SMT焊接不良现象中英文对照表

SMT不良描述中英文对照

常用英语词汇与缩写：Accuracy：精度Additive Process：加成工艺Adhesion：附着力Aerosol：气溶剂Angle of attack：迎角Anisotropic adhesive：各异向性胶Annular ring：环状圈Application specific integrated circuit ：ASIC特殊应用集成电路Array：列阵Artwork：布线图Automated test equipment：ATE自动测试设备Bond lift-off：焊接升离Bonding agent：粘合剂CAD/CAM system：计算机辅助设计与制造系统Capillary action：毛细管作用Chip on board ：COB板面芯片Circuit tester：电路测试机Cladding：覆盖层Cold cleaning：冷清洗Cold solder joint：冷焊锡点Conductive epoxy：导电性环氧树脂Conductive ink：导电墨水Conformal coating：共形涂层Copper foil：铜箔Copper mirror test：铜镜测试Cure：烘焙固化AOI（Automatic optical inspection）：自动光学检查Assembly：组件ATE（Automated test equipment）：自动测试设备Bare Chip：裸芯片BGA（Ball grid array）球栅列阵Blind via：盲孔Blowholes：吹孔Bridge：锡桥Bridging：搭锡bulk feeder：散装式供料器Buried via：埋孔Chamber System：炉膛系统Chip：片状元件Circuit tester：电路测试机cleaning after soldering：焊后清洗Cold solder joint：冷焊锡点Component Check：元件检查Component density：元件密度Component Pick-Up：元件拾取Component Transport：元件传送Component：元件convection reflow soldering：热对流再流焊Copper Clad Laminates：覆铜箔层压板Copper foil：铜箔Copper mirror test：铜镜测试CSP（Chip Scale Package）：芯片规模的封装CTE（Coefficient of the thermal expansion）：温度膨胀系数Cure：烘焙固化Cursting：发生皮层Cycle rate：循环速率Data recorder：数据记录器Defect：缺陷Delamination：分层Desoldering：卸焊Dewetting：去湿DFM：为制造着想的设计Dispersant：分散剂Documentation：文件编制Downtime：停机时间Durometer：硬度计Desoldering：卸焊Device：器件Dewetting：缩锡DIP：双列直插Downtime：停机时间Dpm（defects per million）：百万缺陷率dual wave soldering：双波峰焊Dull Joint：焊点灰暗Environmental test：环境测试Eutectic solders：共晶焊锡Excessive Paste：膏量太多FCT（Functional test）：功能测试feeder holder：供料器架feeders：供料器Fiducial：基准点Fillet：焊角Fine-pitch technology ：FPT密脚距技术Fixture：夹具Flexibility：柔性flexible stencil：柔性金属漏版Flip chip：倒装芯片flux bubbles：焊剂气泡flying：飞片FPT（Fine-pitch technology）：密脚距技术Full liquidus temperature：完全液化温度Golden boy：金样Fundamentals of Solders and Soldering焊料及焊接基础知识Soldering Theory焊接理论Microstructure and Soldering显微结构及焊接Effect of Elemental Constituents on Wetting焊料成分对润湿的影响Effect of Impurities on Soldering杂质对焊接的影响Solder Paste Technology焊膏工艺Solder Powder 锡粉Solder Paste Rheology锡膏流变学Solder Paste Composition & Manufacturing锡膏成分和制造SMT Problems Occurred Prior to Reflow回流前SMT问题Flux Separation助焊剂分离Paste Hardening焊膏硬化Poor Stencil Life网板寿命问题Poor Print Thickness印刷厚度不理想Poor Paste Release From Squeegee锡膏脱离刮刀问题Smear印锡模糊Insufficiency锡不足Needle Clogging针孔堵塞Slump塌落Low Tack低粘性Short Tack Time 粘性时间短SMT Problems Occurred During Reflow回流过程中的SMT问题Cold Joints冷焊Nonwetting不润湿Dewetting反润湿Leaching浸析Intermetallics金属互化物Tombstoning立碑Skewing歪斜Wicking焊料上吸Bridging桥连Voiding空洞Opening开路Solder Balling锡球Solder Beading锡珠Spattering飞溅SMT Problems Occurred at Post Reflow Stage回流后问题White Residue白色残留物Charred Residue炭化残留物Poor Probing Contact探针测接问题Surface Insulation Resistance or Electrochemical Migration Failure表面绝缘阻抗或电化迁移缺陷Delamination/Voiding/Non-curing Of Conformal Coating/Encapsulants分层/空洞/敷形涂覆或包封的固化问题Challenges at BGA and CSP Assembly and Rework Stage BGA、CSP组装和翻修的挑战Starved Solder Joint少锡焊点Poor Self-Alignment自对位问题Poor Wetting润湿不良Voiding空洞Bridging桥连Uneven Joint Height焊点高度不均Open开路Popcorn and Delamination爆米花和分层Solder Webbing锡网Solder Balling锡球Problems Occurred at Flip Chip Reflow Attachment倒装晶片回流期间发生的问题Misalignment位置不准Poor Wetting润湿不良Solder Voiding空洞Underfill Voiding底部填充空洞Bridging桥连Open开路Underfill Crack底部填充裂缝Delamination分层）Filler Segregation填充分离Insufficient Underfilling底部填充不充分Optimizing Reflow Profile via Defect Mechanisms Analysis回流曲线优化与缺陷机理分析Flux Reaction助焊剂反应Peak Temperature峰值温度Cooling Stage冷却阶段Heating Stage加热阶段Timing Considerations时间研究Optimization of Profile曲线优化Comparison with Conventional Profiles与传统曲线的比较Discussion讨论Implementing Linear Ramp Up Profile斜坡式曲线general placement equipment：中速贴装机Golden boy：金样Halides：卤化物Hard water：硬水Hardener：硬化剂high speed placement equipment：高速贴装机hot air reflow soldering：热风再流焊ICT（In-circuit test）：在线测试In-circuit test：在线测试Insufficient Paste：膏量不足JIT（Just-in-time）：刚好准时laser reflow soldering：激光再流焊LCCC（Leadless Ceramic Chip Carrier）：无引脚陶瓷芯片载体Lead configuration：引脚外形Line certification：生产线确认located soldering：局部软钎焊low speed placement equipment：低速贴装机low temperature paste：低温焊膏Machine vision：机器视觉Mean time between failure ：MTBF平均故障间隔时间Manhattan effect：曼哈顿现象melf：圆柱形元件metal stencil：金属漏版Misalignment：偏斜Modularity：模块化Movement：移位no-clean solder paste：免清洗焊膏Non-Dewetting：不沾锡Nonwetting：不熔湿的optic correction system ：光学校准系统Organic activated ：OA有机活性的Packaging density：装配密度Photoploter：相片绘图仪Placement equipment：贴装设备past mask：焊膏膜(漏板）paste shelf life：焊膏贮存寿命PCB（Printed circuit board）：印刷电路板Pick-and-place：拾取-贴装设备placement accuracy：贴装精度placement direction：贴装方位Placement equipment：贴装设备placement pressure：贴装压力Placement Procedure：元件放置placement speed：贴装速度PLCC（Plastic Leaded Chip Carrier）：塑型有引脚芯片载体Poor Tack Retention：粘着力不足precise placement equipment：精密贴装机PTH （Pin Through the Hole）：通孔安装QFP（Quad Flat Package）：多引脚方形扁平封装Reflow soldering：回流焊接Repair：修理Repeatability：可重复性Rheology：流变学repeatability：重复性resolution：分辨率Rework：返工rotating deviation：旋转偏差Schematic：原理图Semi-aqueous cleaning：不完全水清洗Shadowing：阴影Silver chromate test：铬酸银测试Slump：坍落Solder bump：焊锡球Solderability：可焊性Soldermask：阻焊Solids：固体。

不良现象中英对照表(Intel)

27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54
極反立碑偏移/傾斜助焊劑殘留零件腳不出零件腳太長零件腳太短腳未入腳未彎缺蓋章缺標籤缺序號序號錯標籤錯標示錯 JI 不潔錫凹陷線序錯未測試 VR變形 PCB翹皮 PCB彎曲零件沾膠零件腳長浮件零件腳翹零件相觸零件變形
Chinese
Chinese English(Intel) 電晶體壞 Transistor Wrong 振盪器壞 Diode NG 管裝錯誤 Tubes Wrong 阻值錯誤 Impedance Wrong 版本錯誤 Rev. Wrong 電測不良 Test Failure 版本未標 Non Rev Label 包裝損壞 Packing Damage 印章模糊 Stamps Defective 標籤歪斜 Label Tilt 外箱損壞 Carton Damaged 點膠不良 Poor Glue IC座氧化 Socket Rust 缺UL標示 Missing UL Label 線材不良 Wire Failure 設計不良(H/W) Design Bug(Hardware) 設計不良(F/W) Design Bug(Firmware) 組裝不良 Assembling Fail 匹配不良 Compatibility Issue 加工不良 Fabricating Fail 設備不良 Equipment Fail 補線斷線 Broken Circuit after Repairing 零件不良 Component Fail/Defective materials 線材不良 Defective cables 配備機構件不良Periphral Unit Fail Excess Solder 多錫

焊接缺陷中英文对照

焊接缺陷1.裂缝：crack （焊缝/弧坑/热影响区裂纹:weld metal/crater/heat-affected Zone (HAZ) crack）2.焊瘤:overlap3.冷隔：cold lap4.未焊满: under fill / incompletely filled groove5.咬边: undercut6.道间没有圆滑过渡/焊缝凹陷：bum effect / Excessive concave7.未溶合: lack of fusion / incomplete fusion8.气孔:gas pore / blowhole (针尖状气孔:pinhole; 密集气孔:porosity; 条虫状气孔:wormhole)9.夹渣: slag inclusion (夹钨:tungsten inclusion; 夹杂物:inclusion)10.未焊透:incomplete penetration / lack of penetration11.过度焊缝加强高：excessive reinforce / Excessive weld metal12.电弧烧伤：Arc strike / Arc burn13.焊接变形: welding deformation14.烧穿:burn through15.塌陷: excessive penetration16.凹坑:pit / dent17.过度打磨：excessive grindingscar焊疤：18.19.飞溅：spatter20.焊缝成行不好：poor profile21.焊角不足：lack of weld leg附录 attachment焊接工艺方法1.熔焊:fusion welding 压焊:pressure welding 钎焊:brazing welding2.焊缝倾角:weld slope, inclination of weld axis.3.焊缝转角:weld rotation, angle of rotation4.平焊:flat position of welding, downhand welding 横焊:Horizontal position welding.5.立焊:vertical position welding 仰焊:overhead position welding.6.向下立焊:vertical down welding, downward welding in the vertical position.7.向上立焊:vertical up welding, upward welding in the vertical position.8.倾斜焊;inclined position welding9.上坡焊: upward welding in the inclined position10.下坡焊: downward welding in the inclined position11.对接焊:butt welding 角焊:fillet welding 搭接焊:lap welding12.船形焊: fillet welding in the downhand / flat position13.坡口焊:groove welding14.I 形坡口对接焊:square groove welding15.Y形坡口对接焊:flare groove welding16.纵缝焊接:welding of longitudinal seam. 横缝焊接:welding of transverse seam.17.环缝焊接:girth welding, circumferential welding18.螺旋缝焊接:welding of spiral seam, welding of helical seam.19.环缝对接焊:Butt welding of circumferential seam.20.单面焊:welding by one side 双面焊:welding by both sides21.单道焊:single-pass welding, single-run welding 多道焊: multi-pass welding..22.单层焊:single layer welding 多层焊:multi-layer welding23.分段多层焊:block sequence, block welding24.连续焊:continuous welding 打底焊:backing welding 封底焊:back sealing weld25.自动焊:automatic welding 半自动焊:semi-automatic welding26.手工焊:manual welding, hand welding27.车间焊接:shop welding 工地焊接:site welding, field welding:surfacing welding, building up welding, overlaying welding.堆焊28.29.衬垫焊:welding with backing.30.焊剂垫焊:welding with flux backing31.电弧点焊:arc spot welding.32.套环:ferrule 试板test piece 随机检查random check33.单面/双面串联点焊:direct/indirect serial spots welding.34.机械性能试验mechanical properties test35.简历curriculum vitae36.分类category37.风险评估risk assessment38.第三方notified body39.基准modules坡口, 焊缝1.焊接工艺参数:welding parameter2.坡口: groove 钝边:root face3.坡口面角度: angle of bevel, bevel angle.4.坡口角度: Included angle, groove angle.5.坡口高度:groove depth6.开坡口:beveling of the edge, chamfering.7.single-V/U groove (with root face)8.焊缝区:weld metal zone 热影响区:heat-affected Zone (HAZ)9.工艺/使用/热/焊接性:fabrication/service/thermal weldability.10.碳弧气刨:carbon arc air gouging. 火焰气刨:flame gouging11.等离子切割:plasma arc cutting(PAC) 激光切割: laser cutting (LC)12.喷沙: sand blast 清渣:slag removal 清根: back chipping13.碳/铬/镍当量:carbon/chromium/nickel equivalent.电弧焊1.手工电弧焊:manual metal arc welding2.直流电弧焊:direct current arc welding3.交流电弧焊:alternating current arc welding4.三相电弧焊:three phases current arc welding5.熔化极电弧焊: arc welding with consumable electrode6.金属极电弧焊:metal arc welding 电弧堆焊:arc surfacing7.碳弧焊:carbon arc welding 自动堆焊:automatic surfacing8.埋弧焊:submerged-arc welding (SAW)9.自动埋弧焊:automatic submerged-arc welding (SAW)10.半自动埋弧焊:semi-automatic submerged-arc welding (SAW)11.气体保护焊:gas shielded arc welding12.惰性气体保护焊:inert-gas arc welding:argon arc welding氩弧焊13.14.钨极惰性气体保护焊:tungsten inert-gas arc welding15.活性气体保护焊:metal active gas arc welding16.Co2气体保护焊:carbon-dioxide arc welding.17.电渣焊:electro-slag welding (ESW) 电阻焊:resistance welding (RW)18.点焊:spot welding 摩擦焊:friction welding (FW) 爆炸焊: explosive welding (EW)19.热切割: thermal cutting (TC) 气割: gas cutting20.塑性/脆性:plastic/brittle21.焊缝\环焊缝\打磨:welding seam\circumference seam\grind22.发证:certification issue焊接检验1.试件/试样: test piece/specimen2.直射/斜射/水浸超声探伤:straight/angle beam/immersed ultrasonic inspection3.射线探伤:radiographic inspection 超声探伤:ultrasonic inspection4.磁粉探伤:magnetic particle examination 渗透探伤: penetration inspection5.荧光检验:fluorescent penetration inspection6.着色检验:dye penetration inspection7.电磁法探伤:electromagnetic test8.密封性检验:leak test 气密性检验: airtight test10. 破坏检验:destructive test9.耐压检验:pressure test 水压试验:hydraulic test 气压试验:pneumatic test10.声发射:acoustic emersion11.淬火：quenching 回火：tempering退火：annealing 熔炼：smelting12.强制检验:mandatory inspection13.拉伸试验\弯曲试验\冲击试验:tension test\bend test\impact test14.金相检查:metallographic exam15.面弯\背弯\侧弯\断口\弯曲条件:face bend\root bend\side bend\break\condition of bend16.合格级别\评定级别\底片编号acceptable grade\interpretation level\radiograph no17.铱同位素:iridium isotopewelding inspection clearance groove, assembly space whether it meets ?the requirements, positioning it firmly welding, weld around is not oil,rust;清理焊口：焊前检查坡口、组装间隙是否符合要求，定位焊是否牢固，焊缝周围不得有油污、锈物；开孔前要按照图纸给定的方位、标高，结合排版图进行放样、测量、号孔、划线。

不良中英文对照表

不良现象中英文对照表1.缺件(missing parts)2.错件(wrong parts)3.多件(excessive parts)4.短路(short)5.断路(open)6.线短(wire short)7.线长(wire long)8.拐线(wire poor ddress)9.冷焊(cold solder)10.包焊(excess solder)11.空焊(missing solder)12.锡尖(solder icicle)13.锡渣(solder splash)14.锡裂(soder crack)15.锡洞(pin hole)16.锡球(solder ball)17.锡桥(solder bridge)18.滑牙(screw loose)19.氧化(rust)20.异物(foreigner material)21.溢胶(excessive glue)22.锡短路(solder bridge)23.锡不足(solder insufficient)24.极性反(wrong polarity)25.脚未入(pin unseated)26.脚未出(pin unvisible)27.脚未剪(pin no cut)28.脚未弯(pin not bent)29.缺盖章(missing stamp)30.缺标签(missing label)31.缺序号(missing s/n)32.序号错(wrong s/n)33.标签错(wrong label)34.标示错(wrong mark)35.脚太短(pin short)36.j1不洁(j1 dirty)37.锡凹陷(solder scooped)38.线序错(w/l of wire)39.未测试(no test) 40.vr变形(vr deformed)43.零件沾胶(glue on parts)41.pcb翘皮(pcb peeling)42.pcb弯曲(pcb twist)44.零件脚长(parts pin long)45.浮件(parts lift)46.零件歪斜(parts tilt)47.零件相触(parts touch)48.零件变形(parts deformed)49.零件损坏(parts damaged)50.零件脚脏(pin dirty)51.零件多装(parts excess)52.零件沾锡(solder on parts)53.零件偏移(parts shift)54.包装错误(wrong packing)55.印章错误(wrong stamps)56.尺寸错误(dimension wrong)57.二极管坏(diode ng)58.晶体管坏(transistor ng)59.振荡器坏(x’tl ng)60.管装错误(tubes wrong)61.阻值错误(impedance wrong)62.版本错误(rev wrong)63.电测不良(test failure)64.版本未标(non rev lebel)65.包装损坏(packing damaged)66.印章模糊(stamps defective)67.标签歪斜(label tilt)68.外箱损坏(carton damaged)69.点胶不良(poor glue)70.ic座氧化(socket rust)71.缺ul标签(missing ul label)72.线材不良(wire failure)73.零件脚损坏(pin damaged)74.金手指沾锡(solder on golden fingers)75.包装文件错(racking doc wrong)76.包装数量错(packing q’ty wrong)77.零件未定位(parts unseated)78.金手指沾胶(glue on golden fingers)79.垫片安装不良(washer unseated)80.线材安装不良(wire unseated)81.立碑(tombstone)。

焊接缺陷中英文对照

焊接缺陷中英文对照焊接缺陷1.裂缝：crack （焊缝/弧坑/热影响区裂纹:weld metal/crater/heat-affected Zone (HAZ) crack）2.焊瘤:overlap3.冷隔：cold lap4.未焊满: under fill / incompletely filled groove5.咬边: undercut6.道间没有圆滑过渡/焊缝凹陷：bum effect / Excessive concave7.未溶合: lack of fusion / incomplete fusion8.气孔:gas pore / blowhole (针尖状气孔:pinhole; 密集气孔:porosity; 条虫状气孔:wormhole)9.夹渣: slag inclusion (夹钨:tungsten inclusion; 夹杂物:inclusion)10.未焊透:incomplete penetration / lack of penetration11.过度焊缝加强高：excessive reinforce / Excessive weld metal12.电弧烧伤：Arc strike / Arc burn13.焊接变形: welding deformation14.烧穿:burn through15.塌陷: excessive penetration16.凹坑:pit / dent17.过度打磨：excessive grinding18.焊疤：scar19.飞溅：spatter20.焊缝成行不好：poor profile21.焊角不足：lack of weld leg附录attachment焊接工艺方法1.熔焊:fusion welding 压焊:pressure welding 钎焊:brazing welding2.焊缝倾角:weld slope, inclination of weld axis.3.焊缝转角:weld rotation, angle of rotation4.平焊:flat position of welding, downhand welding 横焊:Horizontal position welding.5.立焊:vertical position welding 仰焊:overhead position welding.6.向下立焊:vertical down welding, downward welding in the vertical position.7.向上立焊:vertical up welding, upward welding in the vertical position.8.倾斜焊;inclined position welding9.上坡焊: upward welding in the inclined position10.下坡焊: downward welding in the inclined position11.对接焊:butt welding 角焊:fillet welding 搭接焊:lap welding12.船形焊: fillet welding in the downhand / flat position13.坡口焊:groove welding14.I 形坡口对接焊:square groove welding15.Y形坡口对接焊:flare groove welding16.纵缝焊接:welding of longitudinal seam. 横缝焊接:welding of transverse seam.17.环缝焊接:girth welding, circumferential welding18.螺旋缝焊接:welding of spiral seam, welding of helical seam.19.环缝对接焊:Butt welding of circumferential seam.20.单面焊:welding by one side 双面焊:welding by both sides21.单道焊:single-pass welding, single-run welding 多道焊: multi-pass welding..22.单层焊:single layer welding 多层焊:multi-layer welding23.分段多层焊:block sequence, block welding24.连续焊:continuous welding 打底焊:backing welding 封底焊:back sealing weld25.自动焊:automatic welding 半自动焊:semi-automatic welding26.手工焊:manual welding, hand welding27.车间焊接:shop welding 工地焊接:site welding, field welding28.堆焊:surfacing welding, building up welding, overlaying welding.29.衬垫焊:welding with backing.30.焊剂垫焊:welding with flux backing31.电弧点焊:arc spot welding.32.套环:ferrule 试板test piece 随机检查random check33.单面/双面串联点焊:direct/indirect serial spots welding.34.机械性能试验mechanical properties test35.简历curriculum vitae36.分类category37.风险评估risk assessment38.第三方notified body39.基准modules坡口, 焊缝1.焊接工艺参数:welding parameter2.坡口: groove 钝边:root face3.坡口面角度: angle of bevel, bevel angle.4.坡口角度: Included angle, groove angle.5.坡口高度:groove depth6.开坡口:beveling of the edge, chamfering.7.single-V/U groove (with root face)8.焊缝区:weld metal zone 热影响区:heat-affected Zone (HAZ)9.工艺/使用/热/焊接性:fabrication/service/thermal weldability.10.碳弧气刨:carbon arc air gouging. 火焰气刨:flame gouging11.等离子切割:plasma arc cutting(PAC) 激光切割: laser cutting (LC)12.喷沙: sand blast 清渣:slag removal 清根: back chipping13.碳/铬/镍当量:carbon/chromium/nickel equivalent.电弧焊1.手工电弧焊:manual metal arc welding2.直流电弧焊:direct current arc welding3.交流电弧焊:alternating current arc welding4.三相电弧焊:three phases current arc welding5.熔化极电弧焊: arc welding with consumable electrode6.金属极电弧焊:metal arc welding 电弧堆焊:arc surfacing7.碳弧焊:carbon arc welding 自动堆焊:automatic surfacing8.埋弧焊:submerged-arc welding (SAW)9.自动埋弧焊:automatic submerged-arc welding (SAW)10.半自动埋弧焊:semi-automatic submerged-arc welding (SAW)11.气体保护焊:gas shielded arc welding12.惰性气体保护焊:inert-gas arc welding13.氩弧焊:argon arc welding14.钨极惰性气体保护焊:tungsten inert-gas arc welding15.活性气体保护焊:metal active gas arc welding16.Co2气体保护焊:carbon-dioxide arc welding.17.电渣焊:electro-slag welding (ESW) 电阻焊:resistance welding (RW)18.点焊:spot welding 摩擦焊:friction welding (FW) 爆炸焊: explosive welding (EW)19.热切割: thermal cutting (TC) 气割: gas cutting20.塑性/脆性:plastic/brittle21.焊缝环焊缝打磨:welding seam\circumference seam\grind22.发证:certification issue焊接检验1.试件/试样: test piece/specimen2.直射/斜射/水浸超声探伤:straight/angle beam/immersed ultrasonic inspection3.射线探伤:radiographic inspection 超声探伤:ultrasonic inspection4.磁粉探伤:magnetic particle examination 渗透探伤: penetration inspection5.荧光检验:fluorescent penetration inspection6.着色检验:dye penetration inspection7.电磁法探伤:electromagnetic test8.密封性检验:leak test 气密性检验: airtight test10. 破坏检验:destructive test9.耐压检验:pressure test 水压试验:hydraulic test 气压试验:pneumatic test10.声发射:acoustic emersion11.淬火：quenching 回火：tempering退火：annealing 熔炼：smelting12.强制检验:mandatory inspection13.拉伸试验弯曲试验冲击试验:tension test\bend test\impact test14.金相检查:metallographic exam15.面弯背弯侧弯断口弯曲条件:face bend\root bend\side bend\break\condition of bend16.合格级别评定级别底片编号acceptable grade\interpretation level\radiograph no17.铱同位素:iridium isotopewelding inspection clearance groove, assembly space whether it meetsthe requirements, positioning it firmly welding, weld aroundis not oil, rust;清理焊口：焊前检查坡口、组装间隙是否符合要求，定位焊是否牢固，焊缝周围不得有油污、锈物；开孔前要按照图纸给定的方位、标高，结合排版图进行放样、测量、号孔、划线。

装配过程不良现象中英文对照表

72 线材不良 WIRE FAILURE
73 零件脚损坏 PIN DAMAGED
74 金手指沾锡 SOLDER ON GOLDEN FINGERS
75 包装文件错 RACKING DOC WRONG
76 包装数量错 PACKING Q’TY WRONG
77 零件未定位 PARTS UNSEATED
78 金手指沾胶 GLUE ON GOLDEN FINGERS
装配过程不良现象中英文对照表（续）
序
号
中文
51 零件多装
52 零件沾锡
53 零件偏移
54 包装错误
55 印章错误
56 尺寸错误
57 二极管坏
58 晶体管坏
59 振荡器坏
60 管装错误
61 阻值错误
62 版本错误
不良现象英文
PARTS EXCESS SOLDER ON PARTS PARTS SHIFT WRONG PACKING WRONG STAMPS DIMENSION WRONG DIODE NG TRANSISTOR NG X’TL NG TUBES WRONG IMPEDANCE WRONG REV WRONG
序
号
中文
26 脚未出
27 脚未剪
28 脚未弯
29 缺盖章
30 缺标签
31 缺序号
32 序号错
33 标签错
34 标示错
35 脚太短
36 J1 不洁
37 锡凹陷
38 线序错
39 未测试
40 VR 变形
41 PCB 翘皮
42 PCB 弯曲
43 零件沾胶
44 零件脚长
45 浮件
46 零件歪斜

常见不良中英文对照

常見不良現象中英文對照表
英文 poor solder mask PAD defect forming defect board bent extra component component deform ICT test fail voltage defect no voltage wire open no boot BIOS flash error cann't flash BIOS cann't RESET battery no voltage
中文 CACHE MEMORY不良 A磁碟機不讀 IDE1硬碟機不讀或不抓 KEYBOARD LOCK不良 GREEN不良速度不對或不能切換 LED燈不亮或不良喇叭不叫或亂叫 COM 1/2不良 LPT1不良 CMOS設定不良時間不動 ID 00不良 CARD不良 WINDOWS當機
power short CPU frequency error MEMORY defect KEYBOARD defect HIMEM ERROR or hang up shrinkage pool streak surface check surface roughening surging sweat out torsion warpage waviness webbing weld mant G/F scratch G/F residue glue G/F etching defect
中文 PCB不良空焊短路缺件錯件反向位移偏移翻面立碑側立錫球錫多吃錫不良條碼不良
殘留助焊劑板面不澍零件破損溢錫零件氧化矯直色差霧化凸料紋咬入塗料孔(鑄疵) 塗料疤起泡起霜泛白皺紋冒口帶肉膜泡糊斑毛邊毛邊翹曲表面中部波皺細裂痕龜裂修整表面缺陷鑄件凹痕

(完整版)SMT常见焊接不良

PCB常見不良
Pad氧化(Pad Discoloration)
PCB應上錫出呈灰暗色,土黃色,甚至出現黑色顆粒氧化物
PCB常見不良
漏銅(Expose Copper)
PCB絕緣漆覆蓋處或PAD漏出銅箔
PCB常見不良
VIA孔不良(Via Defect)
孔被異物堵塞,或有多餘的錫
PCB常見不良
線路短路(Trace short)
元件本體有裂紋
SMT常見焊接不良
標籤褶皺 (Lable peeling)
完整具有可讀性,SFC掃描無問題,為允收
SMT常見焊接不良
共面度(Coplanarity Defect)
元件一個或多個引腳變形,不能與焊盤正常接觸
PCB常見缺失
1:焊盤氧化(Pad discoloration) 2:漏銅(Exposed Copper) 3:VIA孔不良(Via defect) 4:線路短路(Trace short)
Pad 上沾有綠油,影響正產焊接
PCB常見不良
絲印不良(Defect silkscreen)
絲印重影,造成不可辨識
PCB常見不良
PCB髒污(Contamination On PCB)
表面殘留灰塵,金屬顆粒物質
PCB常見不良
PCB斷線(Trace open)
線路阻抗為無窮大或著阻抗偏大於正常值
PCB常見不良
SMT常見焊接不良
1:錫珠(Solder ball)
13:反向(Polarity Orientation)
2:錫渣(Solder splashes)
14:殘留助焊劑(Flux Residues)
3:側立(Mounting On Side)

SMT常见焊接不良

SMT常見焊接不良
短路(bridging)
焊不同兩點間電阻值為0,或不應導通兩點導通

SMT常見焊接不良
針孔(Pinholes)
製程示警,其焊錫量需滿足焊接最低要求.

SMT常見焊接不良
元件破損(Component Damaged)
元件本體有裂紋

SMT常見焊接不良
標籤褶皺 (Lable peeling)

1:錫珠(Solder ball)
SMT常見焊接不良
13:反向(Polarity Orientation)
14:殘留助焊劑(Flux Residues) 15:錯件(Worng Part) 16:多錫(Extra solder) 17:多件(Extra Part) 18:燈芯(Solder wicking) 19:錫裂(Fractured Solder) 20:短路(Solder short)
錫珠(Solder Ball)
焊接过程中的加热急速而使焊料飞散所致 ,焊料的印刷错位，塌边

SMT常見焊接不良
錫渣(Solder Splashes)
由於焊料潑濺於PCB造成,網狀細小焊料

SMT常見焊接不良
側立(Gross placement)
晶片元件側向(90度)焊接在Pad上.

SMT常見焊接不良
線路短路(Trace short)
常見的有PCB內部線路層短路(通過萬用表量測),以及外觀目檢PCB 表層線路短路

PCB常見不良
分層,氣泡(Dlamination)
發生起泡,分層區域不超過鍍覆孔,或內部導線間距25%

PCB常見不良
板翹Twist board)

焊接缺陷中英文对照

焊接缺陷1.裂缝：crack （焊缝/弧坑/热影响区裂纹:weld metal/crater/heat-affected Zone (HAZ) crack）2.焊瘤:overlap3.冷隔：cold lap4.未焊满: under fill / incompletely filled groove5.咬边: undercut6.道间没有圆滑过渡/焊缝凹陷：bum effect / Excessive concave7.未溶合: lack of fusion / incomplete fusion8.气孔:gas pore / blowhole (针尖状气孔:pinhole; 密集气孔:porosity; 条虫状气孔:wormhole)9.夹渣: slag inclusion (夹钨:tungsten inclusion; 夹杂物:inclusion)10.未焊透:incomplete penetration / lack of penetration11.过度焊缝加强高：excessive reinforce / Excessive weld metal12.电弧烧伤：Arc strike / Arc burn13.焊接变形: welding deformation14.烧穿:burn through15.塌陷: excessive penetration16.凹坑:pit / dent17.过度打磨：excessive grinding18.焊疤：scar19.飞溅：spatter20.焊缝成行不好：poor profile21.焊角不足：lack of weld leg附录attachment焊接工艺方法1.熔焊:fusion welding 压焊:pressure welding 钎焊:brazing welding2.焊缝倾角:weld slope, inclination of weld axis.3.焊缝转角:weld rotation, angle of rotation4.平焊:flat position of welding, downhand welding 横焊:Horizontal position welding.5.立焊:vertical position welding 仰焊:overhead position welding.6.向下立焊:vertical down welding, downward welding in the vertical position.7.向上立焊:vertical up welding, upward welding in the vertical position.8.倾斜焊;inclined position welding9.上坡焊: upward welding in the inclined position10.下坡焊: downward welding in the inclined position11.对接焊:butt welding 角焊:fillet welding 搭接焊:lap welding12.船形焊: fillet welding in the downhand / flat position13.坡口焊:groove welding14.I 形坡口对接焊:square groove welding15.Y形坡口对接焊:flare groove welding16.纵缝焊接:welding of longitudinal seam. 横缝焊接:welding of transverse seam.17.环缝焊接:girth welding, circumferential welding18.螺旋缝焊接:welding of spiral seam, welding of helical seam.19.环缝对接焊:Butt welding of circumferential seam.20.单面焊:welding by one side 双面焊:welding by both sides21.单道焊:single-pass welding, single-run welding 多道焊: multi-pass welding..22.单层焊:single layer welding 多层焊:multi-layer welding23.分段多层焊:block sequence, block welding24.连续焊:continuous welding 打底焊:backing welding 封底焊:back sealing weld25.自动焊:automatic welding 半自动焊:semi-automatic welding26.手工焊:manual welding, hand welding27.车间焊接:shop welding 工地焊接:site welding, field welding28.堆焊:surfacing welding, building up welding, overlaying welding.29.衬垫焊:welding with backing.30.焊剂垫焊:welding with flux backing31.电弧点焊:arc spot welding.32.套环:ferrule 试板test piece 随机检查random check33.单面/双面串联点焊:direct/indirect serial spots welding.34.机械性能试验mechanical properties test35.简历curriculum vitae36.分类category37.风险评估risk assessment38.第三方notified body39.基准modules坡口, 焊缝1.焊接工艺参数:welding parameter2.坡口: groove 钝边:root face3.坡口面角度: angle of bevel, bevel angle.4.坡口角度: Included angle, groove angle.5.坡口高度:groove depth6.开坡口:beveling of the edge, chamfering.7.single-V/U groove (with root face)8.焊缝区:weld metal zone 热影响区:heat-affected Zone (HAZ)9.工艺/使用/热/焊接性:fabrication/service/thermal weldability.10.碳弧气刨:carbon arc air gouging. 火焰气刨:flame gouging11.等离子切割:plasma arc cutting(PAC) 激光切割: laser cutting (LC)12.喷沙: sand blast 清渣:slag removal 清根: back chipping13.碳/铬/镍当量:carbon/chromium/nickel equivalent.电弧焊1.手工电弧焊:manual metal arc welding2.直流电弧焊:direct current arc welding3.交流电弧焊:alternating current arc welding4.三相电弧焊:three phases current arc welding5.熔化极电弧焊: arc welding with consumable electrode6.金属极电弧焊:metal arc welding 电弧堆焊:arc surfacing7.碳弧焊:carbon arc welding 自动堆焊:automatic surfacing8.埋弧焊:submerged-arc welding (SAW)9.自动埋弧焊:automatic submerged-arc welding (SAW)10.半自动埋弧焊:semi-automatic submerged-arc welding (SAW)11.气体保护焊:gas shielded arc welding12.惰性气体保护焊:inert-gas arc welding13.氩弧焊:argon arc welding14.钨极惰性气体保护焊:tungsten inert-gas arc welding15.活性气体保护焊:metal active gas arc welding16.Co2气体保护焊:carbon-dioxide arc welding.17.电渣焊:electro-slag welding (ESW) 电阻焊:resistance welding (RW)18.点焊:spot welding 摩擦焊:friction welding (FW) 爆炸焊: explosive welding (EW)19.热切割: thermal cutting (TC) 气割: gas cutting20.塑性/脆性:plastic/brittle21.焊缝\环焊缝\打磨:welding seam\circumference seam\grind22.发证:certification issue焊接检验1.试件/试样: test piece/specimen2.直射/斜射/水浸超声探伤:straight/angle beam/immersed ultrasonic inspection3.射线探伤:radiographic inspection 超声探伤:ultrasonic inspection4.磁粉探伤:magnetic particle examination 渗透探伤: penetration inspection5.荧光检验:fluorescent penetration inspection6.着色检验:dye penetration inspection7.电磁法探伤:electromagnetic test8.密封性检验:leak test 气密性检验: airtight test10. 破坏检验:destructive test9.耐压检验:pressure test 水压试验:hydraulic test 气压试验:pneumatic test10.声发射:acoustic emersion11.淬火：quenching 回火：tempering退火：annealing 熔炼：smelting12.强制检验:mandatory inspection13.拉伸试验\弯曲试验\冲击试验:tension test\bend test\impact test14.金相检查:metallographic exam15.面弯\背弯\侧弯\断口\弯曲条件:face bend\root bend\side bend\break\condition of bend16.合格级别\评定级别\底片编号acceptable grade\interpretation level\radiograph no17.铱同位素:iridium isotope•welding inspection clearance groove, assembly space whether it meets the requirements, positioning it firmly welding, weld around is not oil, rust;清理焊口：焊前检查坡口、组装间隙是否符合要求，定位焊是否牢固，焊缝周围不得有油污、锈物；•开孔前要按照图纸给定的方位、标高，结合排版图进行放样、测量、号孔、划线。

SMT 不良描述中英文对照

常用英语词汇与缩写：Accuracy：精度Additive Process：加成工艺Adhesion：附着力Aerosol：气溶剂Angle of attack：迎角Anisotropic adhesive：各异向性胶Annular ring：环状圈Application specific integrated circuit ：ASIC特殊应用集成电路Array：列阵Artwork：布线图Automated test equipment：ATE自动测试设备Bond lift-off：焊接升离Bonding agent：粘合剂CAD/CAM system：计算机辅助设计与制造系统Capillary action：毛细管作用Chip on board ：COB板面芯片Circuit tester：电路测试机Cladding：覆盖层Cold cleaning：冷清洗Cold solder joint：冷焊锡点Conductive epoxy：导电性环氧树脂Conductive ink：导电墨水Conformal coating：共形涂层Copper foil：铜箔Copper mirror test：铜镜测试Cure：烘焙固化AOI（Automatic optical inspection）：自动光学检查Assembly：组件ATE（Automated test equipment）：自动测试设备Bare Chip：裸芯片BGA（Ball grid array）球栅列阵Blind via：盲孔Blowholes：吹孔Bridge：锡桥Bridging：搭锡bulk feeder：散装式供料器Buried via：埋孔Chamber System：炉膛系统Chip：片状元件Circuit tester：电路测试机cleaning after soldering：焊后清洗Cold solder joint：冷焊锡点Component Check：元件检查Component density：元件密度Component Pick-Up：元件拾取Component Transport：元件传送Component：元件convection reflow soldering：热对流再流焊Copper Clad Laminates：覆铜箔层压板Copper foil：铜箔Copper mirror test：铜镜测试CSP（Chip Scale Package）：芯片规模的封装CTE（Coefficient of the thermal expansion）：温度膨胀系数Cure：烘焙固化Cursting：发生皮层Cycle rate：循环速率Data recorder：数据记录器Defect：缺陷Delamination：分层Desoldering：卸焊Dewetting：去湿DFM：为制造着想的设计Dispersant：分散剂Documentation：文件编制Downtime：停机时间Durometer：硬度计Desoldering：卸焊Device：器件Dewetting：缩锡DIP：双列直插Downtime：停机时间Dpm（defects per million）：百万缺陷率dual wave soldering：双波峰焊Dull Joint：焊点灰暗Environmental test：环境测试Eutectic solders：共晶焊锡Excessive Paste：膏量太多FCT（Functional test）：功能测试feeder holder：供料器架feeders：供料器Fiducial：基准点Fillet：焊角Fine-pitch technology ：FPT密脚距技术Fixture：夹具Flexibility：柔性flexible stencil：柔性金属漏版Flip chip：倒装芯片flux bubbles：焊剂气泡flying：飞片FPT（Fine-pitch technology）：密脚距技术Full liquidus temperature：完全液化温度Golden boy：金样Fundamentals of Solders and Soldering焊料及焊接基础知识Soldering Theory焊接理论Microstructure and Soldering显微结构及焊接Effect of Elemental Constituents on Wetting焊料成分对润湿的影响Effect of Impurities on Soldering杂质对焊接的影响Solder Paste Technology焊膏工艺Solder Powder 锡粉Solder Paste Rheology锡膏流变学Solder Paste Composition & Manufacturing锡膏成分和制造SMT Problems Occurred Prior to Reflow回流前SMT问题Flux Separation助焊剂分离Paste Hardening焊膏硬化Poor Stencil Life网板寿命问题Poor Print Thickness印刷厚度不理想Poor Paste Release From Squeegee锡膏脱离刮刀问题Smear印锡模糊Insufficiency锡不足Needle Clogging针孔堵塞Slump塌落Low Tack低粘性Short Tack Time 粘性时间短SMT Problems Occurred During Reflow回流过程中的SMT问题Cold Joints冷焊Nonwetting不润湿Dewetting反润湿Leaching浸析Intermetallics金属互化物Tombstoning立碑Skewing歪斜Wicking焊料上吸Bridging桥连Voiding空洞Opening开路Solder Balling锡球Solder Beading锡珠Spattering飞溅SMT Problems Occurred at Post Reflow Stage回流后问题White Residue白色残留物Charred Residue炭化残留物Poor Probing Contact探针测接问题Surface Insulation Resistance or Electrochemical Migration Failure表面绝缘阻抗或电化迁移缺陷Delamination/Voiding/Non-curing Of Conformal Coating/Encapsulants分层/空洞/敷形涂覆或包封的固化问题Challenges at BGA and CSP Assembly and Rework Stage BGA、CSP组装和翻修的挑战Starved Solder Joint少锡焊点Poor Self-Alignment自对位问题Poor Wetting润湿不良Voiding空洞Bridging桥连Uneven Joint Height焊点高度不均Open开路Popcorn and Delamination爆米花和分层Solder Webbing锡网Solder Balling锡球Problems Occurred at Flip Chip Reflow Attachment倒装晶片回流期间发生的问题Misalignment位置不准Poor Wetting润湿不良Solder Voiding空洞Underfill Voiding底部填充空洞Bridging桥连Open开路Underfill Crack底部填充裂缝Delamination分层）Filler Segregation填充分离Insufficient Underfilling底部填充不充分Optimizing Reflow Profile via Defect Mechanisms Analysis回流曲线优化与缺陷机理分析Flux Reaction助焊剂反应Peak Temperature峰值温度Cooling Stage冷却阶段Heating Stage加热阶段Timing Considerations时间研究Optimization of Profile曲线优化Comparison with Conventional Profiles与传统曲线的比较Discussion讨论Implementing Linear Ramp Up Profile斜坡式曲线general placement equipment：中速贴装机Golden boy：金样Halides：卤化物Hard water：硬水Hardener：硬化剂high speed placement equipment：高速贴装机hot air reflow soldering：热风再流焊ICT（In-circuit test）：在线测试In-circuit test：在线测试Insufficient Paste：膏量不足JIT（Just-in-time）：刚好准时laser reflow soldering：激光再流焊LCCC（Leadless Ceramic Chip Carrier）：无引脚陶瓷芯片载体Lead configuration：引脚外形Line certification：生产线确认located soldering：局部软钎焊low speed placement equipment：低速贴装机low temperature paste：低温焊膏Machine vision：机器视觉Mean time between failure ：MTBF平均故障间隔时间Manhattan effect：曼哈顿现象melf：圆柱形元件metal stencil：金属漏版Misalignment：偏斜Modularity：模块化Movement：移位no-clean solder paste：免清洗焊膏Non-Dewetting：不沾锡Nonwetting：不熔湿的optic correction system ：光学校准系统Organic activated ：OA有机活性的Packaging density：装配密度Photoploter：相片绘图仪Placement equipment：贴装设备past mask：焊膏膜(漏板）paste shelf life：焊膏贮存寿命PCB（Printed circuit board）：印刷电路板Pick-and-place：拾取-贴装设备placement accuracy：贴装精度placement direction：贴装方位Placement equipment：贴装设备placement pressure：贴装压力Placement Procedure：元件放置placement speed：贴装速度PLCC（Plastic Leaded Chip Carrier）：塑型有引脚芯片载体Poor Tack Retention：粘着力不足precise placement equipment：精密贴装机PTH （Pin Through the Hole）：通孔安装QFP（Quad Flat Package）：多引脚方形扁平封装Reflow soldering：回流焊接Repair：修理Repeatability：可重复性Rheology：流变学repeatability：重复性resolution：分辨率Rework：返工rotating deviation：旋转偏差Schematic：原理图Semi-aqueous cleaning：不完全水清洗Shadowing：阴影Silver chromate test：铬酸银测试Slump：坍落Solder bump：焊锡球Solderability：可焊性Soldermask：阻焊Solids：固体。

焊接缺陷中英文对照

焊接缺陷1.裂缝：crack （焊缝/弧坑/热影响区裂纹:weld metal/crater/heat-affected Zone (HAZ) crack）2.焊瘤:overlap3.冷隔：cold lap4.未焊满: under fill / incompletely filled groove5.咬边: undercut6.道间没有圆滑过渡/焊缝凹陷：bum effect / Excessive concave7.未溶合: lack of fusion / incomplete fusion8.气孔:gas pore / blowhole (针尖状气孔:pinhole; 密集气孔:porosity; 条虫状气孔:wormhole)9.夹渣: slag inclusion (夹钨:tungsten inclusion; 夹杂物:inclusion)10.未焊透:incomplete penetration / lack of penetration11.过度焊缝加强高：excessive reinforce / Excessive weld metal12.电弧烧伤：Arc strike / Arc burn13.焊接变形: welding deformation14.烧穿:burn through15.塌陷: excessive penetration16.凹坑:pit / dent17.过度打磨：excessive grinding18.焊疤：scar19.飞溅：spatter20.焊缝成行不好：poor profile21.焊角不足：lack of weld leg附录attachment焊接工艺方法1.熔焊:fusion welding 压焊:pressure welding 钎焊:brazing welding2.焊缝倾角:weld slope, inclination of weld axis.3.焊缝转角:weld rotation, angle of rotation4.平焊:flat position of welding, downhand welding 横焊:Horizontal position welding.5.立焊:vertical position welding 仰焊:overhead position welding.6.向下立焊:vertical down welding, downward welding in the vertical position.7.向上立焊:vertical up welding, upward welding in the vertical position.8.倾斜焊;inclined position welding9.上坡焊: upward welding in the inclined position10.下坡焊: downward welding in the inclined position11.对接焊:butt welding 角焊:fillet welding 搭接焊:lap welding12.船形焊: fillet welding in the downhand / flat position13.坡口焊:groove welding14.I 形坡口对接焊:square groove welding15.Y形坡口对接焊:flare groove welding16.纵缝焊接:welding of longitudinal seam. 横缝焊接:welding of transverse seam.17.环缝焊接:girth welding, circumferential welding18.螺旋缝焊接:welding of spiral seam, welding of helical seam.19.环缝对接焊:Butt welding of circumferential seam.20.单面焊:welding by one side 双面焊:welding by both sides21.单道焊:single-pass welding, single-run welding 多道焊: multi-pass welding..22.单层焊:single layer welding 多层焊:multi-layer welding23.分段多层焊:block sequence, block welding24.连续焊:continuous welding 打底焊:backing welding 封底焊:back sealing weld25.自动焊:automatic welding 半自动焊:semi-automatic welding26.手工焊:manual welding, hand welding27.车间焊接:shop welding 工地焊接:site welding, field welding28.堆焊:surfacing welding, building up welding, overlaying welding.29.衬垫焊:welding with backing.30.焊剂垫焊:welding with flux backing31.电弧点焊:arc spot welding.32.套环:ferrule 试板test piece 随机检查random check33.单面/双面串联点焊:direct/indirect serial spots welding.34.机械性能试验mechanical properties test35.简历curriculum vitae36.分类category37.风险评估risk assessment38.第三方notified body39.基准modules坡口, 焊缝1.焊接工艺参数:welding parameter2.坡口: groove 钝边:root face3.坡口面角度: angle of bevel, bevel angle.4.坡口角度: Included angle, groove angle.5.坡口高度:groove depth6.开坡口:beveling of the edge, chamfering.7.single-V/U groove (with root face)8.焊缝区:weld metal zone 热影响区:heat-affected Zone (HAZ)9.工艺/使用/热/焊接性:fabrication/service/thermal weldability.10.碳弧气刨:carbon arc air gouging. 火焰气刨:flame gouging11.等离子切割:plasma arc cutting(PAC) 激光切割: laser cutting (LC)12.喷沙: sand blast 清渣:slag removal 清根: back chipping13.碳/铬/镍当量:carbon/chromium/nickel equivalent.电弧焊1.手工电弧焊:manual metal arc welding2.直流电弧焊:direct current arc welding3.交流电弧焊:alternating current arc welding4.三相电弧焊:three phases current arc welding5.熔化极电弧焊: arc welding with consumable electrode6.金属极电弧焊:metal arc welding 电弧堆焊:arc surfacing7.碳弧焊:carbon arc welding 自动堆焊:automatic surfacing8.埋弧焊:submerged-arc welding (SAW)9.自动埋弧焊:automatic submerged-arc welding (SAW)10.半自动埋弧焊:semi-automatic submerged-arc welding (SAW)11.气体保护焊:gas shielded arc welding12.惰性气体保护焊:inert-gas arc welding13.氩弧焊:argon arc welding14.钨极惰性气体保护焊:tungsten inert-gas arc welding15.活性气体保护焊:metal active gas arc welding16.Co2气体保护焊:carbon-dioxide arc welding.17.电渣焊:electro-slag welding (ESW) 电阻焊:resistance welding (RW)18.点焊:spot welding 摩擦焊:friction welding (FW) 爆炸焊: explosive welding (EW)19.热切割: thermal cutting (TC) 气割: gas cutting20.塑性/脆性:plastic/brittle21.焊缝\环焊缝\打磨:welding seam\circumference seam\grind22.发证:certification issue焊接检验1.试件/试样: test piece/specimen2.直射/斜射/水浸超声探伤:straight/angle beam/immersed ultrasonic inspection3.射线探伤:radiographic inspection 超声探伤:ultrasonic inspection4.磁粉探伤:magnetic particle examination 渗透探伤: penetration inspection5.荧光检验:fluorescent penetration inspection6.着色检验:dye penetration inspection7.电磁法探伤:electromagnetic test8.密封性检验:leak test 气密性检验: airtight test10. 破坏检验:destructive test9.耐压检验:pressure test 水压试验:hydraulic test 气压试验:pneumatic test10.声发射:acoustic emersion11.淬火：quenching 回火：tempering退火：annealing 熔炼：smelting12.强制检验:mandatory inspection13.拉伸试验\弯曲试验\冲击试验:tension test\bend test\impact test14.金相检查:metallographic exam15.面弯\背弯\侧弯\断口\弯曲条件:face bend\root bend\side bend\break\condition of bend16.合格级别\评定级别\底片编号acceptable grade\interpretation level\radiograph no17.铱同位素:iridium isotope∙welding inspection clearance groove, assembly space whether it meets the requirements, positioning it firmly welding, weld around is not oil, rust;清理焊口：焊前检查坡口、组装间隙是否符合要求，定位焊是否牢固，焊缝周围不得有油污、锈物；∙开孔前要按照图纸给定的方位、标高，结合排版图进行放样、测量、号孔、划线。

焊接缺陷中英文对照

焊接缺陷中英文对照(总4页) -CAL-FENGHAI.-(YICAI)-Company One1-CAL-本页仅作为文档封面，使用请直接删除焊接缺陷1.裂缝：crack （焊缝/弧坑/热影响区裂纹:weldmetal/crater/ heat-affected Zone (HAZ) crack）2.焊瘤:overlap3.冷隔：cold lap4.未焊满: under fill / incompletely filled groove5.咬边: undercut6.道间没有圆滑过渡/焊缝凹陷：bum effect / Excessiveconcave7.未溶合: lack of fusion / incomplete fusion8.气孔:gas pore / blowhole (针尖状气孔:pinhole; 密集气孔:porosity; 条虫状气孔:wormhole)9.夹渣: slag inclusion (夹钨:tungsten inclusion; 夹杂物:inclusion)10.未焊透:incomplete penetration / lack ofpenetration11.过度焊缝加强高：excessive reinforce / Excessiveweld metal12.电弧烧伤：Arc strike / Arc burn13.焊接变形: welding deformation14.烧穿:burn through15.塌陷: excessive penetration16.凹坑:pit / dent17.过度打磨：excessive grinding18.焊疤：scar19.飞溅：spatter20.焊缝成行不好：poor profile21.焊角不足：lack of weld leg附录 attachment焊接工艺方法1.熔焊:fusion welding 压焊:pressure welding 钎焊:brazing welding2.焊缝倾角:weld slope, inclination of weld axis.3.焊缝转角:weld rotation, angle of rotation4.平焊:flat position of welding, downhand welding 横焊:Horizontalposition welding.5.立焊:vertical position welding 仰焊:overhead position welding.6.向下立焊:vertical down welding, downward welding in the verticalposition.7.向上立焊:vertical up welding, upward welding in the verticalposition.8.倾斜焊;inclined position welding9.上坡焊: upward welding in the inclined position10.下坡焊: downward welding in the inclined position11.对接焊:butt welding 角焊:fillet welding 搭接焊:lap welding12.船形焊: fillet welding in the downhand / flat position13.坡口焊:groove welding14.I 形坡口对接焊:square groove welding15.Y形坡口对接焊:flare groove welding16.纵缝焊接:welding of longitudinal seam. 横缝焊接:welding oftransverse seam.17.环缝焊接:girth welding, circumferential welding18.螺旋缝焊接:welding of spiral seam, welding of helical seam.19.环缝对接焊:Butt welding of circumferential seam.20.单面焊:welding by one side 双面焊:welding by both sides21.单道焊:single-pass welding, single-run welding 多道焊: multi-passwelding..22.单层焊:single layer welding 多层焊:multi-layer welding23.分段多层焊:block sequence, block welding24.连续焊:continuous welding 打底焊:backing welding 封底焊:backsealing weld25.自动焊:automatic welding 半自动焊:semi-automatic welding26.手工焊:manual welding, hand welding27.车间焊接:shop welding 工地焊接:site welding, field welding28.堆焊:surfacing welding, building up welding, overlaying welding.29.衬垫焊:welding with backing.30.焊剂垫焊:welding with flux backing31.电弧点焊:arc spot welding.32.套环:ferrule 试板test piece 随机检查random check33.单面/双面串联点焊:direct/indirect serial spots welding.34.机械性能试验mechanical properties test35.简历curriculum vitae36.分类category37.风险评估risk assessment38.第三方notified body39.基准modules坡口, 焊缝1.焊接工艺参数:welding parameter2.坡口: groove 钝边:root face3.坡口面角度: angle of bevel, bevel angle.4.坡口角度: Included angle, groove angle.5.坡口高度:groove depth6.开坡口:beveling of the edge, chamfering.7.single-V/U groove (with root face)8.焊缝区:weld metal zone 热影响区:heat-affected Zone (HAZ)9.工艺/使用/热/焊接性:fabrication/service/thermal weldability.10.碳弧气刨:carbon arc air gouging. 火焰气刨:flame gouging11.等离子切割:plasma arc cutting(PAC) 激光切割: laser cutting (LC)12.喷沙: sand blast 清渣:slag removal 清根: back chipping13.碳/铬/镍当量:carbon/chromium/nickel equivalent.电弧焊1.手工电弧焊:manual metal arc welding2.直流电弧焊:direct current arc welding3.交流电弧焊:alternating current arc welding4.三相电弧焊:three phases current arc welding5.熔化极电弧焊: arc welding with consumable electrode6.金属极电弧焊:metal arc welding 电弧堆焊:arc surfacing7.碳弧焊:carbon arc welding 自动堆焊:automatic surfacing8.埋弧焊:submerged-arc welding (SAW)9.自动埋弧焊:automatic submerged-arc welding (SAW)10.半自动埋弧焊:semi-automatic submerged-arc welding (SAW)11.气体保护焊:gas shielded arc welding12.惰性气体保护焊:inert-gas arc welding13.氩弧焊:argon arc welding14.钨极惰性气体保护焊:tungsten inert-gas arc welding15.活性气体保护焊:metal active gas arc welding16.Co2气体保护焊:carbon-dioxide arc welding.17.电渣焊:electro-slag welding (ESW) 电阻焊:resistance welding (RW)18.点焊:spot welding 摩擦焊:friction welding (FW) 爆炸焊:explosive welding (EW)19.热切割: thermal cutting (TC) 气割: gas cutting20.塑性/脆性:plastic/brittle21.焊缝\环焊缝\打磨:welding seam\circumference seam\grind22.发证:certification issue焊接检验1.试件/试样: test piece/specimen2.直射/斜射/水浸超声探伤:straight/angle beam/immersed ultrasonicinspection3.射线探伤:radiographic inspection 超声探伤:ultrasonic inspection4.磁粉探伤:magnetic particle examination 渗透探伤: penetrationinspection5.荧光检验:fluorescent penetration inspection6.着色检验:dye penetration inspection7.电磁法探伤:electromagnetic test8.密封性检验:leak test 气密性检验: airtight test10. 破坏检验:destructive test9.耐压检验:pressure test 水压试验:hydraulic test 气压试验:pneumatic test10.声发射:acoustic emersion11.淬火：quenching 回火：tempering退火：annealing 熔炼：smelting12.强制检验:mandatory inspection13.拉伸试验\弯曲试验\冲击试验:tension test\bend test\impact test14.金相检查:metallographic exam15.面弯\背弯\侧弯\断口\弯曲条件:face bend\root bend\sidebend\break\condition of bend16.合格级别\评定级别\底片编号acceptable grade\interpretationlevel\radiograph no17.铱同位素:iridium isotopewelding inspection clearance groove, assembly space whether it meets the requirements, positioning it firmly welding, weld around is not oil, rust;清理焊口：焊前检查坡口、组装间隙是否符合要求，定位焊是否牢固，焊缝周围不得有油污、锈物；开孔前要按照图纸给定的方位、标高，结合排版图进行放样、测量、号孔、划线。

不良现象中英文对照表（2）

41.PCB翘⽪（PCB PEELING） 42.PCB弯曲（PCB TWIST） 43.零件沾胶（GLUE ON PARTS） 44.零件脚长（PARTS PIN LONG） 45.浮件（PARTS LIFT） 46.零件歪斜（PARTS TILT） 47.零件相触（PARTS TOUCH） 48.零件变形（PARTS DEFORMED） 49.零件损坏（PARTS DAMAGED） 50.零件脚脏（PIN DIRTY） 51.零件多装（PARTS EXCESS） 52.零件沾锡（SOLDER ON PARTS） 53.零件偏移（PARTS SHIFT） 54.包装错误（WRONG PACKING） 55.印章错误（WRONG STAMPS） 56.尺⼨错误（DIMENSION WRONG） 57.⼆极管坏（DIODE NG） 58.晶体管坏（TRANSISTOR NG） 59.振荡器坏（X'TL NG） 60.管装错误（TUBES WRONG） 61.阻值错误（IMPEDANCE WRONG） 62.版本错误（REV WRONG） 63.电测不良（TEST FAILURE） 64.版本未标（NON REV LEBEL） 65.包装损坏（PACKING DAMAGED） 66.印章模糊（STAMPS DEFECTIVE） 67.标签歪斜（LABEL TILT） 68.外箱损坏（CARTON DAMAGED） 69.点胶不良（POOR GLUE） 70.IC座氧化（SOCKET RUST） 71.缺UL标签（MISSING UL LABEL） 72.线材不良（WIRE FAILURE） 73.零件脚损坏（PIN DAMAGED） 74.⾦⼿指沾锡（SOLDER ON GOLDEN FINGERS） 75.包装⽂件错（RACKING DOC WRONG） 76.包装数量错（PACKING Q'TY WRONG） 77.零件未定位（PARTS UNSEATED） 78.⾦⼿指沾胶（GLUE ON GOLDEN FINGERS） 79.垫⽚安装不良（WASHER UNSEATED） 80.线材安装不良（WIRE UNSEATED） 81.⽴碑（TOMBSTONE）。

各类SMT缺陷中英文解释

SP MP DS/SS ST 组移连锡件位焊尖放歪
TP SU CS/US WP PE PB P0 PCS 组侧虚错 PAD PCB PCB 线件立焊件脱断烘路立落裂焦短起路
BP 管脚弯曲
CD 组件功能失效
DP NTF 组误件测损坏
Barcode 手机识别码

故障类型号 station locatiom SG CS EP ES FL FM FP GP IS OP PM IP RP SB SH 站元沾冷多多浮外反金少空漏撞极锡锡别件胶焊件锡高来白手锡焊件件性珠孔异指贴物沾反锡
TBA 待分析
TBA 待分析
Barcode 手机识别码
故障类型号 station locatiom SG CS EP ES FL FM FP GP IS OP PM IP RP SB SH 站元沾冷多多浮外反金少空漏撞极锡锡别件胶焊件锡高来白手锡焊件件性珠孔异指贴物沾反锡
SP MP DS/SS ST 组移连锡件位焊尖放歪
TP SU CS/US WP PE PB P0 PCS 组侧虚错 PAD PCB PCB 线件立焊件脱断烘路立落裂焦短起路
BP 管脚弯曲
CD 组件功能失效
DP NTF 组误件测损坏

不良信息中英文对照

MARK点错误
其他错误
窗口偏出
窗口抽出偏移
没有检查
抽出错误
焊盘抽出错误
元件本体抽出错误
引脚抽出错误
缺件（本体测出）
缺件（焊锡测出）
缺件（引脚测出）
没有极性标识（极性错误）没有标志（丝印标识测试）横向偏移
纵向偏移
引脚弯曲
翘脚
丝印偏移
文字错误
文字读取错误
锡桥
引脚锡桥
吹孔
粘合剂错误
成型角异常（焊锡角度）成型角异常（焊锡缺口）浸润异常
浸润异常（焊锡整体）
浸润异常（引脚上锡）
浸润异常（引脚部分）
锡球
锡球引脚部分
焊盘露出
条码错误
条码读取错误
少锡
X方向偏移
Y方向偏移
X方向偏移（焊盘）Y方向偏移（焊盘）横向偏移
纵向偏移
锡桥（自动抽出）锡桥(单独的）
脏污
多锡。

SMT焊接不良现象中英文对照表

[replyview]不良现象中英文对照表1.缺件(MISSING PARTS) 28.脚未弯(PIN NOT BENT) 55.印章错误(WRONG STAMPS)2.错件(WRONG PARTS) 29.缺盖章(MISSING STAMP) 56.尺寸错误(DIMENSION WRONG)3.多件(EXCESSIVE PARTS) 30.缺卷标(MISSING LABEL) 57.二极管坏(DIODE NG)4.短路(SHORT) 31.缺序号(MISSING S/N) 58.晶体管坏(TRANSISTOR NG)5.断路(OPEN) 32.序号错(WRONG S/N) 59.振荡器坏(X’TL NG)6.线短(WIRE SHORT) 33.卷标错(WRONG LABEL) 60.管装错误(TUBES WRONG)7.线长(WIRE LONG) 34.标示错(WRONG MARK) 61.阻值错误(IMPEDANCE WRONG)8.拐线(WIRE POOR DDRESS) 35.脚太短(PIN SHORT) 62.版本错误(REV WRONG)9.冷焊(COLD SOLDER) 36.J1不洁(J1 DIRTY) 63.电测不良(TEST FAILURE)10.包焊(EXCESS SOLDER) 37.锡凹陷(SOLDER SCOOPED) 64.版本未标(NON REV LEBEL)11.空焊(MISSING SOLDER) 38.线序错(W/L OF WIRE) 65.包装损坏(PACKING DAMAGED)12.锡尖(SOLDER ICICLE) 39.未测试(NO TEST) 66.印章模糊(STAMPS DEFECTIVE)13.锡渣(SOLDER SPLASH) 40.VR变形(VR DEFORMED) 67.卷标歪斜(LABEL TILT)14.锡裂(SODER CRACK) 41.PCB翘皮(PCB PEELING) 68.外箱损坏(CARTON DAMAGED)15.锡洞(PIN HOLE) 42.PCB弯曲(PCB TWIST) 69.点胶不良(POOR GLUE)16.锡球(SOLDER BALL) 43.零件沾胶(GLUE ON PARTS) 70.IC座氧化(SOCKET RUST)17.锡桥(SOLDER BRIDGE) 44.零件脚长(PARTS PIN LONG) 71.缺UL卷标(MISSING UL LABEL)18.滑牙(SCREW LOOSE) 45.浮件(PARTS LIFT) 72.线材不良(WIRE FAILURE)19.氧化(RUST) 46.零件歪斜(PARTS TILT) 73.零件脚损坏(PIN DAMAGED)20.异物(FOREIGNER MATERIAL) 47.零件相触(PARTS TOUCH) 74.金手指沾锡(SOLDER ON GOLDEN FINGERS)21.溢胶(EXCESSIVE GLUE) 48.零件变形(PARTS DEFORMED) 75.包装文件错(RACKING DOC WRONG)22.锡短路(SOLDER BRIDGE) 49.零件损坏(PARTS DAMAGED) 76.包装数量错(PACKING Q’TY WRO NG)23.锡不足(SOLDER INSUFFICIENT) 50.零件脚脏(PIN DIRTY) 77.零件未定位(PARTS UNSEATED)24.极性反(WRONG POLARITY) 51.零件多装(PARTS EXCESS) 78.金手指沾胶(GLUE ON GOLDEN FINGERS)25.脚未入(PIN UNSEATED) 52.零件沾锡(SOLDER ON PARTS) 79.垫片安装不良(WASHER UNSEATED)26.脚未出(PIN UNVISIBLE) 53.零件偏移(PARTS SHIFT) 80.线材安装不良(WIRE UNSEATED)27.脚未剪(PIN NO CUT) 54.包装错误(WRONG PACKING) 81. 立碑(TOMBSTONE)。

SMT术语中英文对照

SMT术语中英文对照来源：作者：发布时间：2007-08-161.缺件(MISSING PARTS) 28.腳未彎(PIN NOTBENT) 55.印章錯誤(WRONG STAMPS)2.錯件(WRONG PARTS) 29.缺蓋章(MISSINGSTAMP) 56.尺寸錯誤(DIMENSION WRONG)3.多件(EXCESSIVE PARTS) 30.缺標籤(MISSINGLABEL) 57.二極體壞(DIODE NG)4.短路(SHORT) 31.缺序號(MISSINGS/N) 58.電晶體壞(TRANSISTOR NG)5.斷路(OPEN) 32.序號錯(WRONGS/N) 59.振盪器壞(X’TL NG)6.線短(WIRE SHORT) 33.標籤錯(WRONGLABEL) 60.管裝錯誤(TUBES WRONG)7.線長(WIRE LONG) 34.標示錯(WRONGMARK) 61.阻值錯誤(IMPEDANCE WRONG)8.拐線(WIRE POOR DDRESS) 35.腳太短(PINSHORT) 62.版本錯誤(REV WRONG)9.冷焊(COLD SOLDER) 36.J1不潔(J1DIRTY) 63.電測不良(TEST FAILURE)10.包焊(EXCESS SOLDER) 37.錫凹陷(SOLDER SCOOPED) 64.版本未標(NON REV LEBEL)11.空焊(MISSING SOLDER) 38.線序錯(W/L OFWIRE) 65.包裝損壞(PACKING DAMAGED)12.錫尖(SOLDER ICICLE) 39.未測試(NOTEST) 66.印章模糊(STAMPS DEFECTIVE)13.錫渣(SOLDER SPLASH) 40.VR變形(VR DEFORMED) 67.標籤歪斜(LABEL TILT)14.錫裂(SODER CRACK) 41.PCB翹皮(PCBPEELING) 68.外箱損壞(CARTON DAMAGED)15.錫洞(PIN HOLE) 42.PCB彎曲(PCBTWIST) 69.點膠不良(POOR GLUE)16.錫球(SOLDER BALL) 43.零件沾膠(GLUE ONPARTS) 70.IC座氧化(SOCKET RUST)17.錫橋(SOLDER BRIDGE) 44.零件腳長(PARTS PIN LONG) 71.缺UL標籤(MISSING UL LABEL)18.滑牙(SCREW LOOSE) 45.浮件(PARTSLIFT) 72.線材不良(WIRE FAILURE)19.氧化(RUST) 46.零件歪斜(PARTSTILT) 73.零件腳損壞(PIN DAMAGED)20.異物(FOREIGNER MATERIAL) 47.零件相觸(PARTS TOUCH) 74.金手指沾錫(SOLDER ON GOLDEN FINGERS)21.溢膠(EXCESSIVE GLUE) 48.零件變形(PARTS DEFORMED) 75.包裝文件錯(RACKING DOC WRONG)22.錫短路(SOLDER BRIDGE) 49.零件損壞(PARTS DAMAGED) 76.包裝數量錯(PACKING Q’TY WRONG)23.錫不足(SOLDER INSUFFICIENT) 50.零件腳髒(PINDIRTY) 77.零件未定位(PARTS UNSEATED)24.極性反(WRONG POLARITY) 51.零件多裝(PARTS EXCESS) 78.金手指沾膠(GLUE ON GOLDEN FINGERS)25.腳未入(PIN UNSEATED) 52.零件沾錫(SOLDER ON PARTS) 79.墊片安裝不良(WASHER UNSEATED)26.腳未出(PIN UNVISIBLE) 53.零件偏移(PARTSSHIFT) 80.線材安裝不良(WIRE UNSEATED)27.腳未剪(PIN NO CUT) 54.包裝錯誤(WRONGPACKING) 81. 立碑(TOMBSTONE)。