Integrated Memory Controllers with Parallel Coherence Streams
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Microchip LAN92542-3端口EtherCAT从控制器解决方案
microchip公司的LAN9254是集成了以太网PHY和解复用HBI / 32DIGIO的2/3端口EtherCAT®从控制器,包含全双工100BASE-TX收发器,支持100Mbps (100BASE-TX)工作. LAN9254支持HP Auto-MDIX,允许直接连接或通过LAN电缆,也支持EtherCAT P和信号质量指数PHY诊断. LAN9254包括EtherCAT从控制器和8KB双端口存储器(DPRAM)和8个现场总线存储器管理单元(FMMU),每个FMMU实现映射逻辑地址到物理地址. LAN9254还包含8个SyncManager,允许在EtherCAT主和本地应用间交换数据.每个SyncManager的取向和工作模式由EtherCAT主站来配置. LAN9254支持多种电源管理和叫醒特性.器件还包括I2C主EEPROM控制器,用来连接EEPROM,允许静态数据的存储和检索.LAN9254和IEEE 802.3/802.3u(快速以太网)兼容.单电源3.3V工作,主要用在马达运动控制,过程/工厂自动化,通信模块,接口卡和传感器,液压和气动阀门系统以及操作员界面.本文介绍了LAN9254亮点和主要优势,系统框图和内部框图,应用电路以及评估板EVB-LAN9254-DIGIO主要特性,框图,电路图和材料清单.The LAN9254 is a 2/3-port EtherCAT slave controller with dualintegrated Ethernet PHYs, each containing a full-duplex100BASE-TXtransceiver that supports 100Mbps (100BASE-TX) operation. The LAN9254 supports HP Auto-MDIX,allowing the use of direct connect or cross-over LAN cables. EtherCAT P and Signal Quality Index PHY diagnosticsaresupported.The LAN9254 includes an EtherCAT slave controller with 8K bytes ofDual Port memory (DPRAM) and 8 Fieldbus MemoryManagement Units(FMMUs).Each FMMU performs the task of mapping logical addresses tophysical addresses.The EtherCAT slave controller also includes 8 SyncManagers to allowthe exchange of data between the EtherCAT masterand the localapplication. Each SyncManagers direction and mode of operation isconfigured by the EtherCAT master.Two modes of operation are available: buffered mode or mailboxmode. In the buffered mode, both the localmicrocontroller and EtherCAT master can write to the device concurrently. The buffer within the LAN9254 will alwayscontain the latest data. If newer data arrives before the old data can be read out, the old data will be dropped. In mailbox mode, access to the buffer by the local microcontroller and the EtherCAT master isperformed using handshakes, guaranteeingthat no data will be dropped.The LAN9254 provides an EtherCAT direct mapping mode, whichinserts the EtherCAT registers into the base addressspace. The EtherCATdirect mapping mode eliminates the need for a command/data accessstructure, which canincrease the speed of smaller data blocks.The LAN9254 supports numerous power management and wakeupfeatures. The LAN9254 can be placed in a reducedpower mode and can be programmed to issue an external wake signal (IRQ or PME) via severalMicrochip LAN9254 2-3端口EtherCAT从控制器解决方案methods, including“Magic Packet”, “Wake on LAN”, wake onbroadcast, wake on perfect DA, and “Link Status Change”.This signal is idealfor triggering system power-up using remoteEthernet wakeup events. The device can be removed from the lowpowerstate via a host processor command or one of the wake events.The LAN9254 contains an I2C master EEPROM controller for connection to an EEPROM, allowing for the storage andretrieval of static data. Theinternal EEPROM Loader automatically loads stored configuration settings from theEEPROM into the device at reset. An EEPROM emulation feature, which requires additional software support, is availablefor EEPROM-lessoperation.The LAN9254 contains an I2C master EEPROM controller for connection to an EEPROM, allowing for the storage andretrieval of static data. Theinternal EEPROM Loader automatically loads stored configuration settings from theEEPROM into the device at reset. An EEPROM emulation feature, which requires additional software support, is availablefor EEPROM-lessoperation.To enable star or tree network topologies, the device can be configured as a 3-port slave, providing an additional MIIport. This port can beconnected to an external PHY, forming a tap along the current daisy chain, or to another LAN9254creating a 4-port solution. The MII port can pointupstream (as Port 0) or downstream (as Port 2).LED support consists of a standard RUN indicator and a LINK / Activity indicator per port. Configuration options enableERR and STATE_RUNindicators.A 64-bit distributed clock is included to enable high-precisionsynchronization and to provide accurate information aboutthe local timing of data acquisition.The LAN9254 can be configured to operate via a single 3.3V supplyutilizing an integrated 3.3V to 1.2V linear regulator.The linear regulator may be optionally disabled, allowing usage of ahigh efficiency external regulator for lower systempower dissipation. LAN9254亮点:• 2/3-port EtherCAT slave controller with 8 FieldbusMemoryManagement Units (FMMUs) and8 SyncManagers• Interfaces to most 8/16-bit embedded controllersand 32-bitembedded controllers with an 8/16-bitbus• Integrated Ethernet PHYs with HP Auto-MDIX• Wake on LAN (WoL) support• Low power mode allows systems to enter sleepmode until addressed by the Master• Cable diagnostic support• 1.8V to 3.3V variable voltage I/O• Integrated 1.2V regulator for single 3.3V operationLAN9254主要优势:• Integrated high-performance 100Mbps Ethernettransceivers- Compliant with IEEE 802.3/802.3u (Fast Ethernet)- Signal Quality Index diagnostics- Loop-back modes- Automatic polarity detection and correction- HP Auto-MDIX- Compatible with EtherCAT P• EtherCAT slave controller- Supports 8 FMMUs- Supports 8 SyncManagers- Distributed clock support allows synchronization withother EtherCAT devices- 8K bytes of DPRAM• 8/16-Bit Host Bus Interface- Indexed register, multiplexed or demultiplexed bus- Allows local host to enter sleep mode until addressed byEtherCAT Master- SPI / SQI (Quad SPI) support• Digital I/O Mode for optimized system cost- 32 available Digital I/Os• 3rd port for flexible network configurations • Comprehensive power management features- 3 power-down levels- Wake on link status change (energy detect)- Magic packet wakeup, Wake on LAN (WoL), wake onbroadcast, wake on perfect DA- Wakeup indicator event signal• Power and I/O- Integrated power-on reset circuit- Latch-up performance exceeds 150mAper EIA/JESD78, Class II- JEDEC Class 3A ESD performance- Single 3.3V power supply(integrated 1.2V regulator)• Additional Features- EEPROM emulation- Transformer-less link support- Multifunction GPIOs- Ability to use low cost 25MHz crystal for reduced BOM- 25MHz clock output for reference clock daisy chaining• Packaging- Pb-free RoHS compliant 80-pin TQFP-EP• Available in commercial, industrial, and extendedindustrial temp.rangesLAN9254目标应用:• Motor Motion Control• Process/Factory Automation• Communication Modules, Interface Cards • Sensors• Hydraulic & Pneumatic Valve Systems • Operator Interfaces图1:LAN9254系统框图图2:LAN9254内部框图。
NVIDIA nForce 680i SLI Extreme 介绍说明书
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NVIDIA NFORCE FEATURES AND BENEFITS* for INTEL
FEATURES CPU Dynamic Adaptive Speculative Pre-processor (DASP)
NVIDIA nForce4 Enthusiast
SLI X16
Extreme Gamer and Multimedia
Enthusiast
NVIDIA nForce4 Performance Gaming
SLI
Power User, Gamer, and
Multimedia Hobbiest
NVIDIA nForce4 Performance
CPU
Storage • Confidently store and protect priceless
digital media files with NVIDIA MediaShield™ technology • Support for multiple SATA 3Gb/s drives • Reliable, accessible, scalable, and easy to manage storage
(Dual 64-bit memory controllers, 128-bit interface) NVIDIA SLI-Ready Memory with EPP STORAGE NVIDIA® MediaShield™ Storage Technology
南桥北桥英语作文
South Bridge and North Bridge are two essential components in a computers motherboard,playing a vital role in the communication and coordination between various hardware devices.Heres a detailed English composition about these two components:Title:The Role of South Bridge and North Bridge in a Computer SystemIn the intricate architecture of a computer system,the motherboard is the central hub that connects all the components,allowing them to communicate and function efficiently. Two critical parts of the motherboard are the South Bridge and North Bridge,also known as the I/O Controller Hub and the Memory Controller Hub,respectively.This essay aims to explore the functions,importance,and evolution of these two components in modern computer systems.Introduction to South Bridge and North BridgeThe South Bridge and North Bridge are interconnected chips on the motherboard that facilitate data transfer between the central processing unit CPU,memory,and other peripheral devices.They are named based on their traditional positions relative to the CPU socket on the motherboard,with the North Bridge typically being closer to the CPU. Functions of South BridgeThe South Bridge is responsible for managing the input/output I/O operations of the computer.Its primary functions include:1.I/O Expansion Slots:It controls the expansion slots such as PCI,AGP,and PCI Express,which allow for the addition of various cards like graphics cards,network cards, and sound cards.B Controller:It manages Universal Serial Bus USB ports,enabling the connection of peripherals like keyboards,mice,printers,and external storage devices.3.SATA Controller:It oversees Serial ATA SATA ports,which are used for connecting hard drives,solidstate drives,and optical drives.4.Audio Controller:It provides support for integrated audio,managing the sound output and input through the motherboard.N Controller:In some systems,the South Bridge also includes a LAN controller for Ethernet connectivity.Functions of North BridgeThe North Bridge,on the other hand,is primarily responsible for highspeed data transfers between the CPU,memory,and graphics processing unit GPU.Its key functions are:1.Memory Controller:It interfaces with the systems RAM,managing the flow of data to and from the CPU.2.CPU Interface:It connects directly to the CPU,providing a highspeed pathway for data exchange.3.Graphics Interface:It links the CPU with the GPU,especially in systems where the GPU is not directly integrated into the CPU.4.PCIe Lanes for HighSpeed Data:It provides additional PCIe lanes for devices that require highspeed data transfer,such as solidstate drives or highperformance network cards.Evolution and IntegrationOver time,the distinction between the South Bridge and North Bridge has become less pronounced due to technological advancements.With the advent of integrated memory controllers in modern CPUs and the shift towards systemonachip SoC designs,the traditional roles of the North Bridge have been largely absorbed into the CPU itself.This has led to a consolidation of functions into a single chip,known as the Platform Controller Hub PCH,which combines aspects of both the South Bridge and North Bridge. ConclusionThe South Bridge and North Bridge have been pivotal in the development of computer systems,ensuring efficient data management and communication between various components.As technology continues to evolve,their roles have adapted,with many of their functions now integrated into other parts of the system.Understanding the historical and ongoing significance of these components provides insight into the complex interplay of hardware in a computers architecture.In summary,the South Bridge and North Bridge are integral to the motherboards operation,each with specific responsibilities that contribute to the overall performanceand connectivity of a computer system.Their evolution reflects the ongoing innovation in computer hardware design,aiming to enhance efficiency and performance.。
SAA7750-N1D 芯片资料PHILIPS_
Philips Semiconductors
Preliminary Specification version 1.3
SAA7750-N1D
CONTENTS 1 1.1 1.2 1.3 2 3 4 5 6 6.1 6.1.1 6.1.2 6.1.3 6.2 6.2.1 6.2.2 6.3 6.3.1 6.3.2 6.3.3 6.3.4 6.3.5 6.3.5.1 6.3.5.2 6.3.5.3 6.3.5.4 6.4 6.4.1 6.4.2 6.5 6.5.1 6.5.2 6.5.3 6.5.4 6.5.5 6.5.5.1 6.5.5.2 6.6 6.6.1 6.6.2 6.7 6.7.1 6.8 6.8.1 6.8.2 6.8.3 6.8.4 6.8.5 6.9 FEATURES Hardware Features General Features Software features GENERAL DESCRIPTION APPLICATIONS BLOCK DIAGRAM PINNING HARDWARE DESCRIPTION SSA ARM720T microcontroller Overview BLOCK DIAGRAM The THUMB Concept Internal busses Advanced High-performance Bus (AHB) AHB Address Decoder Memory controllers Overview Static Memory Controller SDRAM Interface Controller Internal Memory Controller FLASH memory controller FLASH reads Erasing the FLASH block Programming the FLASH block Operating conditions Interrupt Controller Overview Functional Description Power Management Unit (PMU) Functional Description Wake-up behaviour Watchdog behaviour Pause behaviour Power down behaviour Power down Request Power down Acknowledge Oscillators and clock generation Overview clock generation module Functional Description Multi Media Card Interface (MMC) Choice of flash memory cards 10-bit ADC Overview Functional description Multi channel A/D conversion scan ADC resolution Interrupts UART 2 6.9.1 6.9.2 6.9.3 6.10 6.10.1 6.10.2 6.11 6.11.1 6.11.2 6.11.3 6.12 6.12.1 6.12.2 6.13 6.13.1 6.13.2 6.14 6.14.1 6.14.2 6.15 6.15.1 6.15.2 6.16 6.16.1 6.16.2 6.16.3 6.16.4 6.16.5 6.16.6 6.16.7 6.16.8 6.16.9 6.17 6.17.1 6.18 6.19 6.19.1 6.19.1.1 6.19.1.2 6.19.1.3 6.19.1.4 6.20 6.20.1 6.20.1.1 6.20.2 6.20.3 6.20.4 6.20.5 6.20.6 6.20.7 6.20.8 6.20.9 6.21
AMD OpteronTM 6300系列处理器快速参考指南说明书
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SIMATIC S7-1200 CPU 1214C 数据手册说明书
CPU 1214C DC/DC/DC V4.5
STEP 7 V17 or higher
Yes 20.4 V 28.8 V Yes
24 V 20.4 V 28.8 V
500 mA; CPU only 1 500 mA; CPU with all expansion modules 12 A; at 28.8 V 0.5 A²·s
14
24 V 5 V DC at 1 mA 15 V DC at 2.5 mA
0.2 ms, 0.4 ms, 0.8 ms, 1.6 ms, 3.2 ms, 6.4 ms and 12.8 ms, selectable in groups of four 0.2 ms 12.8 ms
Yes
Single phase: 3 @ 100 kHz & 3 @ 30 kHz, differential: 3 @ 80 kHz & 3 @ 30 kHz
2/15/2022
Subject to change without notice © Copyright Siemens
Output voltage ● for signal "0", max. ● for signal "1", min.
Output current ● for signal "1" rated value ● for signal "0" residual current, max.
Analog outputs Number of analog outputs
Analog value generation for the inputs Integration and conversion time/resolution per channel ● Resolution with overrange (bit including sign), max. ● Integration time, parameterizable ● Conversion time (per channel)
MU70-SU0 LGA2011插座R3主板 用户手册说明书
2-3-6-1 IOAT 配置...................................................................................................84
-3-
第3章
2-3-2-3 CPU T State Control(CPU T 状态控制)............................................73
2-3-3 Common RefCode Configuration(通用 RefCode 配置)..............74
2-3-5-1 内存拓扑.....................................................................................................79
2-3-5-2 内存热效应................................................................................................80
目录
包装箱物品...........................................................................................................5 MU70-SU0 主板布局..........................................................................................6 框图.......................................................................................................................9 第 1 章 硬件安装.............................................................................................10
MEMORY存储芯片STM32F103VET6中文规格书
High-density performance line Arm®-based 32-bit MCU with 256 to 512KB Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfacesDatasheet − production data Features•Core: Arm® 32-bit Cortex®-M3 CPU–72 MHz maximum frequency, 1.25DMIPS/MHz(Dhrystone 2.1) performance at 0 wait statememory access–Single-cycle multiplication and hardwaredivision•Memories–256 to 512 Kbytes of Flash memory–up to 64 Kbytes of SRAM–Flexible static memory controller with 4 Chip Select. Supports Compact Flash, SRAM,PSRAM, NOR and NAND memories–LCD parallel interface, 8080/6800 modes •Clock, reset and supply management – 2.0 to 3.6V application supply and I/Os–POR, PDR, and programmable voltage detector (PVD)–4-to-16 MHz crystal oscillator–Internal 8 MHz factory-trimmed RC–Internal 40 kHz RC with calibration–32 kHz oscillator for RTC with calibration •Low power–Sleep, Stop and Standby modes–V BAT supply for RTC and backup registers • 3 × 12-bit, 1 µs A/D converters (up to 21channels)–Conversion range: 0 to 3.6 V–Triple-sample and hold capability–Temperature sensor• 2 × 12-bit D/A converters•DMA: 12-channel DMA controller–Supported peripherals: timers, ADCs, DAC, SDIO, I2Ss, SPIs, I2Cs and USARTs •Debug mode–Serial wire debug (SWD) & JTAG interfaces–Cortex®-M3 Embedded Trace Macrocell™•Up to 112 fast I/O ports–51/80/112 I/Os, all mappable on 16 external interrupt vectors and almost all 5V-tolerant •Up to 11 timers–Up to four 16-bit timers, each with up to 4IC/OC/PWM or pulse counter and quadrature(incremental) encoder input– 2 × 16-bit motor control PWM timers with dead-time generation and emergency stop– 2 × watchdog timers (Independent and Window)–SysTick timer: a 24-bit downcounter– 2 × 16-bit basic timers to drive the DAC•Up to 13 communication interfaces–Up to 2 × I2C interfaces (SMBus/PMBus)–Up to 5 USARTs (ISO 7816 interface, LIN, IrDA capability, modem control)–Up to 3 SPIs (18 Mbit/s), 2 with I2S interface multiplexed–CAN interface (2.0B Active)–USB 2.0 full speed interface–SDIO interface•CRC calculation unit, 96-bit unique ID •ECOPACK® packagesTable 1.Device summary Reference Part numberSTM32F103xCSTM32F103RC STM32F103VCSTM32F103ZCSTM32F103xDSTM32F103RD STM32F103VDSTM32F103ZDSTM32F103xESTM32F103RE STM32F103ZESTM32F103VEJuly 2018DS5792 Rev 13STM32F103xC, STM32F103xD, STM32F103xE Description modes2.3.10 BootAt startup, boot pins are used to select one of three boot options:•Boot from user Flash: you have an option to boot from any of two memory banks. By default, boot from Flash memory bank 1 is selected. You can choose to boot from Flashmemory bank 2 by setting a bit in the option bytes.•Boot from system memory•Boot from embedded SRAMThe boot loader is located in system memory. It is used to reprogram the Flash memory byusing USART1.2.3.11 Power supply schemes•V DD = 2.0 to 3.6 V: external power supply for I/Os and the internal regulator.Provided externally through V DD pins.•V SSA, V DDA = 2.0 to 3.6 V: external analog power supplies for ADC, DAC, Reset blocks, RCs and PLL (minimum voltage to be applied to VDDA is 2.4 V when the ADCor DAC is used). V DDA and V SSA must be connected to V DD and V SS, respectively.•V BAT = 1.8 to 3.6 V: power supply for RTC, external clock 32 kHz oscillator and backup registers (through power switch) when V DD is not present.For more details on how to connect power pins, refer to Figure12: Power supply scheme.2.3.12 Power supply supervisorThe device has an integrated power-on reset (POR)/power-down reset (PDR) circuitry. It isalways active, and ensures proper operation starting from/down to 2 V. The device remainsin reset mode when V DD is below a specified threshold, V POR/PDR, without the need for anexternal reset circuit.The device features an embedded programmable voltage detector (PVD) that monitors theV DD/V DDA power supply and compares it to the V PVD threshold. An interrupt can begenerated when V DD/V DDA drops below the V PVD threshold and/or when V DD/V DDA ishigher than the V PVD threshold. The interrupt service routine can then generate a warningmessage and/or put the MCU into a safe state. The PVD is enabled by software. Refer toTable12: Embedded reset and power control block characteristics for the values ofV POR/PDR and V PVD.2.3.13 VoltageregulatorThe regulator has three operation modes: main (MR), low-power (LPR) and power down.•MR is used in the nominal regulation mode (Run)•LPR is used in the Stop modes.•Power down is used in Standby mode: the regulator output is in high impedance: the kernel circuitry is powered down, inducing zero consumption (but the contents of theregisters and SRAM are lost)This regulator is always enabled after reset. It is disabled in Standby mode.DS5792 Rev 13Description STM32F103xC, STM32F103xD, STM32F103xEDS5792 Rev 132.3.14 Low-power modesThe STM32F103xC, STM32F103xD and STM32F103xE performance line supports threelow-power modes to achieve the best compromise between low-power consumption, short startup time and available wakeup sources:•Sleep modeIn Sleep mode, only the CPU is stopped. All peripherals continue to operate and can wake up the CPU when an interrupt/event occurs.•Stop modeStop mode achieves the lowest power consumption while retaining the content ofSRAM and registers. All clocks in the 1.8 V domain are stopped, the PLL, the HSI RC and the HSE crystal oscillators are disabled. The voltage regulator can also be put either in normal or in low-power mode.The device can be woken up from Stop mode by any of the EXTI line. The EXTI line source can be one of the 16 external lines, the PVD output, the RTC alarm or the USB wakeup.•Standby modeThe Standby mode is used to achieve the lowest power consumption. The internal voltage regulator is switched off so that the entire 1.8 V domain is powered off. The PLL, the HSI RC and the HSE crystal oscillators are also switched off. After entering Standby mode, SRAM and register contents are lost except for registers in the Backup domain and Standby circuitry.The device exits Standby mode when an external reset (NRST pin), an IWDG reset, a rising edge on the WKUP pin, or an RTC alarm occurs.Note:The RTC, the IWDG , and the corresponding clock sources are not stopped by entering Stop or Standby mode.2.3.15 DMAThe flexible 12-channel general-purpose DMAs (7 channels for DMA1 and 5 channels for DMA2) are able to manage memory-to-memory, peripheral-to-memory and memory-to-peripheral transfers. The two DMA controllers support circular buffer management,removing the need for user code intervention when the controller reaches the end of the buffer.Each channel is connected to dedicated hardware DMA requests, with support for software trigger on each channel. Configuration is made by software and transfer sizes between source and destination are independent.The DMA can be used with the main peripherals: SPI, I 2C, USART, general-purpose, basic and advanced-control timers TIMx, DAC, I 2S, SDIO and ADC.2.3.16 RTC (real-time clock) and backup registersThe RTC and the backup registers are supplied through a switch that takes power either on V DD supply when present or through the V BAT pin. The backup registers are forty-two 16-bit registers used to store 84 bytes of user application data when V DD power is not present. They are not reset by a system or power reset, and they are not reset when the device wakes up from the Standby mode.The real-time clock provides a set of continuously running counters which can be used with suitable software to provide a clock calendar function, and provides an alarm interrupt and aSTM32F103xC, STM32F103xD, STM32F103xEDescriptionDS5792 Rev 13Description STM32F103xC, STM32F103xD, STM32F103xEAdvanced-control timers (TIM1 and TIM8)The two advanced-control timers (TIM1 and TIM8) can each be seen as a three-phasePWM multiplexed on 6 channels. They have complementary PWM outputs withprogrammable inserted dead-times. They can also be seen as a complete general-purposetimer. The 4 independent channels can be used for:•Input capture•Output compare•PWM generation (edge or center-aligned modes)•One-pulse mode outputIf configured as a standard 16-bit timer, it has the same features as the TIMx timer. Ifconfigured as the 16-bit PWM generator, it has full modulation capability (0-100%).In debug mode, the advanced-control timer counter can be frozen and the PWM outputsdisabled to turn off any power switch driven by these outputs.Many features are shared with those of the general-purpose TIM timers which have thesame architecture. The advanced-control timer can therefore work together with the TIMtimers via the Timer Link feature for synchronization or event chaining.General-purpose timers (TIMx)There are up to 4 synchronizable general-purpose timers (TIM2, TIM3, TIM4 and TIM5)embedded in the STM32F103xC, STM32F103xD and STM32F103xE performance linedevices. These timers are based on a 16-bit auto-reload up/down counter, a 16-bit prescalerand feature 4 independent channels each for input capture/output compare, PWM or one-pulse mode output. This gives up to 16 input captures / output compares / PWMs on thelargest packages.The general-purpose timers can work together with the advanced-control timer via the TimerLink feature for synchronization or event chaining. Their counter can be frozen in debugmode. Any of the general-purpose timers can be used to generate PWM outputs. They allhave independent DMA request generation.These timers are capable of handling quadrature (incremental) encoder signals and thedigital outputs from 1 to 3 hall-effect sensors.Basic timers TIM6 and TIM7These timers are mainly used for DAC trigger generation. They can also be used as ageneric 16-bit time base.Independent watchdogThe independent watchdog is based on a 12-bit downcounter and 8-bit prescaler. It isclocked from an independent 40 kHz internal RC and as it operates independently from themain clock, it can operate in Stop and Standby modes. It can be used either as a watchdogto reset the device when a problem occurs, or as a free running timer for application timeoutmanagement. It is hardware or software configurable through the option bytes. The countercan be frozen in debug mode.Window watchdogThe window watchdog is based on a 7-bit downcounter that can be set as free running. Itcan be used as a watchdog to reset the device when a problem occurs. It is clocked fromDS5792 Rev 13。
娱乐机器人外文翻译
附录一Entertainment RobotsSarcos, a Utah-based company, developed the robot shown atleft. With 30 joints arranged in a torso supporting five branchingchains, this is the most kinematically complex robot I have everseen. Unlike most robots that are either electric or hydraulic, thisrobot utilizes pneumatic motors.Sarcos has developed some of the world's most sophisticated humanoid robots and virtual reality interfaces. Sarcos entertainment robots are constructed not only to be high performance, but also to be sensitive and graceful. Sarcos has placed a great deal of emphasis on the aesthetics of its humanoid as well as the engineering. Its corporate staff includes leading designers, artists and craftspeople who style the robots. Concept development and graphic renderings are supported by a complete sculpting facility, where high-performance skins and other coverings are produced. They can be teleoperated by a remote operator wearing a SenSuit or by a computer-controlled playback of a preprogrammed show. Recently, a Sarcos robot named DB has been used by the ERATO brain project in Japan to enable motion learning. DB has 30 D.O.F. and is nicely packaged in an 80kg, 1.85m body. A tether connects DB with its air supply and control computers.Any discussion of entertainment robots has to include Disney.They have been doing entertainment robots as long as anyone andthey do them quite well. With dancing bears and singing piratesDisney's imagineers have created thousands of robots. The robotshown at left is new as of August, 2003. It is a robot dinosaur named Lucky. He walks on his two back legs and pulls a very large cart of "silk flowers". Really the cart is full of batteries. Even Disney has not figured-out the battery issue that plagues mobile robots. This was the only way they could get enough battery life for the robot to spend a meaningful amount of time wandering the amusement part.I don't do roller coasters, but I'm sure my kids would love this.According to the manufacturer, KUKA Robotics, this is the firstrobot with world-wide certification to handle human beings. KUKA makes robots of very high-quality, so I would let my kids ride. Here's a description from the KUKA site "In the unique ROBOCOASTER from KUKA Roboter, the advantages of the practically unrestricted freedom of motion and excellent dynamic performance of an industrial robot have been exploited in the leisure and amusement industry for the first time."And who can forget the consumer entertainment robots thathave come onto the market in the last decade or so? From thoselittle Furby's that go for around twenty bucks to Sony's Aibo (twoof which are shown at left) that can top a thousand dollars a pop;these have been the first robots to really pervade our homes. One of the funniest things I have ever seen was my dog running around the house with a "live" Furby in its mouth. My dog would give it a shake every now and then and the Furby was going off like it was, well, like it was being shaken in a dog'sThe Lego Mindstorms are also a big player in this category. Future roboticists will likely remember their first Lego Mindstorms in the same way today's computer scientists remember their first TRS80 personal computer.Some entertainment robots are not much more than rolling,remote-controlled speaker phones with video camera "eyes."They can wander around at parties and play pre-recorded jinglesor display scrolling messages to promote a company's productsor distribute promotional literature.Florida Robotics makes robots like these. They also make more complex robots that have the capability to talk with on-lookers and include fiber optic hair, remote Florida Robotics makes robots like these. They also make more complex robots that have the capability to talk with on-lookers and include fiber optic hair, remote smoke.Disney makes use of a Florida Robotics robot called "X1846" at Walt Disney World in Orlando, Florida. X1846 serves drinks there. Heck, I'll take a robot that can bring me a soda.Bug RobotsI don't show many people on this site, but there is no discussionof bug robots without Rodney Brooks. He pretty much started thebug robot idea. There is so much information online about Rodney,his work at MIT and with iRobot that I am not even going tobother with that. I will tell you about a time I had lunch with him in the mid-1990's just off the StanfordUniversity campus. I'm sure he doesn't remember. It was a group of ten or twenty people presenting research work and I was lucky enough to sit at the same table as Rodney. We talked about our kids, our wives, the weather and none about robots. He's a nice guy; with an unassuming, down-to-earth personality and an Australian accent. I do find it interesting that Rodney's robotics research has progressed from bugs, to horses, to dogs and now on to humanoid robots. A kind of evolution in alifetime.The basic idea behind the bug robots was to try to understandvery simple biologic creatures and create corresponding robotsbefore trying to build highly complex robots that try to mimichuman reasoning. Even a fruit fly with less than twenty neural connections can fly, avoid obstacles,find food and mate (however it is that fruit flies mate). This idea makes a lot of sense, but in practicality building very tiny robots is quite difficult. It seems like the people who work on bug robots spend more time developing techniques for building tiny robots than they do on studying bug behaviors and ways to mimicthem.If you want to give bug robots a try, you might consider thelittle BugBrain by Yost Engineering on the left. Those bigwhiskers on the front give the bug the ability to sense contactswith objects in its environment and you can program the onboard computer to make decisions about how to react. That's a true robot. You can add other sensors to it too. Maybe a phototransistor so the bug can "run for the shadows" like real bugs do? According to the manufacturer you can also add wireless RF and an ultrasonic range finder to the bug. That could give it sensing and decision making capabilities on-par with University researchrobots.The exploration of Mars is one application that has beenproposed for bug robots. Instead of sending one or two big robots,send one or two thousand bug robots equipped with small camerasand chemical sensors. One of the advantages of this approach is fault tolerance. If a few of the bugs break or get lost, it is no big deal. Another is the ability of the small bugs to get into small places such as cracks or fissures in rocks. Of course the small size of the robots also limits the scale of tasks they can accomplish. For example even a thousand bugs working together are not going to drill a core sample ten feet into the Martiancrust.Undersea RobotsUndersea operations are a great application for robotics to replace humans. Working underwater is both dangerous and difficult for humans. Schilling Robotics makes the system shown at left. This system combines a remote operated vehicle with thrusters for maneuvering and two robot arms for manipulating. Note that one of the arms is almost a grappler. It can grab something rigid, such as the base of an oil rig, to steady the vehicle while the other arm performs such tasks as welding and valve maintenance.The robot at left is a biomimetic (mimicking biology) lobsterdeveloped by the NortheasternUniversityMarineScienceCenter.Biomimetic robots may employ myomorphic actuators, whichmimic muscle action; neuromorphic sensors, which, like animal sensors, represent sensory modalities such as light, pressure, and motion in a labeled-line code; biomimetic controllers, based on the relatively simple control systems of invertebrate animals; and autonomous behaviors that are based on the actual animal's behavior. If a robot like this goes walking around on the ocean floor, I wonder if a big fish will eat it ?The Australian Centre for Field Robotics at the University ofSydney developed the robot shown at left as a prototype forautonomous underwater robots that may one day explore andmonitor the Great Barrier Reef. At present this robot (called Oberon) must remain tethered to a ship on the surface, but its inventors predict that within a decade it would be possible for robots to be lowered to the ocean floor and left to get on with mapping the terrain on their own. Oberon has two scanning sonars and a depth sensor as well as a color camera. It does not need any independent information, such as from global positioning system satellites, to work out where it is.Robots in the MilitaryPretty much by definition, the military is a dangerous placefor humans. This makes it a logical application for robotics, butI definitely have mixed feelings about that. I can live with robotsassisting soldiers, but automated killing is taking it too far. At left we see the Smart Crane Ammunition Transfer System being developed by the Robotics Research Corporation. The goal is for one soldier to be able to unload the entire truck without ever leaving the cab. The system includes cameras, video screens, force sensors and specialgrippers.The photo at left shows a robotic mine-sweeper. It is basicallya tractorwith a bunch of swinging chains mounted on the front.These chains pound the ground with significant forces toexplode any buried mines. Using GPS and relatively simplecontrol algorithms, robots such as these can be programmed to methodically cover large areas of ground in a perfect grid. Vehicles like this can also be equipped with water cutting tools to cut into and through explosive ordnance, water cannons to disperse unruly mobs and charge setters to explode suspicious packages. For these operations the unmanned vehicle would beteleoperated.The Predator shown at left has probably become our military'smost famous unmanned vehicle. It is essentially a superhigh-tech r/c plane though it does have some autonomous flyingcapabilities. Originally designed for reconnaissance, it now can be outfitted with a variety of different weaponry, most recently the laser-guided AGM-114 Hellfire anti-armor missiles. It is roughly 29 feet long with a 49 foot wingspan. Since 1995, the Predator has seen action over Iraq, Bosnia, Kosovo andAfghanistan.The photo at left shows an unmanned underwater vehiclethat was developed by Woods Hole Oceanographic Institution(WHOI) under ONR support. It performs reconnaissance(hydrographic and side-scan sonar surveys) in littoral waters, from the seaward edge of the surf zone into waters as deep as 100 meters. The vehicle is small, capable of deployment by two people, and can be launched andrecovered from a small vessel without a crane or other special handling equipment. It can operate over 20 hours on battery power before recharging and is capable of speeds over附录二娱乐机器人犹他州的Sarcos公司开发出了左图所示的机器人。
Rain Bird高尔夫球场灌溉系统产品指南说明书
¢ Golf Rotors . . . . . . . . . . . . . . . . . . . . . . . 4¢ IC System™ . . . . . . . . . . . . . . . . . . . . . . .6¢ Field Controllers . . . . . . . . . . . . . . . . . .7¢ Central Control Systems . . . . . . . . . . .8¢ Pump Stations . . . . . . . . . . . . . . . . . . .10¢ Warranty . . . . . . . . . . . . . . . . . . . . . . . .11Rain Bird is the only manufacturer devoted exclusively to irrigation. That means you have our commitment to provide you with fully-integrated, end-to-end solutions for your entire course. Planning a system for new construction? Renovating or upgrading an existing layout? Reducing maintenance costs? Improving resource efficiencies or complying with mandated regulations? Rain Bird offers a multitude of options to precisely meet your needs. Experience the difference of working with the one company that lives and breathes irrigation.It’s what we do. It’s all we do.Single Source. Multiple Choice.Cover: Winged Foot Golf ClubInside Cover: Somerset Hills Country ClubTimeless Compatibility™Every Rain Bird golf irrigation product is engineered for Timeless Compatibility, allowing you to have a state-of-the-art system that can be updated or changed without obsoleting your existing equipment.Real-Time ResponseRain Bird offers continuous two-way communication, allowing for automatic optimization between your Central Control and the field. By receiving data and making instant adjustments when needed, you can protect your course from unforgiving weather and unexpected challenges.Unmatched QualityThroughout engineering, design and testing, Rain Bird’s mission is to deliver industry-leading quality to our customers. Our stringent testing procedures are implemented at the first launch of every product as well as regularly throughout the year, and they replicate the world’s harshest conditions. Easy To UseAll Rain Bird products are engineered with the challenges of golf professionals in mind and designed to deliver everyday ease of use. From software interfaces to rotor designs, they help you and your crew find a quicker, hassle-free path to top playability.G O L F R O T O R S4GOLF ROTORSWhat goes into building a superior rotor? It’s delivering a unique combination of uniform application, high efficiency and rock-solid dependability. Rain Bird® rotors lead the way with unmatched performance. Choose from three proven series to meet every course need from wide open fairways to postage stamp greens.Engineered to Perform. Built to Last.Rain Bird 500/550 SeriesThe 500/550 Series is a true golf-quality rotor with valve-in-head options, ideal for tee boxes, greens and smaller areas requiring short- to medium-throw ranges. Features higher flow rates and large droplets that reduce wind drift. Get better coverage with greater precision in a shorter amount of time.Rain Bird 700/751 Series700/751 Series rotors offer unmatched flexibility and dependability across your entire course, with simple “turn-of-the screw” adjustments. Experience the intelligent ease of patented Memory Arc® technology built into our 751 Series, allowing you to switch between full- and part-circle settings without resetting the arc.GOLF ROTORS/golf5GOLF ROTORSEAGLE™ 900/950 SeriesBig spaces demand big performance. Our 900/950 Series rotors deliver in spades with extra- long throw ranges, increased droplet size and uniformity that is reliable and consistent. Choose full-circle 900 Series or 950 Series for part-circle precision application.TOP SERVICEABILITYAll Rain Bird golf rotors featuretop-serviceable arc adjustments and pressure regulation, as well as quick access to internal components. This is just one more way that Rain Bird makes your job easier.FeaturesSwing JointsMaximize the performance and protect any Rain Bird rotor with ourhigh-performance swing joints. Available in a wide range of configurations, the unique swept elbow design reduces pressure loss by up to 50% to promote consistent flow and optimal watering. Allows for easy adjustment of head to grade to prevent damage when run over by equipment.Extended Rain Bird golf rotor warranty available when purchased and installed with Rain Bird swing joints.IC SYSTEM™Take precision to the next level by adding Integrated Control (IC) to your Rain Bird rotors (see page 6). Provides revolutionary anywhere/anytime diagnostics and feedback to help you maintain the best playing conditions.GBS25 PROTECTIONAll Rain Bird electric rotors (except IC) feature a robust GBS25 solenoid. You get unmatched 25kV surge protection and built-in filtration from debris. This Rain Bird exclusive virtually eliminates the most common maintenance tasks that plague competing rotors.Quick SpecsICSYSTEM™Pinpoint Control and DiagnosticsControl modules built into every rotor provide real-timeinformation to the system. Access diagnostics and adjustrotors from any web-enabled device, from anywhere in theworld. So fast and easy you can check the status of up to1,500 rotors in 90 seconds or less.Simplified DesignChoose the Rain Bird IC System and eliminate up to 90% ofthe wire and all of the decoders and satellites. Improves theappearance of your course while saving valuable time andunneeded costs.Streamlined InstallationWith simplified wiring requirements, you can dramaticallyreduce installation time and costs. Eliminates more than 50%of the splicing required with traditional systems. Why take onthat extra vulnerability?Exclusive Hybrid CapabilityOnly Rain Bird allows you to control different types offield hardware through a single Central Control System.This hybrid solution eliminates the need to run differentsoftware platforms and allows hassle-free phased or partialrenovations, making changes and upgrades easier and morecost effective.Easy ExpandabilityA Rain Bird IC System is an excellent choice for today andtomorrow. Should your system need to expand you caninstall additional IC Rotors anywhere there is a Maxi Wire,up to 36,000 rotor capacity.Central Control ComputerMAXIWIREIC VALVEIC Interface/golf7FIELD CONTROLLERSFIELD CONTROLLERSRain Bird offers an array of proven field controllers that make scheduling, adjusting and maintaining your system as easy as possible, while optimizing course playability and appearance. Each is fully compatible with any Rain Bird Central Control system. Maintain Control.PAR+ES ControllerThis easy-to-program controller features 72-station capability, unlimited programs, premium surge protection, extensive diagnostics and a best-in-class pedestalenclosure. Also available as a retro kit (PAR+ES Retro Kit) for a budget-minded option to extend the life of a current controller.PAR+ES SAT DecoderCombines the features and benefits of a satellite system with those of a decodersystem. Easy to install with reduced costs. Expandable as your renovation or site grows.ESC-1 ControllerGet advanced water management in one easy-to-use package. A value-priced controller with 16, 24 or 40 station capacities, it features four programs, a real-time calendar and RASTER™ troubleshooting technology.DecodersAn excellent choice for renovations, a buried Rain Bird decoder system leaves nothing to the elements. These field-proven solutions offer in-field control options, easy expandability and a cost-effective alternative to protective enclosures. Choose from five models to operate one, two, four or six solenoids.8C E N T R A L C O N T R O L S Y S T E M SCENTRAL CONTROL SYSTEMSCirrus™Our most advanced option, Cirrus controls many of golf’s most sophisticated irrigation systems. GPS geo-referenced images. State-of-the-art ET-basedscheduling. Cirrus delivers the most innovative features in an intuitive package that lets you spend less time dealing with issues and more time with solutions.Nimbus™ IINimbus delivers advanced features with simpleadministration, ideal for saving time and effort whilemaintaining premier playing conditions. ET-based scheduling, precise flow management and real-time adjustments help you get the most out of every drop of water.Stratus™ II and StratusLT™Offering two options, the Stratus platform is an excellent choice for simple-time or ET-based scheduling. Choose to start with the basics, or upgrade to more advanced features. With either system, Rain Bird delivers the ease and convenience you want in a Central Control system, aiding superior turf and playing conditions throughout the year.To maintain superior turf and playing conditions, there are no routine answers. Day to day, hour to hour—even minute to minute—you need to be able to react and respond quickly to changing conditions. Rain Bird Central Control systems not only optimize performance automatically, but give you the power to make critical decisions in real time. Intuitive; Flexible; Empowering; That’s Rain Bird Central Control. Choose from several options to dial in a solution that best meets your needs.Puts You in 24/7 Command./golf9CENTRAL CONTROL SYSTEMSCENTRAL CONTROL SYSTEMSMI Series™ Mobile ControllersControl sprinklers, adjust programs, run diagnostics, edit station and program details, and review system activity from any web-enabled computer, tablet or smart phone. The MI Series software lets you use up to nine devices simultaneously to remotely manage your system from anywhere in the world.SpecificationsRain Watch™Rain Bird’s patented Rain Watch technology provides automatic real-time decision-making based on accurate rainfall measurements. By adding this intelligence to your system you’ll maximize water efficiency while reducing system wear and tear.Up to four high-resolution Rain Watch cans can be placed throughout your course to collect up-to-the-minute rainfall data. Rain Watch utilizes rainfall data to modify the amount of water applied for optimal irrigation.10P U M P S T A T I O N SPUMP STATIONSPump Manager 2A powerful software application, Pump Manager 2 gives you remote pump control, monitoring and data reporting. Compatible with your computer or Rain Bird Central Control and fully integrated with our exclusive Smart Pump™. Available in 11 different languages.Smart Pump™This proprietary software integrates directly with Rain Bird Central Control and improves pump performance more than any other comparable product on the market. Embracing the Rain Bird reservoir to rotor philosophy, Smart Pump will provide optimal flow rates and significant energy savings. Smart Pump is a smart choice for any system.Devoted solely to irrigation, Rain Bird brings its unmatched expertise to every component of your system, including pumps and pump stations. Designed for durability and performance, we deliver real-time response, reduced water use, lower energy costs and less wear and tear on your pumping equipment.Industry-Leading Expertise.A Custom Fit for Any Environment or BudgetEvery Rain Bird pump station is custom-built for the specific requirements of your site. We offer a variety of options that make it easier to achieve the most efficient performance possible./golf11WARRANTYRain Bird will repair or replace at no charge any Rain Bird professional product that fails in normal use within the warranty period stated below. You must return it to the dealer or distributor where you bought it. Product failures due to acts of God including without limitation, lightning and flooding, are not covered by this warranty. This commitment to repair or replace is our sole and total warranty.Implied Warranties of Merchantability and Fitness, if Applicable, are Limited to One Year from the Date of Sale. We will not, under any circumstances be liable for incidental or consequential damages, no matter how they occur.I. Landscape Irrigation Products1800® Series Pop-Up Spray Heads, U-Series Nozzles, Brass MPR Nozzles, A-8S and PA-8S-PRS Shrub Adapters, and 1300 and 1400 Bubblers, 5000 Series Rotors, 5500 Series Rotors, 7005/8005 Rotors, Falcon® 6504 Series Rotors, PEB and PESB Plastic Valves – 5 Years All other Landscape Irrigation products – 3 yearsII. Golf ProductsGolf Rotors: EAGLE™ Series and EAGLE IC™ Series, Rain Bird® Series and Rain Bird IC™ Golf rotors – 3 years. Additionally, EAGLE Series and EAGLE IC Series, Rain Bird Series and Rain Bird IC Golf Rotor sold and installed in conjunction with a Rain Bird swing joint – 5 years. Proof of concurrent installation is required.Swing Joints – 5 yearsBrass Remote Control Valves and Brass Quick Coupling and Keys – 3 years Filtration system controllers – 3 years LINK™ Radios – 3 yearsTSM-3 SDI12 Soil Sensor (ISS) – 3 years All other golf products – 1 year III. Agricultural ProductsLF Series Sprinklers – 5 years Other Impact Sprinklers – 2 years All other AG products – 1 year IV. Pump StationsRain Bird guarantees that its pump station will be free of manufacturer defects for three years from the date of start-up but not beyond forty months from the date of purchase by the original customer with a copy of the seller’s invoice required for coverage under this Policy. Start-up or service by anyone other than a Rain Bird authorized representative, when required, will void these terms and conditions.Provided that all installation, start-up, operation responsibilities, and recommendedmaintenance procedures have been properly executed and performed by authorized Rain Bird representatives, when required, Rain Bird will replace or repair, at Rain Bird’s option, any Rain Bird part found to be defective under normal recommended use during the effective period of this Policy, such evaluation to be solely determined by Rain Bird. Rain Bird’s only obligation and customer’s exclusive remedy under this Policy is limited to repair or replacement, at Rain Bird’s option, of the parts or the products the defects of which arereported to Rain Bird within the applicable Policy period, which prove to be defective and such evaluation will be solely determined by Rain Bird.In no case will Rain Bird cover labor costs associated with repair or replacement of parts beyond one year from date of start-up. Repairs performed and parts used at Rain Bird’sexpense must be authorized by Rain Bird, in writing, prior to repairs being performed. Product repairs or replacement under this Policy will not extend this Policy. Coverage for repaired or replaced product shall end when this Policy terminates. Rain Bird’s sole obligation and customer’s exclusive remedy under this Policy shall be limited to such repair or replacement.Upon request, Rain Bird may provide advice on trouble-shooting a defect during the effective period of this Customer Satisfaction Policy. Repair service must be performed by a Rain Bird authorized representative regardless of whether the labor is covered by Rain Bird or is at the owner’s expense during the effective period of this Policy. However, no service, replacement or repair under this Customer Satisfaction Policy will be rendered while the customer is in default of any payments due to Rain Bird .Rain Bird will not accept responsibility for costs associated with the removal, replacement or repair of equipment in difficult-to-access locations and such evaluation will be solely determined by Rain Bird. Difficult-to-access locations include (but are not limited to) locations where any of the following are required:1) C ranes larger than 15 tons 2) Divers 3) Barges4) Helicopters5) Dredging 6) R oof removal or other such construction/deconstruction requirements 7) A ny other unusual means or requirement s Such extraordinary cost associated with difficult-to-access locations shall be the sole responsibility of the customer, regardless of the reason requiring removal, repair or replacement of the equipment.The terms and conditions of this Customer Satisfaction Policy do not cover damage, loss or injury caused by or resulting from the following:1) M isapplication, abuse, or failure toconduct routine maintenance (to includewinterization/winter lay-up procedures).2) P umping of liquids other thanfresh water as defined by the U.S.Environmental Protection Agency,unless the pump station quoted byRain Bird specifically lists these other liquids and their concentrations.3) U se of pesticides (to include insecticides, fungicides and herbicides), free chlorine or other strong biocides.4) E xposure to electrolysis, erosion, or abrasion.5) U se or presence of destructive gases or chemicals unless these materials and their concentrations are specified in the Rain Bird quotation.6) E lectrical supply voltages above orbelow those specified for correct pumpstation operation.7) Electrical phase loss or reversal.8) U se of a power source other than thatspecified in the original quotation.9) N on-WYE configured power supplies such as open delta, phase converters or other forms of unbalanced three phase power supplies.10) I mproper electrical grounding or exposure to incoming power lacking circuit breaker or fused protection.11) U sing the control panel as a service disconnect.12) L ightning, earthquake, flood, windstorm or other Acts of Nature.13) F ailure of pump packing seal (unlessthe failure occurs on initial start-up).14) A ny damage or loss to plants,equipment or groundwater or injury to people caused by the failure of or improper use of an injection system or improper concentration of chemicalsor plant nutrients introduced into the pump station by an injection system.15) A ny failure of nutrient or chemicalstorage or spill containment equipment or facilities associated with the pump station location.The foregoing terms and conditions constitute Rain Bird’s entire pump station customer satisfaction policy. This policy is exclusiveand in lieu of any other warranties whatsoever, whether express, implied, or statutory including the implied warranties ofmerchantability and fitness for a particular purpose, which are all hereby expressly disclaimed. The sole remedy under this policy shall be limited to the repair or replacement of the pump station or its components pursuant to the terms and conditions contained herein. In the case of any components or injection systems manufactured by others (as noted on the pump station quotation), there is no warranty provided by Rain Bird and these items are covered solely by and to the extent of the warranty if any, offered by those other manufacturers.Rain Bird shall not be liable to the customer or any other person or entity for any liability, loss, delay or damage caused or alleged to be caused, directly or indirectly, by any use, defect, failure or malfunction of the pump station or by any injection system whether a claim for such liability, loss, delay or damages is based upon warranty, contract, tort or otherwise. Rain Bird shall not be liable for incidental, consequential, collateral or indirect damages or delay or loss of profit or loss of use or any damages related to the customer’s business operations, nor for those caused by acts of nature. In no case and under no circumstances shall Rain Bird’s liability exceed the Rain Bird Corporation’s net sale price of the pump station.Laws concerning customer warranties and disclaimers vary from state to state, jurisdiction to jurisdiction, province to province or country to country and therefore some of the foregoing limitations may not apply to you. The exclusions and limitations set out above are not intended to, and should not be construed so as to contravene mandatory provisions of applicable law. If any part or term of this policy is held to be illegal, unenforceable or in conflict with applicable law by a court of competent jurisdiction, the validity of the remaining portions of this policy shall not be affected, and all rights and obligations shall be construed and enforced as if this policy did not contain the particular part or term held to be invalid.V. All other products – 1 yearAt Rain Bird, we believe it is our responsibility to develop products and technologies that use water efficiently. Our commitment also extends to education, training and services for our industry and our communities.The need to conserve water has never been greater. We want to do even more, and with your help, we can. Visit for more information about The Intelligent Use of Water.™The Intelligent Use of Water .™L E A D E R S H I P • E D U C A T I O N • P A R T N E R S H I P S • P R O D U C T SD37414® Registered Trademark of Rain Bird Corporation © 2018 Rain Bird Corporation 3/18Rain Bird Corporation 970 W . Sierra Madre Azusa, CA 91702Phone: (626) 812-3400 Fax: (626) 812-3411Rain Bird Technical Services (866) GSP-XPRT (477-9778) (U .S . and Canada)Rain Bird Corporation 6991 East Southpoint Road Tucson, AZ 85756Phone: (520) 741-6100 Fax: (520) 741-6522Rain Bird International, Inc.1000 W . Sierra Madre Azusa, CA 91702Phone: (626) 963-9311 Fax: (626) 963-4287。
MEMORY存储芯片MAX1632EAI中文规格书
For pricing, delivery, and ordering information, please contact /Dallas Direct! at , or visit Maxim’s website at .________________General Description The MAX1630–MAX1635 are buck-topology, step-down,switch-mode, power-supply controllers that generatelogic-supply voltages in battery-powered systems. These high-performance, dual/triple-output devices include on-board power-up sequencing, power-good signaling with delay, digital soft-start, secondary winding control, low-dropout circuitry, internal frequency-compensation net-works, and automatic bootstrapping. Up to 96% efficiency is achieved through synchronous rectification and Maxim’s proprietary Idle Mode™ control scheme. Efficiency is greater than 80% over a 1000:1load-current range, which extends battery life in system-suspend or standby mode. Excellent dynamic response corrects output load transients caused by the latest dynamic-clock CPUs within five 300kHz clock cycles.Strong 1A on-board gate drivers ensure fast external N-channel MOSFET switching. These devices feature a logic-controlled and synchroniz-able, fixed-frequency, pulse-width-modulation (PWM)operating mode. This reduces noise and RF interference in sensitive mobile communications and pen-entry appli-cations. Asserting the SKIP pin enables fixed-frequency mode, for lowest noise under all load conditions. The MAX1630–MAX1635 include two PWM regulators,adjustable from 2.5V to 5.5V with fixed 5.0V and 3.3V modes. All these devices include secondary feedbackregulation, and the MAX1630/MAX1632/MAX1633/MAX1635 each contain 12V/120mA linear regulators. The MAX1631/MAX1634 include a secondary feedback input(SECF B), plus a control pin (STEER) that selects which PWM (3.3V or 5V) receives the secondary feedback sig-nal. SECF B provides a method for adjusting the sec-ondary winding voltage regulation point with an external resistor divider, and is intended to aid in creating auxiliaryvoltages other than fixed 12V.The MAX1630/MAX1631/MAX1632 contain internal out-put overvoltage and undervoltage protection features.________________________Applications Notebook and Subnotebook Computers PDAs and Mobile CommunicatorsDesktop CPU Local DC-DC Converters____________________________Features ♦96% Efficiency♦+4.2V to +30V Input Range♦2.5V to 5.5V Dual Adjustable Outputs ♦Selectable 3.3V and 5V Fixed or Adjustable Outputs (Dual Mode™)♦12V Linear Regulator♦Adjustable Secondary Feedback(MAX1631/MAX1634)♦5V/50mA Linear Regulator Output♦Precision 2.5V Reference Output♦Programmable Power-Up Sequencing♦Power-Good (RESET) Output♦Output Overvoltage Protection(MAX1630/MAX1631/MAX1632)♦Output Undervoltage Shutdown(MAX1630/MAX1631/MAX1632)♦200kHz/300kHz Low-Noise, Fixed-Frequency Operation♦Low-Dropout, 99% Duty-Factor Operation ♦2.5mW Typical Quiescent Power (+12V input, both SMPSs on)♦4μA Typical Shutdown Current♦28-Pin SSOP PackageMAX1630–MAX1635________________________________________________________________ Integrated Products 1________________Functional Diagram _______________Ordering Information Ordering Information continued at end of data sheet.Pin Configurations and Selector Guide appear at end of datasheet.Idle Mode and Dual Mode are trademarks of Integrated Products.+Denotes lead-free package.找MEMORY 、二三极管上美光存储M A X 1630–M A X 1635Multi-Output, Low-Noise Power-Supply Controllers for Notebook Computers 2_______________________________________________________________________________________ABSOLUTE MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS(V+ = 15V, both PWMs on, SYNC = VL, VL load = 0mA, REF load = 0mA, SKIP = 0V, T A = T MIN to T MAX , unless otherwise noted.Typical values are at T A = +25°C.)Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.V+ to GND..............................................................-0.3V to +36V PGND to GND.....................................................................±0.3V VL to GND ................................................................-0.3V to +6V BST3, BST5 to GND ...............................................-0.3V to +36V LX3 to BST3..............................................................-6V to +0.3V LX5 to BST5..............................................................-6V to +0.3V REF, SYNC, SEQ, STEER, SKIP , TIME/ON5,SECFB, RESET to GND............................................-0.3V to +6V V DD to GND............................................................-0.3V to +20VRUN/ON3, SHDN to GND.............................-0.3V to (V+ + 0.3V)12OUT to GND...........................................-0.3V to (V DD + 0.3V)DL3, DL5 to PGND........................................-0.3V to (VL + 0.3V)DH3 to LX3...............................................-0.3V to (BST3 + 0.3V)DH5 to LX5...............................................-0.3V to (BST5 + 0.3V)VL, REF Short to GND................................................Momentary 12OUT Short to GND..................................................Continuous REF Current...........................................................+5mA to -1mA VL Current.........................................................................+50mA 12OUT Current ...............................................................+200mA V DD Shunt Current............................................................+15mA Operating Temperature Ranges MAX163_CAI.......................................................0°C to +70°C MAX163_EAI....................................................-40°C to +85°C Storage Temperature Range.............................-65°C to +160°C Continuous Power Dissipation (T A = +70°C)SSOP (derate 9.52mW/°C above +70°C)....................762mW Lead Temperature (soldering, 10s).................................+300°C。
戴尔易安信技术白皮书:PowerEdge YX5X 服务器中改进的内存可靠性、可用性和可服务性 (R
Technical White PaperImproved Memory Reliability, Availability, and Serviceability (RAS) in PowerEdge YX5X serversAbstractThis technical white paper describes enhancements made to the memory RASfeatures in PowerEdge YX5X servers that use Intel 3rd Generation (‘Ice Lake’)Xeon Scalable Processors. System configurations for achieving the maximummemory up time are called out.September 2021RevisionsAcknowledgementsAuthor(s): Jordan Chin (Memory Systems Engineering)Support: Mark Dykstra (Escalation Engineering), Kevin Cross (Memory Systems Engineering), Dave Chalfant(BIOS Engineering), Rene Franco (Memory Systems Engineering), and Trent Bates (Product Management)Others: Sheshadri PR Rao (InfoDev)The information in this publication is provided “as is.” Dell Inc. makes no representations or warranties of any kind with re spect to the information in this publication, and specifically disclaims implied warranties of merchantability or fitness for a particular purpose.Use, copying, and distribution of any software described in this publication requires an applicable software license.Copyright © 2021 Dell Inc. or its subsidiaries. All Rights Reserved. Dell Technologies, Dell, EMC, Dell EMC and other trademarks are trademarks of Dell Inc. or its subsidiaries. Other trademarks may be trademarks of their respective owners. [9/13/2021] [Technical White Paper] [Manager]Contents Revisions (2)Acknowledgements (2)Contents (3)Executive Summary (4)1RAS improvements in the Chipset (5)1.1Intel Partial Cache Line Sparing (PCLS) (5)1.2Improvements to Advanced ECC (or Single Device Data Correction) (5)2Smarter Self-healing (6)2.1Memory Health Check (6)2.2Self-healing during Full-Boot Memory tests (7)3Other Memory Serviceability improvements (9)3.1Redesigned Memory Event messaging (9)3.1.1Standard Memory Event Message severity levels (9)3.1.2Prescriptive Remediation (9)3.2User-directed Memory Map-out (10)4Legacy RAS features (12)5Achieving Maximum Memory Uptime (13)6Applicable PowerEdge YX5X servers (14)Executive SummaryExecutive SummaryIn our Memory Errors and Dell EMC PowerEdge YX4X Server Memory RAS Features technical white paper,we provided a primer on memory errors and the Memory Reliability, Availability, and Serviceability (RAS)features on our PowerEdge YX4X products. Most of the principles and RAS feature information from thatwhitepaper continue to remain intact for our latest YX5X line of PowerEdge products. However, as with everygeneration of Dell EMC PowerEdge server product, we continue to innovate and improve. With thisdocument, we would like to share with our customers the next generation of improvements to the memoryRAS capabilities in our latest YX5X line of PowerEdge products. At a high-level, this includes the followingnew features or processes:The content covered in this technical white paper applies only to DRAM based memory modules and does not apply to Intel Optane Persistent Memory. Also, this content is specific to Dell EMC PowerEdge YX5X serverswith 3rd generation Intel Xeon Scalable Processors.RAS improvements in the Chipset1 RAS improvements in the ChipsetIntel introduced the following improvements in their third generation of Xeon Scalable Processors:1.1 Intel Partial Cache Line Sparing (PCLS)The third generation of Xeon Scalable Processors contains 16 segments of spare cachelines per DDR channel in their integrated Memory Controllers (iMC). When BIOS detectsthat DRAM on a DIMM is experiencing single-bit errors (SBEs) for a particular cache line,it may request the iMC to re-map the offending portion of the cache-line to use its internalspare cache instead. Single-bit errors are generally harmless, but if left unchecked, theycould cause unwanted activation of preventative RAS features that can impact systemperformance.This feature will prevent continued triggering of the Dell Predictive Failure Algorithm (PFA) that wouldotherwise activate other RAS features (such as ADDDC) or consume self-healing resources. This results infewer performance impacts and corrective actions required by users. This feature is available on all third GenXeon Scalable Processors. There are no memory or system configuration requirements necessary to takeadvantage of PCLS.1.2 Improvements to Advanced ECC (or Single Device Data Correction)Intel has redesigned and optimized their Advanced Error Correcting Code in 3rd Gen XeonScalable Processors to handle the most common failure patterns known among the majorDRAM suppliers. In doing this, many of the multi-bit error patterns that were uncorrectable byprevious generations of Intel Xeon Scalable Processors are now correctable by 3rd GenXeon SPs. This uplift will result in a significant decrease in uncorrectable memory errors.This enhancement is available on all 3rd Gen Xeon Scalable Processors. There are no memory or systemconfiguration requirements necessary to take advantage of the improved Advanced ECC (or SDDC).For more information about Advanced ECC, see the Memory Errors and Dell EMC PowerEdge YX4X ServerMemory RAS Features technical white paper available on the Dell support site.2 Smarter Self-healingDell Technologies has introduced Memory Health Check and self-healing on full-boots as improvements tomemory self-healing in their PowerEdge YX5X servers. When used together, these features should provide amultiplicative effect on the testing and self-healing coverage for memory while minimally impacting the serverboot time.2.1 Memory Health CheckPrevious Dell EMC PowerEdge implementations of memory self-healing was based ontargeting repairs at a specific memory location where an uncorrectable error or multiplecorrectable errors were detected. For self-healing to take effect, the system must berebooted—thereby, resulting in some downtime. Understanding that downtime can beimpactful and difficult to arrange, it made sense to make use of any downtime because ofself-healing and use it as an opportunity to find other questionable memory locations and repair them. Thiswould prevent the need for future reboot operations and downtime to conduct further self-healing. Thus, DellTechnologies has developed Memory Health Check.Dell Memory Health Check works by first allowing the original self-healing process to execute and completeas described in the original Memory Errors and Dell EMC PowerEdge YX4X Server Memory RAS Featurestechnical white paper. Next, during the same boot cycle as the original self-heal, BIOS executes rigoroustesting throughout the DRAM rank where memory errors have occurred. The rigorous testing used by DellMemory Health Check is the same used by the Dell factory memory screening process. BIOS on thePowerEdge server can quickly and efficiently execute this type of rigorous testing (which can normally takehours) by intelligently testing the affected DRAM rank instead of the entire system memory range.Figure 1 The Memory Health Check process in PowerEdge YX5X serversLastly, if any additional questionable locations are found by this enhanced screening, then those locations are automatically repaired within the same boot cycle, thereby incurring no additional reboot penalty.If BIOS detects that there are more questionable locations than there are self-healing resources available torepair them, then BIOS will automatically map-out that memory region and message to the user that a DIMMreplacement is necessary.The execution of Dell Memory Health Check adds several seconds of boot time and is only executed asneeded based on certain types of memory health events from the previous boot. Normal boots should not see an impact to completion time.This feature is available on all 3rd Gen Xeon Scalable Processors. There are no memory or systemconfiguration requirements necessary to take advantage of Dell Memory Health Check.2.2 Self-healing during Full-Boot Memory testsOn Dell EMC PowerEdge platforms, the default boot behavior is ‘fast boot’, where the DDRbus is trained only partially and memory testing phase is skipped. ‘Full-boot’ is executedafter either a BIOS upgrade, memory configuration change, or after a memory health event(such as uncorrectable error or large number of correctable errors) or the system isconfigured to do so. During a full-boot cycle, BIOS performs memory retraining and a quickmemory test among other activities.On PowerEdge YX5X servers, Dell Technologies has added the ability to perform self-healing based on theresults of this quick memory test which differs from the testing in Memory Health Check in the following ways:Despite the differences in testing, the self-healing and map-out functions of the two features are identical. Ifany questionable locations are detected, then those locations are automatically repaired. If BIOS detects thatthere are more questionable locations than there are self-healing resources available to repair them, thenBIOS will automatically map-out that memory region and indicates to the user (through a message) that aDIMM replacement is necessary.As mentioned earlier, by default, full-boot is executed only in certain conditions. However, full-boot can beenabled to always execute in the BIOS Setup menu. Also, a user can also request for a one-time execution of full-boot. The boot options are accessed as ‘Memory Training’ settings in the System BIOS Settings→Memory Settings. Setting ‘Memory Training’ to ‘Enable’ will cause the system to always perform full-boot, while ‘Retrain at Next Boot’ will perform a one-time full-boot operation during the next reboot cycle.Access to these settings are also available in iDRAC9 by clicking Configuration→BIOS Settings→Memory Settings.Figure 2 Access Boot options on the System Setup pageThis feature is available on all 3rd Gen Xeon Scalable Processors. There are no memory requirements necessary to take advantage of self-healing during full-boot.3 Other Memory Serviceability improvements3.1 Redesigned Memory Event messagingDell Technologies has approached its YX5X PowerEdge servers with the goal of updating memory eventmessaging to improve reliability, usability, and serviceability. Run-time memory event messages in theSystem Event Log and Lifecycle Logs have been redesigned to focus on standardization of memory eventmessaging and prescriptive remediation.3.1.1 Standard Memory Event Message severity levelsAll run-time memory events are now designated by message ID prefixes MEM51xx, MEM61xx, and MEM71xx for alignment according to event severity. Severity is determined based the long-term health outlook of thememory device and whether the event or device correctable by the user.MEM51xx (Informational Severity) Events—Memory device is operational but may benefitfrom additional user action to improve performance or health. The specified user action in theevent message is optional. These event messages will appear only in the Lifecycle Log.MEM61xx (Warning Severity) Events—Memory device has encountered an event that canbe corrected with additional user action. The specified action in the event message is requiredto be performed by the user to prevent potential system outage or resolve an existing outage.If the event persists after performing the specified user action, users should contact thetechnical support teams for further assistance.These events messages will appear in both the Lifecycle Log and System Event Log.MEM71xx (Critical Severity) Events—Memory device has detected an event that hascompromised the reliability or usability of the device. Immediate replacement of the device iseither required or highly recommended. The specified user action in the event message, ifprovided, is intended only for use as a short-term remedy.These event messages will appear in both the Lifecycle Log and System Event Log.3.1.2 Prescriptive RemediationAfter broad review of memory event messaging throughout the server industry, we found it extremelycommon to recommend a general set of user actions to resolve all memory event types. These actions weretypically to reseat the memory device and to update BIOS firmware. Both actions are good practices inmaintaining a healthy memory system. Reseating the memory device can reduce any device-to-socketconnectivity issues, and while updating firmware, ensures that the system is patched for any known issuesand is running the latest memory-training and error-handling algorithms. However, almost all solutions requiresome system downtime and/or physical access to execute. Thus, spending time strictly to complete goodmaintenance practices is an inefficient use of downtime. As mentioned earlier, downtime can be impactful anddifficult to arrange, and as such, every solution prescribed should be carefully considered for the highestlikelihood of resolving the problem.Therefore, in addition to severity, run-time memory event messages on YX5X PowerEdge servers are nowalso categorized based on the recommended resolution. These recommended user actions arerecommended as the best engineering recommendation to address each underlying event. Recommendeduser action aligns with the last two digits of the message ID for all MEM51xx, MEM61xx, and MEM71xxevents.Important—The table above is a simplified version of the listed Recommended Response Actions for MEM51xx, 61xx, and 71xx. Refer to the appropriate product documentation for the fully detailed RecommendedResponse Actions which will include next steps for resolution beyond those listed here.3.2 User-directed Memory Map-outPowerEdge YX5X servers configured with BIOS version 1.3.x or later will enable usersthrough firmware to directly remove a DIMM from the system memory pool withoutphysically handling the device. When a DIMM is no longer part of the system memory pool,its DRAM components will not be used for any read/write operations. Total system memorycapacity is reduced to exclude the mapped out DIMM. Any DRAM faults on this DIMM willno longer produce correctable or uncorrectable errors during run-time operation.Important—DIMMs that are mapped out from the system memory pool are still configured, trained, andtested during the boot operation. Therefore, enabling memory map-out cannot prevent many memory relatedissues that may arise during boot.Mapping out one or more DIMMs can produce an imbalanced memory configuration and significantly impactsystem performance. To retain a supported memory configuration, Dell EMC BIOS may automatically mapout other DIMMs that are not targeted by you. This is necessary to maintain an optimized memoryconfiguration. Therefore, total system memory capacity may be reduced beyond the expected amount. This type of automatic map-out behavior also occurs if the DIMM was physically removed and the system is in an unsupported memory configuration.DIMMs that have been manually mapped out will display the MEM6101 message in system logs to indicate successful map-out. Meanwhile, DIMMs that have been automatically mapped out to maintain a supported memory configuration will display the MEM6101 message and UEFI0339 message in Lifecycle Logs.User directed memory map-out can be enabled and configured in the BIOS Setup menu under System BIOS Settings → Memory Settings → Memory Map Out. Access to these settings are also available in iDRAC9 via Configuration → BIOS Settings → Memory Settings → Memory Map Out.Figure 3 Enable the Memory Map Out feature on the System Setup pageMap-out takes effect during the next system reboot operation and will remain in effect until the you manually reenable the DIMM. Map-out settings will persist through configuration changes and BIOS firmware updates. There are no CPU or memory configuration requirements necessary to take advantage of user directed memory map-out.Warning—This feature should be used with care to ensure that at least one physically installed DIMMs is always enabled. Accidentally disabling all physically installed DIMMs will prevent the system from booting. The system BIOS NVRAM must be cleared to recover from this state. For information about clearing NVRAM, see the respective Installation and Service Manual available on the support site.Legacy RAS features4 Legacy RAS featuresThe RAS features that were supported in the YX4X servers are still supported in YX4X. See the MemoryErrors and Dell EMC PowerEdge YX4X Server Memory RAS Features technical white paper available on thesupport site. However, some updates to those features are listed here as sub-bullets:•Single Error Correction—Double Error Detection (SEC-DED) ECC•Advanced ECCo Improvements to Advanced ECC (or Single Device Data Correction)•Adaptive Double Device Data Correction (ADDDC)•Memory Patrol Scrub•Operating System Memory Page Retirement / Off-lining•Fault Resilient Memory (FRM) / Address Range Mirroring modeo A Non-Uniform Memory Access (NUMA) aware FRM option has been added. When NUMA aware FRM has been enabled, BIOS enforces creation of fault-resilient memory regions whichspan NUMA nodes, and if SNC is enabled, then also spans across sub-NUMA clusters. Earlier,YX4X servers created a fault- resilient region of memory starting from the lowest system memoryaddress without awareness of NUMA. Address range mirroring requested and enabled by theoperating system is and remains NUMA—aware.•Memory Self-Healingo Smarter Self-Healing•Machine Check Architecture RecoveryThe following legacy RAS features have been deprecated in PowerEdge YX5X servers because of insufficient user enablement:•Memory Rank Sparing•Full Memory MirroringAchieving Maximum Memory Uptime5 Achieving Maximum Memory UptimeThe following summarizes actions that users can take to achieve maximum memory uptime on theirPowerEdge YX5X servers:•Configure server using genuine DIMMs from Dell Technologieso Benefit—Memory modules are fully validated and assured by Dell Technologies. Additional self-healing (PPR) resources above and beyond industry standards. Rigorously screened usingproprietary Dell Technologies test patterns and DRAM vendor unique test patterns.•Configure server with x4 DRAM based DIMMso Benefit—Single DRAM Device Correction and ADDDC.•Configure server to operate in Fault Resilient Memory modeo Benefit—Significantly reduced probability of UCEs in critical portions of memory used byoperating systems. Low memory capacity reduction overhead (depending on the systemsettings).•Configure server to run memory patrol scrub in ‘Extended Mode’o Benefit—Patrol-scrub will run after every four hours (instead of 24). Increased scrubbingfrequency will reduce the accumulation of errors in areas of memory with low utilization that arenot being corrected by demand scrub.•Configure server to run ‘Full-Boot’ instead of ‘Fast Boot’o Benefit—Server performs full DDR bus training and testing after every boot operation. Re-training ensuring that the bus is optimally tuned given the current environmental and operating conditions.The quick memory testing will self-heal questionable memory cells that may have developed overtime.•Regularly check for MEM events in Lifecycle Logs and perform the actions as specified—Even for MEM51xx events displayed for information purposes only.o Benefit—Actions specified by MEM61xx and 71xx events are required while those specified by MEM51xx are optional. Even though the MEM51xx events are optional, PowerEdge BIOS hasmade these recommendations based on monitoring memory health and performing the actionsmay improve memory performance or long-term reliability.•Regularly update system firmwareo Benefit—System firmware is patched for any known issues and is running the latest memory training and error handling algorithms.Applicable PowerEdge YX5X servers6 Applicable PowerEdge YX5X serversThe following platforms are considered PowerEdge YX5X servers equipped with 3rd Gen Xeon ScalableProcessors and are therefore covered by this technical white paper:Important—Subsequent to the publication of this document, Dell may continue to add products to its YX5Xserver lineup. If a product is not listed below, please consult with a Dell sales or support representative toconfirm the server generation.PowerEdge leveraged products such as some Precision workstations may also be covered by this document.Please consult with a Dell sales or support representative to confirm.•PowerEdge R750•PowerEdge R750xa•PowerEdge R750xs•PowerEdge R650•PowerEdge R650xs•PowerEdge R550•PowerEdge C6520•PowerEdge MX750c•PowerEdge R450•PowerEdge T550•PowerEdge XR11•PowerEdge XR12。
MTSAdvantageVideoExtensometer(AVX)
MTS Advantage TMVideo Extensometer (AVX)Flexible, efficient and repeatable non-contact strain measurementThe Advantage TM Video Extensometer delivers confidence in non-contact strain measurement. The ergonomic design integrates a magnetic-return support arm for precise, repeatable video capture, and calibration verification procedures ensure continuous and traceable data accuracy. Driven by powerful cameras, processors and software, the MTS Advantage Video Extensometer (AVX) delivers unprecedented speed, accuracy and flexibility for non-contact measurement. The extensometer recognizes patterns on the specimen to acquire measurement data, which is then processed by MTS TestSuite TM TW software to calculate specimen strain and modulus.Choose from 16 different quick-attach, interchangeable measurement heads that have predefined gage lengths. Simply select a gage length and strain range that meets your testing needs, and use the corresponding materials testing measurement head to accuratelydetermine Y oung’s modulus, Poisson’s ratio, or select R-Value; or a general purpose measurement head to measure high elongation materials.The AVX’s magnetic-return support arm swings out of the way for access to the specimen when using a chamber or test area enclosure. Also, the video extensometer can easily be mounted to any mechanical test system, and the LED light is integrated into the measurement head.»Load frame-mounted video extensometer »Magnetic-return support arm for precise and repeatable measurements »Quick-attach, pre-defined gage length measurement heads »Simple pass/fail ASTM and ISO calibration verification blocks »Software calibration verification wizards »Up to 0.05 µm resolutionBecause they do not touch the specimen, non-contact extensometers work well when specimens are thin or brittle, have irregular surfaces, require high-temperature or submerged environments or tend to release a great deal of energy at failure.BUILT IN FLEXIBILITY Interchangeable measurement heads can replace dozens of extensometers in your laboratory. Buy multiple measurement heads with your initial purchase or add them as laboratory needs change.PERFECT FOR DELICATE SPECIMEN SAMPLESWhen testing a specimen sample that is fragile, brittle or irregularly shaped, non-contact extensometry prevents damage caused by the contact forces of a clip-on extensometer.TAKE MULTIPLE MEASUREMENTSUnlike other strain measurement technologies, the AVX allows users to take up to 200 measurements in real time with one instrument. Options allow users to upgrade to a more advanced package to measure strain, Poisson’s ratio, rotation or shear strain.TEST ONCE, MEASURE OVER AND OVER AGAINThe AVX reduces the chance for operator error in placing the extensometer on the specimen, and allows repeatable measurementsto be taken after the physical test is complete in post process mode.Put the MTS Advantage Video Extensometer to Work for YouThe AVX allows for non-contact multi-point measurement of strain, rotation, and displacement by using pattern recognition and sub-pixel interpolation to measure exact displacements of selected points on a video image.TENSILE TESTING From testing nanowires to high elongation plastics, you can configure your AVX to test virtually any gage length with the correct measurement head. Additionally, AVX avoids common tensile testing problems like slipping, adding stress concentrations or breaking during high-energy fractures.COMPRESSION TESTINGCompression platens often inhibit access to the specimen, but unlike contacting methods the AVX only requires line of site through to the specimen. Without specimen contact, there is little risk of damage to the strain measurement device.MULTI-POINT BEND TESTINGHigh-precision deflection measurements may be taken during a multi-point bend test. Point deflection measurements may be taken for the rollers or specimen, or strain can be directly measured from the surface in tension.SHEAR TESTING2D multi-point tracking allows for direct measurements of shear strain. Direct measurements can be taken through measuring the change in angle between three points. Shear modulus measurements can be taken using these methods for v-notch or short beam specimens of any size using the appropriate hardware and minimal specimen preparation.3MATERIALS TESTING MEASUREMENT HEADSSpecially designed optics in the XT-200 series or materials testing measurement heads enable the determination of materials properties at low strains (from 0.01%), such as Y oung’s modulus, Poisson’s ratio, and R-value. Choose from nine measurement heads with data collection rates of either 0.1 to 30 Hz or 0.1 to 500 Hz.GENERAL PURPOSE MEASUREMENT HEADSMore conventional optics offer excellent results when measuring strains greater than 10%. Choose from seven measurement heads capable of measuring high elongation materials.TEST AT HIGH AND LOW TEMPERATURESHigh-temperature testing may be performed as long as the unit has a line of site through the chamber window. Magnetic-return support arm easily moves out of the way for easy specimen access.Confidence and Flexibility in One PackageUniformly illuminate your specimen with the integrated LED lightFinely adjust the measurement head forward and backwardto hundreds of positions over three axesQuick-attach, interchangeable predefined gage length measurement headsReturn to the same position over and over with the magnetic-return support armright, front or back of load frameMove up and down manually or with a power drillAVX software combines the control, capture, processing, and analysis of ultra-highresolution measurements into an intuitive user interface. After half a day’s training, anyuser will feel confident that they are obtaining accurate results. Built on top of patentedsub-pixel pattern recognition technology, the AVX software can measure almost anymaterial, anywhere, using the most robust pattern tracking algorithms available. Maximize Efficiency with Easy-to-use SoftwareDRAG AND DROP MEASUREMENT TOOLBOXDrag and drop a full selection of virtual measurement devices onto your specimen. Pre-configured devices are equivalent to traditional devices, but without the hardware cost or headaches. Position a strain gage on your specimen in seconds, and save hours in specimen preparation.MOVEMENT AND STRAIN TOOLS AT YOUR FINGERTIPSSelect from10 different virtual measurement devices in our advanced software to easily measure position, displacement, distance, or rotation. Virtual strain measurement devices convert motion into axial strain, dual average strain, Poisson’s ratio, shear strain and 2D strain maps.UNDERSTAND RESULTS QUICKLY WITH INTUITIVE GRAPHICAL DATA DISPLAYS MTS TestSuite TW software and AVX software create easy to interpret charts and graphs. Ethernet communication betweensystems sends ±10 V signals to the MTS TestSuite TW software.Upgrade to Include 2D Digital Image Correlation (DIC)The AVX packages include an option of adding DIC capability tocreate planar strain maps with real-time measurements. Thisconvenient visual tool for scanning an area under load helps toidentify areas of high stress, crack opening or other discontinuities.The DIC option creates high-resolution, full-field maps that areoverlaid on the original video files. Results are easy to interpretand it is possible to toggle between all measurement optionswithout reprocessing a test.EASILY VISUALIZE STRAIN AND DISPLACEMENT GRADIENTSThe DIC software outputs 2D contour plots where color gradientsshow levels of strain. The software allows the user to define thex-axis and show Exx, Eyy or Exy.5Confidence in Your Test DataConfirm that your set-up meets your ASTM E83 or ISO 9513 calibration with a pass/fail calibration wizard following these simple steps:1) Place your verification block in front of your specimen2) Select your desired ASTM E83 or ISO 9513 class from a drop down menu 3) Move the measurement head until blue cursor lands within green bar4) Lock the support arm in placeEach AVX Measurement Head includes an inspected, traceable validation block, which can be used to confirm calibration at the beginning a series of tests. Validation blocks are serialized and include an ISO 17025 AccreditationCalibration Report.Portable, powerful, and compact AVX controllers move between test systems with ease. Each controller includes pre-installed software, solid state memory drives with ample data storage, and Ethernet connectivity to the system controller.Powerful Controllers with Integrated SoftwareChoose One of Three Software PackagesBASIC PACKAGEIdeal for quality acceptance and quality control applications where measurements are simple and well defined.ROUTINE PACKAGEWorks well for users that need more flexibility in measurements. Includes drag-and-drop preconfigured measurement tools including virtual displacement gages,extensometers and strain gages.ADVANCED PACKAGEDesigned for the test lab that requires the flexibility to measure practically any physical displacement. Provided with unlimited drag-and-drop virtual measurements and the capability tomeasure up to 200 points in real time.Mounts to MTS Criterion ® and MTS Exceed ® Test Systems Mounting brackets are available for all MTS Criterion and MTS Exceed test systems. Legacy, electrodynamic, servohydraulic and competitive mounting optionsare available upon request.7Measurement Head SpecificationsEach AVX Measurement Head includes an inspected, traceable validation block, which can be used to confirm calibration at the beginning a series of tests. Validation blocks are serialized and include an ISO 17025 Accreditation Calibration Report. XT-100 Series Measurement Heads1. Strain ranges assume a distance between the grips of twice the GL, with a centrally positioned gage. Actual strainranges may be greater or less than these values, depending on gage positioning, grip separation and specimen behavior.2. Maximum transverse GL and tracking speed is quoted at a measurement rate of 100 Hz. 3. Resolution is based on typical lab performance.4. For Class B-1, minimum specimen width for transverse gage lengths should be increased by 65%.1. Specified strain ranges assume a distance between the grips of twice the GL, with a centrally positioned gage. Actual strainranges may be greater or less than these values, depending on gage positioning, grip separation and specimen behavior.2. Maximum transverse GL and tracking speed is quoted at a measurement rate of 15Hz (XT-20x series) and 100 Hz (XT-25x series).3. Resolution based on typical lab performance.Ideal for determining higher strain (>10%) materials properties such as yield point & elongation, and for long gage lengths. All models are capable of meeting Class B-2 (ASTM E-83) & Class 0.5 (ISO 9513) at the specified gage lengths and strain ranges (>10%). They are also capable of meeting Class B-1 (ASTM E-83) over most of their operating range (gage lengths where maximum axial tensile strain less than 600%).The XT-100 series operate at measurement rates from 0.1 - 500 Hz.Ideal for determining low strain materials properties (from 0.01%), such as tensile & compressive modulus, Poisson’s ratio & R-value. All models are capable of meeting Class B-1 (ASTM E-83) & Class 0.5 (ISO 9513) at the specified gage lengths and strain ranges.The XT-200 series are our highest accuracy measurement heads. These models operate at measurement rates from 0.1 - 30 Hz. The XT-250 series are suitable for many high accuracy dynamic applications, and operate at measurement rates from 0.1 - 500 Hz.XT-200 Series Measurement HeadsMTS Systems Corporation 14000 Technology DriveEden Prairie, MN 55344-2290 USA Telephone: 1.952.937.4000Toll Free: 1.800.328.2255 Fax: 1.952.937.4515E-mail:************ISO 9001 Certified QMS MTS, MTS Criterion and Exceed are registered trademarks, and Advantage and MTS TestSuite are trademarks of MTS Systems Corporation within the United States. These trademarks may be protected in other countries.RTM No. 211177.© 2016 MTS Systems Corporation.100-248-318c AdvantageVideoAVX Printed in U.S.A. 12/16。
带有只读存储器的单片机集成电路中英文翻译
英文原文:Microcontroller Integrated Circuit with Read Only Memory Microcontroller integrated circuit comprises a processor core which exchanges data with at least one data processing and storage device. The integrated circuit comprises a mash-programmed read only memory containing a generic program such as a test program which can be executed by the microcontroller. The genetic program includes a basic function for writing data into the data progressing or storage device or devices .The write function is used to load a downloading program. Because a downloading program is not permanently stored in the read only memory. the microcontroller can be tested independently of the application program .and remains standard with regard to the type of memory component with which it can be used in a system.In a microprocessor based system the processing will be performed in the microprocessor itself. The storage will be by means of memory circuits and the communication of information into and out of the system will be by means of special input/output(I/O) circuits. It would be impossible to identify a particular piece of hardware which performed the counting in a microprocessor based clock because the time would be stored in the memory and incremented at regular intervals but the microprocessor. However, the software which defined the system‟s behavior would contain sections that performed as counters. The apparently rather abstract approach to the architecture of the microprocessor and its associated circuits allows it to be very flexible in use, since the system is defined almost entirely software. The design process is largely one of software engineering, and the similar problems of construction and maintenance which occur in conventional engineering are encountered when producing software.Microcomputers use RAM (Random Access Memory) into which data can be written and from which data can be read again when needed. This data can be read back from the memory in any sequence desired, and not necessarily the same order in whi ch it was written, hence the expression …random‟ access memory. Another type of ROM (Read Only Memory) is used to hold fixed patterns of information which cannot be affected by the microprocessor; these patterns are not lost when power is removed and are normally used to hold the program which defines the behavior of a microprocessor based system. ROMs can be read like RAMs, but unlike RAMs they cannot be used to store variable information. Some ROMs have their data patterns put in during manufacture, while others are programmable by the user by means of special equipment and are called programmable ROMs. The widely used programmable ROMs are erasable by means of special ultraviolet lamps and are referred to as EPROMs, short for Erasable Programmable Read Only Memories. Other new types of device can be erased electrically without the need for ultraviolet light, which are called Electrically Erasable Programmable Read Only Memories, EEPROMs.The microprocessor processes data under the control of the program, controlling the flow of information to and from memory and input/output devices. Some input/output devices are general-purpose types while others are designed forcontrolling special hardware such as disc drives or controlling information transmission to other computers. Most types of I/O devices are programmable to some extent, allowing different modes of operation, while some actually contain special-purpose microprocessors to permit quite complex operations to be carried out without directly involving the main microprocessor.Another major engineering application of microcomputers is in process control. Here the presence of the microcomputer is usually more apparent to the user because provision is normally made for programming the microcomputer for the particular application. In process control applications the benefits lf fitting the entire system on to single chip are usually outweighed by the high design cost involved, because this sort lf equipment is produced in smaller quantities. Moreover, process controllers are usually more complicated so that it is more difficult to make them as single integrated circuits. Two approaches are possible; the controller can be implemented as a general-purpose microcomputer rather like a more robust version lf a hobby computer, or as a …packaged‟ system, signed for replacing controllers based on older technologies such as electromagnetic relays. In the former case the system would probably be programmed in conventional programming languages such as the ones to9 be introduced later, while in the other case a special-purpose language might be used, for example one which allowed the function of the controller to be described in terms of relay interconnections, In either case programs can be stored in RAM, which allows them to be altered to suit changes in application, but this makes the overall system vulnerable to loss lf power unless batteries are used to ensure continuity of supply. Alternatively programs can be stored in ROM, in which case they virtually become part of t he electronic …hardware‟ and are often referred to as firmware.To be more precise ,the invention concerns a microcontroller integrated circuit .A microcontroller is usually a VLSI(Very Large Scale Integration) integrated circuit containing all or most of the components of a “computer”. Its function is not predefined but depends on the program that it executes.A microcontroller necessarily comprises a processor core including a command sequence (which is a device distributing various control signals to the instructions of a program),an arithmetic and logic unit (for processing the data) and registers(which are specialized memory units).The other components of the “computer” can be either internal or external to the microcontroller, however, In other words ,the other component are integrated into either the microcontroller or auxiliary circuits.These other components of the “computer”are data processing and storage devices, for example read only or random access memory containing the program to be executed, clocks and interfaces(serial or parallel).As a general rule ,a system based on a microcontroller therefore comprises a microchip containing the microcontroller, and a plurality of microchips containing the external data processing and storage devices which are not integrated into the microcontroller. A microcontroller-based system of this kind comprises, for example, one or more printed circuit boards on which the microcontroller and the other components are mounted.It is the application program, I, e, the program which is executed by the microcontroller, which determines the overall operation of the microcontroller system. Each application program is therefore specific to a separate application.In most current application the application program is too large to be held in the microcontroller and is therefore stored in a memory external to the microcontroller, This program memory, which has only to be read , not written, is generally a reprogrammable read only memory(REPROM).After the application program has been programmed in memory and then started in order to be executed by the microcontroller, the microcontroller system may not function a expected.In the last unfavorable situation this is a minor dysfunction of the system and the microcontroller is still able to dialog with a test station via a serial or parallel interface, This test station is then able to determin the nature of the problem and indicates precisely the type of correction(software and physical) to be applied to the system foe it to operate correctly.Unfortunately, most dysfunctions of microcontroller-based system result in a total system lock-up, preventing any dialog with a test station. It is then impossible to determine the type of fault,i,e.whether it is a physical fault(in the microcontroller itself,in an external read only memory, in a peripheral device,on a bus,etc ) or a software fault( I,e. an error in the application program). The troubleshooting technique usually employed in these cases of total lock-up is based on the use of sophisticated test devices requiring the application of probes to the pins of the various integrated circuits of the microcontroller-based system under test.There are various problem associated with the use of such test devices for troubleshooting a microcontroller-based system. The probes used in these test devices are very fragile, difficult to apply because of the small size of the circuit and their close packing,and may not make good contact with the circuit.Also, because of their high cost, these test devices are not mass produced. Consequently, faulty microcontroller-based systems can not be repaired immediately, wherever they happen to be located at the time, but must first be returned to a place where a test device is available. Troubleshooting a microcontroller-based system in this way is time-consuming, irksome and costly.To avoid the need for direct action on the microcontroller-based system each time the application program executed by the microcontroller of the system is changed, it is standard practice to use a downloadable read only memory to store the application program, a loading program being written into a mask-programmed read only memory of the microcontroller, The mask-programmed read only memory of the microcontroller is integrated into the microcontroller and programmed once and for all during manufacture of the microcontroller.To change the application program the microcontroller is reset by running the downloading program. This downloading program can then communicate with a workstation connected to the microcontroller by an appropriate transmission line, this workstation the new application program to be written into the microcontroller, The downloading program receives the new application program and loads it into a readonly memory external to the microcontroller.Although this solution avoids the need for direct action on the microcontroller=based system (which would entail removing from the system the reprogrammable read only memories containing the application program, writing into these memories the new application program using an appropriate programming device and then replacing them in the system), it nevertheless has a major drawback, namely specialization of the microcontroller during manufacture.Each type of reprogrammable memory is associated with a different downloading program because the programming parameters (voltage to be applied, duration for which the voltage is to be applied) vary with the technology employed, The downloading program is written once and for all into the mask-programmed internal memory of the microcontroller and the latter is therefore restricted to using memory components of the type for which this downloading program was written. In other words,the microcontroller is not a standard component and this increases its cost of manufacture.One object of the invention is to overcome these various drawbacks of the prior art, To be more precise, an object of the invention is to provide a microcontroller circuit which can verify quickly, simply, reliably and at low cost the operation of a system based on the microcontroller.Another object of the invention is to provide a microcontroller integrated circuit which can accurately locate the defective component or components of a system using the microcontroller in the event of dysfunction of the system.A further object of the invention is to provide a microcontroller integrated circuit which avoids the need for direct action on the microcontroller-based system to change the application program, whilst remaining standard as regards the type of memory component with which it can be used in a system.译文:带有只读存储器的单片机集成电路单片机集成电路包含一个处理器内核,它至少通过一种数据处理或存储设备来交换数据,集成电路包含一个只读掩模存储器,其中像测试程序一样的通用程序能被单片机执行。
Rx2900
QuickSpecsHPE Integrity rx2800 i4 ServerOverviewHPE Integrity rx2800 i4 ServerIs your branch office or data center server infrastructure challenged to support more users and applications within constrainedbudget, smaller IT staff and limited space or energy footprint? In your environment is downtime not an option, security is paramount and IT dynamics mandate a flexible converged infrastructure that scales with your business? The HPE Integrity rx2800 i4 Server, a reliable and secure 2U two-socket UNIX server, is a great fit for branch offices and rack-mount server data centers supporting a range of mission-critical workloads. With up to 3.5X performance, 21 percent less energy consumption, and 33 percent lower TCO, the Integrity rx2800 i4 Server does more with less. It enables workload consolidation and software licensing cost savings through HPE Virtual Partitions (vPars) or Virtual Machines (VMs), while HPE Insight software and HPE Integrated Lights-Out 3 (iLO 3) increase staff productivity. HPE-UX 11i v3 and HPE Serviceguard support provides always-on resiliency and disaster recovery capability. The Integrity rx2800 i4 Server offers exceptional configuration flexibility and also comes in tower configurations withreduced acoustics for deployment in infrastructure challenged office environments.HPE Integrity rx2800 i4 Server: Front ViewHPE Integrity rx2800 i4 Server: Rear View 1. Systems Insight Display 1. 2x Power Supplies 2. 1 DVD & 8 SFF HDDs2. Rear VGA & USB3. Front Panel Console (KVM) 3. 4x 1G LANs4. RS232 port5. iLO3 LAN6.6x I/O SlotsOverviewHPE Integrity rx2800 i4 Server: Inside View1. 6 system fans 7. 2 low profile PCIe above p410i RAID controller2. Internal USB 8. 24 DDR3 Memory Modules3. 2 Processor Sockets 9. 8 Hard Disk Drive Slots4. 2 PSUs over ICH10, Gromit XE & RN50 video controller 10. DVD-ROM or DVD+RW slot5. Chipset 11. Front IO & Systems Insight Display6. 2 full-length PCIe slots over 2 half-length PCIe slotsWhat's New•Support for Intel Itanium 9500 series processors•Support for Low Voltage DIMMs•Support for 80Plus Platinum Power Supplies•Support for HPE-UX 11iv3 1209 releaseModelsHPE rx2800 i4 server comes in two (2) models:•2U Rack-Optimized Server (can be installed in tower form factor with pedestal kit)•Office Friendly Server (OFS) in tower form factor with reduced acoustics for deployment in office environments. ProcessorsUp to two (2) Intel® Itanium® 9500 processor series are supported:•Intel® Itanium® 9560 8-core 2.53 GHz / 32 MB (L3) 170W•Intel® Itanium® 9550 4-core 2.4 GHz / 32 MB (L3) 170W•Intel® Itanium® 9540 8-core 2.13 GHz / 24 MB (L3) 170W•Intel® Itanium® 9520 4-core 1.73 GHz / 20 MB (L3) 130WKey features:•On core 32KB Level 1 (L1) cache; 16KB Instruction/16KB Data•On core Level 2 (L2) cache, 512KB Instruction/256KB Data•Up to 32MB Shared Last Level Cache (LLC); see details above for each processor•Total of up to 54MB on die cache per processor•Single bit cache error correction•50 bit physical addressing•64 bit virtual addressing•Integrated memory controllers and Scalable Memory Interconnect (SMI)•Intel Instruction Replay Technology•Enhanced instructions-level parallelism•Enhanced Intel Hyper Threading, with Dual-Domain Multi-Threading support•Intel Cache Safe Technology•Residual error protection for floating point operations•Thermal logic technologies•Dynamic CKE, for additional power savings with memory DIMMs•Floating point coprocessor•Full width Intel QuickPath Interconnect (QPI) links providing 25.6 GB/s of bandwidth•QPI error detection, correction and lane failover•Two memory controllers per processor w/ aggregate bandwidth of 34 GB/s read•1MB directory cache in memory controller•Support for 12 DDR3 memory DIMMs per processor•Turbo Boost Technology (allows low activity factor workloads to run at a faster clock speed)•Error protection on all major data structures•Dynamic Processor resilience and de-allocation (DPR)•Advanced Machine Check Architecture (AMCA)•Automatic Process Recovery (APR)•Enhanced resistance to Soft ErrorsMemory ExpansionUp to four (4) 6-slot memory riser boards with total of 24 DDR3 registered Low Voltage (1.35V) memory modules (RDIMMs) are supportedUp to 384GB system memory with Low Voltage (1.35V) 16GB DIMMsMemory ModulesDDR3 (double data rate) SDRAM (synchronous dynamic random access memory) DIMMs with the following capacities:Page 3•8GB (2 x 4GB) PC3L-10600 Registered CAS 9 Memory Kit•16GB (2 x 8GB) PC3L-10600 Registered CAS 9 Memory Kit•32GB (2 x 16GB) PC3L-10600 Registered CAS 9 Memory KitKey features:•DRAM ECC (Double Device Data Correction - DDDC)•Memory Scrubbing•Scalable Memory Interface (SMI) memory channel protection•ECC and double chip spare to overcome single DRAM chip failures.Internal Storage•Up to eight (8) small form factor (SFF) hot-plug hard disk drives (HDD) or solid state drives (SSD)•Up to 7.2TB of internal storage with 900GB HDDsEmbedded Storage ControllerIntegrated HPE Smart Array P410i 6Gbps Serial-Attached SCSI (SAS) RAID ControllerKey features•Support for eight (8) internal Hard Disk Drive (HDDs) and Solid State Drives (SSDs)•Supports RAID 0, 1, 10, 5, 50, 6, 60NOTE: Please refer to configuration information below for additional components that are required for RAID 5, 5+0, 6, 6+0 Internal Hard Disk DrivesSupport for SAS HDDs•146GB 15K RPM 6G/s SAS (Serial Attached SCSI) 2.5" Small Form Factor Hot Plug Disk•300GB 15K RPM 12G/s SAS (Serial Attached SCSI) 2.5" Small Form Factor Hot Plug Disk•300GB 10K RPM 6G/s SAS (Serial Attached SCSI) 2.5" Small Form Factor Hot Plug Disk•450GB 15K RPM 12G/s SAS (Serial Attached SCSI) 2.5" Small Form Factor Hot Plug Disk•450GB 10K RPM 6G/s SAS (Serial Attached SCSI) 2.5" Small Form Factor Hot Plug Disk•600GB 15K RPM 12G/s SAS (Serial Attached SCSI) 2.5" Small Form Factor Hot Plug Disk 600GB 10K RPM 6G/s SAS (Serial Attached SCSI) 2.5" Small Form Factor Hot Plug Disk•900GB 10K RPM 6G/s SAS (Serial Attached SCSI) 2.5" Small Form Factor Hot Plug DiskInternal Solid State DrivesSupport for 12 Gb/s SAS Single Level Cell (SLC) SSDs•200GB 12G SAS SLC 2.5" Small Form Factor (SFF) Enterprise Performance Solid State Drive•400GB 12G SAS SLC 2.5" Small Form Factor (SFF) Enterprise Performance Solid State Drive•800GB 12G SAS SLC 2.5" Small Form Factor (SFF) Enterprise Performance Solid State DriveOptical Media DriveUp to one (1) HPE Slimline DVD-RW or DVD-ROM Optical DriveEmbedded Network ControllerTwo (2) two-port Intel 82575 embedded 10/100/1000 Base-TX LAN (auto sensing; RJ 45 connector, Wake On LAN support) Graphics, VGA, USB and Serial portsRN50 integrated chip for basic graphic capabilities with support for one of two (2) VGA ports (front or rear) •Supports maximum resolution of 1280x1024x16M color. It does not support widescreen resolutions. One (1) RS 232 serial portFour (4) USB 2.0 portsI/O Expansion slotsUp to six (6) PCIe Gen2 slots with choice of PCIe riser cards are supported•3-Slot Riser Card (1 FL/FH x8 speed/x16 connector and 2 HL/FH x4 speed/x8 connector)•2-Slot Riser Card (1 FL/FH x8 speed/x16 connector and 1 HL/FH x8 speed/x16 connector) Network AdaptersSupport for PCIe Gen2 1 Gb/s and 10 Gb/s network adapters for Local Area Network (LAN) •HPE PCIe 2-port 1000Base-T card•HPE PCIe 2-port 1000Base-SX card•HPE PCIe 4-port 1000Base-T Gigabit Adapter•HPE Integrity 10GbE-SR 2p PCIe Adapter•HPE Integrity 10GbE-LR 2p PCIe Adapter•HPE Integrity 10GbE-Cu 2p PCIe Adapter•HPE Integrity NC552SFP 2P 10GbE Adapter•HPE Ethernet 10Gb 2-port 561T AdapterConverged Network AdaptersSupport for PCIe Gen2 10 Gb/s converged network adapters for Fibre Channel over Ethernet and Ethernet •HPE Integrity CN1100E PCIe 2-port CNAMulti-function (Combo) AdaptersSupport for multi-function (Network and Fibre Channel Adapter on one card) cards•HPE PCIe 1p 4Gb FC AND 1p 1000BT Adapter•HPE PCIe 2p 4Gb FC AND 2p 1000BT Adapter•HPE PCIe 2p 4Gb FC AND 2p 1000BSX Adapter•HPE PCIe 2p 8Gb FC AND 2p 1/10GbE AdapterFibre Channel Host Bus AdaptersSupport for one (1) or two (2) port (eight) 8 Gb/s Fibre Channel Host Bus Adapters•HPE PCIe 1-port 8Gb FC SR Qlogic HBA•HPE PCIe 2-port 8Gb FC SR Qlogic HBA•HPE PCIe 1-port 8Gb FC SR Emulex HBA•HPE PCIe 2-port 8Gb FC SR Emulex HBA•HPE SN1000Q 1-port 16GB FC HBA•HPE SN1000Q 2-port 16GB FC HBASAS RAID Controllers and Host Bus AdaptersSupport for 6 Gb/s SAS RAID Controllers•HPE Integrity PCIe 2p P411/256MB SAS Ctlr•HPE Integrity SA 812/1GB PCIe SAS CtrlGraphics AdapterSupport for 2D graphics•HPE Integrity rx2800 2D Graphics AdapterInfiniBand Host Channel AdaptersSupport for Quad-Data Rate (QDR) 40 Gb/s 4X connector based InfiniBand Host Channel Adapter •HPE Integrity 4X QDR CX-2 PCI-e G2 DP HCAHardware SecuritySupport for Trusted Platform Module (TPM) for hardware security supportPower & CoolingUp to two (2) hot-swap power supplies for N+N redundancy•1200W Hot Plug Power Supply Kit (Supports High-Line and Low-Line Voltages)NOTE: It is highly recommended that the HPE Power Advisor tool is run to determine configuration specific power and cooling needs. The HPE Power Advisor is located at: \go\hppoweradvisor.Up to six (6) hot-plug fans (N+1 redundancy)Key Power & Cooling Features:•ENERGY STAR ® certified with 80Plus Platinum Power Supplies•Power monitoring and control•UPS power management•The hot swap design allows for the online replacement of a power supply when N+N=2 supplies are configured in the server.Emedded Manageability and ServiceabilityHPE Integrity Integrated Lights-Out (iLO) 3 (factory integrated)HPE Integrity Integrated Lights-Out (iLO) management processors make it simpler, faster, and less costly to remotely manage your Integrity servers.Key features:•Telnet and web console via 10/100/1000Base-TX management LAN (RJ 45 connector)•Local VT100 or hpterm terminal, or VT100 or hpterm emulator via local RS 232 serial connection•Remote VT100 or hpterm terminal, or VT100 or hpterm emulator via external modem•SSL secured Web console accessible through the 10/100/1000Base-TX management LAN•Console mirroring between all local, modem, LAN, and web consoles•Virtual Media•LDAP directory services•iLO power measurement•Integration with Insight Power Manager•Separate LAN for system management•Password protection on console port•Disablement of remote console ports•Remote power up and power down control•Configurable remote access control•Event notification to system console-Provides connectivity, information, and support for HPE UX tools (such as STM and EMS) to notify by email, pager and/or Hewlett Packard Enterprise response centers.•Interface to system monitoring and diagnostic hardware via an internal IC busNOTE: HPE Integrity iLO 3 ships with a built in Advanced Pack License. No additional iLO licensing is needed.For more information, please see /go/integrityiloSystems Insight DisplayHPE Systems Insight Display LEDs enables diagnosis with the access panel installedAccessoriesRack KitsFor customers who need to use non-HPE cabinets, simple options for installation are available•Field Rack Kit (contains adjustable side rails to mount server in cabinets that use the four post EIA mounting system) •Pedestal Kit (for tower form factor deployment)•Rackmount Shelf KitNOTE: For non-HPE cabinets, please adhere to the following instructions to ensure that HPE can support the rack environment.•Anti-Tip - The rack/cabinet must be solidly anchored to the floor both front and rear. This is usually accomplished by anti-tip feet or by direct bolting to the floor.•Air Flow - The HPE Integrity rx2800 i4 uses front to back airflow to cool the unit. Thus a cabinet cannot have a solid front or rear door. Solid doors may have to be removed or changed to an open perforation pattern.•Cable Strain Relief - A proper method of strain relief must be used. This may force the elimination of the rear door in some cases.•Front and Rear Access - For proper cooling and ease of service access, Hewlett Packard Enterprise recommends 32 inches of unobstructed floor space in the front and rear of rack installations. This recommendation applies to both HPE and third party racks and cabinets.Certifications and Compliance•ENERGY STAR ® certified with 80Plus Platinum Power SuppliesOperating System•HPE-UX 11i v3 1209 release•HPE-UX 11i v3 Data Center Operating Environment (DC-OE)•HPE-UX 11i v3 Virtual Server Operating Environment (VSE-OE)•HPE-UX 11i v3 High Availability Operating Environment (HA-OE)•HPE-UX 11i v3 Base Operating Environment (BOE)•Key HPE-UX 11i featuresManageabilityGetting Started•HPE Systems Insight Manager•HPE Insight Control for HPE-UX 11i•HPE-UX 11i System Management•HPE BladeSystem Integrated Manager in HPE System Insight Manager•HPE Onboard Administrator•HPE BladeSystem c-Class Onboard Administrator Firmware•HPE BladeSystem c-Class Virtual Connect Firmware•HPE Insight Control for HPE-UX 11i v3 (Included in Base OE)Deploy•HPE Ignite-UX•Software Distributor-UX•Software Package Builder•Dynamic Root Disk (DRD)Monitor•HPE Systems Insight Manager•HPE System Management Homepage•Glance Plus Pak•Performance Manager and Agent•HPE Serviceguard ManagerControl•HPE Integrity Integrated Lights-Out (iLO) 3 (standard with HPE Integrity rx2800 i4 Server) •Integrity iLO 3 Advanced Pack license (included with HPE Integrity rx2800 i4 Server) Protect•HPE-UX Bastille•Secure Resource Partitions•Data Protector Software•Software Assistant (SWA)Optimize•HPE Capacity Advisory•HPE Virtualization Manager•HPE-UX Workload Manager•HPE Global Workload Manager•Process Resource Manager•HPE Insight Power Manager•HPE-UX 11i v3 power managementProvision•HPE Insight Dynamics - VSE infrastructure orchestrationIntegrate•HPE Business Technology Optimization•IT Management Software•HPE Insight Dynamics - VSE for HPE Integrity server bladesVirtualization•HPE Integrity Virtual Machines (VMs)•HPE Integrity Virtual Partitions (vPars) and Virtual Machines (VMs) 6.1•HPE-UX Containers (Formerly known as Secure Resources Partitions)Availability•Journal file system with HPE-UX*•Auto reboot•HPE Serviceguard for HPE-UX*•HPE Serviceguard Extension for RAC for HPE-UX*•HPE Serviceguard Extension for SAP for HPE-UX*•Serviceguard Manager for HPE-UX Clusters*•HPE Event Monitoring Service•HA Monitors for HPE-UX•HA Toolkits for HPE-UX•HPE Mirrordisk/UX* (Included if purchase HPE-UX 11i VSE-OE, HA-OE or DC-OE)•Extended Campus Cluster*, HPE Metrocluster*, and HPE Continentalclusters* for HPE UX •HPE System Insight Manager (SIM) for proactive fault management•HPE Serviceguard Storage Management Suites for HPE-UX*SecurityProtecting System•Bastille system hardening•Host Intrusion Detection System•Secure Resource Partitions•IPFilter - firewall technology•Software Assistant (security bulletin currency)•Install-time Security•Boot Authentication•Standard Mode Security Extensions•Shadow Passwords•Strong Random Number GeneratorProtecting Data•Encrypted volume and file system•Trusted Computing Services•Security containment•OpenSSL•IPsec•Secure Shell•MD5sumProtecting Identity:•Identity Management Integration•Select Access for IdMI•Role-based Access Control•AAA Server•HPE Directory Server for HPE-UX•LDAP-UX Client•Kerberos Server•Kerberos Client Services•PAM KerberosNOTE: For detailed information on HPE-UX support and features, please visit the following links:QuickSpecs: /products/QuickSpecs/12079_div/12079_div.htmlOverview: /go/HPE-uxWarrantyThree-year parts, 3 Year Labor and 3 Year on-site limited global warranty.Protected by Hewlett Packard Enterprise Services and a worldwide network of Hewlett Packard Enterprise Authorized Channel Partners.Services and SupportSupport ServicesHPE Technology Services for Integrity ServersHPE Technology Services delivers confidence, reduces risk and helps customers realize agility and stability. Connect to Hewlett Packard Enterprise to help prevent problems and solve issues faster. Our support technology lets you to tap into the knowledge of millions of devices and thousands of experts to stay informed and in control, anywhere, any time.Protect your business beyond warranty with HPE Care Pack ServicesHPE Care Pack Services enable you to order the right service level, length of coverage and response time as you purchase your new server, giving you full entitlement for the term you select.Recommended HPE Care Pack Services for optimal satisfaction with your Hewlett Packard Enterprise product.Optimized CareHPE Proactive Care with 6 hour call-to-repair commitment, three year Care Pack ServiceHPE Proactive Care helps prevent problems and stabilize IT by utilizing secure, real-time, predictive analytics and proactive consultations when your products are connected to Hewlett Packard Enterprise. This Care Pack Service combines three years’ proactive reporting and advice with our highest level reactive coverage and enhanced escalation management, The Hewlett Packard Enterprise 24x7, six hour call-to-repair hardware commitment. Hewlett Packard Enterprise is the only leading manufacturer who makes this level of coverage available as a standard service offering for your most valuable servers. Service includes 24x7 collaborative software support for leading industry standard software running on your HPE ProLiant server./v2/GetPDF.aspx/4AA3-8855ENW.pdfStandard CareHPE Proactive Care with 24x7 coverage, three year Care Pack ServiceHPE Proactive Care helps prevent problems and stabilize IT by utilizing secure, real-time, predictive analytics and proactive consultations when your products are connected to Hewlett Packard Enterprise. This Care Pack Service combines three years’ proactive reporting and advice with our 24x7 coverage and enhanced escalation management, four hour hardware response time and two hour call back for software questions on leading industry standard software running on your HPE ProLiant server./v2/GetPDF.aspx/4AA3-8855ENW.pdfBasic CareFoundation Care 24x7, three-year Care Pack ServiceHPE Foundation Care 24x7 connects you to Hewlett Packard Enterprise 24 hours a day, seven days a week for assistance on resolving issues. Hardware onsite response within four hours if needed; collaborative software included in this Care Pack service provides troubleshooting assistance on industry leading software running on your HPE server. Simplify your support experience and make Hewlett Packard Enterprise your first call for hardware or software questions./V2/GetDocument.aspx?docname=4AA4-8876ENW&cc=us&lc=enRelated ServicesHPE Server Hardware InstallationProvides for the basic hardware installation of Hewlett Packard Enterprise branded servers, storage devices and networking options to assist you in bringing your new hardware into operation in a timely and professional manner./V2/GetPDF.aspx/5981-9356EN.pdfFactory Express for Servers and storageHPE Factory Express offers configuration, customization, integration and deployment services for Hewlett Packard Enterprise servers and storage products. Customers can choose how their factory solutions are built, tested, integrated, shipped and deployed.Page 10Services and SupportFor more information on Factory Express services for your specific server model please contact your sales representative or go to: /go/factory-express.Data Privacy ServicesProtect your data through better media management. HPE Data privacy services help manage and protect sensitive data to reduce the risk of unauthorized access to private information and help meet compliance requirements. Our retention services allow you to keep drives and other devices upon failure, our removal services provide convenient data sanitization and our recovery services allow you to safely retire IT assets and capture any remaining value from the hardware. /services/dataprivacy Additional HPE Care Pack services can be found at: /go/cpceSupportGet connected to Hewlett Packard Enterprise to improve your support experiencePrevent problems with innovative, automated monitoring tools and proactive services. Combining Proactive Care Services with our remote support technology such as Insight Online provides you with expert advice and personalized, cloud-based automated IT support, helping to prevent unplanned down time and solve problems quickly. For more information, visit:/go/proactiveinsightexperienceHPE Support CenterPersonalized online support portal with access to information, tools and experts to support Hewlett Packard Enterprise business products. Submit support cases online, chat with Hewlett Packard Enterprise experts, access support resources or collaborate with peers. Learn more /go/hpscThe Hewlett Packard Enterprise Support Center Mobile App allows you to resolve issues yourself or quickly connect to an agent for live support. Now, you can get access to personalized IT support anywhere, anytime.HPE Insight Remote Support and HPE Support Center are available at no additional cost with an Hewlett Packard Enterprise warranty, HPE Care Pack or Hewlett Packard Enterprise contractual support agreement.NOTE: The HPE Support Center Mobile App is subject to local availabilityParts and MaterialsHewlett Packard Enterprise will provide HPE-supported replacement parts and materials necessary to maintain the covered hardware product in operating condition, including parts and materials for available and recommended engineering improvements. Parts and components that have reached their maximum supported lifetime and/or the maximum usage limitations as set forth in the manufacturer's operating manual, product QuickSpecs, or the technical product data sheet will not be provided, repaired, or replaced as part of these services.The defective media retention service feature option applies only to Disk or eligible SSD/Flash Drives replaced by Hewlett Packard Enterprise due to malfunction.Additional Services InformationTo learn more on HPE ProLiant servers, HPE BladeSystem servers and HPE StorageWorks storage products, please contact your Hewlett Packard Enterprise sales representative or Hewlett Packard Enterprise Authorized Channel Partner. Or visit/services/proliant or /services/bladesystem or/services/storageServer product numbers•HPE Integrity rx2800 i4 Rack-Optimized Server AT101A Minimum additional components required:•One processor•8 GB memory•HPE rx2800 i4 Racking KitNOTE:•Supports High Line Power (1200W) and Low Line Power (800W)•Low Line Power (800W) is supported in limited configurations. One processorwith up to 12 memory DIMMs or two processor sockets with up to 8 memoryDIMMs.•HPE Integrity rx2800 i4 Office Friendly Server AT102A Minimum additional component required:•One processor (supports Intel® Itanium® 9520 quad-core processor only)•8 GB memory•Requires the pedestal kit (Cannot be factory integrated. Must be assembled on site)NOTE:•OFS configuration does not support hot-swap redundancy in cooling fans•Supports both High Line Power (1200W) and Low Line Power (800W).•Low line power is supported in limited configurations. One processor with up to12 memory DIMMs or two processor sockets with up to 8 memory DIMMs.NOTE: With HPE Smart Array P410i 6 Gb/s SAS RAID Controller•HPE rx2800 i4 512MB FBWC Kit (AM252A) is required for RAID 5 and RAID 5+0•HPE rx2800 i4 512MB FBWC kit (AM252A) AND HPE rx2800 i4 Smart ArrayAdvance Pack (SAAP) License (AM305A) is required for RAID 6 and RAID 6+0Processors HPE Integrity rx2800 i4 Itanium 9520 (1.73GHz/4-core/20MB/130W) Processor Kit AT104A HPE rx2800 i4 Itanium 9550 (2.4GHz/4-core/32MB/130W) Processor Kit AT138AHPE Integrity rx2800 i4 Itanium 9540 (2.13GHz/8-core/24MB/170W) Processor Kit AT105AHPE Integrity rx2800 i4 Itanium 9560 (2.53GHz/8-core/32MB/170W) Processor Kit AT106ANOTE: Processor frequencies cannot be mixed in a server.Memory Exp Board HPE Integrity rx2800 i4 6-slot Memory Expansion BoardNOTE:•Each memory expansion board contains six (6) memory DIMM slots•The server supports a maximum of four (4) memory expansion boards or 24DIMM slots.•For one processor in system, maximum of two (2) memory expansion boards aresupported.AT103ASystem Memory HPE rx2800 i4 8GB (2x4G) Single Rank PC3L 10600 (DDR3-1333) Registered CAS-9 MemoryKitAT108AHPE rx2800 i4 16GB (2x8G) Dual Rank PC3L 10600 (DDR3-1333) Registered CAS-9 MemoryKitAT109AHPE rx2800 i4 32GB (2x16G) Dual Rank PC3L 10600 (DDR3-1333) Registered CAS-9Memory KitAT110A NOTE:•Memory must be installed in groups of two DIMMs, also known as pairs orPage 12modules.•For best performance, all DIMM slots should be populated with the same sizeDIMM.•Each memory pair must consist of DIMMs of the same type: samecapacity/density, same organization, same number of ranks, and same speed.•Alternate DIMM pairs between memory risers. If both processor sockets arepopulated, alternate DIMMs between processors.I/O Riser Boards HPE Integrity rx2800 i2 PCIe 3-Slot Riser Board AM228A HPE Integrity rx2800 i2 PCIe 2-Slot Riser Board AM245ANOTE•I/O Riser Boards can be mixed in the system•Last two slots on second I/O riser board (secondary riser board) supports onlyLow Profile form factor for some I/O cards.Network Adapters HPE PCIe 2-port 1000Base-T LAN Adapter AD337A HPE PCIe 2-port 1000Base-SX LAN Adapter AD338AHPE PCIe 4-port 1000Base-T Gigabit Adapter AD339AHPE Integrity PCIe 2-port 10GbE-SR Fabric AdapterNOTE:•For more details, please visit:/products/QuickSpecs/13874_div/13874_div.htmlAM225AHPE Integrity PCIe 2-port 10GbE-LR Fabric Adapter AM232AHPE Integrity PCIe 2-port 10GbE-CR Copper Adapter AM233AHPE Integrity NC552SFP 10Gb 2-port Server AdapterNOTE:•Transceivers (HPE Integrity 10Gb SR SFP+ Opt) must be ordered separately.•For more details, please visit:/products/QuickSpecs/14207_div/14207_div.htmlAT118A HPE Ethernet 10Gb 2-port 561T Adapter for Integrity Servers B9F25AConverged Network Adapters HPE Integrity CN1100E Dual Port Converged Network AdapterNOTE:•Transceivers (HPE Integrity 10Gb SR SFP+ Opt) must be ordered separately.•For more details, please visit:/products/QuickSpecs/14205_div/14205_div.htmlAT111AMulti-function (Combo) Adapters HPE PCIe 1-port 4Gb and 1-port 1000BT AdapterNOTE: Maximum of four (4) cards are supported.AD221AHPE PCIe 2-port 4Gb and 2-port 1000BT AdapterNOTE: Maximum of four (4) cards are supported.AD222AHPE PCIe 2-port 4Gb and 2-port 1000BSX AdapterNOTE: Maximum of four (4) cards are supported.AD393AHPE PCIe 2-port 8Gb FC and 2-port 1/10Gb Ethernet AdapterNOTE:AT094A。
HP Integrity Blade Server系列产品技术白皮书说明书
Blades (BL860c i2, BL870c i2, andBL890c i2)World’s first scale-up blades built on the industry’s #1 bladeinfrastructureTechnical White PaperTable of contentsExecutive Summary (2)Product Family—A starting point (2)HP BladeSystem c-Class Enclosure Solutions and Integrity Server Blades (4)Building a Bladed Scalable System—Foundation Blade and the BL860c i2 (5)HP Integrity BL860c i2 Server Blade (5)Scalable Blade Architecture—Building larger systems (7)Inter Blade QPI Fabric Communication (7)Integrity Blade Link (7)HP Manageability Architecture (8)QPI Fabric and System Topology (8)HP Integrity BL870c i2 Server Blade (8)HP Integrity BL890c i2 Server Blade (9)Memory Architecture (10)HP Integrity IO Subsystem (10)Flex-10 and Virtual Connect (11)Conclusion (12)Executive SummaryThe HP Integrity server blade architecture builds on the best of HP blade technology with new levels ofscalability, spanning from the BL860c i2 single blade entry solution up to the BL890c i2 quad blademid-range offering. Benefits of the HP integrity server blade solutions include scalability, ease of use,flexibility, best-in-class I/O solutions, and total cost of ownership (TCO). This provides a compellingmission-critical Converged Infrastructure strategy for Integrity server blades.If you are considering upgrading from a current bladed or non-bladed server design to a nextgeneration server, this white paper is intended to highlight some of the capabilities of the HP Integrityserver blades to aid in your evaluation.Product Family—A starting pointThe HP Integrity server blades, as shown in Figure 1, are designed to provide a range of capabilities,replacing the prior Integrity generation BL860c, BL870c, and racked 4-processor module and8-processor module rack mount servers. The Integrity server blades product line is composed of theBL860c i2 single blade server, BL870c i2 two-blade server, and BL890c i2 four-blade server. Theprocessor, Memory, and I/O resources of the Integrity server blades can be adjusted, that is scaled,to meet application requirements. Integrity server blades enable compute, memory, and I/O capacityto scale across the product line, as shown in Table 1. In essence, the supported resources of theBL870c i2 are double those of the BL860c i2, and the BL890c i2 resources are double those of theBL870c i2.A complementary part of the Integrity server blades story is that the Integrity blade productsseamlessly coexist with other HP BladeSystem solutions within the c-Class enclosure, enabling mixedHP ProLiant and Integrity, and StorageWorks storage blade solutions within the same enclosure. TheIntegrity server blades and enclosure solutions are supported by the HP BladeSystem managementsuite of products.The HP Integrity server blade family will support future enhanced capabilities, including memory,processor enhancements, operating system offerings, partitioning abilities, and field product upgradesto further extend its capabilities.2Figure 1: Integrity Server Blades Product Family3Table 1: Blade CapabilitiesIntegrity BL860c i2 BL870c i2 BL890c i2 Processor module Intel® Itanium 9300 processor seriesProcessor/Cores/Threads 2P/8C/16T 4P/16C/32T 8P/32C/64T Chipset Intel® E7500 Boxboro/Millbrook ChipsetMemoryIndustry Standard DDR3 24 DIMM slots96 GB (w/4 GB)192 GB (w/8 GB)*48 DIMM slots192 GB (w/4 GB)384 GB (w/8 GB)*96 DIMM slots384 GB (w/4 GB)768 GB (w/8 GB)*Internal Storage 2 hot swap SAS HDDsHW RAID 0, 1* orMirrorDisk/UX 4 hot swap SAS HDDsHW RAID 0, 1* orMirrorDisk/UX8 hot swap SAS HDDsHW RAID 0, 1* orMirrorDisk/UXNetworking (built-in IO solution) 4 @ 10 GbE NICsFlex-10 capability8 @ 10 GbE NICsFlex-10 capability16 @ 10 GbE NICsFlex-10 capabilityMezzanine IO Slots 3 PCIe slots 6 PCIe slots 12 PCIe slotsManagement Integrity iLO 3 (Integrity Integrated Lights-Out 3), iLO 3 Advanced Packlicense is includedSupported OperatingSystemsHPUX 11i v3, OpenVMS v8.4*, Windows Server 2008 R2** (Future Support)Future enhancements include 16 GB DIMM Memory, Product field Upgrades and Partition support.Integrity server blades have an important set of reliability, availably and serviceability (RAS) features,provided in all key areas of the architecture. Capabilities such as, Intel Cache Safe Technology®,error hardened latches, register store engine, memory protection keys, double device data correction,and CPU sparing and migration as well as Advanced Machine Check Architecture (AMCA) forco-ordinated error handling across the hardware, firmware, and operating systems. RAS details arecontained in the “Technologies in the HP Integrity Server Blades” white paper.Virtual Connect Flex-10 features significantly expand the I/O capabilities of the Integrity server bladesand will be described in more detail later in this white paper.HP BladeSystem c-Class Enclosure Solutions and Integrity Server BladesIntegrity server blades may reside in the c7000 or c3000 BladeSystem enclosures.The HP BladeSystem c-Class enclosure story is composed of four key themes:1.Simple to manage and easy to control: Onboard Administrator (OA), Integrity HP IntegrityIntegrated Lights-Out (iLO 3) Manageability, and HP Insight Control Environment2.Agility: Pre-wired and pre-configured make adding a new server simple3.Reduced capital and operating costs: Uses less power and less than half of the space comparedwith racked solutions.4.Ease of Integration: Flexible power configuration, same management tools as HP rack-mountservers4These four elements are applicable to Integrity server blades and become even more important as the size and capabilities of the servers increase.Table 2 details the capacity of the c3000 and c7000 enclosures for Integrity server blades.Table 2: Enclosure Capacity for the Integrity Server Blade FamilyEnclosure CapacityIntegrity server bladesBL860c i2 BL870c i2 BL890c i24 servers 2 servers 1 serverc3000(full height—4 bays)8 servers 4 servers 2 serversc7000(full height—8 bays)Building a Bladed Scalable System—Foundation Blade and the BL860c i2All Integrity server blades are built on the same basic hardware structure. With the Intel QuickPath Interconnect (QPI) fabric, Integrity Blade Link and the extensible HP Integrity iLO 3 solution, HP defines a family of servers, scaling from the BL860c i2 two-processor module system all the way up to theBL890c i2 eight-processor module system.The Integrity server blades are comprised of one to four physical blades, depending on the Integrity server blade product. Multi-blade solutions are regarded as being “conjoined” or interdependently linked together. The Integrity server blades design relies on a common foundation blade design that is replicated and configured based on the location, for example node address, within the QPI fabric topology, resulting in a scalable architecture. The Integrity server blade architecture can easily be increased in resources, for example processor modules, memory and I/O, with sufficient allocated QPI fabric bandwidth and I/O bandwidth to enable a balanced system as I/O resources are added. As the Integrity server blade architecture is increased or scaled from a minimum configuration to a maximum configuration, all management resources, tools, and user interfaces behave consistently, simplifying administration of the entire product line.HP Integrity BL860c i2 Server BladeThe foundation blade structure provides a set of blade features as shown in Figure 2. A foundation blade combined with a BL860c i2 Integrity Blade Link, will be configured to a BL860c i2 blade.The BL860c i2 server blade supports two Intel® Itanium® processor 9300 series (quad-core ordual-core) processor modules. The two processors are linked together by a full width QPI link providing 19.2 GB/s of bandwidth. Each Itanium processor 9300 series module contains two memory controllers with an aggregate bandwidth of 28.8 GB/s. Each Processor Module supports up to 12 DDR3 memory DIMMs, or 24 memory DIMMs in total for the blade. The blade will support a memory capacity of 384 GB when 16 GB DIMMs are available.The I/O subsystem is composed of built-in I/O functions and three I/O expansion slots. The I/O expansion slots are provisioned with x8 PCIe Gen2 links back into the IO Hub controller (IOH). This provides a raw total aggregate bandwidth of 10 GB/s per I/O Mezzanine card (send and receive).5The BL860c i2 server blade also has four 10 GbE Flex-10 NIC ports provided by two embedded dualLAN controllers. Each dual LAN controller is provisioned with x4 PCIe Gen2 links, providing a rawaggregate bandwidth of 5 GB/s (send and receive).The BL860c i2 server blade contains an on-board SAS RAID controller and a separate PCIe Gen1 x4path to an adjacent blade enclosure bay for support of partner blade SAS mass storage and tapebackup options. A manageability subsystem also resides on the blade which works independently ona single blade basis or as an orchestrated manageability subsystem if multiple blades are conjoinedtogether. As with all c-Class Integrity and HP ProLiant blades, the HP Integrity server blades provide aSUV (serial, USB, and video) port on the front of the blade for service and support.As shown in Figure 2, each Itanium processor 9300 series module provides three QPI fabric links tosupport conjoining of blades, using the Integrity Blade Link. This architectural approach enables thefuture ability to upgrade the BL860c i2 product to a BL870c i2 product, resulting in the scaling up ofinterconnected resources by 2x. The BL870c i2 product could also be upgraded to a BL890c i2,resulting in a further doubling of resources.Figure 2:Foundation Blade Architecture DiagramThe BL860c i2 server blade is designed to be socket compatible with the nextgeneration of Itanium processor modules as well.6Table 3:Integrity Server Blades Supported ProcessorsFuture ItaniumFeature Intel® Itanium® processor 9300seriesCores per processor module 4 EnhancedMulti-Threading Support Yes YesUp to 24 MB L3 Enhanced Processor module Highest LevelCache SizeDIMMs per processor module 2-12 2-12DRAM Technology DDR3 DDR3 Scalable Blade Architecture—Building larger systemsThe Integrity server blade architecture is based on distributed shared memory (DSM) architecture, also known as cache coherent Non-Unified Memory Architecture (ccNUMA). The Integrity server blade architecture utilizes the Intel Quick Path Interconnect (QPI) point-to-point fabric to connect the primary system components. Each node in the DSM architecture has access to shared memory. To maintain coherency between all caches in the system, a cache coherency protocol is implemented over QPI. The cache coherency spans all the distributed caches and memory controllers.Inter Blade QPI Fabric CommunicationInter Blade communication is achieved through a glueless structure composed of the Integrity Blade Link, HP Manageability architecture and QPI fabric topology.Integrity Blade LinkFor multi-blade products, for example BL870c i2 and BL890c i2, the Integrity Blade Link conjoins or ties together all the associated blades by providing a physical inter-blade path for the QPI fabric. Additionally, the Blade Link provides a path for auxiliary signals. An additional feature of the Blade Link is to provide description information for the manageability architecture, for use in configuration and initialization of the Integrity server blade hardware.Initially, when the blades are inserted into the enclosure, only the manageability subsystem will be powered on. The attachment of the Integrity Blade Link is required to conjoin the blades into a server, enabling full power-on and boot.The Blade Link physically attaches to the front of one or more blades and is unique for the BL860c i2, BL870c i2, and BL890c i2. The suffix of the Blade Link indicates the size of Blade Link, for example IBL-2 refers to a Blade Link which will support a conjoined two blade solution.7Figure 3: Integrity Blade Link Example—BL890c i2HP Manageability ArchitectureThe HP Integrity HP Integrity Integrated Lights-Out (iLO 3) Manageability system is an important aspectof the overall Integrity blades scalable architecture. From a user point of view, the Integrity iLO 3access point for single and conjoined blades provides a manageability console as well as commandand configuration abilities. As the product scales to larger sizes, the Integrity iLO 3’s on each bladescale as well, working together to manage the product, but providing the administrator with a singleIntegrity iLO 3 server user interface for simplicity. The enclosure Onboard Administrator (OA) behavesin a consistent manner with Integrity server blades and other blade hardware and tools. From anarchitectural point of view, the HP Manageability architecture is the back bone of the system, givingthe ability for each blade to be configured, initialized, and then connected into a scalable set ofnodes with distributed shared memory. Every blade ships with an iLO 3 Advanced license factoryinstalled to enable advanced remote management features such as virtual media.QPI Fabric and System TopologyThe HP Integrity server blades are designed to be scalable. The BL890c i2 supports up to8 processor module sockets, all accessible to each other through the low-latency high bandwidthsystem QPI fabric. Each of these processor sockets supports the Intel® Itanium® processor 9300series module.HP Integrity BL870c i2 Server BladeBuilding a scalable system using the Foundation blade architecture shown in Figure 2, two foundationblades conjoined together with a BL870c i2 Blade Link yields the BL870c i2 topology shown inFigure 4. The BL870c i2 is a four process module system with a fully interconnected QPI fabricbetween all four processor modules.8Figure 4: QPI Fabric, BL870c i2HP Integrity BL890c i2 Server BladeThe HP Integrity architecture can be scaled up to a larger system beyond the BL870c i2 server blade, using the foundation blade architecture shown in Figure 2. Four foundation blades may be gathered or conjoined together using a Blade Link to create the Inter-blade topology structure as shown in Figure 5, resulting in the HP Integrity BL890c i2 architecture.Figure 5:QPI Fabric, BL890c i29Memory ArchitectureccNUMA stands for “cache coherent Non Unified Memory Access.”For ccNUMA systems, CPU memory access time is related to the processor to memory locationproximity. For example a given processor module can access its locally attached faster than memorythat is attached to another processor. Stated in other words, processor module local memory, alsoknown as SLM (socket local memory) has lower latency than accessing memory connected to anotherprocessor module’s memory controllers by sending memory requests through the QPI link across oneor two nodes. Referring to Figure 5, a memory reference from one scalable node to an adjacentscalable node requires communication between the two nodes to access the memory at the target.With the Integrity server blades architecture, QPI fabric provides low latency and high bandwidth tofacilitate node to node communication.UMA or “Unified Memory Access” is a memory configuration in which all processor modules haveuniform memory access latencies. The memory interleaving terminology for this configuration is ILM(interleaved memory). While it is possible for any processor module to communicate with any otherwithin the server, an ILM configuration interleaves across either the top or bottom half of the cube ofFigure 5, resulting in only one node hop for a memory access.A feature of the Integrity server blades architecture is that the user may specify an optimal memoryinterleaving scheme that will be best suited to the user’s application and the host operating system.Different Operating Systems may prefer different configurations for better performance. The user canspecify a range of options from full SLM to full ILM. The default interleaving setting at EFI is “MostlyNUMA” with 7/8th of the memory configured as SLM and 1/8th as ILM. For further details on the topicof memory configuration and optimization please refer to the “Memory Subsystem Information for HPIntegrity Server Blades” white paper.HP Integrity IO SubsystemThe Integrity server blade I/O subsystem brings a broad range of capabilities to the HP Integrityserver product line. As noted earlier in this white paper, the I/O subsystem is supported by a lowlatency high bandwidth QPI fabric. Within the I/O subsystem, four categories of I/O are provided ona foundation blade:1.Three general I/O mezzanine card slots–PCIe Gen2 x8 for each slot–VC Flex-10 capable2.Four 10 GbE built-in LAN ports–Two dual-port NICs, PCIe Gen2 x4–VC Flex-10 capable3.One built-in SAS RAID capable controller–Supporting two hot plug SAS drives–PCIe Gen2 x14.ICH Mezzanine built-in I/O capabilities–PCIe link for adjacent enclosure bay partner blade support–USB controller–VGA controller–PCIe Gen1 x410As the Foundation blade architecture is conjoined to scale up to larger size servers, the I/O subsystem capacity scales linearly. For example the BL870c i2 provides double the capacity of the BL860c i2.For further details please refer to the “Technologies in the HP Integrity Server Blades” white paper. Flex-10 and Virtual ConnectThe Virtual Connect Flex-10 capabilities of HP Integrity server blades set it apart from its competitors. It provides up to four virtual NICs over a 10 GbE LAN server connection, and bandwidth limits can be dynamically configured on each NIC. Virtual Connect Flex-10 can also reduce the number of Ethernet mezzanine cards and blade interconnect modules required within the Blade Enclosure. Note that it is important to scale up the memory subsystem size as the I/O subsystem is scaled up. Please refer to the “Memory Subsystem Information for HP Integrity Server Blades” white paper for further details.The Integrity BL890c i2 server blade configuration example, using Virtual Connect Flex-10, allows the system to expand from a physical implementation of 32 physical NIC ports into a maximum of 128 virtual NIC ports.Table 4:Flex-10 LAN CapacityBase Flex-10 LAN port Configuration Maximum Flex-10 LAN port ConfigurationPhysical 10 GbE built-in NIC port count Virtual ConnectFlex-10 portcountPhysical 10 GbEbuilt-in NIC portcountOptional I/O10 GbE NICcard count(physicalport count)VirtualConnectFlex-10 portcountBL860ci24 16 4 2,(4)32 BL870ci28 32 8 4,(8)64 BL890ci216 64 16 8,(16)128The maximum Flex-10 configuration, as shown in Table 4, leaves one general I/O mezzanine slot per blade within the server available to support an addition type of I/O interconnect, such as dual port8 Gb Fibre Channel. A BL890c i2 System configuration example, customized for Storage Area Network (SAN), would support up to 12 2-port 8 Gb Fibre Channel cards, while still having 16 physical 10 GbE NICs that may be expanded to 64 virtual ports.Other I/O configurations can be implemented to provide the best combination of Fibre Channel, Ethernet and SAS or other types of I/O to meet the user requirements.11ConclusionHP Integrity server blades provide:•A broad product offering within the current c-Class c7000 and c3000 enclosures•Memory, storage, and I/O that scales linearly with compute power•Improved total cost of ownership by increasing Integrity blade features within the existingc-Class enclosure.•Consistent management and tools with existing c-Class blades•Support for Integrity, ProLiant, and StorageWorks storage blades in the same enclosure.With the rich set of features and choices, enabled for use within both the c7000 and c3000 bladeenclosures, HP Integrity server blades provide a balanced, scalable system, for single blade andmulti-blade conjoined configurations. The HP Integrity server blade architecture utilizes a low latencyhigh bandwidth QPI fabric to tie together each of the nodes within the server. The architecture alsoprovides a best in class I/O architecture, utilizing Flex-10 and Virtual Connect.Share with colleagues© Copyright 2010 Hewlett-Packard Development Company, L.P. The information contained herein is subject tochange without notice. The only warranties for HP products and services are set forth in the express warrantystatements accompanying such products and services. Nothing herein should be construed as constituting anadditional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.Intel and Itanium logo are trademarks of Intel Corporation in the U.S. and other countries.4AA1-1295ENW, Created April 2010。
MEMORY存储芯片LPC824M201JHI33E中文规格书
1.General descriptionThe LPC82x are an ARM Cortex-M0+ based, low-cost 32-bit MCU family operating atCPU frequencies of up to 30MHz. The LPC82x support up to 32 KB of flash memory and8KB of SRAM.The peripheral complement of the LPC82x includes a CRC engine, four I2C-businterfaces, up to three USARTs, up to two SPI interfaces, one multi-rate timer,self-wake-up timer, and state-configurable timer with PWM function (SCTimer/PWM), aDMA, one 12-bit ADC and one analog comparator, function-configurable I/O ports througha switch matrix, an input pattern match engine, and up to 29 general-purpose I/O pins.For additional documentation related to the LPC82x parts, see Section18.2.Features and benefits⏹System:◆ARM Cortex-M0+ processor (revision r0p1), running at frequencies of up to30MHz with single-cycle multiplier and fast single-cycle I/O port.◆ARM Cortex-M0+ built-in Nested Vectored Interrupt Controller (NVIC).◆System tick timer.◆AHB multilayer matrix.◆Serial Wire Debug (SWD) with four break points and two watch points. JTAGboundary scan (BSDL) supported.◆MTB⏹Memory:◆Up to 32KB on-chip flash programming memory with 64 Byte page write anderase. Code Read Protection (CRP) supported.◆8 KB SRAM.⏹ROM API support:◆Boot loader.◆On-chip ROM APIs for ADC, SPI, I2C, USART, power configuration (powerprofiles) and integer divide.◆Flash In-Application Programming (IAP) and In-System Programming (ISP).⏹Digital peripherals:◆High-speed GPIO interface connected to the ARM Cortex-M0+ IO bus with up to 29General-Purpose I/O (GPIO) pins with configurable pull-up/pull-down resistors,programmable open-drain mode, input inverter, and digital filter. GPIO directioncontrol supports independent set/clear/toggle of individual bits.◆High-current source output driver (20 mA) on four pins.◆High-current sink driver (20 mA) on two true open-drain pins.◆GPIO interrupt generation capability with boolean pattern-matching feature on eightGPIO inputs.◆Switch matrix for flexible configuration of each I/O pin function.◆CRC engine.◆DMA with 18 channels and 9 trigger inputs.⏹Timers:◆State Configurable Timer (SCTimer/PWM) with input and output functions(including capture and match) for timing and PWM applications. EachSCTimer/PWM input is multiplexed to allow selecting from several input sourcessuch as pins, ADC interrupt, or comparator output.◆Four channel Multi-Rate Timer (MRT) for repetitive interrupt generation at up tofour programmable, fixed rates.◆Self-Wake-up Timer (WKT) clocked from either the IRC, a low-power,low-frequency internal oscillator, or an external clock input in the always-on power domain.◆Windowed Watchdog timer (WWDT).⏹Analog peripherals:◆One 12-bit ADC with up to 12 input channels with multiple internal and externaltrigger inputs and with sample rates of up to 1.2 Msamples/s. The ADC supports two independent conversion sequences.◆Comparator with four input pins and external or internal reference voltage.⏹Serial peripherals:◆Three USART interfaces with pin functions assigned through the switch matrix andone common fractional baud rate generator.◆Two SPI controllers with pin functions assigned through the switch matrix.◆Four I2C-bus interfaces. One I2C supports Fast-mode Plus with 1Mbit/s data rateson two true open-drain pins and listen mode. Three I2Cs support data rates up to 400 kbit/s on standard digital pins.⏹Clock generation:◆12MHz internal RC oscillator trimmed to 1.5 % accuracy that can optionally beused as a system clock.◆Crystal oscillator with an operating range of 1MHz to 25MHz.◆Programmable watchdog oscillator with a frequency range of 9.4 kHz to 2.3MHz.◆PLL allows CPU operation up to the maximum CPU rate without the need for ahigh-frequency crystal. May be run from the system oscillator, the external clockinput, or the internal RC oscillator.◆Clock output function with divider that can reflect all internal clock sources.⏹Power control:◆Power consumption in active mode as low as 90 uA/MHz in low-current modeusing the IRC as the clock source.◆Integrated PMU (Power Management Unit) to minimize power consumption.◆Reduced power modes: Sleep mode, Deep-sleep mode, Power-down mode, andDeep power-down mode.◆Wake-up from Deep-sleep and Power-down modes on activity on USART, SPI, andI2C peripherals.◆Timer-controlled self wake-up from Deep power-down mode.◆Power-On Reset (POR).◆Brownout detect (BOD).⏹Unique device serial number for identification.⏹Single power supply (1.8 V to 3.6 V).⏹Operating temperature range -40 °C to +105 °C.⏹Available in a TSSOP20 and HVQFN33 (5x5) package.3.Applications4.Ordering information4.1Ordering options⏹Sensor gateways ⏹Simple motor control ⏹Industrial⏹Portables and wearables ⏹Gaming controllers ⏹Lighting⏹8/16-bit applications ⏹Motor control⏹Consumer⏹Fire and security applications⏹Climate controlTable 1.Ordering informationType numberPackage NameDescriptionVersionLPC824M201JHI33HVQFN33HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 5 ⨯ 5 ⨯ 0.85 mmn/aLPC822M101JHI33HVQFN33HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 5 ⨯ 5 ⨯ 0.85 mmn/a LPC824M201JDH20TSSOP20plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1LPC822M101JDH20TSSOP20plastic thin shrink small outline package; 20 leads; body width 4.4 mmSOT360-1Table 2.Ordering optionsType number Flash/KB SRAM/KB USART I 2C SPI ADCchannels Comparator GPIO Package LPC824M201JHI3332834212Y 29HVQFN33LPC822M101JHI3316434212Y 29HVQFN33LPC824M201JDH203283425Y 16TSSOP20LPC822M101JDH201643425y16TSSOP206.Block diagram7.Pinning information7.1Pinning。
MEMORY存储芯片GD32F103RCT6中文规格书
3.Functional description3.1. ARM® Cortex™-M3 coreThe Cortex™-M3 processor is the latest generation of ARM®processors for embeddedsystems. It has been developed to provide a low-cost platform that meets the needs of MCUimplementation, with a reduced pin count and low-power consumption, while deliveringoutstanding computational performance and an advanced system response to interrupts.⏹32-bit ARM®Cortex™-M3 processor core⏹Up to 108 MHz operation frequency⏹Single-cycle multiplication and hardware divider⏹Integrated Nested Vectored Interrupt Controller (NVIC)⏹24-bit SysTick timerThe Cortex™-M3 processor is based on the ARMv7 architecture and supports both Thumband Thumb-2 instruction sets. Some system peripherals listed below are also provided byCortex™-M3:⏹Internal Bus Matrix connected with I-Code bus, D-Code bus, System bus, PrivatePeripheral Bus (PPB) and debug accesses.⏹Nested Vectored Interrupt Controller (NVIC).⏹Flash Patch and Breakpoint (FPB).⏹Data Watchpoint and Trace (DWT).⏹Instrumentation Trace Macrocell (ITM).⏹Embedded Trace Macrocell (ETM).⏹Serial Wire JTAG Debug Port (SWJ-DP).⏹Trace Port Interface Unit (TPIU).⏹Memory Protection Unit (MPU).3.2. On-chip memory⏹Up to 3072 Kbytes of Flash memory⏹Up to 96 Kbytes of SRAMThe ARM®Cortex™-M3 processor is structured in Harvard architecture which can useseparate buses to fetch instructions and load/store data. 3072 Kbytes of inner Flash and 96Kbytes of inner SRAM at most is available for storing programs and data, both accessed (R/W)at CPU clock speed with zero wait states.The Table 2-4. GD32F103xx memory mapshows the memory map of the GD32F103xx series of devices, including code, SRAM,peripheral, and other pre-defined regions.3.3. Clock, reset and supply management⏹Internal 8 MHz factory-trimmed RC and external 4 to 16 MHz crystal oscillator⏹Internal 40 KHz RC calibrated oscillator and external 32.768 KHz crystal oscillator⏹Integrated system clock PLL⏹ 2.6 to 3.6 V application supply and I/Os⏹Supply Supervisor: POR (Power On Reset), PDR (Power Down Reset), and low voltagedetector (LVD)The Clock Control unit provides a range of frequencies and clock functions. These include anInternal 8M RC oscillator (IRC8M), a High Speed crystal oscillator (HXTAL), a Low SpeedInternal 40K RC oscillator (IRC40K), a Low Speed crystal oscillator (LXTAL), a Phase LockLoop (PLL), a HXTAL clock monitor, clock prescalers, clock multiplexers and clock gatingcircuitry. The frequency of AHB, APB2 and the APB1 domains can be configured by eachprescaler. The maximum frequency of the AHB, APB2 and APB1 domains is 108 MHz/108MHz/54 MHz. See Figure 2-8. GD32F103xx clock tree for details.GD32F10x Reset Control includes the control of three kinds of reset: power reset, systemreset and backup domain reset.The system reset resets the processor core and peripheralIP components except for the SW-DP controller and the Backup domain.Power-on reset(POR) and power-down reset (PDR) are always active, and ensures proper operation startingfrom/down to 2.6 V. The device remains in reset mode when V DD is below a specifiedthreshold. The embedded low voltage detector (LVD) monitors the power supply, comparesit to the voltage threshold and generates an interrupt as a warning message for leading theMCU into security.Power supply schemes:⏹V DD range: 2.6 to 3.6 V, external power supply for I/Os and the internal regulator.Provided externally through V DD pins.⏹V SSA, V DDA range: 2.6 to 3.6 V, external analog power supplies for ADC, reset blocks,RCs and PLL. V DDA and V SSA must be connected to V DD and V SS, respectively.⏹V BAT range: 1.8 to 3.6 V, power supply for RTC, external clock 32 KHz oscillator andbackup registers (through power switch) when V DD is not present.3.4. Boot modesAt startup, boot pins are used to select one of three boot options:⏹Boot from main flash memory (default)⏹Boot from system memory⏹Boot from on-chip SRAMThe boot loader is located in the internal boot ROM memory (system memory). It is used toreprogram the Flash memory by using USART0 (PA9 and PA10), if devices areGD32F103xF/G/I/K, USART1 (PA2 and PA3) is also available for boot functions. It also can453.5. Power saving modesThe MCU supports three kinds of power saving modes to achieve even lower powerconsumption. They are sleep mode, deep-sleep mode, and standby mode.These operatingmodes reduce the power consumption and allow the application to achieve the best balancebetween the CPU operating time, speed and power consumption.⏹Sleep modeIn sleep mode, only clock of Cortex™-M3 is off. All peripherals continue to operate andany interrupt/event can wake up the system.⏹Deep-sleep modeIn deep-sleep mode, all clocks in the 1.2V domain are off, and all of IRC8M, HXTAL andPLLs are disabled. Only the contents of SRAM and registers are retained. Any interruptor wakeup event from EXTI lines can wake up the system from the deep-sleep modeincluding the 16 external lines, the RTC alarm, the LVD output, USB Wakeup and EthernetWakeup. When exiting the deep-sleep mode, the IRC8M is selected as the system clock.⏹Standby modeIn standby mode, the whole 1.2V domain is power off, the LDO is shut down, and all ofIRC8M, HXTAL and PLL are disabled.The contents of SRAM and registers (exceptBackup registers) are lost. There are four wakeup sources for the Standby mode,including the external reset from NRST pin, the RTC alarm, the FWDGT reset, and therising edge on WKUP pin.3.6. Analog to digital converter (ADC)⏹12-bit SAR ADC⏹Up to 1 MSPS for 12-bit resolution⏹Analog input signal voltage range: V SSA to V DDA (2.6 to 3.6 V)⏹Temperature sensorUp to three 12-bit multi-channel ADCs are integrated in the device. Each has a total of up to21 multiplexed external channels. An analog watchdog block can be used to detect thechannels, which are required to remain within a specific threshold window. A configurablechannel management block of analog inputs also can be used to perform conversions insingle, continuous, scan or discontinuous mode.The ADCs can be triggered from the events generated by the general level 0 timers (TIMERx)or the advanced timers (TIMER0 and TIMER7) with internal connection. The temperaturesensor generates a voltage that varies linearly with temperature. The analog supply voltageV DDA can vary from 2.6 V to 3.6 V. The output voltage of temperature sensor is internallyconnected to the ADC_IN16 input channel.3.7. Digital to analog converter (DAC)⏹Two 12-bit DACs with independent output channels⏹8-bit or 12-bit mode in conjunction with the DMA controllerThe two 12-bit buffered DACs are used to generate variable analog outputs. The DACchannels can be triggered by the timer or EXTI with DMA support.In dual DAC channeloperation, conversions could be done independently or simultaneously. The maximum outputvalue of the DAC is V REF+.3.8. DMA⏹7 channel DMA0 controller and 5 channel DMA1 controller⏹Peripherals supported: Timers, ADC, SPIs, I2Cs, USARTs, DAC, I2S and SDIOThe direct memory access (DMA) controllers provide a hardware method of transferring databetween peripherals and/or memory without intervention from the CPU, thereby freeing upbandwidth for other system functions. Three types of access method are supported:peripheral to memory, memory to peripheral, memory to memory.Each channel is connected to fixed hardware DMA requests. The priorities of DMA channelrequests are determined by software configuration and hardware channel number.Transfersize of source and destination are independent and configurable.3.9. General-purpose inputs/outputs (GPIOs)⏹Up to 112 fast GPIOs, all mappable on 16 external interrupt lines⏹Analog input/output configurable⏹Alternate function input/output configurableThere are up to 112 general purpose I/O pins (GPIO), named PA0 ~ PA15, PB0 ~ PB15, PC0~ PC15, PD0 ~ PD15, PE0 ~ PE15, PF0 ~ PF15 and PG0 ~ PG15 for the device to implementlogic input/output functions. Each GPIO port has related control and configuration registers tosatisfy the requirements of specific applications. The external interrupt on the GPIO pins ofthe device have related control and configuration registers in the Interrupt/event ControllerUnit (EXTI). The GPIO ports are pin-shared with other alternative functions (AFs) to obtainmaximum flexibility on the package pins. The GPIO pins can be used as alternative functionalpins by configuring the corresponding registers regardless of the AF input or output pins. Eachof the GPIO pins can be configured by software as output (push-pull or open-drain), input,peripheral alternate function or analog mode. Each GPIO pin can be configured as pull-up,pull-down or no pull-up/pull-down. All GPIOs are high-current capable except for analog mode.3.10. Timers and PWM generation⏹Up to two 16-bit advanced timer (TIMER0 & TIMER7), ten 16-bit general timers, and two16-bit basic timer (TIMER5 & TIMER6)⏹Up to 4 independent channels of PWM, output compare or input capture for each andexternal trigger input⏹16-bit, motor control PWM advanced timer with programmable dead-time generation foroutput match⏹Encoder interface controller with two inputs using quadrature decoder⏹24-bit SysTick timer down counter⏹ 2 watchdog timers (Free watchdog timer and window watchdog timer)The advanced timer (TIMER0 & TIMER7) can be seen as a three-phase PWM multiplexedon 6 channels. It has complementary PWM outputs with programmable dead-time generation.It can also be used as a complete general timer. The 6 independent channels can be usedfor。
Integrated memory controller
专利名称:Integrated memory controller发明人:Theodore C. White,Dinesh Jayabharathi申请号:US10867113申请日:20040614公开号:US07120084B2公开日:20061010专利内容由知识产权出版社提供专利附图:摘要:A system and circuit for reading and writing data to a buffer memory, which is Synchronous Dynamic Random access Memory (“SDRAM”), or Double Data Rate-Synchronous Dynamic Random Access Memory (“DDR”) is provided. The circuit includes logic for managing programmable clock signal relationships such that data arrives at anoptimum time for writing. Data that is to be written at DDR is moved from a first buffer clock to a DDR write clock signal and to a DQS signal that is based on a SDRAM clock signal. Also, plural tap-cells may be used to delay clock signals such that data and clock signals are aligned. An emulated DQS signal in a DDR capture scheme is used for reading from a SDRAM.申请人:Theodore C. White,Dinesh Jayabharathi地址:Margarita CA US,Orange CA US国籍:US,US更多信息请下载全文后查看。
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Integrated Memory Controllerswith Parallel Coherence Streams Mainak Chaudhuri,Member,IEEE,and Mark Heinrich,Senior Member,IEEE Abstract—Previous work in scalable hardware distributed shared memory(DSM)multiprocessors has established the critical and dominant role that protocol processing bandwidth(or its inverse,occupancy)plays in determining overall performance in architectures with standalone memory/coherence controllers.However,with recent architectural trends toward integrated(on-chip)memory controllers and the well-known fact that processor frequency is increasing more rapidly than memory systems’,we must ask whether parallel coherence processing engines(either multiple integrated protocol processors/cores or multiple protocol threads)are needed in DSM machines constructed from modern processor architectures and,if so,when.We construct a useful analytical model to give the designer insight into when parallel coherence streams will improve performance and verify our model via detailed simulation on 64-threaded microbenchmarks and parallel applications and on single-node multiprogrammed workloads.Surprisingly,and contrary to related work,we find that,in these architectures,adding a second coherence engine has almost no impact on performance.Further, for less-tuned applications that suffer from hot spots(contentious requests to the same memory line),additional engines offer no benefit whatsoever.Even with double the memory bandwidth(or channels),an additional coherence processing stream yields only slight performance improvement.Only for a special class of DSM machines employing directoryless broadcast protocols over unordered interconnects does parallel“snoop”processing offer reasonable performance improvement for communication-intensive applications.Overall,given the architectural trends,this is good news for DSM designers who want to minimize the resources necessary(protocol threads or integrated protocol processor cores for maintaining internode coherence,respectively)to create SMTp-based or multi-CMP-based scalable DSM machines using directory protocols.Index Terms—Distributed shared memory multiprocessor,directory protocol,multiple coherence controllers,coherence bandwidth, integrated memory controller.Ç1I NTRODUCTIONI NTEGRATED memory controllers appearing in several high-end microprocessors such as the Alpha21364[6],the IBM POWER5[11],the AMD Opteron[12],and the Sun UltraSPARC III and IV[30],[31]provide a direct solution to reducing the round-trip memory transaction latency. Multiprocessor systems built from microprocessors with integrated memory controllers are naturally distributed memory machines(each processor has its own local memory)as opposed to symmetric multiprocessors(SMPs). A“snoop-based”cache coherence protocol in such ma-chines requires that a point-to-point message be sent to all processors in the system to complete even a simple remote read miss when the cache line is clean at the home node[2]. Therefore,a high-performance and bandwidth-thrifty solu-tion would employ a scalable directory-based cache coherence protocol.Research on directory-based coherence controller design has led to two different high-performance architectures. Hardwired coherence controllers,found in the MIT Alewife [1],the KSR1machine[13],the SGI Origin2000[18],and the Stanford DASH[19],offer fast handling of coherence transactions but no flexibility in choice of the coherence protocol.On the other hand,customized programmable protocol processors embedded in memory controllers, found in the Piranha chip-multiprocessor[3],the Opteron-Horus[15],the Stanford FLASH multiprocessor[9],[17],the STiNG multiprocessor[20],and the Sun S3.mp[26],execute coherence protocol handlers in the form of optimized sequences of instructions or microcode.Due to higher protocol processor occupancy,these designs may offer degraded performance,depending on the speed of the protocol processor.However,this kind of design allows late binding of the protocol,flexibility in the choice of the protocol,and,in most cases,an easier and faster protocol verification phase.Despite these compelling reasons,lower performance has led the designers of commercial DSM multiprocessors not to consider programmable coherence controllers.In fact,prior research[9]has shown that there can be as much as a12percent performance gap between hardwired controllers and customized protocol processors and that coherence controller occupancy is the most important determinant of performance[4].Designs employing multiple coherence engines offer low-occupancy coherence.What is surprising is that,with multiple coherence engines,even hardwired controllers show significant performance improvement in DSM multi-processors built out of SMP nodes[24],[27].In such systems,a single coherence engine in a standalone memory controller is not sufficient to handle all coherence transac-tions efficiently.However,we note that none of these studies have explored multiprocessors with integrated.M.Chaudhuri is with the Department of Computer Science and Engineering,Indian Institute of Technology,Kanpur208016,India.E-mail:mainakc@cse.iitk.ac.in..M.Heinrich is with the School of Computer Science,University of Central Florida,Orlando,FL32816.E-mail:heinrich@.Manuscript received23Nov.2005;revised25June2006;accepted22Sept. 2006;published online9Jan.2007.Recommended for acceptance by A.Gonzalez.In this paper,we reconsider customized programmable protocol processors in light of integrated memory con-trollers and explore the extensions to memory controller hardware and coherence protocol software for enabling multiple coherence engines in such systems.Since simulta-neous multithreading(SMT)[32],[33]is common in high-end microprocessors today[11],[14],[16],[22],in this study, we consider directory-based DSM multiprocessors of up to 16nodes with each node built from an SMT processor capable of running four application threads.This aspect, along with integrated memory controllers,makes our work quite different from prior research in this direction. Although,in this paper,we squarely focus on SMT nodes, we believe that the trends presented here will apply equally to the internode coherence controllers in DSM multi-processors built out of chip multiprocessor(CMP)nodes. We consider two classes of directory-based programmable coherence controller design.One class consists of one or more customized protocol processors embedded in the integrated memory controller,while the other exploits the recently proposed SMTp architecture[5],which executes the coherence protocol handlers on one or more of the hardware thread contexts of the main SMT processor,thereby entirely eliminating the embedded protocol pro-cessor.For both designs we present the architectural extensions needed to support concurrent handling of multiple independent coherence transactions,which we will refer to as parallel coherence streams.Simulation results on two carefully crafted microbench-marks,a selected set of shared memory scientific applica-tions,and single-node multiprogrammed workloads show that the designs with SMTp extensions or with embedded protocol processors running at full processor frequency do not suffer from a shortage of protocol bandwidth.Even when the embedded protocol processor is operated at half the main processor frequency we find that adding a second protocol processor does not improve performance signifi-cantly,although it does reduce the average waiting time of coherence transactions.Only for a frequency ratio of4 between the main processor and the protocol processor do we start seeing performance gains when adding a second protocol processor.To explain our results,we develop a simple,yet generic,analytical model.In the model,we derive the relationships between DRAM bank behavior of a batch of concurrent coherence requests,DRAM access latency,protocol processor occupancy,and memory chan-nel bandwidth for which adding a second protocol handling engine may improve performance.In this paper,we focus on scalable directory-based coherence processing.A different class of broadcast proto-cols over unordered interconnects,namely,AMD Hammer [2]and Token Coherence[21],eliminates the directory indirection,but increases the volume of coherence mes-sages.While presenting the results,for completeness,we briefly discuss our experience with a Hammer-like protocol in the context of parallel snoop processing.In summary,this paper contributes in the following two major ways:.This paper presents a thorough evaluation of two different classes of customized programmable co-herence controller architectures with integratedmemory controllers and simultaneous multithread-different from the previously published results onoff-chip hardwired coherence engines[24],[27].Parallel coherence stream processing turns out tobe beneficial only for directoryless broadcast proto-cols over unordered interconnects..This paper develops a simple and generic analytical model to decide whether adding a second coherenceengine will improve performance in a directory-based protocol.The next section describes the baseline architecture,and Section3explains the few necessary microarchitectural extensions and coherence protocol software modifications for enabling parallel coherence streams.We also present our analytical model in this section.In Sections4and5,we present our simulation results.Section6briefly discusses prior research in this area,and Section7presents conclud-ing remarks and future directions.2B ASELINE M EMORY C ONTROLLERIn this section,we first discuss a DSM architecture with an embedded protocol processor and we then describe the salient architectural modifications needed to realize the SMTp architecture.In the next section,we extend this baseline architecture to enable multiple protocol processing streams.Our memory controller architecture shown in Fig.1is derived from the Memory And General Interconnect Controller(MAGIC)of the Stanford FLASH multiprocessor [17].However,its design is closer to the hub of the SGI Origin2000[18]with the exception that it is programmable and can execute any cache coherence protocol.Coherence messages arrive at the inbound processor interface(PI)or the inbound network interface(NI)and wait for the dispatch unit to schedule them.The dispatch unit carries out a round-robin scheduling among the PI queue,four NI input queues(corresponding to four virtual networks or lanes),and the software queue(see below)by examining the heads of the six queues.After selecting a message,a table lookup decides which protocol message handler should beFig.1.Memory controller architecture.PI,NI,PPWQ,OMB,and MRQ stand for processor interface,network interface,protocol processor wait queue,outstanding message buffer,and memory reorder queue, respectively.the requested address if the message expects a data reply. The speculative DRAM access potentially hides the protocol processing latency under the memory access latency.The dispatched message waits in the Protocol Processor Wait Queue(PPWQ)until the protocol processor extracts it for execution.Each PPWQ entry contains the requested address,the starting PC of the handler,and the header of the message.The speculative memory request is sent to the memory reorder queue(MRQ)and can start accessing DRAM immediately if it does not have a bank conflict with any outstanding requests.After the memory read is completed,the cache line is transferred over a free memory channel to a data buffer,allocated by the PI or NI when the message arrived.The contents of the data buffer are sent to the requester only after the protocol processor instructs the outgoing interface to do so.The protocol processor starts serving a message by extracting a new entry from the head of the PPWQ,storing it in the Outstanding Message Buffer (OMB),marking the PPWQ entry free,and transferring control to the PC stored in the OMB.The software queue provides a self-scheduling mechanism for the protocol processor and plays an important role in the deadlock avoidance mechanism related to outgoing NI queue space needed to send invalidations to the sharers(see[17]for details).Our reasonably aggressive memory controller is orga-nized to have a four-stage macropipeline,namely,PI/NI inbound,handler dispatch,protocol processor,and the PI/ NI outbound.These four units can operate concurrently on four different messages in a pipelined fashion.The protocol processor itself has a statically scheduled dual-issue five-stage in-order MIPS pipeline with some additional custom instructions to accelerate directory-specific bit manipula-tions.It has dedicated protocol instruction and data caches backed by main memory.The full-map write-invalidate bitvector coherence proto-col used in this study is derived from the SGI Origin2000 protocol[18].A typical protocol handler(e.g.,a local read miss handler)starts by calculating the address of the directory entry corresponding to the requested cache line through a one-to-one hash function on the requested address.Next,the handler loads the directory entry in a register(the protocol processor has a MIPS-like ISA with 32registers)and carries out some integer arithmetic on this register to decide appropriate coherence actions.The protocol handler uses send instructions to instruct the send unit to initiate message transfer operations via the PI or NI, as appropriate.2.1The SMTp ArchitectureWe now briefly discuss the salient features of the SMTp architecture[5]used in this study.The SMTp architecture replaces the embedded protocol processor in the baseline memory controller described above by a hardware thread context in the SMT processor core.The handler dispatch hardware sets the Protocol PC Valid(PPCV)bit in the fetcher when a message is ready to be serviced and the fetcher has completed fetching the current handler.At the same time the dispatch hardware sets the protocol handler PC.This lets the fetch policy(ICOUNT in this study) consider the protocol thread as a potential fetch candidate. When the fetcher completes fetching the current handler it probes the PPWQ to see if some message is waiting to be some of the latency imposed by long front-end pipeline on short critical handlers.All protocol instructions go through the pipeline resources shared with the application threads,including the two-level cache hierarchy.Note that the protocol thread does not have a separate cache hierarchy and this is a major advantage in terms of complexity over embedded protocol processors.A protocol L2miss does not invoke another protocol thread recursively.Instead,the dispatch hardware recognizes the protocol address space and enqueues the request into the MRQ directly.In an SMTp architecture,the forward progress of an application thread’s L2miss depends on the forward progress of the protocol thread.This creates dependence cycles involving the shared pipeline resources such as the front-end queue buffers,branch stack space,integer registers,integer queue slots,load/store queue slots, speculative store buffers,and miss status holding registers (MSHRs).Since,in this design,we consider per-thread active lists(or reorder buffers),they are not involved in this kind of resource deadlock.We avoid any deadlock involving these resources by maintaining at least one reserved instance that is usable by the protocol thread only. For performance reasons more instances may be reserved. To break a subtle deadlock cycle involving cache index conflicts between the application and the protocol threads,a number of cache line-sized bypass buffers are reserved for the protocol thread[5].The coherence protocol software requires no modifica-tions when switching from an architecture with an embedded protocol processor to SMTp.However,we optimized the SMTp protocol code by eliminating the unnecessary NOPs generated by the static dual-issue scheduler of the embedded protocol processor.3M ULTIPLE C OHERENCE S TREAMSIn this section,we explain the necessary modifications to both the hardware and coherence protocol software for enabling multiple coherence streams.The modifications are essentially independent of whether the parallel coherence engines are multiple embedded protocol processors or multiple protocol threads.The basic difference between the two architectures is that the former has a much higher hardware cost due to the complete replication of protocol processor.SMTp only requires that multiple hardware thread contexts be reserved for protocol execution.In the following,we focus our discussion on multiple protocol processors only.We conclude this section with a simple performance model applicable to both embedded protocol processors and SMTp.3.1Multiple Protocol ProcessorsWith multiple protocol processors,the memory controller’s dispatch unit must be modified to ensure mutual exclusion for directory accesses.Before selecting a message from the heads of the six incoming queues,the dispatch unit compares the address requested by the message with addresses of the requests waiting in the PPWQ and OMB. The size of the OMB is increased to be equal to the number of protocol processors,and one OMB is logically assigned to one protocol processor.For a fast dispatch,we make the address CAMs in the PPWQ and OMB six-ported so that allCHAUDHURI AND HEINRICH:INTEGRATED MEMORY CONTROLLERS WITH PARALLEL COHERENCE STREAMS3PPWQ.The dispatch unit can write only one message to the PPWQ per cycle(it needs only one write port).Whenever a protocol processor is free,it arbitrates for the PPWQ read port.The read port is granted to the protocol processor having the lowest identifier among the contenders with the help of a priority encoder.Thus,the k th protocol processor gets a message to work on only if the protocol processors0 to kÀ1are busy.Thus,assignment of a message to a protocol processor is completely dynamic and is based solely on availability of protocol processors.In every cycle, a new protocol handler can be started on a free protocol processor.Under pathological conditions,the dispatch unit mayfind that all the six potential messages are suffering from an address conflict with some outstanding request.This leads to idle dispatch cycles.As a way to reduce the number of idle dispatch cycles,we explore the potential of out-of-order dispatch by making five out of the six queues collapsible and organizing them as CAMs(the software queue cannot be made collapsible without significant performance pen-alty,since it is not implemented in hardware).The dispatch hardware considers all the requests(instead of only the head)in a queue before selecting one.To enable concurrent execution of coherence protocol handlers,the coherence protocol code must be modified so that critical sections are protected via locks.We experi-mented with two types of spin locks,namely,atomic test and set(requires a special test-and-set instruction)and LL/SC.For high-throughput,the test and set lock bit is maintained on-chip in a special register instead of in memory.The LL/SC lock is implemented in the conven-tional manner by allocating the lock in the protocol address space.The access to the shared software queue data structure is the only major critical section in our protocol code.The running occupancy of the software queue is also a shared variable among the protocol processors.This variable is read by read-exclusive and upgrade handlers before starting to send invalidations,if any.Access to this variable is also protected by locks.In summary,the coherence protocol executed on a system supporting parallel coherence streams will exhibit increased dynamic instruction count leading to an increased average handler occupancy.Thus,we are trading the increase in occupancy of individual handlers with concurrency across different handlers(an usual latency versus throughput trade-off).In the baseline(non-SMTp)architecture,the protocol instruction and data caches are not replicated per protocol processor due to coherence problems involving directory entries.The shared caches are made dual ported to support accesses from two protocol processors at the same time. However,each cache can have only one outstanding miss. While a miss is outstanding,the caches can continue to service hits to different lines.We chose such a design because the number of misses(other than cold misses)in the protocol instruction and data caches is small for the data sizes we consider.As a result,supporting one outstanding miss for each cache does not significantly affect perfor-mance but does obviate the need for complex circuitry associated with multiple outstanding misses.This modifi-cation does not apply to the SMTp architecture since the protocol threads already share the lockup-free cache hierarchy of the main SMT processor core.The protocol processors(or the protocol threads)arbi-multiple header and address registers.The send unit has the best case occupancy of one cycle and,therefore,can initiate a new message every cycle.Finally,the boot handler of the protocol code requires some minor modifications.The boot handler is responsible for initializing various memory controller state and the protocol processors’(or protocol threads’)registers.With multiple protocol processors per memory controller only one protocol processor needs to initialize the memory controller states.Each of the remaining protocol processors executes a much shorter boot handler containing only the code to initialize its own architectural register file.3.2A Performance ModelIn this section,we present a simple analytical model to help decide whether more than one coherence controller is helpful.We analyze the time spent in the memory system by a batch of concurrently arriving coherence requests with one and two coherence controllers.The applicability of the model is not limited to architectures with integrated memory controllers,but is equally applicable to any multiprocessor system exercising directory-based cache coherence.To keep the model simple,we focus on architectures with one or two coherence controllers,but it can be trivially extended to any number of coherence controllers.As pointed out in other work[4],the handlers running on the home node handling read,read-exclusive, and upgrade requests contribute the most toward the total occupancy of the coherence controller.Further,the number of upgrade requests is usually far fewer than the number of read and read-exclusive requests.Therefore,a system can potentially enjoy a considerable amount of performance improvement with two coherence controllers if there are multiple independent read or read-exclusive requests available at the home node at the same time.One common property of these request handlers is that they require cache line replies and,hence,DRAM reads.In the following discussion,we focus on these types of requests only.As we have already described,the DRAM access is initiated speculatively by the dispatch unit as soon as a request is selected and it can start long before the handler actually executes.Of course,at a later point,the directory lookup may reveal that the data is stale in memory,and the result of the speculative DRAM access may never be used.There are three parts in the life of a request after it is dispatched,namely,the DRAM occupancy or the DRAM access latencyðO mÞ,the protocol handler occupancyðO pÞ, and the memory channel occupancy or the transfer time of the cache line from DRAM to the memory controllerðO cÞ. Fig.2(scale used:O m¼6,O p¼4,O c¼3)shows the timing4IEEE TRANSACTIONS ON PARALLEL AND DISTRIBUTED SYSTEMS,VOL.18,NO.8,AUGUST2007Fig. 2.Timing diagram of the performance model for bank-parallelrequests.O m <O p ,even in the case of the slowest protocol processor that we consider.We show the timing of two requests scheduled back-to-back at the home node.Time increases on the x-axis from left to right.The starting time of the request i is Si .Here,we assume that S 1¼S 2,although,in practice,there may be a slight time gap due to scheduling delays.The time at which the DRAM access of the i th request finishes is Mi and the time at which the protocol handler for this request finishes is Oi .As soon as the DRAM access finishes,the cache line transfer can start if there is a free channel.We show timing diagrams for single-channel and dual-channel memory controllers.The finishing time of this transfer is denoted by Ci .The single protocol processor case is labeled 1PP while the dual protocol processor case is labeled 2PP.In the 1PP model,the handler for the second request cannot start until timestamp O 1,but the two DRAM accesses can start at the same time (e.g.,at S 1or S 2)as long as they do not suffer from bank conflicts.In Fig.2,we have assumed this to be the case.Bank conflicts are discussed later.Thus for a single-channel controller O 1ÀS 1¼O p ,M 1ÀS 1¼O m ,and C 1ÀM 1¼O c .Similar relations exist for the second request.The only difference is that for the 1PP model O 2ÀO 1¼O p ,since the second protocol handler cannot start until the first one finishes.It is clear that there is no gain in adding a second protocol processor because in both the 1PP and 2PP models the total time required by two requests is the same (i.e.,C 2ÀS 1).However,for the 1PP model in cases where O 2>C 2(this is not the case in the figure shown),the 2PP model will enjoy performance improvement because the total protocol processing latency in 1PP can no longer be hidden under the memory access and transfer latency.For single-channel memory controllers this condition can be restated as 2O p >O m þ2O c .In this situation the amount of time saved by the 2PP model would be 2O p ÀðO m þ2O c Þ.For a dual-channel architecture the equivalent condition is 2O p >O m þO c and the gain for the 2PP model would be 2O p ÀðO m þO c Þ.Requests typically arrive at the memory controller in bursts.Therefore,it would be useful to extend this model to a larger number of concurrent requests.Let us assume that at a certain point in time there are k independent requests for read or read-exclusive misses present at the home memory controller.All these k DRAM accesses can be scheduled at the same time as long as k does not exceed the maximum MRQ occupancy and the number of DRAM banks.In the 1PP model,the k coherence protocol handlers must execute sequentially.Therefore,if we want all the protocol processing to take longer than the DRAM accesses and the cache line transfers (this is the situation when 2PP can offer improvement),we must have kO p >O m þkO c for a single-channel architecture.In this situation the k requests spend a total time of kO p in the memory controller.With 2PP,we can execute the coherence protocol handlers in pairs and,therefore,the total time for k requests is max ðk 2O p ;O m þkO c Þ,which is less than kO p ifO p >1kO m þO c :ð1ÞNote that,for k ¼2,this bound is exactly as discussed above.Similarly,for a dual-channel architecture,we can derive the inequality kO p >O m þk 2O c or,equivalently,The amount by which O p actually exceeds the right-handside will be referred to as the occupancy margin .The occupancy margin gives us an indication about the overall gain to expect from adding a second protocol processing unit.Interestingly,as k becomes large (e.g.,in heavily banked memory systems with large MRQs running applications with high burstiness),the contribu-tion of DRAM occupancy to these inequalities diminishes.As a result,the usefulness of parallel coherence streams becomes constrained by the proper balance between protocol bandwidth (characterized by O p )and memory bandwidth (characterized by O c ).Further,observe that,if burstiness is low (i.e.,small k ),a large positive occupancy margin is unlikely and adding a second protocol processor would not be helpful.These inequalities also bring out the fact that,when adding extra memory bandwidth (or channels),the protocol processing band-width may become a bottleneck if the application actually uses the added memory bandwidth (the scaling factor of O c in (2)is the reciprocal of the total number of memory channels).Thus,this performance model offers a simple way to determine protocol bandwidth requirements.From a designer’s viewpoint,one can carry out simulations with single protocol processor,evaluate the average values of O p and O m and the maximum value of k (which captures the maximum burstiness),and find out if (1)or (2)holds (note that the value of O c is fixed by the channel bandwidth).Unless the appropriate condition holds,there would be no benefit of adding a second coherence controller.We will rely on (1)and (2)for analyzing our simulation results.We conclude the discussion of the model by commenting on cases where consecutive requests access the same DRAM bank,generating a bank conflict and delaying the second DRAM access.We note that,when a hot spot forms at the home node,this is possibly the most common case,since all requests will access the same cache line.Referring back to Fig.2,we find that in this case the second memory request cannot start until timestamp M 1(in practice,a little later due to bank turnaround time).In such a situation,M 2will always be greater than O 2for 1PP,since O m >O p on average.Further,we cannot start transferring the second cache line until the timestamp M 2.Thus,in this case,the memory latency and transfer latency hide the entire protocol proces-sing latency.Therefore,with bank-conflicting requests two protocol processors will not,in general,provide a visible performance improvement.However,in cases where the second request enjoys a row buffer hit,there may be some benefit if M 2<O 2ÀO c .But since on average O m >O p ,M 2is typically greater than O 2.In summary,for bank-parallel requests,having two protocol processors improves performance only if the average occupancy with a single protocol processor exceeds a certain limit determined by the average DRAM latency,memory bandwidth,and burstiness of the application.For applications with high burstiness,only the proper balance between the protocol and the memory bandwidth is important.On the other hand,for bank-conflicting requests,there is little or no benefit from adding a second protocol processor.4E VALUATION F RAMEWORKCHAUDHURI AND HEINRICH:INTEGRATED MEMORY CONTROLLERS WITH PARALLEL COHERENCE STREAMS 5。