vibration and Thermal Analysis of Switched Reluctance Hub Motor

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高密度阳极铝电解槽电

第 54 卷第 2 期2023 年 2 月中南大学学报(自然科学版)Journal of Central South University (Science and Technology)V ol.54 No.2Feb. 2023高密度阳极铝电解槽电−热场耦合仿真研究魏兴国1，廖成志1，侯文渊1, 2，段鹏1，李贺松1(1. 中南大学能源科学与工程学院，湖南长沙，410083；2. 中北大学能源与动力工程学院，山西太原，030051)摘要：在铝电解槽中，阳极炭块内存在的气孔会降低炭块的导电和导热性能，并且增加炭渣，降低电流效率，导致炭耗和直流电耗升高。

通过浸渍工艺得到的高密度阳极可以有效地降低炭块的气孔率。

为了探究高密度阳极铝电解槽的电−热场变化和影响，基于ANSYS 软件建立高密度阳极铝电解槽的电−热场耦合计算模型。

研究结果表明：铝电解槽高密度阳极炭块的平均温度上升8.73 ℃，热应力增加，但形变量减小；侧部槽壳的平均温度下降28.59 ℃，热应力和形变量均降低，有利于保持槽膛内形稳定；热场变化主要与阳极炭块物性改变有关；槽电压降低49.16 mV ，主要与炭块物性改变和电解质电阻率降低有关；高密度阳极电流全导通时间缩短3.39 h ，可有效减弱换极产生的负面影响，阳极使用寿命可延长4 d ，炭耗降低10.3 kg/t ；铝电解槽反应能耗占比增加0.62%，电流效率提高1.69%，直流电耗降低270 kW·h/t 。

关键词：铝电解槽；高密度阳极；电−热场；耦合仿真中图分类号：TF821 文献标志码：A 文章编号：1672-7207（2023）02-0744-10Simulation study of electric-thermal field coupling in high-densityanode aluminum electrolyzerWEI Xingguo 1, LIAO Chengzhi 1, HOU Wenyuan 1, 2, DUAN Peng 1, LI Hesong 1(1. School of Energy Science and Engineering, Central South University, Changsha 410083, China;2. School of Energy and Power Engineering, North University of China, Taiyuan 030051, China)Abstract: In aluminum electrolytic cells, porosity in anode carbon blocks can reduce the electrical and thermal conductivity of the blocks and increase carbon slag, reduce current efficiency and lead to higher carbon consumption and DC power consumption. High-density anodes obtained by impregnation process can effectively reduce the porosity of carbon blocks. In order to investigate the electric-thermal field variation and the causes of influence in the high-density anode aluminum electrolyzer, a coupled electric-thermal field calculation model of收稿日期： 2022 −07 −11；修回日期： 2022 −08 −20基金项目(Foundation item)：国家高技术研究发展项目(2010AA065201)；中南大学研究生自主探索创新项目(2021zzts0668)(Project(2010AA065201) supported by the National High-Tech Research and Development Program of China; Project (2021zzts0668) supported by the Independent Exploration and Innovation of Graduate Students in Central South University)通信作者：李贺松，博士，教授，博士生导师，从事铝电解研究；E-mail:****************.cnDOI: 10.11817/j.issn.1672-7207.2023.02.032引用格式：魏兴国, 廖成志, 侯文渊, 等. 高密度阳极铝电解槽电−热场耦合仿真研究[J]. 中南大学学报(自然科学版), 2023, 54(2): 744−753.Citation: WEI Xingguo, LIAO Chengzhi, HOU Wenyuan, et al. Simulation study of electric-thermal field coupling in high-density anode aluminum electrolyzer[J]. Journal of Central South University(Science and Technology), 2023, 54(2): 744−753.第 2 期魏兴国，等：高密度阳极铝电解槽电−热场耦合仿真研究the high-density anode aluminum electrolyzer was established based on ANSYS software. The results show that the average temperature of the anode carbon block increases by 8.73 ℃ when the high-density anode is put on the tank, and the thermal stress increases but the deformation variable decreases. The average temperature of the side shell decreases by 28.59 ℃, and the thermal stress and deformation variable both decrease,which helps to protect the inner shape of the tank chamber stable. The change of the thermal field is mainly related to the change of the physical properties of the anode carbon block. The cell voltage decreases by 49.16 mV which is mainly related to the change of carbon block physical ploperties and the decrease of electrolyte resistivity, respectively. The reduction of 3.39 h in the full conduction time of high-density anode current can effectively reduce the negative effects of electrode change, and the anode service life can be extended by 4 d. The carbon consumption is reduced by 10.3 kg/t. The reaction energy consumption of aluminum electrolyzer is increased by 0.62%, the current efficiency is increased by 1.69%, and the DC power consumption is reduced by 270 kW·h/t.Key words: aluminum electrolyzer; high-density anode; electric-thermal field; coupling simulation作为铝电解槽的核心部件，阳极炭块在反应过程中被不断消耗，其品质直接影响着各项经济技术指标[1]。

基于瑞典条分法的滑坡稳定性反演分析及评价

2019·1·Building Construction168基于瑞典条分法的滑坡稳定性反演分析及评价龚颖刘铁军张建同深圳市市政工程总公司广东深圳 518109摘要：以某天然气井场滑坡作为研究对象，简要分析了该滑坡形成的原因及机理，重点对滑坡稳定性分析的方法、计算模型、参数选取、计算过程及结果进行了详细论述，并对滑坡治理方案进行了研究。

根据滑坡特征，提出了格构锚索＋裂缝夯填＋坡脚堆载施工方案，并对治理工程及其效果进行了分析。

关键词：填土滑坡；形成机制；稳定性分析；锚索；坡脚堆载中图分类号：TU43 文献标志码：A 文章编号：1004-1001(2019)01-0168-05 DOI：10.14144/ki.jzsg.2019.01.056Inverse Analysis and Evaluation of Landslide Stability Basedon Swedish Slice MethodGONG Ying LIU Tiejun ZHANG JiantongShenzhen Municipal Engineering Company, Shenzhen, Guangdong 518109, ChinaAbstract: Taking a natural gas well field landslide as the research object, the formation causes and mechanism of the landslide are briefly analyzed, the method, calculation model, parameter selection, calculation process and results of landslide stability analysis are emphatically discussed, and the landslide treatment scheme is studied. According to the characteristics of the landslide, the lattice anchor cable ＋ crack tamping and filling ＋ slope toe heaped load construction methods are put forward, and the treatment engineering and its effect are analyzed.Keywords: filled soil landslide; formation mechanism; stability analysis; anchor cable; slope toe heaped load残坡积层（Q4el ＋dl ）、滑坡堆积层（Q4del ）及侏罗系下统遂宁组第三段（J3sn ）。

thermal stress analysis

thermal stress analysisThermal stress analysis is a technique used to determine the effects of temperature changes on the mechanical behavior of materials and structures. It involves evaluating the stresses and strains that are induced in a material or structure when it is subjected to thermal loading.When materials are exposed to temperature changes, they expand or contract due to thermal expansion. This expansion or contraction can induce stresses in the material, which can lead to deformation, cracking, or failure if they exceed certain limits. Thermal stress analysis takes into account various factors such as material properties (thermal expansion coefficient), geometry of the structure, boundary conditions (constraints), and temperature distribution. It typically involves numerical methods such as finite element analysis (FEA) or analytical methods based on mathematical equations.The process usually starts by determining the temperature distribution within a structure using heat transfer analysis techniques. Once this is known, it is combined with information about material properties and geometry in order to calculate stresses and strains induced by thermal loading.The results obtained from thermal stress analysis can be used for various purposes including design optimization, predicting failure points due to excessive temperatures, evaluating performance under different operating conditions (e.g., heating/cooling cycles), and assessing safety factors for different applications.Overall, thermal stress analysis plays an important role in ensuring that materials and structures are able to withstand temperature variations without compromising their integrity.。

Thermal Science and Engineering

Thermal Science and Engineering Thermal science and engineering is a captivating field that delves into the intricate world of heat transfer and its applications. It explores the fundamental principles governing the movement of thermal energy and seeks to harness this knowledge for the betterment of society. From the design of efficient power plants to the development of innovative cooling systems, thermal science plays a pivotal role in shaping our modern world. At the heart of thermal science lies the concept of heat transfer, the process by which thermal energy migrates from regions of higher temperature to those of lower temperature. This transfer can occur through three primary mechanisms: conduction, convection, and radiation. Conduction involves the transfer of heat through a material medium, such as a metal rod, while convection relies on the movement of fluids, like air or water, to carry heat away. Radiation, on the other hand, transmits heat in the form of electromagnetic waves, requiring no physical medium for propagation. The study of thermal science encompasses a wide range of disciplines, including thermodynamics, fluid mechanics, and heat transfer. Thermodynamics provides a framework for understanding the relationship between heat, work, temperature, and energy. Fluid mechanics deals with the behavior of fluids at rest and in motion, crucial for analyzing heat transfer in systems involving fluids. Heat transfer, as mentioned earlier, focuses on the mechanisms and rates of heat transfer between different objects or systems. Thermal engineering leverages the principles of thermal science to design, analyze, and optimize systems involving heat transfer. It encompasses a vast array of applications, including power generation, refrigeration, air conditioning, and materials processing. Power plants, for instance, rely on the principles of thermodynamics and heat transfer to convert thermal energy into electricity. Refrigeration and air conditioning systemsexploit the properties of refrigerants to transfer heat from one location to another, providing us with comfortable living and working environments. The advancements in thermal science and engineering have had a profound impact on our daily lives. They have enabled the development of more efficient and environmentally friendly power plants, reducing our reliance on fossil fuels. Innovations in refrigeration and air conditioning have improved food preservation,enhanced comfort levels, and facilitated the growth of various industries. Moreover, advances in materials processing, driven by thermal science, have led to the creation of new materials with exceptional properties, paving the way for technological breakthroughs. In conclusion, thermal science and engineering is an indispensable field that underpins numerous technological advancements andsocietal benefits. Its principles govern the movement of thermal energy, enabling us to harness this energy for various purposes. From power generation to refrigeration, from materials processing to environmental sustainability, thermal science plays a crucial role in shaping our world and improving our quality of life. As we continue to push the boundaries of knowledge and innovation, the field of thermal science and engineering holds immense promise for addressing future challenges and creating a more sustainable future.。

液滴蒸发瞬时效应

International Journal of Heat and Mass Transfer 86 (2015) 212–220
Contents lists available at ScienceDirect
International Journal of Heat and Mass Transfer
journal homepage: /locate/ijhmt
Transient effects on sessile droplet evaporation of volatile liquids
A. Maatar a, S. Chikh a,⇑, M. Ait Saada a, L. Tadrist b
1. Introduction The sessile droplet evaporation on a solid substrate is a phenomenon found in many industrial applications: pharmaceutical processes, electronics, coating and micro-lenses manufacturing, etc. . . The physics of sessile droplet evaporation on a solid substrate is a quite complex phenomenon because it involves several coupled mechanisms. Accounting for heat and mass transfer, interactions between the different phases (solid, liquid and gas), ﬂuid motion inside and outside the drop, dynamics of the contact line and evaporation kinetics makes it a difﬁcult problem to solve. The concentration gradient at the droplet surface is the initial driving force of the evaporation phenomenon, but it is inﬂuenced by several parameters such as liquid properties (density, diffusion coefﬁcient of vapor into the surrounding gas, and the latent heat of vaporization) as well as solid substrate and surrounding gas properties. The literature survey shows that several theoretical works [1,2] have been carried out to propose mathematical models for evaluating the evaporation rate as a function of contact angle. Gatapova et al. [3] carried out an experimental and theoretical study to investigate the evaporation of water droplet on a heated solid substrate. Different values of wettability are considered and the three modes of evaporation (pinned and receding contact line and stick–slip mode) are analyzed. The authors reported that the

温度胁迫对珊瑚共生虫黄藻超微结构及相关基因表达的影响

1.The nSSU rDNA of zooxanthellae digested by Sau 3（AI）and Taq I ,then we obtained enzyme fragment are 850 bp ,500 bp and 900bp, 700bp,respectively. The results showed that zooxanthellae belong to sub-clade C1; The ITS-2 sequence homology analysis also indicated it is C1 clade..
2.利用透射电子显微镜观察了热应激过程中虫黄藻细胞的形态与结构变化，当温度从 28℃缓慢升至 32℃24h 时，虫黄藻细胞形态结构正常，表明此时并未对虫黄藻产生应激作用。到 32℃72h 时，受热应激的影响，虫黄藻的细胞膜开始出现变化，32℃ 168 h 时，虫黄藻的细胞损伤程度进一步加大，绝大多数虫黄藻开始表现出细胞凋亡的迹象，此时，珊瑚开始出现白化，表明虫黄藻热应激敏感性高于珊瑚组织。此外，还观察到极少数虫黄藻发生细胞坏死现象。
4.By in vitro culture of zooxanthellae,we found that the algae which isolated from Galaxea astreata can survive in ASP-8A medium for 13 days,and 9 days in f/2 medium. And when we improve the concentration of Fe3+ to 1.8*10-5M in ASP-8A medium,the zooxanthellae can alive for 15days.The results showed that Fe3+ play an important role in zooxanthellae cultivation.

土壤异位间接热脱附技术应用研究与优化策略分析

土壤异位间接热脱附技术应用研究与优化策略分析*王磊1，2，姚佳斌2，张海静1（1.上海市政工程设计研究总院（集团）有限公司，上海200092；2.同济大学，上海200092）【摘要】针对我国12个省份的16个典型异位间接热脱附工程进行调研，分析异位间接热脱附技术的应用特征。

结果表明，异位间接热脱附修复的目标污染物主要包括苯系物、氯代烃、多环芳烃、农药和石油烃等5种类型，污染物的最大超标倍数为7.60~4409.09，热脱附最高温度范围为350~750℃，热脱附停留时间不超过30min 的工程占比为94%，热脱附修复综合成本为734~1400元/m 3，平均值为1210元/m 3。

同时，对热脱附设备在工程应用中的运行问题进行识别，发现存在热脱附设备运行稳定性差、制约处理能力，热脱附系统能量利用效率低、影响处理成本等问题。

需进一步加强热脱附过程传热传质机理研究，提升设备集成化与标准化水平，提高能量利用效率。

【关键词】土壤；有机污染；修复；异位热脱附；设备优化中图分类号：X53文献标识码：A文章编号：1005-8206（2024）01-0079-08DOI ：10.19841/ki.hjwsgc.2024.01.011Application Research and Optimization Strategy Analysis of Soil Ex-situ Indirect Thermal Desorption Technology WANG Lei 1，2，YAO Jiabin 2，ZHANG Haijing 1（1.Shanghai Municipal Engineering Design Institute （Group ）Co.Ltd.，Shanghai 200092；2.Tongji University ，Shanghai200092）【Abstract 】16typical ex-situ indirect thermal desorption projects in 12provinces in China were investigated.Theapplication characteristics of ex-situ indirect thermal desorption technology were analyzed.The results showed that the target pollutants of ex-situ indirect thermal desorption remediation mainly include benzene，chlorinated hydrocarbons，polycyclic aromatic hydrocarbons，pesticides and petroleum hydrocarbons，for a total of five types.The maximum exceedance of pollutants multiples was 7.60~4409.09.The maximum thermal desorption temperature ranged from 350to 750℃，the thermal desorption residence time of less than 30min accounted for 94%of the projects，the comprehensive cost of thermal desorption repair was 734~1400yuan per square meter，the average value was 1210yuan per square meter.At the same time，the operation problems of thermal desorption equipment in engineering applications were identified，and it was found that the running stability of thermal desorption equipment was poor，which restricted the processing capacity.And the energy utilization efficiency of thermal desorption system was low，which affected the processing cost.It was necessary to further strengthening the research of thermal desorption process heat and mass transfer mechanism，improving the level of equipment integration and standardization and improving the energy utilization efficiency.【Key words 】soil；organic pollution；remediation；indirect thermal desorption；equipment optimization*基金项目：上海市2021年度“科技创新行动计划”启明星项目（21QB1404200）收稿日期：2023-08-24；录用日期：2023-11-200引言随着我国城市经济发展和产业结构调整，在“退二进三”和“退城进园”的背景下，大批工业企业将由城市人口稠密区迁往郊区或工业园区。

QSC MH-1063 MH-1075 电影中高音箱系统用户手册说明书

*TD-000180-00*Cinema Mid-High Loudspeaker System User ManualMH-1063 10” (254mm) mid, 2.5” (63mm) compression driver MH-1075 10” (254mm) mid, 3.0” (75mm) compression driverIntroductionThe MH-1063 and MH-1075 “mid-high packs” provide the mid and high frequency components of three-way screen channel loudspeaker systems for high performance cinema applications. They were designed to operate with and be directly mounted on QSC’s cinema low frequency enclosures.Mid frequencies are reproduced with a 10” (254mm) high-efficiency, phase-ring loaded driver mounted on a custom designed cinema horn. The high-frequency driver is a large format, 2.5” (63mm, MH-1063) or 3.0” (75mm, MH-1075) titanium dia-phragm compression driver mounted on a custom high-frequency cinema horn. The high frequency horn is a low-distortion waveguide providing highly articulate dialogue without coloration associated with conventional horn loudspeakers. Both horns fea-ture broad horizontal and vertical coverage angles to ensure coverage of every seat in the auditorium. The driver assemblies are mounted on an adjustable pan and tilt bracket that has an integral aiming sight, simplifying installation.The MH-1063 and MH-1075 loudspeakers include a driver protection and crossover network to assure reliable operation. DC blocking capacitors protect against DC or low-frequency signals that could damage an unprotected driver. Power limiter circuitry protects the driver from over-powering and an 18dB/octave crossover seamlessly blends the high and mid frequency elements. Outboard processing is required to form the crossover between the LF and MH loudspeakers.Bi-amp or tri-amp operation is possible using a selector switch mounted on the con-nections panel. The bi-amp setting provides a passive crossover network between mid and high drivers. Separate amplifiers and an active crossover are required for the low frequency channel and the mid-high channel. Tri-amp setting disables the internal mid-high crossover and each driver is driven independently by its own amplifier and active crossover; one for the low, one for the mid, and one for the high frequencies. The MH-1063 and MH-1075 components come pre-assembled to reduce field assem-bly time. Three bolts are all that are required to secure the mid-high assembly to the top of a QSC low frequency enclosure.Install in accordance with QSC Audio Product’s instructions and a licensed, professional engineer. Only use attachments, mounts,accessories, or brackets specified by QSC Audio Products, Inc. Refer all servicing to qualified personnel. Servicing is required when the apparatus has been damaged in any way.WARNING! Before placing, installing, rigging, or suspending any speaker product, inspect all hardware, suspension, cabinets, trans-ducers, brackets and associated equipment for damage. Any missing, corroded, deformed or non-load rated component could significantly reduce the strength of the installation, placement, or array. Any such condition severely reduces the safety of the installation and should be immediately corrected. Use only hardware which is rated for the loading conditions of the installation and any possible short-term unexpected overloading. Never exceed the rating of the hardware or equipment. Consult a licensed, professional engineer when any doubt or questions arise regarding a physical equipment installation.TD-000180-00 rev.A© Copyright 2004, QSC Audio Products, Inc.QSC® is a registered trademark of QSC Audio Products, Inc.“QSC” and the QSC logo are registered with the U.S. Patent and Trademark Office1675 MacArthur Blvd., Costa Mesa, CA, 92626 USAMain Number (714) 754-6175 Sales & Marketing (714) 957-7100 or toll free (USA only) (800) 854-4079Customer Service(714) 957-7150 or toll free (USA only) (800) 772-28342SettingsBI-AMP / TRI-AMP Operating Mode SelectionSet the operating mode selector switch to BI-AMP or TRI-AMP , depending on your application setup.MountingAttaching to Low Frequency EnclosureThe mid-high loudspeaker assembly attaches to the top of the QSC low frequency cabinet with three 5/16-18 bolts, 0.75” long, with lock washers. This hardware ships installed on the low frequency cabinet. We recommend the use of serviceable thread locking com-pound when installing the bolts to prevent loosening due to vibration. Do not fully tighten the mounting hardware before aiming (see below).AimingAim the horn in the horizontal plane (pan) before tightening the attachment hardware. Adjust the vertical tilt with the mid-high vertical adjustment bracket. The mid-high assembly is equipped with an aiming sight to assist in achieving desired coverage quickly and easily. For typical applications, the aim point should be the center seat in the back row of the auditorium. If the cinema screen has already been installed, a flashlight placed at the desired aiming point can be seen through the screen perforations in a darkened auditorium.Where the sight holes are located:How to use the sights:BI-AMP-When set to BI-AMP , the MH-1063 and MH-1075 accepts mid-high frequency signals on one set of inputs and uses an internal crossover network between the mid- and high-frequency drivers. The signal applied to the mid-high loudspeaker assembly must not contain low-frequency content (below 200 Hz).TRI-AMP- When set to TRI-AMP , the MH-1063 and MH-1075 accepts separate mid- and high-frequency signals on two sets of inputs. The inter-nal crossover network is bypassed and only the protective circuitry for the H.F. driver remains. Each of the driver’s signals must have the appropriate signal processing before operating.Do not connect amplifiers directly to the driver inputs! Always use the input terminal strip.ConnectionsINPUT TerminalsThe MH-1063 and MH-1075 have barrier strip screw terminals that accept up to #10 AWG (5.3mm2) stranded loudspeaker wire.Observe proper polarity. Use the largest wire size and shortest wire length for the application.OUTPUT TerminalsThe OUTPUT terminals are factory-connected to the drivers. These terminals should ONLY be connected to their respective driver. Do not connect signals to these terminals as all protection and equalization circuitry will be bypassed.NOTE! Maintain proper loudspeaker connection polarity throughout the entire system for maximum performance.Do not apply full range signal to the MH-1063 / MH-1075! There is a mid-high passive crossover for bi-amp modeonly. There is no crossover connected when operating in tri-amp mode. A protection network is always active. Allrequired signal processing must be done before the signal is applied to the loudspeaker. Do not connect any sig-nal to the upper sets of OUTPUT terminals.BI-AMP mode connections- Ensure the mode switch is set to BI-AMP, connect the input to the MH-1063 / MH-1075 to the lower set of input terminals marked “BI-AMP + -”.BI-AMP Mode- one Array for the low frequencychannel for the mid-highset to BI-AMP. Activecrossovers are usedmid-high assembly pro-between the mid andhigh frequency drivers.3Connections (continued)TRI-AMP mode connections- When the mode switch is set to TRI-AMP, connect the high frequency signal to the terminals marked“INPUT HI +-” and the mid frequency signal to the terminals marked “INPUT MID +-”.TRI-AMP Mode- one Array amplifier channel isused for the low fre-quency cabinet, oneamplifier channel forthe mids, and oneamplifier channel forthe high frequencies.The MH-1063 / MH-1075 mode switch isset to TRI-AMP,bypassing the internalmid-high passive cross-over. Active or passivecrossovers are usedbefore amplification.Power limiter and DCblocking remain active.4MH-1063 Specifications (subject to change without notice)Freq. Range180 - 15k (-6dB, full space)Nominal Coverage90° horizontal X +20 to -30° vertical (50° total, adjustable mount provides for vertical plane adjustments.The horizontal plane can be adjusted by altering mounting position on the low frequency enclosure beforetightening bolts.DI: 9 dB (400 to 16k Hertz average)Q: 8 (400 to 16k Hertz average)Max. Output:[Tri-amp mode] Mid Freq. 135.5 dB SPL calculated peak, 1m, full space[Tri-amp mode] High Freq. 131.5 dB SPL calculated peak, 1m, full space[Bi-amp mode] 135 dB SPL calculated peak, 1m ,full spaceImpedance:[Bi-amp mode] 8 ohms nominal7.9 ohms minimum at 1500 Hertz91 ohms maximum at 150 HertzMaximum Input Power[Tri-amp mode] Mid Freq. 275 W (AES method, 2 hrs.)[Tri-amp mode] High Freq. 60 W (AES method, 2 hrs.)[Bi-amp mode] 250 W (IEC method, 8 hrs.)Sensitivity[Tri-amp mode] Mid Freq. 105 dB SPL, 1 watt, 1 meter[Tri-amp mode] High Freq. 107.5 dB SPL, 1 watt, 1 meter[Bi-amp mode] 135 dB SPL, 1 watt, 1 meterCrossover Frequency[Tri-amp mode] 250 Hertz or higher, 24dB/octave and 1.7k Hertz, 24dB/octave[Bi-amp mode] 250 Hertz or higher, 24dB/octaveCrossover Network 1.7k Hertz, 18 dB/octave electrical slope, HF driver power limiting circuit (never disrupts continuity). Swit-chable operation between Bi-Amp and Tri-amp operation. Tri-amp setting removes crossover circuit fromsignal, leaving power limiter and DC blocking capacitors.Connectors Barrier strip screw terminals accept up to #10 AWG stranded wire. Four terminals, two HF input and twoMF input (for Tri-amp mode operation).Transducers MF: 10" high efficiency midrange, phase-ring loaded.HF: 1.5" (38mm) exit, 2.5" (63.5mm) titanium diaphragm compression driver.Mounting Hardware:Attaches to top of the low frequency cabinet using three 5/16”-18 x 3/4” long bolts.Size39” high x 30” wide x 20” deep (991 x 762 x 508mm)Weight85 lb. (39 kg) net5MH-1075 Specifications (subject to change without noticeFreq. Range180 - 15k (-6dB, full space)Nominal Coverage90° horizontal X +20 to -30° vertical (50° total, adjustable mount provides for vertical plane adjustments.The horizontal plane can be adjusted by altering mounting position on the low frequency enclosure beforetightening bolts.DI: 9 dB (400 to 16k Hertz average)Q: 8 (400 to 16k Hertz average)Max. Output:[Tri-amp mode] Mid Freq. 135.5 dB SPL calculated peak, 1m, full space[Tri-amp mode] High Freq. 133 dB SPL calculated peak, 1m, full space[Bi-amp mode] 135.5 dB SPL calculated peak, 1m ,full spaceImpedance:[Bi-amp mode] 8 ohms nominal6.4 ohms minimum at 1500 Hertz91 ohms maximum at 150 HertzMaximum Input Power[Tri-amp mode] Mid Freq. 275 W (AES method, 2 hrs.)[Tri-amp ode] High Freq. 80 W (AES method, 2 hrs.)[Bi-amp mode] 250 W (IEC method, 8 hrs.)Sensitivity[Tri-amp mode] Mid Freq. 105 dB SPL, 1 watt, 1 meter[Tri-amp mode] High Freq. 108 dB SPL, 1 watt, 1 meter[Bi-amp mode] 135.5 dB SPL, 1 watt, 1 meterCrossover Frequencies[Tri-amp mode] 250 Hertz or higher, 24dB/octave and 1.7k Hertz, 24dB/octave[Bi-amp mode] 250 Hertz or higher, 24dB/octaveCrossover Network 1.7k Hertz, 18 dB/octave electrical slope, HF driver power limiting circuit (never disrupts continuity). Swit-chable operation between Bi-Amp and Tri-amp operation. Tri-amp setting removes crossover circuit fromsignal, leaving power limiter and DC blocking capacitors.Connectors Barrier strip screw terminals accept up to #10 AWG stranded wire. Four terminals, two HF input and twoMF input (for Tri-amp mode operation).Transducers MF: 10" high efficiency midrange, phase-ring loaded.HF: 1.5" (38mm) exit, 3" (76mm) titanium diaphragm compression driver.Mounting Hardware:Attaches to top of the low frequency cabinet using three 5/16”-18 x 3/4” long bolts.Size39” high x 30” wide x 20” deep (991 x 762 x 508mm)Weight85 lb. (39 kg) net67MH-1075 SPL and Impedance vs. FrequencyFrequency (Hertz)I m p e d a n c e (O h m s )MH-1063 SPL and Impedance vs. FrequencyS P L (d B )Frequency (Hertz)I m p e d a n c e (O h m s )Warranty (USA only; other countries, see your dealer or distributor)DisclaimerQSC Audio Products, Inc. is not liable for any damage to amplifiers, or any other equipment that is caused by negligence or improper installation and/or use of this loudspeaker product.QSC Audio Products 3 Year Limited WarrantyQSC Audio Products, Inc. (“QSC”) guarantees its products to be free from defective material and / or workmanship for a period of three (3) years from date of sale, and will replace defective parts and repair malfunctioning products under this warranty when the defect occurs under normal installation and use - provided the unit is returned to our factory or one of our authorized service stations via pre-paid transportation with a copy of proof of purchase (i.e., sales receipt).This warranty provides that the examination of the return product must indicate, in our judgment, a manufacturing defect.This warranty does not extend to any product which has been subjected to misuse, neglect, accident, improper installation, or where the date code has been removed or defaced. QSC shall not be liable for incidental and/or consequential damages.This warranty gives you specific legal rights. This limited warranty is freely transferable during the term of the warranty period.Customer may have additional rights, which vary from state to state.In the event that this product was manufactured for export and sale outside of the United States or its territories, then this lim-ited warranty shall not apply. Removal of the serial number on this product, or purchase of this product from an unauthorized dealer, will void this limited warranty. Periodically, this warranty is updated. To obtain the most recent version of QSC’s war-ranty statement, please visit . Contact us at 800-854-4079 or visit our website at . Contacting QSC Audio ProductsMailing address:QSC Audio Products, Inc.1675 MacArthur BoulevardCosta Mesa, CA 92626-1468 USATelephone Numbers:Main Number (714) 754-6175Sales & Marketing (714) 957-7100 or toll free (USA only) (800) 854-4079Customer Service(714) 957-7150 or toll free (USA only) (800) 772-2834Facsimile Numbers:Sales & Marketing Fax(714) 754-6174Customer Service Fax(714) 754-6173World Wide Web:E-mail:*************************************QSC Audio Products, Inc. 1675 MacArthur Boulevard Costa Mesa, California 92626 USA©2004 “QSC” and the QSC logo are registered with the U.S. Patent and Trademark Office.。

沥青船热应力分析及总纵强度评估

当前新闻App的发展困境与对策随着智能手机的普及，新闻App已经成为了人们获取新闻资讯的重要途径之一。

随着市场竞争加剧，新闻App面临着一些发展困境。

本文将探讨当前新闻App的发展困境，并提出相关对策。

一、发展困境1. 信息过载：随着各类新闻App的涌现，用户面临着大量新闻信息的选择，导致信息过载的问题。

用户在众多新闻App中选择合适自己的一款变得更加困难。

2. 广告滥竽充数：为了盈利，一些新闻App投放大量广告，导致用户体验下降。

广告滥竽充数的做法不仅让用户感到烦恼，也降低了新闻App的品质和声誉。

3. 内容质量参差不齐：由于新闻App大多数依赖于用户上传内容，内容质量参差不齐。

一些不负责任的用户发布虚假新闻，损害了用户的利益和新闻App的声誉。

二、对策1. 精细化推荐：新闻App可以通过用户行为分析和人工智能等技术手段，向用户推荐与其兴趣相关的新闻。

用户体验良好的新闻App会受到用户喜爱和青睐。

2. 提供高质量内容：新闻App应该加强内容审核和管理，确保用户获取到的是高质量、真实可信的新闻。

加强对内容发布者的审核和把关，避免虚假新闻的传播。

3. 广告优化：新闻App应该控制广告量和广告质量，避免滥竽充数和影响用户体验。

可以通过合理的广告投放策略，提供用户感兴趣的产品和服务信息。

4. 多元化服务：新闻App可以引入一些独家服务，如用户互动、专家讲座等，增加用户粘性和忠诚度。

新闻App还可以提供一些增值服务，如专业报告服务、个性化订阅等，为用户提供更多的选择和价值。

5. 建立信任机制：新闻App可以通过建立用户评价、举报机制等，加强用户对平台的监督和信任。

新闻App还可以与权威的新闻机构合作，提供更加可靠的新闻来源。

6. 加强社交功能：新闻App可以加强社交功能，如评论互动、分享转发等，增加用户的参与感和社交属性。

通过激发用户的社交欲望，新闻App可以增加用户活跃度和留存率。

当前新闻App面临着信息过载、广告滥竽充数和内容质量参差不齐的发展困境。

211064089_微乳液脉动热管应用于锂离子电池的散热性能

化工进展Chemical Industry and Engineering Progress2023 年第 42 卷第 3 期微乳液脉动热管应用于锂离子电池的散热性能高婷婷，蒋振，吴晓毅，郝婷婷，马学虎，温荣福（大连理工大学化工学院，辽宁大连 116024）摘要：利用11弯管的脉动热管作为汽车锂离子电池的散热系统进行传热实验。

在脉动热管中引入不同比例的混合工质[H 2O 、全氟丁基甲基醚（HFE-7100）]，在模拟单体锂离子电池不同发热功率下展开传热实验，实验结果表明，微乳液工质可以有效避免高发热功率下脉动热管出现局部烧干的现象，防止电池表面温度过高发生热失控。

使用水包油（O/W ）型微乳液工质（0.048%SDBS ∶HFE-7100=1∶1）时传热性能最理想，并且可以保证锂离子单体电池正常工作（20～30W ）时，温度不超过40℃，表面温差低于1.8℃，在单体电池高发热功率（40～50W ）时，电池局部温度不超过56℃，电池表面的平均温度不超过55℃。

关键词：脉动热管；表面活性剂；混合工质；乳液；传热性能中图分类号：TK172.4 文献标志码：A 文章编号：1000-6613（2023）03-1167-11Experimental investigation on lithium-ion battery heat dissipation performance of oscillating heat pipe with micro-nano emulsionGAO Tingting ，JIANG Zhen ，WU Xiaoyi ，HAO Tingting ，MA Xuehu ，WEN Rongfu(Institute of Chemical Engineering, Dalian University of Technology, Dalian 116024, Liaoning, China)Abstract: The oscillating heat pipe (OHP) with 11 bends was employed to the heat dissipation system of the lithium-ion battery. Different proportions of hybrid fluids (H 2O and HFE-7100) were introduced into the oscillating heat pipe, and the heat transfer experiment was carried out at different heating loads to simulate a lithium-ion battery. The experimental results showed that micro-emulsion can effectively avoid the occurrences of partial drying at high heating loads and prevent thermal control due to the high temperature of the battery surface. Best heat transfer performance was obtained at oil in water (O/W) type micro-emulsion (0.048%SDBS ∶HFE-7100=1∶1) and could ensure the normal operation of lithium-ion monomer battery (20—30W), and the temperature did not exceed 40℃ and the surface temperature difference was less than 1.8℃. With the high heating loads of the monomer battery (40—50W), the local temperature of the battery was below 56℃ and the average temperature of the battery surface was below 55℃.Keywords: oscillating heat pipe; surfactant solution; hybrid fluids; emulsion; heat transfer performance 近年来化石燃料大量燃烧突显出的环境问题日益严重，针对新能源汽车相关的电池能源技术的研究呈现不断上升的趋势。

生物物理学论文：艾灸的生物物理特性_英文_

Thoughts and MethodsBiophysical characteristics of moxibustion艾灸的生物物理特性*YANG Hua-yuan (杨华元) HU Zhui-cheng (胡追成)College of Acupuncture-moxibustion and Tuina Massage, Shanghai University of TCM, Shanghai 201203, China （上海中医大学针灸推拿学院，上海 201203, 中国）ABSTRACT In recent years, new progresses have been achieved on biophysical characteristics of moxibustion. Researches aimed at elucidating the mechanism of moxibustion therapy from the view of biophysics showed that the effectiveness of moxibustion is not only the result of thermal effect, but also the joint function of spectral radiation, bio-thermal effect and non-thermal bio-effect. Currently, multi-discipline techniques are applied on the related researches which have aroused extensive concern. It may explore new ideas and methods for further expounding of mechanism of moxibustion therapy. And it is also expected to provide experimental evidence for enhancing the therapeutic effect in clinic as well as designing moxibustion-like instruments. Therefore, the article has a comprehensive statement on subjects such as moxibustion and local body temperature, infrared spectrum characteristics of moxibustion, bio-thermal effect and energy conversion of moxibustion, bio-heat transfer of moxibustion and microcirculation.KEY WORDS Moxibustion; Moxa Cone Moxibustion; Indirect Moxibustion; Biophysics［摘要］近年来，艾灸的生物物理特性研究取得了一些新的进展，从生物物理学的角度探讨灸疗的作用机制研究发现，艾灸的治疗作用并不单纯是温热效应，而是光谱辐射、生物热效应及非热生物效应等综合作用的结果。

毕设外文翻译讲解

衢州学院本科毕业设计(论文)外文翻译译文：实验室和现场的比较来确定土壤导热系数对能源基金会和其他地下换热器的影响收稿日期：2013年9月10日/接受日期：2014年4月28日在线/发布时间：2014年10月16日©施普林格科学+商业媒体有限责任公司2011年摘要：土壤热导热系数是影响能源基金会和其他地下换热器的一个重要因素。

它可以用现场热响应试验确定,这是昂贵又耗时的,但可以测试大量的土壤。

另外实验室测试法更便宜、更快可应用于较小的土壤样本。

本文研究了两种不同的实验方法:稳态热电池和瞬态探针。

从等会要进行热响应实验的现场采集一个U100土壤试样做一个小直径的测试桩。

试用两种实验室方法测试试样的导热系数。

热电池和探针测的结果明显不同,热电池法测得的导热系数始终高于探针法测得的。

热电池法的主要困难是确定热流率，因为测试设备有显着的热损失。

探针的误差少，但测试的试样比热电池的小。

然而，两种实验室方法得到的导热系数低比现场热响应试验的小得多。

对于存在这些差异的可能原因进行讨论，包括样本的大小，方向和外界干扰。

关键词：能源基金会，探针，热电池，导热系数1 介绍地源热泵系统（GSHP）提供了一个可行的替代传统的加热和冷却系统迈向可持续建筑的解决方案[6]。

热量由制冷剂的装置，它是通过一系列管道埋在地下的泵送在地面和建筑物之间传输。

为了尽量减少初期建设成本，管道可铸造成的基础，消除了需要进一步发掘。

这些系统被称为能量或热的基础。

要设计这样一个系统，它是精确模型的基础与土壤之间的热传递过程中的重要。

这种分析的一个重要的输入参数是土壤热导率。

有几种不同的实验室方法测量土壤热传导率[14,26]。

它们分为两类：稳态或瞬态方法。

在实验室规模，稳态方法涉及施加一个方向热流的试样，然后测量它的输入功率和温度差，当达到稳定状态。

的热导率，然后直接使用傅立叶定律计算。

瞬态方法包括将热施加到样品和监测温度随时间的变化。

Thermal Analysis for Silicon-based Integration of LED Systems

Thermal Analysis for Silicon-based Integration of LED Systems Mingzhi Dong1,4,*, Fabio Santagata1,4, Jia Wei1,4, Cadmus Yuan2,4, Kouchi Zhang2,3 1Beijing Research Center, Delft University of Technology, Beijing, China2Institute of Semiconductors, Chinese Academy of Sciences, Beijing, China 3DIMES, Delft University of Technology, Delft, the Netherlands4State Key Laboratory of Solid State Lighting, ChinaM.Dong-1@tudelft.nlAbstractSilicon interposer is an emerging and promising technology for 3D integration of LED systems. In this paper, the thermal performance of silicon interposer is investigated through finite element analysis (FEA). Different approaches of silicon integration are evaluated: double-side interposer and double-layer interposer. The effect of thermal interface material (TIM) on the junction temperature of LEDs is investigated. Some design recommendations are also provided within this paper.IntroductionLEDs are gaining increasing attention due to small size, high efficiency, high reliability and compatibility with electronic systems, which make them very useful for a multitude of applications including lighting, display, communication, etc. As the need for smarter electronic system increases, more functions (components) are needed to be integrated into single systems or modules [1-2]. Meanwhile, the integrated systems keep downscaling, making the integration more challenging. Thermal management is one of the crucial issues for LED system because LED generates more heat than other electronic components and the performance of LED is highly dependent on temperature.Silicon interposer is an emerging and promising technology for 3D integration of LED systems [3-4]. Our present work focuses on the integration of LED systems by means of silicon interposer technology. In this paper, the thermal performance of silicon interposer is investigated through FEA. Different approaches of silicon integration are also evaluated.Module DescriptionIn our module, the silicon interposer behaves as a packaging substrate, which provides thermal dissipation path and electrical interconnection for the components. The cavities were formed on the surface of the silicon for placing the components, including LEDs. Two different configurations were simulated and compared. The one is stacking silicon interposers, where the cavities only exist on the front side of the interposer. The other is single-layer interposers, of which the cavities were made on both the front and the back side. For stacking interposers design, the layer containing LEDs is glued on top of the layer containing other components by solder paste or thermal-conductive glue. For single-layer interposer design, LEDs locate on the front side of the interposer while all other electrical components are on the backside. The interposers are then fixed on heat sink using thermal-conductive glue. As a comparison, single-layer interposer only with LEDs on the front side is analyzed. Fig. 1 shows the schematic of the cross-sectioned view of the modules.Fig. 1 Schematic of cross-sectioned view (a) stackinginterposer (b) double-side interposer SimulationThe material properties and geometry used in the thermal simulation are listed in Tab. 1 and Tab. 2.The single-layer interposer with only LEDs was first analyzed. There are eight LEDs on the interposer, each of which generates 0.7 W of heat. The thermal conductivity and thickness of the TIM between the interposer and the heatsink was set as 0.1, 0.5, 1, 5 W/m·K and 10, 50, 100μm respectively. All the outer surfaces of the structure were convection cooled by the environment of 20o C. Then, six IC components were added on the back side of the interposer, of those only two components generate 0.2 W of heat each. Accordingly, the thickness of silicon interposer was changed from 500μm to 700μm. All other settings remained the same with previous analysis. Afterwards, stacking interposer module was simulated. The TIM between the module and the heatsink was set with a thickness of 100μm and athermalconductivity of 1 W/m·K. The thermal conductivity andthickness of the TIM between the interposers was set as 0.5, 1,10, 50 W/m·K and 10, 50, 100μm respectively.Results and DiscussionTypical temperature distributions are shown in Fig. 2. Forall the three structures, the highest temperature appears on theLEDs.(a) only LEDs(b) stacking interposer(c) double-side interposerFig. 2 Temperature distribution (TIM: 100μm, k=1.0 W/m·K)Fig. 3 Change of junction temperature with TIM properties inthe module with only LEDsFig. 4 Change of junction temperature with TIM properties in the module with double-side interposerFig. 5 Comparison of the module with only LEDs and double-side interposerFig. 3 shows the trend of the LED junction temperature with different TIM properties and thicknesses. The thicker the TIM layer is, the hotter the LED will be. If TIM with good thermal performance (k > 1 W/m·K), the effect of thickness of TIM layer is negligible.Fig. 4 shows the LED junction temperature in the double-side interposer. The trend is the same with the one with only LEDs. Due to adding IC components and increasing the thickness of the silicon interposer, the junction temperature is increased by ~5o C (shown in Fig. 5).Fig. 6 shows the junction temperature in the stacking interposer module. Compared with the single-layer interposer design, adding another interposer does not increase the temperature obviously. If the same TIM is used with thickness of 100μm and k of 1 W/m·K, the junction temperature is only increased by less than 1C. If solder paste (k~50 W/m·K) is used instead of thermal glue, even thicker layer of solder paste will not increase the thermal resistivity on the dominant heat dissipation path, which is through heat sink.Fig. 6 Change of junction temperature with TIM properties in the module with stacking interposersConclusionsSilicon interposer is a promising technology for function enrichment of small footprint LED systems.i. The TIM becomes bottleneck of thermal dissipation. TIM with thermal conductivity of higher than 1 W/m·K is recommended; otherwise the thickness of TIM layer should be carefully controlled.ii. To integrate IC components on the backside of silicon interposer, the interposer thickness becomes bigger. Compared with the heat generation of LEDs, the heat generated by ICs does not make much contribution to the increase of junction temperature of LEDs.iii. For stacking interposer design, another layer of TIM between interposers is added, that is, thermal resistivity is increased. Thermal glue with higher thermal conductivity is more appropriate. If possible, solder paste is suggested. AcknowledgmentsThe authors would like to acknowledge Dr. Sau Koh for his assistance to current research and valuable review for the paper.References1. Jeung-Mo Kang, et al, “Fabrication and Thermal Analysisof Wafer-Level Light-Emitting Diode Packages,”IEEE ELECTRON DEVICE LETTERS, Vol. 29, No. 10 (2008), pp. 1118-1120.2. Thomas Uhrmann, et al, “Silicon-Based Wafer-LevelPackaging for Cost Reduction of High Brightness LEDs,”Proc 61st Electronic Components and Technology Conf, Lake Buena Vista, FL, May-June. 2011, pp. 1622-1625. 3. Chingfu Tsou, et al, “Silicon-Based Packaging Platformfor Light-Emitting Diode,”IEEE Transactions on Advanced Packaging, Vol. 29, No. 3 (2006), pp. 607-614.4. Rong Zhang, et al, “LED Packaging using SiliconSubstrate with Cavities for Phosphor Printing and Copper-filled TSVs for 3D Interconnection,”Proc 61st Electronic Components and Technology Conf, Lake Buena Vista, FL, May-June. 2011, pp. 1616-1621.。

非平衡态分子系统中温度的计算

北京力学会第18届学术年会论文集：参评青年优秀论文非平衡态分子系统中温度的计算*徐然刘彬（清华大学工程力学系，100084）摘要：温度是自然科学的一个重要基础概念，对非平衡态系统而言，局部子系统的温度更重要，但非平衡系统中原子运动形式非常复杂，如何辨识出热扰动部分是一个需要认真考虑的问题。

本文发展了一种基于动能的非平衡态分子动力学模拟中局部温度的计算方法并证实扰动动能能够更好的表征非平衡态系统局部温度。

然而在理论和数值试验中均发现扰动动能有尺寸效应，因此不能直接使用小尺寸的子系统来消除机械振动对温度计算的影响，针对这个问题使用一个处于平衡态的分子系统做参照温度计，用修正的方法消除扰动动能的尺寸效应，得到了很好的效果。

并提出自适应的Nose-Hoover热浴算法，能够在不剥离机械运动的基础上，准确模拟恒温环境中非平衡系统的行为。

最后用一定温度下处于非平衡振动状态原子棒为例，考察了各种基于动能的温度计算方法的适用性和收敛性。

关键词：温度，非平衡态，分子动力学一、前言本文提出了一种针对非平衡态系统的基于动能的局部温度简单算法[1-25]，并用考察处于非平衡振动状态的原子棒中势能随时间的变化关系来展示算法的有效性。

二、如何滤除温度计算中刚体运动的影响？分子系统温度正比于原子的平均动能，而动能中只有扰动动能形式是客观的。

三、如何滤除温度计算中机械振动的影响？平均扰动动能有尺寸效应，依赖于所考察系统的规模。

从数值模拟和理论上都证明了尺寸效应的存在。

提出用于消除尺寸效应的非平衡态局部温度修正方法：热力学平衡系统的温度有明确定义并广泛认可，将其当作温度计修正非平衡态下H Dis，对两个子系统，若采样尺寸(N)和平均扰动动能(H Dis )均相同，则二者温度是相同的。

四、非平衡态系统中的控温方法提出修正的Nose-Hoover热浴算法[8-11,26]，包含扰动速度和修正系数，通过算例证明自适应Nose-Hoover热浴有效。

飞机专业英语词汇

1、the airframe 机身,结构2、The front (fore) part 前部3、The rear (aft) part 后部4、port 左旋(舵)5、starboard 右旋(舵)6、the inboard engine or inboards 内侧发动机7、the outboard engine or outboards 外侧发动机8、the nose 机头9、the belly 腹部10、the skin 蒙皮11、the windscreen or windshield 风挡12、the wing 机翼13、the trailing edge 机翼后缘14、the leading edge 机翼前缘15、the wing tip 翼尖16、the control surface 操纵面17、ailerons 副翼18、flaps (inboard flap,outboard flap,leading edge flaps) 襟翼（内侧襟翼，外侧襟翼，前缘缝翼）19、spoilers (inboardoutboard spoiler)(spoiler downup) 阻力板，扰流板（内、外侧扰流板）（扰流板放下、打开）20、slats 缝翼21、elevators (elevator control tab) 升降舵（升降舵操纵片）22、rudder (rudder control tab) 方向舵（方向舵操纵片）23、flap angle 襟翼角24、flap setting 襟翼调整25、the full flap position 全襟翼位置26、a flapless landing 无襟翼着陆27、the landing gear 起落架28、stabilizer 安定面29、the nose wheel 前轮30、gear locked 起落架锁定31、the wheel well 起落架舱32、the wheel door 起落架舱门33、a tyre 轮胎34、to burst 爆破35、a deflated tyre 放了气的轮胎36、a flat tyre 走了气的轮胎37、a puncture 轮胎被扎破38、to extend the flaps (to retract the flaps) 放下襟翼（收上襟翼）39、gear extention (gear retraction) 起落架放下（起落架收上）40、The gear is jammed. 起落架被卡死。

热重分析1

热分析 (Thermal Analysis)
课程内容
发展历史。热分析技术的概述。
TG原理及应用案例。
DTA (DSC)原理及应用案例。热分析的应用领域。
热分析的发展简史
公元前600年-18世纪
在文献[1]中回顾了与热有关的相转变现象的早期历史阶段鉴定粘土
1887年 Le Chàtelier 利用升温速率变化曲线来
Diamond TG/DTA/DSC同步热分析仪器
产品编号： C10450 产品型号： Labsys16
原产地：法国SETARAM公司
1.RT~1600℃;最大样品重量：20g 2.重量分辨率：0.4μg;温度精度：＜0.5℃ 3.量热精度：＜3%;热失重准确度：＜0.5% 4.DSC分辨率：0.4μW;加热速率：0.01~50.00℃ 5.冷却速率：1600~50℃，小于40分钟
TGA S-1000/1500热重分析仪产品编号： C12537 产品型号： S-1000/1500
原产地：韩国SCINCO
仪器介绍
TGA S-1000/1500是一台由计算机控制的仪器，它配有精确定位的气动炉，操作方便。小体积加热炉可快速加热和冷却。小体积吹扫可保证气体的严格控制。实验由新方法文件启动。该方法文件可使实验回复到起始阶段。这些方法文件作为实验的临时文件，包含了所有的校准信息。TGA S-1000/1500可自动称量样品，数据被直接保存到数据文件中。样品也可在外部天平称量，然后放置到样品池中。操作过程中，实验实时进行，且缩放比例随时间不断变化。一旦数据被采集，各种分析形式及图谱便产生了。 TGA S-1000/1500和Windows软件结合提供了一个良好的成本-效率体系，它适用于各种热重分析仪。

First-principles study of the structural, vibrational, phonon and thermodynamic

1. Introduction Ultra-high temperature ceramics (UHTCs) with melting temperatures in excess of 3000 K are usually composed by the refractory borides, carbides and nitrides of early transition metals [1–7]. Among the UHTCs, transition metal carbides (TMC) such as TiC, ZrC and HfC are metallic compounds with unique physical and chemical properties including an extremely high melting point and hardness, chemical stability, corrosion resistance combined with metallic electrical and thermal conductivities [5–10]. These features give transition metal carbides the capability to withstand high temperatures in oxidizing environments, making them candidates for applications in the atmosphere of extreme thermal and chemical environments [6,7]. The structural, vibrational, phonon and thermodynamic properties of IVb group transition metal carbides have been investigated experimentally [10–17] and theoretically [13,18–28] in the earlier reports. In the 1970s, the phonon dispersion relations of TiC, ZrC and HfC were measured using inelastic neutron scattering by Pintschovius et al. [10] and Smith et al. [15–17]. Lattice dynamics calculation and the phonon dispersion relations of transition metal carbides such as ZrC and HfC were reported using a phenomenological ‘‘double-shell’’ model theory [18] where long-range interatomic interactions were taken into account in order to get a