VPR A new packing, placement and routing tool for FPGA research
Eaton 自定义设计的 VPI VPE 干式变压器产品介绍说明书
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December 2012Sheet14 General Description014VPI/VPE Dry-TypeTransformersApplication DescriptionEaton’s VPI and VPE transformersare custom-designed dry-type powertransformers, which give environmen-tal protection, for both indoor andoutdoor applications. The transform-ers are explosion-resistant, fire-resistant, non-polluting to theenvironment, and ideally suitable foruse in coordinated unit substations.Typical applications of VPI/VPEtransformers are:■Schools, hospitals, shopping centers■High-rise buildings■Industrial environmentsBenefits■Custom-design flexibility to meet special customer needs andapplications■Computerized loss-evaluated designs for specific customer load and evaluation criteria■Environmental protection■Low maintenance■High short-circuit strength■IEEE short-time overload capability ■Aluminum or copper windings■Available in NEMA 1, 2 and3R enclosures■EconomicalRatings■112.5–3750 kVA■Primary voltages: 600V–35 kV■Primary BIL: up to 150 kV■Secondary voltages: 120V–15 kV■Secondary BIL: up to 75 kV■Temperature rise: 80/115/150°CDry-Type Substation TransformerDesign and TechnologyThe dry-type transformers are customdesigned and manufactured with coilsinsulated with 220°C Class H Nomex®,insulation system. Environmentalprotection is provided by vacuumpressure impregnation with polyesterresin (VPI). Enhanced environmentalprotection is available through the useof silicone resin encapsulation (VPE).The VPE process provides 4-cycleenhanced environmental protection.The entire core and coil assembly isvacuum pressure encapsulated witha silicone resin per MIL-1-24092. Bothsystems are superior to the conven-tional dry-type technology known as“Dip and Bake.” Both resin types, andNomex, insulation system are 220°CClass H rated. Transformers with ClassH insulation are suitable for use up to150°C average rise over a maximumambient temperature of 40°C, not toexceed 30°C average for any 24-hourperiod. Other temperature rise optionsare 80°C and 115°C, which allow thetransformer to be overloaded up to150°C rise.Taps are provided on the central sectionof the HV coil face. Taps are accessed byremoving enclosure panels, and taps arechanged by moving the flexible boltedlinks from one connecting point to theother. T o simplify these changes, theconnection points are clearly identified.Material used for cores is non-aging,cold rolled, high permeability, grain-oriented silicone steel. Cores are con-structed with step lap mitered joints andare rigidly braced to reduce sound levelsand losses in the finished product.To reduce the transfer of noise to thecase, the core is mounted on neoprenerubber vibration dampeners. The coreis electrically grounded by means ofa flexible ground braid.The enclosure has removable panelsfor access to taps and for core and coilinspection. The complete case can beremoved and knocked down to reducesize and weight for rigging into tightlocations.VentilationLouversFan Control/WindingTemperatureIndicatorRemovablePanelFan Motor and BladesCore-CoilAssemblyFor more information, visit: /consultants CA08104001ECA08104001E For more information, visit: /consultantsDecember 2012Sheet14General Description015VPI/VPE Dry-TypeTransformers (Continued)AccessoriesStandard accessories include:■Jacking pads ■Ground pad■Diagrammatic nameplate ■Provisions for rolling ■Ventilation grilles ■Core ground strap■Primary reconnectable taps ■Future fan provisions on units over 500 kVA■Core ground strap ■ANSI 61 paint finish ■Step-lap mitered core ■NEMA 1 enclosureOptional Features■Copper windings/bussing (aluminum is standard)■VPE silicone resin vacuum pressure impregnation and encapsulation ■Fan cooling package, complete with digital winding temperature ■80°C or 115°C rise (150°C rise is standard)■Non-standard ambient temperature (30°C average/24-hour 40°C maximum is standard)■Non-standard altitude (up to 3300 ft (1006m) is standard)■Non-standard BIL level ■NEMA 3R enclosure■Aluminum or copper ground bus ■Lightning arresters■Low loss design (loss evaluation)■Special sound level■Wye-wye connected windings ■UL labelTestsThe following tests are standard:■Induced potential ■Applied potential■Resistance measurement ■Ratio test■Polarity and phase relationship test ■No load loss at rated voltage ■Exciting current at rated voltage ■Impedance and load loss ■Quality control impulseSpecial TestsThe following tests can be provided at additional cost:■Temperature rise ■ANSI impulse ■Sound level ■Witness15 kV 95 kV BIL Aluminum 150˚kVA HeightInches (mm)WidthInches (mm)DepthInches (mm)WeightLbs. (kg)1132253005007501000150020002500300090 (2286)90 (2286)90 (2286)90 (2286)90 (2286)90 (2286)90 (2286)90 (2286)90 (2286)102 (2591)78 (1981)78 (1981)78 (1981)78 (1981)84 (2134)84 (2134)84 (2134)96 (2438)102 (2591)108 (2743)60 (1524)60 (1524)60 (1524)60 (1524)60 (1524)66 (1676)66 (1676)66 (1676)66 (1676)66 (1676)2250 (1022)2850 (1294)3200 (1453)4350 (1975)5450 (2474)6250 (2838)8150 (3700)9350 (4245)11,050 (5017)14,750 (6697)Standard Enclosure Design Dimension & WeightsANSI/IEEE Loading Guide15 kV 95 kV BIL Copper 80˚kVA HeightInches (mm)WidthInches (mm)Depth Inches (mm)WeightLbs. (kg)1132253005007501000150020002500300090 (2286)90 (2286)90 (2286)90 (2286)90 (2286)90 (2286)102 (2591)102 (2591)112 (2845)112 (2845)78 (1981)90 (2286)90 (2286)96 (2438)102 (2591)102 (2591)108 (2743)114 (2896)126 (3200)144 (3658)60 (1524)60 (1524)60 (1524)66 (1676)66 (1676)66 (1676)66 (1676)66 (1676)2950 (1339)4250 (1930)4650 (2111)6350 (2883)8150 (3700)9200 (4177)12,050 (5471)14,850 (6742)18,550 (8422)20,850 (9466)66 (1676)66 (1676)Values listed are typical and should not be used for construction purposes.Retrofit design with minimal enclosure width.1/212341.711.451.301.211.15(210)(196)(181)(165)(155)1.561.371.271.191.141.641.421.291.211.14(220)(206)(186)(169)(158)(217)(203)(185)(169)(156)Times Rated kV A 220˚ Insulation System Following and followed by aconstant load ofPeak Load in Hours90%(1)70%(1)50%(1)Daily loads above rating to give normal life expectancy.(1) Maximum Hottest—spot temperature reached during load cycle.Winding Temperature Indicator provided with isolation barrier for added safety.Low voltage bus arrangement to close couple to low voltage switchgear.5The following tests are made on all transformers unless noted as an exception. The numbers shown do not necessarily indicate the sequence in which the tests will be made. All tests will be made in accordance with the latest revision of ANSI C57.12.91 Test Code for Transformers.1. Resistance measurements of allwindings on the rated tap and on the tap extremes on one unit of a given rating on a multiple unit order2. Ratio Tests on the rated voltage connection and all tap connections3. Polarity and Phase-relation Tests4. No-load loss at rated voltage5. Excitation current at rated voltage6. Impedance and load loss at rated current on the rated voltage connection of each unit and on the tap extremes on one unit of a given rating on a multiple unit order7. Applied Potential Tests8. Double Induced Potential Test.Optional tests which are routinely performed: Temperature Tests will be made when a record of a Temperature Test that has been made in accordance with ANSI standardsis not available on a duplicate or essentially duplicate unit.Temperature Test or tests will be made on one unit only of an order covering one or more units of a given rating. Optional Tests:1. Impulse Tests-full andchopped-wave Tests per ANSIand NEMA standards2. Quality Control Impulse Test(100% full wave)3. Audible Sound Level Test4. Induced Partial Discharge5. Temperature Test6. Insulation Power-factor Test7. Switch and Soak Test8. Short Circuit Test9. Seismic Qualification.ABB’s quality assurance begins withcontract negotiations and continuesthrough design, control of purchasedmaterials, manufacturing and test,and is not complete until thetransformer is installed and operatingsuccessfully in the customer’sapplication for many years.VPE transformers have successfully passedANSI Short Circuit Tests.VPE transformers are manufactured in an ISO9001Certified factory.U L®LISTED93DODISTRIBUTIONTRANSFORMERU L®CLISTED93DODISTRIBUTIONTRANSFORMER®N UCLEAR1E CERTIFICATIONIEEE 323—QUALIFIED LIFEIEEE 344—SEISMIC CERTIFICATIONQuality Assurance 6SpecificationsSelf-Cooled Power RatingkVA PrimaryVoltagekVPrimary BILkVSecondaryVoltagekVSecondary BILkV112.5-10,000Up through 35Up to 150Up through 15Up to 75TemperatureRiseC80/115/150˚Standard VPE Features1.Aluminum windings—copper optional2.Step-lap mitered core3.220˚C insulation system-150˚C average temperaturerise4.Vacuum pressure encapsulated silicone varnish5.Four (4) full-capacity taps on HV winding rated2 1/2% 2-FCAN—2-FCBN on units with voltageabove 601 V6.NEMA 1 heavy-gauge ventilated enclosure withremovable panels front and rear7.ANSI 61 gray paint electrostatically applied usingdry powder8.Vibration isolation pads between core and coil andenclosure9.Base equipped with jacking pads and designed forrolling or skidding enclosure in any direction10.Provisions for lifting core and coil assembly11.Diagrammatic aluminum nameplate12.100% QC Impulse Test13. Short Circuit Design Verification Options & Accessories____ UL listing____ CSA certificationNuclear 1E certification:____ IEEE 323—qualified life____ IEEE 344—seismic certification____ NEMA 3R enclosure____ 80˚C or 115˚C average temperature rise____ Copper windings____ Provisions for future fan cooling (FFA)____ Three-phase electronic temperature monitor____ Forced cooling package with three-phase electronic temperature monitor____ Increased basic impulse levels____ Loss optimized designs____ Air-filled terminal chambers____ Special paint colors____ Retrofit designsTemperatureRise BaseRatedkVA150˚CRisekVAFanCooledkVA150˚C100010001333115˚C 80˚C 100010001150135015301800VPE transformers are constructed with 220˚C class insulation and have a maximum temperature rise of 150˚C.When ordered with 115˚C rise, the VPE transformer (if specified) will have a 115% continuous overload capability (153% with fans). AA/FA/FAVPE transformers, when ordered with a 80˚C rise (if specified), will have a 135% continuous overload capability (180% with fans). AA/FA/FA ANSI C57.12.01ANSI C57.12.91ANSI N45.2-1977ULNRC 10CFR50 Appendix BISO 9001NEMA ST20CSA Z 299.3MIL-I-45208AQualified for manufacture of Nuvlear Class 1-E, Safety Related Transformers including IEEE 344 Certification.Temperature Rise Standards and Certifications7kVA 3-PhaseSelf-Cooled Fan-Cooled VentilatedDry Fan-CooledWeatherResistantVentilated208Y/120240Delta 480Y/277480Delta 112 1/2150225300500750100010001500———400667333346876250937512,50010001333133320002666Secondary Voltage2400 Delta 4160Y /24004160 Delta2000250037505000750010,00012,500——937562504687333326662000133313331000667400————————X X X X XXX XX XX X X X X X X X X X ———XX X X X X X X X X X ————Standard Transformer RatingsPrimary Voltage Class 600V through 34.5 kV 150˚C rise 30˚C average ambientAltitude Derating FactorAltitude (FT)VPE (AA)BIL Correction .894.903.912.921.930.939.948.957.966.985.9941.00kVA Correction Forced Air(FA).823.838.853.868.883.898.914.929.944.959.974.9891.00.67.70.72.77.80.83.86.89.92.95.981.00330040005000600070008000900010,00011,00012,00013,00014,00015,000.975.75NOTE: 3.28 FT = 1 MeterEquivalent Two-Winding(kVA)Ventilated (Class AA Rating)Class FA and AFA RatingSelf-CooledkVA 6968670-910-5051-150151-300301-500501-700701-10001001-15001501-20002001-30003001-40004001-50005001-6000757473716668-83335001-66673334-50002001-33331668-20001168-16670-116772717068666564626050454055Ventilated Forced AirCooled 6001-750075Audible Sound LevelsImpedance ChartkVA ANSI Std.ABB 112.5-500501 & Larger *5.75%5.75%5.75%None Specified* For Units with 60 kV Primaries and below.“X” denotes standard or available.NominalSystemVoltage (kV)1.2S112.55.0S1SBILs in common use (kV crest)10203045609511012515020011SS22S111S111118.715.025.034.5NOTES:S = Standard value.1 = Optional higher levels where exposure to overvoltage occurs and improved protective margins are required.2 = Lower levels where protective characteristics of applied surge arresters have been evaluated and found to provide appropriate surge protection.BIL ’s Associated Voltages8。
国际贸易实务双语Chapter 1
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Warming-up Exercise Part A English Tex Part B Bilingual Tex
Chapter One Warming-up Exercise
Answer the following questions.
Chapter One Part A English Tex
Packing of Commodity
Types of Packaging Transport Packaging Transport packing is also called shipping packing, outer packing or big packing. It is classified into unit packing and collective packing. Unit packing is the smallest shippable unit of cargo. In unit packing, goods are put in different forms of containers such as cases, cartons, drums, bales, bags, bundles, etc. Collective packing (also group shipping packing) means a certain number of units of cargo are grouped together to form a large collection. In collective packing, goods are put in flexible container, pallet and container. Sales Packaging Sales packaging is also called inner packaging, small packaging, immediate packaging or marketing packaging. It focuses on the design and beauty of the package, aiming at promoting sales. Sales packaging is divided into carrying packaging, easy-open packaging, hang-up packaging, spraying packaging, gift packaging, etc.
packaging
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packagingPackaging: The Key to Product SuccessIntroduction:In today's competitive marketplace, packaging plays a significant role in influencing consumer purchase decisions. A well-designed and attractive packaging can make a positive first impression on consumers, ultimately leading to increased sales. This document explores the importance of packaging, its impact on the success of a product, and the key elements to consider when designing packaging.1. The Purpose of Packaging:Packaging serves multiple purposes beyond the protection and transportation of products. It is the first point of physical contact with consumers and acts as a silent salesman by conveying brand values and product information. Some of the key purposes of packaging include:1.1. Protection: Packaging safeguards products by preventing damage during transportation and storage. It helps to maintain product integrity.1.2. Differentiation: Packaging distinguishes a product from its competitors and attracts consumer attention on crowded store shelves.1.3. Communication: Packaging communicates essential information such as product features, benefits, usage instructions, and ingredients. It also conveys brand values and enhances brand recognition.1.4. Convenience: Packaging should be user-friendly, providing convenience in terms of handling, storage, and usage.2. Impact of Packaging on Consumer Behavior:Packaging can significantly influence consumer behavior and purchasing decisions. A well-packaged product can create strong brand recognition, attract attention, and convey value to consumers. Key ways in which packaging impacts consumer behavior include:2.1. Brand Perception: Packaging provides an opportunity to create a positive brand image and shape consumer perceptions. High-quality and visually appealing packaging can help position a product as premium and trustworthy.2.2. Emotional Connections: Packaging design can evoke emotional responses in consumers, leading to a stronger connection with the product. The use of colors, visuals, and typography can elicit specific emotions and create a memorable experience.2.3. Product Visibility: Packaging design must ensure that the product stands out on store shelves, catching the consumer's eye amidst competitors. Clever use of colors, unique shapes, and strategic placement can enhance product visibility.2.4. Informative Content: Consumers rely on packaging to provide crucial information about the product. Clear communication of product features, benefits, and usage instructions can build consumer trust and influence purchase decisions.3. Key Elements of Effective Packaging Design:When designing packaging, several essential elements should be considered to ensure its effectiveness and appeal to the target audience. These elements include:3.1. Target Audience: Understanding the target audience is crucial in determining the packaging design elements that will resonate with and attract them. Factors such as age, gender, lifestyle, and preferences should be considered.3.2. Branding: Packaging must align with the brand's identity and values. Consistency in terms of color schemes, logos, and typography helps to create brand recognition.3.3. Visual Appeal: Eye-catching packaging design should differentiate the product from competitors. The use of colors, graphics, and fonts should be visually appealing and in line with the brand strategy.3.4. Functional Considerations: Packaging should be practical and user-friendly. It should allow easy product access, provide clear usage instructions, and ensure ease of storage and shipping.3.5. Sustainability: As consumers become more environmentally conscious, sustainable packaging options are gaining importance. Using eco-friendly materials and minimizing waste can enhance a brand's reputation and attract environmentally conscious consumers.Conclusion:Packaging is a vital element in the success of a product. It serves various purposes, including protection, differentiation, communication, and convenience. Effective packaging design can significantly impact consumer behavior, creating brand recognition, emotional connections, and influencing purchase decisions. By considering key elements such as the target audience, branding, visual appeal, functionality, and sustainability, businesses can design packaging that captures the attention and loyalty of consumers, leading to increased sales and brand success.。
【实用文档】达能新包装物和新原材料的评估
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NEW PACKING AND NEW RAW MATERIAL EVALUATION达能新包装物和新原材料的评估Agreement ProcedureBefore using a new raw material / a new supplier or a raw material agreed but manufactured in a new supplier plant, it’s necessary to test the compatibility of this new material with your water.It’s necessary to check the organic and inorganic migrations in the water., but also the quality (taste and smell) of the water after bottling and storage in the new packing.The procedure and methods are the followingFIRST STEPSend to the Danone R&D Global Packaging Plateform ( F POULAT*) the following samplesPET: 1 Kg of resin5 lots of preforms (all the cavities)OR50 Kg of PET resinPE/PP for closures : 1Kg of resin 100g resin in a glass containerAbout 100 caps , 20 of them to be packed in aluminium to avoid contamination during transportation对于PE/PP料1.取100克树脂(PE或PP料),装入玻璃容器中2.100个盖子,其中20个用铝制包材包装,避免运输途中的污染On the raw material and on the preforms or caps the total and specificmigration will be evaluated.在原料和半成品,成品盖中总的和精确的迁移量/溶出物将被评估Colour Masterbatch or additives for closures :盖子中色母/色粉或添加剂:If solid masterbatch : 20g in a glass container如果是固体色母:取20克用玻璃容器包装20 closures to be packed in aluminium to avoid contamination duringtransportation取20个盖子,用铝制包材包装,避免运输途中的污染For each raw material (HDPE/PP resin and masterbatch the following informations will be enclosed每种原料必须同时付上以下相关信息•raw material reference including supplier name•提供原料的供应商名称•production plant of the raw material•原料的生产工厂•technical data sheet•技术清单(原料的相关技术说明)-The legal status of this raw material (FDA or European food compliance document and local agreement for your qualitydepartment-政府部门的合法批准文件-To be sent to (邮寄地址)•Danone – R&D BeveragesTo Ms F. POULATPLACE DE LA GAREEVIAN 74500FRANCETel 33 (0)4 50 26 82 90SECOND STEP1)Fill the new packing with treated or untreated water( following yourindustrial process)2)Realize the following organoleptic tests after storage• 1 month at 20°C•10 days at 40°C (abuse test)For each time and each temperature compare the organoleptic characteristics against a sample (glass bottle or PET bottle made with raw material agreed) stored in the same conditions.The quotation scale for the organoleptic tests can be the following* 0 no ‘off taste ‘or bad smell* 1 Very light ‘off taste ‘or bad smell* 2 light ‘off taste’ or bad smell* 3 ‘off taste’ or bad smell* 4 no drinkableIf the results after 10 days at 40°C is less than 2 or equal to 2 and after 1 month at 20°C is less than or equal to 1,5 the new packing or the new material is acceptable,THE NEW RAW MATERIAL OR THE NEW PACKING SHALL BE USABLE IF:-RAW MATERIAL OR NEW PACKING IS APPROVED BY THE WTC ( after migration test)-THE RAW MATERIAL IS IN ACCORDANCE WITH THE REGULATION-THE ORGANOLEPTIC RESULTS ARE CONFORMS0O0SCHEME OF NEW RAW MATERIAL EVALUATIONI study by the WTCII study by the department*The new raw material shall be also conforming to the regulation for the food contact。
Packing外贸函电
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· 1. Explosives · 2 . Toxic gas · 3 . Flammable Liquids · 4 . Flammable solids · 5.Radioactive Material · 6.Corrosives
moisture · Keep away from heat · Use no hooks · Keep f l a t · Fragile
Warning marks · Dangerous goods · Inflammable · Explosive · Poison
Warning marks
Packing for Sales
·Packing for sales, or inner packing-- artisti attractive, or small packing, will not only protect, but also prettify commodities.
·suspensible packing transparent packing portable packing window packing gift packing
·Cargoes fall into three groups:
(1) Bulk cargoes or cargoes in bulk: like wheat mineral ore, coal, etc.
(2) Nude cargoes: like vehicles, bronze or stee plates or blocks.
shipment as stipulated in your o f f e r . When making marks, please no the
Unit 13 Packing《外贸英语函电》PPT课件
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Notes
2.Products that are packed in such a way as to catch the consumer’s eye will help to sell.用那种足以引起消 费者注目的方法加以包装的产品将有助于销售。
意 • to provide information
about 提供信息 • to provide convenience 提
供方便 • to come to realize 开始认
识到
• undergo v.经受 • rough handling 野蛮装卸 • give attention to 注意 • in a cking is an art.” “Packing or container is part of the product.” “Packing should help identify the product inside.”“包装是一门艺术。”“包装或容器 是产品的一部分。”“包装应该有助于识别里面的商品。”
Text B
(A) Dear Sirs,
Re:Trip Scissors In reply to your letter of August 10 inquiring about the packing of the captioned goods,we wish to state as below. Our exported Trip Scissors are packed in boxes of one dozen each, 100 boxes to a carton.The dimensions are 17 cm high,30 cm wide and 50 cm long with a volume of about 0.026 cubic meter.The gross weight is 23.5 kg.,the net weight being 22.5 kg..As to shipping marks outside the carton,in addition to the gross,net and tare weights,the wording “MADE IN CHINA” is also stenciled on the package.Should you have any special preference in this respect, please let us know and we will meet you to the best of our ability. Taking this opportunity,we would like to inform you that we used to pack our scissors in wooden cases but after several trial shipments in carton packing,we found our cartons just as seaworthy as wooden cases.Besides,cartons are less expensive,lighter to carry and cost lower freight.So nowadays more and more clients are preferring carton packing to wooden case packing.We trust that you will agree to our opinion and accept our carton packing. We thank you in advance for your early reply.
Basic Electronics-- Integrated circuits
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Brewer, J.E., Zargham, M.R., Tragoudas, S., Tewksbury, S. “Integrated Circuits”The Electrical Engineering HandbookEd. Richard C. DorfBoca Raton: CRC Press LLC, 2000© 2000 by CRC Press LLC 25Integrated Circuits25.1Integrated Circuit TechnologyTechnology Perspectives •Technology Generations •NationalTechnology Roadmap for Semiconductors25.2Layout, Placement, and Routing What Is Layout?•Floorplanning Techniques •PlacementTechniques •Routing Techniques25.3Application-Specific Integrated Circuits Introduction •Primary Steps of VLSI ASIC Design •Increasing Impact of Interconnection Delays on Design •General Transistor-Level Design of CMOS Circuits •ASIC Technologies •Interconnection Performance Modeling •Clock Distribution •Power Distribution •Analog and Mixed-Signal ASICs Joe E. BrewerIntegrated circuit (IC) technology, the cornerstone of the modern electronics industry, is subject to rapid change.Electronic engineers, especially those engaged in research and development, can benefit from an understanding of the structure and pattern of growth of the technology.Technology PerspectiveA solid state IC is a group of interconnected circuit elements formed on or within a continuous substrate.While an integrated circuit may be based on many different material systems, silicon is by far the dominant material. More than 98% of contemporary electronic devices are based on silicon technology. On the order of 85% of silicon ICs are complementary metal oxide semiconductor (CMOS) devices.From an economic standpoint the most important metric for an IC is the “level of functional integration.”Since the invention of the IC by Jack Kilby in 1958, the level of integration has steadily increased. The pleasant result is that cost and physical size per function reduce continuously, and we enjoy a flow of new, affordable information processing products that pervade all aspects of our day-to-day lives. The historical rate of increase is a doubling of functional content per chip every 18 months.For engineers who work with products that use semiconductor devices, the challenge is to anticipate and make use of these enhanced capabilities in a timely manner. It is not an overstatement to say that survival in the marketplace depends on rapid “design-in” and deployment.For engineers who work in the semiconductor industry, or in its myriad of supporting industries, the challenge is to maintain this relentless growth. The entire industry is marching to a drumbeat. The cost of technology development and the investment in plant and equipment have risen to billions of dollars. Companies that lag behind face a serious loss of market share and, possibly, dire economic consequences.Joe E. BrewerNorthrop Grumman Corporation Medhi R. Zargham andSpyros TragoudasSouthern Illinois University Stuart Tewksbury West Virginia University© 2000 by CRC Press LLCTechnology GenerationsThe concept of a technology generation emerged from analysis of historical records, was clearly defined by Gordon Moore in the 1960s, and codified as Moore’s law. The current version of the law is that succeeding generations will support a four times increase in circuit complexity, and that new generations emerge at approximately 3-year intervals. The associated observations are that linear dimensions of device features change by a factor of 0.7, and the economically viable die size grows by a factor of 1.6.Minimum feature size stated in microns (micrometers) is the term used most frequently to label a technology generation. “Feature” refers to a geometric object in the mask set such as a linewidth or a gate length. The “minimum feature” is the smallest dimension that can be reliably used to form the entity.Figure 25.1 displays the technology evolution sequence. In the diagram succeeding generations are numbered using the current generation as the “0” reference. Because this material was written in 1996, the “0” generation is the 0.35 m m minimum feature size technology that began volume production in 1995.An individual device generation has been observed to have a reasonably well-defined life cycle which covers about 17 years. The first year of volume manufacture is the reference point for a generation, but its lifetime actually extends further in both directions. As shown in Fig. 25.2, one can think of the stages of maturity as ranging over a linear scale which measures years to production in both the plus and minus directions. The 17-year life cycle of a single generation, with new generations being introduced at 3-year intervals, means that at any given time up to six generations are being worked on. This tends to blur the significance of research news and company announcements unless the reader is sensitive to the technology overlap in time.To visualize this situation, consider Fig. 25.3. The top row lists calendar years. The second row shows how the life cycle of the 0.35 m m generation relates to the calendar. The third row shows the life cycle of the 0.25 m m generation vs. the calendar. Looking down any column corresponding to a specific calendar year, one can see which generations are active and identify their respective life cycle year.FIGURE 25.1Semiconductor technology generation time sequence.FIGURE 25.2Life cycle of a semiconductor technology generation.FIGURE 25.3Time overlap of semiconductor technology generations.One should not interpret the 17-year life cycle as meaning that no work is being performed that is relevant to a generation before the 17-year period begins. For example, many organizations are conducting experiments directed at transistors with gate lengths smaller than 0.1 m m. This author’s interpretation is that when basic research efforts have explored technology boundary conditions, the conditions are ripe for a specific generation to begin to coalesce as a unique entity. When a body of research begins to seek compatible materials and processes to enable design and production at the target feature size, the generation life cycle begins. This is a rather diffused activity at first, and it becomes more focused as the cycle proceeds.National Technology Roadmap for SemiconductorsThe National Technology Roadmap for Semiconductors (NTRS) is an almost 200-page volume distributed by the Semiconductor Industry Association (SIA). Focused on mainstream leading edge technology, the roadmap provides a common vision for the industry. It enables a degree of cooperative precompetitive research and development among the fiercely competitive semiconductor device manufacturers. It is a dynamic document which will be revised and reissued to reflect learning on an as-needed basis.The NTRS is compiled by engineers and scientists from all sectors of the U.S. IC technology base. Industry, academia, and government organizations participate in its formulation. Key leaders are the Semiconductor Research Corporation (SRC) and SEMATECH industry consortia. The roadmap effort is directed by the Roadmap Coordinating Group (RCG) of the SIA.The starting assumption of the NTRS is that Moore’s law will continue to describe the growth of the technology. The overall roadmap comprises many individual roadmaps which address defined critical areas of semiconductor research, development, engineering, and manufacturing. In each area, needs and potential solutions for each technology generation are reviewed. Of course, this process is more definitive for the early generations because knowledge is more complete and the range of alternatives is restricted.The NTRS document provides a convenient summary table which presents some of the salient characteristics of the six technology generations ranging from 1995 to 2010. That summary is reproduced (with minor variations in format) as Table 25.1.Year of First DRAM Shipment/Minimum Feature (m m)MemoryBits/chip (DRAM/Flash) 64M 256M 1G 4G 16G 64G Cost/bit @ volume (millicents) 0.017 0.007 0.003 0.001 0.0005 0.0002 Logic (high-volume microprocessor)Logic transistors/cm2 (packed) 4M 7M 13M 25M 50M 90M Bits/cm2 (cache SRAM) 2M 6M 20M 50M 100M 300M Cost/transistor @ volume (millicents) 1 0.5 0.2 0.1 0.05 0.02 Logic (low-volume ASIC)Transistors/cm2 (auto layout) 2M 4M 7M 12M 25M 40M Non-recurring engineering 0.3 0.1 0.05 0.03 0.02 0.01 Cost/transistor (millicents)Number of chip I/OsChip to package (pads) high performance 900 1350 2000 2600 3600 4800 Number of package pins/ballsMicroprocessor/controller 512 512 512 512 800 1024 ASIC (high performance) 750 1100 1700 2200 3000 4000 Package cost (cents/pin) 1.4 1.3 1.1 1.0 0.9 0.8Chip frequency (MHz)On-chip clock, cost performance 150 200 300 400 500 625 On-chip clock, high performance 300 450 600 800 1000 1100 Chip-to-board speed, high performance 150 200 250 300 375 475 Chip size (mm2)DRAM 190 280 420 640 960 1400 Microprocessor 250 300 360 430 520 620© 2000 by CRC Press LLCMax number wiring levels (logic)On-chip4–555–666–77–8 Electrical defect density (d/m2)24016014012010025 Minimum mask count182020222224 Cycle time days (theoretical)91010111112 Maximum substrate diameter (mm)Bulk or epitaxial or SOI wafer200200300300400400 Power supply voltage (V)Desktop 3.3 2.5 1.8 1.5 1.20.9 Battery 2.5 1.8–2.50.9–1.80.90.90.9 Maximum powerHigh performance with heatsink (W)80100120140160180 Logic without heatsink (W)5710101010 Battery (W) 2.5 2.5 3.0 3.5 4.0 4.5 Design and testVolume tester cost/pin ($K) 3.3 1.7 1.30.70.50.4 Number of test vectors (m P/M)16–3216–3216–328–164–84% IC function with BIST/DFT254050709090+Related Topics1.1 Resistors•23.1 ProcessesFurther InformationThe NTRS is available from the SIA, 181 Metro Drive, Suite 450, San Jose, CA 95110, telephone 408-436-6600, fax 408-436-6646. The document can also be accessed via the SEMATECH home page at <>. Information concerning the IC life cycle can be found in Larrabee, G. B. and Chatterjee, P. “DRAM Manu-facturing in the 90’s — Part 1: The History Lesson” and “Part 2: The Roadmap,” Semiconductor International, pp. 84–92, May 1991.Mehdi R. Zargham and Spyros TragoudasVery large scale integrated (VLSI) electronics presents a challenge, not only to those involved in the development of fabrication technology, but also to computer scientists, computer engineers, and electrical engineers. The ways in which digital systems are structured, the procedures used to design them, the trade-offs between hardware and software, and the design of computational algorithms will all be greatly affected by the coming changes in integrated electronics.A VLSI chip can today contain millions of transistors and is expected to contain more than 100 million transistors in the year 2000. One of the main factors contributing to this increase is the effort that has been invested in the development of computer-aided design (CAD) systems for VLSI design. The VLSI CAD systems are able to simplify the design process by hiding the low-level circuit theory and device physics details from the designer, and allowing him or her to concentrate on the functionality of the design and on ways of optimizing it.A VLSI CAD system supports descriptions of hardware at many levels of abstraction, such as system, subsystem, register, gate, circuit, and layout levels. It allows designers to design a hardware device at an abstract level and progressively work down to the layout level. A layout is a complete geometric representation (a set of rectangles) from which the latest fabrication technologies directly produce reliable, working chips. A VLSI © 2000 by CRC Press LLC© 2000 by CRC Press LLC CAD system also supports verification, synthesis, and testing of the design. Using a CAD system, the designer can make sure that all of the parts work before actually implementing the design.A variety of VLSI CAD systems are commercially available that perform all or some of the levels of abstraction of design. Most of these systems support a layout editor for designing a circuit layout . A layout-editor is software that provides commands for drawing lines and boxes, copying objects, moving objects, erasing unwanted objects, and so on. The output of such an editor is a design file that describes the layout. Usually, the design file is represented in a standard format, called Caltech Intermediate Form (CIF), which is accepted by the fabrication industry.What Is Layout?For a specific circuit, a layout specifies the position and dimension of the different layers of materials as they would be laid on the silicon wafer. However, the layout description is only a symbolic representation, which simplifies the description of the actual fabrication process. For example, the layout representation does not explicitly indicate the thickness of the layers, thickness of oxide coating, amount of ionization in the transistors channels, etc., but these factors are implicitly understood in the fabrication process. Some of the main layers used in any layout description are n -diffusion, p -diffusion, poly, metal-1, and metal-2. Each of these layers is represented by a polygon of a particular color or pattern. As an example, Fig. 25.4 presents a specific pattern for each layer that will be used through the rest of this section.As is shown in Fig. 25.5, an n -diffusion layer crossing a poly layer implies an nMOS transistor, and a p -diffusion crossing poly implies a pMOS transistor.Note that the widths of diffusion and poly are represented with a scalable parameter called lambda. These measurements, referred to as design rules, are introduced to prevent errors on the chip, such as preventing thin lines from opening (disconnecting) and short circuiting.FIGURE 25.4Different layers.FIGURE 25.5Layout and fabrication of MOS transistors.© 2000 by CRC Press LLCImplementing the design rules based on lambda makes the design process independent of the fabrication process. This allows the design to be rescaled as the fabrication process improves.Metal layers are used as wires for connections between the components. This is because metal has the lowest propagation delay compared to the other layers. However, sometimes a poly layer is also used for short wires in order to reduce the complexity of the wire routing. Any wire can cross another wire without getting electrically affected as long as they are in different layers. Two different layers can be electrically connected together using contacts. The fabrication process of the contacts depends on types of the layers that are to be connected.Therefore, a layout editor supports different types of contacts by using different patterns.From the circuit layout, the actual chip is fabricated. Based on the layers in the layout, various layers of materials, one on top of the others, are laid down on a silicon wafer. Typically, the processing of laying down each of these materials involves several steps, such as masking, oxide coating, lithography and etching [Mead and Conway, 1980]. For example, as shown in Fig. 25.6(a), for fabricating an nMOS transistor, first two masks,one for poly and one for n -diffusion, are obtained from the circuit layout. Next, the n -diffusion mask is used to create a layer of silicon oxide on the wafer [see Fig. 25.6(b)]. The wafer will be covered with a thin layer of oxide in places where the transistors are supposed to be placed as opposed to a thick layer in other places. The poly mask is used to place a layer of polysilicon on top of the oxide layer to define the gate terminals of the transistor [see Fig. 25.6(c)]. Finally, the n -diffusion regions are made to form the source and drain terminals of the transistor [see Fig. 25.6(d)].To better illustrate the concept of layout design, the design of an inverter in the CMOS technology is shown in Fig. 25.7. An inverter produces an output voltage that is the logical inverse of its input. Considering the circuit diagram of Fig. 25.7(a), when the input is 1, the lower nMOS is on, but the upper pMOS is off. Thus, the output becomes 0 by becoming connected to the ground through the nMOS. On the other hand, if the input is 0, the pMOS is on and the nMOS is off, so the output must find a charge-up path through the pMOS to the supply and therefore becomes 1. Figure 25.7(b) represents a layout for such an inverter. As can be seen from this figure,the problem of a layout design is essentially reduced to drawing and painting a set of polygons. Layout editors provide commands for drawing such polygons. The commands are usually entered at the keyboard or with a mouse and, in some menu-driven packages, can be selected as options from a pull-down menu.FIGURE 25.6Fabrication steps for an nMOS transistor.© 2000 by CRC Press LLCIn addition to the drawing commands, often a layout system provides tools for minimizing the overall area of the layout (i.e., size of the chip). Today a VLSI chip consists of a lot of individual cells, with each one laid out separately. A cell can be an inverter, a NAND gate, a multiplier, a memory unit, etc. The designer can make the layout of a cell and then store it in a file called the cell library. Later, each time the designer wants to design a circuit that requires the stored cell, he or she simply copies the layout from the cell library. A layout may consist of many cells. Most of the layout systems provide routines, called floorplanning, placement and routing routines, for placing the cells and then interconnecting them with wires in such a way that minimizes the layout area. As an example, Fig. 25.8 presents the placement of three cells. The area between the cells is used for routing. The entire routing surface is divided into a set of rectangular routing areas called channels. The sides of each channel consist of a set of terminals. A wire that connects the terminals with the same ID is called a net. The router finds a location for the wire segments of each net within the channel. The following sections classify various types of placement and routing techniques and provide an overview of the main steps of some of these techniques.Floorplanning TechniquesThe floorplanning problem in Computer Aided Design of Integrated Circuits is similar to that in Architecture and the goal is to find a location for each cell based on proximity (layout adjacency) criteria to other cells. We FIGURE 25.7An inverter.FIGURE 25.8Placement and routing.,© 2000 by CRC Press LLCconsider rectangular floorplans whose boundaries are rectangles. It is desirable to obtain a floorplan that minimizes the overall area of the layout.An important goal in floorplanning is the cell sizing problem where the goal is to determine the dimensions of variable cells whose area is invariant. All cells are assumed to be rectangular, and in the cell sizing problem the goal is to determine the width and height of each cell subject to predetermined upper and lower bounds on their ratio, and to their product being equal to its area, so that the final floorplan has optimal area.One of the early approaches in floorplanning is the hierarchical, where recursive bipartition or partition into more than two parts is recursively employed and a floorplan tree is constructed. The tree simply reflects the hierarchical construction of the floorplan. Figure 25.9 shows a hierarchical floorplan and its associated tree.The partitioning problem and related algorithms are discussed extensively later in this section.Many early hierarchical floorplanning tools insist that the floorplan be sliceable. A sliceable floorplan is recursively defined as follows: (a) a cell or (b) a floorplan that can be bipartitioned into two sliceable floorplans with either a horizontal or vertical line. Figure 25.10 shows a sliceable floorplan whose tree is binary.Many tools that produce sliceable floorplans are still in use because of theirsimplicity. In particular, many problems arising in sliceable floorplanning are solv-able optimally in polynomial time [Sarrafzadeh and Wong, 1996]. Unfortunately,sliceable floorplans are rarely optimal (in terms of their area), and they often resultin layouts with very difficult routing phases. (Routing is discussed later in thissection.) Figure 25.11 shows a compact floorplan that is not sliceable.Hierarchical tools that produce nonsliceable floorplans have also been proposed[Sarrafzadeh and Wong, 1996]. The major problem in the development of suchtools is that we are often facing problems that are intractable and thus we have to rely on heuristics in order to obtain fast solutions. For example, the cell sizing problem can be tackled optimally in sliceable floorplans [Otten, 1983 and Stock-meyer, 1983] but the problem is intractable for general nonsliceable floorplans.A second approach to floorplanning is the rectangular dual graph. The idea here is to use duality arguments and express the cell adjacency constraints in terms of a graph, and then use an algorithm to translate the graph into a rectangular floorplan. A rectangular dual graph of a rectangular floorplan is a planar graph G = (V ,E),where V is the set of cells and E is the set of edges, and an edge (C 1,C 2) is in E if and only if cells C 1 and C 2are adjacent in the floorplan. See Fig. 25.12 for a rectangular floorplan and its rectangular dual graph G.FIGURE 25.9 A hierarchical floorplan and its associated tree. The root node has degree 5. The internal node labeled with |indicates a vertical slicing. The internal node labeled with — indicates a horizontal slicing.FIGURE 25.10A sliceable floorplan and its associated binary tree.FIGURE 25.11 A com-pact layout that is notsliceable.© 2000 by CRC Press LLC Let us assume that the floorplan does not contain cross junctions. Figure 25.13 shows a cross junction. This restriction does not significantly increase the area of a floorplan because, as Fig. 25.13 shows, a cross junction can be replaced by two T-junctions by simply adding a short edge e.It has been shown that in the absence of cross junctions the dual graph is planar triangulated (PT), and every T-junction corresponds to a triangulated face of the dual PT graph. Unfortunately, not all PT graphs have a rectangular floorplan. For example, in the graph of Fig. 25.14 we cannot satisfy the adjacency require-ments of edges (a,b), (b,c) and (c,a) at the same time. Note that the later edges form a cycle of length three that is not a face. It has been shown that a PT graph has a rectangular floorplan if and only if it does not contain such cycles of length three. Moreover, a linear time algorithm to obtain such a floorplan has been presented [Sarrafzadeh and Wong, 1996]. The rectangular dual graph approach is a new method for floorplan-ning, and many floorplanning problems, such as the sizing problem, have not been tackled yet.Rectangular floorplans can be obtained using simulated annealing and genetic algorithms. Both techniques are used to solve general optimization problems for which the solution space is not well understood. The approaches are easy to implement, but the algorithms have many parameters which require empirical adjust-ments, and the results are usually unpredictable.A final approach to floorplanning, which unfortunately requires substantial computational resources and results to an intractable problem, is to formulate the problem as a mixed-integer linear programming (LP).Consider the following definitions:W i ,H i ,R i : width, height and area of cell C iX i ,Y i : coordinates of lower left corner of cell C iX,Y : the width and height of the final floorplanA i ,B i : lower and upper bound for the ratio W i /H i of cellC iP ij , Q ij : variables that take 0/1 values for each pair of cells C i and C jThe goal is to find X i ,Y i ,W i , and H i for each cell so that all constraints are satisfied and XY is minimized.The latter is a nonlinear constraint. However, we can fix the width W and minimize the height of the floorplan as follows:FIGURE 25.12 A rectangular floorplan and its associated dual planer graph.FIGURE 25.13 A cross junction can be replaced by 2 T-junctions.FIGURE 25.14For a cycle of size 3 that is not a face we cannot satisfy all constraints.min YX i + W i £ WY ³ Y i + H iThe complete mixed-integer LP formulation is [Sutanthavibul et al., 1991]:min YX i ,Y i ,W i ³ 0P ij ,Q ij = 0 or 1X i + W i £ WY ³ Y i + H iX i + W i £ X j + W(P ij + Q ij )X j + W j £ X i + W(1-P ij + Q ij )Y i + H i £ Y j + H(1 + P ij -Q ij )Y j + H j £ Y i + H(2-P ij -Q ij )When H i appears in the above equations, it must be replaced (using first-order approximation techniques)by H i = D i W i + E i where D i and E i are defined below:W min = W max = H min = H max = D i = (H max – H min )/(W min – W max )E i = H max – D i W minThe unknown variables are X i , Y i , W i , P ij , and Q ij . All other variables are known. The equations can then befed into an LP solver to find a minimum cost solution for the unknowns.Placement TechniquesPlacement is a restricted version of floorplanning where all cells have fixed dimension. The objective of aplacement routine is to determine an optimal position on the chip for a set of cells in a way that the totaloccupied area and total estimated length of connections are minimized. Given that the main cause of delay ina chip is the length of the connections, providing shorter connections becomes an important objective in placinga set of cells. The placement should be such that no cells overlap and enough space is left to complete all theconnections.All exact methods known for determining an optimal solution require a computing effort that increasesexponentially with number of cells. To overcome this problem, many heuristics have been proposed [Preas andLorenzetti, 1988]. There are basically three strategies of heuristics for solving the placement problem, namely,constructive, partitioning, and iterative methods. Constructive methods create placement in an incrementalmanner where a complete placement is only available when the method terminates. They often start by placinga seed (a seed can be a single cell or a group of cells) on the chip and then continuously placing other cellsbased on some heuristics such as size of cells, connectivity between the cells, design condition for connectionlengths, or size of chip. This process continues until all the cells are placed on the chip. Partitioning methodsdivide the cells into two or more partitions so that the number of connections that cross the partition boundariesR i A iR i B iR i B i¤R i A i¤is minimized. The process of dividing is continued until the number of cells per partition becomes less than a certain small number. Iterative methods seek to improve an initial placement by repeatedly modifying it. Improvement might be made by transforming one cell to a new position or switching positions of two or more cells. After a change is made to the current placement configuration based on some cost function, a decision is made to see whether to accept the new configuration. This process continues until an optimal (in most cases a near optimal) solution is obtained. Often the constructive methods are used to create initial placement on which an iterative method subsequently improves.Constructive MethodIn most of the constructive methods, at each step an unplaced cell is selected and then located in the proper area. There are different strategies for selecting a cell from the collection of unplaced cells [Wimer and Koren, 1988]. One strategy is to select the cell that is most strongly connected to already placed cells. For each unplaced cell, we find the total of its connections to all of the already placed cells. Then we select the unplaced cell that has the maximum number of connections. As an example consider the cells in Fig. 25.15. Assume that cells c1 and c2 are already placed on the chip. In Fig. 25.16 we see that cell c5 has been selected as the next cell to be placed. This is because cell c5 has the largest number of connections (i.e., three) to cells c1 and c2.FIGURE 25.15 Initial configuration.FIGURE 25.16 Selection based on the number of connections.。
外贸英语包装packing有关实用词组
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1.sale or inner packing 内包装2.the transportation packing or outer packing外包装3.With reference to the packing of our order No.168 for...关于我方第168号有关……货物的包装问题……4. packing method of... 。
的包装方式5.packing arrangement 包装安排6. to your convenience and satisfaction 让你们感到方便和满意7. We look forward to your early reply. 期盼尽早回复8. Please tell us whether the packing requirements could be met.请告诉我们此包装要求能否达到要求?9. ready to accept 打算接受10. We feel regretful to inform you that... 遗憾地告诉贵方……11. meet your request of the special packing material.满足贵方对使用这种特殊包装材料的要求?12. prefer A to B. 宁愿选择A,而不是B13. your confirmation on the issue of packing贵方对包装事宜的确认15. in FCL (Full Container Load) container 用整集装箱装运16.waterproof and airtight 防水且不漏气的17. seaworthy export packing 适于海运的出口包装18. inner/sales packing 内包装19. outer/transportation packing 外包装20. green packing 绿色/环保包装21. shipping mark 运输标志22. indicative mark 指示性标志23. warning mark 警告性标志24. strong enough 足够坚固25. solid and durable 坚固耐用26. suited to the climate/transportation modes 适合气候条件/运输方式27. number of packages 件数28. package number 件号29. pack sth. in... 某商品用……容器来装30. pack... to... 把……装入……31. pack sth. to... and... to... 把某商品装入……容器,再把若干个此种容器装入……32. pack each... in... and... to... 每件……商品用……包装,若干件该商品装入……容器33. Please mark the case with... 请在箱子上刷上……的标记?34. withstand rough handling 经得起粗暴装卸35. strong enough to withstand rough handling 足够牢固,能禁得起野蛮装卸36. be lined with 内衬。
Clearance of ISPM 15 compliant wood packing and …
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Compliance Agreement Notice – 2004/13I n t e r n a t i o n a l S t a n d a r d f o r P h y t o s a n i t a r yM e a s u r e s(I S P M)#15Australian Implementation of the International Standard for Phytosanitary Measures (ISPM) # 15: Guidelines for Regulating Wood Packaging Material in International Trade (ISPM 15)On 1 September 2004, Australia will implement the new international standard for solid wood packing1 and dunnage - the International Standard for Phytosanitary Measures (ISPM) # 15: Guidelines for Regulating Wood Packaging Material in International Trade (ISPM 15).This notice is to provide information about facilitated clearance procedures for containerised solid wood packing compliant with ISPM 15.C H A N G E S I N E F F E C T F R O M1S E P T E M B E R2004From 1 September 2004, AQIS will accept solid timber packing and dunnage compliant with ISPM 15 in addition to packing which meets existing AQIS requirements.For AQIS purposes, ISPM 15 treated packing:∙Will not require a treatment certificate (providing that the packing declaration indicates ISPM 15 compliance and freedom from bark).∙Will not need to satisfy the 21 day rule. There is no limitation on time between treatment and shipping (please note this rule is being reviewed for Australia’s existing wood packing import conditions).∙Will be considered acceptable under existing AQIS Compliance Agreement arrangements such as the Containerised Cargo Clearance for FCL/X Scheme.1 Solid wood packing excludes packing made entirely from composite boards, plywood, and medium density fibre board. Please see ICON (.au) for import conditions for these products.P A C K I N G D E C L A R A T I O N SFor AQIS, the packing declaration is an essential quarantine risk management tool as it identifies what has been used as packing within a consignment.The general requirements for packing declarations have not changed; in order for any packing declaration to be acceptable it must contain the following information (as taken from the Containerised Cargo Clearance Manual):∙Letterhead or company stamp∙Date or vessel/voyage reference∙Consignment identifier or numerical ink∙Straw declaration∙Timber declaration and bark declaration where required∙SignatureIn regards to ISPM 15, a packing declaration identifies if ISPM 15 compliant timber packing has been used within a consignment. Attachments 1 and 2 show the revised packing declarations.The revised packing declarations include a new question relating to timber packing. Question 2b asks if all timber packing in the consignment has been marked with ISPM 15 compliant stamps.∙If a yes answer is given, this means that an acceptable treatment has been performed on the timber packing and no further treatment certification isrequired for the timber packing used in the consignment.∙If a no answer is given, consignments must be accompanied either by an acceptable treatment certificate or directed for AQIS inspection (a noresponse means that some or all of the packing is not marked with theISPM15 stamp).The revised packing declaration is only mandatory where timber packing used within a consignment is ISPM 15 compliant.Please note that annual packing declarations will not be accepted for consignments where ISPM 15 compliant timber packing has been used.All other packing is subject to existing AQIS requirements and approved treatments. Further information on these requirements can be found on the AQIS website at .au/cargoqap.For further information regarding ISPM 15 compliant packing, please contact Doug Walsh on 02 6272 4989.C H A N G E S T O T H E C O N T A I N E R I S ED C A R G OC L E A R A N C E M A N U A L–1S E P T E M B E R2004On 1 September 2004, amendments to the Containerised Cargo Clearance Manual will be distributed to industry. Section 4 of the manual defines the requirements for Packing Declarations.The following changes will be made to Section 4:∙Addition of the new question relating to ISPM 15 timber packing under part2.8 Timber Packing Statement∙Amendment of the example packing declaration at the end of the sectionAgain, please note that current clearance procedures for timber packing used within a consignment are still acceptable. The revised packing declarations need only be used by those countries who choose to use ISPM 15 treatments for their timber packing.For further information regarding the changes to the Containerised Cargo Clearance Manual, please contact Rossana Simoncini on 02 6272 4139.Attachment 2。
包装(Packing)常用语句中英文对照
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包装(Packing)常用语句中英文对照第一篇:包装(Packing)常用语句中英文对照包装(Packing)常用语句中英文对照We will mark the packages the same as before.我们将在货包上刷上和以前一样的唛头。
Please make an offer indicating the packing.请报价并说明包装情况。
The next thing I'd like to bring up for discussion is packing.下面我想提出包装问题讨论一下。
Packing has a close bearing on sales.包装直接关系到产品的销售。
Packing also effects the reputation of our products.包装也影响产品的声誉。
A packing that catches the eye will help us push the sales.醒目的包装有助于我们推销产品。
Buyers always pay great attention to packing.买方很注意包装的情况。
I'm sure the new packing will give your clients satisfaction.我相信新包装定会使您的客户满意。
Different articles require different packing.不同商品需要不同的包装。
Generally speaking, buyers bear the charges of packing.包装费用一般由买方负担。
Packing charge is about 3% of the total cost of the goods.包装费用占货物总值的百分之三。
Normally, packing charge is included in the contract price.一般地,合同价格中已经包括了包装费用。
IEEE_Spectrum_
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have the most valuable patents in batteries, clean coal, fuel cells, and five other categories. To see where your company ranks, dive deep into our interactive charts, created by the Dutch firm Information Design Studio, and discuss the rankings in our new commenting system.
单词缩写 沃尔沃汽车零部件开发项目
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SICM SML SOP SP SPA SPC SPFU SPL SQR SREA SRICA SRSA STA TA TCF TE TIE TMS TO TPD TPL TR TS TT UN UP UPL VCCS VCE VCG VCI VCMS VCPA VCT VIR VLD VPDS VQE VRT VSIM VSIM WCR
Emergency Responce Action ElectroStatic Discharge Engineering Sample Evaluation Report Early Supplier Involvement Engineering Statement of Work Engineering Statement Of Work Field Action Board Field Action Stop Shipment Factory Complete Functions Left In Tiko Final Status Report Full Truck Load Global 8 Diciplines Geometry Assurance Engineer Global Dimensioning Tolerancing Geomtry Engineer Global Product Development System Geometry System Utvecklare Global Terms & Conditions Global Terms & Conditions Global Technology Development System Inbound logistics Interim Containment Action ISO Modular Carton International Material Data System Induvidual Moving Range Intellectual Property International Plant Protection Convention International Standard International Standards for Phytosanitary Measures Joined Purchasing Team Knock Down Operations Kontruktions Data Personvagnar Key Performance Indicator Key process Input Variables Key Process Output Variables Lean Deployment Assessment Lean Enterprise Quality Management Logistics Service Provider Ministry of Environmental Protection Materials Management Operations Guideline Logistics Evaluation Multi Party Matrix Milk Run Material Required Date Manufacturing Site Assessment Measurement System Analysis Master Service Agreements Non Disclosure Agreement New Model Launch Normal Weekly Capacity Overall Equipment Effectiveness Operational Management Open To Go Problem Analys
进出口专业英语词汇(T1)
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进出口专业英语词汇(T1)t bandage 丁字带t-access coupler t形通路耦合器t-bend 三通管t-branch pipe 三通管t-breaker t型断路器t-bulb steel 球头丁字钢t-cloth 标布t-head bolt 丁字头螺栓t-pipe 三通管t-shirt 短袖圆领衫t-slot milling cutter t型槽铣刀t-square 丁字尺t-steel t形钢t-topper 圆领衫t-tube 丁字管t-type tooth collect bar 钉齿校正棒t.s. urea formaldehyde moulding powder 电玉粉ta ta 大大泡泡糖tab vaccine 伤寒副伤寒甲乙菌苗tab. neutral protease 中性蛋白酶片tabard 塔巴德式外衣tabaret 塔巴勒绸tabasco sauce 塔巴斯哥辣酱油tabasheer 竹黄tabatrex 驱虫特tabby velvet 平背丝绒tabby 平纹绉绸tabby-back corduroy 平纹背灯芯绒tabellae acetyl spiramycini 乙酰螺旋霉素片tabellae natrii bicarb compositae 复方碳酸氢钠片tabellae swertlae mileensis 青叶胆片tabernacle organ 管风琴tabi sock 日本式短袜tabinet 波纹塔夫绸tabis 塔比绸table balance 托盘天平table beet 食用甜菜table centre lace 通花台心布table clamp 台钳table clock 台钟table cloth of paper 纸桌布table cloth 台布table concentrator 摇床table cover 台布table cutlery 餐刀table damask 台布花缎table drive motor 工作台驱动电动机table easel 绘画台table electric dental engine 台式牙钻table feeder 台式给料器table for table tennis 乒乓球台table fork 餐叉table game 台式游戏机table glassware 餐桌用玻璃器皿table jelly cutting machine 水晶软糖切块机table knife 餐刀table lace 通花台布table lamp 台灯table lighter 台式打火机table linen 亚麻台布table mat of paper 餐桌纸垫table mirror 台镜table model profile projector 台式轮廊投影仪table napkin 餐巾table pad 台垫table padding 台布垫布table planing machine 龙门刨床table potato 餐用马铃薯table poultry 肉用鸡table receiver 台式收音机table roll 台辊table salt 食盐table screen 台屏table serrated knife 餐齿刀table set 成套餐具table soy sauce 佐餐酱油table speed indicator 转盘转速指示器table spoon 餐匙table spun sugar processor 台式棉花糖机table tennis ball 乒乓球table tennis bat 乒乓球拍table tennis net & post 乒乓球网和架table tennis post 乒乓球网架table tennis robot 乒乓发球机table tennis set 套装乒乓球table tennis table 乒乓球台table tennis training machine 乒乓球训练机table top paper 桌布纸table top 台面table tripod 台式三角架table type airless shot blasting machine 台式真空抛丸清理机table type conveyer 台式输送机table type rock drill 台式凿岩机table type stereo recorder-receiver 台式立体声收录机table vibrator 台式振动器table vice for wood working 木工台虎钳table vice with anvil 有砧台虎钳table vice without anvil 无砧台虎钳table vinegar 食醋table white wine 白餐酒table writing paper 书写用薄纸table 桌子table-type torque balance 台式扭力天平table-vice 台虎钳tablecloth paper 桌布纸tablecloth with crochet insertion 勾针镶拼台布tablecloth with fillet squares and edges 菲立拼方台布tablecloth with lace border 镶边台布tablet and pill filling machine 药片药丸盛装机tablet car 小平板车tablet compressing machine 压片机tablet for blood-enriching and mind-tranquilizing 补血宁神片tablet for chronic nephritis 肾康宁片tablet for coronary heart disease and hypertension 心血宁片tablet for osteo phyte 骨质增生片tablet for preventing common cold 防感片tablet for promoting coronary circulation 活血通脉片tablet for relieving rigidity of muscles and promoting bloodcirculation 舒筋活血片tablet for replenishing blood and treating aplastic anemia 再障生血片tablet for treating common cold 感冒清片tablet for treating osteomyelitis 抗骨髓炎片tablet for women's health and tranquilness 妇康宁片tablet of acanthopanax senticosus 刺五加片tablet of antelope's horn for common cold 羚羊感冒片tablet of antibechic and antiasthmatica 止咳止喘片tablet of corydalis tuber for alleviating pain 元胡止痛片tablet of cow-bezoar for children 小儿牛黄片tablet of cow-bezoar for throat trouble 牛黄益金片tablet of cow-bezoar for tranquilization 安脑牛黄片tablet of ganoderma extract 灵芝浸骨片tablet of ten ingredients for woman diseases 妇科十味片tablet packing machine 片剂包装机tablet paper 便笺用纸tablet press 压片机tableting press 压片机tableware detergent 餐具洗涤剂tableware dryer 餐具干燥器tableware washing and sterilizing equipment 餐具清洗消毒设备tableware 餐具tabling 桌布taborette 塔布雷特窗帘绸taborine 塔博林波纹呢tabriz rug 塔布里兹地毯tabulating machine 制表机tabulating paper 表格纸tabutrex 驱虫特tachigaren 土菌消tacho-alternator 测速同步发电机tacho-generator 测速发电机tachograph 转速记录器tachometer drive cable 转速表传动软轴tachometer generator 测速发电机tachometer wheel 测速轮tachometer 流速计tachomotor 测速电动机tachopulsometer of decimal scale 十进制流速脉搏计tachoscope 转速表tachymater theodolite 视距经纬仪tachymeter 视距仪tachymeter-transit 视距中星仪tachystoscope 速示器tacitron 噪声闸流管tack claw 平头钉拔除器tack welder 定位焊机tack-hammer 钉锤tackle gear 滑车齿轮tackle twill 运动服斜纹布tackle 滑车tackle-block 起重滑车tacky fibre 粘结纤维tacrine 他克林tacryl 聚丙烯腈纤维tactic polymer 有规聚合物tactic polypropene 有规聚丙烯tactical air missile 战术航空导弹tactical defence alert radar 战术防御警戒雷达tactical jamming transmitter 战术干扰发射机tactical missile 战术导弹tactical-control radar 战术控制雷达tactile sensor 触感传感器tactometer 触觉测量器tactron 冷阴极充气管tadla cotton 塔德拉棉taf steel taf铁素体耐热合金钢taffa plaid 长方格棉塔府绸taffeta armure 花塔夫绸taffeta brocade 花塔夫绸taffeta chameleon 闪光塔夫绸taffeta checked 格子塔夫绸taffeta chiffon 细塔夫绸taffeta coutil 白地彩条塔夫绸taffeta faconne 提花塔夫绸taffeta flannel 轻质条格法兰绒taffeta fleure 彩色小花卉纹塔夫绸taffeta lining 里子塔夫绸taffeta lustre 光亮塔夫绸taffeta metallique 金属色彩塔夫绸taffeta mousselin 精细塔夫绸taffeta plain 素塔夫绸taffeta pointille 小花塔夫绸taffeta ribbon 塔夫绸带taffeta slip 塔夫绸套裙taffeta souplesse 软塔夫绸taffeta tinsel check 格塔绢taffeta uni 单色塔夫绸taffeta 塔夫绸taffetaline 绢丝塔夫绸taffetas alpaca 阿尔帕卡塔夫绸taffetas arc-en-ciel 虹彩塔夫绸taffetas boyaux 格子花纹塔夫绸taffetas bright 高级素色塔夫绸taffetas broché 绣花全丝塔夫绸taffetas changeant 闪光塔夫绸taffetas chine 印经全丝塔夫绸taffetas d'herbe 草地塔夫绸taffetas de florence 佛罗伦萨薄塔夫绸taffetas fleuret 弗里雷特塔夫绸taffetas prismatique 虹彩塔夫绸taffetas quadrille 格子塔夫绸taffetas royal 多色条纹塔夫绸taffetine 塔夫泰因里子绸taffety 塔夫绸tafftop 塔夫托普粘胶短纤维taffy 太妃糖taft 塔夫特牌汽车tafta 塔夫太绸tag blank 标签用纸tag fungicid hl 311 赛力散tag 赛力散tagamet tablet 泰胃美片tagger plate 极薄镀锡薄钢板taggers tin 镀锡薄钢板taglutimide 他谷酰胺tagora 塔戈拉牌汽车taihore hemp 泰霍里大麻tail coat 燕尾服tail gate spreader 尾部挡板式石屑撒布器tail hair 鬃尾tail of red ginseng 红直参须tail pipe 尾管tail stripper 带卷直头机tail-first plane 前尾式飞机tail-light 尾灯tailed cotton 索棉tailed shirt 圆边衬衫tailing elevator 尾矿提升机tailor paper 服装剪裁纸tailor's chalk 裁缝用划粉tailor's goose 裁缝熨斗tailor's scissors 裁缝剪刀tailor's table blanket 裁缝用台毡tailor's tape 裁缝尺tailor-made fibre 特制纤维tailor-made polymer 特制的聚合物tailored costume 定做的服装tailored suit 西装tailoring machine 成衣机tailstock 尾架tairilin 台丽琳聚酯纤维taitinger 泰丁歇香槟酒tajmir fibre 泰米尔纤维takano 高野牌手表take reel 卷线筒take-up machine 绕丝机take-up winder 绕丝机taker 取料机takesulin vial 注射用达克舒林taking machine 取料机takri 泰克里白棉布talampicillin 酞氨苄西林talastine 他拉斯丁talbot cotton 塔尔博特棉talbutal 他布比妥talc 滑石talc grain 滑石小粒talc lump & grain 滑石碎块talc lump 滑石块talc powder 滑石粉talc stone 滑石talipot 扇形棕榈talisomycin 他利霉素talitan rug 床罩用棉毯talk radio 收音对话两用机talkback microphone 对讲传声器talkback speaker 联络电话扩音器tall hat 大礼帽tall oil pitch 塔罗油树脂tall oil resin 塔罗油松香tall oil 塔罗油tall socks 高统短袜tallow fatty acid 动物脂肪酸tallow oil 牛羊油tallow seed oil 乌桕子油talma 旧式大披肩talmi gold 塔尔米假金talniflumate 他尼氟酯talosalate 他洛沙酯tam alloy 塔姆铁钛合金tam 无沿圆帽tamala oil 梓樟油tamaxin capsule 他莫昔芬胶囊tambac alloy 顿巴克黄铜合金tambac 沉香tambour curtain 刺绣窗帘tambour for embroidery machine 刺绣机绷子tambour lace 绷子刺绣花边tambour muslin 绷子绣花用棉布tambour needle 刺绣针tambour 绷子刺绣品tambour-making machine 刺绣品加工机tambourine 铃鼓tamis 精纺毛筛绢tamise 泰米斯薄呢tamiska 低级梳毛衣料tamitinol 他米替诺tammy 棉经毛纬平纹呢tamo'-shanter 绒球女帽tamoxifen 他莫西芬tamper pneumatic rammer 气动夯槌tamper 打夯机tampic 坦皮克牌手表tamping drum 辗压滚筒tamping hammer 捣固锤tamping iron 铁夯tamping machine 捣固机tamping plate 捣固板tamping rod 捣固杆tamping roller 夯击式压路机tamping-levelling finisher 整平捣固机tamron 腾龙牌照相器材tamtine 绢丝塔夫绸tan cloth 红褐色布tana silk 塔纳丝tancao hemp 坦考麻tanco 天高牌手表tandamine 坦达明tandem acme tap 阿克姆梯形扣丝锥tandem bladed inducer 串联诱导叶轮tandem brush 串联电刷tandem capacitor 双定片组电容器tandem cold mill 串列式冷轧机tandem cold strip mill 串列式带材冷轧机tandem compound engine 串排复缸蒸汽机tandem compressor 串排复缸压缩机tandem condenser 双定片组电容器tandem connected turbine 串联式涡轮机tandem cylinder 串联式汽缸tandem disc harrow 串联圆盘耙tandem engine 串联式发动机tandem fuel pump 串联燃油泵tandem fulling machine 双辊缩绒机tandem gas engine 串排复缸瓦斯发动机tandem ion analyzer 串联式离子分析仪tandem knife switch 串联闸刀开关tandem machine 双系统针织机tandem master cylinder 串联式双制动总泵tandem metal 坦德姆合金tandem mill 连轧机tandem mixer 复式搅拌机tandem motor 串联式电动机tandem piston 串联活塞tandem propeller 串列螺旋桨tandem road roller 双轮压路机tandem roller 串联式压路机tandem selector 汇接选组器tandem sheet mill 串列式薄板轧机tandem stabilizer 串联稳定器tandem stranding machine 串列式捻股机tandem tension packer 串联式拉伸封隔器tandem tin-plate mill 串列式镀锡薄网板轧机tandem tractor 串联式拖拉机tandem truck 拖挂卡车tandem turbine 串联式汽轮机tandem type road roller 两轮压路机tandem vibratory roller 两轮振动压路机tandem 中级漂白亚麻平布tandem-bowl scraper 串联斗式铲运机tandem-compound flow turbine 串联复式涡轮机tandem-compound turbine 串联式涡轮机tandem-drawing machine 串列式拉拔机tandem-rotor helicopter 纵列式直升机tang instant drink 果珍速溶饮品tang 果珍饮料tanga 三角裤tangent bender 切线弯板机tangent compass 正切罗盘tangent die 切线板牙tangent galvanometer 正切电流计tangent pump 切线增压泵tangential brush 切向电刷tangential chaser 切向螺纹梳刀tangential flow fan 切向流动式通风机tangential flow turbine 切向流动式涡轮机tangerine essence 红桔香精tangerine in syrup 糖水桔子tangerine oil 红桔油tangerine peel bolus 桔红丸tangerine peel 桔皮tangerine pith 桔络tangerine seed 桔核tangerine 红桔tangib 坦吉平纹细薄棉布tangut dragonhead 唐古特青兰tanikalon 塔尼卡纶tank barge 油驳船tank body truck 油槽汽车tank boiler 火管锅炉tank car blower 油槽车吹扫机tank car 油槽车tank classifier 槽式分级机tank cleaning barge 油轮清洗驳tank cleaning pump 油舱清洗泵tank coil heater 油罐盘管加热器tank crew helmet 坦克乘员帽tank drawing machine 箱式拉丝机tank filler 装罐机tank gauge 油箱液位计tank indicator 油箱指示器tank level indicator 油槽液面指示器tank locomotive 带水柜机车tank lorry 槽车tank mixer 罐式混合器tank oil level alarm 油箱油位警报器tank oil temperature alarm 油箱油温警报器tank oil 商品油tank pressure distributor 压力喷洒机tank pressure gauge 油罐压力计tank regulator 油罐调整器tank relief valve 油罐放气阀tank sampler 储罐取样器tank service car 加油车tank sprayer 喷洒机tank sprinkler 洒水车tank suction heater 油罐抽吸加热器tank suit 坦克装tank top 大圆领女背心tank trailer 装运坦克的挂车tank transformer 油冷变压器tank truck pump 油槽车泵tank truck 油罐车tank vessel 油船tank wagon 铁路油槽车tank 罐tank-car heater 油槽车加热器tank-carrying truck 油罐车tank-mounted electric fuel pump 装在坦克上的电动燃油泵tank-type circuit breaker 箱形断路器tank-type hydraulic classifier 槽形水力分级机tank-type oil circuit breaker 箱型油断路器tankard 有柄大啤酒杯tanker container ship 集装箱油轮tanker 油轮tanker-spreader 液肥喷洒机tankometer 油罐容量计tannage machine 鞣皮机tanned jute 精制黄麻tanner oil 鞣革油tanner's knife 鞣皮刀tannery machine 鞣革机tannic acid 鞣酸tannin 丹宁tanning extracts 栲胶tanning machine 鞣皮机tanning mill 鞣料粉碎机tanning paper 鞣革纸tannometer 鞣液比重计tanqueray dry gin 探戈雷英式毡酒tantalite niobite power 钽铌粉tantalite powder 钽粉tantalum analyzer 钽含量分析仪tantalum and niobium ore 钽铌矿砂tantalum boride 硼化钽tantalum capacitor 钽电容器tantalum carbide 碳化钽tantalum chip capacitor 钽薄片电容器tantalum detector 钽检波器tantalum die 钽模tantalum electrolytic capacitor 钽电解电容器tantalum electrolytic condenser 钽电解电容器tantalum lamp 钽丝灯tantalum metal powder 钽粉tantalum niobium concentrate 钽铌矿tantalum niobium ore 钽铌矿砂tantalum nitride 氮化钽tantalum oxide 氧化钽tantalum pentoxide 五氧化二钽tantalum powder 钽粉tantalum rectifier 钽整流器tantalum rod 钽条tantalum silicide 硅化钽tantalum tube 钽管tantalum wire 钽丝tantalum 钽tap bit 螺孔钻头tap bolt 带头螺栓tap borer 螺孔钻tap chuck 丝锥夹套tap detector 搭线窃听检测器tap drill 螺孔钻tap for bicycle 自行车丝锥tap for sewing machine 缝纫机螺纹丝锥tap grinding machine 丝锥磨床tap inspection machine 丝锥检查机tap rivet 螺旋铆钉tap switch 分线开关tap transformer 抽头变压器tap with plain cylindrical pilot 带普通外圆导柱的丝锥tap wrench 丝锥扳手tap 水龙头tapa fibre 塔帕纤维tapa 塔帕纤维布tapalos 多色墨西哥披肩或围巾tape armored cable 钢带铠装电缆tape butt-seam welding machine 带状对接缝焊机tape cable connector 带式电缆连接器tape cassette 盒式磁带tape checks 坦普切克薄棉布tape cleaning machine 磁带清洗机tape comparator 磁带比较器tape controller 带控制器tape cutting machine 条带式裁剪机tape duplicator 磁带复制机tape eraser 磁带消磁器tape facsimile equipment 带式传真机tape footage counter 带长计数器tape handler 磁带处理机tape injection mold 磁带注塑模tape loom 织带机tape magnet eliminator 磁带消磁器tape measure 卷尺tape memory 磁带存储器tape output register 磁带输出寄存器tape perforator 纸带穿孔机tape printer 印字电报机tape punch typewriter 纸带穿孔打字机tape recorder head 磁带录音机磁头tape recorder 磁带记录器tape recording machine 磁带录音机tape reproducer 磁带放声机tape rule 卷尺tape sealant 粘封带tape sealing machine 胶带封箱机tape teleprinter 纸带式电传打字机tape transmitter 纸带发报机tape verifier 纸带校对机tape winding machine 绕带机tape yarn 扁丝tape-controlled turret punching-machine 程序控制转塔车床tape-reading punch 读带穿孔机taped forming and assembling machine 带式成形组装机tapeless digital multitrack recorder 无磁带数字式多轨录音机taper bit 锥形钻头taper bolt 锥形螺栓taper calipers 锥度卡规taper candle 尖烛taper connector 锥形连接器taper coordinated oil-pressure dismantler 锥度配合油压拆卸工具taper coupler 锥形耦合器taper crusher 圆锥破碎机taper drill 锥柄麻花钻taper drum oil seal 锥形鼓油封taper elastic washer 锥形弹性垫圈taper end milling cutter with coarse teeth 粗齿锥柄立铣刀taper end milling cutter with fine teeth 细齿锥柄立铣刀taper end milling cutter with middle coarse teeth 中粗齿锥柄立铣刀taper file 锥形锉taper gauge 锥度规taper gear milling cutter 锥齿轮铣刀taper hob 锥形滚刀taper key way milling cutter 锥柄键槽铣刀taper leaf spring for vehicle 车辆锥形钢板弹簧taper machine reamer 锥形机用铰刀taper mandrel 锥形心轴taper mill tool 锥形铣刀taper mill 楔形扁材轧机taper pin reamer 锥形销孔铰刀taper pin 锥形销taper pipe reamer 锥管铰刀taper pipe tap 锥形管taper pipe thread die 锥管螺纹板牙taper pipe thread 锥形管螺纹taper plain plug gauge 锥度光滑塞规taper plain ring 锥度光滑环taper plate condenser 递变式平板电容器taper plug gauge 锥度塞规taper reamer 锥形铰刀taper ring 锥形环taper rivet 锥形铆钉taper roller bearing 锥形滚柱轴承taper rolling mill 变断面轧机taper saw file 尖锯锉taper saw 斜形狭圆锯taper screw 锥形螺钉taper shaft 锥形轴taper shank adjustable reamer 锥形柄可调铰刀taper shank core drill 锥柄扩孔钻taper shank cutter 锥柄铣刀taper shank drill 锥柄钻头taper shank end mill 锥柄立铣刀taper shank end milling cutter 锥柄立铣刀taper shank end slotting cutter 锥柄立铣刀taper shank endmill with coarse teeth 粗齿锥柄立铣刀taper shank endmill with fine teeth 细齿锥柄立铣刀taper shank endmill with long edge 长刃锥柄立铣刀taper shank keyway milling cutter 锥柄键槽铣刀taper shank machine reamer 锥柄机用铰刀taper shank percussion drill 锥柄冲击钻taper shank reamer 锥柄铰刀taper shank right angle end mill 锥柄直角立铣刀taper shank slotting endmill 锥柄键槽铣刀taper shank three-edge hole-dilating drill 锥柄三刃扩孔钻taper shank twist drill set 套装锥柄麻花钻taper shank vertical milling cutter 锥柄立铣刀taper shank wedge 锥柄楔taper shank with threads for draw bar 拉杆螺纹锥柄taper sleeve 锥形套筒taper tap 锥形丝攻taper tester 锥度测量器taper thread ring 锥度螺纹环taper thread round die 锥螺纹圆板牙taper thread tap 锥螺纹丝锥taper trowel 锥形镘刀taper twist drill 锥柄麻花钻taper washer 锥形垫圈taper wheel 锥形砂轮taper wire-cut edm machine 锥度电火花线切割机床taper 小蜡烛taper-shank twist drill 锥柄麻花钻头tapered nut 锥形螺母tapered bearing 锥形轴承tapered bolt 锥形螺栓tapered bushing 锥形衬套tapered center-column rotameter 锥形芯柱式转子流量计tapered cylindrical optical fiber 锥形光纤tapered directional coupler 锥形定向耦合器tapered dress shirt 小腰身衬衫tapered file 锥形锉tapered graded index fiber 递变型渐变折射率光纤tapered increaser 锥形扩径器tapered lens 锥形透镜tapered pants 锥形裤tapered pin 锥形销tapered pipe 锥形管tapered piston 锥形活塞tapered potentiometer 递变电阻分压器tapered rod 锥形杆tapered roller bearing 圆锥滚柱轴承tapered screw plug 锥形螺塞tapered shaft 锥形轴tapered slacks 小裤脚裤tapered sleeve 锥形套筒tapered step-core bit 锥形塔式岩芯钻头tapered thickness gauge 锥形厚度规tapered thread 锥形螺纹tapered transformer 锥形交换器tapered tube and disc type flow meter 锥形管圆盘式浮子流量计tapered tube rotameter 锥形管柱式旋转流量计tapered tube 锥形管tapered-hole disk penetrometer 锥形孔盘式透度计tapered-plug connector 锥形插头连接器tapering drill 锥孔钻机tapering glass 圆锥形酒杯tapering machine 车锥度机床tapering spindle 锥形轴taperstraight shank drill 锥直柄麻花钻taperstraight shank end mill 锥直柄立铣刀taperstraight shank reamer 锥直柄铰刀tapestry brick 装饰面砖tapestry brussels 布鲁塞尔地毯tapestry carpet 印经绒圈地毯tapestry for household furniture 家具用绒绣品tapestry handbag 绒线绣花手提包tapestry loom 花毯织机tapestry quilts 织花床单布tapestry satin cushion cover 织锦靠垫tapestry satin round cushion cover 织锦圆靠垫tapestry satin square cushion cover 织锦方靠垫tapestry satin 织锦缎tapestry sofa set 绒绣沙发套tapestry velvet carpet 印经割绒地毯tapestry wool 刺绣毛纱tapestry yarn 花毯线tapestry 花毯taphole stopping machine 堵铁口机taping and reinforcing machine 胶带拼缝加固机taping machine 胶带拼缝机tapioca flour 木薯粉tapioca meal 木薯粗粉tapioca slice 木薯干片tapioca starch 木薯淀粉tapioca 木薯tapisserie de verdure 风景挂毯tapisserie 花毯tapped down generator 带抽头线圈振荡器tapped function potentiometer 抽头式函数电位计tapped transformer 抽头变压器tapped-coil oscillator 带抽头线圈的振荡器tapped-condenser oscillator 电容耦合三端振荡器tapper tap 螺母丝锥tapper 攻丝机tappet drum 凸轮鼓tappet guide pipe 挺杆导管tappet loom 踏盘织机tappet roller shaft 挺杆滚轮轴tappet roller 挺杆滚轮tappet spanner 阀挺杆扳手tappet switch 制动开关tappet 挺杆tapping drill 螺孔钻头tapping knife 割胶刀tapping machine 螺纹切削机床tapping screw 自攻螺丝tapsel 泰普席尔条子布tapti 泰普提布taquis 泰基平布tar brush 焦油刷tar catcher 焦油分离器tar condenser 焦油冷凝器tar extractor 焦油提取器tar felt 油毛毡tar mixer 柏油调合机tar paint 焦油涂料tar paper 焦油纸tar rope 油绳tar saturator 焦油浸制器tar separator 焦油分离器tar sprayer 沥青喷洒机tar spraying machine 沥青喷洒机tar spraying tank 沥青喷洒车tar stripper 焦油汽提器tar viscosimeter 焦油粘度计tar-dressing machine 柏油浇灌机tar-macadam batch mixer 焦油沥青碎石分批拌和机tar-macadam plant 焦油沥青碎石拌制机tar-saturated felt 油毛毡tara mandal 塔腊曼达耳丝花缎tarare gauze 塔拉尔纱罗tarare 麻帆布tarboosh 土耳其帽tardocillin 长效西林tare seed 稗子target data transmitter 目标数据发射机target flow transmitter 靶式流量变送器target meter 靶型流量计target tracking filter 目标跟踪滤光器target type flowmeter 靶式流量计tarivid tablet 泰利必妥片tarlatan 透明薄纱tarnish resistant flannel 防变色法兰绒tarnishproof board 防晦暗纸板tarnishproof paper 防晦暗纸taro curd 南乳taro meal 芋头粉taro 芋头tarpaulin canvas 柏油帆布tarpaulin paper 防潮纸tarpaulin 蓬布tarragon oil 菌陈蒿油tarragon vinegar 菌陈蒿醋tarragon 菌陈蒿tarred canvas 沥青帆布tarred felt 柏油毛毡tarred paper 沥青纸tarred sheathing paper 油毡纸tarred thread felt 加线柏油毡tarring machine 涂焦油机tart 果馅饼tartan checks 苏格兰格子呢tartan plaid jacket 格子花呢外短衣tartan plaid socks 格子短袜tartan plaids 格子呢tartan velvet 格子丝绒tartan 格子呢tartanella 混纺格子呢tartar sauce 调味酱tartar-emetic 吐酒石tartaric acid edible 食用酒石酸tartaric acid 酒石酸tartrate 酒石酸盐tartrazine 柠檬黄tarver cotton 塔凡尔棉tarzol 抗螨唑tas 塔斯锦缎tasar silk 柞蚕丝tasca 德士古牌照相机taseometer 应力计tash 塔什锦缎tashiari fibre 塔希亚里纤维tasmin 塔斯明牌汽车tassol 塔索尔牌手表tassor 塔沙纬向条纹薄呢tasteless preserved soybean 淡豆鼓tat chotee 黄麻布tat patti 粗袋布tat 粗袋布tat-c-lect 赛力散tata 塔塔牌手表tatanium 钛tatarian aster root 紫菀根tatarian aster 紫菀taterpex 氯苯胺灵tathion eye drop 谷胱甘肽眼药水tathion injection 注射用谷胱甘肽tatmo steel 塔特莫钼工具钢tatra 塔特拉牌汽车tattersall 塔特萨尔花格呢tatting lace tablecloth 梭子花边台布taunus 陶努斯牌汽车taurine 氨基乙磺酸taurino 陶利诺羊毛牛毛混纺呢taurolin 滔罗林tavex 塔韦克斯牌手表taximeter 出租汽车里程计taxus 紫杉tayentex fibre 泰廷特克斯纤维tayiba cotton 太巴棉tayssato 甲氧乙氯汞tc fancy suiting 涤棉花呢tea ash 茶灰tea bag infusion paper 茶叶袋浸泡纸tea bag paper 茶叶袋纸tea bag 袋泡茶tea ball 滤茶球tea brick 茶砖tea bust 细茶tea canister 茶叶罐tea cozy 茶壶套tea cropper 茶叶收获机tea cup with underglazed carp design 釉下鲤鱼茶杯tea cup 茶杯tea drier 焙茶机tea dust 茶末tea firing machine 焙茶机tea fork 茶叉tea green cloth 茶绿色布tea heating machine 烤茶机tea in bulk 散茶tea in round box 圆筒茶tea in square box 方筒茶tea kettle with fixed handle 固定把茶壶tea kettle with grip handle 手把茶壶tea kettle with round bottom 圆底茶壶tea kettle 平底茶壶tea mug with cover 龙云盖杯tea napkin 茶布tea natural antioxidant 茶叶天然抗氧化剂tea oil 茶油tea packaging machine 茶叶包装机tea packing machine 茶叶包装机tea plant pruning machine 茶树剪修机tea plate 茶盘tea plucker 采茶机tea plucking machine 采茶机tea pocket forming and filling machine 茶叶制袋包装机tea pot with grip handle 手把茶壶tea pot 茶壶tea processing machine 制茶机tea rose colour cloth 茶玫瑰色布tea saucer 茶碟tea scented chicken 茶香鸡tea seed cake 茶籽饼tea seed 油茶籽tea set 茶具tea sifting and grading machine 茶叶筛分机tea sorting machine 茶叶分选机tea spoon 茶匙tea stalk 茶梗tea stem 茶梗tea strainer 茶滤器tea table 茶几tea towel 茶巾tea urn 茶缸tea utensils 茶具tea 茶叶tea-box board 茶箱板tea-caddy 茶叶筒tea-cola 茶可乐tea-coloured crystal 茶晶tea-cup cushion 茶杯垫tea-dust glaze 茶叶末釉tea-flake glaze 茶叶末釉tea-leaf picker 采茶机tea-leaf rolling machine 茶叶压实机tea-leaf steaming machine 茶叶蒸制机tea-leaf withering machine 茶叶干燥机tea-picking machine 采茶机tea-processing equipment 茶叶加工设备tea-tray 茶盘teagle 卷扬机teak fancy plywood 柚木装饰板teak wood 柚木teal 水鸭teamstar 郊游队之星牌旅游车tear-gas weapon 催泪武器tear-off calendar 撕页日历tearing tester 纸张撕裂测定仪teaseed oil 茶油teasel nut 起绒草果teasel raising machine 刺果起绒机teaser 起绒机teaxa 梯高牌手表tebela 特贝拉牌手表teca 特卡醋酯短纤维technetium 锝technetium-99m albumin macroaggregated m 锝大颗粒白蛋白technetium-99m bleomylcin m 锝-博莱霉素technetium-99m calcium gluconate m 锝葡萄糖酸钙technetium-99m dmsa m 锝二巯基琥珀酸technetium-99m dtpa m 锝二乙三胺五醋酸technetium-99m pyrophosphate m 锝-焦磷酸盐technetium-99m sodium pertechnetate 高m锝酸钠technetium-99m sufur colloid 硫化m锝胶体technetium-99m tetracycline m 锝-四环素technical ceramics 技术陶瓷technical gelatine 工业明胶technical glass 技术玻璃technical sodium citrate 工业柠檬酸钠technical yarn 工业用纱线technique and equipment for latex gloves 乳胶手套生产技术及设备technique and equipment of on-machine cooling in sinteringmachine 烧结机上冷却的工艺和设备technique for gypsous hollow strip panel production 石膏空心条板生产技术technique treating morbid sterility of dairy cattle with laser needle 激光针治疗乳牛疾病性不孕症技术technology and equipment for insulation gloves 绝缘手套技术设备technology and equipment for paint production 油漆生产技术设备technology and equipment for the production of formic acid 甲酸生产技术及设备technology and equipment of making aluminium strip coil 铝带卷生产技术与设备technology and equipment of manufacturing aluminium water heater solar energy 铝制太阳能热水器制造技术与设备technology and equipment of powder for match point 火柴头药粉生产技术及设备technology and production line of deep freezer 冷藏柜生产技术及设备technology and production line of making copper wire rod 铜盘条生产技术与生产线technology and related equipment for the production of quick themoelectric junction 快速热电偶生产制造技术、关键设备technology and related equipment of the production of single-phase electricity meter 单相电度表制造技术和关键设备technology for brightening polyacrylonitrile fibre 腈纶增白技术technology for brightening polyester fibre 涤纶增白技术technology for making main and hair spring of various materials and specifications 各种材料及规格的发条、游丝加工technology for producing icecream with soybean 用大豆生产冰淇淋技术technology for producing {jilin} simulated meat serial products 吉林素肉系列产品生产技术technology for production of myocardium display agent 心肌显像剂生产技术technology for recovering and extracting the lead alloy for storage battery 蓄电池铅合金回收精炼技术technology for the concrete durability and steel anticorrosion 混凝土耐久性及钢筋防蚀技术究technology for the manufacture of fragrant metal piece 香币制造技术technology of brewing low alcoholic drink 制低度酒技术technology of building mini-hydro power station and its autodevice 小型水电站成套技术及自动化装置technology of double film packing materials 双膜包装材料生产技术technology of immediate bloking of water leakage by direct grouting and equipment 直接灌浆快速堵漏技术和设备technology of investing shell mold by electrophoresis 电泳复合精铸制壳工艺technology of making clayware handwork 砂器工艺品的烧制技术technology of manufacturing 4mm universal automatic spring coiling machine 四毫米自动卷簧机制造技术technology of manufacturing anion generator 负离子发生器制造技术technology of manufacturing bending tool for thin-walled tube 薄壁管弯管工具生产技术technology of manufacturing corrugation forming machine波纹成型机制造技术technology of manufacturing linear motor type puller 直线电动机式牵引机制造技术technology of manufacturing man-power collecting harvester 人力收割机制造技术technology of manufacturing solar energy quartz clock 太阳能石英钟制造技术technology of natural lac dye for foods 天然食用紫胶染色素生产技术technology of nitrogen generator 氮气发生器技术technology of producing cabin pressure regulator with corrector for working order 纠误位座舱压力调节器生产技术technology of producing strengthened fracture-set plate 增强接骨板生产技术technology of recovering gold from gold-bearing sulphate calcine 含金硫酸烧渣提金工艺technology of roller coating for leather surface 辊印涂饰皮革表面技术technology of spraying fragnance or colour 喷色喷香技术technology of superplastically forming metallic die 金属模具的超塑成型技术technology of using laser in the heat-treatment of block gauge 块规激光热处理技术technology of using laser in the heat-treatment of ingot red 锭杆激光热处理技术technology tester 工艺试验机technometer x射线照射量计technos 天克诺牌手表teclothiazide 四氯噻嗪teclozan 替克洛生tecnazene 四氯硝基苯tecto 涕必灵tectoquinone 甲基蒽醌tedder 干草摊晒机tedding machine 摊晒机teddy bear cloth 长绒毛织物tedion v-18 三氯杀螨砜tedion 三氯杀螨砜tee pipe 三通管tee shirt 圆领短袖汗衫teeter ladder 云梯teeter-totter 跷跷板teeth forming machine for band sawblade 锯条开齿机teeth instrument set 拔牙器械包teeth-adjustable reducer 活齿减速机teeth-roller cracker 齿辊破碎机teething weave 经条灯芯绒tefazoline 替法唑林teflon asbestos 聚四氟乙烯石棉teflon cable 聚四氟乙烯绝缘电缆teflon capacitor 聚四氟乙烯电容器teflon clad fiber 聚四氟乙烯包层光纤teflon coaxial cable 聚四氟乙烯同轴电缆teflon filter 聚四氟乙烯滤光器teflon hose 聚四氟乙烯塑料软管teflon insulated wire 聚四氟乙烯绝缘电线teflon resin 聚四氟乙烯树脂teflon seal tape 聚四氟乙烯密封带teflon 特氟隆teflurane 替氟烷tefnon 天龙牌摄影器材tegafur 喃氟啶tego 蒂戈铅基轴承合金tegretol tablet 痛可灵片teheran carpet 德黑兰地毯tehlila 特丽拉红色粗呢teijin acetate filament 帝人醋酯长丝teijin-tetoron 帝特龙聚酯纤维teiwalon 帝和纶聚酰胺变形丝tekke bakhara 特卡·布哈拉地毯tekko 德科油地毡teklan 蒂克纶变性聚丙烯腈系纤维tektamer 休菌清tekwaisa 甲基一六0五telconstantan 特尔康铜电热合金telcuman 特尔卡曼铜锰镍合金telda 特尔达牌手表teleammeter 遥测电流表teleautograph 传真电报机telebrineller 携带式布氏硬度测定仪telebrix solution 显影葡胺纳液telecamera 电视摄像机telecar 收发报汽车telecaster 电视广播机teleceptor 距离感受器telecine camera 电视电影摄像机telecine machine 电视电影机telecine projector 电视电影放映机teleclinometer 遥测井斜仪telecommunication cable 电信电缆telecommunication equipment 电信设备telecommunication laser 电信激光器telecommunication optical fiber 电信光纤telecommunication satellite with directional antenna 具有定向天线的通信卫星telecompass 遥控罗盘teleconst 特尔康铜电热合金telecopier 电传复写机telecoseal 特尔柯西尔低膨胀合金telecoupler 共用天线耦合器telectal alloy 特勒克塔尔铝硅合金telectrograph 传真电报机telectroscope 电传照相机teledepth 气压测深仪teledium 特雷迪姆铅碲合金telefax machine 用户传真机telefork 叉式起重拖车telegauge 遥测仪telegon 无接点交流自整角机telegoniometer 无线电测向仪telegram cable 电报电缆telegram converting transmitter 电报转发器telegram exchange 电报交换机telegram paper 电报纸telegram slip 电报纸条telegraph analyzer 电报分析仪telegraph cable 电报电缆telegraph code inverter 电报电码变换器telegraph demodulator 电报解调器telegraph distortion analyzer 电报信号失真分析器。
chapter 9 packingand marking
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Language Points
Packing specification 包装规格(要求) Packing instruction 包装须知 Packing list 包装单;装箱单 Customary packing 习惯包装 Commercial packing 商业包装 Improper(poor, )packing 有缺陷的包装 Particular packing 特定包装 Neutral packing 中性包装 Seaworthy packing 适合海洋运输包装 Waterproof packing 防水包装
Chapter 9
Packing and Marking
Introduction:
Packing protects products and adds value to them.
1.Outer Packing 外包装,大包装 Transport packing/Packing for shipment 运输包装; Large packing 大包装 Export packing 出口包装
double walled or triple walled两层的或三层的 corrugated: 有瓦楞的,用瓦楞材料制造的
Wooden Case木箱 The wooden case is strong. It is used for small, heavy items. stack:堆,垛 steel wire: 钢丝 flat steel strap: 扁钢条
Stipulations concerning packing expenses in the sales contract: Including export packing / Packing included 包装费在内(在报价中) Export packing is for buyer’s account. (Packing extra) 包装费由买方负担 (包装费另计)
板材吸塑英语说 -回复
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板材吸塑英语说-回复the process of vacuum forming plastic sheet material. Vacuum forming is a manufacturing process used to shape plastic sheets into various products or components. It is widely used in industries such as automotive, packaging, and signage. In this article, we will explore the step-by-step process of vacuum forming plastic sheets.1. Design and Prototyping:The first step in the vacuum forming process is to design and prototype the desired product or component. This involves creating a 3D model using computer-aided design (CAD) software. Once the design is finalized, a prototype is created using either 3D printing or traditional manufacturing methods.2. Mold Preparation:After the design and prototyping stage, a mold needs to be prepared. The mold, also known as the tool or form, is typically made from wood, aluminum, or composite materials. The mold is then machined or formed to match the desired shape of the final product.3. Plastic Sheet Selection:Choosing the right plastic sheet material is crucial in the vacuum forming process. The selection depends on factors such as the desired product's requirements, such as strength, flexibility, and transparency. Common plastic sheets used in vacuum forming include ABS (Acrylonitrile Butadiene Styrene), PVC (Polyvinyl Chloride), and PETG (Polyethylene Terephthalate Glycol).4. Heating:Before the actual vacuum forming process, the selected plastic sheet needs to be heated until it reaches a pliable state. This can be done using different methods such as infrared heaters or convection ovens. The heating temperature and time depend on the type and thickness of the plastic sheet.5. Vacuum Forming:Once the plastic sheet is heated and pliable, it is then placed over the mold on the vacuum forming machine. The machine typically consists of a heated plate, a vacuum chamber or box, and a vacuum pump. The heated plate helps maintain the plastic sheet's temperature and evenly distribute the heat during the forming process.When the plastic sheet is in position, the vacuum pump is activated, creating a vacuum inside the chamber or box. The atmospheric pressure pushes the pliable plastic sheet against the mold's surface, forming the desired shape. The vacuum is maintained until the plastic sheet cools down and solidifies in the mold's shape.6. Trimming and Finishing:Once the vacuum forming process is completed, the formed plastic sheet is removed from the mold. The excess plastic, known as flash or excess material, is trimmed off using various cutting tools or CNC routers. This step ensures that the final product has clean edges and the desired dimensions.Further finishing processes like sanding, smoothing, or painting can be carried out to enhance the appearance and functionality of the formed plastic product. These additional steps vary depending on the specific requirements of the product and its intended use.7. Quality Control and Packaging:After the trimming and finishing process, the formed plastic products undergo rigorous quality control checks to ensure they meet the specified standards and requirements. This includeschecking for any defects, dimensional accuracy, and physical properties.Once the products have passed the quality control tests, they are packaged appropriately for transportation and distribution. Proper packaging ensures the products are protected from damage during handling and transportation.In conclusion, vacuum forming is a versatile manufacturing process used to shape plastic sheets into products or components. By following the step-by-step process outlined above, manufacturers can produce high-quality plastic products with consistent shape and dimensions.。
外贸流程常用短语之包装术语
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Packing 包装 1. packaging 包装⽅法 2. blister packing 起泡包装 3. neutral packing 中性包装 4. skin packing 吸塑包装 5. hanging packing 挂式包装 6. catch sb‘s eye 引某⼈注⽬ 7. mark 唛头 8. unlabelled packing ⽆牌的包装 9. in bulk 散装 10. in loose packing 散装 11 nude packing *装 12. bulk pack 整批包装 13. consumer pack 零售包装 14. large packing ⼤包装 15. inner packing, external packing, end packing ⼩包装 16. shrunk packaging,压缩包装 17. foam-spary packaging 喷泡沫包装 18. gift-wrap 礼品包装 19. bag, sack 袋 20. jute bag ⿇袋 21. polythelene bag, plastic bag 塑料袋 22. polythelene net 尼龙绳袋 23. zippered bag 拉链袋 24. case, chest 箱 25. box 盒 26. wooden case ⽊箱 27. carton 纸箱 28. container 集装箱 29. rate 板条箱 30. fibre board case 纤维板箱 Packing(⼆)包装 1. packet ⼩包 2. bale 包 3. bundle 捆 4. tin , can 罐头 5. basket 篮,篓,筐 6. bamboo basket ⽵篓 7. bottle 瓶 8. wooden keg ⼩⽊桶 9. hogshead ⼤桶 10. iron drum 铁桶 11 cylinder 铁桶 12. barrel 琵琶桶 13. drum 圆桶 14. waterproof paper 防⽔纸 15. cellophone 玻璃纸 16. kraftpaper ⽜⽪纸 17. canvas 帆布 18. fibreboard 纤维板 19. nylon strap 尼龙腰⼦ 20. plastic strap 塑料腰⼦ 21. adhesive tape 胶带 22. stuffing material 填料 23. nylon plastic 尼龙丝 24. fermented plastic 泡沫塑料 25. paper scrap 纸屑 26. saw dust ⽊屑 27. tar paper 沥青纸 28. wax paper 蜡纸 29. slushing compound 润滑油 30. tarpaulin 油布、防⽔帆布。
外贸英语之包装 packing
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外贸英语之包装packing一)The next thing I'd like to bring up for discussion is packing.下面我想提出包装问题讨论一下。
We'd like to hear what you say concerning the matter of packing.我很想听听你们就包装问题发表意见。
You'd like to know something about the packing of the drugs. is that right?您想了解药品的包装情况,对吗?Please make an offer indicating the packing.请报价并说明包装情况。
Your opinions on packing will be passed on to our manufacturers.你们对包装的意见将转达给厂商。
It is necessary to improve the packaging.改进包装方法十分必要。
We've informed the manufacturer to have them packed as per your instruction. 我们已经通知厂商按你们的要求包装。
Packing has a close bearing on sales.包装直接关系到产品的销售。
Packing also effects the reputation of our products.包装也影响产品的声誉。
A packing that catches the eye will help us push the sales.醒目的包装有助于我们推销产品。
Buyers always pay great attention to packing.买方很注意包装的情况。
I'm sure the new packing will give your clients satisfaction.我相信新包装定会使您的客户满意。
包装印刷常用名词英语
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包装量 Packing Unit箱Case纸箱Carton瓦椤纸箱 Corrugated Carton旧瓦椤纸箱 Old Corrugated Carton (O.C.C.) 木箱 Wooden Case板条箱 Crate木条箱 Wooden Crate竹条箱 Bamboo Crate胶合板箱 Plywood Case三层夹板箱 3--Ply Plywood Case镀锡铁皮胎木箱Tin Lined Wooden Case盒Box木盒Wooden Box铁盒Iron Box塑料透明盒 Plastic Transparency Box苯乙烯盒 Styrol Box袋Bag(Sack)布袋 Cloth Bag草袋 Straw Bag麻袋 Gunny Bag/Jute Bag旧麻袋 Used Gunny Bag/Old Gunny Bag新麻袋 New Gunny Bag尼龙袋 Nylon Bag聚丙烯袋 Polypropylene Bag聚乙烯袋 Polythene Bag塑料袋 Poly Bag塑料编织袋 Polywoven Bag纤维袋 Fibre Bag玻璃纤维袋 Glass Fibre Bag玻璃纸袋 Callophane Bag防潮纸袋 Moisture Proof Pager Bag乳胶袋子Emulsion Bag三层牛皮纸袋 3?ply Kraft Paper Bag锡箔袋 Fresco Bag特大袋 Jumbo Bag单层完整袋子Single Sound Bag桶 Drum木桶 Wooden Cask大木桶 Hogshead小木桶 Keg粗腰桶(琵琶桶) Barrel胶木桶 Bakelite Drum塑料桶 Plastic Drum铁桶 Iron Drum镀锌铁桶 Galvanized Iron Drum镀锌闭口钢桶 Galvanized Mouth Closed Steel Drum 镀锌开口钢桶 Galvanized Mouth Opened Steel Drum 铝桶 Aluminum Drum麻布包 Gunny Bale (Hessian Cloth Bag)蒲包 Mat Bale草包 Straw Bale紧压包 Press Packed Bale铝箔包 Aluminium Foil Package铁机包 Hard-pressed Bale木机包Half-pressed Bale覃(缸)Jar陶缸 Earthen Jar瓷缸 Porcelain Jar壶 Pot铅壶 Lead Pot铜壶Copper Pot施 Bottle铝瓶 Aluminum Bottle陶瓶 Earthen Bottle瓷瓶 Porcelain bottle罐 Can听 Tin绕线筒 Bobbin笼(篓、篮、筐)Basket竹笼(篓、篮、筐)Bamboo Basket柳条筐(笼、篮、筐)Wicker Basket集装箱 Container集装包/集装袋 Flexible Container托盘 Pallet件(支、把、个)Piece架(台、套)Set(Kit)安瓿 Amp(o)ule(药针支)双 Pair打 Dozen令 Ream匹 Bolt(Piece)码Yard卷(Roll(reel)块Block捆 Bundle瓣 Braid度 Degree辆 Unit(Cart)套(罩) Casing包装形状 Shapes of Packing圆形 Round方形Square三角形 Triangular(Delta Type)长方形(矩形) Rectangular菱形(斜方形) Rhombus(Diamond)椭圆形 Oval圆锥形 Conical圆柱形 Cylindrical蛋形 Egg-Shaped葫芦形 Pear-Shaped五边形 Pentagon六边形 Hexagon七边形 Heptagon八边形 Octagon长 Long宽 Wide高 High深 Deep厚 Thick长度 Length宽度 Width高度 Height深度 Depth厚度 Thickness 包装外表标志 Marks On Packing下端,底部 Bottom 顶部(上部) Top(Upper)小心 Care 勿掷Don’t Cast易碎 Fragile 小心轻放,小心装运 Handle With Care起吊点(此处起吊) Heave Here 易燃物,避火 Inflammable保持干燥,防泾 Keep Dry 防潮 keep Away from Moisture储存阴冷处 Keep in a Cool Place 储存干燥处 Keep in a Dry Place 请勿倒置 Keep Upright 请勿倾倒 Not to Be Tipped避冷 To be Protected from Cold 避热 To be Protected from Heat 在滚子上移动 Use Rollers 此方向上 This Side Up由此开启 Open from This Side 爆炸品Explosive易燃品 Inflammable 遇水燃烧品 Dangerous When Wet有毒品 Poison 无毒品 No Poison不可触摩 Hand off 适合海运包装 Seaworthy Packing毛重 Gross Weight (Gr.Wt.) 净重 Net Weight (Nt.Wt)皮重 Tare Weight 包装唛头 Packing Mark包装容积 Packing Capacity 包袋件数 Packing Number小心玻璃 Glass 易碎物品 Fragile易腐货物 Perishable 液体货物 Liquid切勿受潮 Keep Dry/Caution Against Wet 怕冷 To Be Protected from Cold 怕热 To Be Protected from Heat 怕火 Inflammable上部,向上 Top 此端向上 This Side Up勿用手钩 Use No Hooks 切勿投掷 No Dumping切勿倒置 Keep Upright 切勿倾倒 No Turning Over切勿坠落Do Not Drop/No Dropping 切勿平放 Not to Be Laid Flat切勿压挤 Do Not Crush 勿放顶上 Do Not Stake on Top放于凉处Keep Cool/Stow Cool 干处保管Keep in Dry Place勿放湿处 Do Not Stow in Damp Place 甲板装运 Keep on Deck装于舱内 Keep in Hold 勿近锅炉 Stow Away from Boiler必须平放 Keep Flat/Stow Level 怕光 Keep in Dark Place怕压 Not to Be Stow Below Other Cargo 由此吊起 Lift Here挂绳位置 Sling Here 重心 Centre of Balance着力点Point of Strength 用滚子搬运 Use Rollers此处打开 Opon Here 暗室开启 Open in Dark Room先开顶部 Romove Top First 怕火,易燃物 Inflammable氧化物 Oxidizing Material 腐蚀品 Corrosive压缩气体Compressed Gas 易燃压缩气体Inflammable Compressed Gas毒品 Poison 爆炸物 Explosive危险品 Hazardous Article 放射性物质Material Radioactive立菱形 Upright Diamond 菱形 Diamond Phombus双菱形 Double Diamond 内十字菱形 Gross in Diamond四等分菱形 Divided Diamond 突角菱形Diamond with Projecting Ends斜井形 Projecting Diamond 内直线菱形 Line in Diamond内三线突角菱形 Three Line in Projecting Diamond 三菱形 Three Diamond 附耳菱形 Diamond with Looped Ends 正方形 Square Box长方形 Rectangle 梯形 Echelon Formation平行四边形 Parallelogram 井筒形 Intersecting Parallels五边形 Pentagon 六边形 Hexagon长六边形 Long Hexagon 圆形 Circle/Round二等分圆 Bisected Circle 双环形 Crossed Circle双圆形 Double Circle 双带圆形 Zoned Circle长圆形 Long Circle 椭圆形 Oval双缺圆形 Double Indented Circle 圆内三角形 Triangle in Circle三角形 Triangle 六角星形 Hexangular Star二重三角形 Double Triangle 对顶三角形 Hourgrass Touching Triangle内外三角形 Three Triangle 十字形 Cross圆内十字形 Cross in Circle 山角形 Angle义架形 Crotch 直线 Line月牙形 Crescent 心形 Heart星形 Star 包装情况 Packing Condition散装 In Bulk 块装 In Block条装 In Spear 片装 In Slice捆(扎)装 In Bundle 裸装 In Nude裸散装 Bare in Loose 木托架立装 Straightly Stand on Wooden Shelf 传统包装 Traditional Packing 中性包装 Neutral Packing水密Water Tight 气密 Air Tight不透水包 Water Proof Packing 不透气包 Air Proof Packing薄膜 Film Membrane 透明纸 Transparent Paper牛皮纸 Kraft Paper 地沥青牛皮纸Bituminous Kraft Paper腊纸 Waxpaper 厚板纸 Cardboard Paper蒲、苇 Bulrush mat 防水纸 Water Proof Paper保丽龙(泡沫塑料)Poly Foam(SnowBox) 竹条Bamboo Batten竹篾 Bamboo Skin 狭木条Batten铜丝 Brass Wire 铁丝 Iron Wire铁条 Iron Rod 扣箍 Buckle外捆麻绳Bound with Rope Externally外裹蒲包,加捆铁皮Bale?matted Iron-band-strapped Outside块装外加塑料袋Block Covered with Poly Bag每件外套一塑料袋 Each Piece Wrapped in a Poly Bag机器榨包不带包皮Press Packed Bale without Wrapper机器榨包以铁皮捆扎 Press Packed in Iron Hooped Bale用牢固的纸箱装运 Packed in Strong Carton适合于长途海洋运输 Suitable for Long Distance Ocean Transportation 适合出口海运包装 Packed in Seaworthy Carton for Export全幅卷筒 Full with Rolled on Tube每卷用素包聚乙烯袋装 Each Roll in Plain Poly Bag混色混码 With Assorted Colours Sizes每隔--码烫有边印With Selvedge Stamped Internally at Every--Yards 用…隔开 Portioned with纸屑 Paper Scrap纸条 Paper Slip纸带 Paper Tape纸层 Paper Wool泡沫塑料 Foamed Plastics泡沫橡胶Foamed Rubber帆布袋内充水 Canvas Bag Filled with Water包内衬薄纸 Lined with Thin Paper内衬锡箔袋 Lined with Frescobag内置充气氧塑料袋 Inner Poly Bag Filled with Oxygen内衬牛皮纸 Lined with Kraft Paper内衬防潮纸、牛皮纸 Lined with Moist Proof Paper &Kraft Paper铝箔包装 In Aluminium Foil Packing木箱内衬铝箔纸Lined with Aluminium Foil in the Wooden Case双层布袋外层上浆 Double Cloth Bag with Outer Bag Starched外置木箱 Covered with Wooded Case外绕铁皮 Bound with Iron Bands Externally胶木盖Bakelite Cover外绕铁丝二道 Bound with Two Bands 0f Metal Wires Outside标签上标有:Labels Were Marked with纸箱上标有Cartons Were Marked with包装合格 Proper Packing包装完整 Packing Intact包装完好 Packing Sound正规出口包装 Regular Packing for Export表面状况良好 Apparently in Good Order& Condition包装不妥 Improper Packing包装不固 Insufficiently Packed包装不良 Negligent Packing包装残旧玷污 Packing Stained &Old箱遭水渍 Cartons Wet &Stained外包装受水湿 With Outer Packing Wet包装形状改变 Shape of Packing Distorted散包 Bales Off铁皮失落 Iron Straps Off钉上 Nailed on尺寸不符 Off Size袋子撕破 Bags Torn箱板破 Case Plank Broken简述瓦楞纸板楞型(Flute types)及其相关参数轉自:DoPack和大家聊一聊瓦楞纸板的楞型吧!虽然这是一老生常谈的话题,但不知道到底有多少人能真正透彻的理解并应用于实践中。
ISPM15 Update木质包装要求

China
March 1, 2004
January 1, 2006
Columbia
June 3, 2004
September 15, 2005 Columbia 1/4/05 communication to WTO announced revised implementation of ISPM 15 to September 15, 2005.
Argentina
IPPC ISPM 15 Implementation? Enforcement?
June 1, 2005 June 1, 2005
Current Requirements for Wood Packaging
Official announcement of intentions to WTO were made on 4/27/05, stating "All wood packaging and/or support material and dunnage entering or in transit through Argentina must be treated and certified by means of the corresponding mark in accordance with ISPM 15.
Costa Rica
January 1, 2005
September 16, 2005 Costa Rica has notified the WTO of their intent to implement and enforce ISPM 15 regulations for wood packaging, setting 2005 dates for implementation and enforcement n/a Official notification from WTO on April 15, 2005 regarding the country's adoption and implementation of ISPM 15 for internal technical procedures and use of mark by facilities approved to produce wood packaging within the country. No apparent implementation of ISPM 15 for imported wood packaging at this time.
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VPR: A New Packing, Placement and Routing Tool forFPGA Research1Vaughn Betz and Jonathan RoseDepartment of Electrical and Computer Engineering, University of Toronto Toronto, ON, Canada M5S 3G4 {vaughn, jayar}@AbstractWe describe the capabilities of and algorithms used in a new FPGA CAD tool, Versatile Place and Route (VPR). In terms of minimizing routing area, VPR outper-forms all published FPGA place and route tools to which we can compare.Although the algorithms used are based on previously known approaches, wepresent several enhancements that improve run-time and quality. We present place-ment and routing results on a new set of large circuits to allow future benchmarkcomparisons of FPGA place and route tools on circuit sizes more typical of today’sindustrial designs.VPR is capable of targeting a broad range of FPGA architectures, and the source code is publicly available. It and the associated netlist translation / clustering toolVPACK have already been used in a number of research projects worldwide, andshould be useful in many areas of FPGA architecture research.1 IntroductionIn FPGA research, one must typically evaluate the utility of new architectural fea-tures experimentally. That is, benchmark circuits are technology mapped, placed and routed onto the FPGA architectures of interest, and measures of the architecture’s quality, such as speed or area, can then readily be extracted. Accordingly, there is con-siderable need forflexible CAD tools that can target a wide variety of FPGA architec-tures efficiently, and hence allow fair comparisons of the architectures.This paper describes the Versatile Place and Route (VPR) tool, which has been designed to be flexible enough to allow comparison of many different FPGA architec-tures. VPR can perform placement and either global routing or combined global and detailed routing. It is publicly available from /~jayar/soft-ware.html.In order to make meaningful FPGA architecture comparisons, it is essential that the CAD tools used to map circuits into each architecture are of high quality. The routing phase of VPR outperforms all previously published FPGA routers for which standard benchmarks results are available, and that the combination of VPR’s placer and router outperforms all published combinations of FPGA placement and routing tools.2 The organization of this paper is as follows. In Section 2 we describe some of the features of VPR and the range of FPGA architectures with which it may be used. In Sections 3 and 4 we describe the placement and routing algorithms. In Section 5, we compare the number of tracks required by VPR to successfully route circuits with that required by other published tools. In Section 6 we conclude and outline some future 1.This work was supported by a Walter C. Sumner Memorial Foundation Scholarship, anNSERC 1967 Scholarship, and the Information Technology Centre of Ontario.2.Again, for those tools which have standard benchmark results to which we can compare.enhancements which will be made to VPR.2 Overview of VPRFigure 1 outlines the VPR CAD flow. The inputs to VPR consist of a technology-mapped netlist and a text file describing the FPGA architecture. VPR can place the circuit, or a pre-existing placement can be read in. VPR can then perform either a glo-bal route or a combined global/detailed route of the placement. VPR’s output consists of the placement and routing, as well as statistics useful in assessing the utility of an FPGA architecture, such as routed wirelength, track count, and maximum net length.Some of the architectural parameters that can be specified in the architecture description file are:•the number of logic block inputs and outputs,•the side(s) of the logic block from which each input and output is accessible,•the logical equivalence between various input and output pins (e.g. all LUT inputs are functionally equivalent),•the number of I/O pads that fit into one row or one column of the FPGA, and •the dimensions of the logic block array (e.g. 23 x 30 logic blocks).In addition, if global routing is to be performed, one can also specify:•the relative widths of horizontal and vertical channels, and•the relative widths of the channels in different regions of the FPGA.Finally, if combined global and detailed routing is to be performed, one also specifies:•the switch block [1] architecture (i.e. how the routing tracks are interconnected),•the number of tracks to which each logic block input pin connects (F c [1]),•the F c value for logic block outputs, and•the F c value for I/O pads.The current architecture description format does not allow segments that span more than one logic block to be included in the routing architecture, but we are presently adding this feature. Adding new routing architecture features to VPR is relatively easy, since VPR uses the architecture description to create a routing resource graph. Every routing track and every pin in the architecture becomes a node in this graph, and the graph edges represent the allowable connections. The router, graphics visualiza-Fig. 1. CAD flow.tion and statistics computing routines all work only with this routing resource graph,so adding new routing architecture features only involves changing the subroutines that build this graph.Although VPR was initially developed for island-style FPGAs [2, 3], it can also be used with row-based FPGAs [4]. VPR is not currently capable of targeting hierarchi-cal FPGAs [5], although adding an appropriate placement cost function and the required routing resource graph building routines would allow it to target them.Finally, VPR’s built-in graphics allow interactive visualization of the placement,the final routing, the available routing resources and the possible ways of interconnect-ing the routing resources.2.1 The VPACK Logic Block Packer / Netlist TranslatorVPACK reads in a blif format netlist of a circuit that has been technology-mapped to LUTs and flip-flops, packs the LUTs and flip flops into the desired FPGA logic block, and outputs a netlist in VPR’s netlist format. VPACK can target a logic block consisting of one LUT and one FF, as shown in Figure 2, as this is a common FPGA logic element. VPACK is also capable of targeting logic blocks that contain several LUTs and several flip flops, with or without shared LUT inputs [6]. These “cluster-based” logic blocks are similar to those employed in recent FPGAs by Altera, Xilinx and Lucent Technologies.3 Placement AlgorithmVPR uses the simulated annealing algorithm [7] for placement. We have experi-mented with several different cost functions, and found that what we call a linear con-gestion cost function provides the best results in a reasonable computation time [8].The functional form of this cost function iswhere the summation is over all the nets in the circuit. For each net, bb x and bb y denote the horizontal and vertical spans of its bounding box, respectively. The q(n)factor compensates for the fact that the bounding box wire length model underesti-mates the wiring necessary to connect nets with more than three terminals, as sug-gested in [10]. Its value depends on the number of terminals of net n; q is 1 for nets with 3 or fewer terminals, and slowly increases to 2.79 for nets with 50 terminals.C av,x (n) and C av,y (n) are the average channel capacities (in tracks) in the x and y direc-tions, respectively, over the bounding box of net n.This cost function penalizes placements which require more routing in areas of the FPGA that have narrower channels. All the results in this paper, however, are obtained with FPGAs in which all channels have the same capacity. In this case C av is a con-InputsOutFig. 2.Basic FPGA logic block.Cost q n ()bb x n ()C av ,x n ()--------------------bb y n ()C av ,y n ()--------------------+n 1=N nets∑=stant and the linear congestion cost function reduces to a bounding box cost function.A good annealing schedule is essential to obtain high-quality solutions in a reason-able computation time with simulated annealing. We have developed a new annealing schedule which leads to very high-quality placements, and in which the annealing parameters automatically adjust to different cost functions and circuit sizes. We com-pute the initial temperature in a manner similar to [11]. Let N blocks be the total num-ber of logic blocks plus the number of I/O pads in a circuit. We first create a random placement of the circuit. Next we perform N blocks moves (pairwise swaps) of logic blocks or I/O pads, and compute the standard deviation of the cost of these N blocks dif-ferent configurations. The initial temperature is set to 20 times this standard deviation,ensuring that initially virtually any move is accepted at the start of the anneal.As in [12], the default number of moves evaluated at each temperature is . This default number can be overridden on the command line,however, to allow different CPU time / placement quality tradeoffs. Reducing the number of moves per temperature by a factor of 10, for example, speeds up placement by a factor of 10 and reduces final placement quality by only about 10%.When the temperature is so high that almost any move is accepted, we are essen-tially moving randomly from one placement to another and little improvement in cost is obtained. Conversely, if very few moves are being accepted (due to the temperature being low and the current placement being of fairly high quality), there is also little improvement in cost. With this motivation in mind, we propose a new temperature update schedule which increases the amount of time spent at temperatures where a sig-nificant fraction of, but not all, moves are being accepted. A new temperature is com-puted as T new =α T old , where the value of α depends on the fraction of attempted moves that were accepted (R accept ) at T old , as shown in Table 1.Finally, it was shown in [12, 13] that it is desirable to keep R accept near 0.44 for as long as possible. We accomplish this by using the value of R accept to control a range limiter -- only interchanges of blocks that are less than or equal to D limit units apart in the x and y directions are attempted. A small value of D limit increases R accept by ensuring that only blocks which are close together are considered for swapping. These “local swaps” tend to result in relatively small changes in the placement cost, increas-ing their likelihood of acceptance. Initially, D limit is set to the entire chip. Whenever the temperature is reduced, the value of D limit is updated according to , and then clamped to the range 1≤ D limit ≤10N blocks ()1.33⋅D limit newD limit old10.44–R accept old+()⋅=maximum FPGA dimension. This results in D limit being the size of the entire chip for the first part of the anneal, shrinking gradually during the middle stages of the anneal, and being 1 for the low-temperature part of the anneal.Finally, the anneal is terminated when T < 0.005 * Cost / N nets. The movement of a logic block will always affect at least one net. When the temperature is less than a small fraction of the average cost of a net, it is unlikely that any move that results in a cost increase will be accepted, so we terminate the anneal.4 Routing AlgorithmVPR’s router is based on the Pathfinder negotiated congestion algorithm [14, 8]. Basically, this algorithm initially routes each net by the shortest path it can find, regardless of any overuse of wiring segments or logic block pins that may result. One iteration of the router consists of sequentially ripping-up and re-routing (by the lowest cost path found) every net in the circuit. The cost of using a routing resource is a func-tion of the current overuse of that resource and any overuse that occurred in prior rout-ing iterations. By gradually increasing the cost of oversubscribed routing resources, the algorithm forces nets with alternative routes to avoid using oversubscribed resources, leaving only the net that most needs a given resource behind.For the experimental results in this paper we set the maximum number of router iterations to 45; if a circuit has not successfully routed in a given number of tracks in 45 iterations it is assumed to be unroutable with channels of that width. To avoid overly circuitous routes and to save CPU time, we allow the routing of a net to go at most 3 channels outside the bounding box of the net terminals.One important implementation detail deserves mention. Both the original Path-finder algorithm and VPR’s router use Dijkstra’s algorithm (i.e. a maze router [15]) to connect each net. For a k terminal net, the maze router is invoked k-1 times to perform all the required connections. In the first invocation, the maze routing wavefront expands out from the net source until it reaches any one of the k-1 net sinks. The path from source to sink is now the first part of this net’s routing. The maze routing wave-front is emptied, and a new wavefront expansion is started from the entire net routing found thus far. After k-1 invocations of the maze router all k terminals of the net will be connected.Unfortunately, this approach requires considerable CPU time for high-fanout nets. High-fanout nets usually span most or all of the FPGA. Therefore, in the latter invoca-tions of the maze router the partial routing used as the net source will be very large, and it will take a long time to expand the maze router wavefront out to the next sink. Fortunately there is a more efficient method. When a net sink is reached, add all the routing resource segments required to connect the sink and the current partial routing to the wavefront (i.e. the expansion list) with a cost of 0. Do not empty the current maze routing wavefront; just continue expanding normally. Since the new path added to the partial routing has a cost of zero, the maze router will expand around it at first. Since this new path is typically fairly small, it will take relatively little time to add this new wavefront, and the next sink will be reached much more quickly than if the entire wavefront expansion had been started from scratch. Figure 3 illustrates the difference graphically.5 Experimental ResultsThe various FPGA parameters used in this section were always chosen to allow a direct comparison with previously published results. All the results in this section were obtained with a logic block consisting of a 4-input LUT plus a flip flop, as shown in Figure 2. The clock net was not routed in sequential circuits, as it is usually routed via a dedicated routing network in commercial FPGAs. Each LUT input appears on one side of the logic block, while the logic block output is accessible from both the bottom and right sides, as shown in Figure 4. Each logic block input or output can connect to any track in the adjacent channel(s) (i.e. F c = W). Each wire segment can connect to three other wiring segments at channel intersections (i.e F s = 3) and the switch box topology is “disjoint” -- that is, a wiring segment in track 0 connects only to other wiring segments in track 0 and so on.5.1 Experimental Results with Input Pin DoglegsMost previous FPGA routing results have assumed that “input pin doglegs” are possible. If the connection box between an input pin and the tracks to which it con-nects consists of F c independent pass transistors controlled by F c SRAM bits, it is pos-sible to turn on two of these switches in order to electrically connect two tracks via the input pin. We will refer to this as an input pin dogleg. Commercial FPGAs, however,Expansion Unconnected(a) Expansion reaches a sinkExpansion(b) Traditional method:restart wavefront(c) VPR method: maintainwavefront and expand around new wireExpansion Fig. 3.When a sink is reached (a), a new wavefront can be built from scratch (b), orincrementally (c).Re-expand aroundRoutingin4outFig. 4.Logic block pin locations.implement the connection box from an input pin to a channel via a multiplexer, so only one track may be connected to the input pin. Using a multiplexer rather than indepen-dent pass transistors saves considerable area in the FPGA layout. As well, normally there is a buffer between a track and the connection block multiplexers to which it con-nects in order to improve speed; this buffer also means that input pin doglegs can not be used. Therefore, while we allow input pin doglegs in this section in order to make a fair comparison with past results, it would be best if in the future FPGA routers were tested without input pin doglegs.In this section we compare the minimum number of tracks per channel required for a successful routing by various CAD tools on a set of 9 benchmark circuits.1 All the results in Table2 are obtained by routing a placement produced by Altor [16], a min-cut based placement tool. Three of the columns consist of two-step (global then detailed) routing, while the other routers perform combined global and detailed rout-ing. VPR requires 10% fewer tracks than the second best router, and the third best router consists of VPR’s global route phase plus SEGA for detailed routing.Table3 lists the number of tracks required to implement these benchmarks when new CAD tools are allowed to both place and route the circuits. The size column lists the number of logic blocks in each circuit. VPR uses 13% fewer tracks when it per-forms combined global and detailed routing than it does when SEGA is used to per-form detailed routing on a a VPR-generated global route. FPR, which performs placement and global routing simultaneously in an attempt to improve routability, requires 87% more total tracks than VPR. Finally, allowing VPR to place the circuits instead of forcing it to use the Altor placements reduces the number of tracks VPR requires to route them by 40%, indicating that VPR’s simulated annealing based placer is considerably better than the Altor min-cut placer.5.2 Experimental Results Without Input Pin DoglegsTable4 compares the performance of VPR with that of the SPLACE/SROUTE tool 1.These benchmarks are available for download at /~lemieux/sega.an Altor-generated placement VPR requires 13% fewer tracks than SROUTE. When the tools are allowed to both place and route the circuits, VPR requires 29% fewer tracks than the SPLACE/SROUTE combination. Both VPR and SPLACE are based on simulated annealing. We believe the VPR placer outperforms SPLACE partially because it handles high-fanout nets more efficiently, allowing more moves to be evalu-ated in a given time, and partially because of a more efficient annealing schedule.The benchmarks used in Sections 5.1 and 5.2 range in size from 54 to 358 logic blocks, and accordingly are too small to be very representative of today’s FPGAs. Therefore, in this section we present experimental results for the 20 largest MCNC benchmark circuits [27], which range in size from 1047 to 8383 logic blocks. We use Flowmap [28] to technology map each circuit to 4-LUTs and flip flops, and VPACK tocombine flip flops and LUTs into our basic logic block. The number of I/O pads that fit per row or column is set to 2, in line with current commercial FPGAs. Each circuit is placed and routed in the smallest square FPGA which can contain it. Input pin dog-legs are not allowed. Note that three of the benchmarks, bigkey, des, and dsip, are pad-limited in the FPGA architecture assumed.cuits with VPR with the number required to place and globally route the circuits with VPR and then perform detailed routing with SEGA [23]. Table5 also gives the size of each circuit, in terms of the number of logic blocks. The entries in the SEGA column with a≥ sign could not be successfully routed because SEGA ran out of memory. Using SEGA to perform detailed routing on a global route generated by VPR increases the total number of tracks required to route the circuits by over 68% vs. having VPR perform the routing completely. Clearly SEGA has difficulty routing large circuits when input doglegs are not allowed.To encourage other FPGA researchers to publish routing results using these larger benchmarks, we issue the following “FPGA challenge.” Each time verified results which beat the previously best verified results on these benchmarks are announced, we will pay the authors $1 (sorry, $1 Cdn., not $1 U.S.) for each track by which they reduce the total number of tracks required from that of the previously best results. The technology-mapped netlists, the placements generated by VPR and the currently best routing track total are available at /~jayar/software.html.6 Conclusions and Future WorkWe have presented a new FPGA placement and routing tool that outperforms all such tools to which we can make direct comparisons. In addition we have presented benchmark results on much larger circuits than have typically been used to character-ize academic FPGA place and route tools. We hope the next generation of FPGA CAD tools will be compared on the basis of these larger benchmarks, as they are a closer approximation of the kind of problems being mapped into today’s FPGAs.One of the main design goals for VPR was to keep the tool flexible enough to allow its use in many FPGA architectural studies. We are currently working on several improvements to VPR to further increase its utility in FPGA architecture research. In the near future VPR will support buffered and segmented routing structures, and soon after that we plan to add a timing analyzer and timing-driven routing.References[1]S. Brown, R. Francis, J. Rose, and Z. Vranesic,Field-Programmable Gate Arrays, KluwerAcademic Publishers, 1992.[2]Xilinx Inc.,The Programmable Logic Data Book, 1994.[3]AT & T Inc.,ORCA Datasheet, 1994.[4]Actel Inc.,FPGA Data Book, 1994.[5]Altera Inc.,Data Book, 1996.[6]V. Betz and J. 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