Phase diagram and optical conductivity of the one-dimensional spinless Holstein model
高炉炼铁专业英语
4 冶金过程物理化学4.1 冶金过程热力学冶金过程热力学thermodynamics of metallurgical processes 统计热力学statistical thermodynamics不可逆过程热力学thermodynamics of irreversible processes 化学热力学chemical thernodynamics表面热力学surface thermodynamics合金热力学thermodynamics of alloys冶金热力学数据库thermodynamics databank in metallurgy 系system单元系single-componentsystem多元系multicomponent system均相系统homogeneous system广度性质extensive property强度性质intensive property过程process等温过程isothermal process等压过程isobaric process等容过程isochoric process绝热过程adiabatic process可逆过程reversible process不可逆过程irreversible process自发过程spontaneous process自理过程physical process化学过程chemical process冶金过程metallurgical process化学反应chemical reaction化合反应combination reaction分解反应decomposition reaction置换反应displacement reaction可逆反应reversible reaction不可逆反应irreversible reaction电化学反应electrochemical reaction多相反应multiphase reaction固态反应solid state reaction气一金(属)反应gas-metal reaction渣一金(属)反应slag-metal reaction平衡equilibrium化学平衡chemical equilibrium相平衡phase equilibrium热力学平衡thermodynamic equilibrium亚稳平衡metastable equilibrium热力学函数thermodynamic function偏摩尔量partial molar quantity总摩尔量integral molar quantity标准态standard state焓enthalpy生成焓enthalpy of formation反应焓enthalpy of reaction熵entropy吉布斯能Gibbs energy生成吉布斯能Gibbs energy of formation 反应吉布斯能Gibbs energy of reaction溶解吉布斯能Gibbs energy of solution吉布斯能函数Gibbs energy function化学位chemical potential热化学thermochemistry热效应heat effect热容heat capacity熔化热heat of fusion汽化热heat of vaporization升华热heat of sublimation相变热heat of phase transformation放热反应exothermic reaction吸热反应endothermic reaction赫斯定律Hess’s law相律phase rule相图phase diagram一元相图single-component phase diagram 二元相图binary-component phase diagram 三元相图ternary-component phase diagram 液相线liquidus固相线solidus共晶点eutectic point杠杆规则lever rule溶液solution溶质solute溶剂solvent固溶体solid solution溶液浓度concentration of solution摩尔分数mole fraction冶金熔体metallurgical melt金属熔体metal melt(炉)渣,熔渣slag熔盐molten salt, fused salt理想溶液ideal solution真实溶液real solution正规溶液regular solution活度activity活度系数activity coefficient拉乌尔定律Raoult’s law亨利定律Henry’s law纯物质标准态pure substance standard质量1%溶液标准(态)1 mass% solution standard无限稀溶液参考态reference state of infinityly dilute solution相互作用系数interaction coefficient化学反应等温式chemical reaction isotherm吉布斯~亥姆霍兹方程Gibbs-Helmholtz equation质量作用定律law of mass action平衡常数equilibrium constant平衡值equilibrium value直接还原direct reduction间接还原indirect reduction金属热还原metallothermic reduction选择性氧化selective oxidation渣碱度basicity of slag光学破度optical basicity酸性氧化物acid oxide碱性氧化物basicoxide两性氧化物amphoteric泡沫渣foaming slag熔渣的分子理论molecular theory of slag熔渣的离子理论ionization theory of slag脱氧平衡deoxidation equilibrium脱氧常数deoxidation constant熔渣脱硫desulfurization by slag气态脱硫desulfurization in the gaseous state硫分配比sulfur partition ratio硫化物容量sulfide capacity氧化脱磷dephosphorization under oxidizing atmosphere磷分配比碳一氧平衡carbon-oxygen equilibrium真空脱碳vacuum decarburization去气degassing去除非金属夹杂(物)elimination of nonmetallic inclusion非金属夹杂(物)变形form modification of nonmetallic inclusion 脱硅desiliconization脱锰demanganization分配平衡distribution law化学气相沉积chemical vapor deposition(CVD)4.2 冶金过程动力学微观动力学microkinetics化学动力学chemical kinetics反应途径reaction path反应机理reaction mechanism基元反应elementary reaction平行反应parallel链反应chain reaction总反应overall reaction反应速率reaction rate反应速率常数reaction rate constant反应级数reaction order零级反应zero order reaction一级反应first order reaction二级反应second order reactionn级反应nth order reaction碰撞理论collision theory活化能activation energy表现活化能apparent activation energy阿伦尼乌斯方程Arrhenius equation半衰期half-life宏观动力学macrokinetics冶金过程动力学kinetics of metallurgical process传输现象transport phenomena传质mass transfer传热heat transfer动量传输momentum transfer层流laminar flow湍流turbulent flow气泡gas bubble鼓泡bubbling射流jet液滴liquid droplet粘度viscosity边界层boundary layer流率flow rate通量flux扩散diffusion菲克第一扩散定律Fick’s 1st law of diffusion菲克第一扩散定律Fick’s 2nd law of diffusion扩散系数diffusion coefficient传质系数mass transfer coefficient热传导heat conduction热对流heat convection自然对流natural convection强制对流forced convection热辐射heat radiation导热率thermal conductivity传热系数heat transfer coefficient体内浓度bulk concentration未反应核模型unreacted core model扩散控制反应diffusion-controlled reaction化学控制反应chenical-controlled reaction混合控制反应mixed-controlled reaction相似原理priciple of similarity雷诺数Reynolds number固定床fiexed bed填充床packed bed移动床moving bed流态化床fluidized bed混合时间mixing time停留时间residence time, retention time催化catalysis催化剂catalyst表面能surface energy表面张力surface tension界面能interfacial energy界面张力interfacial tension润湿wetting表面活性物质surface-active substance吸收absorption吸附absorption4.3 冶金电化学冶金电化学metallurgical electrochemistry熔盐电化学electrochemistry of fused salts固态离子学solid state ionics电解质溶液electrolyte solution阳离子cation阴离子anion电导conductance电导率conductivity电阻resistance电极electrode阴极cathode阳极anode电镀electroplating固体电解质solid electrolyte稳定的氧化锆stablized zirconia氧传感器oxygen sensor硅传感器silicon sensor定氧测头oxygen probe定硅测头silicon probe4.4 冶金物理化学研究方法冶金物理化学研究方法research methods in metallurgical physical chemistry热电偶thermocouple量热计calorimeter热太平thermobalance热分析thermal analysis差热分析differential thermal analysis,DTA热重法thermogravimetry分子筛molecular sieve5 钢铁冶金5.1 炼焦炼焦coking高温炭化high temperature carbonization塑性成焦机理plastic mechanism of coke formation中间相成焦机理mesophase mechanism of coke formation选煤coal preparation, coal washing配煤coal blending配煤试验coal blending test炼焦煤coking coal气煤gas coal肥煤fat coal瘦煤lean coal焦炉coke oven焦化室oven chamber焦饼coke cake结焦时间coking time周转时间cycle time装煤coal charging捣固装煤stamp charging推焦coke pushing焦炭熄火coke quenching干法熄焦dry quenching of coke焦台coke wharf装煤车larry car推焦机pushing machine拦焦机coke guide熄焦车quenching car焦炉焖炉banking for coke oven焦炭coke冶金焦metallurgical coke铸造焦foundry coke焦炭工业分析proximate analysis of coke焦炭元素分析ultimate analysis of coke焦炭落下指数shatter index of coke焦炭转鼓指数drum index of coke焦炭热强度hot strength of coke焦炭反应性coke reactivity焦炭反应后强度post-reaction strength of coke 焦炭显微强度microstrength of coke焦炉煤气coke oven gas发热值calorific value煤焦油coal tar粗苯crude benzol苯benzene甲苯toluene二甲苯xylene苯并呋喃-茚树脂coumarone-indene resin精萘refined naphthalene精蒽refined anthracene煤[焦油]沥青coal tar pitch沥青焦pitch coke针状焦needle coke型焦formcoke5.2 耐火材料耐火材料refractory materials耐火粘土fireclay高岭土kaolin硬质粘土flint clay轻质粘土soft clay陶土pot clay蒙脱石montmorillonite叶蜡石pyrophyllite膨润土bentonite鳞石英tridymite方石英cristobalite砂岩sandstone耐火石firestone莫来石mullite氧化铝alumina烧结氧化铝sintered alumina电熔氧化铝fused alumina刚玉corundum红柱石andalusite蓝晶石kyanite,cyanite硅线石sillimanite橄榄石olivine方镁石periclase镁砂magnesia合成镁砂synthetic sintered magnesia电熔镁砂fused magnesia烧结白云石砂sintered dolomite clinker合成镁铬砂synthetic magnesia chromite clinker尖晶石spinel镁铬尖晶石magnesia chrome spinel,magnesiochromite 硅藻土diatomaceous earth, infusorial earth蛭石vermiculite珍珠岩perlite碳化硅silicon carbide氮化硅silicon nitride氮化硼boron nitride粘土熟料chamotte熟料grog轻烧light burning,soft burning死烧dead burning,hard burning成型模注shaping moulding机压成型mechanical pressing等静压成型isostatic pressing摩擦压砖机friction press液压压砖机hydraulic press捣打成型ramming process熔铸成型fusion cast process砖坯强度green strength,dry strength隧道窑tunnel kiln回转窑rotary kiln倒焰窑down draught kiln耐火砖refractory brick标准型耐火砖standard size refractory brick泡砂石quartzite sandstone酸性耐火材料acid refractory [material]硅质耐火材料siliceous refractory [material]硅砖silica brick,dinas brick熔融石英制品fused quartz product硅酸铝质耐火材料aluminosillicate refractory半硅砖semisilica brick粘土砖fireclay brick,chamotte brick石墨粘土砖graphite clay brick高铝砖high alumina brick硅线石砖sillimanite brick莫来石砖mullite brick刚玉砖corundum brick铝铬砖alumina chrome brick熔铸砖fused cast brick碱性耐火材料basic refractory [material]镁质耐火材料magnesia refractory [material]镁砖magnesia brick镁铝砖magnesia alumina brick镁铬砖magnesia chrome brick镁炭砖magnesia carbon brick中性耐火材料neutral refractory [material]复合砖composite brick铝炭砖alumina carbon brick铝镁炭转alumina magnesia brick锆炭砖zirconia graphite brick镁钙炭砖magnesia clacia carbon brick长水口long nozzle浸入式水口immersion nozzle,submerged nozzle 定径水口metering nozzle氧化铝-碳化硅-炭砖Al2O3-SiC-C brick透气砖gas permeable brick,porous brick滑动水口slide gate nozzle水口砖nozzle brick塞头砖stopper绝热耐火材料insulating refractory轻质耐火材料light weight refractory袖砖sleeve brick格子砖checker brick,chequer brick陶瓷纤维ceramic fiber耐火纤维refractory fiber耐火浇注料refractory castable耐火混凝土refractory concrete荷重耐火性refractoriness under load抗渣性slagging resistance耐磨损性abrasion resistance5.3 碳素材料[含]碳[元]素材料carbon materials无定形碳amorphous carbon金刚石diamond炭相[学]carbon micrography炭黑carbon black石油沥青petroleum pitch石油焦炭petroleum coke石墨化graphitization石墨化电阻炉electric resistance furnace for graphitization 石墨纯净化处理purification treatment of graphite炭砖carbon brick炭块carbon block碳化硅基炭块SiC-based carbon block炭电极carbon electrode连续自焙电极Soderberg electrode石墨电极graphite electrode超高功率石墨电极ultra-high power graphite electrode石墨电极接头graphite electrode nipple石墨电极接头孔graphite electrode socket plug电极糊electrode paste石墨坩埚graphite crucible石墨电阻棒graphite rod resistor炭刷carbon brush高纯石墨high purity graphite5.4 铁合金铁合金ferroalloy硅铁ferrosilicon硅钙calcium silicon金属硅silicon metal锰铁ferromangnanese低碳锰铁low carbon ferromanganese硅锰silicomanganese金属锰manganese metal铬铁ferrochromium低碳铬铁low carbon ferrochromium微碳铬铁extra low carbon ferrochromium硅铬silicochromium金属铬chromium metal钨铁ferrotunsten钼铁ferromolybdenum钛铁ferrotitanium硼铁ferroboron铌铁ferroniobium磷铁ferrophosphorus镍铁ferronickel锆铁ferrozirconium硅锆silicozirconium稀土硅铁rare earth ferrosilicon稀土镁硅铁rare earth ferrosilicomagnesium成核剂nucleater孕育剂incubater,inoculant球化剂nodulizer蠕化剂vermiculizer中间铁合金master alloy复合铁合金complex ferroalloy电碳热法electro-carbothermic process电硅热法electro-silicothermic process铝热法aluminothermic process,thermit process电铝热法electro-aluminothermic process开弧炉open arc furnace埋弧炉submerged arc furnace半封闭炉semiclosed furnace封闭炉closed furnace矮烟罩电炉electric furnace with low hood矮炉身电炉low-shaft electric furnace5.5 烧结与球团人造块矿ore agglomerates烧结矿sinter压块矿briquette球团[矿] pellet针铁矿goethite自熔性铁矿self-fluxed iron ore复合铁矿complex iron ore块矿lump ore粉矿ore fines矿石混匀ore blending配矿ore proportioning矿石整粒ore size grading返矿return fines储矿场ore stockyard矿石堆料机ore stocker匀矿取料机ore reclaimer熔剂flux消石灰slaked lime活性石灰quickened lime有机粘结剂organic binder烧结混合料sinter mixture烧结铺底料hearth layer for sinter烧结sintering烧结热前沿heat front in sintering烧结火焰前沿flame front in sintering渣相粘结slag bonding扩散粘结diffusion bonding带式烧结机Dwight-Lloyd sintering machine环式烧结机circular travelling sintering machine烧结梭式布料机shuttle conveyer belt烧结点火料sintering ignition furnace烧结盘sintering pan烧结锅sintering pot烧结冷却机sinter cooler带式冷却机straight-line cooler环式冷却机circular cooler,annular cooler生球green pellet,ball生球长大聚合机理ball growth by coalescence生球长大成层机理ball growth by layering生球长大同化机理ball growth by assimilation精矿成球指数balling index for iron ore concentrates 生球转鼓强度drum strength of green pellet生球落下强度shatter strength of green pellet生球抗压强度compression strength of green pellet 生球爆裂温度cracking temperature of green pellet 圆筒造球机balling drum圆盘造球机balling disc竖炉陪烧球团shaft furnace for pellet firing带式机陪烧球团traveling grate for pellet firing链算机-回转窑陪烧球团grate-kiln for pellet firing 环式机陪烧球团circular gates for pellet firing冷固结球团cold bound pellet维式体wustite铁橄榄石fayalite铁尖晶石hercynite铁黄长石ferrogehlenite铁酸半钙calcium diferrite铁酸钙calcium ferrite铁酸二钙dicalcium ferrite锰铁橄榄石knebelite钙铁橄榄石kirschsteinite钙铁辉石hedenbergite钙铁榴石andradite钙长石anorthite钙镁橄榄石monticellite钙钛矿perovskite硅灰石wollastonite硅酸二钙dicalcium silicate硅酸三钙tricalcium silicate镁橄榄石forsterite镁黄长石akermanite镁蔷薇辉石manganolite钙铝黄长石gehlenite钛辉石titanaugite枪晶石cuspidine预还原球团pre-reduced pellet金属化球团metallized pellet转鼓试验drum test,tumbler test落下试验shatter test5.6 高炉炼铁炼铁iron making高炉炼铁[法] blast furnace process高炉blast furnace鼓风炉blast furnace炉料charge, burden矿料ore charge焦料coke charge炉料提升charge hoisting小车上料charge hoisting by skip吊罐上料charge hoisting by bucket皮带上料charge hoisting by belt conveyer装料charging装料顺序charging sequence储料漏斗hopper双料钟式装料two-bells system charging无料钟装料bell-less charging布料器distributor炉内料线stock line in the furnace探料尺gauge rod利用系数utilization coefficient冶炼强度combustion intensity鼓风blast风压blast pressure风温blast temperature鼓风量blast volume鼓风湿度blast humidity全风量操作full blast慢风under blowing休风delay喷吹燃料fuel injection喷煤coal injection喷油oil injection富氧鼓风oxygen enriched blast,oxygen enrichment 置换比replacement ratio喷射器injector热补偿thermal compensation焦比coke ratio,coke rate燃料比fuel ratio,fuel rate氧化带oxidizing zone风口循环区raceway蒸汽鼓风humidified blast混合喷吹mixed injection脱湿鼓风dehumidified blast炉内压差pressure drop in furnace煤气分布gas distribution煤气利用率gas utilization rate炉况furnace condition顺行smooth running焦炭负荷coke load,ore to coke ratio软熔带cohesive zone,softening zone渣比slag to iron ratio,slag ratio上部[炉料]调节burden conditioning下部[鼓风]调节blast conditioning高炉作业率operation rate of blast furnace 休风率delay ratio高炉寿命blast furnace campaign悬料hanging崩料slip沟流channeling结瘤scaffolding炉缸冻结hearth freeze-up开炉blow on停炉blow off积铁salamander炉型profile,furnace lines炉喉throat炉身shaft,stack炉腰belly炉腹bosh炉缸hearth炉底bottom炉腹角bosh angle炉身角stack angle有效容积effective volume工作容积working bolume铁口iron notch, slag notch渣口cinder notch, slag notch风口tuyere窥视孔peep hole风口水套tuyere cooler渣口水套slag notch cooler风口弯头tuyere stock热风围管bustle pipe堵渣机stopper泥炮mud gun,clay gun开铁口机iron notch drill铁水hot metal铁[水]罐iron ladle鱼雷车torpedo car主铁沟sow出铁沟casting house铁沟iron runner渣沟slag runner渣罐cinder ladle, slag ladle撇渣器skimmer冷却水箱cooling plate冷却壁cooling stave汽化冷却vaporization cooling热风炉hot blast stove燃烧室combustion chamber燃烧器burner热风阀hot blast valve烟道阀chimney valve冷风阀cold blast valve助燃风机burner blower切断阀burner shut-off valve旁通阀by-pass valve混风阀mixer selector valve送风期on blast of stove,on blast燃烧期on gas of stove, on gas换炉stove changing放散阀blow off valve内燃式热风炉Cowper stove外燃式燃烧炉outside combustion stove 顶燃式热风炉top combustion stove炉顶放散阀bleeding valve放散管bleeder上升管gas uptake放风阀snorting valve均压阀equalizing valve高压调节阀septum valve炉顶高压elevated top pressure铸铁机pig-casting machine铸铁模pig mold冲天炉cupola水渣granulating slag水渣池granulating pit渣场slag disposal pit高炉煤气top gas,blast furnace gas高炉煤气回收topgas recovery,TGR非焦炭炼铁non-coke iron making直接还原炼铁[法]direct reduction iron making直接还原铁directly reduced iron,DRI竖炉直接炼铁direct reduction in shaft furnace流态化炼铁fluidized-bed iron making转底炉炼铁rotary hearth iron making米德雷克斯直接炼铁[法]Midrex processHYL直接炼铁[法] HYL process克虏伯回转窑炼铁[法] Krupp rotary kiln iron-making 熔态还原smelting reduction铁溶法iron-bath process科雷克斯法COREX process生铁pig iron海绵铁sponge iron镜铁spiegel iron清铁法H-rion process。
材料科学与工程专业英语1-19单元课后翻译答案
1.“材料科学”涉及到研究材料的结构与性能的关系。
相反,材料工程是根据材料的结构与性质的关系来涉及或操控材料的结构以求制造出一系列可预定的性质。
2.实际上,所有固体材料的重要性质可以分为六类:机械、电学、热学、磁学、光学、腐蚀性。
3.除了结构与性质,材料科学与工程还有其他两个重要的组成部分,即加工与性能。
4.工程师或科学家越熟悉材料的各种性质、结构、性能之间的关系以及材料的加工技术,根据以上的原则,他或她就会越自信与熟练地对材料进行更明智的选择。
5.只有在少数情况下,材料才具有最优或最理想的综合性质。
因此,有时候有必要为某一性质而牺牲另一性能。
6.Interdisciplinary dielectric constant Solid material(s) heat capacity Mechanical property electromagnetic radiation Material processing elastic modulus7.It was not until relativcal properties relate deformation to an applied load or force.Unit 21. 金属是电和热很好的导体,在可见光下不透明;擦亮的金属外表有金属光泽。
2. 陶瓷是典型的导热导电的绝缘体,并且比金属和聚合物具有更高的耐热温度和耐恶劣环境性能。
3. 用于高科技领域的材料有时也被称为先进材料。
4. 压电陶瓷在电场作用下膨胀和收缩;反之,当它们膨胀和收缩时,他们也能产生一个电场。
5. 随着能够观察单个原子或者分子的扫描探针显微镜的出现,操控和移动原子和分子以形成新结构成为可能,因此,我们能通过一些简单的原子水平的构建就可以设计出新的材料。
6. advanced materials ceramic materials high-performance materials clay minerals alloy implant glass fibre carbon nanotube7. Metallic materials have large numbers of nonlocalized electrons and many properties of metals are directly attributable to these electrons.8. Many of polymeric materials are organic compounds with very large molecular structures.9. Semiconductors hace electrical properties that are intermediate between the electrical conductors(viz. metals and metal alloys) and insulators(viz. ceramics and polymers). 10. Biomaterials must not produce toxic substances and must be compatible with body tissues.Unit 31.金属的行为〔性质〕不同于陶瓷的行为〔性质〕,陶瓷的行为〔性质〕不同于聚合物的行为〔性质〕。
半导体一些术语的中英文对照
半导体一些术语的中英文对照离子注入机ionimplanterLSS理论LindhandScharffandSchiotttheory 又称“林汉德-斯卡夫-斯高特理论”。
沟道效应channelingeffect射程分布rangedistribution深度分布depthdistribution投影射程projectedrange负性光刻胶negativephotoresist正性光刻胶positivephotoresist无机光刻胶inorganicresist多层光刻胶multilevelresist电子束光刻胶electronbeamresistX射线光刻胶X-rayresist刷洗scrubbing甩胶spinning涂胶photoresistcoating后烘postbaking光刻photolithographyX射线光刻X-raylithography电子束光刻electronbeamlithography离子束光刻ionbeamlithography深紫外光刻deep-UVlithography光刻机maskaligner投影光刻机projectionmaskaligner曝光exposure接触式曝光法contactexposuremethod接近式曝光法proximityexposuremethod光学投影曝光法opticalprojectionexposuremethod磷硅玻璃phosphorosilicateglass硼磷硅玻璃boron-phosphorosilicateglass钝化工艺passivationtechnology 多层介质钝化multilayerdielectricpassivation划片scribing电子束切片electronbeamslicing烧结sintering印压indentation热压焊thermocompressionbonding热超声焊thermosonicbonding冷焊coldwelding点焊spotwelding球焊ballbonding楔焊wedgebonding内引线焊接innerleadbonding外引线焊接outerleadbonding梁式引线beamlead装架工艺mountingtechnology附着adhesion封装packaging金属封装metallicpackagingAmbipolar双极的Ambienttemperature环境温度Amorphous无定形的,非晶体的Amplifier功放扩音器放大器Analogue(Analog)comparator模拟比较器Angstrom埃Anneal退火Anisotropic各向异性的Anode阳极Arsenic(AS)砷Auger俄歇Augerprocess俄歇过程Avalanche雪崩Avalanchebreakdown雪崩击穿Avalancheexcitation雪崩激发Backgroundcarrier本底载流子Backgrounddoping本底掺杂Backward反向Backwardbias反向偏置Ballastingresistor整流电阻Ballbond球形键合Band能带Bandgap能带间隙Barrier势垒Barrierlayer势垒层Barrierwidth势垒宽度Base基极Basecontact基区接触Basestretching基区扩展效应Basetransittime基区渡越时间Basetransportefficiency基区输运系数Base-widthmodulation基区宽度调制Basisvector基矢Bias偏置Bilateralswitch双向开关Binarycode二进制代码Binarycompoundsemiconductor二元化合物半导体Bipolar双极性的BipolarJunctionTransistor(BJT)双极晶体管Bloch布洛赫Blockingband阻挡能带Chargeconservation电荷守恒Chargeneutralitycondition电中性条件Chargedrive/exchange/sharing/transfer/storage电荷驱动/交换/共享/转移/存储Chemmicaletching化学腐蚀法Chemically-Polish化学抛光Chemmically-MechanicallyPolish(CMP)化学机械抛光Chip芯片Chipyield芯片成品率Clamped箝位Clampingdiode箝位二极管Cleavageplane解理面Clockrate时钟频率Clockgenerator时钟发生器Clockflip-flop时钟触发器Close-packedstructure密堆积结构Close-loopgain闭环增益Collector集电极Collision碰撞CompensatedOP-AMP补偿运放Common-base/collector/emitterconnection共基极/集电极/发射极连接Common-gate/drain/sourceconnection共栅/漏/源连接Common-modegain共模增益Common-modeinput共模输入Common-moderejectionratio(CMRR)共模抑制比Compatibility兼容性Compensation补偿Compensatedimpurities补偿杂质Compensatedsemiconductor补偿半导体ComplementaryDarlingtoncircuit互补达林顿电路ComplementaryMetal-Oxide-SemiconductorField-Effect-Transistor(CMOS)互补金属氧化物半导体场效应晶体管Complementaryerrorfunction余误差函数Computer-aideddesign(CAD)/test(CAT)/manufacture(CAM)计算机辅助设计/测试/制De.broglie德布洛意Decderate减速Decibel(dB)分贝Decode译码Deepacceptorlevel深受主能级Deepdonorlevel深施主能级Deepimpuritylevel深度杂质能级Deeptrap深陷阱Defeat缺陷Degeneratesemiconductor简并半导体Degeneracy简并度Degradation退化DegreeCelsius(centigrade)/Kelvin摄氏/开氏温度Delay延迟Density密度Densityofstates态密度Depletion耗尽Depletionapproximation耗尽近似Depletioncontact耗尽接触Depletiondepth耗尽深度Depletioneffect耗尽效应Depletionlayer耗尽层DepletionMOS耗尽MOSDepletionregion耗尽区Depositedfilm淀积薄膜Depositionprocess淀积工艺Designrules设计规则Die芯片(复数dice)Diode二极管Dielectric介电的Dielectricisolation介质隔离Difference-modeinput差模输入Differentialamplifier差分放大器Differentialcapacitance微分电容Diffusedjunction扩散结Diffusion扩散Diffusioncoefficient扩散系数Diffusionconstant扩散常数Diffusivity扩散率Diffusioncapacitance/barrier/current/furnace扩散电容/势垒/电流/炉Electrostatic静电的Element元素/元件/配件Elementalsemiconductor元素半导体Ellipse椭圆Ellipsoid椭球Emitter发射极Emitter-coupledlogic发射极耦合逻辑Emitter-coupledpair发射极耦合对Emitterfollower射随器Emptyband空带Emittercrowdingeffect发射极集边(拥挤)效应Endurancetest=lifetest寿命测试Energystate能态Energymomentumdiagram能量-动量(E-K)图Enhancementmode增强型模式EnhancementMOS增强性MOSEntefic(低)共溶的Environmentaltest环境测试Epitaxial外延的Epitaxiallayer外延层Epitaxialslice外延片Expitaxy外延Equivalentcurcuit等效电路Equilibriummajority/minoritycarriers平衡多数/少数载流子ErasableProgrammableROM(EPROM)可搽取(编程)存储器Errorfunctioncomplement余误差函数Etch刻蚀Etchant刻蚀剂Etchingmask抗蚀剂掩模Excesscarrier过剩载流子Excitationenergy激发能Excitedstate激发态Exciton激子Extrapolation外推法Extrinsic非本征的Extrinsicsemiconductor杂质半导体Face-centered面心立方Falltime下降时间Heatsink散热器、热沉Heavy/lightholeband重/轻空穴带Heavysaturation重掺杂Hell-effect霍尔效应Heterojunction异质结Heterojunctionstructure异质结结构HeterojunctionBipolarTransistor(HBT)异质结双极型晶体Highfieldproperty高场特性High-performanceMOS.(H-MOS)高性能MOS.Hormalized归一化Horizontalepitaxialreactor卧式外延反应器Hotcarrior热载流子Hybridintegration混合集成Image-force镜象力Impactionization碰撞电离Impedance阻抗Imperfectstructure不完整结构Implantationdose注入剂量Implantedion注入离子Impurity杂质Impurityscattering杂志散射Incrementalresistance电阻增量(微分电阻)In-contactmask接触式掩模Indiumtinoxide(ITO)铟锡氧化物Inducedchannel感应沟道Infrared红外的Injection注入Inputoffsetvoltage输入失调电压Insulator绝缘体InsulatedGateFET(IGFET)绝缘栅FETIntegratedinjectionlogic集成注入逻辑Integration集成、积分Interconnection互连Interconnectiontimedelay互连延时Interdigitatedstructure交互式结构Interface界面Interference干涉Internationalsystemofunions国际单位制Internallyscattering谷间散射Matching匹配Maxwell麦克斯韦Meanfreepath平均自由程Meanderedemitterjunction梳状发射极结Meantimebeforefailure(MTBF)平均工作时间Megeto-resistance磁阻Mesa台面MESFET-MetalSemiconductor金属半导体FETMetallization金属化Microelectronictechnique微电子技术Microelectronics微电子学Millenindices密勒指数Minoritycarrier少数载流子Misfit失配Mismatching失配Mobileions可动离子Mobility迁移率Module模块Modulate调制Molecularcrystal分子晶体MonolithicIC单片ICMOSFET金属氧化物半导体场效应晶体管Mos.Transistor(MOST)MOS.晶体管Multiplication倍增Modulator调制Multi-chipIC多芯片ICMulti-chipmodule(MCM)多芯片模块Multiplicationcoefficient倍增因子Nakedchip未封装的芯片(裸片)Negativefeedback负反馈Negativeresistance负阻Nesting套刻Negative-temperature-coefficient负温度系数Noisemargin噪声容限Nonequilibrium非平衡Nonrolatile非挥发(易失)性Normallyoff/on常闭/开Numericalanalysis数值分析Occupiedband满带Officienay功率Photoelectriccell光电池Photoelectriceffect光电效应Photoenicdevices光子器件Photolithographicprocess光刻工艺(photo)resist(光敏)抗腐蚀剂Pin管脚Pinchoff夹断PinningofFermilevel费米能级的钉扎(效应)Planarprocess平面工艺Planartransistor平面晶体管Plasma等离子体Plezoelectriceffect压电效应Poissonequation泊松方程Pointcontact点接触Polarity极性Polycrystal多晶Polymersemiconductor聚合物半导体Poly-silicon多晶硅Potential(电)势Potentialbarrier势垒Potentialwell势阱Powerdissipation功耗Powertransistor功率晶体管Preamplifier前置放大器Primaryflat主平面Principalaxes主轴Print-circuitboard(PCB)印制电路板Probability几率Probe探针Process工艺Propagationdelay传输延时Pseudopotentialmethod膺势发Punchthrough穿通Pulsetriggering/modulating脉冲触发/调制Pulse WidenModulator(PWM)脉冲宽度调制Punchthrough穿通Push-pullstage推挽级Qualityfactor品质因子Quantization量子化Schottkybarrier肖特基势垒Schottkycontact肖特基接触Schrodingen薛定厄Scribinggrid划片格Secondaryflat次平面Seedcrystal籽晶Segregation分凝Selectivity选择性Selfaligned自对准的Selfdiffusion自扩散Semiconductor半导体Semiconductor-controlledrectifier可控硅Sendsitivity灵敏度Serial串行/串联Seriesinductance串联电感Settletime建立时间Sheetresistance薄层电阻Shield屏蔽Shortcircuit短路Shotnoise散粒噪声Shunt分流Sidewallcapacitance边墙电容Signal信号Silicaglass石英玻璃Silicon硅Siliconcarbide碳化硅Silicondioxide(SiO2)二氧化硅SiliconNitride(Si3N4)氮化硅SiliconOnInsulator绝缘硅Siliverwhiskers银须Simplecubic简立方Singlecrystal单晶Sink沉Skineffect趋肤效应Snaptime急变时间Sneakpath潜行通路Sulethreshold亚阈的Solarbattery/cell太阳能电池Solidcircuit固体电路SolidSolubility固溶度Sonband子带Transistoraging(stress)晶体管老化Transittime渡越时间Transition跃迁Transition-metalsilica过度金属硅化物Transitionprobability跃迁几率Transitionregion过渡区Transport输运Transverse横向的Trap陷阱Trapping俘获Trappedcharge陷阱电荷Trianglegenerator三角波发生器Triboelectricity摩擦电Trigger触发Trim调配调整Triplediffusion三重扩散Truthtable真值表Tolerahce容差Tunnel(ing)隧道(穿)Tunnelcurrent隧道电流Turnover转折Turn-offtime关断时间Ultraviolet紫外的Unijunction单结的Unipolar单极的Unitcell原(元)胞Unity-gainfrequency单位增益频率Unilateral-switch单向开关Vacancy空位Vacuum真空Valence(value)band价带Valuebandedge价带顶Valencebond价键Vapourphase汽相Varactor变容管Varistor变阻器Vibration振动Voltage电压Wafer晶片Waveequation波动方程Waveguide波导Wavenumber波数CT:ContaminationThreshold??污染阀值Ctrl:Control控制;管理;抑制D:Die芯片DAC igitalAnalogConverter??数字转换器DSP igitalSignalProcessing数字信号处理EFO:ElevtronicFlame-Off电子打火系统FA:FaceAngle顶锥角(面锥角)FAB:FreeAirBall空气球FD:FloppyDisk软盘,软式磁碟片Frd:Forward??前进GEM:GenericHi:HightMagnification高倍率Hybd:Hybrid混合动力/混合式Impd:Impedence阻抗Ins:Inspection检查,检验L/F eadFrame框架Lo:LowMagnification低倍率PM reventiveMaintenance??PR atternRecognitionT/P:TopPlate??顶板UPH:UnitPerHour??每小时产量UTI:UltrasonicTransducerInterface超声波传感受器接口VLL:VisualLeadLocator导脚定位W/C:WireClamp??线夹W/H:WorkHolder??轨道W/S:WireSpool??线轴ESD:ElectroStaticDischarge静电释放EPa:ESDProtectedarea??静电防护区ESDS??????????????????????静电敏感设备BM:BreakdownMaintenance事后维修CM:CorrectiveMaintenance改良保养PVM:PreventiveMaintenance预防保养MP:MaintencePreventive保养预防PM:ProductionMaintenance生产保养BG:backgrinding??背部研磨DS:diesaw????将wafer切die DA:dieattach??=DB:diebond??装片WB:wirebond焊线????。
材料科学基础常用英语词汇
耔晶取向seed orientation,
籽晶生长seeded growth,
均质核化homogeneous nucleation,
异质核化heterogeneous nucleation,
均匀化热处理homogenization heat treatment,
成核生长相变nucleation–growth transition,
斯宾那多分解spinodal decomposition,
有序无序转变disordered-order transition,
马氏体相变martensite phase transformation,
成核nucleation,
耔晶取向seed orientation,
籽晶生长seeded growth,
均质核化homogeneous nucleation,
异质核化heterogeneous nucleation,
均匀化热处理homogenization heat treatment,
熟料grog,
自恰场self-consistent field
相变温度phase transition temperature,
相变压力phase transition pressure,
同质多晶转变polymorphic transformation,
相平衡条件phase equilibrium conditions,
显微结构microstructures,
热导率thermal conductivity,
应力和应变stress and strain,
弹性应变elastic strain,
金属材料工程专业相关英语词汇
金属材料工程专业相关英语词汇1. 金属材料学中文英文金属metal合金alloy晶体crystal晶格lattice晶胞unit cell点阵常数lattice constant空位vacancy间隙原子interstitial atom置换固溶体substitutional solid solution间隙固溶体interstitial solid solution相图phase diagram相phase组元component共晶eutectic包晶peritectic过共晶hypereutectic亚共晶hypoeutectic奥氏体austenite珠光体pearlite马氏体martensite贝氏体bainite铁素体ferrite渗碳体cementite合金化元素alloying element强化机制strengthening mechanism固溶强化solid solution strengthening畸变强化strain hardening沉淀强化precipitation hardening热处理heat treatment正火annealing回火tempering调质quenching and tempering表面硬化surface hardening渗碳carburizing渗氮nitriding铝合金aluminum alloy中文英文铜合金copper alloy镁合金magnesium alloy钛合金titanium alloy2. 材料力学中文英文应力stress应变strain弹性模量elastic modulus, Young's modulus, modulus of elasticity 泊松比Poisson's ratio屈服强度yield strength抗拉强度tensile strength断裂韧性fracture toughness蠕变creep疲劳fatigue应力集中系数stress concentration factor应力强度因子stress intensity factor裂纹尖端crack tip裂纹扩展crack propagation裂纹扩展速率crack growth rate塑性变形plastic deformation弹性变形elastic deformation滞弹性变形anelastic deformation粘弹性变形viscoelastic deformation滑移slip滑移面slip plane滑移方向slip direction柏氏矢量Burgers vector位错dislocation索氏体spheroidite索氏化spheroidization3. 材料物理中文英文电子结构electronic structure能带理论band theory半导体semiconductor禁带宽度band gap本征半导体intrinsic semiconductor掺杂半导体doped semiconductor非平衡载流子excess carrierPN结PN junction二极管diode晶体管transistor集成电路integrated circuit磁性材料magnetic material磁化强度magnetization磁畴magnetic domain矫顽力coercivity饱和磁化强度saturation magnetization铁磁性ferromagnetism反铁磁性antiferromagnetism顺磁性paramagnetism抗磁性diamagnetism铁电材料ferroelectric material自发极化强度spontaneous polarization矫顽电场强度coercive electric field压电效应piezoelectric effect光学材料optical material折射率refractive index反射率reflectance透射率transmittance吸收系数absorption coefficient发光效应luminescence effect荧光材料fluorescent material发光二极管(LED)light-emitting diode (LED)激光器(LD)laser diode (LD)4. 材料热力学中文英文热力学thermodynamics系统system环境surroundings状态state过程process平衡equilibrium状态方程equation of state热力学第一定律first law of thermodynamics热力学第二定律second law of thermodynamics 熵entropy焓enthalpy自由能free energy吉布斯自由能Gibbs free energy海姆霍兹自由能Helmholtz free energy化学势chemical potential活度activity活度系数activity coefficient相律phase rule吉布斯相图Gibbs phase diagram杠杆规则lever rule相变phase transition相变焓变enthalpy change of phase transition相变熵变entropy change of phase transition相变自由能变free energy change of phase transition材料反应material reaction反应焓变enthalpy change of reaction反应熵变entropy change of reaction反应自由能变free energy change of reaction5. 材料测试中文英文金相组织观察metallographic observation 金相显微镜metallographic microscope 抛光机polishing machine腐蚀剂etchant晶粒度grain size显微硬度测试仪(Microhardness tester)microhardness tester维氏硬度(Vickers hardness)Vickers hardness布氏硬度(Brinell hardness)Brinell hardness洛氏硬度(Rockwell hardness)Rockwell hardness拉伸试验(tensile test)tensile test拉伸试验机(tensile testing machine)tensile testing machine标准试样(standard specimen)standard specimen应力-应变曲线(stress-strain curve)stress-strain curve弹性模量(elastic modulus)elastic modulus屈服点(yield point)yield point抗拉强度(tensile strength)tensile strength断后伸长率(elongation at break)elongation at break断面收缩率(reduction of area)reduction of area6. 材料分析中文英文光谱分析spectroscopy原子发射光谱atomic emission spectroscopy原子吸收光谱atomic absorption spectroscopy紫外-可见光谱ultraviolet-visible spectroscopy红外光谱infrared spectroscopy拉曼光谱Raman spectroscopy质谱分析mass spectrometry电感耦合等离子体质谱inductively coupled plasma mass spectrometry 二次离子质谱secondary ion mass spectrometry色谱分析chromatography气相色谱gas chromatography液相色谱liquid chromatographyX射线衍射X-ray diffraction布拉格方程Bragg's lawX射线荧光分析X-ray fluorescence analysis电子显微镜electron microscope扫描电子显微镜(SEM)scanning electron microscope (SEM)透射电子显微镜(TEM)transmission electron microscope (TEM)能量色散X射线能谱(EDS)energy dispersive X-ray spectroscopy (EDS)电子能量损失能谱(EELS)electron energy loss spectroscopy (EELS)7. 材料加工中文英文铸造casting模具mold浇注pouring凝固solidification缩孔shrinkage cavity缩松shrinkage porosity砂型铸造sand casting金属型铸造metal mold casting精密铸造precision casting锻造forging热锻hot forging冷锻cold forging自由锻open die forging模锻closed die forging轧制rolling热轧hot rolling冷轧cold rolling平板轧机flat rolling mill形状轧机shape rolling mill拉拔drawing拉丝机wire drawing machine挤压extrusion直接挤压direct extrusion间接挤压indirect extrusion8. 材料表征中文英文电学性能electrical property电阻率resistivity电导率conductivity电容capacitance介电常数dielectric constant电极化polarization耐压强度breakdown strength磁学性能magnetic property磁化曲线magnetization curve磁滞回线hysteresis loop矫顽力coercivity剩余磁化强度remanence磁导率permeability磁阻率reluctivity光学性能optical property折射率refractive index反射率reflectance透射率transmittance吸收系数absorption coefficient发光效应luminescence effect荧光材料fluorescent material9. 材料设计中文英文材料选择material selection材料性能指数material performance index材料选择图material selection chart材料性能预测material property prediction本构关系constitutive relation有限元分析finite element analysis材料组合优化material combination optimization复合材料composite material多层板sandwich panel功能梯度材料functionally graded material材料失效分析material failure analysis应力集中stress concentration裂纹扩展crack propagation脆性断裂brittle fracture韧性断裂ductile fracture疲劳断裂fatigue fracture蠕变断裂creep fracture10. 材料科学前沿中文英文纳米材料nanomaterial纳米粒子nanoparticle纳米线nanowire纳米管nanotube石墨烯graphene全息石墨烯holographic graphene生物材料biomaterial生物相容性biocompatibility生物降解性biodegradability组织工程tissue engineering药物传递drug delivery智能材料smart material形状记忆合金shape memory alloy磁致伸缩合金magnetostrictive alloy压电材料piezoelectric material电致变色材料electrochromic material超弹性合金superelastic alloy超导材料superconducting material能源材料energy material太阳能电池solar cell燃料电池fuel cell锂离子电池lithium-ion battery钠离子电池sodium-ion battery环境材料environmental material环境友好型材料eco-friendly material环境降解型材料environmentally degradable material 环境适应型材料environmentally adaptive material光催化材料photocatalytic material二氧化钛titanium dioxide水净化材料water purification material空气净化材料air purification material重金属吸附材料heavy metal adsorption material。
半导体一些术语的中英文对照
半导体一些术语的中英文对照离子注入机ion implanterLSS理论Lindhand Scharff and Schiott theory 又称“林汉德—斯卡夫—斯高特理论".沟道效应channeling effect射程分布range distribution深度分布depth distribution投影射程projected range阻止距离stopping distance阻止本领stopping power标准阻止截面standard stopping cross section 退火annealing激活能activation energy等温退火isothermal annealing激光退火laser annealing应力感生缺陷stress-induced defect择优取向preferred orientation制版工艺mask—making technology图形畸变pattern distortion初缩first minification精缩final minification母版master mask铬版chromium plate干版dry plate乳胶版emulsion plate透明版see—through plate高分辨率版high resolution plate,HRP超微粒干版plate for ultra-microminiaturization 掩模mask掩模对准mask alignment对准精度alignment precision光刻胶photoresist又称“光致抗蚀剂”。
负性光刻胶negative photoresist正性光刻胶positive photoresist无机光刻胶inorganic resist多层光刻胶multilevel resist电子束光刻胶electron beam resistX射线光刻胶X-ray resist刷洗scrubbing甩胶spinning涂胶photoresist coating后烘postbaking光刻photolithographyX射线光刻X-ray lithography电子束光刻electron beam lithography离子束光刻ion beam lithography深紫外光刻deep-UV lithography光刻机mask aligner投影光刻机projection mask aligner曝光exposure接触式曝光法contact exposure method接近式曝光法proximity exposure method光学投影曝光法optical projection exposure method 电子束曝光系统electron beam exposure system分步重复系统step-and—repeat system显影development线宽linewidth去胶stripping of photoresist氧化去胶removing of photoresist by oxidation等离子[体]去胶removing of photoresist by plasma 刻蚀etching干法刻蚀dry etching反应离子刻蚀reactive ion etching, RIE各向同性刻蚀isotropic etching各向异性刻蚀anisotropic etching反应溅射刻蚀reactive sputter etching离子铣ion beam milling又称“离子磨削”。
冶金专业英语词汇整理
专业英语词汇1 总论采矿mining地下采矿underground mining露天采矿open cut mining, open pit mining, surface mining采矿工程mining engineering选矿(学)mineral dressing, ore beneficiation, mineral processing 矿物工程mineral engineering冶金(学)metallurgy过程冶金(学)process metallurgy提取冶金(学)extractive metallurgy化学冶金(学)chemical metallurgy物理冶金(学)physical metallurgy金属学Metallkunde冶金过程物理化学physical chemistry of process metallurgy冶金反应工程学metallurgical reaction engineering冶金工程metallurgical engineering钢铁冶金(学)ferrous metallurgy, metallurgy of iron and steel有色冶金(学)nonferrous metallurgy真空冶金(学)vacuum metallurgy等离子冶金(学)plasma metallurgy微生物冶金(学)microbial metallurgy喷射冶金(学)injection metallurgy钢包冶金(学)ladle metallurgy二次冶金(学)secondary metallurgy机械冶金(学)mechanical metallurgy焊接冶金(学)welding metallurgy粉末冶金(学)powder metallurgy铸造学foundry火法冶金(学)pyrometallurgy湿法冶金(学)hydrometallurgy电冶金(学)electrometallurgy氯冶金(学)chlorine metallurgy矿物资源综合利用engineering of comprehensive utilization of mineral resources中国金属学会The Chinese Society for Metals中国有色金属学会The Nonferrous Metals Society of China2 采矿采矿工艺mining technology有用矿物valuable mineral冶金矿产原料metallurgical mineral raw materials矿床mineral deposit特殊采矿specialized mining海洋采矿oceanic mining, marine mining矿田mine field矿山mine 露天矿山surface mine地下矿山underground mine矿井shaft矿床勘探mineral deposit exploration矿山可行性研究mine feasibility study矿山规模mine capacity矿山生产能力mine production capacity矿山年产量annual mine output矿山服务年限mine life矿山基本建设mine construction矿山建设期限mine construction period矿山达产arrival at mine full capacity开采强度mining intensity矿石回收率ore recovery ratio矿石损失率ore loss ratio工业矿石industrial ore采出矿石extracted ore矿体orebody矿脉vein海洋矿产资源oceanic mineral resources矿石ore矿石品位ore grade岩石力学rock mechanics岩体力学rock mass mechanics3 选矿选矿厂concentrator, mineral processing plant 工艺矿物学process mineralogy开路open circuit闭路closed circuit流程flowsheet方框流程block flowsheet产率yield回收率recovery矿物mineral粒度particle size粗颗粒coarse particle细颗粒fine particle超微颗粒ultrafine particle粗粒级coarse fraction细粒级fine fraction网目mesh原矿run of mine, crude精矿concentrate粗精矿rough concentrate混合精矿bulk concentrate最终精矿final concentrate尾矿tailings粉碎comminution破碎crushing磨碎grinding团聚agglomeration筛分screening, sieving分级classification富集concentration分选separation手选hand sorting重选gravity separation, gravity concentration 磁选magnetic separation电选electrostatic separation浮选flotation化学选矿chemical mineral processing自然铜native copper铝土矿bauxite冰晶石cryolite磁铁矿magnetite赤铁矿hematite假象赤铁矿martite钒钛磁铁矿vanadium titano-magnetite铁燧石taconite褐铁矿limonite菱铁矿siderite镜铁矿specularite硬锰矿psilomelane软锰矿pyrolusite铬铁矿chromite黄铁矿pyrite钛铁矿ilmennite金红石rutile萤石fluorite高岭石kaolinite菱镁矿magnesite重晶石barite石墨graphite石英quartz方解石calcite石灰石limestone白云石dolomite云母mica石膏gypsum硼砂borax石棉asbestos蛇纹石serpentine阶段破碎stage crushing粗碎primary crushing中碎secondary crushing细碎fine crushing 对辊破碎机roll crusher粉磨机pulverizer震动筛vibrating screen筛网screen cloth筛孔screen opening筛上料oversize筛下料undersize粗磨coarse grinding细磨fine grinding球磨机ball mill衬板liner分级机classifier自由沉降free setting沉积sedimentation石灰lime松油pine oil硫化钠sodium sulfide硅酸钠(水玻璃)sodium silicate, water glass过滤filtration过滤机filter给矿,给料feeding给矿机feeder在线分析仪on line analyzer在线粒度分析仪on line size analyzer超声粒度计ultrasonic particle sizer, supersonic particle sizer4 冶金过程物理化学冶金过程热力学thermodynamics of metallurgical processes 统计热力学statistical thermodynamics不可逆过程热力学thermodynamics of irreversible processes 化学热力学chemical thernodynamics表面热力学surface thermodynamics合金热力学thermodynamics of alloys冶金热力学数据库thermodynamics databank in metallurgy 系system单元系single-componentsystem多元系multicomponent system均相系统homogeneous system广度性质extensive property强度性质intensive property过程process等温过程isothermal process等压过程isobaric process等容过程isochoric process绝热过程adiabatic process可逆过程reversible process不可逆过程irreversible process自发过程spontaneous process自理过程physical process化学过程chemical process冶金过程metallurgical process化学反应chemical reaction化合反应combination reaction分解反应decomposition reaction置换反应displacement reaction可逆反应reversible reaction不可逆反应irreversible reaction电化学反应electrochemical reaction多相反应multiphase reaction固态反应solid state reaction气一金(属)反应gas-metal reaction渣一金(属)反应slag-metal reaction平衡equilibrium化学平衡chemical equilibrium相平衡phase equilibrium热力学平衡thermodynamic equilibrium亚稳平衡metastable equilibrium热力学函数thermodynamic function偏摩尔量partial molar quantity总摩尔量integral molar quantity标准态standard state焓enthalpy生成焓enthalpy of formation反应焓enthalpy of reaction熵entropy吉布斯能Gibbs energy生成吉布斯能Gibbs energy of formation 反应吉布斯能Gibbs energy of reaction溶解吉布斯能Gibbs energy of solution吉布斯能函数Gibbs energy function化学位chemical potential热化学thermochemistry热效应heat effect热容heat capacity熔化热heat of fusion汽化热heat of vaporization升华热heat of sublimation相变热heat of phase transformation放热反应exothermic reaction吸热反应endothermic reaction赫斯定律Hess’s law相律phase rule相图phase diagram一元相图single-component phase diagram 二元相图binary-component phase diagram 三元相图ternary-component phase diagram 液相线liquidus固相线solidus共晶点eutectic point杠杆规则lever rule溶液solution溶质solute溶剂solvent 固溶体solid solution溶液浓度concentration of solution摩尔分数mole fraction冶金熔体metallurgical melt金属熔体metal melt(炉)渣,熔渣slag熔盐molten salt, fused salt理想溶液ideal solution真实溶液real solution正规溶液regular solution活度activity活度系数activity coefficient拉乌尔定律Raoult’s law亨利定律Henry’s law纯物质标准态pure substance standard质量1%溶液标准(态)1 mass% solution standard无限稀溶液参考态reference state of infinityly dilute solution相互作用系数interaction coefficient化学反应等温式chemical reaction isotherm吉布斯~亥姆霍兹方程Gibbs-Helmholtz equation质量作用定律law of mass action平衡常数equilibrium constant平衡值equilibrium value直接还原direct reduction间接还原indirect reduction金属热还原metallothermic reduction选择性氧化selective oxidation渣碱度basicity of slag光学破度optical basicity酸性氧化物acid oxide碱性氧化物basicoxide两性氧化物amphoteric泡沫渣foaming slag熔渣的分子理论molecular theory of slag熔渣的离子理论ionization theory of slag脱氧平衡deoxidation equilibrium脱氧常数deoxidation constant熔渣脱硫desulfurization by slag气态脱硫desulfurization in the gaseous state硫分配比sulfur partition ratio硫化物容量sulfide capacity氧化脱磷dephosphorization under oxidizing atmosphere磷分配比碳一氧平衡carbon-oxygen equilibrium真空脱碳vacuum decarburization去气degassing去除非金属夹杂(物)elimination of nonmetallic inclusion非金属夹杂(物)变形form modification of nonmetallic inclusion 脱硅desiliconization脱锰demanganization分配平衡distribution law化学气相沉积chemical vapor deposition(CVD)4.2 冶金过程动力学微观动力学microkinetics化学动力学chemical kinetics反应途径reaction path反应机理reaction mechanism基元反应elementary reaction平行反应parallel链反应chain reaction总反应overall reaction反应速率reaction rate反应速率常数reaction rate constant反应级数reaction order零级反应zero order reaction一级反应first order reaction二级反应second order reactionn级反应nth order reaction碰撞理论collision theory活化能activation energy表现活化能apparent activation energy阿伦尼乌斯方程Arrhenius equation半衰期half-life宏观动力学macrokinetics冶金过程动力学kinetics of metallurgical process 传输现象transport phenomena传质mass transfer传热heat transfer动量传输momentum transfer层流laminar flow湍流turbulent flow气泡gas bubble鼓泡bubbling射流jet液滴liquid droplet粘度viscosity边界层boundary layer流率flow rate通量flux扩散diffusion菲克第一扩散定律Fick’s 1st law of diffusion菲克第一扩散定律Fick’s 2nd law of diffusion 扩散系数diffusion coefficient传质系数mass transfer coefficient热传导heat conduction热对流heat convection自然对流natural convection强制对流forced convection热辐射heat radiation导热率thermal conductivity传热系数heat transfer coefficient体内浓度bulk concentration未反应核模型unreacted core model 扩散控制反应diffusion-controlled reaction化学控制反应chenical-controlled reaction混合控制反应mixed-controlled reaction相似原理priciple of similarity雷诺数Reynolds number固定床fiexed bed填充床packed bed移动床moving bed流态化床fluidized bed混合时间mixing time停留时间residence time, retention time催化catalysis催化剂catalyst表面能surface energy表面张力surface tension界面能interfacial energy界面张力interfacial tension润湿wetting表面活性物质surface-active substance吸收absorption吸附absorption4.3 冶金电化学冶金电化学metallurgical electrochemistry熔盐电化学electrochemistry of fused salts固态离子学solid state ionics电解质溶液electrolyte solution阳离子cation阴离子anion电导conductance电导率conductivity电阻resistance电极electrode阴极cathode阳极anode电镀electroplating固体电解质solid electrolyte稳定的氧化锆stablized zirconia氧传感器oxygen sensor硅传感器silicon sensor定氧测头oxygen probe定硅测头silicon probe4.4 冶金物理化学研究方法冶金物理化学研究方法research methods in metallurgical physical chemistry热电偶thermocouple量热计calorimeter热太平thermobalance热分析thermal analysis差热分析differential thermal analysis,DTA热重法thermogravimetry分子筛molecular sieve5 钢铁冶金 5.1 炼焦炼焦coking高温炭化high temperature carbonization塑性成焦机理plastic mechanism of coke formation中间相成焦机理mesophase mechanism of coke formation 选煤coal preparation, coal washing配煤coal blending配煤试验coal blending test炼焦煤coking coal气煤gas coal肥煤fat coal瘦煤lean coal焦炉coke oven焦化室oven chamber焦饼coke cake结焦时间coking time周转时间cycle time装煤coal charging捣固装煤stamp charging推焦coke pushing焦炭熄火coke quenching干法熄焦dry quenching of coke焦台coke wharf装煤车larry car推焦机pushing machine拦焦机coke guide熄焦车quenching car焦炉焖炉banking for coke oven焦炭coke冶金焦metallurgical coke铸造焦foundry coke焦炭工业分析proximate analysis of coke焦炭元素分析ultimate analysis of coke焦炭落下指数shatter index of coke焦炭转鼓指数drum index of coke焦炭热强度hot strength of coke焦炭反应性coke reactivity焦炭反应后强度post-reaction strength of coke焦炭显微强度microstrength of coke焦炉煤气coke oven gas发热值calorific value煤焦油coal tar粗苯crude benzol苯benzene甲苯toluene二甲苯xylene苯并呋喃-茚树脂coumarone-indene resin精萘refined naphthalene精蒽refined anthracene煤[焦油]沥青coal tar pitch沥青焦pitch coke 针状焦needle coke型焦formcoke5.2 耐火材料耐火材料refractory materials耐火粘土fireclay高岭土kaolin硬质粘土flint clay轻质粘土soft clay陶土pot clay蒙脱石montmorillonite叶蜡石pyrophyllite膨润土bentonite鳞石英tridymite方石英cristobalite砂岩sandstone耐火石firestone莫来石mullite氧化铝alumina烧结氧化铝sintered alumina电熔氧化铝fused alumina刚玉corundum红柱石andalusite蓝晶石kyanite,cyanite硅线石sillimanite橄榄石olivine方镁石periclase镁砂magnesia合成镁砂synthetic sintered magnesia电熔镁砂fused magnesia烧结白云石砂sintered dolomite clinker合成镁铬砂synthetic magnesia chromite clinker尖晶石spinel镁铬尖晶石magnesia chrome spinel,magnesiochromite 硅藻土diatomaceous earth, infusorial earth蛭石vermiculite珍珠岩perlite碳化硅silicon carbide氮化硅silicon nitride氮化硼boron nitride粘土熟料chamotte熟料grog轻烧light burning,soft burning死烧dead burning,hard burning成型模注shaping moulding机压成型mechanical pressing等静压成型isostatic pressing摩擦压砖机friction press液压压砖机hydraulic press捣打成型ramming process熔铸成型fusion cast process砖坯强度green strength,dry strength隧道窑tunnel kiln回转窑rotary kiln倒焰窑down draught kiln耐火砖refractory brick标准型耐火砖standard size refractory brick泡砂石quartzite sandstone酸性耐火材料acid refractory [material]硅质耐火材料siliceous refractory [material]硅砖silica brick,dinas brick熔融石英制品fused quartz product硅酸铝质耐火材料aluminosillicate refractory 半硅砖semisilica brick粘土砖fireclay brick,chamotte brick石墨粘土砖graphite clay brick高铝砖high alumina brick硅线石砖sillimanite brick莫来石砖mullite brick刚玉砖corundum brick铝铬砖alumina chrome brick熔铸砖fused cast brick碱性耐火材料basic refractory [material]镁质耐火材料magnesia refractory [material]镁砖magnesia brick镁铝砖magnesia alumina brick镁铬砖magnesia chrome brick镁炭砖magnesia carbon brick中性耐火材料neutral refractory [material]复合砖composite brick铝炭砖alumina carbon brick铝镁炭转alumina magnesia brick锆炭砖zirconia graphite brick镁钙炭砖magnesia clacia carbon brick长水口long nozzle浸入式水口immersion nozzle,submerged nozzle 定径水口metering nozzle氧化铝-碳化硅-炭砖Al2O3-SiC-C brick透气砖gas permeable brick,porous brick滑动水口slide gate nozzle水口砖nozzle brick塞头砖stopper绝热耐火材料insulating refractory轻质耐火材料light weight refractory袖砖sleeve brick格子砖checker brick,chequer brick陶瓷纤维ceramic fiber耐火纤维refractory fiber耐火浇注料refractory castable耐火混凝土refractory concrete荷重耐火性refractoriness under load抗渣性slagging resistance耐磨损性abrasion resistance5.3 碳素材料[含]碳[元]素材料carbon materials无定形碳amorphous carbon金刚石diamond炭相[学]carbon micrography炭黑carbon black石油沥青petroleum pitch石油焦炭petroleum coke石墨化graphitization石墨化电阻炉electric resistance furnace for graphitization 石墨纯净化处理purification treatment of graphite炭砖carbon brick炭块carbon block碳化硅基炭块SiC-based carbon block炭电极carbon electrode连续自焙电极Soderberg electrode石墨电极graphite electrode超高功率石墨电极ultra-high power graphite electrode石墨电极接头graphite electrode nipple石墨电极接头孔graphite electrode socket plug电极糊electrode paste石墨坩埚graphite crucible石墨电阻棒graphite rod resistor炭刷carbon brush高纯石墨high purity graphite5.4 铁合金铁合金ferroalloy硅铁ferrosilicon硅钙calcium silicon金属硅silicon metal锰铁ferromangnanese低碳锰铁low carbon ferromanganese硅锰silicomanganese金属锰manganese metal铬铁ferrochromium低碳铬铁low carbon ferrochromium微碳铬铁extra low carbon ferrochromium硅铬silicochromium金属铬chromium metal钨铁ferrotunsten钼铁ferromolybdenum钛铁ferrotitanium硼铁ferroboron铌铁ferroniobium磷铁ferrophosphorus镍铁ferronickel锆铁ferrozirconium硅锆silicozirconium稀土硅铁rare earth ferrosilicon稀土镁硅铁rare earth ferrosilicomagnesium成核剂nucleater孕育剂incubater,inoculant球化剂nodulizer蠕化剂vermiculizer中间铁合金master alloy复合铁合金complex ferroalloy电碳热法electro-carbothermic process电硅热法electro-silicothermic process铝热法aluminothermic process,thermit process 电铝热法electro-aluminothermic process开弧炉open arc furnace埋弧炉submerged arc furnace半封闭炉semiclosed furnace封闭炉closed furnace矮烟罩电炉electric furnace with low hood矮炉身电炉low-shaft electric furnace5.5 烧结与球团人造块矿ore agglomerates烧结矿sinter压块矿briquette球团[矿] pellet针铁矿goethite自熔性铁矿self-fluxed iron ore复合铁矿complex iron ore块矿lump ore粉矿ore fines矿石混匀ore blending配矿ore proportioning矿石整粒ore size grading返矿return fines储矿场ore stockyard矿石堆料机ore stocker匀矿取料机ore reclaimer熔剂flux消石灰slaked lime活性石灰quickened lime有机粘结剂organic binder烧结混合料sinter mixture烧结铺底料hearth layer for sinter烧结sintering烧结热前沿heat front in sintering烧结火焰前沿flame front in sintering渣相粘结slag bonding扩散粘结diffusion bonding带式烧结机Dwight-Lloyd sintering machine环式烧结机circular travelling sintering machine 烧结梭式布料机shuttle conveyer belt烧结点火料sintering ignition furnace烧结盘sintering pan烧结锅sintering pot烧结冷却机sinter cooler带式冷却机straight-line cooler 环式冷却机circular cooler,annular cooler生球green pellet,ball生球长大聚合机理ball growth by coalescence生球长大成层机理ball growth by layering生球长大同化机理ball growth by assimilation精矿成球指数balling index for iron ore concentrates 生球转鼓强度drum strength of green pellet生球落下强度shatter strength of green pellet生球抗压强度compression strength of green pellet 生球爆裂温度cracking temperature of green pellet 圆筒造球机balling drum圆盘造球机balling disc竖炉陪烧球团shaft furnace for pellet firing带式机陪烧球团traveling grate for pellet firing链算机-回转窑陪烧球团grate-kiln for pellet firing 环式机陪烧球团circular gates for pellet firing冷固结球团cold bound pellet维式体wustite铁橄榄石fayalite铁尖晶石hercynite铁黄长石ferrogehlenite铁酸半钙calcium diferrite铁酸钙calcium ferrite铁酸二钙dicalcium ferrite锰铁橄榄石knebelite钙铁橄榄石kirschsteinite钙铁辉石hedenbergite钙铁榴石andradite钙长石anorthite钙镁橄榄石monticellite钙钛矿perovskite硅灰石wollastonite硅酸二钙dicalcium silicate硅酸三钙tricalcium silicate镁橄榄石forsterite镁黄长石akermanite镁蔷薇辉石manganolite钙铝黄长石gehlenite钛辉石titanaugite枪晶石cuspidine预还原球团pre-reduced pellet金属化球团metallized pellet转鼓试验drum test,tumbler test落下试验shatter test5.6 高炉炼铁炼铁iron making高炉炼铁[法] blast furnace process高炉blast furnace鼓风炉blast furnace炉料charge, burden矿料ore charge焦料coke charge炉料提升charge hoisting小车上料charge hoisting by skip吊罐上料charge hoisting by bucket皮带上料charge hoisting by belt conveyer装料charging装料顺序charging sequence储料漏斗hopper双料钟式装料two-bells system charging无料钟装料bell-less charging布料器distributor炉内料线stock line in the furnace探料尺gauge rod利用系数utilization coefficient冶炼强度combustion intensity鼓风blast风压blast pressure风温blast temperature鼓风量blast volume鼓风湿度blast humidity全风量操作full blast慢风under blowing休风delay喷吹燃料fuel injection喷煤coal injection喷油oil injection富氧鼓风oxygen enriched blast,oxygen enrichment 置换比replacement ratio喷射器injector热补偿thermal compensation焦比coke ratio,coke rate燃料比fuel ratio,fuel rate氧化带oxidizing zone风口循环区raceway蒸汽鼓风humidified blast混合喷吹mixed injection脱湿鼓风dehumidified blast炉内压差pressure drop in furnace煤气分布gas distribution煤气利用率gas utilization rate炉况furnace condition顺行smooth running焦炭负荷coke load,ore to coke ratio软熔带cohesive zone,softening zone渣比slag to iron ratio,slag ratio上部[炉料]调节burden conditioning下部[鼓风]调节blast conditioning高炉作业率operation rate of blast furnace休风率delay ratio高炉寿命blast furnace campaign悬料hanging 崩料slip沟流channeling结瘤scaffolding炉缸冻结hearth freeze-up开炉blow on停炉blow off积铁salamander炉型profile,furnace lines炉喉throat炉身shaft,stack炉腰belly炉腹bosh炉缸hearth炉底bottom炉腹角bosh angle炉身角stack angle有效容积effective volume工作容积working bolume铁口iron notch, slag notch渣口cinder notch, slag notch 风口tuyere窥视孔peep hole风口水套tuyere cooler渣口水套slag notch cooler风口弯头tuyere stock热风围管bustle pipe堵渣机stopper泥炮mud gun,clay gun开铁口机iron notch drill铁水hot metal铁[水]罐iron ladle鱼雷车torpedo car主铁沟sow出铁沟casting house铁沟iron runner渣沟slag runner渣罐cinder ladle, slag ladle撇渣器skimmer冷却水箱cooling plate冷却壁cooling stave汽化冷却vaporization cooling 热风炉hot blast stove燃烧室combustion chamber 燃烧器burner热风阀hot blast valve烟道阀chimney valve冷风阀cold blast valve助燃风机burner blower切断阀burner shut-off valve 旁通阀by-pass valve混风阀mixer selector valve送风期on blast of stove,on blast燃烧期on gas of stove, on gas换炉stove changing放散阀blow off valve内燃式热风炉Cowper stove外燃式燃烧炉outside combustion stove顶燃式热风炉top combustion stove炉顶放散阀bleeding valve放散管bleeder上升管gas uptake放风阀snorting valve均压阀equalizing valve高压调节阀septum valve炉顶高压elevated top pressure铸铁机pig-casting machine铸铁模pig mold冲天炉cupola水渣granulating slag水渣池granulating pit渣场slag disposal pit高炉煤气top gas,blast furnace gas高炉煤气回收topgas recovery,TGR非焦炭炼铁non-coke iron making直接还原炼铁[法]direct reduction iron making直接还原铁directly reduced iron,DRI竖炉直接炼铁direct reduction in shaft furnace流态化炼铁fluidized-bed iron making转底炉炼铁rotary hearth iron making米德雷克斯直接炼铁[法]Midrex processHYL直接炼铁[法] HYL process克虏伯回转窑炼铁[法] Krupp rotary kiln iron-making 熔态还原smelting reduction铁溶法iron-bath process科雷克斯法COREX process生铁pig iron海绵铁sponge iron镜铁spiegel iron清铁法H-rion process5.7 炼钢钢steel炼钢steelmaking钢水liquid steel,molten steel钢semisteel沸腾钢rimming steel,rimmed steel镇静钢killed steel半镇静钢semikilled steel压盖沸腾钢capped steel坩埚炼钢法crucible steelmaking双联炼钢法duplex steelmaking process连续炼钢法continuous steelmaking process直接炼钢法direct steelmaking process 混铁炉hot metal machine装料机charging machine装料期charging machine加热期heating period熔化期melting period造渣期slag forming period精炼期refining period熔清melting down脱氧deoxidation预脱氧preliminary dexidation 还原渣reducing slag酸性渣acid slag碱性渣basic slag脱碳decarburization增碳recarburization脱磷dephosphorization回磷rephosphorization脱硫desulfurization回硫resulfurization脱氮denitrogenation过氧化overoxidation出钢tapping冶炼时间duration of heat出钢样tapping sample浇铸样casting sample不合格炉次off heat熔炼损耗melting loss铁损iron loss废钢scrap废钢打包baling of scrap造渣材料slag making materials 添加剂addition reagent脱氧剂deoxidizer脱硫剂desulfurizer冷却剂coolant回炉渣return slag喷枪lance浸入式喷枪submerged lance 钢包ladle出钢口top hole出钢槽pouring lining炉顶furnace roof炉衬furnace lining炉衬侵蚀lining erosion渣线slag line炉衬寿命lining life分区砌砖zoned lining补炉fettling热修hot repair喷补gunning火焰喷补flame gunning转炉converter底吹转炉bottom-blown converter酸性空气底吹转炉air bottom-blown acid converter碱性空气底吹转炉air bottom-blown basic converter侧吹转炉side-blown converter卡尔多转炉Kaldo converter氧气炼铁oxygen steelmaking氧气顶吹转炉top-blown oxygen converter,LI converter氧气底吹转炉bottom-blown oxygen converter quiet basic oxygen furnace,QBOF顶底复吹转炉top and bottom combined blown converter喷石灰粉顶吹氧气转炉法oxygen lime process底吹煤氧的复合吹炼法Klockner-Maxhutte steelmaking process,KMS住友复合吹炼法Sumitomo top and bottom blowing process,STB LBE复吹法lance bubbling equilibrium process,LBE顶枪喷煤粉炼钢法Arved lance carbon injection process,ALCI蒂森复合吹炼法Thyssen Blassen Metallurgical process,TBM面吹surface blow软吹soft blow硬吹hard blow补吹reblow过吹overblow后吹after blow目标碳aim carbon终点碳end point carbon高拉碳操作catch carbon practice增碳操作recarburization practice单渣操作single-slag operation双渣操作double-slag operation渣乳化slag emulsion二次燃烧postcombustion吹氧时间oxygen blow duration吹炼终点blow end point倒炉turning down喷渣slopping喷溅spitting静态控制static control动态控制dynamic control氧枪oxygen lance氧枪喷孔nozzle of oxygen lance多孔喷枪multi-nozzle lance转炉炉体converter body炉帽upper cone炉口mouth,lip ring装料大面impact pad活动炉底removable bottom顶吹氧枪top blow oxygen lance副枪sublance多孔砖nozzle brick单环缝喷嘴single annular tuyere双环缝喷嘴double annular tuyere 挡渣器slag stopper挡渣塞floating plug电磁测渣器electromagnetic slag detector废气控制系统off gas control system,OGCS平炉open-hearth furnace平炉炼钢open-hearth steelmaking冷装法cold charge practice热装法hot charge practice碳沸腾carbon boil石灰沸腾lime boil炉底沸腾bottom boil再沸腾reboil有效炉底面积effective hearth area酸性平炉acid open-hearth furnace碱性平炉basic open-hearth furnace固定式平炉stationary open-hearth furnace倾动式平炉tilting open-hearth furnace双床平炉twin-hearth furnace顶吹氧气平炉open-hearth furnace with roof oxygen lance蓄热室regenerator沉渣室slag pocket电炉炼钢electric steelmaking电弧炉electric arc furnace超高功率电弧炉ultra-high power electric arc furnace直流电弧炉direct current electric arc furnace双电极直流电弧炉double electrode direct current arc furnace 竖窑式电弧炉shaft arc furnace电阻炉electric resistance furnace工频感应炉line frequency induction furnace中频感应炉medium frequency induction furnace高频感应炉high frequency induction furnace电渣重熔electroslag remelting,ESR电渣熔铸electroslag casting,ESC电渣浇注Bohler electroslag tapping,BEST真空电弧炉重熔vacuum arc remelting,V AR真空感应炉熔炼vacuum induction melting,VIM电子束炉重熔electron beam remelting,EBR等离子炉重炼plasma-arc remelting,PAR水冷模电弧熔炼cold-mold arc melting等离子感应炉熔炼plasma induction melting,PIM等离子连续铸锭plasma progressive casting,PPC等离子凝壳铸造plasma skull casting,PSC能量优化炼钢炉energy optimizing furnace,EOF氧燃喷嘴oxygen-fuel burner氧煤助熔accelerated melting by coal-oxygen burner氧化期oxidation period还原期reduction period长弧泡沫渣操作弧长控制long arc foaming slag operation 白渣white slag电石渣carbide slag煤氧喷吹coal-oxygen injection炉壁热点hot spots on the furnace wall偏弧arc bias透气塞porous plug出钢到出钢时间tap-to-tap time虹吸出钢siphon tapping偏心炉底出钢eccentric bottom tapping,EBT中心炉底出钢centric bottom tapping,CBT侧面炉底出钢side bottom tapping,SBT滑动水口出钢slide fate tapping5.8 精炼、浇铸及缺陷铁水预处理hot metal pretreatment机械搅拌铁水脱硫法KR process torpedo desulfurization鱼雷车铁水脱磷torpedo dephosphorization二次精炼secondary refining钢包精炼ladle refining合成渣synthetic slag微合金化microalloying成分微调trimming钢洁净度steel cleanness钢包炉ladle furnace,LF直流钢包炉DC ladle furnace真空钢包炉LF-vacuum真空脱气vacuum degassing真空电弧脱气vacuum arc degassing,V AD真空脱气炉vacuum degassing furnace,VDF真空精炼vacuum refining钢流脱气stream degassing提升式真空脱气法Dortmund Horder vacuum degassing process,DH循环式真空脱气法Ruhstahl-Hausen vacuum degassing process,RH 真空浇铸vacuum casting吹氧RH操作RH-oxygen blowing,RH-OB川崎顶吹氧RH操作RH-Kawasaki top blowing,RH-KTB喷粉RH操作RH-poowder blowing,TH-PB喷粉法powder injection process喷粉精炼injection refining蒂森钢包喷粉法Thyssen Niederhein process,TN瑞典喷粉法Scandinavian Lancer process,SL君津真空喷粉法vacuum Kimitsu injection process密封吹氩合金成分调整法composition adjustment by sealed argon bubbling,CAS吹氧提温CAS法CAS-OB process脉冲搅拌法pulsating mixing process,PM电弧加热电磁搅拌钢包精炼法ASEA-SKF process真空吹氧脱碳法vacuum oxygen decarburization process ,VOD氩氧脱碳法argon-oxygen decarburization process,AOD蒸汽氧精炼法Creusot-Loire Uddelholm process,CLU无渣精炼slag free refining摇包法shaking ladle process铝弹脱氧法aluminium bullet shooting,ABS钢锭ingot铸锭ingot casting 坑铸pit casting车铸car casting钢锭模ingot mold保温帽hot top下铸bottom casting上铸top casting补浇back pour,back feeding浇注速度pouring speed脱模ingot stripping发热渣exoslag防再氧化操作reoxidation protection连续浇注continuous casting连铸机continuous caster,CC,continuous casting machine,CCM 弧形连铸机bow-type continuous caster立弯式连铸机vertical-bending caster立式连铸机vertical caster水平连铸机horizontal caster小方坯连铸机billet caster大方坯连铸机bloom caster板坯连铸机slab caster薄板坯连铸机thin-slab casting薄带连铸机strip caster近终型浇铸near-net-shape casting单辊式连铸机single-roll caster单带式连铸机single-belt caster双带式连铸机twin-belt caster倾斜带式连铸机inclined conveyer type caster[连铸]流strand铸流间距strand distance注流对中控制stream centering control钢包回转台ladle turret中间包tundish回转式中间包swiveling tundish倾动式中间包tiltable tundish中间包挡墙weir and dam in tundish引锭杆dummy bar刚性引锭杆rigid dummy bar挠性引锭杆flexible dummy bar结晶器mold直型结晶器straight mold弧形结晶器curved mold组合式结晶器composite mold多级结晶器multi-stage mold调宽结晶器adjustable mold结晶器振动mold oscillation结晶器内钢液顶面meniscus,steel level钢液面控制技术steel level control technique保护渣casting powder,mold powder凝壳shell液芯liquid core空气隙air gap一次冷却区peimary cooling zone二次冷却区secondary cooling zone极限冷却速度critical cooling rate浇铸半径casting radius渗漏bleeding拉坯速度casting speed拉漏breaking out振动波纹oscillation mark水口堵塞nozzle clogging气水喷雾冷却air mist spray cooling分离环separating ring拉辊withdrawal roll立式导辊vertical guide roll弯曲辊bending roll夹辊pinch roll矫直辊straightening roll驱动辊driving roll导向辊装置roller apron切割定尺装置cut-to-length device钢流保护浇注shielded casting practice 多点矫直multipoint straightening电磁搅拌electromagnetic stirring,EMS 浇注周期casting cycle多炉连浇sequence casting事故溢流槽emergercy launder菜花头cauliflower top钢锭缩头piped top表面缺陷surface defect内部缺陷internal defect缩孔shrinkage cavity中心缩孔center line shrinkage气孔blowhole表面气孔surface blowhole皮下气孔subskin blowhole针孔pinhole铸疤feather冷隔cold shut炼钢缺陷lamination发裂flake,hair crack纵裂longitudinal crack横裂transverse crack角部横向裂纹transverse corner crack 角部纵向裂纹longitudinal corner crack 收缩裂纹shrinkage crack热裂hot crack冷裂cold crack冷脆cold shortness热脆hot shortness夹渣slag inclusion皮下夹杂subsurface inclusion正偏析positive segregation 负偏析negative segregation,inverse seregation V形偏析∨-shaped segregation倒V形偏析∧-shaped segregation中心偏析center segregation中心疏松center porosity鼓肚bulging脱方rhomboidity连铸-直接轧制continuous casting-direct rolling 工艺CC-DR6 钢铁材料铸铁cast iron熟铁wrought iron电解铁electrolytic iron白口铸铁white cast iron灰口铸铁grey cast iron麻口铸铁mottled cast iron变性铸铁modified cast iron孕育铸铁inoculated cast iron冷硬铸铁chilled cast iron球墨铸铁nodular cast iron蠕墨铸铁vermicular cast iron可锻铸铁malleable cast iron半可锻铸铁semi-malleable cast iron奥氏体铸铁austenitic cast iron贝氏体铸铁bainitic cast iron共晶白口铁eutectic white iron亚共晶白口铁hypoeutectic white iron过共晶白口铁hypereutectic white iron结构钢constructional steel软钢mild steel普通碳素钢plain carbon steel正火钢normalized steel热轧钢hot rolled steel高强度低合金钢high-strength low-alloy steel 微合金钢micro-alloy steel冷轧钢cold rolled steel深冲钢deep drawing steel双相钢dual phase steel渗碳钢carburizing steel渗氮钢nitriding steel调质钢quenched and tempered steel超高强度钢ultra-high strength steel不锈钢stainless steel奥氏体不锈钢austenitic stainless steel铁素体不锈钢ferritic stainless steel马氏体不锈钢martensitic stainless steel双相不锈钢duplex stainless steel马氏体时效钢maraging steel耐蚀钢corrosion-resisting steel耐热钢heat-resisting steel弹簧钢spring steel。
时效过程中亚晶界析出演变对7050铝合金性能的影响
时效过程中亚晶界析出演变对7050铝合金性能的影响顾伟;李静媛;王一德【摘要】采用光学显微镜、电子背散射衍射和透射电镜,研究亚晶界析出演变对7050 铝合金时效过程电导率和冲击韧性的影响.结果表明:亚晶界上析出相转变后,在二级时效过程中完成长大过程,并使电导率升高,冲击韧性降低.时效过程中亚晶界取向差增大,有利于η′相在亚晶界形核.一级时效升温至二级时效使亚晶界η′相转变为η相,且电导率升高13.04%,冲击韧性降低53.91%.二级时效过程中,亚晶界η相持续转变长大、无析出自由区宽化以及晶内析出量增加,导致电导率升高,冲击韧性降低.统计 Graff 试剂侵蚀金相中的晶界长度演变确定亚晶界η相的转变长大完成过程为(121℃, 360 min)+(177℃, 60 min).%The effects of precipitation evolution at sub-grain boundaries on electrical conductivity and impact toughness of 7050 aluminum alloy during aging were investigated by optical microscopy, electron back scatter diffraction and transmission electron microscopy. The results show that the electrical conductivity increases and the impact energy drops due to the transformation and growth of precipitation.η′ phase prefers to precipitate at sub-grain boundaries as the misorientation increases. At the heating stage between two-step aging, the electrical conductivity rises by 13.04% and impact toughness decreases by 53.91% as transformation fromη′ toη. The microstructure evolutions includingη phase precipitating at sub-grain boundaries, precipitate spacing increasing and precipitation-free-zone widening improve the electrical conductivity but deteriorate the impact toughness. The length of grain boundaries etched by Graff solution andviewed in the optical microscopy was counted to ensure the transformation and growth ofηphase completed at (121℃, 360min)+(177℃, 60 min).【期刊名称】《中国有色金属学报》【年(卷),期】2015(025)008【总页数】8页(P2049-2056)【关键词】7050铝合金;亚晶界析出;时效;电导率;冲击韧性【作者】顾伟;李静媛;王一德【作者单位】北京科技大学材料科学与工程学院,北京 100083;北京科技大学材料科学与工程学院,北京 100083;北京科技大学材料科学与工程学院,北京 100083【正文语种】中文【中图分类】TG146.217050 高强度铝合金由于比强度高,常用于飞机的结构材料[1-2]。
(材料成型)专业英语---注塑成型专业词汇
引用sincere.xiao的专业英语---注塑成型专业词汇Injection machine啤机Shot size(weight)实际射胶量injection volume理论射胶量min mold height最小容模厚度Max mold height最大容模厚度Tie bar clearance拉杆间距Die plate size 模板尺寸Ejector stroke顶出行程barrel炮筒,机筒clamp force锁模力non-return valve止回阀shear剪切opening开模行程Injection pressure射胶压力back pressure 背压nozzle size射咀尺寸Cycle time循环周期down time停机时间hopper料筒Mold release脱模剂lubrication润滑work horse主力,主要设备Reserve pressure/packing pressure保压mold trial试模shot(一)啤Decompress 减压oven烤炉,烘灶shrinkage rate收缩率Residence time滞留时间injection speed注射速度booster time增压时间Compression ratio压缩比mold close time合模时间Resin 胶料Plastification塑化,增塑viscosity粘性,粘度contamination污染,杂物Thermoplastic热塑性塑料thermosetting plastics热固性塑料Booster time增压时间feed喂料,填充purge 净化Flame retardant阻燃degradation 降解,软化regrind再粉碎Water absorption吸水reinforce增强,加固specific gravity比重Elongation延伸率density密度melting point熔点Polystyrene聚苯乙烯(PS)Styrene苯乙烯Acrylonitrile丙烯腈Polypropylene聚丙烯(PP)Polyethylene 聚乙烯glass fiber玻纤Condensation凝固,浓缩crystalline resin结晶形塑料Mold materials模具General-purpose steel多用途钢tool steel模具钢Free-cutting steel高速切削钢case hardening steel表面硬化钢Pre-hardened steel预硬钢ball and roller bearing steel滚珠轴承钢Nonferrous steel非铁合金high speed steel高速钢cast iron铸铁Steel specification钢材规格steel certification钢材合格证明书Stainless steel不锈钢nickel镍chrome 铬aluminum铝Copper铜brass黄铜bronze青铜titanium钛Processing 钢材的加工方法Harding / quench淬火nitride氮化temper回火anneal退火Roll轧制abrasive研磨,磨损的finish精加工,抛光(polish)Case-hardening表面硬化milling machine铣(锣)床Lathe车床drill钻床wire cut线割NC(numerical control )数控材料EDM (Electrical discharge machine)电火花加工Cut steel开料Precision ground精密研磨heat treatment热处理tap丝锥,攻牙Texture 蚀纹weld焊接forge锻压deformation变形Spraying喷涂die-cast压铸Properties 性能Resistance电阻,抵抗能力abrasion / wear磨损erode / corrode腐蚀Toughness韧性yield strength屈服强度tensile strength拉伸强度Fatigue strength疲劳强度break断裂stress应力hardness硬度Humidity / moisture潮湿,湿气roughness粗糙度parameter参数Thermal conductivity导热系数manufacture制造,加工drawback缺点Ductility延展性grain晶粒property性能,财产brittleness脆性GD&T(Geometric Dimensions and Tolerance)形位尺寸公差Flexural strength挠曲强度impact冲击conductivity传导性,导电性Optical光学的transparent透明的insulation绝缘Mechanical机械的processability可加工性能timeyield蠕变Physical物理的flow rate流动速率compressive strength压缩强度Adhesive粘附的,胶合durability耐用性Mold design模具设计Tooling specification 模具规格mould flow流动模拟sprue nozzle唧咀孔Clearance避空,间隙undercut倒扣flush插入,埋入legend图例Groove凹槽latch插销class 类型,种类plan平面图Orifice孔,口column柱位boss凸台standard标准,规格Rib骨位tapered interlock锥形管位块Bubbler炮隆Bolt 螺钉,销顶identification mark铭牌P/L strip锁模片Overflow well / cold-slug well冷料井Vent排气pocket槽Gate location入水点full line实线broken line虚线Retainer固定,支撑operator操作者(啤工)receptacle插座Lifting hole吊令孔insulation plate隔热板cavity number型腔号Bolster支撑,垫子vent channel排气槽leak / filter渗漏Leak test试运水stamp / engrave雕刻,印记(打字唛)Clamp slot码模槽support button / pin垃圾钉cut steel开料Lodge安装,放置inlay镶嵌,插入cam / lifter斜顶Stripper推方lifting bar吊模方sprue唧咀tolerance公差Counter bore沉孔slant倾斜,斜面conical圆锥的,圆锥形的Bolt螺栓manifold热流道板prototype tooling原型试验Gusset角撑reverse mold倒装模constrain / restrict约束,限制Counter lock反锁thermocouple热电偶moldmaker模具制造商Asset / property number资产编号tool product destination模具生产地点Accelerating ejection加速顶出hydraulic液压的pneumatic气动的Trapezoid梯形的semi-round半圆形format格式baffle隔水片Electrode电极,铜公spare part配件gall磨伤,插伤Cable 电缆,电线plating / coating(电)镀bonding / joint接头Wall transition壁厚过渡Product problem产品问题Troubleshoot故障处理reduce(add) plastic减(加)胶Burr/flash披峰Burn mark烧焦ejector mark顶针印,顶白black specs黑点,黑斑Discoloration混色,污点gloss光泽jetting/worming走水纹Sink mark缩水void / bubble气泡,夹气distortion变形Warpage翘曲short molding / non-fill缺胶,未走齐Weld line / knit line夹水线discarded as useless报废Split line夹线stick in sprue bushing / cavity / core 粘唧咀/前模/后模Break / crack顶裂brittleness脆性,易脆Others 其他Invoice发票,清单vendor(er)卖方vendee买方guideline方针,指导Intricate复杂的confidential机密的,不可外泄的proprietary私有的Authorize批准,授权recipient接收者issue①发布,提供;②问题Approve确认,赞成requirement需要,必需物const常数,常量Regarding关于,涉及opposite相反的,对面的latitude纬度,纵向的Version版本definition注释,解说transversal横向的,截线Profile轮廓,剖面eliminate / cancel取消allow / permit允许,许可Respective各自的,分别的individual单独的decrease减少increase增加Preliminary初步的approximately大约,近似estimate / valuate估计,预算Adjust调整,校准application应用,申请maintain维持Accurate / precise 精确的smooth光滑,顺畅的device装置,设备Convenient方便的deadline截至日期available有用的,有空的Shift轮班,换班critical关键的,临界的exceptional 异常的,优异的Exceed超过layout布局,方案loss损失,消耗install安装,安置 R otation 旋转item条款,项目quotation报价stabilize稳定Quality质量quantity数量couple连接,接合configuration构造,外形Illustrate图解说明simulation模拟,仿真recommend推荐使用。
电路板中英文专业术语词汇(N-Z)
电路板专业词汇(N-Z)N.C.数值控制.Nail Head钉头.Near IR近红外线.Negative负片,钻尖的第一面外缘变窄.Negative Etch-back反回蚀.Negative Stencil负性感光膜.Negative-Acting Resist负性作用之阻剂.Network纲状元件.Newton牛顿.Newton Ring 牛顿环.Newtonian Liquid牛顿流体.Nick缺口.N-Methyl Pyrrolidine (NMP)N-甲基四氢哔咯.Noble Metal Paste贵金属印膏.Node节点.Nodule节瘤.Nomencleature标示文字符号.Nominal Cured Thickness标示厚度.Non-Circular Land非圆形孔环焊垫.Non-flammable非燃性.Non-wetting不沾锡.Normal Concentration (Strength)标准浓度,当量浓度.Normal Distribution常态分布.Novolac酯醛树脂.Nucleation , Nucleating核化.Numerical Control数值控制.Nylon尼龙.*****O*****Occlusion吸藏.Off-Contact架空.Offset第一面大小不均.OFHC(Oxyen Free High Conductivity)无氧高导电铜.Ohm欧姆.Oilcanning盖板弹动.OLB(Outer Lead Bond)外引脚结合.Oligomer寡聚物.Omega Meter离子污染检测仪.Omega Wave振荡波.On-Contact Printing密贴式印刷.Opaquer不透明剂,遮光剂.Open Circuits断线.Optical Comparater光学对比器(光学放大器.)Optical Density光密度.Optical Inspection光学检验.Optical Instrument光学仪器.Organic Solderability Preservatives (OSP)有机保焊剂. Osmosis渗透.Outgassing出气,吹气.Outgrowth悬出,横出,侧出.Output产出,输出.Overflow溢流.Overhang总悬空.Overlap 钻尖点分离.Overpotantial(Over voltage)过电位,过电压. Oxidation氧化.Oxygen Inhibitor氧化抑制剂.Ozone Depletion臭氧层耗损.*****P*****Packaging封装,构装.Pad焊垫,圆垫.Pad Master圆垫底片.Pads Only Board唯垫板.Palladium钯.Panel制程板.Panel Plating全板镀铜.Panel Process全板电镀法.Paper Phenolic纸质酚醛树脂(板材).Parting Agent脱膜剂.Passivation钝化,钝化外理.Passive Device (Component)被动组件(零件)Paste膏,糊.Pattern板面图形.Pattern Plating线路电镀.Pattern Process线路电镀法.Peak Voltage峰值电压.Peel Strength抗撕强度.Periodic Reverse (PR) Current周期性反电流. Peripheral周边附属设备.Permeability透气性,导磁率.Permittivity诱电率,透电率.pH Value酸碱值.Phase相.Phase Diagram相图.Phenolic酚醛树脂.Photofugitive感光褪色.Photographic film感光成像之底片.Photoinitiator感光启始剂.Photomask光罩.Photoplotter, Plotter光学绘图机.Photoresist光阻.Photoresist Chemical Machinning (Milling)光阻式化学(铣刻)加工. Phototool底片.Pick and Place拾取与放置.Piezoelectric压电性.Pin 插脚,插梢,插针.Pin Grid Array (PGA)矩阵式针脚对装.Pinhole针孔.Pink Ring粉红圈.Pitch跨距,脚距,垫距,线距.Pits凹点.Plain Weave平织.Plasma电浆.Plasticizers可塑剂,增塑剂.Plated Through Hole镀通孔.Platen热盘.Plating镀.Plotting标绘.Plowing犁沟.Plug插脚,塞柱.Ply层,股.Pneumatic Stretcher气动拉伸器.Pogo Pin伸缩探针.Point 钻尖.Point Angle钻尖面.Point Source Light点状光源.Poise泊."粘滞度"单位=1dyne*sec/cm2.Polar Solvent极性溶剂.Polarity电极性.Polarization分极,极化.Polarizing Slot偏槽.Polyester Films聚酯类薄片.Polymer Thick Film (PTF)厚膜糊.Polymerization聚合.Polymide(PI)聚亚醯胺.Popcorn Effect爆米花效应.Porcelain瓷材,瓷面.Porosity Test疏孔度试验.Positive Acting Resist正性光阻剂.Post Cure后续硬化,后烤.Post Separation后期分离,事后公离.Pot Life运用期,锅中寿命.Potting铸封,模封.Power Supply电源供应器.Preform 预制品.Preheat预热.Prepreg胶片,树脂片.Press Plate钢板.Press-Fit Contact挤入式接触.Pressure Foot 压力脚.Pre-tinning预先沾锡.Primary Image线路成像.Print Through压透,过度挤压..Probe探针.Process Camera制程用照像机.Process Window操作范围.Production Master生产底片.Profile轮廓,部面图,升温曲线图棱线.Propagation传播.Propagation Delay传播延迟.Puddle Effect水坑效应.Pull Away拉离.Pulse Plating脉冲电镀法.Pumice Powder 浮石粉.Punch冲切.Purge, Purging净空,净洗.Purple Plague紫疫(金与铝的共化物层).Pyrolysis热裂解,高温分解.*****Q*****Quad Flat Pack (QFP)方扁形封装体.Qualification Agency资格认证机构.Qualification Inspection资格检验.Qualified Products List合格产品(供应者)名单.Qualitative Analysis定性分析.Quality Conformance Test Circuitry (Coupon)品质符合之试验线路(样板). Quantitative Analysis定量分析.Quench 淬火,骤冷.Quick Disconnect快速接头.Quill纬纱绕轴.*****R*****Rack 挂架.Radial Lead放射状引脚.Radio Frequency Interference (RFI)射频干扰.Rake Angle抠角,耙角.Rated Temperature, Voltage额定温度,额定电压. Reactance电抗.Real Estate底材面,基板面.Real Time System 实时系统.Reclaiming再生,再制.Rediometer辐射计,光度计.Reel to Reel卷轮(盘)式操作.Reference Dimension参考尺度.Reference Edge参考边缘.Reflection反射.Reflow Soldering重熔焊接,熔焊.Refraction折射.Refractive Index折射率.Register Mark对准用标记.Registration对准度.Reinforcement补强物.Rejection剔退,拒收.Relamination(Re-Lam)多层板压合.Relaxation松弛.缓和.Relay继电器.Release Agent, Release Sheets脱模剂,离模剂. Reliability可靠度,可信度.Relief Angle浮角.Repair修理.Resin Coated Copper Foil背胶铜箔.Resin Content胶含量,树脂含量.Resin Flow胶流量,树脂流量.Resin Recession树脂下陷.Resin Rich Area 多胶区,树脂丰富区.Resin Smear胶(糊)渣.Resin Starve Area缺胶区,树脂缺乏区.Resist阻膜,阻剂.Resistivity电阻系数,电阻率.Resistor电阻器,电阻.Resistor Drift电阻漂移.Resistor Paste电阻印膏.Resolution解像,解像度,分辨率.Resolving Power解析(像)力,分辨力.Reverse Current Cleaning反电流(电解)清洗. Reverse Etchback反回蚀.Reverse Image负片影像(阻剂).Reverse Osmosis (RO)反(逆渗透).Reversion反转,还原.Revision修正版.改订版.Rework(ing)重工,再加工.Rhology流变学,流变性质.Ribbon Cable圆线缆带.Rigid-Flex Printed Board硬软合板.Ring 套环.Rinsing水洗,冲洗.Ripple纹波(指整流器所输出电流中不稳定成分). Rise Time上升时间.Roadmap 线路与零件之布局图.Robber辅助阴极.Roller Coating辊轮涂布.Roller Coating滚动涂布法.Roller Cutter辊切机.Roller Tinning辊锡法,滚锡法.Rosin松香.Rotary Dip Test摆动沾锡试验.Routing切外型.Runout偏转,累绩距差.Rupture迸裂.*****S*****Sacrificial Protection牺牲性保护层.Salt Spray Test盐雾试验.Sand Blast喷砂.Saponification皂化作用.Saponifier皂化剂.Satin Finish缎面处理.Scaled Flow Test比例流量实验.Schemetic Diagram电路概略图.ScoringV型刻槽.Scratch刮痕.Screen Printing纲版印刷.Screenability纲印能力.Scrubber磨刷机,磨刷器.Scum透明残膜.Sealing封孔.Secondary Side第二面 .Seeding下种.Selective Plating选择性电镀.Self-Extinguishing自熄性.Selvage布边.Semi-Additive Process半加成制程.Semi-Conductor半导体.Sensitizing敏化.Separable Component Part可分离式零件.Separator Plate隔板, 钢板.Sequential Lamination接续性压合法.Sequestering Agent螯合剂.Shadowing阴影,回蚀死角.Shank钻针柄部.Shear Strength 抗剪强度.Shelf Life储龄.Shield遮蔽.Shore Hardness萧氏硬度.Short短路.Shoulder Angle肩斜角.Shunt分路.Side Wall侧壁.Siemens电阻值.Sigma (Standard Deviation)标准差.Signal讯号.Silane硅烷.Silica Gel硅胶砂.Silicon硅.Silicone硅铜.Silk Screen纲版印刷,丝纲印刷.Silver Migration银迁移.Silver Paste 银膏.Single-In-Line Package(SIP)单边插脚封装体.Sintering烧结.Sizing上胶,上浆.Sizing上浆处理.Skin Effect集肤效应(高频下,电流在传递时多集中在导体表面,使得道线内部通过电流甚少, 造成内部导体浪费,并也使得表面导体部分电阻升高.Skip Printing, Skip Plating漏印,漏镀.Skip Solder 缺锡, 漏焊.Slashing浆经.Sleeve Jint套接.Sliver边丝,边余.Slot, Slotting槽口.Sludge于泥.Slump塌散.Slurry稠浆,悬浮浆.Small Hole小孔.Smear胶渣.Smudging锡点沾污.Snap-off弹回高度.Socket插座.Soft Contact轻触.Soft Glass 软质玻璃(铅玻璃).Solder焊锡.Solder Ball锡球.Solder Bridging锡桥.Solder Bump 焊锡凸块.Solder Column Package锡柱脚封装法. Solder Connection焊接.Solder Cost焊锡着层.Solder Dam锡堤.Solder Fillet填锡.Solder Levelling喷锡,热风整平.Solder Masking(S/M)防焊膜绿漆.Solder Paste锡膏.Solder Plug锡塞(柱).Solder Preforms预焊料.Solder Projection焊锡突点.Solder Sag 焊锡垂流物.Solder Side焊锡面.Solder Spatter溅锡.Solder Splash贱锡.Solder Spread Test散锡试验.Solder Webbing锡纲.Solder Webbing锡纲.Solder Wicking渗锡,焊锡之灯芯效应. Solderability可焊性.Soldering软焊,焊接.Soldering Fluid, Soldering Oil助焊液,护焊油. Solid Content固体含量,固形分.Solidus Line固相线.Spacing间距.Span跨距.Spark Over闪络.Specific Heat 比热.Specification (Spec)规范,规格.Specimen样品,试样.Spectrophotometry分光光度计检测法. Spindle主轴,钻轴.Spinning Coating自转涂布.Splay斜钻孔.Spray Coating喷着涂装.Spur底片图形边缘突出.Sputtering溅射.Squeege刮刀.Stagger Grid蹒跚格点.Stalagometer滴管式表面张力计.Stand-off Terminals直立型端子.Starvation缺胶.Static Eliminator静电消除器.Steel Rule Die(钢)刀模.Stencil版膜.Step and Repeat逐次重复曝光.Step Plating梯阶式镀层.Step Tablet阶段式曝光表.Stiffener补强条(板).Stop Off防镀膜, 阻剂.Strain变形,应变.Strand绞(指由许多股单丝集束并旋扭而成的丝束).Stray Current迷走电流, 散杂电流(在电镀槽系统中,其直流电由整流器所提供,应在阳极板与被镀件之间的汇电杆与槽体液体中流通,但有时少部分电流也可能会从槽体本身或加热器上迷走,漏失).Stress Corrosion应力腐蚀.Stress Relief消除应力.Strike预镀.Stringing拖尾.Stripline条线.Stripper剥除液(器).Substractive Process减成法.Substrate底材.Supper Solder超级焊锡.Supported Hole(金属)支助通孔.Surface Energy表面能.Surface Insulation Resistance表面绝缘电阻.Surface Mount Device 表面粘装组件.Surface Mounting Technology (SMT)表面粘装技术. Surface Resistivity表面电阻率.Surface Speed钻针表面速度.Surface Tension表面张力.Surfactant表面润湿剂.Surge突流,突压.Swaged Lead压扁式引脚.Swelling Agents, Sweller膨松剂.Swimming 线路滑离.Synthetic Resin合成树脂.*****T*****Tab接点,金手指.Taber Abraser泰伯磨试器.Tackiness粘着性, 粘手性.Tape Automatic Bonding (TAB)卷带自动结合.Tape Casting 带状铸材.Tape Test撕胶带试验.Tape Up Master原始手贴片.Taped Components卷带式连载组件.Taper Pin Gauge锥状孔规.Tarnish污化.Tarnish 污化, 污着.Teflon铁氟龙(聚4氟乙烯).Telegraphing浮印,隐印.Temperature Profile温度曲线.Template模板.Tensile Strength抗拉强度.Tensiomenter张力计.Tenting盖孔法.Terminal端子.Terminal Clearance端子空环.Tetra-Etch氟树脂蚀粗剂.Tetrafunctional Resin四功能树脂.Thermal Coefficient of Expansion (TCE)热膨胀系数. Thermal Conductivity导热率.Thermal Cycling热循环,热震荡.Thermal Mismstch感热失谐.Thermal Relief散热式镂空.Thermal Via导热孔.Thermal Zone感热区.Thermocompression Bonding热压结合. Thermocouple热电偶.Thermode发热体.Thermode Soldering热模焊接法. Thermogravimetric Analysis, (TGA)热重分析法. Thermomechanical Analysis (TMA)热机分析法. Thermoplastic热塑性.Thermosetting热固性.Thermosonic Bonding热超音波结合.Thermount聚醯胺短纤席材.Thermo-Via导热孔.Thick Film Circuit厚膜电路.Thief辅助阳极.Thin Copper Foil薄铜箔.Thin Core薄基板.Thin Film Technology薄膜技术.Thin Small Outline Package(TSOP)薄小型绩体电路器.Thinner调薄剂.Thixotropy抗垂流性,摇变性.Three Point Bending三点压弯试验.Three-Layer Carrier三层式载体.Threshold Limit Value (TLV)极限值.Through Hole Mounting通孔插装.Through Put物流量,物料通过量.Throwing Power分布力.Tie Bar分流条.Tin Drift锡量漂飘失.Tin Immersion浸镀锡.Tin Pest锡疫(常见白色金属锡为"β锡",当温度低于13.2℃时则β锡将逐渐转变成粉末状灰色"α锡"称为"锡疫".Tin Whishers锡须.Tinning热沾焊锡.Tolerance公差.Tombstoning墓碑效应.Tooling Feature工具标示物.Topography表面地形.Torsion Strength抗扭强度.Touch Up触修,简修.Trace 线路,导线.Traceability追溯性,可溯性.Transducer转能器.Transfer Bump移用式突块.Transfer Laminatied Circuit转压式线路.Transfer Soldering移焊法.Transistor晶体管.Translucency半透性.Transmission Line传输线.Transmittance透光率.Treament, Treating含浸处理.Treeing枝状镀物,镀须.Trim修整, 精修.Trim Line裁切线.Trimming修整,修边.True Position真位.Tungsten钨Tungsten Carbide碳化钨.Turnkey System包办式系统.Turret Solder Terminal塔立式焊接端子.Twill Weave斜织法.Twist板扭.Two Layer Carrier两层式载体.UL Symbol(UL.为Under-Writers 保俭业试验所标志. Laboratories,INC)Ultimate Tensile Strength (UTS)极限抗拉强度. Ultra High Frequency (UHF)超高频率.Ultra Violet Curing (UV Curing)紫外线硬化. Ultrasonic Bonding超音波结合.Ultrasonic Cleaning超音波清洗.Ultrasonic Soldering超音波焊接.Unbalanced Transmission Line非平衡式传输线. Undercut, Undercutting侧蚀.Underplate底镀层.Universal Tester汛用型电测机.Unsupported Hole非镀通孔.Urea尿素.Urethane胺基甲酸乙脂.*****V*****Vacuoles焊洞.Vacuum Evaporation(or Deposition)真空蒸镀法. Vacuum Lamination真空压合.Van Der Waals Force凡得华力.Vapor Blasting蒸汽喷砂.Vapor Degreasing蒸汽除油法.Vapor Phase Soldering气相焊接.Varnish凡力水,清漆(树脂之液态单体).V-cutV型切槽.Very Large-Scale Integration(VLSI)极大绩体电路器. Via Hole 导通孔.Vickers Hardness维氏硬度.Viscosity粘滞度,粘度.Vision Systems视觉系统.Visual Examination目视检验.Void 破洞,空洞.Volatile Content挥发份含量.Voltage电压.Voltage Breakdown崩溃电压.Voltage Drop 电压降落.Voltage Efficiency电压效率.Voltage Plane电压层.Voltage Plane Clearance电压层的空环.Volume Resistivity体绩电阻率.Volume Resistivity体绩电阻率.Volumetric Analysis容量分析法.Vulcanization交联,硫化.Wafer晶圆.Waive暂准过关,暂不检查. Warp Size 浆经处理.Warp, Warpage板弯.Washer垫圈.Waste Treatment废弃处理. Water Absorption吸水性. Water Break水膜破散,水破. Water Mark水印.Watt瓦特.Watts Bath瓦兹镀镍液.Wave Guide导波管.Wave Soldering波焊. Waviness 波纹,波度.Wear Resistance耐磨性,耐磨度. Weatherability耐候性.Weave Eposure织纹显露. Weave Texture织纹隐现.Web蹼部.Wedge Bond 楔形结合点. Wedge Void楔形缺口(破口). Weft Yarn纬纱.Welding熔接.Wet Blasting湿喷砂.Wet Lamination湿压膜法.Wet Process湿式制程.Wetting Agent润湿剂.Wetting Balance沾锡天平. Wetting Balance沾锡,沾湿. Whirl Brush旋涡式磨刷法. Whirl Coating旋涡涂布法. Whisker晶须.White Residue白色残渣.White Spot白点.Wicking灯蕊效应.Window操作范围,传动齿孔. Wiping Action 滑动接触(导电). Wire Bonding打线结合.Wire Gauge线规.Wire Lead金属线脚.Wire Pattern布线图形.Wire Wrap绕线互连.Working Master工作母片.Working Time (Life)堪用时间.Workmanship 手艺,工艺水平,制作水准.Woven Cable扁平编线.Wrinkle皱折, 皱纹.Wrought Foil锻碾金属箔.*****X*****X AxisX轴.X-Ray X光.X-Ray FluorescenceX萤光.*****Y*****Yarn纱线.Y-AxisY轴.Yield良品率,良率,产率.Yield Point屈服点.*****Z*****Z-AxisZ轴.Zero Centering中心不变(叠合法).Zig-Zag In-Line Package (ZIP)炼齿状双排脚封装件.。
半导体制造的常用名词
半导体制造的常用名词发表于: 2007-5-07 17:10 作者: luhaoxinglhx 来源: 半导体技术天地Ingot - A cylindrical solid made of polycrystalline or single crystal silicon from which wafers are cut.晶锭- 由多晶或单晶形成的圆柱体,晶圆片由此切割而成。
Laser Light-Scattering Event - A signal pulse that locates surface imperfections on a wafer.激光散射- 由晶圆片表面缺陷引起的脉冲信号。
Lay - The main direction of surface texture on a wafer.层- 晶圆片表面结构的主要方向。
Light Point Defect (LPD) (Not preferred; see localized light-scatterer)光点缺陷(LPD) (不推荐使用,参见“局部光散射”)Lithography - The process used to transfer patterns onto wafers.光刻- 从掩膜到圆片转移的过程。
Localized Light-Scatterer - One feature on the surface of a wafer, such as a pit or a scratch that scatters light. It is also called a light point defect.局部光散射- 晶圆片表面特征,例如小坑或擦伤导致光线散射,也称为光点缺陷。
Lot - Wafers of similar sizes and characteristics placed together in a shipment.批次- 具有相似尺寸和特性的晶圆片一并放置在一个载片器内。
冶金专业英语词汇整理
..专业英语词汇1 总论采矿mining地下采矿underground mining露天采矿open cut mining, open pit mining, surface mining采矿工程mining engineering选矿(学)mineral dressing, ore beneficiation, mineral processing 矿物工程mineral engineering冶金(学)metallurgy过程冶金(学)process metallurgy提取冶金(学)extractive metallurgy化学冶金(学)chemical metallurgy物理冶金(学)physical metallurgy金属学Metallkunde冶金过程物理化学physical chemistry of process metallurgy冶金反应工程学metallurgical reaction engineering冶金工程metallurgical engineering钢铁冶金(学)ferrous metallurgy, metallurgy of iron and steel 有色冶金(学)nonferrous metallurgy真空冶金(学)vacuum metallurgy等离子冶金(学)plasma metallurgy微生物冶金(学)microbial metallurgy喷射冶金(学)injection metallurgy钢包冶金(学)ladle metallurgy二次冶金(学)secondary metallurgy机械冶金(学)mechanical metallurgy焊接冶金(学)welding metallurgy粉末冶金(学)powder metallurgy铸造学foundry火法冶金(学)pyrometallurgy湿法冶金(学)hydrometallurgy电冶金(学)electrometallurgy氯冶金(学)chlorine metallurgy矿物资源综合利用engineering of comprehensive utilization of mineral resources中国金属学会The Chinese Society for Metals中国有色金属学会The Nonferrous Metals Society of China2 采矿采矿工艺mining technology有用矿物valuable mineral冶金矿产原料metallurgical mineral raw materials矿床mineral deposit特殊采矿specialized mining海洋采矿oceanic mining, marine mining矿田mine field矿山mine露天矿山surface mine地下矿山underground mine矿井shaft矿床勘探mineral deposit exploration矿山可行性研究mine feasibility study矿山规模mine capacity矿山生产能力mine production capacity矿山年产量annual mine output矿山服务年限mine life矿山基本建设mine construction矿山建设期限mine construction period矿山达产arrival at mine full capacity开采强度mining intensity 矿石回收率ore recovery ratio矿石损失率ore loss ratio工业矿石industrial ore采出矿石extracted ore矿体orebody矿脉vein海洋矿产资源oceanic mineral resources矿石ore矿石品位ore grade岩石力学rock mechanics岩体力学rock mass mechanics3 选矿选矿厂concentrator, mineral processing plant 工艺矿物学process mineralogy开路open circuit闭路closed circuit流程flowsheet方框流程block flowsheet产率yield回收率recovery矿物mineral粒度particle size粗颗粒coarse particle细颗粒fine particle超微颗粒ultrafine particle粗粒级coarse fraction细粒级fine fraction网目mesh原矿run of mine, crude精矿concentrate粗精矿rough concentrate混合精矿bulk concentrate最终精矿final concentrate尾矿tailings粉碎comminution破碎crushing磨碎grinding团聚agglomeration筛分screening, sieving分级classification富集concentration分选separation手选hand sorting重选gravity separation, gravity concentration 磁选magnetic separation电选electrostatic separation浮选flotation化学选矿chemical mineral processing自然铜native copper铝土矿bauxite冰晶石cryolite磁铁矿magnetite赤铁矿hematite假象赤铁矿martite钒钛磁铁矿vanadium titano-magnetite铁燧石taconite褐铁矿limonite菱铁矿siderite................... tuyere cooler风口水套tuyere stock风口弯头tuyere风口twin-belt caster双带式连铸机twin-hearth furnace双床平炉two-bells system charging双料钟式装料type steel轮箍钢ultimate analysis of coke 焦炭元素分析ultrafine particle超微颗粒ultra-high power electric arc furnace超高功率电弧炉ultra-high power graphite electrode超高功率石墨电极ultra-high strength steel超高强度钢ultrasonic particle sizer, supersonic particle sizer超声粒度计under blowing 慢风underground mine地下矿山underground mining地下采矿undersize筛下料unreacted core model未反应核模型upper cone炉帽utilization coefficient利用系数vacuum arc degassing, VAD真空电弧脱气vacuum arc remelting, VAR真空电弧炉重熔vacuum casting真空浇铸vacuum decarburization真空脱碳vacuum degassing furnace, VDF真空脱气炉vacuum degassing真空脱气vacuum induction melting, VIM真空感应炉熔炼vacuum Kimitsu injection process君津真空喷粉法vacuum metallurgy真空冶金(学)vacuum oxygen decarburization process ,VOD真空吹氧脱碳法vacuum refining真空精炼valuable mineral有用矿物vanadium titano-magne钒钛磁铁矿titevaporization cooling汽化冷却vein矿脉vermicular cast iron蠕墨铸铁vermiculite蛭石vermiculizer蠕化剂vertical caster立式连铸机vertical guide roll立式导辊vertical-bending caster立弯式连铸机vibrating screen震动筛viscosity粘度weir and dam in tundish中间包挡墙welding metallurgy焊接冶金(学)wetting润湿white cast iron白口铸铁white slag白渣withdrawal roll拉辊wollastonite硅灰石working bolume工作容积wrought iron熟铁wustite维式体xylene二甲苯yield产率zero order reaction零级反应zirconia graphite brick锆炭砖zoned lining分区砌砖.。
加州大学伯克莱分校(UCB)核工系相关课程习题6
H-Zr Phase Diagram
1200 1100
H2 isobars: 10 K atmosphere
K=1 1000 900 800 700 600 500 400 300 200 100 0 0.2 0.4 0.6 0.8 1 H/Zr atom ratio 1.2 1.4 1.6 1.8 2 K=0
350oC
(U,Zr)H1.6 fuel
LM gap
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
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0.50
r (cm)
• Use of a low-melting, inert liquid metal in the fuel-cladding gap essentially produces hgap= (klm ~ 100xkHe) • The low fuel temperature prevents hydrogen loss • Hydrogen in fuel redistributes in the temperature gradient2
1
TQ = heat of transport of H in ZrH1.6 / gas constant = 640 K
initial
4
Stresses in hydride fuel pellet
• Stresses in pellet arise from two sources: - Thermal stress: must account for the temperature dependence of the linear coefficient of thermal expansion: ΔL α o (1 2 10 3 T) L thermal
半导体专业术语英语
1. acceptance testing (WAT: wafer acceptance testing)2. acceptor: 受主,如B,掺入Si中需要接受电子3. ACCESS:一个EDA(Engineering Data Analysis)系统4. Acid:酸5. Active device:有源器件,如MOS FET(非线性,可以对信号放大)6. Align mark(key):对位标记7. Alloy:合金8. Aluminum:铝9. Ammonia:氨水10. Ammonium fluoride:NH4F11. Ammonium hydroxide:NH4OH12. Amorphous silicon:α-Si,非晶硅(不是多晶硅)13. Analog:模拟的14. Angstrom:A(1E-10m)埃15. Anisotropic:各向异性(如POLY ETCH)16. AQL(Acceptance Quality Level):接受质量标准,在一定采样下,可以95%置信度通过质量标准(不同于可靠性,可靠性要求一定时间后的失效率)17. ARC(Antireflective coating):抗反射层(用于METAL等层的光刻)18. Antimony(Sb)锑19. Argon(Ar)氩20. Arsenic(As)砷21. Arsenic trioxide(As2O3)三氧化二砷22. Arsine(AsH3)23. Asher:去胶机24. Aspect ration:形貌比(ETCH中的深度、宽度比)25. Autodoping:自搀杂(外延时SUB的浓度高,导致有杂质蒸发到环境中后,又回掺到外延层)26. Back end:后段(CONTACT以后、PCM测试前)27. Baseline:标准流程28. Benchmark:基准29. Bipolar:双极30. Boat:扩散用(石英)舟31. CD:(Critical Dimension)临界(关键)尺寸。
电子信息工程专业英语教程_第5版 题库
《电子信息工程专业英语教程(第5版)》题库Section A 术语互译 (1)Section B 段落翻译 (5)Section C阅读理解素材 (12)C.1 History of Tablets (12)C.2 A Brief History of satellite communication (13)C.3 Smartphones (14)C.4 Analog, Digital and HDTV (14)C.5 SoC (15)Section A 术语互译Section B 段落翻译Section C阅读理解素材C.1 History of TabletsThe idea of the tablet computer isn't new. Back in 1968, a computer scientist named Alan Kay proposed that with advances in flat-panel display technology, user interfaces, miniaturization of computer components and some experimental work in WiFi technology, you could develop an all-in-one computing device. He developed the idea further, suggesting that such a device would be perfect as an educational tool for schoolchildren. In 1972, he published a paper about the device and called it the Dynabook.The sketches of the Dynabook show a device very similar to the tablet computers we have today, with a couple of exceptions. The Dynabook had both a screen and a keyboard all on the same plane. But Key's vision went even further. He predicted that with the right touch-screen technology, you could do away with the physical keyboard and display a virtual keyboard in any configuration on the screen itself.Key was ahead of his time. It would take nearly four decades before a tablet similar to the one he imagined took the public by storm. But that doesn't mean there were no tablet computers on the market between the Dynabook concept and Apple's famed iPad.One early tablet was the GRiDPad. First produced in 1989, the GRiDPad included a monochromatic capacitance touch screen and a wired stylus. It weighed just under 5 pounds (2.26 kilograms). Compared to today's tablets, the GRiDPad was bulky and heavy, with a short battery life of only three hours. The man behind the GRiDPad was Jeff Hawkins, who later founded Palm.Other pen-based tablet computers followed but none received much support from the public. Apple first entered the tablet battlefield with the Newton, a device that's received equal amounts of love and ridicule over the years. Much of the criticism for the Newton focuses on its handwriting-recognition software.It really wasn't until Steve Jobs revealed the first iPad to an eager crowd that tablet computers became a viable consumer product. Today, companies like Apple, Google, Microsoft and HP are trying to predict consumer needs while designing the next generation of tablet devices.C.2 A Brief History of satellite communicationIn an article in Wireless World in 1945, Arthur C. Clarke proposed the idea of placing satellites in geostationary orbit around Earth such that three equally spaced satellites could provide worldwide coverage. However, it was not until 1957 that the Soviet Union launched the first satellite Sputnik 1, which was followed in early 1958 by the U.S. Army’s Explorer 1. Both Sputnik and Explorer transmitted telemetry information.The first communications satellite, the Signal Communicating Orbit Repeater Experiment (SCORE), was launched in 1958 by the U.S. Air Force. SCORE was a delayed-repeater satellite, which received signals from Earth at 150 MHz and stored them on tape for later retransmission. A further experimental communication satellite, Echo 1, was launched on August 12, 1960 and placed into inclined orbit at about 1500 km above Earth. Echo 1 was an aluminized plastic balloon with a diameter of 30 m and a weight of 75.3 kg. Echo 1 successfully demonstrated the first two-way voice communications by satellite.On October 4, 1960, the U.S. Department of Defense launched Courier into an elliptical orbit between 956 and 1240 km, with a period of 107 min. Although Courier lasted only 17 days, it was used for real-time voice, data, and facsimile transmission. The satellite also had five tape recorders onboard; four were used for delayed repetition of digital information, and the other for delayed repetition of analog messages.Direct-repeated satellite transmission began with the launch of Telstar I on July 10, 1962. Telstar I was an 87-cm, 80-kg sphere placed in low-Earth orbit between 960 and 6140 km, with an orbital period of 158 min. Telstar I was the first satellite to be able to transmit and receive simultaneously and was used for experimental telephone, image, and television transmission. However, on February 21, 1963, Telstar I suffered damage caused by the newly discovered Van Allen belts.Telstar II was made more radiation resistant and was launched on May 7, 1963. Telstar II was a straight repeater with a 6.5-GHz uplink and a 4.1-GHz downlink. The satellite power amplifier used a specially developed 2-W traveling wave tube. Along with its other capabilities, the broadband amplifier was able to relay color TV transmissions. The first successful trans-Atlantic transmission of video was accomplished with Telstar II , which also incorporated radiation measurements and experiments that exposed semiconductor components to space radiation.The first satellites placed in geostationary orbit were the synchronous communication (SYNCOM ) satellites launched by NASA in 1963. SYNCOM I failed on injection into orbit. However, SYNCOM II was successfully launched on July 26, 1964 and provided telephone, teletype, and facsimile transmission. SYNCOM III was launched on August 19, 1964 and transmitted TV pictures from the Tokyo Olympics. The International Telecommunications by Satellite (INTELSAT) consortium was founded in July 1964 with the charter to design, construct, establish, and maintain the operation of a global commercial communications system on a nondiscriminatory basis. The INTELSAT network started with the launch on April 6, 1965, of INTELSAT I, also called Early Bird. On June 28, 1965, INTELSAT I began providing 240 commercial international telephone channels as well as TV transmission between the United States and Europe.In 1979, INMARSAT established a third global system. In 1995, the INMARSAT name was changed to the International Mobile Satellite Organization to reflect the fact that the organization had evolved to become the only provider of global mobile satellite communications at sea, in the air, and on the land.Early telecommunication satellites were mainly used for long-distance continental and intercontinental broadband, narrowband, and TV transmission. With the advent of broadband optical fiber transmission, satellite services shifted focus to TV distribution, and to point-to-multipoint and very small aperture terminal (VSAT) applications. Satellite transmission is currently undergoing further significant growth with the introduction of mobile satellite systems for personal communications and fixed satellite systems for broadband data transmission.C.3 SmartphonesThink of a daily task, any daily task, and it's likely there's a specialized, pocket-sized device designed to help you accomplish it. You can get a separate, tiny and powerful machine to make phone calls, keep your calendar and address book, entertain you, play your music, give directions, take pictures, check your e-mail, and do countless other things. But how many pockets do you have? Handheld devices become as clunky as a room-sized supercomputer when you have to carry four of them around with you every day.A smartphone is one device that can take care of all of your handheld computing and communication needs in a single, small package. It's not so much a distinct class of products as it is a different set of standards for cell phones to live up to.Unlike many traditional cell phones, smartphones allow individual users to install, configure and run applications of their choosing. A smartphone offers the ability to conform the device to your particular way of doing things. Most standard cell-phone software offers only limited choices for re-configuration, forcing you to adapt to the way it's set up. On a standard phone, whether or not you like the built-in calendar application, you are stuck with it except for a few minor tweaks. If that phone were a smartphone, you could install any compatible calendar application you like.Here's a list of some of the things smartphones can do:•Send and receive mobile phone calls•Personal Information Management (PIM) including notes, calendar and to-do list•Communication with laptop or desktop computers•Data synchronization with applications like Microsoft Outlook•E-mail•Instant messaging•Applications such as word processing programs or video games•Play audio and video files in some standard formatsC.4 Analog, Digital and HDTVFor years, watching TV has involved analog signals and cathode ray tube (CRT) sets. The signal is made of continually varying radio waves that the TV translates into a picture and sound. An analog signal can reach a person's TV over the air, through a cable or via satellite. Digital signals, like the ones from DVD players, are converted to analog when played on traditional TVs.This system has worked pretty well for a long time, but it has some limitations:•Conventional CRT sets display around 480 visible lines of pixels. Broadcasters have been sending signals that work well with this resolution for years, and they can't fit enough resolution to fill a huge television into the analog signal.•Analog pictures are interlaced - a CRT's electron gun paints only half the lines for each pass down the screen. On some TVs, interlacing makes the picture flicker.•Converting video to analog format lowers its quality.United States broadcasting is currently changing to digital television (DTV). A digital signal transmits the information for video and sound as ones and zeros instead of as a wave. For over-the-air broadcasting, DTV will generally use the UHF portion of the radio spectrum with a 6 MHz bandwidth, just like analog TV signals do.DTV has several advantages:•The picture, even when displayed on a small TV, is better quality.• A digital signal can support a higher resolution, so the picture will still look good when shown on a larger TV screen.•The video can be progressive rather than interlaced - the screen shows the entire picture for every frame instead of every other line of pixels.•TV stations can broadcast several signals using the same bandwidth. This is called multicasting.•If broadcasters choose to, they can include interactive content or additional information with the DTV signal.•It can support high-definition (HDTV) broadcasts.DTV also has one really big disadvantage: Analog TVs can't decode and display digital signals. When analog broadcasting ends, you'll only be able to watch TV on your trusty old set if you have cable or satellite service transmitting analog signals or if you have a set-top digital converter.C.5 SoCThe semiconductor industry has continued to make impressive improvements in the achievable density of very large-scale integrated (VLSI) circuits. In order to keep pace with the levels of integration available, design engineers have developed new methodologies and techniques to manage the increased complexity inherent in these large chips. One such emerging methodology is system-on-chip (SoC) design, wherein predesigned and pre-verified blocks often called intellectual property (IP) blocks, IP cores, or virtual components are obtained from internal sources, or third parties, and combined on a single chip.These reusable IP cores may include embedded processors, memory blocks, interface blocks, analog blocks, and components that handle application specific processing functions. Corresponding software components are also provided in a reusable form and may include real-time operating systems and kernels, library functions, and device drivers.Large productivity gains can be achieved using this SoC/IP approach. In fact, rather than implementing each of these components separately, the role of the SoC designer is to integrate them onto a chip to implement complex functions in a relatively short amount of time.The integration process involves connecting the IP blocks to the communication network, implementing design-for-test (DFT) techniques and using methodologies to verify and validate the overall system-level design. Even larger productivity gains are possible if the system is architected as a platform in such as way that derivative designs can be generated quickly.In the past, the concept of SoC simply implied higher and higher levels of integration. That is, it was viewed as migrating a multichip system-on-board (SoB) to a single chip containing digital logic, memory, analog/mixed signal, and RF blocks. The primary drivers for this direction were the reduction of power, smaller form factor, and lower overall cost. It is important to recognize that integrating more and more functionality on a chip has always existed as a trend by virtue of Moore’s Law, which predicts that the number of transistors on a chip will double every 18-24 months. The challenge is to increase designer productivity to keep pace with Moore’s Law. Therefore, today’s notion of SoC is defined in terms of overall productivity gains through reusable design and integration of components.。
钢铁冶金专业英语词汇
钢铁冶金专业英语词汇目录1 总论 (1)2 采矿 (1)3 选矿 (1)4 冶金过程物理化学 (2)4.1 冶金过程热力学 (2)4.2 冶金过程动力学 (4)4.3 冶金电化学 (5)4.4 冶金物理化学研究方法 (5)5 钢铁冶金 (5)5.1 炼焦 (5)5.2 耐火材料 (6)5.3 碳素材料 (7)5.4 铁合金 (7)5.5 烧结与球团 (7)5.6 高炉炼铁 (8)5.7 炼钢 (10)5.8 精炼、浇铸及缺陷 (12)6 钢铁材料 (14)7 英译汉 (14)'.1 总论采矿mining地下采矿underground mining露天采矿open cut mining, open pit mining, surface mining采矿工程mining engineering选矿(学)mineral dressing, ore beneficiation, mineral processing矿物工程mineral engineering冶金(学)metallurgy过程冶金(学)process metallurgy提取冶金(学)extractive metallurgy化学冶金(学)chemical metallurgy物理冶金(学)physical metallurgy金属学Metallkunde冶金过程物理化学physical chemistry of process metallurgy冶金反应工程学metallurgical reaction engineering 冶金工程metallurgical engineering钢铁冶金(学)ferrous metallurgy, metallurgy of iron and steel有色冶金(学)nonferrous metallurgy真空冶金(学)vacuum metallurgy等离子冶金(学)plasma metallurgy微生物冶金(学)microbial metallurgy喷射冶金(学)injection metallurgy钢包冶金(学)ladle metallurgy二次冶金(学)secondary metallurgy机械冶金(学)mechanical metallurgy焊接冶金(学)welding metallurgy粉末冶金(学)powder metallurgy铸造学foundry火法冶金(学)pyrometallurgy湿法冶金(学)hydrometallurgy电冶金(学)electrometallurgy氯冶金(学)chlorine metallurgy矿物资源综合利用engineering of comprehensive utilization of mineral resources中国金属学会The Chinese Society for Metals中国有色金属学会The Nonferrous Metals Society of China2 采矿采矿工艺mining technology有用矿物valuable mineral冶金矿产原料metallurgical mineral raw materials 矿床mineral deposit特殊采矿specialized mining海洋采矿oceanic mining, marine mining矿田mine field矿山mine露天矿山surface mine地下矿山underground mine矿井shaft矿床勘探mineral deposit exploration矿山可行性研究mine feasibility study矿山规模mine capacity矿山生产能力mine production capacity矿山年产量annual mine output矿山服务年限mine life矿山基本建设mine construction矿山建设期限mine construction period矿山达产arrival at mine full capacity开采强度mining intensity矿石回收率ore recovery ratio矿石损失率ore loss ratio工业矿石industrial ore采出矿石extracted ore矿体orebody矿脉vein海洋矿产资源oceanic mineral resources矿石ore矿石品位ore grade岩石力学rock mechanics岩体力学rock mass mechanics3 选矿选矿厂concentrator, mineral processing plant 工艺矿物学process mineralogy开路open circuit闭路closed circuit流程flowsheet方框流程block flowsheet产率yield回收率recovery矿物mineral粒度particle size粗颗粒coarse particle细颗粒fine particle超微颗粒ultrafine particle粗粒级coarse fraction细粒级fine fraction'.'.'.'.'.'.'.'.'.'.'.'.'.'.'.'.'.'.'.'.'.'.'.'.'.'.'.'.。
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a r X i v :c o n d -m a t /0105003v 1 [c o n d -m a t .s t r -e l ] 1 M a y 2001Phase diagram and optical conductivity of the one-dimensional spinless Holstein model Q.Wang ∗and H.Zheng Department of Applied Physics,Shanghai Jiao Tong University,Shanghai 200030,P.R.China Physics Department,Xinjiang Normal University,Uromuq 830053,P.R.China M.Avignon Laboratoire d’Etudes des Proprietes Electroniques des Solides,Centre National de la Recherche Scientifique,B.P.166,38042Grenoble Cedex 9,France Abstract The effects of quantum lattice fluctuations on the Peierls transition and the opti-cal conductivity in the one-dimensional Holstein model of spinless fermions have been studied by developing an analytical approach,based on the unitary transformation method.We show that when the electron-phonon coupling constant decreases to a finite critical value the Peierls dimerization is destroyed by the quantum lattice fluctu-ations.The dimerization gap is much more reduced by the quantum lattice fluctuations than the phonon order parameter.The calculated optical conductivity does not have the inverse-square-root singularity but have a peak above the gap edge and there ex-ists a significant tail below the peak.The peak of optical-conductivity spectrum is not directly corresponding to the dimerized gap.Our results of the phase diagram and the spectral-weight function agree with those of the density matrix renormalization group and the exact diagonalization methods.PACS number(s):71.38.+i;;71.30.+h;71.45.Lr;A great deal of quasi-one-dimensional materials,for example,the halogen-bridged mixed-valence transition-metal complexes,the conducting polymers,the organic and inorganic spin-Peierls systems,exhibit an instability against a periodic lattice distortion due to the Peierlsdynamics.Among the models for one-dimensional systems the Holstein Hamiltonian[1]is atypical electron-phonon coupling model studied by many previous authors.An interestingand still controversial problem is how the dimerized ground state is modified when quantumlatticefluctuations are taken into account.The quantum latticefluctuations could havean important effect in most quasi-one-dimensional materials with a dimerized ground statebecause the lattice zero-point motion is often comparable to the amplitude of the Peierlsdistortion[2].The challenge of understanding the physics of quantum latticefluctuationsled to an intense study of the Holstein model.Generally speaking,the nonadiabatic effectsuppresses the order parameters of the system[3].As the optical-absorption concerned,theresults of adiabatic approximations have inverse-square-root singularity at the gap edge.However,this approach is questionable and it has been shown that the quantum latticefluctuations must be taken into account to satisfactorily describe some physical propertiesof quasi-one-dimensional systems[4].By considering the nonadiabatic effect,the singularitymay disappear[5].The influences of the phonon frequency on the optical-conductivity spec-trum in the range fromω0=0toω0→∞should be studied for understanding the physics of electron-phonon interactions in nonadiabatic case.When the quantum latticefluctuations are taken into account the theoretical analysisbecomes much more difficult.In the past several years,the Holstein Hamiltonian has beeninvestigated by using various numerical approaches,such as Green’s function Monte Carlosimulation[6,7],renormalization group analysis[8,9],variational method of the squeezed-polaron wave-function[10],phenomenological approach[2],exact diagonalization[11],etc.Veryrecently,works of numerical approaches have been performed in relation to the Peierls transi-tion and the optical conductivity in the one-dimensional Holstein model of spinless fermionsby using the density matrix renormalization group[12]and the exact diagonalization[13]methods.However,as was pointed out in Ref.[13],because of the effects of limited systemsizes in numerical approaches,the precise determination of the critical value in the smallω0regime is somewhat difficult and the precise extraction of the dimerized gap from op-tical conductivity data is prevented.An analytical study of the Holstein model will makeit possible to have an insight into the intrinsical properties of the molecular crystal mate-rials.In a resent work,two of us[14]studied this model and investigated the dimerizationorder parameters and density of states in gapped phase and the velocity of charge excita-tions and Luttinger liquid stiffness constant in gapless phase.In this work we concentrateon the properties of the phase transition and the optical-responses of the system with theview of understanding the effects of quantum latticefluctuations on the Peierls instabilityand the optical conductivity in the Holstein model.We will show that our results of thephase diagram and the spectral-weight function agree surprisingly well with those of the density matrix renormalization group[12]and the exact diagonalization[13]methods,and in our theory the critical value can be determined precisely even for extremely small phonon frequency.The effects of quantum latticefluctuations on the dimerized gap and on the or-der parameters are essentially different.The peak of optical-conductivity spectrum is not directly corresponding to the dimerization gap.The one-dimensional spinless Holstein model,in momentum space isH= qω0b†q b q+ kǫk c†k c k−1N q,k g(b q+b†−q)c†k+q c k,(1)whereǫk=−2t cos k is the bare band structure,t the hopping integral,and N the total number of sites.c k and b q are the annihilation operators of electrons with momentum k and phonons with momentum q,respectively.The dispersionless phonon frequencyω0=KNu20+ k E0(k)c†k c k− k>0∆0(k)(c†k−πc k+c†k c k−π)2−1ωδ(k+q,k)[2−δ(k′−q,k′)]c†k+q c k c†k′−q c k′,(2)whereδ(k′,k)δ(k,k′)(ǫk−ǫk′),(3) E0(k)=ǫk−1ω2∆0(k)=αu0[1−δ(k−π,k)],(4)√α=gKN k>0[1−δ(k−π,k)] fe (c†k−πc k+c†k c k−π) fe .(5) Here|fe is the ground state of H eff.Thus,the total Hamiltonian can be written as˜H=˜H+˜H1,where˜H1includes the terms which are zero after being averaged over the phonon 0vacuum state,and˜H= qω0b†q b q+H eff.(6)By means of the Green’s function method to implement the perturbation treatment on the four-fermion term in Eq.(2),we get the renormalized band function and the gap function[14]E k =E 0(k )−2tλE 2k +∆2k is the fermionic spectrum in the gapped state,andc =1+2tλαu 0N k>0[1−δ(k −π,k )]∆0(k )E 20(k )+∆20(k ).(10)V =1Nl (−1)l <u l >=αW (k ).(12)These are basic equations in our theory.From Eq.(5),let u 0=0,we get the self-consistent equation of phase transition points in the g 2/ω0∼ω0plane,1=4tλ|E k |.(13)If ω0=0we have δ(k ′,k )=0and c =1,Eq.(5)becomes the same as that in the adiabatic theory.In our theory δ(k −π,k )has a sharp peak at the Fermi point and,since 1−δ(k −π,k )=4t |cos k |/(ω0+4t |cos k |),the logarithmic singularity in the integration of Eq.(5)in the adiabatic case is removed as long as the ratio ω0/t 0is fiparing Eq.(8)with that in the adiabatic case,∆=αu 0,we have the gap in the nonadiabatic case,∆=∆(π/2)=αu 0[c −d ].(14)This is the true gap in the fermionic spectrum.Fig.1shows the ground state phase diagram in the g/ω0∼t/ω0plane.The solid line is our analytical result.For comparison,the results of previous authors are also shown.The line with circle and the line with square denote the results of the density matrix renormalization group(DMRG)[12]and the two-cutoffrenormalization group(TCRG)[15],respectively.The line with triangle is the phase boundary of the variational Lanczos approach based on the inhomogeneous modified variational Lang-Firsov transformation(IMVLF)[13].To check the consistency of the phase transition quantitatively with that of DMRG,some critical values g c are listed in Table I.One can see from both thefigure and the table that our results agree surprisingly well with that of DMRG except for very largeω0(ω0/t≥10).Furthermore,our theory can get the phase boundary,separating Luttinger liquid(LL)and insulation(CDW) phases,even in the very smallω0regime,which is theoretically and experimentally significant since,from the view point of experiment,for quite a lot of realistic cases the frequency of quantum phononω0is small.It seems that in the DMRG and thefinite-lattice Lanczos approach,because of the effects of limited system sizes,the precise determination of the critical value in the smallω0regime is somewhat difficult[13].The infinite system is never really gapless within the adiabatic approach,because the gap remains nonzero,although it becomes very small for weak electron-phonon coupling.On the contrary,in our theory,the logarithmic singularity π/20dk/cos k in the integration of Eq.(5)is removed by the factor 1−δ(k−π,k)and the critical valueλc can be determined precisely even for extremely small phonon frequency.Inspired by the success of obtaining the phase diagram,we further investigate the dimer-ization gap and the optical responses.Fig.2shows the dimerization gap∆/t=∆(π/2)/t and the phonon order parameter αm p/t as functions of the phonon frequencyω0/t forλ=0.81.It is the most notable that there is a discontinuous drop in the dimerization gap once the phonon frequency changes,no matter how small it is,from zero tofinite,though at the adiabatic limit the dimerization gap ∆(π/2)/t=αm p/t.After the drop the dimerization gap and the phonon order parameter decrease as the phonon frequency increases.At the critical valueωc,the dimerization gap and the phonon order parameter go to zero simultaneously and the system becomes gapless,which indicates that the quantum latticefluctuations can destroy the dimerized Peierls state.The dimerization gap is much more reduced by the quantum latticefluctuations than the phonon order parameter.The reason for the different behavior of the dimerization gap and the order parameter is that the former is the value of Eq.(14)at the Fermi point k=π/2,where the quantum latticefluctuations have the strongest effect,while the latter is the integral (see Eq.(12))over the all Brillouin zone and the effect of the quantum latticefluctuations is gentled.The effects of quantum latticefluctuations on the dimerization gap and on the phonon order parameter are essentially different,especially whenω0is small.In the mean field(MF)approximation the Peierls distortion opens a gap2∆MF and∆MF=αm p.Thisrelation is sometimes assumed remains valid when quantum lattice fluctuations are taken into account.Our results indicate that this relation holds only in the adiabatic limit.The optical conductivity σ(ω)can be expressed by the retarded Green’s function as follows:σ(ω)=−2ε0nc 2[S,[S,j ]]+O (g 3).Allterms of higher order than g 2will be omitted in the following treatment.Because theaveraging of ˜H1over the phonon vacuum state is zero,in the ground state at zero temperature ˜H 1can be neglected.By using the approximately decoupling |g ′ ≈|g ′0 ,the ground state of ˜H 0,and ˜H ≈˜H 0in the calculation g |j (0)j (t )|g = g ′|[e (S +R )je −(S +R )]e i ˜Ht [e (S +R )je −(S +R )]e −i ˜Ht |g ′ ≈ g ′0|[e S je −S ]e i ˜H 0t [e S je −S ]e −i ˜H 0t |g ′0 ,(18)we can getK R (ω)=J 2ω−2W k +i 0+−1N k ′g 2W 2k +J 2ω20 1ω+ω0+W k +W k ′−i 0+×[δ2(k ′,k )(sin k ′−sin k )2(αk βk ′+βk αk ′)2+δ2(k ′−π,k )(sin k ′+sin k )2(αk αk ′+βk βk ′)2],(19)where αk =(1−E k /W k )/2.Thus,the optical conductivity σ(ω)=2ε0ncJ 2Nk ′g 2W 2k +2ε0ncJ 2ω20δ(ω−ω0−W k −W k ′)[δ2(k ′,k )(sin k ′−sin k )2(αk βk ′+βk αk ′)2+δ2(k ′−π,k )(sin k ′+sin k )2(αk αk ′+βk βk ′)2],(20)and the ω−integrated spectral-weight functionS (ω)= ω0σ(ω′)dω′.(21)The optical conductivity for different phonon frequencies are shown in Fig.3.The pa-rameter values used are:λ=1.0,withω0/t=0.01,0.05,and0.10.One can see that as ω0increases,the optical-absorption spectrum broadens but the peak height decreases and moves to lower photon energy,and the spectral-weight increases asω0increases.The inverse-square-root singularity at the gap edge in the adiabatic case[17]disappears and there is a significant tail below the peak because of the nonadiabatic effect.We note that in our theory, in mathematical viewpoint,the difference between theω0=0andω0>0cases mainly comes from the functional form of the gap[see Eq.(8)].Comparing it with that in the adiabatic limit,one can see that the subgap states come from the quantum latticefluctuations,i.e., the second term in the square bracket of Eq.(8).The rescaledω-integrated spectral-weight function S(ω)/S m versus the photon energyω/t relations of our result(solid line)and that of IMVLF(dashed line)are shown in Fig.4,where S m=S(ω→∞).The optical conductivityσ(ω)(rescaled by S m)of our result(solid line)is also shown.Because of thefinite-size effects the optical conductivity of IMVLF is oscillatory and can not be compared with our result directly.We use the same parameter values as in Ref.[13](Fig.6(b)):g/ω0=4.47,andω0/t=0.1.The true gap2∆(π/2)/t=1.04obtained from Eq.(14)is marked by the arrow.One can see that the peak of optical-conductivity spectrum is not directly corresponding to the dimerized gap.The energy gap is small than the activation energy of the optical-conductivity.Our result shows clearly both the position and the peak of optical conductivity and the spectral-weight agrees with that of IMVLF. While in the exact diagonalization method thefinite-size effects prevent a precise extraction of the CDW gap from the optical exact diagonalization data[13].In conclusion,the effects of quantum latticefluctuations on the optical-conductivity spectrum and the ground state phase diagram of the one-dimensional Holstein model of spinless fermions have been studied by developing an analytical approach.We show that when the electron-phonon coupling constant decreases the dimerization gap decreases,and at afinite critical value the Peierls dimerization is destroyed by the quantum latticefluctuations. The critical value of electron-phonon coupling can be determined precisely even for very small phonon frequency.The dimerization gap is much more reduced by the quantum latticefluctuations than the order parameter.The calculated optical conductivity does not have the inverse-square-root singularity but have a peak above the gap edge and there exists a significant tail below the peak.In nonadiabatic case the dimerization gap is small than what the peak position of the optical conductivity is corresponding to.Our results of the phase diagram and the spectral-weight function agree with those of the density matrix renormalization group and the exact diagonalization methods.References[1]T.Holstein,Ann.Phys.8,325(1959).[2]R.H.McKenzie and J.W.Wilkins,Phys.Rev.Lett.69,1085(1992);K.Kim,R.H.McKenzie,and J.W.Wilkins,Phys.Rev.Lett.71,4015(1993).[3]E.Fradkin,and J.E.Hirsch,Phys.Rev.B27,1680(1983).[4]T.W.Hagler and A.J.Heeger,Phys.Rev.B49,7313(1994).[5]H.Zheng,Phys.Rev.B56,14414(1997).[6]J.E.Hirsch and E.Fradkin,Phys.Rev.B27,4302(1983).[7]R.H.McKenzie,C.J.Hamer,and D.W.Murray,Phys.Rev.B53,9676(1996)[8]C.Bourbonnais and L.G.Caron,J.Physique50,2751(1989).[9]D.Schmeltzer,J.Phys.C18,L1103(1985).[10]H.Zheng,D.Feinberg,and M.Avignon,Phys.Rev.B39,9405(1989).[11]G.Wellein and H.Fehske,Phys.Rev.B56,4513(1997).[12]R.J.Bursill,R.H.McKenzie and C.J.Hamer,Phys.Rev.Lett.80,5607(1998).[13]A.Weisse and H.Fehske,Phys.Rev.B58,13526(1998).[14]H.Zheng and M.Avignon,Phys.Rev.B58,3704(1998).[15]L.G.Caron and C.Bourbonnais,Phys.Rev.B29,4230(1984).[16]C.Zhang,E.Jeckelmann,and R.White,Phys.Rev.B60,14092(1999).[17]J.T.Gammel,I.Batistic,A.R.Bishop,et al.,Physica B163,458(1990).Fig.1The ground state phase diagram in the g/ω0∼t/ω0plane.The solid line is our analytical result.The line with open circle and the line with open square denote the results of the density matrix renormalization group(DMRG)and the two-cutoffrenormalization group(TCRG)methods,respectively.The line with open triangle is the phase boundary of the variational Lanczos approach(IMVLF).Fig.2The dimerization gap∆/t=∆(π/2)/t and the order parameterαm p/t as func-tions of the phonon frequencyω0/t in the case ofλ=0.81.Fig.3The optical conductivity in the case ofλ=1.0for different phonon frequencies ω0/t=0.01,0.05,and0.10.Fig.4The rescaled optical conductivityσ(ω)andω-integrated spectral-weight function S(ω)/S m versus the photon energyω/t relations of our results and that of IMVLF,where S m=S(ω→∞).The parameter values used are same as in Ref.[14](Fig.6(b)):g/ω0=4.47, andω0/t=0.1.The dashed line is the result of IMVLF and the solid lines are our results. The arrow marks the true gap2∆(π/2)/t=1.04.Table I:Critical point g c.g∗is the value of g determined by letting the stiffness constant Kρ=1g c/ω0(Ref.[12]) 2.297(2) 2.093(2) 1.63(1) 1.61(1) 2.21(3) 2.79(5)g∗/ω0(Ref.[12]) 2.299 2.102 1.64 1.62 2.27 2.89g c/ω0 2.8215 2.1613 1.5939 1.6403 2.3068 2.8783 3.6868 6.97381234567LL stateCDW stateFIG.1 Qin Wang PRB 0.05 0.1 0.2 0.5 1 2 5 10 20 50 1000This Work DMRG TCRG IMVLFg /ω0t/ω00.00.20.40.60.8 1.00.00.40.81.2FIG.2 Qin Wang PRBλ=0.81∆(π/2)/t αm p /t ∆(π/2)/t , αm p /t ω0/t0.5 1.0 1.5 2.0 2.5 3.0 3.50.00.20.40.60.81.0S(ω)FIG.3 Qin Wang PRB λ=1.0ω0/t=0.10ω0/t=0.05ω0/t=0.01σ(ω),S(ω)(arb.units)ω/t0123450.00.20.40.60.81.02∆(π/2)/t=1.041.04FIG.4 Qin Wang PRBσ(ω)g/ω0=4.47ω0/t=0.1σ(ω), S (ω)/S m ω/t。