IC datasheet pdf-74AC11245,pdf(Octal Bus Transceiver)
IC datasheet pdf-REF1004,pdf(Micropower Voltage Reference)
The REF1004 is offered in an 8-lead Plastic SOIC package and shipped in anti-static rails or tape and reel.
Typical Operating Circuit
NC 1 NC 2 NC 3 Anode 4
IR = 100µA
10Hz ≤ IR ≤ 10kHz
60
120
µV
LONG TERM STABILITY
IR = 100µA
TA = 25°C ± 0.1°C
20
2 (1) This specification applies over the full operating temperature range of 0°C ≤ TA ≤ 70°C. (2) This specification applies over the full operating temperature range of 40°C ≤ TA ≤ +85°C. (3) Denotes the specifications which apply over the full operating temperature range.
IC datasheet pdf-CD74ACT10,pdf(QUADRUPLE 2-INPUT POSITIVE-NAND GATES)
TRIPLE 3-INPUT POSITIVE-NAND GATESTRIPLE 3-INPUT POSITIVE-NAND GATESIMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. 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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers AudioData Converters AutomotiveDSP BroadbandInterface Digital ControlLogic MilitaryPower Mgmt Optical NetworkingMicrocontrollers SecurityLow Power TelephonyWirelessVideo&ImagingWirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments IncorporatedPACKAGING INFORMATION Orderable DeviceStatus (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)CD74ACT10EACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type CD74ACT10EE4ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type CD74ACT10MACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM CD74ACT10M96ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM CD74ACT10M96E4ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM CD74ACT10M96G4ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM CD74ACT10ME4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM CD74ACT10MG4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die andleadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.PACKAGE OPTION ADDENDUM 23-Apr-2007TAPE AND REEL INFORMATION*All dimensions are nominal Device Package Type Package DrawingPinsSPQ Reel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant CD74ACT10M96SOIC D 142500330.016.4 6.59.0 2.18.016.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) CD74ACT10M96SOIC D142500346.0346.033.0。
IC datasheet pdf-DS1921G,pdf,datasheet,Thermochron iButton
General Description The DS1921G Thermochron ®iButton ®is a rugged, self-sufficient system that measures temperature and records the result in a protected memory section. The recording is done at a user-defined rate, both as a direct storage of temperature values as well as in the form of a histogram.Up to 2048 temperature values taken at equidistant inter-vals ranging from 1 to 255min can be stored. The his-togram provides 63 data bins with a resolution of 2.0°C.If the temperature leaves a user-programmable range,the DS1921G also records when this happened, for how long the temperature stayed outside the permitted range,and if the temperature was too high or too low. An addi-tional 512 bytes of read/write nonvolatile (NV) memory allows storing information pertaining to the object to which the DS1921G is associated. Data is transferred serially through the 1-Wire ®protocol, which requires only a single data lead and a ground return. Every DS1921G is factory lasered with a guaranteed unique, electrically readable, 64-bit registration number that allows for abso-lute traceability. The durable stainless steel package is highly resistant to environmental hazards such as dirt,moisture, and shock. Accessories permit the DS1921G to be mounted on almost any object including contain-ers, pallets, and bags.ApplicationsFeatures♦Digital Thermometer Measures Temperature in 0.5°C Increments♦Accuracy ±1°C from -30°C to +70°C (See the Electrical Characteristics for Accuracy Specification)♦Built-In Real-Time Clock (RTC) and Timer HasAccuracy of ±2 Minutes per Month from 0°C to +45°C ♦Water Resistant or Waterproof if Placed Inside DS9107 iButton Capsule (Exceeds Water Resistant 3 ATM Requirements)♦Automatically Wakes Up and Measures Temperature at User-Programmable Intervals from 1Minute to 255 Minutes♦Logs Up to 2048 Consecutive Temperature Measurements in Protected NV RAM♦Records a Long-Term Temperature Histogram with 2.0°C Resolution♦Programmable Temperature High and Temperature Low Alarm Trip Points♦Records Up to 24 Timestamps and Durations When Temperature Leaves the Range Specified by the Trip Points♦512 Bytes of General-Purpose Read/Write NV RAM ♦Communicates to Host with a Single Digital Signal at 15.4kbps or 125kbps Using 1-Wire ProtocolCommon iButton Features♦Digital Identification and Information by Momentary Contact♦Unique, Factory-Lasered, and Tested 64-BitRegistration Number (8-Bit Family Code + 48-BitSerial Number + 8-Bit CRC Tester) AssuresAbsolute Traceability Because No Two Parts areAlike ♦Multidrop Controller for 1-Wire Net ♦Chip-Based Data Carrier Compactly Stores Information♦Data Can Be Accessed While Affixed to Object♦Button Shape is Self-Aligning with Cup-ShapedProbes♦Durable Stainless-Steel Case Engraved withRegistration Number Withstands HarshEnvironments ♦Easily Affixed with Self-Stick Adhesive Backing,Latched by Its Flange, or Locked with a Ring Pressed Onto Its Rim♦Presence Detector Acknowledges When Reader First Applies Voltage ♦Meets UL 913 (4th Edit.); Intrinsically SafeApparatus: Approved Under Entity Concept for Usein Class I, Division 1, Group A, B, C and D LocationsDS1921GThermochron iButton________________________________________________________________Maxim Integrated Products1Ordering Information 19-5101; Rev 3; 4/10For pricing, delivery, and ordering information,please contact Maxim Direct at 1-888-629-4642,or visit Maxim’s website at .PART TEMP RANGE PIN-PACKAGEDS1921G-F5# -40°C to +85°C F5 iButton Examples of Accessories PART ACCESS ORY DS9096P Self-Stick AdhesivePadDS9101 Multipurpose Clip DS9093RA Mounting Lock RingDS9093A Snap-In FobDS9092 iButton ProbePin Configuration appears at end of data sheet.Thermochron, iButton, and 1-Wire are registered trademarks of Maxim Integrated Products, Inc.#Denotes a RoHS-compliant device that may include lead(Pb)that is exempt under the RoHS requirements.Temperature Logging in Cold Chain, Food Safety,Pharmaceutical, and Medical ProductsD S 1921GThermochron iButton 2_______________________________________________________________________________________ABSOLUTE MAXIMUM RATINGSELECTRICAL CHARACTERISTICSStresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.IO Voltage Range Relative to GND..........................-0.5V to +6V IO Sink Current....................................................................20mA Operating Temperature Range..........................-40°C to +85°C*Storage Temperature Range..............................-40°C to +50°C**Storage or operation above +50°C significantly reduces battery life.DS1921GThermochron iButton_______________________________________________________________________________________3times. The specified value here applies to systems with only one device and with the minimum 1-Wire recovery times. For more heavily loaded systems, an active pullup such as that found in the DS2480B may be required.Note 3:Capacitance on IO could be 800pF when power is first applied. If a 2.2k Ωresistor is used to pull up the data line, 2.5µs after V PUP has been applied, the parasite capacitor does not affect normal communication.Note 4:These values are derived from simulation across process, voltage, and temperature and are not production tested.Note 5:Input load is to ground.Note 6:All voltages are referenced to ground.Note 7:V TL , V TH are a function of the internal supply voltage.Note 8:Voltage below which, during a falling edge of IO, a logic 0 is detected.Note 9:The voltage on IO must be less than or equal to V ILMAX whenever the master drives the line low.Note 10:Voltage above which, during a rising edge on IO, a logic 1 is detected.Note 11:The I-V characteristic is linear for voltages less than 1V.Note 12:Numbers in bold are not in compliance with the published iButton standards. See the Comparison Table .Note 13:εin Figure 15 represents the time required for the pullup circuitry to pull the voltage on the IO pin up from V IL to V TH .Note 14:δin Figure 15 represents the time required for the pullup circuitry to pull the voltage on the IO pin up from V IL to the input high threshold of the bus master.Note 15:This number was derived from a test conducted by Cemagref in Antony, France, in July 2000.http://www.cemagref.fr/English/index.htm Test Report No. E42Note 16:Total accuracy is Δϑplus 0.25°C quantization due to the 0.5°C digital resolution of the device.ELECTRICAL CHARACTERISTICS (continued)D S 1921GNote 17:WARNING:Not for use as the sole method of measuring or tracking temperature in products and articles that could affectthe health or safety of persons, plants, animals, or other living organisms, including but not limited to foods, beverages,pharmaceuticals, medications, blood and blood products, organs, flammable, and combustible products. User shallassure that redundant (or other primary) methods of testing and determining the handling methods, quality, and fitness of the articles and products should be implemented. Temperature tracking with this product, where the health or safety of the aforementioned persons or things could be adversely affected, is only recommended when supplemental or redundant information sources are used. Data-logger products are 100% tested and calibrated at time of manufacture by Maxim to ensure that they meet all data sheet parameters, including temperature accuracy. User shall be responsible for proper use and storage of this product. As with any sensor-based product, user shall also be responsible for occasionally rechecking the temperature accuracy of the product to ensure it is still operating properly.Note 18:The number of temperature conversions (= samples) possible with the built-in energy source depends on the operating andstorage temperature of the device. When not in use for a mission, the RTC oscillator should be turned off and the device should be stored at a temperature not exceeding +25°C. Under this condition the shelf life time is 10 years minimum.Thermochron iButton 4_______________________________________________________________________________________Note:Numbers in bold are not in compliance with the published iButton standards.ELECTRICAL CHARACTERISTICS (continued)(V PUP = +2.8V to +5.25V, T A = -40°C to +85°C.)DS1921GThermochron iButton_______________________________________________________________________________________5RTC Deviation vs. TemperatureMinimum Product Lifetime vs. Temperature at Different Sample RatesD S 1921GThermochron iButtonMinimum Product Lifetime vs. Sample Rate at Different TemperaturesAccuracy LimitsDetailed DescriptionThe DS1921G Thermochron iButton is an ideal device to monitor the temperature of any object it is attached to or shipped with, such as perishable goods or con-tainers of temperature-sensitive chemicals. The read/write NV memory can store an electronic copy of shipping information, date of manufacture and other important data written as clear as well as encrypted files. Note that the initial sealing level of the DS1921G achieves IP56. Aging and use conditions can degrade the integrity of the seal over time, therefore, for applica-tions with significant exposure to liquids, sprays, or other similar environments, it is recommended to placethe Thermochron in the DS9107 iButton capsule. The DS9107 provides a watertight enclosure that has been rated to IP68 (refer to Application Note 4126:Understanding the IP (Ingress Protection) Ratings of iButton Data Loggers and Capsule ).OverviewFigure 1 shows the relationships between the major control and memory sections of the DS1921G. The device has seven main data components: 64-bit lasered ROM; 256-bit scratchpad; 4096-bit general-purpose SRAM; 256-bit register page of timekeeping,control, and counter registers; 96 bytes of alarm time-stamp and duration logging memory; 126bytes ofDS1921GThermochron iButton_______________________________________________________________________________________7Figure 1. Block DiagramD S 1921GThermochron iButton8_______________________________________________________________________________________Figure 2. Hierarchical Structure for 1-Wire Protocolhistogram memory; and 2048 bytes of data-logging memory. Except for the ROM and the scratchpad, all other memory is arranged in a single linear address space. All memory reserved for logging purposes,including counter registers and several other regis-ters, is read-only for the user. The timekeeping and control registers are write protected while the device is programmed for a mission.The hierarchical structure of the 1-Wire protocol is shown in Figure 2. The bus master must first provide one of the seven ROM function commands: Read ROM,Match ROM, Search ROM, Conditional Search ROM,Skip ROM, Overdrive-Skip ROM, or Overdrive-Match ROM. Upon completion of an Overdrive ROM com-mand byte executed at standard speed, the device enters overdrive mode, where all subsequent communi-cation occurs at a higher speed. The protocol required for these ROM function commands is described in Figure 13. After a ROM function command is success-fully executed, the memory functions become accessi-ble and the master can provide any one of the sevenavailable commands. The protocol for these memory function commands is described in Figure 10. All data is read and written least significant bit first.Parasite PowerFigure 1 shows the parasite-powered circuitry. This cir-cuitry “steals” power whenever the IO input is high. IO provides sufficient power as long as the specified tim-ing and voltage requirements are met. The advantages of parasite power are two-fold: 1) By parasiting off this input, battery power is not consumed for 1-Wire ROM function commands, and 2) if the battery is exhausted for any reason, the ROM may still be read normally. The remaining circuitry of the DS1921G is solely operated by battery energy.64-Bit Lasered ROMEach DS1921G contains a unique ROM code that is 64bits long. The first 8 bits are a 1-Wire family code. The next 48 bits are a unique serial number. The last 8 bits are a cyclic redundancy check (CRC) of the first 56 bits (see Figure 3 for details). The 1-Wire CRC is generatedDS1921GThermochron iButton_______________________________________________________________________________________9MSB8-BIT CRC CODE48-BIT SERIAL NUMBERMSBMSBLSB LSBLSB 8-BIT FAMILY CODE(21h)MSBLSB Figure 3. 64-Bit Lasered ROMFigure 4. 1-Wire CRC Generatorusing a polynomial generator consisting of a shift regis-ter and XOR gates as shown in Figure 4. The polynomi-al is X 8+ X 5 + X 4+ 1. Additional information about the 1-Wire CRC is available in Application Note 27:Understanding and Using Cyclic Redundancy Checks with Maxim iButton Products .The Shift register bits are initialized to 0. Then, starting with the least significant bit of the family code, one bit at a time is shifted in. After the 8th bit of the family code has been entered, the serial number is then entered.After the 48th bit of the serial number has been entered, the Shift register contains the CRC value.Shifting in the 8 bits of CRC returns the Shift register to all zeros.MemoryFigure 5 shows the DS1921G memory map. The 4096-bit general-purpose SRAM makes up pages 0 to 15.The timekeeping, control, and counter registers fill page 16, called register page (see Figure 6). Pages 17,18, and 19 are assigned to storing the alarm time-stamps and durations. The temperature histogram bins begin at page 64 and use up to four pages. The tem-perature-logging memory covers pages 128 to 191.Memory pages 20 to 63, 68 to 127, and 192 to 255 are reserved for future extensions. The scratchpad is an additional page that acts as a buffer when writing to the SRAM memory or the register page. The memory pages 17 and higher are read only for the user. They are written to or erased solely under the supervision of the on-chip control logic.D S 1921GThermochron iButton 10______________________________________________________________________________________32-BYTE INTERMEDIATE STORAGE SCRATCHPADADDRESS0000h to 01FFh GENERAL-PURPOSE SRAM (16 PAGES)PAGES 0 to 15 0200h to 021Fh 32-BYTE REGISTER PAGEPAGE 16 0220h to 027Fh ALARM TIMESTAMPS AND DURATIONS PAGES 17 to 19 0280h to 07FFh (RESERVED FOR FUTURE EXTENSIONS) PAGES 20 to 63 0800h to 087Fh TEMPERATURE HISTOGRAM MEMORY PAGES 64 to 67 0880h to 0FFFh (RESERVED FOR FUTURE EXTENSIONS) PAGES 68 to 127 1000h to 17FFh DATA-LOG MEMORY (64 PAGES) PAGES128 to 191 1800h to 1FFFh(RESERVED FOR FUTURE EXTENSIONS)PAGES 192 to 255Figure 5. Memory MapADDRESS BIT 7BIT 6BIT 5BIT 4BIT 3BIT 2BIT 1BIT 0FUNCTION ACCESS*0200h 0 10 Seconds Single Seconds 0201h10 MinutesSingle Minutes 0202h 0 12/2420 HourAM/PM 10 Hour Single Hours0203h 0 0 0 0 0Day of Week0204h10 Date Single Date 0205h CENT 0 010 MonthsSingle Months 0206h 10 YearsSingle Years RTCRegistersR/W R/W**0207h MS 10 Seconds Alarm Single Seconds Alarm 0208hMM10 Minutes AlarmSingle Minutes Alarm 0209h MH 12/24 20 HourAM/PMAlarm 10 HourAlarmSingle Hours Alarm020Ah MD 0 0 0 0 Day of Week AlarmRTC Alarm RegistersR/W R/W**020Bh Temperature Low Alarm Threshold 020Ch Temperature High Alarm ThresholdTemperatureAlarms R/W R/W** 020Dh Number of Minutes Between Temperature ConversionsSample RateR/W R** 020Eh EOSC EMCLREM RO TLS THS TAS Control R/W R/W**020Fh(No function, reads 00h)—RR**Figure 6. Register Pages Map *The left entry in the ACCESS column is valid between missions. The right entry shows the applicable access mode while amission is in progress.**While a mission is in progress, these addresses can be read. The first attempt to write to these registers (even read-only ones), however, ends the mission and overwrites selected writable registers.DS1921GThermochron iButtonADDRESS BIT 7BIT 6BIT 5BIT 4BIT 3BIT 2BIT 1BIT 0FUNCTIONACCESS*0210h(No function, reads 00h)—RR**0211h Temperature Read-Out (Forced Conversion) Temperature RR** 0212h Low Byte 0213h High Byte Mission Start Delay R/W R/W** 0214hTCB MEMCLR MIPSIPTLFTHFTAFStatusR/W R/W0215h Minutes 0216h Hours0217h Date0218h Month 0219h YearMission TimestampR R 021Ah Low Byte 021Bh Center Byte 021Ch High Byte Mission Samples Counter R R 021Dh Low Byte 021Eh Center Byte 021Fh High Byte Device Samples CounterR RFigure 6. Register Pages Map (continued)*The left entry in the ACCESS column is valid between missions. The right entry shows the applicable access mode while a mission is in progress.**While a mission is in progress, these addresses can be read. The first attempt to write to these registers (even read-only ones), however, ends the mission and overwrites selected writable registers.Detailed Register DescriptionsTimekeepingThe RTC/alarm and calendar information is accessed by reading/writing the appropriate bytes in the register page, address 0200h to 0206h. Note that some bits are set to 0. These bits always read 0 regardless of how they are written. The contents of the time, calendar, and alarm registers are in the binary-coded decimal (BCD)format.RTC/CalendarThe RTC of the DS1921G can run in either 12hr or 24hr mode. Bit 6 of the Hours register (address 0202h) is defined as the 12hr or 24hr mode select bit. When high,the 12hr mode is selected. In the 12hr mode, bit 5 is the AM/PM bit with logic 1 being PM. In the 24hr mode, bit 5 is the 20hr bit (20hr to 23hr).To distinguish between the days of the week, the DS1921G includes a counter with a range from 1 to 7.The assignment of a counter value to the day of week is arbitrary. Typically, the number 1 is assigned to a Sunday (U.S. standard) or to a Monday (European stan-dard).The calendar logic is designed to automatically com-pensate for leap years. For every year value that is either 00 or a multiple of four, the device adds a 29th of February. This works correctly up to (but not including)the year 2100.The DS1921G is Y2K compliant. Bit 7 (CE NT) of the Months register at address 0205h serves as a century flag. When the Year register rolls over from 99 to 00, the century flag toggles. It is recommended to write the century bit to a 1 when setting the RTC to a time/date between the years 2000 and 2099.D S 1921GRTC AlarmsThe DS1921G also contains an RTC alarm function. The RTC Alarm registers are located in registers 0207h to 020Ah. The most significant bit of each of the alarm registers is a mask bit. When all the mask bits are logic 0, an alarm occurs once per week when the values stored in timekeeping registers 0200h to 0203h match the values stored in the RTC Alarm registers. Any alarm sets the timer alarm flag (TAF) in the device’s Status register (address 214h). The bus master can set the search conditions in the Control register (address 20Eh) to identify devices with timer alarms by means of the conditional search function (see the ROM Function Commands section).Thermochron iButtonTemperature Conversion The DS1921G measures temperatures with a resolution of 0.5°C. Temperature values are represented in a sin-gle byte as an unsigned binary number, which trans-lates into a theoretical range of 128°C. The range, however, has been limited to values from 0000 0000 (00h) through 1111 1010 (FAh). The codes 01h to F9h are considered valid temperature readings.If a temperature conversion yields a temperature that is out of range, it is recorded as 00h (if too low) or FAh (if too high). Since out-of-range results are accumulated in histogram bins 0 and 62 (see the Temperature Logging and Histogram section), the data in these bins is of lim-ited value. For this reason the specified temperature range of the DS1921G is considered to begin at code 04h and end at code F7h, which corresponds to his-togram bins 1 to 61.With T[7…0] representing the decimal equivalent of a tem-perature reading, the temperature value is calculated asϑ(°C) = T[7…0]/2 - 40.0This equation is valid for converting temperature read-ings stored in the data-log memory as well as for data read from the Forced Temperature Conversion Readout register (address 0211h).To specify the temperature alarm thresholds, this equa-tion needs to be resolved toT[7…0] = 2 x ϑ(°C) + 80.0A value of 23°C, for example, thus translates into 126 decimal or 7Eh. This corresponds to the binary patterns0111 1110, which could be written to a TemperatureAlarm register (address 020Bh and 020Ch, respectively).Sample RateThe content of the Sample Rate register (address020Dh) determines how many minutes the temperature conversions are apart from each other during a mission.The sample rate can be any value from 1 to 255, codedas an unsigned 8-bit binary number. If the memory hasbeen cleared (Status register bit ME MCLR = 1) and a mission is enabled (Control register bit EM= 0), writinga nonzero value to the Sample Rate register starts a mis-sion. For a full description of the correct sequence ofsteps to start a temperature-logging mission, see the Missioning or Mission E xample: Prepare and Start aNew Mission sections.DS1921G Thermochron iButtonD S 1921GControl RegisterThe DS1921G is set up for its operation by writing appropriate data to its special function registers that are located in the register page. Several functions that are controlled by a single bit only are combined into a single byte called the Control register (address 020Eh).This register can be read and written. If the device is programmed for a mission, writing to the Control regis-ter ends the mission and changes the register contents.The functional assignments of the individual bits are explained below. Bit 5 has no function. It always reads 0 and cannot be written to 1.Bit 7: Enable Oscillator (EOSC ). This bit controls the crystal oscillator of the RTC. When set to logic 0, the oscillator starts operation. When written to logic 1, the oscillator stops and the device is in a low-power data-retention mode. This bit must be 0 for normal opera-tion.The RTC must have advanced at least 1 second before a Mission Start is accepted.Bit 6: Memory Clear Enable (EMCLR). This bit needs to be set to logic 1 to enable the Clear Memory func-tion, which is invoked as a memory function command.The timestamp, histogram memory as well as the Mission Timestamp, Mission Samples Counter, Mission Start Delay, and Sample Rate are cleared only if the Clear Memory command is issued with the next access to the device . The E MCLR bit returns to 0 as the next memory function command is executed.Bit 4: Enable Mission (EM ). This bit controls whether the DS1921G begins a mission as soon as the sample rate is written. To enable the device for a mission, this bit must be 0.Bit 3: Rollover Enable/Disable (RO). This bit controls whether the temperature logging memory is overwritten with new data or whether data logging is stopped once the memory is filled with data during a mission. Setting this bit to a 1 enables the rollover and data logging continues at the beginning, overwriting previously col-lected data. Clearing this bit to 0 disables the rolloverand no further temperature values are stored in the temperature logging memory once it is filled with data.This does not stop the mission. The device continues measuring temperatures and updating the histogram and alarm timestamps and durations.Bit 2: Temperature L ow Alarm Search (TL S). If this bit is 1, the device responds to a Conditional Search ROM command if, during a mission, the temperature has reached or is lower than the Low Temperature Threshold stored at address 020Bh.Bit 1: Temperature High Alarm Search (THS). If this bit is 1, the device responds to a Conditional Search ROM command if, during a mission, the temperature has reached or is higher than the High Temperature Threshold stored at address 020Ch.Bit 0: Timer Alarm Search (TAS). If this bit is 1, the device responds to a Conditional Search ROM com-mand if, during a mission, a timer alarm has occurred.Since a timer alarm cannot be disabled, the TAF flag usually reads 1 during a mission. Therefore, it is advis-able to set the TAS bit to a 0, in most cases.Mission Start Delay CounterThe content of the Mission Start Delay Counter register determines how many minutes the device waits before starting the logging process. The Mission Start Delay value is stored as an unsigned 16-bit integer number at addresses 0212h (low byte) and 0213h (high byte). The maximum delay is 65,535 minutes, equivalent to 45days, 12 hours, and 15 minutes.For a typical mission, the Mission Start Delay is 0. If a mission is too long for a single DS1921G to store all temperature readings at the selected sample rate, one can use several devices, staggering the Mission Start Delay to record the full period. In this case, the rollover enable (RO) bit in the Control register (address 020Eh)must be set to 0 to prevent overwriting of the recorded temperature log after the data-log memory is full. See the Mission Start and Logging Process section and Figure 11 for details.Thermochron iButtonStatus Register The Status register holds device status information and alarm flags. The register is located at address 0214h. Writing to this register does not necessarily end a mission.The functional assignments of the individual bits are explained below. The bits MIP, TLF, THF, and TAF can only be written to 0. All other bits are read-only. Bit 3 has no function.Bit 7: Temperature Core Busy (TCB). If this bit reads 0, the DS1921G is currently performing a temperature conversion. This temperature conversion is either self-initiated because of a mission being in progress or initi-ated by a command when a mission is not in progress. The TCB bit goes low just before a conversion starts and returns to high just after the result is latched into the Read-Out register at address 0211h.Bit 6: Memory Cleared (MEMCLR). If this bit reads 1, the memory pages 17 and higher (alarm timestamps/ durations, temperature histogram, excluding data-log memory), as well as the Mission Timestamp, Mission Samples Counter, Mission Start Delay, and Sample Rate have been cleared to 0 from executing a Clear Memory function command. The MEMCLR bit returns to 0 as soon as writing a nonzero value to the Sample Rate register starts a new mission, provided that the EM bit is also 0. The memory has to be cleared in order for a mission to start.Bit 5: Mission in Progress (MIP). If this bit reads 1, the DS1921G has been set up for a mission and this mis-sion is still in progress. A mission is started if the EM bit of the Control register (address 20Eh) is 0 and a nonze-ro value is written to the Sample Rate register, address 20Dh. The MIP bit returns from logic 1 to logic 0 when a mission is ended. A mission ends with the first write attempt (Copy Scratchpad command) to any register in the address range of 200h to 213h. Alternatively, a mis-sion can be ended by directly writing to the Status reg-ister and setting the MIP bit to 0. The MIP bit cannot beset to 1 by writing to the Status register.BIT 4: Sample in Progress (SIP). If this bit reads 1, theDS1921G is currently performing a temperature conver-sion as part of a mission in progress. The mission sam-ples occur on the seconds rollover from 59 to 00. TheSIP bit changes from 0 to 1 approximately 250ms before the actual temperature conversion begins allow-ing the circuitry of the chip to wake up. A temperature conversion including a wake-up phase takes maximum875ms. During this time, read accesses to the memorypages 17 and higher are permissible but can reveal invalid data.Bit 2: Temperature L ow Flag (TL F). Logic 1 in the temperature low flag bit indicates that a temperature measurement during a mission revealed a temperatureequal to or lower than the value in the Temperature Low Threshold register. The temperature low flag can be cleared at any time by writing this bit to 0. This flagmust be cleared before starting a new mission.Bit 1: Temperature High Flag (THF). Logic 1 in the temperature high flag bit indicates that a temperature measurement during a mission revealed a temperatureequal to or higher than the value in the TemperatureHigh Threshold register. The temperature high flag canbe cleared at any time by writing this bit to 0. This flagmust be cleared before starting a new mission.Bit 0: Timer Alarm Flag (TAF). If this bit reads 1, aRTC alarm has occurred (see the Timekeeping sectionfor details). The timer alarm flag can be cleared at anytime by writing this bit to logic 0. Since the timer alarm cannot be disabled, the TAF flag usually reads 1 duringa mission. This flag should be cleared before starting anew mission.DS1921G Thermochron iButton。
74HC1G14和74HCT1G14高速Si-gate CMOS非门IC数据手册说明书
1. General description74HC1G14 and 74HCT1G14 are high-speed Si-gate CMOS devices. They provide aninverting buffer function with Schmitt trigger action. These devices are capable oftransforming slowly changing input signals into sharply defined, jitter-free output signals.The HC device has CMOS input switching levels and supply voltage range 2 V to 6 V.The HCT device has TTL input switching levels and supply voltage range 4.5 V to 5.5 V.The standard output currents are half of those of the 74HC14 and 74HCT14.2. Features and benefits⏹Symmetrical output impedance ⏹High noise immunity ⏹Low power dissipation⏹Balanced propagation delays⏹SOT353-1 and SOT753 package options ⏹Specified from -40 ︒C to +125 ︒C3. Applications⏹Wave and pulse shapers ⏹Astable multivibrators ⏹Monostable multivibrators4. Ordering information74HC1G14; 74HCT1G14Inverting Schmitt triggerRev. 6 — 27 December 2012Product data sheetTable 1.Ordering informationType numberPackageTemperature rangeName DescriptionVersion 74HC1G14GW -40 ︒C to +125 ︒CTSSOP5plastic thin shrink small outline package;5leads; body width 1.25mmSOT353-174HCT1G14GW 74HC1G14GV -40 ︒C to +125 ︒CSC-74Aplastic surface-mounted package; 5 leadsSOT75374HCT1G14GV5. MarkingTable 2.Marking codesType number Marking code[1]74HC1G14GW HF74HCT1G14GW TF74HC1G14GV H1474HCT1G14GV T14[1]The pin 1 indicator is located on the lower left corner of the device, below the marking code.6. Functional diagram7. Pinning information7.1Pinning7.2Pin descriptionTable 3.Pin descriptionSymbol Pin Descriptionn.c.1not connectedA2data inputGND3ground (0 V)Y4data outputV CC5supply voltage8. Functional descriptionTable 4.Function tableH = HIGH voltage level; L = LOW voltage levelInput OutputA YL HH L9. Limiting valuesTable 5.Limiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). [1] Symbol Parameter Conditions Min Max UnitV CC supply voltage-0.5+7.0VI IK input clamping current V I <-0.5V or V I>V CC+ 0.5V-±20mAI OK output clamping current V O<-0.5V or V O>V CC+ 0.5V-±20mAI O output current-0.5 V < V O<V CC+0.5V-±12.5mAI CC supply current-25mAI GND ground current-25-mAT stg storage temperature-65+150︒CP tot total power dissipation T amb = -40︒C to+125 ︒C[2]-200mW[1]The input and output voltage ratings may be exceeded if the input and output current ratings are observed.[2]Above 55︒C, the value of P tot derates linearly with 2.5mW/K.10. Recommended operating conditionsTable 6.Recommended operating conditionsVoltages are referenced to GND (ground = 0 V).Symbol Parameter Conditions74HC1G1474HCT1G14UnitMin Typ Max Min Typ MaxV CC supply voltage 2.0 5.0 6.0 4.5 5.0 5.5VV I input voltage0-V CC0-V CC VV O output voltage0-V CC0-V CC VT amb ambient temperature-40+25+125-40+25+125︒C11. Static characteristicsTable 7.Static characteristicsVoltages are referenced to GND (ground = 0 V). All typical values are measured at T amb=25︒C.Symbol Parameter Conditions-40︒C to+85 ︒C-40︒C to+125 ︒C UnitMin Typ Max Min MaxFor type 74HC1G14V OH HIGH-level outputvoltage V I= V T+ or V T-I O= -20μA; V CC=2.0V 1.9 2.0- 1.9-V I O= -20μA; V CC=4.5V 4.4 4.5- 4.4-V I O= -20μA; V CC=6.0V 5.9 6.0- 5.9-V I O= -2.0mA; V CC=4.5V 4.13 4.32- 3.7-V I O= -2.6mA; V CC=6.0V 5.63 5.81- 5.2-VV OL LOW-level outputvoltage V I= V T+ or V T-I O= 20μA; V CC=2.0V-00.1-0.1V I O= 20μA; V CC=4.5V-00.1-0.1V I O= 20μA; V CC=6.0V-00.1-0.1V I O= 2.0mA; V CC=4.5V-0.150.33-0.4V I O= 2.6mA; V CC=6.0V-0.160.33-0.4VI I input leakage current V I=V CC or GND; V CC=6.0V-- 1.0- 1.0μA I CC supply current V I=V CC or GND; I O=0A;V CC=6.0V--10-20μA C I input capacitance- 1.5---pFV T+positive-goingthreshold voltage see Figure7 and Figure8V CC=2.0 V0.7 1.09 1.50.7 1.5V V CC=4.5 V 1.7 2.36 3.15 1.7 3.15V V CC=6.0 V 2.1 3.12 4.2 2.1 4.2VV T-negative-goingthreshold voltage see Figure7 and Figure8V CC=2.0 V0.30.600.90.30.9V V CC=4.5 V0.9 1.53 2.00.9 2.0V V CC=6.0 V 1.2 2.08 2.6 1.2 2.6VV H hysteresis voltage see Figure7 and Figure8V CC=2.0 V0.20.48 1.00.2 1.0VV CC=4.5 V0.40.83 1.40.4 1.4VV CC=6.0 V0.6 1.04 1.60.6 1.6V For type 74HCT1G14V OH HIGH-level outputvoltage V I= V T+ or V T-I O= -20μA; V CC=4.5V 4.4 4.5- 4.4-V I O= -2.0mA; V CC=4.5V 4.13 4.32- 3.7-VV OL LOW-level outputvoltage V I= V T+ or V T-I O= 20μA; V CC=4.5V-00.1-0.1V I O= 2.0mA; V CC=4.5V-0.150.33-0.4VI I input leakage current V I=V CC or GND; V CC=5.5V-- 1.0- 1.0μA12. Dynamic characteristics[1]t pd is the same as t PLH and t PHL .[2]C PD is used to determine the dynamic power dissipation P D (μW).P D =C PD ⨯V CC 2⨯f i +∑(C L ⨯V CC 2⨯f o )where:f i =input frequency in MHz; f o =output frequency in MHz C L =output load capacitance in pF; V CC =supply voltage in Volts ∑(C L ⨯V CC 2⨯f o ) = sum of outputsI CC supply current V I =V CC or GND; I O =0A; V CC =5.5V--10-20μA ∆I CC additional supply currentper input; V CC =4.5V to 5.5V; V I = V CC - 2.1 V; I O =0A--500-850μA C I input capacitance - 1.5---pF V T+positive-going threshold voltagesee Figure 7 and Figure 8V CC =4.5 V 1.2 1.55 1.9 1.2 1.9V V CC =5.5 V1.41.802.11.42.1VV T -negative-going threshold voltagesee Figure 7 and Figure 8V CC =4.5 V 0.50.76 1.20.5 1.2V V CC =5.5 V0.60.901.40.61.4VV Hhysteresis voltagesee Figure 7 and Figure 8V CC =4.5 V 0.40.80-0.4-V V CC =5.5 V0.40.90-0.4-VTable 7.Static characteristics …continuedVoltages are referenced to GND (ground = 0 V). All typical values are measured at T amb =25︒C.Symbol Parameter Conditions-40︒C to +85 ︒C -40︒C to +125 ︒C UnitMin Typ Max Min Max Table 8.Dynamic characteristicsGND = 0 V; t r = t f ≤ 6.0 ns; All typical values are measured at T amb =25︒C. For test circuit see Figure 6Symbol Parameter Conditions -40︒C to +85 ︒C -40︒C to +125 ︒C Unit MinTyp MaxMinMaxFor type 74HC1G14t pdpropagation delay A to Y; see Figure 5[1]V CC = 2.0 V; C L =50pF -25155-190ns V CC = 4.5 V; C L =50pF -1231-38ns V CC = 5.0 V; C L =15pF -10---ns V CC = 6.0 V; C L =50pF-1126-32ns C PDpower dissipation capacitanceV I =GND to V CC [2]-20---pFFor type 74HCT1G14t pdpropagation delay A to Y; see Figure 5[1]V CC = 4.5 V; C L =50pF -1743-51ns V CC = 5.0 V; C L =15pF-15---ns C PDpower dissipation capacitanceV I =GND to V CC -1.5V [2]-22---pF13. WaveformsTable 9.Measurement pointsType number Input OutputV I V M V M74HC1G14GND to V CC0.5 ⨯ V CC0.5 ⨯ V CC 74HCT1G14GND to 3.0 V 1.5 V0.5 ⨯ V CC14. Transfer characteristics waveforms15. Application informationThe slow input rise and fall times cause additional power dissipation, this can becalculated using the following formula:P add=f i⨯(t r⨯∆I CC(AV)+t f⨯∆I CC(AV))⨯V CCWhere:P add=additional power dissipation (μW)f i=input frequency (MHz)t r=rise time (ns); 10% to 90%t f=fall time (ns); 90% to 10%∆I CC(AV)=average additional supply current (μA)∆I CC(AV) differs with positive or negative input transitions, as shown in Figure14 and Figure15.74HC1G14 and 74HCT1G14 used in relaxation oscillator circuit, see Figure16. Remark: All values given are typical unless otherwise specified.16. Package outlineTSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm SOT353-1Fig 18.Package outline SOT353-1 (TSSOP5)Plastic surface-mounted package; 5 leads SOT753Fig 19.Package outline SOT753 (SC-74A)17. Abbreviations18. Revision historyTable 10.AbbreviationsAcronym Description DUT Device Under Test TTLTransistor-Transistor LogicTable 11.Revision historyDocument ID Release date Data sheet status Change notice Supersedes 74HC_HCT1G14 v.620121227Product data sheet -74HC_HCT1G14 v.5Modifications:•Table 3: Pin number Y output changed from 5 to 4 (errata).74HC_HCT1G14 v.520120924Product data sheet-74HC_HCT1G14 v.4Modifications:•Figure 17 added (typical K-factor for relaxation oscillator).•Legal page updated.74HC_HCT1G14 v.420070717Product data sheet -74HC_HCT1G14 v.374HC_HCT1G14 v.320020515Product specification -74HC_HCT1G14 v.274HC_HCT1G14 v.220010302Product specification -74HC_HCT1G14 v.174HC_HCT1G14 v.119980805Product specification--19. 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The English version shall prevail in case of any discrepancy between the translated and English versions.19.4 TrademarksNotice: All referenced brands, product names, service names and trademarks are the property of their respective owners.20. Contact informationFor more information, please visit: For sales office addresses, please send an email to: ***************************21. Contents1 General description. . . . . . . . . . . . . . . . . . . . . . 12 Features and benefits . . . . . . . . . . . . . . . . . . . . 13 Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Ordering information. . . . . . . . . . . . . . . . . . . . . 15 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 27 Pinning information. . . . . . . . . . . . . . . . . . . . . . 27.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 28 Functional description . . . . . . . . . . . . . . . . . . . 39 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 310 Recommended operating conditions. . . . . . . . 311 Static characteristics. . . . . . . . . . . . . . . . . . . . . 412 Dynamic characteristics . . . . . . . . . . . . . . . . . . 513 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 614 Transfer characteristics waveforms. . . . . . . . . 715 Application information. . . . . . . . . . . . . . . . . . . 816 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 1117 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 1318 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 1319 Legal information. . . . . . . . . . . . . . . . . . . . . . . 1419.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 1419.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 1419.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 1419.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 1520 Contact information. . . . . . . . . . . . . . . . . . . . . 1521 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16© Nexperia B.V. 2017. All rights reserved For more information, please visit: Forsalesofficeaddresses,pleasesendanemailto:*************************** Date of release:Mouser ElectronicsAuthorized DistributorClick to View Pricing, Inventory, Delivery & Lifecycle Information:N experia:74HC1G14GV,12574HC1G14GW,12574HC1G14GW,16574HCT1G14GV,12574HCT1G14GW,125。
74HC245DTR2G, 规格书,Datasheet 资料
74HC245Octal 3−State Noninverting Bus TransceiverHigh −Performance Silicon −Gate CMOSThe 74HC245 is identical in pinout to the LS245. The device inputs are compatible with standard CMOS outputs; with pull −up resistors,they are compatible with LSTTL outputs.The HC245 is a 3−state noninverting transceiver that is used for 2−way asynchronous communication between data buses. The device has an active −low Output Enable pin, which is used to place the I/O ports into high −impedance states. The Direction control determines whether data flows from A to B or from B to A.Features•Output Drive Capability: 15 LSTTL Loads•Outputs Directly Interface to CMOS, NMOS, and TTL •Operating V oltage Range: 2.0 to 6.0 V •Low Input Current: 1.0 m A•High Noise Immunity Characteristic of CMOS Devices•In Compliance with the Requirements Defined by JEDEC Standard No. 7A•ESD Performance: HBM > 2000 V; Machine Model > 200 V•Chip Complexity: 308 FETs or 77 Equivalent Gates •This is a Pb −Free Device120MARKING DIAGRAMSHC 245ALYW GGTSSOP −20DT SUFFIX CASE 948ESee detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet.ORDERING INFORMATIONHC245= Device CodeA = Assembly Location L = Wafer Lot Y = YearW = Work WeekG = Pb −Free Package(Note: Microdot may be in either location)Figure 1. Pin Assignment A5A3A2A1DIRECTIONGNDA8A7A6A4B3B2B1OUTPUT ENABLE V CCB8B7B6B5B4A DATA PORTA8A7A6A5A3A4A2A1DIRECTION OUTPUT ENABLEPIN 10 = GND PIN 20 = V CCB1B2B3B4B5B6B7B8B DATA PORTFigure 2. Logic DiagramFUNCTION TABLEControl Inputs OperationOutput Enable DirectionL L Data Transmitted from Bus B to Bus A L H Data Transmitted from Bus A to Bus B H XBuses Isolated (High −Impedance State)X = don’t careORDERING INFORMATIONDevicePackage Shipping †74HC245DTR2GTSSOP −20*2500 / Tape & Reel†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.*This package is inherently Pb −Free.MAXIMUM RATINGS (Note 1)Symbol Parameter Value Unit V CC DC Supply Voltage*0.5 to )7.0V V IN DC Input Voltage*0.5 to V CC)0.5V V OUT DC Output Voltage(Note 2)*0.5 to V CC)0.5VI IK DC Input Diode Current$20mAI OK DC Output Diode Current$35mA I OUT DC Output Sink Current$35mAI CC DC Supply Current per Supply Pin$75mA I GND DC Ground Current per Ground Pin$75mA T STG Storage Temperature Range*65 to )150_C T L Lead Temperature, 1 mm from Case for 10 Seconds260_C T J Junction Temperature Under Bias)150_C q JA Thermal Resistance TSSOP128_C/W P D Power Dissipation in Still Air at 85_C TSSOP450mW MSL Moisture Sensitivity Level 1F R Flammability Rating Oxygen Index: 30% to 35%UL 94 V−0 @ 0.125 inV ESD ESD Withstand Voltage Human Body Model (Note 3)Machine Model (Note 4)u2000u200VI LATCHUP Latchup Performance Above V CC and Below GND at 85_C (Note 5)$300mA Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above theRecommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.1.Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 20 ounce copper trace with no air flow.2.I O absolute maximum rating must observed.3.Tested to EIA/JESD22−A114−A.4.Tested to EIA/JESD22−A115−A.5.Tested to EIA/JESD78.RECOMMENDED OPERATING CONDITIONSSymbol Parameter Min Max Unit V CC DC Supply Voltage (Referenced to GND) 2.0 6.0VV in, V out DC Input Voltage, Output Voltage (Referenced to GND)0V CC V T A Operating Temperature, All Package Types–55+125_Ct r, t f Input Rise and Fall Time V CC = 2.0 V (Figure 3)V CC = 4.5 VV CC = 6.0 V 01000500400nsDC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)Guaranteed LimitSymbol Parameter Test Conditions V CCV–55 to25_C v 85_C v 125_C UnitV IH Minimum High−Level Input Voltage V out = V CC – 0.1 V|I out| v 20 m A 2.03.04.56.01.52.13.154.21.52.13.154.21.52.13.154.2VV IL Maximum Low−Level Input Voltage V out = 0.1 V|I out| v 20 m A 2.03.04.56.00.50.91.351.80.50.91.351.80.50.91.351.8VV OH Minimum High−Level Output Voltage V in = V IH|I out| v 20 m A2.04.56.01.94.45.91.94.45.91.94.45.9VV in = V IH|I out| v 2.4 mA|I out| v 6.0 mA|I out| v 7.8 mA3.04.56.02.483.985.482.343.845.342.23.75.2V OL Maximum Low−Level Output Voltage V in = V IL|I out| v 20 m A2.04.56.00.10.10.10.10.10.10.10.10.1VV in = V IL|I out| v 2.4 mA|I out| v 6.0 mA|I out| v 7.8 mA3.04.56.00.260.260.260.330.330.330.40.40.4I in Maximum Input Leakage Current V in = V CC or GND 6.0±0.1±1.0±1.0m AI OZ Maximum Three−State LeakageCurrent Output in High−Impedance StateV in = V IL or V IHV out = V CC or GND6.0±0.5±5.0±10m AI CC Maximum Quiescent SupplyCurrent (per Package)V in = V CC or GNDI out = 0 m A6.0 4.04040m Armation on typical parametric values and high frequency or heavy load considerations can be found in the ON SemiconductorHigh−Speed CMOS Data Book (DL129/D).AC ELECTRICAL CHARACTERISTICS (C L = 50 pF, Input t r = t f = 6 ns)Symbol Parameter V CCVGuaranteed LimitUnit –55 to25_C v85_C v 125_Ct PLH, t PHL Maximum Propagation Delay,A to B,B to A(Figures 1 and 3)2.03.04.56.07555151395701916110802219nst PLZ, t PHZ Maximum Propagation Delay,Direction or Output Enable to A or B(Figures 2 and 4)2.03.04.56.011090221914011028241651303328nst PZL, t PZH Maximum Propagation Delay,Output Enable to A or B(Figures 2 and 4)2.03.04.56.011090221914011028241651303328nst TLH, t THL Maximum Output Transition Time,Any Output(Figures 1 and 3)2.03.04.56.0602312107527151390321815nsC in Maximum Input Capacitance (Pin 1 or Pin 19)−101010pFC out Maximum Three−State I/O Capacitance(I/O in High−Impedance State)−151515pF7.For propagation delays with loads other than 50 pF, and information on typical parametric values, see the ON Semiconductor High−SpeedCMOS Data Book (DL129/D).C PD Power Dissipation Capacitance (Per Transceiver Channel) (Note 8)Typical @ 25°C, V CC = 5.0 VpF40ed to determine the no−load dynamic power consumption: P D = C PD V CC f + I CC V CC. For load considerations, see the ONSemiconductor High−Speed CMOS Data Book (DL129/D).V CCGNDFigure 3. Switching Waveform OUTPUT ENABLE A OR B A OR BV CCGNDHIGHIMPEDANCEV OLV OHHIGHIMPEDANCEV CCGNDFigure 4. Switching WaveformDIRECTION*Includes all probe and jig capacitanceC L*TEST POINTFigure 5. Test Circuit*Includes all probe and jig capacitanceTEST POINTFigure 6. Test CircuitCONNECT TO V CC WHENTESTING t PLZ AND t PZL.CONNECT TO GND WHENTESTING t PHZ AND t PZH.A DATA PORTBDATAPORTB1B2B3B4B5B6B7B8Figure 7. Expanded Logic DiagramPACKAGE DIMENSIONSTSSOP −20CASE 948E −02ISSUE CDIM A MIN MAX MIN MAX INCHES 6.600.260MILLIMETERS B 4.30 4.500.1690.177C 1.200.047D 0.050.150.0020.006F 0.500.750.0200.030G 0.65 BSC 0.026 BSC H 0.270.370.0110.015J 0.090.200.0040.008J10.090.160.0040.006K 0.190.300.0070.012K10.190.250.0070.010L 6.40 BSC 0.252 BSCM0 8 0 8 ____NOTES:1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.2.CONTROLLING DIMENSION:MILLIMETER.3.DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE.4.DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION.INTERLEAD FLASH OR PROTRUSIONSHALL NOT EXCEED 0.25 (0.010) PER SIDE.5.DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08(0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION.6.TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY .7.DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W −.6.400.252−−−−−−16X0.360.65PITCHSOLDERING FOOTPRINT**For additional information on our Pb −Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.PUBLICATION ORDERING INFORMATION。
IC datasheet pdf-OPA743,OPA2743,OPA4743,pdf(CMOS, Rail-to-Rail, I_O Operational Amplifiers)
ELECTROSTATIC DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
OPA2743EA
MSOP-8
337
E43
OPA2743EA/250
Tape and Reel
"
"
"
"
OPA2743EA/2K5
Tape and Reel
OPA2743UA
"
SO-8
"
182
OPA2743UA
OPA2743UA
Rails
"
"
OPA2743UA/2K5
Tape and Reel
OPA2743PA
OPA743
Out 1 V– 2 +In 3
OPA743
5 V+ 4 –In
SOT23-5
Out A 1 –In A 2 +In A 3
V– 4
OPA2743
A B
NC 1 –In 2 +In 3 V– 4
SO-8, DIP-8 8 V+ 7 Out B 6 –In B 5 +In B
8 NC 7 V+ 6 Out 5 NC Out A 1
IC datasheet pdf-TL3695,pdf(Differential Bus Transceiver)
D Designed for Multipoint Transmission on Long Bus Lines in Noisy Environments D Low Supply-Current Requirements ...30 mA MaxD Wide Positive and Negative Input/Output Bus-Voltage RangesD Driver Output Capacity ...±60 mA D Thermal-Shutdown ProtectionD Driver Positive and Negative Current LimitingD Receiver Input Impedances ...12 k Ω Min D Receiver Input Sensitivity ...±200 mV Max D Receiver Input Hysteresis ...120 mV Typ D Fail Safe ...High Receiver Output With Inputs OpenD Operates From a Single 5-V Supply D Glitch-Free Power-Up and Power-Down ProtectionDInterchangeable With National DS3695 and DS3695AdescriptionThe TL3695 differential bus transceiver is designed for bidirectional data communication on multipoint bus-transmission lines. It is designed for balanced transmission lines and meets TIA/EIA-422-B,TIA/EIA-485-A, and ITU Recommendation V.11.The TL3695 combines a 3-state differential line driver and a differential input line receiver, both of which operate from a single 5-V power supply. The driver and receiver have active-high and active-low enables, respectively,which can be externally connected together to function as a directional control. The driver differential outputs and the receiver differential inputs are connected internally to form a differential input/output (I/O) bus port that is designed to offer minimum loading to the bus when the driver is disabled or V CC = 0. This port features wide positive and negative common-mode voltage ranges, making the device suitable for party line applications.The TL3695 is characterized for operation from 0°C to 70°C.Copyright © 1999, Texas Instruments IncorporatedPRODUCTION DATA information is current as of pub ication date.Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.AVAILABLE OPTIONSPACKAGED DEVICEST A SMALL OUTLINE(D)PLASTIC DIP(P)0°C to 70°CTL3695DTL3695PThe D package is available taped and reeled. Add the suffix R to device type (e.g., TL3695DR).Function TablesDRIVERENABLE OUTPUTS INPUT D DEA B H H H L L H L H XLZZH = high level, L = low level, ? = indeterminate, X = irrelevant, Z = high impedance (off)RECEIVERENABLE OUTPUTDIFFERENTIAL INPUTSA − BRERV ID ≥ 0.2 V L H −0.2 V < V ID < 0.2 VL ?V ID ≤ −0.2 VL L X H Z Inputs openLHH = high level, L = low level, ? = indeterminate, X = irrelevant, Z = high impedance (off)logic symbol ††This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.DE A BRDRElogic diagram (positive logic)BARDE DBus REschematic of inputs and outputsabsolute maximum ratings over operating free-air temperature range (unless otherwise noted)†Supply voltage, V CC (see Note 1) 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Voltage range at any bus terminal −10 V to 15 V Enable input voltage, V I 5.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Operating free-air temperature range, T A0°C to 70°C Package thermal impedance, θJA (see Note 2):D package 97°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .PW package 85°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Storage temperature range, T stg −65°C to 150°C †Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.NOTES: 1.All voltage values, except differential I/O bus voltage, are with respect to network ground terminal.2.The package thermal impedance is calculated in accordance with JESD 51.recommended operating conditionsMIN NOM MAX UNIT Supply voltage, V CC 4.755 5.25VVoltage at any bus terminal(separately or common mode)V or V 12Voltage at any bus terminal (separately or common mode), V I or V IC−7V High-level Input voltage, V IH D, DE, and RE2V Low-level Input voltage, V IL D, DE, and RE0.8V Differential input voltage, V ID (see Note 3)±12VHigh level output current I Driver−60mAHigh-level output current, I OHReceiver−400μALow level output current I Driver60Low-level output current, I OLReceiver8mA Operating free-air temperature, T A070°C NOTE 3:Differential input/output bus voltage is measured at the noninverting terminal A with respect to the inverting terminal B.DRIVER SECTIONelectrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)PARAMETERTEST CONDITIONS †MIN TYP ‡MAX UNIT V IK Input clamp voltage I I = −18 mA −1.5V V O Output voltageI O = 006V |V OD1|Differential output voltage I O = 0 1.55V R 100See Figure 11/2V L = 100 Ω,See Figure 1OD1or 2§V|V OD2|Differential output voltage R L = 54 Ω,See Figure 1 1.5 2.55V V OD3Differential output voltageV test = −7 V to 12 V,See Figure 21.55V Δ |V OD |Change in magnitude of differential output voltage ¶±0.2V V OC Common-mode output voltage= 54 Ω,3V Δ |V OC |Change in magnitude of common-mode output voltage ¶R L 54 See Figure 1±0.2V Output current Output disabled,V O = 12 V 1I O Output current See Note 4V O = −7 V−0.8mA I IH High-level input current V I = 2.4 V 20μA I ILLow-level input currentV I = 0.4 V −200μAV O = −6 V−250Short circuit output current V O = 0−150I OSShort-circuit output current #V O = V CC 250mAV O = 8 V250Supply current No load Outputs enabled 2350I CCSupply current No loadOutputs disabled1935mA†The power-off measurement in TIA/EIA-422-B applies to disabled outputs only and is not applied to combined inputs and outputs.‡All typical values are at V CC = 5 V and T A = 25°C.§The minimum VOD2 with a 100-Ω load is either 1/2 V OD1 or 2 V, whichever is greater.¶Δ |V OD | and Δ |V OC | are the changes in magnitude of V OD and V OC , respectively, that occur when the input is changed from a high level to a lowlevel.#Duration of the short circuit should not exceed one second for this test.NOTE 4:This applies for power on and power off. Refer to TIA/EIA-485-A for exact conditions. The TIA/EIA-422-B limit does not apply for acombined driver and receiver terminal.switching characteristics over recommended ranges of supply voltage and operating free-air temperaturePARAMETERTEST CONDITIONSMINTYP ‡MAX UNIT t d(OD)Differential-output delay time 822ns Skew (|t d(ODH) − t d(ODL)|) = C = 100 pF, = 60 Ω,18ns t t(OD)Differential output transition time C L1 C L2 100 pF,R L 60 See Figure 3818ns t PZH Output enable time to high level C L = 100 pF,R L = 500 Ω,See Figure 450ns t PZL Output enable time to low level C L = 100 pF,R L = 500 Ω,See Figure 550ns t PHZ Output disable time from high level C L = 15 pF,R L = 500 Ω,See Figure 4830ns t PLZOutput disable time from low levelC L = 15 pF,R L = 500 Ω,See Figure 5830ns‡All typical values are at V CC = 5 V and T A = 25°C.SYMBOL EQUIVALENTSDATA-SHEET PARAMETER TIA/EIA-422-B TIA/EIA-485-A V O V oa, V ob V oa, V ob|V OD1|V o V o|V OD2|V t (R L = 100 Ω)V t (R L = 54 Ω)|V OD3|V t (test termination measurement 2)V test V tstΔ |V OD|| |V t| − |V t| || |V t| − |V t| |V OC|V os||V os|Δ |V OC|| V os − V os|| V os − V os|I OS| I sa|, | I sb |I O| I xa|, | I xb |I ia, I ibRECEIVER SECTIONelectrical characteristics over recommended ranges of common-mode input voltage, supply voltage, and operating free-air temperature range (unless otherwise noted)PARAMETER TEST CONDITIONS MIN TYP†MAX UNITV IT+Positive-going input threshold voltage V O = 2.7 V,I O = −0.4 mA0.2VV IT−Negative-going input threshold voltage V O = 0.5 V,I O = 8 mA−0.2‡VV hys Hysteresis voltage (V IT+−V IT−)V OC = 070mVV IK Enable-input clamp voltage I I = −18 mA−1.5VHigh level output voltage V24V OH High-level output voltage ID = 200 mV or inputs open,I OH = −400 μA,See Figure 62.4VLow level output voltage V = −200 mV,I OL = 16 mA0.5V OL Low-level output voltage ID = 200 mV,See Figure 6I OL = 8 mA0.45V I OZ High-impedance-state output current V O = 0.4 V to 2.4 V±20μALine input current Other input = 0,V I = 12 V1I I Line input currentSee Note 5V I = −7 V−0.8mA I IH High-level enable-input current V IH= 2.7 V20μA I IL Low-level enable-input current V IL= 0.4 V−100μA r I Input resistance12kΩI OS Short-circuit output current§V O= 0−15−85mASupply current No load Outputs enabled2350I CC Supply current No loadOutputs disabled1935mA†All typical values are at V CC = 5 V and T A = 25°C.‡The algebraic convention, in which the less positive (more negative) limit is designated minimum, is used in this data sheet for common-mode input voltage and threshold voltage levels only.§Duration of the short circuit should not exceed one second for this test.NOTE 5:This applies for power on and power off. Refer to TIA/EIA-485-A for exact conditions.switching characteristics over recommended ranges of supply voltage and operating free-air temperature range, C L = 15 pFPARAMETERTEST CONDITIONS MINTYP †MAX UNIT t PLH Propagation delay time, low- to high-level output V = −1.5 V to 1.5 V,1437ns t PHL Propagation delay time, high- to low-level output ID = 1.5 V to 1.5 V,See Figure 71437ns t PZH Output enable time to high level See Figure 8720ns t PZL Output enable time to low level See Figure 8720ns t PHZ Output disable time from high levelSee Figure 8716ns t PLZOutput disable time from low levelSee Figure 8816ns†All typical values are at V CC = 5 V and T A = 25°C.PARAMETER MEASUREMENT INFORMATIONFigure 1. Driver V OD and VOC375 ΩFigure 2. Driver VOD3OutputInputt t t(OD)−2.5 V TEST CIRCUITVOLTAGE WAVEFORMSNOTES: A.C L includes probe and jig capacitance.B.The input pulse is supplied by a generator having the following characteristics: PRR ≤ 1 MHz, 50% duty cycle, t r ≤ 6 ns, t f ≤ 6 ns,Z O = 50 Ω.Figure 3. Driver Differential-Output Test Circuit and Voltage WaveformsPARAMETER MEASUREMENT INFORMATIONOutput L = 500 ΩInputOutputV OH off ≈0 V TEST CIRCUITVOLTAGE WAVEFORMSNOTES: A.C L includes probe and jig capacitance.B.The input pulse is supplied by a generator having the following characteristics: PRR ≤ 1 MHz, 50% duty cycle, t r ≤ 10 ns,t f ≤ 10 ns, Z O = 50 Ω.Figure 4. Driver Test Circuit and Voltage WaveformsΩOutputOutputInput3 V0 V5 V V OL t NOTES: A.C L includes probe and jig capacitance.B.The input pulse is supplied by a generator having the following characteristics: PRR ≤ 1 MHz, 50% duty cycle, t r ≤ 10 ns,t f ≤ 10 ns, Z O = 50 Ω..Figure 5. Driver Test Circuit and Voltage WaveformsPARAMETER MEASUREMENT INFORMATIONFigure 6. Receiver V OH and VOL5 V Ω1N916orInputOutput2.5 V−2.5 V OHV OLt VOLTAGE WAVEFORMSNOTES: A.C L includes probe and jig capacitance.B.The input pulse is supplied by a generator having the following characteristics: PRR ≤ 1 MHz, 50% duty cycle, t r ≤ 10 ns,t f ≤ 10 ns, Z O = 50 Ω.OutputFigure 7. Receiver Test Circuit and Voltage WaveformsPARAMETER MEASUREMENT INFORMATION1.5 V0 VInputInputOutputOutputV OHS1 to 1.5 VS2 OpenS3 ClosedV OL≈4.5 V ≈1.3 V S1 to −1.5 VS2 ClosedS3 Open S1 to −1.5 V S2 Closed S3 Open3 V0 VS1 to 1.5 VS2 Open S3 ClosedV OH≈1.3 VV OLVOLTAGE WAVEFORMSNOTES: A.C L includes probe and jig capacitance.B.The input pulse is supplied by a generator having the following characteristics: PRR ≤ 1 MHz, 50% duty cycle, t r ≤ 10 ns,t f ≤ 10 ns, Z O = 50 Ω.OutputFigure 8. Receiver Test Circuit and Voltage WaveformsTL3695DIFFERENTIAL BUS TRANSCEIVER SLLS044D − NOVEMBER 1988 − REVISED DECEMBER 1999TYPICAL CHARACTERISTICS †Figure 9−201.510.5022.533.544.55DRIVER HIGH-LEVEL OUTPUT VOLTAGEvsHIGH-LEVEL OUTPUT CURRENTI OH − High-Level Output Current − mA V 0H− H i g h -L e v e l O u t p u t V o l t a g e − V V O H −40−60−80−100−120V O L − L o w -L e v e l O u t p u t V o l t a g e − V V OL 1.510.50020406022.53801001203.544.55DRIVERLOW-LEVEL OUTPUT VOLTAGE vs LOW-LEVEL OUTPUT CURRENT I OL − Low-Level Output Current − mAFigure 1021.50.53413.5 2.5I O − Output Current − mADRIVER DIFFERENTIAL OUTPUT VOLTAGEvsOUTPUT CURRENTV O D − D i f f e r e n t i a l O u t p u t V o l t a g e − VO D Figure 11†Operation of the device at these or any other conditions beyond those indicated under ‘‘recommended operating conditions” is not implied.TL3695DIFFERENTIAL BUS TRANSCEIVER SLLS044D − NOVEMBER 1988 − REVISED DECEMBER 1999TYPICAL CHARACTERISTICS †Figure 12−102100345RECEIVER HIGH-LEVEL OUTPUT VOLTAGEvsHIGH-LEVEL OUTPUT CURRENTI OH − High-Level Output Current − mA V 0H− H i g h -L e v e l O u t p u t V o l t a g e − VV O H −20−30−40−50205431RECEIVERHIGH-LEVEL OUTPUT VOLTAGE vs FREE-AIR TEMPERATURE V 0H− H i g h -L e v e l O u t p u t V o l t a g e − V V O H T A − Free-Air Temperature − °C −40−20Figure 13Figure 140.30.20.1005100.40.50.615202530RECEIVER LOW-LEVEL OUTPUT VOLTAGEvsLOW-LEVEL OUTPUT CURRENTI OL − Low-Level Output Current − mA V O L − L o w -L e v e l O u t p u t V o l t a g e − VV O L Figure 15−400.30.20.1002040600.40.50.680100120RECEIVERLOW-LEVEL OUTPUT VOLTAGE vs FREE-AIR TEMPERATURE V O L − L o w -L e v e l O u t p u t V o l t a g e − V V O L T A − Free-Air Temperature − °C −20†Operation of the device at these or any other conditions beyond those indicated under ‘‘recommended operating conditions” is not implied.TL3695DIFFERENTIAL BUS TRANSCEIVER SLLS044D − NOVEMBER 1988 − REVISED DECEMBER 1999TYPICAL CHARACTERISTICS †Figure 16100.51 1.5232 2.5345RECEIVER OUTPUT VOLTAGEvsENABLE VOLTAGE V ) − O u t p u t V o l t a g e − VV O V I − Enable Voltage − VFigure 17321000.51456 1.52 2.53RECEIVER OUTPUT VOLTAGE vs ENABLE VOLTAGE V ) − O u t p u t V o l t a g e − VV O V I− Enable Voltage − V †Operation of the device at these or any other conditions beyond those indicated under ‘‘recommended operating conditions” is not implied.TL3695TL3695NOTE A:The line should be terminated at both ends in its characteristic impedance (R T = Z O ). Stub lengths off the main line should be keptas short as possible.Figure 18. Typical Application CircuitPACKAGING INFORMATION Orderable DeviceStatus (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)TL3695DACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL3695DE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL3695DG4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL3695DRACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL3695DRE4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL3695DRG4ACTIVE SOIC D 82500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL3695PACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL3695PE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwiseconsidered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.PACKAGE OPTION ADDENDUM 23-Apr-2007TAPE AND REEL INFORMATION*All dimensions are nominal Device Package Type Package DrawingPinsSPQ Reel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant TL3695DR SOIC D 82500330.012.4 6.4 5.2 2.18.012.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) TL3695DR SOIC D8*******.5338.120.6IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right, or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use any non-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDLP®Products Communications and /communicationsTelecomDSP Computers and /computersPeripheralsClocks and Timers /clocks Consumer Electronics /consumer-appsInterface Energy /energyLogic Industrial /industrialPower Mgmt Medical /medicalMicrocontrollers Security /securityRFID Space,Avionics&/space-avionics-defenseDefenseRF/IF and ZigBee®Solutions /lprf Video and Imaging /videoWireless /wireless-appsMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2010,Texas Instruments Incorporated。
74LVC245AD原版数据手册.pdf-EasyDatasheet
NXP Semiconductors
74LVC245A; 74LVCH245A
Octal bus transceiver; 3-state
3. Ordering information
Table 1. Ordering information Package Temperature range Name 74LVC245AD 74LVCH245AD 74LVC245ADB 74LVCH245ADB 74LVC245APW 74LVCH245APW 74LVC245ABQ 74LVCH245ABQ 74LVC245ABX 74LVCH245ABX 40 C to +125 C DHXQFN20 40 C to +125 C DHVQFN20 40 C to +125 C TSSOP20 40 C to +125 C SSOP20 40 C to +125 C SO20 Description plastic small outline package; 20 leads; body width 7.5 mm plastic shrink small outline package; 20 leads; body width 5.3 mm Version SOT163-1 SOT339-1 Type number
74LVC_LVCH245A
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 8 — 28 June 2013
74AHCT245
1999 Sep 28
Philips Semiconductors
Octal bus transceiver; 3-state
Product specification
74AHC245; 74AHCT245
FEATURES
• ESD protection: HBM EIA/JESD22-A114-A exceeds 2000 V MM EIA/JESD22-A115-A exceeds 200 V CDM EIA/JESD22-C101 exceeds 1000 V
INTEGRATED CIRCUITS
DATA SHEET
74AHC245; 74AHCT245 Octal bus transceiver; 3-state
Product specification Supersedes data of 1998 Sep 21 File under Integrated Circuits, IC06
B5 13
B6 12
B7 11
MNA174
Fig.2 Logic symbol.
Product specification
74AHC245; 74AHCT245
handbook, halfpage
19
1
G3 3EN1 3EN2
1
2
18 2
3
17
4
16
5
15
6
14
7
13
8
12
9
11
MNA175
Fig.3 IEEE/IEC logic symbol.
IO
DC output source or sink current −0.5 V < VO < VCC + 0.5 V
IC datasheet pdf-LM158,LM158A,LM258,LM258A,LM358,LM358A,LM2904,LM2904V,pdf(Dual Operational Amplifie
MB_§
7 mV
32 V
SOIC (D) TSSOP (PW)
Reel of 2500 Reel of 2000
LM2904VQDR LM2904VQPWR
L2904V L2904V
2 mV
32 V
SOIC (D) TSSOP (PW)
Reel of 2500 Reel of 2000
LM2904AVQDR LM2904AVQPWR
LM158JG LM158FK LM158AJG LM158AFK
† For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web
− Input Offset Voltage . . . 3 mV Typ A Versions . . . 2 mV Typ
− Input Offset Current . . . 2 nA Typ − Input Bias Current . . . 20 nA Typ
A Versions . . . 15 nA Typ
LM158, LM158A . . . JG PACKAGE LM258, LM258A . . . D, DGK, OR P PACKAGE LM358 . . . D, DGK, P, PS, OR PW PACKAGE
LM358A . . . D, DGK, P, OR PW PACKAGE LM2904 . . . D, DGK, P, PS, OR PW PACKAGE
D Internal Frequency Compensation
IC datasheet pdf-THS12082,PDF(12-Bit, 8 MSPS, Simultaneous Sampling Analog-to-Digital Converter)
12-BIT, 8 MSPS, SIMULTANEOUS SAMPLING ANALOG-TO-DIGITAL CONVERTERS12-BIT, 8 MSPS, SIMULTANEOUS SAMPLING ANALOG-TO-DIGITAL CONVERTERS12-BIT, 8 MSPS, SIMULTANEOUS SAMPLING ANALOG-TO-DIGITAL CONVERTERS12-BIT, 8 MSPS, SIMULTANEOUS SAMPLING ANALOG-TO-DIGITAL CONVERTERSPACKAGING INFORMATIONOrderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)5962-0051901NXD PREVIEW TSSOP DA 32TBD Call TI Call TITHS12082CDA ACTIVE TSSOP DA 3246Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR THS12082CDAG4ACTIVE TSSOP DA 3246Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR THS12082CDAR ACTIVE TSSOP DA 322000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR THS12082CDARG4ACTIVE TSSOP DA 322000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR THS12082IDA ACTIVE TSSOP DA 3246Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR THS12082IDAG4ACTIVE TSSOP DA 3246Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR THS12082IDAR ACTIVE TSSOP DA 322000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR THS12082IDARG4ACTIVE TSSOP DA 322000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR THS12082QDA PREVIEW TSSOP DA 32TBD Call TI Call TI THS12082QDARPREVIEWTSSOPDA32TBDCall TICall TI(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement thatlead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.PACKAGE OPTION ADDENDUM18-Sep-2008TAPE AND REEL INFORMATION*All dimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant THS12082CDAR TSSOP DA 322000330.024.48.611.5 1.612.024.0Q1THS12082IDARTSSOPDA322000330.024.48.611.51.612.024.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) THS12082CDAR TSSOP DA322000346.0346.041.0 THS12082IDAR TSSOP DA322000346.0346.041.0IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right, or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use any non-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers AudioData Converters AutomotiveDLP®Products BroadbandDSP Digital ControlClocks and Timers MedicalInterface MilitaryLogic Optical NetworkingPower Mgmt SecurityMicrocontrollers TelephonyRFID Video&ImagingRF/IF and ZigBee®Solutions WirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2009,Texas Instruments Incorporated。
IC datasheet pdf-TPIC8101,pdf(Knock Sensor Interface)
KNOCKKNOCKKNOCKInput SignalInt/Hold SignalOutput SignalFigure 3. Amplified Input Signal ProcessInput SignalInt/Hold SignalOutput SignalFigure 4. Input Signal ProcessingKNOCKPACKAGE OPTION ADDENDUM 16-Jul-2010Addendum-Page 1PACKAGING INFORMATION Orderable DeviceStatus (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)Samples (Requires Login)TPIC8101DWACTIVE SOIC DW 2025Green (RoHS & no Sb/Br)CU NIPDAU Level-3-260C-168 HR/Level-1-235C-UNLIM Contact TI Distributor or Sales Office TPIC8101DWG4ACTIVE SOIC DW 20TBD Call TI Call TI Purchase Samples TPIC8101DWRACTIVE SOIC DW 202000Green (RoHS & no Sb/Br)CU NIPDAU Level-3-260C-168 HR/Level-1-235C-UNLIM Request Free Samples TPIC8101DWRG4ACTIVE SOIC DW 20TBD Call TI Call TI Purchase Samples (1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check /productcontent for the latest availability information and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right, or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use any non-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDLP®Products Communications and /communicationsTelecomDSP Computers and /computersPeripheralsClocks and Timers /clocks Consumer Electronics /consumer-appsInterface Energy /energyLogic Industrial /industrialPower Mgmt Medical /medicalMicrocontrollers Security /securityRFID Space,Avionics&/space-avionics-defenseDefenseRF/IF and ZigBee®Solutions /lprf Video and Imaging /videoWireless /wireless-appsMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2010,Texas Instruments Incorporated。
IC datasheet pdf-L293,L293D,pdf(Quadruple Half-H Drivers)
D Peak Output Current 2 A Per Channel (1.2 A for L293D)DOutput Clamp Diodes for Inductive Transient Suppression (L293D)description/ordering informationThe L293 and L293D are quadruple high-current half-H drivers. The L293 is designed to provide bidirectional drive currents of up to 1 A at voltages from 4.5 V to 36 V. The L293D is designed to provide bidirectional drive currents of up to 600-mA at voltages from 4.5 V to 36 V. Both devices are designed to drive inductive loads such as relays, solenoids, dc and bipolar stepping motors, as well as other high-current/high-voltage loads in positive-supply applications.All inputs are TTL compatible. Each output is a complete totem-pole drive circuit, with a Darlington transistor sink and a pseudo-Darlington source. Drivers are enabled in pairs, with drivers 1 and 2 enabled by 1,2EN and drivers 3 and 4enabled by 3,4EN. When an enable input is high, the associated drivers are enabled, and their outputs are active and in phase with their inputs. When the enable input is low, those drivers are disabled, and their outputs are off and in the high-impedance state. With the proper data inputs, each pair of drivers forms a full-H (or bridge)reversible drive suitable for solenoid or motor applications.ORDERING INFORMATIONT APACKAGE †ORDERABLEPART NUMBER TOP-SIDE MARKING HSOP (DWP)Tube of 20L293DWP L293DWP C to 70PDIP (N)Tube of 25L293N L293N 0°C to 70°C PDIP (NE)Tube of 25L293NE L293NE PDIP (NE)Tube of 25L293DNEL293DNE†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at /sc/package.PRODUCTION DATA information is current as of publication date.Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.123456789101112131428272625242322212019181716151,2EN1A 1Y NC NC NCNC NC 2Y 2A V CC2V CC14A 4Y NC NC NCNC NC 3Y 3A 3,4ENL293...DWP PACKAGE(TOP VIEW)HEAT SINK AND GROUND HEAT SINK AND GROUNDdescription/ordering information (continued)On the L293, external high-speed output clamp diodes should be used for inductive transient suppression.A V CC1 terminal, separate from V CC2, is provided for the logic inputs to minimize device power dissipation.The L293and L293D are characterized for operation from 0°C to 70°C.block diagramV CC2V CC1NOTE: Output diodes are internal in L293D.FUNCTION TABLE(each driver)INPUTS†A EN OUTPUTYH H HL H LX L ZH = high level, L = low level, X = irrelevant, Z = high impedance (off)†In the thermal shutdown mode, the output is in the high-impedance state, regardless of the input levels.logic diagram1A 1,2EN2A3A 3,4EN4A 1Y 2Y 3Y 4Yschematics of inputs and outputs (L293)InputV CC2OutputGND TYPICAL OF ALL OUTPUTSEQUIVALENT OF EACH INPUT V CC1CurrentSourceGNDschematics of inputs and outputs (L293D)InputV CC2OutputGND TYPICAL OF ALL OUTPUTSEQUIVALENT OF EACH INPUTV CC1CurrentSourceGNDabsolute maximum ratings over operating free-air temperature range (unless otherwise noted)†Supply voltage, V CC1(see Note 1) 36 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Output supply voltage, V CC236 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Input voltage, V I7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Output voltage range, V O −3V toV CC2 + 3 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Peak output current, I O (nonrepetitive, t ≤ 5 ms): L293 ±2 A. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Peak output current, I O (nonrepetitive, t ≤ 100 µs): L293D ±1.2 A. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous output current, I O: L293 ±1 A. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous output current, I O: L293D ±600 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Package thermal impedance, θJA (see Notes 2 and 3):DWP package TBD°C/W. . . . . . . . . . . . . . . . . . . . . . .N package 67°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . .NE package TBD°C/W. . . . . . . . . . . . . . . . . . . . . . . . .Maximum junction temperature, T J 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Storage temperature range, T stg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, andfunctional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is notimplied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.NOTES: 1.All voltage values are with respect to the network ground terminal.2.Maximum power dissipation is a function of T J(max), q JA, and T A. The maximum allowable power dissipation at any allowableambient temperature is P D = (T J(max) − T A)/q JA. Operating at the absolute maximum T J of 150°C can affect reliability.3.The package thermal impedance is calculated in accordance with JESD 51-7.recommended operating conditionsMIN MAX UNITSupply voltage V CC1 4.57Supply voltageV CC2V CC136VHigh level input voltage V CC1≤ 7 V 2.3V CC1VV IH High-level input voltageV CC1≥ 7 V 2.37VV IL Low-level output voltage−0.3† 1.5VT A Operating free-air temperature070°C†The algebraic convention, in which the least positive (most negative) designated minimum, is used in this data sheet for logic voltage levels. electrical characteristics, V CC1 = 5 V, V CC2 = 24 V, T A = 25°CPARAMETER TEST CONDITIONS MIN TYP MAX UNITV OH High-level output voltage L293: I OH = −1 AL293D: I OH = −0.6 AV CC2 − 1.8V CC2 − 1.4VV OL Low-level output voltage L293: I OL= 1 AL293D: I OL = 0.6 A1.2 1.8VV OKH High-level output clamp voltage L293D: I OK = −0.6 A V CC2+1.3V V OKL Low-level output clamp voltage L293D: I OK = 0.6 A 1.3VHigh level input current A7V0.2100I IH High-level input currentEN V I = 7 V0.210µALow level input current A−3−10I IL Low-level input currentEN V I = 0−2−100µA All outputs at high level1322I= 0All outputs at low level3560I CC1Logic supply current O 0All outputs at high impedance824mAAll outputs at high level1424I Output supply current I = 0All outputs at low level26mA CC2p pp y OAll outputs at high impedance24 switching characteristics, V CC1 = 5 V, V CC2 = 24 V, T A = 25°CTEST CONDITIONS L293NE, L293DNEPARAMETER TEST CONDITIONSMIN TYP MAXUNIT t PLH Propagation delay time, low-to-high-level output from A input800nst PHL Propagation delay time, high-to-low-level output from A input=30pF See Figure1400nst TLH Transition time, low-to-high-level output C L = 30 pF, See Figure 1300nst THL Transition time, high-to-low-level output300nsswitching characteristics, V CC1 = 5 V, V CC2 = 24 V, T A = 25°CL293DWP, L293NL293DNPARAMETER TEST CONDITIONSMIN TYP MAXUNIT t PLH Propagation delay time, low-to-high-level output from A input750nst PHL Propagation delay time, high-to-low-level output from A input=30pF See Figure1200nst TLH Transition time, low-to-high-level output C L = 30 pF, See Figure 1100nst THL Transition time, high-to-low-level output350nsPARAMETER MEASUREMENT INFORMATIONTEST CIRCUITOH VOLTAGE WAVEFORMSOLNOTES: A.C L includes probe and jig capacitance.B.The pulse generator has the following characteristics: t r≤ 10 ns, t f≤ 10 ns, t w = 10 µs, PRR = 5 kHz, Z O = 50 Ω.Figure 1. Test Circuit and Voltage WaveformsAPPLICATION INFORMATION24 V5 V10 k ΩV CC1V CC2Control AControl B4, 5, 12, 13GNDThermal ShutdownMotor1683611144Y 3Y 2Y 1Y 1,2EN1A 2A 3,4EN3A 4A 15109721Figure 2. Two-Phase Motor Driver (L293)APPLICATION INFORMATION24 V5 V10 k ΩV CC1V CC21681,2EN11A 22A 73,4EN93A 104A 15Control AControl B4, 5, 12, 13GNDThermal ShutdownMotor1Y 32Y 63Y 114Y 14Figure 3. Two-Phase Motor Driver (L293D)APPLICATION INFORMATIONEN3A M14A M2H H Fast motor stopH RunH L RunL Fast motor stop LXFree-running motorstopXFree-running motor stopL = low, H = high, X = don’t careEN 1A 2A FUNCTIONH L H Turn rightH H L Turn left H L LFast motor stop H H H Fast motor stop LXXFast motor stopL = low, H = high, X = don’t careV CC2Figure 4. DC Motor Controls (connections to ground and tosupply voltage)GNDV CC2V CC1ENFigure 5. Bidirectional DC Motor ControlGNDAPPLICATION INFORMATION0.22V CC2D1−D8 = SES5001Figure 6. Bipolar Stepping-Motor Controlmounting instructionsThe Rthj-amp of the L293 can be reduced by soldering the GND pins to a suitable copper area of the printed circuit board or to an external heat sink.Figure 9 shows the maximum package power P TOT and the θJA as a function of the side of two equal square copper areas having a thickness of 35 µm(see Figure 7). In addition, an external heat sink can be used (see Figure 8).During soldering, the pin temperature must not exceed 260°C, and the soldering time must not exceed 12 seconds.The external heatsink or printed circuit copper area must be connected to electrical ground.L293, L293D QUADRUPLE HALF-H DRIVERS SLRS008C − SEPTEMBER 1986 − REVISED NOVEMBER 200411POST OFFICE BOX 655303 • DALLAS, TEXAS 75265APPLICATION INFORMATIONFigure 7. Example of Printed Circuit Board Copper Area(used as heat sink)Figure 8. External Heat Sink Mounting Example (θJA = 25°C/W)L293, L293D QUADRUPLE HALF-H DRIVERS SLRS008C − SEPTEMBER 1986 − REVISED NOVEMBER 200412POST OFFICE BOX 655303 •DALLAS, TEXAS 75265APPLICATION INFORMATION310201020P 4MAXIMUM POWER AND JUNCTIONvsTHERMAL RESISTANCE 30T O T − P o w e r D i s s i p a t i o n − W 602004080θJ A − T h e r m a l R e s i s t a n c e −°C /W 40Side − mm Figure 95053102−500504MAXIMUM POWER DISSIPATION vs AMBIENT TEMPERATURE100T A − Ambient Temperature −°CFigure 10150P T O T − P o w e r D i s s i p a t i o n − WPACKAGING INFORMATIONOrderable Device Status (1)Package Type PackageDrawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)Samples(Requires Login)L293DDWP OBSOLETE SOIC DW28TBD Call TI Call TI Samples Not Available L293DDWPTR OBSOLETE SOIC DW28TBD Call TI Call TI Samples Not Available L293DN OBSOLETE PDIP N16TBD Call TI Call TI Samples Not Available L293DNE ACTIVE PDIP NE1625Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type Contact TI Distributoror Sales Office L293DNEE4ACTIVE PDIP NE1625Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type Contact TI Distributoror Sales Office L293DSP OBSOLETE16TBD Call TI Call TI Samples Not Available L293DSP883B OBSOLETE16TBD Call TI Call TI Samples Not Available L293DSP883C OBSOLETE UTR TBD Call TI Call TI Samples Not Available L293DWP OBSOLETE SOIC DW28TBD Call TI Call TI Replaced by L293DNE L293DWPG4OBSOLETE SOIC DW28TBD Call TI Call TI Replaced by L293DNE L293DWPTR OBSOLETE SO PowerPAD DWP28TBD Call TI Call TI Samples Not Available L293N OBSOLETE PDIP N16TBD Call TI Call TI Replaced by L293DNE L293NE ACTIVE PDIP NE1625Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type Contact TI Distributoror Sales Office L293NEE4ACTIVE PDIP NE1625Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type Contact TI Distributoror Sales Office L293NG4OBSOLETE PDIP N16TBD Call TI Call TI Replaced by L293DNE(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check /productcontent for the latest availability information and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Addendum-Page 1Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.Addendum-Page 2IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right, or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. 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IC datasheet pdf-CD54AC245,CD74AC245,CD54ACT245,CD74ACT245,pdf(Octal-Bus Transceiver,Three-State, No
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
FAST™ is a Trademark of Fairchild Semiconductor.
For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA DC Output Diode Current, IOK
For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±50mA DC Output Source or Sink Current per Output Pin, IO
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC
Operating Conditions
Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC Supply Voltage Range, VCC (Note 4)
AC Types. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.5V to 5.5V ACT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC Input Rise and Fall Slew Rate, dt/dv AC Types, 1.5V to 3V . . . . . . . . . . . . . . . . . . . . . . . . . 50ns (Max) AC Types, 3.6V to 5.5V . . . . . . . . . . . . . . . . . . . . . . . . 20ns (Max) ACT Types, 4.5V to 5.5V. . . . . . . . . . . . . . . . . . . . . . . 10ns (Max)
IC datasheet pdf-MAXQ2010评估套件
BIT 3 COM3 1A 1H 2A 2H 3A 3H 4A 4H 5A 5H 6A 6H 7A 7H 8A 8H
BIT 2 COM2 1B 1G 2B 2G 3B 3G 4B 4G 5B 5G 6B 6G 7B 7G 8B 8G
BIT 1 COM1 1C 1N 2C 2N 3C 3N 4C 4N 5C 5N 6C 6N 7C 7N 8C 8N
QTY
DESCRIPTION 100nF ±10%, 10V ceramic capacitors (0805) Murata GRM219R71C104KA01D 10nF ±5%, 10V ceramic capacitors (0805) Murata GRM21BR72A103KA01L 22pF ±5%, 10V ceramic capacitors (0805) Murata GRM2195C2A220JZ01D 4.7μF ±10%, 10V ceramic capacitors (0805) Murata GRM219R61A475KE19D 10μF ±10%, 10V capacitors (0805) Murata GRM21BR61A106KE19L Empty capacitor footprint (0805) 1μF ±10%, 10V ceramic capacitors (0805) Murata GRM21BR71C105KA01L Green surface-mount LEDs Lumex SML-LX0805SUGC-TR Red surface-mount LED Lumex SML-LX0805SIC-TR
BIT 6 COM2 1F 1J 2F 2J 3F 3J 4F 4J 5F 5J 6F 6J 7F 7J 8F 8J
IC datasheet pdf-ATA5795 pdf,datasheet
Features Array•AES-128 Immobilizer Transponder for Use in Contactless Mode•CMMI Certified. Configurable, Secure, Open Source Immobilizer Stack•Energy Supply and Bi-directional Communication via LF Link (125 kHz)•32-bit Unique Identification Number•Integrated Codecs for Enhanced LF Communication Range•Fast AES-128 Cryptographic Engine for Both Immobilizer and RKE Functions•Two 128-bit Secret Keys•One 128-bit Transport Key•Embedded Ultra-low-power Atmel® AVR® Microcontroller•Fractional-N RF Transmitter Covering 315 MHz and 433 MHz•8-Kbyte Flash for User Application (6 Kbytes) and Immobilizer (2 Kbytes)•2112-byte EEPROM for User Data Storage (2 Kbytes) and Device Configuration(64Bytes)•Locking Mechanism Protects both Flash and EEPROM Contents•Error Correction Code (ECC) Engine Protects both the Flash and EEPROM Units•1-wire Debug Interface Integrated with AVR Development Tools•Automotive Grade C Compiler• 1.9 to 3.6 V Battery Voltage Range (in Contact Mode)•–40°C to +105°C Operating Temperature•Small QFN 32 - 5x5 Package1.DescriptionATA5795 is a smart Remote Keyless Entry (RKE) device that includes an embedded ultra-low-power AVR 8-bit microcontroller, a fractional-N RF transmitter and an LF immobilizer interface in a single QFN32 package.Furthermore, the device has an integrated AES-128 cryptography hardware engine, which is accessible by both the immobilizer and the RKE unit. The immobilizer inter-face can run in contactless mode, allowing energy supply and data transmission via the LF link.The ATA5795 is designed for automotive applications that necessitate both immobili-zation and Remote Keyless Entry functions in one single key. It conforms to requirements of extremely low power consumption and provides all the necessary cir-cuitry for the entire application.29182AS–RKE–03/10ATA5795[Preliminary]1.1System Block DiagramFigure 1-1.System Block Diagram39182AS–RKE–03/10ATA5795[Preliminary]1.2ATA5795 Block DiagramFigure 1-2.ATA5795 Block Diagram49182AS–RKE–03/10ATA5795[Preliminary]2.Ultra-low-power AVR Microcontroller (ATA5795)2.1Features2.1.1High Performance, Ultra-low-power AVR 8-bit MicrocontrollerAdvanced RISC Architecture •131 Powerful Instruction•32 × 8 General Purpose Working Registers •Fully Static Operation •On-chip 2-cycle MultiplierNon-volatile Program and Data Memories •8Kbytes of In-System Self-Programmable Flash with ECC •2112 Bytes of EEPROM with ECC •512-byte Internal SRAM•Programming Lock for Software SecurityPeripheral Features•Programmable Watchdog/Interval Timer with Separate Internal Calibrated Ultra-Low-Power Oscillator•Two 8-bit Timer/Counters: 1x with Compare Mode, 1x with Compare and Capture Mode •Programmable Automatic Data Codec •Power Management for Power Supply•High Performance AES-128 Hardware Crypto Unit •CRC Module•Programmable Voltage Monitor•Infrared (IR) Driver Stage to Control an External IR Transmitter Stage •System Clock Management and Clock Monitoring •Master/Slave SPI Serial Interface •Integrated DebugWire Interface•Interrupt and Wake-up on Pin Change•32-bit Unique Device Identification NumberAnalog Front End (AFE) and Power Management Features•Integrated Power Management that Automatically Handles the Two Power-supply Sources(Battery or 125 kHz Magnetic Field)•Contactless Interface for Power Supply and Bi-directional Data CommunicationSpecial Microcontroller Features •Power-on Reset and Brown-out Detection •Two Internal Calibrated RC Oscillators•Real Time Clock (RTC) Module with Integrated Ultra-low-power 32 kHz Crystal Oscillator Circuit •External and Internal Interrupt Sources•Several Sleep Modes: Idle, Extended Power-save, Power-save and Power-down59182AS–RKE–03/10ATA5795[Preliminary]I/O and Package•17 Programmable I/O Lines •Small QFN 32 - 5x5 Package RF-Transmitter •Fully Integrated Fractional-N PLL•ASK and Closed Loop FSK Modulation•Output Power up to +12.5 dBm from 300 to 450 MHz•Current Consumption is Scaled by Output Power Programming •Fast Crystal Oscillator Start-up Time of Typically 200 µs •Low Current Consumption of Typically 7.3 mA at 5.5 dBm•Just One 13.0000 MHz Crystal for 314.1 to 329.5 MHz and 424.5 to 439.9 MHz Operation •Single-ended RF Power Amplifier Output •Output Power from –0.5 to +12.5 dBm•RF Frequency from 300 to 450 MHz with Different Crystals •FSK Deviation with 396 Hz Resolution •Data Rate up to 40 kbit/s (Manchester)•Supports Multi-channel Operation2.2Pin ConfigurationsFigure 2-1.Pin Out for QFN 32 Package69182AS–RKE–03/10ATA5795[Preliminary]Table 2-1.Pin DescriptionPin NumberPin Name Alternate Function 1Alternate Function 2Function Comment1TME --Test mode enable 2XTO1--Connection for RF crystal RF - pin 3VSRF --Power supply voltage RF RF - pin 4GNDRF --Power supply ground RF RF - pin 5NRESET dW -Reset input / debugWire interface 6PC0--I/O portPort C07A4N --Input pin for transponder AFE 8A4P --Input pin for transponder AFE 9VBA T --Power supply voltage for battery 10PD0INT0PCINT8I/O port / external interrupt input 0Port D011PD1T3ICP PCINT9I/O port / timer 3 external capture input Port D112PD2TEI PCINT10I/O port / external timer input clockPort D213VCC --Power supply voltage for the microcontroller. A capacitor with capacitance C BUF must be connected at this pin to buffer the voltage during field supply and block the microcontroller VCC.14XT AL1--32 kHz crystal oscillator input pin 15GND --Power supply ground16XT AL2--32 kHz crystal oscillator output pin 17PB5TM5PCINT5I/O port / timer modulator pin 5Port B518PB4TM4PCINT4I/O port / timer modulator pin 4Port B419PD7TM3PCINT15I/O port / timer modulator pin 3Port D720PD6TM2PCINT14I/O port / timer modulator pin 2Port D621PD5TM1PCINT13I/O port / timer modulator pin 1Port D522PD4ECIN0PCINT12I/O port / external clock input 0Port D423PD3-PCINT11I/O port Port D324PB3MISO PCINT3I/O port / SPI Port B325PB2MOSI PCINT2I/O port / SPI Port B226PB1SCK PCINT1I/O port / SPI Port B127ANT2--RF antenna 2RF - pin 28ANT1--RF antenna 1RF - pin 29PB0NSS PCINT0I/O port / SPI Port B030PB7-PCINT7I/O port Port B731PB6-PCINT6I/O portPort B632XTO2--Connection for RF crystalRF - pin79182AS–RKE–03/10ATA5795[Preliminary]4.Package InformationFigure 4-1.QFN 32 - 5x5 Package3.Ordering InformationExtended Type Number Package Remarks A T A5795-PNQWQFN32 - 5x5Pb-free9182AS–RKE–03/10HeadquartersInternationalAtmel Corporation 2325 Orchard Parkway San Jose, CA 95131USATel: 1(408) 441-0311Fax: 1(408) 487-2600Atmel AsiaUnit 1-5 & 16, 19/FBEA Tower, Millennium City 5418 Kwun Tong Road Kwun Tong, Kowloon Hong KongTel: (852) 2245-6100Fax: (852) 2722-1369Atmel Europe Le Krebs8, Rue Jean-Pierre Timbaud BP 30978054Saint-Quentin-en-Yvelines Cedex FranceTel: (33) 1-30-60-70-00 Fax: (33) 1-30-60-71-11Atmel Japan9F, Tonetsu Shinkawa Bldg.1-24-8 ShinkawaChuo-ku, Tokyo 104-0033JapanTel: (81) 3-3523-3551Fax: (81) 3-3523-7581Product ContactWeb SiteTechnical Supportauto_control@Sales Contact/contactsLiterature Requests /literatureDisclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise,to any intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN ATMEL ’S TERMS AND CONDI-TIONS OF SALE LOCATED ON ATMEL ’S WEB SITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDEN-TAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and product descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel’s products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life.© 2010 Atmel Corporation. All rights reserved. Atmel ®, Atmel logo and combinations thereof, AVR ® and others are registered trademarks or trademarks of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others.。
IC datasheet pdf-TPA6011A4,pdf(3-W Stereo Audio Power Amplifier)
FEATURES DESCRIPTIONAPPLICATIONS-90-80-70-60-50-40-30-20-1010203000.51 1.52 2.53 3.54 4.55Volume [Pin 21] - VDC VOLUME CONTROLVolume-dBTPA6011A4SLOS392A–FEBRUARY2002–REVISED JULY20043-W STEREO AUDIO POWER AMPLIFIERWITH ADVANCED DC VOLUME CONTROL•Advanced DC Volume Control With2-dB The TPA6011A4is a stereo audio power amplifier Steps that drives3W/channel of continuous RMS power From-40dB to20dB into a3-Ωload.Advanced dc volume controlminimizes external components and allows BTL –Fade Mode(speaker)volume control and SE(headphone)vol-–Maximum Volume Setting for SE Mode ume control.Notebook and pocket PCs benefit from–Adjustable SE Volume Control the integrated feature set that minimizes external Referenced to BTL Volume Control components without sacrificing functionality.•3W Into3-ΩSpeakers To simplify design,the speaker volume level isadjusted by applying a dc voltage to the VOLUME •Stereo Input MUXterminal.Likewise,the delta between speaker volume •Differential Inputsand headphone volume can be adjusted by applyinga dc voltage to the SEDIFF terminal.To avoid anunexpected high volume level through the •Notebook PC headphones,a third terminal,SEMAX,limits the •LCD Monitors headphone volume level when a dc voltage is ap-plied.Finally,to ensure a smooth transition between •Pocket PCactive and shutdown modes,a fade mode ramps thevolume up and down.Please be aware that an important notice concerning availability,standard warranty,and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.PRODUCTION DATA information is current as of publication date.Copyright©2002–2004,Texas Instruments Incorporated Products conform to specifications per the terms of the TexasInstruments standard warranty.Production processing does notnecessarily include testing of all parameters.ABSOLUTE MAXIMUM RATINGSDISSIPATION RATING TABLERECOMMENDED OPERATING CONDITIIONSTPA6011A4SLOS392A–FEBRUARY 2002–REVISED JULY 2004AVAILABLE OPTIONSPACKAGET A24-PIN TSSOP (PWP)(1)40°C to 85°CTPA6011A4PWP(1)The PWP package is available taped and reeled.To order a taped and reeled part,add the suffix R to the part number (e.g.,TPA6011A4PWPR).over operating free-air temperature range (unless otherwise noted)(1)UNITV SS Supply voltage,V DD ,PV DD -0.3V to 6V V I Input voltage-0.3V to V DD +0.3V Continuous total power dissipation See Dissipation Rating TableT A Operating free-air temperature range -40°C to 85°C T J Operating junction temperature range -40°C to 150°C T stg Storage temperature range-65°C to 150°CLead temperature 1,6mm (1/16inch)from case for 10seconds260°C(1)Stresses beyond those listed under "absolute maximum ratings"may cause permanent damage to the device.These are stress ratings only,and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions"is not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.T A ≤25°C DERATING FACTOR T A =70°C T A =85°C PACKAGE POWER RATINGABOVE T A =25°CPOWER RATINGPOWER RATINGPWP2.7mW21.8mW/°C1.7W1.4WMINMAX UNIT V SS Supply voltage,V DD ,PV DD 4.0 5.5V SE/BTL,HP/LINE,FADE 0.8×V DDV V IH High-level input voltage SHUTDOWN2V SE/BTL,HP/LINE,FADE 0.6×V DDV V IL Low-level input voltage SHUTDOWN0.8V T AOperating free-air temperature-4085°C2ELECTRICAL CHARACTERISTICSOPERATING CHARACTERISTICSTPA6011A4SLOS392A–FEBRUARY 2002–REVISED JULY 2004T A =25°C,V DD =PV DD =5.5V (unless otherwise noted)PARAMETERTEST CONDITIONSMINTYPMAX UNIT V DD =5.5V,Gain =0dB,SE/BTL =0V 30mV |V OO |Output offset voltage (measured differentially)V DD =5.5V,Gain =20dB,SE/BTL =0V 50mV PSRR Power supply rejection ratioV DD =PV DD =4.0V to 5.5V -42-70dB High-level input current (SE/BTL,FADE,HP/LINE,V DD =PV DD =5.5V,|I IH |1µA SHUTDOWN,SEDIFF,SEMAX,VOLUME)V I =V DD =PV DDLow-level input current (SE/BTL,FADE,HP/LINE,|I IL |V DD =PV DD =5.5V,V I =0V 1µASHUTDOWN,SEDIFF,SEMAX,VOLUME)V DD =PV DD =5.5V,SE/BTL =0V, 6.07.59.0SHUTDOWN =2VI DDSupply current,no loadmA V DD =PV DD =5.5V,SE/BTL =5.5V, 3.056SHUTDOWN =2VV DD =5V =PV DD ,SE/BTL =0V,I DD Supply current,max power intoa 3-Ωload SHUTDOWN =2V,R L =3Ω, 1.5A RMS P O =2W,stereo I DD(SD)Supply current,shutdown modeSHUTDOWN =0.0V120µAT A =25°C,V DD =PV DD =5V,R L =3Ω,Gain =6dB (unless otherwise noted)3PGND ROUT-PV DD RHPIN RLINEINRIN V DD LIN LLINEIN LHPIN PV DD LOUT-PWP PACKAGE (TOP VIEW)TPA6011A4SLOS392A–FEBRUARY 2002–REVISED JULY 2004Terminal FunctionsTERMINAL I/O DESCRIPTIONNAME NO.PGND 1,13-Power groundLOUT-12O Left channel negative audio output PV DD 3,11-Supply voltage terminal for power stageLHPIN 10I Left channel headphone input,selected when HP/LINE is held high LLINEIN 9I Left channel line input,selected when HP/LINE is held lowLIN 8I Common left channel input for fully differential input.AC ground for single-ended inputs.V DD 7-Supply voltage terminalRIN 6I Common right channel input for fully differential input.AC ground for single-ended inputs.RLINEIN 5I Right channel line input,selected when HP/LINE is held low RHPIN 4I Right channel headphone input,selected when HP/LINE is held high ROUT-2O Right channel negative audio output ROUT+24O Right channel positive audio outputSHUTDOWN 15I Places the amplifier in shutdown mode if a TTL logic low is placed on this terminalPlaces the amplifier in fade mode if a logic low is placed on this terminal;normal operation if a logic high is FADE 16I placed on this terminalBYPASS 17I Tap to voltage divider for internal midsupply bias generator used for analog reference AGND 18-Analog power supply groundSEMAX 19I Sets the maximum volume for single ended operation.DC voltage range is 0to V DD .SEDIFF 20I Sets the difference between BTL volume and SE volume.DC voltage range is 0to V DD .VOLUME 21I Terminal for dc volume control.DC voltage range is 0to V DD .Input MUX control.When logic high,RHPIN and LHPIN inputs are selected.When logic low,RLINEIN and HP/LINE 22I LLINEIN inputs are selected.Output MUX control.When this terminal is high,SE outputs are selected.When this terminal is low,BTL SE/BTL 23I outputs are selected.LOUT+14OLeft channel positive audio output.4FUNCTIONAL BLOCK DIAGRAMROUT+SHUTDOWN ROUT-PV DD PGND V DD BYPASS AGNDLOUT+LOUT-TPA6011A4SLOS392A–FEBRUARY 2002–REVISED JULY 2004NOTE:All resistor wipers are adjusted with 32step volume control.5TPA6011A4SLOS392A–FEBRUARY 2002–REVISED JULY 2004Table 1.DC Volume Control (BTL Mode,V DD =5V)(1)VOLUME (PIN 21)GAIN OF AMPLIFIER(Typ)FROM (V)TO (V)0.000.26-85(2)0.330.37-400.440.48-380.560.59-360.670.70-340.780.82-320.890.93-301.01 1.04-281.12 1.16-261.23 1.27-241.35 1.38-221.46 1.49-201.57 1.60-181.68 1.72-161.79 1.83-141.91 1.94-122.02 2.06-102.13 2.17-82.25 2.28-6(2)2.36 2.39-42.47 2.50-22.58 2.6102.70 2.7322.81 2.8342.92 2.9563.04 3.0683.15 3.17103.26 3.29123.38 3.40143.49 3.51163.60 3.63183.715.0020(2)(1)For other values of V DD ,scale the voltage values in the table by a factor of V DD /5.(2)Tested in production.Remaining gain steps are specified by design.6TPA6011A4SLOS392A–FEBRUARY2002–REVISED JULY2004 Table2.DC Volume Control(SE Mode,V DD=5V)(1)SE_VOLUME=VOLUME-SEDIFF or SEMAX GAIN OF AMPLIFIER(Typ)FROM(V)TO(V)0.000.26-85(2)0.330.37-460.440.48-440.560.59-420.670.70-400.780.82-380.890.93-361.01 1.04-341.12 1.16-321.23 1.27-301.35 1.38-281.46 1.49-261.57 1.60-241.68 1.72-221.79 1.83-201.91 1.94-182.02 2.06-162.13 2.17-142.25 2.28-122.36 2.39-102.47 2.50-82.58 2.61-6(2)2.70 2.73-42.81 2.83-22.92 2.950(2)3.04 3.0623.15 3.1743.26 3.296(2)3.38 3.4083.49 3.51103.60 3.63123.71 5.0014(1)For other values of V DD,scale the voltage values in the table by a factor of V DD/5.(2)Tested in production.Remaining gain steps are specified by design.7TYPICAL CHARACTERISTICSTable of GraphsT H D +N − T o t a l H a r m o n i c D i s t o r t i o n + N o i s e (B T L ) − %f − Frequency − Hzf − Frequency − HzT H D +N − T o t a l H a r m o n i c D i s t o r t i o n + N o i s e (B T L ) − %TPA6011A4SLOS392A–FEBRUARY 2002–REVISED JULY 2004FIGUREvs Frequency 1,23THD+NTotal harmonic distortion plus noise (BTL)vs Output power 6,7,8vs Frequency4,5THD+NTotal harmonic distortion plus noise (SE)vs Output power 9vs Output voltage10Closed loop response11,12vs Temperature 13I CC Supply current vs Supply voltage 14,15,16P D Power Dissipation vs Output power 17,18P OOutput power vs Load resistance 19,20Crosstalkvs Frequency 21,22HP/LINE attenuationvs Frequency 23PSRR Power supply ripple rejection (BTL)vs Frequency 24PSRR Power supply ripple rejection (SE)vs Frequency 25Z I Input impedance vs BTL gain 26V nOutput noise voltagevs Frequency 27TOTAL HARMONIC DISTORTION +NOISE (BTL)TOTAL HARMONIC DISTORTION +NOISE (BTL)vsvsFREQUENCYFREQUENCYFigure 1.Figure 2.8f − Frequency − HzT H D +N − T o t a l H a r m o n i c D i s t o r t i o n + N o i s e (S E ) − %f − Frequency − HzT H D +N − T o t a l H a r m o n i c D i s t o r t i o n + N o i s e (B T L ) − %f − Frequency − HzT H D +N − T o t a l H a r m o n i c D i s t o r t i o n + N o i s e (S E ) −%P O − Output Power − WT H D +N − T o t a l H a r m o n i c D i s t o r t i o n + N o i s e (B T L ) − %TPA6011A4SLOS392A–FEBRUARY 2002–REVISED JULY 2004TOTAL HARMONIC DISTORTION +NOISE (BTL)TOTAL HARMONIC DISTORTION +NOISE (SE)vsvsFREQUENCYFREQUENCYFigure 3.Figure 4.TOTAL HARMONIC DISTORTION +NOISE (SE)TOTAL HARMONIC DISTORTION +NOISE (BTL)vsvsFREQUENCYOUTPUT POWERFigure 5.Figure 6.9P O − Output Power − WT H D +N − T o t a l H a r m o n i c D i s t o r t i o n + N o i s e (B T L ) − %P O − Output Power − WT H D +N − T o t a l H a r m o n i c D i s t o r t i o n + N o i s e (B T L ) − %V O − Output Voltage − rmsT H D +N − T o t a l H a r m o n i c D i s t o r t i o n + N o i s e (S E ) − %P O − Output Power − WT H D +N − T o t a l H a r m o n i c D i s t o r t i o n + N o i s e (S E ) − %TPA6011A4SLOS392A–FEBRUARY 2002–REVISED JULY 2004TOTAL HARMONIC DISTORTION +NOISE (BTL)TOTAL HARMONIC DISTORTION +NOISE (BTL)vsvsOUTPUT POWEROUTPUT POWERFigure 7.Figure 8.TOTAL HARMONIC DISTORTION +NOISE (SE)TOTAL HARMONIC DISTORTION +NOISE (SE)vsvsOUTPUT POWEROUTPUT VOLTAGEFigure 9.Figure 10.10f − Frequency − HzC l o s e d L o o p G a i n − d BP h a s e − D e g r e es f − Frequency − HzC l o s e d L o o p G a i n − d BP h a s e − D e g r e e s− S u p p l y C u r r e n t − m AT A − Free-Air Temperature − °C I D DV DD − Supply Voltage − V− S u p p l y C u r r e n t − m AI D D CLOSED LOOP RESPONSECLOSED LOOP RESPONSEFigure 11.Figure 12.SUPPLY CURRENTSUPPLY CURRENTvsvsFREE-AIR TEMPERATURESUPPLY VOLTAGEFigure 13.Figure 14.V DD − Supply Voltage − V− S u p p l y C u r r e n t − I D D nAV DD − Supply Voltage − V− S u p p l y C u r r e n t − m AI D DP O − Output Power − W− P o w e r D i s s i p a t i o n (P E R C H A N N E L ) − WP DP O − Output Power − mW− P o w e r D i s s i p a t i o n (P E R C H A N N E L ) − m WP D SLOS392A–FEBRUARY 2002–REVISED JULY 2004SUPPLY CURRENTSUPPLY CURRENTvsvsSUPPLY VOLTAGESUPPLY VOLTAGEFigure 15.Figure 16.POWER DISSIPATION (PER CHANNEL)POWER DISSIPATION (PER CHANNEL)vsvsOUTPUT POWEROUTPUT POWERFigure 17.Figure 18.R L − Load Resistance − Ω− O u t p u t P o w e r − WP OR L − Load Resistance − Ω− O u t p u t P o w e r − WP O−1 f − Frequency − HzC r o s s t a l k − d B−1 f − Frequency − HzC r o s s t a l k − d BOUTPUT POWEROUTPUT POWERvsvsLOAD RESISTANCELOAD RESISTANCEFigure 19.Figure 20.CROSSTALKCROSSTALKvsvsFREQUENCYFREQUENCYFigure 21.Figure 22.f − Frequency − HzP S R R − P o w e r S u p p l y R e j e c t i o n R a t i o (B T L ) − d Bf − Frequency − HzH P /L i n e A t t e n u a t i o n − d Bf − Frequency − HzP S R R − P o w e r S u p p l y R e j e c t i o n R a t i o (S E ) − d B01020304050607080900BTL Gain − dB− I n p u t I m p e d a m c e − Z I k ΩSLOS392A–FEBRUARY 2002–REVISED JULY 2004HP/LINE ATTENUATIONPOWER SUPPLY REJECTION RATIO (BTL)vsvsFREQUENCYFREQUENCYFigure 23.Figure 24.POWER SUPPLY REJECTION RATIO (SE)INPUT IMPEDANCEvsvs FREQUENCYBTL GAINFigure 25.Figure 26.1008020− O u t p u t N o i s e V o l t a g e −12014018040060160V n V µR M Sf − Frequency − HzOUTPUT NOISE VOLTAGEvsFREQUENCYFigure 27.SLOS392A–FEBRUARY2002–REVISED JULY2004APPLICATION INFORMATIONSELECTION OF COMPONENTSFigure28and Figure29are schematic diagrams of typical notebook computer application circuits.A.A0.1-µF ceramic capacitor should be placed as close as possible to the IC.For filtering lower-frequency noisesignals,a larger electrolytic capacitor of10µF or greater should be placed near the audio power amplifier.Figure28.Typical TPA6011A4Application Circuit Using Single-Ended Inputs and Input MUXAPPLICATION INFORMATION(continued)A.A0.1-µF ceramic capacitor should be placed as close as possible to the IC.For filtering lower-frequency noisesignals,a larger electrolytic capacitor of10µF or greater should be placed near the audio power amplifier.Figure29.Typical TPA6011A4Application Circuit Using Differential InputsSE/BTL OPERATIONThe ability of the TPA6011A4to easily switch between BTL and SE modes is one of its most important cost saving features.This feature eliminates the requirement for an additional headphone amplifier in applications where internal stereo speakers are driven in BTL mode but external headphone or speakers must be accommodated.Internal to the TPA6011A4,two separate amplifiers drive OUT+and OUT-.The SE/BTL input controls the operation of the follower amplifier that drives LOUT-and ROUT-.When SE/BTL is held low,the amplifier is on and the TPA6011A4is in the BTL mode.When SE/BTL is held high,the OUT-amplifiers are in a high output impedance state,which configures the TPA6011A4as an SE driver from LOUT+and ROUT+.I DD is reduced by approximately one-third in SE mode.Control of the SE/BTL input can be from a logic-level CMOS source or,more typically,from a resistor divider network as shown in Figure30.The trip level for the SE/BTL input can be found in the recommended operating conditions table.SLOS392A–FEBRUARY2002–REVISED JULY2004APPLICATION INFORMATION(continued)Figure30.TPA6011A4Resistor Divider Network CircuitUsing a1/8-in.(3,5mm)stereo headphone jack,the control switch is closed when no plug is inserted.When closed the100-kΩ/1-kΩdivider pulls the SE/BTL input low.When a plug is inserted,the1-kΩresistor is disconnected and the SE/BTL input is pulled high.When the input goes high,the OUT-amplifier is shut down causing the speaker to mute(open-circuits the speaker).The OUT+amplifier then drives through the output capacitor(C o)into the headphone jack.HP/LINE OPERATIONThe HP/LINE input controls the internal input multiplexer(MUX).Refer to the block diagram in Figure30.This allows the device to switch between two separate stereo inputs to the amplifier.For design flexibility,the HP/LINE control is independent of the output mode,SE or BTL,which is controlled by the aforementioned SE/BTL pin.To allow the amplifier to switch from the LINE inputs to the HP inputs when the output switches from BTL mode to SE mode,simply connect the SE/BTL control input to the HP/LINE input.When this input is logic high,the RHPIN and LHPIN inputs are selected.When this terminal is logic low,the RLINEIN and LLINEIN inputs are selected.This operation is also detailed in Table3and the trip levels for a logic low(V IL)or logic high(V IH)can be found in the recommended operating conditions table.SHUTDOWN MODESThe TPA6011A4employs a shutdown mode of operation designed to reduce supply current(I DD)to the absolute minimum level during periods of nonuse for battery-power conservation.The SHUTDOWN input terminal should be held high during normal operation when the amplifier is in use.Pulling SHUTDOWN low causes the outputs to mute and the amplifier to enter a low-current state,I DD=20µA.SHUTDOWN should never be left unconnected because amplifier operation would be unpredictable.FADE OPERATION Table3.HP/LINE,SE/BTL,and Shutdown Functions INPUTS(1)AMPLIFIER STATEHP/LINE SE/BTL SHUTDOWN INPUT OUTPUTX X Low X MuteLow Low High Line BTLLow High High Line SEHigh Low High HP BTLHigh High High HP SE(1)Inputs should never be left unconnected.For design flexibility,a fade mode is provided to slowly ramp up the amplifier gain when coming out of shutdown mode and conversely ramp the gain down when going into shutdown.This mode provides a smooth transition between the active and shutdown states and virtually eliminates any pops or clicks on the outputs.When the FADE input is a logic low,the device is placed into fade-on mode.A logic high on this pin places the amplifier in the fade-off mode.The voltage trip levels for a logic low(V IL)or logic high(V IH)can be found in the recommended operating conditions table.When a logic low is applied to the FADE pin and a logic low is then applied on the SHUTDOWN pin,the channel gain steps down from gain step to gain step at a rate of two clock cycles per step.With a nominal internal clock frequency of58Hz,this equates to34ms(1/24Hz)per step.The gain steps down until the lowest gain step is reached.The time it takes to reach this step depends on the gain setting prior to placing the device in shutdown. For example,if the amplifier is in the highest gain mode of20dB,the time it takes to ramp down the channel gain is1.05seconds.This number is calculated by taking the number of steps to reach the lowest gain from the highest gain,or31steps,and multiplying by the time per step,or34ms.After the channel gain is stepped down to the lowest gain,the amplifier begins discharging the bypass capacitor from the nominal voltage of V DD/2to ground.This time is dependent on the value of the bypass capacitor.For a 0.47-µF capacitor that is used in the application diagram in Figure28,the time is approximately500ms.This time scales linearly with the value of bypass capacitor.For example,if a1-µF capacitor is used for bypass,the time period to discharge the capacitor to ground is twice that of the0.47-µF capacitor,or1second.Figure30 below is a waveform captured at the output during the shutdown sequence when the part is in fade-on mode. The gain is set to the highest level and the output is at V DD when the amplifier is shut down.When a logic high is placed on the SHUTDOWN pin and the FADE pin is still held low,the device begins the start-up process.The bypass capacitor will begin charging.Once the bypass voltage reaches the final value of V DD/2,the gain increases in2-dB steps from the lowest gain level to the gain level set by the dc voltage applied to the VOLUME,SEDIFF,and SEMAX pins.In the fade-off mode,the amplifier stores the gain value prior to starting the shutdown sequence.The output of the amplifier immediately drops to V DD/2and the bypass capacitor begins a smooth discharge to ground.When shutdown is released,the bypass capacitor charges up to V DD/2and the channel gain returns immediately to the value stored in memory.Figure31below is a waveform captured at the output during the shutdown sequence when the part is in the fade-off mode.The gain is set to the highest level,and the output is at V DD when the amplifier is shut down.The power-up sequence is different from the shutdown sequence and the voltage on the FADE pin does not change the power-up sequence.Upon a power-up condition,the TPA6011A4begins in the lowest gain setting and steps up2dB every2clock cycles until the final value is reached as determined by the dc voltage applied to the VOLUME,SEDIFF,and SEMAX pins.ROUT+VOLUME,SEDIFF,AND SEMAX OPERATIONSLOS392A–FEBRUARY 2002–REVISED JULY 2004Figure 31.Shutdown Sequence in theFigure 32.Shutdown Sequence in theFade-on Mode Fade-off ModeThree pins labeled VOLUME,SEDIFF,and SEMAX control the BTL volume when driving speakers and the SE volume when driving headphones.All of these pins are controlled with a dc voltage,which should not exceed V DD .When driving speakers in BTL mode,the VOLUME pin is the only pin that controls the gain.Table 1shows the gain for the BTL mode.The voltages listed in the table are for V DD =5V.For a different V DD ,the values in the table scale linearly.If V DD =4V,multiply all the voltages in the table by 4V/5V,or 0.8.The TPA6011A4allows the user to specify a difference between BTL gain and SE gain.This is desirable to avoid any listening discomfort when plugging in headphones.When switching to SE mode,the SEDIFF and SEMAX pins control the singe-ended gain proportional to the gain set by the voltage on the VOLUME pin.When SEDIFF =0V,the difference between the BTL gain and the SE gain is 6dB.Refer to the section labeled bridged-tied load versus single-ended load for an explanation on why the gain in BTL mode is 2x that of single-ended mode,or 6dB greater.As the voltage on the SEDIFF terminal is increased,the gain in SE mode decreases.The voltage on the SEDIFF terminal is subtracted from the voltage on the VOLUME terminal and this value is used to determine the SE gain.Some audio systems require that the gain be limited in the single-ended mode to a level that is comfortable for headphone listening.Most volume control devices only have one terminal for setting the gain.For example,if the speaker gain is 20dB,the gain in the headphone channel is fixed at 14dB.This level of gain could cause discomfort to listeners and the SEMAX pin allows the designer to limit this discomfort when plugging in headphones.The SEMAX terminal controls the maximum gain for single-ended mode.The functionality of the SEDIFF and SEMAX pin are combined to set the SE gain.A block diagram of the combined functionality is shown in Figure 33.The value obtained from the block diagram for SE_VOLUME is a dc voltage that can be used in conjunction with Table 2to determine the SE gain.Again,the voltages listed in the table are for V DD =5V.The values must be scaled for other values of V DD .Table 1and Table 2show a range of voltages for each gain step.There is a gap in the voltage between each gain step.This gap represents the hysteresis about each trip point in the internal comparator.The hysteresis ensures that the gain control is monotonic and does not oscillate from one gain step to another.If a potentiometer is used to adjust the voltage on the control terminals,the gain increases as the potentiometer is turned in one direction and decreases as it is turned back the other direction.The trip point,where the gainSEDIFF (V)VOLUME (V)0242.702.61 2.732.81B T L G a i n - d B Voltage on VOLUME Pin - VTPA6011A4SLOS392A–FEBRUARY 2002–REVISED JULY 2004actually changes,is different depending on whether the voltage is increased or decreased as a result of the hysteresis about each trip point.The gaps in Table 1and Table 2can also be thought of as indeterminate states where the gain could be in the next higher gain step or the lower gain step depending on the direction the voltage is changing.If using a DAC to control the volume,set the voltage in the middle of each range to ensure that the desired gain is achieved.A pictorial representation of the volume control can be found in Figure 34.The graph focuses on three gain steps with the trip points defined in Table 1for BTL gain.The dotted line represents the hysteresis about each gain step.Figure 33.Block Diagram of SE Volume ControlFigure 34.DC Volume Control Operation21 INPUTRESISTANCEInput Signal ƒ*3dB +12p CR i (1)INPUT CAPACITOR,C if c(highpass)+12p R i C i −3 dBf c (2)C i +12p R i f c (3)TPA6011A4SLOS392A–FEBRUARY 2002–REVISED JULY 2004Each gain setting is achieved by varying the input resistance of the amplifier,which can range from its smallest value to over six times that value.As a result,if a single capacitor is used in the input high-pass filter,the -3dB or cutoff frequency also changes by over six times.Figure 35.Resistor on Input for Cut-Off FrequencyThe input resistance at each gain setting is given in Figure 26.The -3-dB frequency can be calculated using Equation 1.In the typical application an input capacitor (C i )is required to allow the amplifier to bias the input signal to the proper dc level for optimum operation.In this case,C i and the input impedance of the amplifier (R i )form a high-pass filter with the corner frequency determined in Equation 2.The value of C i is important to consider as it directly affects the bass (low frequency)performance of the circuit.Consider the example where R i is 70k Ωand the specification calls for a flat-bass response down to 40Hz.Equation 2is reconfigured as Equation 3.In this example,C i is 56.8nF,so one would likely choose a value in the range of 56nF to 1µF.A further consideration for this capacitor is the leakage path from the input source through the input network (C i )and the feedback network to the load.This leakage current creates a dc offset voltage at the input to the amplifier that reduces useful headroom,especially in high gain applications.For this reason,a low-leakage tantalum or ceramic capacitor is the best choice.When polarized capacitors are used,the positive side of the capacitor should face the amplifier input in most applications as the dc level there is held at V DD /2,which is likely higher than the source dc level.Note that it is important to confirm the capacitor polarity in the application.22POWER SUPPLY DECOUPLING,C(S) MIDRAIL BYPASS CAPACITOR,C(BYP) OUTPUT COUPLING CAPACITOR,C(C)f c(high)+12p RL C(C)−3 dBf c(4)TPA6011A4SLOS392A–FEBRUARY2002–REVISED JULY2004The TPA6011A4is a high-performance CMOS audio amplifier that requires adequate power supply decoupling to ensure the output total harmonic distortion(THD)is as low as possible.Power supply decoupling also prevents oscillations for long lead lengths between the amplifier and the speaker.The optimum decoupling is achieved by using two capacitors of different types that target different types of noise on the power supply leads.For higher frequency transients,spikes,or digital hash on the line,a good low equivalent-series-resistance(ESR)ceramic capacitor,typically0.1µF placed as close as possible to the device V DD lead,works best.For filtering lower-frequency noise signals,a larger aluminum electrolytic capacitor of10µF or greater placed near the audio power amplifier is recommended.The midrail bypass capacitor(C(BYP))is the most critical capacitor and serves several important functions.During start-up or recovery from shutdown mode,C(BYP)determines the rate at which the amplifier starts up.The second function is to reduce noise produced by the power supply caused by coupling into the output drive signal.This noise is from the midrail generation circuit internal to the amplifier,which appears as degraded PSRR and THD+N.Bypass capacitor(C(BYP))values of0.47-µF to1-µF ceramic or tantalum low-ESR capacitors are recommended for the best THD and noise performance.For the best pop performance,choose a value for C(BYP)that is equal to or greater than the value chosen for C i.This ensures that the input capacitors are charged up to the midrail voltage before C(BYP)is fully charged to the midrail voltage.In the typical single-supply SE configuration,an output coupling capacitor(C(C))is required to block the dc bias at the output of the amplifier,thus preventing dc currents in the load.As with the input coupling capacitor,the output coupling capacitor and impedance of the load form a high-pass filter governed by Equation4.The main disadvantage,from a performance standpoint,is the load impedances are typically small,which drives the low-frequency corner higher,degrading the bass rge values of C(C)are required to pass low frequencies into the load.Consider the example where a C(C)of330µF is chosen and loads vary from3Ω,4Ω, 8Ω,32Ω,10kΩ,and47kΩ.Table4summarizes the frequency response characteristics of each configuration.mon Load Impedances vs Low FrequencyOutput Characteristics in SE ModeLOWESTR L C(C)FREQUENCY3Ω330µF161Hz4Ω330µF120Hz8Ω330µF60Hz32Ω330µF15Hz10,000Ω330µF0.05Hz47,000Ω330µF0.01Hz23。
IC datasheet pdf-CD74AC14,pdf(HEX SCHMITT-TRIGGER INVERTER )
HEX SCHMITTĆTRIGGERHEX SCHMITTĆTRIGGERPACKAGING INFORMATION Orderable DeviceStatus (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)CD74AC14EACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type CD74AC14EE4ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type CD74AC14MACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM CD74AC14M96ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM CD74AC14M96E4ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM CD74AC14M96G4ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM CD74AC14ME4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM CD74AC14MG4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.PACKAGE OPTION ADDENDUM 23-Apr-2007TAPE AND REEL INFORMATION*All dimensions are nominal Device Package Type Package DrawingPinsSPQ Reel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant CD74AC14M96SOIC D 142500330.016.4 6.59.0 2.18.016.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) CD74AC14M96SOIC D142500346.0346.033.0IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right, or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use any non-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDLP®Products Communications and /communicationsTelecomDSP Computers and /computersPeripheralsClocks and Timers /clocks Consumer Electronics /consumer-appsInterface Energy /energyLogic Industrial /industrialPower Mgmt Medical /medicalMicrocontrollers Security /securityRFID Space,Avionics&/space-avionics-defenseDefenseRF/IF and ZigBee®Solutions /lprf Video and Imaging /videoWireless /wireless-appsMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2010,Texas Instruments Incorporated。
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OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTSOCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTSOCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTSPACKAGING INFORMATIONOrderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)74AC11245DBLE OBSOLETE SSOP DB 24TBD Call TI Call TI 74AC11245DBR OBSOLETE SSOP DB 24TBD Call TI Call TI74AC11245DW ACTIVE SOIC DW 2425Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM 74AC11245DWE4ACTIVE SOIC DW 2425Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM 74AC11245DWG4ACTIVE SOIC DW 2425Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM 74AC11245DWR ACTIVE SOIC DW 242000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM 74AC11245DWRE4ACTIVE SOIC DW 242000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM 74AC11245DWRG4ACTIVE SOIC DW 242000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM 74AC11245NT ACTIVE PDIP NT 2415Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type 74AC11245NTE4ACTIVE PDIP NT 2415Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type 74AC11245PWLEOBSOLETETSSOPPW24TBDCall TICall TI(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%byweight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.PACKAGE OPTION ADDENDUM11-Nov-2009TAPE AND REEL INFORMATION*All dimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant 74AC11245DWR SOICDW242000330.024.410.7515.72.712.024.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm)74AC11245DWR SOIC DW242000346.0346.041.0IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right, or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use any non-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers AudioData Converters AutomotiveDLP®Products BroadbandDSP Digital ControlClocks and Timers MedicalInterface MilitaryLogic Optical NetworkingPower Mgmt SecurityMicrocontrollers TelephonyRFID Video&ImagingRF/IF and ZigBee®Solutions WirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2009,Texas Instruments Incorporated。