SG-9LLCNS中文资料
中星9号接收机各厂家芯片资料大全和升级接口针脚定义2
中星9号接收机各厂家芯片资料大全和升级接口针脚定义2高斯贝尔ABS-208N 铁壳(9针母串口) IC42s16400F高斯贝尔ABS-208 IC:D61216GJ+AV1108+29AL016D+5812高斯贝尔ABS-208S 1晶IC:NEC D61216GJ+AVL1108EGa+高频头高斯贝尔ABS-208Q 1晶14芯IC:AVL1108EGA+M3330E+M12L64164A+AV2020ABS-S LX-3688A 1晶12芯IC:GX3001+GX1121+5812现代V4、V5 3晶9芯IC:GX3001+GX1121+5812+EN25D80+HY57V641620ETP-6集信科技V6铁壳(海尔机芯) 3晶9芯针脚定义①VCC .②-TXD .③-RXD .④-GND (亲测)IC:1108EG(Hi3121)+Hi2023+5812.集信科技V4.V6(铁壳) 2晶9芯( B型)针脚定义①VCC .②-RXD .③-TXD .④-GND (亲测)IC:0001(GX3001)+HN4F74+5812集信科技V4 .V6(铁壳) 2晶10芯针脚定义①VCC. ②-RXD .③-TXD .④-GND (亲测)IC:00001(GX3001)+HN4LSW+S6416AHTA+5812集信科技V4.V6(铁壳)IC:HN4LSW+S6416AHTA-6BZH+EN25F80-1000CP+5812集信科技V4.V6(铁壳)IC:0002P1M43700ta06+5812+EN25F80+TM8211+POL4558集信科技V4.V5 1晶10芯(A型)针脚定义①VCC .②-RXD .③-TXD .④-GND (亲测)IC:0002(GX6121)+5812+M12L64164A艾雷特2晶10芯IC:M88VS2000+ES256454K+M88TS2020艾雷特V5 IC:HN4F910931M2EE+0001G1K729-1TA060932+5812艾雷特ALT5812 IC:GX3001+GX1121+5812艾雷特ALT600A 2晶11芯IC:M3330E+AVL108的+夏普高频头艾雷特ALT600A/吉祥ABS-2009 2晶IC:GX3001+GX1121-ES29L160FB+SHARP高频头艾雷特ALT600G IC:HTV903+AVL1108+25L160+ST2020(Y32S-8BAT 081113) 艾雷特ALT6812 1晶10芯IC:GX6121+RDA5812+ZB-1A艾雷特ALT6815 1晶10芯IC:GX6121-RDA5812-2B-1A艾雷特ALT7815 3晶10芯IC:GX3001+1121+TS2020艾雷特1000 黑珍珠V4.V5 1晶10芯IC:0002(GX6121)+EEPLDA+5812+M12L64164A艾雷特alt 7812 3晶10芯IC:GX3001+GX1121+5812艾雷特ALT7812 3晶11芯针脚定义①VCC .②-RXD .③-TXD .④-GND (参考)IC:GX3001+GX1121+5812艾雷特ALT600c 2晶10芯IC:GX3001+GX1121+5812艾雷特ALT600c 2晶11芯IC:GX3001+GX1121+5812艾雷特ALT600c 1晶11芯IC:CH216H+AVL1108+C6XS-8CA深圳亿通DVB-V5 10芯IC:HN4N46+EN25F80+G1N540-1TA06+IS42S16400-7T+5812亿通电子WS-3688ZL 1晶10芯IC:Hi2023EC+Hi3102E+AV2020中大WS-3688ZJ (铁壳) 1晶10芯针脚定义①-GND .②-RXD .③-TXD .④VCC (亲测)IC:Hi2023EC+Hi3102E+AV2020中大WS-3688ZJ (铁壳) 2晶10芯IC:Hi2023+AVL1108EG+夏普高频头皇视HSR-208A 2晶10芯IC:Hi2023E+AVL1108EG+AV2020皇视HSR-208B 2晶10芯IC:Hi2023+1108+2020皇视HSR-208B 单晶10芯IC:3330+1108+2020皇视HSR-208B 单晶10芯针脚定义①-GND ②-TXD ③-RXD ④-VCC (参考)IC:Hi2023EC+Hi3102+AV2020皇视HSR-2090 2晶11芯IC:Hi2023+1108EGa+夏普头++EN29LV160 皇视HSR-210A 单晶6芯IC:Hi2023ec+Hi3122e+AV2020皇视HSR-260A 铁盒2晶10芯IC:Hi+1108+SHARP夏普头皇视HRS-268 3晶10芯IC:Hi2023EC+Hi3102E+AV2020皇视HRS-268 2晶10芯IC:Hi2023EC+Hi3121+5812皇视HSR-268 单晶10线IC:HTV903+AVL1108+5812皇视HSR-268 单晶10线IC:Hi2023+Hi3121+AV2020皇视HRS-268 3晶10芯IC:Hi2023EC+AVL1108+5812皇视HSR-260B 3晶10芯IC:Hi2023+1108+2020皇视HSR-260B/索尼高清258 1晶10芯IC:2023E+3121+AV2020皇视HSR-260B 3晶10芯IC:HI2023+1108+5812皇朝HSR-268 10芯IC:Hi2023+AVL1108+5812凯恩斯KES-2066S 6芯针脚定义①-TXD .②-RXD .③VCC .④-GND .⑤-BL (参考)IC:Hi3122E+Hi2023ECE+N25F80凯恩斯KES-2077Z 1晶6芯针脚定义①-TXD .②-RXD .③VCC .④-GND .⑤-BL (参考)IC:Hi2023EC+3122E+5812凯恩斯2077ABS 2晶10芯IC:M3330+AVL1108+5812凯恩斯2077ABS 2晶10芯IC:Hi2023+1108E+5812+25L800凯恩斯KES-2088S 2晶6芯IC:Hi2023EC+HI3102E+RDA5812凯恩斯KES-2088S 2晶10芯IC:Hi2023EC+HI3102E+RDA5812凯恩斯KES-2088S 2晶6芯针脚定义①-TXD .②-RXD .③VCC .④-GND .⑤-BL (参考)IC:Hi2023EC+HI3122E+RDA5812凯恩斯KES-2088Z (5针).针脚定义①-TXD .②-RXD .③VCC .④-GND .⑤-BL (参考)IC:Hi2023EC+HI3102E+RDA5812凯恩斯KES-2099S 2晶6芯IC:Hi2023EC+Hi3102E+5812+25L80凯恩斯KES-2188T 3晶10芯IC:Hi2023+1108+5812凯恩斯KES-2188T 3晶12芯IC:Hi2023+1108E+5037凯恩斯KES-2288S 3晶10芯IC:M3330E+AVL1108+RDA5812+M12L64164A凯恩斯KES-2688b 2晶10芯IC:Hi2023e+1108e+5812凯恩斯KES-2688S 2晶10芯IC:Hi2023e+1108e+5812凯恩斯KES-2788S 3晶10芯IC:Hi2023E+AVL1108EGa+5812凯恩斯KES-2788S 2晶6芯IC:Hi2023EC+Hi3122E+5812凯恩斯KES-5188 11芯IC:HTV903+AVL1108EGA+AV2020凯恩斯KES-5188A铁盒2晶10芯IC:HTV903F+AVL1108+RDK5812+F80+PT8211凯恩斯KES-5188B 2晶13芯IC:HTV903+RDA5812+AVL1108+8211+F80 美路3晶13芯IC:Hi2023E+1108+2119美路2晶12芯IC:GX3003+GX1121+5812美路MR-1809 IC:Hi2023E+AVL1108E+高频头MAX2119C美路MR-5598铁壳3晶12芯IC:GX3003+GX1121+5812美路MR-5598 3晶12芯针脚定义①VCC. ②-RXD .③-TXD .④-GND (参考)IC:Hi2023E+1108+2119C美路-5798 IC:Hi2023E+1108+2119C美路-5598 IC:Hi2023+1108+GAIM-18R+29lv160ZY 5518A 2晶10芯IC:Hi2023E+3102E+5812万利达ZY-5518A 1晶6芯((5针)) IC:Hi2023E+Hi3102E+5812万利达ZY-5518A 2晶10芯IC:CX3001+GX1121+5812万利达ZY-5518A 3晶10芯(9针接口) IC:Hi2023+1108+5812长虹新一代3晶10芯IC:HI2023E+1108E+FL016ALF长虹新一代，海尔数码、海信数码单双晶体6芯IC:HI2023E+3102(3121)+5812长虹数码CH930 3晶12芯IC:HTV903F+1108+AV2020+M80长虹精品TC-6688ABS 2晶10芯IC:HTV903+AVL1108EG+5812长虹精工YJ5978 1晶10芯IC:HTV903F+1108EGa+2000+F80-100+8211 长虹KES-2099S 2晶5芯IC:Hi2023+Hi3102E+5812长虹KES 2晶6芯IC:Hi2023+Hi3102+5812长虹CH920 3晶6芯IC:HTV903F+1108EGa+AV2020+25L80航天天信WTD198J 2晶12芯(9针接口)IC:GX3001+GX1121+5812+ES29LV160FB-70TG航天珠江WTD-198J 2晶12芯IC:GX3001+GX1121+5812航天珠江ABS-209B IC:GX3001+GX1121++WGSE5037航天数码ABS-3809 2晶12芯IC:GX3001+GX1121+5812航天直播HT-168 3晶12芯IC:Hi2023+1108+夏普头航天高清王-HS-166 2晶12芯IC:Hi2023EC+Hi3102E+RDA5812航天高清王HS-169 2晶12芯针脚定义①-GND .②-TX .③-RX .④-VCC (参考) IC:Hi2023EC+3122+5812 天诚TCD-219 2晶10芯IC:Hi2023EC+Hi3121+5812天诚TCD-219ABS 2晶10芯IC:M3330E+AVL1108EGA+5812天诚TCD-299Z 2晶10芯IC:Hi2023+3206+5812天诚TD-299Z 2晶5芯IC:Hi2023+3206+5812天诚TD-2992 2晶6芯IC:Hi3122E+Hi2023E+5812+F80+MXT8211天诚539 2晶10芯IC:HTV903+AV1108+5812天诚519型2晶10芯IC:HTV903+1108E+5812天诚TCD-239ABS 3晶10芯IC:M3330+1108+5812天诚TCD-239ABS 2晶10芯IC:Hi2023+1108E+5812天诚TCD-239 2晶10芯IC:M3330E+1108E+5812天诚TCD-279 2晶10芯IC:Hi2023EC+Hi3102E+5812天诚TCD-299ABS 2晶10芯IC:Hi2023EC+Hi3121+5812天诚TCD-319ABS 3晶10芯IC:Hi2023E0914+AVL1108EGa+RDA5812天诚TCD-319ABS 3晶12芯IC:Hi2302+AVL1108+5037天诚TCD-369ABS 3晶10芯IC:Hi2023+1108+5812天诚TCD-369ABS 3晶10芯IC:M3330E+1108+5812天诚TCD-369ABS 3晶5芯IC:Hi2023+1108+WCGE5037天诚TCD-509ABS 3晶10芯IC:M3330E-AVL1108EGa-5812天诚TCD-509ABS 10芯(5针) IC:Hi2023+AVL1108+5812+M12L6416A天诚TCD-539ABS 2晶10芯(5针)针脚定义①-RX .②-TX .③VCC .④-GND .⑤-BL (参考)IC:M3330E+AVL1108+25L80+5812天诚TCD-579ABS 2晶10芯IC:Hi2023+Hi1108+5812天诚TCD-579ABS 3晶10芯IC:HiM3330+AVL1108EGa+RDA5812天诚TCD-589ABS 3晶10芯IC:Hi2023+1108+5812天诚TCD-689ABS铁壳机2晶12芯(9针接口) IC:Hi2023+AVL1108+夏普头天诚TC-ABS1108A 11芯IC:Hi2023EC+AVL1108+5812TCD--239ABS 2晶10芯IC:M3330E+AVL1108E+5812TCD-339ABS 3晶10芯(9针接口) IC:Hi2023+1108+5812TCD-509ABS 3晶10芯IC:Hi2023E0915+AVL1108EGa+RDA5812TCD-509ABS 2晶10芯(5针) IC:Hi2023EC+HI3121+5812TCD-519ABS 2晶10芯IC:Hi2023+AVL1108+5812TCD-599 2晶10芯IC:M3330+AVL1008+5812TCD-219ABS 2晶振10芯针脚定义①-TXD .②-RXD .③-VCC .④-GND .⑤-BL (参考)IC:Hi2023EC+Hi3121+5812爱普思DVB-2568 3晶10芯IC:HTV903+1121+2020卓异5518A 3晶10芯IC:Hi2023E+1108+5812卓异5518A(铁壳)3晶11芯IC:Hi2023E+1108+5812卓异5518A(铁壳)2晶11芯(9针接口) IC:Hi2023+1108+夏普独立高频头卓异5518A G 1晶10芯爱百信针脚定义①-GND .②-TXD .③-RXD .④VCC (参考)IC:HTV903+AVL1108+5812卓异ZY-5518A G 驰骋天下针脚定义①-GND .②-RXD .③-TXD .④VCC (参考)IC:HTV903+AVL1108+5812+F80卓异5518AG 2晶11芯针脚定义①-GND .②-RXD .③-TXD .④VCC ⑤-BL (参考)IC:Hi2023E+1108+5812卓异ZY-5518A H 春1晶6芯针脚定义①-GND .②-TXD .③-RXD .④VCC (参考)IC:GX3001+5812+25L8005卓异ZY-5518A H 春2晶10芯针脚定义①-GND .②-TXD .③-RXD .④VCC .⑤-BL(参考)IC:Hi2023E+HI3121+5812+F25L008A卓异ZY-5518A H 秋针脚定义①-GND .②-RXD .③-TXD .④VCC( 参考)升级接口在内部PCB上IC:GX6121+5812+F80卓异ZY-5518A H 秋1晶10芯针脚定义①-GND .②-RXD .③-TXD .④VCC ⑤-BL (参考)IC:Hi2023EC+Hi3102E+5812+F80-100卓异ZY-5518A H至尊王牌2晶10芯针脚定义①-GND .②-TXD .③-RXD .④VCC (参考)IC:GX3001+GX1121+5812+25L8005卓异ZY-5518A H 财富2晶6 芯针脚定义①-GND .②-TXD .③-RXD .④VCC .⑤-BL(参考) IC:芯片掩磨+5812+80L100绿达PS-1288 3晶12芯IC:Hi2023E+ABS090520+M88TS2020绿达PS-1288 2晶12芯IC:Hi2023+Hi3021+AV2020绿达视美人\卓异1晶10芯IC:Hi2023EC+Hi3121+2020绿达金统帅3晶10芯IC:M3330+1108+5812三星DQ88/DQ66 IC:HTV903F+AVL1108+AV2020三星高清王2晶12芯IC:GX3001+GX1121+5812三星高清DQ88 3晶12芯IC:HTV903F+AVL1108+AV2020三星数码王TDX668B 2晶6芯针脚定义①-RXD .②-TXD .③-GND .④VCC. ⑤-BL (参考)IC:Hi2023+1108+5812三星数码王TDX668B 2晶6芯IC:HTV903F+AVL1108E+5812三星数码王668C 2晶6芯IC:HTV903F+AVL1108E+5812三星数码王TDX668E 1晶6芯IC:Hi2023EC+3102C+5812三星HSR-208C 1晶10芯IC:Hi2023E+Hi3102+MXT8211+AV2020+F25L08pA三星小霸王ABS-S 2009 2晶10芯IC:CX3001+CX1121+5812三星小霸王2900 (9针接口) IC:Hi2023E+AVL1108+MAX2119三星王国-KL6350 1晶11芯IC:HTV903+AVL1108EGa+EDA5812开门红KSP638 2晶10芯IC:HTV903F+AVL1108E+AV2020开门红KSP638 1晶10芯IC:CT216H+AVL1108EGa+AV2020日立创新TDX-668B 2晶6芯针脚定义①-RXD .②-TXD .③-GND .④VCC. ⑤-BL (参考)IC:Hi2023+AVL1108+5812志高之星HS166 2晶12芯IC:Hi3102+Hi2023+5812志高之星HS169 2晶12芯IC:Hi2023EC+Hi3012E+RDA5812A+EM638165TS-6G金牛ABS-1108 3晶10芯IC:Hi2023+1108+5812小灵通2晶6线IC:Hi2023+1108+5812福临门ABS-S 3晶9线IC:GX1121+GX3001+5812C60S-93AT 单晶10芯IC:CT216H+AVL1108EGa+AV2020ABS-2301 单晶10芯针脚定义①-GND.②-TXD.③-RX .④VCC (参考)IC:Hi2023EC+Hi3211E+5812+25L8005其乐达CT216 2晶10芯IC:CT216+1108+AV2020科海6228 1晶11芯IC:HTV903+AVL1108EGa+RDa5812+25X16AVSIG 科海6228-CT216H 1晶11芯IC:CT216H+1108EGa+M88TS2020科海C623S-91AT 单晶10芯IC:CT210H+AVL1108+2020科海炫彩6888 IC:HTV903+AVL1108EGa+RDa5812科海2888（小天使）2晶10芯IC:HTV903+AVL1108EGa+RDa5812大旗920 3晶12芯IC:HTV903+AVL1108+AV2020大旗DQ920 3晶12芯IC:GX3001+GX1121+5812+25X16大旗930 3晶12芯IC:HTV903+AVL1108+AV2020众昌电子ABS--2088 2晶10芯IC:Hi2023+AVL1108+5812众昌电子ABS-2087 2晶10芯IC:M3330+AVL1108+5812创维S600 3晶IC:M3330E+AVL1108E+5812创维新一代3晶10芯IC:Hi2023E+1108+5037+FL016A中广通XC-B188 3晶12芯IC:GX3001+GX1121+5812深圳知音ABSTAR KT-2309 3晶10芯IC:Hi2023+AVL1108E+5812知音科技ABSTAR KT1028H 2晶振10芯IC:Hi2023+AVL1108+GST GAIM-18R铁壳ABS-2009 2晶11芯IC:Hi2023+1108+夏普头王牌数码OST-366 2晶6芯针脚定义①-GND ②-RXD .③-TXD .④VCC (参考)IC:Hi3102+Hi2023EC+AV2020王牌数码王GM-ABS1108A 2晶10芯针脚定义①-GND .②-TXD .③-RXD .④VCC (参考)IC:GX3001+GX1121+5812+25L8005王牌数码王GM-ABS1108A 10芯IC:Hi2023+AVL1108+5812JIXIANG ABS-208 2晶14芯(9针接口) IC:Hi2023+1108+GST GAIM-18R ABS TUNER 夏普头JIXIANG-ABS208 2晶IC:D6121+1108+GST高频头East Star 2晶10芯IC:M3330-1108-GST GAIM-18R高频头小福星abs 2008 3晶12芯IC:GX3001+GX1211+5812通达C60S-93AT/C62S-91AT 1晶10芯IC:CT216H+AVL1108E+2020威特斯ZL-5188A 2晶13芯IC:HTV903+AVL1108+RDK5812威特斯ZL-5188B 2晶11芯IC:GX3001+GX1121+5812迷你星3晶13芯IC:GX3001+GX1121+5812+F16-100HIP高星HS-312 3晶12芯IC:GX3001+GX1121+5812北大高科3晶9芯IC:GX3001+GX1211+5812思达科ABS-S 801型2晶10芯IC:GX3001+GX1121+5810思达科ABS-S 802G 2晶10芯IC:GX3001+GX1211+5812思达科ABS-S 803A 1晶10芯IC:AVL1118+AV2020+25D80V思达科ABS-S 803G IC:GX3001+GX1211+5812思达科ABS-S 806H IC:GX3001+GX1211+5812思达科ABS-S 806H IC:AVL1118+AV2020+DSD4M16G思达科ABS-S 806H IC:HN4J7G+G2A954+5812+25X80思达科ABS-S807 1晶5芯IC:AVL1118a+AV2020+806H金霸王JBW-6688 2晶11芯IC:HTV903F+AVL1108EGa+AV2020+8211金霸王JBW-6688 IC:GX3001+GX1211+5812阿德尔ADE-168 IC:HY903+AVL1108EG+AV2020阿德尔ADE131金刚IC:HTV903F+AVL1108E+M88TS2020海西小霸王TD299Z 2晶6芯IC:Hi2023E+Hi3122+5812同洲CY-668S 1晶12芯IC:HM1512+1108+5812喜旺ABS5398 IC:Hi2023+1108E+MAX2119C喜旺ABS-5798 12芯IC:GX3001+GX1211+5812喜旺ABS-3809 2晶12芯IC:GX3001+GX1121+RDA5812希旺598 2晶12芯(9针接口) IC:Hi2023+1108+SHRP高频头彩虹视霸CY84 1晶10芯IC:HTV903F+AVL1108+M88TS2020彩虹视霸A10S-9AAT 1晶10芯IC:AVL1118+SM42S16400B1-7+F80九洲村村通DVS-398F IC:CT216H+ALV1108+SHRP高频头金星ABS-208 1晶14芯IC:Hi2023+AVL1108+铁壳高频头威克2晶6芯(5针) IC:HTV903+1108+5812华尔HR731A1 3晶12芯IC:CX3001+CX1121+SHARP高频头爱普斯3晶9芯IC:HTV903+AV2020+AVL1108EG爱普斯2568 3晶10芯IC:HTV903+AV2020+AVL1108EG爱普斯IC:GX3001+GX1211+AV2020+2J10X未来视佳ADEI88 3晶9芯IC:HTV903F+AV2020+AVL1108EG黑金刚TRT006 1晶10芯IC:AVL1118+AV2020+4558+F80-100DX-668 2晶10芯针脚定义①-RXD .②-TXD .③VCC .④-GND .⑤-BL (参考)IC:Hi2023EC_Hi3102E+5812+F80-100傲天海-吉祥2晶12芯针脚定义①-GND ②-RXD ③-TXD ④VCC (参考)IC:GX3001+GX1121+RDA5812高频头+P8075火星漫步LJ6008 1晶10芯IC:HTV903F+AVL1108+M88TS2020+F80-100 王牌新一代TD-299Z针脚定义①- . ②-TXD .③-RXD .④-GND ⑤- (参考)IC:Hi2023E+Hi3122+5812王牌HJ360 3晶10芯IC:GX1120+GX3001+TS2020TVWALKER ABS-2008 1晶6芯IC:D61216GJ+1108E+SHARP头吉祥988 (ZJ-111) 1晶11芯IC:HTV903 +1108+高频头北京北电科林3晶12芯IC:Hi2023+AVL1108EGa+SHARP高频头家家福BEX811 1晶10芯IC:24645K2+M88VS2000+M88TS2020家家福ADE158 IC:HTV903+AVL1108+M88TS2020华星科技2晶IC:Hi2023+AVL1108+5812亚视达ABR-S(H11) 2晶10芯IC:HTV903+1108E+AV2020HSTAR 3晶10芯IC:Hi2023+AVL1108EGa+M88IS2020长江电讯ABS-2008型铁壳(9针接口) IC:D61216GJ+AVL1108EG+夏普头全家福3晶IC:Hi2023E+AVL1108EG+M88TS2020畅想BEX818 1晶10芯IC:HTV903+AVL1108+AV2020必佳GF-901 2晶10芯针脚定义①-GND .②-RXD .③-TXD .④VCC (参考)IC:HTV903+1108+AV2020KSP600G 飓风(华亚) 2晶10芯针脚定义①-GND ②-TXD ③-RXD ④VCC (参考)IC:HTV903+1108+M88TS2020+25D80万家乐TB002 (5针) IC:Hi2023EC+Hi3102E+M88TS2020+25X80AV万家乐2晶6芯IC:M3330+ALi1108+5812+F80-75奥伟科技ABS-800 3晶(9针接口) IC:GX3001+GX1121+5812奥伟科技ABS-900E 2晶12芯IC:CT216+AVL1108+独立高频头GAIR-08R 天眼HSTER3晶10芯IC:Hi2023E+AVL1108+5812飞翔ADE351 2晶10芯IC:HTV903F+AVL1108EG+M88TS2000星视通XC-B268 1晶10芯IC:HTV903+AVL1108+5812星视通XC-C268 1晶11芯IC:HTV903 AVL1108 5812奥维科技ABS-600 3晶12芯IC:GX3001+GX1121+AV2020GM-210825A 3晶10芯IC:Hi2023+AV1108+5812GM-210825A 2晶10芯IC:GX3001+GX1121+5812中国结TRT005 1晶10芯IC:M88VS2000+256454K+M88TS2020万视达118S 3晶10芯IC:Hi2023EC+Hi3121E+5812足球王国ADE266 1晶10芯IC:HTV903F+AVL1108Ga+M88T52000摩托罗拉IC:HM1521+AVL1108+5812现代数码TDX-668B 2晶6芯IC:AVL1108EG+HI2023EC+5812国科广电GKA800 ( 9孔串口) IC:GX3001+AVL1108+EN29LV160AB+夏普头心语BEX838 10芯IC:HTV903F+AVL1108+5812心语BEX838 2晶10芯IC:HTV903F+AVL1108+m88ts2020+GH8211美万嘉MJ-518S 3晶10芯IC:GX3001+GX1121+RDK5812SVA CH-6788 2晶IC:M88VS2000+ES255624K+M88TS2020+EN25F80+AMS1117数码新一代HT702 2晶10芯IC:HTV903F+1108+M88TS2020飓风KSP600G 2晶10芯IC:HTV903+AVL1108+2020板号CH-ABS-S-VS2000-V1.1 2晶6芯IC:2000+2020+255624K斯威特ZL-5188A 1晶13芯IC:2HTV903+AVL1108EGA+夏普高频头中国星2晶6芯IC:ALI3330+ALi1108+5812+F80-75Ji Xiang 208版号ABS-A005B.M 3晶6芯IC:D61216GJ100+AVL1108+S29AL016070TF102+MAXIM2119C欧士达209B 10芯IC:GX1121+GX3001+5037。
S9iGNSS接收机用户手册-思拓力
S9i GNSS接收机用户手册广州思拓力测绘科技有限公司2016年10月目录第1章S9i接收机简介 (3)1.1接收机外型 (5)1.2S9i接收机正面 (5)1.3S9i接收机背面 (8)1.4S9i接收机底部 (9)第2章S9i操作说明 (11)2.1基站和移动站安装操作 (11)2.2按键操作 (11)2.3切换工作模式和数据链 (12)2.4自检 (12)2.5测量天线高度 (13)第3章Web UI应用 (15)3.1工作状态 (16)3.2仪器信息 (16)3.3数据下载 (16)3.4管理页面 (17)3.4.1仪器注册 (18)3.5设置 (19)3.5.1工作模式的设置 (19)3.5.2系统参数 (24)3.5.3NMEA消息 (25)第4章S9i附件 (26)4.1仪器箱 (26)4.2电源 (26)4.3天线 (27)4.4电缆 (28)4.5其他附件 (29)第5章附录 (31)附录1电台出厂设置 (31)附录2 技术参数 (31)第1章S9i接收机简介广州思拓力测绘科技有限公司致力于提供最先进的GNSS测量工具。
RTK测量技术在测量任务中发挥着重要的作用，并且得到越来越普遍的应用。
作为一个领先的RTK仪器生产商, 广州思拓力测绘科技有限公司保证S9i接收机是一款性能优秀的RTK接收机，非常适合现代测量的精度要求，能够提供可靠的测量成果和友好的用户操作。
S9i能够收到GPS卫星信号、GLONASS、GALILEO和北斗卫星信号。
S9i接收机集成了天线、主板、电台、接收天线、蓝牙模块、电池等组件，移动站完全一体化，只需手簿操作即可工作。
与以往的接收机相比，S9i更具稳定性高、功耗小、体积小、重量轻等特点，且拥有防水、防尘、防振的独特设计。
电池和内置电台安放在接收机底部，更有效的防尘、防水，使得S9i接收机能更好的适用于外业测量工作。
接收机的一体化设计，使得S9i仅有1.2公斤，携带轻便。
gmsl max9296a原理
gmsl max9296a原理
GMSL (Gigabit Multimedia Serial Link)是一种高速、高带宽的
串行接口技术，广泛应用于多媒体传输领域。
而Max9296A
是一种GMSL收发器芯片，它的原理主要涉及以下几个方面：
1. 串行传输：Max9296A采用串行传输方式，通过一对差分线
对数据进行传输。
这种传输方式可以提供更高的带宽和更远的传输距离。
2. 差分信号传输：Max9296A采用差分信号传输方式，通过同
时传输正负两个信号来抵消传输过程中的噪声和干扰。
这种传输方式可以提高信号质量和抗干扰能力。
3. 视频数据传输：Max9296A主要用于传输视频数据，支持高
清视频格式（如1080p、4K等）。
它可以将视频数据转换为
串行信号，并通过差分线进行传输。
4. 时钟和同步信号：Max9296A通过发送时钟和同步信号来保
持数据传输的同步性。
时钟信号用于确定数据传输的速率和时序，同步信号用于确定数据传输的起始和结束点。
5. 电源管理：Max9296A具有电源管理功能，可以根据需要对
芯片进行供电和休眠控制，以降低功耗和延长芯片的使用寿命。
总之，Max9296A通过使用GMSL技术的串行传输和差分信号传输方式，以及时钟和同步信号的控制，实现了高速、高带宽
的视频数据传输。
同时，它还具有电源管理功能，方便对芯片进行供电和控制。
中星九号接收机各常用芯片升级46台工具和bin文件使用教程
接收机各常用芯片升级46台工具和bin文件使用教程全集, 工具借这儿再声明一下：本人不算高手，本文也旨在抛砖引玉，真切希望那些高手多施舍点技艺。
引子：本人从事家电维修行业，近期接大量中9接收机升级，已成功“升级”大量上寨接收机，为了方便同行，故将成功经验整理发布，附全4类芯片：海尔（Hi2023，Hi2023E），华亚HTV903(F)，国芯（GX3001，GX6121 等），阿里（ALi M3330E）的刷机软件和各类芯片46台的成功数据，数据均为本版块收集亲测，首先感谢原作者！为了避免刷成砖头，请认真参考以下内容！硬件准备：万用电表。
串口刷机板（TTL转接板。
可以自制，现成的也需要自制各种联机插线），标准串口延长线（用于使用标准9芯串口的接收机）万用电表：世人皆知。
用于判断各类接收机升级数据接口各引脚功能。
与电脑连接硬件：如果是标准9芯串口插头，直接使用标准串口延长线。
如果是4线或5线插排，请使用TTL转接板接入电脑的串口。
串口刷机板：本人是自制的（成本6元左右，一个串口插头，max232集成电路，电解等），淘宝也有卖（大约12元钱+运费），自制电路图纸网上随便就可以找到，就是一个max232芯片以及一些辅助原件。
刷机板自身工作电源无法像图纸上那样从串口获得，可以从5线数据线的4脚得到14V然后经过78L05稳压供给。
但4线的数据接口标称3.3V（有些好像标5V的，未测），故本人从USB端口供电，直供5V，未使用耦合电路也是成功的，建议大家从USB端口直接供电。
只要找到一个退休的USB鼠标或摄像头剪下插头即可，非常实用。
该板连接接收机最终是3根线：公用地线，读数据，写数据。
用万用表判断4线或5线的数据接口：地线：不用说了吧？就是和高频头外壳直通的那根！呵呵！电源线：无论是多高的电压，电源相对于任何数据引脚都有相对较小的对地电阻，对地反向二极管导通性更明显。
数据读写线：两个引脚靠在一起，万用表实测电压为3.3V，而且紧靠接地脚。
各厂家中九接收机芯片IC资料大全(目前最完整的)部分附针脚定义
各厂家中九接收机芯片IC资料大全(目前最完整的)部分附针脚定义最新刷机资料点下面的链接最新刷机资料1最新刷机资料24月3日BIN教程工具集中帖刷机教程大全刷机工具大全2.10-3.2刷机bin大全3月3日后刷机bin大全各厂家中九接收机顶盒芯片IC资料大全(目前最完整的)，部分附针脚定义。
方便大家速查。
可使用CTRL+F，然后输入相关数据进行速查，或者也可以下载附件。
品牌产品型号芯片配置海尔2晶10芯IC:HI2023E+1108+5812海尔高清OST-666 2晶6芯IC:M88VS2000+241674K.1+M88TS2020海尔高清OST-666 3晶12芯IC:High032E+His121+M88TS2020海尔3晶10芯(9针接口)IC:HI2023E+1108+5812+ESMTM12L64164A-GNR1T80AB 海尔高清OST-666 2晶6芯IC:Hi2023E+3160+TS2020欧视达ABS-209B 3晶10芯IC:GX3001+GX1121+LW37 欧视达ABS-209B 3晶11芯IC:GX3001+5037+8211欧视达ABS-309B 3晶11芯IC:GX3001+GX1121+MGCE5037欧视达AS-900S 1晶11芯IC:GX6121+25L80+LW37城市之宝BEX868 Y32S-93AT 2晶10芯IC:HTV903F+A VL1108+TS2020通达Y35S-8BAT/Y35S-8CAT 2晶10芯IC:HTV903+A VL1108+5812通达Y30S-01BT 2晶12芯IC:HTV903+A VL1108+2020 皇朝HSR-268 10芯IC:Hi2023+A VL1108+5812小霸王TDX-668E ABS-S1 1晶6芯IC:Hi2023+Hi3102+FT8211+HT1117天地星小霸王TDX-328B 1晶10芯IC:ALi M3328F+5810天地星小霸王TDX-668A (9针接口)IC:HI2023+1108+夏普头天地星小霸王TDX-668B 2晶振IC:HTV903+A VL1108EGA+RDA5812+25L8005天地星小霸王(三星数码王)TDX-668B 单晶6芯.针脚定义①-TXD ②-RXD ③VCC ④-GND ⑤-BL IC:Hi2023E+RDA5812+A VL1108E+MXT8211a+25L8005天地星（原大盒中星九号）3晶IC:Hi2023+1108+5037天地星TDX-668B 2晶10芯IC:Hi2023+A VL1108+5812天地星小霸王TDX-668C 2晶6芯IC:HTV903+A VL1108EGA+RDK5812+25F80小霸王TDX-328B 1晶10芯IC:ALi M3328F+5810小霸王TDX-668B 6芯IC:Hi2023+RDA5812+A VL1108E 小霸王TDX-668B 2晶6芯IC:HTV903+1108+5812小霸王TDX-668E 1晶6芯IC:Hi2023EC+Hi3121+5812 小霸王TDX-668E 2晶6芯IC:HTV903+1108+5812小霰王XC-B298 1晶12芯IC:HTV903-RDA5812-A VL1108 小霸王ABS-1388 2晶10芯针脚定义①-GND ②-RXD ③-TXD ④VCC小霸王ABS-1688 2晶10芯针脚定义①-GND ②-RXD ③-TXD ④VCC IC:Hi2023EC+Hi3122E+5812小霸王GF902 IC:A VL1118a+A V2020+EN25F80索尼高清ABS-S 258 2晶10芯针脚定义①-GND ②-RXD ③-TXD ④VCC IC:Hi2023EC+Hi3122E+5812索尼高清ABS-S 258 2晶10芯针脚定义①-GND ②-RXD ③-TXD ④VCC IC:Hi3102E+Hi2023EC+A V2020太阳红TYH-279ABS/289ABS/299ABS 2晶10芯针脚定义①-GND ②-RXD ③-TXD ④VCC松下科技星TDX-668B1/松下科技星-668EIC:Hi3102E+Hi2023EC+5812松下科技星TDX-668B 2晶6芯IC:HTV903FH42+A VL1108EGA+RGK5812松下科技星668B 2晶6芯Hi2023(E0908)+EVl1108EG2+5812松下科技星-668C 2晶6芯针脚定义①-RX .②-TX .③-GND .④VCC. ⑤-BLIC:A VL1108EG+HTV903F+5812松下科技星668E 2晶6芯IC:HV903+A VL1108E+5812松下科技星/海尔数码/海信数码单双晶6芯IC:Hi2023E+Hi3102(Hi3121)+5812松下科技星TDX-668B 2晶6芯针脚定义①-RXD .②-TXD .③-GND .④VCC. ⑤-BLIC:Hi2023+A VL1108+5812+25L8005松下高清SX168 3晶6芯IC:HTV903F+A VL1108+A V2020 松下数码王P-269A 2晶6芯IC:Hi2023E+Hi3122+A V2020 松下高清OST168 2晶10芯IC:Hi2023E+Hi3121+A V2020 松下科技PS-228 11芯IC:Hi2023+Hi3122+5812松下科技PS-228 2晶6芯IC:M88VS2000+M88TS2020+ES261474K松下科技PS-228 1晶12芯N88VS2000+ES261344K+M88TS2020高频头+T25P80+S163816STS松下科技PS-228 2晶IC:HTV903+1108+2020松下科技PS-228 2晶10芯IC:GX3001+GX1211+5812松下数码王OST-266 10芯(4针)针脚定义①-GND ②-RXD ③-TXD ④VCCIC:Hi2023E+Hi3106+2020松下数码王OST-266 2晶6芯IC:M88VS2000+M88TS2020+261414k+25F80松下数码王OST-266 2晶6芯IC:Hi2023E+Hi3102E+M88TS2020+MXT8211松下高清OST-466 2晶10芯IC:Hi2023e+Hi3121+MBBTS2020+MBDA80CG松下科技星3晶6芯IC:Hi2023+A VL1108+WGCE5037松下科技星.海尔数码.海信数码单双晶+6芯IC:Hi2023E+Hi3102(3121)+5812中星科技单晶14芯IC:Hi2023E+1108+5812+25L8单晶14芯中星科技ZG-N02 12芯IC:GX3001+A V2020中星科技2晶10芯针脚定义①-GND ②-RXD ③-TXD ④VCCIC:Hi2023EC+Hi3102E+5812+M12L64164A中兴科技ABS-S323 2晶10芯IC:Hi2023EC+HI3102E+5812+M12L64164A村村通ABS-S323- 2晶10芯针脚定义①-GND ②-RXD ③-TXD ④VCCIC:Hi2023EC+Hi3122E+5812村村通2晶6芯IC:HN4+0001+5812村村通ZL5188 1晶13芯IC:HTV903+1108+SHARP高频头村村通ZL-5188A 2晶11芯IC:HTV903+A VL1108+RDK5812村村通ZL-5188B 2晶13芯IC:HTV903+A VL1108+RDK5812 村村通ZL-5188B 2晶10芯IC:HTV903+A VL1108EGA+5812村村通ZL5188B 1晶13芯IC:HTV903+A V1108+SHARP6306村村通ZJ-11 IC:HTV903+1108+夏普头S7ZH6306村村通wx-666 3晶10芯IC:GX3001+GX1121+RDK5812村村通ZL-6188 2晶10芯IC:HTV903+A VL1108EGA+5812村村通ZL-6188C 10芯IC:GX3001+GX1121+RDK5812村村通DTH(铁壳) 3晶12芯IC:A VL1108EG+HTV903F+A V2020村村通001 3晶10芯IC:GX3001+GX1121+RDK5812村村通ABS-S GD-1008 3晶10芯IC:Hi2023E+A VL1108E+ZL10037+F16-100HIP村村通ABS-S888AIC:Hi2023EC+Hi3121+ET8211+RDA5812+25X80视美人ABS-S PS-1288 2晶10芯IC:Hi3102E+Hi2023EC+A V2020视美人PS-1288 ICM88VS2000+ES256454K+M88TS2020 视美人2晶10芯IC:Hi2023+3106+A V2020太平鸟HJ321 3晶10芯针脚定义①-GND .②-RXD .③-TXD .④VCCIC:GX3001+GX1121+TS2020太平鸟HJ321 3晶11芯IC:GX3001+GX1121+5812焦点yj5888 2晶10芯IC:HTV903+A VL1108+RDA5812幸运之星YJ5988 2晶10芯IC:HTV903F+A VL1108EGa+A V2020克莱尔HT701 1晶10芯IC:A VL1108EG+HTV903F+M88TS2000中电电子J-6288 ABS-S 3晶12芯IC:GX3001+GX1121+5812小福星3晶11芯针脚定义①-GND .②-(空) .③-RXD .④-TXD (）IC:GX3001+GX1121+5812东仕DIS-2000K 单晶10芯IC:HTV903F+A VL1108E+A V2020Souy Ericsson英文机2晶10芯IC:GX3001+GX1121+A V2020高斯贝尔/歌德威尔ABS-208F 3晶14芯针脚定义①-GND .②-TXD .③-RXD .④VCC .⑤-BL IC:A VL1108EG+Hi2023+5812高斯贝尔ABS-208 1晶14芯(5针).针脚定义①-GND .②-TXD .③-RXD .④VCC .⑤-BL IC:A VL1108EG+Hi2023+5812歌德威尔ABS-208H/高斯贝尔208P 3晶14芯针脚定义①-GND .②-TXD .③-RXD .④VCCIC:M3330E+A VL1108EG+A V2020+M12L64164高斯贝尔ABS-208P/歌德威尔208H 1晶14芯针脚定义①-GND .②-TXD .③-RXD .④VCC .⑤-BL IC:A VL1108EGi+Hi2023+5812高斯贝尔ABS-208P/歌德威尔208H 1晶14芯针脚定义①-GND .②-TXD .③-RXD .④VCCIC:M3330E+A VL1108EG+A V2020+M12L64164A高斯贝尔ABS—208F IC:Hi2023+A VL1108EGA+M88TS2020高斯贝尔ABS—208 2晶14芯IC:HTV903+1108+5812吉祥ABS-208C IC:Hi2023+A VL1108EGa+GST GAIM-18R ABS-STUNER吉祥ABS-2009B 3晶14芯IC:GX3001+GX1121+RDK5812吉祥ABS-2009大铁壳2晶IC:GX3001+GX1121+夏普高频头ABS-2009 2晶12芯IC:HTV903+1108+GAIM-18R歌德威尔ABS-208 3晶6芯IC:D61216GJ+1108+5812歌德威尔ABS-208 3晶14芯(9针接口)IC:M3330+1108+5812高斯贝尔ABS-208 3晶(9针母串口)IC:A VL1108+Hi2023+GAIM-18RIC:D61216GJ100+A VL1108EG+S29AL016D70TF102+ISSI高斯贝尔ABS-208N 铁壳(9针母串口) IC42s16400F高斯贝尔ABS-208 IC:D61216GJ+A V1108+29AL016D+5812高斯贝尔ABS-208S 1晶IC:NECD61216GJ+A VL1108EGa+高频头高斯贝尔ABS-208Q 1晶14芯IC:A VL1108EGA+M3330E+M12L64164A+A V2020ABS-S LX-3688A 1晶12芯IC:GX3001+GX1121+5812现代V4、V5 3晶9芯IC:GX3001+GX1121+5812+EN25D80+HY57V641620ETP-6 集信科技V6铁壳(海尔机芯) 3晶9芯针脚定义①VCC .②-TXD .③-RXD .④-GNDIC:1108EG(Hi3121)+Hi2023+5812.集信科技V4.V6(铁壳) 2晶9芯( B型)针脚定义①VCC .②-RXD .③-TXD .④-GNDIC:0001(GX3001)+HN4F74+5812集信科技V4 .V6(铁壳) 2晶10芯针脚定义①VCC. ②-RXD .③-TXD .④-GNDIC:00001(GX3001)+HN4LSW+S6416AHTA+5812集信科技V4.V6(铁壳)IC:HN4LSW+S6416AHTA-6BZH+EN25F80-1000CP+5812集信科技V4.V6(铁壳)IC:0002P1M43700ta06+5812+EN25F80+TM8211+POL4558 集信科技V4.V5 1晶10芯(A型)针脚定义①VCC .②-RXD .③-TXD .④-GNDIC:0002(GX6121)+5812+M12L64164A艾雷特2晶10芯IC:M88VS2000+ES256454K+M88TS2020艾雷特V5IC:HN4F910931M2EE+0001G1K729-1TA060932+5812艾雷特ALT5812 IC:GX3001+GX1121+5812艾雷特ALT600A 2晶11芯IC:M3330E+A VL108的+夏普高频头艾雷特ALT600A/吉祥ABS-2009 2晶IC:GX3001+GX1121-ES29L160FB+SHARP高频头艾雷特ALT600GIC:HTV903+A VL1108+25L160+ST2020(Y32S-8BAT 081113)艾雷特ALT6812 1晶10芯IC:GX6121+RDA5812+ZB-1A艾雷特ALT6815 1晶10芯IC:GX6121-RDA5812-2B-1A艾雷特ALT7815 3晶10芯IC:GX3001+1121+TS2020艾雷特1000 黑珍珠V4.V5 1晶10芯IC:0002(GX6121)+EEPLDA+5812+M12L64164A艾雷特alt 7812 3晶10芯IC:GX3001+GX1121+5812艾雷特ALT7812 3晶11芯针脚定义①VCC .②-RXD .③-TXD .④-GNDIC:GX3001+GX1121+5812艾雷特ALT600c 2晶10芯IC:GX3001+GX1121+5812艾雷特ALT600c 2晶11芯IC:GX3001+GX1121+5812艾雷特ALT600c 1晶11芯IC:CH216H+A VL1108+C6XS-8CA深圳亿通DVB-V5 10芯IC:HN4N46+EN25F80+G1N540-1TA06+IS42S16400-7T+581亿通电子WS-3688ZL 1晶10芯IC:Hi2023EC+Hi3102E+A V2020中大WS-3688ZJ (铁壳) 1晶10芯针脚定义①-GND .②-RXD .③-TXD .④VCCIC:Hi2023EC+Hi3102E+A V2020中大WS-3688ZJ (铁壳) 2晶10芯IC:Hi2023+A VL1108EG+夏普高频头皇视HSR-208A 2晶10芯IC:Hi2023E+A VL1108EG+A V2020皇视HSR-208B 2晶10芯IC:Hi2023+1108+2020皇视HSR-208B 单晶10芯IC:3330+1108+2020皇视HSR-208B 单晶10芯针脚定义①-GND ②-TXD ③-RXD ④-VCCIC:Hi2023EC+Hi3102+A V2020皇视HSR-2090 2晶11芯IC:Hi2023+1108EGa+夏普头++EN29LV160皇视HSR-210A 单晶6芯IC:Hi2023ec+Hi3122e+A V2020 皇视HSR-260A 铁盒2晶10芯IC:Hi+1108+SHARP夏普头皇视HRS-268 3晶10芯IC:Hi2023EC+Hi3102E+A V2020 皇视HRS-268 2晶10芯IC:Hi2023EC+Hi3121+5812皇视HSR-268 单晶10线IC:HTV903+A VL1108+5812皇视HSR-268 单晶10线IC:Hi2023+Hi3121+A V2020皇视HRS-268 3晶10芯IC:Hi2023EC+A VL1108+5812皇视HSR-260B 3晶10芯IC:Hi2023+1108+2020皇视HSR-260B/索尼高清258 1晶10芯IC:2023E+3121+A V2020皇视HSR-260B 3晶10芯IC:HI2023+1108+5812皇朝HSR-268 10芯IC:Hi2023+A VL1108+5812凯恩斯KES-2066S 6芯针脚定义①-TXD .②-RXD .③VCC .④-GND .⑤-BL IC:Hi3122E+Hi2023ECE+N25F80凯恩斯KES-2077Z 1晶6芯针脚定义①-TXD .②-RXD .③VCC .④-GND .⑤-BL IC:Hi2023EC+3122E+5812凯恩斯2077ABS 2晶10芯IC:M3330+A VL1108+5812凯恩斯2077ABS 2晶10芯IC:Hi2023+1108E+5812+25L800凯恩斯KES-2088S 2晶6芯IC:Hi2023EC+HI3102E+RDA5812凯恩斯KES-2088S 2晶10芯IC:Hi2023EC+HI3102E+RDA5812凯恩斯KES-2088S 2晶6芯针脚定义①-TXD .②-RXD .③VCC .④-GND .⑤-BL IC:Hi2023EC+HI3122E+RDA5812凯恩斯KES-2088Z (5针).针脚定义①-TXD .②-RXD .③VCC .④-GND .⑤-BL IC:Hi2023EC+HI3102E+RDA5812凯恩斯KES-2099S 2晶6芯IC:Hi2023EC+Hi3102E+5812+25L80凯恩斯KES-2188T 3晶10芯IC:Hi2023+1108+5812凯恩斯KES-2188T 3晶12芯IC:Hi2023+1108E+5037凯恩斯KES-2288S 3晶10芯IC:M3330E+A VL1108+RDA5812+M12L64164A凯恩斯KES-2688b 2晶10芯IC:Hi2023e+1108e+5812 凯恩斯KES-2688S 2晶10芯IC:Hi2023e+1108e+5812凯恩斯KES-2788S 3晶10芯IC:Hi2023E+A VL1108EGa+5812凯恩斯KES-2788S 2晶6芯IC:Hi2023EC+Hi3122E+5812凯恩斯KES-5188 11芯IC:HTV903+A VL1108EGA+A V2020凯恩斯KES-5188A铁盒2晶10芯IC:HTV903F+A VL1108+RDK5812+F80+PT8211凯恩斯KES-5188B 2晶13芯IC:HTV903+RDA5812+A VL1108+8211+F80美路3晶13芯IC:Hi2023E+1108+2119美路2晶12芯IC:GX3003+GX1121+5812美路MR-1809 IC:Hi2023E+A VL1108E+高频头MAX2119C 美路MR-5598铁壳3晶12芯IC:GX3003+GX1121+5812 美路MR-5598 3晶12芯针脚定义①VCC. ②-RXD .③-TXD .④-GNDIC:Hi2023E+1108+2119C美路-5798 IC:Hi2023E+1108+2119C美路-5598 IC:Hi2023+1108+GAIM-18R+29lv160ZY 5518A 2晶10芯IC:Hi2023E+3102E+5812万利达ZY-5518A 1晶6芯((5针))IC:Hi2023E+Hi3102E+5812万利达ZY-5518A 2晶10芯IC:CX3001+GX1121+5812万利达ZY-5518A 3晶10芯(9针接口)IC:Hi2023+1108+5812长虹新一代3晶10芯IC:HI2023E+1108E+FL016ALF长虹新一代，海尔数码、海信数码单双晶体6芯IC:HI2023E+3102(3121)+5812长虹数码CH930 3晶12芯IC:HTV903F+1108+A V2020+M80长虹精品TC-6688ABS 2晶10芯IC:HTV903+A VL1108EG+5812长虹精工YJ5978 1晶10芯IC:HTV903F+1108EGa+2000+F80-100+8211长虹KES-2099S 2晶5芯IC:Hi2023+Hi3102E+5812长虹KES 2晶6芯IC:Hi2023+Hi3102+5812长虹CH920 3晶6芯IC:HTV903F+1108EGa+A V2020+25L80航天天信WTD198J 2晶12芯(9针接口)IC:GX3001+GX1121+5812+ES29LV160FB-70TG航天珠江WTD-198J 2晶12芯IC:GX3001+GX1121+5812 航天珠江ABS-209B IC:GX3001+GX1121++WGSE5037航天数码ABS-3809 2晶12芯IC:GX3001+GX1121+5812航天直播HT-168 3晶12芯IC:Hi2023+1108+夏普头航天高清王-HS-166 2晶12芯IC:Hi2023EC+Hi3102E+RDA5812航天高清王HS-169 2晶12芯针脚定义①-GND .②-TX .③-RX .④-VCCIC:Hi2023EC+3122+5812天诚TCD-219ABS 2晶10芯IC:M3330E+A VL1108EGA+5812天诚TCD-299Z 2晶10芯IC:Hi2023+3206+5812天诚TD-299Z 2晶5芯IC:Hi2023+3206+5812天诚TD-2992 2晶6芯IC:Hi3122E+Hi2023E+5812+F80+MXT8211天诚539 2晶10芯IC:HTV903+A V1108+5812天诚519型2晶10芯IC:HTV903+1108E+5812天诚TCD-239ABS 3晶10芯IC:M3330+1108+5812 天诚TCD-239ABS 2晶10芯IC:Hi2023+1108E+5812 天诚TCD-239 2晶10芯IC:M3330E+1108E+5812天诚TCD-299ABS 2晶10芯IC:Hi2023EC+Hi3121+5812天诚TCD-319ABS 3晶10芯IC:Hi2023E0914+A VL1108EGa+RDA5812天诚TCD-319ABS 3晶12芯IC:Hi2302+A VL1108+5037 天诚TCD-369ABS 3晶10芯IC:Hi2023+1108+5812天诚TCD-369ABS 3晶10芯IC:M3330E+1108+5812天诚TCD-369ABS 3晶5芯IC:Hi2023+1108+WCGE5037天诚TCD-509ABS 3晶10芯IC:M3330E-A VL1108EGa-5812天诚TCD-509ABS 10芯(5针)IC:Hi2023+A VL1108+5812+M12L6416A天诚TCD-539ABS 2晶10芯(5针)针脚定义①-RX .②-TX .③VCC .④-GND .⑤-BLIC:M3330E+A VL1108+25L80+5812天诚TCD-579ABS 2晶10芯IC:Hi2023+Hi1108+5812天诚TCD-579ABS 3晶10芯IC:HiM3330+A VL1108EGa+RDA5812天诚TCD-589ABS 3晶10芯IC:Hi2023+1108+5812天诚TCD-689ABS铁壳机2晶12芯(9针接口)IC:Hi2023+A VL1108+夏普头天诚TC-ABS1108A 11芯IC:Hi2023EC+A VL1108+5812 TCD--239ABS 2晶10芯IC:M3330E+A VL1108E+5812 TCD-339ABS 3晶10芯(9针接口) IC:Hi2023+1108+5812TCD-509ABS 3晶10芯IC:Hi2023E0915+A VL1108EGa+RDA5812TCD-509ABS 2晶10芯(5针) IC:Hi2023EC+HI3121+5812TCD-519ABS 2晶10芯IC:Hi2023+A VL1108+5812TCD-599 2晶10芯IC:M3330+A VL1008+5812TCD-219ABS 2晶振10芯针脚定义①-TXD .②-RXD .③-VCC .④-GND .⑤-BLIC:Hi2023EC+Hi3121+5812爱普思DVB-2568 3晶10芯IC:HTV903+1121+2020卓异5518A 3晶10芯IC:Hi2023E+1108+5812卓异5518A(铁壳)3晶11芯IC:Hi2023E+1108+5812卓异5518A(铁壳)2晶11芯(9针接口) IC:Hi2023+1108+夏普独立高频头卓异5518A G 1晶10芯爱百信针脚定义①-GND .②-TXD .③-RXD .④VCCIC:HTV903+A VL1108+5812卓异ZY-5518A G 驰骋天下针脚定义①-GND .②-RXD .③-TXD .④VCCIC:HTV903+A VL1108+5812+F80卓异5518AG 2晶11芯针脚定义①-GND .②-RXD .③-TXD .④VCC ⑤-BL IC:Hi2023E+1108+5812卓异ZY-5518A H 春1晶6芯针脚定义①-GND .②-TXD .③-RXD .④VCCIC:GX3001+5812+25L8005卓异ZY-5518A H 春2晶10芯针脚定义①-GND .②-TXD .③-RXD .④VCC .⑤-BLIC:Hi2023E+HI3121+5812+F25L008A卓异ZY-5518A H 秋针脚定义①-GND .②-RXD .③-TXD .④VCC 升级接口在内部PCB上IC:GX6121+5812+F80卓异ZY-5518A H 秋1晶10芯针脚定义①-GND .②-RXD .③-TXD .④VCC ⑤-BLIC:Hi2023EC+Hi3102E+5812+F80-100卓异ZY-5518A H至尊王牌2晶10芯针脚定义①-GND .②-TXD .③-RXD .④VCCIC:GX3001+GX1121+5812+25L8005卓异ZY-5518A H 财富2晶6 芯针脚定义①-GND .②-TXD .③-RXD .④VCC .⑤-BLIC:芯片掩磨+5812+80L100绿达PS-1288 3晶12芯IC:Hi2023E+ABS090520+M88TS2020绿达PS-1288 2晶12芯IC:Hi2023+Hi3021+A V2020绿达视美人\卓异1晶10芯IC:Hi2023EC+Hi3121+2020 绿达金统帅3晶10芯IC:M3330+1108+5812三星DQ88/DQ66 IC:HTV903F+A VL1108+A V2020三星高清王2晶12芯IC:GX3001+GX1121+5812三星高清DQ88 3晶12芯IC:HTV903F+A VL1108+A V2020 三星数码王TDX668B 2晶6芯针脚定义①-RXD .②-TXD .③-GND .④VCC. ⑤-BLIC:Hi2023+1108+5812三星数码王TDX668B 2晶6芯IC:HTV903F+A VL1108E+5812三星数码王668C 2晶6芯IC:HTV903F+A VL1108E+5812三星数码王TDX668E 1晶6芯IC:Hi2023EC+3102C+5812三星HSR-208C 1晶10芯IC:Hi2023E+Hi3102+MXT8211+A V2020+F25L08pA三星小霸王ABS-S 2009 2晶10芯IC:CX3001+CX1121+5812三星小霸王2900 (9针接口)IC:Hi2023E+A VL1108+MAX2119三星王国-KL6350 1晶11芯IC:HTV903+A VL1108EGa+EDA5812开门红KSP638 2晶10芯IC:HTV903F+A VL1108E+A V2020开门红KSP638 1晶10芯IC:CT216H+A VL1108EGa+A V2020日立创新TDX-668B 2晶6芯针脚定义①-RXD .②-TXD .③-GND .④VCC. ⑤-BLIC:Hi2023+A VL1108+5812志高之星HS166 2晶12芯IC:Hi3102+Hi2023+5812志高之星HS169 2晶12芯IC:Hi2023EC+Hi3012E+RDA5812A+EM638165TS-6G金牛ABS-1108 3晶10芯IC:Hi2023+1108+5812小灵通2晶6线IC:Hi2023+1108+5812福临门ABS-S 3晶9线IC:GX1121+GX3001+5812C60S-93AT 单晶10芯IC:CT216H+A VL1108EGa+A V2020 ABS-2301 单晶10芯针脚定义①-GND.②-TXD.③-RX .④VCCIC:Hi2023EC+Hi3211E+5812+25L8005其乐达CT216 2晶10芯IC:CT216+1108+A V2020科海6228 1晶11芯IC:HTV903+A VL1108EGa+RDa5812+25X16A VSIG科海6228-CT216H 1晶11芯IC:CT216H+1108EGa+M88TS2020科海C623S-91AT 单晶10芯IC:CT210H+A VL1108+2020 科海炫彩6888 IC:HTV903+A VL1108EGa+RDa5812科海2888（小天使）2晶10芯IC:HTV903+A VL1108EGa+RDa5812大旗920 3晶12芯IC:HTV903+A VL1108+A V2020大旗DQ920 3晶12芯IC:GX3001+GX1121+5812+25X16 大旗930 3晶12芯IC:HTV903+A VL1108+A V2020众昌电子ABS--2088 2晶10芯IC:Hi2023+A VL1108+5812众昌电子ABS-2087 2晶10芯IC:M3330+A VL1108+5812 创维S600 3晶IC:M3330E+A VL1108E+5812创维新一代3晶10芯IC:Hi2023E+1108+5037+FL016A 中广通XC-B188 3晶12芯IC:GX3001+GX1121+5812深圳知音ABSTAR KT-2309 3晶10芯IC:Hi2023+A VL1108E+5812知音科技ABSTAR KT1028H 2晶振10芯IC:Hi2023+A VL1108+GST GAIM-18R铁壳ABS-2009 2晶11芯IC:Hi2023+1108+夏普头王牌数码OST-366 2晶6芯针脚定义①-GND ②-RXD .③-TXD .④VCCIC:Hi3102+Hi2023EC+A V2020王牌数码王GM-ABS1108A 2晶10芯针脚定义①-GND .②-TXD .③-RXD .④VCCIC:GX3001+GX1121+5812+25L8005王牌数码王GM-ABS1108A 10芯IC:Hi2023+A VL1108+5812JIXIANG ABS-208 2晶14芯(9针接口)IC:Hi2023+1108+GST GAIM-18R ABS TUNER 夏普头JIXIANG-ABS208 2晶IC:D6121+1108+GST高频头East Star 2晶10芯IC:M3330-1108-GST GAIM-18R高频头小福星abs 2008 3晶12芯IC:GX3001+GX1211+5812通达C60S-93AT/C62S-91AT 1晶10芯IC:CT216H+A VL1108E+2020威特斯ZL-5188A 2晶13芯IC:HTV903+A VL1108+RDK5812威特斯ZL-5188B 2晶11芯IC:GX3001+GX1121+5812迷你星3晶13芯IC:GX3001+GX1121+5812+F16-100HIP高星HS-312 3晶12芯IC:GX3001+GX1121+5812北大高科3晶9芯IC:GX3001+GX1211+5812思达科ABS-S 801型2晶10芯IC:GX3001+GX1121+5810思达科ABS-S 802G 2晶10芯IC:GX3001+GX1211+5812思达科ABS-S 803A 1晶10芯IC:A VL1118+A V2020+25D80V思达科ABS-S 803G IC:GX3001+GX1211+5812思达科ABS-S 806H IC:GX3001+GX1211+5812思达科ABS-S 806H IC:A VL1118+A V2020+DSD4M16G思达科ABS-S 806H IC:HN4J7G+G2A954+5812+25X80思达科ABS-S807 1晶5芯IC:A VL1118a+A V2020+806H金霸王JBW-6688 2晶11芯IC:HTV903F+A VL1108EGa+A V2020+8211金霸王JBW-6688 IC:GX3001+GX1211+5812阿德尔ADE-168 IC:HY903+A VL1108EG+A V2020阿德尔ADE131金刚IC:HTV903F+A VL1108E+M88TS2020 海西小霸王TD299Z 2晶6芯IC:Hi2023E+Hi3122+5812 同洲CY-668S 1晶12芯IC:HM1512+1108+5812喜旺ABS5398 IC:Hi2023+1108E+MAX2119C喜旺ABS-5798 12芯IC:GX3001+GX1211+5812喜旺ABS-3809 2晶12芯IC:GX3001+GX1121+RDA5812希旺598 2晶12芯(9针接口) IC:Hi2023+1108+SHRP 高频头彩虹视霸CY84 1晶10芯IC:HTV903F+A VL1108+M88TS2020彩虹视霸A10S-9AAT 1晶10芯IC:A VL1118+SM42S16400B1-7+F80九洲村村通DVS-398F IC:CT216H+ALV1108+SHRP高频头金星ABS-208 1晶14芯IC:Hi2023+A VL1108+铁壳高频头威克2晶6芯(5针) IC:HTV903+1108+5812华尔HR731A1 3晶12芯IC:CX3001+CX1121+SHARP高频头爱普斯3晶9芯IC:HTV903+A V2020+A VL1108EG爱普斯2568 3晶10芯IC:HTV903+A V2020+A VL1108EG 爱普斯IC:GX3001+GX1211+A V2020+2J10X未来视佳ADEI88 3晶9芯IC:HTV903F+A V2020+A VL1108EG黑金刚TRT006 1晶10芯IC:A VL1118+A V2020+4558+F80-100DX-668 2晶10芯针脚定义①-RXD .②-TXD .③VCC .④-GND .⑤-BLIC:Hi2023EC_Hi3102E+5812+F80-100傲天海-吉祥2晶12芯针脚定义①-GND ②-RXD ③-TXD ④VCCIC:GX3001+GX1121+RDA5812高频头+P8075火星漫步LJ6008 1晶10芯IC:HTV903F+A VL1108+M88TS2020+F80-100王牌新一代TD-299Z针脚定义①- . ②-TXD .③-RXD .④-GND ⑤-IC:Hi2023E+Hi3122+5812王牌HJ360 3晶10芯IC:GX1120+GX3001+TS2020TVWALKER ABS-2008 1晶6芯IC:D61216GJ+1108E+SHARP头吉祥988 (ZJ-111) 1晶11芯IC:HTV903 +1108+高频头北京北电科林3晶12芯IC:Hi2023+A VL1108EGa+SHARP高频头家家福BEX811 1晶10芯IC:24645K2+M88VS2000+M88TS2020家家福ADE158 IC:HTV903+A VL1108+M88TS2020华星科技2晶IC:Hi2023+A VL1108+5812亚视达ABR-S(H11) 2晶10芯IC:HTV903+1108E+A V2020HSTAR 3晶10芯IC:Hi2023+A VL1108EGa+M88IS2020长江电讯ABS-2008型铁壳(9针接口)IC:D61216GJ+A VL1108EG+夏普头全家福3晶IC:Hi2023E+A VL1108EG+M88TS2020 畅想BEX818 1晶10芯IC:HTV903+A VL1108+A V2020 必佳GF-901 2晶10芯针脚定义①-GND .②-RXD .③-TXD .④VCCIC:HTV903+1108+A V2020KSP600G 飓风(华亚) 2晶10芯针脚定义①-GND ②-TXD ③-RXD ④VCCIC:HTV903+1108+M88TS2020+25D80万家乐TB002 (5针)IC:Hi2023EC+Hi3102E+M88TS2020+25X80A V万家乐2晶6芯IC:M3330+ALi1108+5812+F80-75奥伟科技ABS-800 3晶(9针接口)IC:GX3001+GX1121+5812奥伟科技ABS-900E 2晶12芯IC:CT216+A VL1108+独立高频头GAIR-08R天眼HSTER3晶10芯IC:Hi2023E+A VL1108+5812飞翔ADE351 2晶10芯IC:HTV903F+A VL1108EG+M88TS2000星视通XC-B268 1晶10芯IC:HTV903+A VL1108+5812星视通XC-C268 1晶11芯IC:HTV903 A VL1108 5812奥维科技ABS-600 3晶12芯IC:GX3001+GX1121+A V2020 超的个人论坛转载分享本资源。
毛斯（Moxa）UC-8200系列双核ARM Cortex-A7 1GHz IIoT网关产品说明书
UC-8200SeriesArm Cortex-A7dual-core1GHz IIoT gateways with built-in LTE Cat.4,1mini PCIe expansion slot for a Wi-Fi module,1CAN port,4DIs,4DOsFeatures and Benefits•Armv7Cortex-A7dual-core1GHz•ISASecure IEC62443-4-2Security Level2certified with Moxa IndustrialLinux3Secure•Moxa Industrial Linux with10-year superior long-term support•LTE-ready computer with Verizon/AT&T certification and industrial-grade CE/FCC/UL certifications•Dual-SIM slots•2auto-sensing10/100/1000Mbps Ethernet ports•Integrated LTE Cat.4module with US/EU/APAC band support•1CAN port supports CAN2.0A/B•microSD socket for storage expansion•-40to85°C wide temperature range and-40to70°C with LTE enabledCertificationsIntroductionThe UC-8200computing platform is designed for embedded data acquisition applications.The computer comes with dual RS-232/422/485serial ports,dual10/100/1000Mbps Ethernet ports,and one CAN port as well as dual Mini PCIe socket to support Wi-Fi/cellular modules.These versatile capabilities let users efficiently adapt the UC-8200to a variety of complex communications solutions.The UC-8200is built around a Cortex-A7dual core processor that has been optimized for use in energy monitoring systems,but is widely applicable to a variety of industrial solutions.With flexible interfacing options,this tiny embedded computer is a reliable and secure gateway for data acquisition and processing at field sites as well as a useful communications platform for many other large-scale deployments.Wide temperature LTE-enabled models are available for extended temperature applications.All units are thoroughly tested in a testing chamber, guaranteeing that the LTE-enabled computing platforms are suitable for wide-temperature applications.AppearanceUC-8210UC-8220SpecificationsComputerCPU Armv7Cortex-A7dual-core1GHzDRAM2GB DDR3LSupported OS Moxa Industrial Linux1(Debian9,kernel4.4),2027EOLMoxa Industrial Linux31(Debian11,kernel5.10),2031EOLSee /MILStorage Pre-installed8GB eMMCExpansion Slots MicroSD(SD3.0)socket x13OS is selectable via Moxa Computer Configuration System(CCS)for CTO models.For the model names,see the Ordering Information section of thedatasheet PDF file.Computer InterfaceEthernet Ports Auto-sensing10/100/1000Mbps ports(RJ45connector)x2 Serial Ports RS-232/422/485ports x2,software selectable(DB9male) CAN Ports CAN2.0A/B x1(DB9male)Digital Input DIs x4Digital Output DOs x4USB2.0USB2.0hosts x1,type-A connectorsWi-Fi Antenna Connector UC-8220Models:RP-SMA x2Cellular Antenna Connector UC-8220Models:SMA x2GPS Antenna Connector UC-8220Models:SMA x1Expansion Slots UC-8220-T-LX:mPCIe slot x2UC-8220-T-LX US/EU/AP Models:mPCIe slot x1SIM Format UC-8220Models:NanoNumber of SIMs UC-8220Models:2Buttons Programmable buttonTPM TPM v2.0Ethernet InterfaceMagnetic Isolation Protection 1.5kV(built-in)Security FunctionsHardware-based Security TPM2.0Hardware Root of Trust Secure BootIntrusion Detection Host-based Intrusion DetectionSecurity Tools Security Diagnostic ToolSecurity Event AuditingSecure UpdateDisk Protection LUKS Disk EncryptionRecovery One-step recovery to the last known secure stateDual-system design with automatic failbackReliability Network Keep AliveNetwork Failover and FailbackSerial InterfaceBaudrate300bps to921.6kbpsData Bits7,8Stop Bits1,2Parity None,Even,Odd,Space,MarkFlow Control RTS/CTS,XON/XOFFADDC(automatic data direction control)for RS-485RTS Toggle(RS-232only)Console Port1x4-pin header to DB9console portRS-232TxD,RxD,RTS,CTS,DTR,DSR,DCD,GNDRS-422Tx+,Tx-,Rx+,Rx-,GNDRS-485-2w Data+,Data-,GNDCAN InterfaceNo.of Ports1Connector DB9maleBaudrate10to1000kbpsIndustrial Protocols CAN2.0ACAN2.0BIsolation2kV(built-in)Signals CAN_H,CAN_L,CAN_GND,CAN_SHLD,CAN_V+,GNDDigital InputsConnector Screw-fastened Euroblock terminalDry Contact Off:openOn:short to GNDIsolation3K VDCSensor Type Wet contact(NPN)Dry contactWet Contact(DI to COM)On:10to30VDCOff:0to3VDCDigital OutputsConnector Screw-fastened Euroblock terminalCurrent Rating200mA per channelI/O Type SinkVoltage24VDC nominal,open collector to30VDCCellular InterfaceCellular Standards LTE Cat.4Band Options US Models:LTE Band2(1900MHz)/LTE Band4(1700MHz)/LTE Band5(850MHz)/LTE Band13(700MHz)/LTE Band17(700MHz)UMTS/HSPA850MHz/1900MHzCarrier Approval:Verizon,AT&TEU Models:LTE Band1(2100MHz)/LTE Band3(1800MHz)/LTE Band5(850MHz)/LTE Band7(2600MHz)/LTE Band8(900MHz)/LTE Band20(800MHz)UMTS/HSPA850MHz/900MHz/1900MHz/2100MHzAP Models:LTE Band1(2100MHz)/LTE Band3(1800MHz)/LTE Band5(850MHz)/LTE Band7(2600MHz)/LTE Band8(900MHz)/LTE Band28(700MHz)UMTS/HSPA850MHz/900MHz/1900MHz/2100MHzReceiver Types GPS/GLONASS/GalileoState-of-the-art GNSS solutionAccuracy Position:2.0m@CEP50Acquisition Hot starts:1.1secCold starts:29.94secSensitivity Cold starts:-145dBmTracking:-160dBmTime Pulse0.25Hz to10MHzLED IndicatorsSystem Power x2Programmable x1SIM card indicator x1Wireless Signal Strength Cellular/Wi-Fi x6Power ParametersNo.of Power Inputs Redundant dual inputsInput Voltage12to48VDCPower Consumption10WInput Current0.8A@12VDCReliabilityAlert Tools External RTC(real-time clock)Automatic Reboot Trigger External WDT(watchdog timer)Physical CharacteristicsDimensions UC-8220Models:141.5x120x39mm(5.7x4.72x1.54in)UC-8210Models:141.5x120x27mm(5.7x4.72x1.06in)141.5x120x27mm(5.7x4.72x1.06in)Weight UC-8210Models:560g(1.23lb)UC-8220Models:750g(1.65lb)Housing SECCMetalIP Rating IP30Installation DIN-rail mountingWall mounting(with optional kit)Environmental LimitsOperating Temperature-40to70°C(-40to158°F)Storage Temperature(package included)-40to85°C(-40to185°F)Ambient Relative Humidity5to95%(non-condensing)Shock IEC60068-2-27Vibration2Grms@IEC60068-2-64,random wave,5-500Hz,1hr per axis(without USB devicesattached)Standards and CertificationsEMC EN55032/35EN61000-6-2/-6-4EMI CISPR32,FCC Part15B Class AEMS IEC61000-4-2ESD:Contact:4kV;Air:8kVIEC61000-4-3RS:80MHz to1GHz:10V/mIEC61000-4-4EFT:Power:2kV;Signal:1kVIEC61000-4-6CS:10VIEC61000-4-8PFMFIEC61000-4-5Surge:Power:0.5kV;Signal:1kV Industrial Cybersecurity IEC62443-4-1IEC62443-4-2Hazardous Locations Class I Division2ATEXIECExCarrier Approvals VerizonAT&TSafety UL62368-1EN62368-1Green Product RoHS,CRoHS,WEEEMTBFTime UC-8210-T-LX-S:708,581hrsUC-8220-T-LX:650,836hrsUC-8220-T-LX-US-S/EU-S/AP-S:528,574hrs Standards Telcordia(Bellcore)Standard TR/SRWarrantyWarranty Period5yearsDetails See /warrantyPackage ContentsDevice1x UC-8200Series computerDocumentation1x quick installation guide1x warranty cardInstallation Kit1x DIN-rail kit(preinstalled)1x power jack6x M2.5mounting screws for the cellular module Cable1x console cableDimensions UC-8210UC-8220Ordering Information12UC-8210-T-LX-SDefault:MIL1(-Debian9),2027EOLOrder WithModel UC-8210-T-LX-S(CTO):MIL3(Debian11)Secure/Standard,2031EOLWith MIL3Secure1GHzDual CoreBuilt in––-40to85°CUC-8220-T-LXDefault:MIL1(-Debian9),2027EOLOrder WithModel UC-8220-T-LX(CTO):MIL3(Debian11)Secure/Standard,2031EOLWith MIL3Secure1GHzDual CoreBuilt in Reserved Reserved-40to70°CUC-8220-T-LX-US-SDefault:MIL1(-Debian9),2027EOLOrder WithModel UC-8220-T-LX-US-S(CTO):MIL3(Debian11)Secure/Standard,2031EOLWith MIL3Secure1GHzDual CoreBuilt inUS region LTEmodulepreinstalledReserved-40to70°CUC-8220-T-LX-EU-SDefault:MIL1(-Debian9),2027EOLOrder WithModel UC-8220-T-LX-EU-S(CTO):MIL3(Debian11)Secure/Standard,2031EOLWith MIL3Secure1GHzDual CoreBuilt inEurope regionLTE modulepreinstalledReserved-40to70°CUC-8220-T-LX-AP-SDefault:MIL1(-Debian9),2027EOLOrder WithModel UC-8220-T-LX-AP-S(CTO):MIL3(Debian11)Secure/Standard,2031EOLWith MIL3Secure1GHzDual CoreBuilt inAPAC regionLTE modulepreinstalledReserved-40to70°CUC-8210-T-LX-S(CTO)MIL3(Debian11)Secure orStandard,2031EOLWith MIL3Secure1GHzDual CoreBuilt in––-40to85°CUC-8220-T-LX(CTO)MIL3(Debian11)Secure orStandard,2031EOLWith MIL3Secure1GHzDual Core–Reserved Reserved-40to70°CUC-8220-T-LX-US-S (CTO)MIL3(Debian11)Secure orStandard,2031EOLWith MIL3Secure1GHzDual CoreBuilt inUS region LTEmodulepreinstalledReserved-40to70°C12UC-8220-T-LX-EU-S (CTO)MIL3(Debian11)Secure orStandard,2031EOLWith MIL3Secure1GHzDual CoreBuilt inEurope regionLTE modulepreinstalledReserved-40to70°CUC-8220-T-LX-AP-S (CTO)MIL3(Debian11)Secure orStandard,2031EOLWith MIL3Secure1GHzDual CoreBuilt inAPAC regionLTE modulepreinstalledReserved-40to70°CAccessories(sold separately)Power AdaptersPWR-12150-EU-SA-T Locking barrel plug,12VDC,1.5A,100to240VAC,EU plug,-40to75°C operating temperature PWR-12150-UK-SA-T Locking barrel plug,12VDC,1.5A,100to240VAC,UK plug,-40to75°C operating temperature PWR-12150-USJP-SA-T Locking barrel plug,12VDC1.5A,100to240VAC,US/JP plug,-40to75°C operating temperature PWR-12150-AU-SA-T Locking barrel plug,12VDC,1.5A,100to240VAC,AU plug,-40to75°C operating temperature PWR-12150-CN-SA-T Locking barrel plug,12VDC,1.5A,100to240VAC,CN plug,-40to75°C operating temperature Power WiringCBL-PJTB-10Non-locking barrel plug to bare-wire cableCablesCBL-F9DPF1x4-BK-100Console cable with4-pin connector,1mWi-Fi Wireless ModulesUC-8200-WLAN22-AC Wireless package for UC-8200V2.0or later with Wi-Fi module,2screws,2spacers,1heat sink,1pad AntennasANT-LTEUS-ASM-01GSM/GPRS/EDGE/UMTS/HSPA/LTE,1dBi,omnidirectional rubber-duck antennaANT-LTE-ASM-04BK704to960/1710to2620MHz,LTE omnidirectional stick antenna,4.5dBiANT-LTE-OSM-03-3m BK700-2700MHz,multiband antenna,specifically designed for2G,3G,and4G applications,3m cable ANT-LTE-ASM-05BK704-960/1710-2620MHz,LTE stick antenna,5dBiANT-LTE-OSM-06-3m BK MIMO Multiband antenna with screw-fastened mounting option for700-2700/2400-2500/5150-5850MHzfrequenciesANT-WDB-ARM-02022dBi at2.4GHz or2dBi at5GHz,RP-SMA(male),dual-band,omnidirectional antennaDIN-Rail Mounting KitsUC-8210DIN-rail Mounting Kit DIN-rail mounting kit for UC-8210with4M3screwsUC-8220DIN-rail Mounting Kit DIN-rail mounting kit for UC-8220with4M3screwsWall-Mounting KitsUC-8200Wall-mounting Kit Wall-mounting kit for UC-8200with4M3screws©Moxa Inc.All rights reserved.Updated Jul18,2023.This document and any portion thereof may not be reproduced or used in any manner whatsoever without the express written permission of Moxa Inc.Product specifications subject to change without notice.Visit our website for the most up-to-date product information.。
富斯9通说明书
MENU: 主菜单功能按钮ENT : 退出按钮UP ：菜单向上选择DOWN: 菜单向下选择+ ：增加参数的值—：减少参数的值注意区分：长按和短按1，持续按键2秒以上。
2，持续按键不超过1秒（微调显示）（编码方式）（比赛时间指示）（模式选择）（用户名）（型号选择）*电池电压指示：检测当前电源电压的值（如果电池电压低于8.5V后，BUZZER每隔5S发一次提示音*编码方式：发射机的发射数据的编码格式（包含PPM和PCM）*模式选择：用户参数编号显示（最多8组可以选择）*用户名字：当前用户的名字（用户名可以自定义，最长8个字符）*微调指示：副翼，升降，方向，油门通道的微调指示*型号选择：机种型号选择（飞机，直升机，滑翔机）*比赛时间：比赛倒计时（最长时间99分59秒）长按MENU键进入主菜单设置（大约2秒）（系统设置）（基本功能设置）*系统设置（SYSTEN SETTING）：对系统的初始化设定*基本功能设置（FU NC SETTING）：机种功能参数设定*使用UP DOWN选择SYSTEN SETTING和（FU NC SETTING。
然后，短按（1秒左右）MENU确定进入相应菜单或者按EXIT键退出设置菜单*菜单每动作一次BUZZER发一次声音*如果是菜单中参数调到最大值后，继续按按钮，BUZZER将不会发出音系统设定功能*MODEL SELE ：模式选择*MODEL NAME ：用户名称编辑*TYPE SELE ：机种型号的选择*MODEUAT ：调制模式选择*STICK SET ：控制杆的模式选择（左右手油门互换）*COPY ：复制成初始化3-1模式选择（MODEL SELE）*功能说明：为不同机种的操作调出不同用户的设定*系统总共包含8种模式，也就是说能够存储8种不同形式的设置为不同的用户，每次使用只要选择它就能够调出相应的设置。
*使用UP DOWN按钮选择，如果选择第一项其他颜色会翻转*然后短按MENU选择保存并返回上一项菜单，按EXIT键不保存并返回上一项菜单）3-2用户名称编辑（MODEL NAME*功能说明：编辑用户的名称*使用UP ，DOWN按钮选择，如果选择某一项其颜色会翻转，使用（—），（+）选择不同的字符，包含有（数字，字母等，空格）。
Silicon Digital Attenuator HMC1119数据手册说明书
0.25 dB LSB, 7-Bit, Silicon DigitalAttenuator, 0.1 GHz to 6.0 GHz Data Sheet HMC1119Rev. C Document FeedbackInformation furnished by Analog Devices is believed to be accurate and reliable. However, noresponsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. T rademarks and registered trademarks are the property of their respective owners. O ne Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2016–2018 Analog Devices, Inc. All rights reserved. Technical Support FEATURESAttenuation range: 0.25 dB LSB steps to 31.75 dBLow insertion loss:1.1 dB at 1.0 GHz1.3 dB at2.0 GHzTypical step error: less than ±0.1 dBExcellent attenuation accuracy: less than ±0.2 dBLow phase shift error: 6° phase shift at 1.0 GHzSafe state transitionsHigh linearity1 dB compression (P1dB): 31 dBm typicalInput third-order intercept (IP3): 54 dBm typicalRF settling time (0.05 dB final RF output): 250 nsSingle supply operation: 3.3 V to 5.0 VESD rating: Class 2 (2 kV human body model (HBM))24-lead, 4 mm × 4 mm LFCSP package: 16 mm2 APPLICATIONSCellular infrastructureMicrowave radios and very small aperture terminals (VSATs) Test equipment and sensorsIF and RF designsFUNCTIONAL BLOCK DIAGRAMVGND65432112962-1Figure 1.GENERAL DESCRIPTIONThe HMC1119 is a broadband, highly accurate, 7-bit digital attenuator, operating from 0.1 GHz to 6.0 GHz with 31.5 dB attenuation control range in 0.25 dB steps.The HMC1119 is implemented in a silicon process, offering very fast settling time, low power consumption, and high ESD robustness. The device features safe state transitions and is optimized for excellent step accuracy and high linearity over frequency and temperature range. The RF input and output are internally matched to 50 Ω and do not require any external matching components. The design is bidirectional; therefore, the RF input and output are interchangeable. The HMC1119 has an on-chip regulator that can support a wide supply operating range from 3.3 V to 5.0 V with no performance change in electrical characteristics. The HMC1119 incorporates a driver that supports serial (3-wire) and parallel controls of the attenuator.The HMC1119 comes in a RoHS-compliant, compact, 4 mm ×4 mm LFCSP package.A fully populated evaluation board is available.HMC1119Data SheetRev. C | Page 2 of 15TABLE OF CONTENTSFeatures .............................................................................................. 1 Applications ....................................................................................... 1 Functional Block Diagram .............................................................. 1 General Description ......................................................................... 1 Revision History ............................................................................... 2 Specifications ..................................................................................... 3 Electrical Specifications ............................................................... 3 Timing Specifications .................................................................. 4 Absolute Maximum Ratings ....................................................... 5 ESD Caution .................................................................................. 5 Pin Configuration and Function Descriptions ............................. 6 Interface Schematics..................................................................... 7 Typical Performance Characteristics ............................................. 8 Insertion Loss, Return Loss, State Error, Step Error, andRelative Phase ................................................................................8 Input Power Compression and Third-Order Intercept ......... 10 Theory of Operation ...................................................................... 11 Serial Control Interface ............................................................. 11 RF Input Output ......................................................................... 11 Parallel Control Interface .......................................................... 12 Power-Up Sequence ................................................................... 12 Applications Information .............................................................. 13 Evaluation Printed Circuit Board ............................................ 13 Packaging and Ordering Information ......................................... 15 Outline Dimensions ................................................................... 15 Ordering Guide .. (15)REVISION HISTORY4/2018—Rev. B to Rev CChanges to Figure 23 ...................................................................... 12 Change to PCB Description, Table 7 ............................................ 13 Updated Outline Dimensions . (15)9/2017—Rev. A to Rev. BChanged CP-24-16 to HCP-24-3 ................................. Throughout Updated Outline Dimensions ....................................................... 15 Changes to Ordering Guide .......................................................... 15 8/2017—Rev. 0 to Rev. AAdded Timing Specifications Section ............................................. 4 Moved Table 2 .................................................................................... 4 Changes to Figure 5 and Figure 6 .................................................... 7 Changes to Serial Control Interface Section ............................... 11 Moved Figure 22 and Table 6 ........................................................ 11 Changes to Figure 23 ...................................................................... 12 Moved Parallel Control Interface Section, Direct Parallel Mode Section, Latched Parallel Mode Section, Power-Up Sequence Section, and Power-Up States Section ......................................... 12 Updated Outline Dimensions . (15)9/2016—Revision 0: Initial VersionData SheetHMC1119Rev. C | Page 3 of 15SPECIFICATIONSELECTRICAL SPECIFICATIONSV DD = 3.3 V to 5.0 V , T A = 25°C, 50 Ω system, unless otherwise noted. Table 1.ParameterTest Conditions/Comments Min Typ Max Unit FREQUENCY RANGE0.1 6.0 GHz INSERTION LOSS 0.1 GHz to 1.0 GHz 1.1 1.8 dB 0.1 GHz to 2.0 GHz 1.3 2.0 dB 0.1 GHz to 4.0 GHz 1.6 2.3 dB0.1 GHz to 6.0 GHz 2.0 2.8 dB ATTENUATION 0.2 GHz to 6.0 GHzRange Delta between minimum and maximum attenuation states31.75dB AccuracyReferenced to insertion loss; all attenuation states−(0.05 + 4% of attenuation setting) +(0.05 + 4% of attenuation setting) dB Step Error All attenuation states±0.1 dB Overshoot Between all attenuation states ≤0.1 dB RETURN LOSSAll attenuation states ATTNIN, ATTNOUT 1.0 GHz 23 dBm 2.0 GHz 22 dBm 4.0 GHz 19 dBm6.0 GHz 17 dBm RELATIVE PHASE 1.0 GHz 6 Degrees 2.0 GHz 18 Degrees 4.0 GHz 38 Degrees6.0 GHz 58 Degrees SWITCHING CHARACTERISTICSt RISE , t FALL 10%/90% RF output60 ns t ON , t OFF50% CTL to 10%/90% RF output 150 ns Settling Time 50% CTL to 0.05 dB final RF output 250 ns50% CTL to 0.10 dB final RF output 200 ns INPUT LINEARITYAll attenuation states, 0.2 GHz to 6 GHz 0.1 dB Compression (P0.1dB) 30 dBm 1 dB Compression (P1dB)31 dBm Input Third-Order Intercept (IP3) Two-tone input power = 16 dBm/tone, ∆f = 1 MHz 54 dBm SUPPLY CURRENT (I DD ) V DD = 3.3 V 0.3 mAV DD = 5.0 V 0.6 mA CONTROL VOLTAGE THRESHOLD <1 µA typical Low V DD = 3.3 V 0 0.5 VV DD = 5.0 V 0 0.8 V High V DD = 3.3 V 2.0 3.3 VV DD = 5.0 V 3.5 5.0 V RECOMMENDED OPERATING CONDITIONS Supply Voltage Range (V DD )3.0 5.4 V Digital Control Voltage Range For P/S, CLK, SERNIN, LE, D0 to D6 pins 0 V DD V RF Input PowerAll attenuation states, T CASE = 85°C 24 dBm Case Temperature (T CASE )−40+85°CHMC1119 Data SheetTIMING SPECIFICATIONSSee Figure 23 and Figure 24 for the timing diagrams.Table 2.Parameter Description Min Typ Max Unitt SCK Minimum serial period, see Figure 23 70 nst CS Control setup time, see Figure 23 15 nst CH Control hold time, see Figure 23 20 nst LN LE setup time, see Figure 23 15 nst LEW Minimum LE pulse width, see Figure 24 10 nst LES Minimum LE pulse spacing, see Figure 23 630 nst CKN Serial clock hold time from LE, see Figure 23 0 nst PH Hold time, see Figure 24 10 nst PS Setup time, see Figure 24 2 nsRev. C | Page 4 of 15Data SheetHMC1119Rev. C | Page 5 of 15ABSOLUTE MAXIMUM RATINGSTable 3.ParameterRating RF Input Power (T CASE = 85°C) 25 dBmDigital Control Inputs (P/S, CLK, SERNIN, LE, D0 to D6) −0.3 V to V DD + 0.5 V Supply Voltage (V DD )−0.3 V to +5.5 V Continuous Power Dissipation (P DISS ) 0.31 W Thermal Resistance (at Maximum Power Dissipation) 156°C/WTemperatureChannel Temperature 135°CStorage−65°C to +150°C Maximum Reflow Temperature 260°C (MSL3 Rating) ESD Sensitivity (HBM)2 kV (Class 2)Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability.ESD CAUTIONHMC1119Data SheetRev. C | Page 6 of 15PIN CONFIGURATION AND FUNCTION DESCRIPTIONSV SERNIN NOTES1. THE EXPOSED PAD AND GND PINS MUST BE CONNECTED TO RF DC GROUND.CLK LE GND ATTNOUT GNDG N G N G N G N G N G N D 6D 5D 4D 3D 2D 112962-002Figure 2. Pin ConfigurationTable 4. Pin Function DescriptionsPin No. Mnemonic Description1, 19 to 24 D0, D6 to D1 Parallel Control Voltage Inputs. These pins attain the required attenuation (see Table 6). There is no internal pull-up or pull-down on these pins; therefore, these pins must always be kept at a valid logic level (V IH or V IL ) and must not be left floating. 2 V DD Supply Voltage Pin.3P/S Parallel/Serial Control Input. There is no internal pull-up or pull-down on this pin; therefore, this pin must always be kept at a valid logic level (V IH or V IL ) and must not be left floating. For parallel mode, set Pin 3 to low; for serial mode, set Pin 3 to high.4, 6 to 13, 15 GND Ground. The package bottom has an exposed metal pad that must connect to the printed circuit board (PCB) RF/dc ground. See Figure 4 for the GND interface schematic.5 ATTNIN Attenuator Input. This pin is dc-coupled and matched to 50 Ω. A blocking capacitor is required. Select the value of the capacitor based on the lowest frequency of operation. See Figure 5.14 ATTNOUT Attenuator Output. This pin is dc-coupled and matched to 50 Ω.A blocking capacitor is required. Select the value of the capacitor based on the lowest frequency of operation. See Figure 5.16 LE Serial/Parallel Interface Latch Enable Input. There is no internal pull-up or pull-down on this pin; therefore, this pin must always be kept at a valid logic level (V IH or V IL ) and must not be left floating. See the Theory of Operation section for more information.17 CLK Serial Interface Clock Input. There is no internal pull-up or pull-down on this pin; therefore, this pin must always be kept at a valid logic level (V IH or V IL ) and must not be left floating. See the Theory of Operation section for more information.18 SERNIN Serial interface Data Input. There is no internal pull-up or pull-down on this pin; therefore, this pin must always be kept at a valid logic level (V IH or V IL ) and must not be left floating. See the Theory of Operation section for more information.EPADExposed Pad. The exposed pad must be connected to RF/dc ground.Data SheetHMC1119Rev. C | Page 7 of 15INTERFACE SCHEMATICSD0TO D512962-021Figure 3. D0 to D6 Interface12962-022Figure 4. GND Interface12962-023Figure 5. ATTIN and ATTOUT InterfaceV 12962-024Figure 6. P/S, LE, CLK, and SERNIN InterfaceHMC1119Data SheetRev. C | Page 8 of 15TYPICAL PERFORMANCE CHARACTERISTICSINSERTION LOSS, RETURN LOSS, STATE ERROR, STEP ERROR, AND RELATIVE PHASE–4–3–2–1I N S E R T I O N L O S S (d B )FREQUENCY (GHz)12962-003Figure 7. Insertion Loss vs. Frequency at Various TemperaturesFREQUENCY (GHz)–50–40–30–20–100I N P U T R E T U R N L O S S (d B)12962-004Figure 8. Input Return Loss (Major States Only)–2.0–1.6–1.2–0.8–0.400.40.81.21.62.0043281216202428S T A T E E R R O R (d B )ATTENUATION STATE (dB)12962-007Figure 9. State Error vs. Attentuation State, 0.1 GHz to 0.5 GHzFREQUENCY (GHz)–35–30–25–20–15–10–50N O R M A L I Z E D A T T E N U A T I O N (d B )12962-005Figure 10. Normalized Attenuation (Major States Only)FREQUENCY (GHz)–60–50–40–30–20–10O U T P U T R E T U R N L O S S (d B )12962-006Figure 11. Output Return Loss (Major States Only)–1–0.8–0.6–0.4–0.200.20.40.60.81S T A T E E R R O R (d B )043281216202428ATTENUATION STATE (dB)12962-009Figure 12. State Error vs. Attentuation State, 1 GHz to 6 GHzData SheetHMC1119Rev. C | Page 9 of 15–2.0–1.5–1.0–0.500.51.01.52.0S T A T E E R R O R (d B )FREQUENCY (GHz)12962-008Figure 13. State Error vs. Frequency, Major States Only–60–40–20020406080R E L A T I V E P H A S E (d e g )FREQUENCY (GHz)12962-011Figure 14. Relative Phase vs. Frequency, Major States Only–1.0–0.8–0.6–0.4–0.200.20.40.60.81.0S T E P E R R O R (d B )FREQUENCY (GHz)12962-010Figure 15. Step Error vs. Frequency, Major States OnlyHMC1119Data SheetRev. C | Page 10 of 15INPUT POWER COMPRESSION AND THIRD-ORDER INTERCEPT152025303540P 1d B(d B m )FREQUENCY (GHz)12962-012Figure 16. P1dB vs. Frequency at Various Temperatures, MinimumAttentuation State, 0.05 GHz to 1 GHz152025303540P 0.1d B(d B m )FREQUENCY (GHz)12962-013Figure 17. P0.1dB vs. Frequency at Various Temperatures, MinimumAttentuation State, 0.05 GHz to 1 GHzFREQUENCY (GHz)3040506070I P 3(d B m )0.200.40.60.8 1.012962-014Figure 18. IP3 vs. Frequency at Various Temperatures, MinimumAttentuation State, 0.1 GHz to 1 GHz 152025303540P 1d B (dB m )FREQUENCY (GHz)12962-015Figure 19. P1dB vs. Frequency at Various Temperatures, MinimumAttentuation State, 0.05 GHz to 6 GHz152025303540P 0.1d B (dB m )FREQUENCY (GHz)12962-016Figure 20. P0.1dB vs. Frequency at Various Temperatures, MinimumAttentuation State, 0.05 GHz to 6 GHzFREQUENCY (GHz)3040506070I P 3(d B m )12962-017Figure 21. IP3 vs. Frequency at Various Temperatures, MinimumAttentuation State, 0.1 GHz to 6 GHzTHEORY OF OPERATIONThe HMC1119 incorporates a 7-bit fixed attenuator array that offers an attenuation range of 0.25 dB to 31.75 dB, with 0.25 dB steps. An integrated driver provides both serial and parallel mode control of the attenuator array (see Figure 22).The HMC1119 can be in either serial or parallel mode control by setting the P/S pin to high or low, respectively (see Table 5). The 7-bit data, loaded in either serial or parallel mode, then latches with the control signal, LE, to determine the attenuator value. Table 5. Mode Selection Table 1P/S Pin State Control Mode Low Parallel HighSerial1The P/S pin must always be kept at a valid logic level (V IH or V IL ) and must not be left floating.SERIAL CONTROL INTERFACEThe HMC1119 utilizes a 3-wire serial to parallel (SPI)configuration, as shown in the serial mode timing diagram (see Figure 23): serial data input (SERNIN), clock (CLK), and latch enable (LE). The serial control interface activates when the P/S pin is set to high.In serial mode, the 7-bit SERNIN data is clocked MSB first on rising CLK edges into the shift register; then, LE must betoggled high to latch the new attenuation state into the device. The LE must be set low to clock a set of 7-bit data into the shift register because CLK is masked to prevent the attenuator value from changing if LE is kept high.In serial mode operation, both the serial control inputs (LE, CLK, SERNIN) and the parallel control inputs (D0 to D6) must always be kept at a valid logic level (V IH or V IL ) and must not be left floating. It is recommended to connect the parallel control inputs to ground and to use pull-down resistors on all serial control input lines if the device driving these input lines goes high impedance during hibernation.RF INPUT OUTPUTThe attenuator in the HMC1119 is bidirectional; the ATTNIN and ATTNOUT pins are interchangeable as the RF input and output ports. The attenuator is internally matched to 50 Ω at both input and output; therefore, no external matching components are required. The RF pins are dc-coupled; therefore, dc blocking capacitors are required on RF lines.SERNIND0D1D2D3D4D5D6CLK P/S LERFOUTPUT12962-018Figure 22. Attenuator Array Functional Block DiagramTable 6. Truth TableDigital Control Input 1Attenuation State (dB) D6 D5 D4 D3 D2 D1D0 Low Low Low Low Low Low Low 0 (reference) Low Low Low Low Low Low High 0.25 Low Low Low Low Low High Low 0.5 Low Low Low Low High Low Low 1.0 Low Low Low High Low Low Low 2.0 Low Low High Low Low Low Low 4.0 Low High Low Low Low Low Low 8.0 High Low Low Low Low Low Low 16.0 HighHighHigh High HighHigh High 31.751Any combination of the control voltage input states shown in Table 6 provides an attenuation equal to the sum of the bits selected.12962-19 P/SSERNINCLKLEFigure 23. Serial Control Timing DiagramPARALLEL CONTROL INTERFACEThe parallel control interface has seven digital control input lines(D6 to D0) to set the attenuation value. D6 is the most significantbit (MSB) that selects the 16 dB attenuator stage, and D0 is theleast significant bit (LSB) that selects the 0.25 dB attenuator stage(see Figure 22).In parallel mode operation, both the serial control inputs (LE, CLK,SERNIN) and the parallel control inputs (D0 to D6) must always bekept at a valid logic level (V IH or V IL) and must not be left floating. Itis recommended to connect the serial control inputs to ground andto use pull-down resistors on all parallel control input lines ifthe device driving these input lines goes high impedance duringhibernation.Setting P/S to low enables parallel mode. There are two modes ofparallel operation: direct parallel mode and latched parallel mode.Direct Parallel ModeFor direct parallel mode, the latch enable (LE) pin must be kepthigh. Change the attenuation state using the control voltage inputs(D0 to D6) directly. This mode is ideal for manual control of theattenuator and using hardware, switches, or a jumper.Latched Parallel ModeThe latch enable (LE) pin must be low when changing thecontrol voltage inputs (D0 to D6) to set the attenuation state.When the desired state is set, LE must be toggled high to transferthe 7-bit data to the bypass switches of the attenuator array, thentoggled low to latch the change into the device (see Figure 24).LED6TO D0P/S12962-2Figure 24. Latched Parallel Mode Timing DiagramPOWER-UP SEQUENCEThe ideal power-up sequence is as follows:1.Power up GND.2.Power up V DD.3.Power up the digital control inputs (the relative order ofthe digital control inputs is not important).4.Power up the RF input.For latched parallel mode operation, LE must be toggled. Therelative order of the digital inputs is not important as long as theinputs are powered up after GND and V DD.Power-Up StatesThe logic state of the device is at maximum attenuation when, atpower up, LE is set to low. The attenuator latches in the desiredpower-up state approximately 200 ms after power up.APPLICATIONS INFORMATIONEVALUATION PRINTED CIRCUIT BOARDThe schematic of the evaluation board, EV2HMC1119LP4M , is shown in Figure 25. The PCB is four-layer material with a copper thickness of 0.7 mils on each layer. Each copper layer is separated with a dielectric material. The top dielectric material is 10-mil RO4350 with a typical dielectric constant of 3.48. The middle and bottom dielectric materials are FR-4 material, used for mechanical strength and to meet the overall board thickness of approximately 62 mils, which allows SMA connectors to beAll RF and dc traces are routed on the top copper layer. The RF transmission lines are designed using coplanar waveguide model (CPWG) with a width of 18 mils, spacing of 17 mils, and dielectric thickness of 10 mils to maintain 50 Ω characteristic impedance. The inner and bottom layers are solid ground planes. For optimal electrical and thermal performance, an ample number of vias are populated around the transmission lines and under the package exposed pad. The evaluation board layout serves as a recommenda-tion for the optimal performance on both electrical and thermal aspects.12962-026Figure 25. EV2HMC1119LP4M Evaluation PCBTable 7. Bill of MaterialsItem Value 1 DescriptionManufacturer 2 J1, J2 PCB mount SMA connector J318-pin dc connectorTP1, TP2Through hole mount test point C1, C3 100 pF Capacitor, 0402 package C6 10 μF Capacitor, 0603 package C71000 pF Capacitor, 0402 package R1 to R11 0 Ω Resistor, 0402 package R12 to R25 100 kΩ Resistor, 0402 packageSW1, SW2 SPDT four-position DIP switchU1 HMC1119 digital attenuator Analog Devices, Inc.PCB 3600-01280-00-1 evaluation PCB EV2HMC1119LP4M 4 from Analog Devices1 Blank cells in the Value column indicate that there is no specific value recommendation for the listed component.2Blank cells in the Manufacturer column indicate that there is no specific manufacturer recommendation for the listed component. 3Circuit board material is Arlon 25FR. 4Reference this number when ordering the full evaluation PCB. See the Ordering Guide section.12962-027Figure 26. Applications CircuitPACKAGING AND ORDERING INFORMATIONOUTLINE DIMENSIONS0.50BSC0.500.400.30BOTTOM VIEWTOP VIEWSIDE VIEW4.104.00 SQ 3.900.950.850.750.05 MAX 0.02 NOM0.20 REFCOPLANARITY0.08PIN 1INDICATORFOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONSSECTION OF THIS DATA SHEET.12-08-2017-C0.300.250.180.20 MIN2.852.70 SQ 2.55EXPOSED PAD00SEATING PLANEDETAIL A (JEDEC 95)Figure 27. 24-Lead Lead Frame Chip Scale Package [LFCSP]4 mm × 4 mm Body and 0.85 mm Package Height(HCP-24-3)Dimensions shown in millimetersORDERING GUIDEModel 1Temperature Range MSL Rating 2 Package DescriptionPackage Option HMC1119LP4ME −40°C to +85°C MSL3 24-Lead Lead Frame Chip Scale Package [LFCSP] HCP-24-3 HMC1119LP4METR −40°C to +85°C MSL3 24-Lead Lead Frame Chip Scale Package [LFCSP] HCP-24-3 EV2HMC1119LP4MEvaluation Board1 All models are RoHS compliant.2See the Absolute Maximum Ratings section.©2016–2018 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D12962-0-4/18(C)。
思科网络安全设备 AsyncOS 9.0.x 版本说明说明书
思科系统公司思科网络安全设备 AsyncOS 9.0.x 版本说明发布日期：2015 年 9 月 21 日修订日期：2016 年 7 月 18 日目录•新增内容（第 1 页）•版本分类（第 3 页）•此版本支持的硬件（第 3 页）•升级路线（第 4 页）•升级前要求（第 6 页）•安装和升级说明（第 7 页）•升级 AsyncOS for Web （第 11 页）•重要提示！升级后需要进行的操作（第 11 页） •文档更新（第 12 页）•已知和已修复问题（第 13 页） •相关文档（第 15 页）•支持（第 15 页）新增内容•Cisco AsyncOS 9.0.1 中的新增内容（第 2 页）•Cisco AsyncOS 9.0.0-485 (LD) 中的新增内容（第 3 页）新增内容Cisco AsyncOS 9.0.1 中的新增内容•Cisco AsyncOS 9.0.1-162 (GD) 中的新增内容（第 2 页）•Cisco AsyncOS 9.0.1-161（GD - 仅面向物理设备）中的新增内容（第 2 页）•Cisco AsyncOS 9.0.1-135 (ED) 中的新增内容（第 2 页）Cisco AsyncOS 9.0.1-162 (GD) 中的新增内容在物理 WSA 设备上，版本 161 和 162 相同。
在虚拟 WSA 设备上进行安装时，版本 161 在最后一刻出现问题 (CSCux56040)。
该问题在版本 162 中得到更正。
功能说明身份服务引擎 (ISE) 版本支持 ISE 2.0 以内的所有版本。
HTTP 信头长度的最大值您可以使用 CLI 命令maxhttpheadersize更改代理请求的 HTTP 信头长度最大值。
增加该值可以减少在指定用户属于大量身份验证组，或者响应信头超过当前信头长度最大值时发生的策略跟踪故障。
注意此命令在 AsyncOS 9.0 中实际引入。
A9s接收卡规格书-V1.1.0
集成网络变压器，简化设计，提高电磁兼容性，有助于用户产品顺利通过 EMC 认
子 证。 电 实用的软件设计：
支持 LVDS 传输（专用固件程序支持）。
瓦 支持智能模组（专用固件程序支持）。
支持快速修缝。
诺 支持 3D 功能。 安 支持模组自动校正。
有 3.3 提升硬件可靠性 ........................................................................................................................................... 5 技 3.4 提升软件可靠性 ........................................................................................................................................... 5
3 功能特性
3 功能特性
司
3.1 提升显示效果
公
特性 支持逐点亮色度校正
说明
限 配合 NovaLCT 和 NovaCLB，对每个灯点的亮度和 有 色度进行校正。
支持画面 90°倍数旋转 （不支持旋转后进行校正）
技 在 NovaLCT 上可以设置显示屏画面以 90°的倍数
B 术语 ...............................................................................................................................19
SG2009用户手册
11
三爱仪器
3.2.5 彩条选择
SG-2009 用户手册
两种不同形式的彩条供用户选择 3.2.6 灰阶选择
4 种不同级数的阶梯供用户选择
四、遥控开关控制盒操作
HDMI/DVI
HDCP
REAUTH
LOOP
HDMI/DVI： 数字输出端口切换键，按下该键数字输出端口即由 DVI 转为 HDMI,或由 HDMI 转为 DVI，当 HDMI 输出端口有效时所有模拟输出被关闭。
循环功能— 循环显示预设制式与图像 按下 RP1---3 中任意一键后，即可使用遥控开关循环输出预设的信号
2．2 后面板：
8
三爱仪器
SG-2009 用户手册
后面板主要包括各种输出端口、控制端口、USB 下载端口和电源开关组成。 输出端口包括 HDMI 端口、DVI 端口、VGA 端口、YPbPr、CVBS、Y/C 及音频的左右 声道。 控制端口用来联接遥控开关盒。
二、面板操作
2．1 前面板介绍
SG-2009 用户手册
前面板由 LCD 显示屏、菜单控制、制式选择、静态图象选择、动态图象选择、循环 RP1-3 等六部分组成。
LCD 显示屏 — 显示制式、图象以及控制的相关信息。
菜单控制
功能设置键
左键
上键
右键
6
三爱仪器
SG-2009 用户手册
下键
进行功能的选择，中心“SET”键进入系统功能主菜单设置界面，右键为选择下级 菜单或确认当前选择，左键返回上级菜单或取消当前菜单，上下键控制菜单的滚动。 制式选择 —进行输出制式的选择。
HDCP：该键使能 HDCP 或取消 HDCP 功能，在 HDCP 模式下当前选择的数字端口 DVI 或 HDMI 输出信号被加密，HDCP 模式时所有模拟输出端口无效。
SG2023中文资料
HIGH VOLTAGE MEDIUM CURRENT DRIVER ARRAYSABSOLUTE MAXIMUM RATINGS (Note 1)Peak Collector Current, I C(SG2000, 2020) ......................................................(SG2010) ................................................................Operating Junction TemperatureHermetic (J, L Packages) .........................................Plastic (N, Packages) ...............................................Storage Temperature Range ..........................Lead Temperature (Soldering 10 sec.) .........................Output Voltage, V CE(SG2000, 2010 series) ................................................(SG2020 series) ..........................................................Input Voltage, V IN(SG2002,3,4) ...............................................................Continuous Input Current, I IN ........................................50V 95V 30V 25mA500mA 600mA 150°C 150°C -65°C to 150°C 300°CNote 1. Values beyond which damage may occur.J Package:Thermal Resistance-Junction to Case , θJC .................. 30°C/W Thermal Resistance-Junction to Ambient , θJA ...............80°C/W N Package:Thermal Resistance-Junction to Case , θJC .................. 40°C/W Thermal Resistance-Junction to Ambient , θJA .............. 65°C/W L Package:Thermal Resistance-Junction to Case , θJC .................. 35°C/W Thermal Resistance-Junction to Ambient , θJA ............ 120°C/WTHERMAL DATANote A.Junction Temperature Calculation: T J = T A + (P D x θJA ).Note B.The above numbers for θJC are maximums for the limiting thermalresistance of the package in a standard mounting configuration.The θJA numbers are meant to be guidelines for the thermal performance of the device/pc-board system. All of the above assume no ambient airflow.Output Voltage, V CESG2000, SG2010 series ..............................................SG2020 series .............................................................50V 95VPeak Collector Current, I CSG2000, SG2020 series ...........................................SG2010 series ........................................................Operating Ambient Temperature RangeSG2000 Series - Hermetic ..........................SG2000 Series - Plastic ..................................50mA 500mA -55°C to 125°C 0°C to 70°CRECOMMENDED OPERATING CONDITIONS (Note 2)Note 2. Range over which the device is functional.SELECTION GUIDEDevice V CE Max I C Max Logic InputsSG200150V 500mA General Purpose PMOS, CMOS SG200250V 500mA 14V-25V PMOS SG200350V 500mA 5V TTL, CMOSSG200450V 500mA 6V-15V CMOS, PMOS SG201150V 600mA General Purpose PMOS, CMOS SG201250V600mA14V-25V PMOSDevice V CE Max I C Max Logic InputsSG201350V 600mA 5V TTL, CMOSSG201450V 600mA 6V-15V CMOS, PMOS SG201550V 600mA High Output TTL SG202195V 500mA General Purpose PMOS, CMOS SG202395V 500mA 5V TTL, CMOSSG202495V500mA6V-15V CMOS, PMOSCHARACTERISTIC CURVESFIGURE 4.INPUT CHARACTERISTICS - SG2002FIGURE 5.INPUT CHARACTERISTICS - SG2003FIGURE 6.INPUT CHARACTERISTICS - SG2004FIGURE 7.PEAK COLLECTOR CURRENT VS. DUTY CYCLEFIGURE 1.OUTPUT CHARACTERISTICS FIGURE 2.OUTPUT CURRENT VS. INPUT VOLTAGE FIGURE 3.OUTPUT CURRENT VS. INPUT CURRENTNote 1. Contact factory for JAN and DESC product availability.2. All parts are viewed from the top.3. See selection guide for specific device types.CONNECTION DIAGRAMS & ORDERING INFORMATION (See Notes Below)AmbientTemperature Range Part No. (Note 3)PackageConnection Diagram16-PIN CERAMIC DIP J - PACKAGESG2XXXJ/883B -55°C to 125°C SG2023J/DESC -55°C to 125°C JAN2001J -55°C to 125°C JAN2002J -55°C to 125°C JAN2003J -55°C to 125°C JAN2004J -55°C to 125°C SG2XXXJ-55°C to 125°C17654328109111213141615SG2003N 0°C to 70°C SG2023N 0°C to 70°C16-PIN PLASTIC DIP N - PACKAGE20-PIN CERAMICLEADLESS CHIP CARRIER L- PACKAGESG2XXXL/883B -55°C to 125°C SG2XXXL -55°C to 125°C1849319201214151716876513121110。
Cisco Nexus 9500系列交换机数据册说明书
Data sheetCisco Nexus 9500 Series SwitchesProduct overviewApplication architectures and deployment modes are rapidly evolving. Modern applications are multinode, highly modular, and deployed over a combination of bare-metal, virtual, and cloud data center environments. In addition to that, individual departments within an organization have varying infrastructure and networking needs. These factors require that data center networks be simple, programmable, extensible, scalable, and shareable to meet the demands of applications.The Cisco Nexus® 9000 Series Switches operate in one of two modes – Cisco Application Centric Infrastructure (Cisco ACI™) or Cisco NX-OS. In Cisco ACI mode, these switches provide a turnkey, fully automated, policy-based architecture to design and manage data center fabrics. In Cisco NX-OS mode, these switches provide the capability to use foundational layer 2/3 technologies, as well as modern technologies such as VXLAN, with a Border Gateway Protocol‒Ethernet VPN (BGP-EVPN) control plane, segment routing, Multiprotocol Label Switching (MPLS), and automation via NX-APIs.The Cisco Nexus 9000 Series Switches include the Nexus 9500 Series modular switches and the Nexus9200/9300 Series fixed switches.Figure 1. Cisco Nexus 9000 Series Switch ChassisThe Cisco Nexus 9500 Series modular switches are capable of supporting a bandwidth of up to 172.8 Terabits per second (Tbps) with a comprehensive selection of line cards that provide 1-, 10-, 25-, 40-, 50-, and 100-Gigabit Ethernet interfaces. Using these line cards, the Cisco Nexus 9500 Series switches can be configured with up to1. 576 100-Gigabit Ethernet ports (or)2. 576 40-Gigabit Ethernet ports (or)3. 2304 25-Gigabit Ethernet ports (or)4. 2304 10-Gigabit Ethernet portsThe supervisor, system controller, power supplies, and line cards are common across all three switches. Each switch, however, has unique fabric modules and fan trays that plug in vertically in the rear of the chassis.Table 1. Features and benefitsDeployment scenariosThe Cisco Nexus 9500 Series Switches support various deployment scenarios:●Spine nodes in a spine-leaf fabric●Core or aggregation node in an L2/L3 network●Border gateway in a L2/L3 networkSpine-leaf fabric architectureThe high port-density and ability to support multispeed ports on the same chassis make the Cisco Nexus 9500 Series Switches the ideal choice as a spine in spine-leaf fabric architectures. The Cisco Nexus 9500 Series Switches can function as a spine in either Cisco Application Centric Infrastructure (Cisco ACI) or Cisco NX-OS operating modes (Figure 1).Figure 2. Spine-leaf architecture using Cisco Nexus 9300 and 9500 switchesCisco ACI is the most comprehensive solution to enable data center automation and application agility. It provides a secure, scalable, deterministic, and integrated policy-based architecture, which enables rapid application deployment and workload mobility in data centers. The Cisco Nexus 9000 Series cloud-scale switches are the foundation to deploy and run Cisco ACI. The Cisco Nexus 9500 Series cloud-scale switches and select Cisco 9300 Series cloud-scale switches provide the ACI spine functionality in the Cisco ACI fabric. The Cisco Nexus 9300 Series cloud-scale switches provide the ACI leaf functionality in the Cisco ACI fabric.In Cisco NX-OS mode, the Cisco Nexus 9500 Series Switches support foundational routing and switching technologies along with modern technologies such as VXLAN with BGP-EVPN control plane, segment routing, MPLS, and open APIs. These technologies provide the flexibility to build spine-leaf data center fabrics or classical three-tier data center networks. In this mode, the Cisco® Data Center Network Manager (DCNM) can manage the Cisco Nexus 9500 Series Switches.Core, aggregation, and gateway rolesThe Cisco Nexus 9500 Series Switches support line cards that provide a choice of smart buffers, deep buffers, large tables, and high-density, high-speed Ethernet interfaces. These hardware capabilities, along with extensive routing and switching software capabilities, make the Cisco Nexus 9500 Series Switches an excellent choice as a core, aggregation, or gateway switch.End-of-row access layer switchAs the Cisco Nexus 9500 Series Switches support high-density, multispeed Ethernet ports, these switches can also be deployed as end-of-row switches providing access connections to blade or rack servers. The Cisco Nexus 9500 Series Switches also provide the flexibility to incrementally transition from lower-speed server connections to higher-speed server connections.Cisco Nexus 9500 Series Switch componentsThe Cisco Nexus 9500 Series Switch includes the components shown in Figure 2.Figure 3.Cisco Nexus 9500 Series Switch componentsThe Cisco Nexus 9500 Series switches support several line cards and fabric modules. The following data sheets describe each family of line cards and fabric modules:●Cisco Nexus 9500 Cloud Scale Line Cards and Fabric Modules. URL:https:///c/en/us/products/collateral/switches/nexus-9000-series-switches/datasheet-c78-736677.html .●Cisco Nexus 9500 R-Series (Deep Buffer) Line Cards and Fabric Modules. URL:https:///c/en/us/products/collateral/switches/nexus-9000-series-switches/datasheet-c78-738321.html .●Cisco Nexus 9500 Classic Line Cards and Fabric Modules. URL:https:///c/en/us/products/collateral/switches/nexus-9000-series-switches/datasheet-c78-741336.html .Cisco Nexus 9500 Series switch chassisThe Cisco Nexus 9500 Series Switch has three chassis – a 4-slot, 8-slot, and 16-slot chassis.N9K-C9504: 4-Slot ChassisN9K-C9508: 8-Slot ChassisN9K-C9516: 16-Slot ChassisTable 2. Cisco Nexus 9500 Series Switch chassis specificationsNumber of line card slotsDimensionsWeightMean Time Between Failure(MTBF) HoursOperating temperatureNonoperating temperatureHumidityAltitudeCisco Nexus 9500 Series supervisor modulesA pair of redundant supervisor modules manages all switch operations using a state-synchronized, active-standby model. The supervisor accepts an external clock and supports management through multiple ports – two USB ports, a serial port, and a 10/100/1000-Mbps Ethernet port. All supervisors support Cisco ACI or NX-OS deployments. Redundant supervisors should be of the same type within a chassis.Table 3. Cisco Nexus 9500 Series supervisor modules specificationsCisco Nexus 9500 platform system controllerA pair of redundant system controllers offloads chassis management functions from the supervisor modules. The controllers are responsible for managing the power supplies and fan trays; they are also the central point for the Gigabit Ethernet Out-of-Band Channel (EOBC) between the supervisors, fabric modules, and line cards.Table 4. Cisco Nexus 9500 Series supervisor modules specificationsCisco Nexus 9500 platform fabric moduleEach Cisco Nexus 9500 Series Chassis supports up to six fabric modules, which plug in vertically at the back of the chassis behind the fan trays. The Cisco Nexus 9500 line card and fabric module data sheets provide additional information about the various fabric modules.Cisco Nexus 9500 platform fan traysThree hot-swappable fan trays support front-to-back cooling for the Cisco Nexus 9500 Series switches. Each fan tray covers two fabric modules.Table 5. Fan tray specificationsCisco Nexus 9500 platform power supplyThe Cisco Nexus 9500 platform supports hot-swappable, front-panel-accessible AC, DC, and universal high voltage AC/DC power supplies. N+1 and N+N redundancy modes are supported depending on the chassis configuration.The 3150W high voltage AC/DC power supply offers two power inputs each of which can provide up to 3150 W of output power. This unique capability allows provisioning grid redundancy without doubling the required number of power supplies.Table 6. Power supply specificationsTable 7. Ordering informationWarrantyThe Cisco Nexus 9500 platform has a 1-year limited hardware warranty. The warranty includes hardware replacement with a 10-day turnaround from receipt of a Return Materials Authorization (RMA).Service and supportCisco offers a wide range of services to help accelerate your success in deploying and optimizing the Cisco Nexus 9500 platform in your data center. These innovative Cisco Services offerings are delivered through a unique combination of people, processes, tools, and partners and are focused on helping you increase operation efficiency and improve your data center network.Cisco Advanced Services use an architecture-led approach to help you align your data center infrastructure with your business goals and achieve long-term value. Cisco SMARTnet™ Service helps you resolve mission-critical problems with direct access at any time to Cisco network experts and award-winning resources. With this service, you can take advantage of the Cisco Smart Call Home service, which offers proactive diagnostics and real-time alerts on your Cisco Nexus 9500 platform switch.Spanning the entire network lifecycle, Cisco Services offerings help increase investment protection, optimize network operations, support migration operations, and strengthen your IT expertise.Cisco CapitalFlexible payment solutions to help you achieve your objectivesCisco Capital makes it easier to get the right technology to achieve your objectives, enable business transformation and help you stay competitive. We can help you reduce the total cost of ownership, conserve capital, and accelerate growth. In more than 100 countries, our flexible payment solutions can help you acquire hardware, software, services and complementary third-party equipment in easy, predictable payments. Learn more.For more informationFor more information about the Cisco Nexus 9000 Series, please visit https:///go/nexus9000.。
RUCKUS ICX 交换机系列产品介绍说明书
State-of-the-art hospitality networks Transforming the guest experience with CommScope’s RUCKUS® ICX switchingHIGHLIGHTSUNIFIED NETWORK MANAGEMENTRUCKUS SmartZone offers a single pane of glass for deploying, managing and troubleshooting ICX switches, RUCKUS access points, and wireless controllers for simplified and unified end-to-end network management.ADVANCED POWER OVER ETHERNET (POE)Power next-generation PoE devices with PoE, PoE+ and the upcoming 802.3bt standard delivering up to90 watts per port for next-generation wireless APs and security cameras. Get a PoE budget of up to1,500 watts with two power supplies. Even entry-level switches deliver a 370-watt PoE budget.MULTIGIGABIT ETHERNET TECHNOLOGYSelect ICX switch models support IEEE 802.3bz standard based Multigigabit Ethernet optimized for next-generation 802.11ac Wave 2 and future wireless AP deployment, increasing performance while reducing cost and protecting investment for years to come.ADVANCED STACKINGTo simplify deployment and management, ICX switches can be stacked over long distances up to10 kilometers using standard Ethernet optics, and offer superior scalability of up to 12 switches per stack. An entire hotel network can be managed as a single switch!OPTIMIZED FOR HOSPITALITY USE CASESICX switches offer purpose-built features for hospitality like protected ports designed to protect the privacy and safety of guests while ensuring access to key network services and entertainment products.SILENT OPERATIONFor non-disruptive deployment in a work area, like under the front desk or in a guest area, ICX switches offer a fanless design or a silent mode setting option. The 12-port model comes in a small, unobtrusive form factor that can be deployed anywhere.INDUSTRY-LEADING PRICE/PERFORMANCEICX entry-level access switches offer unprecedented capabilities. ICX high-performance stackable aggregation and core switches deliver more for less.T oday’s hotel guests are more tech savvy than ever and expect flawless high-speed internet connectivity for their smart devices everywhere. In this new world, the hotel wired network infrastructure has become the critical underlay supporting ultimate guest Wi-Fi experience.The guest Wi-Fi experience has the biggest impact on whether a hotel guest will rebook with a hotel. Today’s hotel guests are bringing more devices into the hotel room and are using more bandwidth-intensive applications, including over-the-top video, video conferencing, gaming and many other applications. To provide a great user experience, the hotel guest network must be high performing and able to meet the high expectations of hotel guests.However, the guest wireless network is only as good as its weakest link. Simply deploying the best wireless technology is not enough to provide a great user experience. The switches that power the wireless network and their ability to route the wireless traffic efficiently is just as important. These switches must be able to support not only wireless traffic but also high-def TV streams, video on demand, guest room VoIP phones, along with hotel administrative services such as staff phones, front desk stations and point-of-sale systems. This requires a high-performing switching infrastructure that can deliver enough PoE power and switching capacity as well as all the other key features required to deploy a modern hospitality network.COMMSCOPE’S RUCKUS ICX™ SWITCHES ARE OPTIMIZED FOR HOSPITALITYThere is a reason 70 percent of the hospitality market and 86 percent of the world’s luxury properties rely on RUCKUS technology from CommScope. Support for hospitality networks and Wi-Fi connectivity is a key design element of CommScope’s RUCKUS ICX™switch family. RUCKUS ICX switches are easy to deploy, provide higher speeds and support more connections than competitive products. Additionally, RUCKUS ICX switches offer must-have features critical for hospitality networks, including:·Advanced power over Ethernet (PoE)·Multigigabit Ethernet technology·Advanced stacking capabilities·Optimized for key hospitality use cases and applications·Silent operationADVANCED POE CAPABILITIESRUCKUS ICX switches feature industry-leading PoE budgetsas well as the upcoming 802.3bt standard (up to 90 wattscurrent and future generations of wireless access points (APs).more power to deliver higher speeds and support moreFurthermore, surveillance cameras, video displays and otherpower to run directly off the network ports. This increases thepower delivery infrastructure.RUCKUS ICX switches with power over Ethernet offer PoEPoE+ (802.3at; 30 watts) sufficient to drive wireless accesscameras, lighting and other devices. Each switch family offersmost densely populated environments, with PoE to all portspower supply, and drives PoE+ (30 watts) to all ports with dualSome ICX switches, like the ICX 7150-48ZP and ICX 7650-48ZP models, take PoE to the next level with support for the 802.3bt standard (pending ratification) delivering up to 90 wattsper port to support power-hungry PoE devices such as next-generation wireless access points, large video displays, pan/tilt/ zoom surveillance cameras and other devices.Learn more about PoE support and design with CommScope’s PoE Implementation Guide.EASE OF DEPLOYMENTAdvanced stackingICX multi-purpose switches can be deployed standalone or stacked to scale out in a single wiring closet or long-distance stacking. Unlike traditional stackable switches, RUCKUS ICX switches do not rely on proprietary stacking ports and stacking cables. Stacking is supported over standard 10 Gbps SFP+,40 Gbps QSFP+ or 100 Gbps QSFP28 Ethernet ports. The same ports can be configured for stacking or to forward uplink traffic. This provides a level of flexibility unavailable on other stackable switches.RUCKUS ICX switches can be stacked for superior scalabilityup to 12 switches per stack. This provides 50 percent more ports per stack than traditional stackable switches. In addition, there are no hardware modules required for stacking. Many traditional stackable switches require the purchase of additional hardware stacking modules to be able to stack, increasing overall costs. All RUCKUS ICX switches come with the hardware necessary for stacking since they use standard stacking ports.Long-distance stacking enables stacking between closetsor across multiple floors. This helps to dramatically reduce management touchpoints. The ICX switches can be deployed in homogeneous stacks using local or long-distance links of up to 10 km for maximum flexibility.RUCKUS stacking technology delivers high availability, performing real-time state synchronization across the stack and enabling instantaneous hitless failover to a standby controller in the unlikely event of a failure of the master stack controller. Users can use hot insertion/removal of stack members to avoid interrupting service when adding a switch to increase the capacity of a stack or replacing a switch that needs servicing.RUCKUS campus fabricA fabric design will deliver higher scalability and increased network visibility while reducing network operations costs. CommScope’s RUCKUS campus Fabric is highly reliable, based on a centralized controller switch, with redundant load balancing links, that shares network services and capabilities with other switches in the fabric network. Switches thatare deployed anywhere in the network by hotel IT staff are automatically provisioned with zero-touch deployment. Witha single point of management, troubleshooting and adding capacity are much easier, and uptime is improved.Silent operationThe RUCKUS ICX 7150 can operate silently through eithera fanless design or a “silent mode” configuration option depending on the model. The silent mode capability enables the PoE switches to operate with the fan disabled while providing a PoE budget of up to 150 watts for the 24-port model and the 48-port model. This RUCKUS-exclusive feature enables users to deploy the RUCKUS ICX 7150 switches outside of the wiring closet without disrupting the environment.This capability is critical for certain areas of the propertysuch as a conference room, the front desk, or admin area, where networking equipment needs to be deployed into an environment with minimal disruptions.EASE OF MANAGEMENTSwitch management and controlRUCKUS ICX switches provide simplified, standards-based management capabilities that help users reduce administrative time and effort while securing their networks.RUCKUS ICX switches support zero-touch provisioning to simplify deployment and deliver a plug-and-play experience. Users can use this feature to automate imaging and IP addressing as well as feature configuration of the ICX switches without requiring a highly trained network engineer onsite. When the switches power up, they automatically receivean IP address and configuration from DHCP and Trivial File Transport Protocol (TFTP) servers. Subsequently, the switches automatically receive a software update to be at the same code version as currently installed switches to maintain consistency across the network.All RUCKUS ICX 7000 series switches can also be auto-provisioned from USB storage. Provisioning a switch can be as simple as plugging in a USB key containing the proper software image and configuration files and re-booting the switch.This greatly simplifies the deployment or unit replacement of switches by untrained personnel.Unified wired and wireless network managementRUCKUS SmartZone represents a new class of scalable and versatile unified network managers designed to deploy and manage networks where wired and wireless LANs are equally critical components complementing each other to deliver seamless network access.A unified wired and wireless network infrastructure starts at the network layer but is not complete until management, security, monitoring and troubleshooting are all seamlessly integrated. Only then can customers realize the full benefits and ROI of their unified infrastructure investment.SmartZone delivers a single console that handles all common network tasks for wired and wireless LAN management. This includes planning, discovery, provisioning, configuration, monitoring, performance management, security, logging and reporting. The SmartZone console also supports functions unique to wired and wireless management, including connection reliability, spectrum management and monitoring, location, and tracking functionality, as well as security and access management.FUTURE-READYMultigigabit Ethernet technologySupport for wireless networking is at the core of the ICX family design. RUCKUS ICX 7150-48ZP switches are designed to handle next-generation 802.11ac Wave 2 and future 802.11ax wireless access points. These ICX switches offer2.5 GbE (803.2bz) ports to connect multigigabit APs and increase the data speeds. This new technology delivers two and a half times the bandwidth of regular Gigabit Ethernet on the same standard Category 5e cables, reducing the total number for links needed between switches and APs and optimizing wireless performance and scalability.On the wired side of the network, CommScope has you covered too, with a variety of Category 5e, 6 and 6A structured cabling solutions.Purposely designed to be upgradableICX switches are purposely designed to be easily upgradeable so customers can buy what they need today and upgrade later as their business requirements evolve. One example of ICX purpose-built upgradability is the ports-on-demand capability, which enables customers to upgrade uplink port speed from 1G to 10G using a software key, with no need to rip and replace even on entry-level switches. Also, all ICX switches can be deployed as standalone switches today and can be redeployed later in a stackable configuration or in a campus fabric configuration at no additional cost as the business evolves and the network needs to be reconfigured to scale accordingly. The same goes for advanced L3 capabilities that can be added to all ICX switches with a license.ONE NETWORK FOR ALL CONVERGED SERVICES, POWERED BY COMMSCOPE CommScope’s industry-leading network technology blends RUCKUS ICX switches and RUCKUS high-performance access points to enable hoteliers to deploy a single and reliable network infrastructure to concurrently support all essential hospitality business applications, including:·Tiered high-speed internet access (HSIA)·Streaming TV/video on demand (VOD) (multicast)·Voice over IP (VoIP)·Point-of-sales terminal (including PCI DSS compliance)·Back-office and service-optimization services ·Digital signage and kiosks·Security cameras·In-room IP-enabled devicesVisit our website or contact your local CommScope representative for more information.© 2020 CommScope, Inc. All rights reserved.Unless otherwise noted, all trademarks identified by ® or ™ are registered trademarks or trademarks, respectively, of CommScope, Inc. This document is for planning purposes only and is not intended to modify or supplement any specifications or warranties relating to CommScope products or services. CommScope is committed to the highest standards of business integrity and environmentalsustainability, with a number of CommScope’s facilities across the globe certified in accordance with international standards, including ISO 9001, TL 9000, and ISO 14001. Further information regarding CommScope’s commitment can be found at /About-Us/mScope pushes the boundaries of communications technology with game-changing ideas and ground-breaking discoveries that spark profound human achievement. We collaborate with our customers and partners to design, create and build the world’s most advanced networks. It is our passion andcommitment to identify the next opportunity and realize a better tomorrow. Discover more at RUCKUS SOLUTIONS ARE PART OF COMMSCOPE’S COMPREHENSIVE PORTFOLIO FOR ENTERPRISEENVIRONMENTS (INDOOR AND OUTDOOR).We encourage you to visit to learn more about:·RUCKUS Wi-Fi access points ·RUCKUS ICX switches·RUCKUS cloud management software·SYSTIMAX ®and NETCONNECT: Structured cabling solutions(copper and fiber)·imVision ®: automated infrastructure management ·Era and OneCell: In-building cellular solutions·Our extensive experience about supporting PoE and IoT。
南星S9接收机【OPENBOX,KD,PVR,3612(S9),接收机的录像功能与DIY】
南星S9接收机OPENBOX,KD,PVR,3612(S9),接收机的录像功能与DIY】如今讲到OPENBOX KD PVR 3612接收机，大家并不生疏了，该机如今已改名为OPENBOX KD PVR s9接收机，软件也在不断更新，如今接受了的F1旗舰版本的软件，比老版本改良很多，例如解决了硬盘NTFS与FT32格式化两种可选，可任意删除录像存贮的某个节目的文件夹，可写入9个CCCm等；本刊在20XX年第19期中，笔者介绍了该机的常规技术性能与使用方法，时隔3月，在实际使用中对该机的有用性与廉价的性价比还是情有独钟，该机工作稳定，功能有用，接口齐全，打开面板小门，可看到有2个卡槽，下面个为模块，上面一个为智能卡，也就是讲该机支持多种加密方式的收看，只需配上相对应的模块与智能卡，参见图。
尤其是该机的录，放像功能与节目编辑功能，设计特别到位，在卫星设置方面支持16切1，这在接收机中也不多见，切换速度也很快，接收门限较低，再认真看看其生产工艺与用料，在低价位的接收机中，该机的用料还是不错的，如最易发生故障的电源板中，选用了优质的电解电容，沟通整流滤波电解电容选用了33uf450V，通常为22uf400V，几路直流输出滤波电解电容选用了金字电解电容，开关变压器质量也很好，电源板设计功率余量较大，这给提供移动硬盘用作电源制造了条件，主板上元器性的焊接工艺糈良，在发热较高的CPU及13／18V电源稳压集成块317上均加装了散热片，加上机壳合理的散热孔使机内温升不大；与主板连接的每个插件均打有翔胶，且很牢固，从而保证了运输中的防震与紧偶合，如需拔下插头跗，应先用刀将封胶割除才能拔下；该机机壳与面板均贴有爱护膜，将面板上爱护膜撕去，可看到其面板是单独贴上去的，面板经过镀膜处理，光滑度特别高，如镜面般可照出人影，参见图二。
该机录像功能还是很强的，该机除了可预设八个不同时段的节目定时录像外，可以对己录像保存的节目进行加锁与删除，也可以对己录像保存的节目进行重命名，目前该机只支持用英文命名，使用遥控器上的数字键就可轻松完成，也可退格等；该机也支持用“U〞盘或移动硬盘来播放音乐与图片，还可设定图片用幻灯片模式播放，可设定图片间隔时间，可选择设定从1秒到9秒与关闭，还可设定图片大小，可选择“全屏〞或者“原始〞。
SCI 多极器件 LLC Zener 二极管说明书
MMBZxxxALT1G Series, SZMMBZxxxALT1G Series Zener Diodes, 24 and40 Watt Peak PowerSOT−23 Dual Common Anode ZenersThese dual monolithic silicon Zener diodes are designed for applications requiring transient overvoltage protection capability. They are intended for use in voltage and ESD sensitive equipment such as computers, printers, business machines, communication systems, medical equipment and other applications. Their dual junction commonanode design protects two separate lines using only one package. These devices are ideal for situations where board space is at a premium. Features•SOT−23 Package Allows Either Two Separate Unidirectional Configurations or a Single Bidirectional Configuration •Standard Zener Breakdown V oltage Range − 5.6 V to 47 V •PeakPower−*************(Unidirectional),per Figure 6 Waveform•ESD Rating:− Class 3B (> 16 kV) per the Human Body Model− Class C (> 400 V) per the Machine Model•ESD Rating of IEC61000−4−2 Level 4, ±30 kV Contact Discharge •Maximum Clamping V oltage @ Peak Pulse Current•Low Leakage < 5.0 m A•Flammability Rating UL 94 V−0•SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable•These Devices are Pb−Free and are RoHS CompliantMechanical CharacteristicsCASE:V oid-free, transfer-molded, thermosetting plastic case FINISH:Corrosion resistant finish, easily solderableMAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 SecondsPackage designed for optimal automated board assemblySmall package size for high density applicationsAvailable in 8 mm Tape and ReelUse the Device Number to order the 7 inch/3,000 unit reel.Replace the “T1” with “T3” in the Device Number to order the13 inch/10,000 unit reel.SOT−23CASE 318STYLE 12CATHODE 13 ANODE CATHODE 2MARKING DIAGRAMSee specific marking information in the device marking column of the table on page 3 of this data sheet.DEVICE MARKING INFORMATIONSee detailed ordering and shipping information on page 2 of this data sheet.ORDERING INFORMATION1XXXM GGXXX= Specific Device CodeM= Date CodeG= Pb−Free Package(Note: Microdot may be in either location)MAXIMUM RATINGSRating Symbol Value Unit**************************(Note1)MMBZ5V6ALT1G thru MMBZ9V1ALT1G @ T L≤ 25°C MMBZ12VALT1G thru MMBZ47VALT1G P pk2440WTotal Power Dissipation on FR−5 Board (Note 2) @ T A = 25°CDerate above 25°C P D2251.8mWmW/°CThermal Resistance Junction−to−Ambient R q JA556°C/WTotal Power Dissipation on Alumina Substrate (Note 3) @ T A = 25°CDerate above 25°C P D3002.4mWmW/°CThermal Resistance Junction−to−Ambient R q JA417°C/W Junction and Storage Temperature Range T J, T stg−55 to +150°CLead Solder Temperature − Maximum (10 Second Duration)T L260°C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.1.Non−repetitive current pulse per Figure 6 and derate above T A = 25°C per Figure 7.2.FR−5 = 1.0 x 0.75 x 0.62 in.3.Alumina = 0.4 x 0.3 x 0.024 in, 99.5% alumina.*Other voltages may be available upon request.ORDERING INFORMATIONDevice Package Shipping†MMBZ5V6ALT1G SOT−23(Pb−Free)3,000 / Tape & ReelSZMMBZ5V6ALT1G*SOT−23(Pb−Free)3,000 / Tape & ReelMMBZ5V6ALT3G SOT−23(Pb−Free)10,000 / Tape & ReelMMBZ6VxALT1G SOT−23(Pb−Free)3,000 / Tape & ReelSZMMBZ6VxALT1G*SOT−23(Pb−Free)3,000 / Tape & ReelMMBZ6VxALT3G SOT−23(Pb−Free)10,000 / Tape & ReelMMBZ9V1ALT1G SOT−23(Pb−Free)3,000 / Tape & ReelMMBZ9V1ALT13G SOT−23(Pb−Free)10,000 / Tape & ReelMMBZxxVALT1G SOT−23(Pb−Free)3,000 / Tape & ReelSZMMBZxxVALT1G*SOT−23(Pb−Free)3,000 / Tape & ReelMMBZxxVALT3G SOT−23(Pb−Free)10,000 / Tape & ReelSZMMBZxxVALT3G*SOT−23(Pb−Free)10,000 / Tape & ReelSZMMBZxxVTALT1G*SOT−23(Pb−Free)3,000 / Tape & Reel†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.*SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP CapableELECTRICAL CHARACTERISTICS(T A = 25°C unless otherwise noted)UNIDIRECTIONAL (Circuit tied to Pins 1 and 3 or 2 and 3) Symbol ParameterI PP Maximum Reverse Peak Pulse CurrentV C Clamping Voltage @ I PPV RWM Working Peak Reverse VoltageI R Maximum Reverse Leakage Current @ VRWMV BR Breakdown Voltage @ I TI T Test CurrentQ V BR Maximum Temperature Coefficient of V BRI F Forward CurrentV F Forward Voltage @ I FZ ZT Maximum Zener Impedance @ I ZTI ZK Reverse CurrentZ ZK Maximum Zener Impedance @ I ZKELECTRICAL CHARACTERISTICS (T A = 25°C unless otherwise noted) UNIDIRECTIONAL (Circuit tied to Pins 1 and 3 or Pins 2 and 3)(V F = 0.9 V Max @ I F = 10 mA) (5% Tolerance)24 WATTSDevice*DeviceMarkingV RWMI R @V RWMBreakdown VoltageMax ZenerImpedance (Note 5)V C @ I PP(Note 6)Q V BRV BR(Note 4) (V)@ I TZ ZT@ I ZT Z ZK @ I ZK V C I PP Volts m A Min Nom Max mA W W mA V A mV/5CMMBZ5V6ALT1G/T3G5A6 3.0 5.0 5.32 5.6 5.88201116000.258.0 3.0 1.26 MMBZ6V2ALT1G6A2 3.00.5 5.89 6.2 6.51 1.0−−−8.7 2.76 2.80 MMBZ6V8ALT1G6A8 4.50.5 6.46 6.87.14 1.0−−−9.6 2.5 3.4 MMBZ9V1ALT1G9A1 6.00.38.659.19.56 1.0−−−14 1.77.5 (V F = 0.9 V Max @ I F = 10 mA) (5% Tolerance)40 WATTSDevice*DeviceMarkingV RWMI R @V RWMBreakdown Voltage V C @ I PP (Note 6)Q V BRV BR(Note 4) (V)@ I T V C I PPVolts nA Min Nom Max mA V A mV/5CMMBZ12VALT1G12A8.520011.401212.60 1.017 2.357.5 MMBZ15VALT1G15A125014.251515.75 1.021 1.912.3 MMBZ16VALT1G16A135015.201616.80 1.023 1.713.8 MMBZ18VALT1G18A14.55017.101818.90 1.025 1.615.3 MMBZ20VALT1G20A175019.002021.00 1.028 1.417.2 MMBZ27VALT1G/T3G27A225025.652728.35 1.040 1.024.3 MMBZ33VALT1G33A265031.353334.65 1.0460.8730.4 MMBZ47VALT1G47A385044.654749.35 1.0540.7443.1 (V F = 0.9 V Max @ I F = 10 mA) (2% Tolerance)40 WATTSDevice*DeviceMarkingV RWMI R @V RWMBreakdown Voltage V C @ I PP (Note 6)Q V BRV BR(Note 4) (V)@ I T V C I PPVolts nA Min Nom Max mA V A mV/5CMMBZ16VTALT1G16T135015.681616.32 1.023 1.713.8 MMBZ47VTALT1G47T385046.064747.94 1.0540.7443.1 Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.4.V BR measured at pulse test current I T at an ambient temperature of 25°C.5.Z ZT and Z ZK are measured by dividing the AC voltage drop across the device by the AC current applied. The specified limits are for I Z(AC)= 0.1 I Z(DC), with the AC frequency = 1.0 kHz.6.Surge current waveform per Figure 6 and derate per Figure 7*Include SZ-prefix devices where applicable.−40+5018Figure 1. Typical Breakdown Voltageversus Temperature(Upper curve for each voltage is bidirectional mode,lower curve is unidirectional mode)TEMPERATURE (°C)+100+15015129630−40+251000Figure 2. Typical Leakage Currentversus TemperatureTEMPERATURE (°C)+85+1251001010.10.01B R E A K D O W N V O L T A G E (V O L T S )(V B R @ I T )I R (n A )Figure 3. Typical Capacitance versus Bias Voltage(Upper curve for each voltage is unidirectional mode,lower curve is bidirectional mode)300250200150100500Figure 4. Typical Capacitance versus Bias Voltage(Upper curve for each voltage is unidirectional mode,lower curve is bidirectional mode)TEMPERATURE (°C)320280240160120400C , C A P A C I T A N C E (p F )BIAS (V)20080P D , P O W E R D I S S I PA T I O N (m W )Figure 5. Steady State Power Derating Curve604030100C , C A P A C I T A N C E (p F )BIAS (V)502010100Power is defined as V RSM x I Z (pk) where V RSM is the clamping voltage at I Z (pk).PW, PULSE WIDTH (ms)Figure 6. Pulse Waveform t, TIME (ms)Figure 7. Pulse Derating Curve10090807060504030201000255075100125150175200T A , AMBIENT TEMPERATURE (°C)Figure 8. Maximum Non−repetitive SurgePower, P pk versus PWFigure 9. Maximum Non−repetitive SurgePower, P pk (NOM) versus PW10PW, PULSE WIDTH (ms)Power is defined as V Z (NOM) x I Z (pk) whereV Z (NOM) is the nominal Zener voltage measured at the low test current used for voltage classification.P E A K P U L S E D E R A T I N G I N % O F P E A K P O W E R O R C U R R E N T @ T A = 25°CP p k , P E A K S U R G E P O W E R (W )P p k , P E A K S U R G E P O W E R (W )TYPICAL COMMON ANODE APPLICATIONSA dual junction common anode design in a SOT−23package protects two separate lines using only one package.This adds flexibility and creativity to PCB design especiallywhen board space is at a premium. Two simplified examples of ESD applications are illustrated below.MMBZ5V6ALT1GTHRUMMBZ47VALT1GKEYBOARD TERMINAL PRINTERETC.MMBZ5V6ALT1GTHRUMMBZ47VALT1GComputer Interface ProtectionMicroprocessor ProtectionGNDV GGV DDPACKAGE DIMENSIONSSOT−23 (TO−236)CASE 318−08ISSUE ASNOTES:1.DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.2.CONTROLLING DIMENSION: MILLIMETERS.3.MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF THE BASE MATERIAL.4.DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,PROTRUSIONS, OR GATE BURRS.SOLDERING FOOTPRINT*VIEW CDIM A MIN NOM MAX MINMILLIMETERS0.89 1.00 1.110.035INCHES A10.010.060.100.000b 0.370.440.500.015c 0.080.140.200.003D 2.80 2.90 3.040.110E 1.20 1.30 1.400.047e 1.78 1.90 2.040.070L 0.300.430.550.0120.0390.0440.0020.0040.0170.0200.0060.0080.1140.1200.0510.0550.0750.0800.0170.022NOM MAX L1 2.10 2.40 2.640.0830.0940.104H E 0.350.540.690.0140.0210.027c0−−−100−−−10T°°°°TOP VIEWEND VIEWDIMENSIONS: MILLIMETERS3X3XRECOMMENDED*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.STYLE 12:PIN 1.CATHODE2.CATHODE3.ANODEON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage PUBLICATION ORDERING INFORMATION。
Christie NAS-S2 用户手册说明书
用户手册
020-101657-01
Christie NAS-S2
用户手册
020-101657-01
声明
版权和商标
版权所有 ©2014 Christie Digital Systems USA Inc. 保留所有权利。
所有品牌名称和产品名称均为其各自所有者的商标、注册商标或商号名称。
或损坏。 e. 因使用从未经授权的科视灯泡、替换部件或组件分销商处购买或获得的任何灯泡、替换部件或组件而引发的问题或造成的损坏，包括
但不限于通过 internet 提供科视灯泡、替换部件或组件的任何分销商 （可向科视确认有哪些经授权的分销商）。 f. 因使用不当、电源不匹配、意外事故、火灾、洪水、闪电、地震或其他自然灾害而引发的问题或造成的损坏。 g.因安装 / 校正不当而引发的问题或造成的损坏，以及由非科视维修人员或非科视授权维修服务供应商进行的设备改装所引发的问题或
天、每天 8 小时。 k. 因在户外使用产品而引发的问题或造成的损坏 （除非产品专用于户外用途），但以下情况除外：保护此类产品免于受到降雨或其他恶
劣天气或环境条件的影响并且室温位于规格中所设定的适合此类产品的推荐室温范围内。 l. LCD 平板上的影像滞留。 m.由正常磨损或产品正常老化造成的缺陷。 保修不适用于序列号已移除或擦除的任何产品。保修也不适用于由转销商出售给转销商所在国家 / 地区之外的最终用户的任何产品，但以 下情况除外：(i) 科视在最终用户所在的国家 / 地区拥有办事处或 (ii) 已支付所需的国际保修费用。
* This part uses metallic alloys, which may contain Lead. - 因该部件使用金属合金材料，故可能含有铅。
9G端口全千兆网管型以太网交换机
简介EDS-G509配备了9个千兆以太网端口，最大可以支持5个光纤端口，使它适合将现存的网络升级到千兆或者建立一套全千兆的骨干网络。
千兆传输能够增加带宽，达到更高的性能在网络上传输大量的视频、音频和数据。
以太网冗余协议，Turbo Ring和 RSTP\STP（IEEE 802.1W/D）可以增加您的骨干网络的可靠性。
EDS-G509特别为严苛的应用而设计的，例如视频和过程监视、造船、ITS和DCS系统，所有这些都可以受益于一套可升级的骨干网络。
- 支持Turbo Ring和RSTP/STP（IEEE 802.1w/D）- 支持IGMP snooping和GMRP，用于多播过滤- 基于端口VLAN，IEEE 802.1Q VLAN和GVRP，轻松实现网络规划- 支持QoS-IEEE 802.1p/1Q和TOS/DiffServ，增加网络确定性- 支持端口聚合，优化网络带宽- 支持IEEE 802.1X，HTTPS和SSH，增加网络安全性- 支持SNMPv1/v2/v3不同等级的网络管理协议- 支持RMON，有效监控网络- 支持带宽管理，预防不可预见性网络故障- 支持基于MAC地址的端口锁定，防止非法入侵- 支持端口镜像功能，便于在线调试- 通过e-mail和继电器输出自动报告意外事件- 通过IP网络轻松集成数字输入和传感器状态- 通过ABC-01自动备份器实现系统配置备份技术标准：IEEE 802.3适用于10BaseT,IEEE 802.3u适用于100BaseT(X) 和100Base FX,IEEE 802.3ab适用于1000Base(X),IEEE 802.3z适用于1000BaseSX/LX/LHX/ZX,IEEE 802.3x适用于流量控制,IEEE 802.1D适用于生成树协议,IEEE 802.1w适用于快速生成树协议,IEEE 802.1Q适用于VLAN Tagging,IEEE 802.1p适用于Class of Service,IEEE 802.1X适用于认证,IEEE 802.3ad适用于基于LACP的端口聚合协议：IGMPv1/v2 device，GMRP，GVRP，SNMPv1/v2c/v3，DHCP Server/Client，DHCP Option 82，BootP，TFTP，SNTP，SMTP，RARP，RMON，HTTP，HTTPS，Telnet，SSH，SyslogMIB：MIB-II，Ethernet-Like MIB，P-BRIDGE MIB，Q-BRIDGE MIB，Bridge MIB，RSTP MIB，RMON MIBGroup 1，2，3，9流量控制：IEEE 802.3x 流量控制，背板压流量控制交换属性优先级：4最多可用的VLAN数：64VLAN ID范围：VID 1到4094IGMP Groups：256接口RJ45端：10/100/1000BaseT(X)速率自侦测光口：100/1000BaseSFP插槽Console：RS-232 (RJ45)LED指示灯：PWR1，PWR2，FAULT，10/100M/1000M，MASTER，COUPLERDIP开关：Turbo Ring，Master，Coupler，Reserve报警触点：2个继电器输出，电流负载能力1A@ 24 VDC数字输入：2个共地输入点，电气隔离• 状态“1”：+13~+30V• 状态“0”：-30~+3V• 最大输入电流：8 mA电源需求输入电压：12/24/48 VDC (9.6~60 VDC)，24 V AC (18~30 V AC)，冗余双电源输入连接方式：两组6-pin端子排接线过流保护：有反接保护：有物理特性外壳：IP30等级保护，金属外壳尺寸(W x H x D)：80.2 x 135 x 105 mm(3.16 x 5.31 x 4.13 in.)安装方式：DIN-Rail导轨安装，壁挂安装(可选附件)环境参数工作温度：0 ~ 60 °C (32 ~ 140 °F)-40 ~ 75 °C (-40 ~ 167 °F) 适用于宽温模块存储温度：-40 ~ 85 °C (-40 ~ 185 °F)环境湿度：5 ~ 95% (无凝露)安规认证安全：UL508 (申请中)，EN60950-1 (申请中)危险区域：UL/cUL Class I，Division 2，Groups A，B，C和D (申请中); A TEX Zone 2，Ex nC IIC (申请中)海事：DNV (申请中)，GL (申请中)EMI：FCC Part 15，CISPR (EN55022) class AEMS：EN61000-4-2 (ESD)，level 3EN61000-4-3 (RS)，level 3EN61000-4-4 (EFT)，level 3EN61000-4-5 (Surge)，level 2EN61000-4-6 (CS)，level 3EN61000-4-8EN61000-4-11冲击：IEC 60068-2-27自由跌落：IEC 60068-2-32震动：IEC 60068-2-6*欲知产品认证最新动态，请登陆Moxa网站查询。