S1170 Datasheet

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AMS1117-ADJ DATASHEET原厂规格书

1A Adjustable/Fixed Low Dropout Linear Regulator- Low dropout voltage- Load regulation: 0.2% typical - Optimized for Low V oltage - On-chip thermal limiting- Standard SOT-223 and TO-252 packages- Three-terminal adjustable or fixed low dropout 1.2V ,1.5V ,1.8V , 2.5V , 2.85V , 3.3V , 5V . Regulators- Active SCSI terminators- High efficiency linear regulators- Post regulators for switching supplies - Battery chargers- 12V to 5V linear regulators - M otherboard clock suppliesThe AMS 1117-ADJ and AMS 1117-1.2,-1.5,-1.8,-2.5,-2.85, -3.3 and-5 are low dropout three-terminal regulators with 1A output current capability. These devices have been optimized for low voltage where transient response and minimum input voltage are critical. The 2.85V version is designed specifically to be used in Active Terminators for SCSI bus.On-chip thermal limiting provides protection against any combination of overload and ambient temperatures that would create excessive junction temperatures.Unlike PNP type regulators where up to 10% of the output current is wasted as quiescent current, the quiescent cur-rent of the AMS 1117 flows into the load, increasing effi-ciency.The AMS 1117 series regulators are available in the indus-try-standard SOT-223 and TO-252 power packages.Key FeaturesApplicationsGeneral DescriptionTypical ApplicationNotice: The distance between V out pin and Capacitor should not exceed 4cm for excellent performanceFigure 1. Typical Applications of AMS 11171A Adjustable/Fixed Low Dropout Linear RegulatorPin Assignments*With package soldered to 0.5 square inch copper area over backside ground plane or internal power plane, ΘJA can vary from 30°C/W to more than 50°C/W. Other mounting techniques may provide better thermal resistance than 30°C/W.Absolute Maximum RatingsFigure 2. Pin Assignments of AMS 1117ParameterMin.Max.UnitV IN 18 V(V IN – V OUT ) * I OUTSee Figure 3Operating Junction Temperature Range -20 125°C Storage Temperature Range-65150°C Lead Temperature (Soldering, 10 sec.) 300°C1A Adjustable/Fixed Low Dropout Linear RegulatorTypicals and limits appearing in normal type apply for T J =25℃.Limits appearing in Boldface type apply over the entire junction temperature for operation, -20℃to 125℃.Electrical CharacteristicBlock DiagramThermal LimitCurrent LimitV OUTV INSubstrateGND (fixed output) ADJ. (adjustable output)Figure 3. Block Diagram of AMS 1117SymbolParameterConditionsMin (Note 2) Typ (Note 1) Max(Note 2)UnitsV REFReference VoltageAMS 11171.5V<=(V IN -V OUT )<=7V,10mA<=I OUT <=1A1.225 1.250 1.275 VV OUT OutputVoltage 10mA<=I OUT <=1AI OUT = 10mA, V IN = 3.2V AMS 1117-1.2 ,2.7V<= V IN <=8.2V 1.176 1.152 1.200 1.200 1.224 1.248 V AMS 1117-1.5 ,3.0V<= V IN <=8.5V1.4701.5001.530VAMS 1117-1.8 ,3.3V<= V IN <=8.8V 1.764 1.800 1.836 VAMS 1117-2.5 ,4V<= V IN <= 9.5V 2.450 2.500 2.550 V AMS 1117-2.85 , 4.35V <= V IN <= 9.85V 2.793 2.850 2.907 V AMS 1117-3.3 , 4.8V<= V IN <=10.3V 3.234 3.300 3.366 V AMS 1117-5.0,6.5V<=V IN <= 12V4.9005.0005.100V1A Adjustable/Fixed Low Dropout Linear RegulatorTypicals and limits appearing in normal type apply for T J =25℃.Limits appearing in Boldface type apply over the entire junction temperature for operation, -20℃ to 125℃.Electrical Characteristic(Continued)SymbolParameter ConditionsMin (Note 2)Typ (Note 1) Max (Note 2) Units △V OUTLine Regultion (Note 3)I OUT =10mA ,(V OUT +1.5V)<=V IN <=12V 0.035 0.2 % Load Regultion (Note 3) V IN -V OUT =2V,10mA<= I OUT <=1A,0.2 0.7 % AMS 1117-1.2V IN -V OUT =2V,10mA<= I OUT <=1A,0.2 1 % V IN -V OUTDropout Volage I OUT =1A,△V REF =1% 1.100 1.250 V I LimitCurrent Limit V IN -V OUT = 2V, T J =25℃1.1 1.5A Minimum Load Current (Note 4) AMS 1117-ADJ1.5V<=(V IN -V OUT )<=10V10mA Quiescent CurentV IN =V OUT +1.25V 5 13 mA Thermal Regulation T A = 25°C, 30ms pulse 0.01 0.1 %/W RippleRejection f=120Hz,V IN -V OUT =3V, V Ripple =1V PP60 72 dB Adjust Pin Current50120µAAdjust Pin CurrentChange 1.5V<=V IN -V OUT <=7V, 10mA<=I OUT <=1A0.2 5 µATemperature Stability0.5 % Long Term StabilityT A = 125°C, 1000hrs.0.3%1A Adjustable/Fixed Low Dropout Linear RegulatorNote 1: Typical Values represent the most likely parametric norm. Note 2: All limits are guaranteed by testing or statistical analysis.Note 3: Load and line regulation are measured at constant junction room temperature. Note 4: The minimum output current required to maintain regulation.Typical Performance CharacteristicsTypicals and limits appearing in normal type apply for T J =25℃.Limits appearing in Boldface type apply over the entire junction temperature for operation, -20℃to 125℃.Electrical Characteristic(Continued)Symbol ParameterConditionsMin (Note 2) Typ (Note 1) Max (Note 2)UnitsI LimitRMS Output Noise(% ofV OUT )T A = 25°C, 10Hz<= f <=10kHz0.003 % Thermal Resistance, Junctionto CaseSOT-223 15 ℃/W TO-252 3 ℃/W Thermal Shutdown Junction Temperature155 ℃ Thermal Shutdown Hysteresis25℃Output Current ( A )0 0.2 0.4 0.6 0.8 1.01.5 1.4 1.3 1.2 1.0 0.9 0.8 0.7 0.6 0.5 0D r o p o u t V o l t a g e ( V )Figure 4. Dropout Voltage VS. Output Current1A Adjustable/Fixed Low Dropout Linear RegulatorTypical Performance Characteristics(Continued)Figure 6. Output Voltage VS. TemperatureO u t p u t V o l t a g e ( V )3.70 3.65 3.603.553.50 3.45 3.40 3.35 3.30 3.253.20Junction Temperature ( ℃ )-75 –50 –25 0 25 50 75 100 125 150 175Figure 5. Reference Voltage VS. TemperatureR e f e r e n c e V o l t a g e ( V )0.260 1.255 1.250 1.245 1.240 1.235 1.225 1.220 1.215 1.210Junction Temperature ( ℃ )-75 –50 –25 0 25 50 75 100 125 150 175Figure 7. Minimum Load Current VS. TemperatureM i n i m u m L o a d C u r r e n t ( m A )5 4 3 2 1Junction Temperature ( ℃ ) -75 –50 –25 0 25 50 75 100 125 150 175Figure 8. ADJ Pin Current VS. TemperatureA D J P i n C u r r e n t ( µA ) 100 90 807060 50 40 30 20 10 0Junction Temperature ( ℃ ) -75 –50 –25 0 25 50 75 100 125 150 175Note:AMS 1117 OnlyAMS11171AAdjustable/Fixed Low Dropout Linear RegulatorMechanical Dimensions4-Lead SOT-223 PackageSymbolInches Millimeters NotesMin.Max.Min. Max.A Ñ .071 Ñ 1.80 A1 Ñ .181 Ñ 4.80B .025 .033 .064 .840 c Ñ 0.90 Ñ 2.29 D .248 .264 6.30 6.71 E .130 .148 3.30 3.71 e .115 .124 2.95 3.15 F .033 .041 .840 1.04 H .264 .287 6.71 7.29 I .0121 Ñ .310 Ñ J Ñ 10° Ñ 10° K 10° 16° 10° 16° L.0008 .0040 .0203 .1018 M 10° 16° 10° 16° N.010.014.250.360Figure 9. 4-Lead SOT-223 Package1A Adjustable/Fixed Low Dropout Linear RegulatorMechanical Dimensions(Continued)3-Lead TO-252 PackageNotes:1. Dimensions are exclusive of mold flash, metal burrsor interlead protrusion.2. Stand off-height is measured from lead tip with ref. toDatum –B-.3. Foot length is measured with ref. to Datum –A– withlead surface. 4. Thermal pad contour optional within dimension b3 and L3.5. Formed leads to be planar with respect to one anotherat seating place –C-.6. Dimensions and tolerances.SymbolInchesMillimetersNotesMin. Max.Min. Max.A .086 .094 2.19 2.39 b .025 .035 0.64 0.89 b2 .030 .045 0.76 1.14 b3 .205 .215 5.12 5.46 4 c .018 .024 0.46 0.61 c2 .018 .023 0.46 0.58 D .210 .245 5.33 6.22 1E .250 .265 6.35 6.73 1e .090 BSC 2.29 BSCH .370 .410 9.40 10.41 L .055 .070 1.40 1.78 3 L1 .108 REF 2.74 REFL3 .035 .080 0.89 2.03 4 L4.025.0400.641.02Figure 10. 3-Lead TO-252 Package1A Adjustable/Fixed Low Dropout Linear R egulatorAdvanced Monolithic Systems The " " logo is a registered trademark of Advanced Monolithic Systems.All other company and product names are trademarks of their respective ownersOrdering InformationPackage Temperature Range Part Number Output Voltage Packing Marking Transport MediaSOT －223－２０℃ - +125℃ AMS 1117-1.2 1.2V AMS 1117 1.2 2.5K Tape and Reel －２０℃ - +125℃ AMS 1117-1.5 1.5V AMS 1117 1.5 2.5K Tape and Reel -20℃ - +125℃ AMS 1117-1.8 1.8V AMS 1117 1.8 2.5K Tape and Reel-20℃ - +125℃ AMS 1117-2.5 2.5V AMS 1117 2.5 2.5K Tape and Reel -20℃ - +125℃ AMS 1117-2.85 2.85V AMS 1117 2.8 2.5K Tape and Reel -20℃ - +125℃ AMS 1117-3.3 3.3V AMS 1117 3.3 2.5K Tape and Reel -20℃ - +125℃ AMS 1117-5 5V AMS 1117 5 2.5K Tape and Reel -20℃ - +125℃ AMS 1117 Adjust AMS 1117 2.5K Tape and Reel TO －252-20℃ - +125℃ AMS 1117-1.2 1.2V AMS 1117 1.2 2.5K Tape and Reel -20℃ - +125℃ AMS 1117-1.5 1.5V AMS 1117 1.5 2.5K Tape and Reel -20℃ - +125℃ AMS 1117-1.8 1.8V AMS 1117 1.8 2.5K Tape and Reel-20℃ - +125℃ AMS 1117-2.5 2.5V AMS 1117 2.5 2.5K Tape and Reel -20℃ - +125℃ AMS 1117-2.85 2.85V AMS 1117 2.8 2.5K Tape and Reel -20℃ - +125℃ AMS 1117-3.3 3.3V AMS 1117 3.3 2.5K Tape and Reel -20℃ - +125℃ AMS 1117-5 5.0V AMS 1117 5 2.5K Tape and Reel -20℃ - +125℃ AMS 1117CD Adjust AMS 1117CD 2.5K Tape and ReelDisclaimer:• AMS reserves the right to make changes to the information herein for the improvement of the design and performancewithout further notice! Customers should obtain the latest relevant information before placing orders and should verify that such information is complete and current.• All semiconductor products malfunction or fail with some probability under special conditions. When using AMS productsin system design or complete machine manufacturing, it is the responsibility of the buyer to comply with the safety standards strictly and take essential measures to avoid situations in which a malfunction or failure of such AMS products could cause loss of body injury or damage to property.• AMS will supply the best possible product for customers!。

压敏电阻突波吸收器--S10K14AUTO 规格书 datasheet

ConstructionI Round varistor element, leadedI Coating: epoxy resin (D1: phenolic resin),flame-retardant to UL 94 V-0I Terminals: tinned copper wire FeaturesI High energy absorption,particularly in case of load dump I Jump-start strengthI Stable protection level, minimum leakage current I High resistance to cyclic temperature stress I PSpice modelsITypes for T A = 125 °CTapingI All types available on tape upon requestType designationDetailed description of coding system on page 39, chapter “General Technical Information ”General technical data Climatic category LCT UCTDamp heat, steady state (93 % r.h., 40 °C)40/85/56 (D1: 40/125/56)– 40 °C+ 85 °C (D1: + 125 °C)56 daysin accordance with IEC 60068-1in accordance with IEC 60068-2-3Operating temperature – 40 … + 85 °C (D1: … + 125 °C)in accordance with CECC 42 000Storage temperature – 40 … + 125 °C (D1: … + 150 °C)Electric strength ³ 2,5 kV RMS (not D1)in accordance with CECC 42 000Insulation resistance ³ 10 M W (not D1)in accordance with CECC 42 000Response time< 25 nsSIOV-S 14 K 14 AUTODesignRated diameter of varistor disk Automotive varistor Max. AC operating voltage Tolerance of varistor voltageEPCOS metal oxide varistor Leaded Varistors Automotive SeriesC for S (1)V RMSV141414141414171717253030If the maximum loads specified for load dump and jump start are fully utilized, subsequentpolarity reversal of the AUTO varistors is inadmissible.If the load remains under the maximum ratings, polarity reversal may be admissible.Contact EPCOS for consultancy on this kind of problem.Load dump or jump start can decrease the varistor voltage in load direction by max. 15 %.1)Measured in load directionv(1 mA)Max. clamping voltage v V 10431043 1043 1043 1043 1043 1053 1053 1053 1077 1093 1093±mm b max mm 9,0 13,0 12,0 17,0 16,0 23,0 13,0 17,04max.Herausgegeben von EPCOS AGUnternehmenskommunikation, Postfach 801709, 81617 München, DEUTSCHLAND( ++49 89 636 09, FAX (089) 636-2 2689EPCOS AG 2002. Vervielfältigung, Veröffentlichung, Verbreitung und Verwertung dieser Broschüre und ihres Inhalts ohne aus-drückliche Genehmigung der EPCOS AG nicht gestattet.Bestellungen unterliegen den vom ZVEI empfohlenen Allgemeinen Lieferbedingungen für Erzeugnisse und Leistungen der Elek-troindustrie, soweit nichts anderes vereinbart wird.Diese Broschüre ersetzt die vorige Ausgabe.Fragen über Technik, Preise und Liefermöglichkeiten richten Sie bitte an den Ihnen nächstgelegenen Vertrieb der EPCOS AG oder an unsere Vertriebsgesellschaften im Ausland. Bauelemente können aufgrund technischer Erfordernisse Gefahrstoffe ent-halten. Auskünfte darüber bitten wir unter Angabe des betreffenden Typs ebenfalls über die zuständige Vertriebsgesellschaft ein-zuholen.Published by EPCOS AGCorporate Communications, P.O. Box 80 17 09, 81617 Munich, GERMANY( ++49 89 636 09, FAX (089) 636-2 2689EPCOS AG 2002. Reproduction, publication and dissemination of this brochure and the information contained therein without EPCOS’ prior express consent is prohibited.Purchase orders are subject to the General Conditions for the Supply of Products and Services of the Electrical and Electronics Industry recommended by the ZVEI (German Electrical and Electronic Manufacturers’ Association), unless otherwise agreed. This brochure replaces the previous edition.For questions on technology, prices and delivery please contact the Sales Offices of EPCOS AG or the international Representa-tives.Due to technical requirements components may contain dangerous substances. For information on the type in question please also contact one of our Sales Offices.。

S-1170中文资料

元器件交易网
Rev.3.0_02
HIGH RIPPLE-REJECTION AND LOW DROPOUT HIGH OUTPUT CURRENT CMOS VOLTAGE REGULATOR
S-1170 Series
The S-1170 Series is a positive voltage regulator with a low dropout voltage, high output voltage accuracy, and low current consumption developed based on CMOS technology. A built-in low on-resistance transistor provides a low dropout voltage and large output current, a built-in overcurrent protector prevents the load current from exceeding the current capacitance of the output transistor, and a built-in thermal shutdown circuit prevents damage caused by the heat. An ON/OFF circuit ensures a long battery life. Compared with the voltage regulators using the conventional CMOS process, a larger variety of capacitors are available, including small ceramic capacitors. Small SOT-89-5 and 6-Pin HSON(A) packages realize high-density mounting.

英飞凌 FF225R65T3E3 XHP 3 模块数据表

XHP ™3 模块采用第三代沟槽栅/场终止IGBT3和第三代发射极控制二极管特性•电气特性-V CES = 6500 V-I C nom = 225 A / I CRM = 450 A -高动态稳定性-低 V CEsat -沟槽栅IGBT3•机械特性-封装的 CTI > 600-加强绝缘封装，10.4kV 交流 60 秒-碳化硅铝 (AlSiC) 基板提供更高的温度循环能力-扩大存储温度范围至 T stg = -55°C -高爬电距离和电气间隙-外壳材料符合EN45545-2 “铁路车辆防火”标准中的 R23 (HL3) 等级可选应用•牵引变流器•中压变流器产品认证•根据 IEC 60747、60749 和 60068标准的相关测试，符合工业应用的要求。

描述FF225R65T3E3XHP ™3 模块内容描述 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1特性 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1可选应用 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1产品认证 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1内容 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 1封装 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 2IGBT, 逆变器 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 3二极管,逆变器 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 4特征参数图表 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 5电路拓扑图 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 6封装尺寸 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 7模块标签代码 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12修订历史 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13免责声明 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .141封装表 1绝缘参数特征参数代号标注或测试条件数值单位绝缘测试电压V ISOL RMS, f = 50 Hz, t = 60 s10.4kV 局部放电熄弧电压V isol RMS, f = 50 Hz, Q PD typ. 10 pC 5.1kV DC 稳定性V CE(D)T vj=25°C, 100 Fit3800V 模块基板材料AlSiC爬电距离d Creep端子至散热器53.0mm 爬电距离d Creep端子至端子53.0mm 电气间隙d Clear端子至散热器36.0mm 电气间隙d Clear端子至端子26.0mm 相对电痕指数CTI > 600表 2特征值特征参数代号标注或测试条件数值单位最小值典型值最大值杂散电感,模块L sCE25nH 模块引线电阻,端子-芯片R AA'+CC'T C=25°C, 每个开关0.33mΩ模块引线电阻,端子-芯片R CC'+EE'T C=25°C, 每个开关0.42mΩ储存温度T stg-55125°C 模块安装的安装扭距M根据相应的应用手册进行安装M6, 螺丝 4.25 5.75Nm端子安装扭矩M根据相应的应用手册进行安装M3, 螺丝0.9 1.1Nm M8, 螺丝810重量G700g 2IGBT, 逆变器表 3最大标定值特征参数代号标注或测试条件数值单位集电极－发射极电压V CES T vj = -50 °C5900VT vj = 125 °C6500连续集电极直流电流I CDC T vj max = 125 °C T C = 80 °C225A 集电极重复峰值电流I CRM t p受限于 T vj op450A 栅极－发射极峰值电压V GES±20V表 4特征值特征参数代号标注或测试条件数值单位最小值典型值最大值集电极－发射极饱和电压V CE sat I C = 225 A, V GE = 15 V T vj = 25 °C 3.00 3.40VT vj = 125 °C 3.70 4.20栅极阈值电压V GEth I C = 33 mA, V CE = V GE, T vj = 25 °C 5.406 6.60V 栅极电荷Q G V GE = ±15 V, V CE = 3600 V10.5µC 内部栅极电阻R Gint T vj = 25 °C0.67Ω输入电容C ies f = 100 kHz, T vj = 25 °C, V CE = 25 V, V GE = 0 V65.6nF 反向传输电容C res f = 100 kHz, T vj = 25 °C, V CE = 25 V, V GE = 0 V1nF 集电极-发射极截止电流I CES V CE = 6500 V, V GE = 0 V T vj = 25 °C5mA 栅极-发射极漏电流I GES V CE = 0 V, V GE = 20 V, T vj = 25 °C400nA开通延迟时间(感性负载)t don I C = 225 A, V CE = 3600 V,V GE = ±15 V, R Gon = 4.7 ΩT vj = 25 °C0.240µs T vj = 125 °C0.240上升时间(感性负载)t r I C = 225 A, V CE = 3600 V,V GE = ±15 V, R Gon = 4.7 ΩT vj = 25 °C0.070µs T vj = 125 °C0.080关断延迟时间(感性负载)t doff I C = 225 A, V CE = 3600 V,V GE = ±15 V, R Goff = 22 ΩT vj = 25 °C 6.000µs T vj = 125 °C 6.400下降时间(感性负载)t f I C = 225 A, V CE = 3600 V,V GE = ±15 V, R Goff = 22 ΩT vj = 25 °C0.950µs T vj = 125 °C 2.000开通损耗能量 (每脉冲)E on I C = 225 A, V CE = 3600 V,Lσ = 85 nH, V GE = ±15 V,R Gon = 4.7 Ω, di/dt =2200 A/µs (T vj = 125 °C)T vj = 25 °C1230mJ T vj = 125 °C1710关断损耗能量 (每脉冲）E off I C = 225 A, V CE = 3600 V,Lσ = 85 nH, V GE = ±15 V,R Goff = 22 Ω, dv/dt =2100 V/µs (T vj = 125 °C)T vj = 25 °C875mJ T vj = 125 °C1170短路数据I SC V GE≤ 15 V, V CC = 4500 V,V CEmax=V CES-L sCE*di/dt t P≤ 10 µs,T vj=125 °C1300A结－外壳热阻R thJC每个 IGBT29.1K/kW 外壳－散热器热阻R thCH每个 IGBT21.3K/kW 允许开关的温度范围T vj op-50125°C3二极管,逆变器表 5最大标定值特征参数代号标注或测试条件数值单位反向重复峰值电压V RRM T vj = -50 °C5900VT vj = 125 °C6500连续正向直流电流I F225A 正向重复峰值电流I FRM t P = 1 ms450A I2t-值I2t t P = 10 ms, V R = 0 V T vj = 125 °C45.2kA²s 最大损耗功率P RQM T vj = 125 °C1000kW 最小开通时间t onmin10µs表 6特征值特征参数代号标注或测试条件数值单位最小值典型值最大值正向电压V F I F = 225 A, V GE = 0 V T vj = 25 °C 3.10 3.55VT vj = 125 °C 2.85 3.25反向恢复峰值电流I RM V R = 3600 V, I F = 225 A,V GE = -15 V, -di F/dt =2200 A/µs (T vj = 125 °C)T vj = 25 °C405A T vj = 125 °C365恢复电荷Q r V R = 3600 V, I F = 225 A,V GE = -15 V, -di F/dt =2200 A/µs (T vj = 125 °C)T vj = 25 °C255µC T vj = 125 °C505反向恢复损耗（每脉冲）E rec V R = 3600 V, I F = 225 A,V GE = -15 V, -di F/dt =2200 A/µs (T vj = 125 °C)T vj = 25 °C450mJ T vj = 125 °C1070结－外壳热阻R thJC每个二极管51.3K/kW 外壳－散热器热阻R thCH每个二极管24.2K/kW 允许开关的温度范围T vj op-50125°C5电路拓扑图Beispiel: PrimePACK-3+ CostdownCommon Collektorxx.03.2019 mit WW, Jürgen Esch36NTC 9,11,13T23,4D29651T1D187202.08.2021 Beispiel für A.Schulz10: NC图 1FF225R65T3E3XHP ™3 模块5 电路拓扑图6 封装尺寸6封装尺寸图 27 模块标签代码7模块标签代码图 3修订历史修订历史修订版本发布日期变更说明V1.02017-12-19Target datasheetV1.12018-04-17Target datasheetV2.02018-04-23Preliminary datasheetn/a2020-09-01Datasheet migrated to a new system with a new layout and new revisionnumber schema: target or preliminary datasheet = 0.xy; final datasheet =1.xy1.102020-12-111.112022-04-12Final datasheet商标所有参照产品或服务名称和商标均为其各自所有者的财产。

赛米控丹佛斯电子 SEMiX703GB12M7p 数据表

Rev. 3.0–23.09.20211SEMiX ®3pGBTrench IGBT ModulesSEMiX703GB12M7p Features*•Homogeneous Si•Trench = Trenchgate technology •V CE(sat) with positive temperature coefficient•High overload capability •Low loss high density IGBTs•Press-fit pins as auxiliary contacts •UL recognized, file no. E63532Typical Applications•AC inverter drives •UPS•Renewable energy systemsRemarks•Product reliability results are valid for T j =150°C (recommended T j,op =-40...+150°C)•V isol between temperature sensor and power section is only 2500V•For storage and case temperature with TIM see document “TP(*) SEMiX 3p”Absolute Maximum Ratings SymbolConditions Values UnitIGBT V CES T j =25°C 1200V I C T j =175°CT c =25°C 863A T c =80°C656A I Cnom 700A I CRM1400A V GES -20 (20)V t psc V CC =800V V GE ≤ 15V V CES ≤ 1200 VT j =150°C8µs T j -40...175°C Inverse diodeV RRM T j =25°C 1200V I F T j =175°CT c =25°C 796A T c =80°C593A I FRM 1400A I FSM t p =10ms, sin 180°, T j =25°C3456A T j -40...175°C Module I t(RMS)600A T stg module without TIM -40...125°C V isolAC sinus 50Hz, t =1min4000VCharacteristics SymbolConditionsmin.typ.max.UnitIGBT V CE(sat)I C =700A V GE =15V chiplevel T j =25°C 1.55 1.94V T j =150°C 1.81V V CE0chiplevel T j =25°C 0.860.96V T j =150°C 0.75V r CE V GE =15V chiplevelT j =25°C 0.99 1.41m ΩT j =150°C1.51m ΩV GE(th)V CE = 10 V, I C =69mA5.466.6V I CES V GE =0V,V CE =1200V, T j =25°C 5mA C ies V CE =10V V GE =0Vf =1MHz 132.0nF C oes f =1MHz 4.14nF C res f =1MHz1.62nF Q G V GE =-8V ... + 15V 6150nC R Gint T j =25°C 0.7Ωt d(on)V CC =600V I C =700AV GE =+15/-15V R G on =1.5ΩR G off =1.5Ωdi/dt on =5850A/µs di/dt off =5450A/µs dv/dt =5400V/µs L s =25nH T j =150°C 390ns t r T j =150°C 130ns E on T j =150°C 83mJ t d(off)T j =150°C 530ns t f T j =150°C 110ns E off T j =150°C 77mJR th(j-c)per IGBT0.058K/W R th(c-s)per IGBT (λgrease =0.81 W/(m*K))0.035K/W R th(c-s)per IGBT, pre-applied phase change material0.025K/W2Rev. 3.0–23.09.2021© by SEMIKRONSEMiX ®3pGBTrench IGBT ModulesSEMiX703GB12M7p Features*•Homogeneous Si•Trench = Trenchgate technology •V CE(sat) with positive temperature coefficient•High overload capability •Low loss high density IGBTs•Press-fit pins as auxiliary contacts •UL recognized, file no. E63532Typical Applications•AC inverter drives •UPS•Renewable energy systemsRemarks•Product reliability results are valid for T j =150°C (recommended T j,op =-40...+150°C)•V isol between temperature sensor and power section is only 2500V•For storage and case temperature with TIM see document “TP(*) SEMiX 3p”Characteristics SymbolConditionsmin.typ.max.UnitInverse diodeV F = V EC I F =700AV GE =0V chiplevelT j =25°C 2.20 2.59V T j =150°C 2.25 2.53V V F0chiplevel T j =25°C 1.39 1.59V T j =150°C 1.08 1.18V r FchiplevelT j =25°C 1.16 1.42m ΩT j =150°C1.67 1.93m ΩI RRM I F =700A di/dt off =6300A/µs V GE =-15VV CC =600VT j =150°C 510A Q rr T j=150°C110µC E rr T j =150°C 50mJR th(j-c)per diode0.073K/W R th(c-s)per diode (λgrease =0.81 W/(m*K))0.039K/W R th(c-s)per diode, pre-applied phase change material0.031K/W Module L CE 20nH R CC'+EE'measured per switchT C =25°C 0.8m ΩT C =125°C1.1m ΩR th(c-s)1calculated without thermal coupling 0.009K/W R th(c-s)2including thermal coupling,T s underneath module (λgrease =0.81 W/(m*K))0.014K/W R th(c-s)2including thermal coupling,T s underneath module, pre-applied phase change material 0.011K/WM s to heat sink (M5)36Nm M t to terminals (M6)36Nm Nm w350g Temperature Sensor R 100T c =100°C (R 25=5 k Ω)493 ± 5%ΩB 100/125R (T)=R 100exp[B 100/125(1/T-1/T 100)]; T[K];3550 ±2%K© by SEMIKRON Rev. 3.0–23.09.202134Rev. 3.0–23.09.2021© by SEMIKRONThis is an electrostatic discharge sensitive device (ESDS) due to international standard IEC 61340.*IMPORTANT INFORMATION AND WARNINGSThe specifications of SEMIKRON products may not be considered as guarantee or assurance of product characteristics ("Beschaffenheitsgarantie"). The specifications of SEMIKRON products describe only the usual characteristics of products to be expected in typical applications, which may still vary depending on the specific application. Therefore, products must be tested for the respective application in advance. Application adjustments may be necessary. The user of SEMIKRON products is responsible for the safety of their applications embedding SEMIKRON products and must take adequate safety measures to prevent the applications from causing a physical injury, fire or other problem if any of SEMIKRON products become faulty. The user is responsible to make sure that the application design is compliant with all applicable laws, regulations, norms and standards. Except as otherwise explicitly approved by SEMIKRON in a written document signed by authorized representatives of SEMIKRON, SEMIKRON products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury. No representation or warranty is given and no liability is assumed with respect to the accuracy, completeness and/or use of any information herein, including without limitation, warranties of non-infringement of intellectual property rights of any third party. SEMIKRON does not assume any liability arising out of the applications or use of any product; neither does it convey any license under its patent rights, copyrights, trade secrets or other intellectual property rights, nor the rights of others. SEMIKRON makes no representation or warranty of non-infringement or alleged non-infringement of intellectual property rights of any third party which may arise from applications. Due to technical requirements our products may contain dangerous substances. For information on the types in question please contact the nearest SEMIKRON sales office. This document supersedes and replaces all information previously supplied and may be superseded by updates. SEMIKRON reserves the right to make changes.6。

6639S-1-103;6639S-1-102;6639S-1-104;6639S-1-202;6639S-1-203;中文规格书,Datasheet资料

22.23 (.875) DIA.
3.18 (.125)
6639
11.25 .38 (.443 .015)
1.57 (.062)
Байду номын сангаас
22.23 (.875) DIA.
.51 (.020) REF
19.81 (.780) DIA.
12.70 .79 (.500 .031)
10.317+.000/-.051 (.4062+.000/-.002)
DIA.
6.342+.000/-.008
(.2497+.0000/-.0003) DIA. SHAFT .25
45 5 (.010) CHAMFER 1.19 1.60
SLOT (.047) X (.063)
Mechanical Characteristics1
Mechanical Angle ..........................................................Continuous, Stops (340 ° +8 °, -0 °) available Torque (Starting & Running)2 ...................................................................0.40 N-cm (0.5 oz.-in.) max.
Sea Level......................................... 750 VAC minimum .....................750 VAC minimum Power Rating (Voltage Limited By Power Dissipation or 300 VAC, Whichever is Less)

2SK1170中文资料

3
2SK1169, 2SK1170
Power vs. Temperature Derating 100 150 Channel Dissipation Pch (W) 30 Drain Current ID (A) 10 3 1.0 Operation in this area is limited by RDS (on) 0.3 0 50 100 Case Temperature TC (°C) 150 0.1 1 Ta = 25°C
Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Body to drain diode forward voltage Body to drain diode reverse recovery time Note: 1. Pulse test
D C
PW
Maximum Safe Operation Area
10
1
= 10 m s
C
10
0 µs
µs
100
m
(1
O
s
pe
ra
tio
n
(T
Sh
50
=
ot ) 25 °C )
2SK1170 2SK1169
3 10 30 100 300 1,000 Drain to Source Voltage VDS (V)
3.6
0.9 1.0
5.45 ± 0.5
5.45 ± 0.5

AS1170.1-2002

AS/NZS 1170.1:2002 (Including Amendment No. 1)Australian/New Zealand Standard ™Structural design actionsPart 1: Permanent, imposed and otheractionsAS/NZS 1170.1:2002 s e d b y I S O N E T - C H I N A S T A T E B U R E A U O F T E C H N I C A L S U P E R V I S o n 20 M a r 2006AS/NZS 1170.1:2002 T his Joint Australian/New Zealand Standard was prepared by Joint T echnicalCommittee BD-006, General Design Requirements and Loading on Structures. It was approved on behalf of the Council of Standards Australia on 29 March 2002 and on behalf of the Council of Standards New Zealand on 28 March 2002. This Standard was published on 4 June 2002.The following are represented on Committee BD-006:Association of Consulting Engineers AustraliaAustralian Building Codes BoardAustralian Institute of Steel ConstructionBuilding Research Association of New ZealandCement and Concrete Association of AustraliaCSIRO, Building, Construction and EngineeringCyclone Testing Station—James Cook UniversityElectricity Supply Association of AustraliaHousing Industry AssociationInstitution of Engineers AustraliaInstitution of Professional Engineers New ZealandMaster Builders AustraliaNew Zealand Heavy Engineering Research AssociationSteel Reinforcement Institute of AustraliaUniversity of NewcastleUniversity of Auckland (New Zealand)University of Canterbury, New Zealand University of MelbourneKeeping Standards up-to-dateStandards are living documents which reflect progress in science, technology and systems. T o maintain their currency, all Standards are periodically reviewed, andnew editions are published. Between editions, amendments may be issued. Standards may also be withdrawn. It is important that readers assure themselves they are using a current Standard, which should include any amendments which may have been published since the Standard was purchased.Detailed information about joint Australian/New Zealand Standards can be found by visiting the Standards Web Shop at .au or Standards New Zealand web site at and looking up the relevant Standard in the on-line catalogue.Alternatively, both organizations publish an annual printed Catalogue with full details of all current Standards. For more frequent listings or notification of revisions, amendments and withdrawals, Standards Australia and Standards New Zealand offer a number of update options. For information about these services, users should contact their respective national Standards organization.We also welcome suggestions for improvement in our Standards, and especially encourage readers to notify us immediately of any apparent inaccuracies or ambiguities. Please address your comments to the Chief Executive of either Standards Australia or Standards New Zealand at the address shown on the back cover. This Standard was issued in draft form for comment as DR 99310.s e d b y I S O N E T - C H I N A S T A T E B U R E A U O F T E C H N I C A L S U P E R V I S o n 20 M a r 2006AS/NZS 1170.1:2002 (Including Amendment No. 1)Australian/New Zealand Standard ™Structural design actionsPart 1: Permanent, imposed and otheractionsCOPYRIGHT© Standards Australia/Standards New ZealandAll rights are reserved. No part of this work may be reproduced or copied in any form or byany means, electron i c or mechan i cal, i nclud i ng photocopy i ng, w i thout the wr i ttenOriginated in Australia as part of AS CA1—1933.Originated in New Zealand as part of NZS 1900:1964.Previous Australian editions AS 1170.1—1989 and AS 2867—1986.Previous New Zealand edition NZS 4203:1992.AS 1170.1—1989, AS 2867—1986 and NZS 4203:1992 jointly revised,amalgamated and redesignated in part as AS/NZS 1170.1:2002.Reissued with Amendment No. 1 attached (April 2005).s e d b y I S O N E T - C H I N A S T A T E B U R E A U O F T E C H N I C A L S U P E R V I S o n 20 M a r 2006AS/NZS 1170.1:2002 2PREFACEThis S tandard was prepared by the Joint S tandards Australia/S tandards New ZealandCommittee BD-006, General Design Requirements and Loading on Structures, to supersede,in part, AS 1170.1—1989, Minimum design loads on structures, Part 1: Dead and liveloads , and in part NZS 4203:1992, Code of p ractice for general structural design anddesign loadings for buildings and, in part, AS 2867—1986, Farm structures—Generalrequirements for structural design .This edition of the Standard includes Amendment No. 1 which is attached at the end of thedocument. In order to avoid confusion, the Amendment has not yet been incorporated intothe clauses of the Standard because, at the time of publication of the Amendment, they hadnot yet been referenced by the BCA.This S tandard is published as a joint S tandard (as are also AS /NZS 1170.0 andAS/NZS 1170.2) and it is intended that it is suitable for use in New Zealand as well as inAustralia. However, NZS 4203, General structural design and design loadings for buildingsremains current in New Zealand until the publication of all parts (includingPart 4: Earthquake action) and for a transition period afterwards.This S tandard will be referenced in the Building Code of Australia by way of BCAAmendment 11 to be Published on 1 July 2002, thereby superseding the previous edition,AS 1170.1—1989, which will be withdrawn 12 months from the date of publication of thisEdition.The objective of this Standard is to provide designers of structures with values representingthe permanent actions, likely actions imposed due to use and occupancy, and other actionsappropriate to the type of structure for use in structural design.This S tandard is Part 1 of the AS /NZS 1170 series Structural design actions , which comprises the following parts, each of which have an accompanying Commentary published as a Supplement: A S /NZ S 1170.0 Part 0: General principles. 1170.1 Part 1: Permanent, imposed and other actions. 1170.2 Part 2: Wind action. 1170.3 Part 3: Snow action. 1170.4 Part 4: Earthquake action. The Commentary to this S tandard is AS /NZS 1170.1 S upp 1, Structural design actions —Permanent, imposed and other actions —Commentary (Supplement to AS/NZS 1170.1). This Standard is not equivalent to ISO 9194:1987, Bases for design of structures—Actions due to the self-weight of structures, non-structural elements and stored materials—Density .However, it does conform to that S tandard (which states ‘Each country in its relevant standards should use its traditional values which are in the indicated range’). Extracts from the data given in ISO 9194 are provided in the Commentary to this Standard. This S tandard is not equivalent to IS O 2103:1986, Loads due to use and occup ancy in residential and public buildings or to ISO 2633:1974, Determination of imposed floor loads in p roduction buildings and warehouses . The philosophy of imposed actions in this Standard is based on ISO 2103 and ISO 2633. ISO 2103 states that the values it gives are the lowest values given in the National S tandards that were considered. It is not used in Europe or North America. This Standard gives values that are either equivalent to or greater than those in ISO 2103. This Standard does conform to ISO 2633 for all values except for s e d b y I S O N E T - C H I N A S T A T E B U R E A U O F T E C H N I C A L S U P E R V I S o n 20 M a r 20063 AS/NZS 1170.1:2002This edition incorporates the following principal changes from the previous edition:(a) Dead and live loads for Australia and New Zealand have been included.(b) Load combinations and other general reliability clauses have been removed to thenew Standard AS/NZS 1170.0, General principles .(c)The information on movement effects has been included in AS /NZS 1170.0 S upp 1, Commentary on General principles. (d)Permanent and imposed loads from AS 2867, Farm structures—General requirements for structural design , have been included. (e) The provision for occasional loading of 4.5 kN for roof trusses or roof structures inindustrial or commercial buildings has been deleted.The term ‘normative’ has been used in this S tandard to define the application of theappendix to which it applies. A ‘normative’ appendix is an integral part of a Standard.S tatements expressed in mandatory terms in notes to tables are deemed to be an integralpart of this Standard.Notes to the text contain information and guidance and are not considered to be an integralpart of the Standard.s e d b y I S O N E T - C H I N A S T A T E B U R E A U O F T E C H N I C A L S U P E R V I S o n 20 M a r 2006AS/NZS 1170.1:2002 4CONTENTSPage SECTION 1 SCOPE AND GENERAL1.1 S COPE (5)1.2 APPLICATION (5)1.3 DETERMINATION OF DESIGN ACTIONS (5)1.4 REFERENCED DOCUMENTS (5)1.5 DEFINITIONS (6)1.6 NOTATION (6)SECTION 2 PERMANENT ACTIONS2.1 GENERAL (7)2.2 CALCULATION OF SELF-WEIGHT (7)2.3 PROVISION FOR PARTITIONS (7)2.4 REMOVABLE ITEMS (7)SECTION 3 IMPOSED ACTIONS3.1 GENERAL (8)3.2 CONCENTRATED ACTIONS (8)3.3 PARTIAL LOAD (8)3.4 FLOORS (8)3.5 ROOF AND SUPPORTING ELEMENTS (12)3.6 BARRIERS (13)3.7 ACTIONS FROM INSTALLED CRANES, HOISTS, LIFTS AND MACHINERY .153.8 CAR PARKS (16)3.9 GRANDS TANDS (17)SECTION 4 LIQUID PRESSURE, GROUND WATER, RAINWATER PONDING ANDEARTH PRESSURE4.1 GENERAL (18)4.2 LIQUID PRES S URE (18)4.3 GROUND WATER (18)4.4 RAINWATER PONDING (18)4.5 EARTH PRES S URE (18)APPENDICESA UNIT WEIGHTS OF MATERIALS (19)B OTHER IMPOSED ACTIONS (22)s e d b y I S O N E T - C H I N A S T A T E B U R E A U O F T E C H N I C A L S U P E R V I S o n 20 M a r 20065 AS/NZS 1170.1:2002STANDARDS AUSTRALIA/STANDARDS NEW ZEALANDAustralian/New Zealand Standard Structural design actions Part 1: Permanent, imposed and other actionsS E C T I O N 1 S C O P E A N D G E N E R A L1.1 SCOPEThis S tandard specifies permanent, imposed, liquid pressure, ground water, rainwaterponding and earth pressure actions to be used in the limit state design of structures andparts of structures.1.2 APPLICATIONThis Standard shall be read in conjunction with AS/NZS 1170.0.This Standard may be used as a means for demonstrating compliance with the Requirementsof Part B1 of the Building Code of Australia.1.3 DETERMINATION OF DESIGN ACTIONSFor the actions covered by this Standard, values for use in design shall be appropriate forthe type of structure or structural element, its intended use and exposure to such actions.The determination of values in accordance with Sections 2 to 4 shall be deemed to satisfy this Clause. 1.4 REFERENCED DOCUMENTS The following documents are referred to in this Standard: A S 1418 Cranes, hoists and winches (all parts) 1657 Fixed platforms, walkways, stairways and ladders—Design, construction and installation 1720 Timber structures 1720.2 Part 2: Timber properties 1735 Lifts, escalators and moving walks (all parts) 2156 Walking tracks 2156.1 Part 1: Classification and signage A S /NZ S 1170 Structural design actions 1170.0 Part 0: General principles 1170.2 Part 2: Wind actionsNZS s e d b y I S O N E T - C H I N A S T A T E B U R E A U O F T E C H N I C A L S U P E R V I S o n 20 M a r 2006AS/NZS 1170.1:2002 6Australian Building Codes BoardBuilding Code of Australia1.5 DEFINITIONSFor the purpose of this Standard, the definitions given in AS/NZS 1170.0 and those belowapply.1.5.1 Imposed actionA variable action resulting from the intended use or occupancy of the structure.1.5.2 LoadThe value of a force appropriate to an action.1.5.3 Permanent actionAction that is likely to act continuously throughout the design working life and for whichvariations in magnitude with time are small compared with the mean value.1.5.4 Design working lifeAssumed period for which a structure or a structural element is to be used for its intendedpurpose without major repair being necessary.1.5.5 Tributary areaThe area assumed to be supported by a structural element.1.5.6 Variable actionAction for which the variation in magnitude with time is neither negligible in relation to themean value nor monotonic.1.6 NOTATION Unless otherwise stated, the notation used in this Standard has the following meaning: A = tributary area supported by a structural element F e,u = earth pressure action F gw = ground water action F lp = liquid pressure action F pnd = ponding action G = permanent action Q = imposed action ψa = factor for reduction of imposed floor loads due to area ψl = factor for determining quasi-permanent values (long-term) of actions (see AS/NZS 1170.0)s e d b y I S O N E T - C H I N A S T A T E B U R E A U O F T E C H N I C A L S U P E R V I S o n 20 M a r 20067 AS/NZS 1170.1:2002S E C T I O N 2 P E R M A N E N T A C T I O N S2.1 GENERALThis Section gives permanent actions (G) for use in designing structures.Permanent actions shall be taken to include the self-weight of the following:(a) The structure.(b) All other materials incorporated into the structure.NOT E: his includes walls, floors, roofs, suspended ceilings and other permanentconstruction, as appropriate.(c) Permanent equipment including fixtures and fittings.NOT E: T his includes permanently fixed wiring, reticulated services and other permanentequipment as appropriate.(d) Partitions as given in Clause 2.3.(e) S tored materials where the resultant actions are consistent with the definition forpermanent action.2.2 CALCULATION OF SELF-WEIGHTThe self-weight of a material shall be calculated from the design dimensions or knowndimensions and the unit weight as given in Appendix A.NOT E: Further information on unit weights of materials is given in AS/NZS 1170.1 Supp 1,Structural design actions—Permanent, imposed and other actions—Commentary (Supplement toAS/NZS 1170.1:2002).2.3 PROVISION FOR PARTITIONS The self-weight of permanent partitions shall be calculated for their actual layout. S tructures for which provision is to be made for movable partitions shall be designed for the anticipated weight of the partitions placed in any probable positions but not less than a uniformly distributed permanent load of 0.5 kPa over the area being considered. 2.4 REMOVABLE ITEMS Consideration shall be given to the actions resulting from the effect of removing those permanent items that are not essential parts of the structure, such as tanks or their contents, stored materials as defined in Clause 2.1(e), service equipment, partitions and similar.s e d b y I S O N E T - C H I N A S T A T E B U R E A U O F T E C H N I C A L S U P E R V I S o n 20 M a r 2006AS/NZS 1170.1:2002 8S E C T I O N 3 I M P O S E D A C T I O N S3.1 GENERALThis S ection gives imposed actions (Q) for use in designing structures. The values of imposed actions provided in this S ection are appropriate for use with all of the annual probabilities of exceedance defined in AS/NZS 1170.0.Actions resulting from construction are not covered in this Standard.The imposed actions shall be not less than the greater of the following:(a)The actions resulting from the intended use of the structure. (b) The imposed actions given in this Section.NOTE: The imposed actions given in this Section include sufficient allowance for the effects of vertical impact arising from the usual movement of people and shifting of furniture. This allowance does not cover dynamic effects due to highly active crowds. Dynamic effects due to vibrating machinery are covered separately in Clause 3.7.The distributed and concentrated imposed loads shall be considered separately and design carried out for the most adverse effect.3.2 CONCENTRATED ACTIONSA concentrated imposed action shall be applied as follows:(a) At its known position or where its position is not known, in the position giving themost adverse effect.(b) Distributed over the actual area of application or if the actual area is not known or otherwise stipulated in Tables 3.1 or 3.2, over an area of not greater than 0.01 m 2 for floors and roofs. 3.3 PARTIAL LOAD The imposed action shall be considered to be absent from any parts of a structure if its absence will cause more adverse effects on that or any other part. For floor loads, the intensity of the imposed load shall be appropriate to the loaded portion of the area under consideration (see Clause 3.4.2). For design situations involving wind, earthquake or fire emergency conditions, partial loading of alternate spans of continuous beams or slabs need not be considered. For partial loading on continuous beams, the span (or two adjacent spans) that contains the effect under consideration shall be loaded with an imposed load intensity, as determined from Clause 3.4.2, appropriate to the tributary area supported by the span (or spans). Other spans that are required to be loaded to cause the most adverse effect shall be assumed to be loaded with a load intensity appropriate to the span multiplied by the long-term factor (ψl )given in AS/NZS 1170.0. 3.4 FLOORS 3.4.1 Imposed floor actions The imposed actions (Q ) appropriate to the type of activity or occupancy for which the floor area will be used shall be the reference values given in Table 3.1 and Appendix B multiplied by the reduction factor given in Clause 3.4.2.s e d b y I S O N E T - C H I N A S T A T E B U R E A U O F T E C H N I C A L S U P E R V I S o n 20 M a r 2006Areas in residential, social, commercial, industrial and administration structures are dividedinto seven categories, according to their type of activity or occupancy, as shown in Column 1 of Table 3.1.NOT E: T he philosophy of the T able is that each area of a floor is associated with one of the activity types. Thus in order to classify an area under consideration, the design must consider the type of activities that occur in that area.TABLE 3.1REFERENCE VALUES OF IMPOSED FLOOR ACTIONSUniformly distributed actions Concentrated actionsType of activity/occupancy for part of the building orstructureSpecific useskPa kNA Domestic and residential activities(also see Category C)General areas, private kitchens and laundries in self-contained dwellings 1.5 1.8(1)Balconies, and roofs used for floor type activities, in self-contained dwellings— (a) less than 1 m above ground level 1.5 1.5 kN/m runalong edge(b) other2.01.8(1)Stairs (2) and landings in self-contained dwellings2.0 2.7 A1 Self-containeddwellingsNon-habitable roof spaces in self-contained dwellings0.5 1.4 General areas, bedrooms, hospital wards, hotel rooms, toilet areas 2.0 1.8(1)Communal kitchens3.02.7 A2 OtherBalconies, and roofs used for floor type activities, with community accesssame as areasproviding access but not less than 4.01.8B Offices and work areas not covered elsewhereOperating theatres, X-ray rooms, utilityrooms 3.0 4.5 Work rooms (light industrial) without storage3.0 3.5 Offices for general use 3.0 2.7(3) Communal kitchens3.0 2.7 Commercial/institutional kitchens5.04.5La u ndries 3.0 4.5Laboratories 3.0 4.5Factories, workshops and similarbuildings (general industrial)5.0 4.5Balconies, and roofs used for floor type activitiessame as areasproviding access but not less than 4.0 1.8Fly galleries (in theatres, etc.)4.5 kN/m rununiformly distributed over the width—Grids (over the area of proscenium width by stage depth)2.8 —(continued )s e d b y I S O N E T - C H I N A S T A T E B U R E A U O F T E C H N I C A L S U P E R V I S o n 20 M a r 2006(continued )s e d b y I S O N E T - C H I N A S T A T E B U R E A U O F T E C H N I C A L S U P E R V I S o n 20 M a r 2006NOTES:1 The concentrated load shall be applied over an area of 350 mm2 for calculation of punching or crushing. 2 Where a stair tread or landing is structurally independent of the adjoining elements, it shall be capable of withstanding a line load of 2.2 kN/m of span of tread or landing.3 A concentrated load of 6.7 kN shall be used where a general allowance for safes is made.4 The concentrated load shall be applied over an area of 0.025 m2 for calculation of punching or crushing. 5Where these same areas may be subjected to loads due to physical activities or overcrowding (for example a hotel dining room u sed as a dance floor), imposed loads shall be based on occu pancy C4 or C5, as appropriate.6Fixed seating is seating where the removal of the seating and the use of the space for other purposes is not likely.7 For domestic garages with timber floors, this may be redu ced to 9 kN applied over an area of0.3 m × 0.3 m.s e d b y I S O N E T - C H I N A S T A T E B U R E A U O F T E C H N I C A L S U P E R V I S o n 20 M a r 20063.4.2 Reduction of uniformly distribution imposed actions The reduction factor (ψa ) shall be as follows: (a)ψa = 1.0 for the following: (i)Areas covered by activity or occupancy types C3, C4 and C5 (see Table 3.1). (ii) Storage areas on which imposed floor actions exceed 5 kPa.(iii) Light and medium traffic areas (activity or occupancy types F and G).(iv) Imposed actions from machinery and equipment for which specific designallowance has been made. (v) One-way slabs. (b)ψa = A.330+but not greater than 1.0 and not less than 0.5.whereA = sum of all areas supported by a structural element, in square metre, forwhich reduction is not restricted under Clause 3.4.2(a)3.5 ROOF AND SUPPORTING ELEMENTS 3.5.1 RoofsValues for the imposed actions appropriate to roofs shall be as given in Table 3.2 except that roofs used for floor type activities (including activity types A, B, C, D, E, F and G) are treated as floors and values shall be as given in Table 3.1.Roofs not accessible except for normal maintenance, repair, painting and minor repairs are divided into the following categories: (a)R1—Street awnings or roof areas where it is practical for limited numbers of people to gain access either from adjacent openable windows, awnings, balconies or roofs or from the ground only.(b)R2—Other roofs, either flat or pitched as follows: (i)Structural elements supporting the cladding.(ii) Roof cladding inclusive of any associated protective mesh, or similar, which isrequired to support actions incidental to maintenance. (iii) S urfaces (including transparent surfaces) over which supports (e.g., boards orladders) are required to be laid to support actions incidental to maintenance (e.g., people).s e d b y I S O N E T - C H I N A S T A T E B U R E A U O F T E C H N I C A L S U P E R V I S o n 20 M a r 2006TABLE 3.2REFERENCE VALUES OF ROOF ACTIONSUniformlydistributed actionsConcentrated actionsType of activity/occupancyfor part of the building orstructure Specific useskPa kN Accessible from adjacent windows, roofs or balconies1.5 1.8 R1 Street awnings (including cladding)Accessible only from ground level1.01.8 (i) Str u ct u ral elements(1.8/A +0.12) but not less than 0.25(see Notes 1 and 2) 1.4 (ii) Cladding providing direct supportAs for structural elements1.1R2 Other roofs(iii)Surfaces over which boards or ladders are required to be laid— 0.5NOTES: 1 Stru ctu ral elements supporting more than 200 m 2 of roof area shall be designed to support 0.25 kPa on the 200 m 2 of the supported area that gives the worst effect.2A = the plan projection of the su rface area of roof su pported by the member u nder analysis, in squ are metres.3.5.2 Roof trusses, ceilings, skylights and similar structuresWhere the bottom chords of roof trusses, joists and hangers for ceilings, ribs of skylights, frames and coverings of ceiling access hatches and any similar structure are required to support the force imposed by a person for any purpose, they shall be designed to support a 1.4 kN concentrated load.Where the structural element is not required to support a person before the cladding is in place, and there is headroom of less than 1.2 m after installation of the cladding, the concentrated action may be reduced to 0.9 kN.NOT E: T his Standard no longer includes the 4.5 kN occasional load on exposed trusses and beams (for industrial, commercial and farm buildings) that was required in AS 1170.1—1989. If provision for such loads is required, the loads should be given in the specification for the building.3.6 BARRIERSBarriers, including parapets, balustrades and railings, together with members and connections that provide structural support, shall be designed to sustain the imposed actions given in Table 3.3. The top edge or handrail shall also be designed for the case where a concentrated load of 0.6 kN, positioned for the worst effect, acts inward, outward or downward.The uniformly distributed line load and the uniformly distributed and concentrated loads applicable to the infill are not additive. They shall be considered as three separate load cases.Actions due to wind or earthquake need not be assumed to act concurrently with the loads given in Table 3.3.NOTE: For design of barriers for wind effects, information is given in AS/NZS 1170.2.s e d b y I S O N E T - C H I N A S T A T E B U R E A U O F T E C H N I C A L S U P E R V I S o n 20 M a r 2006TABLE 3.3MINIMUM IMPOSED ACTIONS FOR BARRIERSTop edgeInfillHorizontal Vertical Inwards,outwards or downwards HorizontalAnydirectionType of occupancy for part of the building or structureSpecific useskN/m kN/m kNkPa kNAll areas within orserving exclusively onedwelling including stairs, landings, etc. but excluding external balconies and edges of roofs (see C3)0.35 0.35 0.6 0.5 0.25A Domestic and residential activities Other residential, (see also C)0.75 0.75 0.6 1.0 0.5Light access stairs andgangways not more than 600 mm wide 0.22 0.22 0.6 N/A N/AFixed platforms,walkways, stairways and ladders for access (see Note)0.35 0.35 0.6 N/A N/AB, E Offices and work areas not included elsewhere including storage areasAreas not susceptible to overcrowding in office and institutionalbuildings also industrial and storage buildings0.75 0.75 0.6 1.0 0.5C Areas where peoplemay congregateC1/C2 Areas with tables or fixed seating Areas with fixed seatingadjacent to a balustrade,restaurants, bars, etc. 1.5 0.75 0.6 1.5 1.5C3 Areas without obstacles for moving people and not susceptible to over-crowding Stairs, landings, externalbalconies, edges of roofs, etc. 0.75 0.75 0.6 1.0 0.5C5 Areas s u sceptible to over-crowding Theatres, cinemas,grandstands,discotheques, bars,auditoria, shopping malls (see also D), assembly areas, studios, etc. 3.0 0.75 0.6 1.5 1.5D Retail areasAll retail areas includingpublic areas ofbanks/building societies, (see C5 for areas where overcrowding may occur)1.5 0.75 0.6 1.5 1.5(continued )s e d b y I S O N E T - C H I N A S T A T E B U R E A U O F T E C H N I C A L S U P E R V I S o n 20 M a r 2006NOTE: This u sage (u nder B, E) is for access to and safe working at places normally u sed by operating, inspection, maintenance and servicing personnel.3.7 ACTIONS FROM INSTALLED CRANES, HOISTS, LIFTS AND MACHINERY 3.7.1 GeneralActions resulting from acceleration of masses in installed cranes, hoists, lifts and other machinery shall be treated as additional imposed loads.The imposed loads used for the design of structures supporting such loads shall be—(a) provided by the manufacturer of that machinery based on an appropriate dynamicassessment; or (b)derived from AS 1418, AS 1735 or NZS 4332, as applicable.In the absence of such information, the factors given in Clauses 3.7.2 and 3.7.3 shall be used.3.7.2 Vertical actionsFor the design of elements supporting lifts, cranes and machinery, the static vertical actions and their appropriate dynamic factors shall be as given in Table 3.4.TABLE 3.4DYNAMIC FACTORS FOR VERTICAL ACTIONSMachineryDynamic factorElement being designedAction being consideredLifts 2.0 S u pports Weight of movingcomponents Travelling cranes:Electric overhead cranes Hand-operated cranes 1.25 1.1 Gantry girders and theirconnectionsStatic wheel loadsNon-reciprocating machinery (e.g., light machinery, shaft or motor driven)1.2Supports Weight of the machineryReciprocating machinery (e.g., compressors) or power-driven units (e.g., piston engines)1.5 Supports Weight of the machinerys e d b y I S O N E T - C H I N A S T A T E B U R E A U O F T E C H N I C A L S U P E R V I S o n 20 M a r 2006。

电路板FR-4基材及可制造性

深圳速成兴电路板，单位多品种，快交付的原则。

全球客户达1.6万家。

从加工各类PCB样板中小批量的综合试验。

对FR-4的选料做出以下解析。

常用电路板当中。

材料选择将是一个产品的定性选择。

1：消费类常规FR-4 TG-135，材料品牌（生益、建滔、联茂）2：工业类中级FR-4 TG-150，材料品牌（生益、联茂）3：医疗器械特级FR-4 TG-170，材料品牌（生益、联茂）4：航空、石油高级FR-4 TG-250，材料品牌（生益）1.1 FR-4项目推荐板材型号/厂商说明普通TG的FR-4 S1141/生益科技TG值140℃，可以满足普通民用、工业用途PCB需求高TG的FR-4 IT-180A/联茂电子TG值175℃，可以满足普通民用、工业、军用等行业的PCB需求普通TG无卤素FR-4 S1155/生益科技TG值140℃，无卤素，根据产品的环保要求选用高TG无卤素FR-4 S1165/生益科技TG值170℃，无卤素，根据产品的用途及环保要求选用以上板材的PCB成本顺序为：S1141＜IT180A＜S1155＜S1165.当然，市面上还有很多种型号的FR-4，以上推荐的板材，necpcb技术中心经过长达数年的评估而最终得出的性价比最好的型号。

其中S1141在普通TG的FR-4中，可以说是性能表现最好的；IT180A在普通高TG的FR-4性能对比中表现优异，可以替代S1170、S1000-2、FR406、PCL-370HR、N4000-6等板材。

生益科技和联茂电子是单位供应链的战略合作伙伴，优先保证necpcb的板材需求，无供货风险，交期短。

1.2 高频板材根据对材料的介电常数、介电常数稳定性、介质损耗的特殊需求选用高频板材。

世界三大高频板材供应商为ROGERS、TACONIC、ARLON，此外还有Neclo、Panasonic等公司也生产高频板材，国内厂商有泰州旺灵、咸阳704厂等。

高频板材按其树脂类型可分为两类：陶瓷粉填充热固性树脂板材（通常称为非PTFE板材）、PTFE板材。

AUK S1117AQ S1117-xxQ DATA SHEET

查询S1117-15Q供应商DescriptionsThe S1117 series of positive adjustable and fixed regulators are designed to provide 1Awith higher efficiency. All internal circuitry is designed to operate down to 1.3V input tooutput differential. On-chip trimming adjusts reference voltage to 2%Features•Adjustable or Fixed output• Output Current of 1A•Low Dropout, 1.3V maximum at 1A Output Current•Thermal Shutdown Protection•Fast Transient ResponseOrdering InformationType NO. Marking Package Code S1117AQ/S1117xxQ S1117□□Q/S1117□□□Q SOT-223 □□:Voltage Code (Aj : 1.25V, 15:1.5V,:18: 1.8V, 25:2.5V, 33:3.3V, 50:5.0V)□□□:Voltage Code (285:2.85V)S1117AQ/S1117-xxQ Absolute Maximum Ratings Ta=25°CCharacteristic Symbol Rating UnitV Input Voltage V I 16P D1 (Note1) 1.5WPower DissipationP D2 (Note2) 0.8Junction Temperature T J 150°CStorage Temperature Range T stg-55 ~ 150 °CNote 1 : Mounted on a glass epoxy circuit board of 25.4 x 25.4mm. (at 1oz copper area)Note 2 : No Heat sinkDevice Selection Guide (NOTE3)Voltage Device OutputS1117AQ AdjustableS1117-15Q 1.5VS1117-18Q 1.8VS1117-25Q 2.5VS1117-285Q 2.85VS1117-33Q 3.3VS1117-50Q 5.0V Note 3 : Other fixed versions are available Vo=1.5V to 5VS1117AQ/S1117-xxQElectrical Characteristics(Electrical Characteristics at T J = 25℃ and V I =(V O +1.5V), I L =10㎃, C O =10㎌ unless otherwise specified.)Characteristic Symbol DeviceTest Condition Min Typ MaxUnitV I = (V O +1.5V),I O = 10㎃ 1.2251.275S1117A V I = (V O +1.5V) to 7V I O = 0 to 1000㎃* 1.200 1.251.300V I = (V O +1.5V),I O = 10㎃ 1.4701.530 S1117-15 V I = (V O +1.5V) to 7V I O = 0 to 1000㎃* 1.440 1.51.560 V I = (V O +1.5V),I O = 10㎃ 1.7641.836 S1117-18V I = (V O +1.5V) to 7V I O = 0 to 1000㎃* 1.728 1.81.872 V I = (V O +1.5V),I O = 10㎃2.4502.550 S1117-25 V I = (V O +1.5V) to 7V I O = 0 to 1000㎃* 2.400 2.52.600 V I = (V O +1.5V),I O = 10㎃ 2.7932.907 S1117-285 V I = (V O +1.5V) to 7V I O = 0 to 1000㎃* 2.7362.852.964V I = (V O +1.5V),I O = 10㎃ 3.234 3.3 3.366 S1117-33 V I = (V O +1.5V) to 7V I O = 0 to 1000㎃* 3.1683.432V I = (V O +1.5V),I O = 10㎃ 4.900 5.0 5.100 Output Voltage V OS1117-50V I = (V O +1.5V) to 7V I O = 0 to 1000㎃ * 4.8005.200VLine Regulation (Note4)△V O(△VI) All 1.5V ≤ V I -V O ≤7V I O =10㎃- 5 10 ㎷ Load Regulation (Note4) △V O(△IL)AllV I =(V O +1.5V)I O =10㎃ ~ 1000㎃ - 10 30 ㎷ Quiescent CurrentI QC AllV I = V O + 1.5V V ADJ =0V* - 7 13 ㎃Minimum Load Current I L(MIN) S1117A V I =(V O +1.5V), V O =0V * 3 7 ㎃ Adjust Pin CurrentI ADJ S1117A V I= (V O +1.5V) to 7VI O = 10㎃ * 55 90 ㎂ Dropout Voltage (Note6)V DROP All I O =1000㎃* - 1.2 1.3 VRipple Rejection (Note5)RR AllV I -V O =1.5V, I O =1000㎃ V Ripple =1V P-P , f=120㎐60 72-㏈ Current LimitI LIMIT All (V I -V O )= 1.5V * 1 AThe * denotes the specifications which apply over the full temperature range. Note 4: Low duty pulse testing with Kelvin connections required. Note 5: 120㎐ input ripple (C ADJ for ADJ=25㎌) Note 6: V △O = 1%■ Typical ApplicationsV OIVFig. 1 Fixed V oltage RegulatorV IV O =V ADJ * (1 + R 2/R 1) + I ADJ *R 2 Fig. 2 Adjustable V oltage RegulatorNotes:1) C I needed if device is far from filter capacitors 2) C o minimum value required for stabilityElectrical Characteristic CurvesThese AUK Corp. products are intended for usage in general electronic equipment (Office and communication equipment, measuring equipment, domestic electrification, etc.) Please make sure that you consult with us before you use these AUK products in equipm- ents which require high quality and/or reliability, and in equipments which could have major impact to the welfare of human life(atomic energy control, airplane, spaceship, traffic signal, combustion central, all types of safety device, etc.) AUK cannot accept liability to any damage which may occur in casethese AUK products were used in the mentioned equipments without prior consultation。

AMS1117_datasheet

Advanced AMS1117 Monolithic 1A LOW DROPOUT VOLTAGE REGULATORSystemsRoHS compliantFEATURESAPPLICATIONS• Three Terminal Adjustable or Fixed Voltages* • High Efficiency Linear Regulators1.5V, 1.8V,2.5V, 2.85V,3.3V and 5.0V •Post Regulators for Switching Supplies • Output Current of 1A• 5V to 3.3V Linear Regulator • Operates Down to 1V Dropout • Battery Chargers• Line Regulation: 0.2% Max. • Active SCSI Terminators• Load Regulation: 0.4% Max.• Power Management for Notebook • SOT-223, TO-252 and SO-8 package available • Battery Powered InstrumentationGENERAL DESCRIPTIONThe AMS1117 series of adjustable and fixed voltage regulators are designed to provide 1A output current and to operate down to 1V input-to-output differential. The dropout voltage of the device is guaranteed maximum 1.3V at maximum output current, decreasing at lower load currents.On-chip trimming adjusts the reference voltage to 1%. Current limit is also trimmed, minimizing the stress under overload conditions on both the regulator and power source circuitry.The AMS1117 devices are pin compatible with other three-terminal SCSI regulators and are offered in the low profile surface mount SOT-223 package, in the 8L SOIC package and in the TO-252 (DPAK) plastic package.ORDERING INFORMATION:PACKAGE TYPEOPERATING JUNCTIONTO-252 SOT-223 8L SOIC TEMPERATURE RANGE AMS1117CD AMS1117 AMS1117CS -40 to 125° C AMS1117CD-1.5 AMS1117-1.5 AMS1117CS-1.5 -40 to 125° C AMS1117CD-1.8 AMS1117-1.8 AMS1117CS-1.8 -40 to 125° C AMS1117CD-2.5 AMS1117-2.5 AMS1117CS-2.5 -40 to 125° C AMS1117CD-2.85 AMS1117-2.85 AMS1117CS-2.85 -40 to 125° C AMS1117CD-3.3 AMS1117-3.3 AMS1117CS-3.3 -40 to 125° C AMS1117CD-5.0 AMS1117-5.0 AMS1117CS-5.0 -40 to 125° C *For additional available fixed voltages contact factory.PIN CONNECTIONSSOT-223 Top View3 PIN FIXED/ADJUSTABLE VERSION1- Ground/Adjust 2- V OUT 3- V IN捷多邦，您值得信赖的PCB打样专家！AMS1117ABSOLUTE MAXIMUM RATINGS (Note 1)Power Dissipation Internally limitedSoldering informationInput Voltage15VLead Temperature (25 sec) 265°COperating Junction TemperatureThermal ResistanceControl Section0°C to 125°C SO-8 package ϕ JA = 160°C/W Power Transistor 0°C to 150°C TO-252 package ϕ JA = 80°C/W Storage temperature - 65°C to +150°CSOT-223 packageϕ JA = 90°C/W** With package soldering to copper area over backsideground plane or internal power plane ϕ JA can vary from 46°C/W to >90°C/W depending on mounting technique and the size of the copper area.ELECTRICAL CHARACTERISTICSElectrical Characteristics at I OUT = 0 mA, and T J = +25°C unless otherwise specified. ParameterDevice Conditions Min Typ MaxUnitsReference Voltage (Note 2) AMS1117 I OUT = 10 mA10mA ≤ I OUT ≤ 1A, 1.5V ≤ (V IN - V OUT ) ≤ 12V 1.238 1.225 1.250 1.250 1.262 1.270 V V Output Voltage (Note 2) AMS1117-1.5 0 ≤ I OUT ≤ 1A , 3.0V ≤ V IN ≤ 12V 1.485 1.476 1.500 1.500 1.515 1.524 V V AMS1117-1.8 0 ≤ I OUT ≤ 1A , 3.3V ≤ V IN ≤ 12V 1.782 1.773 1.800 1.800 1.818 1.827 V V AMS1117-2.5 0 ≤ I OUT ≤ 1A , 4.0V ≤ V IN ≤ 12V 2.475 2.460 2.500 2.500 2.525 2.560 V V AMS1117-2.85 0 ≤ I OUT ≤ 1A , 4.35V ≤ V IN ≤ 12V 2.82 2.79 2.850 2.850 2.88 2.91 V V AMS1117-3.3 0 ≤ I OUT ≤ 1A , 4.75V ≤ V IN ≤ 12V 3.267 3.235 3.300 3.300 3.333 3.365 V VAMS1117-5.0 0 ≤ I OUT ≤ 1A , 6.5V ≤ V IN ≤ 12V 4.950 4.9005.000 5.0005.050 5.100V V Line RegulationAMS1117I LOAD = 10 mA , 1.5V ≤ (V IN - V OUT ) ≤ 12V0.015 0.035 0.20.2 % % AMS1117-1.5 3.0V ≤ V IN ≤ 12V 0.3 0.6 5 6 mV mV AMS1117-1.8 3.3V ≤ V IN ≤ 12V 0.3 0.6 5 6 mV mV AMS1117-2.5 4.0V ≤ V IN ≤ 12V 0.3 0.6 6 6 mV mV AMS1117-2.85 4.35V ≤ V IN ≤ 12V 0.3 0.6 6 6 mV mV AMS1117-3.3 4.75V ≤ V IN ≤ 12V 0.5 1.0 10 10 mV mV AMS1117-5.0 6.5V ≤ V IN ≤ 12V 0.5 1.0 10 10 mV mV Load Regulation (Notes 2, 3)AMS1117(V IN - V OUT ) =3V, 10mA ≤ I OUT ≤ 1A0.1 0.20.3 0.4% % AMS1117-1.5 V IN = 5V, 0 ≤ I OUT ≤ 1A 3 6 1020 mV mV AMS1117-1.8 V IN = 5V, 0 ≤ I OUT ≤ 1A 3 6 10 20 mV mV AMS1117-2.5 V IN = 5V, 0 ≤ I OUT ≤ 1A3 6 12 20mV mVAMS1117ELECTRICAL CHARACTERISTICSElectrical Characteristics at I OUT = 0 mA, and T J = +25°C unless otherwise specified. ParameterDeviceConditionsMin Typ MaxUnitsLoad Regulation (Notes 2, 3)AMS1117-2.85V IN = 5V, 0 ≤ I OUT ≤ 1A3 6 1220 mV mV AMS1117-3.3 V IN = 5V, 0 ≤ I OUT ≤ 1A 3 7 15 25 mV mV AMS1117-5.0 V IN = 8V, 0 ≤ I OUT ≤ 1A 5 10 20 35 mV mV Dropout Voltage (V IN - V OUT ) AMS1117-1.5/-1.8/-2.5/-2.85/-3.3/-5.0∆V OUT , ∆V REF = 1%, I OUT = 1A (Note 4)1.11.3V Current LimitAMS1117-1.5/-1.8/-2.5/-2.85/-3.3/-5.0(V IN - V OUT ) = 5V900 1,100 1,500 mA Minimum Load CurrentAMS1117 (V IN - V OUT ) = 12V (Note 5) 5 10 mA Quiescent Current AMS1117-1.5/-1.8/-2.5/-2.85/-3.3/-5.0 V IN ≤ 12V5 10mARipple Rejection AMS1117f =120Hz , C OUT = 22µF Tantalum, I OUT = 1A, (V IN -V OUT ) = 3V, C ADJ =10µF60 75 dBAMS1117-1.5/-1.8/-2.5/-2.85f =120Hz , C OUT = 22µF Tantalum, I OUT = 1A, V IN = 6V60 72 dB AMS1117-3.3 f =120Hz , C OUT = 22µF Tantalum, I OUT = 1AV IN = 6.3V 6072dB AMS1117-5.0 f =120Hz , C OUT = 22µF Tantalum, I OUT = 1AV IN = 8V 60 68 dB Thermal Regulation AMS1117 T A = 25°C, 30ms pulse0.0080.04%W Adjust Pin Current AMS1117 10mA ≤ I OUT ≤ 1A , 1.5V ≤ (V IN - V OUT ) ≤ 12V 55120 µA µA Adjust Pin Current ChangeAMS1117 10mA ≤ I OUT ≤ 1A , 1.5V ≤ (V IN - V OUT ) ≤ 12V0.2 5 µA Temperature Stability0.5% Long Term Stability T A =125°C, 1000Hrs0.3 1 % RMS Output Noise (% of V OUT )T A = 25°C , 10Hz ≤ f ≤ 10kHz0.003%Thermal Resistance Junction-to-Case15 °C/WParameters identified with boldface type apply over the full operating temperature range.Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. For guaranteed specifications and test conditions, see the Electrical Characteristics . The guaranteed specifications apply only for the test conditions listed.Note 2: Line and Load regulation are guaranteed up to the maximum power dissipation of 1.2 W. Power dissipation is determined by the input/output differential and the output current. Guaranteed maximum power dissipation will not be available over the full input/output range.Note 3: See thermal regulation specifications for changes in output voltage due to heating effects. Line and load regulation are measured at a constant junction temperature by low duty cycle pulse testing. Load regulation is measured at the output lead ~1/8” from the package. Note 4: Dropout voltage is specified over the full output current range of the device.Note 5: Minimum load current is defined as the minimum output current required to maintain regulation. When 1.5V ≤ (V IN - V OUT ) ≤ 12V the device is guaranteed to regulate if the output current is greater than 10mA.APPLICATION HINTSThe AMS1117 series of adjustable and fixed regulators are easy to use and are protected against short circuit and thermal overloads. Thermal protection circuitry will shut-down the regulator shouldthe junction temperature exceed 165°C at the sense point.Pin compatible with older three terminal adjustable regulators, these devices offer the advantage of a lower dropout voltage, more precise reference tolerance and improved reference stability with temperature.StabilityThe circuit design used in the AMS1117 series requires the use of an output capacitor as part of the device frequency compensation. The addition of22µF solid tantalum on the output will ensure stability for all operating conditions.When the adjustment terminal is bypassed with a capacitor to improve the ripple rejection, the requirement for an output capacitor increases. The value of 22µF tantalum covers all cases of bypassing the adjustment terminal. Without bypassing the adjustment terminal smaller capacitors can be used with equally good results.To further improve stability and transient response of these devices larger values of output capacitor can be used.Protection DiodesUnlike older regulators, the AMS1117 family does not need any protection diodes between the adjustment pin and the output and from the output to the input to prevent over-stressing the die. Internal resistors are limiting the internal current paths on the AMS1117 adjustment pin, therefore even with capacitors on the adjustment pin no protection diode is needed to ensure device safety under short-circuit conditions.Diodes between the input and output are not usually needed. Microsecond surge currents of 50A to 100A can be handled by the internal diode between the input and output pins of the device. In normal operations it is difficult to get those values of surge currents even with the use of large output capacitances. If high value output capacitors are used, such as 1000µF to 5000µF and the input pin is instantaneously shorted to ground, damage can occur. A diode from output to input is recommended, when a crowbar circuit at the input of the AMS1117 is used (Figure 1).FVOUTD1VINFigure 1.Output VoltageThe AMS1117 series develops a 1.25V reference voltage between the output and the adjust terminal. Placing a resistor between these two terminals causes a constant current to flow through R1 and down through R2 to set the overall output voltage. This current is normally the specified minimum load current of 10mA. Because I ADJ is very small and constant it represents a small error and it can usually be ignored.VOUT VINV OUT = V REF (1+ R2/R1)+I ADJ R2Figure 2. Basic Adjustable RegulatorLoad RegulationTrue remote load sensing it is not possible to provide, because the AMS1117 is a three terminal device. The resistance of the wire connecting the regulator to the load will limit the load regulation. The data sheet specification for load regulation is measured at the bottom of the package. Negative side sensing is a true Kelvin connection, with the bottom of the output divider returned to the negative side of the load.The best load regulation is obtained when the top of the resistor divider R1 is connected directly to the case not to the load. If R1 were connected to the load, the effective resistance between the regulator and the load would be:R P x( R2+R1 ) , R P = Parasitic Line Resistance R1APPLICATION HINTSConnected as shown , R P is not multiplied by the divider ratioR LV INR PPARASITIC*CONNECT R1 TO CASECONNECT R2 TO LOADFigure 3. Connections for Best Load RegulationIn the case of fixed voltage devices the top of R1 is connectedKelvin internally, and the ground pin can be used for negative side sensing.Thermal ConsiderationsThe AMS1117 series have internal power and thermal limiting circuitry designed to protect the device under overload conditions. However maximum junction temperature ratings of 125°C should not be exceeded under continuous normal load conditions.Careful consideration must be given to all sources of thermal resistance from junction to ambient. For the surface mount package SOT-223 additional heat sources mounted near the device must be considered. The heat dissipation capability of the PC board and its copper traces is used as a heat sink for the device. The thermal resistance from the junction to the tab for the AMS1117 is 15°C/W. Thermal resistance from tab to ambient can be as low as 30°C/W.The total thermal resistance from junction to ambient can be as low as 45°C/W. This requires a reasonable sized PC board with at least on layer of copper to spread the heat across the board and couple it into the surrounding air.Experiments have shown that the heat spreading copper layer does not need to be electrically connected to the tab of the device. The PC material can be very effective at transmitting heat between the pad area, attached to the pad of the device, and a ground plane layer either inside or on the opposite side of the board. Although the actual thermal resistance of the PC material is high, the Length/Area ratio of the thermal resistance between layers is small. The data in Table 1, was taken using 1/16” FR-4 board with 1 oz. copper foil, and it can be used as a rough guideline for estimating thermal resistance.For each application the thermal resistance will be affected by thermal interactions with other components on the board. To determine the actual value some experimentation will be necessary.The power dissipation of the AMS1117 is equal to: P D = ( V IN - V OUT )( I OUT )Maximum junction temperature will be equal to:T J = T A(MAX) + P D (Thermal Resistance (junction-to-ambient)) Maximum junction temperature must not exceed 125°C.Ripple RejectionThe ripple rejection values are measured with the adjustment pin bypassed. The impedance of the adjust pin capacitor at the ripple frequency should be less than the value of R1 (normally 100Ω to 200Ω) for a proper bypassing and ripple rejection approaching the values shown. The size of the required adjust pin capacitor is a function of the input ripple frequency. If R1=100Ω at 120Hz the adjust pin capacitor should be >13µF. At 10kHz only 0.16µF is needed.The ripple rejection will be a function of output voltage, in circuits without an adjust pin bypass capacitor. The output ripple will increase directly as a ratio of the output voltage to the reference voltage (V OUT / V REF ).Table 1.COPPER AREATHERMAL RESISTANCE TOP SIDE* BACK SIDE BOARD AREA (JUNCTION-TO-AMBIENT)2500 Sq. mm 2500 Sq. mm 2500 Sq. mm 45°C/W 1000 Sq. mm 2500 Sq. mm 2500 Sq. mm 45°C/W 225 Sq. mm 2500 Sq. mm 2500 Sq. mm 53°C/W 100 Sq. mm 2500 Sq. mm 2500 Sq. mm 59°C/W 1000 Sq. mm 1000 Sq. mm 1000 Sq. mm 52°C/W 1000 Sq. mm 0 1000 Sq. mm 55°C/W* Tab of device attached to topside copper.TYPICAL PERFORMANCE CHARACTERISTICSMinimum Operating Current (Adjustable Device)Short-Circuit Current036912M I N I M U M O P E R A T I N G C U R R E N T (m A )-0.20-0.15-0.10-0.050.050.10O U T P U T V O L T A G E D E V I A T I O N (%)-50-25255075100125150-2.0-1.01.02.0TEMPERATURE (°C)O U T P U T V O L T A G E C H A N G E (%)TEMPERATURE (°C)-50-250255075100125150AMS1117 PACKAGE DIMENSIONS inches (millimeters) unless otherwise noted.TO-252 PLASTIC PACKAGE (D)3 LEAD SOT-223 PLASTIC PACKAGEAMS1117 PACKAGE DIMENSIONS inches (millimeters) unless otherwise noted (Continued).8 LEAD SOIC PLASTIC PACKAGE (S)*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASHSHALL NOT EXCEED 0.006" (0.152mm) PER SIDE**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEADFLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE。

SQT-103-01-F-D;SQT-106-01-LM-D;SQT-110-03-F-D;SQT-120-01-F-S;中文规格书,Datasheet资料

SPECIFICATIONS
For complete speciﬁcations see ?SQT
Mates with: TMMH, TMM, MTMM, MMT, TW, LTMM, ZLTMM, ESQT, TCMD
Choice of one through six rows
SQT-106-01-LM-D SQT-112-01-F-D SQT-110-01-L-Q
SQT-110-03-F-D SQT-107-01-L-T SQT-125-01-F-D
(2,29) .050 .090
(2,00) .0787
–RA OPTION
(–Q, –5 & –6 not available)

/
分销商库存信息:
SAMTEC SQT-103-01-F-D SQT-120-01-F-S SQT-110-01-LM-Q SQT-116-01-S-D
TMM/ SQT TMMH
HORIZONTAL
(2,00mm) .0787" pitch
1
NO. PINS PER ROW
LEAD STYLE
(6,35mm) .250"
PLATING OPTION
ROW OPTION
Note: Some lengths, styles and options are non-standard, non-returnable.
20°C
5.5A
(2,62mm) .103" to (5,03mm) .198" Insertion Force: (Single contact only)
40°C
5A
60°C

SP1000A芯片规格说明书

SP1000A Datasheet2021.5Revision History目录第1章SP1000A简介 (1)1.1主要技术特征 (2)1.1.1以太网 (2)1.1.2数据中心 (2)1.1.3卸载 (2)1.1.4主机接口 (3)1.1.5虚拟化 (3)1.1.6接口 (3)1.2引脚描述 (4)1.3电气规格 (12)1.3.1极限工作条件 (12)1.3.2建议工作条件 (12)1.3.3工作电流 (13)1.3.4模式配置说明 (13)1.3.5ETH时钟输入 (14)1.3.6电源设计 (15)1.3.7复位时间 (15)1.3.8NCSI AC S PECIFICATION (15)1.3.9FLASH推荐 (16)1.3.10光模块推荐 (16)1.3.11PCI_E XPRESS 布线建议 (17)1.3.12SFP+布线建议 (17)第2章芯片封装尺寸说明 (18)第1章SP1000A简介SP1000A处理器是北京网迅自主设计的，拥有自主知识产权，它能满足企业数据中心对网络最新需求，应用在服务器上，支持管理程序分流数据排序功能，通过有效地平衡网络负载在CPU核上，提高数据吞吐量和CPU使用率，在多CPU处理器系统中表现出极佳的性能。

SP1000A处理器具有优良的噪声抗扰性，同时还支持300米距离光纤连接，适用于服务器和高端设备，它可轻松将任何PCI Express X8集成到万兆网络中，并且对性能进行了优化，使系统I/O不再是高端网络应用的瓶颈。

SP1000A处理器带有两个完全集成的万兆以太网媒体存取控制（MAC）和SFP+端口，它是部署多个网络以及在高性能服务器上部署关键网络应用环境的理想解决方案。

SP1000A产品应用框图如下：1.1主要技术特征1.1.1 以太网➢10G SFI/KR/XAUI/SGMII接口➢支持最大9.5 KB的巨型帧➢支持模式下自动匹配第73条➢控制支持：发送/接收暂停帧和接收FIFO阈值➢支持802.1q VLAN➢休眠唤醒➢流量整形1.1.2数据中心➢支持PFC(802.1Qbb)➢支持ETS(802.1Qaz)➢支持QCN(802.1Qau)➢支持VEPA➢支持ETAG➢支持MIB和RMON➢VXLAN/Geneve/NVGRE卸载1.1.3卸载➢IPv4 TCP RSC卸载➢FCOE卸载➢发送端TCP报文切片：最高支持256KB➢Linksec卸载➢更规范的IPSec➢IP/TCP/UDP/STCP校验和卸载➢用于数据包重组的分段UDP校验和卸载➢以太网CRC剥离卸载➢VLAN Tag发送端插入和接收端剥离卸载➢支持传输数据包的MAC源地址/ VLAN防欺骗功能➢支持接收数据包头拆分1.1.4主机接口➢消息信号中断（MSI / MSI-X）➢中断节流控制，用于限制最大中断速率➢TCP定时器中断➢支持TPH/FLR/IDO/ARI/VPD/ECRC➢256B最大有效载荷/ 2KB最大请求➢PCIE乱序发送➢功能性支持D0和D3状态的ACPI寄存器设置和掉电1.1.5虚拟化➢支持SR-IOV➢128个传输队列◼每个队列有32个条目数据描述符缓存◼每个队列都有2个条目上下文描述符缓存➢128个接收队列◼LLI队列的描述符缓存➢支持每个端口64个虚拟机（64个虚拟机x 2个队列）注：驱动软件支持每个端口63个虚拟网口。

伊顿 Quik-Spec 电源模块面板数据表

Product description:The Quik-Spec™ Power Module Panel (PMP) is an all-in-one multi-elevator disconnect switch available in configurations to meet virtually any shutdown and disconnect requirement.Quik-Spec Power Module PanelAll-in-one elevator disconnectFeatures and options:• 400-800 amp bus MLO and/or main fused switch*• 200kA RMS short-circuit current rating • Feeder switches 30-200 amp, 600Vac with Class J clips 1•Copper busOptional features:• Control power transformer with fuses and blocks• Fire safety interface relay • Key to test switch • Pilot light – “ON”• Isolated neutral lug 2•Mechanically interlocked auxiliary contact for hydraulic elevators with battery backup (5 amp 120Vac rated)• Fire alarm voltage monitoring relay (to monitor shunt trip voltage)• NEMA 3R enclosures available (consult factory)• Phase failure and undervoltage relay available (consult factory)•For added safety, use the Bussmann SAMI™ fuse covers to improve maintenance personnel protection [OSHA 1910.335(A)(2)(ii)]3Agency information:•UL 67 enclosed and dead-front switches* Contact Bussmann for applications greater than 800 amps.1Class J fuses not included.2Oversized 200% rated neutral option available where required byexcessive non-linear loads.3Through 100A.Typical control with wiring options for fire safety interface (option R1)LegendN.O.F .A.Normally Open Fire Alarm contacts supplied from the fire alarm system to initiate the shunt trip.Shunt Trip Solenoid for remote trip of switch, which is activated by the closing of the fire alarm contacts or key test switch.Option R1Fire Safety Interface Relay that is operated at 120Vac from secondary of transformer. No additional power needed.CR Control Relay used to isolate the N.O.F .A. contacts from the duty of the shunt trip.FRFire Alarm Voltage Monitoring Relay used to monitor presence of voltage in switch from a remote location (Fire Alarm Control Panel).PL Pilot Light to visually indicate presence of voltage on outside of switch enclosure.CPT Control Power Transformer used to step down line voltage to 120Vac to power shunt trip coil.SW Aux.Normally closed contact when switch is closed. Opens as power switch opens.Key Test Key-to-Test switch used to operate shunt trip from the outside of switch enclosure. Can be used for trouble-shootingand inspection.Mechanically Interlocked Auxiliary Contact – Contact used to disconnect secondary source of power.Terminal block connection point. Pre-wired connection point.Mechanically interlocked aux contact Shunt tripOption F1: Relay terminal configurationVoltage monitoringNote: Contacts for FR are shown inde-energized postion.Wiring diagramOption A: battery backup terminal configurationMechanically interlocked auxiliary contactTo connect the battery lowering for hydraulic elevator, connectto points NC and COM.Note: Contacts for mechanically interlocked auxiliary contact areshown in the energized position.LegendN.O.F .A.Normally Open Fire Alarm contacts supplied from the fire alarm system to initiate the shunt trip.Shunt Trip Solenoid for remote trip of switch, which is activated by the closing of the fire alarm contacts or key test switch.Option R2Fire Safety Interface Relay that is operated at 24Vdc from fire alarm system. May require an additional power source to be needed.CR Control Relay used to isolate the N.O.F .A. contacts from the duty of the shunt trip.FR Fire Alarm Voltage Monitoring Relay used to monitor presence of voltage in switch from a remote location (i.e., FireAlarm Control Panel).PL Pilot Light to visually indicate presence of voltage on outside of switch enclosure.CPT Control Power Transformer used to step down line voltage to 120Vac to power shunt trip coil.SW Aux.Normally closed contact when switch is closed. Opens as power switch opens.Key Test Key-to-Test switch used to operate shunt trip from the outside of switch enclosure. Can be used for trouble-shootingand inspection.Mechanically Interlocked Auxiliary Contact Contact used to disconnect secondary source of power.Terminal block connection point.Pre-wired connection point.Wiring diagramOption A: battery backup terminal configurationMechanically interlocked aux contact Shunt tripVoltage monitoring24Vdc source provided by fire alarm systemMechanically interlocked auxiliary contactTo connect the battery lowering for hydraulic elevator, connectto points NC and COM.Note: Contacts for mechanically interlocked auxiliary contact areshown in the energized position.Typical control with wiring options for fire safety interface (option R2)The only controlled copy of this data sheet is the electronic read-only version located on the Bussmann network drive. All other copies of this document are by definition uncontrolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Bussmann also reserves the right to change or update, without notice, any technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications.Eaton’s Bussmann Business114 Old State RoadEllisville, MO 63021United States© 2014 EatonAll Rights ReservedPublication No. 1146 - BU-SB14456 July 2014Eaton is a registered trademark. All other trademarks are property of their respective owners.。

i.MX RT1060到i.MX RT1170的迁移指南说明书

AN13106从i.MX RT1060到i.MX RT1170的迁移指南第 1 版—2021年2月18日应用笔记作者：恩智浦半导体1 简介本文档介绍了i.MX RT1170与i.MX RT1060的主要区别和新功能。

本文档可用作迁移的参考。

它是为以下读者准备的：•开发了一些基于i.MX RT1060的项目，并决定将该项目迁移到i.MXRT1170。

•熟悉i.MX RT1060并希望根据先前对i.MX RT1060的了解启动新项目的人员。

目录1简介 (1)2SoC的比较 (2)3封装 (4)4管脚复用 (4)5电源更换 (5)6时钟 (5)6.1概述 (5)6.2振荡器和锁相环 (6)7电源模式/管理 (6)8DMA. (6)9内存映射 (6)10ECC (7)11图形和显示 (8)11.1图形处理单元（GPU2D） (8)11.2LCDIFv2. (8)12音频 (9)12.1ASRC. (9)12.2PDM话筒接口 (9)13低速外围设备 (10)13.1FlexIO. (10)14EMVSIM (10)15看门狗 (10)16模拟 (11)17Boot (11)18安全 (12)19软件迁移考虑 (14)20参考资料 (14)21修订历史 (14)2 SoC的比较表 1列出了SoC的比较。

红色文本是i.MX RT1170上的新功能。

表1. SoC比较表格在下一页继续…...表格在下一页继续…...封装3 封装如表 2所示，i.MX RT1170是289-pin MAPBGA，而i.MX RT1060是196-pin MAPBGA。

i.MX RT1170有一个更大的封装，以适应额外的功能和电源架构的变化。

4 管脚复用对于i.MX RT1170上的新pin mux，用户可参考表3。

电源更换5 电源更换以下描述了 i.MX RT1170 和 RT1060 之间的主要区别。

有关详细信息，请参阅 MIMXRT1170 处理器的硬件开发指南（文档MIMXRT1170HDUG）和MIMXRT1170 EVK板硬件用户指南（文档MIMXRT1170EVKHUG）。

S1170

35 30 25 20 15 10 5 0
288℃ 20 secends←→30℃ 10seconds Sample with Copper
＞ 30
Delaminaton Time(min)
Test of solder dip 288℃ with copper
14 12 10 8 6 4 2 0
12
芯板可开PNLS供货/The PNLS T/C can be supplied.
S1170/S0701 粘结片指标参数
Prepreg Parameters
G/F Type 106 1080 3313 2116 1500 7628 Gel Time(sec) 90±20 90±20 90±20 90±20 90±20 90±20 Resin Content(%) 70±3 64±3 55±3 52±3 45±3 43±3 Resin Flow(%) 37±5 36±5 26±5 28±5 22±5 23±5 Thickness After Press(um) 50±10 80±10 105±15 125±15 165±15 200±20
S1170/S0701
特征与属性
S1170/S0701
高性能、适合无铅应用覆铜板/粘结片 High Performance & Lead Free Laminate/Prepreg
产品特性及基本性能
General Features & Properties
S1170/S0701
高Tg
High Tg ：DSC-Tg =176.99℃/177.30℃
100
332.26°C 1.000% Loss 334.40°C 2.000% Loss 336.33°C 5.000% Loss 338.27°C 10.00% Loss

TDA1170S 集成电路资料

THERMAL DATA
Max Max
1170S-02.TBL 1170S-03.TBL
Symbol Rth j–tab R th j–amb
Parameter Thermal Resistance Junction–tab Thermal Resistance Junction-ambient
Value 12 70
Symbol Is I8 V4 V9 tfly fo ∆f ∆f ∆VS ∆f ∆T tab Parameter Supply Current Sync. Input Current (positive or negative) Flyback Voltage Peak to Peak Oscillator Sawtooth Voltage Flyback Time Free Running Frequency Synchronization Range Frequency Drift with Supply Voltage Frequency Drift with Tab Temperature Iy = 1App (P1 + R1) = 300kΩ, C2 = 0.1 µF (P1 + R1) = 260kΩ, C2 = 0.1 µF I8 = 0.5mA VS = 10 to 35V Ttab = 40 to 120°C 14 0.005 0.01 Iy = 1App Test Conditions Iy = 1App 500 51 2.4 0.7 42.2 48.5 Min. Typ. 140 Max. Unit mA µA V V ms Hz Hz Hz Hz/V Hz/°C
10
R1
- I9 1V 8V
- I12 R2

AMS1117 DATASHEET中文资料

AMS1117-3.0 AMS1117-3.0 AMS1117-3.3 AMS1117-3.3
AMS1117-5.0 AMS1117-5.0
AMS1117-ADJ AMS1117-2.85
AMS1117-1.2 AMS1117-3.0 AMS1117-1.5 AMS1117-3.3
AMS1117-1.8 AMS1117-5.0 AMS1117-2.5
共10页第3页
AMS1117
（接上页）
参数
输出电压
输出电压温度稳定性线性调整负载调整漏失电压静态电流纹波抑制比可调管脚电流可调管脚电流变化温度稳定性长期稳定性 RMS输出噪声
热阻系数 (无散热片)
符号
测试条件
最小值典型值最大值单位
AMS1117-2.85,
IOUT=10mA, VIN=4.85V,TJ=25°C , 2.820 2.850 .880
2.940 3.000 3.060
AMS1117-3.3, IOUT=10mA, VIN=5V,TJ=25°C , 0≤IOUT≤1A, 4.75V≤VIN≤10V
3.267 3.300 3.333 V 3.235 3.300 3.365
AMS1117-5.0,
IOUT=10mA, VIN=7V, TJ=25°C , 4.950 5.000 5.05 V
线性瞬态响应（VOUT=2.85V）
线性瞬态响应（VOUT=5 V）
ADVANCED MONOLITHIC SYSTEMS (translate by BONA 0755-82800289)
IOUT=10mA, VIN=3.8V, TJ=25°C , 1.782 1.800 1.818 V

赛米控丹佛斯 SEMIPACK 晶闸管二极管模块 SKKH 107 16 E 数据表

Rev. 3.0–31.05.20221®1SKKHThyristor / Diode ModulesSKKH 107/16 E Features*•Heat transfer through aluminium oxide ceramic insulated metal baseplate •UL recognized, file no. E63532Typical Applications•Rectifier for motor drives •Process control•Rectifier for power suppliesAbsolute Maximum Ratings SymbolConditions Values UnitChip I T(AV)sin. 180°T j =130°C T c =85°C 119A T c =100°C 91A I TSM 10ms T j =25°C 2250A T j =130°C 1900A i 2t10ms T j =25°C 25313A²s T j =130°C18050A²s V RSM T j =25°C 1700V V RRM T j =25°C 1600V V DRM T j =25°C 1600V (di/dt)cr T j =130°C 140A/µs (dv/dt)cr T j =130°C1000V/µs T j -40...130°C Module T stg -40 (125)°C V isola.c.; 50 Hz; r.m.s.1min 3000V 1s3600VCharacteristics SymbolConditions min.typ.max.UnitChip V T T j =25°C,I T =300A 1.6 1.75V V T(TO)T j =130°C 0.80.90V r T T j =130°C2.803.35m ΩI DD ;I RD T j =130°C,V DD = V DRM ; V RD = V RRM 20mA t gd T j =25°C,I G =1A, di G /dt =1A/µs 1µs t gr V D = 0.67 * V DRM 2µs t q T j =130°C 200µs I H T j =25°C150250mA I L T j =25°C,R G =33Ω300600mA V GT T j =25°C,d.c. 2.5V I GT T j =25°C,d.c.100mA V GD T j =130°C, d.c.0.25V I GD T j =130°C, d.c.4mA R th(j-c)continuous DC per chip 0.15K/W per module 0.075K/W R th(j-c)sin. 180°per chip 0.2K/W per module 0.1K/W R th(j-c)rec. 120°per chip 0.21K/W per module0.105K/WModule R th(c-s)chip 0.09K/W module 0.05K/W M s to heatsink M5 4.25 5.75Nm M t to terminals M52.553.45Nm a 5 * 9.81m/s²w75g2Rev. 3.0–31.05.2022© by SEMIKRON© by SEMIKRON Rev. 3.0–31.05.202234Rev. 3.0–31.05.2022© by SEMIKRONThis is an electrostatic discharge sensitive device (ESDS) due to international standard IEC 61340.*IMPORTANT INFORMATION AND WARNINGSThe specifications of SEMIKRON products may not be considered as guarantee or assurance of product characteristics("Beschaffenheitsgarantie"). The specifications of SEMIKRON products describe only the usual characteristics of products to be expected inSKKHtypical applications, which may still vary depending on the specific application. Therefore, products must be tested for the respective application in advance. Application adjustments may be necessary. The user of SEMIKRON products is responsible for the safety of their applications embedding SEMIKRON products and must take adequate safety measures to prevent the applications from causing a physical injury, fire or other problem if any of SEMIKRON products become faulty. The user is responsible to make sure that the application design is compliant with all applicable laws, regulations, norms and standards. Except as otherwise explicitly approved by SEMIKRON in a written document signed by authorized representatives of SEMIKRON, SEMIKRON products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury. No representation or warranty is given and no liability is assumed with respect to the accuracy, completeness and/or use of any information herein, including without limitation, warranties of non-infringement of intellectual property rights of any third party. SEMIKRON does not assume any liability arising out of the applications or use of any product; neither does it convey any license under its patent rights, copyrights, trade secrets or other intellectual property rights, nor the rights of others. SEMIKRON makes no representation or warranty of non-infringement or alleged non-infringement of intellectual property rights of any third party which may arise from applications. Due to technical requirements our products may contain dangerous substances. For information on the types in question please contact the nearest SEMIKRON sales office. This document supersedes and replaces all information previously supplied and may be superseded by updates. SEMIKRON reserves the right to make changes.5。