Single top quark production via SUSY-QCD FCNC couplings at the CERN LHC in the unconstraine
LT8637 42V, 5A Synchronous Step-Down Silent Switch
1Rev. 0DESCRIPTIONLT863742V, 5A Synchronous Step-Down Silent Switcherwith 2.5μA Quiescent CurrentDemonstration circuit 3020A is a 42V, 5A (7A Peak) syn-chronous step-down Silent Switcher ® with spread spec-trum frequency modulation featuring the L T ®8637. The demo board is designed for 5V output from a 5.8V to 42V input. The wide input range allows a variety of input sources, such as automotive batteries and industrial sup-plies. The LT8637 is a compact, low emission, high effi-ciency, and high frequency synchronous monolithic step-down switching regulator . The LT8637 is the same as the LT8636, except it has a VC pin for external compensation. This allows the customer to optimize the loop response, or to parallel multiple regulators for higher current appli-cations. The proprietary Silent Switcher architecture mini-mizes electromagnetic emissions with simplified filter and reduced layout sensitivity. Selectable spread spectrum mode further improves EMI performance, making it per-fect solution to the noise sensitive applications. The regu-lator’s ultralow 2.5μA quiescent current–with the output in full regulation–enables applications requiring highest efficiency at very light load currents, such as automotive and battery powered portable instruments.Peak current mode control with minimum on-time of as small as 30ns allows high step-down conversion even at high frequency. The LT8637 switching frequency can be programmed either via oscillator resistor or external clockAll registered trademarks and trademarks are the property of their respective owners.PERFORMANCE SUMMARYover a 200kHz to 3MHz range. The default frequency of demo circuit 3020A is 2MHz.The SYNC/MODE pin on the demo board DC3020A is grounded (JP1 at BURST position) by default for low ripple Burst Mode ® operation. To synchronize to an external clock, move the Jump JP1 to SYNC/FCM and apply the external clock to the SYNC terminal ON THE 3020A. In sync mode, the part runs in forced continuous mode. Without external clock applied, the SYNC/MODE pin is floating, and the part runs in forced continuous mode. This mode offers fast transient response and full frequency operation over a wide load range. Alternatively, move the Jump JP1 to the SPREAD-SPECTRUM, and the SYNC/MODE is tied to INTVCC, the part runs in forced continuous mode with spread spectrum function enabled. The LT8637 data sheet gives a complete description of the part, operation and application information. The data sheet must be read in conjunction with this demo manual for demo circuit 3020A. The layout recommendations for low EMI operation and best thermal performance are available in the data sheet section Low EMI PCB Layout and Thermal Considerations and Peak Output Current. Contact ADI applications engineer for support.Design files for this circuit board are available .Specifications are at T A = 25°CSYMBOL PARAMETERCONDITIONSMIN TYPMAX UNITSV IN_EMI Input Supply Range with EMI Filter 5.842V V OUT Output Voltage4.855 5.15V I OUT Maximum Output Current Derating is Necessary for Certain V IN and Thermal Conditions 5Af SW Switching Frequency 1.852 2.15MHz EFFEfficiencyV IN = 12V, I OUT = 3A94.4%QUICK START PROCEDUREDemonstration circuit 3020A is easy to set up to evalu-ate the performance of the LT8637. Refer to Figure 1 for proper measurement equipment setup and follow the procedure below:NOTE: When measuring the input or output voltage ripple, care must be taken to avoid a long ground lead on the oscilloscope probe. Measure the output voltage ripple by touching the probe tip directly across the output capacitor.1. Make sure the Jump JP1 is on the BURST position. Refer to the schematic.2. With power off, connect the DC power supply to VEMI and GND. Connect the load from VOUT to GND.3. Connect the voltage meter across the VIN_SENSE and GND for V IN measurement, and VOUT_SENSE and GND for V OUT measurement.4. Turn on the power at the input.NOTE: Make sure that the input voltage does not exceed 42V.5. Check for the proper output voltage (V OUT = 5V). NOTE: If there is no output, temporarily disconnect theload to make sure that the load is not set too high or is shorted.6. Once the proper output voltage is established, adjust the load within the operating ranges and observe the output voltage regulation, ripple voltage, efficiency and other parameters. For efficiency measurement, use the VIN_SENSE, GND, and VOUT_SENSE, GND accordingly.7. An external clock can be added to the SYNC terminal when SYNC function is used (JP1 on the SYNC position). When JP1 is in SYNC, and no external clock is connected to the SYNC terminal of the board, the SYNC/FCM pin is floating, and the LT8637 runs in forced continuous mode. JP1 can also set LT8637 in spread spectrum mode (JP1 on the SPREAD-SPECTRUM position).Figure 1. Proper Measurement Equipment Setup2Rev. 0QUICK START PROCEDUREEfficiency, 12V IN, FCMFigure 2. Efficiency vs Load Current, 12V IN, V OUT = 5VCISPR25 Radiated Emission Test with Class 5 Average LimitsFigure 3. Radiated Emission Test with CISPR 25, Average Limit, SS Mode. V IN = 14V, I OUT = 5A, V OUT = 5V3Rev. 0PARTS LISTITEM QTY REFERENCE PART DESCRIPTION MANUFACTURER/PART NUMBERRequired Circuit Components11C1CAP., 22µF, ALUM. ELECT., 63V, 20%, 6.3mm × 7.7mm, CE-BS SUN ELECTRONIC INDUSTRIES CORP, 63CE22BS 23C2, C10, C11CAP., 10µF, X7R, 50V, 10%, 1210, NO SUBS. ALLOWED MURATA, GRM32ER71H106KA12L32C3, C4CAP., 1µF, X5R, 50V, 10%, 0603AVX, 06035D105KAT2A41C5CAP., 0.1µF, X7R, 16V, 10%, 0603WURTH ELEKTRONIK, 885012206046 51C6CAP., 10pF, X7R, 50V, 10%, 0603AVX, 06035C100KAT2A61C7CAP., 100µF, X5R, 6.3V, 10%, 1206MURATA, GRM31CR60J107KE39L72C8, C16CAP., 1µF, X7R, 10V, 10%, 0603AVX, 0603ZC105KAT2A83C12, C13, C15CAP., 0.1µF, X7R, 50V, 10%, 0402AVX, 04025C104KAT2A91C17CAP., 560pF, C0G, 50V, 5%, 0603AVX, 06035A561JAT2A101C18CAP., 68pF, C0G, 50V, 5%, 0603AVX, 06035A680JAT2A111FB1IND., 30Ω AT 100MHz, FERRITE BEAD, 25%, 5A, 10mΩ, 0603TDK, MPZ1608S300ATAH0121L1IND., 2.2µH, 20%, 18.1A, 6.70mΩ, 6.56mm × 6.36mm,COILCRAFT, XEL6060-222MEBXEL6060, AEC-Q200131L2IND., 0.33µH, 20%, 19.2A, 3.52mΩCOILCRAFT, XAL5030-331MEB142R1, R4RES., 100k, 1%, 1/10W, 0603, AEC-Q200VISHAY, CRCW0603100KFKEA151R2RES., 17.8k, 1%, 1/10W, 0603, AEC-Q200NIC, NRC06F1782TRF161R3RES., 243k, 1%, 1/10W, 0603VISHAY, CRCW0603243KFKEA171R6RES., 1M, 1%, 1/10W, 0603, AEC-Q200VISHAY, CRCW06031M00FKEA181R7RES., 0Ω, 1/10W, 0603, AEC-Q200VISHAY, CRCW06030000Z0EA191R9RES., 8.06k, 1%, 1/10W, 0603YAGEO, RC0603FR-078K06L201U1IC, SYN. STEP-DOWN Silent Switcher, LQFN-20, 42V, 5A/7A ANALOG DEVICES, LT8637EV#PBF Additional Demo Board Circuit Components10R8RES., OPTION, 0603Hardware: For Demo Board Only14E2, E9, E11, E12TEST POINT, TURRET, 0.064" MTG. HOLE, PCB 0.062" THK MILL-MAX, 2308-2-00-80-00-00-07-0 26E4-E8, E10TEST POINT, TURRET, 0.094" MTG. HOLE, PCB 0.062" THK MILL-MAX, 2501-2-00-80-00-00-07-0KEYSTONE, 575-4 34J1-J4CONN., BANANA JACK, FEMALE, THT, NON-INSULATED,SWAGE, 0.218"41JP1CONN., HDR., MALE, 2 × 3, 2mm, VERT, STR, THT WURTH ELEKTRONIK, 6200062112154MH1-MH4STANDOFF, NYLON, SNAP-ON, 0.50"WURTH ELEKTRONIK, 70293500061XJP1CONN., SHUNT, FEMALE, 2-POS, 2mm SAMTEC, 2SN-BK-G4Rev. 05Rev. 0Information furnished by Analog Devices is believed to be accurate and reliable. However , no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.SCHEMATIC DIAGRAMP h o n e : (4086Rev. 0ANALOG DEVICES, INC. 202103/21ESD CautionESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can discharge without detection. Although this product features patented or proprietary protection circuitry, damage may occur on devices subjected to high energy ESD. Therefore, proper ESD precautions should be taken to avoid performance degradation or loss of functionality.Legal Terms and ConditionsBy using the evaluation board discussed herein (together with any tools, components documentation or support materials, the “Evaluation Board”), you are agreeing to be bound by the terms and conditions set forth below (“Agreement”) unless you have purchased the Evaluation Board, in which case the Analog Devices Standard Terms and Conditions of Sale shall govern. Do not use the Evaluation Board until you have read and agreed to the Agreement. Your use of the Evaluation Board shall signify your acceptance of the Agreement. This Agreement is made by and between you (“Customer”) and Analog Devices, Inc. (“ADI”), with its principal place of business at One Technology Way, Norwood, MA 02062, USA. Subject to the terms and conditions of the Agreement, ADI hereby grants to Customer a free, limited, personal, temporary, non-exclusive, non-sublicensable, non-transferable license to use the Evaluation Board FOR EVALUATION PURPOSES ONL Y. Customer understands and agrees that the Evaluation Board is provided for the sole and exclusive purpose referenced above, and agrees not to use the Evaluation Board for any other purpose. Furthermore, the license granted is expressly made subject to the following additional limitations: Customer shall not (i) rent, lease, display, sell, transfer , assign, sublicense, or distribute the Evaluation Board; and (ii) permit any Third Party to access the Evaluation Board. As used herein, the term “Third Party” includes any entity other than ADI, Customer , their employees, affiliates and in-house consultants. The Evaluation Board is NOT sold to Customer; all rights not expressly granted herein, including ownership of the Evaluation Board, are reserved by ADI. CONFIDENTIALITY. This Agreement and the Evaluation Board shall all be considered the confidential and proprietary information of ADI. Customer may not disclose or transfer any portion of the Evaluation Board to any other party for any reason. Upon discontinuation of use of the Evaluation Board or termination of this Agreement, Customer agrees to promptly return the Evaluation Board to ADI. ADDITIONAL RESTRICTIONS. Customer may not disassemble, decompile or reverse engineer chips on the Evaluation Board. Customer shall inform ADI of any occurred damages or any modifications or alterations it makes to the Evaluation Board, including but not limited to soldering or any other activity that affects the material content of the Evaluation Board. Modifications to the Evaluation Board must comply with applicable law, including but not limited to the RoHS Directive. TERMINATION. ADI may terminate this Agreement at any time upon giving written notice to Customer . Customer agrees to return to ADI the Evaluation Board at that time. LIMITATION OF LIABILITY. THE EVALUATION BOARD PROVIDED HEREUNDER IS PROVIDED “AS IS” AND ADI MAKES NO WARRANTIES OR REPRESENTATIONS OF ANY KIND WITH RESPECT TO IT . ADI SPECIFICALL Y DISCLAIMS ANY REPRESENTATIONS, ENDORSEMENTS, GUARANTEES, OR WARRANTIES, EXPRESS OR IMPLIED, RELATED TO THE EVALUATION BOARD INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, TITLE, FITNESS FOR A PARTICULAR PURPOSE OR NONINFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS. IN NO EVENT WILL ADI AND ITS LICENSORS BE LIABLE FOR ANY INCIDENTAL, SPECIAL, INDIRECT , OR CONSEQUENTIAL DAMAGES RESUL TING FROM CUSTOMER’S POSSESSION OR USE OF THE EVALUATION BOARD, INCLUDING BUT NOT LIMITED TO LOST PROFITS, DELAY COSTS, LABOR COSTS OR LOSS OF GOODWILL. ADI’S TOTAL LIABILITY FROM ANY AND ALL CAUSES SHALL BE LIMITED TO THE AMOUNT OF ONE HUNDRED US DOLLARS ($100.00). EXPORT . Customer agrees that it will not directly or indirectly export the Evaluation Board to another country, and that it will comply with all applicable United States federal laws and regulations relating to exports. GOVERNING LAW . This Agreement shall be governed by and construed in accordance with the substantive laws of the Commonwealth of Massachusetts (excluding conflict of law rules). Any legal action regarding this Agreement will be heard in the state or federal courts having jurisdiction in Suffolk County, Massachusetts, and Customer hereby submits to the personal jurisdiction and venue of such courts. The United Nations Convention on Contracts for the International Sale of Goods shall not apply to this Agreement and is expressly disclaimed.。
Native Instruments MASCHINE MK3 用户手册说明书
The information in this document is subject to change without notice and does not represent a commitment on the part of Native Instruments GmbH. The software described by this docu-ment is subject to a License Agreement and may not be copied to other media. No part of this publication may be copied, reproduced or otherwise transmitted or recorded, for any purpose, without prior written permission by Native Instruments GmbH, hereinafter referred to as Native Instruments.“Native Instruments”, “NI” and associated logos are (registered) trademarks of Native Instru-ments GmbH.ASIO, VST, HALion and Cubase are registered trademarks of Steinberg Media Technologies GmbH.All other product and company names are trademarks™ or registered® trademarks of their re-spective holders. Use of them does not imply any affiliation with or endorsement by them.Document authored by: David Gover and Nico Sidi.Software version: 2.8 (02/2019)Hardware version: MASCHINE MK3Special thanks to the Beta Test Team, who were invaluable not just in tracking down bugs, but in making this a better product.NATIVE INSTRUMENTS GmbH Schlesische Str. 29-30D-10997 Berlin Germanywww.native-instruments.de NATIVE INSTRUMENTS North America, Inc. 6725 Sunset Boulevard5th FloorLos Angeles, CA 90028USANATIVE INSTRUMENTS K.K.YO Building 3FJingumae 6-7-15, Shibuya-ku, Tokyo 150-0001Japanwww.native-instruments.co.jp NATIVE INSTRUMENTS UK Limited 18 Phipp StreetLondon EC2A 4NUUKNATIVE INSTRUMENTS FRANCE SARL 113 Rue Saint-Maur75011 ParisFrance SHENZHEN NATIVE INSTRUMENTS COMPANY Limited 5F, Shenzhen Zimao Center111 Taizi Road, Nanshan District, Shenzhen, GuangdongChina© NATIVE INSTRUMENTS GmbH, 2019. All rights reserved.Table of Contents1Welcome to MASCHINE (25)1.1MASCHINE Documentation (26)1.2Document Conventions (27)1.3New Features in MASCHINE 2.8 (29)1.4New Features in MASCHINE 2.7.10 (31)1.5New Features in MASCHINE 2.7.8 (31)1.6New Features in MASCHINE 2.7.7 (32)1.7New Features in MASCHINE 2.7.4 (33)1.8New Features in MASCHINE 2.7.3 (36)2Quick Reference (38)2.1Using Your Controller (38)2.1.1Controller Modes and Mode Pinning (38)2.1.2Controlling the Software Views from Your Controller (40)2.2MASCHINE Project Overview (43)2.2.1Sound Content (44)2.2.2Arrangement (45)2.3MASCHINE Hardware Overview (48)2.3.1MASCHINE Hardware Overview (48)2.3.1.1Control Section (50)2.3.1.2Edit Section (53)2.3.1.3Performance Section (54)2.3.1.4Group Section (56)2.3.1.5Transport Section (56)2.3.1.6Pad Section (58)2.3.1.7Rear Panel (63)2.4MASCHINE Software Overview (65)2.4.1Header (66)2.4.2Browser (68)2.4.3Arranger (70)2.4.4Control Area (73)2.4.5Pattern Editor (74)3Basic Concepts (76)3.1Important Names and Concepts (76)3.2Adjusting the MASCHINE User Interface (79)3.2.1Adjusting the Size of the Interface (79)3.2.2Switching between Ideas View and Song View (80)3.2.3Showing/Hiding the Browser (81)3.2.4Showing/Hiding the Control Lane (81)3.3Common Operations (82)3.3.1Using the 4-Directional Push Encoder (82)3.3.2Pinning a Mode on the Controller (83)3.3.3Adjusting Volume, Swing, and Tempo (84)3.3.4Undo/Redo (87)3.3.5List Overlay for Selectors (89)3.3.6Zoom and Scroll Overlays (90)3.3.7Focusing on a Group or a Sound (91)3.3.8Switching Between the Master, Group, and Sound Level (96)3.3.9Navigating Channel Properties, Plug-ins, and Parameter Pages in the Control Area.973.3.9.1Extended Navigate Mode on Your Controller (102)3.3.10Navigating the Software Using the Controller (105)3.3.11Using Two or More Hardware Controllers (106)3.3.12Touch Auto-Write Option (108)3.4Native Kontrol Standard (110)3.5Stand-Alone and Plug-in Mode (111)3.5.1Differences between Stand-Alone and Plug-in Mode (112)3.5.2Switching Instances (113)3.5.3Controlling Various Instances with Different Controllers (114)3.6Host Integration (114)3.6.1Setting up Host Integration (115)3.6.1.1Setting up Ableton Live (macOS) (115)3.6.1.2Setting up Ableton Live (Windows) (116)3.6.1.3Setting up Apple Logic Pro X (116)3.6.2Integration with Ableton Live (117)3.6.3Integration with Apple Logic Pro X (119)3.7Preferences (120)3.7.1Preferences – General Page (121)3.7.2Preferences – Audio Page (126)3.7.3Preferences – MIDI Page (130)3.7.4Preferences – Default Page (133)3.7.5Preferences – Library Page (137)3.7.6Preferences – Plug-ins Page (145)3.7.7Preferences – Hardware Page (150)3.7.8Preferences – Colors Page (154)3.8Integrating MASCHINE into a MIDI Setup (156)3.8.1Connecting External MIDI Equipment (156)3.8.2Sync to External MIDI Clock (157)3.8.3Send MIDI Clock (158)3.9Syncing MASCHINE using Ableton Link (159)3.9.1Connecting to a Network (159)3.9.2Joining and Leaving a Link Session (159)3.10Using a Pedal with the MASCHINE Controller (160)3.11File Management on the MASCHINE Controller (161)4Browser (163)4.1Browser Basics (163)4.1.1The MASCHINE Library (163)4.1.2Browsing the Library vs. Browsing Your Hard Disks (164)4.2Searching and Loading Files from the Library (165)4.2.1Overview of the Library Pane (165)4.2.2Selecting or Loading a Product and Selecting a Bank from the Browser (170)4.2.2.1[MK3] Browsing by Product Category Using the Controller (174)4.2.2.2[MK3] Browsing by Product Vendor Using the Controller (174)4.2.3Selecting a Product Category, a Product, a Bank, and a Sub-Bank (175)4.2.3.1Selecting a Product Category, a Product, a Bank, and a Sub-Bank on theController (179)4.2.4Selecting a File Type (180)4.2.5Choosing Between Factory and User Content (181)4.2.6Selecting Type and Character Tags (182)4.2.7List and Tag Overlays in the Browser (186)4.2.8Performing a Text Search (188)4.2.9Loading a File from the Result List (188)4.3Additional Browsing Tools (193)4.3.1Loading the Selected Files Automatically (193)4.3.2Auditioning Instrument Presets (195)4.3.3Auditioning Samples (196)4.3.4Loading Groups with Patterns (197)4.3.5Loading Groups with Routing (198)4.3.6Displaying File Information (198)4.4Using Favorites in the Browser (199)4.5Editing the Files’ Tags and Properties (203)4.5.1Attribute Editor Basics (203)4.5.2The Bank Page (205)4.5.3The Types and Characters Pages (205)4.5.4The Properties Page (208)4.6Loading and Importing Files from Your File System (209)4.6.1Overview of the FILES Pane (209)4.6.2Using Favorites (211)4.6.3Using the Location Bar (212)4.6.4Navigating to Recent Locations (213)4.6.5Using the Result List (214)4.6.6Importing Files to the MASCHINE Library (217)4.7Locating Missing Samples (219)4.8Using Quick Browse (221)5Managing Sounds, Groups, and Your Project (225)5.1Overview of the Sounds, Groups, and Master (225)5.1.1The Sound, Group, and Master Channels (226)5.1.2Similarities and Differences in Handling Sounds and Groups (227)5.1.3Selecting Multiple Sounds or Groups (228)5.2Managing Sounds (233)5.2.1Loading Sounds (235)5.2.2Pre-listening to Sounds (236)5.2.3Renaming Sound Slots (237)5.2.4Changing the Sound’s Color (237)5.2.5Saving Sounds (239)5.2.6Copying and Pasting Sounds (241)5.2.7Moving Sounds (244)5.2.8Resetting Sound Slots (245)5.3Managing Groups (247)5.3.1Creating Groups (248)5.3.2Loading Groups (249)5.3.3Renaming Groups (251)5.3.4Changing the Group’s Color (251)5.3.5Saving Groups (253)5.3.6Copying and Pasting Groups (255)5.3.7Reordering Groups (258)5.3.8Deleting Groups (259)5.4Exporting MASCHINE Objects and Audio (260)5.4.1Saving a Group with its Samples (261)5.4.2Saving a Project with its Samples (262)5.4.3Exporting Audio (264)5.5Importing Third-Party File Formats (270)5.5.1Loading REX Files into Sound Slots (270)5.5.2Importing MPC Programs to Groups (271)6Playing on the Controller (275)6.1Adjusting the Pads (275)6.1.1The Pad View in the Software (275)6.1.2Choosing a Pad Input Mode (277)6.1.3Adjusting the Base Key (280)6.1.4Using Choke Groups (282)6.1.5Using Link Groups (284)6.2Adjusting the Key, Choke, and Link Parameters for Multiple Sounds (286)6.3Playing Tools (287)6.3.1Mute and Solo (288)6.3.2Choke All Notes (292)6.3.3Groove (293)6.3.4Level, Tempo, Tune, and Groove Shortcuts on Your Controller (295)6.3.5Tap Tempo (299)6.4Performance Features (300)6.4.1Overview of the Perform Features (300)6.4.2Selecting a Scale and Creating Chords (303)6.4.3Scale and Chord Parameters (303)6.4.4Creating Arpeggios and Repeated Notes (316)6.4.5Swing on Note Repeat / Arp Output (321)6.5Using Lock Snapshots (322)6.5.1Creating a Lock Snapshot (322)6.5.2Using Extended Lock (323)6.5.3Updating a Lock Snapshot (323)6.5.4Recalling a Lock Snapshot (324)6.5.5Morphing Between Lock Snapshots (324)6.5.6Deleting a Lock Snapshot (325)6.5.7Triggering Lock Snapshots via MIDI (326)6.6Using the Smart Strip (327)6.6.1Pitch Mode (328)6.6.2Modulation Mode (328)6.6.3Perform Mode (328)6.6.4Notes Mode (329)7Working with Plug-ins (330)7.1Plug-in Overview (330)7.1.1Plug-in Basics (330)7.1.2First Plug-in Slot of Sounds: Choosing the Sound’s Role (334)7.1.3Loading, Removing, and Replacing a Plug-in (335)7.1.3.1Browser Plug-in Slot Selection (341)7.1.4Adjusting the Plug-in Parameters (344)7.1.5Bypassing Plug-in Slots (344)7.1.6Using Side-Chain (346)7.1.7Moving Plug-ins (346)7.1.8Alternative: the Plug-in Strip (348)7.1.9Saving and Recalling Plug-in Presets (348)7.1.9.1Saving Plug-in Presets (349)7.1.9.2Recalling Plug-in Presets (350)7.1.9.3Removing a Default Plug-in Preset (351)7.2The Sampler Plug-in (352)7.2.1Page 1: Voice Settings / Engine (354)7.2.2Page 2: Pitch / Envelope (356)7.2.3Page 3: FX / Filter (359)7.2.4Page 4: Modulation (361)7.2.5Page 5: LFO (363)7.2.6Page 6: Velocity / Modwheel (365)7.3Using Native Instruments and External Plug-ins (367)7.3.1Opening/Closing Plug-in Windows (367)7.3.2Using the VST/AU Plug-in Parameters (370)7.3.3Setting Up Your Own Parameter Pages (371)7.3.4Using VST/AU Plug-in Presets (376)7.3.5Multiple-Output Plug-ins and Multitimbral Plug-ins (378)8Using the Audio Plug-in (380)8.1Loading a Loop into the Audio Plug-in (384)8.2Editing Audio in the Audio Plug-in (385)8.3Using Loop Mode (386)8.4Using Gate Mode (388)9Using the Drumsynths (390)9.1Drumsynths – General Handling (391)9.1.1Engines: Many Different Drums per Drumsynth (391)9.1.2Common Parameter Organization (391)9.1.3Shared Parameters (394)9.1.4Various Velocity Responses (394)9.1.5Pitch Range, Tuning, and MIDI Notes (394)9.2The Kicks (395)9.2.1Kick – Sub (397)9.2.2Kick – Tronic (399)9.2.3Kick – Dusty (402)9.2.4Kick – Grit (403)9.2.5Kick – Rasper (406)9.2.6Kick – Snappy (407)9.2.7Kick – Bold (409)9.2.8Kick – Maple (411)9.2.9Kick – Push (412)9.3The Snares (414)9.3.1Snare – Volt (416)9.3.2Snare – Bit (418)9.3.3Snare – Pow (420)9.3.4Snare – Sharp (421)9.3.5Snare – Airy (423)9.3.6Snare – Vintage (425)9.3.7Snare – Chrome (427)9.3.8Snare – Iron (429)9.3.9Snare – Clap (431)9.3.10Snare – Breaker (433)9.4The Hi-hats (435)9.4.1Hi-hat – Silver (436)9.4.2Hi-hat – Circuit (438)9.4.3Hi-hat – Memory (440)9.4.4Hi-hat – Hybrid (442)9.4.5Creating a Pattern with Closed and Open Hi-hats (444)9.5The Toms (445)9.5.1Tom – Tronic (447)9.5.2Tom – Fractal (449)9.5.3Tom – Floor (453)9.5.4Tom – High (455)9.6The Percussions (456)9.6.1Percussion – Fractal (458)9.6.2Percussion – Kettle (461)9.6.3Percussion – Shaker (463)9.7The Cymbals (467)9.7.1Cymbal – Crash (469)9.7.2Cymbal – Ride (471)10Using the Bass Synth (474)10.1Bass Synth – General Handling (475)10.1.1Parameter Organization (475)10.1.2Bass Synth Parameters (477)11Working with Patterns (479)11.1Pattern Basics (479)11.1.1Pattern Editor Overview (480)11.1.2Navigating the Event Area (486)11.1.3Following the Playback Position in the Pattern (488)11.1.4Jumping to Another Playback Position in the Pattern (489)11.1.5Group View and Keyboard View (491)11.1.6Adjusting the Arrange Grid and the Pattern Length (493)11.1.7Adjusting the Step Grid and the Nudge Grid (497)11.2Recording Patterns in Real Time (501)11.2.1Recording Your Patterns Live (501)11.2.2The Record Prepare Mode (504)11.2.3Using the Metronome (505)11.2.4Recording with Count-in (506)11.2.5Quantizing while Recording (508)11.3Recording Patterns with the Step Sequencer (508)11.3.1Step Mode Basics (508)11.3.2Editing Events in Step Mode (511)11.3.3Recording Modulation in Step Mode (513)11.4Editing Events (514)11.4.1Editing Events with the Mouse: an Overview (514)11.4.2Creating Events/Notes (517)11.4.3Selecting Events/Notes (518)11.4.4Editing Selected Events/Notes (526)11.4.5Deleting Events/Notes (532)11.4.6Cut, Copy, and Paste Events/Notes (535)11.4.7Quantizing Events/Notes (538)11.4.8Quantization While Playing (540)11.4.9Doubling a Pattern (541)11.4.10Adding Variation to Patterns (541)11.5Recording and Editing Modulation (546)11.5.1Which Parameters Are Modulatable? (547)11.5.2Recording Modulation (548)11.5.3Creating and Editing Modulation in the Control Lane (550)11.6Creating MIDI Tracks from Scratch in MASCHINE (555)11.7Managing Patterns (557)11.7.1The Pattern Manager and Pattern Mode (558)11.7.2Selecting Patterns and Pattern Banks (560)11.7.3Creating Patterns (563)11.7.4Deleting Patterns (565)11.7.5Creating and Deleting Pattern Banks (566)11.7.6Naming Patterns (568)11.7.7Changing the Pattern’s Color (570)11.7.8Duplicating, Copying, and Pasting Patterns (571)11.7.9Moving Patterns (574)11.7.10Adjusting Pattern Length in Fine Increments (575)11.8Importing/Exporting Audio and MIDI to/from Patterns (576)11.8.1Exporting Audio from Patterns (576)11.8.2Exporting MIDI from Patterns (577)11.8.3Importing MIDI to Patterns (580)12Audio Routing, Remote Control, and Macro Controls (589)12.1Audio Routing in MASCHINE (590)12.1.1Sending External Audio to Sounds (591)12.1.2Configuring the Main Output of Sounds and Groups (596)12.1.3Setting Up Auxiliary Outputs for Sounds and Groups (601)12.1.4Configuring the Master and Cue Outputs of MASCHINE (605)12.1.5Mono Audio Inputs (610)12.1.5.1Configuring External Inputs for Sounds in Mix View (611)12.2Using MIDI Control and Host Automation (614)12.2.1Triggering Sounds via MIDI Notes (615)12.2.2Triggering Scenes via MIDI (622)12.2.3Controlling Parameters via MIDI and Host Automation (623)12.2.4Selecting VST/AU Plug-in Presets via MIDI Program Change (631)12.2.5Sending MIDI from Sounds (632)12.3Creating Custom Sets of Parameters with the Macro Controls (636)12.3.1Macro Control Overview (637)12.3.2Assigning Macro Controls Using the Software (638)12.3.3Assigning Macro Controls Using the Controller (644)13Controlling Your Mix (646)13.1Mix View Basics (646)13.1.1Switching between Arrange View and Mix View (646)13.1.2Mix View Elements (647)13.2The Mixer (649)13.2.1Displaying Groups vs. Displaying Sounds (650)13.2.2Adjusting the Mixer Layout (652)13.2.3Selecting Channel Strips (653)13.2.4Managing Your Channels in the Mixer (654)13.2.5Adjusting Settings in the Channel Strips (656)13.2.6Using the Cue Bus (660)13.3The Plug-in Chain (662)13.4The Plug-in Strip (663)13.4.1The Plug-in Header (665)13.4.2Panels for Drumsynths and Internal Effects (667)13.4.3Panel for the Sampler (668)13.4.4Custom Panels for Native Instruments Plug-ins (671)13.4.5Undocking a Plug-in Panel (Native Instruments and External Plug-ins Only) (675)13.5Controlling Your Mix from the Controller (677)13.5.1Navigating Your Channels in Mix Mode (678)13.5.2Adjusting the Level and Pan in Mix Mode (679)13.5.3Mute and Solo in Mix Mode (680)13.5.4Plug-in Icons in Mix Mode (680)14Using Effects (681)14.1Applying Effects to a Sound, a Group or the Master (681)14.1.1Adding an Effect (681)14.1.2Other Operations on Effects (690)14.1.3Using the Side-Chain Input (692)14.2Applying Effects to External Audio (695)14.2.1Step 1: Configure MASCHINE Audio Inputs (695)14.2.2Step 2: Set up a Sound to Receive the External Input (698)14.2.3Step 3: Load an Effect to Process an Input (700)14.3Creating a Send Effect (701)14.3.1Step 1: Set Up a Sound or Group as Send Effect (702)14.3.2Step 2: Route Audio to the Send Effect (706)14.3.3 A Few Notes on Send Effects (708)14.4Creating Multi-Effects (709)15Effect Reference (712)15.1Dynamics (713)15.1.1Compressor (713)15.1.2Gate (717)15.1.3Transient Master (721)15.1.4Limiter (723)15.1.5Maximizer (727)15.2Filtering Effects (730)15.2.1EQ (730)15.2.2Filter (733)15.2.3Cabinet (737)15.3Modulation Effects (738)15.3.1Chorus (738)15.3.2Flanger (740)15.3.3FM (742)15.3.4Freq Shifter (743)15.3.5Phaser (745)15.4Spatial and Reverb Effects (747)15.4.1Ice (747)15.4.2Metaverb (749)15.4.3Reflex (750)15.4.4Reverb (Legacy) (752)15.4.5Reverb (754)15.4.5.1Reverb Room (754)15.4.5.2Reverb Hall (757)15.4.5.3Plate Reverb (760)15.5Delays (762)15.5.1Beat Delay (762)15.5.2Grain Delay (765)15.5.3Grain Stretch (767)15.5.4Resochord (769)15.6Distortion Effects (771)15.6.1Distortion (771)15.6.2Lofi (774)15.6.3Saturator (775)15.7Perform FX (779)15.7.1Filter (780)15.7.2Flanger (782)15.7.3Burst Echo (785)15.7.4Reso Echo (787)15.7.5Ring (790)15.7.6Stutter (792)15.7.7Tremolo (795)15.7.8Scratcher (798)16Working with the Arranger (801)16.1Arranger Basics (801)16.1.1Navigating Song View (804)16.1.2Following the Playback Position in Your Project (806)16.1.3Performing with Scenes and Sections using the Pads (807)16.2Using Ideas View (811)16.2.1Scene Overview (811)16.2.2Creating Scenes (813)16.2.3Assigning and Removing Patterns (813)16.2.4Selecting Scenes (817)16.2.5Deleting Scenes (818)16.2.6Creating and Deleting Scene Banks (820)16.2.7Clearing Scenes (820)16.2.8Duplicating Scenes (821)16.2.9Reordering Scenes (822)16.2.10Making Scenes Unique (824)16.2.11Appending Scenes to Arrangement (825)16.2.12Naming Scenes (826)16.2.13Changing the Color of a Scene (827)16.3Using Song View (828)16.3.1Section Management Overview (828)16.3.2Creating Sections (833)16.3.3Assigning a Scene to a Section (834)16.3.4Selecting Sections and Section Banks (835)16.3.5Reorganizing Sections (839)16.3.6Adjusting the Length of a Section (840)16.3.6.1Adjusting the Length of a Section Using the Software (841)16.3.6.2Adjusting the Length of a Section Using the Controller (843)16.3.7Clearing a Pattern in Song View (843)16.3.8Duplicating Sections (844)16.3.8.1Making Sections Unique (845)16.3.9Removing Sections (846)16.3.10Renaming Scenes (848)16.3.11Clearing Sections (849)16.3.12Creating and Deleting Section Banks (850)16.3.13Working with Patterns in Song view (850)16.3.13.1Creating a Pattern in Song View (850)16.3.13.2Selecting a Pattern in Song View (850)16.3.13.3Clearing a Pattern in Song View (851)16.3.13.4Renaming a Pattern in Song View (851)16.3.13.5Coloring a Pattern in Song View (851)16.3.13.6Removing a Pattern in Song View (852)16.3.13.7Duplicating a Pattern in Song View (852)16.3.14Enabling Auto Length (852)16.3.15Looping (853)16.3.15.1Setting the Loop Range in the Software (854)16.4Playing with Sections (855)16.4.1Jumping to another Playback Position in Your Project (855)16.5Triggering Sections or Scenes via MIDI (856)16.6The Arrange Grid (858)16.7Quick Grid (860)17Sampling and Sample Mapping (862)17.1Opening the Sample Editor (862)17.2Recording Audio (863)17.2.1Opening the Record Page (863)17.2.2Selecting the Source and the Recording Mode (865)17.2.3Arming, Starting, and Stopping the Recording (868)17.2.5Using the Footswitch for Recording Audio (871)17.2.6Checking Your Recordings (872)17.2.7Location and Name of Your Recorded Samples (876)17.3Editing a Sample (876)17.3.1Using the Edit Page (877)17.3.2Audio Editing Functions (882)17.4Slicing a Sample (890)17.4.1Opening the Slice Page (891)17.4.2Adjusting the Slicing Settings (893)17.4.3Live Slicing (898)17.4.3.1Live Slicing Using the Controller (898)17.4.3.2Delete All Slices (899)17.4.4Manually Adjusting Your Slices (899)17.4.5Applying the Slicing (906)17.5Mapping Samples to Zones (912)17.5.1Opening the Zone Page (912)17.5.2Zone Page Overview (913)17.5.3Selecting and Managing Zones in the Zone List (915)17.5.4Selecting and Editing Zones in the Map View (920)17.5.5Editing Zones in the Sample View (924)17.5.6Adjusting the Zone Settings (927)17.5.7Adding Samples to the Sample Map (934)18Appendix: Tips for Playing Live (937)18.1Preparations (937)18.1.1Focus on the Hardware (937)18.1.2Customize the Pads of the Hardware (937)18.1.3Check Your CPU Power Before Playing (937)18.1.4Name and Color Your Groups, Patterns, Sounds and Scenes (938)18.1.5Consider Using a Limiter on Your Master (938)18.1.6Hook Up Your Other Gear and Sync It with MIDI Clock (938)18.1.7Improvise (938)18.2Basic Techniques (938)18.2.1Use Mute and Solo (938)18.2.2Use Scene Mode and Tweak the Loop Range (939)18.2.3Create Variations of Your Drum Patterns in the Step Sequencer (939)18.2.4Use Note Repeat (939)18.2.5Set Up Your Own Multi-effect Groups and Automate Them (939)18.3Special Tricks (940)18.3.1Changing Pattern Length for Variation (940)18.3.2Using Loops to Cycle Through Samples (940)18.3.3Using Loops to Cycle Through Samples (940)18.3.4Load Long Audio Files and Play with the Start Point (940)19Troubleshooting (941)19.1Knowledge Base (941)19.2Technical Support (941)19.3Registration Support (942)19.4User Forum (942)20Glossary (943)Index (951)1Welcome to MASCHINEThank you for buying MASCHINE!MASCHINE is a groove production studio that implements the familiar working style of classi-cal groove boxes along with the advantages of a computer based system. MASCHINE is ideal for making music live, as well as in the studio. It’s the hands-on aspect of a dedicated instru-ment, the MASCHINE hardware controller, united with the advanced editing features of the MASCHINE software.Creating beats is often not very intuitive with a computer, but using the MASCHINE hardware controller to do it makes it easy and fun. You can tap in freely with the pads or use Note Re-peat to jam along. Alternatively, build your beats using the step sequencer just as in classic drum machines.Patterns can be intuitively combined and rearranged on the fly to form larger ideas. You can try out several different versions of a song without ever having to stop the music.Since you can integrate it into any sequencer that supports VST, AU, or AAX plug-ins, you can reap the benefits in almost any software setup, or use it as a stand-alone application. You can sample your own material, slice loops and rearrange them easily.However, MASCHINE is a lot more than an ordinary groovebox or sampler: it comes with an inspiring 7-gigabyte library, and a sophisticated, yet easy to use tag-based Browser to give you instant access to the sounds you are looking for.What’s more, MASCHINE provides lots of options for manipulating your sounds via internal ef-fects and other sound-shaping possibilities. You can also control external MIDI hardware and 3rd-party software with the MASCHINE hardware controller, while customizing the functions of the pads, knobs and buttons according to your needs utilizing the included Controller Editor application. We hope you enjoy this fantastic instrument as much as we do. Now let’s get go-ing!—The MASCHINE team at Native Instruments.MASCHINE Documentation1.1MASCHINE DocumentationNative Instruments provide many information sources regarding MASCHINE. The main docu-ments should be read in the following sequence:1.MASCHINE Getting Started: This document provides a practical approach to MASCHINE viaa set of tutorials covering easy and more advanced tasks in order to help you familiarizeyourself with MASCHINE.2.MASCHINE Manual (this document): The MASCHINE Manual provides you with a compre-hensive description of all MASCHINE software and hardware features.Additional documentation sources provide you with details on more specific topics:▪Controller Editor Manual: Besides using your MASCHINE hardware controller together withits dedicated MASCHINE software, you can also use it as a powerful and highly versatileMIDI controller to pilot any other MIDI-capable application or device. This is made possibleby the Controller Editor software, an application that allows you to precisely define all MIDIassignments for your MASCHINE controller. The Controller Editor was installed during theMASCHINE installation procedure. For more information on this, please refer to the Con-troller Editor Manual available as a PDF file via the Help menu of Controller Editor.▪Online Support Videos: You can find a number of support videos on The Official Native In-struments Support Channel under the following URL: https:///NIsupport-EN. We recommend that you follow along with these instructions while the respective ap-plication is running on your computer.Other Online Resources:If you are experiencing problems related to your Native Instruments product that the supplied documentation does not cover, there are several ways of getting help:▪Knowledge Base▪User Forum▪Technical Support▪Registration SupportYou will find more information on these subjects in the chapter Troubleshooting.1.2Document ConventionsThis section introduces you to the signage and text highlighting used in this manual. This man-ual uses particular formatting to point out special facts and to warn you of potential issues. The icons introducing these notes let you see what kind of information is to be expected:This document uses particular formatting to point out special facts and to warn you of poten-tial issues. The icons introducing the following notes let you see what kind of information can be expected:Furthermore, the following formatting is used:▪Text appearing in (drop-down) menus (such as Open…, Save as… etc.) in the software and paths to locations on your hard disk or other storage devices is printed in italics.▪Text appearing elsewhere (labels of buttons, controls, text next to checkboxes etc.) in the software is printed in blue. Whenever you see this formatting applied, you will find the same text appearing somewhere on the screen.▪Text appearing on the displays of the controller is printed in light grey. Whenever you see this formatting applied, you will find the same text on a controller display.▪Text appearing on labels of the hardware controller is printed in orange. Whenever you see this formatting applied, you will find the same text on the controller.▪Important names and concepts are printed in bold.▪References to keys on your computer’s keyboard you’ll find put in square brackets (e.g.,“Press [Shift] + [Enter]”).►Single instructions are introduced by this play button type arrow.→Results of actions are introduced by this smaller arrow.Naming ConventionThroughout the documentation we will refer to MASCHINE controller (or just controller) as the hardware controller and MASCHINE software as the software installed on your computer.The term “effect” will sometimes be abbreviated as “FX” when referring to elements in the MA-SCHINE software and hardware. These terms have the same meaning.Button Combinations and Shortcuts on Your ControllerMost instructions will use the “+” sign to indicate buttons (or buttons and pads) that must be pressed simultaneously, starting with the button indicated first. E.g., an instruction such as:“Press SHIFT + PLAY”means:1.Press and hold SHIFT.2.While holding SHIFT, press PLAY and release it.3.Release SHIFT.Unlabeled Buttons on the ControllerThe buttons and knobs above and below the displays on your MASCHINE controller do not have labels.。
AWG5000系列混合信号伪随机波形生成器说明书
Arbitrary Waveform GeneratorAWG5000 Series (AWG5014 • AWG5012 • AWG5004 • AWG5002)The AWG5000 Series of Arbitrary Waveform Generators Delivers the Industry’s Best Mixed Signal Stimulus Solution for Today’s Complex Measurement ChallengesThe AWG5000 Series of Arbitrary Waveform Generators delivers theoptimal combination of industry leading sample rate, vertical resolution, signal fidelity and waveform memory length,all in an easy-to-use self-contained package.The series offers the industry’s best solution to the challenging signal stim-ulus issues faced by designers verifying,characterizing and debugging sophisti-cated electronic designs.Meeting the needs of today’s design engineers, the series provides excellent signal dynamic range and integrity.AWG5000 Series models, with a 14bits DA converter based sample rate from 600MS/s to 1.2GS/s, two to four output channels, synchronized four to eight digital marker outputs, and 28-channels of digital data outputs, easily solve the toughest measurement chal-lenges in wireless base band I/Q communications, digital consumer product design such as imaging devices, data conversion equipment and semiconductor design and test. The open Windows (Windows XP)-based instruments are easy and convenient to use and connect easily with peripherals and third-party software.AWG5000 Series.Features & Benefits1.2Gs/s and 600MS/s Models 14 bit Vertical Resolution 2 or 4Arbitrary WaveformDifferential/Single-ended Outputs –Up to 4.5V p-p Single-ended and 9V p-p at Differential Output into 50Ω–0.95ns Tr/Tf (10 to 90%) at 0.6V p-p–+/– 5ns Range (50ps Resolution) Inter Channel Skew Control–SFDR: 80dBc (1MHz),64dBc (10MHz)4 or 8Variable Level Marker Outputs–Up to 3.7V p-p Single-ended Output into 50Ω–300ps Tr/Tf (20 to 80%)at 0 to 1V–Up to 1ns Range (50ps Resolution) Delay Control28 Bits Ch 1/Ch 2Variable Level Digital Data Output–Up to 3.7V p-p Single-ended Output into 50Ω–300ps Tr/Tf (20 to 80%)at 0 to 1VUp to 32M Point Record Length For Longer Data Streams Down to 800ps Resolution Edge Timing Shift Control Real-time Sequencing Creates Infinite Waveform Loops, Jumps,and Conditional BranchesEasy to Use and Learn Shortens Test TimeIntuitive User Interface Based on Windows 2000 XP Convenient Bench Top Form FactorIntegrated PC Supports Network Integration and Provides a Built-in DVD, Removable Hard Drive,LAN and USB portsApplicationsDesigning, Testing and Deploying Wireless Communications: –High Fidelity QuadratureModulation I and Q Base-band Signals (Polar Modulation:I/Q + Magnitude Control, Two Pair of I/Q for MIMO)Imaging–Stimulus Signals for Imaging Display and Recording Devices (CCD, LCD)Data Conversion–Stimulus Signals for DataConversion Devices (ADC, DAC)Mixed Signal Design and Test –2/4Ch Analog + 4/8Ch Marker Outputs + 28 Bit Digital Data OutputsReal-world, Ideal or Distorted Signal Generation – Including All the Glitches, Anomalies and ImpairmentsEnhanced/Corrupted Playback of DSO Captured SignalsWaveform Vectors Imported from Third-party T ools such as MathCAD,MATLAB, Excel and OthersArbitrary Waveform GeneratorAWG5000 Series (AWG5014 • AWG5012 • AWG5004 • AWG5002)AWG5000 Series • /signal_sources2EVM/Constellation measurement.Typical Signal Injection.Arbitrary Waveform GeneratorAWG5000 Series (AWG5014 • AWG5012 • AWG5004 • AWG5002) RTSA Spectrum view.9-PAM with 250 Mbps.Mixed signal test by TDS/TLA iView.™AWG5000 Series • /signal_sources3Arbitrary Waveform GeneratorAWG5000 Series (AWG5014 • AWG5012 • AWG5004 • AWG5002)4AWG5000 Series • /signal_sourcesArbitrary Waveform GeneratorAWG5000 Series (AWG5014 • AWG5012 • AWG5004 • AWG5002)AWG5014AWG5012AWG5004AWG5002Arbitrary WaveformsWaveform Length 1 to 16,200,000 points (or 1 to 32,400,000 points,option 01)Number of Waveforms 1 to 16,000Sequence Length 1 to 4,000stepsSequence Repeat Counter 1 to 65,536 or infiniteSequence Control Repeat count,Trigger,Go-to-N and JumpJump Mode Synchronous and AsynchronousRun ModesContinuous Waveform is iteratively output.If a sequence is defined,the sequence order and repeat functions are appliedTriggered Waveform is output only once when an external,internal,GPIB,LAN or manual trigger is receivedGated Waveform begins output when gate is true and resets to beginning when falseSequence Waveform is output as defined by the sequenceClock GeneratorSampling Frequency10 MS/s to 1.2GS/s10 MS/s to 600 MS/sResolution8digitsInternal ClockAccuracy Within ±(1 ppm + Aging),Aging:within ±1 ppm/yearClock Phase Noise Less than –90dBc/Hz at 100kHz offsetInternal Trigger GeneratorInternal Trigger RateRange 1.0μs to 10.0sResolution3digits,0.1μs minimumSkew Control Between OutputsRange– 5 ns to + 5nsResolution5psAWG5000 Series • /signal_sources5Arbitrary Waveform GeneratorAWG5000 Series (AWG5014 • AWG5012 • AWG5004 • AWG5002)AWG5000 Series • /signal_sources6AWG5014AWG5012AWG5004AWG5002Main Arbitrary Waveform Output Resolution14 bitsAnalog OutputOutput StyleDifferential Output Impedance 50ΩConnectorBNC FrontAmplitude Output Voltage Normal:–4.5 V to + 4.5V,Direct –0.3V to +0.3V Amplitude Normal:20mV p-p to 4.5V p-p ,Direct; 20mV p-p to 0.6V p-pResolution 1mVDC Accuracy±(2.0% of Amplitude + 2mV) at offset = 0V Offset (into 50Ω) Range Normal:–2.25V to +2.25V,Direct:N/A Resolution 1mVAccuracy±(2% of offset +10mV at minimum amplitudePulse Response Rise/Fall time:(10% to 90%).Normal:1.4ns (2.0V p-p ),Direct:0.95ns (0.6V p-p )Bandwidth (–3dB)Normal:250MHz (2.0V p-p ),Direct:370MHz (0.6V p-p )Ringing Normal:750mV p-p (4.5V p-p filter through),80mV p-p (2.0V p-p filter through),Direct:60mV p-p (0.6V p-p )Low Pass Filter High range:100MHz,20MHz,Low range:through,100MHz,20MHz,Direct:N/ADelay from Marker Normal:17.5ns to 19.4ns (20MHz filter),3.8ns to 5.7ns (100MHz filter),0 to 1.9ns (Through),Direct:–1.5ns to 0.4nsSine Wave Characteristics (1.2GS/s clock,32 waveform points,37.5MHz signal frequency)(600MS/s clock,32 waveform points,18.75MHz signal frequency)Harmonics Normal:≤–40dBc (2.0V p-p ),Direct ≤=–49dBc (0.6V p-p )Normal:≤–46dBc (2.0V p-p ),Direct ≤=–55dBc (0.6V p-p )Non Harmonics Normal:≤–60dBc (2.0V p-p ,DC to 600MHz)Normal:≤–60dBc (2.0V p-p ,DC to 300MHz)Phase noise ≤–85dBc/Hz (2.0V p-p ,10kHz offset) –85dBc/Hz (2.0V p-p ,10kHz offset) SFDR 50dBc (Normal,37.5MHz,1.2GS/s,2.0V p-p )56dBc (Normal,18.75MHz,600MS/s,2.0V p-p )60dBc (Normal,10MHz,600MS/s,1.0V p-p )60dBc (Normal,10MHz,600MS/s,1.0V p-p )80dBc (Normal,1MHz,600MS/s,1.0V p-p )80dBc (Normal,1MHz,600MS/s,1.0V p-p )64dBc (Direct,10MHz,600 MS/s,0.6V p-p )64dBc (Direct,10MHz,600MS/s,0.6V p-p )80dBc (Direct,1MHz,600 MS/s,0.6V p-p )80dBc (Direct,1MHz,600MS/s,0.6V p-p )Arbitrary Waveform GeneratorAWG5000 Series (AWG5014 • AWG5012 • AWG5004 • AWG5002) Auxiliary OutputsOutput Style Single-endedOutput Impedance50ΩConnector BNC FrontLevel (into 50Ω)(Twice for Hi_Z input)Output Windows–1.00 V to + 2.7VAmplitude0.10 Vp-p to 3.7 Vp-pResolution10mVDC Accuracy±(10% of setting +120mV) Maximum Output Current±54mA /chRise/Fall Time (20% to 80%)300 ps(1.0 Vp-p,Hi +1.0V,Lo 0V) Skew Adjust Between MarkersRange0 to 1000ps Resolution50psRandom Jitter (Typical)1010 clock patternRMS5psrmsTotal Jitter (Typical)2^15–1PN data patternPeak to Peak (p-p)80psp-pClock (VCO) OutRange600MHz to 1.2GHzAmplitude0.4 Vp-pinto 50Ωto GND Impedance:50Ω,AC coupling Connector BNC Rear10MHz Reference OutAmplitude 1.2 Vp-p into 50Ω.Max 2.5 Vp-popenImpedance50Ω,AC couplingConnector BNC RearDC OutputsNumber of Outputs4:independently controlled outputsRange–3.0 to +5.0VResolution10mVMax.Current±100mAConnector2x4 pin header on front panelAWG5000 Series • /signal_sources7Arbitrary Waveform GeneratorAWG5000 Series (AWG5014 • AWG5012 • AWG5004 • AWG5002)AWG5000 Series • /signal_sources8Trigger In Impedance 1 k Ωor 50ΩPolarity POS or NEG ConnectorBNC FrontInput Voltage Range1 k Ω:±10V.50 Ω:±5V Threshold Level –5.0 V to 5.0VResolution 0.1VTrigger Jitter2.0ns to 4.5ns (Typical) Trigger Mode Minimum Pulse Width 20nsTrigger Hold-off 832* sampling_period – 100ns Delay to Analog Out128* sampling_period + 250ns Gate Mode Minimum Pulse Width 1024* sampling_period + 10ns Delay to Analog Out640* sampling_period + 260ns Event Input Impedance 1 k Ωor 50ΩPolarity POS or NEG ConnectorBNC FrontInput Voltage Range 1 k Ω:±10V.50 Ω:±5V Threshold –5.0 V to 5.0VResolution0.1VSequence Mode Mode Minimum Pulse Width 20nsEvent Hold Off 1024* Sampling Period + 10nsDelay to Analog Out640* Sampling Period + 280 ns (Jump timing:Asynchronous jump)External Clock IN Input Voltage Range 0.2 V p-p to 0.8 V p-p Impedance50Ω,AC coupledConnectorBNC RearReference Clock IN Input Voltage Range 0.2 V p-p to 3.0 V p-p Impedance50Ω,AC coupledFrequency Range 10MHz,20MHz,100MHz (with ±0.1%)ConnectorBNC RearPhase Lock IN Input Ranges5MHz to 600MHz (acceptable frequency drift is ±0.5%)Input Voltage Range 0.2 V p-p to 3 V p-pConnectorBNC RearAdd IN For each analog channel Impedance 50Ω,DC coupledDC Gain 1BandwidthDC to 100MHz at –3 dBInput Voltage Range ±1.0V ConnectorBNC RearArbitrary Waveform GeneratorAWG5000 Series (AWG5014 • AWG5012 • AWG5004 • AWG5002)(Third party software creation waveform data:MATLAB,MathCad,Excel)S/W driver for 3rd party S/W IVI-com driver and MATLAB libraryInstrument Control/Data Transfer PortsGPIB Remote control and data transfer.(Conforms to IEEE-Std 488.1,compatible with IEEE 488.2 and SCPI-1999.0)Ethernet (10/100/1000Base-T)Remote control and data transfer.(Conforms to IEEE 802.3).RJ-45Computer System & Peripherals Windows XP Professional,512 MB SDRAM,80 GB removable Hard Drive at rear (available front mount kit),CD-RW/DVD drive at front,included USB compact keyboard and mousePC I/O Ports USB 2.0 compliant ports (6 total,2 front,4 rear),PS/2mouse and keyboard connectors (rear panel),RJ-45 Ethernet connector (rear panel) supports 10/100/1000BASE-T,XGA outDisplay Characteristics10.4inch,LCD color display with touch screen,1024 (H)x768 (V) (XGA)Power Supply100 to 240VAC,47 to 63HzPower Consumption450WSafety UL61010-1,CAN/CSA-22.2,No.61010-1-04,EN61010-1,IEC61010-1Emissions EN 55011 (Class A),IEC61000-3-2,IEC61000-3-3Immunity IEC61326,IEC61000-4-2/3/4/5/6/8/11Regional CertificationsEurope EN61326Australia/New Zealand AS/NZS 2064AWG5000 Series • /signal_sources9Arbitrary Waveform GeneratorAWG5000 Series (AWG5014 • AWG5012 • AWG5004 • AWG5002)Ordering Information Arbitrary WaveformGenerator MainframeAWG50141.2GS/s,4-channel,14bits,16M point/channel Arbitrary Waveform Generator.AWG50121.2GS/s,2-channel,14bits,16M point/channel Arbitrary Waveform Generator.AWG5004600MS/s,4-channel,14bits,16M point/channel Arbitrary Waveform Generator.AWG5002600MS/s,2-channel,14bits,16M point/channel Arbitrary Waveform Generator.All Models Include:Accessory pouch,front cover, USB mouse,compact USB key board,lead set for DC output,stylus for touch screen 2 each, Windows®XP operating system restore DVD and instructions,AWG5000 Series product software CD and instructions,Document CD with Browser,Quick Start User Manual,registration card,Certificate of Calibration,power cable.Note:Please specify power cord and language option when ordering.Instrument OptionsAWG5014/AWG5012,AWG5004/AWG5002Opt.01 – Waveform Length Expansion (from 16 M to 32 M).AWG5012/AWG5002Opt. 03 –28 bits digital data outputs (digital data of ch 1 and ch 2).Common OptionsInternational Power PlugsOpt. A0 – North America power.Opt. A1 –Universal EURO power.Opt. A2 – United Kingdom power.Opt. A3 – Australia power.Opt. A5 – Switzerland power.Opt.A6 –Japan power.Opt.A10 – China power.Opt.A99 – No power cord or AC adapter.Language OptionsOpt. L0 – English.Opt. L5 – Japanese.Opt. L7 –Simplified Chinese.Opt. L8 – Traditional Chinese.ServiceOpt. CA1 – A single calibration event.Opt. C3 – Calibration service 3 years.Opt. C5 – Calibration service 5 years.Opt. D1 –Calibration data report.Opt. D3 – Calibration data report 3 years (withoption C3).Opt. D5 – Calibration data report 5 years (withoption C5).Opt. R3 –Repair service 3 years.Opt. R5 –Repair service 5 years.Post-sales Service Options:(e.g.,AWG5012-CA1).CA1 – A single calibration event.R3DW – Repair service coverage 3 years.R5DW – Repair service coverage 5 years.R2PW –Repair service coverage 2 yearspost warranty.R1PW –Repair service coverage 1 yearpost warranty.Product UpgradeAWG5014, AWG50UPOpt.M14 – Waveform Length Expansionfrom 16 M point to 32 M point.Product UpgradeAWG5012, AWG50UPOpt. M12 – Waveform Length Expansionfrom 16 M point to 32 M point.Opt.D13 –Digital Data Outputs.Product UpgradeAWG5004, AWG50UPOpt. M04 – Waveform Length Expansionfrom 16 M point to 32 M point.Product UpgradeAWG5002, AWG50UPOpt.M02 – Waveform Length Expansionfrom 16 M point to 32 M point.Opt.D03 –Digital Data Outputs.AWG5000 Series • /signal_sources 10Arbitrary Waveform GeneratorAWG5000 Series (AWG5014 • AWG5012 • AWG5004 • AWG5002)WarrantyOne-year parts and labor.AWG5000 Series • /signal_sources11Arbitrary Waveform GeneratorAWG5000 Series (AWG5014 • AWG5012 • AWG5004 • AWG5002)For Further InformationTektronix maintains a comprehensive, constantly expanding collection of application notes, technical briefs and other resources to help engineers working on the cutting edge of technology. Please visit Copyright © 2008, Tektronix. All rights reserved. Tektronix products are covered by U.S. and foreign patents, issued and pending. Information in this publication supersedes that in all previously published material.Specification and price change privileges reserved. TEKTRONIX and TEK are registered trademarks of Tektronix, Inc. All other trade names referenced are the service marks, trademarks or registered trademarks of their respective companies. 07/08 JS/WOW 76W-20381-3Contact Tektronix:ASEAN/Australasia (65) 6356 3900Austria +41 52 675 3777Balkans, Israel, South Africa and other ISE Countries +41 52 675 3777Belgium 07 81 60166Brazil & South America (11) 40669400Canada 1 (800) 661-5625Central East Europe, Ukraine and the Baltics +41 52 675 3777Central Europe & Greece +41 52 675 3777Denmark +45 80 88 1401Finland +41 52 675 3777France +33 (0) 1 69 86 81 81Germany +49 (221) 94 77 400Hong Kong (852) 2585-6688India (91) 80-22275577Italy +39 (02) 25086 1Japan 81 (3) 6714-3010Luxembourg +44 (0) 1344 392400Mexico, Central America & Caribbean 52 (55) 5424700Middle East, Asia and North Africa +41 52 675 3777The Netherlands ***********Norway 800 16098People’s Republic of China 86 (10) 6235 1230Poland +41 52 675 3777Portugal 80 08 12370Republic of Korea 82 (2) 6917-5000Russia & CIS +7 (495) 7484900South Africa +27 11 206 8360Spain (+34) 901 988 054Sweden 020 08 80371Switzerland +41 52 675 3777Taiwan 886 (2) 2722-9622United Kingdom & Eire +44 (0) 1344 392400USA 1 (800) 426-2200For other areas contact Tektronix, Inc. at: 1 (503) 627-7111Updated 12 November 2007roduct(s) are manufactured in ISO registered facilitie Product(s) complies with IEEE Standard 488.1-1987,RS-232-C,and with Tektronix Standard Codes and Formats.。
Schlumberger - Well Integrity Program 斯伦贝谢井眼完整性程序
Well Integrity Framework
Component of our “Excellence in Execution” Program
Schlumberger Confidential
Schlumberger Well Integrity Program
Hussam Al Quassar MEA WSV Technique Manager
Well Integrity
Recent industry incidents led to an increase focus on Well Integrity.
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QuarkXPress 2017 使用手册说明书
开始使用QuarkXPress2017内容内容相关文档 (4)系统要求 (5)系统要求:Mac OS X (5)系统要求:Windows (5)安装:Mac OS X (7)安装:Windows (8)执行静默安装 (8)准备静默安装:Windows (8)静默安装:Windows (8)安装后添加文件:Windows (8)安装XTensions模块 (10)首选项 (11)升级 (12)安装或使用QLA升级 (13)注册 (14)激活 (15)激活 (15)激活故障诊断 (16)重新激活 (16)双激活政策 (17)演示模式 (18)许可证转让 (19)卸载 (20)ii|开始使用QUARKXPRESS2017内容卸载:Mac OS X (20)卸载:Windows (20)故障诊断 (21)QuarkXPress文档转换器 (23)联系Quark (24)在美国 (24)在美国境外 (24)法律声明 (25)开始使用QUARKXPRESS2017|iii相关文档关于使用QuarkXPress的详细信息,请参见下列其他QuarkXPress的文档/资源。
从何处获取说明文档/项目名称/support/documentation 该指南是为QuarkXPress的终端用户编写的。
可使用此指南快速查找信息、寻找需要了解的内容并继续您的工作。
QuarkXPress用户指南/support/documentationQuarkXPress 新功能总结。
QuarkXPress 新功能/support/documentation QuarkXPress 数字发布指南。
QuarkXPress 数字发布4|开始使用QUARKXPRESS 2017相关文档系统要求系统要求:Mac OS X软件•Mac OS X ®10.10.5(Yosemite)、Mac OS X ®10.11.6(El Capitan)和Mac OS X ®10.12.x (Sierra)硬件•CPU,双核或多核•2GB RAM 用于QuarkXPress•2GB 硬盘空间,用于安装要在处理复杂(大量图形)和长文档时获得更好的性能,建议使用性能更强大的硬件并为QuarkXPress 提供更多RAM。
赛米控丹佛斯 SEMITRANS 全碳化硅功率模块 SKM260MB170SCH17 数据表
© by SEMIKRONRev. 1.0–04.11.20201SEMITRANS ®3SiC MOSFET ModuleSKM260MB170SCH17Features*•Full Silicon Carbide (SiC) power module•High reliability 2nd Generation SiC MOSFETs•Optimized for fast switching and lowest power losses•External SiC Schottky Barrier Diode embedded•Insulated copper baseplate using DBC technology (Direct Bonded Copper)•Improved thermal performances with Aluminum Nitride (AlN) substrate •UL recognized, file no. E63532Typical Applications•High frequency power supplies •AC inverters •Traction APU •EV Chargers•Industrial Test SystemsRemarks•Case temperature limited to T C = 125°C max.•Recommended T jop = -40 ... +150°C •Gate-Source SURGE VOLTAGE(t surge <300ns), V GS_surge = -10V ... +26VAbsolute Maximum Ratings SymbolConditions Values UnitMOSFET V DSS T j =25°C 1700VI D T j =175°CT c =25°C 378 A T c =80°C301 A I DMPW ≤ 10µs, Duty cycle ≤ 1%980A I DM,repetitive790A V GS -6...22V T j-40 (175)°CAbsolute Maximum Ratings SymbolConditionsValuesUnitInverse diodeV RRM T j =25°C 1700V I F T j =175°CT c =25°C 552A T c =80°C428A I Fnom 300A I FRM 900A I FSM t p =10ms, sin 180°, T j =150°C, including body diode2030A T j-40 (175)°CAbsolute Maximum Ratings SymbolConditions Values UnitModule I t(RMS)500A T stg module without TIM -40...125°C V isolAC sinus 50 Hz, t =1min4000V2Rev. 1.0–04.11.2020© by SEMIKRONSEMITRANS ®3SiC MOSFET ModuleSKM260MB170SCH17Features*•Full Silicon Carbide (SiC) power module•High reliability 2nd Generation SiC MOSFETs•Optimized for fast switching and lowest power losses•External SiC Schottky Barrier Diode embedded•Insulated copper baseplate using DBC technology (Direct Bonded Copper)•Improved thermal performances with Aluminum Nitride (AlN) substrate •UL recognized, file no. E63532Typical Applications•High frequency power supplies •AC inverters •Traction APU •EV Chargers•Industrial Test SystemsRemarks•Case temperature limited to T C = 125°C max.•Recommended T jop = -40 ... +150°C •Gate-Source SURGE VOLTAGE(t surge <300ns), V GS_surge = -10V ... +26VMOSFET V (BR)DSS V GS =0V,I D =1mA, T j =25°C 1700V V GS(th)V DS =V GS , I D =57.75mA1.62.84V I DSS V GS =0V,V DS =1700V, T j =25°C 1.8mA I GSS V GS =22V,V DS =0V 700nA R DS(on)V GS =18V I D =161AchiplevelT j =25°C 8.110m ΩT j =150°C 14m ΩC iss V GS =0V V DS =800Vf =1MHzT j =25°C 27nF C oss T j =25°C 0.88nF C rss T j =25°C0.105nF R Gint T j =25°C2.1ΩQ G V DD =1000V, V GS =-5 ... 20V, I D =300A 1470nC t d(on)V DD =900V I D =300A V GS =-5 / +20VR Gon =0.7ΩR Goff =0.7Ωdi/dt on =12kA/µs di/dt off =9.5kA/µsdv/dt off =22kV/µs T j =150°C 64ns t r T j =150°C 60ns t d(off)T j =150°C162ns t f T j =150°C 32ns E on T j =150°C 7.59mJ E off T j =150°C6.21mJ R th(j-c)per MOSFET0.065K/W R th(c-s)per MOSFET (λgrease =0.81 W/(m*K))0.03K/WCharacteristics SymbolConditionsmin.typ.max.UnitInverse diodeV F = V SD I F =300A chiplevel T j =25°C 1.65 1.95V T j =150°C 2.51 2.86V V F0chiplevel T j =25°C 1.00 1.10V T j =150°C 0.860.96V r F chiplevelT j =25°C2.2 2.8m ΩT j =150°C5.56.3m ΩC j parallel to C oss , f =1MHz, V R =1700V, T j =25°C1.026nF Q c V R =800V, di/dt off =500A/µs, T j =25°C 0.95µCR th(j-c)per diode0.056K/W R th(c-s)per diode (λgrease =0.81 W/(m*K))0.027K/W© by SEMIKRONRev. 1.0–04.11.20203SEMITRANS ®3SiC MOSFET ModuleSKM260MB170SCH17Features*•Full Silicon Carbide (SiC) power module•High reliability 2nd Generation SiC MOSFETs•Optimized for fast switching and lowest power losses•External SiC Schottky Barrier Diode embedded•Insulated copper baseplate using DBC technology (Direct Bonded Copper)•Improved thermal performances with Aluminum Nitride (AlN) substrate •UL recognized, file no. E63532Typical Applications•High frequency power supplies •AC inverters •Traction APU •EV Chargers•Industrial Test SystemsRemarks•Case temperature limited to T C = 125°C max.•Recommended T jop = -40 ... +150°C •Gate-Source SURGE VOLTAGE(t surge <300ns), V GS_surge = -10V ... +26VModule L DS 15nH R DD'+SS'measured per switchT C =25°C0.55m ΩT C =125°C0.85m ΩR th(c-s)1calculated without thermal coupling (λgrease =0.81 W/(m*K))0.008K/W R th(c-s)2including thermal coupling, T s underneath module (λgrease =0.81 W/(m*K))0.013K/W M s to heat sink M635Nm M tto terminals M62.55Nm Nmw325g4Rev. 1.0–04.11.2020© by SEMIKRON© by SEMIKRON Rev. 1.0–04.11.202056Rev. 1.0–04.11.2020© by SEMIKRON© by SEMIKRON Rev. 1.0–04.11.20207This is an electrostatic discharge sensitive device (ESDS) due to international standard IEC 61340.*IMPORTANT INFORMATION AND WARNINGSThe specifications of SEMIKRON products may not be considered as guarantee or assurance of product characteristics ("Beschaffenheitsgarantie"). The specifications of SEMIKRON products describe only the usual characteristics of products to be expected in typical applications, which may still vary depending on the specific application. Therefore, products must be tested for the respective application in advance. Application adjustments may be necessary. The user of SEMIKRON products is responsible for the safety of their applications embedding SEMIKRON products and must take adequate safety measures to prevent the applications from causing a physical injury, fire or other problem if any of SEMIKRON products become faulty. The user is responsible to make sure that the application design is compliant with all applicable laws, regulations, norms and standards. Except as otherwise explicitly approved by SEMIKRON in a written document signed by authorized representatives of SEMIKRON, SEMIKRON products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury. No representation or warranty is given and no liability is assumed with respect to the accuracy, completeness and/or use of any information herein, including without limitation, warranties of non-infringement of intellectual property rights of any third party. SEMIKRON does not assume any liability arising out of the applications or use of any product; neither does it convey any license under its patent rights, copyrights, trade secrets or other intellectual property rights, nor the rights of others. SEMIKRON makes no representation or warranty of non-infringement or alleged non-infringement of intellectual property rights of any third party which may arise from applications. Due to technical requirements our products may contain dangerous substances. For information on the types in question please contact the nearest SEMIKRON sales office. This document supersedes and replaces all information previously supplied and may be superseded by updates. SEMIKRON reserves the right to make changes.8。
XMC4500自动化输入输出芯片模块说明书
XMC4500 Satellite-kit: Automation I/O Kit Part Number: KIT_XMC4X_AUT_ISO_001Features∙Connection to CPU board via ACT Satellite Connector∙ISOFACE OUT, up to 8 channels∙ISOFACE IN, up to 8 channels∙I2C based IO expander up to 8 channels∙Single side assembly of all parts∙ 2 LEDs indicating power (3.3 Volt, 5 Volt)∙Power supply:-Power jack for external 24V supply-From CPU Board via ACT Satellite ConnectorPLEASE SEE THE FOLLOWING PAGES FOR USERS MANUALHexagon Application Kit For XMC4000 FamilyAUT_ISO-V1Automation I/O CardBoard User's Manual Revision 1.0, 2012-02-28Edition 2012-02-28Published byInfineon Technologies AG81726 Munich, Germany© 2012 Infineon Technologies AGAll Rights Reserved.Legal DisclaimerThe information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party.InformationFor further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office ().WarningsDue to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office.Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or otherTrademarks of Infineon Technologies AGAURIX™, C166™, CanPAK™, CIPOS™, CIPURSE™, EconoPACK™, CoolMOS™, CoolSET™, CORECONTROL™, CROSSAVE™, DAVE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPIM™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, I²RF™, ISOFACE™, IsoPACK™, MIPAQ™, ModSTACK™,my-d™, NovalithIC™, OptiMOS™, ORIGA™, PRIMARION™, PrimePACK™, PrimeSTACK™, PRO-SIL™, PROFET™, RASIC™, ReverSave™, SatRIC™, SIEGET™, SINDRION™, SIPMOS™, SmartLEWIS™, SOLID FLASH™, TEMPFET™, thinQ!™, TRENCHSTOP™, TriCore™.Other TrademarksAdvance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™, PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Foru m. COLOSSUS™, FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG. FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics Corporation. Mifare™ of NXP. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RF Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zetex Limited.Last Trademarks Update 2011-02-24Table of ContentsTable of Contents1Overview (7)1.1Key Features (7)1.2Block Diagram (8)2Hardware Description (8)2.1ISOFACE OUT (9)2.2ISOFACE IN (9)2.3IO Expander (10)2.4Power (11)2.5Satellite Connector (12)3Production Data (13)3.1Schematics (13)3.2Layout and Geometry (16)3.3Bill of Material (17)List of FiguresFigure 1Automation I/O Card (AUT_ISO-V1) (8)Figure 2Automation I/O Card Interfaces (8)Figure 3Power Circuit (11)Figure 4ACT Satellite Connector (12)Figure 5Satellite Connector Type ACT (12)Figure 6Satellite Connector, IO Expander, Power (14)Figure 7ISOFACE (15)Figure 8Automation I/O Card Layout (16)List of TablesTable 1ISOFACE OUT Connector Pinout (9)Table 2ISOFACE OUT signal connection to the Satellite Connector (9)Table 3ISOFACE IN Connector Pinout (9)Table 4ISOFACE IN signal connection to the Satellite Connector (10)Table 5GPIO channel LED/SMD pad mapping (10)Table 6IO Expander I2C signal connection to the Satellite Connector (10)Table 7Power LED’s (11)Table 8PowerScale Jumper (11)Table 9Automation I/O Card BOM (17)OverviewIntroductionThis document describes the features and hardware details of the Automation I/O Card (AUT_ISO-V1) designed to work with Infineon’s XMC4500 CPU board. This board is part of Infineon’s Hexagon Application Kits.1 OverviewThe AUT_ISO-V1 board is an application expansion satellite card of the Hexagon Application Kits. The satellite card along with a CPU board (e.g. CPU_45A-V2 board) demonstrates ISOFACE capabilities together with XMC4500. The focus is safe operation under evaluation conditions. The satellite card is not cost optimized and cannot be seen as reference design.1.1 Key FeaturesThe AUT_ISO-V1 satellite card is equipped with following featuresConnection to CPU board (e.g. CPU_45A-V2) via satellite connector ACTISOFACE OUT, up to 8 channelsISOFACE IN, up to 8 channelsI2C based IO expander up to 8 channelsPower supplyo Powerjack for external 24 V supplyo From CPU board via ACT satellite connector1.2Block DiagramFigure 1 shows the block diagram of the AUT_ISO-V1 satellite card. There are following building blocks:Figure 1Automation I/O Card (AUT_ISO-V1)2 Hardware DescriptionThe following sections give a detailed description of the hardware and how it can be used.Figure 2 Automation I/O Card InterfacesISOFACE OUT (ISO1H812G)ISOFACE IN (ISO1I811T)Power 3.3 V (IFX1763SJV33)ISOFACE IN ConnectorACT Satellite ConnectorPower Jack24 V2.1 ISOFACE OUTISOFACE output device used in AUT_ISO-V1 satellite card is ISO1H812G. It is supplied by VDD3.3 on the CPU side and VDD24 for the ISOFACE OUT side. VDD24 and GNDISO can to be connected either by X300 or by X240(24 V external power jack). This is the same net that supplies the DC/DC converter. VDD24 is +24 Vdc (referred to GNDISO)Table 1 below gives the signal details of ISOFACE OUT connector.Table 12 below gives the details of SPI signal connection to the satellite connector.2.2 ISOFACE INISOFACE input device used in AUT_ISO-V1 satellite card is ISO1I811T. It is supplied by 3.3 V on the CPU side and VBB (24V) for the ISOFACE IN side. VBB and GNDBB need a separate connection to 24 V external power source through connector X320.Resistor R337 is used on board for setting input type to IEC61131-2 Type 1.Resistors R326 and R327 sets the frequency of ISOFACE IN to 100 kHz (default).Table 3 gives the details of ISOFACE IN connector pin mapping.Table 3 ISOFACE IN Connector PinoutISOFACE IN shares the same SPI lines with ISOFACE OUT except the chip select as shown in Table 4.2.3 IO ExpanderThe AUT_ISO-V1 satellite card supports GPIO expansion though I2C IO-Expander on board (U230). The I2C Address for IO expander device is 0x1001000X. The satellite card supports 8 such GPIO’s. All t he GPIO’s are connected to LEDs (V230-V237) and SMD-Pads (TP230 – TP237). The Table 5 gives the GPIO channel and corresponding LED/PAD mapping.Table 6 shows the connection of the IO Expander device to the ACT satellite connector.2.4 PowerThe AUT_ISO-V1 satellite card can be supplied by an external power supply (24 V / 1 A) to be connected to the power jack X240 or by a 5 V supply via the 80-pin ACT satellite connector. An external power supply is necessary only in case the current coming via the ACT satellite connector is not sufficient.A DC-DC converter on board (U240) steps down the input voltage from the power jack X240 to 5 V (VDD5). The input voltage can be in the range from 12 V to 24 V. An on board linear voltage regulator is generating a 3.3 V (VDD3.3) power supply out of the VDD5.Figure 3 Power CircuitA Diode V242 protects the reverse flow of current to an external source. Therefore a simultaneous power supply of the satellite boards via both the power jack and the satellite connector with not harm.LED V210 indicates the presence of 5 V power and LED V211 indicates the presence of 3.3 V power.Table 7 Power LED’sThe AUT_ISO-V1 satellite card supports a PowerScale probe for power measurement purpose.Table 8 PowerScale Jumper2.5 Satellite ConnectorThe satellite connector of the AUT_ISO-V1 satellite card interfaces it’s the signals to a CPU board e.g. CPU_45A-V2. Take care to connect the ACT satellite card always to the corresponding ACT satellite connector of the CPU board only.Figure 4 ACT Satellite ConnectorThe signal mapping of the ACT satellite connector and correponding CPU function are provided in figure 6Figure 5 Satellite Connector Type ACT3 Production Data3.1 SchematicsThis chapter contains the schematics for the Automation I/O Card:Satellite Connector, IO Expander, PowerISOFACEFigure 6 Satellite Connector, IO Expander, PowerFigure 7 ISOFACE3.2 Layout and GeometryFigure 8 Automation I/O Card Layout3.3 Bill of MaterialTable 9 Automation I/O Card BOMTable 9 Automation I/O Card BOMw w w.i n f i n e o n.c o m。
PORTFREEPRODUCTIONPROGRAM
PORTFREEPRODUCTIONPROGRAMIntroductionThe PORTFREEPRODUCTIONPROGRAM is a comprehensive software system designed to streamline and automate the production process for port-free products. This program aims to eliminate the need for ports, such as USB or HDMI ports, in electronic devices by providing alternative methods of data transfer and connectivity. In this document, we will provide a detailed overview of the PORTFREEPRODUCTIONPROGRAM, its features, and the benefits it offers to manufacturers of electronic devices.FeaturesThe PORTFREEPRODUCTIONPROGRAM offers a wide range of features that simplify the production process for port-free products. Some of the key features include:Alternative connectivity methodsThe program provides alternative methods of connectivity, such as wireless connectivity and cloud-based data transfer. This allows electronic devices to communicate and exchange information without the need for physical ports.Streamlined manufacturing processThe PORTFREEPRODUCTIONPROGRAM includes several modules that automate various stages of the manufacturing process. These modules include:•Design module: This module allows manufacturers to design port-free electronic devices using an intuitive and user-friendly interface. Manufacturers can specify thedesired functionality of the device and the program willgenerate the necessary code and configurations.•Testing module: This module automatically tests the performance and functionality of the port-free devices toensure that they meet the required standards. It includes comprehensive testing procedures and generates detailed test reports.•Production module: This module handles the production of the port-free devices, including the assembly of components, quality control, and packaging. It ensures that the devices are manufactured in a timely and efficient manner.Integration with existing systemsThe PORTFREEPRODUCTIONPROGRAM can be seamlessly integrated with existing manufacturing systems, such as enterprise resource planning (ERP) and supply chain management (SCM) systems. This allows manufacturers to leverage their existing infrastructure and processes while benefiting from the additional capabilities offered by the program.Real-time analyticsThe program includes a real-time analytics module that provides manufacturers with valuable insights into the production process. It collects and analyzes data from various stages of the manufacturing process, allowing manufacturers to identify bottlenecks, optimize workflows, and improve overall efficiency and productivity.BenefitsBy implementing the PORTFREEPRODUCTIONPROGRAM, manufacturers can enjoy a wide range of benefits, including: Cost savingsEliminating the need for physical ports in electronic devices can significantly reduce the manufacturing costs. This is because ports can be expensive to produce, assemble, and maintain. By utilizing alternative connectivity methods, manufacturers can save on the costs associated with ports, such as connectors, cables, and related components.Enhanced flexibility and design optionsRemoving ports from electronic devices opens up new possibilities in terms of design and form factor. Manufacturers can create more compact and sleek devices without compromising on functionality. This allows for greater flexibility in product design and differentiation, ultimately resulting in a competitive advantage in the market.Improved user experienceBy providing alternative methods of connectivity, the PORTFREEPRODUCTIONPROGRAM enhances the user experience of electronic devices. Users can enjoy seamless wireless connectivity and transfer data effortlessly. This improves convenience and usability, leading to higher customer satisfaction and loyalty.Future-proofingAs technology continues to evolve, the PORTFREEPRODUCTIONPROGRAM ensures that manufacturers are well-prepared for future advancements. By eliminating reliance on physical ports, manufacturers can adapt to emerging technologies and trends without the need for costly hardware upgrades or modifications.ConclusionThe PORTFREEPRODUCTIONPROGRAM is a powerful software system that revolutionizes the production process for port-free electronic devices. With its range of features and benefits, this program offers manufacturers an efficient and cost-effective solution to produce cutting-edge devices without the need for physical ports. By embracing this program, manufacturers can stay ahead of the competition and meet the ever-increasing demands of the market.。
Single Top Quark and Light Higgs Boson at Tevatron
a r X i v :h e p -p h /9804328v 2 21 A p r 1998SINGLE TOP QUARK AND LIGHT HIGGS BOSONAT TEV ATRONA.Belyaevs =2TeV and up to about 120GeV at√1.1SignalWe concentrated on the following processes of single top quark production:1.p¯p→tq¯b+X (W-gluon fusion),2.p¯p→t¯b+X,3.p¯p→tq+ X where q is a light quark and X stands for remnants of the proton and antiproton.Feyn-man diagrams for the above processes are shown in Fig.1.We refer to the paper[2]for de-tails.All analytical and almost all numeri-Figure1:Diagrams for single top production cal calculations have been done by means of CompHEP package[3].FORTRAN codes of matrix elements generated by CompHEP have been used in MC generators implemented as external processes of PYTHIA program.For t-quark production we chose Q2scale equal to top mass squared.For a180GeV top quark the total single top plus anti-top cross section is1.76+0.26−0.18pb(√∆φ2jj+∆η2jj).For Wjj background Q2=M2W has been taken.For calculation of jb¯b and jjb¯b processes we choose invariant b¯bmass for Q2scale.Total cross section of W+2jets(Wjj)“glu-onic”background(1000pb)is about2orders of magnitude higher than that of the signal. The specific feature of single top production is highly energetic b quark in thefinal state and one additional b quark for W-gluon fu-sion process.The b quark content of the Wjj processes is small(less then1%)and efficient b-tagging gives us chance to extract the signal from Wjj overwhelming background.We as-sume50%b-tagging efficiency hereafter.For initial cuts mentioned above the total cross section for W+b¯b process(gluon splitting)is 7.2pb.Contribution from Wjj background due to b quark misidentification should also be taken into account.In our study we chose1%misiden-tification probability.Complete set of Feynman diagrams for W±b¯b background is shown in Fig.2.The main con-tions for jb¯b and jjb¯b are204105and66733pb, respectively.process CS(pb)process CS(pb)gg→gb¯b120180gq→qb¯b82290q¯q→gb¯b1635gg→ggb¯b36212q¯q→q¯q b¯b2269q¯q→ggb¯b288gq→gqb¯b26166gg→q¯q b¯b1798 Table1:jb¯b and jjb¯b cross sections.processes1.3Signal and background study Even after b-tagging procedure the signal is more than one order lower than the background. This fact requires special kinematic analysis in order to reduce the background and leave the signal intact as much as possible.The main difference between kinematic dis-tributions for background and signal is that jets from Wjj,jb¯b and jjb¯b processes are much softer and less central than those for the signal with one very hard jet coming from top and another softer jet,accompanying top quark. Among the kinematic variables for separation of the signal and background the most effec-tive are:p⊥of leading jet(Fig.3a)invariantmass of the system√accompanying cuts Top W b¯b W jj j(j)b¯bˆs>180GeV495743375.p T W>30GeV455039376.jj m>25GeV454838377.H T>100GeV44463636 Table2:Signal and background events;ǫb=50%,m top=180GeV,L=1000pb−1of signal and background kinematics the opti-mal set of cuts for the background suppression has been worked out.The effect of consequent application of these cuts is presented in Ta-ble2.As a result the signal-to-background ra-tio becomes equal to1/3and the signal exceeds the background by3standard deviations.pTjetmax[GeV]Numberofevents10002000300040005000600070008000900020406080100120140160180200√s∧ [GeV]Numberofevents2004006008001000120014001600150200250300350400450500550600———background-----200·signala)b)c)d)HT[GeV]Numberofevents20004000600080001000050100150200250300350400di-jet mass [GeV]Numberofevents100020003000400050006000700050100150200250300350400 Figure3:Distributions for signal and back-ground for some most spectacular variables 1.4Wtb coupling and V tbSince the top quark is rather heavy one could expect that new physics might be revealed at the scale of its mass(see refs.65-71in[2]). We examine the effects of a deviation in the Wtb coupling from the standard model struc-ture,and study sensitivity of measurement of the CKM matrix element V tb.Experimental studies of this type are among the main goals of the single top physics.As an example of a deviation from the stan-dard model Wtb coupling,we introduce addi-tional contribution from the nonstandard(V+ A)structure with arbitrary parameter A r by:Γ=eV tb2sinθW[γµ(1−γ5)+A rγµ(1+γ5)] The production rate varies almost quadrati-cally with A r,and is nearly symmetric around A r=0.The cross section rises from2.44pb when A r=0to4.68pb when A r=−1and to 4.73pb when A r=+1.We have calculated the region in the(V tb,A r)plane where future single top measurements are expected to be sensitive. The error of V tb measurement will be half of the error of the single top cross section,since the cross sections for all single top processes are proportional to|V tb|2.This results in an errorfor V tb and A r around12-19%(L=2fb−1)[2].2Higgs bosonLuminosity upgrade of TEVATRON and in-stallation of the efficient b-tagging system opens also opportunities for the Higgs boson search. This task is crucial since the Higgs boson is the last particle(in the frame of SM)which has not been discovered yet.The most promising will be the Higgs bo-son search in association with the electroweak W and Z bosons[4,5]:Here we concentrated on detailed study of Higgs p¯p→W±H+Xp¯p→ZH+Xs=2TeV the Higgs production cross section is about0.03-0.3pb depending on the Higgs mass and therefore one can expect30-300signal events for integrated luminosity L= 1000pb−1.However the total reaction rates are about two orders of magnitude larger that the Higgs signal.That is why one has to make a detailed analysis of different4-fermionfinal state distributions tofind out whether it is pos-sible tofind a set of cuts to suppress the huge background strongly enough.For the cross sec-tion calculation and event simulation the same procedure has been done as for the single top quark study,including the effect of initial andfinal state radiation.2.2Background studyFrom the complete set of diagrams for back-ground the dominant contribution comes from several subprocesses:1)QCD2→3type mainbackground subprocesses:q¯q′→W±b¯b,q¯q→Zb¯b,gg→Zb¯b;2)2→2electroweak subpro-cesses:q¯q′→W±Z,q¯q→(Z/γ∗)(Z/γ∗);3) single top quark production q¯q′→t¯b or¯t b. Single top background has not been taken into account in the previous studies.This contri-bution becomes more important with growth of the invariant b¯b-pair mass.Signal and background kinematical distri-butions differ mainly due to concentration of events of QCD backgrounds mostly in the re-gion of small p⊥.We study b quark and charged lepton distributions over transverse momentum p⊥(b)and p⊥(ℓ)as well as b¯b distributions over transverse momentum p⊥(b¯b)and miss-ing energy/E⊥.It turned out that pair charac-teristic p⊥(b¯b)related to high transverse mo-menta of Higgs boson is very important for background suppression.After detailed com-parison of the signal and the background distri-butions appropriate set of cuts has been found:1)p⊥(b),p⊥(b¯b)>20GeV;p⊥(ℓ)>15GeV;2)typical cuts for TEVATRON detectors:/E⊥>20GeV;|ηb|<1.5;|ηℓ|<2;|∆R¯b|>0.7; |∆R bℓ|>0.7;3)−2∆M¯b+M¯b<M¯b<2∆M¯b+ M¯b.This set of cuts reduces the total back-ground more than40times.The number of events corresponding to signal and background after the cuts application is presented in Ta-ble3.Requiring3-standard deviation criteria one canfind Higgs up to the mass≃100GeV at√s=4TeV.These numbers are obtained under assumption of50%efficiency of double b-tagging.One can see that with the decreasing Higgs boson mass the contribution of the single top processes to the total background becomes more significant.√M HW ±HZHW b ¯b +W Z +b ¯t Zb ¯b +ZZs =4TeVTable 3:Number of events for Higgs bosonsignal and background after cuts N u m b e r o f e v e n t s√s = 2 TeV pp → (l ν– + l l – +ν ν– ) + bb – + X M H = 80 GeVall cuts absentall cuts appliedInvariant bb –mass distribution[ GeV ]N u m b e r o f e v e n t s250500750100012501500175020002040608010012014010203040506020406080100120140Figure 4:Invariant b ¯b mass distribution be-fore and after cutsIt should be noted also that Wbb background increases approximately two times with the in-creasing of√s =2TeV without any cuts andwith cuts applied revealing clear peak from Higgs boson.ConclusionsStudy of single top quark and Higgs boson pro-duction at the upgraded Tevatron is not only important but also convenient since they have very similar signatures.It was shown that the signal from the sin-gle top quark can be extracted and therefore Wtb vertex and V tb CKM parameter at theupgraded TEVATRON can be measured.Themain backgrounds have been studied:W ±b ¯b,Wjj,jb ¯b +jjb ¯b and the set of kinematical cuts on p ⊥(jet),√s =2TeV and up to about 120GeVat√。
洗刷刷产品设计流程
洗刷刷产品设计流程英文回答:Product Design Process for a Dishwashing Liquid Bottle.1. Research and Define.Conduct market research to identify user needs and pain points.Define the product's target market, including demographics, usage habits, and values.Establish product goals and constraints based on research findings.2. Ideate and Brainstorm.Generate multiple design concepts through brainstorming, sketching, and ideation workshops.Consider ergonomic factors, ease of use, sustainability, and visual appeal.Explore different shapes, sizes, packaging materials, and dispensing mechanisms.3. Prototype and Test.Create physical prototypes to evaluate design ideas and gather user feedback.Conduct usability testing with potential users to assess the product's functionality and user experience.Refine the design based on feedback and testing results.4. Develop and Refine.Finalize the product design and select materials and components.Optimize the dispensing mechanism for ease of use and efficiency.Design packaging that aligns with the brand identity and product positioning.5. Manufacture and Launch.Partner with a manufacturer to produce the product according to specifications.Plan and execute a product launch strategy that includes marketing and distribution channels.6. Monitor and Iterate.Gather customer feedback and market data to track product performance.Identify areas for improvement and iterate the design as needed to enhance user experience and market acceptance.中文回答:洗刷刷产品设计流程。
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Principle of MCUSingle-chip is an integrated on a single chip a complete computer system. Even though most of his features in a small chip, but it has a need to complete the majority of computer components: CPU, memory, internal and external bus system, most will have the Core. At the same time, such as integrated communication interfaces, timers, real-time clock and other peripheral equipment. And now the most powerful single-chip microcomputer system can even voice, image, networking, input and output complex system integration on a single chip.Also known as single-chip MCU (Microcontroller), because it was first used in the field of industrial control. Only by the single-chip CPU chip developed from the dedicated processor. The design concept is the first by a large number of peripherals and CPU in a single chip, the computer system so that smaller, more easily integrated into the complex and demanding on the volume control devices. INTEL the Z80 is one of the first design in accordance with the idea of the processor, From then on, the MCU and the development of a dedicated processor parted ways.Early single-chip 8-bit or all of the four. One of the most successful is INTEL's 8031, because the performance of a simple and reliable access to a lot of good praise. Since then in 8031 to develop a single-chip microcomputer system MCS51 series. Based on single-chip microcomputer system of the system is still widely used until now. As the field of industrial control requirements increase in the beginning of a 16-bit single-chip, but not ideal because the price has not been very widely used. After the 90's with the big consumer electronics product development, single-chip technology is a huge improvement. INTEL i960 Series with subsequent ARM in particular, a broad range of applications, quickly replaced by 32-bit single-chip 16-bit single-chip high-end status, and enter the mainstream market. Traditional 8-bit single-chip performance has been the rapid increase in processing power compared to the 80's to raise a few hundred times. At present, the high-end 32-bit single-chip frequency over 300MHz, the performance of the mid-90's close on the heels of a special processor, while the ordinary price of the model dropped to one U.S. dollars, the most high-end models, only 10 U.S. dollars. Contemporary single-chip microcomputer system is no longer only the bare-metal environment in the development and use of a large number of dedicated embedded operating system is widely used in the full range of single-chip microcomputer. In PDAs and cell phones as the core processing of high-end single-chip or even a dedicated direct access to Windows and Linux operating systems.More than a dedicated single-chip processor suitable for embedded systems, so it was up to the application. In fact the number of single-chip is the world's largest computer. Modern human life used in almost every piece of electronic and mechanical products will have a single-chip integration. Phone, telephone, calculator, home appliances, electronic toys, handheld computers and computer accessories such as a mouse in the Department are equipped with 1-2 single chip. And personal computersalso have a large number of single-chip microcomputer in the workplace. Vehicles equipped with more than 40 Department of the general single-chip, complex industrial control systems and even single-chip may have hundreds of work at the same time! SCM is not only far exceeds the number of PC and other integrated computing, even more than the number of human beings.Hardwave introductionThe 8051 family of micro controllers is based on an architecture which is highly optimized for embedded control systems. It is used in a wide variety of applications from military equipment to automobiles to the keyboard on your PC. Second only to the Motorola 68HC11 in eight bit processors sales, the 8051 family of microcontrollers is available in a wide array of variations from manufacturers such as Intel, Philips, and Siemens. These manufacturers have added numerous features and peripherals to the 8051 such as I2C interfaces, analog to digital converters, watchdog timers, and pulse width modulated outputs. Variations of the 8051 with clock speeds up to 40MHz and voltage requirements down to 1.5 volts are available. This wide range of parts based on one core makes the 8051 family an excellent choice as the base architecture for a company's entire line of products since it can perform many functions and developers will only have to learn this one platform.The basic architecture consists of the following features:an eight bit ALU,32 descrete I/O pins (4 groups of 8) which can be individually accessed, two 16 bit timer/counters,full duplex UART,6 interrupt sources with 2 priority levels,128 bytes of on board RAM,separate 64K byte address spaces for DATA and CODE memory.One 8051 processor cycle consists of twelve oscillator periods. Each of the twelve oscillator periods is used for a special function by the 8051 core such as op code fetches and samples of the interrupt daisy chain for pending interrupts. The time required for any 8051 instruction can be computed by dividing the clock frequency by 12, inverting that result and multiplying it by the number of processor cycles required by the instruction in question. Therefore, if you have a system which is using an 11.059MHz clock, you can compute the number of instructions per second by dividing this value by 12. This gives an instruction frequency of 921583 instructions per second. Inverting this will provide the amount of time taken by each instruction cycle (1.085 microseconds).Structure and function of the MCS-51 seriesStructure and function of the MCS-51 series one-chip computer MCS-51 is a name of a piece of one-chip computer series which Intel Company produces. This company introduced 8 top-grade one-chip computers of MCS-51 series in 1980 after introducing 8 one-chip computers of MCS-48 series in 1976. It belong to a lot of kinds this line of one-chip computer the chips have, such as 8051, 8031, 8751, 80C51BH, 80C31BH,etc., their basic composition, basic performance and instructionsystem are all the same. 8051 daily representatives 51 serial one-chip computers.A one-chip computer system is made up of several following parts: (1) One microprocessor of 8 (CPU). ( 2) At slice data memory RAM (128B/256B),it use not depositing not can reading /data that write, such as result not middle of operation, final result and data wanted to show, etc. ( 3) Procedure memory ROM/EPROM (4KB/8KB ), is used to preserve the procedure , some initial data and form in slice. But does not take ROM/EPROM within some one-chip computers, such as 8031 ,8032, 80C ,etc. ( 4) Four 8 run side by side I/O interface P0 four P3, each mouth can use as introduction , may use as exporting too. ( 5) Two timer / counter, each timer / counter may set up and count in the way, used to count to the external incident, can set up into a timing way too, and can according to count or result of timing realize the control of the computer. ( 7) One all depleting serial I/O mouth of UART (universal asynchronous receiver/transmitter (UART) ), is it realize one-chip computer or one-chip computer and serial communication of computer to use for.(8) Stretch oscillator and clock produce circuit, quartz crystal finely tune electric capacity need outer. Allow oscillation frequency as 12 megahits now at most. Every the above-mentioned part was joined through the inside data bus .Among them, CPU is a core of the one-chip computer, it is the control of the computer and command centre, made up of such parts as arithmetic unit and controller , etc.. The arithmetic unit can carry on 8 persons of arithmetic operation and unit ALU of logic operation while including one, the 1 storing device temporalities of 8, storing device 2 temporarily, 8's accumulation device ACC, register B and procedure state register PSW, etc. Person who accumulate ACC count by 2 input ends entered of checking etc. temporarily as one operation often, come from person who store 1 operation is it is it make operation to go on to count temporarily , operation result and loopback ACC with another one. In addition, ACC is often regarded as the transfer station of data transmission on 8051 inside. The same as general microprocessor, it is the busiest register. Help remembering that agreeing with A expresses in the order. The controller includes the procedure counter, the order is deposited, the order deciphers the oscillator and timing circuit, etc. The procedure counter is made up of counter of 8 for two, amounts to 16. It is a byte address counter of the procedure in fact, the content is the next IA that will carried out in PC. The content which changes it can change the direction that the procedure carries out . Shake the circuit in 8051 one-chip computers, only need outer quartz crystal and frequency to finely tune the electric capacity, its frequency range is its 12MHZ of 1.2MHZ. This pulse signal, as 8051 basic beats of working, namely the minimum unit of time. 8051 is the same as other computers, the work in harmony under the control of the basic beat, just like an orchestra according to the beat play that is commanded. there are ROM (procedure memory , can only read ) and RAM in 8051 slices (data memory, can is it can write ) two to read, they have each independent memory address space, dispose way to be the same with general memory of computer.Procedure 8051 memory and 8751 slice procedure memory capacity 4KB, address begin from 0000H, used for preserving the procedure and form constant. Data 8051- 8751 8031 of memory data memory 128B, address false 00FH, use for middleresult to deposit operation, the data are stored temporarily and the data are buffered etc.. In RAM of this 128B, there is unit of 32 bytes that can be appointed as the job register, this and general microprocessor is different, 8051 slice RAM and job register rank one formation the same to arrange the location. It is not very the same that the memory of MCS-51 series one-chip computer and general computer disposes the way in addition. General computer for first address space, ROM and RAM can arrange in different space within the range of this address at will, namely the addresses of ROM and RAM, with distributing different address space in a formation. While visiting the memory, corresponding and only an address Memory unit, can ROM, it can be RAM too, and by visiting the order similarly. This kind of memory structure is called the structure of Princeton. 8051 memories are divided into procedure memory space and data memory space on the physics structure, there are four memory spaces in all: The procedure stores in one and data memory space outside data memory and one in procedure memory space and one outside one, the structure forms of this kind of procedure device and data memory separated form data memory, called Harvard structure. But use the angle from users, 8051 memory address space is divided into three kinds: (1) In the slice, arrange blocks of FFFFH, 0000H of location, in unison outside the slice (use 16 addresses). (2) The data memory address space outside one of 64KB, the address is arranged from 0000H 64KB FFFFH (with 16 addresses) too to the location. (3) Data memory address space of 256B (use 8 addresses). Three above-mentioned memory space addresses overlap, for distinguishing and designing the order symbol of different data transmission in the instruction system of 8051: CPU visit slice, ROM order spend MOVC , visit block RAM order uses MOVX outside the slice, RAM order uses MOV to visit in slice.8051 one-chip computer have four 8 walk abreast I/O port, call P0, P1, P2 and P3. Each port is 8 accurate two-way mouths, accounts for 32 pins altogether. Every one I/O line can be used as introduction and exported independently. Each port includes a latch (namely special function register), one exports the driver and a introduction buffer. Make data can latch when outputting, data can buffer when making introduction , but four function of pass way these self-same. Expand among the system of memory outside having slice, four ports these may serve as accurate two-way mouth of I/O in common use. Expand among the system of memory outside having slice, P2 mouth see high 8 address off; P0 mouth is a two-way bus, send the introduction of 8 low addresses and data / export in timesharing output grade, P3 of mouth, P1 of P1, connect with inside have load resistance of drawing, every one of they can drive 4 Model LS TTL load to output. As while inputting the mouth, any TTL or NMOS circuit can drive P1 of 8051 one-chip computers as P3 mouth in a normal way. Because draw resistance on output grade of them have, can open a way collector too or drain-source resistance is it urge to open a way, do not need to have the resistance of drawing outer. Mouths are all accurate two-way mouths too. When the conduct is input, must write the corresponding port latch with 1 first. As to 80C51 one-chip computer, port can only offer milliamp ere of output electric currents, is it output mouth go when urging one ordinary basing of transistor to regard as, shouldcontact a resistance among the port and transistor base, in order to the electricity while restraining the high level from exporting P1~P3 Being restored to the throne is the operation of initializing of an one-chip computer. Its main function is to turn PC into 0000H initially, make the one-chip computer begin to hold the conduct procedure from unit 0000H. Except that the ones that enter the system are initialized normally, as because procedure operate it make mistakes or operate there aren't mistake, in order to extricate oneself from a predicament , need to be pressed and restored to the throne the key restarting too. It is an input end which is restored to the throne the signal in 8051 China RST pin. Restore to the throne signal high level effective, should sustain 24 shake cycle (namely 2 machine cycles) the above its effective times. If 6 of frequency of utilization brilliant to shake, restore to the throne signal duration should exceed 4 delicate to finish restoring to the throne and operating. Produce the logic picture of circuit which is restored to the throne the signal:restore to the throne the circuit and include two parts outside in the chip entirely. Outside that circuit produces to restore to the throne signal (RST) hand over to Schmitt's trigger, restore to the throne circuit sample to output, Schmitt of trigger constantly in each S5P2, machine of cycle in having one more, then just got and restored to the throne and operated the necessary signal inside. Restore to the throne resistance of circuit generally, electric capacity parameter suitable for 6 brilliant to shake, can is it restore to the throne signal high level duration greater than 2 machine cycles to guarantee. Being restored to the throne in the circuit is simple, its function is very important. Pieces of one-chip computer system could normal running, should first check it can restore to the throne not succeeding. Checking and can pop one's head and monitor the pin with the oscillograph tentatively, push and is restored to the throne the key, the wave form that observes and has enough range is exported (instantaneous), can also through is it restore to the throne circuit group holding value carry on the experiment to change.翻译:单片机原理单片机是指一个集成在一块芯片上的完整计算机系统。
AMD FirePro W5100 4GB 工作站图形卡介绍说明书
AMD FirePro W5100 4GB GraphicsAMD FirePro W5100 4GB Graphics J3G92AA INTRODUCTIONThe AMD FirePro™ W5100 workstation graphics card delivers impressive performance, superb visual quality, andoutstanding multi-display capabilities all in a single-slot, <75W solution. It is an excellent mid-range solution forprofessionals who work with CAD & Engineering and Media & Entertainment applications.The AMD FirePro W5100 features four display outputs and AMD Eyefinity technology support, as well as support up to six simultaneous and independent monitors from a single graphics card via DisplayPort Multi-Streaming (see Note 1).Also, the AMD FirePro W5100 is backed by 4GB of ultra-fast GDDR5 memory.PERFORMANCE AND FEATURES∙AMD Graphics Core Next (GCN) architecture designed to effortlessly balance GPU compute and 3D workloads efficiently∙Segment leading compute architecture yielding up to 1.43 TFLOPS peak single precision∙Optimized and certified for leading workstation ISV applications. The AMD FirePro™ professional graphics family is certified on more than 100 different applications for reliable performance.∙GeometryBoost technology with dual primitive engines∙Four (4) native display DisplayPort 1.2a (with Adaptive-Sync) outputs with 4K resolution support∙Up to six display outputs using DisplayPort 1.2a and MST compliant displays, HBR2 support∙AMD Eyefinity technology (see Note 1) support managing up to 6 displays seamlessly as though they were one display∙FreeSync display technology enabling GPU control of the display refresh rate for tear-free display updates∙AMD PowerTune and AMD ZeroCore Power technologies that allow for state of the art dynamic power management of the GPU∙4GB of high speed GDDR5 memory∙PCI Express® 3.0 compliantCOMPATIBILITYThe AMD FirePro W5100 is supported on the following HP Z Workstations:- Z230 CMT, Z440, Z640, Z840SERVICE AND SUPPORTThe AMD FirePro W5100 has a one-year limited warranty or the remainder of the warranty of the HP product in which it is installed. Technical support is available seven days a week, 24 hours a day by phone, as well as online support forums.Parts and labor are available on-site within the next business day. Telephone support is available for parts diagnosis and installation. Certain restrictions and exclusions apply.TECHNICAL SPECIFICATIONSForm Factor Full height, single slot (6.75” X 4.376”)Graphics Controller AMD FirePro W5100 graphicsGPU Frequency: 930MhzGPU: 768 Stream Processors organized into 12 Compute UnitsPower: <75 WattsCooling: ActiveBus Type PCI Express® x16, Generation 3.0Memory 4GB GDDR5 memoryMemory Bandwidth: up to 96 GB/sMemory Width: 128 bitConnectors 4x Display Port 1.2 connectors with HBR2 and MST support.Factory Configured: No video cable adapter includedAfter market option kit: No video cable adapter includedAdditional DisplayPort-to-VGA or DisplayPort-to-DVI adapters are available as FactoryConfiguration or Option Kit accessories.Maximum Resolution DisplayPort:- 4096x2160 @24bpp 60HzDual Link DVI:- 2560x1600 (requires DP to DL-DVI adapter)Single Link DVI:- 1920x1200 (requires DP to DVI adapter)VGA:- 1920x1200 (requires DP to VGA adapter)Technical SpecificationsImage Quality Features Advanced support for 8-bit, 10-bit, and 16-bit per RGB color component.High bandwidth scaler for high quality up and downscalingDisplay Output Max number of monitors supported using DisplayPort 1.2a:- 4 direct attached monitors- 6 using DP 1.2a with MST and HBR2 enabled monitorsMonitor chaining from a single DisplayPort (subject to a max of 6 total monitors across alloutputs, requires use of DisplayPort enabled monitors supporting MST and HBR2):- one 4096x2160 display- two 2560x1600 displays- four 1920x1200 displaysShading Architecture Shader Model 5.0Supported Graphics APIs OpenGL 4.4OpenCL 1.2 and 2.0DirectX 11.2 / 12AMD MantleAvailable Graphics Drivers Windows 8.1 / 8 (64-bit and 32-bit)Windows® 7 (64-bit and 32-bit)LinuxHP qualified drivers may be preloaded or available from the HP support Web site:/country/us/en/support.htmlNotes 1. AMD Eyefinity technology supports up to six DisplayPort™ monitors on an enabled graphicscard. Supported display quantity, type and resolution vary by model and board design; confirmspecifications with manufacturer before purchase. To enable more than two displays, or multipledisplays from a single output, additional hardware such as DisplayPort-ready monitors orDisplayPort 1.2 MST-enabled hubs may be required. A maximum of two active adapters isrecommended for consumer systems. See /eyefinityfaq for full details.2. Configurations of two FirePro W5100 graphics cards in HP Z440 Workstation require the HPZ440 Fan and Front Card Guide Kit, configurable from the factory (CTO PN: G8T99AV) or as anAftermarket Option (AMO PN: J9P80AA).Summary of ChangesDate of change: VersionDescription of change:History:May 1, 2015 From v1 to v2 Changed Notes for Technical Specifications section© Copyright 2015 Hewlett-Packard Development Company, L.P.The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. The information contained herein is subject to change without notice.。
堆叠式内存制造中炉管非选择性半球状多晶硅片数效应
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神茶的制作流程作文英文
神茶的制作流程作文英文下载温馨提示:该文档是我店铺精心编制而成,希望大家下载以后,能够帮助大家解决实际的问题。
文档下载后可定制随意修改,请根据实际需要进行相应的调整和使用,谢谢!并且,本店铺为大家提供各种各样类型的实用资料,如教育随笔、日记赏析、句子摘抄、古诗大全、经典美文、话题作文、工作总结、词语解析、文案摘录、其他资料等等,如想了解不同资料格式和写法,敬请关注!Download tips: This document is carefully compiled by theeditor. I hope that after you download them,they can help yousolve practical problems. The document can be customized andmodified after downloading,please adjust and use it according toactual needs, thank you!In addition, our shop provides you with various types ofpractical materials,such as educational essays, diaryappreciation,sentence excerpts,ancient poems,classic articles,topic composition,work summary,word parsing,copyexcerpts,other materials and so on,want to know different data formats andwriting methods,please pay attention!First, you need to gather all the necessary ingredients for making a divine tea. This includes tea leaves, herbs, spices, and any other flavorings you desire. The key is to choose high-quality ingredients that will create a rich and aromatic blend.Next, you must prepare the tea leaves by heating waterto the perfect temperature. This can vary depending on the type of tea you are using. Green tea, for example, requires water that is slightly cooler than boiling, while black tea needs boiling water. It's important to follow the specific instructions for each type of tea to ensure the best flavor.Once the water is at the right temperature, you can add the tea leaves and let them steep for the recommended amount of time. This allows the flavors to infuse into the water and create a delicious brew. Be patient and resistthe temptation to rush this step – it's worth the wait!While the tea is steeping, you can prepare any additional ingredients you want to add to your divine tea. This could include herbs like mint or chamomile, spiceslike cinnamon or ginger, or even fruits like lemon or orange. The possibilities are endless, so get creative and experiment with different combinations.After the tea has finished steeping, it's time tostrain out the leaves and any other solid ingredients you added. This will ensure a smooth and enjoyable drinking experience without any unwanted bits floating around in your cup. Use a fine-mesh strainer or a tea infuser to achieve the best results.Finally, it's time to sit back, relax, and enjoy your divine tea. Take a moment to appreciate the aroma and flavors that you have created. Savor each sip and let the warmth and comfort of the tea wash over you. Whether you're enjoying it alone or sharing it with friends, a cup of divine tea is always a treat.Remember, the beauty of making divine tea lies in theability to personalize it to your own taste. Don't be afraid to experiment with different ingredients and ratios until you find the perfect blend. With a little practice and creativity, you can create a tea that is truly divine. So go ahead, grab your ingredients and start brewing!。
调试单体设备英语作文
调试单体设备英语作文Title: Debugging Monolithic Devices。
Debugging monolithic devices is a crucial aspect of ensuring their optimal functionality and performance. In this essay, we will explore the process of debugging monolithic devices, highlighting the challenges involved and the strategies employed to overcome them.Firstly, it is important to understand what monolithic devices are. Monolithic devices refer to integrated circuits or systems where most, if not all, components are fabricated onto a single substrate or chip. These devices are commonly found in various applications, including microprocessors, memory chips, and sensors.One of the primary challenges in debugging monolithic devices is the complexity of their internal structure. Unlike modular devices where components can be easily isolated and tested individually, monolithic devicespresent a more intricate system where a fault in one component can affect the functionality of the entire device. Therefore, pinpointing the root cause of a problem requires meticulous analysis and testing.To effectively debug monolithic devices, engineers employ a variety of techniques and tools. One commonly used method is the use of built-in self-test (BIST) circuits. These circuits are integrated into the device during the fabrication process and allow for automated testing of various components. By activating the BIST circuits, engineers can quickly identify faulty components or connections within the device.In addition to BIST circuits, engineers also utilize external testing equipment such as oscilloscopes, logic analyzers, and probe stations. These tools enable engineers to perform detailed measurements and observations of the device under test, helping to identify anomalies and irregularities.Furthermore, advanced diagnostic techniques such asfault simulation and emulation are employed to simulatereal-world operating conditions and identify potentialfailure scenarios. By subjecting the device to simulated stress conditions, engineers can uncover latent defects and weaknesses that may not be apparent during normal operation.Despite the availability of sophisticated tools and techniques, debugging monolithic devices remains a challenging task due to the inherent complexity of these systems. Often, the process involves a combination of theoretical analysis, empirical testing, and creative problem-solving.Moreover, the miniaturization of modern monolithic devices presents additional challenges in debugging. As components shrink in size, the spacing between them decreases, making it more difficult to access and probe individual elements. This necessitates the development of specialized testing methodologies and equipment capable of handling miniature components.In conclusion, debugging monolithic devices is acomplex and challenging process that requires a combination of expertise, creativity, and advanced tools. By employing a systematic approach and leveraging the available resources, engineers can effectively identify and resolve issues, ensuring the reliability and performance of monolithic devices in various applications.。
DTP桌面排版工具之QuarkXPress
书山有路勤为径;学海无涯苦作舟DTP桌面排版工具之QuarkXPressQuarkXPress是一款着名的综合排版软件,由Quark 公司在1987年推出。
它功能全面,可以完成各种简单及复杂的排版任务。
除了基本的页面布局框架和出色的文本格式化工具以外,它还包含大量方便易用的特性,适合各种出版介质。
QuarkXPress将专业排版、设计、彩色和图形处理功能、文字处理及复杂的印前作业功能集于一身。
它最早采用了扩展灵活的Extension技术,通过各种第三方的扩展插件实现更为强大的功能。
自面世以来相当长一段时间内,QuarkXPress以其优秀的设计理念、强大的排版功能、先进的色彩处理能力等多方面优势在桌面出版行业,特别是在高端出版市场中占据了领先的地位。
QuarkXPress较早的版本主要运行在Mac OS 之上,从4.0以后增加了Windows 版本。
目前最新版本为QuarkXPress 6.0。
QuarkXPress针对不同的语言有不同的版本,且各版本之间不能互相交换文件。
这一策略给Quark公司带来了可观的利润,但也给本地化的桌面出版工作带来了诸多的不便。
以亚洲本地化中最常见的CJK(简繁中文/日文/韩文)为例,要完成四个文种的工作,就需要四个不同版本的Quark,并且不同的语言不能在一个文件中同时处理。
在从操作系统到应用软件都在向支持多语言,支持Unicode的方向全面发展的今天,QuarkXPress的这一策略将可能极大地限制自身的发展。
QuarkXPress软件本身的本地化工作也进展缓慢。
在完成3.3和4.1版的简体、繁体中文版后,Quark基本上停止了中文版的开发。
由于没有更高的中文版本,本地化中QuarkXPress的项目只能在较早的Mac OS 9之上完成。
专注下一代成长,为了孩子。
Quark PDF Style说明书
Last update: May 18, 2016 9:46 AM Page 1 of 1Loading Century Quark PDF Style OverviewLoading a Quark PDF Style is quick and painless. Be sure you have downloaded the Century Quark PDF Style before you begin. You can download it from: guide/quark/quark-pdf-export-settings/. Be sure to save the preset file to a location will be able to find later. For the purposes of these instructions we are using QuarkXPress 8, but steps are the same for QuarkXPress 7 and newer.Loading the PDF Preset1. Within Quark, click in the Edit menu, thenclick Output Styles…2. This will open up a new window that listscurrently loaded Output Styles displayed atthe top and buttons along the bottom. Clickon the Import… button.3. Another window should now be openallowing you to browse to the PDF Style fileyou downloaded. Navigate to where the fileis saved, highlight it then click the Openbutton.4. You will now be back in the windowdisplaying the currently loaded OutputStyles and you should now see theCenturyPDF setting listed. Click the Savebutton to close the window and save thePDF Style in your list of Output ing the PDF StyleWhen you are ready to make the final press quality PDFs of your magazine, within Quark, click the File menu then click Export , then select Layout as PDF… At this point you will be prompted to choose a name and location for your PDF(s). Be sure to select the Century PDF style as the PDF Style before you click the Save button.1234。
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February 1, 2008
Abstract We evaluate the tc ¯ and tu ¯ productions at the LHC within the general unconstrained MSSM framework. We find that these single top quark productions induced by SUSY-QCD FCNC couplings have remarkable cross sections for favorable parameter values allowed by current low energy data, which can be as large as a few pb. Once large rates of the tc ¯ and tu ¯ productions are detected at the LHC, they may be induced by SUSY FCNC couplings. We show that the precise measurement of single top quark production cross sections at the LHC is a powerful probe for the details of the SUSY FCNC couplings.
Single top quark production via SUSY-QCD FCNC couplings at the CERN LHC in the unconstrained
arXiv:hep-ph/0404099v2 13 Dec 2004
MSSM
Jian Jun Liua , Chong Sheng Lia∗ , Li Lin Yanga and Li Gang Jinb
Keywords: top quark, MSSM, FCNC PACS numbers: 14.65.Ha, 12.60.Jv, 11.30.pb
∗
csli@
1
1
Introduction
The flavor dynamics, such as the mixing of three generation fermions and their large mass differences observed, is still a great mystery in particle physics today. The heaviest one of three generation fermions is the top quark with the mass close to the electroweak (EW) symmetry breaking scale. Therefore, it can play a role of a wonderful probe for the EW breaking mechanism and new physics beyond the standard model (SM) through its decays and productions. An important aspect of the top quark physics is to investigate anomalous flavor changing neutral current (FCNC) couplings. Within the SM, FCNC is forbidden at the tree-level and highly suppressed by the GIM mechanism [1] at one-loop level. All the precise measurements of various FCNC processes, for example, b → sγ [2], agree with the SM predictions. However, many new physics models allow the existence of the tree-level FCNC couplings, and may enhance some FCNC processes. In particular, the minimal supersymmetric standard model (MSSM) is one of the most popular new physics models. And it is hard to believe that this model will say no more about the flavor dynamics than the SM. The MSSM includes 105 free parameters beyond the SM: 5 real parameters and 3 CP-violating phases in the gaugino/higgsino sector, 21 squark and slepton masses, 36 new real mixing angles to define the squark and slepton mass eigenstates, and 40 new CP-violating phases that can appear in squark and slepton interactions [2], so in general, it can provide a new explanation of the source of FCNC couplings. Actually, many of the parameters are constrained by present experimental data, and some popular SUSY models, for example, the gravity-mediated supersymmetry brokeupersymmetry broken model (GMSB) [4], anomaly mediated supersymmetry broken model (AMSB) [5], gaugino mediated supersymmetry broken model (gMSB) [6] and Kaluza-Klein mediated supersymmetry broken model [7], make some ad hoc assumptions to reduce the number of independent parameters. Although the predictions of these models can agree with the present constraints from FCNC experiments, it should be noted that few experimental constraints on the top quark FCNC processes are available so far [2]. Since the CERN Large Hadron Collider (LHC) can produce abundant top events, the measurement of the top quark rare processes will become possible. Therefore, a good un2
derstanding of the theoretical predictions of these processes, especially within the general unconstrained MSSM framework, is important. And a careful investigation will provide some clues to the constraint relations among the supersymmetry (SUSY) parameters and more clear information about the SUSY breaking mechanisms. The top quark FCNC processes have been investigated in detail. There are two categories of these investigations, one of which is the top quark FCNC decays [8], especially for t → cg [9, 10] and t → ch [11] in the MSSM. These results show that the branch ratio of t → cg can reach 10−4 [10], which enhances the one in the SM (∼ 10−11 ) significantly. The other category is the top quark productions through FCNC processes [12]–[17], ones of which induced by the anomalous top quark FCNC couplings at the colliders have been extensively discussed in a model independent way [12]–[16] and model dependent way [17], respectively. As we know, most of the works within SUSY models are limited in some constrained MSSM, where the top quark FCNC couplings were studied through some SUSY-CKM matrices or mass insertion approximation [18]. However, it is interesting to study the top quark FCNC productions using soft SUSY broken parameters directly, and then establish some relations between the production cross sections and soft SUSY broken parameters in the mass eigenstate formalism [19, 20]. Actually, the general framework with SUSY FCNC mechanisms was presented several years ago [21], and there have been a lot of works studying SUSY FCNC processes within this framework [19, 20]. But the top quark SUSY FCNC production processes have not been studied in above framework so far, and this means that the relations between the observables of the top quark production processes and the mixing among up squarks involving the third generation have not been established yet. In this paper, we will investigate the single top quark productions at the LHC induced by SUSY FCNC couplings in the general unconstrained MSSM, which include the top quark productions associated with the anti-charm quark and the anti-up quark, and we believe that it is an important step towards revealing the top quark SUSY FCNC couplings and exploring some relations among SUSY broken parameters at the LHC. The paper is organized as follows: In Sec. 2 we describe the general framework of