51581-18P中文资料
17-21SYGC-S530中文资料
EVERLIGHT ELECTRONICS CO.,LTD.DATA SHEETPART NO. ：17-21SYGC/S530-E2/TR8DATE ：2005.08.17.DEPARTMENT：SZIEREVISION ：2RECEIVED■MASS PRODUCTION□ PRELIMINARY□ CUSTOMER DESIGNDEVICE NUMBER : SZ DSE-171-024PAGE :9CUSTOMER DESIGNER CHECKER APPROVERMeng Yali Auh Buck2 New data sheet approve2005.08.17REV DESCRIPTION RELEASE DATEOFFICE : NO 25,Lane 76,Chung Yang Rd,Sec.3 Tucheng, Taipei 236, Taiwan, R.O.C.TEL : 886-2-2267-2000,2266-9936 ( 22 Lines )FAX : 886-2-2267-6189Technical Data Sheet0805 Package Chip LEDs17-21SYGC/S530-XX/TR8 Features․Package in 8mm tape on 7〞diameter reel.․Compatible with automatic placement equipment.․Compatible with infrared and vapor phase reflowsolder process.․Mono-color type.․Pb-free.․The product itself will remain within RoHS complaint Version.Descriptions․The 17-21 SMD Taping is much smallerthan lead frame type components, thusenable smaller board size, higher packingdensity, reduced storage space and finallysmaller equipment to be obtained.․Besides, lightweight makes them ideal forminiature applications. etc.Applications․Automotive: backlighting in dashboard and switch.․Telecommunication: indicator and backlighting intelephone and fax.․Flat backlight for LCD, switch and symbol.․General use.Device Selection GuideChipLens Color Part No.ColorMaterial Emitted17-21SYGC/S530-XX/TR8 AlGaInP Brilliant Yellow Green Water Clear17-21SYGC/S530-XX/TR8 Package Outline DimensionsNote: The tolerances unless mentioned is ±0.1mm, Unit = mm17-21SYGC/S530-XX/TR8Absolute Maximum Ratings (Ta=25℃)Parameter SymbolRating UnitReverse Voltage V R 5 V Forward Current I F 25 mA Operating Temperature Topr -40 ~ +85 ℃ Storage TemperatureTstg-40~ +90℃Electrostatic Discharge(HBM) ESD 2000 V Power Dissipation Pd 60mWPeak Forward Current (Duty 1/10 @1KHz) I FP60 mA Soldering TemperatureTsolReflow Soldering : 260 ℃ for 10 sec. Hand Soldering : 350 ℃ for 3 sec.Electro-Optical Characteristics (Ta=25℃)Parameter Symbol*ChipRankMin. Typ. Max. Unit ConditionE1 12 17 -----E2 17 23-----E3 22 31 ----- Luminous IntensityIvE4 27 41 -----mcdViewing Angle 2θ1/2 ----- ----- 140 ----- degPeak Wavelength λp ----- ----- 575 ----- nm Dominant Wavelength λd ----- ----- 573 ----- nm Spectrum RadiationBandwidth △λ ----- ----- 20 ----- nm Forward Voltage V F ----- 1.7 2.0 2.4 V I F =20 mAReverse CurrentI R----- ----- ----- 10μAV R =5V* Chip Rank17-21SYGC/S530-XX/TR8Reel DimensionsNote: The tolerances unless mentioned is ±0.1mm, Unit = mm17-21SYGC/S530-XX/TR8 Carrier Tape Dimensions: Loaded quantity3000 PCS per reel17-21SYGC/S530-XX/TR8Reliability Test Items And ConditionsThe reliability of products shall be satisfied with items listed below. Confidence level ：90% LTPD ：10%No. Items Test Condition Test Hours/Cycles SampleSizeAc/Re1 Reflow Soldering Temp. : 260℃±5℃Min. 5sec. 6 Min.22 PCS.0/1 2 Temperature Cycle H : +100℃ 15min∫ 5 minL : -40℃ 15min 300 Cycles 22 PCS.0/13 Thermal Shock H : +100℃ 5min∫ 10 secL : -10℃ 5min300 Cycles 22 PCS.0/1 4High TemperatureStorageTemp. : 100℃ 1000 Hrs. 22 PCS.0/1 5Low TemperatureStorage Temp. : -40℃ 1000 Hrs. 22 PCS.0/1 6 DC Operating Life I F = 20 mA 1000 Hrs. 22 PCS.0/1 7High Temperature /High Humidity85℃/ 85%RH1000 Hrs.22 PCS.0/117-21SYGC/S530-XX/TR8 Precautions For Use1. Over-current-proofCustomer must apply resistors for protection, otherwise slight voltage shift will cause bigcurrent change ( Burn out will happen ).2. Storage2.1 Do not open moisture proof bag before the products are ready to use.2.2 Before opening the package: The LEDs should be kept at 30℃or less and 90%RH or less.2.3 After opening the package : The LEDs should be kept at 30℃or less and 60%RH or less(Floor life).However, it's recommended that the LEDs should be used within 168 hours (7 days) after openingthe package. If unused LEDs remain, it should be stored in moisture proof packages.2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded thestorage time, baking treatment should be performed using the following conditions.Baking treatment : 60±5℃for 24 hours.3. Soldering Condition3.1 Pb-free solder temperature profile3.2 Reflow soldering should not be done more than two times.3.3 When soldering, do not put stress on the LEDs during heating.3.4 After soldering, do not warp the circuit board.17-21SYGC/S530-XX/TR84.Soldering IronEach terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder. 5.RepairingRepair should not be done after the LEDs have been soldered. When repairing isunavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.。
EL817中文资料(everlight)中文数据手册「EasyDatasheet - 矽搜」
和outpu（u维t 索= 50 V R0M0S0）
• 爬电距离7e
7.62 mm
• 操作TEMPgERATUR高达re+110
0°C
• 紧凑小外形封装
e
• 无铅并符合RoHS标准.
• UL认证（编号E214129）
• VDE认证（132249号）
• SEMKO一批个准
• NEMKO一批个准
• DEMKO一批个准
SMD选项.
1
芯片中文手册,看全文,戳
数据表
4PIN DIP光电晶体管光耦合器 EL817系列
绝对最大额定值（TA = 25℃）
Input
参数 正向电流
峰值正向电流（1微秒,脉冲）
反向电压
功耗
符号
IF IFP VR
PD
击穿电压
PC
产量
总功耗
隔离电压*
工作温度 储存温度
焊接温度*
集电极电流
• Programm梅布尔CONTRolOlers • 系统A 家电,公头 测量插件 struments • 电信 通信设备 • 家电,SUC风扇加热器等.ch • 信号TRAansmission b各色潜力和impueitdsa断路器操e作nt过电压之间s
ances
引脚Configuuration 1.阳极 2.阴极 e 3.发射 4.收集器
4
芯片中文手册,看全文,戳
数据表
4PIN DIP光电晶体管光耦合器 EL817系列
VCC
IF
IC
RL
产量
Input
脉冲
Input R IN
产量 脉冲
tr ton
图 7.开关时间测试电路和波形
EN61058-1-CHINESE
EN61058-1 & -2-1 標准整理1. 范圍2. 引用標准IEC68 焊錫試驗方法IEC112 固定絕緣材料在潮濕條件下相比漏電起痕指數和耐漏電起痕指數的測定法.IEC529 外殼防護IP等級IEC335 家用電器安全IEC695 灼熱絲試驗ISO 金屬覆蓋層IEC669 家用固定式(如墻面)電氣裝置的要求IEC664 低壓系統的絕緣配合IEC730 家用電自動控制器3. 定义3.1一般术语3.1.1 机械开关电器mechanical switching device:依靠可分离的触头来闭合,断开一条或多条电路的开关电器.3.1.2 开关(机械的) switch (mechanical)能在正常电路条件下(包括规定的运行过载条件)接通,承载与分断电流,也能在规定的不正常电路条件下(如短路之类), 在规定的时间内承载电流的机械开关电器.(注: 开关或许能接通短路电流, 但不能分断短路电流)3.1.3 导电部分 conductive part不一定用来承载工作电流,但能传导电流的部分.3.1.4 带电部分 live part正常使用时要带电的导体或导电部分, 包括中性导体.但按惯例,不包括保护接地零线PEN. 3.1.5 开关的极pole of a switch仅与开关中一条在电气上独立的导电路径有关联的开关部分.3.1.6 电气间隙 clearance两个导电部分之间, 或导电部分与覆盖在任何绝缘材料易触及表面上的金属泊之间的最短空间距离.3.1.7 爬电距离 creepage distance两个导电部分之间,或导电部分与覆盖在任何绝缘材料易触及表面上的金属泊之间, 沿绝缘材料表面的最短距离.3.1.8 易拆卸零件detachable part3.1.9 工具 tool3.1.10 专用工具special purpose tool3.1.11 正常使用 normal use3.1.12 周围空气温度 ambient air temperature开关按制造厂的说明安装后,在规定条件下测得的其周围空气的温度.3.1.13 耐漏电起痕指数PTI proof tracking index材料耐受50滴液而无起痕的, 以V为单位的最高耐电压数值.3.1.14 专用型号标志.unique type reference3.1.15 通用型号标注common type reference3.1.16 盖或盖板cover or cover plate开关按正常使用安装后可触及的,但能借助工具拆卸的部分.3.1.17.信号指示器 signal indicator与开关相联结的显示电路状态的器件.3.1.18 非制备导线 unprepared conductor已经切断的,并且为了插入夹紧件而剥除了绝缘层的导线.3.1.19 制备导线 prepared conductor裸露的导线端配有端环,端头,电缆接线片等的导线.3.1.20 基材 base material绝缘材料,支撑电子电路.3.1.21 印刷板 printed board涂胶含孔的基材, 至少有一层导电层.3.1.22 印刷电路板组立 printed board assembly安装有电气和电子零件的印刷板, 包括制造工艺,焊锡,涂层等3.1.23 绝缘距离 insulation distance印刷板的基材上有涂层可导电零件之间的最短距离.3.1.24 变极 polarity reversal通过开关动作改变连接到负载上的端子3.1.25 半导体开关装置semiconductor switching device3.1.26 电子降压转换器electronic step-down convertor3.1.27 电子开关 electronic switch在正常电路条件下, 一个装置能够连接,承载和断开或控制电流, 可能在特定过载情况下和在短路等非正常电路情况下承载特定时间的电流. 其装置包括操作件,操作装置.开关装置可以是机械的或是电子的. 至少其中之一是电子的.3.1.28 功率 duty3.1.29.工作类型 duty-type是持续, 短时, 间隙的3.1.30 负载持续率cyclic duration factor工作周期中的负载包括连接和断开在整个周期的时间以百分数表示.3.1.31 保护阻抗 protective impedance在火体和可接触导电部分之间的阻抗,其电流在失效的情况下控制在一定安全的范围.3.2 电压,电流,功率的定义3.2.1 额定电压,额定电流,额定功率3.2.2 SELV安全特低电压safety extra-low voltage在与电网隔离的电路中, 导体之间或任何导体与地之间,电压不超过50Vac 或120 Vdc. SELV 被认为是不接地的安全特低电压.3.2.3 过电流 over current3.2.4 过载 overload,在未受电气损害的电路中,会引起过电流的运行状态.3.2.5 短路电流short circuit current3.2.6 工作电压 working voltage3.2.7 过电压 over voltage3.2.8 Recurring peak voltage交流电压变形或交流零件施加在直流电压上的周期性最高峰值.由于不时的开光产生的偶尔过电压不认为重复峰值电压.3.2.9 临时过电压temporary over voltage在额定频率下过电压稍长一点时间3.2.9.1 短时临时过电压不超过5秒3.2.9.2 长时临时过电压超过5秒3.2.10 脉冲耐压3.2.11 过电压类型(请参考附件K)3.2.12 额定负载3.2.13 最小负载电子开关工作的最小负载3.2.14 热电流3.3 关于不同类型开关的定义3.3.1 附装开关incorporated switch3.3.2 拼合开关 integrated switch3.3.3 旋转开关 rotary switch3.3.4 倒板开关 lever switch3.3.5 翘板开关 rocker switch3.3.6 按扭开关 push-button switch3.3.7 拉线开关 cord-operated switch3.3.8 推拉开关 push-pull switch3.3.9 自动复位开关 biased switch3.4 关于开关操作的定义3.4.1 驱动 actuation3.4.2 间接驱动 indirect actuation3.4.3 操作件 actuating member3.4.4 传动机构 actuating means3.4.5 断开 disconnection断开一极的电气电路并绝缘电源和连接的部分.3.4.6 微小断开 micro-disconnection一个极内的触头开距足以保证功能可靠.对触头间隙介电强度有要求,保证断开功能可靠.3.4.7 电子断开 electronic disconnection万一长时间短态过电压断开保证非循环正常功能.3.4.8 完全断开 full-disconnection一个极内的触头开距足以保证电源与要断开的那些部件之间的绝缘性能与基本绝缘相当.3.4.9 全极断开 all-pole disconnection对单相交流器具和直流器具而言,靠单一开关动作基本上同时断开两根电源线. 对连接多于2根电源线的器具而言, 除了接地线外,靠单一开关基本同时断开全部电源线.3.4.10 操作 operation3.4.11 操作循环 operation cycle3.4.12 电子操作部件 electronic actuating member如光控, 声控等3.4.13 电子操作机构 electronic actuating means3.4.14 非正常操作3.4.15 感应装置3.5 关于开关连接的定义3.5.1 外部导体 external conductor3.5.2 内装线 integrated conductor3.5.3 内接线 internal conductor3.5.4 软线连接方式3.5.4.1 X型连接 type X attachment3.5.4.2 Y型连接 type Y attachment3.5.4.3 Z型连接 type Z attachment3.6 关于端子和端头的定义3.7 关于绝缘的定义3.7.1 基本绝缘 basic insulation用在带电部分上,提供防触电基本防护的绝缘.3.7.2 附加绝缘 supplementary insulation为了在基本绝缘失效时提供防触电保护, 而在基本绝缘之外另加的独立绝缘.3.7.3 双重绝缘 double insulation包含基本绝缘和附加绝缘两者的绝缘.3.7.4 加强绝缘 reinforced insulation用在带电部分上的单一绝缘结构,其提供的防触电保护程度与双重绝缘相当.注: 术语绝缘结构并不意味着绝缘层必须是同质一体的, 它可由几层组成,但不能按附加绝缘或基本绝缘分开进行试验.3.7.5 功能绝缘 functional insulation具有电位差的带电部分之间的绝缘, 在开关使用寿命期间, 它是开关正确工作所必需的.3.7.6 涂层 coating3.7.7 固体绝缘 solid insulation3.7.8 0 类器具 class 0 appliance依靠基本绝缘防止触电的器具. 这意味着不存在将易触及导电部分(如有的话) 连接到电气安装固定布线中的保护导体上的措施. 在基本绝缘失效时,就需依靠环境条件防止触电.3.7.9 1 类器具class I appliance不仅依靠基本绝缘而且还包括一个附加安全措施来防止触电的器具.即提供将导电部分(不带电部分)连接到固定布线中的保护(接地)导体的措施,使这些导电部分在基本绝缘失效时也不可能带电.3.7.10 II 类器具class II appliance不仅依靠基本绝缘,而且还提供诸如双重绝缘或加强绝缘这类附加安全措施来防止触电的器具.它没有保护接地装置, 也不依赖于安装条件.3.7.11 III 类器具class III appliance依靠安全特低电压(SELV) 供电并且以内部不会产生高于安全特低电压的电压来防止触电的器具.3.8 关于污染的定义3.8.1 污染 pollution任何会引起介电强度或表面电阻率永久性降低的外来固体,液体或气体杂质.3.8.2 微小环境 micro-environment紧靠电气间隙和爬电距离周围的环境条件, 不包括开关正常工作时自身产生的污染. 微小环境可能比器具环境要好,也可能要坏.3.8.3 大环境 macro-environment3.8.4 污染等级 pollution degree3.8.4.1 清洁状态 clean situation没有污染或仅出现干的, 非导电性的污染. 此污染无影响.3.8.4.2 正常污染 normal situation通常仅出现非导电性的污染. 但必须估计到偶尔会由于冷凝而产生暂时性的导电性.3.8.4.3 脏污染 dirty situation出现导电性污染. 或出现干的, 非导电性的,但估计会由于冷凝而变成导电性的污染.4. 总要求 general requirements开关应设计和制作得在正常使用时能安全工作, 即使出现本标准第一部分及相应的第二部分所规定的在正常使用中可能发生的轻率使用, 也不会危及人或周围环境.通常进行全部有关试验来检验是否符合要求.5. 试验一般注意事项general notes on tests5.1 按本标准进行的试验是型式试验5.2 除非本标准另有规定, 否则试样以交货状态(25+10)℃的环境温度中试验. 试样按制造厂的说明安装, 如果说明的方法不止一种,而安装方法有很关键, 则采用最不利的安装方法.注:如有争议, 则在20+5)℃的环境温度中试验.5.3 带着不可拆卸导线一起使用的开关,要带着所连接的相应导线一起试验.5.4 如果开关具有插片,则进行第16章和第17章试验时应使用新的插套.供试验用的扁形快速连接端头插套的外部尺寸应符合图8.注: 挑选扁形快速端头插套的方法列于附录H.插套的型式应适合于开关额定周围空气温度,被压接的导体应锡焊或熔焊在插套的压接部位(如有的话)5.5除非本标准第1部分另有规定.否则试验按本部条目顺序进行.需要的试样序号及相关条目如下: 5.5.1 具有下列额定值的开关:---只有直流的;---兼有直流和交流的;只要直流电压,电流额定值等于或大于交流额定值,试验以直流进行.……5.5.2 具有下列额定值的开关:---只有交流的;---兼有直流和交流的,但不满足5.5.1规定的对于这些额定值,用下列试样:第6章—第12章:用1号试样;第19章—第22章:用2号试样;第13章—第18章:交流额定值:用3-5号试样直流额定值: 有极性标志的用6-8号试样; 无极性标志的用6-8为一极, 9-11为另一极.5.5.3 一种电源内具有多个额定电压和(或)额定电流组合的开关.分別按最大額定電流組合, 次一檔額定電流組合..)注:對應多個電壓額定值, 有一個額定電流的開關,應以每種的最高電壓額定值進行測試.……5.6 标有额定功率的开关以该频率试验, 无额定频率的开关以50Hz试验, 标有额定功率范围的开关以该范围内最不利的频率试样.5.7 在进行第13章—第18章的试验时, 如果只有1个试样不符合其中一项要求, 则在另一组同样的试样上重复进行该不合格试验以及在此项之前可能影响该项试验结果的各项试验. 该组试样应全部符合重复的试验. 进行第6章—第12章和第19章—第22章的试验时,应不出现失败.5.8 如果用于0类或I类器具的开关需要具有双重绝缘或加强绝缘的零件, 则在这些零件按用于II类器具的开关规定的要求检验.同样,若有在安全特低电压下工作的开关零件, 则这些零件也按用于III类器具的开关所规定的要求检验.5.9 对本标准而言, 操作件可用试验设备来驱动. 高速测试按章节17.2.4进行.5.10 只要可能, 信号指示灯与开关一起试验.灯光的光亮度可以不用考虑,测试可能考虑电气,机械和热影响.独立于开关的指示灯应持续工作.5.11…5.12…5.13对于电子开关, 可能要必要断开或短路电子零件测试.5.14对于23.1.1.1 abnormal test, 要增加样品测试.6. 额定值6.1最大额定电压为440V注: 优先值50V, 125V, 230V, 250V, 400V, 440V6.2 带信号指示灯的开关可以对指示灯有不同的额定电压.6.3 最大额定电流63A.注: 优先值1A, 2A, 4A, 6A, 10A, 16A, 20A, 25A, 40A, 63A.7. 分类7.1 开关分类7.1.1 按电源分类AC; DC, AC 和 DC7.1.2 按开关開關所控制的電路負載分结合附录F 开关应用通则7.1.2.1功率因數不低于0.9的基本電阻性負載7.1.2.2電阻性負載或功率因數不低于0.6的電動机負載;或者兩者負載組合7.1.2.3交流電阻性与電容性組合負載7.1.2.4白熾燈負載7.1.2.5特定負載7.1.2.6電流不大于20毫安的負載7.1.2.7特别灯饰负载7.1.2.8功率因素大于0.6的电感性负载7.1.2.9带有锁定转子马达的特殊负载且功率因素大于0.6.7.1.2.10电子开关的最小负载.7.1.3按周圍空气溫度分:7.1.3.1包括操作件在內整体在0~55℃7.1.3.2包括操作件在內整体在高于55℃或低于0℃, 或两者.7.1.3.3操作件和易觸及部分在0~55℃,而其它部分在在高于55℃的空气溫度中使用.---最高溫度的优先值:85℃, 100℃, 150℃---最低溫度的优先值:-10℃,-25℃,-40℃---限值可不同优先值,但應是5℃的倍數.7.1.3.4 电子线上开关和电子独立安装开关适用于最大环境温度为35℃7.1.3.4.1—电子线上开关和电子独立安装开关包括操作件在內整体在周围空气温度0~35℃7.1.3.4.2—电子线上开关和电子独立安装开关包括操作件在內整体在周围空气温度高于35℃或低于0℃, 或两者.---最高溫度的优先值: 55℃, 85℃, 100℃, 125℃---最低溫度的优先值:-10℃,-25℃,-40℃---限值可不同优先值,但應是5℃的倍數.7.1.4 按操作次数頻繁操作開關指操作循環數為50,000的開關,不頻繁操作開關指操作循環數為10,000的開關,7.1.5 IP等级7.1.6 按開關不另加防護時所使用的環境污染分:7.1.6.1 清潔狀態—正常工作狀態: 污染等级17.1.6.2. 正常狀態---嚴酷工作狀態: 污染等级27.1.6.3. 臟狀態—极嚴酷工作狀態: 污染等级37.1.7 按開關操作方式分:旋轉; 倒扳, 饒板, 按扭, 拉線, 推拉, 通过感应器操作的电子开关(触摸, 靠近, 旋转, 光, 声, 热或其它感应)7.1.8 按標志:帶限定標志CT(專用型號)帶詳盡標志C.T.(通用型號)7.1.9 按耐熱性和耐燃性的使用等級:1級開關6502級開關7503級開關8507.1.10 按额定脉冲耐压330V, 500V, 800V, 1500V, 2500V, 4000V7.1.11 按断开类型电子断开, 微小断开, 完全断开7.1.12 按电路板的涂覆.Type A, Type B7.1.13 按开关的类型或连接.7.1.14 按电子开关的开关装置半导体式, 机械式7.1.15 按电子开关的制冷方式非强制, 强制,7.1.16 按电子开关的负载类型S1持续, S2 短时, S3间隙7.1.17 按电子开关的测试条件----用热电流或最大额定电阻电流----按7.1.2的负载类型模拟测试条件.----按最终产品用途测试.7.2.14 耐焊接熱能力:1型焊錫端子(235℃锡槽) 2型焊錫端子(350℃烫铁);8. 用標志或文件說明額定電流和額定電壓可只用數字來標志,電流數字置于電壓之前或之上,用直線將其分開. 1.對電阻,電動机負載電路, 電動机負載的額定電流放于電阻性負載額定電流之后, 而電源种類符號置于電流,電源值之后.16(3) A 250 V~, 16(3) / 250~, 16(3) ~2502.對電阻,電容性負載電路,峰值浪勇電流置于電阻性負載額定電流之后, 並用一斜杠子分開.而電源种類符號置于電流,電源值之后.2 / 8A 250 V~, 2 / 8 ~2503. 對電阻性和白熾燈負載電路,白熾燈負載的峰值浪勇電流放在方括號內, 置于電阻性負載額定電流之后,而電源种類符號置于電流,電源值之后.6〔3〕A 250 V~, 6〔3〕/250~, 6〔3〕~2505. 对電感性負載電路(7.1.2.9), 电感性负载的额定电流放在双引号括號內.“4A”250V~, “4”/250~, “4” ~2506. 对锁定转子的特殊马达負載電路(7.1.2.9),6/(3/3) A 250V~ 6(3/3) /250~ 6(3/3) ~2507.热电流的额定值在最大电流之前.3<12/250~8.1 开关環境溫度25T85(指空气溫度范圍(-25℃~85℃); T85 (指空气溫度范圍(0~85℃)T85/55(指空气溫度范圍85℃,而操作件周圍溫度55℃)8.2 电子开关環境溫度25T85(指空气溫度范圍(-25℃~85℃); T85 (指空气溫度范圍(0~85℃)T85/35(指空气溫度范圍85℃,而操作件周圍溫度35℃)8.6 Class II 不能用于开关.8.7 额定操作循环数应以幂的形式E做标记, 操作循环次数为10,000的开关不需要该标志.8.8 开关需要标出的标志应标在开关的主体上, 容许标在不易拆卸的零件上,但不可标在螺钉,可拆卸垫圈或其他在开关接线和安装时可能拆下的零件上.对于小尺寸开关而言,标志可标在不同的表面上.8.9 开关需要标出的标志应清晰耐久.通过观测以及按下述方法用手擦拭标志来检验是否符合要求.8.10如果开关有自身外壳且不用于器具, 应明显标出OFF位置. 带有微小开关或电子开关不用标注O (OFF位置)对于按扭开关只有一个按钮不用标识OFF位置.标志O仅用于完全断开8.11对于电子线上开关和独立安装开关如果有两个以上端子. 负载端应按相关安装说明用箭头.(8.標識和文件8.1 開關標志類型: 專用型號開關U.T. & 通用型號開關 C.T.制造商的名稱或商標型號開關環境和安裝(文件:防水防潮等級, 放電擊等級, 安裝方法)溫度( 0-55℃if no marking)電氣負載: 額定電壓, ~,Hz, 額定電流3 [1.5]A 電阻性負載和白熾燈負載.連接軟線的接線端子操作次數IE4指示燈完全電路斷開絕緣材料:PTI (50滴, 保証耐漏電起痕指數175V)灼熱絲: 等級2開關750℃不可使用Class II的標識本身有外殼且不裝在器具內的開關應清楚表有O (斷開)或操作方向.專用控制燈具的軟線開關不需要”斷開”)9. 放電擊保護9.1开关按正常使用方式安装和操作, 并处于任何使用位置时, 以及在拆除任何易拆卸零件(带灯头的灯泡不拆卸)后, 均应有足够的防止触及开关带电部分的保护.用于II类器具开关还应防止触及仅由基本绝缘与带电部分隔开的金属零件或基本绝缘本身.注:对于触摸开关, 如果金属感应部分与火体连接的部分通过保护性阻抗,认为是提供防电击保护.通过观察以及下述试验来检验.1)开关按厂商规定安装并拆去易拆卸零件后(带灯头的灯泡不拆下),对开关的易触及部分试验.2)用IEC60529所示的铰接试指探触每一个可能的部位,探触时不用力.对铰接试指不能进入的孔隙,要用与铰接试指尺寸相同的直形无铰接试指作进一步试验. 试验时施加20N的力.如果该无铰接试指能进入, 再用铰接试指插入孔隙位置重复试验. 接触与否可用电接触器显示.3)对绝缘材料上和未接地金属零件上的孔隙, 用测试探针探触每个可能的部位, 探触不用力4)如有疑问,在16.2.2*触头和端子测试)的试验条件下重复测试.无论是铰接试指还是测试探针, 均应不可能触及裸露的带电零件.对具有双重绝缘结构零件的开关,标准测试试指(铰接试指和无铰接试指)应触及不到仅由基本绝缘与带电零件隔开的不接地金属零件或基本绝缘本身.漆膜, 瓷漆, 纸, 棉织物, 金属零件上的氧化膜,玻璃粉和受热即软的密封胶不应用作防止触及带电部分的保护.除非另有规定, 与不超过24V的特低安全电压源连接的零件不作为带电零件.注: 建议采用灯泡作为电接触指示器的电压不低于40V.9.1.1. 用于电子开关操作的可接触金属部分连接到火体部分用保护阻抗. 其电阻和电容符合如下要求:至少两个额定值相同的电阻串联, 并符合24.3的规定;至少两个额定值相同的Y2电容串联, 并符合IEC60384-14的要求;在串联中至少有一个电阻符合24.3的规定和一个电容符合Y2等级的IEC600384-14规定.移开保护性阻抗或短路, 只有破坏电子开关或者不能使用.9.1.2 如果盖子或防护玻璃或保险丝在没有工具的帮助下可以移开, 或者使用说明规定, 出于维修目的, 退换保险丝时用工具紧固盖子或防护玻璃移去时, 仍能确保不会触及火体.9.2如果拆下操动件后, 就能触及带电部分, 则开关的操作件应充分紧固, 如果只有在操作件破啐或剖开或借助专用工具拆除后才能触及带电部分, 则认为操动件已充分紧固.通过观察和用铰接试指来检验. 检验时不用力.9.3除用于III类器具的开关外, 操动件的易触及部分应由绝缘材料制成. 如果是金属的,则应由附加绝缘使之与基本绝缘零件隔开, 或由双重绝缘或加强绝缘使之与带电零件隔开.对于电子开关, 金属与火体用保护阻抗隔开.在单一可接触金属部分或任意可接触金属混合部分和地之间,在导通和断开状态下(或最大最小设定值), 以在额定电压和导通时的额定负载. 通过非电感2KΩ电阻. 在测试中,出于保护阻抗中的每一个电阻和所有其他部件, 每次短路一次.对于交流达到1KHz, 电流不能超过峰值0.7mA, 对于直流不能超过2mA.对于大于1KHz, 0.7mA X K, 但是不超过70mA.9.4电容不能连接可接触的未接地金属部分.金属外壳以附加绝缘同可接触未接地金属部分隔开.按第15章和20章规定.開關固定連接后火體不可触及到.如果是Class II, 与火體僅用基本絕緣的金屬不可觸及到.用鉸接試指測試不用力探測每一個部位, 對于不能進入的空隙,用直形無鉸接試指測試, 施加20N.開關的操作件應充分緊固.操作件的可触及部分應用絕緣材料, 如果是金屬的則用雙重或加強絕緣于火體分開.電容的金屬外殼應用附加絕緣与易觸及的不接地金屬零件隔開.10. 接地裝置10.1 用于II类器具的开关不应有将开关或其零件接地的装置, 但可以有保持接地电路连续性的过渡连接装置.10.2 接地端子.接地端头和其他接地装置不应与中性线端子成电气连接.10.3 对于I 类器具的开关,若绝缘损害就可能带电的易触及金属零件应有接地装置.通过观察来检验.10.3.1 由双重绝缘或加强绝缘与带电部分隔开的零件, 以及由接至接地端子,接地端头或其他接地装置的金属零件与带电部分遮拦的零件, 都不认为是绝缘损害就可能带电的零件.10.3.2 开关的易触及金属零件可通过其紧固件接地, 但连接处的金属表面必须洁净.10.4接地端子,接地端头或其他接地装置与其所连接的各零件之间的连接应是低电阻.测试如下:a)接地端子,接地端头或其他接地装置与其所连接的各零件之间依次通以 1.5倍额定电流,但是不超过25A, 电源的空载电压不超过12V.b)到达稳定后,测量接地端子,接地端头或其他接地装置与其所连接的各零件之间的电压降,并根据电流和电压计算出电阻. 电阻不得大于50mΩ.10.5 连接非制备导线的各种接地端子规格不应小于相应载流端子的规格. 不使用工具,应不可能松开夹紧装置. 夹紧装置应充分锁定, 以防意外松动.通过观察,手试以及第11章的相应试验来检验.10.5.1 一般情况下, 11.1.1和11.1.2的接线端子常用的结构具有良好的弹性,符合充分锁定,防止意外松脱的要求.10.5.2 如果开关会受到过度振动或周期性的温度变化, 则在采用柱式端子时,可能由必要采取附加措施, 例如使用具有足够弹性的零件(如压板)等.10.6 如果在正常使用时不必拧紧接地连接, 并且每一连接至少有2只螺钉,则容许通过自切螺钉或自攻螺丝接地.通过观测以及在19.2试验时的来检验.10.7 接地端子的所有零件应不会由于接触接地导线的铜线或接触其他金属而引起腐蚀.10.8 除非接地端子本体是外壳的一部分, 否则接地端子本体应由黄铜制成, 或由耐腐蚀性能不亚于黄铜的其他金属制成. 当接地端子本体是外壳的一部分, 螺钉或螺母应由黄铜制成, 或由符合19.3的有镀层的钢制成,也可由耐腐蚀性能和防绣能力均不亚于黄铜的其他金属制成.10.9 如果接地端子本体是铝或铝合金机架或外壳的一部分,则应有措施,避免铜与铝或铝合金接触而引起腐蚀.通过观察来检验10.7,10.8,10.9的要求,如有疑问,则对材料及其涂层进行分析.11.接線端子与端頭(参考附录G)11.1 连接铜导线的接线端子11.1.1 连接非制备的铜导线和不需使用专用工具的接线端子11.1.1.1共同要求11.1.1.1.1接线端子应用螺钉,螺母,弹簧,契块,偏心块,锥体或等效的构件或方法实现连线.接线和拆线时不需使用专用工具.通过观察来检验.11.1.1.1.2在夹紧和松开夹紧装置时, 接线端子不应松动.如果端子的活动不会妨害开关的正确动作, 则容许浮动的端子或浮动部件上的端子(例如某些积木式开关中的端子.通过将一根具有表4 规定最大截面积的导线夹紧和松开各10次来检验, 对螺纹型端子的扭矩按表20中的规定.11.1.1.1.3在接线时, 和按规定方式操作开关时,导线不应从接线端子内滑脱. 通过下述试验测试a)接线端子接表4规定的最大截面积导线, 用表20规定的扭矩拧紧夹紧装置.然后接线端子按表4规定的最小截面积导线, 重复上述试验.表4 端子承载的电阻性电流与相应的连接非制备导线的端子截面积.b)供连接2根或2根以上导线的接线端子,接上规定根数的导线,重复此项试验.c)导线插入端子前,应将硬线的线芯矫直; 将软线朝一个方向绞捻,在约20mm长度内均匀地绞捻一转.d)将导体插入端子并超出端子, 超出长度等于规定的最短距离;如果未规定该距离,则一直插到底,直到挡块或插到导体从端子另一侧伸出,恰好使胶合导体最易散开的位置为止.e)对于软线,还要用新电线按上述方式反方向绞捻后,重复此项试验. 试验后导线不应散托而进入或穿过夹紧位置与定位件间的空隙.注:符合IEC60228的导线最大直径列于表511.1.1.1.4 连接软线的接线端子在接线时,即使有芯线从端子中散托,也不应使带电部分与易触及金属零件接触; 对用于II类器具的开关而言, 还不应使带电部分与仅由附件绝缘和易触及金属零件隔开的金属零件接触;也不应使那些只有通过开关的动作才会呈电气连接的端子之间形成短路. 通过观察和下述试验来检验.a)把表4规定的最小截面积软线线端剥出8mm长的绝缘层,留出一根芯线,其余完全插入端子并夹紧.b)在不撕裂绝缘层的情况下,把那根留出的芯线向各个可能的方向弯折,但不得绕过隔板做急剧弯折.该留出芯线不应触及上述有关零件.接地端子留出的芯线还不应触及带电部分.11.1.1.1.5 接线端子应能夹紧导线而不过度损害导线.。
1952801资料
Extract from the onlinecatalogMCDNV 1,5/ 4-G1-3,5 P26THROrder No.: 1952801The figure shows a 10-position version of the producthttp://eshop.phoenixcontact.de/phoenix/treeViewClick.do?UID=1952801Headers, 3.5 mm pitch, pin length 2.6 mm, plug-in direction vertical to the PCBhttp://Please note that the data givenhere has been taken from theonline catalog. For comprehensiveinformation and data, please referto the user documentation. TheGeneral Terms and Conditions ofUse apply to Internet downloads. Technical dataDimensions / positionsLength16 mmHeight13.3 mmPitch 3.5 mmDimension a10.5 mmNumber of positions4Pin dimensions0,8 x 0,8 mm Pin spacing 3.5 mmHole diameter 1.3 mmTechnical dataInsulating material group IIIaRated surge voltage (III/3) 2.5 kVRated surge voltage (III/2) 2.5 kVRated surge voltage (II/2) 2.5 kVRated voltage (III/2)200 VRated voltage (II/2)250 V Connection in acc. with standard EN-VDE Nominal current I N8 ANominal voltage U N160 V Maximum load current8 A (per position) Insulating material LCP Inflammability class acc. to UL 94V0Certificates / ApprovalsApproval logoCULNominal voltage U N150 VNominal current I N8 AULNominal voltage U N150 VNominal current I N8 A Certification CUL, ULAccessoriesItem Designation DescriptionMarking0805030SK 3,5/2,8:SO Marker card, special printing, self-adhesive, labeled acc. tocustomer requirements, 14 identical marker strips per card, max.25-position labeling per strip, color: White0804109SK 3,81/2,8:FORTL.ZAHLEN Marker card, printed horizontally, self-adhesive, 10-section markerstrip, 14 identical decades marked 1-10, 11-20 etc. up to 91-(99)100, sufficient for 140 terminal blocksPlug/Adapter1734634CP-MSTB Coding profile, is inserted into the slot on the plug or invertedheader, red insulating materialDrawingsDrilling diagramDimensioned drawingAddressPHOENIX CONTACT GmbH & Co. KGFlachsmarktstr. 832825 Blomberg,GermanyPhone +49 5235 3 00Fax +49 5235 3 41200http://www.phoenixcontact.de© 2008 Phoenix ContactTechnical modifications reserved;。
42118-024中文资料
42118POSITIVE HIGH TEMPERATUREFIXED VOLTAGE REGULATORDesigned for use in high temperature environmentsMii MICROCIRCUITS DIVISIONFeatures:• Operating temperature +200ºC• Output current to 1.0 A• Input voltage to +38 V• Output voltage to +30V• Internal short circuit protection, foldback and current limiting• Isolated TO-258 package Applications:• Military and Hi Rel Industrial harsh environment applications where hermetically sealed product is required• Down hole applicationsDESCRIPTIONThe 42118 series of fixed voltage regulators covers the output voltage range from +5 VDC through +30 VDC. These voltage regulators are fabricated using hybrid techniques and will operate at temperatures up to +200ºC. These devices are complete with internal short circuit protection, which includes voltage shutdown and current foldback. It is strongly recommended that input and output capacitors be added as close to the case as possible. A 2µf capacitor should be addedMicropac Industries cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement.Micropac reserves the right to make changes at any time in order to improve design and to supply the best product possible.ELECTRICAL CHARACTERISTICSPARAMETER TEST CONDITIONSTEMPERATURE TYPICAL *Output voltage I OUT = 1.0 A V IN = V OUT +3 VDC +25°C to +200°CV OUT ±1.0%*Line regulationV IN = (V OUT +3 VDC)to +38 DC I OUT = 50 mA+25°C to +200°CV OUT ±0.5%Load regulationV IN = V OUT +5 VDC I OUT = 0.05 to 1.0 A +25°C to +200°CV OUT ±0.5% @ 25ºC ± 1.0% @ 200ºCRipple rejection at 120 Hz V IN = V OUT +5 VDCI L = 300 mA +25°C -50 dBStandby current V IN = V OUT +5 VDCI OUT = 0 +25°C30 mAShort circuit current V IN = V OUT +5 VDC +25°C 400 mA Short circuit current V IN = V OUT +5 VDC +200°C 200 mA Foldback current (knee) V IN = V OUT +5 VDC +25°C 2 A Foldback current (knee) V IN = V OUT +5 VDC +200°C 1.5 A Noise output V IN = V OUT +5 VDC I OUT = 300 mA +25°C2 mVRMSDifferential voltage ( ∆V= V IN – V OUT ) I OUT = 300 mA+25°C to +200°C3 VDC MIN*V IN = 10V MinTABLE 1 (see note) TYPEV OUT (volts) MAX I OUT (amps)I KNEE TYP(amps at 25°C) 42118-005 5 1.0 2.0 42118-012 12 1.0 2.0 42118-015 15 1.0 2.0 42118-018 18 1.0 2.0 42118-024241.02.0 42118-030 30 1.02.0NOTE: Under condition (V IN – V OUT) x l OUT ≤ 8 watts at 200°COption: 1) Other output voltage available2) MIL-STD-883 type screening availableMicropac Industries cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement.Micropac reserves the right to make changes at any time in order to improve design and to supply the best product possible.Mechanical ConfigurationPin Function 1 V OUT2 Common 3V IN。
丹东华奥 LDA515电感式接近开关说明书
丹东华奥电子有限公司简介LDA515(替代TCA505)是针对电感式接近开关应用而开发的具有短路保护功能的专用集成电路，可广泛应用于各种接近传感器或接近控制系统中，也可用来制作多种感应式检测仪表，如感应式转速表等。
LDA515由振荡器、开关电路和放大输出电路组成，其基本工作原理是利用外接的电感电容构成LC 高频谐振电路，并在谐振环路中产生一个交变磁场。
当被检测的金属目标接近这一磁场并达到感应距离时，在被检测的金属目标内产生涡流并吸取振荡器的能量，使得振荡器振幅衰减或停振。
振荡器振荡及停振的变化被后级放大电路处理并转换成开关信号，触发驱动控制器件，从而实现了非接触式检测的目的。
LDA515具有集成度高、工作电压宽、输出电流大、控制距离可调、外围电路少、应用方便、工作稳定可靠等特点。
和一般分立元器件组成的电感式接近开关方案相比，LDA515集成芯片方案的一致性、稳定性更好，因此特别适用于高要求高可靠性的场合。
LDA515采用DFN-14L 封装形式。
特点系列信息●宽的工作电压范围：4.0~40V ●较低的静态工作电流：小于0.7mA ●内部集成的输出级驱动电流达到70mA ●高的抗干扰性能●开关频率可达5KHz ●可用于二线制交流接近开关●具有温度补偿功能●具有短路保护和过载保护功能●工作温度范围-40~+125℃典型应用●电感式接近开关●无触点开关●位置控制●隔离检测●转速测量封装说明DFN-14L管装，编带，无铅有短路保护的电感式接近开关集成电路丹东华奥电子有限公司引脚定义序号符号功能说明1LC 振荡器LC 和GND 之间外接电感和电容，用于构成谐振电路。
2R Di 距离设置电阻R Di 外接电阻，用于设定振荡器中的电流和检测距离。
3C I 积分电容C I 和GND 之间通常外接1nF 电容，可以起到减少干扰的作用。
4R Hy 回差设置R Hy 和GND 之间外接电阻，用于设置检测的窗口回差。
5SC 短路检测电路输出级的短路采样（可以对V CC ，也可以对GND ）。
NCP1015中文资料
Storage Temperature Range
ESD Capability, Human Body Model (HBM) (All pins except HV)
1 15
9.0 77 60 14 74 55 150 -60 to +150 2
demand.
3
5
DRAIN
Drain Connection
The internal drain MOSFET connection.
-
-
-
-
-
-
7
GND
The IC Ground
-
4
8
GND
The IC Ground
-
2
元器件交易网
MARKING DIAGRAMS
8 1
PDIP-7 CASE 626A AP SUFFIX
P1015APyy AWL
YYWWG
1
4
4
SOT-223
CASE 318E
1
ST SUFFIX
AYW
1015yĂG G
1
yy y A WL YY WW G or G
= 06 (65 kHz), 10 (100 kHz) = A (65 kHz), B (100 kHz) = Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Package
元器件交易网
NCP1015
Self-Supplied Monolithic Switcher for Low StandbyPower Offline SMPS
TK11818中文资料
TL: Tape Left
VIN
OSC
DK STARTUP CIRCUIT
OSCILLATOR
FEEDBACK CONTROL
REFERENCE VOLTAGE
VOUT T1
January 1999 TOKO, Inc.
Page 1
元器件交易网
TK11816, TK11817, TK11818, TK11819
0.3
UNITS mA mA V V mA mA %
mV/° C mV/° C
TK11819 ELECTRICAL CHARACTERISTICS
Test Conditions: VIN = 5 V, TA = 25 °C (Notes 3 & 5), unless otherwise specified.
TYP 4.7 12.1 16.8 9.30 4.5 6.0 0.06 1.81 2.31
MAX 9.0 19.0 17.6 9.80
0.3
UNITS mA mA V V mA mA %
mV/° C mV/° C
Page 2
January 1999 TOKO, Inc.
元器件交易网
SYMBOL
PARAMETER
TEST CONDITIONS
MIN
IIN
Supply Current
VOUT
Output Voltage
IOUT
Output Current
Load Reg Load Regulation
VOUT = 16.8 V, IOUT = 0.1 mA
VOUT = 9.3 V, IOUT = 1.0 mA
TK11816 TK11817 TK11818 TK11819
FDN5618P_NL中文资料
ID(on) gFS Ciss Coss Crss td(on) tr td(off) tf Qg Qgs Qgd IS VSD
A S pF pF pF ns ns ns ns nC nC nC A V
Dynamic Characteristics
VDS = –30 V, f = 1.0 MHz V GS = 0 V,
Switching Characteristics
Turn–On Delay Time Turn–On Rise Time Turn–Off Delay Time Turn–Off Fall Time Total Gate Charge Gate–Source Charge Gate–Drain Charge
On Characteristics
Gate Threshold Voltage Gate Threshold Voltage Temperature Coefficient Static Drain–Source On–Resistance On–State Drain Current Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance
Device Marking 618 Device FDN5618P Reel Size 7’’ Tape width 8mm Quantity 3000 units
2000 Fairchild Semiconductor Corporation
FDN5618P Rev C(W)
元器件交易网
FDN5618P
Typical Characteristics
SN75188NE4中文资料
PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)5962-86889012A ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type 5962-8688901CA ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type 5962-8688901DA ACTIVE CFP W141TBD A42SNPB N/A for Pkg Type MC1488N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeMC1488NE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg Type SN55188J ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type SN75188D ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN75188DE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN75188DR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN75188DRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN75188N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeSN75188NE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeSN75188NSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN75188NSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SNJ55188FK ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type SNJ55188J ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type SNJ55188W ACTIVE CFP W141TBD A42SNPB N/A for Pkg Type (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is 18-Jul-2006provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annualbasis.18-Jul-2006IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetwork Microcontrollers Security /securityLow Power Wireless /lpw Telephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2006, Texas Instruments Incorporated。
PT15-21BTR8;中文规格书,Datasheet资料
Technical Data Sheet 1206 Package PhototransistorPT15-21B/TR8Features․Fast response time ․High photo sensitivity ․Small junction capacitance ․Pb free ․The product itself will remain within RoHS compliant version.Descriptions․PT15-21B/TR8 is a phototransistor in miniature SMD package which is molded in a black plastic with flat top view lens. The device is spectrally matched to infrared emitting diode.Applications․Miniature switch ․Counters and sorter ․Position sensor ․Infrared applied systemDevice Selection Guide LED Part No.PTChip MaterialSiliconLens ColorBlackEverlight Electronics Co., Ltd. Device No：DTT-015-031http:\\ Prepared date：06-06-2006Rev 2Page: 1 of 10Prepared by：Jaine Tsai/PT15-21B/TR8Package DimensionsEmitter CollectorNotes: 1.All dimensions are in millimeters 2.Tolerances unless dimensions ±0.1mmAbsolute Maximum Ratings (Ta=25℃)Parameter Collector-Emitter Voltage Emitter-Collector-Voltage Collector Current Operating Temperature Storage Temperature Soldering Temperature Power Dissipation at(or below) 25℃Free Air Temperature Symbol VCEO VECO IC Topr Tstg Tsol Pc Rating 30 5 20 -25 ~ +85 -40 ~ +85 260 75 Units V V mA ℃ ℃ ℃ mWNotes: *1:Soldering time≦5 seconds.Everlight Electronics Co., Ltd. Device No：DTT-015-031http:\\ Prepared date：06-06-2006Rev 2Page: 2 of 10Prepared by：Jaine Tsai/PT15-21B/TR8Electro-Optical Characteristics (Ta=25℃)Parameter Rang Of Spectral Bandwidth Wavelength Of Peak Sensitivity Collector-Emitter Breakdown Voltage Emitter-Collector Breakdown Voltage Collector-Emitter Saturation Voltage Collector Dark Current Symbol λ0.5 λP BVCEO BVECO VCE(sat) ICEO Condition ----IC=100μA Ee=0mW/cm2 IE=100μA Ee=0mW/cm2 IC=2mA Ee=1m W/cm2 VCE=20V Ee=0mW/cm2 VCE=5V Ee=1mW /cm2 VCE=5V IC=1mA RL=1000Ω Min 730 --30 5 ----Typ --940 --------Max 1100 ------0.4 100 Unit nm nm V V V nAOn State Collector Current Rise Time Fall TimeIC(ON) tr tf0.1 -----0.3 15 15 ---mAμS ---Everlight Electronics Co., Ltd. Device No：DTT-015-031http:\\ Prepared date：06-06-2006Rev 2Page: 3 of 10Prepared by：Jaine Tsai/PT15-21B/TR8Typical Electro-Optical Characteristics CurvesFig.1Collector Power Dissipation vs. Ambient Temperature Fig.2 Spectral Sensitivity100 80 60 40 20 01.0 Ta=25 C 0.8 0.6 0.4 0.2 0-250255075 85 1007008009001000 1100 1300Fig.3 Relative Collector Current vs. Ambient TemperatureFig.4 Collector Current vs. Irradiance160 140 120 100 80 60 40 20 0 0 10 20 30 40 50 60 702100 C 10 1 0.10.01 0.51325Everlight Electronics Co., Ltd. Device No：DTT-015-031http:\\ Prepared date：06-06-2006Rev 2Page: 4 of 10Prepared by：Jaine Tsai/PT15-21B/TR8Typical Electro-Optical Characteristics CurvesFig.5 Collector Dark Current vs. Ambient Temperature Fig.6 Collector Current vs. Collector-Emitter Voltage1014 1210 1010 8 610 10 0 25 50 75 1004 2 0 0 1 2 3 4Everlight Electronics Co., Ltd. Device No：DTT-015-031http:\\ Prepared date：06-06-2006Rev 2Page: 5 of 10Prepared by：Jaine Tsai/PT15-21B/TR8Precautions For Use1. Over-current-proof Customer must apply resistors for protection , otherwise slight voltage shift will cause big current change ( Burn out will happen ). 2. Storage 2.1 Do not open moisture proof bag before the products are ready to use. 2.2 Before opening the package, the LEDs should be kept at 30℃ or less and 90%RH or less. 2.3 The LEDs should be used within a year. 2.4 After opening the package, the LEDs should be kept at 30℃ or less and 70%RH or less. 2.5 The LEDs should be used within 168 hours (7 days) after opening the package. 2.6 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment : 60±5℃ for 24 hours. 3. Soldering Condition 3.1 Pb-free solder temperature profile3.2 Reflow soldering should not be done more than two times. 3.3 When soldering, do not put stress on the LEDs during heating. 3.4 After soldering, do not warp the circuit board.Everlight Electronics Co., Ltd. Device No：DTT-015-031http:\\ Prepared date：06-06-2006Rev 2Page: 6 of 10Prepared by：Jaine Tsai/PT15-21B/TR84.Soldering Iron Each terminal is to go to the tip of soldering iron temperature less than 280℃ for 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder. 5.Repairing Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.Everlight Electronics Co., Ltd. Device No：DTT-015-031http:\\ Prepared date：06-06-2006Rev 2Page: 7 of 10Prepared by：Jaine Tsai/PT15-21B/TR8Reliability Test Item And Condition The reliability of products shall be satisfied with items listed below. Confidence level：90% LTPD：10% NO. Item Test Conditions Test Hours/ Sample Cycles Sizes 6Mins 22pcs 22pcs IC(ON)≦L×0.8 L：Lower 22pcs Specification Limit 0/1 Failure Judgement Criteria Ac/Re1 REFLOWTEMP.：260℃±5℃0/1 0/15secs 2 Temperature Cycle H : +100℃ L : -40℃ 3 Thermal Shock H :+100℃ L :-10℃ 4 High Temperature Storage 5 Low Temperature Storage15mins 50Cycles 5mins 15mins 5mins 50Cycles 10secs 5mins 1000hrs 1000hrs 1000hrs 1000hrsTEMP.：+100℃ TEMP.：-40℃22pcs 22pcs 22pcs 22pcs0/1 0/1 0/1 0/16 DC Operating Life VCE=5V 7 High Temperature/ 85℃ / 85% R.H High HumidityEverlight Electronics Co., Ltd. Device No：DTT-015-031http:\\ Prepared date：06-06-2006Rev 2Page: 8 of 10Prepared by：Jaine Tsai/PT15-21B/TR8Package DimensionsTaping DimensionsEmitter CollectorUnit:mmEverlight Electronics Co., Ltd. Device No：DTT-015-031 http:\\ Prepared date：06-06-2006 Rev 2 Page: 9 of 10Prepared by：Jaine Tsai/PT15-21B/TR8Packing Quantity Specification1.2000Pcs/1Volume，1Volume/1Bag 2.10Boxes/1CartonLabel Form SpecificationCPN: Customer’s Production Number P/N : Production Number QTY: Packing Quantity CAT: Ranks HUE: Peak Wavelength REF: Reference LOT No: Lot Number MADE IN TAIWAN: Production PlaceRoHSPT15-21B/TR8Notes1. Above specification may be changed without notice. EVERLIGHT will reserve authority on material change for above specification. 2. When using this product, please observe the absolute maximum ratings and the instructions for using outlined in these specification sheets. EVERLIGHT assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets. 3. These specification sheets include materials protected under copyright of EVERLIGHT corporation. Please don’t reproduce or cause anyone to reproduce them without EVERLIGHT’s consent.EVERLIGHT ELECTRONICS CO., LTD. Office: No 25, Lane 76, Sec 3, Chung Yang Rd, Tucheng, Taipei 236, Taiwan, R.O.C Tel: 886-2-2267-2000, 2267-9936 Fax: 886-2267-6244, 2267-6189, 2267-6306 http:\\Everlight Electronics Co., Ltd. Device No：DTT-015-031http:\\ Prepared date：06-06-2006Rev 2Page: 10 of 10Prepared by：Jaine Tsai/分销商库存信息: EVERLIGHTPT15-21B/TR8。
MIC5158BM中文资料
Micrel
Ordering Information MIC5157
Part Number MIC5157BN MIC5157BM Temperature Range –40°C to +85°C –40°C to +85°C Voltage Selectable Selectable Package 14-pin DIP 14-pin SOP
MIC5158
14 EN 13 S (Source) 12 D (Drain) 11 G (Gate) 10 VD D 9 C1– 8 C1+
March 1999
3-113
元器件交易网 MIC5156/5157/5158 Pin Description MIC5156
Pin Number 1 2 3 4 5 Pin Name EN FLAG GND VP VDD Pin Function
Part Number MIC5156-3.3BN MIC5156-5.0BN MIC5156BN MIC5156-3.3BM MIC5156-5.0BM MIC5156BM Temperature Range –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C Voltage 3.3V 5.0V Adjustable 3.3V 5.0V Adjustable Package 8-pin DIP 8-pin DIP 8-pin DIP 8-pin SOP 8-pin SOP 8-pin SOP
Ordering Information MIC5158
TPS7510XYYYZ中文资料
FEATURES DESCRIPTIONAPPLICATIONSV ENA V ENBV BATTTPS7510x YFF 9-Ball WCSP (T op View)TPS7510xSBVS080E–SEPTEMBER 2006–REVISED JANUARY 2008Low Dropout,Two-Bank LED Driver with PWM Brightness Control•Regulated Output Current with 2%LED-to-LED The TPS7510x linear low dropout (LDO)matching MatchingLED current source is optimized for low power keypad and navigation pad LED backlighting •Drives up to Four LEDs at 25mA Each in a applications.The device provides a constant current Common Cathode Topologyto up to four unmatched LEDs organized in two banks •28mV Typical Dropout Voltage Extends Usable of two LEDs each in a common-cathode topology.Supply Range in Li-Ion Battery Applications Without an external resistor,the current source •Brightness Control Using PWM Signals defaults to factory-programmable,preset current level with ±0.5%accuracy (typical).An optional external •Two 2-LED Banks with Independent Enable resistor can be used to set initial brightness to and PWM Brightness Control per Bankuser-programmable values with higher accuracy.•No Internal Switching Signals—Eliminates EMI Brightness can be varied from off to full brightness by •Default LED Current Eliminates External inputting a pulse width modulation (PWM)signal on each Enable pin.Each bank has independent enable Componentsand brightness control,but current matching is done –Default values from 3mA to 10mA (in 1mA to all four channels concurrently.The input supply increments)available using innovative range is ideally suited for single-cell Li-Ion battery factory EEPROM programmingsupplies and the TPS7510x can provide up to 25mA –Optional external resistor can be used for per LED.high-accuracy,user-programmable current No internal switching signals are used,eliminating •Over-Current and Over-Temperature troublesome electromagnetic interference (EMI).The ProtectionTPS7510x is offered in an ultra-small,9-ball,0.4mm ball-pitch wafer chip-scale package (WCSP),yielding •Available in Wafer Chip-Scale Packagea very compact total solution size ideal for mobile handsets and portable backlighting applications.The device is fully specified over T J =–40°C to +85°C.•Keypad and Display Backlighting •White and Color LEDs •Cellular Handsets•PDAs and SmartphonesPlease be aware that an important notice concerning availability,standard warranty,and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.All trademarks are the property of their respective owners.PRODUCTION DATA information is current as of publication date.Copyright ©2006–2008,Texas Instruments IncorporatedProducts conform to specifications per the terms of the Texas Instruments standard warranty.Production processing does not necessarily include testing of all parameters.ABSOLUTE MAXIMUM RATINGS (1)DISSIPATION RATINGSRECOMMENDED OPERATING CONDITIONSTPS7510xSBVS080E–SEPTEMBER 2006–REVISED JANUARY 2008This integrated circuit can be damaged by ESD.Texas Instruments recommends that all integrated circuits be handled with appropriate precautions.Failure to observe proper handling and installation procedures can cause damage.ESD damage can range from subtle performance degradation to complete device failure.Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.ORDERING INFORMATION (1)PRODUCT ID OPTIONS (2)TPS7510x yyyzX is the nominal default diode output current (for example,3=3mA,5=5mA,and 0=10mA).YYY is the package designator.Z is the reel quantity (R =3000,T =250).(1)For the most current package and ordering information see the Package Option Addendum at the end of this document,or see the TI web site at .(2)Default set 3mA to 10mA in 1mA increments are available through the use of innovative factory EEPROM programming.Minimum order quantities may apply.Contact factory for details and availability.Over operating temperature range (unless otherwise noted).PARAMETERVALUE V IN range–0.3V to +7.0V V ISET ,V ENA ,V ENB ,V DX range –0.3V to V INI DX for D1A,D2A,D1B,D2B35mA D1A,D2A,D1B,D2B short circuit duration Indefinite Continuous total power dissipation Internally limited Junction temperature (T J )–55°C to +150°C Storage temperature –55°C to +150°C(1)Stresses above these ratings may cause permanent damage.Exposure to absolute maximum conditions for extended periods may degrade device reliability.These are stress ratings only,and functional operation of the device at these or any other conditions beyond those specified is not implied.DERATING FACTORABOVE BOARD PACKAGER θJC R θJA T A =+25°CT A <+25°C T A =+70°C T A =+85°C Low-K(1)YFF 55°C/W 208°C/W 4.8mW/°C 480mW 264mW 192mW High-K (2)YFF55°C/W142°C/W7.0mW/°C704mW387mW282mW(1)The JEDEC low-K (1s)board used to derive this data was a 3inch ×3inch,two-layer board with 2ounce copper traces on top of the board.(2)The JEDEC high-K (2s2p)board used to derive this data was a 3inch ×3inch,multi-layer board with 1ounce internal power and ground planes and 2ounce copper traces on top and bottom of the board.PARAMETERMIN TYPMAX UNIT V IN Input voltage2.7 5.5V I DX Operating current per LED 325mA t PWM On-time for PWM signal33µs T J Operating junction temperature range–40+85°C2Submit Documentation FeedbackCopyright ©2006–2008,Texas Instruments IncorporatedProduct Folder Link(s):TPS7510xELECTRICAL CHARACTERISTICSTPS7510x SBVS080E–SEPTEMBER2006–REVISED JANUARY2008Over operating junction temperature range(T J=–40°C to+85°C),V IN=3.8V,DxA and DxB=3.3V,R SET=32.4kΩ,and ENA and ENB=3.8V,unless otherwise noted.Typical values are at T A=+25°C.PARAMETER TEST CONDITIONS MIN TYP MAX UNITI SHDN Shutdown supply current V ENA,B=0V,V DX=0V0.03 1.0µAI Q Ground current I SET=open,I DX=5mA,V IN=4.5V170200µAT A=+25°C024 Current matchingΔI D%(I DXMAX–I DXMIN/I DXMAX)×100%TA=–40°C to+85°C5ΔI DX%/ΔV IN Line regulation 3.5V≤V IN≤4.5V,I DX=5mA 2.0%/VΔI DX%/ΔV DX Load regulation 1.8V≤V DX≤3.5V,I DX=5mA0.8%/V Dropout voltage of any I DXnom=5mA28100 V DO DX current source mVI DXnom=15mA70(V DX at I DX=0.8×I DX,nom)V ISET Reference voltage for current set 1.183 1.225 1.257VI OPEN Diode current accuracy(1)I SET=open,V DX=V IN–0.2V0.53%I SET I SET pin current range 2.562.5µAk I SET to I DX current ratio(1)420V IH Enable high level input voltage 1.2V V IL Enable low level input voltage0.4VV ENA=3.8V 5.0 6.1I INA Enable pin A(V ENA)input currentµAV ENA=1.8V 2.2V ENB=3.8V 4.0 4.9I INB Enable pin B(V ENB)input currentµAV ENB=1.8V 1.8Delay from ENA and ENB=low tot SD Shutdown delay time reach shutdown current51330µs(I DX=0.1×I DX,nom)Shutdown,temp increasing+165 T SD Thermal shutdown temperature°CReset,temp decreasing+140 T J Operating junction temperature range–40+85°C (1)Average of all four I DX outputs.Copyright©2006–2008,Texas Instruments Incorporated Submit Documentation Feedback3Product Folder Link(s):TPS7510xTPS7510xSBVS080E–SEPTEMBER 2006–REVISED JANUARY 2008Table 1.Recommended (1%Tolerance)Set Resistor ValuesR SET (k Ω)I SET (µA)I DX (mA)(1)511 2.4 1.0255 4.8 2.01697.2 3.01279.6 4.110212.0 5.084.514.5 6.173.216.77.064.918.97.956.221.89.251.124.010.146.426.411.142.229.012.239.231.313.136.533.614.134.036.015.132.437.815.930.140.717.128.742.717.926.745.919.325.548.020.224.350.421.223.252.822.222.155.423.321.557.023.920.559.825.1(1)I DX =(V SET /R SET )×k.4Submit Documentation FeedbackCopyright ©2006–2008,Texas Instruments IncorporatedProduct Folder Link(s):TPS7510xPIN ASSIGNMENTSTPS7510x YFF 9-Ball WCSP (T op View)TPS7510xSBVS080E–SEPTEMBER2006–REVISED JANUARY 2008TERMINAL FUNCTIONSCopyright ©2006–2008,Texas Instruments Incorporated Submit Documentation Feedback5Product Folder Link(s):TPS7510xD1AD2AD1BD2BV IN ENBI SETENATPS7510xSBVS080E–SEPTEMBER 2006–REVISED JANUARY 2008FUNCTIONAL BLOCK DIAGRAM6Submit Documentation FeedbackCopyright ©2006–2008,Texas Instruments IncorporatedProduct Folder Link(s):TPS7510xTYPICAL CHARACTERISTICS0.5mA/div1V/divI OUTV IN20s/divm 30100102040Duty Cycle (%)I (m A )O U T 2520151050506070809020mA/div1V/divI OUTENA = ENB20s/divm 0.5mA/div1V/divI OUTV IN20s/divm 20mA/div1V/divI OUTENB20s/divm0.0600.200.020.040.08V V -(V)IN OUT I (m A )O U T 2520151050.100.120.140.160.18TPS7510xSBVS080E–SEPTEMBER 2006–REVISED JANUARY 2008Over operating junction temperature range (T J =–40°C to +85°C),V IN =3.8V,DxA and DxB =3.3V,R SET =32.4k Ω,and ENAand ENB =high,unless otherwise noted.Typical values are at T A =+25°C.LED CURRENT vs DUTY CYCLE (f =300Hz)LINE TRANSIENT (600mV Pulse)Figure 1.Figure 2.LINE TRANSIENT (300mV Pulse)DIMMING RESPONSE (Both Channels)Figure 3.Figure 4.DIMMING RESPONSE (Single Channel)OUTPUT CURRENT vs HEADROOM VOLTAGEFigure 5.Figure 6.Copyright ©2006–2008,Texas Instruments Incorporated Submit Documentation Feedback7Product Folder Link(s):TPS7510x1402042046050060100180R (k )W SET I (m A )O U T 28262422201816141210864202202603003403805020100304060R (k )W SET I (m A )O U T 28262422201816141210864207080904.02.55.53.03.54.5V (V)IN I (A )m Q 1801751701651601555.0+85C°+25C°-°40CI (m A )O U T V (V)IN 5.45.35.25.15.04.94.84.74.63.44.44.95.43.95.920-40-20040T emperature (C)°I (m A )O U T 5.45.35.25.15.04.94.84.74.66080851.54.00.51.02.0V (V)OUT I (m A )O U T 20181614121086422.53.03.5TPS7510xSBVS080E–SEPTEMBER 2006–REVISED JANUARY 2008TYPICAL CHARACTERISTICS (continued)Over operating junction temperature range (T J =–40°C to +85°C),V IN =3.8V,DxA and DxB =3.3V,R SET =32.4k Ω,and ENA and ENB =high,unless otherwise noted.Typical values are at T A =+25°C.OUTPUT CURRENT vs R SETOUTPUT CURRENT vs R SETFigure 7.Figure 8.TPS75105OUTPUT CURRENT vs INPUT VOLTAGEGROUND CURRENT vs INPUT VOLTAGER SET =OpenFigure 9.Figure 10.TPS75105OUTPUT CURRENT vs TEMPERATURER SET =OpenOUTPUT CURRENT vs OUTPUT VOLTAGEFigure 11.Figure 12.8Submit Documentation FeedbackCopyright ©2006–2008,Texas Instruments IncorporatedProduct Folder Link(s):TPS7510xAPPLICATIONS INFORMATIONLIMITATIONS ON LED FORWARD SETTING THE OUTPUT CURRENT LEVELR= ISET K V´ISETILED(1)USE OF EXTERNAL CAPACITORSUSE OF UNUSED OUTPUTS OR TYINGTPS7510xSBVS080E–SEPTEMBER2006–REVISED JANUARY2008VOLTAGESThe TPS7510x is a linear current sourceThe TPS7510x is a quad matched current source.implementing LDO regulator building blocks. Each of the four current source output levels is set byTherefore,there are some limitations to the forward a single reference current.An internal voltage(output)voltages that can be used while maintaining reference of1.225V(nominal)in combination with aaccurate operation.The first limitation is the resistor sets the reference current level.Thismaximum LED forward voltage.Because LDO reference current is then mirrored onto each of thetechnology is employed,there is the dropout voltage four outputs with a ratio of typically420:1.Theto consider.The TPS7510x is an ultra-low dropout resistor required to set the LED current is calculateddevice with typical dropouts in the range of30mV at using Equation1:5mA.Care must be taken in the design to ensure thatthe difference between the lowest possible inputvoltage(for example,battery cut-off)and the highestpossible forward voltage yields at least100mV of where:headroom.Headroom levels less than dropout •K is the current ratio decrease the accuracy of the current source(see •V ISET is the internal reference voltage Figure6).•I LED is the desired LED currentThe other limitation to consider is the minimum output For example,to set the LED current level to10mA,a voltage required to yield accurate operation.The resistor value of51.1kΩis required.This value sets current source employs NMOS MOSFETs,and a up a reference current of23.9µA(1.22V/51.1kΩ).In minimum forward LED voltage of approximately1.5V turn,this reference current is mirrored to each output on the output is required to maintain highest current source,resulting in an output current of10mA accuracy.The TPS7510x is ideal for white LEDs and (23.9µA×420).color LEDs with forward voltages greater than1.5V.This range includes red LEDs that have typical The TPS7510x offers two methods for setting theforward voltages of1.7V.output current levels.The LED current is set either byconnecting a resistor(calculated using Equation1)from the I SET pin to GND,or leaving I SETto employ the factory-programmed R SET resistance.The TPS7510x does not require the use of any The internal programmed resistance is implemented external capacitors for stable operation.Nominal using high-precision processing and yields a stray and/or power-supply decoupling capacitance on reference current accuracy of0.5%,nominal.the input is adequate for stable operation.Capacitors Accuracy using external resistors is subject to the are not recommended on the outputs because they tolerance of the external resistor and the accuracy of are not needed for stability.the internal reference voltage.The TPS7510x automatically detects the presence ofOUTPUTS TOGETHERan external resistor by monitoring the current out ofthe I SET pin.Current levels in excess of3µA signify Unused outputs may be left unconnected or tied tothe presence of an external resistor and the device the VIN supply.While open outputs are acceptable,uses the external resistor to set the reference current.tying unused outputs to the VIN supply increases ESDIf the current from I SET is less than3µA,the device protection.Connecting unused output to ground defaults to the preset internal reference set resistor.violates the minimum recommended output voltage, The TPS7510x is available with eight preset current results in current levels that potentially exceed the levels,from3mA to10mA(per output)in1mA set/preset LED current and should be avoided. increments.Solutions using the preset internalConnecting outputs in parallel is an acceptable way current level eliminate an external component,of increasing the amount of LED current drive.This thereby increasing accuracy and reducing cost.configuration is a useful trick when the higher currentlevel is a multiple of the preset value.Copyright©2006–2008,Texas Instruments Incorporated Submit Documentation Feedback9Product Folder Link(s):TPS7510xUSE OF ENABLE PINS FOR PWM DIMMINGLOAD REGULATIONLINE REGULATIONTPS7510xSBVS080E–SEPTEMBER 2006–REVISED JANUARY 2008The TPS7510x divides control of the LED outputs into The TPS7510x is designed to provide very tight load two banks of two current sources each.Each bank is regulation.In the case of a fixed current source,the controlled by the use of an independent,active-high output load change is a change in voltage.Tight load enable pin (ENA and ENB).The enable pin can be regulation means that output voltages (LED forward used for standard ON/OFF operation of the current voltages)with large variations can be used without source,driven by standard logic levels from impacting the fixed current being sourced by the processor GPIO pins,for example.Drive EN high to output or the output-to-output current matching.The turn on the bank of LEDs;drive EN low to turn off the permissible variation on the output not only allows for bank of LEDs.large variations in white LED forward voltages,but even permits the use of different color LEDs on Another use of the enable pin is for LED dimming.different outputs with minimal effect on output current.LED brightness is a function of the current level being driven across the diode and the time that current is being driven through the diode.The perceived brightness of an LED can be changed by either The TPS7510x is also designed to provide very tight varying the current level or,more effectively,by line regulation.This architecture allows for voltage changing the time in which that current is present.transient events to occur on the power supply When a PWM signal is input into the enable pin,the (battery)without impacting the fixed output current duty cycle (high or ON time)determines how long the levels or the output to output current matching.A fixed current is driven across the LEDs.Reducing or prime example of such a supply transient event is the increasing that duration has the effect of dimming or occurrence of a transmit pulse on the radio of a brightening the LED,without having to employ the mobile handset.These transient pulses can cause more complex method of varying the current level.variations of 300mV and 600mV on the supply to the This technique is particularly useful for reducing LED TPS7510x.The line regulation limitation is that the brightness in low ambient light conditions,where LED lower supply voltage level of the event does not brightness is not required,thereby decreasing current cause the input to output voltage difference to drop consumption.The enable pins can also be used for below the dropout voltage range.LED blinking,varying blink rates based on system status.Although providing many useful applications,PWM dimming does have a minimum duty cycle required to achieve the required current level.The recommended minimum on time of the TPS7510x is approximately 33µs.On times less than 33µs result in reductions in the output current by not allowing enough time for the output to reach the desired current level.Also,having both enables switching together,asynchronously,or having one enable on at all times,impacts the minimum recommended on time (see Figure 4and Figure 5).If one enable is already on,at other channel turns on is faster than if both channel were turning on together or if the other channel is off.Therefore,connecting one enable on Figure 13.Typical Application Diagramallows for approximately 10µs to 12µs shorter minimum on times of the switching enable channel.Unused enable pins can be left unconnected or connected to ground to minimize current consumption.Connecting unused enable pins to ground increases ESD protection.If connected to V IN ,a small amount of current drains through the enable input (see the Electrical Characteristics table).10Submit Documentation FeedbackCopyright ©2006–2008,Texas Instruments IncorporatedProduct Folder Link(s):TPS7510xTPS7510xSBVS080E–SEPTEMBER 2006–REVISED JANUARY 2008Figure 14.YFF Wafer Chip-Scale Package Dimensions (in mm)PACKAGING INFORMATIONOrderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)TPS75103YFFR ACTIVE DSBGA YFF 93000Green (RoHS &no Sb/Br)SNAG Level-1-260C-UNLIM TPS75103YFFT ACTIVE DSBGA YFF 9250Green (RoHS &no Sb/Br)SNAG Level-1-260C-UNLIM TPS75105YFFR ACTIVE DSBGA YFF 93000Green (RoHS &no Sb/Br)Call TI Level-1-260C-UNLIM TPS75105YFFTACTIVEDSBGAYFF9250Green (RoHS &no Sb/Br)Call TILevel-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and beliefon information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.PACKAGE OPTION ADDENDUM16-Jan-2008TAPE AND REEL BOX INFORMATIONDevice Package Pins SiteReel Diameter (mm)Reel Width (mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant TPS75105YFFR YFF 9SITE 1218081.34 1.340.8148Q1Device Package Pins Site Length(mm)Width(mm)Height(mm) TPS75105YFFR YFF9SITE12220.0220.034.0IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right, or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use any non-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers AudioData Converters AutomotiveDSP BroadbandClocks and Timers Digital ControlInterface MedicalLogic MilitaryPower Mgmt Optical NetworkingMicrocontrollers SecurityRFID TelephonyRF/IF and ZigBee®Solutions Video&ImagingWirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2008,Texas Instruments Incorporated。
LN8K06 LN8K15 LN8K16 LN8K17 LN8K18 LN8K19力生美电源管理芯片
LN8506、LN8K15L、N8K16、LN8K17、LN8K18、LN8K19描述：LN8K06 是一颗高性能电流模式的智能功率开关控制器集成电路，专为小家电控制板电源等非隔离式离线和直流到直流开关式降压变换器而设计。
其内部集成有完整的 PWM/PFM混合控制电路、高达750V耐压的功率开关电路、故障检测与保护电路、时钟与延时控制电路等，在85-380Vac的超宽电网电压条件下，具有高达200mA 的额定输出电流能力。
完善的内部电路设计，最大程度减少了外部器件数量，仅需极少器件即可实现一个典型的降压式BUCK拓扑开关电源设计，功能完善的多种故障保护电路，进一步简化了电源设计的难度，降低了成本；LN8K15 是一颗高性能电流模式的智能功率开关控制器集成电路，专为小家电控制板电源等非隔离式离线和直流到直流开关式降压变换器而设计。
其内部集成有完整的 PWM/PFM混合控制电路、高达 750V耐压的功率开关电路、故障检测与保护电路、时钟与延时控制电路等，在 85-380Vac 的超宽电网电压条件下，具有高达 400mA 的额定输出电流能力。
完善的内部电路设计，最大程度减少了外部器件数量，仅需极少器件即可实现一个典型的降压式BUCK拓扑开关电源设计，功能完善的多种故障保护电路，进一步简化了电源设计的难度，降低了成本；v 专为 BUCK降压转换器设计v 内置专利的 ZeroFluxTM控制技术v 内置 smartEnergyTM能效控制技术v 内部集成 750V高压功率开关v 峰值开关电流可由外部进行调节v 可靠的快速峰值电流限制工作模式v 具有短路、过载与过热保护功能v 极低的待机功率和极高的转换效率v 待机功耗可低至 0.10W以下v 满足能源之星 5级能效要求v 极少外围的 DIP7、SOP6高隔离封装v 额定输出电流能力可达 400mA主要特點難度，降低了系統成本。
芯片內置專利的ZeroFlux TM智能化磁v專為BUCK降壓轉換器設計v內置專利的ZeroFlux TM控制技術v內置smartEnergy TM能效控制技術通過零控制技術，開關機和每個開關週期導通均在磁芯磁通釋放至零時發生，確保磁芯工作在安全的磁滯回綫區域，從而徹v內部集成750V高壓功率開關底消除電流過沖現象，極大提高了系統工v峰值開關電流可由外部進行調節作的安全性。
fcc part 18中文版[1].
![fcc part 18中文版[1].](https://img.taocdn.com/s3/m/489163956bec0975f465e2d1.png)
6.78MHz±15.0KHz 13.56MHz±7.0KHz 27.12MHz±163.0KHz 40.68MHz±20.0KHz 915MHz±13.0MHz 2450MHz±50.0MHz 5800MHz±75.0MHz 24.125MHz±125.0MHz 61.25GHz±250.0MHz 122.50GHz±500.0MHz 24500GHz±1.0GHz
0.45-1.6 1.6-30
Conducted limit (uv)
1000 3000
消费类设备
• Frequency (MHz)
0.45-2.51 2.51-3.0 3.0-30
Conducted limit (uv)
250 3000 250
c. 工科医设备类型，运行频率，功率变化定义限值
注意：1.单位换算: y dBuv /m = 20 log x uv/m 2.测试距离的变化与限值成反比: L2/L1=d1/d2
a.所有电感烹具类和超音速设备
• Frequency of emission (MHz) 0.009-0.05 0.05-0.15 0.15-0.5 0.5-5 5-30 Conducted limit (dBuv) QP AV 110 -----90-80 -----66-56 56-46 56 46 60 50
永存不变的附加标记意思是经蚀刻的雕刻压印丝网印刷的不能磨灭的印刷物或者是一个的记号在设备上一个永远不变固定的部分或在金属塑料铭牌上或其它材料上经焊接或铆钉或用永久不变的粘合剂进行固定
FCC part 18 –工业，科学，医疗设备
A B C
一般信息. 申请和认可. 技术标准.
A 一般信息.
• • • •
DM74LS08M中文资料
© 2000 Fairchild Semiconductor Corporation DS006347August 1986Revised March 2000DM74LS08 Quad 2-Input AND GatesDM74LS08Quad 2-Input AND GatesGeneral DescriptionThis device contains four independent gates each of which performs the logic AND function.Ordering Code:Devices also available in T ape and Reel. Specify by appending the suffix letter “X” to the ordering code.Connection Diagram Function TableY = ABH = HIGH Logic Level L = LOW Logic LevelOrder Number Package NumberPackage DescriptionDM74LS08M M14A 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-120, 0.150 Narrow DM74LS08SJ M14D 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide DM74LS08NN14A14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 WideInputs OutputA B Y L L L L H L H L L HHH 2D M 74L S 08Absolute Maximum Ratings (Note 1)Note 1: The “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. The device should not be operated at these limits. The parametric values defined in the Electrical Characteristics tables are not guaranteed at the absolute maximum ratings.The “Recommended Operating Conditions” table will define the conditions for actual device operation.Recommended Operating ConditionsElectrical Characteristicsover recommended operating free air temperature range (unless otherwise noted)Switching Characteristicsat V CC = 5V and T A = 25°CNote 2: All typicals are at V CC = 5V, T A = 25°C.Note 3: Not more than one output should be shorted at a time, and the duration should not exceed one second.Supply Voltage 7V Input Voltage7VOperating Free Air Temperature Range 0°C to +70°C Storage Temperature Range−65°C to +150°CSymbol ParameterMin Nom Max Units V CC Supply Voltage4.7555.25V V IH HIGH Level Input Voltage 2V V IL LOW Level Input Voltage 0.8V I OH HIGH Level Output Current −0.4mA I OL LOW Level Output Current 8mA T AFree Air Operating Temperature70°CSymbol ParameterConditionsMinTyp Max Units (Note 2)V I Input Clamp Voltage V CC = Min, I I = −18 mA −1.5V V OH HIGH Level V CC = Min, I OH = Max, 2.73.4VOutput Voltage V IH = Min V OLLOW Level V CC = Min, I OL = Max,0.350.5Output VoltageV IL = MaxVI OL = 4 mA, V CC = Min 0.250.4I I Input Current @ Max Input Voltage V CC = Max, V I = 7V 0.1mA I IH HIGH Level Input Current V CC = Max, V I = 2.7V 20µA I IL LOW Level Input Current V CC = Max, V I = 0.4V −0.36mA I OS Short Circuit Output Current V CC = Max (Note 3)−20−100mA I CCH Supply Current with Outputs HIGH V CC = Max 2.4 4.8mA I CCLSupply Current with Outputs LOWV CC = Max4.48.8mAR L = 2 k ΩSymbol ParameterC L = 15 pF C L = 50 pFUnitsMin Max Min Max t PLH Propagation Delay Time 413618ns LOW-to-HIGH Level Output t PHLPropagation Delay Time 311518nsHIGH-to-LOW Level OutputDM74LS08Physical Dimensions inches (millimeters) unless otherwise noted14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-120, 0.150 NarrowPackage Number M14A 4D M 74L S 08Physical Dimensionsinches (millimeters) unless otherwise noted (Continued)14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm WidePackage Number M14D5DM74LS08 Quad 2-Input AND GatesPhysical Dimensions inches (millimeters) unless otherwise noted (Continued)14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 WidePackage Number N14AFairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.LIFE SUPPORT POLICYFAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:1.Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be rea-sonably expected to result in a significant injury to the user.2. A critical component in any component of a life support device or system whose failure to perform can be rea-sonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.。
优派PJD5152说明书
1. 请在使用投影机之前阅读本使用手册。妥善保存本使用手册以备日后参考。 2. 在使用过程中请不要直视投影机镜头。强光束可能会损害眼睛。 3. 仅让专业技术人员进行维修。 4. 投影机灯泡亮起时，请切记要打开镜头快门或取下镜头盖。 5. 在某些国家，电源电压不稳定。本投影机在 100 到 240 ( 伏特 ) 的交流电源
ViewSonic®
PJD5152 / PJD5352 DLP Projector
- User Guide - Guide de l’utilisateur - Bedienungsanleitung - Guía del usuario - Guida dell’utente - Guia do usuário - Användarhandbok - Käyttöopas - Руководство пользователя - 使用手冊 (繁體) - 使用手冊 (簡體) - 사용자 안내서 - Podręcznik użytkownika - Kullanιcι kιlavuzu
产品登记
为满足您日后的需要，并且使您能接收最新发布的所有附加产品的信息，请通过互联网登记您 的产品，网址为：。您还可用ViewSonic精灵光盘打印登记表，填好后请邮 寄或传真给 ViewSonic。
产 品 名：
型 号： 文 件 号： 序 列 号： 购买日期：
用户记录
○
○
○
○
○
○
光盘/说明书(CD/Manual)
○
○
○
○
○
○
遥控器
×
○
○
○
○
○
Mylar
○
○
○
○
○