Semiconductor chip module and method for manufactu
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专利名称：Semiconductor chip module and method for
manufacturing the same
发明人：Ming-Tung Shen
申请号：US09810840
申请日：20010316
公开号：US06734041B2
公开日：
20040511
专利内容由知识产权出版社提供
专利附图：
摘要：A semiconductor chip module includes first and second semiconductor chips,and a dielectric tape layer. The first semiconductor chip has a pad mounting surface with a plurality of first bonding pads provided thereon. The dielectric tape layer has opposite
first and second adhesive surfaces. The first adhesive surface is adhered onto the pad mounting surface of the first semiconductor chip. The dielectric tape layer is formed with a plurality of holes at positions registered with the first bonding pads to expose the first bonding pads. Each of the holes is confined by a wall that cooperates with a registered one of the first bonding pads to form a contact receiving space. A plurality of conductive contacts are placed in the contact receiving spaces, respectively. The second semiconductor chip has a chip mounting surface adhered onto the second adhesive surface of the dielectric tape layer. The chip mounting surface is provided with second bonding pads that are bonded to the conductive contacts to establish electrical connection with the first bonding pads. A method for manufacturing the semiconductor chip module is also disclosed.
申请人：SHEN MING-TUNG
代理机构：Ladas & Parry
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