MC14002BCP中文资料
MC34002中文资料
Amplifiers and Comparators
In Brief . . .
For over two decades, Motorola has continually refined and updated integrated circuit technologies, analog circuit design techniques and processes in response to the needs of the marketplace. The enhanced performance of newer operational amplifiers and comparators has come through innovative application of these technologies, designs and processes. Some early designs are still available but are giving way to the new, higher performance operational amplifier and comparator circuits. Motorola has pioneered in JFET inputs, low temperature coefficient input stages, Miller loop compensation, all NPN output stages, dual–doublet frequency compensation and analog “in–the–package” trimming of resistors to produce superior high performance operational amplifiers and comparators, operating in many cases from a single supply with low input offset, low noise, low power, high output swing, high slew rate and high gain–bandwidth product at reasonable cost to the customer. Present day operational amplifiers and comparators find applications in all market segments including motor controls, instrumentation, aerospace, automotive, telecommunications, medical, and consumer products. Page Operational Amplifiers . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1–2 Single . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1–2 Dual . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1–3 Quad . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1–4 One Volt SMARTMOS™ Rail–to–Rail Dual Operational Amplifier . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1–6 High Frequency Amplifiers . . . . . . . . . . . . . . . . . . . . . . . 4.1–7 AGC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1–7 Miscellaneous Amplifiers . . . . . . . . . . . . . . . . . . . . . . . . 4.1–8 Bipolar . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1–8 CMOS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1–8 Comparators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1–9 Single . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1–9 Dual . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1–9 Quad . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1–9 Package Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1–10
74HC245电路
细的参数规格及各厂商型号替换,请以厂商数据手册为准。
生产工艺
TI 公司
ON 公司
工作电压(V)
输入电平兼容
输出电平兼容
74F
F
4.5~5.5
TTL
TTL
Bipolar 5V-Logic
LS
LS
4.75~5.25
TTL
TTL
ALS
4.5~5.5
TTL
TTL
CD4000 系列
MC1400 系列
3.0~18
DFT2,XV5T2
DTT1,DFT2
US
z 工业级温度范围: -40~85℃
07
Buffer OD
DFT2,XV5T2
DTT1,DFT2
US
08
2-Input AND
DFT2,XV5T2
US
14
Inverter-Schmitt
DFT2,XV5T2
DTT1,DFT2
US
数
优点
16
Buffer
DFT2,XV5T2
150
产品参数仅供参考,以厂家数据手册为准。批量价格,欢迎垂询。更多详情:
免费业务电话:800-880-8051 总机:027-8752 6752 传真:027-8752 6551
CMOS
CMOS
HC
HC
2.0~6.0
CMOS
CMOS
AHC
VHC
2.0~5.5
CMOS
CMOS
AHC1G
MC74VHC1G
2.0~6.0
CMOS
CMOS
CMOS 5V-Logic
HCT
HCT
4.5~5.5
MCK12140D中文资料
PIN CONNECTIONS
VCC 8 R 7 V 6 VEE 5
LOGIC DIAGRAM
1 U (fR > fV) R R S S R V D (fV > fR) Device MCH1214OD MCK12140D Q D (fV > fR) Q U (fR > fV) U
2 U
3 D
4 D
元器件交易网
Order this document By MCH12140/D
Phase Frequency Detector
The MCH/K12140 is a phase frequency-detector intended for phase-locked loop applications which require a minimum amount of phase and frequency difference at lock. When used in conjunction with the MC12147, MC12148 or MC12149 VCO, a high bandwidth PLL can be realized. The device is functionally compatible with the MC12040 phase-frequency detector, however the MOSAIC™ III process is used to push the maximum frequency to 800 MHz and significantly reduce the dead zone of the detector. When the Reference (R) and VCO (V) inputs are unequal in frequency and/or phase, the differential UP (U) and DOWN (D) outputs will provide pulse streams which when subtracted and integrated provide an error voltage for control of a VCO. The device is packaged in a small outline, surface mount 8-lead SOIC package. There are two versions of the device to provide I/O compatibility to the two existing ECL standards. The MCH12140 is compatible with MECL10H™ logic levels while the MCK12140 is compatible to 100K ECL logic levels. This device can also be used in +5.0 V systems. Please refer to Motorola Application Note AN1406/D, “Designing with PECL (ECL at +5.0 V)” for more information.
基于MC145152_2芯片的频率合成器的设计_何强
基于MC 145152-2芯片的频率合成器的设计XDesign of A Frequency Synthesizer Based on MC 145152-2何 强,王 丹(南京工业职业技术学院 江苏南京210002)【摘 要】 介绍了M C 145152-2芯片的特点,并分析了利用该芯片设计1800M Hz 频率合成器的方法。
该频率合成器具有较低的相位噪声、很高的频率稳定度,它将在移动通信等领域有广泛的应用。
关键词:频率合成器,锁相环,压控振荡器,相位噪声【Abstract 】 T he paper intro duces the characteristics o f MC145152-2,and analyzes the method of designing a 1800M Hz fr equency sy nthesizer using MC145152-2.This synthesizer has low phase noise and hig h fr equency stability ,and it will be used w idely in mo bile comm unication.Keywords :frequency sy nthesizer,PLL,VCO,phase noise1 引 言频率合成技术是现代通信的重要组成部分,它是将一个高稳定度和高准确度的基准频率经过四则运算,产生同样稳定度和准确度的任意频率。
随着大规模集成电路的发展,利用锁相环频率合成技术研制出了很多频率合成集成电路。
其中,以摩托罗拉公司的M C 14515x -2系列较为先进,本文将介绍一种基于M C145152-2芯片的频率合成器。
这种锁相环频率合成器的稳定度和准确度与基准频率相当,不产生额外的误差。
它在移动通信等领域有着广泛的应用。
2 MC 145152-2芯片的特点及功能M C145152-2芯片是摩托罗拉公司生产的锁相环频率合成器专用芯片。
MC-4R512FKE6D-840资料
GND LDQA8 GND LDQA6 GND LDQA4 GND LDQA2 GND LDQA0 GND LCTMN GND LCTM GND NC GND LROW1 GND LCOL4 GND LCOL2 GND LCOL0 GND LDQB1 GND LDQB3 GND LDQB5 GND LDQB7 GND LSCK VCMOS SOUT VCMOS NC GND NC VDD VDD NC NC NC NC
A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20 A21 A22 A23 A24 A25 A26 A27 A28 A29 A30 A31 A32 A33 A34 A35 A36 A37 A38 A39 A40 A41 A42 A43 A44 A45 A46
NC NC NC NC VREF GND SA0 VDD SA1 SVDD SA2 VDD RCMD GND RDQB8 GND RDQB6 GND RDQB4 GND RDQB2 GND RDQB0 GND RCOL1 GND RCOL3 GND RROW0 GND RROW2 GND NC GND RCFMN GND RCFM GND RDQA1 GND RDQA3 GND RDQA5 GND RDQA7 GND
NC NC NC NC VREF GND SCL VDD SDA SVDD SWP VDD RSCK GND RDQB7 GND RDQB5 GND RDQB3 GND RDQB1 GND RCOL0 GND RCOL2 GND RCOL4 GND RROW1 GND NC GND RCTM GND RCTMN GND RDQA0 GND RDQA2 GND RDQA4 GND RDQA6 GND RDQA8 GND
芬兰贝美科斯MC2中文使用手册
Part A概述A部分所讨论的内容:∙MC2简介以及这本用户指南各部分介绍∙MC2硬件概述∙MC2软件概述∙MC2的模块化结构和选件∙安全注意事项∙MC2维护简介介绍MC2是一款精致小巧的便携式校验仪,适用于压力和电信号的校验。
MC2是一款直观的、界面友好的校验仪。
MC2的尺寸设计很小巧,便于携带和使用。
MC2有较大的图形显示屏,基于菜单的操作界面和全数字化键盘。
操作校验仪和校准仪器将很快捷和简便。
除此以外,标准的充电电池和充电器使MC2更灵活。
由于有防压保护和薄膜键盘,MC2具有耐腐蚀性,可承受各种恶劣的环境。
MC2可以配置内部和外部压力模块,它为压力校验提供更大的配置可选性。
作为贝美克斯校验仪家族之一,MC2比其他产品有更高的质量标准。
MC2是一款值得信赖的多功能校验仪。
关于本手册这本用户手册分为四个部分: A, B, C 和 D.A部分讨论一些概述性的内容,此外还专门有一个章节介绍安全使用需注意的内容。
B部分讲述MC2基本的使用方法,诸如测量信号和设置显示模式和特殊测量。
C部分讲述高级配置功能的使用以及压力测量的一些附加信息。
D部分主要涉及校验和与校验有关的内容。
偶数页的抬头标注当前是在哪个部分,奇数页的抬头标注列出当前正在讨论的主题。
利用每页抬头所标注的内容可以帮助用户快速查找到需要的主题。
MC2硬件特征概述²集成防冲撞保护器²在桌上使用校验仪用的背撑²重量770克²工作温度: -10 -- +50 ℃充电时: +10 -- +40 ℃²储存温度: -20 -- +60 ℃注: 在极端的条件下长期储存,粘接物和电池可能会有影响²湿度: 0 -- 90 %RH更综合的性能指标见参考手册附录1。
连接接口压力模块内部压力模块MC2可以安装一个内部压力模块。
内部压力模块的接口已经固定在MC2上部面板中。
内部压力模块允许的压力介质是惰性的、无毒的、无爆炸性的气体。
mc2中文说明书
安全性
MC2 可以经受工业环境的考验,具有很好的防震功能。它十分精密灵
武汉联合约克仪器有限公司 编译
7
York instrument LTD
巧,对使用者的技术要求比较高。而且必须对操作手册有个好的理解。 尽量避开电磁信号源,以免影响到测量精度。 可充电电池在充电的过程中会发出少许气体,这种气体是易爆的,虽
要有超过 60V 直流、30V 交流和 100mA 的电信号。 MC2 最大输出电压低于 30V,所以输入、输出的时候千万小心。
废弃电池与材料的处理 贝美克斯很注重对环境的保护,他设计的产品很容易回收利用而不污
染环境。 欧盟和其他国家联合建立了一个体系——WEEE。WEEE/EC 要 求所有生产电器电表的厂家对产品的回收和循环利用负责。这一政策在 2005 年 8 月在欧洲市场实施。旨在保护环境、保护人类身体和维持自然资
源。标签上引有
符号的,表示可再回收利用。
建议 不要随便打开 MC2 外壳。只有具备资格的专业技术人员才能维修。 充电器不能维修,请依据环保法规妥善处理废弃的充电器。 若重新设置 MC2,同时按下回车键和开关键 5 秒钟。然后再次按下开
关键即可。重设后 MC2 的时钟回到 1970 年 1 月 1 日 0 点。记得输入正确 的时间。不建议重设。详细可咨询武汉约克仪器公司。 若清洁 MC2,用软布沾些清洁油擦拭。过几分钟,再用湿布擦干。
武汉联合约克仪器有限公司 编译
10
内部压力模块(IPM)
York instrument LTD
压力模块类型:
·IPM200mC 量程:±200mbar(±20 kPa)
·IPM2C 量程:-1 ̄+2bar(-100 ̄+200 kPa)
HMC1001 HMC1002 一维、二维磁阻微电路芯片 磁阻传感器 说明书
概述HMC1001是一维磁阻微电路,是一个单边封装(SIP)的磁场传感器,感应与管脚方向平行的磁场。
HMC1002是两维磁阻微电路,是封装在小型集成电路封装(SOIC)的双磁场传感器。
两个传感器的敏感方向互相垂直。
传感器A感应与外封装长边方向平行的磁场,传感器B感应与外封装长边方向垂直且与表面平行的磁场。
在外磁场的作用下,磁阻的变化引起输出电压(OUT+和 OUT-)的变化,并直接表示磁场的强度。
由于器件本身不需聚磁器,所以不会导致迟滞和非重复性。
芯片内置有霍尼韦尔专利的电流带,不需要外部线圈。
传感由四个800-900欧姆的磁阻臂组成惠斯通电桥,在± 2Oe 的范围内具有灵敏度为2.6mV/V/Oe的线性输出,电桥的噪声密度在1Hz以上为25nV/Hz.。
传感器的工作电压为0—10V。
电桥输出的差分放大受桥路的失调电压影响。
当工作电压为8V时,无外磁场作用下的失调电压通常为-10—25mV。
除了磁阻电桥电路之外,传感器内有有一个磁耦合电流带可进行多种模式的操作。
磁场偏置电流带(OFFSET+ 和OFFSET-)上每通过50mA的电流。
相当于在与敏感轴交叉的方向上提供1Oe的磁场。
另一种用法是在偏置电流带上提供反馈信号电流,传感器工作在闭环模式下。
参数电桥电压电桥电阻测量范围磁场分辨率(4)线性度(4)电桥失调灵敏度补偿电流带置位/复位电流带置位/复位电流干扰磁场(4)带宽噪声密度灵敏度温度系数电阻温度系数条件工作电压,-40~85℃桥路电流=10mA线性全量程带宽=0~10Hz,S/R脉冲=4A最佳曲线拟合法设置脉冲后零磁场,电桥电压=8VI offset=50mA ,电桥电压=8V从OFFSET+至OFFSET-测量从S/R+到S/R-测量0.1%的占空比,2u S电流脉冲灵敏度开始下降,需开始使用S/R脉冲磁信号,下限频率为直流1Hz,电桥电压=5VTCS,电桥电压=8V,-40~85˚CTCR,电桥电压=8V,-40~85˚C最小值600-2.0552.523.03典型值5850270.11-153.22.51.53.2529-30002500最大值121200+2.00.52304.03.51.85单位VΩGaussµ Gauss% 满量程mVmV/V/GaussΩΩAGaussMHznV/Hzppm/˚Cppm/˚C二十脚小型封装的二维磁阻传感器管脚示意图箭头所指方向为传感器产生正输出的磁场方向±1 gauss±2 gaussHMC1001/1002外另加磁场—输出电压特性曲线磁阻传感器在受到强磁场影响(>5Guass )时输出信号会变坏。
MC14018B
Output Drive Current
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ (VOH = 2.5 Vdc) ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ (VOH = 4.6 Vdc)
(VOH = 9.5 Vdc)
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ (VOH = 13.5 Vdc)
Tstg
Storage Temperature Range
TL
Lead Temperature
(8–Second Soldering)
–55 to +125
°C
–65 to +150
°C
260
°C
2. Maximum Ratings are those values beyond which damage to the device may occur.
—
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Input Voltage
“0” Level VIL
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ (VO = 4.5 or 0.5 Vdc)
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ (VO = 9.0 or 1.0 Vdc)
IOH Source
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ (VOL = 0.4 Vdc) ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ (VOL = 0.5 Vdc)
(VOL = 1.5 Vdc)
Sink IOL
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Input Current
MC14541BCPG中文资料
1
A
= Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
G or G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
14
MC14541BCP AWLYYWWG 1
14
SOIC−14 D SUFFIX CASE 751A
14541BG AWLYWW
1
TSSOP−14 DT SUFFIX CASE 948G
14
14 541B ALYWG
G
1
SOEIAJ−14 F SUFFIX CASE 965
14
MC14541B ALYWG
Unit
VDD
DC Supply Voltage Range
−0.5 to +18.0
V
Vin, Vout
Input or Output Voltage Range, (DC or Transient)
−0.5 to VDD + 0.5
V
Iin
Input Current (DC or Transient)
15 – 16.3
−
– 13.2 – 26.33
mAdc
−
– 4.49
−
−
– 2.37ຫໍສະໝຸດ −−− 9.24
−
5.0
1.93
−
1.56
3.12
10
4.96
−
4.0
8.0
15
19.3
ADF4252BCP-REEL7资料
元器件交易网
1 = V 2 = V 3 = DV = 3 V ؎ 10%, DV R = 2.7 k⍀, dBm referred to 50 ⍀, T = T ADF4252–SPECIFICATIONS1 (V
DD DD DD DD SET A
< VP1, VP2 < 5.5 V, GND = 0 V, MIN to TMAX, unless otherwise noted.)
Unit GHz min/max dBm min/max GHz min/max MHz max MHz max MHz min/max dBm min/max MHz max MHz max MHz max V p-p min/max µA max pF max mA typ µA typ mA typ µA typ nA typ % typ k⍀ typ % typ % typ % typ V min V max µA max pF max V min V max V min/V max V min/V max mA typ mA typ mA typ µA typ dBc/Hz typ dBc/Hz typ dBc/Hz typ dBc/Hz typ
NOTES 1 Operating Temperature Range (B Version): –40 °C to +85 °C. 2 Use a square wave for frequencies less than f MIN. 3 RF = 1 GHz, RF PFD = 10 MHz, MOD = 4095, IF = 500 MHz, IF PFD = 200 kHz, REF = 10 MHz, V DD = 3 V, VP1 = 5 V, and VP2 = 3 V. 4 The in-band phase noise is measured with the EVAL-ADF4252EB2 evaluation board and the HP5500E phase noise test system. The spectrum analyzer provides the REFIN for the synthesizer (fREFOUT = 10 MHz @ 0 dBm). fOUT = 1.74 GHz, fREF = 20 MHz, N = 87, Mod = 100, Channel Spacing = 200 kHz, V DD = 3.3 V, and VP = 5 V. Specifications subject to change without notice.
MC9S12_datasheet中文
目录 .................................................................................................................................................. I 第一章 PWM模块 ...........................................................................................................................1 第一节 PWM模块介绍 .........................................................................................................1 第二节 PWM寄存器简介 .......................................................................2 2.1 PWME寄存器 ........................................................................................................2 2.2 PWMPOL寄存器...................................................................................................2 2.3 PWMCLK寄存器 ..................................................................
MC14106B中文资料
MC14106B 中文资料目录元件的最大额定值 (1)MC14106B功能介绍 (1)电气特性 (3)芯片转换特性 (4)芯片应用举例 (4)应用1 按键防抖 (4)应用2 积分电路 (5)MC14106B封装信息 (6)PDIP-14封装 (6)SOIC-14封装 (7)TSSOP-14封装 (8)元件的最大额定值条件之上进行功能操作。
长期暴露在高于推荐工作条件的环境下可能会影响器件的可靠性。
表中的电压值均为对地电压。
MC14106B功能介绍MC14106B共14个引脚,其中14号引脚为VDD(+),7号引脚为VSS (-),其余引脚为输入输出引脚,1,3,5,9,11,13号引脚为输入引脚,2,4,6,8,10,12号引脚为输出引脚。
内部逻辑如图1如所示,从图1中我们可以看出,MC14106B内部共有6组相同功能施密特触发器,每组施密特触发器的逻辑如图2所示。
图1图2下面通过图3所示施密特触发器讲解其工作过程。
其工作时序如图4所示。
当输入端输入低电平(VSS)时,输出端输出高电平(V OH)。
当输入端电平变为高电平(VDD)时,输出端电平经过一小段时间后也会发生变化,变为低电平(V OL)。
当输入端电平由VDD变为VSS后,一小段时间后,输出端电平变为高电平(V OH)。
施密特触发器最重要的是以下几个参数:从输入端电平由低到高变化到50%时,至输出端电平由高到低变化变化至50%时的时间记做t PHL;从输入端电平由高到低变化到50%时,至输出端电平由低到高变化变化至50%时的时间记做t PLH。
当输出端产生下调沿时,电平从90%变化至10%所用的时间t f;当输出端产生上跳沿时,电平从10%变化至90%所用的时间t r。
这些参数主要与VDD有关,可以通过下面提供的电气特性表格查出典型值。
图3图4通过图5进一步讲解施密特触发器的工作流程。
当输入端的电平达到V T+之后,输出端电平才会发生负跳变,当输入端平超过V T+之后,即使略低于该值,输出端不会发生负跳变,直到当输入端电平低于V T-,输出端才会发生正跳变。
MC14538BCPG中文资料
ORDERING INFORMATION Device
Package
Shipping†
MC14538BCP
PDIP−16
500 Units / Rail
MC14538BCPG
PDIP−16 (Pb−Free)
500 Units / Rail
MC14538BD
SOIC−16
48 Units / Rail
元器件交易网
MC14538B
Dual Precision Retriggerable/Resettable Monostable Multivibrator
The MC14538B is a dual, retriggerable, resettable monostable multivibrator. It may be triggered from either edge of an input pulse, and produces an accurate output pulse over a wide range of widths, the duration and accuracy of which are determined by the external timing components, CX and RX. Output Pulse Width T = RX @ CX (secs)
Publication Order Number: MC14538B/D
元器件交易网
MC14538B
PIN ASSIGNMENT
VSS 1 CX/RXA 2 RESET A 3
AA 4 BA 5 QA 6 QA 7 VSS 8
16 VDD 15 VSS 14 CX/RXB 13 RESET B 12 AB 11 BB 10 QB 9 QB
奥的斯电梯调试资料
调试手册奥的斯电梯有限公司文件编号:OH-CONB863_SUR_ZH原始会签记录授权AUTH. CAL4804部件版本注意:部件版本可能会随时更新,有需要最新部件版本参数和I/O表,请上工程中心网站读取或下载。
更改记录This work and the information it contains are the property of Xizi Otis Elevator Company (“XOEC”). It is delivered~others on the express condition that it will be used only for, or on behalf of, XOEC; that neither it nor the information it contains will be reported or disclosed, in whole or in part, without the prior written consent of XOEC, and that on demand it and any copies will be promptly returned~XOEC.目录1概述.......................................................... 错误!未定义书签。
2检修模式运行条件检查.......................................... 错误!未定义书签。
3检修模式GECB上电检查......................................... 错误!未定义书签。
4变频器参数设置................................................ 错误!未定义书签。
5MCBC参数确认 ................................................. 错误!未定义书签。
MOTOROLA Semiconductor MC14093B 数据手册
MOTOROLA CMOS LOGIC DATA MC14093BQuad 2-Input NAND"Schmitt TriggerThe MC14093B Schmitt trigger is constructed with MOS P–channel and N–channel enhancement mode devices in a single monolithic structure.These devices find primary use where low power dissipation and/or high noise immunity is desired. The MC14093B may be used in place of the MC14011B quad 2–input NAND gate for enhanced noise immunity or to “square up” slowly changing waveforms.•Supply Voltage Range = 3.0 Vdc to 18 Vdc•Capable of Driving Two Low–Power TTL Loads or One Low–Power Schottky TTL Load Over the Rated T emperature Range •Triple Diode Protection on All Inputs •Pin–for–Pin Compatible with CD4093•Can be Used to Replace MC14011B•Independent Schmitt–Trigger at each InputMAXIMUM RATINGS* (Voltages Referenced to V SS )Symbol ParameterValue Unit V DDDC Supply Voltage– 0.5 to + 18.0V V in , V out Input or Output Voltage (DC or Transient)– 0.5 to V DD + 0.5VI in , I out Input or Output Current (DC or Transient),per Pin± 10mAP DPower Dissipation, per Package†500mW T stg Storage T emperature– 65 to + 150_C T LLead T emperature (8–Second Soldering)260_C*Maximum Ratings are those values beyond which damage to the device may occur.†Temperature Derating:Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C Ceramic “L” Packages: – 12 mW/_C From 100_C To 125_CEQUIVALENT CIRCUIT SCHEMATIC(1/4 OF CIRCUIT SHOWN)This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, V in and V out should be constrained to the range V SS ≤ (V in or V out ) ≤ V DD .Unused inputs must always be tied to an appropriate logic voltage level (e.g., either V SS or V DD ). Unused outputs must be left open.MOTOROLA SEMICONDUCTOR TECHNICAL DATA© Motorola, Inc. 1995REV 31/94MC14077B Ċ See Page 6-160MC14078B, MC14081B, MC14082B ĊSee Page 6-5MC14093BL SUFFIX CERAMIC CASE 632ORDERING INFORMATIONMC14XXXBCP Plastic MC14XXXBCL Ceramic MC14XXXBDSOICT A = – 55° to 125°C for all packages.P SUFFIX PLASTIC CASE 646D SUFFIX SOIC CASE 751ALOGIC DIAGRAM1311V DD = PIN 14V SS = PIN 7104312986521查询MC14093BCL供应商ELECTRICAL CHARACTERISTICS (Voltages Referenced to V SS )V – 55_C 25_C 125_CCharacteristicSymbol DD Vdc Min Max Min Typ #Max Min Max Unit Output Voltage“0” LevelV in = V DD or 0V OL5.01015———0.050.050.05———0000.050.050.05———0.050.050.05Vdc“1” LevelV in = 0 or V DDV OH5.01015 4.959.9514.95——— 4.959.9514.95 5.01015——— 4.959.9514.95———VdcOutput Drive Current(V OH = 2.5 Vdc) Source(V OH = 4.6 Vdc)(V OH = 9.5 Vdc)(V OH = 13.5 Vdc)I OH5.05.01015– 3.0– 0.64– 1.6– 4.2————– 2.4– 0.51– 1.3– 3.4– 4.2– 0.88– 2.25– 8.8————– 1.7– 0.36– 0.9– 2.4————mAdc(V OL = 0.4 Vdc) Sink(V OL = 0.5 Vdc)(V OL = 1.5 Vdc)I OL5.010150.641.64.2———0.511.33.40.882.258.8———0.360.92.4———mAdcInput Current I in15—± 0.1—±0.00001± 0.1—± 1.0µAdc Input Capacitance(V in = 0)C in———— 5.07.5——pF Quiescent Current(Per Package)I DD5.01015———0.250.51.0———0.00050.00100.00150.250.51.0———7.51530µAdcTotal Supply Current**†(Dynamic plus Quiescent,Per Package)(C L = 50 pF on all outputs, all buffers switching)I T5.01015I T = (1.2 µA/kHz) f + I DD I T = (2.4 µA/kHz) f + I DD I T = (3.6 µA/kHz) f + I DDµAdcHysteresis VoltageV H †5.010150.31.21.6 2.03.45.00.31.21.6 1.11.72.1 2.03.45.00.31.21.6 2.03.45.0VdcThreshold VoltagePositive–GoingV T+5.01015 2.24.66.8 3.67.110.8 2.24.66.8 2.95.98.8 3.67.110.8 2.24.66.8 3.67.110.8VdcNegative–GoingV T–5.010150.92.54.02.85.27.40.92.54.01.93.95.82.85.27.40.92.54.02.85.27.4Vdc#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.**The formulas given are for the typical characteristics only at 25_C.†To calculate total supply current at loads other than 50 pF:I T (C L ) = I T (50 pF) + (C L – 50) Vfkwhere: I T is in µA (per package), C L in pF , V = (V DD – V SS ) in volts, f in kHz is input frequency, and k = 0.004.MOTOROLA CMOS LOGIC DATAMC14093BSWITCHING CHARACTERISTICS (C L = 50 pF, T A = 25_C)CharacteristicSymbol V DDVdc Min Typ #Max Unit Output Rise Timet TLH5.01015———100504020010080nsOutput Fall Timet THL5.01015———100504020010080nsPropagation Delay Timet PLH , t PHL5.01015———125504025010080ns#Data labeled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.Figure 1. Switching Time Test Circuit and WaveformsPULSEGENERATORV DD OUTPUTC LV SS714INPUT20 ns 20 nsV DD V SS V OH V OLt PLHt PHL OUTPUTINPUT t THL t TLH90%50%10%90%50%10%V outV inV H V DDV SS V DDV SS(a) Schmitt Triggers will square up (a) inputs with slow rise and fall times.(b) A Schmitt trigger offers maximum (b) noise immunity in gate applications.V H V outV inV DDV SS V DDV SSFigure 2. Typical Schmitt Trigger ApplicationsFigure 3. Typical Output Source Characteristics Test Circuit V DS , DRAIN VOLTAGE (Vdc)–10–8.0–6.0–4.0–2.00–2.0–4.0–6.0–8.0–10I O H , D R A I N C U R R E N T (m A d c )Figure 4. Typical Output Sink Characteristics Test CircuitV DS , DRAIN VOLTAGE (Vdc)0 2.04.0 6.08.010108.06.04.02.0I O L , D R A I N C U R R E N T (m A d c )147V GS V outI OHAll unused inputs connected to ground.All unused inputs connected to ground.147V outI OLV GSV o u t , O U T P U T V O L T A G E (V d c )V DD 0V DDV T–V T+V HV in , INPUT VOLTAGE (Vdc)Figure 5. Typical Transfer CharacteristicsV GS = –5.0 Vdcc b acbcb aa –15 Vdc–10 Vdca T A = –55°Cb T A = +25°C bT A = +125°Cab ca b cab c5.0 Vdca T A = –55°Cb T A = +25°C cT A = +125°CPIN ASSIGNMENT1112131489105432176OUT C OUT D IN 1D IN 2D V DD IN 1CIN 2C OUT B OUT A IN 2A IN 1A V SSIN 2B IN 1B 15 VdcV GS = 10 VdcMOTOROLA CMOS LOGIC DATAMC14093BCASE 632–08ISSUE YDIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.7500.78519.0519.94B 0.2450.280 6.237.11C 0.1550.200 3.94 5.08D 0.0150.0200.390.50F 0.0550.065 1.40 1.65G 0.100 BSC 2.54 BSC J 0.0080.0150.210.38K 0.1250.170 3.18 4.31L 0.300 BSC 7.62 BSC M 0 15 0 15 N0.0200.0400.51 1.01____NOTES:1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.2.CONTROLLING DIMENSION: INCH.3.DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL.4.DIMENSION F MAY NARROW TO 0.76 (0.030)WHERE THE LEAD ENTERS THE CERAMIC BODY.–A––B–C 14 PLDG FNK14 PLJM LSBM0.25 (0.010)T SAM0.25 (0.010)T –T–SEATINGPLANE17149P SUFFIXPLASTIC DIP PACKAGECASE 646–06ISSUE LNOTES:1.LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE POSITION AT SEATING PLANE AT MAXIMUM MATERIAL CONDITION.2.DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL.3.DIMENSION B DOES NOT INCLUDE MOLD FLASH.4.ROUNDED CORNERS OPTIONAL.17148BA FHGDKCNLJMSEATINGPLANEDIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.7150.77018.1619.56B 0.2400.260 6.10 6.60C 0.1450.185 3.69 4.69D 0.0150.0210.380.53F 0.0400.070 1.02 1.78G 0.100 BSC 2.54 BSC H 0.0520.095 1.32 2.41J 0.0080.0150.200.38K 0.1150.135 2.92 3.43L 0.300 BSC 7.62 BSC M 0 10 0 10 N0.0150.0390.39 1.01____How to reach us:USA/EUROPE/Locations Not Listed: Motorola Literature Distribution;JAPAN: Nippon Motorola Ltd.; T atsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center, P.O. Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 or 602–303–54543–14–2 T atsumi Koto–Ku, T okyo 135, Japan. 03–81–3521–8315MFAX:****************–TOUCHTONE602–244–6609ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B T ai Ping Industrial Park, INTERNET: http://Design–51 Ting Kok Road, T ai Po, N.T., Hong Kong. 852–26629298。
Moxa MC-1200 Series计算机简介及技术支持信息说明书
P/N: 1802012004013 *1802012004013*MC-1200 SeriesQuick Installation GuideVersion 3.0, September 2020Technical Support Contact Information/supportMoxa Americas:Toll-free: 1-888-669-2872 Tel: 1-714-528-6777 Fax: 1-714-528-6778 Moxa China (Shanghai office): Toll-free: 800-820-5036 Tel: +86-21-5258-9955 Fax: +86-21-5258-5505 Moxa Europe:Tel: +49-89-3 70 03 99-0 Fax: +49-89-3 70 03 99-99 Moxa Asia-Pacific:Tel: +886-2-8919-1230 Fax: +886-2-8919-1231 Moxa India:Tel: +91-80-4172-9088 Fax: +91-80-4132-10452020 Moxa Inc. All rights reserved.OverviewThe MC-1200 Series computers are built around a 7th Gen Intel® Celeron® or Intel® Core™ i3, i5, or i7 CPU and come with 1 HDMI display port, 3 USB 3.0 ports, 2 gigabit LAN ports, and 2 3-in-1 RS-232/422/485 serial ports. The MC-1200 is equipped with a 2.5”HDD/SSD slot and a built-in TPM 2.0 module.Additional value and convenience is provided through a modular design with three independent slots for flexible system integration and expansion. Users have the option to add a variety of different communications modules, including Wi-Fi, 3G, LTE, GPS, and mSATA expansion modules.The MC-1200 is designed to operate reliably in extreme conditions, such as continuous exposure to low or high temperatures, humidity, high vibration, and power surges, making them perfect for heavy industry, solar grid, water/wastewater, oil and gas, and transportation applications.Package ChecklistBefore installing the MC-1200, verify that the package contains the following items:•MC-1200 embedded computer•Terminal block to power jack converter•DIN-rail mounting kit•Quick installation guide (printed)•Warranty cardPlease notify your sales representative if any of the above items are missing or damaged.Panel LayoutThe panel layouts of the MC-1200 are shown in the following illustrations:Front ViewTop ViewBottom ViewLED IndicatorsThe following table describes the function of the LED indicators located on the front panel of the MC-1200:LED Name StatusDescriptionPowerGreenPower is on and computer isfunctioning normally OffPower is offStorage 1 (mSATA)Yellow Blinking: Data transmission Off No data transmission.LAN 1/2(on connectors)GreenSteady On: 100 Mbps Ethernet link Blinking: Data is being transmitted YellowSteady On: 1000 Mbps Ethernet linkBlinking: Data is being transmitted Off10 Mbps Ethernet link or LAN is notconnectedTx 1/2Green Blinking: Data is being transmitted. Off No connectionRx 1/2Yellow Blinking: Data is being transmitted. Off No connectionInstalling the MC-1200DIN-rail MountingThe MC-1200 comes with a DIN-rail mounting kit. To install the DIN-rail mounting kit, do the following: STEP 1:Use the 4 screws included with thekit to attach the DIN-rail mountingbracket to the MC-1200’s rearpanel and tighten the screws tosecure the bracket to the MC-1200.STEP 2:Insert the top of the DIN rail intothe slot just below the upper hookof the DIN-rail mounting kit.STEP 3:Press the MC-1200 towards theDIN rail until it snaps into place.Removal:STEP 1:Pull down the latch on themounting kit with a screwdriver.STEP 2 & 3:Slightly pull the MC-1200 forwardand lift it up to remove it from theDIN rail.For the specifications of the DIN-rail mounting screws, refer tothe illustration on the right andadhere to these values to securethe DIN-rail bracket to the rearpanel of the computer.Wall MountingThe MC-1200 can be installed on a wall by using the optional wall-mounting kit. The wall-mounting kit must be purchased separately.STEP 1:Use three screws for each bracket and attach the brackets to the rear of the MC-1200.Refer to the figure on the right for the specifications of the screws used to attach the mounting brackets.STEP 2:Use two screws per bracket to attach the MC-1200 to a wall or cabinet. Note:Mounting the MC-1200 to a wall requires four screws. Use the MC-1200 computer, with the optional wall-mounting brackets attached, as a guide to mark the correct locations of the screws on the wall.The heads of the screws should be less than 6.0 mm in diameter, and the shafts should be less than 3.5 mm in diameter as shown in the figure on the right. Do not drive the screws in all the way; leave a space of about 2 mm to allow room for sliding the wall-mounting bracket between the wall and the screws.Connector DescriptionPower ConnectorUse an LPS (9-36 VDC) or Class 2 power cord to connect to the MC-1200's terminal block to power jack converter and then turn on the power. If the power is supplied properly, the Power LED will light up. The OS is ready when the Power LED glows a solid green.Grounding the MC-1200 Grounding and wire routing help limit the effects of noise due to electromagnetic interference (EMI). Run the groundconnection from the grounding screw (M4) to the grounding surface prior to connecting the power as shown in the illustration on the right.Terminal BlockTerminal block (JP1)—R/C (XCFR2, XCFR8), socket soldered on to the PWB, DINKLE ENTERPRISE CO., LTD, type 2EHDRM, rated 300 V, 15 A, 105°C. Mating with plug type 2RSDAM, 2ESDPM, 2ESDPLM or 2ESDVM, rated 300 V, 15 A, 105°C. The plug-half connection is secured byscrews; suitable for 12 to 24 AWG wire size, secured on plug by screws with a torque value of 0.5 N-m (4.4253 lb-in).Ethernet PortsThe 10/100/1000 Mbps Ethernet ports use RJ45 connectors. Pin 10/100 Mbps1000 Mbps 1 ETx+ TRD(0)+ 2 ETx- TRD(0)- 3 ERx+ TRD(1)+ 4 – TRD(2)+ 5 – TRD(2)- 6 ERx- TRD(1)- 7 – TRD(3)+ 8–TRD(3)-Serial PortsThe serial ports use DB9 connectors. Each port can be configured by software as a RS-232, RS-422, or RS-485 port. The pin assignments for the ports are shown below: Pin RS-232 RS-422RS-485 (4-wire) RS-485 (2-wire)1DCD TxDA(-) TxDA(-)– 2 RxD TxDB(+) TxDB(+) –3 TxD RxDB(+) RxDB(+) DataB(+)4 DTR RxDA(-) RxDA(-) DataA(-)5 GND GND GND GND6 DSR – – –7 RTS – – – 8CTS– – –USIM SlotThe MC-1200 has two USIM slots for 3G/LTE wireless Internetconnections. Each slot supports dual USIM cards. To install a USIM card, gently remove the outer cover on the bottom panel, and then insert the USIM card into the slot. USB HostsThe MC-1200 has 3 USB 3.0 Type-A connectors located on the front panel. The ports support keyboard and mouse devices, and can also be used to connect a flash disk for storing large amounts of data. HDMI ConnectorThe MC-1200 has an HDMI connector located on the front panel, allowing users to connect to an audio or video device.Installing Communications ModulesThe MC-1200 Series comes with three sockets for installing various communications modules. Unfasten the screws on the right side of the computer and remove the cover to find the locations of these sockets as shown below:Installing the mSATA ModuleInsert the mSATA module into thesocket and tighter the two screwson the mSATA module to secure it.Installing the Wi-Fi ModuleThe MC-1200 comes with two sockets for users to install up to two Wi-Fi/cellular modules for wireless communication.Wi-Fi Module PackageThe contents of the Wi-Fi module package are shown below:Follow these steps to install the Wi-Fi module in the MC-1200.1.Attach the Wi-Fi module to themounting plate with twoscrews.2.Remove the transparentplastic and the blue cover onboth sides of the thermal padand then place it on the topheat sink. Also, remove theblue cover on the heat sink.3.Place the heat sink with thethermal pad at the center ofthe wireless module socket. 4.Insert the Wi-Fi module (withthe mounting plate) into thesocket and fasten the twoblack screws on the mountingplate to secure it.5.Attach one end of the Wi-Fiantenna cable to theconnector on the Wi-Fi moduleand the insert the other end(with the threaded connectionring) through the antennamounting hole on the frontpanel of the computer.Remove the protection coveron the mounting hole beforeyou do so.6.Insert the locking washerthrough the threadedconnection ring and hold itagainst the front panel.Secure the antenna connectorin place by tightening a nutonto the threaded protectionring.7. Connect the Wi-Fi antenna tothe connector on the front panel.8. Use this method to connectanother Wi-Fi antenna, if necessary.9. Reattach the right side coveron to the computer and fasten the screws to secure it.Installing the Cellular ModuleThe MC-1200 comes with two sockets for users to install up to two Wi-Fi/cellular modules for wireless communication. Cellular Module PackageThe contents of the Wi-Fi module package are shown below:Follow these steps to install the cellular module in the MC-1220. 1. Remove thetransparent plastic and the blue covers on both sides of the thermal pad and then place it on top of the heat sink. Also, remove the blue cover on the heat sink.2. Place the heat sinkwith the thermal pad at the center of the cellular module socket.3. Insert the cellularmodule in the socket and fasten the two black screws on the module to secure it.4. There are threeconnectors on the cellular module: a GPS antennaconnector and two cellular antenna connectors.5. Attach one end of thecellular antennacable to a connector on the cellular module and theinsert the other end (with the threaded connection ring)through the antenna mounting hole on the front panel of the computer. Remove theprotection cover on the mounting hole before you do so.6. Insert the lockingwasher through the threaded connection ring and hold it against the front panel. Secure the antenna connector in place by tightening a nut onto thethreaded protection ring.7. Connect the cellularantenna to theconnector provided on the front panel. 8. Use this method toconnect anothercellular antenna and the GPS antenna, if necessary.9. Reattach the rightside cover on to the computer and fasten the screws to secure it.Installing SIM CardsFollow these steps to install SIM cards for a cellular module. 1. Remove the screws onthe bottom panel of the computer and remove the cover. You will see four SIM card slots.2. Insert a card into theSIM 1 slot. Make sure you insert the card in the right direction as indicated in the image beside the slot.3. Insert the other cardinto the SIM 2 slot, if necessary.4. Replace the computercover and secure it by fastening the screws.Switching Between the Wireless Module SocketAs there are two wireless module sockets and you can install the Wi-Fi or the cellular module in either of the sockets, a DIP switch is provided to enable selection of the Wi-Fi or cellular module installed. The DIP switch is located below the mSATA socket as shown in the following illustration.The DIP switch operation is explained below:Status Switch 1 Switch 2 ONWi-FiWi-Fi OFF (default)CellularCellularFor example, if you have installed a Wi-Fi module in the first socket, you need to turn the DIP switch 1 to the ON status.ATEX and IECEx DetailsModelsMC-1220-KLX-T-YYYY (X = 0-9; Y = A-Z, 0-9, dash or blank, if without Y, dash can be blank) (for marketing purpose only and no impact safety related constructions and critical components)Rating 9 to 36 VDC, 8 AATEXInformationII 3 GDEMKO20 ATEX 2386X Ex nA nC T4 GcAmbient Range: -40°C ≤ Tamb ≤ +70°C Rated Cable Temp.≥ 130°C IECExCertificate No.IECEx UL 20.0069X。
mc14053bcp工作原理
mc14053bcp工作原理
摘要:
1.mc14053bcp 的概述
2.mc14053bcp 的工作原理
3.mc14053bcp 的应用领域
正文:
【概述】
mc14053bcp 是一种电子元器件,属于模拟ic 芯片的一种。
它的全称是“多路开关控制电路”,广泛应用于各种电子设备中,如计算机、通信设备、仪器仪表等。
【工作原理】
mc14053bcp 的工作原理主要基于其内部的开关电路。
它内部有多个开关,可以接收外部的控制信号,根据控制信号的不同,选择将输入信号切换到不同的输出端。
具体来说,当控制信号为高电平时,开关闭合,输入信号被切换到对应的输出端;当控制信号为低电平时,开关断开,输入信号不会切换到对应的输出端。
mc14053bcp 的另一个重要功能是信号放大。
当输入信号较弱时,可以通过mc14053bcp 进行信号放大,从而使得信号能够更好地被后续电路处理。
【应用领域】
mc14053bcp 广泛应用于各种电子设备中,主要用于实现信号的切换和
放大。
例如,在计算机中,它可以用于实现键盘、鼠标等外部设备的信号切换和放大;在通信设备中,它可以用于实现信号的切换和放大,从而提高信号的质量和稳定性;在仪器仪表中,它可以用于实现各种传感器的信号切换和放大,从而提高仪器仪表的精度和可靠性。
MC1413BP中文资料
1.0
Maximum Typical
0.5 0 0 5.0 6.0 7.0 8.0
9.0
10
11
12
20
30 % DUTY CYCLE
50
70
100
VI, INPUT VOLTAGE (V)
MOTOROLA ANALOG IC DEVICE DATA
ELECTRICAL CHARACTERISTICS (TA = 25°C, unless otherwise noted)
Characteristic Output Leakage Current (VO = 50 V, TA = +85°C) (VO = 50 V, TA = +25°C) (VO = 50 V, TA = +85°C, VI = 1.0 V) Collector–Emitter Saturation Voltage (IC = 350 mA, IB = 500 µA) (IC = 200 mA, IB = 350 µA) (IC = 100 mA, IB = 250 µA) Input Current – On Condition (VI = 3.85 V) (VI = 5.0 V) (VI = 12 V) Input Voltage – On Condition (VCE = 2.0 V, IC = 200 mA) (VCE = 2.0 V, IC = 250 mA) (VCE = 2.0 V, IC = 300 mA) (VCE = 2.0 V, IC = 125 mA) (VCE = 2.0 V, IC = 200 mA) (VCE = 2.0 V, IC = 275 mA) (VCE = 2.0 V, IC = 350 mA) Input Current – Off Condition (IC = 500 µA, TA = 85°C) DC Current Gain (VCE = 2.0 V, IC = 350 mA) Input Capacitance Turn–On Delay Time (50% EI to 50% EO) Turn–Off Delay Time (50% EI to 50% EO) Clamp Diode Leakage Current (VR = 50 V) Clamp Diode Forward Voltage (IF = 350 mA) TA = +25°C TA = +85°C All Types All Types MC1416, B VCE(sat) All Types All Types All Types II(on) MC1413, B MC1416, B MC1416, B VI(on) MC1413, B MC1413, B MC1413, B MC1416, B MC1416, B MC1416, B MC1416, B All Types II(off) hFE CI ton toff IR VF – – – – – – – 50 1000 – – – – – – – – – – – – – 100 – 15 0.25 0.25 – – 1.5 2.4 2.7 3.0 5.0 6.0 7.0 8.0 – – 30 1.0 1.0 50 100 2.0 µA – pF µs µs µA V – – – 0.93 0.35 1.0 1.35 0.5 1.45 V – – – 1.1 0.95 0.85 1.6 1.3 1.1 mA Symbol ICEX – – – – – – 100 50 500 V Min Typ Max Unit µA
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MC14073B Triple 3–Input AND Gate
1 2 8 3 4 5 11 12 13 9
3 INPUT
6
6
6
6
10
10
10
10
MC14002B Dual 4–Input NOR Gate
2 3 4 5 9 10 11 12
MC14012B Dual 4–Input NAND Gate
MC14001B MC14002B MC14011B MC14012B MC14023B MC14025B MC14068B MC14071B MC14072B MC14073B MC14075B MC14078B MC14081B MC14082B
L SUFFIX CERAMIC CASE 632
P SUFFIX PLASTIC CASE 646
D SUFFIX SOIC CASE 751A
ORDERING INFORMATION
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎ
MC14071B Quad 2–Input OR Gate
IN 1A IN 2A OUTA OUTB IN 1B IN 2B VSS 1 2 3 4 5 6 7 14 13 12 11 10 9 8 VDD IN 2D IN 1D OUTD OUTC IN 2C IN 1C
MC14072B Dual 4–Input OR Gate
OUTA IN 1A IN 2A IN 3A IN 4A NC VSS 1 2 3 4 5 6 7 14 13 12 11 10 9 8 VDD OUTB IN 4B IN 3B IN 2B IN 1B NC
10
11
11
11
11
MC14025B Triple 3–Input NOR Gate
1 2 8 3 4 5 11 12 13 9
MC14023B Triple 3–Input NAND Gate
1 2 8 3 4 5 11 12 13 9
MC14075B Triple 3–Input OR Gate
2 3 4 5 9 10 11 12
MC14072B Dual 4–Input OR Gate
2 3 4 5 9 10 11 12
MC14082B Dual 4–Input AND Gate
2 3 4 5 9 10 11 12
4 INPUT
1
1
1
1
13 NC = 6, 8
13 NC = 6, 8
13 NC = 6, 8
Quad 2-Input NOR Gate Dual 4-Input NOR Gate Quad 2-Input NAND Gate Dual 4-Input NAND Gate Triple 3-Input NAND Gate Triple 3-Input NOR Gate 8-Input NAND Gate Quad 2-Input OR Gate Dual 4-Input OR Gate Triple 3-Input AND Gate Triple 3-Input OR Gate 8-Input NOR Gate Quad 2-Input AND Gate Dual 4-Input AND Gate
13 NC = 6, 8
MC14078B 8–Input NOR Gate
2 3 4 5 9 10 11 12 2 3 4 5 9 10 11 12
MC14068B 8–Input NAND Gate
VDD = PIN 14 VSS = PIN 7 FOR ALL DEVICES 13
8 INPUT
MC14023B Triple 3–Input NAND Gate
IN 1A IN 2A IN 1B IN 2B IN 3B OUTB VSS 1 2 3 4 5 6 7 14 13 12 11 10 9 8 VDD IN 3C IN 2C IN 1C OUTC OUTA IN 3A
MC14025B Triple 3–Input NOR Gate
REV 3 1/94
©MOTOROLA Motorola, Inc. 1995 CMOS LOGIC DATA
MC14001B 7
元器件交易网
LOGIC DIAGRAMS
NOR MC14001B Quad 2–Input NOR Gate
1 2
NAND MC14011B Quad 2–Input NAND Gate
1 2 5 6 8 9 12 13
OR MC14071B Quad 2–Input OR Gate
1 2 5 6 8 9 12 13
AND MC14081B Quad 2–Input AND Gate
1 2 5 6 8 9 12 13
3
3
3
3
2 INPUT
5 6 8 9 12 13
4
4
4
4
10
10
10
MC14XXXBCP MC14XXXBCL MC14XXXBD Plastic Ceramic SOIC TA = – 55° to 125°C for all packages.
MAXIMUM RATINGS* (Voltages Referenced to VSS)
Symbol VDD Parameter DC Supply Voltage
13
NC = 6, 8
NC = 6, 8
MC14001B 8
MOTOROLA CMOS LOGIC DATA
元器件交易网
PIN ASSIGNMENTS
MC14001B Quad 2–Input NOR Gate
IN 1A IN 2A OUTA OUTB IN 1B IN 2B VSS 1 2 3 4 5 6 7 14 13 12 11 10 9 8 VDD IN 2D IN 1D OUTD OUTC IN 2C IN 1C
MC14002B Dual 4–Input NOR Gate
OUTA IN 1A IN 2A IN 3A IN 4A NC VSS 1 2 3 4 5 6 7 14 13 12 11 10 9 8 VDD OUTB IN 4B IN 3B IN 2B IN 1B NC
MC14011B Quad 2–Input NAND Gate
元器件交易网
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
B-Suffix Series CMOS Gates
The B Series logic gates are constructed with P and N channel enhancement mode devices in a single monolithic structure (Complementary MOS). Their primary use is where low power dissipation and/or high noise immunity is desired. • Supply Voltage Range = 3.0 Vdc to 18 Vdc • All Outputs Buffered • Capable of Driving Two Low–power TTL Loads or One Low–power Schottky TTL Load Over the Rated Temperature Range. • Double Diode Protection on All Inputs Except: Triple Diode Protection on MC14011B and MC14081B • Pin–for–Pin Replacements for Corresponding CD4000 Series B Suffix Devices (Exceptions: MC14068B and MC14078B)
IN 1A IN 2A OUTA OUTB IN 1B IN 2B VSS 1 2 3 4 5 6 7 14 13 12 11 10 9 8 VDD IN 2D IN 1D OUTD OUTC IN 2C IN 1C
MC14012B Dual 4–Input NAND Gate
OUTA IN 1A IN 2A IN 3A IN 4A NC VSS 1 2 3 4 5 6 7 14 13 12 11 10 9 8 VDD OUTB IN 4B IN 3B IN 2B IN 1B NC
mA
mW
Tstg
– 65 to + 150
_C
TL Lead Temperature (8–Second Soldering) 260 _C * Maximum Ratings are those values beyond which damage to the device may occur. †Temperature Derating: Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C Ceramic “L” Packages: – 12 mW/_C From 100_C To 125_C This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and Vout should be constrained to the range VSS ≤ (Vin or Vout) ≤ VDD. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD). Unused outputs must be left open.