PCB工序英语

PCB工序英语
PCB Printed Circuit Board
A1.Process 流程 Board Cut 开料 ? Drill钻孔 ? Incoming Quality Control (IQC) ? Plated Through Hole (PTH) ?Panel Plating 整板镀铜 ? dry film 干膜 ?patterm plating 图形电镀?Flash Gold Plating 闪金电镀
Cu(Copper)/Sn(Tin) Plating ? etch 蚀刻 ? quality control (FIRST)QC ? Wetfilm W/F ? Legend ( Mark Printing , Component
Mark)文字 ? Hot Air Leveling 喷锡 ( Immersion Gold Chemical Gold 沉金 ) ? Routing 锣板 (Punching啤板) ? V-Cut ? Rinse 洗板 ? E-test ? Entek ? Final Quality Control FQC ? QA Audit 审核 ? Package ? Shipment ( Delivery) 出货
B drill process 钻孔工序 the type of holes 孔的类型 Via hole 通孔Component hole 元件孔 Installing hole 安装孔 Registration hole (for Printing ,HAL ,Chemical gold
etc) 定位孔 Slot 槽孔 PTH hole 电镀孔 NPTH hole 非电镀孔 Big
hole(Too big to tent 孔太大,不能掩孔) Small hole 小孔
1. Drill process Board cut 开料 ? Pin hole making 销钉孔(Registration pin ) ?
Board up 上板 ? Drilling ? Board down ? Check 检查
2. Parameters 参数 Drill Bit 钻咀 Diameter of hole (drill bit)孔径Feed speed 进刀
速度 RPM (Round per minute ) 转速 How many panels (Total thickness 厚度)
上板数量 Hole quantity 孔数
3. Quality 品质 about drill bit 关于钻咀 chips 缺口 overlap 重合 gap 间隙
flair变形 about hole 关于孔 rough (roughness) 粗糙度 bur(debur) 去毛刺
nailhead 钉头 (multilayer多层板) resin smear (desmear)除胶渣 surface scratch 表面
擦花 breakout of registration hole 定位孔爆 hole shift 偏孔(位) hole plugged堵
孔 raw material 材料 Laminate 板材 copper foil 铜箔 prepreg 半固化片C Main contents IQC ( IQC主要内容) Measuring tooling 测量工具 Pin gauge 针规 Caliper 卡尺 C-caliper 螺旋卡尺 X-ray instrument for Au/Ni thickness X光金/镍测厚仪 Outline Artwork for outline dimension 外形菲林Visual check 肉眼检查 2. The main raw materials 主要材料 laminate 板材prepreg半固化片 copper foil铜箔 chemical 化学药品 dry film wetfilm
Pb(lead)/Sn(Tin) Alloy mixture of metals 铅锡合金 flux 松香 etch salt 蚀板盐 carbon ink 碳油 legend ink字符油墨 die 模具 Semifinished products form sub-contractor 外协厂 3.Quality of laminate 板材品质 Pin hole 针孔dent 凹痕 scratch 擦花 delamination 分层 white spot 白点 fibre exposure 露纤维 discolour 变色 thickness deviation 厚度偏差 surface oxidation 表面氧化
D PTH Process Debur 除胶渣? Degrease 除油脂 ? Rinse (Ci Water) ?
Microetch 微蚀 ? Rinse ?
Dip In Sulfate Acid Solution 酸洗 ? Rinse ? Pre-Dip 预浸 ? Catalyst 崔化剂?
Rinse ? Accelerate 加速剂 ?Rinse ? PTH ? Rinse ? Dry烘干
E Several Concepts Electroless Plating (Electroplating) 无电镀铜Dummy Plating
拖缸 APS (Ammonium Per Sulfate) 过硫酸铵 Deionized Water 去离子水C.I Water
自来水 Loading 负载 Deposition Rate 沉铜速率 Foam 泡沫 Heater 加热器Pink Ring 粉红圈 (红环) Clot 结块 Hard Water 硬水 Soft Water 软水Debris 树脂屑 Rough Copper Deposit 沉铜粗糙 Peel Off 铜层剥离 Void 空洞Poor Adhesion 结合力不良 Short Bath Life 槽液短命 Poor Backlight 背光不良 No Copper Deposit On Hole Wall 黑孔
F D/F process Scrub 磨板 ? Laminate 贴膜 ? Artwork check 菲林检查 ? Image transfer 对位 ?
expose 曝光 ? develop 显影 ? touchup 执漏
Main materials 主要材料 dry film sodium carbonate 碳酸钠 defoam 除泡剂 alcohol 洒精 yellow film黄菲林
Main machines 主要设备 Laminator 贴膜机 exposure machine 曝光机
developing machine 显影机 developing machine for
yellow artwork 黄菲林显影机 (重氮显影机)
Quality Open/short bur chip underdevelop 显影不够 overdevelop 显影过度
underexposure 曝光不够 overexposure 曝光过度 scratch surface
contamination 表面污染 bubble 气泡
Main parameters参数 break point 突破点 footprint 磨痕 exposure index 曝光指数 stauffer 曝光尺(光楔表)
G Sn(Tin)-plating degrease 除油污? rinse ? microetch 微蚀? rinse ? dip in
sulfate acid solution 酸洗? Cu(copper)-plating 电铜 ? rinse
Tin-plating 镀锡
Main materials Copper sulfate 硫酸铜 copper ball 铜球 Acid sulfate
硫酸
Tin metal bar 锡条 Stannous sulfate硫酸亚锡 Additives 添加
剂 brightener 光亮剂
The other useful words Make-up 开缸 make-up procedure 开缸程序 Anode 阳极 Cathode 阴极 maintenance 维护\保养 litre 升 gram 克 volume 容积carbon treat 碳处理 Current Density 电流密度Current Area 电流面积Quality corner crack 角部断裂 pit 凹痕(麻点,大凹痕为dent) Non-uniform 不均匀 dull plating 镀层发暗 poor adhesion 结合力不良 void 空洞copper thickness under spec. 铜厚不符合要求(标准)
Etch process strip 去膜 ? etch ? tin-strip ? QC(quality check)
Etching line 蚀刻线 etch salt 蚀板盐 ammonia 氨水(ammonium 铵) copper chloride 氯化铜 tin-strip chemical退锡水 poor strip 退膜不良
poor tin-strip 退锡不良(净) poor etch 蚀刻不良 over-etch 蚀刻过度
open/short black hole 黑孔 void 空洞 scratch 刮花 chip 缺口 bur 毛刺
peel off 剥离 etch factor 蚀刻因子 tin-transfer 锡迁移 undercut 侧蚀
line width 线宽 line space 线距
W/F process scrub 磨板 (pumice 火山灰 or chemical treatment 化学处
理 ) ?
screen printing 丝印 ? pre-cure 前焗 ? expose ? develop ?
postcure 后焗 ? touchup
Scrubber (scrub machine) printing machine 丝印机 exposing machine developing machine
Pumice火山灰chemical diazo film 重氮片 wet film sodium carbonate poor
developing scratch peel off S(solder)/M(mask) in hole 绿油入孔 S/M on pad 绿油上焊盘 S/M on gold finger 绿油上金手指 S/M on mark overdevelop 显影过度 residue 垃圾，杂物(particals 颗粒) copper exposure 露铜 stauffer test 曝光尺实验
adhesion 粘度 stencil 网板 footprint 磨痕 breakpoint 突破点，显影点C/M process (component/mark) legend printing ? cure ? QC check oven Residue missing character illegible character character broken C/M on pad (finger.
in hole) discolor peel off
HAT process (hot air leveling) pretreatment ? HAL ? posttreatment ? QC check Solder flux
APS (ammonium per sulfate ) copper exposure (hole wall ) ununiform rough surface
bubble (discolor) of S/M
every lot 每批 reworked 返工 scrapped 报废 spec. 规格,说明 choice 选择 solve解决semifinished product 半成品 co-operation 合作 improve 改善
dispose of surface 表面处理 purchase order 采购单 standerd 标准 gerber data GERBER文件 item 序号 Part No description 描述 model 型号 delivery schedule 交货日期
U/P 单价 amount 总计 remark 备注 CIF 到岸价 specifications 说明solvent test 溶剂试验
defect 缺陷 nonconforming 不一致 corrective action 纠正措施 First Article check 首件检查 customer 客户complain投诉 take action 采取行动Thank you for your attention。

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最好的问候Engineering Department Quality Engineering Manufacturing Instruction Engineering
Change Notice such as 例如
CAD computer assistant design 计算机辅助设计 CAM computer assistant manufacturing 计
算机辅助制造 etc 等
File 资料 template 钻孔首件 E/T fixture 测试架 outline drawing 外形图纸 panel size 拼板尺寸 plotter 光绘机 Sample Making 样板制作 etching compensation 蚀
刻补偿 pattern artwork 线路菲林 peel able ink artwork 蓝胶 MI audit 审核 tolerance 公差 second drill 二钻 clearance 净空度 S/M bridge 绿油桥coner mark 角标 target pad(hole) 定位焊盘 PQC process quality control copper chloride
tese 氯化铜实验 microsection 切片检查 microetch rate 微蚀速率 tape test 胶纸
实验 lot check 批检 full check 全检 sampling check 抽检 customer 客户 date code sample size lot size LOGO bow(warp) twist 翘曲、扭曲annular ring 环宽10×scope 放大镜 solder side 焊接面 front back registration 两面图形一致性 gold(S/M) tape test functional test 功能试验ionic contamination test 离子污染
测试 wetting(soderability) tset 可焊性实验 peel (pull) strength test 可剥(拉脱)
强度测试 test method 测试方法 solder pot(bath) 锡炉 specimen(coupon) 样品 outgoing(shipment) report 出货报告 accepted rejected UAI use as is 特采 guarantee承诺、保证 MRB material review board 物料审核委员会calibration 计
量 product identification产品标识 product traceability 产品追溯。