SN74HCT574PWT中文资料

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74HC75PW资料

74HC75PW资料

74HC75Quad bistable transparant latchRev. 03 — 12 November 2004Product data sheet1.General descriptionThe 74HC75 is a high-speed Si-gate CMOS device and is pin compatible with low powerSchottky TTL (LSTTL). The 74HC75 is specified in compliance with JEDECstandard no.7A.The 74HC75 has four bistable latches. The two latches are simultaneously controlled byone of two active HIGH enable inputs (LE12 and LE34). When LEnn is HIGH, the dataenters the latches and appears at the nQ outputs. The nQ outputs follow the data inputs(nD) as long as LEnn is HIGH (transparent). The data on the nD inputs one set-up timeprior to the HIGH-to-LOW transition of the LEnn will be stored in the latches. The latchedoutputs remain stable as long as the LEnn is LOW.2.Featuress Complementary Q and Q outputss V CC and GND on the center pinss Low-power dissipations Complies with JEDEC standard no.7As ESD protection:x HBM EIA/JESD22-A114-B exceeds 2000Vx MM EIA/JESD22-A115-A exceeds 200V.s Multiple package optionss Specified from−40°C to+80°C and from−40°C to+125°C.3.Quick reference data[1]C PD is used to determine the dynamic power dissipation (P D in µW).P D =C PD ×V CC 2×f i ×N +∑(C L ×V CC 2×f o )where:f i =input frequency in MHz;f o =output frequency in MHz;C L =output load capacitance in pF;V CC =supply voltage in V;N =number of inputs switching;∑(C L ×V CC 2×f o )= sum of outputs.4.Ordering informationTable 1:Quick reference data Symbol Parameter Conditions Min Typ Max Unitt PHL , t PLHpropagation delay C L =15pF;V CC =5VnD to nQ, nQ -11-ns LEnn to nQ, nQ-11-ns C I input capacitance - 3.5-pF C PDpower dissipation capacitance per latchV I =GND to V CC[1]-42-pFTable 2:Ordering informationType numberPackageTemperature rangeName DescriptionVersion 74HC75N −40°C to +125°C DIP16plastic dual in-line package; 16leads (300mil)SOT38-474HC75D −40°C to +125°C SO16plastic small outline package; 16leads;body width 3.9mmSOT109-174HC75DB −40°C to +125°C SSOP16plastic shrink small outline package; 16leads;body width 5.3mmSOT338-174HC75PW−40°C to +125°CTSSOP16plastic thin shrink small outline package;16leads; body width 4.4mmSOT403-15.Functional diagramFig 1.Functional diagram Fig 2.Logic symbol001aab853L1D CP16213Q1L2D CP153Q14L3D CP10641D LE122D3D LE34Q11L4D CP974DQ81Q 1Q2Q 2Q3Q 3Q4Q 4Q001aab8511D LE12L1,2L3,4LE341341Q 1Q 2Q 2Q 3Q 3Q 4Q 4Q2D3D 4D891110141511627636.Pinning information6.1PinningFig 3.IEC logic symbol Fig 4.Logic diagram001aab8524C171D986101113C121D16131514001aab854LATCH 1D CP 1Q 1D LE12Q 1QLATCH 2D CP 2Q 2D Q 2QLATCH 3D CP 3Q 3D LE34Q 3QLATCH 4D CP 4Q 4D Q 4QFig 5.Pin configuration751Q 1Q 1D 2Q 2D 2Q LE34LE12V CC GND 3D 3Q 4D 3Q 4Q4Q001aab850123456781091211141316156.2Pin descriptionTable 3:Pin descriptionSymbol Pin Description1Q1complementary latch output 11D2data input 12D3data input 2LE344latch enable input for latches 3 and 4 (active HIGH)V CC5positive supply voltage3D6data input 34D7data input 44Q8complementary latch output 44Q9latch output 43Q10latch output 33Q11complementary latch output 3GND12ground (0V)LE1213latch enable input for latches 1 and 2 (active HIGH)2Q14complementary latch output 22Q15latch output 21Q16latch output 17.Functional description7.1Function tableTable 4:Function table[1]Operating mode Input OutputLEnn nD nQ nQData enabled H L L HH H H LData latched L X q q[1]H=HIGH voltage level;L=LOW voltage level;q=lower case letters indicate the state of the referenced output one set-up time prior to the HIGH-to-LOWLEnn transition;X=don’t care.8.Limiting values[1]Above 70°C: P tot derates linearly with 12mW/K.[2]Above 70°C: P tot derates linearly with 8mW/K.9.Recommended operating conditionsTable 5:Limiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).Symbol Parameter ConditionsMin Max Unit V CC supply voltage −0.5+7V I IK input diode current V I <−0.5V or V I >V CC +0.5 V -±20mA I OK output diode current V O <−0.5V or V O >V CC +0.5V-±20mA I O output source or sink currentV O =−0.5V to V CC +0.5V-±25mA I CC , I GND V CC or GND current -±50mA T stg storage temperature −65+150°C P totpower dissipation DIP16 package [1]-750mW SO16, SSOP16 and TSSOP16 packages[2]-500mWTable 6:Recommended operating conditions Symbol Parameter ConditionsMin Typ Max Unit V CC supply voltage 2.0 5.0 6.0V V I input voltage 0-V CC V V O output voltage 0-V CC V t r , t finput rise and fall timesV CC = 2.0 V --1000ns V CC = 4.5 V - 6.0500ns V CC = 6.0 V--400ns T ambambient temperature−40-+125°C10.Static characteristicsTable 7:Static characteristicsAt recommended operating conditions; voltages are referenced to GND (ground=0V).Symbol Parameter Conditions Min Typ Max Unit T amb=25°CV IH HIGH-level input voltage V CC=2.0V 1.5 1.2-VV CC=4.5V 3.15 2.4-VV CC=6.0V 4.2 3.2-VV IL LOW-level input voltage V CC=2.0V-0.80.5VV CC=4.5V- 2.1 1.35VV CC=6.0V- 2.8 1.8VV OH HIGH-level output voltage V I=V IH or V ILI O=−20µA; V CC=2.0V 1.9 2.0-VI O=−20µA; V CC=4.5V 4.4 4.5-VI O=−20µA; V CC=6.0V 5.9 6.0-VI O=−4mA; V CC=4.5V 3.98 4.32-VI O=−5.2mA; V CC=6.0V 5.48 5.81-VV OL LOW-level output voltage V I=V IH or V ILI O=20µA; V CC=2.0V-00.1VI O=20µA; V CC=4.5V-00.1VI O=20µA; V CC=6.0V-00.1VI O=4mA; V CC=4.5V-0.150.26VI O=5.2mA; V CC=6.0V-0.160.26VI LI input leakage current V I=V CC or GND; V CC=6.0V--±0.1µA--8.0µA I CC quiescent supply current V I=V CC or GND; I O=0A;V CC=6.0VC I input capacitance- 3.5-pF T amb=−40°C to +85°CV IH HIGH-level input voltage V CC=2.0V 1.5--VV CC=4.5V 3.15--VV CC=6.0V 4.2--VV IL LOW-level input voltage V CC=2.0V--0.5VV CC=4.5V-- 1.35VV CC=6.0V-- 1.8VV OH HIGH-level output voltage V I=V IH or V ILI O=−20µA; V CC=2.0V 1.9--VI O=−20µA; V CC=4.5V 4.4--VI O=−20µA; V CC=6.0V 5.9--VI O=−4mA; V CC=4.5V 3.84--VI O=−5.2mA; V CC=6.0V 5.34--VV OL LOW-level output voltage V I=V IH or V ILI O=20µA; V CC=2.0V--0.1VI O=20µA; V CC=4.5V--0.1VI O=20µA; V CC=6.0V--0.1VI O=4mA; V CC=4.5V--0.33VI O=5.2mA; V CC=6.0V--0.33V I LI input leakage current V I=V CC or GND; V CC=6.0V--±1.0µA I CC quiescent supply current V I=V CC or GND; I O=0A;V CC=6.0V--80µA T amb=−40°C to +125°CV IH HIGH-level input voltage V CC=2.0V 1.5--VV CC=4.5V 3.15--VV CC=6.0V 4.2--V V IL LOW-level input voltage V CC=2.0V--0.5VV CC=4.5V-- 1.35VV CC=6.0V-- 1.8V V OH HIGH-level output voltage V I=V IH or V IL-I O=−20µA; V CC=2.0V 1.9--VI O=−20µA; V CC=4.5V 4.4--VI O=−20µA; V CC=6.0V 5.9--VI O=−4mA; V CC=4.5V 3.7--VI O=−5.2mA; V CC=6.0V 5.2--V V OL LOW-level output voltage V I=V IH or V IL-I O=20µA; V CC=2.0V--0.1VI O=20µA; V CC=4.5V--0.1VI O=20µA; V CC=6.0V--0.1VI O=4mA; V CC=4.5V--0.4VI O=5.2mA; V CC=6.0V--0.4V I LI input leakage current V I=V CC or GND; V CC=6.0V--±1.0µAI CC quiescent supply current V I=V CC or GND; I O=0A;V CC=6.0V --160µATable 7:Static characteristics …continuedAt recommended operating conditions; voltages are referenced to GND (ground=0V).Symbol Parameter Conditions Min Typ Max Unit11.Dynamic characteristicsTable 8:Dynamic characteristicsGND=0 V; t r=t f=6 ns; C L=50 pF; unless otherwise specified, see Figure10.Symbol Parameter Conditions Min Typ Max Unit T amb = 25°Ct PHL, t PLH propagation delaynD to nQ see Figure6V CC = 2.0 V-33110ns V CC = 4.5 V-1222ns V CC = 6.0 V-1019ns V CC=5.0V; C L=15pF-11-nspropagation delay nD to nQ see Figure7V CC = 2.0 V-39120ns V CC = 4.5 V-1424ns V CC = 6.0 V-1120ns V CC=5.0V; C L=15pF-11-nspropagation delay LEnn to nQ see Figure9V CC = 2.0 V-33120ns V CC = 4.5 V-1224ns V CC = 6.0 V-1020ns V CC=5.0V; C L=15pF-11-nspropagation delay LEnn to nQ see Figure9V CC = 2.0 V-39125ns V CC = 4.5 V-1425ns V CC = 6.0 V-1121ns V CC=5.0V; C L=15pF-11-nst THL, t TLH output transition time see Figure6 and7V CC = 2.0 V-1975nsV CC = 4.5 V-715nsV CC = 6.0 V-613nst W enable pulse widthHIGH see Figure9V CC = 2.0 V8017-ns V CC = 4.5 V166-ns V CC = 6.0 V145-nst su set-up time nD toLEnn see Figure8V CC = 2.0 V6014-ns V CC = 4.5 V125-ns V CC = 6.0 V104-nst h hold time nD to LEnn see Figure8V CC = 2.0 V3−8-nsV CC = 4.5 V3−3-nsV CC = 6.0 V3−2-nsC PDpower dissipation capacitance per latch V I =GND to V CC[1]-42-pFT amb =−40°C to +85°C t PHL , t PLHpropagation delay nD to nQsee Figure 6V CC = 2.0 V --140ns V CC = 4.5 V --28ns V CC = 6.0 V--24nspropagation delay nD to nQsee Figure 7V CC = 2.0 V --150ns V CC = 4.5 V --30ns V CC = 6.0 V--26nspropagation delay LEnn to nQsee Figure 9V CC = 2.0 V --150ns V CC = 4.5 V --30ns V CC = 6.0 V--26nspropagation delay LEnn to nQsee Figure 9V CC = 2.0 V --155ns V CC = 4.5 V --31ns V CC = 6.0 V--26nst THL , t TLHoutput transition timesee Figure 6 and 7V CC = 2.0 V --95ns V CC = 4.5 V --19ns V CC = 6.0 V--16nst Wenable pulse width HIGHsee Figure 9V CC = 2.0 V 100--ns V CC = 4.5 V 20--ns V CC = 6.0 V17--nst suset-up time nD to LEnnsee Figure 8V CC = 2.0 V 75--ns V CC = 4.5 V 15--ns V CC = 6.0 V13--nst hhold time nD to LEnnsee Figure 8V CC = 2.0 V 3--ns V CC = 4.5 V 3--ns V CC = 6.0 V3--nsTable 8:Dynamic characteristics …continuedGND =0 V; t r =t f =6 ns; C L =50 pF; unless otherwise specified, see Figure 10.Symbol ParameterConditions Min Typ Max Unit[1]C PD is used to determine the dynamic power dissipation (P D in µW).P D =C PD ×V CC 2×f i ×N +∑(C L ×V CC 2×f o )where:f i =input frequency in MHz;f o =output frequency in MHz;C L =output load capacitance in pF;V CC =supply voltage in V;N =number of inputs switching;∑(C L ×V CC 2×f o )= sum of outputs.T amb =−40°C to +125°Ct PHL , t PLHpropagation delay nD to nQsee Figure 6V CC = 2.0 V --165ns V CC = 4.5 V --33ns V CC = 6.0 V--28ns propagation delay nD to nQsee Figure 7V CC = 2.0 V --180ns V CC = 4.5 V --36ns V CC = 6.0 V--31ns propagation delay LEnn to nQsee Figure 9V CC = 2.0 V --180ns V CC = 4.5 V --36ns V CC = 6.0 V--31ns propagation delay LEnn to nQsee Figure 9V CC = 2.0 V --190ns V CC = 4.5 V --38ns V CC = 6.0 V--32ns t THL , t TLHoutput transition timesee Figure 6 and 7V CC = 2.0 V --110ns V CC = 4.5 V --22ns V CC = 6.0 V--19ns t Wenable pulse width HIGHsee Figure 9V CC = 2.0 V 120--ns V CC = 4.5 V 24--ns V CC = 6.0 V20--ns t suset-up time nD to LEnnsee Figure 8V CC = 2.0 V 90--ns V CC = 4.5 V 18--ns V CC = 6.0 V15--ns t hhold time nD to LEnnsee Figure 8V CC = 2.0 V 3--ns V CC = 4.5 V 3--ns V CC = 6.0 V3--nsTable 8:Dynamic characteristics …continuedGND =0 V; t r =t f =6 ns; C L =50 pF; unless otherwise specified, see Figure 10.Symbol Parameter Conditions Min Typ Max Unit12.WaveformsV M = 0.5×V I .Fig 6.Waveforms showing the data input (nD)to output (nQ)propagation delays and theoutput transition timesV M = 0.5×V I .Fig 7.Waveforms showing the data input (nD)to output (nQ)propagation delays and theoutput transition timesThe shaded areas indicate when the input is permitted to change for predictable output performance.V M = 0.5×V I .Fig 8.Waveforms showing the data set-up and hold times for nD input to LEnn input001aab855nD inputnQ outputV Mt PHLt THL t TLHt PLHV M001aab856nD inputnQ outputV Mt PHLt THL t TLHt PLHV Mt sut h nQ output LEnn inputV MV M001aab858t sut hnD inputQ = D Q = DV M = 0.5×V I .Fig 9.Waveforms showing the latch enable input (LEnn) pulse width, the latch enableinput to outputs (nQ, nQ) propagation delays and the output transition timesTest data is given in T able 9.Definitions for test circuit:R T = Termination resistance should be equal to output impedance Z o of the pulse generator.C L = Load capacitance including jig and probe capacitance.Fig 10.Load circuitry for switching times Table 9:Test dataSupply Input Load V CC V I t r , t f C L 2.0 V V CC 6 ns 50 pF 4.5 V V CC 6 ns 50 pF 6.0 V V CC 6 ns 50 pF 5.0 VV CC6 ns15 pFnD inputLEnn inputnQ outputnQ outputt W V M V MV M 001aab857t PHLt PLHt THLt TLH t THLt PLHt PHLt TLHmna101V CCV IV OR TC LPULSE GENERATORD.U.T.13.Package outlineFig 11.Package outline SOT38-4 (DIP16)REFERENCESOUTLINE VERSION EUROPEAN PROJECTIONISSUE DATE IECJEDECJEITASOT38-495-01-1403-02-13M Hc(e )1M EALs e a t i n g p l a n eA 1w Mb 1b 2eDA 2Z16198Epin 1 indexb0510 mmscaleNote1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.UNIT Amax.12b 1(1)(1)(1)b 2c D E e M Z H L mm DIMENSIONS (inch dimensions are derived from the original mm dimensions)A min. A max.b max.w M E e 11.731.300.530.380.360.2319.5018.55 6.486.20 3.603.050.2542.547.628.257.8010.08.30.764.20.51 3.2inches0.0680.0510.0210.0150.0140.0091.250.850.0490.0330.770.730.260.240.140.120.010.10.30.320.310.390.330.030.170.020.13DIP16: plastic dual in-line package; 16 leads (300 mil)SOT38-4Fig 12.Package outline SOT109-1 (SO16)Xw MθAA 1A 2b pD H EL pQdetail XE Z ecL v M A(A )3A89116ypin 1 indexUNIT Amax.A 1A 2A 3b p c D (1)E (1)(1)e H E L L p Q Z y w v θREFERENCESOUTLINE VERSION EUROPEAN PROJECTIONISSUE DATE IEC JEDEC JEITAmm inches1.750.250.101.451.250.250.490.360.250.1910.09.84.03.8 1.27 6.25.80.70.60.70.380oo 0.250.1DIMENSIONS (inch dimensions are derived from the original mm dimensions)Note1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.1.00.4 SOT109-199-12-2703-02-19076E07MS-0120.0690.0100.0040.0570.0490.010.0190.0140.01000.00750.390.380.160.150.051.050.0410.2440.2280.0280.0200.0280.0120.010.250.010.0040.0390.0160 2.5 5 mmscaleSO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1Fig 13.Package outline SOT338-1 (SSOP16)UNIT A 1A 2A 3b p c D (1)E (1)e H E L L p Q Z y w v θ REFERENCESOUTLINE VERSION EUROPEAN PROJECTIONISSUE DATE IECJEDEC JEITAmm0.210.051.801.650.250.380.250.200.096.46.05.45.20.651.257.97.61.030.630.90.71.000.5580oo 0.130.20.1DIMENSIONS (mm are the original dimensions)Note1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.SOT338-199-12-2703-02-19(1)w Mb pD H EE Z ecv M AXAy18169θAA 1A 2L p Qdetail XL(A )3MO-150pin 1 index0 2.5 5 mmscaleSSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm SOT338-1Amax.2Fig 14.Package outline SOT403-1 (TSSOP16)UNIT A 1A 2A 3b p c D (1)E (2)(1)e H E L L p Q Z y w v θ REFERENCESOUTLINE VERSION EUROPEAN PROJECTIONISSUE DATE IECJEDEC JEITAmm0.150.050.950.800.300.190.20.15.14.94.54.30.656.66.20.40.30.400.0680oo 0.130.10.21DIMENSIONS (mm are the original dimensions)Notes1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.0.750.50SOT403-1MO-15399-12-2703-02-18w Mb pD Ze0.2518169θAA 1A 2L p Qdetail XL(A )3H EE cv M AXAy0 2.5 5 mmscaleTSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1Amax.1.1pin 1 index14.Revision historyTable 10:Revision historyDocument ID Release date Data sheet status Change notice Doc. number Supersedes74HC75_320041112Product data sheet-9397 750 1381674HC_HCT75_CNV_2 Modifications:•The format of this data sheet has been redesigned to comply with the current presentation andinformation standard of Philips Semiconductors.•Removed type number 74HCT75.•Inserted family specification.74HC_HCT75_CNV_219970918Product specification--74HC_HCT75_174HC_HCT75_119901201Product specification---15.Data sheet status[1]Please consult the most recently issued data sheet before initiating or completing a design.[2]The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL .[3]For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.16.DefinitionsShort-form specification —The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook.Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device.These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.17.DisclaimersLife support —These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.Right to make changes —Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’),relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes noresponsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to theseproducts,and makes no representations or warranties that these products are free from patent,copyright,or mask work right infringement,unless otherwise specified.18.Contact informationFor additional information, please visit: For sales office addresses, send an email to: sales.addresses@Level Data sheet status [1]Product status [2][3]DefinitionI Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice.IIPreliminary dataQualificationThis data sheet contains data from the preliminary specification.Supplementary data will be published at a later date.Philips Semiconductors reserves the right to change the specification without notice,in order to improve the design and supply the best possible product.III Product data ProductionThis data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design,manufacturing and supply.Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).19.Contents1General description. . . . . . . . . . . . . . . . . . . . . . 12Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13Quick reference data. . . . . . . . . . . . . . . . . . . . . 24Ordering information. . . . . . . . . . . . . . . . . . . . . 25Functional diagram . . . . . . . . . . . . . . . . . . . . . . 36Pinning information. . . . . . . . . . . . . . . . . . . . . . 46.1Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46.2Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 57Functional description . . . . . . . . . . . . . . . . . . . 57.1Function table. . . . . . . . . . . . . . . . . . . . . . . . . . 58Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 69Recommended operating conditions. . . . . . . . 610Static characteristics. . . . . . . . . . . . . . . . . . . . . 711Dynamic characteristics . . . . . . . . . . . . . . . . . . 912Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1213Package outline . . . . . . . . . . . . . . . . . . . . . . . . 1414Revision history. . . . . . . . . . . . . . . . . . . . . . . . 1815Data sheet status. . . . . . . . . . . . . . . . . . . . . . . 1916Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1917Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 1918Contact information . . . . . . . . . . . . . . . . . . . . 19© Koninklijke Philips Electronics N.V.2004All rights are reserved.Reproduction in whole or in part is prohibited without the priorwritten consent of the copyright owner.The information presented in this document doesnot form part of any quotation or contract,is believed to be accurate and reliable and maybe changed without notice.No liability will be accepted by the publisher for anyconsequence of its use.Publication thereof does not convey nor imply any license underpatent- or other industrial or intellectual property rights.Date of release: 12 November 2004Document number: 9397 750 13816。

HD74BC574AT中文资料

HD74BC574AT中文资料

HD74BC574AOctal D Type Flip Flops With 3 State OutputsADE-205-042A (Z)2nd. EditionSep. 2000 DescriptionThe HD74BC574A provides high drivability and operation equal to or better than high speed bipolar standard logic IC by using Bi-CMOS process. The device features low power dissipation that is about 1/5 of high speed bipolar logic IC, when the frequency is 10 MHz. The device has eight edge triger D type flip flops with three state outputs in a 20 pin package. Data at the D inputs meeting set up requirements, are transferred to the Q outputs on positive going transitions of the clock input. When the latch enable goes low, data at the D inputs will be retained at the outputs until latch enable returns high again. When a high logic level is applied to the output control input, all outputs go to a high impedance state, regardless of what signals are present at the other inputs and the state of the strage elements.Features• Input/Output are at high impedance state when power supply is off.• Built in input pull up circuit can make input pins be open, when not used.• TTL level input• Wide operating temperature rangeTa = –40 to + 85°CHD74BC574A2Function TableInputsOutput Control CKD Output QL H HL L L L L X Q 0H X XZH :High level L :Low level X :ImmaterialZ:High impedance: Low to high transition Q 0:Level of Q before the indicated steady state input conditions were established.Pin ArrangementHD74BC574A3Absolute Maximum RatingsItemSymbol Rating Unit Supply voltage V CC –0.5 to +7.0V Input diode current I IK ±30mA Input voltage V IN –0.5 to +7.5V Output voltage V OUT –0.5 to +7.5V Off state output voltage V OUT(off)–0.5 to +5.5V Storage temperature Tstg–65 to +150°CNote:1.The absolute maximum ratings are values which must not individually be exceeded, andfurthermore, no two of which may be realized at the same time.Recommended Operating ConditionsItemSymbol Min Typ Max Unit Supply voltage V CC 4.5 5.0 5.5V Input voltage V IN 0—V CC V Output voltage V OUT 0—V CC V Operating temperature Topr –40—85°C Input rise/fall time*1t r , t f—8ns/VNote:1.This item guarantees maximum limit when one input switches.Waveform: Refer to test circuit of switching characteristics.HD74BC574A Logic Diagram4HD74BC574A5Electrical Characteristics (Ta = –40°C to +85°C)Item Symbol V CC (V)Min Max Unit Test ConditionsInput voltage V IH 2.0—V V IL —0.8V Output voltageV OH 4.5 2.4—V I OH = –3 mA 4.5 2.0—V I OH = –15 mA V OL4.5—0.4V I OL = 24 mA 4.5—0.5V I OL = 48 mA Input diode voltage V IK 4.5—–1.2V I IN = –18 mA Input currentI I5.5—–250µA V IN = 0 V 5.5— 1.0µA V IN = 5.5 V 5.5—100µA V IN = 7.0 V Short circuit output current*1I OS 5.5–100–225mA V IN = 0 or 5.5 V Off state output current I OZH 5.5—50µA V O = 2.7 V I OZL 5.5—–50µA V O = 0.5 V Supply currentI CCL 5.5—29.5mA V IN = 0 or 5.5 V All outputs is “L”I CCH 5.5— 2.5mA V IN = 0 or 5.5 V All outputs is “H”I CCZ 5.5— 2.5mA V IN = 0 or 5.5 V All outputs is “Z”I CCT *25.5—1.5mAV IN = 3.4 or 0.5 V Notes: 1.Not more than one output should be shorted at a time and duration of the short circuit should notexceed one second.2.When input by the TTL level, it shows I CC increase at per one input pin.HD74BC574A6Switching Test Method (C L = 50 pF)Ta = 25°C V CC = 5.0 VTa = –40 to 85°C V CC = 5.0 V ±10%Item SymbolMin Max Min Max Unit Test conditions Propagation CK →Q t PLH3.08.0 3.010.0nsSee under figuredelay time t PHL 3.08.0 3.010.0Output enable time t ZH 3.09.0 3.011.0ns t ZL 3.09.0 3.011.0Output disable time t HZ 3.08.0 3.010.0ns t LZ 3.08.0 3.010.0Setup time t s (H) 2.0— 2.0—ns t s (L) 2.0— 2.0—Hold time t h (H) 2.0— 2.0—ns t h (L) 2.0— 2.0—Pulse width t W (H) 6.0— 6.0—ns t W (L) 6.0—6.0—Input capacitance C IN 3.0 (Typ)——pF V IN = V CC or GND Output capacitanceC O15.0 (Typ)—pFV O = V CC or GNDTest CircuitHD74BC574A Waveforms-1Waveforms-27HD74BC574A8Waveforms-3Notes:1.t r = 2.5 ns, t f = 2.5 ns2.Input waveform: PRR = 1 MHz, duty cycle 50%3.Waveform-A shows input conditions such that the output is “L” level when enable by the output control.4.Waveform-B shows input conditions such that the output is “H” level when enable by the output control.HD74BC574A Package Dimensions9HD74BC574A10HD74BC574A11Cautions 1.Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,copyright, trademark, or other intellectual property rights for information contained in this document.Hitachi bears no responsibility for problems that may arise with third party’s rights, includingintellectual property rights, in connection with use of the information contained in this document.2.Products and product specifications may be subject to change without notice. Confirm that you havereceived the latest product standards or specifications before final design, purchase or use.3.Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,traffic, safety equipment or medical equipment for life support.4.Design your application so that the product is used within the ranges guaranteed by Hitachi particularlyfor maximum rating, operating supply voltage range, heat radiation characteristics, installationconditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeablefailure rates or failure modes in semiconductor devices and employ systemic measures such as fail-safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.5.This product is not designed to be radiation resistant.6.No one is permitted to reproduce or duplicate, in any form, the whole or part of this document withoutwritten approval from Hitachi.7.Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductorproducts.Hitachi, Ltd.Semiconductor & Integrated Circuits.Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109Copyright © Hitachi, Ltd., 2000. All rights reserved. Printed in Japan.Hitachi Asia Ltd.Hitachi Tower16 Collyer Quay #20-00,Singapore 049318Tel : <65>-538-6533/538-8577Fax : <65>-538-6933/538-3877URL : .sgURL NorthAmerica : /Europe : /hel/ecg Asia : Japan : http://www.hitachi.co.jp/Sicd/indx.htmHitachi Asia Ltd.(Taipei Branch Office)4/F, No. 167, Tun Hwa North Road,Hung-Kuo Building,Taipei (105), TaiwanTel : <886>-(2)-2718-3666Fax : <886>-(2)-2718-8180Telex : 23222 HAS-TPURL : Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road Tsim Sha Tsui, Kowloon, Hong Kong Tel : <852>-(2)-735-9218 Fax : <852>-(2)-730-0281 URL : Hitachi Europe Ltd.Electronic Components Group.Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000Fax: <44> (1628) 585160Hitachi Europe GmbH Electronic Components Group Dornacher Stra βe 3D-85622 Feldkirchen, Munich Germany Tel: <49> (89) 9 9180-0Fax: <49> (89) 9 29 30 00Hitachi Semiconductor (America) Inc.179 East Tasman Drive,San Jose,CA 95134 Tel: <1> (408) 433-1990Fax: <1>(408) 433-0223For further information write to:Colophon 2.0。

74HC574

74HC574

20 VCC 19 Q7 18 D7 17 D6 16 Q6 15 Q5 14 D5 13 D4 12 Q4 11 CP
CD54HC574, CD54HCT574 (CERDIP)
CD74HC574 (PDIP, SOIC) CD74HCT574 (PDIP, SOIC, TSSOP)
TOP VIEW
OE 1 D0 2 D1 3 D2 4 D3 5 D4 6 D5 7 D6 8 D7 9 GND 10
20 VCC 19 Q0 18 Q1 17 Q2 16 Q3 15 Q4 14 Q5 13 Q6 12 Q7 11 CP
Functional Diagram
D0
D1
D2
D3
D4
D5
D6
D7
D CP Q
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC
D CP Q
D CP Q
D CP Q
D CP Q
D CP Q
D CP Q
D CP Q
CP
OE
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7
TRUTH TABLE
INPUTS
OUTPUT
OE
CP
Dn
Qn

74HCT574D中文资料

74HCT574D中文资料
• 8-bit positive edge-triggered register
• Common 3-state output enable input
• Independent register and 3-state buffer operation
• Output capability: bus driver • ICC category: MSI
14 60
75
90 ns 2.0 Fig.6
5 12
15
18
4.5
4 10
13
15
6.0
tW
clock pulse width
80 14
HIGH or LOW
16 5
14 4
100
120
20
24
17
20
ns 2.0 Fig.6 4.5 6.0
tsu
set-up time
Dn to CP
60 6 12 2 10 2
The 8 flip-flops will store the state of their individual D-inputs that meet the set-up and hold time requirements on the LOW-to-HIGH CP transition. When OE is LOW, the contents of the 8 flip-flops are available at the outputs. When OE is HIGH, the outputs go to the high impedance OFF-state. Operation of the OE input does not affect the state of the flip-flops.

74系列芯片功能大全

74系列芯片功能大全

74系列芯片功能大全7400 TTL 2输入端四与非门7401 TTL 集电极开路2输入端四与非门7402 TTL 2输入端四或非门7403 TTL 集电极开路2输入端四与非门7404 TTL 六反相器7405 TTL 集电极开路六反相器7406 TTL 集电极开路六反相高压驱动器7407 TTL 集电极开路六正相高压驱动器7408 TTL 2输入端四与门7409 TTL 集电极开路2输入端四与门7410 TTL 3输入端3与非门74107 TTL 带清除主从双J-K触发器74109 TTL 带预置清除正触发双J-K触发器7411 TTL 3输入端3与门74112 TTL 带预置清除负触发双J-K触发器7412 TTL 开路输出3输入端三与非门74121 TTL 单稳态多谐振荡器74122 TTL 可再触发单稳态多谐振荡器74123 TTL 双可再触发单稳态多谐振荡器74125 TTL 三态输出高有效四总线缓冲门74126 TTL 三态输出低有效四总线缓冲门7413 TTL 4输入端双与非施密特触发器74132 TTL 2输入端四与非施密特触发器74133 TTL 13输入端与非门74136 TTL 四异或门74138 TTL 3-8线译码器/复工器74139 TTL 双2-4线译码器/复工器7414 TTL 六反相施密特触发器74145 TTL BCD—十进制译码/驱动器7415 TTL 开路输出3输入端三与门74150 TTL 16选1数据选择/多路开关74151 TTL 8选1数据选择器74153 TTL 双4选1数据选择器74154 TTL 4线—16线译码器74155 TTL 图腾柱输出译码器/分配器74156 TTL 开路输出译码器/分配器74157 TTL 同相输出四2选1数据选择器74158 TTL 反相输出四2选1数据选择器7416 TTL 开路输出六反相缓冲/驱动器74160 TTL 可预置BCD异步清除计数器74161 TTL 可予制四位二进制异步清除计数器74162 TTL 可预置BCD同步清除计数器74163 TTL 可予制四位二进制同步清除计数器74164 TTL 八位串行入/并行输出移位寄存器74165 TTL 八位并行入/串行输出移位寄存器74166 TTL 八位并入/串出移位寄存器74169 TTL 二进制四位加/减同步计数器7417 TTL 开路输出六同相缓冲/驱动器74170 TTL 开路输出4×4寄存器堆74173 TTL 三态输出四位D型寄存器74174 TTL 带公共时钟和复位六D触发器74175 TTL 带公共时钟和复位四D触发器74180 TTL 9位奇数/偶数发生器/校验器74181 TTL 算术逻辑单元/函数发生器74185 TTL 二进制—BCD代码转换器74190 TTL BCD同步加/减计数器74191 TTL 二进制同步可逆计数器74192 TTL 可预置BCD双时钟可逆计数器74193 TTL 可预置四位二进制双时钟可逆计数器74194 TTL 四位双向通用移位寄存器74195 TTL 四位并行通道移位寄存器74196 TTL 十进制/二-十进制可预置计数锁存器74197 TTL 二进制可预置锁存器/计数器7420 TTL 4输入端双与非门7421 TTL 4输入端双与门7422 TTL 开路输出4输入端双与非门74221 TTL 双/单稳态多谐振荡器74240 TTL 八反相三态缓冲器/线驱动器74241 TTL 八同相三态缓冲器/线驱动器74243 TTL 四同相三态总线收发器74244 TTL 八同相三态缓冲器/线驱动器74245 TTL 八同相三态总线收发器74247 TTL BCD—7段15V输出译码/驱动器74248 TTL BCD—7段译码/升压输出驱动器74249 TTL BCD—7段译码/开路输出驱动器74251 TTL 三态输出8选1数据选择器/复工器74253 TTL 三态输出双4选1数据选择器/复工器74256 TTL 双四位可寻址锁存器74257 TTL 三态原码四2选1数据选择器/复工器74258 TTL 三态反码四2选1数据选择器/复工器74259 TTL 八位可寻址锁存器/3-8线译码器7426 TTL 2输入端高压接口四与非门74260 TTL 5输入端双或非门74266 TTL 2输入端四异或非门7427 TTL 3输入端三或非门74273 TTL 带公共时钟复位八D触发器74279 TTL 四图腾柱输出S-R锁存器7428 TTL 2输入端四或非门缓冲器74283 TTL 4位二进制全加器74290 TTL 二/五分频十进制计数器74293 TTL 二/八分频四位二进制计数器74295 TTL 四位双向通用移位寄存器74298 TTL 四2输入多路带存贮开关74299 TTL 三态输出八位通用移位寄存器7430 TTL 8输入端与非门7432 TTL 2输入端四或门74322 TTL 带符号扩展端八位移位寄存器74323 TTL 三态输出八位双向移位/存贮寄存器7433 TTL 开路输出2输入端四或非缓冲器74347 TTL BCD—7段译码器/驱动器74352 TTL 双4选1数据选择器/复工器74353 TTL 三态输出双4选1数据选择器/复工器74365 TTL 门使能输入三态输出六同相线驱动器74365 TTL 门使能输入三态输出六同相线驱动器74366 TTL 门使能输入三态输出六反相线驱动器74367 TTL 4/2线使能输入三态六同相线驱动器74368 TTL 4/2线使能输入三态六反相线驱动器7437 TTL 开路输出2输入端四与非缓冲器74373 TTL 三态同相八D锁存器74374 TTL 三态反相八D锁存器74375 TTL 4位双稳态锁存器74377 TTL 单边输出公共使能八D锁存器74378 TTL 单边输出公共使能六D锁存器74379 TTL 双边输出公共使能四D锁存器7438 TTL 开路输出2输入端四与非缓冲器74380 TTL 多功能八进制寄存器7439 TTL 开路输出2输入端四与非缓冲器74390 TTL 双十进制计数器74393 TTL 双四位二进制计数器7440 TTL 4输入端双与非缓冲器7442 TTL BCD—十进制代码转换器74352 TTL 双4选1数据选择器/复工器74353 TTL 三态输出双4选1数据选择器/复工器74365 TTL 门使能输入三态输出六同相线驱动器74366 TTL 门使能输入三态输出六反相线驱动器74367 TTL 4/2线使能输入三态六同相线驱动器74368 TTL 4/2线使能输入三态六反相线驱动器7437 TTL 开路输出2输入端四与非缓冲器74373 TTL 三态同相八D锁存器74374 TTL 三态反相八D锁存器74375 TTL 4位双稳态锁存器74377 TTL 单边输出公共使能八D锁存器74378 TTL 单边输出公共使能六D锁存器74379 TTL 双边输出公共使能四D锁存器7438 TTL 开路输出2输入端四与非缓冲器74380 TTL 多功能八进制寄存器7439 TTL 开路输出2输入端四与非缓冲器74390 TTL 双十进制计数器74393 TTL 双四位二进制计数器7440 TTL 4输入端双与非缓冲器7442 TTL BCD—十进制代码转换器74447 TTL BCD—7段译码器/驱动器7445 TTL BCD—十进制代码转换/驱动器74450 TTL 16:1多路转接复用器多工器74451 TTL 双8:1多路转接复用器多工器74453 TTL 四4:1多路转接复用器多工器7446 TTL BCD—7段低有效译码/驱动器74460 TTL 十位比较器74461 TTL 八进制计数器74465 TTL 三态同相2与使能端八总线缓冲器74466 TTL 三态反相2与使能八总线缓冲器74467 TTL 三态同相2使能端八总线缓冲器74468 TTL 三态反相2使能端八总线缓冲器74469 TTL 八位双向计数器7447 TTL BCD—7段高有效译码/驱动器7448 TTL BCD—7段译码器/内部上拉输出驱动74490 TTL 双十进制计数器74491 TTL 十位计数器74498 TTL 八进制移位寄存器7450 TTL 2-3/2-2输入端双与或非门74502 TTL 八位逐次逼近寄存器74503 TTL 八位逐次逼近寄存器7451 TTL 2-3/2-2输入端双与或非门74533 TTL 三态反相八D锁存器74534 TTL 三态反相八D锁存器7454 TTL 四路输入与或非门74540 TTL 八位三态反相输出总线缓冲器7455 TTL 4输入端二路输入与或非门74563 TTL 八位三态反相输出触发器74564 TTL 八位三态反相输出D触发器74573 TTL 八位三态输出触发器74574 TTL 八位三态输出D触发器74645 TTL 三态输出八同相总线传送接收器74670 TTL 三态输出4×4寄存器堆7473 TTL 带清除负触发双J-K触发器7474 TTL 带置位复位正触发双D触发器7476 TTL 带预置清除双J-K触发器7483 TTL 四位二进制快速进位全加器7485 TTL 四位数字比较器7486 TTL 2输入端四异或门7490 TTL 可二/五分频十进制计数器7493 TTL 可二/八分频二进制计数器7495 TTL 四位并行输入\输出移位寄存器7497 TTL 6位同步二进制乘法器常用74系列标准数字电路的中文名称资料器件代号器件名称 74 74LS 74HC00 四2输入端与非门√√√01 四2输入端与非门(OC) √√02 四2输入端或非门√√√03 四2输入端与非门(OC) √√04 六反相器√√√05 六反相器(OC) √√06 六高压输出反相器(OC,30V) √√07 六高压输出缓冲,驱动器(OC,30V) √√√08 四2输入端与门√√√09 四2输入端与门(OC) √√√10 三3输入端与非门√√√11 三3输入端与门√√12 三3输入端与非门(OC) √√√13 双4输入端与非门√√√14 六反相器√√√15 三3输入端与门 (OC) √√16 六高压输出反相器(OC,15V) √17 六高压输出缓冲,驱动器(OC,15V) √20 双4输入端与非门√√√21 双4输入端与门√√√22 双4输入端与非门(OC) √√25 双4输入端或非门(有选通端) √√√26 四2输入端高压输出与非缓冲器√√√27 三3输入端或非门√√√28 四2输入端或非缓冲器√√√30 8输入端与非门√√√32 四2输入端或门√√√33 四2输入端或非缓冲器(OC) √√37 四2输入端与非缓冲器√√38 四2输入端与非缓冲器(OC) √√40 双4输入端与非缓冲器√√√42 4线-10线译码器(BCD输入) √√43 4线-10线译码器(余3码输入) √44 4线-10线译码器(余3葛莱码输入) √48 4线-7段译码器√49 4线-7段译码器√50 双2路2-2输入与或非门√√√51 2路3-3输入,2路2-2输入与或非门√√√52 4路2-3-2-2输入与或门√53 4路2-2-2-2输入与或非门√54 4路2-3-3-2输入与或非门√√55 2路4-4输入与或非门√60 双4输入与扩展器√√61 三3输入与扩展器√62 4路2-3-3-2输入与或扩展器√64 4路4-2-3-2输入与或非门√65 4路4-2-3-2输入与或非门(OC) √70 与门输入J-K触发器√71 与或门输入J-K触发器√72 与门输入J-K触发器√74 双上升沿D型触发器√√78 双D型触发器√√85 四位数值比较器√86 四2输入端异或门√√√87 4位二进制原码/反码√95 4位移位寄存器√101 与或门输入J-K触发器√102 与门输入J-K触发器√107 双主-从J-K触发器√108 双主-从J-K触发器√109 双主-从J-K触发器√110 与门输入J-K触发器√111 双主-从J-K触发器√√112 双下降沿J-K触发器√113 双下降沿J-K触发器√114 双下降沿J-K触发器√116 双4位锁存器√120 双脉冲同步驱动器√121 单稳态触发器√√√122 可重触发单稳态触发器√√√123 可重触发双稳态触发器√√√125 四总线缓冲器√√√126 四总线缓冲器√√√128 四2输入端或非线驱动器√√√132 四2输入端与非门√√√。

74ls574芯片中文使用手册说明书

74ls574芯片中文使用手册说明书

特点: 逻辑图说明:LS574的八个触发器是边沿触发D 型触发器。

在时钟的正跳动,Q 输出将处于D 输入端已建立的逻辑状态。

时钟线上的施密特触发缓冲输入将简化系统设计,因为输入滞后作用使交流和直流抗扰度一般提高400mV 。

缓冲输出的控制输入将使八个输出处于正常状态(高电平或低电平)或处于高阻状态。

在高阻态下,输出既不能有效地给总线加负载,也不能有效地驱动总线。

输出控制不影响触发器的内部工作,既老数据可以保持,甚至当输出被关闭,新的数据也可以置入。

·三态总线驱动输出 ·置数全并行存取 ·缓冲控制输入·时钟输入有改善抗扰度的滞后作用 外引线排列图功能表输入输出控制 时钟 数据输出 CLK D Q L ↑ H H L ↑ L L L L × Q O H × × Z H=高电平 L=低电平 ×=不定 Z=高阻态↑=从低转换到高电平 Q O=建立稳态输入条件前Q 的电平推荐工作条件74Ⅱ 54 参数值 参数值 符号 参数名称 最小典型最大最小典型 最大 单位Vcc 电源电压 4.75 5 5.25 4.5 5 5.5 V V IH 输入高电平电压 2.0 2.0 V V IL 输入低电平电压 0.8 0.7 V I OH 输出高电平电流 -2.6 -1 mA I OL 输出低电平电流 24 12 mA 高 15 15 ns t W 时钟脉冲宽度低15 15 ns t su 数据建立时间 20↑ 20↑ ns t h 数据保持时间 0↑ 0↑ ns T A工作环境温度-4085-55125℃电 性 能:(除特别说明外,均为全温度范围)74Ⅱ54参数值参数值符号参数名称测试条件最小典型最大最小典型 最大 单位V IK 输入钳位电压Vcc=最小 I I =-18mA-1.5 -1.5 V V OH 输出高电平电压Vcc=最小 V IL =最大V IH =2V I OH =最大 2.4 2.4 3.4V V OL 输出低电平电压Vcc=最小 V IL =最大V IH =2V I OL =最大0.5 0.25 0.4VI I 输入电流 (最大输入电压时)Vcc=最大 V I =7V0.1 0.1 mA I IH 输入高电平电流 Vcc=最大 V I =2.7V 20 20 μAI IL 输入低电平电流 Vcc=最大 V I =0.4V-0.4 -0.4 mA I OZH 高关态输出电流Vcc=最大 V I =2.0VV o=2.7V20 20μAI OZL 低关态输出电流Vcc=最大 V I =2.0VV o=0.4V-20 -20 μA I OS 输出短路电流 Vcc =最大 V O =0V -30 -130-30 -130 mA I CC 电源电流 Vcc=最大 (注)402740 mA注:Icc 在输出控制端加4.5V 时测量。

SN74HCT645PWG4中文资料

SN74HCT645PWG4中文资料

PACKAGING INFORMATIONOrderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)SN74HCT645DW ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HCT645DWE4ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HCT645DWG4ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HCT645DWR ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HCT645DWRE4ACTIVE SOICDW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HCT645DWRG4ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HCT645N ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74HCT645N3OBSOLETE PDIP N 20TBD Call TI Call TISN74HCT645NE4ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74HCT645NSR ACTIVE SO NS 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HCT645NSRE4ACTIVE SO NS 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HCT645PW ACTIVE TSSOP PW 2070Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HCT645PWE4ACTIVE TSSOP PW 2070Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HCT645PWG4ACTIVE TSSOP PW 2070Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HCT645PWR ACTIVE TSSOP PW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HCT645PWRE4ACTIVE TSSOP PW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HCT645PWRG4ACTIVE TSSOP PW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HCT645PWT ACTIVE TSSOP PW 20250Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HCT645PWTE4ACTIVE TSSOP PW 20250Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HCT645PWTG4ACTIVETSSOPPW20250Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.24-May-2007Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annualbasis.24-May-2007TAPE AND REELINFORMATION19-May-2007DevicePackage Pins SiteReel Diameter (mm)Reel Width (mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74HCT645DWR DW 20MLA 3302410.813.0 2.71224Q1SN74HCT645NSR NS 20MLA 330248.213.0 2.51224Q1SN74HCT645PWRPW20MLA330166.957.11.6816Q1TAPE AND REEL BOX INFORMATIONDevice Package Pins Site Length (mm)Width (mm)Height (mm)SN74HCT645DWR DW 20MLA 333.2333.231.75SN74HCT645NSR NS 20MLA 333.2333.231.75SN74HCT645PWRPW20MLA342.9336.628.5819-May-200719-May-2007IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. 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SL74HCT574中文资料

SL74HCT574中文资料

ICC
Maximum Quiescent Supply Current (per Package) Additional Quiescent Supply Current
5.5
4.0
40
160
µA
∆ICC
≥-55°C
25°C to 125°C 2.4
mA
5.5
2.9
SLS
System Logic Semiconductor
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range GND≤(VIN or VOUT)≤VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or V CC). Unused outputs must be left open.
X = don’t care Z = higogic Semiconductor
元器件交易网
SL74HCT574
MAXIMUM RATINGS *

HCT574中文资料

HCT574中文资料

PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)SN74HCT574DBR ACTIVE SSOP DB202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HCT574DBRE4ACTIVE SSOP DB202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HCT574DW ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HCT574DWR ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HCT574DWRE4ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HCT574N ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU N/A for Pkg Type SN74HCT574N3OBSOLETE PDIP N20TBD Call TI Call TISN74HCT574NE4ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeSN74HCT574NSR ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HCT574NSRE4ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HCT574PW ACTIVE TSSOP PW2070Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HCT574PWE4ACTIVE TSSOP PW2070Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HCT574PWLE OBSOLETE TSSOP PW20TBD Call TI Call TISN74HCT574PWR ACTIVE TSSOP PW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HCT574PWRE4ACTIVE TSSOP PW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HCT574PWT ACTIVE TSSOP PW20250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HCT574PWTE4ACTIVE TSSOP PW20250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.TAPE AND REEL INFORMATIONDevice Package Pins Site ReelDiameter(mm)ReelWidth(mm)A0(mm)B0(mm)K0(mm)P1(mm)W(mm)Pin1QuadrantSN74HCT574DBR DB20MLA330168.27.5 2.51216Q1 SN74HCT574DWR DW20MLA3302410.813.0 2.71224Q1 SN74HCT574NSR NS20MLA330248.213.0 2.51224Q1 SN74HCT574PWR PW20MLA33016 6.957.1 1.6816Q1TAPE AND REEL BOX INFORMATIONDevice Package Pins Site Length(mm)Width(mm)Height(mm) SN74HCT574DBR DB20MLA333.2333.228.58SN74HCT574DWR DW20MLA333.2333.231.75SN74HCT574NSR NS20MLA333.2333.231.75SN74HCT574PWR PW20MLA333.2333.228.58IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI)reserve the right to make corrections,modifications,enhancements,improvements,and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and 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74hct574n芯片参数

74hct574n芯片参数

AC CHARACTERISTICS FOR 74HC GND = 0 V; tr = tf = 6 ns; CL = 50 pF
Tamb (°C)
TEST CONDITIONS
SYMBOL PARAMETER
min.
+25 typ.
max.
74HC −40 to +85 min. max.
−40 to +125 min. max.
INTEGRATED CIRCUITS
DATA SHEET
For a complete data sheet, please also download:
• The IC06 74HC/HCT/HCU/HCMOS Logic Family Specifications • The IC06 74HC/HCT/HCU/HCMOS Logic Package Information • The IC06 74HC/HCT/HCU/HCMOS Logic Package Outlines
The “574” is functionally identical to the “564”, but has non-inverting outputs. The “574” is functionally identical to the “374”, but has a different pinning.
CL = 15 pF; VCC = 5 V notes 1 and 2
Notes
1. CPD is used to determine the dynamic power dissipation (PD in µW): PD = CPD × VCC2 × fi + ∑ (CL × VCC2 × fo) where:

CD74HC574中文资料

CD74HC574中文资料
For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA DC Output Diode Current, IOK
For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA DC Drain Current, per Output, IO
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC
(SOIC - Lead Tips Only)
Operating Conditions
Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC Supply Voltage Range, VCC
Pinouts
CD74HC374, CD74HCT374 (PDIP, SOIC) TOP VIEW
CD74HCT574 (PDIP, SOIC)
TOP VIEW
OE 1 Q0 2 D0 3 D1 4 Q1 5 Q2 6 D2 7 D3 8 Q3 9 GND 10
20 VCC 19 Q7 18 D7 17 D6 16 Q6 15 Q5 14 D5 13 D4 12 Q4 11 CP
• HC Types - 2V to 6V Operation - High Noise Immunity: NIL = 30%, NIH = 30% of VCC at VCC = 5V

74LS系列与74HC

74LS系列与74HC

74LS系列与74HC,74HCT,CD系列的区别一、概述:74LS是TTL电路的一个系列,TTL电路以双极型晶体管为开关元件所以以称双极型(电子和空穴)集成电路。

74HC是CMOS电路,CMOS电路是MOS电路中的主导产品。

MOS电路以绝缘栅场效应晶体管为开关元件。

所以又称单极型集成电路。

按其导电沟道的类型,MOS电路可分为PMOST 、NMOS和CMOS电路。

CMOS电路沿着4000A--4000B/4500B(统一称为4000B)--74HC/74vHC--74HCT系列高速发展。

HCT系列还同TTL电平兼容,扩大了应用范围。

CD代表标准的4000系列CMOS电路,我国生产的CMOS电路系列为“CC4000B”。

二、TTL逻辑芯片与与CMOS逻辑芯片的区别1.TTL工作电压范围为5V正负左右。

CMOS为3--18V左右。

2.频率特性:标准TTL电路在5MHZ以下,一般COMS在100KHZ以下。

3.速度*功耗积:(在100KHZ时,单位为PJ)标准TTL电路和为100。

标准CMOS为11。

4.最小输出的驱动电流(单位MA,输出低电平0.4V)标准输出:标准TTL系列为16。

标准COMS(4000系列为16,74系列为4)。

5.大电流输出:标准TTL为48V。

标准COMS(4000为16,74系列为6)6.扇出能力:标准TTL为系列为40(大电流输出为120)。

标准COMS(4000系列为4,74系列为10,大电流输出为4,15)。

7.最大输入电流(单位MA,输出低电平4V):标准TTL系列为-1.6。

COMS(4000系列为正负0.001,74系列为负0.001)。

8.输入阻抗:COMS可达10M,TTL为5M。

74LSHC高电平规定为0.7倍电源电压,低电平规定为0.3倍电源电压。

LS规定高电平为2.0V,低电平为0.8V。

带负载特性不同。

2.HC上拉下拉能力相同,LS上拉弱而下拉强。

3.输入特性不同:HC输入电阻很高,输入开路时电平不定。

74HC系列查询课件

74HC系列查询课件

2006-9-22 23:06系列电平典型传输延迟ns 最大驱动电流(-Ioh/Lol)mA AHC CMOS 8.5 -8/8AHCT COMS/TTL 8.5 -8/8HC COMS 25 -8/8HCT COMS/TTL 25 -8/8ACT COMS/TTL 10 -24/24F TTL 6.5 -15/64ALS TTL 10 -15/64LS TTL 18 -15/24注:同型号的74系列、74HC系列、74LS系列芯片,逻辑功能上是一样的。

74LSxx的使用说明如果找不到的话,可参阅74xx或74HCxx的使用说明。

有些资料里包含了几种芯片,如74HC161资料里包含了74HC160、74HC161、74HC162、74HC163四种芯片的资料。

找不到某种芯片的资料时,可试着查看一下临近型号的芯片资料。

7400 QUAD 2-INPUT NAND GATES 与非门7401 QUAD 2-INPUT NAND GATES OC 与非门7402 QUAD 2-INPUT NOR GATES 或非门7403 QUAD 2-INPUT NAND GATES 与非门7404 HEX INVERTING GATES 反向器7406 HEX INVERTING GATES HV 高输出反向器7408 QUAD 2-INPUT AND GATE 与门7409 QUAD 2-INPUT AND GATES OC 与门7410 TRIPLE 3-INPUT NAND GATES 与非门7411 TRIPLE 3-INPUT AND GATES 与门74121 ONE-SHOT WITH CLEAR 单稳态74132 SCHMITT TRIGGER NAND GATES 触发器与非门7414 SCHMITT TRIGGER INVERTERS 触发器反向器74153 4-LINE TO 1 LINE SELECTOR 四选一74155 2-LINE TO 4-LINE DECODER 译码器74180 PARITY GENERATOR/CHECKER 奇偶发生检验74191 4-BIT BINARY COUNTER UP/DOWN 计数器7420 DUAL 4-INPUT NAND GATES 双四输入与非门7426 QUAD 2-INPUT NAND GATES 与非门7427 TRIPLE 3-INPUT NOR GATES 三输入或非门7430 8-INPUT NAND GATES 八输入端与非门7432 QUAD 2-INPUT OR GATES 二输入或门7438 2-INPUT NAND GATE BUFFER 与非门缓冲器7445 BCD-DECIMAL DECODER/DRIVER BCD译码驱动器7474 D-TYPE FLIP-FLOP D型触发器7475 QUAD LATCHES 双锁存器7476 J-K FLIP-FLOP J-K触发器7485 4-BIT MAGNITUDE COMPARATOR 四位比较器7486 2-INPUT EXCLUSIVE OR GATES 双端异或门74HC00 QUAD 2-INPUT NAND GATES 双输入与非门74HC02 QUAD 2-INPUT NOR GATES 双输入或非门74HC03 2-INPUT OPEN-DRAIN NAND GATES 与非门74HC04 HEX INVERTERS 六路反向器74HC05 HEX INVERTERS OPEN DRAIN 六路反向器74HC08 2-INPUT AND GATES 双输入与门74HC107 J-K FLIP-FLOP WITH CLEAR J-K触发器74HC109A J-K FLIP-FLOP W/PRESET J-K触发器74HC11 TRIPLE 3-INPUT AND GATES 三输入与门74HC112 DUAL J-K FLIP-FLOP 双J-K触发器74HC113 DUAL J-K FLIP-FLOP PRESET 双JK触发器74HC123A RETRIGGERABLE MONOSTAB 可重触发单稳74HC125 TRI-STATE QUAD BUFFERS 四个三态门74HC126 TRI-STATE QUAD BUFFERS 六三态门74HC132 2-INPUT TRIGGER NAND 施密特触发与非门74HC133 13-INPUT NAND GATES 十三输入与非门74HC137 3-TO-8 DECODERS W/LATCHES 3-8线译码器74HC138 3-8 LINE DECODER 3线至8线译码器74HC139 2-4 LINE DECODER 2线至4线译码器74HC14 TRIGGERED HEX INVERTER 六触发反向器74HC147 10-4 LINE PRIORITY ENCODER 10-4编码器74HC148 8-3 LINE PRIORITY ENCODER 8-3编码器74HC149 8-8 LINE PRIORITY ENCODER 8-8编码器74HC151 8-CHANNEL DIGITAL MUX 8通道多路器74HC153 DUAL 4-INPUT MUX 双四输入多路器74HC154 4-16 LINE DECODER 4线至16线译码器74HC155 2-4 LINE DECODER 2线至4线译码器74HC157 QUAD 2-INPUT MUX 四个双端多路器74HC161 BINARY COUNTER 二进制计数器74HC163 DECADE COUNTERS 十进制计数器74HC164 SERIAL-PARALLEL SHIFT REG 串入并出74HC165 PARALLEL-SERIAL SHIFT REG 并入串出74HC166 SERIAL-PARALLEL SHIFT REG 串入并出74HC173 TRI-STATE D FLIP-FLOP 三态D触发器74HC174 HEX D FLIP-FLOP W/CLEAR 六D触发器74HC175 HEX D FLIP-FLOP W/CLEAR 六D触发器74HC181 ARITHMETIC LOGIC UNIT 算术逻辑单元74HC182 LOOK AHEAD CARRYGENERATR 进位发生器74HC190 BINARY UP/DN COUNTER 二进制加减计数器74HC191 DECADE UP/DN COUNTER 十进制加减计数器74HC192 DECADE UP/DN COUNTER 十进制加减计数器74HC193 BINARY UP/DN COUNTER 二进制加减计数器74HC194 4BIT BI-DIR SHIFT 4位双向移位寄存器74HC195 4BIT PARALLEL SHIFT 4位并行移位寄存器74HC20 QUAD 4-INPUT NAND GATE 四个四入与非门74HC221A NON-RETRIG MONOSTAB 不可重触发单稳74HC237 3-8 LINE DECODER 地址锁3线至8线译码器74HC242/243 TRI-STAT TRANSCEIVER 三态收发器74HC244 OCTAL 3-STATE BUFFER 八个三态缓冲门74HC245 OCTAL 3-STATE TRANSCEIVER 三态收发器74HC251 8-CH 3-STATE MUX 8路3态多路器74HC253 DUAL 4-CH 3-STATE MUX 4路3态多路器74HC257 QUAD 2-CH 3-STATE MUX 4路3态多路器74HC258 2-CH 3-STATE MUX 2路3态多路器74HC259 3-8 LINE DECODER 8位地址锁存译码器74HC266A 2-INPUT EXCLUSIVE NOR GATE 异或非74HC27 TRIPLE 3-INPUT NOR GATE 三个3输入或非门74HC273 OCTAL D FLIP-FLOP CLEAR 8路D触发器74HC280 9BIT ODD/EVEN GENERATOR 奇偶发生器74HC283 4BIT BINARY ADDER CARRY 四位加法器74HC299 3-STATE UNIVERSAL SHIFT 三态移位寄存74HC30 8-INPUT NAND GATE 8输入端与非门74HC32 QUAD 2-INPUT OR GATE 四个双端或门74HC34 NON-INVERTER 非反向器74HC354 8-CH 3-STATE MUX 8路3态多路器74HC356 8-CH 3-STATE MUX 8路3态多路器74HC365 HEX 3-STATE BUFFER 六个三态缓冲门74HC366 3-STATE BUFFER INVERTER 缓冲反向器74HC367 3-STATE BUFFER INVERTER 缓冲反向器74HC368 3-STATE BUFFER INVERTER 缓冲反向器74HC373 3-STATE OCTAL D LATCHES 三态D型锁存器74HC374 3-STATE OCTAL D FLIPFLOP 三态D触发器74HC393 4-BIT BINARY COUNTER 4位二进制计数器74HC4016 QUAD ANALOG SWITCH 四路模拟量开关74HC4020 14-Stage Binary Counter 14输出计数器74HC4017 Decade Counter/Divider with 10 Decoded Outputsvvv十进制计数器带10个译码输出端74HC4040 12 Stage Binary Counter 12出计数器74HC4046 PHASE LOCK LOOP 相位监测输出器74HC4049 LEVEL DOWN CONVERTER 电平变低器74HC4050 LEVEL DOWN CONVERTER 电平变低器74HC4051 8-CH ANALOG MUX 8通道多路器74HC4052 4-CH ANALOG MUX 4通道多路器74HC4053 2-CH ANALOG MUX 2通道多路器74HC4060 14-STAGE BINARY COUNTER 14阶BIN计数74HC4066 QUAD ANALOG MUX 四通道多路器74HC4075 TRIPLE 3-INPUT OR GATE 3输入或门74HC42 BCD TO DECIMAL BCD转十进制译码器74HC423A RETRIGGERABLE MONOSTAB 可重触发单稳74HC4511 BCD-7 SEG DRIVER/DECODER 7段译码器74HC4514 4-16 LINE DECODER 4至16线译码器74HC4538A RETRIGGERAB MONOSTAB 可重触发单稳74HC4543 LCD BCD-7 SEG LCD用的BCD-7段译码驱动74HC51 AND OR GATE INVERTER 与或非门74HC521 8BIT MAGNITUDE COMPARATOR 判决定路74HC533 3-STATE D LATCH 三态D锁存器74HC534 3-STATE D FLIP-FLOP 三态D型触发器74HC540 3-STATE BUFFER 三态缓冲器74HC541 3-STATE BUFFER INVERTER 三态缓冲反向器74HC58 DUAL AND OR GATE 与或门74HC589 3STATE 8BIT SHIFT 8位移位寄存三态输出74HC594 8BIT SHIFT REG 8位移位寄存器74HC595 8BIT SHIFT REG 8位移位寄存器出锁存74HC597 8BIT SHIFT REG 8位移位寄存器入锁存74HC620 3-STATE TRANSCEIVER 反向3态收发器74HC623 3-STATE TRANSCEIVER 八路三态收发器74HC640 3-STATE TRANSCEIVER 反向3态收发器74HC643 3-STATE TRANSCEIVER 八路三态收发器74HC646 NON-INVERT BUS TRANSCEIVER 总线收发器74HC648 INVERT BUS TRANCIVER 反向总线收发器74HC688 8BIT MAGNITUDE COMPARATOR 8位判决电路74HC7266 2-INPUT EXCLUSIVE NOR GATE 异或非门74HC73 DUAL J-K FLIP-FLOP W/CLEAR 双JK触发器74HC74A PRESET/CLEAR D FLIP-FLOP 双D触发器74HC75 4BIT BISTABLE LATCH 4位双稳锁存器74HC76 PRESET/CLEAR JK FLIP-FLOP 双JK触发器74HC85 4BIT MAGNITUDE COMPARATOR 4位判决电路74HC86 2INPUT EXCLUSIVE OR GATE 2输入异或门74HC942 BAUD MODEM 300BPS低速调制解调器74HC943 300 BAUD MODEM 300BPS低速调制解调器74LS00 QUAD 2-INPUT NAND GATES 与非门74LS02 QUAD 2-INPUT NOR GATES 或非门74LS03 QUAD 2-INPUT NAND GATES 与非门74LS04 HEX INVERTING GATES 反向器74LS05 HEX INVERTERS OPEN DRAIN 六路反向器74LS08 QUAD 2-INPUT AND GATE 与门74LS09 QUAD 2-INPUT AND GATES OC 与门74LS10 TRIPLE 3-INPUT NAND GATES 与非门 74LS109 QUAD 2-INPUT AND GATES OC 与门74LS11 TRIPLE 3-INPUT AND GATES 与门74LS112 DUAL J-K FLIP-FLOP 双J-K触发器74LS113 DUAL J-K FLIP-FLOP PRESET 双JK触发器74LS114 NEGATIVE J-K FLIP-FLOP 负沿J-K触发器74LS122 Retriggerable Monostab 可重触发单稳74LS123 Retriggerable Monostable 可重触发单稳74LS125 TRI-STATE QUAD BUFFERS 四个三态门74LS13 QUAL 4-in NAND TRIGGER 4输入与非触发器74LS160 BCD DECADE 4BIT BIN COUNTERS 计数器74LS136 QUADRUPLE 2-INPUT XOR GATE 异或门74LS138 3-8 LINE DECODER 3线至8线译码器74LS139 2-4 LINE DECODER 2线至4线译码器74LS14 TRIGGERED HEX INVERTER 六触发反向器74HC147 10-4 LINE PRIORITY ENCODER 10-4编码器74HC148 8-3 LINE PRIORITY ENCODER 8-3编码器74HC149 8-8 LINE PRIORITY ENCODER 8-8编码器74LS151 8-CHANNEL DIGITAL MUX 8通道多路器74LS153 DUAL 4-INPUT MUX 双四输入多路器74LS155 2-4 LINE DECODER 2线至4线译码器74LS156 2-4 LINE DECODER/DEMUX 2-4译码器74LS157 QUAD 2-INPUT MUX 四个双端多路器74LS158 2-1 LINE MUX 2-1线多路器74LS160A BINARY COUNTER 二进制计数器74LS161A BINARY COUNTER 二进制计数器74LS162A BINARY COUNTER 二进制计数器74LS163A DECADE COUNTERS 十进制计数器74LS164 SERIAL-PARALLEL SHIFT REG 串入并出74LS168 BI-DIRECT BCD TO DECADE 双向计数器74LS169 4BIT UP/DN BIN COUNTER 四位加减计数器74LS173 TRI-STATE D FLIP-FLOP 三态D触发器74LS174 HEX D FLIP-FLOP W/CLEAR 六D触发器74LS175 HEX D FLIP-FLOP W/CLEAR 六D触发器74LS190 BINARY UP/DN COUNTER 二进制加减计数器74LS191 DECADE UP/DN COUNTER 十进制加减计数器74LS192 DECADE UP/DN COUNTER 十进制加减计数器74LS193 BINARY UP/DN COUNTER 二进制加减计数器74LS194A 4BIT BI-DIR SHIFT 4位双向移位寄存器74LS195A 4BIT PARALLEL SHIFT 4位并行移位寄存器74LS20 QUAD 4-INPUT NAND GATE 四个四入与非门74LS21 4-INPUT AND GATE 四输入端与门74LS240 OCTAL 3-STATE BUFFER 八个三态缓冲门74LS244 OCTAL 3-STATE BUFFER 八个三态缓冲门74LS245 OCTAL 3-STATE TRANSCEIVER 三态收发器74LS253 DUAL 4-CH 3-STATE MUX 4路3态多路器74LS256 4BIT ADDRESS LATCH 四位可锁存锁存器74LS257 QUAD 2-CH 3-STATE MUX 4路3态多路器74LS258 2-CH 3-STATE MUX 2路3态多路器74LS27 TRIPLE 3-INPUT NOR GATES 三输入或非门74LS279 QUAD R-S LATCHES 四个RS非锁存器74LS28 QUAD 2-INPUT NOR BUFFER 四双端或非缓冲74LS283 4BIT BINARY ADDER CARRY 四位加法器74LS30 8-INPUT NAND GATES 八输入端与非门74LS32 QUAD 2-INPUT OR GATES 二输入或门74LS352 4-1 LINE SELECTOR/MUX 4-1线选择多路器74LS365 HEX 3-STATE BUFFER 六个三态缓冲门74LS367 3-STATE BUFFER INVERTER 缓冲反向器74LS368A 3-STATE BUFFER INVERTER 缓冲反向器74LS373 OCT LATCH W/3-STATE OUT 三态输出锁存器74LS76 Dual JK Flip-Flop w/set 2个JK触发器74LS379 QUAD PARALLEL REG 四个并行寄存器74LS38 2-INPUT NAND GATE BUFFER 与非门缓冲器74LS390 DUAL DECADE COUNTER 2个10进制计数器74LS393 DUAL BINARY COUNTER 2个2进制计数器74LS42 BCD TO DECIMAL BCD转十进制译码器74LS48 BCD-7 SEG BCD-7段译码器74LS49 BCD-7 SEG BCD-7段译码器74LS51 AND OR GATE INVERTER 与或非门74LS540 OCT Buffer/Line Driver 8路缓冲驱动器74LS541 OCT Buffer/LineDriver 8路缓冲驱动器74LS74 D-TYPE FLIP-FLOP D型触发器74LS682 8BIT MAGNITUDE COMPARATOR 8路比较器74LS684 8BIT MAGNITUDE COMPARATOR 8路比较器74LS75 QUAD LATCHES 双锁存器74LS83A 4BIT BINARY ADDER CARRY 四位加法器74LS85 4BIT MAGNITUDE COMPARAT 4位判决电路74LS86 2INPUT EXCLUSIVE OR GATE 2输入异或门74LS90 DECADE/BINARY COUNTER 十/二进制计数器74LS95B 4BIT RIGHT/LEFT SHIFT 4位左右移位寄存74LS688 8BIT MAGNITUDE COMPARAT 8位判决电路74LS136 2-INPUT XOR GATE 2输入异或门74LS651 BUS TRANSCEIVERS 总线收发器74LS653 BUS TRANSCEIVERS 总线收发器74LS670 3-STATE 4-BY-4 REG 3态4-4寄存器74LS73A DUAL J-K FLIP-FLOP W/CLEAR 双JK触发器。

M74HCT574B1R中文资料

M74HCT574B1R中文资料

1/11August 2001sHIGH SPEED: f MAX = 50MHz (TYP.) at V CC = 4.5V sLOW POWER DISSIPATION:I CC = 4µA(MAX.) at T A =25°CsCOMPATIBLE WITH TTL OUTPUTS : V IH = 2V (MIN.) V IL = 0.8V (MAX)sSYMMETRICAL OUTPUT IMPEDANCE:|I OH | = I OL = 6mA (MIN)sBALANCED PROPAGATION DELAYS:t PLH ≅ t PHLsPIN AND FUNCTION COMPATIBLE WITH 74 SERIES 574DESCRIPTIONThe M74HCT574 is an high speed CMOS OCTAL D-TYPE FLIP FLOP WITH 3-STATE OUTPUTS INVERTING fabricated with sub-micron silicon gate C 2MOS technology.This 8 bit D-TYPE FLIP FLOP is controlled by a clock input (CK) and an output enable input (OE).On the positive transition of the clock, the Q outputs will be set to the logic state that were setup at the D inputs.While the OE input is at low level, the eight outputs will be in a normal logic state (high or low logic level) and while OE is in high level the outputs will be in a high impedance state.The output control does not affect the internal operation of flip-flops; that is, the old data can be retained or the new data can be entered even while the outputs are off.All inputs are equipped with protection circuits against static discharge and transient excess voltage.M74HCT574OCTAL D-TYPE FLIP FLOPWITH 3 STATE OUTPUT NON INVERTINGPIN CONNECTION AND IEC LOGIC SYMBOLSORDER CODESPACKAGE TUBE T & RDIP M74HCT574B1R SOP M74HCT574M1RM74HCT574RM13TR TSSOPM74HCT574TTRM74HCT5742/11INPUT AND OUTPUT EQUIVALENT CIRCUITPIN DESCRIPTIONTRUTH TABLEZ: High ImpedanceLOGIC DIAGRAMPIN No SYMBOL NAME AND FUNCTION 1OE 3 State Output Enable Input (Active LOW)2, 3, 4, 5, 6, 7, 8, 9 D0 to D7Data Inputs 12, 13, 14, 15, 16, 17, 18, 19Q7 to Q03 State Outputs11CK Clock Input (LOW to HIGH, edge triggered)10GND Ground (0V)20V CCPositive Supply VoltageM74HCT5743/11ABSOLUTE MAXIMUM RATINGSAbsolute Maximum Ratings are those values beyond which damage to the device may occur. Functional operation under these conditions is not implied(*) 500mW at 65 °C; derate to 300mW by 10mW/°C from 65°C to 85°CRECOMMENDED OPERATING CONDITIONSSymbol ParameterValue Unit V CC Supply Voltage -0.5 to +7V V I DC Input Voltage -0.5 to V CC + 0.5V V O DC Output Voltage -0.5 to V CC + 0.5V I IK DC Input Diode Current ± 20mA I OK DC Output Diode Current ± 20mA I O DC Output Current ± 35mA I CC or I GND DC V CC or Ground Current± 70mA P D Power Dissipation 500(*)mW T stg Storage Temperature -65 to +150°C T LLead Temperature (10 sec)300°CSymbol ParameterValue Unit V CC Supply Voltage 4.5 to 5.5V V I Input Voltage 0 to V CC V V O Output Voltage 0 to V CC V T op Operating Temperature-55 to 125°C t r , t fInput Rise and Fall Time (V CC = 4.5 to 5.5V)0 to 500nsM74HCT5744/11DC SPECIFICATIONSSymbolParameterTest ConditionValue UnitV CC (V)T A = 25°C -40 to 85°C -55 to 125°C Min.Typ.Max.Min.Max.Min.Max.V IHHigh Level Input Voltage4.5 to5.5 2.02.02.0V V IL Low Level Input Voltage4.5 to5.50.80.80.8V V OH High Level Output Voltage4.5I O =-20 µA 4.4 4.5 4.4 4.4VI O =-6.0 mA 4.184.31 4.134.10V OL Low Level Output Voltage4.5I O =20 µA 0.00.10.10.1V I O =6.0 mA 0.170.260.330.40I I Input Leakage Current5.5V I = V CC or GND ± 0.1± 1± 1µA I OZ High Impedance Output Leakage Current5.5V I = V IH or V IL V O = V CC or GND ± 0.5± 5± 10µA I CC Quiescent Supply Current5.5V I = V CC or GND 44080µA ∆ I CCAdditional Worst Case Supply Current5.5Per Input pin V I = 0.5V or V I = 2.4V Other Inputs at V CC or GNDI O = 02.02.93.0mAM74HCT5745/11AC ELECTRICAL CHARACTERISTICS (C L = 50 pF, Input t r = t f = 6ns)CAPACITIVE CHARACTERISTICS1) C PD is defined as the value of the IC’s internal equivalent capacitance which is calculated from the operating current consumption without load. (Refer to Test Circuit). Average operating current can be obtained by the following equation. I CC(opr) = C PD x V CC x f IN + I CC /8 (per Flip-Flop)SymbolParameterTest ConditionValue UnitV CC (V)C L (pF)T A = 25°C -40 to 85°C -55 to 125°C Min.Typ.Max.Min.Max.Min.Max.t TLH t THL Output TransitionTime4.5507121518ns t PLH t PHL Propagation DelayTime 4.55020303845ns 150********t PZL t PZH High ImpedanceOutput Enable Time4.550R L = 1 K Ω19303845ns 150********t PLZ t PHZ High ImpedanceOutput Disable Time4.550R L = 1 K Ω19303845ns f MAX Maximum ClockFrequency4.55031502521ns t W(H)t W(H)Minimum Pulse Width (CK)4.5508151922ns t s Minimum Set-up Time4.5507151922ns t hMinimum Hold Time4.55000nsSymbolParameterTest ConditionValue UnitV CC (V)T A = 25°C -40 to 85°C -55 to 125°C Min.Typ.Max.Min.Max.Min.Max.C IN Input Capacitance 5101010pF C OUT OutputCapacitance10pF C PDPower Dissipation Capacitance (note 1)63pFM74HCT5746/11TEST CIRCUITC L = 50pF/150pF or equivalent (includes jig and probe capacitance)R 1 = 1K Ω or equivalentR T = Z OUT of pulse generator (typically 50Ω)WAVEFORM 1: CK TO Qn PROPAGATION DELAYS, CK MAXIMUM FREQUENCY, Dn TO CK SETUP AND HOLD TIMES (f=1MHz; 50% duty cycle)TESTSWITCH t PLH , t PHL Open t PZL , t PLZ V CC t PZH , t PHZGNDM74HCT5747/11WAVEFORM 2 : OUTPUT ENABLE AND DISABLE TIMES (f=1MHz; 50% duty cycle)WAVEFORM 3 : MINIMUM PULSE WIDTH(f=1MHz; 50% duty cycle)元器件交易网M74HCT574 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for theconsequences of use of such information nor for any infringement of patents or other rights of third parties which may result fromits use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specificationsmentioned in this publication are subject to change without notice. This publication supersedes and replaces all informationpreviously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices orsystems without express written approval of STMicroelectronics.© The ST logo is a registered trademark of STMicroelectronics© 2000 STMicroelectronics - Printed in Italy - All Rights ReservedSTMicroelectronics GROUP OF COMPANIESAustralia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia - Malta - MoroccoSingapore - Spain - Sweden - Switzerland - United Kingdom© 11/11。

SN74HC175PWTE4,SN74HC175PWR,SN74HC175PWR,SN74HC175PWR,SN74HC175N,SN74HC175NSR, 规格书,Datasheet 资料

SN74HC175PWTE4,SN74HC175PWR,SN74HC175PWR,SN74HC175PWR,SN74HC175N,SN74HC175NSR, 规格书,Datasheet 资料

Addendum-Page 1PACKAGING INFORMATIONOrderable DeviceStatus(1)Package Type PackageDrawingPins Package QtyEco Plan(2)Lead/Ball Finish MSL Peak Temp (3)Samples (Requires Login)84089012A ACTIVE LCCC FK 201TBD Call TI Call TI 8408901EA ACTIVE CDIP J 161TBD Call TI Call TI 8408901FA ACTIVE CFP W 161TBD Call TI Call TIJM38510/65308BEA ACTIVE CDIP J 161TBD A42N / A for Pkg Type JM38510/65308BFA ACTIVE CFP W 161TBD A42N / A for Pkg Type M38510/65308BEA ACTIVE CDIP J 161TBD A42N / A for Pkg Type M38510/65308BFA ACTIVE CFP W 161TBD A42N / A for Pkg Type SN54HC175J ACTIVE CDIP J 161TBDA42N / A for Pkg TypeSN74HC175D ACTIVE SOIC D 1640Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC175DBR ACTIVE SSOP DB 162000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC175DBRE4ACTIVE SSOP DB 162000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC175DBRG4ACTIVE SSOP DB 162000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC175DE4ACTIVE SOIC D 1640Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC175DG4ACTIVE SOIC D 1640Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC175DR ACTIVE SOIC D 162500Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC175DRE4ACTIVE SOIC D 162500Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC175DRG4ACTIVE SOIC D 162500Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC175DT ACTIVE SOIC D 16250Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC175DTE4ACTIVE SOIC D 16250Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC175DTG4ACTIVE SOIC D 16250Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC175NACTIVEPDIPN1625Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type芯天下--/Addendum-Page 2Orderable Device Status(1)Package Type PackageDrawingPins Package QtyEco Plan(2)Lead/Ball FinishMSL Peak Temp(3)Samples (Requires Login)SN74HC175NE4ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type SN74HC175NSR ACTIVE SO NS 162000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC175NSRE4ACTIVE SO NS 162000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC175NSRG4ACTIVE SO NS 162000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC175PW ACTIVE TSSOP PW 1690Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC175PWE4ACTIVE TSSOP PW 1690Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC175PWG4ACTIVE TSSOP PW 1690Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC175PWLE OBSOLETE TSSOP PW 16TBD Call TICall TISN74HC175PWR ACTIVE TSSOP PW 162000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC175PWRE4ACTIVE TSSOP PW 162000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC175PWRG4ACTIVE TSSOP PW 162000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC175PWT ACTIVE TSSOP PW 16250Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC175PWTE4ACTIVE TSSOP PW 16250Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC175PWTG4ACTIVE TSSOP PW 16250Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SNJ54HC175FK ACTIVE LCCC FK 201TBD POST-PLATE N / A for Pkg TypeSNJ54HC175J ACTIVE CDIP J 161TBD A42N / A for Pkg Type SNJ54HC175WACTIVECFPW161TBDA42N / A for Pkg Type(1)The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.芯天下--/(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check /productcontent for the latest availability information and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.OTHER QUALIFIED VERSIONS OF SN54HC175, SN74HC175 :•Catalog: SN74HC175•Military: SN54HC175NOTE: Qualified Version Definitions:•Catalog - TI's standard catalog product•Military - QML certified for Military and Defense ApplicationsAddendum-Page 3芯天下--/TAPE AND REEL INFORMATION*All dimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74HC175DBR SSOP DB 162000330.016.48.2 6.6 2.512.016.0Q1SN74HC175DR SOIC D 162500330.016.4 6.510.3 2.18.016.0Q1SN74HC175NSR SO NS 162000330.016.48.210.5 2.512.016.0Q1SN74HC175PWR TSSOP PW 162000330.012.4 6.9 5.6 1.68.012.0Q1SN74HC175PWTTSSOPPW16250330.012.46.95.61.68.012.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) SN74HC175DBR SSOP DB162000367.0367.038.0 SN74HC175DR SOIC D162500333.2345.928.6 SN74HC175NSR SO NS162000367.0367.038.0 SN74HC175PWR TSSOP PW162000367.0367.035.0SN74HC175PWT TSSOP PW16250367.0367.035.0IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,enhancements,improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B.Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All semiconductor products(also referred to herein as“components”)are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale,in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by applicable law,testing of all parameters of each component is not necessarily performed.TI assumes no liability for applications assistance or the design of Buyers’products.Buyers are responsible for their products and applications using TI components.To minimize the risks associated with Buyers’products and applications,Buyers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any patent right,copyright,mask work right,or other intellectual property right relating to any combination,machine,or process in which TI components or services are rmation published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal,regulatory and safety-related requirements concerning its products,and any use of TI components in its applications,notwithstanding any applications-related information or support that may be provided by TI.Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures,monitor failures and their consequences,lessen the likelihood of failures that might cause harm and take appropriate remedial actions.Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.In some cases,TI components may be promoted specifically to facilitate safety-related applications.With such components,TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements.Nonetheless,such components are subject to these terms.No TI components are authorized for use in FDA Class III(or similar life-critical medical equipment)unless authorized officers of the parties have executed a special agreement specifically governing such use.Only those TI components which TI has specifically designated as military grade or“enhanced plastic”are designed and intended for use in military/aerospace applications or environments.Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk,and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI has specifically designated certain components which meet ISO/TS16949requirements,mainly for automotive ponents which have not been so designated are neither designed nor intended for automotive use;and TI will not be responsible for any failure of such components to meet such requirements.Products ApplicationsAudio /audio Automotive and Transportation /automotiveAmplifiers Communications and Telecom /communicationsData Converters Computers and Peripherals /computersDLP®Products Consumer Electronics /consumer-appsDSP Energy and Lighting /energyClocks and Timers /clocks Industrial /industrialInterface Medical /medicalLogic Security /securityPower Mgmt Space,Avionics and Defense /space-avionics-defense Microcontrollers Video and Imaging /videoRFID OMAP Mobile Processors /omap TI E2E Community Wireless Connectivity /wirelessconnectivityMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2012,Texas Instruments Incorporated芯天下--/。

74HC574PW-T中文资料

74HC574PW-T中文资料
INTEGRATED CIRCUITS
DATA SHEET
For a complete data sheet, please also download:
• The IC06 74HC/HCT/HCU/HCMOS Logic Family Specifications • The IC06 74HC/HCT/HCU/HCMOS Logic Package Information • The IC06 74HC/HCT/HCU/HCMOS Logic Package Outlines
Octal D-type flip-flop; positive edge-trigger; 3-state
Product specification
74HC/HCT574
PIN DESCRIPTION
PIN NO. 1 2, 3, 4, 5, 6, 7, 8, 9 10 11 19, 18, 17, 16, 15, 14, 13, 12 20
The 74HC/HCT574 are octal D-type flip-flops featuring separate D-type inputs for each flip-flop and non-inverting 3-state outputs for bus oriented applications. A clock (CP) and an output enable (OE) input are common to all flip-flops.
GENERAL DESCRIPTION
The 74HC/HCT574 are high-speed Si-gate CMOS devices and are pin compatible with low power Schottky TTL (LSTTL). They are specified in compliance with JEDEC standard no. 7A.

74AC574MTCX中文资料

74AC574MTCX中文资料
Note 1: Absolute maximum ratings are those values beyond which damage to the device may occur. The databook specifications should be met, without exception, to ensure that the system design is reliable over its power supply, temperature, and output/input loading variables. Fairchild does not recommend operation of FACT¥ circuits outside databook specifications.
The AC/ACT574 consists of eight edge-triggered flip-flops with individual D-type inputs and 3-STATE true outputs. The buffered clock and buffered Output Enable are common to all flip-flops. The eight flip-flops will store the state of their individual D-type inputs that meet the setup and hold time requirements on the LOW-to-HIGH Clock (CP) transition. With the Output Enable (OE) LOW, the contents of the eight flip-flops are available at the outputs. When OE is HIGH, the outputs go to the high impedance state. Operation of the OE input does not affect the state of the flipflops.

74ACT574PC资料

74ACT574PC资料


2
元器件交易网
74AC574 • 74ACT574
Absolute Maximum Ratings(Note 1)
Supply Voltage (VCC) DC Input Diode Current (IIK) VI = −0.5V VI = VCC +0.5V DC Input Voltage (VI) DC Output Diode Current (IOK) VO = −0.5V VO = VCC +0.5V DC Output Voltage (VO) DC Output Source or Sink Current (IO) DC VCC or Ground Current Per Output Pin (ICC or IGND) Storage Temperature (TSTG) Junction Temperature (TJ) PDIP 140°C ±50 mA −65°C to +150°C ±50 mA −20 mA +20 mA −0.5V to VCC +0.5V −20 mA +20 mA −0.5V to VCC +0.5V −0.5V to +7.0V
Pin Names D0 – D7 CP OE O0–O7 Data Inputs Clock Pulse Input 3-STATE Output Enable Input 3-STATE Outputs Description
FACT is a trademark of Fairchild Semiconductor Corporation.
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.

74hc74中文资料

74hc74中文资料

II最大输入电压
Vcc=最大
D,CP
1
‘H74 最小 最大
-1.5
2.4 2.4
0.4 0.4 1
‘S74 最小 最大
-1.2 2.5 2.7
0.5 0.5 1
‘LS74 最小 最大
-1.5 2.5 2.7
0.4 0.5 0.1
单位 V V V mA
三毛电子世界

时输入电流
5
5.5
Vcc
74 4.75 5 5.25
输入高电平电压VIH
2
输入低电平 54
0.8
电VIL
74
0.8
输出高电平电流IOH
输出低电平 54
-400 16
电流IOL
74
16
时钟频率fCLK
0
15
脉冲宽 CP(H) 30
度tW CP(L) 37
PR(L)
30
CLR(L)
建立时 D(H) 20*
间tSU
‘74 最小 最大
Iik=-8mA
VIK输入嵌位电压
Vcc=最小
Iik=-12mA
-1.5
Iik=-18mA
VOH输出高电平 Vc=最小VIH=2V,VIL 54
2.4
电压
=最大IOH=最大
74 2.4
VOL输出低电平 Vcc=最小,VIL=最
54
0.4
电压
大,VIH=2V,IOL=最大 74
0.4
13.5
40
tPLH CP-Q
tPHL
_
CP-Q
25
15
9
25 ns
40
20
9
40

74H574使用心得

74H574使用心得

74HC574应用电路原理图寄存器是一种重要的数字电路部件, 常用来暂时存放数据、指令等。

一个触发器可以存储一位二进制代码,存放N位二进制代码,用N个触发器即可。

因为我们的模型机是8位的,因此在本模型机中大部分寄存器是8位的,标志位寄存器(Cy, Z)是二位的。

在COP2000实验仪中,寄存器由74HC574构成,它可以存放8位二进制代码,其中的一位二进制代码是由一个D触发器来存储的。

首先,我们先介绍一下74HC574的工作原理。

图2-1是74HC574的原理图。

图2-1 74HC574原理图我们可以看到,在CLK的上升沿,输入端的数据被打入到8个触发器中。

当OC = 1 时,触发器的输出被关闭,当OC=0时,触发器输出数据。

表2-1列出了74HC574的使用方法。

表2-1 74HC574使用方法从这个原理图中我们看不怎么明白在我编程的时候该怎么写代码如何使用我在这里使用了proteus软件仿真,使用KEIL软件编写代码:电路图:代码:#include <REG52.H>#define uchar unsigned char main(){P3=0X01;P2=0X01;//P3=0X00;//P2=0X00;}图2代码:#include <REG52.H>#define uchar unsigned charmain(){P3=0X01;P2=0X01;P3=0X00;//P2=0X00;}图3代码#include <REG52.H>#define uchar unsigned charmain(){P2=0X01;P3=0X01;P3=0X00;P2=0X00;}总结如果要使用74H574芯片做寄存器先要给端口赋值然后让CLK端口从低到高电频,把数据输入到寄存器,然后把CLK从搞到低锁存数据。

这个过程就是数据锁存了。

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PACKAGING INFORMATIONOrderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)SN74HCT574DBR ACTIVE SSOP DB 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HCT574DBRE4ACTIVE SSOP DB 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HCT574DW ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HCT574DWR ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HCT574DWRE4ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HCT574N ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74HCT574N3OBSOLETE PDIP N 20TBD Call TI Call TISN74HCT574NE4ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74HCT574NSR ACTIVE SO NS 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HCT574NSRE4ACTIVE SO NS 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HCT574PW ACTIVETSSOP PW 2070Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HCT574PWE4ACTIVE TSSOP PW 2070Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HCT574PWLE OBSOLETE TSSOP PW 20TBDCall TI Call TISN74HCT574PWR ACTIVE TSSOP PW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HCT574PWRE4ACTIVE TSSOP PW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HCT574PWT ACTIVE TSSOP PW 20250Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HCT574PWTE4ACTIVETSSOPPW20250Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)6-Dec-2006(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annualbasis.6-Dec-2006TAPE AND REELINFORMATION30-Apr-2007DevicePackage Pins SiteReel Diameter (mm)Reel Width (mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74HCT574DBR DB 20MLA 330168.27.5 2.51216Q1SN74HCT574DWR DW 20MLA 3302410.813.0 2.71224Q1SN74HCT574NSRNS 20MLA 330248.213.0 2.51224Q1SN74HCT574PWRPW20MLA330166.957.11.6816Q1TAPE AND REEL BOX INFORMATIONDevice Package Pins Site Length (mm)Width (mm)Height (mm)SN74HCT574DBR DB 20MLA 333.2333.228.58SN74HCT574DWR DW 20MLA 333.2333.231.75SN74HCT574NSR NS 20MLA 333.2333.231.75SN74HCT574PWRPW20MLA333.2333.228.5830-Apr-200730-Apr-2007IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use anynon-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityLow Power /lpw Telephony /telephonyWirelessVideo&Imaging /videoWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments Incorporated。

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