MAXIM TINI Power SoCs 说明书
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EEPROM, EPROM, NV SRAM, OTP, ROM MAXQ®, 8051, ARM®, DSP
Capacitive multitouch, proximity, ambient light, RGB Smartphones, tablets, e-readers, media players
I2C/SPI™/JTAG GPIO
RTC
MEMORY DDR POWER
AUDIO CODEC HEADPHONE, MIC, SPEAKER AMPS
SENSORS AMPS AND ADCs MISC. ADC CHANNELS
CONNECTORS CURRENT LIMIT AND OVP PROTECTION
Building Blocks DC-DC converters, LED drivers, LDOs, charge pumps
Chargers, fuel gauges, battery security/safety Filters, comparators, op amps, video amps
TOUCH SCREEN SPEAKER
TINI Power SoC
DUAL PROCESSOR POWER
AUDIO SUBSYSTEM
BASEBAND PROCESSOR
MOBILE TV
BLUETOOTH®/ 802.11
HEADPHONES
USB Li+ BATTERY
TOUCH-SCREEN CONTROL
Maxim Integrated Products, Inc. • 120 San Gabriel Drive Sunnyvale, CA 94086 • 1-408-737-7600
Any number of AMS blocks can be integrated together on Maxim’s proprietary BCD process technology to achieve the best performance and optimum integration. Power SoCs thus enable customers to break through the integration barrier with a smaller, lower cost solution that provides a richer feature set.
materials, and improve performance • Integrate a microcontroller and memory to offload the applications processor and allow one
design to be ported across multiple platforms • Extend battery life and reduce heat with highly efficient power-management functions • Leverage a broad portfolio of high-performance building blocks, including advanced IP cores like
ADCs, switches/muxes, DACs, digital potentiometers I2C, SPI, SPMI, 1-Wire®, LVDS, USB, level translators, RS-232
XO, DCXO, TCXO, RTC Codec, noise cancellation, jack sense, mics, amplifiers
BATTERY CHARGING AND PROTECTION
APPLICATIONS PROCESSOR
CAMERA FLASH SDRAM
System diagram of a TINI Power SoC that supports both the applications and baseband processors. An audio subsystem, battery charging and protection, and touch-screen control are integrated to reduce external component count.
Today, consumer demand for additional capabilities in thinner and lighter form factors is driving the need for even more integration. However, the deep-submicron CMOS processes used to integrate digital gates are not suitable for analog/ mixed-signal (AMS) functions due to high leakage and noise.
TINI® Power SoCs
Analog Integration Gives You Space for New Functions in Mobile Platforms
Technology Benefits • Combine power and system functions into a single chip to save board space, reduce the bill of
3G/4G RADIO
Customer Success Story: Powering the Applications and Baseband Processors
Applications Processor
Basm’s Power SoC Solution Saves 63% PCB Area
IC Count IC Size (mm2) Component Count Component Area (mm2)
Competing Solution
9 161 121 321
Maxim Solution
2 38 76 117
Choose from a Complete Portfolio of High-Performance Building Blocks
ModelGauge™, FlexSound®, and TacTouch®
TINI Power SoCs Enable Thinner, Lighter Smartphones
The Integration Barrier Each year smartphones get smarter, thanks to constant advances in CMOS process technology. With the reduction of process geometries to 40nm and below, the baseband and applications processors have absorbed more and more digital functional blocks, enabling smartphones to support an everwidening array of applications and faster speeds.
Breaking Through with TINI Power SoCs Multifunction AMS solutions are needed to break through the integration barrier in portable platforms. Today, power, analog, mixed-signal audio, and passives occupy roughly half the PCB space in smartphones and tablet PCs. Combining these blocks into a single system-on-chip (SoC) solution can free up significant real estate for new differentiating features and higher-capacity batteries.
Maxim’s TINI Power SoCs leverage our broad portfolio of AMS building blocks to deliver the best performance in the smallest footprint. They integrate all necessary DC-DCs and linear regulators to power the applications and baseband processors, along with functional blocks such as audio codecs, touch-screen controllers, battery management, and more. A microcontroller and memory may be included to offload the applications processor by managing housekeeping functions. The built-in microcontroller also provides the flexibility (via firmware updates) to reuse a design across multiple platforms and device generations.
SENSOR
TINI Power SoC
BATTERY MANAGEMENT CHARGER WITH OVP AND Smart Power Selector™ FUEL GAUGE
DISPLAY DISPLAY POWER
PROCESSOR AND SYSTEM POWER
HIGH-EFFICIENCY DC-DCs
CAMERAS LOW-NOISE POL REGULATORS CAMERA FLASH
RADIO ENVELOPE-TRACKING
RFPA POWER
APPLICATIONS/ BASEBAND
PROCESSORS
USB HOST HDMI
HIGH-RESOLUTION CAMERA
VGA CAMERA
Functions Power Management Battery Management Amplifiers and Comparators Data Conversion Interface Timing Audio Memory Microcontrollers Sensors Application-Specific Blocks
HIGH-SPEED CORE DC-DCs WITH DVM
LOW-NOISE, HIGH PSRR LDOs
TOUCH-SCREEN CONTROL TACTILE FEEDBACK
INDICATORS LED AND MOTOR DRIVERS
CONTROL/GPIO SERIAL INTERFACE:
Inside the TINI Power SoC
USB/AC ADAPTER MAIN BATTERY
BACKUP BATTERY
TOUCH SCREEN AND DISPLAY
KEYBOARD VIBRATOR
LPDDR RAM
HEADPHONE, MIC, SPEAKER
SYSTEM TEMP SENSOR AMBIENT-LIGHT
Capacitive multitouch, proximity, ambient light, RGB Smartphones, tablets, e-readers, media players
I2C/SPI™/JTAG GPIO
RTC
MEMORY DDR POWER
AUDIO CODEC HEADPHONE, MIC, SPEAKER AMPS
SENSORS AMPS AND ADCs MISC. ADC CHANNELS
CONNECTORS CURRENT LIMIT AND OVP PROTECTION
Building Blocks DC-DC converters, LED drivers, LDOs, charge pumps
Chargers, fuel gauges, battery security/safety Filters, comparators, op amps, video amps
TOUCH SCREEN SPEAKER
TINI Power SoC
DUAL PROCESSOR POWER
AUDIO SUBSYSTEM
BASEBAND PROCESSOR
MOBILE TV
BLUETOOTH®/ 802.11
HEADPHONES
USB Li+ BATTERY
TOUCH-SCREEN CONTROL
Maxim Integrated Products, Inc. • 120 San Gabriel Drive Sunnyvale, CA 94086 • 1-408-737-7600
Any number of AMS blocks can be integrated together on Maxim’s proprietary BCD process technology to achieve the best performance and optimum integration. Power SoCs thus enable customers to break through the integration barrier with a smaller, lower cost solution that provides a richer feature set.
materials, and improve performance • Integrate a microcontroller and memory to offload the applications processor and allow one
design to be ported across multiple platforms • Extend battery life and reduce heat with highly efficient power-management functions • Leverage a broad portfolio of high-performance building blocks, including advanced IP cores like
ADCs, switches/muxes, DACs, digital potentiometers I2C, SPI, SPMI, 1-Wire®, LVDS, USB, level translators, RS-232
XO, DCXO, TCXO, RTC Codec, noise cancellation, jack sense, mics, amplifiers
BATTERY CHARGING AND PROTECTION
APPLICATIONS PROCESSOR
CAMERA FLASH SDRAM
System diagram of a TINI Power SoC that supports both the applications and baseband processors. An audio subsystem, battery charging and protection, and touch-screen control are integrated to reduce external component count.
Today, consumer demand for additional capabilities in thinner and lighter form factors is driving the need for even more integration. However, the deep-submicron CMOS processes used to integrate digital gates are not suitable for analog/ mixed-signal (AMS) functions due to high leakage and noise.
TINI® Power SoCs
Analog Integration Gives You Space for New Functions in Mobile Platforms
Technology Benefits • Combine power and system functions into a single chip to save board space, reduce the bill of
3G/4G RADIO
Customer Success Story: Powering the Applications and Baseband Processors
Applications Processor
Basm’s Power SoC Solution Saves 63% PCB Area
IC Count IC Size (mm2) Component Count Component Area (mm2)
Competing Solution
9 161 121 321
Maxim Solution
2 38 76 117
Choose from a Complete Portfolio of High-Performance Building Blocks
ModelGauge™, FlexSound®, and TacTouch®
TINI Power SoCs Enable Thinner, Lighter Smartphones
The Integration Barrier Each year smartphones get smarter, thanks to constant advances in CMOS process technology. With the reduction of process geometries to 40nm and below, the baseband and applications processors have absorbed more and more digital functional blocks, enabling smartphones to support an everwidening array of applications and faster speeds.
Breaking Through with TINI Power SoCs Multifunction AMS solutions are needed to break through the integration barrier in portable platforms. Today, power, analog, mixed-signal audio, and passives occupy roughly half the PCB space in smartphones and tablet PCs. Combining these blocks into a single system-on-chip (SoC) solution can free up significant real estate for new differentiating features and higher-capacity batteries.
Maxim’s TINI Power SoCs leverage our broad portfolio of AMS building blocks to deliver the best performance in the smallest footprint. They integrate all necessary DC-DCs and linear regulators to power the applications and baseband processors, along with functional blocks such as audio codecs, touch-screen controllers, battery management, and more. A microcontroller and memory may be included to offload the applications processor by managing housekeeping functions. The built-in microcontroller also provides the flexibility (via firmware updates) to reuse a design across multiple platforms and device generations.
SENSOR
TINI Power SoC
BATTERY MANAGEMENT CHARGER WITH OVP AND Smart Power Selector™ FUEL GAUGE
DISPLAY DISPLAY POWER
PROCESSOR AND SYSTEM POWER
HIGH-EFFICIENCY DC-DCs
CAMERAS LOW-NOISE POL REGULATORS CAMERA FLASH
RADIO ENVELOPE-TRACKING
RFPA POWER
APPLICATIONS/ BASEBAND
PROCESSORS
USB HOST HDMI
HIGH-RESOLUTION CAMERA
VGA CAMERA
Functions Power Management Battery Management Amplifiers and Comparators Data Conversion Interface Timing Audio Memory Microcontrollers Sensors Application-Specific Blocks
HIGH-SPEED CORE DC-DCs WITH DVM
LOW-NOISE, HIGH PSRR LDOs
TOUCH-SCREEN CONTROL TACTILE FEEDBACK
INDICATORS LED AND MOTOR DRIVERS
CONTROL/GPIO SERIAL INTERFACE:
Inside the TINI Power SoC
USB/AC ADAPTER MAIN BATTERY
BACKUP BATTERY
TOUCH SCREEN AND DISPLAY
KEYBOARD VIBRATOR
LPDDR RAM
HEADPHONE, MIC, SPEAKER
SYSTEM TEMP SENSOR AMBIENT-LIGHT