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产品说明书范文英文版

产品说明书范文英文版

产品说明书范文英文版电子产品说明书——媒体音响英文说明书范例(中英)便携式多媒体音响 Portable Multimedia Acoustics使用说明书User’s Manual专注于完美音质的追求?? Concentrate on perfect soundpursuit?感谢您使用本公司出品的数码产品,为了让您轻松体验产品,我们随机配备了内容详尽的使用说明,您从中可以获取有关产品的介绍,使用方法等方面的知识。

在您开始使用本机之前请先仔细阅读说明书,以便您能正确的使用本机,如有任何印刷错误或翻译失误望广大用户谅解,当涉及内容有所更改时,恕不另行通知。

Thank you for using this digital product of our company. In order to let you experience the product swimmingly, detailed instruction is provided which you can find the product’sintroduction, usage and other information. Before using this product, please read the manual carefully, so that you can correctly use it. In case of any printing or translation error, we apologize for the inconvenience. As for the content change, we are sorry for no further notice.一、产品概述 General Information本机是一款外观小巧,设计精美、携带方便多媒体小音响,适用于家居、户外旅游、办公室等场所,随时随地享受音乐带来的轻松,为您的电脑、数码音乐播放器、手机等视听产品提供超值完美的音质。

美国专业分类

美国专业分类

A————————————————Accounting(会计学)Acoustics(音响设计)Actuarial Sciences(保险统计学)Acupuncture and Oriental Medicine(针灸及东方医学)Addictions/Substance Abuse Counseling(药物滥用咨询)Adult Education(成人教育)Advanced Practice Nursing(护理学高级实践)Advertising and Public Relations(广告及公共关系)Aerospace/Aeronautical Engineering(航天航空工程学)African/American Studies(非洲/美洲研究)African Studies(非洲研究)Agricultural Economics and Agribusiness(农业经济)Agricultural Education(农业教育)Agricultural Engineering(农业工程)Agricultural Sciences, General(农业)Agronomy and Soil Sciences(农艺学及土壤学)Allied Health, General(健康学)Allopathic Medicine(对抗疗法)American Studies(美洲研究)Analytical Chemistry(解析化学)Anatomy(解剖学)Animal Behavior(动物行为学)Animal Sciences(动物学)Anthropology(人类学)Applied Arts and Design, General(应用艺术与设计)Applied Economics(应用经济学)Applied Mathematics(应用数学)Applied Physics(应用物理学)Applied Science and Technology(应用科学与技术)Aquaculture(水产养殖)Archaeology(考古学)Architectural Engineering(建筑工程学)Architectural History(建筑史)Architecture(建筑学)Art/Fine Arts(艺术/美术)Art Education(艺术教育)Art History(艺术史)Artificial Intelligence/Robotics(人工智能/机器人技术)Arts Administration(艺术管理)Art Therapy(艺术心理疗法)Asian-American Studies(亚洲/美洲研究)Asian Languages(亚洲语言)Asian Studies(亚洲研究)Astronomy(天文学)Astrophysics(天体物理学)Athletic Training and Sports Medicine(体育培训及体育医学)Atmospheric Sciences(大气学)Automotive Engineering(汽车工程学)Aviation(航空学)Aviation Management(航空管理学)B————————————————Bacteriology(细菌学)Biochemical Engineering(生化工程)Biochemistry(生物化学)Bioengineering(生物工程)Bioethics(生物伦理学)Bioinformatics(生物信息学)Biological and Biomedical Sciences, General(生物及生物医学)Biomedical Engineering(生物医学工程)Biometrics(生物统计学)Biophysics(生物物理学)Biopsychology(生物心理学)Biosystems Engineering(生物系统工程)Biotechnology(生物技术)Botany and Plant Science(植物学)Building Sciences(建造学)Business Administration and Management, General(工商管理)Business Education(商业教育)I————————————————Illustration(插图)Immunology(免疫学)Industrial /Management Engineering(企业管理)Industrial and Labor Relations(劳资关系)Industrial and Manufacturing Management(工业制造管理)Industrial and Organizational Psychology(企业机构心理学)Industrial Design(企业策划)Industrial Hygiene(企业卫生)Infectious Diseases(传染性疾病)Information Sciences(信息科学)Information Studies(信息研究)Inorganic Chemistry(无机化学)Instructional Technology/Educational Media(教育技术/教育传媒)Insurance(保险)Interdisciplinary Studies(跨学科研究)Interior Design(室内装潢设计)International Affairs(国际关系)International and Comparative Education(国际比较教育)International Business(国际贸易)International Development(国际发展)International Health(国际健康)Internet and Interactive Multimedia(网络及多媒体互动)Investment Management(投资管理)Italian(意大利语)J————————————————Jewish Studies(犹太语研究)Journalism(新闻学)K————————————————Kinesiology and Movement Studies(人体运动学)L————————————————Landscape Architecture(景观建筑)Latin American Studies(拉美研究)Law(法律)Leadership(领导学)Legal and Justice Studies(法定权利和公正研究)Leisure Studies(娱乐业研究)Liberal Studies(自由党研究)Library Sciences(图书馆研究)Limnology(湖沼学)Linguistics(语言学)Logistics(后勤学)M————————————————Management Information Systems(管理信息系统)Management of Technology(技术管理)Management Strategy and Policy(管理决策与政策)Manufacturing Engineering(制造工程)Marine Affairs(海洋事物研究)Marine Biology(海洋生物学)Marine Sciences(海洋科学)Marketing(市场营销)Marketing Research(市场研究)Marriage and Family Therapy(婚姻及家庭咨询)Mass Communication(大众传播)Materials Engineering(材料工程)Materials Science(材料学)Maternal/Child-care Nursing(妇婴护理)Maternal and Child Health(儿童健康)Mathematical and Computational Finance(数学及计算机金融)Mathematical Physics(数学物理)Mathematics(数学)Mathematics Education(数学教育)Mechanical Engineering(机械工程)Mechanics(力学)Media Studies(传媒研究)Medical/Surgical Nursing(医学外科护理)Medical Informatics(医疗信息学)Medical Microbiology(医疗微生物学)Medical Physics(医疗物理学)Medicinal and Pharmaceutical Chemistry(医药化学)Medieval and Renaissance Studies(中世纪文艺复兴研究)Metallurgical Engineering and Metallurgy(冶金工程)Meteorology(气象学)Microbiology(微生物学)Middle School Education(中学教育)Military and Defense Studies(军事及防御研究)Mineral/Mining Engineering(矿石及采矿工程)Mineral Economics(采矿经济)Mineralogy(矿物学)Missions and Missiology(传教及传教学)Molecular Biology(分子生物)Molecular Medicine(分子药学)Molecular Pathology(分子病理学)Multilingual and Multicultural Education(多语言多文化教育)Museum Education (博物馆教育)Museum Studies(博物馆研究)Music(音乐)Music Education(音乐教育)N————————————————Native American Studies(美国本土研究)Natural Resources(自然资源)Naturopathic Medicine(自然疗法)Near and Middle Eastern Languages(中东及附近地区语言)Near and Middle Eastern Studies(中东及附近地区研究)Neurobiology(神经生物学)Neuroscience(神经学)Nonprofit Management(公共事业管理)Nuclear Engineering(核能工程)Nurse Anesthesia(护理麻醉)Nurse Midwifery(护士助产学)Nursing,general(护理)Nursing Administration(护理管理)Nursing Education(护理教育)Nutrition(营养学)O————————————————Occupational Health Nursing(职业健康护理)Occupational Therapy(职业心理治疗)Ocean Engineering(海洋工程)Oceanography(海洋学)Oncology Nursing(肿瘤护理)Operations Research(运筹学)Optical Sciences(眼部科学)Optometry(眼部光学)Oral and Dental Sciences(口腔医学)Organic Chemistry(有机化学)Organizational Behavior(组织行为学)Organizational Management(机构管理学)Osteopathic Medicine(骨科学。

所有声学测试标准 Acoustics-Application

所有声学测试标准 Acoustics-Application

Test Method Designation Short Title______08/P01ASTM C367Strength properties of prefabricated architecturalacoustical tile or lay-in ceiling panels______08/P04ASTM C522Airflow resistance of acoustical materials______08/P09ASTM E756Measuring vibration-damping properties of materials ______08/P55SAE J1637Laboratory measurement of the composite vibrationdamping properties of materials on a supportingsteel bar______08/P61AAMA 1801Acoustical rating of windows, doors, and glazed wallsystems ______08/P02ASTM C384Impedance and absorption of acoustical materials bythe impedance tube method______08/P03ASTM C423Sound absorption and sound absorption coefficientsby the reverberation room method______08/P35ASTM E1050Impedance and absorption of acoustical materialsusing a tube, two microphones, and a digitalfrequency analysis system______08/P44ISO 354Acoustics - Measurement of sound absorption in areverberation room Instruction: Check each test method for which you are requesting accreditation.Note: Accreditation is limited to the frequency range for which the test room has beenqualified.ACOUSTICAL TESTING SERVICESTEST METHOD SELECTION LISTNVLAP TestMethod Code MATERIAL PROPERTIES SOUND ABSORPTION______08/P72AS ISO 354Acoustics - Measurement of sound absorption in areverberation room______08/P98NFPA 1981 (Sec. 3.3.49, 7.10, 7.17, 8.10, and 8.15)Open-Circuit Self-Contained Breathing Apparatus(SCBA) for Emergency Services______08/P31ASTM E336Measurement of airborne sound insulation inbuildings______08/P37ASTM E966Guide for field measurement of airborne soundinsulation of building facades and facade elements ______08/P06ASTM E90Laboratory measurement of airborne soundtransmission loss of building partitions______08/P96BS EN ISO 10140-2Acoustics - Laboratory measurement of soundinsulation of building elements - Measurement ofairborne sound insulation ______08/P08ASTM E596Laboratory measurement of noise reduction of sound-isolating enclosures______08/P33ASTM E1111Measuring the interzone attenuation of ceilingsystems______08/P34ASTM E1414Airborne sound attenuation between rooms sharinga common ceiling plenum______08/P36ASTM E477Measuring acoustical and airflow performance ofduct liner materials and prefabricated silencers______08/P49AMA-1-II-67Ceiling sound transmission test by two-room method FieldLaboratory - Set 1Laboratory - Set 2Device SpecificSOUND TRANSMISSION - AIRBORNE______08/P54SAE J1400Laboratory measurement of the airborne soundbarrier performance of automotive materials andassemblies______08/P58ASTM E1222Laboratory measurement of the insertion loss of pipelagging systems______08/P71AS/NZS 2499Measurements of sound insulation in buildings and ofbuilding elements - Laboratory measurement ofroom-to-room airborne sound insulation of asuspended ceiling with a plenum above it______08/P92ISO 7235Acoustics - Laboratory measurement procedures forducted silencers and air-terminal units - Insertionloss, flow noise and total pressure loss______08/P93ISO 11691Acoustics - Measurement of insertion loss of ductedsilencers without flow - Laboratory survey method______08/P99ANSI S3.1Maximum permissible ambient noise levels foraudiometric test rooms ______08/P32ASTM E1007Field measurement of tapping machine impact soundtransmission through floor-ceiling assemblies andassociated support structures______08/P94ASTM E1124Field measurement of sound power level by the two-surface method______08/P95ASTM E1574Measurement of sound in residential spaces ______08/P07ASTM E492Laboratory measurement of impact soundtransmission through floor-ceiling assemblies usingthe tapping machine______08/P59ASTM E2179Laboratory measurement of the effectiveness offloor coverings in reducing impact soundtransmission through concrete floors SOUND TRANSMISSION - STRUCTURE BORNEFieldLaboratory______08/P76ISO 10848-2Acoustics - Laboratory measurement of the flankingtransmission of airborne and impact sound betweenadjoining rooms - Part 2: Application to lightelements when the junction has a small influence______08/P11ISO 3744Acoustics - Determination of sound power levels andsound energy levels of noise sources using soundpressure - Engineering methods for an essentiallyfree field over a reflecting plane______08/P21ISO 3745Acoustics - Determination of sound power levels andsound energy levels of noise sources using soundpressure - Precision methods for anechoic rooms andhemi-anechoic rooms______08/P46ISO 3741Acoustics - Determination of sound power levels andsound energy levels of noise sources using soundpressure - Precision methods for reverberation testrooms______08/P60ANSI S12.51Determination of sound power levels of noisesources using sound pressure - precision method forreverberation rooms______08/P62ANSI S12.54Determination of sound power levels of noisesources using sound pressure - Engineering methodin an essentially free field over a reflecting plane______08/P63ANSI S1.10Method for calibration of microphones______08/P79ANSI S12.55Determination of sound power levels of noisesources using sound pressure - Precision methods foranechoic and hemi-anechoic rooms ______08/P24ANSI S12.10Measurement and designation of noise emitted bycomputer and business equipmentSOUND POWERGenericMachine Specific______08/P38ANSI S12.11Measurement of noise emitted by small air-movingdevices______08/P39ANSI S12.5Requirements for the performance and calibration ofreference sound sources______08/P40ISO 9296Acoustics - Declared noise emission values ofcomputer and business equipment______08/P41ECMA 74Measurement of airborne noise emitted byinformation technology and telecommunicationequipment______08/P48ISO 7779Acoustics - Measurement of airborne noise emittedby information technology and telecommunicationsequipment______08/P51ISO 6926Acoustics - Requirements for the performance andcalibration of reference sound sources used for thedetermination of sound power levels______08/P52ISO 3822Laboratory tests on noise emission from appliancesand equipment used in water supply installations______08/P53SAE J1477Measurement of interior sound levels of lightvehicles______08/P65ISO 11201Noise emitted by machinery and equipment -Determination of emission sound pressure levels at awork station and at other specified positions in anessentially free field over a reflecting plane withnegligible environmental corrections______08/P67IEC 60704-1Household and similar electrical appliances - Testcode for the determination of airborne acousticalnoise emitted by household and similar electricalappliances - Part 1: General requirements______08/P68IEC 60704-2-3Household and similar electrical appliances - Testcode for the determination of airborne acousticalnoise - Part 2-3: Particular requirements fordishwashers______08/P69ECMA 109Declared noise emission values of informationtechnology and telecommunications equipment______08/P73ISO 10302Acoustics - Measurement of airborne noise emittedand structure-borne vibration induced by small air-moving devices______08/P75IEC 60704-2-4Household and similar electrical appliances - Testcode for the determination of airborne acousticalnoise - Part 2-4: Particular requirements for washingmachines and extractors______08/P77IEC 60704-2-6Household and similar electrical appliances - Testcode for the determination of airborne acousticalnoise - Part 2-6: Particular requirements for tumble-dryers______08/P78ANSI S12.15Portable electric power tools, stationary and fixedelectric power tools, and gardening appliances -Measurement of sound emitted______08/P80IEC 60704-2-14Household and similar electrical appliances - Testcode for the determination of airborne acousticalnoise - Part 2-14: Particular requirements forrefrigerators, frozen-food storage cabinets and foodfreezers______08/P90ISO 3747Acoustics - Determination of sound power levels andsound energy levels of noise sources using soundpressure - Engineering/survey methods for use in situin a reverberant environment______08/P26ANSI S3.19 (ANSI S3.19-1974)Measurement of real-ear protection of hearing protectors and physical attenuation of earmuffs______08/P27ANSI S12.6Methods for measuring the real-ear attenuation ofhearing protectors______08/P66AS/NZS 1270Acoustics - Hearing protectorsHEARING PROTECTORS______08/P81ANSI S12.42Methods for measurement of insertion loss ofhearing protection devices in continuous orimpulsive noise using microphone-in-real-ear oracoustics test fixture procedures______08/P82BS EN 352-1Hearing protectors - Safety requirements and testing -Ear-muffs______08/P83BS EN 352-2Hearing protectors - Safety requirements and testing -Ear-plugs______08/P84BS EN 352-3Hearing protectors - Safety requirements and testing -Ear-muffs attached to an industrial safety helmet______08/P85BS EN 352-4Hearing protectors - Safety requirements and testing -Level-dependent ear-muffs______08/P86BS EN 352-5Hearing protectors - Safety requirements and testing -Active noise reduction ear-muffs______08/P87BS EN 352-6Hearing protectors - Safety requirements and testing -Ear-muffs with electrical audio input______08/P88BS EN 352-7Hearing protectors - Safety requirements and testing -Level-dependent ear-plugs______08/P89BS EN 352-8Hearing protectors - Safety requirements and testing -Entertainment audio ear-muffsSTANDARD PRACTICES______08/P43ASTM E1425Standard practice for determining the acousticalperformance of exterior windows and doors______08/P64ASTM E1816Standard practice for ultrasonic examinations usingelectromagnetic acoustic transducer (EMAT)techniques______08/P70ASTM E795Standard practice for mounting test specimensduring sound absorption tests______08/P91MIL-STD-1474D Department of Defense design criteria standard -Noise limits______08/P97ASTM E2235-04 Determination of decay rates for use in soundinsulation test methodsOTHERPlease list additional test methods for which you seek accreditation.。

常用光学期刊缩写

常用光学期刊缩写

光学与应用光学等领域常用期刊英文缩写Acta Optica SinicaActa Photonica SinicaAIP CONFERENCE PROCEEDINGSAIP CONF PROCAPPLIED OPTICSAPPL. OPTICSAPPLIED PHYSICS LETTERSAPPL PHYS LETTChinese Journal of LasersChinese J. LasersHigh Power Laser and Particle BeamsIEEE AEROSPACE AND ELECTRONIC SYSTEMS MAGAZINEIEEE AERO EL SYS MAGIEEE ANNALS OF THE HISTORY OF COMPUTINGIEEE ANN HIST COMPUTIEEE ANTENNAS AND PROPAGATION MAGAZINEIEEE ANTENNAS PROPAGIEEE CIRCUITS & DEVICESIEEE CIRCUITS DEVICEIEEE CIRCUITS AND DEVICES MAGAZINEIEEE CIRCUIT DEVICIEEE COMMUNICATIONS LETTERSIEEE COMMUN LETTIEEE COMMUNICATIONS MAGAZINEIEEE COMMUN MAGIEEE COMPUTATIONAL SCIENCE & ENGINEERINGIEEE COMPUT SCI ENGIEEE COMPUTER APPLICATIONS IN POWERIEEE COMPUT APPL POWIEEE COMPUTER GRAPHICS AND APPLICATIONSIEEE COMPUT GRAPHIEEE COMPUTER GROUP NEWSIEEE COMPUT GROUP NIEEE CONCURRENCYIEEE CONCURRIEEE CONTROL SYSTEMS MAGAZINEIEEE CONTR SYST MAGIEEE DESIGN & TEST OF COMPUTERSIEEE DES TEST COMPUTIEEE ELECTRICAL INSULATION MAGAZINEIEEE ELECTR INSUL MIEEE ELECTROMAGNETIC COMPATIBILITY SYMPOSIUM RECORD IEEE ELECTROMAN COMPIEEE ELECTRON DEVICE LETTERSIEEE ELECTR DEVICE LIEEE ENGINEERING IN MEDICINE AND BIOLOGY MAGAZINE IEEE ENG MED BIOLIEEE EXPERT-INTELLIGENT SYSTEMS & THEIR APPLICATIONS IEEE EXPERTIEEE INDUSTRY APPLICATIONS MAGAZINEIEEE IND APPL MAGIEEE INSTRUMENTATION & MEASUREMENT MAGAZINEIEEE INSTRU MEAS MAGIEEE INTELLIGENT SYSTEMS & THEIR APPLICATIONSIEEE INTELL SYST APPIEEE INTERNET COMPUTINGIEEE INTERNET COMPUTIEEE JOURNAL OF OCEANIC ENGINEERINGIEEE J OCEANIC ENGIEEE JOURNAL OF QUANTUM ELECTRONICSIEEE J QUANTUM ELECTIEEE JOURNAL OF ROBOTICS AND AUTOMATIONIEEE T ROBOTIC AUTOMIEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS IEEE J SEL TOP QUANTIEEE JOURNAL OF SOLID-STATE CIRCUITSIEEE J SOLID-ST CIRCIEEE JOURNAL ON SELECTED AREAS IN COMMUNICATIONSIEEE J SEL AREA COMMIEEE MICROIEEE MICROIEEE MICROWAVE AND GUIDED WAVE LETTERSIEEE MICROW GUIDED WIEEE MULTIMEDIAIEEE MULTIMEDIAIEEE NETWORKIEEE NETWORKIEEE PARALLEL & DISTRIBUTED TECHNOLOGYIEEE PARALL DISTRIBIEEE PERSONAL COMMUNICATIONSIEEE PERS COMMUNIEEE PHOTONICS TECHNOLOGY LETTERSIEEE PHOTONIC TECH LIEEE ROBOTICS & AUTOMATION MAGAZINEIEEE ROBOT AUTOM MAGIEEE SIGNAL PROCESSING LETTERSIEEE SIGNAL PROC LETIEEE SIGNAL PROCESSING MAGAZINEIEEE SIGNAL PROC MAGIEEE SOFTWAREIEEE SOFTWAREIEEE SPECTRUMIEEE SPECTRUMIEEE TECHNOLOGY AND SOCIETY MAGAZINEIEEE TECHNOL SOC MAGIEEE TRANSACTIONS ON ACOUSTICS SPEECH AND SIGNAL PROCESSING IEEE T ACOUST SPEECHIEEE TRANSACTIONS ON ADVANCED PACKAGINGIEEE TRANS ADV PACKIEEE TRANSACTIONS ON AEROSPACEIEEE T AEROSPIEEE TRANSACTIONS ON AEROSPACE AND ELECTRONIC SYSTEMSIEEE T AERO ELEC SYSIEEE TRANSACTIONS ON AEROSPACE AND NAVAL ELECTRONICSIEEE T AERO NAV ELECIEEE TRANSACTIONS ON AEROSPACE AND NAVIGATIONAL ELECTRONICS IEEE TRANS AEROSP NIEEE TRANSACTIONS ON ANTENNAS AND PROPAGATIONIEEE T ANTENN PROPAGIEEE TRANSACTIONS ON APPLICATIONS AND INDUSTRYIEEE T APPL INDIEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITYIEEE T APPL SUPERCONIEEE TRANSACTIONS ON AUDIOIEEE TRANS AUDIOIEEE TRANSACTIONS ON AUDIO AND ELECTROACOUSTICSIEEE T ACOUST SPEECHIEEE TRANSACTIONS ON AUTOMATIC CONTROLIEEE T AUTOMAT CONTRIEEE TRANSACTIONS ON BIOMEDICAL ENGINEERINGIEEE T BIO-MED ENGIEEE TRANSACTIONS ON BROADCAST AND TELEVISION RECEIVERS IEEE T BROADC TELEVIEEE TRANSACTIONS ON BROADCASTINGIEEE T BROADCASTIEEE TRANSACTIONS ON CIRCUIT THEORYIEEE T CIRCUITS SYSTIEEE TRANSACTIONS ON CIRCUITS AND SYSTEMSIEEE T CIRCUITS SYSTIEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS FOR VIDEO TECHNOLOGYIEEE T CIRC SYST VIDIEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-FUNDAMENTAL THEORY AND APPLICATIONSIEEE T CIRCUITS-IIEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-ANALOG AND DIGITAL SIGNAL PROCESSINGIEEE T CIRCUITS-IIIEEE TRANSACTIONS ON COMMUNICATION AND ELECTRONICSIEEE T COMMUN ELECTRIEEE TRANSACTIONS ON COMMUNICATION TECHNOLOGYIEEE T COMMUN TECHNIEEE TRANSACTIONS ON COMMUNICATIONSIEEE T COMMUNIEEE TRANSACTIONS ON COMMUNICATIONS SYSTEMSIEEE T COMMUN SYSTIEEE TRANSACTIONS ON COMPONENT PARTSIEEE T COMPON PARTSIEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIESIEEE T COMPON PACK TIEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGYIEEE T COMPON HYBRIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART AIEEE T COMPON PACK AIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGINGIEEE T COMPON PACK BIEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMSIEEE T COMPUT AID DIEEE TRANSACTIONS ON COMPUTERSIEEE T COMPUTIEEE TRANSACTIONS ON CONSUMER ELECTRONICSIEEE T CONSUM ELECTRIEEE TRANSACTIONS ON CONTROL SYSTEMS TECHNOLOGYIEEE T CONTR SYST TIEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATIONIEEE T DIELECT EL INIEEE TRANSACTIONS ON EDUCATIONIEEE T EDUCIEEE TRANSACTIONS ON ELECTRICAL INSULATIONIEEE T ELECTR INSULIEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITYIEEE T ELECTROMAGN CIEEE TRANSACTIONS ON ELECTRON DEVICESIEEE T ELECTRON DEVIEEE TRANSACTIONS ON ELECTRONIC COMPUTERSIEEE TRANS ELECTRONIEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURINGIEEE T ELECTRON PA MIEEE TRANSACTIONS ON ENERGY CONVERSIONIEEE T ENERGY CONVERIEEE TRANSACTIONS ON ENGINEERING MANAGEMENTIEEE T ENG MANAGEIEEE TRANSACTIONS ON ENGINEERING WRITING AND SPEECHIEEE T PROF COMMUNIEEE TRANSACTIONS ON EVOLUTIONARY COMPUTATIONIEEE T EVOLUT COMPUTIEEE TRANSACTIONS ON FUZZY SYSTEMSIEEE T FUZZY SYSTIEEE TRANSACTIONS ON GEOSCIENCE AND REMOTE SENSINGIEEE T GEOSCI REMOTEIEEE TRANSACTIONS ON GEOSCIENCE ELECTRONICSIEEE T GEOSCI ELECTIEEE TRANSACTIONS ON HUMAN FACTORS IN ELECTRONICSIEEE TRANS HUM FACTIEEE TRANSACTIONS ON HUMAN FACTORS IN ENGINEERINGIEEE T HUM FACT ENGIEEE TRANSACTIONS ON IMAGE PROCESSINGIEEE T IMAGE PROCESSIEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICSIEEE T IND ELECTRONIEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS AND CONTROL INSTRUMENTATIONIEEE T IND EL CON INIEEE TRANSACTIONS ON INDUSTRY AND GENERAL APPLICATIONSIEEE TRANS IND GEN AIEEE TRANSACTIONS ON INDUSTRY APPLICATIONSIEEE T IND APPLIEEE TRANSACTIONS ON INFORMATION TECHNOLOGY IN BIOMEDICINEIEEE TRANSACTIONS ON INFORMATION THEORYIEEE T INFORM THEORYIEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENTIEEE T INSTRUM MEASIEEE TRANSACTIONS ON KNOWLEDGE AND DATA ENGINEERINGIEEE T KNOWL DATA ENIEEE TRANSACTIONS ON MAGNETICSIEEE T MAGNIEEE TRANSACTIONS ON MAN-MACHINE SYSTEMSIEEE T MAN MACHINEIEEE TRANSACTIONS ON MANUFACTURING TECHNOLOGYIEEE T MANUF TECHIEEE TRANSACTIONS ON MEDICAL IMAGINGIEEE T MED IMAGINGIEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUESIEEE T MICROW THEORYIEEE TRANSACTIONS ON MILITARY ELECTRONICSIEEE T MIL ELECTRONIEEE TRANSACTIONS ON NEURAL NETWORKSIEEE T NEURAL NETWORIEEE TRANSACTIONS ON NUCLEAR SCIENCEIEEE T NUCL SCIIEEE TRANSACTIONS ON PARALLEL AND DISTRIBUTED SYSTEMSIEEE T PARALL DISTRIEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGINGIEEE T PARTS HYB PACIEEE TRANSACTIONS ON PARTS MATERIALS AND PACKAGINGIEEE TR PARTS MATERIEEE TRANSACTIONS ON PATTERN ANALYSIS AND MACHINE INTELLIGENCE IEEE T PATTERN ANALIEEE TRANSACTIONS ON PLASMA SCIENCEIEEE T PLASMA SCIIEEE TRANSACTIONS ON POWER APPARATUS AND SYSTEMSIEEE T POWER AP SYSTIEEE TRANSACTIONS ON POWER DELIVERYIEEE T POWER DELIVERIEEE TRANSACTIONS ON POWER ELECTRONICSIEEE T POWER ELECTRIEEE TRANSACTIONS ON POWER SYSTEMSIEEE T POWER SYSTIEEE TRANSACTIONS ON PRODUCT ENGINEERING AND PRODUCTIONIEEE T PROD ENG PRODIEEE TRANSACTIONS ON PROFESSIONAL COMMUNICATIONIEEE TRANSACTIONS ON REHABILITATION ENGINEERINGIEEE T REHABIL ENGIEEE TRANSACTIONS ON RELIABILITYIEEE T RELIABIEEE TRANSACTIONS ON ROBOTICS AND AUTOMATIONIEEE T ROBOTIC AUTOMIEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURINGIEEE T SEMICONDUCT MIEEE TRANSACTIONS ON SIGNAL PROCESSINGIEEE T SIGNAL PROCESIEEE TRANSACTIONS ON SOFTWARE ENGINEERINGIEEE T SOFTWARE ENGIEEE TRANSACTIONS ON SONICS AND ULTRASONICSIEEE T SON ULTRASONIEEE TRANSACTIONS ON SPACE ELECTRONICS AND TELEMETRYIEEE T SPACE EL TELIEEE TRANSACTIONS ON SPEECH AND AUDIO PROCESSINGIEEE T SPEECH AUDI PIEEE TRANSACTIONS ON SYSTEMS MAN AND CYBERNETICSIEEE T SYST MAN CYBIEEE TRANSACTIONS ON SYSTEMS MAN AND CYBERNETICS PART A-SYSTEMS AND HUMANSIEEE T SYST MAN CY AIEEE TRANSACTIONS ON SYSTEMS MAN AND CYBERNETICS PART B-CYBERNETICSIEEE T SYST MAN CY BIEEE TRANSACTIONS ON SYSTEMS MAN AND CYBERNETICS PART C-APPLICATIONS AND REVIEWSIEEE T SYST MAN CY CIEEE TRANSACTIONS ON SYSTEMS SCIENCE AND CYBERNETICSIEEE T SYST SCI CYBIEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROLIEEE T ULTRASON FERRIEEE TRANSACTIONS ON VEHICULAR COMMUNICATIONSIEEE T VEH COMMUNIEEE TRANSACTIONS ON VEHICULAR TECHNOLOGYIEEE T VEH TECHNOLIEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION VLSI SYSTEMSIEEE T VLSI SYSTIEEE TRANSACTIONS ON VISUALIZATION AND COMPUTER GRAPHICSIEEE T VIS COMPUT GRIEEE VEHICULAR TECHNOLOGY GROUP-ANNUAL CONFERENCEIEEE VEH TECHNOL GRIEEE-ACM TRANSACTIONS ON NETWORKINGIEEE ACM T NETWORKIEEE-ASME TRANSACTIONS ON MECHATRONICSIEEE-ASME T MECHJournal of Optoelectronics . LaserJ. Optoelectronics . LaserJOURNAL OF THE OPTICAL SOCIETY OF AMERICAJ OPT SOC AMJOURNAL OF THE OPTICAL SOCIETY OF AMERICA A-OPTICS IMAGE SCIENCE AND VISION J OPT SOC AM AJOURNAL OF THE OPTICAL SOCIETY OF AMERICA B-OPTICAL PHYSICSJ OPT SOC AM BOPTICAL TECHNOLOGYOPT. TECHNOL.OPTICS LETTERSOPT LETTOPTICAL TECHNICSOPT. TECH.OPTICS AND PRECISION ENGINEERINGOPT. PRECISION ENG.OPTICA ACTAOPT ACTAOPTICA APPLICATAOPT APPLOPTICAL AND QUANTUM ELECTRONICSOPT QUANT ELECTRONOPTICAL ENGINEERINGOPT ENGOPTICAL FIBER TECHNOLOGYOPT FIBER TECHNOLOPTICAL IMAGING OF BRAIN FUNCTION AND METABOLISM 2 ADV EXP MED BIOLOPTICAL INFORMATION SYSTEMSOPT INF SYSTOPTICAL MATERIALSOPT MATEROPTICAL PROPERTIES OF SEMICONDUCTOR QUANTUM DOTS SPRINGER TR MOD PHYSOPTICAL REVIEWOPT REVOPTICAL SPECTRAOPT SPECTRAOPTICS & PHOTONICS NEWSOPT PHOTONICS NEWSOPTICS AND LASER TECHNOLOGYOPT LASER TECHNOLOPTICS AND LASERS IN ENGINEERINGOPT LASER ENGOPTICS AND SPECTROSCOPYOPT SPECTROSC+OPTICS AND SPECTROSCOPY-USSROPT SPECTROSC-USSROPTICS COMMUNICATIONSOPT COMMUNOPTICS EXPRESSOPT EXPRESSOPTICS LETTERSOPT LETTOPTIKOPTIKOPTIKA I SPEKTROSKOPIYAOPT SPEKTROSK+PATTERN ANALYSIS AND APPLICATIONS PATTERN ANAL APPLPATTERN FORMATION IN GRANULAR MATERIALS SPRINGER TR MOD PHYSPATTERN RECOGNITIONPATTERN RECOGNPATTERN RECOGNITION LETTERSPATTERN RECOGN LETTPROGRESS IN OPTICSPROG OPTICSPROGRESS IN OPTICS, VOL 33PROG OPTICSPROGRESS IN OPTICS, VOL 35PROG OPTICSPROGRESS IN OPTICS, VOL 38PROG OPTICSPROGRESS IN OPTICS, VOL XLPROG OPTICSPROGRESS IN OPTICS, VOL XXXIIPROG OPTICSPROGRESS IN OPTICS, VOL XXXIXPROG OPTICSPROGRESS IN OPTICS, VOL XXXVIPROG OPTICSPROGRESS IN OPTICS, VOL. 37PROG OPTICSSpacecraft Recovery & Remote SensingSOLAR ENERGY MATERIALSSOL ENERG MATERSOLAR ENERGY MATERIALS AND SOLAR CELLS SOL ENERG MAT SOL CVISION RESEARCHVISION RESVISION TECNOLOGICAVIS TECNOL。

岩石破裂过程声发射动态显示虚拟现实实验教学系统

岩石破裂过程声发射动态显示虚拟现实实验教学系统

文章编号:1007-757X(2020)07-0004-04岩石破裂过程声发射动态显示虚拟现实实验教学系统张春明,杨天鸿(东北大学资源与土木工程学院,辽宁沈阳110006)摘要:利用虚拟现实技术将单轴压缩实验采集的应力应变实验数据和声发射系统采集的声发射信息,与岩石试件的三维模型和岩石破裂面的宏观信息全部集成到同一虚拟场景中,不但可以为学生提供观察各种实验数据的一种可视化手段,而且可以对岩石破裂过程中的声发射事件进行形象直观的动态模拟显示。

这将有助于加深学生对岩石破裂实验的理解,对岩石力学课程的教与学具有非常重要的意义。

关键词:岩石力学;声发射;岩石破裂;动态模拟;虚拟现实中图分类号:TP311文献标志码:AVR Experimental Teaching System for Dynamic Demonstration ofAcoustic Emission in Rock Failure ProcessZHANG Chunming,YANG Tianhong(School of Resources and Civil Engineering,Northeastern University,Shenyang,Liaoning110006,China) Abstract:By way of the virtual reality technology,the stress and strain experimental data collected from the uni-axial compres­sion experiment and the acoustic emission information collected by the acoustic emission system are integrated into a virtual scene together with the three-dimensional model of rock specimen and affiliated surface information.It provides students with a visual means to observe various experimental data and implement a dynamic simulation of acoustic emission events during rock failure.It can help students deepen their understanding of rock failure experiments and is of great significance to the teaching and learning of rock mechanics.Key words:rock mechanics&acoustic emission;rock failure;dynamic simulation;virtual reality0引言本文依次介绍了岩石破裂实验的物理实验过程和数值模拟过程。

产品说明书范文英文版

产品说明书范文英文版

产品说明书范文英文版电子产品说明书——媒体音响英文说明书范例(中英)便携式多媒体音响 Portable Multimedia Acoustics使用说明书User’s Manual专注于完美音质的追求?? Concentrate on perfect soundpursuit?感谢您使用本公司出品的数码产品,为了让您轻松体验产品,我们随机配备了内容详尽的使用说明,您从中可以获取有关产品的介绍,使用方法等方面的知识。

在您开始使用本机之前请先仔细阅读说明书,以便您能正确的使用本机,如有任何印刷错误或翻译失误望广大用户谅解,当涉及内容有所更改时,恕不另行通知。

Thank you for using this digital product of our company. In order to let you experience the product swimmingly, detailed instruction is provided which you can find the product’sintroduction, usage and other information. Before using this product, please read the manual carefully, so that you can correctly use it. In case of any printing or translation error, we apologize for the inconvenience. As for the content change, we are sorry for no further notice.一、产品概述 General Information本机是一款外观小巧,设计精美、携带方便多媒体小音响,适用于家居、户外旅游、办公室等场所,随时随地享受音乐带来的轻松,为您的电脑、数码音乐播放器、手机等视听产品提供超值完美的音质。

美国最容易移民的STEM专业

美国最容易移民的STEM专业

美国最容易移民的STEM专业伴随着中国经济和互联网的发展,‘留学’这件事情似乎也越来越揭开了她神秘的面纱,它变得不再那么遥不可及。

越来越多的‘90后’对自己留学之路的规划也更加理性。

他们不再是一味追求所谓的热门专业,反而开始寻找自己真正喜欢的,或者跟自己的人生规划相结合的留学专业。

这也是属于‘90后’自己的特征,他们有主见、有想法,也越来越知道自己需要什么。

在他们眼里,留学不仅仅是留学,更是移民国外的理想途径。

众所周知,美国是个留学大国,拥有着全球最优秀的教育资源,每年吸纳成千上万的海外留学生。

然而,在美国的移民签证政策越来越收紧的状态下,留学生毕业后继续留在美国就变的越来越困难。

这篇文章,来给大家分析下当下最火热的STEM专业,以及怎么好好的利用自己的专业,从而拥有更多的机会留在美国工作,甚至移民。

2013年,奥巴马总统提出新的移民政策中一直提到STEM这个词,那STEM到底是什么呢?其实,STEM代表的是四种不同专业的大方向,共包含422个具体的专业(具体专业看附录一)。

本文就是要解开STEM的神秘面纱。

S代表Science科学,T代表Technology科技,E代表Engineering工程,M代表Mathematic 数学。

如果你的专业属于这一类里面的,你将要获得比别人多17个月的OPT(全称Optional Practical Training,专业实习)时间。

OPT计划是美国针对国际留学生颁布的一项政策。

根据OPT计划,国际学生从美国大学毕业后,可继续以学生的身份在美国工作实习12个月,但是美国移民海关总署(ICE)规定,科学、技术、工程和数学(即STEM)专业领域内的毕业生OPT时间可延长至29个月。

STEM,是美国乃至世界蓬勃崛起的前景学科,相关领域的工作也被认为是未来薪资最高、最有前途的职业。

因此,STEM专业的留学生也享受到比其他专业学生多出150%(一年半)的毕业实习时间。

jstd035声学扫描

jstd035声学扫描

JOINT INDUSTRY STANDARDAcoustic Microscopy for Non-HermeticEncapsulatedElectronicComponents IPC/JEDEC J-STD-035APRIL1999Supersedes IPC-SM-786 Supersedes IPC-TM-650,2.6.22Notice EIA/JEDEC and IPC Standards and Publications are designed to serve thepublic interest through eliminating misunderstandings between manufacturersand purchasers,facilitating interchangeability and improvement of products,and assisting the purchaser in selecting and obtaining with minimum delaythe proper product for his particular need.Existence of such Standards andPublications shall not in any respect preclude any member or nonmember ofEIA/JEDEC or IPC from manufacturing or selling products not conformingto such Standards and Publications,nor shall the existence of such Standardsand Publications preclude their voluntary use by those other than EIA/JEDECand IPC members,whether the standard is to be used either domestically orinternationally.Recommended Standards and Publications are adopted by EIA/JEDEC andIPC without regard to whether their adoption may involve patents on articles,materials,or processes.By such action,EIA/JEDEC and IPC do not assumeany liability to any patent owner,nor do they assume any obligation whateverto parties adopting the Recommended Standard or ers are alsowholly responsible for protecting themselves against all claims of liabilities forpatent infringement.The material in this joint standard was developed by the EIA/JEDEC JC-14.1Committee on Reliability Test Methods for Packaged Devices and the IPCPlastic Chip Carrier Cracking Task Group(B-10a)The J-STD-035supersedes IPC-TM-650,Test Method2.6.22.For Technical Information Contact:Electronic Industries Alliance/ JEDEC(Joint Electron Device Engineering Council)2500Wilson Boulevard Arlington,V A22201Phone(703)907-7560Fax(703)907-7501IPC2215Sanders Road Northbrook,IL60062-6135 Phone(847)509-9700Fax(847)509-9798Please use the Standard Improvement Form shown at the end of thisdocument.©Copyright1999.The Electronic Industries Alliance,Arlington,Virginia,and IPC,Northbrook,Illinois.All rights reserved under both international and Pan-American copyright conventions.Any copying,scanning or other reproduction of these materials without the prior written consent of the copyright holder is strictly prohibited and constitutes infringement under the Copyright Law of the United States.IPC/JEDEC J-STD-035Acoustic Microscopyfor Non-Hermetic EncapsulatedElectronicComponentsA joint standard developed by the EIA/JEDEC JC-14.1Committee on Reliability Test Methods for Packaged Devices and the B-10a Plastic Chip Carrier Cracking Task Group of IPCUsers of this standard are encouraged to participate in the development of future revisions.Contact:EIA/JEDEC Engineering Department 2500Wilson Boulevard Arlington,V A22201 Phone(703)907-7500 Fax(703)907-7501IPC2215Sanders Road Northbrook,IL60062-6135 Phone(847)509-9700Fax(847)509-9798ASSOCIATION CONNECTINGELECTRONICS INDUSTRIESAcknowledgmentMembers of the Joint IPC-EIA/JEDEC Moisture Classification Task Group have worked to develop this document.We would like to thank them for their dedication to this effort.Any Standard involving a complex technology draws material from a vast number of sources.While the principal members of the Joint Moisture Classification Working Group are shown below,it is not possible to include all of those who assisted in the evolution of this Standard.To each of them,the mem-bers of the EIA/JEDEC and IPC extend their gratitude.IPC Packaged Electronic Components Committee ChairmanMartin FreedmanAMP,Inc.IPC Plastic Chip Carrier Cracking Task Group,B-10a ChairmanSteven MartellSonoscan,Inc.EIA/JEDEC JC14.1CommitteeChairmanJack McCullenIntel Corp.EIA/JEDEC JC14ChairmanNick LycoudesMotorolaJoint Working Group MembersCharlie Baker,TIChristopher Brigham,Hi/FnRalph Carbone,Hewlett Packard Co. Don Denton,TIMatt Dotty,AmkorMichele J.DiFranza,The Mitre Corp. Leo Feinstein,Allegro Microsystems Inc.Barry Fernelius,Hewlett Packard Co. Chris Fortunko,National Institute of StandardsRobert J.Gregory,CAE Electronics, Inc.Curtis Grosskopf,IBM Corp.Bill Guthrie,IBM Corp.Phil Johnson,Philips Semiconductors Nick Lycoudes,MotorolaSteven R.Martell,Sonoscan Inc. Jack McCullen,Intel Corp.Tom Moore,TIDavid Nicol,Lucent Technologies Inc.Pramod Patel,Advanced Micro Devices Inc.Ramon R.Reglos,XilinxCorazon Reglos,AdaptecGerald Servais,Delphi Delco Electronics SystemsRichard Shook,Lucent Technologies Inc.E.Lon Smith,Lucent Technologies Inc.Randy Walberg,NationalSemiconductor Corp.Charlie Wu,AdaptecEdward Masami Aoki,HewlettPackard LaboratoriesFonda B.Wu,Raytheon Systems Co.Richard W.Boerdner,EJE ResearchVictor J.Brzozowski,NorthropGrumman ES&SDMacushla Chen,Wus Printed CircuitCo.Ltd.Jeffrey C.Colish,Northrop GrummanCorp.Samuel J.Croce,Litton AeroProducts DivisionDerek D-Andrade,Surface MountTechnology CentreRao B.Dayaneni,Hewlett PackardLaboratoriesRodney Dehne,OEM WorldwideJames F.Maguire,Boeing Defense&Space GroupKim Finch,Boeing Defense&SpaceGroupAlelie Funcell,Xilinx Inc.Constantino J.Gonzalez,ACMEMunir Haq,Advanced Micro DevicesInc.Larry A.Hargreaves,DC.ScientificInc.John T.Hoback,Amoco ChemicalCo.Terence Kern,Axiom Electronics Inc.Connie M.Korth,K-Byte/HibbingManufacturingGabriele Marcantonio,NORTELCharles Martin,Hewlett PackardLaboratoriesRichard W.Max,Alcatel NetworkSystems Inc.Patrick McCluskey,University ofMarylandJames H.Moffitt,Moffitt ConsultingServicesRobert Mulligan,Motorola Inc.James E.Mumby,CibaJohn Northrup,Lockheed MartinCorp.Dominique K.Numakura,LitchfieldPrecision ComponentsNitin B.Parekh,Unisys Corp.Bella Poborets,Lucent TechnologiesInc.D.Elaine Pope,Intel Corp.Ray Prasad,Ray Prasad ConsultancyGroupAlbert Puah,Adaptec Inc.William Sepp,Technic Inc.Ralph W.Taylor,Lockheed MartinCorp.Ed R.Tidwell,DSC CommunicationsCorp.Nick Virmani,Naval Research LabKen Warren,Corlund ElectronicsCorp.Yulia B.Zaks,Lucent TechnologiesInc.IPC/JEDEC J-STD-035April1999 iiTable of Contents1SCOPE (1)2DEFINITIONS (1)2.1A-mode (1)2.2B-mode (1)2.3Back-Side Substrate View Area (1)2.4C-mode (1)2.5Through Transmission Mode (2)2.6Die Attach View Area (2)2.7Die Surface View Area (2)2.8Focal Length(FL) (2)2.9Focus Plane (2)2.10Leadframe(L/F)View Area (2)2.11Reflective Acoustic Microscope (2)2.12Through Transmission Acoustic Microscope (2)2.13Time-of-Flight(TOF) (3)2.14Top-Side Die Attach Substrate View Area (3)3APPARATUS (3)3.1Reflective Acoustic Microscope System (3)3.2Through Transmission AcousticMicroscope System (4)4PROCEDURE (4)4.1Equipment Setup (4)4.2Perform Acoustic Scans..........................................4Appendix A Acoustic Microscopy Defect CheckSheet (6)Appendix B Potential Image Pitfalls (9)Appendix C Some Limitations of AcousticMicroscopy (10)Appendix D Reference Procedure for PresentingApplicable Scanned Data (11)FiguresFigure1Example of A-mode Display (1)Figure2Example of B-mode Display (1)Figure3Example of C-mode Display (2)Figure4Example of Through Transmission Display (2)Figure5Diagram of a Reflective Acoustic MicroscopeSystem (3)Figure6Diagram of a Through Transmission AcousticMicroscope System (3)April1999IPC/JEDEC J-STD-035iiiIPC/JEDEC J-STD-035April1999This Page Intentionally Left BlankivApril1999IPC/JEDEC J-STD-035 Acoustic Microscopy for Non-Hermetic EncapsulatedElectronic Components1SCOPEThis test method defines the procedures for performing acoustic microscopy on non-hermetic encapsulated electronic com-ponents.This method provides users with an acoustic microscopy processflow for detecting defects non-destructively in plastic packages while achieving reproducibility.2DEFINITIONS2.1A-mode Acoustic data collected at the smallest X-Y-Z region defined by the limitations of the given acoustic micro-scope.An A-mode display contains amplitude and phase/polarity information as a function of time offlight at a single point in the X-Y plane.See Figure1-Example of A-mode Display.IPC-035-1 Figure1Example of A-mode Display2.2B-mode Acoustic data collected along an X-Z or Y-Z plane versus depth using a reflective acoustic microscope.A B-mode scan contains amplitude and phase/polarity information as a function of time offlight at each point along the scan line.A B-mode scan furnishes a two-dimensional(cross-sectional)description along a scan line(X or Y).See Figure2-Example of B-mode Display.IPC-035-2 Figure2Example of B-mode Display(bottom half of picture on left)2.3Back-Side Substrate View Area(Refer to Appendix A,Type IV)The interface between the encapsulant and the back of the substrate within the outer edges of the substrate surface.2.4C-mode Acoustic data collected in an X-Y plane at depth(Z)using a reflective acoustic microscope.A C-mode scan contains amplitude and phase/polarity information at each point in the scan plane.A C-mode scan furnishes a two-dimensional(area)image of echoes arising from reflections at a particular depth(Z).See Figure3-Example of C-mode Display.1IPC/JEDEC J-STD-035April1999IPC-035-3 Figure3Example of C-mode Display2.5Through Transmission Mode Acoustic data collected in an X-Y plane throughout the depth(Z)using a through trans-mission acoustic microscope.A Through Transmission mode scan contains only amplitude information at each point in the scan plane.A Through Transmission scan furnishes a two-dimensional(area)image of transmitted ultrasound through the complete thickness/depth(Z)of the sample/component.See Figure4-Example of Through Transmission Display.IPC-035-4 Figure4Example of Through Transmission Display2.6Die Attach View Area(Refer to Appendix A,Type II)The interface between the die and the die attach adhesive and/or the die attach adhesive and the die attach substrate.2.7Die Surface View Area(Refer to Appendix A,Type I)The interface between the encapsulant and the active side of the die.2.8Focal Length(FL)The distance in water at which a transducer’s spot size is at a minimum.2.9Focus Plane The X-Y plane at a depth(Z),which the amplitude of the acoustic signal is maximized.2.10Leadframe(L/F)View Area(Refer to Appendix A,Type V)The imaged area which extends from the outer L/F edges of the package to the L/F‘‘tips’’(wedge bond/stitch bond region of the innermost portion of the L/F.)2.11Reflective Acoustic Microscope An acoustic microscope that uses one transducer as both the pulser and receiver. (This is also known as a pulse/echo system.)See Figure5-Diagram of a Reflective Acoustic Microscope System.2.12Through Transmission Acoustic Microscope An acoustic microscope that transmits ultrasound completely through the sample from a sending transducer to a receiver on the opposite side.See Figure6-Diagram of a Through Transmis-sion Acoustic Microscope System.2April1999IPC/JEDEC J-STD-0353IPC/JEDEC J-STD-035April1999 3.1.6A broad band acoustic transducer with a center frequency in the range of10to200MHz for subsurface imaging.3.2Through Transmission Acoustic Microscope System(see Figure6)comprised of:3.2.1Items3.1.1to3.1.6above3.2.2Ultrasonic pulser(can be a pulser/receiver as in3.1.1)3.2.3Separate receiving transducer or ultrasonic detection system3.3Reference packages or standards,including packages with delamination and packages without delamination,for use during equipment setup.3.4Sample holder for pre-positioning samples.The holder should keep the samples from moving during the scan and maintain planarity.4PROCEDUREThis procedure is generic to all acoustic microscopes.For operational details related to this procedure that apply to a spe-cific model of acoustic microscope,consult the manufacturer’s operational manual.4.1Equipment Setup4.1.1Select the transducer with the highest useable ultrasonic frequency,subject to the limitations imposed by the media thickness and acoustic characteristics,package configuration,and transducer availability,to analyze the interfaces of inter-est.The transducer selected should have a low enough frequency to provide a clear signal from the interface of interest.The transducer should have a high enough frequency to delineate the interface of interest.Note:Through transmission mode may require a lower frequency and/or longer focal length than reflective mode.Through transmission is effective for the initial inspection of components to determine if defects are present.4.1.2Verify setup with the reference packages or standards(see3.3above)and settings that are appropriate for the trans-ducer chosen in4.1.1to ensure that the critical parameters at the interface of interest correlate to the reference standard uti-lized.4.1.3Place units in the sample holder in the coupling medium such that the upper surface of each unit is parallel with the scanning plane of the acoustic transducer.Sweep air bubbles away from the unit surface and from the bottom of the trans-ducer head.4.1.4At afixed distance(Z),align the transducer and/or stage for the maximum reflected amplitude from the top surface of the sample.The transducer must be perpendicular to the sample surface.4.1.5Focus by maximizing the amplitude,in the A-mode display,of the reflection from the interface designated for imag-ing.This is done by adjusting the Z-axis distance between the transducer and the sample.4.2Perform Acoustic Scans4.2.1Inspect the acoustic image(s)for any anomalies,verify that the anomaly is a package defect or an artifact of the imaging process,and record the results.(See Appendix A for an example of a check sheet that may be used.)To determine if an anomaly is a package defect or an artifact of the imaging process it is recommended to analyze the A-mode display at the location of the anomaly.4.2.2Consider potential pitfalls in image interpretation listed in,but not limited to,Appendix B and some of the limita-tions of acoustic microscopy listed in,but not limited to,Appendix C.If necessary,make adjustments to the equipment setup to optimize the results and rescan.4April1999IPC/JEDEC J-STD-035 4.2.3Evaluate the acoustic images using the failure criteria specified in other appropriate documents,such as J-STD-020.4.2.4Record the images and thefinal instrument setup parameters for documentation purposes.An example checklist is shown in Appendix D.5IPC/JEDEC J-STD-035April19996April1999IPC/JEDEC J-STD-035Appendix AAcoustic Microscopy Defect Check Sheet(continued)CIRCUIT SIDE SCANImage File Name/PathDelamination(Type I)Die Circuit Surface/Encapsulant Number Affected:Average%Location:Corner Edge Center (Type II)Die/Die Attach Number Affected:Average%Location:Corner Edge Center (Type III)Encapsulant/Substrate Number Affected:Average%Location:Corner Edge Center (Type V)Interconnect tip Number Affected:Average%Interconnect Number Affected:Max.%Length(Type VI)Intra-Laminate Number Affected:Average%Location:Corner Edge Center Comments:CracksAre cracks present:Yes NoIf yes:Do any cracks intersect:bond wire ball bond wedge bond tab bump tab leadDoes crack extend from leadfinger to any other internal feature:Yes NoDoes crack extend more than two-thirds the distance from any internal feature to the external surfaceof the package:Yes NoAdditional verification required:Yes NoComments:Mold Compound VoidsAre voids present:Yes NoIf yes:Approx.size Location(if multiple voids,use comment section)Do any voids intersect:bond wire ball bond wedge bond tab bump tab lead Additional verification required:Yes NoComments:7IPC/JEDEC J-STD-035April1999Appendix AAcoustic Microscopy Defect Check Sheet(continued)NON-CIRCUIT SIDE SCANImage File Name/PathDelamination(Type IV)Encapsulant/Substrate Number Affected:Average%Location:Corner Edge Center (Type II)Substrate/Die Attach Number Affected:Average%Location:Corner Edge Center (Type V)Interconnect Number Affected:Max.%LengthLocation:Corner Edge Center (Type VI)Intra-Laminate Number Affected:Average%Location:Corner Edge Center (Type VII)Heat Spreader Number Affected:Average%Location:Corner Edge Center Additional verification required:Yes NoComments:CracksAre cracks present:Yes NoIf yes:Does crack extend more than two-thirds the distance from any internal feature to the external surfaceof the package:Yes NoAdditional verification required:Yes NoComments:Mold Compound VoidsAre voids present:Yes NoIf yes:Approx.size Location(if multiple voids,use comment section)Additional verification required:Yes NoComments:8Appendix BPotential Image PitfallsOBSERV ATIONS CAUSES/COMMENTSUnexplained loss of front surface signal Gain setting too lowSymbolization on package surfaceEjector pin knockoutsPin1and other mold marksDust,air bubbles,fingerprints,residueScratches,scribe marks,pencil marksCambered package edgeUnexplained loss of subsurface signal Gain setting too lowTransducer frequency too highAcoustically absorbent(rubbery)fillerLarge mold compound voidsPorosity/high concentration of small voidsAngled cracks in package‘‘Dark line boundary’’(phase cancellation)Burned molding compound(ESD/EOS damage)False or spotty indication of delamination Low acoustic impedance coating(polyimide,gel)Focus errorIncorrect delamination gate setupMultilayer interference effectsFalse indication of adhesion Gain set too high(saturation)Incorrect delamination gate setupFocus errorOverlap of front surface and subsurface echoes(transducerfrequency too low)Fluidfilling delamination areasApparent voiding around die edge Reflection from wire loopsIncorrect setting of void gateGraded intensity Die tilt or lead frame deformation Sample tiltApril1999IPC/JEDEC J-STD-0359Appendix CSome Limitations of Acoustic MicroscopyAcoustic microscopy is an analytical technique that provides a non-destructive method for examining plastic encapsulated components for the existence of delaminations,cracks,and voids.This technique has limitations that include the following: LIMITATION REASONAcoustic microscopy has difficulty infinding small defects if the package is too thick.The ultrasonic signal becomes more attenuated as a function of two factors:the depth into the package and the transducer fre-quency.The greater the depth,the greater the attenuation.Simi-larly,the higher the transducer frequency,the greater the attenu-ation as a function of depth.There are limitations on the Z-axis(axial)resolu-tion.This is a function of the transducer frequency.The higher the transducer frequency,the better the resolution.However,the higher frequency signal becomes attenuated more quickly as a function of depth.There are limitations on the X-Y(lateral)resolu-tion.The X-Y(lateral)resolution is a function of a number of differ-ent variables including:•Transducer characteristics,including frequency,element diam-eter,and focal length•Absorption and scattering of acoustic waves as a function of the sample material•Electromechanical properties of the X-Y stageIrregularly shaped packages are difficult to analyze.The technique requires some kind offlat reference surface.Typically,the upper surface of the package or the die surfacecan be used as references.In some packages,cambered packageedges can cause difficulty in analyzing defects near the edgesand below their surfaces.Edge Effect The edges cause difficulty in analyzing defects near the edge ofany internal features.IPC/JEDEC J-STD-035April1999 10April1999IPC/JEDEC J-STD-035Appendix DReference Procedure for Presenting Applicable Scanned DataMost of the settings described may be captured as a default for the particular supplier/product with specific changes recorded on a sample or lot basis.Setup Configuration(Digital Setup File Name and Contents)Calibration Procedure and Calibration/Reference Standards usedTransducerManufacturerModelCenter frequencySerial numberElement diameterFocal length in waterScan SetupScan area(X-Y dimensions)Scan step sizeHorizontalVerticalDisplayed resolutionHorizontalVerticalScan speedPulser/Receiver SettingsGainBandwidthPulseEnergyRepetition rateReceiver attenuationDampingFilterEcho amplitudePulse Analyzer SettingsFront surface gate delay relative to trigger pulseSubsurface gate(if used)High passfilterDetection threshold for positive oscillation,negative oscillationA/D settingsSampling rateOffset settingPer Sample SettingsSample orientation(top or bottom(flipped)view and location of pin1or some other distinguishing characteristic) Focus(point,depth,interface)Reference planeNon-default parametersSample identification information to uniquely distinguish it from others in the same group11IPC/JEDEC J-STD-035April1999Appendix DReference Procedure for Presenting Applicable Scanned Data(continued) Reference Procedure for Presenting Scanned DataImagefile types and namesGray scale and color image legend definitionsSignificance of colorsIndications or definition of delaminationImage dimensionsDepth scale of TOFDeviation from true aspect ratioImage type:A-mode,B-mode,C-mode,TOF,Through TransmissionA-mode waveforms should be provided for points of interest,such as delaminated areas.In addition,an A-mode image should be provided for a bonded area as a control.12Standard Improvement FormIPC/JEDEC J-STD-035The purpose of this form is to provide the Technical Committee of IPC with input from the industry regarding usage of the subject standard.Individuals or companies are invited to submit comments to IPC.All comments will be collected and dispersed to the appropriate committee(s).If you can provide input,please complete this form and return to:IPC2215Sanders RoadNorthbrook,IL 60062-6135Fax 847509.97981.I recommend changes to the following:Requirement,paragraph number Test Method number,paragraph numberThe referenced paragraph number has proven to be:Unclear Too RigidInErrorOther2.Recommendations forcorrection:3.Other suggestions for document improvement:Submitted by:Name Telephone Company E-mailAddress City/State/ZipDate ASSOCIATION CONNECTING ELECTRONICS INDUSTRIESASSOCIATION CONNECTINGELECTRONICS INDUSTRIESISBN#1-580982-28-X2215 Sanders Road, Northbrook, IL 60062-6135Tel. 847.509.9700 Fax 847.509.9798。

电子产品说明书翻译

电子产品说明书翻译

电子产品说明书翻译【篇一:产品说明书的翻译】产品说明书的翻译说明书主要是用来说明产品的性能、特点、用途、配方及使用方法等,服务对象是普通消费者,所以语言浅显确切,简单明了,讲究科学性和逻辑性。

它的作用旨在指导使用,所以翻译时要一丝不苟,不能有少出入。

由于商品中种类、性质不同,说明的方法。

内容也就不同。

所以在翻译时要针对不同的具体要求,努力使译文所选用词准确明了,行文简洁流畅。

一般来说,日用品说明书在说明产品性能、特点、用途等方面时,往往追求生动活泼,充满溢美之词,旨在激发人们购买、使用产品的欲望。

而药品说明书通常包含成分、主治、用法说明、注意事项、禁忌以及副作用等部分。

翻译时要读懂原文中的专用名词,然后才能准确用词,避免出错。

机械设备说明书通常包括商品特点、用途、规格、性能、结构、操作程序以及注意事项等,语言简单明了。

【例1】娃哈哈儿童营养液娃哈哈儿童营养液是由我厂和浙江医科大学医学营养系共同开发的,含有人体所需的氨基酸、维生素、微量元素等多种营养成分,尤其是对儿童生长发育所缺的钙、铁、锌作了补充,通过国家级新产品鉴定,在国内同类产品中处于领先地位。

配料:蜂蜜、山楂、红枣、枸杞、莲子、米仁、桂圆、核桃等。

成分:每100毫升含量,蛋白质1.5%以上,钙250-300毫克,铁12.5-20毫克,锌12.5-20毫克。

净含量:每支10毫克,每盒10只,计100毫升。

储藏:本品宜存于阴凉处。

保质期一年,保存期一年半。

食用方法:早晚食用,每次1-2支。

批准文号:浙卫食准字(89)第0004-35号标准代号:q/wjb0201-89杭州娃哈哈营养食品厂出品,浙江医科大学医学营养系监制。

【译文】wahaha, a children’s nourishing liquid is co-developed by hangzhou wahaha nutritious food product factory and the dept.of medical nutrition of zhejiang medical university. the liquid contains rich amino acids, vitamins and particularly supplies children with ca and trace elements such as fe and zn essential to healthy growth. it occupies the leading position in the development of nourishing products and has passed the nation-level evaluation of newly-developed products.ingredients: honey, hawthorn, jujube, lycium, chinese lotus seed, barley, longan,walnut, etc.nutrients: per 100ml: protein over 1.5%, ca 250-300 mg, fe 12.5-20 mg, zn12.5-20 mg.contents: 10 ampoules per case, 10 ml per ample, total 100 ml. storage: to be kept in a cool place. quality guarantee for one year and storageperiod one and a half year.dosage: 1-2 ampoules a day in the morning and evening.sanction no.: zhejiang food hygiene permit (89)0004-35standard code: q/wjb 0201-89manufactured by: hangzhou wahaha nutritious food product factorysupervised by: dept. of medical nutrition of zhejiang medical university【例2】care and maintenanceyour device is a product of superior design and craftsmanship and should be treated with care. the suggestion below will help you protect your warranty coverage.【译文】您的手机为设计优越、做工精良之产品,应妥善维护、保养。

FUNDAMENTALS OF ACOUSTICS(11)

FUNDAMENTALS OF ACOUSTICS(11)

equation
2 p t 2
c02
2 p x2
The general solution for the one-
dimensional wave equation can be
written in progressive waves form
x
x
p
f1(t c0 )
f2 (t
) c0
Which consists of two parts : the first part represents a wave of arbitrary shape traveling in the x direction with velocity co ,and the second part represents a wave also of arbitrary shape traveling in the negative x direction with velocity c0 .
• As suggested in Fig. , let the plane x=0 be
the boundary between fluid I of
characteristic acoustic impedance Z1 and fluid II of characteristic acoustic
must be satisfied for all times at all point on the boundary:
• (1) the acoustic pressures on both sides
of the boundary are equal
p1(x,t) x0 p2(x,t) x0
impedance Z2.

KEF Blade 扬声器说明书

KEF Blade 扬声器说明书

Blade owner’s manualimportant safety informationgeneral care of your systemThank you for purchasing KEF Blade speakers. They have been designed to faithfully reproduce high qualitysound over many years of use and should provide realistic reproduction of music and speech. Please take a littletime to read these instructions prior to use.Y our KEF Blade speakers are tall, slim and extremely heavy. Installed correctly on a smooth, level surface, yourspeakers should be entirely safe to listen to and to live with.However, if you live with small children, large pets, the infirm, have uneven flooring or unusually thick carpetingin your home, then correct adjustment of the foot assemblies is imperative if safe, stable operation is tobe achieved.Warning: The metal tweeter dome has a protective wave guide at the centre of the Uni-Q® driver array;if this is compromised and the dome itself is dented, it will permanently impair performance.1. Read this manual carefully,especially the safety information,before attempting to assembleand operate the system.1. Avoid temperature extremes.2. Avoid damp.3. Avoid direct sunlight.4. Clean with the KEF cloth provided.5. Do not use spirit based cleaners.If you are at all uncertain about setting up, operating or caring for your system your dealer willbe pleased to assist you.4. Trailing cables are dangerous.Ensure all cables are secureand tidy.2. Follow the unpacking andassembly instructions on thecartons. Please note that liftingthe system requires twoable-bodied persons.3. Never connect the systemdirectly to the electricity supply.5. When stripping cables use onlytools designed specifically for thepurpose i.e. correct wire cuttersor cable strippers.AdjustmentCaution/WarningSwitch off appliancePositiveNegativeOption5Page 10 - unpacking, handling and after carePage 11 - adjusting the feet and/or spikesPage 12 - speaker placement and room acoustics Page 14 - amplifier tospeaker connectionsPage 15 - amplifier requirementsand power handlingPage 16 - single, bi-wireand bi-amp connectionsPage 19contentsInstallation and Operation Specifications7Adjust Lockunpacking, handling and after care adjusting the feet and/or spikes These Blade speakers are packedone speaker per carton. Prior tounpacking, please ensure that theserial numbers of the speakerssupplied match each other.Then, unpack the speakerscarefully following the instructionsprinted on the carton and inspectfor any sign of damage.Y our speakers left KEF in perfectcondition. If any damage isapparent, you should notify yourretailer or consultant immediately.Retain the packaging in case aneed arises for you to transportthe speakers at a later date.Y ou will notice that a special KEFcare pack is included with eachpair of speakers.Under normal circumstances your speakers will be commissioned by your retailer or consultant, who will have been trained in their installation by KEF.KEF strongly recommends that you do not attempt to level your speakers single-handedly.Recruit the assistance of another adult or consult an authorised KEF Blade outlet for assistance which may be chargeable if the purchase was not made through them originally.The spike/locking nut combination supplied is designed to provide small adjustments, not to compensate for seriously irregular floors.Each Blade speaker is supplied with KEF designed substantial spikes and locking nuts (also in the care pack). This enables fine adjustment of level, depending on your preferred location of the speakers whatever the floor covering, carpet, tile or block wood. In addition to the spikes and locking nuts each Blade also comes with pucks to protect wood floors.Often, you will find that the speaker is close to vertical, but rocks because one spike (or two spikes diagonally) seems too short.If the general stability is good, but the speaker is leaning to the left, right, backward or forward, then equal minor adjustments to the two spikes opposite to the direction of lean should be made. Installation and operation Installation and operation This pack contains a cleaning cloth and all the required accessories for connecting and positioning your speakers. The care pack also contains the unique product build certificate. This is a valuable document and guarantees the quality and craftsmanship of your speakers.The cabinets are finished in high gloss and should be treated with the same care with which you would treat fine furniture. A suitable cleaning cloth is included in the customer care pack to maintain the original finish and lustre. A spirit level is provided at the rear of the Blade to gauge when the speaker is perfectly level.A rigidly-sited speaker performs better than one that can move because it enables the cabinet to remain fixed while the drive units are allowed to move as determined by the source signal. Best results will be obtained if the speakers are level and stable. Check the general stability of each speaker by gently rocking it from side to side, front-to-back and diagonally.11speaker placement and room acousticsThe listening room is one of the most variable elements in the hi-fi chain and its effect cannot be emphasised too strongly, nor can its effect be reliably predicted. Spacing the speakers approximately 2m - 3m (6ft. -10ft.) apart will allow the stereo images to develop fully. Y ou should sit at a distance at least equal to, and preferably greater than, the distance betweenthe speakers.Be aware also that soft furnishingsnear to a speaker will deaden thesound - similarly, nearby reflectivesurfaces may brighten up thesound. Move the speakers untilyou are satisfied that the sound isright and that the stereo image iswell defined.Installation and operationPositioning the speaker in a corner or near to a side wall is not recommended as the significant bass boost caused by this position will affect the sound and cause the stereo image to deteriorate. It is best to place the speakers symmetrically within the room, relative to the walls, ceiling andfloor, where possible.13amplifier to speaker connectionsAll connections should be made with the amplifier switched OFF. Ensure the integrity of all connections prior to switching the amplifier ON.KEF Blade speakers are fitted with purpose designed silver-platedBi-wire/Bi-amp terminals which will accept bare wire, spade or4mm connectors.Most good quality speaker cables have some indication, such as colour coding or ‘ribbing’ on the insulating material, indicating which conductor is ‘+’ or positive. Connection to the speakers can then be made as follows:Bare wire connections are the simplest to achieve and involve stripping 12.5mm (0.5in.) of insulation to expose the speaker wire core. (Y ou should twist together, using clean fingers, the ends of each multi-stranded core prior to the next stage to ensure a good signal contact). Having unscrewed the lower terminal cap, push the wire through the exposed hole in the terminal body and screw the capdown tightly.Make sure that no stray strands come into contact with the opposite terminal; this could cause a short circuit between the terminals and may damage your amplifier.Be aware that a higher quality run of cable will always give a more rewarding presentation than multiple runs of an inferior cable.Installation and operationThe left channel amplifier output terminal marked ‘+’ or coloured RED connects to the left speaker terminal marked ‘+’. The left channel amplifier output terminal marked ‘-’ or coloured BLACK connects to the left speaker terminal marked ‘-’. Similarly, these instructions should be followed for making connections between the right channel amplifier output and the right speaker. Correct polarity, or phase, is vital to the proper operation of the system.If the connections are not made correctly the sound will deteriorate giving poor bass output and a diffuse presentation of the soundstage.amplifier requirementsand power handlingIn KEF literature and in thespecification table within theseinstructions are listed a range ofamplifier power outputs to matchyour Blade speakers. Conditions ofuse (room size, type ofprogramme, preferred listeninglevel) and the nature of thespeaker/amplifier interface vary sowidely that it is not possible to laydown hard and fast rules aboutamplifiers and the speakersthey drive.KEF speakers are built to rigorousstandards of quality andconsistency and the upper limits ofthe amplifier requirements shownare those which the speaker inquestion should handle withoutdistress or damage when usedunder normal domestic conditions.Remember it is easier to damagethe speaker by using a smallamplifier driven into distortion bytoo much volume, possibly withbass and treble boost, than byusing a larger amplifier which haspower in reserve. If in doubt,ask the advice of your retaileror consultant. Installation and operationIf higher than specified amplifierpowers are used, great care shouldbe taken to avoid abnormalconditions such as switch-onsurges or gross distortion, eitherof the amplifier or the speaker,resulting in power peaks greatly inexcess of the ratings specified.Care should be taken as thepossibility still exists under certainconditions (such as excessive bassor treble boost caused by toneand/or loudness controls, graphicequalisers, etc.) that the speakerscan be overloaded and damaged.The lower limits of amplifierpower are those necessary to givea reasonable sound pressure levelunder domestic conditions.15single, bi-wire and bi-amp connectionsInstallation and operationThe left and right channel speaker cables should, wherever possible, be the same length otherwise there may be a perceptible change in output level between the speakers.17specifications19BladeDesign Three-way bass reflex, Single Apparent Sourcedriver configurationDrive units Uni-Q driver array:MF: 125mm (5in.) Li-Mg-Al /LCP hybrid coneHF: 25mm (1in.) Al domeBass units:LF: 4 x 225mm (9in.) with force cancellingFrequency response 40Hz - 35kHz +/- 3dB28Hz - 45kHz. +/- 6dBHarmonic distortion 2nd and 3rd harmonics (90dB/1m):<0.5% 40Hz - 100kHz<0.2% 200Hz - 10kHzCrossover frequencies 350Hz, 3kHzAmplifier requirements 50 - 400WSensitivity (2.83V/1m)90dBMaximum output (SPL)117dBNominal impedance 4 Ohms (3.2 Ohms min.)Weight 57.2 kg (126 lbs)Dimensions (H x W x D)1590 x 363 x 540 mm62.5 x 14.3 x 21.2in.Standard Finishes Gloss black or gloss whiteCustom Colours Garnet, sapphire, grigio, racing red, racing blue, palegold, orange sorbet, graphite, stardust, lemon sorbet,lime sorbet or snow white1590mm(62.5in.)363mm (14.3in.)540mm(21.2in.)K 290247EEmail:************Email:********************Email:***************Email:*******************Email:********************.hk E-mail:***********Email:********************.tw10Email:********************。

工业工程专业英语词汇

工业工程专业英语词汇

工业工程专业英语词汇industrial engineering:工业工程accredited:认可的、授权的accrue:增值acoustics:声学acquisition:并购address:处理、针对、重点提出affiliate:隶属于aggregation:总体、集合体Agile Manufacturing (AM):敏捷制造aircraft:飞机,航空器align:适应alliance:联盟ample:足够的、充裕的anatomical:解剖的ancillary:辅助的、附属的anthropometry:人体测量学appropriation: 占用artificial material:人工材料ASME: American Society of Mechanical Engineers:美国机械工程师协会assembly line:装配线assess:评估assiduity:勤奋、刻苦audit:审计automatic pallet changer:自动托盘转换装置automation:自动化ballistic:自然带弧形的bar code:条形码batch production:批量生产bench:工作台bill:清单bin:箱子biomechanical:生物力学的blade:刀片、叶片brand new:全新的budget-oriented:面向预算的capacity:生产能力capital turnover:资金周转capital:资金carbon-filament:钨丝causal method:因果法cause and effect diagram:因果图cellular layout:单元式布局certification:认证change over :换模checksheet:检查表chronological:严密逻辑的chuck:卡盘circulate:循环、流通civil engineering:土木工程clamp:夹住closed loop:闭环CNC machine tools:计算机数控机床cockpit:飞机座舱、驾驶员座舱cognitive:认知的coil feeder:卷料进料器Communication Techniques in Logisticscompetitiveness:竞争力component:零件、组件、部件comprehensive interest:综合利益Computer Integrated Manufacturing Systems (CIMS):计算机集成制造系统computerized numerical controlconsecutive: 连续的continous improvement:持续改进continuous improvement:持续改进conveyor:输送机convoluted:复杂的、回旋的、弯曲的coordination:协调corkscrew: 螺丝刀cost-effective:有成本效益的、划算的crank:曲柄critical examination technique:关键检测技术crossbar:十字杠culminate:达到顶点curricula: 课程(or curriculum)customer satisfaction:顾客满意cutback:缩减cylindrical:圆柱的prismatic:棱柱的dam:水坝decision-making:决策defective:有瑕疵的,有缺陷的definable:可定义的demonstrate:示范、说明dependent demand: 相关需求discipline:学科discrete:离散的dispersion:分散性distribution:配送、分销division:部门、分配、分开drill press:钻床drop delivery:堕送装置due date:交货期dye:染料earning:收益、利润E-business:电子商务economic and knowledge-based era:知识经济时代economic batch quantity:经济批量economic globalization:经济全球化ECRS(eliminate combine rearrange simplify):取消、合并、重排、简化EDM: electron discharge machining:放电加工effectiveness:效果efficiency:效率ejector:斜槽、导轨electrical engineering:电气工程electricity: 电、电学、电流、电气electronic data interchange:电子数据交换E-Manufacturing:网络化制造engulf:吞没EOS:电子订货系统electronic ordering system ergonomically:工效学地ergonomics:工效学exaggerated:过大的、许多的explosion:爆炸法eyestrain:视觉疲劳,眼睛疲劳fabrication:制造facility:设备、设施factory layout:工厂布局family:簇fatigue:疲劳fatigue:疲劳feat:合适的feed grinding machine: 进给式磨床feedback:反馈feedback:反馈file:锉刀final product:最终产品fish bone diagram:鱼骨图fitness for use:适用性fixed position layout:定位布局fixture:固定设备、夹具flapped operation:节拍式加工flexible manufacturing system:柔性制造系统flow diagram:线路图flow process chart:流程程序图fluctuate: 波动forcible:强制的、有说服力的forearm:前臂upper arm:大臂trunk:躯干torso forecast:预测forge:锻造forge:锻造formulate:阐述、制定fortification:防御工事forward-looking:有远见的foundry:铸造friction: 摩擦frustration:挫折fuel:燃料fully automated:全自动化gang process chart:联合程序图garment industry:制衣业gauge:计量器general packet radio servicegeographic information systemsgeometry:几何形状GIS:地理信息系统GPRS:通用分组无线业务GPS:全球定位系统global positioning systemgravity feed:重力自流进料group technology:成组技术hand in hand :合作hardware:硬件harmonious society:和谐社会haul: 拖、拉health-care delivery: 卫生保健服务high-tech:高科技hindrance:妨碍histogram:直方图hoist:起重机human factor:人因human-centered design:以人为中心设计hybrid layout:混合式布局hypotenuse:斜边(hypothesis:假设)identical:相同的idleness:空闲IE engineers:工业工程师(IEs)IE graduates:工业工程毕业生(IEs)impede:妨碍,阻止implicitly:隐含地incentive:鼓励inclined plane:斜面inclusive design:全方位设计inconsistency:不一致independent demand: 独立需求independent variable:自变量inevitable:不可避免的inspection:检测Institute of Industrial Engineers:工业工程师学会(IIE)instructor:讲师、教练instrument:仪器、器械intangible:无形的integrated equipment:集成设备interchangeability:互换性interface:界面、接口intermediary:中间人intermittent:间歇的internal combustion engine:内燃机International Accreditation Forum:国际认证论坛International Organization for Standardization:国际标准化组织(ISO)inventory control:库存控制Inventory:库存inventory:清单、库存invoicing:开发票item:物料项目jig:夹具job shop production:车间任务型生产judgment method:判断方法jumbled:混合的、混乱的knuckle:指关节wrist:腕关节elbow:肘关节lag:落后,延迟lathe:车床layout:布局lead time:提前期Lean Production (LP):精益生产literature:文献loading:装载locomotive:火车头logistics:物流long and short-term memory:长短时记忆lot for lot:批对批lot size:批量low-volume, high-variety production:多品种、小批量生产lubricant:润滑剂luggage:行李machine cell:机器单元machine tool:机床magnetism:磁学maintainability:可维护性maintaining:维护malfunction:故障manipulate:处理,使用,操纵man-machine process chart:人机程序图manufacturing industry:制造业manufacturing resources planning:制造资源计划market share:市场占有率master production scheduling:主生产计划material handling :物料搬运material requirements planning:物料需求计划mechanical engineering:机械工程mechanized:机械化的mental demand:脑力需求metal-working job shop :金工车间method study:方法研究methodology:方法metrics:度量military:军事的milling machine:铣床mission:使命、任务、目标MIT: 麻省理工学院Massachusetts Institute of Technology molecular:分子的momentum:动量monetary:货币的、金融的morale:士气、纪律motion analysis:动作分析motion economy principles:动作经济原则motivation:激励multi-disciplinary:多学科性质的muscle:肌肉muscle:肌肉musculoskeletal disorder:肌骨失调navigation:导航netting:净需求计算normative:标准的notch: V型凹槽、切口nutrition:营养observe value:观察值offset:偏置法operation analysis:作业分析operation management:运作管理operation process chart: 工艺程序图opportunity:缺陷机会order fulfillment: 订单执行order lots:订单批量、订货量orient:定向otiose:无效的、多余的outlets:品牌直销购物中心overengineer:高于工程要求的package:包装pallet:托盘parameter:参数pareto chart:排列图part period cover:零件周期批量participation:参与partition:分割parts feeder:送料器physical science :自然科学(natural science )physiology:生理学pivot:轴、支点、中心点plot:以图的形式表示Pmts: predetermined motion time system:预定动作时间系统portable powered tool:便携式电动工具portray:描绘POS:销售时点系统point of sale systempositioning device:定位装置positioning:定位potentiality:潜能practitioner:开业者pre-assessment:预评估precondition :前提prediction:预言preliminary:预备的、初级的pre-positioned:预放在工作位置上proceed:行进、继续进行process analysis:程序分析process layout:工艺布局procurement:采购product layout:产品布局product life cycle: 产品生命周期production line:生产线production planning:生产计划production process:生产过程production scheduling:生产调度production system:生产系统productive:有生产价值的、多产的productivity :生产率profitability:收益率psychology:心理学pull production:拉动式生产Pythagorean theorem:勾股定理qualitative method:定性方法quality of conformance:符合性质量quality of design:设计质量quantitative method:定量方法rapid changeover:快速换模raw material:原材料rectangular:矩形的cube:立方体registrar:注册人员reliability:可靠性repetition:重复、复制品repetitive strain injury:重复性劳损replenishment:补充、补给reproach:责备、谴责reputation:声誉requirement:需求reservation:预定resharpen:重磨retailer:零售商revenue:收入、税收RFID:无线射频技术radio frequency identification rough cut capacity:粗能力计划saturation:饱和scatter diagram:散布图scheduling:调度、排程scheme:计划、设计screwdriver:螺丝刀seasonal patterns:季节模式semi-automatic(automated):半自动化seminar:研讨班sensory:感觉的service system:服务系统setup time:生产准备时间Shakespeare industry :莎士比亚产业sheet:薄板状的shroud:罩、遮蔽物simple lever:单杠杆simultaneously:同时地six sigma methodology: 六西格玛法socialize joint distribution:社会化共同配送specialization: 专业化specialty:专业specification:规范specs:规范、规格stamp:冲压standard data:标准资料standard deviation:标准偏差standardization: 标准化static electricity:静电学statistic:统计的statistical:统计学的steam engine:蒸汽机stock:库存store :仓库strategic planning:战略规划Stratford-on-Avon, as we all know, has only one industry-William Shakespeare-but there are two distinctly separate and increasingly hostile branches.subassembly:组件、部件substandard:低于标准的suite:软件包supply chain:供应链symmetrical:对称、匀称synchronous:同步的synthesize:综合tangible:有形的team spirit:团队精神Technical Committee(TC)176:品质保证技术委员会template:模板template:模型thermal process:热处理thermal:热量的,热的third-party logistics:第三方物流threbligs:动素time study:时间研究time-series analysis:时间序列分析tolerance:容许偏差tote bin:搬运箱trade-off: 权衡transaction:业务、交易transformation:转换transmission:传送transportation:运输trivial:琐碎的tune:调整turbine:涡轮机、汽轮机two-hand process chart:双手程序图underengineer:低于工程要求的unloading:卸载unpredictable:不可预测的user-centered:用户为中心的variable:变量vessel:管道vibration:振动vicinity:邻近visionary:远景warehouse:仓库warehouse:仓库、仓储weld:焊接wholesaler:批发商work measurement:作业测定work piece:工件work related upper limb disorder:工作引起的上肢功能障碍work sampling:工作抽样work unit:工件workhead:工作台、机台workholder:工件夹具work-in-process:在制品workshop:车间、研讨会workstation:工作站。

手机声学原理介绍

手机声学原理介绍

Learning report on principles of acoustics of the cellphoneZHOU Y ang-fangOnce in the Sunlite Electronic (Shen Zhen ) co.,ltd, Shen Zhen 518000, ChinaAbstract:These days , through the chect of kinds of material ,I have a general idea of the mobile phone acoustics and make a relavant arrangement ,making mainly a summary report in here .The sound system of the phone have the three basic function devices that include the speaker ,the receiver ,and the microphone .The speaker is to realize the hand-free cellphone conversation and the speech broadcasting ,the receiver’s purpose is that the voice messenger is received by the phone ,and the microphone’s function is that the acoustic information is passed from people to phone .They realize the fundamental function of the phone and perfectly deduce the phone’s roles in the daily life so that we cannot do without it .Keywords:Acoustics of the cellphone ,acoustics devices ,sound wave , the working principle ,short circuiting effectContent:1.The basic knowledge of the electroacoustics1.1Sound propagation mode1.2Speed of sound1.3Frequency domain1.4Sound pressure level1.5V oice three elements2.Acoustics devices of the phone’s structure3.Working principle of SPK.&RCV.3.1The basic principle of application3.2Workong principle3.3Difference of SPK.&RCV.3.4The basic parameters of SPK.&RCV.4.The acoustic short circuiting effectT ext:1.The basic knowledge of the electroacoustics1.1Sound propagation modeSound transimission needs the medium and sound can’t travel through a vacuum .Sound wave belongs to the longitudinal wave1.2Speed of soundSpeed which sound travels through the air is 344 m/s ,at normal temperatures and press- ures.The highter the temperature is ,the greater the sound velocity is .And sound travels faster in the liquid and the solid than through the air .The relationships of sound speed through the air and temperature is that , c (t℃) =331.6 +0.6t m/s1.3 Frequency domainUaually,frequency range is 20 HZ to 20K HZ .The soundwave ,whose range is below 20 HZ,is called the infrasonicwave ,while the soundwave whose range is above 20K HZ is called the ulfrasonicwave .But the range of speech tone is 300 HZ to 3400 HZ .1.4Sound pressure level (ear acceptable)SPL is denoted by the sign “Lp” ,whose result is denoted by the sign “db” .SPL’s expres- sion is as below :Lp =20 ㏒10 P/P0 , P0 --- atmosphere pressureP -- sound pressureThe relationships of sound pressure and sound pressure level is that ,the sound pressure e- very double and the increased sound pressure level 6db ,and every increase 10 times and incr- eased pressure level 20db . As provided below ;P0 = 1.0325 ×105(20℃)1.5V oice three elementsThe pitch ,the volume ,and the tone make up three elements of voice . The pitch repre-- sents the high-low of sound frequence ,whose result is denoted by the sign “CPS “(cycle per second) .The volume represents the big or small of sound amplitude ,usually denoted by the sign “db” . For the soundwave ,people only know it is generated by the harmonicwave , but anyway ,how do these harmonicwaves make up the soundwave ? How is their result ? Can neither make the substantial explanations ,can nor make a measure .So ,for the tone ,people feel completely by heart and with experience ,and it is man’s subjective opinion .2.Acoustics devices of the phone’s structureUsually the cellphone acoustics devices include the miniature receiver ,the polyphonic speaker ,the microphone ,and the headsets .3.Working principle of SPK.&RCV.3.1 The basic principle of applicationFor SPK and RCV ,their application basic principle ,including threee parts of Electricity ,Magnetism ,and Force ,is that when the current-carrying wire cuts the line of magnetic force ,it will exposure to the power of magnetic field with its forced direction following the Left Hand Rule ,and the valve of force is that F= BIL .3.2 Working principleThe SPK and RCV ,their magnetic circuit system consists of the annular space in which is full of uniform magnetic field , whose vibrating system is made up of the ring voice coil constituted the conducting wire and the vibrating diaphragm liked with it .Their working pri- nciple is that ,as the voice coil is transmitted a signal voltage ,it will generate current and cut the line of magnetic force ,and then generate the force ,on the effect of which , the vibrating diaphragm will generate the vibration and then compress the atmosphere air ,as a result that , the SPK and RCV generate the sound . For the overall process above , it is a transformation from the Electricity to the Force ,and to the Sound, again..3.3 Difference of SPK &RCVSPK is heared by the ear through a distance ,while RCV is directly heared .SPK’s worki- ng range is wide , involving the music category , while working range of RCV is the voice .SPK’s power is bigger than RCV’s . SPK’s geometry is bigger than RCV’s. Also , SPK is quite arbitrary in phone’s position ,but RCV is only in a position .3.4 The basic parameters of SPK.&RCV.Frequency Response curveEffective Frequency RangeSPL(Sound Pressure Level)THD(Total Harmonic Distortion)F0 --- Harmonic FrequencyRated impedanceRated Power / max. Power4.The acoustic short circuiting effectWhen vibrating diaphragm of SPK and RCV vibrates ,they will generate the soundwave forward and backwad , and their soundwaves phase is the opposition . Because directivity of low frenquency is more than 180 degrees ,close to no directivity , when soundwaves outward show a ring spread ,soundwaves of anti-phase low frequency will intersect forward and bac- kward , and then voice willl take place of short circuit . This is the acoustic short circuiting effect .Phone’s cavity and gasket can avoid the acoustic short circuit effect ,separating sound waves brfore and after .。

Primacoustic EcoScapes Acoustic Clouds 安装手册说明书

Primacoustic EcoScapes Acoustic Clouds 安装手册说明书

33"/4' A coustic CloudsInstallation ManualBox Contents:Before beginning assembly, please take a moment to familiarize yourself with the box contents.orHigh Density PET Acoustic Clouds4' x 4' x 1" (1,200mm x 1,200mm x 24mm) 33" x 33" x 1" (838mm x 838mm x 24mm)Actual appearance may vary, depending on model purchased2x 76" Sheathed Aircraft Cable8x8xCeiling Toggle w/Screws8xCable Caps (two parts)Congratulations on purchasing your new EcoScapes Cloud kit from Primacoustic. EcoScapes Acoustic Clouds are high performance absorption panels that are designed to hang from the ceiling and capture ambient noise and reverberation. This is achieved by absorbing sound as it hits the face of the panel, while trapping powerful reflections behind as they echo off the ceiling. Please take a few minutes to read this installation manual. It will give you a list of included parts, as well as easy to follow assembly instructions and installation options.Please refer to for general room acoustics information and further details. Should you have any questions or comments, we invite you to send an email to *********************Cable Anchor Set8xInstallation GuidelinesDENSITYThe number of clouds in a given area will determine the rate of sound absorption. This can vary depending on room size and noise levels.LOCATIONSpread evenly for general sound control, or concentrate over noisy areas to absorb sound before it can reflect.SUSPENSION HEIGHTLeave a minimum 3" (76mm) of air space between the panel and ceiling, up to a maximum of 75" (150cm)Installation1. Ceiling Anchor LocationsMeasure and mark your ceiling for suspension point locations. Pay close attention to where you want the panel to be located. This way the panel anchors will be directly below each ceiling mounting point. All cables should hang straight to create a dead hang.3. Attach Pet Cable AnchorPlace anchor with the flat section on marks previously created. Screw the smaller screws through the plate’s holes directly into the cloud panel until the head of the screw is flush and tight with the anchor plate. NOTE: the screws will not fully tighten, however the connection will be very secure.Repeat for the other three anchors.and follow the next steps. Tools & materials required:• Measuring Tape• Ladder/Scaffolding• Drill 3/32" (2.4mm) bit• Screwdriver• Hammer• Wire ClippersPlease inspect products immediately after receiving your purchase. Primacoustic acoustic products are guaranteed to be free of manufacturing defects for a period of 3 years after purchase. In the unlikely event that a defect is uncovered, please call 604-942-1001 to obtain a RA number (Return Authorization number) from Primacoustic before the 3 year warranty period expires. Once you have obtained a RA number you must return the product, freight prepaid, within fifteen (15) days after the date the RA number is issued. Please return the product in the original packaging (or another, affording an equal degree of protection) with all of the following: (1) RA number clearly marked on the returned package; (2) a receipt or bill of sale showing proof of purchase from an authorized seller; plus (3) a letter describing the defect. Please include your name, address, telephone number and the applicable RA number. You are solely responsible for all shipping and insurance costs for returning the product to Primacoustic, and you will not be reimbursed or compensated for any loss or damage incurred during return shipping. Primacoustic will at its sole discretion repair or replace the product. Should the product no longer be available, Primacoustic reserves the right to exchange this with a product of similar performance and value. Due to different dye lots, Primacoustic cannot guarantee exact color match. This Warranty shall solely extend to the original owner and is limited to manufacturing defects and excludes damage due to improper installation, freight handling, wear and tear, abuse, misuse, misapplication, color fading or deterioration due to prolonged exposure to ultra violet light, smoke, humidity or other environmental factors. It is understood that the use and suitability of the product is entirely the responsibility of the buyer or specifying engineer and as such, these parties agree to hold Primacoustic, or its associated company, and/or officers, harmless from any responsibility whatsoever other than what is clearly outlined in this warranty.Limited Warranty7. Suspend and LevelWith the panel suspended, pull the cable though to adjust the panel’s distance from the ceiling.5. Install The Cable EndcapPass the unterminated end of the cable though the cable cap. Screw the ceiling cap into the ceiling anchor using thelonger screws. Screw the cable cap into the ceiling cap.Fine-tune the lengths of the cable by pressing on the center sleeve of the anchor to release the cable. For the best acoustic performance, maintain a minimum of 3" (76mm) 6. Attach The Cloud PanelAngle the cable anchor at 45 degrees. Insert the loose end of the cable into the top of the anchor, pushing firmly to engage the cable into the anchoring mechanism. You should be able to see the cable protruding thought the bottom.。

营运能力的分析外文中英文翻译

营运能力的分析外文中英文翻译

营运能力的分析外文中英文翻译外文翻译原文 Operation ability analysis Material Source: China's securities nets 05/17/2020 Author:Techever Operation ability fully utilize existing resources to create social wealth ability, can be used to evaluate the enterprise to its own resources utilization and operating activities ability. Its essence is to as few as possible resources occupation short turnover time, produce as many products, create as many sales revenue, and to achieve this goal, we must improve enterprise's operation ability level. Operation ability is the assets of the enterprise turnaround to measure the efficiency of the utilization of assets enterprises. The index reflects assets turnover rate have inventory turnover, liquid assets turnover rate, total asset turnover. The faster turnaround speed, it shows that the enterprise of assets into business links, forming the faster the cycle of revenue and profit more short, business efficiency is higher. Operation ability refers to the enterprise asset turnover operation ability, usually can use total asset turnover, fixedasset turnover, flow asset turnover, inventory turnover and accounts receivable turnover these five financial ratios to enterprises' operating capacity for layered analysis. Operation ability analysis can help investors understand enterprise business conditions and operating management level. With our su ning electric equipment (BBS) (market, for example, 002024) to introduce how to enterprise's investors operating capability analysis. Total asset turnover is to show enterprise sales income and total assets of the ratio of average balance. Suning 2020 sales revenue for 91.1 billion yuan, average total assets of 14 million yuan; 2020 sales income increased to 160.4 billion yuan, the average total assets is increased by 2.3 times, reached 31.9 million yuan. Due to the growing rate of total assets than the sales income increase, total asset turnover down to 5 by lead. The rate of decline in 2020 with suning opened the new mass are directly related. In order to complete the “national cloth nets“ thestrategic pattern, suning in 2020 at 65, a new store new landed 20 cities, and the original logistics, service system of radiation radius is limited, so su ning to makes lots of management platform, in order to support the construction of the urbanconstruction in the same after other stores of logistics and management. This makes su ning expansion strategy initial cost of relatively high. Current assets turnover is enterprise's sales income and liquidity ratio of average balance. Through this ratio analysis, we can further understanding of enterprise in the short term operation ability changes. From statements that su ning 2020 sales income nearly 1.6 billion yuan, growth rate, while the average flow rate reached more than doubled assets. The liquidity didn't bring the same margin large increase of sales income growth, so current assets turnover in 2020 7.36 dropped by the 2020 5.61, explain the efficiency in the use of su ning liquid assets declined. Fixed asset turnover is mainly used for analysis of fixed assets such as factory buildings, equipment, the ratio of the utilization efficiency of the higher and higher, explain utilization, management level, the better. If the fixed asset turnover compared with industry average low, then explaining enterprise of fixed assets utilization is low, might affect the enterprise profitability. It reflects enterprise asset utilization degree. Fixed asset turnover ratio = sales revenue/average net value of fixed assets The average net value of fixed assets = (initialequity + final equity) voting 2 Enterprise inside certain period advocate business wu income with average net current assets ratio of total asset utilization, is appraise enterprise another important indexes. It reflects the enterprise liquid assets turnover rate from enterprise all assets, liquidity of the strongest in current assets Angle of enterprise assets utilization efficiency, in order to further analyze the quality of enterprise assets reveals acoustics major factor. Current assets turnover means certain period for a year) (usually the main business income and total migrant assets ratio of the average balance.therefore, can through to inventory turnover and accounts receivable further analysis of flow asset turnover ratio changes. Suning in stock sales primarily, therefore, accounts receivable accounted for only the liquidity, and inventory 50% 4.75%. Inventory turnover refers to enterprises and inventory cost of sales average balance ratio. For real estate industry inventory turnover is a very key indicators, real estate industry is very special. Usually, inventory turnover is the sooner the better, and real estate industry inventory quantity bigger, the slower the turnover that the strength of the company is the more abundant. Other industry's inventory turnover for six or seven times a year of general level, in contrast, in the real estate industry a year about a second, if in six or seven times a year inventory turnover for real estate industry as the company is tiny companies, with a powerful real estate stocks, inventory turnover are very low, because must keep a lot of land reserves, land reserve is his inventory, the houses built yet form sales belong to assets range, depend on these achieve sales.Inventory turnover condition can also be expressed with inventory, namely said days once inventory turnover the time required that the shorter days, the faster inventory turnover. Suning 15.05 inventory turnover in 2020 for 2020, this ratio dropped to 10.33. Accordingly, inventory turnover days from 24 days extended to 35 days. Inventory liquidation speed decreased obviously, explain suning sales ability may exist problems down or inventory excess. Accounts receivable turnover refers to the enterprise certain period income and accounts receivable credit average balance ratio. It reflects the company obtained the account receivable from the right to withdraw money, can be converted into cash needed the length of time. Accounts receivable turnover can be used to estimate the accounts receivable convertedspeed and management efficiency. Recovery quickly can save money, also shows that enterprise credit situation is good, not easy loss of bad happened. Generally believe that the higher the turnover of the good.This index measure enterprise accounts receivable into cash speed. Because credit sales income can't easily get, in practice used more sales income is calculated alternative credit income. Suning customers is mainly individual consumer to both clear of money and goods, trading on the basis of the account receivable credit income proportion is very small, so the sales income data obtained by receivable turnover is very high. In general, the higher the ratio of enterprises that enterprise collection receivable and the faster, can reduce the loss of bad, and liquidity strong, enterprise's short-term solvency will also strengthen, in some extent could compensate for the current ratio low adverse impact. If the enterprise receivables turnover is too low, then explaining enterprise collection receivable inefficient or credit policy very loose, affect the enterprise use of the capital and capital normal turnover. On real estate enterprise operation ability of financial analysis framework can mainly from three aspects: building management ability index, accountsreceivable turnover and working capital turnover rate. In these three respects based on real estate enterprise combining the characteristics, the selection of the appropriate financial index on real estate enterprises' operating capability evaluation. This paper puts forward the analysis framework of general applicability, for real estate enterprises and other enterprises in the operation of the managers do provide quantitative basis for decision-making and analysis methods. Through the case analysis can be found that, because the influence of assets turnover rate, total assets yield level but not necessarily advocate business wu income consistent with gross margin. And commercial real estate and industrial real estate, residential real estate than sex where profit margins, so vanke's sales income margin increased year by year, but despite highest when still about 41%, but the lujiazui, and the land is provided income can be as high as 80% gross margin, cofco property of materials processing income also can achieve 75% gross margin. From the trend, the incomes of the three companies are in growth state gross margin. But because the operating cash flow is low, the efficiency high profit margins of the lujiazui and cofco real estate but show low on total assets. Three real estate enterpriseoperations in there is a common problem, namely the working capital turnover rate is too slow. Operation ability of the enterprise of the scale of operations and different difference were real estate enterprise can cause inventory turnover rate and working capital turnover rate is different. Residential property turnover rate sex than commercial real estate and industrial real estate, so vanke faster the inventory turnover faster than lujiazui, cofco property because small in scale, the turnover rate close to YuWanKe. But in recent years due to land prices continue to rise, real estate enterprises have been through a lot of store, extend the project development period and so on the way to getting the higher profit margin. Thus the current real estate enterprises in our country there are a large amount of inventory turnover, slow ills. 译文营运能力的分析资料来源:中国证券网 05/17/2020 作者:Techever 营运能力是充分利用现有资源创造社会财富的能力,可以用来评价企业对其拥有资源的利用程度和营运活动能力。

#音视频设备上常用英文标识的含义

#音视频设备上常用英文标识的含义

音响常用英文表记的含义合用于音响培训班编译—郑宝生AANRS 自动降噪系统Auto 自动的Analogic 模拟的(依据声波强度和特色变换成相应的电信号)Audio mixing consol 调音台(对音频电信号的放大、修饰、混淆、分派、输出)Amplifier 功率放大器(对音频信号的功率、幅度放大到可以驱动扬声器)Aux 协助 ( 分为输入、输出,用于调音台和周边设施进行电信号联接、在输入通道上设有信号拿出点、输出通道设有输出接口 ) Attack 成即刻间 - 进入状态所用的时间(压限器开始压缩或限制所用时间)Auto/Manual 自动 / 手动操作变换键。

Audio 音频(声音变换的电信号)Acoustical 声波(声音以波的形式经过空气向四周流传)。

Acoustics Ambiet 声学环境(声波流传的环境、同声场的形成)。

Active crossover 有源分频器(电子分频)将全音域音频信号利用分频网络:(低通滤波器、带通滤波器、高通滤波器)进行频段切割为 2 段、 3 段分别输出、拥有增益赔偿功能。

Afl 衰减器后监听(音量控制器、推子后输出)Across Frequency 交错频次 - 两个频段之间的切割频次(分频点)Allocact 分派Alter 改正变换Adaptor 适配器Ambience 围绕声Absorbent Room 消声室 - 也称无混响室,用于声学设施的丈量。

Antenna 天线用于无线信号的发送和接收。

Architectural Acoustice 建筑声学(建筑内声波流传特征的研究)A/D 模拟 / 数字变换器(将模拟信号变换成数字信号)。

Attenuation 数字式衰减器BBroadcast System BalanceBridging 广播系统均衡信号传输中信号的冷热端有关于均衡点电平相等。

桥接双通道放大器经桥接功能作为单通道放大器使用。

功率为双通道之和、负载接于两个通道的正极、信号由 A 路输入、并受控于 A音量控制。

7-13 按国际专利标准分类的专利申请受理、授权和有效数(2015年)

7-13 按国际专利标准分类的专利申请受理、授权和有效数(2015年)

Centrifugal Apparatus or Machines Spraying or Atomizing in General Generating or transmission of Mechanical Vibrations Separating Solids from Solids Wastes Cleaning Disposal of Solid Waste Mechanical Metal-working and Stamping Casting and Powder Metallurgy Machine Tools Grinding and Polishing Hand tools, Portable Power Tools and Workshop Equipment Hand Cutting Tools, Cutting and Servering Wood Preservation and Nailing or Stapling Machines Cement, Clay or Stone Working of Plastics Presses Paper Making and Processing Paper Layered Products Pringting, Lining Machines, and Typewriters Bookbinding, Albums, and Files Writing or Drawing Appliances Decorative Arts Vehicles in General Railways Land Vehicles other than Rails Ships and Related Equipment Aircraft and Aviation Conveying aand Packing Inflammatory Material Hoistng, Lifting, and Hauling
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Sound Absorption Coefficient
0.70 0.60 0.50 0.40 0.30 0.20 0.10 0.00 100 Sample A Sample B
1000
10000
Project number
28
1/3 Octave Band Frequency - Hz
How does Sound Absorption Contribute to Vehicle Noise Control?

What is a Sound Barrier?
A sound barrier blocks the transmission of sound from one zone to an adjacent zone The effectiveness of a sound barrier is measured by the Sound Transmission Loss (STL), which is the ratio of sound energy transmitted by a material surface to the sound energy incident upon the surface
τ =
acoustic energy transmitte d by a surface acoustic energy incident on that surface
STL = 10log10 1
( τ)
The STL is measured in dB, varies with frequency, and can be as high as 80 to 90 dB at 10,000 Hz

1/4 wavelength cavities for high performance over a narrow frequency band dual density constructions for a balance of absorption and transmission loss
Porous Less Porous
DENSITY
Higher Density
Lower Density
THICKNESS
Absorption
FACING
Absorption
Thick Thin Frequency
None
Perforated Solid
Frequency
Sound Absokshop
Organized by: Pranab Saha and Anita B. Carey SAE Acoustical Materials Committee
2003 SAE NVC
Presentation Feature This Evening
In general, smaller fiber diameters or smaller cell sizes create higher viscous drag and increase the flow resistance
Sound Absorbers
POROSITY
Absorption Absorption
21 20 1.3 1.26
1.00 higher is better 0.90 0.80
Original Baseline / Company A Baseline Current production design Top Layer A at 1.4 mm thick Middle Layer B at 6 mm thick Bottom Layer C at 12 mm thick Sample B Proposal 1 / Company A-1 Cost Reduction Proposal Top Layer A at 1.4 mm thick Middle Layer B at 8 mm thick Bottom Layer C at 12 mm thick

Basics of Acoustical Materials - Barry R. Wyerman Test Methods for Determining Performance of Acoustical Materials - Peggy Hoult Predicting the Performance of Acoustical Materials -
ThrowThrow-in Mats Carpet Carpet/Vinyl Underlayment HeatHeatBondable Damper
Rear Seat Bottom
Rear Seat Strainer
Rear Wheelhouse
Trunk Floor
= Damper
= Insulator
Interior noise is the summation of contributions from all interior surfaces
6
How are NVH Materials Used?
Materials are converted into products applied throughout the vehicle
Micro denier fibers - porous materials with high internal surface area Sound absorbing products • Engine side treatments, headliners, floor systems, dash insulators
What is an Acoustical Material?
An acoustical material is any material that reduces noise and vibration 4 different materials are commonly used to control automotive noise and vibration


Jerome E. Manning
Acoustical Materials Workshop
Materials
Barrier Absorber Damper
Acoustical Materials Workshop
Basics of Acoustical Materials
Barry R. Wyerman Lear Corporation
What Characteristics of Materials make them Absorptive?
Effective sound absorbers are usually porous, with performance increasing with thickness. Important material properties include the following: •Porosity is the percent open area within the material - it allows the sound waves to propagate into the material •Tortuosity is the property that prevents direct flow through the material •Flow Resistance is the result of porosity, tortuosity, and cell structure of a material and is often a good measure of how absorptive a material will be.
Typical sound absorbing materials • Fibers - recycled cotton, glass fibers, thermoplastic fibers • Foams - open cell polyurethanes • Membrane absorbers - light weight membranes for tuned performance over a specific frequency range • Hybrid constructions •
Typical Sound Absorption Plot
Sample A Sample B
Normal Incidence Sound Absorption per ASTM E1050SAE Standard Data Format
99
Thickness (mm) 20 Reported Measured 21 Surface Weight (kg/m^2) 1.2 Reported 1.15 Measured Sample A
Damping
Energy Dissipated
Output Vibration
Each material performs a special function to reduce noise or vibration
Why do We Need Different Materials?
Some materials control airborne noise Some materials control structureborne noise
α=
acoustic energy absorbed by a surface acoustic energy incident on that surface
The sound absorption coefficient ranges from 0% to 100% and varies with frequency, based on the material properties
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