Sharp interface limit of a phase-field model of crystal grains

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AK4495数据手册

2. Features
128x Over sampling Sampling Rate: 30kHz 768kHz 32-bit 8x Digital Filter - Ripple: 0.005dB, Attenuation: 100dB - Short Delay Sharp Roll-off, GD=6.25/fs - Short Delay Slow Roll-off, GD=5.3/fs - Sharp Roll-off - Slow Roll-off - Super Slow Roll-off High Tolerance to Clock Jitter Low Distortion Differential Output 2.8MHz, 5.6MHz DSD Input Support Digital De-emphasis for 32, 44.1, 48kHz sampling Soft Mute Digital Attenuator (255 levels and 0.5dB step) Mono Mode External Digital Filter Mode THD+N: -101dB DR, S/N: 123dB (Mono mode: 126dB, Analog Block Power Supply 7V) I/F Format: 24/32bit MSB justified, 16/20/24/32bit LSB justified, I2S, DSD Master Clock: 30kHz ~ 32kHz: 1152fs 30kHz ~ 54kHz: 512fs or 768fs 30kHz ~ 108kHz: 256fs or 384fs 108kHz ~ 216kHz: 128fs or 192fs ~ 384kHz: 64fs or 128fs ~ 768kHz: 64fs Power Supply: DVDD=AVDD=3.0 3.6V, VDD1/2=4.75 7.2V Digital Input Level: CMOS Package: 44pin LQFP

phase-field modeling

Phase field modelsFrom Wikipedia, the free encyclopediaJump to: navigation, searchA phase field model is a mathematical model for solving interfacial problems. It has mainly been applied to solidification dynamics,[1]but it has also been applied to other situations such as viscous fingering,[2]fracture dynamics, [3] vesicle dynamics,[4] etc.The method substitutes boundary conditions at the interface by a partial differential equation for the evolution of an auxiliary field (the phase field) that takes the role of an order parameter. This phase field takes two distinct values (for instance +1 and −1) in each of the phases, with a smooth change between both values in the zone around the interface, which is then diffuse with a finite width.A discrete location of the interface may be defined as the collection of all points where the phase field takes a certain value (e.g., 0).A phase field model is usually constructed in such a way that in the limit of an infinitesimal interface width (the so-called sharp interface limit) the correct interfacial dynamics are recovered. This approach permits to solve the problem by integrating a set of partial differential equations for the whole system, thus avoiding theexplicit treatment of the boundary conditions at the interface.Phase field models were first introduced by Fix[5] and Langer,[6] and have experienced a growing interest in solidification and other areas.Contents∙ 1 Equations of the Phase field modelo 1.1 Variational formulationso 1.2 Sharp interface limit of the Phase field equations∙ 2 Multi Phase Field Models∙ 3 Software∙ 4 Further reading∙ 5 References[edit] Equations of the Phase field modelPhase field models are usually constructed in order to reproduce a given interfacial dynamics. For instance, in solidification problems the front dynamics is given by a diffusion equation for either concentration or temperature in the bulk and some boundary conditions at the interface (a local equilibrium condition and a conservation law),[7] which constitutes the sharp interface model.A two phase microstructure and the order parameter φ profile is shown on a line across the domain. Gradual change of order parameter from one phase to another shows diffuse nature of the interface.A number of formulations of the phase field model are based on a free energy functional depending on an order parameter (the phase field) and a diffusive field (variational formulations). Equations of the model are then obtained by using general relations of Statistical Physics. Such a functional is constructed from physical considerations, but contains a parameter or combination of parameters related to the interface width. Parameters of the model are then chosen by studying the limit of the model with this width going to zero, in such a way that one can identify this limit with the intended sharp interface model.Other formulations start by writing directly the phase field equations, without referring to any thermodynamical functional (non-variational formulations). In this case the only reference is the sharp interface model, in the sense that it should be recovered when performing the small interface width limit of the phase field model.Phase field equations in principle reproduce the interfacial dynamics when the interface width is small compared with the smallest length scale in the problem. In solidification this scale is the capillary length d o, which is a microscopic scale. From a computational point of view integration of partial differential equations resolving such a small scale is prohibitive. However, Karma and Rappel introduced the thin interface limit,[8] which permitted to relax this condition and has opened the way to practical quantitative simulations with phase field models. With the increasing power of computers and the theoretical progress in phase field modelling, phase field models have become a useful tool for the numerical simulation of interfacial problems.[edit] Variational formulationsA model for a phase field can be constructed by physical arguments if one have an explicit expression for the free energy of the system. A simple example for solidification problems is the following:where φ is the phase field, u = e / e0 + h(φ) / 2, e is the local enthalpy per unit volume, h is a certain polynomial function of φ, and e0 = L2 / T M c p (where L is the latent heat, T M is the melting temperature, and c p is the specific heat). The term withcorresponds to the interfacial energy. The function f(φ) is usually taken as a double-well potential describing the free energy density of the bulk of each phase, which themselves correspond to the two minima of the function f(φ). The constants K and h0 have respectively dimensions of energy per unit length and energy per unitvolume. The interface width is then given by . The phase field model can then be obtained from the following variational relations:[9]where D is a diffusion coefficient for the variable e, and η andare stochastic terms accounting for thermal fluctuations (and whose statistical properties can be obtained from the fluctuation dissipation theorem). The first equation gives an equation for the evolution of the phase field, whereas the second one is a diffusion equation, which usually is rewritten for the temperature or for the concentration (in the case of an alloy). These equations are, scaling space with l and times with l2 / D:where is the nondimensional interface width, α = Dτ / W2h0,and , are nondimensionalized noises.[edit] Sharp interface limit of the Phase field equationsA phase field model can be constructed to purposely reproduce a given interfacial dynamics as represented by a sharp interface model. In such a case the sharp interface limit (i.e. the limit when the interface width goes to zero) of the proposed set of phase field equations should be performed. This limit is usually taken by asymptotic expansions of the fields of the model in powers of the interface width . These expansions are performed both in the interfacial region (inner expansion) and in the bulk (outer expansion), and then are asymptotically matched order by order. The result gives a partial differential equation for the diffusive field and a series of boundary conditions at the interface, which shouldcorrespond to the sharp interface model and whose comparison with it provides the values of the parameters of the phase field model.Whereas such expansions were in early phase field models performed up to the lower order in only, more recent models use higher order asymptotics (thin interface limits) in order to cancel undesired spureous effects or to include new physics in the model. For example, this technique has permitted to cancel kinetic effects,[8] to treat cases with unequal diffusivities in the phases,[10] to model viscous fingering[2] and two-phase Navier–Stokes flows,[11] to include fluctuations in the model,[12] etc.[edit] Multi Phase Field ModelsMultiple order parameters describe a polycrystalline material microstructure.In multi a phase field model microstructure is described by set of order parameters each one is related to a specific phase or crystallographic orientation. This model is mostly used for solid state phase transformations where multiple grains evolve (e.g. grain growth, recrystallization or first order transformation like austenite to ferrite in ferrous alloys.[edit] Software∙The Mesoscale Microstructure Simulation Project (MMSP) is a collection of c++ classes for grid-based microstructure simulation. ∙The Microstructure Evolution Simulation Software (MICRESS) is a multi-phase field simulation package developed at RWTH-Aachen.[edit] Further reading∙R. Gonzalez-Cinca et al., in Advances in Condensed Matter and Statistical Mechanics, ed. by E. Korucheva and R. Cuerno, NovaScience Publishers (2004) a review on phase field models.∙L-Q Chen, Annual Review of Materials Research, Vol. 32: 113-140 (2002) Phase field models in solidification∙N. Moelans, B. Blanpain, P.Wollants, Calphad, Vol. 32: 268-294 (2008) An introduction to phase-field modeling for microstructure evolution∙I. Steinbach:Phase-field models in Materials Science –Topical Review, Modelling Simul. Mater. Sci. Eng. 17 (2009)073001∙S.G.Fries, B.Böttger, J.Eiken,I.St einbach:Upgrading CALPHAD to microstructure simulation: the phase-field method, Int.J.Mat.Res100(2009)2∙R. Qin and H. K. D. H. Bhadeshia, a critical assessment of the phase field method, 2010, published in Materials Science andTechnology.[edit] References1.^WJ. Boettinger et al. Annual Review of Materials Research Vol. 32:163-194 (2002)2.^ a b R. Folch et al. Phys. Rev. E 60, 1734 - 1740 (1999)3.^ A. Karma et al. Phys. Rev. Lett. 87, 045501 (2001)4.^T. Biben et al. Phys. Rev. E 72, 041921 (2005)5.^ G.J. Fix, in Free Boundary Problems: Theory and Applications, Ed.A. Fasano and M. Primicerio, p. 580, Pitman (Boston, 1983).6.^ J.S. Langer, Models of pattern formation in ﬁrst–order phasetransitions, in Directions in Condensed Matter Physics p. 165, Ed. G.Grinstein and G. Mazenko, World Scientiﬁc, Singapore, (1986).7.^J.S. Langer, Rev. Mod. Phys. 52, 1 (1980)8.^ a b A. Karma and W.J. Rappel Phys. Rev. E 57, 4323 - 4349 (1998)9.^P.C. Hohenberg and B.I. Halperin, Rev. Mod. Phys. 49, 435 (1977)10.^G. B. McFadden et al., Physica D 144, 154-168 (2000)11.^ D. Jacqmin, J. Comput. Phys. 155,96-127 (1999)12.^R. Benítez and L. Ramírez-Piscina Phys. Rev. E 71, 061603 (2005)。

相场法数值模拟

四、相场方程 (phase-field equations)
Ginzburg-Landau 方程 f 0 k (r , t ) F Lk k k Lk t k (r , t ) k
Cahn-Hilliard 方程
2、凝固-单相场变量
ϵ 2 * 2 F f 0 ( xB , , T ) (xB ) ( ) dr V 2 2
等温凝固，假设摩尔体积不变，即组成梯度项不考虑 ϵ则=0
均质自由能密度
f 0 ( xB , , T * ) f p ( xB , , T * ) g ( )
图1（a）性能不连续
（b）性能连续
N. Moelans, B. Blanpain , P. Wollants, "An introduction to phase-field modeling of microstructure evolution", CALPHAD -Computer Coupling of Phase Diagrams and Thermochemistry, 32, 268-294, 2008
相场量(phase-fields)
两相
多相
p相，相应的变量 k 在系统中任一点 r
1表示在固相中 0表示在液相中 0 1在固液界面

k 1
p
k
1，k 0, k
三、热力学势函数 (thermodynamic energy functional)
经典热力学
F ( xB ,k ) f 0 ( xB ,k ) 1 xB (r , t ) M M xB (r , t ) Vm t xB (r , t ) xB

电能表专业术语中英文对照定稿版

电能表专业术语中英文对照精编W O R D版 IBM system office room 【A0816H-A0912AAAHH-GX8Q8-GNTHHJ8】电能表专业术语中英文对照有功电度表——watt-hour meter静止式有功电度表——static watt-hour meter 多费率电度表——multi-rate meter仪表型式——meter type测量器件——measuring element测试输出——test output工作指示器——operation indicator贮存器——memory非易失贮存器——non-volatile memory显示器——display计度器——register电流线路——current circuit电压线路——voltage circuit辅助线路——auxiliary circuit常数——constant室内仪表——indoor meter室外仪表——outdoor meter表底——base插座——socket表盖——meter cover表壳——meter case可触及导电部件——accessible conductive part保护接地端——protective earth terminal端子座——terminal block端子盖——terminal cover间隙——clearance爬电距离——creepage distance基本绝缘——basic insulation附加绝缘——supplementary insulation双重绝缘——double insulation加强绝缘——reinforced insulationI类防护绝缘包封仪表——insulating encased meter of protective class I II类防护绝缘包封仪表——insulating encased meter of protective class II 参比电流——reference current基本电流*（Ib)——basic current （Ib)额定电流*（In)——rated current （In)最大电流*（Imax)——maximum current （Imax)参比电压*（Un)——reference voltage（Un)参比频率——reference frequency等级指数——class index百分数误差——percentage error影响量——influence quantity参比条件——reference conditions由影响量引起的误差改变量——variation of error due to an influence quantity 畸变因数——distortion factor电磁骚扰——electromagnetic disturbance参比温度——reference temperature平均温度系数——mean temperature coefficient额定工作条件——rated operating conditions规定的测量范围——specified measuring range规定的工作范围——specified operating range极限工作范围——limit range of operation贮存和运输条件——storage and transport conditions正常工作位置——normal working position热稳定性——thermal stability型式试验——type test电度表型号——meter type标准表——reference meter无功功率（乏）——reactive power(var)无功电能（乏一小时）——reactive energy(var-hour)单相电路中无功电能——reactive energy in a single-phase circuit 三相电路中无功电能——reactive energy in a three-phase circuit无功电度表——var-hour meter静止式无功电度表——static var-hour meter多费率仪表——multi-rate meter无功功率的方向和符号——directions and sign of reactive power测量元件——measuring element输出装置——output devices感应式仪表——induction meter仪表转子——meter rotor仪表驱动元件——meter driving element仪表制动元件——meter braking element仪表计度器（计数机构）——register of a meter(counting mechanism) 仪表底座——meter base仪表插座——meter socket仪表基架——meter frame接线端座——terminal block接线端盖——terminal cover基本转速——basic speed基本转矩——basic torque仪表常数——meter constant绝缘——insulation型式——type型式检验——type test型式验证程序——type approval procedure鉴定程序——qualification procedure影响量或影响因数——influence quantity or factor 垂直工作位置——vertical working position等级指数——class index测量单元——measuring unit数据处理单元——data processing unit多功能电能表——multifunction watthour meter需要周期——demand interval最大需量——maximum demand滑差时间——sliding window time尖、峰、谷、平时段——（sharp、peak、shoulder、off—peak time consumption）额定最大脉冲频率——rated maximum impulse frequency最大需量复零装置——maximum demand reset zero unit辅助电源——auxiliary supply电磁骚扰——electromagnetic disturbance产品——item修理的产品——repaired item不修理的产品——non-repaired item服务——service规定功能——required function时刻——instant of time时间区间——time interval持续时间——time duration累积时间——accumulated time量度——measure工作——operation修改——modification(of an item)效能——effectiveness固有能力——capability耐久性——durability可靠性——reliability维修性——maintainability维修保障性——maintenance support performance可用性——availability可信性——dependability失效——failure致命失效——critical failure非致命失效——non-critical failure误用失效——misuse failure误操作失效——mishandling failure弱质失效——weakness failure设计失效——design failure制造失效——manufacturing failure老化失效；耗损失效——ageing failure；wearout failure 突然失效——sudden failure渐变失效；漂移失效——gradual failure；drift failure 灾变失效——cataleptic failure关联失效——relevant failure非关联失效——non-relevant failure独立失效——primary failure从属失效——secondary failure失效原因——failure cause失效机理——failure mechanism系统性失效；重复性失效——systematic failure；reproducible failure 完全失效——complete failure退化失效——degradation failure部分失效——partial failure故障——fault致命故障——critical fault非致命故障——non-critical fault重要故障——major fault次要故障——minor fault误用故障——minor fault误操作故障——mishandling fault弱质故障——weakness fault设计故障——design fault制造故障——manufacturing fault老化故障；耗损故障——ageing fault；wearout fault程序－敏感故障——programme-sensitive fault数据－敏感故障——data-sensitive fault完全故障；功能阻碍故障——complete fault；function-preventing fault 部分故障——partial fault持久故障——persistent fault间歇故障——intermittent fault确定性故障——determinate fault非确定性故障——indeterminate fault潜在故障——latent fault系统性故障——systematic fault故障模式——fault mode故障产品——faulty item差错——error失误——mistake工作状态——operating state不工作状态——non-operating state待命状态——standby state闲置状态；空闲状态——idle state；free state不能工作状态——disable state；outage处因不能工作状态——external disabled state不可用状态；内因不能工作状态——down state；internal disabled state可用状态——up state忙碌状态——busy state致使状态——critical state维修——maintenance维修准则——maintenance philosophy维修方针——maintenance policy维修作业线——maintenance echelon；line of maintenance维修约定级——indenture level(for maintenance)维修等级——level of maintenance预防性维修——preventive maintenance修复性维修——corrective maintenance受控维修——controlled maintenance计划性维修——scheduled maintenance非计划性维修——unscheduled maintenance现场维修——on-site maintenance；in sits maintenance；field maintenance非现场维修——off-site maintenance遥控维修——remote maintenance自动维修——automatic maintenance逾期维修——deferred maintenance基本的维修作业——elementary maintenance activity 维修工作——maintenance action；maintenance task修理——repair故障识别——fault recognition故障定位——fault localization故障诊断——fault diagnosis故障修复——fault correction功能核查——function check-out恢复——restoration；recovery监测——supervision；monitoring维修的实体——maintenance entity影响功能的维修——function-affecting maintenance妨碍功能的维修——function-preventing maintenance 减弱功能的维修——function-degreding maintenance不影响功能的维修——function-permitting maintenance维修时间——maintenance time维修人时——MMH maintenance man-hours实际维修时间——active maintenance time预防性维修时间——preventive maintenance time修复性维修时间——corrective maintenance time实际的预防性维修时间——active preventive maintenance time 实际的修复性维修时间——active corrective maintenance time 未检出故障时间——undetected fault time管理延迟（对于修复性维修）——administrative delay后勤延迟——logistic delay故障修复时间——fault correction time技术延迟——technical delay核查时间——check－out time故障诊断时间——fault diagnosis time故障定位时间——fault localization time修理时间——repair time工作时间——operating time不工作时间——non—operating time需求时间——required time无需求时间——non-required time待命时间——stand-by time闲置时间——idle time；free time不能工作时间——disabled time不可用时间——down time累积不可用时间——accumulated down time外因不能工作时间——external disabled time；external loss time 可用时间——up time首次失效前时间——time to first failure失效前时间——time to failure失效间隔时间——time between failures失效间工作时间——operating time between failures恢复前时间——time to restoration；time to recovery使用寿命——useful life早期失效期——early failure period恒定失效密度期——constant failure intensity period恒定失效率期——constant failure rate period耗损失效期——wear－out failure period瞬时可用度——A(t) instantaneous availability瞬时不可用度——U(t) instantaneous unavailability平均可用度——A(t1,t2)mean availability平均不可用度——U(t1，t2)mean unavailability渐近可用度——A asymptotic availability稳态可用度——steady－state availability渐近下可用度——U asymptotic unavailability稳态不可用度——steady-state unavailability渐近平均可用度——Aasymptotic mean availability渐近平均不可用度——U asymptotic mean unavailability 平均可用时间——MUT mean up time平均累积不可用时间——MADT mean accumulated down time 可靠度——R(t1，t2)reliability瞬时失效率——λ(t)instantaneous failure rate平均失效率——λ(t1,t2)mean failure rate瞬时失效密度——Z(t) instantaneous failure intensity 平均失效密度——Z(tl，t2) mean failure intensity平均首次失效前时间——MTTFF mean time to first failure 平均失效前时间——MTTF mean time to failure平均失效间隔时间——MTBF mean time between failures平均失效间工作时间——MTBF mean operating time between failures 失效率加速系数——failure rate acceleration factor失效密度加速系数——failure intensity acceleration factor维修度——maintainability瞬时修复率——μ(t)instantaneous repair rate平均修复率——μ(t1，t2)mean repair rate平均维修人时——mean maintenance man-hours平均不可用时间——MDT mean down time平均修理时间——MRT mean repair timeP—分位修理时间——p—fractile repair time平均实际修复性维修时间——mean active corrective maintenance time 平均恢复前时间——MTTRmean time to restoration故障识别比——fault coverage修复比——repair coverage平均管理延迟——MAD mean administrative delayp—分位管理延迟——p-fractile administrative delay平均后勤延迟——MLD mean logistic delayP—分位后勤延迟——P—fractile logistic delay试验——test验证试验——compliance test测定试验——determination test实验室试验——laboratory test现场试验——field test耐久性试验——endurance test?加速试验——accelerated test步进应力试验——step stress test筛选试验——screening test时间加速系数——time acceleration factor维修性检验——maintainability verfication 维修性验证——maintainability demonstration 观测数据——observed data试验数据——test data现场数据——field data基准数据——reference data冗余——redundancy工作冗余——active redundancy备用冗余——standby redundancy失效安全——fail safe故障裕度——fault tolerance故障掩盖——fault masking预计——prediction可靠性模型——reliability model可靠性预计——reliability prediction可靠性分配——reliability allocation；reliability apportionment故障模式与影响分析——FMEA fault modes and effects analysis故障模式、影响与危害度分析——FMECA fault modes，effects and criticality analysis故障树分析——FTA fault tree analysis应力分析——stress analysis可靠性框图——reliability block diagram故障树——fault tree状态转移图——state-transition diagram应力模式——stress madel?故障分析——fault analysis失效分析——failure analysis维修性模型——maintainability model维修性预计——maintainability prediction维修树——maintenance tree维修性分配——maintainability allocation；maintainability apportionment 老练——burn in可靠性增长——reliability growth可靠性改进——reliability improvement可靠性和维修性管理——reliability and maintainability management可靠性和维修性保证——reliability and maintainability assurance可靠性和维修性控制——reliability and maintainability control可靠性和维修性大纲——reliability and maintainability programme可靠性和维修性计划——reliability and maintainability plan可靠性和维修性审计——reliability and maintainability audit可靠性和维修性监察——reliability and maintainability surveillance设计评审——design review真实的…——true…预计的…——predicted…外推的…——extrapolated…估计的…——estimated…固有的…——intrinsic…；inherent…使用的…——operational…平均的…——mean…P-分位…——P-fratile…瞬时的…——instantaneous… 稳态的…——steady state。

尼康显微镜 E200 说明书

The CFI60 optical systemcombines Nikon'srenowned CF opticaldesign with infinityoptics to overcome thelimitations of thetraditional infinitydesign. CFI60 opticsprovide longer working distances and higher N.A.'s.These new optics deliver startlingly clear images atany magnification because chromatic aberrations andcurvature of field are both corrected over the entirefield of view when the field number is 20mm. Nikondeveloped new dedicated CFI E Plan Achromatobjectives exclusively for the E200. Also, you can useother higher-grade objectives available for the Eclipseseries whenever your laboratory situation calls for it.Anti-mold designMold is a formidable enemy of microscopes. Before you know it, it can begingrowing on the interior optical surfaces of the microscope and ruinperformance. Using anti-mold paint, plus anti-mold agent sealed at criticalplaces inside the microscope, the Eclipse E200 is designed to resist moldgrowth. In tests, an anti-mold treated unit was able to resist the growth ofmold for three consecutive years at an average temperature of 30°C (86°F)and 80% humidity.Ergonomic designequals comfortableoperationComfort is ensured allowing longhours of use, thanks to Nikon’sthoughtful ergonomic design. This isthe same design incorporated intoNikon’s other laboratory and research-grade Eclipse seriesmicroscopes.For example, the focus knob and the stage handle are locatedequidistant from the operator, permitting one-handed operation in anatural posture without twisting the shoulders. Because these controlsare low positioned, you can operate the microscope while resting yourarms comfortably on the desk. Moreover, the low-profile stage makesexchange of specimen slides easy, while the low inclination angleeyepiece tube provides comfortable viewing.Ergonomic binocular tubeWith this option, users can adjust not only the eyepiecetube tilt angle, but the eyepiece length to suit their build,eliminating discomfort and strain during long hours ofobservation.* Use of this accessory in combination with other equipment mayproduce darker images around the periphery.* Must be attached directly to the main body.One-piece construction from arm to base, a stage designwhere its up/down mechanism is located in the base, plusa wide footprint of 188.5mm across the back all providegreater rigidity and resistance to vibrations, contributing tosuperior images.optical systemImprovedEye-level riserUp to two eye-level risers can be mounted to raise the height of the eyepoint—25mm eachfor a total of 50mm.Robust, vibration resistant constructionfocus control knobTilt angle is adjustable 8˚–32˚.Eyepiece length is adjustable±15mm.E200 configured with anergonomic binocular tubeRevolving nosepiece A reversed-type nosepiece creates more space at the front of the stage, making handling of specimen slides fast and easy. In addition, the CFI60 optical design eliminates extra optical elements in the nosepiece for enhanced image sharpness. Another advantage of CFI60 objectives is that their increased objective lengths and longer working distances provide more working space around the nosepiece.Refocusing stage Nikon has created a unique innovation. The Refocusing Stage eliminates the need to refocus the image manually, making specimen handling safer and easier. In this unique design, the stage can be instantly dropped by pushing it down to exchange specimens or oil the slide, then returns to the original position as soon as the hand is removed. The wide stage surface can accommodate two slide glasses at the same time.In addition, this stage has an array of features including:– Increased resistance to vibrations due to the design of the in-base focus mechanism.– Low-profile design that creates more space around the objective for increased freedom in specimen handling and easier operation.– A belt-drive mechanism to eliminate the projection of the rack at the edge of the stage for better ergonomics and smoother movement.– Removable specimen holder for fast hand scanning of slides.– Improved XY cross travel, providing the comfort and feel similar to Nikon’s higher grade Eclipse series microscopes.Upper limit stopper When using short-working-distance objectives such as 40X or greater, you can set the upper limit of the stage movement, so that the objective doesn’t hit the specimen slide, protecting both from damage. Thanks to this feature,even novices or operators who need to change slides often can perform their job easily and quickly. The limit height can be set in two levels using a stopper bolt—either at the standard position or 2mm lower. This feature isvery useful except when extraordinarily thick specimens are used.New New Eyepiece tubeThe Siedentopf-typeeyepiece tube is inclined at30 degrees to ensurecomfortable viewing in anatural posture. Designedfor use by operators withdifferent builds, thiseyepiece tube has a narrowminimum interpupillarydistance of 47mm, whilethe eyepoint height can beraised 34mm wheninterpupillary distance is64mm by simply swingingthe front part of theeyepiece tube up 180˚. For extremely tall users, eye-level risers are available tocustomize the microscope.EyepiecesThe E200’s new eyepieces feature a wider field of view for amicroscope of this class and are available in 10X (F.O.V. 20) and 15X(F.O.V. 12) types. These eyepieces also feature built-in diopteradjustment that allows the operator to adjust diopters separately forthe right and left easily. In addition, these eyepieces acceptmeasuring reticles that will always be in sharp focus with thespecimen. Moreover, they can be locked, preventing theft andeliminating the possibility of damage during transit.CFI60 objectivesNikon’s exclusive CFI60 objectives provide numerous benefits: longerworking distances, high numerical apertures, flat images over the entirefield of view with virtually no curvature of field when the field number is20mm. To match your laboratory requirements, the E200 provides a wideselection of objectives to choose from. These include the new CFI E PlanAchromat objectives developed for the E200 or other higher-gradeEclipse series objectives.ImprovedCFI E Plan Achromat objectivesLow position High positionE2-TB binocular tube E2-TF trinocular tube* Eyepiece lens is optional.F.O.V. 18 (conventional model)F.O.V. 20 (E200)Wide stage surface with no rack sticking outof the stageCondenserAlthough the stage is low-positioned for comfort, there is ample space around the condenser for easy access. The condenser also features an aperture diaphragm that comes complete with position guide markings for respective objectives to make operation quick and easy. Another plus is that virtually all Eclipse series condensers can be used, except the universal type.Replacing the lamp is safe and easyTurning the microscope upside down to replace the lamp is no longer necessary. Simply open the lens unit cover to make replacement.Model with field diaphragm available.A model with a built-in field diaphragm allows the use of Koehlerillumination. It features:– A field lens unit with a field diaphragm that has position-guide markings forrespective objectives.– Easy and safe lamp replacementprocedure.ImprovedWide variety of condensers Abbe, Phase, and other Eclipse series condensers, except the universal type, can be used with the E200.Phase contrast Simple phase contrast observation at 10X,20X and 40X is possible with a single phase annulus slider. The aperture diaphragm automatically opens when the slider is inserted into the condenser. Phase contrast 100X slider and darkfield slider up to 40X objectives are available as options.Epi-fluorescence The E200-dedicated epi-fluorescence attachment is available for users who want to begin fluorescence observation. Although affordably priced, this attachment allows comprehensive epi-fluorescence as well as UV excitation observations.Simple polarizing This method is ideal for observing amyloid and crystals.To set up, install the polarizer over the field lens and the analyzer—available in ring (Set C) or intermediate (Set A) types.Field diaphragm with position-guidemarkings.E200-FE2 Abbe condenser (left) and E2 phase condenser Simple polarizing set A Simple polarizing set C CFI Achromat DL objectives for phase contrast Filters are optional.Ergonomic binocular tube Drawing tubeAllows accuratesketching of theimage beingobserved.Eye-level riserTwo risers can be inserted toincrease the eyepoint height—25mm per riser for a total of 50mm.Teaching heads Face-to-face* and side-by-side teaching heads are available.* Not recommended for use in conjunction with a photomicrographic system, because it makes the microscope top-heavy.Object markerAllows the point of interest within a specimento be marked with ink.Photomicrographic systemThe FX-III series H-III photomicrographic system can be mounted to the trinoculareyepiece tube. With abuilt-in control box anda reduced number ofswitches, this system issimpler to operate than ever before.Auto exposure, 1%spot, and 35% integratedaverage metering areprovided.Quick setupAll components in the basic set, with the exception of theeyepiece tube, are attached to the main body for quick setup and use. All you need to do is adjust the eyepiece tube.ImprovedBoth eyepiece length and tilt angle are adjustable.411.4 (E y e p o i n t h e i g h t w h e n P D i s 64m m .)191.3315407.4 (M i n i m u m m i c r o s c o p e h e i g h t )414.6 (W h e n P D i s 64m m .)105188.5247.7206.4226.8101.5381.7 (W h e n P D i s 64m m .)Unit : mmOptical systemCFI60 (infinity optical system)Parfocal distance: 60mm Magnification40–1500X for observation 8–500X for 35mm photomicrography Eyepiece tube E2-TB Binocular tube, E2-TF Trinocular tubeSiedentopf type (Inclination: 30°, Interpupillarydistance: 47-75 mm, 360°rotatable)As an option, all E600/E400 tubes can be used.Eyepiece CFI E 10X (F.O.V.: 20mm), CFI E 15X (F.O.V.:12mm)Photo lens PLI projection lens: 2X, 2.5X, 4X, 5XNosepiece Quadruple nosepiece, reversed typeCoarse/fine Fine: 0.2mm per rotation, Coarse: 37.7mm perfocusing rotation, Minimum reading: 2 microns on left-side fine control knob, Coarse motion torqueadjustable, Refocusing system incorporated instage, Stage handle and focusing knob are atequal distance from the operatorStage Rectangular 216 x 150 mm surface stage mountedon the main body. Cross travel 78 x 54 mm usinglow-positioned X/Y coaxial control knobObjectivesCFI E Plan Achromat 4X N.A. 0.10 (F.O.V. 20)CFI E Plan Achromat 10X N.A. 0.25 (F.O.V. 20)CFI E Plan Achromat 40X N.A. 0.65 (F.O.V. 20)CFI E Plan Achromat 100X Oil N.A. 1.25(F.O.V. 20)As an option, CFI Achromat DL and other higher-grade CFI60 objectives can be used Condenser E2 Abbe condenser N.A. 1.25; leaf-type aperture diaphragm with position guide markings for respective CFI E Plan objectives Optional condensers: E2 Phase condenser N.A. 1.25; leaf-type aperture diaphragm with position guide markings for respective CFI Achromat DL objectives Other E600/E400 condensers except Universal Turret condenser (for the model without field diaphragm)Illumination system 6V-20W halogen bulb (6V-30W halogen bulb optional)Intermediate E200 epi-fluorescence attachment, Teaching attachment *head (face-to-face and side-by-side types), Drawing tube, Eye level riser *Maximum intermediate space 50mm WARNING TO ENSURE CORRECT USAGE, READ THE CORRESPONDING MANUALS CAREFULLYBEFORE USING YOUR EQUIPMENT.Specifications and equipment are subject to change without any notice or obligation on the part of the manufacturer. March 2005.©2000-05 NIKON CORPORATIONNIKON CORPORATION /NIKON INSTECH CO., LTD.Parale Mitsui Bldg.,8, Higashida-cho, Kawasaki-ku,Kawasaki, Kanagawa 210-0005, Japanphone: +81-44-223-2167 fax: +81-44-223-2182www.nikon-instruments.jp/eng/NIKON INSTRUMENTS(SHANGHAI) CO., LTD.CHINA phone: +86-021-5836-0050 fax: +86-021-5836-0030(Beijing office)CHINA phone: +86-10-5869-2255 fax: +86-10-5869-2277NIKON SINGAPORE PTE LTDSINGAPORE phone: +65-6559-3618 fax: +65-6559-3668NIKON MALAYSIA SDN. BHD.MALAYSIA phone: +60-3-78763887 fax: +60-3-78763387NIKON INSTRUMENTS EUROPE B.V.P.O. Box 222, 1170 AE Badhoevedorp, The Netherlands phone: +31-20-44-96-222 fax: +/NIKON FRANCE S.A.S.FRANCE phone: +33-1-45-16-45-16 fax: +33-1-45-16-00-33NIKON GMBH GERMANY phone: +49-211-9414-0 fax: +49-211-9414-322NIKON INSTRUMENTS S.p.A.ITALY phone: + 39-55-3009601 fax: + 39-55-300993NIKON AG SWITZERLAND phone: +41-43-277-2860 fax: +41-43-277-2861NIKON UK LTD. UNITED KINGDOM phone: +44-20-8541-4440 fax: +44-20-8541-4584NIKON INSTRUMENTS INC.1300 Walt Whitman Road, Melville, N.Y. 11747-3064, U.S.A.phone: +1-631-547-8500; +1-800-52-NIKON (within the U.S.A.only) fax: +/NIKON CANADA INC.CANADA phone: +1-905-625-9910 fax: +1-905-625-0103。

Indradrive 系列故障代码

Error MessagesF9001 Error internal function call.F9002 Error internal RTOS function callF9003 WatchdogF9004 Hardware trapF8000 Fatal hardware errorF8010 Autom. commutation: Max. motion range when moving back F8011 Commutation offset could not be determinedF8012 Autom. commutation: Max. motion rangeF8013 Automatic commutation: Current too lowF8014 Automatic commutation: OvercurrentF8015 Automatic commutation: TimeoutF8016 Automatic commutation: Iteration without resultF8017 Automatic commutation: Incorrect commutation adjustment F8018 Device overtemperature shutdownF8022 Enc. 1: Enc. signals incorr. (can be cleared in ph. 2) F8023 Error mechanical link of encoder or motor connectionF8025 Overvoltage in power sectionF8027 Safe torque off while drive enabledF8028 Overcurrent in power sectionF8030 Safe stop 1 while drive enabledF8042 Encoder 2 error: Signal amplitude incorrectF8057 Device overload shutdownF8060 Overcurrent in power sectionF8064 Interruption of motor phaseF8067 Synchronization PWM-Timer wrongF8069 +/-15Volt DC errorF8070 +24Volt DC errorF8076 Error in error angle loopF8078 Speed loop error.F8079 Velocity limit value exceededF8091 Power section defectiveF8100 Error when initializing the parameter handlingF8102 Error when initializing power sectionF8118 Invalid power section/firmware combinationF8120 Invalid control section/firmware combinationF8122 Control section defectiveF8129 Incorrect optional module firmwareF8130 Firmware of option 2 of safety technology defectiveF8133 Error when checking interrupting circuitsF8134 SBS: Fatal errorF8135 SMD: Velocity exceededF8140 Fatal CCD error.F8201 Safety command for basic initialization incorrectF8203 Safety technology configuration parameter invalidF8813 Connection error mains chokeF8830 Power section errorF8838 Overcurrent external braking resistorF7010 Safely-limited increment exceededF7011 Safely-monitored position, exceeded in pos. DirectionF7012 Safely-monitored position, exceeded in neg. DirectionF7013 Safely-limited speed exceededF7020 Safe maximum speed exceededF7021 Safely-limited position exceededF7030 Position window Safe stop 2 exceededF7031 Incorrect direction of motionF7040 Validation error parameterized - effective thresholdF7041 Actual position value validation errorF7042 Validation error of safe operation modeF7043 Error of output stage interlockF7050 Time for stopping process exceeded8.3.15 F7051 Safely-monitored deceleration exceeded (159)8.4 Travel Range Errors (F6xxx) (161)8.4.1 Behavior in the Case of Travel Range Errors (161)8.4.2 F6010 PLC Runtime Error (162)8.4.3 F6024 Maximum braking time exceeded (163)8.4.4 F6028 Position limit value exceeded (overflow) (164)8.4.5 F6029 Positive position limit exceeded (164)8.4.6 F6030 Negative position limit exceeded (165)8.4.7 F6034 Emergency-Stop (166)8.4.8 F6042 Both travel range limit switches activated (167)8.4.9 F6043 Positive travel range limit switch activated (167)8.4.10 F6044 Negative travel range limit switch activated (168)8.4.11 F6140 CCD slave error (emergency halt) (169)8.5 Interface Errors (F4xxx) (169)8.5.1 Behavior in the Case of Interface Errors (169)8.5.2 F4001 Sync telegram failure (170)8.5.3 F4002 RTD telegram failure (171)8.5.4 F4003 Invalid communication phase shutdown (172)8.5.5 F4004 Error during phase progression (172)8.5.6 F4005 Error during phase regression (173)8.5.7 F4006 Phase switching without ready signal (173)8.5.8 F4009 Bus failure (173)8.5.9 F4012 Incorrect I/O length (175)8.5.10 F4016 PLC double real-time channel failure (176)8.5.11 F4017 S-III: Incorrect sequence during phase switch (176)8.5.12 F4034 Emergency-Stop (177)8.5.13 F4140 CCD communication error (178)8.6 Non-Fatal Safety Technology Errors (F3xxx) (178)8.6.1 Behavior in the Case of Non-Fatal Safety Technology Errors (178)8.6.2 F3111 Refer. missing when selecting safety related end pos (179)8.6.3 F3112 Safe reference missing (179)8.6.4 F3115 Brake check time interval exceeded (181)Troubleshooting Guide | Rexroth IndraDrive Electric Drivesand ControlsI Bosch Rexroth AG VII/XXIITable of ContentsPage8.6.5 F3116 Nominal load torque of holding system exceeded (182)8.6.6 F3117 Actual position values validation error (182)8.6.7 F3122 SBS: System error (183)8.6.8 F3123 SBS: Brake check missing (184)8.6.9 F3130 Error when checking input signals (185)8.6.10 F3131 Error when checking acknowledgment signal (185)8.6.11 F3132 Error when checking diagnostic output signal (186)8.6.12 F3133 Error when checking interrupting circuits (187)8.6.13 F3134 Dynamization time interval incorrect (188)8.6.14 F3135 Dynamization pulse width incorrect (189)8.6.15 F3140 Safety parameters validation error (192)8.6.16 F3141 Selection validation error (192)8.6.17 F3142 Activation time of enabling control exceeded (193)8.6.18 F3143 Safety command for clearing errors incorrect (194)8.6.19 F3144 Incorrect safety configuration (195)8.6.20 F3145 Error when unlocking the safety door (196)8.6.21 F3146 System error channel 2 (197)8.6.22 F3147 System error channel 1 (198)8.6.23 F3150 Safety command for system start incorrect (199)8.6.24 F3151 Safety command for system halt incorrect (200)8.6.25 F3152 Incorrect backup of safety technology data (201)8.6.26 F3160 Communication error of safe communication (202)8.7 Non-Fatal Errors (F2xxx) (202)8.7.1 Behavior in the Case of Non-Fatal Errors (202)8.7.2 F2002 Encoder assignment not allowed for synchronization (203)8.7.3 F2003 Motion step skipped (203)8.7.4 F2004 Error in MotionProfile (204)8.7.5 F2005 Cam table invalid (205)8.7.6 F2006 MMC was removed (206)8.7.7 F2007 Switching to non-initialized operation mode (206)8.7.8 F2008 RL The motor type has changed (207)8.7.9 F2009 PL Load parameter default values (208)8.7.10 F2010 Error when initializing digital I/O (-> S-0-0423) (209)8.7.11 F2011 PLC - Error no. 1 (210)8.7.12 F2012 PLC - Error no. 2 (210)8.7.13 F2013 PLC - Error no. 3 (211)8.7.14 F2014 PLC - Error no. 4 (211)8.7.15 F2018 Device overtemperature shutdown (211)8.7.16 F2019 Motor overtemperature shutdown (212)8.7.17 F2021 Motor temperature monitor defective (213)8.7.18 F2022 Device temperature monitor defective (214)8.7.19 F2025 Drive not ready for control (214)8.7.20 F2026 Undervoltage in power section (215)8.7.21 F2027 Excessive oscillation in DC bus (216)8.7.22 F2028 Excessive deviation (216)8.7.23 F2031 Encoder 1 error: Signal amplitude incorrect (217)VIII/XXII Bosch Rexroth AG | Electric Drivesand ControlsRexroth IndraDrive | Troubleshooting GuideTable of ContentsPage8.7.24 F2032 Validation error during commutation fine adjustment (217)8.7.25 F2033 External power supply X10 error (218)8.7.26 F2036 Excessive position feedback difference (219)8.7.27 F2037 Excessive position command difference (220)8.7.28 F2039 Maximum acceleration exceeded (220)8.7.29 F2040 Device overtemperature 2 shutdown (221)8.7.30 F2042 Encoder 2: Encoder signals incorrect (222)8.7.31 F2043 Measuring encoder: Encoder signals incorrect (222)8.7.32 F2044 External power supply X15 error (223)8.7.33 F2048 Low battery voltage (224)8.7.34 F2050 Overflow of target position preset memory (225)8.7.35 F2051 No sequential block in target position preset memory (225)8.7.36 F2053 Incr. encoder emulator: Pulse frequency too high (226)8.7.37 F2054 Incr. encoder emulator: Hardware error (226)8.7.38 F2055 External power supply dig. I/O error (227)8.7.39 F2057 Target position out of travel range (227)8.7.40 F2058 Internal overflow by positioning input (228)8.7.41 F2059 Incorrect command value direction when positioning (229)8.7.42 F2063 Internal overflow master axis generator (230)8.7.43 F2064 Incorrect cmd value direction master axis generator (230)8.7.44 F2067 Synchronization to master communication incorrect (231)8.7.45 F2068 Brake error (231)8.7.46 F2069 Error when releasing the motor holding brake (232)8.7.47 F2074 Actual pos. value 1 outside absolute encoder window (232)8.7.48 F2075 Actual pos. value 2 outside absolute encoder window (233)8.7.49 F2076 Actual pos. value 3 outside absolute encoder window (234)8.7.50 F2077 Current measurement trim wrong (235)8.7.51 F2086 Error supply module (236)8.7.52 F2087 Module group communication error (236)8.7.53 F2100 Incorrect access to command value memory (237)8.7.54 F2101 It was impossible to address MMC (237)8.7.55 F2102 It was impossible to address I2C memory (238)8.7.56 F2103 It was impossible to address EnDat memory (238)8.7.57 F2104 Commutation offset invalid (239)8.7.58 F2105 It was impossible to address Hiperface memory (239)8.7.59 F2110 Error in non-cyclical data communic. of power section (240)8.7.60 F2120 MMC: Defective or missing, replace (240)8.7.61 F2121 MMC: Incorrect data or file, create correctly (241)8.7.62 F2122 MMC: Incorrect IBF file, correct it (241)8.7.63 F2123 Retain data backup impossible (242)8.7.64 F2124 MMC: Saving too slowly, replace (243)8.7.65 F2130 Error comfort control panel (243)8.7.66 F2140 CCD slave error (243)8.7.67 F2150 MLD motion function block error (244)8.7.68 F2174 Loss of motor encoder reference (244)8.7.69 F2175 Loss of optional encoder reference (245)Troubleshooting Guide | Rexroth IndraDrive Electric Drivesand Controls| Bosch Rexroth AG IX/XXIITable of ContentsPage8.7.70 F2176 Loss of measuring encoder reference (246)8.7.71 F2177 Modulo limitation error of motor encoder (246)8.7.72 F2178 Modulo limitation error of optional encoder (247)8.7.73 F2179 Modulo limitation error of measuring encoder (247)8.7.74 F2190 Incorrect Ethernet configuration (248)8.7.75 F2260 Command current limit shutoff (249)8.7.76 F2270 Analog input 1 or 2, wire break (249)8.7.77 F2802 PLL is not synchronized (250)8.7.78 F2814 Undervoltage in mains (250)8.7.79 F2815 Overvoltage in mains (251)8.7.80 F2816 Softstart fault power supply unit (251)8.7.81 F2817 Overvoltage in power section (251)8.7.82 F2818 Phase failure (252)8.7.83 F2819 Mains failure (253)8.7.84 F2820 Braking resistor overload (253)8.7.85 F2821 Error in control of braking resistor (254)8.7.86 F2825 Switch-on threshold braking resistor too low (255)8.7.87 F2833 Ground fault in motor line (255)8.7.88 F2834 Contactor control error (256)8.7.89 F2835 Mains contactor wiring error (256)8.7.90 F2836 DC bus balancing monitor error (257)8.7.91 F2837 Contactor monitoring error (257)8.7.92 F2840 Error supply shutdown (257)8.7.93 F2860 Overcurrent in mains-side power section (258)8.7.94 F2890 Invalid device code (259)8.7.95 F2891 Incorrect interrupt timing (259)8.7.96 F2892 Hardware variant not supported (259)8.8 SERCOS Error Codes / Error Messages of Serial Communication (259)9 Warnings (Exxxx) (263)9.1 Fatal Warnings (E8xxx) (263)9.1.1 Behavior in the Case of Fatal Warnings (263)9.1.2 E8025 Overvoltage in power section (263)9.1.3 E8026 Undervoltage in power section (264)9.1.4 E8027 Safe torque off while drive enabled (265)9.1.5 E8028 Overcurrent in power section (265)9.1.6 E8029 Positive position limit exceeded (266)9.1.7 E8030 Negative position limit exceeded (267)9.1.8 E8034 Emergency-Stop (268)9.1.9 E8040 Torque/force actual value limit active (268)9.1.10 E8041 Current limit active (269)9.1.11 E8042 Both travel range limit switches activated (269)9.1.12 E8043 Positive travel range limit switch activated (270)9.1.13 E8044 Negative travel range limit switch activated (271)9.1.14 E8055 Motor overload, current limit active (271)9.1.15 E8057 Device overload, current limit active (272)X/XXII Bosch Rexroth AG | Electric Drivesand ControlsRexroth IndraDrive | Troubleshooting GuideTable of ContentsPage9.1.16 E8058 Drive system not ready for operation (273)9.1.17 E8260 Torque/force command value limit active (273)9.1.18 E8802 PLL is not synchronized (274)9.1.19 E8814 Undervoltage in mains (275)9.1.20 E8815 Overvoltage in mains (275)9.1.21 E8818 Phase failure (276)9.1.22 E8819 Mains failure (276)9.2 Warnings of Category E4xxx (277)9.2.1 E4001 Double MST failure shutdown (277)9.2.2 E4002 Double MDT failure shutdown (278)9.2.3 E4005 No command value input via master communication (279)9.2.4 E4007 SERCOS III: Consumer connection failed (280)9.2.5 E4008 Invalid addressing command value data container A (280)9.2.6 E4009 Invalid addressing actual value data container A (281)9.2.7 E4010 Slave not scanned or address 0 (281)9.2.8 E4012 Maximum number of CCD slaves exceeded (282)9.2.9 E4013 Incorrect CCD addressing (282)9.2.10 E4014 Incorrect phase switch of CCD slaves (283)9.3 Possible Warnings When Operating Safety Technology (E3xxx) (283)9.3.1 Behavior in Case a Safety Technology Warning Occurs (283)9.3.2 E3100 Error when checking input signals (284)9.3.3 E3101 Error when checking acknowledgment signal (284)9.3.4 E3102 Actual position values validation error (285)9.3.5 E3103 Dynamization failed (285)9.3.6 E3104 Safety parameters validation error (286)9.3.7 E3105 Validation error of safe operation mode (286)9.3.8 E3106 System error safety technology (287)9.3.9 E3107 Safe reference missing (287)9.3.10 E3108 Safely-monitored deceleration exceeded (288)9.3.11 E3110 Time interval of forced dynamization exceeded (289)9.3.12 E3115 Prewarning, end of brake check time interval (289)9.3.13 E3116 Nominal load torque of holding system reached (290)9.4 Non-Fatal Warnings (E2xxx) (290)9.4.1 Behavior in Case a Non-Fatal Warning Occurs (290)9.4.2 E2010 Position control with encoder 2 not possible (291)9.4.3 E2011 PLC - Warning no. 1 (291)9.4.4 E2012 PLC - Warning no. 2 (291)9.4.5 E2013 PLC - Warning no. 3 (292)9.4.6 E2014 PLC - Warning no. 4 (292)9.4.7 E2021 Motor temperature outside of measuring range (292)9.4.8 E2026 Undervoltage in power section (293)9.4.9 E2040 Device overtemperature 2 prewarning (294)9.4.10 E2047 Interpolation velocity = 0 (294)9.4.11 E2048 Interpolation acceleration = 0 (295)9.4.12 E2049 Positioning velocity >= limit value (296)9.4.13 E2050 Device overtemp. Prewarning (297)Troubleshooting Guide | Rexroth IndraDrive Electric Drivesand Controls| Bosch Rexroth AG XI/XXIITable of ContentsPage9.4.14 E2051 Motor overtemp. prewarning (298)9.4.15 E2053 Target position out of travel range (298)9.4.16 E2054 Not homed (300)9.4.17 E2055 Feedrate override S-0-0108 = 0 (300)9.4.18 E2056 Torque limit = 0 (301)9.4.19 E2058 Selected positioning block has not been programmed (302)9.4.20 E2059 Velocity command value limit active (302)9.4.21 E2061 Device overload prewarning (303)9.4.22 E2063 Velocity command value > limit value (304)9.4.23 E2064 Target position out of num. range (304)9.4.24 E2069 Holding brake torque too low (305)9.4.25 E2070 Acceleration limit active (306)9.4.26 E2074 Encoder 1: Encoder signals disturbed (306)9.4.27 E2075 Encoder 2: Encoder signals disturbed (307)9.4.28 E2076 Measuring encoder: Encoder signals disturbed (308)9.4.29 E2077 Absolute encoder monitoring, motor encoder (encoder alarm) (308)9.4.30 E2078 Absolute encoder monitoring, opt. encoder (encoder alarm) (309)9.4.31 E2079 Absolute enc. monitoring, measuring encoder (encoder alarm) (309)9.4.32 E2086 Prewarning supply module overload (310)9.4.33 E2092 Internal synchronization defective (310)9.4.34 E2100 Positioning velocity of master axis generator too high (311)9.4.35 E2101 Acceleration of master axis generator is zero (312)9.4.36 E2140 CCD error at node (312)9.4.37 E2270 Analog input 1 or 2, wire break (312)9.4.38 E2802 HW control of braking resistor (313)9.4.39 E2810 Drive system not ready for operation (314)9.4.40 E2814 Undervoltage in mains (314)9.4.41 E2816 Undervoltage in power section (314)9.4.42 E2818 Phase failure (315)9.4.43 E2819 Mains failure (315)9.4.44 E2820 Braking resistor overload prewarning (316)9.4.45 E2829 Not ready for power on (316)。

工程流体力学中英翻译

fluctuatingstress
脉动应力
fluid
流体
fluid dynamics
流体动力学
fluid field
流场
fluid machinery
流体机械
fluid mechanics
流体力学
fluid particle
流体质点
fluid statics
流体静力学
free surface
自由表面
比热比
real fluid
粘性流体
real gas
真实气体，实际气体
rectangular coordinate system
直角坐标系
reduced Navier-Stokes equation
简化纳维—斯托克斯方程
Reynoldsnumber
雷诺数
adiabatic flow
绝热流动
airfoil
翼型
angle of attack
冲角
angular velocity
角速度
apparent shear stresses
表面剪切应力
apparent stresses
表面应力
Archimedes law
阿基米德定律
atmospheric pressure
临界雷诺数
critical speed of sound
临界声速
critical state
临界状态
cross section
横截面
curvature radius
曲率半径
curved shock
曲面波
cylindrical coordinate system
柱坐标系

德力西JD-5S 电动机综合保护器说明书

JD-5S Series Electric Motor Integrated ProtectorUser Manual□Please carefully read this User Manual before the installationand operation of this product, and keep it properly for futurereferenceI. Overview1.1 Scope of ApplicationJD-5S series electric motor integrated protector is used in the AC 50/60Hz power supply circuit with a voltage 380V and below to form an electric motor control circuit together with the switching circuits such as AC contactor. if found abnormal working states such as open phase, overload, and stall of main circuit of electric motor, please disconnect the contact of the switching device and cut off the three-phase power supply of electric motor timely to protect the electric motor reliably. JD-5S is an upgraded product of JD-5 product, and the setting current of the protector is set directly according to the rated current marked on the nameplate of the electric motor before use for convenient operation by users; there are technologies of multiple starting timeout options and the overload protection has inverse time limit performance, the needs of various types of motors starting from light load to heavy load can be adapted. The product has functions that there is a digital tube do display the setting current value, the run and fault status light-emitting tube is used to display, and there is pointer ammeter drive output.Standard: GB/T 14048.41.2 Model definitionRated control supply voltage Us:AC220V;AC380VRated current: 1A~9.9A10A～99ASpecification codeElectric motor integrated protectors1.3 Normal working conditions and installation conditions1.3.1 Working environment: the altitude does not exceed 2000 meters; The ambient temperature is not higher than +40℃and not below than -5℃; the voltage change range of the rated control power supply is 85%-110% of the rated voltage; the product is installed in places where the medium has no serious vibration and explosion hazard, and there are no gases and dust in the medium sufficient to cause corrosion to the metals and damage to the insulation, and there is rain and snow invasion.1.3.2 Vertical or horizontal installationII. Structural Characteristics and Working PrincipleJD-5S electric motor integrated protector has protections for overload, stall, thermal memory, open phase, three-phase imbalance, and start-up timeout. This protector adopts current sensing technology, and has a relay output interface; the whole series is of the core-through type. This protector has advantages of simple structure, reliable action, and convenient operation.III. Technical ParametersRated operating current Ie range 1A~9.9A 10A~99ARated insulation voltage, Ui AC380VRated operating voltage, Ue AC380VRated control supply voltage, Us AC50/60Hz AC220V AC380VUse category Main circuit AC-3; matched auxiliary contact (body) AC-15 Shell protection grade IP40Number of types of contacts of aux.circuit1 normally openOperating voltage and operating currentunder the use category of aux. CircuitAC-15 Ue: AC220V Ie: 0.47ARated ultimate short circuit current matedSCPDRT16-00, 6ATrip level 10A, 10, 20, 30Overload protection characteristics When the actual operating current of the motor is 1.05 times of the rated operating current, the protector operation protection time is greater than or equal to 2 h; when the actual operating current rises to 1.2 times, the protector operation protection time is less than 2 h; when the actual operating current rises to 1.5 times, the protector operation protection time is less than 2 min.Range of matched DC meter head(Rated current) 0~5A (1A~4A); 0~10A (4A~10A); 0~50A (10A~40A);0~100A (40~99A)Phase open time The open time of any phase among three phases is ≤ 3s Contact capacity AC380V, 3A; AC220V, 5A (Resistive)Electrical life: ≥10 x 104 timesMechanical life ≥100 x 104 timesInstallation method Device type (with TH35 mounting rail or screw fixed installation)IV. Outline and Installation Dimensions of ProductElectric motor integrated protectorConnected to meter headConnected to meter head Notes: QA: Start Notes: QA: StartTA: Stop TA: StopKM: AC contactor 220V KM: AC contactor 380VV. Installation and Operation InstructionsInstallation and Operation Instructions:1. Please carefully read the instructions, and connect the wires according to the wiring diagram.2. 1# and 2# terminals are the working power input terminals of the protector; 3# and 4# are the normally open contacts at the control end; 5# and 6# can be connected to the pointer ammeter head. The wiring connection method can refer to the wiring diagram; three wires from the outlet end of the AC contactor are pass through three white wire holes H1, H2, and H3 of the protector to connect to the inlet wires of the electric motor (see wiring diagram).3. Operation Guide3.1 Parameter settings1) Motor rated current settingBefore starting the electric motor, power on the JD-5S protector, press the "SET" key to switch to the "Rated current" setting item, and at this time the indicator is lit and the display value on the digital tube is the setting rated current. (According to the nominal rated current value marked on the motor nameplate, the rated current is set by pressing the "" and "" add and subtract keys)2) Starting timeout protection time settingBefore starting the electric motor, power on the JD-5S protector, press the "SET" key to switch to the "Start time" setting item, and at this time the indicator is lit and the display value on the digital tube is the setting starting timeout protection time (second); set the starting timeout protection time by pressing the "" and "" add and subtract keys; when "OF" is displayed on the digital tube, this indicates that the starting timeout protection is disabled, and when the digit is displayed, this indicates that the starting timeout protection is enabled.The factory default of the product is "OF" to turn off starting timeout protection.3) Trip level settingBefore starting the electric motor, power on the JD-5S protector, and press and hold the "SET" key to switch to the "Trip level" setting item, and at this time the indicator is lit, and the digital tube displays the protection trip level to be set; if "10." is displayed, this indicates Level 10A, with "10" displayed to indicate Level 10, with "20" displayed to indicate Level 20, and with "30" displayed to indicate Level 30. By pressing the "" and "" keys, set the different trip levels. The factory default is "10." indicating Level 10A.4) Failsafe status view and status recovery:When the failsafe protection trips in the event of starting timeout, overload, open phase or unbalance in the line, the fault status indicator on the JD-5S protector panel will be lit, and at this time the protector contact opens and is locked at the OFF state; by pressing the "SET" key, the three-phase current when the trip protection works can be viewed on the external pointer ammeter. If the digital tube displays "A-", this is the trip current of phase a; if "B-" is displayed, this is the trip current of phase B; if "C-" is displayed, this is the trip current of phase C. When the line works normally, press the "RST" key to unlock the current lock state (in case of open phase, unbalance, or starting timeout, press the "RST" key for unlocking). As the overload protection has the thermal memory function, pressing the "RST" key cannot realize the unlocking action, and the unlocking will be carried out automatically when the electric motor is cooled down (also, the protector can be powered on again for unlocking).VI. Operation Precautions1. Connect the wire properly according to the wiring diagram.2. Set the setting current according to the rated current marked on the nameplate of electric motor by combining with the display on the digital tube via keys.3. During the startup of electric motor, the overload indicator will be lit. After startup, the overload indicator shall be off during normal operation, so that the adjustment process is completed.4. Please check the performance of the protector regularly, such as open phase test and overload test.5. It is strictly prohibited to increase the current of the protector when the current and electric motor or the load works abnormally, otherwise this may cause the electric motor burns.6. The equipment that may cause major economic losses or personal safety shall be designed to ensure that the technical characteristics and performance values have sufficient margins, and safety measures such as double circuit protection should be taken.VII. Common Faults and Solutions1. If the motor stops during normal operation, carefully check the electric motor for open phase or overload. First check whether the electric motor has very high temperature rise; if found temperature rise, the overload may occur; if not found temperature rise, the line may have open phase to cause trip; check whether the three-phase power supply works normally; check the moving and fixed contacts of the AC contactor have good contact; check whether three power lines of electric motor are loose; If all are normal but the electric motor still fails to start, please carefully check whether the connecting screws of the self-lock contact of AC contactor and the normally-closed contact of protector are loose; the electric motor can start only after all faults are eliminated. Do not start the product forcedly when the fault is not eliminated to prevent accidents.2. The protector works with the electric motor and the load switch (such as contactor), and the power supply shall be turned on simultaneously. If failed to realize the synchronized power-on, the protector may have open phase fault, and the electric motor cannot start normally.3. If found any product failure, please disconnect the power supply, and then find the cause of fault; after checking that the line works normally, operate the product according to the installation and operation instructions.4. For products with poor quality, please contact the local dealer company or our company.VIII. Transport and StorageThe product is not affected by rain and snow during storage and transportation, and cannot be extruded; the product shall be put in a well-ventilated environment during storage, and the relative humidity does not exceed 90% at (25℃± 5℃). The lower temperature limit is -25℃, and the upper temperature limit is +55℃.IX. Unpacking and InspectionUnpack the outer carton, and check there is a user manual in the packing box.X. Ordering NoticeThe current specification is 1A~9.9A, 10~99A. Please note that the power of electric motor shall be consist with that of the protector.When ordering, please specify the model and specification of the product. For special requirements, please contact the manufacturer.VI. Company’s CommitmentUnder the premise that users follow the use and storage conditions and the product are well sealed, within 24 months from the production date, our company will provide repair and replacement service free of charge for any damage or abnormal operation due to poor manufacture quality. A paid repair will be provided if the warranty period expires. For any damage due to one of the following situations, a paid repair will be given even if within the warranty period:(1)Improper operation, maintenance, or storage;(2)Modified and inappropriate repair without permission;(3)Damage due to falling off or during installation after purchase;(4)Force majeure such as earthquakes, fires, lightning strikes, abnormal voltages, and secondary disasters.(5)The electrical life of the product exceeds 100,000 times; the mechanical life of the product exceeds one million times.If you have any questions, please contact the dealer or our company’s customer service department.Customer Service Hotline: 400-826-8008Certificate DELIXI GROUP CO., LTD. Name: Integrated Protector for Electric Motors Model: JD-5S seriesThis product complies with the standard GB/T 14048.4, passes the inspection and is allowed to be shipped. Inspector: Check 01Inspection date: See label on inner boxManufacturer: Delixi Group Co., Ltd.Address: No. 155, Zhandong Road, Liushi Town, Yueqing City, Zhejiang Province P.C.: 325604 Tel: (86-577) 6177 8888Fax: (86-577) 6177 8000Customer Service Hotline: 400-826-8008The second edition of this User Manual was issued in Aug. 2021。

Philips 51厘米（20英寸）LCD 20PF5120电视说明书

Philips Flat TV51 cm (20")LCD20PF5120Turn up your viewing experiencewith Crystal Clear IIIHere is a new TV that not only gives you great picture and sound but also modern styling and quality finish. It features Crystal Clear III for better quality images that reveal more detail and Incredible Surround for superb audio.Vivid, natural and razor sharp images•Enhanced-definition LCD SVGA display, 800 x 600p•Crystal Clear III for natural images with enhanced quality •2D Combfilter sharpens images for finer detail Leading interface for digital quality audio/video •DVI-I provides the best picture and flexible connectivity Slim, stylish design to complement your interior •Compact and slim design that fits in every room Exciting and lifelike sound•Incredible Surround™ for enhanced audio enjoyment Multi-purpose convenience•Smart Picture provides personalized image settings •Smart Sound optimizes audio settings•PC input lets you also use your TV as a PC monitorHighlightsLCD SVGA display, 800 x 600pThis SVGA display with state-of-the-art LCD screen technology has an enhanced resolution of 800 x 600p. It produces brilliant flicker-free progressive scan pictures with optimum brightness and superb colors. This vibrant and sharp image will provide you with an enhanced viewing experience.Crystal Clear IIICrystal Clear III combines a whole range of enhancements to provide a better picture. They include a 2D Comb filter, Dynamic contrast, Blue stretch and Green enhancement so that you always get the most natural looking colors.2D CombfilterThe 2D comb filter separates chrominance (color) from luminance (brightness) information in the video signal for independent processing to improve picture resolution and minimize distortion.Incredible Surround™Incredible Surround is an audio technology from Philips that dramatically magnifies the sound field to immerse you in the audio. Using state-of-the-art electronic phase shifting, Incredible Surround mixes sounds from left and right in such a way that it expands the virtual distance between the two speakers.This wider spread greatly enhances the stereoeffect and creates a more natural sounddimension. Incredible Surround allows you toexperience total surround with greater depthand width of sound, without the use ofadditional speakers.Compact and slim designThis design style emphasizes a slim, compactlook that saves space and fits in anywhere.PC inputWith PC input you can connect your TV to acomputer and use the TV as a PC monitor.Smart PictureSmart Picture provides the optimum picturesettings for color, brightness, saturation,contrast, sharpness, and so on, to enhanceyour overall viewing experience at all times.Smart SoundSmart Sound provides the optimal soundsettings for ultra bass, bass, treble and balanceso that you can get the best entertainmentexperience.DVI-I InputA DVI-I input connects the non-compressedhigh-bandwidth digital RGB signal from sourceto screen. By eliminating the conversion of thedigital signals to analog, it delivers anunblemished and noisefree image, that is clearand flickerfree. The DVI input supports HDCPcopy protection that allows viewing of copyprotected programs from Digital Settop boxes,DVD players and HD recorders. DVI-I isfuture proof as it can be be connected to allHDMI devices (a converter cable is required).The DVI-I input also supports analog PC-VGAsignals.Issue date 2023-08-21Version: 4.0.5EAN: 87 10895 87541 7© 2023 Koninklijke Philips N.V.All Rights reserved.Specifications are subject to change without notice. Trademarks are the property of Koninklijke Philips N.V. or their respective owners.SpecificationsPicture/Display•Aspect ratio: 4:3•Diagonal screen size (inch): 20 inch •Diagonal screen size (metric): 51 cm •Panel resolution: 800 x 600p •Brightness: 500 cd/m²•Contrast ratio (typical): 500:1•Picture enhancement: Crystal Clear III, Progressive scan, 2D Combfilter, Sharpness Adjustment•Display screen type: LCD SVGA Active Matrix TFT •Response time (typical): 16 ms•Viewing angle (horizontal): 160 degree •Viewing angle (vertical): 120 degreeSupported Display Resolution•Computer formats: 640 x 480, 60, 67, 72, 75Hz, 800 x 600, 56, 60, 72, 75Hz•Video Formats: 640 x 480i - 1Fh, 640 x 480p - 2Fh, 720 x 576i - 1Fh, 720 x 576p - 2Fh, 1280 x 720p - 3Fh, 1920 x 1080i - 2FhTuner/Reception/Transmission•Tuner bands: Hyperband, S-Channel, UHF, VHF •TV system: PAL, PAL B/G, PAL D/K, PAL I, SECAM, SECAM B/G, SECAM D/K •Video Playback: NTSC, PAL, SECAMConvenience •Child Protection: Child Lock+Parental Control •Ease of Installation: Automatic Tuning System (ATS), Autostore, Fine Tuning•Ease of Use: Smart Picture, Smart Sound, Top Controls, Auto Volume Leveller (AVL), Menu Control, On Screen Display •Clock: Sleep Timer•Screen Format Adjustments: 4:3, 16:9 compress, 4:3 expand•Teletext: 10 page Smart Text •VESA Mount: 100 x 100 mmSound•Output power (RMS): 2 x 5W•Sound System: Mono, Nicam Stereo•Sound Enhancement: Incredible SurroundConnectivity•AV 1: Audio L/R in, YPbPr (2fh)•AV 2: Audio L/R in, CVBS, S-Video•Front / Side connections: Headphone Out•Other connections: DVI-I, PC Audio in, Antenna IEC75Power•Power supply: AC 90-240•Ambient temperature: 5 °C to 40 °C •Power consumption: 55 W•Standby power consumption: < 1 WAccessories•Included accessories: Table top stand, Power cord, Quick start guide, Remote Control, User ManualDimensions•Set Width: 506 mm •Set Height: 444 mm •Set Depth: 80 mm •Product weight: 8.5 kg•Width (with base): 506 mm •Height (with base): 484 mm •Depth (with base): 220 mm。

电能表专业术语中英文对照完整版

电能表专业术语中英文对照标准化管理处编码[BBX968T-XBB8968-NNJ668-MM9N]电能表专业术语中英文对照有功电度表——watt-hour meter静止式有功电度表——static watt-hour meter 多费率电度表——multi-rate meter仪表型式——meter type测量器件——measuring element测试输出——test output工作指示器——operation indicator贮存器——memory非易失贮存器——non-volatile memory显示器——display计度器——register电流线路——current circuit电压线路——voltage circuit辅助线路——auxiliary circuit常数——constant室内仪表——indoor meter室外仪表——outdoor meter表底——base插座——socket表盖——meter cover表壳——meter case可触及导电部件——accessible conductive part保护接地端——protective earth terminal端子座——terminal block端子盖——terminal cover间隙——clearance爬电距离——creepage distance基本绝缘——basic insulation附加绝缘——supplementary insulation双重绝缘——double insulation加强绝缘——reinforced insulationI类防护绝缘包封仪表——insulating encased meter of protective class I II类防护绝缘包封仪表——insulating encased meter of protective class II 参比电流——reference current基本电流*（Ib)——basic current （Ib)额定电流*（In)——rated current （In)最大电流*（Imax)——maximum current （Imax)参比电压*（Un)——reference voltage（Un)参比频率——reference frequency等级指数——class index百分数误差——percentage error影响量——influence quantity参比条件——reference conditions由影响量引起的误差改变量——variation of error due to an influence quantity 畸变因数——distortion factor电磁骚扰——electromagnetic disturbance参比温度——reference temperature平均温度系数——mean temperature coefficient额定工作条件——rated operating conditions规定的测量范围——specified measuring range规定的工作范围——specified operating range极限工作范围——limit range of operation贮存和运输条件——storage and transport conditions正常工作位置——normal working position热稳定性——thermal stability型式试验——type test电度表型号——meter type标准表——reference meter无功功率（乏）——reactive power(var)无功电能（乏一小时）——reactive energy(var-hour)单相电路中无功电能——reactive energy in a single-phase circuit 三相电路中无功电能——reactive energy in a three-phase circuit 无功电度表——var-hour meter静止式无功电度表——static var-hour meter多费率仪表——multi-rate meter无功功率的方向和符号——directions and sign of reactive power 测量元件——measuring element输出装置——output devices感应式仪表——induction meter仪表转子——meter rotor仪表驱动元件——meter driving element仪表制动元件——meter braking element仪表计度器（计数机构）——register of a meter(counting mechanism) 仪表底座——meter base仪表插座——meter socket仪表基架——meter frame接线端座——terminal block接线端盖——terminal cover基本转速——basic speed基本转矩——basic torque仪表常数——meter constant绝缘——insulation型式——type型式检验——type test型式验证程序——type approval procedure鉴定程序——qualification procedure影响量或影响因数——influence quantity or factor垂直工作位置——vertical working position等级指数——class index测量单元——measuring unit数据处理单元——data processing unit多功能电能表——multifunction watthour meter需要周期——demand interval最大需量——maximum demand滑差时间——sliding window time尖、峰、谷、平时段——（sharp、peak、shoulder、off—peak time consumption）额定最大脉冲频率——rated maximum impulse frequency最大需量复零装置——maximum demand reset zero unit辅助电源——auxiliary supply电磁骚扰——electromagnetic disturbance产品——item修理的产品——repaired item不修理的产品——non-repaired item服务——service规定功能——required function时刻——instant of time时间区间——time interval持续时间——time duration累积时间——accumulated time量度——measure工作——operation修改——modification(of an item)效能——effectiveness固有能力——capability耐久性——durability可靠性——reliability维修性——maintainability维修保障性——maintenance support performance 可用性——availability可信性——dependability失效——failure致命失效——critical failure非致命失效——non-critical failure误用失效——misuse failure误操作失效——mishandling failure弱质失效——weakness failure设计失效——design failure制造失效——manufacturing failure老化失效；耗损失效——ageing failure；wearout failure突然失效——sudden failure渐变失效；漂移失效——gradual failure；drift failure灾变失效——cataleptic failure关联失效——relevant failure非关联失效——non-relevant failure独立失效——primary failure从属失效——secondary failure失效原因——failure cause失效机理——failure mechanism系统性失效；重复性失效——systematic failure；reproducible failure 完全失效——complete failure退化失效——degradation failure部分失效——partial failure故障——fault致命故障——critical fault非致命故障——non-critical fault重要故障——major fault次要故障——minor fault误用故障——minor fault误操作故障——mishandling fault弱质故障——weakness fault设计故障——design fault制造故障——manufacturing fault老化故障；耗损故障——ageing fault；wearout fault程序－敏感故障——programme-sensitive fault数据－敏感故障——data-sensitive fault完全故障；功能阻碍故障——complete fault；function-preventing fault 部分故障——partial fault持久故障——persistent fault间歇故障——intermittent fault确定性故障——determinate fault非确定性故障——indeterminate fault潜在故障——latent fault系统性故障——systematic fault故障模式——fault mode故障产品——faulty item差错——error失误——mistake工作状态——operating state不工作状态——non-operating state待命状态——standby state闲置状态；空闲状态——idle state；free state不能工作状态——disable state；outage处因不能工作状态——external disabled state不可用状态；内因不能工作状态——down state；internal disabled state 可用状态——up state忙碌状态——busy state致使状态——critical state维修——maintenance维修准则——maintenance philosophy维修方针——maintenance policy维修作业线——maintenance echelon；line of maintenance维修约定级——indenture level(for maintenance)维修等级——level of maintenance预防性维修——preventive maintenance修复性维修——corrective maintenance受控维修——controlled maintenance计划性维修——scheduled maintenance非计划性维修——unscheduled maintenance现场维修——on-site maintenance；in sits maintenance；field maintenance 非现场维修——off-site maintenance遥控维修——remote maintenance自动维修——automatic maintenance逾期维修——deferred maintenance基本的维修作业——elementary maintenance activity维修工作——maintenance action；maintenance task修理——repair故障识别——fault recognition故障定位——fault localization故障诊断——fault diagnosis故障修复——fault correction功能核查——function check-out恢复——restoration；recovery监测——supervision；monitoring维修的实体——maintenance entity影响功能的维修——function-affecting maintenance妨碍功能的维修——function-preventing maintenance减弱功能的维修——function-degreding maintenance不影响功能的维修——function-permitting maintenance维修时间——maintenance time维修人时——MMH maintenance man-hours实际维修时间——active maintenance time预防性维修时间——preventive maintenance time修复性维修时间——corrective maintenance time实际的预防性维修时间——active preventive maintenance time 实际的修复性维修时间——active corrective maintenance time未检出故障时间——undetected fault time管理延迟（对于修复性维修）——administrative delay 后勤延迟——logistic delay故障修复时间——fault correction time技术延迟——technical delay核查时间——check－out time故障诊断时间——fault diagnosis time故障定位时间——fault localization time修理时间——repair time工作时间——operating time不工作时间——non—operating time需求时间——required time无需求时间——non-required time待命时间——stand-by time闲置时间——idle time；free time不能工作时间——disabled time不可用时间——down time累积不可用时间——accumulated down time外因不能工作时间——external disabled time；external loss time 可用时间——up time首次失效前时间——time to first failure失效前时间——time to failure失效间隔时间——time between failures失效间工作时间——operating time between failures恢复前时间——time to restoration；time to recovery使用寿命——useful life早期失效期——early failure period恒定失效密度期——constant failure intensity period恒定失效率期——constant failure rate period耗损失效期——wear－out failure period瞬时可用度——A(t) instantaneous availability瞬时不可用度——U(t) instantaneous unavailability平均可用度——A(t1,t2)mean availability平均不可用度——U(t1，t2)mean unavailability渐近可用度——A asymptotic availability稳态可用度——steady－state availability渐近下可用度——U asymptotic unavailability稳态不可用度——steady-state unavailability渐近平均可用度——Aasymptotic mean availability渐近平均不可用度——U asymptotic mean unavailability平均可用时间——MUT mean up time平均累积不可用时间——MADT mean accumulated down time可靠度——R(t1，t2)reliability瞬时失效率——λ(t)instantaneous failure rate平均失效率——λ(t1,t2)mean failure rate瞬时失效密度——Z(t) instantaneous failure intensity平均失效密度——Z(tl，t2) mean failure intensity平均首次失效前时间——MTTFF mean time to first failure平均失效前时间——MTTF mean time to failure平均失效间隔时间——MTBF mean time between failures平均失效间工作时间——MTBF mean operating time between failures 失效率加速系数——failure rate acceleration factor失效密度加速系数——failure intensity acceleration factor维修度——maintainability瞬时修复率——μ(t)instantaneous repair r ate平均修复率——μ(t1，t2)mean repair rate平均维修人时——mean maintenance man-hours平均不可用时间——MDT mean down time平均修理时间——MRT mean repair timeP—分位修理时间——p—fractile repair time平均实际修复性维修时间——mean active corrective maintenance time 平均恢复前时间——MTTRmean time to restoration故障识别比——fault coverage修复比——repair coverage平均管理延迟——MAD mean administrative delayp—分位管理延迟——p-fractile administrative delay平均后勤延迟——MLD mean logistic delayP—分位后勤延迟——P—fractile logistic delay试验——test验证试验——compliance test测定试验——determination test实验室试验——laboratory test现场试验——field test耐久性试验——endurance test加速试验——accelerated test步进应力试验——step stress test筛选试验——screening test时间加速系数——time acceleration factor维修性检验——maintainability verfication 维修性验证——maintainability demonstration 观测数据——observed data试验数据——test data现场数据——field data基准数据——reference data冗余——redundancy工作冗余——active redundancy备用冗余——standby redundancy失效安全——fail safe故障裕度——fault tolerance故障掩盖——fault masking预计——prediction可靠性模型——reliability model可靠性预计——reliability prediction可靠性分配——reliability allocation；reliability apportionment故障模式与影响分析——FMEA fault modes and effects analysis故障模式、影响与危害度分析——FMECA fault modes，effects and criticality analysis故障树分析——FTA fault tree analysis应力分析——stress analysis可靠性框图——reliability block diagram故障树——fault tree状态转移图——state-transition diagram应力模式——stress madel故障分析——fault analysis 失效分析——failure analysis 维修性模型——maintainability model 维修性预计——maintainability prediction 维修树——maintenance tree 维修性分配——maintainability allocation；maintainability apportionment 老练——burn in 可靠性增长——reliability growth 可靠性改进——reliability improvement 可靠性和维修性管理——reliability and maintainability management 可靠性和维修性保证——reliability and maintainability assurance 可靠性和维修性控制——reliability and maintainability control 可靠性和维修性大纲——reliability and maintainability programme 可靠性和维修性计划——reliability and maintainability plan 可靠性和维修性审计——reliability andmaintainability audit 可靠性和维修性监察——reliability and maintainability surveillance 设计评审——design review 真实的…——true… 预计的…——predicted… 外推的…——extrapolated… 估计的…——estimated… 固有的…——intrinsic…；inherent… 使用的…——operational… 平均的…——mean… P-分位…——P-fratile… 瞬时的…——instantaneous… 稳态的…——steady state。

相场法数值模拟

均质与非均质体系 Homogeneous versus heterogeneous systems
图5 自由能与浓度的关系
Nele Moelans.Phase field method to simulate microstructural evolution (June 2004)
1、固态相变-对称性降低
图1（a）性能不连续
（b）性能连续
N. Moelans, B. Blanpain , P. Wollants, "An introduction to phase-field modeling of microstructure evolution", CALPHAD -Computer Coupling of Phase Diagrams and Thermochemistry, 32, 268-294, 2008
数值模拟
结束语
相场模拟通过微积分放映扩散、有序化以及热力学驱动力的综合作用。相场方程的解可以描述系统中固液界面的状态、曲率以及界面的移动。把相场方程与外场（如温度场等）耦合，则可以模拟多晶的真实形貌。
相场法数值模拟从单相场发展到多相场，从没有流场到包含流场，其数学模型越来越接近真实模拟过程。
α相扩散到 β相的溶质扩散方程
尖锐界面
c D2c t
c D2c t
(c,in t c,in)tDcDc r1 r1
(c,in ) t (c,in )t
相场法原理
相场法是以GinzburgLandau理论为基础, 用微分方程来体现扩散、有序化势和热力学驱动的综合作用, 它是建立在GinzburgLandau 唯象理论之上的一种近代方法。
相场法数值模拟 phase-field modeling

OSRAM OSTAR Observation应用注意事项说明书

April 8, 2011page 1 of 10OSRAM OSTAR Observation Application NoteSummaryThis application note provides an overview of the general handling and functionality of the OSRAM OSTAR Observation. The im-portant optical and electrical characteristics are described and the thermal requirements for stable operation of the IR LED light source are addressed.In addition, the procedure for dimensioning an appropriate heat sink is illustrated by means of an example.Applications of the IR light source OSRAM OSTAR ObservationThere are various possibilities where our customers are using the OSRAM OSTAR Observation as IR light source:- Infrared illumination for cameras - General monitoring systems - IR data transfer- Driver assistance systems.Due to its compact and flat design together with its high light density, the OSRAM OSTAR Observation can be easily inte-grated in various applications. This opens up new application areas that were off limits to conventional IR devices.Construction of the OSRAM OSTAR ObservationDuring design of the OSRAM OSTAR Ob-servation, special attention was given to the thermal optimization of the module.The module core is formed from ten highly efficient semiconductor chips mounted on ceramic. For optimal heat transfer, the ce-ramic is directly mounted to the aluminum of the insulated metal core circuit board (base plate). This results in optimal heat dissipa-tion and additionally provides a sufficiently large area for a good thermal connection to the system heat sink where the OSRAM OSTAR module has to be attached to.With this construction, the light source itself exhibits a very low thermal resistance (R thJB ) between junction and base plate of 2.8 K/W.The frame surrounding the chips is available in black and white colour to enable a choice depending on the desired application.The black frame minimizes scattered light, which is important in imaging systems, whereas the white frame optimizes the total optical output power.Figure 1: Two frame colours are available for the OSRAM OSTAR Observation.April 8, 2011page 2 of 10Equipped with an ESD protection diode, the OSRAM OSTAR Observation possesses ESD protection up to 2 kV according to JESD22-A114-B.A thermistor (NTC EPCOS 8502) mounted to the base plate serves as a sensor for de-termining the temperature of the metal core board. The NTC temperature provides a good approximation of the average tempera-ture of the underside of the aluminum base plate. From this the junction temperature can be estimated (using R thJB ) and thus con-trolled.As a light source, semiconductors of the latest highly efficient thin film technology based on AlGaAs are employed. This pro-vides a nearly pure surface emitter with Lambertian radiation characteristics.All semiconductor chips are wired in series to achieve a constant intensity for all emit-ting surfaces.Tips for handling the OSRAM OSTAR ObservationIn order to protect the semiconductor chips from environmental influences such as mois-ture, they are encapsulated using a clear silicone.In addition, the silicone encapsulant allows an operation at a junction temperature of 145°C.Since this encapsulant is very elastic and soft, mechanical damage to the silicone should be minimized or avoided if at all pos-sible during processing (see also the appli-cation note "Handling of Silicone Resin LEDs“).This also applies to the black silicone en-capsulant for the connection contacts. Ex-cessive force on the cover can lead to spon-taneous failure of the light source (damageto the contacts).Figure 2: Areas of the silicone encapsu-lant of the OSRAM OSTAR Observation (shown in red hatch marks), which must not be damaged.In Figure 2, the corresponding locations are shown in red hatch marks.To prevent damaging or puncturing the en-capsulant the use of all types of sharp ob-jects should be avoided.Furthermore, it should be assured that the light source is provided with adequate cool-ing (see design example below) during op-eration. Even at low currents, prolonged operation without cooling can lead to over-heating, damage or even failure of the mod-ule.Electrical connection of the OS-RAM OSTAR ObservationFor easy electrical connection, the OSRAM OSTAR Observation is equipped with a 4-pin socket:Pin Assignment: Pin 1: Anode Pin 2: Thermistor Pin 3: Thermistor Pin 4: CathodeAs a mating plug, the SMD plug from ERNI (SMD214025.4-pins) is recommended.April 8, 2011page 3 of 10Mounting the OSRAM OSTAR Ob-servationSeveral mounting methods can be used for attaching the IR light source.When selecting an appropriate mounting method, make sure that a good heat transfer is provided between the OSRAM OSTAR Observation and the heat sink and that this is also guaranteed during operation.An insufficient or incorrect mounting can lead to thermal or mechanical problems dur-ing assembly.Generally, screws should be used for mount-ing the OSRAM OSTAR Observation.When mounting the module with M2 screws, a torque of 0.2 - 0.3 Nm should be used. In order to achieve a good thermal connection, the contact pressure should typically be in the range of 0.35 MPa.In addition to mounting with screws, the OSRAM OSTAR Observation can also be attached by means of gluing or clamping. When mounting with glue, care should be taken that the glue is both adhesive and thermally stable, and possesses a good thermal conductivity.When mounting a component to a heat sink, it should generally be kept in mind that the two solid surfaces must be brought into physical contact.Technical surfaces are never really flat or smooth, however, but have a certain rough-ness due to microscopic edges and depres-sions. When two such surfaces are joined together, contact occurs only at the surface peaks. The depressions remain separated and form air-filled cavities (Figure 3).DescriptionMaterial Advantages DisadvantagesThermally conductive pasteTypically silicone based, with heat conductiveparticlesThermally conductive compoundsImproved thermallyconductive paste – rub-bery film after curingThinnest connection with minimal pressureHigh thermal conductiv-ity No delaminationMaterial discharge at the edgesDanger of contamina-tion during mass pro-ductionPaste can escape and "creep" over timeConnections require curing process Phase Change Materi-als (PCM)Material of polyester or acrylic with lower glass transition temperature, filled with thermally con-ductive particlesEasy handling and mountingNo delaminationNo curingContact pressure re-quiredHeat pretreatment re-quiredThermally conductive elastomersSilicone plastic washer pads- filled with thermally conductive particles - often strengthened with glass fibers or di-electric filmsThermally conductive tapeDouble sided tape filled with particles for uniform thermal and adhesive propertiesNo leakage of materialCuring not requiredProblem with delamina-tionModerate thermal con-ductivityContact pressure re-quiredTable 1: Thermal Interface MaterialsApril 8, 2011page 4 of 10Figure 3: Heat flow with and without heat conductive material.Since air is a poor conductor of heat, these cavities should be filled with a thermally conductive material in order to significantly reduce the thermal resistance and improve the heat flow between the two adjacent sur-faces.Without an appropriate, optimally effective interface, only a limited amount of heat ex-change occurs between the two surfaces, eventually leading to overheating of the light source.To improve the heat transfer capability and reduce the thermal contact resistance, sev-eral materials are suitable.Thermally conductive pastes and com-pounds possess the lowest transfer resis-tance, but require a certain amount of care in handling.Elastomers and foils/bands are easy to use. With pretreated surfaces and appropriate contact pressure, a good thermal transfer can be realized.Table 1 shows an overview of the most commonly used thermally conductive mate-rials along with their most important advan-tages and disadvantages.Optical characteristics of the OS-RAM OSTAR ObservationWhen characterizing IR LEDs, the intensity is usually specified with two parameters - the total radiant flux Φe (units of mW) and the radiant intensity I e (units of mW/sr).The total radiant flux Φe of an LED describes the total radiated light power independent of direction. For the OSRAM OSTAR Observa-tion, this is shown in Figure 4, in relation to forward current.In contrast, the radiant intensity expresses the radiated power within a fixed solid angle (e.g. 0.01 sr ≙ ±3.2°) in the primary direction of radiation (optical axis).Figure 4: Relative total radiant flux in re-lation to forward current I F .The radiation characteristics (in the far field ) show the distribution of intensity dependent on angle and are shown for the OSRAM OSTAR Observation in Figure 5. This repre-sents a good approximation of a Lambertian source with a radiation angle of ±60°.In general, the brightness can be influenced with the help of appropriate secondary op-tics. That is, with the use of focusing optics, the light output within a particular angle can be significantly increased.April 8, 2011page 5 of 10Figure 5: Radiation characteristics with-out optics.The user should refrain from attempting to mount the primary optics to the silicone en-capsulant. This can lead to damage to the chip and especially to the bonding wires, thereby voiding the warranty provided by OSRAM.In the near field (at different operating cur-rents), the OSRAM OSTAR Observation exhibits the radiance images shown in Fig-ure 6.Figure 6: Radiance images in the near field at very low power (above) and at higher power (below).An especially homogeneous radiance is achieved through the black frame of the module - a particular advantage when using imaging optics.Optical safety regulationsDepending on the mode of operation, the OSRAM OSTAR Observation emits highly concentrated, invisible infrared radiation, which can be dangerous for the human eye. Products which contain these components must be handled according to the guidelines specified in IEC Standard 60825-1 and IEC 62471 "Photobiological Safety of Lamps and Lamp Systems“. Please see “Applica-tion Note Eye Safety” for more details.At high currents, one should always avoid looking at the optical path through a focus-ing lens, since the limits imposed by Laser Class 1M can be exceeded.Electrical characteristics and op-eration of the OSRAM OSTAR Ob-servationIn addition to optimized optical behavior, the new thin film AlGaAs technology also exhib-its improved electrical characteristics, when compared to traditional standard chip tech-nologies. These improvements lead to a significantly reduced forward voltage. It also enables higher forward currents for a given junction temperature.A typical current-voltage characteristic is shown in Figure 7.Care should be taken to observe the limiting conditions specified in the data sheet and at higher power, sufficient cooling should be provided.The OSRAM OSTAR Observation consists of a current-driven component, in which small voltage fluctuations at the input can lead to significant changes in current for theApril 8, 2011page 6 of 10device and thus to changes in the emitted output power. When selecting or developing suitable driver circuitry, it is therefore rec-ommended that appropriate current stabili-zation should also be provided. To find a suitable component for this purpose please see the manufacturer homepages linked on .Figure 7: Current-Voltage characteristic of the OSRAM OSTAR Observation.The efficiency of the OSRAM OSTAR Ob-servation module which results from the total radiated light power Φe and the electrical power P = V f x I f , is plotted in Figure 8. It is optimal at around 100 mA and de-creases at lower and higher currents.This is especially true for pulse operation at I f >100 mA, since the average optical power does not remain constant when the current is doubled and the duty cycle is halved.Figure 8: Efficiency in relation to forward current I f ; T B = 25°C, t pulse = 100µs.Thermal ConsiderationsIn order to achieve reliability and optimal performance for IR light sources such as the OSRAM OSTAR Observation, appropriate thermal management is necessary.Basically, there are two principle limitations for the maximum allowable temperature. First of all, for the OSRAM OSTAR Observa-tion, the maximum allowable base plate temperature T B of 125°C must not be ex-ceeded. Secondly, the maximum junction temperature is specified to be 145°C. Since these temperatures are dependent on the operating current and mode of operation (constant current or pulsed mode), the maximum allowable currents listed in the data sheet specify a T B of up to 125°C for DC operation. Thus, for example, the maxi-mum allowable constant current is 1 A for a base plate temperature T B = 85°C and is 650 mA at 110°C. The permissible pulse handling diagram shows the maximum cur-rent allowed for various pulse conditions with given pulse length t p and duty cycle D.April 8, 2011page 7 of 10Exceeding the maximum junction tempera-ture of 145°C can lead to irreversible dam-age to the LED and to spontaneous failure of the device.Due to underlying physical inter-dependencies associated with the function-ing of light emitting diodes, a change in the junction temperature T J - within the allowable temperature range - has an effect on several LED parameters.As a result, the forward voltage, radiant flux, wavelength and lifetime of LEDs are influ-enced by the junction temperature.Influence on forward voltage V f and optical power ΦeFor LEDs, an increase in junction tempera-ture leads to both a reduction of forward voltage V F (Figure 9), and a decrease in optical power Φe (Figure 10). The resulting changes are reversible. That is, the original default values return when the temperature change is reversed.For the application, this means that the lower the temperature of the semiconductor, the higher the light output will be.Influence on reliability and lifetimeIn general, with respect to aging, reliability and performance, continually driving the LEDs at their maximum allowable junction temperature is not recommended, since with an increase in temperature, a reduction in lifetime can be observed.Figure 9: Typical forward voltage in rela-tion to base plate temperature T B (I f = 1 A, t p = 10 ms).Figure 10: Relative optical power in rela-tion to base plate temperature for various pulsed currents (t p = 10 ms).April 8, 2011page 8 of 10Determination of the module tem-perature with the integrated NTCA good approximation of the base plate temperature TB can be determined from the measured resistance of the NTC and the curve given in the reference table (Fig-ure 12).Depending on the operating conditions, the corresponding junction temperature will be ΔT = R thJB x P D (P D = electrical power dissi-pation) higher. With appropriate feedback circuitry, T B and thus the junction tempera-ture can be regulated.Figure 11: Cross section of the OSRAM OSTAR Observation.Design ExampleIn the following example, the thermal re-quirements of the heat sink for the OSRAM OSTAR Observation are examined. In Fig-ure 13, an equivalent circuit for the different thermal resistances of the module is shown. Additional information is contained in the application note "Thermal Management of OSTAR-Projection Light Source".As a starting point for the thermal evaluation, an OSRAM OSTAR Observation module (10 Chips) is driven at an operating current of I f = 1000 mA and a maximum ambient tem-perature of T A = 50°C .From the given data and information from the data sheet, the requirements for the necessary cooling can be found by means ofthe following formula:Figure 12: Typical thermistor characteris-tics for the OSRAM OSTAR Observation (NTC EPCOS 8502).Where][][][][,)()(A I V V W P T T T K T f f Module D Safety mbient A unction J ⋅≈Δ−−=ΔWithT J(unction) = Max. Junction temperature (from data sheet: T J = 145°C)T B(aseplate) = Base plate temperatureT A(mbient) = Ambient temperature (T A = 50°C)ΔT Safety = Safety temperature range (typ.10 – 20K)V f = Forward voltage (from data sheet: V f = 15.5V)I f = Forward current (I f = 1A) Æ typ. P D, Module = 15.5 WApril 8, 2011page 9 of 10ΔT = Temperature change due to P D,ModuleR th,Interface = Thermal resistance of the transition mate-rial between the OSRAM OSTAR base plate and the cooler/heat sink (e.g. thermally conductive paste ≈ 0.1 K/W)R th,JB = Thermal resistance of the OSRAM OSTAR Observation (from data sheet: R th,JB = 2.8 K/W)R th,Heat sink = Thermal resistance of the cooler/heat sink to the environmentthe thermal resistances.In this example, the maximum thermal resis-tance required for cooling of the module can be found by:With the calculated thermal resistance value at hand, a corresponding heat sink can beselected from a manufacturer (see ). Using this setup at the given operating conditions the junction temperature of the module will be at 135°C. If a lower T J is desired, the safety temperature ΔT Safety has to be increased accordingly.In addition to a thermal evaluation by means of a simulation or a computed estimate, it is generally recommended to verify and safe-guard the design with a prototype and ther-mal measurements.ConclusionDeveloped for high power operation with pulsed currents of up to five Amperes, the OSRAM OSTAR Observation IR light source achieves a light output of several Watts, depending on operating parameters.Due to operation at high power levels, ap-propriate thermal management is particularly necessary in order to dissipate the accumu-lated heat and to assure the optimal per-formance and reliability of the module.When developing applications based on the OSRAM OSTAR Observation, it is generally recommended that in addition to thermal simulations, the design should be verified and safeguarded by means of a prototype and thermal measurements.April 8, 2011page 10 of 10Don't forget: LED Light for you is your place to be whenever you are looking for information or worldwide partners for your LED Lighting project.Author: Dr. Claus Jäger, Andreas StichABOUT OSRAM OPTO SEMICONDUCTORSOSRAM is part of the Industry sector of Siemens and one of the two leading lighting manufactur-ers in the world. Its subsidiary, OSRAM Opto Semiconductors GmbH in Regensburg (Germany), offers its customers solutions based on semiconductor technology for lighting, sensor and visu-alization applications. OSRAM Opto Semiconductors has production sites in Regensburg (Ger-many) and Penang (Malaysia). Its headquarters for North America is in Sunnyvale (USA), and for Asia in Hong Kong. OSRAM Opto Semiconductors also has sales offices throughout the world. For more information go to .All information contained in this document has been checked with the greatest care. OSRAM Opto Semiconductors GmbH can however, not be made liable for any damage that occurs in connection with the use of these contents.。

Influence_of_Composite_Non_Magnetic_Ions_(Cd-Ti)_D

New Journal of Glass and Ceramics, 2012, 2, 144-149doi:10.4236/njgc.2012.24021 Published Online October 2012 (/journal/njgc)Influence of Composite Non Magnetic Ions (Cd-Ti) Doping on Structural and Electrical Properties of Li-Mn Ferrite Vidya J. Deshmukh1, Pragati S. Jadhav2, Ketaki K. Patankar2*, Sharad S. Suryawanshi3, Vijaya R. Puri4 1Ramkrishna Paramhansa Mahavidyalaya, Osmanabad College, Osmanabad, India; 2Physics Department Rajaram College, Kolhapur, India; 3Physics Department, Solapur University, Solapur, India; 4Physics Department, Shivaji University, Kolhapur, India.Email: *Received May 6th, 2012; revised July 23rd, 2012; accepted August 16th, 2012ABSTRACTThe Li-Mn ferrites with composite divalent and tetravalent non-magnetic ions doping were prepared by ceramic method and studied for the first time to investigate their structural and electrical properties. It has been confirmed from the studies that these materials result in properties suitable for microwave applications. The structural properties have con- firmed the formation of cubic spinel ferrite and the substitutions of non magnetic ions have resulted in increase of unit cell dimensions and hence the grain size with increase in dopant content. An IR study asserts the same. Electrical Prop- erties show increase in dc resistivity and decrease in dielectric loss tangent with increase in dopant concentration. Keywords: Electronic Materials; Magnetic Ceramics; Electrical Characterization; Powder Diffraction1. IntroductionLi ferrite is becoming increasingly attractive for micro- wave applications replacing garnets and other spinel fer- rites [1-3]. Microwave devices such as circulators, isola- tors, magnetostatic resonators, filters, switches, limiters and tunable electroptic modulators are the microwave applications of Li ferrites [4]. Recent exponential growth in microwave communication through mobile and satel- lite communications has further stressed the worldwide need for extremely low-loss and economical microwave devices using ferrite materials. In preparation of micro- wave ferrite materials, particular attention should be given to the purity of the raw materials, stoichiometry of the composition and porosity as well as grain characteris- tics of the final product. Characteristics of various mi- crowave ferrites have been minutely reported by Voron- kov et al. [5]. The emergence of Li ferrite as a competent material in microwave devices has resulted from some appropriate chemical substitutions made in it, which in turn result in low dielectric loss tangent, a low magnetic loss tangent at the operating bias field, a low coercive force and a large remanence ratio [6-8]. Low dielectric and magnetic losses are the essential requisites for mi- crowave applications Small amounts of Mn3+ is added to microwave Li ferrites to ensure an acceptably low di- electric loss tangent [9]. Moreover, manganese addition also alter the hysteresis property, reduces magnetocrys- talline anisotropy and magnetostriction in ferrites [9]. Non magnetic ions like Cd2+ and Ti4+ substitutions have been found to be most suitable to obtain high resistivity [10,11]. The site occupancies of the various cations known from earlier works are given as follows. Li1+ has strong preference for B-Site [12], Cd2+ has strong preference for A site [1], Ti4+ also has strong preference for B-site [13], Fe2+ has strong preference for B-site [1] and Mn3+ has strong preference for B-site [14]. From the above survey, it can be envisaged that investigations on the electrical properties of composite non-magnetic ions doping in Li-Mn ferrite may lead to more interesting results as the studies on their independent doping in Lithium ferrites have al- ready resulted in properties suitable for microwave ap- plications [10,11].In this view, the present paper aims to communicate structural and electric properties in Li0.35Cd x Ti x Mn0.1 Fe2.55–2x O4 where x varies from 0 to 0.5.2. ExperimentalSix samples of different compositions were prepared by standard ceramic technique using pure metal oxides in the form of a series Li0.35Cd x Ti x Mn0.1Fe2.55–2x O4 with x = 0.0, 0.1, 0.2, 0.3, 0.4 and 0.5. AR grade chemicals of Li2CO3, CdO, TiO2, Mn2O3 and Fe2O3 were used for the preparation of various compositions in the above ferrite series. These oxides were weighed in the required mole proportions using a single pan balance having least count 0.001 gm and mixed thoroughly in the agate-mortar in acetone for about 2 hrs. The mixture was sieved using a*Corresponding author.Influence of Composite Non Magnetic Ions (Cd-Ti) Doping on Structural and Electrical Properties of Li-Mn Ferrite 145sieve of mesh size 200 micron. The mixture of each com- position was preheated in platinum crucible and were presintered at 300˚C for 2 hours and followed by 600 Influence of Composite Non Magnetic ions (Cd-Ti) Do- ping on Structural and Electrical Properties of Li-Mn Ferrite for 4 hrs and finally sintered at 1000˚C for 8 hours.X-ray Diffractograms of various compositions were obtained using X ray diffractometer Model PW 3710. The various parameters used for X ray diffraction were Target—Cu Kα; Wavelengths λ1 = 1.54056 Å and λ2 = 1.54439 Å; Rate of Scanning—2˚/min and scanning an-gle range 2θ—20˚ to 90˚. Micrographs of various sam- ples were obtained using the scanning electron micro- scope SEM (model JSM-6360A). IR absorption peaks of various compositions were studied using PerkinElmer IR spectrometer (Model 783) with KBr as a solvent. DC resistivities of various prepared samples were studied using two probe set up. Dielectric constant and loss tan- gent in the frequency range 100 Hz - 1 MHz were also measured using HP LCR meter 4284A model.3. Results and DiscussionThe X-Ray diffraction patterns for Li0.35Cd x Ti x Mn0.1 Fe2.55–2x O4 system show sharp peaks indicating formation of single phase spinel ferrite for all compositions. How- ever trace amount of α-Fe2O3 phase is found for x = 0.3 sample. Hence the XRD of x = 0.3 composition is given in the Figure 1. The α-Fe2O3 phase is formed because at higher sintering temperature (>500˚C) there is possibil- ity for a fraction of ferric oxide to get converted into α-Fe2O3. The presence of such a phase in different ferrite is already reported by earlier workers [15].The lattice parameter increases with increasing the content of Cd2+and Ti4+ ions and is shown in Figure 2. This is in accordance with Vegard’s law. The Cd2+ ions have larger ionic radius (0.97 Å) as compared to Fe3+Figure 1. Fe2O3 pattern XRD of Li0.35Cd0.3Ti0.3Mn0.1 Fe1.95O4.Figure 2. Variation of lattice parameter with Cd and Ti content [x] in Li0.35 Cd x Ti x Mn0.1Fe2.55–2x O4 series.(0.65 Å), Ni2+ (0.74 Å) and Li1+ (0.71 Å) ions. The Cd2+ ions successively replace Fe3+ ions on A-site this results in an increase of lattice parameter with Cd content. Same is true for Ti ions at B-sites. Similar results were ob- tained when Cd and Ti were separately doped in Li fer- rite [10,11]. The compositional variations however sug- gest that the lattice parameters for composite non-mag- netic ions doping is increased to larger extent in com- parison to their separate doping in ferrites.The SEM technique was studied to understand the surface morphology of the samples. All compositions have grains with sharp boundaries indicating that grains are fully developed, well packed, crack free with clear grain boundaries. The grain boundaries are district and grains are closely packed in some cases which suggest that compositions exhibit high density values. The SEM images denoted by a, b, c, d, e, and f shows micrographs for compositions x = 0.0, 0.1, 0.2, 0.3, 0.4, and 0.5. With the addition of Cd-Ti ions the average grain size in- creases as shown in the Figures3(a)-(f). The increase in grain diameter with Cd and Ti content is attributed to the smaller solid solubility of lithium in the samples. It is obvious from the generic formula.The IR spectra of one representative member of ferrite series i.e. x = 0.3 is shown in Figure 4. The IR absorp- tion bands were observed in the range 600 cm–1 to 400 cm–1. The absorption bands obtained in the present investi- gation are found to be in the range reported for many other lithium containing ferrites [16,17]. The difference in band position ν1 and ν2 is expected because the Fe3+-O2–distance for B site (0.199 nm) is different from that of A site (0.189 nm). The tetrahedral vibrations are of bond stretching type while octahedral vibrations are of bond bending type. These types of vibrations also affect the absorption frequency. The octrahedral complex band is found to be suppressed with increase in composite non- magnetic ions content in the ferrite. This can be attri- buted to increase in the lattice parameter and average grain size with increase in Cd-Ti content.Influence of Composite Non Magnetic Ions (Cd-Ti) Doping on Structural and Electrical Properties of Li-Mn Ferrite 146(a) (b) (c)c(d) (e) (f)Figure 3. SEM of series Li0.35Cd x Ti x Mn0.1Fe2.55–2x O4 with x = 0 to 0.5.Variation of logρ vs 103/T for the samples Li0.5Cd x Ti xMn0.1Fe2.55–2x O4 and Li0.35Cd x Ti x Mn0.1Fe2.55–2x O4 with x =0, 0.1, 0.2, 0.3, 0.4, and 0.5 are shown in Figure 5. Allthe plots exhibit a linear relationship suggesting that theresistivity obeys a relation ρ =ρ0 exp(ΔE/kT) and cha-nge in slope is observed in case of all the compositions.From figure, it is seen that the variation is almost linearup to Curie temperature where a break occurs indicatinga change of magnetic ordering from ferrimagnetic to para-magnetic. The temperatures where breaks occur coincidewith the Curie temperature determined by permeabilitymeasurements which is not reported here. The exponen-tial increase in resistivity on decrease in temperature isdue to decrease in thermally activated mobility of thecharge carrier. The change in slope is attributed to thechange in the activation energy due to phase transition ofthe material from ferromagnetic to paramagnetic state.This anomaly strongly supports the influence of magneticordering upon the conductivity process in-ferrites. Manyworkers have studied logρ vs (1/T) and observed similarbehaviour suggesting that resistivity obeys the Arrheniusrelation [11,18]. Resistivity studies show that resistivity(ρdc) of the samples in the compositions increase as theCd2+, Ti4+ concentration increases similar to that reportedin 10 and 11 D.C. resistivity of Li-Cd-Ti ferrite can beexplained on the basis of a model based on phonon as-sisted electron hopping. Trace amount of Fe2+ ions arepresent in the present ferrites. The electrons are known toparticipate in the exchange process by the following re-action Fe2+↔ Fe3+ + e. Hence these electrons arestrongly coupled to the lattice and tunnel from one site tothe other due to phonon induced transfer mechanism.Ti4+ ions, being tetravalent, localize Fe2+ ions in the sys-tem and tunneling of electrons by transfer mechanism isretarded due to the reduction of Fe3+ ions which enhancesthe resistivity. The activation energy is estimated to be0.21 eV, which in turn confirms the conduction in pre-sent ferrites are due to small polarons [18].The dielectric constant decreases with increase in fre-quency showing dielectric dispersion as depicted in Fig-ure 6. The decrease in ε with frequency is natural be-cause of the fact that any species contributing to polar-izability is found to show lagging behind the appliedLi-Cd-Ti ferrite can be explained on the basis of a modelbased on phonon assisted electron hopping. Traceamountof Fe2+ ions is present in the present ferrites. The electronsare known to participate in the exchange process by thefollowing reaction Fe2+↔ Fe3+ + e. Hence these elec-trons are strongly coupled to the lattice and tunnel fromone site to the other due to phonon induced transfermechanism. Ti4+ ions, being tetravalent, localize Fe2+ions in the system & tunneling of electrons by transfermechanism is retarded due to the reduction of Fe3+ ionswhich enhances the resistivity. The activation energy isestimated to be 0.21 eV, which in turn confirms the con-duction in present ferrites are due to small polarons [18].Influence of Composite Non Magnetic Ions (Cd-Ti) Doping on Structural and Electrical Properties of Li-Mn Ferrite 1474. ConclusionThe Li 0.35Cd x Ti x Mn 0.1Fe 2.55–2x O 4 system has been suc- cessfully prepared with standard ceramic technique. The most intense (311) peak in XRD pattern confirms the formation of cubic spinel ferrite. The SEM micrograph shows the agglomerated grain structure with sharp grainboundaries due to high sintering temperature. The IR studies show the absorption bands which are in good agreement to the studied literature. The electrical proper- ties study shows the Li-ferrites are the n-type semicon- ductors. The dielectric constant shows usual dispersionbehaviour.Figure 4. IR spectra of Li 0.35Cd x Ti x Mn 0.1Fe 2.55–2x O 4 with x = 0.3.123456789101111.522.533.5Figure 5. Variation of log ρ vs 103/T for Li 0.35Cd x Ti x Mn 0.1Fe 2.55–2x O 4.14822.533.544.555.56Figure 6. Variation of dielectric constant Є vs logf for ferrite system Li 0.35Cd x Ti x Mn 0.1Fe 2.55–2x O 4.33.544.555.56Figure 7. The plot of dielectric loss tangent (tan δ) vs logf for ferrite system Li 0.35Cd x Ti x Mn 0.1Fe 2.55–2x O 4.5. AcknowledgementsAuthor K. K. Patankar is thankful to UGC, New Delhi for the financial assistance in the form of major research project extended to her.REFERENCES[1] R. G. Kharabe, R. S. Devan, C. M. Kanamadi and B. K.Chougule, “Dielectric Properties of Mixed Li-Ni-Cd Fer- rites,” Smart Materials and Structures , Vol. 15, No. 2, 2006, pp. 229-334. doi:10.1088/0964-1726/15/2/N02[2] S. R. Sawant, D. N. Bhosale, N. D. Chaudhari and P. P.Bakare, “Electric Properties of NiCuZn Ferrites Synthe- sized by Oxalate Precursor Method,” Journal of Materi- als Science , Vol. 3, 2002, pp. 617-622. [3] B. P. Ladgaonkar, P. N. Vasambekar and A. S. Vain-gankar, “Structural and DC Electrical Resistivity Study of Nd3+ Substituted Zn-Mg Ferrites,” Journal of Materials Science Letters , Vol. 19, No. 5, 2000, pp. 1375-1377. doi:10.1023/A:1006713518433 [4] M. Pardavi-Horvath, “Microwave Applications of SoftFerrites,” Journal of Magnetism and Magnetic Materials , Vol. 215-216, 2000, pp. 171-183.Influence of Composite Non Magnetic Ions (Cd-Ti) Doping on Structural and Electrical Properties of Li-Mn Ferrite 149doi:10.1016/S0304-8853(00)00106-2[5]V. Voronkov, “Microwave Ferrites: The Present and Fu-ture,” Journal of Physics IV (Paris), Vol. 7, No. 1, 1997, pp. 35-38.[6] D. Ravinder, “Dielectric Behaviour of Lithium-CadmiumFerrites,” Physica Status Solidi (A), Vol. 129, No. 2, 1992,pp. 549-554. doi:10.1002/pssa.2211290225[7]S. S. Bellad, S. C. Watawe and B. K. Chougule, “SomeAc Electrical Properties of Li-Mg Ferrites,” Materials Re- search Bulletin, Vol. 34, No. 7, 1999, pp. 1099-1106.doi:10.1016/S0025-5408(99)00107-5[8]V. P. Reddy and D. V. Reddy, “Far-Infrared Spectral Stu-dies of Some Lithium-Nickel Mixed Ferrites,” Journal ofMagnetism and Magnetic Materials, Vol. 136, No. 3, 1994,pp. 279-283. doi:10.1016/0304-8853(94)00321-1[9]P. P. Hankare, R. P. Patil, U. B. Sankpal, S. D. Jadhav, I.S. Mulla, K. M. Jadhav and B. K. Chougule, “Magnetic and Dielectric Properties of Nanophase Manganese-Sub- stituted Lithium Ferrite,” Journal of Magnetism and Mag-netic Materials, Vol. 321, No. 19, 2009, pp. 2977-3372.doi:10.1016/j.jmmm.2009.05.074[10]R. G. Kharabe, R. S. Devan and B. K. Chougale, “Struc-tural and Electrical Properties of Cd-Substituted Li-Ni Fer-rites,” Journal of Alloys and Compounds, Vol. 463, No.1-2, 2008, pp. 67-72.[11] D. Kothari, S. Phanjoubam and J. S. Baijal, “ElectricalConduction and Dielectric Behaviour of the Oxidic SpinelLi0.5+0.5x Cr0.3Ti x Fe2.2−1.5X O4,” Journal of Materials Sci- ence, Vol. 25, No. 12, 1990, pp. 5142-5146.doi:10.1007/BF00580142[12]S. Chander, M. P. Sharma, A. Krishnamurthy and B. K.Srivastava, “Mössbauer Study of Nano-Particles of SpinelFerrites Li x Fe3−x O4,” Indian Journal of Pure and Applied Physics, Vol. 45, No. 10, 2007, pp. 816-821. [13]K. P. Chaea, J. G. Lee, H. S. Kweona and Y. B. Lee, “TheCrystallographic, Magnetic Properties of Al, Ti Doped CoFe2O4 Powders Grown by Sol-Gel Method,” Journalof Magnetism and Magnetic Materials, Vol. 283, No. 1, 2004, pp. 103-108. doi:10.1016/j.jmmm.2004.05.010 [14]K. K. Patankar, “Synthesis and Characterization of Mag-netoelectric Composites,” Ph.D. Thesis, Shivaji Univer-sity, Kolhapur, 2000.[15] A. F. Junior, E. C. de O. Lima, M. A. Novak and P. R.Wells, “Synthesis of Nanoparticles of Co x Fe(3−x)O4 by Combustion Reaction Method,” Journal of Magnetism and Magnetic Materials, Vol. 308, No. 2, 2007, pp. 198- 202. doi:10.1016/j.jmmm.2006.05.022[16] B. K. Bammannavar, L. R. Naik, R. B. Pujar and B. K.Chougule, “Preparation, Characterization and Physical Pro- perties of Mg-Zn Ferrites,” Indian Journal of Pure and Applied Physics, Vol. 14, No. 5, 1998, pp. 381-385. [17]P. V. Redy and V. D. Reddy, “Far-Infrared Spectral Stud-ies of Some Lithium-Nickel Mixed Ferrites,” Journal of Magnetism and Magnetic Materials, Vol. 136, No. 3, 1994, pp. 279-283. doi:10.1016/0304-8853(94)00321-1[18]R. S. Patil, S. V. Kakatkar, S. A. Patil, P. K. Maskar andS. R. Sawant, “Electrical Properties of Ferrites,” IndianJournal of Pure and Applied Physics, Vol. 29, 1991, pp.131-135.[19]V. P. Reddy and D. V. Reddy. “Far-Infrared SpectralStudies of Some Lithium-Nickel Mixed Ferrites,” Journalof Magnetism and Magnetic Materials, Vol. 136, No. 3, 1994, pp. 279-283. doi:10.1016/0304-8853(94)00321-1 [20]S. A. Rahman, “Temperature, Frequency and Composi-tion Dependence of Dielectric Properties of Nb Substi- tuted Li Ferrite,” Egyptian Journal of Solids, Vol. 29, No.1, 2006, pp. 131-141.。

相场模拟的基本思想和流程

相场模拟的基本思想和流程The basic idea behind phase-field simulation is to model the evolution of microstructural features in materials by considering them as continuous fields that evolve over time. 相场模拟的基本思想是通过将材料的微观结构特征视为随时间演化的连续场来建模。

In this type of simulation, the evolution of these fields is governed by a set of partial differential equations that describe the kinetics of phase transformations. 在这种类型的模拟中，这些场的演变受到一组描述相变动力学的偏微分方程的控制。

By solving these equations numerically, researchers can study the complex interactions between different phases and understand how microstructural features develop over time. 通过数值求解这些方程，研究人员可以研究不同相之间复杂的相互作用，并了解微观结构特征随时间发展的过程。

One of the key advantages of phase-field simulation is its ability to capture the dynamics of microstructural evolution without the need for explicit interfaces. 相场模拟的一个关键优势是它能够捕捉微观结构演化的动态过程，而无需明确的界面。

步进电机驱动器(24VDC伺服)说明书

Instruction ManualStep Motor Driver (24 VDC Servo) Pulse input type Series LECPA###-#The intended use of the step motor driver is to control the movement of an electrical actuator in response to step data and electrical inputs.These safety instructions are intended to prevent hazardous situations and/or equipment damage. These instructions indicate the level of potential hazard with the labels of “Caution,” “Warning” or “Danger.”They are all important notes for safety and must be followed in addition to International Standards (ISO/IEC) *1), and other safety regulations.IEC 60204-1: Safety of machinery - Electrical equipment of machines. (Part 1: General requirements)ISO 10218-1: Robots and robotic devices - Safety requirements for industrial robots - Part 1: Robots.• Refer to product catalogue, Operation Manual and Handling Precautions for SMC Products for additional information. • Keep this manual in a safe place for future reference.CautionCaution indicates a hazard with a low level of risk which, if not avoided, could result in minor or moderate injury.WarningWarning indicates a hazard with a medium level of riskwhich, if not avoided, could result in death or serious injury.DangerDanger indicates a hazard with a high level of risk which, ifnot avoided, will result in death or serious injury.Warning• Always ensure compliance with relevant safety laws and standards.• All work must be carried out in a safe manner by a qualified person in compliance with applicable national regulations.2.1General specificationsItemSpecificationsCompatible motorStep motor (servo 24 VDC)Power supply voltage24 VDC +/-10%(motor drive control, stop, lock brake release).Current consumption 3 A (Peak 5 A) maximum Parallel Inputs 5 inputs (photo-coupler isolation) Parallel Outputs 9 outputs (photo-coupler isolation)Compatible encoderIncremental A/B phase(resolution: 800 pulses / rotation)Serial communication RS485Lock controlForced lock release terminal (applicable tonon-magnetizing lock). Cable lengthIO cable: 5 m maximumActuator cable: 20 m maximumCooling method Natural air-cooling Operatingtemperature0o C to 40o C (no freezing)Storage temperature -10o C to 60o C (no freezing) Operating humidity 90% RH or less (no condensation)Insulation resistance50 MΩ (500 VDC)between external terminals and caseWeight120 g (Direct mounting type)140 g (DIN rail mounting type)WarningSpecial products (-X) might have specifications different from those shown in this section. Contact SMC for specific drawings.4 Installation4.1 InstallationWarning• Do not install the product unless the safety instructions have been read and understood.• Design the installation so that the temperature surrounding the controller is within the specified operating temperature. Leave enough space between the controllers so that the operating temperature of the controllers remains within the specification range.• Mount the controller vertically with 30 mm minimum space on the top and bottom of the controller as shown below.• Allow 60 mm minimum space between the front of the controller and a door (lid) so that the connectors can be connected and disconnected.4.2 Mounting• The controller can be direct mounted using screws or mounted on a DIN rail (model LECPA##D).• When using DIN rail mounting, hook the controller on the DIN rail and press the lever down to lock it.CautionIf the mounting surface for the controller is not flat or is uneven, excessive stress may be applied to the enclosure, which can cause failure. Be sure to mount on a flat surface. 4.3 EnvironmentWarning• Do not use in an environment where corrosive gases, chemicals, salt water or steam are present.• Do not use in an explosive atmosphere.• Do not expose to direct sunlight. Use a suitable protective cover.• Do not install in a location subject to vibration or impact in excess of the product’s specifications.• Do not mount in a location exposed to radiant heat that would result in temperatures in excess of the product’s specifications.• Avoid mounting the controller near a vibration source, such as a large electromagnetic contactor or circuit breaker on the same panel. • Do not use in an environment with strong magnetic fields present. 4.4 WiringCaution• Do not perform wiring while the power is on. • Confirm proper insulation of wiring.• Do not route wires and cables together with power or high voltage cables.• Keep wiring as short as possible to prevent interference from electromagnetic noise and surge voltage.• Do not use an inrush current limited type of power supply for the controller.• Do not connect multiple wires to one connector terminal.Power Supply ConnectorWire the power supply cable to the power supply plug connector, then insert it into connector PWR on the driver.• Use special screwdriver (Phoenix Contact No. SZS0.4×2.0) to open / close lever and insert the wire into the connector terminal.Power Supply Wire specificationsPrepare the wiring according to the following specifications (to be prepared by the user).ORIGINAL INSTRUCTIONSPower supply connector. SMC Part No. LEC-D-1-1. Phoenix Contact Part No: FK-MC0.5/5-ST-2.510 mm minimum Driver30 mm min. (Direct mounting) 50 mm min. (DIN rail mounting)30 mm minimumParallel I/O Connector• When connecting the parallel I/O connector to a PLC use an SMC parallel I/O cable (LEC-CL5-#).• There are 2 types of parallel I/O with this controller: NPN type and PNP type. Check the polarity required before use.The parallel I/O wiring should be prepared according to the polarity.For further details of the Parallel I/O wiring refer to the Operation Manual on the SMC website (URL: https:// ).4.5 Ground connection• Place a ground cable with crimped terminal under one of the M4 mounting screws with a shakeproof washer and tighten the screw.CautionThe M4 screw, cable with crimped terminal and shakeproof washer must be prepared by the user.The controller must be connected to Ground to reduce noise. If higher noise resistance is required, ground the 0 V (signal ground). When grounding the 0 V, avoid flowing noise from ground to 0 V.• A dedicated Ground connection must be used. Grounding should be to a D-class ground (ground resistance of 100 Ω maximum).• The cross-sectional area of the ground cable shall be 2 mm 2 minimum. • The Grounding point should be as near as possible to the controller. Keep the grounding cable as short as possible.In order to move the electric actuator to a specific position, it is necessary to set up the patterns of operation with a PC using the controller setting software or by using a teaching box. This set up data will be recorded in the memory of the controller.Step data describes the data that sets items of operation (such as positioning width) excluding speed, position, acceleration, and deceleration, which are determined by the pulse-signal input. Step data will become effective as soon as it is recorded into the driver.Refer to the Operation Manual on the SMC website (URL: https:// ) for further setting details.Refer to the table below for details of the LED status.LEDDescriptionPWROFFPower is not supplied Green LED is ON Power is suppliedGreen LED is flashingEEPROM memory writing ALM OFFNormal operationRed LED is ONController Alarm generated7 How to OrderRefer to the catalogue on the SMC website (URL: https:// ) for the How to Order information.8 Outline Dimensions (mm)Refer to the drawings / operation manual on the SMC website (URL: https:// ) for outline dimensions.9 Maintenance9.1 General MaintenanceCaution• Not following proper maintenance procedures could cause the product to malfunction and lead to equipment damage.• Before performing maintenance, turn off the power supply. Check the voltage with a tester 5 minutes after the power supply is turned OFF. • If any electrical connections are disturbed during maintenance, ensure they are reconnected correctly and safety checks are carried out as required to ensure continued compliance with applicable national regulations.• Do not make any modification to the product.• Do not disassemble the product, unless required by installation or maintenance instructions.Caution• Maintenance should be performed according to the procedure indicated in the Operation Manual.• When equipment is serviced, first confirm that measures are in place to prevent dropping of work pieces and run-away of equipment, etc, then cut the power supply to the system. When machinery is restarted, check that operation is normal with actuators in the correct position.Warning• Perform maintenance checks periodically.• Confirm wiring and screws are not loose. Loose screws or wires may cause unexpected malfunction.• Conduct an appropriate functional inspection and test after completing maintenance. In case of any abnormalities (if the actuator does not move, etc.), stop the operation of the system. Otherwise, an unexpected malfunction may occur and it will become impossible to ensure safety. Operate an emergency stop instruction to confirm safety. • Do not put anything conductive or flammable inside of the controller. • Ensure sufficient space around the controller for maintenance.10 Limitations of Use10.1 Limited warranty and Disclaimer/Compliance Requirements Refer to Handling Precautions for SMC Products.11 Product disposalThis product shall not be disposed of as municipal waste. Check your local regulations and guidelines to dispose of this product correctly, in order to reduce the impact on human health and the environment.12 ContactsRefer to or www.smc.eu for your local distributor / importer.URL: https:// (Global) https://www.smc.eu (Europe) SMC Corporation, 4-14-1, Sotokanda, Chiyoda-ku, Tokyo 101-0021, Japan Specifications are subject to change without prior notice from the manufacturer. © 2021 SMC Corporation All Rights Reserved. Template DKP50047-F-085MPin No. Insulation Colour Dot mark Dot colour Category Signal 1 Light brown ● Black 24 V COM+ 2 Light brown ● Red 0 V COM- 3 Yellow ● Black Pulse signal NP+ 4 Yellow ● Red Pulse signal NP- 5 Light green ● Black Pulse signal PP+ 6 Light green ● Red Pulse signal PP- 7 Grey ● Black Input SETUP 8 Grey ● Red Input RESET 9 White ● Black Input SVON 10 White ● Red Input CLR 11 Light brown ●● Black Input TL 12 Light brown ●● Red Output TLOUT 13 Yellow ●● Black Output WAREA 14 Yellow ●● Red Output BUSY 15 Light green ●● Black Output SETON 16 Light green ●● Red Output INP 17 Grey ●● Black Output SVRE 18 Grey ●● Red Output ESTOP19White ●● Black Output ALARM 20White ●● Red Output AREA。

EN 4K ACTION CAMERA WITH WIFI 80-83002 说明书

2021CHOKING HAZARD — Small parts. Not for children under 3 years.WARNING:80-83002EN4K ACTION CAMERA WITH WIFIINSTRUCTION MANUAL22021This product is a high-definition digital motion video recording device tailored to market demand. It has a variety of industry-leading features including video recording, photo shooting, audio recording, videodisplay and rechargeable battery, which makes it perfect for vehicledata recording, photo-shooting, outdoor sports, deep-water probing.3202142021About this Instruction Manual Please read the safety instructions and the operating instructions carefully before use. Keep these instructions for renewed use at a later date. When the device is sold or given to someone else, the instruction manual must be provided to the new owner/user of the product.Read these safety instructions before using your device and store them for possible future reference. This product is intended only for private use. It was developed as an electronic medium for the use of multimedia services.Important Safety Instructions 1) Read these instructions.2) Keep these instructions.3) Heed all warnings.4) Follow all instructions.5) Store the device in cool, dry and dust-proof places.6) Do not use this apparatus near water unless the unit is securely enclosed in the waterproof housing. 7) Clean only with dry cloth.8) Never touch the lens surface with your fingers.9) Do not block any ventilation openings. Install in accordance with the manufacturer’s instructions.10) Never point the camera lens directly at the Sun. Doing so may damage the image sensor. 11) Do not place or store the device near any heat sources such as radiators, heat registers, stoves, or other apparatus (including amplifiers) that produce heat.12) Do not defeat the safety purpose of the polarized or grounding-type plug. A polarized plug has two blades with one wider than the other. A grounding type plug has two blades and a third grounding prong. The wide blade or the third prong are provided for your safety. If the provided plug does not fit into your outlet, consult an electrician for replacement of the obsolete outlet.13) The charging cord should always be readily accessible.14) While it is charging, keep the product and the power cord out of the reach of children to prevent accidental suffocation or electric shock. 15) Protect the power cord from being walked on or pinched particularly at plugs, convenience receptacles, and the point where they exit from the apparatus.EN 16) In case of overheating, smoke, or unpleasant smell in the process of charging, unplug your device immediately to prevent a fire.17) If the charging cord is damaged, have it repaired by the manufacturer, its service or a similarly qualified person in order to avoid any hazard.18) Replacing the battery incorrectly or with a battery that is not the same type or its equivalent could result in an explosion.19) The battery should not be exposed to excessive heat such as sunlight, fire or any heat sources such as radiators, heat registers, stoves, or other apparatus (including amplifiers) that produce heat.20) The battery must be installed according to the polarity.21) The battery must be disposed of safely. Always use the collection bins provided (check with your dealer) to protect the environment.22) Non-rechargeable batteries are not to be recharged.23) Rechargeable batteries must be removed from the unit before being charged, and should only be charged under adult supervision.24) Do not short-circuit the supply terminals.25) Only use attachments/accessories specified by the manufacturer or sold with the apparatus. Whena cart is used, use caution when moving the cart/apparatus combination to avoid injury from tip-over.26) Unplug this apparatus during lightning storms or when unused for long periods of time.27) Refer all servicing to qualified service personnel. Servicing is required when the apparatus has been damaged in any way, such as power-supply cord or plug is damaged, liquid has been spilled or objects have fallen into the apparatus, the apparatus has been exposed to rain or moisture, does not operate normally, or has been dropped.28) Do not expose the unit to strong magnetic objects or strong radio waves. Strong magnetic fields may cause product malfunctions or damage to images and sounds.29) If the unit has not been operated in a long time, check whether the camera operates normally or not before using the camera again.30) Always backup or download any data from any memory card before reusing. It is recommended that you test any memory card to make sure it is properly storing the data before any imaging session.31) Please choose branded Micro SD card. Neutral cards are not guaranteed to work normally.32) Do not place Micro SD card near strong magnetic objects to avoid data loss.52021General Warnings• Risk of choking! — Keep packaging material, like plastic bags and rubber bands, out of the reachof children, as these materials pose a choking hazard. This product contains small parts that could be swallowed by children.• Leaking battery acid can lead to chemical burns! Avoid contact of battery acid with skin, eyes and mucous membranes. In the event of contact, rinse the affected region immediately with a plenty of water and seek medical attention.• Risk of electric shock! — Never bend, pinch or pull the power and connecting cables, extensions and adapters. Protect the cables from sharp edges and heat. Before operating, check the device, cables and connections for damage. Never use a damaged unit or a unit with damaged power cables. Damaged parts must be exchanged immediately by an authorized service centre.• Risk of property damage! — Do not disassemble the device. In the event of a defect, please contact your dealer. The dealer will contact the Service Centre and can send the device in to be repaired, if necessary.• Do not expose the device to high temperatures! Use only the supplied power adapter. Do not short-circuit the device or throw it into a fire. Excessive heat or improper handling could trigger a short-circuit, a fire or an explosion.• Do not interrupt an ongoing data connection to a computer before all data has been transferred! This could lead to data loss for which the manufacturer is not liable.CAUTIONRISK OF EXPLOSION IF BATTERY IS REPLACED BY AN INCORRECT TYPE.Disposal of a battery into fire or a hot oven, or mechanically crushing or cutting of a battery, that can result in an explosion.Leaving a battery in an extremely high temperature surrounding environment that can result in an explosion or the leakage of flammable liquid or gas.A battery subjected to extremely low air pressure that may result in an explosion or the leakage of flammable liquid or gas.62021EN Notes on CleaningTurn off the camera. Clean the eyepieces and/or lenses only with a soft, lint-free cloth, (e.g. microfibre cloth). To avoid scratching the lenses, use only gentle pressure with the cleaning cloth. Only use a dry cloth to clean the exterior of the device. To avoid damaging the electronics, do not use any cleaning fluid. Clean the protective case after each use with clear, clean water and dry it thoroughly.DisposalDispose of the packaging materials properly, according to their type, such as paper orcardboard. Contact your local waste-disposal service or environmental authority forinformation on the proper disposal.The integrated battery must only be removed for disposal. Opening the device housing candamage the unit. Drain the battery completely before disposal. Remove all the screws in thehousing and open the device housing. Remove the connections to the battery and remove it.Cover the open contacts with tape and package the battery in such a way that it cannot shift in the packaging.72021FCC ID: 2ASJU80-83002CAUTION: Changes or modifications not expressly approved by the party responsible for compliance could void the user‘s authority to operate the equipment. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:.- Reorient or relocate the receiving antenna.- Increase the separation between the equipment and receiver.- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.- Consult the dealer or an experienced radio/TV technician for help.This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.FCC SAR statementThis equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End user must follow the specific operating instructions for satisfying RF exposure compliance. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. The portable device is designed to meet the requirements for exposure to radio waves establishedby the Federal Communications Commission (USA). These requirements set a SAR limit of 1.6 W/kg averaged over one gram of tissue. The highest SAR value reported under this standard during product certification for use when properly worn on the body. The device has been tested for uses against the head and body-worn operations, with 5mm separation in Specific Absorption Rate (SAR) testing.82021Supplier’s Declaration of Conformity47 CFR § 2.1077 Compliance InformationUnique IdentifierTrade Name: Explore OneModel No.: 80-83002Responsible Party – U.S. Contact InformationUS Company Name: Explore Scientific, LLC.Address: 1010 S. 48th Street, AR, 72762Telephone number or internet contact information: 866.252.3811FCC Compliance StatementThis device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.920210509121020211120214K CameraWaterproof CaseFlat Adhesive MountsHandle Bar/Pole MountFrame Housing MountStrapsLong Thumb ScrewQuick Release BucklePivot MountsShort Thumb ScrewUSB CableMicroFlash Card and Adapter01020304050607080910111212Product Features 1. A waterproof casing that allows you to film fascinating water sports; waterproof up to 30 metres under water 2. 2 in (50.8mm) screen that displays and replays fascinating videos recorded.3. Support storage cards up to 64GB maximum.download videos and photos. 6. 140° wide-angle lens.13Operatingrequirements:2. ChargingA. Connected to a computer or power adapter via USB cable for charging.B. Charging of the action camera can be done even when it’s powered off.C. When it is charging, the red indicator light will glow, and when charging is complete, it will turn off.3. Turning camera on and offPress and hold the power switch for three to five seconds to turn the camera on or off.4. Mode SwitchingA. Press the [Power On-Off / mode] button [] repeatedly to cycle through the cameramodes.Camera mode Description1420215. How to record videos and configure recording setting5.1. Video RecordingTurn the camera on. You will start with the video recording mode. Insert a MicroFlash card and start recording by pressing “OK”. Press “OK” again if you want to stop the recording.5.2. Photo shootingSwitch to photo shooting mode by pressing []. Press ”OK” to take photos.5.3 Slow Motion1. From the menu, open video settings.2. Select the slow motion option.3. Select the “720P 120” or “1080P 60” option. The camera will now take video at 120 or 60 frames per second and play it back at 30 frames per second.5.4 Playback1. Verify the camera is in the playback menu.2. Press the “UP” or “DOWN” button to select a file.3. Press the “OK” button to play the selected video.4. Long press the “OK” button, a prompt appears asking, “Delete this file?”. You can delete files here.5.5. SettingSwitch to setting mode by pressing []. There will be an icon in the center. Press “OK,”“UP,” or “DOWN” button to set.5.6. File Storage and Play backThe USB cable is for charging camera only.Take the MicroFlash card out of the camera and access the images on a computer with a card reader for play back and storage.1520216. Connecting to WiFiTo connect the camera to an Android or Apple iOS smart device follow these steps:1. Download the XDV app from the application store on your smart device and install it.2. Turn on the camera and press the WiFi button on the side of the device. The WiFi logo will appear on the screen.3. Using your smart device’s WiFi settings, locate the camera’s WiFi connection. It will appear as SSID: EXPLOREONE followed by the camera’s serial number. The default password will be a random 10 digit number shown on the camera’s screen.4. Once connected, the XDV app can be used to view images in real time. It can also be used to control the camera’s video functions, take photos and download content directly to your device. Please Note: Instructions for viewing and saving videos on mobile phones.Video on the XDV app can be saved directly to your phone.162021Unable to connect to WiFi?First, make sure your smart device’s WiFi is turned on. Press the power button on the camera and press the WiFi button on the side of the device. The WiFi logo will appear on the screen. If no connection, it is recommended to power off and power on both the camera and your smartdevice and repeat the steps. Also check for any app updates.172021182021How to Open and Close the Waterproof Case How to Open:Press and hold down the switch(1) and then use the arrow (2) toopen the clamp (3).1232How to Close:Press the case door all theway down (1) and then snapthe clamp to the hinge (2).Now, simply press the clampdown (3) to close.1192021202021Base Mount Example4K CameraCase Quick Release Buckle Flat Adhesive Mount 4K CameraFrame Housing Mount Pivot Mount Flat Adhesive Mount Quick Release Buckle212021Helmet Mount Example4K CameraCaseQuick Release Buckle Flat Adhesive Mount4K CameraFrame Housing MountQuick Release Buckle Flat Adhesive MountStraps222021Pole/Bicycle Mount Example4K CameraWaterproof Case Pivot Mount Pole Mount4K CameraHousing Mount Pivot Mounts Pole Mount23 2021Technical DataDisplay 2.0 (50.8 mm) inch displayLens140° wide angleWaterproof case Up to 30 m (100 ft)Language options English/Traditional Chinese/SimplifiedChinese/Russian/Portuguese/Spanish/Japanese/German/French/Polish/ItalianResolution of photos20 M(by interpolation)16 M(by interpolation)12 M(by interpolation)8 M5 MResolution of videos4K @ 30FPS (by interpolation)2.7K @ 30FPS (by interpolation)1080p @ 60FPS1080p @ 30FPS720p @ 120FPS720p @ 60FPS242021252021Please regard the actual product as the standard.26202127 2021282021#80-83002©2021 Explore Scientific, LLC.1010 S 48th Street, Springdale, AR 72762All rights reserved. | 866.252.3811Made in China.V072021HIPO©2021 National Geographic Partners LLC.All rights reserved. NATIONAL GEOGRAPHIC and Yellow Border Design are trademarks of the National Geographic Society, used under license.。

X射线衍射测量晶体温度

X射线衍射测量晶体温度高凤菊【摘要】From the usual mercurial thermometer to the thermal radiation thermometer, temperature measurement technology continues to emerge and more and more methods come into being. A new temperature measurement method is presented. The temperature by diffraction of ray is measured. In the range from room temperature to 440℃, the temperature of MgO single crystal is measured by X-ray diffraction. First, the (002) diffraction peak of MgO crystal was measured at different temperatures. The (002) peaks are very sharp. The peak pattern is Gaussian function. The position of peak moves to the low angle as the increasing of temperature. Then, the spacing of (002) lattice plane was calculated according to the position of the peak. As the relationship between the interplanar spacing and the temperature is known, the real temperature of the sample is gained. Measuring temperature of crystal by X-ray diffraction is not only interesting from the view of temperature measurement method but also providing a new precise way to measure temperature for in situ high temperature X-ray diffraction.%从常温到440℃的温度区间内,采用X射线衍射测量了MgO单晶的温度.测量了不同温度下MgO单晶的(002)衍射峰,发现MgO单晶的(002)衍射峰很尖锐、峰型呈高斯函数状,峰位随温度升高向低角方向移动明显.根据峰位计算了(002)晶面间距,根据晶面间距与样品温度之间的关系,测得了样品的实际温度.为测量晶体温度提供了一种新的方法,为材料的高温X射线衍射实验提供了更为精确的测温途径.【期刊名称】《实验技术与管理》【年(卷),期】2012(029)012【总页数】3页(P48-50)【关键词】晶体温度;X射线衍射;MgO【作者】高凤菊【作者单位】石家庄铁道大学数理系,河北石家庄050043【正文语种】中文【中图分类】TG115.22全辐射温度计、光学高温度计、光电高温度计和比色高温计是通过测量物体的热辐射能量，并转化为光信号或电信号来测量温度的［1］。

Aspergillusfumig...

Downloaded from on January 21, 2016
Aspergillus fumigates causes a diverse spectrum of human diseases, including allergic bronchopulmonary aspergil-
Inhibition ofProtein Synthesis. AspfI and mitogillin were used to inhibit protein synthesis in a rabbit reticulocyte lysate in vitro translation system for Brome Mosaic Virus (Promega Biotec,
IgE Antibody Assays. mAb 4A6 was used in a solid-phase RIA to present Asp fI to IgE antibodies. Bound IgE antibodies were detected by the addition of 2 ng affinity-purified, '211-labeled goat anti-human IgE . Specific IgE antibody to AspfI or to mitogillin was also determined by double antibody antigen-binding RIA (10) . IgE antibody to A.fumigates was measured by quantitative radioallergosorbent test (RAST) (11) .
losis (ABPA), asthma, aspergilloma, and invasive infection in immunocompromised hosts (1) . The respiratory tract of patients with chronic pulmonary diseases, particularly cystic fibrosis (2, 3), is frequently colonized by A . fumigates . However, despite the ability of the fungus to cause tissue invasion, respiratory colonization by A . fumigates is often regarded as saprophytic or benign . Serologic studies have shown that colonization can induce IgG and/or IgE antibodies to several A . fumigatus antigens (4-7), however, the structure and function of these antigens are largely unknown . In this report, we describe the purification of an 18-kD IgE-binding protein from A . fumigatus (Asp f I) that is selectively expressed in A . fumigatus . Structural, functional, and antigenic analyses show that Asp f I is a member of the mitogillin family of cytotoxins (8, 9) .

材料科学-相场模拟简介

相场方法模拟调幅分解
Fe-Mo合金的调幅分解，进一步耦合弹性应力场
忽略弹性应力的组织演化
考虑弹性应力的组织演化
弹性应力对CMo=0.5合金调幅分解的影响（ T=500℃ ）
(a)t=5000；(b)t=10000；(c)t=20000；(d)t=50000
相场模拟的进展
温度场，浓度场，流场等多场耦合技术的实现相场晶体模型（ Phase Field Crystal Modeling ）
相场法模拟树枝晶生长
相场方法模拟凝固过程
要从固相和液相的过渡态找出一个序参量作为过渡态的表征·······
纯物质固液相的区别
ห้องสมุดไป่ตู้
相场方法模拟凝固过程
纯物质序参量-自由能函数
相场方法模拟凝固过程
要在相场动力学方程中采用各项异性因子的方法体现各项异性，图示为六次对称，各项异性
因子为
纯物质凝固的各项异性生长
t=300
t=800
t=10000
相场模拟磁畴生成及畴界演化
相场方法模拟凝固过程
相场方法模拟凝固现象可得到一般的微观组织形貌演化过程；相场方法在凝固模拟中的应用包括纯物质的凝固，合金凝固，
定向凝固过程等等；除相场动力学方程，还需要考虑传热方程，传质方程和流体力
学方程，以及各项异性问题；
相场法模拟等轴晶生长（自适应有限元法）
多元序参量场的发展和应用计算技术的升级实践中的广泛应用
Diffuse interface 弥散界面（相场界面）
明锐界面与弥散界面
Stefan problem equations
Phase field equations
两种方法的不同（以纯物质凝固模拟为例）

电能表专业术语中英文对照

电能表专业术语中英文对照有功电度表——watt-hour meter静止式有功电度表——static watt-hour meter多费率电度表——multi-rate meter仪表型式——meter type测量器件——measuring element测试输出——test output工作指示器——operation indicator贮存器——memory非易失贮存器——non-volatile memory显示器——display计度器——register电流线路——current circuit电压线路——voltage circuit辅助线路——auxiliary circuit常数——constant室内仪表——indoor meter室外仪表——outdoor meter表底——base插座——socket表盖——meter cover表壳——meter case可触及导电部件——accessible conductive part保护接地端——protective earth terminal端子座——terminal block端子盖——terminal cover间隙——clearance爬电距离——creepage distance基本绝缘——basic insulation附加绝缘——supplementary insulation双重绝缘——double insulation加强绝缘——reinforced insulationI类防护绝缘包封仪表——insulating encased meter of protective class I II类防护绝缘包封仪表——insulating encased meter of protective class II 参比电流——reference current基本电流*〔Ib)——basic current 〔Ib)额定电流*〔In)——rated current 〔In)最大电流*〔Imax)——maximum current 〔Imax)参比电压*〔Un)——reference voltage〔Un)参比频率——reference frequency等级指数——class index百分数误差——percentage error影响量——influence quantity参比条件——reference conditions由影响量引起的误差改变量——variation of error due to an influence quantity 畸变因数——distortion factor电磁骚扰——electromagnetic disturbance参比温度——reference temperature平均温度系数——mean temperature coefficient额定工作条件——rated operating conditions规定的测量范围——specified measuring range规定的工作范围——specified operating range极限工作范围——limit range of operation贮存和运输条件——storage and transport conditions正常工作位置——normal working position热稳定性——thermal stability型式试验——type test电度表型号——meter type标准表——reference meter无功功率〔乏〕——reactive power(var)无功电能〔乏一小时〕——reactive energy(var-hour)单相电路中无功电能——reactive energy in a single-phase circuit三相电路中无功电能——reactive energy in a three-phase circuit无功电度表——var-hour meter静止式无功电度表——static var-hour meter多费率仪表——multi-rate meter无功功率的方向和符号——directions and sign of reactive power测量元件——measuring element输出装置——output devices感应式仪表——induction meter仪表转子——meter rotor仪表驱动元件——meter driving element仪表制动元件——meter braking element仪表计度器〔计数机构〕——register of a meter(counting mechanism)仪表底座——meter base仪表插座——meter socket仪表基架——meter frame接线端座——terminal block接线端盖——terminal cover基本转速——basic speed基本转矩——basic torque仪表常数——meter constant绝缘——insulation型式——type型式检验——type test型式验证程序——type approval procedure鉴定程序——qualification procedure影响量或影响因数——influence quantity or factor垂直工作位置——vertical working position等级指数——class index测量单元——measuring unit数据处理单元——data processing unit多功能电能表——multifunction watthour meter需要周期——demand interval最大需量——maximum demand滑差时间——sliding window time尖、峰、谷、平时段——〔sharp、peak、shoulder、off—peak time consumption〕额定最大脉冲频率——rated maximum impulse frequency最大需量复零装置——maximum demand reset zero unit辅助电源——auxiliary supply电磁骚扰——electromagnetic disturbance产品——item修理的产品——repaired item不修理的产品——non-repaired item服务——service规定功能——required function时刻——instant of time时间区间——time interval持续时间——time duration累积时间——accumulated time量度——measure工作——operation修改——modification(of an item)效能——effectiveness固有能力——capability耐久性——durability可靠性——reliability维修性——maintainability维修保障性——maintenance support performance可用性——availability可信性——dependability失效——failure致命失效——critical failure非致命失效——non-critical failure误用失效——misuse failure误操作失效——mishandling failure弱质失效——weakness failure设计失效——design failure制造失效——manufacturing failure老化失效；耗损失效——ageing failure；wearout failure突然失效——sudden failure渐变失效；漂移失效——gradual failure；drift failure灾变失效——cataleptic failure关联失效——relevant failure非关联失效——non-relevant failure独立失效——primary failure从属失效——secondary failure失效原因——failure cause失效机理——failure mechanism系统性失效；重复性失效——systematic failure；reproducible failure 完全失效——complete failure退化失效——degradation failure部分失效——partial failure故障——fault致命故障——critical fault非致命故障——non-critical fault重要故障——major fault次要故障——minor fault误用故障——minor fault误操作故障——mishandling fault弱质故障——weakness fault设计故障——design fault制造故障——manufacturing fault老化故障；耗损故障——ageing fault；wearout fault程序－敏感故障——programme-sensitive fault数据－敏感故障——data-sensitive fault完全故障；功能阻碍故障——complete fault；function-preventing fault 部分故障——partial fault持久故障——persistent fault间歇故障——intermittent fault确定性故障——determinate fault非确定性故障——indeterminate fault潜在故障——latent fault系统性故障——systematic fault故障模式——fault mode故障产品——faulty item过失——error失误——mistake工作状态——operating state不工作状态——non-operating state待命状态——standby state闲置状态；空闲状态——idle state；free state不能工作状态——disable state；outage处因不能工作状态——external disabled state不可用状态；内因不能工作状态——down state；internal disabled state 可用状态——up state忙碌状态——busy state致使状态——critical state维修——maintenance维修准则——maintenance philosophy维修方针——maintenance policy维修作业线——maintenance echelon；line of maintenance维修约定级——indenture level(for maintenance)维修等级——level of maintenance预防性维修——preventive maintenance修复性维修——corrective maintenance受控维修——controlled maintenance计划性维修——scheduled maintenance非计划性维修——unscheduled maintenance现场维修——on-site maintenance；in sits maintenance；field maintenance 非现场维修——off-site maintenance遥控维修——remote maintenance自动维修——automatic maintenance逾期维修——deferred maintenance基本的维修作业——elementary maintenance activity维修工作——maintenance action；maintenance task修理——repair故障识别——fault recognition故障定位——fault localization故障诊断——fault diagnosis故障修复——fault correction功能核查——function check-out恢复——restoration；recovery监测——supervision；monitoring维修的实体——maintenance entity影响功能的维修——function-affecting maintenance阻碍功能的维修——function-preventing maintenance减弱功能的维修——function-degreding maintenance不影响功能的维修——function-permitting maintenance维修时间——maintenance time维修人时——MMH maintenance man-hours实际维修时间——active maintenance time预防性维修时间——preventive maintenance time修复性维修时间——corrective maintenance time实际的预防性维修时间——active preventive maintenance time实际的修复性维修时间——active corrective maintenance time未检出故障时间——undetected fault time管理延迟〔对于修复性维修〕——administrative delay后勤延迟——logistic delay故障修复时间——fault correction time技术延迟——technical delay核查时间——check－out time故障诊断时间——fault diagnosis time故障定位时间——fault localization time修理时间——repair time工作时间——operating time不工作时间——non—operating time需求时间——required time无需求时间——non-required time待命时间——stand-by time闲置时间——idle time；free time不能工作时间——disabled time不可用时间——down time累积不可用时间——accumulated down time外因不能工作时间——external disabled time；external loss time 可用时间——up time首次失效前时间——time to first failure失效前时间——time to failure失效间隔时间——time between failures失效间工作时间——operating time between failures恢复前时间——time to restoration；time to recovery使用寿命——useful life早期失效期——early failure period恒定失效密度期——constant failure intensity period恒定失效率期——constant failure rate period耗损失效期——wear－out failure period瞬时可用度——A(t) instantaneous availability瞬时不可用度——U(t) instantaneous unavailability平均可用度——A(t1,t2)mean availability平均不可用度——U(t1，t2)mean unavailability渐近可用度——A asymptotic availability稳态可用度——steady－state availability渐近下可用度——U asymptotic unavailability稳态不可用度——steady-state unavailability渐近平均可用度——A asymptotic mean availability渐近平均不可用度——U asymptotic mean unavailability平均可用时间——MUT mean up time平均累积不可用时间——MADT mean accumulated down time可靠度——R(t1，t2)reliability瞬时失效率——λ(t)instantaneous failure rate平均失效率——λ(t1,t2)mean failure rate瞬时失效密度——Z(t) instantaneous failure intensity平均失效密度——Z(tl，t2) mean failure intensity平均首次失效前时间——MTTFF mean time to first failure平均失效前时间——MTTF mean time to failure平均失效间隔时间——MTBF mean time between failures平均失效间工作时间——MTBF mean operating time between failures 失效率加速系数——failure rate acceleration factor失效密度加速系数——failure intensity acceleration factor维修度——maintainability瞬时修复率——μ(t)instantaneous repair rate平均修复率——μ(t1，t2)mean repair rate平均维修人时——mean maintenance man-hours平均不可用时间——MDT mean down time平均修理时间——MRT mean repair timeP—分位修理时间——p—fractile repair time平均实际修复性维修时间——mean active corrective maintenance time 平均恢复前时间——MTTR mean time to restoration故障识别比——fault coverage修复比——repair coverage平均管理延迟——MAD mean administrative delayp—分位管理延迟——p-fractile administrative delay平均后勤延迟——MLD mean logistic delayP—分位后勤延迟——P—fractile logistic delay试验——test验证试验——compliance test测定试验——determination test实验室试验——laboratory test现场试验——field test耐久性试验——endurance test加速试验——accelerated test步进应力试验——step stress test筛选试验——screening test时间加速系数——time acceleration factor维修性检验——maintainability verfication维修性验证——maintainability demonstration观测数据——observed data试验数据——test data现场数据——field data基准数据——reference data冗余——redundancy工作冗余——active redundancy备用冗余——standby redundancy失效安全——fail safe故障裕度——fault tolerance故障掩盖——fault masking预计——prediction可靠性模型——reliability model可靠性预计——reliability prediction可靠性分配——reliability allocation；reliability apportionment故障模式与影响分析——FMEA fault modes and effects analysis故障模式、影响与危害度分析——FMECA fault modes，effects and criticality analysis 故障树分析——FTA fault tree analysis应力分析——stress analysis可靠性框图——reliability block diagram故障树——fault tree状态转移图——state-transition diagram应力模式——stress madel故障分析——fault analysis失效分析——failure analysis维修性模型——maintainability model维修性预计——maintainability prediction维修树——maintenance tree维修性分配——maintainability allocation；maintainability apportionment 老练——burn in可靠性增长——reliability growth可靠性改良——reliability improvement可靠性和维修性管理——reliability and maintainability management可靠性和维修性保证——reliability and maintainability assurance可靠性和维修性控制——reliability and maintainability control可靠性和维修性大纲——reliability and maintainability programme可靠性和维修性计划——reliability and maintainability plan可靠性和维修性审计——reliability and maintainability audit可靠性和维修性监察——reliability and maintainability surveillance设计评审——design review真实的…——true…预计的…——predicted…外推的…——extrapolated…估计的…——estimated…固有的…——intrinsic…；inherent…使用的…——operationa l…平均的…——mean…P-分位…——P-fratile…瞬时的…——instantaneous…稳态的…——steady state。

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arXiv:cond-mat/0012122v1 [cond-mat.mtrl-sci] 7 Dec 2000I.INTRODUCTION
The characterization and evolution of microstructure forms a cornerstone of materials science. In particular the grain structure of a polycrystalline material determines many of its properties. Recent eﬀorts at modeling the evolution of grain boundaries have used a variety of approaches [1], [2], [3], [4]. Herein we focus on the recently introduced phase ﬁeld model of Kobayashi, Warren and Carter (KWC)[5] which is based on earlier attempts by the same authors ([6] and [7]). The model is motivated by symmetry principles and has a surprisingly rich set of physical characteristics. In particular, KWC showed numerically that solutions to this model can be interpreted as a collection of grains. The velocity of the interface between the grains was found to be approximately proportional to the local curvature of the interface, but the grains were also able to rotate towards lower energy misorientations. In support of the notion of grain rotation, three independent unpublished molecular dynamics studies by M. Upmanyu and D. Srolovitz, S. R. Phillpot and D. Wolf, and S. Srivillaputhur and J. W. Cahn, suggest that grain rotation will occur under certain circumstances. In addition, there is a substantial history (and debate) concerning the mechanisms [8], [9] and observation of grain rotation [10, 11]. The KWC phase ﬁeld model is challenging mathematically because of a singular term in the free energy. Kobayashi and Giga [12] studied similar singular models and showed that there is a way to handle the singularity consistently. In this paper we will apply their method to the KWC model and show that its solutions can indeed be interpreted as grains. Our main goal is to analytically obtain the properties of a grain boundary as well as the rotation rate of a grain. We accomplish this task by considering a distinguished limit of the model parameters in which the width of the boundary vanishes while its measurable characteristics remain ﬁnite and non-zero. The methodology of this this so called sharp interface limit is well established [13], [14], [15]. The organization of this paper is as follows. In Sec. II we introduce the order parameters, phenomenological
Sharp interface limit of a phase-ﬁeld model of crystal grains
Alexander E. Lobkovsky and James A. Warren
National Institute of Standards and Technology, 100 Bureau Drive, Gaithersburg, MD, 20899 We analyze a two-dimensional phase ﬁeld model designed to describe the dynamics of crystalline grains. The phenomenological free energy is a functional of two order parameters. The ﬁrst one reﬂects the orientational order while the second reﬂects the predominant local orientation of the crystal. We consider the gradient ﬂow of this free energy. Solutions can be interpreted as ensembles of grains (in which the phase of the order parameter is approximately constant in space) separated by grain boundaries. We study the dynamics of the boundaries as well as the rotation of the grains. In the limit of the inﬁnitely sharp interface, the normal velocity of the boundary is proportional to both its curvature and its energy. We obtain explicit formulas for the interfacial energy and mobility and study their behavior in the limit of a small misorientation. We calculate the rate of rotation of a grain in the sharp interface limit and ﬁnd that it depends sensitively on the choice of the model.
II.
MODEL
We model the evolution of a collection of nearly perfect crystalline grains in two dimensionsvia a phase ﬁeld model. First, we discuss order parameters which capture the microscopic physics of grain boundaries. It is then possible to construct a phenomenological free energy which favors a perfect uniform crystal and supports stable grain boundaries. Evolution of an ensemble of grains is then modeled via gradient ﬂow of this free energy. Following [5] we develop two order parameters which capture the physics of grain boundaries. To distinguish grains of diﬀerent orientations we introduce a continuously varying local orientation θ. Since the energy of crystal does not depend on θ itself, the phenomenological free energy will be a functional of the gradients of θ only. The second order parameter η is used to diﬀerentiate the nearly perfect crystal in the interior of the grains from the disordered material in the grain boundary. It varies from perfect order η = 1 to complete disorder η = 0. Both order parameters are not conserved.

Sharp interface limit of a phase-field model of crystal grains

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