T6B65AFG中文资料
G6迷你型光电传感器选型手册(中文版)
G6经济型迷你光电开关德国西克传感器产品简介2 S I C K超越标准 - G6易于对准经济型迷你光电开关3w w w.s i c k.c o m/g lo b al s en so r片技术S I C K4 S I C KGTB6L+M QL+MQ NC漫反射式光电开关,背景遮蔽型LED光源技术,光点更亮更精确 金属螺纹安装孔,安装简便且坚固 大旋钮方便调节 指示灯大而明亮类激光性能施克 芯片,抗环境干扰和传感器互相干扰ASIC 光轴接收光轴发射所有尺寸均为毫米(英寸)G6S I C K5252010501550(1.97)mm(inch)100(3.94)150(5.91)200(7.87)250(9.84)300(11.81)Ø 6.6Ø 5.6Ø 5.3(5.91)(9.84)(1.97)(7.87)(3.94)(11.81)18 % 90 %2 6 %311)对90%反射率物体(基于DIN 5033的标准白色)2) T a=+25°C下平均工作时间100,000小时3)限定值,电源极性反接在短路保护下电流最大8A4) 不可以超出供电电压Vs允许范围值信号冗余最大典型检测范围检测距离对白色( 的反射率)的检测距离对灰色( 的反射率)的检测距离对黑色( 的反射率)的检测距离5) 空载8) 0°C以下不可弯曲6)电阻性负载情况下信号传输时间7) 亮/暗比例1:1所有尺寸均为毫米(英寸)距离单位为毫米(英寸)距离单位为毫米(英寸)6 S I C KL+M Q所有尺寸均为毫米(英寸)LED光源技术,光点更亮更精确 金属螺纹安装孔,安装简便且坚固施克ASIC芯片,抗环境光干扰和传感器互相干扰 大旋钮方便调节 指示灯大而明亮光轴接收光轴发射L+M Q NC反射式光电开关,增强型漫类激光性能GTE6G6S I C K 71)对90%反射率物体(基于DIN 5033的标准白色)2) T a=+25°C下平均工作时间100,000小时3)限定值,电源极性反接在短路保护下电流最大8A4) 不可以超出供电电压Vs允许范围值检测范围1000101信号冗余mm(inch)50(1.9)100(3.9)150(5.9)200(7.9)250(9.8)300(11.8)215) 空载8) 0°C以下不可弯曲6)电阻性负载情况下信号传输时间7) 亮/暗比例1:1最大典型检测距离距离[mm]8 S I C KGL6镜反射式光电开关金属螺纹安装孔,安装简便且坚固 施克ASIC芯片,抗环境光干扰和传感器互相干扰 大旋钮方便调节指示灯大而明亮L+M Q所有尺寸均为毫米(英寸)L+M Q NC光轴接收光轴发射M3螺纹安装孔LED光源技术,光点更亮更精确G6S I C K 9(inch)(78.7)(157.5)(236.2)(315.0)1) Ta=+25°C下平均工作时间100,000小时2)限定值,电源极性反接在短路保护下电流最大8A 3) 不可以超出供电电压Vs允许范围值4)空载5) 电阻性负载情况下信号传输时间6) 亮/暗比例1:17) 0°C以下不可弯曲检测范围 (EGR: 2)[m]GL6镜反射式光电开关,可调节灵敏度检测距离 6 m镜反射式光电开关尺寸图所有型号调节+–4针,M81L+M Q34棕色蓝色黑色3 x 0.14 mm 2连接类型GL6-P4211GL6-N4211GL6-P1211GL6-P1212GL6-N1211GL6-N1212附件电缆和接头安装附件反射镜所有尺寸均为毫米(英寸)1L+M Q NC342棕色蓝色黑色白色光轴接收器光轴发射器M3螺纹安装孔绿色LED 指示灯,电源黄色LED 指示灯,接收光线亮通/暗通旋钮: L = 亮通D = 暗通接收器灵敏度调节器①②③④⑤⑥⑦PinPoint LED 光源技术,光点更亮更精确金属螺纹安装孔,安装简便且坚固SICK ASIC 芯片,抗环境光干扰和传感器互相干扰可通过270°电位计调节接收器灵敏度适用于特殊表面和光亮物体7.6(0.30)9.7(0.38)18.3(0.72)21 (0.83)11.4(0.45)31.5 (1.24)28.5 (1.12)25.4 (1.00)0.5 (0.02)0.5 (0.02)9.7(0.38)3 (0.12)L D12(0.47)S I C K10G6S I C K 11信号冗余Ø 8 mmØ 25 mmØ 80 mmØ 130 mm距离(米)传感器3.05.01.00.351)TA = +25°C 时,平均工作时间100000小时2) 限定值,短路保护下的最大电流为8 A 3)不得超出供电电压V S 的允许范围值4) 空载5)V S > 24 V 或环境温度大于49 °C 时,最大电流I A = 50 mA6) 电阻负载下的信号传输时间7) 亮/暗比例为1:18) 低于0 °C 时不可弯曲最大检测距离6 m 检测范围 5 m接收器灵敏度调节器270°电位计配套装置 PL80A 反射镜光源类型LED 红光,650 nm 1) 光点直径8 mm ,距离350 mm 处偏光滤镜 供电电压V S 10 ... 30 V DC 2)残余纹波 ± 10 % 3) 能耗 ≤ 30 mA 4)开关输出 NPN :集电极开路:QPNP: QPNP 高/低输出电压V S – (≤ 3 V)/约0 V NPN 高/低输出电压约V S /≤ 3 V 输出方式 亮通/暗通旋钮最大输出电流I A 100 mA 5)响应时间 < 625 µs 6)切换频率典型值为1 kHz 7)连接方式电缆,PVC ,2 m 8)M8接头,4针防护等级电流保护电源极性反接保护输入输出短路保护输出过流保护防护等级IP 67环境温度工作温度 –25 °C ... +55 °C储存温度 –40 °C ... +70 °C 重量 M8接头型,约20 g2 m 电缆型,约60 g 外壳材质ABS, PC, PMMA随附配件P250反射镜,安装支架N1211技术数据GL6-N1212N4211P1211P1212P4211检测距离和信号冗余型号Part no.GL6-P1211GL6-P1212GL6-P4211GL6-N1211GL6-N1212GL6-N4211105992210608151059241105992310608141059631订货信息REF-IRF-56型反射镜PL20A 型反射镜P250型反射镜PL40A 型反射镜PL80A 型反射镜反射镜型号 检测范围0.25 ... 1.6 m0.07 ... 2.2 m 0.07 ... 3.5m 0.07 ... 3.8 m 0.07 ... 5.0 m 订货号检测范围最大检测距离距离单位为米(英寸)距离单位为米(英寸)最大检测距离检测范围12GL6G 镜反射式光电开关检测距离6 m镜反射式光电开关尺寸图所有型号调节4针,M81L+M Q34棕色蓝色黑色3 x 0.14 mm 2连接类型GL6G-P4211GL6G-P4212GL6G-N4211GL6G-N4212GL6G-P1211GL6G-P1212GL6G-N1211GL6G-N1212附件电缆和接头安装附件反射镜7.6(0.30)9.7(0.38)18.3(0.72)21 (0.83)11.4(0.45)31.5 (1.24)28.5 (1.12)25.4 (1.00)0.5 (0.02)0.5 (0.02)9.7(0.38)3 (0.12)L D12(0.47)所有尺寸均为毫米(英寸)1L+M Q NC342棕色蓝色黑色白色光轴接收器光轴发射器M3螺纹安装孔绿色LED 指示灯,电源黄色LED 指示灯,接收光线亮通/暗通旋钮: L = 亮通D = 暗通接收器灵敏度调节器+–PinPoint LED 光源技术,光点更亮更精确金属螺纹安装孔,安装简便且坚固SICK ASIC 芯片,抗环境光干扰和传感器互相干扰可通过270°电位计调节接收器灵敏度适用于特殊表面和光亮物体①②③④⑤⑥⑦S I C KG6S I C K 13信号冗余Ø 8 mmØ 25 mmØ 80 mmØ 130 mm距离(米)3.05.01.00.351)T A = +25 °C 时,平均工作时间100000小时2) 限定值,短路保护下的最大电流为8 A 3) 不得超出供电电压V S 的允许范围值4) 空载5)最小光束衰减为20%6) V S > 24 V 或环境温度大于49 °C 时,最大电流I A = 50 mA7) 电阻负载下的信号传输时间8) 亮/暗比例为1:19)低于0 °C 时不可弯曲10) 温度需稳定在±10 °C 范围内最大检测距离 6 m 检测范围 5 m接收器灵敏度调节器270°电位计配套装置 PL80A 反射镜光源类型 LED 红光,650 nm 1) 光点直径 8 mm ,距离350 mm 偏光滤镜 供电电压V S 10 ... 30 V DC 2)残余纹波 ± 10 % 3)能耗 ≤ 30 mA 4)开关输出 NPN :集电极开路:QPNP: Q 光束衰减 > 20%特殊设计 适用于透明物体 5)PNP 高/低输出电压V S – (≤ 3 V)/约0 V NPN 高/低输出电压约V S /≤ 3 V 输出方式 亮通/暗通旋钮最大输出电流I A 100 mA 6)响应时间 < 625 µs 7)切换频率典型值为1 kHz 8) 连接方式电缆,PVC ,2 m 9)M8接头,4针防护等级电流保护电源极性反接保护输入输出短路保护输出过流保护防护等级IP 67环境温度T A 工作温度 –25 °C ... +55 °C 10)储存温度 –40 °C ... +70 °C 重量 M8接头型,约20 g2 m 电缆型,约60 g 外壳材质ABS, PC, PMMA随附配件P250反射镜,安装支架N1211技术数据GL6G-N1212N4211N4212P1211P1212P4211P4212检测距离和信号冗余型号订货号GL6G-P1211GL6G-P1212GL6G-P4211GL6G-P4212GL6G-N1211GL6G-N1212GL6G-N4211GL6G-N421210599241060812105963210608101059925106081110596331060809订货信息REF-IRF-56型反射镜PL20A 型反射镜P250型反射镜PL40A 型反射镜PL80A 型反射镜反射镜型号 检测范围0.25 ... 1.6 m0.07 ... 2.2 m 0.07 ... 3.5m 0.07 ... 3.8 m 0.07 ... 5.0 m检测范围最大检测距离距离单位为米(英寸)距离单位为米(英寸)最大检测距离检测范围传感器S I C KL+M QL+MQ NC射式光电开关对 LED光源技术,光点更亮更精确 金属螺纹安装孔,安装简便且坚固 大旋钮方便调节 指示灯大而明亮类激光性能光轴接收光轴发射所有尺寸均为毫米(英寸)GSE610G6S I C K 111,000100101(inch)(157.48)(472.44)(314.96)(629.92)[m]信号冗余检测范围1) Ta=+25°C下平均工作时间100,000小时2)限定值,电源极性反接在短路保护下电流最大8A 3) 不可以超出供电电压Vs允许范围值4)空载5) 电阻性负载情况下信号传输时间6) 亮/暗比例1:17) 0°C以下不可弯曲最大典型检测距离距离电缆和插头/安装附件Ø9.8(.4)8.2Ø9.81)使用过程中最小弯曲半径R min = 20 x 电缆直径所有尺寸均为毫米(英寸)所有尺寸均为毫米(英寸)所有尺寸均为毫米(英寸)所有尺寸均为毫米(英寸)Ø9.8(.4)8.2Ø9.81)使用过程中最小弯曲半径R min = 20 x 电缆直径12S I C KS I C K13附件L1412All dimensions in mm (inch)所有尺寸均为毫米(英寸)所有尺寸均为毫米(英寸)锁紧螺丝反射镜14 S I C K1)发货包含 GL6 标准型号S I C K15附件完善的服务领先的技术独特的产品SICK 概览SICK CHINA| 客户服务专线: 4000-121-0008014182/2013-09-09中文译本 内容如有变更,恕不另行通知SICK 是一家世界顶级的传感器技术提供商,在全球建立了接近50个子公司和众多的销售机构, 雇员总数超过6,300人。
TB6552FNG中文资料
The TB6552FN/FNG/FL/FLG is a dual-bridge driver IC for DC motors with output transistors in an LD MOS structure with low ON-resistance. Two input signals, IN1 and IN2, can chose one of four modes such as CW, CCW, short brake, and stop mode. A PWM drive system supports high heat efficiency driving.
VM VCC VIN IOUT
PD
Topr Tstg
15 V
6
−0.2 to 6
V
IN1, 2, STBY and PWM pins
1
A
0.78 W
(Note 1)
−20 to 85
°C
−55 to 150
°C
Note 1: This rating is obtained when the product is mounted on a 50 × 30 × 1.6 mm glass-epoxy PCB of which 40% or more is occupied by copper.
16
22 Small-signal power supply pin
Remarks GND for small-signal power supply (VCC)
Input PWM signal Ch. A circuit is in standby (power save) state while this signal is Low. Ch. A connect to motor coil pin Ch. A connect to motor coil pin GND for motor power supply (VM) VM (ope) = 2.5 V to 13.5 V Ch. B connect to motor coil pin Ch. B connect to motor coil pin Ch. B circuit is in standby (power save) state while this signal is Low. Input PWM signal
Philips 65BDL3552T 交响乐室顯示器:六十五英寸多逼 touches 解說書说明书
Philips Signage Solutions Multi-Touch Display65"Powered by Android Multi-touch65BDL3552TInteractive classroom displayFeaturing multi-touch technologyMaximise engagement and inspire collaboration with an interactive Philips T-Line display. Featuring anti-glare toughened glass, these Android-powered displays are made to withstand heavy daily usage and feature up to 20 touchpointsInteractive and collaborative•Multi-touch technology capable of 20 touchpoints •Advanced IR touch with smaller, shallower bezels•Operate, monitor and maintain with CMND and Control Smart and powerful•Anti-glare toughened glass•OPS slot allows for PC embedding without cabling •Whiteboard mode built in•Wireless screen sharing and advanced collaboration•Android: Run your own app or choose your favourite app to runHighlightsMulti-touch technologyCreate a memorable interactive experience with up to 20 touchpoints at the same time. Perfect for collaborative and competitive applications, this display connects youraudience with any content - making it ideal for education, public venues, corporate,hospitality and retail settings. The touch panel is HID compliant, providing true plug-and-play operation.OPS slotIntegrate a full-power PC or Android-powered CRD50 module directly into your Philips Professional Display. The OPS slot contains all the connections you need to run your slot-in solution, including a power supply.CMND and ControlRun your display network over a local (LAN) connection. CMND and Control allows you to perform vital functions like controlling inputs and monitoring display status. Whether you're in charge of one screen or 100.Whiteboard mode built inInspire agile collaboration with whiteboard mode. Simply activate this feature to turn your display into a blank canvas that can be drawn on by multiple users by hand or with dedicated display markers. Everything on the screen can then be captured for easy printing or file sharing.Wireless screen sharingDisplay four feeds on the one screen. Wireless screen sharing allows you to connect multipledevices at the same time for quick content switching when you need it. Use your existing Wi-Fi network to instantly and securely connect devices or use our optional HDMI interact dongles to cast directly to the screen without needing to connect to your secured/protected network.Powered by AndroidWith Android OS integrated into the display, you can work with the most developed OS on the planet and save your own app directly into the display. Or, choose from the large library of Android apps and play content from there. With the built-in scheduler, you can daypart your apps and content based on yourcustomer and time of day and with the auto-orientation feature, showing content inportrait or landscape is as simple as turning thedisplay.Issue date 2022-07-15Version: 13.0.112 NC: 8670 001 66454EAN: 87 12581 76594 1© 2022 Koninklijke Philips N.V.All Rights reserved.Specifications are subject to change without notice. Trademarks are the property of Koninklijke Philips N.V. or their respective owners.SpecificationsPicture/Display•Diagonal screen size: 64.5 inch / 163.9 cm •Panel resolution: 3840 x 2160•Optimum resolution: 3840 x 2160 @ 60 Hz •Brightness: 420 cd/m²•Contrast ratio (typical): 1300:1•Surface treatment: Anti-Glare coating •Aspect ratio: 16:9•Response time (typical): 9 ms •Pixel pitch: 0.372 x 0.372 mm •Display colours: 1.07 Billion•Viewing Angle (H / V): 178 / 178 degree•Picture enhancement: 3/2 - 2/2 motion pull down, 3D Combfilter, Motion compens. deinterlacing, Progressive scan, 3D MA deinterlacing, Dynamic contrast enhancement•Dynamic contrast ratio: 500,000:1•Panel technology: IPS•Operating system: Android 9Interactivity•Multi-touch technology: Advanced infrared touch •Touch points: 20 simultaneous touch points •Plug and play: HID compliant•Protection glass: Tempered safety glass, Anti-GlareConnectivity•Video input: Display Port1.2 (x 1), DVI-I (x 1), HDMI 2.0 (x 4), USB 2.0 (x 2), USB 3.0 (x 2), USB-C, HDMI 2.0 (x 2)•Audio input: 3.5 mm Jack (x 1)•Audio output: 3.5 mm Jack (x 2)•External control: RJ45, IR (in/out) 3.5 mm jack, RS232C (in/out) 2.5 mm jack•Other connections: micro SD, OPS•Video output: DisplayPort 1.2 (x 1), DVI - D (x 1), HDMI 2.0 (x 1), USB 2.0 (x 2)Supported Display Resolution•Computer formatsResolutionRefresh rate 1024 x 768 60, 70 Hz 1152 x 864 60, 70, 75 Hz 1152 x 900 66 Hz 1280 x 720 60, 70 Hz 1280 x 768 60 Hz, 75 Hz 1280 x 800 60, 75 Hz 1280 x 960 60 Hz 1280 x 1024 60, 67, 75 Hz1360 x 76860 Hz 1366 x 768 60 Hz 1400 x 1050 60, 75 Hz 1440 x 1050 60 Hz 1440 x 900 60, 75 Hz 1600 x 1200 60 Hz 1600 x 900 60 Hz 1680 x 1050 60 Hz 1920 x 1080 60 Hz 1920 x 1200 60 Hz3840 x 2160 24, 25, 30, 60 Hz 640 x 350 70 Hz640 x 480 60, 67, 72, 75 Hz 800 x 600 56, 60, 72, 75 Hz 832 x 624 75 Hz 848 x 480 60 Hz 960 x 720 75 Hz •Video formats Resolution Refresh rate 1080i 50, 60 Hz 1080p 50, 60 Hz 480p 60 Hz 4K x 2K 576p 50 Hz 720p 50, 60 Hz 720p60 HzConvenience•Placement: Landscape (18/7), Portrait (12/7)•Signal loop through: IR Loop through, DisplayPort, RS232•Network controllable: RS232, RJ45•Picture performance: Advanced colour control •Screen-saving functions: Pixel Shift, Low Brightness •Keyboard control: Hidden, Lockable •Remote control signal: Lockable•Energy-saving functions: Smart Power •Other convenience: Carrying handles •Ease of installation: Smart InsertDimensions•Set dimensions (W x H x D):1494.30 x 869.40 x 80.2 mm (D@wall mount)/106.8 mm (D@speaker cover) mm •Product weight: 43.6 kg•Wall Mount: 400(H)x400(V), M8•Bezel width:16.30 mm(even)•Product weight (lb): 96.12 lb•Set dimensions in inch (W x H x D):58.83 x 34.23 x 3.16 (D@wall mount)/4.20 (D@speaker cover) inch•Smart Insert mount: 100 mm x 100 mm, 6 x M4L6Sound•Built-in speakers: 2 x 20 W RMSOperating conditions•Temperature range (operation): 0 ~ 40 °C•Relative humidity: 20–80% (Operational), 5–95% (Storage) %•MTBF: 50,000 hour(s)•Altitude: 0 ~ 3000 m•Temperature range (storage): -20 ~ 60 °CPower•Mains power: 100 ~ 240 VAC, 50 ~ 60 Hz •Standby power consumption: <0.5 W •Power Saving Features: Smart Power •Consumption (Typical): 175 W •Consumption (Max): 350 W •Energy Label Class: GAccessories•Included accessories: AC Power Cord, RS232 cable, Remote Control, Batteries for remote control, Quick start guide, HDMI cable, IR sensor cable (1.8 M)•Included Accessories: RS232 daisy-chain cable, Cleaning cloth (x 1), DVI-D cable (1.8 m), M2 Screw (x 2), M3 screw (x 2), Philips logo (x 1), Touch Pen (x 2), Touch USB (x 1), USB Cover (x 1)•Optional accessories: Cast to dongleMiscellaneous•On-Screen Display Languages: Arabic, English, French, German, Italian, Japanese, Polish, Spanish, Turkish, Russian, Simplified Chinese, Traditional Chinese, Danish, Dutch, Finnish, Norwegian, Portuguese, Swedish•Regulatory approvals: BSMI, CB, CE, EMF, ETL, FCC, Class A, PSB, RoHS, EAC •Warranty:3 year warrantyMultimedia Applications•USB Playback Picture: BMP, JPEG, JPG, PNG •USB Playback Audio: AAC, M4A, MP3, WMA •USB Playback Video: ASF, AVI, DAT, FLV, MKV, MP4, MPEG, MPG, TS, VOB, WEBM, WMVInternal Player•CPU:MTK5680•Storage: 32 GB eMMc•Wi-Fi: AP(WC0SR2511-88112BU), STA(WCT5GM2511MT7668AU)•GPU: DDR4 4 GB •Memory:4 GB RAM。
lnb65faemc规格书
lnb65faemc规格书全文共四篇示例,供您参考第一篇示例:一、产品概述【lnb65faemc规格书】所描述的产品是一种________(产品名称),主要用于________(主要用途)。
该产品采用了先进的________技术,具有________特点,广泛适用于________领域。
它的发展历程________,在市场上取得了________的成绩,受到了广泛好评。
二、技术参数1. 外观尺寸:产品的长宽高分别为______mm × ______mm ×______mm,重量为______kg。
2. 电源要求:工作电压为______V,工作电流为______A,功率消耗为______W。
3. 性能参数:________(列举相关性能参数)。
4. 工作温度范围:______℃至______℃。
5. 存储温度范围:______℃至______℃。
6. 通信接口:________(列举通信接口类型)。
7. 其他重要参数:________。
三、功能特性1. ________功能:______(介绍功能特性)。
2. ________功能:______(介绍功能特性)。
3. ________功能:______(介绍功能特性)。
4. ________功能:______(介绍功能特性)。
5. ________功能:______(介绍功能特性)。
四、使用方法1. ________步骤:______(详细描述使用方法)。
2. ________步骤:______(详细描述使用方法)。
3. ________步骤:______(详细描述使用方法)。
4. ________步骤:______(详细描述使用方法)。
5. ________步骤:______(详细描述使用方法)。
五、注意事项1. 在使用过程中,请注意______(列举注意事项)。
2. 请使用标准电源适配器。
3. 请勿拆卸产品外壳,以免影响产品性能和安全。
TB67S109AFNG_datasheet_zh_cn_20140520
OUT_A+ OUT_AOUT_B+ OUT_BRSA RSB
VM 电源电压范围 10V(最小值)~47V(最大值)
OUTPUT 引脚电压 10V(最小值)~47V(最大值)
出于解释目的,可能简化等效电路图或忽略其中的一部分。
9
2013-11-05
译文
TB67S109AFTG/FNG
功能说明(步进电机) CLK 功能
请将 QFN 封装的四角引脚与外露垫安装到 PCB 的 GND 区域。 (顶视图)
OSCM
1
NC
2
CW/CCW
3
MO
4
DMODE1
5
NC
6
DMODE2
7
CLK
8
ENABLE
9
RESET
10
GND
11
NC
12
RSA
13
RSA
14
NC
15
OUTA+
16
OUTA+
17
NC
18
NC
19
GND
20
NC
21
OUTA-
功能
TB67S109AFTG/FNG
8
2013-11-05
译文
TB67S109AFTG/FNG
INPUT/OUTPUT 等效电路(TB67S109A)
引脚名称
IN/OUT 信号
DMODE0 DMODE1 DMODE2 CLK ENABLE RESET CW/CCW
数字输入(VIH/VIL)
VIH: 2.0V(最小值)~5.5V(最大值) VIL: 0V(最小值)~0.8V(最大值)
在切换 DMODE0,1,2 时,建议将 RESET 信号设置为低(这意味着将电角设置为初始状态)。
TD62084AFG中文资料
VCE = 2 V, IOUT = 275 mA
⎯
⎯
7.0
VCE = 2 V, IOUT = 350 mA
⎯
⎯
8.0
2 VCE = 2 V, IOUT = 350 mA
1000 ⎯
⎯
Ta = 25°C 6
Ta = 85°C
(Note) ⎯ (Note) ⎯
⎯
50
µA
⎯ 100
Clamp diode forward voltage Input capacitance Turn-on delay Turn-off delay
Test Circuit 1. ICEX
Open VIN
TD62081~084APG/AFG
Open
ICEX
2. VCE (sat), hFE
Open
IIN
IOUT
3. IIN (ON)
IIN (ON)
VCE
VCE, VCE (sat)
VIN
hFE =
IOUT IIN
Open Open
4. IIN (OFF)
123456789 I1 I2 I3 I4 I5 I6 I7 I8 GND
1
2006-06-13
元器件交易网
Schematics (each driver)
TD62081~084APG/AFG
TD62081APG/AFG Common
TD62082APG/AFG Common
−40 to 85 −55 to 150
Unit V
mA/ch V mA V mA
W
°C °C
2
2006-06-13
元器件交易网
AFGB40T65SQDN IGBT(集成高电压开关桥)说明书
AFGB40T65SQDNAFGB40T65SQDNIGBT for Automotive Applications, 650 V, 40 A, D2PAKFeatures•Maximum Junction Temperature: T J = 175°C•High Speed Switching Series•V CE(sat) = 1.6 V (Typ.) @ I C = 40 A•100% of the Part are Dynamically Tested (Note1)•AEC−Q101 Qualified•These Devices are Pb−Free and are RoHS CompliantTypical Applications•Automotive On Board Charger•Automotive DC/DC Converter for HEVABSOLUTE MAXIMUM RATINGS(T J= 25°C unless otherwise stated)Parameter Symbol Value Unit Collector to Emitter Voltage V CES650V Gate-to-Emitter Voltage V GES±20V Transient Gate-to-Emitter Voltage V GES±30V Collector Current − T C = 25°C I C80A Collector Current − T C = 100°C40A Pulsed Collector Current (Note2)I CM160A Diode Forward Current − T C = 25°C I F40A Diode Forward Current − T C = 100°C20A Pulsed Diode Maximum ForwardCurrent (Note2)I FM160AMaximum Power Dissipation −T C = 25°CP D238WMaximum Power Dissipation −T C = 100°C119WOperating Junction and StorageTemperatureT J, T stg−55 to 175°CStresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.1.V CC = 400V, V GE = 15V, I C = 120A, R G = 100W, Inductive Load.2.Repetitive rating: pulse width limited by max. Junction temperature.3.Surface−mounted on FR4 board using 1 in2pad size, 1 oz Cu pad.4.The entire application environment impacts the thermal resistance valuesshown, they are not constants and are only valid for the particular conditions noted.D2PAK−3CASE 418AJMARKING DIAGRAMDevice Package Shipping†ORDERING INFORMATIONAFGB40T65SQDN D2PAK800 Units /Tape & Reel BV CES V CE(sat) TYP I C MAX650 V 1.6 V160 AGG$Y= ON Semiconductor Logo&Z= Assembly Plant Code&3= 3-Digit Data Code&K= 2-Digit Lot Traceability Code AFGB40T65SQDN= Specific Device Code$Y&Z&3&KAFGB40T65SQDN†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.THERMAL CHARACTERISTICSParameter Symbol Max Unit Thermal Resistance Junction-to-Case, for IGBT R q JC0.63°C/W Thermal Resistance Junction-to-Case, for Diode R q JC 1.55 Thermal Resistance Junction-to-Ambient R q JA40ELECTRICAL CHARACTERISTICS (T C= 25°C unless otherwise stated)Parameter Symbol Test Condition Min Typ Max Unit OFF CHARACTERISTICSCollector to Emitter BreakdownVoltageBV CES V GE = 0 V, I C = 1 mA650−−VTemperature Coefficient ofBreakdown VoltageD V CES/D T J I C = 1 mA, Reference to 25°C−0.6−V/°C Collector Cut-Off Current I CES V CE= V CES, V GE= 0 V−−250m A G−E Leakage Current I GES V GE= V GES, V CE= 0 V−−±400nA ON CHARACTERISTICSGate Threshold Voltage V GE(th)V GE= V CE, I C= 40 mA 2.6 4.5 6.4V Collector to Emitter SaturationVoltageV CE(sat)I C= 40 A, V GE= 15 V, T C = 25°C− 1.6 2.1VI C= 40 A, V GE= 15 V, T C = 175°C− 1.92−V DYNAMIC CHARACTERISTICInput Capacitance C ies V CE= 30 V, V GE= 0 V, f = 1 MHz−2495−pF Output Capacitance C oes−50−Reverse Transfer Capacitance C res−9−SWITCHING CHARACTERISTICTurn-On Delay Time t d(on)V CC= 400 V, I C= 40 A, R G= 6 W,V GE= 15 V, Inductive Load,T C = 25°C −17.6−nsRise Time t r−19.2−ns Turn-Off Delay Time t d(off)−75.2−ns Fall Time t f−9.6−ns Turn-On Switching Loss E on−0.858−mJ Turn-Off Switching Loss E off−0.229−mJ Total Switching Loss E ts− 1.087−mJTurn-On Delay Time t d(on)V CC= 400 V, I C= 40 A, R G= 6 W,V GE= 15 V, Inductive Load,T C = 175°C −16−nsRise Time t r−22.4−ns Turn-Off Delay Time t d(off)−81.6−ns Fall Time t f−20.8−ns Turn-On Switching Loss E on− 1.14−mJ Turn-Off Switching Loss E off−0.484−mJ Total Switching Loss E ts− 1.624−mJ Total Gate Charge Qg V CE= 400 V, I C= 40 A, V GE= 15 V−76−nC Gate to Emitter Charge Qge−14−nC Gate to Collector Charge Qgc−17−nCELECTRICAL CHARACTERISTICS (T C= 25°C unless otherwise stated) (continued)SymbolMinTest ConditionMax Parameter UnitTypELECTRICAL CHARACTERISTIC OF THE DIODE (T J= 25°C unless otherwise stated)Diode Forward Voltage VFM I F = 20 A− 1.5 2.1V−22.3−m J Reverse Recovery Energy E rec I F = 20 AdI F/dt = 200 A/m s, T C = 25°CDiode Reverse Recovery Time t rr−131−ns Diode Reverse Recovery Charge Q rr−348−nC−100−m J Reverse Recovery Energy E rec I F = 20 AdI F/dt = 200A/m s, T C = 175°CDiode Reverse Recovery Time t rr−245−ns Diode Reverse Recovery Charge Q rr−961−nC Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.TYPICAL CHARACTERISTICS48121620481216200601234512345Figure 1. Typical Output Characteristics (255C)Figure 2. Typical Output Characteristics (1755C)Figure 3. Typical Saturation VoltageCharacteristics Figure 4. Saturation Voltage vs Case Temperatureat Variant Current LevelFigure 5. Saturation Voltage vs V GE (255C)Figure 6. Saturation Voltage vs V GE (1755C)6012018012345Collector −Emitter Voltage, V CE (V)C o l l e c t o r C u r r e n t , I C (A )Collector −Emitter Voltage, V CE (V)C o l l e c t o r C u r r e n t , I C (A )Collector −Emitter Voltage, V CE (V)C o l l e c t o r C u r r e n t , I C (A)11,21,41,61,822,22,42,62,8−Collector −Emitter Case Temperature, T C (5C)C o l l e c t o r −E m i t t e r V o l t a g e , V C E (V )Gate −Emitter Voltage, V GE (V)C o l l e c t o r −E m i t t e r V o l t a g e , V C E (V )Gate −Emitter Voltage, V GE (V)C o l l e c t o r −E m i t t e r V o l t a g e , V C E (V )TYPICAL CHARACTERISTICSFigure 7. Capacitance Characteristics Figure 8. Gate Charge CharacteristicsFigure 9. Turn −On Characteristics vs GateResistance Figure 10. Turn −Off Characteristics vs GateResistanceFigure 11. Turn −On Characteristics vs CollectorCurrent Figure 12. Turn −Off Characteristics vs CollectorCurrentCollect to Emitter Voltage, V CE (V)C a p a c i t a n c e (p F )Gate Charge, G g (nC)G a t e −E m i t t e r V o l t a g e , V G E (V )1101000369121510010********Gate Resistance, R G (W )S w i t c h i n g T i m e (n s )1100010********Gate Resistance, R G (W )S w i t c h i n g T i m e (n s )1010001100Collector Current, I C (A)S w i t c h i n g T i m e (n s )10255075100125150Collector Current, I C (A)S w i t c h i n g T i m e (n s )TYPICAL CHARACTERISTICSFigure 13. Switching Loss vs Gate Resistance Figure 14. Switching Loss vs Collector CurrentFigure 15. SOA Characteristics Figure 16. Forward CharacteristicsFigure 17. Reverse Recovery Current Figure 18. Reverse Recovery TimeGate Resistance, R G (W )S w i t c h i n g L o s s (m J )100100010000S w i t c h i n g L o s s (m J )Collector Current, I C (A)110100Collector − Emitter Voltage, V CE (V)C o l l e c t o r C u r r e n t , I C (A )110100012340Forward Voltage, V F (V)F o r w a r d C u r r e n t , I F (A )246810Forward Current, I F (A)R e v e r s e R e c o v e r y C u r r e n t , I r r (A )050100150200250300350400010203040Forward Current, I F (A)R e v e r s e R e c o v e r y T i m e , t r r (n s )TYPICAL CHARACTERISTICSFigure 19. Stored ChargeFigure 20. Transient Thermal Impedance of IGBTFigure 21. Transient Thermal Impedance of DiodeForward Current, I F (A)S t o r e d R e c o v e r y C h a r g e , Q r r (n C )02004006008001000120014000.010.101.00110Rectangular Pulse Duration (s)T h e r m a l R e s p o n s e (Z t h j c )0.010.101.000.11Rectangular Pulse Duration (s)T h e r m a l R e s p o n s e (Z t h j c )D 2PAK −3 (TO −263, 3−LEAD)CASE 418AJ ISSUE CDATE 03 OCT 2018DIM MIN MAX MIN MAX MILLIMETERSINCHES D 0.3300.3808.389.65E 0.3800.4209.6510.67A 0.1600.190 4.06 4.83b 0.0200.0390.510.99c20.0450.065 1.14 1.65e 0.100 BSC 2.54 BSC A10.0000.0100.000.25c 0.0120.0290.300.74L 0.0700.110 1.78 2.79H 0.5750.62514.6015.88L2−−−−0.070−−−− 1.781.DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.2.CONTROLLING DIMENSION: INCHES.3.CHAMFER OPTIONAL4.DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.005PER SIDE. THESE DIMENSIONS ARE MEASURED AT THE OUTERMOST EXTREMES OF THE PLAS-TIC BODY AT DATUM H.5.THERMAL PAD CONTOUR IS OPTIONAL WITHIN DIMENSIONS E, L1, D1 AND E1.E10.245−−−− 6.22−−−−L1−−−−0.066−−−− 1.68D10.260−−−− 6.60−−−−L30.010 BSC 0.25 BSC M−88−88°°°°VIEW A −AOPTIONAL CONSTRUCTIONSXXXXXXXXXXX AWLYWWGXXXXXX = Specific Device Code A = Assembly Location WL = Wafer Lot Y = Year WW = Work Week W = Week Code (SSG)M = Month Code (SSG)G = Pb −Free Package AKA = Polarity Indicator ICStandardXXXXXXXXG AYWW*This information is generic. Please refer to device data sheet for actual part marking.Pb −Free indicator, “G” or microdot “ G ”,may or may not be present. Some products may not follow the Generic Marking.RectifierAYWW XXXXXXXXG AKA*For additional information on our Pb −Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.RECOMMENDEDDIMENSIONS: INCHESSOLDERING FOOTPRINT*SSGXXXXXX XXYMWMECHANICAL CASE OUTLINEPACKAGE DIMENSIONSON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor theON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent PUBLICATION ORDERING INFORMATIONAFGB40T65SQDN。
TB6575FNG中文资料
SC 2 START 8 IP 9 FST 24 DC excitation control circuit Forced commutation frequency setting Maximum commutation frequency setting Lead angle setting Overcurrent protection 22 OC PWM generator 17 OUT_WP 14 OUT_UN 16 OUT_VN Timing control 18 OUT_WN
TB6575FNG
Pin Description
Pin No. 1 2 Symbol GND SC I/O ⎯ I Ground pin Connection pin for a capacitor to set a startup commutation time and duty cycle ramp-up time Select the polarity of transistors. High or open : High-side transistor = P-channel (active low) Low-side transistor = N-channel (active low) Low : High-side transistor = N-channel (active low) Low-side transistor = N-channel (active low) The pin has a pull-up resistor. Set an upper limit of the maximum commutation frequency. <Fst=Low> FMAX =High or Open , Maximum commutation frequency fMX = fXT/ (6 12 FMAX =Low , Maximum commutation frequency fMX = fXT/(6 × 2 ) <Fst=High or Middle> FMAX =High or Open , Maximum commutation frequency fMX = fXT/ (6 9 FMAX =Low , Maximum commutation frequency fMX = fXT/(6 × 2 ) The pin has a pull-up resistor. 2)
BAV56W-G中文资料
0 * % $ *,= = - > - - - ( ) ? *+*, "# = 6 / 9# "* * * " = - 0 - 8 -@AB ( ) ( ) 7=-4- 8- C 8 ( --& . ) # % : ,$* #: * D- C D- C元器件交易网110100100010,0000100200I ,L E A K A G E C U R R E N T (n A )R T ,JUNCTION TEMPERATURE (°C)Fig.2Leakage Current vs Junction Temperaturej 101.010010000.10.01012I ,I N S T A N T A N E O U S F O R W A R D C U R R E N T (m A )F V ,INSTANTANEOUS FORWARD VOLTAGE (V)Fig.1Forward CharacteristicsF元器件交易网元器件交易网SENSITRONSEMICONDUCTORTECHNICAL DATADISCLAIMER:1- The information given herein, including the specifications and dimensions, is subject to change without prior notice to improve productcharacteristics. Before ordering, purchasers are advised to contact the Sensitron Semiconductor sales department for the latest versionof the datasheet(s).2- In cases where extremely high reliability is required (such as use in nuclear power control, aerospace and aviation, traffic equipment,medical equipment, and safety equipment), safety should be ensured by using semiconductor devices that feature assured safety or bymeans of users’ fail-safe precautions or other arrangement.3- In no event shall Sensitron Semiconductor be liable for any damages that may result from an accident or any other cause duringoperation of the user’s units according to the datasheet(s). Sensitron Semiconductor assumes no responsibility for any intellectualproperty claims or any other problems that may result from applications of information, products or circuits described in the datasheets.4- In no event shall Sensitron Semiconductor be liable for any failure in a semiconductor device or any secondary damage resulting fromuse at a value exceeding the absolute maximum rating.5- No license is granted by the datasheet(s) under any patents or other rights of any third party or Sensitron Semiconductor.6- The datasheet(s) may not be reproduced or duplicated, in any form, in whole or part, without the expressed written permission ofSensitron Semiconductor.7- The products (technologies) described in the datasheet(s) are not to be provided to any party whose purpose in their application willhinder maintenance of international peace and safety nor are they to be applied to that purpose by their direct purchasers or any thirdparty. When exporting these products (technologies), the necessary procedures are to be taken in accordance with related laws andregulations.• 221 West Industry Court Deer Park, NY 11729-4681 (631) 586-7600 FAX (631) 242-9798 •• World Wide Web - • E-Mail Address - sales@ •。
гомдустру roduction EFPAU TEST NO说明书
感谢您购买 产品!请仔细阅读本手册,它将帮助你妥善设置并运行您的系统,使其发挥卓越的性能。
并保留这些说明以供日后参照。
警告:为了降低火灾与电击的风险,请不要将产品暴露在雨中或潮湿环境中。
警告:为了降低电击的风险,非专业人士请勿擅自拆卸该系统。
仅供专业人士操作。
等边三角形中的闪电标记,用以警示用户该部件为非绝缘体,系统内部存在着电压危险,电压。
可能足以引起触电。
可能足以引起触电如系统标有带惊叹号的等边三角形,则是为提示用户严格遵守本用户指南中的操作与维护规定。
注意:请勿对系统或附件作擅自的改装。
未经授权擅自改装将造成安全隐患。
警告:燃不得将明火源(如点的蜡烛)放在器材上面。
1. 请先阅读本说明。
2. 保留这些说明以供日后参照。
3. 注意所有警告信息。
4. 遵守各项操作指示。
5. 不要在雨水中或潮湿环境中使用本产品。
6. 不要将产品靠近热源安装,例如暖气管、加热器、火炉或其它能产生热量的装置(包括功放机 )。
7. 不要破坏极性或接地插头的安全性设置。
如果提供的插头不能插入插座,则应当请专业人员更换插座。
8. 保护好电源线和信号线,不要在上面踩踏或拧在一起(尤其是插头插座及穿出机体以外的部分 )。
9. 使用厂商规定及符合当地安全标准的附件。
10.雷电或长时间不使用时请断电以防止损坏产品。
12. 不要让物体或液体落入产品内——它们可能引起火灾或触电。
13. 请注意产品外罩上的相关安全标志。
. 仅与厂商指定或与电器一同售出的推车、架子、三脚架、支架或桌子一起使用。
推动小车/电器时,应谨防翻倒。
11注意事项产品的安装调试须由专业人士操作。
在使用非本厂规定的吊装件时,要保证结构的强度并符合当地的安全规范。
警告:1扬声器及扬声器系统的产品有限保修期为自正式购买日起的3年。
由于用户不合理的应用而导致音圈烧毁或纸盆损坏等故障,不包含于产品保修项目。
产品吊附件(包括音箱装配五金件和吊挂配件)的有限保修期为自正式购买日起的1年。
TB62726AFG资料
TOSHIBA Bi-CMOS Integrated Circuit Silicon MonolithicTB62726ANG,TB62726AFG16-bit Constant-Current LED Driver with Operating Voltage of 3.3-V and 5-VThe TB62726A series are comprised of constant-current drivers designed for LEDs and LED displays. The output current value can be set using an external resistor.As a result, all outputs will have virtually the same current levels.This driver incorporates 16-bit constant-current outputs, a 16-bit shift register, a 16-bit latch and a 16-bit AND-gate circuit. These drivers have been designed using the Bi-CMOS process. The suffix (G) appended to the part number represents a Lead(Pb)-Free product.Features• Output current capability and number of outputs:90 mA × 16 outputs • Constant current range: 2 to 90 mA• Application output voltage: 0.7 V (output current 2 to 80 mA)0.4 V (output current 2 to 40 mA) • For anode-common LEDs• Input signal voltage level: 3.3-V and 5-V CMOS level (Schmitt trigger input) • Power supply voltage range V DD = 3.0 to 5.5 V • Maximum output terminal voltage: 17 V • Serial and parallel data transfer rate: 20 MHz (max, cascade connection)• Operating temperature range T opr = −40 to 85°C • Package: Type ANG: SDIP24-P-300-1.78Type AFG: SSOP24-P-300-1.00B • Current accuracy (All output ON)Current AccuracyOutput VoltageBetween BitsBetween ICsOutput Current > =0.4 V ±15% 2 to 5 mA > =0.7 V±4%±12%5 to 80 mATB62726ANGTB62726AFGWeightSDIP24-P-300-1.78: 1.22 g (typ.) SSOP24-P-300-1.00B: 0.32 g (typ.)Pin Assignment (top view)Warnings: Short-circuiting an output terminal to GND or to the power supply terminal may broken the device.Please take care when wiring the output terminals, the power supply terminal and the GND terminals.Block DiagramTruth TableNote 1: OUT0 to OUT15= On when Dn = H; OUT0 to OUT15= Off when Dn = L.In order to ensure that the level of the power supply voltage is correct, an external resistor must be connected between R-EXT and GND.LATCH OUT0OUT1OUT3DD ENABLE OUT15OUT14OUT13OUT12OUT4OUT5OUT6OUT7OUT11OUT10OUT9 OUT8LATCH OUT0ENABLETiming DiagramWarning: Latch circuit is leveled-latch circuit. Be careful because it is not triggered-latch circuit.Note 2: The latches circuit holds data by pulling the terminalLow. And, when terminal is a High level, latch circuit doesn’t hold data, and it passes from the input to the output.When ENABLE terminal is a Low level, output terminal OUT0 to OUT15 respond to the data, and on and off does.And, when ENABLE terminal is a High level, it offs with the output terminal regardless of the data.SERIAL-INLATCHCLOCKOUT0OUT1OUT3SERIAL-OUTENABLEOUT153.3 V/5 V0 V3.3 V/5 V0 V 3.3 V/5 V0 V3.3 V/5 V 0 V OnOff OnOff OnOffOn Off 3.3 V/5 V0 VTerminal DescriptionEquivalent Circuits for Inputs and Outputs1. ENABLE terminal2. LATCH terminal3. CLOCK, SERIAL-IN terminal4. SERIAL-OUT terminal5. OUT0 to OUT15 terminalsV ENABLE V OUT0 to OUT15Absolute Maximum Ratings (T opr = 25°C)Characteristics Symbol Rating UnitSupply voltage V DD 6 V Input voltage V IN −0.2 to V DD + 0.2VOutput current I OUT +90 mA/ch Output voltageV OUT −0.2 to 17 VANG-type(when not mounted)1.25 ANG-type (on PCB)P d11.78 AFG-type(when not mounted) 0.83 Power dissipation (Note 3) AFG-type (on PCB) P d21.00 W ANG-type(when not mounted)104 ANG-type (on PCB)R th (j-a) 1 70 AFG-type(when not mounted) 140 Thermal resistance (Note 3) AFG-type (on PCB)R th (j-a) 2 120°C/W Operating temperature T opr −40 to 85 °C Storage temperatureT stg −55 to 150°CNote 3: ANG-Type: Powers dissipation is derated by 14.28 mW/°C if device is mounted on PCB and ambienttemperature is above 25°C.AFG-Type: Powers dissipation is derated by 6.67 mW/°C if device is mounted on PCB and ambient temperature is above 25°C.With device mounted on glass-epoxy PCB of less than 40% Cu and of dimensions 50 mm × 50 mm × 1.6 mm.Recommended Operating Conditions (T opr = −40°C to 85°C unless otherwise specified)Note 4: When the pulse of the Low level is inputted to the ENABLE terminal held in the High level.Electrical Characteristics (T opr= 25°C, V DD= 3.0 V to 5.5 V unless otherwise specified)Switching Characteristics (T opr = 25°C unless otherwise specifed )Conditions: (Refer to test circuit.)T opr = 25°C, V DD = V IH = 3.3 V and 5 V, V OUT = 0.7 V, V IL = 0 V, R EXT = 490 Ω, V L = 3.0 V, R L = 60 Ω, C L = 10.5 pFNote 5: If the device is connected in a cascade and t r /t f for the waveform is large, it may not be possible to achievethe timing required for data transfer. Please consider the timings carefully.Test CircuitV DD = V IH = 3.3 V V IL = 0 V t r = t f = 10 ns (10% to 90%)V LTiming Waveforms1. CLOCK, SERIAL-IN, SERIAL-OUT2. CLOCK, SERIAL-IN, LATCH , ENABLE , OUTn3. OUTnSERIAL-INCLOCKSERIAL-OUTSERIAL-INCLOCKpHL3LH3ENABLELATCHOUTnOUTnOutput Current – Duty (LEDS turn-on rate)Output Current – R EXT ResistorDUTY – Turn On Rate (%)I O U T (m A )DUTY – Turn On Rate (%)I OUT – DUTY On PCBI O U T (m A )I OUT – DUTY On PCBDUTY – Turn On Rate (%)I O U T (m A )I OUT – DUTY On PCBAmbient temperature Ta (°C)P d – T oprP o w e r d i s s i p a t i o n P D (W /I C )R EXT (Ω)I O U T (m A )I OUT – R EXT0 20 40 60 80 100 0 20 40 60 80 1002006-06-1410A p p l i c a t i o n C i r c u i t (e x a m p l e 1): T h e g e n e r a l c o m p o s i t i o n i n s t a t i c l i g h t i n g o f L E D .M o r e t h a n V L E D (V ) ≥ V f (t o t a l m a x ) + 0.7 i s r e c o m m e n d e d w i t h t h e f o l l o w i n g a p p l i c a t i o n c i r c u i t w i t h t h e L E D p o w e r s u p p l y V L E D .r 1: T h e s e t u p r e s i s t a n c e f o r t h e s e t u p o f o u t p u t c u r r e n t o f e v e r y I C . r 2: T h e v a r i a b l e r e s i s t a n c e f o r t h e b r i g h t n e s s c o n t r o l o f e v e r y L E D m o d u l e .V L E D2006-06-1411A p p l i c a t i o n C i r c u i t (e x a m p l e 2): W h e n t h e c o n d i t i o n o f V L E D i s V L E D > 17 VT h e u n n e c e s s a r y v o l t a g e i s o n e e f f e c t i v e t e c h n i q u e a s t o m a k i n g t h e v o l t a g e d e s c e n d w i t h t h e z e n o r d i o d e .V L E D > 17 V2006-06-1412A p p l i c a t i o n C i r c u i t (e x a m p l e 3): W h e n t h e c o n d i t i o n o f V L E D i s V f +0.7 < V L E D < 17 VV O U T = V L E D -V f = 0.7 t o 1.0 V i s t h e m o s t s u i t a b l e f o r V O U T . S u r p l u s V O U T c a u s e s a n I C f e v e r a n d t h e u s e l e s s c o n s u m p t i o n e l e c t r i c p o w e r . I t i s t h e o n e w a y o f b e i n g e f f e c t i v e t o b u i l d i n t h e r 3 i n t h i s p r o b l e m . r 3 c a n m a k e a c a l c u l a t i o n t o t h e f o r m u l a r 3 Ω = s u r p l u s V O U T /I O U T . T h o u g h t h e r e s i s t a n c e p a r t s i n c r e a s e , t h e f i x e d c o n s t a n t c u r r e n t p e r f o r m a n c e i s k e p tV L E D = 15 VNotes• Operation may become unstable due to the electromagnetic interference caused by the wiring and other phenomena.To counter this, it is recommended that the IC be situated as close as possible to the LED module.If overvoltage is caused by inductance between the LED and the output terminals, both the LED and the terminals may suffer damage as a result.• There is only one GND terminal on this device when the inductance in the GND line and the resistor are large, the device may malfunction due to the GND noise when output switchings by the circuit board pattern and wiring.To achieve stable operation, it is necessary to connect a resistor between the REXT terminal and the GND line.Fluctuation in the output waveform is likely to occur when the GND line is unstable or when a capacitor (of more than 50 pF) is used.Therefore, take care when designing the circuit board pattern layout and the wiring from the controller.• This application circuit is a reference example and is not guaranteed to work in all conditions.Be sure to check the operation of your circuits.• This device does not include protection circuits for overvoltage, overcurrent or overtemperature.If protection is necessary, it must be incorporated into the control circuitry.• The device is likely to be destroyed if a short-circuit occurs between either of the power supply pins and any of the output terminals when designing circuits, pay special attention to the positions of the output terminals and the power supply terminals (V DD and V LED), and to the design of the GND line.Package DimensionsWeight: 1.22 g (typ.)Package DimensionsWeight: 0.32 g (typ.)Notes on Contents1. Block DiagramsSome of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes.2. Equivalent CircuitsThe equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.3. Timing ChartsTiming charts may be simplified for explanatory purposes.4. Application CircuitsThe application circuits shown in this document are provided for reference purposes only.Thorough evaluation is required, especially at the mass production design stage.Toshiba does not grant any license to any industrial property rights by providing these examples ofapplication circuits.5. Test CircuitsComponents in the test circuits are used only to obtain and confirm the device characteristics. Thesecomponents and circuits are not guaranteed to prevent malfunction or failure from occurring in theapplication equipment.IC Usage ConsiderationsNotes on Handling of ICs(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not beexceeded, even for a moment. Do not exceed any of these ratings.Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may resultinjury by explosion or combustion.(2) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in caseof over current and/or IC failure. The IC will fully break down when used under conditions that exceedits absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noiseoccurs from the wiring or load, causing a large current to continuously flow and the breakdown canlead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown,appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required.(3) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into thedesign to prevent device malfunction or breakdown caused by the current resulting from the inrushcurrent at power ON or the negative current resulting from the back electromotive force at power OFF.IC breakdown may cause injury, smoke or ignition.Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable,the protection function may not operate, causing IC breakdown. IC breakdown may cause injury,smoke or ignition.(4) Do not insert devices in the wrong orientation or incorrectly.Make sure that the positive and negative terminals of power supplies are connected properly.Otherwise, the current or power consumption may exceed the absolute maximum rating, andexceeding the rating(s) may cause the device breakdown, damage or deterioration, and may resultinjury by explosion or combustion.In addition, do not use any device that is applied the current with inserting in the wrong orientation orincorrectly even just one time.(5) Carefully select external components (such as inputs and negative feedback capacitors) and loadcomponents (such as speakers), for example, power amp and regulator.If there is a large amount of leakage current such as input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low inputwithstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC that inputs output DC voltage to a speaker directly.Points to Remember on Handling of ICs(1) Heat Radiation DesignIn using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiationdesign can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheralcomponents.(2) Back-EMFWhen a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor power supply and output pins might be exposed to conditions beyondabsolute maximum ratings. To avoid this problem, take the effect of back-EMF into consideration insystem design.About solderability, following conditions were confirmed• Solderability(1) Use of Sn-37Pb solder Bath· solder bath temperature = 230°C· dipping time = 5 seconds· the number of times = once· use of R-type flux(2) Use of Sn-3.0Ag-0.5Cu solder Bath· solder bath temperature = 245°C· dipping time = 5 seconds· the number of times = once· use of R-type fluxRESTRICTIONS ON PRODUCT USE060116EBA •The information contained herein is subject to change without notice. 021023_D•TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property.In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. 021023_A• The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk. 021023_B•The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q•The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others.021023_C•The products described in this document are subject to the foreign exchange and foreign trade laws. 021023_E。
泰勒顿组件产品目录索引说明书
SK9458
N/A
SK9459
Thompson Components
SK9459
Thomson
SK9460
Thomson
SK9461
Thompson Components
SK9461
Thomson
SK9462
Thomson
SK9463
Thompson Components
SK9463
Thomson
SK9464
SK9478
Thompson Components
SK9478
Thomson
SK9479
Thompson Components
SK9479
Thomson
SK9480
Thompson Components
ห้องสมุดไป่ตู้
SK9480
Thomson
SK9481
Thompson Components
SK9481
Thomson
SK9474
Thompson Components
SK9474
Thomson
SK9475
Thompson Components
SK9475
Thomson
SK9476
Thompson Components
SK9476
Thomson
SK9477
Thompson Components
SK9477
Thomson
Bipolar Transistor Selection Guide /SK9466-datasheet.html QUOTE
Si NPN Power HF BJT
/SK9466-datasheet.html QUOTE
杰尼奥电子 KDL-65W5100 65英寸类BRAVIA W系列LED电视产品说明书
Key Features16:9 Full HD 1080p Resolution Panel(1920x1080)Motionflow™ 120Hz technologyBRAVIA® Internet Video 3BRAVIA® WidgetsBRAVIA Engine™ 3 fully digital video processor USB with photos, music, and videoDLNA support for photos, music, and video®TV Guide Interactive Program Guide ®HD input x 7Xross Media Bar™ w/ enhanced 3D favorites menuScene SelectBravia Link module compatible ®Key Technologies16:9 Full HD 1080p Resolution Panel (1920x1080) 16:9 Full HD 1080p resolution panel (1920x1080)accepts virtually any high definition video signal and renders it with optimum resolution, so you can take full advantage of Blu-ray Disc™ players and Sony PlayStation 3 entertainment systems that can deliver 1080p content.® ® Motionflow™ 120Hz technology Engineered for fast-action sports, movies and games, Motionflow120Hz technology reduces blurriness and judder. Overall, motion is smoother, sharper, and morenatural when watching your favorite HD content, DVDs, and even broadcast movies and prime-timeprogramming.BRAVIA™ Internet Video With BRAVIA Internet Video you can enjoy select premium and free on-demand entertainment directly to your HDTV. Use your in-home broadband connection and theBRAVIA HDTV remote control to access online video, music, and more content from over 20 providers including Amazon Video On Demand, YouTube™, Sports Illustrated, Sony Pictures, Sony Music, Slacker and .3 BRAVIA Internet Widgets Personalize your viewing experience by selecting, positioning, andresizing widgets on your BRAVIA HDTV display. BRAVIA Internet Widgets are small applications that can be accessed with the touch of one button providing you with the latest in news, weather, stock info, and much more right on your BRAVIA W-Series HDTV.® BRAVIA Engine™ 3 fully digital video processor BRAVIA Engine 3 is the newest fully digital videoprocessor from Sony . It uses a collection of enhanced algorithms to significantly reduce noise,enhance overall image detail, and optimize contrast so every scene produces sharp, vibrant, life-like images.® USB with photos, music, and video Connect your compatible camera, USB-enabled MP3 player, orUSB storage device directly to the HDTV's USB input to view photos on the big screen or listen to your favorite MP3s. BRAVIA W-series HDTVs also include mpeg2 video file support, so you can go straight from shooting video to screening it via USB.® DLNA® with photos, music, and video Compliance with DLNA (Digital Living Network Alliance)allows BRAVIA W-series HDTVs to access digital photos, music, and video from DLNA-enabled PCs and other devices, so you can enjoy your memories with family and friends in the comfort of your living room instead of crowding around a PC.®Sony Electronics Inc. • 16530 Via Esprillo • S an Diego, CA 92127 • 1.800.222.7669 • w Last Updated: 10/07/2009Please visit the Dealer Network for currentinformation at /dnFeaturesGeneralClosed Captions (CC): Analog, Digital On-Screen Display: 3D XMB Illuminated Sony Logo: YesFinish (Surface Color): Bezel - Iridescent SilverSupports Rear Mounting of DMeX™ Module: Yes Demo Mode: YesBRAVIA® Link Module support: DMX-SW1, DMX-CT1, DMX-DVD, DMX-WL1DisplayBacklight Type: CCFL Display Device: LCDVideoVideo Processing: BRAVIA Engine 3™ TechnologyCineMotion® Reverse 3:2 Pulldown Technology: Yes Direct Mode: Yes Game Mode: YesWide Mode: Wide Zoom, Normal, Full (Full1-2 for PC), H Stretch, Zoom Deep Color: Yes 3D Comb Filter: YesMPEG Noise Reduction: Yes Auto Wide: Yes 4:3 Default: Yes24p True Cinema™ Technology: YesPicture Mode: Vivid, Standard, Custom, Cinema, Sports, Game, Graphics, Photo-Vivid, Photo-Standard, Photo-Original, Photo-CustomAdvanced Contrast Enhancer (ACE): Yes Motionflow™ Technology: 120 HzAudioDigital Amplifier: S-Master Digital Amplifier Voice Zoom: Yes Auto SAP: YesAuto Mute (on no signal): YesSteady Sound® Automatic Volume Control: Yes Audio Out: Variable/FixedSony Original Surround: S-Force Stereo System: MTS Dolby®: Dolby DigitalAlternate Audio (Digital): YesSurround Effect: Sports, Music, Cinema, Game Sound Booster: Yes5.1 Channel Audio Out: YesSound Mode: Dynamic, Standard, Clear Voice, Custom 5.1ch Through Out (Handycam): Yes Sound Enhancer: YesConvenienceChannel Jump: YesFavorite Channel: YesMultiple Language Display: English, French, Spanish Info Banner: TV Guide on Screen, PSIP, XDS Sleep Timer: YesInput Skip: Automatic Channel Surf: YesRemote Control: RM-YD027Channel Block (with password): Yes Edit Channel Labels: Yes Label Inputs: Yes ID-1 Detection: Yes On/Off Timer: YesUSB Application(s): Music Player (mp3), Photo Viewer (jpeg), Video Player (mpeg2 TS/PS) Theatre Mode (Theatre Button): Yes Show/Hide Channels: Yes BRAVIA® Sync™: Yes Parental Control: YesBRAVIA® Sync™ Menu Button: Yes (on Remote Control)On-Screen Display for External Input: Yes Channel Labels: Yes Program Block: YesControl for HDMI™ (HDMI™ CEC): Yes Auto Photo Mode: Yes (DLNA, USB) On-Screen Clock: YesAuto Picture Setting w/HDMI™: Game, Graphics, Photo, CinemaInternet Radio: YesScene Select: Cinema, Sports, Photo, Music, Game, Graphics, General, AutoTheatre Mode with Cinema Surround: Yes Start Up BRAVIA® Logo Display: Yes Favorites Menu: GraphicTV Guide On-Screen: Yes(Gemstar ver.10)Picture Adjustments Lock (For Americas): Yes White Balance (For Americas): RGB Gain/BiasNetworkDLNA: Client (Photo), Client (Music), Client (Video) BRAVIA® Internet Video: Yes BRAVIA® Internet Widgets: YesSpecificationsGeneralTelevision Type: Flat Panel LCD HDTVDisplayViewing Angle (Right/Left): 178 (89/89) Viewing Angle (Up/Down): 178 (89/89) On-screen Contrast Ratio: 2,000:1 Dynamic Contrast Ratio: 50,000:1Screen Size (measured diagonally): 64.5" Native Resolution: 1920 x 1080Display Resolution: 1920 x 1080p (Full HD) Panel Bit: 8-bitAspect Ratio: 16:9Color Range (u'v'): 90% of NTSC Color Range (xy): 72% of NTSCTV SystemTuner (Cable): Clear QAMTuner (Terrestrial): ATSC / NTSC Channel Coverage: VHF: 2-13 UHF: 14-69CATV (analog): 1-135 CATV (digital) : 1-135 TV System (Analog): MNumber of Tuners (Analog): 1Number of Tuners (Digital): 1(Hybrid) TV System (Digital): ATSC Color System: NTSC 3.58VideoVideo Signal: 1080/60p (HDMI™ / COMPONENT), 1080/60i, 1080/24p (HDMI™ ONLY), 720/60p, 480/60p, 480/60iAudioAudio Power Output: 20W (10W+10W) Speakers (Total): 4Speaker Configuration: Invisible Speaker + TweeterInputs and OutputsComponent Video (Y/Pb/Pr ) Input(s): 2 (Rear) (1 fixed/1 selectable)Composite Video Input(s): 2 (1 Side/1 Rear - selectable) Digital Audio Output(s): Optical Digital Output - 1 (Rear) RF Connection Input(s): 1 (Rear) S-Video Input(s): 1 (Side)Analog Audio Input(s) (Total): 3 (1 Side/2 Rear) Audio Out: 1 (Rear)HDMI™ Connection(s) (Total): 4 (3 Side/1 Rear)PC In (D-Sub) + Audio In (Stereo Mini): 1 (Side) see owner's manual for supported timings USB 2.0: 1 (Side)HDMI™ PC Input: Yes (see owner's manual for supported timings) S-Video Detection: Yes AC Power Input: 1 (Rear)Ethernet Connection(s): 1 (Rear)Analog Audio Input(s) for HDMI™: 1 (Rear) USB 1.1: 1 (Rear) for DMe / Service onlyPowerPower Consumption (in Standby): Less than 0.1W (120VAC)Less than 0.3W (240VAC)Power Requirements (voltage): AC 120-240V Power Requirements (frequency): 50/60HzPower Consumption (in Operation) max.: 430 W (max) Power Consumption (in Download Acquisition Mode): Less than 22WRegulation and Standard ComplianceVESA® Hole Spacing Compatible: Yes VESA® Hole Pitch: 400x300 M6Service and Warranty InformationLimited Warranty Term: 1 Year Labor / 1 Year Parts Online Instruction Manual (Reference Book): YesEnergy Saving & EfficiencyLightSensor™ Technology: Yes Power Saving Modes: YesEnergy Star® compliant: Exceeds Energy Star Version 3.0 by at least 15% Eco Settings: YesDynamic Backlight Control: Yes Backlight Off Mode: YesPC Power Management: YesEstimated Annual Energy Consumption (kWh): 594 kWhr Idle TV Standby: YesPower Consumption (On Mode) for Energy Star: 325.0 W Power Consumption (Standby Mode) for Energy Star: 0.1 WRecycled & Recyclable MaterialsPackaging Materials: Recycled Carton (more than 40%) Printed Materials: Recycled PaperLEDHD Indicator: YesDimensionsWeight: 126.3 lbs. (56.1kg) with pedestal; 107.5 lbs. (48.8kg) without pedestalMeasurements: 61 x 40 x 16 3/4 in (1549 x 1014 x 423mm) with pedestal; 61 x 37 7/8 x 4 5/8 in (1549 x 960 x 115mm) without pedestalSupplied AccessoriesRemote Control RM-YD027 Batteries (Type AA x2)AC Power Cord (separate) Operating Instructions Quick Setup Guide Warranty CardTable Top Stand (attached)Optional AccessoriesSU-WL500 Wallmount Bracket BRAVIA DVD Link BRAVIA Input Link BRAVIA Wireless Link UPC Code: 027*********1. Works with other BRAVIA Sync™ or Theatre SyncTM labeled home audio/video products when connected via HDMI.2. Limited to resolutions supported by both the PC and the Sony HDTV. For supported resolutions, see Sony TV user's manual and PC documentation.3. Video quality and picture size will vary depending on your broadband connection speed (we recommend at least 2.5Mbps and 10Mbps for HD content) and the content itself. Select content provided and subject to change. © 2009 Sony Electronics Inc. All rights reserved. Reproduction in whole or in part without written permission is prohibited. Sony, HDNA, BRAVIA, BRAVIA Engine, BRAVIA Sync, Cybershot, DMex, Handycam, Motionflow, 24p True Cinema, Xross Media Bar, and their respective logos are trademarks of Sony. PlayStation is a trademark of Sony ComputerEntertainment Inc. HDMI, the HDMI logo and High-Definition Multimedia Interface are trademarks of HDMI Licensing LLC. Energy Star and the Energy Star mark are registered U.S. marks. Blu-ray Disc is a trademark. TV Guide is a trademark of TV Guide Magazine Group, Inc. All other trademarks are trademarks of their respective owners. Features and specifications are subject to change without notice. Non-metric weights and measures are approximate.Lamp in this product contains mercury. Disposal of these materials may be regulated due to environmental considerations. For disposal or recycling information, please contact your local authorities or the Electronic Industries Alliance ().® ®。
Hisense 65A6GV 4K 智能电视产品介绍 说明书
4K Smart TVModel:65A6GVAll product,product specifications, and data are subject to change without notice to improve reliability,function, design or otherwise. ©2019Hisense Canada Co., Ltd.All rights reserved WORKS WITH GOOGLE ASSISTANTWith four times more pixels(8.3million)than standard high-definition TV’s,the Hisense A6Series4K Ultra HD Smart TV is built to deliver bright colors and rich contrast in a slim-bezel frame.Dolby Vision HDR*technology maximizes brightness,the UHD Upscaler brings lower resolution content as close to4K as possible,and Motion Rate120keeps up with the fastest sports,movies and4K gaming.This series also comes with tons of built-in apps via the Hisense Smart Platform(VIDAA OS),making it easier than ever to personalize your entertainment experience.Wirelessly connect a soundbar or headphones to enhance your audio experience with Bluetooth Audio.ALLM allows the ideal latencysetting to automatically adjust,allowing for smooth, lag-less,and uninterrupted interactionwith your TV. ALLM allows yourconnected gaming console, orcomputer to send a signal to theTV which makes it switch to alow-latency, low-lag mode forgaming.Grab your High-Speed HDMI cableand experience all that HDMI 2.0 hasto offer. Higher resolutions, higherframe rates and more bandwidth arejust a few of the things that allowgamers to take advantage of newgraphics features on some of the nextgen gaming consoles. Game at 4K upto 120 fps (on supported panels).HDMI 2.0 offers support for VRR andALLM giving you a more simplifiedconnection between your TV andconnected devices.Dolby Vision™& HDR10 are cinema-inspired technology that add ultravivid imaging, brightness, contrast,colour and detail that bringsentertainment to life right before youreyes. The Hisense A6GV Series TVtransforms your viewing experienceby combining these two technologieswith impressive 4K picture quality.Technology is a versatile advancedpost-processing package thatcreates an immersive audioexperience that includespsychoacoustic bassenhancements and multichannelvirtual surround sound. Experiencemore lifelike, multidimensionalaudio on your Hisense 65A6GV.HDMITECHNICAL SPECIFICATIONS DISPLAYActual screen size(diagonal)64.5”Screen class65”Screen type FlatTYPE OF TVSmart TV / operatingsystemYes / VIDAA OSBuilt-in Apps YesWeb Browser YesWorks with Amazon Alexa Alexa Built-inWorks with GoogleAssistantYesPICTURE QUALITYScreen resolution3840 x 2160Local Dimming No4K Upscaler YesMotion Rate | Responsetime120 | 8msAspect Ratio16:09*HDR Dolby Vision/HDR10 Backlight Type Source Full ArrayAuto Low Latency Mode YesAUDIOAudio output power(Watts)10W x 2Audio technologies DTS Virtual:X LANGUAGESOn-Screen Display English/French/Spanish CONNECTIVITYWiFi Built-in802.11 ac -Dual band (2.4/5 GHz)Ethernet YesBluetooth®YesPORTSHDMI 3 x HDMI 2.0 inputs Ethernet (LAN)1USB 2 x USB 2.0RF Antenna1Digital Audio Output 1 x Optical Headphone/Audio Output1OTHER FEATURESNoise Reduction Digital Noise ReductionParental Control YesClosed Caption YesSleep Timer YesWALL MOUNTVESA400 x 300mm ACCESSORIESRemote Yes (Voice Remote) Battery2Quick Start Guide and/orUser ManualQuick Start Guide (UserManual is available online) Power Cable YesPOWERPower Consumption160WStandby Consumption<0.5WPower Supply(Voltage/Hz)AC 120, 60Hz DIMENSIONS/WEIGHTTV Dimension (Without thestand)57.2”W x 32.8”H x 2.9”D TV Dimension (With thestand)57.2”W x 35.3”H x 11.5”D TV Net Weight36.8 lbsCarton Dimensions63.1”W x 39.2”H x 7.0”D Shipping Weight56.9 lbsWARRANTY/UPCWarranty 1 year (carry-in)UPC Code888143010991Product specifications and data are subject to change without notice.Hisense Canada Co., Ltd2283 Argentia Rd, Suite 16, Mississauga ON,L5N 5Z21-855-344-7367*HDR viewing experience will vary by model,content availability and Internet connection.。
泰尔富G型说明书
2.2.3 主回路端子的接线..................................................................................................... 20
5 TECH.FULL
目录
2.2.4 控制回路端子的接线................................................................................................ 23
1.2.4 产品型号说明 ........................................................................................................ 11
1.3 产品外观............................................................................................................................ 12
1.4 变频器标准规格 ................................................................................................................ 12
戴尔B5465dnf激光多功能一体机用户手册说明书
Dell B5465dnf 雷射多功能複合機用戶手冊2012 年 7 月 | 商標本文件所載資訊若有異動應以異動之文件為準,不再另行通知。
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目錄安全資訊 (8)瞭解印表機 (10)尋找印表機相關資訊 (10)選取印表機放置地點 (11)印表機配置 (12)瞭解掃描器的基本功能 (14)使用自動送件器和掃描器玻璃面板 (15)瞭解印表機控制面板 (16)使用印表機控制面板 (16)瞭解指示燈和「睡眠」按鈕指示燈的顏色 (16)瞭解主畫面 (17)使用觸控式螢幕按鈕 (19)設定及使用主畫面應用程式 (21)尋找印表機的 IP 位址 (21)尋找電腦的 IP 位址 (21)存取 Embedded Web Server(內嵌式 Web 伺服器) (22)自訂主畫面 (22)瞭解不同的應用程式 (22)啟動主畫面應用程式 (23)尋找主畫面應用程式相關資訊 (23)設定 Forms and Favorites(表單與喜好項目) (23)設定 Card Copy(證件複印) (24)使用 MyShortcut(我的快捷鍵) (24)設定多點傳送 (25)設定 Scan to Network(掃描至網路) (25)設定 Remote Operator Panel(遠端操作面板) (26)匯出及匯入配置 (27)其他印表機設定 (28)安裝內接式選購品 (28)可用的內接式選購品 (28)存取控制板 (29)安裝記憶卡 (32)安裝選購卡 (34)安裝內部解決方案連接埠 (35)安裝印表機硬碟 (41)移除印表機硬碟 (45)安裝硬體選購品 (46)安裝順序 (46)安裝選購性紙匣組件 (47)連接電纜 (49)設定印表機軟體 (51)安裝印表機軟體 (51)更新印表機驅動程式中的可用選項 (52)網路功能 (53)準備將印表機安裝在乙太網路上 (53)在乙太網路上安裝印表機 (53)準備將印表機安裝在無線網路上 (55)使用「無線設定精靈」連接印表機 (55)利用 Wi-Fi Protected Setup (WPS),將印表機連接到無線網路 (56)利用 Embedded Web Server(內嵌式 Web 伺服器)將印表機連接到無線網路 (57)在安裝新的網路「內部解決方案連接埠」之後變更連接埠設定 (58)設定序列列印 (59)驗證印表機設定 (60)列印功能表設定頁 (60)列印網路設定頁 (60)載入紙張和特殊材質 (61)設定紙張尺寸和類型 (61)配置 Universal(通用尺寸)紙張設定 (61)載入 550 張紙匣組件 (61)載入 2100 張紙匣組件 (67)將材質載入多用途送紙器 (73)連結及解除連結紙匣組件 (77)連結及解除連結紙匣組件 (77)建立紙張類型的自訂名稱 (78)指定自訂紙張類型 (78)紙張和特殊材質指南 (80)紙張指引 (80)紙張特性 (80)選取紙張 (81)選取預印紙張規格和信頭紙 (81)使用再生紙和其他辦公室紙張 (81)存放紙張 (82)支援的紙張尺寸、類型和重量 (83)支援的紙張尺寸 (83)支援的紙張類型和重量 (84)列印 (85)列印表單和文件 (85)從快閃儲存碟列印 (86)使用特殊材質 (88)列印機密工作和其他保留工作 (90)列印資訊頁 (92)取消列印工作 (92)複印 (93)進行複印 (93)複印相片 (94)複印在特殊材質上 (94)自訂複印設定 (95)在複印文件上放置資訊 (101)取消複印工作 (102)瞭解複印選項 (102)以電子郵件寄送 (106)設定印表機電子郵件功能 (106)建立電子郵件快捷鍵 (107)以電子郵件寄送文件 (108)自訂電子郵件設定 (109)取消電子郵件 (110)瞭解電子郵件選項 (110)傳真 (113)設定印表機傳真功能 (113)傳送傳真 (127)建立快捷鍵 (130)自訂傳真設定 (130)取消外送的傳真 (132)保留與轉發傳真 (132)瞭解傳真選項 (133)掃描 (136)使用 Scan to Network(掃描至網路) (136)掃描至 FTP 位址 (136)掃描至電腦或快閃儲存碟 (138)瞭解掃描選項 (141)瞭解印表機功能表 (144)功能表清單 (144)Paper menu(紙張功能表) (145)Reports Menu(報告功能表) (156)Network/Ports menu(網路/連接埠功能表) (157)Security menu(安全性功能表) (170)Settings menu(設定功能表) (175)Help menu(說明功能表) (217)節省金錢並注重環保 (219)節省紙張和碳粉 (219)使用再生紙 (219)節省耗材 (219)省電 (219)使用 Eco-Mode(經濟省電模式) (219)降低印表機噪音 (220)調整 Sleep(睡眠)模式 (220)使用 Hibernate(休眠)模式 (221)調整印表機顯示幕的亮度 (222)回收利用 (222)回收 Dell 產品 (222)固定印表機 (223)揮發性聲明 (223)清除揮發性記憶體 (223)清除非揮發性記憶體 (224)清除印表機硬碟記憶體 (224)配置印表機硬碟加密 (225)尋找印表機安全資訊 (226)維護印表機 (227)清潔印表機零件 (227)清潔印表機 (227)清潔掃描器玻璃面板 (227)檢查零件及耗材狀態 (229)在印表機控制面板檢查零件及耗材的狀態 (229)從 Embedded Web Server(內嵌式 Web 伺服器)檢查零件及耗材的狀態 (229)預估剩餘頁數 (229)訂購零件及耗材 (230)利用「耗材訂購公用程式」訂購耗材 (230)利用「印表機首頁」訂購耗材 (230)存放耗材 (230)更換耗材 (231)更換碳粉匣 (231)更換成像組件 (234)移動印表機 (237)移動印表機之前 (237)將印表機移到其他地點 (237)運送印表機 (238)管理印表機 (239)管理印表機訊息 (239)存取狀態監視器中心 (239)檢查虛擬顯示幕 (239)設定電子郵件警示 (240)檢視報告 (240)從 Embedded Web Server(內嵌式 Web 伺服器)配置耗材通知 (240)回復出廠預設值 (241)清除夾紙 (242)避免夾紙 (242)瞭解夾紙訊息和位置 (243)[x]‑page jam, lift front cover to remove cartridge. [200–201]([x] 夾紙,請掀開前蓋以移除碳粉匣。
AJ65SBT-64AD用户手册
[报废处理注意事项]
报废时 将本产品当作工业废弃物处理
! 小心
A-3
修订记录
印刷日期 2000 年 9 月 2001 年 6 月
手册编号 SH(NA)-080087-A SH(NA)-080087-B
第一次印刷 程序示例修改 部分修改 总称 缩写的 2.1 节 3.5.2 节 4.7.2 节
2.2 节
2. 系统配置
2-1 至 2-2
2.1 整个配置......................................................................................................................................................2-1 2.2 适用系统......................................................................................................................................................2-2
[接线注意事项] ! 小心
在开始安装 接线或其它工作之前 必须断开外部所有相的电源 不这样做可能会损坏产品或出现误动作 必须采用 PLC 专用的 D 种接地 第三种接地 方式把 FG 端子和 FG1 端子接地 不这样做可能导致误动作 在确认了产品的额定电压和端子接线正确无误之后再为模块正确接线 如果连接不符合额定值的 电源或接错线 可能导致火灾或故障 一定要在规定扭矩范围内紧固端子螺钉 如果没有拧紧可能导致短路或误动作 如果拧得过紧可能损坏螺钉或模块而导致短路或误动作 一定不要让异物 如切屑或接线头等 进入模块 异物进入模块可能导致火灾 故障或误动作
G940T65B资料
3.7V 400mA Low Dropout RegulatorFeaturesDropout voltage typically 0.8V @ I O = 400mA Output current in excess of 400mA Output voltage accuracy +3%/-2% Quiescent current, typically 600µA Internal short circuit current limit Internal over temperature protectionGeneral DescriptionThe G940/G941 positive 3.7V voltage regulator fea-tures the ability to source 400mA of output current with a dropout voltage of typically 0.8V over the en-tire operating temperature range. A low quiescent current is provided over the entire output current range. The typical quiescent current is 0.6mA. Fur-thermore, the quiescent current is smaller when the regulator is in the dropout mode (V IN < 3.7V).Familiar regulator features such as over temperature and over current protection circuits are provided to prevent it from being damaged by abnormal operating conditions.Ordering InformationPIN OPTIONORDER NUMBERPACKAGE TYPE1 2 3G940T21U SOT 89 V OUT GND V IN G941T24U SOT 89 GND V IN V OUT G940T73U SOT 23 GND V OUT V IN*For other package types, pin options and package, please contact us at sales @ Order Number IdentificationType Pin Option TypePart NumberPACKAGE TYPEPIN OPTIONPACKINGT2 : SOT 89 1 2 3U & D : Tape & Reel D DirectionT6 : SOT 223 1 : V OUT GNDV IN T : Tube T7 : SOT 23 2 : V OUTV INGND B : Bag T8 : µTO92 3 : GND V OUT V IN4 : GND V INV OUT 5 : V IN GNDV OUT6 : V IN V OUT GNDTypical Application Package Type[Note 4] : Type of C OUTSOT 893µTO 92SOT 23、223V OUTAbsolute Maximum Ratings (Note 1)Input Voltage……………………………..……..…..…10V Power Dissipation Internally Limited ..(Note 2) Maximum Junction Temperature………….….…...150°C Storage Temperature Range…..…..…..-65°C ≤ T J ≤+150°C Lead Temperature, Time for Wave SolderingSOT 89, SOT23 Package….….…..……..…....260°C, 4s Continuous Power Dissipation (T A = + 25°C)SOT 23(1)…….…………………….….……….……...0.3W SOT 89(1)……………………….………..………..…0.42WNote (1): See Recommended Minimum Footprint.Operating Conditions (Note 1)Input Voltage………………………….…………….4V~7V Temperature Range………………….…0°C ≤ T J ≤125°CElectrical CharacteristicsV IN =5V, I O = 400mA, C IN = 1 µF, C OUT =10 µF, All specifications apply for T A = T J = 25°C. [Note 3]PARAMETER CONDITIONS MIN TYP MAX UNITSOutput Voltage Accuracy I O = 10mA -2 - +3 % Line Regulation V IN = 4V to 7V, I O = 50mA - 0.08 0.9 %/V Load Regulation I O = 10mA to 400mA - - 2.2 % Output Impedance 100mA DC and 100mA AC, fo = 120Hz - 100 - m ΩQuiescent Current V IN =5V - 0.6 - mA Ripple Rejection f i = 120 Hz, 1V P-P , Io = 100mA - 42 - dBI O = 400mA - 0.8 0.9 V Dropout Voltage I O = 100mA - 130 150 mV Short Circuit Current-0.76-AOver Temperature- 125 - °CNote 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Condi-tions are conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications and test conditions see the Electrical Characteristics.Note 2: The maximum power dissipation is a function of the maximum junction temperature, T Jmax ; total thermal re-sistance, θJA , and ambient temperature T A . The maximum allowable power dissipation at any ambient tem-perature is T jmax -T A / θJA . If this dissipation is exceeded, the die temperature will rise above 130°C and ICwill go into thermal shutdown. For the G940/G941 in SOT 23 package, θJA is 350°C/W and in the SOT 89 package is 250°C/W (See Recommend Minimum Footprint). The safe operation in SOT 23 & SOT 89 package, it can see “Typical Performance Characteristics” (Safe Operating Area).Note3: Low duty pulse techniques are used during test to maintain junction temperature as close to ambient aspossible.Note4: The type of output capacitor should be tantalum or aluminum.DefinitionsDropout VoltageThe input/output Voltage differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 100mV below its nominal value, dropout voltage is affected by junction temperature, load cur-rent and minimum input supply requirements.Line RegulationThe change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that average chip temperature is not significantly af-fected.Load RegulationThe change in output voltage for a change in load current at constant chip temperature. The measure-ment is made under conditions of low dissipation or by using pulse techniques such that average chip tem-perature is not significantly affected.Maximum Power DissipationThe maximum total device dissipation for which the regulator will operate within specifications.Quiescent Bias CurrentCurrent which is used to operate the regulator chip and is not delivered to the load.Typical Performance Characteristics(V IN =5V, C IN =1µF, C OUT =10µF, T A =25°C, unless otherwise noted.)Ch1: Vout (offset=3.70V)Ch1: Iout (400mA/div)Ch2: Vin (offset=5.0V)Ch2: Vout (offset=3.70V)Iout=100mAGround Current vs. Load CurrentLine TransientLoad TransientOutput Voltage Accuracy vs. Load CurrentDropout Voltage vs. Load CurrentRecommend Minimum FootprintNote: V IN(max) <= 6.5VNote: V IN(max)<= 6.5VPackage InformationSOT-89 (T2) PackageDIMENSIONS IN MILLIMETERS DIMENSIONS IN INCHESSYMBOLSMIN NOM MAX MIN NOM MAXA 1.40 1.50 1.60 0.055 0.059 0.063 A1 0.80 1.04 ----- 0.031 0.041 ----- b 0.36 0.42 0.48 0.014 0.0160.048 b1 0.41 0.47 0.53 0.016 0.018 0.020 C 038 0.40 0.43 0.014 0.015 0.017 D 4.40 4.50 4.60 0.173 0.177 0.181 D1 1.40 1.60 1.75 0.055 0.062 0.069 HE ----- ----- 4.25 ----- ----- 0.167 E 2.40 2.50 2.60 0.094 0.098 0.102 e 2.90 3.00 3.10 0.114 0.118 0.122SOT-223 (T6) PackageMILLIMETERS INCHES SYMBOLSMIN MAX MIN MAXA 1.551.80 0.061 0.071 A1 0.02 0.12 0.0008 0.0047 B 0.60 0.80 0.024 0.031 B12.903.10 0.114 0.122 C 0.240.32 0.009 0.013 D 6.30 6.70 0.248 0.264 E 3.30 3.70 0.130 0.146 e 2.30 BSC0.090 BSC e1 4.60 BSC 0.181 BSC H 6.70 7.30 0.264 0.287 L 0.90 MIN0.036 MINL2 0.06 BSC 0.0024 BSCα0º 10º 0º 10º13°(4X)α(4X)SOT-23 (T7) PackageNote:1.Package body sizes exclude mold flash protrusions or gate burrs2.Tolerance ±0.1000 mm (4mil) unless otherwise specified3.Coplanarity: 0.1000mm4.Dimension L is measured in gage planeDIMENSIONS IN MILLIMETERSSYMBOLSMIN NOM MAXA 1.00 1.10 1.30 A10.00 ----- 0.10 A2 0.70 0.80 0.90 b 0.35 0.40 0.50 C 0.10 0.150.25 D 2.70 2.90 3.10 E 1.40 1.60 1.80 e ----- 1.90(TYP)----- H 2.60 2.80 3.00 L 0.37 ------ ----- θ1 1º 5º 9ºGMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications.SOT 23 Package OrientationSOT 89、223 Package Orientation。
Hisense R6系列65R6E3 65英寸4K超高清红外屏TV说明文档说明书
Works with Google Assistant and Alexa Quickly access entertainment and control your TV with a Google Assistant or Alexa device that you already own. With the touch of your remote or ROKU mobile app, or a simple voice command, you can take control of your smart home, turn on and off the TV, change channels, and much more.
1 1 Optical 1
Yes Yes Yes Yes Works With Works With
300×200 / M6
Yes (IR Remote) Quick Start Guide is in the box/ User Manual is available online Yes
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TOSHIBA CMOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHICT6B65AFGColumn Driver LSI for Dot Matrix Graphic LCD’sManufactured using the CMOS process, the T6B65AFG is a column (segment) driver for small-to-medium-sized dot matrix graphic LCDs. Use of the T6B65AFG enables power dissipation to be reduced. It is designed to connect directly to an 8-bitmicroprocessor unit. The MPU can program all operating modes for the T6B65AFG asynchronously.The T6B65AFG stores display data transferred from an MPU in its internal display RAM. The contents of the internal display RAM correspond to the image on the LCD screen and are used to generate the LCD drive signal.Three T6B65AFGs can be combined with a Toshiba T6B66BFG row (common) driver to drive a 240-dot by 65-dot LCD screen. The T6B65AFG is lead (Pb)-free product.FeaturesDot matrix graphic LCD column driver with display RAM Display RAM capacity: 64 lines × 10 pages × 8 bits = 5120 bits (display area) 1 line × 10 pages × 8 bits = 80 bits (flag area) Total = 5200 bits LCD drive outputs: 80Interface :80-family MPU (8-bit) RAM data directly echoed to LCD(1) RAM bit data = 1 …………… ON (2) RAM bit data = 0 …………… OFF Duty: Can be controlled by the T6B66BFG. Display OFF functionsVarious functionsX/Y-counter selection, Up/Down mode selection, X-address setting,Y-address setting, Display Start Line setting, “Status Read”, display data read/write Low power consumption Logic power supply : 2.7 to 5.5 VCMOS Si-Gate process 100-pin-plastic flat packageQFP100-P-1420-0.65QWeight: 1.6 g (typ.)Block DiagramPin AssignmentPin FunctionsPin Name Pin No . I / O FunctionSEG1 to SEG80 1 to 80 Output Column driver outputspulseclockCL 96InputShiftPM 95 Input Pre-frame signal inputsignalClockInput/φ 94DB0 to DB7 81 to 88 I / O Data busD / I 93 Input Data/instruction select signal input (Note 1)/ WR 92 Input Write select signal input (Note 2) / CE 91 Input Chip enable signal input (Note 3) / RST 89 Input Reset signal input: / RST = L .........Reset state97 ― PowersupplyV DD, V SS 90,V LC2, 3, 598, 99, 100 ―Power supply for LCD driveNote 1: D / I = H ……………… Indicates that the data on DB0 to DB7 is display data.D / I = L ……………… Indicates that the data on DB0 to DB7 is control data.Note 2: / WR = H ………..…… Read is selected./ WR = L ………..…… Write is selected.Note 3: When writing………… Data on DB0 to DB7 is latched on the rising edge of / CE.When reading…..…… Data appears at DB0 to DB7 while / CE is LOW.Function of Each Block● InterfaceThe T6B65AFG is equipped with interface logic enabling interfacing to an 8-bit (80-family) MPU.● Input registerThis register holds 8-bit data from the MPU. Instruction and display data are distinguished by the D / Isignal and the 8-bit data.● Output registerThis register holds 8-bit data from the display RAM. When display data is read, the display data in theaddress is copied to this register. The address is then automatically incremented or decremented. When an address is set, therefore, the correct data does not appear on the first data reading. The data at the specified address appears on the second data reading.●X, Y (Page)-address counterThe X, Y (Page)-address counter holds a display RAM address. Reading or writing to the display RAM causes the X / Y-address to increment or decrement automatically.● Z-address counterThe Z-address counter holds the 6-bit datum that indicates the display start line. This value is preset by the PM signal. The value indicates the address of the display start line, which is the line that appears at the top of the screen.●Counter Up / Down registerThis register determines the counter and Up / Down mode. When the X-counter / Up mode is selected, reading or writing to the RAM causes the X-counter to increment automatically.When the X-counter / Down mode is selected, reading or writing to the RAM causes the X-counter to decrement automatically. When the Y-counter / Up mode is selected, reading or writing to the RAM causes the Y-counter to increment automatically. When the Y-counter / Down mode is selected, reading or writing to the RAM causes the Y-counter to decrement automatically.●Display ON / OFF registerThis 1-bit register holds the ON / OFF state. In the OFF state, the output is ignored. In the ON state, the data in the display RAM is displayed.The data in the display RAM is independent of the value of the display ON / OFF setting.● Busy flagThe Busy flag is set when an instruction other than the Status Read instruction is executed. Using Status Read, you can find out whether the Busy flag has been set or not. While the Busy flag is set, the T6B65A cannot accept any instruction other than Status Read.Ensure, therefore, that the Busy flag is reset before an instruction is issued.The Busy state time (T) is always as follows:1 / F ≤ T ≤2 / F [seconds] F: φ frequency (one half of the T6B66BFG's oscillation frequency)● LatchThe rising edge of CL latches data from the display RAM.●Column driver circuit and LCD voltage generation circuitThe column driver circuit consists of 80 driver circuits. The combination of display data from latches and the M signal selects one of the four LCD levels. Details of the voltage generation circuit and column driver circuit are shown in the diagram below:Command DefinitionsCode/ WR D / I DB7 DB6 DB5 DB4DB3DB2DB1DB0Function11 / 0Display ON (1) / OFF (0)0 0 0 0 0 0 0 1 Y / X U / DY (1) / X (0) Counter SelectUP (1) / Down (0) Mode Select 0 0 0 0 0 0 1 * * * Test Mode Select 0 0 0 1 Z-Address (0 to 63) Set Z-Address 0 0 1 0 X-Address (0 to 63)Set X-Address 0 0 1 1 * F / DR Y (Page) −Address (0 to 9) Set Y (Page) −Address 1 0 BDRF / DRY / XU / DStatus Read (Note) 0 1 Write Data Write Display Data 11Read DataRead Display Data*: INVALIDNote: B : Busy flagD : Display ON (1) / OFF (0) R : Reset Y / X : Counter Select 1: Y-Counter 0: X-CounterU / D : Up / Down Select 1: Up 0: DownF / DR : Flag Mode 1: Flag Mode 0: Display RAM Mode● Display ON / OFF/ WR D / I DB7 ················································ DB0 0 00 0 0 00011Display ON Code0 00 0 0 01Display OFFThis command controls the display ON / OFF setting. Display ON / OFF does not change the display RAM data. When / RST = L, Display = OFF (all the segment outputs are at the V DD level when Display = OFF). The T6B65A is in display OFF mode after a reset operation.● Counter UP / DOWN select/ WR D / I DB7 ················································ DB00 00 0 0 00100X-Counter / Down Mode 0 00 0 0 00101X-Counter / Up Mode 0 00 0 0 00110Y-Counter / Down Mode Code0 00 0 0 0111Y-Counter / Up ModeThis command selects the counter and Up / Down mode. When / RST = L, Y -Counter / Up mode is selected.● Test mode selectDB7IDB0················································WR//DCode0 00 0 0 01* * * *:INVALIDThis command selects the Test mode. Do not use this command.● Set Z-address (Display Start Line)DB7················································IDB0WR//DCode0 00 1 A A A A A AThis command specifies which RAM line (0 to 63) is displayed at the top of the screen. When the display duty is more than 1 / 64 (e.g., 1 / 33, 1 / 49), display begins at a line within the range 1 to 33 or 1 to 49.This command only applied to display RAM. The line following the last line of the display RAM is the flag RAM.● Set X-addressDB7IDB0················································/WR/DCode0 0 1 0 A A A A A AThis command sets the X-address (0 to 63). When the Counter Up / Down Select command selects this address counter, reading or writing to the RAM causes the X-address to increment or decrementautomatically.In X-Counter / Up mode, if the previous X-address is 63, the new X-address after the increment will be 0 and the Y (page)-address will be incremented. In Y-Counter / Down mode, if the previous X-address is 0, the new X-address after the decrement will be 63 and the Y (page)-address will be decremented.● Set Y (Page)-addressDB7IDB0················································//WRDmode0 0 1 1 * 1A A A A FlagCodemodeINVALID*:0 0 1 1 * 0A A A A DisplayRAMThis command sets the Y (page) -address and also selects Flag mode or Display RAM mode.In Flag mode, you can read data from or write data to Flag RAM only but cannot access the Display RAM.In Display RAM mode, you can read data from or write data to the Display RAM only but cannot access the Flag RAM.When the Counter Up / Down Select command selects this address counter, reading from or writing to the RAM causes the Y-address to increment or decrement automatically.In Y-Counter / Up mode, if the previous Y-address is 9, the new Y-address after the increment will be 0 and the X-address will be incremented. In Y-Counter / Down mode, if the previous Y-address is 0, the new Y-address after the decrement will be 9 and the X-address will be decremented.In Flag mode, only Y-Counter / Up or Down mode is permitted.● Status ReadIDB7 ················································ DB0/WR/DCode0 0 B 0 D R0 F / DR Y / X U / DB (Busy) : When B = 1, an instruction is being executed and no other instructions maybe accepted.When B = 0, instructions can be accepted.D (Display) : When D = 1, display is ON.When D = 0, display is OFF.R (Reset) : When R = 1, the T6B65A is in the Reset state.When R = 0, the T6B65A is in the Operating state.Y / X (Counter) : When Y / X = 1, Y-Counter is selected.When Y / X = 0, X-Counter is selected.U (Up) / D (Down) : When U / D = 1, Up mode is selected.When U / D = 0, Down mode is selected.F (Flag) / DR (Display RAM) : When F / DR = 1, Flag mode is selected.When F / DR = 0, Display RAM is selected.●Read / Write display dataDB7IDB0················································D//WRData0 1 D D D D D D D D WriteCodeData1 1 D D D D D D D D ReadThis command sends data to or receives data from the LCD RAM address that was specified. However, the correct data does not appear on the first read of the display data.Refer to the description of the Output Register in the section FUNCTION OF EACH BLOCK.LCD Drive WaveformLCD driver timing chart (1 / 65 duty)Absolute Maximum Ratings (Ta = 25°C)Item Symbol Rating UnitSupply Voltage (1) V DD(Note 1) −0.3 to 7.0V Supply Voltage (2) V LC2, 3, 5 (Note 3) V DD − 18.0 to V DD + 0.3V Input VoltageV IN (Note 1, 2)−0.3 to V DD + 0.3V Operating Temperature T opr −20 to 75 °C Storage TemperatureT stg−55 to 125°CNote 1: Referenced to V SSNote 2: Applies to all data bus pins and input pins except V LC2, V LC3 and V LC5 Note 3: Ensure that the following condition is always maintained:V DD ≥ V LC2 ≥ V LC3 ≥ V LC5Electrical Characteristics DC Characteristics Test Conditions (1)(Unless otherwise specified, V SS = 0, V DD = 3.0 V ± 10%, V LC5 = V DD − 16 V, Ta = −20 to 75°C)Item SymbolTestCircuitTest ConditionMinTyp.MaxUnitPin NameOperating Supply (1) V DD ― ― 2.7 ― 3.3 V V DD Operating Supply (2)V LC5 ― ― V DD−16.0― V DD −4.0V V LC5H Level V IH ― ―0.8 V DD―V DD VInput VoltageL Level V IL ― ― 0 ― 0.2V DDV CL, PM, / φ DB0 to DB7, D / I, / WR, / CE, / RST H Level V OH ― I OH = −400 µA V DD −0.2―― VOutputVoltageL LevelV OL ― I OL = 400 µA― ― 0.2 V DB0 to DB7Column Driver Output ResistanceR col―V DD − V LC5 = 11.0 V Load current = ±100 µA―― 7.5 K ΩSEG1 toSEG80Input LeakageI IL ―V IN = V DD to GND−1― 1 µADB0 to DB7, D / I, / WR,/ CE, / RST, CL, PM, / φOperating Frequency f φ ― ― 10 ― 250 kHz / φCurrent Consumption (1)I DD1 ― (Note 1)― 100140 µA V DD Current Consumption (2)I DD2 ― (Note 2)― 20 30 µA V DD Current Consumption (3)I DD3― (Note 3)−1 ― 1 µA V DDNote 1: Current consumption while the internal data receiver is operating:V DD = 2.7 to 3.3 V, V LC5 = V DD − 16 V, Ta = 25°C 1/9 bias, 1/65 duty, no load, f PM = 35 Hz, f CE = 1 MHzNote 2: Current consumption while the internal data receiver is inactive:V DD = 2.7 to 3.3 V, V LC5 = V DD −16 V, Ta = 25°C 1/9 bias, 1/65 duty, no loadNote 3: Current consumption in low power mode ( / STB pin of T6B66BFG = L):V DD = 3.0V, V LC5 = 0 V, Ta = 25°C, no loadTest Conditions (2)(Unless otherwise noted, V SS = 0, V DD = 5.0 V ± 10%, V LC5 = V DD − 16 V, Ta = −20 to 75°C)Item SymbolTestCircuitTest ConditionMinTyp.MaxUnitPin NameOperating Supply (1) V DD ― ― 4.5 ― 5.5 V V DD Operating Supply (2)V LC5 ― ― V DD−16.0― V DD −4.0V V LC5H Level V IH ― ―0.7 V DD―V DD VInput VoltageL Level V IL ― ― 0 ― 0.3V DDV CL, PM, /φ DB0 to DB7,D / I, / WR, / CE, / RST H Level V OH ― I OH = −400 µA V DD −0.4― ― VOutputVoltageL LevelV OL ― I OL = 400 µA― ― 0.4 V DB0 to DB7Column Output ResistanceR col―V DD − V LC5 = 11.0 V Load current = ±100 µA―― 7.5 k ΩSEG1 to SEG80Input LeakageI IL ― V IN = V DD to GND−1― 1 µADB0 to DB7, D / I, / WR,/ CE, / RST, CL, PM, /φOperating Frequency f φ ― ― 10 ― 250 kHz / φCurrent Consumption (1)I DD1 ― (Note 1)― 220330 µA V DDCurrent Consumption (2)I DD2 ― (Note 2)― 35 50 µA V DD Current Consumption (3)I DD 3―(Note 3)−1― 1 µA V DDNote 1: Current consumption while the internal data receiver is operating:V DD = 4.0 to 5.5 V, V LC5 = V DD − 16 V, Ta = 25°C 1/9 bias, 1/65 duty, no load, f PM = 35 Hz, f CE = 1 MHzNote 2: Current consumption while the internal data receiver is inactive:V DD = 4.0 to 5.5 V, V LC5 = V DD − 16 V, Ta = 25°C 1/9 bias, 1/65 duty, no loadNote 3: Current consumption in Low Power mode ( / STB pin of T6B66BFG = L):V DD = 5.0 V, V LC5 = 0 V, Ta = 25°C, no loadAC CharacteristicsTest Conditions (1)(V SS = 0 V , V DD = 3.0 V ± 10%, V LC5 = 0 V , Ta = −20 to 75°C)Item Symbol Min MaxUnitEnable Cycle Time t cycE 1000― ns Enable Pulse Width PWEH 450― nsEnable Rise / Fall Time t Er , t Ef― 25 nsAddress Set-up Time t AS 40 ― ns Address Hold Time t AH 10 ― ns Data Set-up Time t DS 280― nsData Hold Time t DHW 10 ― ns Data Delay Time t DD (Note)― 300nsData Hold Timet DHR (Note)20― nsLoad CircuitTest Conditions (2)(V SS = 0 V, V DD = 5.0 V ± 10%, V LC5 = 0 V, Ta = −20 to 75°C)Item Symbol Min Max UnitEnable Cycle Time t cycE 500― ns Enable Pulse Width PWEH 220― nsEnable Rise / Fall Time t Er , t Ef― 20 nsAddress Set-up Time t AS 40 ― ns Address Hold Time t AH 0 ― ns Data Set-up Time t DS 60 ― ns Data Hold Time t DHW 10 ― ns Data Delay Time t DD (Note)― 120nsData Hold Timet DHR (Note)20― nsNote: With load circuit connectedApplication CircuitPackage Dimensions QFP100-P-1420-0.65QWeight :1.6g (Typ.)。