MC10H188MEL中文资料

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GM音色表中英文对照

GM音色表中英文对照钢琴0 Acoustic Grand Piano 大钢琴（声学钢琴）1 Bright Acoustic Piano 明亮的钢琴2 Electric Grand Piano 电钢琴3 Honky-tonk Piano 酒吧钢琴4 Rhodes Piano 柔和的电钢琴5 Chorused Piano 加合唱效果的电钢琴6 Harpsichord 羽管键琴（拨弦古钢琴）7 Clavichord 科拉维科特琴（击弦古钢琴）色彩打击乐器8 Celesta 钢片琴9 Glockenspiel 钟琴10 Music box 八音盒11 Vibraphone 颤音琴12 Marimba 马林巴13 Xylophone 木琴14 Tubular Bells 管钟15 Dulcimer 大扬琴风琴16 Hammond Organ 击杆风琴17 Percussive Organ 打击式风琴18 Rock Organ 摇滚风琴19 Church Organ 教堂风琴20 Reed Organ 簧管风琴22 口琴23 Tango Accordian 探戈手风琴吉他24 Acoustic Guitar (nylon) 尼龙弦吉他25 Acoustic Guitar (steel) 钢弦吉他26 Electric Guitar (jazz) 爵士电吉他27 Electric Guitar (clean) 清音电吉他28 Electric Guitar (muted) 闷音电吉他29 Overdriven Guitar 加驱动效果的电吉他30 Distortion Guitar 加失真效果的电吉他31 Guitar Harmonics 吉他和音贝司32 Acoustic Bass 大贝司（声学贝司）33 Electric Bass(finger) 电贝司（指弹）34 Electric Bass (pick) 电贝司（拨片）35 Fretless Bass 无品贝司36 Slap Bass 1 掌击Bass 137 Slap Bass 2 掌击Bass 238 Synth Bass 1 电子合成Bass 139 Synth Bass 2 电子合成Bass 2弦乐40 Violin 小提琴41 Viola 中提琴42 Cello 大提琴44 Tremolo Strings 弦乐群颤音音色45 Pizzicato Strings 弦乐群拨弦音色46 Orchestral Harp 竖琴47 Timpani 定音鼓合奏/合唱48 String Ensemble 1 弦乐合奏音色149 String Ensemble 2 弦乐合奏音色250 Synth Strings 1 合成弦乐合奏音色151 Synth Strings 2 合成弦乐合奏音色252 Choir Aahs 人声合唱“啊”53 Voice Oohs 人声“嘟”54 Synth Voice 合成人声55 Orchestra Hit 管弦乐敲击齐奏铜管56 Trumpet 小号57 Trombone 长号58 Tuba 大号59 Muted Trumpet 加弱音器小号60 French Horn 法国号（圆号）61 Brass Section 铜管组（铜管乐器合奏音色）62 Synth Brass 1 合成铜管音色163 Synth Brass 2 合成铜管音色2簧管64 Soprano Sax 高音萨克斯风65 Alto Sax 次中音萨克斯风66 Tenor Sax 中音萨克斯风67 Baritone Sax 低音萨克斯风68 Oboe 双簧管69 English Horn 英国管70 Bassoon 巴松（大管）71 Clarinet 单簧管（黑管）笛72 Piccolo 短笛73 Flute 长笛74 Recorder 竖笛75 Pan Flute 排箫76 Bottle Blow [中文名称暂缺]77 Shakuhachi 日本尺八78 Whistle 口哨声79 Ocarina 奥卡雷那合成主音80 Lead 1 (square) 合成主音1（方波）81 Lead 2 (sawtooth) 合成主音2（锯齿波）82 Lead 3 (caliope lead) 合成主音383 Lead 4 (chiff lead) 合成主音484 Lead 5 (charang) 合成主音585 Lead 6 (voice) 合成主音6（人声）86 Lead 7 (fifths) 合成主音7（平行五度）87 Lead 8 (bass+lead)合成主音8（贝司加主音）合成音色88 Pad 1 (new age) 合成音色1（新世纪）89 Pad 2 (warm) 合成音色2 （温暖）90 Pad 3 (polysynth) 合成音色391 Pad 4 (choir) 合成音色4 （合唱）92 Pad 5 (bowed) 合成音色593 Pad 6 (metallic) 合成音色6 （金属声）94 Pad 7 (halo) 合成音色7 （光环）95 Pad 8 (sweep) 合成音色8合成效果96 FX 1 (rain) 合成效果 1 雨声97 FX 2 (soundtrack) 合成效果 2 音轨98 FX 3 (crystal) 合成效果 3 水晶99 FX 4 (atmosphere) 合成效果 4 大气100 FX 5 (brightness) 合成效果 5 明亮101 FX 6 (goblins) 合成效果 6 鬼怪102 FX 7 (echoes) 合成效果 7 回声103 FX 8 (sci-fi) 合成效果 8 科幻民间乐器104 Sitar 西塔尔（印度）105 Banjo 班卓琴（美洲）106 Shamisen 三昧线（日本）107 Koto 十三弦筝（日本）108 Kalimba 卡林巴109 Bagpipe 风笛110 Fiddle 民族提琴111 Shanai 山奈打击乐器112 Tinkle Bell 叮当铃113 Agogo [中文名称暂缺] 114 Steel Drums 钢鼓115 Woodblock 木鱼116 Taiko Drum 太鼓117 Melodic Tom 通通鼓118 Synth Drum 合成鼓119 Reverse Cymbal 铜钹Sound Effects 声音效果120 Guitar Fret Noise 吉他换把杂音121 Breath Noise 呼吸声122 Seashore 海浪声123 Bird Tweet 鸟鸣124 Telephone Ring 电话铃125 Helicopter 直升机126 Applause 鼓掌声127 Gunshot 枪声General MIDI打击乐器音色排列表MIDI音高打击乐声音35 Acoustic Bass Drum36 Bass Drum 137 Side Stick38 Acoustic Snare39 Hand Clap40 Electric Snare41 Low Floor Tom42 Closed Hi-Hat43 High Floor Tom44 Pedal Hi-Hat45 Low Tom46 Open Hi-Hat47 Low-Mid Tom48 Hi-Mid Tom49 Crash Cymbal 150 High Tom51 Ride Cymbal 152 Chinese Cymbal53 Ride Bell54 Tambourine55 Splash Cymbal56 Cowbell57 Crash Cymbal 258 Vibraslap59 Ride Cymbal 260 Hi Bongo61 Low Bongo62 Mute Hi Conga63 Open Hi Conga64 Low Conga65 High Timbale66 Low Timbale67 High Agogo68 Low Agogo69 Cabasa70 Maracas71 Short Whistle72 Long Whistle73 Short Guiro74 Long Guiro75 Claves76 Hi Wood Block77 Low Wood Block78 Mute Cuica79 Open Cuica80 Mute Triangle81 Open Triangle。

B18系列产品说明书

6MB18A 812MB18A 16MB18A MCS50B18A 6M3B18ACO 812MB18S
*(XXX)CO
4
MC/AC
4
1/2" [13] & 3/4" [19]
Attaches to 1/8" [3] through 1/4" [6] flange.
4
1" [25]
4
MC/AC
4
1/2" [13] & 3/4" [19]
other purpose.
NOTE: All load ratings are for static conditions and do not account for dynamic loading such as wind, water or seismic loads, unless otherwise noted.
Pentair, CADDY, ERICO CADWELD, ERICO CRITEC, ERICO, ERIFLEX, and LENTON are owned by Pentair or its global affiliates. All other trademarks are the property of their respective owners. Pentair reserves the right to change specifications without prior notice.
CADDY B18 series with threaded rod going through both
the B18 and the box, this single support is appropriate.

AK 98

商标商标Gambro、AK 98、BiCart、CleanCart、Diascan、SoftPac、U 9000、Polyflux、Revaclear 和Evodial 都属于Gambro 集团。

商标Dialox 属于Air Liquide 集团。

商标HASTELLOY 属于Haynes International Inc。

制造商Gambro Lundia ABBox 10101Magistratsvägen 16SE-22010LUNDSweden电话：+4646169000销售代表联系信息（如果有）：如对本手册有任何意见或建议，请联系当地销售代表或制造商。

Operators handbook1用前须知 (1)2机器说明 (17)3操作血液透析装置 (39)4血液透析-双针治疗 (57)5血液透析-单针治疗 (85)6单纯超滤 (93)7图形预制功能 (97)8测量血压（选件） (105)9检查清除率（选件） (111)10消毒和清洁 (117)11对AK98™血液透析装置和WRO系统进行消毒 (131)12维护和操作 (135)13技术数据和规格 (141)14当地法规登记号（如果有） (161)Alarm handbook1报警 (1)2关注信息 (55)HCZHCN12626修订02.2015程序版本1.xx目录1用前须知 (1)1.1阅读操作手册时的重要事项 (2)1.1.1关于本操作手册 (2)1.1.2安全定义 (2)1.1.3值和设置 (2)1.1.4按钮 (2)1.1.5关于屏幕 (2)1.1.6符号 (4)1.2使用前的一般警告和注意事项 (6)1.2.1使用前的一般注意事项 (6)1.2.2责任与免责声明 (8)1.2.3漏电和等电位连接 (8)1.2.4治疗地点 (9)1.2.5中心静脉导管 (9)1.2.6外部电气设备连接 (9)1.2.7如何移动AK98血液透析装置 (9)1.2.8安全须知 (9)1.3预期用途 (10)1.3.1预期用途 (10)1.3.2培训 (11)1.3.3消毒和功能检查 (11)1.3.4进水要求 (11)1.3.5中央输送系统的卫生质量 (11)1.3.6配制透析液 (11)1.4附件 (12)1.4.1浓缩液、化学消毒剂、附件和消耗品 (12)1.4.2浓缩液 (12)1.4.3化学消毒剂 (13)1.4.4血液管路 (13)1.4.5附件 (13)1.4.6超滤器（选件） (13)1.4.7透析器 (14)1.4.8血压测量附件 (14)1.5术语 (15)1.5.1术语 (15)2机器说明 (17)2.1血液部分 (18)2.1.1血液部分的部件 (18)2.1.2血液部分部件详细信息 (19)2.2液体部分 (26)2.2.1液体部分的部件 (26)2.2.2液体部分组件详细信息 (27)HCZHCN12626修订02.2015程序版本1.xx2.3背面的部件 (32)2.3.1背面的部件 (32)2.3.2背面部件详细信息 (33)3操作血液透析装置 (39)3.1操作员位置 (40)3.1.1操作员位置 (40)3.2打开和关闭血液透析装置 (40)3.2.1主开关 (40)3.2.2开/关按钮 (40)3.3指示灯和按钮 (40)3.3.1指示灯 (40)3.3.2操作员面板上的按钮 (41)3.4屏幕 (42)3.4.1屏幕概述 (42)3.4.2静脉和动脉压力控制(1,2) (43)3.4.3机器状态指示灯(3) (43)3.4.4时间(4) (43)3.4.5血液路径(5) (44)3.4.6液体流路(6) (44)3.4.7旁路路径 (44)3.4.8血压区(7,8)（选件） (44)3.4.9清除率区(9,10)（选件） (44)3.4.10治疗浏览(11–15) (44)3.4.11报警选项卡(16) (45)3.4.12信息选项卡(17) (45)3.4.13信息字段(18) (45)3.4.14预冲按钮(19) (45)3.4.15回血按钮(20) (45)3.4.16消毒按钮(21) (46)3.4.17血液按钮(22) (47)3.4.18液体按钮(23) (48)3.4.19液体旁路按钮(24) (50)3.4.20超滤按钮(25) (51)3.4.21治疗历史记录页面(26) (51)3.4.22状态栏(27) (51)3.4.23服务菜单 (51)3.5浓缩液待命模式 (52)3.5.1关于暂停透析液 (52)3.5.2手动暂停透析液的配制 (53)3.5.3恢复透析液的配制 (53)3.5.4自动暂停透析液配制 (53)3.6在电源故障期间操作机器 (53)3.6.1在有备用电池的情况下出现电源故障 (53)3.6.2在没有备用电池的情况下出现电源故障 (53)3.6.3手动为病人回血 (54)HCZHCN12626修订02.2015程序版本1.xx3.7在治疗过程中更换透析器和血路管 (54)3.8超滤控制 (55)4血液透析-双针治疗 (57)4.1基本功能 (58)4.2开始双针治疗 (58)4.2.1治疗前检查事项 (58)4.2.2开始功能检查 (58)4.2.3设置血液透析装置 (59)4.2.4连接动脉血液管路 (61)4.2.5连接静脉血液管路 (66)4.2.6连接肝素注射器 (71)4.2.7预冲透析循环 (73)4.2.7.1预冲说明 (73)4.2.7.2手动预冲 (73)4.2.7.3辅助预冲 (75)4.2.8预冲选项 (76)4.2.8.1额外预冲 (76)4.2.8.2再循环 (76)4.2.9设置治疗时间 (77)4.2.10设置超滤量 (77)4.2.11设置肝素值 (78)4.2.12连接病人 (79)4.2.13开始治疗 (81)4.3结束双针治疗 (82)4.3.1结束治疗 (82)4.3.2确认断开病人 (83)4.3.3机器后期处理 (83)5血液透析-单针治疗 (85)5.1基本功能 (86)5.2准备 (86)5.3连接病人 (89)5.4开始治疗 (90)5.5结束单针治疗 (91)6单纯超滤 (93)6.1基本功能 (94)6.2处理单纯超滤 (94)6.2.1启用单纯超滤 (94)6.2.2如何再添加一个单纯超滤量 (94)6.2.3停止单纯超滤 (95)6.3其他信息 (95)6.3.1肝素 (95)HCZHCN12626修订02.2015程序版本1.xx7图形预制功能 (97)7.1一般信息 (98)7.2钠和碳酸氢盐浓度曲线 (98)7.3超滤率曲线 (98)7.4图形预制功能设置/启用 (101)7.5无预设模型的图形预制功能 (102)7.5.1无预设模型的超滤图形预制功能 (102)7.5.2无预设模型的钠图形预制功能 (103)7.5.3无预设模型的碳酸氢盐图形预制功能 (103)7.6设置和启用带预设模型的图形预制功能 (104)8测量血压（选件） (105)8.1血压监测仪(BPM) (106)8.2血压袖带 (106)8.3直接血压测量 (107)8.4间隔时间血压测量 (108)8.5测量历史记录 (108)8.6设置报警限值 (109)8.7血压测量期间的病人护理 (109)8.7.1所有病人 (109)8.7.2高血压病人 (110)8.7.3心律不齐的病人 (110)9检查清除率（选件） (111)9.1清除率测量(Diascan™)如何工作 (112)9.2清除率测量检查内容 (112)9.3检查K和Kt (112)9.4检查Kt/V (113)9.5测量历史记录 (114)9.6设置Kt/V目标值 (114)9.7设置K或Kt/V过低的报警 (115)9.8影响测量的因素 (115)10消毒和清洁 (117)10.1消毒和清洁–一般信息 (118)10.2启动前的检查事项 (118)10.3加热消毒 (119)10.3.1加热消毒说明 (119)10.3.2清洁和脱钙 (119)10.3.3启动加热消毒 (119)HCZHCN12626修订02.2015程序版本1.xx10.3.4启动使用CleanCart™清洗棒的加热消毒 (120)10.3.5启动使用液体柠檬酸的加热消毒 (120)10.3.6启动使用液体柠檬酸的短时间加热消毒 (120)10.3.7整合加热消毒 (121)10.3.7.1整合加热消毒 (121)10.3.7.2安排加热消毒方案 (121)10.3.7.3关闭已安排的方案 (122)10.3.8使用WRO300H单元进行整合加热消毒 (122)10.3.8.1使用WRO300H单元进行整合加热消毒 (122)10.4化学消毒 (122)10.4.1有关化学消毒 (122)10.4.2启动化学消毒 (123)10.4.3启动中央化学消毒 (123)10.4.4对WRO单元执行化学消毒方案 (124)10.4.5消毒剂残留物检测 (124)10.4.6消毒历史记录 (124)10.4.7关于化学消毒剂 (125)10.5冲洗和排水 (125)10.5.1启动冲洗或排水 (125)10.5.2安排冲洗方案 (125)10.5.3关闭特定天的冲洗方案 (126)10.6存放灌有化学消毒剂的机器 (126)10.6.1在血液透析装置中灌注化学消毒剂 (126)10.6.2开始使用灌有化学消毒剂的血液透析装置 (127)10.7参考 (127)10.7.1消毒剂、脱钙剂和清洁剂-特征 (127)10.7.2清洁和消毒安排 (128)10.7.3流量路径 (129)11对AK98™血液透析装置和WRO系统进行消毒 (131)11.1一般说明 (132)11.2使用WRO300H单元进行整合加热消毒 (132)11.2.1对WRO300H单元进行整合加热消毒的说明 (132)11.2.2安排整合加热消毒 (132)11.2.3手动启动整合加热消毒 (132)11.3对WRO单元执行中央化学消毒方案 (133)11.3.1对WRO单元执行中央化学消毒方案的说明 (133)11.3.2启动WRO单元的中央化学消毒 (133)11.4冲洗设置 (134)11.4.1冲洗设置 (134)HCZHCN12626修订02.2015程序版本1.xx12维护和操作 (135)12.1维护 (136)12.2血泵转子 (136)12.2.1血泵转子的维护 (136)12.2.2清洁血泵转子 (136)12.3清洁漏血探测器 (137)12.4进水管 (137)12.5吸液管 (137)12.6表面和顶部托盘 (138)12.7更换超滤器 (138)12.8存放 (139)12.9服务 (139)12.10丢弃 (139)13技术数据和规格 (141)13.1性能和规格-控制系统 (143)13.1.1预冲 (143)13.1.2血流控制 (143)13.1.3肝素泵 (143)13.1.4血压 (144)13.1.5血压监测仪(BPM) (144)13.1.6透析液准备 (144)13.1.7超滤控制 (145)13.1.8超滤保护 (146)13.1.9图形预制功能 (146)13.1.10Diascan™（选件） (146)13.1.11消毒和清洁-化学消毒 (146)13.1.12消毒和清洁–加热消毒 (147)13.1.13自动加热消毒 (148)13.1.14加热消毒方案（包括WRO300H） (148)13.1.15消毒和清洁-冲洗/排水 (148)13.1.16消毒和清洁-外部清洁 (148)13.1.17供水 (148)13.1.18电源 (149)13.1.19外部设备连接 (150)13.1.20备用电池 (150)13.2性能和规格-监控系统 (150)13.2.1血压监控 (150)13.2.2空气探测 (151)13.2.3因凝血造成的体外血液流失 (151)13.2.4透析液准备 (151)13.2.5超滤控制系统 (151)13.2.6漏血探测 (152)HCZHCN12626修订02.2015程序版本1.xx13.3报警声压 (152)13.3.1报警声压 (152)13.4物理数据 (152)13.4.1尺寸和重量 (152)13.4.2输液支架 (152)13.5与透析液、浓缩液和水接触的材料 (152)13.5.1聚合物 (152)13.5.2金属 (153)13.5.3其它材料 (153)13.6环境数据 (153)13.6.1中国RoHS声明表 (153)13.6.2操作 (153)13.6.3运输和储存 (154)13.6.4电磁环境 (154)13.6.5预期使用寿命 (157)13.6.6能耗 (157)13.7标准 (158)14当地法规登记号（如果有） (161)HCZHCN12626修订02.2015程序版本1.xx1用前须知1.1阅读操作手册时的重要事项 (2)1.1.1关于本操作手册 (2)1.1.2安全定义 (2)1.1.3值和设置 (2)1.1.4按钮 (2)1.1.5关于屏幕 (2)1.1.6符号 (4)1.2使用前的一般警告和注意事项 (6)1.2.1使用前的一般注意事项 (6)1.2.2责任与免责声明 (8)1.2.3漏电和等电位连接 (8)1.2.4治疗地点 (9)1.2.5中心静脉导管 (9)1.2.6外部电气设备连接 (9)1.2.7如何移动AK98血液透析装置 (9)1.2.8安全须知 (9)1.3预期用途 (10)1.3.1预期用途 (10)1.3.2培训 (11)1.3.3消毒和功能检查 (11)1.3.4进水要求 (11)1.3.5中央输送系统的卫生质量 (11)1.3.6配制透析液 (11)1.4附件 (12)1.4.1浓缩液、化学消毒剂、附件和消耗品 (12)1.4.2浓缩液 (12)1.4.3化学消毒剂 (13)1.4.4血液管路 (13)1.4.5附件 (13)1.4.6超滤器（选件） (13)1.4.7透析器 (14)1.4.8血压测量附件 (14)1.5术语 (15)1.5.1术语 (15)1.1阅读操作手册时的重要事项1.1.1关于本操作手册这本操作手册提供了正确使用AK200SAK200ULTRA SAK96AK98NewayPrismaflex血液透析装置所需的说明。

哈姆尔曼高压注射泵商品介绍说明书

Injection pumpsMethanolLDHIGlycolwww.process-pumps.deHammelmann offer a wide rangeof high pressure pumps for thechemical, oil and gas industries.Visit our website.Asphaltene InhibitorParaffin InhibitorCorrosion InhibitorScale Inhibitor INNOVATION THROUGH EXPERIENCEHammelmann Injection PumpsCalder offer a wide range of highpressure pump packages incorporatingHammelmann pumps for the chemical,oil and gas industries.Visit our website.www.process-pumps.deLabyrinth sealThis seal design which is absolutely unique to Hammelmann enables safe, reliable, continuous duty operation at pressures up to 3800 bar.The high pressure seal is formed within the minute cylindrical gap between the plunger and the labyrinth insert. The medium pressure is continuously reduced along the sealing surface.A minimum amount of high pressure leakage serving as lubricant is returned to the pump suction chamber.Exclusive sealing systemThe plunger connection to thepower end is self centering thereby drastically reducing sideways forces. This design ensures that there is virtually no contact between the plunger and the labyrinth insert resulting in extremely low component wear.When the pump unit is shut down the medium remains in thecylindrical gap so that a re-start,even after an extended shut down period is assured.Wear at the high pressure seal components does not lead to an abrupt breakdown of the pump but rather a gradual decrease in the flow rate. If the pump is driven in a control loop the r.p.m. of the driver will increase in direct proportion to component wear.S p e e dThe running speed of the pump is a direct indicator of the extent of wear.This enables long term planning of maintenance intervals and targeting ofspecific servicing tasks.We manufacture extremely compact Triplex and Quintuplex pump units for injection of Methanol, LDHI,Glycol and a range of inhibitors.Hammelmann high pressure pump units in the pressure range up to 15,000 psi (1035 bar) havedeveloped into the standard choice for offshore methanol injection applications with a reputation for extreme reliability and minimal maintenance requirements.Compact constructionExtensiveperformancerangeWith both Triplex andQuintuplex pumpsavailable we cansupply a veryextensive range offlow rates andoperating pressures.Power ratingsup to 1000 HPup to 750 kWFlow ratesup to 530 gpmup to 2000 l/minOperating pressuresup to 55,000 psiup to 3800 barHammelmann pumps producemaximum performance from aminimal footprint which is the resultof combining a compact integralspeed reduction gear end with theconcept of a vertical configuration.The vertical configuration channelsoscillating forces directlydownwards into the base structure.Unwanted lateral oscillations asproduced by horizontal pumps donot occur.The integral speed reducer with twinhelical gears arranged in a herringbone configuration ensures smoothrunning and even powertransmission without axially loadingthe bearings.A selection of gear ratios isavailable to allow the optimal choiceof driver. The compact constructioneliminates the need for an externalgear box and prevents rotaryoscillation. Mechanical efficiency isin excess of 95%.Industrial pumps, series 2ValvesThe suction valve (below) is a discring design incorporating a onepiece suction and discharge valveseat.FeaturesSeries 2 pumps employ the sameprecision engineered, field provencomponents as Hammelmannstandard production pumps. Theyare extremely compact with lowmaintenance costs and highoperational efficiency.Plunger speedUnitsOur high pressure pump units canbe supplied with electric motor, achoice of controls, safety valves andsuction side/discharge sidepulsation dampers.HDP 752HDP 482HDP 362HDP 252HDP172HDP 122HDP 72HDP 42HDP 2200,20,40,60,81,01,21,4Plunger speed m/sec1,61,8Moderate plunger speeds result inlow plunger and sealing elementwear characteristics.OUTINSealmonitoringsystemSeal monitoringThe condition of the low pressureseals may be monitored by installingan optional sealmonitoring system.MaintenancePump maintenance is carried outfrom above. Once the pump head isremoved you have complete,uncomplicated access to all highpressure components.Pump headThe total pressurised fluid productof the individual cylinders collectswithin a single high pressuredischarge bore within the pumphead valve block. The coaxial valvearrangement eliminates alternatingstress within the valve block.Suction chamberThe process fluid enters the pumpvia the suction chamber. Thistotally encloses the high pressurecomponents in a protective barrierand prevents emission of mediumto atmosphere.5,000 psi345 bar 10,000 psi 690 bar 15,000 psi 1035 bar Crankspeed HDP 22 D 20 D 15 D 12750 rpm 5 gpm 19l/min 2.6 gpm 10 l/min 1.6 gpm 6 l/min HDP 42 D 35 D 26 D 20750 rpm 15 gpm 60 l/min 8 gpm 31 l/min 4.7 gpm18 l/min HDP 72D 35 D 26 D 22750 rpm 21 gpm 80 l/min 11 gpm 42 l/min 7.4 gpm 28 l/min HDP 122 D 55 D 35 D 30530 rpm 50 gpm 192 l/min 19 gpm 74 l/min 13 gpm 51 l/min HDP 172 D 50 D 35 D 30555 rpm 61 gpm 232 l/min 28 gpm 108 l/min 20 gpm 75 l/min HDP 252 D 50 D 35 D 30555 rpm 102 gpm 387 l/min 47 gpm 181 l/min 32 gpm 124 l/min HDP 362 D 80 D 60 D 45490 pm 138 gpm 525 l/min 74 gpm 282 l/min 38 gpm 146 l/min HDP 482 D 80D 60 D 45465 rpm 171 gpm650 l/min92 gpm 349 l/min 47 gpm 181 l/min HDP 752D 80D 60D 45465 rpm285 gpm 1080 l/min159 gpm603 l/min79 gpm302 l/minPerformance data, Industrial pumps, series 2(Selection)Pos.Part name Pos.Part name 1Discharge valve 8Low pressure seal pack 2Valve housing 9Bellow 3Suction valve 10Crosshead4Suction chamber 11Connection rod 5Sleeve 12GearHDP 22/42: belt drive 6Labyrinth insert 13Crank shaft7Plunger14Crank section housing1234567891011121314Recommendations and standardsEU Machine directive 98/37/ EU ATEX 94/9/EUAPI 674 (with exceptions)Technical data, Industrial pumps, series 2Standard Option PlungerLabyrinth insert Ceramic Bronze-Valve housing 17% Chromium steel22% Duplex steelSealsNBR / PolyamideFKM / PEEK Suction chamberBronze18 – 10Chromium Nickel steel* Right reserved to make technical modificationsWetted parts materials *Gas tight designThe intermediate chamber of the pump can be outfitted with gas tight covers which provide a seal to atmosphere. The chamber is then charged with inert gas.This design ensures that no fluids, vapours or gases can escape to atmosphere via a worn plunger seal.1 = Priming valve2 =Safety valve3=Pressure regulating valveBellows systemThe bellows are the hermetic seals for the power end to prevent the intrusion of fluid or gas. They are available in FKM, H-NBR and PTFE.Process pumps, series 5ValvesTo ensure that the pumpconstructíon is appropiate for the pumped medium we have a number of alternative valve designsavailable. In the example shown below the suction and discharge valves are conical. The suction and discharge valve seats are combined in one component.FeaturesSeries 5 pumps are built to the highest standards of safety and reliability. We can supplycomponents from a wide range of materials to suit the pumped medium.Our latest variation of this pump series is the Zero emission where the pumped fluid is hermetically sealed within the pump, preventing leakage to atmosphere during operation.Plunger speedUnitsYour complete pump unit can be outfitted with suction and/or discharge pulsation dampersdimensioned, manufactured, tested and certified to your specification.1,4HDP 755HDP 485HDP 365HDP 255HDP 175HDP 125HDP 75HDP 45HDP 2500,20,40,60,81,01,2Plunger speed m/secInert gasOUTINThe series 5 pumps areconservatively rated for power with low plunger speeds ensuring limited wear of plungers and sealing elements.32Seal monitoring 11Performance data, Process pumps, series 5 (Selection)5,000 psi345 bar 10,000 psi 690 bar 15,000 psi 1035 bar Crank speed HDP 25 D 20 D 15 D 12420 rpm 2.9 gpm 11 l/min 1.5 gpm 6 l/min 0.9 gpm 3,5 l/min HDP 45 D 35 D 26 D 20500 rpm 10 gpm 40 l/min 5 gpm 20 l/min 3 gpm 12 l/min HDP 75 D 35 D 26 D 22490 rpm 13 gpm 52 l/min 7 gpm 28 l/min 5 gpm 19 l/min HDP 125 D 55 D 35 D 30365 rpm 35 gpm 133 l/min 13 gpm 51 l/min 9 gpm 35 l/min HDP 175 D 50 D 35 D 30385 rpm 42 gpm 160 l/min 19 gpm 74 l/min 13 gpm 52 l/min HDP 255 D 50 D 35 D 30390 rpm 71 gpm 270 l/min 33 gpm 126 l/min 23 gpm 87 l/min HDP 365 D 80 D 60 D 45340 rpm 95 gpm 363 l/min 51 gpm 194 l/min 26 gpm 101 l/min HDP 485 D 80 D 60 D 45365 rpm 137 gpm 520 l/min 73 gpm 279 l/min 38 gpm 145 l/min HDP 755D 80D 60D 45365 pm229 gpm867 l/min127 gpm483 l/min63 gpm242 l/minD = Piston dia [mm]1234567891011121314Technical data, Process pumps, series 5Wetted parts materials *Recommendations and standardsEU Machine directive 98/37/ EUATEX 94/9/EUAPI 674 (with exceptions)Other customer specified standards, i.e.NORSK M501NORSOK M650NACE MR 0175Pos.Part name Pos.Part name 1Discharge valve 8Low pressure seal pack 2Valve housing 9Bellows 3Suction valve 10Crosshead4Suction chamber 11Connection rod 5Sleeve 12GearHDP 25/45: belt drive 6Labyrinth insert 13Crank shaft7Plunger14Crank section housingStandardOptionPlungerLabyrinth insert Ceramic BronzeTungsten carbide Tungsten carbide Valve housing 22% Duplex steel25% Super duplex steel SealsNBR / PolyamideFFKM / PEEKSuction chamber 18–10 Chromium Nickel steel 25% Superduplex steel * Right reserved to make technical modificationsRound the clock operationThe compact design ofHammelmann pumps is a space saving advantage for installation on offshore platforms and FPSO’s.They are increasingly specified as the pumps of choice for offshore installations.02/09© Copyright Hammelmann Maschinenfabrik GmbH, Oelde, Germany. Right reserved to make technical modificationsAgbami Aker 1-6Allegheny Anna Platform Atlantis Auger Auger Apit Baton Rouge Black Widow BrazilBrutus/Glider BS4Cabida Block Canyon Express Conger Salsa Demos ForvieGarden Banks Garnet Gjoa Semi Groupo R Hickory HolsteinHorn Mountain HoumaIndep. Hub 3IndpendenceK2 Green Canyon K-FelsKikeh-Gusto King Kong Kings PeekKristin Longhorn Mad Dog Magnolia Marco Polo Max-Stena-Drill Mobile Rig Morvin Asgard Neptune Nile NoonanNorse Marchand Panama City Pegasus Perdido Petrorig Producer Scarebo Schahin SevanS. Timbalier Statfjord B & C Tahiti Talisman Tanzanite Tarantula TMT 1TyphonUrsa-Princess Valifornia West EdrillHDP 72 unit for methanol duty Op. pressure 12,000 psi – 830 bar Flow rate 6 gpm – 24 l/minHDP 555 pump unit for glycol and methanol dutyOp.pressure 10,700 psi – 740 bar, Flow rate 87 gpm – 333 l/minHDP 115 units for methanol duty Op. pressure 15,000 psi – 1035 bar Flow rate 1.5 gpm – 6 l/minHDP 122 unit for LDHI dutyOp. pressure 15,000 psi – 1035 bar Flow rate 7 gpm – 28 l/minHDP 175 units for methanol duty Op. pressure 5,300 psi – 370 bar Flow rate 46 gpm – 176 l/minHammelmannMaschinenfabrik GmbH Zum Sundern 13-2159302 Oelde – Germany Tel. +45 2522 760Fax +49 2522 76444******************www.hammelmann.deCalder Ltd.Gregory's Bank Worcester WR3 8ABUnited Kingdom Phone: 0044 1905 723 255Fax: 0044 1905 723 904***************.uk Calder Ltd.Gregory’s Bank Worcester WR3 8AB United KingdomPhone: 0044 1905 723 255Fax: 0044 1905 723 904***************.uk The compact design of Calder pump packages incorporatingHammelmann pumps, offers a space saving advantage for installation on offshore platforms and FPSO’s. They are increasingly specified as the pumps of choice for offshore installations.。

哈氏合金188热处理工艺哈氏合金188材料规格

合金188是一种钴基特殊合金，具有独特的高温强度和抗氧化性。

长期暴露在1400-1600 °f的温度范围内后，它仍然具有足够的延展性。

与镍基合金相比，钴基合金具有固有的高温蠕变性能。

在固溶强化过程中，向合金188中加入14% 钨，然后加入M6C和M23C6碳化物。

合金188易于加工，并且适用于手动和自动焊接。

焊接方法包括电子束、钨极氩弧焊和电阻焊。

a1a3a1a6a6a3a6a8a1a9a9188合金海恩斯1881.优异的高温强度和环保性188合金含有钴、镍、铬和钨，高温强度非常好。

如果长时间放置在1095 ℃的高温下，仍具有良好的抗氧化性，可有效抵抗含硫沉淀物的热腐蚀。

它可以用传统技术或铸造零件加工。

2.易于加工188合金具有良好的成形和加工特性。

它可以锻造或热处理。

热加工需要将工件在1175 ℃下保持足够长的时间温暖，以确保整个工件达到该温度。

由于该材料的延展性非常好，因此可以对188合金进行冷加工。

由于该合金具有快速冷硬化的特性，因此在加工复杂零件时，需要在两个过程之间进行多次退火。

冷热零件都需要退火处理和快速冷却，以恢复材料的性能。

该材料具有良好的有限焊接特性，可手动焊接或自动焊接，包括TIG、MIG、电子束焊接和电阻焊。

3.热处理锻造的188合金通常以固溶状态供应。

常规热处理方法为1175 ℃ +/-14 ℃固溶处理，然后快速冷却或水淬火以达到最佳性能。

在低于溶液温度的温度下，工艺退火会产生一些碳化物沉淀，这将影响188合金的性能。

4.各种供应形状188合金供应形状包括厚板、薄板、带材、块状、棒状、金属丝、管材5.应用广泛应用于航空工业、制造军用和商用气体发动机燃烧室、管道、后燃气部件等。

6.材料规格188合金满足以下材料规格:AMS5608 (片材、带材、厚板) AMS5772 (圆棒、锻造材料)188合金是一种固溶体强化材料，具有优异的高温强度和良好的室温加工性能。

它可以在650 ℃和更高的温度下长时间工作。

哈氏耐蚀合金.doc

HASTLLOY®耐腐蚀合金在化工工业得到广泛应用，同时它们也愈来愈多地在能源。

健康与环境。

石油天然气。

制药，烟气脱硫等领域获得应用，使这些领域中的设备更加可靠。

HASTELLOY®合金的突出特点包括好的抗均匀腐蚀性能。

优异的抗局部性能，极好的抗应力腐蚀开裂性能及焊接和加工性能。

HASTLLOY®合金中最通用的 C 类合金。

C-2000®合金既有优异的抗氧化性介质侵蚀性能有优异的抗还原性介质侵蚀性能，代表了华工设备应用材料的重大成就。

C-22®合金对点蚀和缝隙腐蚀具有特别的抵抗能力，常应用于烟气脱硫系统的大多数腐蚀环境及最复杂的制药反应器中。

G-30®合金特别设计用来抵抗商业磷酸侵蚀。

该合金特别成功地应用于化肥工业的热交换管及其他部件中。

由于该合金中的高钴含量，它也是对强氧化性溶液及用混合酸进行酸洗作时的首选合金。

G-35®合金也是专为工业湿法磷酸设计的合金，作为 G-30 的升级版本， G-35 对强氧化性溶液和混合酸有着更好的抵抗能力，同时对卤素离子引起的局部腐蚀也有极好的抵抗能力。

B-3®合金是 B 系列合金中最新一个。

该合金对还原性酸，如盐酸，硫酸等，具有优异的耐蚀性。

与 B 系列其他早期合金比较。

该合金具有更好的热稳定性，并改善了加工性能。

D-205®合金成功地应用与高浓度热硫酸板式换热器中。

与高硅含量的不锈钢相比，该合金具有很多优越性能，包括在含氧介质中抗点蚀性能更好等。

HASTELLOY®耐蚀合金系列传统上，航空燃气涡轮机市场是HASTELLOY®和 HAYNES ®高温合金的主要用户。

伴随着 Haynes 新的，性能更好的结构材料发展，燃气涡轮机性能不断得到改善与提高。

MULTIMET®合金是第一个重要的供给抗空业的HAYNES®高温合金。

紧随其后的HASTELLOYX®合金至今是该工业领域的主角。

高纯度铜铅合金产品资料说明书

MATERIAL SAFETY DATA SHEETHIGH PURITY SOLDER ALLOYS1. PRODUCT & COMPANY IDENTIFICATIONMULTICOMP Premier Farnell plc150 Armley RoadLEEDS LS12 2QQTel. : +44 (0) 870 129 8608FaxEmergency Telephone Number:+44 (0) 870 202530Product Identification : High Purity Tin/Lead Solder Alloys.Trade Name : Ingots, Solid Wire, Pellets, Tinmans & BlowpipeUses : Hand or Machine Soldering.2. COMPOSITION/INFORMATION ON INGREDIENTS.Note: Solder Wire and Bar is considered to be an article and is not subject to the Classification (Hazard Information and Packaging for Supply) Regulations 1994, because it is not hazardous as supplied. However, this product may become hazardous in use and the information included in this data sheet reflects the hazards associated with solder reflow operations.3. HAZARDS IDENTIFICATION.Solder alloys containing lead give off negligible lead fume at normal soldering temperatures and at temperatures up to 500°C. Lead is harmful if absorbed into the body and can cause lead poisoning, birth defects and other reproductive harm.4. FIRST AID MEASURESInhalation : Providing soldering temperature are kept below 500ºC these products will not give off harmful fumes. Any flux used with the products may generate irritating or harmful fumes. The safety data sheet for the flux should be read to ascertain health hazards and appropriate first aid measures.Ingestion : Seek Medical AdviceSkin contact : The constituents of the alloys are not absored through the skin. Contamination of the skin during handing should be removed by washing hands with soap and warm water particularly before eating, drinking or smoking.Eye contact : Fluxes used with these products may generate fumes which may irritate the eyes. Fluxes may spit during soldering. Contact with molton or hot solder will cause severe eye damage. Flush immediately with plenty of water. In cases where spitting flux has entered the eye seek medical attention.5. FIRE FIGHTINGExtinguishers Suitable:dry chemical, carbon dioxide, water spray or foamUnsuitable:water jetTemperatures over 500ºC may produce heavy metal dust, fumes and/or vapours. Fire fighters should wear full protective clothing and positive pressure breathing appartatus.6. ACCIDENTAL RELEASE MEASURES.Not applicable.7. HANDLING - STORAGEAvoid inhaling the fumes emitted by the fluxes used with these products. Ensure that the general area is well ventilated. Wash hands with soap and water after handling solder, particularly before eating, drinking or smoking. The products should be stored in a cool, dry area. Keep out of the reach of children and away from food and drink.8. EXPOSURE CONTROLS / PERSONAL PROTECTIONIn normal soldering operations where the temperature is below 500°C the exposure to lead will be minimal and the risks from the toxic effects of lead insignificant. (Ref: Approved Code of Practice supporting the Control of Lead at Work Regulations.) Extraction should be provided to control exposure to flux fumes. Suitable examples include bench top, soldering iron tip extraction or an extraction arm.Occupational Exposure LimitsSubstance Long term exposure limit Short term exposure limit(8 hour TWA) (15 minute)Lead * 0.15 mg/m³ (MEL) -* From appendix 1 of the Approved Code of Practice supporting the Control of Lead at Work Regulations. Employees should be under medical surveillance if the risk assesment made under the Control of Lead at Work Regulations indicates they are likely to be exposed to significant concentrations of lead, or if an Employment Medical Advisor or appointed doctor so certifies.A women employed on work which exposes her to lead should notify her employer as soon as possible if she becomes pregnant. The Employment Medical Advisor/Appointed Doctor should be informed of the pregnancy.Under the Management of Health and Safety at Work (Amendment) Regulations, employers are required to assess the particular risks to health at work of pregnant workers and workers who have recently given birth or who are breast feeding.Respiratory Protection : Necessary if there is a risk of exposure to flux fumes.Eye Protection : Operators should wear safety glasses or goggles to protect the eyesfrom spitting flux or if there is a risk of contact with molton or hot solder.Hand Protection : Heat resistance leather gloves should be worn if there ia a risk of contactwith molten or hot solder9. PHYSICAL AND CHEMICAL DATAAppearance : Silver-white to grey bars, anodes, sticks, pellets or solid wiresOdour : Odourless at ambient temperatures.Boiling range : The vapour pressure of lead may be significant above 500°C Solubility in Water : Insoluble.10. STABILITY - REACTIVITYConditions to AvoidIf solder is exposed to temperatures above 500°C then lead dust, fume and/or vapour may be produced. Contact of water with molton solder will cause molten metal to be violenty ejected.Materials to AvoidSolder will react with concentrated nitric acid to release toxic fumes of nitric oxide, which oxidises to nitrogen dioxide, a red gas with a pungent odour. If personnel are exposed to these gases then immediate medical attention should be sought, as symptoms can be delayed for a considerable time and can be fatal.Under reducing conditions antimony containing alloys may form the toxic gas stibline (antimony trihydride.)11. TOXICOLOGICAL INFORMATIONAcute ToxicityLead can cause weakness, pains in the joints, vomiting, loss of appetite and stupor.Chronic ToxicityLead can cause weakness, insomnia, headache and possible paralysis. Chronic overexposure to lead may result in damage to the blood forming, nervous, urinary and reproductive systems. Lead is classified as a 2B carcinogen by the IARC (1987), i.e. evidence of carcinogenicity is adequate in animals but inadequate for humans. Severe lead toxicity has long been known to cause sterility, abortion and neonatal mortality and morbidity.12. ECOLOGICAL INFORMATIONLead is not degradable and will persist in the environment. Lead is insoluble in water and is not attacked by most inorganic acids and bases.13. DISPOSAL CONSIDERATIONSWherever possible unwanted solder should be recycled for recovery of metal. Otherwise disposal should be in accordance with local and national legislation. In the UK this is the Control of Pollution Act 1974, the Environmental Protection Act 1990 and regulations made under them.14. TRANSPORT INFORMATIONSolder alloys are not classified as hazardous for transport.15. REGULATORY INFORMATIONClassification according to the Chemicals (Hazard information and Packaging for Supply) Regulations 1994:Tin/lead solder alloy is considered to be an article and is not subject to the above regulations. However, it is recommended that the following information be included on labels:Contains lead which may harm your health. Lead can cause birth defects and other reproductive harm. Regulations forbid the use of lead containing solder in any private or public drinking water supply system.After handling solder wash hands with soap and water before eating, drinking and smoking.Keep out of the reach of children.Applicable EC DirectivesDirective 82/605/EEC on the protection of workers from the risks related to the exposure to metallic lead and its ionic compounds at work.Directive 80/1107/EEC on the protection of workers from the risk related to physical, chemical and biological agents at work.Directive 92/85/EEC on the introduction of measures to encourage improvements in the safety and health at work of pregnant workers and workers who have recently given birth or are breastfeedingApplicable UK LegislationThe Health and Safety at Work etc Act 1974The Control of Lead at Work Regulation 1998The Control of Substances Hazardous to Health Regulations 1999The Management of Health and Safety at Work Regulations 1999.The information contained in this safety data sheet is accurate to the best of knowledge and belief.16. OTHER INFORMATIONRecommended UsesThis safety data sheet covers a range of alloys in the form of wire and bar. Reference should be made to the Further Detailed Guidance from the UK Health and Safety ExecutiveHS(G)37: An Introduction to local Exhaust VentilationHS(G)53: Respiratory Protective Equipment – a Practical Guide for UsersHS(G)97: A Step by Step Guide to the COSHH RegulationsApproved Code of Practice to the Control of Lead at Work RegulationsApproved Code of Practice – Management of Health and Safety at WorkGeneral Approved Code of Practice to the COSHH RegulationsEH40: Occupational Exposure Limits (revised annually)This safety data sheet is based on the requirement of the Chemicals (Hazard Information and Packaging for Supply) Regulations 1994, (Commission Directive 91/155/EEC, as amended by Directive 93/112/EEC)Issued September 2007 Issue 4Reason for revision: General Update of Health and Safety Data Sheet.。

泊洛沙姆188安全技术说明书

安全技术说明书页: 1/10 巴斯夫安全技术说明书按照GB/T 16483编制日期 / 本次修订: 21.05.2023版本: 4.0日期/上次修订: 29.12.2021上次版本: 3.2日期 / 首次编制: 04.07.2013产品: 泊洛沙姆188Product: Lµtrol® micro 68(30241530/SDS_GEN_CN/ZH)印刷日期 13.11.20231. 化学品及企业标识泊洛沙姆188Lµtrol® micro 68推荐用途和限制用途: 药用辅料公司:巴斯夫(中国)有限公司中国上海浦东江心沙路300号邮政编码 200137电话: +86 21 20391000传真号: +86 21 20394800E-mail地址: **********************紧急联络信息:巴斯夫紧急热线中心（中国）+86 21 5861-1199巴斯夫紧急热线中心（国际）:电话: +49 180 2273-112Company:BASF (China) Co., Ltd.300 Jiang Xin Sha RoadPu Dong Shanghai 200137, CHINA Telephone: +86 21 20391000Telefax number: +86 21 20394800E-mail address: ********************** Emergency information:Emergency Call Center (China):+86 21 5861-1199International emergency number: Telephone: +49 180 2273-1122. 危险性概述纯物质和混合物的分类:根据 GHS 标准，该产品不需要进行分类。

巴斯夫安全技术说明书日期 / 本次修订: 21.05.2023版本: 4.0产品: 泊洛沙姆188Product: Lµtrol® micro 68(30241530/SDS_GEN_CN/ZH)印刷日期 13.11.2023 标签要素和警示性说明:根据GHS标准，该产品不需要添加危险警示标签其它危害但是不至于归入分类:在一定条件下，产品可形成粉尘爆炸。

MC10H158MEL中文资料

MC10H158Quad 2−Input Multiplexer (Non−Inverting)DescriptionThe MC10H158 is a quad two channel multiplexer with common input select. A “high” level select enables input D00, D10, D20 and D30 and a “low” level select enables input D01, D11, D21 and D31. This MECL 10H™ part is a functional/pinout duplication of the standard MECL 10K™ family part, with 100% improvement in propagation delay and no increase in power−supply current. Features•Propagation Delay, 1.5 ns Typical•Power Dissipation, 197 mW Typical•Improved Noise Margin 150 mV (Over Operating V oltage and Temperature Range)•V oltage Compensated•MECL 10K Compatible•Pb−Free Packages are Available*DIPPIN ASSIGNMENTQ0 Q1 D11 D10 D01 D00 NC V EEV CCQ2Q3D20D21D30D31SELECT16151413121110912345678TRUTH TABLESelect D0D1QL L LXL H HXH X LLH X HHPin assignment is for Dual−in−Line Package.For PLCC pin assignment, see the Pin Conversion Tables on page 18of the ON Semiconductor MECL Data Book (DL122/D).*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.See detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet.ORDERING INFORMATIONTable 1. MAXIMUM RATINGSSymbol Characteristic Rating Unit V EE Power Supply (V CC = 0)−8.0 to 0Vdc V I Input Voltage (V CC = 0)0 to V EE VdcI out Output Current− Continuous− Surge 50100mAT A Operating Temperature Range0 to +75°CT stg Storage Temperature Range− Plastic− Ceramic −55 to +150−55 to +165°C°CMaximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.Table 2. ELECTRICAL CHARACTERISTICS (V EE = −5.2 V ±5%)0°25°75°Symbol Characteristic Min Max Min Max Min Max UnitI E Power Supply Current−53−48−53mAI inH Input Current HighPin 9Pins 3−6 and 10−13−−475515−−295320−−295320m AI inL Input Current Low0.5−0.5−0.3−m AV OH High Output Voltage−1.02−0.84−0.98−0.81−0.92−0.735Vdc V OL Low Output Voltage−1.95−1.63−1.95−1.63−1.95−1.60Vdc V IH High Input Voltage−1.17−0.84−1.13−0.81−1.07−0.735Vdc V IL Low Input Voltage−1.95−1.48−1.95−1.48−1.95−1.45Vdc 1.Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has beenestablished. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is maintained. Outputs are terminated through a 50 W resistor to −2.0 V.Table 3. AC PARAMETERS0°25°75°Symbol Characteristic Min Max Min Max Min Max Unit t pd Propagation DelayData Select 0.51.01.92.90.51.01.92.90.51.02.02.9nst r Rise Time0.7 2.20.7 2.20.7 2.2ns t f Fall Time0.7 2.20.7 2.20.7 2.2ns NOTE:Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declaredoperating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously.LOGIC DIAGRAMV CC = PIN 16V EE = PIN 8SELECT 9D0 1 5D0 0 6D1 1 3D1 0 4D2 1 12D2 0 13D3 1 10D3 0 111 Q02 Q115 Q214 Q3ORDERING INFORMATIONDevicePackage Shipping †MC10H158FN PLLC −2046 Units / Rail MC10H158FNG PLLC −20(Pb −Free)46 Units / Rail MC10H158FNR2PLLC −20500 / Tape & Reel MC10H158FNR2G PLLC −20(Pb −Free)500 / Tape & Reel MC10H158L CDIP −1625 Unit / Rail MC10H158M SOEIAJ −1650 Unit / Rail MC10H158MG SOEIAJ −16(Pb −Free)50 Unit / Rail MC10H158MEL SOEIAJ −162000 / Tape & Reel MC10H158MELG SOEIAJ −16(Pb −Free)2000 / Tape & Reel MC10H158P PDIP −1625 Unit / Rail MC10H158PGPDIP −16(Pb −Free)25 Unit / Rail†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.PACKAGE DIMENSIONSSL−MS 0.010 (0.250) NST 20 LEAD PLLC CASE 775−02ISSUE ENOTES:1.DIMENSIONS AND TOLERANCING PER ANSI Y14.5M,1982.2.DIMENSIONS IN INCHES.3.DATUMS −L −, −M −, AND −N − DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE.4.DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM −T −, SEATING PLANE.5.DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.6.DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300).DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY .7.DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBARPROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBARINTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.3850.3959.7810.03B 0.3850.3959.7810.03C 0.1650.180 4.20 4.57E 0.0900.110 2.29 2.79F 0.0130.0190.330.48G 0.050 BSC 1.27 BSC H 0.0260.0320.660.81J 0.020−−−0.51−−−K 0.025−−−0.64−−−R 0.3500.3568.899.04U 0.3500.3568.899.04V 0.0420.048 1.07 1.21W 0.0420.048 1.07 1.21X 0.0420.056 1.07 1.42Y −−−0.020−−−0.50Z 2 10 2 10 G10.3100.3307.888.38K10.040−−− 1.02−−−____PACKAGE DIMENSIONSSOEIAJ −16CASE 966−01ISSUE ANOTES:1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.CDIP −16L SUFFIXCERAMIC DIP PACKAGECASE 620A −01NOTES:1.DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.2.CONTROLLING DIMENSION: INCH.3.DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL.4.DIMENSION F MAY NARROW TO 0.76 (0.030)WHERE THE LEAD ENTERS THE CERAMIC BODY.5THIS DRAWING REPLACES OBSOLETE CASE OUTLINE 620−10.AM0.25 (0.010)T DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.7500.78519.0519.93B 0.2400.295 6.107.49C −−−0.200−−− 5.08D 0.0150.0200.390.50E 0.050 BSC 1.27 BSC F 0.0550.065 1.40 1.65G 0.100 BSC 2.54 BSC H 0.0080.0150.210.38K 0.1250.170 3.18 4.31L 0.300 BSC 7.62 BSC M 0 15 0 15 N0.0200.0400.51 1.01____PACKAGE DIMENSIONSNOTES:1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.2.CONTROLLING DIMENSION: INCH.3.DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL.4.DIMENSION B DOES NOT INCLUDE MOLD FLASH.5.ROUNDED CORNERS OPTIONAL.MDIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.7400.77018.8019.55B 0.2500.270 6.35 6.85C 0.1450.175 3.69 4.44D 0.0150.0210.390.53F 0.0400.70 1.02 1.77G 0.100 BSC 2.54 BSC H 0.050 BSC 1.27 BSC J 0.0080.0150.210.38K 0.1100.130 2.80 3.30L 0.2950.3057.507.74M 0 10 0 10 S0.0200.0400.51 1.01____PDIP −16P SUFFIXPLASTIC DIP PACKAGEON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.PUBLICATION ORDERING INFORMATIONMECL 10H and MECL 10K are trademarks of Motorola, Inc.。

MB98D81223资料

2M/4M-BYTE 3 V-ONL Y FLASH MINIATURE CARDThe Fujitsu Flash Miniature cards conform to “Miniature Card Speciﬁcation” pubulished by MCIF; Miniature Card Implementers Forum.The Fujitsu Flash Miniature cards are small form factor Flash memory cards targeted various markets; digital pho-tography, audio recording, hand held PCs and other small portable equipments. Miniature cards’ high performance, small size (38 mm × 33 mm × 3.5 mm), low cost and simple interface are ideal for portable applications that require high speed ﬂash disk drives or eXecute In Place (XIP).The Flash Miniature cards are 5 V-only operational and allow the users to use as ×8 or ×16 organization on low power at high speed.•Small size: 33.0 mm (length) × 38.0 mm (width) × 3.5 mm (thickness)•+3.3 V power supply program and erase•Command control for Automated Program/Automated Erase operation•Erase Suspend Read/Program Capability•128 KB Sector Erase (at ×16 mode)•Any Combination of Sectors Erase and Full Chip Erase•Detection of completion of program/erase operation with Data# Polling or Toggle bit.•Ready/Busy Output with BUSY#•Reset Function with RESET# pin•Write protect function with WP switch•Low VCC Write Inhibit•AIS (Attribute Information Structure) is available from the address “0000H” of Lower Byte.2MB98D81123/81223-15s PACKAGEs DESCRIPTIONDIFFERENCESMB98D81123MB98D81223 Density 2 MB 4 MB Memory Device8 M bit8 M bit Quantity24 Read 1 B unit←Program 1 B unit←Chip Erase 1 MB unit 1 MB unit Sector Erase64 KB unit←Number of Sectors3264 Erase Suspend Read Yes Yes Erase Suspend Program Yes Yes Address A0 to A19A0 to A20 RESET#Yes Yes BUSY#Yes Yes(CRD-60P-M02)MB98D81123/81223-15s PAD ASSIGNMENTSPad No Symbol Pad No Symbol Pad No Symbol Pad No Symbol 1A1816N.C.31A1946CD#2A1617N.C.32A1747N.C.3A1418OE#33A1548BUSY#4N.C.19D1534A1349WE#5CEH#20D1335A1250D146A1121D1236RESET#51RFU7A922D1037A1052D118A823D938VS1#53VS2#9A624D039A754D810A525D240N.C.55D111A326D441A456D312A227N.C.42CEL#57D513A028D743A158D614N.C.29N.C.44N.C.59N.C.15N.C.30N.C.45N.C.60A20 *EX 1V CC EX 2GND EX 3CINS#* :A20 is “N.C.” for MB98D81123.34MB98D81123/81223-15s PAD DESCRIPTIONS* :T ake notice that those pads are connected internally.s PAD LOCATIONSSymbol I/O Pad Name Symbol I/O Pad Name A0 to A20I Address Input BUSY#O Ready/BusyD0 to D15I/O Data Input/Output CD#O Card Detect *CEL#I Card Enable for Lower Byte VS1#, VS2#O Voltage Sense CEH#I Card Enable for Upper Byte N.C.—Non Connection OE#I Output Enable V CC—Power SupplyWE#I Write Enable GND—GroundRESET#I Hardware Reset CINS#OCard InsertionMB98D81123/81223-15s BLOCK DIAGRAMMB98D8112356MB98D81123/81223-15 MB98D812237MB98D81123/81223-15s CHIP AND SECTOR DECODINGERASE SECTOR DECODING TABLESector Address (SA)A 19A 18A 17A 16Sector 151111Sector 141110Sector 13111Total 16 sectors per 1 chip••••••••••••••••Sector 20010Sector 10001Sector 08MB98D81123/81223-15s CHIP CONFIGURATIONThe miniature cards use 2 or 4 pcs of Flash Memory.•2 pcs of Flash Memory are operated simultaneously at 16 bit mode and even number of chip is applied to lower byte and odd number of chip is applied to upper byte.At ×8 bit mode, even address and odd address are selected with CEL# and CEH#.× 16 bit mode1CEL# = “L”, CEH# = “L”::Odd Number of Chip + Even Number of ChipOdd Number of Chip + Even Number of ChipOdd Number of Chip + Even Number of ChipOdd Number of Chip + Even Number of ChipD15 • • • • • • • • • • • • • • D0003h002h001h000h2× 8 bit modeCEL# = “H”, CEH# = “L”::odd Number of Chipodd Number of Chipodd Number of Chipodd Number of ChipD15 • • • •D8003h002h001h000hCEL# = “L”, CEH# = “H”::even Number of Chipeven Number of Chipeven Number of Chipeven Number of ChipD7 • • • • •D0003h002h001h000hMB98D81123/81223-15s FUNCTION DESCRIPTIONS1.Read ModeThe data in the common can be read with “OE#=VIL” and “WE#=VIH”. The address is selected with A0-A20.And CEL# and CEH# select output mode.2.Standby Mode–CEL# and CEH# at “VIH” place the card in Standby mode. D0-D15 are placed in a high-Z state independent of the status “OE#” and “WE#”.3.Output Disable Mode–The outputs are disabled with OE# and WE# at “VIH”. D0-D15 are placed in high-Z state.4.Write Mode1) Common Memory Write–The card is in Write mode with “OE#=VIH” and “WE# and CE#=VIL”.–Commands can be written at the Write mode.–Two types of the Write mode, “WE# control” and “CE# control” are available.mand Deﬁnitions–User can select the card operation by writing the speciﬁc address and data sequences into the command register. If incollect address and data are written or improper sequence is done, the card is reseted to read mode. See “COMMAND DEFINISION T ABLE”.6.Automated Program Capability–Programming operation can switch the data from “1” to “0”.–The data is programmed on a byte-by-byte or word-by-word basis.–The card will automatically provide adequate internally generated programming pulses and verify the pro-grammed cell margin by writing four bus cycle operation. The card returns to Common Memory Read mode automatically after the programming is completed.–Addresses are latched at falling edge of WE# or CE# and data is latched at rising edge of WE# or CE#. The fourth rising edge of WE# or CE# on the command write cycle begins programming operation.–We can check whether a byte (word) programming operation is completed successfully by sequence ﬂug with BUSY#, Data# Polling or Toggle Bit function. See “WRITE OPERATION STATUS”.–Any commands written to the chip during programming operation will be ignored.7.Automated Chip Erase Capability–We can execute chip erase operation by 6 bus cycle operation. Chip erase does not require the user to program the chip prior to erase. Upon executing the Erase command sequence the chip automatically will program and verify the entire memory for an all zero data pattern prior to electrical erase. The system is not required to provide any controls or timing during these operations.–The card returns to Common Memory Read mode automatically after the chip erasing is completed.–Whether or not chip erase operation is completed successfully can be checked by sequence ﬂug with BUSY#, Data# Polling or Toggle Bit function. See “WRITE OPERATION STATUS”.–Any commands written to the chip during programming operation will be ignored.910MB98D81123/81223-158.Automated Sector Erase Capability–We can execute the erase operation on any sectors by 6 bus cycle operation.–A time-out of 50 µs (typ.) from the rising edge of the last Sector Erase command will initiate the Sector Erase command(s).–Multiple sectors in a chip can be erased concurrently. This sequence is followed with writes of 30H to addresses in other sectors desired to be concurrently erased. The time between writes 30H must be less than 50 µs, otherwise that command will not be accepted. Any command other than Sector Erase or Erase Suspend during this time-out period will reset the chip to Read mode. The automated sector erase begins after the 50µs (typ.) time out from the rising edge of WE# pulse for the last Sector Erase command pulse. Whether the sector erase window is still open can be monitored with D3 and D11.–Sector Erase does not require the user to program the chip prior to erase. The chip automatically programs “0” to all memory locations in the sector(s) prior to electrical erase. The system is not required to provide any controls or timing during these operations.–The card returns to Common Memory Read mode automatically after the chip erasing is completed.–Whether or not sector erase operation is completed successfully can be checked by sequence ﬂug with BUSY#, Data# Polling or T oggle Bit function. The sequence ﬂug must be read from the address of the sector involved in erase operation. See “WRITE OPERATION STA TUS”.9.Erase Suspend–Erase Suspend command allows the user to interrupt the sector erase operation and then do data reads or program from or to a non-busy sector in the chip which has the sector(s) suspended erase. This command is applicable only during the sector erase operation (including the sector erase time-out period after the sector erase commands 30H) and will be ignored if written during the chip erase or programming operation. Writing this command during the time-out will result in immediate termination of the time-out period. The addresses are “don’t cares” in wrinting the Erase Suspend or Resume commands in the chip.–When the Erase Suspend command is written during a Sector Erase operation, the chip will enter the Erase Suspend Read mode. User can read the data from other sectors than those in suspention. The read operation from sectors in suspention results D2/D10 toggling. User can program to non-busy sectors by writing program commands.–A read from a sector being erase suspended may result in invalid data.10. Intelligent Identiﬁer (ID) Read Mode–Each common memory can execute an Intelligent Identiﬁer operation, initiated by writing Intelligent ID com-mand (90H). Following the command write, a read cycle from address 00H retrieves the manufacture code, and a read cycle from address 01H returns the device code as follows. To terminate the operation, it is necessary to write Read/Reset command.11. Hardware Reset–The Card may be reset by driving the RESET# pin to VIL. The RESET# pin must be kept High (VIL) for at least 500 ns. Any operation in progress will be terminated and the card will be reset to the read mode 20 µs after the RESET# pin is driven Low. If a hardware reset occurs during a program operation, the data at that particular location will be indeterminate.–When the RESET# pin is Low and the internal reset is complete, the Card goes to standby mode and cannot be accessed. Also, note that all the data output pins are High-Z for the duration of the RESET# pulse. Once the RESET# pin is taken high, the Card requires 500 ns of wake up time until outputs are valid for read access.–If hardware reset occurs during a erase operation, there is a possibility that the erasing sector(s) cannot be used.12. Data Protection–The card has WP (Write Protect) switch for write lockout.–To avoid initiation of a write cycle during V CC power-up and power-down, a write cycle is locked out for V CC less than 3.2 V. If V CC < V LKO, the command register is disabled and all internal program/erase circuits are disabled.Under this condition the device will reset to the read mode. Subsequent writes will be ignored until the V CC level is greater than V LKO.It is the users responsibility to ensure that the control pins are logically correct to prevent unintentional writes when V CC is above 3.2 V.–If V CC would be less than V LKO during program/erase operation, the operation will stop. And after that, the operation will not resume even if V CC returns recommended voltage level. Therefore, program command must be written again because the data on the address interrupted program operation is invalid. And regarding interrupting erase operation, there is possibility that the erasing sector(s) cannot be used.–Noise pulses of less than 5 ns (typical) on OE#, CE# or WE# will not initiate a write cycle.s FUNCTION TRUTH TABLEH : “H” level, L : “L ” level , X : “H” or “L ”Note:*1.WPSW = Write Protect Switch, NP = NON-PROTECT, P = PROTECTMode RESET#CEH#CEL#OE#WE#WPSW *1Data Input/Output D8 to D15D0 to D7Hardware ResetLX X X X P or NP High-Z High-Z Standby H H H XXP or NPHigh-Z High-Z Read (×8 bit)H L LHP or NPHigh-Z DOUT L H DOUT High-Z Read (×16 bit)L L DOUT DOUT Write (×8 bit)H L HLNPHigh-Z DIN L H DIN High-Z Write (×16 bit)L L DIN DIN Output DisableHL P High-Z High-Z L H High-Z High-Z LLHigh-ZHigh-Zs COMMAND DEFINITION TABLECommand Table for 8-bit ModeNote:CA:Chip Address.(address in chip selected by A20 for MB98D81223)SA:Sector Address (address in 64 KB selected by A16, A17, A18, A19 and A20)P A:Program Address (address to be programmed)RA:Read Address (address to be read)IA:Intelligent ID read address (Manufacture Code 0000H, Device Code 0001H)PD:Programming data RD:Read dataID:Intelligent Identiﬁer (ID) CodeCommandBusCycle 1st Bus Write Cycle 2nd BusWrite/Read Cycle 3rd BusWrite Cycle 4th BusWrite/Read Cycle5th BusWrite Cycle 6th Bus Write CycleRead/Reset 12Write Read CAF0HRARDRead/Reset 24Write Write Write Read CAAAHCA55HCAF0HRARDRead Intelligent ID Codes 4Write Write Write Read CAAAHCA55HCA90HIAIDByte Program4Write Write Write Write CAAAHCA55HCAA0HPAPDSector Erase 6Write Write Write Write Write Write CAAAHCA55HCA80HCAAAHCA55HSA30HChip Erase 6Write Write Write Write Write Write CAAAHCA55HCA80HCAAAHCA55HCA10HSector Erase Suspend 1Write CAB0HSector Erase Resume 1Write CA30HCommand Table for 16-bit ModeNote:CA:Chip Address.(address in chip selected by A20 for MB98D81223)SA:Sector Address (address in 128 KB selected by A16, A17, A18, A19 and A20)P A:Program Address (address to be programmed)RA:Read Address (address to be read)IA:Intelligent ID read address (Manufacture Code 0000H, Device Code 0001H)PD:Programming data RD:Read dataID:Intelligent Identiﬁer (ID) CodeCommandBusCycle 1st Bus Write Cycle 2nd BusWrite/Read Cycle 3rd BusWrite Cycle 4th BusWrite/Read Cycle5th BusWrite Cycle 6th Bus Write CycleRead/Reset 12Write Read CAF0F0HRARDRead/Reset 24Write Write Write Read CAAAAAHCA5555HCAF0F0HRARDRead Intelligent ID Codes 4Write Write Write Read CAAAAAHCA5555HCA9090HIAIDByte Program4Write Write Write Write CAAAAAHCA5555HCAA0A0HPAPDSector Erase 6Write Write Write Write Write Write CAAAAAHCA5555HCA8080HCAAAAAHCA5555HSA3030HChip Erase 6Write Write Write Write Write Write CAAAAAHCA5555HCA8080HCAAAAAHCA5555HCA1010HSector Erase Suspend 1Write CAB0B0HSector Erase Resume 1Write CA3030Hs WRITE OPERATION STATUSHardware Sequence Flag Table(1): Erase Suspended Sector (2): Non-Erase Suspended SectorNotes:*1.Performing successive read operations from the erase-suspended sector will cause D 2, D 10 to toggle.*2.Performing successive read operations from any address will cause D 6, D 14 to toggle.*3.Reading the byte address being programmed while in the erase-suspend program mode will indicatelogic ‘1’ at the D 2, D 10 bit. However, successive reads from the erase-suspended sector will cause D 2,D 10 to toggle.D7, D15 (Data# Polling)The card features Data# Polling as a method to indicate to the host that the Program/Erase Operation are in progress or completed. During the program operation an attempt to read the program address will produce the compliment of the data last written to D 7/D 15. Upon completion of the program operation, an attempt to read the program address will produce the true data last written to D 7/D 15. During the erase operation, an attempt to read the program address will produce a “0” at the D 7/D 15 output. Upon completion of the erase operation an attempt to read the device will produce a “1” at the D 7/D 15 output.For Chip Erase, the Data# Polling is valid after the rising edge of the sixth WE# pulse in the six write pulse sequence. For sector erase, the Data# Polling is valid after the last rising edge of the sector erase WE# pulse.Even if the device has completed the operation and D 7/D 15 has a valid data, the data outputs on D 0 to D 6/D 8 to D 14 may be still invalid. The valid data on D 0 to D 7/D 8 to D 15 will be read on the successive read attempts.The Data# Polling feature is only active during the programming operation, erase operation, sector erase time-out, Erase Suspend Read mode and Erase Supend Program mode.D6, D14 (Toggle Bit I)The card also features the “Toggle Bit” as a method to indicate to the host system that the Program/Erase Operation are in progress or completed.During an Program or Erase cycle, successive attempts to read (OE# or CE# toggling) data from the card will result in D 6/D 14 toggling between one and zero. Once the Program or Erase cycle is completed, D 6/D 14 will stop toggling and valid data will be read on the next successive attempts. During programming, the Toggle Bit is valid after the rising edge of the fourth WE# pulse in the four write pulse sequence. For chip erase, the Toggle Bit is valid after the rising edge of the sixth WE# pulse in the six write pulse sequence. For sector erase, the Toggle Bit is valid after the last rising edge of the sector erase WE# pulse. The Toggle Bit is also active during the sector time out.Either CE# or OE# toggling will cause the D 6/D 14 to toggle.Status D 7, D 15D 6, D 14D 5, D 13D 3, D 11D 2, D 10BUSY#InProgressProgramming D 7#, D 15#Toggle 0010Erasing0Toggle 01Toggle 0Erase Suspend Read(1)1100Toggle *11(2)Data Data Data Data Data 1Erase Suspend Program D 7#, D 15#T oggle *200*1, *30Exceeded Time LimitsProgrammingD 7#, D 15#Toggle 1010Erasing 0Toggle 11N/A 0Erase Suspend ProgramD 7#, D 15#Toggle1N/AD5, D13 (Exceeded Timing Limits)D5/D13 will indicate if the program or erase time has exceeded the speciﬁed limits (internal pulse count). Under these conditions D5/D13 will produce a “1”. This is a failure condition which indicates that the program or erase cycle was not successfully completed. Data# Polling is the only operating function of the card under this condition.If this failure condition occurs during sector erase operation, it speciﬁes that a particular sector is bad and it may not be reused, however, other sectors are still functional and may be used for the program or erase operation.The chip must be reset to use other sectors. Write the Reset command sequence to the chip, and then execute Program or Erase command sequence. This allows the system to continue to use the other active sectors in the chip.If this failure condition occurs during the chip erase operation, it speciﬁes that the entire chip is bad or combination of sectors are bad.If this failure condition occurs during the byte programming operation, it speciﬁes that the entire sector containing that byte is bad and this sector may not be reused, (other sectors are still functional and can be reused).The D5/D13 failure condition may also appear if a user tries to program a non blank location without erasing. In this case the card locks out and never completes the card operation. Hence, the system never reads a valid data on D7/D15 bit and D6/D14 never stops toggling. Once the card has exceeded timing limits, the D5/D13 bit will indicate a “1”. Please note that this is not a device failure condition since the device was incorrectly used.D3, D11 (Sector Erase Timer)After the completion of the initial sector erase command sequence the sector erase time-out will begin. D3/D11 will remain low until the time-out is complete. Data# Polling and Toggle Bit are valid after the initial sector erase command sequence.If Data# Polling or the T oggle Bit indicates the card has been written with a valid erase command, D3/D11 may be used to determine if the sector erase timer window is still open. If D3/D11 is high (“1”) the internally controlled erase cycle has begun; attempts to write subsequent commands to the card will be ignored until the erase operation is completed as indicated by Data# Polling or Toggle Bit. If D3/D11 is low (“0”), the card will accept additional sector erase commands. T o insure the command has been accepted, the system software should check the status of D3/D11 prior to and following each subsequent sector erase command. If D3/D11 were high on the second status check, the command may not have been accepted.Refer to T able: Hardware Sequence Flags.D2, D10This T oggle bit, along with D6, can be used to determine whether the card is in the Erase operation or in Erase Suspend.Successive reads from the erasing sector will cause D2 to toggle during the Erase operation. If the card is in the erase-suspended-read mode, successive reads from the erase-suspended sector will cause D2 to toggle. When the card is in the erase-suspended-program mode, successive reads from the byte address of the non-erase suspended sector will indicate a logic ‘1’ at the D2 bit.D6 is different from D2 in that D6 toggles only when the standard Program or Erase, or Erase Suspend Program operation is in progress.BUSY#The card provides a BUSY# open-drain output pin as a way to indicate to the system that the program or erase operation are either in progress or has been completed. If the output is low, the card is busy with either a program or erase operation. If the card is placed in an Erase Suspend mode, the BUSY# output will be high.During programming, the BUSY# pin is driven low after the rising edge of the fourth WE# pulse. During an erase operation, the BUSY# pin is driven low after the rising edge of the sixth WE# pulse. The BUSY# pin will indicatea busy condition during the RESET# pulse.s PROGRAM/ERASE FLOWCHARTs ABSOLUTE MAXIMUM RATINGS *1*1.Permanent device damage may occur if the above Absolute Maximum Ratings are exceeded. Functionaloperation should be restricted to the conditions as detailed in the operational sections of this data sheet.Exposure to absolute maximum rating conditions for extended periods may affect device reliability.s RECOMMENDED OPERATING CONDITIONSs DC CHARACTERISTICSNotes:*1.This value does not apply to CEL#, CEH# and WE#.*2.This value does not apply to CD# and CINS#.ParameterSymbol Value Unit Supply Voltage V CC –0.5 to +5.5V Input Voltage V IN –0.5 to V CC +0.5V Output VoltageV OUT –0.5 to V CC +0.5V Temperature under Bias T A 0 to +60°C Storage T emperatureT STG–30 to +70°CParameterSymbol Min Typ Max Unit V CC Supply Voltage V CC 3.1353.30 3.465V GroundGND 0V Ambient T emperatureT A055°CParameterTest ConditionsSymbol ValueUnit MinTypMax Input Leakage Current *1V CC = V CC max., V IN = GND or V CCI LI ±10µA Output Leakage Current *2V CC = V CC max., V IN = GND or V CC I LO ±10µA Standby CurrentCEL#, CEH#,RESET# = V CC ±0.3 V I SB1—1070µA CEL#, CEH#, RESET# = V IHI SB2 5.0mA Active Read Current V CC = V CC max., CEL#, CEH# = V IL Cycle = 150 ns, I OUT = 0 mA I CC15080mA Program Current Program in progress (×16 mode)I CC260100mA Erase Current Erase in progress (×16 mode)I CC360100mA Input Low Voltage —V IL –0.5—0.6V Input High Voltage —V IH 0.7 V CC—V CC +0.5V Output Low Voltage I OL = 4.0 mA, V CC = V CC min.V OL 0.45V Output High Voltage I OH = –2.0 mA, V CC = V CC min.V OH 2.4V Low V CC Lock-out Voltage—V LKO2.3—2.5Vs CAPACITANCE (T A = 25°C, f = 1 MHz, V IN = V I/O = GND)Parameter Symbol Min Max Unit Input Capacitance *1C IN40pF I/O Capacitance *2C I/O40pF Notes:*1.This value does not apply to CEL#, CEH# and WE#.*2.This value does not apply to VS1#, CD# and CINS#.s AC TEST CONDITIONS•Input Pulse Levels: V IH = 3.0 V, V IL = 0.0 V•Input Pulse Rise and Fall Times: 5 ns•Timing Reference LevelsInput: V IL = 1.5 V, V IH = 1.5 VOutput: V OL = 1.5 V, V OH = 1.5 VOutput Load: 1TTL +100 pFs PROGRAM AND ERASE PERFORMANCESParameter Min Typ Max Unit Byte Program Time *183600µs Chip Programming Time *18.4T.B.D.Sec. Sector Erase Time *2115Sec. Program/Erase Cycles100,000Cycles Notes:*1.Excludes system-level overhead.*2.Excludes 00H programming prior to erasure.s AC CHARACTERISTICS(Recommended operating conditions unless otherwise noted.)READ CYCLE *1Parameter Symbol Min Max Unit Read Cycle Time t RC150ns Card Enable Access Time t CE150ns Address Access Time t ACC150ns Output Enable Access Time t OE75ns Card Enable to Output in Low-Z *2t CLZ5ns Card Disable to Output in High-Z *2t CHZ75ns Output Enable to Output in Low-Z *2t OLZ5ns Output Disable to Output in High-Z *2t OHZ60ns Output Hold from Address Change t OH0ns Ready Time from RESET#t RDY20µs Notes:*1.Rise/Fall time < 5 ns.*2.T ransition is measured at the point of ±500 mV from steady state voltage.PROGRAM/ERASE CYCLENotes:*1.These do not include the preprogramming time.*2.Not 100% tested.ParameterSymbol Min TypMaxUnit Write Cycle Time t WC 150ns Address Setup Time t AS 20ns Address Hold Time t AH 20ns Data Setup Time t DS 50ns Data Hold Timet DH 20ns Read Recovery Time (WE# control)t GHWL 10ns Read Recovery Time (CE# control)t GHEL 10ns Output Enable Hold Time t OEH 10ns Card Enable Setup Time t CS 0ns Card Enable Hold Time t CH 10ns Write Enable Pulse Width t WP 80ns Write Enable Setup Time t WS 0ns Write Enable Hold Time t WH 10ns Card Enable Pulse Widtht CP 100ns Duration of Byte Program Operation (/WE Control)t WHWH18µs Duration of Erase Operation *1 (/WE Control)t WHWH2115s Duration of Byte Program Operation (/CE Control)t EHEH18µs Duration of Erase Operation *1(/CE Control)t EHEH2115s V CC Setup Time *2t VCS 50µs Reset Pulse Width t RP 500ns Busy Delay Timet BSY90nss TIMING DIAGRAMREAD CYCLE TIMING DIAGRAM (WE# = V IH, RESET# = V IH)READ CYCLE TIMING DIAGRAM (continued) (WE# = V IH, RESET# = V IH)READ CYCLE TIMING DIAGRAM (continued) (WE# = V IH, RESET# = V IH)3132PROGRAM CYCLE TIMING DIAGRAM (WE# = CONTROLLED, RESET# = V IH)Notes:*1.See “FUNCTION TRUTH TABLE”.*2.PCMA1/PCMA2 = Command Address for Program, PA = Program Address, PD = Program Data. See “COMMAND DEFINITION TABLE”.PROGRAM CYCLE TIMING DIAGRAM (CE# = CONTROLLED, RESET# = V IH)Notes:*1.See “FUNCTION TRUTH TABLE”.*2.PCMA1/PCMA2 = Command Address for Program, PA = Program Address, PD = Program Data. See “COMMAND DEFINITION TABLE”.3334ERASE CYCLE TIMING DIAGRAM (WE# = CONTROLLED, RESET# = V IH)Notes:*1.See “FUNCTION TRUTH TABLE”.*MA1/CCMA2 = Command Address for Chip Erase, SCMA1/SCMA2 = Command Address for Sector Erase, SA = Sector Address. See “COMMAND DEFINITION TABLE”.ERASE CYCLE TIMING DIAGRAM (CE# = CONTROLLED, RESET# = V IH)Notes:*1.See “FUNCTION TRUTH TABLE”.*MA1/CCMA2 = Command Address for Chip Erase, SCMA1/SCMA2 = Command Address for Sector Erase, SA = Sector Address. See “COMMAND DEFINITION TABLE”.3536DATA# POLLING CYCLE TIMING DIAGRAM (RESET# = V IH)Notes:*1.VA = PA for Programming Cycle, VA = SA for Sector Erase, VA = CA for Chip Erase.*2.See “FUNCTION TRUTH TABLE”.*3.t EHEH1,2 for CE# Control.*4.Program/Erase operation is ﬁnished.。

Omega Engineering HTWAT系列丝绒热带电热带电热带说明书

IMPORTANT SAFETY INSTRUCTIONS
A person who has not read and understood all installation instructions is not qualiﬁed to install this product.
Agency Approvals
• All electrical wiring must follow local electrical codes and highly recommend following NEC Article 427.
• Final installation / wiring is to be inspected by the authority who has jurisdiction in the area that the heating tape is installed.
SAFETY ALERT SYMBOL
Immediate hazards which WILL result in severe personal injury or death
The symbol above is used to call your attention to instructions concerning your personal safety. It points out important safety precautions. It means “ATTENTION! Become Alert! Your Personal Safety is involved!” Read the message that follows and be alert to the possibility of personal injury or death.

HUM18资料

环宇集团有限公司HUM18系列产品资料环宇集团有限公司二〇一三年六月第一部分环宇HUM18系列产品的特点及性能参数一技术性能优势1、全系列具有短路、过载、隔离保护功能。

2、分断能力高。

3、全系列具有触头位置状态指示。

4、操作机构的金属件均采用非磁性不锈钢材料，有效避免其对电弧运动的干扰。

5、HUM18-63小型断路器由于采用了气吹，电弧驱动力加大，使栅片间距缩小，断路器采用13片铁栅片的大灭弧室，喷弧口采用多层网状铁栅，基本保证了零飞弧，有效地防止极间的弧光短路，二产品质量优势1、全系列外壳材料均采用进口环保型热塑性材料制成，具有耐高温、抗冲击、外形美观、耐磨损等优点。

2、采用进口双金属材料作为反时限热保护元件，保护特性精确，操作机构再扣可靠。

3、采用国内最先进的全自动化流水线生产和在线检测，产品质量更稳定、性能更可靠。

三、产品价格优势1、产品的生产批量大；2、产品的综合制造成本低，具有较强的价格竞争力。

四 HUM18系列小型断路器主要技术参数第二部分 HUM18系列产品资质证书和荣誉一 CCC证书二试验报告三产品鉴定报告四产品所获得的的荣誉1 2011年全国用户满意企业及2011年度断路器全国用户满意产品2 2011年中国电器工业协会HUM18型质量可信产品推介证书3 驰名商标4 3·15质量无投诉、服务无投诉诚信企业及纳税信用等级证书第三部分中标业绩（部分）一安徽省2013年第一批（协议库存）电表箱元器件业绩13年安徽电力公司第一批协议库存中标电表箱、JP柜元器件合同数量、供货数量及结算表二安徽省2012第一批（协议库存）电表箱元器件业绩环宇集团电表箱元器件合同数量、供货数量三江苏省2012年省网微型断路器中标通知书四山东省电力公司2013年第一协议库存电表箱中标通知书、合同五云南省电力公司2013年城农网电表箱（4万只）中标通知书。

MT1887 1 度角凹刀刮刀说明书

THIS INSTRUCTION MANUAL CONTAINS IMPORTANT SAFETY INFORMATION.READ THIS INSTRUCTION MANUAL CAREFULLY AND UNDERSTAND ALL INFORMATION BEFORE OPERATING THIS TOOL.• Always operate, inspect and maintain this tool in accordance with American National Standards Institute Safety Code of Portable Air Tools (ANSI B186.1) and any other applicable safety codes and regulations.• For safety, top performance and maximum durability of parts, operate this tool at 90 psig 6.2 bar max air pressure with 3/8" diameter air supply hose.• Always wear impact-resistant eye and face protection when operating or performing maintenance on this tool.• Always wear hearing protection when using this tool. High sound levels can cause permanent hearing loss. Use hearing protection as recommended by your employer or OSHA regulation.• Keep the tool in efficient operating condition.• Operators and maintenance personnel must be physically able to handle the bulk, weight and power of this tool.• Air powered tools can vibrate in use. Vibration, repetitive motions or uncomfortable positions over extended periods of time may be harmful to your hands and arms. Discontinue use of tool if discomfort, tingling feeling or pain occurs. Seek medical advice before resuming use.• Air under pressure can cause severe injury. Never direct air at yourself or others. Always turn off the air supply, drain hose of air pressure and detach tool from air supply before installing, removing or adjusting any accessory on this tool, or before performing any maintenance on this tool. Failure to do so could result in injury. Whip hoses can cause serious injury. Always check for damaged, frayed or loose hoses and fittings, and replace immediately. Do not use quick detach couplings at tool. See instructions for correct set-up.• Place the tool on the work before starting the tool. • Slipping, tripping and/or falling while operating air tools can be a major cause of serious injury or death. Be aware of excess hose left on the walking or work surface.• Keep body working stance balanced and firm. Do not overreach when operating the tool.• Anticipate and be alert for sudden changes in motion during start up and operation of any power tool.• Do not carry tool by the hose. Protect the hose from sharp objects and heat.• Tool shaft may continue to rotate briefly after throttle is released. Avoid direct contact with accessories during and after use. Gloves will reduce the risk of cuts or burns.• Keep away from rotating end of tool. Do not wear jewelry or loose clothing. Secure long hair. Scalping can occur if hair is not kept away from tool and accessories. Choking can occur if neckwear is not kept away from tool and accessories.• C orrect grinding wheel mounting is necessary to prevent injury from broken wheels. Do not use chipped or cracked grinding wheels. Grinding wheels should be a free fit on the spindle to prevent stress at the hole. Use only wheel collars that come with the grinder for mounting the grinding wheel. Flat washers or other adapters may over stress the wheel. Always use heavy paper blotter discs between the wheel collars and the grinding wheel. Tighten the wheel on the spindle to prevent spin off when the air grinder is turned off.• Do not lubricate tools with flammable or volatile liquids such as kerosene, diesel or jet fuel.• Do not force tool beyond its rated capacity.• Do not remove any labels. Replace damaged labels.FAILURE TO OBSERVE THESE WARNINGS COULD RESULT IN INJURYOPERATIONWhen using the grinder be careful not to exert excessive force. Toomuch force could be hazardous if it causes the cutting tool spindleto bend or break.The burning of the work piece or excessive speed reductionindicates too much force being applied. Changing to a freecutting tool may be better for the desired rate of speed and stockremoval.Avoid hazardous conditions by making sure there is sufficient forceon the spindle of the cutting tool by placing the spindle 7/16" ormore inside the collet.AIR INLETNote:Some states do not allow the exclusion or limitation incidental or consequential damages so the above limitation exclusion may not apply to you.MATCO AIR COMMANDTool Repair SV1330 Commerce Dr.Stow, OH 44224(800) 433-7098DISCOUNT TOOL REPAIRITEM PART NO. DESCRIPTION QTY.1 ** RS188001N Motor Housing 12 RS78741 Lever Pin 13 ** RS188003N Air Inlet (including #7, 29, 51) 14 RS188004 Throttle Lever 15 RS188005 Valve Shaft 16 RS188006 Deflector 17 O-Ring (included in #3) 18 RS188008 Spring 19 RS188009 O-Ring 110 RS188010 Valve Screw 111 RS188011 O-Ring 112 RS188012 Rotor Spacer 113 RS30516 Ball Bearing 114 RS188014 Rear End Plate 115 RS188015 Rotor 116 RS188016 Vane 417 RS43018 Spring Pin 218 RS188018 Cylinder 119 RS188019 Front End Plate (incl. #38) 120 RS30524 Ball Bearing 321 RS188021 Controller 122 RS188722 Pinion Gear 123 RS188323 Front Coupling 124 RS188024A 1/4" Collet 1RS188024B 1/8" Collet (optional)*25 RS188025 Collet Nut 1ITEM PART NO. DESCRIPTION QTY.26 RS188326 Front Cap 127 RS44028 Spanner 228 RS188728 Head (incl. #37) 129 21mm Fixed Shaft (included in #3) 130 RS188730 Bevel Gear 131 RS188331 Lock Ring 132 RS188332 Key 133 RS188733 Spindle 134 RS188034 Bushing 135 RS188035 O-Ring 136 RS188036 O-Ring 137 RS181029 Oil Cap 138 Steel Ball (included in #19) 139 RS188039 Safety Bar 140 RS188040 Throttle Valve 141 RS188041 Knob 142 RS188028 Spring Pin 143 RS188030 Spring Pin 144 RS188037 Spring 145 RS188745 Grip 146 RS78707 O-Ring 147 RS188031 Spring Pin 148 RS188748 Crescent Rings 149 RS188042 Lever Plate 150 RS188750 Shim 251 RS188042Washer (included in #3) 1* Available through special order dept. only.** New improved parts as of serial number #DYF010001. For tools with earlierserial numbers, order RS188001 Motor Housing and RS188003R Air Inlet.。

Medeli MC-105 音色和节奏对照表

PIANO GUITAR SYNTH1 SYNTH2
含义电源开关音量控制和弦声音大小节奏声音大小 --AUTO BASS CHORD-单指和弦多指和弦启动/停止前奏/插入同步启拍数节拍器控制选所需节拍数低音乐器钢琴吉他合成1 合成2 和弦变奏 --MEMORY-记忆1 记忆2 记忆3 存储其它持续音颤音 9 复调音乐示范曲选择
CHROD VARATION M1 M2 M3 STORE SUBSTAIN VIBRATO 9 POLYPHONY DEMO SELECT
序号英文含义00piano钢琴01pipeorgan管风琴02elecorgan电子风琴03strings弦乐04mutetrumpet弱音小号05horn圆号06clarinet黑管07flute长笛08violin小提琴09vibes颤音10elecguitar电吉他11woodbass木贝司12elecpiano电子钢琴13jazzorgan爵士风琴14accordion手风琴15brass铜乐器16tuba大号17chimes18oboe双簧管19saxophone萨克斯管20cello大提琴21bell22guitar吉他23slapbass打弦贝司medelimc105音色voice对照表序号英文含义00disco迪斯科01pops流行乐02slowrock慢摇滚03swing摇摆舞曲04rhumba伦巴05bassanova06march进行曲07enka0816beat09beat10rock?n?roll摇滚乐11jazzwaltz爵士华尔兹12tango探戈13samba桑巴14waltz华尔兹15country乡村乐medelimc105节奏style对照表16拍英文含义power电源开关mainvolume音量控制abcvol和弦声音大小phy

奥马杆数字电容表说明书

OMEGAHHM18 Digital Capacitance MeterOMEGAnet On-Line Service Internet e-mail **************Servicing North America:USA: ISO 9001 Certified Canada:One Omega Drive, Box 4047976 Bergar Stamford, CT 06907-0047Laval (Quebec) H7L5A1 Tel: (203) 359-1660Tel: (514) 856-6928 FAX: (203)359-7700FAX: (514) 856-6886e-mail:**************e-mail:**************SPECIFICATIONSDisplay: 3½ digit liquid crystal display (LCD) with a maximum reading of 1999. Polarity: Automatic, positive implied, negative polarity indication. Overrange: (OL) or (-OL) is displayed.Zero: Automatic.Low battery indication: the "" is displayed when the battery voltage drops below the operating level.Measurement rate: 2.5 times per second, nominal.Operating Environment: 0°C to 40°C at < 70% relative humidity.Storage Temperature: -20°C to 60°C, 0 to 80% R.H. with battery removed from meter.Accuracy: Stated accuracy at 23°C ± 5°C, <75% relative humidity. Power: single standard 9-volt battery.Battery life: 200 hours typical.Dimensions: 192mm (H) x 91mm (W) x 52.5mm (D).Weight: 365g including battery.Accessories: One pair test leads, 9V battery (installed), one spare fuse and Operating Instructions.CAPACITANCETest voltage: <3.5VInput protection: 0.1A/250V fast acting fuseZero adjust limited: ±20pF approxRangeResolution Accuracy Test Frequency200pF0.1pF ±(0.5%rdg+1dgt+0.5pF)2nF1pF 20nF10pF 200nF100pF 2µF1nF 20µF10nF 200µF100nF 2000µF1µF ±(2.0%rdg+1dgt)20mF 10µF ±(4.0%rdg+1dgt)±(0.5%rdg+1dgt)820Hz 82Hz 8.2HzCONTINUITYAudible indication: less than 30WOverload protection: 24VDC or AC rmsDIODE TESTTest current: 1.0mA ± 0.6mAAccuracy:±(10.0%rdg + 3dgts)Open circuit volts: 3.0Vdc typicalOverload protection: 24VDC or AC rmsRESISTANCERanges: 20W,200W,2K W,20K W,200K W,2M W,20M W Accuracy:±(0.3%rdg + 10dgts) on 20W range±(0.3%rdg + 1dgt) on 200W to 2M W ranges±(3.0%rdg + 4dgts) on 20M W rangeOpen circuit volts: 0.3Vdc (3.0Vdc on 20W and 200W ranges) Overload protection: 24VDC or AC rmsFREQUENCY (Autoranging)Ranges: 2KHz,20KHz,200KHz,2000KHz,15MHzAccuracy:±(0.1%rdg + 1dgt)Sensitivity: 1.0Vrms minOverload protection: 24VDC or AC rmsEffect Reading: 10 - 1999OPERATIONMAX-HOLD FeaturePress "MAX-HOLD" to toggle in and out of the Maximun Hold mode.(holding the highest reading.) In the MAX mode, the MAX annunciator is displayed and maximun reading are stored in display register, If the new reading is higher than the reading being displayed, the higher reading is transferred to the display register. A "higher" reading is defined as the reading with the higher absolute value. The MAX hold function is disable in the frequency count mode, but the MAX annunciator is still displayed.DATA-Button:Capacitance Measurements1. Set the Function/Range switch to the desired capacitance range.2. Never apply an external voltage to the sockets. Damage to the meter may result.3. Insert the capacitor leads directly into the socket.4. Read the capacitance directly from the display.Diode Tests and Continuity1. Connect the red test lead to the "V W" jack and the black test lead to the "COM" jack.2. Set the Function/Range switch to the "" position.3. Turn off power to the circuit under test.4. Touch probes to the diode. A forward-voltage drop is about 0.6V (typical fora silicon diode).5. Reverse probes. If the diode is good, "OL" is displayed. If the diode is shorted, ".000" or another number is displayed.6. If the diode is open, "OL" is displayed in both directions.7. If the junction is measured in a circuit and a low reading is obtained with both lead connections, the junction may be shunted by a resistance of less than 1k W. In this case the diode must be disconnected from the circuit for accurate testing.Resistance Measurements1. Set the Function/Range switch to the desired resistance range or continuity position.2. Remove power from the equipment under test.3. Connect the red test lead to the "V W" jack and the black test lead to the "COM" jack.4. Touch the probes to the test points. In ohms, the value indicated in the display is the measured value of resistance. In continuity test, the beeper sounds continuously, if the resistance is less than 30W.WARNINGThe accuracy of the functions might be slightly affected, when exposed to a radiated electromagnetic field environment, eg, radio, telephone or similar.Frequency Measurements1. Set the Function/Range switch to the Hz position.2. Connect the red test lead to the "V W" jack and the black test lead to the "COM" jack.3. Connect the test leads to the point of measurement and read the frequency from the display.MAINTENANCEWARNINGRemove test leads before changing battery or fuseor performing any servicing.Battery ReplacementPower is supplied by a 9 volt "transistor" battery. (NEDA 1604 IEC 6F22). The "" appears on the LCD display when replacement is needed. To replace the battery, remove the two screws from the back of the meter and lift off the battery case. Remove the battery from battery contacts.Fuse ReplacementIf no capacitance measurements are possible, check for a blown overload protection fuse. For access to fuses, remove the four screws from the back of the meter and lift off the battery cover and case. Replace F1 only with the original type 0.1A/250V, fast acting ceramic fuse.CleaningPeriodically wipe the case with a damp cloth and detergent, do not use abrasives or solvents.WARRANTY / DISCLAIMEROMEGA ENGINEERING, INC. warrants this unit to be free of defects in materials and workmanship for a period of 13 months from date of purchase. OMEGA Warranty adds an additional one (1) month grace period to the normal one (1) year product warranty to cover handling and shipping time. This ensures that OMEGA's customers receive maximum coverage on each product.If the unit should malfunction, it must be returned to the factory for evaluation. OMEGA's Customer Service Department will issue an Authorized Return (AR) number immediately upon phone or written request. Upon examination by OMEGA, if the unit is found to be defective it will be repaired or replaced at no charge. OMEGA's WARRANTY does not apply to defects resulting from any action of the purchaser, including but not limited to mishandling, improper interfacing, operation outside of design limits, improper repair, or unauthorized modification. This WARRANTY is VOID if the unit shows evidence of having been tampered with or shows evidence of being damaged as a result of excessive corrosion; or current, heat moisture or vibration; improper specification; misapplication; misuse or other operating conditions outside of OMEGA's control. Components which wear are not warranted, including but not limited to contact points, fuses, and triacs.OMEGA is pleased to offer suggestions on the use of its various products. However, OMEGA neither assumes responsibility for any omissions or errors nor assumes liability for any damages that result from the use of its products in accordance with information provided by OMEGA, either verbal or written. OMEGA warrants only that the parts manufactured by it will be as specified and free of defects. OMEGA MAKES NO OTHER WARRANTIES OR REPRESENTATIONS OF ANY KIND WHATSOEVER, EXPRESSED OR IMPLIED, EXCEPT THAT OF TITLE AND ALL IMPLIED WARRANTIES INCLUDING ANY WARRANTY OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE ARE HEREBY DISCLAIMED. LIMITATION OF LIABILITY: The remedies of purchaser set forth herein are exclusive and the total liability of OMEGA with respect to this order, whether based on contract, warranty, negligence, indemnification, strict liability or otherwise, shall not exceed the purchase price of the component upon which liability is based. In no event shall OMEGA be liable for consequential, incidental or special damages.CONDITIONS: Equipment sold by OMEGA is not intended to be used, nor shall it be used: (1) as a "Basic Component" under 10 CFR 21 (NRC), used in or with any nuclear installation or activity; or (2) in medical applications or used on humans. Should any Product(s) be used in or with any nuclear installation or activity, medical application, used on humans, or misused in any way, OMEGA assumes no responsibility as set forth in our basic WARRANTY / DISCLAIMER language, and additionally, purchaser will indemnify OMEGA and hold OMEGA harmless from any liability or damage whatsoever arising out of the use of the Product(s) in such a manner.RETURN REQUESTS / INQUIRIESDirect all warranty and repair requests/inquiries to the OMEGA Customer Service Department. BEFORE RETURNING ANY PRODUCT(S) TO OMEGA, PURCHASER MUST OBT AIN AN AUTHORIZED RETURN (AR) NUMBER FROM OMEGA'S CUSTOMER SERVICE DEP ARTMENT (IN ORDER TO AVOID PROCESSING DELAYS). The assigned AR number should then be marked on the outside of the return package and on any correspondence.The purchaser is responsible for shipping charges, freight, insurance and proper packaging to prevent breakage in transit.FOR WARRANTY RETURNS, please have the following information available BEFORE contacting OMEGA:1.P.O. number under which the product was PURCHASED.2.Model and serial number of the product under warranty, and3.Repair instructions and/or specific problems relative to theproduct.FOR NON-WARRANTY REP AIRS, consult OMEGA for current repair charges. Have the following informationavailable BEFORE contacting OMEGA:1.P.O. number to cover the COST of the repair.2.Model and serial number of product , and3.Repair instructions and/or specific problems relative to theproduct.OMEGA's policy is to make running changes, not model changes, whenever an improvement is possible. This affords our customers the latest in technology and engineering. OMEGA is a registered trademark of OMEGA ENGINEERING, INC. © Copyright 1999 OMEGA ENGINEERING,Where Do I Find Everything I Need for Process Measurement and Control?OMEGA...Of Course!TEMPERATUREþThermocouple, RTD & Thermistor Probes, Connectors, Panels & Assemblies þWire: Thermocouple, RTD & Thermistor þCalibrators & Ice Point ReferencesþRecorders, Controllers & Process Monitors þInfrared PyrometersPRESSURE/STRAIN AND FORCEþTransducers & Strain GaugesþLoad Cells & Pressure GaugesþDisplacement TransducersþInstrumentation & AccessoriesFLOW/LEVELþRotameters, Gas Mass Flowmeters& Flow ComputersþAir Velocity IndicatorsþTurbine/Paddlewheel SystemsþTotalizers & Batch ControllerspH/CONDUCTIVITYþpH Electrodes, Testers & AccessoriesþBenchtop/Laboratory MetersþControllers, Calibrators, Simulators& PumpsþIndustrial pH & Conductivity Equipment DATA ACQUISITIONþData Acquisition &Engineering SoftwareþCommunications-Based Acquisition SystemsþPlug-in Cards for Apple, IBM& CompatiblesþDatalogging SystemsþRecorders, Printers & Plotters HEATERSþHeating CableþCartridge & Strip HeatersþImmersion & Band HeatersþFlexible HeatersþLaboratory Heaters ENVIRONMENTAL MONITORING AND CONTROL þMetering & Control Instrumentation þRefractometersþPumps & TubingþAir, Soil & Water MonitorsþIndustrial Water & Wastewater TreatmentþpH, Conductivity & Dissolved Oxygen InstrumentsM-2854/0799。

GMW16579 2012 中文翻译版

Material and Process Testing Requirements forPress Hardened Steel and Stamping Suppliers热成形钢和热冲压零件供应商的材料和工艺要求1 Scope1 范围This document describes the minimum process and internal testing requirements for producers of hot stamped parts.此文件描述热成形零件供应商的最低工艺和内部试验要求。

1.1 Material Description. Hot stamping, or press hardening as it is also known, utilizes a steel of high hardenability such as 22MnB5 that is heated to convert the microstructure to austenite followed by stamping in a water cooled die to produce the proper part shape and to simultaneously quench the steel to create a martensite rich microstructure. Parts produced to this specification will have a uniform hardness and a microstructure consisting of essentially 100% tempered martensite along with small amounts of bainite.1.1 材料描述。

热成形，也称为压力硬化，即把具有良好淬硬性的热成形钢如22MnB5等加热使之奥氏体化，然后利用带有冷却系统的模具来冲压成形，使零件在获得所需形状的同时淬火，得到马氏体组织。

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MC10H188Hex Buffer with EnableDescriptionThe MC10H188 is a high −speed Hex Buffer with a common Enable input. When Enable is in the high −state, all outputs are in the low −state. When Enable is in the low −state, the outputs take the same state as the inputs.This MECL 10H ™ part is a functional/pinout duplication of the standard MECL 10K ™ family part, with 100% improvement in propagation delay and no increase in power −supply current.Features•Propagation Delay, 1.3 ns Typical Data −to −Output •Power Dissipation 180 mW Typ/Pkg (No Load)•Improved Noise Margin 150 mV (Over Operating V oltage and Temperature Range)•V oltage Compensated •MECL 10K Compatible•Pb −Free Packages are Available*LOGIC DIAGRAMDIPPIN ASSIGNMENTV CC1A OUT B OUT C OUT A IN B IN C IN V EEV CC2F OUT E OUT DOUT F IN E IN D IN COMMON161514131211109123456781211107659Pin assignment is for Dual −in −Line Package.For PLCC pin assignment, see the Pin Conversion Tables on page 18of the ON Semiconductor MECL Data Book (DL122/D).*For additional information on our Pb −Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.See detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet.ORDERING INFORMATIONTable 1. MAXIMUM RATINGSSymbol Characteristic Rating Unit V EE Power Supply (V CC = 0)−8.0 to 0Vdc V I Input Voltage (V CC = 0)0 to V EE VdcI out Output Current− Continuous− Surge 50100mAT A Operating Temperature Range0 to +75°CT stg Storage Temperature Range− Plastic− Ceramic −55 to +150−55 to +165°C°CMaximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.Table 2. ELECTRICAL CHARACTERISTICS (V EE = −5.2 V ±5%) (Note )0°25°75°Symbol Characteristic Min Max Min Max Min Max UnitI E Power Supply Current−46−42−46mAI inH Input Current High−495−310−310m AI inL Input Current Low0.5−0.5−0.3−m AV OH High Output Voltage−1.02−0.84−0.98−0.81−0.92−0.735Vdc V OL Low Output Voltage−1.95−1.63−1.95−1.63−1.95−1.60Vdc V IH High Input Voltage−1.17−0.84−1.13−0.81−1.07−0.735Vdc V IL Low Input Voltage−1.95−1.48−1.95−1.48−1.95−1.45Vdc 1.Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has beenestablished. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 lfpm is maintained.Outputs are terminated through a 50 W resistor to −2.0 V.Table 3. AC PARAMETERS0°25°75°Symbol Characteristic Min Max Min Max Min Max Unit t pd Propagation DelayEnable Data 0.70.72.21.90.70.72.21.90.70.72.21.9nst r Rise Time0.7 2.40.7 2.40.7 2.4ns t f Fall Time0.7 2.40.7 2.40.7 2.4ns NOTE:Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declaredoperating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously.ORDERING INFORMATIONDevice Package Shipping†MC10H188FN PLLC−2046 Units / RailMC10H188FNG PLLC−2046 Units / Rail(Pb−Free)MC10H188FNR2PLLC−20500 / Tape & ReelMC10H188FNR2G PLLC−20500 / Tape & Reel(Pb−Free)MC10H188L CDIP−1625 Unit / RailMC10H188M SOEIAJ−1650 Unit / Rail50 Unit / RailMC10H188MG SOEIAJ−16(Pb−Free)MC10H188MEL SOEIAJ−162000 / Tape & Reel2000 / Tape & ReelMC10H188MELG SOEIAJ−16(Pb−Free)MC10H188P PDIP−1625 Unit / RailMC10H188PG PDIP−1625 Unit / Rail(Pb−Free)†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.PACKAGE DIMENSIONSSL−MS 0.010 (0.250) NST 20 LEAD PLLC CASE 775−02ISSUE ENOTES:1.DIMENSIONS AND TOLERANCING PER ANSI Y14.5M,1982.2.DIMENSIONS IN INCHES.3.DATUMS −L −, −M −, AND −N − DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE.4.DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM −T −, SEATING PLANE.5.DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.6.DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300).DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY .7.DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBARPROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBARINTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.3850.3959.7810.03B 0.3850.3959.7810.03C 0.1650.180 4.20 4.57E 0.0900.110 2.29 2.79F 0.0130.0190.330.48G 0.050 BSC 1.27 BSC H 0.0260.0320.660.81J 0.020−−−0.51−−−K 0.025−−−0.64−−−R 0.3500.3568.899.04U 0.3500.3568.899.04V 0.0420.048 1.07 1.21W 0.0420.048 1.07 1.21X 0.0420.056 1.07 1.42Y −−−0.020−−−0.50Z 2 10 2 10 G10.3100.3307.888.38K10.040−−− 1.02−−−____PACKAGE DIMENSIONSSOEIAJ −16CASE 966−01ISSUE ANOTES:1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.CDIP −16L SUFFIXCERAMIC DIP PACKAGECASE 620A −01NOTES:1.DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.2.CONTROLLING DIMENSION: INCH.3.DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL.4.DIMENSION F MAY NARROW TO 0.76 (0.030)WHERE THE LEAD ENTERS THE CERAMIC BODY.5THIS DRAWING REPLACES OBSOLETE CASE OUTLINE 620−10.AM0.25 (0.010)T DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.7500.78519.0519.93B 0.2400.295 6.107.49C −−−0.200−−− 5.08D 0.0150.0200.390.50E 0.050 BSC 1.27 BSC F 0.0550.065 1.40 1.65G 0.100 BSC 2.54 BSC H 0.0080.0150.210.38K 0.1250.170 3.18 4.31L 0.300 BSC 7.62 BSC M 0 15 0 15 N0.0200.0400.51 1.01____PACKAGE DIMENSIONSNOTES:1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.2.CONTROLLING DIMENSION: INCH.3.DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL.4.DIMENSION B DOES NOT INCLUDE MOLD FLASH.5.ROUNDED CORNERS OPTIONAL.MDIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.7400.77018.8019.55B 0.2500.270 6.35 6.85C 0.1450.175 3.69 4.44D 0.0150.0210.390.53F 0.0400.70 1.02 1.77G 0.100 BSC 2.54 BSC H 0.050 BSC 1.27 BSC J 0.0080.0150.210.38K 0.1100.130 2.80 3.30L 0.2950.3057.507.74M 0 10 0 10 S0.0200.0400.51 1.01____PDIP −16P SUFFIXPLASTIC DIP PACKAGEON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.PUBLICATION ORDERING INFORMATIONMECL 10H and MECL 10K are trademarks of Motorola, Inc.。