upgrading-flex3-to-flex4-techguide
Seagate GoFlex Desk 外接硬盘说明书
Perfect for when you need to:• S tore or back up photos, movies, music and documents • A ccess your files with both PC and Mac® computers Capacities500GB, 1TB, 2TB, 3TBProtect, store and access files through the interface of your choice with the world’s most versatile drive. The GoFlex™ Desk external drive delivers high-capacity storage and automatic, continuous backup with encryption for all your files with its pre-loaded software. The included plug-and-play USB 2.0 or USB 3.0 adapter makes it easy to connect to your PC or Mac® computer and it displays the drive’s available storage capacity. As the world’s most upgradable external desktop drive, you now have the ability to upgrade your connection interface to suit your needs. Plus, the option to place the drive vertically or horizontally complements any desktop.Access files with the interface of your choice.Available with the standard USB 2.0 interface or the USB 3.0 interface, or upgrade to the FireWire® 800 adapter. Free your files.With the included NTFS driver for Mac®, you can now interchangeably store and access files from PC and Mac computers without reformatting. The NTFS driver is simply installed once on your Mac computer, allowing it to access and store files in a PC compatible format*.SuperSpeed USB 3.0 for Faster PerformanceThe GoFlex Desk drive is available with a USB 3.0 interface that provides up to 10x faster data transfer rates compared to USB 2.0 interfaces. USB 3.0 is backward compatible with USB 2.0 interfaces so you have the flexibility to access files from any PC.* Reformatting to HFS+ required to use backup software for Mac or Time Machine® softwareHighlights• USB 2.0 or USB 3.0 Plug-and-play• Easy-to-use pre-loaded backup software with encryption• World’s most versatile external drive - upgrade to a faster interface with a GoFlex™ Desk desktop adapter• Includes GoFlex Desk USB 2.0 or USB 3.0 adapter with capacity gauge display• Offers both vertical and horizontal drive orientation• 2-year limited warranty© 2010 Seagate Technology LLC. All rights reserved. Seagate, Seagate Technology, the Wave logo, FreeAgent and GoFlex are trademarks or registered trademarks of Seagate Technology LLC or one of its affiliated companies in the United States and/or other countries. All other trademarks or registered trademarks are the property of their respective owners. When referring to drive capacity, one gigabyte, or GB, equals one billion bytes and one terabyte, or TB, equals one thousand billion bytes. Your computer’s operating system may use a different standard of measurement and report a lower capacity. In addition, some of the listed capacity is used for formatting and other functions and will not be available for data storage. The export or re-export of hardware or software containing encryption may be regulated by the U.S. Department of Commerce, Bureau of Industry and Security (for more information, visit ). Actual data rates may vary depending on operating environment and other factors. Seagate reserves the right to change, without notice, product offerings or specifications. DS1709.3 1009-AMERProduct Dimensions 6.22in L x 4.88in W x 1.73in D (158mm x 124mm x 44mm)Weight: 2.38lb (1.08kg)Retail Packaging SpecsBox dimensions: 7.87in L x 9.06in W x 3.54in D (200mm x 230mm x 90mm) Box weight: 2.93lb (1.33kg)Master carton dimensions: 14.96in L x 9.52in W x 8.58in D (372mm x 242mm x 218mm) Master carton weight: 12.44lb (5.66kg)Master carton quantity: 4Master cartons per pallet: 60Pallet dimensions: 43.93in L x 38.11in W x 47.76in D (1,116mm x 968mm x 1,213mm)Pallet weight: 785lb (356.80kg)Pallet layers: 5System Requirements• Windows ® 7, Windows Vista ®, Windows ® XP (32-bit & 64-bit) operating system or • O perating system Max OS X 10.4.6 Tiger or higher, 10.5 Leopard or 10.6 Snow Leopard (the 32-bit kernel). Reformatting for Mac may be required.• USB 2.0 portCompatibility may vary depending on user’s hardware configuration and operating systemInside the Box• GoFlex ™ Desk external drive• Backup and encryption software pre-loaded on drive • NTFS driver for Mac ® pre-loaded on drive*• GoFlex ™ Desk USB 2.0 or USB 3.0 adapter base with capacity gauge • Power supply•5-foot (150cm) USB 2.0 cable or 4-foot (120cm) USB 3.0 cable • Quick start guide• 2-year limited warranty。
特斯拉 Model S 用户指南说明书
Trigo Product CenterRelease Notes Fix pack 4.1.0.13aNote: Before using this information and the product it supports, read the information in “Notices”at the end of this document.10 June 2006This edition of this document applies to Trigo Product Center, version 4.1.0.13a, and to all subsequent releases and modifications until otherwise indicated in new editions.© Copyright International Business Machines Corporations 2006. All rights reserved. Licensed Materials-Property of IBM. US Government Users Restricted Rights – Use, duplication or disclosure restricted by GSA ADP Schedule Contract with IBM Corp.Table of Contents1. Overview (2)1.1 Fix pack requirements (2)2. Product fixes (2)2.1 Fixes for 4.1.0.13a (2)2.2 Fixes for 4.1.0.12a (2)2.3 Fixes for 4.1.0.11 (3)2.3.1Override with Blank feature disabled (3)2.4 Fixes for 4.1.0.10 (3)2.5 Fixes for 4.1.0.9 (3)2.6 Fixes for 4.1.0.8a (4)2.7 Fixes for 4.1.0.8 (4)2.8 Fixes for 4.1.0.7 (5)3. Known issues and limitations (5)4. Installation (5)4.1 Installation notes (5)4.1.1Removal of J2EE and JSSE (5)4.2 Preparation (7)4.2.1Stopping the whole application on the local machine (7)4.2.2Backup (7)4.2.3Delete Tomcat working directory (8)4.3 Apply Fix Pack (8)4.3.1Unpack tar file (8)4.3.2Verify configuration files (8)4.4 Test installation (9)4.4.1Start Trigo Product Center (9)4.4.2Check status (10)1. OverviewThis document addresses customer requests, installation instructions, and notes for Trigo Product Center Fix Pack 4.1.0.13a on the following platform:•Tomcat/Oracle1.1 Fix pack requirementsTrigo Product Center 4.1.0.7 must be installed prior to the application of Fix Pack 4.1.0.13a. Ifworking with a version prior to 4.1.0.7, it is required to upgrade to 4.1.0.7 first and then apply the4.1.0.13a Fix Pack.2. Product fixesThis section identifies issues that have been reported and resolved with the application of this fix pack.Note: The Tracking Number column uses APAR, PMR, and Internal CR record numbers.2.1 Fixes for 4.1.0.13aDescriptionTrackingNumberJR23783 Cannot import all items from a cvs file.2.2 Fixes for 4.1.0.12aDescriptionTrackingNumberJR22156 Cannot delete spec, even if not in useJR21730 Attribute Search choice should jump.Impact: No change in the UI. Grouped attributes are highlighted when searched forin tab view.JR22158 Empty paths displayed in left paneJR22547 Jobs failing after MTPing 4.1.0.10 in production2.3 Fixes for 4.1.0.11DescriptionTrackingNumberJR21938 Attribute not included in exportJR21924 Attribute order changing from sub-spec to secondary specJR21688 Inheritance path and source not displayedJR22037 Inheritance Rules lost when category tree is rolled backJR21470 Category search unsuccessful - if category name contains "+ "JR22213 IPG Performance comparisonJR22482 Can't override the inherited value through scripting2.3.1 Override with Blank feature disabledProblem: The change made in 4.1.0.9 was for attribute values to be trimmed before being saved.This change was made so that there is proper matching of attribute values (i.e. for lookup tables).However, a problem surfaces when blank spaces are used to override inheritance. The trim fixdisables the overriding feature.Solution: A simple fix will be made to keep the trim fix intact. Trimming is done only forattributes with non-blank characters. Meaning "A " and " A" will be trimmed to "A", but " " will remain as " ".2.4 Fixes for 4.1.0.10TrackingDescriptionNumber18654 Fixes & Optimization of duplicate sub spec script operationsNA Back port of custom export/import tool – Refer to "Export/Import User Guide" for additional information.2.5 Fixes for 4.1.0.9DescriptionTrackingNumberJR21056 Incorrect duplicate sub spec errorJR21036 Script parsing error (explicit final new line required)JR20850 getSpecNameList() does not work for SUB_SPEC parameter valueJR21055 getSpecNameList() returns all spec names for CATEGORY_TREE_SPEC parameter, instead of just the category tree specsJR20852 Get inheritance rule by attribute full path returns no resultJR20981 Lookup table keys don't get leading/trailing white space trimmedJR21123 Fix multi-occurrence ordering on importJR21061 Unexpected results when using the copy toolJR20610 Inheritance source goes to wrong placeJR21469 Issue with non-persistent attributes2.6 Fixes for 4.1.0.8aTrackingNumberDescriptionJR21238 Workflow scheduler stuck on productionDebug code has been added to catch and report certain Java exceptions that willbe thrown if corruptions of workflow static data occur in the database. Forexample, if rows are deleted from the db tables containing workflow static data,while collaboration area that references the workflow still has items movingthrough it. Data corruption should never occur of course; hence these particularJava exceptions should actually never occur.JR21206 Using getFullHTTPResponse(..) method to download zip files.2.7 Fixes for 4.1.0.8Tracking number Description01638Positional placement of new spec attributes.04359Rollback the changeover to the light Data Entry UI screens13524 Ordering of locale attributes is not consistent across specs when new locales are added to the system01114 Clicking on source of inheritance does not direct to the exact location of the attribute15080 Cannot add subspec attribute through spec association screen if Secondary spec or category spec has only single node.15584 View code not handling an invalid attribute properly15634 Extra line ${RM} ${TOP}/etc/tomcat33/webapps/trigo in start_appsvr.sh script removes tomcat working dir15743 Duplicate sub spec validation error preventing save of category entries13405 Redundant execution of queries15761 ItemEdit widget exception when trying to display inherited value2.8 Fixes for 4.1.0.7Refer to the release notes for maintenance releases 4.1.0.7-4.1.0.7c.3. Known issues and limitationsThe following table identifies known issues and limitations related to this release.JR22268 Inconsistent Attribute Values in system-default and user-defined views. Targeted to be addressed for 4.1.0.13JR21545 Issue with displaying inheritance rules. Debug code was implemented in 4.1.0.9 to better analyze the issue and to aid in providing a solution for a future Fix Pack.18633 When removing a subspec, an error occurs stating that a duplicate subspec has been added. The error should not occur as the subspec is removed.Workaround: Log out of WebSphere Product Center and log back in to clear the errormessage.4. InstallationThis section provides general guidelines to apply a Fix Pack to Trigo Product Center. Someinformation may differ depending on the methods used for previous installations. Contact your support representative for Trigo Product Center with any installation issues.4.1 Installation notesPreviously, it was necessary to perform a full installation for all files. The current installationprocess only updates the files that have changed to the current working version directory.4.1.1 Removal of J2EE and JSSECR: P12188Due to new company guidelines, J2EE and JSSE are no longer bundled as part of the Trigoinstallation file. This is not an issue for customers using WebSphere or WebLogic, only customers using Tomcat.J2EE - Java 2 Platform, Enterprise EditionJ2EE is a Trigo prerequisite with the use of Tomcat; therefore the J2EE JAR file, which is part of “Version 1.3.1 of the Java 2 SDK, Enterprise Edition ("J2EE" SDK)”, will need to be downloaded by the customer from the Sun Microsystems website (/j2ee/sdk_1.3/). Follow the instructions on the website to download and install the entire J2EE SDK.Note: The J2EE jar file is included in the J2EE SDK tar file.Figure 1 - Link to download J2EE SDK tar fileOnce this tar file is downloaded, it is extracted to a location defined by the customer.Since j2ee.jar is no longer included when a Trigo enterprise build is created and it is a prerequisite for Trigo Product Center, the following environment variable needs to be set to identify the location of the j2ee.jar file. The environment variable is defined in the init_trigo_vars.sh file.File to edit:$TOP/setup/init_trigo_vars.shEnvironment variable:J2EE_JAR=(location of j2ee.jar file including the file name)For Example:J2EE_JAR=/opt/j2sdkee1.3.1/lib/j2ee.jarNote: This step is not required for WebSphere or WebLogic.JSSE - Java Secure Socket ExtensionJSSE was being used to provide HTTPS post functionality. After careful review, it was determined that this functionality was not being used, therefore the functionality and the associated JAR file were removed.4.2 PreparationBefore attempting to apply the latest Fix Pack to Trigo Product Center, the following preparation is recommended:4.2.1 Stopping the whole application on the local machineComplete the following steps to stop the Trigo Product Center instance:1. Check the scheduler to make sure there are no critical jobs that need to be completed.If the queue is clear, kill the scheduler manually by running the script:$TOP/bin/go/stop/stop_scheduler.sh2. Abort the entire application by running the script:$TOP/bin/go/abort_local.shAll services running on the local machine are aborted. The RMI registry is aborted.Note: Check to make sure all processes have stopped using the 'ps' command.Kill any rogue "java" or "rmiregistry" processes that remain after shutting down the instance.Occasionally, it may take several attempts to kill all java processes.4.2.2 Backup•Create a full backup of the current Trigo Product Center directories before applying the Fix Pack. The Fix Pack will overwrite files that have changed. If any issues occur, thebackup will allow a rollback to a previous version•It is recommended to apply the Fix Pack to a test system to identify any issues before applying the Fix Pack to a production system•Perform a full backup of the database before applying the Fix Pack to a production system Note: Do not delete the old Trigo Product Center version until thorough testing of the new installation is completed.4.2.3 Delete Tomcat working directoryFor configurations using Tomcat, delete the Tomcat working directory using the followingcommand:rm -rf $TOP/etc/default/tomcat33/webapps/ccdOnce the working directory has been deleted, begin the application of the Fix Pack.4.3 Apply Fix PackTo apply the Fix Pack to Trigo Product Center, complete the following tasks:Unpack tar fileUpdate configuration filesTest installation4.3.1 Unpack tar filePurpose: To extract and update any new installation files into the current working directoryNote: GNU tar is needed to untar the Trigo Product Center files.1.Copy the Trigo Product Center tar file to the user or temporary directory.Example:{HOME_OF_TRIGO}/tarballs2. CD to $TOP, the current working directory, and unpack the tar file:Using GNU tar, the following command extracts and unzips the tar file:Example:Tar using an absolute path:tar zxvf /home/trigo/tarballs/trigo_4107a_05_fixpak_tom_ora.tgz 4.3.2 Verify configuration filesVerify all configuration files required by the new installation and make any updates as needed.Refer to the backup copy of the configuration files for the previous installation if needed.austin.propertiesadmin_properties.xmlinit_trigo_vars.shTrigo license fileaustin.propertiesOn startup, the system will use this file to read in all system level parameters. This fileincludes settings for the database layer (connection parameters), directory settings,default character sets, thread-pooling parameters, and other settings, which aredocumented in the file.File location: $TOP/etcadmin_properties.xmlThis file is used by the administrative utilities to configure clusters of the application.File location: $TOP/etcinit_trigo_vars.shThe initialization file is the shell script that initializes the shell variables used by thesystem.File location: $TOP/setupTrigo License FileThe license file contains the license keys needed to use the Trigo application.File location: $TOP/etc/runtime4.4 Test installation4.4.1 Start Trigo Product CenterTo start the Trigo Product Center, execute the following script:$TOP/bin/go/start_local.shThe script starts all the services required to run Trigo Product Center.Note: This process should take approximately 30-40 seconds, depending on the speed of the processor.4.4.2 Check statusRun the $TOP/bin/go/rmi_status.sh script that was provided by Trigo Product Center andverify the following services have started correctly.•admin_<machine name>•appsvr_<machine name>•eventprocessor•queuemanager•scheduler•workflowYOU HAVE SUCCESSFULLY APPLIED THE LATEST MAINTENACE RELEASE FOR TRIGO PRODUCT CENTER!NoticesIBM may not offer the products, services, or features discussed in this document in all countries. Consult your local IBM representative for information on the products and services currently available in your area. Any reference to an IBM product, program, or service is not intended to state or imply that only that IBM product, program, or service may be used. Any functionally equivalent product, program, or service that does not infringe any IBM intellectual property right may be used instead. However, it is the user’s responsibility to evaluate and verify the operation of any non-IBM product, program, or service.IBM may have patents or pending patent applications covering subject matter described in this document. The furnishing of this document does not give you any license to these patents. You can send license inquiries, in writing, to:IBM Director of LicensingIBM CorporationNorth Castle DriveArmonk, NY 10504-1785U.S.A.The following paragraph does not apply to the United Kingdom or any other country where such provisions are inconsistent with local law:INTERNATIONAL BUSINESS MACHINES CORPORATION PROVIDES THIS PUBLICATION “AS IS” WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF NON-INFRINGEMENT, MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. Some states do not allow disclaimer of express or implied warranties in certain transactions, therefore, this statement may not apply to you.This information could include technical inaccuracies or typographical errors. Changes are periodically made to the information herein; these changes will be incorporated in new editions of the publication. IBM may make improvements and/or changes in the product(s) and/or program(s) described in this publication at any time without notice.Any references in this information to non-IBM Web sites are provided for convenience only and do not in any manner serve as an endorsement of those Web sites. The materials at those Web sites are not part of the materials for this IBM product and use of those Web sites is at your own risk.IBM may use or distribute any of the information you supply in any way it believes appropriate without incurring any obligation to you.Licensees of this program who wish to have information about it for the purpose of enabling: (i) the exchange of information between independently created programs and other programs (including this one) and (ii) the mutual use of the information which has been exchanged, should contact:IBM Burlingame LaboratoryDirector IBM Burlingame Laboratory577 Airport Blvd., Suite 800Burlingame, CA 94010U.S.ASuch information may be available, subject to appropriate terms and conditions, including in some cases, payment of a fee.The licensed program described in this document and all licensed material available for it are provided by IBM under terms of the IBM Customer Agreement, IBM International Program License Agreement, or any equivalent agreement between us.Any performance data contained herein was determined in a controlled environment. Therefore, the results obtained in other operating environments may vary significantly. Some measurements may have been made on development-level systems and there is no guarantee that these measurements will be the same on generally available systems. Furthermore, some measurement may have been estimated through extrapolation. Actual results may vary. Users of this document should verify the applicable data for their specific environment.Information concerning non-IBM products was obtained from the suppliers of those products, their published announcements or other publicly available sources. IBM has not necessarily tested those products and cannot confirm the accuracy of performance, compatibility or any other claims related to non-IBM products. Questions on the capabilities of non-IBM products should be addressed to the suppliers of those products.This information may contain examples of data and reports used in daily business operations. To illustrate them as completely as possible, the examples may include the names of individuals, companies, brands, and products. All of these names are fictitious and any similarity to the names and addresses used by an actual business enterprise is entirely coincidental.All statements regarding IBM’s future direction or intent are subject to change or withdrawal without notice, and represent goals and objectives only.Programming interface informationProgramming interface information, if provided, is intended to help you create application software using this program.General-use programming interfaces allow you to write application software that obtain the services of this program’s tools.However, this information may also contain diagnosis, modification, and tuning information. Diagnosis, modification and tuning information is provided to help you debug your application software.Warning: Do not use this diagnosis, modification, and tuning information as a programming interface because it is subject to change.Trademarks and service marksThe following terms are trademarks or registered trademarks of International Business Machines Corporation in the United States or other countries, or both:IBMthe IBM logoAIXCrossWorldsDB2DB2 Universal DatabaseDominoLotusLotus NotesMQIntegratorMQSeriesTivoliWebSphereMicrosoft, Windows, Windows NT, and the Windows logo are trademarks of Microsoft Corporation in the United States, other countries, or both.MMX, Pentium, and ProShare are trademarks or registered trademarks of Intel Corporation in the United States, other countries, or both.Java and all Java-based trademarks are trademarks of Sun Microsystems, Inc. in the United States, other countries, or both.Other company, product or service names may be trademarks or service marks of others.IBM WebSphere Product Center.。
NuMicro N9H30系列开发板用户手册说明书
NuMicro®FamilyArm® ARM926EJ-S BasedNuMaker-HMI-N9H30User ManualEvaluation Board for NuMicro® N9H30 SeriesNUMAKER-HMI-N9H30 USER MANUALThe information described in this document is the exclusive intellectual property ofNuvoton Technology Corporation and shall not be reproduced without permission from Nuvoton.Nuvoton is providing this document only for reference purposes of NuMicro microcontroller andmicroprocessor based system design. Nuvoton assumes no responsibility for errors or omissions.All data and specifications are subject to change without notice.For additional information or questions, please contact: Nuvoton Technology Corporation.Table of Contents1OVERVIEW (5)1.1Features (7)1.1.1NuMaker-N9H30 Main Board Features (7)1.1.2NuDesign-TFT-LCD7 Extension Board Features (7)1.2Supporting Resources (8)2NUMAKER-HMI-N9H30 HARDWARE CONFIGURATION (9)2.1NuMaker-N9H30 Board - Front View (9)2.2NuMaker-N9H30 Board - Rear View (14)2.3NuDesign-TFT-LCD7 - Front View (20)2.4NuDesign-TFT-LCD7 - Rear View (21)2.5NuMaker-N9H30 and NuDesign-TFT-LCD7 PCB Placement (22)3NUMAKER-N9H30 AND NUDESIGN-TFT-LCD7 SCHEMATICS (24)3.1NuMaker-N9H30 - GPIO List Circuit (24)3.2NuMaker-N9H30 - System Block Circuit (25)3.3NuMaker-N9H30 - Power Circuit (26)3.4NuMaker-N9H30 - N9H30F61IEC Circuit (27)3.5NuMaker-N9H30 - Setting, ICE, RS-232_0, Key Circuit (28)NUMAKER-HMI-N9H30 USER MANUAL3.6NuMaker-N9H30 - Memory Circuit (29)3.7NuMaker-N9H30 - I2S, I2C_0, RS-485_6 Circuit (30)3.8NuMaker-N9H30 - RS-232_2 Circuit (31)3.9NuMaker-N9H30 - LCD Circuit (32)3.10NuMaker-N9H30 - CMOS Sensor, I2C_1, CAN_0 Circuit (33)3.11NuMaker-N9H30 - RMII_0_PF Circuit (34)3.12NuMaker-N9H30 - RMII_1_PE Circuit (35)3.13NuMaker-N9H30 - USB Circuit (36)3.14NuDesign-TFT-LCD7 - TFT-LCD7 Circuit (37)4REVISION HISTORY (38)List of FiguresFigure 1-1 Front View of NuMaker-HMI-N9H30 Evaluation Board (5)Figure 1-2 Rear View of NuMaker-HMI-N9H30 Evaluation Board (6)Figure 2-1 Front View of NuMaker-N9H30 Board (9)Figure 2-2 Rear View of NuMaker-N9H30 Board (14)Figure 2-3 Front View of NuDesign-TFT-LCD7 Board (20)Figure 2-4 Rear View of NuDesign-TFT-LCD7 Board (21)Figure 2-5 Front View of NuMaker-N9H30 PCB Placement (22)Figure 2-6 Rear View of NuMaker-N9H30 PCB Placement (22)Figure 2-7 Front View of NuDesign-TFT-LCD7 PCB Placement (23)Figure 2-8 Rear View of NuDesign-TFT-LCD7 PCB Placement (23)Figure 3-1 GPIO List Circuit (24)Figure 3-2 System Block Circuit (25)Figure 3-3 Power Circuit (26)Figure 3-4 N9H30F61IEC Circuit (27)Figure 3-5 Setting, ICE, RS-232_0, Key Circuit (28)Figure 3-6 Memory Circuit (29)Figure 3-7 I2S, I2C_0, RS-486_6 Circuit (30)Figure 3-8 RS-232_2 Circuit (31)Figure 3-9 LCD Circuit (32)NUMAKER-HMI-N9H30 USER MANUAL Figure 3-10 CMOS Sensor, I2C_1, CAN_0 Circuit (33)Figure 3-11 RMII_0_PF Circuit (34)Figure 3-12 RMII_1_PE Circuit (35)Figure 3-13 USB Circuit (36)Figure 3-14 TFT-LCD7 Circuit (37)List of TablesTable 2-1 LCD Panel Combination Connector (CON8) Pin Function (11)Table 2-2 Three Sets of Indication LED Functions (12)Table 2-3 Six Sets of User SW, Key Matrix Functions (12)Table 2-4 CMOS Sensor Connector (CON10) Function (13)Table 2-5 JTAG ICE Interface (J2) Function (14)Table 2-6 Expand Port (CON7) Function (16)Table 2-7 UART0 (J3) Function (16)Table 2-8 UART2 (J6) Function (16)Table 2-9 RS-485_6 (SW6~8) Function (17)Table 2-10 Power on Setting (SW4) Function (17)Table 2-11 Power on Setting (S2) Function (17)Table 2-12 Power on Setting (S3) Function (17)Table 2-13 Power on Setting (S4) Function (17)Table 2-14 Power on Setting (S5) Function (17)Table 2-15 Power on Setting (S7/S6) Function (18)Table 2-16 Power on Setting (S9/S8) Function (18)Table 2-17 CMOS Sensor Connector (CON9) Function (19)Table 2-18 CAN_0 (SW9~10) Function (19)NUMAKER-HMI-N9H30 USER MANUAL1 OVERVIEWThe NuMaker-HMI-N9H30 is an evaluation board for GUI application development. The NuMaker-HMI-N9H30 consists of two parts: a NuMaker-N9H30 main board and a NuDesign-TFT-LCD7 extensionboard. The NuMaker-HMI-N9H30 is designed for project evaluation, prototype development andvalidation with HMI (Human Machine Interface) function.The NuMaker-HMI-N9H30 integrates touchscreen display, voice input/output, rich serial port serviceand I/O interface, providing multiple external storage methods.The NuDesign-TFT-LCD7 can be plugged into the main board via the DIN_32x2 extension connector.The NuDesign-TFT-LCD7 includes one 7” LCD which the resolution is 800x480 with RGB-24bits andembedded the 4-wires resistive type touch panel.Figure 1-1 Front View of NuMaker-HMI-N9H30 Evaluation BoardNUMAKER-HMI-N9H30 USER MANUAL Figure 1-2 Rear View of NuMaker-HMI-N9H30 Evaluation Board1.1 Features1.1.1 NuMaker-N9H30 Main Board Features●N9H30F61IEC chip: LQFP216 pin MCP package with DDR (64 MB)●SPI Flash using W25Q256JVEQ (32 MB) booting with quad mode or storage memory●NAND Flash using W29N01HVSINA (128 MB) booting or storage memory●One Micro-SD/TF card slot served either as a SD memory card for data storage or SDIO(Wi-Fi) device●Two sets of COM ports:–One DB9 RS-232 port with UART_0 used 75C3232E transceiver chip can be servedfor function debug and system development.–One DB9 RS-232 port with UART_2 used 75C3232E transceiver chip for userapplication●22 GPIO expansion ports, including seven sets of UART functions●JTAG interface provided for software development●Microphone input and Earphone/Speaker output with 24-bit stereo audio codec(NAU88C22) for I2S interfaces●Six sets of user-configurable push button keys●Three sets of LEDs for status indication●Provides SN65HVD230 transceiver chip for CAN bus communication●Provides MAX3485 transceiver chip for RS-485 device connection●One buzzer device for program applicationNUMAKER-HMI-N9H30 USER MANUAL●Two sets of RJ45 ports with Ethernet 10/100 Mbps MAC used IP101GR PHY chip●USB_0 that can be used as Device/HOST and USB_1 that can be used as HOSTsupports pen drives, keyboards, mouse and printers●Provides over-voltage and over current protection used APL3211A chip●Retain RTC battery socket for CR2032 type and ADC0 detect battery voltage●System power could be supplied by DC-5V adaptor or USB VBUS1.1.2 NuDesign-TFT-LCD7 Extension Board Features●7” resolution 800x480 4-wire resistive touch panel for 24-bits RGB888 interface●DIN_32x2 extension connector1.2 Supporting ResourcesFor sample codes and introduction about NuMaker-N9H30, please refer to N9H30 BSP:https:///products/gui-solution/gui-platform/numaker-hmi-n9h30/?group=Software&tab=2Visit NuForum for further discussion about the NuMaker-HMI-N9H30:/viewforum.php?f=31 NUMAKER-HMI-N9H30 USER MANUALNUMAKER-HMI-N9H30 USER MANUAL2 NUMAKER-HMI-N9H30 HARDWARE CONFIGURATION2.1 NuMaker-N9H30 Board - Front View Combination Connector (CON8)6 set User SWs (K1~6)3set Indication LEDs (LED1~3)Power Supply Switch (SW_POWER1)Audio Codec(U10)Microphone(M1)NAND Flash(U9)RS-232 Transceiver(U6, U12)RS-485 Transceiver(U11)CAN Transceiver (U13)Figure 2-1 Front View of NuMaker-N9H30 BoardFigure 2-1 shows the main components and connectors from the front side of NuMaker-N9H30 board. The following lists components and connectors from the front view:NuMaker-N9H30 board and NuDesign-TFT-LCD7 board combination connector (CON8). This panel connector supports 4-/5-wire resistive touch or capacitance touch panel for 24-bits RGB888 interface.Connector GPIO pin of N9H30 FunctionCON8.1 - Power 3.3VCON8.2 - Power 3.3VCON8.3 GPD7 LCD_CSCON8.4 GPH3 LCD_BLENCON8.5 GPG9 LCD_DENCON8.7 GPG7 LCD_HSYNCCON8.8 GPG6 LCD_CLKCON8.9 GPD15 LCD_D23(R7)CON8.10 GPD14 LCD_D22(R6)CON8.11 GPD13 LCD_D21(R5)CON8.12 GPD12 LCD_D20(R4)CON8.13 GPD11 LCD_D19(R3)CON8.14 GPD10 LCD_D18(R2)CON8.15 GPD9 LCD_D17(R1)CON8.16 GPD8 LCD_D16(R0)CON8.17 GPA15 LCD_D15(G7)CON8.18 GPA14 LCD_D14(G6)CON8.19 GPA13 LCD_D13(G5)CON8.20 GPA12 LCD_D12(G4)CON8.21 GPA11 LCD_D11(G3)CON8.22 GPA10 LCD_D10(G2)CON8.23 GPA9 LCD_D9(G1) NUMAKER-HMI-N9H30 USER MANUALCON8.24 GPA8 LCD_D8(G0)CON8.25 GPA7 LCD_D7(B7)CON8.26 GPA6 LCD_D6(B6)CON8.27 GPA5 LCD_D5(B5)CON8.28 GPA4 LCD_D4(B4)CON8.29 GPA3 LCD_D3(B3)CON8.30 GPA2 LCD_D2(B2)CON8.31 GPA1 LCD_D1(B1)CON8.32 GPA0 LCD_D0(B0)CON8.33 - -CON8.34 - -CON8.35 - -CON8.36 - -CON8.37 GPB2 LCD_PWMCON8.39 - VSSCON8.40 - VSSCON8.41 ADC7 XPCON8.42 ADC3 VsenCON8.43 ADC6 XMCON8.44 ADC4 YMCON8.45 - -CON8.46 ADC5 YPCON8.47 - VSSCON8.48 - VSSCON8.49 GPG0 I2C0_CCON8.50 GPG1 I2C0_DCON8.51 GPG5 TOUCH_INTCON8.52 - -CON8.53 - -CON8.54 - -CON8.55 - -NUMAKER-HMI-N9H30 USER MANUAL CON8.56 - -CON8.57 - -CON8.58 - -CON8.59 - VSSCON8.60 - VSSCON8.61 - -CON8.62 - -CON8.63 - Power 5VCON8.64 - Power 5VTable 2-1 LCD Panel Combination Connector (CON8) Pin Function●Power supply switch (SW_POWER1): System will be powered on if the SW_POWER1button is pressed●Three sets of indication LEDs:LED Color DescriptionsLED1 Red The system power will beterminated and LED1 lightingwhen the input voltage exceeds5.7V or the current exceeds 2A.LED2 Green Power normal state.LED3 Green Controlled by GPH2 pin Table 2-2 Three Sets of Indication LED Functions●Six sets of user SW, Key Matrix for user definitionKey GPIO pin of N9H30 FunctionK1 GPF10 Row0 GPB4 Col0K2 GPF10 Row0 GPB5 Col1K3 GPE15 Row1 GPB4 Col0K4 GPE15 Row1 GPB5 Col1K5 GPE14 Row2 GPB4 Col0K6GPE14 Row2GPB5 Col1 Table 2-3 Six Sets of User SW, Key Matrix Functions●NAND Flash (128 MB) with Winbond W29N01HVS1NA (U9)●Microphone (M1): Through Nuvoton NAU88C22 chip sound input●Audio CODEC chip (U10): Nuvoton NAU88C22 chip connected to N9H30 using I2Sinterface–SW6/SW7/SW8: 1-2 short for RS-485_6 function and connected to 2P terminal (CON5and J5)–SW6/SW7/SW8: 2-3 short for I2S function and connected to NAU88C22 (U10).●CMOS Sensor connector (CON10, SW9~10)–SW9~10: 1-2 short for CAN_0 function and connected to 2P terminal (CON11)–SW9~10: 2-3 short for CMOS sensor function and connected to CMOS sensorconnector (CON10)Connector GPIO pin of N9H30 FunctionCON10.1 - VSSCON10.2 - VSSNUMAKER-HMI-N9H30 USER MANUALCON10.3 - Power 3.3VCON10.4 - Power 3.3VCON10.5 - -CON10.6 - -CON10.7 GPI4 S_PCLKCON10.8 GPI3 S_CLKCON10.9 GPI8 S_D0CON10.10 GPI9 S_D1CON10.11 GPI10 S_D2CON10.12 GPI11 S_D3CON10.13 GPI12 S_D4CON10.14 GPI13 S_D5CON10.15 GPI14 S_D6CON10.16 GPI15 S_D7CON10.17 GPI6 S_VSYNCCON10.18 GPI5 S_HSYNCCON10.19 GPI0 S_PWDNNUMAKER-HMI-N9H30 USER MANUAL CON10.20 GPI7 S_nRSTCON10.21 GPG2 I2C1_CCON10.22 GPG3 I2C1_DCON10.23 - VSSCON10.24 - VSSTable 2-4 CMOS Sensor Connector (CON10) FunctionNUMAKER-HMI-N9H30 USER MANUAL2.2NuMaker-N9H30 Board - Rear View5V In (CON1)RS-232 DB9 (CON2,CON6)Expand Port (CON7)Speaker Output (J4)Earphone Output (CON4)Buzzer (BZ1)System ResetSW (SW5)SPI Flash (U7,U8)JTAG ICE (J2)Power ProtectionIC (U1)N9H30F61IEC (U5)Micro SD Slot (CON3)RJ45 (CON12, CON13)USB1 HOST (CON15)USB0 Device/Host (CON14)CAN_0 Terminal (CON11)CMOS Sensor Connector (CON9)Power On Setting(SW4, S2~S9)RS-485_6 Terminal (CON5)RTC Battery(BT1)RMII PHY (U14,U16)Figure 2-2 Rear View of NuMaker-N9H30 BoardFigure 2-2 shows the main components and connectors from the rear side of NuMaker-N9H30 board. The following lists components and connectors from the rear view:● +5V In (CON1): Power adaptor 5V input ●JTAG ICE interface (J2) ConnectorGPIO pin of N9H30Function J2.1 - Power 3.3V J2.2 GPJ4 nTRST J2.3 GPJ2 TDI J2.4 GPJ1 TMS J2.5 GPJ0 TCK J2.6 - VSS J2.7 GPJ3 TD0 J2.8-RESETTable 2-5 JTAG ICE Interface (J2) Function●SPI Flash (32 MB) with Winbond W25Q256JVEQ (U7); only one (U7 or U8) SPI Flashcan be used●System Reset (SW5): System will be reset if the SW5 button is pressed●Buzzer (BZ1): Control by GPB3 pin of N9H30●Speaker output (J4): Through the NAU88C22 chip sound output●Earphone output (CON4): Through the NAU88C22 chip sound output●Expand port for user use (CON7):Connector GPIO pin of N9H30 FunctionCON7.1 - Power 3.3VCON7.2 - Power 3.3VCON7.3 GPE12 UART3_TXDCON7.4 GPH4 UART1_TXDCON7.5 GPE13 UART3_RXDCON7.6 GPH5 UART1_RXDCON7.7 GPB0 UART5_TXDCON7.8 GPH6 UART1_RTSCON7.9 GPB1 UART5_RXDCON7.10 GPH7 UART1_CTSCON7.11 GPI1 UART7_TXDNUMAKER-HMI-N9H30 USER MANUAL CON7.12 GPH8 UART4_TXDCON7.13 GPI2 UART7_RXDCON7.14 GPH9 UART4_RXDCON7.15 - -CON7.16 GPH10 UART4_RTSCON7.17 - -CON7.18 GPH11 UART4_CTSCON7.19 - VSSCON7.20 - VSSCON7.21 GPB12 UART10_TXDCON7.22 GPH12 UART8_TXDCON7.23 GPB13 UART10_RXDCON7.24 GPH13 UART8_RXDCON7.25 GPB14 UART10_RTSCON7.26 GPH14 UART8_RTSCON7.27 GPB15 UART10_CTSCON7.28 GPH15 UART8_CTSCON7.29 - Power 5VCON7.30 - Power 5VTable 2-6 Expand Port (CON7) Function●UART0 selection (CON2, J3):–RS-232_0 function and connected to DB9 female (CON2) for debug message output.–GPE0/GPE1 connected to 2P terminal (J3).Connector GPIO pin of N9H30 Function J3.1 GPE1 UART0_RXDJ3.2 GPE0 UART0_TXDTable 2-7 UART0 (J3) Function●UART2 selection (CON6, J6):–RS-232_2 function and connected to DB9 female (CON6) for debug message output –GPF11~14 connected to 4P terminal (J6)Connector GPIO pin of N9H30 Function J6.1 GPF11 UART2_TXDJ6.2 GPF12 UART2_RXDJ6.3 GPF13 UART2_RTSJ6.4 GPF14 UART2_CTSTable 2-8 UART2 (J6) Function●RS-485_6 selection (CON5, J5, SW6~8):–SW6~8: 1-2 short for RS-485_6 function and connected to 2P terminal (CON5 and J5) –SW6~8: 2-3 short for I2S function and connected to NAU88C22 (U10)Connector GPIO pin of N9H30 FunctionSW6:1-2 shortGPG11 RS-485_6_DISW6:2-3 short I2S_DOSW7:1-2 shortGPG12 RS-485_6_ROSW7:2-3 short I2S_DISW8:1-2 shortGPG13 RS-485_6_ENBSW8:2-3 short I2S_BCLKNUMAKER-HMI-N9H30 USER MANUALTable 2-9 RS-485_6 (SW6~8) FunctionPower on setting (SW4, S2~9).SW State FunctionSW4.2/SW4.1 ON/ON Boot from USB SW4.2/SW4.1 ON/OFF Boot from eMMC SW4.2/SW4.1 OFF/ON Boot from NAND Flash SW4.2/SW4.1 OFF/OFF Boot from SPI Flash Table 2-10 Power on Setting (SW4) FunctionSW State FunctionS2 Short System clock from 12MHzcrystalS2 Open System clock from UPLL output Table 2-11 Power on Setting (S2) FunctionSW State FunctionS3 Short Watchdog Timer OFFS3 Open Watchdog Timer ON Table 2-12 Power on Setting (S3) FunctionSW State FunctionS4 Short GPJ[4:0] used as GPIO pinS4Open GPJ[4:0] used as JTAG ICEinterfaceTable 2-13 Power on Setting (S4) FunctionSW State FunctionS5 Short UART0 debug message ONS5 Open UART0 debug message OFFTable 2-14 Power on Setting (S5) FunctionSW State FunctionS7/S6 Short/Short NAND Flash page size 2KBS7/S6 Short/Open NAND Flash page size 4KBS7/S6 Open/Short NAND Flash page size 8KBNUMAKER-HMI-N9H30 USER MANUALS7/S6 Open/Open IgnoreTable 2-15 Power on Setting (S7/S6) FunctionSW State FunctionS9/S8 Short/Short NAND Flash ECC type BCH T12S9/S8 Short/Open NAND Flash ECC type BCH T15S9/S8 Open/Short NAND Flash ECC type BCH T24S9/S8 Open/Open IgnoreTable 2-16 Power on Setting (S9/S8) FunctionCMOS Sensor connector (CON9, SW9~10)–SW9~10: 1-2 short for CAN_0 function and connected to 2P terminal (CON11).–SW9~10: 2-3 short for CMOS sensor function and connected to CMOS sensorconnector (CON9).Connector GPIO pin of N9H30 FunctionCON9.1 - VSSCON9.2 - VSSCON9.3 - Power 3.3VCON9.4 - Power 3.3V NUMAKER-HMI-N9H30 USER MANUALCON9.5 - -CON9.6 - -CON9.7 GPI4 S_PCLKCON9.8 GPI3 S_CLKCON9.9 GPI8 S_D0CON9.10 GPI9 S_D1CON9.11 GPI10 S_D2CON9.12 GPI11 S_D3CON9.13 GPI12 S_D4CON9.14 GPI13 S_D5CON9.15 GPI14 S_D6CON9.16 GPI15 S_D7CON9.17 GPI6 S_VSYNCCON9.18 GPI5 S_HSYNCCON9.19 GPI0 S_PWDNCON9.20 GPI7 S_nRSTCON9.21 GPG2 I2C1_CCON9.22 GPG3 I2C1_DCON9.23 - VSSCON9.24 - VSSTable 2-17 CMOS Sensor Connector (CON9) Function●CAN_0 Selection (CON11, SW9~10):–SW9~10: 1-2 short for CAN_0 function and connected to 2P terminal (CON11) –SW9~10: 2-3 short for CMOS sensor function and connected to CMOS sensor connector (CON9, CON10)SW GPIO pin of N9H30 FunctionSW9:1-2 shortGPI3 CAN_0_RXDSW9:2-3 short S_CLKSW10:1-2 shortGPI4 CAN_0_TXDSW10:2-3 short S_PCLKTable 2-18 CAN_0 (SW9~10) Function●USB0 Device/HOST Micro-AB connector (CON14), where CON14 pin4 ID=1 is Device,ID=0 is HOST●USB1 for USB HOST with Type-A connector (CON15)●RJ45_0 connector with LED indicator (CON12), RMII PHY with IP101GR (U14)●RJ45_1 connector with LED indicator (CON13), RMII PHY with IP101GR (U16)●Micro-SD/TF card slot (CON3)●SOC CPU: Nuvoton N9H30F61IEC (U5)●Battery power for RTC 3.3V powered (BT1, J1), can detect voltage by ADC0●RTC power has 3 sources:–Share with 3.3V I/O power–Battery socket for CR2032 (BT1)–External connector (J1)●Board version 2.1NUMAKER-HMI-N9H30 USER MANUAL2.3 NuDesign-TFT-LCD7 -Front ViewFigure 2-3 Front View of NuDesign-TFT-LCD7 BoardFigure 2-3 shows the main components and connectors from the Front side of NuDesign-TFT-LCD7board.7” resolution 800x480 4-W resistive touch panel for 24-bits RGB888 interface2.4 NuDesign-TFT-LCD7 -Rear ViewFigure 2-4 Rear View of NuDesign-TFT-LCD7 BoardFigure 2-4 shows the main components and connectors from the rear side of NuDesign-TFT-LCD7board.NuMaker-N9H30 and NuDesign-TFT-LCD7 combination connector (CON1).NUMAKER-HMI-N9H30 USER MANUAL 2.5 NuMaker-N9H30 and NuDesign-TFT-LCD7 PCB PlacementFigure 2-5 Front View of NuMaker-N9H30 PCB PlacementFigure 2-6 Rear View of NuMaker-N9H30 PCB PlacementNUMAKER-HMI-N9H30 USER MANUALFigure 2-7 Front View of NuDesign-TFT-LCD7 PCB PlacementFigure 2-8 Rear View of NuDesign-TFT-LCD7 PCB Placement3 NUMAKER-N9H30 AND NUDESIGN-TFT-LCD7 SCHEMATICS3.1 NuMaker-N9H30 - GPIO List CircuitFigure 3-1 shows the N9H30F61IEC GPIO list circuit.Figure 3-1 GPIO List Circuit NUMAKER-HMI-N9H30 USER MANUAL3.2 NuMaker-N9H30 - System Block CircuitFigure 3-2 shows the System Block Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-2 System Block Circuit3.3 NuMaker-N9H30 - Power CircuitFigure 3-3 shows the Power Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-3 Power Circuit3.4 NuMaker-N9H30 - N9H30F61IEC CircuitFigure 3-4 shows the N9H30F61IEC Circuit.Figure 3-4 N9H30F61IEC CircuitNUMAKER-HMI-N9H30 USER MANUAL3.5 NuMaker-N9H30 - Setting, ICE, RS-232_0, Key CircuitFigure 3-5 shows the Setting, ICE, RS-232_0, Key Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-5 Setting, ICE, RS-232_0, Key Circuit3.6 NuMaker-N9H30 - Memory CircuitFigure 3-6 shows the Memory Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-6 Memory Circuit3.7 NuMaker-N9H30 - I2S, I2C_0, RS-485_6 CircuitFigure 3-7 shows the I2S, I2C_0, RS-486_6 Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-7 I2S, I2C_0, RS-486_6 Circuit3.8 NuMaker-N9H30 - RS-232_2 CircuitFigure 3-8 shows the RS-232_2 Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-8 RS-232_2 Circuit3.9 NuMaker-N9H30 - LCD CircuitFigure 3-9 shows the LCD Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-9 LCD Circuit3.10 NuMaker-N9H30 - CMOS Sensor, I2C_1, CAN_0 CircuitFigure 3-10 shows the CMOS Sensor,I2C_1, CAN_0 Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-10 CMOS Sensor, I2C_1, CAN_0 Circuit3.11 NuMaker-N9H30 - RMII_0_PF CircuitFigure 3-11 shows the RMII_0_RF Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-11 RMII_0_PF Circuit3.12 NuMaker-N9H30 - RMII_1_PE CircuitFigure 3-12 shows the RMII_1_PE Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-12 RMII_1_PE Circuit3.13 NuMaker-N9H30 - USB CircuitFigure 3-13 shows the USB Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-13 USB Circuit3.14 NuDesign-TFT-LCD7 - TFT-LCD7 CircuitFigure 3-14 shows the TFT-LCD7 Circuit.Figure 3-14 TFT-LCD7 CircuitNUMAKER-HMI-N9H30 USER MANUAL4 REVISION HISTORYDate Revision Description2022.03.24 1.00 Initial version NUMAKER-HMI-N9H30 USER MANUALNUMAKER-HMI-N9H30 USER MANUALImportant NoticeNuvoton Products are neither intended nor warranted for usage in systems or equipment, anymalfunction or failure of which may cause loss of human life, bodily injury or severe propertydamage. Such applications are deemed, “Insecure Usage”.Insecure usage includes, but is not limited to: equipment for surgical implementation, atomicenergy control instruments, airplane or spaceship instruments, the control or operation ofdynamic, brake or safety systems designed for vehicular use, traffic signal instruments, all typesof safety devices, and other applications intended to support or sustain life.All Insecure Usage shall be made at customer’s risk, and in the event that third parties lay claimsto Nuvoton as a result of customer’s Insecure Usage, custome r shall indemnify the damagesand liabilities thus incurred by Nuvoton.。
博思廷智能分析标准化版本3.0安装使用手册
博思廷标准化版本安装和使用手册目录1.安装1.1 boostiv-server(ivas-分析、vsms-分发、vrms-存储、ams-告警)1.1.1选择boostiv-server.msi双击打开安装界面。
1.1.2进入安装界面,然后点击下一步。
1.1.3选择默认安装路径,或点击更改,选择其它安装路径;然后点击下一步。
1.1.4点击安装,开始安装ivas、vsms、vrms、ams服务。
1.1.5安装成功,点击完成。
1.1.6安装完成后,桌面显示BSTAIRSConfig(其它4个服务的配置界面)、ivas、vsms、vrms、ams图标。
1.2 ivms平台1.2.1选择ivms.msi双击打开安装界面。
1.2.2进入安装界面,然后点击下一步。
1.2.3选择默认安装路径,或点击更改,选择其它安装路径;然后点击下一步。
1.2.4点击安装,开始安装ivms平台。
1.2.5安装成功,点击完成。
1.2.6安装完成后,桌面显示BSTivms-平台、cmc-平台配置、BSTMplayer-播放器,图标。
1.3其它辅助软件vc++2005、vc++2008、mysql-5.1.67、加密狗驱动1.3.1点击插件exe文件,全部保持默认完成安装。
1.3.2 MySql安装,选择mysql-5.1.67-win32.msi双击打开安装界面。
保持默认选项,直到出现如下界面,勾选Include Bin Directory in Windows PATH,点击NEXT:密码必须为admin不可更改,勾选Enable root access from remote machines,点击NEXT,继续保持默认选项,完成安装:2.服务配置2.1 boostiv-server服务配置(BSTAIRSConfig、ivas、vsms、vrms、ams)2.1.1双击BSTAIRSConfig图标,打开配置界面。
2.1.2 ivas配置。
软通动力扬帆富设备开发板硬件指导手册说明书
软通动力信息技术(集团)股份有限公司目录第一章产品概述 (2)1.1适用范围 (2)1.2产品概述 (2)1.3产品特点 (2)1.4外观及接口示意图 (4)正面/背面 (4)第二章基本功能列表 (5)第三章PCB尺寸和接口布局 (6)3.1PCB尺寸图 (6)3.2接口参数说明 (6)第四章电气性能 (14)第五章使用注意事项 (15)第一章产品概述1.1.1.1适用范围扬帆开发板属于自助终端主板,普遍适用于:互动广告机、互动数字标牌、智能自助终端、智能零售终端、工控主机、机器人设备等。
1.2.1.2产品概述扬帆开发板采用瑞芯微RK3399(双Cortex-A72大核+四Cortex-A53小核)六核64位超强CPU,搭载Openharmony系统,主频最高达1.8GHz。
采用Mali-T860GPU,支持4K、H265/H264视频解码。
多路视频输出和输入,性能更强,速度更快,接口更丰富,是您在人机交互、智能终端、工控项目上的最佳选择。
1.3.1.3产品特点RK3399超强CPU,速度更快,性能更强●搭载OpenHarmony●系统支持WIFI,单天线●网口设计,支持1000M网口●内置PCI-E接口●丰富的扩展接口.六路USB接口、可扩展串口、GPIO及ADC接口,可以满足市场上各种外设的要求●高清晰度,支持eDP/HDMI OUT等接口的LCD显示屏●支持多种主流触摸屏1.4.1.4外观及接口示意图1.5.正面/背面第二章基本功能列表主要功能参数板卡尺寸146mm*104mm、板厚1.6mmCPU RK3399、六核、主频最高达1.8GHzGPU四核Mali-T860GPU高性能GPU操作系统OpenHarmony内存/存储4G(2G可选)/32G(8G/16G/64G可选)HDMI输出1个HDMI2.0a支持4K60Hz显示、支持HDCP1.4/2.2eDP输出可直接驱动1920x1080分辨率的eDP接口液晶屏视频格式支持支持MP4图片格式支持支持BMP、JPEG、PNG、GIF音频输出功放输出(支持左右声道输出,内置双4R/20W、8R/10W功放)耳机支持一路耳机接口USB接口1路USB3.0OTG、1路USB3.0Host+4路HUB串口/扩展接口1路TTL、1路DEBUG、1路IIC、4路GPIO接口、1路ADC WIFI内置WIFI、单天线以太网支持1000M以太网PCIE接口预留2.第三章PCB尺寸和接口布局2.1.3.1PCB尺寸图PCB:8层板,板厚1.6mmPCBA:L*W=146mm*104mm,MAX H=12.0+/-0.3mm螺丝孔规格:∮3.5mm x42.2.3.2接口参数说明图片标注说明:插座接口图片上圆圈处“Ο”表示第一脚。
联想Flex System Fabric EN4093R 10Gb可扩展交换机产品指南说明书
Lenovo Flex System Fabric EN4093R 10Gb Scalable SwitchProduct GuideThe Lenovo® Flex System Fabric EN4093R 10Gb Scalable Switch provides unmatched scalability, port flexibility, and performance. The switch also delivers innovations to help address several networking concerns today and provides capabilities that help you prepare for the future.This switch can support up to 64x 10 Gb Ethernet connections while offering Layer 2/3 switching, in addition to OpenFlow and "easy connect" modes. It installs within the I/O module bays of the Flex System™ Enterprise Chassis. This switch can help clients migrate to a 10 Gb or 40 Gb Ethernet infrastructure, offers cloud-ready virtualization features (such as Virtual Fabric and VMready®), and is Software Defined Network (SDN) ready. The EN4093R 10Gb Scalable Switch is shown in the following figure.Figure 1. Lenovo Flex System Fabric EN4093R 10Gb Scalable SwitchDid you know?The base switch configuration comes standard with 24x 10 GbE port licenses that can be assigned to internal connections or external SFP+ or QSFP+ ports with flexible port mapping. For example, this feature allows you to trade off four 10 GbE ports for one 40 GbE port (or vice versa) or trade off one external 10 GbE SFP+ port for one internal 10 GbE port (or vice versa). You then have the flexibility of turning on more ports when you need them by using Lenovo's Features on Demand upgrade licensing capabilities that provide “pay as you grow” scalability without the need to buy more hardware.The EN4093R is cloud ready with support for VM aware networking and advanced NIC virtualization technologies, such as Unified Fabric Port (UFP). In addition, the switch offers different operational modes (from "easy connect" transparent networking connectivity to Layer 3 functionality) to satisfy diverse client networking requirements.The EN4093R switch is SDN-ready with support for OpenFlow. OpenFlow is the protocol that enables the network administrator to easily configure and manage virtual networks that control traffic on a "per-flow" basis. OpenFlow creates multiple independent virtual networks and related policies without dealing with the complexities of the underlying physical network and protocols.With support for Converged Enhanced Ethernet (CEE), the EN4093R can be used as an FCoE transit device and is ideal for network-attached storage (NAS) and iSCSI environments.Click here to check for updatesFigure 2. Front panel of the Flex System Fabric EN4093R 10Gb Scalable SwitchThe front panel includes the following components:System LEDs that display the status of the switch module and the network.One mini-USB RS-232 console port that provides another means to configure the switch module.14x SFP/SFP+ ports to attach SFP/SFP+ transceivers for 1 GbE or 10 GbE connections or SFP+ DAC cables for 10 GbE connections.2x QSFP+ ports to attach QSFP+ transceivers or DAC cables for 40 GbE or 4x 10 GbE connections.1x RJ-45 10/100/1000 Mb Ethernet port for out-of-band management.The supported transceivers and cables are listed in the following table. Table 5. Supported transceivers and direct-attach cablesDescription Part number FeaturecodeMaximumquantitysupportedSerial console cablesFlex System Management Serial Access Cable Kit90Y9338A2RR1 SFP transceivers - 1 GbELenovo 1000BASE-T (RJ-45) SFP Transceiver (no 10/100 Mbps support)00FE333A5DL14 Lenovo 1000BASE-SX SFP Transceiver81Y1622326914 Lenovo 1000BASE-LX SFP Transceiver90Y9424A1PN14 SFP+ transceivers - 10 GbELenovo Dual Rate 1/10Gb SX/SR SFP+ Transceiver00MY034ATTJ14 Lenovo 10Gb SFP+ SR Transceiver (10GBASE-SR)46C3447505314 Lenovo 10GBASE-LR SFP+ Transceiver00FE331B0RJ14 Lenovo 10GBASE-T SFP+ Transceiver7G17A03130AVV114 Optical cables for 1 GbE SX SFP, 10 GbE SR SFP+, and 40 GbE SR QSFP+ BiDi transceiversLenovo 1m LC-LC OM3 MMF Cable00MN502ASR614 Lenovo 3m LC-LC OM3 MMF Cable00MN505ASR714 Lenovo 5m LC-LC OM3 MMF Cable00MN508ASR814 Lenovo 10m LC-LC OM3 MMF Cable00MN511ASR914 Lenovo 15m LC-LC OM3 MMF Cable00MN514ASRA14 Lenovo 25m LC-LC OM3 MMF Cable00MN517ASRB14 Lenovo 30m LC-LC OM3 MMF Cable00MN520ASRC14 SFP+ active optical cables - 10 GbELenovo 1m SFP+ to SFP+ Active Optical Cable00YL634ATYX14 Lenovo 3m SFP+ to SFP+ Active Optical Cable00YL637ATYY14 Lenovo 5m SFP+ to SFP+ Active Optical Cable00YL640ATYZ14 Lenovo 7m SFP+ to SFP+ Active Optical Cable00YL643ATZ014 Lenovo 15m SFP+ to SFP+ Active Optical Cable00YL646ATZ114 Lenovo 20m SFP+ to SFP+ Active Optical Cable00YL649ATZ214 SFP+ direct-attach cables - 10 GbELenovo 1m Passive SFP+ DAC Cable90Y9427A1PH14 Lenovo 1.5m Passive SFP+ DAC Cable00AY764A51N14 Lenovo 2m Passive SFP+ DAC Cable00AY765A51P14 Lenovo 3m Passive SFP+ DAC Cable90Y9430A1PJ14 Lenovo 5m Passive SFP+ DAC Cable90Y9433A1PK14 Lenovo 7m Passive SFP+ DAC Cable00D6151A3RH14 QSFP+ transceivers - 40 GbELenovo 40GBase QSFP+ Bi-Directional Transceiver00YL631ATYW2 Lenovo 40GBASE-SR4 QSFP+ Transceiver49Y7884A1DR2 Lenovo 40GBASE-iSR4 QSFP+ Transceiver00D9865ASTM2 Lenovo 40GBASE-eSR4 QSFP+ Transceiver00FE325A5U92 Lenovo 40GBASE-LR4 QSFP+ Transceiver00D6222A3NY2Optical cables for 40 GbE QSFP+ SR4/iSR4/eSR4 transceivers Lenovo 10m QSFP+ MPO-MPO OM3 MMF Cable 00VX003AT2U 2Lenovo 30m QSFP+ MPO-MPO OM3 MMF Cable00VX005AT2V 2Optical breakout cables for 40 GbE QSFP+ iSR4/eSR4 transceivers Lenovo 1m MPO-4xLC OM3 MMF Breakout Cable 00FM412A5UA 2Lenovo 3m MPO-4xLC OM3 MMF Breakout Cable 00FM413A5UB 2Lenovo 5m MPO-4xLC OM3 MMF Breakout Cable 00FM414A5UC2QSFP+ active optical cables - 40 GbELenovo 1m QSFP+ to QSFP+ Active Optical Cable 7Z57A04256AX422Lenovo 3m QSFP+ to QSFP+ Active Optical Cable 00YL652ATZ32Lenovo 5m QSFP+ to QSFP+ Active Optical Cable 00YL655ATZ42Lenovo 7m QSFP+ to QSFP+ Active Optical Cable 00YL658ATZ52Lenovo 15m QSFP+ to QSFP+ Active Optical Cable 00YL661ATZ62Lenovo 20m QSFP+ to QSFP+ Active Optical Cable 00YL664ATZ72QSFP+ active optical breakout cables - 40 GbE to 4x10 GbE Lenovo 1M QSFP+ to 4xSFP+ Active Optical Cable 00YL667ATZ82Lenovo 3M QSFP+ to 4xSFP+ Active Optical Cable 00YL670ATZ92Lenovo 5M QSFP+ to 4xSFP+ Active Optical Cable 00YL673ATZA 2QSFP+ direct-attach cables - 40 GbE Lenovo 1m Passive QSFP+ DAC Cable 49Y7890A1DP 2Lenovo 3m Passive QSFP+ DAC Cable 49Y7891A1DQ 2Lenovo 5m Passive QSFP+ DAC Cable 00D5810A2X82Lenovo 7m Passive QSFP+ DAC Cable 00D5813A2X92QSFP+ breakout cables - 40 GbE to 4x10 GbELenovo 1m Passive QSFP+ to SFP+ Breakout DAC Cable 49Y7886A1DL 2Lenovo 3m Passive QSFP+ to SFP+ Breakout DAC Cable 49Y7887A1DM 2Lenovo 5m Passive QSFP+ to SFP+ Breakout DAC Cable49Y7888A1DN2DescriptionPart number Featurecode Maximum quantity supportedThe network cables that can be used with the switch are listed in the following table.Table 6. EN4093R network cabling requirementsTransceiver Standard Cable Connector 40 Gb Ethernet40Gb SR QSFP+ BiDi (00YL631)40GBASE-SRBiDiUp to 30 m with fiber optic cables supplied by Lenovo (seeTable 5); up to 100 m with OM3 or up to 150 m with OM4multimode fiber optic cable.LC40Gb SR4 QSFP+ (49Y7884)40GBASE-SR410 m or 30 m MPO fiber optic cables supplied byLenovo (see Table 5); up to 100 m with OM3 or up to 150 mwith OM4 multimode fiber optic cable.MPO40Gb iSR4 QSFP+ (00D9865)40GBASE-SR410 m or 30 m MPO fiber optic cables or MPO-4xLCbreakout cables up to 5 m supplied by Lenovo (see Table5); up to 100 m with OM3 or up to 150 m with OM4multimode fiber optic cable.MPO40Gb eSR4 QSFP+ (00FE325)40GBASE-SR410 m or 30 m MPO fiber optic cables or MPO-4xLCbreakout cables up to 5 m supplied by Lenovo (see Table5); up to 300 m with OM3 or up to 400 m with OM4multimode fiber optic cable.MPO40Gb LR4 QSFP+(00D6222)40GBASE-LR41310 nm single-mode fiber optic cable up to 10 km.LCActive optical cable40GBASE-SR4QSFP+ to QSFP+ active optical cables up to 1 m; QSFP+to 4x SFP+ active optical break-out cables up to 5 m for 4x10 GbE SFP+ connections out of a 40 GbE port (see Table5)QSFP+Direct attach copper cable40GBASE-CR4QSFP+ to QSFP+ DAC cables up to 7 m; QSFP+ to4x SFP+ DAC break-out cables up to 5 m for 4x 10 GbESFP+ connections out of a 40 GbE port (see Table 5).QSFP+ 10 Gb Ethernet10Gb SR SFP+ (46C3447) 1/10Gb SFP+ (00MY034)10GBASE-SR Up to 30 m with fiber optic cables supplied by Lenovo (seeTable 5); up to 300 m with OM3 or up to 400 m with OM4multimode fiber optic cable.LC10Gb LR SFP+ (00FE331)10GBASE-LR1310 nm single-mode fiber optic cable up to 10 km.LC 10Gb RJ-45 SFP+(7G17A03130)10GBASE-T UTP Category 6a or 7 up to 30 meters.RJ-45 Active optical cable10GBASE-SR SFP+ active optical cables up to 20 m (see Table 5)SFP+ Direct attach copper cable10GSFP+Cu SFP+ DAC cables up to 7 m (see Table 5).SFP+ 1 Gb Ethernet1Gb RJ-45 SFP (00FE333)1000BASE-T UTP Category 5, 5E, or 6 up to 100 meters.RJ-451Gb SX SFP (81Y1622) 1/10Gb SFP+ (00MY034)1000BASE-SX Up to 30 m with fiber optic cables supplied by Lenovo (seeTable 5); 850 nm multimode fiber cable 50 µ (OM2) up to550 m or 62.5 µ (OM1) up to 220 m.LC1Gb LX SFP (90Y9424)1000BASE-LX1310 nm single-mode fiber optic cable up to 10 km.LC Management ports1 GbE management port1000BASE-T UTP Category 5, 5E, or 6 up to 100 meters.RJ-45 RS-232 management port RS-232DB-9-to-mini-USB or RJ-45-to-mini-USB console cable(comes with the optional Cable Kit, 90Y9338).Mini-USBFigure 3. Location of the I/O bays in the Flex System Enterprise ChassisThe EN4093R switches can be installed in bays 1, 2, 3, and 4 of the Enterprise chassis. A supported adapter must be installed in the corresponding slot of the compute node. Each adapter can use up to four lanes to connect to the respective I/O module bay. The EN4093R can use up to three of the four lanes.In compute nodes that have an integrated dual-port 10 GbE network interface controller (NIC), NIC ports are routed to bays 1 and 2 with a specialized periscope connector, and the adapter is not required. However, the periscope connector can be replaced with the adapter when needed. In such a case, integrated NIC is disabled. With flexible port mapping, there is no need to buy switch upgrades for 4-port and 8-port adapters if the total number of port licenses on the switch does not exceed the number of external (upstream network ports) and internal (compute node network ports) connections that are used.The following table shows compatibility information for the EN4093R and Flex System chassis.Table 7. Flex System chassis compatibilityThe midplane connections between the adapters that are installed in the compute nodes to the I/O module bays in the chassis are listed in the following table. Half-wide compute nodes support up to two adapters, and full-wide compute nodes support up to four adapters.Table 8. Adapter to I/O bay correspondenceI/O adapter slotin the compute node Port on the adapter Corresponding I/O module bay in the chassisBay 1Bay 2Bay 3Bay 4Slot 1Port 1YesPort 2YesPort 3YesPort 4YesPort 5YesPort 6YesPort 7*Port 8*Slot 2Port 1YesPort 2YesPort 3YesPort 4YesPort 5YesPort 6YesPort 7*Port 8*Slot 3(full-wide compute nodes only)Port 1YesPort 2Yes Port 3YesPort 4Yes Port 5YesPort 6Yes Port 7*Port 8*Slot 4(full-wide compute nodes only)Port 1YesPort 2Yes Port 3YesPort 4Yes Port 5YesPort 6Yes Port 7*Port 8** Ports 7 and 8 are routed to I/O bays 1 and 2 (Slot 1 and Slot 3) or 3 and 4 (Slot 2 and Slot 4), but these ports cannot be used with the EN4093R switch.The following table lists the adapters that are supported by the I/O module.Table 9. Network adaptersDescription Part number Featurecode50 Gb EthernetThinkSystem QLogic QL45212 Flex 50Gb 2-Port Ethernet Adapter7XC7A05843B2VT ThinkSystem QLogic QL45262 Flex 50Gb 2-Port Ethernet Adapter with iSCSI/FCoE7XC7A05845B2VV25 Gb EthernetThinkSystem QLogic QL45214 Flex 25Gb 4-Port Ethernet Adapter7XC7A05844B2VU10 Gb EthernetEmbedded 10Gb Virtual Fabric Adapter (2-port)†None None Flex System CN4052S 2-port 10Gb Virtual Fabric Adapter00AG540ATBT Flex System CN4052S 2-port 10Gb Virtual Fabric Adapter Advanced01CV780AU7X Flex System CN4054S 4-port 10Gb Virtual Fabric Adapter00AG590ATBS Flex System CN4054S 4-port 10Gb Virtual Fabric Adapter Advanced01CV790AU7Y1 Gb EthernetEmbedded 1 Gb Ethernet controller (2-port)*None None† The Embedded 10Gb Virtual Fabric Adapter is built into selected compute nodes.* The Embedded 1 Gb Ethernet controller is built into selected compute nodes.Network connectivityThe following table lists the 10 Gb, 25 Gb, and 40 Gb Ethernet network switches that are offered by Lenovo that can be used with the EN4093R switch in Flex System network connectivity solutions.Table 10. Network switchesDescription Part number 10 Gb Ethernet switchesLenovo ThinkSystem NE1032 RackSwitch (Rear to Front)7159A1X Lenovo ThinkSystem NE1032T RackSwitch (Rear to Front)7159B1X Lenovo ThinkSystem NE1064TO RackSwitch (Rear to Front, ONIE)7Z330O11WW Lenovo ThinkSystem NE1072T RackSwitch (Rear to Front)7159C1X Lenovo RackSwitch G8272 (Rear to Front)7159CRW25 Gb Ethernet switchesLenovo ThinkSystem NE2572 RackSwitch (Rear to Front)7159E1X Lenovo ThinkSystem NE2572O RackSwitch (Rear to Front, ONIE)7Z210O21WW Lenovo ThinkSystem NE2580O RackSwitch (Rear to Front, ONIE)7Z330O21WW 100 Gb Ethernet switches (support 40 GbE connectivity)Lenovo ThinkSystem NE10032 RackSwitch (Rear to Front)7159D1X Lenovo ThinkSystem NE10032O RackSwitch (Rear to Front, ONIE)7Z210O11WWFor more information, see the list of Product Guides in the Top-of-rack Switches category:/servers/options/switchesStorage connectivityThe following table lists the external storage systems that are currently offered by Lenovo that can be used with the EN4093R switch for external NAS or iSCSI SAN storage connectivity.Table 11. External storage systems: DE SeriesDescription Part number Worldwide JapanLenovo ThinkSystem DE2000HLenovo ThinkSystem DE2000H 10GBASE-T Hybrid Flash Array LFF (16 GB cache)7Y70A003WW7Y701001JP Lenovo ThinkSystem DE2000H 10GBASE-T Hybrid Flash Array SFF (16 GB cache)7Y71A002WW7Y711005JP Lenovo ThinkSystem DE2000H iSCSI Hybrid Flash Array LFF (16 GB cache)7Y70A004WW7Y701000JP Lenovo ThinkSystem DE2000H iSCSI Hybrid Flash Array SFF (16 GB cache)7Y71A003WW7Y711006JP Lenovo ThinkSystem DE4000HLenovo ThinkSystem DE4000H iSCSI Hybrid Flash Array 4U60 (16 GB cache)7Y77A000WW7Y771002JP Lenovo ThinkSystem DE4000H iSCSI Hybrid Flash Array LFF (16 GB cache)7Y74A002WW7Y74A002JP Lenovo ThinkSystem DE4000H iSCSI Hybrid Flash Array SFF (16 GB cache)7Y75A001WW7Y75A001JP Lenovo ThinkSystem DE4000FLenovo ThinkSystem DE4000F iSCSI All Flash Array SFF (16 GB cache)7Y76A002WW7Y76A002JP Lenovo ThinkSystem DE4000F iSCSI All Flash Array SFF (64 GB cache)7Y76A007WW7Y76A00AJP Lenovo ThinkSystem DE6000HLenovo ThinkSystem DE6000H iSCSI Hybrid Flash Array 4U60 (32 GB cache)7Y80A002WW7Y801000JP Lenovo ThinkSystem DE6000H iSCSI Hybrid Flash Array SFF (32 GB cache)7Y78A002WW7Y781000JP Lenovo ThinkSystem DE6000FLenovo ThinkSystem DE6000F iSCSI All Flash Array SFF (128 GB cache)7Y79A002WW7Y79A002JPTable 12. External storage systems: DM SeriesDescription Part number Lenovo ThinkSystem DM3000HThinkSystem DM3000H Hybrid Storage Array (2U12 LFF, CTO only)7Y42CTO1WW ThinkSystem DM3000H, 48TB (12x 4TB HDDs), 10GBASE-T, ONTAP 9.5 Fundamentals7Y421003EA* ThinkSystem DM3000H, 48TB (12x 4TB HDDs), 10GBASE-T, ONTAP 9.57Y421007EA* ThinkSystem DM3000H, 48TB (12x 4TB HDDs), 16Gb FC / 10GbE SFP+, ONTAP 9.5 Fundamentals7Y421009NA* ThinkSystem DM3000H, 48TB (12x 4TB HDDs), 16Gb FC / 10GbE SFP+, ONTAP 9.5 Fundamentals7Y421002EA* ThinkSystem DM3000H, 48TB (12x 4TB HDDs), 16Gb FC / 10GbE SFP+, ONTAP 9.57Y421006EA* ThinkSystem DM3000H, 96TB (12x 8TB HDDs), 10GBASE-T, ONTAP 9.5 Fundamentals7Y421005EA* ThinkSystem DM3000H, 96TB (12x 8TB HDDs), 10GBASE-T, ONTAP 9.57Y421001EA* ThinkSystem DM3000H, 96TB (12x 8TB HDDs), 16Gb FC / 10GbE SFP+, ONTAP 9.5 Fundamentals7Y421004EA* ThinkSystem DM3000H, 96TB (12x 8TB HDDs), 16Gb FC / 10GbE SFP+, ONTAP 9.57Y421008EA* Lenovo ThinkSystem DM5000HThinkSystem DM5000H Hybrid Storage Array (2U24 SFF, CTO only)7Y57CTO1WW ThinkSystem DM5000H, 11.5TB (12x 960GB SSDs), 10GBASE-T, ONTAP 9.5 Fundamentals7Y571004EA* ThinkSystem DM5000H, 11.5TB (12x 960GB SSDs), 10GBASE-T, ONTAP 9.57Y57100LEA* ThinkSystem DM5000H, 11.5TB (12x 960GB SSDs), 16Gb FC / 10GbE SFP+, ONTAP 9.5 Fundamentals7Y571011NA* ThinkSystem DM5000H, 11.5TB (12x 960GB SSDs), 16Gb FC / 10GbE SFP+, ONTAP 9.5 Fundamentals7Y571003EA*Description Part number ThinkSystem DM5000H, 11.5TB (12x 960GB SSDs), 16Gb FC / 10GbE SFP+, ONTAP 9.57Y57100KEA* ThinkSystem DM5000H, 14.4TB (12x 1.2TB HDDs), 10GBASE-T, ONTAP 9.5 Fundamentals7Y57100CEA*7Y57100BEA* ThinkSystem DM5000H, 14.4TB (12x 1.2TB HDDs), 16Gb FC / 10GbE SFP+, ONTAP 9.5FundamentalsThinkSystem DM5000H, 21.6TB (12x 1.8TB HDDs), 10GBASE-T, ONTAP 9.5 Fundamentals7Y57100GEA* ThinkSystem DM5000H, 21.6TB (12x 1.8TB HDDs), 16Gb FC / 10GbE SFP+, ONTAP 9.57Y57100FEA* FundamentalsThinkSystem DM5000H, 23TB (24x 960GB SSDs), 10GBASE-T, ONTAP 9.5 Fundamentals7Y571006EA* ThinkSystem DM5000H, 23TB (24x 960GB SSDs), 10GBASE-T, ONTAP 9.57Y57100NEA* ThinkSystem DM5000H, 23TB (24x 960GB SSDs), 16Gb FC / 10GbE SFP+, ONTAP 9.5 Fundamentals7Y571005EA* ThinkSystem DM5000H, 23TB (24x 960GB SSDs), 16Gb FC / 10GbE SFP+, ONTAP 9.57Y57100MEA* ThinkSystem DM5000H, 28.8TB (24x 1.2TB HDDs), 10GBASE-T, ONTAP 9.5 Fundamentals7Y57100EEA* ThinkSystem DM5000H, 28.8TB (24x 1.2TB HDDs), 10GBASE-T, ONTAP 9.57Y57100VEA*7Y57100DEA* ThinkSystem DM5000H, 28.8TB (24x 1.2TB HDDs), 16Gb FC / 10GbE SFP+, ONTAP 9.5FundamentalsThinkSystem DM5000H, 43.2TB (24x 1.8TB HDDs), 10GBASE-T, ONTAP 9.5 Fundamentals7Y57100JEA* ThinkSystem DM5000H, 43.2TB (24x 1.8TB HDDs), 10GBASE-T, ONTAP 9.57Y571002EA*7Y571010NA* ThinkSystem DM5000H, 43.2TB (24x 1.8TB HDDs), 16Gb FC / 10GbE SFP+, ONTAP 9.5Fundamentals7Y57100HEA* ThinkSystem DM5000H, 43.2TB (24x 1.8TB HDDs), 16Gb FC / 10GbE SFP+, ONTAP 9.5FundamentalsThinkSystem DM5000H, 43.2TB (24x 1.8TB HDDs), 16Gb FC / 10GbE SFP+, ONTAP 9.57Y57100ZEA* ThinkSystem DM5000H, 46TB (12x 3.84TB SSDs), 10GBASE-T, ONTAP 9.5 Fundamentals7Y571008EA* ThinkSystem DM5000H, 46TB (12x 3.84TB SSDs), 10GBASE-T, ONTAP 9.57Y57100QEA* ThinkSystem DM5000H, 46TB (12x 3.84TB SSDs), 16Gb FC / 10GbE SFP+, ONTAP 9.5 Fundamentals7Y571007EA* ThinkSystem DM5000H, 46TB (12x 3.84TB SSDs), 16Gb FC / 10GbE SFP+, ONTAP 9.57Y57100PEA* ThinkSystem DM5000H, 92TB (24x 3.84TB SSDs), 10GBASE-T, ONTAP 9.5 Fundamentals7Y57100AEA* ThinkSystem DM5000H, 92TB (24x 3.84TB SSDs), 10GBASE-T, ONTAP 9.57Y57100REA* ThinkSystem DM5000H, 92TB (24x 3.84TB SSDs), 16Gb FC / 10GbE SFP+, ONTAP 9.5 Fundamentals7Y571009EA* ThinkSystem DM5000H, 92TB (24x 3.84TB SSDs), 16Gb FC / 10GbE SFP+, ONTAP 9.57Y57100SEA* Lenovo ThinkSystem DM5000FThinkSystem DM5000F Flash Storage Array (2U24 SFF, CTO only)7Y41CTO1WW ThinkSystem DM5000F, 11.5TB (12x 960GB SSDs), 10GBASE-T, ONTAP 9.57Y411002EA* ThinkSystem DM5000F, 11.5TB (12x 960GB SSDs), 16Gb FC / 10GbE SFP+, ONTAP 9.57Y411001EA* ThinkSystem DM5000F, 23TB (24x 960GB SSDs), 10GBASE-T, ONTAP 9.57Y411004EA* ThinkSystem DM5000F, 23TB (24x 960GB SSDs), 16Gb FC / 10GbE SFP+, ONTAP 9.57Y411003EA* ThinkSystem DM5000F, 46TB (12x 3.84TB SSDs), 10GBASE-T, ONTAP 9.57Y411006EA* ThinkSystem DM5000F, 46TB (12x 3.84TB SSDs), 16Gb FC / 10GbE SFP+, ONTAP 9.57Y411005EA* ThinkSystem DM5000F, 92TB (24x 3.84TB SSDs), 10GBASE-T, ONTAP 9.57Y411007EA* ThinkSystem DM5000F, 92TB (24x 3.84TB SSDs), 16Gb FC / 10GbE SFP+, ONTAP 9.57Y411000EA* Lenovo ThinkSystem DM7000HThinkSystem DM7000H Hybrid Storage Array (3U, CTO only)7Y56CTO1WW Lenovo ThinkSystem DM7000FThinkSystem DM7000F Flash Storage Array (3U, CTO only)7Y40CTO1WW * Preconfigured models that are available only in North America (part numbers that have NA at the end) or EMEA (part numbers thatTrademarksLenovo and the Lenovo logo are trademarks or registered trademarks of Lenovo in the United States, other countries, or both. A current list of Lenovo trademarks is available on the Web athttps:///us/en/legal/copytrade/.The following terms are trademarks of Lenovo in the United States, other countries, or both:Lenovo®Flex SystemNMotion®RackSwitchThinkSystem®VMready®XClarity®The following terms are trademarks of other companies:Intel® is a trademark of Intel Corporation or its subsidiaries.Hyper-V® and Microsoft® are trademarks of Microsoft Corporation in the United States, other countries, or both. Other company, product, or service names may be trademarks or service marks of others.。
Espressif Systems (Shanghai) Co.,Ltd.产品说明书
EMITIDO POR / ISSUED BYLGAI TECHNOLOGICAL CENTER - No. 0370 (APPLUS)SOLICITANTE / APPLICANTEspressif Systems (Shanghai) Co.,Ltd.FABRICANTE (Nombre, Dirección)MANUFACTURER (Name, Address) Espressif Systems (Shanghai) Co.,Ltd.Suite 204, Block 2, 690 Bibo Road, Zhang Jiang Hi-Tech Park, Shanghai, China COMERCIALIZADO POR (marca)COMMERCIALISED BY (Brand) ESPRESSIFPRODUCTOPRODUCT Wi-Fi & Bluetooth Internet of Things Module TIPOSTYPESESP32-S3-MINI-1U Versión HW / FMWHW / FMW versionSW: V1.1.3.0HW: V1.0DIRECTIVA APLICABLEAPPLICABLE DIRECTIVEDIRECTIVA 2014/53/UE DEL PARLAMENTO EUROPEO Y DEL CONSEJO, DE 16 DE ABRIL DE 2014, RELATIVA A LA ARMONIZACIÓN DE LAS LEGISLACIONES DE LOS ESTADOS MIEMBROS SOBRE LA COMERCIALIZACIÓN DE EQUIPOS RADIOELÉCTRICOSDIRECTIVE 2014/53/EU OF THE EUROPEAN PARLIAMENT AND OF THE COUNCILOF 16 APRIL 2014 ON THE HARMONISATION OF THE LAWS OF THE MEMBER STATES RELATING TO THE MAKING AVAILABLE ON THE MARKET OF RADIO EQUIPMENTDESCRIPCIÓNDESCRIPTIONThe device is a Wi-Fi & Bluetooth Internet of Things Module with Wi-Fi 2.4G and Bluetooth.CUMPLE CON LOS REQUISITOS ESENCIALESMEET ESSENTIAL REQUIREMENTSArt.3.1a Salud y Seguridad / ☒Art.3.1a Health & SafetyArt. 3.2 Uso eficiente del espectro radioeléctrico / ☒Art.3.2 Efficient use of Radio spectrumArt.3.1b EMC / ☒Art.3.1b EMC Art 3.3 Características especiales / ☐Art.3.3 Special characteristicsEste documento carece de validez sin su anexo, cuyo número coincide con el del presente certificado. // This document in not valid without its technical annex, whosenumber coincides with the number of the certificate.La evaluación de la documentación técnica entregada se encuentran recogidos en el expediente técnico número: 22/36400865The evaluation of the technical documentation delivered is included in the technical file number: 22/36400865Restricciones (si aplican) / Restrictions (if apply):Bellaterra, 17 de marzo de 2022 // 17th March 2022José Luis Medina DirectorElectrical & Electronics - SpainEste Certificado es válido mientras no se produzcan cambios en el estado de la técnica que indiquen que el equipo radioeléctrico aprobado ya no puede cumplir los requisitos esenciales de la Directiva 2014/53/UE y no haya notificaciones en el tipo aprobado que puedan afectar a la conformidad con los requisitos esenciales de la Directiva 2014/53/UEThis Certificate is valid as long as there are no changes in the prior art indicating that the approved radio equipment can no longer meet the essential requirements of Directive 2014/53/EU and No.0370-RED-5007LGAI Technological Center, S.A. (APPLUS)Campus UAB - Ronda de la Font del Carme s/n 08193 Bellaterra (Barcelona) T +34 93 567 20 00 F +34 93 567 20 01 No.CERTIFICADO DE EXAMEN UE DE TIPOEU-TYPE EXAMINATION CERTIFICATEF +34 93 567 20 01Anexo técnico Ed. 117/03/2022ANEXO TÉCNICOTECHNICAL ANNEX0370-RED-5007L G A I T e c h n o l o g i c a l C e n t e r , S .A . C .I .F A 63207492A. MODEL DESCRIPTIONA.1. GENERAL INFORMATION ON THE RADIO EQUIPMENT:Manufacturing country: China Brand: ESPRESSIFCommercial designation: ESPRESSIFCountry of commercialization: European UnionRadio service: Wi-Fi 2.4G and BluetoothApplication: Wi-Fi & Bluetooth Internet of Things ModuleA.1.1 TRADE VERSIONS/VARIANTS: ESP32-S3-MINI-1UA.2. FEATURES: Wi-Fi & Bluetooth Internet of Things ModuleA.3. SOFTWARE VERSION(S): V1.1.3.0A.4. HARDWARE VERSION(S): V1.0A.5. OTHER COMPONENTS- Disposable antenna YES ☐ NO ☒o Antenna gain (dBi)*:(*) only in case of YESF +34 93 567 20 01Anexo técnico Ed. 117/03/2022ANEXO TÉCNICOTECHNICAL ANNEX0370-RED-5007L G A I T e c h n o l o g i c a l C e n t e r , S .A . C .I .F A 63207492A.6. OPERATING FREQUENCIES AND MAXIMUM POWER EMITTED BY BANDN/A: Not applicable N/D: Not defined* Conducted power for mobile technologies and EIRP for other technologies.A.7. OTHER PARAMETERS OF RADIO INTERFACE SPECIFICATIONS (RI)Requires license/Use authorization: YES ☐ NO ☒BAND SERVICEOPERATIONAL FREQUENCY(TX)MAX POWER* CNAF IR CNAF/ UN-XXX Band 1 BLE F_min: 2402MHz F_max: 2480MHz 9.25 dBm IR-163 UN-85 Band 2WiFi 2.4GHzF_min: 2412MHz F_max: 2472MHz19.95 dBmIR-163UN-85F +34 93 567 20 01Anexo técnico Ed. 117/03/2022ANEXO TÉCNICOTECHNICAL ANNEX0370-RED-5007L G A I T e c h n o l o g i c a l C e n t e r , S .A . C .I .F A 63207492B. TEST PROTOCOLREQUIREMENT STANDARDLaboratory Report no. Health and Safety (Article 3.1a) EN IEC 62368-1:2020+A11:2020 TA Technology(Shanghai) Co., Ltd. R2112A1105-L1 EN 50665:2017 R2112A1105-M1 EN IEC 62311:2020 EMC (Article 3.1b) EN 301 489-1 V2.2.3 TA Technology(Shanghai) Co., Ltd.R2112A1105-E1EN 301 489-17 V3.2.4EN 55032:2015+A11:2020 EN 55035:2017+A11:2020 Radio Aspects (Article 3.2) EN 300 328 V2.2.2TA Technology(Shanghai) Co., Ltd.R2112A1105-R1C. RESTRICTIONSRestrictions: YES ☐ NO ☒ Describe restrictions: N/AF +34 93 567 20 01Anexo técnico Ed. 117/03/2022ANEXO TÉCNICOTECHNICAL ANNEX0370-RED-5007L G A I T e c h n o l o g i c a l C e n t e r , S .A . C .I .F A 63207492D. ACTIVITIES CARRIED OUT BY THE NBTechnical Documentation Review☐ Assembly drawings(s) ☒ Block diagram ☒ Circuit diagram/schematics ☒ External photographs ☒ Label drawing/location ☒ User manual ☒ Internal photographs ☒ Operational description ☒ Risk Assessment☒ Test set-up photographs☒ Test reports ☒ EU declaration of conformity ☒ Bill of materials☒ PCB layout☐ Installation diagrams and explanations☒ List of applied (harmonized and non-harmonized) standardsOther activities☒ RIS☒ EFIS/CNAF☒ Review Technical Justifications ☒ Analysis report☒ EU type certification issuedE.ADDITIONAL INFORMATION:Radio Equipment Directive 2014/53/EU, Article 10.4: Manufacturers shall keep the technical documentation and the EU declaration of conformity for 10 years after the radio equipment has been placed on the market.Radio Equipment Directive 2014/53/EU, Annex III, Module B.7: The manufacturer shall inform the notified body that holds the technical documentation relating to the EU-type examination certificate of all modifications to the approved type that may affect the conformity of the radio equipment with the essential requirements of this Directive or the conditions for validity of that certificate. Such modifications shall require additional approval in the form of an addition to the original EU-type examination certificate.This review includes draft standards, deviations from the standards and technical justification for compliance.。
思拓斯3i安装指南说明书
Installation GuideRevision 1.3Last revised: November 6, 2020Disclaimer:This document and its contents are not certified.Stratus 3i Installation Guide©2018-20 Appareo Systems, LLC. All Rights Reserved.Stratus 3i Installation Guide. All content within is copyrighted by Appareo Systems, LLC, and may not be reprinted without permission.The content of this guide is furnished for informational use only, is subject to change without notice, and should not be construed as a commitment by Appareo Systems, LLC. Appareo assumes no responsibility or liability for any errors or inaccuracies that may appear in the information content contained in this guide. Unauthorized replication of this guide is prohibited. Appareo, Appareo Systems, Stratus, and the Appareo logos are either registered trademarks or trademarks of Appareo Systems, LLC. MITRE is a registered trademark of the MITRE Corporation. iPad, iPhone, and iPod touch are registered trademarks of Apple Inc. App Store is a service mark of Apple Inc. All other trademarks and registered trademarks are the sole property of their respective owners.Appareo Systems, LLC, 1810 NDSU Research Circle North, Fargo, ND 58102 USA.To view the most current version of this document, go to /dealer-portal or /resources.Record of RevisionRevisionNumber Change Description Revision Date Inserted By1.0 Initial release 7/11/18 AAL1.1 Updated certification disclaimer 8/29/18 AAL1.2 Updated Stratus ES wiring diagram 1/15/19 AAL1.3 Fixed arrows in Stratus ES wiring diagram 11/6/20 AALAbout Stratus 3iStratus 3i is a portable receiver that is wired to Stratus ES/ESG. It receives auxiliary power from the transponder and also receives the ADS-B and GPS signal from the transponder’s externally-mounted antennas.Refer to the installation instructions on /resources or /dealer-portal/manuals to install Stratus ES/ESG.Supplied Components•Stratus 3i ADS-B In portable receiver•Mounting clip•9-pin D-Sub connector with mounting hardware•Power serial interface cable•BNC jack to blind mate adapter•RF interface cablePlacing Stratus 3i in the AircraftStratus 3i can be placed anywhere in the cockpit in any orientation (including sideways or upside down) as long as the Direction of Flight arrow on the top of the receiver points in the direction of flight.The provided mounting clip can be used to secure the receiver in the aircraft. The holes in the Stratus 3i mount are also compatible with many RAM mounts.Installing the Interface Cables1. Wire the 9 pin D-Sub connector to the transponder following the wiring diagram onPage 6 or 7 and the specifications below.•Maximum harness length: 3 feet•Wire gauge: 20 AWG2. Plug the Stratus 3i power serial interface cable into the 9-pin D-Sub connector. Secureusing the thumb screws.3. Install the BNC blind mate adapter in the ADSB AUX hole on the transponder backplate.4. Plug the BNC connector of the Stratus 3i RF interface cable into the BNC adapter.5. Connect the remaining end of the power serial cable into the power port of Stratus 3i,and the remaining end of the Stratus 3i RF interface cable into the ADS-B port ofStratus 3i. Secure cables as necessary.6. Power on the aircraft to make sure that Stratus 3i is receiving power. Refer to the LEDindicator statuses on Page 8.Configuring the TransponderAfter Stratus 3i has been installed, configure the transponder to allow for ADS-B In receiver information.1. Enter into configuration mode on the transponder.To enter into configuration mode: While holding the FUNC key, press and release thePWR key.2. Press FUNC or the arrow keys to navigate to the ADS-B Capability screen. Press ENT.3. Use the arrow keys to select UAT and 1090 ES. Press ENT.Turning on Stratus 3iStratus 3i automatically turns on when it receives aircraft power.If Stratus 3i is moved after being turned on, you must re-calibrate it in Stratus Horizon Pro or ForeFlight Mobile.LED Indicator Status© 2018-20 Appareo Systems, LLC. All Rights Reserved.。
Flex System x440 Compute Node(7917)产品指南(已撤销产品)说明书
Flex System x440 Compute Node (7917)Product Guide (withdrawn product)The Lenovo Flex System x440 Compute Node is a four-socket Intel Xeon processor-based server that is optimized for high-end virtualization, mainstream database deployments, and memory-intensive, high-performance environments.Based on the Intel Xeon E5-4600 processors, it is price-performance optimized with a selection of processors, memory, and I/O options to help you match system capabilities and cost to workloads without compromise. The Flex System x440 Compute Node can help reduce floor space that is used and lower data center power and cooling costs.Suggested usage: Database, virtualization, and enterprise applications.Figure 1 shows the Flex System x440 Compute Node.Figure 1. The Flex System x440 Compute NodeDid you know?Flex System is a new category of computing that integrates multiple server architectures, networking, storage, and system management capability into a single system that is easy to deploy and manage. Flex System has full, built-in virtualization support of servers, storage, and networking to speed provisioning and increased resiliency. In addition, it supports open industry standards, such as operating systems, networking and storage fabrics, virtualization, and system management protocols, to easily fit within existing and future data center environments. Flex System is scalable and extendable with multi-generation upgrades to protect and maximize IT investments.Click here to check for updatesLocations of key components and connectors Figure 2 shows the front of the server.Figure 2. Front view of the Flex System x440 Compute Node Figure 3 shows the locations of key components inside the server.Figure 3. Inside view of the Flex System x440 Compute NodeStandard modelsThe following table lists the standard models. Table 2. Standard modelsModel Intel Xeon processor(4 maximum)**Memory DiskadapterDisk bays(used/max)†Disks10 GbEEmbeddedVirtualFabric‡I/O slots(used/max)7917-A2x Xeon E5-4603 4C 2.0 GHz10 MB 1066 MHz 95W 1x 8 GB1066 MHz*SAS/SATARAID2.5” hot-swap(0 / 2)Open No0 / 47917-A4x Xeon E5-4603 4C 2.0 GHz10 MB 1066 MHz 95W 1x 8 GB1066 MHz*SAS/SATARAID2.5” hot-swap(0 / 2)Open Standard 2 / 4‡7917-B2x Xeon E5-4607 6C 2.2 GHz12 MB 1066 MHz 95W 1x 8 GB1066 MHz*SAS/SATARAID2.5” hot-swap(0 / 2)Open No0 / 47917-B4x Xeon E5-4607 6C 2.2 GHz12 MB 1066 MHz 95W 1x 8 GB1066 MHz*SAS/SATARAID2.5” hot-swap(0 / 2)Open Standard 2 / 4‡7917-C2x Xeon E5-4610 6C 2.4 GHz15 MB 1333 MHz 95W 1x 8 GB1333 MHzSAS/SATARAID2.5” hot-swap(0 / 2)Open No0 / 47917-C4x Xeon E5-4610 6C 2.4 GHz15 MB 1333 MHz 95W 1x 8 GB1333 MHzSAS/SATARAID2.5” hot-swap(0 / 2)Open Standard 2 / 4‡7917-D2x Xeon E5-4620 8C 2.2 GHz16 MB 1333 MHz 95W 1x 8 GB1333 MHzSAS/SATARAID2.5” hot-swap(0 / 2)Open No0 / 47917-D4x Xeon E5-4620 8C 2.2 GHz16 MB 1333 MHz 95W 1x 8 GB1333 MHzSAS/SATARAID2.5” hot-swap(0 / 2)Open Standard 2 / 4‡7917-F2x Xeon E5-4650 8C 2.7 GHz20 MB 1600 MHz 130W 1x 8 GB1600 MHzSAS/SATARAID2.5” hot-swap(0 / 2)Open No0 / 47917-F4x Xeon E5-4650 8C 2.7 GHz20 MB 1600 MHz 130W 1x 8 GB1600 MHzSAS/SATARAID2.5” hot-swap(0 / 2)Open Standard 2 / 4‡** Processor detail: Processor quantity and model, cores, core speed, L3 cache, memory speed, and power consumption.* For models Axx and Bxx, the standard DIMM is rated at 1333 MHz, but operates at up to 1066 MHz to match the processor memory speed.† The 2.5-inch drive bays can be replaced and expanded with additional internal bays to support up to eight 1.8-inch solid-state drives (SSDs). See the "Internal disk storage options" section.‡ The x4x models include two Embedded 10Gb Virtual Fabric Ethernet controllers. Connections are routed using a Fabric Connector. The Fabric Connectors preclude the use of an I/O adapter in I/O connectors 1 and 3, except the ServeRAID M5115 controller, which can be installed in slot 1.Chassis supportIf memory mirroring is used, then DIMMs must be installed in pairs (minimum of one pair per processor), and both DIMMs in a pair must be identical in type and size.If memory rank sparing is used, then a minimum of one quad-rank DIMM or two single-rank or dual-rank DIMMs must be installed per populated channel (the DIMMs do not need being identical). In rank sparing mode, one rank of a DIMM in each populated channel is reserved as spare memory. The size of a rank varies depending on the DIMMs installed.The following table lists the memory options that are available for the x440 Compute Node.Table 6. Memory optionsPart number FeaturecodeDescription MaximumsupportedWhereusedUDIMMs49Y140486484GB (1x4GB, 2Rx8, 1.35V) PC3L-10600 CL9 ECC DDR31333MHz LP UDIMM 32 (8 per processor)-RDIMMs - 1333 MHz49Y140689414GB (1x4GB, 1Rx4, 1.35V) PC3L-10600 CL9 ECC DDR31333MHz LP RDIMM 48 (12 per processor)-49Y140789424GB (1x4GB, 2Rx8, 1.35V) PC3L-10600 CL9 ECC DDR31333MHz LP RDIMM 48 (12 per processor)-49Y139789238GB (1x8GB, 2Rx4, 1.35V) PC3L-10600 CL9 ECC DDR31333MHz LP RDIMM 48 (12 perprocessor)All othermodels49Y1563A1QT16GB (1x16GB, 2Rx4, 1.35V) PC3L-10600 CL9 ECC DDR31333MHz LP RDIMM 48 (12 per processor)-RDIMMs - 1600 MHz49Y1559A28Z4GB (1x4GB, 1Rx4, 1.5V) PC3-12800 CL11 ECC DDR31600MHz LP RDIMM 48 (12 per processor)-90Y3109A2928GB (1x8GB, 2Rx4, 1.5V) PC3-12800 CL11 ECC DDR31600MHz LP RDIMM 48 (12 perprocessor)F2x andF4x46W0672A3QM16GB (1x16GB, 2Rx4, 1.35V) PC3L-12800 CL11 ECC DDR31600MHz LP RDIMM 48 (12 per processor)-00D4968A2U516GB (1x16GB, 2Rx4, 1.5V) PC3-12800 CL11 ECC DDR31600MHz LP RDIMM 48 (12 per processor)-LRDIMMs90Y3105A29132GB (1x32GB, 4Rx4, 1.35V) PC3L-10600 CL9 ECC DDR31333MHz LP LRDIMM 48 (12 per processor)-Internal storageattachment locations and flex cables for attachment to up to four 1.8-inch SSDs.Note: The above kits are specific for the x440 and cannot be used with the x240 or x220.The following table shows the kits required for each combination of drives. For example, if you plan to install eight 1.8-inch SSDs, then you need the M5115 controller, the Flash Kit, and the SSD Expansion kit.Table 8. ServeRAID M5115 hardware kitsDesired drive support Components requiredMaximum number of 2.5-inch drives Maximumnumber of1.8-inchSSDsServeRAIDM511590Y4390Enablement Kit46C9030Flash Kit47C8809SSDExpansion Kit46C903220=>Required Required0 4 (front)=>Required Required2 4 (internal)=>Required Required Required08 (both)=>Required Required RequiredThe following figure shows how the ServeRAID M5115 and the Enablement Kit are installed in the server tosupport two 2.5-inch drives with MegaRAID CacheVault flash cache protection (row 1 of previous table).Figure 4. The ServeRAID M5115 and the Enablement Kit installedThe following figure shows how the ServeRAID M5115 and Flash and SSD Expansion Kits are installed in the server to support eight 1.8-inch solid-state drives (row 4 of the previous table).Figure 5. ServeRAID M5115 with Flash and SSD Expansion Kits installedPart number Feature code Description Maximumsupported90Y8944A2ZK146GB 15K 6Gbps SAS 2.5" SFF G2HS SED290Y8913A2XF300GB 10K 6Gbps SAS 2.5" SFF G2HS SED244W22645413300GB 10K 6Gbps SAS 2.5" SFF Slim-HS SED290Y8908A3EF600GB 10K 6Gbps SAS 2.5" SFF G2HS SED281Y9662A3EG900GB 10K 6Gbps SAS 2.5" SFF G2HS SED200AD085A48T 1.2TB 10K 6Gbps SAS 2.5'' G2HS SED215K SAS hard disk drives90Y8926A2XB146GB 15K 6Gbps SAS 2.5" SFF G2HS HDD281Y9670A283300GB 15K 6Gbps SAS 2.5" SFF HS HDD200AJ300A4VB600GB 15K 6Gbps SAS 2.5'' G2HS HDD2NL SATA drives81Y9722A1NX250GB 7.2K 6Gbps NL SATA 2.5" SFF HS HDD281Y9726A1NZ500GB 7.2K 6Gbps NL SATA 2.5" SFF HS HDD281Y9730A1AV1TB 7.2K 6Gbps NL SATA 2.5" SFF HS HDD2NL SAS drives90Y8953A2XE500GB 7.2K 6Gbps NL SAS 2.5" SFF G2HS HDD281Y9690A1P31TB 7.2K 6Gbps NL SAS 2.5" SFF HS HDD2SAS-SSD Hybrid drive00AD102A4G7600GB 10K 6Gbps SAS 2.5'' G2HS Hybrid2Enterprise SSDs49Y6129A3EW200GB SAS 2.5" MLC HS Enterprise SSD249Y6134A3EY400GB SAS 2.5" MLC HS Enterprise SSD249Y6139A3F0800GB SAS 2.5" MLC HS Enterprise SSD249Y6195A4GH 1.6TB SAS 2.5" MLC HS Enterprise SSD241Y8331A4FL S3700 200GB SATA 2.5" MLC HS Enterprise SSD241Y8336A4FN S3700 400GB SATA 2.5" MLC HS Enterprise SSD241Y8341A4FQ S3700 800GB SATA 2.5" MLC HS Enterprise SSD200W1125A3HR100GB SATA 2.5" MLC HS Enterprise SSD243W7718A2FN200GB SATA 2.5" MLC HS SSD2Enterprise Value SSDs90Y8648A2U4128GB SATA 2.5" MLC HS Enterprise Value SSD290Y8643A2U3256GB SATA 2.5" MLC HS Enterprise Value SSD200AJ000A4KM S3500 120GB SATA 2.5" MLC HS Enterprise Value SSD200AJ005A4KN S3500 240GB SATA 2.5" MLC HS Enterprise Value SSD200AJ010A4KP S3500 480GB SATA 2.5" MLC HS Enterprise Value SSD200AJ015A4KQ S3500 800GB SATA 2.5" MLC HS Enterprise Value SSD200FN268A5U4S3500 1.6TB SATA 2.5" MLC HS Enterprise Value SSD800AJ355A56Z120GB SATA 2.5" MLC HS Enterprise Value SSD200AJ360A570240GB SATA 2.5" MLC HS Enterprise Value SSD200AJ365A571480GB SATA 2.5" MLC HS Enterprise Value SSD200AJ370A572800GB SATA 2.5" MLC HS Enterprise Value SSD2* Supports self-encrypting drive (SED) technology. For more information, see Self-Encrypting Drives for System x at /tips0761.The 1.8-inch solid state drives supported are listed in the following table. The use of 1.8-inch drives requires the ServeRAID M5115 SAS/SATA controller.Table 11. Supported 1.8-inch solid state drivesPart number FeaturecodeDescription MaxsupportEnterprise SSDs00W1120A3HQ100GB SATA 1.8" MLC Enterprise SSD849Y6119A3AN200GB SATA 1.8" MLC Enterprise SSD849Y6124A3AP400GB SATA 1.8" MLC Enterprise SSD841Y8366A4FS S3700 200GB SATA 1.8" MLC Enterprise SSD841Y8371A4FT S3700 400GB SATA 1.8" MLC Enterprise SSD8Enterprise Value SSDs00AJ335A56V120GB SATA 1.8" MLC Enterprise Value SSD800AJ340A56W240GB SATA 1.8" MLC Enterprise Value SSD800AJ345A56X480GB SATA 1.8" MLC Enterprise Value SSD800AJ350A56Y800GB SATA 1.8" MLC Enterprise Value SSD800AJ040A4KV S3500 80GB SATA 1.8" MLC Enterprise Value SSD800AJ045A4KW S3500 240GB SATA 1.8" MLC Enterprise Value SSD800AJ050A4KX S3500 400GB SATA 1.8" MLC Enterprise Value SSD800AJ455A58U S3500 800GB SATA 1.8" MLC Enterprise Value SSD8Internal tape drivesThe server does not support an internal tape drive. However, it can be attached to external tape drives using Fibre Channel connectivity.Optical drivesThe server does not support an internal optical drive option, however, you can connect an external USB optical drive. See /en/documents/pd011281 for information about available external optical drives from Lenovo.Note: The USB port on the compute nodes supply up to 0.5 A at 5 V. For devices that require more power, an additional power source will be required.Embedded 10Gb Virtual FabricFigure 6. Location of the I/O adapter slots in the Flex System x440 Compute NodeAll I/O adapters are the same shape and can be used in any available slot. A compatible switch or pass-through module must be installed in the corresponding I/O bays in the chassis, as indicated in the following table. Installing two switches means that all ports of the adapter are enabled, which improves performance and network availability.Table 13. Adapter to I/O bay correspondenceI/O adapter slot in the server Port on the adapter Corresponding I/O module bay in the chassis Slot 1Port 1Module bay 1Port 2Module bay 2Port 3 (for 4-port cards)Module bay 1Port 4 (for 4-port cards)Module bay 2Slot 2Port 1Module bay 3Port 2Module bay 4Port 3 (for 4-port cards)Module bay 3Port 4 (for 4-port cards)Module bay 4Slot 3Port 1Module bay 1Port 2Module bay 2Port 3 (for 4-port cards)Module bay 1Port 4 (for 4-port cards)Module bay 2Slot 4Port 1Module bay 3Port 2Module bay 4Port 3 (for 4-port cards)Module bay 3Port 4 (for 4-port cards)Module bay 4For a list of supported switches, see the Flex System Interoperability Guide, available from:/fsigFigure 7 shows the location of the switch bays in the Flex System Enterprise Chassis.Figure 7. Location of the switch bays in the Flex System Enterprise ChassisFigure 8 shows how 2-port adapters are connected to switches installed in the chassis.Figure 8. Logical layout of the interconnects between I/O adapters and I/O modules Network adaptersNetwork adaptersAs described in the Embedded 10Gb Virtual Fabric section, certain models (those with a model number of the form x4x) have two 10 Gb Ethernet controllers on the system board, and its ports are routed to the midplane and switches installed in the chassis through two Compute Note Fabric Connectors that takes the place of adapters in I/O slots 1 and 3.Models without the Embedded 10Gb Virtual Fabric controller (those with a model number of the form x2x) do not include any other Ethernet connections to the Enterprise Chassis midplane as standard. Therefore, for those models, an I/O adapter must be installed to provide network connectivity between the server and the chassis midplane and ultimately to the network switches.The following table lists the supported network adapters and upgrades. Adapters can be installed in any slot. However, compatible switches must be installed in the corresponding bays of the chassis.Table 14. Network adaptersPart number Featurecode Description Numberof portsMaximumsupported*40 Gb Ethernet90Y3482A3HK Flex System EN6132 2-port 40Gb Ethernet Adapter4410 Gb Ethernet88Y5920A4K3Flex System CN4022 2-port 10Gb Converged Adapter2490Y3554A1R1Flex System CN4054 10Gb Virtual Fabric Adapter4400Y3306A4K2Flex System CN4054R 10Gb Virtual Fabric Adapter4490Y3558A1R0Flex System CN4054 Virtual Fabric Adapter (SW Upgrade)(Feature on Demand to provide FCoE and iSCSI support)License490Y3466A1QY Flex System EN4132 2-port 10Gb Ethernet Adapter241 Gb Ethernet49Y7900A10Y Flex System EN2024 4-port 1Gb Ethernet Adapter44 InfiniBand90Y3454A1QZ Flex System IB6132 2-port FDR InfiniBand Adapter22* For x4x models with two Embedded 10Gb Virtual Fabric controllers standard, the Compute Node Fabric Connectors occupy the same space as the I/O adapters in I/O slots 1 and 3, so you have to remove the Fabric Connectors if you plan to install adapters in those I/O slots. To use slots 3 and 4 requires the second processor. For adapter-to-switch compatibility, see the Flex System Interoperability Guide: /fsigStorage host bus adaptersStorage host bus adaptersThe following table lists storage HBAs supported by the x440 server. Table 15. Storage adaptersPart number Featurecode Description Numberof portsFibre Channel88Y6370A1BP Flex System FC5022 2-port 16Gb FC Adapter269Y1938A1BM Flex System FC3172 2-port 8Gb FC Adapter295Y2375A2N5Flex System FC3052 2-port 8Gb FC Adapter295Y2386A45R Flex System FC5052 2-port 16Gb FC Adapter295Y2391A45S Flex System FC5054 4-port 16Gb FC Adapter469Y1942A1BQ Flex System FC5172 2-port 16Gb FC Adapter2For x4x models with two Embedded 10Gb Virtual Fabric controllers standard, the Compute Node Fabric Connectors occupy the same space as the I/O adapters in I/O slots 1 and 3, so you have to remove the Fabric Connectors if you plan to install adapters in those I/O slots. To use slots 3 and 4 requires the second processor. Power suppliesServer power is derived from the power supplies installed in the chassis. There are no server options regarding power supplies.Integrated virtualizationLight path diagnostics panelFor quick problem determination when located physically at the server, the x440 offers a 3-step guided path:1. The Fault LED on the front panel2. The light path diagnostics panel3. LEDs next to key components on the system boardThe x440 light path diagnostics panel is visible when you remove the server from the chassis. The panel is located at the upper right side of the compute node, as shown in Figure 9.Figure 9. Location of x440 light path diagnostics panelTo illuminate the light path diagnostics LEDs, power off the compute node, slide it out of the chassis, and press the power button. The power button doubles as the light path diagnostics remind button when the server is removed from the chassis. The meanings of the LEDs are listed in the following table.Table 17. Light path diagnostic panel LEDsLED MeaningLP The light path diagnostics panel is operational.S BRD A system board error is detected.MIS A mismatch has occurred between the processors, DIMMs, or HDDs.NMI A non-maskable interrupt (NMI) has occurred.TEMP An over-temperature condition occurred that was critical enough to shut down the server.MEM A memory fault has occurred. The corresponding DIMM error LEDs on the system board are also lit.ADJ A fault is detected in the adjacent expansion unit (if installed).Remote managementTrademarksLenovo and the Lenovo logo are trademarks or registered trademarks of Lenovo in the United States, other countries, or both. A current list of Lenovo trademarks is available on the Web athttps:///us/en/legal/copytrade/.The following terms are trademarks of Lenovo in the United States, other countries, or both:Lenovo®Flex SystemServeRAIDServerGuideServerProven®System x®ThinkSystem®The following terms are trademarks of other companies:Intel® and Xeon® are trademarks of Intel Corporation or its subsidiaries.Linux® is the trademark of Linus Torvalds in the U.S. and other countries.Microsoft®, Windows Server®, and Windows® are trademarks of Microsoft Corporation in the United States, other countries, or both.Other company, product, or service names may be trademarks or service marks of others.。
Fujitsu PRIMERGY Linux安装后操作指南(适用于x86版本3.0)说明书
2005-11-01 Notes on Using Red Hat Enterprise Linux AS (v.3 for x86) PrefaceAbout This ManualThis manual provides notes on PRIMERGY operation with Linux installed. Be sure to read this manual before using Linux.Intended ReadersThis manual is intended for persons who operate PRIMERGY.Organization of This ManualThis manual consists of the following chapters:Chapter 1 Notes on OperationThis chapter provides notes on operation after installation. Be sure to read this chapterbefore operating PRIMERGY with Linux installed.Chapter 2 Addition of Peripheral Devices and Option CardsThis chapter explains the procedures for adding peripheral devices and cards afterinstallation and provides notes on adding these options. Read this chapter as required.Chapter 3 OthersThis chapter explains other functions and provides other notes such as notes on limits.Operation VerificationThe operations of the products described in this manual have been confirmed by Fujitsu. Please note, however, that these operations are subject to change without prior notice.Support & ServiceA support service(SupportDesk Product basic service), available for a fee, provides customers usingLinux with an enhanced sense of security and confidence. Customers concluding a support and service agreement are entitled to receive support in such areas as assistance with queries regarding this manual and questions and problems that may come up during the installation and operation of this product.Please consider taking advantage of this service option by concluding a support and service agreement with us.CopyrightAll rights Reserved, Copyright (C) FUJITSU LIMITED 20051. Notes on Operation1.1 Assignment of Device NamesLinux assigns device names to a variety of devices, such as the hard disk drive, in the order that it recognizes them during its startup sequence. If the system is restarted after a device such as a hard disk drive or controller fails, the assigned device names may be changed because the system cannot recognize a device that has failed.Example: When hard disk drives are connected to SCSI ID 1, 2, and 3, device names /dev/sda, /dev/sdb, and /dev/sdc are assigned respectively to the disk drives. If /dev/sdb failsunder this condition, the device previously assigned /dev/sdc/ is moved up by one andrecognized as /dev/sdb after the system is restarted.If an assigned device is unexpectedly changed, it may prevent the system from starting or,in the worst case, may damage your data. If a device fault is detected, therefore, Fujitsurecommends starting the system in rescue mode and checking for hardware faults beforerestarting the system (*1). Repair the hardware fault, restore the system by means suchas the backup tape, and then restart the system.*1 For details on starting the system in rescue mode, see Section 1.4, "Starting theSystem in Rescue Mode."After starting the system, use the fdisk command to check whether the relevant hard diskdrive can be recognized, and take necessary steps such as checking for hardware errormessages in /var/log/messages.1.2 Installation of Red Hat Enterprise Linux AS (v.3 for x86) PackagesRed Hat Enterprise Linux provides installation types so that the optimum system can be constructed according to the use purpose. For this reason, packages required for your purposes might not be installed. If a required package has not been installed, log in as the root and install it by executing the following procedure:Install the necessary packages by using the installation CDs (1/4 to 4/4) that have beencreated according to the Installation Procedure included in the driver kit.# mount -r /dev/cdrom /mnt/cdrom# cd /mnt/cdrom/RedHat/RPMS# rpm -ivh <package_file>Example: To install package "make"# rpm -ivh make-3.79.1-17.i386.rpm# cd /# umount /mnt/cdrom# eject* Remove the CD.1.3 Installing and Setting Up Global Array Manager (GAM)Use Global Array Manager (GAM) as a RAID management tool in a system with a mounted onboard SCSI-RAID and SCSI-RAID card (PG-142E3).For details on installing GAM-Client (Windows), see "Outline of Installation Procedure for Global Array Manager-Client", which is an attachment.The GAM-Server (Linux) installation procedure is explained below.[Notes]1)The screen display may become unstable during GAM installation or GAM service startup.This is not an operational problem.2)Specify the port numbers shown below for GAM service.Take care when configuring firewall settings.Port numbers: 157,158(1)To install GAM-Server (Linux), insert the driver CD into the CD-ROM drive, and entercommands as follows:# mount -r /dev/cdrom /mnt/cdrom# cd /mnt/cdrom/UTY/GAM/Linux# rpm -ivh gam-server-6.02-21.i386.rpm# rpm -ivh gam-agent-6.02-21.i386.rpm- Enter the following only if onboard SCSI for RX200 S2# rpm -ivh 1030SNMPAgent-2.4-3.i386.rpm# sh ./insgam* Confirm that “GAM is installed successfully.” is displayed.# cd /# umount /mnt/cdrom# eject* Remove the CD.(2)For user accounts in Linux, create "gamroot" as a user account with GAM administratorauthority and then create user accounts (e.g., "gamuser") with user authority.(If a user account with user authority has already been created, another account need not be created.) # adduser gamroot# passwd gamrootChanging password for user gamrootNew-password <--- Enter a password.Retype new password <--- Re-enter the same password for confirmation.passwd: all authentication tokens updated successfully* Create a user account with user authority in the same way as explained above.(3)Edit three lines as shown below in the /etc/sysconfig/gam file.Events can be posted to GAM-Client after this editing is completed.# vi /etc/sysconfig/gam[Before editing]START_GAMEVENT=nGAMEVENT_OPTIONS=""[After editing]START_GAMEVENT=y <--- Change "n" to "y".GAMEVENT_OPTIONS="-h ip-address" <--- Specify the IP address of the managementWindows system on which GAM-Client isinstalled.[Before editing]START_GAMEVLOG=n[After editing]START_GAMEVLOG=y <--- Change "n" to "y".(4)Restart the system.# shutdown -r now* The following message may be displayed after the system starts. It does not indicate an operational problem.[Message]gamagent: gamagent: Connection refusedgamagent connect failure1.4 Starting the System in Rescue ModeUsing only one of the installation CDs that have been created according to the Installation Procedure included in the driver kit, you can start the system in rescue mode. This may enable system recovery in the event of a problem that prevents the system from starting normally.This section explains only how to start the system as one that has minimum functionality.Start the system in rescue mode as follows:(1)Start the system from installation CD 1/4 that was created according to the InstallationProcedure included in the driver kit. Enter the appropriate response in the following window,and press the [Enter] key.(2)In the Choose a Language window, select "English" and select "OK."(3)In the Keyboard Type window, select "jp106" and select "OK."If an accessory keyboard such as of a flat display (PG-R1DP3) is used, select "us" here.(4)In the following window, select "Yes."(5)In the following window, select "Add Device."(6)In the Driver List window, select the drivers for the devices installed in the system, and select"OK." The following drivers must be selected:[onboard SCSI type for TX200 S2][onboard SCSI type or onboard SCSI-RAID type for RX200 S2]Two drivers must be selected. Select drivers as follows:1.Select the driver shown below, and select "OK.""LSI Logic Fusion MPT Base Driver (mptbase)"2.The Device Selection window is displayed. Select "AddDevice."3. A list of drivers is displayed. Select the driver shown below, and select "OK.""LSI Logic Fusion MPT SCSI Driver (mptscsih)"[SCSI-RAID card(PG-140D1/PG-142E3) for TX200 S2][onboard SCSI-RAID type for RX300 S2]Select the driver shown below, and select "OK.""LSI MegaRAID controller (megaraid2)"(7)Make sure that the selected driver is displayed in the following window, and select "Done."(8)The Setup Networking window is displayed. Select "No" because network settings need not beconfigured at this time.(9)Select "Continue" in the Rescue window.(10)If the root partition (/) in the existing Linux system has been mounted successfully under/mnt/sysimage, this is reported in the Rescue window. Select "OK."(11)When the prompt is displayed, enter the chroot command to change the root path to the harddisk drive.sh-2.05b# chroot /mnt/sysimage(12)This completes startup in rescue mode. To exit rescue mode, enter the exit command twice.sh-2.05b# exit <--- Exit from the chroot environment.sh-2.05b# exit <--- Exit from the rescue mode.1.5 Power-off at ShutdownPower is not automatically turned off at shutdown.When [Power down] is displayed on the console screen, press the power switch to turn off the power.Note that the power is automatically turned off when the system is shut down in an environment in which ServerView is installed.2. Addition of Peripheral Devices and Option Cards2.1 Adding a SCSI DiskThe number of LUNs is set to 1 by default. To add a SCSI disk, shared disk, or tape library, log in as the root and define the number of LUNs as shown below. Multiple LUN referencing is enabled after the system is started next.(1)Add the following lines to /etc/modules.conf:options scsi_mod max_scsi_luns=N <--- Add* N is the number of LUNs. Define the appropriate number.(2)Enter the mkinitrd command to create initrd.To create initrd, enter the mkinitrd command appropriate for the type of kernel used.* Enter the following command to check the type of kernel used:# uname -r[2.4.21-32.0.1.EL (kernel for single CPU)]# cp /boot/initrd-2.4.21-32.0.1.EL.img /boot/initrd-2.4.21-32.0.1.EL.img.bak# mkinitrd -f /boot/initrd-2.4.21-32.0.1.EL.img 2.4.21-32.0.1.EL[2.4.21-32.0.1.EL smp (kernel for multi-CPU)]#cp /boot/initrd-2.4.21-32.0.1.ELsmp.img /boot/initrd-2.4.21-32.0.1.ELsmp.img.bak# mkinitrd -f /boot/initrd-2.4.21-32.0.1.EL smp.img 2.4.21-32.0.1.EL smp(3)Restart the system.Enter the following command to restart the system.# shutdown -r now2.2 Adding Option CardsIf any of the option cards supported by the models listed in the following table is added after system installation, kudzu is automatically started at system startup. This section explains the operations that enable the system to automatically recognize the added card at each subsequent system startup.The table lists models and the option cards supported by them.TX200 S2 RX200 S2 RX300 S2PG-128 V -- -- SCSI cardPG-130L -- V V PG-140D1V V -- SCSI-RAID cardPG-142E3V V -- PG-1852 V V -- PG-1853 V -- -- PG-1853L -- V -- PG-1862 V V -- PG-1882 V -- -- PG-1882L -- V V PG-1892 V -- -- LAN cardPG-1892L -- V V PG-FC106V V V onboard Fibre-Channel cardPG-FC107V V VSCSI cardPG-128 -- -- V SCSI-RAID cardPG-142E3-- -- V PG-1852 -- -- V PG-1853 -- -- V PG-1862 -- -- V PG-1882 -- -- V LAN cardPG-1892 -- -- V PG-FC106-- -- V Raiser Card Fibre-Channel cardPG-FC107-- -- VV: Supported --: Not supported- TX200 S2 or RX300 S2If any of the option cards supported by the models listed in the above table is added after system installation, kudzu is automatically started at system startup. To add a fibre channel card, follow the steps below. Except for a fibre channel card, select "configure."To add a LAN card, configure network settings according to the instructions displayed in the window. Login as a root user at system startup, and perform the operations explained in Section 2.3, "Executing mkinitrd."This section explains the operations that enable the system to automatically recognize the added card at each subsequent system startup.[A fibre channel card is added](1)If a fibre channel card is added after system installation,kudzu is automatically started at system startup.Always select "ignore ."(2)Add the following line to /etc/modules.conf.If SCSI or SCSI-RAID device is installed in the system,number the end of "scsi_hostadapter", as "2, 3, ...".options scsi_mod max_scsi_luns=128 Add- RX200 S2If any of the option cards supported by the models listed in the above table is added after systeminstallation, kudzu is automatically started at system startup.To add a fibre channel card or LAN card, follow the steps below.Except for a fibre channel card and LAN card, select "configure." Login as a root user at system startup, and perform the operations explained in Section 2.3, "Executing mkinitrd."This section explains the operations that enable the system to automatically recognize the added card at each subsequent system startup.[A LAN card(PG-1852, PG-1862, PG-1882L or PG-1892L) is added](1)If any of the LAN cards supported by the models listed in the above table is addedafter system installation, kudzu is automatically started at system startup.Always select " ignore."(2)Add the following lines to /etc/modules.conf.[ PG-1852, PG-1853L,PG-1892L, or PG-1882L]alias eth0 e1000alias eth1 e1000alias eth2 e1000 <--- Add[ PG-1862]alias eth0 e1000alias eth1 e1000alias eth2 e1000 <--- Addalias eth3 e1000 <--- Add(3)Set up the network.[ PG-1852, ,PG-1853L ,PG-1892L, or PG-1882L]# netconfig -d eth0# netconfig -d eth1# netconfig -d eth2[ PG-1862]# netconfig -d eth0# netconfig -d eth1# netconfig -d eth2# netconfig -d eth3[A fibre channel card is added](1)If a fibre channel card is added after system installation,kudzu is automatically started atsystem startup.Always select "ignore ."(2)Add the following line to /etc/modules.conf.If SCSI or SCSI-RAID device is installed in the system,number the end of "scsi_hostadapter",as "2, 3, ...".options scsi_mod max_scsi_luns=128 Add2.3 Executing mkinitrd(1) Create initrd by executing the mkinitrd command.Create initrd by executing the mkinitrd command according to the kernel used.* Enter the following command to check the kernel used:# uname -rCommand execution examples are shown below.[2.4.21-32.0.1.EL (kernel for a single CPU)]# cp /boot/initrd-2.4.21-32.0.1.EL.img /boot/initrd-2.4.21-32.0.1.EL.img.bak# mkinitrd -f /boot/initrd-2.4.21-32.0.1.EL.img 2.4.21-32.0.1.EL[2.4.21-32.0.1.EL smp (kernel for multi-CPUs)]# cp /boot/initrd-2.4.21-32.0.1.EL smp.img /boot/initrd-2.4.21-32.0.1.ELsmp.img.bak# mkinitrd -f /boot/initrd-2.4.21-32.0.1.EL smp.img 2.4.21-32.0.1.EL smp(2) Restart the system.Restart the system as follows:# shutdown -r now3. Others3.1 Sound FunctionNo sound function is supported.3.2 PCI Hot Plug FunctionThe PCI hot plug function is not supported.3.3 Usable KernelsThe kernels that can be used vary depending on the hardware conditions.See the table below for the kernels that can be used.Note that middleware specifications might limit the kernel to be selected. In this case, select the kernel in accordance with the middleware specifications.Hardware conditionsKernel to be selectedMemory Number of logical CPUs (*1)for single CPU1CPU Kernel Up to 4 GB2 or more CPUs Kernel for multi-CPUMore than 4 GB and up to 8 GB No conditions Kernel for multi-CPU(*1) Even when only one CPU is installed, the number of logical CPUs is 2if Hyper Threading = Enabled.3.4 Distribution LimitationsOperation is not guaranteed if one of the following CPU, memory, and file system limitations is exceeded:Maximum number of logical CPUs: 16Maximum memory size: 8 GBFile system: Less than 1 TB3.5 Installation ProcedureFor information on the procedure for installing Red Hat Enterprise Linux ES (v.3 for x86), see the Installation Procedure included in the "Installation Kit" downloaded from Download Search.Attachment Outline of Global Array Manager Client Installation* Perform this operation only when an onboard SCSI-RAID or a SCSI-RAID card (PG-140D1 or PG-142E3) are mounted.* GAM-Client runs on Windows2000 and Windows2003. Prepare a management Windows system.1. Insert the driver CD into the CD-ROM drive in the management Windows system.2. Execute setup.exe in RHEL3¥UTY¥GAM¥Windows on the driver CD.3. When the "Welcome" window is displayed, click "Next."4. The "Software License Agreement" window is displayed. Read the statements and click "Yes" if youaccept the terms of this agreement.5. The "Select Components" window (Figure 1) is displayed. Confirm that the check box before "GlobalArray Manager Client" is selected. Clear the "Global Array Manager Server" and "SAN Array Manager Client" check boxes, and click "Next."Figure 1* "SAN Array Manager Client" is not supported. Do not install it.6.The "Choose Destination Location" window is displayed.Click "Browse," specify the location that you want as the installation destination, and click "Next."* If GAM-Client is already installed, a message confirmingwhether to overwrite is displayed. Click "OK" to continue.7. A dialog box for specifying the GAM-Client installation destination is displayed. Click "Next." and thesetup program starts copying files.8. The "Setup Complete" window is displayed.Click "Finish" to exit the GAM-Client installation wizard.-- END --。
Silicon Labs Flex SDK 3.4.3.0 GA 产品说明书
Proprietary Flex SDK 3.4.3.0 GAGecko SDK Suite 4.1October 19, 2022 ArrayThe Proprietary Flex SDK is a complete software development suite for proprietary wire-less applications. Per its namesake, Flex offers two implementation options.The first uses Silicon Labs RAIL (Radio Abstraction Interface Layer), an intuitive and eas-ily-customizable radio interface layer designed to support both proprietary and standards-based wireless protocols.The second uses Silicon Labs Connect, an IEEE 802.15.4-based networking stack de-signed for customizable broad-based proprietary wireless networking solutions that re-quire low power consumption and operates in either the sub-GHz or 2.4 GHz frequencybands. The solution is targeted towards simple network topologies.The Flex SDK is supplied with extensive documentation and sample applications. All ex-amples are provided in source code within the Flex SDK sample applications.These release notes cover SDK version(s):3.4.3.0 GA released October 19, 2022 (early access part support, one RAIL Library fixed issue)3.4.2.0 GA released September 28, 20223.4.1.0 GA released August 17, 20223.4.0.0 GA released June 8, 2022Compatibility and Use NoticesFor information about security updates and notices, see the Security chapter of the Gecko Platform Release notes installed with this SDK or on the TECH DOCS tab on https:///developers/flex-sdk-connect-networking-stack. Silicon Labs also strongly recommends that you subscribe to Security Advisories for up-to-date information. For instructions, or if you are new to the Silicon Labs Flex SDK, see Using This Release.Compatible Compilers:IAR Embedded Workbench for ARM (IAR-EWARM) version 9.20.4•Using wine to build with the IarBuild.exe command line utility or IAR Embedded Workbench GUI on macOS or Linux could result in incorrect files being used due to collisions in wine’s hashing algorithm for generating short file names.•Customers on macOS or Linux are advised not to build with IAR outside of Simplicity Studio. Customers who do should carefully verify that the correct files are being used.GCC (The GNU Compiler Collection) version 10.3-2021.10, provided with Simplicity Studio.Contents Contents1Connect Applications (1)1.1New Items (1)1.2Improvements (1)1.3Fixed Issues (1)1.4Known Issues in the Current Release (1)1.5Deprecated Items (1)1.6Removed Items (1)2Connect Stack (2)2.1New Items (2)2.2Improvements (2)2.3Fixed Issues (2)2.4Known Issues in the Current Release (2)2.5Deprecated Items (3)2.6Removed Items (3)3RAIL Applications (4)3.1New Items (4)3.2Improvements (4)3.3Fixed Issues (4)3.4Known Issues in the Current Release (4)3.5Deprecated Items (4)3.6Removed Items (4)4RAIL Library (5)4.1New Items (5)4.2Improvements (5)4.3Fixed Issues (5)4.4Known Issues in the Current Release (7)4.5Deprecated Items (7)4.6Removed Items (7)5Using This Release (8)5.1Installation and Use (8)5.2Security Information (8)5.3Support (9)Connect Applications 1 Connect Applications1.1 New ItemsAdded in release 3.4.0.0•PSA Crypto API usage•Major update of Connect - SoC ECDH Key Exchange1.2 ImprovementsNone1.3 Fixed IssuesNone1.4 Known Issues in the Current ReleaseIssues in bold were added since the previous release. If you have missed a release, recent release notes are available on the TECH DOCS tab on https:///developers/flex-sdk-connect-networking-stack.652925 EFR32XG21 is not supported for “Flex (Connect) - SoC LightExample DMP” and “Flex (Connect) - SoC Switch Example”1.5 Deprecated ItemsNone1.6 Removed ItemsNone2 Connect Stack2.1 New ItemsAdded in release 3.4.0.0•All of the crypto operations are now made through ARM PSA Crypo API, enabling the storage of the network security key in the Secure Vault.•Added a new API emberSetPsaSecurityKey() that indicates which PSA Crypto key handler has to be used by the stack. It is the application’s responsibility to create the key. The old emberSetSecurityKey()no longer designates the key used by the network. It can be used to erase an old key from its previous location in NVM.•Added a new API emberRemovePsaSecurityKey()that cancels the effects of emberSetPsaSecurityKey(). It does not erase the key. It is the application’s responsibility to destroy the key.2.2 ImprovementsNone2.3 Fixed IssuesFixed in release 3.4.2.01022904Fixed an error that was causing the application task to be blocked by the stack task during an active scan. As a result, the application was missing beacons.Fixed in release 3.4.0.0833232 Fixed an error that was causing Connect Application Framework IPC to write to the address 0.2.4 Known Issues in the Current ReleaseIssues in bold were added since the previous release. If you have missed a release, recent release notes are available on the TECH DOCS tab on https:///developers/gecko-software-development-kit.When running the RAIL Multiprotocol Library (used forexample when running DMP Connect+BLE), IR Calibrationis not performed because of a known issue in the RAILMultiprotocol Library. As result, there is an RX sensitivityloss in the order of 3 or 4 dBm.501561 In the Legacy HAL component,the PA configuration is hard-coded regardless of the user or board settings. Until this is changed to properly pull from the configuration header, the file ember-phy.c in the user's project will need to be modified by hand to reflect the desired PA mode, voltage, and ramp time.711804 Connecting multiple devices simultaneously may fail with a timeout error.2.5 Deprecated Items None2.6 Removed Items NoneRAIL Applications 3 RAIL Applications3.1 New ItemsAdded in release 3.4.0.0•EFR32xG24 support•FGM230S support•RAIL Bluetooth DMP - SoC Range Test BLE and IEEE802.15.4 demos for some XGM210 boards3.2 ImprovementsNone3.3 Fixed IssuesNone3.4 Known Issues in the Current ReleaseNone3.5 Deprecated ItemsNone3.6 Removed ItemsNone4 RAIL Library4.1 New ItemsAdded in release 3.4.2.0•Added early support for IEEE802.15.4G dynamic forward error correction PHYs on the EFR32xG12 platform. Use requires help from support to create an appropriate PHY.Added in release 3.4.0.0•The RAIL channel of a received packet is now available in the packet's RAIL_RxPacketDetails_t::channel field. This can be of value when scanning or hopping across multiple channels while letting packets accumulate in the receive FIFO for later processing.•Added the RAIL_ConfigPaAutoEntry API to allow for easier configuration of PA auto mode operation in RAIL.•Added the RAIL_SetRssiDetectThreshold API to allow the user to detect when the RSSI is at or above a configurable threshold.Once configured, the RAIL_EVENT_DETECT_RSSI_THRESHOLD event can be used to detect when this happens.•Added support for the MGM240L022RNF module.•Added support for the FGM230SA27HGN and FGM230SBHGN modules.•Added the RAIL_GetChannelAlt API. This function returns the channel the radio is currently using. If using DMP and run on the inactive protocol it returns the channel that will be used when next switching to that protocol. When using channel hopping, mode switch, and other features that change channels dynamically this may be different than what is returned by RAIL_GetChannel, as this function will track what channel the radio is actually on at that moment and not what it started on.4.2 ImprovementsChanged in release 3.4.2.0•Improved PA configurations for the xGM240 modules based on additional test data.Changed in release 3.4.1.0•Added support in "RAIL Utility, Coexistence" component for configuring priority options when directional priority is enabled but no static priority GPIO is defined.Changed in release 3.4.0.0•The "RAIL Utility, PTI" component will now validate that the correct set of pins are in use for the desired PTI mode.•RAIL will now error if attempting to start a CSMA or LBT transmit while a scheduled RX is still in progress or vice versa.•Added PA curves for BGM240P and MGM240P modules.•Restricted the SL_RAIL_UTIL_PA_RAMP_TIME_US to 10us on some EFR32 modules to match the certification conditions.4.3 Fixed IssuesFixed in release 4.1.3.01041997 Fixed the librail_config libraries for the following xGM240 modules: BGM240PA22VNA, BGM240PA32VNA, BGM240PA32VNN, BGM240PB22VNA, BGM240PB32VNA, BGM240PB32VNN, MGM240PA22VNA,MGM240PA32VNA, MGM240PA32VNN. Without this update these modules will assert when trying to load thesupported BLE and IEEE 802.15.4 PHYs.Fixed in release 3.4.2.0844377 Fixed a Bluetooth LE 2 Mbps AoX issue on EFR32xG24 when using a 38.4 MHz crystal.1029710 Fixed an issue with RAIL's PA auto mode that would cause it to select an unsupported RAIL_TxPowerMode_t on chip OPNs that are missing the higher power PAs.Fixed in release 3.4.1.0819544 Improved reception on EFR32xG23 and EFR32xG24 when using a PHY with fast detect enable (preamble sense mode).843708 Moved function declarations from rail_features.h to rail.h to avoid a convoluted include dependency order.844325 Fixed RAIL_SetTxFifo() to properly return 0 (error) rather than 4096 for an undersized FIFO.844936 Fixed an issue where using RAIL_SetNextTxRepeat() could cause a brownout reset on EFR32xG23.853714 Fixed an issue with xGM240 modules causing them to assert during initialization.988518 Fixed an issue where the radio sequencer would leave portions of the chip enabled after AoX CTE packet reception, preventing the device from going into EM2 sleep and potentially causing missed packet receive events.Fixed in release 3.4.0.0376658 Fixed an issue with the Bluetooth LE coded PHY on EFR32xG21 where a packet received with a corrupt coding indicator would result in an invalid start-of-packet timestamp.759793 Fixed an issue with Bluetooth LE long-range reception on EFR32xG21 that corrupted packet data and tripped RAIL_ASSERT_FAILED_UNEXPECTED_STATE_RX_FIFO.772769 Fixed an issue when running IR Calibration on the EFR32xG23 using RAIL_CalibrateIrAlt where we could compute an invalid IRCAL value for certain PHYs and chips.777427 Fixed support for using the signal identifier CCA modes simultaneously with a user-enabled signal identifier trigger event.819644 Fixed an issue with frame-type decoding PHYs running at more than 500 kbps on EFR32xG22 and later.825083 Fixed an issue on EFR32xG23 and EFR32xG24 where PTI could merge multiple receive packets into the same transaction when interrupt latency is significant.829499 Fixed an issue where RAIL_GetRadioStateDetail would not report the correct state information when frame detection was disabled or during an LBT operation.830214 Ensure that the RAIL_RadioConfigChangedCallback_t is called for all RAIL handles in a dynamic multiprotocol application where multiple handles use the same underlying PHY configuration.835299 Fixed an issue with dynamic handling of whitening and FCS in FSK when onlyRAIL_IEEE802154_E_OPTION_GB868 was enabled.844600 Fixed an issue of not being able to receive packets during a RAIL_ScheduleRx configured with a zero relative start time when Power Manager sleep is enabled and configured with an EM2 or lower energy requirement.4.4 Known Issues in the Current ReleaseIssues in bold were added since the previous release.Using direct mode (or IQ) functionality on EFR32xG23requires a specifically set radio configuration that is notyet supported by the radio configurator. For theserequirements, reach out to technical support who couldprovide that configuration based on your specification 641705 Infinite receive operations where the frame's fixed lengthis set to 0 are not working correctly on the EFR32xG23series chips.732659 On EFR32xG23:•Wi-SUN FSK mode 1a exhibits a PER floor with fre-quency offsets around ± 8 to 10 KHz• Wi-SUN FSK mode 1b exhibits a PER floor with fre-quency offsets around ± 18 to 20 KHz1019590When using the “RAIL Utility, Coexistence”component with Bluetooth LE thesl_bt_system_get_counters() function will alwaysreturn 0 for GRANT denied counts.Contact support for a patch to coexistence-ble.c to fix this issue.4.5 Deprecated Items None4.6 Removed Items NoneUsing This Release 5 Using This ReleaseThis release contains the following•Radio Abstraction Interface Layer (RAIL) stack library•Connect Stack Library•RAIL and Connect Sample Applications•RAIL and Connect Components and Application FrameworkThis SDK depends on Gecko Platform. The Gecko Platform code provides functionality that supports protocol plugins and APIs in the form of drivers and other lower layer features that interact directly with Silicon Labs chips and modules. Gecko Platform components include EMLIB, EMDRV, RAIL Library, NVM3, and mbedTLS. Gecko Platform release notes are available through Simplicity Studio’s Documentation tab.For more information about the Flex SDK v3.x see UG103.13: RAIL Fundamentals and UG103.12: Silicon Labs Connect Fundamentals. If you are a first time user, see QSG168: Proprietary Flex SDK v3.x Quick Start Guide.5.1 Installation and UseThe Proprietary Flex SDK is provided as part of the Gecko SDK (GSDK), the suite of Silicon Labs SDKs. To quickly get started with the GSDK, install Simplicity Studio 5, which will set up your development environment and walk you through GSDK installation. Simplicity Studio 5 includes everything needed for IoT product development with Silicon Labs devices, including a resource and project launcher, software configuration tools, full IDE with GNU toolchain, and analysis tools. Installation instructions are provided in the online Simplicity Studio 5 User’s Guide.Alternatively, Gecko SDK may be installed manually by downloading or cloning the latest from GitHub. See https:///Sili-conLabs/gecko_sdk for more information.Simplicity Studio installs the GSDK by default in:•(Windows): C:\Users\<NAME>\SimplicityStudio\SDKs\gecko_sdk•(MacOS): /Users/<NAME>/SimplicityStudio/SDKs/gecko_sdkDocumentation specific to the SDK version is installed with the SDK. Additional information can often be found in the knowledge base articles (KBAs). API references and other information about this and earlier releases is available on https:///.5.2 Security InformationSecure Vault IntegrationWhen deployed to Secure Vault High devices, sensitive keys are protected using the Secure Vault Key Management functionality. The following table shows the protected keys and their storage protection characteristics.Thread Master Key Exportable Must be exportable to form the TLVsPSKc Exportable Must be exportable to form the TLVsKey Encryption Key Exportable Must be exportable to form the TLVsMLE Key Non-ExportableTemporary MLE Key Non-ExportableMAC Previous Key Non-ExportableMAC Current Key Non-ExportableMAC Next Key Non-ExportableWrapped keys that are marked as “Non-Exportable” can be used but cannot be viewed or shared at runtime.Wrapped keys that are marked as “Exportable” can be used or shared at runtime but remain encrypted while stored in flash.For more information on Secure Vault Key Management functionality, see AN1271: Secure Key Storage.Using This ReleaseSecurity AdvisoriesTo subscribe to Security Advisories, log in to the Silicon Labs customer portal, then select Account Home. Click HOME to go to the portal home page and then click the Manage Notifications tile. Make sure that ‘Software/Security Advisory Notices & Product Change Notices (PCNs)’ is checked, and that you are subscribed at minimum for your platform and protocol. Click Save to save any changes.5.3 SupportDevelopment Kit customers are eligible for training and technical support. Use the Silicon Labs Flex web page to obtain information about all Silicon Labs Thread products and services, and to sign up for product support.You can contact Silicon Laboratories support at /support.Silicon Laboratories Inc.400 West Cesar Chavez Austin, TX 78701USA IoT Portfolio /IoT SW/HW /simplicity Quality /quality Support & Community /communityDisclaimerSilicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software imple-menters using or intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and “Typical” parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes without further notice to the product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Without prior notification, Silicon Labs may update product firmware during the manufacturing process for security or reliability reasons. Such changes will not alter the specifications or the performance of the product. Silicon Labs shall have no liability for the consequences of use of the infor -mation supplied in this document. This document does not imply or expressly grant any license to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any FDA Class III devices, applications for which FDA premarket approval is required or Life Support Systems without the specific written consent of Silicon Labs. A “Life Support System” is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. Silicon Labs products are not designed or authorized for military applications. Silicon Labs products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons. Silicon Labs disclaims all express and implied warranties and shall not be responsible or liable for any injuries or damages related to use of a Silicon Labs product in such unauthorized applications. Note: This content may contain offensive terminology that is now obsolete. Silicon Labs is replacing these terms with inclusive language wherever possible. For more information, visit /about-us/inclusive-lexicon-projectTrademark InformationSilicon Laboratories Inc.®, Silicon Laboratories ®, Silicon Labs ®, SiLabs ® and the Silicon Labs logo ®, Bluegiga ®, Bluegiga Logo ®, EFM ®, EFM32®, EFR, Ember ®, Energy Micro, Energy Micro logo and combinations thereof, “the world’s most energy friendly microcontrollers”, Redpine Signals ®, WiSeConnect , n-Link, ThreadArch ®, EZLink ®, EZRadio ®, EZRadioPRO ®, Gecko ®, Gecko OS, Gecko OS Studio, Precision32®, Simplicity Studio ®, Telegesis, the Telegesis Logo ®, USBXpress ® , Zentri, the Zentri logo and Zentri DMS, Z-Wave ®, and others are trademarks or registered trademarks of Silicon Labs. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of ARM Holdings. Keil is a registered trademark of ARM Limited. Wi-Fi is a registered trademark of the Wi-Fi Alliance. All other products or brand names mentioned herein are trademarks of their respective holders.。
FLEXCUBE IS 安装指南说明书
FLEXCUBE IS Installation Oracle FLEXCUBE Investor ServicingRelease 12.3.0.8.1[May] [2021]Table of Contents1.FLEXCUBE IS INSTALLATION (2)1.1I NTRODUCTION (2)1.2D EPLOYMENT O PTIONS (2)1.2.1Centralized (2)1.3O RACLE FLEXCUBE I NSTALLATION V ARIETIES (2)1.3.1Creating New FCHome (3)1.3.2Updating FCHome with Patchsets (3)1.3.3Updating FCHome with ROLLED Patchsets (3)1.3.4New Installation (4)1.3.5Cloning Existing Environment (4)1.3.6Applying Patchset (4)1.3.7Upgrading to Higher Version. (5)1.4C OMPONENTS OF O RACLE FLEXCUBE (5)1.4.1Plug-Ins Required (6)1.4.2Setting up the Plug-Ins (6)1.4.3Manual Deployment (6)1.4.4FCIS Application Installation (6)1.4.5GATEWAY Application Installation (8)1.4.6Open Development Tool (ODT) (8)1.4.7Standalone Scheduler Installation (9)1. FLEXCUBE IS Installation 1.1 IntroductionThis manual is designed to help acquaint you with the various deployment options supported by the installer, the various components that make FLEXCUBE IS, the plug-ins that are supported by these components and the detailed installation steps of the various components supported by Oracle FLEXCUBE.1.2 Deployment Options1.2.1 Centralized1.3 Oracle FLEXCUBE Installation VarietiesInstalling FLEXCUBE can happen in multiple varities. Please follow steps mentioned in first 3sections before starting any installation steps.Installer does not accept spaces in file path. Its applicable for all path including but not limited tosource path, temp destination directory, property file path etc.The below screenshot shows sample “FC Home” folder structure. This is the location to bepointed, if installer asks for FC Home directory.In the above screenshot, main release content can be found directly under FCHOME directory and Patches directory contains patch release contents.1.3.1 Creating New FCHome1. Extract the ZIP file FCIS_<Version>_<Release Date>.zip2. Create a FCHOME Folder and extract the above zip into this folder.3. Copy FCHome.ini from FCUBS folder to FCHOME Folder.4. Make sure that FCHOME Directory is accessible by both Application server and DatabaseServer.1.3.2 Updating FCHome with Patchsets1. Extract the ZIP file FCIS_ <Version>.0.<Patch No>.zip into FCHOME folder2. You find the extracted patch under the folder FCUBSHOME\Patches\.1.3.3 Updating FCHome with ROLLED Patchsets1. Extract the ZIP file FCIS_ <Version>.<Rolled Patch No>.0.zip into FCHOME folder2. You find the extracted patch under the folder FCUBSHOME\Patches\.1.3.4 New InstallationThis section explains the step by step procedure for fresh installation using installer:1. Apply the environment settings for Oracle FLEXCUBE. (Refer toOracleFLEXCUBE_FCIS_Pre-requisites document).2. Navigate to the folder which was chosen as FCHOME and launch the installer by runningFCUBSInstaller.bat in the Installer folder.3. Select Database in Oracle FLEXCUBE Installer and provide the FCHOME path. (ReferFCIS_DB_Setup document under FCIS Components > FCIS).4. For creating application, create a property file with the required plug-ins. (Refer toFCIS_Property_File_Creation document under FCIS Components > FCIS).5. Build an EAR using the property file created in step 4. (Refer FCIS_EAR_Building documentunder FCIS Components > FCIS).6. Deploy the Built EAR in application server and login to the Oracle FLEXCUBE. (Refer toapplication server specific Deployment documents under FCIS Components > FCIS).1.3.5 Cloning Existing Environment1. Import a dump of FLEXCUBE database. (Refer FCIS_DB_Setup document under FCISComponents > FCIS)2. Create two FLEXCUBE Users using Installer. (Refer User_Creation_Utility document underUtilities).3. Get the Property file of the Environment to be cloned and Modify the property file by loading itin the Installer.4. Update the Ear file with the New Property File.5. Deploy the Built EAR in application server and login to the FLEXCUBE.6. Login into FLEXCUBE using the users created as part of step3 and reset/Modify thePassword of all the users.1.3.6 Applying PatchsetThis section describes applying patchset.1.3.6.1 Applying FLEXCUBE Patch Set - MiddlewareWeblogic1. Navigate to the folder which was chosen as FCHOME and Launch the installer by runningFCUBSInstaller.bat in the Installer folder.2. Provide the path of the FCHOME folder3. Build an EAR by loading the existing property file.4. Deploy the built EAR in weblogic application server.Building of EAR can be done in remote location but the application deployment should be done in local system where the application server in installed.Websphere1. Navigate to the folder which was chosen as FCHOME and Launch the installer by runningFCUBSInstaller.bat in the Installer folder.2. Provide the path of the FCHOME folder3. Build an EAR by loading the existing property file4. Deploy the built EAR in websphere application server.1.3.6.2 Applying FLEXCUBE Patch set - DATABASE1. Navigate to the folder which was chosen as FCHOME and Launch the installer by runningFCUBSInstaller.bat in the Installer folder.2. Launch Installer by running FCUBSInstaller.bat and select Database Setup.3. Provide Database server connection details4. Apply the patch set into the Database server.Take a snapshot backup of the environment before applying the patchset as backup or recovery process for the continuity of business. Once patchset is applied, it cannot be rolled back automatically.1.3.7 Upgrading to Higher Version.FLEXCUBE DATABASE Version Up gradation1. Copy the Installer sources from shipment area to a local folder INSTALLER.2. Copy the All the existing version sources from Shipment area to a local folder which will begiven as source path1 in step 4.3. Copy the sources of the upgraded version from shipment area to a local folder which will begiven as source path2 in step 4.4. Launch the latest upgraded Installer by running FCUBSInstaller.bat.5. Provide the existing version sources path created in step 2 as consolidated source andprovide the upgraded version sources path created in step 3 as delta source.6. Provide Database server connection details.7. Apply the patch set into the Database server.1.4 Components of Oracle FLEXCUBEFollowing are the components of the oracle FLEXCUBE:∙FLEXCUBE Investor Servicing (FCIS)∙GATEWAY∙Open Development Tool (ODT)∙Standalone Scheduler1.4.1 Plug-Ins Required1.4.2 Setting up the Plug-InsThe Setting_up_Plugins document describes the step by step details of setting up the variousplug-ins supported by FLEXCUBE. This is under FCIS Main. This is a common document for both UBS and IS. All references of FCUBS in the document can be changed to FCIS as appropriate.1.4.3 Manual DeploymentThis section explains the steps to deploy Oracle FLEXCUBE IS application manually. Application server resources required are detailed in “Resources_To_Be_Created document.This is present under Environment Setup > Application ServerFollow the document FCIS_Manual_Deployment_WL. for Websphere please followFCIS_Manual_Deployment_WAS. All these documents are present in the Environment Setup > Application Server1.4.4 FCIS Application InstallationAll documents can be referred under FCIS Components > FCIS.In default mode Property file is created by considering the default properties and EAR is built based on the property file created.Database Installation This document gives the step by step instructions for setting up FCIS Data Base. It also explains the process of importing full dump, and also explains the process of loading static data. Refer to the document FCIS_DB_SetupBuilding Property File This section explains the detailed instructions to be followed for Building FCIS Property file , it explains the instructions for setting up the property file with plug-ins and plug-in related properties. Refer to the document FCIS_Property_File_CreationBuilding Ear This section explains the detailed instructions to be followed for Building FCIS EAR, it explains the step by step instructions for building the EAR with the corresponding property file. Refer to the documentFCIS_EAR_BuildingApplication Deployment Weblogic FULLDeploymentThis section gives the detailedinstructions for FULL deployment of UBSapplication in weblogic server, it alsoexplains the basic instructions for creatingthe resources required for deployment ofUBS application. Refer to the documentFCIS_Application_Deployment_WeblogicPatch/PatchsetDeploymentThis section gives the detailedinstructions for Partial deployment of UBSapplication, It explains the steps fordeployment of the patches of the existingear in weblogic server. Refer to thedocumentFCIS_Application_Deployment_WeblogicWebsphere FULLDeploymentThis section gives the detailedinstructions for FULL deployment of UBSapplicationin websphere server, it explainthe steps to be followed for deployingUBS application in websphere serverusing installer. Refer to the documentFCIS_Application_Deployment_WebspherePatch/PatchsetDeploymentThis section gives the detailedinstructions for partial deployment of UBSapplication in websphere server, itexplains the steps to be followed fordeploying the patches for the existingapplication in websphere server. Refer tothe documentFCIS_Application_Deployment_Websphere1.4.5 GATEWAY Application InstallationAll documents can be referred under FCIS Components > Gateway.1.4.6 Open Development Tool (ODT)All documents can be referred under FCIS Components > ODT.1.4.7 Standalone Scheduler InstallationAll documents can be referred under FCIS Components > Scheduler.FLEXCUBE IS Installation[May] [2021]Version 12.3.0.8.1Oracle Financial Services Software LimitedOracle ParkOff Western Express HighwayGoregaon (East)Mumbai, Maharashtra 400 063IndiaWorldwide Inquiries:Phone: +91 22 6718 3000Fax:+91 22 6718 3001/financialservices/Copyright © [2007], [2021], Oracle and/or its affiliates. All rights reserved.Oracle and Java are registered trademarks of Oracle and/or its affiliates. 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If you use this software or hardware in dangerous applications, then you shall be responsible to take all appropriate failsafe, backup, redundancy, and other measures to ensure its safe use. Oracle Corporation and its affiliates disclaim any liability for any damages caused by use of this software or hardware in dangerous applications.This software and related documentation are provided under a license agreement containing restrictions on use and disclosure and are protected by intellectual property laws. Except as expressly permitted in your license agreement or allowed by law, you may not use, copy, reproduce, translate, broadcast, modify, license, transmit, distribute, exhibit, perform, publish or display any part, in any form, or by any means. Reverse engineering, disassembly, or decompilation of this software, unless required by law for interoperability, is prohibited.The information contained herein is subject to change without notice and is not warranted to be error-free. If you find any errors, please report them to us in writing.This software or hardware and documentation may provide access to or information on content, products and services from third parties. Oracle Corporation and its affiliates are not responsible for and expressly disclaim all warranties of any kind with respect to third-party content, products, and services. Oracle Corporation and its affiliates will not be responsible for any loss, costs, or damages incurred due to your access to or use of third-party content, products, or services。
MSL2024快速向导
HP StoreEver 1/8 G2 Tape AutoloaderThe HP StoreEver 1/8 G2 Tape Autoloader provides a cost-effective, easy-to-install, unattended backup that is ideal for an entry-level or remote office automated backup solution. The HP 1/8 G2 autoloader combines incredible storage density and tape library features into a compact 1U form factor. Capable of up to 24TB of compressed capacity in only a 1U form factor, the autoloader is well equipped to offer room for uncertain data growth. Web-based remote management offers the capability to quickly and easily access, configure, monitor, and troubleshoot the autoloader that will reduce dependencies on local IT staff while allowing multiple sites to be supported centrally. Protect confidential business information with native encryption, ensuring that if a tape is lost or stolen your data is protected from unauthorized access. Proactively monitor utilization, operational performance, as well as life and health information for both the drive and media with TapeAssure.What's NewLTO-6 Ultrium 6250 half-height SAS and FC tape drives and LTO-6 Ultrium 6250 tape media are now available, improving performance by 44% and more than doubling the storage capacity of the autoloader.Key Features ∙The HP 1/8 G2 Tape Autoloader packs the maximum amount of storage into the minimumamount of space. LTO-6 Ultrium 6250 tape technology delivers 50 TB of compressed capacity(2.5:1) in a 1U form factor.∙Easy to install, manage and use integrated solution∙Protect and secure your data with native autoloader encryption∙Predicative and proactive monitoring with Tape Assure∙Integrated web-based remote management∙Flexible tape technology and interface choices to suit your needs∙Easy to use and manage∙Customer serviceable and replaceable components∙Yosemite Backup Basic Software for a complete out of the box solution.Family Comparison 1/8 G2 LTO-6 Ultrium 6250 TapeAutoloader 1/8 G2 LTO-5 Ultrium 3000 TapeAutoloader1/8 G2 LTO-4 Ultrium 1760 TapeAutoloaderDrive Technology Ultrium 6250 Ultrium 3000 Ultrium 1760 Capacity(compressed 2.5:1)50 TBCapacity(compressed 2:1)24 TB 12.8 TBMaximum Data Transfer(compressed 2.5:1)1.44 TB/hrMaximum Data Transfer(compressed 2:1)1.0 TB/hr 576 GB/hrInterface 8 Gb/sec Fibre Channel(LTO 6 only) 8 Gb/sec Fibre Channel(LTO 5 only)3 Gb/sec SAS(LTO 5, 4, 3)6 Gb/sec SAS (LTO 6 only) 6 Gb/sec SAS(LTO 5 only)Ultra320 LVD SCSI(LTO 4, 3)Easy Installation The 1/8 G2 Tape Autoloader ships as a rack-ready unit. A separate 1/8 G2 Tape Autoloader Rack Kit must be purchased to allow installation in a variety of HP racks which include the 10000 series, 9000series, 5000 series and System/E racks.A set of rubber feet are included in the box if you choose to use the unit on a tabletop or desk. Foradditional structural rigidity, HP recommends the purchase of the 1/8 G2 Rack-to-Tabletop conversionkit which has a maximum load of 33 pounds (15 kilograms) and fully encloses the unit.Data Protector backup and recovery software If the Autoloader is for a large environment that requires UNIX support and/or enterprise class application and feature support then HP Data Protector is the recommended backup and recovery software. If current or future requirements will require Data Protector, this software should be installed from day 1.For more information and evaluation software please visit: /go/dataprotector.Linear Tape File System (LTFS) HP LTFS makes tape self-describing, file-based, and easy-to-use, it also provides users with the ability to use standard file operations on tape media for accessing, managing and sharing files with an interface that behaves just like a hard disk. In addition, LTFS provides the ability to share data across platforms, as you would with a USB drive or memory stick. Simply load a tape into the drive, mount it into the file system, and it becomes visible as a disk. For more information, including user guide, downloads and compatibility, visit: /go/ltfsHP StoreOpen Automation HP StoreOpen Automation is a free downloadable application that extends the LTFS capability to HP Autoloaders, HP MSL and ESL G3 Tape Libraries. By simply mounting the tape autoloader or library as a file system, the intuitive HP StoreOpen Automation interface makes it easier to copy, rename, create or move files. When a cartridge folder is selected for use, that tape is automatically moved to an available tape drive.For more information, including user guide, downloads and compatibility, visit:/go/HPStoreOpenManageability The 1/8 G2 Tape Autoloader allows web-based remote manageability; the unit can be monitored and managed from across the room or across the globe. Functions included in the management toolinclude:∙Status information on the drive and system∙System configuration operations and reporting∙System error and status logs∙Library and drive firmware upload capabilities∙Diagnostic tests and information∙Cartridge movement for maintenance and management purposes∙Cleaning cartridge support∙Security and access control∙SNMP support for IP communicationsProven Reliability With a rating of 2,000,000 robot load/unload cycles, the 1/8 G2 Tape Autoloader provides necessary high reliability for today's demanding environment. To improve reliability and longevity, all HP Ultriumproducts feature Data Rate Matching (DRM). This allows the tape drive to dynamically andcontinuously adjust the speed of the drive, from 7 MB/s to 140 MB/s, to match the speed of the host ornetwork. This increases performance, reduces mechanical wear on the tape drive and extends tapelife.Longevity Organizations need to be confident that their data in archive is still there when they need it. LTO tape media is specified with a 30 year shelf life in normal ambient conditions.Disaster Recovery and Security Removable media also has the advantage that data is held 'offline' which means that archive data on tape has the additional level of protection from the threats to on-line data from viruses, hackers and cyber-attacks. LTO-6 , LTO-5, and LTO-4. Ultrium tape drives include hardware based data encryption to prevent unauthorized access to data at rest and cartridges are available with write-once-read-many (WORM) capability to prevent accidental overwriting of data archived on the tape. Both WORM and hardware data encryption features help organizations to comply with increased data security regulations.Encryption The HP 1/8 G2 & MSL Encryption Kit provides a library-enabled encryption solution that greatlyenhances data privacy, confidentiality, and integrity of your critical business data while supportingcompliance requirements. While there are a wide range of encryption solutions available, the HP 1/8G2 & MSL Encryption Kit is intended to be an easy and affordable library-enabled solution for smallbusinesses.Protect the confidentiality and integrity of your data:The encryption kit includes two USB key server tokens, product documentation, and firmware support.One encryption kit is needed per library or autoloader and it must be physically accessible so that theUSB token can be inserted into the automation device. One of the two tokens will plug into the USBport in the autoloader or library and will generate and maintain encryption keys for the LTO-6, LTO-5and LTO-4 drives/libraries. The USB key server token uses a hardware random number generator, acryptographic module running on FIPS 140-2 Level 3 validated hardware, password authentication,and digital envelopes for strong encryption keys and security operations. The second USB token isintended to provide a backup to the first. The keys are transferred securely token-to-token for backupor export, with no exposure to insecure PCs, servers, or networks. The encryption kit provides a self-contained solution for MSL libraries with no additional software, PCs, or servers required or involved.Protect IT resources and meet compliance requirements:With the HP 1/8 G2 & MSL Encryption Kit, users can enable or disable encryption, configure the USB keyserver tokens, restore encrypted data, as well as a variety of other tasks. In addition, the LTO-6, LTO-5and LTO-4 tape drives use the Advanced Encryption Standard (AES) with the longest and most securekeys -- 256 bits. AES-256 encryption is implemented using the Galois Counter Mode (GCM). Thismethod adds Message Authentication Codes to ensure the integrity as well as privacy of the backupdata stored on tape. The HP LTO-6 LTO, 5, and LTO-4 Ultrium Tape Drives are designed to be compliantwith the standard for tape media security (IEEE 1619.1).Achieve the highest level of encryption security to secure confidential business information whilemeeting compliance guidelines with the HP 1/8 G2 & MSL Encryption Kit or KMIP 1.2 Encryption KeyManager License.Protect critical business data across an enterprise:To meet requirements for larger scale encryption key managers, the StoreEver Automation family ofalso supports KMIP 1.2 compliant key managers. With the purchase of the KMIP Encryption License,the 1/8 G2 Tape Autoloader and MSL libraries will be able to request encryption keys from KMIP 1.2compliant key managers, for data encryption and key management.For more information on servers supported, please visit: /go/BURAcompatibilityLTO Ultrium Technology HP LTO (Linear Tape Open) Ultrium Tape Drives use best of breed technology. By taking the bestfeatures from other tape technologies and combining them into a single new technology, Ultrium tapedrives are in a league of their own. Inclusion of innovative features such as Adaptive Tape Speed (ATS)ensure that Ultrium LTO technology is an open drives can meet the performance and reliabilitydemands of a library environment. Industry standard format; thus data written on HP Ultrium TapeDrives can be interchanged directly with Ultrium Tape Drives from other vendors.Investment protection HP LTO tape drives and automation products are founded on the LTO open standard and adhere to the published LTO format roadmap to Generation 8. With built-in two generation backwards readcompatibility, LTO customers can be assured of investment protection.Data Rate Matching Data Rate Matching combines sophisticated buffer management with the HP exclusive variableAdaptive Tape Speed technology, to allow the tape drive to match its transfer rate to the host speeddynamically and continuously across the wide range of transfer rates. This feature ensures that thetape drive continues to stream data regardless of the environment, and brings three big advantages:∙It optimizes performance and maximizes overall efficiency, allowing the drive to respondimmediately to any speed changes from the host.∙It minimizes rewinding and repositioning of the tape, significantly reducing physical wear andincreasing reliability.∙It minimizes the power requirements for the drive by reducing the number of repositionsneeded.LTO Ultrium Tape Drive ATS data transfer rate range (native)HP LTO-6 Ultrium 6250 54 to 160 MB/sHP LTO-5 Ultrium 3000 47 to 140 MB/sHP LTO-4 Ultrium 1760 33 to 80 MB/sHP Ultrium WORM Critical to the success of data retention policies in highly regulated environments is the ability to store and manage data in an unalterable state. Following stringent guidelines set forth by regulatoryagencies such as the SEC and HIPPA, IT organizations must now integrate new solutions and policiesthat can verify the integrity of stored data for periods that can extend well beyond seven years.The LTO-6, LTO-5, LTO-4, and LTO-3 Ultrium tape drives feature the ability to archive and store data ina non-rewriteable format that meets the most stringent regulatory guidelines. Using a combination ofintegrated fail-safe features in the drive firmware, cartridge memory, and tape formatting, the LTO-6,LTO-5, LTO-4, and LTO-3 Ultrium can archive large amounts of data for periods of up to 30 years in asecure, untampered state. Since all LTO-6, LTO-5, LTO-4, and LTO-3 Ultrium tape drives includesupport for both rewritable and WORM media, IT organizations can now easily integrate a secure, long-term archiving solution into their current data protection strategy. As compared to other technologiesthat feature support for WORM storage, the LTO-6, LTO-5, LTO-4 and LTO-3 Ultrium tape drives offer the advantages of:∙ A single drive to support all backup and archiving needs∙Two distinctive tape cartridges to easily distinguish and manage both rewriteable and WORM data cartridges∙ A specially designed WORM data cartridge with multiple integrated fail-safe features to prevent accidental or intentional overwriting of data∙Support from many backup and archiving software vendors, providing the most comprehensive and mainstream support in the industry∙The LTO open standard that offers greater choice and compatibility across all third- and fourth-generation LTO Ultrium productsNOTE: While all HP LTO-6, LTO-5, and LTO-4 Ultrium tape drives support LTO Ultrium WORM media, some third, fourth and fifth -generation LTO Ultrium tape drives from other manufacturers may not include read and write support for LTO Ultrium WORM media. For non-HP third- and fourth-generation LTO Ultrium tape drives, please check the manufacturers' specifications to ensure this support is provided if you are using your WORM media. If WORM support is not provided, the drive will eject the WORM tape cartridge immediately upon insertion into to the tape drive.HP Library and Tape Tools The 1/8 G2 Tape Autoloader is supported on The HP industry-leading diagnostic tool - HP Library and Tape Tools (L&TT). L&TT is a single, convenient program that's a snap to install and simple to operate. L&TT's intuitive user interface eliminates the need for training and deploys in less than five minutes. This robust diagnostic tool is designed for both the experienced professional and the untrained administrator. It ensures product integrity through self-diagnostics and fast resolution to device concerns. Additional information on L&TT plus download information can be found at:/support/tapetools.HP Storage Media HP recommends that you use HP-branded cartridges in the 1/8 G2 Tape Autoloader to assure thehighest level of protection for your valuable data. The test program for HP media is the most thoroughand comprehensive in the industry.All HP cartridges must satisfy an exhaustive battery of additional tests that relate directly to real lifesituations, where real data and real businesses are at stake. The benefit of the HP brand specificationfor media is consistent quality. Through the testing of thousands of HP drives and HP cartridges, theideal formulation for backup performance is defined and then continuously monitored. This hugelyresource-intensive process is unique to HP and affords deep insight into the HP+HP backup solutionfor a wide range of environments and duty cycles. Your best choice for ease of support and maximumdependability is to use HP-branded Ultrium cartridges at all times.Factory Express Portfolio for Servers and Storage HP Factory Express offers configuration, customization, integration and deployment services for HP servers and storage products. Customers can choose how their factory solutions are built, tested, integrated, shipped and deployed. Customization must comply with all relevant product specifications and factory supported configurations.Factory Express offers service packages for simple configuration, racking, installation, complex configuration and design services as well as individual factory services, such as image loading, asset tagging, and custom packaging. HP products supported through Factory Express include a wide arrayof servers and storage: HP Integrity, HP ProLiant, HP ProLiant Server Blades, HP BladeSystem, and HP 9000 servers as well as MSA, VA7xxx, EVA, and XP disk arrays, rackable tape libraries and configurable network switches.Type of service support varies by platform and product family. For more information on Factory Express services for your specific server model or storage device please contact your sales representative or go to: /go/factory-express.CompatibilityCompatibility The HP extensive compatibility testing program assures that your HP 1/8 G2 Tape Autoloader works with leading servers, operating systems, and backup applications - and not just those sold by HP. The1/8 G2 Tape Autoloader works seamlessly in many environments, making them especially suitable ifyou have a mixed system environment. For the latest list of servers, workstations, operating systems,and backup software that support the 1/8 G2 Tape Autoloader, reference the HP Data Agile BURACompatibility Matrix (Formerly EBS) at: /go/BURAcompatibility .NOTE: The 1/8 G2 Tape Autoloader requires an HBA with multiple LUN support and should not be usedwith RAID or Array controllersServer Compatibility The 1/8 G2 Tape Autoloader is supported on a wide range of HP systems. For details of which 1/8 G2 Tape Autoloader works with which systems, including third-party systems, reference the HP Data AgileBURA Compatibility Matrix (Formerly EBS) at: /go/BURAcompatibility for the latesthardware compatibility information.OS Support Reference the HP Data Agile BURA Compatibility Matrix (Formerly EBS) for the most up-to-date OS compatibility information at: /go/BURAcompatibility.Software Support Reference the HP Data Agile BURA Compatibility Matrix (Formerly EBS) for the most up-to-datesoftware compatibility information at: /go/BURAcompatibility.Warranty The warranty for this product consists of 1-year parts exchange, next business day.For increased uptime, productivity and ROI -HP Care Pack packaged services for StorageThese days, you need to get the most out of your storage investment-you can't afford not to. When you buy HP storage products and solutions, it's also a good time to think about what levels of service and support you may need. To help take the worry out of deploying, designing, maintaining, and managing your environment, we've designed a portfolio of service options that are as: flexible, reliable and scalable as your storage. Unlike storage-only vendors, we take a holistic approach to your entire environment, bridging storage, servers, blades, software and network infrastructures with our HP Care Pack packaged services for Storage.Protect your business beyond the warrantyWhen it comes to robustness and reliability, standard warranties on today's computing equipment have matured just as the technologies have matured. Good news on some fronts-but also a source of potential problems and subsequent consequences that come from depending on standard warranties alone. Standard warranty protects against product defects and some causes of downtime- but not the business. By using a standard approach to warranty uplifts, such as HP Care Pack Services, you can reduce downtime risks and be more certain of operational consistency for both mission-critical and standard business computing. Simply put, HP Care Pack Services normalize the warranty of combined products - helping you proactively guard against unplanned downtime.Extending warranties with HP Care Pack ServicesFor cost-effective upgrading or extending your standard warranty, HP Care Pack Services offer a suite of standard reactive hardware and software support services that are sold separately, or combined as with our Support Plus and Support Plus 24 services. The portfolio also provides a combination of proactive and reactive services, such as Proactive 24 Service and Critical Service. In addition, with HP Proactive Select we offer an innovative approach to service delivery that gives you the flexibility to acquire the specific proactive services you need today, then add services as your needs evolve. HP Proactive Select offers a broad set of technical or per-event type service options - including server, storage, and network, SAN device, and software, environment, installation and education services. Services that you can mix and match depending on your specific requirements, from preliminary planning and equipment delivery to installation, configuration, integration, and testing, through every level of ongoing support. Our HP Care Pack packaged services for Storage assures help when you need it most. And for many products, post-warranty HP Care Pack Services are available when your original warranty has expired.HP Storage Services: Offering reliability, flexibility and value-just like your storageHP Storage Services offers a full spectrum of customer care, from technology support to complex migrations to complete completely managed services. HP Factory Express provides customization, integration and deployment services for turnkey solutions. HP Education offers flexible, comprehensive training on storage networking, disk storage systems, and storage software to help your IT staff get the most out of your investments. And HP Financial solutions extend innovative financing and asset management programs to cost-effective buy, manage and eventually retire your older equipment.HP Storage Services, the trusted business technology experts who manage your technology in action, because when technology works, business works. /services/storageNOTE: Care Pack Services availability may vary by product and country.HP Care Pack Services are sold by HP and HP Authorized Service Partners:∙Services for customers purchasing from HP or an enterprise reseller are quoted using HP order configuration tools.∙Customers purchasing from a commercial reseller can find HP Care Pack Services at/go/lookuptoolRecommended HP Care Pack Services for optimal satisfaction with your HP product. Recommended Services HP Foundation Care 24x7 connects you to HP 24 hours a day, seven days a week for assistance on resolving issues - hardware onsite response within four hours and software call back within two hoursafter opening your case. Three years' coverage recommended with HP Care Pack Service.HP Install Storage Autoloader/Tape Drive Array ServiceFor smooth startup and better business outcomes, HP Install Storage Autoloader/Tape Drive ArrayService- this service provides initial hardware installation into your server technology environment(system configuration is not included). Leverage the full strength of HP Technology Services -customers can trust the services professionals at HP to work collaboratively with them, putting ourstrategic and technical know-how to work across their entire infrastructure.∙Allows your IT resources to stay focused on their core tasks and priorities∙Reduces implementation time, impact and risk to your storage environment/ERC/downloads/5981-9356EN.pdfHP Proactive Select ServiceHP Proactive Select Service improves your IT performance and manageability through the use of costeffective flexible services. HP provides technical expertise and best practices to accelerate ROI of yourtechnology investment. Selectable proactive services span a wide range of technology and processservices - a flexible way to purchase proactive services that fit your particular environment andsituation.HP Proactive Select Service is technology agnostic and purchased in addition to your choice ofunderlying reactive support.∙Access to a list of flexible and customizable proactive service activities∙Enhance customers' in-house IT team with complementary assistance from HP∙Improved time to solution∙Reduce business risk and project costs by accessing HP specialists∙Simplify IT operational procedures by leveraging HP best practices/v2/GetPDF.aspx/4AA2-3842ENN.pdfeSupport HP eSupport is a portfolio of technology-based services that assist you with managing your business environment - from the desktop to the data center.Support PortalThe HP support portal provides one-stop access to the information, tools and services you need tomanage the daily operations of your IT environment.Service and Support, HP Care Pack, and Warranty InformationFeatures include:∙Access to self-solve tools (including search technical knowledge base)∙Efficient logging and tracking of support cases∙Collaboration with other business and IT professionals∙Download of patches and drivers∙Access to diagnostic tools∙Proactive notification of relevant informationAccess to certain features of the support portal requires an HP service agreement. To access thesupport portal, visit /supportCustomer Technical Training Consider education as an integral part of your strategy to get the best return on investment for your HP storage solution. HP offers a variety of training courses on storage software, networking, archiving and disk storage systems. Our classes are available in many delivery modalities from traditional instructor-led courses at one of our 80 training centers worldwide to on-site training customized to your needs or online. /learn/storageHP Services Awards HP Services continues to be recognized for service and support excellence by customers, partners, industry organizations and publications around the world. Recent honors and award reflect ourservices team's dedications, technical expertise, professionalism and uncompromising commitment tocustomer satisfaction. For a list of all our awards, please visit/services/cache/433028-0-0-225-121.htmAdditional Services Information For more information about HP Care Pack Services for Storage, please visit:/services/storageIf you have specific questions, contact your local HP representative. Contact information for a representative in your area can be found at "Contact HP" Step 1 – Base ConfigurationSelect one:Model Name Model Description Part NumberHP StoreEver 1/8 G2 Tape Autoloader HP StoreEver 1/8 G2 LTO-6 Ultrium 6250 SAS Tape Autoloader C0H18A HP StoreEver 1/8 G2 LTO-6 Ultrium 6250 FC Tape Autoloader C0H19A HP StoreEver 1/8 G2 LTO-5 Ultrium 3000 Fibre Channel Tape Autoloader BL541B HP StoreEver 1/8 G2 LTO-5 Ultrium 3000 SAS Tape Autoloader BL536B HP StoreEver 1/8 G2 LTO-4 Ultrium 1760 SAS Tape Autoloader AK377B HP StoreEver 1/8 G2 LTO-4 Ultrium 1760 SCSI Autoloader AJ816B Kit Contents (for each autoloader):∙SCSI models:o(1) 2.5M PDU Power Cord, C13/C14, 10Ao(1) 6' VHDCI to HDTS68 SCSI cableo(1) RJ-45 Ethernet cableo(1) HDTS68 SCSI terminatoro Set of six rubber feet (for tabletop use)o Getting Started Postero Flyer for Yosemite Server Backup software∙SAS models:o(1) 2.5M PDU Power Cord, C13/C14, 10Aoo(1) HP SAS Min-Min 1x-2m Cable Assembly Kit (1) RJ-45 Ethernetcableo Set of six rubber feet (for tabletop use)o Getting Started Postero Flyer for Yosemite Server Backup software∙FC models:o(1) 2.5M PDU Power Cord, C13/C14, 10Ao(1) RJ-45 Ethernet cableo Set of six rubber feet (for tabletop use)o Getting Started Postero Flyer for Yosemite Server Backup softwareStep 2 - Additional OptionsNOTE: The HP StoreEver 1/8 G2 Tape Autoloader comes standard as a one drive, 8-slot unit (includes both a right and left 4-slot magazine) which is shipped rack-ready. A separate 1/8 G2 Tape Autoloader Rack Kit must be purchased to complete the rack installation. The HP 1/8 G2 Tape Autoloader ships with a PDU power cord (C13/C14, 10A, P/N 142257-002). If a 110V receptacle power cord is needed please order (P/N AF556A). For power cord options, please visit: HP Power Cord Link:/products/powercordsSelect each required option with quantities specified:Power Cord Quantity Description Part Number1 each HP C13 - Nema 5-15P US/CA 110V 10Amp 1.83m Power CordNOTE: This cord does not ship standard with 1/8 G2 TapeAutoloader.AF556A。
罗克韦尔自动化 FLEX I O 系列 D 型远程 I O 适配器模块 1794-ASBLT 安装说
Publication 1794-IN110A-EN-P - August 2005Installation InstructionsFLEX I/O Remote I/O Adapter Module1794-ASBLT Series DUse the 1794-ASBLT Series D adapter when communicating with Classic PLC-5/15 or PLC-5/25 via Remote I/O. The 1794-ASBLT Series D adapter is a replacement for the 1794-ASB Series D adapteronly whencommunicating with PLC-5/15 or PLC5/25.Important User InformationSolid state equipment has operational characteristics differing from those ofelectromechanical equipment. Safety Guidelines for the Application, Installation and Maintenance of Solid State Controls (Publication SGI-1.1 available from your local Rockwell Automation sales office or online at) describes some important differences between solid state equipment and hard-wired electromechanical devices. Because of this difference, and also because of the wide variety of uses for solid state equipment, all persons responsible for applying this equipment must satisfy themselves that each intended application of this equipment is acceptable.In no event will Rockwell Automation, Inc. be responsible or liable for indirect or consequential damages resulting from the use or application of this equipment.The examples and diagrams in this manual are included solely for illustrative purposes. Because of the many variables and requirements associated with any particularinstallation, Rockwell Automation, Inc. cannot assume responsibility or liability for actual use based on the examples and diagrams.No patent liability is assumed by Rockwell Automation, Inc. with respect to use of information, circuits, equipment, or software described in this manual.Reproduction of the contents of this manual, in whole or in part, without written permission of Rockwell Automation, Inc. is prohibited.Throughout this manual we use notes to make you aware of safety considerations.Identifies information about practices or circumstances that cancause an explosion in a hazardous environment, which may leadto personal injury or death, property damage, or economic loss.Identifies information that is critical for successful application and understanding of the product.Identifies information about practices or circumstances that can lead to personal injury or death, property damage, or economic loss. Attentions help you:•identify a hazard •avoid a hazard•recognize the consequenceLabels may be located on or inside the equipment (e.g., drive or motor) to alert people that dangerous voltage may be present.Environment and EnclosureThis equipment is intended for use in a Pollution Degree 2 industrial environment, in overvoltage Category II applications (as defined in IEC publication 60664-1), at altitudes up to 2000 meters without derating.This equipment is considered Group 1, Class A industrial equipment according to IEC/CISPR Publication 11. Without appropriate precautions, there may be potential difficulties ensuring electromagnetic compatibility in other environments due to conducted as well as radiated disturbance.This equipment is supplied as "open type" equipment. It must be mounted within an enclosure that is suitably designed for those specific environmental conditions that will be present andappropriately designed to prevent personal injury resulting from accessibility to live parts. The interior of the enclosure must be accessible only by the use of a tool. Subsequent sections of this publication may contain additional information regarding specific enclosure type ratings that are required to comply with certain product safety certifications.See NEMA Standards publication 250 and IEC publication 60529, as applicable, for explanations of the degrees of protection provided by different types of enclosure. Also, see the appropriate sections in this publication, as well as the Allen-Bradley publication 1770-4.1 ("Industrial Automation Wiring and Grounding Guidelines"), for additional installation requirements pertaining to this equipment.When you insert or remove the module while backplane power is on, or connect or disconnect the serial cable with power applied to this module or the serial device on the other end of the cable, anelectrical arc can occur. This could cause an explosion in hazardous location installations. Be sure that power is removed or the area is nonhazardous before proceeding.If you connect or disconnect wiring while the field-side power is on, an electrical arc can occur. This could cause an explosion inhazardous location installations. Be sure that power is removed or the area is nonhazardous before proceeding.FLEX I/O is grounded through the DIN rail to chassis ground. Use zinc plated yellow-chromate steel DIN rail to assure proper grounding. The use of other DIN rail materials (e.g. aluminum, plastic, etc.) that can corrode, oxidize, or are poor conductors, can result in improper or intermittent grounding.Preventing Electrostatic DischargeThis equipment is sensitive to electrostatic discharge, which can cause internal damage and affect normal operation. Follow these guidelines when you handle this equipment:•Touch a grounded object to discharge potential static.•Wear an approved grounding wriststrap.•Do not touch connectors or pins on component boards.•Do not touch circuit components inside the equipment.•If available, use a static-safe workstation.2Publication 1794-IN110A-EN-P - August 2005North American Hazardous Location ApprovalRemote I/O Adapter, Cat. No. 1794-ASBLT Series DThese adapters are shipped configured for standard addressing mode. InStandard Addressing Mode, the 1794-ASBLT series D adapter can be used as a replacement for 1794-ASB series A and B remote I/O adapters.Install Your Adapter ModuleMount on a DIN Rail Before Installing the Terminal Base Units1.Hook the lip on the rear of the adapter onto the top of the DIN rail,and rotate the adapter module onto the rail.2.Press the adapter module down onto the DIN rail until flush. Lockingtab C will snap into position and lock the adapter module to the DIN rail.3.If the adapter module does not lock in place, use a screwdriver orsimilar device to move the locking tab down while pressing theadapter module flush onto the DIN rail, and release the locking tab to lock the adapter module in place. If necessary, push up on the locking tab to lock.4.Connect the adapter wiring as shown under “Wiring” later in thisdocument.Mount (or Replace) the Adapter on an Existing System1.Remove the RIO plug-in connector from the front of the adapter.2.Disconnect any wiring jumpered to the adjacent terminal base.3.Open the module latching mechanism and remove the module fromthe base unit to which the adapter will be attached.4.Push the flexbus connector toward the right side of the terminal baseto unplug the backplane connection. (When fully retracted, you will see a raised dot on the connector.)5.Release the adapter locking tab and remove the adapter module.6.Before installing the new adapter, notice the notch on the right rear ofthe adapter. This notch accepts the hook on the terminal base unit. The notch is open at the bottom. The hook and adjacent connection point keep the terminal base and the adapter tight together, reducing the possibility of a break in communication over the backplane.7.The following information applies when operating this equipment in hazardous locations:Informations sur l’utilisation de cet équipement en environnements dangereux :Products marked “CL I, DIV 2, GP A, B, C, D” are suitable for use in Class I Division 2 Groups A, B, C, D, Hazardous Locations and nonhazardous locations only. Each product is supplied with markings on the rating nameplate indicating the hazardous location temperature code. When combining products within a system, the most adverse temperature code(lowest “T” number) may be used to help determine the overall temperature code of the system. Combinations of equipment in your system are subject to investigation by the local Authority Having Jurisdiction at the time of installation.Les produits marqués "CL I, DIV 2, GP A, B, C, D" ne conviennent qu’à une utilisation en environnements de Classe I Division 2 Groupes A, B, C, D dangereux et non dangereux. Chaque produit est livré avec des marquages sur sa plaque d’identification qui indiquent le code detempérature pour les environnements dangereux. Lorsque plusieurs produits sont combinés dans un système, le code de température le plus défavorable (code de température le plus faible) peut être utilisé pour déterminer le code de température global du système. Les combinaisonsd’équipements dans le système sont sujettes à inspection par les autorités locales qualifiées au moment de l’installation.EXPLOSION HAZARD •Do not disconnectequipment unless power has been removed or the area is known to be nonhazardous. •Do not disconnectconnections to this equipment unless power has beenremoved or the area is known to be nonhazardous. Secure any external connections that mate to this equipment by using screws, sliding latches, threaded connectors, or other means provided with this product.•Substitution of components may impair suitability for Class I, Division 2.•If this product contains batteries, they must only be changed in an area known to be nonhazardous.RISQUE D’EXPLOSION •Couper le courant ou s’assurer que l’environnement est classé non dangereux avant de débrancher l'équipement.•Couper le courant ou s'assurer que l’environnement est classé non dangereux avant dedébrancher les connecteurs. Fixer tous les connecteurs externes reliés à cet équipement à l'aide de vis, loquets coulissants, connecteurs filetés ou autres moyens fournis avec ce produit.•La substitution de composants peut rendre cet équipement inadapté à une utilisation en environnement de Classe I, Division 2.•S’assurer que l’environnement est classé non dangereux avant de changer les piles.Component Identification1Remote I/O Adapter Module 2Indicators3Communication reset button (PRL)4Access door to switches S1 and S25Switches S1 and S2 (behind door)6Remote I/O cable connector 7+V dc connections8-V common connections 9Flexbus connectorATTENTIONDuring mounting of all devices, be sure that all debris (such as metal chips or wire strands) is kept from falling into the module. Debris that falls into the module could cause damage on power up.WARNINGIf you connect or disconnect wiring while the field-side power is on, an electrical arc can occur. This could cause an explosion in hazardous location installations. Be sure that power is removed or the area is nonhazardous before proceeding.3Publication 1794-IN110A-EN-P - August 20058.If the adapter module does not lock in place, use a screwdriver orsimilar device to move the locking tab down while pressing theadapter module flush onto the DIN rail, and release the locking tab to lock the adapter module in place. If necessary, push up on the locking tab to lock.9.Reinstall the module in the adjacent terminal base unit.Connect Wiring1.Connect the remote I/O cable to the removable remote I/Oconnector.2.Connect +V dc power to the left side of the lower connector, terminalA .3.Connect -V common to the left side of the upper connector, terminalB . 4.ConnectionsC andD are used to pass +V dc power (D) and -Vcommon (C) to the next module in the series (if required).Set the Addressing Mode Switches1.Lift the hinged switch cover on the front of the adapter to expose theswitches.2.Set the switches as shown below.3.Cycle power to the adapter after setting the switches.8 and 16-point Mode Switch SettingsIf you connect or disconnect the communications cable with power applied to this module or any device on the network, an electrical arc can occur. This could cause an explosion in hazardous location installations.Connect To terminalBlue Wire - RIO 1Shield Wire - RIO SH Clear Wire - RIO2If this is the last adapter, you must terminate the remote I/O link here. Use a terminating resistor connected across terminals 1 and 2. Refer to your processor manual for information on the size of theresistor.Push down and in at the same time to lock the adapter to the When the adapter is locked onto the DIN rail, gently push the flexbus connector into 20127To reduce susceptibility to noise, power analog modules and digital modules from separate power supplies. Do not exceed a total length of 32.8 ft (10m) for dc power cabling.ATTENTIONSome switches on this adapter differ from the switches on previous versions. Make certain that you identify each switch before setting.When using this addressing modeAndMode Switch 2 S1-1Mode Switch 1 S2-5Mode Switch 0 S2-8Standard (as shipped 8 and/or 16-point modules See note 1ON ON Compact8-point modules OFF ON OFF 16-point modules ONONOFFComplementary See complementary table below.Primary Chassis 8-point modules OFFOFF ON Complementary ChassisONOFF ON Complementary See complementary table below.Primary Chassis 16-point modules OFF OFF OFF Complementary ChassisON OFF OFF 1In Standard mode, this switch retains its function as switch position 1 ofrack addressing. In standard mode, the module is functionally interchangeable with 1794-ASB series A or B adapters.2In compact mode, 32-point modules appear as 8 or 16-point modules.3When programming block transfers, address analog modules as module 0if switch S1-1 is on; module 1 if switch S1-1 is off.4Publication 1794-IN110A-EN-P - August 2005I/O Rack Number Switch SettingsComplementary I/O Rack Number Switch Settings for PLC-5 ProcessorsRefer to your processor documentation for all other processors.Primary RackComplementary RackRefer to your processor documentation for all other processors.First I/O GroupI/O Rack NumberS1-8S1-7I/O Group S1-6 thru S1-1ON ON 0 (1st)Refer to addressing mode tables.OFF ON 2 (2nd)ON OFF 4 (3rd)OFFOFF6 (4th)S2-8Mode Switch 0Refer to mode selection switches, above.S2-7Hold InputsS2-6Rack Fault SelectON Hold inputs ON Disabled (default)OFFReset inputsOFFEnabledS2-5Mode Switch 1Refer to mode selection switches, above.Communication Rate Processor Restart Lockout Hold Last State S2-4S2-3Bits/sS2-2S2-1ON ON 57.6 k ON Restart ON Reset Outputs OFF ON 115.2 k 1OFFLocked outOFFHold Last StateON OFF 230.4 k 1OFFOFF230.4 k 11PLC5/15 and PLC5/25 can only support 57.6 kbps.Rack NumberS1 Switch PositionPLC5/15PLC-5/25654321Not Valid Rack 0ON ON ON ON ON ON Rack 0Rack 1OFF ON ON ON ON ON Rack 1Rack 2ON OFF ON ON ON ON Rack 2Rack 3ON ON OFF ON ON ON Rack 3Rack 4ON ON ON OFF ON ON Rack 5OFF ON OFF ON ON ON Rack 6ON OFF OFF ON ON ON Rack 7OFFOFFOFFONONONRack NumberRack NumberS1 Switch PositionPLC-5/15PLC-5/25654321Not Valid Not Valid ON ON ON ON ON OFF Rack 1Rack 1OFF ON ON ON ON OFF Rack 2Rack 2ON OFF ON ON ON OFF Rack 3Rack 3OFF OFF ON ON ON OFF Rack 4ON ON OFF ON ON OFF Rack 5OFF ON OFF ON ON OFF Rack 6ON OFF OFF ON ON OFF Rack 7OFFOFFOFFONONOFFRack NumberRack NumberS1 Switch PositionPLC-5/15PLC-5/25654321Not Valid Not Valid ON ON ON OFF ON ON Rack 1Rack 1OFF ON ON OFF ON ON Rack 2Rack 2ON OFF ON OFF ON ON Rack 3Rack 3OFF OFF ON OFF ON ON Rack 4ON ON OFF OFF ON ON Rack 5OFF ON OFF OFF ON ON Rack 6ON OFF OFF OFF ON ON Rack 7OFFOFFOFFOFFONON5Publication 1794-IN110A-EN-P - August 2005SpecificationsMounting Dimensions(Specifications - Remote I/O Adapter, Cat. No. 1794-ASBLT/DI/O Capacity 8 modulesPower Supply Power supply must be capable of providing a turn-on inrush surge current of 23 A (at 24V dc) for 2 ms for each adapter connected to the power supply.Input Voltage Rating 24V dc nominal19.2V to 31.2 V dc (includes 5% ac ripple)Communication Rate57.6 kbps 115.2 kbps 230 kbpsNOTE: PLC5/15 and PLC5/25 can only support 57.6 kbps IndicatorsPower - greenAdapter Active - green Adapter Fault - red Local Fault - red Flexbus Output Current 640 mA maximum Isolation Voltage 50V continuousTested at 850V dc for 1 s between user power and flexbus Current Draw 330 mA at 24V dc; 450 mA maximum Power Dissipation *******************Thermal DissipationMaximum1.7BTU/**********General SpecificationsDimensions3.4H x 2.7W x 2.7D inches 87H x 69W x 69D mmEnvironmental Conditions Operating TemperatureIEC 60068-2-1 (Test Ad, Operating Cold),IEC 60068-2-2 (Test Bd, Operating Dry Heat),IEC 60068-2-14 (Test Nb, Operating Thermal Shock):0 to 55 °C (32 to 131 °F)Storage TemperatureIEC 60068-2-1 (Test Ab, Unpackaged Nonoperating Cold),IEC 60068-2-2 (Test Bb, Unpackaged Nonoperating Dry Heat),IEC 60068-2-14 (Test Na, Unpackaged Nonoperating Thermal Shock):–40 to 85 °C (–40 to 185 °F)Relative Humidity IEC 60068-2-30 (Test Db, Unpackaged Nonoperating Damp Heat):5 to 95% non-condensingVibration IEC60068-2-6 (Test Fc, Operating):5g @ 10-500 HzShock IEC60068-2-27 (Test Ea, Unpackaged shock):Operating 30g Non-operating 50g Emissions CISPR 11:Group 1, Class A (with appropriate enclosure)ESD Immunity IEC 61000-4-2:4 kV contact discharges 8 kV air discharges Radiated RF ImmunityIEC 61000-4-3:10V/m with 1kHz sine-wave 80%AM from 30MHz to 2000MHz 10V/m with 200Hz 50% Pulse 100%AM at 900Mhz 10V/m with 200Hz 50% Pulse 100%AM at 1890Mhz EFT/B Immunity IEC 61000-4-4:±2 kV at 5 kHz on power ports±2 kV at 5 kHz on communications ports Surge Transient ImmunityIEC 61000-4-5:±2 kV line-earth(CM) on communications ports Conducted RF Immunity IEC 61000-4-6:10Vrms with 1 kHz sine-wave 80%AM from 150 kHz to 80 MHz Enclosure Type Rating None (open-style)Conductors Wire SizeCategory 1Communications:12 AWG (2.5mm2) …22 AWG (0.34mm2) solid or stranded copper wire rated at 75°C or greater, 3/64 inch (1.2mm) insulation maximum. Power:12 AWG (2.5mm2) …22 AWG (0.34mm2) solid or stranded copper wire rated at 75°C or greater, 3/64 inch (1.2mm) insulation maximum."2 on communication ports3 on power portsTerminal Screw Torque 7 pound-inches (0.8 Nm)Remote I/O CableBelden 9463 as specified in publication ICCG-2.2Remote I/O connector Plug Part Number 942029-03Certifications (when product is marked)2C UL US UL Listed Industrial Control Equipment, certified for USand CanadaC UL US UL Listed for Class I, Division 2, Groups A, B, C and DHazardous locations, certified for US and CanadaCSA CSA certified Process Control EquipmentCSA CSA certified Process Control Equipment for Class I,Division 2, Groups A, B, C and D Hazardous locationsCE European Union 89/336/EEC EMC Directive,compliant with:EN 61000-6-4; Industrial Emissions EN 50082-2; Industrial ImmunityEN 61326; Meas./Control/Lab., Industrial Requirements EN 61000-6-2; Industrial ImmunityC-Tick Australian Radiocommunications Act compliant withAS/NZS CISPR 11, Industrial Emissions1You use this category information for planning conductor routing as described in Allen-Bradley publication 1770-4.1, Industrial Automation Wiring and Grounding Guidelines.2For the latest up-to-date information, see the Product Certification link at for Declarations of Conformity, Certificates and other certification details.Publication 1794-IN110A-EN-P - August 2005 PN 957974-12Copyright © 2005 Rockwell Automation, Inc. All rights reserved. Printed in the U.S.A.。
FLEXR GT软件用户指南说明书
interface
• Software and database management tools for disaster
recovery
• Connection management for powerful control of
cross-connects
• Real-time alarm monitoring
FLEXR GT software allows support personnel to provision, maintain and upgrade Fujitsu networks without requiring knowledge of Transaction Language 1 (TL1). Simply load the FLEXR GT software onto a laptop or desktop personal computer, connect an RS-232 serial cable or Ethernet Local Area Network (LAN) cable to an NE and log on to begin work. The software includes an impressive array of menus to speed provisioning and maintenance.
ቤተ መጻሕፍቲ ባይዱ
Multiplexing (DWDM) systems. FLEXR GT software features an
intuitive Graphical User Interface (GUI) that makes provisioning
and trouble-shooting a simple, yet powerful process. Overall,
Google Cloud VPN 配置指南说明书
2. On the VPC network page, click on Create VPC Network. 3. Fill in a Name and, optionally, a Description.
ISAKMP peer. 14. Copy this and save it somewhere secure 15. Under Routing options, choose Policy-based. 16. Under Remote network IP ranges, enter the internal IP address range of your router. 17. Under Local IP ranges, enter the local-address-selector that you created earlier.
5. Click on Create to create the VPC network.
6. Once the VPC network has been created, you will be returned to the Home Page. On the Home Page, from the menu on the left under Networking, select Hybrid Connectivity, then VPN.
C613-02084-00 REV A
Introduction | Page 3
Google Cloud VPN
Static routing
To configure static routing to a Google Cloud VPN, use the following steps: 1. Log in to your Google Cloud Account. Navigate to the Home Page. From the menu on the left,
Luminex FLEXMAP 3D Quick Guide
Luminex ® FLEXMAP 3D ® Quick Guide RnDSy-lu-2945(For full details, reference the software manual)1. Turn on instrument – the power switch is on the right side of the instrumenta. Warm up takes 30 minutesb. System will shut down the lasers after 4 hours of inactivity2. Turn on computer3. Open xPonent ® software4. Adjust probe height using the Probe Height Adjustment Tool. If the adjustment tool is not available, use a 96-well plate. (This technique may cause the probe to punch through the bottom of the plate. It may take multiple attempts to adjust properly.)a. Go to Maintenance Tab > Probe & Heaterb. For 96-well plate: use well F8 (2.1 mm) on the Probe Height Adjustment Tool or use 2 discs in 96-well platec. For 384-well plate: use well E1 (1.4 mm) on the Probe Height Adjustment Toold. Do not use any discs in Calibration/Verifi cation strip5. Run daily instrument startup routinea. Go to Maintenance Tab > Cmds & Routines > Daily Instrument Startup (dropdown menu)b. Fill reservoirs with appropriate reagentsi. diH 2Oii. 70% EtOHNOTE: Startup routine takes <10 minutes6. If needed, run calibration and verificationa.Go to Maintenance > Auto Maint > System Initializationb.Warm reagents to room temperaturec.Vortex vigorously before dropping into strip wellsd. 5 drops per reagentNOTE: Full calibration/verification takes approximately 20 minutes7. Create protocola.SETTINGS / STEP 1:i.Follow instrument setting instructions in assay protocol for sample volume, bead type, and gatesii.Volume: This is how much of the sample/well will be aspiratediii.Analysis Type: Quantitative Protocoliv.Enter number of standards (do not include the blank)v.Unless required in the PDF result file, leave controls as zerob.ANALYTES / STEP 2:i.Select bead regions analytesiii.Count = 50iv.Units = pg/mLv.Click Apply Allc.PLATE LAYOUT / STEP 3:i.Change Replicate Countii.Assign Background and Standards - this can be changed in the batchNOTE: All users can share a protocol if running the exact same analytes and bead regions8. Create standard curve for protocola.Go to Protocols Tab > Stds & Ctrls > Create New Std/Ctrl Lotsb.Choose protocol from dropdown menuc.Enter highest concentrationi.This information is on the Certificate of Analysis or Standard Value Cardd.Enter dilution as a whole numberi.Not sample dilution! Dilution factor of the standard curve.e.Highlight and apply all using arrows9. Create batcha.Select Protocolb.Associate Std Curvec.Assign Unknown Sample Wellsd.Program any options specific to your batchi.Add multiple plates Samples (optional)i.Can Import List – comma delineated list of Sample ID and Dilution Factorf.Add Sample Dilution Factori.If you add sample names after sample dilution factor, you will need to add sample dilution factor again10. Resultsa.Go to Results > Saved Batches > Select Batch to Analyzeb.Check box for all analytesc.Generate reportd.SAVE AS .PDF: Save All Buttone.SAVE AS EXCEL: Save Button for each different analyte11. System shutdowna.Remove Assay Plateb.Go to Maintenance > Auto Maint > Shutdownc.Fill off-plate reagent reservoir block with appropriate reagents and run Shutdownd.Remove off-plate reagent reservoir block, empty it and replace it in the instrumente.Exit xPonent software and shut down the instrument and computerNOTE: System shutdown takes approximately 5 minutesLearn More |/luminexGlobal************************************+16123792956North America TEL 800 343 7475Europe | Middle East | Africa TEL +44 (0)1235 529449 China*************************+86(21)52380373For research use or manufacturing purposes only. Trademarks and registered trademarks are the property of their respective owners.。
Quick Connect Basic Installation and user 说明书
Easy to install Adaptable for changesSeveral labs in one 100 % safeEasy to installPre-install and decide laterServeral labs in one100 % safeThis is an installations guide for Quick Connect Basic.Quick Connect is the new, innovative and flexible lab solution.Quick Connect is based on the concept plug and play and easy to install. BROEN-LAB has furthermore made a drilling template which makes it easi-er to drill the mounting holes for the installation of Quick Connect. For futher information see page 23.Before installation please read the chapter, Purity on page 22.PANEL MOUNTEDBUILT-IN MOUNTEDBENCH MOUNTEDEXPOSED PIPECONCEALED PIPESUSPENDED MOUNTEDDISC MOUNTEDTable of Contents 4-5 Quick Connect Basicmounted 6-7 Panelmounted 8-9 Built-inBench mounted 10-11 Exposed pipe mounted 12-13 Concealed pipe mounted 14-15 Suspended mounted 16-17 Disc mounted 18-19 Changing media type 20-21 Purity 2.0, 4.0, 5.0 22 Drilling template 23 Trouble shooting guide 24-25 Accessories and datasheets 26-27Temperature range: 0-90o CMax. working pressure: 16 bar/232 psi Inlet: BROEN-LAB UniFlex TM Materials with media contact Metals: BrassNitrile (NBR) VITON (FKM) EPDM Panel thickness up to 26 mmAssemblyCartrid g eO-ringM4 (x2) screwFront partFront ringRear PartNutFemale BROEN-LABUniFlex TMSTEP 1STEP 2STEP 3MountingDatasheetTool: A wrench key+1All measurements are in mmTemperature range: 0-90o CMax. working pressure: 16 bar/232 psiPanel thickness 1-6 mm AssemblyCover ringO-ringFront partFront ringGASInlet: Femal e BROEN-LAB UniFlex TM Materials with media contactMetals: Brass Nitrile (NBR) VITON (FKM) EPDMg eDatasheetMountingTool: Allen key 3 mm for (2x) M5x8 screws Allen key 2,5 mm for (2x) M4 screws2,5 mm 3 mmNice to know!Built-in is delivered assembled and has to be disassembled before mounting - Follow the mounting backwardsPlace the rear part from theDepending on the wall thick-Place the locking plate Place the front part over the All measurements are in mmMount with (2x) M5x8 mmTemperature range: 0-90o CMax. working pressure: 16 bar/232 psiInlet: BROEN-LAB UniFlex TM Panel thickness 30-90 mm AssemblyCoverRear PartM3x12 ScrewInlet pipeUniFlex Connection (Need to be pre-mounted)Materials with media contactMetals: Brass Nitrile (NBR) VITON (FKM) EPDMDatasheetSTEP 1STEP 2STEP 3MountingTool: A Phillips screwdriver, size 21234All measurements are in mmTemperature range: 0-90o CMax. working pressure: 16 bar/232 psi Inlet: BROEN-LAB UniFlex TM Assemblyg eM4 (x2) screwFront partFront ringRear PartFemale BROEN-LAB UniFlex compression Materials with media contactMetals: Brass Nitrile (NBR) VITON (FKM) EPDMOnly for plates where threads can be drilled.MountingTool: Allen key for M3x25 (x4) screw s A llen key for M4 (x2) screwsFront: Use (4x) M3x25 mounting screws ( included) Rear: Use (4x) M4x25 screws (included)mm STEP 3STEP 4STEP 6STEP 7STEP 8STEP 1Front:Mounting with (4x) M3 mm screws Rear:Mounting with (4x) M4 mm screwsPush the cartrigde into therear partTighten the (2x) M4 screwsPush the front ring with light forceinto placeDraw a centerline and place the sticker with the drilling template e STEP 5Slide the black cover onDrill after the green marks on thestickerNice to know!Exposed isdelivered assembled and has to bedisassembled before mounting - Follow the mounting backwards3 mmCatridgeFemaleBROEN-LAB UniFlex TMFront partFront ringRear PartTemperature range: 0-90o CMax. working pressure: 16 bar/232 psiInlet: BROEN-LAB UniFlex TM AssemblyMaterials with media contactMetals: Brass Nitrile (NBR) VITON (FKM) EPDMFor furniture without space fortightening behind the wallMountingDatasheet6STEP 8Mounting with (4x) M3x25 mm screws Push the catridge into the rear partSlide the black cover on Push the front ring with light forceinto placeTool: Allen key for (4x) M3x25 screwsA llen key for (2x) M4 screws (front mounting and media changing- includedSTEP 3STEP 4STEP 5mmNice to know!Concealed isdelivered assembledand has to bedisassembled beforemounting - Follow themounting backwardsAll measurements are in mmSTEP 2STEP 1Drill after the green and redmarks on the stickerTemperature range: 0-90o CMax. working pressure: 16 bar/232 psiPanel thickness 30-90 mm AssemblyCoverRear PartM3x12 ScrewMounting plateLocking pinsInlet pipeHoseUniFlex ConnectionInlet: BROEN-LAB UniFlex TM Materials with media contactMetals: Brass Nitrile (NBR) VITON (FKM) EPDMMountingDatasheetSTEP 2STEP 3Tool: A Phillips screwdriver , size 21234mmSTEP 1Inlet: BROEN-LAB UniFlex TM /For porous wallsTemperature range: 0-90o CAssemblyCatridge Cover, Long O-ringFemaleTMM4 (x2) screw Front partFront ring(4x) M3x25Mounting discMaterials with media contactMetals: Brass Nitrile (NBR) VITON (FKM) EPDMFront mounting in soft material where threads not can be drilledDatasheetSTEP 3STEP 4STEP 6STEP 7STEP 8STEP 1Mount the mounting disc with screws - not included Moun t the rear part with the (4x) M3 x25 mm screwsTighten the (2x) M4 mm screwsPush the front ring with light forceinto placeDraw a centerline and place the sticker with the drilling template eSTEP 5Slide the black cover onDrill after the blue and red markson the sticker All measurements are in mmWith Quick Connect is it possible to make last minute changes.It is important only to change between the gases within the same category.There are 3 categories: Non-burning gases, burning gases and water.Types of mediaThe changeable mediaNon-burning gases Burning gases WaterNot possiblePossibleMedia changingSTEP 1STEP 2Move the front ring i.e. CA by pulling it out with lightforceLoosen the (2x) M4 mm screws - only a little bit.12Push the front ring with light force into placeTighten the (2x) M4 mm screws12Tool: 3 mmSTEP 5STEP 62.0, 4.0 and 5.0 indicate the purity of the gases.2.04.05.099 %99,99 %99,999 %Changes or modifications are not allowed to be made to the equipment without prior approval from BROEN -LAB .Improper handling or use can involve risks for the user and other persons as well as damage of the equipment.The equipment can only be used for the gas type it was manufactured and labelled for. Change can be made prior to start of use, provided that the new media is listed in the data sheet, or BROEN -LAB has approved the new media.Observe the maximum pressure & temperature ranges.The equipment cannot be used for gases in the liquid phase.The equipment must not be exposed to impact, vibrations or other mechanical forces that can damage the equipment. The equipment is designed for use in laboratories. The equipment is not designed for installing where there is a possibility of exposure to aggressive media.By installation avoid oil and grease contamination (Fire or explosion hazard). It is recommended to use a proper leak detection fluid or similar to check for leak when installing and using the Quick Connect.These valves do not contain a relief valve. In case of failure, the outlet pressure may rise above the adjusted value. Anyequipment connected to the equipment Purity 5.0 in useWhen changing the outletTo maintain a purity of 5.0, BROEN-LAB recommends to purge the system in 30 sec. before usage, when you change the outlet.Safety instructionsHandling of technical gases requires knowledge of the subject, operation instructions and special safety measures. Always check national and local laws, regulations and procedures regarding the installation and use of this type of equipment., ERROR CAUSE ACTIONERROR CAUSE ACTIONThe outlet is leaking There are leaksinside the outlet Replace the o utlet with a new oneAccessorie s Datasheet s97Pressure regulatorDatasheet sAccessorie sBROEN-LAB Ltd.BROEN-LAB Singapore Pte. Ltd.BROEN-LAB A/S BROEN-LAB GmbH BROEN-LAB Sverige AB broen-lab .comINTERNATIONAL OFFICESUnit 9 Navigation Point, Golds Hill Way Tipton • West Midlands DY4 OPY • U.K.Tel. +44 121 522 4515 • Fax +44 121 522 4535E-mail:*****************10 Bukit Batok Crescent #10-02 • The Spire • Singapore 658079Tel: +65 6298 0662 • Fax: +65 6298 0468 E-mail:*****************HEAD OFFICE Drejervænget 2 • DK-5610 AssensTel. +45 6376 6376 • Fax +45 6471 2476 E-mail:*****************Tel. +45 6376 6376 • Fax +45 6471 2476 E-mail:*****************Tel. +45 6376 6376 • Fax +45 6471 2476 E-mail:*****************BROEN-LAB A/S ISO 9001 certificationIn September 1991 BROEN-LAB A/S was certified according to ISO 9001 as one of the first Danishcompanies. The certification was carried out by Bureau Veritas, Denmark, for our Danish site in Assens.The quality management system of BROEN-LAB A/S now complies with detailed specifications laid down by the internationally acknowledged EN ISO 9001:2008. This certification will further contribute to reputationfor quality and reliability of BROEN-LAB A/S.94G0243 UK 109/12-2020。
IBM Flex System Manager 产品指南说明书
IBM Flex System ManagerProduct Guide (withdrawn product)IBM® Flex System™ Manager (FSM) is a systems management appliance that drives efficiency and cost savings in the data center. IBM Flex System Manager provides a pre-integrated and virtualized management environment across servers, storage, and networking that is easily managed from a single interface. A single focus point for seamless multichassis management provides an instant and resource-oriented view of chassis and chassis resources for both IBM System x® and IBM Power Systems™compute nodes. You can reduce the number of interfaces, steps, and clicks it takes to manage IT resources, intelligently manage and deploy workloads based on resource availability and predefined policies, and manage events and alerts to increase system availability and reduce downtime while reducing operational costs.The IBM Flex System Manager management appliance is shown in the following figure.Figure 1. IBM Flex System Manager management applianceDid you know?Click here to check for updatesDid you know?IBM Flex System, a new category of computing and the next generation of Smarter Computing, offers intelligent workload deployment and management for maximum business agility. This chassis delivers high-speed performance complete with integrated servers, storage, and networking for multi-chassis management in data center compute environments. Furthermore, its flexible design can meet the needs of varying workloads with independently scalable IT resource pools for higher utilization and lower cost per workload. While increased security and resiliency protect vital information and promote maximum uptime, the integrated, easy-to-use management system reduces setup time and complexity, providing a quicker path to return on investment (ROI).IBM Flex System gives forward-thinking companies a way to completely rethink deployment and management of their IT environments; it offers an opportunity to evolve to a more open, agile, and integrated computing system that is dynamically managed from a single vantage point to simultaneously maximize efficiency and innovation.Figure 2. IBM Flex System Manager internal management network connectionsThe management network is used to complete management-related functions for the various endpoints that are managed by the IBM Flex System Manager management software, such as other Enterprise Chassis and compute nodes. During initialization, the management software discovers any Enterprise Chassis on the management network. The management node console can be connected to the management network or to the data network.The IBM Flex System Manager management node Eth1 interface (two 10 Gb Ethernet ports) must be connected to the chassis switch modules that are installed in I/O bay 1 or bay 2. This setup is referred to as the data network. You can configure a switch module in bay 1 or bay 2 to map Eth1 to one of its external Ethernet ports, as you would configure the other nodes in the chassis that are connected to the external network. The data network is used by applications and operating systems and can support data transfer rates up to 10 Gbps if a chassis switch module that is capable of 10 Gbps is installed.One of the key functions that the data network supports is discovery of operating systems on the various network endpoints. Discovery of operating systems by the IBM Flex System Manager is required to support software updates on an endpoint such as a compute node. The IBM Flex System Manager Checking and Updating Compute Nodes wizard assists you in discovering operating systems as part of the initial setup.Management task Agentlessin-band Agentlessout-of-bandPlatformAgentCommonAgentCommand Automation No No No Yes Hardware alerts and status No Yes Yes Yes Platform alerts No No Yes Yes Health and status monitoring No No Yes Yes File Transfer No No No Yes Inventory (hardware)No Yes Yes Yes Inventory (software)Yes No Yes Yes Process Management No No No Yes Power Management No Yes No Yes Remote Control No Yes No No Remote Command Line Yes No Yes Yes Resource Monitors Yes*No Yes Yes Update Manager (firmware)Yes**Yes Yes Yes Update Manager (agent updates)No No Yes Yes* Supported for VMware and Hyper-V virtualization environments** Supported for Windows environmentsThe following table shows supported virtualization environments and their management tasks.Table 6. Supported virtualization environments and management tasksVirtualization environment Management task AIX andLinux*IBM i VMware ESXwith vCenterMicrosoftHyper-VLinuxKVMDeploy virtual servers Yes Yes Yes Yes Yes Deploy virtual farms No No Yes No Yes Relocate virtual servers Yes Yes**Yes No Yes Maintenance mode Yes No Yes No Yes Import virtual appliance packages Yes Yes No No Yes Capture virtual servers Yes Yes No No Yes Capture workloads Yes Yes No No Yes Deploy virtual appliances Yes Yes No No Yes Deploy workloads Yes Yes No No Yes Deploy server system pools Yes Yes No No Yes Deploy storage system pools Yes Yes No No No* Linux on IBM Power Systems compute nodes** Supported only for virtual servers that are running IBM i v7.1, TR4 PTF group SF99707 level 4, or later. The following table shows supported I/O modules and their management tasks.Table 7. Supported I/O modules and management tasks (Part 1)I/O module Management task EN2092EN4091EN4093EN4093RCN4093SI4093Discovery Yes Yes Yes Yes Yes Inventory Yes Yes Yes Yes Yes Monitoring Yes Yes Yes Yes Yes Alerts Yes Yes Yes Yes Yes Protocol configuration Yes No Yes Yes No VLAN configuration Yes No Yes Yes No CEE configuration No No Yes Yes No EVB configuration No No Yes Yes No Stacked switch management No No Yes No NoTable 7. Supported I/O modules and management tasks (Part 2)I/O moduleManagement taskEN4023Cisco B22FC3171FC5022IB6131 Discovery Yes Yes Yes Yes Yes Inventory Yes Yes Yes Yes Yes Monitoring Yes Yes Yes Yes Yes Alerts Yes Yes Yes Yes Yes Protocol configuration No No Yes No No VLAN configuration No No No No No CEE configuration No No No No No EVB configuration No No No No No Stacked switch management No No No No NoThe following table shows supported virtual switches and their management tasks.Table 8. Supported virtual switches and management tasksVirtualization environment Linux KVM VMware vSphere PowerVM Hyper-V Virtual switchManagement taskPlatform Agent VMware IBM 5000V PowerVM Hyper-V Discovery Yes Yes Yes Yes No Inventory Yes Yes Yes Yes No Configuration management Yes Yes Yes Yes No Automated logical networkprovisioning (ALNP)Yes Yes Yes Yes NoThe following table shows supported storage systems and their management tasks.Table 9. Supported storage systems and management tasksTrademarksLenovo and the Lenovo logo are trademarks or registered trademarks of Lenovo in the United States, other countries, or both. A current list of Lenovo trademarks is available on the Web athttps:///us/en/legal/copytrade/.The following terms are trademarks of Lenovo in the United States, other countries, or both:Lenovo®Flex SystemSystem x®The following terms are trademarks of other companies:Intel® and Xeon® are trademarks of Intel Corporation or its subsidiaries.Linux® is the trademark of Linus Torvalds in the U.S. and other countries.Hyper-V®, Internet Explorer®, Microsoft®, and Windows® are trademarks of Microsoft Corporation in the United States, other countries, or both.Other company, product, or service names may be trademarks or service marks of others.。
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Technical Guide: Upgrading Flex 3 applications to Flex 4 SDKTechnical Guide: Upgrading Flex 3 applications to Flex 4 SDK (1)About This Document (3)Introduction (3)MXML 2009 (4)Namespaces (4)States (5)New MXML Tags (6)Declarations (6)Library (6)Definition (6)Private (7)Reparent (8)DesignLayer (8)Two-way Data Binding (8)MXML Graphics and FXG (9)MXML Graphics (9)FXG (10)CSS (13)Flex Themes (15)Creating a Flex Theme (15)Applying a Theme (17)Spark Components (18)The Skinning Contract – Skinning Spark Components (20)Data (21)Parts (21)States (21)Creating Spark Components and Skins (22)Spark Components and Skins Lifecycle (24)New Layout Engine (26)Existing Spark Layouts (26)BasicLayout (26)HorizontalLayout (27)TileLayout (27)VerticalLayout (27)Layout Mirroring (28)Creating Custom Spark Layouts (28)New Animation Engine (31)Built-in Effects (31)Advanced Effects (33)What’s New in Adobe AIR 2 (36)Native Processes (36)Updated Version of WebKit (36)The New Networking API (37)Better Operating System Integration (37)Local Audio Recording (38)More AIR 2 Features (38)Text Layout Framework (39)Working with Fonts (39)Working with Flex 3 Components and Flex 4 Components in the Same Project (41)Migrating Flex 3 Projects to Flex 4 (42)New Features in Flash Builder 4 (43)Additional Resources (44)About This DocumentThis technical guide is for developers who are upgrading to Flex 4 SDK. By upgrading, we mean "beginning to use the new version of Flex." It focuses on the material you’ll want to know as you begin to use this new version of Flex. Though you will likely find information in this guide that you can use if you are migrating a Flex project, that is, to move and update a project from one version of Flex to the next, there are other documents that are more focused on moving and updating a project from earlier versions of Flex to Flex 4 (see Chapter 4 of the Adobe Flex 4 Features and Migration Guide, for example). Also, see the Migrating Flex 3 Projects to Flex 4 section of this document for an overview of the migration process.While it is impossible to cover all the aspects of any nontrivial framework or language in only 40 pages, we are confident that after reading this document you’ll manage to find your way on Flex 4 projects. On the web there are many interesting articles on Flex and there is extensive documentation on the Adobe website. This document is not intended to duplicate that content. Instead, we have strived to keep it focused on what you need to know, so you have enough information to get started and you know where to look for more.About the authorsMihai Corlan is a platform evangelist with Adobe Systems. For the past two years he’s been speaking at conferences or talking with partners and clients around the world. He focuses on Flex, AIR, and Flex Builder. You can follow him on his blog or twitter. Alin Achim is a computer scientist with Adobe Systems. He is part of a team charged with building software used by Adobe employees. Flex (combined with various server side technologies) forms the backbone for the solutions they build.IntroductionIf you remember the transition from Flex 2 to Flex 3, you may recall that it was fairly nice and easy to follow. Compared to that, Flex 4 is a revolution: some aspects of the framework were changed and many new features were added.The most notable new features are:• A new UI component architecture named Spark that works along with the old one (MX)•The Spark architecture separates the skinning and layout from the data and behavior.• A new animation engine•The addition of FXG and MXML graphics•New MXML language features•The addition of text controls based on the Text Layout Framework•Charts, advanced data grid, and OLAP data grid are now part of the open source Flex SDK.MXML 2009To enable the changes to the MXML language, a new namespace was created. This chapter covers the new tags in MXML 2009 and the different namespaces available. NamespacesThe first big change in Flex 4 is the separation of the namespace for the MXML language from the one for the components library. Thus, in Flex 4 applications you now specify the namespace for the MXML language (2009 or 2006). You also specify the namespace for the Spark components library and MX components library if you want to use them. This separation is needed because there are components with the same name in both libraries (for example Button, Label, and so on).You can still use the 2006 namespace, but you cannot use Flex 4 features (including the new components, new states engine, or layout schemes) with it. You also cannot mix the language namespaces in the same document. You can however, have some documents that use MXML 2009 and other documents that use MXML 2006.Here are the main namespaces for Flex 4:•MXML language declaration:xmlns:fx="/mxml/2009"•MX components (includes all of the components in the Flex mx.* packages, the Flex charting components, and the Flex data visualization components):xmlns:mx="library:///flex/mx"•Spark components (includes all of the components in the Flex spark.* packages and the text framework classes in the flashx.* packages):xmlns:s="library:///flex/spark"•Old Flex 3 and MX components library (when you don’t want to use the new language features or Spark components):xmlns:mx="/2006/mxml"For example:<s:Application xmlns:fx="/mxml/2009"xmlns:mx="library:///flex/mx"xmlns:s="library:///flex/spark"><fx:Style></fx:Style><s:Button label=”This is a Spark button!”/><mx:Button label=”This is a MX button!”</s:Application>If you work with Flash Catalyst and Illustrator or Photoshop to create skins for Flex applications you might see other namespaces as well; for example:xmlns:ai="/ai/2009"xmlns:d="/fxg/2008/dt"xmlns:flm="/flame/2008"These namespaces are either related to the FXG or used internally by Flash Catalyst, Flash Builder, Illustrator, or Photoshop.StatesOne of the major enhancements in Flex 4 was made to simplify how states are managed. If you want to use states in a component or MXML document you use a <s:States> tag as a direct child of the root tag to declare any number of states, and then you can use the attributes includeIn and excludeFrom on any component to specify whether the component is present in a given state. You change the state using the currentState property; for example:<?xml version="1.0" encoding="utf-8"?><s:Application xmlns:fx="/mxml/2009"xmlns:s="library:///flex/spark"xmlns:mx="library:///flex/mx"><s:states><s:State name="default"/><s:State name="report"/><s:State name="form"/></s:states><s:CheckBox label="Checkbox" includeIn="report, form"/><sButton id=”b1” label=”Change state” click=”currentState=’form’;”/><s:TextInput excludeFrom="form"/>In addition, you can set the value for any attribute of an MXML component by appending the state name to the attribute with dot notation; for example:<s:CheckBox label.default ="Checkbox" label.report=”Report Name:”label=””/>Flex 4 also introduced the stateGroups attribute, which lets you group and apply two or more states together; for example:<s:states><s:State name="A" stateGroups="G1"/><s:State name="B" stateGroups="G2"/><s:State name="C" stateGroups="G1"/></s:states>…<s:Button label="Button A" includeIn="G1"/><s:Button label="Button B" includeIn="G2"/><s:Button label="Button C" includeIn="G1"/>The code above produces the following results:New MXML TagsIn addition to the existing MXML tags (Binding , Component , Metadata , Model , Script , Style , XML , XMLList ) there are six new tags in Flex 4: Declarations , Definition, DesignLayer , Library , Reparent , and Private Declarations. In Flex 4, any components you declare that are not UI components must be placed inside of a Declarations tag; for example:<?xml version="1.0"?><s:Application xmlns:fx="/mxml/2009"xmlns:mx="library:///flex/mx"xmlns:s="library:///flex/spark"><fx:Declarations><s:HTTPservice id=”myService”/></fx:Declarations><s:Button label=”My Button” /></s:Application>If you don’t place your non-UI components inside a Declarations Librarytag, you’ll get an error at compile time. Use the <fx:Library> tag to define one or more named graphic <fx:Definition> children (see Definition below). The definition itself in a library is not an instance of that graphic, but it lets you reference that definition any number of times in the document as an instance. The Library tag must be the first child of the document’s root tag. You can only have one Library Definitiontag per document. You use an <fx:Definition> tag inside an <fx:Library> tag when you want to declare a UI component inside of a MXML file and use the component somewhere else in the file. This is the equivalent of defining the component in a separate MXML or ActionScript file. Each Definition created must have a name attribute defined. This is needed to use the component in your code. Defining a component using theDefinition tag doesn’tHere is an example: <?xml version="1.0"?><s:Application xmlns:fx="/mxml/2009"xmlns:mx="library:///flex/mx"xmlns:s="library:///flex/spark"><fx:Library><fx:Definition name="MySquare"><s:Group><s:Rect width="100%" height="100%"><s:stroke><s:SolidColorStroke color="red"/> </s:stroke></s:Rect></s:Group></fx:Definition></fx:Library><mx:Canvas><fx:MySquare x="0" y="0" height="20" width="20"/><fx:MySquare x="25" y="0" height="20" width="20"/></mx:Canvas></s:Application>Each Definition in the Library Privatetag is compiled into a separate ActionScript class that is a subclass of the type represented by the first node in the definition. In the example above, the new class is a subclass of mx.graphics.Group. The scope of this class is limited to the document, so you should treat it as a private ActionScript class. The <fx:Private>The compiler ignores all content of the tag provides meta information about the MXML or FXG document. The tag must be a child of the root document tag, and it must be the last tag in the file. <fx:Private> tag, although it must be valid XML. The XML can be empty, contain arbitrary tags, or contain a string of characters; for example: <?xml version="1.0"?><s:Application xmlns:fx="/mxml/2009"xmlns:mx="library:///flex/mx"xmlns:s="library:///flex/spark"><mx:Canvas><fx:MySquare x="0" y="0" height="20" width="20"/><fx:MySquare x="25" y="0" height="20" width="20"/></mx:Canvas><fx:Private><Date>10/22/2008</Date><Author>Nick Danger</Author></fx:Private></s:Application>ReparentYou use the <fx:Reparent>tag to change the parent container of a component as part of a change of view state:<fx:Reparent target="targetComp" includeIn="stateName">The target property specifies the target component, and includeIn specifies a view state. When the current view state is set to stateName, the target component becomes a child of the parent component of the <fx:Reparent> tag. Here is an example:<s:states><s:State name="Parent1"/><s:State name="Parent2"/></s:states><mx:HDividedBox height="25%" width="100%" borderStyle="inset"><mx:VBox id="VB1><mx:Button id="setCB" includeIn="Parent1"/></mx:VBox><mx:VBox id="VB2"><fx:Reparent target="setCB" includeIn="Parent2"/></mx:VBox></mx:HDividedBox>DesignLayerThe <fx:DesignLayer>Two-way Data Binding tag is for internal use only. Flash Catalyst uses this tag, for example.With two-way data binding a variable is bound to a property of an object, such that any time one of them is updated the other is automatically updated. When the value of the variable changes, the object automatically updates its property, and when the object property changes, the variable is updated automatically.In Flex 3, two-way data binding was implemented using a combination of curly braces, <mx:Binding>statements, and calls tothe mx.binding.utils.BindingUtils.bindProperty()method.Flex 4 introduces some shorthand ways to accomplish this. The two ways to specify a two-way data binding are:1.Via an inline declaration using the @{bindable_property} syntax; for example:<s:TextInput id="t1" text="@{t2.text}"/><s:TextInput id="t2"/>2.Via MXML; for example:<fx:Binding source="a.property" destination="b.property" twoWay="true”/>MXML Graphics and FXGAmong the biggest changes introduced in Flex 4 is the addition of MXML graphics and support for FXG. While both of these concepts deal with drawing vector based graphics, they are not the same.MXML GraphicsMXML graphics are a collection of classes that you can use to define interactive graphics—that is, graphics that can be changed at runtime. This is not a new language, but an addition to the MXML language and Flex framework. These classes are part of the Flex SDK (most of them are part of the mx.graphics and spark.primitives packages) and the MXML compiler maps each MXML graphic tag to a corresponding ActionScript class. MXML graphic tags can be added as children of the root Application tag or any other container or group. They have an implicit depth order: each tag is rendered on top of the previous sibling. Because each tag is backed by an ActionScript class, you can create graphics using ActionScript instead of MXML.MXML graphics define:•Graphics and text primitives•Fills, strokes, gradients, and bitmaps•Filters, masks, alphas, transforms, and blend modessYou can write the MXML graphics code using a code editor or you can use a tool such as Flash Catalyst to generate the code. Typically, you use MXML graphics to create the skins for Flex 4 components.For example, you can use MXML graphics to draw this shape:Here is the code:<?xml version="1.0" encoding="utf-8"?><s:Application xmlns:fx="/mxml/2009"xmlns:s="library:///flex/spark"xmlns:mx="library:///flex/mx"><s:Group x="50" y="50"><s:Rect height="75" radiusX="5.62472" radiusY="5.99958" width="75"x="0.5" y="0.5"><s:fill><s:SolidColor color="#494848"/></s:fill><s:stroke><s:SolidColorStroke caps="none" joints="miter" miterLimit="10" weight="1"/></s:stroke><s:filters><s:GlowFilter alpha="0.56" blurX="7.5" blurY="7.5"color="#777777" inner="true" quality="2" strength="2"/></s:filters></s:Rect><s:Group x="22" y="28"><s:Line x="0" xFrom="37" y="14"/><s:Path data="M 36.785 11.654 L 23.489 11.654 L 22.785 11.654 L 22.785 0 L 0 13.154 L 22.785 26.309 L 22.785 14.654 L 23.489 14.654 L36.785 14.654 L 36.785 11.654 Z" winding="nonZero" x="0.215" y="0.346"><s:fill><s:SolidColor color="#FFFFFF"/></s:fill></s:Path></s:Group></s:Group></s:Application>FXGFXG is an XML-based graphics interchange format for the Adobe Flash Platform. You can use Adobe Illustrator and Adobe Photoshop to create graphical assets, export them as FXG, and use them in Flex.You can’t use the FXG language inside of MXML documents/components; instead you define separate .FXG files and then reference these files inside of MXML. The root tag for an FXG document is always <Graphic> and there can be only one <Graphic> node in a FXG document. For example you could define AlphaMaskComponent.fxg as follows:<?xml version="1.0" encoding="utf-8"?><!-- /comps/AlphaMaskComp.fxg --><Graphic xmlns="/fxg/2008" version="2"><Ellipse width="400" height="200" maskType="alpha"><mask><Group><Rect width="100" height="100"><fill><SolidColor alpha="0.1"/></fill></Rect></Group></mask><fill><SolidColor color="#FF00FF"/></fill></Ellipse></Graphic>You would then use it in MXML like this:<?xml version="1.0" encoding="utf-8"?><s:Applicationxmlns:fx="/mxml/2009"xmlns:mx="library:///flex/mx"xmlns:s="library:///flex/spark"xmlns:comps="comps.*"><comps:AlphaMaskComponent/></s:Application>Most FXG elements have MXML graphic equivalents, although FXG elements support only a subset of the attributes supported by MXML graphics tags.Here are some differences and similarities between FXG and MXML graphics:•Both are used to create graphics in Flex applications.•FXG is compiled (the FXG rendering model follows the Flash Player 10 rendering model very closely, and the compiler optimizes FXG directly into SWF tags understood natively by Flash Player). MXML graphics are rendered at runtime (the Flex compiler transforms them into ActionScript, which is transformed into ActionScript bytecode). Thus FXG is highly optimized when compared to the same graphic drawn using MXML graphics.•FXG uses its own namespace (/fxg/2008), whereas MXMLnamespace).•Because FXG is highly optimized at compile time, it can’t be changed at runtime. Thus if you want to use it for skinning a button you won’t be able to add different colors for the background for each state (over, disabled, up, and down). Likewise, no data binding or event handling is available in FXG.For more information, see FXG and MXML graphics.CSSFlex 4 has significantly improved support for styling Flex applications using CSS. Within the CSS file, you need to specify the namespace of the Flex library you want to customize using CSS. For example, the following CSS file sets the styles for the MX Button and Spark Button: /* CSS file */@namespace s "library:///flex/spark";@namespace mx "library:///flex/mx";s|Button {color:#ffffff;}mx|Button {color:#ffffff;}You can use multiple classes for the same component. For example, if you’ve defined two CSS classes called buttonOk and buttonGreen, you can apply styles to both of them using the following code:<fx:Style>@namespace s "library:///flex/spark";@namespace mx "library:///flex/mx";.buttonOK {font-size: 12;}.buttonGreen {color: #00ff00;}</fx:Style><s:Button styleName=”buttonOk buttonGreen”/>You can also define and apply styles using ID selectors; for example:<fx:Style>@namespace s "library:///flex/spark";@namespace mx "library:///flex/mx";#myButton {color:#ffffff;}</fx:Style><s:Button id=”myButton”/>You can use descendant selectors. For example, you can apply a style only to buttons<fx:Style>@namespace s "library:///flex/spark";@namespace mx "library:///flex/mx";s|Panel s|Button {color:#ffffff;}</fx:Style><s:Panel><s:Button label="White label"/></s:Panel><s:Button label="Black label"/>You can use pseudo selectors; for example:<fx:Style>@namespace s "library:///flex/spark";@namespace mx "library:///flex/mx";s|Button:over {color: #000000;}s|Button:up {color: #ffffff;}</fx:Style><s:Button label=”My Button”/>To apply style sheets at runtime, compile the CSS file into a SWF and load this SWF using the StyleManger loadStyleDeclaration() method. Here are the basic steps to achieve this in Flash Builder:1.Create a CSS file; for example myStyle.css2.In Flash Builder right-click the file in the Package Explorer and select Compile CSS to SWF. You will find a myStyle.swf file inside the bin-debug3.When you want to load this style at runtime, use folder.loadStyleDeclarations; for example:styleManager.loadStyleDeclarations("myStyle.swf");The first parameter is the path of the SWF file and the second (optional) parameter specifies whether the style is applied immediately after it is loaded (this is the default behavior).Flex ThemesA theme defines the look and feel of an application. It can define a limited set of styles, for example the font size and family, or it can redefine all Flex UI components using a mix of CSS, images, and skins.The default theme for a Flex 4 application is called Spark. Thus all Flex UI components in Flex 4 have this theme by default, including the MX components (Flex 3 components). You can change the theme using the theme compiler argument. If you use Flash Builder 4, you can use the Properties dialog box to apply themes to an existing project and to add new themes.Flash Builder offers a number of themes to choose from, and if you want, you can create your own themes. It is possible to apply multiple themes to the same project. However, if the themes you apply set the appearance for the same element, then, as with CSS, the last theme applied takes precedence.If you want the MX components to have the Flex 3 look and feel, then you can use the Halo theme. Note that Spark components will use the same skin as the one defined by the Spark theme.You can find the code for the built-in themes in the Flex 4SDK/frameworks/themes/Creating a Flex Theme folder.In general, themes take the form of a SWC file, which comprises a CSS file and skinning assets. The skinning assets can be images (JPEG, GIF, PNG) or programmatic assets compiled into an SWF file.You can also create a theme by using only a CSS file as is without compiling it into a SWF file. Alternatively, you can have a CSS file and a SWF file (this is how the AeonGraphical skin was created).For example, consider a situation in which you’ve created two programmatic skins, SpecialButtonSkin and SpecialCheckBoxSkin, in MXML. You’ve also created the following CSS file, which references these class names://mycss.css@namespace s "library:///flex/spark";s|Button {skinClass: ClassReference("SpecialButtonSkin");}s|CheckBox {skinClass: ClassReference("SpecialCheckBoxSkin");}s|panel {color:#ff0000;}You could then use the command line component compiler (compc) with the include-file and include-classes options to include the CSS, image assets, and skins. Use the o option to specify the output theme SWC file; for example:compc -source-path c:/projects/flex/mytheme-include-file mycss.css c:/projects/flex/mytheme/mycss.css-include-classes SpecialButtonSkin SpecialCheckBoxSkin-o c:/projects/flex/MyTheme.swcInstead of passing all these arguments on the command line, you can create a Flex Config file and pass it as an argument to the load-config option to the compc command; for example:compc –load-config myconfig.xmlThe following Flex configuration file can be used in place of the command line options in the example above:<?xml version="1.0"?><flex-config><output>MyTheme.swc</output><include-file><name>mycss.css</name><path>c:/projects/flex/mytheme/mycss.css</path></include-file><include-classes><class> SpecialButtonSkin </class><class> SpecialCheckBoxSkin</class></include-classes></flex-config>You can also invoke the component compiler to make a theme SWC file by creating a Library Project in Flash Builder.For more information see, see Creating a theme SWC file.Applying a ThemeYou can apply a theme using the theme option and the MXML compiler; for example:mxmlc -theme="C:\ProgramFiles\Adobe\Flex\sdks\4.0.0\frameworks\themes\Halo\halo.swc" MyApp.mxml Alternatively, you can open the Flash Builder Properties dialog box for the project you want to customize and select the theme you want. (If it is not already there, you can import the theme before applying it.)One final note: You can’t apply a theme by just adding it to the libs folder. If you want to apply themes at runtime, read the CSS chapter to learn how (basically you use a SWF instead of a SWC and call the StyleManager loadStyleDeclarations method).Spark ComponentsMany of the features presented in this guide so far can be seen as evolutionary features: small improvements or additions. The Spark components are definitely a revolutionary feature. The new Spark component architecture, introduced in Flex 4, is a significant departure from the previous MX component model of Flex 3 and Flex 2.In a nutshell, Spark components introduce a clear separation between the logic and data of a component and its visual appearance (skin). To support this separation, every Spark component has at least two classes.One class (typically written in ActionScript) gives the component MXML tag name (for example, Button) and encapsulates the core behavior of the component: defining what events the component dispatches, the data represented by the component (for a button this could be the label), and managing subcomponents and states (for a button these could be up, down, over, and disabled).Coupled with this class there is a skin class that manages everything related to how the component is rendered on the screen including layout, animation, changing appearance in different states, transitions, and representing the data. Typically you create a skin class using MXML graphics, FXG, or both.From a tooling perspective, you can use a text editor to create the skin class or you can use the new workflows enabled by Flash Catalyst and Illustrator or Photoshop to create the skins visually.。