SN54AS169A中文资料
SN54LS157J中文资料
PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)76002012A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC 7600201EA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC 7600201FA ACTIVE CFP W161TBD Call TI Level-NC-NC-NC 76033012A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC 7603301EA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC 7603301FA ACTIVE CFP W161TBD Call TI Level-NC-NC-NCJM38510/07903BEA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NCJM38510/07903BFA ACTIVE CFP W161TBD Call TI Level-NC-NC-NCJM38510/07904BEA OBSOLETE CDIP J16TBD Call TI Call TIJM38510/07904BFA OBSOLETE CFP W16TBD Call TI Call TIJM38510/30903B2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NCJM38510/30903BEA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NCJM38510/30903BFA ACTIVE CFP W161TBD Call TI Level-NC-NC-NC SN54157J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SN54LS157J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SN54LS158J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SN54S157J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SN54S158J OBSOLETE CDIP J16TBD Call TI Call TISN74157N OBSOLETE PDIP N16TBD Call TI Call TISN74157N3OBSOLETE PDIP N16TBD Call TI Call TISN74LS157D ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS157DG4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS157DR ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS157DRG4ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS157N ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74LS157N3OBSOLETE PDIP N16TBD Call TI Call TISN74LS157NE4ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS157NSR ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS157NSRE4ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS158D ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS158DE4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS158DR ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS158DRE4ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS158N ACTIVE PDIP N1625Pb-Free CU NIPDAU Level-NC-NC-NCOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)(RoHS)SN74LS158N3OBSOLETE PDIP N16TBD Call TI Call TISN74LS158NE4ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS158NSR ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS158NSRE4ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S157D ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S157DE4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S157N ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74S157N3OBSOLETE PDIP N16TBD Call TI Call TISN74S157NE4ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74S157NSR ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S157NSRE4ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74S158D OBSOLETE SOIC D16TBD Call TI Call TISN74S158DR OBSOLETE SOIC D16TBD Call TI Call TISN74S158N OBSOLETE PDIP N16TBD Call TI Call TISN74S158N3OBSOLETE PDIP N16TBD Call TI Call TISNJ54157J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NCSNJ54157W ACTIVE CFP W161TBD Call TI Level-NC-NC-NC SNJ54LS157FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54LS157J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SNJ54LS157W ACTIVE CFP W161TBD Call TI Level-NC-NC-NC SNJ54LS158FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54LS158J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SNJ54LS158W ACTIVE CFP W161TBD Call TI Level-NC-NC-NC SNJ54S157FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54S157J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SNJ54S157W ACTIVE CFP W161TBD Call TI Level-NC-NC-NC SNJ54S158FK OBSOLETE LCCC FK20TBD Call TI Call TISNJ54S158J OBSOLETE CDIP J16TBD Call TI Call TISNJ54S158W OBSOLETE CFP W16TBD Call TI Call TI(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check/productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetwork Microcontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。
厚声贴片电阻规格中文版
• Small size & light weight 短小轻薄• Reduction of assembly costs and matching with placement machine. 可降低装置成本及配合机器组装• Suitable for both wave & re-flow soldering. 适合波峰焊与回流焊• Applications: Navigator (GPS), Mobile Phone,Telecom, PDA, Setbox, Meter. 应用于GPS ， 移动电话，PDA ，机顶盒，仪表Feature (特性)Figures (型状)Derating Curve & Specification降功率曲线及性能Thick Film Chip ResistorsP e r c e n t r a t e d l o a d (%)Ambient termperature 环境温度 (°C)厚膜晶片电阻器负载比率(%)UniOhm3r i g h s e rv ed .©UValue阻值Code 代码Value 阻值Code 代码Value 阻值Code 代码Value 阻值Code 代码Value 阻值Code 代码Value 阻值Code 代码100011471721533316494646568181102021501822134324504756669882105031541922635332514876771583107041582023236340524996873284110051622123737348535116975085113061652224338357545237076886115071692324939365555367178787118081742425540374565497280688121091782526141383575627382589124101822626742392585767484590127111872727443402595907586691130121912828044412606047688792133131962928745422616197790993137142003029446432626347893194140152053130147442636497995395143162103230948453646658097696Thick Film Chip Resistors• For 0201 & 0402 size, no marking on the body due to the small size of the resistor. 0201, 0402因电阻本体太小，故本体无标示字码• ±5% tolerance product: the marking is 3 digits, the first 2 digits are the significant of theresistance and the 3rd digit denotes number of zeros following.±5%公差产品字码是三位数，前二位是阻值的有效数，第三位表示有几个 0• 0805, 1206, 1210, 2010, 2512 ≤±1%: the marking is 4 digits, the first 3 digits are the significant of the resistance and the 4th digit denotes number of zeros following. 0805, 1206, 1210, 2010, 2512 ≤±1%公差产品字码有四位数，前三位是阻值的有效数，第四位表示有几个 0Marking on the Resistors Body (电阻本体字码标示)2372 = 23700Ω = 23.7KΩBelow 10Ω : 3R24 = 3.24Ω10Ω 以下标示: 3R24 = 3.24Ω153 = 15000Ω = 15KΩBelow 10Ω: 6R8 = 6.8Ω10Ω 以下标示: 6R8 = 6.8Ω• Standard E-96 series values of 0603 ≤±1%: due to the small size of the resistor’s body, 3 digits marking will be used to indicate the accurate resistance value by using the following Multiplier & Resistance Code.0603 ≤±1%公差 E-96系列标准阻值，因电阻本体太小，采用三位阻值代码（数字）及下列指数代码（字母）配合来指明标准的阻值。
SN54AHCT541中文资料
PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)5962-9685801Q2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC 5962-9685801QRA ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC 5962-9685801QSA ACTIVE CFP W201TBD Call TI Level-NC-NC-NC SN74AHCT541DBLE OBSOLETE SSOP DB20TBD Call TI Call TISN74AHCT541DBR ACTIVE SSOP DB202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541DBRE4ACTIVE SSOP DB202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541DW ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541DWE4ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541DWR ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541DWRE4ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541N ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74AHCT541NE4ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74AHCT541NSR ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541NSRE4ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541PW ACTIVE TSSOP PW2070Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541PWE4ACTIVE TSSOP PW2070Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHCT541PWLE OBSOLETE TSSOP PW20TBD Call TI Call TISN74AHCT541PWR ACTIVE TSSOP PW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541PWRE4ACTIVE TSSOP PW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT541PWRG4ACTIVE TSSOP PW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SNJ54AHCT541FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54AHCT541J ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC SNJ54AHCT541W ACTIVE CFP W201TBD Call TI Level-NC-NC-NC (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。
SN54LS123中文资料
RETRIGGERABLE MONOSTABLE MULTIVIBRATORSThese dc triggered multivibrators feature pulse width control by three meth-ods. The basic pulse width is programmed by selection of external resistance and capacitance values. The LS122 has an internal timing resistor that allows the circuits to be used with only an external capacitor. Once triggered, the ba-sic pulse width may be extended by retriggering the gated low-level-active (A)or high-level-active (B) inputs, or be reduced by use of the overriding clear.•Overriding Clear Terminates Output Pulse•Compensated for V CC and T emperature Variations•DC Triggered from Active-High or Active-Low Gated Logic Inputs •Retriggerable for Very Long Output Pulses, up to 100% Duty Cycle •Internal Timing Resistors on LS122SN54/74LS122 (TOP VIEW)(SEE NOTES 1 THRU 4)SN54/74LS123 (TOP VIEW)(SEE NOTES 1 THRU 4)NOTES:1.An external timing capacitor may be connected between C ext and R ext /C ext (positive).2.To use the internal timing resistor of the LS122, connect R int to V CC .3.For improved pulse width accuracy connect an external resistor between R ext /C ext and V CC with R int open-circuited.4.To obtain variable pulse widths, connect an external variable resistance between R int /C ext and V CC .R ext/CR ext/C ext 11ĂRext/2CLRC extNC Ċ NO INTERNAL CONNECTION.。
SN54AS00中文资料
元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1998, Texas Instruments Incorporated。
SN54AHC16245或SN74AHC16245(中文说明书)
2. The package thermal impedance is calculated in accordance with JESD 51.
存取温度范围，Tstg . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . .–65°C to 150°C
†强调上市以后在“绝对最大额定值”可能造成永久性损坏器件。这些压力等级和功能操作在这些或任何其他条件的器件之外，表明在“推荐工作条件”不是暗示。在绝对最大额定值条件下长时间可能影响器件的可靠性。
封装热阻抗，JA (看注2)：DGG封装. . . . . . . . . . . . . . . . . .89°C/W
DGV封装. . . . . . . . . .. . . . . . . . . . . . .93°C/W
DL封装. . . . . . . . . . . . . . . .. . . . . . . .94°C/W
#逻辑符号依照ANSI/IEEE Std 91-1984和IEC期刊617-12
逻辑框图（正逻辑）
到七个其他通道到七个其他通道
绝对最大额定值在工作温度范围（除非另有说明）†
电源电压范围，Vcc. . . . . .. . . . . . . . . . . . .–0.5 V to 7 V
输入电压范围（看注1）. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
SN54LV14A中文资料
元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1998, Texas Instruments Incorporated。
SN54LS365A资料
3-STATE HEX BUFFERS
These devices are high speed hex buffers with 3-state outputs. They are organized as single 6-bit or 2-bit / 4-bit, with inverting or non-inverting data (D) paths. The outputs are designed to drive 15 TTL Unit Loads or 60 Low Power Schottky loads when the Enable (E) is LOW. When the Output Enable (E) is HIGH, the outputs are forced to a high impedance “off” state. If the outputs of the 3-state devices are tied together, all but one device must be in the high impedance state to avoid high currents that would exceed the maximum ratings. Designers should ensure that Output Enable signals to 3-state devices whose outputs are tied together are designed so there is no overlap.
2
3
4
5
6
7
8 GND
TRUTH TABLE
INPUTS E1 L L H X E2 L L X H D L H X X L H (Z) (Z) OUTPUT L L H X
SN74AS574中文资料
元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1998, Texas Instruments Incorporated。
SN74ALS245A中文资料
元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1998, Texas Instruments Incorporated。
CS5463A中文资料手册pdf
SN54LS245中文资料
PACKAGING INFORMATIONAddendum-Page 1(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check /productcontent for the latest availability information and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)Addendum-Page 2(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.OTHER QUALIFIED VERSIONS OF SN54LS245, SN54LS245-SP, SN74LS245 :•Catalog: SN74LS245, SN54LS245•Military: SN54LS245•Space: SN54LS245-SPNOTE: Qualified Version Definitions:•Catalog - TI's standard catalog product•Military - QML certified for Military and Defense Applications•Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based applicationAddendum-Page 3TAPE AND REEL INFORMATION*All dimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74LS245DBR SSOP DB 202000330.016.48.27.5 2.512.016.0Q1SN74LS245DWR SOIC DW 202000330.024.410.813.0 2.712.024.0Q1SN74LS245NSRSONS202000330.024.48.213.02.512.024.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) SN74LS245DBR SSOP DB202000367.0367.038.0 SN74LS245DWR SOIC DW202000367.0367.045.0SN74LS245NSR SO NS202000367.0367.045.0IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,enhancements,improvements and other changes to its semiconductor products and services per JESD46,latest issue,and to discontinue any product or service per JESD48,latest issue.Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All semiconductor products(also referred to herein as“components”)are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale,in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by applicable law,testing of all parameters of each component is not necessarily performed.TI assumes no liability for applications assistance or the design of Buyers’products.Buyers are responsible for their products and applications using TI components.To minimize the risks associated with Buyers’products and applications,Buyers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any patent right,copyright,mask work right,or other intellectual property right relating to any combination,machine,or process in which TI components or services are rmation published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal,regulatory and safety-related requirements concerning its products,and any use of TI components in its applications,notwithstanding any applications-related information or support that may be provided by TI.Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures,monitor failures and their consequences,lessen the likelihood of failures that might cause harm and take appropriate remedial actions.Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.In some cases,TI components may be promoted specifically to facilitate safety-related applications.With such components,TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements.Nonetheless,such components are subject to these terms.No TI components are authorized for use in FDA Class III(or similar life-critical medical equipment)unless authorized officers of the parties have executed a special agreement specifically governing such use.Only those TI components which TI has specifically designated as military grade or“enhanced plastic”are designed and intended for use in military/aerospace applications or environments.Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk,and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI has specifically designated certain components as meeting ISO/TS16949requirements,mainly for automotive use.In any case of use of non-designated products,TI will not be responsible for any failure to meet ISO/TS16949.Products ApplicationsAudio /audio Automotive and Transportation /automotiveAmplifiers Communications and Telecom /communicationsData Converters Computers and Peripherals /computersDLP®Products Consumer Electronics /consumer-appsDSP Energy and Lighting /energyClocks and Timers /clocks Industrial /industrialInterface Medical /medicalLogic Security /securityPower Mgmt Space,Avionics and Defense /space-avionics-defense Microcontrollers Video and Imaging /videoRFID OMAP Applications Processors /omap TI E2E Community Wireless Connectivity /wirelessconnectivityMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2014,Texas Instruments Incorporated。
SNJ54LS76AW中文资料
Copyright © 1988, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date.PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)5962-9557501QEA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC 5962-9557501QFA ACTIVE CFP W161TBD Call TI Level-NC-NC-NC 5962-9557501QFA ACTIVE CFP W161TBD Call TI Level-NC-NC-NC 7601301EA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC7601301EA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC JM38510/00204BEA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC JM38510/00204BEA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SN5476J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NCSN5476J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SN54LS76AJ ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SN54LS76AJ ACTIVE CDIP J161TBD Call TI Level-NC-NC-NCSN7476N OBSOLETE PDIP N16TBD Call TI Call TISN7476N OBSOLETE PDIP N16TBD Call TI Call TISN7476N3OBSOLETE PDIP N16TBD Call TI Call TISN7476N3OBSOLETE PDIP N16TBD Call TI Call TISN74LS76AD OBSOLETE SOIC D16TBD Call TI Call TISN74LS76AD OBSOLETE SOIC D16TBD Call TI Call TISN74LS76ADR OBSOLETE SOIC D16TBD Call TI Call TISN74LS76ADR OBSOLETE SOIC D16TBD Call TI Call TISN74LS76AN OBSOLETE PDIP N16TBD Call TI Call TISN74LS76AN OBSOLETE PDIP N16TBD Call TI Call TISN74LS76AN3OBSOLETE PDIP N16TBD Call TI Call TISN74LS76AN3OBSOLETE PDIP N16TBD Call TI Call TI SNJ5476J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NCSNJ5476J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NCSNJ5476W ACTIVE CFP W161TBD Call TI Level-NC-NC-NCSNJ5476W ACTIVE CFP W161TBD Call TI Level-NC-NC-NC SNJ54LS76AJ ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SNJ54LS76AJ ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SNJ54LS76AW ACTIVE CFP W161TBD Call TI Level-NC-NC-NC SNJ54LS76AW ACTIVE CFP W161TBD Call TI Level-NC-NC-NC(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetwork Microcontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。
SN54HC132中文资料
元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1998, Texas Instruments Incorporated。
SN54S32中文资料
PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)5962-9557401QCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC 5962-9557401QDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NC 5962-9557401QDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NCJM38510/30501B2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NCJM38510/30501B2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NCJM38510/30501BCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCJM38510/30501BCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCJM38510/30501BDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NCJM38510/30501BDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NCJM38510/30501SCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCJM38510/30501SCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCJM38510/30501SDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NCJM38510/30501SDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NC SN5432J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN5432J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN54LS32J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN54LS32J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN54S32J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN54S32J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SN7432N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN7432N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN7432N3OBSOLETE PDIP N14TBD Call TI Call TISN7432N3OBSOLETE PDIP N14TBD Call TI Call TISN7432NE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN7432NE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS32D ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS32D ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS32DBR ACTIVE SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS32DBR ACTIVE SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS32DBRE4ACTIVE SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS32DBRE4ACTIVE SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS32DE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS32DE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS32DG4ACTIVE SOIC D1450Green(RoHS&CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)no Sb/Br)SN74LS32DG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS32DR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS32DR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS32DRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS32DRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS32DRG4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS32DRG4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS32J OBSOLETE CDIP J14TBD Call TI Call TISN74LS32J OBSOLETE CDIP J14TBD Call TI Call TISN74LS32N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS32N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74LS32N3OBSOLETE PDIP N14TBD Call TI Call TISN74LS32N3OBSOLETE PDIP N14TBD Call TI Call TISN74LS32NE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS32NE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS32NSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS32NSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS32NSRG4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS32NSRG4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S32D ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S32D ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S32DE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S32DE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S32DR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S32DR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S32DRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S32DRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)SN74S32N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74S32N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74S32N3OBSOLETE PDIP N14TBD Call TI Call TISN74S32N3OBSOLETE PDIP N14TBD Call TI Call TISN74S32NE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74S32NE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74S32NSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S32NSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S32NSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S32NSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SNJ5432J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCSNJ5432J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCSNJ5432W ACTIVE CFP W141TBD Call TI Level-NC-NC-NCSNJ5432W ACTIVE CFP W141TBD Call TI Level-NC-NC-NC SNJ54LS32FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54LS32FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54LS32J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SNJ54LS32J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SNJ54LS32W ACTIVE CFP W141TBD Call TI Level-NC-NC-NC SNJ54LS32W ACTIVE CFP W141TBD Call TI Level-NC-NC-NC SNJ54S32FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54S32FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NCSNJ54S32J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCSNJ54S32J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NCSNJ54S32W ACTIVE CFP W141TBD Call TI Level-NC-NC-NCSNJ54S32W ACTIVE CFP W141TBD Call TI Level-NC-NC-NC (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。
SN54LS139A中文资料
PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)76007012A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC 7600701EA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC 7600701EA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC 7600701FA ACTIVE CFP W161TBD Call TI Level-NC-NC-NC 7600701FA ACTIVE CFP W161TBD Call TI Level-NC-NC-NC 7700401EA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC 7700401EA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC 7700401FA ACTIVE CFP W161TBD Call TI Level-NC-NC-NC 7700401FA ACTIVE CFP W161TBD Call TI Level-NC-NC-NCJM38510/30702B2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NCJM38510/30702B2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NCJM38510/30702BEA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NCJM38510/30702BEA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NCJM38510/30702BFA ACTIVE CFP W161TBD Call TI Level-NC-NC-NCJM38510/30702BFA ACTIVE CFP W161TBD Call TI Level-NC-NC-NCJM38510/30702SEA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NCJM38510/30702SEA ACTIVE CDIP J161TBD Call TI Level-NC-NC-NCJM38510/30702SFA ACTIVE CFP W161TBD Call TI Level-NC-NC-NCJM38510/30702SFA ACTIVE CFP W161TBD Call TI Level-NC-NC-NC SN54LS139AJ ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SN54LS139AJ ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SN54S139J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SN54S139J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SN74LS139AD ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS139AD ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS139ADE4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS139ADE4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS139ADR ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS139ADR ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS139ADRE4ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS139ADRE4ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS139AN ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS139AN ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74LS139AN3OBSOLETE PDIP N16TBD Call TI Call TISN74LS139AN3OBSOLETE PDIP N16TBD Call TI Call TIOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)SN74LS139ANE4ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS139ANE4ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS139ANSR ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS139ANSR ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS139ANSRE4ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS139ANSRE4ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S139AD ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S139ADE4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S139AN ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74S139AN3OBSOLETE PDIP N16TBD Call TI Call TISN74S139ANE4ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74S139ANSR ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S139ANSRE4ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SNJ54LS139AFK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54LS139AFK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54LS139AJ ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SNJ54LS139AJ ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SNJ54LS139AW ACTIVE CFP W161TBD Call TI Level-NC-NC-NC SNJ54LS139AW ACTIVE CFP W161TBD Call TI Level-NC-NC-NC SNJ54S139FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54S139FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54S139J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SNJ54S139J ACTIVE CDIP J161TBD Call TI Level-NC-NC-NC SNJ54S139W ACTIVE CFP W161TBD Call TI Level-NC-NC-NC SNJ54S139W ACTIVE CFP W161TBD Call TI Level-NC-NC-NC (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be solderedat high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetwork Microcontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。
SN54ACT7881HV资料
元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1999, Texas Instruments Incorporated。
SN54AHCT14中文资料
PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)5962-9680101Q2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC 5962-9680101QCA ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC 5962-9680101QDA ACTIVE CFP W141TBD Call TI Level-NC-NC-NC 5962-9680101VCA ACTIVE CDIP J141TBD Call TI Call TI5962-9680101VDA ACTIVE CFP W141TBD Call TI Call TISN74AHCT14D ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT14DBLE OBSOLETE SSOP DB14TBD Call TI Call TISN74AHCT14DBR ACTIVE SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT14DBRE4ACTIVE SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT14DE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT14DG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT14DGVR ACTIVE TVSOP DGV142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT14DGVRE4ACTIVE TVSOP DGV142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT14DR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT14DRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT14DRG4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT14N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74AHCT14NSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT14NSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT14NSRG4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT14PW ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT14PWE4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT14PWG4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHCT14PWLE OBSOLETE TSSOP PW14TBD Call TI Call TISN74AHCT14PWR ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT14PWRE4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHCT14PWRG4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AHCT14RGYR ACTIVE QFN RGY141000Green(RoHS&CU NIPDAU Level-2-260C-1YEAROrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)no Sb/Br)SNJ54AHCT14FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54AHCT14J ACTIVE CDIP J141TBD Call TI Level-NC-NC-NC SNJ54AHCT14W ACTIVE CFP W141TBD Call TI Level-NC-NC-NC(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.元器件交易网元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。
AZ169中文资料
CONTACTSArrangement DPDT (2 Form C)3PDT (3 Form C)RatingsResistive load:Max. switched power: 300 W or 2500 VA Max. switched current: 10 AMax. switched voltage: 30 VDC* or 250 VAC*Note: If switching voltage is greater than 30VDC,special precautions must be taken.Please contact the factory.UL, CUR10A at 250 VAC 30VDC 1/3HP at 240 VAC 1/3HP at 120 VAC 1/2HP at 277 VACMaterial Silver tin oxide or silver cadmium oxide,gold plated versions are available Resistance< 100 milliohms initiallyGENERAL DATALife ExpectancyMinimum operations Mechanical 1 x 107operations Electrical 1 x 105operationsOperate Time 25 ms max. at nominal coil voltage Release Time25 ms max. at nominal coil voltage (without suppression)Dielectric Strength 2500 Vrms coil to contact(at sea level for 1 min.)2000 Vrms between contact sets Insulation 500 megohms min. at 500 VDC,Resistance 20°C, 50% RHInsulation C250(according to Overvoltage category: III DIN VDE 0110, Pollution degree: 3IEC 60664-1)Nominal voltage: 250 VACDropout DC coilsGreater than 10% of nominal coil voltage AC coils Greater than 30% of nominal coil voltage Ambient TemperatureAt nominal coil voltageOperating-40°C (-40°F) to 70°C (158°F) - DC coils -40°C (-40°F) to 55°C (131°F) - AC coils Storage-40°C (-40°F) to 105°C (221°F)Vibration 0.062" (1.5 mm) DA at 10–55 Hz Shock 10 gEnclosure PolycarbonateTerminals Octal or Undecal Type Plug Weight85 gramsPacking unit in pcs10 per small carton / 100 per carton boxCOILPowerAt Pickup Voltage DC:1.0 W (typical)AC:2.0 VAMax. Continuous DC:2.2 W at 20°C (68°F)Dissipation AC:3.5 VA at 20°C (68°F)Temperature105°C (221°F)ZET TLERelectronics GmbHFax +49 89 800 97 200 office@ 0 97 800 89 +49 Tel. GermanyPuchheim, D-82178 Junkersstrasse 3, 2006-02-03NOTES1.All values at 20°C (68°F).2.Relay may pull in with less than “Must Operate” value.3.Specifications subject to change without notice.RELAY ORDERING DATACOIL SPECIFICATIONS: DC CoilNominal CoilMust OperateMax. ContinuousNominal CurrentCoil Resistance ORDER NUMBER*VDC VDC VDC mA ± 10%Ohm ± 10%64.87.2255.323.5 AZ169–2C–6D129.614.4126.395 AZ169–2C–12D 2419.228.855.8430 AZ169–2C–24D 4838.457.636.91,630 AZ169–2C–48D 6048.072.031.31,920 AZ169–2C–60D 10080.0120.014.76,800 AZ169–2C–100D 11088.0132.015.17,300AZ169–2C–110DCOIL SPECIFICATIONS AC Coil (50/60 Hz)Nominal CoilMust OperateMax. ContinuousNominal CurrentCoil Resistance ORDER NUMBER*VAC VAC VAC mA ± 10%Ohm ± 10%64.87.2450.03.9 AZ169–2C–6A129.614.4225.016.3 AZ169–2C–12A 2419.228.8112.570 AZ169–2C–24A 4838.457.656.3315 AZ169–2C–48A 12088.0132.022.51,600 AZ169–2C–120A230176.0264.011.76,800AZ169–2C–230A* For 3PDT substitute “-3C” for “-2C”. Add suffix “E” to “-2C” or “-3C” to indicate silver tin oxide contacts. Add suffix “1” for LED at the end of part number.Add suffix “P” for “Push to Test” lever at the end of part number.Add sufffix “A” for gold plated contacts at the end of part number.ZET TLERelectronics GmbHFax +49 89 800 97 200 office@ 0 97 800 89 +49 Tel. GermanyPuchheim, D-82178 Junkersstrasse 3, 2006-02-03。
SN54180W资料
IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1998, Texas Instruments Incorporated。
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元器件交易网
IMPORTANT NOTICE
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright © 1998, Texas Instruments Incorporated。