电子元器件应用-Low-Power Signal Conditioning For A Pressure Sensor

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软考中级嵌入式系统需掌握的英语词汇

软考中级嵌入式系统需掌握的英语词汇一、嵌入式系统基础1. 嵌入式系统：Embedded System2. 硬件：Hardware3. 软件：Software4. 固件：Firmware5. 系统软件：System Software6. 应用软件：Application Software7. 实时操作系统：Real-Time Operating System (RTOS)二、微控制器原理1. 微控制器：Microcontroller2. 中央处理器：Central Processing Unit (CPU)3. 存储器：Memory4. 输入/输出接口：Input/Output Interface5. 时钟系统：Clock System6. 中断：Interrupt7. 外设：Peripheral三、ARM架构与编程1. ARM架构：ARM Architecture2. ARM指令集：ARM Instruction Set3. ARM汇编语言：ARM Assembly Language4. ARM链接器：ARM Linker5. ARM工具链：ARM Toolchain6. ARM Cortex系列：ARM Cortex Series7. ARM内存管理单元：ARM Memory Management Unit (MMU)四、实时操作系统1. 实时操作系统：Real-Time Operating System (RTOS)2. 任务调度：Task Scheduling3. 信号量：Semaphore4. 消息队列：Message Queue5. 内存管理：Memory Management6. 中断处理：Interrupt Handling7. 时间管理：Time Management五、低功耗设计1. 低功耗设计：Low Power Design2. 待机模式：Standby Mode3. 休眠模式：Sleep Mode4. 唤醒机制：Wake-up Mechanism5. 能效比：Energy Efficiency Ratio6. 功率优化：Power Optimization7. 低功耗电路设计：Low Power Circuit Design六、传感器与信号处理1. 传感器：Sensor2. 模拟信号：Analog Signal3. 数字信号：Digital Signal4. 信号调理：Signal Conditioning5. 采样率：Sampling Rate6. 滤波器：Filter7. 数据转换器：Data Converter8. 信号处理算法：Signal Processing Algorithm9. 特征提取：Feature Extraction10. 信号分析：Signal Analysis11. 噪声抑制：Noise Suppression12. 数据融合：Data Fusion13. 动态范围：Dynamic Range14. 量程：Range of Measurement。

大学生毕业设计电路IR2153及应用

1.概述IR2153是一种高压、高速、带有高低端驱动的半桥驱动器。

该器件前级可调振荡器的功能与大家熟知的555时基电路相似。

驱动器的输出带有缓冲单元,可设定内部死区时间,防止桥路中的两只功率开关管直通。

高、低端管子具有延时匹配,适用于占空比为50%的场合,该器件可驱动N 沟道功率MOSF E T 或I G 2B T 。

IR2153具有以下特点:●带自举二极管的浮动设计,最大耐压为600V ;●允许瞬时负压;●欠压保护;●内部振荡器频率可调整;●高、低通道匹配的死区时间;●起动电流很小,仅为90μA ;●高、低通道的关断功能;●低通道输出电压波形与R T 端电压波形相同。

2.内部结构及引脚功能IR2153内部由放大器、触发器、逻辑控制电路、驱动器及功率电路等构成,如图1所示。

该器件采用双列8引脚封装,引脚定义及形式如图2所示。

脚1(V CC ):低端逻辑和内部MOS 管的门极驱动电源电压。

脚2(R T ):振荡器定时电阻输入端。

此端电压波形与半桥高端(脚7)相同。

脚3(C T ):振荡器●新特器件应用节能灯驱动电路IR2153及应用湖北省电子产品质量检验所胡大友摘要:IR2153是美国国际整流器公司(IR )推出的电子镇流器控制专用集成电路。

本文描述了IR2153的主要特点、引脚功能,简要介绍了该器件的电气参数,并着重讲述了实际应用电路。

关键词:电子镇流器驱动IR2153应用图2IR2153引脚图图1IR2153功能框图定时电容输入端。

应用时,该脚和COM (脚4)之间应接一电容,以便调整振荡器频率。

f =11.4(R T +75Ω)C T(式中,75Ω是输出级的等效电阻)。

脚4(COM ):低端返回端。

脚5(L O ):低端门极驱动输出端。

脚6(V S ):高端浮动电源返回端。

脚7(HO ):高端门极输出驱动端。

脚8(V S ):高端MOS 管门极驱动浮动电源。

3.电气参数3.1极限参数IR2153的极限参数如表1所列。

TSL2561中文资料

Chipscale Package
D Automatically Rejects 50/60-Hz Lighting
Ripple
D Low Active Power (0.75 mW Typical) with
Power Down Mode
D RoHS Compliant
TSL2560, TSL2561 LIGHT-TO-DIGITAL CON61 LIGHT-TO-DIGITAL CONVERTER
TAOS059K − APRIL 2007
Functional Block Diagram
VDD = 2.7 V to 3.5 V
Channel 0 Visible and IR
The TSL256x devices also support an interrupt feature that simplifies and improves system efficiency by eliminating the need to poll a sensor for a light intensity value. The primary purpose of the interrupt function is to detect a meaningful change in light intensity. The concept of a meaningful change can be defined by the user both in terms of light intensity and time, or persistence, of that change in intensity. The TSL256x devices have the ability to define a threshold above and below the current light level. An interrupt is generated when the value of a conversion exceeds either of these limits.

电气专业英语

电气类：电机与电气Electric Machine & Electrical Apparatus电气材料分析高级实验Advanced Experiment of Electric Material Analysis [E5nAlisis]电气测量技术及虚拟仪器Electrical Measurment Technology & V irtual Instrument电气工程Electrical Engineering电气工程中的数学Mathematics in Electrical Engineering电气绝缘测试技术专题Special Topics on Electrical Insulation Measurement电气绝缘测试新技术New Technology of Electric Insulation Measurement电气设备的现代设计方法Modern Design of Electrical Facility电气设备故障诊断技术Electric Equipment Fault Diagnosis电气物性专论Special Topics on Electric Property优化技术在电气工程中的应用Application of Optimization [7Cptimai5zeiFEn] in Electrical Engineering电器类：电机与电器Electric Machine & Electric Apparatus电力开关电器理论及应用Theory & Application of Power Switch电器测量技术Electrical Measurement Technology电器工程Electrical Engineering电力类：电力电子技术Power Electronics电力电子与电力传动Power Electronics & Power Drive电力电子装置设计技术Power Electronic Equipment Design电力开关电器理论及应用Theory & Application of Power Switch电力市场Elcetric Power Market电力系统安全自动装置Power System Automatic Device电力系统电磁暂态数字仿真技术Electro-magnetic Transient[5trAnziEnt] Digital Simulation in Power System电力系统分析Electric Power System Analysis电力系统及其自动化Power System & its Automation电力系统继电保护原理Power System Relay Protection电力系统可靠性Power System Power Reliablility电力系统控制Power System Control电力系统通信Communication in Power System电力系统专题Special Topics on Power System高电压技术在非电力系统中的应用Application of High V oltage Technology in Non-power System高频电力电子电路的建模与控制Modeling & Control of High-frequency Power,Electronic & Electrocircuit李雅普诺夫直接法在电力系统中的应用Application of Lyapunov Theory in Power System现代电力电子技术Modern Power Electronics现代电力电子学Modern Power Electronics新型电力电子器件及其基础New Power Electronic Deviceacid cleaning 酸洗interstage leakage 级间漏汽coal bunker 原煤斗intervetion/disturbing/bump 扰动excess air 过量空气inverter 转换开关induced draft fan 引风机isolate 相互隔离steam drum 汽包item 物品、元件sub-distribution transformer 低压厂用变journal bearing 支持轴承6kv station board 6KV公用配电屏kilo-volt 千伏6kv unit board 6KV配电屏low pressure cylinder/casing(LP) 低压缸A: ampere 安培large scale integrate circuit 大规模集成电路actuator 执行机构LED 发光二极管adapter 转接器、接头、light/ignite 点火air circuit breaker 空气断路器linear variable differential transformer (LVDT) 线性差动变压器air dry 分析基linearization 线性化air preheater 空气预热器liquid 液态air-insulated 空气绝缘的live steam 主蒸汽algorithms 算法load tap-changing 有载调压的alignment 平直度log 记录、日志alteration 改造longitudinal 纵向的alternating current 交流电lug 吊耳ammonia 氨major pant item 主要辅机amplitude 幅度making current 关合电流analogue 模拟量malfunction 误动作Analogue to Digital conversion 模数转换mechanism 操作机构annex 附属部分medium 媒介、介质annular 环状的membrane panel/wall 膜式壁annunciator 报警器microgovernor 微型调速器anthracite 无烟煤mill 铁素体apex 顶点millivolt 毫伏archive buffer 文件缓冲器Mimic 模拟图armature 电枢MMC: motor control center 电动机控制中心as received 应用基Modulation 调节、调制ash 灰分modulation-demodulation 调制解调ASM 模拟子模块moisture 水分Attemperator 减温器monitor mode 监控方式Automatic Boiler Controls 锅炉自动控制monitor/monitor unit 监控器automatic control system 自动控制系统monitoring 监测autonomous 独立存在的monoxide 一氧化碳auxiliary 辅助的motor starter 电动机启动装置axial 轴向的motor-operated 电动操纵的back-up 备用moving blades/ blading 动叶片bar 条形multifork root 叉型叶根bargraph 条形图Multi Function Process(MFP) 多功能处理器batch 成组的、成批的MV A: mega volt-ampere 兆伏安baud rate 波特率natural gas 天然气bay 隔间natural/thermal circulation 自然循环bearing house 轴承座network 电网bearing pad 轴瓦neutral point 中性点binary 二进制的nitrogen 氮binary cell 二进制单元node 节点binary counter 二进制计数器notch V形凹槽bit 比特、位ohm 欧姆bituminous 烟煤oil 石油blank 毛胚oiled-cable 油浸式电缆blow 熔断open loop 开环blow/purge 吹扫open-cycle 开环blowdown pipe 排污管operation 运行/操作boil 沸腾operation condition 运行工况boiler/steam generator 锅炉optimum control最优控制Boil out 煮炉order polynomial 多项式breaking current 开断电流orientation 定位brown coal/lignite 褐煤outage 停运bubble 汽泡outdoor 户外的burner 燃烧器outer casing 外缸bus interface module(BIM) 总线接口模块overhaul 大修busbar/bus 母线overhead 架空的cable 电缆overhead transmission line 架空输电线calibration 检验overview 全貌、总的看法capacitance 电容oxidized condition/atmosphere 氧化气氛capacitive current 电容电流oxygen 氧capacitor 电容器palm terminal 星型capacity 容量panel 配电盘、屏、板carbon 碳parallel interface 并行接口cast resin transformer 树脂浇注变压器pedestal 轴承座casting 锻造pedestal 轴承座centerline 中心线peer 同类的central control room (CCR) 集控室permanent 长久的channel 通道、信道permanent magnet 永久磁铁character 符号字符permeability 磁导率charger 充电器PF burner/pulverized fuel burner 煤粉燃烧器chronological 按时间顺序的phase change 相变circuit breaker 断路器photo-electric 光电circular 圆形的pick-ups 采样器circumferential 周围的pilot exciter 副励磁机clearance 间隙pipe 管道closed loop 闭环plane 平面coal 煤plant-loop 厂环coal feeder 给煤机pneumatic pilot valve 启动控制阀coil 线圈power plant 电厂cold junction compensation 冷端补偿power station （水）电站collar 轴环power supplies 电源Commission 试运行pressure 压力commissioning operation 试运行pressure firing 正压燃烧common service system 公用系统pressure meter 压力表compatibility 兼容性、相容性probe 探针compatible 能共存的、兼容的Process Control Unit (PCU) 过程处理单元complete functional set 全功能组件programmable logic controller(PLC) 可编程逻辑控制器concentricity 中心度、同心度programmable read only memory(PROM) 可编程只读存储器condensate 凝结prolong outage 长期停机conductance 导纳protection and trip 保护和跳闸conductibility 电导率provision 备用conductor 导体proximate analysis 工业分析cone 锥体PT: potential /voltage transformer 电压互感器configure 组态pulverizer/mill 磨煤机conical 圆锥形的push button 按钮connected in star 星型连接push contact 按钮触点consumption 消耗pushbutton 按钮control accuracy 控制精度pyramid 锥体control action 控制作用quality 质量control and instrumentation(C&I) 控制仪表系统quench 灭弧control button(knob) 控制按钮radial 半径的、辐射状的control console(desk) 控制台Rotor 转子controller 控制器reactance 电抗convection pass 对流烟道reaction turbine 反动式汽轮机converter 变送器rear end 后端、末端cooling fin 散热片rectify 整流coordination control system(CCS) 协调控制系统reducing condition/atmosphere 还原气氛core 铁芯redundancy 冗余的coupling 联轴器redundancy bit 冗余位crack/cracking 裂纹redundancy testing 冗余测试creep 蠕变reheater 再热器critical pressure 临界压力reliability 可靠性CT :current transformer 电流互感器reserve 备用cubical 机柜resistance 电阻cylinder 汽缸resolution 分辨率cylindrical 圆柱形的reverse video 反相显示D.C. resistance 直流电阻roll 毛胚deaerator（D.A）除氧器roof tube 顶棚管decimal 十进制的root 叶根demineralized water 除盐水rotor 转子density 密度RTD 热电阻diaphragm 隔板stator 定子dielectric 不导电的、绝缘的saturated water 饱和水digit display 数字显示scheme: system 系统digit signal 数字信号screw 螺钉dimension 尺寸search coil 控制线圈diode 二极管semiconductor 半导体directed forced-oil and forced-air cooled(ODAF) serial access 串行存取disconnecter 隔离开关serial interface 串（行接）口discrete 不连续的serpentine tube 蛇形管distribute control system(DCS) 分散控制系统shadow 跟随distribution 配电shaft 轴diverter 分压器shroud/shrouding 围带division wall 分隔墙shunt 使分流double shell structure 双层缸结构shut down 停机double-flow 双向流动side wall 侧墙dowel 销钉signal conditioning 信号调节drain pipe 疏水管silicon 硅Drain 疏水single-flow 单向流动dry 干燥基slave module 子模块dry and ash free 可燃基Slipping 滑环dry -core cable 干式电缆Solenoid 电磁dual 双重的solid 固态duct 风道sootblower 吹灰器dump 转存sophisticated 高级的、先进的duodecimal 十二进制square root 平方根duplicate 复制的、备用的stabilization 稳定性duration 持续时间start up 启动dynamic stability 动稳定start up/standby transformer 启/备变eccentricity 偏心度state-of the-art 有目前发展水平的economizer 省煤器stationary blades/ blading 静叶片ECR:economic continuous rating 额定负荷stator frame 定子机座eddy current proximity detector 电涡流式检测器steady-state 稳态EHV :extra-high voltage 超高压steam air header 蒸汽热风器electric pressure converter 电压转换器steam/water vapor 水蒸气electrical equipment/apparatus 电气设备steam-water -mixture 汽水混合物electro-hydraulic 电动液压的stop/emergency valve 截止阀emergency 紧急的stress 应力energy 能量stud/stub 管接头engineering unit 工程单位sub system 子系统error checking and recovery 错误检验和恢复subbituminous 次烟煤error detector 错误指示器subcooled water 过冷水error rate 误差率substation 变电站evaluate 求出的数量suction firing 负压燃烧evaporate 蒸发suite 一组exception report 例外报告sulfur/sulphur 硫excite 励磁sulphur hexa fluoride 六氟化硫exciter 励磁机superconductor 超导体expansion 膨胀superheater 过热器expansion tank 油枕supervise 监督管理extinction 熄灭、灭火surge 浪涌facia/fascia 仪器仪表板surge diverter 避雷器facility 设备、工具switch block 开关组fatigue 疲劳、软化switch cabinet 开关柜feed back 反馈switcher 开关feeder speed 给煤机转速信号Switchgear 开关柜finish 光洁度symmetry 对称度fir-tree root 枞树形叶根synchronization 并网fixed carbon 固定碳tap 分接头flow meter 流量计tapping winding 分接头绕组flow rate 流量temperature 温度flue 烟道tenon 榫头flue gas 烟气terminal 终端、端子forced draft fan 鼓风机terminal box 端子箱、出线盒forced/pumped circulation 强迫循环terminal device 终端设备forced-oil and forced-air cooled(OFAF) the action of a magnetic field 磁场作用forging 铣制the bottom half 下半部fossil fuel 化石燃料the control room 控制室frame 机座the dew point temperature 露点free standing 独立的the front pedestal 操作台front/rear wall 前/后墙the horizontal joint 水平接合面fuel /flue 燃料/烟道the operations panel 控制屏furnace 炉膛the top half 上半部furnace tube 水冷壁thermal efficiency 热效率fuse 熔断器thermal power plant 热电厂galvanic isolation 绝缘thermal stress analysis 热应力分析gas air header 烟气热风器thermocouple 热电偶gaseous 气态thermocouple 热电偶gauge glass 水位计thermodynamic instrumentation 热工仪表generator 发电机thrust bearing 推力轴承generator transformer 主变tip 叶顶gland segment/packing 汽封片token 令牌governing valve 铸造tolerance 公差governor 调速器transformer 变压器gravity 重力transmitter 变送器grid 电网transport 传送、运输ground coal /pulverized fuel 粉状燃料transverse 横向的harmonious 协调的trap 阻波器header 联箱trip 切除、切断、脱扣heat 热量/加热tube 管子hexadecimal 十六进制tube bundle 管排hierarchical 分层（级）的tube seat 管座high pressure cylinder/casing(HP) 高压缸tube sheet 管板horizontal 水平的tubular 管形的hydraulic power plant 水电站turbine 汽轮机hydrazine 联氨turbine supervisory instrument(TIS) 汽机监视仪表hydrogen 氢turning gear 盘车装置hydrostatic test 水压实验two-tier terminals 双列端子排igniter 点火器ultimate analysis 元素分析impeller/wheel/disk 叶轮Uniform :the same 相同的impulse turbine 冲动式汽轮机Uninterruptible power supply(UPS) 不断电电源impulse withstand voltage 冲击耐受电压unit transformer 厂用变indoor 户内的utility boiler 公用锅炉inductance 感抗V: volt 伏特inductive 感应的vacuum contactor 真空断路器inductive current 电感电流V ane 导叶industrial boiler 工业锅炉V ertical 垂直的inner casing 内缸V ia 经由INNIS 网络接口子模块Vibration 振动instrument 测试仪表visual (inquiry)display terminal 直观显示终端instrument board 仪器盘visual communication 可视通讯instrument correction 仪表校正visual display unit (VDU) 直观显示元件instrument range 仪表量程visual frequency 视频instrument sensitivity 仪表灵敏度visual scanner 视像扫描器instrument terminal 端子、接线柱volatile 挥发分insulator 绝缘子volt free contact 电压自由触点integration 使完整W: watt 瓦特interconnection 相互water 水interface 接口water level 水位interlock 联锁wet-steam 湿蒸汽interlocking contact 联锁触点wind box 风箱interlocking signal 联锁信号winding 绕组interlocking switch system 联锁开关系统workhouse 模块intermediate pressure cylinder/casing(IP) 中压缸Zener diode 齐纳二极管internally 内部的zig-zag rod Z型拉筋interruption 开断。

THS4522中文资料

The family includes single (THS4521), dual (THS4522), and quad (THS4524)(1) versions.
These fully differential op amps feature accurate output common-mode control that allows for dc-coupling when driving analog-to-digital converters (ADCs). This control, coupled with an input common-mode range below the negative rail as well as rail-to-rail output, allows for easy interfacing between single-ended, ground-referenced signal sources. Additionally, these devices are ideally suited for driving both successive-approximation register (SAR) and delta-sigma (ΔΣ) ADCs using only a single +3V to +5V and ground power supply.
TRANSPORT MEDIA, QUANTITY Rails, 75
Tape and reel, 2500 Tape and reel, 250 Tape and reel, 2500
Rails, 90 Tape and reel, 2000
Rails, 50 Tape and reel, 2000

MAX4130EUK+T,MAX4130EUK+T,MAX4132ESA+,MAX4132EUA+,MAX4131ESA,MAX4131EBT+T, 规格书,Datasheet 资料

MAX4130–MAX4134________________________________________________________________Maxim Integrated Products1For pricing, delivery, and ordering information,please contact Maxim/Dallas Direct!at 1-888-629-4642, or visit Maxim’s website at .General DescriptionThe MAX4130–MAX4134 family of operational amplifiers combines 10MHz gain-bandwidth product and excellent DC accuracy with Rail-to-Rail ®operation at the inputs and outputs. These devices require only 900µA per amplifier, and operate from either a single supply (+2.7V to +6.5V) or dual supplies (±1.35V to ±3.25V) with a common-mode voltage range that extends 250mV beyond V EE and V CC . They are capable of driving 250Ωloads and are unity-gain stable. In addition, the MAX4131/ MAX4133 feature a shutdown mode in which the outputs are placed in a high-impedance state and the supply current is reduced to only 25µA per amplifier.With their rail-to-rail input common-mode range and output swing, the MAX4130–MAX4134 are ideal for low-voltage, single-supply operation. Although the minimum operating voltage is specified at 2.7V, the devices typically operate down to 1.8V. In addition, low offset voltage and high speed make them the ideal signal-conditioning stages for precision, low-voltage data-acquisition systems. The MAX4130 is offered in the space-saving 5-pin SOT23 package. The MAX4131 is offered in the ultra-small 6-bump, 1mm x 1.5mm chip-scale package (UCSP™).________________________ApplicationsBattery-Powered Instruments Portable Equipment Data-Acquisition Systems Signal ConditioningLow-Power, Low-Voltage ApplicationsFeatureso 6-Bump UCSP (MAX4131)o +2.7V to +6.5V Single-Supply Operationo Rail-to-Rail Input Common-Mode Voltage Rangeo Rail-to-Rail Output Voltage Swing o 10MHz Gain-Bandwidth Product o 900µA Quiescent Current per Amplifier o 25µA Shutdown Function (MAX4131/MAX4133)o 200µV Offset Voltageo No Phase Reversal for Overdriven Inputs o Drive 250ΩLoadso Stable with 160pF Capacitive Loads o Unity-Gain StableSingle/Dual/Quad, Wide-Bandwidth, Low-Power,Single-Supply, Rail-to-Rail I/O Op Amps19-1089; Rev 3; 3/03*Dice are specified at T A = +25°C. DC parameters only.Ordering Information continued at end of data sheet.Pin Configurations appear at end of data sheet.Rail-to-Rail is a registered trademark of Nippon Motorola, Ltd.UCSP is a trademark of Maxim Integrated Products, Inc.M A X 4130–M A X 4134Single/Dual/Quad, Wide-Bandwidth, Low-Power,Single-Supply Rail-to-Rail I/O Op Amps 2_______________________________________________________________________________________ABSOLUTE MAXIMUM RATINGSDC ELECTRICAL CHARACTERISTICS(V CC = +2.7V to +6.5V, V EE = 0V, V CM = 0V, V OUT = V CC /2, R L tied to V CC /2, SHDN ≥2V (or open), T A = +25°C , unless otherwise noted.)Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.Supply Voltage (V CC - V EE )...................................................7.5V IN+, IN-, SHDN Voltage...................(V CC + 0.3V) to (V EE - 0.3V)Output Short-Circuit Duration (Note 1).......................Continuous(short to either supply)Continuous Power Dissipation (T A = +70°C)5-Pin SOT23 (derate 7.1mW/°C above +70°C)............571mW 6-Bump UCSP (derate 2.9mW/°C above +70°C).........308mW 8-Pin SO (derate 5.88mW/°C above +70°C)................471mW8-Pin µMAX (derate 4.10mW/°C above +70°C)...........330mW 14-Pin SO (derate 8.00mW/°C above +70°C)..............640mW Operating Temperature RangeMAX413_E__...................................................-40°C to +85°C Maximum Junction Temperature.....................................+150°C Storage Temperature Range.............................-65°C to +160°C Lead Temperature (soldering, 10s).................................+300°C Bump Reflow Temperature .........................................+235°CNote 1:Provided that the maximum package power-dissipation rating is not exceeded.MAX4130–MAX4134Single/Dual/Quad, Wide-Bandwidth, Low-Power,Single-Supply Rail-to-Rail I/O Op AmpsDC ELECTRICAL CHARACTERISTICS (continued)(V CC = +2.7V to +6.5V, V EE = 0V, V CM = 0V, V OUT = V CC /2, R L tied to V CC /2, SHDN ≥2V (or open), T A = +25°C , unless otherwise noted.)DC ELECTRICAL CHARACTERISTICS(V CC = +2.7V to +6.5V, V EE = 0V, V CM = 0V, V OUT = V CC /2, R L tied to V CC /2, SHDN ≥2V (or open), T A = -40°C to +85°C , unlessM A X 4130–M A X 4134Single/Dual/Quad, Wide-Bandwidth, Low-Power,Single-Supply Rail-to-Rail I/O Op Amps 4_______________________________________________________________________________________DC ELECTRICAL CHARACTERISTICS(V CC = +2.7V to +6.5V, V EE = 0V, V CM = 0V, V OUT = V CC /2, R L tied to V CC /2, SHDN ≥2V (or open), T A = -40°C to +85°C , unlessMAX4130–MAX4134Single/Dual/Quad, Wide-Bandwidth, Low-Power,Single-Supply Rail-to-Rail I/O Op Amps_______________________________________________________________________________________5DC ELECTRICAL CHARACTERISTICS (continued)(V CC = +2.7V to +6.5V, V EE = 0V, V CM = 0V, V OUT = V CC /2, R L tied to V CC /2, SHDN ≥2V (or open), T A = -40°C to +85°C , unless otherwise noted.) (Note 2)AC ELECTRICAL CHARACTERISTICSM A X 4130–M A X 4134Single/Dual/Quad, Wide-Bandwidth, Low-Power,Single-Supply, Rail-to-Rail I/O Op Amps 6_______________________________________________________________________________________60-401001k 10k 1M 10M100k 100M GAIN AND PHASE vs. FREQUENCY-20FREQUENCY (Hz)G A I N (d B )02040P H A S E (D E G R E E S )180144720-72-144-180-108-363610860-401001k 10k 1M 10M100k 100MGAIN AND PHASEvs. FREQUENCY (WITH C)-20FREQUENCY (Hz)G A I N (d B )2040P H A S E (D E G R E E S )180144720-72-144-180-108-36361080-100101001k100k1M10M10k 100MPOWER-SUPPLY REJECTIONvs. FREQUENCY-80FREQUENCY (Hz)P S R (d B )-60-40-2001051520253530454050-40-25-105203550658095SHUTDOWN SUPPLY CURRENTvs. TEMPERATURETEMPERATURE (°C)S U P P L Y C U R R E N T (µA )1000.100.011001k100k1M10M10k100MOUTPUT IMPEDANCE vs. FREQUENCYFREQUENCY (Hz)O U T P U T I M P E D A N C E (Ω)1101150800850900950105010001100-40-25-105203550658095SUPPLY CURRENT PER AMPLIFIERvs. TEMPERATURETEMPERATURE (°C)S U P P L Y C U R R E N T (µA )-10-505101520-40-25-105203550658095OUTPUT LEAKAGE CURRENTvs. TEMPERATURETEMPERATURE (°C)L E A K A G E C U R R E N T (µA )Typical Operating Characteristics(V CC = +5V, V EE = 0V, VCM = V CC / 2, T A = +25°C, unless otherwise noted.)-600123456INPUT BIAS CURRENT vs. COMMON-MODE VOLTAGECOMMON-MODE VOLTAGE (V)I N P U T B I A S C U R R E N T (n A )-50-40-30-20-10010203040-60-40-40-25-105203550658095INPUT BIAS CURRENTvs. TEMPERATURETEMPERATURE (°C)I N P U T B I A S C U R R E N T (n A )-200204060MAX4130–MAX4134Single/Dual/Quad, Wide-Bandwidth, Low-Power,Single-Supply, Rail-to-Rail I/O Op Amps_______________________________________________________________________________________712070750600110115OUTPUT VOLTAGE: EITHER SUPPLY (mV)G A I N (d B )30095859080100200500105100400LARGE-SIGNAL GAIN vs. OUTPUT VOLTAGE130-40-25-105203550658095LARGE-SIGNAL GAIN vs. TEMPERATURE90120TEMPERATURE (°C)G A I N (d B )11010085951251151051.21.31.51.41.61.71.81.9-40-25-105203550658095MINIMUM OPERATING VOLTAGEvs. TEMPERATUREM A X 4130/34-21TEMPERATURE (°C)M I N I M U M O P E R A T I N G V O L T A G E (V )Typical Operating Characteristics (continued)(V CC = +5V, V EE = 0V, V CM = V CC / 2, T A = +25°C, unless otherwise noted.)12080859095100105110115-40-25-105203550658095COMMON-MODE REJECTIONvs. TEMPERATURETEMPERATURE (°C)C O M M O N -M ODE R E J E C T I O N (d B )130700600120OUTPUT VOLTAGE: EITHER SUPPLY (mV)G A I N (dB )3001009080100200500110400LARGE-SIGNAL GAIN vs. OUTPUT VOLTAGE12060600110OUTPUT VOLTAGE: EITHER SUPPLY (mV)G A I N (d B )300908070100200500100400LARGE-SIGNAL GAIN vs. OUTPUT VOLTAGE12080-40-25-105203550658095LARGE-SIGNAL GAIN vs. TEMPERATURE90TEMPERATURE (°C)G A I N (d B )105859511511010012070750600110115OUTPUT VOLTAGE: EITHER SUPPLY (mV)G A I N (d B )30095859080100200500105100400LARGE-SIGNAL GAIN vs. OUTPUT VOLTAGE-3.00-2.25-0.75-1.5001.500.752.253.00-40-25-105203550658095INPUT OFFSET VOLTAGE vs. TEMPERATURETEMPERATURE (°C)V O L T A G E (m V )M A X 4130–M A X 4134Single/Dual/Quad, Wide-Bandwidth, Low-Power,Single-Supply, Rail-to-Rail I/O Op Amps 8_______________________________________________________________________________________1408010k 1k 100k 10M 1M CHANNEL SEPARATION vs. FREQUENCYFREQUENCY (Hz)C H A N N E L S E P A R A T I O N (d B )1009013011012010100k10kFREQUENCY (Hz)1001k 0.03000.0050.0100.0150.0200.025 TOTAL HARMONIC DISTORTION AND NOISE vs. FREQUENCYT H D A N D N O I S E (%)0.10.0014.04.44.25.04.84.6TOTAL HARMONIC DISTORTION AND NOISE vs. PEAK-TO-PEAK SIGNAL AMPLITUDEPEAK-TO-PEAK SIGNAL AMPLITUDE (V)T H D + N O I S E (%)0.01INTIME (200ns/div)V O L T A G E (50m V /d i v )OUTMAX4131SMALL-SIGNAL TRANSIENT RESPONSE (NONINVERTING)IN TIME (200ns/div)V O L T A G E (50m V /d i v )OUT MAX4131SMALL-SIGNAL TRANSIENT RESPONSE (INVERTING)A V = -1IN TIME (2µs/div)V O L T A G E (2V/d i v )OUT MAX4131LARGE-SIGNAL TRANSIENT RESPONSE (NONINVERTING)A V = +1INTIME (2µs/div)V O L T A G E (2V /d i v )OUTMAX4131LARGE-SIGNAL TRANSIENT RESPONSE (INVERTING)Typical Operating Characteristics (continued)(V CC = +5V, V EE = 0V, V CM = V CC / 2, T A = +25°C, unless otherwise noted.)1600-40-25-105203550658095MINIMUM OUTPUT VOLTAGEvs. TEMPERATURE20140120TEMPERATURE (°C)V O U T - V E E (m V )100806040050100150200250300-40-25-105203550658095MAXIMUM OUTPUT VOLTAGEvs. TEMPERATURETEMPERATURE (°C)V C C - V O U T (m V )MAX4130–MAX4134Single/Dual/Quad, Wide-Bandwidth, Low-Power,Single-Supply, Rail-to-Rail I/O Op Amps_______________________________________________________________________________________9Figure 1a. Reducing Offset Error Due to Bias Current (Noninverting)Figure 1b. Reducing Offset Error Due to Bias Current (Inverting)M A X 4130–M A X 4134Single/Dual/Quad, Wide-Bandwidth, Low-Power,Single-Supply, Rail-to-Rail I/O Op Amps 10______________________________________________________________________________________Applications InformationRail-to-Rail Input StageDevices in the MAX4130–MAX4134 family of high-speed amplifiers have rail-to-rail input and output stages designed for low-voltage, single-supply opera-tion. The input stage consists of separate NPN and PNP differential stages that combine to provide an input common-mode range that extends 0.2V beyond the supply rails. The PNP stage is active for input volt-ages close to the negative rail, and the NPN stage is active for input voltages near the positive rail. The input offset voltage is typically below 200µV. The switchover transition region, which occurs near V CC / 2, has been extended to minimize the slight degradation in com-mon-mode rejection ratio caused by the mismatch of the input pairs. Their low offset voltage, high band-width, and rail-to-rail common-mode range make these op amps excellent choices for precision, low-voltage data-acquisition systems.Since the input stage switches between the NPN and PNP pairs, the input bias current changes polarity as the input voltage passes through the transition region.Reduce the offset error caused by input bias currents flowing through external source impedances by match-ing the effective impedance seen by each input (Figures 1a, 1b). High source impedances, together with input capacitance, can create a parasitic pole that produces an underdamped signal response. Reducing the input impedance or placing a small (2pF to 10pF)capacitor across the feedback resistor improves response.The MAX4130–MAX4134s ’ inputs are protected from large differential input voltages by 1k Ωseries resistors and back-to-back triple diodes across the inputs (Figure 2). For differential input voltages less than 1.8V,input resistance is typically 500k Ω. For differential input voltages greater than 1.8V, input resistance is approxi-mately 2k Ω. The input bias current is given by the fol-lowing equation:Figure 2. Input Protection CircuitMAX4130–MAX4134Single/Dual/Quad, Wide-Bandwidth, Low-Power,Single-Supply, Rail-to-Rail I/O Op Amps______________________________________________________________________________________11Rail-to-Rail Output StageThe minimum output voltage is within millivolts of ground for single-supply operation where the load is referenced to ground (V EE ). Figure 3 shows the input voltage range and output voltage swing of a MAX4131connected as a voltage follower. With a +3V supply and the load tied to ground, the output swings from 0.00V to 2.90V. The maximum output voltage swing depends on the load, but will be within 150mV of a +3V supply, even with the maximum load (500Ωto ground).Driving a capacitive load can cause instability in most high-speed op amps, especially those with low quies-cent current. The MAX4130–MAX4134 have a high tol-erance for capacitive loads. They are stable with capacitive loads up to 160pF. Figure 4 gives the stable operating region for capacitive loads. Figures 5 and 6show the response with capacitive loads and the results of adding an isolation resistor in series with the output (Figure 7). The resistor improves the circuit ’s phase margin by isolating the load capacitor from the op amp ’s output.INTIME (1µs/div)V O L T A G E (1V /d i v )OUTV CC = 3V, R L = 10k Ω to V EEFigure 3. Rail-to-Rail Input/Output Voltage RangeFigure 4. Capacitive-Load StabilityINTIME (200ns/div)V O L T A G E (50m V /d i v )OUTV CC = 5V R L = 10k Ω C L = 130pFFigure 5. MAX4131 Small-Signal Transient Response with Capacitive Load Figure 6. MAX4131 Transient Response to Capacitive Load with Isolation ResistorINTIME (500ns/div)V O L T A G E (50m V /d i v )OUTV CC = 5V C L = 1000pF R S = 39ΩM A X 4130–M A X 4134Single/Dual/Quad, Wide-Bandwidth, Low-Power,Single-Supply, Rail-to-Rail I/O Op Amps 12______________________________________________________________________________________Power-Up and Shutdown ModeThe MAX4130–MAX4134 amplifiers typically settle with-in 1µs after power-up. Figures 9 and 10 show the out-put voltage and supply current on power-up, using the test circuit of Figure 8.The MAX4131 and MAX4133 have a shutdown option.When the shutdown pin (SHDN ) is pulled low, the sup-ply current drops below 25µA per amplifier and theamplifiers are disabled with the outputs in a high-impedance state. Pulling SHDN high or leaving it float-ing enables the amplifier. In the dual-amplifier MAX4133, the shutdown functions operate indepen-dently. Figures 11 and 12 show the output voltage and supply current responses of the MAX4131 to a shut-down pulse, using the test circuit of Figure 8.Figure 7. Capacitive-Load Driving CircuitFigure 8. Power-Up/Shutdown Test CircuitV CC TIME (5µs/div)V O L T A G E (1V /d i v )OUTFigure 9. Power-Up Output Voltage V CC (1V/div)TIME (5µs/div)I EE(500µA/div)Figure 10. Power-Up Supply CurrentMAX4130–MAX4134Single/Dual/Quad, Wide-Bandwidth, Low-Power,Single-Supply, Rail-to-Rail I/O Op Amps______________________________________________________________________________________13Power Supplies and LayoutThe MAX4130–MAX4134 operate from a single +2.7V to +6.5V power supply, or from dual supplies of ±1.35V to ±3.25V. For single-supply operation, bypass the power supply with a 0.1µF ceramic capacitor in parallel with at least 1µF. For dual supplies, bypass each sup-ply to ground.Good layout improves performance by decreasing the amount of stray capacitance at the op amp ’s inputs and outputs. Decrease stray capacitance by placing external components close to the op amp ’s pins, mini-mizing trace lengths and resistor leads.UCSP Applications InformationFor the latest application details on UCSP construction,dimensions, tape carrier information, PC board tech-niques, bump-pad layout, and the recommended reflow temperature profile, as well as the latest informa-tion on reliability testing results, go to Maxim ’s website at /ucsp and search for the Application Note: UCSP –A Wafer-Level Chip-Scale Package .TIME (1µs/div)OUTFigure 11. Shutdown Output Voltage TIME (1µs/div)Figure 12. Shutdown Enable/Disable Supply CurrentM A X 4130–M A X 4134Single/Dual/Quad, Wide-Bandwidth, Low-Power,Single-Supply, Rail-to-Rail I/O Op Amps 14________________________________________________________________________________________________________________________________________________Pin ConfigurationsMAX4130–MAX4134Single/Dual/Quad, Wide-Bandwidth, Low-Power,Single-Supply, Rail-to-Rail I/O Op Amps______________________________________________________________________________________15Chip InformationOrdering Information (continued)MAX4130 TRANSISTOR COUNT: 170MAX4131 TRANSISTOR COUNT: 170MAX4132 TRANSISTOR COUNT: 340MAX4134 TRANSISTOR COUNT: 680*Dice are specified at T A = +25°C, DC parameters only.Package Information(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,go to /packages .)M A X 4130–M A X 4134Single/Dual/Quad, Wide-Bandwidth, Low-Power,Single-Supply, Rail-to-Rail I/O Op Amps 16______________________________________________________________________________________Package Information (continued)(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,go to /packages .)MAX4130–MAX4134Single/Dual/Quad, Wide-Bandwidth, Low-Power,Single-Supply, Rail-to-Rail I/O Op Amps______________________________________________________________________________________17Package Information (continued)(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,go to /packages .)Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are M A X 4130–M A X 4134Single/Dual/Quad, Wide-Bandwidth, Low-Power,Single-Supply, Rail-to-Rail I/O Op Amps implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.18__________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 (408) 737-7600©2003 Maxim Integrated ProductsPrinted USAis a registered trademark of Maxim Integrated Products.Package Information (continued)(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,go to /packages .)。

THS4521中文资料

DEVICE THS4520 THS4121 THS4130
BW (MHz)
570 100 150
RELATED PRODUCTS
IQ (mA) 15.3 16 16
THD (dBc) at 100 kHz
–114
–79
–107
VN
RAIL-
(nV/√Hz) TO-RAIL
2
Out
5.4
In/Out
PACKAGE/ORDERING INFORMATION(1)
PRODUCT THS4521
THS4522 THS4524 (2)
PACKAGELEAD SOIC-8
MSOP-8
TSSOP-16
TSSOP-38
PACKAGE DESIGNATOR
D
DGK
SPECIFIED TEMPERATURE
RANGE
The family includes single (THS4521), dual (THS4522), and quad (THS4524)(1) versions.
These fully differential op amps feature accurate output common-mode control that allows for dc-coupling when driving analog-to-digital converters (ADCs). This control, coupled with an input common-mode range below the negative rail as well as rail-to-rail output, allows for easy interfacing between single-ended, ground-referenced signal sources. Additionally, these devices are ideally suited for driving both successive-approximation register (SAR) and delta-sigma (ΔΣ) ADCs using only a single +3V to +5V and ground power supply.

数字式电子罗盘毕业设计

毕业设计说明书数字式电子罗盘设计学生姓名：孔垂礼学号： ********** 学院：计算机与控制工程专业：电气工程及其自动化指导教师：***2015 年 06 月数字式电子罗盘设计摘要数字式电子罗盘具有很多优点，例如：体积比较小、启动非常迅速、功率损耗较低、制造成本低廉等,当今社会测控技术对测向传感器提出了非常高的要求;为了提高数字罗盘的测量精度,特意设计了一种基于HMC5883L三轴磁阻传感器[1]的数字电子罗盘;在分析相关类似产品的基础上,特别强调对电源、器件选型、信号调理电路、软件设计等方面进行了分析研究,设计出了数字罗盘并且研制了试验的样机;为验证设计效果,在双轴陀螺测试转台上进行了测试,试验结果初步验证了该设计方案的可行性;论文的研究工作可以为研究和改良数字式磁罗盘的测量准确度提供可靠的资料.关键词：地磁场，数字罗盘，HMC5883L三轴磁阻传感器，重力加速度计Here is the translation of your chinese paper’s titleAbstractDigital electronic compass, has small volume, quick start, low power consumption, and low cost, the modern measurement and control technology puts forward higher requirements on sensor of direction finding; In order to improve the precision of the digital compass, we design a HMC5883L triaxial magnetic resistance sensor based digital electronic compass; On the basis of the analysis of related products, focuses on the power supply, device selection, signal conditioning circuit and software design are analyzed in aspects of research, design the digital compass and test prototype was developed; To verify the design effect, on the two-axis gyro testing table was tested, experimental results verify the feasibility of the design scheme of; Thesis research work could be used to research and provide reference for improving the measuring accuracy of digital magnetic compass.Key words : Earth's magnetic field, digital compass, HMC5883L three-axis magnetic resistance sensor, the gravity accelerometer目录摘要 (2)Abstract (3)目录...........................................................................................................................................错误!未定义书签。

DS25BR150_0711中文资料

November 6, 2007 DS25BR1503.125 Gbps LVDS BufferGeneral DescriptionThe DS25BR150 is a single channel 3.125 Gbps LVDS buffer optimized for high-speed signal transmission over printed cir-cuit boards and balanced cables. Fully differential signal paths ensure exceptional signal integrity and noise immunity. The DS25BR150 is a buffer/repeater with very low power consumption. Other LVDS devices with similar IO character-istics and with signal conditioning features include the follow-ing products. The DS25BR110 features four levels of equalization for use as an optimized receiver device, the DS25BR120 features four levels of pre-emphasis for use as an optimized driver device, while the DS25BR100 features both pre-emphasis and equalization for use as an optimized repeater device.Wide input common mode range allows the receiver to accept signals with LVDS, CML and LVPECL levels; the output levels are LVDS. A very small package footprint requires a minimal space on the board while the flow-through pinout allows easy board layout. The differential inputs and outputs are internally terminated with a 100Ω resistor to lower device input and out-put return losses, reduce component count, and further min-imize board space.Features■DC - 3.125 Gbps low jitter, high noise immunity, low power operation■On-chip 100 Ω input and output termination minimizes insertion and return losses, reduces component count and minimizes board space■7 kV ESD on LVDS I/O pins protects adjoining components■Small 3 mm x 3 mm LLP-8 space saving package Applications■Clock or data buffering / repeating■OC-48 / STM-16 Clock or data buffering / repeating■InfiniBand■FireWireTypical Application30005510© 2007 National Semiconductor DS25BR150 3.125 Gbps LVDS BufferBlock Diagram30005507Pin Diagram30005508Pin DescriptionsPin Name Pin Name Pin Type Pin Description NC 1NA "NO CONNECT" pin.IN+2Input Non-inverting LVDS input pin.IN-3Input Inverting LVDS input pin.NC 4NA "NO CONNECT" pin.NC 5NA "NO CONNECT" pin.OUT-6Output Inverting LVDS output pin.OUT+7Output Non-inverting LVDS Output pin.VCC 8Power Power supply pin.GNDDAPPowerGround pad (DAP - die attach pad)Ordering Codes and ConfigurationsNSIDFunction DS25BR150TSDBuffer/Repeater 2D S 25B R 150Absolute Maximum Ratings (Note 4)If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications.Supply Voltage (VCC)−0.3V to +4V LVDS Input Voltage (IN+, IN−)−0.3V to +4V LVDS Differential Input Voltage ((IN+) - (IN−))0V to 1V LVDS Output Voltage (OUT+,OUT−)−0.3V to (V CC + 0.3V) LVDS Differential Output Voltage ((OUT+) - (OUT−))0V to 1V LVDS Output Short Circuit CurrentDuration5 ms Junction Temperature+150°C Storage Temperature Range−65°C to +150°C Lead Temperature RangeSoldering (4 sec.)+260°C Maximum Package Power Dissipation at 25°CSDA Package 2.08W Derate SDA Package16.7 mW/°C above +25°C Package Thermal Resistance θJA+60.0°C/W θJC+12.3°C/W ESD SusceptibilityHBM (Note 1)≥7 kV MM (Note 2)≥250V CDM (Note 3)≥1250V Note 1:Human Body Model, applicable std. JESD22-A114CNote 2:Machine Model, applicable std. JESD22-A115-ANote 3:Field Induced Charge Device Model, applicable std.JESD22-C101-CRecommended Operating ConditionsMin Typ Max Units Supply Voltage (VCC) 3.0 3.3 3.6V Receiver Differential InputVoltage (VID)01VOperating Free AirTemperature (TA)−40+25+85°CDC Electrical CharacteristicsOver recommended operating supply and temperature ranges unless otherwise specified. (Notes 5, 6, 7)Symbol Parameter Conditions Min Typ Max Units LVDS OUTPUT DC SPECIFICATIONS (OUT+, OUT-)VODDifferential Output VoltageR L = 100Ω250350450mVΔV OD Change in Magnitude of V OD for ComplimentaryOutput States-3535mVVOSOffset VoltageR L = 100Ω1.05 1.2 1.375VΔV OS Change in Magnitude of V OS for ComplimentaryOutput States-3535mVIOSOutput Short Circuit Current (Note 8)OUT to GND-25-50mAOUT to VCC7.550mACOUTOutput Capacitance Any LVDS Output Pin to GND 1.2pFROUTOutput Termination Resistor Between OUT+ and OUT-100ΩDS25BR150Symbol ParameterConditionsMin Typ Max Units LVDS INPUT DC SPECIFICATIONS (IN+, IN-)V ID Input Differential Voltage0 1V V TH Differential Input High Threshold V CM = +0.05V or V CC -0.05V 0+100mV V TL Differential Input Low Threshold−1000 mV V CMR Common Mode Voltage RangeV ID = 100 mV 0.05 V CC -0.05V I IN Input Current V IN = 3.6V or 0V V CC = 3.6V or 0V±1±10μA C IN Input Capacitance Any LVDS Input Pin to GND 1.7 pF R IN Input Termination Resistor Between IN+ and IN- 100 ΩSUPPLY CURRENTI CCSupply Current2735mANote 4:“Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating Conditions indicate conditions at which the device is functional and the device should not be operated beyond such conditions.Note 5:The Electrical Characteristics tables list guaranteed specifications under the listed Recommended Operating Conditions except as otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and are not guaranteed.Note 6:Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground except V OD and ΔV OD .Note 7:Typical values represent most likely parametric norms for V CC = +3.3V and T A = +25°C, and at the Recommended Operation Conditions at the time of product characterization and are not guaranteed.Note 8:Output short circuit current (I OS ) is specified as magnitude only, minus sign indicates direction only. 4D S 25B R 150AC Electrical Characteristics (Note 11)Over recommended operating supply and temperature ranges unless otherwise specified. (Notes 9, 10)Symbol Parameter Conditions Min Typ Max Units LVDS OUTPUT AC SPECIFICATIONS (OUT+, OUT-)t PHLD Differential Propagation Delay High to LowRL= 100Ω370520pstPLHDDifferential Propagation Delay Low to High355520pstSKD1Pulse Skew |tPLHD− tPHLD| (Note 12)15100pstSKD2Part to Part Skew (Note 13)45160pst LHT Rise TimeRL= 100Ω80150pstHLTFall Time80150ps JITTER PERFORMANCE (Figure 5)tDJ1Deterministic Jitter (Peak-to-Peak Value ) (Note 15)VID= 350 mVVCM= 1.2VK28.5 (NRZ)2.5 Gbps1133pstDJ2 3.125 Gbps1541pstRJ1Random Jitter (RMS Value)(Note 14)VID= 350 mVVCM= 1.2VClock (RZ)1.25 GHz0.51pstRJ2 1.5625 GHz0.51pstTJ1Total Jitter (Peak to Peak Value) (Note 16)VID= 350 mVVCM= 1.2VPRBS-23 (NRZ)2.5 Gbps0.040.11UI P-PtTJ2 3.125 Gbps0.070.15UIP-PNote 9:The Electrical Characteristics tables list guaranteed specifications under the listed Recommended Operating Conditions except as otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and are not guaranteed.Note 10:Typical values represent most likely parametric norms for VCC = +3.3V and TA= +25°C, and at the Recommended Operation Conditions at the time ofproduct characterization and are not guaranteed.Note 11:Specification is guaranteed by characterization and is not tested in production.Note 12:tSKD1, |tPLHD− tPHLD|, is the magnitude difference in differential propagation delay time between the positive going edge and the negative going edge ofthe same channel.Note 13:tSKD2, Part to Part Skew, is defined as the difference between the minimum and maximum specified differential propagation delays. This specificationapplies to devices at the same VCCand within 5°C of each other within the operating temperature range.Note 14:Measured on a clock edge with a histogram and an acummulation of 1500 histogram hits. Input stimulus jitter is subtracted geometrically.Note 15:Tested with a combination of the 1100000101 (K28.5+ character) and 0011111010 (K28.5- character) patterns. Input stimulus jitter is subtracted algebraically.Note 16:Measured on an eye diagram with a histogram and an acummulation of 3500 histogram hits. Input stimulus jitter is subtracted.DS25BR150DC Test Circuits30005520FIGURE 1. Differential Driver DC Test CircuitAC Test Circuits and Timing Diagrams30005521FIGURE 2. Differential Driver AC Test Circuit30005522FIGURE 3. Propagation Delay Timing Diagram30005523FIGURE 4. LVDS Output Transition Times 6D S 25B R 150DS25BR15030005529FIGURE 5. Jitter Measurements Test CircuitDevice OperationINPUT INTERFACINGThe DS25BR150 accepts differential signals and allows simple AC or DC coupling. With a wide common mode range, the DS25BR150 can be DC-coupled with all common differential drivers (i.e. LVPECL, LVDS, CML). The following three figures illus-trate typical DC-coupled interface to common differential drivers. Note that the DS25BR150 inputs are internally terminated with a 100Ω resistor.30005511Typical LVDS Driver DC-Coupled Interface to DS25BR150 Input30005512Typical CML Driver DC-Coupled Interface to DS25BR150 Input30005513Typical LVPECL Driver DC-Coupled Interface to DS25BR150 Input 8D S 25B R 150OUTPUT INTERFACINGThe DS25BR150 outputs signals are compliant to the LVDS standard. It can be DC-coupled to most common differential receivers.The following figure illustrates typical DC-coupled interface to common differential receivers and assumes that the receivers have high impedance inputs. While most differential receivers have a common mode input range that can accomodate LVDS compliant signals, it is recommended to check respective receiver's data sheet prior to implementing the suggested interface implementation.30005514Typical DS25BR150 Output DC-Coupled Interface to an LVDS, CML or LVPECL ReceiverDS25BR150Typical Performance30005531A 2.5 Gbps NRZ PRBS-7 Output Eye DiagramV:100 mV / DIV, H:75 ps / DIV30005532Total Jitter as a Function of Input Amplitude30005530A 3.125 Gbps NRZ PRBS-7 Output Eye DiagramV:100 mV / DIV, H:50 ps / DIV30005533Total Jitter as a Function of Input Amplitude 10D S 25B R 150Physical Dimensions inches (millimeters) unless otherwise notedOrder Number DS25BR150TSDNS Package Number SDA08A(See AN-1187 for PCB Design and Assembly Recommendations) DS25BR150NotesD S 25B R 150 3.125 G b p s L V D S B u f f e rFor more National Semiconductor product information and proven design tools, visit the following Web sites at:ProductsDesign SupportAmplifiers /amplifiers WEBENCH /webench Audio/audio Analog University /AU Clock Conditioners /timing App Notes /appnotes Data Converters /adc Distributors /contacts Displays /displays Green Compliance /quality/green Ethernet /ethernet Packaging/packaging Interface /interface Quality and Reliability /quality LVDS/lvds Reference Designs /refdesigns Power Management /power Feedback /feedback Switching Regulators /switchers LDOs /ldo LED Lighting /led PowerWise/powerwise Serial Digital Interface (SDI)/sdiTemperature Sensors /tempsensors Wireless (PLL/VCO)/wirelessTHE CONTENTS OF THIS DOCUMENT ARE PROVIDED IN CONNECTION WITH NATIONAL SEMICONDUCTOR CORPORATION (“NATIONAL”) PRODUCTS. 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PRI OR TO USI NG OR DI STRI BUTI NG ANY PRODUCTS THAT I NCLUDE NATIONAL COMPONENTS, BUYERS SHOULD PROVIDE ADEQUATE DESIGN, TESTING AND OPERATING SAFEGUARDS.EXCEPT AS PROVIDED IN NATIONAL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, NATIONAL ASSUMES NO LI ABI LI TY WHATSOEVER, AND NATI ONAL DI SCLAI MS ANY EXPRESS OR I MPLI ED WARRANTY RELATI NG TO THE SALE AND/OR USE OF NATIONAL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABI LI TY, OR I NFRI NGEMENT OF ANY PATENT, COPYRI GHT OR OTHER I NTELLECTUAL PROPERTY RIGHT.LIFE SUPPORT POLICYN ATION AL’S PRODUCTS ARE N OT AUTHORIZED FOR USE AS CRITICAL COMPON EN TS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS PRIOR WRITTEN APPROVAL OF THE CHIEF EXECUTIVE OFFICER AN D GEN ERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:Life support devices or systems are devices which (a) are intended for surgical implant into the body, or (b) support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in a significant injury to the user. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness.National Semiconductor and the National Semiconductor logo are registered trademarks of National Semiconductor Corporation. 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【电子技术应用】_low power_期刊发文热词逐年推荐_20140728

科研热词低功耗高速hart 高可靠骨矫形器频控半桥驱动预付费随动系统输出闭环反馈路由误码率舰炮自动抄表空间科学实验电机驱动电压空间矢量脉宽调制电力载波通信电力线通信热量表点对点通信温备份深度调光滞环控制标定有源功率校正数字化改进数字pwm变频电源控制器抗干扰微小电容嵌入式linux 峰均功率比多线程多叉树遍历寻优算法基准电流源可控硅调光器双积分a/d转换器压控振荡器单电源供电动态中继信道估计位同步传感器互补累积分布函数中继转发技术 tdc ofdm系统 msp430单片机 msp430 mfrc522 mems ic卡 icb1fl02g集成电路 h桥
53 54 55 56 57 58
constant trans-conductance cochlear implant cis算法 cis algorithm anti-collision adaptive filter
1 1 1 1 1 1
2013年序号 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44
科研热词低功耗高空平台风力发电非接触资源分配皮卫星电压跌落发生器生命探测现场可编程门阵列温度检测对偶理论地球磁场测量系统准则偏置电流带低电压穿越 zigbee xpower sram pauta ofdma l*mad jn5139 dsp
推荐指数 2 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1

【电子技术应用】_电源供电_期刊发文热词逐年推荐_20140727

科研热词高级电源管理高稳定性高压可控硅降压转换器配合使用输出噪声软件设计设计人员线性功率放大器系统设计系统实施真空断路器直接供电电源分配电流消耗电池电量电池寿命电容器组涌流新趋势数据速率操作过电压推出接口德州仪器应用设备射频功率放大器发热测量半导体温差发电充电泵便携式产品供电设备业界 rsa协处理器 rsa f2812 dc-dc
推荐指数 2 2 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1
2010年序号 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37
2008年序号 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
科研热词静态显示自适应超时电源无线传感器网络放电特性收支平衡点控制器太阳能电池板动态电源管理动态显示低功耗 nrf24l01 msp430f449 led点阵屏 dc/dc转换 ccd
科研热词推荐指数电源管理集成电路 2 双供电轨 2 adi 2 鲁棒性 1 非接触供电 1 静态电流 1 阅读器 1 采集设计 1 超级电容 1 负载瞬态响应测试 1 自动切换 1 能量 1 等效控制 1 硅能蓄电池 1 监控系统 1 电源管理单元 1 电源管理功能 1 电池供电 1 滑模控制 1 桥臂直通 1 智能配电终端 1 无线通信 1 无线传感器网络节点 1 无线传感器网络 1 数字隔离技术 1 数字隔离器 1 心脏起博器 1 德州仪器 1 射频识别 1 后备电源 1 受限制电源 1 双电源 1 单芯片 1 升压型dc/dc 1 功耗 1 前端 1 光耦合器 1 便携式电子产品 1 供电单元 1 低功耗电路 1 仪表系统 1 三相双降压式并网逆变器 1 ti 1 stm32 1 1 sepic-cuk转换器 1 mf rc522 1 devices 1 adi公司 1

【电子技术应用】_开关电源_期刊发文热词逐年推荐_20140725

宽电压容差多路输出备份电路基板器件喀嗒声同步可编程参数设计升压切换内置电源低反馈电阻主份电路中国专用电源 tda4863 sg3525 scart pfm控制 ncp1207 dc/dc转换 dc-dc变换器 ccd boost直流变换器
1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52
推荐指数 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1
2011年序号 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29
推荐指数 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1
2010年序号 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31
2011年科研热词开关电源高输入电压高性能非连续导电模式非线性解耦控制逆变器软开关解决方案程控移相全桥电源管理电压调整模块微分几何理论开关控制器开关损耗大电流同步控制器反激式双闭环双路输出双向dc/dc变换器单级链单片机信号处理供应商交错式三相磁集成 zvs orcad 推荐指数 2 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1

Low power complementary MOSFET digital signal buff

专利名称：Low power complementary MOSFET digitalsignal buffer circuit发明人：Sandhu, Bal S.申请号：EP92309116.9申请日：19921007公开号：EP0541242A1公开日：19930512专利内容由知识产权出版社提供专利附图：摘要：A low power complementary MOSFET buffer circuit includes an inputcomplementary MOSFET inverter (102) with a plurality of serially coupled diode-connected complementary MOSFETs (116,118) and an output complementary MOSFETinverter (104). An input digital signal drives one of the input inverter's MOSFET gates, and passes through the diode-connected MOSFETs to be biased, or level-shifted, prior to driving the input inverter's other MOSFET gate. Using the input digital signal directly and its biased equivalent ensures that, when each of the input inverter's MOSFETs is turned "off " in accordance with the logic level of the input digital signal, it is turned off more fully, thereby minimizing power dissipation. The inverted digital signal outputted from the input inverter drives both of the output inverter's MOSFET gates. The original input digital signal also drives one of the output inverter's MOSFET sources, whereby the low-to-high transition time of the output digital signal is reduced.申请人：NATIONAL SEMICONDUCTOR CORPORATION地址：2900 Semiconductor Drive, P.O. Box 58090 Santa Clara, California 95052-8090 US 国籍：US代理机构：Horton, Andrew Robert Grant更多信息请下载全文后查看。

电子元器件应用-Tag-it_ HF-I Plus 中等矩形Inlay [RI-I15-112B]

FEATURES APPLICATIONSDESCRIPTIONRI-I15-112B-02SCBS825–JULY2004–REVISED DECEMBER2005Tag-it™HF-I PLUS TRANSPONDER INLAYSMEDIUM RECTANGLE•Product Authentication•ISO/IEC15693-2,-3;ISO/IEC18000-3Compliant•Library•Supply-Chain Management•13.56-MHz Operating Frequency•Asset Management•2048-Bit User Memory in64-Bit×32-Bit•Ticketing/Stored ValueBlocks•User and Factory Lock Per Block•Application Family Identifier(AFI)•Data Storage Format Identifier(DSFID)•Combined Inventory Read BlockTexas Instruments Tag-it™HF-I plus transponder inlays consist of13.56-MHz high-frequency(HF)transponders that are compliant with the ISO/IEC15693and ISO/IEC18000-3global open standards.These products offer a user-accessible memory of2048bits,organized in64blocks,and an extensive command set available in six different antenna shapes,with frequency offset for integration into paper,PVC,or other substrates.The Tag-it HF-I plus transponder inlays are manufactured with TI’s patented laser tuning process to provide consistent read performance.Prior to delivery,the transponders undergo complete functional and parametric testing,in order to provide the high quality that customers have come to expect from TI.The Tag-it HF-I plus transponder inlays are well suited for a variety of applications including,but not limited to, product authentication,library,supply-chain management,asset management,and ticketing/stored value applications.Please be aware that an important notice concerning availability,standard warranty,and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.Tag-it is a trademark of Texas Instruments.PRODUCTION DATA information is current as of publication date.Copyright©2004–2005,Texas Instruments Incorporated Products conform to specifications per the terms of the TexasInstruments standard warranty.Production processing does notnecessarily include testing of all parameters.RI-I15-112B-02SCBS825–JULY 2004–REVISED DECEMBER 2005SPECIFICATIONS (1)PART NUMBER RI-I15-112B-02Supported standardISO/IEC 15693-2,-3;ISO/IEC 18000-3Recommended operating frequency 13.56MHz14.1MHz ±200kHz (includes frequency offset to compensate PVC Passive resonance frequency (at 25°C)lamination)Typical required activation field strength to read (at 25°C)98dB µA/m (2)Typical required activation field strength to write (at 25°C)101dB µA/m (2)Factory programmed read-only number 64bitsMemory (user programmable)2k bits organized in 64-bit ×32-bit blocks Typical programming cycles (at 25°C)100,000Data retention time (at 55°C)>10yearsSimultaneous identification of tags Up to 50tags per second (reader/antenna dependent)Antenna size 34mm ×65mm (~1.34in ×~2.56in)Foil width 48mm ±0.5mm (1.89in ±0.02in)Foil pitch 101.6mm +0.1mm/–0.4mm (4in)Chip area:0.355mm (~0.014in)Thickness Antenna area:0.085mm (~0.0033in)Base materialSubstrate:PET (polyethylenetherephtalate);Antenna:aluminum Smallest bending radius allowed 18mm (~0.71in)Operating temperature–25°C to 70°CStorage temperature (single inlay)–40°C to 85°C (warpage may occur at upper temperature range)Storage temperature (on reel)–40°C to 40°CSingle-row tape wound on cardboard reel with 500-mm diameter Reel outer width:approximately 60mm (~2.36in)DeliveryReel inner width:approximately 50mm (~1.97in)Hub diameter:76.2mm (3in)Typical quantity of good units per reel 5,000(1)For highest possible read-out coverage,operate readers at a modulation depth of 20%or higher.(2)After integration into paperSUPPORTED COMMAND SETREQUEST MODE (1)REQUESTREQUEST CODEINVENTORYADDRESSEDNON-ADDRESSEDSELECTAFI ISO 15693Mandatory and Optional Commands Inventory 0x01ü–––üStay Quiet0x02–ü–––Read_Single_Block 0x20üüüüüWrite_Single_Block 0x21–üüü–Lock_Block 0x22–üüü–Read_Multi_Blocks 0x23üüüüüWrite_Multi_Blocks 0x24–––––Select Tag 0x25–ü–––Reset to Ready 0x26–üüü–Write_AFI 0x27–üüü–Lock_AFI 0x28–üüü–Write DSFID0x29–üüü–(1)ü=Implemented,–=Not applicable2Submit Documentation FeedbackBlock #1236263RI-I15-112B-02SCBS825–JULY 2004–REVISED DECEMBER 2005SUPPORTED COMMAND SET (continued)REQUEST MODE (1)REQUESTREQUEST CODEINVENTORYADDRESSEDNON-ADDRESSEDSELECTAFI ISO 15693Mandatory and Optional Commands Lock DSFID 0x2A –üüü–Get_System_info 0x2B üüüüüGet_M_BLK_Sec_St 0x2C üüüüüTI Custom Commands Write_2_Blocks 0xA2–üüü–Lock_2_Blocks0xA3–üüü–MEMORY ORGANIZATION3Submit Documentation FeedbackPACKAGING INFORMATIONOrderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)RI-I15-112B-02OBSOLETERFIDNTFGTBDCall TICall TI(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free 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电子元器件应用、检测与筛选技术PPT

19
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20
(6)
MTTF
如何理解MTBF/MTTF ?
每天工作三班的工厂如果要求24小时连续运转、无故障率P(t)＝99%以上，则机床的MTBF 必须大于4500小时。 MTBF=5000小时对由不同数量的数控机床构成的生产线要求就更高了
ZZZ版权所有，请勿复制传播
可靠性
规定条件
规定时间
规定功能
能力
气候环境（温度、湿度、气压、盐雾等）
机械环境（振动、冲击、离心、碰撞等）
电应力环境（电压、电流、电场等）
电磁环境（磁场、电磁波辐射等）
广义（小时、公里、次数、字符数等。）
产品功能及其性能指标
7
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8
主要内容
电子元器件应用、检测与筛选技术
中国赛宝实验室 2011年 6月 20日
第一篇元器件的可靠性参数 2. 集成电路的主要失效模式与预防第二篇、电子元器件的选用 3. 阻容元件的主要失效模式与预防
1. 元器件质量保证的有关标准 2.可靠性表征方式与质量等级 3.元器件的质量等级 4.元器件的选用 5.进口半导体器件质量的鉴别方法 6. DPA试验 4. 继电器的主要失效模式与预防 5. 其他元器件的主要失效模式与预防
(5) MTBF
n
对于可维修产品而言，平均寿命指的是产品两次相邻故障间的平均工作时间，称为平均故障间隔时间MTBF(Mean time between failure)，数学表达式：＇＇
MTBF = ∫ R (t )dt
0
∞
T1
F1

低能电子衍射LEED

A B
低能衍射实验方法
球栅各网按要求加电压
样品安装及清洁衍射斑强度的测量
C
3 低能衍射实验方法
A 球栅各网按要求加电压
栅网2、3上加一与入射电子能量相近的减速电压在荧光屏上加5-7kV高压
3 低能衍射实验方法
B 样品安装及清洁
X射线定出晶面取向进入真空室之前机械抛光和化学腐蚀
首先用150-500eV的氩离子轰击进入系统之后其次在具有横向周期性结构的表面。
其二
低能电子衍射所能分析的仅是很薄的表面层。
低能衍射实验方法球栅各网按要求加电压样品安装及清洁衍射斑强度的测量低能衍射实验方法栅网23上加一与入射电子能量相近的减速电压在荧光屏上加57kv高压低能衍射实验方法进入真空室之前x射线定出晶面取向机械抛光和化学腐蚀进入系统之后首先用150500ev的氩离子轰击其次在晶体表面加以高温烘烤并通入少量氧气
3 低能衍射实验方法
C 衍射斑强度的测量
Ep e
e C
外圆筒(接地）
内圆筒
导出线接微
电流放大
接收器：法拉第圆筒
低能衍射在表面结构分析中的应用
低能电子衍射在表面分析中的主要应用为分析表面的结构，以研究表面形成的机理，表面性质与表面结构的关系，表面的吸附特点，吸附原子的空间位置，表面结构与表面态的关系等。
电子束中的入射电子只能进入表面几个原子层的深度。随着能量降低，透入深度也减小，从LEED得到的信息是晶体的表面结构，因此LEED是研究单晶表面层原子排列的一种有效方法。低能电子衍射的原理与X-射线衍射相似，不同的是X-射线传入固体的深度较深，一般在微米量级，因此所求的结构是穿入深度内的平均值，属于体内结构。
Low Energy Electron Diffraction

IR2161被美国电子产品杂志社评为2004年度优胜产品

IR2161被美国电子产品杂志社评为2004年度优胜产品
佚名
【期刊名称】《电子元器件应用》
【年(卷),期】2005(007)004
【摘要】2005年1月美国加里福尼亚ELSEGUNDO讯，国际整流器(IR)公司生
产的照明控制集成电路——IR2161型卤灯电子变压器专用智能半桥驱动器被美国《电子产品》杂志社(位于纽约州公园市)评为2004年度优胜产品，优胜产品名单
刊登在《电子产品》杂志2005年1月刊上。

该杂志社依照各种产品在技术、应用、设计、价格和性能等方面的重大进展每年评选一次优胜产品。

【总页数】1页(P10)
【正文语种】中文
【中图分类】TN06
【相关文献】
1.关于荣获"2004-2005年度上海市塑料管道产品质量诚信优胜企业"的公告 [J],
2.《森林防火》杂志社被评为2004～2006年度全国森林防火先进单位 [J],
3.安捷伦高性能示波器被《电子产品》杂志命名为2004年度产品 [J], 李雅晨
4.Agilent高性能示波器被“电子产品”杂志命名为2004年度产品 [J],
5.Agilent高性能示波器被“电子产品”杂志命名为2004年度产品——以13GHz 带宽实时示波器和探头系统领跑业界 [J],
因版权原因，仅展示原文概要，查看原文内容请购买。

温度补偿的30nACMOS电流源及在LDO中的应用_王忆

文章编号 : 0253 - 4177( 2006) 09 - 1657 - 06
1
引言
L DO( low dr opout) 线性稳压器由于具有低噪声、低功耗、结构简单及封装尺寸较小的优点, 在便携式电子产品中作为电源转换电路得到了广泛的应用. 便携式电子产品要求功耗低且电池续航时间长 . 这对电源的转换效率提出了更高的要求 . L DO 的电源转换效率定义为[ 1] : I oV o G= @ 100% ( 1) ( I o + I q) V I 其中 I o 是输出电流; V o 为输出电压 ; I q 为静态工作电流 ; V I 为输入电压 . 要提高效率, 必须降低静态电流 I q 和输入输出压差 V D ropout . 一般设计中, 静态电流的典型值为 40 ~ 100 LA, 压差为 200 ~ [ 2] 400m V , 其中基准电流值一般为 1 LA 左右 . 图 1 是 LDO 的基本结构图. 从图中可以发现, 参考电流源为误差放大器提供了偏置电流, 是决定 LDO 静态功耗的主要因素. 另外 , 由于便携式电子产品功能的增加, 要求 L DO 输出电流增大 , 因此, 芯片的耐高温特性也成为芯片设计的关键问题. 在本文中为了达到 L DO 低功耗的目的, 采用亚阈值设计方法, 首次设计了 30nA 的 CMOS 高精度参考电流源. 从而将 L DO 芯片的静态电流降低为 4LA, 并且利用 M OS 管寄生二极管反向电流的高温特性 , 对各支路的镜像电流进行温度补偿 , 得到在- 40~ 130 e 范围内稳定的基准电流 . 芯片的仿真与测试结果验证了本文的设计方法 .
图2
经典的与电源电压无关的偏置电流电路

使用无损耗过零点检测功能提高智能家居和智能建筑(HBA)应用中的AC输入开关效率和可靠性

使用无损耗过零点检测功能提高智能家居和智能建筑(HBA)应用中的AC输入开关效率和可靠性
Adnaan Lokhandwala
【期刊名称】《世界电子元器件》
【年(卷),期】2021()11
【摘要】在越来越多的应用中,对导通和关断AC输入电源的器件的性能进行优化是一个重要考虑因素,这些应用包括智能家居/智能建筑(HBA)、支持物联网(IoT)的家电、智能开关和插头、调光器和人体感应传感器,特别适用于采用继电器或可控硅进行功率控制的设计。

当AC电源异步导通或关断而不考虑其所处的电压时,效率和可靠性会受到不利影响,必须添加电路以保护开关免受高瞬态电流的影响。

【总页数】3页(P28-30)
【作者】Adnaan Lokhandwala
【作者单位】Power Integrations
【正文语种】中文
【中图分类】TU855
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2.现场可编程门阵列在开关磁阻电机无传感器位置检测中的应用
3.使用"夹心TTC染色法"可显著提高脑缺血模型中梗死灶的检测效率
4.ADI公司新的CDC使用先进的检测技术以提高手持消费
类电子产品中触摸控制的精度和可靠性5.使用C6/36细胞培养结合RT-PCR方法来提高IgM阳性血清样本中DEN-1病毒的检测效率
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微电子器件应用中的几个重要问题

微电子器件应用中的几个重要问题
李志鑫
【期刊名称】《电子元器件应用》
【年(卷),期】2000(002)006
【摘要】本文报道了半导体分立器件和集成电路应用尤其是航天型号产品应用中暴露出的若干重要问题，剖析了这些问题的成因，提出了相应的对策，供生产厂家和用户参考．
【总页数】3页(P1-2,6)
【作者】李志鑫
【作者单位】西安微电子技术研究所
【正文语种】中文
【中图分类】TN4
【相关文献】
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3.我国《陆地国界法》制定和实施中的几个重要问题 [J], 周卫国
4.信息组织中的主题标引及其在机读目录中的几个重要问题 [J], 隆新雯
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