art%3A10.1007%2Fs00542-006-0100-8
一汽大众故障码-数据流-编码-匹配功能汇总-
编码与匹配目前汇总状态01发动机1巡航启动:01-11-11463,汽车启动2巡航关闭:01-11-161673.节气门匹配:01-10-00 04-060或098 PQ35车型需要再点击启动。
4二次空气泵基本设定:01-04-0775废气再循基本环设定:01-04-0746凸轮轴基本设定:01-04-094将发动机转速提升到2000-4000RPM,保持直到显示3区变为TEST ON7 柴油废气再循环基本设定:01-04-038编码:01-07-31(06A 906 033 KL宝两)(06A 906 032 EQ)(1GD906033A捷)/71(06G 906 033 C速)(06G 906 033 L) /33(06A 906 033 KN速)(06A 906 032 JB)/04500(06A 906 032 LE)(06A 906 032 EN ) /04530(06A 906 032 LF)(06A 906 032 LD ) /TDI、 SDI控制单元的编码均为000028.冠军版速腾加装定速巡航:需要将发动机编码倒数第3位加1.冠军巡航编码进入发动机控制单元将原编码0403000018070060倒数第三位改为1,即160进入16控制单元,07编码将0002001改为00020219.1.4发动机编码:0无意,0可调风扇,0无意义,x:1ABS,2气囊,4自动空调,x:1五档手动,2六档手动,7:0AM.10 01-08-50 第三区外界温度传感器第四区是压缩机工作状态 01-08-137 第二区空调开关状态,第三区制冷剂压力,11、01-08-131 1区上水管温度 3区下水管温度12、自变箱强制低档设置:01-04-063(BJG)13BJG发动机编码规则:个位:1为手动档,3为自动档,十位:+1多ABS,+2多安全气囊,+8欧二多14 检查生成就绪代码:01-08-086第一区应为00000000,其含义如下表,应都为0,有1说明需要重4开/关到ABS通讯:44-10-03(0带DSR动态转向弥补的ESP,1取消,2带DSG2的ESP,不对有01319故障)5第二代更换第三代转向机有G85故障44-10-9-1(1代表在转向机上取得G85信号,不对有00778故障)6左右转向限位器基本设定:在前车轮直线时,方向盘在转向角零度且左右转动到极限位置相差角度不多时,将方向盘向左打到头用力坚持直到仪表有‘叮’的提示音,松开方向盘2秒后,再向右打到头用力坚持直到仪表有‘叮’的提示音,松开方向盘2秒。
ARTISAN技术集团的预览目录:IC200UEX636-C及GFK-1645H 11-1数字扩展单
GFK-1645H 11-1Analog Expansion UnitsThis chapter describes the following VersaMax Micro PLC Analog Expansion Units:▪ IC200UEX616 6 Point Analog Expansion Unit, (4) Analog In and(2) Analog Out, 12 VDC Power Supply▪ IC200UEX624 4 Point Analog Expansion Unit, (4) Analog In, 24 VDC Power Supply▪ IC200UEX6266 Point Analog Expansion Unit, (4) Analog In and(2) Analog Out, 24 VDC Power Supply▪ IC200UEX6366 Point Analog Expansion Unit, (4) Analog In and(2) Analog Out, 100/240 VAC Power SupplyGE FANUC SparesFeatures of Analog Expansion UnitsAnalog, Expansion Units have the features shown below. Expansion Units can belocated up to 2 meters from the Micro PLC.Removable Terminal StripsThe removable terminal assemblies are protected by hinged covers. After turningoff power to the Expansion Unit, a terminal assembly and attached field wiring canbe separated from the Expansion Unit by removing two screws.Expansion ConnectorThe connector on the left side of the Expansion Unit is used to connect to theMicro PLC or to the outgoing connector on the previous Expansion Unit. Theconnector on the right side of the Expansion Unit can be used to attach to the nextExpansion Unit.Status LEDsLEDs on the Expansion Unit provide quick visual verification of operating status.Expansion Unit LEDs indicate local Power and OK mode.CablesA 0.1 meter ribbon cable (IC200CBL501) is provided with each Expansion Unit.Cables are also available in 0.5 meter (IC200CBL505) and 1 meter(IC200CBL510) lengths.11-2 VersaMax® Micro PLCs and Nano PLCs User’s Manual – June 2008 GFK-1645HGFK-1645HChapter 11 Analog Expansion Units 11-3Analog Expansion Unit SpecificationsModule Dimensions Height: 90mm (3.6 inches), Depth: 76mm (3.0 inches) Width: 150mm (6.0 inches) Inputs 4 analog inputsOutputs2 analog outputs (all models except UEX624)Power Specifications for Analog Expansion UnitsIC200UEX616 IC200UEX624, UEX626IC200UEX636Power voltage 12VDC 24VDC 100/110/120/200/210/220V (50/60Hz) VACRange 9.6VDC - 15VDC 19.2VDC to 30VDC 85 to 264VAC Hold-up 10.1ms at 9.6V 24.5ms at 19.2V 223ms at 85V Inrush Current/Time 0.9A / 1ms at 15V 2.5V / 1ms at 30V 4A / 5ms at 264V Input Current 0.15A at 15V 0.1A at 30V 0.06A at 264V Input Power Supply Rating 2.25W 3W 15VA The DC power source must have enough transient current capability to support the inrush current of the power supply and to maintain the nominal voltage level.Input and Output SpecificationsAnalog Input Channels (IC200UEX6**) 4, differentialInput ranges0 to 10V (10.23V maximum)-10V to +10V ( -10.23V min. and +10.23V max.) 0 to 20mA (20.47mA maximum) 4 to 20mA (20.47mA maximum) Resolution 12 bitsAccuracy ±1% of full scale over full operating temperature range Linearity ±3 LSB maximum Isolationnon-isolated Common mode voltage ±40 V maximum Current input impedance 249 Ohms Voltage input impedance 200 kOhmsInput filter time20ms to reach 1% error for step input Analog Output Channels 2, single-ended, non isolated Output ranges0 to 10V (10.23V maximum) 0 to 20mA (20.47mA maximum) 4 to 20mA (20.47mA maximum) Resolution 12 bitsAccuracy±1% of full scale over operating temperature range Current: maximum terminal voltage user load range output load capacitance output load inductance 10V (at 20mA output) 10 to 500 ohms 2000 pF maximum 1 Henry maximumVoltage: output loading output load capacitance10 kOhm minimum at 10 volts 1 µF maximumGE FANUC Spares11-4 VersaMax® Micro PLCs and Nano PLCs User’s Manual – June 2008GFK-1645HAnalog OperationThis section explains how a VersaMax Micro PLC Expansion Unit with analog channels processes analog data. Unlike discrete expansion units, if one analog unit fails all subsequent analog expansion units will stop communicating.However, expansion units before the failed unit continue to be available. If an analog expansion fails at power up, no expansion units (discrete or analog) will be functional.Analog I/O ParametersEach analog channel can be configured to operate in either voltage or current mode. If current mode operation is selected, the range can then be configured as either 4-20mA or 0-20mA. If voltage mode operation is selected (inputs only), the range can then be configured as either 0-10V or –10V to +10V.Parameter Choices Default ValueVoltage or current mode Voltage, Current Voltage Current range selection4–20mA, 0–20mA 4–20mA Voltage range selection (Inputs Only)0-10V, -10-+10V0-10VInput/Output Values Compared to Process DataThe Expansion Unit processes analog channels using fixed conversion values for both current and voltage mode operation. The table below shows the relationship between the analog input and output values used by the application program, and the actual analog input or output for each mode. These values include the automatic adjustments for gain.In this ConfiguredMode: This is the Analog Signal Range This is the Equivalent Process Data %AI or %AQRangeFor the Default Calibration, theValue in the%AI or %AQ Reference Equals:Voltage 0 to +10V 0 to 10,000mV 0 to 32000 3.2 x mV Voltage –10 to +10V (Inputs Only) -10,000mv to +10,0000mV -32000 to 32000 3.2 x mV Current 0 to 20mA 0 to 20,000µA 0 to 32000 1.6 x µA Current 4 to 20mA4,000 to 20,000µA0 to 320002 x µA –8000GFK-1645HChapter 11 Analog Expansion Units 11-5Count Resolution for Analog Expansion UnitsFor analog expansion units, count resolution is controlled by a dip switch setting on the module. Switch 6 should be set to ON by default. If unexpected results are observed, check the position of switch 6. If switch 6 is not ON, power down the system and set switch 6 to ON. Do NOT change any of the other switches.LED IndicationsThe module’s LEDs indicate the status of the module and of the analog inputs.IN 1 IN2 IN3 IN4POW OKIf an initialization error occurs, the OK LED blinks rapidly. During normal operation, the analog input LEDs should be off.GE FANUC Spares11-6 VersaMax® Micro PLCs and Nano PLCs User’s Manual – June 2008GFK-1645HAnalog Input ProcessingThe Expansion Unit processes analog input channels with a 12-bit successive-approximation A/D converter. It converts the analog value into a digital count, calculates the %AI value as described below, then places the result into theappropriate %AI input reference (these references are described in chapter 21).Automatic Conversion of Analog Voltage or Current to CountsIn voltage mode, the Expansion Unit first converts the 0 to 10,000mV input signal to a count in the range of 0 to 4,000 (or –10,000mV to 10,000mV signal to a range of –4,000 to 4,000). The fixed multiplier for this conversion is 2.5.In current mode, the Expansion Unit first converts the 0 to 20,000µA input signal to a count value in the range of 0 to 4,000. The fixed multiplier for this conversion is 5. The conversion for both current modes (0-20mA and 4-20mA) is the same.Automatic Gain and Offset Adjustment for Analog InputsThe Expansion Unit then converts the A/D converter's input count value from the range of 0 to 4000 to a final %AI input value in the range of 0 to 32,000. Itmultiplies the count value by 8 (32000 / 4000) to get the final analog input ($AI):(input count X 8) = %AI valueAny calculated value above 32,767 is clamped at that maximum value. Any calculated value less than 0 is clamped at 0.Analog Input Conversion SummaryThe table below summarizes the conversion of voltage or current inputs to counts and then to %AI values.Input SignalConversion Factor A/D ConverterVAlueGain Factor %AI Range Voltage Mode (0 to 10,000mV) 2.50–4000 counts8 0–32,000 Voltage Mode (-10,000 to 10,000mV)2.5 -4000 to 4000counts8-32,000 to 32,000 Current Mode (0–20mA) or (4–20mA)5 0–4000 counts 80–32,000GFK-1645HChapter 11 Analog Expansion Units 11-7Analog Output ProcessingTo generate the analog output signal, the Expansion Unit converts the value in the %AQ output reference into a count value for the 12-bit D/A converter, which then drives the analog output.Automatic Gain and Offset Adjustment for Analog OutputsThe application's %AQ output range of 0 to 32000 corresponds to the D/Aconverter's output count range of 0 to 4000. The Expansion Unit first multiplies the %AQ value from the program by .125 (4000 / 32000) to produce the count value for the D/A converter:(%AQ X .125) = D/A countAny calculated value that exceeds 4095 (212-1) is clamped at that maximum value. Any calculated value less than 0 is clamped at 0. The range 0 to 4095 corresponds to %AQ values between 0 and 32,767.Automatic Conversion of Counts to Analog Voltage or CurrentIn voltage mode, the D/A converter then converts the count value in the range of 0 to 4,000 counts to an analog signal from 0 to 10,000mV. The output voltage gain (ratio) for this conversion is 2.5.In current mode, the D/A converter converts the count value to an analog signal from 0 to 20,000µA. The output current gain for this conversion is 5. The conversion for both current modes (0-20mA and 4-20mA) is the same.Analog Output Data Conversion SummaryThe table below summarizes the conversion of %AQ values to counts and then to voltage or current levels.%AQ Range Gain, Factor D/A Converter Range Conversion Factor Output Signal0– 32,000 0.125 0–4,000 counts 2.5 Voltage Mode (0–10,000mV) 0–32,0000.1250–4,000 counts5Current Mode (0–20mA)or (4–20mA)GE FANUC Spares11-8 VersaMax® Micro PLCs and Nano PLCs User’s Manual – June 2008GFK-1645HWiring DiagramPower Supply:UEX616: 12VDC UEX624: 24VDC UEX626: 24VDC UEX636: 100/240VACConnect jumpers in current mode2 Voltage or Current Analog OutputsOn modules IC200UEX616, UEX626 and UEX 636, voltage and current outputs are present on their respective output terminals at the same time. For proper module operation, only the output terminals that correspond to the voltage / current output configuration should be connected.。
ARTISAN
390National Instruments • Tel: (800) 433-3488•Fax: (512) 683-9300•***********•C o u n t e r /T i m e r A c c e s s o r i e s a n d C a b l e sD a t a A c q u i s i t i o n a n d S i g n a l C o n d i t i o n i n gAccessory and Cable Selection ProcessStep 1.Select your counter/timer device from Tables 1 and 2.Step ing Tables 1 and 2 as a guide,determine which accessories are appropriate for that device.Select an accessory using Table 3 as reference.Step ing Tables 1 and 2,determine the appropriate cable solution for your selected counter/timer device and accessory.AccessoriesBNC-2121 (See Figure 1)Connector block with BNC and spring terminal connections for easy connection of I/O signals to counter/timer devices.The BNC-2121 offers spring terminals,as well as eight dedicated and six user-defined BNC connectors,which provide access to all I/O signals.This connector block is also a full-featured test accessory that provides pulse-train,trigger,and quadrature encoder signals.For the connections,refer to the BNC-2121 user guide at /manualsBNC-2121......................................................................................................778289-01Dimensions – 26.7 by 11.2 by 5.5 cm (8.0 by 4.4 by 2.2 in.)CA-1000 (See Figure 2)Configurable signal connectivity solution for connecting counter/timers to different types of standard I/O connectors.You can also incorporate switches and LED indicators.You can place the CA-1000 under a laptop PC,on a benchtop,or in a 19 in.rack.CA-1000......................................................................................................See page 351Dimensions – 30.7 by 25.4 by 4.3 cm (12.1 by 10 by 1.7 in.)Counter/Timer Accessories and CablesFigure 2. CA-1000 Configurable Signal Conditioning SolutionFigure 1. BNC-2121 Connector BlockAccessory DescriptionPage BNC-2121BNC connector block with built-in test features390CA-1000Configurable connector accessory 390SCB-68Shielded screw connector block 391TB-2715Front-mount terminal block for PXI-660x391TBX-68DIN-rail connector block 391CB-68LP Low-cost screw connector block 391CB-68LPR Low-cost screw connector block 391Table 1. Accessories and Cables for PXI-6601 and PCI-6602Table 2. Accessories and Cables for PXI-6602 and PXI-6608Table 3. Overview of AccessoriesPCI-6601, PCI-6602AccessoriesCables BNC-2121, CA-1000, SCB-68,–TBX-68, CB-68LP , and CB-68LPR R6868 or SH68-68-D1TB-2715N/APXI-6602, PXI-6608AccessoriesCables BNC-2121, CA-1000, SCB-68,–TBX-68, CB-68LP , and CB-68LPR R6868 or SH68-68-D1TB-2715Connects directly to the deviceCounter/Timer Accessories and CablesSCB-68 Shielded I/O Connector Block (See Figure 3)Shielded I/O connector block for easy connection of I/O signals to the counter/timer devices.T he screw terminals are housed in a metal enclosure for protection from noise bined with a shielded cable,the SCB-68 provides rugged,very low-noise signal termination.T he SCB-68 also includes two general-purpose breadboard areas.SCB-68..............................................................................................................776844-01Dimensions – 19.5 by 15.2 by 4.5 cm (7.7 by 6.0 by 1.8 in)TB-2715 Terminal Block (See Figure 4)With the T B-2715 terminal block for PXI counter/timer devices,you can connect signals directly without additional cables.Screw terminals provide easy connection of I/O signals.The TB-2715 latches to the front of your PXI module with locking screws and provides strain relief.TB-2715............................................................................................................778242-01Dimensions – 8.43 by 10.41 by 2.03 cm (3.32 by 4.1 by 0.8 in.)TBX-68 I/O Connector Block with DIN-Rail Mounting (See Figure 5)Termination accessory with 68 screw terminals for easy connection of field I/O signals to the counter/timer devices.The TBX-68 is mounted in a protective plastic base with hardware for mounting on a standard DIN rail.TBX-68..............................................................................................................777141-01Dimensions – 12.50 by 10.74 cm (4.92 by 4.23 in.)CB-68LP and CB-68LPR I/O Connector Blocks (See Figure 6)Low-cost termination accessories with 68 screw terminals for easy connection of field I/O signals to the counter/timer devices.The connector blocks include standoffs for use on a desktop or mounting in a custom panel.T he CB-68LP has a vertically mounted 68-pin connector.The CB-68LPR has a right-angle mounted connector for use with with the CA-1000.CB-68LP............................................................................................................777145-01Dimensions – 14.35 by 10.74 cm (5.65 by 4.23 in.)CB-68LPR ........................................................................................................777145-02Dimensions – 7.62 by 16.19 cm (3.00 by 6.36 in.)391National Instruments • Tel: (800) 433-3488•Fax: (512) 683-9300•***********•Counter/Timer Accessories and CablesData Acquisition andSignal ConditioningFigure 6. CB-68LP and CB-68LPR I/O Connector BlocksFigure 5. TBX-68 I/O Connector BlockFigure 4. TB-2715 I/O Terminal BlockFigure 3. SCB-68 Shielded I/O Connector Block392National Instruments • Tel: (800) 433-3488•Fax: (512) 683-9300•***********•C o u n t e r /T i m e r A c c e s s o r i e s a n d C a b l e sD a t a A c q u i s i t i o n a n d S i g n a l C o n d i t i o n i n gCablesRTSI Bus Cables (See Figures 7 and 8)Use RT SI bus cables to connect timing and synchronization signals among measurement,vision,motion,and CAN boards for PCI.For systems using long and short boards,order the extended RTSI cable.2 boards ..........................................................................................................776249-023 boards ..........................................................................................................776249-034 boards ..........................................................................................................776249-045 boards ..........................................................................................................776249-05Extended,5 boards ........................................................................................777562-05SH68-68-D1 Shielded Cable (See Figure 9)Shielded 68-conductor cable terminated with two 68-pin female 0.050 series D-type connectors.This cable connects counter/timer devices to accessories.1 m..................................................................................................................183432-012 m..................................................................................................................183432-02R6868 Ribbon I/O Cable (See Figure 10)68-conductor flat ribbon cable terminated with two 68-pin e this cable to connect the NI PCI-6601 to an accessory.For signal integrity with high-frequency signals,use the SH68-68-D1 with the NI 6602 and NI 6608.1 m..................................................................................................................182482-01Custom Connectivity Components68-Pin Custom Cable Connector/Backshell Kit (See Figure 11)68-pin female mating custom cable kit for use in making custom 68-conductor cables.Solder-cup contacts are available for soldering of cable wires to the connector.68-pin custom cable kit ................................................................................776832-01PCB Mounting ConnectorsPrinted circuit board (PCB) connectors for use in building custom accessories that connect to 68-conductor shielded and ribbon cables.Two connectors are available,one for right-angle and one for vertical mounting onto a PCB.68-pin,male,right-angle mounting..............................................................777600-0168-pin,male,vertical mounting....................................................................777601-01Counter/Timer Accessories and CablesFigure 10. R6868 Ribbon I/O CableFigure 9. SH68-68-D1 Shielded CableFigure 8. Extended RTSI Bus CableFigure 7. RTSI Bus CableFigure 11. 68-Pin Custom Cable Kit。
01005 Design Assembleon
©A s s e m b l éo n 1Keeping Cost per placement under control using 01005 componentsJeroen de GrootMarketing Director Assembleon AsiaOctober 13th©A s s e m bl éo n 2Market of microchips (0201 and 01005 size)Cellular phone(Board of main body)0201Small video (DSC, DVC, etc.)©A s s e m b l éo n 3Migration of microchips to modules•Component distribution (source: Murata ):–Now: 70 % of microchips on main board (30 % in modules)–Future (3-5 years from now): 60% of microchips in modules•Reasons for this migration:–Difficult to solder both microchips and large IC ’s at same board –Less RF specific competence needed–Reduced investments at manufacturer of end-products•Less specific production equipment necessary (wire bonders, FC placers, etc.)–Shorter Time-to-market (TTM)•Off-the-shelf functionality–More flexibility in mobile phone design•Diversity based on modular architecture©A s s e m b l éo n 5Design•Traces may have to pass around the component. Stencil printing•Finer grain size of the solder particles in the solder paste •The risk of blocked stencil apertures and bridging•The need for using even thinner stencils ( down to 50 µm)Inspection•Visual inspection and willbecome more difficult and repair is not possibleChallenges for ‘01005’ componentsSource: Philips CFT –February 2003Component placement•Required placement accuracy better than 50 micron (3 sigma)•Special nozzle (with an extremely small nozzle diameter)•Placement force is critical (risk of component cracking)•High resolution vision camera •Positional accuracy of feeder and tape•Measuring / correcting pick-up position Soldering•Poor solder balling.©A s s e m b l éo n 6‘01005’ process challenges•‘01005’ chip size requires thinner stencils ( down to 50 µm ) and does not fit in existing reflow process for applications with mixed components. Extra process steps would be necessary and existing lines must be adapted accordingly.•‘01005’ components can be used in modules & System InPackage (SiP) applications where all the components are small •The available process window for lead free soldering of ‘01005’ is more critical. Due to higher temperatures the risk of flux evaporation is present.©A s s e m b l éo n 9Parallel principle of operation©A s s e m b l éo n 11Factors that influence efficiency•Workload ….•Scheduled downtime–Easy to maintain systems•Unscheduled downtime–Easy to repair/replace systems•Model change–Fast to changeover systems•New product introduction–First time right systems•General operator practice and behavior–Easy to use systems•Supporting processes (e.g. logistics)•...©A s s e m b l éo n 12Requirements –01005 process•Pick process–Feeder indexing accuracy–Auto pick correction at system level•Alignment process–Alignment unit resolution•Placement process–Placement accuracy•Placement force control©A s s e m b l éo n 13Much waste material !Much waste material !©A s s e m b l éo n 19Helping you to reduce PPM levels -1©A s s e m b l éo n 20Helping you to reduce PPM levels -2©A s s e m b l éo n 21Solder Paste Pattern AlignmentGenerally component follows solderpaste offsets in both X and Y direction©A s s e m b l éo n 22Use of pattern entities as fiducialsFigure of M. Nikeshina/Pre-developmentPM1PM2Artwork recognition5.45.8 5.65.053.63.453.83.83.43.13.322.962.62.652.832.42.32.322.162.242.02Interspacing (8×200μm150μm100μm80μm60μm884SMD / cm©A s s e m b l éo n 25Placement accuracy 75 micron©A s s e m b l éo n 26Placement accuracy 50 micron©A s s e m b l éo n 28Typical process failures©A s s e m b l éo n 29Placement force control•Static Component Break Strength–The static 0201 placement force should be lower than 3N. What ’s more, according to the Murata formula, 01005 component break strength is expected to be 43.56% compared with 0201 components . This also suggests that the 01005 “static ” placement force setting should be about 1.5N or less•Impact Force Control–The dynamic behavior of the placement action can also be the cause of chip damage. Therefore, preferably, the peak of the impact force should be lower than the static placement force setting.•Board support & Board Height control–For 0201/01005 placement, it is important to control the placement impact and force, being independent from either board support system (elasticity of the placement point) or board height.settingF =©A s s e m b l éo n 32。
SL Headmic 1 耳顶麦克风说明说明书
FEATURES• Most comfortable-to-use presenter microphone • Outstanding sound quality, omni-directional • Sleek and unobtrusive appearance• Extremely lightweight, but sturdy metal frame • Soft case for convenient transport and storage • Available in black, beige and silverThe SL Headmic 1 is an extremely unobtrusive and com-fortable-to-use headworn microphone. It features the proven omni-directional MKE 1 microphone capsule. The adjustable neck band makes its use convenient for everyone. The extremely lightweight (7 g ) but robust metal frame makes the microphone ideal for long-term use. It comes with a sturdy and sleek soft case, which can also hold a bodypack transmitter. It is available in black, beige and silver.DELIVERY INCLUDES• SL H eadmic 1• connection cable• MZC 1-2 frequency response cap• MZC 1-1 frequency response cap (SL Headmic 1 -4 NConly)• 2x clips (SL Headmic 1 -4 NC only)• SL M ZW 1 windshield • soft case • quick guide • safety instructionsSPECIFICATIONSFrequency response 20 to 20,000 H z ± 3 d B Pick-up pattern omni-directional Nominal impedance @ 1 k Hz1 k ΩMin. terminating impedance 4.7 k ΩSensitivity5 m V/Pa ± 3 d B Diameter of mic capsule 3.3 m m Max. sound pressure level 143 d B Equivalent noise level 27 d B(A)Supply current approx. 240 μA Power supply 4.5 to 15 VTemperature rangeOperation: Storage: -10 °C to 50 °C(14 °F to 122 °F)-20 °C to 70 °C(-4 °F to 158 °F)Relative air humidity max. 95 %Cable length1.6 m Diameter of boom arm 1.1 m mConnector3.5 m m jack plug or3-Pin connector (-4 variant)Weight (without cable)approx. 7 gPRODUCT VARIANTSSL HEADMIC 1 BK - black Art. No. 506271SL HEADMIC 1 BE - beige Art. No. 506272SL HEADMIC 1 SB - silver Art. No. 506904SL HEADMIC 1 -4 BK - black Art. No. 506905SL HEADMIC 1 -4 BE - beige Art. No. 506906SL HEADMIC 1 -4 SB - silver Art. No. 506907SL HEADMIC 1 -4 NC SB - silver Art. No. 390004SL HEADMIC 1 -4 NC BK - black Art. No. 390005SL HEADMIC 1 -4 NC BE - beigeArt. No. 390006Sennheiser electronic GmbH & Co. KG · Am Labor 1 · 30900 Wedemark · Germany · DIMENSIONS64.91[ca. 1600mm]Kabel mit 3,5 mm Klinkenstecker / cable with 3.5 mm jack plugKabel mit 3-poligem Spezialstecker / cable with 3-pin special connectorSignal64.91[ca. 1600mm]ARCHITECT‘S SPECIFICATIONThe headset microphone shall be designed for professional …hands free“ applications. Its high-quality microphone cap-sule shall be a pre-polarized condenser with an omni-di-rectional pick-up pattern and shall be optimized for speech intelligibility.The headset microphone shall have an adjustable, visually unobtrusive neckband and an extremely thin microphone boom that shall be adjustable in length. The headset mi-crophone shall be available in black (BK variant), beige (BE variant) or silver (SB variant).The frequency response of the headset microphone shall be 20 H z-20,000 H z (± 3 d B) and sensitivity shall be 5 m V/Pa (± 3 d B). Nominal impedance at 1 k Hz shall be 1 k Ω, with a min. terminating impedance of 4.7 k Ω. Maximum SPL shall be 143 d B, equivalent noise level shall be 27 d B(A).The current consumption shall be approximately 240 μA. Operating voltage shall range from 4.5-15 V . Diameter of the microphone capsule shall be 3.3 m m (0.13"), diameter of the boom arm shall be 1.1 m m (0.04"). The cable shall be 1.6 m long and shall provide connection via a 3.5 m m jack plug or a lockable 3-pin special connector. Weight without cable shall be approximately 7 g rams (0.25 o z). Operating temperature shall range from -10 °C to +50 °C (+14 °F to +122 °F).The headset microphone shall be the Sennheiser SL Headmic 1.。
13.Sparepartlist-epoke.dk
020 22008405 M10x35 8.8 FZB DIN933 Hex Cap Screw
021 22058410 M10 140HV FZB DIN 125 ISO7090 Flat Washer with chamfer
022 22052004 M10 6 FZB DIN985 Prevailing Torque Hex Nut with polyamid inserted
005 22008403 M10x25 8.8 FZB DIN933 Hex Cap Screw
006 Y7200138 Edge seal for RBU, large
007 Y7200190 Edge seal for RBU, small
008 Y7100189 Fixing rubber profile
009 Y7100190 Fixing rubber profile
010 Y7100146 Fixing rubber plate
011 22014402 M8x25 10.9 RAW DIN7991/ ISO10642 Hexagon Socket Countersunk
012 22058600 M8 140HV FZB DIN9021A/ ISO7093 Flat Washer without chamfer
13.Spare part list
Typing. Type no.: Ballart nr.: ________________________
Fabrikationsnr.: Prod. no.: Prod. nr.: _________________________
Årgang: Year: Jahr: _____________________________
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B NC-208X S er i e sU s er M a nu a lA n a l ogB NC B r e ako ut B oa r d sS e p te m b er 1993 Edi t i o nP a rt N u m b er 320407-01©C o p y r i g h t 1991, 1994 N a t i o n a l Ins tr u me n t s C o r p o r a t i o n.A ll R i g h t s Re s er v e d.N a t i o n a l Ins tr u me n t s C o r p o r a te H e a dqu a rter s6504 B r i dg e P o i n t P ar k wa yA u sti n, TX 78730-5039(512) 794-0100Tec hn i ca l s uppo r t fa x:(800) 328-2203(512) 794-5678B r a n c h O ff i ce s:A u st ra li a(03) 879 9422, A u st r i a(0662) 435986,B e l g i u m 02/757.00.20,C a n a d a(O n t ar i o)(519) 622-9310,C a n a d a(Q uéb ec)(514) 694-8521, De n m ar k 45 76 26 00, Fi n l a nd (90) 527 2321, F ra n ce(1) 48 14 24 24,Ger m a ny 089/741 31 30, I t a l y 02/48301892, J a p a n (03) 3788-1921, M e x i c o 95 800 010 0793,Ne t h er l a nd s 03480-33466, N o rwa y 32-84 84 00, Si ng a po re 2265886, S p a i n (91) 640 0085, S we d e n 08-730 49 70, S w it zer l a nd 056/20 51 51, Ta i wa n 02 377 1200, U.K. 0635 523545Li m i te d Wa rr a n t yT h e B N C-208X S er i e s bo ar d s are warra n t e d a g a i n st d efec ts i n m a t er i a ls a nd w o r k m a n s h i p f o r a p er i od o f on e y ear fr o m t h e d a t e o f s h i p m e n t, a s e v i d e n ce d by rece i p ts o r o t h er do c u m e n t a ti on. Na ti on a l I n st r u m e n ts w ill, a t its op ti on, re p a i r o r re p l ace e qu i p m e n t t h a t p r ov e s t o b e d efec ti v e du r i ng t h e warra n t y p er i od. T h is warra n t yi n c l ud e s p ar ts a nd l a bo r.T h e m e d i a on w h i c h you rece i v e Na ti on a l I n st r u m e n ts s o f t ware are warra n t e d no t t o fa il t o e x ec u t ep r og ra mmi ng i n st r u c ti on s, du e t o d efec ts i n m a t er i a ls a nd w o r k m a n s h i p, f o r a p er i od o f 90 d a y s fr o m d a t e o fs h i p m e n t, a s e v i d e n ce d by rece i p ts o r o t h er do c u m e n t a ti on. Na ti on a l I n st r u m e n ts w ill, a t its op ti on, re p a i r o r re p l ace s o f t ware m e d i a t h a t do no t e x ec u t e p r og ra mmi ng i n st r u c ti on s i f Na ti on a l I n st r u m e n ts rece i v e s no ti ce o f s u c h d efec ts du r i ng t h e warra n t y p er i od. Na ti on a l I n st r u m e n ts do e s no t warra n t t h a t t h e op era ti on o f t h es o f t ware s h a ll b e un i n t err up t e d o r err o r free.A R e t u r n M a t er i a l A u t ho r i za ti on (RM A) nu m b er m u st b e ob t a i n e d fr o m t h e fac t o r y a nd c l ear l y m ar k e d on t h e ou tsi d e o f t h e p ac k a g e b ef o re a ny e qu i p m e n t w ill b e acce p t e d f o r warra n t y w o r k. Na ti on a l I n st r u m e n ts w illp a y t h e s h i pp i ng c o sts o f re t u r n i ng t o t h e o w n er p ar ts w h i c h are c ov ere d by warra n t y.Na ti on a l I n st r u m e n ts b e li e v e s t h a t t h e i n f o r m a ti on i n t h is m a nu a l is acc u ra t e. T h e do c u m e n t h a s b ee ncaref u ll y re v i ewe d f o r t ec hn i ca l acc u rac y. I n t h e e v e n t t h a t t ec hn i ca l o r t ypog ra ph i ca l err o r s e x ist, Na ti on a lI n st r u m e n ts re s er v e s t h e r i gh t t o m a k e c h a ng e s t o s ub s e qu e n t e d iti on s o f t h is do c u m e n t w it hou t p r i o r no ti ce t o ho l d er s o f t h is e d iti on. T h e rea d er s hou l d c on s u lt Na ti on a l I n st r u m e n ts i f err o r s are s u s p ec t e d. I n no e v e n ts h a ll Na ti on a l I n st r u m e n ts b e li a b l e f o r a ny d a m a g e s ar isi ng ou t o f o r re l a t e d t o t h is do c u m e n t o r t h ei n f o r m a ti on c on t a i n e d i n it.E X C E P T A S SP E C IF IED HE R EIN, N ATIONAL I N S T R U M ENT S M AKE S NO WA RR ANTIE S, EX PR E SS O R I MP LIED,AND SP E C I F I C ALLY DI SC LAI MS ANY WA RR ANTY O F M E RC HANTA B ILITY O R F ITNE SS F O R A P A R TI C ULA RP U RP O S E. C U S TO M E R’S R IGHT TO R E C OVE R DA M AGE S C AU S ED B Y F AULT O R NEGLIGEN C E ON THE P A R T O F N ATIONAL I N S T R U M ENT S S HALL B E LI M ITED TO THE A M OUNT THE R ETO F O R E P AID B Y THE C U S TO M E R. N ATIONAL I N S T R U M ENT S WILL NOT B E LIA B LE F O R DA M AGE S R E S ULTING FR O M LO SS O F DATA, PR O F IT S,U S E O F PR ODU C T S, O R IN C IDENTAL O R C ON S EQUENTIAL DA M AGE S, EVEN I F ADVI S ED O F THE P O SS I B ILITY THE R EO F. T h is limit a ti on o f t h e li a b ilit y o f Na ti on a l I n st r u m e n ts w ill a pp l y re g ar d l e ss o f t h e f o r m o f ac ti on,w h e t h er i n c on t rac t o r t o r t, i n c l ud i ng n e g li g e n ce. A ny ac ti on a g a i n st Na ti on a l I n st r u m e n ts m u st b e b r ough tw it h i n on e y ear af t er t h e ca u s e o f ac ti on accr u e s. Na ti on a l I n st r u m e n ts s h a ll no t b e li a b l e f o r a ny d e l a y i np erf o r m a n ce du e t o ca u s e s b e yond its rea s on a b l e c on t r o l. T h e warra n t y p r ov i d e d h ere i n do e s no t c ov erd a m a ge s, d efec ts, m a lf un c ti on s, o r s er v i ce fa il u re s ca u s e d by o w n er’s fa il u re t o f o ll o w t h e Na ti on a lI n st r u m e n ts i n st a ll a ti on, op era ti on, o r m a i n t e n a n ce i n st r u c ti on s; o w n er’s m od i f i ca ti on o f t h e p r odu c t; o w n er’sa bu s e, mis u s e, o r n e g li g e n t ac ts;a nd po wer fa il u re o r s u r g e s, f i re, f l ood, acc i d e n t, ac ti on s o f t h i r d p ar ti e s, o ro t h er e v e n ts ou tsi d e rea s on a b l e c on t r o l.C o p y r i g h tU nd er t h e c opy r i gh t l aw s, t h is pub li ca ti on m a y no t b e re p r odu ce d o r t ra n smitt e d i n a ny f o r m, e l ec t r on i c o rm ec h a n i ca l, i n c l ud i ng pho t o c opy i ng, rec o r d i ng, st o r i ng i n a n i n f o r m a ti on re t r i e v a l s y st e m, o r t ra n sl a ti ng, i nw ho l e o r i n p ar t, w it hou t t h e p r i o r wr itt e n c on s e n t o f Na ti on a l I n st r u m e n ts C o r po ra ti on.T r a d em a r k sP r odu c t a nd c o m p a ny n a m e s list e d are t ra d e m ar k s o r t ra d e n a m e s o f t h e i r re s p ec ti v e c o m p a n i e s.W ARN I N G R EG ARD I N G M E D I CA L AND C LI N I CA L U SEO F NA TIO NA L I N ST RUM E N TS PR O DUC TSNa ti on a l I n st r u m e n ts p r odu c ts are no t d e si gn e d w it h c o m pon e n ts a nd t e sti ng i n t e nd e d t o e n s u re a l e v e l o fre li a b ilit y s u it a b l e f o r u s e i n t rea tm e n t a nd d i a gno sis o f hu m a n s. A pp li ca ti on s o f Na ti on a l I n st r u m e n ts p r odu c ts i nvo l v i ng m e d i ca l o r c li n i ca l t rea tm e n t ca n crea t e a po t e n ti a l f o r acc i d e n t a l i n j u r y ca u s e d by p r odu c t fa il u re, o r by err o r s on t h e p ar t o f t h e u s er o r a pp li ca ti on d e si gn er. A ny u s e o r a pp li ca ti on o f Na ti on a l I n st r u m e n tsp r odu c ts f o r o r i nvo l v i ng m e d i ca l o r c li n i ca l t rea tm e n t m u st b e p erf o r m e d by p r op er l y t ra i n e d a nd qu a li f i e dm e d i ca l p er s onn e l, a nd a ll t ra d iti on a l m e d i ca l s afe gu ar d s, e qu i p m e n t, a nd p r o ce du re s t h a t are a pp r op r i a t e i nt h e p ar ti c u l ar sit u a ti on t o p re v e n t s er i ou s i n j u r y o r d ea t h s hou l d a l wa y s c on ti nu e t o b e u s e d w h e n Na ti on a lI n st r u m e n ts p r odu c ts are b e i ng u s e d. Na ti on a l I n st r u m e n ts p r odu c ts are NOT i n t e nd e d t o b e a s ub stit u t e f o r a ny f o r m o f e st a b lis h e d p r o ce ss, p r o ce du re, o r e qu i p m e n t u s e d t o m on it o r o r s afe gu ar d hu m a n h ea lt h a nd s afe t y i n m e d i ca l o r c li n i ca l t rea tm e n t.Pref a ceT h i s m a nu a l d e s cr i b e s t h e e l ec t r i ca l a nd m ec h a n i ca l a s p ec ts o f t h e B N C-2080 a ndB N C-2081 bo ar d s a nd c on t a i n s i n f o r m a ti on a bou t i n st a lli ng a nd m a k i ng c onn ec ti on s t o t h e bo ar d s. T h e B N C-208X S er i e s bo ar d s are a n a l og b rea kou t bo ar d s w it h B N C-st y l e c onn ec t o r s. T h e s eb rea kou t bo ar d sc onn ec t t o t h e Na ti on a l I n st r u m e n ts m u lti f un c ti ond a t a ac qu isiti on bo ar d s f o r t he I B M PC/XT/AT, P er s on a l S y st e m/2, a nd c o m p a ti b l e c o m pu t er s, a nd M ac i n t o s h N u B u s c o m pu t er s. O r ga ni z a t i o n of This M a nu a lT h e B NC-208X S e r i e s U s e r M anua l is o r g a n i ze d a s f o ll o w s:• C h a p t er 1, I n tr odu c ti on, d e s cr i b e s t h e B N C-208X S er i e s bo ar d s;lists t h e c on t e n ts o f you rB N C-2080 a nd B N C-2081 k its; d e s cr i b e s t h e op ti on a l e qu i p m e n t, si gn a l c ond iti on i ngacce ss o r i e s, a nd s o f t ware s uppo r t;a nd e xp l a i n s ho w t o unp ac k you r B N C-208X S er i e s bo ar d.• C h a p t er 2, B NC-2080 B oa r d,d e s cr i b e s t h e B N C-2080 bo ar d i n d e t a il, i n c l ud i ng its f un c ti on, s p ec i f i ca ti on s, c o m p a ti b ilit y, c onn ec ti on, m oun ti ng, a nd a pp li ca ti on no t e s.• C h a p t er 3, B NC-2081 B oa r d, d e s cr i b e s t h e B N C-2081 bo ar d i n d e t a il, i n c l ud i ng its f un c ti on, s p ec i f i ca ti on s, c o m p a ti b ilit y, c onn ec ti on, m oun ti ng, a nd a pp li ca ti on no t e s.• C h a p t er 4, I n st a ll a ti on and C onn ec ti on s, e xp l a i n s ho w t o i n st a ll a nd m a k e c onn ec ti on s t o t h eB N C-208X S er i e s bo ar d s.• T h e C u st o me r C o mm un i c a ti on a pp e nd i x c on t a i n s f o r ms you ca n u s e t o re qu e st h e l p fr o m Na ti on a l I n st r u m e n ts o r t o c o mm e n t on ou r p r odu c ts.• T h e I nd ex c on t a i n s a n a l ph a b e ti ca l list o f k e y t er ms a nd t op i c s i n t h is m a nu a l, i n c l ud i ng t h e p a g e w h ere you ca n f i nd eac h on e.C o n v e n t i o ns U s e d in This M a nu a lT h e f o ll o w i ng c onv e n ti on s are u s e d i n t h is m a nu a l:it a li c I t a li c t e x t d e no t e s e m ph a sis, a cr o ss refere n ce, o r a n i n t r odu c ti on t o a k e yc on ce p t.La b bo ar d La b bo ar d refer s t o t h e La b-PC, La b-PC+, La b-N B, a nd La b-L C bo ar d s.M ac i n t o s h N u B u s M ac i n t o s h N u B u s refer s t o t h e M ac i n t o s h N u B u s fa mil y o f c o m pu t er s.M IO-16M IO-16 refer s t o t h e AT-M IO-16, AT-M IO-16D, AT-M IO-16F-5,AT-M IO-16X, MC-M IO-16, N B-M IO-16, N B-M IO-16X, a ndPC-L PM-16 bo ar d s.©N a ti ona l I n str u me n ts C o r po r a ti on v B NC-208X S e ri e s U s e r M anua lP r e f a ceB NC -208X S e ri e s U s e r M anua l v i © N a ti ona l I n str u me n ts C o r po r a ti onPCPC refer s t o PC/XT /AT /EI S A a nd I BM PS/2 c o m pu t er s .SC -205XSC -205X refer s t o t h e SC -2050, SC -2051, SC -2052, a nd SC -2053 bo ar d s .SC -206XSC -206X refer s t o t h e SC -2060, SC -2061, a nd SC -2062 bo ar d s .SC -207X SC -207X refer s t o t h e SC -2070, SC -2071, a nd SC -2072 bo ar d s .A bb re v i a t i o nsT h e f o ll o w i ng m e t r i c s y st e m p ref i x e s are u s e d w it h a bb re v i a ti on s f o r un its o f m ea s u re i n t h is m a nu a l:Pref i xMe a nin g V a lu e -mi cr o -10-6m -milli -10-3k -k il o -103M -m e g a-106T h e f o ll o w i ng a bb re v i a ti on s are u s e d i n t h is m a nu a l:Aa m p ere s CC e lsi u s d Bd ec i be ls d e g ree s Ffara d s f cc u t o ff fre qu e n c y Hzh er t z i n.i n c h e s mm e t er s oh ms %p erce n t p i Vvo lts W wa ttsAcr o n y m sT h e f o ll o w i ng acr ony ms are u s e d i n t h is m a nu a l:A C a lt er n a ti ng c u rre n tCMRRc o mm on -m ode re j ec ti on ra ti o D C d i rec t c u rre n tDGND d i g it a l g r oundDI FF d i ffere n ti a l i npu tI /O i npu t/ou t pu tLED li gh t -e mitti ng d i od eN RS E non refere n ce d si ng l e-e nd e d i npu tRS E refere n ce d si ng l e-e nd e d i npu tVD C vo lts d i rec t c u rre n tP r e f a ce Re l a te d D o c u me n t a t i o nT h e f o ll o w i ng Na ti on a l I n st r u m e n ts do c u m e n ts c on t a i n i n f o r m a ti on t h a t you m a y f i nd h e l p f u l a s you rea d t h is m a nu a l:•S C-205X S e ri e s U s e r M anua l(p ar t nu m b er 320385-01)•S C-206X S e ri e s U s e r M anua l(p ar t nu m b er 320200-01)•S C-207X S e ri e s U s e r M anua l(p ar t nu m b er 320239-01)T h e f o ll o w i ng Na ti on a l I n st r u m e n ts do c u m e n ts m a y a ls o b e h e l p f u l t o you d e p e nd i ng on t h e t yp e o f s y st e m you are u si ng w it h you r B N C-208X S er i e s bo ar d s:•M ac i n t o s h N u B u s u s er s-N B-MIO-16X U s e r M anua l(p ar t nu m b er 320157-01)-N B-MIO-16 U s e r M anua l(p ar t nu m b er 320295-01)-L ab-N B U s e r M anua l(p ar t nu m b er 320174-01)•I BM PC/XT/AT u s er s-A T-MIO-16F-5 U s e r M anua l(p ar t nu m b er320266-01)-A T-MIO-16 U s e r M anua l(p ar t nu m b er 320476-01)-L ab-P C U s e r M anua l(p ar t nu m b er 320205-01)-L ab-P C+ U s e r M anua l(p ar t nu m b er 320502-01)-P C-L PM-16 U s e r M anua l(p ar t nu m b er 320287-01)•I BM PS/2 Mi cr o C h a nn e l u s er s-M C-MIO-16 U s e r M anua l(p ar t nu m b er 320130-01)C us t o mer C o mm uni c a t i o nNa ti on a l I n st r u m e n ts wa n ts t o rece i v e you r c o mm e n ts on ou r p r odu c ts a nd m a nu a ls. We arei n t ere st e d i n t h e a pp li ca ti on s you d e v e l op w it h ou r p r odu c ts, a nd we wa n t t o h e l p i f you h a v ep r ob l e ms w it h t h e m. T o m a k e it ea s y f o r you t o c on t ac t u s, t h is m a nu a l c on t a i n s c o mm e n t a ndc on f i gu ra ti on f o r ms f o r you t o c o m p l e t e. T h e s e f o r ms are i n t h e a pp e nd i x a t t he e nd of t h is m a nu a l.©N a ti ona l I n str u me n ts C o r po r a ti on v ii B NC-208X S e ri e s U s e r M anua lC o n te n t sC h a p ter 1In tr o du ct i o n.........................................................................................................................1-1 W h a t Y ou r K it S hou l d C on t a i n......................................................................................1-3 O p ti on a l E qu i p m e n t.......................................................................................................1-3 Si gn a l C ond iti on i ng Acce ss o r i e s...................................................................................1-4 S o f t ware S uppo r t............................................................................................................1-5 U np ac k i ng......................................................................................................................1-5 C h a p ter 2B NC-2080 B oa r d................................................................................................................2-1P o wer C onn ec ti on s........................................................................................................2-3A n a l og I npu t...................................................................................................................2-3S h i e l d Gr ound................................................................................................................2-5F u s e a nd P o wer LED.....................................................................................................2-6D i g it a l a nd T imi ng Si gn a ls............................................................................................2-6S p ec i f i ca ti on s.................................................................................................................2-6A n a l og I npu t......................................................................................................2-6P o wer R e qu i re m e n ts..........................................................................................2-7P hy si ca l..............................................................................................................2-7O p era ti ng E nv i r on m e n t......................................................................................2-7St o ra g e E nv i r on m e n t..........................................................................................2-7B o ar d-t o-B o ar dC a b li ng.................................................................................................2-7M oun ti ng........................................................................................................................2-9A pp li ca ti on N o t e s..........................................................................................................2-9S o l d er i ng a nd De s o l d er i ng on t h e B N C-2080 B o ar d.........................................2-9C h a nn e l C on f i gu ra ti on s.....................................................................................2-9M IO-16 A n a l og I npu t............................................................................2-9C onn ec ti ng N on refere n ce d (o r Fl o a ti ng)Si gn a l S ou rce s..................................2-13D i ffere n ti a l I npu ts..................................................................................2-13Si ng l e-E nd e d I npu ts...............................................................................2-14C onn ec ti ng Gr ound-R efere n ce d Si gn a l S ou rce s................................................2-15D i ffere n ti a l I npu ts..................................................................................2-15Si ng l e-E nd e d I npu ts...............................................................................2-15B u il d i ng L o w p a ss Filt er s...................................................................................2-15B u il d i ng H i ghp a ss Filt er s...................................................................................2-17B u il d i ng A tt e nu a t o r s(V o lt a g e D i v i d er s)...........................................................2-20PC-L PM-16............................................................................................2-22M IO-16 A n a l og O u t pu t..........................................................................2-23 C h a p ter 3B NC-2081 B oa r d.................................................................................................................3-1A n a l og I npu t..................................................................................................................3-2S h i e l d Gr ound................................................................................................................3-4F u s e a nd P o wer LED.....................................................................................................3-5D i g it a l a nd T imi ng Si gn a ls............................................................................................3-5©N a ti ona l I n str u me n ts C o r po r a ti on i x B NC-208X S e ri e s U s e r M anua lC on t e n tsS p ec i f i ca ti on s.................................................................................................................3-5A n a l og I npu t......................................................................................................3-5P o wer R e qu i re m e n ts..........................................................................................3-5P hy si ca l..............................................................................................................3-6O p era ti ng E nv i r on m e n t......................................................................................3-6St o ra g e E nv i r on m e n t..........................................................................................3-6B o ar d-t o-B o ar dC a b li ng.................................................................................................3-6M oun ti ng........................................................................................................................3-8A pp li ca ti on N o t e s..........................................................................................................3-8S o l d er i ng a nd De s o l d er i ng on t h e B N C-2081 B o ar d.........................................3-8C onn ec ti ng N on refere n ce d (o r Fl o a ti ng)Si gn a l S ou rce s..................................3-8C onn ec ti ng Gr ound-R efere n ce d Si gn a l S ou rce s................................................3-8B u il d i ng L o w p a ss Filt er s...................................................................................3-9B u il d i ng H i ghp a ss Filt er s...................................................................................3-11B u il d i ng A tt e nu a t o r s(V o lt a g e D i v i d er s)...........................................................3-12La b B o ar d A n a l og O u t pu t..............................................................................................3-14 C h a p ter 4Ins t a ll a t i o n a nd C o nn ect i o ns..........................................................................................4-1 Har d ware I n st a ll a ti on.....................................................................................................4-1 Har d ware I n st a ll a ti on f o r t h e B N C-2080 a nd t h e B N C-2081............................4-1I n st a lli ng t h e SC-205X S er i e s C a b l e A d a p t er B o ar d s.......................................4-2I n st a lli ng t h e SC-207X Ge n era l-P u r po s e Ter mi n a ti on B rea dbo ar d s.................4-2R ac k M oun ti ng...................................................................................................4-2E x t er n a l P o wer C onn ec ti on (If Nece ss ar y)........................................................4-5B N C-208X S er i e s B o ar dC onn ec ti on................................................................4-6Si gn a l C onn ec ti on s........................................................................................................4-7 Ri bbon-C a b l e C onn ec t o r s..................................................................................4-7R ac k-M oun t C h a ssis C ov er A tt ac h m e n t............................................................4-7 A pp e ndi xC us t o mer C o mm uni c a t i o n...............................................................................................A-1 Ind e x..................................................................................................................................I nd e x-1F i g u re sFi gu re1-1.B N C-2080 B o ar d D i rec tl y C onn ec t e d t o a n M IO-16 B o ar d............................1-2 Fi gu re1-2.B N C-208X, SC-207X, SC-206X, a nd SC-205X S er i e s B o ar d sC onn ec t e d t o a n M IO-16 B o ar d.......................................................................1-2 Fi gu re2-1.B N C-2080 A n a l og B rea kou t B o ar d..................................................................2-1 Fi gu re2-2.B N C-2080 B o ar d P ar ts L o ca t o rD i a g ra m.........................................................2-2 Fi gu re2-3.O nbo ar dE qu i v a l e n t Ci rc u it f o r DI FF M od e....................................................2-4 Fi gu re2-4.W2 J u m p er S e tti ng s..........................................................................................2-5 Fi gu re2-5.D i rec t C onn ec ti on b e t wee n a n M IO-16 B o ar d a nd t h e B N C-2080 B o ar d.......2-8 B NC-208X S e ri e s U s e r M anua l x©N a ti ona l I n str u me n ts C o r po r a ti onC on t e n ts Fi gu re2-6.C onn ec ti on b e t wee n a n M IO-16 B o ar d, t h e B N C-2080 B o ar d, a ndt h e SC-2070/72 B o ar d o r t h e M IO-16, a nd t h e B N C-2080 a ndSC-206X S er i e s B o ar d s v i a t h e SC-2050 B o ar d..............................................2-8 Fi gu re2-7.S w it c h C on f i gu ra ti on s f o r D i ffere n ti a l M od e o r Si ng l e-E nd e d M od e.............2-10 Fi gu re2-8.W1 Gr ound R efere n ce J u m p er.........................................................................2-10 Fi gu re2-9.B N C-2080 S w it c h C on f i gu ra ti on s f o r a n M IO-16 C on f i gu re d i nDI FF M od e(F ac t o r y Defa u lt S e tti ng)..............................................................2-11 Fi gu re2-10.B N C-2080 S w it c h C on f i gu ra ti on s f o r a n M IO-16 C on f i gu re d i nRS E a nd N RS E M od e s.....................................................................................2-12 Fi gu re2-11.Bi a s R e t u r n R e sist o r f o r D C-C oup l e d Fl o a ti ng S ou rce on C h a nn e l 1i n DI FF M od e...................................................................................................2-14 Fi gu re2-12.N o r m a li ze d F re qu e n c y R e s pon s e o f L o w p a ss Filt er........................................2-16 Fi gu re2-13.L o w p a ss Filt er on D i ffere n ti a l C h a nn e l 1........................................................2-17 Fi gu re2-14.N o r m a li ze d F re qu e n c y R e s pon s e o f H i ghp a ss Filt er.......................................2-18 Fi gu re2-15.H i ghp a ss Filt er on D i ffere n ti a l C h a nn e l 1........................................................2-19 Fi gu re2-16.A tt e nu a t o r f o r U s e w it h D i ffere n ti a l I npu ts......................................................2-21 Fi gu re2-17.S w it c h C on f i gu ra ti on s f o r S E M od e(PC-L PM-16).........................................2-22 Fi gu re2-18.Gr ound R efere n ce J u m p er P o siti on f o r U s e w it h t h e PC-L PM-16..................2-23 Fi gu re2-19.A n a l og O u t pu t S c h e m a ti c f o r DA Cs, DA C0 OUT S ho w n.............................2-23 Fi gu re3-1.B N C-2081 A n a l og B rea kou t B o ar d..................................................................3-1 Fi gu re3-2.B N C-2081 B o ar d P ar ts L o ca t o r D i a g ra m.........................................................3-2 Fi gu re3-3.O nbo ar d E qu i v a l e n t Ci rc u it..............................................................................3-3 Fi gu re3-4.W1 J u m p er S e tti ng s..........................................................................................3-4 Fi gu re3-5.D i rec t C onn ec ti on b e t wee n a La b B o ar d a nd t h e B N C-2081 B o ar d................3-7 Fi gu re3-6.C onn ec ti on b e t wee n a La b B o ar d, t h e B N C-2081, a nd t h e SC-2071 B o ar d, o r t h e C onn ec ti on b e t wee n a La b B o ar d, t h e B N C-2081 a nd t h e SC-206XS er i e s B o ar d, v i a t h e SC-2053 B o ar d...............................................................3-7 Fi gu re3-7.N o r m a li ze d F re qu e n c y R e s pon s e o f L o w p a ss Filt er........................................3-9 Fi gu re3-8.L o w p a ss Filt er on C h a nn e l 1............................................................................3-10 Fi gu re3-9.N o r m a li ze d F re qu e n c y R e s pon s e o f H i ghp a ss Filt er.......................................3-11 Fi gu re3-10.H i ghp a ss Filt er on C h a nn e l 1...........................................................................3-12 Fi gu re3-11.A tt e nu a t o r f o r U s e w it h B N C-2081 B o ar d I npu ts............................................3-13 Fi gu re3-12.DA C0 OUT S c h e m a ti c.....................................................................................3-14 Fi gu re3-13.A n a l og O u t pu t S c h e m a ti c f o r DA Cs, DA C0 OUT S ho w n.............................3-14 Fi gu re4-1.M oun ti ng L o ca ti on s f o r t h e B N C-208X S er i e s B o ar d a nd SC-207XS er i e s B o ar d......................................................................................................4-3 Fi gu re4-2.M oun ti ng L o ca ti on s f o r t h e B N C-208X S er i e s B o ar d a nd SC-205XS er i e s B o ar d o r SC-206X S er i e s B o ar d............................................................4-3 Fi gu re4-3.A tt ac h i ng a M oun t a b l e B o ar d t o t h e C h a ssis...................................................4-4 Fi gu re4-4.D oub l e-He i gh t M oun ti ng..................................................................................4-5 Fi gu re4-5.C onn ec ti on s b e t wee n Da t a Ac qu isiti on B o ar d s a nd B N C-208XS er i e s B o ar d s a nd b e t wee n SC-205X S er i e s B o ar d s a nd B N C-2080a nd B N C-2081 B o ar d s......................................................................................4-6©N a ti ona l I n str u me n ts C o r po r a ti on x i B NC-208X S e ri e s U s e r M anua l。
A3_Artwork_Specification
可以方便后期改色。
贴图匹配不要有接缝。要按照模型大小尺寸来分配贴图象素。
主角美术制做规格(骨架)
骨架和骨架命名
选Rigid绑绿点。 先用默认骨架,胸骨用一块骨头,拳头一块骨头, 指骨一块,脚指骨一块。 把Bip01改成b_root。
主角美术制做规格(文件命名)
文件命名规则
– – – – – – – Avatar: Body: Hand: Leg: Waist: Mask: Gear: Avatar: Body: Hand: Leg: Waist: Mask: Gear: 头部(包括头发)档名是mta01 身体躯干(包括盔甲)档名是mtb01 手部(包括手套)档名是mth01 脚部(包括靴子)档名是mtl01 腰带(身体以外飘动的装饰如下摆、飘带等)档名是mtw01 眼饰(包括面具面巾等)档名是mtm01 头饰(包括帽子头饰)档名是mtg01 头部(包括头发头饰)档名是fta01 身体躯干(包括盔甲)档名是ftb01 手部(包括手套)档名是fth01 脚部(包括靴子)档名是ftl01 腰带(身体以外飘动的装饰如下摆、飘带等)档名是ftw01 眼饰(包括面具面巾等)档名是ftm01 头饰(包括帽子头饰)档名是ftg01
文件命名的规则是模型缩写+套装编号,男女主角模型的套装在序号01的基础上按顺序增加 :参考裸模的编号是 00,新手套装的编号是01。 男主角根据种族使用不同的动作骨骼(mt00/mw00/ms00):
• • • • • • • 男主角1(人族|Male Human)的文件夹和MAX的档名是mt01 男主角2(巫族|Male Wizard)的文件夹和MAX的档名是mw01 男主角3(篪虎族|Male Savage)的文件夹和MAX的档名是ms01 女主角1(人族|Female Human)的文件夹和MAX的档名是ft01 女主角2(巫族|Female Wizard)的文件夹和MAX的档名是fw01 女主角3(白月族|Female Moonblade)的文件夹和MAX的档名是fm01 如男主角1的模型:
1.成人口服营养补充中国专家共识--参考文献
参考文献[1]Cederholm T, Barazzoni R, Austin P, et al. ESPEN guidelines on definitions andterminology of clinical nutrition[J]. Clin Nutr, 2016, In press.DOI:10.1016/j.clnu.2016.09.004.[2]Elia M, Normand C, Laviano A, et al. A systematic review of the cost and costeffectiveness of using standard oral nutritional supplements in community and care home settings[J]. Clin Nutr, 2016,35(1):125-137. DOI:10.1016/j.clnu.2015.07.012.[3]Parsons EL, Stratton RJ, Cawood AL, et al. Oral nutritional supplements in arandomised trial are more effective than dietary advice at improving quality of life in malnourished care home residents[J]. Clin Nutr, 2016, In press.DOI:10.1016/j.clnu.2016.01.002.[4]Deutz NE, Matheson EM, Matarese LE, et al. Readmission and mortality inmalnourished, older, hospitalized adults treated with a specialized oral nutritional supplement: A randomized clinical trial[J]. Clin Nutr, 2016,35(1):18-26. DOI:10.1016/j.clnu.2015.12.010.[5]Cramer JT, Cruz-Jentoft AJ, Landi F, et al. Impacts of High-Protein OralNutritional Supplements Among Malnourished Men and Women with Sarcopenia:A Multicenter, Randomized, Double-Blinded, Controlled Trial[J]. J Am Med DirAssoc, 2016,17(11):1044-1055. DOI: 10.1016/j.jamda.2016.08.009.[6]Elia M, Normand C, Norman K, et al. A systematic review of the cost and costeffectiveness of using standard oral nutritional supplements in the hospital setting[J]. Clin Nutr, 2016,35(2):370-380. DOI: 10.1016/j.clnu.2015.05.010. [7]Jensen GL. Oral nutritional supplementation[J]. Am J Manag Care,2013,19(2):119-120.[8]Stratton RJ, Elia M. Encouraging appropriate, evidence-based use of oralnutritional supplements[J]. Proc Nutr Soc, 2010,69(4):477-487. DOI:10.1017/S0029665110001977.[9]蒋朱明,陈伟,朱赛楠,等. 中国东、中、西部大城市三甲医院营养不良(不足)、营养风险发生率及营养支持应用状况调查[J].中国临床营养杂志,2008,16(6):335-337. DOI: 10.3881/j.issn.1008-5882.2008.06.002.[10]S treicher M, Themessl-Huber M, Schindler K, et al. Who receives oral nutritionalsupplements in nursing homes? Results from the nutritionDay project [J]. ClinNutr, 2016, In press. DOI:10.1016/j.clnu.2016.09.005.[11]D upuy C, de Souto Barreto P, Ghisolfi A, et al. Indicators of oral nutritionalsupplements prescription in nursing home residents: A cross-sectional study[J].Clin Nutr, 2016,35(5):1047-1052. DOI: 10.1016/j.clnu.2015.07.015.[12]G azzotti C, Arnaud-Battandier F, Parello M, et al. Prevention of malnutrition inolder people during and after hospitalisation: results from a randomised controlled clinical trial[J]. Age Ageing, 2003,32(3):321-325.[13]Z hong Y, Cohen JT, Goates S, et al. The Cost-Effectiveness of Oral NutritionSupplementation for Malnourished Older Hospital Patients[J]. Appl Health Econ Health Policy, 2017,15(1):75-83. DOI: 10.1007/s40258-016-0269-7.[14]N eelemaat F, Bosmans JE, Thijs A, et al. Oral nutritional support in malnourishedelderly decreases functional limitations with no extra costs[J]. Clin Nutr, 2012,31(2):183-190. DOI: 10.1016/j.clnu.2011.10.009.[15]A bizanda P, López MD, García VP, et al. Effects of an Oral NutritionalSupplementation Plus Physical Exercise Intervention on the Physical Function, Nutritional Status, and Quality of Life in Frail Institutionalized Older Adults: The ACTIVNES Study[J]. J Am Med Dir Assoc, 2015,16(5):439.e9-439.e16. DOI:10.1016/j.jamda.2015.02.005.[16]W outers-Wesseling W, V an Hooijdonk C, Wagenaar L, et al. The effect of a liquidnutrition supplement on body composition and physical functioning in elderly people[J]. Clin Nutr, 2003,22(4):371-377.[17]A bizanda P, Sinclair A, Barcons N, et al. Costs of Malnutrition inInstitutionalized and Community-Dwelling Older Adults: A Systematic Review[J].J Am Med Dir Assoc, 2016,17(1):17-23. DOI: 10.1016/j.jamda.2015.07.005. [18]H atao F, Chen KY, Wu JM, et al. Randomized controlled clinical trial assessingthe effects of oral nutritional supplements in postoperative gastric cancer patients [J]. Langenbecks Arch Surg, 2016, In press. DOI:10.1007/s00423-016-1527-8. [19]A venell A, Smith TO, Curtain JP, et al. Nutritional supplementation for hipfracture aftercare in older people[J]. Cochrane Database Syst Rev, 2016,11:CD001880. DOI: 10.1002/14651858.CD001880.pub6.[20]M oya P, Soriano-Irigaray L, Ramirez JM, et al. Perioperative Standard OralNutrition Supplements Versus Immunonutrition in Patients Undergoing Colorectal Resection in an Enhanced Recovery (ERAS) Protocol: A Multicenter Randomized Clinical Trial (SONVI Study)[J]. Medicine (Baltimore),2016,95(21):e3704. DOI: 10.1097/MD.0000000000003704.[21]P hilipson TJ, Snider JT, Lakdawalla DN, et al. Impact of oral nutritionalsupplementation on hospital outcomes[J]. Am J Manag Care, 2013,19(2):121-128.[22]L iu M, Yang J, Yu X, et al. The role of perioperative oral nutritionalsupplementation in elderly patients after hip surgery[J]. Clin Interv Aging, 2015,10:849-858. DOI: 10.2147/CIA.S74951.[23]B urden ST, Gibson DJ, Lal S, et al. Pre-operative oral nutritional supplementationwith dietary advice versus dietary advice alone in weight-losing patients with colorectal cancer: single-blind randomized controlled trial [J]. J Cachexia Sarcopenia Muscle, 2017, In press. DOI:10.1002/jcsm.12170.[24]I mamura H, Nishikawa K, Kishi K, et al. Effects of an Oral Elemental NutritionalSupplement on Post-gastrectomy Body Weight Loss in Gastric Cancer Patients: A Randomized Controlled Clinical Trial[J]. Ann Surg Oncol, 2016,23(9):2928-2935.DOI: 10.1245/s10434-016-5221-4.[25]C awood AL, Elia M, Stratton RJ. Systematic review and meta-analysis of theeffects of high protein oral nutritional supplements[J]. Ageing Res Rev, 2012,11(2):278-296. DOI: 10.1016/j.arr.2011.12.008.[26]中华医学会肠外肠内营养学分会. 成人围手术期营养支持指南[J].中华外科杂志,2016,54(9):641-657. DOI: 10.3760/cma.j.issn.0529-5815.2016.09.001. [27]A rends J, Bachmann P, Baracos V, et al. ESPEN guidelines on nutrition in cancerpatients [J]. Clin Nutr, 2016, In press. DOI:10.1016/j.clnu.2016.07.015.[28]V olkert D, Berner YN, Berry E, et al. ESPEN Guidelines on Enteral Nutrition:Geriatrics[J]. Clin Nutr, 2006,25(2):330-360. DOI: 10.1016/j.clnu.2006.01.012. [29]S tange I, Bartram M, Liao Y, et al. Effects of a low-volume, nutrient- andenergy-dense oral nutritional supplement on nutritional and functional status: a randomized, controlled trial in nursing home residents[J]. J Am Med Dir Assoc, 2013,14(8):628.e1-e8. DOI: 10.1016/j.jamda.2013.05.011.[30]I Jpma I, Renken RJ, Ter HGJ, et al. The palatability of oral nutritionalsupplements: before, during, and after chemotherapy[J]. Support Care Cancer, 2016,24(10):4301-4308. DOI: 10.1007/s00520-016-3263-6.[31]R elph WL. Addressing the nutritional needs of older patients[J]. Nurs OlderPeople, 2016,28(3):16-19. DOI: 10.7748/nop.28.3.16.s22.[32]G uyonnet S, Rolland Y. Screening for Malnutrition in Older People[J]. ClinGeriatr Med, 2015,31(3):429-437. DOI: 10.1016/j.cger.2015.04.009.[33]A garwal E, Miller M, Yaxley A, et al. Malnutrition in the elderly: a narrativereview[J]. Maturitas, 2013,76(4):296-302. DOI: 10.1016/j.maturitas.2013.07.013.[34]M ilne AC, Potter J, Vivanti A, et al. Protein and energy supplementation inelderly people at risk from malnutrition[J]. Cochrane Database Syst Rev, 2009,(2):CD003288. DOI: 10.1002/14651858.CD003288.pub3.[35]G ariballa S, Forster S, Walters S, et al. A randomized, double-blind,placebo-controlled trial of nutritional supplementation during acute illness[J]. Am J Med, 2006,119(8):693-699. DOI: 10.1016/j.amjmed.2005.12.006.[36]M anders M, De Groot LC, Hoefnagels WH, et al. The effect of a nutrient densedrink on mental and physical function in institutionalized elderly people[J]. J Nutr Health Aging, 2009,13(9):760-767.[37]M anders M, de Groot CP, Blauw YH, et al. Effect of a nutrient-enriched drink ondietary intake and nutritional status in institutionalised elderly[J]. Eur J Clin Nutr, 2009,63(10):1241-1250. DOI: 10.1038/ejcn.2009.28.[38]L anger G, Fink A. Nutritional interventions for preventing and treating pressureulcers[J]. Cochrane Database Syst Rev, 2014,(6):CD003216. DOI:10.1002/14651858.CD003216.pub2.[39]S tratton RJ, Ek AC, Engfer M, et al. Enteral nutritional support in prevention andtreatment of pressure ulcers: a systematic review and meta-analysis[J]. Ageing Res Rev, 2005,4(3):422-450. DOI: 10.1016/j.arr.2005.03.005.[40]S nider JT, Jena AB, Linthicum MT, et al. Effect of hospital use of oral nutritionalsupplementation on length of stay, hospital cost, and 30-day readmissions among Medicare patients with COPD[J]. Chest, 2015,147(6):1477-1484. DOI:10.1378/chest.14-1368.[41]H amilton C, Boyce VJ. Addressing malnutrition in hospitalized adults[J]. JPEN JParenter Enteral Nutr, 2013,37(6):808-815. DOI: 10.1177/0148607113497224. [42]A faghi E, Tayebi A, Ebadi A, et al. The Effect of BCAA and ISO-WHEY OralNutritional Supplements on Dialysis Adequacy[J]. Nephrourol Mon, 2016,8(6):e34993. DOI: 10.5812/numonthly.34993.[43]S ezer S, Bal Z, Tutal E, et al. Long-term oral nutrition supplementation improvesoutcomes in malnourished patients with chronic kidney disease on hemodialysis[J]. JPEN J Parenter Enteral Nutr, 2014,38(8):960-965. DOI:10.1177/0148607113517266.[44]W hitham D. Nutrition management of diabetes in acute care[J]. Can J Diabetes,2014,38(2):90-93. DOI: 10.1016/j.jcjd.2014.01.007.[45]M asuda T, Shirabe K, Yoshiya S, et al. Nutrition support and infections associatedwith hepatic resection and liver transplantation in patients with chronic liver disease[J]. JPEN J Parenter Enteral Nutr, 2013,37(3):318-326. DOI:10.1177/0148607112456041.[46]S tratton RJ, Elia M. A review of reviews: A new look at the evidence for oralnutritional supplements in clinical practice[J]. Clin Nutr Suppl, 2007,2(1):5-23.DOI:10.1016/j.clnu.2007.04.004.[47]L ee JL, Leong LP, Lim SL. Nutrition intervention approaches to reducemalnutrition in oncology patients: a systematic review[J]. Support Care Cancer, 2016,24(1):469-480. DOI: 10.1007/s00520-015-2958-4.[48]R avasco P, Monteiro-Grillo I, Vidal PM, et al. Dietary counseling improvespatient outcomes: a prospective, randomized, controlled trial in colorectal cancer patients undergoing radiotherapy[J]. J Clin Oncol, 2005,23(7):1431-1438. DOI:10.1200/JCO.2005.02.054.[49]R avasco P, Monteiro-Grillo I, Marques VP, et al. Impact of nutrition on outcome:a prospective randomized controlled trial in patients with head and neck cancerundergoing radiotherapy[J]. Head Neck, 2005,27(8):659-668. DOI:10.1002/hed.20221.[50]R avasco P, Monteiro-Grillo I, Camilo M. Individualized nutrition intervention isof major benefit to colorectal cancer patients: long-term follow-up of a randomized controlled trial of nutritional therapy[J]. Am J Clin Nutr, 2012,96(6):1346-1353. DOI: 10.3945/ajcn.111.018838.[51]B aldwin C, Spiro A, Ahern R, et al. Oral nutritional interventions in malnourishedpatients with cancer: a systematic review and meta-analysis[J]. J Natl Cancer Inst, 2012,104(5):371-385. DOI: 10.1093/jnci/djr556.[52]v an der Meij BS, Langius JA, Smit EF, et al. Oral nutritional supplementscontaining (n-3) polyunsaturated fatty acids affect the nutritional status of patients with stage III non-small cell lung cancer during multimodality treatment[J]. J Nutr, 2010,140(10):1774-1780. DOI: 10.3945/jn.110.121202. [53]v an der Meij BS, Langius JA, Spreeuwenberg MD, et al. Oral nutritionalsupplements containing n-3 polyunsaturated fatty acids affect quality of life andfunctional status in lung cancer patients during multimodality treatment: an RCT[J]. Eur J Clin Nutr, 2012,66(3):399-404. DOI: 10.1038/ejcn.2011.214. [54]H ead and Neck Guideline Steering Committee. Evidence-based practiceguidelines for the nutritional management of adult patients with head and neck cancer[DB/OL]. .au/australiawiki/index.php?oldid=116710, cited 2017 Jan 9.[55]C ong MH, Li SL, Cheng GW, et al. An Interdisciplinary Nutrition Support TeamImproves Clinical and Hospitalized Outcomes of Esophageal Cancer Patients with Concurrent Chemoradiotherapy[J]. Chin Med J (Engl), 2015,128(22):3003-3007. DOI: 10.4103/0366-6999.168963.[56]D elegge M, Wooley JA, Guenter P, et al. The state of nutrition support teams andupdate on current models for providing nutrition support therapy to patients[J].Nutr Clin Pract, 2010,25(1):76-84. DOI: 10.1177/0884533609354901.[57]G rass F, Bertrand PC, Schäfer M, et al. Compliance with preoperative oralnutritional supplements in patients at nutritional risk--only a question of will?[J].Eur J Clin Nutr, 2015,69(4):525-529. DOI: 10.1038/ejcn.2014.285.。
全新的爱色丽图形艺术标准
以无滤镜 ( o F t r N — ¨ )模式 式对色彩控制条进行测量 ,测量问 e
s 理 。导致测量结果差异的根本原因 住标准色彩控制条上进行测量 ,即 隔时问为4 。 在于各制造商所采用的仪器校准 标 I 0 35 中的无滤镜模式 。这是 16 5 s
准 并 不 完全 相 同 。 爱 色丽 对 系统 差 异 的研 究 20 年 ,爱色丽 和格 灵达一 06 麦 印刷 行 业 中最 常 用 的滤 镜 设置 。
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性 ;现 有 标 准 的最 佳 实 施 : 现 有 仪
差异的客户, 爱色丽将 负责把原有数
表 3 旧标 准 和 爱 色 丽 新 标 准 的测 量 值
器 的型号问一致性 的提 高;前爱色 丽公 司仪 器之 间及前 格灵 达一 麦克
贝斯 公 司 仪 器 之 问 的色 彩 一致 性 ;
差异 ( 字印刷用高质量打样纸 ) 数
于 色 彩 控 制 的测 量 仪 来 自许 多 不 同 得 结 果之 的 系统 差 异 进 行 量 化 , 的制 造 商 ,或 者 将 具 备 多 种 测 量 功 并 最 终确 定 新 爱色 丽 公 司 的 图形 艺
美术馆藏品二维影像采集-全国美术馆藏品普查
美术馆藏品二维影像采集1 范围本标准规定了藏品二维数字影像拍摄规范、藏品数字影像拍摄流程、银盐影像资料的扫描规范。
本标准适用于美术馆藏品二维数字影像信息采集。
2 规范性引用文件下列文件对于本文件的应用是必不可少的。
凡是注日期的引用文件,仅注日期的版本适用于本文件。
凡是不注日期的引用文件,其最新版本(包括所有的修改单)适用于本文件。
WW/T0017 馆藏文物登录规范WW/T0020 文物藏品档案规范3 术语和定义下列术语和定义适用于本标准。
3.1 分辨率指每英寸长度包含的像素点的数量(PPI),像素数决定了位图图像细节的精细程度,图像的分辨率越高,所包含的像素越多,所记录的图像越清晰。
3.2 色彩模式指影像数据记录颜色的方式,通常分为:RGB色彩模式、CMYK色彩模式、Lab色彩模式。
3.3 色深色深亦可称为色位深度,用来描述单个像素单个颜色所包含的颜色值,位值越大,单色分辨级数就越多。
3.4 色温描述光源颜色的参量。
在不同温度下绝对黑体(一种对外来辐射既不反射也不透射,而是全部吸收的物体)可以辐射出的不同颜色的光,而且辐射光的颜色只和温度有关,温度确定,光的颜色也就确定。
色温是以绝对温度K表示。
3.5 显色指数光源对物体显色能力的描述,光源显色指数越高色彩再现能力就越强,所采集到的影像颜色就越丰富,色彩还原越真实。
3.6 JPEG格式世界标准化组织“联合摄影师专家组”(Joint Photographic Experts Group)制定的对采用位图表示法的数字影像的压缩算法。
文件的后缀名是.JPG,是当前常用的一种有损压缩算法。
3.7 TIFF格式Tagged Image File Format(标记图像文件格式)的缩写,文件的后缀名是.TIF,这是现阶段印刷行业使用最广泛的文件格式。
这种文件格式是由Aldus和Microsoft公司为存储黑白图像、灰度图像和彩色图像而定义的存储格式。
3.8 RAW格式CCD(Charge Coupled Device电荷耦合元件)或CMOS (Complementary Metal Oxide Semiconductor互补金属氧化物半导体)在将光信号转换为电信号时的电平高低的原始记录,单纯地记录了数字相机传感器的原始信息。
200703-DIVING-PAM中文操作手册
水下调制荧光仪——DIVING-PAM操作手册2006年11月版泽泉国际集团(香港)有限公司 泽 泉 科 技 有 限 公 司 德国WA L Z 公司中国技术服务中心中国总部:上海市中江路879号天地软件园28幢402-403座 (200333)电话:021-********/13/14/15/16/17/18 传真:021-********E-Mail :sevice@ 网址:北京分部:北京市海淀区花园北路48号院华思特商务楼209室(100083)电话:010-********/53/58,89110167 传真:010-********转20成都分部:成都市人民南路1段97号现代之窗1018室 (610016)电话:028-********,86719836 传真:028-********目录1 安全指导...................................................................................................................................- 4 -1.1 一般安全指导................................................................................................................- 4 -1.2 特殊安全指导................................................................................................................- 4 -2 光合作用与叶绿素荧光原理....................................................................................................- 5 -2.1 光合作用基本过程........................................................................................................- 5 -2.2 活体叶绿素荧光..........................................................................................................- 7 -2.2.1 叶绿素荧光的产生............................................................................................- 7 -2.2.2 叶绿素荧光诱导曲线........................................................................................- 8 -2.2.3 调制叶绿素荧光的测量....................................................................................- 8 -2.2.4 光响应曲线和快速光曲线..............................................................................- 10 -2.2.5 叶绿素荧光的暗弛豫......................................................................................- 10 -2.2.6 调制叶绿素荧光成像......................................................................................- 11 -3 DIVING-PAM简介..................................................................................................................- 12 -4 常用荧光参数.........................................................................................................................- 13 -4.1 Fo、Fm和Fv/Fm.........................................................................................................- 13 -4.3 Fm’.................................................................................................................................- 13 -4.3 Ft....................................................................................................................................- 13 -4.4 量子产量Yield.............................................................................................................- 13 -4.5 ETR和PAR..................................................................................................................- 14 -4.6 qP、qN和NPQ............................................................................................................- 14 -5 基础操作步骤.........................................................................................................................- 16 -6 按键操作.................................................................................................................................- 17 -6.1 单键操作......................................................................................................................- 17 -6.2 双键操作......................................................................................................................- 18 -7 数据存储功能.........................................................................................................................- 19 -8 MODE菜单介绍......................................................................................................................- 20 -8.1 MODE界面列表...........................................................................................................- 20 -8.2 MODE界面功能介绍...................................................................................................- 21 -9 DIVING-PAM的组成..............................................................................................................- 28 -9.1 主控单元......................................................................................................................- 28 -9.1.1 荧光的激发与检测............................................................................................- 28 -9.1.2 内置卤素灯.......................................................................................................- 29 -9.1.3 可充电电池.......................................................................................................- 29 -9.1.4 显示器...............................................................................................................- 30 -9.1.5 电子元件...........................................................................................................- 30 -9.1.6 接口介绍...........................................................................................................- 30 -9.2 标准光纤DIVING-PAM/F和微光纤DIVING-PAM/F1...........................................- 32 -9.3 光量子传感器..............................................................................................................- 32 -9.4 深度传感器..................................................................................................................- 33 -9.5 水温传感器..................................................................................................................- 33 -9.6 水下通用样品架DIVING-USH..................................................................................- 33 -9.6.1 介绍...................................................................................................................- 33 -9.6.2 应用方法:叶片状样品....................................................................................- 35 -9.6.3 应用方法:珊瑚、附着藻类等样品................................................................- 36 -9.6.4 应用方法:暗适应后测量Fv/Fm....................................................................- 37 -9.6.5 应用方法:测量叶片状样品吸收到的PAR...................................................- 38 -9.6.6 DIVING-USH的详细配件................................................................................- 39 -9.7 特殊叶夹/样品室.......................................................................................................- 40 -9.7.1 暗适应叶夹DIVING-LC................................................................................- 40 -9.7.2 表面样品室DIVING-SH(适合于珊瑚等0.................................................- 40 -9.7.3 磁性样品架DIVING-MLC(可选).............................................................- 40 -10 数据传输...............................................................................................................................- 42 -11 通过PC终端控制DIVING-PAM........................................................................................- 43 -12 维护.......................................................................................................................................- 44 -12.1 内置电池的更换......................................................................................................- 44 -12.2 卤素灯的更换..........................................................................................................- 46 -12.3 EPROM的更换........................................................................................................- 47 -12.4 保险丝的更换..........................................................................................................- 47 -12.5 清洁..........................................................................................................................- 47 - 附录1 技术参数......................................................................................................................- 48 - 附录2 警告和错误列表..........................................................................................................- 50 - 附录3 PIN分配.......................................................................................................................- 51 - 附录4 PC终端控制DIVING-PAM的命令列表...................................................................- 52 - 附录5 部分荧光基础理论文献...............................................................................................- 55 - 附录6 部分利用DIVING-PAM发表的文献.........................................................................- 59 -1 安全指导1.1 一般安全指导为避免触电,请不要拆开DIVING-PAM的主机。
萧育仁-南台科技大学机械工程系
姓名:蕭育仁職稱:副教授電話分機:3521辦公室:K202-4E-Mail:yujen@.tw實驗室:最高學歷:國立成功大學材料科學與工程博士研究領域:微感測器製作、半導體元件、新興能源材料、精密機械感測元件學術榮譽1.2011年IEEE電子元件最重要的國際會議IEDM 正式發表,更被大會選為重點宣傳論文之一(First author )。
2.2013被國際SCI系列之International Journal of Photoenergy期刊邀請擔任客座主編 (Invitation to Guest Editor).獲獎1.榮獲第四屆(2010年)國家實驗研究院傑出科技貢獻獎優等。
2.韓國首爾國際發明展金牌(2013年)。
作品名稱:氧化鋅奈米柱之紫外光檢測器。
3.第十九屆(2015年)奈米工程暨微系統技術研討會報告佳作獎。
4.韓國首爾國際發明展金牌 (2016年)。
作品名稱:氧化鋅奈米片狀結構之多功能感測器。
5.榮獲(2018年)奈米元件技術研討會論文優等獎6.榮獲第十二屆(2018年)國家實驗研究院傑出科技貢獻獎佳作。
期刊論文1.You-Ting Tsai, Shoou-Jinn Chang, I-Tseng. Tang, Yu-Jen Hsiao*, and Liang-Wen Ji, High density novel porous ZnO nanosheets based on amicroheater chip for ozone sensors, IEEE Sensors Journal 18 (2018) 5559-5565.2.Tang-Yu Lai, Yu-Jen Hsiao and Te-Hua Fang, In situ deformation and mechanical properties of bismuth telluride prepared via zone melting, MaterialsResearch Express 5 (2018) 035010.3.Kai-Peng Lin,Yu-Jen Hsiao, Te-Hua Fang, Bo-Yi Yang, Characteristics of Molybdenum Disulfide Nanoparticles for Heterojunction Polymer SolarCells, Journal of Nanoscience and Nanotechnology 18 (2018) 2576-2581(6).4.Ming-Fong Tsai, Chin Hsu, Chen-Sheng Yeh, Yu-Jen Hsiao, Chia-Hao Su, and Li Fang Wang, Tuning the Distance of Rattle-Shaped IONP@Shell-in-Shell Nanoparticles for Magnetically-Targeted Photothermal Therapy in the Second Near-Infrared Window, ACS Applied Materials & Interfaces (2018), 10 (2),1508–1519. (I.F.=8.1)5.Yu-Jen Hsiao, Shi-Hao Wang, Te-Hua Fang, Liang-Wen Ji, Annealing effect on electrical, nanomechanical and sensing properties of ZnO/Mo/ZnOnanofilms, Microsystem Technologies (2017) in press. DOI 10.1007/s00542-017-3615-26.Tang-Yu Lai, Yu-Jen Hsiao and Te-Hua Fang, Mechanical properties of CIGS film with different metallic composition by co-evaporation method,Materials Research Express 4 (2017) 115006.7.Kin-Tak Lam, Yu-Jen Hsiao*, Liang-Wen Ji*, Te-Hua Fang, Kai-Hua Hsiao, Tung-Te Chu, High-Sensitive Ultraviolet Photodetectors Based on ZnONanorods/CdS Heterostructures, Nanoscale Research Letters, 12 (2017) 31.8.Yu-Jen Hsiao*, Liang-Wen Ji, Hao-Ying Lu, Te-Hua Fang, Kai-Hua Hsiao, High Sensitivity ZnO Nanorod-Based Flexible Photodetectors Enhanced byCdSe/ZnS Core-Shell Quantum Dots, IEEE Sensors Journal 17 (2017) 3710 - 3713.9.Shi-Hao Wang, Yu-Jen Hsiao, Te-Hua Fang*, Enhanced electrical conductivity and mechanical properties of Mo-interlayered ZnO multilayer nanofilmsfor NO sensor, Surface and Coatings Technology, 307 (2016) 622-624.10.Chih-Hao Liang*, Yu-Jen Hsiao, Weng-Sing Hwang, Comparative study of structural and electro-optical properties of ZnO:Ga films grown by steeredcathodic arc plasma evaporation and sputtering on plastic and their application on polymer-based organic solar cells, Thin Solid Films, 612, (2016) 419–429.11.Shang-Chou Chang*, Yu-Jen Hsiao, Tien-Chai Lin, To-Sing Li , Syu-An Zeng, Chen-En Yu, Improving Power Conversion Efficiency of P3HT/PCBMbased Organic Solar Cells by Optimizing Graphene Doping Concentration and Annealing Temperature, International Journal of Electrochemical Science, 11 (2016) 5819-5828.12.Sean Wu*, Chin-Hsiang Cheng, Yu-Jen Hsiao, Rei-Cheng Juang and Wen-Fu Wen, Fe2O3 Films on Stainless Steel for Solar Absorbers, Renewable &Sustainable Energy Reviews 58 (2016) 574-580. (I.F.=9.1)13.Yu-Jen Hsiao, Te-Hua Fang*, Liang-Wen Ji and Bo-Yi Yang, "Red-shift effect and sensitive responsivity of MoS2/ZnO flexible photodetectors",Nanoscale Research Letters 10 (2015) 443.14.Tung-Te Chu, Yu-Jen Hsiao, Liang-Wen Ji*, and Jhih-Wei Yang, “Metal-insulator-semiconductor -insulator-metal structure of TiO2/SiO2 Thin Filmsfor Ultraviolet (UV) Photodetectors”, International Journal of Electrochemical Science 10 (2015) 8951-8958.15.Te-Hua Fang*, Yu-Jen Hsiao, Shao-Hui Kang, “Mechanical characteristics of copper indium gallium diselenide compound nanopillars using in situtransmission electron microscopy compression”, Scripta Materialia, 108 (2015) 130-135.16.Sheng-Hung Chou, Yu-Jen Hsiao, Te-Hua Fang*, Po-Hsun Chou, “Synthesis and characteristics of ZnS nanospheres for heterojunction photovoltaicdevice”, Journal of Materials Engineering and Performance, 24 (2015) 2282-2286.17.Shi-Hao Wang, Yu-Jen Hsiao, Te-Hua Fang, “Fabrication and optoelectronic and nanomechanical properties of AZO/Mo/AZO multilayer thin films,Science of Advanced Materials 7 (2015) 1605-1610 (I.F.=2.9).18.Zhe-Wei Chiu, Yu-Jen Hsiao, Te-Hua Fang, Liang-Wen Ji, “Photoluminescence and Optoelectronics Characteristics of Eu-doped InBO3Nanocrystals” International Journal of Electrochemical Science 10 (2015) 2391-2399 (I.F.=1.5).19.Liang-Wen Ji, Yu-Jen Hsiao, Sheng-Joue Young, Wei-Shun Shih, Walter Water, and Shiau-Mei Lin, “High-Efficient Ultraviolet Photodetectors Basedon TiO2/Ag/TiO2 Multilayer Films” IEEE Sensors Journal, 15 ( 2015) 762-765 (I.F.=2.5).20.Shi-Hao Wang, Yu-Jen Hsiao, Te-Hua Fang, Sung-Long Chen, Shao-Hui Kang,”P3HT:PCBM Doped with Multi-walled Carbon Nanotubes forEnhancing Efficiency and Nanomechanical Properties of Hybrid Photovoltaics” Science of Advanced Materials 7 (2015) 278-282 (I.F.=2.9).21.Shang-Chou Chang, Yu-Jen Hsiao and To-Sing Li, “Selecting Annealing Temperature of P3HT/PCBM Incorporated with Nano-diamonds UsingThermal Desorption Spectroscopy”, International Journal of Electrochemical Science 10 (2015) 1658-1668 (I.F.=1.9).22.Han-Ting Hsueh, Yu-Jen Hsiao*, Yu-De Lin, and Chung-Lin Wu, “Bifacial structures of ZnS humidity sensor and Cd-free CIGS photovoltaic cell asself-powered device” IEEE Electron Device Letters 35 (2014) 1272-74 (I.F.=3.0).23.Shi-Hao Wang, Yu-Jen Hsiao, Te-Hua Fang, Liang-Wen Ji, Ming-Horng Lin, Shao-Hui Kang, Yu-Chao Lee, “A textured SiO2 antireflection layer forefficient organic solar cells”, Surface Topography: Metrology and Properties 2 (2014) 035005. (IOP New Journal)24.Shang-Chou Chang, Yu-Jen Hsiao and To-Sing Li, “Improving the Power Conversion Efficiency of Organic Solar Cell by Blending with CdSe/ZnSCore-Shell Quantum Dots”, Journal of Electronic Materials 43 (2014) 3077-3081 (I.F.=1.7).25.Zhe-Wei Chiu, Yu-Jen Hsiao, Te-Hua Fang, Liang-Wen Ji, “Optical properties of yellow-light-emitting LiZnVO4:Eu3+ phosphor prepared by sol-gelmethod”, Journal of Sol-Gel Science and Technology 69 (2014) 229 (I.F.=1.5).26.Shi-Hao Wang, Yu-Jen Hsiao, Te-Hua Fang, Sung-Long Chen, and Shao-Hui Kang,“Effects of ITO film annealing temperature on hybrid solar cellperformance” Microsystem Technologies 20 (2014) 1181 (I.F.=0.95)27.Yu-Jen Hsiao, Chung-Hsin Lu, Liang-Wen Ji, Teen-Hang Meen, Yan-Lung Chen, Hsiao-Ping Chi,” Characterization of Photovoltaics with In2S3Nanoflakes / p-Si Heterojunction” Nanoscale Research Letters 9 (2014) 32 (I.F.=2.5).28.Shang-Chou Chang, Yu-Jen Hsiao and To-Sing Li, “P3HT:PCBM Incorporated with Silicon Nanoparticles as Photoactive Layer in Efficient OrganicPhotovoltaic Devices”, Journal of Nanomaterials 2013 (2013) 354035(I.F.=1.7).29.Liang-Wen Ji, Yu-Jen Hsiao, I-Tseng Tang, Teen-Hang Meen, Chien-Hung Liu, Jenn-Kai Tsai , Tien-Chuan Wu, Yue-Sian Wu,” Annealing effectand photovoltaic properties of nano-ZnS/textured p-Si heterojunction” Nanoscale Research Letters 8 (2013) 470 (I.F.=2.5).30.Shi-Hao Wang, Yu-Jen Hsiao, Te-Hua Fang, Ming-Horng Lin and Shao-Hui Kang, “Enhancing performance and nanomechanical properties of carbonnanotube doped P3HT:PCBM solar cells” ECS Journal of Solid State Science and Technology 2 (11) (2013) M52-M55.. (I.F.=0.9)31.Zhe-Wei Chiu, Yu-Jen Hsiao, Te-Hua Fang, Liang-Wen Ji,“ Morphology and Optical Performance of Graphene-doped Organic Photovoltaic Cells”Microsystem Technologies 19 (2013) 1781. (I.F.=0.95)32.Yu-Jen Hsiao, Chung-Hsin Lu, Te-Hua Fang,” To enhance performance of light soaking process on ZnS/CuIn1-xGaxSe2 solar cell” InternationalJournal of Photoenergy 2013, 561948 (2013) .33.Y. J. Hsiao, T. H. Meen, L. W. Ji, J. K. Tsai, Y. S. Wu, C. J. Huang,” Preparation of ZnS microdisks using chemical bath deposition and ZnS/p-Siheterojunction solar cells” Journal of Physics and Chemistry of Solids 74 (2013) 1403. (I.F.=1.60)34.Yu-Jen Hsiao, Te-Hua Fang, Liang-Wen Ji, Yu-Chao Lee, Bau-Tong Dai, “Size effect of nanodiamonds on P3HT:PCBM heterojunction solar cells”Electrochemistry Communications. 18 (2012) 4. (I.F.=4.3)35.Yu-Jen Hsiao, Yin-Lai Chai, Liang-Wen Ji, Te-Hua Fang, Teen-Hang Meen, Jenn-Kai Tsai, Kan-Lin Chen, Stephen D. Prior, “Optical Characteristicsof LiZnVO4 Green Phosphor at Low Temperature Preparation” Materials Letters 70 (2012) 163. (I.F.=2.3)研討會論文1.Liang-Wen Ji, Yu-Jen Hsiao*, I-Tseng Tang, Wen-Nan Lin, Hsiao-Ping Chi, Research and development of new hybrid optical detector, 2017 IEEEInternational Conference on Applied System Innovation (IEEE ICASI 2017), Sapporo Japan, May 13-17, 2017.2.Sheng-Hung Chou, Yan Liu, Maria Durham, Sze Pei Lim, Te-Hua Fang, Yu-Jen Hsiao*, Test method to evaluate a robust ball grid array (BGA) ballmount flux, The 18th IEEE Electronics Packaging Technology Conference, Singapore, 30th Nov – 3rd Dec 2016.3.Liang-Wen Ji, Chih-Pin Hsiao, Yu-Jen Hsiao, Ta-Min Liu, Lithium doped Zinc Oxide nanorod-based the metal-semiconductor-metal (MSM) UVphotodetector, The 8rd International Symposium on Advanced Plasma Science and its Applications for Nitrides and Nanomaterials, Nagoya, March 6-10, 2016.4.Shi-Hao Wang, Yu-Jen Hsiao, Te-Hua Fang, “Metal Oxide Conductivity and Nanomechanical Properties of ZnO/Mo/ZnO Multilayer Thin FilmsDeposited By RF Magnetron Sputtering“ The 228th Meeting of the electrochemical society (ECS), Phoenix USA, October 11-15, 2015.5.Tung-Te Chu, Yu-Jen Hsiao, Jhih-Wei Yang, and Liang-Wen Ji,“TiO2 based thin films for ultraviolet (UV) photodetectors using Micro-Electro-Mechanical Systems technology“Symposium on Nano Device Technology, Hsinchu Taiwan, September 10, 2015.技術報告專利1.Yu-Jen Hsiao, Ting-Jen Hsueh, Jia-Min Shieh, Yu-Ming Yeh, Bau-Tong Dai,Fu-Liang Yang, SEMICONDUCTOR STRUCTURE AND METHOD OFFABRICATING THE SAME 美國發明專利通過US 2014/0008726A1 (2015) 。
Product_Spec_MT4601B02-1_Ver.1.1_20120803_201308232462
MT4601B02-1 Product SpecificationVer. 1.1ContentsRevision History (4)1. General Description (5)1.1 Product Features (5)1.2 Overview (5)1.3 General Information (5)2. Absolute Maximum Ratings (6)2.1 Absolute Maximum Ratings (Ta = 25 ± 2 °C) (6)2.2 Environment Requirement (6)2.3 Package Storage (7)3. Electrical Specification (8)3.1 Electrical Characteristics (8)3.1.1 Power Consumption (Ta = 25 ± 2 ºC) (8)3.1.2 LVDS Characteristics (9)3.2 Backlight Converter Unit (10)3.2.1 LED Converter Electrical Characteristics (Ta = 25 ± 2 ºC) (10)3.2.2 LED Converter Power Sequence (11)4. Electrical Block Diagram (12)5. Input Terminal Pin Assignment (13)5.1 TFT LCD Module (13)5.2 Converter Unit (15)5.2.1 Converter Input Connector Pin Definition (15)5.3 Block Diagram of Interface (16)5.4 LVDS Interface (16)5.4.1 VESA Format (SELLVDS = H) (16)5.4.2 JEIDA Format (SELLVDS = L or Open) (16)5.5 Color Data Input Assignment (17)6. Interface Timing (18)6.1 Timing Table (DE Only Mode) (18)6.2 Power On/Off Sequence (19)7. Optical Characteristics (20)7.1 Measurement Conditions (20)7.2 Optical Specifications (21)8. Mechanical Characteristics (25)8.1 Mechanical Specification (25)8.2 Packing (27)8.2.1 Packing Specifications (27)8.2.2 Packing Method (27)9. Definition of Labels (29)9.1 Module Label (29)9.2 Carton Label (29)9.3 Pallet Label (30)10. Precautions (31)10.1 Assembly and Handling Precautions (31)10.2 Safety Precautions (31)Revision History1. General Description1.1 Product Features-FHD Resolution (1920 x 1080)-High Brightness: 350 cd/m²-Very High Contrast Ratio: 4000:1-Fast Response Time-High Color Saturation: 72% NTSC-Ultra Wide Viewing Angle: 178° (H)/178° (V) (CR ≥ 10) -Low Power Consumption: Typ. 85 W2. Absolute Maximum Ratings2.1 Absolute Maximum Ratings (Ta = 25 ± 2 °C)The followings are maximum values which, if exceeded, may cause damage to the unit.The maximum operating temperature is based on the test condition that the surface temperature of display area is less than or equal to 65 ºC with LCD module in a temperature controlled chamber alone. Thermal management should be considered in final product design to prevent the surface temperature of display area from being over 65 ºC. The range of operating temperature may degrade in case of improper thermal management in the end product design.(3) The TFT module including glass should be avoided any shock or vibration.While testing shock and vibration, the fixture holding the module should be assured to be hard and rigid enough to prevent the module twisted or bent by the fixture. The test conditions should be less than:Shock (Non-operating): 35 G, 11 ms, half sine wave, 1 time for ± X, ± Y, ± Z.Vibration (Non-operating): Random 1.0 Grms, 10 ~ 200 Hz, 10 min, 1 time for each X, Y, Z.2.3 Package StorageWhen storing modules as spares for a long time, please follow the precaution instructions:(1) Do not store the module in high temperature and high humidity for a long time. It is highly recommended to store themodule with temperature from 0 ºC to 35 ºC in normal humidity.(2) The module shall be stored in a dark area and avoided to be exposed in direct sunlight or fluorescent light.3. Electrical Specification3.1 Electrical CharacteristicsFig. 3.2 Test patterns3.2 Backlight Converter UnitFig. 3.5 The power sequence of V BL and V BLONNOTE:The power sequence :POWER ON : V BL > V P_DIM >V BLON POWER OFF :V BLON >= V P_DIM> V BLV V V4. Electrical Block Diagram5. Input Terminal Pin Assignment5.1 TFT LCD ModuleCN1: 0-511037-5 (Xi Da Yi Tong) or equivalent (see Note (1))CN1(6)Fig. 5.1 LVDS connector direction sketch map(2) For CSOT internal only, please let it open.(3) High: connect to + 3.3 V →VESA format; Low: connect to GND or Open →JEIDA format.5.2 Converter Unit5.2.1 Converter Input Connector Pin DefinitionCN1: CI0114M1HR0-NH (Cvilux) or equivalent (see 5.2 Note (1))Fig. 5.2 Power input connector direction sketch map Attention:If the external PWM function includes 10% dimming ratio, the judge conditions are as below:(1) Backlight module must be lighted on normally.(2) All protection functions must work normally.(3) Uniformity and flicker could not be guaranteed.5.3 Block Diagram of InterfaceFig. 5.5 JEIDA format5.5 Color Data Input AssignmentThe brightness of each primary color is based on the 8-bit gray scale data input for each color. The higher the binary input, the brighter the color. The table below provides the assignment of the color versus.Attention:0: Low level voltage; 1: High level voltage.6. Interface TimingFig. 6.1 Interface signal timing diagram6.2 Power On/Off SequenceTo prevent a latch-up or DC operation of LCD module, the power on/off sequence should be as the diagram below.(2) Apply the lightbar voltage within the LCD operation range. When the backlight turns on before the LCD operation or theLCD turns off before the backlight turns off, the display may momentarily become abnormal screen.(3) In case that V CC is in off level, please keep the level of input signals on the low or high impedance. If T2 < 0, that maycause electrical overstress.(4) T4 should be measured after the module has been fully discharged between power off and on period.(5) Interface signal shall not be kept at high impedance when the power is on.7. Optical Characteristics7.1 Measurement ConditionsThe table below is the test condition of optical measurement.N means the actual number of the pixels in the area S.7.2 Optical SpecificationsThe table below of optical characteristics is measured by MINOLTA CS2000, MINOLTA CA310, ELDIM OPTI Scope-SA and ELDIM EZContrast in dark room.CR-W is the luminance measured by LMD(light-measuring device) at the center point of the LCD module with full-screen displaying white. The standard setup of measurement is illustrated in Fig. 7.3;CR-D is the luminance measured by LMD at the center point of the LCD module with full-screen displaying black.(2) The LMD in the item could be a spectroradiometer such as (KONICA MINOLTA) CS2000, CS1000, (TOPCON) SR-UL2or the same level spectroradiometer. Other display color analyzer (KONICA MINOLTA) CA210, CA310 or (TOPCON) BM-7 could be involved after being calibrated with a spectroradiometer on each stage of a product.Fig. 7.3 The standard setup of CR measurement(3) Response time T L is defined as the average transition time in the response time matrix. The table below is the responseX to YAll the transition time is measured at the center point of the LCD module by ELDIM OPTI Scope-SA.(4) Definition of center luminance (L W):The luminance is measured at the center point of the LCD module with full-screen displaying white. Fig. 7.5 shows the standard setup of luminance measurement.and themin Uniformity=L(6)color R,G,B and white.G,Bcoordinates and the area is defined by NTSC1953color standard in the CIE color space.Chromaticity coordinates are measured by CS2000 and the standard setup of measurement is shown in Fig. 7.7.Fig. 7.7 The standard setup of color chromaticity measurement (7) Definition of viewing angle coordinate system (θH, θV):angles: upθV+8. Mechanical Characteristics 8.1 Mechanical Specification8.2 PackingFig. 8.1 Packing method (protector film stick on the front of the LCD module)Protector Film LCD Module PE BagCorrugated BoardPP BeltCarton LabelTop CushionMasking TapePalletBottom CushionAround BoardLCD ModuleEarth CoverPallet Label PalletPE FilmPE SheetPP BeltFig. 8.2 Shipping method9. Definition of Labels 9.1 Module LabelManufactured Date:Year: 2010 = 10, 2011 = 11…2020 = 20, 2021 = 21…9.3 Pallet LabelSerial Number: XXX XX XXX XXXXXCSOT Internal UseYear, MonthMT4601B02-1 Product Specification 10. Precautions10.1 Assembly and Handling Precautions(1) Do not apply rough force such as bending or twisting to the LCD module during assembly.(2) It is recommended to assemble or install a LCD module into the user’s system in clean working areas. The dustand oil may cause electrical short or damage the polarizer.(3) Do not apply pressure or impulse to the LCD module to prevent the damage to LCD panel and backlight.(4) Always follow the correct power-on sequence. This can prevent the damage and latch-up to the LSI chips.(5) Do not plug in or pull out the interface connector while the module is in operation.(6) Do not disassemble the LCD module.(7) Use soft dry cloth without chemicals for cleaning because the surface of polarizer is very soft and easily bescratched.(8) Moisture can easily penetrate into the LCD module and may cause the damage during operation.(9) High temperature or humidity may deteriorate the performance of the LCD module. Please store LCD modules inthe specified storage conditions.(10) When ambient temperature is lower than 10ºC, the display quality might be deteriorated. For example, theresponse time will become slow, and the starting voltage of LED light bar will be higher than that in roomtemperature.10.2 Safety Precautions(1) If the liquid crystal material leaks from the panel, it should be kept away from the eyes or mouth. In case ofcontact with hands, skin or clothes, it has to be washed away thoroughly with soap.(2) After the LCD module’s end of life, it is not harmful in case of normal operation and storage.The copyright belongs to Shenzhen China Star 31 / 31 Ver. 1.1 Optoelectronics Technology Co., Ltd.Any unauthorized use is prohibited.。
Tetrahedron Letters, Volume 42, Issue 30, 23 July 2001, Pages 5121-5122
TETRAHEDRONLETTERSTetrahedron Letters42(2001)5121–5122PergamonReactions of7-polyfluoroalkylnorkhellins with alkyl mercaptoacetates:a simple synthesis of dihydrothienopsoralens and benzofuran derivatives of2-oxa-7-thiabicyclo[3.2.1]octaneVyacheslav Ya.Sosnovskikh*and Boris achevDepartment of Chemistry,Ural State University,620083Ekaterinburg,RussiaReceived26April2001;revised25May2001;accepted1June2001Abstract—Newfluoro-containing derivatives of khellin were synthesized from7-polyfluoroalkylnorkhellins and alkyl mercapto-acetates.©2001Elsevier Science Ltd.All rights reserved.The natural furochromone khellin(4,9-dimethoxy-7-methyl-5H-furo[3,2-g][1]benzopyran-5-one),obtainedfrom the fruits and seeds of Ammi visnaga L.possessesa high antiatherosclerotic and lipid-altering activity1and is the active constituent of many modernmedicines.2In view of the unique biological propertiesdisplayed by khellin on the one hand and by manyfluorinated heterocyclic compounds3on the other hand,we have described recently4the synthesis of7-tri-halomethylnorkhellins,which are highly reactive build-ing blocks for the preparation of new khellinderivatives with potential biological activity.The present work is devoted to the study of the interac-tion of these compounds with alkyl mercaptoacetates.It is known5that the reaction of3,3-dialkyl-6-trifluoro-methyl-2,3-dihydro-4-pyrones with alkyl mercapto-acetates in the presence of Et3N involves both elec-trophilic centers of the dihydropyrones and occurswithout ring cleavage to give derivatives of2-oxa-7-thia-bicyclo[3.2.1]octane1.At the same time,the interactionof2-trifluoromethylchromones with a threefold excessof ethyl mercaptoacetate is a redox process that affordsdihydrothienocoumarins2and diethyl3,4-dithiadipatein a high yield6(Scheme1).Taking into account the results of previous work,5,6wewould expect that7-polyfluoroalkylnorkhellins3a–c,being chromones,would react with alkyl mercapto-acetates to form dihydrothienocoumarins2.However,we found that,despite the structural similarly withchromones,they behave in this reaction as dihydro-pyrones and give compounds4a–d in53–85%yields7(Scheme2).It should be noted that khellin,7-perfluorobutyl-and7-trichloromethylnorkhellins donot react with alkyl mercaptoacetates under these con-ditions and we failed to isolate the individual reactionproducts from7-perfluoroethyl-and7-perfluoro-propylnorkhellins.According to the1H NMR data of4a–d,which exhibitonly one set of signals,the reaction is highly stereo-selective and results in the formation of only onediastereomer with the cis-arrangement of the sub-stituents in the tetrahydrothiophene ring.This is mostlikely related to the formation of an intramolecularhydrogen bond between the hydroxyl and carbonylgroups(the IR spectra of4a–d in CHCl3solution had abonded peak at3470–3495cm−1,which were unchangedupon dilution).It seems probable that little,if any,OH···O C intramolecular hydrogen bonding interac-tions can occur in trans-isomer.Whenfluorokhellins3a–c were heated in a sealedampoule at140–150°C for 1.5h with an excess of Scheme1.Keywords:7-polyfluoroalkylnorkhellins;alkyl mercaptoacetates;di-hydrothienopsoralens;benzofuran derivatives of2-oxa-7-thia-bicyclo-[3.2.1]octane.*Corresponding author.Fax:+73432615978;e-mail:vyacheslav.sosnovskikh@usu.ru0040-4039/01/$-see front matter©2001Elsevier Science Ltd.All rights reserved.PII:S0040-4039(01)00948-0V .Ya .Sosno 6skikh ,B .I .Usache 6/Tetrahedron Letters 42(2001)5121–51225122Scheme 2.Reaction conditions :(i)HSCH 2CO 2R,Et 3N, 20°C,3–10days;(ii)HSCH 2CO 2R,Et 3N,140–150°C,1.5h.References1.Gammill,R.B.;Day,C.E.;Schurr,P.E.J .Med .Chem .1983,26,1672–1674.2.Mashkovskii,M. D.Lekarstvennye sredstva ;Vilnyus,1993;Vol.1,p.396.anofluorine Compounds in Medicinal Chemistry and Biomedical Applications ;Filler,R.;Kobayashi,Y.;Yagu-polskii,L.M.,Eds.;Elsevier:Amsterdam,1993.4.Sosnovskikh,V.Ya.;Kutsenko,V.A.Mendeleev Com -mun .2000,238–239.5.Sosnovskikh,V.Ya.;Mel ’nikov,M.Yu.Mendeleev Com -mun .1998,198–199.6.Sosnovskikh,V.Ya.;Usachev, B.I.;Sevenard, D.V.;Lork,E.;Ro ¨schenthaler,G.-V.Tetrahedron Lett .2001,42,5117–5119.7.Preparation of 4a :a mixture of fluorokhellin 3a (0.25g,0.8mmol)and ethyl mercaptoacetate (0.5g,4.2mmol)in the presence of one drop of Et 3N without solvent was kept for 3days at room temperature.Then the reaction mixture was diluted with 5ml of ethanol and the crystalline material was isolated by filtration and washed with ethanol to give 0.25g (72%yield)of compound 4a ,mp 148–149°C.After recrystallization from butanol,the melting point did not change.1H NMR (250MHz,CDCl 3,l ,ppm,J /Hz):1.35(t,3H,MeCH 2,J =7.1),2.52(d,1H,CH H,J AX =11.7),3.50(d,1H,CHH ,J AX =11.7),4.01(s,3H,MeO),4.23(s,3H,MeO),4.28(q,2H,CH 2Me,J =7.1),4.29(s,1H,CH),5.91(s 1H,OH),6.87(d,1H,H 3,J =2.3),7.56(d,1H,H 2,J =2.3).IR (Vaseline oil,cm −1):3480(OH),3170,3140( CH),1740(C O),1630,1610,1540(arom.).Found (%):C,49.80;H,3.75.Calcd for C 18H 17F 3O 7S (%):C,49.77;H,3.94.8.Preparation of 5a :a mixture of fluorokhellin 3a (0.25g,0.8mmol)and ethyl mercaptoacetate (0.5g,4.2mmol)in the presence of one drop of Et 3N without solvent was heated in a sealed ampoule at 140–150°C for 1.5h.After cooling,the reaction mixture was diluted with 5ml of ethanol –water (3:1)and the crystalline material was iso-lated by filtration and washed with aqueous ethanol to give 0.1g (34%yield)of compound 5a ,mp 187–188°C.1H NMR (400MHz,CDCl 3,l ,ppm,J /Hz):3.96–4.17(AB-part of ABX-system,2H,CH 2,2J AB =19.3;l A =4.14,l B =4.00,3J AX =4.1,3J BX =10.8),4.33–4.43(m,1H,CH),6.98(d,1H,H 3,J =2.3),7.64(d,1H,H 2,J =2.3).IR (Vaseline oil,cm −1):1720(C O),1610,1580,1550w (arom.).Found (%):C,51.63;H,2.89.Calcd for C 16H 11F 3O 5S (%):C,51.62;H,2.98.9.Zoubir, B.;Refouvelet, B.;Aubin, F.;Humbert,P.;Xicluna,A.J .Heterocyclic Chem .1999,36,509–513.HSCH 2CO 2Et in the presence of Et 3N,we succeeded in obtaining dihydrothienopsoralens 5a ,b in 34and 17%yields,respectively.8Fluorokhellin 3c does not react under these conditions.A similar heterocyclic system with an aryl group instead of the poly fluoroalkyl sub-stituent has recently 9been synthesized from the corre-sponding o -hydroxychalcones and ethyl mercapto-acetate.Treatment of compound 4a with ethyl mercapto-acetate under similar conditions gave dihydrothieno-psoralen 5a in 64%yield,which indicates the intermedi-acy of compounds 4in the transformation of khellins 3into psoralens 5.Thus,as expected,4the replacement of the methyl group in khellin by the poly fluoroalkyl group substan-tially increases the reactivity of the pyrone ring of the khellin system toward nucleophiles and makes it possi-ble to design from it new fluoro-containing hetero-cycles,which are of interest as biologically active com-pounds.AcknowledgementsThis work was supported by the RFBR (grant No.99-03-32960)and CRDF (grant No.REC-005)..。
漫威汽车系列的数字目录说明书
Digital CatalogClick the series name you are looking for.SeriesAction Type StandardCJ5-S CG5-SDouble actingBore size (mm)10,1620,25,32,40,50,63,80,100Operation can be made from the toolbar at the center of the lower portion of the screen.Click here to download the PDF file.Click here to display the contents.Series VariationsSeriesSeal materialCG5-SCJ5-S NBR FKMThis product cannot be used in the food zone. Refer to the Product Specific Precautions (page 1071) for details.Series CJ5-S 16Series CG5-S 100Applicable for use in an environmentwith water splashing such as food processing, etc.For use with grease for food processing machines (Approved by NSF-H1)All stainless steel specifications (External parts)Stainless steel 304 is used for external metal parts.Corrosion resistance is improved even in environments with exposure to water.Relation of Liquid Entry and Sliding Distance 0A m o u n t o f l i q u i d e n t r y (g )Standard cylinderStainless steel cylinderSliding distance (km)Special scraperTwo types of seal materialNBR or FKM can be selected to accommodate the application.(Nitrile rubber) (Fluororubber)Exterior configuration reduces residual liquid• Electropolishing of mounting bracket surfaces makes them smoother to prevent build-up of liquids and foreign matter.• Plugs are provided for unused mounting threads (Series CG5-S) to prevent residue build-up in the threads.Plug1016202532Bore size (mm)40506380100Applicable auto switch Water resistant D-H7BAL Water resistant D-G5BALSpecial scraper (Standard)Prevents water from entering the cylinder.ConditionsWorking fluid (i)Pressure ············· 0.5 MPaLiquid ·················· Water-soluble coolant Piston speed ······· 200 mm/s Operating frequency ··· 60 cpmCan be disassembled(Series CG5-S ø20 to 40)Since seals are replaceable, this extends the life of the cylinder.(Before disassembly, be sure to refer to the section regarding maintenance under“Specific Product Precautions” on page 1072.)1055HYWater ResistantD- -XTechnical dataCJ5CG5∗ for double clevis style.• For details about auto switches with pre-wired connector, refer to pages 1626 and 1627.∗ Solid state auto switches marked with “ ” are produced upon receipt of order. Grease pack for stainless steel cylinders/Part no.: GR-R-010 (10 g)How to OrderSeries CJ5-Sø10, ø16Stainless Steel Cylinder∗ Lead wire length symbols: Nil··········0.5 m (Example) D-M9NA M ··········1 m (Example) D-M9NAM L ··········3 m (Example) D-M9NAL Z ··········5 m (Example) D-M9NAZswitch is required, suffix the symbol “-B” (Band mounting style) to the end of part number.(Example) CDJ5B10SV-45R-Bto auto switch cylinders.∗ If a built-in magnet cylinder without an auto switch is required, refer to the model of built-in magnet cylinder.1056A(mm)SpecificationsStandard StrokeMounting Style and AccessorySymbolDouble acting,Single rod, Rubber bumper∗ For the one with auto switch, refer to the minimum stroke for auto switch mounting. (P. 1069)∗∗ Mounting nut is not included in double clevis style.Calculation: (Example) CJ5L10SR-45• Basic weight ·························· 52 g (ø10)• Additional weight ··················· 4 g/15 stroke • Cylinder stroke ····················· 45 stroke• Mounting bracket weight········ 22 g (Axial foot type) 52 + 4/15 x 45 + 22 = 86 gStainless Steel Cylinder SeriesCJ5-S1057D- -XTechnical dataSeries CJ5-SConstruction (Not able to disassemble.)are the same as the standard type of Series CJ2. 1058DimensionsBasic style (B): C J5B S RVWith head cover port in axial location (R)Axial foot style (L): C J5L Saxial location (R)0Stainless Steel Cylinder SeriesCJ5-S1059D- -XTechnical dataDimensionsRod side flange style (F): C J5F S RVDouble clevis style (D): C J5D S R VSeries CJ5-S1060Single Knuckle JointClevis Pin Knuckle PinDouble Knuckle Joint Mounting Nut Rod End NutT-bracket Rod End Cap∗Retaining rings are included.∗Knuckle pin and retaining ring are packaged together.Flat type/CJ-CFRound type/CJ-CRSeries CJ5-SAccessory Dimensions1061D--XTechnicaldata• For details about auto switches with pre-wired connector, refer to pages 1626 and 1627.Note) When ordering the foot bracket, order 2 pcs. per cylinder.Grease pack for stainless steel cylinders/Part no.: GR-R-010 (10 g)(Example) CDG5BA40SV-100How to OrderSeries CG5-Sø20, ø25, ø32, ø40, ø50, ø63, ø80, ø100Stainless Steel Cylinder1062SpecificationsAccessoryWeightStandard StrokeSymbolDouble acting,Single rod, Rubber bumperMade to Order Specifications(For details, refer to pages 1675 to 1818.)∗ Long stroke applies to the axial foot style and the rod side flange style. If other mounting brackets are used, or the length exceeds the long stroke limit, the stroke should be determined based on the stroke selection table (front matter 34, CG1).(Foot style ø20, 100 stroke)• Additional stroke weight ············· 0.06 kg/50 ST • Air cylinder stroke ······················ 100 ST • Additional air cushion weight ····· 0.02 kg 0.40 + 0.06 x 100/50 + 0.02 = 0.54 kgStainless Steel Cylinder SeriesCG5-S (1063)D- -XTechnicaldataConstructionWith rubber bumperWith air cushionCautionWhen disassembling cylinders with bore sizes of ø20 through ø40, grip the double flat part of either the tube cover or the rod cover with a vise and loosen the other side with a wrench or a monkey wrench, etc., and then remove the cover. When retightening, tighten approximately 2 degrees more than the original position. (Cylinders with ø50 or larger bore sizes are tightened with a large tightening torque and cannot be disassembled.)ø80, ø100ø80, ø100are the same as the standard type of Series CG1.Note 2) For cylinders with an auto switch, the piston is fixed with a magnet.∗ Seal kit includes a grease pack (10 g).Order with the following part number when only the grease pack is needed. Grease pack part number: GR-R-010 (10 g)Series CG5-S1064DimensionsBasic style (B): C G5BN S : With rubber bumperR V Basic style (B): C G5BA S : With air cushionRV Plug bolt ∗ (4 pcs. included)Plug bolt ∗ (4 pcs. included)Stainless Steel Cylinder SeriesCG5-SD- -XTechnical dataDimensionsAxial foot style (L): C G5L S RVN A Note 1) ø20 and ø25 cylinders with an air cushion: M5 x 0.8Note 2) Refer to the basic type (B)/CG5BA S ∗ for the dimensions of air cushion needles.Rod side flange style (F): C G5F S RVN A Note 1) ø20 and ø25 cylinders with an air cushion: M5 x 0.8Note 2) Refer to the basic type (B)/CG5BA S ∗ for the dimensions of air cushion needles.Series CG5-S1066DimensionsHead side flange style (G): C G5G S RVN A Note 1) ø20 and ø25 cylinders with an air cushion: M5 x 0.8Note 2) Refer to the basic type (B)/CG5BA S ∗ for the dimensions of air cushion needles.Integral clevis style (E): C G5E S RVN A ∗ Plug bolts are installed when shipped from factory.∗ Pivot bracket (with clevis pin and snap ring) are optional. (Not included.)Note 1) ø20 and ø25 cylinders with anair cushion: M5 x 0.8Note 2) Refer to the basic type(B)/CG5BA S ∗ for the dimensions of air cushion needles.Stainless Steel Cylinder SeriesCG5-S1067D- -XTechnical dataMaterial: Stainless steel 304Material: Stainless steel 440 (Pin)Stainless steel 304 (Bracket, retaining ring) Material: Stainless steel 440 (Pin)Stainless steel 304 (Retaining ring)Material: Stainless steel 440 (Pin)Material: Stainless steel 440 (Pin)Stainless steel 304 (Retaining ring)Material: Stainless steel 304 Single Knuckle Joint Double Knuckle JointKnuckle Joint Pin Pivot BracketClevis PinRod End NutSeries CG5-SAccessory Dimensions1068Proper Auto Switch Mounting Position (Detection at stroke end) and Its Mounting HeightSeries CJ5-S D-M9 D-H7BAmeant to be guaranteed. (Assuming approximately ±30% dispersion) There may be the case to change substantially depending on an ambient environ-ment.Proper Auto Switch Mounting Position Note) Adjust the auto switch after confirming theoperating condition in the actual setting.Series CG5-S D-G5BA∗ With stainless steel mounting screws.meant to be guaranteed. (Assuming approximately ±30% dispersion) There may be the case to change substantially depending on an ambient environment.Proper Auto Switch Mounting Position operating condition in the actual setting.Note 1) Set part number which includes the auto switch mounting band(BJ2- S) and the holder kit (BJ4-1/Switch bracket: White).Note 2) For D-M9 A(V), avoid the indicator LED for mounting the switch bracket.Series CJ5-S/CG5-SAuto Switch Mounting1069D- -XTechnical dataTechnical Data:Chemical Resistance Table: No influence or almost no influence: Some influence, but operational depending on conditions: Avoid use if possible: Substantial influence, not suitable for use: Not tested Array∗ Unless noted otherwise, the solution concentration is in a saturated state.∗ Chemical resistance is a guide that applies only to the stainless steel cylinder parts, and does not guarantee the performance of air cylinders (auto switches). Be sure to perform a verification test before operating.∗ ) Reference data1070Operating EnvironmentCaution on DesignWarningWarningCautionMountingWarningOperating PrecautionsCautionSelectionWarningCautionand pages 3 to 12 for Actuator and Auto Switch Precautions.1. Note the weight of the stainless steel products.Since the weight of stainless steel cylinders is approximately 1.5 to 3 times heavier than the standard products (with aluminum body), be careful when calculating weight estimates. Also, when mounting the cylinder on equipment where vibration is expected, avoid using single side brackets such as the flange style, and use double side brackets such as the foot style instead.1. A djust the speed control for the environment in which it will be used.Speed adjustment may be changed depending on the environment.2. D ust may accumulate on this product’s mounting screws and brackets in some operating conditions.Measures must be applied depending on the operating conditions when mounting.1. Generally, use nitrile rubber (NBR) seals with liquids that do not contain chlorine and sulfur, and use fluoro rubber (FKM) seals with liquids that contain chlorine and sulfur.However, depending on the type and the brand of liquid (such as cleaning solvent) that splashes on the cylinder, the operating life of seals may be reduced dramatically. In cases where special additives are used, or where liquid caused trouble with the conventional nitrile or fluoro rubber seals in the past, request an investigation or set up a test period for the use of the seals.2.Even the fluoro rubber specification may not be applicable depending on the type of chemicals and the operating temperature. Therefore, be sure to verify the seal's applicability before use .1. Do not rotate the cover.If a cover is rotated when installing a cylinder or screwing a fitting into the port, it is likely to damage the junction part with cover.2. When using pins, apply grease, etc., in order to prevent them from degrading of shape and rusting.1. If cleaning the rotating part, grease may leak out, which shortens product service life. Thus, cleaning must be as infrequent as possible.2. If excess water gets into mounting holes, unwanted bacteria may reproduce. Plug them with plug bolts or external covers to avoid this.1.For details about operating precautions, refer to page 174 for Series CM2 and page 310 for Series CG1.Warning1. Fully consider the compatibility of stainless steel.The corrosion resistance of stainless steel is not effective against all media and corrosive environments. Corrosionproceeds rapidly with strong hydrochloric acid, hydrofluoric acid, and high temperature ammonium gas, etc. Therefore its compatibility to the environment must be considered carefully.2.Do not operate cylinders with auto switches in environments where oil and chemicals are used.Please contact SMC when operating in environments with coolants, cleaning solvents, various oils or chemicals, as it may cause adverse effects (faulty insulation, malfunction due to swelling of the potting resin, and hardening of lead wires, etc) to auto switches even in a short period of time. Even with the fluoro rubber seal specification, the auto switch related parts (switch body, mounting bracket, and built-in magnet) are identical to the standard specifications. Therefore, consult with SMC regarding the cylinder’s compatibility (such as chemical resistance) with an environment (chemicals, etc.) before operating.3. Do not immerse the cylinder in water or chemicals.When the cylinder is operated in a condition with water pressure, the fluid leaks into the cylinder in the early stages. In the worst case, the fluid may back flow inside the piping and damage the solenoid valve.2. When cleaning solvent or chemicals splashes on a cylinder, the service life may be extremely shortened. Please contact SMC for details.3. When cleaning cylinders with steam, do it as quickly as possible, keeping the cylinder’s temperature range in mind.4. When cleaning cylinders with a brush, etc., do not apply excessive force to the weaker parts, such as auto switch lead wire, etc.1. Avoid installing and using a cylinder inside a food zone.<Not installable> Food zone <Installable>Splash zone Non-food zone An environment where food which will besold as merchandize, directly touches the cylinder’s components.An environment where food which will not besold as merchandize, directly touches the cylinder’s components.An environment where there is no contactFood1071D- -XTechnical dataMaintenanceWarningPrecautions for Series CG5-S1.Sealant ∗ is used on the threads of the connecting sections of the cover and the cylinder tube for air-tight construction. When disassembling the cylinder, the old sealant must be completely removed, and new sealant must be applied before re-assembling.∗ Loctite ® 542 (medium strength) or equivalent2. ø50 or larger bore size cylinders cannot be dis-as-sembled.When disassembling cylinders with bore sizes of ø20 through ø40, grip the double flat part of either the head cover or the rod cover with a vise and loosen the other side with a wrench or a monkey wrench, etc., and then remove the cover. When re-tightening, tighten approximately 2 degrees more than the original position. (Cylinders with ø50 or larger bore sizes are tightened with a large tightening torque and cannot be disassembled. Please contact SMC when disassembly is required.)1. If this cylinder is lubricated, it may cause malfunctions.If grease other than designated is used, it may also cause malfunctions.• Order with the following part number when only the grease for maintenance is needed.Grease pack part number for stainless steel cylinders Grease for food processing machines: GR-R-010 (10 g)2.Do not wipe grease attached to the rotating part of the air cylinder.If grease attached to the rotating part is forcibly wiped off, it may cause malfunctions.If the cylinder is operated for a long period of time, the rotating part may become black. In such cases, wipe the grease attached to the rotating part and reapply fresh grease to enable the cylinder to operate for a long period of time.(Wipe the grease with water. Using alcohol or solvents may damage seals.)and pages 3 to 12 for Actuator and Auto Switch Precautions.1072。
艺术家技术集团产品说明书
489-0941, rev 2.2 324605D-01 Printed in HungaryPortable Waveform Acquisition SystemsBefore you get started verify that you have a 32-bit version of Windows XP, the following items, and meet or exceed the minimum requirements listed. • WaveBook/512A or /516A • TR-40U Power Supply• Parallel Port-to-Parallel Port Cable • Software CDDynamic Signal Analysis CD (for eZ-Software), orData Acquisition CD (for WaveView) See Note, pg. 2• License Keys for purchased [eZ]software• Monitor: SVGA, 1024 x 768 screen resolution • Computer that meets or exceeds the following:Intel ™ Pentium 4 or equivalent; Microsoft ® Windows XPEPP (Enhanced Parallel Port) or ECP (Enhanced Capabilities Port) 1 GB memory; 10 GB disk spaceStep 1 - Install Software NOTE : /512A and /516A are not supported by Windows 7 or Vista1. Close all running applications on the host PC.2. Insert the CD into your CD-ROM drive. AnOpening Screen will appear. 3. Click the <ENTER SETUP > button.4. From the hardware selection screen [which follows a licensing agreement], select the WaveBook/512A orWaveBook/516A as applicable; then follow the on-screen instructions.Step 2 - Connect the WaveBook to the ComputerFor PCs that do not have an available parallel port, an interface option may be used, such as a WBK20A [interfaces with a PCMCIA card slot], WBK21 [interfaces with an ISA bus slot], or WBK23 [interfaces with a PCI bus slot]. These are discussed in PDF documents included on the CD. In regard to Ethernet connection, these WaveBook models can beconnected to one of three Expansion Ports on a WaveBook/516E or to one of three Expansion Ports on a WBK25 Ethernet Module. Refer to the CD PDF documentation as needed.1. Using a parallel port cable, connect the WaveBook to a parallel port on the computer.2. With the WaveBook power switch “OFF,” connect the power supply cable from the TR-40U to the WaveBook’sPower-In DIN5 connector (located on the rear panel). 3. Connect the TR-40U plug to a standard AC outlet; and turn the WaveBook power switch to “ON.”Printed in HungaryStep 3 - Configure & Test the Systemwith the Daq Configuration Applet1. Open the Daq Configuration Applet.a. Open the Control Panel by navigating from the Windows’ Desktop:Start Menu ⇒ Settings ⇒ Control Panel b. From the Control Panel, double-click the Daq Configuration icon.2. Add the WaveBook/512A or WaveBook/516A to the list of installed devices.a. Click the <Add Device > button. The “Select Device Type” box will appear.b. Select the WaveBook/512A [or /516A], as applicable, from the list of devices.c. Click the <OK > button. The “Properties” box will appear for the selected device.3. Test the SystemClick the “Test Hardware” tab and run the test. Should you need additional help, please refer to the user’s manual PDF included on the CD.When testing, if the unit does not respond within 30 seconds, perform the following: 1) reboot the system, 2) upon power-up, re-open the Daq Configuration applet, 3)select another configuration setting, 4) reinitiate the test.Step 4 - Connect Data Acquisition Signal LinesPrior to making signal connections review the Specifications chapter of your user’s manual to ensure that your intended signal inputs do not exceed the specified limits. The manual is included in PDF format on your CD.Reference Notes :Adobe Acrobat PDF versions of documents pertaining to the WaveBook/516E and associated accessories and software are included on the Data Acquisition and Dynamic Signal Analysis CDs.Documents are automatically installed onto your PC’s hard-drive as a part of product support at the time of software installation. The default location is the Programs group. It can be accessed via the Windows Desktop Start Menu .Note WaveView users only: If you are using WaveView as your software application you will be using the Data Acquisition CD (not the Dynamic Analysis CD ). If this is the case, and if TEDS (Transducer Electronic Data Sheet ) applies to your system, use: D7DB1F527813 as the Authorization Code , when prompted.:*324605D-01*324605D-01Measurement Computing Corporation10 Commerce Way Norton, MA 02766 USAPhone : (508) 946-5100 Fax : (508) 946-9500e-mail :***************。
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J.Fleischer ÆA.-M.DieckmannAutomation of the powder injection molding processReceived:28June 2005/Accepted:7November 2005/Published online:28April 2006ÓSpringer-Verlag 2006Abstract Powder injection molding (PIM)offers a high potential for fabrication of micro-mechanical parts manufactured in metal or ceramic material providing a large variety of properties.To ensure an economical micro-PIM production in large lot sizes and high quality automation of the process beginning with demolding,handling,debinding and ending with sintering is a necessity.Within the field of automation research focus is to optimize critical processes like sprue separation,demolding and handling as well as the set-up of an autonomous and automated process-chain which are presented in this article.1IntroductionMiniaturization is one of the most important techno-logical trends,which will gain further importance in the future.It offers the decisive advantage of a higher functional integration on smaller room and thus the possibility to develop new product concepts.This opens a wide range of new application fields associated with handy,portable products [1].Required quantities of miniaturized highly integrated components and products vary—from mass production for e.g.the automotive sector or medical applications to middle and small series in e.g.mechanical engineering.To ensure an economic production of micro parts in high series automation of the process has to be devel-oped and integrated to an overall process-chain.One of the production technologies to meet the increasing industrial requirements of an economical production of high quality parts in small to large series is the powder injection molding (PIM)process.It offers the production of three-dimensional micro parts as well as micro-structured parts in a wide variety of metallic and ceramic material.Due to the strength of the wear-resistant materials highly precise metallic or ceramic parts for the transmission of forces and torques can be produced.As a result,the PIM technology enables the economic production of micro-structured parts and systems in various branches of the industry like biotechnology,telecommunication,automotive,etc.with a throughput of more than 1Mio.parts per year.However,in order to utilize this potential and to transfer this technology into the industry,the complete automation of the micro-PIM process chain from the separation of the micro-PIM parts from the sprue through the sintering to the stacking is inevitable [2].2Microproduction technology for micro-mechanical partsThe approach on the automation of the PIM-process is divided into sprue separation and demolding of micro parts,handling and automation of fragile green compact parts produced by micro-PIM and the integration of the debinding and sintering process in the complete process-chain developed at the wbk Institute of Production Science,Universita t Karlsruhe.2.1PIMprocessFor the processing of metal powder or ceramic powder (diameter of powder d 50<4l m),it is first necessary to homogenize and granulate the material with a binder in a mixing machine.This compound,which is capable ofThis work is based upon the Collaborative Research Centre SFB499funded by the German Research Foundation (DFG)J.Fleischer (&)ÆA.-M.Dieckmannwbk Institute of Production Science,Universita t Karlsruhe,Karlsruhe,GermanyE-mail:fleischer@a.de Tel.:+49-721-6084009Fax:+49-721-699153Microsyst Technol (2006)12:702–706DOI 10.1007/s00542-006-0100-8being molded,is then injected into the cavity giving it the form of the desired toothed wheel.After injection the parts (green compact)have to be separated from the sprues,demolded and transferred to a furnace.In the subsequent debinding process the binder is first removed from the molded part (green compact)resulting in the ‘‘brown compact’’which then is sintered.Within these process steps the reproducible and material-specific shrinkage of the part is typically 18–30%[3,4].2.2Mold-internal separation of sprue from parts There are different possibilities of separation:within the mold via three-plate-mold or hot-runner-systems as well as inside the mold via grippers or outside the mold via manufacturing technologies (ablation,milling or grinding).The decision for the three-plate mold was based on experiments and studies with experts.By use of a two-stage opening movement of the mold,sprue and parts are separated from each other and the gripping system can handle the parts from the ejection side of the mold.Due to the challenging demand regarding the required precision of the tooling this technology is well known in the field of macro mold-ing but does seldom find application within micro molding [5].The separation process has been realized using the example of a toothed wheel with an outer diameter of 1,400l m,a thickness of 230l m (dimensions of the green compact,shrinking to 1,200and 200l m during sintering)and a module of 0.1(involutes).The results show that the realized injection area has reached surface qualities meeting the design specifications and show non-destructive feedstock characteristics with a centered gap of 0.04mm 2[6].The principal set-up of the three-part mold with a cavity of a toothed wheel within the millimeter-range is shown in Fig.1(for better illustra-tion only a one-cavity mold is shown).2.3DemoldingWhen the cavities are opened the part has to be de-molded from the mold.This process can either be done with mechanical ejector pins,application of pneumatic pressure within the mold or by the handling system.Due to the shrinkage (about 2%of the nominal value)of the part during the cooling time,the part may stick on mold cores for example.Research work at the wbk is aimed at the evaluation of the demolding forces imposed upon the produced parts.This analysis is being carried out with respect to boundary conditions e.g.necessary surface qualities,tribological characteristics,demolding slants of the mold in order to determine the position and size of ejector pins in the mold as a basis for technical designers and moldmakers.For these objectives to be achieved,cor-relations have to be set up between variable structures,sizes and alternative technical solutions (e.g.pneumati-cally)for demolding parts and structures by means of geometrical sets.These sets include structures like cir-cles,triangles and hollow cylinders to model real parts e.g.toothed wheels (see Fig.2).The dimensions are below 300l m with part lengths from 400to 1,000l m and depths from 400to 1,000l m.Subsequent to this process all parts are measured to detect damages.The upper points in Fig.2show the measured demolding forces necessary for three different parts all of them having the same length.The distinction between the structures is not only their form but also the resulting surface causing cohesive forces inflicted upon it being the reason for higher demolding forces.The lower set of points in Fig.2shows the necessary demolding forces with demolding spray in use.The experiments show small demolding forces below 1N including an extensive reduction of the forces by use of demolding spray and coating on the cavity for better surface qualities [7]but without further analysis of the effects of sprays to debinding and sintering processes.Within the automated process chain,demoldinghasFig.1Mold-internalseparation of parts and sprue (three-part mold),source:wbk,Kugele703been realized by mechanical ejector pins having an inner diameter of 525l m,surrounding the inner core of the toothed wheel (see Fig.1).2.4HandlingAfter demolding the parts from the cavities the handling system has to transfer the parts to the stack unit.There are two critical process steps:•Accurate positioning of the handling system to the cavities within a range of 1–3l m in six degrees of freedom in production area (contamination,temper-ature,etc.)•Gripping of the fragile micro-PIM parts.A molded feedstock has a tensile strength of about 4N/mm 2;this restricts the gripper forces acting on the micro parts to the milliNewton range [8].The pneumatical gripper (see Fig.3),based on the Ven-turi principle,consists of a housing with modular pestles for part variation.The movement of the pestle,essential for gripping the part at the cavity and releasing the part at the sintertray is realized by use of air-bearings with slip-stick-free movement within the millimeter-range.2.5Automated material flowTo ensure a reliable and complete demolding of the part an integrated quality assurance is necessary.Due to the process restrictions e.g.cycle time a 100%visual inspection of the part is done after demolding and handling of the part to the sintertray.Damaged or missing structures of below 1l m can therefore be bined with the quality assurance the parts are magazined on a sinter tray.Due to the sensitivity of green and brown compacts to vibrations,there are high machine requirements for conveyance systems.To meet the requirements a pater-noster and linear modules with a high gear reduction and a vibration absorber were installed in the system.A prototype of the process chain between the injec-tion molding machine and the furnace is shown in Fig.4.Stacking is done by means of a mechanical stage with a repeating accuracy of 50l m—the movement in the third dimension has been realized by the handling system.A linear module transfers the sinter trays to a paternoster for flexible storing.The sintertrays are clustered with the help of a production planning and control system and transferred to the furnace conveyer belt.Subsequent to the debinding and sintering process the sinter trays are extracted by means of a linear module with a hexapod mounted below.Therefore thelinearFig.2Demolding forces at micro-PIM teststructuresFig.3Schematic view of a pneumatical gripper with air-bearings704module transfers the sinter trays and the hexapod with a repeating accuracy below 1l m handling the parts by use of a mechanical gripper developed by the Institute of Machine Tools and Production Technology in Braun-schweig [5].Due to the integrated vision system (see Fig.5)the parts can be localized,centered and handled by the mechanical gripper for stacking on 0.2mm pins with total system accuracy below 2l m in 6degrees of freedom.2.6Debinding and sinteringTo provide an automated production of micro-PIM parts the thermal processes of debinding and sintering have to be integrated.Generally continuous and dis-continuous furnaces are used for producing macro parts.In contrast to discontinuous (batch)furnaces distinc-tively tuned for the use in metal injection molding (MIM),which are mostly used in laboratory environ-ments,the most economic solution for large lot sizes is the usage of a continuous furnace.The furnace (see Fig.6)consists of a catalytical as well as thermal debinding area (max.temperature 600°C),a sintering zone (max 1,450°C),a cooling area as well as a loading and unloading area.The total dimen-sions of the furnace are shown above.The maximum capacity of the furnace (atmosphere:nitrogen and hydrogen at variable mixing ratios)is about 9Mio.parts/year with total cycle times below 9h.3ConclusionThe demand for complex three-dimensional micro-mechanical parts in wear-resistant material indifferentFig.4Schematic view of the process chain for micro-PIM parts between molding machine andfurnaceFig.5Hexapod kinematics for stacking of micro-PIM parts and mechanical gripper,source:wbk,iwf705branches like medical,biological or even telecommuni-cation areas can be supplied by the PIM process [9].To obtain a breakthrough of this technology,an economic and high-quality production of medium to large series has to be set up.This can only be achieved with an automated process and with a special focus on critical sub-processes,e.g.separation of parts and sprue,de-molding and handling.To validate the concepts of an automated micro-PIM production a process chain for micro-PIM parts—here toothed wheels with a diameter of 1,400l m—has been set up.Innovative separation solutions for micro-PIM parts with a three-part mold as well as demolding of microstructures,quality assurance,handling and trans-portation have been integrated in this automated process chain.To counter problems arising from producing smaller parts,dependencies between structure sizes,material and specific technology criteria,e.g.gripping principles or force control systems have to be developed as a basis for the respective sub-processes [10].References1.Weck M,Fischer S (1999)Maschinenentwicklung fu r die Mikrotechnik,wt Werkstattstechnik 89No.11/12,pp 489–4912.van Brussel H et al (2000)Assembly of microsystems.Ann CIRP 49(2):451–4713.Piotter V,Ruprecht R,Haußelt J (1999)Spritzgießen von Mikroteilen aus Metall und Keramik.Werkstattstechnik on-line,No.11/19994.Yoshikawa K,Ohmori H (2001)Outstanding features of powder injection molding for micro parts manufacturing.Ri-ken Rev 34:13–185.Weule H,Fleischer J,Buchholz C,Tritschler H,Elsner J,Knoll M,Hesselbach J,Raatz A,Wrege J,Herrmann H,Klocke F,Weck M,von Bodenhausen J,von Klitzing A (2004)Interna-tional state of the art of micro production technology.Prod Eng XI(1):29–366.Weule H,Stengel G,Buchholz C (2002)Variation of geometry and size for optimized demolding,seperation and handling of molded micro parts within an automated PIM-process.In:Proceedings of 3rd international conference of euspen,26–30May 2002Eindhoven pp 419–4227.Fleischer J,Buchholz C,Weule H (2003)Automation of the powder-injection-molding process for micro-mechanical parts.Ann CIRP 52(1):419–4228.Walcher H (2001)The market for ferrules is booming.Inte Ceramics,2:9.Walcher H,Maetzig M (2001)Spritzguss und Automati-sierungsmo glichkeiten,seminar powder injection mold-ing—Tagung des Su ddeutschen Kunststoff-Zentrum,Wu rzburg10.Fleischer J,Buchholz C,Walcher H,Maetzig M,Kugele H,Cremer I (2004)Klein und doch belastbar -Potenziale des Mikro-Pulverspritzgießens fu r die Massenproduktion.Mi-kroproduktion1:46–48Fig.6Rough draft of the continuous furnace for micro-PIM706。