SN74BCT245DWRG4中文资料

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MC74LCX245DWR2中文资料

MC74LCX245Low−Voltage CMOS Octal TransceiverWith 5 V−Tolerant Inputs and Outputs (3−State, Inverting)The MC74LCX245 is a high performance, non−inverting octal transceiver operating from a 2.3 to 3.6 V supply. High impedance TTL compatible inputs significantly reduce current loading to input drivers while TTL compatible outputs offer improved switching noise performance. A V I specification of 5.5 V allows MC74LCX245 inputs to be safely driven from 5 V devices. The MC74LCX245 is suitable for memory address driving and all TTL level bus oriented transceiver applications.Current drive capability is 24 mA at both A and B ports. The Transmit/Receive (T/R) input determines the direction of data flow through the bi−directional transceiver. Transmit (active−HIGH) enables data from A ports to B ports; Receive (active−LOW) enables data from B to A ports. The Output Enable input, when HIGH, disables both A and B ports by placing them in a HIGH Z condition. Features•Designed for 2.3 to 3.6 V V CC Operation•5 V Tolerant − Interface Capability With 5 V TTL Logic •Supports Live Insertion and Withdrawal•I OFF Specification Guarantees High Impedance When V CC = 0 V •LVTTL Compatible•LVCMOS Compatible•24 mA Balanced Output Sink and Source Capability•Near Zero Static Supply Current in All Three Logic States (10 m A) Substantially Reduces System Power Requirements •Latchup Performance Exceeds 500 mA•ESD Performance:Human Body Model >2000 VMachine Model >200 V•Pb−Free Packages are Available**For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.See detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet.ORDERING INFORMATIONB0OE 19T/R 1A0B1A1B2A2B3A3B4A4B5A5B6A6B7A7Figure 1. Pinout (Top View)192018171615142134567V CC 1381291110OE B0B1B2B3B4B5B6B7T/RA0A1A2A3A4A5A6A7GNDH = High Voltage Level L = Low Voltage Level Z = High Impedance StateX = High or Low Voltage Level and Transitions are Acceptable For I CC reasons, Do Not Float InputsFigure 2. Logic DiagramMAXIMUM RATINGSvalues (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.1.I O absolute maximum rating must be observed.RECOMMENDED OPERATING CONDITIONSORDERING INFORMATIONSpecifications Brochure, BRD8011/D.*This package is inherently Pb−Free.DC ELECTRICAL CHARACTERISTICSIAC CHARACTERISTICS t R = t F = 2.5 ns; R L = 500 WThe specification applies to any outputs switching in the same direction, either HIGH−to−LOW (t OSHL) or LOW−to−HIGH (t OSLH); parameter guaranteed by design.DYNAMIC SWITCHING CHARACTERISTICSmeasured in the LOW state.CAPACITIVE CHARACTERISTICSWAVEFORM 1 − PROPAGATION DELAYS t R = t F = 2.5 ns, 10% to 90%; f = 1 MHz; t W = 500 ns V CC0 VV OHV OLAn, BnWAVEFORM 2 − OUTPUT ENABLE AND DISABLE TIMESt R = t F = 2.5 ns, 10% to 90%; f = 1 MHz; t W = 500 ns0 V Figure 3. AC WaveformsV OH V HZV OLV CCV LZ Symbol V CC3.3 V ±0.3 V2.7 V 2.5 V ±0.2 VVmi 1.5 V 1.5 V V CC /2Vmo 1.5 V 1.5 V V CC /2V HZ V OL + 0.3 V V OL + 0.3 V V OL + 0.15 V V LZV OH − 0.3 VV OH − 0.3 VV OH − 015 VBn, AnOPENV6 V GNDC L = 50 pF at V CC = 3.3 0.3 V or equivalent (includes jig and probe capacitance)C L = 30 pF at V CC = 2.5 0.2 V or equivalent (includes jig and probe capacitance)R L = R 1 = 500 W or equivalentR T = Z OUT of pulse generator (typically 50 W )Figure 4. Test CircuitPACKAGE DIMENSIONSSOIC−20DW SUFFIX CASE 751D−05ISSUE GTSSOP−20DT SUFFIX CASE 948E−02ISSUE BDIM A MIN MAX MIN MAX INCHES 6.600.260MILLIMETERS B 4.30 4.500.1690.177C 1.200.047D 0.050.150.0020.006F 0.500.750.0200.030G 0.65 BSC 0.026 BSC H 0.270.370.0110.015J 0.090.200.0040.008J10.090.160.0040.006K 0.190.300.0070.012K10.190.250.0070.010L 6.40 BSC 0.252 BSCM0 8 0 8 ____1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.2.CONTROLLING DIMENSION:MILLIMETER.3.DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE.4.DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION.INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.5.DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08(0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION.6.TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY .7.DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−.6.400.252−−−−−−PACKAGE DIMENSIONSSOEIAJ−20M SUFFIX CASE 967−01ISSUE ODIM MIN MAX MIN MAX INCHES−−− 2.05−−−0.081MILLIMETERS 0.050.200.0020.0080.350.500.0140.0200.180.270.0070.01112.3512.800.4860.5045.10 5.450.2010.2151.27 BSC 0.050 BSC 7.408.200.2910.3230.500.850.0200.0331.10 1.500.0430.0590 0.700.900.0280.035−−−0.81−−−0.032A 1H E Q 1L E _10 _0 _10 _NOTES:1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.2.CONTROLLING DIMENSION: MILLIMETER.3.DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH ORPROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)PER SIDE.4.TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY.5.THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003)TOTAL IN EXCESS OF THE LEAD WIDTHDIMENSION AT MAXIMUM MATERIAL CONDITION.DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACEBETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018).A b c D E e L M ZON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further noticeto any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.PUBLICATION ORDERING INFORMATION。

74lvc245中文说明

74LV245是低压硅栅CMOS器件，与74HC245和74HCT245针脚和功能兼容。

74LV245是八位元收发器，在发送和接收方向上都具有非反相3态总线兼容输出。

发送/接收(DIR)输入控制方向，而输出使能(OE)输入则可实现轻松级联。

针脚OE控制输出，因此总线可以得到有效隔离。

特性和优势
•宽工作电压范围：1.0 V至5.5 V
•最适合低压应用：1.0 V至3.6 V
•接受介于VCC = 2.7 V和VCC = 3.6 V之间的TTL输入电平
•VCC = 3.3 V且T amb = 25 °C时的典型输出地弹：< 0.8 V
•VCC = 3.3 V且T amb = 25 °C时的典型高电平输出电压(VOH)欠冲：> 2 V •ESD保护：
o HBM JESD22-A114E超过2000 V
o MM JESD22-A115-A超过200 V
•多种封装选择
•额定温度范围为-40 °C至+85 °C和-40 °C至+125 °C
外形图
显示功能框图
真值表
INPUTS INPUTS/OUTPUT OE DIR An Bn
H=高电压L=低电压X=无输入、Z=高阻态。

SN74ACT245中文资料

元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 2000, Texas Instruments Incorporated。

SN74BCT240DW中文资料

SN7404DRG4中文资料

IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use anynon-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityLow Power /lpw Telephony /telephonyWirelessVideo&Imaging /videoWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments IncorporatedPACKAGING INFORMATIONOrderable Device Status (1)Package Type Package DrawingPins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)JM38510/00105BCA ACTIVE CDIP J 141TBD A42SNPB N /A for Pkg Type JM38510/00105BDA ACTIVE CFP W 141TBD A42N /A for Pkg Type JM38510/07003BCA ACTIVE CDIP J 141TBD A42SNPB N /A for Pkg Type JM38510/30003B2A ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg TypeJM38510/30003BCA ACTIVE CDIP J 141TBD A42SNPB N /A for Pkg Type JM38510/30003BDA ACTIVE CFP W 141TBD A42N /A for Pkg Type JM38510/30003SCA ACTIVE CDIP J 141TBD A42SNPB N /A for Pkg Type JM38510/30003SDAACTIVE CFP W 141TBD A42N /A for Pkg Type SN5404J ACTIVE CDIP J 141TBD A42SNPB N /A for Pkg Type SN54LS04J ACTIVE CDIP J 141TBD A42SNPB N /A for Pkg Type SN54S04J ACTIVE CDIP J 141TBD A42SNPB N /A for Pkg Type SN7404D ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN7404DE4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN7404DG4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN7404DR ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN7404DRE4ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN7404DRG4ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN7404N ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN7404N3OBSOLETE PDIP N 14TBD Call TI Call TISN7404NE4ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN7404NSR ACTIVE SO NS 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN7404NSRE4ACTIVE SO NS 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS04D ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS04DE4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS04DG4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS04DR ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS04DRE4ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS04DRG4ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS04J OBSOLETE CDIP J 14TBD Call TI Call TISN74LS04NACTIVEPDIPN1425Pb-Free (RoHS)CU NIPDAUN /A for Pkg Type23-Apr-2007Orderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)SN74LS04N3OBSOLETE PDIP N14TBD Call TI Call TISN74LS04NE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeSN74LS04NSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS04NSRG4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S04D ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S04DE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S04DG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S04DR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CUNIPDAU Level-1-260C-UNLIMSN74S04DRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S04DRG4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S04N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg Type SN74S04N3OBSOLETE PDIP N14TBD Call TI Call TISN74S04NE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeSN74S04NSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S04NSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SNJ5404J ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type SNJ5404W ACTIVE CFP W141TBD A42N/A for Pkg Type SNJ54LS04FK ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type SNJ54LS04J ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type SNJ54LS04W ACTIVE CFP W141TBD A42N/A for Pkg Type SNJ54S04FK ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type SNJ54S04J ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type SNJ54S04W ACTIVE CFP W141TBD A42N/A for Pkg Type (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and 23-Apr-2007package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annualbasis.23-Apr-2007TAPE AND REELINFORMATION30-Apr-2007DevicePackage Pins SiteReel Diameter (mm)Reel Width (mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN7404DR D 14MLA 33016 6.59.0 2.1816Q1SN7404NSR NS 14MLA 330168.210.5 2.51216Q1SN74LS04DR D 14MLA 33016 6.59.0 2.1816Q1SN74LS04NSR NS 14MLA330168.210.5 2.51216Q1SN74S04DR D 14MLA 33016 6.59.0 2.1816Q1SN74S04NSRNS14MLA330168.210.52.51216Q1TAPE AND REEL BOX INFORMATIONDevice PackagePins Site Length (mm)Width (mm)Height (mm)SN7404DR D 14MLA 333.2333.228.58SN7404NSR NS 14MLA 333.2333.228.58SN74LS04DR D 14MLA 333.2333.228.58SN74LS04NSR NS 14MLA 333.2333.228.58SN74S04DR D 14MLA 333.2333.228.58SN74S04NSRNS14MLA333.2333.228.5830-Apr-200730-Apr-2007IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use anynon-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityLow Power /lpw Telephony /telephonyWirelessVideo&Imaging /videoWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments Incorporated。

SN74LVC8T245DBQR中文资料

Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
VCCA VCCB
Supply voltage range
VI
Input voltage range(2)
VO
Voltage range applied to any output in the high-impedance or power-off state(2)
This 8-bit noninverting bus transceiver uses two separate configurable power-supply rails. The SN74LVC8T245 is optimized to operate with VCCA and VCCB set at 1.65 V to 5.5 V. The A port is designed to track VCCA. VCCA accepts any supply voltage from 1.65 V to 5.5 V. The B port is designed to track VCCB. VCCB accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation between any of the 1.8-V, 2.5-V, 3.3-V, and 5.5-V voltage nodes.
Isolation
(1) Input circuits of the data I/Os are always active.

SN74AS245DWRG4,SN74AS245NSRG4,SN74AS245DWG4, 规格书,Datasheet 资料

Addendum-Page 1PACKAGING INFORMATIONOrderable DeviceStatus(1)Package Type PackageDrawingPins Package QtyEco Plan(2)Lead/Ball Finish MSL Peak Temp (3)Samples (Requires Login)84030012A ACTIVE LCCC FK 201TBD Call TI Call TI 8403001RA ACTIVE CDIP J 201TBD Call TI Call TI 8403001SA ACTIVE CFP W 201TBD Call TI Call TISN54ALS245AJ ACTIVE CDIP J 201TBD A42N / A for Pkg Type SN54AS245J ACTIVE CDIP J 201TBDA42N / A for Pkg TypeSN74ALS245A-1DW ACTIVE SOIC DW 2025Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ALS245A-1DWE4ACTIVE SOIC DW 2025Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ALS245A-1DWG4ACTIVE SOIC DW 2025Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ALS245A-1DWR ACTIVE SOIC DW 202000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ALS245A-1DWRE4ACTIVE SOIC DW 202000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ALS245A-1DWRG4ACTIVE SOIC DW 202000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ALS245A-1N ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type SN74ALS245A-1NE4ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type SN74ALS245A-1NSR ACTIVE SO NS 202000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ALS245A-1NSRE4ACTIVE SO NS 202000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ALS245A-1NSRG4ACTIVE SO NS 202000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ALS245ADBLE OBSOLETE SSOP DB 20TBD Call TICall TISN74ALS245ADBR ACTIVE SSOP DB 202000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ALS245ADBRE4ACTIVE SSOP DB 202000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ALS245ADBRG4ACTIVESSOPDB202000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM芯天下--/Addendum-Page 2Orderable Device Status(1)Package Type PackageDrawingPins Package QtyEco Plan(2)Lead/Ball FinishMSL Peak Temp(3)Samples (Requires Login)SN74ALS245ADW ACTIVE SOIC DW 2025Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ALS245ADWG4ACTIVE SOIC DW 2025Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ALS245ADWR ACTIVE SOIC DW 202000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ALS245ADWRE4ACTIVE SOIC DW 202000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ALS245ADWRG4ACTIVE SOIC DW 202000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ALS245AN ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type SN74ALS245AN3OBSOLETE PDIP N 20TBD Call TICall TISN74ALS245ANE4ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type SN74ALS245ANSR ACTIVE SO NS 202000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ALS245ANSRE4ACTIVE SO NS 202000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ALS245ANSRG4ACTIVE SO NS 202000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AS245DW ACTIVE SOIC DW 2025Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AS245DWE4ACTIVE SOIC DW 2025Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AS245DWG4ACTIVE SOIC DW 2025Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AS245DWR ACTIVE SOIC DW 20Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AS245DWRE4ACTIVE SOIC DW 20Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AS245DWRG4ACTIVE SOIC DW 20Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AS245N ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type SN74AS245NE4ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type SN74AS245NSRACTIVESONS202000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM芯天下--/Addendum-Page 3Orderable Device Status(1)Package Type PackageDrawingPins Package QtyEco Plan(2)Lead/Ball FinishMSL Peak Temp(3)Samples (Requires Login)SN74AS245NSRE4ACTIVE SO NS 202000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AS245NSRG4ACTIVE SO NS 202000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SNJ54ALS245AFK ACTIVE LCCC FK 201TBD POST-PLATE N / A for Pkg TypeSNJ54ALS245AJ ACTIVE CDIP J 201TBD A42N / A for Pkg Type SNJ54ALS245AW ACTIVE CFP W 201TBD Call TI N / A for Pkg Type SNJ54AS245FK ACTIVE LCCC FK 201TBD POST-PLATE N / A for Pkg TypeSNJ54AS245JACTIVECDIPJ201TBDA42N / A for Pkg Type(1)The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.(2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check /productcontent for the latest availability information and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)(3)MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.OTHER QUALIFIED VERSIONS OF SN54ALS245A, SN54AS245, SN74ALS245A, SN74AS245 :芯天下--/•Catalog: SN74ALS245A, SN74AS245•Military: SN54ALS245A, SN54AS245NOTE: Qualified Version Definitions:•Catalog - TI's standard catalog product•Military - QML certified for Military and Defense ApplicationsAddendum-Page 4芯天下--/TAPE AND REEL INFORMATION*All dimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74ALS245A-1DWR SOIC DW 202000330.024.410.813.0 2.712.024.0Q1SN74ALS245A-1NSR SO NS 202000330.024.48.213.0 2.512.024.0Q1SN74ALS245ADBR SSOP DB 202000330.016.48.27.5 2.512.016.0Q1SN74ALS245ADWR SOIC DW 202000330.024.410.813.0 2.712.024.0Q1SN74ALS245ANSR SO NS 202000330.024.48.213.0 2.512.024.0Q1SN74AS245DWR SOIC DW 200330.024.410.813.0 2.712.024.0Q1SN74AS245NSRSONS202000330.024.48.213.02.512.024.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) SN74ALS245A-1DWR SOIC DW202000367.0367.045.0 SN74ALS245A-1NSR SO NS202000367.0367.045.0 SN74ALS245ADBR SSOP DB202000367.0367.038.0 SN74ALS245ADWR SOIC DW202000367.0367.045.0 SN74ALS245ANSR SO NS202000367.0367.045.0 SN74AS245DWR SOIC DW200367.0367.045.0SN74AS245NSR SO NS202000367.0367.045.0IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,enhancements,improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B.Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All semiconductor products(also referred to herein as“components”)are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale,in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by applicable law,testing of all parameters of each component is not necessarily performed.TI assumes no liability for applications assistance or the design of Buyers’products.Buyers are responsible for their products and applications using TI components.To minimize the risks associated with Buyers’products and applications,Buyers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any patent right,copyright,mask work right,or other intellectual property right relating to any combination,machine,or process in which TI components or services are rmation published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal,regulatory and safety-related requirements concerning its products,and any use of TI components in its applications,notwithstanding any applications-related information or support that may be provided by TI.Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures,monitor failures and their consequences,lessen the likelihood of failures that might cause harm and take appropriate remedial actions.Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.In some cases,TI components may be promoted specifically to facilitate safety-related applications.With such components,TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements.Nonetheless,such components are subject to these terms.No TI components are authorized for use in FDA Class III(or similar life-critical medical equipment)unless authorized officers of the parties have executed a special agreement specifically governing such use.Only those TI components which TI has specifically designated as military grade or“enhanced plastic”are designed and intended for use in military/aerospace applications or environments.Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk,and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI has specifically designated certain components which meet ISO/TS16949requirements,mainly for automotive ponents which have not been so designated are neither designed nor intended for automotive use;and TI will not be responsible for any failure of such components to meet such requirements.Products ApplicationsAudio /audio Automotive and Transportation /automotiveAmplifiers Communications and Telecom /communicationsData Converters Computers and Peripherals /computersDLP®Products Consumer Electronics /consumer-appsDSP Energy and Lighting /energyClocks and Timers /clocks Industrial /industrialInterface Medical /medicalLogic Security /securityPower Mgmt Space,Avionics and Defense /space-avionics-defense Microcontrollers Video and Imaging /videoRFID OMAP Mobile Processors /omap TI E2E Community Wireless Connectivity /wirelessconnectivityMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2012,Texas Instruments Incorporated芯天下--/。

74FCT245中文资料

8-Bit TransceiverCY54/74FCT245TSCCS018 - May 1994 - Revised February 2000Data sheet acquired from Cypress Semiconductor Corporation.Data sheet modiﬁed to remove devices not offered.Copyright © 2000, T exas Instruments IncorporatedFeatures•Function, pinout, and drive compatible with FCT, and F logic•FCT-D speed at 3.8 ns max. (Com’l),FCT-C speed at 4.1 ns max. (Com’l),FCT-A speed at 4.6 ns max. (Com’l)•Reduced V OH (typically = 3.3V) versions of equivalent FCT functions•Edge-rate control circuitry for signiﬁcantly improved noise characteristics •Power-off disable feature •ESD > 2000V•Matched rise and fall times•Fully compatible with TTL input and output logic levels •Extended commercial range of −40˚C to +85˚C •Sink current 64 mA (Com’l), 48 mA (Mil)Source current 32 mA (Com’l), 12 mA (Mil)Functional DescriptionThe FCT245T contains eight non-inverting bidirectional buff-ers with three-state outputs and is intended for bus oriented applications.For the FCT245T,current sinking capability is 64mA at the A and B ports.The Transmit/Receiver (T/R)input determines the direction of data ﬂow through bidirectional transceiver.Transmit (Active HIGH)enables data from A ports to B ports.The output enable (OE),when HIGH,disables both the A and B ports by putting them in a High Z condition.The outputs are designed with a power-off disable feature to allow for live insertion of boards.Function Table [1]OE T/R Operation L L B Data to Bus A L H A Data to Bus B HXHigh Z StateNote:1.H = HIGH Voltage Level. L = LOW Voltage Level. X = Don’t Care.Logic Block DiagramPin ConfigurationsA 0A 1A 2A 3A 4A 5A 6A 7OEB 0B 1B 2B 3B 4B 5B 6B 7T/R4891011127651516171832120131419A 6A 5A 3B 1B 4B 0B 7V CC GND B 3Top ViewA 2LCCT/R A 0A 1A 7B 5B 612345678910111216171819201314V CC 15Top ViewB 2A 4OEA 0A 1A 2A 3A 4A 5A 6A 7OEB 0B 1B 2B 3B 4B 5B 6B 7T/R GNDDIP/SOIC/QSOPMaximum Ratings[2,3](Above which the useful life may be impaired.For user guidelines, not tested.)Storage T emperature.....................................−65°C to +150°C Ambient T emperature withPower Applied..................................................−65°C to +135°C Supply Voltage to Ground Potential..................−0.5V to +7.0V DC Input Voltage.................................................−0.5V to +7.0V DC Output Voltage..............................................−0.5V to +7.0V DC Output Current (Maximum Sink Current/Pin).......120 mA Power Dissipation..........................................................0.5W Static Discharge Voltage............................................>2001V (per MIL-STD-883, Method 3015)Operating RangeRange RangeAmbientTemperature V CC Commercial DT0°C to +70°C5V± 5% Commercial T, AT, CT−40°C to +85°C5V± 5% Military[4]All−55°C to +125°C5V± 10%Electrical Characteristics Over the Operating RangeParameter Description Test Conditions Min.Typ.[5]Max.Unit V OH Output HIGH Voltage V CC=Min., I OH=−32 mA Com’l 2.0VV CC=Min., I OH=−15 mA Com’l 2.4 3.3VV CC=Min., I OH=−12 mA Mil 2.4 3.3V V OL Output LOW Voltage V CC=Min., I OL=64 mA Com’l0.30.55VV CC=Min., I OL=48mA Mil0.30.55V V IH Input HIGH Voltage 2.0V V IL Input LOW Voltage0.8V V H Hysteresis[6]All inputs0.2V V IK Input Clamp Diode Voltage V CC=Min., I IN=−18 mA−0.7−1.2V I I Input HIGH Current V CC=Max., V IN=V CC5µA I IH Input HIGH Current V CC=Max., V IN=2.7V±1µA I IL Input LOW Current V CC=Max., V IN=0.5V±1µA I OS Output Short Circuit Current[7]V CC=Max., V OUT=0.0V−60−120−225mA I OFF Power-Off Disable V CC=0V, V OUT=4.5V±1µACapacitance[6]Parameter Description Typ.[5]Max.UnitC IN Input Capacitance510pFC OUT Output Capacitance912pF Notes:2.Unless otherwise noted, these limits are over the operating free-air temperature range.3.Unused inputs must always be connected to an appropriate logic voltage level, preferably either V CC or ground.4.T A is the “instant on” case temperature.5.Typical values are at V CC=5.0V, T A=+25˚C ambient.6.This parameter is speciﬁed but not tested.7.Not more than one output should be shorted at a time.Duration of short should not exceed one second.The use of high-speed test apparatus and/or sampleand hold techniques are preferable in order to minimize internal chip heating and more accurately reﬂect operational values.Otherwise prolonged shorting ofa high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests.In any sequence of parametertests, I OS tests should be performed last.Power Supply CharacteristicsParameter DescriptionTest ConditionsTyp.[5]Max.Unit I CC Quiescent Power Supply Current V CC =Max., V IN ≤0.2V , V IN ≥V CC −0.2V 0.10.2mA ∆I CC Quiescent Power Supply Current (TTL inputs HIGH)V CC =Max., V IN =3.4V ,[8]f 1=0, Outputs Open0.5 2.0mA I CCDDynamic Power Supply Current [9]V CC =Max., One Input Toggling,50% Duty Cycle, Outputs Open,T/R or OE=GND andV IN ≤0.2V or V IN ≥V CC −0.2V0.060.12mA/MHzI CTotal Power Supply Current [10]V CC =Max.,50%Duty Cycle,Outputs Open,One Bit Toggling at f 1=10 MHz,T/R or OE=GND andV IN ≤0.2V or V IN ≥V CC −0.2V0.7 1.4mAV CC =Max.,50%Duty Cycle,Outputs Open,One Bit Toggling at f 1=10 MHz,T/R or OE=GND and V IN =3.4V or V IN =GND 1.2 3.4mAV CC =Max.,50%Duty Cycle,Outputs Open,Eight Bits Toggling at f 1=2.5 MHz,T/R or OE=GND andV IN ≤0.2V or V IN ≥V CC −0.2V1.32.6[11]mAV CC =Max.,50%Duty Cycle,Outputs Open,Eight Bits Toggling at f 1=2.5 MHz,T/R or OE=GND and V IN =3.4V or V IN =GND3.310.6[11]mANotes:8.Per TTL driven input (V IN =3.4V); all other inputs at V CC or GND.9.This parameter is not directly testable, but is derived for use in Total Power Supply calculations.10.I C=I QUIESCENT + I INPUTS + I DYNAMIC I C =I CC +∆I CC D H N T +I CCD (f 0/2 + f 1N 1)I CC =Quiescent Current with CMOS input levels∆I CC =Power Supply Current for a TTL HIGH input (V IN =3.4V)D H =Duty Cycle for TTL inputs HIGH N T =Number of TTL inputs at D HI CCD =Dynamic Current caused by an input transition pair (HLH or LHL)f 0=Clock frequency for registered devices, otherwise zero f 1=Input signal frequency N 1=Number of inputs changing at f 1All currents are in milliamps and all frequencies are in megahertz.11.Values for these conditions are examples of the I CC formula. These limits are speciﬁed but not tested.Document #: 38−00318−BSwitching Characteristics Over the Operating RangeParameter Description FCT245TFCT245ATUnit Fig.No.[13]MilitaryCommercial MilitaryCommercial Min.[12]Max.Min.[12]Max.Min.[12]Max.Min.[12]Max.t PLH t PHL Propagation Delay A to B or B to A 1.57.5 1.57.0 1.5 4.9 1.5 4.6ns 1, 3t PZH t PZL Output Enable Time OE or T/R to A or B 1.510.0 1.59.5 1.5 6.5 1.5 6.2ns 1, 7, 8t PHZ t PLZOutput Disable Time OE or T/R to A or B1.510.01.57.51.56.01.55.0ns1, 7, 8Switching Characteristics Over the Operating Range (continued)Parameter DescriptionFCT245CTFCT245DT Unit Fig.No.[13]MilitaryCommercial Commercial Min.[12]Max.Min.[12]Max.Min.[12]Max.t PLH t PHL Propagation Delay A to B or B to A 1.5 4.5 1.5 4.1 1.5 3.8ns 1, 3t PZH t PZL Output Enable Time OE or T/R to A or B 1.5 6.2 1.5 5.8 1.5 5.0ns 1, 7, 8t PHZ t PLZOutput Disable Time OE or T/R to A or B1.55.21.54.81.54.3ns1, 7, 8Ordering InformationSpeed (ns)Ordering CodePackage Name Package TypeOperating Range 3.8CY74FCT245DTQCT Q520-Lead (150-Mil) QSOP CommercialCY74FCT245DTSOC/SOCT S520-Lead (300-Mil) Molded SOIC 4.1CY74FCT245CTQCT Q520-Lead (150-Mil) QSOP Commercial CY74FCT245CTSOC/SOCT S520-Lead (300-Mil) Molded SOIC 4.5CY54FCT245CTDMB D620-Lead (300-Mil) CerDIP Military CY54FCT245CTLMB L6120-Square Leadless Chip Carrier 4.6CY74FCT245ATPC P520-Lead (300-Mil) Molded DIP Commercial CY74FCT245ATQCT Q520-Lead (150-Mil) QSOP CY74FCT245ATSOC/SOCTS520-Lead (300-Mil) Molded SOIC 4.9CY54FCT245ATDMB D620-Lead (300-Mil) CerDIP Military CY54FCT245ATLMB L6120-Square Leadless Chip Carrier 7.0CY74FCT245TQCT Q520-Lead (150-Mil) QSOP Commercial CY74FCT245TSOC/SOCT S520-Lead (300-Mil) Molded SOIC 7.5CY54FCT245TDMB D620-Lead (300-Mil) CerDIP Military CY54FCT245TLMBL6120-Square Leadless Chip CarrierNotes:12.Minimum limits are speciﬁed but not tested on Propagation Delays.13.See “Parameter Measurement Information” in the General Information section.Package Diagrams20-Lead (300-Mil)CerDIP D6MIL −STD −1835D −8 Config.A20-Pin Square Leadless Chip Carrier L61MIL −STD −1835 C −2A20-Lead (300-Mil)Molded DIP P5Package Diagrams (continued)20-Lead Quarter Size Outline Q520-Lead(300-Mil)Molded SOIC S5IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 2000, Texas Instruments Incorporated。

SN74LVCH245ADBR中文资料

FEATURESSN74LVCH245A...RGY PACKAGE(TOP VIEW)I RB G NC CSN54LVCH245A...J OR W PACKAGE SN74LVCH245A...DB, DGV, DW, NS,OR PW PACKAGE(TOP VIEW)1234567891020191817161514131211DIR A1A2A3A4A5A6A7A8GNDV CC OE B1B2B3B4B5B6B7B8SN54LVCH245A...FK PACKAGE(TOP VIEW)3212019910111213456781817161514B1B2B3B4B5A3A4A5A6A7A 2A 1D I RB 7B 6O EA 8G N DB 8VC CDESCRIPTION/ORDERING INFORMATIONSN54LVCH245A,SN74LVCH245A OCTAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTSSCES008O–JULY 1995–REVISED DECEMBER 2005•Operate From 1.65V to 3.6V •I off Supports Partial-Power-Down Mode Operation•Inputs Accept Voltages to 5.5V •Bus Hold on Data Inputs Eliminates the Need •Max t pd of 6.3ns at 3.3Vfor External Pullup/Pulldown Resistors•Typical V OLP (Output Ground Bounce)•Latch-Up Performance Exceeds 250mA Per <0.8V at V CC =3.3V,T A =25°CJESD 17•Typical V OHV (Output V OH Undershoot)•ESD Protection Exceeds JESD 22>2V at V CC =3.3V,T A =25°C–2000-V Human-Body Model (A114-A)•Support Mixed-Mode Signal Operation on All Ports (5-V Input/Output Voltage With –200-V Machine Model (A115-A)3.3-V V CC )The SN54LVCH245A octal bus transceiver is designed for 2.7-V to 3.6-V V CC operation,and the SN74LVCH245A octal bus transceiver is designed for 1.65-V to 3.6-V V CC operation.Inputs can be driven from either 3.3-V or 5-V devices.This feature allows the use of these devices as translators in a mixed 3.3-V/5-V system environment.These devices are designed for asynchronous communication between data buses.These devices transmit data from the A bus to the B bus or from the B bus to the A bus,depending on the logic level at the direction-control (DIR)input.The output-enable (OE)input can be used to disable the device so the buses are effectively isolated.These devices are fully specified for partial-power-down applications using I off .The I off circuitry disables the outputs,preventing damaging current backflow through the devices when they are powered down.To ensure the high-impedance state during power up or power down,OE should be tied to V CC through a pullup resistor;the minimum value of the resistor is determined by the current-sinking capability of the driver.Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic e of pullup or pulldown resistors with the bus-hold circuitry is not recommended.The bus-hold circuitry is part of the input circuit and is not disabled by OE or DIR.Please be aware that an important notice concerning availability,standard warranty,and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.GQN OR ZQN PACKAGE(TOP VIEW)1234A B C D ESN54LVCH245A,SN74LVCH245A OCTAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTSSCES008O–JULY 1995–REVISED DECEMBER 2005ORDERING INFORMATIONT APACKAGE (1)ORDERABLE PART NUMBER TOP-SIDE MARKING QFN –RGY Reel of 1000SN74LVCH245ARGYR LCH245A Tube of 25SN74LVCH245ADW SOIC –DW LVCH245A Reel of 2000SN74LVCH245ADWR SOP –NS Reel of 2000SN74LVCH245ANSR LVCH245A SSOP –DBReel of 2000SN74LVCH245ADBR LCH245A–40°C to 85°CTube of 70SN74LVCH245APW TSSOP –PW Reel of 2000SN74LVCH245APWR LCH245AReel of 250SN74LVCH245APWT TVSOP –DGV Reel of 2000SN74LVCH245ADGVR LCH245A VFBGA –GQNSN74LVCH245AGQNR Reel of 1000LCH245AVFBGA –ZQN (Pb-free)SN74LVCH245AZQNR CDIP –JTube of 20SNJ54LVCH245AJ SNJ54LVCH245AJ –55°C to 125°CCFP –W Tube of 85SNJ54LVCH245AW SNJ54LVCH245AW LCCC –FKTube of 55SNJ54LVCH245AFKSNJ54LVCH245AFK (1)Package drawings,standard packing quantities,thermal data,symbolization,and PCB design guidelines are available at /sc/package.TERMINAL ASSIGNMENTS1234A A1DIR V CC OE B A3B2A2B1C A5A4B4B3D A7B6A6B5EGNDA8B8B7FUNCTION TABLEINPUTS OPERATION OE DIR L L B data to A bus L H A data to B busHXIsolationDIROEA1B1To Seven Other ChannelsAbsolute Maximum Ratings (1)SN54LVCH245A,SN74LVCH245A OCTAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTSSCES008O–JULY 1995–REVISED DECEMBER 2005LOGIC DIAGRAM (POSITIVE LOGIC)over operating free-air temperature range (unless otherwise noted)MINMAX UNIT V CC Supply voltage range –0.5 6.5V V I Input voltage range (2)–0.5 6.5V V O Voltage range applied to any output in the high-impedance or power-off state (2)–0.5 6.5V V O Voltage range applied to any output in the high or low state (2)(3)–0.5V CC +0.5V I IK Input clamp current V I <0–50mA I OK Output clamp current V O <0–50mA I OContinuous output current±50mA Continuous current through V CC or GND±100mADB package (4)70DGV package (4)92DW package (4)58θJAPackage thermal impedanceGQN/ZQN package (4)78°C/W NS package (4)60PW package (4)83RGY package (5)37T stg Storage temperature range–65150°C (1)Stresses beyond those listed under "absolute maximum ratings"may cause permanent damage to the device.These are stress ratings only,and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions"is not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2)The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.(3)The value of V CC is provided in the recommended operating conditions table.(4)The package thermal impedance is calculated in accordance with JESD 51-7.(5)The package thermal impedance is calculated in accordance with JESD 51-5.Recommended Operating Conditions (1)SN54LVCH245A,SN74LVCH245A OCTAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTSSCES008O–JULY 1995–REVISED DECEMBER 2005SN54LVCH245A SN74LVCH245AUNIT MINMAX MIN MAX Operating2 3.61.65 3.6V CCSupply voltageVData retention only 1.51.5V CC =1.65V to 1.95V0.65×V CCV IHHigh-level input voltageV CC =2.3V to 2.7V 1.7VV CC =2.7V to 3.6V 22V CC =1.65V to 1.95V0.35×V CCV IL Low-level input voltage V CC =2.3V to 2.7V 0.7V V CC =2.7V to 3.6V0.80.8V I Input voltage 0 5.50 5.5V High or low state 0V CC 0V CC V OOutput voltageV 3-state 05.55.5V CC =1.65V–4V CC =2.3V –8I OHHigh-level output currentmA V CC =2.7V –12–12V CC =3V –24–24V CC =1.65V4V CC =2.3V 8I OLLow-level output currentmA V CC =2.7V 1212V CC =3V2424∆t/∆v Input transition rise or fall rate 1010ns/V T A Operating free-air temperature–55125–4085°C (1)All unused control inputs of the device must be held at V CC or GND to ensure proper device operation.Refer to the TI application report,Implications of Slow or Floating CMOS Inputs ,literature number SCBA004.Electrical CharacteristicsSN54LVCH245A,SN74LVCH245A OCTAL BUS TRANSCEIVERSWITH3-STATE OUTPUTS SCES008O–JULY1995–REVISED DECEMBER2005over recommended operating free-air temperature range(unless otherwise noted)SN54LVCH245A SN74LVCH245A PARAMETER TEST CONDITIONS V CC UNITMIN TYP(1)MAX MIN TYP(1)MAXV CC1.65V to3.6V–0.2I OH=–100µAV CC2.7V to3.6V–0.2I OH=–4mA 1.65V 1.2V OH VI OH=–8mA 2.3V 1.72.7V 2.2 2.2I OH=–12mA3V 2.4 2.4I OH=–24mA3V 2.2 2.21.65V to3.6V0.2I OL=100µA2.7V to3.6V0.2I OL=4mA 1.65V0.45V OL VI OL=8mA 2.3V0.7I OL=12mA 2.7V0.40.4I OL=24mA3V0.550.55I I Control inputs V I=0to5.5V 3.6V±5±5µAI off V I or V O=5.5V0±10µAV I=0.58V251.65VV I=1.07V–25V I=0.7V452.3VI I(hold)V I=1.7V–45µAV I=0.8V75753VV I=2V–75–75V I=0to3.6V(2) 3.6V±500±500I OZ(3)V O=0V or(V CC to5.5V) 2.3V to3.6V±15±5µAV I=V CC or GND1010I CC I O=0 3.6VµA3.6V≤V I≤5.5V(4)1010One input at V CC–0.6V,∆I CC 2.7V to3.6V500500µA Other inputs at V CC or GNDC i Control inputs V I=V CC or GND 3.3V4124pFC io A or B port V O=V CC or GND 3.3V 5.512 5.5pF(1)All typical values are at V CC=3.3V,T A=25°C.(2)This is the bus-hold maximum dynamic current required to switch the input from one state to another.(3)For the total leakage current in an I/O port,please consult the I I(hold)specification for the input voltage condition0V<V I<V CC,and theI OZ specification for the input voltage conditions V I=0V or V I=V CC to5.5V.The bus-hold current,at input voltage greater than V CC,isnegligible.(4)This applies in the disabled state only.Switching CharacteristicsSwitching CharacteristicsOperating CharacteristicsSN54LVCH245A,SN74LVCH245A OCTAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTSSCES008O–JULY 1995–REVISED DECEMBER 2005over recommended operating free-air temperature range (unless otherwise noted)(see Figure 1)SN54LVCH245AFROM TO V CC =3.3V PARAMETERV CC =2.7V UNIT(INPUT)(OUTPUT)±0.3V MIN MAXMIN MAXt pd A or B B or A 817ns t en OE A or B 9.518.5ns t disOEA or B8.517.5ns over recommended operating free-air temperature range (unless otherwise noted)(see Figure 1)SN74LVCH245AFROM TO V CC =1.8V V CC =2.5V V CC =3.3V PARAMETERV CC =2.7V UNIT(INPUT)(OUTPUT)±0.15V ±0.2V ±0.3V MINMAXMINMAXMINMAX MIN MAX t pd A or B B or A (1)(1)(1)(1)7.3 1.5 6.3ns t en OE A or B (1)(1)(1)(1)9.5 1.58.5ns t dis OEA or B(1)(1)(1)(1)8.51.77.5ns t sk(o)1ns(1)This information was not available at the time of publication.T A =25°CV CC =1.8VV CC =2.5VV CC =3.3VTEST PARAMETERUNIT CONDITIONS TYPTYPTYP Outputs enabled (1)(1)47Power dissipation capacitance C pd f =10MHzpFper transceiverOutputs disabled(1)(1)2(1)This information was not available at the time of publication.PARAMETER MEASUREMENT INFORMATIONFrom Output Under TestLOAD CIRCUITOpen Data InputTiming InputV I0 VV I0 V0 VInputVOLTAGE WAVEFORMS SETUP AND HOLD TIMESVOLTAGE WAVEFORMS PROPAGATION DELAY TIMESINVERTING AND NONINVERTING OUTPUTSVOLTAGE WAVEFORMS PULSE DURATIONV OHV OHV OLV OLV I0 V InputOutput Waveform 1S1 at V LOAD (see Note B)Output Waveform 2S1 at GND (see Note B)V OLV OH V LOAD /20 V≈0 VV IVOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLINGOutputOutputt PLH /t PHL t PLZ /t PZL t PHZ /t PZHOpen V LOAD GNDTEST S1NOTES: A.C L includes probe and jig capacitance.B.Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.C.All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z O = 50 Ω.D.The outputs are measured one at a time with, one transition per measurement.E.t PLZ and t PHZ are the same as t dis .F.t PZL and t PZH are the same as t en .G.t PLH and t PHL are the same as t pd .H.All parameters and waveforms are not applicable to all devices.Output Control V I1.8 V ± 0.15 V2.5 V ± 0.2 V2.7 V3.3 V ± 0.3 V1 k Ω500 Ω500 Ω500 ΩV CC R L 2 × V CC 2 × V CC 6 V 6 VV LOAD C L 30 pF 30 pF 50 pF 50 pF0.15 V 0.15 V 0.3 V 0.3 VV ∆V CC V CC 2.7 V 2.7 VV I V CC /2V CC /21.5 V 1.5 VV M t r /t f ≤2 ns ≤2 ns ≤2.5 ns ≤2.5 nsINPUTS SN54LVCH245A,SN74LVCH245A OCTAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTSSCES008O–JULY 1995–REVISED DECEMBER 2005Figure 1.Load Circuit and Voltage WaveformsPACKAGING INFORMATIONOrderableDevice Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)5962-9754301Q2A ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type 5962-9754301QRA ACTIVE CDIP J 201TBD A42SNPB N /A for Pkg Type 5962-9754301QSA ACTIVE CFP W 201TBD A42N /A for Pkg Type 5962-9754301V2A ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type5962-9754301VRA ACTIVE CDIP J 201TBD A42SNPB N /A for Pkg Type 5962-9754301VSA ACTIVE CFP W 201TBD A42N /A for Pkg Type SN74LVCH245ADBLE OBSOLETE SSOP DB 20TBDCall TI Call TISN74LVCH245ADBR ACTIVE SSOP DB 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVCH245ADBRE4ACTIVE SSOP DB 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVCH245ADBRG4ACTIVE SSOP DB 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVCH245ADGVR ACTIVE TVSOP DGV 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVCH245ADGVRE4ACTIVE TVSOP DGV 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVCH245ADGVRG4ACTIVE TVSOP DGV 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVCH245ADW ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVCH245ADWE4ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVCH245ADWG4ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVCH245ADWR ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVCH245ADWRE4ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVCH245ADWRG4ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVCH245AGQNRNRNDBGA MI CROSTA R JUNI ORGQN201000TBDSNPBLevel-1-240C-UNLIMSN74LVCH245ANSR ACTIVE SO NS 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVCH245ANSRE4ACTIVE SO NS 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVCH245ANSRG4ACTIVE SO NS 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVCH245APW ACTIVE TSSOP PW 2070Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVCH245APWE4ACTIVE TSSOP PW 2070Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVCH245APWG4ACTIVE TSSOP PW 2070Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVCH245APWLEOBSOLETETSSOPPW20TBDCall TICall TI3-Jan-2008Orderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)SN74LVCH245APWR ACTIVE TSSOP PW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVCH245APWRE4ACTIVE TSSOP PW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVCH245APWRG4ACTIVE TSSOP PW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVCH245APWT ACTIVE TSSOP PW20250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVCH245APWTE4ACTIVE TSSOP PW20250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVCH245APWTG4ACTIVE TSSOP PW20250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVCH245ARGYR ACTIVE QFN RGY201000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARSN74LVCH245ARGYRG4ACTIVE QFN RGY201000Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARSN74LVCH245AZQNR ACTIVE BGA MICROSTAR JUNIOR ZQN201000Green(RoHS&no Sb/Br)SNAGCU Level-1-260C-UNLIMSN74LVCH245AZXYR ACTIVE BGA MICROSTAR JUNIOR ZXY202500Green(RoHS&no Sb/Br)SNAGCU Level-1-260C-UNLIMSNJ54LVCH245AFK ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type SNJ54LVCH245AJ ACTIVE CDIP J201TBD A42SNPB N/A for Pkg Type SNJ54LVCH245AW ACTIVE CFP W201TBD A42N/A for Pkg Type(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part ina new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited 3-Jan-2008information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annualbasis.3-Jan-2008TAPE AND REEL BOXINFORMATIONDevicePackage Pins SiteReel Diameter (mm)Reel Width (mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74LVCH245ADBR DB 20SITE 41330168.27.5 2.51216Q1SN74LVCH245ADGVR DGV 20SITE 41330127.0 5.6 1.6812Q1SN74LVCH245ADWR DW 20SITE 413302410.813.0 2.71224Q1SN74LVCH245AGQNR GQN 20SITE 3233012 3.3 4.3 1.5812Q1SN74LVCH245AGQNR GQN 20SITE 6033012 3.3 4.3 1.6812Q1SN74LVCH245APWR PW 20SITE 4133016 6.957.1 1.6816Q1SN74LVCH245ARGYR RGY 20SITE 4118012 3.8 4.8 1.6812Q1SN74LVCH245AZQNR ZQN 20SITE 3233012 3.3 4.3 1.5812Q1SN74LVCH245AZQNR ZQN 20SITE 6033012 3.3 4.3 1.6812Q1SN74LVCH245AZXYRZXY20SITE 60330122.83.31.0412Q212-Jan-2008DevicePackage Pins Site Length (mm)Width (mm)Height (mm)SN74LVCH245ADBR DB 20SITE 41346.0346.033.0SN74LVCH245ADGVR DGV 20SITE 41346.0346.029.0SN74LVCH245ADWR DW 20SITE 41346.0346.041.0SN74LVCH245AGQNR GQN 20SITE 32346.0346.029.0SN74LVCH245AGQNR GQN 20SITE 60342.9338.120.64SN74LVCH245APWR PW 20SITE 41346.0346.033.0SN74LVCH245ARGYR RGY 20SITE 41190.5212.731.75SN74LVCH245AZQNR ZQN 20SITE 32346.0346.029.0SN74LVCH245AZQNR ZQN 20SITE 60342.9338.120.64SN74LVCH245AZXYRZXY20SITE 60342.9338.120.6412-Jan-2008IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product 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SN74LVTH245中文资料

SN74BCT2414DW;SN74BCT2414DWR;SN74BCT2414DWRE4;SN74BCT2414DWRG4;SN74BCT2414N;中文规格书,Datasheet资料

PACKAGING INFORMATIONOrderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)SN74BCT2414DW ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74BCT2414DWG4ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74BCT2414DWR ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74BCT2414DWRE4ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74BCT2414DWRG4ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74BCT2414N ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74BCT2414NE4ACTIVEPDIPN2020Pb-Free (RoHS)CU NIPDAUN /A for Pkg Type(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine(Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.PACKAGE OPTION ADDENDUM18-Sep-2008TAPE AND REEL INFORMATION*All dimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74BCT2414DWR SOICDW202000330.024.410.813.02.712.024.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm)SN74BCT2414DWR SOIC DW202000367.0367.045.0分销商库存信息:TISN74BCT2414DW SN74BCT2414DWR SN74BCT2414DWRE4 SN74BCT2414DWRG4SN74BCT2414N SN74BCT2414NE4 SN74BCT2414DWG4。

SN74BCT2244NSR,SN74BCT2244NSRE4,SN74BCT2244NSRG4,SN74BCT2244N,SN74BCT2244NE4, 规格书,Datasheet 资料

and bus-oriented receivers and transmitters.Together with the ’BCT2240 devices and SN74BCT2241, these devices provide the choice of selected combinations of inverting and noninverting outputs, symmetrical active-low output-enable (OE) inputs, and complementary OE and OE inputs. These devices feature high fan-out and improved fan-in.To ensure the high-impedance state during power up or power down, OE should be tied to V CC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.The outputs, which are designed to source or sink up to 12 mA, include 33-Ω series resistors to reduce overshoot and undershoot.ORDERING INFORMATIONT APACKAGE †ORDERABLE PART NUMBER TOP-SIDE MARKING PDIP − NTube SN74BCT2244N SN74BCT2244N C to 70SOIC DW Tube SN74BCT2244DW 0°C to 70°CSOIC − DW Tape and reel SN74BCT2244DWR BCT2244SOP − NS Tape and reel SN74BCT2244NSR BCT2244CDIP − JTube SNJ54BCT2244J SNJ54BCT2244J −55°C to 125°CCFP − W Tube SNJ54BCT2244W SNJ54BCT2244W LCCC − FKTubeSNJ54BCT2244FKSNJ54BCT2244FK†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at /sc/package.32120199101112134567818171615141Y12A41Y22A31Y31A22Y31A32Y21A4SN54BCT2244...FK PACKAGE(TOP VIEW)2Y 41A 11O E 1Y 42A 2O E2Y 1G N D 2A 1V C CCopyright © 2003, Texas Instruments IncorporatedPlease be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.PRODUCTION DATA information is current as of pub lication date.SN54BCT2244, SN74BCT2244OCTAL BUFFERS AND LINE/MOS DRIVERS WITH 3-STATE OUTPUTSSCBS017D − SEPTEMBER 1988 − REVISED MARCH 2003FUNCTION TABLE (each buffer)INPUTS OUTPUTOE A YL H H L L L HXZlogic diagram (positive logic)1A11A21A31A41Y12A12A22A32A42Y11Y21Y31Y42Y22Y32Y41OE2OESN54BCT2244, SN74BCT2244OCTAL BUFFERS AND LINE/MOS DRIVERSWITH 3-STATE OUTPUTSSCBS017D − SEPTEMBER 1988 − REVISED MARCH 2003schematic of Y outputsOutputV CCGNDabsolute maximum ratings over operating free-air temperature range (unless otherwise noted)†Supply voltage range, V CC −0.5 V to 7 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input voltage range, V I (see Note 1) −0.5 V to 7 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Voltage range applied to any output in the disabled or power-off state, V O −0.5 V to 5.5 V . . . . . . . . . . . . . . . . Voltage range applied to any output in the high state, V O −0.5 V to V CC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input clamp current, I IK −30 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Current into any output in the low state, I O 24 mA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package thermal impedance, θJA (see Note 2):DW package 58°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . N package 69°C/W . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . NS package 60°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Storage temperature range, T stg −65°C to 150°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . †Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, andfunctional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.NOTES: 1.The input and output voltage ratings may be exceeded if the input and output current ratings are observed.2.The package thermal impedance is calculated in accordance with JESD 51-7.recommended operating conditions(see Note 3)SN54BCT2244SN74BCT2244MINNOMMAX MIN NOMMAX UNIT V CC Supply voltage 4.555.54.555.5V V IH High-level input voltage 22V V IL Low-level input voltage 0.80.8V I IK Input clamp current −18−18mA I OH High-level output current −12−12mA I OL Low-level output current 1212mA T AOperating free-air temperature−5512570°CNOTE 3:All unused inputs of the device must be held at V CC or GND to ensure proper device operation. Refer to the TI application report,Implications of Slow or Floating CMOS Inputs , literature number SCBA004.SN54BCT2244, SN74BCT2244OCTAL BUFFERS AND LINE/MOS DRIVERS WITH 3-STATE OUTPUTSSCBS017D − SEPTEMBER 1988 − REVISED MARCH 2003electrical characteristics over recommended operating free-air temperature range (unless otherwise noted)TEST CONDITIONS SN54BCT2244SN74BCT2244PARAMETERTEST CONDITIONSMIN TYP †MAX MIN TYP †MAX UNIT V IK V CC = 4.5 V,I I = −18 mA −1.2−1.2V 45V I OH = −1 mA 2.4 2.4V OH V CC = 4.5 V I OH = −12 mA 22V 45V I OL = 1 mA 0.150.50.150.5V OL V CC = 4.5 V I OL = 12 mA 0.350.80.350.8V I I V CC = 5.5 V,V I = 7 V 0.10.1mA I IH V CC = 5.5 V,V I = 2.7 V 2020μA I IL V CC = 5.5 V,V I = 0.5 V −1−1mA I OZH V CC = 5.5 V,V O = 2.7 V 5050μA I OZL V CC = 5.5 V,V O = 0.5 V −50−50μA I OS ‡V CC = 5.5 V,V O = 0−100−225−100−225mA I CCH V CC = 5.5 V,Outputs open 23372337mA I CCL V CC = 5.5 V,Outputs open 53775377mA I CCZ V CC = 5.5 V,Outputs open 6.5106.510mA C i V CC = 5 V,V I = 2.5 V or 0.5 V 66pF C oV CC = 5 V,V O = 2.5 V or 0.5 V1111pF†All typical values are at V CC = 5 V, T A = 25°C.‡Not more than one output should be tested at a time, and the duration of the test should not exceed one second.switching characteristics over recommended ranges of supply voltage and operating free-air temperature, C L = 50 pF (unless otherwise noted) (see Figure 1)FROM TO V CC = 5 V,T A = 25°C SN54BCT2244SN74BCT2244PARAMETER(INPUT)(OUTPUT)MIN TYP MAX MIN MAX MIN MAX UNITt PLH 0.53 4.40.5 5.20.5 4.9t PHL A Y 1.6 4.6 6.3 1.67.1 1.6 6.7ns t PZH 2.4 6.17.7 2.49.1 2.48.7t PZL OE Y 3.97.69.4 3.910.8 3.910.4ns t PHZ 1.7 5.2 6.9 1.78.1 1.77.8t PLZOEY2.86.58.32.810.92.89.8ns PARAMETER MEASUREMENT INFORMATIONSN54BCT2244, SN74BCT2244OCTAL BUFFERS AND LINE/MOS DRIVERSWITH 3-STATE OUTPUTSSCBS017D − SEPTEMBER 1988 − REVISED MARCH 2003NOTES: A.C L includes probe and jig capacitance.B.All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, t r = t f ≤ 2.5 ns, duty cycle = 50%.C.Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.D.The outputs are measured one at a time with one transition per measurement.E.When measuring propagation delay times of 3-state outputs, switch S1 is open.F.All parameters and waveforms are not applicable to all devices.From Output Under TestTest PointLOAD CIRCUIT FOR TOTEM-POLE OUTPUTSLOAD CIRCUIT FOR3-STATE AND OPEN-COLLECTOR OUTPUTS7 V (t PZL , t PLZ , O.C.)From Output Under TestTest PointL = R1 = R21.5 V1.5 V1.5 V3 V3 V0 V0 Vt ht suVOLTAGE WAVEFORMS SETUP AND HOLD TIMESTiming Input (see Note B)Data Input(see Note B)3 V3 V0 V0 VHigh-LevelPulse(see Note B)Low-LevelPulseVOLTAGE WAVEFORMS PULSE DURATIONt PHLt PLHt PLHt PHLInput(see Note B)Out-of-PhaseOutput (see Note D)1.5 V1.5 V1.5 V1.5 V1.5 V1.5 V3 V0 V V OLV OHV OHV OLIn-Phase Output (see Note D)VOLTAGE WAVEFORMSPROPAGATION DELAY TIMES (see Note D)t PHZt PLZ0.3 V t PZLt PZH1.5 V1.5 V1.5 V 1.5 V3 V0 VOutput Control(low-level enable)Waveform 1(see Notes C and D)Waveform 2(see Notes C and D)0 VV OHV OL 3.5 V 0.3 VVOLTAGE WAVEFORMSENABLE AND DISABLE TIMES, 3-STATE OUTPUTSFigure 1. Load Circuit and Voltage WaveformsAddendum-Page 1PACKAGING INFORMATIONOrderable Device Status(1)Package Type PackageDrawingPins Package QtyEco Plan(2)Lead/Ball Finish MSL Peak Temp (3)Samples (Requires Login)5962-9074101M2A ACTIVE LCCC FK 201TBD Call TI Call TI 5962-9074101MRA ACTIVE CDIP J 201TBD Call TI Call TI 5962-9074101MSA ACTIVE CFP W 201TBDCall TICall TISN74BCT2244DW ACTIVE SOIC DW 2025Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74BCT2244DWE4ACTIVE SOIC DW 2025Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74BCT2244DWG4ACTIVE SOIC DW 2025Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74BCT2244DWR ACTIVE SOIC DW 202000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74BCT2244DWRE4ACTIVE SOIC DW 202000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74BCT2244DWRG4ACTIVE SOIC DW 202000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74BCT2244N ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type SN74BCT2244NE4ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type SN74BCT2244NSR ACTIVE SO NS 202000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74BCT2244NSRE4ACTIVE SO NS 202000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74BCT2244NSRG4ACTIVE SO NS 202000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SNJ54BCT2244FK ACTIVE LCCC FK 201TBD POST-PLATE N / A for Pkg TypeSNJ54BCT2244J ACTIVE CDIP J 201TBD A42N / A for Pkg Type SNJ54BCT2244WACTIVECFPW201TBDCall TIN / A for Pkg Type(1)The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.芯天下--/(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check /productcontent for the latest availability information and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.OTHER QUALIFIED VERSIONS OF SN54BCT2244, SN74BCT2244 :•Catalog: SN74BCT2244•Military: SN54BCT2244NOTE: Qualified Version Definitions:•Catalog - TI's standard catalog product•Military - QML certified for Military and Defense ApplicationsAddendum-Page 2芯天下--/TAPE AND REEL INFORMATION*All dimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74BCT2244DWR SOIC DW 202000330.024.410.813.0 2.712.024.0Q1SN74BCT2244NSRSONS202000330.024.48.213.02.512.024.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) SN74BCT2244DWR SOIC DW202000367.0367.045.0SN74BCT2244NSR SO NS202000367.0367.045.0IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,enhancements,improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B.Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All semiconductor products(also referred to herein as“components”)are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale,in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by applicable law,testing of all parameters of each component is not necessarily performed.TI assumes no liability for applications assistance or the design of Buyers’products.Buyers are responsible for their products and applications using TI components.To minimize the risks associated with Buyers’products and applications,Buyers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any patent right,copyright,mask work right,or other intellectual property right relating to any combination,machine,or process in which TI components or services are rmation published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal,regulatory and safety-related requirements concerning its products,and any use of TI components in its applications,notwithstanding any applications-related information or support that may be provided by TI.Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures,monitor failures and their consequences,lessen the likelihood of failures that might cause harm and take appropriate remedial actions.Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.In some cases,TI components may be promoted specifically to facilitate safety-related applications.With such components,TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements.Nonetheless,such components are subject to these terms.No TI components are authorized for use in FDA Class III(or similar life-critical medical equipment)unless authorized officers of the parties have executed a special agreement specifically governing such use.Only those TI components which TI has specifically designated as military grade or“enhanced plastic”are designed and intended for use in military/aerospace applications or environments.Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk,and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI has specifically designated certain components which meet ISO/TS16949requirements,mainly for automotive ponents which have not been so designated are neither designed nor intended for automotive use;and TI will not be responsible for any failure of such components to meet such requirements.Products ApplicationsAudio /audio Automotive and Transportation /automotiveAmplifiers Communications and Telecom /communicationsData Converters Computers and Peripherals /computersDLP®Products Consumer Electronics /consumer-appsDSP Energy and Lighting /energyClocks and Timers /clocks Industrial /industrialInterface Medical /medicalLogic Security /securityPower Mgmt Space,Avionics and Defense /space-avionics-defense Microcontrollers Video and Imaging /videoRFID OMAP Mobile Processors /omap TI E2E Community Wireless Connectivity /wirelessconnectivityMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2012,Texas Instruments Incorporated。

74xx245中文资料

74
Vcc＝最大
VI=5.5V VI=7V
Vcc＝最大，VIH=2.7V
IIL输入低电平电流
Vcc＝最大，VIL=0.4V
IOS输出短路电流 IOZH输出高阻态时高
电平电流 IOZL输出高阻态时低
电平电流
Icc 电源电流
Vcc＝最大
Vcc＝最大，VIH=2V VIL=最大，VO=2.7V Vcc＝最大，VIH=2V,VIL＝最大
5
5.5
4.75
5
5.25
2
0.7 0.8 -12 -15
12 24
单位 V V V mA mA
参
数
tPLH输出由低到高传输延迟时间 tPHL输出由高到低传输延迟时间 tPZH输出由高阻态到高允许时间 tPZL输出由高阻态到低允许时间 tPHZ输出由高到高阻态禁止时间 tPLZ输出由低到高阻态禁止时间
54/74245
双向总线发送器/接收器(3S)
简要说明: 245 为三态输出的八组总线收发器,其主要电器特性的典型值如下(不同厂家
具体值有差别):
型号
tPLH
54LS245/74LS245
8ns
tphl
PD
8ns
275mW
引出端符号: A B /G DIR
逻辑图:
A 总线端 B 总线端三态允许端(低电平有效) 方向控制端
测试条件
Vcc =5V CL=45pF RL=667 Ω
Vcc=5V CL=5pF RL=90 Ω
静态特性（TA 为工作环境温度范围）
LS245 最大
12 12 40 40 25 25
单位
ns ns ns ns ns nsቤተ መጻሕፍቲ ባይዱ

SN74LVT245BPWR中文资料

PACKAGING INFORMATIONOrderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)SN74LVT245BDBLE OBSOLETE SSOP DB 20TBDCall TI Call TISN74LVT245BDBR ACTIVE SSOP DB 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVT245BDBRE4ACTIVE SSOPDB 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVT245BDW ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVT245BDWE4ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVT245BDWG4ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVT245BDWR ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVT245BDWRE4ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVT245BDWRG4ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVT245BGQNRACTIVEBGA MI CROSTA R JUNI ORGQN201000TBDSNPBLevel-1-240C-UNLIMSN74LVT245BNSR ACTIVE SO NS 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVT245BNSRE4ACTIVE SO NS 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVT245BPW ACTIVE TSSOP PW 2070Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVT245BPWE4ACTIVE TSSOP PW 2070Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVT245BPWLE OBSOLETE TSSOP PW 20TBDCall TI Call TISN74LVT245BPWR ACTIVE TSSOP PW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVT245BPWRE4ACTIVE TSSOP PW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVT245BPWRG4ACTIVE TSSOP PW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVT245BRGYR ACTIVE QFN RGY 201000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR SN74LVT245BRGYRG4ACTIVE QFN RGY 201000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR SN74LVT245BZQNRACTIVEBGA MI CROSTA R JUNI ORZQN201000Green (RoHS &no Sb/Br)SNAGCULevel-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.6-Dec-2006OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annualbasis.6-Dec-2006IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetwork Microcontrollers Security /securityLow Power Wireless /lpw Telephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2006, Texas Instruments Incorporated。

SN74LVC245AN中文资料

FEATURESDESCRIPTION/ORDERING INFORMATION1234567891020191817161514131211DIRA1A2A3A4A5A6A7A8GNDV CCOEB1B2B3B4B5B6B7B8DB, DGV, DW, N, NS, OR PW PACKAGE(TOP VIEW)RGY PACKAGE(TOP VIEW)IRBGNCCSN74LVC245AOCTAL BUS TRANSCEIVERWITH3-STATE OUTPUTS SCAS218T–JANUARY1993–REVISED FEBRUARY2005•Operates From1.65V to3.6V•Inputs Accept Voltages to5.5V•Max t pd of6.3ns at3.3V•Typical V OLP(Output Ground Bounce)<0.8V at V CC=3.3V,T A=25°C•Typical V OHV(Output V OH Undershoot)>2V at V CC=3.3V,T A=25°C•I off Supports Partial-Power-Down ModeOperation•Supports Mixed-Mode Signal Operation on AllPorts(5-V Input/Output Voltage With3.3-V V CC)•Latch-Up Performance Exceeds250mA PerJESD17•ESD Protection Exceeds JESD22–2000-V Human-Body Model(A114-A)–1000-V Charged-Device Model(C101)This octal bus transceiver is designed for1.65-V to3.6-V V CC operation.The SN74LVC245A is designed for asynchronouscommunication between data buses.The devicetransmits data from the A bus to the B bus or fromthe B bus to the A bus,depending on the logic levelat the direction-control(DIR)input.The output-enable(OE)input can be used to disable the device so thebuses effectively are isolated.ORDERING INFORMATIONT A PACKAGE(1)ORDERABLE PART NUMBER TOP-SIDE MARKING PDIP–N Tube of20SN74LVC245AN SN74LVC245ANQFN–RGY Reel of1000SN74LVC245ARGYR LC245ATube of25SN74LVC245ADWSOIC–DW LVC245AReel of2000SN74LVC245ADWRSOP–NS Reel of2000SN74LVC245ANSR LVC245ASSOP–DB Reel of2000SN74LVC245ADBR LC245A–40°C to85°CTube of70SN74LVC245APWTSSOP–PW Reel of2000SN74LVC245APWR LC245AReel of250SN74LVC245APWTTVSOP–DGV Reel of2000SN74LVC245ADGVR LC245AVFBGA–GQN SN74LVC245AGQNRReel of1000LC245AVFBGA–ZQN(Pb-Free)SN74LVC245AZQNR(1)Package drawings,standard packing quantities,thermal data,symbolization,and PCB design guidelines are available at/sc/package.Please be aware that an important notice concerning availability,standard warranty,and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.DESCRIPTION/ORDERING INFORMATION (CONTINUED)GQN OR ZQN PACKAGE(TOP VIEW)1234A B C DEDIROEA1B1To Seven Other ChannelsPin numbers shown are for the DB, DGV, DW, N, NS, PW, and RGY packages.SN74LVC245AOCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTSSCAS218T–JANUARY 1993–REVISED FEBRUARY 2005To ensure the high-impedance state during power up or power down,OE should be tied to V CC through a pullup resistor;the minimum value of the resistor is determined by the current-sinking capability of the driver.Inputs can be driven from either 3.3-V or 5-V devices.This feature allows the use of this device as a translator in a mixed 3.3-V/5-V system environment.This device is fully specified for partial-power-down applications using I off .The I off circuitry disables the outputs,preventing damaging current backflow through the device when it is powered down.TERMINAL ASSIGNMENTS1234A A1DIR V CC OE B A3B2A2B1C A5A4B4B3D A7B6A6B5EGNDA8B8B7FUNCTION TABLEINPUTS OPERATION OE DIR L L B data to A bus L H A data to B busHXIsolationLOGIC DIAGRAM (POSITIVE LOGIC)Absolute Maximum Ratings(1)SN74LVC245A OCTAL BUS TRANSCEIVERWITH3-STATE OUTPUTS SCAS218T–JANUARY1993–REVISED FEBRUARY2005over operating free-air temperature range(unless otherwise noted)MIN MAX UNIT V CC Supply voltage range–0.5 6.5VV I Input voltage range(2)–0.5 6.5VV O Voltage range applied to any output in the high-impedance or power-off state(2)–0.5 6.5VV O Voltage range applied to any output in the high or low state(2)(3)–0.5V CC+0.5VI IK Input clamp current V I<0–50mA I OK Output clamp current V O<0–50mA I O Continuous output current±50mAContinuous current through V CC or GND±100mADB package(4)70DGV package(4)92DW package(4)58GQN/ZQN package(4)78θJA Package thermal impedance°C/WN package(4)69NS package(4)60PW package(4)83RGY package(5)37T stg Storage temperature range–65150°C (1)Stresses beyond those listed under"absolute maximum ratings"may cause permanent damage to the device.These are stress ratingsonly,and functional operation of the device at these or any other conditions beyond those indicated under"recommended operating conditions"is not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2)The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.(3)The value of V CC is provided in the recommended operating conditions table.(4)The package thermal impedance is calculated in accordance with JESD51-7.(5)The package thermal impedance is calculated in accordance with JESD51-5.Recommended Operating Conditions (1)SN74LVC245AOCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTSSCAS218T–JANUARY 1993–REVISED FEBRUARY 2005T A =25°C –40°C TO 85°C UNIT MINMAX MIN MAX Operating1.65 3.61.65 3.6V CCSupply voltageVData retention only 1.51.5V CC =1.65V to 1.95V0.65×V CC0.65×V CCV IHHigh-level input voltageV CC =2.3V to 2.7V 1.7 1.7VV CC =2.7V to 3.6V 22V CC =1.65V to 1.95V0.35×V CC0.35×V CCV IL Low-level input voltage V CC =2.3V to 2.7V 0.70.7V V CC =2.7V to 3.6V0.80.8V I Input voltage 0 5.50 5.5V V OOutput voltage0V CC 0V CC V V CC =1.65V–4–4V CC =2.3V –8–8I OHHigh-level output currentmA V CC =2.7V –12–12V CC =3V –24–24V CC =1.65V44V CC =2.3V 88I OLLow-level output currentmA V CC =2.7V 1212V CC =3V2424∆t/∆v Input transition rise or fall rate1010ns/V (1)All unused inputs of the device must be held at V CC or GND to ensure proper device operation.Refer to the TI application report,Implications of Slow or Floating CMOS Inputs ,literature number SCBA004.Electrical Characteristics Switching CharacteristicsSN74LVC245A OCTAL BUS TRANSCEIVERWITH3-STATE OUTPUTS SCAS218T–JANUARY1993–REVISED FEBRUARY2005over recommended operating free-air temperature range(unless otherwise noted)T A=25°C–40°C TO85°C PARAMETER TEST CONDITIONS V CC UNITMIN TYP MAX MIN MAXI OH=–100µA 1.65V to3.6V V CC–0.2V CC–0.2I OH=–4mA 1.65V 1.29 1.2I OH=–8mA 2.3V 1.9 1.7V OH V2.7V 2.2 2.2I OH=–12mA3V 2.4 2.4I OH=–24mA3V 2.3 2.2I OL=100µA 1.65V to3.6V0.10.2I OL=4mA 1.65V0.240.45V OL I OL=8mA 2.3V0.30.7VI OL=12mA 2.7V0.40.4I OL=24mA3V0.550.55I I Control inputs V I=0to5.5V 3.6V±1±5µAI off V I or V O=5.5V0±1±10µAI OZ(1)V O=0to5.5V 3.6V±1±10µAV I=V CC or GND110I CC I O=0 3.6VµA3.6V≤V I≤5.5V(2)110One input at V CC–0.6V,∆I CC 2.7V to3.6V500500µA Other inputs at V CC or GNDC i Control inputs V I=V CC or GND 3.3V4pFC io A or B ports V I=V CC or GND 3.3V 5.5pF(1)For I/O ports,the parameter I OZ includes the input leakage current.(2)This applies in the disabled state only.over recommended operating free-air temperature range(unless otherwise noted)(see Figure1)T A=25°C–40°C TO85°CFROM TOPARAMETER V CC UNIT (INPUT)(OUTPUT)MIN TYP MAX MIN MAX1.8V±0.15V1612.2112.72.5V±0.2V13.97.818.3t pd A or B B or A ns2.7V1 4.27.117.33.3V±0.3V 1.5 3.8 6.1 1.5 6.31.8V±0.15V1714.8115.32.5V±0.2V1 4.510110.5t en OE A or B ns2.7V1 5.49.319.53.3V±0.3V 1.54.48.3 1.58.51.8V±0.15V17.816.51172.5V±0.2V14919.5t dis OE A or B ns2.7V1 4.48.318.53.3V±0.3V 1.74.17.3 1.77.5t sk(o) 3.3V±0.3V1nsOperating CharacteristicsSN74LVC245AOCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTSSCAS218T–JANUARY 1993–REVISED FEBRUARY 2005T A =25°CTEST PARAMETERV CC TYP UNITCONDITIONS1.8V 42Outputs enabled2.5V 433.3V 45C pdPower dissipation capacitance per transceiverf =10MHzpF 1.8V 1Outputs disabled2.5V 13.3V2PARAMETER MEASUREMENT INFORMATIONFrom Output Under TestLOAD CIRCUITOpen Data InputTiming InputV I0 VV I0 V0 VInputVOLTAGE WAVEFORMS SETUP AND HOLD TIMESVOLTAGE WAVEFORMS PROPAGATION DELAY TIMESINVERTING AND NONINVERTING OUTPUTSVOLTAGE WAVEFORMS PULSE DURATIONV OHV OHV OLV OLV I0 V InputOutput Waveform 1S1 at V LOAD (see Note B)Output Waveform 2S1 at GND (see Note B)V OLV OH V LOAD /20 V≈0 VV IVOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLINGOutputOutputt PLH /t PHL t PLZ /t PZL t PHZ /t PZHOpen V LOAD GNDTEST S1NOTES: A.C L includes probe and jig capacitance.B.Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.C.All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z O = 50 Ω.D.The outputs are measured one at a time, with one transition per measurement.E.t PLZ and t PHZ are the same as t dis .F.t PZL and t PZH are the same as t en .G.t PLH and t PHL are the same as t pd .H.All parameters and waveforms are not applicable to all devices.Output Control V I1.8 V ± 0.15 V2.5 V ± 0.2 V2.7 V3.3 V ± 0.3 V1 k Ω500 Ω500 Ω500 ΩV CC R L 2 × V CC 2 × V CC 6 V 6 VV LOAD C L 30 pF 30 pF 50 pF 50 pF0.15 V 0.15 V 0.3 V 0.3 VV ∆V CC V CC 2.7 V 2.7 VV I V CC /2V CC /21.5 V 1.5 VV M t r /t f ≤2 ns ≤2 ns ≤2.5 ns ≤2.5 nsINPUTS SN74LVC245AOCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTSSCAS218T–JANUARY 1993–REVISED FEBRUARY 2005Figure 1.Load Circuit and Voltage WaveformsPACKAGING INFORMATIONOrderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)SN74LVC245ADBLE OBSOLETE SSOP DB 20None Call TI Call TISN74LVC245ADBR ACTIVE SSOP DB 202000Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SN74LVC245ADGVR ACTIVE TVSOP DGV 202000Pb-Free (RoHS)CU NIPDAU Level-1-250C-UNLIM SN74LVC245ADW ACTIVE SOIC DW 2025Pb-Free (RoHS)CU NIPDAU Level-2-250C-1YEAR/Level-1-235C-UNLIM SN74LVC245ADWR ACTIVE SOIC DW 202000Pb-Free (RoHS)CU NIPDAU Level-2-250C-1YEAR/Level-1-235C-UNLIM SN74LVC245AGQNR ACTIVE VFBGA GQN 201000None SNPB Level-1-240C-UNLIM SN74LVC245AN ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU Level-NC-NC-NC SN74LVC245ANSR ACTIVE SO NS 202000Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SN74LVC245APW ACTIVE TSSOP PW 2070Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC245APWLE OBSOLETE TSSOP PW 20NoneCall TI Call TISN74LVC245APWR ACTIVE TSSOP PW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC245APWT ACTIVE TSSOP PW 20250Pb-Free (RoHS)CU NIPDAU Level-1-250C-UNLIM SN74LVC245ARGYR ACTIVE QFN RGY 201000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR SN74LVC245AZQNRACTIVEVFBGAZQN201000Pb-Free (RoHS)SNAGCULevel-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for newdesigns.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -May not be currently available -please check /productcontent for the latest availability information and additional product content details.None:Not yet available Lead (Pb-Free).Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green (RoHS &no Sb/Br):TI defines "Green"to mean "Pb-Free"and in addition,uses package materials that do not contain halogens,including bromine (Br)or antimony (Sb)above 0.1%of total product weight.(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.28-Feb-2005In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annualbasis.28-Feb-2005IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetwork Microcontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。

SN74LVC1T45DRLRG4中文资料

FEATURESV CCA V CCBBGNDADBV PACKAGE(TOP VIEW)DCK PACKAGE(TOP VIEW)V CCA V CCBBAV CCBDRL PACKAGE(TOP VIEW)See mechanical drawings for dimensions.DIRDIRYZP PACKAGE(BOTTOM VIEW)V CCAAV CCBBGND DIR DESCRIPTION/ORDERING INFORMATIONWITH CONFIGURABLE VOLTAGE TRANSLATION AND3-STATE OUTPUTSSCES515H–DECEMBER2003–REVISED JANUARY2007•Available in the Texas Instruments•Max Data RatesNanoFree™Package–420Mbps(3.3-V to5-V Translation)•Fully Configurable Dual-Rail Design Allows–210Mbps(Translate to3.3V) Each Port to Operate Over the Full1.65-V to–140Mbps(Translate to2.5V)5.5-V Power-Supply Range–75Mbps(Translate to1.8V)•V CC Isolation Feature–If Either V CC Input Is at•Latch-Up Performance Exceeds100mA Per GND,Both Ports Are in the High-ImpedanceJESD78,Class IIState•ESD Protection Exceeds JESD22•DIR Input Circuit Referenced to V CCA–2000-V Human-Body Model(A114-A)•Low Power Consumption,4-µA Max I CC–200-V Machine Model(A115-A)•±24-mA Output Drive at3.3V–1000-V Charged-Device Model(C101)•I off Supports Partial-Power-Down ModeOperationThis single-bit noninverting bus transceiver uses two separate configurable power-supply rails.The A port is designed to track V CCA.V CCA accepts any supply voltage from1.65V to5.5V.The B port is designed to track V CCB.V CCB accepts any supply voltage from1.65V to5.5V.This allows for universal low-voltage bidirectional translation between any of the1.8-V,2.5-V,3.3-V,and5-V voltage nodes.ORDERING INFORMATIONT A PACKAGE(1)ORDERABLE PART NUMBER TOP-SIDE MARKING(2)NanoFree™–WCSP(DSBGA)Reel of3000SN74LVC1T45YZPR___TA_0.23-mm Large Bump–YZP(Pb-free)Reel of3000SN74LVC1T45DBVRSOT(SOT-23)–DBV CT1_Reel of250SN74LVC1T45DBVT–40°C to85°CReel of3000SN74LVC1T45DCKRSOT(SC-70)–DCKReel of250SN74LVC1T45DCKT TA_SOT(SOT-533)–DRL Reel of4000SN74LVC1T45DRLR(1)Package drawings,standard packing quantities,thermal data,symbolization,and PCB design guidelines are available at/sc/package.(2)DBV/DCK/DRL:The actual top-side marking has one additional character that designates the assembly/test site.YZP:The actual top-side marking has three preceding characters to denote year,month,and sequence code,and one following character to designate the assembly/test site.Pin1identifier indicates solder-bump composition(1=SnPb,•=Pb-free).Please be aware that an important notice concerning availability,standard warranty,and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.NanoFree is a trademark of Texas Instruments.PRODUCTION DATA information is current as of publication date.Copyright©2003–2007,Texas Instruments Incorporated Products conform to specifications per the terms of the TexasInstruments standard warranty.Production processing does notnecessarily include testing of all parameters.DESCRIPTION/ORDERING INFORMATION (CONTINUED)BDIRAV CCA V CCBWITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTSSCES515H–DECEMBER 2003–REVISED JANUARY 2007The SN74LVC1T45is designed for asynchronous communication between two data buses.The logic levels of the direction-control (DIR)input activate either the B-port outputs or the A-port outputs.The device transmits data from the A bus to the B bus when the B-port outputs are activated and from the B bus to the A bus when the A-port outputs are activated.The input circuitry on both A and B ports always is active and must have a logic HIGH or LOW level applied to prevent excess I CC and I CCZ .The SN74LVC1T45is designed so that the DIR input is powered by V CCA .This device is fully specified for partial-power-down applications using I off .The I off circuitry disables the outputs,preventing damaging current backflow through the device when it is powered down.The V CC isolation feature ensures that if either V CC input is at GND,then both ports are in the high-impedance state.NanoFree™package technology is a major breakthrough in IC packaging concepts,using the die as the package.FUNCTION TABLE (1)INPUT OPERATION DIR L B data to A bus HA data toB bus(1)Input circuits of the data I/Os always are active.LOGIC DIAGRAM (POSITIVE LOGIC)2Submit Documentation FeedbackAbsolute Maximum Ratings (1)WITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTSSCES515H–DECEMBER 2003–REVISED JANUARY 2007over operating free-air temperature range (unless otherwise noted)MINMAX UNIT V CCA Supply voltage range –0.5 6.5V V CCB V I Input voltage range (2)–0.5 6.5V V O Voltage range applied to any output in the high-impedance or power-off state (2)–0.5 6.5V A port –0.5V CCA +0.5V O Voltage range applied to any output in the high or low state (2)(3)V B port –0.5V CCB +0.5I IK Input clamp current V I <0–50mA I OK Output clamp current V O <0–50mA I OContinuous output current±50mA Continuous current through V CC or GND±100mADBV package165DCK package 259θJAPackage thermal impedance (4)°C/W DRL package 142YZP package123T stg Storage temperature range–65150°C (1)Stresses beyond those listed under "absolute maximum ratings"may cause permanent damage to the device.These are stress ratings only,and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions"is not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2)The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.(3)The value of V CC is provided in the recommended operating conditions table.(4)The package thermal impedance is calculated in accordance with JESD 51-7.3Submit Documentation FeedbackRecommended Operating Conditions (1)(2)(3)WITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTSSCES515H–DECEMBER 2003–REVISED JANUARY 2007V CCIV CCOMIN MAX UNIT V CCA 1.65 5.5Supply voltageVV CCB1.655.51.65V to 1.95VV CCI ×0.652.3V to 2.7V 1.7High-level V IHData inputs (4)Vinput voltage3V to 3.6V 24.5V to5.5V V CCI ×0.71.65V to 1.95VV CCI ×0.352.3V to 2.7V 0.7Low-level V ILData inputs (4)V input voltage3V to 3.6V 0.84.5V to5.5V V CCI ×0.31.65V to 1.95VV CCA ×0.652.3V to 2.7V 1.7High-level DIRV IHVinput voltage(referenced to V CCA )(5)3V to 3.6V 24.5V to5.5V V CCA ×0.71.65V to 1.95VV CCA ×0.352.3V to 2.7V 0.7Low-level DIRV ILV input voltage (referenced to V CCA )(5)3V to 3.6V 0.84.5V to5.5VV CCA ×0.3V I Input voltage 0 5.5V V OOutput voltageV CCOV 1.65V to 1.95V–42.3V to 2.7V –8I OHHigh-level output currentmA 3V to 3.6V –244.5V to 5.5V –321.65V to 1.95V42.3V to 2.7V 8I OLLow-level output currentmA 3V to 3.6V 244.5V to 5.5V321.65V to 1.95V202.3V to 2.7V 20Data inputsInput transition ∆t/∆v3V to 3.6V 10ns/V rise or fall rate4.5V to5.5V5Control inputs1.65V to 5.5V5T A Operating free-air temperature–4085°C (1)V CCI is the V CC associated with the input port.(2)V CCO is the V CC associated with the output port.(3)All unused data inputs of the device must be held at V CCI or GND to ensure proper device operation.Refer to the TI application report,Implications of Slow or Floating CMOS Inputs ,literature number SCBA004.(4)For V CCI values not specified in the data sheet,V IH min =V CCI ×0.7V,V IL max =V CCI ×0.3V.(5)For V CCI values not specified in the data sheet,V IH min =V CCA ×0.7V,V IL max =V CCA ×0.3V.4Submit Documentation FeedbackElectrical Characteristics (1)(2)WITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTSSCES515H–DECEMBER 2003–REVISED JANUARY 2007over recommended operating free-air temperature range (unless otherwise noted)T A =25°C –40°C to 85°C PARAMETERTEST CONDITIONS V CCA V CCB UNITMINTYPMAXMIN MAXV CCO I OH =–100µA1.65V to 4.5V1.65V to 4.5V–0.1I OH =–4mA 1.65V 1.65V 1.2V OHV I =V IHVI OH =–8mA 2.3V 2.3V 1.9I OH =–24mA 3V 3V 2.4I OH =–32mA 4.5V 4.5V 3.8I OL =100µA 1.65V to 4.5V1.65V to 4.5V0.1I OL =4mA1.65V 1.65V 0.45V OLI OL =8mA V I =V IL 2.3V 2.3V 0.3V I OL =24mA 3V 3V 0.55I OL =32mA4.5V 4.5V 0.55I I DIR V I =V CCA or GND 1.65V to5.5V1.65V to 5.5V ±1±2µA A port 0V 0to 5.5V ±1±2I off V I or V O =0to 5.5V µA B port 0to 5.5V 0V ±1±2A or B I OZV O =V CCO or GND1.65V to 5.5V 1.65V to 5.5V ±1±2µA port1.65V to 5.5V1.65V to 5.5V3I CCAV I =V CCI or GND,I O =05.5V 0V 2µA 0V 5.5V -21.65V to 5.5V1.65V to 5.5V3I CCBV I =V CCI or GND,I O =05.5V 0V -2µA 0V5.5V 2I CCA +I CCB V I =V CCI or GND,I O =0 1.65V to 5.5V1.65V to 5.5V4µA (see Table 1)A port at V CCA –0.6V,A port50DIR at V CCA ,B port =open ∆I CCA3V to 5.5V3V to 5.5VµA DIR at V CCA –0.6V,DIRB port =open,50A port at V CCA or GNDB port at V CCB –0.6V,∆I CCB B port DIR at GND,3V to 5.5V 3V to 5.5V 50µA A port =openC i DIR V I =V CCA or GND 3.3V 3.3V 2.5pF A or B C io V O =V CCA/B or GND3.3V3.3V6pFport(1)V CCO is the V CC associated with the output port.(2)V CCI is the V CC associated with the input port.5Submit Documentation FeedbackSwitching CharacteristicsSwitching CharacteristicsWITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTSSCES515H–DECEMBER 2003–REVISED JANUARY 2007over recommended operating free-air temperature range,V CCA =1.8V ±0.15V (see Figure 1)V CCB =1.8V V CCB =2.5V V CCB =3.3V V CCB =5V FROM TO ±0.15V ±0.2V ±0.3V ±0.5V PARAMETERUNIT(INPUT)(OUTPUT)MIN MAX MIN MAX MIN MAX MIN MAX t PLH 317.7 2.210.3 1.78.3 1.47.2A B ns t PHL 2.814.3 2.28.5 1.87.1 1.77t PLH 317.7 2.316 2.115.5 1.915.1B A ns t PHL 2.814.3 2.112.9212.6 1.812.2t PHZ 5.219.4 4.818.5 4.718.4 5.117.1DIR A ns t PLZ 2.310.5 2.110.5 2.410.7 3.110.9t PHZ 7.421.9 4.911.5 4.610.3 2.88.2DIR B ns t PLZ 4.216 3.79.2 3.38.4 2.46.4t PZH (1)33.725.223.921.5DIR A ns t PZL (1)36.224.422.920.4t PZH (1)28.220.81918.1DIRBns t PZL (1)33.72725.524.1(1)The enable time is a calculated value,derived using the formula shown in the enable times section.over recommended operating free-air temperature range,V CCA =2.5V ±0.2V (see Figure 1)V CCB =1.8V V CCB =2.5V V CCB =3.3V V CCB =5V FROM TO ±0.15V ±0.2V ±0.3V ±0.5V PARAMETERUNIT(INPUT)(OUTPUT)MIN MAX MIN MAX MIN MAX MIN MAX t PLH 2.316 1.58.5 1.3 6.4 1.1 5.1A B ns t PHL 2.112.9 1.47.5 1.3 5.40.9 4.6t PLH 2.210.3 1.58.5 1.4817.5B A ns t PHL 2.28.5 1.47.5 1.370.9 6.2t PHZ 38.1 3.18.1 2.88.1 3.28.1DIR A ns t PLZ 1.3 5.9 1.3 5.9 1.3 5.91 5.8t PHZ 6.523.7 4.111.4 3.910.2 2.47.1DIR B ns t PLZ 3.918.9 3.29.6 2.88.4 1.85.3t PZH (1)29.218.116.412.8DIR A ns t PZL (1)32.218.917.213.3t PZH (1)21.914.412.310.9DIRBns t PZL (1)2115.613.512.7(1)The enable time is a calculated value,derived using the formula shown in the enable times section.6Submit Documentation FeedbackSwitching CharacteristicsSwitching CharacteristicsOperating CharacteristicsWITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTSSCES515H–DECEMBER 2003–REVISED JANUARY 2007over recommended operating free-air temperature range,V CCA =3.3V ±0.3V (see Figure 1)V CCB =1.8V V CCB =2.5V V CCB =3.3V V CCB =5V FROM TO ±0.15V ±0.2V ±0.3V ±0.5V PARAMETERUNIT(INPUT)(OUTPUT)MIN MAX MIN MAXMIN MAX MIN MAX t PLH 2.115.5 1.480.7 5.80.7 4.4A B ns t PHL 212.6 1.370.850.74t PLH 1.78.3 1.3 6.40.7 5.80.6 5.4B A ns t PHL 1.87.1 1.3 5.40.850.7 4.5t PHZ 2.97.337.3 2.87.3 3.47.3DIR A ns t PLZ 1.8 5.6 1.6 5.6 2.2 5.7 2.2 5.7t PHZ 5.420.5 3.910.1 2.98.8 2.4 6.8DIR B ns t PLZ 3.314.5 2.97.8 2.47.1 1.74.9t PZH (1)22.814.212.910.3DIR A ns t PZL (1)27.615.513.811.3t PZH (1)21.113.611.510.1DIRBns t PZL (1)19.914.312.311.3(1)The enable time is a calculated value,derived using the formula shown in the enable times section.over recommended operating free-air temperature range,V CCA =5V ±0.5V (see Figure 1)V CCB =1.8V V CCB =2.5V V CCB =3.3V V CCB =5V FROM TO ±0.15V ±0.2V ±0.3V ±0.5V PARAMETERUNIT(INPUT)(OUTPUT)MIN MAX MIN MAX MIN MAX MIN MAX t PLH 1.915.117.50.6 5.40.5 3.9A B ns t PHL 1.812.20.9 6.20.7 4.50.5 3.5t PLH 1.47.21 5.10.7 4.40.5 3.9B A ns t PHL 1.770.9 4.60.740.5 3.5t PHZ 2.1 5.4 2.2 5.4 2.2 5.5 2.2 5.4DIR A ns t PLZ 0.9 3.81 3.81 3.70.9 3.7t PHZ 4.820.2 2.59.818.5 2.5 6.5DIR B ns t PLZ 4.214.8 2.57.4 2.57 1.64.5t PZH (1)2212.511.48.4DIR A ns t PZL (1)27.214.412.510t PZH (1)18.911.39.17.6DIRBns t PZL (1)17.611.6108.6(1)The enable time is a calculated value,derived using the formula shown in the enable times section.T A =25°CV CCA =V CCA =V CCA =V CCA =TEST V CCB =1.8VV CCB =2.5VV CCB =3.3VV CCB =5VPARAMETERUNITCONDITIONS TYP TYP TYP TYP A-port input,B-port output C L =0pF,3444C pdA(1)f =10MHz,pF B-port input,A-port output 18192021t r =t f =1ns A-port input,B-port output C L =0pF,18192021C pdB (1)f =10MHz,pF B-port input,A-port output3444t r =t f =1ns(1)Power dissipation capacitance per transceiver7Submit Documentation FeedbackPower-Up ConsiderationsWITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTSSCES515H–DECEMBER 2003–REVISED JANUARY 2007A proper power-up sequence always should be followed to avoid excessive supply current,bus contention,oscillations,or other anomalies.To guard against such power-up problems,take the following precautions:1.Connect ground before any supply voltage is applied.2.Power up V CCA .3.V CCB can be ramped up along with or after V CCA .Table 1.Typical Total Static Power Consumption (I CCA +I CCB )V CCAV CCB UNIT0V 1.8V 2.5V 3.3V 5V 0V 0<1<1<1<11.8V <1<2<2<222.5V <1<2<2<2<2µA 3.3V <1<2<2<2<25V<12<2<2<28Submit Documentation FeedbackTYPICAL CHARACTERISTICSt P H L − n sC L − pF105101520253035t P L H− n s C L − pF5101520253035t P H L− n sC L − pF5101520253035t P L H − n sC L − pFWITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTSSCES515H–DECEMBER 2003–REVISED JANUARY 2007TYPICAL PROPAGATION DELAY (A to B)vs LOAD CAPACITANCET A =25°C,V CCA =1.8VTYPICAL PROPAGATION DELAY (B to A)vs LOAD CAPACITANCET A =25°C,V CCA =1.8V9Submit Documentation Feedback5101520253035t P H L − n sC L − pF5t P L H − n sC L − pFt P H L− n s C L − pF12345678910t P L H − n sC L − pFWITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTSSCES515H–DECEMBER 2003–REVISED JANUARY 2007TYPICAL CHARACTERISTICS (continued)TYPICAL PROPAGATION DELAY (A to B)vs LOAD CAPACITANCET A =25°C,V CCA =2.5VTYPICAL PROPAGATION DELAY (B to A)vs LOAD CAPACITANCET A =25°C,V CCA =2.5V10Submit Documentation Feedbackt P H L − n sC L − pFt P L H − n sC L − pFt P H L− n s C L − pFt P L H − n s C L − pFSN74LVC1T45SINGLE-BIT DUAL-SUPPLY BUS TRANSCEIVERWITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTSSCES515H–DECEMBER 2003–REVISED JANUARY 2007TYPICAL CHARACTERISTICS (continued)TYPICAL PROPAGATION DELAY (A to B)vs LOAD CAPACITANCET A =25°C,V CCA =3.3VTYPICAL PROPAGATION DELAY (B to A)vs LOAD CAPACITANCET A =25°C,V CCA =3.3Vt P H L− n s C L − pFt P L H − n s C L − pFt P H L − n sC L − pFt P L H − n sC L − pFSN74LVC1T45SINGLE-BIT DUAL-SUPPLY BUS TRANSCEIVERWITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTSSCES515H–DECEMBER 2003–REVISED JANUARY 2007TYPICAL CHARACTERISTICS (continued)TYPICAL PROPAGATION DELAY (A to B)vs LOAD CAPACITANCET A =25°C,V CCA =5VTYPICAL PROPAGATION DELAY (B to A)vs LOAD CAPACITANCET A =25°C,V CCA =5VPARAMETER MEASUREMENT INFORMATIONV OH V OLLOAD CIRCUIT × V CCOOpenOutput Control (low-level enabling)Output Waveform 1S1 at 2 × V CCO (see Note B)Output Waveform 2S1 at GND (see Note B)0 V0 VV CCI0 VV CCAV CCOVOLTAGE WAVEFORMS PROPAGATION DELAY TIMESVOLTAGE WAVEFORMS PULSE DURATIONVOLTAGE WAVEFORMS ENABLE AND DISABLE TIMESInputt pd t PLZ /t PZL t PHZ /t PZHOpen 2 × V CCO GNDTEST S1NOTES: A.C L includes probe and jig capacitance.B.Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.C.All input pulses are supplied by generators having the following characteristics: PRR v 10 MHz, Z O = 50 Ω, dv/dt ≥ 1 V/ns.D.The outputs are measured one at a time, with one transition per measurement.E.t PLZ and t PHZ are the same as t dis .F.t PZL and t PZH are the same as t en .G.t PLH and t PHL are the same as t pd .H.V CCI is the V CC associated with the input port.I.V CCO is the V CC associated with the output port.J.All parameters and waveforms are not applicable to all devices.1.8 V ± 0.15 V2.5 V ± 0.2 V3.3 V ± 0.3 V 5 V ± 0.5 V2 k Ω2 k Ω2 k Ω2 k ΩV CCO R L 0.15 V 0.15 V 0.3 V 0.3 VV TP C L 15 pF 15 pF 15 pF 15 pFSN74LVC1T45SINGLE-BIT DUAL-SUPPLY BUS TRANSCEIVERWITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTSSCES515H–DECEMBER 2003–REVISED JANUARY 2007Figure 1.Load Circuit and Voltage WaveformsAPPLICATION INFORMATIONSYSTEM-1SYSTEM-2SN74LVC1T45SINGLE-BIT DUAL-SUPPLY BUS TRANSCEIVERWITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTSSCES515H–DECEMBER 2003–REVISED JANUARY 2007Figure 2shows an example of the SN74LVC1T45being used in a unidirectional logic level-shifting application.PIN NAME FUNCTION DESCRIPTION1V CCA V CC1SYSTEM-1supply voltage (1.65V to 5.5V)2GND GND Device GND3A OUT Output level depends on V CC1voltage.4B IN Input threshold value depends on V CC2voltage.5DIR DIR GND (low level)determines B-port to A-port direction.6V CCBV CC2SYSTEM-2supply voltage (1.65V to 5.5V)Figure 2.Unidirectional Logic Level-Shifting ApplicationAPPLICATION INFORMATIONSYSTEM-1SYSTEM-2Enable TimesSN74LVC1T45SINGLE-BIT DUAL-SUPPLY BUS TRANSCEIVERWITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTSSCES515H–DECEMBER 2003–REVISED JANUARY 2007Figure 3shows the SN74LVC1T45being used in a bidirectional logic level-shifting application.Since the SN74LVC1T45does not have an output-enable (OE)pin,the system designer should take precautions to avoid bus contention between SYSTEM-1and SYSTEM-2when changing directions.The following table shows data transmission from SYSTEM-1to SYSTEM-2and then from SYSTEM-2to SYSTEM-1.STATE DIR CTRLI/O-1I/O-2DESCRIPTION1H Out In SYSTEM-1data to SYSTEM-2SYSTEM-2is getting ready to send data to SYSTEM-1.I/O-1and I/O-2are disabled.The 2H Hi-Z Hi-Z bus-line state depends on pullup or pulldown.(1)DIR bit is flipped.I/O-1and I/O-2still are disabled.The bus-line state depends on pullup or 3L Hi-Z Hi-Z pulldown.(1)4LOutInSYSTEM-2data to SYSTEM-1(1)SYSTEM-1and SYSTEM-2must use the same conditions,i.e.,both pullup or both pulldown.Figure 3.Bidirectional Logic Level-Shifting ApplicationCalculate the enable times for the SN74LVC1T45using the following formulas:•t PZH (DIR to A)=t PLZ (DIR to B)+t PLH (B to A)•t PZL (DIR to A)=t PHZ (DIR to B)+t PHL (B to A)•t PZH (DIR to B)=t PLZ (DIR to A)+t PLH (A to B)•t PZL (DIR to B)=t PHZ (DIR to A)+t PHL (A to B)In a bidirectional application,these enable times provide the maximum delay from the time the DIR bit is switched until an output is expected.For example,if the SN74LVC1T45initially is transmitting from A to B,then the DIR bit is switched;the B port of the device must be disabled before presenting it with an input.After the B port has been disabled,an input signal applied to it appears on the corresponding A port after the specified propagation delay.PACKAGING INFORMATIONOrderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)SN74LVC1T45DBVR ACTIVE SOT-23DBV 63000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC1T45DBVRE4ACTIVE SOT-23DBV 63000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC1T45DBVT ACTIVE SOT-23DBV 6250Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC1T45DBVTE4ACTIVE SOT-23DBV 6250Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC1T45DCKR ACTIVE SC70DCK 63000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC1T45DCKRE4ACTIVE SC70DCK 63000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC1T45DCKRG4ACTIVE SC70DCK 63000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC1T45DCKT ACTIVE SC70DCK 6250Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC1T45DCKTE4ACTIVE SC70DCK 6250Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC1T45DCKTG4ACTIVE SC70DCK 6250Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC1T45DRLR ACTIVE SOT-533DRL 64000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC1T45DRLRG4ACTIVE SOT-533DRL 64000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC1T45YZPRACTIVEWCSPYZP63000Green (RoHS &no Sb/Br)SNAGCULevel-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device isin production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on6-Feb-2007incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annualbasis.6-Feb-2007IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at 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Customers should obtain the latest relevant informationbefore placing orders and should verify that such information is current and complete. All products are soldsubject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are used to the extentTI deems necessary to support this warranty. Except where mandated by government requirements, testingof all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsiblefor their products and applications using TI components. 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SN74LVTZ244PWRG4,SN74LVTZ244DBRE4,SN74LVTZ244DBRG4,SN74LVTZ244DWE4, 规格书,Datasheet 资料

PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)SN74LVTZ244DBLE OBSOLETE SSOP DB20TBD Call TI Call TISN74LVTZ244DBR ACTIVE SSOP DB202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVTZ244DBRE4ACTIVE SSOP DB202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVTZ244DBRG4ACTIVE SSOP DB202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVTZ244DW ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVTZ244DWE4ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVTZ244DWG4ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVTZ244DWR ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVTZ244DWRE4ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVTZ244DWRG4ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVTZ244PWLE OBSOLETE TSSOP PW20TBD Call TI Call TISN74LVTZ244PWR ACTIVE TSSOP PW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVTZ244PWRE4ACTIVE TSSOP PW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVTZ244PWRG4ACTIVE TSSOP PW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to takereasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TIto Customer on an annual basis.TAPE AND REEL INFORMATION*All dimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74LVTZ244DBR SSOP DB 202000330.016.48.27.5 2.512.016.0Q1SN74LVTZ244DWR SOIC DW 202000330.024.410.813.0 2.712.024.0Q1SN74LVTZ244PWRTSSOPPW202000330.016.46.957.11.68.016.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) SN74LVTZ244DBR SSOP DB202000367.0367.038.0 SN74LVTZ244DWR SOIC DW202000367.0367.045.0SN74LVTZ244PWR TSSOP PW202000367.0367.038.0IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,enhancements,improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B.Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All semiconductor products(also referred to herein as“components”)are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale,in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by applicable law,testing of all parameters of each component is not necessarily performed.TI assumes no liability for applications assistance or the design of Buyers’products.Buyers are responsible for their products and applications using TI components.To minimize the risks associated with Buyers’products and applications,Buyers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any patent right,copyright,mask work right,or other intellectual property right relating to any combination,machine,or 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TI is not responsible or liable for any such statements.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal,regulatory and safety-related requirements concerning its products,and any use of TI components in its applications,notwithstanding any applications-related information or support that may be provided by TI.Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures,monitor failures and their consequences,lessen the likelihood of failures that might cause harm and take appropriate remedial actions.Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.In some cases,TI components may be promoted specifically to facilitate safety-related applications.With such components,TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements.Nonetheless,such components are subject to these terms.No TI components are authorized for use in FDA Class III(or similar life-critical medical equipment)unless authorized officers of the parties have executed a special agreement specifically governing such use.Only those TI components which TI has specifically designated as military grade or“enhanced plastic”are designed and intended for use in military/aerospace applications or environments.Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk,and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI has specifically designated certain components which meet ISO/TS16949requirements,mainly for automotive ponents which have not been so designated are neither designed nor intended for automotive use;and TI will not be responsible for any failure of such components to meet such requirements.Products ApplicationsAudio /audio Automotive and Transportation /automotiveAmplifiers Communications and Telecom /communicationsData Converters Computers and Peripherals /computersDLP®Products Consumer Electronics /consumer-appsDSP Energy and Lighting /energyClocks and Timers /clocks Industrial /industrialInterface Medical /medicalLogic Security /securityPower Mgmt Space,Avionics and Defense /space-avionics-defense Microcontrollers Video and Imaging /videoRFID OMAP Mobile Processors /omap TI E2E Community Wireless Connectivity /wirelessconnectivityMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2012,Texas Instruments Incorporated。

SN74LVC2T45DCTRE4中文资料

YEP OR YZP PACKAGE (BOTTOM VIEW)
D D
VCCA A1 A2 GND
1 2 3 4
8 7 6 5
VCCB B1 B2 DIR
GND A2 A1 VCCA
4 5 3 6 2 7 1 8
DIR B2 B1 VCCB
description/ordering information
元器件交易网
SN74LVC2T45 DUALĆBIT DUALĆSUPPLY BUS TRANSCEIVER WITH CONFIGURABLE VOLTAGE TRANSLATION AND 3ĆSTATE OUTPUTS
SCES516E − DECEMBER 2003 − REVISED MAY 2004
SN74LVC2T45 DUALĆBIT DUALĆSUPPLY BUS TRANSCEIVER WITH CONFIGURABLE VOLTAGE TRANSLATION AND 3ĆSTATE OUTPUTS
description/ordering information (continued)
The SN74LVC2T45 is designed so that the DIR input circuit is supplied by VCCA. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The VCC isolation feature ensures that if either VCC input is at GND, both ports are in the high-impedance state. NanoStar and NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package.