Frequency Response Function Measurement
数据分析英语试题及答案
数据分析英语试题及答案一、选择题(每题2分,共10分)1. Which of the following is not a common data type in data analysis?A. NumericalB. CategoricalC. TextualD. Binary2. What is the process of transforming raw data into an understandable format called?A. Data cleaningB. Data transformationC. Data miningD. Data visualization3. In data analysis, what does the term "variance" refer to?A. The average of the data pointsB. The spread of the data points around the meanC. The sum of the data pointsD. The highest value in the data set4. Which statistical measure is used to determine the central tendency of a data set?A. ModeB. MedianC. MeanD. All of the above5. What is the purpose of using a correlation coefficient in data analysis?A. To measure the strength and direction of a linear relationship between two variablesB. To calculate the mean of the data pointsC. To identify outliers in the data setD. To predict future data points二、填空题(每题2分,共10分)6. The process of identifying and correcting (or removing) errors and inconsistencies in data is known as ________.7. A type of data that can be ordered or ranked is called________ data.8. The ________ is a statistical measure that shows the average of a data set.9. A ________ is a graphical representation of data that uses bars to show comparisons among categories.10. When two variables move in opposite directions, the correlation between them is ________.三、简答题(每题5分,共20分)11. Explain the difference between descriptive andinferential statistics.12. What is the significance of a p-value in hypothesis testing?13. Describe the concept of data normalization and its importance in data analysis.14. How can data visualization help in understanding complex data sets?四、计算题(每题10分,共20分)15. Given a data set with the following values: 10, 12, 15, 18, 20, calculate the mean and standard deviation.16. If a data analyst wants to compare the performance of two different marketing campaigns, what type of statistical test might they use and why?五、案例分析题(每题15分,共30分)17. A company wants to analyze the sales data of its products over the last year. What steps should the data analyst take to prepare the data for analysis?18. Discuss the ethical considerations a data analyst should keep in mind when handling sensitive customer data.答案:一、选择题1. D2. B3. B4. D5. A二、填空题6. Data cleaning7. Ordinal8. Mean9. Bar chart10. Negative三、简答题11. Descriptive statistics summarize and describe thefeatures of a data set, while inferential statistics make predictions or inferences about a population based on a sample.12. A p-value indicates the probability of observing the data, or something more extreme, if the null hypothesis is true. A small p-value suggests that the observed data is unlikely under the null hypothesis, leading to its rejection.13. Data normalization is the process of scaling data to a common scale. It is important because it allows formeaningful comparisons between variables and can improve the performance of certain algorithms.14. Data visualization can help in understanding complex data sets by providing a visual representation of the data, making it easier to identify patterns, trends, and outliers.四、计算题15. Mean = (10 + 12 + 15 + 18 + 20) / 5 = 14, Standard Deviation = √[(Σ(xi - mean)^2) / N] = √[(10 + 4 + 1 + 16 + 36) / 5] = √52 / 5 ≈ 3.816. A t-test or ANOVA might be used to compare the means ofthe two campaigns, as these tests can determine if there is a statistically significant difference between the groups.五、案例分析题17. The data analyst should first clean the data by removing any errors or inconsistencies. Then, they should transformthe data into a suitable format for analysis, such ascreating a time series for monthly sales. They might also normalize the data if necessary and perform exploratory data analysis to identify any patterns or trends.18. A data analyst should ensure the confidentiality andprivacy of customer data, comply with relevant data protection laws, and obtain consent where required. They should also be transparent about how the data will be used and take steps to prevent any potential misuse of the data.。
电力系统频率响应的改进模型与参数估计
第38卷第5期 852019年9月电力工程技*Electric Power Engineering Technology DOE :10.I2158/j.2096-3203.2019.05.013电力系统频率响应的改进模型与参数估计李东辉1,臧晓明2,鞠平2,陈谦2(1.南瑞集团电力设计有限公司,江苏南京211106;2.河海大学能源与电气学院,江苏南京210098)摘 要:近年来,多种因素导致电力系统频率大波动事故时有发生。
而目前对电力系统调频能力预估误差较大,有必要采用电力系统频率响应(SFR )模型计算频率的动态响应。
文中分析了 SFR 经典模型的不足之处,据此改进了SFR 模型结构,其中考虑了等值调速器的动态特性。
进而提出了 SFR 改进模型的参数估计方法,先直接计算获得部分参数,然后加入保证稳态一致性的参数约束条件,最后辨识获得其余参数。
通过仿真算例对频率响应进行了 计算,验证了 SFR 改进模型结构与参数估计方法的有效性。
结果表明,SFR 改进模型能够有效表征系统频率响应的主要指标,其精度显著高于SFR 经典模型。
关键词:频率;系统频率响应;模型;参数估计中图分类号:TM744 文献标志码:A 文章编号:2096-3203( 2019) 05-0085-060引言我国电网的额定频率为50 Hz ,要求频率偏差控制在±0.2 Hz 以内。
以往电力系统的频率极少发 生较大波动,所以较少关注频率动态问题[1,3]o 随 着新能源特别是风力发电的并网,大大增大了电源 侧的随机性,减小了电力系统的等值惯性,给电力 系统调频带来了新的挑战⑷;特高压交直流大容量输电通道的建设,成为威胁电力系统频率安全稳定 性的重大隐患[5,7];电力电子装置的广泛应用,削弱了负荷侧的频率响应性能,也给电力系统的频率安 全稳定性带来了潜在的威胁[8,9]"鉴于这些新变化,频率动态问题逐渐受到了学者的重视[10]o 尤其 是特高压直流输电工程的逐渐投运,换流站故障导致电力系统频率大波动事件频发。
数字信号处理教案(东南大学)
数 字 信 号 处 理绪 论一、从模拟到数字1、信号:信号传递信息的函数也是独立变量的函数,这个变量可以是时间、空间位置等。
2、连续信号:在某个时间区间,除有限间断点外所有瞬时均有确定值。
3、模拟信号是连续信号的特例。
时间和幅度均连续。
4、离散信号:时间上不连续,幅度连续。
5、数字信号:幅度量化,时间和幅度均不连续。
二、数字信号处理的主要优点数字信号处理采用数字系统完成信号处理的任务,它具有数字系统的一些共同优点,例如数码 量化电平 数字信号 D/A 输出信号 模拟信号 数字信号转化成模拟信号 D/A 输出 模拟滤波输出 模拟信号的数字化 数字信号 数码 量化电平 模拟信号采样保持信号 量化电平 A / D 变换器 通用或专用 计算机 采样 保持器 D/ A 变换器 模拟低通 滤波器 模拟信号 数字信号 模拟信号 数字信号处理系统 连续时间信号 连续时间信号抗干扰、可靠性强,便于大规模集成等。
除此而外,与传统的模拟信号处理方法相比较,它还具有以下一些明显的优点:1、精度高在模拟系统的电路中,元器件精度要达到以上已经不容易了,而数字系统17位字长可以达到的精度,这是很平常的。
例如,基于离散傅里叶变换的数字式频谱分析仪,其幅值精度和频率分辨率均远远高于模拟频谱分析仪。
2、灵活性强数字信号处理采用了专用或通用的数字系统,其性能取决于运算程序和乘法器的各系数,这些均存储在数字系统中,只要改变运算程序或系数,即可改变系统的特性参数,比改变模拟系统方便得多。
3、可以实现模拟系统很难达到的指标或特性例如:有限长单位脉冲响应数字滤波器可以实现严格的线性相位;在数字信号处理中可以将信号存储起来,用延迟的方法实现非因果系统,从而提高了系统的性能指标;数据压缩方法可以大大地减少信息传输中的信道容量。
4、可以实现多维信号处理利用庞大的存储单元,可以存储二维的图像信号或多维的阵列信号,实现二维或多维的滤波及谱分析等。
5、缺点(1)增加了系统的复杂性。
jstd035声学扫描
JOINT INDUSTRY STANDARDAcoustic Microscopy for Non-HermeticEncapsulatedElectronicComponents IPC/JEDEC J-STD-035APRIL1999Supersedes IPC-SM-786 Supersedes IPC-TM-650,2.6.22Notice EIA/JEDEC and IPC Standards and Publications are designed to serve thepublic interest through eliminating misunderstandings between manufacturersand purchasers,facilitating interchangeability and improvement of products,and assisting the purchaser in selecting and obtaining with minimum delaythe proper product for his particular need.Existence of such Standards andPublications shall not in any respect preclude any member or nonmember ofEIA/JEDEC or IPC from manufacturing or selling products not conformingto such Standards and Publications,nor shall the existence of such Standardsand Publications preclude their voluntary use by those other than EIA/JEDECand IPC members,whether the standard is to be used either domestically orinternationally.Recommended Standards and Publications are adopted by EIA/JEDEC andIPC without regard to whether their adoption may involve patents on articles,materials,or processes.By such action,EIA/JEDEC and IPC do not assumeany liability to any patent owner,nor do they assume any obligation whateverto parties adopting the Recommended Standard or ers are alsowholly responsible for protecting themselves against all claims of liabilities forpatent infringement.The material in this joint standard was developed by the EIA/JEDEC JC-14.1Committee on Reliability Test Methods for Packaged Devices and the IPCPlastic Chip Carrier Cracking Task Group(B-10a)The J-STD-035supersedes IPC-TM-650,Test Method2.6.22.For Technical Information Contact:Electronic Industries Alliance/ JEDEC(Joint Electron Device Engineering Council)2500Wilson Boulevard Arlington,V A22201Phone(703)907-7560Fax(703)907-7501IPC2215Sanders Road Northbrook,IL60062-6135 Phone(847)509-9700Fax(847)509-9798Please use the Standard Improvement Form shown at the end of thisdocument.©Copyright1999.The Electronic Industries Alliance,Arlington,Virginia,and IPC,Northbrook,Illinois.All rights reserved under both international and Pan-American copyright conventions.Any copying,scanning or other reproduction of these materials without the prior written consent of the copyright holder is strictly prohibited and constitutes infringement under the Copyright Law of the United States.IPC/JEDEC J-STD-035Acoustic Microscopyfor Non-Hermetic EncapsulatedElectronicComponentsA joint standard developed by the EIA/JEDEC JC-14.1Committee on Reliability Test Methods for Packaged Devices and the B-10a Plastic Chip Carrier Cracking Task Group of IPCUsers of this standard are encouraged to participate in the development of future revisions.Contact:EIA/JEDEC Engineering Department 2500Wilson Boulevard Arlington,V A22201 Phone(703)907-7500 Fax(703)907-7501IPC2215Sanders Road Northbrook,IL60062-6135 Phone(847)509-9700Fax(847)509-9798ASSOCIATION CONNECTINGELECTRONICS INDUSTRIESAcknowledgmentMembers of the Joint IPC-EIA/JEDEC Moisture Classification Task Group have worked to develop this document.We would like to thank them for their dedication to this effort.Any Standard involving a complex technology draws material from a vast number of sources.While the principal members of the Joint Moisture Classification Working Group are shown below,it is not possible to include all of those who assisted in the evolution of this Standard.To each of them,the mem-bers of the EIA/JEDEC and IPC extend their gratitude.IPC Packaged Electronic Components Committee ChairmanMartin FreedmanAMP,Inc.IPC Plastic Chip Carrier Cracking Task Group,B-10a ChairmanSteven MartellSonoscan,Inc.EIA/JEDEC JC14.1CommitteeChairmanJack McCullenIntel Corp.EIA/JEDEC JC14ChairmanNick LycoudesMotorolaJoint Working Group MembersCharlie Baker,TIChristopher Brigham,Hi/FnRalph Carbone,Hewlett Packard Co. Don Denton,TIMatt Dotty,AmkorMichele J.DiFranza,The Mitre Corp. Leo Feinstein,Allegro Microsystems Inc.Barry Fernelius,Hewlett Packard Co. Chris Fortunko,National Institute of StandardsRobert J.Gregory,CAE Electronics, Inc.Curtis Grosskopf,IBM Corp.Bill Guthrie,IBM Corp.Phil Johnson,Philips Semiconductors Nick Lycoudes,MotorolaSteven R.Martell,Sonoscan Inc. Jack McCullen,Intel Corp.Tom Moore,TIDavid Nicol,Lucent Technologies Inc.Pramod Patel,Advanced Micro Devices Inc.Ramon R.Reglos,XilinxCorazon Reglos,AdaptecGerald Servais,Delphi Delco Electronics SystemsRichard Shook,Lucent Technologies Inc.E.Lon Smith,Lucent Technologies Inc.Randy Walberg,NationalSemiconductor Corp.Charlie Wu,AdaptecEdward Masami Aoki,HewlettPackard LaboratoriesFonda B.Wu,Raytheon Systems Co.Richard W.Boerdner,EJE ResearchVictor J.Brzozowski,NorthropGrumman ES&SDMacushla Chen,Wus Printed CircuitCo.Ltd.Jeffrey C.Colish,Northrop GrummanCorp.Samuel J.Croce,Litton AeroProducts DivisionDerek D-Andrade,Surface MountTechnology CentreRao B.Dayaneni,Hewlett PackardLaboratoriesRodney Dehne,OEM WorldwideJames F.Maguire,Boeing Defense&Space GroupKim Finch,Boeing Defense&SpaceGroupAlelie Funcell,Xilinx Inc.Constantino J.Gonzalez,ACMEMunir Haq,Advanced Micro DevicesInc.Larry A.Hargreaves,DC.ScientificInc.John T.Hoback,Amoco ChemicalCo.Terence Kern,Axiom Electronics Inc.Connie M.Korth,K-Byte/HibbingManufacturingGabriele Marcantonio,NORTELCharles Martin,Hewlett PackardLaboratoriesRichard W.Max,Alcatel NetworkSystems Inc.Patrick McCluskey,University ofMarylandJames H.Moffitt,Moffitt ConsultingServicesRobert Mulligan,Motorola Inc.James E.Mumby,CibaJohn Northrup,Lockheed MartinCorp.Dominique K.Numakura,LitchfieldPrecision ComponentsNitin B.Parekh,Unisys Corp.Bella Poborets,Lucent TechnologiesInc.D.Elaine Pope,Intel Corp.Ray Prasad,Ray Prasad ConsultancyGroupAlbert Puah,Adaptec Inc.William Sepp,Technic Inc.Ralph W.Taylor,Lockheed MartinCorp.Ed R.Tidwell,DSC CommunicationsCorp.Nick Virmani,Naval Research LabKen Warren,Corlund ElectronicsCorp.Yulia B.Zaks,Lucent TechnologiesInc.IPC/JEDEC J-STD-035April1999 iiTable of Contents1SCOPE (1)2DEFINITIONS (1)2.1A-mode (1)2.2B-mode (1)2.3Back-Side Substrate View Area (1)2.4C-mode (1)2.5Through Transmission Mode (2)2.6Die Attach View Area (2)2.7Die Surface View Area (2)2.8Focal Length(FL) (2)2.9Focus Plane (2)2.10Leadframe(L/F)View Area (2)2.11Reflective Acoustic Microscope (2)2.12Through Transmission Acoustic Microscope (2)2.13Time-of-Flight(TOF) (3)2.14Top-Side Die Attach Substrate View Area (3)3APPARATUS (3)3.1Reflective Acoustic Microscope System (3)3.2Through Transmission AcousticMicroscope System (4)4PROCEDURE (4)4.1Equipment Setup (4)4.2Perform Acoustic Scans..........................................4Appendix A Acoustic Microscopy Defect CheckSheet (6)Appendix B Potential Image Pitfalls (9)Appendix C Some Limitations of AcousticMicroscopy (10)Appendix D Reference Procedure for PresentingApplicable Scanned Data (11)FiguresFigure1Example of A-mode Display (1)Figure2Example of B-mode Display (1)Figure3Example of C-mode Display (2)Figure4Example of Through Transmission Display (2)Figure5Diagram of a Reflective Acoustic MicroscopeSystem (3)Figure6Diagram of a Through Transmission AcousticMicroscope System (3)April1999IPC/JEDEC J-STD-035iiiIPC/JEDEC J-STD-035April1999This Page Intentionally Left BlankivApril1999IPC/JEDEC J-STD-035 Acoustic Microscopy for Non-Hermetic EncapsulatedElectronic Components1SCOPEThis test method defines the procedures for performing acoustic microscopy on non-hermetic encapsulated electronic com-ponents.This method provides users with an acoustic microscopy processflow for detecting defects non-destructively in plastic packages while achieving reproducibility.2DEFINITIONS2.1A-mode Acoustic data collected at the smallest X-Y-Z region defined by the limitations of the given acoustic micro-scope.An A-mode display contains amplitude and phase/polarity information as a function of time offlight at a single point in the X-Y plane.See Figure1-Example of A-mode Display.IPC-035-1 Figure1Example of A-mode Display2.2B-mode Acoustic data collected along an X-Z or Y-Z plane versus depth using a reflective acoustic microscope.A B-mode scan contains amplitude and phase/polarity information as a function of time offlight at each point along the scan line.A B-mode scan furnishes a two-dimensional(cross-sectional)description along a scan line(X or Y).See Figure2-Example of B-mode Display.IPC-035-2 Figure2Example of B-mode Display(bottom half of picture on left)2.3Back-Side Substrate View Area(Refer to Appendix A,Type IV)The interface between the encapsulant and the back of the substrate within the outer edges of the substrate surface.2.4C-mode Acoustic data collected in an X-Y plane at depth(Z)using a reflective acoustic microscope.A C-mode scan contains amplitude and phase/polarity information at each point in the scan plane.A C-mode scan furnishes a two-dimensional(area)image of echoes arising from reflections at a particular depth(Z).See Figure3-Example of C-mode Display.1IPC/JEDEC J-STD-035April1999IPC-035-3 Figure3Example of C-mode Display2.5Through Transmission Mode Acoustic data collected in an X-Y plane throughout the depth(Z)using a through trans-mission acoustic microscope.A Through Transmission mode scan contains only amplitude information at each point in the scan plane.A Through Transmission scan furnishes a two-dimensional(area)image of transmitted ultrasound through the complete thickness/depth(Z)of the sample/component.See Figure4-Example of Through Transmission Display.IPC-035-4 Figure4Example of Through Transmission Display2.6Die Attach View Area(Refer to Appendix A,Type II)The interface between the die and the die attach adhesive and/or the die attach adhesive and the die attach substrate.2.7Die Surface View Area(Refer to Appendix A,Type I)The interface between the encapsulant and the active side of the die.2.8Focal Length(FL)The distance in water at which a transducer’s spot size is at a minimum.2.9Focus Plane The X-Y plane at a depth(Z),which the amplitude of the acoustic signal is maximized.2.10Leadframe(L/F)View Area(Refer to Appendix A,Type V)The imaged area which extends from the outer L/F edges of the package to the L/F‘‘tips’’(wedge bond/stitch bond region of the innermost portion of the L/F.)2.11Reflective Acoustic Microscope An acoustic microscope that uses one transducer as both the pulser and receiver. (This is also known as a pulse/echo system.)See Figure5-Diagram of a Reflective Acoustic Microscope System.2.12Through Transmission Acoustic Microscope An acoustic microscope that transmits ultrasound completely through the sample from a sending transducer to a receiver on the opposite side.See Figure6-Diagram of a Through Transmis-sion Acoustic Microscope System.2April1999IPC/JEDEC J-STD-0353IPC/JEDEC J-STD-035April1999 3.1.6A broad band acoustic transducer with a center frequency in the range of10to200MHz for subsurface imaging.3.2Through Transmission Acoustic Microscope System(see Figure6)comprised of:3.2.1Items3.1.1to3.1.6above3.2.2Ultrasonic pulser(can be a pulser/receiver as in3.1.1)3.2.3Separate receiving transducer or ultrasonic detection system3.3Reference packages or standards,including packages with delamination and packages without delamination,for use during equipment setup.3.4Sample holder for pre-positioning samples.The holder should keep the samples from moving during the scan and maintain planarity.4PROCEDUREThis procedure is generic to all acoustic microscopes.For operational details related to this procedure that apply to a spe-cific model of acoustic microscope,consult the manufacturer’s operational manual.4.1Equipment Setup4.1.1Select the transducer with the highest useable ultrasonic frequency,subject to the limitations imposed by the media thickness and acoustic characteristics,package configuration,and transducer availability,to analyze the interfaces of inter-est.The transducer selected should have a low enough frequency to provide a clear signal from the interface of interest.The transducer should have a high enough frequency to delineate the interface of interest.Note:Through transmission mode may require a lower frequency and/or longer focal length than reflective mode.Through transmission is effective for the initial inspection of components to determine if defects are present.4.1.2Verify setup with the reference packages or standards(see3.3above)and settings that are appropriate for the trans-ducer chosen in4.1.1to ensure that the critical parameters at the interface of interest correlate to the reference standard uti-lized.4.1.3Place units in the sample holder in the coupling medium such that the upper surface of each unit is parallel with the scanning plane of the acoustic transducer.Sweep air bubbles away from the unit surface and from the bottom of the trans-ducer head.4.1.4At afixed distance(Z),align the transducer and/or stage for the maximum reflected amplitude from the top surface of the sample.The transducer must be perpendicular to the sample surface.4.1.5Focus by maximizing the amplitude,in the A-mode display,of the reflection from the interface designated for imag-ing.This is done by adjusting the Z-axis distance between the transducer and the sample.4.2Perform Acoustic Scans4.2.1Inspect the acoustic image(s)for any anomalies,verify that the anomaly is a package defect or an artifact of the imaging process,and record the results.(See Appendix A for an example of a check sheet that may be used.)To determine if an anomaly is a package defect or an artifact of the imaging process it is recommended to analyze the A-mode display at the location of the anomaly.4.2.2Consider potential pitfalls in image interpretation listed in,but not limited to,Appendix B and some of the limita-tions of acoustic microscopy listed in,but not limited to,Appendix C.If necessary,make adjustments to the equipment setup to optimize the results and rescan.4April1999IPC/JEDEC J-STD-035 4.2.3Evaluate the acoustic images using the failure criteria specified in other appropriate documents,such as J-STD-020.4.2.4Record the images and thefinal instrument setup parameters for documentation purposes.An example checklist is shown in Appendix D.5IPC/JEDEC J-STD-035April19996April1999IPC/JEDEC J-STD-035Appendix AAcoustic Microscopy Defect Check Sheet(continued)CIRCUIT SIDE SCANImage File Name/PathDelamination(Type I)Die Circuit Surface/Encapsulant Number Affected:Average%Location:Corner Edge Center (Type II)Die/Die Attach Number Affected:Average%Location:Corner Edge Center (Type III)Encapsulant/Substrate Number Affected:Average%Location:Corner Edge Center (Type V)Interconnect tip Number Affected:Average%Interconnect Number Affected:Max.%Length(Type VI)Intra-Laminate Number Affected:Average%Location:Corner Edge Center Comments:CracksAre cracks present:Yes NoIf yes:Do any cracks intersect:bond wire ball bond wedge bond tab bump tab leadDoes crack extend from leadfinger to any other internal feature:Yes NoDoes crack extend more than two-thirds the distance from any internal feature to the external surfaceof the package:Yes NoAdditional verification required:Yes NoComments:Mold Compound VoidsAre voids present:Yes NoIf yes:Approx.size Location(if multiple voids,use comment section)Do any voids intersect:bond wire ball bond wedge bond tab bump tab lead Additional verification required:Yes NoComments:7IPC/JEDEC J-STD-035April1999Appendix AAcoustic Microscopy Defect Check Sheet(continued)NON-CIRCUIT SIDE SCANImage File Name/PathDelamination(Type IV)Encapsulant/Substrate Number Affected:Average%Location:Corner Edge Center (Type II)Substrate/Die Attach Number Affected:Average%Location:Corner Edge Center (Type V)Interconnect Number Affected:Max.%LengthLocation:Corner Edge Center (Type VI)Intra-Laminate Number Affected:Average%Location:Corner Edge Center (Type VII)Heat Spreader Number Affected:Average%Location:Corner Edge Center Additional verification required:Yes NoComments:CracksAre cracks present:Yes NoIf yes:Does crack extend more than two-thirds the distance from any internal feature to the external surfaceof the package:Yes NoAdditional verification required:Yes NoComments:Mold Compound VoidsAre voids present:Yes NoIf yes:Approx.size Location(if multiple voids,use comment section)Additional verification required:Yes NoComments:8Appendix BPotential Image PitfallsOBSERV ATIONS CAUSES/COMMENTSUnexplained loss of front surface signal Gain setting too lowSymbolization on package surfaceEjector pin knockoutsPin1and other mold marksDust,air bubbles,fingerprints,residueScratches,scribe marks,pencil marksCambered package edgeUnexplained loss of subsurface signal Gain setting too lowTransducer frequency too highAcoustically absorbent(rubbery)fillerLarge mold compound voidsPorosity/high concentration of small voidsAngled cracks in package‘‘Dark line boundary’’(phase cancellation)Burned molding compound(ESD/EOS damage)False or spotty indication of delamination Low acoustic impedance coating(polyimide,gel)Focus errorIncorrect delamination gate setupMultilayer interference effectsFalse indication of adhesion Gain set too high(saturation)Incorrect delamination gate setupFocus errorOverlap of front surface and subsurface echoes(transducerfrequency too low)Fluidfilling delamination areasApparent voiding around die edge Reflection from wire loopsIncorrect setting of void gateGraded intensity Die tilt or lead frame deformation Sample tiltApril1999IPC/JEDEC J-STD-0359Appendix CSome Limitations of Acoustic MicroscopyAcoustic microscopy is an analytical technique that provides a non-destructive method for examining plastic encapsulated components for the existence of delaminations,cracks,and voids.This technique has limitations that include the following: LIMITATION REASONAcoustic microscopy has difficulty infinding small defects if the package is too thick.The ultrasonic signal becomes more attenuated as a function of two factors:the depth into the package and the transducer fre-quency.The greater the depth,the greater the attenuation.Simi-larly,the higher the transducer frequency,the greater the attenu-ation as a function of depth.There are limitations on the Z-axis(axial)resolu-tion.This is a function of the transducer frequency.The higher the transducer frequency,the better the resolution.However,the higher frequency signal becomes attenuated more quickly as a function of depth.There are limitations on the X-Y(lateral)resolu-tion.The X-Y(lateral)resolution is a function of a number of differ-ent variables including:•Transducer characteristics,including frequency,element diam-eter,and focal length•Absorption and scattering of acoustic waves as a function of the sample material•Electromechanical properties of the X-Y stageIrregularly shaped packages are difficult to analyze.The technique requires some kind offlat reference surface.Typically,the upper surface of the package or the die surfacecan be used as references.In some packages,cambered packageedges can cause difficulty in analyzing defects near the edgesand below their surfaces.Edge Effect The edges cause difficulty in analyzing defects near the edge ofany internal features.IPC/JEDEC J-STD-035April1999 10April1999IPC/JEDEC J-STD-035Appendix DReference Procedure for Presenting Applicable Scanned DataMost of the settings described may be captured as a default for the particular supplier/product with specific changes recorded on a sample or lot basis.Setup Configuration(Digital Setup File Name and Contents)Calibration Procedure and Calibration/Reference Standards usedTransducerManufacturerModelCenter frequencySerial numberElement diameterFocal length in waterScan SetupScan area(X-Y dimensions)Scan step sizeHorizontalVerticalDisplayed resolutionHorizontalVerticalScan speedPulser/Receiver SettingsGainBandwidthPulseEnergyRepetition rateReceiver attenuationDampingFilterEcho amplitudePulse Analyzer SettingsFront surface gate delay relative to trigger pulseSubsurface gate(if used)High passfilterDetection threshold for positive oscillation,negative oscillationA/D settingsSampling rateOffset settingPer Sample SettingsSample orientation(top or bottom(flipped)view and location of pin1or some other distinguishing characteristic) Focus(point,depth,interface)Reference planeNon-default parametersSample identification information to uniquely distinguish it from others in the same group11IPC/JEDEC J-STD-035April1999Appendix DReference Procedure for Presenting Applicable Scanned Data(continued) Reference Procedure for Presenting Scanned DataImagefile types and namesGray scale and color image legend definitionsSignificance of colorsIndications or definition of delaminationImage dimensionsDepth scale of TOFDeviation from true aspect ratioImage type:A-mode,B-mode,C-mode,TOF,Through TransmissionA-mode waveforms should be provided for points of interest,such as delaminated areas.In addition,an A-mode image should be provided for a bonded area as a control.12Standard Improvement FormIPC/JEDEC J-STD-035The purpose of this form is to provide the Technical Committee of IPC with input from the industry regarding usage of the subject standard.Individuals or companies are invited to submit comments to IPC.All comments will be collected and dispersed to the appropriate committee(s).If you can provide input,please complete this form and return to:IPC2215Sanders RoadNorthbrook,IL 60062-6135Fax 847509.97981.I recommend changes to the following:Requirement,paragraph number Test Method number,paragraph numberThe referenced paragraph number has proven to be:Unclear Too RigidInErrorOther2.Recommendations forcorrection:3.Other suggestions for document improvement:Submitted by:Name Telephone Company E-mailAddress City/State/ZipDate ASSOCIATION CONNECTING ELECTRONICS INDUSTRIESASSOCIATION CONNECTINGELECTRONICS INDUSTRIESISBN#1-580982-28-X2215 Sanders Road, Northbrook, IL 60062-6135Tel. 847.509.9700 Fax 847.509.9798。
微电子专业英语词汇
Chapter One 第一章Semiconductor fundamental 半导体基础1.1 Semiconductor Materials 半导体材料1 Solid stare 固态2 insulator 绝缘体3 electrical conductivity电导率4 conductor 导体5 semicoductor 半导体6 Fused quartz熔融石英7 order 有序8 impurity 杂质9 element semiconductor元素半导体10 illumination 阐明11 silicon 硅12 Periodic table周期表13 germanium 锗14 gallium 嫁15two-terminal 两端16 Arsenic 砷17 silica 石英18bipolar transistor 双极晶体管19 rectifier 整流器20 optical 光21photodiodes 光电二极管22silicates 硅酸盐23dimension 维度24 Gallium arsenide 砷化镓25 microwave 微波26compound semicondutor 化合物半导体1.2 Crystal Structure 晶体结构1 Crystal 晶体2 amorphous 非晶的3 formlessness 无定形的4 solar cell 太阳能电池5 polycrystalline 多晶的6 silicon dioxide 二氧化硅7 gate 门栅8 lattice 晶格9 single crystal 单晶10 Fashion 方式11 vibration 振动12 unit cell 原胞13 cubic-crystal 立方晶体14 fcc 面心立方15 lattice constant 晶格常数16 Polonium 钋17 bcc 体心立方18 Miller indices 密勒指数19 sodium 钠20 tungsten 钨21 gallium phosphide 磷化镓22 Aluminum 铝23 copper 铜24 diamondlattice 金刚石点阵25 platinum 铂26 Sublattice 子格27 interpenetrate 互相贯通28 diagonal 对角式29 terahedron 四面体30 zincblende lattice 闪锌矿晶格31 zincsulfide 硫化锌32 anisotropic 各向异性33 crystal orientation 晶向34 interceot 截距35 reciprocal 倒数36 perpendicular垂直37 integer 完整38 Cartesian coordinate 笛卡尔坐标系1.3 Bohrˊs Atom Model 波尔原子模型1 nucleus 原子核2 discrete 分立3 engery level 能级4 electronvolt 电子伏5 wavelength 波长6 binding engery 结合能7 shell 壳8 force 力9 angular momentum 角动量10 photon 光子11 joule 焦耳12 excited state 激发态13 potential 电势14 MKS system米千克秒制15 kinetic energy 动能16 ground state 基态17 valence electron 价电子18 principal quantum number 主量子数1.4 V alence Bonds Model of Solid 固体材料价键模型1 current 电流2 resistivity 电阻率3 electric field 电场4 covalent bond 共价键5 nuclei 核6 metallic conductor 金属导体7 electrostatic 静电的8 deficiency 缺陷9 ionic bond 离子键10 hole 空穴11 vacancy 空位1.5 Energy Bonds Model of Solid 固体材料的能带模型1 gaseous 气态2 mass 质量3 plank constant 普朗克常量4 permittivity 介电常数5 bandgap频带间隙6 energy band 能带7 valence band 价带8 conduction band 导带9 band diagram 能带图10 at rest 静态11 discrete energy level 不连续能级离散能级12 quantum mechanics 量子力学13 doubly degenerate energy lever1.6 Free-Carrier Density in Semicondutor 半导体中的自由载流子的密度1 standing-wave 驻波2 wavelength 波长3 momentum 动量4 sphere 球面5 volume 体积6 electron spin 电子自旋7 agitation 振荡8 intrinsic 本征的9 allowed state 允态10 product 乘积11 integrate 集成12 Fermi level 费米能级13 function 函数14 concentration 浓度15 forbidden-gap 禁带16 unity 单元17 exponential 指数函数18 infinity 无穷大19 excitation 激发20 recombination 复合21 deviation 误差22 extrinsic 非本征的23 term 项24 mass-action law 质量守恒定律1.7Donors and Acceptors1 donor 施主2 accepter 受主3 dope 掺杂4 negative 负的5 positive 正的6 boron 硼7 ionization 电离第二章mobility [məu'biliti]迁移率drift [drift] 漂移diffusion [di'fju:ʒən] 扩散gradient ['greidiənt] 梯度generation [,dʒenə'reiʃən]Injection [in'dʒekʃən] 注入None-equilibrium 非平衡Excess carrier 过剩载流子Recombination 符合Lifetime 寿命Thermal equilibrium 热平衡particle ['pɑ:tikl] 粒子质点motion 运动Equipartition 均分Degree of freedom 自由度Three-dimensional ['θri:di'menʃənəl] 三维的kinetic energy 动能collision [kə'liʒən] 碰撞deflect [di'flekt] 偏转挠曲phonon ['fəunɔn] 声子mechanism ['mekənizəm] 机制,机理,操作机构coulomb force 库仑力displacement 位移,迁移mean free path 平均自由行程component [kəm'pəunənt] 子件,组件vacuum ['vækjuəm] 真空,负压proportionality [prəu,pɔ:ʃə'næliti] 比例性factor因素、因数subscript ['sʌbskript] 下标valley 谷最小值cross-sectional area 截面积conductivity [,kɔndʌk'tiviti] 电导率linearity [lini'ærəti] 线性度convection [kən'vekʃən] 对流stationary ['steiʃənəri] 固定的molecule ['mɔlikju:l] 分子spatial ['speiʃəl] 空间的half-width 半角Fick's first law:菲克(扩散)第一定理;菲克第一定律carrier injection 载子注入forward bias 正向偏压;前向偏移optical excitation 光激励electron hole pair 电子空穴对majority carrier 多数载流子injection level 注入水平order of magnitude 数量级low level injection 低水平注入low level injection 高水平注入dissipate 使消散,驱散;驱散;浪费;耗散radiative ['reidieitiv] 辐射的band to band带间direct-bandgap 直接带隙transient trænʃənt] 瞬态response 响应decay 衰减photoconductivity fəutəu,kɔndʌk'tiviti] 光电导性setup 装置pulse 脉冲propagation 传播传导generation 产生世代carrier scattering 载流子散射Chapter Three3.1Device 器件diode 二极管wafer 晶片Alloying 合金epitaxy 外延implantation 注入Substrate 沉底vacuum chamber 真空室furnace 熔炉Eutectic 共晶体dopant 掺杂剂VPE气象外延LPE 液相外延MBE 分子束外延slice 切片Solubility 溶解度range 范围incident ion 入射离子Anneal 退火oven 恒温炉metallurgical 冶金Clectrostatic 静电的dashed line 虚线homojunction 同质结Huterojunction 异质结3.2Electron affinity 电子亲和势work function 功函数reference 基准点Built-in 内建depletion region 耗尽区polarity 极性Quasi-neutral 准中性reverse bias 反偏tunneling current 漏电流3.3Numenclature 命名,命名法sterdy-state 稳态counterintuitive 违反直觉地Avalanche 雪崩interband 带间extrapolate 外推Quality factot 品质因子zener tunneling 齐纳隧道multiplication factor 倍增因子Impedance 阻抗differential 差分dimension 量纲维数Trap 陷阱rectangle 长方的,矩形Chapter FourBJT---双极结式晶体管Collector---集电极Saturation mode---饱和状态Cut off mode---截止状态Minority carrier---少数载流子Qualitatively---质量上Diode---二极管Injection efficiency---注入系数Tunneling---隧道(穿)Ionized acceptor---离子化受主Approximation---近似Barrier---势垒Simulation---仿真Lateral---横向Sheet resistance---表面电阻MOS---金属氧化半导体Gate---栅极Buried layer---势垒层Forward biased---正向偏压Nondegenerate---非简并Injection---注入Milliampere---毫安培Lifetime---寿命Terminal---终端Capacitance---电容Width---宽度Substitute---代替Uniform doping---均匀掺杂Horizontal axis---水平轴Intrinsic---本征的Slope---斜面,坡度,跨导Terminal---电极Transistor---晶体管Active mode---有源状态Reverse biased---反向偏压Assumption---假想,假设Recombination---复合Leakage current---漏电电流Diffusion length---扩散长度Quantitatively---数量上Breakdown---击穿Flux---通量Simplify---简化Doping profile---掺杂分布Normalization---正规化,标准化Extrinsic---非本征的Avalanche---电子雪崩Emitter---发射极Junction---结Common base configuration---共基极组态Common emitter configuration-共射极组态Degenerate---简并的Extract---提取Base contact---基极接点Micrometer---千分尺Principle---原理Steady-state---平衡状态Concentration---集中,浓度Denominator---分母Semilog---半对数的Extrapolation---外推法Lumped resistance---集中电阻Interdigitated structure---交互式结构Base---基极Well---井Boundary condition---边界条件Generation---产生,代Order of magnitude---数量级Current gain---电流增益Collection efficiency---收集效率Neutrality---中性Hyperbolic function---双曲函数Multiplication---乘Gradient---坡度,斜率Depletion layer---耗尽层Polarity---极性,偏极Chapt 5frequency 频率analog模拟digital数字transient瞬态的/过渡的uppercase大写字母lowercase小写字母load resistance负载电容supply voltage供给电压load line 负载电路equivalent circuit 等效电路differential 微分measure 测量reciprocal 交互的/倒数Transconductance跨导series resistance串联电阻Infinite无穷的shaded area 阴影区operating speed工作速度Response反应figure of merit品质因数Delay延时Parasitic寄生的Oscillation振动self-aligned自动对准ion implantation离子注入heat treatment热处理Polysilicon多晶硅Discontinuity中断Switch开关Pulse脉冲Waveform 波形charging time充电时间Parallel并联State状态Chapt 6dielectric constant电介质常数channel 沟道Macroscopic宏观的work function自由能Equilibrium平衡Substrate衬底Interface接触面Permittivity介电常数Thickness 厚度Electrode电极Accumulation积聚Dc直流电Ac交流电space charge空间电荷inversion layer反型层Source源Length长度Conductance 电导率Drain漏Subthreshold次于最低限度的Perpendiculat垂直的Threshold阈值Bulk体积surfacepotential表面势flat-band voltage平能带电压Symbol符号Longitudinal 纵向的Transverse横向的Expression表达式NFET n沟道场效应晶体管Derivation推论/起源Mobility迁移率Constant 常数Bias偏压enhancement-type增强型parallel plate并联板ground 地V ariable变量Modulation调制Scattering散射Collision碰撞kinetic energy动能mean free path 平均自由能mean free time 平均自由时间Parameter参数Integral积分Minimum最小的Maximum 最大的Evaluate赋值dangling bond悬空键electrostatic potential静电势。
ELT-400电磁场曝光级别测量器说明书
Safety Evaluation Within a Magnetic Field EnvironmentDirect evaluation of field exposure incomparison with major standards andregulations such as Directive 2013/35/EU forworkplacesAutomatic exposure evaluation for variouswaveforms in compliance with Weighted RMSand Weighted Peak methodsEliminates the overestimation thatoccasionally occurs with FFT-based evaluationUltra wide frequency range(1 Hz to 400 kHz)Wide measurement range up to 80 mT(dependent on type)IEC/EN 62311 and 62233 standard compliantincluding isotropic 100 cm² and 3 cm² probeThree-axis analog signal outputExposure Level Tester ELT-400t a b l i s h e d1981NSTS 0714-E0205O 1 / 8Subject to change without noticeNSTS 0714-E0205O 2 / 8Subject to change without noticeAPPLICATIONSThe ELT-400 is an innovative exposure level meter for measuring magnetic fields in the workplace and in public spaces. The model is designed for health and safety professionals in industry, the insurance business and service industries.The instrument can simply and precisely handle practically any level measurement required in the low and medium-frequency range. It is comparable to the sound level meters that are commonly used in the assessment of noise at the workplace.Production AreasThe ELT-400 is useful for checking fields caused by various manufacturing plant, including induction heating, melting and hardening equipment. Thanks to its extremely low frequency limit and high power capability, it can also be used to check most magnetic stirrers.Special demands often occur with machinery in production areas where non-sinusoidal signals are common, e.g. in industrial applications that use resistance welding machinery (pulse waveform, phase angle control) with traditional 50/60 Hz systems, as well as in newer medium-frequency switching units.General EnvironmentThe different types of electronic article surveillance systems generate complex fields in public spaces. Most electromagnetic and magneto acoustic gates operate within the frequency range of the ELT-400.EMC Test HouseThe magnetic fields generated by household appliances or other electrical devices have become the focus of increased attention. Some new standards such as IEC/EN 62233 describe how to investigate such products. The ELT-400 is the ideal measuring device when it comes to compliance with these standards. Benefits include the perfectly matched frequency range and implementation of the specified transfer function.The ELT-400 allows to greatly simplify the assessment process. With EXPOSURE STD (Shaped Time Domain) mode, the instrument achieves a new standard in simple but reliable measurement of magnetic fields, whether in straightforward or in very complex field environments. Industrial melting furnaceResistance welding machinery in operation Magneto acoustic gate used for product surveillanceNSTS 0714-E0205O 3 / 8Subject to change without noticeThe easily misinterpreted time-consuming measurements with aspectrum analyzer or scope are rendered obsolete. Detailed knowledgeabout the evaluation procedure or the field waveform or frequency is nolonger needed. The results are reliable, and speed and ease of use aresignificantly better than all traditional methods.BASIC OPERATIONThe ELT-400 covers the wide frequency range of 1 Hz to 400 kHz. Themeasurement range of the ELT-400 is far wider than the reference limitsof common guidelines. The instrument has an external isotropicmagnetic field probe with a 100 cm2cross-sectional area. This issuitable for standards-compliant measurement even in non-homogeneous fields. The ELT-400 has a rugged housing and is easy tooperate using only six buttons. The measurement result and theinstrument settings are clearly displayed on a backlit LCD panel.The optional probe extension cable is specially designed for lowinfluence on the frequency response and sensitivity of the instrument.The cable is a good choice in cases where the probe and instrumentmust be handled separately. Variants of the ELT-400 are available withdifferent operating mode combinations, e.g. “Exposure STD” or “FieldStrength”. Please refer to the Ordering Information section for details.EXPOSURE STD (SHAPED TIME DOMAIN) MODESignal-Shaped-Independent Field EvaluationIn EXPOSURE STD mode, the level of the magnetic (B) field is directlydisplayed as a “Percent of Standard” regardless of the signal shape andfrequency. The numeric result clearly reflects the current situation andthe remaining safety margin. The method employed can be compared tosound level meters that are commonly used to determine noise in theworkplace.The variation with frequency specified in the standard is normalized bymeans of an appropriate filter. Users no longer need to know thefrequency or the frequency-dependent limits. The standard is easilyselected by pressing just one button. Multi-frequency signals are just aseasy to measure as single frequencies.Compliance testing of household appliancesCoupling factors can be determined in compliancewith IEC/EN 62233 by use of the optional 3 cm2 probeNSTS 0714-E0205O 4 / 8Subject to change without noticeThe newer safety standards and guidelines also specify waveform-specific evaluation procedures. For example, stationary sinusoidal and pulsed fields are differentiated. With the ELT-400 the waveform is automatically taken into account. Users no longer need any knowledge about the waveform or the duty cycle. Measurements on pulsed signals are also possible. Different evaluation patterns are occasionally specified in the standard for certain pulse waveforms. These patterns (valid for all imaginable waveforms) are directly handled by EXPOSURE STD mode. This completely eliminates the need to analyze the waveform in the time domain using a scope.Even when faced with pulses that include DC fields, the EXPOSURE STD method provides valuable results. The ELT-400 covers all the signal components down to 1 Hz that are relevant in assessing such a situation.Occasionally both the RMS value and the peak value are critical for assessing exposure in the low-frequency range. Both detector types are provided (Weighted RMS and Weighted Peak), and are simultaneously activated in the default setting. Depending on the incoming signal and standard selected, the most suitable detector is automatically employed at all times. The necessary weighting factors are also taken into account. The detectors may also be selected independently for further interpretation of the signal.Detailed knowledge of the field, the test equipment and other auxiliary conditions is necessary to obtain insight into the degree of exposure when using traditional analysis instruments. The exposure level is derived through extensive calculation. Results can be easily misinterpreted or other problems may occur. For example, FFT spectrum analysis tends to overestimate results for the ICNIRP standard. The ELT-400 continuously monitors the field, and the results are constantly updated. Any change in the field, e.g. due to a power reduction, can be evaluated immediately.Proper evaluation in a personal safety context is achieved quickly and reliably using the STD technique. In Exposure STD mode the result is displayed directly as a percentage of the permitted limitExposure STD automatically sets the prescribeddetector applicable for the selected standardNSTS 0714-E0205O 5 / 8 Subject to change without noticeFIELD STRENGTH MODEBroadband Field Strength MeasurementsIf the field under test is essentially a single frequency component, broadband mode is also a good choice.The ELT-400 provides an ultra wideband, flat frequency response. The measurement range can handle extremely high field strength levels. Both detectors, RMS and Peak, are available for broadband measurement. The field strength result is displayed in “Tesla”.ACTIVE FIELD PROBEThree-Axis Analog Signal OutputFor scientific studies or advanced signal-shape / frequency analysis, a scope or an FFT analyzer can be connected to the analog output. The output signal ensures proper phase within the three axes and covers the full bandwidth of the instrument.The buffered output provides an adequate voltage swing to allow forsimple operation.Broadband measurement in “mT”with RMS detectorThe oscilloscope display shows the welding current when using the analog signal output of ELT-400aa Unless otherwise stated, these specifications apply fort the reference condition: ambient temperature 23±3 °C,relative air humidity 40 % to 60 %, continuous wave signal (CW) and RMS detectionb Depends on type; see Ordering Informationc Detection: Automatic according to selected standard, for IEC/EN 62233 based on ICNIRP limit valuesd Includes flatness, isotropy, absolute and linearity variations (frequency range: 1 Hz to 400 kHz or 10 Hz to 400 kHz).The uncertainty increases at the frequency band limits to ±1 dB based on the nominal frequency response.e For Frequency Range 10 Hz to 400 kHz and 30 Hz to 400 kHz only.NSTS 0714-E0205O 6 / 8Subject to change without noticea Unless otherwise stated, these specifications apply for the reference condition: ambient temperature 23±3 °C,relative air humidity 40 % to 60 %, continuous wave signal (CW) and RMS detectionb Depends on type, see Ordering Informationc Detection: Automatic according to selected standard, for IEC 62233 based on ICNIRP limit valuesd Includes flatness, isotropy, absolute and linearity variations (frequency range: 1 Hz to 400 kHz or 10 Hz to 400 kHz).The uncertainty increases at the frequency band limits to ±1 dB based on the nominal frequency response.e For frequency range 10 Hz to 400 kHz and 30 Hz to 400 kHz only.NSTS 0714-E0205O 7 / 8Subject to change without noticeNSTS 0714-E0205O 8 / 8 Subject to change without notice® Names and Logo are registered trademarks of Narda Safety Test Solutions GmbH and L3 Communications Holdings, Inc. – Trade names are trademarks of the owners.Narda Safety Test Solutions GmbH Sandwiesenstrasse 772793 Pfullingen, Germany Phone: +49 7121 9732 0 Fax: +49 7121 9732 790E-Mail:*************************** Narda Safety Test Solutions 435 Moreland RoadHauppauge, NY 11788, USA Phone: +1 631 231-1700 Fax: +1 631 231-1711E-Mail:*******************Narda Safety Test Solutions Srl Via Leonardo da Vinci, 21/23 20090 Segrate (Milano) - Italy Phone: +39 02 2699871 Fax: +39 02 26998700E-mail:**************************www.narda-sts.it。
AV-1700数字音频放大器用户手册说明书
AV-1700 DIGITAL AMPLIFIER OWNERS MANUAL/techaudio/av-1700DECLARATION OF CONFORMITYWhere applicable Vision products are certified and comply with all known local regulations to a ‘CB Certification’ standard. Vision commits to ensure all products are fully compliant with all applicable certification standards for sale in the EU and other participating countries.The product described in this owner manual is in compliance with RoHS (EU directive2002/95/EC), and WEEE (EU directive 2002/96/EC) standards. This product should be returned to the place of purchase at the end of its useful life for recycling.WARNINGSCAUTION: TO REDUCE THE RISK OF ELECTRIC SHOCK DO NOT REMOVE COVER (OR BACK). NO USER-SERVICEABLE PARTS INSIDE. REFER SERVICING TO QUALIFIEDSERVICE PERSONNEL.The lightning flash with arrowhead symbol, within an equilateral triangle, is intended to alert theuser to the presence of uninsulated “dangerous voltage” within the product’s enclosure that may beof sufficient magnitude to constitute a risk of electric shock to persons.The exclamation point within an equilateral triangle, is intended to alert the user to the presence ofimportant operating and maintenance (servicing) instructions in the literature accompanying theappliance.WARNING: TO REDUCE THE RISK OF FIRE OR ELECTRIC SHOCK, DO NOT EXPOSETHIS APPLIANCE TO RAIN OR MOISTURE.All products are designed and imported into the EU by ‘Vision’ who is wholly owned by ‘Azlan Logistics Ltd.’, Registered in England Nr. 04625566 at Lion House, 4 Pioneer Business Park, Clifton Moor, York, YO30 4GH. WEEE Registration: GD0046SYDECLARATION OF ORIGINAll Vision products are made in the People’s Republic of China (PRC).USE ONLY DOMESTIC AC OUTLETSConnecting the unit to an outlet supplying a higher voltage may create a fire hazard.HANDLE THE POWER CORD WITH CAREDo not disconnect the plug from the AC outlet by pulling the cord; always pull the plug itself. Pulling the cord may damage it. If you do not intend to use your unit for any considerable length of time, unplug the unit. Do not place furniture or other heavy objects on the cord, and try to avoid dropping heavy objects on it. Do not tie a knot in the power cord. Not only could the cord be damaged, but a short circuit could also be caused with a consequent fire hazard. PLACE OF INSTALLATIONAvoid installing this product under the following conditions:• Moist or humid places• Places exposed to direct sunlight or close to heating equipment• Extremely cold locations• Places subject to excessive vibration or dust• Poorly ventilated placesDo not expose this product to dripping or splashing. DO NOT PLACE OBJECTS FILLED WITH LIQUIDS ON OR NEAR THIS PRODUCT!MOVING THE UNITBefore moving the unit, be sure to pull out the power cord from the AC outlet and disconnect the interconnection cords with other units.WARNING SIGNSIf you detect an abnormal smell or smoke, turn this product off immediately and unplug the power cord. Contact your reseller or Vision.PACKAGINGSave all packing material. It is essential for shipping in the event the unit ever needs repair.IF ORIGINAL PACKAGING IS NOT USED TO RETURN THE UNIT TO THE SERVICE CENTRE, DAMAGE IN TRANSIT WILL NOT BE COVERED BY WARRANTY.WATTSThe most consistent standards for measuring watts are “Program Power” and “RMS” because these measure average sustained levels.Amplifier power output changes depending on how many loudspeakers are connected. Professional manufacturers typically quote output based on 8 ohms. Less reputable manufacturers quote at 4 ohms to make their product seem more powerful.This amplifier has an output of:2 x 30w (sometimes referred to as 60w) @ 8 ohms (two loudspeakers connected)2 x 60w (sometimes referred to as 120w) @ 4 ohms (four loudspeakers connected)FRONT AND REAR PANELS1. IR Receiver2. Active Input LED3. Line-level Input 4 (3.5mm Minijack - duplicated on rear panel)4. Line-level Input Volume [Push: Input Select]5. Microphone Input Gain [Push: On/Off]1. Microphone Input (Balanced XLR)2. Line-level Inputs 1-3 (2-Phono)3. Line-level Input 4 (3.5mm Minijack -duplicated on front panel)4. Line-Level Output (2-Phono)5. Loudspeaker Outputs6. RS-232 Control Input7. Fuse8.Figure-8 (C8) Power Input134521236875REMOTE CONTROL1. Power On and Off2. Input Selection3. Tone Reset4. Mute5. Tone Control6. Microphone Input Gain7. Line-level Input Volume1234567INSTALLATION1. CONNECT INPUTS AND OUTPUTS Up to two pairs of loudspeakers can be connected. Ifspeaker cable provided is not long enough use unshielded speaker cable with gauge of 0.75mm or higher.2. CONNECT POWER The amplifier will turn on when power is plugged in the first time.3. TURN POWER ON Then select input and adjust volume as required.Should it become overloaded it will shut down to protect itself. Return operating conditions to safe levels and restart amplifier.MICROPHONE INPUT1. The microphone input provides “Phantom Power” (24v) for condenser microphones such aslectern or boundary (PZM) microphones. 2. The microphone volume can be adjusted independently of the line-level inputs.3. Keep microphone away from loudspeakers to avoid feedback.RS-232 CODESTable 1: Control CodesCodes On Remote Function0x11 ON Bring out of standby0x15 OFF Put into standby0x05 MUTE Mute on/off(Standby activates after 30 minutes of mute) 0x01 INPUT1 Input select 10x09 INPUT2 Input select 20x10 INPUT3 Input select 30x02 INPUT4 Input select 40x08 TREBLE+ Increase treble gain by +1dB0x0D TREBLE- Decrease treble gain by -1dB0x0C BASS+ Increase bass gain by +1dB0x12 BASS- Decrease bass gain by -1Db0x00 RESET Reset tone0x07 MIC+ Mic volume + (also cancels mute if active)0x0B MIC- Mic volume - (also cancels mute if active)0x06 VOL+ Volume + (also cancels mute if active)0x04 VOL- Volume - (also cancels mute if active)Table 2: Return CodesCodes Function Range Remarkworking off standby MUTE Mute status 0 1 0 1 1BD3490FV_SELECT Input select 0 3BD3490FV_GAIN_GET Get master volume 1 28(1C)BD3490FV_B_GAIN_GET Get bass gain 1 15(0F)BD3490FV_T_GAIN_GET Get treble gain 1 15(0F)PT2259_GAIN_GET Get mic gain 1 28(1C)Baud rate: 2400KStop Bit: 1Delivery interval >80msSend 0xA5 (hex code) as verification codeWhen a command is sent twice the amplifier returns the value of table 2TROUBLESHOOTINGIf your system is not operating properly, please refer to the following information. If the problem persists, disconnect from power and contact your AV reseller immediately.Problem CorrectionNo Sound •Turn off and check connections.•Check output level from sources. For example, laptopvolume.Microphone quiet •Some microphones have a gain switch. Consult themanual.No Power light •Check power connections•Abnormal load. Turn power off, disconnect somespeakers and test againDistortion •Input gain too high•Volume too high•Loudspeakers may be worn or damaged Feedback •Turn microphone down, or move away from speakersSound only coming out one side •Adjust balance control•Turn off and switch output connections.If the side changes the amplifier is okay – the fault is with the speakers.•Switch input connections and check input cabling.SPECIFICATIONSAMPLIFIER DIMENSIONS: 220 x 154 x 44mm (wide x deep x tall) not including dials and connectorsAMPLIFIER WEIGHT: 1.2kgCOLOUR: WhiteINPUTS4 x Stereo inputs (via 3 x phono connectors / 1 x 3.5mm minijack)1 x Microphone inputs via balanced XLROUTPUTS1 x Stereo Line-level output via phono connectorsTECHNICAL DETAILS2 x 30w @ 8 ohmsTotal Harmonic Distortion <2%Frequency response (line in): 50Hz~18kHzSignal to noise ratio (line in): 75dBRating input level/Impedance:line in 440~500mV/47kohmsPower consumption (rating condition): <=125WPOWER SUPPLY: 100~240V Internal Power SupplyCOMPLIANCES: RoHS, WEEE & CE compliantACCESSORIES INCLUDED1 x 2-phono to 2-phono cable 2m long1 x 3.5mm to 3.5mm minijack cable 2m long2 x Unshielded Speaker Cable 5m long1 x UK C7 figure-8 power cable 1.8 m long1 x EU C7 figure-8 power cable 1.8 m long1 x AU C7 figure-8 power cable 1.8 m long1 x US C7 figure-8 power cable 1.8 m longWARRANTYThis product comes with a 2-year return to base warranty, effective from the date of purchase. This warranty applies only to the original purchaser and is not transferable. For the avoidance of doubt, this will be taken from the information held by the appointed national distributor at the point of sale. If the product is DOA (dead on arrival), you have 21 days from purchase date to notify the national distributor via your AV reseller. The liability of the manufacturer and its appointed service company is limited to the cost of repair and/or replacement of the faulty unit under warranty, except for death or injury (EU85/374/EEC). This warranty protects you against the following:• Failure of any components, including the power supply.• Damage when the product is first removed from its packaging if reported within 24 hours of purchase.If you find you do have a problem with this product, you should contact the AV reseller you purchased this product from. The original purchaser is responsible for shipment of the product to the manufacturer’s appointed service centre for repair.We will endeavour to return repaired units within 5 working days, however this may not always be possible, in which case it will be returned as soon as practicably possible. In line with our WEEE commitments, the manufacturer endeavours to replace the faulty parts of the product rather than replacing the whole unit. This warranty does not protect this product against faults caused by abuse, misuse, incorrect installation, unstable or faulty power input, which might be caused by ignoring the guidelines set out in this manual.LEGAL DISCLAIMER: Because we are committed to improving our products, the details above may change without prior warning. This User Manual is published without warranty and any improvements or changes to the User Manual necessitated by typographical errors, inaccuracies of current information, or improvements to programs and/or equipment, may be made at any time and without notice. Such changes will be incorporated into new editions of the User Manual.SP-1600 OWNERS MANUAL/techaudio/sp-1600DECLARATION OF CONFORMITYWhere applicable Vision products are certified and comply with all known local regulations to a ‘CB Certification’ standard. Vision commits to ensure all products are fully compliant with all applicable certification standards for sale in the EU and other participating countries.The product described in this owner manual is in compliance with RoHS (EU directive2002/95/EC), and WEEE (EU directive 2002/96/EC) standards. This product should be returned to the place of purchase at the end of its useful life for recycling.WARNINGSCAUTION: TO REDUCE THE RISK OF ELECTRIC SHOCK DO NOT REMOVE COVER (OR BACK). NO USER-SERVICEABLE PARTS INSIDE. REFER SERVICING TO QUALIFIEDSERVICE PERSONNEL.The lightning flash with arrowhead symbol, within an equilateral triangle, is intended to alert theuser to the presence of uninsulated “dangerous voltage” within the product’s enclosure that may beof sufficient magnitude to constitute a risk of electric shock to persons.The exclamation point within an equilateral triangle, is intended to alert the user to the presence ofimportant operating and maintenance (servicing) instructions in the literature accompanying theappliance.WARNING: TO REDUCE THE RISK OF FIRE OR ELECTRIC SHOCK, DO NOT EXPOSETHIS APPLIANCE TO RAIN OR MOISTURE.All products are designed and imported into the EU by ‘Vision’ who is wholly owned by ‘Azlan Logistics Ltd.’, Registered in England Nr. 04625566 at Lion House, 4 Pioneer Business Park, Clifton Moor, York, YO30 4GH. WEEE Registration: GD0046SYDECLARATION OF ORIGINAll Vision products are made in the People’s Republic of China (PRC).PLACE OF INSTALLATIONAvoid installing this product under the following conditions: • Moist or humid places• Places exposed to direct sunlight or close to heating equipment • Extremely cold locations• Places subject to excessive vibration or dust • Poorly ventilated placesDo not expose this product to dripping or splashing. DO NOT PLACE OBJECTS FILLED WITH LIQUIDS ON OR NEAR THIS PRODUCT!PACKAGINGSave all packing material. It is essential for shipping in the event the unit ever needs repair. POWER HANDLINGPower rating with regards to loudspeakers denotes how much power the loudspeaker can handling for a sustained period of time without distortion. These speakers are rated to accept up to 50 watts RMS.WATTSThe most consistent standards for measuring watts are “Program Power” and “RMS” because these measure average sustained levels. Any low impedance amplifiers without an output from 2 x 10w to 2 x 70w (@ 8 ohms) are suitable for these speakers.INSTALLATION1. FIT BRACKETS TO WALL Position brackets over load-bearing studs and use appropriatescrews to fix brackets to wall. Ensure they are plumb2. TERMINATE CABLES TO MOUNTS Connect speaker cables from amplifier to speaker brackets.3. FIT LOUDSPEAKERS TO MOUNTS Fit loudspeakers to brackets from above. When in place they will click into place and cannot be removed.TO REMOVE LOUDSPEAKER1. Squeeze the two tabs together at top/rear of loudspeakers.2.Lift loudspeakers up and off.TROUBLESHOOTINGIf your system is not operating properly, please refer to the following information. If the problem persists, disconnect from power and contact your AV reseller immediately.Problem CorrectionSound only coming out one side •Turn off amplifier and switch output connections. If the side changes the amplifier is okay and the fault is with one of the loudspeakers.•Switch input connections and check input cabling.Sound very quiet •Have you used unshielded speaker cables? Use cable withgauge of 0.75mm or higher. Note: Phono or minijack cable isshielded and is not appropriate.SPECIFICATIONSPRODUCT DIMENSIONS: 160 x 150 x 240 mm (length x width x height for each speaker) PRODUCT WEIGHT: 3.3 kg (per pair)CONSTRUCTION MATERIAL: 9mm MDFCOLOUR: WhitePOWER HANDLING: 50w watts (RMS)TECHNICAL DETAILS:Woofer: 4″Tweeter: 1″ SilkInput / Output Terminals: Phoenix connectorsOutput Impedance: 8 ohmsSensitivity: 85dB (1w/1m)Frequency response: 75Hz-20kHzCOMPLIANCE RoHS & WEEE CompliantACCESSORIES INCLUDED:2 x Wall bracketsWARRANTYThis product comes with a 2-year return to base warranty, effective from the date of purchase. This warranty applies only to the original purchaser and is not transferable. For the avoidance of doubt, this will be taken from the information held by the appointed national distributor at the point of sale. If the product is DOA (dead on arrival), you have 21 days from purchase date to notify the national distributor via your AV reseller. The liability of the manufacturer and its appointed service company is limited to the cost of repair and/or replacement of the faulty unit under warranty, except for death or injury (EU85/374/EEC). This warranty protects you against the following:• Failure of any components, including the power supply.• Damage when the product is first removed from its packaging if reported within 24 hours of purchase.If you find you do have a problem with this product, you should contact the AV reseller you purchased this product from. The original purchaser is responsible for shipment of the product to the manufacturer’s appointed service centre for repair.We will endeavour to return repaired units within 5 working days, however this may not always be possible, in which case it will be returned as soon as practicably possible. In line with our WEEE commitments, the manufacturer endeavours to replace the faulty parts of the product rather than replacing the whole unit. This warranty does not protect this product against faults caused by abuse, misuse, incorrect installation, unstable or faulty power input, which might be caused by ignoring the guidelines set out in this manual.LEGAL DISCLAIMER: Because we are committed to improving our products, the details above may change without prior warning. This User Manual is published without warranty and any improvements or changes to the User Manual necessitated by typographical errors, inaccuracies of current information, or improvements to programs and/or equipment, may be made at any time and without notice. Such changes will be incorporated into new editions of the User Manual.。
IEC Flicker Impedance M6204 电源闪烁阻抗器M6204说明书
The M6204 unit provides the requisite lumped impedance between the AC Power Source and the Unit Under Test (UUT) used to test for flicker compliance to IEC 61000-3-3. Designed to meet IEC 60725 - Consideration of reference impedances and public supply network impedances for use in determining the disturbance characteristics of electrical equipment having a rated current ≤75 A per phase – the M6204 simulates the typical public utility impedance characteristics found in most European countries in order to provide a common flicker measurement reference.IEC Flicker ImpedanceStandard Features:•Three Phase Flicker Impedance Network Supports both single and three phase flicker testing of UUT’s up to 16Arms per phase•Z ref Impedances Values per IEC 60725Line Impedance: 0.24 Ω+ 0.15 j Ω Neutral Impedance: 0.16 Ω + 0.10j Ω•Compatible with 360AMXT and 3120AMXT AC Source ModelsIEC Impedance is matched to AC Source Output impedance for exact IEC 60725 matching•High Qualify Impedance Components Used Low Thermal Drift and Forced Air Cooling while under Load Ensures Constant Flicker Impedance during Long Flicker Test Runs •Dual Connectors on Rear PanelMultiple Terminal Blocks Provided for Power, Voltage Sense and Power Analyzer Connections Simplifies Connections •Standard 19” Rack Mount EnclosureFits easily on Lab Bench, on top of the AC Power Source used or in an Instrument CabinetStandards Supported:• IEC 61000-3-3 / EN 61000-3-3• IEC 61000-4-13 / EN 61000-4-13• IEC 61000-4-27/ EN 61000-4-27•IEC 60725The Leader in AC Power TechnologyFREQUENCY CONVERSION R & D MANUFACTURING AEROSPACE MILITARY CUSTOMA separate impedance network in the Neutral leg ensures full compliance to IEC 61000-3-3 and IEC 60725 even under imbalanced three phase load conditions. The same three phase Impedance network is also fully capable of supporting single phase Flicker test. In this case, the Phase A impedance and Neutral impedance combine together to provide the required Z ref = 0.40 Ω + 0.25 j Ω single phase impedance.Three Phase and Single Phase UUT TestingThe use of high quality components with low thermal drift and high saturation resistance ensures a stable impedance network throughout the entire flicker test duration – typically two hours. This is augmented by efficient yet quiet forced air cooling. Testing to the full 16 Arms per phase as required for products that fall under the IEC 61000-3-3 Flicker Standard is fully supported by this lumped impedance with ample margin for temporary overload conditions.Full 16 Arms per Phase CapableAC Source MatchedAn early pioneer in the development solid-state power conversion equipment, Pacific Power Source continues to develop, manufacture, and market both linear and high-performance PWM AC Power Sources. Pacific’s reputation as a market and technology leader is best demonstrated by its continuing investments in both research and development and world-wide customer support. With corpo-rate owned offices in the United States, Germany, the United Kingdom, and China, local personalized support is always available.12KVA Three Phase 16 Arms/Phase IEC 60725 CompliantThe M6204 impedance is factory calibrated and matched to the AMX AC Power Source Model it is used with. This ensures that the combination of AC Source Output Impedance and Lumped Impedance adds up to the requisite IEC 60725 Impedance values. This prevents unwanted system level errors that can occur when the IEC Flicker Impedance is sourced from a different vendor as the AC Power Source.ApplicationsThe M6204 IEC Flicker Impedance provides the required lumped impedance to create a Flicker test system consisting of a Programmable AC Power Source, an IEC compliant Flicker Meter or Power Analyzer with Flicker measurement mode and the required lumped impedance between the AC Source and the UUT. The IEC Flicker standard is based on analyzing voltage fluctuations caused by changes in UUT load current working against a reference impedance (Z ref ). Z ref was cho-sen to simulate the typical public utility impedance found in Europe. An incorrect or out of tolerance Flicker Impedance can lead to significant errors in Flicker measurement results.Flicker TestingFor single phase applications, the Phase A and Neutral impedance combine to provide the required single phase Z ref of Z = 0.40 + j0.25 Ω so the same M6204 Impedance can be used for either single or three phase Flicker testing.Phase Impedances: Z L = 0.24 + j0.15 Ω each phase Neutral Impedance:Z N = 0.16 + j0.10 ΩOther IEC Test StandardsThe same IEC Flicker impedance is also called out to be used during other IEC Tests. Examples of some of these IEC Test Standards are shown in the table below.The M6204 Impedance is compatible with these IEC 61000-4 Immunity test standards.High QualityBenefits•The M6204 IEC Flicker Impedance is constructed of high quality resistive and inductive components sized to handle load currents up to 16Arms with ease. Proper heat sinking and forced airflow ensure stable operation over a wide temperature range, even under full load conditions that can persist for many hours. The same impedance module can be used for either Single phase or Three phase UUT Flicker testing without the need to rewire or re-configure.Lumped Impedance•Compared to “synthesized or electronic” impedance solutions as employed by some manufacturers, the M6204 pro-vides the required separate Neutral Impedance which is not available on AC Sources with synthesized impedance. This ensures accurate Flicker measurement results under all circumstances, including unbalanced three phase load conditions caused by the UUT.•Furthermore, synthesized impedance circuits often have a limited frequency range and may closely approximate the required impedance at 50Hz but will not accurately simulate the effect of higher current harmonic frequency components present in UUT current for non-linear loads. A lumped impedance like the M6204 does not have such a frequency dependency and will correctly respond to current harmonics.AC Source Matching•Since most AC Power Sources have a non-zero output impedance, adding the lumped impedance to an AC Source will have a cumulative effect resulting in an overall combined output impedance to the UUT that will exceed the ac-tual Z ref value. This will result in overstated Flicker measurement results that may lead to an UUT not passing Flicker test where it otherwise would have.•By obtaining both the AC Power Source and the IEC Flicker Impedance from the same manufacturer, you can be sure both are matched. This means the lumped impedance as well as the AC Source output impedance is adjusted to ensure the combined impedance is within Z ref tolerances.Requirements for the IEC Flicker Impedance when testing UUT’s with Currents up to 75 Arms per phase are covered by IEC Standard 60725, currently at revision 3.0. For UUT’s with phase currents of 16 Arms per phase or less (either single or three phase UUT’s), the required Z ref is defined as a combination of resistive and inductive components with the fol-lowing nominal values:RatingsInput Power Requirments1 If a NON Pacific Power Source AC Power Source model is used with the M6204, an external 24Vdc supply capable of supplying 280 mAdc @ 24Vdc is required to oper-ate the Fan.© 2013 Pacific Power Source, Inc. Subject to change without notice.Order ExampleM6204• 3 Phase, 12KVA, IEC Lumped Impedance NetworkTypical Delivery ItemsShip Kit:• User Manual17692 Fitch, Irvine, CA 92614 USAPhone: +1 949.251.1800 Fax: +1 949.756.0756 T oll Free: 800.854.2433E-mail:**********************#4DS-IECIMP Rev062013Ordering InformationAvailable ModelsM6204M6204 IEC Flicker Impedance front and rear views。
EM266(DT266) SERIES DIGITAL CLAMP METER 说明书
OWNERS MANUALRead this owners manual thoroughly before useEM266(DT266) SERIES DIGITAL CLAMP METERWARRANTYThis instrument is warranted to be free from defects in material and workmanship for a period of one year. Any instrument found defective within one year from the delivery date and returned to the factory with transportation charges prepaid, will be repaired, adjusted, or replaced at no charge to the original purchaser. This warranty does not cover expandable items such as battery.If the defect has been caused by a misuse or abnormal operating conditions, the repair will be billed at a nominal cost.SAFETY INFORMATIONThe digital multimeter has been designed according to IEC-61010 concerning electronic measuring instruments with a measurement category (CAT II ) and pollution degree 2.ELECTRICAL SYMBOLSAlternating CurrentDirect CurrentCaution, risk of danger, refer to the operating manualbefore use.Caution, risk of electric shock.Earth (ground) TerminalFuseConforms to European Union directivesThe equipment is protected throughout by doubleinsulation or reinforced insulation.A WARNINGTo avoid possible electric shock or personal injury, follow these guidelines:• Do not use the meter if it is damaged. Before you use the meter, inspect the case. Pay particular attention to the insulationsurrounding the connectors.• Inspect the test leads for damaged insulation or exposed metal.Check the test leads for continuity. Replace damaged test leads before you use the meter.• Do not use the meter if it operates abnormally. Protection may be impaired. When in doubt, have the meter serviced.• Do not operate the meter around explosive gas, vapor, or dust. • To avoid damages to the instrument, do not exceed the maximum limits of the input values shown on the meter.• Before use, verify the meter's operation by measuring a known voltage.• When servicing the meter, use only specified replacement parts. • Use with caution when working above 30V AC RMS, 42V peak, or 60V DC. Such voltages pose a shock hazard.• When using the probes, keep your fingers behind the finger guards on the probes.• Connect the common test lead before you connect the live test lead. When you disconnect test leads, disconnect the live test lead first.• Remove the test leads from the meter before you open the battery door.• Do not operate the meter with the battery door or portions of thecover removed or loosened.•To avoid false readings, which could lead to possible electric shock or personal injury, replace the batteries as soon as the low battery indicator (" ") appears.•When an input terminal is connected to dangerous live potential it is to be noted that this potential at all other terminals can occur! •After you press the Data Hold button to enter Data Hold mode, caution must be used because hazardous voltage may be present. •CATII-Measurement Category II is for measurements performed on circuits directly connected to low voltage installation.(Examples are measurements on household appliances, portable tools and similar equipments.) Do not use the meter formeasurements within Measurement Categories III and IV.CAUTIONTo avoid possible damage to the meter or to the equipment under test, follow these guidelines:•Disconnect circuit power and discharge all capacitors beforetesting resistance, insulation resistance, continuity or diode. •Use the proper terminals, function, and range for your easurements. •Never measure current while the test leads are inserted into the input jacks.•Before rotating the range switch to change functions, disconnect test leads from the circuit under test.•Remove test leads from the meter before opening the meter case.FRONT PANEL DESCRIPTION1. Transformer JawsPick up the AC current flowing through the conductor.2. "DATA HOLD" ButtonPress this button to hold the present reading on the display, press again to release the display.For model 260D, this button is used for holding peak.3. Functio n / Range Switc hFunction / Range switch for selecting measuremen t functio n and range.4. Displa y3 1/2 digits LCD, Max. reading 1999.5. Drop-proof Wrist Strap:Prevent the instrumen t from slipping off the hand while in use.6. "EXT" Jac kPlug-in connecto r for the banana plug "EXT" from the extensional insulation resistance tester unit.7. "COM" Jac kPlug-in connecto r for the black test lead while measuring voltage, resistanc e and continuity; and for connectin g the banana plug "COM" from the insulation tester unit while measuring insulation resistance.8. V/ΩInput Jac kPlug-i n connecto r for the red test lead while measuring voltage, resistanc e and continuity; and for connectin g the banana plug "V/Ω" from the insulation tester unit while measuring insulation resistance.9. Trigge rPress the level to open the transforme r jaws; when the finger pressing on the level is released, the jaws will close again.MODEL S AND FUNCTIONSACV ACA DCV ΩInsulationTEM PF200mV200V750V20A200A1000A200mV2V20V200V1000V200Ω2kΩ20kΩ200kΩ2MΩ20MΩ-2000MΩ°C, °F2kHz1mA, 2.8V<50Ω266********266C***************266C+****************260D*****************266F*****************266F T***************INTRODUCTIONThe meter is a portable, 3-1/2 digits LCD clamp meter with insulation test function (with optional 500V insulation tester unit), designed for being used by electricians, technicians, serviceman and hobbyists who need an instrument that is accurate, reliable, and always ready for use. It is powered by a standard 9V battery, and can provide150-200 operating hours, which depends on the type of battery and using conditions. It has rugged structure design, good feeling held in operator's hand and convenient use.TECHNICAL SPECIFICATIONSThe following specifications assume a l-year calibration cycle and operating conditions of temperature scale of 18°C to 28°C (64°F to 82°F) with relative humidity up to 80% unless otherwise noted. Accuracy specifications take the form of:± [(% of Reading)+(Number of Least Significant Digits)]Range 20A 200A1000A Resolution10mA100mA1AAccuracy(50Hz - 60Hz)+ (2.5% + 8)+ (2.5% + 5)+ (2.5% + 5) for 800A and belowIf >800A, the reading is only for reference.AC CurrentFrequency response: 50~60HzIndication: Average (rms of sine wave) Overload protection: 1200A within 60seconds, Jaw opening: 2"(5cm)Frequency range: 45 - 400Hz I nput impedance: 9MΩ Indication: Average (rms of sine wave) Overload protection: 200mV range: 250V AC;the other ranges: 750V rms ACOverload protection: 200mV range: 250V AC;the other ranges: 1000V DC/AC peak. Input impedance: 9MΩInsulation Test (with optional 500V insulation tester unit)AC VoltageDC VoltageRange 20MΩ 2000MΩResolution 10kΩ 1MΩAccuracy +(2% + 2 )500MΩ: +(4% + 2) >500MΩ: +(5%+ 2)Range 200mV 200V 750VResolution 0.1mV 100mV 1VAccuracy +(1.2% + 5) +(2.0% + 5)Range 200mV 2V 20V 200V 1000V| Resolution0.1mV 1mV 10mV 100mV1VAccuracy+(0.8% + 3) +(1.2%+ 5)ResistanceUse K type thermocoupleNote:1. Accuracy does not include error of the thermocouple probe.2. Accuracy specification assumes ambient temperature is stableto ±1°C. For ambient temperature changes of ±5ic, ratedaccuracy applies after 1 hour.Range 2 kHz Resolution1HzAccuracy+(1.5%+ 5)Range 200Ω 2kΩ 20 kΩ 200 kΩ 2MΩ Resolution0.1Ω1Ω10Ω100Ω1kΩAccuracy+(1.2% + 5)+(1.0% +3)+(1.5%+ 5)Range 0°C - 750°C 32°F~1382°F Resolution1°C1°FAccuracy0^-400^: ±(1%+5)400r~750lC: ±(2%+5)32T-752T: ±(1%+9)752T-1382T: ±(2%+9)TemperatureOverload protection: 250V rms ACDiode and Continuity TestGENERAL SPECIFICATIONSDisplay: 3 1/2-digit LCD, with a max. reading of 1999Overrange Indication: only figure" 1 " displayed on the LCD Negative Polarity Indication: " - " displayed automatically Sampling Rate: about 2-3 times/secOperating Temperature: 0°C~40°C, <75%RHStorage Temperature: -10°C~50°C, <85%RHBattery: 9V, 6F22 or equivalentLow Battery Indication: " " shown on the displayDimensions: 240 X 102 X 47mmWeight: about 300g (including battery) 10Range DescriptionThe approx. forward voltage drop of the diode wil Ibe displayed on the LCD.When the resistance is less than about 50Ω, the built-inbuzzerwill sound.OPERATING INSTRUCTIO NAC Curren t Measuremen t1. Make sure the "Data Hold" switch is not pressed.2. Set the Function/Rang e switch to the desired ACA range.3. Press the trigge r to open the transforme r jaws and clamp oneconducto r only. It is impossible to make measurement s when two or three conductor s are clamped at the same time.4. The value displayed on the LCD is the AC current flowing throug hthe conductor.Insulatio n Resistanc e Test1. Set the rotary switch of the clamp meter to the 2000MΩrange.In this condition, it is normal that the reading is unstable.2. Insert the three banana plugs V/Q, COM, EX T of the insulationtester unit to the correspondin g V/Q, COM, EX T input jacks on the clamp meter.3. Set the range switch of the insulation tester unit to the 2000MΩposition.4. Connect the test leads from the insulation tester unit to theapplianc e to be tested.5. Set the insulation tester Power switch to the "ON" position.6. Push the " 500V" button, the red LE D "500V" will light. Thereading on the LCD of the clamp meter is the insulation resistance value; if the reading is below 19MΩ, set the rotary switch of the the clamp meter and the range switch of the insulation tester unit to 20MΩ range position to increase the measuremen t accuracy.117. If the insulation tester unit is not used, the power switch mustset to OFF position. And the test leads must be removed from the input jacks; this can extend the battery life and prevent electrical shock hazard.DC Voltage Measurement1. Connect the red test lead to the "V/Ω" jack and the black testlead to the "COM" jack.2. Set the rotary switch to the desired DCV range. If the voltage tobe measured is not known beforehand, set the range switch to the highest range and then turn down range by range untilsatisfactory resolution is obtained.3. Connect the test leads to the source or load to be measured.4. Read the voltage value displayed on the LCD along with thepolarity of the red test lead.AC Voltage Measurement1. Connect the red test lead to the "V/Ω" jack and the black testlead to the "COM" jack.2. Set the rotary switch to the desired ACV range. If the voltage tobe measured is not known beforehand, set the range switch to the highest range and then turn down range by range untilsatisfactory resolution is obtained.3. Connect the test leads to the source or load to be measured.4. Read the voltage value displayed on the LCD.12Resistanc e Measuremen t1. Connect the red test lead to the "V/Ω" jack and the black testlead to the "COM" jack.2. Set the rotary switch to the desired Ω. range.3.Connect the test leads to the resisto r to be measured andread the value displayed on the LCD.Note:For resistance about 1 Mfi and above, the meter may take a few second s to stabilize. This is normal for high resistance readings.Diode Test1. Connect the red test lead to the "V/Ω" jack and the black testlead to the "COM" jack. (The polarity of the red test lead ispositive"+".)2. Set the rotary switch to range.3. Connect the red test lead to the anode of the diode to be testedand the black test lead to the cathode of the diode. The approximat e forwar d voltage drop of the diode will be displayed on the LCD.If the connectio n is reversed, only figure "1" will be shown.13Audible Continuity Test1. Connect the red test lead to the "V/Ω" jack and the black testlead to the "COM" jack.2. Set the rotary switch to range.3. Connect the test leads to the two terminals of the circuit to betested. If the resistance Is less than about 50Ω, the built-in buzzer will sound.Temperature MeasurementNoteTo avoid possible damage to the meter or otherequipment, remember that while the meter is ratedfor 0°C to +750°C and 32°F to 1382°F, the K TypeThermocouple provided with the meter is rated to250°C. For temperatures out of that range, use ahigher rated thermocouple.The K Type Thermocouple provided with the meteris a present, it is not professional and can only beused for non-critical reference measurements.For accurate measurements, use a professionalthermocouple.1. Connect the K type thermocouple to the correspondingmeasurement socket.2. Set the rotary switch to the desired temperature range.3. Touch the K type thermocouple to the object to be measured.4. Wait a while, read the temperature value displayed on the LCD.14Frequenc y Measuremen t1. Connect the red test lead to the "V/Ω" jack and the black testlead to the "COM" jack.2. Set the rotary switch to the frequenc y (2kHz) range.Connect the test leads to the source or load to be measured. 3. Read the frequenc y value displayed on the LCD.MAINTENANC E•Before opening the case, always disconnec t the test leads from all live circuits.•Periodically wipe the case with a damp cloth and mild detergent.Do not use abrasives or solvents.BATTERY REPLACEMEN TWhen the symbol" " appears on the display, it shows that the batter y should be replaced. To replace the battery, open the batter y door, replace the exhausted battery with a new one of the same type, reinstall the battery door. Some models of this series use screws for fastening the door, please install the screws.15ACCESSORIESInstruction manual: 1 copyTest leads: 1 pairNote:In normal condition, the insulation tester is not provided. If needed, you can buy from our company.PRESENTK Type Thermocouple: 1 piece (only 266C, 266C+, 266FT) NOTE1. This manual is subject to change without notice.2. Our company will not take the other responsibilities for any loss.3. The content of this manual can not be used as the reason to use the meter for any special applications.DISPOSAL OF THIS ARTICLEDear Customer, If you at some point intend to dispose of this article, then please keep in mind that many of its components consist of valuable materials, which can be recycled. Please do not discharge it in the garbage bin, but check with your local council for recycling facilities in your area.16 。
海洋与内陆水体高光谱遥感
水体成分的固有光学特性与模型
水体各成分的后向散射
遥感获得是水体后向散射的信息,因此水体成分的后向散射 特性对遥感反演模型的建立具有关键性的作用
水体成分吸收特征
纯(海)水(w)、及典型的叶绿素(C)、悬浮 泥沙(X)、黄色物质(Y)的光谱吸收特征
二类水体固有光学特性
国际上普遍认为,二类水体固有光学特性与 大洋水体的主要差异在: (1)区域性悬浮泥沙的吸收与散射特性; (2)在高泥沙含量区的叶绿素吸收特性与大洋 水体的叶绿素有一定差异; (3)黄色物质光谱吸收特性也有很强的陆源变 化,主要体现在式(3.7)中e指数的S上。 aY()=aY(0)exp[-S(-0)]
6)当水体十分浑浊时,412nm左右篮波 段值在一个很小的范围内变化;
7)赤潮水体光谱与正常光谱有很大的区别。
水色要素反演
(1)经验模型,主要基于离水辐亮度与某一成 分之间的统计关系;
(2)半分析模型, 借助于固有光学量与成分之间 的物理关系和表观量与固有光学量之间的 经验关系,导出遥感量与水体成分之间的 关系;
• 固有光学量(Inherent Optical Properties, IOPs)是指只与 水体成分有关而不随光照条件变化而变化的量,包括:
(1)水分子的吸收系数aw、散射系数bw、散射相函数w; (2)Chl-a的吸收系数ac、单位吸收系数(Specific absorption coef.),散射系数bc、单位散射系数、后向散 射系数bb、前向散射系数bf、散射相函数; (3)黄色物质的单位吸收系数
5. TDI技术扫描成像,没有类似MODIS、HY-1 COCTS上 的多元并扫条带。
水色遥感定量化的要求及其定标/检验
海洋遥感应用对定量精度有严格的要求,以美国的SeaWiFS的精度目标为 例(一类水体 Case-I water): 叶绿素浓度反演误差 <35% 离水辐亮度绝对误差 <5% 相对误差 <1% 按照上述要求,可导出遥感器、大气算法、现场仪器的不确定度 (uncertainty)为: *遥感器辐射定标 <5%(Hooker et al 1992, p1) 相对误差 <1% 波段之间 <5% *大气修正算法 <5%(Gordon & Wang 1994, p445) *现场测量仪器定标 <3%(Mueller & Austin 1995, p14) 相对误差 <1% *现场数据分析处理 <5%(Siegel et al 1995)
等响曲线
这种现象称为弗莱彻—芒森效应。把许多听觉正常的人的这种效应的特征进行平均,所得到的就是著名的弗莱彻-芒森等响度曲线,该曲线反映了人耳对声音强度的心理和生理因素的主观感觉曲线。
等响度曲线,即把不同频率和不同强度的纯音和1kHz的纯音做等响度的配对。把1kHz的某纯音的强度值作为在其等响度曲线上别的频率的纯音的响度级。
等响曲线
对於纯音来说,等响曲线表明了响度与频率的关系。人耳对不同频率的声音闻阈和痛阈不一样,灵敏度也不一样.例如,200Hz的30dB的声音和1kHz的10dB的声音在人耳听起来具有相同的响度,这就是所谓的“等响”不同的频率,具有不同的强度,但它们确有同等的响度级,单位是方(phon),如40方或60方等响曲线。在低强度时,等响线的图形类似於听阈曲线。因此,如果声音的强度相等,那麼中频声听起来会比低频或高频声更响一些。随著响度级或声压级的增加,等响曲线渐趋於平直。也就是说,不同频率的响度级的增长速度是不同的,低频声的响度级随声音强度的增长比中频声要快,这表明在高声强时,人耳对低频声变得比较敏感了。一个由线谱或连续谱组成的复合声,一般来讲,它所包括的频率范围越宽,其声音也越响,尽管这时所包含的总声能保持不变。研究证明,响度与频宽的这种关系,只有当频宽超过某一最小值即临界带宽之后才会产生。而在其临界带宽之内,响度基本上不依赖於频宽,这种效应通常叫做响度综合,声音的响度也与声音持续作用的时间有关。在一定范围内(大约15~150毫秒),持续时间越长声音也越响。超过这个范围,这种关系便不存在了。
TD-SCDMA和WCDMA区别
• 核心网由三部分构成:电路域、分组域和广播域。核心网内各网 络实体及其接口定义与WCDMA的对应部分完全一致。 • 接入网和核心网的接口为Iu接口,遵循3GPP 25.41x 规范的规定。 • 接入网和UE之间的空中接口为Uu接口,遵循3GPP 25.1xx、 25.2xx、25.3xx 的规定。
Iub接口上无线网络层控制面协议(NBAP)的差别
Iub接口上无线网络层用户面协议(Iub FP)的差别
27
Iub接口上无线网络逻辑资源中公共资源的差异
C ell C e l l-Id 1
[F D D 0-i] [T D D 0-1 ]
1
P C P IC H C PC I d
0 -m
S C P IC H C PC I d
U SCH FP
CPCH FP
R a d io N e tw o rk L a yer
N ode B A p p lic a tio n P a r t (N B A P )
D CH FP
ALCAP Q .2 6 3 0 .2
Q .2 1 5 0 .2
T ra n s p o rt L a yer
S S C F-U N I SSCO P A A L T yp e 5
•1 • 60 •6 • 2Mbps • 0.4
TD-SCDMA •1.6MHZ,可同时用于上 行和下行的传输,非对称 性/对称都能够传输
•1 • 24 • 15 • 2Mbps • 1.25
频率复用系数
•1
每载波同时工作 • 30 信道数 频谱利用率(话音) • 12 最大数据传输速率 频谱利用率(数据, Mbps/MHz/cell ) • 2.5Mbps • 1.0
PROLOOP FSMplus 场强计说明书
PLA FSMP Field Strength MeterWe would like to congratulate you on your purchase of a PROLOOP FSMplus Field Strength Meter. You have chosen a modern and reliable system. Please make sure to read the operating instructions carefully before using this equipment. They will provide you with important information on the safety, use and operation of the device. The PROLOOP FSMplus is an ideal solution for measuring, comparing and starting up an inductionloop system according to the requirements of the IEC60118-4 Norm. The ergonomically designed, hand-held meter has two calibrated measuring functions and two calibrated measuring functions and two settings for the evaluation of background noise and the magnetic strength. You can use the PROLOOP FSMplus headphone jack to listen to and test the loop signal. The PROLOOP FSMplus comes complete with the batteries required and an audio CD with special test signals. The CD contains different sine test signals in the 100 Hz to 6 kHz range.Safety InstructionsUse “AA/LR6” batteries only. Do not expose the meter to water in any way. Should any water penetrate into the enclosure, it may destroy the electronics. Do not store the de-vice outside. T o clean the meter, wipe it carefully with a dry cloth – never use any type of chemicals or water.(1) Color-coded display of the field strength (2) On/off indicator(3) Battery-low indicator (4) On/off switchSwitch setting for the measure-ment range selection switch (6)(5) Filter selection switch(6) Measurement range selection switch (7) Headphone jack(8) Volume control for the headphones1. Overview of the connection jacks and operating elements2. Measurement functions(-20dB) measurement range for background noiseIncreases the sensitivity of the deviceand is used to detect magnetic interference fields. This function can be used to determine the crosstalk ofthe loops. Measurement range from -43 to -12 dB.(0dB) measurement range for magnetic field strengthA broadband measurement range used to check the field strength that the induction loop emits.Filter AEvaluates the values measured on the basis of the listening curve of the human ear.Filter NormEvaluates all the values measured in the same way on the basis of their physical values.3. Using the meterBefore you begin with the calibration, look for a reference point within your loop (usually in the middle of the installed loop). Hold the PROLOOP FSMplus perfectly perpendicular to the floor. Be sure to also make a note of the height at which you hold the device. This depends on the application.Typical values are e.g. 1.20 m(sitting) or 1.70 m (standing).4. Step-by-step instructionsUse the CD with the reference signal that is enclosed with the device and perform the following steps to perfectly adjust the loop to your needs.To ensure exact measurements, always hold the PROLOOP FSMplus perpendicular to the floor.M a s u r e m e n tS i g n a l R e q u i r e dM e a s u r e m e n t r a n g e a n d fi l t e r s e l e c t i o n s w i t c hC o m p a r i s o n p o i n t R e f e r e n c e m e a s u r e m e n t sS t e p 1B a s i c s e t i n g A m p l i fi e r o ffF S M p l u s o ff F S M p l u s o ff N o n e A l l c o n t r o l s t u r n e d a s f a r t o t h e l e f t a s p o s s i b l eS t e p 2B a c k g r o u n d n o i s eA m p l i fi e r o ff -20 dB AS e v e r a l p o i n t s i n s i d e t h e l o o pM a x i m u m < -30 d B I d e a l < -43 d BS t e p 3M a g n e t i c F i e l d S t r e n g t hC D t r a c k 30 d B N o r m L o o p p o w e r0 d B +-3 d B a t 1000 H zS t e p 4F r e q u e n c y r e s p o n s eC D t r a c k 30 d B N o r m T r e b l eM a x d e v i a t i o n -3 t o +3 d BS t e p 5M a g n e t i c fi e l d s t r e n g t h a g a i nC D t r a c k 30 d B N o r m A d j u s t l o o p p o w e r0 d B +-3 d B a t 1000 H zS t e p 6C u r r e n t s i g n a l e .g . m i c r o p h o n e0 d B N o r m L i n e I N c o n t r o l-3 t o +3 d B i n t h e p e a k s5. Maintenance and careThe PROLOOP FSMplus does not require any maintenance. If theunit does become dirty, simply wipe it clean with a soft, damp cloth. Never use spirits, thinners or other organic solvents. Do not set upthe PROLOOP FSMplus where it will be exposed to full sunlight for long periods. In addition, it must be protected against excessive heat, moisture and severe mechanical shocks.Note: This product is not protected against splash water. Do not place any containers filled with water, such as flower vases, or anything with an open flame, such as a lit candle, on or near the product.6. WarrantyThe PROLOOP FSMplus is a very reliable product. Should a malfunction occur despite the unit having been set up and operated correctly, please contact your dealer or the manufacturer directly.This warranty covers the repair of the product and returning it to you free of charge. It is essential that you send in the product in its original packaging, so do not throw the packaging away. The warranty does not apply to damage caused by incorrect handling or attempts to repair the unit by people not authorised to do so (destruction of the seal on the unit). Repairs will only be carried out under warranty if the completed warranty card is returned accompanied by a copy of the dealer‘s invoice/till receipt. Always specify the product number in any event.7. DisposalDisposal off used electric and electronic units countries with a separate collection system). The symbol on the product or the packaging indicates that this product is not to be handled as ordinary household waste but has to be returned to a collecting point for the recycling of electric and electronic units. You protect the environment and health of your fellow men by the correct disposal of this products. Environment and health are endangered by a faulty disposal. Material recycling helps to reduce the consumption of raw material. You will receive further information on the recycling of this product from your local community, your communal disposal company or your local dealer.8. SpecificationsScale calibration:Operating mode -20 dB -20 dB = 0.043 A/m Operating mode 0 dB 0 dB = 0.4 A/mType of measurement True RMS 125 msFrequency response:Filter A / Flat30 Hz...500 Hz -3 dB...-4 dB500 Hz...2500 Hz +/-0.25 dB2500 Hz…10kHz +/-3 dBOutputs:Display Color-coded LED dot display Headphones 3.5 mm cinchPower supply: Batteries 2x AAIndicator lights LEDService life 100 hDimensions (WxHxD) 83 x 126 x 35 mm Weight approx. 300 gThis device satisfies the following EU directives:- 2002/95/EG RoHS directive - 2004/108/EG EMC directive- 2002/96/EG WEEE directive - 2006/95/EG Low voltage directiveCompliance with the directives listed above is confirmed by the CE seal on the device. CE compliance declarations are available on the Internet at . Technical specifications subject to change without notice.10300 Valley View Rd · Eden Prairie, MN 55344800-328-6190 / 952-943-2252 · FAX: 952-943-2174。
ndfh144-1995sa
对于ndfh144-1995sa这一主题,我们先来了解一下其背景和相关内容:1. ndfh144-1995sa是一种在医学领域中被广泛应用的诊断方法,主要用于检测某种特定疾病的存在与否。
2. 这种诊断方法通过对患者的生理指标、临床表现以及实验室检测数据进行综合分析和比对,从而达到对疾病的诊断与判断的目的。
3. 在临床实践中,ndfh144-1995sa的应用已经取得了显著的成果,为医生提供了重要的辅助诊断工具,帮助他们更准确地判断疾病类型和病情严重程度。
4. 作为一种诊断方法,ndfh144-1995sa也在不断的发展和完善之中,通过不断改进其算法和技术手段,使其在诊断准确性和鲁棒性上有所提高。
5. ndfh144-1995sa的应用也面临一些挑战和待解决的问题,如在数据采集和处理上的局限性,以及对不同种裙和地域疾病特点的适应性等。
基于以上内容,我们可以从以下几个方面展开文章的论述:1. ndfh144-1995sa的原理和技术特点- 介绍ndfh144-1995sa的基本原理和诊断流程- 分析ndfh144-1995sa的技术特点和优势所在2. ndfh144-1995sa在临床应用中的价值- 分析ndfh144-1995sa在不同疾病诊断中的应用情况与成效- 总结ndfh144-1995sa在医学领域的价值和作用3. ndfh144-1995sa的发展现状和未来展望- 探讨ndfh144-1995sa在技术上的发展趋势和方向- 分析ndfh144-1995sa在临床应用中可能面临的挑战与发展空间4. 结语- 总结ndfh144-1995sa的意义与作用- 展望ndfh144-1995sa的发展前景与未来发展方向在文章撰写过程中,我们应当注重提供相关数据和案例分析,以及引用权威的文献和研究成果,从而使文章的观点更加具有权威性和说服力。
在结构上应当注重层次分明,条理清晰,确保文章的逻辑性和连贯性。
NRS2002营养风险筛查在初诊胃癌患者中的应用
-论著----------------------------中国当代医药2021年6月第28卷第17期NRS2002营养风险筛查在初诊胃癌患者屮的应用黄凌莉江苏省肿瘤医院江苏省肿瘤防治研究所南京医科大学附属肿瘤医院药学部,江苏南京210009[摘要]目的评估初诊胃癌患者的营养状况,并探讨初诊胃癌患者NRS2002营养风险筛查与检查指标的关系,以指导营养治疗。
方法选择2018年2~6月南京市某肿瘤专科医院胃外科93例初诊胃癌患者作为研究对象,在入院48h内采用NRS2002工具进行营养风险筛查,根据NRS2002评分结果分为有营养风险组(NRS2002评分逸3分)和无营养风险组(NRS2002评分<3分)。
同时进行PG-PGA营养评估分级、体格检查,测定血常规及生化指标,并采用多频生物电阻抗分析法测定机体成分,对结果进行统计分析。
结果入组的93例患者,其中有营养风险患者占47.31%遥两组患者的PG-SGA分级分布比较,差异有统计学意义(P<0.05)遥有营养风险组患者的血清白蛋白、血红蛋白、骨骼肌量、细胞内液、去脂组织指数、骨骼肌指数均低于无营养风险组,差异有统计学意义(P<0.05)遥两组患者的其他指标比较,差异无统计学意义(P>0.05)遥结论NRS2002营养风险筛查与PG-SGA分级、血清白蛋白、血红蛋白、骨骼肌指数等检查指标均有较好的一致性,不但是一种可靠、快速的营养风险筛查工具,且能在一定程度上反映营养状况。
NRS2002联合PG-SGA、血清白蛋白、血红蛋白、骨骼肌量等营养相关指标,能更加准确、全面地了解患者营养状况,改善患者预后遥[关键词]胃癌;营养风险筛查;人体成分;营养指标[中图分类号]R151.42[文献标识码]A[文章编号]1674-4721(2021)6(b)-0004-04Application of NRS2002nutritional risk screening in patients with newly diagnosed gastric cancerHUANG Ling-liDeparLmenL of Pharmacy,Jiangsu Cancer Hospital,Jiangsu InsLiLuLe of Cancer Research,Lhe Affiliated Cancer Hospital of Nanjing Medical UniversiLy,Jiangsu Province,Nanjing210009,China[Abstract]Objective To evaluaLe Lhe nuLriLional sLaLus of newly diagnosed gasLric cancer paLienLs,Lo explore Lhe cor-relaLion beLween NRS2002nuLriLional risk screening and ouLcome measuremenLs,so as Lo guide nuLriLional LreaLmenL.Methods A LoLal of93newly diagnosed gasLric cancer paLienLs from February Lo June2018were selecLed as Lhe research objecLs in deparLmenL of gasLric surgery of a cancer specialisL hospiLal from Nanjing CiLy.NRS2002was used for nuLriLional risk screening wiLhin48hours of admission.According Lo Lhe NRS2002score,Lhey were divided inLo nuLri-Lional risk group(NRS2002score逸3poinLs)and non-nuLriLional risk group(NRS2002score<3poinLs).A l Lhe same Lime, PG-PGA nuLriLional assessmenL classificaLion and physical examinaLion were performed,blood rouLine and biochemical indicators were LesLed,mulLi-frequency bioelecLrical impedance analysis was used Lo deLecL body composition,and sLa-LisLical analysis of the results was made.Results A total of93patients were enrolled in the group,of whom47.31%' were at nutritional risk.There was statistically significant difference in the PG-SGA grading distribution between the two groups(P<0.05).The serum albumin,hemoglobin,skeletal muscle mass,intra-cellular water,fat free mass index, and skeleLal muscle index in Lhe nuLriLional risk group were lower Lhan Lhose in Lhe non-nuLriLional risk group,and Lhe differences were statistically significant(P<0.05).There were no statistically significant differences in other indexes between the two groups(P>0.05).Conclusion NRS2002nutritional risk screening has great concordance in PG-SGA grades,serum albumin,hemoglobin,skeletal muscle index and other nutritional indicators.It is not only a reliable and rapid nutritional risk screening tool,but also can reflect nutritional status.Most of all,combining NRS2002with these nutritional indexes can more accurately and comprehensively understand the nutritional status of patients and improve[基金项目]江苏省药学会-天晴医院药学基金项目(Q2018017)[作者简介]黄凌莉(1991-),女,硕士,主管药师,研究方向:营养药学the prognosis of patients.[Key words]Gastric cancer;Nutritional risk screening; Body composition;Nutrition indicators4CHINA MODERN MEDICINE Vol.28No.17June 2021中国当代医药2021年6月第28卷第17期•论著窑胃癌是发病率和死亡率均较高的恶性肿瘤之一,且是营养不良的高发人群。
LMSTest.Lab中文操作指南_Desktop桌面操作
b中文操作指南_Desktop桌面操作LMS b中文操作指南— Desktop桌面操作比利时LMS国际公司北京代表处2009年2月LMS b中文操作指南— Desktop桌面操作目录1.开始 (2)2.浏览数据 (3)3.显示数据 (4)3.1.测试的数据 (4)3.2.图形拷贝 (8)3.3.几何图形显示 (8)4.数据调理 (10)5.搜索功能 (11)6.Documentation 界面 (13)6.1.添加附件 (13)6.2.添加模板 (14)6.3.添加用户属性 (15)7.导入外部数据 (17)1. 开始启动LMS b Desktop 从开始菜单? 所有程序? LMS b 9ADesktop 或者通过桌面的快捷图标软件打开后,通过底部的导航条,可以看到两个界面:Documentation 和 Navigator 。
默认会打开一个空白的Project ,软件激活“Navigator”页面中的“Data Viewing”子页面。
可以浏览数据,图形显示数据。
页面在LMS b 资源管理器中可以看到Project ,另外还有:My Computer: 资源管理器最后一个项目。
可以浏览您电脑中的数据。
My Links: 此处可以链接常用Project 的快捷方式,首先从“My Computer”找到Project ,右键单击Copy ,然后到“My Links”右键单击Paste as link 。
Search Results: LMS b 软件可以进行搜索,搜索的结果放在此处。
Input Basket: 暂时存放准备作处理的数据。
Online Data: 此目录可浏览采集时定义的在线数据。
Workspace: 和Windows 中的Workspace 一样,暂时存放数据。
打开某个测试的数据,以下“ProblemDescription.lms”为例。
通过 File ? Open 打开“ProblemDescription.lms”下图显示“ProblemDescription”包括两个sections ,称为Section1和Section2,可以增加删除或重命名section 。
第8章 频率响应分析
第八章频率响应分析8.1 概述1)计算震荡激励的响应2) 激励在频域中显式定义,在每频率点作用力已知3) 计算的响应通常包括节点位移、单元力和应力4) 计算的响应为复数、由大小、相位定义5) 频率响应分析分为直接法、模态法。
8.2 直接频率响应法1)动力学方程2)在MATi卡中PARAM,G和GE 不形成阻尼矩阵、而形成复刚度矩阵其中,与瞬态响应对应有8.3 模态频率响应法1)转化为模态坐标中,求解解耦的单自由度系统得2)求解该方程比直接法更快3)如无阻尼或仅有模态阻尼(TABDMP1定义),方程才能解耦;否则,如果出现非模态阻尼(VISC,DAMP定义),使用低效率得直接频响法(对小的模态坐标矩阵)。
8.4 激励的确定1)定义为频率的函数2)MSC/NASTRAN中的几种定义• RLOAD1: 用实部和虚部定义频变载荷• RLOAD2 :用大小和相位定义频变载荷• LSEQ :用静态载荷产生动态载荷3)用 DLOAD数据集卡组合频变力4)RLOADi卡由DLOAD 情况控制卡选择8.4.1 RLOAD1卡片1) 定义如下频变载荷2) 格式3) 由DLOAD=SID.选取8.4.2 RLOAD2卡片1) 定义如下频变载荷2)格式3) 由DLOAD=SID.选取8.4.3 FREQ卡片1) 选择频率步长大小2) FREQ卡片定义离散激励频率3) FREQ1 定义f START, 频率增量、增量数目4)FREQ2定义f START, f end对数间隔数5)FREQ3 定义F1, F2和在二者间线性或对数插值数目(基于朝两端点或中心)6)FREQ4 指定一个共振频率、一个等效的间隔频率数(在激励频率内)7)FREQ5 指定一个频率范围和频率范围内的固有频率的分数8)FREQ3, FREQ4, FREQ5 仅对模态法有效9)FREQi 数据卡由FREQUENCY =SID情况控制卡选取10)所有FREQi数据卡用相同的ID11)FREQ, FREQ1, FREQ2, FREQ3, FREQ4和FREQ5 卡可以在同一分析中使用8.4.3.1 FREQ卡1) 定义频率响应分析中的频率集2) 格式3) 由情况控制卡FREQUENCY = SID.选取1) 定义频率响应问题中频率集:通过开始频率、频率增量、增量数目2) 格式3) 由情况控制卡FREQUENCY = SID选取4) f i= F1 + DF * (i - 1)5) 单位:cycles per unit time.8.4.3.3 FREQ21) 定义频率响应问题中频率集,通过开始频率、结束频率、对数增量数目2) 格式3) 由情况控制卡FREQUENCY = SID选取4) 单位:cycles per unit time5)1) 定义频率响应问题中频率集,通过指定两模态频率间的激励频率数2) 格式3) 仅用于模态频率响应4) 由情况控制卡FREQUENCY = SID选取5) 对各种CLUSTER其中,6)) 例子(F1=10,F2=20,NEF=11,TYPE=LINEAR)8.3.3.5 FREQ4卡1) 定义频率响应问题中频率集,通过指定范围内每阶固有频率附近激励频率数2) 格式3) 仅用于模态频率响应4) 由情况控制卡FREQUENCY = SID选取8.3.3.6 FREQ5卡1) 定义频率响应问题中频率集,通过指定频率范围及该范围内的位置2) 格式3) 如f N1为F1和F2间的固有频率,则4) 仅用于模态频率响应5) 由情况控制卡FREQUENCY = SID选8.5 模态频率响应与直接频率响应比较注:“X”表可用8.6 SORT1和SORT2输出1) SORT1输出每一激励频率点2) SORT2输出给定节点、单元的结果8.7 频率响应求解控制8.7.1 执行控制8.7.2 情况控制8.7.3 数据模型集8.7.4 输出控制1)结点结果输出2)单元输出结果3)其它8.8 频变弹簧和阻尼器(1) 弹簧刚度和阻尼器阻尼系数为频变函数(2) CBUSH定义一般弹簧、阻尼连接(3) PBUSH定义名义上的弹簧、阻尼连接(4) PBUSHT定义变频弹簧、阻尼器的值8.8.1 CBUSH 卡片1)定义广义弹簧-阻尼器结构单元,可为非线性或频变2)格式8.8.2 PBUSH卡片1)定义广义弹簧-阻尼器结构单元性质2)格式8.8.3 PBUSHT卡片1)定义广义弹簧-阻尼器的频变或力变性质2)格式8.8.4 例子SAMPLE USING CBUSH ELEMENT$$ cbush1.dat$TIME 10SOL 108CENDTITLE = VERIFICATION PROBLEM, FREQ. DEP. IMPEDANCE BUSHVER SUBTITLE = SINGLE DOF, CRITICAL DAMPING, 3 EXCITATION FREQUENCIES ECHO = BOTHSPC = 1002DLOAD = 1DISP = ALLFREQ = 10ELFO = ALLBEGIN BULK$ CONVENTIONAL INPUT FOR MOUNTGRDSET,, , , , , ,23456 $ PS$ TIE DOWN EVERYTHING BUT THE 1 DOFGRID, 11, , 0., 0., 0.0 $ GROUND=, 12, =, =, =, , $ ISOLATED DOFSPC1, 1002 123456 11 $ GROUNDCONM2, 12, 12, , 1.0 $ THE ISOLATED MASS$$ EID PID GA GB GO/X1 X2 X3 CID$CBUSH 1000 2000 11 12 0$PBUSH 2000 K 1.0B 0.0$PBUSHT 2000 K 2001B 2002$TABLED1, 2001 $ STIFFNESS TABLE, 0.9 0.81, 1.0, 1.0, 1.1, 1.21 ENDTTABLED1 2002 $ DAMPING TABLE, 0.9 .2864789, 1.0,.318309, 1.1,.3501409 ENDT$CONVENTIONAL INPUT FOR FREQUENCY RESPONSEPARAM, WTMASS, .0253303 $ 1/(2*PI)**2. GIVES FN=1.0DAREA, 1, 12, 1, 2. $CAUSES UNIT DEFLECTIONFREQ, 10, 0.9, 1.0, 1.1 $ BRACKET THE NATURAL FREQUENCYRLOAD1, 1, 1, , , 3TABLED1,3 $ TABLE FOR FORCE VS. FREQUENCY, 0.9, 0.81, 1., 1., 1.1, 1.21,ENDT $ P = KENDDATA例2,直接频响法激励为作用在角点的单位载荷,频率范围在20~1000间,频率步为20HZ, 结构阻尼g=0.06.INPUT FILE FOR PROBLEM #5ID SEMINAR, PROB5SOL108TIME30CENDTITLE = FREQUENCY RESPONSE DUE TO UNIT FORCE AT TIPECHO = UNSORTEDSPC = 1SET 111 = 11, 33, 55DISPLACEMENT(SORT2, PHASE) = 111SUBCASE 1DLOAD = 500FREQUENCY = 100$OUTPUT (XYPLOT)$XTGRID= YESYTGRID= YESXBGRID= YESYBGRID= YESYTLOG= YESYBLOG= NOXTITLE= FREQUENCY (HZ)YTTITLE= DISPLACEMENT RESPONSE AT LOADED CORNER, MAGNITUDE YBTITLE= DISPLACEMENT RESPONSE AT LOADED CORNER, PHASE XYPLOT DISP RESPONSE / 11 (T3RM, T3IP)YTTITLE= DISPLACEMENT RESPONSE AT TIP CENTER, MAGNITUDEYBTITLE= DISPLACEMENT RESPONSE AT TIP CENTER, PHASEXYPLOT DISP RESPONSE / 33 (T3RM, T3IP)YTTITLE= DISPLACEMENT RESPONSE AT OPPOSITE CORNER, MAGNITUDE YBTITLE= DISPLACEMENT RESPONSE AT OPPOSITE CORNER, PHASEXYPLOT DISP RESPONSE / 55 (T3RM, T3IP)$BEGIN BULKparam,post,0PARAM, COUPMASS, 1PARAM, WTMASS, 0.00259$$ PLATE MODEL DESCRIBED IN NORMAL MODES EXAMPLE$INCLUDE ’plate.bdf’$$ SPECIFY STRUCTURAL DAMPING$PARAM, G, 0.06$$ APPLY UNIT FORCE AT TIP POINT$RLOAD2, 500, 600, , ,310$DAREA, 600, 11, 3, 1.0$TABLED1, 310,, 0., 1., 1000., 1., ENDT$$ SPECIFY FREQUENCY STEPS$FREQ1, 100, 20., 20., 49$ENDDATA例3,模态频响法激励为振幅为0.1 psi的分布载荷与作用在角点的1.0 lb集中力,相位为45度。
人体频响函数的测量和分析
人体频响函数的测量和分析人类在不同频率信号的作用下,可以接收到不同频率的声音。
因此,测量和分析人体在不同频率信号作用下的反应,即人体频响函数(HRF),有助于对人体的音频特性等进行深入的研究。
本文的主要内容为人体频响函数的测量和分析,旨在为后续研究提供参考。
一、HRF的测量传统来讲,HRF的测量大都采用传统的声学设备,包括麦克风、功率计、放大器、滤波器等。
首先,将麦克风放置在测试场景之中,并将其与功率表或放大器相连接,一般来说,麦克风的频率范围可达近20kHz,以捕捉不同频率声音。
其次,将放大器与滤波器相连,滤波器可以有效消除噪音,使得在静音环境中测试。
最后,将滤波器与功率计相连,以便获得更加准确的实验结果。
二、HRF的分析HRF分析包括实验时间域分析、频域分析、声谱图分析和脉冲反应分析四个方面。
首先,在实验时间域分析中,首先实现HRF的采样,其次,通过拟合曲线,来分析HRF变化的趋势,从而分析出HRF在不同时点的行为特性;其次,在频域分析中,利用傅里叶变换,将实验采样数据转换成频域数据,以便更直观的分析HRF在不同频率的响应。
同时,还可以采用声谱图进行HRF分析,声谱图是通过将交叠的频谱分离后显示出来的结果,能够表现出HRF在不同频段的特性;最后,在脉冲反应分析中,采用脉冲发射信号,非常有效的抑制因噪声而产生的干扰,从而获取准确的实验结果。
三、HRF的应用HRF的研究有助于我们更深入地了解人们对声音特性的感知及反应,因此,HRF的研究及应用十分广泛。
其中,首先,可以应用在人们的声学设计以及对改善噪声环境中,以便更符合人类音频特性的声学环境;其次,在音频和视频动画中,可以应用HRF的结果,以便制作出更符合人类感受的动画;最后,HRF的研究也有助于人们研究语言及习得的过程,以便更好地理解及分析人们在声音交流中的行为特性等。
综上所述,HRF的测量和分析有助于我们更深入地了解及分析人类在不同频率信号作用下的反应,从而可以更好地应用于人们的声学设计以及视频动画制作中,以及在语言学研究以及习得过程中,帮助我们更好地理解人类语言的行为特性等。
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There are at least four different testing configurations that can be compared. These different testing conditions are largely a function of the number of acquisition channels or excitation sources that are available to the test engineer. In general, the best testing situation is the multiple input/multiple output configuration (MIMO) since the data is collected in the shortest possible time with the fewest changes in the test conditions.
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(5-2)
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Time invariance problems between measurements from different responses.
Multiple input/multiple output. (MIMO)
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Multiple input/single output. (MISO)
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Multiple channel system required (3 or more.). (One ADC channel for each input signal to be measured plus one ADC channel for a response signal.) Long testing time. Roving response transducer. More than one input location per measurement cycle. Detects repeated roots. Maxwell reciprocity checks are possible.
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Single input/multiple output. (SIMO)
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Multiple channel system (3 or more). (One ADC channel for each response signal to be measured plus one ADC channel for an input signal.) Shorter testing time than SISO. Transducers not necessarily moved. Consistent frequency and damping for data acquired simultaneously. Time invariance problems between measurements from different inputs.
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Single input/single output. (SISO)
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Only option if 2 channel data acquisition system. Longest testing time. Roving inputs. Roving outputs. Time invariance problems between measurements.
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5. FREQUENCY RESPONSE FUNCTION MEASUREMENTS 5.1 Introduction
For current approaches to experimental modal analysis, the frequency response function is the most important measurement to be made. When estimating frequency response functions, a measurement model is needed that will allow the frequency response function to be estimated from measured input and output data in the presence of noise (errors). Some of the errors are:
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Multiple channel system (up to 512 channels). Increased set-up time. Large amount of data to be stored and organized. Shortest testing time. Consistent frequency and damping for all data acquired simultaneously. Detects repeated roots. Maxwell reciprocity checks are possible. Best overall testing scheme.
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Digital Signal Processing Errors (Leakage, Aliasing) Noise
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Equipment problem (Power supply noise) Cabling problems (RFI,EMI) Rattles, cable motion
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Calibration (operator error)
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Complete system calibration Transducer calibration
Since the frequency response function can be expressed in terms of system properties of mass, stiffness, and damping, it is reasonable to conclude that in most realistic structures, the frequency response functions are considered to be constants just like mass, stiffness, and damping. This concept means that when formulating the frequency response function using H 1 , H 2 , or H v algorithms, the estimate of frequency response is intrinsically unique, as long as the system is linear and the noise can be minimized or eliminated. The estimate of frequency response is valid whether the input is stationary, non-stationary, or deterministic. Therefore, several important points to remember before estimating frequency response functions are:
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5.2 Frequency Response Function Estimation
Frequency response functions are normally used to describe the input-output (force-response) relationships of any system. Most often, the system is assumed to be linear and time invariant although this is not necessary. In the cases where assumptions of linearity and time invariance are not valid, the measurement of frequency response functions are also dependent upon the independent variables of time and input. In this way, a conditional frequency response function is measured as a function of other independent variables in addition to frequency. Note that the different possible formulations listed in Table 5-1 can all be considered frequency response functions since each of these formulations can be numerically manipulated (synthetic differentiation, integration, etc.) into the equivalent displacement over force relationship. This assumes that initial conditions can be ignored.