MMSZ5251BT1中文资料 - 360文档中心

MMSZ5235B

Type Number
MMSZ5221B MMSZ5223B MMSZ5225B MMSZ5226B MMSZ5227B MMSZ5228B MMSZ5229B MMSZ5230B MMSZ5231B MMSZ5232B MMSZ5233B MMSZ5234B MMSZ5235B MMSZ5236B MMSZ5237B MMSZ5238B MMSZ5239B MMSZ5240B MMSZ5241B MMSZ5242B MMSZ5243B MMSZ5244B MMSZ5245B MMSZ5246B MMSZ5248B MMSZ5250B MMSZ5251B MMSZ5252B MMSZ5253B MMSZ5254B MMSZ5255B MMSZ5256B MMSZ5257B MMSZ5258B MMSZ5259B
6.30
20
6.2
5.89
6.51
20
6.8
6.46
ቤተ መጻሕፍቲ ባይዱ
7.14
20
7.5
7.13
7.88
20
8.2
7.79
8.61
20
8.7
8.27
9.14
20
9.1
8.65
9.56
20
10
9.50
10.50
20
11
10.45
11.55
20
12
11.40
12.60
20
13
12.35
13.65
9.5
14
13.30
14.70
【领先的片式无源器件整合供应商—南京南山半导体有限公司】

JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD

MMSZ5242中文资料

Cathode Mark
.152 (3.85) .140 (3.55) .112 (2.85) .100 (2.55)
Top View
max. .004 (0.1)
max. .053 (1.35)
min. .010 (0.25)
max. .006 (0.15)
.067 (1.70) .055 (1.40)
50 25 15 10 5.0 5.0 5.0 5.0 5.0 5.0 3.0 3.0 3.0 3.0 3.0 3.0 2.0 1.0 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1
1.0 1.0 1.0 1.0 1.0 2.0 2.0 3.0 3.5 4.0 5.0 6.0 6.5 6.5 7.0 8.0 8.4 9.1 9.9 10 11 12 13 14 14 15 17 18 19 21 21 23 25 27 30 33 36 39 43 46 47 52 56
NOTES: (1) The Zener Impedance is derived from the 1kHz AC voltage which results when an AC current having an RMS value equal to 10% of the Zener current (IZT or IZK) is superimposed on IZT or IZK. Zener Impedance is measured at two points to insure a sharp knee on the breakdown curve and to eliminate unstable units. (2) Measured with device junction in thermal equilibrium.

MMSZ11中文资料

POWER: 0.5 Wa t VOLTAGE RANGE: 2.4 - 7 5VMMSZ2V4 - MMSZ75SymbolValueUnitTotal Power Dissipation on FR-5 Board,P DmW(Note 1), at T L = 75 °Derated above 75 °C6.7mW/°C Thermal Resistance Junction to Ambient R ӨJA 340°C/W Thermal Resistance Junction to Lead R ӨJL150°C/W Junction Temperature Range T J -55 to + 150°C Storage Temperature RangeT STG-55 to + 150°CNote :(1) FR-5 = 3.5 x 1.5 inchesParameterFeaturesSmall Package Size for High Density Applications!!!!Total Power Dissipation 500 mW on FR-4or FR-5 BoardWide Zener Reverse Voltage Range 2.4 Vto 75 VPackage Designed for Optimal AutomatedBoard AssemblyC 500SURFACE MOUNT SILICON ZENER DIODES: SOD-123FLplastic body over passivated junction Method 2026: Color band denotes cathode end : AnyCase Terminals Polarity Mounting Position : Plated axial leads,solderable per MIL-STD-750,Mechanical Data!!!!!!Weight:0.0007 ounce, 0.02 grams3.58 3.72 0.55 0.57 0.530.15 0.17 0.13E D 1.00 1.03 0.097 1.05 1.08 1.021 1.80 1.83 1.77 2.75 2.78 2.72A 3.653 SOD-123FLDim Min Max Typ B C H L All Dimensions in mmMaximum Ratings T A = 25°C unless otherwise specified MMSZ11MMSZ11ELECTRICAL CHARACTERISTICS (Ta = 25 °C unless otherwise note, V F= 0.9 Vmax. @ I F= 10 mA)Z ZT1(3)Z ZT2 (3)Max. Reverse @ I ZT1 = @ I ZT2 =Leakage 5 mA 1 mA Current MinNom Max Min Max (μA)(V)2.28 2.4 2.52100 1.7 2.160050 1.02.57 2.7 2.84100 1.9 2.460020 1.02.85 3.0 3.1595 2.1 2.760010 1.03.14 3.3 3.4795 2.3 2.9600 5.0 1.03.42 3.6 3.7890 2.7 3.3600 5.0 1.03.71 3.9 4.1090 2.9 3.5600 3.0 1.04.09 4.3 4.5290 3.3 4.0600 3.0 1.04.47 4.7 4.9480 3.7 4.7500 3.0 2.04.85 5.1 5.3660 4.2 5.3480 2.0 2.05.32 5.6 5.8840 4.8 6.0400 1.0 2.05.89 6.2 6.5110 5.6 6.6150 3.0 4.06.46 6.87.1415 6.37.280 2.0 4.07.137.57.8815 6.97.980 1.0 5.07.798.28.61157.68.7800.7 5.08.659.19.56158.49.61000.5 6.09.501010.50209.310.61500.27.010.451111.552010.211.61500.18.011.401212.602511.212.71500.18.012.351313.653012.314.01700.18.014.251515.753013.715.52000.0510.515.201616.804015.217.02000.0511.217.101818.904516.719.02250.0512.619.002021.005518.721.12250.0514.020.902223.105520.723.22500.0515.422.802425.207022.725.52500.0516.8Notes :(1) The type number shown have a standard tolerance of±5% on the nominal Zener Voltage.(2) Tolerance and Voltage Designation: Zener Voltage (V Z ) is measured with the Zener Current applied for PW = 1ms.(3) Z ZT and Z ZK are measured by dividing the AC voltage drop across the device by the AC current applied. The specified limits are for I Z(AC)=0.1I Z(DC), with the AC frequency = 1 kHz.V Z1(1, 2)V Z2 (1, 2)(Ω)I R @ V R @ I ZT1 = 5 mA@ I ZT2 = 1 mA(V)(Ω)(V)TYPEMMSZ2V4 MMSZ2V7 MMSZ3V0 MMSZ3V3 MMSZ3V6 MMSZ3V9 MMSZ4V3 MMSZ4V7 MMSZ5V1 MMSZ5V6 MMSZ6V2 MMSZ6V8 MMSZ7V5 MMSZ8V2 MMSZ9V1 MMSZ10 MMSZ11 MMSZ12 MMSZ13 MMSZ15 MMSZ16 MMSZ18 MMSZ20 MMSZ22 MMSZ24ELECTRICAL CHARACTERISTICS (Ta = 25 °C unless otherwise note, V F= 0.9 Vmax. @ I F= 10 mA)ZZT1 (3)Z ZT2 (3)Max. Reverse @ I ZT1 = @ I ZT2 =Leakage TYPE NO.2 mA0.5 mA Current MinNom Max Min Max (μ25.652728.358025.028.93000.0518.928.503031.508027.832.03000.0521.031.353334.658030.835.03250.0523.134.203637.809033.838.03500.0525.237.053940.9513036.741.03500.0527.340.854345.1515039.746.03750.0530.144.654749.3517043.750.03750.0532.948.455153.5518047.654.04000.0535.753.205658.8020051.560.04250.0539.258.006266.00200---0.24764.006872.00250---0.25270.007579.00300---0.257Notes :(1) The type number shown have a standard tolerance of ±5% on the nominal Zener Voltage.(2) Tolerance and Voltage Designation: Zener Voltage (V Z ) is measured with the Zener Current applied for PW = 1ms.(3) Z ZT and Z ZK are measured by dividing the AC voltage drop across the device by the AC current applied. The specified limits are for I Z(AC)=0.1I Z(DC), with the AC frequency = 1 kHz.(Ω)I R @ V R V Z1(1, 2)V Z2 (1, 2)@ I ZT1 ZT2 = 0.1 mA(V)(Ω)(V) MMSZ27 MMSZ30 MMSZ33 MMSZ36 MMSZ39 MMSZ43 MMSZ47 MMSZ51 MMSZ56 MMSZ62 MMSZ68 MMSZ75= 2 mA@ I。

MMBZ5259B贴片二极管规格书

JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD SOT-23 Plastic-Encapsulate DiodeMMBZ5221B-MMBZ5259B ZENER DIODEFEATURES：Planar Die ConstructionGeneral purpose, Medium CurrentIdeally Suited for Automated AssemblyMarking: see table on page2 t he marking codeMaximum Ratings(T a= 25℃ unless otherwise specified)Characteristic SymbolValueUnit Forward Voltage @ I F = 10mA V F0.9 VPower Dissipation P D300mWThermal Resistance, Junction to Ambient Air RθJA417℃/WOperating and Storage Temperature Range T j, T STG-55 ~ +150℃B,Jun,2013ELECTRICAL CHARACTERISTICS (T a=25℃ unless otherwise specified)Zener Voltage Range (Note 1)TestCurrentMaximum ZenerImpedance (Note 2)Maximum ReverseLeakage Current(Note 1)Type Number MarkingCodeV Z @ I ZT I ZTZ ZT @I ZTZ ZK @ I ZK =0.25mA I R @V RNom (V) Min (V) Max (V)mA ΩµA VMMBZ5221B KC1 2.4 2.28 2.52 20 30 1200 100 1.0 MMBZ5222B KC2 2.5 2.38 2.63 20 30 1250 100 1.0 MMBZ5223B KC3 2.7 2.57 2.84 20 30 1300 75 1.0 MMBZ5225B KC5 3.0 2.85 3.15 20 30 1600 50 1.0 MMBZ5226B KG1 3.3 3.14 3.47 20 28 1600 25 1.0 MMBZ5227B KG2 3.6 3.42 3.78 20 24 1700 15 1.0 MMBZ5228B KG3 3.9 3.71 4.10 20 23 1900 10 1.0 MMBZ5229B KG4 4.3 4.09 4.52 20 22 2000 5.0 1.0 MMBZ5230B KG5 4.7 4.47 4.94 20 19 1900 5.0 2.0 MMBZ5231B KE1 5.1 4.85 5.36 20 17 1600 5.0 2.0 MMBZ5232B KE2 5.6 5.32 5.88 20 11 1600 5.0 3.0 MMBZ5233B KE3 6.0 5.70 6.30 20 7 1600 5.0 3.5 MMBZ5234B KE4 6.2 5.89 6.51 20 7 1000 5.0 4.0 MMBZ5235B KE5 6.8 6.46 7.14 20 5 750 3.0 5.0 MMBZ5236B KF1 7.5 7.13 7.88 20 6 500 3.0 6.0 MMBZ5237B KF2 8.2 7.79 8.61 20 8 500 3.0 6.5 MMBZ5238B KF3 8.7 8.27 9.14 20 8 600 3.0 6.5 MMBZ5239B KF4 9.1 8.65 9.56 20 10 600 3.0 7.0 MMBZ5240B KF5 10 9.50 10.50 20 17 600 3.0 8.0 MMBZ5241B KH1 11 10.45 11.55 20 22 600 2.0 8.4 MMBZ5242B KH2 12 11.40 12.60 20 30 600 1.0 9.1 MMBZ5243B KH3 13 12.35 13.65 9.5 13 600 0.5 9.9 MMBZ5244B KH4 14 13.30 14.70 9.0 15 600 0.1 10 MMBZ5245B KH5 15 14.25 15.75 8.5 16 600 0.1 11 MMBZ5246B KJ1 16 15.20 16.80 7.8 17 600 0.1 12 MMB Z5247B KJ2 17 16.15 17.85 7.4 19 600 0.1 13 MMBZ5248B KJ3 18 17.10 18.90 7.0 21 600 0.1 14 MMBZ5249B KJ4 19 18.05 19.95 6.6 23 600 0.1 14 MMBZ5250B KJ5 20 19.00 21.00 6.2 25 600 0.1 15 MMBZ5251B KK1 22 20.90 23.10 5.6 29 600 0.1 17 MMBZ5252B KK2 24 22.80 25.20 5.2 33 600 0.1 18 MMBZ5253B KK3 25 23.75 26.25 5.0 35 600 0.1 19 MMBZ5254B KK4 27 25.65 28.35 5.0 41 600 0.1 21 MMBZ5255B KK5 28 26.60 29.40 4.5 44 600 0.1 21 MMBZ5256B KM1 30 28.50 31.50 4.2 49 600 0.1 23 MMBZ5257B KM2 33 31.35 34.65 3.8 58 700 0.1 25 MMBZ5258B KM3 36 34.20 37.80 3.4 70 700 0.1 27 MMBZ5259B KM4 39 37.05 40.95 3.2 80 800 0.1 30Notes: 1. Short duration test pulse used to minimize self-heating effect.2. f = 1k Hz.B,Jun,2013【南京南山—领先的片式无源器件整合供应商】第3页共3页贴片电感样品申请单南山联系资料总机：技术支持：客服：传真：电邮：客户基本资料公司名称网址：联系方式电话：传真：□生产型企业□贸易商收货地址生产产品联络人姓名：职务：□技术□采购□其他电话：手机：电邮：样品明细资料元器件名称型号及封装单机用量申请数量备注预计生产情况预计小批量生产日期：规模生产日期：样品申请日期：样品申请流程1、请详细、全面、真实填写上列各项。

MMSZ5254B中文资料

Antistatic Cover Tape
F63TNR Label
Static Dissipative Embossed Carrier Tape
Cathode
SOD123 Packaging Information Packaging Option Packaging type Qty per Reel/Tube/Bag Reel Size Box Dimension (mm) Max qty per Box Weight per unit (gm) Weight per Reel (kg) Note/Comments Standard (no flow code) TNR 3,000 7" Dia 184x187x47 9,000 0.01 0.123 L99Z TNR 3,000 7" Dia 184x187x47 9,000 0.01 0.123 No marking required D87Z TNR 10,000 13" 343x343x64 30,000 0.01 0.420
Component Rotation
W1 Measured at Hub
Dim A Max
Dim A max
Dim N
See detail AA
7" Diameter Option
B Min Dim C See detail AA W3
Dim D min
13" Diameter Option
W2 max Measured at Hub DETAIL AA
Dimensions are in inches and millimeters
Tape Size
8mm
Reel Option

稳压二极管规格书资料

MMSZ5221BT1 SeriesPreferred DeviceZener Voltage Regulators 500 mW SOD−123 Surface MountThree complete series of Zener diodes are offered in the convenient, surface mount plastic SOD−123 package. These devices provide a convenient alternative to the leadless 34−package style.Features•500 mW Rating on FR−4 or FR−5 Board•Wide Zener Reverse V oltage Range − 2.4 V to 110 V •Package Designed for Optimal Automated Board Assembly •Small Package Size for High Density Applications •General Purpose, Medium Current•ESD Rating of Class 3 (>16 kV) per Human Body Model•Pb−Free Packages are AvailableMechanical CharacteristicsCASE:V oid-free, transfer-molded, thermosetting plastic case FINISH:Corrosion resistant finish, easily solderableMAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 SecondsPOLARITY:Cathode indicated by polarity band FLAMMABILITY RATING:UL 94 V−0MAXIMUM RATINGSMaximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.1.FR−5 = 3.5 X 1.5 inches, using the minimum recommended footprint.2.Thermal Resistance measurement obtained via infrared Scan Method.See specific marking information in the device marking column of the Electrical Characteristics table on page 3 of this data sheet.DEVICE MARKING INFORMATIONDevices listed in bold, italic are ON Semiconductor Preferred devices. Preferred devices are recommended choices for future use and best overall value.ELECTRICAL CHARACTERISTICS (T A = 25°C unlessotherwise noted, V= 0.95 V Max. @ I = 10 mA)4.Nominal Zener voltage is measured with the device junction in thermal equilibrium at T L = 30°C $1°C.5.Z ZT and Z ZK are measured by dividing the AC voltage drop across the device by the ac current applied.The specified limits are for I Z(AC) = 0.1 I Z(dc) with the AC frequency = 1 KHz.V Z , NOMINAL ZENER VOLTAGE (V)−1012345678Figure 1. Temperature Coefficients (Temperature Range −55°C to +150°C)100101V Z , NOMINAL ZENER VOLTAGE (V)Figure 2. Temperature Coefficients (Temperature Range −55°C to +150°C)1.21.00.80.60.40.20T, TEMPERATURE (°C)Figure 3. Steady State Power Derating PW, PULSE WIDTH (ms)Figure 4. Maximum Nonrepetitive Surge Power1000100101V Z , NOMINAL ZENER VOLTAGEFigure 5. Effect of Zener Voltage onZener Impedance100101V F , FORWARD VOLTAGE (V)Figure 6. Typical Forward Voltage1000100101q V Z , T E M P E R A T U R E C O E F F I C I E N T (m V /°C )q V Z , T E M P E R A T U R E C O E F F I C I E N T (m V /°C )P p k , P E A K S U R G E P O W E R (W A T T S )Z Z T , D Y N A M I C I M P E D A N C E (W )I F , F O R W A R D C U R R E N T (m A )C , C A P A C I T A N C E (p F )V Z , NOMINAL ZENER VOLTAGE (V)Figure 7. Typical Capacitance 1000100101V Z , ZENER VOLTAGE (V)1001010.10.01V Z , ZENER VOLTAGE (V)1001010.10.01V Z , NOMINAL ZENER VOLTAGE (V)Figure 8. Typical Leakage CurrentFigure 9. Zener Voltage versus Zener Current(V Z Up to 12 V)Figure 10. Zener Voltage versus Zener Current(12 V to 91 V)I R , L E A K A G E C U R R E N T (m A )I Z , Z E N E R C U R R E N T (m A )I Z , Z E N E R C U R R E N T (m A )PACKAGE DIMENSIONSSOD−123CASE 425−04ISSUE Cǒmm inchesǓSCALE 10:1*For additional information on our Pb−Free strategy and solderingdetails, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.SOLDERING FOOTPRINT*ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.PUBLICATION ORDERING INFORMATION。

MMSZ5256资料

Cathode Mark
.152 (3.85) .140 (3.55) .112 (2.85) .100 (2.55)
Top View
max. .004 (0.1)
max. .053 (1.35)
min. .010 (0.25)
max. .006 (0.15)
.067 (1.70) .055 (1.40)
1/20/99
元器件交易网
MMSZ5225 THRU MMSZ5267
ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.
Type
Marking Code
1.0 1.0 1.0 1.0 1.0 2.0 2.0 3.0 3.5 4.0 5.0 6.0 6.5 6.5 7.0 8.0 8.4 9.1 9.9 10 11 12 13 14 14 15 17 18 19 21 21 23 25 27 30 33 36 39 43 46 47 52 56
NOTES: (1) The Zener Impedance is derived from the 1kHz AC voltage which results when an AC current having an RMS value equal to 10% of the Zener current (IZT or IZK) is superimposed on IZT or IZK. Zener Impedance is measured at two points to insure a sharp knee on the breakdown curve and to eliminate unstable units. (2) Measured with device junction in thermal equilibrium.

MSK5251资料

2
Rev. D 2/07
元器件交易网
APPLICATION NOTES
REGULATOR PROTECTION:
The MSK 5251 series are high performance linear regulators for high current, low voltage applications requiring fast transient response. The devices are fully protected from damage due to fault conditions, offering constant current limiting and thermal shutdown. The thermal shutdown junction temperature is typically 140°C and is 100% tested to verify thermal shutdown occurs above 130°C.
7
+0.8V
MSK5251-0.9
+0.9V
MSK5251-1.0
+1.0V
MSK5251-1.2
+1.2V
NOTES:
MSK5251-1.3
+1.3V
1 Output decoupled to ground using 10µF minimum capacitor unless otherwise specified.
See typical performance curves for clarification.
9 Continuous operation at or above absolute maximum ratings may adversely effect the device performance and/or life cycle.

MMSZ5231中文资料

元器件交易网 NEW PRODUCT
NEW PRODUCT
NEW PRODUCT
MMSZ5225 THRU MMSZ5267
ZENER DIODES
SOD-123
.022 (0.55)
FEATURES
♦ Silicon Planar Power Zener Diodes ♦ Standard Zener voltage tolerance is ± 5% with a “B” suffix. Other tolerances are available upon request. ♦ These diodes are also available in Mini-MELF case with the designation ZMM5225 ... ZMM5267, DO-35 case with type designation 1N5225 ... 1N5267 and SOT-23 case with the type designation MMBZ5225 ... MMBZ5267.
(%/K)
IR (µA)
Test Voltage VR (V)
MMSZ5225 MMSZ5226 MMSZ5227 MMSZ5228 MMSZ5229 MMSZ5230 MMSZ5231 MMSZ5232 MMSZ5233 MMSZ5234 MMSZ5235 MMSZ5236 MMSZ5237 MMSZ5238 MMSZ5239 MMSZ5240 MMSZ5241 MMSZ5242 MMSZ5243 MMSZ5244 MMSZ5245 MMSZ5246 MMSZ5247 MMSZ5248 MMSZ5249 MMSZ5250 MMSZ5251 MMSZ5252 MMSZ5253 MMSZ5254 MMSZ5255 MMSZ5256 MMSZ5257 MMSZ5258 MMSZ5259 MMSZ5260 MMSZ5261 MMSZ5262 MMSZ5263 MMSZ5264 MMSZ5265 MMSZ5266 MMSZ5267

MMSZ5232BT1中文资料

MMSZ5221BT1 SeriesPreferred DeviceZener Voltage Regulators 500 mW SOD−123 Surface MountThree complete series of Zener diodes are offered in the convenient, surface mount plastic SOD−123 package. These devices provide a convenient alternative to the leadless 34−package style.Features•500 mW Rating on FR−4 or FR−5 Board•Wide Zener Reverse V oltage Range − 2.4 V to 110 V •Package Designed for Optimal Automated Board Assembly •Small Package Size for High Density Applications •General Purpose, Medium Current•ESD Rating of Class 3 (>16 kV) per Human Body Model•Pb−Free Packages are AvailableMechanical CharacteristicsCASE:V oid-free, transfer-molded, thermosetting plastic case FINISH:Corrosion resistant finish, easily solderableMAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 SecondsPOLARITY:Cathode indicated by polarity band FLAMMABILITY RATING:UL 94 V−0MAXIMUM RATINGSMaximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.1.FR−5 = 3.5 X 1.5 inches, using the minimum recommended footprint.2.Thermal Resistance measurement obtained via infrared Scan Method.See specific marking information in the device marking column of the Electrical Characteristics table on page 3 of this data sheet.DEVICE MARKING INFORMATIONDevices listed in bold, italic are ON Semiconductor Preferred devices. Preferred devices are recommended choices for future use and best overall value.ELECTRICAL CHARACTERISTICS (T A = 25°C unlessotherwise noted, V= 0.95 V Max. @ I = 10 mA)4.Nominal Zener voltage is measured with the device junction in thermal equilibrium at T L = 30°C $1°C.5.Z ZT and Z ZK are measured by dividing the AC voltage drop across the device by the ac current applied.The specified limits are for I Z(AC) = 0.1 I Z(dc) with the AC frequency = 1 KHz.V Z , NOMINAL ZENER VOLTAGE (V)−1012345678Figure 1. Temperature Coefficients (Temperature Range −55°C to +150°C)100101V Z , NOMINAL ZENER VOLTAGE (V)Figure 2. Temperature Coefficients (Temperature Range −55°C to +150°C)1.21.00.80.60.40.20T, TEMPERATURE (°C)Figure 3. Steady State Power Derating PW, PULSE WIDTH (ms)Figure 4. Maximum Nonrepetitive Surge Power1000100101V Z , NOMINAL ZENER VOLTAGEFigure 5. Effect of Zener Voltage onZener Impedance100101V F , FORWARD VOLTAGE (V)Figure 6. Typical Forward Voltage1000100101q V Z , T E M P E R A T U R E C O E F F I C I E N T (m V /°C )q V Z , T E M P E R A T U R E C O E F F I C I E N T (m V /°C )P p k , P E A K S U R G E P O W E R (W A T T S )Z Z T , D Y N A M I C I M P E D A N C E (W )I F , F O R W A R D C U R R E N T (m A )C , C A P A C I T A N C E (p F )V Z , NOMINAL ZENER VOLTAGE (V)Figure 7. Typical Capacitance 1000100101V Z , ZENER VOLTAGE (V)1001010.10.01V Z , ZENER VOLTAGE (V)1001010.10.01V Z , NOMINAL ZENER VOLTAGE (V)Figure 8. Typical Leakage CurrentFigure 9. Zener Voltage versus Zener Current(V Z Up to 12 V)Figure 10. Zener Voltage versus Zener Current(12 V to 91 V)I R , L E A K A G E C U R R E N T (m A )I Z , Z E N E R C U R R E N T (m A )I Z , Z E N E R C U R R E N T (m A )PACKAGE DIMENSIONSSOD−123CASE 425−04ISSUE Cǒmm inchesǓSCALE 10:1*For additional information on our Pb−Free strategy and solderingdetails, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.SOLDERING FOOTPRINT*ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.PUBLICATION ORDERING INFORMATION。

MMBZ5251B二极管规格书

Max (V) 2.52 2.63 2.84 3.15 3.47 3.78 4.10 4.52 4.94 5.36 5.88 6.30 6.51 7.14 7.88 8.61 9.14 9.56 10.50 11.55 12.60 13.65 14.70 15.75 16.80 17.85 18.90 19.95 21.00 23.10 25.20 26.25 28.35 29.40 31.50 34.65 37.80 40.95
Marking Code
KC1 KC2 KC3 KC5 KG1 KG2 KG3 KG4 KG5 KE1 KE2 KE3 KE4 KE5 KF1 KF2 KF3 KF4 KF5 KH1 KH2 KH3 KH4 KH5 KJ1 KJ2 KJ3 KJ4 KJ5 KK1 KK2 KK3 KK4 KK5 KM1 KM2 KM3 KM4
ZZT @ IZT
30 30 30 30 28 24 23 22 19 17 11 7 7 5 6 8 8 10 17 22 30 13 15 16 17 19 21 23 25 29 33 35 41 44 49 58 70 80
ZZK @ IZK = 0.25mA
Ω
1200 1250 1300 1600 1600 1700 1900 2000 1900 1600 1600 1600 1000 750 500 500 600 600 600 600 600 600 600 600 600 600 600 600 600 600 600 600 600 600 600 700 700 800
元器件名称型号及封装
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MMSZ5240中文资料

1/20/99
元器件交易网
MMSZ5225 THRU MMSZ5267
ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.
Type
Marking Code
MECHANICAL DATA
Case: SOD-123 Plastic Case Weight: approx. 0.01 g
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.
-0.075 -0.070 -0.065 -0.060 -0.055 ±0.030 ±0.030 +0.038 +0.038 +0.045 +0.050 +0.058 +0.062 +0.065 +0.068 +0.075 +0.076 +0.077 +0.079 +0.082 +0.082 +0.083 +0.084 +0.085 +0.086 +0.086 +0.087 +0.087 +0.089 +0.090 +0.091 +0.091 +0.092 +0.093 +0.094 +0.095 +0.095 +0.096 +0.096 +0.097 +0.097 +0.097 +0.098

MMSZ5259B

【领先的片式无源器件整合供应商—南京南山半导体有限公司】

JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD
SOD-123 Plastic-Encapsulate Diodes
MMSZ5221B-MMSZ5259B ZENER DIODE
23
1900
0.25
22
2000
0.25
19
1900
0.25
17
1600
0.25
11
1600
0.25
7
1600
0.25
7
1000
0.25
5
750
0.25
6
500
0.25
8
500
0.25
8
600
0.25
10
600
0.25
17
600
0.25
22
600
0.25
30
600
0.25
13
600
0.25
15
600
Code
C1 C3 C5 G1 G2 G3 G4 G5 E1 E2 E3 H2 H3 H4 H5 J1 J3 J5 K1 K2 K3 K4 K5 M1 M2 M3 M4
Zener Voltage Range (Note 2)
VZ@IZT
IZT
Nom(V)
0.25
16
600
0.25
17
600
0.25
21
600
0.25
25
600
0.25
29
600
0.25
33

MMBTA06LT3G;MMBTA06LT1G;MMBTA05LT1G;MMBTA05LT3G;MMBTA05LT1;中文规格书,Datasheet资料

MMBTA05L, MMBTA06L, SMMBTA06LDriver TransistorsNPN SiliconFeatures•S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS CompliantMAXIMUM RATINGSRating Symbol Value UnitCollector−Emitter VoltageMMBTA05LT1 MMBTA06LT1, SMMBTA06LT1V CEO6080VdcCollector−Base VoltageMMBTA05LT1 MMBTA06LT1, SMMBTA06LT1V CBO6080VdcEmitter−Base Voltage V EBO 4.0Vdc Collector Current − Continuous I C500mAdc Electrostatic Discharge ESD HBM Class 3BMM Class CCDM Class IV THERMAL CHARACTERISTICSCharacteristic Symbol Max UnitTotal Device Dissipation FR−5 Board (Note 1) T A = 25°C Derate above 25°C P D2251.8mWmW/°CThermal Resistance, Junction−to−Ambient R qJA556°C/WTotal Device Dissipation Alumina Substrate, (Note 2) T A = 25°C Derate above 25°C P D3002.4mWmW/°CThermal Resistance, Junction−to−Ambient R q JA417°C/WJunction and Storage Temperature T J, Tstg−55 to +150°C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.1.FR−5 = 1.0 0.75 0.062 in.2.Alumina = 0.4 0.3 0.024 in. 99.5% alumina.SOT−23CASE 318STYLE 6MARKING DIAGRAMS1H M GGMMBTA05LT1COLLECTOR1EMITTER1GM M GGMMBTA06LT1,SMMBTA06L1H, 1GM= Specific Device CodeM= Date Code*G= Pb−Free PackageSee detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet.ORDERING INFORMATION(Note: Microdot may be in either location)*Date Code orientation and/or overbar mayvary depending upon manufacturing location.ELECTRICAL CHARACTERISTICS (T A = 25°C unless otherwise noted)CharacteristicSymbolMinMaxUnitOFF CHARACTERISTICSCollector −Emitter Breakdown Voltage (Note 3)(I C = 1.0 mAdc, I B = 0)MMBTA05MMBTA06, SMMBTA06V (BR)CEO6080−−VdcEmitter −Base Breakdown Voltage (I E = 100 m Adc, I C = 0)V (BR)EBO 4.0−Vdc Collector Cutoff Current (V CE = 60 Vdc, I B = 0)I CES −0.1m Adc Collector Cutoff Current (V CB = 60 Vdc, I E = 0)MMBTA05(V CB = 80 Vdc, I E = 0)MMBTA06, SMMBTA06I CBO−−0.10.1m AdcON CHARACTERISTICSDC Current Gain(I C = 10 mAdc, V CE = 1.0 Vdc)(I C = 100 mAdc, V CE = 1.0 Vdc)h FE100100−−−Collector −Emitter Saturation Voltage (I C = 100 mAdc, I B = 10 mAdc)V CE(sat)−0.25Vdc Base −Emitter On Voltage(I C = 100 mAdc, V CE = 1.0 Vdc)V BE(on)−1.2VdcSMALL −SIGNAL CHARACTERISTICS Current −Gain − Bandwidth Product (Note 4)(I C = 10 mA, V CE = 2.0 V, f = 100 MHz)f T100−MHz3.Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2.0%.4.f T is defined as the frequency at which |h fe | extrapolates to unity.Figure 1. Switching Time Test CircuitsOUTPUTTURN-ON TIME V S t 6.0 pFtr = 3.0 ns+10 V5.0 m OUTPUTTURN-OFF TIME +V V S t 6.0 pFt r = 3.0 ns5.0 m *Total Shunt Capacitance of Test Jig and Connectors For PNP Test Circuits, Reverse All Voltage PolaritiesFigure 2. Current Gain Bandwidth Product vs.Collector CurrentFigure 3. CapacitanceFigure 4. Switching TimeI C , COLLECTOR CURRENT (mA)V R , REVERSE VOLTAGE (V)I C , COLLECTOR CURRENT (mA)200100502010t , T I M E (n s )2005001.0 k 5003070300700C , C A P A C I T A N C E (p F )300Figure 5. DC Current Gain vs. CollectorCurrentI C , COLLECTOR CURRENT (mA)f t a u , C U R R E N T G A I N B A N D W I D T H P R O D U C T (M H z )h f e , D C C U R R E N T G A I NFigure 6. Collector Emitter Saturation Voltagevs. Collector Current Figure 7. Base Emitter Saturation Voltage vs.Collector CurrentIC , COLLECTOR CURRENT (mA)I C , COLLECTOR CURRENT (mA)0.010.11V C E (s a t ), C O L L E C T O R −E M I T T E R S A T U R A T I O N V O L T A G E (V )V B E (s a t ), B A S E −E M I T T E R S A T U R A T I O N V O L T A G E (V )Figure 8. Base Emitter Turn −ON Voltage vs.Collector CurrentI C , COLLECTOR CURRENT (mA)1.1V B E (o n ), B A S E −E M I T T E R V O L T A G E (V )Figure 9. Saturation RegionI B , BASE CURRENT (mA)Figure 10. Base −Emitter TemperatureCoefficientI C , COLLECTOR CURRENT (mA)−0.8−1.2−1.6−2.0−2.4−2.8Figure 11. Safe Operating AreaV CE , COLLECTOR EMITTER VOLTAGE (V)10000IC , C O L L E C T O R C U R R E N T (m A )10.90.80.70.60.50.40.30.20.1V C E (s a t ), C O L L E C T O R −E M I T T E R S A T U R A T I O N V O L T A G E (V )R q V B , T E M P E R A T U R E C O E F F I C I E N T (m V /°C )Figure 12. Safe Operating AreaV CE , COLLECTOR EMITTER VOLTAGE (V)I C , C O L L E C T O R C U R R E N T (m A )1000100101ORDERING INFORMATIONDevice Package Shipping†3000 / Tape & Reel MMBTA05LT1G SOT−23(Pb−Free)MMBTA05LT3G SOT−2310,000 / Tape & Reel(Pb−Free)3000 / Tape & Reel MMBTA06LT1G SOT−23(Pb−Free)SMMBTA06LT1G SOT−233000 / Tape & Reel(Pb−Free)10,000 / Tape & Reel MMBTA06LT3G SOT−23(Pb−Free)SMMBTA06LT3G SOT−2310,000 / Tape & Reel(Pb−Free)†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.PACKAGE DIMENSIONSSOT −23 (TO −236)CASE 318−08ISSUE APNOTES:1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.2.CONTROLLING DIMENSION: INCH.3.MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISHTHICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.4.DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,PROTRUSIONS, OR GATE BURRS.VIEW CDIM A MIN NOM MAX MINMILLIMETERS0.89 1.00 1.110.035INCHES A10.010.060.100.001b 0.370.440.500.015c 0.090.130.180.003D 2.80 2.90 3.040.110E 1.20 1.30 1.400.047e 1.78 1.90 2.040.070L 0.100.200.300.0040.0400.0440.0020.0040.0180.0200.0050.0070.1140.1200.0510.0550.0750.0810.0080.012NOM MAX L1 2.10 2.40 2.640.0830.0940.104H E 0.350.540.690.0140.0210.0290−−−100−−−10q°°°°STYLE 6:PIN 1.BASE2.EMITTER3.COLLECTOR*For additional information on our Pb −Free strategy and solderingdetails, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.SOLDERING FOOTPRINT*ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at /site/pdf/Patent −Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly,any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.PUBLICATION ORDERING INFORMATION分销商库存信息:ONSEMIMMBTA06LT3G MMBTA06LT1G MMBTA05LT1G MMBTA05LT3G MMBTA05LT1MMBTA06LT1 MMBTA05LT3。

MMSZ5240B

4.2
33
31.35
34.65
3.8
36
34.20
37.80
3.4
39
37.05
40.95
3.2
Maximum Zener Impedance (Note 4)
ZZT@IZT
ZZK@IZK
IZK
Ω
mA
30
1200
0.25
30
1300
0.25
30
1600
0.25
28
1600
0.25
24
1700
0.25
Type Number
MMSZ5221B MMSZ5223B MMSZ5225B MMSZ5226B MMSZ5227B MMSZ5228B MMSZ5229B MMSZ5230B MMSZ5231B MMSZ5232B MMSZ5233B MMSZ5234B MMSZ5235B MMSZ5236B MMSZ5237B MMSZ5238B MMSZ5239B MMSZ5240B MMSZ5241B MMSZ5242B MMSZ5243B MMSZ5244B MMSZ5245B MMSZ5246B MMSZ5248B MMSZ5250B MMSZ5251B MMSZ5252B MMSZ5253B MMSZ5254B MMSZ5255B MMSZ5256B MMSZ5257B MMSZ5258B MMSZ5259B
9.0
15
14.25
15.75
8.5
16
15.20
16.80
7.8
18
17.10
18.90
7.0
20
19.00
21.00
6.2

ZMM5252B中文资料(WILLAS ELECTRONIC)中文数据手册「EasyDatasheet - 矽搜」

5264
ZMM5265B
62.0
58.90
65.10
185
2.0
1400
0.25
0.1
47.0
5265
ZMM5266B
68.0
64.60
71.40
230
1.8
1600
0.25
0.1
52.0
5266
ZMM5267B
75.0
71.25
78.75
270
1.7
1700
0.25
0.1
56.0
5267
1）基于直流测量达到热平衡;引线长度=9.5毫米（3/8"）;散热器= 30K / W热阻
5244
ZMM5245B
15.0
14.25
15.75
16
8.5
600
0.25
0.1
11.0
5245
ZMM5246B
16.0
15.20
16.80
17
7.8
600
0.25
0.1
12.0
5246
ZMM5247B
17.0
16.15
17.85
19
7.4
600
0.25
0.1
13.0
5247
ZMM5248B
18.0
类型
max. .006 (0.15)
符号
PTOT IZ Tj Tstg
值
500
PV/V Z -65到+175 –65 至 +175
单元
mW
mA °C °C
.010 (0.25) min.
Marking Code: 测JV o试r 4条件

5251RP资料

Intelligent Plug-In Model 5251RP Rate-of-Rise Temperature Sensor with Fixed Temperature AlarmINSTALLATION AND MAINTENANCE INSTRUCTIONSA Division of Pittway3825 Ohio Avenue, St. Charles, Illinois 601741-800-SENSOR2, FAX: 630-377-6495Before installing sensors, refer to NFPA 72, and 101 (Life Safety Code) for information on sensor spacing, placement, zon-ing, and special applications.GENERAL DESCRIPTIONModel 5251RP is an intelligent sensor that utilizes a state-of-the-art thermistor sensing circuit for fast response. This sen-sor is designed to provide open area protection with 50 foot spacing capability and is intended for use with compatible control panels only.T wo LEDs on each sensor light to provide 360° visibility of the sensor indication. The LEDs can be latched ON by code command from the panel for an alarm indication. The LEDs can also be unlatched to the normal condition by code com-mand. Remote LED annunciator capability is available as an optional accessory (Part No. RA400Z).SPECIFICATIONS Diameter:6.1 inches (155 mm) installed in B210LP 4.1 inches (104 mm) installed in B501Height: 2.0 inches (51 mm)Weight:5 ounces (150 gm)Installation T emperatures:-4°F to 100°F (-20°C to 38°C)Operating Humidity Range:10% to 93% Relative Humidity Non-condensing Mounting:B210LP flanged base B501 flangeless baseB501 with RMK400 recessed mounting kit Voltage Range:15 to 32 Volts DC PeakStandby Current:300 µA @ 24 VDC (one communication every 5 seconds with LED blink enabled)LED Current:6.5 mA @ 24 VDC Fixed T emperature Rating:135°F (57°C)Rate-of-Rise Detection:Responds to greater than 15°F/min.WIRING GUIDERefer to the installation instructions for the particular plug-in base being used: 1) for the B210LP base (D250-01-00); 2) for the B501 base (D550-02-00); 3) for the RMK400 used with the B501 base (D450-07-00). Bases are provided with screw ter-minals for power, ground, and remote annunciator connections. See Figure 1.2.T amper Resistance:The sensor bases have a tamper-resistant capability. When this capability is enabled, sensors cannot be removed from the base without the use of a small screwdriver or other similar tool. Refer to the sensor base installation instruction manual for details in using this capability.3.After all sensors have been installed, apply power to the control unit.4.T est the sensor by placing a small magnet against the sensor plastic, as shown in Figure 2. The alarm level should be recognized in the panel and the LED controlled by communication command from the panel.5.The reset of the sensor LED is controlled by communication command from the panel.TESTINGSensors must be tested after installation and periodic maintenance. The sensor may be tested in the following ways.A.T est Magnet (Model No. M02-04)1.Place the magnet against the cover in the magnet test area as shown in Figure 2 to activate the test feature.2.The LEDs should latch ON within 10 seconds, indicating alarm and annunciating the panel.3.Reset the detector at the system control panel.B.T est sensitivity from the control panel.C.Direct Heat Method (Hair dryer of 1000 – 1500 watts)1.From the side of the detector, direct the heat toward the sensor. Hold the heat source about 6 inches (15cm) away to prevent damage to the cover during testing.NOTE:All wiring must conform to applicable local codes, ordinances, and regulations.NOTE:Verify that all sensor bases are installed and that the wiring polarity is correct at each base.W ARNING:Disconnect the power from the loop before installing sensors.1.Install Sensors:a.Verify that the sensor type matches the type written on the label in the base.b.Set the sensor to a desired address and then write the address on the label on the base.c.Place the sensor into the sensor base.d.T urn the sensor clockwise until it drops into place.e.Continue turning the sensor clockwise to lock it in place.A78-1253-01A78-1944-012.The LEDs on the detector should light when the temperature at the detector reaches 135°F (57°C). If the LEDs fail to light, check the power to the detector and the wiring in the detector base.3.Reset the detector at the system control panel.Detectors that fail these tests should be cleaned as described under MAINTENANCE and retested. If the detectors still fail these tests they should be returned for repair.Figure 3Figure 2. Views showing position of test magnet.MAINTENANCENOTE:Before cleaning notify the proper authorities that the system is undergoing maintenance, and therefore the systemwill temporarily be out of service. Disable the loop or system undergoing maintenance to prevent unwanted alarms.It is recommended that the sensor be removed from its mounting base for easier cleaning and that sensors be cleaned at least once a year. Use a vacuum cleaner to remove dust from the sensing chamber. See Figure 3.LEDMAGNETPAINTED SURFACEA78-1478-05Three-Year Limited WarrantySystem Sensor warrants its enclosed heat detector to be free from defects in materials and workmanship under normal use and service for a period of three years from date of manufacture. System Sensor makes no other express warranty for this heat detector. No agent, representative, dealer, or employee of the Company has the authority to increase or alter the obliga-tions or limitations of this Warranty. The Company’s obligation of this Warranty shall be limited to the repair or replacement of any part of the heat detector which is found to be defective in materials or workmanship under normal use and service during the three year period commencing with the date of manufacture. After phoning System Sensor’s toll free number 800-SENSOR2 (736-7672) for a Return Authorization number, send defective units postage prepaid to: System Sensor, Repair Depart-ment, RA #__________, 3825 Ohio Avenue, St. Charles, IL 60174. Please include a note describing the malfunction and suspected cause of failure. The Company shall not be obligated to repair or replace units which are found to be defective because of damage, unreasonable use, modifica-tions, or alterations occurring after the date of manufacture. In no case shall the Company be liable for any consequential or incidental damages for breach of this or any other Warranty, expressed or implied whatsoever, even if the loss or damage is caused by the Company’s negligence or fault. Some states do not allow the exclusion or limitation of incidental or conse-quential damages, so the above limitation or exclusion may not apply to you. This Warranty gives you specific legal rights, and you may also have other rights which vary from state to state.FCC StatementThis device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interfer-ence, and (2) this device must accept any interference received, including interference that may cause undesired operation.Note:This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio commu-nications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interfer-ence to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:– Reorient or relocate the receiving antenna.– Increase the separation between the equipment and receiver.– Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.– Consult the dealer or an experienced radio/TV technician for help.Please refer to insert for the Limitations of Fire Alarm Systems。

MMSZ5250BS-7-F中文资料

Lead-free·Planar Die Construction·Ultra-Small Surface Mount Package ·General Purpose·Ideally suited for Automated Assembly Processes ·Lead Free /RoHS Compliant (Note 3)FeaturesMaximum Ratings@ T A = 25°C unless otherwise specifiedNotes: 1. Part mounted on FR-4 PC board with recommended pad layout, which can be found on our website at /datasheets/ap02001.pdf.2. Short duration pulse test used to minimize self-heating effect.3. No purposefully added lead.Mechanical DataMMSZ5221BS - MMSZ5259BSSURFACE MOUNT ZENER DIODE·Case: SOD-323·Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0·Moisture Sensitivity: Level 1 per J-STD-020C ·Terminals: Solderable per MIL-STD-202, Method 208·Lead Free Plating (Matte Tin Finish annealed over Alloy 42leadframe). Please see Ordering Information, Note 5, on Page 2·Polarity: Cathode Band ·Marking: See Page 2·Weight: 0.004 grams (approximate)Electrical Characteristics@ T A = 25°C unless otherwise specified5. f = 1KHz.XX = Product Type Marking Code (See Table Above)Marking InformationOrdering Information (Note 6)Notes: 6. For Packaging Details, go to our website at: /datasheets/ap02007.pdf.*Add “-7-F” to the appropriate type number in Table 1 above example: 6.2V Zener = MMSZ5234BS-7-F.0102030I , Z E N E R C U R R E N T (m A )Z V , ZENER VOLTAGE (V)Z Fig. 6 Zener Breakdown Characteristics10203040102030405012345678910I , ZE N E R C U R R E N T (m A )Z V , ZENER VOLTAGE (V)Z Fig. 5 Zener Breakdown Characteristics110100110100P , P E A K S U R G E P O W E R (W )P K PULSE WIDTH (ms)Fig. 4 Maximum Non-repetitive Surge Power10001101001000110100V , NOMINAL ZENER VOLTAGE (V)Z Fig. 3 Zener Impedance vs. Zener Voltage1101001000110100C , T O T A L C A P A C I T A N C E (p F )T V , NOMINAL ZENER VOLTAGE (V)Z Fig. 2 Typical Capacitance00.10.20.30.4255075100125150P , P O W E R D I S S I P A T I O N (W )D T , AMBIENT TEMPERATURE (°C)A Fig. 1 Power Dissipation vs Ambient TemperatureIMPORTANT NOTICEDiodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website, harmless against all damages.LIFE SUPPORTDiodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written approval of the President of Diodes Incorporated.。

MMSZ5246中文资料

C5 D1 D2 D3 D4 D5 E1 E2 E3 E4 E5 F1 F2 F3 F4 F5 H1 H2 H3 H4 H5 J1 J2 J3 J4 J5 K1 K2 K3 K4 K5 M1 M2 M3 M4 M5 N1 N2 N3 N4 N5 P1 P2
3.0 3.3 3.6 3.9 4.3 4.7 5.1 5.6 6.0 6.2 6.8 7.5 8.2 8.7 9.1 10 11 12 13 14 15 16 17 18 19 20 22 24 25 27 28 30 33 36 39 43 47 51 56 60 62 68 75
(%/K)
IR (µA)
Test Voltage VR (V)
MMSZ5225 MMSZ5226 MMSZ5227 MMSZ5228 MMSZ5229 MMSZ5230 MMSZ5231 MMSZ5232 MMSZ5233 MMSZ5234 MMSZ5235 MMSZ5236 MMSZ5237 MMSZ5238 MMSZ5239 MMSZ5240 MMSZ5241 MMSZ5242 MMSZ5243 MMSZ5244 MMSZ5245 MMSZ5246 MMSZ5247 MMSZ5248 MMSZ5249 MMSZ5250 MMSZ5251 MMSZ5252 MMSZ5253 MMSZ5254 MMSZ5255 MMSZ5256 MMSZ5257 MMSZ5258 MMSZ5259 MMSZ5260 MMSZ5261 MMSZ5262 MMSZ5263 MMSZ5264 MMSZ5265 MMSZ5266 MMSZ5267
SYMBOL
MIN.
TYP.
MAX.
UNIT
Thermal Resistance Junction to Ambient Air Forward Voltage at IF = 10 mA

MMSZ5252BT1中文资料

MMSZ5221BT1 SeriesPreferred DeviceZener Voltage Regulators 500 mW SOD−123 Surface MountThree complete series of Zener diodes are offered in the convenient, surface mount plastic SOD−123 package. These devices provide a convenient alternative to the leadless 34−package style.Features•500 mW Rating on FR−4 or FR−5 Board•Wide Zener Reverse V oltage Range − 2.4 V to 110 V •Package Designed for Optimal Automated Board Assembly •Small Package Size for High Density Applications •General Purpose, Medium Current•ESD Rating of Class 3 (>16 kV) per Human Body Model•Pb−Free Packages are AvailableMechanical CharacteristicsCASE:V oid-free, transfer-molded, thermosetting plastic case FINISH:Corrosion resistant finish, easily solderableMAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 SecondsPOLARITY:Cathode indicated by polarity band FLAMMABILITY RATING:UL 94 V−0MAXIMUM RATINGSMaximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.1.FR−5 = 3.5 X 1.5 inches, using the minimum recommended footprint.2.Thermal Resistance measurement obtained via infrared Scan Method.See specific marking information in the device marking column of the Electrical Characteristics table on page 3 of this data sheet.DEVICE MARKING INFORMATIONDevices listed in bold, italic are ON Semiconductor Preferred devices. Preferred devices are recommended choices for future use and best overall value.ELECTRICAL CHARACTERISTICS (T A = 25°C unlessotherwise noted, V= 0.95 V Max. @ I = 10 mA)4.Nominal Zener voltage is measured with the device junction in thermal equilibrium at T L = 30°C $1°C.5.Z ZT and Z ZK are measured by dividing the AC voltage drop across the device by the ac current applied.The specified limits are for I Z(AC) = 0.1 I Z(dc) with the AC frequency = 1 KHz.V Z , NOMINAL ZENER VOLTAGE (V)−1012345678Figure 1. Temperature Coefficients (Temperature Range −55°C to +150°C)100101V Z , NOMINAL ZENER VOLTAGE (V)Figure 2. Temperature Coefficients (Temperature Range −55°C to +150°C)1.21.00.80.60.40.20T, TEMPERATURE (°C)Figure 3. Steady State Power Derating PW, PULSE WIDTH (ms)Figure 4. Maximum Nonrepetitive Surge Power1000100101V Z , NOMINAL ZENER VOLTAGEFigure 5. Effect of Zener Voltage onZener Impedance100101V F , FORWARD VOLTAGE (V)Figure 6. Typical Forward Voltage1000100101q V Z , T E M P E R A T U R E C O E F F I C I E N T (m V /°C )q V Z , T E M P E R A T U R E C O E F F I C I E N T (m V /°C )P p k , P E A K S U R G E P O W E R (W A T T S )Z Z T , D Y N A M I C I M P E D A N C E (W )I F , F O R W A R D C U R R E N T (m A )C , C A P A C I T A N C E (p F )V Z , NOMINAL ZENER VOLTAGE (V)Figure 7. Typical Capacitance 1000100101V Z , ZENER VOLTAGE (V)1001010.10.01V Z , ZENER VOLTAGE (V)1001010.10.01V Z , NOMINAL ZENER VOLTAGE (V)Figure 8. Typical Leakage CurrentFigure 9. Zener Voltage versus Zener Current(V Z Up to 12 V)Figure 10. Zener Voltage versus Zener Current(12 V to 91 V)I R , L E A K A G E C U R R E N T (m A )I Z , Z E N E R C U R R E N T (m A )I Z , Z E N E R C U R R E N T (m A )PACKAGE DIMENSIONSSOD−123CASE 425−04ISSUE Cǒmm inchesǓSCALE 10:1*For additional information on our Pb−Free strategy and solderingdetails, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.SOLDERING FOOTPRINT*ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.PUBLICATION ORDERING INFORMATION。