI6C壁墙扬声器系列用户指南说明书
OWNER’S GUIDEINCLUDEDTemplate/paint shield (punch out at perforation).One pair of speakers with grilles.(punch out at perforation).One pair of speakers with grilles.THANK YOU FOR CHOOSING JBLHTI6,HTI8For more than 50 years, JBL has been involved in every aspect of music and film recording and reproduction,from live performances to monitoring the recordings you play in your home, car or office.We’re confident that the JBL loudspeakers you have chosen will provide every note of enjoyment that youexpected – and that when you think about purchasing addi-tional audio equipment for your home, car or office, you will once again choose JBL.Please take a moment to register your product on our Web site at . It enables us to keep you posted on our latest advancements,and helps us to better under-stand our customers and build products that meet their needs and expectations.JBL Consumer ProductsHTI55One loudspeaker with grille.Logo to be attached to grille depending on vertical or horizontal installation.Template/paint shield(punch out at perforation).23Front Speakers (HTI6,HTI8,HTI55)Models HTI6,HTI8 and HTI55 as Rear SpeakersModel HTI6C in CeilingSPEAKER PLACEMENTProper placement of thespeakers is an important step in obtaining the most realistic soundstage possible. These recommendations are for the optimum placement of the loud-speakers. Use these placement recommendations as a guide.Slight variations will not dimin-ish your listening pleasure.The front speakers should be placed the same distance from each other as they are from the listening position. They shouldbe placed at about the same height from the floor as the listeners’ ears will be, with the tweeters aimed toward the listening position at ear-level height.Model HTI55 is suitable for the front left, center and right posi-tions, and it may also be used as a side surround or surround back speaker. It may bemounted horizontally or verti-cally, but make sure to position it so that the tweeters for all of the front speakers are at the same height (or differ by no more than 2 feet). You may rotate the tweeter to correctly orient the JBL logo.In a home theater configura-tion, the two surround speakers should be placed slightly behind the listening position and, ideally, should face eachother and be at a level higher than the listeners’ ears. If that is not possible, they may be placed in a wall behind the lis-tening position, facing forward.The rear wall is the required mounting position for the sur-round back speakers in 6.1- and 7.1-channel system. The sur-round speakers should not call attention to themselves. They should provide a diffuse, ambi-ent sound accompanying themain program material heard in the front speakers. In Dolby*Digital and DTS ®systems, aim the tweeters toward the listen-ing position at ear-level height.Phillips #2 screwdriverMeasuring tape Utility knifePencilAwlTools NeededThe JBL HTI Series in-wallspeakers were designed to beeasily installed. However, ifyou are unsure of your abilityto properly install these loud-speakers, please contact yourdealer or a qualified installer.INSTALLATIONSpeakers and electronicsterminals have corresponding(+) and (–) terminals. Mostmanufacturers of speakers andelectronics, including JBL, usered to denote the (+) terminaland black for the (–) terminal.It is important to connect bothspeakers identically: (+) on thespeaker to (+) on the amplifierand (–) on the speaker to (–)on the amplifier. Wiring “outof phase” results in thin sound,weak bass and a poor stereoimage. With the advent of multi-channel surround-soundsystems, connecting all ofthe speakers in your systemwith the correct polarityremains equally important inorder to preserve the properambience and directionalityof the program material.Wire Length Recommended SizeUp to 20 ft.16 gaugeUp to 30 ft.12 gaugeGreater than 30 ft.10 gaugeThe wires for both speakersshould be the same length. Ifone speaker is placed closerto the amplifier than the other,hide the excess wire behindthe wall.SPEAKER CONNECTIONS45HTI6,HTI8,HTI55EXISTING CONSTRUCTIONRemove the grille from thespeaker frame by pulling on the paper tab. If the tab is missing,to avoid scratching the grille or baffle you may unfold a paper clip, insert the straight end through one of the holes in thegrille, and gently pull up.Determine the correct speaker location.Note:Remove the inner tem-plate, which is the paint shield,at the perforation. Use the outer template when cutting the dry-wall. Although the HTI55 may be oriented either horizontally or vertically, the installation procedure is the same.Note:Always allow at leastone-half inch between a wall stud and the speaker cutout or the locking tabs will not be able to swivel into place.Cut the drywall.Connect the speaker wiresto the speaker.Replace the metal grille. For the HTI55 only, attach the JBL logo to the grille to correspond tovertical or horizontal installation.Place the frame assembly in the wall.Screw down each of the four (six for HTI55) Phillips head screws. The locking tabs will swivel into place and secure the unit to the rear surface ofthe drywall.The HTI speakers feature unique swivel mounts for the tweeters that enable you to aim the very directional high frequencies toward thelistening position, at ear-level height. Before installing the speaker grille, gently press on the outer edge of the tweeter mount to adjust the position of the tweeter. The tweeter will not swivel more than 15degrees in any direction; do not attempt to force it to move further. You may also rotate the tweeter to orient the JBL logo as desired.HTI6CEXISTING CONSTRUCTIONRemove the grille from thespeaker frame by pulling on the paper tab. If the tab is missing,to avoid scratching the grille or baffle you may unfold a paper clip, insert the straight end through one of the holes in thegrille, and gently pull up.ing tabs will not be able to swivel into place.Connect the speaker wires to the speaker.Place the frame assemblyin the wall.Screw down each of the three Phillips head screws. The locking tabs will swivel into place and secure the unit to the rear surface of the drywall.Replace the metal grille.Use the outer template when cutting the drywall. The HTI speakers feature unique swivel mounts for the tweeters that enable you to aim the very directional high frequencies toward thelistening position, at ear-level height. Before installing the speaker grille, gently press on the outer edge of the tweeter mount to adjust the position of the tweeter. The tweeter will not swivel more than 15degrees in any direction; do not attempt to force it to move further. You may also rotate the tweeter to orient the JBL logo as desired.6NEW CONSTRUCTION PAINTING THE SPEAKER FRAME AND GRILLEJBL HTI Series loudspeakers can be painted to match any decor. If you wish to change their color, the satin finish on the grille and frame will function as a primer coat. Before painting, install the paint shield (in the assembly kit) securely into the recess in the baffle. This will protect the speaker componentsand baffle from paint residue.Use a high-quality spray paint,and apply a thin coat of color.Be certain the grilleperforations remainfree of paint.Fillingthem with paint willdiminish the soundquality.Note:Gently remove theacoustical foam blanket from thegrille before painting. Reattachthe blanket after the paint hasdried.You will need to purchase the correct rough-in frame kit for your model: Speaker Model Rough-in Frame KitHTI6RIF6HTI8RIF8HTI55RIF55HTI6C RIF6CDetailed installation instructions are supplied with the rough-in kit. TROUBLESHOOTINGIf there is no sound from any of the speakers:• Check that receiver/amplifier is on and a source is playing.• Check all wires and connections between receiver/amplifier and speakers. Make sure all wires are connected. Make sure none of the speaker wires are frayed, cut or punctured.• Review proper operation of your receiver/amplifier.If there is no sound coming from one speaker:• Check the “Balance” control on your receiver/amplifier.• Check all wires and connec-tions between receiver/amplifier and speakers. Make sure all wires are connected. Make sure none of the speaker wiresare frayed, cut or punctured.In multichannel applications,make sure that your receiver orprocessor has been configuredto enable all channels that youare using.If there is low (or no)bass output:• Make sure the connectionsto the left and right “SpeakerInputs” have the correct polarity(+ and –).• Consider adding a poweredsubwoofer to your system.• In Dolby Digital or DTSmodes,make sure your receiver/proces-sor is correctly configured. Whenusing a subwoofer, make surethe subwoofer output of thereceiver/processor has beenenabled. If no subwoofer isbeing used, make sure theleft and right front and rearspeakers have been config-ured as “LARGE.” See yourreceiver/processor’s owner’smanual for futher information oncorrect speaker configuration inDolby Digital, DTS and othersurround-sound modes.If the system plays atlow volumes but shutsoff as volume isincreased:• Check all wires and connec-tions between receiver/amplifierand speakers. Make sure allwires are connected. Make surenone of the speaker wires arefrayed, cut or punctured.• If more than one pair of mainspeakers is being used, check theminimum-impedance require-ments of your receiver/amplifier.7†*HTI6Frequency Response38Hz – 20kHz (–10dB)RecommendedMaximum AmplifierPower †100 wattsImpedance8 ohms nominalSensitivity88dB (2.83V/1m)Crossover Frequency2,500HzWoofer6-1/2" Polymer-coated aluminumcone w/rubber surroundTweeter1"Pure-titanium dome,w/Elliptical Oblate Spheroidal™(EOS) waveguide, and swivel mountPlate Size (W x H)8-1/2" x 11" (216mm x 279mm)Mounting Cutout Size(W x H)7-1/8" x 9-11/16" (181mm x 246mm)Mounting Depth3-7/8" (98mm)Weight per Speaker11 lb (5kg)HTI8Frequency Response30Hz – 20kHz (–10dB)RecommendedMaximum AmplifierPower †120 wattsImpedance8 ohms nominalSensitivity90dB (2.83V/1m)Crossover Frequency2,500HzWoofer8" Polymer-coated aluminumcone w/rubber surroundTweeter1"Pure-titanium dome,w/Elliptical Oblate Spheroidal™(EOS) waveguide, and swivel mountPlate Size (W x H)10-1/8" x 13-1/8" (257mm x 333mm)Mounting Cutout Size(W x H)8-7/8" x 11-13/16" (225mm x 300mm)Mounting Depth4" (102mm)Weight per Speaker13.5 lb (6.1kg)HTI55Frequency Response40Hz – 20kHz (–10dB)RecommendedMaximum AmplifierPower †120 wattsImpedance8 ohms nominalSensitivity88dB (2.83V/1m)Crossover Frequency2,000HzWooferDual 5" polymer-coated aluminumcone w/rubber surroundTweeter1"Pure-titanium dome,w/Elliptical Oblate Spheroidal™(EOS) waveguide, and swivel mountPlate Size15-3/8" x 7-1/2" (391mm x 191mm)Mounting Cutout Size14" x 6" (356mm x 152mm)Mounting Depth3-7/8" (98mm)Weight per Speaker5.7 lb (2.6kg)HTI6CFrequency Response40Hz – 20kHz (–10dB)RecommendedMaximum AmplifierPower †100 wattsImpedance8 ohms nominalSensitivity88dB (2.83V/1m)Crossover Frequency2,000HzWoofer6-1/2" Polymer-coated aluminumcone w/rubber surroundTweeter1"Pure-titanium dome,w/swivel mountPlate Size (Diameter)9-3/16" (233mm)Mounting Cutout Size(Diameter)7-7/8" (200mm)Mounting Depth4-1/4" (108mm)Weight per Speaker10 lb (4.5kg)Gary Mardell SPECIFICATIONS。
Testing Acoustic Frequency Response
Chan Pui Yuen, Alvis Hong Kong alvischan900@
1
Download Link
• You can download my loudspeaker test software from Google Code: • /p/alvis-labviewloudspeaker-test/
Software Signal Generation
Sound card play and read simultaneously
Clip detection
Display warning if sound card input clipped
9
7
Impulse Response and Waterfquency response test is done, an impulse response will be calculated and displayed in this page. The graph and data operation buttons are similar to the page “Frequency Response”. By selecting the window size with the 3 cursors, a Waterfall plot will be generated for time frequency analysis. It is a common function in loudspeaker testing software. From left to right, the 1st cursor represent the start time, 2nd cursor is the end time, 3rd cursor is data end point. A right hand side Hanning Window is applied.
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A BSTRACTThe impulse response c[n] characterizing the system of a loudspeaker and a microphone placed in a closed room contains information on the electroacoustical properties of loudspeaker and microphone as well as the acoustical properties of the room.The corresponding transfer function C(z) offers information on the magnitude and phase of the system when regarded as a digital filter. A part of this phase, the excess phase, gives rise to problems when reaching for mathematically perfect equalization of the system. It is a fact however that phenomena which appear through analysis of C(z) might not be perceivable to the human ear.We have shown that, unfortunately, the excess phase contribution is audible in con-trolled listening tests. That is, it can not be neglected in the design of equalization systems.1.I NTRODUCTIONIn high-fidelity reproduction of sound a crucial point is to obtain as little coloration as possi ble due to the reproducti on system. We wi ll defi ne the term colorati on as ampli tude as well as phase distortion. Whenever signals are recorded, steps are taken to ensure that the recordi ng system i tself does not contri bute si gni fi cantly to the recordi ng - at least not in the frequency range where human beings perceive sound. Microphones and analog/di gi tal recordi ng equi pment can i n general be desi gned to affect the signals only very little.(2.1) But when the recordi ng i s played back colorati on effects are certai nly i mposed. These effects come from the necessary voltage-to-pressure transducer, a loudspeaker or a pair of headphones. Additionally, the sound waves generated by the loudspeaker cone must travel trough a room to reach the ear. Hence the acoustical charachteristics of the room plays a role too, and the effect due to these is normally more significant than that of the loudspeaker itself.The system consisting of loudspeaker and room can be modelled as a digital filter, by accepting some limitations, henceforth referred to as C(z). The goal is then to design an electrical equalization filter H(z) that cancels theimpacts from the loudspeaker/room system, see fig. 1.Varoi us attempts have been made to i ncorporate equali zati on i n reproducti on systems, see [1] - [5]. Some subtle listening tests e.g. [6] - [8] have shown that also phase changes influence the perception. Few of these investigations however concern excess phase in the transfer function of loudspeaker and listening room. A recent work in this field [9] indicates through preliminary listening tests that phase changes in such transfer functions are in fact audible even with common music recordings as test material. A remarkable result si nce nonli near phase changes mi ght gi ve ri se to difficulties in equalization tasks.2.S YSTEM IMPULSE RESPONSESDesign of equali zati on fi lters requi res knowledge of the loudspeaker/room system either as temporal or spectral information. When an electrical impulse is applied to the loudspeaker it produces a sound pressure impulse, and when this travels through the room and i s recorded by a mi crophone the output, called c[n], can be regarded as unambi guous information on the colorations introduced in that specific playback path By Z-transforming this impulse response thus obtaining the transfer function C(z) the deviations from the ideal situation, i.e. unity gain for all frequencies and linear phase, are revealed. The Z-transformed response, allthough non-parameter zed, can be regarded as one generated by a di gi tal fi lter, and i t i s qui te obvi ous that the i deal equalization filter must then comply with eq. 2.1.The spectral i nformati on i n C(z) i s remarkably changed i f the loudspeaker and mi crophone positions are varied just slightly [10]. Furthermore, the human hearing works binaurally. Hence two transfer functions are evoked and for higher frequencies(2.2)(2.3) these are indeed not alike because of aural shadowing of the head. Even stationarity can not be assumed. When the head moves, the two transfer functions become time dependent.What we consider here is only the theoretical /mathematical part of the equalization task and even then di ffi culti es wi ll most certai nly ri se attempti ng to carry out the di vi si on i n eq. 2.1. Consi der C(z) as the rati o of two rati onal polynomi als wi th M respecti vely N distinct roots as in eq. 2.2. Since C(z) is in fact not a genuine parametric filter we must presume the numbers M and N to be large (perhaps infinite) and non-determinable. Nevertheless this model is resonable.When some of the zeros z in C(z), i.e. the roots of B(z) fall outside the unit circle injthe Z-plane, the inversion is simply not possible. The poles become zeros and vice versa through inversion, it is therefore a basic requirement that the roots of B(z) must be located entirely inside the unit circle. Unfortunately, that is most often not the case.Systems with zeros inside the unit circle only are called minimum phase systems, and we shall use the term excess phase systems for those with zeros outside the unit circle only. Hence, any transfer function C(z) can be decomposed into a product of aminimum phase part and an excess phase part according to eq. 2.3 with C(z) possiblyepalso containing a pure delay.Now, an i mportant feature of the decomposi ti on i n eq. 2.3 i s that all magni tudei nformati on of C(z) is held in C(z) whereas the magnitude of C(z) always will bemp epunity and thus C(z) consti tutes an allpass fi lter. Accordi ng to the arrangement of epzeros of minimum phase functions we can invert C(z) but not C(z), see [2] and [12],mp epmeaning we can compensate for the magnitude and the minimum phase of the system transfer function but not the excess phase.If excess phase however do not contribute with any significant audible phenomena we do of course not need to worry about i t not bei ng equali zed. Si nce excess phase usually do undertake an extensi ve part of the enti re phase of a loudspeaker/room transfer function it is worth while to investigate its audibility in order to get a measure of how severe this commonly accepted omission in fact is.(3.1)3.H OMOMORPHIC DECONVOLUTIONThe experi ments thus requi re a method to separate the mi ni mum phase and the excess phase parts of an impulse response. Such separation can be accomplished by employing the techniques of homomorphic deconvolution [11]. Homomorphic deconvolut on takes advantage of a si gnal analysi s domai n i n whi ch transformed si gnals are called cepstra. It can be shown that if a signal contains minimum phase only then its cepstrum will turn out to be causal. Similarly, given a causal cepstra it is ensured that it represents a time domain signal containing minimum phase only. Consequently the minimum phase part of a signal can be extracted by first forming the cepstrum, then delete any non-causal information, and finally turning back to the time domain. Transformati on from the ti me domai n can be executed by employi ng the Discrete Fourier Transform in the following three steps:•Perform Fourier Transform of the sequence s[n].•Take the natural logarithm of the absolute value.^•Perform inverse Fourier Transformation yielding the cepstrum s[n].Because of the finite resolution in computable L-points Discrete Fourier Transforms this algorithm can only be an approximation [12]. In mathematical terms it becomes:The most important property of this transformation is perhaps the introduction of a nonlinear operator - the logari thm. The cepstrum exhi bi ts as a consequence the property of mappi ng the convoluti on operati on i n the ti me domai n i nto addi ti on through the three relationships of the filtering operation:time domain-convolution / deconvolution frequency domain-multiplication / division cepstral domain-addition / subtractionThe extracti on of C(z) from C(z) i nvolves deconvoluti on, and now i t becomesmppossi ble to perform deconvoluti on si mply by subtracti on, operati ng i n the cepstral domai n. Hence, if the non-causal part of the cepstrum is subtracted (i.e. removed), the resulting causal cepstrum represents a minimum phase system. The scheme of phase splitting linear systems is depicted in fig. 2. The minimum phase part is found in the cepstral domain by multiplying s[n] with an appropriate window l, leaving only the^mincausal part of the cepstrum, see eq. 3.2, where u[n] i s the uni t step functi on. The(3.2)(3.3)(3.4)(3.5)(3.6) excess phase part is then determined in the frequency domain by dividing the spectrum of the minimum phase part into the original spectrum according to eq. 2.3. Allthough the above mentioned method is employed through this work another way of obtaining the minimum phase part of an impulse response is to take advantage of the properti es of the Hi lbert Transform (HT), see e.g. [13]. Thi s transform li nks together magni tude and mi ni mum phase, so that mi ni mum phase can be deri ved unambi guously from the magnitude, see eqs. 3.3 - 3.6. If one is restricted to operate with relatively small lengths of DFT the Hilbert Transform method is more accurate.4.L ISTENING TEST CONDITIONSIf we take an isolated look at the magnitude of the frequency spectrum of an excess phase part we will expect an almost unmeasurable impact. It is known however that the human hearing system simultanously employs both time- and frequency domain information. Methods for simultanous time- and frequency analysis do exist [9], [14] -[17] but no unambigous connection between these methods and the hearing seems to have been proven. So i t i s necessary to turn to a subjecti ve analysi s method, - the li steni ng test, see e.g. [18]. There are numerous ways to plan and i mplement such tests, and standards have been made to ensure some kind of objectivity, see e.g. [19]. The test in this work is very simple. It will just be a matter of judging if there is a difference between two signals or not.4.1 Two related experimentsThe excess phase part of an impulse response can now be extracted and regarded as a filter, and it is obvious to compare a signal modified by this filter with an unmodified version. In real li fe however the excess phase exi sts uni solated i n conjuncti on wi th mi ni mum phase and magnitude which leads to the question: Will the isolated effects of excess phase be masked sufficiently by minimum phase and magnitude?Hence two experimental scenaria are of interest given the excitation signal s[n] and a loudspeaker/room i mpulse response c[n]. One i n whi ch an unmodi fi ed si gnal i s compared with the exces phase filtered signal, and another in which a minimum phase filtered signal is compared with a signal filtered by the entire response:EXPERIMENT 1 A s[n]B s[n]c[n]ephEXPERIMENT 2 A s[n]c[n]mphB s[n]c[n]c[n]mph eph4.2 Excitation signalsIn order to comply with statistics and in order to reveal possible signal dependencies we chose three different excitation signals - everyday well known types of signals:a) A female voiceb) A male voicec) A guitar soloAll three are recorded anechoi cally, i.e no si gni fi cant transfer functi on colourati on i mposed, and are sampled from the Compact Disc, "Music for Archimedes", CD B&O 101 1992. It is common to use artificial signals as well, e.g. white noise but since this experiment is characterized by a somewhat random phase, it is considered not well suited. The signals are of length app. 6 sec. each which is a reasonable compromise between the short term memory of the ear and time to get a good impression of the signal properties.4.3 Loudspeaker & roomsIn fi gs. 3-5 are shown the characteri sti cs of the loudspeaker, a KEF 107. Its magni tude deviation from 0dB is less than ±2dB in the range 60Hz to 12kHz. It is assumed that the phase contri buti on from the mi crophone, bei ng a B&K 4133, i s negligible in the range 60Hz to 12kHz.We chose for the experiment not only one room impulse response. In fact we tested for three di fferent si tuati ons: Two i nherently di fferent i mpulse responses from two di fferent rooms called R1 and R2, these being of length 300msec. and for room R1 also a shorter version of 150msec. In figs. 6-11 are shown the three characteristics in both time and frequency domains. Room R1 is a standard listening room with reverberation time 0.45sec. Room R2 is larger and less damped having a reverberation time of 0.6sec.After 300msec. the response of room R1 is down 40dB (20dB for 150msec.), and for room R2 i t i s down 30dB. The mi ni mum- and excess phase parts are found by the method depicted in sec. 3 and the time domain response, the magnitude spectrum, and the phase spectrum of these are shown in figs. 12-29.4.4 Obtaining impulse responsesThe impulse responses c[n] are obtained by use of a PC based MLSSA system. That is a Max i mum Length Sequence no i se burst, denoted a[n], is generated and transm i tted through a loudspeaker positioned in the room. By a microphone positioned elsewhere in the room the resulting sound pressure, b[n], is recorded, and because of the special cross correlation properties between a[n] and b[n], the spectral properties of the impulse response c[n] equal those of b[n]. The delay in c[n] due to the physical distance between loudspeaker and microphone is removed since it does not represent any colourat i on. Each response i s obta i ned as the average of 20 independent measurements in order to cancel out additive random noise. The noise burst a[n] needs not to be measured since it is artificially generated and therefore well known.We are not reachi ng for thorough determi nati on of the room acousti cs but only searchi ng for an arbitrary but representative loudspeaker/room transfer function. Thus the only constraint on the arrangement of loudspeaker and microphone is to place the latter in a diffuse sound field.All signals and responses are sampled at 48kHz and bandlimited upwards to 12kHz and downwards to 60Hz, si nce no si gni fi cant si gnal energy appears outsi de these boundari es.4.5 Test sequencesEach test signal applied to each test object in the two tests yield 18 AB pairs. To enhance statistics and to reveal the amount of consistency each pair is presented both forwards AB and backwards BA. Thus 36 test sequences emerge. The test sequencesare recorded on DAT in random order, and the task for the test persons is after each sequence to judge whether or not they beli eve i n a di fference between A and B. Of course, there is for all 36 sequences a difference - the question is whether or not it is audible.4.6 Implementation of the test10 persons were submitted to the experiment. They were not tested for their hearing capability. It must be assumed that when the phase modifications are imposed in the wide frequency range 60Hz to 12kHz, it will not be necessary to evaluate for frequency dependent hearing losses. All test persons were aged 20-25 and we may thus discard the effects of high frequency hearing loss due to age.The test sequences were presented through headphones - diotically at an individually adjusted 'pleasant' level. The persons were asked if the level was too low or too high in order to comply with their individually most comfortable levels. The headphones used were AKG K240DF. The reason for the cho ce of headphones nstead of loudspeakers is the desire to minimize disturbing phase contributions.5. R ESULTSSince 10 persons li stened to 36 sequences, the number of judgements are 360. Of those there were 243 votes for a perceivable difference, that is a 'there-is-difference'score of 68%. In the following table the results are given as function of each parameter.Since i n these experi ments we do not expli ci tly know the a pri ori probabi li ty of a 'there-i s-di fference' answer, it is only possible to carry out a statistical test confirming or rejecting the obvious hypothesis: The excess phase contributions are not significantly audible, by accepting a harsh estimate of the 'there-is-difference' propabality based on the exper i ment. Such est i mat i on i s not cons i dered, s i nce rel i able results must presumably imply a larger statistical material.E XPERIMENTAL ISSUE N UMBER OF VOTEStotal there-is-differenceE XPERIMENT NO . 1180 160 89% E XPERIMENT NO . 2180 83 46%R OOM R1240 139 58%R OOM R2120 103 86%R ESPONSE LENGTH 150msec.120 74 62%R ESPONSE LENGTH 300msec.240 168 70%E XCITATION SIGNAL A)120 89 74%E XCITATION SIGNAL B)120 100 83%E XCITATION SIGNAL C)120 55 46%The test persons show excellent consistency. Testing for reverse-sequence consistency shows that of all 'there-is-difference' votes 51% is given on AB sequences and 49% on BA sequences. Hence there is no bias and the votes on AB sequences and BA sequences are equal reliable.6.D ISCUSSIONNow, it is obvious to pose the following questions:•Why are the number of 'there-is-difference' votes in test no. 2 significantly lower than in test no. 1?•Why do the three excitation signals yield different number of 'there-is-difference' votes?•Why does a long impulse response cause greater impact than a short one?•Why are impulse responses from different rooms yielding different results?The results listed in sec. 5 clearly indicate that it is not indifferent whether excess phase is thrown away. Considered as an isolated filter in experiment 1, it affects an anechoic signal sufficiently for the human ear to detect it almost every time. This is not a reali sti c si tuati on however. The excess phase appears as part of the enti re i mpulse response, and when we try to remove it, the audible difference from the entire response i s much less that before, despi te the fact that i n both experi ments the absolute difference in signals is the same. This result indicates that the main part of an impulse response (the minimum phase part which holds the magnitude information) is able in some sense to mask the effects of the excess phase.Another result of the experiments is that when room reverberation time increases,the excess phase effects become more audi ble, and when the length of the i mpulse response is increased the same happens. In both cases it can be explained by the fact that the excess phase part increases in relation to the minimum phase part.We can also see that the audible impacts are most significant when a male voice is used, slightly decreasing effects on female voice, and a remarkable decrease when it comes to guitar music. One possible explanation is that speech signals contain some short moments of almost si lence where the effects of reveberati on (and thus excess phase) will be emphasized.In loudspeaker/room equalization tasks one of the major signal processing issues are whether or not to deal with the excess phase in the response. Since Ohm in the last century clai med that percepti on of sound only depends on i ts frequency domai n magni tude i t has been wi dely di scussed to what extent phase changes are audi ble.Experiment have shown clear audibility and others none at all - the answers depending highly on the specific test parameters.7. C ONCLUSIONSSo far i t has rema i ned unanswered whether or not the excess phase i n a loudspeaker/room transfer function is audible. Our experiments have clearly shown that it is in fact perceivable. We have also accomplished to show which parameters influence the degree of audibility.The conclusion must be: We can not allow the excess phase to be neglected, and we will have to get arround the equalization task in another way. One possible solution is to i ntroduce a delay i n the transfer functi on [12] thus enabli ng the possi bi li ty of noncausal equali zati on transfer functi ons. Another way i s to multi ply the transfer functi on with an unstable allpass filter thus matching the zeros outside the unit circle with equally placed poles [13]. In order to seal the excess phase zeros thi s method requi res strict knowledge on the arrangement of the zeros through a very thorough system identification process.But even if a total equalization could be accomplished we must remember that there are still heavy practical problems left. The fact that these kinds of equalization are based on one unique playback path from loudspeaker to the listener giving one unique transfer function on which to operate is perhaps a too gross simplification of reality.Works deal i ng w i th these pract i cal problems often tend to use some k i nd of adaptab i l i ty of the fi lters [3] - [5] someti mes based on an average of more i mpulseresponses [20] ri si ng from di fferent recei vi ng posi ti ons i n the room. In such cases subtle phase effects can, no matter how important, of course not be taken into account. In headphone reproducti on however a major part of these problems are removed. Magni tude/mi ni mum-phase equalization of headphone transfer functions is possible yielding increased performance. Again, in this situation the excess phase contribution survives and the audible impact must resemble that found in experiment 1.8.R EFERENCES[1] C. Bean and P. Craven, "Loudspeaker and room correction using digital signal processing." Presented atthe 86th Convention 1989, Hamburg. An Audio Engineering Society preprint.[2]J. Mourjopoulos, "Digital equalization methods for audio systems." Presented at the 84th Convention 1988,Paris. An Audio Engineering Society preprint.[3]J. Kuriyama and Y. Furukawa, "Adaptive Loudspeaker System," J. Audio Eng. Soc., Vol 37, No. 11, 1989November.[4]R. P. Genereux, "Adaptive Loudspeaker Systems: Correcting for the Acoustic Environment." Presented atthe AES 8th Int. Conference, Washington D.C. May 1990.[5]P. G. Craven and M. A. Gerzon, "Practical Adaptive Room and Loudspeaker Equaliser for Hi-Fi Use."Presented at the 92nd Convention 1992, Vienna.[6] D. Preis, "Phase Distortion and Phase Equalization in Audio Signal Processing - A Tutorial Review," J.Audio Eng. Soc., Vol 30, No. 11, 1982 November.[7]R. Plomp and H. J. M. Steeneken, "Effect of Phase on the Timbre of Complex Tones," J. Acoust. Soc. Am.46 part 2, 1969.[8] F. A. Bilsen, "On the Influence of the Number and Phase of Harmonics on the Perceptability of the Pitchof Complex Signal," ACUSTICA Vol. 28, 1973.[9]L. G. Johansen and P. Hazell, "Joi nt Ti me-Frequency Analysi s Tools: Appli cabi li ty i n the Desi gn ofLoudspeaker/room nterface Equal zat on F lters." M. Sc. thes s, Aalborg Un vers ty, Inst tute for Electronic Systems 1994.[10]J. A. Pedersen et al., "The Di stri buti on of the Low Frequency Sound Fi eld and i ts Relati on to RoomEqualization." Presented at the 96th Convention 1994 February, Amsterdam.[11] A. V. Oppenheim and R. W. Schafer, "Discrete-Time Signal Processing," Prentice-Hall International Inc.1989.[12]S. T. Neely and J. B. Allen, "Invertibility of a room impulse response," J. Acoust. Soc. Am. 66 (1) July1979.[13] A. Ambardar, "Analog and Digital Signal Processing," PWS Publishing Company, Boston 1995.[14]L. Cohen, "Time-Frequency Distributions - A Review," Proceedings of the IEEE, vol. 77, no. 7, July 1989.[15] C. P. Janse and A. J. M. Kaizer, "Time-Frequency Distributions of Loudspeakers: The Application of theWigner Distribution," J. Audio Eng. Soc., Vol 31, No. 4, 1983 April.[16] F. T. Agerkvist, "Time-Frequency analysis with temporal and spectral resolution as the human auditorysystem." The Acoustics Laboratory, Technical University of Denmark.[17]N. Yen, "Ti me and frequency representati on of acousti c si gnals by means of the Wi gner di stri buti onfunction: Implementation and interpretation," J. Acoust. Soc. Am. 81 (6) June 1987.[18] F. E. Toole, "Listening Tests - Turning Opinion into Fact," J. Audio Eng. Soc., Vol 30, No 6, 1982 June.[19]CCIR - Recommendation 562-2 (1993): Subjective assessment of sound quality.[20]S. J. Elliott and P. A. Nelson, "Multiple-Point Equalization in a Room Using Adaptive Digital Filters,"J. Audio Eng. Soc., Vol 37, No 11 1989 November.Figure 1: The equalizer and loudspeaker/room systemFigure 2: Phase splitting by homomorfic deconvolution。