SMD专业术语中英文对照电子类知识宝典

S M D专业术语中英文
对照电子类知识宝典 SANY标准化小组 #QS8QHH-HHGX8Q8-GNHHJ8-HHMHGN#
SMD常用术语
微组装技术﹕MPT/MicroelectronicPackagingechnology 混装技术﹕MixedComponentMountingTechnology
封装﹕Package
贴片﹕PickandPlace
拆焊﹕Desoldering
再流﹕Reflow
浸焊﹕DipSoldering
拖焊﹕Dragsoldering
印制电路﹕PrintedCircuit
印制线路﹕PrintedWiring
印制电路板﹕printedcircuitboard
印制线路板﹕printedwiringboard
层压板﹕laminate
覆铜薄层压板﹕copper-cladlaminate
基材﹕basematerial
成品板﹕productionboard
印刷﹕printing
导电图形﹕conductivepattern
印制组件﹕printedcomponent
单面印制板﹕single-sidedprintedboard
双面印制板﹕double-sidedprintedboard 多层印制板﹕multilayerprintedboard 电烙铁﹕Iron
热风嘴﹕hotairreflowingnoozle
吸锡带﹕solderingwick
吸锡器﹕tinextractor
焊后检验﹕post-solderinginspection 目视检验﹕visualinspection
机器检验﹕machineinspection
焊点质量﹕solderingjointquality
焊电缺陷﹕solderingjontdefect
错焊﹕solderwrong
漏焊﹕solderskips
虚焊﹕pseudosoldering
冷焊﹕coldsoldering
桥焊﹕solderbridge
脱焊﹕opensoldering
焊点剥离﹕solderoff
不润湿焊点﹕solderingnonwetting
锡珠﹕solderball
拉尖﹕icicle；solderprojection
孔洞﹕void
焊料爬越﹕solderwicking
过热焊点﹕overheatedsolderconnection
不饱和焊点﹕insufficientsolderconnection
过量焊点﹕excesssolderconnection
微组装技术﹕MPT/MicroelectronicPackagingechnology 混装技术﹕MixedComponentMountingTechnology
封装﹕Package
贴片﹕PickandPlace
拆焊﹕Desoldering
再流﹕Reflow
浸焊﹕DipSoldering
拖焊﹕Dragsoldering
印制电路﹕PrintedCircuit
印制线路﹕PrintedWiring
印制电路板﹕printedcircuitboard
印制线路板﹕printedwiringboard
层压板﹕laminate
覆铜薄层压板﹕copper-cladlaminate
基材﹕basematerial
成品板﹕productionboard
印刷﹕printing
导电图形﹕conductivepattern
印制组件﹕printedcomponent
单面印制板﹕single-sidedprintedboard
双面印制板﹕double-sidedprintedboard 多层印制板﹕multilayerprintedboard 电烙铁﹕Iron
热风嘴﹕hotairreflowingnoozle
吸锡带﹕solderingwick
吸锡器﹕tinextractor
焊后检验﹕post-solderinginspection 目视检验﹕visualinspection
机器检验﹕machineinspection
焊点质量﹕solderingjointquality
焊电缺陷﹕solderingjontdefect
错焊﹕solderwrong
漏焊﹕solderskips
虚焊﹕pseudosoldering
冷焊﹕coldsoldering
桥焊﹕solderbridge
脱焊﹕opensoldering
焊点剥离﹕solderoff
不润湿焊点﹕solderingnonwetting
锡珠﹕solderball
拉尖﹕icicle；solderprojection
孔洞﹕void
焊料爬越﹕solderwicking
过热焊点﹕overheatedsolderconnection
不饱和焊点﹕insufficientsolderconnection
过量焊点﹕excesssolderconnection
助焊剂剩余﹕fluxresidue
焊料裂纹﹕soldercrazeing
焊角翘起﹕fillet-lifting；lift-off
AI:Auto-Insertion自动插件
AQL:acceptablequalitylevel允收水平
ATE:automatictestequipment自动测试
ATM:atmosphere气压
BGA:ballgridarray球形矩阵
CCD:chargecoupleddevice监视连接组件(摄影机)
CLCC:Ceramicleadlesschipcarrier陶瓷引脚载具
COB:chip-on-board芯片直接贴附在电路板上
cps:centipoises(黏度单位)百分之一
CSB:chipscaleballgridarray芯片尺寸BGA
CSP:chipscalepackage芯片尺寸构装
CTE:coefficientofthermalexpansion热膨胀系数
DIP:dualin-linepackage双内线包装(泛指手插组件)
FPT:finepitchtechnology微间距技术
FR-4:flame-retardantsubstrate玻璃纤维胶片(用来制作PCB材质) IC:integratecircuit集成电路
IR:infra-red红外线
Kpa:kilopascals(压力单位)
LCC:leadlesschipcarrier引脚式芯片承载器
MCM:multi-chipmodule多层芯片模块
MELF:metalelectrodeface二极管
MQFP:metalizedQFP金属四方扁平封装
NEPCON:NationalElectronicPackageand ProductionConference国际电子包装及生产会议
ppm:partspermillion指每百万PAD(点)有多少个不良PAD(点) psi:pounds/inch2磅/英寸2
PWB:printedwiringboard电路板
QFP:quadflatpackage四边平坦封装
SIP:singlein-linepackage
SIR:surfaceinsulationresistance绝缘阻抗
SMC:SurfaceMountComponent表面黏着组件
SMD:SurfaceMountDevice表面黏着组件
SMEMA:SurfaceMountEquipment
ManufacturersAssociation表面黏着设备制造协会
SMT:surfacemounttechnology表面黏着技术
SOIC:smalloutlineintegratedcircuit
SOJ:smallout-linej-leadedpackage
SOP:smallout-linepackage小外型封装
SOT:smalloutlinetransistor晶体管
SPC:statisticalprocesscontrol统计过程控制
SSOP:shrinksmalloutlinepackage收缩型小外形封装
TAB:tapeautomaticedbonding带状自动结合
TCE:thermalcoefficientofexpansion膨胀(因热)系数
Tg:glasstransitiontemperature玻璃转换温度
THD:Throughholedevice须穿过洞之组件(贯穿孔)
TQFP:tapequadflatpackage带状四方平坦封装
UV:ultraviolet紫外线
uBGA:microBGA微小球型矩阵
cBGA:ceramicBGA陶瓷球型矩阵
PTHlatedThruHole导通孔
IAInformationAppliance信息家电产品
MESH网目
OXIDE氧化物
FLUX助焊剂
LGA(LandGridArry)封装技术LGA封装不需植球，适合轻薄短小产品应用。

TCP(TapeCarrierPackage)
ACFAnisotropicConductiveFilm异方性导电胶膜制程
Soldermask防焊漆
SolderingIron烙铁
Solderballs锡球
SolderSplash锡渣
SolderSkips漏焊
Throughhole贯穿孔
Touchup补焊
Briding穚接(短路)
SolderWires焊锡线
SolderBars锡棒
GreenStrength未固化强度(红胶)
TransterPressure转印压力(印刷)
ScreenPrinting刮刀式印刷
SolderPowder锡颗粒
Wettengability润湿能力
Viscosity黏度
Solderability焊锡性
Applicability使用性
Flipchip覆晶
DepanelingMachine组装电路板切割机SolderRecoverySystem锡料回收再使用系统WireWelder主机板补线机
X-RayMulti-layerInspectionSystemX-Ray孔偏检查机BGAOpen/ShortX-RayInspectionMachineBGAX-Ray检测机PrepregCopperFoilSheeterP.P.铜箔裁切机FlexCircuitConnections软性排线焊接机LCDReworkStation液晶显示器修护机
BatteryElectroWelder电池电极焊接机PCMCIACardWelderPCMCIA卡连接器焊接
LaserDiode半导体雷射
IonLasers离子雷射
Nd:YAGLaser石榴石雷射
DPSSLasers半导体激发固态雷射
UltrafastLaserSystem超快雷射系统
MLCCEquipment积层组件生产设备
GreenTapeCaster,Coater薄带成型机ISOStaticLaminator积层组件均压机
GreenTapeCutter组件切割机
ChipTerminator积层组件端银机
MLCCTester积层电容测试机ComponentsVisionInspectionSystem芯片组件外观检查机。