3.2 A Fast On-Chip Profiler Memory
关于芯片的说明文英语作文
关于芯片的说明文英语作文A chip, also known as an integrated circuit, is a small piece of silicon that contains thousands or millions oftiny electronic components. These components work together to perform various functions, such as processing data, storing information, and controlling electronic devices.Chips are used in a wide range of electronic devices, including computers, smartphones, and digital cameras. They are essential for the operation of these devices, as they provide the processing power and memory needed to run software and perform tasks.The development of chips has played a crucial role in the advancement of technology. Over the years, chips have become smaller, faster, and more powerful, allowing for the creation of more advanced and efficient electronic devices.One of the key benefits of chips is their ability to perform complex tasks in a small and lightweight package.This has enabled the development of portable and wearable devices that can be easily carried and used on the go.In addition to consumer electronics, chips are alsoused in industrial and commercial applications, such as in the automotive, healthcare, and aerospace industries. They are used to control and monitor complex systems, such as engine management systems in cars, medical imaging equipment, and navigation systems in aircraft.As technology continues to advance, the demand forchips is expected to grow. This will drive furtherinnovation in chip design and manufacturing, leading toeven smaller, faster, and more powerful chips in the future.。
MEMORY存储芯片STM8S003F3P6中文规格书
This is information on a product in full production.August 2018DS7147 Rev 10Value line, 16-MHz STM8S 8-bit MCU, 8-Kbyte Flash memory, 128-byte data EEPROM, 10-bit ADC, 3 timers, UART, SPI, I²CDatasheet - production dataFeaturesCore•16 MHz advanced STM8 core with Harvard architecture and 3-stage pipeline •Extended instruction setMemories•Program memory: 8 Kbyte Flash memory; data retention 20 years at 55 °C after 100 cycles •RAM: 1 Kbyte•Data memory: 128 bytes true data EEPROM;endurance up to 100 k write/erase cyclesClock, reset and supply management• 2.95 V to 5.5 V operating voltage•Flexible clock control, 4 master clock sources –Low-power crystal resonator oscillator –External clock input–Internal, user-trimmable 16 MHz RC –Internal low-power 128 kHz RC •Clock security system with clock monitor •Power management–Low-power modes (wait, active-halt, halt)–Switch-off peripheral clocks individually –Permanently active, low-consumption power-on and power-down resetInterrupt management•Nested interrupt controller with 32 interrupts •Up to 27 external interrupts on 6 vectorsTimers•Advanced control timer: 16-bit, 4 CAPCOM channels, 3 complementary outputs, dead-time insertion and flexible synchronization •16-bit general purpose timer, with 3 CAPCOM channels (IC, OC or PWM)•8-bit basic timer with 8-bit prescaler •Auto wakeup timer•Window and independent watchdog timersCommunications interfaces•UART with clock output for synchronousoperation, SmartCard, IrDA, LIN master mode •SPI interface up to 8 Mbit/s •I 2C interface up to 400 Kbit/sAnalog to digital converter (ADC)•10-bit ADC, ± 1 LSB ADC with up to 5multiplexed channels, scan mode and analog watchdogI/Os•Up to 28 I/Os on a 32-pin package including 21high-sink outputs •Highly robust I/O design, immune against current injectionDevelopment support•Embedded single-wire interface module(SWIM) for fast on-chip programming and non-intrusive debuggingDescription STM8S003F3 STM8S003K3DS7147 Rev 102 DescriptionThe STM8S003F3/K3 value line 8-bit microcontrollers offer 8 Kbytes of Flash programmemory, plus integrated true data EEPROM. They are referred to as low-density devices in the STM8S microcontroller family reference manual (RM0016).The STM8S003F3/K3 value line devices provide the following benefits: performance, robustness and reduced system cost.Device performance and robustness are ensured by true data EEPROM supporting up to 100000 write/erase cycles, advanced core and peripherals made in a state-of-the-arttechnology at 16 MHz clock frequency, robust I/Os, independent watchdogs with separate clock source, and a clock security system.The system cost is reduced thanks to a high system integration level with internal clock oscillators, watchdog, and brown-out reset.Full documentation is offered as well as a wide choice of development tools.Table 1. STM8S003F3/K3 value line featuresFeaturesSTM8S003K3STM8S003F3Pin count3220Max. number of GPIOs (I/O)2816External interrupt pins 2716Timer CAPCOM channels 77Timer complementary outputs 32A/D converter channels 45High-sink I/Os2112Low-density Flash program memory (byte)8 K 8 K RAM (byte)1 K 1 K True data EEPROM (byte)128(1)1.Without read-while-write capability.128(1)Peripheral setMulti purpose timer (TIM1), SPI, I2C, UART, Window WDG, independent WDG, ADC, PWM timer (TIM2), 8-bit timer (TIM4)DS7147 Rev 10STM8S003F3 STM8S003K3Block diagram3 Block diagramFigure 1. STM8S003F3/K3 value line block diagramXTAL 1-16 MHzRC int. 16 MHzRC int. 128 kHzSTM8 coreDebug/SWIMUART1I2CSPIAWU timerReset blockResetPORBORClock controllerDetectorClock to peripherals and core400Kbit/s8Mbit/sup to 5A d d r e s s a n d d a t a b u sWindow WDG8 Kbyte 128 byte 1 Kbyte RAMADC1ResetSingle wiredebug interfaceprogram Flashdata EEPROM16-bit general purpose16-bit advanced controltimer (TIM1)timer (TIM2)8-bit basic timer(TIM4)Beeper1/2/4 kHz beepIndependent WDG4 CAPCOM channels Up to 3 CAPCOM channelsUp to + 3 complementaryoutputsLIN master channelsSPI emul.STM8S003F3 STM8S003K3Product overviewDS7147 Rev 10Product overview STM8S003F3 STM8S003K3DS7147 Rev 104.12 TIM4 - 8-bit basic timer•8-bit autoreload, adjustable prescaler ratio to any power of 2 from 1 to 128•Clock source: CPU clock•Interrupt source: 1 x overflow/update4.13 Analog-to-digital converter (ADC1)STM8S003F3/K3 value line products contain a 10-bit successive approximation A/Dconverter (ADC1) with up to 5 external multiplexed input channels and the following main features: •Input voltage range: 0 to V DDA •Conversion time: 14 clock cycles•Single and continuous, buffered continuous conversion modes •Buffer size (10 x 10 bits)•Scan mode for single and continuous conversion of a sequence of channels •Analog watchdog capability with programmable upper and lower thresholds •Analog watchdog interrupt •External trigger input •Trigger from TIM1 TRGO •End of conversion (EOC) interruptNote:Additional AIN12 analog input is not selectable in ADC scan mode or with analog watchdog. Values converted from AIN12 are stored only into the ADC_DRH/ADC_DRL registers.4.14 Communication interfacesThe following communication interfaces are implemented:•UART1: full feature UART, synchronous mode, SPI master mode, SmartCard mode,IrDA mode, LIN2.1 master capability •SPI: full and half-duplex, 8 Mbit/s •I²C: up to 400 Kbit/sTable 3. TIM timer featuresTimerCounter size (bits)PrescalerCounting mode CAPCOM channels Complem. outputs Ext. trigger Timersynchr-onization/ chainingTIM1 16Any integer from 1 to 65536Up/down 43Yes NoTIM2 16Any power of 2 from 1 to 32768Up 30No TIM48Any power of 2 from 1 to 128UpNo。
MEMORY存储芯片MAX13487EESA+T中文规格书
Half-Duplex RS-485-/RS-422-Compatible Transceiver with AutoDirection Control MAX13487E/MAX13488E General DescriptionThe MAX13487E/MAX13488E +5V, half-duplex, ±15kV ESD-protected RS-485/RS-422-compatible transceivers feature one driver and one receiver. The MAX13487E/MAX13488E include a hot-swap capability to eliminate false transitions on the bus during power-up or live insertion.The MAX13487E/MAX13488E feature Maxim’s propri-etary AutoDirection control. This architecture makes the devices ideal for applications, such as isolated RS-485 ports, where the driver input is used in conjunction with the driver-enable signal to drive the differential bus.The MAX13487E features reduced slew-rate drivers that minimize EMI and reduce reflections caused by improperly terminated cables, allowing error-free trans-mission up to 500kbps. The MAX13488E driver slew rate is not limited, allowing transmit speeds up to 16Mbps.The MAX13487E/MAX13488E feature a 1/4-unit load receiver input impedance, allowing up to 128 trans-ceivers on the bus. These devices are intended for half-duplex communications. All driver outputs are protected to ±15kV ESD using the Human Body Model. The MAX13487E/MAX13488E are available in an 8-pin SO package. The devices operate over the extended -40°C to +85°C temperature range.Applications Isolated RS-485 InterfacesUtility MetersIndustrial ControlsIndustrial Motor DrivesAutomated HVAC SystemsBenefits and Features •AutoDirection Saves Space and BOM Cost •AutoDirection Enables Driver Automatically on Transmission, Eliminating an Opto or Other Discrete Means of Isolation •8-Pin SO Package •Robust Protection Features for Telecom, Industrial,and Isolated Applications •Hot-Swap Capability to Eliminate False Transitions on the Bus During Power-Up or Live Insertion •Extended ESD Protection for RS-485 I/O Pins (±15kV Human Body Model)•Options Optimize Designs for Speed or Errorless Data Transmission •Enhanced Slew-Rate Limiting Facilitates Error-Free Data Transmission (MAX13487E)•High-Speed Version (MAX13488E) Allows for Transmission Speeds Up to 16Mbps •1/4-Unit Load, Allowing Up to 128 Transceivers on the Bus Ordering Information/Selector Guide+Note:All devices operate over the -40°C to +85°C temperature range.Pin Configuration/Typical Application Circuit appear at end of data sheet.Functional Diagram 19-0740; Rev 1; 2/15找MEMORY 、二三极管上美光存储MAX13487E/MAX13488E Half-Duplex RS-485-/RS-422-Compatible Transceiver with AutoDirection Control Integrated | 7Typical Operating Characteristics (continued)(V CC = +5.0V, T A = +25°C, unless otherwise noted.)RECEIVER PROPAGATION vs. TEMPERATURE(MAX13488E)TEMPERATURE (°C)R E C E I VE R P R O P A G A T I O N (n s )603510-1510203040-4085DRIVER PROPAGATION (500kbps)(MAX13487E)M A X 13487E t o c 17DI 2V/div A-B5V/div400ns/div DRIVER PROPAGATION (16Mbps)(MAX13488E)DI 2V/div A-B 5V/div 10ns/div RECEIVER PROPAGATION (16Mbps)(MAX13488E)MA X 13487E t o c 19B 2V/div RO 2V/div A2V/div10ns/div DRIVING 16nF (19.2kbps)(MAX13487E)M A X 13487E t o c 20DI2V/divA-B 5V/div10μs/div DRIVING 16nF (19.2kbps)(MAX13488E)M A X 13487E t o c 21DI2V/div A-B5V/div 10μs/div DRIVING 16nF (750kbps)(MAX13488E)M A X 13487E t o c 22DI 2V/div A-B 5V/div400ns/div。
MEMORY存储芯片N25Q032A13ESC40F中文规格书
Table 11: DDR2 I DD Specifications and Conditions (Die Revision M) (Continued)Notes: 1.I DD specifications are tested after the device is properly initialized. 0°C ≤ T C ≤ +85°C.2.V DD = +1.8V ±0.1V, V DDQ = +1.8V ±0.1V, V DDL = +1.8V ±0.1V, V REF = V DDQ/2.3.I DD parameters are specified with ODT disabled.4.Data bus consists of DQ, DM, DQS, DQS#, RDQS, RDQS#, LDQS, LDQS#, UDQS, andUDQS#. I DD values must be met with all combinations of EMR bits 10 and 11.5.Definitions for I DD conditions:LOW V IN≤ V IL(AC)maxHIGH V IN≥ V IH(AC)minStable Inputs stable at a HIGH or LOW levelFloating Inputs at V REF = V DDQ/2Switching Inputs changing between HIGH and LOW every other clock cycle (once pertwo clocks) for address and control signalsSwitching Inputs changing between HIGH and LOW every other data transfer (onceper clock) for DQ signals, not including masks or strobes6.I DD1, I DD4R, and I DD7 require A12 in EMR to be enabled during testing.7.The following I DD values must be derated (I DD limits increase) on IT-option and AT-optiondevices when operated outside of the range 0°C ≤ T C ≤ 85°C:WhenT C≤ 0°C (IT)I DD2P and I DD3P(SLOW) must be derated by 4%; I DD4R and I DD5W must be de-rated by 2%; and I DD6 and I DD7 must be derated by 7%AC and DC Operating ConditionsTable 13: Recommended DC Operating Conditions (SSTL_18)Input Electrical Characteristics and Operating ConditionsTable 15: Input DC Logic LevelsNote:1.V DDQ + 300mV allowed provided 1.9V is not exceeded.Table 16: Input AC Logic LevelsNote:1.Refer to AC Overshoot/Undershoot Specification (page 58).Figure 13: Single-Ended Input Signal Levels650mV775mV864mV882mV 900mV 918mV 936mV 1,025mV1,150mVNote: 1.Numbers in diagram reflect nominal DDR2-400/DDR2-533 values.Preliminary1Gb: x4, x8, x16 DDR2 SDRAMInput Electrical Characteristics and Operating Conditions。
飞思卡尔KE02系列简介
1Kinetis E seriesKinetis E series provide the highly scalable portfolio ofARM ® Cortex ®-M0+ MCUs in the industry. With 2.7–5.5 V supply and focus on exceptional EMC/ESD robustness,Kinetis E series devices are well suited to a wide range of applications in electrical harsh environments, and is optimized for cost-sensitive applications offering low pin-count option.The Kinetis E series offers a broad range of memory,peripherals, and package options. They share common peripherals and pin counts allowing developers to migrate easily within an MCU family or among the MCU families to take advantage of more memory or feature integration. This scalability allows developers to standardize on the Kinetis E series for their end product platforms, maximising hardware and software reuse and reducing time-to-market.Following are the general features of the Kinetis E series MCUs.•32-bit ARM Cortex-M0+ core•Scalable memory footprints from 8 KB flash / 1 KB SRAM to 128 KB flash / 16 KB SRAM•Precision mixed-signal capability with on chip analog comparator and 12-bit ADC•Powerful timers for a broad range of applications including motor control•Serial communication interfaces such as UART, SPI,I 2C, and others.•High security and safety with internal watchdog andprogrammable CRC moduleProduct BriefRev 3, 07/2013KE02 Product BriefSupports all KE02 devices© 2013 Freescale Semiconductor, Inc.Contents1Kinetis E series..........................................................12KE02 sub-family introduction..................................23Block diagram...........................................................34Features.....................................................................45Power modes.. (136)Revision history (14)•Single power supply (2.7–5.5 V) with full functional flash program/erase/read operations•Ambient operation temperature range: –40 °C ~ 105 °CKinetis E series MCU families are supported by a market-leading enablement bundle from Freescale and numerous ARM third-party ecosystem partners. The KE02 sub-family is the entry-point to the Kinetis E series and is pin-compatible within E series and with the Freescale's 8-bit S08P family.2KE02 sub-family introductionThis sub-family includes a powerful array of analog, communication, and timing and control peripherals with specific flash memory size and the pin count.•Core and architecture:•ARM Cortex-M0+ core running up to 20 MHz with zero wait state execution from memories•Single-cycle access to I/O: Up to 50 percent faster than standard I/O, improves reaction time to externalevents allowing bit manipulation and software protocol emulation•Two-stage pipeline: Reduced number of cycles per instruction (CPI), enabling faster branch instruction andISR entry, and reducing power consumption•Excellent code density in comparison to 8-bit and 16-bit MCUs: Reduced flash size, system cost, andpower consumption•Optimized access to program memory: Accesses on alternate cycles reduces power consumption•100 percent compatible with ARM Cortex-M0 and a subset ARM Cortex-M3/M4: Reuse existingcompilers and debug tools•Simplified architecture: 56 instructions and 17 registers enable easy programming and efficient packagingof 8/16/32-bit data in memory•Linear 4 GB address space removes the need for paging/banking, reducing software complexity•ARM third-party ecosystem support: Software and tools to help minimize development time/cost •Bus clock running up to 20 MHz•BME: Bit manipulation engine reduces code size and cycles for bit-oriented operations to peripheral registerseliminating traditional methods where the core would need to perform read-modify-write operations.•Power-saving:•Low-power ARM Cortex-M0+ core with excellent energy efficiency•Supports three power modes: Run, Wait and Stop•Supports clock gating for unused modules, and specific peripherals remain working in Stop mode •Memory:•Up to 64 KB program flash, 256 B EEPROM, 4 KB SRAM•Embedded 32 B flash cache for optimizing bus bandwidth and flash execution performance •Mixed-signal analog:•Up to 16 channels of 12-bit analog-to-digital conversion (ADC) with 2.5 µs conversion time, 1.7 mV/°Ctemperature sensor, internal bandgap reference channel, supporting automatic compare, optional hardwaretrigger, and operating in Stop mode•Up to two analog comparators (ACMP) with both positive and negative inputs, separately selectable interrupt onrising and falling comparator output•Human-machine interface (HMI):•Up to two keyboard interrupt modules (KBI)•Connectivity and communications:•Up to three serial communications interface (UART) modules with optional 13-bit break, full duplex non-returnto zero (NRZ) and LIN extension support•Up to two serial peripheral interface (SPI) modules with full-duplex or single-wire bidirectional and master orslave mode•One Inter-integrated circuit ( I2C) module with bit rate up to 100 kbit/s, support system management bus •Reliability, safety and security:•Internal watchdog with independent clock source•Cyclic redundancy check (CRC) with programmable 16- or 32-bit polynomial generator•FlexTimer module (FTM) including one 6-channel FTM with deadtime insertion and fault detection, and up totwo 2-channel FTMs backward compatible with TPM modules. Each channel can be configured for inputcapture, output compare, edge- or center-aligned PWM mode.•Periodic interrupt timer (PIT) for RTOS task scheduler time base or trigger source for ADC conversion and timer modules•16-bit real timer counter (RTC)•I/O and package:•Up to 57 GPIO pins with interrupt functionality•Up to 2 true open-drain output pins•Up to 8 ultra high current sink pins supporting 20 mA source/sink current•Multiple package options from 32-pin to 64-pinThe family acts as a low-power, high-robustness, and cost-effective microcontroller to provide developers an appropriate entry-level 32-bit solution. The family is next generation MCU solution with enhanced ESD/EMC performance for cost-sensitive, high-reliability devices applications used in high electrical noise environments.3Block diagramThe following figure shows a superset block diagram of the device. Other devices within the family have a subset of the features.Kinetis KE02 FamilyFigure 1. KE02 family block diagramFeatures4.1Feature summaryAll devices within the KE02 sub-family have a minimum of the following features.44.2Memory and package optionsThe following table summarizes the memory and package options for the KE02 family. All devices which share a common package are pin-for-pin compatible.4.3Part numbers and packagingQ KE## A FFF T PP CC (N)Qualification statusFamily Flash sizeTemperature range (°C)Speed (MHz)Package identifierTape and Reel (T&R)Key attributeFigure 2. Part numbers diagrams4.4KE02 family featuresThe following sections list the differences among the various devices available within the KE02 family.The features listed below each part number specify the maximum configuration available on that device. The signal multiplexing configuration determines which modules can be used simultaneously.4.4.1KE02 family features (20 MHz performance)4.5Module-by-module feature listThe following sections describe the high-level module features for the family's superset device. See KE02 family features (20 MHz performance) for differences among the subset devices.Core modules4.5.1.1ARM Cortex-M0+ core•Up to 20 MHz core frequency from 2.7 V to 5.5 V across temperature range of –40 °C to 105 °C •Supports up to 32 interrupt request sources•2-stage pipeline microarchitecture for reduced power consumption and improved architectural performance (cycles per instruction)•Binary compatible instruction set architecture with the Cortex-M0 core •Thumb instruction set combines high code density with 32-bit performance •Serial wire debug (SWD) reduces the number of pins required for debugging •Single cycle 32 bits by 32 bits multiply4.5.1.2Nested Vectored Interrupt Controller (NVIC)Following are the features of the NVIC module.•Up to 32 interrupt sources•Includes a single non-maskable interrupt4.5.1.3Asynchronous Wake-up Interrupt Controller (AWIC)The features of the AWIC module are given below.•Supports interrupt handling when system clocking is disabled in low-power modes•Takes over and emulates the NVIC behavior when correctly primed by the NVIC on entry to very deep sleep mode.• A rudimentary interrupt masking system with no prioritization logic signals for wake-up as soon as a non-masked interrupt is detected•Contains no programmer’s model visible state and is therefore invisible to end users of the device other than through the benefits of reduced power consumption while sleeping4.5.1.4Debug controller•2-pin serial wire debug (SWD) provides external debugger interfaceSystem modules4.5.2.1Power Management Control (PMC) unitThe features of the PMC module are listed below.•Separate digital (regulated) and analog (referenced to digital) supply outputs •Programmable power saving modes•No output supply decoupling capacitors required•Available wake-up from power saving modes via RTC and external inputs •Integrated power-on-reset (POR)•Integrated low voltage detect (LVD) with reset (brownout) capability •Selectable LVD trip points•Programmable low-voltage warning (LVW) interrupt capability •Buffered bandgap reference voltage output4.5.14.5.2•Factory programmed trim for bandgap and LVD • 1 kHz low-power oscillator (LPO)4.5.2.2Watchdog (WDOG) moduleThe features of the Watchdog module are described as follows.•Independent clock source input (independent from CPU/bus clock)•Choice between clock sources• 1 kHz internal low-power oscillator (LPOCLK)•Internal 32 kHz reference clock (ICSIRCLK)•External clock (OSCERCLK)•Bus clock4.5.2.3System clocksThe following clock sources can be used as system clocks.•System oscillator (OSC)—Loop-control pierce oscillator; crystal or ceramic resonator range of 31.25 to 39.0625 kHz (low-range mode) or 4-20 MHz (high-range mode)•Internal clock source (ICS)•Frequency-locked loop (FLL) controlled by internal or external reference•16 MHz~20 MHz FLL output•Internal reference clocks—Can be used as a clock source for the other on-chip peripherals•On-chip RC oscillator range of 31.25 to 39.0625 kHz oscillator with ±1% deviation across temperature range of 0 °C to 70 °C and ±1.5% deviation across across full temperature rangeMemories and memory interfaces4.5.3.1On-chip memory•20 MHz performance devices•Up to 64 KB flash memory •Up to 256 B EEPROM memory •Up to 4 KB SRAM•Security circuitry to prevent unauthorized access to RAM and flash contentsAnalog4.5.4.1Analog-to-Digital Converter (ADC)The features of the ADC module are given below.•Linear successive approximation algorithm with 8-, 10-, or 12-bit resolution•Up to 16 external analog inputs, external pin inputs, and 5 internal analog inputs including internal bandgap,temperature sensor, and references•Output formatted in 8-, 10-, or 12-bit right-justified unsigned format•Single or continuous conversion (automatic return to idle after single conversion)•Supports up to eight result FIFO with selectable FIFO depth 4.5.34.5.4•Conversion complete flag and interrupt•Input clock selectable from up to four sources•Operation in Wait or Stop modes for lower noise operation •Asynchronous clock source for lower noise operation •Selectable asynchronous hardware conversion trigger•Automatic compare with interrupt for less-than, or greater-than or equal-to, programmable value4.5.4.2Analog Comparator (ACMP)The ACMP module has the following features.•Operational over the whole supply range of 2.7–5.5 V•On-chip 6-bit resolution DAC with selectable reference voltage from V DD or internal bandgap •Configurable hysteresis•Selectable interrupt on rising-edge, falling-edge, or both rising or falling edges of the comparator output •Selectable inversion on comparator output•Up to four selectable comparator inputs; one of these is fixed and connected to built-in DAC output while the others are externally mapped on pinouts.•Operational in Stop modeTimer4.5.5.1FlexTimers (FTM)The FlexTimer module exhibits the following features.•Selectable FTM source clock •Programmable prescaler•16-bit counter supporting free-running or initial/final value, and counting is up or up-down •Input capture, output compare, and edge-aligned and center-aligned PWM modes •Input capture and output compare modes•Operation of FTM channels as pairs with equal outputs, pairs with complimentary outputs, or independent channels with independent outputs•Deadtime insertion is available for each complementary pair •Generation of hardware triggers •Software control of PWM outputs•Up to four fault inputs for global fault control •Configurable channel polarity•Programmable interrupt on input capture, reference compare, overflowed counter, or detected fault condition4.5.5.2Periodic Interrupt Timer (PIT)The features of the PIT module are given below.•Two general-purpose interrupt timers•One interrupt timer for triggering ADC conversions •32-bit counter resolution•Clocked by bus clock frequency4.5.5.3Real-Time Clock (RTC)Following are the features of the real-time clock.4.5.5•16-bit up-counter•16-bit modulo match limit•Software controllable periodic interrupt on match•Software selectable clock sources for input to prescaler with programmable 16 bit prescaler•OSC 32.678 kHz nominal •LPO (~1 kHz)•Bus clock•Internal reference clock (32 kHz)Communication interfaces4.5.6.1Inter-Integrated Circuit (I 2C)The features of the I 2C module are as follows.•Compatible with I 2C bus standard•Up to 100 kbit/s with maximum bus loading •Multimaster operation•Software programmable for one of 64 different serial clock frequencies •Programmable slave address and glitch input filter •Interrupt-driven byte-by-byte data transfer•Arbitration lost interrupt with automatic mode switching from master to slave •Calling address identification interrupt•Bus busy detection broadcast and 10-bit address extension•Address matching causes wake-up when processor is in low-power mode.4.5.6.2Universal Asynchronous Receiver/Transmitter (UART)The UART module has the following features.•Full-duplex, standard non-return-to-zero (NRZ) format•Double-buffered transmitter and receiver with separate enables •Programmable baud rates (13-bit modulo divider)•Interrupt-driven or polled operation:•Transmit data register empty and transmission complete •Receive data register full•Receive overrun, parity error, framing error, and noise error •Idle receiver detect•Active edge on receive pin •Break detect supporting LIN•Hardware parity generation and checking •Programmable 8-bit or 9-bit character length •Programmable 1-bit or 2-bit stop bits•Receiver wake-up by idle-line or address-mark•Optional 13-bit break character generation / 11-bit break character detection •Selectable transmitter output polarity4.5.6.3Serial Peripheral Interface (SPI)The features of the SPI module are listed below.•Master and slave mode•Full-duplex, three-wire synchronous transfers4.5.6•Programmable transmit bit rate•Double-buffered transmit and receive data registers •Serial clock phase and polarity options •Slave select output•Mode fault error flag with CPU interrupt capability •Control of SPI operation during Wait mode •Selectable MSB-first or LSB-first shifting •Receive data buffer hardware match featureHuman machine interface4.5.7.1General-Purpose Input/Output (GPIO)The features of the GPIO module are listed below.•Hysteresis and configurable pull up device on all input pins •Configurable drive strength on some output pins•Independent pin value register to read logic level on digital pin4.5.7.2Keyboard Interrupts (KBI)The KBI features include:•Up to eight keyboard interrupt pins with individual pin enable bits •Each keyboard interrupt pin is programmable as:•falling-edge sensitivity only •rising-edge sensitivity only•both falling-edge and low-level sensitivity •both rising-edge and high-level sensitivity •One software-enabled keyboard interrupt •Exit from low-power modes5Power modesThe power management controller (PMC) provides the user with multiple power options. The different modes of operation are supported to allow the user to optimize power consumption for the level of functionality needed.The device supports Run, Wait, and Stop modes which are easy to use for customers both from different power consumption level and functional requirement. I/O states are held in all the modes.•Run mode—CPU clocks can be run at full speed and the internal supply is fully regulated.•Wait mode—CPU shuts down to conserve power; system clocks and bus clock are running and full regulation is maintained.•Stop mode—LVD optional enabled, and voltage regulator is in standby.The three modes of operation are Run, Wait, and Stop. The WFI instruction invokes both Wait and Stop modes for the chip.4.5.76Revision historyThe following table provides a revision history for this document.How to Reach Us: Home Page: Web Support: /support Information in this document is provided solely to enable system and software implementers to use Freescale products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. Freescale reserves the right to make changes without further notice to any products herein.Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages.“Typical” parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer's technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: /SalesTermsandConditions. Freescale, the Freescale logo, and Kinetis are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. All other product or service names are the property of their respective owners. ARM and Cortex-M0+ are the registered trademarks of ARM Limited.©2013 Freescale Semiconductor, Inc.Document Number KE02PBRevision 3, 07/2013。
Silicon Laboratories AN678 精确32 si32FlashUtility 命
Rev. 0.1 3/12Copyright © 2012 by Silicon LaboratoriesAN678P ROGRAMMER U SER ’S G UIDE1. IntroductionThe Precision32™ si32FlashUtility Command-Line Programmer is a simple program to enable productionprogramming capability using the Silicon Labs 32-bit USB Debug Adapter. This utility can also program and eraselock bytes.Figure 1 shows an invocation of the command-line utility.Figure 1.Precision32 si32FlashUtility Command-Line Programmer2. Relevant DocumentationPrecision32 Application Notes are listed on the following website: /32bit-appnotes.⏹ AN667: Getting Started with the Silicon Labs Precision32™ IDE⏹AN669: Integrating Silicon Labs SiM3xxxx Devices into the Keil µVision® IDEAN6783. Programming OptionsThe si32FlashUtlility has a command-line form of:si32FlashUtility [-options] [drive:][path]imageThese options consist of the following:⏹ -v: Verify the image after downloading to Flash.⏹ -i: Display additional information during the programming process (i.e., verbose mode).⏹ -e {0,1,2}: Erase Flash with three mode options.⏹ -p {0,1,2}: Debug port selection with three mode options.⏹ -r {0,1,2}: Reset during programming with three mode options.⏹ -l: List the available USB Debug Adapters (UDAs).⏹ -s SERIAL: Specify the USB Debug Adapter serial string.This section discusses each of these programming options in more detail.3.1. Download VerificationUsing the -v option flag causes the si32FlashUtility to verify the Flash contents after the download. The command-line utility will output a Download complete and verified message if the Flash contents match the HEX image. 3.2. Verbose FeedbackWith the -i option flag, the si32FlashUtility programmer will report feedback about each step of the programming process, as shown in Figure2.Figure2.Verbose Mode OutputAN6783.3. Flash EraseThe -e option flag has three modes: merge, sector, and full. The default option is sector (-e 1) if no option is specified.The merge option is selected with -e 0 and causes the programmer to read the current contents of the Flash page selected by the HEX file address, copy any contents that are not written in the HEX image, erase the page, and write the merged image back to Flash. This option allows developers to maintain any calibration or code constants in Flash when updating code.When using the -e 1 sector erase option, the programmer will first erase the page selected by the HEX image address before programming the contents of the HEX image.The final option, -e 2, causes the programmer to erase the entire Flash before programming the HEX image.3.4. Debug PortThis option selects the debug port of the device. The -p 0 selection is for any devices with JTAG debug pins. The -p 1 option is for devices with Serial Wire debug pins only (SW-DP). The -p 2 option uses the Serial Wire protocol and is for devices with both JTAG and Serial Wire debug pins (SWJ-DP), like the SiM3U1xx device family. The default option is -p 2 if no option is specified.The JTAG selection (-p 0) does not have provisions for JTAG chaining.3.5. Reset OptionsThe utility supports three different reset options: none, before, and during. The default option is none (-r 0) if no option is specified.The none option (-r 0) prevents the utility from toggling the reset pin at any point during the programming process. The before option (-r 1) allows the si32FlashUtility to toggle reset immediately before programming. This option is useful for SiM3U1xx or SiM3C1xx devices that may be unresponsive due to switching to a non-existent clock. Using this option along with the recommended reset delay in the startup code ensures the USB Debug Adapter will be able to communicate with the device.For the during option (-r 2), the utility asserts the reset pin while attempting to halt the core. Once the core is halted, the utility deasserts the reset pin and starts programming. This option ensures the Debug Adapter can always communicate with a device without the reset delay in the startup code for devices that support this feature.Note:The -r 2 option is unavailable for SiM3U1xx and SiM3C1xx devices.3.6. USB Debug Adapter OptionsThe -l option flag lists the available USB Debug Adapters connected to the PC or system. The -s SERIAL option flag can then specify the USB Debug Adapter the utility should use for programming.AN6784. Creating HEX Files with the Precision32 IDEThe si32FlashUtility programmer expects HEX files as its input, and the Precision32 IDE includes a utility that can convert the GCC AXF file output to HEX files. This objcopy utility can be found in the ..\Precision32_vx.y\IDE\precision32\Tools\arm-none-eabi\bin path after installing the Precision32 software package from /32bit-software.More information on the usage of this utility can be found on the CodeRed website: /CodeRedWiki/OutputFormats.4.1. Using the Objcopy Utility from the IDETo use the objcopy utility from the IDE:1. Hold the Ctrl button and left-click on the project name in the IDE footer as shown in Figure3. This willopen a command prompt in the project directory with the proper paths to use the utility.Figure3.Opening a Project Command Prompt2. Type cd build_directory, where build_directory is Debug by default.3. Invoke the utility: arm-none-eabi-objcopy -O ihex project_name.axf project_name.hex. In the case ofthis example, which uses the sim3u1xx_Blinky project: arm-none-eabi-objcopy -O ihexsim3u1xx_Blinky.axf sim3u1xx_Blinky.hex.Rev. 0.1AN678Rev. 0.1Figure 4.Invoking the Objcopy Utility4.2. Setting the IDE Project to Automatically Generate a HEX FileTo configure the Precision32 IDE project to automatically generate a HEX file after a build:1. Right-click on the project_name in the Project Explorer view.2. Select Properties .3. In the C/C++ Build →Settings →Build Steps tab, type the following in the Post-build steps →Commandbox: arm-none-eabi-objcopy -O ihex ${BuildArtifactFileName} ${BuildArtifactFileBaseName}.hexFigure 5.Automatically Generating a HEX File on Project BuildAN6785. Examples To verify the download of the sim3u1xx_Blinky.hex file:si32FlashUtility -v sim3u1xx_Blinky.hex This example is shown in Figure6.Figure 6.Example with Flash VerificationTo verify the download of the sim3u1xx_Blinky.hex file, use verbose mode, erase the device before the download,and reset before:si32FlashUtility -v -i -e 2 -r 1 sim3u1xx_Blinky.hexFigure 7 shows an example of this call to the si32FlashUtility programmer.Figure 7.Example with Flash Verification, Verbose Mode, Full Device Erase, and Reset BeforeOptions Silicon Laboratories Inc.400 West Cesar Chavez Austin, TX 78701USASimplicity StudioOne-click access to MCU andwireless tools, documentation,software, source code libraries &more. Available for Windows,Mac and Linux!IoT Portfolio /IoT SW/HW /simplicity Quality /quality Support and CommunityDisclaimer Silicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes without further notice and limitation to product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Silicon Labs shall have no liability for the consequences of use of the information supplied herein. This document does not imply or express copyright licenses granted hereunder to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any Life Support System without the specific written consent of Silicon Labs. A "Life Support System" is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. Silicon Labs products are not designed or authorized for military applications. Silicon Labs products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons.Trademark Information Silicon Laboratories Inc.® , Silicon Laboratories®, Silicon Labs®, SiLabs® and the Silicon Labs logo®, Bluegiga®, Bluegiga Logo®, Clockbuilder®, CMEMS®, DSPLL®, EFM®, EFM32®, EFR, Ember®, Energy Micro, Energy Micro logo and combinations thereof, "the world’s most energy friendly microcontrollers", Ember®, EZLink®, EZRadio®, EZRadioPRO®, Gecko®, ISOmodem®, Precision32®, ProSLIC®, Simplicity Studio®, SiPHY®, Telegesis, the Telegesis Logo®, USBXpress® and others are trademarks or registered trademarks of Silicon Labs. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of ARM Holdings. Keil is a registered trademark of ARM Limited. All other products or brand names mentioned herein are trademarks of their respective holders.。
MEMORY存储芯片N25Q032A13EF640F中文规格书
Micron Serial NOR Flash Memory 3V, Multiple I/O, 4KB Sector EraseN25Q032AFeatures•SPI-compatible serial bus interface•108 MHz (MAX) clock frequency•2.7–3.6V single supply voltage•Dual/quad I/O instruction provides increased throughput up to 432 MHz•Supported protocols–Extended SPI, dual I/O, and quad I/O •Execute-in-place (XIP) mode for all three protocols –Configurable via volatile or nonvolatile registers –Enables memory to work in XIP mode directly af-ter power-on•PROGRAM/ERASE SUSPEND operations •Continuous read of entire memory via a single com-mand–FAST READ–QUAD or DUAL OUTPUT FAST READ–QUAD or DUAL I/O FAST READ•Flexible to fit application–Configurable number of dummy cycles–Configurable output buffer–RESET function available upon customer request •64-byte, user-lockable, one-time programmable (OTP) dedicated area•Erase capability–Subsector erase 4KB uniform granularity blocks –Sector erase 64KB uniform granularity blocks–Full-chip erase •Write protection–Software write protection applicable to every 64KB sector via volatile lock bit–Hardware write protection: protected area size defined by four nonvolatile bits (BP0, BP1, BP2,and TB)–Additional smart protections, available upon re-quest•Electronic signature–JEDEC-standard, 2-byte signature (BA16h)–Unique ID code: 17 read-only bytes, including:•Two additional extended device ID bytes toidentify device factory options•Customized factory data (14 bytes)•Minimum 100,000 ERASE cycles per sector •More than 20 years data retention•Packages (JEDEC-standard, RoHS compliant)–F4 = U-PDFN-8 4mm x 3mm (MLP8)–F6 = V-PDFN-8 6mm x 5mm (MLP8)–F8 = V-PDFN-8 8mm x 6mm (MLP8)–12 = T-PBGA-24b05 6mm x 8mm–SC = SOP2-8 150 mils body width (SO8N)–SF = SOP2-16 300 mils body width (SO16W)–SE = SOP2-8 208 mils body width (SO8W)CCMTD-1725822587-8448n25q_32mb_3v_65nm.pdf - Rev. K 05/18 EN 1Micron Technology, Inc. reserves the right to change products or specifications without notice.© 2011 Micron Technology, Inc. All rights reserved.Products and specifications discussed herein are subject to change by Micron without notice.Signal AssignmentsFigure 2: 8-Pin, VDFPN8 – MLP8 and SOP2 – SO8W (Top View)12348765S#DQ1W#/V PP /DQ2V SSV CC HOLD#/DQ3C DQ0Notes: 1.On the underside of the MLP8 package, there is an exposed central pad that is pulledinternally to V SS and must not be connected to any other voltage or signal line on the PCB.2.Reset functionality is available in devices with a dedicated part number. See Part Num-ber Ordering Information for complete package names and details.Figure 3: 16-Pin, Plastic Small Outline – SO16 (Top View)12345678161514131211109C DQ0DNU DNU DNU DNU V SS W#/V PP /DQ2HOLD#/DQ3V CCDNUDNUDNUDNUS#DQ1Note: 1.Reset functionality is available in devices with a dedicated part number. See Part Num-ber Ordering Information for complete package names and details.32Mb, 3V , Multiple I/O Serial Flash Memory Signal AssignmentsCCMTD-1725822587-8448n25q_32mb_3v_65nm.pdf - Rev. K 05/18 EN 9Micron Technology, Inc. reserves the right to change products or specifications without notice.© 2011 Micron Technology, Inc. All rights reserved.Memory OrganizationMemory Configuration and Block DiagramEach page of memory can be individually programmed. Bits are programmed from one through zero. The device is subsector, sector, or bulk-erasable, but not page-erasable.Bits are erased from zero through one. The memory is configured as 4,194,304 bytes (8bits each); 64 sectors (64KB each); 1024 subsectors (4KB each); and 16,384 pages (256bytes each); and 64 OTP bytes are located outside the main memory array.Figure 5: Block DiagramHOLD#S#W#/VCDQ0DQ132Mb, 3V , Multiple I/O Serial Flash Memory Memory OrganizationCCMTD-1725822587-8448n25q_32mb_3v_65nm.pdf - Rev. K 05/18 EN 13Micron Technology, Inc. reserves the right to change products or specifications without notice.© 2011 Micron Technology, Inc. All rights reserved.Table 15: Flag Status Register Bit Definitions (Continued)Notes: 1.Register bits are read by READ FLAG STATUS REGISTER command. All bits are volatile.2.These program/erase controller settings apply only to PROGRAM or ERASE command cy-cles in progress, or to the specific WRITE command cycles in progress as shown here.3.Status bits are reset automatically.4.Error bits must be reset by CLEAR FLAG STATUS REGISTER command.5.Typical errors include operation failures and protection errors caused by issuing a com-mand before the error bit has been reset to 0.32Mb, 3V , Multiple I/O Serial Flash Memory Nonvolatile and Volatile RegistersCCMTD-1725822587-8448n25q_32mb_3v_65nm.pdf - Rev. K 05/18 EN 26Micron Technology, Inc. reserves the right to change products or specifications without notice.© 2011 Micron Technology, Inc. All rights reserved.。
MEMORY存储芯片N25Q032A13ESF40F中文规格书
Table 137: Basic I DD , I PP , and I DDQ Measurement Conditions (Continued)8Gb: x4, x8, x16 DDR4 SDRAM Current Specifications – Measurement ConditionsCAS WRITE LatencyCAS WRITE latency (CWL) is defined by MR2[5:3] as shown in the MR2 Register Defini-tion table. CWL is the delay, in clock cycles, between the internal WRITE command and the availability of the first bit of input data. The device does not support any half-clock latencies. The overall WRITE latency (WL) is defined as additive latency (AL) + parity la-tency (PL) + CAS WRITE latency (CWL): WL = AL +PL + CWL.Low-Power Auto Self RefreshLow-power auto self refresh (LPASR) is supported in the device. Applications requiring SELF REFRESH operation over different temperature ranges can use this feature to opti-mize the I DD6 current for a given temperature range as specified in the MR2 Register Definition table.Dynamic ODTIn certain applications and to further enhance signal integrity on the data bus, it is de-sirable to change the termination strength of the device without issuing an MRS com-mand. This may be done by configuring the dynamic ODT (R TT(WR)) settings in MR2[11:9]. In write leveling mode, only R TT(NOM) is available.Write Cyclic Redundancy Check Data BusThe write cyclic redundancy check (CRC) data bus feature during writes has been added to the device. When enabled via the mode register, the data transfer size goes from the normal 8-bit (BL8) frame to a larger 10-bit UI frame, and the extra two UIs are used for the CRC information.8Gb: x4, x8, x16 DDR4 SDRAM Mode Register 2。
MEMORY存储芯片STM8S003F3P6中文规格书
This is information on a product in full production.August 2018DS7147 Rev 10Value line, 16-MHz STM8S 8-bit MCU, 8-Kbyte Flash memory, 128-byte data EEPROM, 10-bit ADC, 3 timers, UART, SPI, I²CDatasheet - production dataFeaturesCore•16 MHz advanced STM8 core with Harvard architecture and 3-stage pipeline •Extended instruction setMemories•Program memory: 8 Kbyte Flash memory; data retention 20 years at 55 °C after 100 cycles •RAM: 1 Kbyte•Data memory: 128 bytes true data EEPROM;endurance up to 100 k write/erase cyclesClock, reset and supply management• 2.95 V to 5.5 V operating voltage•Flexible clock control, 4 master clock sources –Low-power crystal resonator oscillator –External clock input–Internal, user-trimmable 16 MHz RC –Internal low-power 128 kHz RC •Clock security system with clock monitor •Power management–Low-power modes (wait, active-halt, halt)–Switch-off peripheral clocks individually –Permanently active, low-consumption power-on and power-down resetInterrupt management•Nested interrupt controller with 32 interrupts •Up to 27 external interrupts on 6 vectorsTimers•Advanced control timer: 16-bit, 4 CAPCOM channels, 3 complementary outputs, dead-time insertion and flexible synchronization •16-bit general purpose timer, with 3 CAPCOM channels (IC, OC or PWM)•8-bit basic timer with 8-bit prescaler •Auto wakeup timer•Window and independent watchdog timersCommunications interfaces•UART with clock output for synchronousoperation, SmartCard, IrDA, LIN master mode •SPI interface up to 8 Mbit/s •I 2C interface up to 400 Kbit/sAnalog to digital converter (ADC)•10-bit ADC, ± 1 LSB ADC with up to 5multiplexed channels, scan mode and analog watchdogI/Os•Up to 28 I/Os on a 32-pin package including 21high-sink outputs •Highly robust I/O design, immune against current injectionDevelopment support•Embedded single-wire interface module(SWIM) for fast on-chip programming and non-intrusive debuggingDescription STM8S003F3 STM8S003K3DS7147 Rev 102 DescriptionThe STM8S003F3/K3 value line 8-bit microcontrollers offer 8 Kbytes of Flash programmemory, plus integrated true data EEPROM. They are referred to as low-density devices in the STM8S microcontroller family reference manual (RM0016).The STM8S003F3/K3 value line devices provide the following benefits: performance, robustness and reduced system cost.Device performance and robustness are ensured by true data EEPROM supporting up to 100000 write/erase cycles, advanced core and peripherals made in a state-of-the-arttechnology at 16 MHz clock frequency, robust I/Os, independent watchdogs with separate clock source, and a clock security system.The system cost is reduced thanks to a high system integration level with internal clock oscillators, watchdog, and brown-out reset.Full documentation is offered as well as a wide choice of development tools.Table 1. STM8S003F3/K3 value line featuresFeaturesSTM8S003K3STM8S003F3Pin count3220Max. number of GPIOs (I/O)2816External interrupt pins 2716Timer CAPCOM channels 77Timer complementary outputs 32A/D converter channels 45High-sink I/Os2112Low-density Flash program memory (byte)8 K 8 K RAM (byte)1 K 1 K True data EEPROM (byte)128(1)1.Without read-while-write capability.128(1)Peripheral setMulti purpose timer (TIM1), SPI, I2C, UART, Window WDG, independent WDG, ADC, PWM timer (TIM2), 8-bit timer (TIM4)DS7147 Rev 10STM8S003F3 STM8S003K3Block diagram3 Block diagramFigure 1. STM8S003F3/K3 value line block diagramXTAL 1-16 MHzRC int. 16 MHzRC int. 128 kHzSTM8 coreDebug/SWIMUART1I2CSPIAWU timerReset blockResetPORBORClock controllerDetectorClock to peripherals and core400Kbit/s8Mbit/sup to 5A d d r e s s a n d d a t a b u sWindow WDG8 Kbyte 128 byte 1 Kbyte RAMADC1ResetSingle wiredebug interfaceprogram Flashdata EEPROM16-bit general purpose16-bit advanced controltimer (TIM1)timer (TIM2)8-bit basic timer(TIM4)Beeper1/2/4 kHz beepIndependent WDG4 CAPCOM channels Up to 3 CAPCOM channelsUp to + 3 complementaryoutputsLIN master channelsSPI emul.STM8S003F3 STM8S003K3Product overviewDS7147 Rev 10Product overview STM8S003F3 STM8S003K3DS7147 Rev 104.12 TIM4 - 8-bit basic timer•8-bit autoreload, adjustable prescaler ratio to any power of 2 from 1 to 128•Clock source: CPU clock•Interrupt source: 1 x overflow/update4.13 Analog-to-digital converter (ADC1)STM8S003F3/K3 value line products contain a 10-bit successive approximation A/Dconverter (ADC1) with up to 5 external multiplexed input channels and the following main features: •Input voltage range: 0 to V DDA •Conversion time: 14 clock cycles•Single and continuous, buffered continuous conversion modes •Buffer size (10 x 10 bits)•Scan mode for single and continuous conversion of a sequence of channels •Analog watchdog capability with programmable upper and lower thresholds •Analog watchdog interrupt •External trigger input •Trigger from TIM1 TRGO •End of conversion (EOC) interruptNote:Additional AIN12 analog input is not selectable in ADC scan mode or with analog watchdog. Values converted from AIN12 are stored only into the ADC_DRH/ADC_DRL registers.4.14 Communication interfacesThe following communication interfaces are implemented:•UART1: full feature UART, synchronous mode, SPI master mode, SmartCard mode,IrDA mode, LIN2.1 master capability •SPI: full and half-duplex, 8 Mbit/s •I²C: up to 400 Kbit/sTable 3. TIM timer featuresTimerCounter size (bits)PrescalerCounting mode CAPCOM channels Complem. outputs Ext. trigger Timersynchr-onization/ chainingTIM1 16Any integer from 1 to 65536Up/down 43Yes NoTIM2 16Any power of 2 from 1 to 32768Up 30No TIM48Any power of 2 from 1 to 128UpNo。
MEMORY存储芯片N25Q032A11EF640F中文规格书
Micron Serial NOR Flash Memory 1.8V, Multiple I/O, 4KB Sector EraseN25Q032AFeatures•SPI-compatible serial bus interface•108 MHz (MAX) clock frequency•1.7–2.0V single supply voltage•Dual/quad I/O instruction provides increased throughput up to 432 MHz•Supported protocols–Extended SPI, dual I/O, and quad I/O •Execute-in-place (XIP) mode for all three protocols –Configurable via volatile or nonvolatile registers –Enables memory to work in XIP mode directly af-ter power-on•PROGRAM/ERASE SUSPEND operations •Continuous read of entire memory via a single com-mand–Fast read–Quad or dual output fast read–Quad or dual I/O fast read•Flexible to fit application–Configurable number of dummy cycles–Output buffer configurable•Software reset•64-byte, user-lockable, one-time programmable (OTP) dedicated area•Erase capability–Subsector erase 4KB uniform granularity blocks –Sector erase 64KB uniform granularity blocks–Full-chip erase •Write protection–Software write protection applicable to every 64KB sector via volatile lock bit–Hardware write protection: protected area size defined by four nonvolatile bits (BP0, BP1, BP2,and TB)–Additional smart protections, available upon re-quest•Electronic signature–JEDEC-standard 2-byte signature (BB16h)–Unique ID code (UID): 17 read-only bytes, in-cluding:•Two additional extended device ID (EDID)bytes to identify device factory options•Customized factory data (14 bytes)•Minimum 100,000 ERASE cycles per sector •More than 20 years data retention•Packages JEDEC standard, all RoHS compliant–F4 = UF-PDFN-8 4mm x 3mm (MLP8 4mm x 3mm)–F6 = V-PDFN-8 6mm x 5mm ( MLP8 6mm x 5mm )–F8 = V-PDFN-8 8mm x 6mm (MLP8 8mm x 6mm)–12 = T-PBGA-24b05 6mm x 8mm–SF = SOP2-16 300 mils body width (SO16W)–SE = SOP2-8 208 mils body width (SO8W)质量等级领域:宇航级IC、特军级IC、超军级IC、普军级IC、禁运IC、工业级IC,军级二三极管,功率管等;应用领域:航空航天、船舶、汽车电子、军用计算机、铁路、医疗电子、通信网络、电力工业以及大型工业设备祝您:工作顺利,生活愉快!以深圳市美光存储技术有限公司提供的参数为例,以下为N25Q032A11EF640F的详细参数,仅供参考Device DescriptionThe N25Q is the first high-performance multiple input/output serial Flash memory de-vice manufactured on 65nm NOR technology. It features execute-in-place (XIP) func-tionality, advanced write protection mechanisms, and a high-speed SPI-compatible businterface. The innovative, high-performance, dual and quad input/output instructionsenable double or quadruple the transfer bandwidth for READ and PROGRAM opera-tions.FeaturesThe memory is organized as 64 (64KB) main sectors that are further divided into 16 sub-sectors each (1024 subsectors in total). The memory can be erased one 4KB subsector ata time, 64KB sectors at a time, or as a whole.The memory can be write protected by software through volatile and nonvolatile pro-tection features, depending on the application needs. The protection granularity is of64KB (sector granularity) for volatile protectionsThe device has 64 one-time programmable (OTP) bytes that can be read and program-med with the READ OTP and PROGRAM OTP commands. These 64 bytes can also bepermanently locked with a PROGRAM OTP command.The device also has the ability to pause and resume PROGRAM and ERASE cycles by us-ing dedicated PROGRAM/ERASE SUSPEND and RESUME instructions.Operating ProtocolsThe memory can be operated with three different protocols:•Extended SPI (standard SPI protocol upgraded with dual and quad operations)•Dual I/O SPI•Quad I/O SPIThe standard SPI protocol is extended and enhanced by dual and quad operations. Inaddition, the dual SPI and quad SPI protocols improve the data access time andthroughput of a single I/O device by transmitting commands, addresses, and dataacross two or four data lines.XIP ModeXIP mode requires only an address (no instruction) to output data, improving randomaccess time and eliminating the need to shadow code onto RAM for fast execution.All protocols support XIP operation. For flexibility, multiple XIP entry and exit methodsare available. For applications that must enter XIP mode immediately after poweringup, XIP mode can be set as the default mode through the nonvolatile configuration reg-ister bits.Signal DescriptionsThe signal description table below is a comprehensive list of signals for the N25 familydevices. All signals listed may not be supported on this device. See Signal Assignmentsfor information specific to this device.32Mb, 1.8V, Multiple I/O Serial Flash MemoryNonvolatile and Volatile Registers Nonvolatile and Volatile RegistersThe device features the following volatile and nonvolatile registers that users can accessto store device parameters and operating configurations:•Status register•Nonvolatile and volatile configuration registers•Enhanced volatile configuration register•Flag status register•Lock registerNote: The lock register is defined in READ LOCK REGISTER Command.In addition to these user-accessible registers, the working condition of memory is set byan internal configuration register that is not directly accessible to users. As shown be-low, parameters in the internal configuration register are loaded from the nonvolatileconfiguration register during each device boot phase or power-on reset. In this sense,then, the nonvolatile configuration register contains the default settings of memory.Also, during the life of an application, each time a WRITE VOLATILE or ENHANCEDVOLATILE CONFIGURATION REGISTER command executes to set configuration pa-rameters in these respective registers, these new settings are copied to the internal con-figuration register. Therefore, memory settings can be changed in real time. However, atthe next power-on reset, the memory boots according to the memory settings definedin the nonvolatile configuration register parameters.。
MEMORY存储芯片MAX3232CSE中文规格书
*Covered by U.S. Patent numbers 4,636,930; 4,679,134; 4,777,577; 4,797,899; 4,809,152; 4,897,774; 4,999,761; and other patents pending.For pricing, delivery, and ordering information, please contact Maxim Direct at3.0V to 5.5V , Low-Power, up to 1Mbps, True RS-232Transceivers Using Four 0.1µF External Capacitors MAX3222/MAX3232/MAX3237/MAX3241__________________________________________Typical Operating Characteristics (V CC = +3.3V, 235kbps data rate, 0.1µF capacitors, all transmitters loaded with 3k Ω, T A = +25°C, unless otherwise noted.)TIMING CHARACTERISTICS—MAX3237(V CC = +3.0V to +5.5V, C1–C4 = 0.1µF (Note 2), T A = T MIN to T MAX , unless otherwise noted. Typical values are at T A = +25°C.)Note 2:MAX3222/MAX3232/MAX3241: C1–C4 = 0.1µF tested at 3.3V ±10%; C1 = 0.047µF, C2–C4 = 0.33µF tested at 5.0V ±10%.MAX3237: C1–C4 = 0.1µF tested at 3.3V ±5%; C1–C4 = 0.22µF tested at 3.3V ±10%; C1 = 0.047µF, C2–C4 = 0.33µF testedat 5.0V ±10%.Note 3:Transmitter input hysteresis is typically 250mV.-6-5-4-3-2-101234560MAX3222/MAX3232TRANSMITTER OUTPUT VOLTAGE vs. LOAD CAPACITANCELOAD CAPACITANCE (pF)T R A N S M I T T E R O U T P U T V O L T A G E (V )200030001000400050000246810121416182022150MAX3222/MAX3232SLEW RATE vs. LOAD CAPACITANCE LOAD CAPACITANCE (pF)S L E W R A T E (V /μs )2000300010004000500005101520253035400MAX3222/MAX3232SUPPLY CURRENT vs. LOAD CAPACITANCE WHEN TRANSMITTING DATA LOAD CAPACITANCE (pF)S U P P L Y C U R R E N T (m A )200030001000400050003.0V to 5.5V , Low-Power, up to 1Mbps, True RS-232Transceivers Using Four 0.1µF External Capacitors MAX3222/MAX3232/MAX3237/MAX3241-7.5-5.0-2.502.55.07.50MAX3241TRANSMITTER OUTPUT VOLTAGEvs. LOAD CAPACITANCELOAD CAPACITANCE (pF)T R A N S M I T T E R O U T P U T V O L T A G E (V )2000300010004000500046810121416182022240MAX3241SLEW RATE vs. LOAD CAPACITANCE LOAD CAPACITANCE (pF)S L E W R A T E (V /μs )200030001000400050000510152025303545400MAX3241SUPPLY CURRENT vs. LOAD CAPACITANCE WHEN TRANSMITTING DATA LOAD CAPACITANCE (pF)S U P P L Y C U R R E N T (m A )20003000100040005000-7.5-5.0-2.502.55.07.50MAX3237TRANSMITTER OUTPUT VOLTAGEvs. LOAD CAPACITANCE (MBAUD = GND)LOAD CAPACITANCE (pF)T R A N S M I T T E R O U T P U T V O L T A G E (V )200030001000400050000102030504060700MAX3237SLEW RATE vs. LOAD CAPACITANCE(MBAUD = V CC )LOAD CAPACITANCE (pF)S L E W R A T E (V /μs )500100015002000-7.5-5.0-2.502.55.07.50MAX3237TRANSMITTER OUTPUT VOLTAGE vs. LOAD CAPACITANCE (MBAUD = V CC )LOAD CAPACITANCE (pF)T R A N S M I T T E R O U T P U T V O L T A G E (V )50010001500200001020304050600MAX3237SUPPLY CURRENT vs. LOAD CAPACITANCE (MBAUD = GND)LOAD CAPACITANCE (pF)S U P P L Y C U R R E N T (m A )200030001000400050000246810120MAX3237SLEW RATE vs. LOAD CAPACITANCE (MBAUD = GND)LOAD CAPACITANCE (pF)S L E W R A T E (V /μs )2000300010004000500001*********60700MAX3237SKEW vs. LOAD CAPACITANCE (t PLH - t PHL )LOAD CAPACITANCE (pF)1000150050020002500_____________________________Typical Operating Characteristics (continued)(V CC = +3.3V, 235kbps data rate, 0.1µF capacitors, all transmitters loaded with 3k Ω, T A = +25°C, unless otherwise noted.)3.0V to 5.5V , Low-Power, up to 1Mbps, True RS-232Transceivers Using Four 0.1µF External Capacitors MAX3222/MAX3232/MAX3237/MAX3241Ordering Information (continued)*Dice are tested at T A = +25°C, DC parameters only.+Denotes lead-free package.PART TEMP RANGE PIN-PACKAGEPKG CODE MAX3222EUP+ -40°C to +85°C 20 TSSOPU20+2 MAX3222EAP+ -40°C to +85°C 20 SSOPA20+1 MAX3222EWN+ -40°C to +85°C 18 SOW18+1 MAX3222EPN+ -40°C to +85°C 18 Plastic DipP18+5 MAX3222C/D 0°C to +70°C Dice*— MAX3232CUE+0°C to +70°C 16 TSSOPU16+1 MAX3232CSE+ 0°C to +70°C 16 Narrow SOS16+1 MAX3232CWE+ 0°C to +70°C 16 Wide SOW16+1 MAX3232CPE+ 0°C to +70°C 16 Plastic DIPP16+1 MAX3232EUE+ -40°C to +85°C 16 TSSOPU16+1 MAX3232ESE+ -40°C to +85°C16 Narrow SO S16+5 PART TEMP RANGE PIN-PACKAGE PKG CODE MAX3232EWE+ -40°C to +85°C 16 Wide SO W16+1 MAX3232EPE+ -40°C to +85°C 16 Plastic DIP P16+1MAX3237CAI+ 0°C to +70°C 16 SSOP A28+2 MAX3237EAI+ 0°C to +70°C 28 SSOP A28+1 MAX3241CUI+ 0°C to +70°C 28 TSSOP U28+2 MAX3241CAI+ 0°C to +70°C 28 SSOP A28+1 MAX3241CWI+ 0°C to +70°C 28 SO W28+6 MAX3241EUI+ -40°C to +85°C 28 TSSOP U28+2 MAX3241EAI+ -40°C to +85°C 28 SSOP A28+1 MAX3241EWI+ -40°C to +85°C 28 SO W28+6。
MEMORY存储芯片TUSB212RWBR中文规格书
I/O
INTERNAL PULLUP/PULLDOWN
DESCRIPTION
I/O
N/A
I/O
N/A
I/O
RSTN asserted: 500 kΩ PD
I/O
RSTN asserted: 500 kΩ PD
I
500 kΩ PU
I
N/A
I/O
N/A
I/O
N/A
I/O
P
N/A
O
N/A
P
N/A
USB High Speed negative port..
6.2 ESD Ratings
V(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2)
channel Cable Length – Four Selectable AC Boost Settings Via
External Pulldown Resistor – DC Boost Along With AC Boost for Best Signal
Integrity
2 Applications
In addition, TUSB212 is compatible with the USB OnThe-Go (OTG) and Battery Charging (BC) protocols.
Device Information (1)
HSC-1812BA493A-中英文说明书-C00
目录 第一章 产品介绍 ......................................................................................................1
简介 ......................................................................................................................1 机械尺寸、重量与环境.......................................................................................1 典型功耗 ..............................................................................................................1 微处理器 ..............................................................................................................2 芯片组 ..................................................................................................................2 系统内存 ..............................................................................................................2 显示功能 ..............................................................................................................2 网络功能 ..............................................................................................................2 电源特性 ..............................................................................................................2 扩展总线 ..............................................................................................................2 Watchdog功能 ......................................................................................................2 操作系统 ..............................................................................................................3 I/O接口 .................................................................................................................3 EMC .....................................................................................................................3 第二章 安装说明 ......................................................................................................4
NVIDIA CUDA Getting Started Guide for Mac OS X说明书
DU-05348-001_v6.0 | February 2014Installation and Verification on Mac OS XTABLE OF CONTENTS Chapter 1. Introduction (1)1.1. System Requirements (1)1.2. About This Document (2)Chapter 2. Prerequisites (3)2.1. CUDA-capable GPU (3)2.2. Mac OS X Version (3)2.3. Command-Line T ools (3)Chapter 3. Installation (5)3.1. Download (5)3.2. Install (5)3.3. Uninstall (6)Chapter 4. Verification (7)4.1. Driver (7)4.2. Compiler (7)4.3. Runtime (8)Chapter 5. Additional Considerations (10)CUDA™ is a parallel computing platform and programming model invented by NVIDIA. It enables dramatic increases in computing performance by harnessing the power of the graphics processing unit (GPU).CUDA was developed with several design goals in mind:‣Provide a small set of extensions to standard programming languages, like C, that enable a straightforward implementation of parallel algorithms. With CUDA C/C++, programmers can focus on the task of parallelization of the algorithms rather than spending time on their implementation.‣Support heterogeneous computation where applications use both the CPU and GPU. Serial portions of applications are run on the CPU, and parallel portions are offloaded to the GPU. As such, CUDA can be incrementally applied to existingapplications. The CPU and GPU are treated as separate devices that have their own memory spaces. This configuration also allows simultaneous computation on the CPU and GPU without contention for memory resources.CUDA-capable GPUs have hundreds of cores that can collectively run thousands of computing threads. These cores have shared resources including a register file and a shared memory. The on-chip shared memory allows parallel tasks running on these cores to share data without sending it over the system memory bus.This guide will show you how to install and check the correct operation of the CUDA development tools.1.1. System RequirementsTo use CUDA on your system, you need to have:‣ a CUDA-capable GPU‣Mac OS X 10.8 or later‣the gcc or Clang compiler and toolchain installed using Xcode‣the NVIDIA CUDA Toolkit (available from the CUDA Download page)Introduction T able 1 Mac Operating System Support in CUDA 6.0Before installing the CUDA Toolkit, you should read the Release Notes, as they provide important details on installation and software functionality.1.2. About This DocumentThis document is intended for readers familiar with the Mac OS X environment andthe compilation of C programs from the command line. You do not need previous experience with CUDA or experience with parallel computation.2.1. CUDA-capable GPUTo verify that your system is CUDA-capable, under the Apple menu select AboutThis Mac, click the More Info … button, and then select Graphics/Displays under the Hardware list. There you will find the vendor name and model of your graphics card.If it is an NVIDIA card that is listed on the CUDA-supported GPUs page, your GPU is CUDA-capable.The Release Notes for the CUDA Toolkit also contain a list of supported products.2.2. Mac OS X VersionThe CUDA Development Tools require an Intel-based Mac running Mac OSX v. 10.8 or later. To check which version you have, go to the Apple menu on the desktop and select About This Mac.2.3. Command-Line T oolsThe CUDA Toolkit requires that the native command-line tools (gcc, clang,...) are already installed on the system.To install those command-line tools, Xcode must be installed first. Xcode is available from the Mac App Store.Once Xcode is installed, the command-line tools can be installed by launching Xcode and following those steps:1.Xcode > Preferences... > Downloads > Components2.Install the Command Line Tools packageAlternatively, you can install the command-line tools from the Terminal window by typing the following command: xcode-select --install.PrerequisitesYou can verify that the toolchain is installed by entering the command /usr/bin/cc --help from a Terminal window.3.1. DownloadOnce you have verified that you have a supported NVIDIA GPU, a supported version the MAC OS, and gcc, you need to download the NVIDIA CUDA Toolkit.The NVIDIA CUDA Toolkit is available at no cost from the main CUDA Downloads page. It contains the driver and tools needed to create, build and run a CUDA application as well as libraries, header files, CUDA samples source code, and other resources.The download can be verified by comparing the posted MD5 checksum with that of the downloaded file. If either of the checksums differ, the downloaded file is corrupt and needs to be downloaded again.To calculate the MD5 checksum of the downloaded file, run the following:$ openssl md5 <file>3.2. InstallUse the following procedure to successfully install the CUDA driver and the CUDA toolkit. The CUDA driver and the CUDA toolkit must be installed for CUDA to function. If you have not installed a stand-alone driver, install the driver provided with the CUDA Toolkit.Choose which packages you wish to install. The packages are:‣CUDA Driver: This will install /Library/Frameworks/CUDA.framework and the UNIX-compatibility stub /usr/local/cuda/lib/libcuda.dylib that refers to it.‣CUDA Toolkit: The CUDA Toolkit supplements the CUDA Driver with compilers and additional libraries and header files that are installed into /Developer/ NVIDIA/CUDA-6.0 by default. Symlinks are created in /usr/local/cuda/pointing to their respective files in /Developer/NVIDIA/CUDA-6.0/. PreviousInstallationinstallations of the toolkit will be moved to /Developer/NVIDIA/CUDA-#.# tobetter support side-by-side installations.‣CUDA Samples (read-only): A read-only copy of the CUDA Samples is installed in /Developer/NVIDIA/CUDA-6.0/samples. Previous installations of the samples will be moved to /Developer/NVIDIA/CUDA-#.#/samples to better support side-by-side installations.Set up the required environment variables:export PATH=/Developer/NVIDIA/CUDA-6.0/bin:$PATHexport DYLD_LIBRARY_PATH=/Developer/NVIDIA/CUDA-6.0/lib:$DYLD_LIBRARY_PATHIn order to modify, compile, and run the samples, the samples must also be installed with write permissions. A convenience installation script is provided: cuda-install-samples-6.0.sh. This script is installed with the cuda-samples-6-0 package.3.3. UninstallThe CUDA Driver, Toolkit and Samples can be uninstalled by executing the uninstall script provided with the Toolkit:/Developer/NVIDIA/CUDA-6.0/bin/uninstallBefore continuing, it is important to verify that the CUDA toolkit can find and communicate correctly with the CUDA-capable hardware. To do this, you need to compile and run some of the included sample programs.Ensure the PATH and DYLD_LIBRARY_PATH variables are set correctly.4.1. DriverIf the CUDA Driver is installed correctly, the CUDA kernel extension (/System/ Library/Extensions/CUDA.kext) should be loaded automatically at boot time. To verify that it is loaded, use the commandkextstat | grep -i cuda4.2. CompilerThe installation of the compiler is first checked by running nvcc -V in a terminal window. The nvcc command runs the compiler driver that compiles CUDA programs. It calls the host compiler for C code and the NVIDIA PTX compiler for the CUDA code.On Mac OS 10.8 with XCode 5, nvcc must be invoked with --ccbin=path-to-clang-executable. There are some features that are not yet supported: Clang languageextensions (see /docs/LanguageExtensions.html), LL VM libc++ (only GNU libstdc++ is currently supported), language features introduced in C++11, the __global__ function template explicit instantiation definition, and 32-bitarchitecture cross-compilation.The NVIDIA CUDA Toolkit includes CUDA sample programs in source form. To fully verify that the compiler works properly, a couple of samples should be built. After switching to the directory where the samples were installed, type:Verificationmake -C 0_Simple/vectorAddmake -C 0_Simple/vectorAddDrvmake -C 1_Utilities/deviceQuerymake -C 1_Utilities/bandwidthTestThe builds should produce no error message. The resulting binaries will appear under <dir>/bin/x86_64/darwin/release. To go further and build all the CUDA samples, simply type make from the samples root directory.4.3. RuntimeAfter compilation, go to bin/x86_64/darwin/release and run deviceQuery. Ifthe CUDA software is installed and configured correctly, the output for deviceQuery should look similar to that shown in Figure 1.Figure 1 Valid Results from deviceQuery CUDA SampleNote that the parameters for your CUDA device will vary. The key lines are the first and second ones that confirm a device was found and what model it is. Also, the next-to-last line, as indicated, should show that the test passed.Running the bandwidthTest sample ensures that the system and the CUDA-capable device are able to communicate correctly. Its output is shown in Figure 2VerificationFigure 2 Valid Results from bandwidthT est CUDA SampleNote that the measurements for your CUDA-capable device description will vary from system to system. The important point is that you obtain measurements, and that the second-to-last line (in Figure 2) confirms that all necessary tests passed.Should the tests not pass, make sure you have a CUDA-capable NVIDIA GPU on your system and make sure it is properly installed.If you run into difficulties with the link step (such as libraries not being found), consult the Release Notes found in the doc folder in the CUDA Samples directory.To see a graphical representation of what CUDA can do, run the particles executable.Now that you have CUDA-capable hardware and the NVIDIA CUDA Toolkit installed, you can examine and enjoy the numerous included programs. To begin using CUDA to accelerate the performance of your own applications, consult the CUDA C Programming Guide.A number of helpful development tools are included in the CUDA Toolkit to assistyou as you develop your CUDA programs, such as NVIDIA® Nsight™ Eclipse Edition, NVIDIA Visual Profiler, cuda-gdb, and cuda-memcheck.For technical support on programming questions, consult and participate in the Developer Forums.NoticeALL NVIDIA DESIGN SPECIFICATIONS, REFERENCE BOARDS, FILES, DRAWINGS, DIAGNOSTICS, LISTS, AND OTHER DOCUMENTS (TOGETHER AND SEPARATEL Y, "MATERIALS") ARE BEING PROVIDED "AS IS." NVIDIA MAKES NO WARRANTIES, EXPRESSED, IMPLIED, STATUTORY, OR OTHERWISE WITH RESPECT TO THE MATERIALS, AND EXPRESSL Y DISCLAIMS ALL IMPLIED WARRANTIES OF NONINFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A PARTICULAR PURPOSE.Information furnished is believed to be accurate and reliable. However, NVIDIA Corporation assumes no responsibility for the consequences of use of such information or for any infringement of patents or other rights of third parties that may result from its use. No license is granted by implication of otherwise under any patent rights of NVIDIA Corporation. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all other information previously supplied. NVIDIA Corporation products are not authorized as critical components in life support devices or systems without express written approval of NVIDIA Corporation.TrademarksNVIDIA and the NVIDIA logo are trademarks or registered trademarks of NVIDIA Corporation in the U.S. and other countries. Other company and product names may be trademarks of the respective companies with which they are associated. Copyright© 2009-2014 NVIDIA Corporation. All rights reserved.。
Nsight Systems 2021.3.1安装指南说明书
Nsight Systems Installation GuideTABLE OF CONTENTS Chapter 1. Overview (1)Chapter 2. System Requirements (3)Supported Platforms (3)CUDA Version (4)Requirements for Android-Based Devices (4)Requirements for x86_64, Power, and ARM SBSA T argets on Linux (5)x86_64 Windows T arget Device Requirements (6)Host Application Requirements (6)Chapter 3. Getting Started Guide (7)3.1. Finding the Right Package (7)3.2. Installing GUI on the Host System (8)3.3. Optional: Setting up the CLI (8)3.4. Launching the GUI (9)Nsight Systems is a statistical sampling profiler with tracing features. It is designed to work with devices and devkits based on NVIDIA Tegra SoCs (system-on-chip), ARM SBSA (server based system architecture) systems, IBM Power systems, and systems based on the x86_64 processor architecture that also include NVIDIA GPU(s). Throughout this document we will refer to the device on which profiling happens as the target, and the computer on which the user works and controls the profiling session as the host. Note that for x86_64 based systems these may be on the same device, whereas with Tegra, ARM, or IBM Power based systems they will always be separate. Furthermore, three different activities are distinguished as follows:‣Profiling — The process of collecting any performance data. A profiling session in Nsight Systems typically includes sampling and tracing.‣Sampling — The process of periodically stopping the profilee (the application under investigation during the profiling session), typically to collect backtraces (call stacks of active threads), which allows you to understand statistically how much time is spent in each function. Additionally, hardware counters can also be sampled. This process is inherently imprecise when a low number of samples have been collected.‣Tracing — The process of collecting precise information about various activities happening in the profilee or in the system. For example, profilee API execution may be traced providing the exact time and duration of a function call.Nsight Systems supports multiple generations of Tegra SoCs, NVIDIA discrete GPUs, and various CPU architectures, as well as various target and host operating systems. This documentation describes the full set of features available in any version of Nsight Systems. In the event that a feature is not available in all versions, that will be noted in the text. In general, Nsight Systems Embedded Platforms Edition indicates the package that supports Tegra processors for the embedded and automotive market and Nsight Systems Workstation Edition supports x86_64, IBM Power, and ARM server (SBSA) processors for the workstation and cluster market.Common features that are supported by Nsight Systems on most platforms include the following:‣Sampling of the profilee and collecting backtraces using multiple algorithms (such as frame pointers or DWARF data). Building top-down, bottom-up, and flat viewsOverviewas appropriate. This information helps identify performance bottlenecks in CPU-intensive code.‣Sampling or tracing system power behaviors, such as CPU frequency.‣(Only on Nsight Systems Embedded Platforms Edition)Sampling counters from ARM PMU (Performance Monitoring Unit). Information such as cache misses gets statistically correlated with function execution.‣Support for multiple windows. Users with multiple monitors can see multiple reports simultaneously, or have multiple views into the same report file.With Nsight Systems, a user could:‣Identify call paths that monopolize the CPU.‣Identify individual functions that monopolize the CPU (across different call paths).‣For Nsight Systems Embedded Platforms Edition, identify functions that have poor cache utilization.‣If platform supports CUDA, see visual representation of CUDA Runtime and Driver API calls, as well as CUDA GPU workload. Nsight Systems uses the CUDA Profiling Tools Interface (CUPTI), for more information, see: CUPTI documentation.‣If the user annotates with NVIDIA Tools Extension (NVTX), see visual representation of NVTX annotations: ranges, markers, and thread names.‣For Windows targets, see visual representation of D3D12: which API calls are being made on the CPU, graphic frames, stutter analysis, as well as GPU workloads(command lists and debug ranges).‣For x86_64 targets, see visual representation of Vulkan: which API calls are being made on the CPU, graphic frames, stutter analysis, as well as Vulkan GPU workloads (command buffers and debug ranges).Nsight Systems supports multiple platforms. For simplicity, stentryink of these as Nsight Systems Embedded Platforms Edition and Nsight Systems Workstation Edition, where Nsight Systems Workstation Edition supports desktops, workstations, and clusters with x86_64, IBM Power, and ARM SBSA CPUs on Linux and Windows OSs, while Nsight Systems Embedded Platforms Edition supports NVIDIA Tegra products for the embedded and gaming space on Android, Linux for Tegra, and QNX OSs.Supported PlatformsDepending on your OS, different GPUs are supportedAndroid‣NVIDIA SHIELD Android TV‣NVIDIA SHIELD Tablet‣Various devkitsL4T (Linux for Tegra)‣Jetson AGX Xavier‣Jetson TX2‣Jetson TX2i‣Jetson TX‣Jetson Nano‣Jetson Xavier NXx86_64, IBM Power (from Power 9), or ARM SBSA‣NVIDIA GPU architectures starting with Pascal‣OS (64 bit only)‣Ubuntu 14.04, 16.04, and 18.04‣CentOS and RedHat Enterprise Linux 7.4+ with kernel version 3.10.0-693 or later.‣Windows 10CUDA Version‣Nsight Systems supports CUDA 10.0, 10.1, 10.2, and 11.0 for most platforms ‣Nsight Systems on ARM SBSA supports 10.2 and 11.0Note that CUDA version and driver version must be compatible.CUDA Version Driver minimum version11.045010.2440.3010.1418.3910.0410.48 Requirements for Android-Based DevicesTo use Nsight Systems with Android-based target devices, you must first:1.Have a compatible Android device.2.Have a compatible Android OS image.If installing from CODEWORKS, note that devices from NVIDIA typically shipwith support, while OEMs or ODMs producing their own Nsight Systems choose whether or not to support this tool.To check for the version number of the kernel support of Nsight Systems on a target device, run the following command from ADB shell:cat /proc/quadd/versionMinimal supported version is 1.82.3.Install the Android SDK Platform tools.4.Install the ADB USB Driver.5.Have your target application compiled with the correct flags and packaged with thecorrect permissions.Items 3-4 can be handled automatically for you by installing the latest NVIDIA CodeWorks for Android. Item 2 may already be on your device, if it is a retail device starting with the Tegra 4 (minimum), but not all devices are required to come with OS images that support this tool. Item 2 can also be found for devkits by downloadingthe latest OS Image for your device. CodeWorks for Android can be found at: NVIDIA CodeWorks SDK.Using CodeWorks for Android is the recommended path for getting your Android device and system prepared to use Nsight Systems.Requirements for x86_64, Power, and ARM SBSAT argets on LinuxWhen attaching to x86_64, Power, or ARM SBSA Linux-based target from the GUI on the host, the connection is established through SSH.Use of Linux Perf: To collect thread scheduling data and IP (instruction pointer) samples, the Perf paranoid level on the target system must be 2 or less. Use the following command to check:If the output is >2, then do the following to temporarily adjust the paranoid level (note that this has to be done after each reboot):To make the change permanent, use the following command:Kernel version: To collect thread scheduling data and IP (instruction pointer) samples and backtraces, the kernel version must be:‣ 3.10.0-693 or later for CentOS and RedHat Enterprise Linux 7.4+‣ 4.3 or greater for all other distros including UbuntuTo check the version number of the kernel on a target device, run the following command on the device:Note that only CentOS, RedHat, and Ubuntu distros are tested/confirmed to work correctly.glibc version: To check the glibc version on a target device, run the following command:Nsight Systems requires glibc 2.14 or more recent.CUDA: See above for supported CUDA versions in this release. Use the deviceQuery command to determine the CUDA driver and runtime versions on the system. the deviceQuery command is available in the CUDA SDK. It is normally installed at:Only pure 64-bit environments are supported. In other words, 32-bit systems or 32-bit processes running within a 64-bit environment are not supported.Nsight Systems requires write permission to the `/var/lock` directory on the target system.Docker: See Collecting Data within a Docker section of Profiling in a Docker on Linux Devices for more information.x86_64 Windows T arget Device RequirementsDX12 Requires:‣Windows 10 with NVIDIA Driver 411.63 or higher for DX12 trace‣Windows 10 April 2018 Update (version 1803, AKA Redstone 4) with NVIDIA Driver 411.63 or higher for DirectX Ray Tracing, and tracing DX12 Copy command queues.Host Application RequirementsThe Nsight Systems host application runs on the following host platforms:‣Windows 7 and higher, Windows Server 2008 R2 and higher. Only 64-bit versions are supported.‣Linux Ubuntu 14.04 and higher are known to work, running on other modern distributions should be possible as well. Only 64-bit versions are supported.‣OS X 10.10 "Yosemite" and higher.3.1. Finding the Right PackageNsight Systems is available for multiple targets and multiple host OSs. To choose the right package, first consider the target system to be analyzed.‣For Tegra target systems, select Nsight Systems for Tegra available as part of NVIDIA JetPack SDK and NVIDIA CodeWorks SDK.‣For x86_64, IBM Power target systems,or ARM SDSA select from the target packages from Nsight Systems for Workstations, available from https:/// nsight-systems. This web release will always contain the latest and greatest Nsight Systems features.‣The x86_64, IBM Power, and ARM SBSA target versions of Nsight Systems are also available in the CUDA Toolkit.Each package is limited to one architecture. For example, Tegra packages do not contain support for profiling x86 targets, and x86 packages do not contain support for profiling Tegra targets.After choosing an appropriate target version, select the package corresponding to the host OS, the OS on the system where results will be viewed. These packages are inthe form of common installer types: .msi for Windows; .run, .rpm, and .deb for x86 Linux; .deb and .rpm for Linux on IBM Power; and .dmg for the MacOS installer. Note: the IBM Power and ARM SBSA packages do not have a GUI for visualization of the result. If you wish to visualize your result, please download and install the GUI available for MacOS, x86_64 Linux, or Windows systems.Tegra packages‣Windows host – Install .msi on Windows machine. Enables remote access to Tegra device for profiling.‣Linux host – Install .run on Linux system. Enables remote access to Tegra device for profiling.‣MacOS host – Install .dmg on MacOS machine. Enables remote access to Tegra device for profiling.Getting Started Guidex86_64 packages‣Windows host – Install .msi on Windows machine. Enables remote access to Linux x86_64 or Windows devices for profiling as well as running on local system.‣Linux host – Install .run, .rpm, or .deb on Linux system. Enables remote access to Linux x86_64 or Windows devices for profiling or running collection on localhost.‣Linux CLI only – The Linux CLI is shipped in all x86 packages, but if you just want the CLI, we have a package for that. Install .deb on Linux system. Enables only CLI collection, report can be imported or opened in x86_64 host.‣MacOS host – Install .dmg on MacOS machine. Enables remote access to Linux x86_64 device for profiling.IBM Power packages‣Power CLI only - The IBM Power support does not include a host GUI. Install .deb or .rpm on your Power system. Enables only CLI collection, report can be imported or opened in GUI on any supported host platform.ARM SBSA packages‣ARM SBSA CLI only - ARM SBSA support does not include a host GUI. Install .deb or .rpm on your ARM SBSA system. Enables only CLI collection, report can beimported or opened in GUI on any supported host platform.3.2. Installing GUI on the Host SystemCopy the appropriate file to your host system in a directory where you have write and execute permissions. Run the install file, accept the EULA, and Nsight Systems will install on your system.On Linux, there are special options to enable automated installation. Running the installer with the --accept flag will automatically accept the EULA, running withthe --accept flag and the --quiet flag will automatically accept the EULA without printing to stdout. Running with --quiet without --accept will display an error. The installation will create a Host directory for this host and a Target directory for each target this Nsight Systems package supports.All binaries needed to collect data on a target device will be installed on the target by the host on first connection to the device. There is no need to install the package on the target device.If installing from the CUDA Toolkit, see the CUDA Toolkit documentation.3.3. Optional: Setting up the CLIAll Nsight Systems targets can be profiled using the CLI. IBM Power and ARM SBSA targets can only be profiled using the CLI. The CLI is especially helpful when scripts are used to run unattended collections or when access to the target system via ssh is not possible. In particular, this can be used to enable collection in a Docker container.Getting Started Guide Installation Guide v2021.3.1 | 9The CLI can be found in the Target directory of the Nsight Systems installation. Users who want to install the CLI as a standalone tool can do so by copying the files within the Target directory to the location of their choice.If you wish to run the CLI without root (recommended mode) you will want to install in a directory where you have full access.Once you have the CLI set up, you can use the nsys status -e command to check your environment.~$ nsys status -e Sampling Environment Check Linux Kernel Paranoid Level = 1: OK Linux Distribution = Ubuntu Linux Kernel Version = 4.15.0-109-generic: OK Linux perf_event_open syscall available: OK Sampling trigger event available: OK Intel(c) Last Branch Record support: Available Sampling Environment: OKThis status check allows you to ensure that the system requirements for CPU sampling using Nsight Systems are met in your local environment. If the Sampling Environment is not OK, you will still be able to run various trace operations.Intel(c) Last Branch Record allows tools, including Nsight Systems to use hardware to quickly get limited stack information. Nsight Systems will use this method for stack resolution by default if available.For information about changing these environment settings, see System Requirements section in the Installation Guide. For information about changing the backtrace method,see Profiling from the CLI in the User Guide.To get started using the CLI, run nsys --help for a list of options or see Profiling Applications from the CLI in the User Guide for full documentation.3.4. Launching the GUIInstalled from Product Download PageDepending on your OS, Nsight Systems will have installed an icon on your host desktop that you can use to launch the GUI. To launch the GUI directly, run the nsight-sys executable in the Host sub-directory of your installation.Installed as Part of the CUDA ToolkitNsight Systems is installed by the CUDA Toolkit installer in /usr/local/cuda-[version]/NsightSystems-[version]. To launch the GUI, run the nsight-sys executable in the Host sub-directory there.In a future version of the CUDA Toolkit, this installation will be moved under the CUDA/bin directory.。
MEMORY存储芯片TPS56C215RNNR中文规格书
Operating junction temperature Storage temperature
MIN
MAX
UNIT
–0.3
20
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–2
19
V
–3
20
V
–0.3
6.5
V
–0.3
6.5
V
–0.3
25.5
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–0.3
6.5
V
–0.3
6
V
–0.3
6.5
V
14
A
–40
150
°C
–55
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
AGND 12
1 BOOT
BOOT 1
12 AGND
VIN 11
2 VIN
VIN 2
11 VIN
PGND 10
MEMORY存储芯片N25Q032A13ESE40F中文规格书
Table 33: 1.35V R TT Effective Impedance (Continued)ODT SensitivityIf either the temperature or voltage changes after I/O calibration, then the tolerancelimits listed in Table 32 and Table 33 can be expected to widen according to Table 34and Table 35.Table 34: ODT Sensitivity DefinitionNote: 1.˂T = T - T(@ calibration), ˂V = V DDQ - V DDQ(@ calibration) and V DD = V DDQ.Table 35: ODT Temperature and Voltage SensitivityNote: 1.˂T = T - T(@ calibration), ˂V = V DDQ - V DDQ(@ calibration) and V DD = V DDQ.ODT Timing DefinitionsODT loading differs from that used in AC timing measurements. The reference load forODT timings is shown in Figure 24. Two parameters define when ODT turns on or offsynchronously, two define when ODT turns on or off asynchronously, and another de-fines when ODT turns on or off dynamically. Table 36 and Table 37 (page 63) outlineand provide definition and measurement references settings for each parameter.ODT turn-on time begins when the output leaves High-Z and ODT resistance begins toturn on. ODT turn-off time begins when the output leaves Low-Z and ODT resistancebegins to turn off.4Gb: x4, x8, x16 DDR3L SDRAM Electrical Characteristics and AC Operating ConditionsCommand and Address Setup, Hold, and DeratingThe total t IS (setup time) and t IH (hold time) required is calculated by adding the data sheet t IS (base) and t IH (base) values (see Table 60; values come from the ElectricalCharacteristics and AC Operating Conditions table) to the ǻt IS and ǻt IH derating values (see Table 61 (page 104), Table 62 (page 104) or Table 63 (page 104)) respectively. Ex-ample: t IS (total setup time) = t IS (base) + ǻt IS. For a valid transition, the input signal has to remain above/below V IH(AC)/V IL(AC) for some time t VAC (see Table 64 (page 105)).Although the total setup time for slow slew rates might be negative (for example, a valid input signal will not have reached V IH(AC)/V IL(AC) at the time of the rising clock transi-tion), a valid input signal is still required to complete the transition and to reachV IH(AC)/V IL(AC) (see Figure 15 (page 53) for input signal requirements). For slew rates that fall between the values listed in Table 61 (page 104) and Table 63 (page 104), the derat-ing values may be obtained by linear interpolation.Setup (t IS) nominal slew rate for a rising signal is defined as the slew rate between the last crossing of V REF(DC) and the first crossing of V IH(AC)min . Setup (t IS) nominal slew rate for a falling signal is defined as the slew rate between the last crossing of V REF(DC) and the first crossing of V IL(AC)max . If the actual signal is always earlier than the nominal slew rate line between the shaded V REF(DC)-to-AC region, use the nominal slew rate for derat-ing value (see Figure 34 (page 106)). If the actual signal is later than the nominal slew rate line anywhere between the shaded V REF(DC)-to-AC region, the slew rate of a tangent line to the actual signal from the AC level to the DC level is used for derating value (see Figure 36 (page 108)).Hold (t IH) nominal slew rate for a rising signal is defined as the slew rate between the last crossing of V IL(DC)max and the first crossing of V REF(DC). Hold (t IH) nominal slew rate for a falling signal is defined as the slew rate between the last crossing of V IH(DC)min and the first crossing of V REF(DC). If the actual signal is always later than the nominal slew rate line between the shaded DC-to-V REF(DC) region, use the nominal slew rate for derat-ing value (see Figure 35 (page 107)). If the actual signal is earlier than the nominal slew rate line anywhere between the shaded DC-to-V REF(DC) region, the slew rate of a tangent line to the actual signal from the DC level to the V REF(DC) level is used for derating value (see Figure 37 (page 109)).Table 60: DDR3L Command and Address Setup and Hold Values 1 V/ns Referenced – AC/DC-Based4Gb: x4, x8, x16 DDR3L SDRAMCommand and Address Setup, Hold, and Derating。
英语介绍芯片的作文
英语介绍芯片的作文Title: Introduction to Microchips。
Introduction:Microchips, also known as integrated circuits, are fundamental components in modern electronics. They play a pivotal role in powering a vast array of devices, ranging from smartphones and computers to advanced medical equipment and space exploration technology. In this essay, we will delve into the intricacies of microchips, exploring their structure, functionality, and significance in today's technological landscape.Definition and Structure:At its core, a microchip is a tiny semiconductor wafer comprised of electronic circuits etched onto its surface. These circuits consist of transistors, resistors, and capacitors, meticulously arranged to perform specificfunctions. The most common type of microchip is thesilicon-based semiconductor, owing to its abundance, reliability, and cost-effectiveness.Functionality:Microchips serve as the brain of electronic devices, executing a multitude of tasks with remarkable speed and precision. They process data, perform calculations, store information, and facilitate communication between different components. Depending on their design and complexity, microchips can range from simple logic gates to sophisticated microprocessors capable of powering complex computing systems.Types of Microchips:Microchips can be categorized into several types based on their function and application:1. Microcontrollers: These chips integrate a CPU, memory, and input/output peripherals onto a singlesubstrate. They are commonly used in embedded systems, such as household appliances, automotive electronics, and industrial machinery.2. Memory Chips: Memory chips store data temporarily (RAM) or permanently (ROM) for quick access and retrieval by the processor. Examples include Dynamic Random Access Memory (DRAM), Static Random Access Memory (SRAM), and Flash Memory.3. Application-Specific Integrated Circuits (ASICs): ASICs are customized microchips designed to performspecific functions tailored to a particular application. They are prevalent in specialized fields such as telecommunications, aerospace, and medical imaging.4. Graphics Processing Units (GPUs): GPUs are specialized microchips optimized for rendering images and graphics-intensive tasks. They are essential components in gaming consoles, high-performance computing, and visual simulations.Significance:The significance of microchips in today's society cannot be overstated. They form the backbone of the digital revolution, driving innovation across various industries and transforming the way we live, work, and communicate. From improving healthcare diagnostics to enabling autonomous vehicles, microchips continue to push the boundaries of what is possible in the realm of technology.Future Trends:As technology advances, the demand for faster, smaller, and more energy-efficient microchips continues to grow. Emerging trends such as quantum computing, neuromorphic computing, and 5G networking present new opportunities and challenges for chip designers and manufacturers. The future of microchips holds promise for even greater integration, performance, and connectivity, paving the way for a more interconnected and intelligent world.Conclusion:In conclusion, microchips are indispensable components that underpin the functionality of modern electronic devices. Their versatility, efficiency, and scalability make them indispensable tools for driving innovation and shaping the future of technology. As we continue to push the boundaries of what is possible, microchips will undoubtedly remain at the forefront of technological advancement, powering the innovations of tomorrow.。
MEMORY存储芯片MT29F32G08ABCABH1-10 A中文规格书
READ PARAMETER PAGE (ECh)The READ PARAMETER PAGE (ECh) command is used to read the ONFI parameter pageprogrammed into the target. This command is accepted by the target only when all die(LUNs) on the target are idle.Writing ECh to the command register puts the target in read parameter page mode. Thetarget stays in this mode until another valid command is issued.When the ECh command is followed by an 00h address cycle, the target goes busy for t R.If the READ STATUS (70h) command is used to monitor for command completion, theREAD MODE (00h) command must be used to re-enable data output mode. Use of theREAD STATUS ENHANCED (78h) command is prohibited while the target is busy andduring data output.After t R completes, the host enables data output mode to read the parameter page.When the asynchronous interface is active, one data byte is output per RE# toggle.When the synchronous interface is active, one data byte is output for each rising or fall-ing edge of DQS.A minimum of three copies of the parameter page are stored in the device. Each param-eter page is 256 bytes. If desired, the CHANGE READ COLUMN (05h-E0h) commandcan be used to change the location of data output. Use of the CHANGE READ COLUMNENHANCED (06h-E0h) command is prohibited.The READ PARAMETER PAGE (ECh) output data can be used by the host to configure itsinternal settings to properly use the NAND Flash device. Parameter page data is staticper part, however the value can be changed through the product cycle of NAND Flash.The host should interpret the data and configure itself accordingly.Figure 36: READ PARAMETER (ECh) OperationCycle type DQ[7:0]R/B#Parameter Page Data Structure Tables Table 8: Parameter Page Data Structure。
MEMORY存储芯片UJA1169TK-X-FZ中文规格书
1.General descriptionThe UJA1169 is a mini high-speed CAN System Basis Chip (SBC) containing anISO11898-2:201x (upcoming merged ISO11898-2/5/6) compliant HS-CAN transceiverand an integrated 5 V or 3.3V 250 mA scalable supply (V1) for a microcontroller and/orother loads. It also features a watchdog and a Serial Peripheral Interface(SPI). TheUJA1169 can be operated in very low-current Standby and Sleep modes with bus andlocal wake-up capability.The UJA1169 comes in six variants. The UJA1169TK, UJA1169TK/F, UJA1169TK/X andUJA1169TK/X/F contain a 5V regulator (V1). V1 is a 3.3V regulator in the UJA1169TK/3and the UJA1169TK/F/3.The UJA1169TK, UJA1169TK/F, UJA1169TK/3 and UJA1169TK/F/3 variants feature asecond on-board 5V regulator (V2) that supplies the internal CAN transceiver and canalso be used to supply additional on-board hardware.The UJA1169TK/X and UJA1169TK/X/F are equipped with a 5V supply (VEXT) foroff-board components. VEXT is short-circuit proof to the battery, ground and negativevoltages. The integrated CAN transceiver is supplied internally via V1, in parallel with themicrocontroller.The UJA1169xx/F variants support ISO11898-6:2013 and ISO11898-2:201x compliantCAN partial networking with a selective wake-up function incorporating CAN FD-passive.CAN FD-passive is a feature that allows CAN FD bus traffic to be ignored inSleep/Standby mode. CAN FD-passive partial networking is the perfect fit for networksthat support both CAN FD and classic CAN communications. It allows normal CANcontrollers that do not need to communicate CAN FD messages to remain in partialnetworking Sleep/Standby mode during CAN FD communication without generating buserrors.The UJA1169 implements the standard CAN physical layer as defined in the currentISO11898 standard (-2:2003, -5:2007, -6:2013). Pending the release of the upcomingversion of ISO11898-2:201x including CAN FD, additional timing parameters defining loopdelay symmetry are included. This implementation enables reliable communication in theCAN FD fast phase at data rates up to 2 Mbit/s.A dedicated LIMP output pin is provided to flag system failures.A number of configuration settings are stored in non-volatile memory. This arrangementmakes it possible to configure the power-on and limp-home behavior of the UJA1169 tomeet the requirements of different applications.7.1.1.7Forced Normal mode7.1.1.8Hardware characterization for the UJA1169 operating modes[1]When the SBC switches from Reset, Standby or Normal mode to Off mode in the 5V variants, V1 behaves as a current source during power down while V BAT is falling from V th(det)pof down to 2V (RAM retention feature; see Section 7.5.1).[2]Determined by bits V2C/VEXTC and V2SUC/VEXTSUC (see Table 12)[3]Limited register access: Main status register, Watchdog status register, Identification register and non-volatile memory only.[4]Window mode is only active in Normal mode.Table 4.Hardware characterization by functional block BlockOperating mode Off Forced Normal Standby Normal Sleep Reset Overtemp V1off [1]on ononoffonoffVEXT/V2off on [2][2][2][2]VEXT/V2 off RSTN LOW HIGH HIGH HIGH LOW LOW LOW SPI disabled active [3]activeactivedisableddisableddisabled Watchdogoffoffdetermined by bits WMC (see Table 8)[4]determined by bits WMC determined by bits WMC [4]off offCAN off Active OfflineActive/ Offline/ Listen-only(determined by bits CMC; see Table 15)OfflineOfflineoffRXD V1 level CAN bit streamV1 level/LOW if wake-up detected CAN bit stream if CMC =01/10/11; otherwise same asStandby/Sleep V1 level/LOW if wake-up detected V1 level/LOW if wake-updetected V1level/LOW if wake-up detected7.1.2System control registers7.1.2.1Mode control register (0x01)The operating mode is selected via bits MC in the Mode control register. The Mode control register is accessed via SPI address 0x01 (see Section7.15).Table 5.Mode control register (address 01h)Bit Symbol Access Value Description7:3reserved R-2:0MC R/W mode control:001Sleep mode100Standby mode111Normal mode7.1.2.2Main status register (0x03)The Main status register can be accessed to monitor the status of the overtemperaturewarning flag and to determine whether the UJA1169 has entered Normal mode after initial power-up. It also indicates the source of the most recent reset event.Table 6.Main status register (address 03h)Bit Symbol Access Value Description7reserved R-6OTWS R overtemperature warning status:0IC temperature below overtemperature warning threshold1IC temperature above overtemperature warning threshold 5NMS R Normal mode status:0UJA1169 has entered Normal mode (after power-up)1UJA1169 has powered up but has not yet switched toNormal mode4:0RSS R reset source status:00000left Off mode (power-on)00001CAN wake-up in Sleep mode00100wake-up via WAKE pin in Sleep mode01100watchdog overflow in Sleep mode (Timeout mode)01101diagnostic wake-up in Sleep mode01110watchdog triggered too early (Window mode)01111watchdog overflow (Window mode or Timeout mode withWDF=1)10000illegal watchdog mode control access10001RSTN pulled down externally10010left Overtemp mode10011V1 undervoltage10100illegal Sleep mode command received10110wake-up from Sleep mode due to a frame detect errorThe default value of V2C at power-on is defined by bits V2SUC in non-volatile memory (see Section 7.11). The actual status of V2 can be polled from the Supply voltage status register (Table 13).7.5.4Voltage regulator VEXTIn the UJA1169TK/X and UJA1169TK/X/F, pin 13 is a voltage regulator output (VEXT) that can be used to supply off-board components, delivering up to 100mA. VEXT is protected against short-circuits to the battery and negative voltages. Since the CAN controller is supplied internally via V1, the full 100 mA supply current is available for off-board loads connected to VEXT (provided the thermal limits of the PCB are not exceeded). VEXT is software controlled and must be turned on (via bit VEXTC in the Regulator control register; see Table 12) to activate the supply voltage for off-board components.The default value of VEXTC at power-on is defined by bits VEXTSUC in non-volatile memory (see Section 7.11). The status of VEXT can be read from the Supply voltage status register (Table 13).7.5.5Regulator control register (0x10)[1]UJA1169TK, UJA1169TK/3, UJA1169TK/F and UJA1169TK/F/3: default value at power-up defined by V2SUC bit setting (see Table 11).[2]UJA1169TK/X and UJA1169TK/X/F: default value at power-up defined by VEXTSUC bit setting (see Table 11).[3]5V variants only; default value at power-up defined by setting of bits V1RTSUC (see Table 9). The threshold is fixed at 90% in the 3.3V variants and V1RTC always reads 00 (regardless of the value written to V1RTC or the start-up threshold defined by V1RTSUC).Table 12.Regulator control register (address 10h)Bit Symbol Access Value Description7reserved R -6PDCR/Wpower distribution control:0V1 threshold current for activating the external PNP transistor, load current rising; I th(act)PNP (higher value; see Table 52)V1 threshold current for deactivating the external PNP transistor, load current falling; I th(deact)PNP (higher value; see Table 52)1V1 threshold current for activating the external PNP transistor; load current rising; I th(act)PNP (lower value; see Table 52)V1 threshold current for deactivating the external PNP transistor; load current falling; I th(deact)PNP (lower value; see Table 52)5:4reserved R -reserved bits can be read and overwritten without affecting device functionality; default value at power-up is 00 (other reserved bits always return 0)3:2V2C [1]VEXTC [2]R/WV2/VEXT configuration:00V2/VEXT off in all modes 01V2/VEXT on in Normal mode10V2/VEXT on in Normal, Standby and Reset modes 11V2/VEXT on in Normal, Standby, Sleep and Reset modes 1:0V1RTC [3]R/Wset V1 reset threshold:00reset threshold set to 90% of V1 nominal output voltage 01reset threshold set to 80% of V1 nominal output voltage 10reset threshold set to 70% of V1 nominal output voltage 11reset threshold set to 60% of V1 nominal output voltage7.5.6Supply voltage status register (0x1B)[1]UJA1169TK, UJA1169TK/3, UJA1169TK/F and UJA1169TK/F/3 only.[2]UJA1169TK/X and UJA1169TK/X/F only.[3]Default value at power-up.7.6LIMP outputThe dedicated LIMP pin can be used to enable so called ‘limp home’ hardware in the event of a serious ECU failure. Detectable failure conditions include SBC overtemperature events, loss of watchdog service, short-circuits on pins RSTN or V1 and user-initiated or external reset events (see Figure 7). The LIMP pin is a battery-robust, active-LOW, open-drain output. The LIMP pin can also be forced LOW by setting bit LHC in the Fail-safe control register (Table 14).7.6.1Reset counterThe UJA1169 uses a reset counter to detect serious failures. The reset counter isincremented (bits RCC =RCC +1; see Table 14) every time the SBC enters Reset mode. When the system is running correctly, it is expected that the system software will reset this counter (RCC =00) periodically to ensure that routinely expected reset events do not cause it to overflow.If RCC is equal to 3 when the SBC enters Reset mode, the SBC assumes that a serious failure has occurred and sets the limp-home control bit, LHC. This action forces theexternal LIMP pin LOW with RCC overflowing to RCC =0. Bit LHC can also be set via the SPI interface.The LIMP pin is set floating again if LHC is reset to 0 through software control or at power-up when the SBC leaves Off mode.The application software can preset the counter value to define how many reset events are tolerated before the limp-home function is activated. If RCC is initialized to 3, forexample, the next reset event will immediately trigger the limp-home function. The default counter setting at power-up is RCC =00.Besides a reset counter (RCC) overflow, the following events cause bit LHC to be set and immediately trigger the limp-home function:•overtemperature lasting longer than t d(limp)Table 13.Supply voltage status register (address 1Bh)Bit Symbol Access Value Description 7:3reserved R -2:1V2S [1]VEXTS [2]R/WV2/VEXT status:00[3]V2/VEXT voltage ok01V2/VEXT output voltage below undervoltage threshold 10V2/VEXT output voltage above overvoltage threshold 11V2/VEXT disabled 0V1SR/WV1 status:0[3]V1 output voltage above 90% undervoltage threshold 1V1 output voltage below 90% undervoltage threshold。
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Categories and Subject Descriptors
B.3.0 [Memory Structures]: General.
adaptive architectures, low power, embedded CAD, binary tree, memory design, embedded systems. Profiling an application executing on a microprocessor is a technique needed to solve a wide variety of optimization problems. In the domain of computing, profiling generally means to determine the relative frequency of code regions of interest as a program executes, ranging from fine-grained items like individual statements or basic blocks, to coarser-grained items such as loops or subroutines. The term has also been used to refer to determining the relative frequencies of values that a variable takes on during program execution. Profiling appears as part of the solution for a tremendous variety of program and hardware optimization and design automation problems. For example, profiling has long been used to find the most frequently executed subroutines of an application, so that a programmer might focus on optimizing those subroutines [10]. Profiling has been used in compilers to map frequently executed code and data to non-interfering cache regions [15] to improve performance. The approach in [8] proposes using
Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. DAC 2002, June 10-14, 2002, New Orleans, Louisiana, USA. Copyright 2002 ACM 1-58113-461-4/02/0006…$5.00.
*Also with the Center for Embedded Computer Systemofiling an application executing on a microprocessor is part of the solution to numerous software and hardware optimization and design automation problems. Most current profiling techniques suffer from runtime overhead, inaccuracy, or slowness, and the traditional non-intrusive method of using a logic analyzer doesn’t work for today’s system-on-a-chip having embedded cores. We introduce a novel on-chip memory architecture that overcomes these limitations. The architecture, which we call ProMem, is based on a pipelined binary tree structure. It achieves single-cycle throughput, so it can keep up with today’s fastest pipelined processors. It can also be laid out efficiently and scales very well, becoming more efficient the larger it gets. The memory can be used in a wide-variety of common profiling situations, such as instruction profiling, value profiling, and network traffic profiling, which in turn can be used to guide numerous design automation tasks.
3.2
A Fast On-Chip Profiler Memory
Roman Lysecky, Susan Cotterell, Frank Vahid*
Department of Computer Science and Engineering University of California, Riverside {rlysecky, susanc, vahid}@, /~vahid
General Terms: Performance, Design. Keywords: Profiling, system-on-a-chip, platform tuning, 1. INTRODUCTION
profiling to generate alternate subroutine versions for common cases, with the program then using run-time profiling to pick the best version. Likewise, the approach in [14] uses profiling information to synthesize hardware optimized to the most common situations. Dynamic binary translation methods profile in order to store the translation results of frequent code regions, for improved performance as well as power [13], while dynamic optimization methods search for the hottest blocks for runtime recompilation [3]. The approaches in [4][9] use profiling to detect frequent loops to map to a special address region that an architecture would then map to a small low-power loop cache, while the approach in [12] compresses those regions to reduce memory traffic and hence power. The approach in [6] profiles values of variables or subroutine parameters to detect pseudo-constants that can aid a compiler in optimizing for performance, or even for reduced energy [7]. Most previous profiling approaches, being intended for desktop computing systems, introduce runtime overhead. In particular, either they insert additional code into the application binary, or they interrupt the processor at particular intervals to sample the processor’s registers. However, for embedded systems, runtime overhead is often not acceptable, since very tight real-time constraints must be met. Thus, embedded system designers in the past relied on logic analyzers to non-intrusively profile an executing application – though even this was cumbersome and hence not a common feature in design automation techniques. The trend of increasing chip transistor capacity has led to systems-on-a-chip (SOCs). While providing tremendous advantages in terms of cost, size, performance and power, SOCs have the drawback of low accessibility to the internal components. Thus, logic analyzer probes cannot be connected to arbitrary buses inside the SOC to achieve profiling. Although SOCs typically come with means for accessing internal registers through external pins (e.g., using the JTAG standard [11]), such access is accomplished by stopping normal application execution and then serially scanning the register contents in or out. This access approach incurs large runtime overhead, being intended for test and debug purposes rather than profiling. Fortunately, the same transistor capacity trend that has led to SOCs has enabled hardware-based approaches to profiling. While on-chip profiling hardware in the past has been limited to highvolume high-performance microprocessors, such hardware can today be added to embedded system prototyping platforms. Platforms [16][18] are predesigned SOCs targeted to particular application domains, like set-top boxes, network switches, digital cameras, etc. While some platforms are oriented towards implementation in actual products, others are intended specifically for prototyping. These prototype-oriented platforms are intentionally designed larger than necessary, to accommodate the widest possible range of applications. Thus, adding a relatively small amount of hardware would likely not be an issue, especially since such platforms are specifically designed for use during the design stage, when profiling would be most needed.