LDM-07457NI, 规格书,Datasheet 资料

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IRMCK341TR;IRMCK341TY;中文规格书,Datasheet资料

Data Sheet No. PD60339IRMCK341 Sensorless Motor Control IC for AppliancesFeaturesMCE TM (Motion Control Engine) - Hardware based computation engine for high efficiency sinusoidal sensorless control of permanent magnet AC motor Supports both interior and surface permanent magnet motorsBuilt-in hardware peripheral for single shunt current feedback reconstructionNo external current or voltage sensing operational amplifier requiredThree/two-phase Space Vector PWMThree-channel analog output (PWM)Embedded 8-bit high speed microcontroller (8051) for flexible I/O and man-machine controlJTAG programming port for emulation/debugger Serial communication interface (UART)I2C/SPI serial interfaceWatchdog timer with independent analog clockThree general purpose timers/countersTwo special timers: periodic timer, capture timer Internal ‘One-Time Programmable’ (OTP) memory and internal RAM for final production usagePin compatible with IRMCF341, RAM version1.8V/3.3V CMOS Product SummaryMaximum crystal frequency 60 MHz Maximum internal clock (SYSCLK) frequency 128 MHz Maximum 8051 clock frequency 33 MHz Sensorless control computation time 11 μsec typ MCE TM computation data range 16 bit signed 8051 OTP Program memory 56K bytes MCE program and Data RAM 8K bytes GateKill latency (digital filtered) 2 μsec PWM carrier frequency counter 16 bits/ SYSCLK A/D input channels 8 A/D converter resolution 12 bits A/D converter conversion speed 2 μsec 8051 instruction execution speed 2 SYSCLK Analog output (PWM) resolution 8 bits UART baud rate (typ) 57.6K bps Number of I/O (max) 24 Package (lead-free) QFP64 Operating temperature -40°C ~ 85°CDescriptionIRMCK341 is a high performance OTP based motion control IC designed primarily for appliance applications. IRMCK341 is designed to achieve low cost and high performance control solutions for advanced inverterized appliance motor control. IRMCK341 contains two computation engines. One is Motion Control Engine (MCE TM) for sensorless control of permanent magnet motors; the other is an 8-bit high-speed microcontroller (8051). Both computation engines are integrated into one monolithic chip. The MCE TM contains a collection of control elements such as Proportional plus Integral, Vector rotator, Angle estimator, Multiply/Divide, Low loss SVPWM, Single Shunt IFB. The user can program a motion control algorithm by connecting these control elements using a graphic compiler. Key components of the sensorless control algorithms, such as the Angle Estimator, are provided as complete pre-defined control blocks implemented in hardware. A unique analog/digital circuit and algorithm to fully support single shunt current reconstruction is also provided. The 8051 microcontroller performs 2-cycle instruction execution (16MIPS at 33MHz). The MCE and 8051 microcontroller are connected via dual port RAM to process signal monitoring and command input. An advanced graphic compiler for the MCE TM is seamlessly integrated into the MATLAB/Simulink environment, while third party JTAG based emulator tools are supported for 8051 developments. IRMCK341 comes with a small QFP64 pin lead-free package.TABLE OF CONTENTS1Overview (5)2IRMCK341 Block Diagram and Main Functions (6)3Pinout (8)4Input/Output of IRMCK341 (9)4.18051 Peripheral Interface Group (10)4.2Motion Peripheral Interface Group (11)4.3Analog Interface Group (11)4.4Power Interface Group (12)4.5Test Interface Group (12)5Application Connections (13)6DC Characteristics (14)6.1Absolute Maximum Ratings (14)6.2System Clock Frequency and Power Consumption (14)6.3Digital I/O DC Characteristics (15)6.4PLL and Oscillator DC characteristics (16)6.5Analog I/O DC Characteristics (16)6.6Under Voltage Lockout DC characteristics (17)6.7AREF Characteristics (17)7AC Characteristics (18)7.1PLL AC Characteristics (18)7.2Analog to Digital Converter AC Characteristics (19)7.3Op amp AC Characteristics (19)7.4SYNC to SVPWM and A/D Conversion AC Timing (20)7.5GATEKILL to SVPWM AC Timing (21)7.6Interrupt AC Timing (21)7.7I2C AC Timing (22)7.8SPI AC Timing (23)7.8.1SPI Write AC timing (23)7.8.2SPI Read AC Timing (24)7.9UART AC Timing (25)7.10CAPTURE Input AC Timing (26)7.11JTAG AC Timing (27)7.12OTP Programming Timing (28)8I/O Structure (29)9Pin List (32)10Package Dimensions (35)11Part Marking Information (36)12Order Information (36)TABLE OF FIGURESFigure 1. Typical Application Block Diagram Using IRMCK341 (5)Figure 2. IRMCK341 Internal Block Diagram (6)Figure 3. IRMCK341 Pin Configuration (8)Figure 4. Input/Output of IRMCK341 (9)Figure 5. Application Connection of IRMCK341 (13)Figure 6. Clock Frequency vs. Power Consumption (14)Figure 7 Crystal oscillator circuit (18)Figure 8 Voltage droop of sample and hold (19)Figure 9 SYNC to SVPWM and A/D Conversion AC Timing (20)Figure 10 GATEKILL to SVPWM AC Timing (21)Figure 11 Interrupt AC Timing (21)Figure 12 I2C AC Timing (22)Figure 13 SPI Write AC Timing (23)Figure 14 SPI Read AC Timing (24)Figure 15 UART AC Timing (25)Figure 16 CAPTURE Input AC Timing (26)Figure 17 JTAG AC Timing (27)Figure 18 OTP Programming Timing (28)Figure 19 All digital I/O except motor PWM output (29)Figure 20 RESET, GATEKILL I/O (29)Figure 21 Analog input (30)Figure 22 Analog operational amplifier output and AREF I/O structure (30)Figure 23 VPP programming pin (30)Figure 24 VSS and AVSS pin structure (31)Figure 25 VDD1 and VDDCAP pin structure (31)Figure 26 XTAL0/XTAL1 pins structure (31)TABLE OF TABLESTable 1. Absolute Maximum Ratings (14)Table 2. System Clock Frequency (14)Table 3. Digital I/O DC Characteristics (15)Table 4. PLL DC Characteristics (16)Table 5. Analog I/O DC Characteristics (16)Table 6. UVcc DC Characteristics (17)Table 7. AREF DC Characteristics (17)Table 8. PLL AC Characteristics (18)Table 9. A/D Converter AC Characteristics (19)Table 10. Current Sensing OP Amp AC Characteristics (19)Table 11. SYNC AC Characteristics (20)Table 12. GATEKILL to SVPWM AC Timing (21)Table 13. Interrupt AC Timing (21)Table 14. I2C AC Timing (22)Table 15. SPI Write AC Timing (23)Table 16. SPI Read AC Timing (24)Table 17. UART AC Timing (25)Table 18. CAPTURE AC Timing (26)Table 19. JTAG AC Timing (27)Table 20. OTP Programming Timing (28)Table 21. Pin List (34)1 OverviewIRMCK341 is a new International Rectifier integrated circuit device primarily designed as a one-chip solution for complete inverter controlled appliance motor control applications. Unlike a traditional microcontroller or DSP, the IRMCK341 provides a built-in closed loop sensorless control algorithm using the unique Motion Control Engine (MCE TM) for permanent magnet motors. The MCE TM consists of a collection of control elements, motion peripherals, a dedicated motion control sequencer and dual port RAM to map internal signal nodes. IRMCK341 also employs a unique single shunt current reconstruction circuit to eliminate additional analog/digital circuitry and enables a direct shunt resistor interface to the IC. Motion control programming is achieved using a dedicated graphical compiler integrated into the MATLAB/Simulink TM development environment. Sequencing, user interface, host communication, and upper layer control tasks can be implemented in the 8051 high-speed 8-bit microcontroller. The 8051 microcontroller is equipped with a JTAG port to facilitate emulation and debugging tools. Figure 1 shows a typical application schematic using the IRMCK341.IRMCK341 is intended for volume production purpose and contains 64K bytes of OTP (One Time Programming) ROM, which can be programmed through a JTAG port. For a development purpose use, IRMCF341 contains a 48k byte of RAM in place of program OTP to facilitate an application development work. Both IRMCF341 and IRMCK341 come in the same 64-pin QFP package with identical pin configuration to facilitate PC board layout and transition to mass productionFigure 1. Typical Application Block Diagram Using IRMCK3412 IRMCK341 Block Diagram and Main Functions IRMCK341 block diagram is shown in Figure 2.Figure 2. IRMCK341 Internal Block DiagramIRMCK341 contains the following functions for sensorless AC motor control applications: •Motion Control Engine (MCE TM)o Proportional plus Integral blocko Low pass filtero Differentiator and lag (high pass filter)o Rampo Limito Angle estimate (sensorless control)o Inverse Clark transformationo Vector rotatoro Bit latcho Peak detecto Transitiono Multiply-divide (signed and unsigned)o Divide (signed and unsigned)o Addero Subtractoro Comparatoro Countero Accumulatoro Switcho Shifto ATAN (arc tangent)o Function block (any curve fitting, nonlinear function)o16-bit wide Logic operations (AND, OR, XOR, NOT, NEGATE)o MCE TM program and data memory (6K byte). Note 1o MCE TM control sequencer• 8051 microcontrollero Three 16-bit timer/counterso16-bit periodic timero16-bit analog watchdog timero16-bit capture timero Up to 24 discrete I/Oso Eight-channel 12-bit A/DOne buffered channel for current sensing (0 – 1.2V input)Seven unbuffered channels (0 – 1.2V input)o JTAG port (4 pins)o Up to three channels of analog output (8-bit PWM)o UARTo I2C/SPI porto64K byte program OTPo2K byte data RAM. Note 1Note 1: Total size of RAM is 8K byte including MCE program, MCE data, and 8051data. Different sizes can be allocated depending on applications.3 PinoutFigure 3. IRMCK341 Pin Configuration4 Input/Output of IRMCK341All I/O signals of IRMCK341 are shown in Figure 4. All I/O pins are 3.3V logic interface except A/D interface pins.PWM gate signalInterfaceA/D InterfaceDiscrete I/OJTAG portUART Interface Crystal D/A Interface (PWM output)System ResetDigital power/ground Test ModePLL power/groundI2C Interface & OTP powerAnalog power/groundFigure 4. Input/Output of IRMCK3414.1 8051 Peripheral Interface GroupUART InterfaceTXD Output, Transmit data from IRMCK341RXD Input, Receive data to IRMCK341Discrete I/O InterfaceP1.0/T2 Input/output port 1.0, can be configured as Timer/Counter 2 inputP1.1/RXD Input/output port 1.1, can be configured as RXD inputP1.2/TXD Input/output port 1.2, can be configured as TXD outputP1.3/SYNC/SCK Input/output port 1.3, can be configured as SYNC output or SPI clockoutputP1.4/CAP Input/output port 1.4, can be configured as Capture Timer inputP1.5 Input/output port 1.5P1.6 Input/output port 1.6P1.7 Input/output port 1.7P2.0/NMI Input/output port 2.0, can be configured as non-maskable interrupt input P2.1 Input/output port 2.1P2.2 Input/output port 2.2P2.3 Input/output port 2.3P2.4 Input/output port 2.4P2.5 Input/output port 2.5P2.6/AOPWM0 Input/output port 2.6, can be configured as AOPWM0 outputP2.7/AOPWM1 Input/output port 2.7, can be configured as AOPWM1 outputP3.0/INT2/CS1 Input/output port 3.0, can be configured as INT2 input or SPI chip select 1P3.1/AOPWM2 Input/output port 3.1, can be configured as AOPWM2 outputP3.2/NINT0 Input/output port 3.2, can be configured as INT0 inputP3.3/NINT1 Input/output port 3.3, can be configured as INT1 inputP3.5/T1 Input/output port 3.5, can be configured as Timer/Counter 1 inputP5.1/TSM Input/output port 5.1, configured as JTAG port by defaultP5.2/TDO Input/output port 5.2, configured as JTAG port by defaultP5.3/TDI Input/output port 5.3, configured as JTAG port by defaultAnalog Output InterfaceP2.6/AOPWM0 Input/output, can be configured as 8-bit PWM output 0 withprogrammable carrier frequencyP2.7/AOPWM1 Input/output, can be configured as 8-bit PWM output 1 withprogrammable carrier frequencyP3.1/AOPWM2 Input/output, can be configured as 8-bit PWM output 2 withprogrammable carrier frequencyCrystal InterfaceXTAL0 Input, connected to crystalXTAL1 Output, connected to crystalReset InterfaceRESET Inout, system reset, needs to be pulled up to VDD1 but doesn’t require external RC time constant分销商库存信息:IRIRMCK341TR IRMCK341TY。

RT9817 产品数据手册说明书

1DS9817-13 April 2022Features●Internally Fixed Threshold 1.2V to 5V in 0.1V Step ●High Accuracy ±1.5%●Low Supply Current 3μA●No External Components Required ●Quick Reset within 20μs●Built-in Recovery Delay Include 0ms, 55ms, 220ms,450ms Options●Low Functional Supply Voltage 0.9V ●CMOS Push-Pull Output●Small SC-82 and SOT-143 Packages●RoHS Compliant and 100% Lead (Pb)-FreePin ConfigurationApplications●Computers ●Controllers●Intelligent Instruments●Critical μP and μC Power Monitoring ●Portable/Battery-Powered EquipmentMicro-Power Voltage Detectors with Manual ResetOrdering InformationGeneral DescriptionThe RT9817 is a micro-power voltage detector with deglitched manual reset input supervising the power supply voltage level for microprocessors (μP) or digital systems. It provides internally fixed threshold levels with 0.1V per step ranging from 1.2V to 5V, which covers most digital applications. It features low supply current of 3μA.The RT9817 performs supervisory function by sending out a reset signal whenever the V DD voltage falls below a preset threshold level. This reset signal will last the whole period before V DD recovering. Once V DD recovered upcrossing the threshold level, the reset signal will be released after a certain delay time. To pull reset signal low manually, just pull the manual reset input (MR) below the specified V IL level. RT9817 is provided in SC-82 and SOT-143 packages.(TOP VIEW)SOT-143Marking Information For marking information, contact our sales representative directly or through a RichTek distributor located in your area, otherwise visit our website for detail.Note :Richtek p roducts are :❝RoHS compliant and compatible with the current require- ments of IPC/JEDEC J-STD-020.❝Suitable for use in SnPb or Pb-free soldering processes.SC-82RESET/RESET MRRESET/RESET MR RT9817A = 0ms (RESET)B = 55ms (RESET)C = 220ms (RESET)D = 450ms (RESET)E = 0ms (RESET)F = 55ms (RESET)G = 220ms (RESET)H = 450ms (RESET)2DS9817-13 April 2022 Functional Block DiagramTypical Application CircuitFunctional Pin DescriptionRESET/RESETMRPart StatusThe part status values are defined as below :Active : Device is in production and is recommended for new designs. Lifebuy : The device will be discontinued, and a lifetime -buy period is in effect. NRND : Not recommended for new designs.Preview : Device has been announced but is not in production. Obsolete : Richtek has discontinued the production of the device.3DS9817-13 April 2022Absolute Maximum Ratings (Note 1)●Terminal Voltage (with Respect to GND)V DD ------------------------------------------------------------------------------------------------------------------------−0.3V to 6.0V●All Other Inputs --------------------------------------------------------------------------------------------------------−0.3V to V DD +0.3V ●Input Current, I VDD -----------------------------------------------------------------------------------------------------20mA ●Power Dissipation, PD @ T A = 25°CSC-82--------------------------------------------------------------------------------------------------------------------0.25W SOT-143-----------------------------------------------------------------------------------------------------------------0.285W ●Package Thermal Resistance (Note 2)SC-82, θJA ---------------------------------------------------------------------------------------------------------------400°C SOT-143, θJA ------------------------------------------------------------------------------------------------------------350°C ●Lead Temperature (Soldering, 10sec.)---------------------------------------------------------------------------- 260°C●Storage T emperature Range ----------------------------------------------------------------------------------------−65°C to 125°C ●ESD Susceptibility (Note 3)HBM (Human Body Mode)------------------------------------------------------------------------------------------2kV MM (Machine Mode)--------------------------------------------------------------------------------------------------200VElectrical Characteristics(V= 3V, T = 25°C, unless otherwise specified)Recommended Operating Conditions (Note 4)●Junction T emperature Range ----------------------------------------------------------------------------------------−40°C to 125°C ●Ambient T emperature Range ----------------------------------------------------------------------------------------−40°C to 85°CTo be continued4DS9817-13 April 2022Note 1. Stresses listed as the above “Absolute Maximum Ratings ” may cause permanent damage to the device. These are forstress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may remain possibility to affect device reliability.Note 2. θJA is measured in the natural convection at T A = 25°C on a low effective thermal conductivity test board ofJEDEC 51-3 thermal measurement standard.Note 3. Devices are ESD sensitive. Handling precautions are recommended.Note 4. The device is not guaranteed to function outside its operating conditions.5DS9817-13 April 2022Typical Operating CharacteristicsSupply Current vs. Input Voltage01234123456Input Voltage (V)S u p p l y C u r r e n t I D D (u A )Output Voltage vs. Input Voltage012345670123456Input Voltage (V)O u t p u t V o l t a g e (V)Nch Driver Output Current vs. V DS020*********120012345V DS (V)O u t p u t C u r r e n t(m A )Supply Current vs. Input Voltage01234560123456Input Voltage (V)S u p p l y C u r r e n t (u A )Nch Driver Output Current vs. V DS010********600.511.522.533.5V DS (V)O u t p u t C u r r e n t (m A )Nch Driver Output Current vs. V DS00.40.81.21.622.400.30.60.91.21.5V DS (V)O u t p u t C u r r e n t(m A )6DS9817-13 April 2022 Nch Driver Sink Current vs. Input Voltage0102030400.511.522.533.5Input Voltage (V)S i n k C u r r e n t I S I N K (m A )Supply Current vs. Input Voltage01234123456Input Voltage (V)S u p p l y C u r re n t (u A )Power-Down Reset Delay vs. Temperature051015202530354045-50-25255075100125Temperature P o w e r -D o w n R e s e t D e l a y (u s)(°C)Power-Down Reset Delay vs. Temperature051015202530354045-50-25255075100125Temperature P o w e r -D o w n R e s e t D e l a y (u s )(°C)Power-Down Reset Delay vs. Temperature03691215-50-25255075100125Temperature P o w e r -D o w n R e s e t D e l a y (u s )(°C)Nch Driver Sink Current vs. Input Voltage0102030405012345Input Voltage (V)S i n k C u r r e n t I S I N K (m A )7DS9817-13 April 2022Output Delay Time vs. Load Capacitance0.010.111010010000.00010.00100.01000.1000 1.0000Load Capacitance (uF)O u t p u t D e l a y T i m e (m s )Power-Up Reset Time-Out vs. Temperature0255075100-50-25255075100125Temperature P o w e r -U p R e s e t T im e -O u t (m s )(°C)Reset Threshold Deviation vs. Temperature1.002.003.004.005.006.00-50-25255075100125Temperature R e s e t T h r e s h o l d D e v i a t i on (V )(°C)Pch Driver Output Current vs. Input Voltage0510152025123456Input Voltage (V)O u t p u t C u r r e n t(m A )Nch Driver Output Current vs. V DS204060801001201401600123456V DS (V)N c h D r i v e r O u t p u t C ur r e n t (m A )Power-Up Reset Time-Out vs. Temperature0100200300400500-50-25255075100125Temperature P o w e r -U p R e s e t T i me -O u t (m s )(°C)8DS9817-13 April 2022 Nch Driver Output Current vs. Input Voltage1020304050600123456Input Voltage (V)N c h D r i v e r O u t p u t C u r r e n t (m A )Output Voltage vs. Input Voltage01234567123456Input Voltage (V)O u t p u tV o l t a g e (V )Power-Down Reset Time-Out vs. Temperature051015202530-50-25255075100125Temperature P ow e r -D o w n R e s e t T i m e -O u t (u s )(°C)Power Down Reset Time-Out vs. Temperature0100200300400500-50-25255075100125Temperature P o w e r D o w n R e s e t T i m e -O u t (m s )(°C)9DS9817-13 April 2022Application InformationBenefits of Highly Accurate Reset ThresholdMost μP supervisor ICs have reset threshold voltages between 1% and 1.5% below the value of nominal supply voltages.This ensures a reset will not occur within 1% of the nominal supply, but will occur when the supply is 1.5% below nom inal.10DS9817-13 April 2022SOT-143 Surface Mount Package11DS9817-13 April Richtek Technology CorporationHeadquarter5F, No. 20, Taiyuen Street, Chupei CityHsinchu, Taiwan, R.O.C.Tel: (8863)5526789 Fax: (8863)5526611Information that is provided by Richtek Technology Corporation is believed to be accurate and reliable. Richtek reserves the right to make any change in circuit design,specification or other related things if necessary without notice at any time. No third party intellectual property infringement of the applications should be guaranteed by users when integrating Richtek products into any application. No legal responsibility for any said applications is assumed by Richtek.Richtek Technology Corporation Taipei Office (Marketing)5F, No. 95, Minchiuan Road, Hsintien City Taipei County, Taiwan, R.O.C.Tel: (8862)86672399 Fax: (8862)86672377Email:*********************SC -82 Surface Mount Package。

艾登Moeller系列NZM模具电路保护器技术数据表说明书

Eaton 281299Eaton Moeller series NZM - Molded Case Circuit Breaker. Circuit-breaker, 3p, 20A, H2-M20General specificationsEaton Moeller series NZM molded casecircuit breaker thermo-magnetic281299149 mm184 mm105 mm2.345 kg RoHS conformIEC/EN 60947 IEC NZMH2-M20Product Name Catalog NumberProduct Length/Depth Product Height Product Width Product Weight Compliances Certifications Model Code20 AIs the panel builder's responsibility. The specifications for the switchgear must be observed.5 kA130 kAMeets the product standard's requirements.Is the panel builder's responsibility. The specifications for the switchgear must be observed.Built-in device fixed built-in techniqueFixed20 ADoes not apply, since the entire switchgear needs to be evaluated.Max. 10 segments of 24 mm x 0.8 mm at rear-side connection (punched)Max. 8 segments of 24 mm x 1 mm (2x) at box terminal Min. 2 segments of 9 mm x 0.8 mm at box terminalMin. 2 segements of 16 mm x 0.8 mm at rear-side connection (punched)Max. 10 segments of 16 mm x 0.8 mm at box terminalRocker leverMeets the product standard's requirements.40 °C eaton-circuit-breaker-let-through-current-nzm-mccb-characteristic-curve-005.epseaton-circuit-breaker-characteristic-power-defense-mccb-characteristic-curve-037.epsMH2-M20il01206006z2015_11.pdfVorstellung des neuen digitalen Leistungsschalter NZMDas neue digitale NZM-Sortiment - In Kurze verfugbar DEDA-CD-nzm2_3pDA-CS-nzm2_3peaton-manual-motor-starters-starter-msc-r-reversing-starter-wiring-diagram.epseaton-manual-motor-starters-starter-nzm-mccb-wiring-diagram.epseaton-nzm-technical-information-sheeteaton-circuit-breaker-nzm-mccb-dimensions-019.epsRated operational current for specified heat dissipation (In) 10.11 Short-circuit ratingRated short-circuit breaking capacity Ics (IEC/EN 60947) at 690 V, 50/60 HzRated short-circuit breaking capacity Icu (IEC/EN 60947) at 400/415 V, 50/60 Hz10.4 Clearances and creepage distances10.12 Electromagnetic compatibilityMounting MethodAmperage Rating10.2.5 LiftingTerminal capacity (copper strip)Handle type10.2.3.1 Verification of thermal stability of enclosuresAmbient storage temperature - min Characteristic curveeCAD model Installationsanleitung Installationsvideos mCAD modelSchaltpläneTechnische Datenblätter ZeichnungenFitted with:Thermal protectionProtection against direct contactFinger and back-of-hand proof to VDE 0106 part 100Terminal capacity (copper busbar)Max. 24 mm x 8 mm direct at switch rear-side connectionM8 at rear-side screw connectionMin. 16 mm x 5 mm direct at switch rear-side connection10.8 Connections for external conductorsIs the panel builder's responsibility.Special featuresMaximum back-up fuse, if the expected short-circuit currents at the installation location exceed the switching capacity of the circuit breaker (Rated short-circuit breaking capacity Icn) Rated current = rated uninterrupted current: 20 A Tripping class 10 A IEC/EN 60947-4-1, IEC/EN 60947-2 The circuit-breaker fulfills all requirements for AC-3 switching category.Ambient operating temperature - max70 °CClimatic proofingDamp heat, cyclic, to IEC 60068-2-30Damp heat, constant, to IEC 60068-2-78Terminal capacity (aluminum stranded conductor/cable)25 mm² - 50 mm² (1x) direct at switch rear-side connection25 mm² - 185 mm² (1x) at tunnel terminal25 mm² - 50 mm² (2x) direct at switch rear-side connectionTerminal capacity (copper stranded conductor/cable)25 mm² - 70 mm² (2x) direct at switch rear-side connection25 mm² - 185 mm² (1x) direct at switch rear-side connection25 mm² - 185 mm² (1x) at box terminal25 mm² - 70 mm² (2x) at box terminal25 mm² - 185 mm² (1x) at 1-hole tunnel terminalLifespan, electrical7500 operations at 690 V AC-15000 operations at 690 V AC-310000 operations at 415 V AC-16500 operations at 400 V AC-310000 operations at 400 V AC-16500 operations at 415 V AC-3Electrical connection type of main circuitScrew connectionShort-circuit total breaktime< 10 msRated impulse withstand voltage (Uimp) at main contacts8000 VRated short-circuit breaking capacity Ics (IEC/EN 60947) at 400/415 V, 50/60 Hz130 kA10.9.3 Impulse withstand voltageIs the panel builder's responsibility.Utilization categoryA (IEC/EN 60947-2)Number of polesThree-poleAmbient operating temperature - min-25 °C10.6 Incorporation of switching devices and componentsDoes not apply, since the entire switchgear needs to be evaluated.10.5 Protection against electric shockDoes not apply, since the entire switchgear needs to be evaluated.Terminal capacity (control cable)0.75 mm² - 1.5 mm² (2x)0.75 mm² - 2.5 mm² (1x)Equipment heat dissipation, current-dependent5.1 WInstantaneous current setting (Ii) - min350 A10.13 Mechanical functionThe device meets the requirements, provided the information in the instruction leaflet (IL) is observed.10.2.6 Mechanical impactDoes not apply, since the entire switchgear needs to be evaluated.10.9.4 Testing of enclosures made of insulating materialIs the panel builder's responsibility.Rated operational current16 A (400 V AC-3)Rated short-circuit breaking capacity Ics (IEC/EN 60947) at 230 V, 50/60 Hz150 kAApplicationUse in unearthed supply systems at 690 V10.3 Degree of protection of assembliesDoes not apply, since the entire switchgear needs to be evaluated.Rated short-circuit making capacity Icm at 240 V, 50/60 Hz330 kARated short-circuit breaking capacity Ics (IEC/EN 60947) at 440 V, 50/60 Hz130 kADegree of protection (IP), front sideIP40 (with insulating surround)IP66 (with door coupling rotary handle)Rated short-circuit making capacity Icm at 525 V, 50/60 Hz105 kARated short-circuit making capacity Icm at 690 V, 50/60 Hz40 kAInstantaneous current setting (Ii) - max350 AOverload current setting (Ir) - min16 A10.2.3.2 Verification of resistance of insulating materials to normal heatMeets the product standard's requirements.10.2.3.3 Resist. of insul. mat. to abnormal heat/fire by internal elect. effectsMeets the product standard's requirements.Lifespan, mechanical20000 operationsOverload current setting (Ir) - max20 AVoltage rating690 V - 690 VTerminal capacity (copper solid conductor/cable)6 mm² - 16 mm² (2x) at box terminal6 mm² - 16 mm² (2x) direct at switch rear-side connection16 mm² (1x) at tunnel terminal10 mm² - 16 mm² (1x) at box terminal10 mm² - 16 mm² (1x) direct at switch rear-side connectionDegree of protection (terminations)IP10 (tunnel terminal)IP00 (terminations, phase isolator and strip terminal)10.9.2 Power-frequency electric strengthIs the panel builder's responsibility.Short-circuit release non-delayed setting - min350 ADegree of protectionIP20 (basic degree of protection, in the operating controls area) IP20Overvoltage categoryIIIRated short-time withstand current (t = 1 s)1.9 kARated impulse withstand voltage (Uimp) at auxiliary contacts 6000 VTerminal capacity (aluminum solid conductor/cable)10 mm² - 16 mm² (2x) direct at switch rear-side connection10 mm² - 16 mm² (1x) direct at switch rear-side connection16 mm² (1x) at tunnel terminalSwitch off techniqueThermomagneticRated short-time withstand current (t = 0.3 s)1.9 kAAmbient storage temperature - max70 °CRated short-circuit breaking capacity Ics (IEC/EN 60947) at 525 V, 50/60 Hz37.5 kAOptional terminalsBox terminal. Connection on rear. Tunnel terminalRelease systemThermomagnetic releasePollution degree310.7 Internal electrical circuits and connectionsIs the panel builder's responsibility.Rated operating power at AC-3, 230 V5.5 kW10.10 Temperature riseThe panel builder is responsible for the temperature rise calculation. Eaton will provide heat dissipation data for the devices.FunctionsMotor protectionShort-circuit release non-delayed setting - max350 AStandard terminalsScrew terminalRated short-circuit making capacity Icm at 400/415 V, 50/60 Hz 330 kARated operating power at AC-3, 400 V7.5 kWTypeCircuit breaker10.2.2 Corrosion resistanceMeets the product standard's requirements.10.2.4 Resistance to ultra-violet (UV) radiationMeets the product standard's requirements.10.2.7 InscriptionsMeets the product standard's requirements.Rated short-circuit making capacity Icm at 440 V, 50/60 Hz 286 kAIsolation500 V AC (between auxiliary contacts and main contacts)300 V AC (between the auxiliary contacts)Number of operations per hour - max120Circuit breaker frame typeNZM2Direction of incoming supplyAs requiredShock resistance20 g (half-sinusoidal shock 20 ms)Eaton Konzern plc Eaton-Haus30 Pembroke-Straße Dublin 4, Irland © 2023 Eaton. Alle Rechte vorbehalten. Eaton ist eine eingetrageneMarke.Alle anderen Warenzeichen sindEigentum ihrer jeweiligenBesitzer./socialmedia1000 VRated insulation voltage (Ui)。

深圳市科特翎科技有限公司产品规格书说明书

产品规格书SPECIFICATION产品名称N ame.NO：0805白光White产品型号Model.NO：KTR-0805CWD文件编号Document.NO：MQ8032版次REV.NO：K3.0描述Description:■ 2.0×1.25mm贴片发光二极管2.0×1.25mm Chip SMD ■胶体颜色Colloid Color:黄色Yellow■发光颜色Emission Color:白色White■半功率角度Viewing Angle:120°深圳市科特翎科技有限公司SHENZHEN KETERINE TECHNOLOGY CO.,LTD.编制Prepared by审核Checked by核准Approved by市场部Market Dept.客户确认CUSTOMER CONFIRMATION确认Confirmed by审核Checked by核准Approved by确认Confirmed by1.外形尺寸Dimensions单位(Units):毫米(mm)注意:所有尺寸单位为mm，如无特殊说明误差范围为±0.1mmAll dimensions area in mm tolerance is±0.1mm unless otherwise noted.2.光电特性Electrical/Optical characteristics (1)最大限度值Absolute Maximum Ratings(TA=25±5ºC)项目Item符号Symbol最大额定值Absolute Maximum Rating单位Unit正向电流Forward Current IF20mA正向峰值电流Pulse Forward Current IFP100mA反向电压Reverse Voltage VR5V功率消耗Power Dissipation PD70mW工作温度Operating Temperature Topr-40ºC To+85ºC°C贮藏温度Storage Temperature Tstg-40ºC To+85ºC°C焊接温度Soldering Temperature Tsld ReflowSoldering:260ºC For10sec. 1/10周期,0.1msec脉宽IFP Conditions:1/10Duty Cycle,0.1msec Pulse Width.(2)样品光电参数Initial Electrical/Optical Characteristics(TA=25±5ºC)符号Symbol 项目Item单位Units最小值Min.规格值Typ.最大值Max.测试条件TestConditionsVF正向电压Forward Voltage V 2.6 3.2IF=10mAIR反向电流Reverse Current uA10VR=7V2θ½发光角度Viewing Angleº120ºIF=10mAø发光强度Luminous Intensitymcd6001080IF=10mATC色温Colour Temperature k700011000IF=10mARA显色指数Color Rendering Index Ra7080IF=10mA 正向电压允许误差±0.05V Tolerance of measurement of Vf is±0.05V.亮度允许误差±10%Luminous Intensity Measurement allowance is±10%.3.特性曲线Characteristic curve4.可靠性RELIABILITY (1)测试项目及结果Test Items and Results实验项目Test Items 参考标准Reference实验条件Test Conditions时间Time样品数Quantity判据Criterion冷热冲击Thermal Shock MIL-STD-202G-40℃(30min)←→100℃(30min)循环200次200cycles220/22湿热循环Temperature And Humidity Cyclic JEITA ED-4701200203-10℃——+65℃，0%-90%RH24hrs./1cycle循环10次10cycles220/22高温储存High Temperature Storage JEITA ED-4701200201Ta=100℃1000h220/22低温储存Low Temperature Storage JEITA ED-4701200202Ta=-40℃1000h220/22高温高湿储存High Temperature High Humidity Storage JEITA ED-4701100103Ta=60℃，RH=90%1000h220/22常温寿命试验Life Test JESD22-A108D Ta=25℃IF=20mA1000h220/22高温寿命High Temperature Life Test JESD22-A108D Ta=80℃IF=20mA1000h220/22低温寿命Low Temperature Life Test JESD22-A108D Ta=-40℃IF=20mA1000h220/22耐焊接热Resistance to Soldering Heat GB/T4937,Ⅱ,2.2&2.3Tsol*=260℃10secs.2次2times220/225.注意事项Cautions（1）焊接条件Soldering Conditions本产品最多只可回焊两次,且在首次回焊后须冷却至室温之后方可进行第二次回焊。

NCP1835BMNR2;NCP1835BMNR2G;中文规格书,Datasheet资料

NCP1835BIntegrated Li−Ion ChargerNCP1835B is an integrated linear charger specifically designed to charge 1−cell Li−Ion batteries with a constant current, constant voltage (CCCV) profile.Its low input voltage capability, adjustable charge current, ability to maintain regulation without a battery, and its onboard thermal foldback make it versatile enough to charge from a variety of wall adapters. The NCP1835B can charge from a standard wall adapter or from the USB port. It has been optimized to charge low capacity batteries such as those found in wireless headsets and flash memory−based MP3 players.Features•Integrated V oltage and Current Regulation•No External MOSFET, Sense Resistor or Blocking Diode Required •Charge Current Thermal Foldback•Integrated Pre−charge Current for Conditioning a Deeply Discharged Battery•Integrated End−of−Charge (EOC) Detection•1% V oltage Regulation•4.2 V Regulated Output V oltage•Regulation Maintained without a Battery Present •Programmable Full Charge Current•Open−Drain Charger Status and Fault Alert Flags•2.8 V Output for AC Present Indication and Powering Charging Subsystems•Minimum Input Voltage of 2.4 V Allows Use of Current Limited Adapters•Automatically Recharging if Battery Voltage Drops after Charging Cycle is Completed•Low Profile 3x3 mm DFN Package•Pb−Free Package is AvailableTypical Applications•Wireless Headsets•MP3 Players•USB Appliances•Battery Operated DevicesDevice Package Shipping†ORDERING INFORMATIONNCP1835BMNR2DFN−103000 Units/Reel†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our T ape and Reel Packaging Specification Brochure, BRD8011/D.NCP1835BMNR2G DFN−10(Pb−Free)3000 Units/ReelFigure 1. Typical 50 mA Application CircuitPIN FUNCTION DESCRIPTIONPin Symbol Description1V CC Input Supply Voltage. Provides power to the charger. This pin should be bypassed with at least a 4.7 m F ceramic capacitor to ground.2FAULT An open−drain output indicating fault status. This pin is pulled LOW under any fault conditions. A FAULT condition resets the counter.3CFLG An open−drain output indicating charging or end−of−charge states. The CFLG pin is pulled LOW when the charger is charging a battery. It is forced open when the charge current drops to I EOC. This high impedance mode will belatched until a recharge cycle or a new charge cycle starts.4TIMER Connecting a timing capacitor, C TIME between this pin and ground to set end−of−charge timeout timer.TIMEOUT = 14*C TIME/1.0 nF (minute). The total charge for CC and CV mode is limited to the length of TIMEOUT.Trickle Charge has a time limit of 1/8 of the TIMEOUT period.5GND Ground pin of the IC. For thermal consideration, it is recommended to solder the exposed metal pad on the back-side of the package to ground.6EN Enable logic input. Connect the EN pin to LOW to disable the charger or leave it floating to enable the charger.7V2P8 2.8 V reference voltage output. This pin outputs a 2.8 V voltage source when an adapter is present. The maximum loading for this pin is 2.0 mA.8ISEL The full charge current (I FCHG) can be set by connecting a resistor, R ISEL, from the ISEL pin to ground.For best accuracy, a resistor with 1% tolerance is recommended.9VSNS Battery voltage sense pin. Connect this as close as possible to the battery input connection.10BAT Charge current output. A minimum 4.7 m F capacitor is needed for stability when the battery is not attached.Figure 2. Detailed Block DiagramVSNSBATISELEN GNDTIMER MAXIMUM RATINGSRatingSymbol Value Unit Supply Voltage V CC 7.0V Status Flag Output Pins V FAULT , V CFLG7.0V Voltage Range for Other Pins V io 5.5V Current Out from BAT PinI O 1.2A Thermal CharacteristicsThermal Resistance, Junction−to−Air (Note 3)Power Dissipation, T A = 25°C (Note 3)R q JA P D 68.51.09°C/W WMoisture Sensitivity (Note 4)MSL Level 1Operating Ambient T emperature T A −20 to 70°C Storage T emperature T stg −55 to 125°C ESDHuman Body Model Machine ModelHBM MM2000200V V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.1.This device series contains ESD protection and is tested per the following standards:Human Body Model (HBM) per JEDEC standard: JESD22−A114.Machine Model (MM) per JEDEC standard: JESD22−A115.tchup Current Maximum Rating: 150 mA per JEDEC standard: JESD78.3.Measure on 1 inch sq. of 1 oz. copper area. R q JA is highly dependent on the PCB heatsink area. For example, R q JA can be 38°C/W on 1 inch sq. of 1 oz. copper area on 4 layer PCB that has 1 single signal layer with the additional 3 solid ground or power planes. The maximum package power dissipation limit must not be exceeded:P D +T J(max)*T AR q JAwith R q JA = 68.5°C/W, T J(max) = 100°C, P D = 1.09 W.4.Moisture Sensitivity Level per IPC/JEDEC standard: J−STD−020A.ELECTRICAL CHARACTERISTICS (Typical values are tested at V CC = 5.0 V and room temperature, maximum and minimum values are guaranteed over 0°C to 70°C with a supply voltage in the range of 4.3 V to 6.5 V, unless otherwise noted.)Characteristic Symbol Min Typ Max Unit V CC SUPPLYOperating Supply Range V CC 2.8− 6.5V Rising V CC Threshold V RISE 3.0 3.4 3.95V Falling V CC Lockout Threshold V FALL 2.0 2.4 2.8V Quiescent V CC Pin Supply CurrentShutdown (EN = Low) Normal Operation (EN = High)I VCCI VCC−−30600−−m Am ABattery Drain CurrentManual Shutdown (V CC = 5.0 V, VSNS = 4.0 V, EN = Low)I BMS−− 3.0m ACHARGING PERFORMANCERegulated Output Voltage in Constant Voltage (CV) Mode, I CHG = 10 mA V REG 4.158 4.200 4.242V Dropout Voltage (V BAT = 3.7 V, I CHG = 0.1 A)−−80120mV Pre−Charge Threshold Voltage V PC 2.52 2.8 3.08V Pre−Charge Current (R ISEL = 2.7 M W, V BAT = 2.0 V)I PC 1.02030mA Pre−Charge Current (R ISEL = 270 k W, V BAT = 2.0 V)I PC305065mA Recommended Full Charge Current I FCHG30−300mA Full−Charge Current in Constant Current (CC) Mode (R ISEL = 2.7 M W, V BAT = 3.7 V)I FCHG304558mA Full−Charge Current in Constant Current (CC) Mode (R ISEL = 270 k W, V BAT = 3.7 V)I FCHG280310360mA End−of−Charge Threshold (R ISEL = 2.7 M W, V BAT = V REG)I EOC 1.0 4.011mA End−of−Charge Threshold (R ISEL = 270 k W, V BAT = V REG)I EOC263442mA Recharge Voltage Threshold V RECH 3.80 4.03 4.155V Thermal Foldback Limit (Junction T emperature) (Note 5)T LIM−100−°C OSCILLATOROscillation Period (C TIME = 15 nF)T OSC 2.4 3.0 3.6ms4.55.0 5.56.0 6.5V CC , INPUT VOLTAGE (V)V 2P 8, V 2P 8 V O L T A G E (V )V R E G , R E G U L A T E D O U T P U T V O L T A G E (V )Figure 5. Regulated Output Voltage vs.TemperatureFigure 6. ISEL Voltage vs. Input VoltageFigure 7. V2P8 Voltage vs. Input Voltage−50−25255075T A , AMBIENT TEMPERATURE (°C)V R E G , R E G U L A T E D O U T P U T V O L T A G E (V )1001254.55.05.56.06.5V CC , INPUT VOLTAGE (V)2.53.03.54.04.5V BAT , BATTERY VOLTAGE (V)V 2P 8, V 2P 8 V O L T A G E (V )I P C , T R I C K L E C H A R G E C U R R E N T (m A )4.55.05.56.06.5V CC , INPUT VOLTAGE (V)V R E C H , R E C H A R G E V O L T A G E (V )Figure 12. Recharge Voltage vs. Input Voltage Figure 13. Charge Current vs. Battery VoltageDETAILED OPERATING DESCRIPTIONOverviewRechargeable Li−Ion/Polymer batteries are normally charged with a constant current (CC) until the terminal voltage reaches a fixed voltage threshold, at which point a constant voltage (CV) is applied and the current drawn by the battery decays. The charging rate is determined by the specific rating of the battery. For example, if the battery is rated at 800 mA−hours, then the recommended maximum charge rate is 800 mA. For a severely discharged cell, it takes approximately 2.5−3.5 hours to recharge the battery at the maximum rate. So, when one charges at less than the maximum charge rate, the recharge time increases. Also, the battery should not be continuously charged or the battery could age faster than necessary. Because of this, Li−Ion charging systems need to stop charging within a prescribed time limit regardless of the charge rate.The NCP1835B is a fully integrated, stand−alone 1−cell Li−Ion charger which performs the primary battery charging functions and includes a timer which will terminate charging if the battery has not completed charging within a prescribed time period. The charging rate is user programmable up to 1.0 A and the end−of−charge timer is also programmable. The NCP1835B has a thermal foldback loop which reduces the charge rate if the junction temperature is exceeded. The device also includes several outputs which can be used to drive LED indicators or interface to a microprocessor to provide status information. The adapter providing power to the charger can be a standard fixed output voltage such as a 5.0 V wall adapter or it can be a simple current limited adapter.The NCP1835B comes in two versions with output voltage regulation thresholds of 4.2 or 4.242 V depending on the requirements of the specific battery pack being used. The user determines the charge current by selecting the resistor R ISEL and determines the length of the end−of−charge timeout timer by selecting the capacitor, C TIME.Charging OperationFigure 13 outlines the charging algorithm of the NCP1835B and Figure 14 graphically illustrates this. When the charger is powered up and the input voltage rises above the power−on, rising threshold (nominally 3.4 V), the charger initiates the charging cycle.The NCP1835B first determines the cell voltage. If it is less than the pre−charge threshold (2.8 V), the IC recognizes the battery as severely discharged. In this state, the NCP1835B pre−conditions (trickle charges) the battery by charging it at 10% of the full charge rate (I PC). This slow charge prevents the battery from being damaged from high fast charge currents when it is in a deeply discharged state. The battery voltage should be trickle charged up to 2.8 V before 1/8 of the preset end−of−charge time is expired. If it cannot reach this voltage, than the battery is possibly shorted or damaged. Therefore, the NCP1835B stops charging and the pre−charge timeout signal asserts the FAULT flag.Once the cell voltage crosses the pre−charge threshold, the device will transition to normal (full−rate) charging at 100% of the programmed full rate charge current (I FCHG). As the NCP1835B charges the battery, the cell voltage rises until it reaches the V REG threshold, (4.2 or 4.242 V). At the maximum charge rate, it normally takes about 1 hour to reach this point from a fully discharged state, and the battery will be approximately 70−80% recharged. At this point, the charge transitions to constant voltage mode where the IC forces the battery to remain at a constant voltage, V REG. During this constant voltage state, the current required to maintain V REG steadily decreases as the battery approaches full charge. Charge current eventually falls to a very low value as the battery approaches a fully charged condition.The NCP1835B monitors the current into the battery until it drops to 10% of the full charge rate. This is the End−of−Charge (EOC) threshold. Normally it takes 1.5−2.5 hours to reach this point. Once the NCP1835B reaches end−of−charge it opens the CFLG pin and enters the EOC state. The IC continues to charge the battery until it reaches TIMEOUT. At that point, the NCP1835B stops charging. If the system does not reach EOC during the TIMEOUT period, the NCP1835B views this as a system drops below the recharge threshold (which can occur if the battery is loaded), the IC reinitializes the charging sequence and begins a new charge cycle. The recharge voltage threshold, V RECH, is nominally 4.03 V.In the inhibit state, the NCP1835B continues to monitor the battery voltage, but does not charge the battery. Again, if the battery voltage drops below the recharge threshold the IC reinitializes the charging sequence and begins a new charge cycle.Figure 15. Typical Charging DiagramTrickleCC CV End ofTimeTimeTimeTimeTimeTimeTable 1. Charge StatusConditionCFLG FAULT Trickle, Constant Current and Constant Voltage Charge Low High End−of−Charge or Shutdown ModeHigh High Timeout Fault, V ISEL < 0.35 V or V ISEL > 1.4 VHighLowCharge Status Indicator (CFLG)CFLG is an open−drain output that indicates battery charging or End−of−Charge (EOC) status. It is pulled low when charging in constant current mode and constant voltage mode. It will be forced to a high impedance state when the charge current drops to I EOC. When the charger is in shutdown mode, CFLG will also stay in the high impedance state.Fault Indicator (FAULT)FAULT is an open−drain output that indicates that a charge fault has occurred. It has two states: low or high impedance. In a normal charge cycle, it stays in a high impedance state. At fault conditions, it will be pulled low and terminate the charge cycle. A timeout fault occurs when the full charge or pre−charge timeouts are violated, or if the voltage on ISEL is greater than 1.4 V or lower than 0.35 V. There are two ways to get the charger out of a fault condition and back to a normal charge cycle. One can either toggle the EN pin from GND to a floating state or reset the input power supply.Adapter Present Indicator (V2P8)V2P8 is an input power supply presence indicator. When the input voltage, V CC, is above the power on threshold (V RISE, nominally 3.4 V) and is also 100 mV above the battery voltage, it provides a 2.8 V reference voltage that can source up to 2.0 mA. This voltage can also be used to power a microprocessor I/O.Enable/Disable (EN)Pulling the EN pin to GND disables the NCP1835B. In shutdown mode, the internal reference, oscillator, and control circuits are all turned off. This reduces the battery drain current to less than 3.0 m A and the input supply current to 30 m A. Floating the EN pin enables the charger. Thermal FoldbackAn internal thermal foldback loop reduces the programmed charge current proportionally if the die temperature rises above the preset thermal limit (nominally 100°C). This feature provides the charger protection from over heating or thermal damage. Figure 16 shows the full charge current reduction due to die temperature increase across the thermal foldback limit. For a charger with a 1.0 A constant charge current, the charge current starts decreasing when the die temperature hits 100°C and is reduced to zero when the die temperature rises to 110°C.Figure 16. Full Charge Current vs. JunctionTemperatureICHG,CHARGECURRENTT J, JUNCTION TEMPERATURE分销商库存信息:ONSEMINCP1835BMNR2NCP1835BMNR2G。

SY7201-DATASHEET

Features
• • • • • • • • Input voltage range 2.5V to 30V Switch current limit 2A Drives LED strings up to 30V 1MHz fixed frequency minimizes the external components Internal softstart limits the inrush current Open LED overvoltage protection RoHS Compliant and Halogen Free Compact package: SOT23-6 pin
Recommended Operating Conditions (Note 3) IN, ------------------------------------------------------------------------------------------------------------------- 2.5V to 30V LX, OVP ----------------------------------------------------------------------------------------------------------- 2.5V to 30V All other pins ------------------------------------------------------------------------------------------------------ 0 to 3.6V Junction Temperature Range ------------------------------------------------------------------------------------ -40°C to 125°C Ambient Temperature Range ----------------------------------------------------------------------------------- -40°C to HDN VREF IFB RDS(ON) ILIM VENH VENL VUVLO VHYS FOSC TSD THYST VOCL

NUVOTON NM1817系列微控制器数据手册说明书

ARM Cortex™-M032-BIT MICROCONTROLLER NM1817 Series Product BriefNM1817 SERIES DATASHEET The information described in this document is the exclusive intellectual property ofNuvoton Technology Corporation and shall not be reproduced without permission from Nuvoton.Nuvoton is providing this document only for reference purposes of NuMicro TM microcontroller basedsystem design. Nuvoton assumes no responsibility for errors or omissions.All data and specifications are subject to change without notice.For additional information or questions, please contact: Nuvoton Technology Corporation.TABLE OF CONTENTS1GENERAL DESCRIPTION (3)2FEATURES (4)3PARTS INFORMATION LIST AND PIN CONFIGURATION (8)3.1Selection Guide (8)3.2Pin Configuration (8)3.2.1LQFP44-pin (8)3.3Pin Description (9)4BLOCK DIAGRAM (13)4.1NM1817 Block Diagram (13)5NM1817 ELECTRICAL CHARACTERISTICS (14)5.1NM1120 Absolute Maximum Ratings (14)5.2NM1120 DC Electrical Characteristics (15)5.3NM1120 AC Electrical Characteristics (20)5.3.1**External Input Clock (function has been reserved in NM1817) (20)5.3.2**External 4~24MHz High Speed Crystal (HXT)(function has been reserved in NM1817)215.3.3**Typical Crystal Application Circuits (function has been reserved in NM1817) (21)5.3.448MHz Internal High Speed RC Oscillator (HIRC) (21)5.3.510kHz Internal Low Speed RC Oscillator (LIRC) (21)5.4NM1120 Analog Characteristics (22)5.4.112-bit SAR ADC (22)5.4.2LDO & Power Management (23)5.4.3Brown-out Detector (23)5.4.4Power-on Reset (24)5.4.5Comparator (24)NM1817 SERIES DATASHEET5.4.6PGA (24)5.4.7Temperature Sensor (25)5.5NPT23011 Absolute Maximum Ratings (25)5.6NPT23011 Recommended Operating Conditions (26)5.7NPT23011 Static Electrical Characteristics (26)5.8NPT23011 Dynamic Electrical Characteristics (27)5.9DC Electrical Characteristic for LDO_5V_OUT (27)6PACKAGE DIMENSION (28)6.1LQFP 44-pin(10mm x 10mm) (28)7ORDERING INFORMATION (30)8REVISION HISTORY (31)1 GENERAL DESCRIPTIONThe NM1817 series 32-bit microcontroller(MCU) is embedded with ARM®Cortex™-M0 core andthree phase half-bridge power MOSFET and IGBT drivers with independent high and low sidereferenced output channels for motor driver applications which require high performance andintegration. The Cortex™-M0 is the ARM® embedded processor with 32-bit performance at a costequivalent to the traditional 8-bit microcontroller.The MCU of NM1817 series can run up to 48MHz and offers 29.5K-bytes embedded program flash,size configurable Data Flash (shared with program flash), 2K-byte flash for the ISP, 1.5K-byteSPROM for security, and 4K-byte SRAM. Plentiful system level peripheral functions, such as I/OPort, Timer, UART, SPI, I2C, PWM, ADC, Watchdog Timer, Analog Comparator and Brown-outDetector, have been incorporated into the NM1817 series in order to reduce component count,board space and system cost. These useful functions make the NM1817 series powerful for a widerange of motor driver applications.The floating channel can be used to drive an N-channel power MOSFET or IGBT in the high sideconfiguration which operates up to 600 volts. It’s also built-in the temperature sense output signalfor MCU detection & one comparator for over current protectionAdditionally, the NM1817 is equipped with ISP (In-System Programming) and ICP (In-CircuitProgramming) functions, which allow the user to update the program memory without removing thechip from the actual end product.NM1817 is the combination of NM1120 and NPT23011 Gate Driver. User may refer to the TRM ofNM1120 and the datasheet of NPT23011 for the detailed specification. The NM1120 BSP is alsofor NM1817 software developing.NM1120NPT23011NM1817NM1817 SERIES DATASHEETNM1817 SERIES DATASHEET2 FEATURES● Gate Driver⏹ Programmable enable/disable gate driver by MCU I/O of PC.4⏹ Floating channel designed for bootstrap operation up to + 600V⏹ Gate driver supply range from 12 to 18V⏹ VCC/VBS Under-voltage lock-out⏹ Cross conduction prevention⏹ High side output in phase with HIN● MCU Core⏹ ARM ® Cortex™-M0 core running up to 48MHz⏹ One 24-bit system timer⏹ Supports Low Power idle mode.⏹ A single-cycle 32-bit hardware multiplier⏹ NVIC for the 32 interrupt inputs, each with 4-level of priority⏹ Supports Serial Wire Debug (SWD) interface and two watch points/fourbreakpoints● Memory⏹ 29.5Kbytes Flash memory for program memory (APROM)⏹ Configurable Flash memory for data memory (Data Flash)⏹ 2KB Flash memory for loader (LDROM)⏹ Three 0.5KB Flash memory for security protection (SPROM)⏹ 4KB SRAM for internal scratch-pad RAM (SRAM)● Clock Control⏹ 48MHz internal oscillator (HIRC) (±1% accuracy at 250C, 5V)⏹ 10kHz internal low-power oscillator (LIRC) for Watchdog Timer and idle wake-up ● I/O Port⏹ Up to 15 general-purpose I/O (GPIO) pins⏹ Four I/O modes:◆ Quasi-bidirectional input/output◆ Push-Pull output◆ Open-Drain output◆ Input only with high impedance⏹ Optional TTL/Schmitt trigger input⏹ I/O pin can be configured as interrupt source with edge/level setting ⏹ Supports high driver and high sink I/O mode⏹ GPIO built-in Pull-up/Pull-low resistor for selection.● Timer⏹ Provides two channel 32-bit Timers; one 8-bit pre-scalar counter with 24-bit up-NM1817 SERIES DATASHEETtimer for each timer⏹ Independent clock source for each timer⏹ Provides One-shot, Periodic, Toggle and Continuous operation modes ⏹ 24-bit up counter value is readable through TDR (Timer Data Register) ⏹ Provides trigger counting/free counting/counter reset function triggered byexternal capture pin or internal comparator signal⏹ Supports event counter function⏹ Supports Toggle Output mode⏹ Supports wake-up from Idle or Power-down mode● Continuous Capture⏹ Timer0, Timer1 and Systick support Continuous Capture function which cancontinuously capture at most 4 edges on one signal● Enhanced Input Capture⏹ One unit of 24-bit input capture counter.⏹ Capture source:◆ I/O inputs: ECAP0, ECAP1 and ECAP2◆ ACMP Trigger◆ ADC Trigger● WDT (Watchdog Timer)⏹ Programmable clock source and time-out period⏹ Supports wake-up function in Power-down mode and Idle mode⏹ Interrupt or reset selectable on watchdog time-out● EPWM(Enhanced PWM Generator)⏹ Support a built-in 16-bit PWM clock generators, providing six PWM outputs orthree complementary paired PWM outputs⏹ Shared same clock source, clock divider, period and dead-zone generator ⏹ Supports group/independent/complementary modes⏹ Supports One-shot or Auto-reload mode⏹ Supports Edge-aligned and Center-aligned type⏹ Support Asymmetric mode⏹ Programmable dead-zone insertion between complementary channels ⏹ Each output has independent polarity setting control⏹ Hardware fault brake and software brake protections⏹ Supports rising, falling, central, period, and fault break interrupts⏹ Supports duty/period trigger A/D conversion⏹ Timer comparing matching event trigger PWM to do phase change⏹ Supports comparator event trigger PWM to force PWM output low for currentperiod⏹ Provides interrupt accumulation function⏹ Gate driver PWM output by MCU PWM controlif the ENGD pin of NM1817 is set to high level, then the output status ofNM1120 and gate driver is as the following table.MCU PWM Control Gate Driver PWM OutputPWM0/2/4 PWM1/3/5 UHO/VHO/WHO ULO/VLO/WLOH L ON OFFL H OFF ONL L OFF OFFH H OFF OFFOtherwise, if the ENGD pin of NM1817 is set to low level, then the output of gate driver is all off.●BPWM (Basic PWM Generator)⏹One 16-bit PWM generator which supports one 8-bit pre-scalar, one clock divider,two PWM timers (down counter) and one dead-zone generator⏹Two independent outputs or one complementary paired outputs.⏹PWM Interrupt request synchronized with PWM period⏹Edge-aligned type or Center-aligned type option●USCI (Universal Serial Control Interface Controller)⏹Two USCI devices⏹Supports to be configured as UART, SPI, I²C individually⏹Supports programmable baud-rate generator●ADC (Analog-to-Digital Converter)⏹12-bit ADC with 1M SPS⏹Supports 2 sample/holdNM1817 SERIES DATASHEET⏹Up to 8-ch single-end inputfrom I/O and one internal input from band-gap.⏹Conversion started either by software trigger, PWM trigger, ACMP trigger orexternal pin trigger⏹Supports temperature sensor for measureing chip temperature⏹Support Simultaneous and Sequential function to continuous conversion 4channels maximum.●Programmable Gain Amplifier (PGA)⏹Supports 8 level gain selects from 1, 2, 3, 5, 7, 9, 11 and 13.⏹Unity gain frequency up to 8MHz●Analog Comparator⏹Two analog comparators with programmable 16-level internal voltage reference⏹Build-in CRV (comparator reference voltage)⏹Supports Hysteresis function⏹Interrupt when compared results changed●Hardware Divider⏹Signed (two’s complement) integer calculation⏹32-bit dividend with 16-bit divisor calculation capacity⏹32-bit quotient and 32-bit remainder outputs (16-bit remainder with sign extendsto 32-bit)⏹Divided by zero warning flag⏹ 6 HCLK clocks taken for one cycle calculation⏹Waiting for calculation ready automatically when reading quotient and remainder●ISP (In-System Programming) and ICP (In-Circuit Programming)●BOD (Brown-out Detector)⏹8 programmable threshold levels:4.3V/4.0V/3.7V/3.0V/2.7V/2.4V/2.2V/2.0V⏹Supports Brown-out interrupt and reset option●96-bit unique ID●LVR (Low Voltage Reset)●Operating Temperature: -40℃~105℃●Packages:⏹44-pin LQFP (10x10mm)⏹Package is Halogen-free, RoHS-compliant and TSCA-compliant.NM1817 SERIES DATASHEETNM1817 SERIES DATASHEET3 PARTS INFORMATION LIST AND PIN CONFIGURATION3.1 Selection Guide P a r t N u m b e rF l a s h (K B ) S R A M (K B )I S PL o a d e r R O M(K B ) D a t a F l a s h I /O T im e r Connectivity I R C 48 M H z * B O D P W M An a l o g C o m p .P G A A D C (12-B it )Te m p er a t u r eS e n s orIC P /I S P I /A PPac k a geUSCI U A R T * I 2C S P I NM1817NT 29.5 4 2 √ 15 2 2 2 2 1 1 6 2 1 8x12bit 1 √ LQFP44Table 3.1-1 NM1817 Series Selection Guide3.2 Pin Configuration3.2.1 LQFP44-pin2401436587109114438373635342930272825262324121314151718192021162231323342433941NM1817LQFP 44-pin PB.1/ADC0_CH1/ACMP0_P1/ECAP_P1PB.2/ADC0_CH2/BPWM_CH1/ACMP0_P2/ECAP_P2PC.1/ADC0_CH4/STADC/ACMP0_P3/ACMP1_P1/SPI0_MOSI/SPI1_MISO /RESET PC.3/ACMP1_O/PGA_O/SPI0_CLK/SPI1_SS PD.1/ICE_CLK/ACMP1_P2/I2C0_SCL/SPI0_CLK/SPI1_SS/UART0_TXD PC.0/ADC0_CH3/BPWM_CH0/ACMP1_P0/I2C1_SCL/SPI0_SS/SPI1_CLK/UART1_TXDNCPD.5/UART0_TXDU_VS NC V_LOW_LOU_LO W_HOPC.2/ADC1_CH2/BRAKE/CCAP_P1/I2C1_SDA/SPI0_MISO/SPI1_MOSI/UART1_RXD W_VB NCNCCOMVCCNC PB.3/ACMP1_N/PGA_I/TM0U_VB PD.6/UART0_RXD VDD PB.0/ADC0_CH0/ACMP0_P0/ECAP_P0VSS ENGD V_HO NC V_VS NC NCLDO_CAP NC PB.4/ADC1_CH0/ACMP0_N/TM1U_HO PD.4/BPWM_CH0/UART1_RXD V_VB W_VSLDO_5V_OUT PD.2/ICE_DAT/ADC1_CH1/CCAP_P0/I2C0_SDA/SPI0_MOSI/SPI1_MISO/UART0_RXD PD.3/BPWM_CH1/UART1_TXDFigure 3.2-1 NM1817 LQFP 44-pin Diagram3.3 Pin DescriptionNM1120 NPT23011 NM1817NTPin Name Pin Type Description TSSOP28 SOP-20 LQFP 44-pin2 LDO_5V_OUT A 5V LDO output26 4 ENGD I Gate driver enable pin. The pin is also internally connected to PC.4 of NM1120.27 5 LDO_CAP P LDO output pin28 6 VSS P Ground pin for digital circuit 1 7 VDD P Power supply for digital circuit2 8 PD.6 I/O General purpose digital I/O pin UART0_RXD I Data receiver input pin for UART0.3 9 PB.0 I/O General purpose digital I/O pin.ADC0_CH0 A ADC0 channel0 analog input.ACMP0_P0 A Analog comparator0 positive input pin. ECAP_P0 I Enhanced Input Capture input pin4 10 PB.1 I/O General purpose digital I/O pin.ADC0_CH1 A ADC0 channel1 analog input.ACMP0_P1 A Analog comparator0 positive input pin. ECAP_P1 I Enhanced Input Capture input pin5 11 PB.2 I/O General purpose digital I/O pin.ADC0_CH2 A ADC0 channel2 analog input.BPWM_CH1 I/O PWM channel1 output/capture input. ACMP0_P2 A Analog comparator0 positive input pin. ECAP_P2 I Input capture channel 26 12 PB.4 I/O General purpose digital I/O pin.ADC1_CH0 A ADC1 channel0 analog input.ACMP0_N A Analog comparator0 negative input pin. TM1 I/OTimer1 event counter input / toggleoutput7 13 PC.1 I/O General purpose digital I/O pin.ADC0_CH4 A ADC0 channel4 analog input.STADC I ADC external trigger input.ACMP0_P3 A Analog comparator0 positive input pin.ACMP1_P1 A Analog comparator1 positive input pin.SPI0_MOSI I/O SPI0 1st MOSI (Master Out, Slave In)pin.SPI1_MISO I/O SPI1 MISO (Master In, Slave Out) pin.NM1817 SERIES DATASHEET8 14 nRESET I External reset input: active LOW, withan internal pull-up. Set this pin low resetto initial state.9 15 PB.3 I/O General purpose digital I/O pin. ACMP1_N A Analog comparator1 negative input pin. PGA_I A PGA input pinTM0 I/O Timer0 event counter input / toggleoutput10 16 PC.2 I/O General purpose digital I/O pin.ADC1_CH2 A ADC1 channel2 analog input.BRAKE I Brake input pin of EPWM.CCAP_P1 I Timer Continuous Capture input pinI2C1_SDA I/O I2C1 data input/output pin.SPI0_MISO I/O SPI0 1st MISO (Master In, Slave Out)pin.SPI1_MOSI I/O SPI1 MOSI (Master Out, Slave In) pin. UART1_RXD I Data receiver input pin for UART1.11 17 PD.2 I/O General purpose digital I/O pin.ICE_DAT I/O Serial wired debugger data pinADC1_CH1 A ADC1 channel1 analog input.CCAP_P0 I Timer Continuous Capture input pinI2C0_SDA I/O I2C0 data input/output pin.SPI0_MOSI I/O SPI0 1st MOSI (Master Out, Slave In)pin.SPI1_MISO I/O SPI1 MISO (Master In, Slave Out) pin. UART0_RXD I Data receiver input pin for UART0.12 18 PD.3 I/O General purpose digital I/O pin. BPWM_CH1 I/O PWM channel1 output/capture input. UART1_TXD O Data transmitter output pin for UART1.18 19 PC.3 I/O General purpose digital I/O pin. ACMP1_O O Analog comparator1 output. PGA_O A PGA output pinSPI0_CLK I/O SPI0 serial clock pin.SPI1_SS I/O SPI1 slave select pin17 20 PD.1 I/O General purpose digital I/O pin.ICE_CLK I Serial wired debugger clock pinACMP1_P2 A Analog comparator1 positive input pin.I2C0_SCL I/O I2C0 clock pin.NM1817 SERIES DATASHEETSPI0_CLK I/O SPI0 serial clock pin.SPI1_SS I/O SPI1 slave select pinUART0_TXD O Data transmitter output pin for UART0.16 21 PD.4 I/O General purpose digital I/O pin. BPWM_CH0 I/O PWM channel0 output/capture input. UART1_RXD I Data receiver input pin for UART1.15 22 PC.0 I/O General purpose digital I/O pin.ADC0_CH3 A ADC0 channel3 analog input.BPWM_CH0 I/O PWM channel0 output/capture input. ACMP1_P0 A Analog comparator1 positive input pin. I2C1_SCL I/O I2C1 clock pin.SPI0_SS I/O SPI0 slave select pin.SPI1_CLK I/O SPI1 serial clock pinUART1_TXD O Data transmitter output pin for UART1.19 23 PD.5 I/O General purpose digital I/O pin. UART0_TXD O Data transmitter output pin for UART0.7 24 W_LO HO Low side gate driver output8 26 W_VS HP High side floating supply return9 27 W_HO HO High side gate driver output10 28 W_VB HP High side floating supply11 31 COM HP Low side power supply return12 32 VCC HP Low side and logic fixed power supply13 33 V_LO HO Low side gate driver output14 35 V_VS HP High side floating supply return15 36 V_HO HO High side gate driver output16 37 V_VB HP High side floating supply17 40 U_LO HO Low side gate driver output18 42 U_VS HP High side floating supply return19 43 U_HO HO High side gate driver output20 44 U_VB HP High side floating supply25 1 HIN1 PWM0 connect to HIN124 2 LIN1 PWM1 connect to LIN123 3 HIN2 PWM2 connect to HIN222 4 LIN2 PWM3 connect to LIN221 5 HIN3 PWM4 connect to HIN320 6 LIN3 PWM5 connect to LIN3NM1817 SERIES DATASHEET13,14 1,3,25,29,30,34,38,39,41 No connected[1] Low voltage I/O type description. I: input, O: output, I/O: quasi bi-direction, D: open-drain, P:power pin, ST: Schmitt trigger, A: Analog input.[2] High voltage I/O type description. HI: input, HO: output, HP: power pin.NM1817 SERIES DATASHEETNM1817 SERIES DATASHEET 4 BLOCK DIAGRAM4.1 NM1817 Block Diagram Cortex-M048 MHz Clock Controller AHB APB-Bridge GPIO PA~PD ADC 8ch/12bit Watch Dog Timer Advanced Capture Serial Port UART/SPI/I2C EPWM 0~5Timer 0/1Flash Control ISP 4KB Info Option LDROM 2KB CONFIG SRAM 4KB 2 sets *ComparatorHW Divider 4~24MHz XTAL 32.768kHz XTAL 48MHz RC OSC10kHz RC OSC VHin VLin WHin WLinULin UHinBPWM 0~1MCU AP ROM29.5KB SP ROM 1.5KB Configurable Data FLASH (Share with AP ROM)PWM2PWM3PWM4PWM5PWM1PWM0Gate DriverPULSE GEN RSQU_VBU_HOU_VSU_LOR VCC 100K DRIVERDRIVER UVLOU Phase DriverV Phase Driver V_VB V_HO V_VS V_LO W Phase Driver W_VB W_HOW_VS W_LOCOMUHIN VCC_UVLO VCC ULIN VCC VHINVLIN VCC WHIN WLIN NOISE FILTER CROSS CONDUCTION PREVENTION CONTROL LOGICLDO VCCLDO_5V_OUTVCCEnhanced Input Capture ENGDPC.4En VSS 100KFigure 4.1-1 NM1817 Block Diagram5 NM1817 ELECTRICAL CHARACTERISTICSThe electrical characteristics refer to both MCU NM1120 and Gate Driver NPT23011.According to Figure 4.1-1, we can list a table of pin definition in NM1817 as below:Alternative function , MFP_0 means setting MFP[3:0]=0x0, MFP_5 means MFP[3:0]=0x5GPIO ICE XTAL ADC PWM_BRAKE ACMP0ACMP1PGA(OP)TIMER I2C SPIO SPI1UARTMFP_0MFP_1MFP_2MFP_3MFP_4MFP_5MFP_6MFP_7MFP_8MFP_9MFP_A MFP_BGPA0CLKO O EPWM_CH0O I²C1_SCL I/O SPI0_SS I/O SPI1_CLK I/O UART1_TXD OGPA1EPWM_CH1O I²C1_SDA I/O SPI0_MISO I/O SPI1_MOSI I/O UART1_RXD IGPA2EPWM_CH2O I²C0_SDA I/O SPI0_MOSI I/O SPI1_MISO I/O UART0_RX D IGPA3EPWM_CH3O I²C0_SCL I/O SPI0_CLK I/O SPI1_SS I/O UART0_TX D OGPA4XT_IN A EPWM_CH4OGPA5XT_OUT A EPWM_CH5O ACMP0_O OGPB0ADC0_CH0A ACMP0_P0A ICAP0IGPB1ADC0_CH1A ACMP0_P1A ICAP1IGPB2ADC0_CH2A BPWM_CH1O ACMP0_P2A ICAP2IGPB3ACMP1_N A PGA_I A T0I/OGPB4ADC1_CH0A ACMP0_N A T1I/OGPC0ADC0_CH3A BPWM_CH0O ACMP1_P0A I²C1_SCL I/O SPI0_SS I/O SPI1_CLK I/O UART1_TXD OGPC1ADC0_CH4A STADC I ACMP0_P3A ACMP1_P1A SPI0_MOSI I/O SPI1_MISO I/OGPC2ADC1_CH2A PWM_BRAKE I CCAP I I²C1_SDA I/O SPI0_MISO I/O SPI1_MOSI I/O UART1_RXD IGPC3ACMP1_O O PGA_O A SPI0_CLK I/O SPI1_SS I/OGPC4ICAP0InRESETGPD1ICE_CLK I ACMP1_P2A I²C0_SCL I/O SPI0_CLK I/O SPI1_SS I/O UART0_TX D OGPD2ICE_DAT I/O ADC1_CH1A CCAP I I²C0_SDA I/O SPI0_MOSI I/O SPI1_MISO I/O UART0_RX D IGPD3BPWM_CH1O UART1_TX D OGPD4BPWM_CH0O UART1_RXD IGPD5UART0_TX D OGPD6UART0_RX D IVDDVSS: Function has been reserved for another usage.Attention :a. Some functions would be prohibition because of the limitation of pin definition in NM1817.b. GPA0 ~ GPA5 should be set as EPWM0 ~ EPWM5, GPC4 should be set as GPIO.NM1817 SERIES DATASHEET5.1 NM1120 Absolute Maximum RatingsSymbol Parameter Min Max UnitV DD-V SS DC Power Supply-0.3+7.0V V IN Input Voltage V SS -0.3V DD +0.3V 1/t CLCL Oscillator Frequency424MHz T A Operating Temperature-40+105℃T ST Storage Temperature-55+150℃I DD Maximum Current into VDD-120mAI SS Maximum Current out of VSS-120mAI IO Maximum Current sunk by an I/O pin-35mA Maximum Current sourced by an I/O pin-35mA Maximum Current sunk by total I/O pins-100mA Maximum Current sourced by total I/O pins-100mAaffects the life and reliability of the device.5.2 NM1120 DC Electrical Characteristics(V DD - V SS = 2.1 ~ 5.5 V, T A = 25︒C)Symbol Parameter Min Typ Max Unit Test ConditionsNM1817 SERIES DATASHEETV DD Operation voltage 2.1 - 5.5 V V DD = 2.1V ~ 5.5V up to 48 MHz V SS/A VSS Power Ground -0.3 - - VV LDO LDO Output Voltage 1.5 VV BG Band-gap Voltage3 1.14 1.20 1.24 V V DD = 3.0V ~ 5.5V, T A = -40︒C~105︒CI DD5Operating CurrentNormal Run ModeHCLK = 48 MHz - 9.7 - mAV DD**HXT HIRCAll DigitalModules5.5V X 48 MHz VI DD6- 7.4 - mA 5.5V X 48 MHz X I DD7- 9.7 - mA 3V X 48 MHz V I DD8- 7.4 - mA 3V X 48 MHz XI DD1Operating CurrentNormal Run ModeHCLK = 24 MHz - 5.4 - mAV DD**HXT HIRCAll DigitalModules5.5V 24 MHz X VI DD2- 4.4 - mA 5.5V 24 MHz X X I DD3- 5.4 - mA 3V 24 MHz X V I DD4- 4.4 - mA 3V 24 MHz X XI DD9Operating CurrentNormal Run ModeHCLK = 16 MHz -3.7- mAV DD**HXT HIRCAll DigitalModules5.5V 16 MHz X VI DD10- 3.0 - mA 5.5V 16 MHz X X I DD11- 3.7 - mA 3V 16 MHz X V I DD12- 3.1 - mA 3V 16 MHz X XI DD9Operating CurrentNormal Run ModeHCLK = 12 MHz - 2.8 - mAV DD**HXT HIRCAll DigitalModules5.5V 12 MHz X VI DD10- 2.3 - mA 5.5V 12 MHz X XI DD11- 2.8 - mA 3V 12 MHz X VI DD12- 2.3 - mA 3V 12 MHz X XNM1817 SERIES DATASHEETI DD13Operating CurrentNormal Run ModeHCLK = 4 MHz - 1.2 - mAV DD**HXT HIRCAll DigitalModules5.5V 4 MHz X VI DD14- 1.0 - mA 5.5V 4 MHz X X I DD15- 1.2 - mA 3V 4 MHz X V I DD16- 1.0 - mA 3V 4 MHz X XI DD17Operating CurrentNormal Run ModeHCLK = 32 kHz - 291.7 - μAV DD**LXT LIRCAll DigitalModules5.5V 32 KHz V V[1]I DD18- 290.7 - μA 5.5V 32 KHz V X I DD19- 280.8 - μA3V 32 KHz V V[1] I DD20- 281.4 - μA3V 32 KHz V XI DD17Operating CurrentNormal Run ModeHCLK = 10 kHz - 248.0 - μAV DD**HXT LIRCAll DigitalModules5.5V X 10 KHz V[2]I DD18- 247.7 - μA 5.5V X 10 KHz X I DD19- 237.9 - μA3V X 10 KHz V[2] I DD20- 237.5 - μA3V X 10 KHz XI IDLE5Operating CurrentIdle ModeHCLK= 48 MHz - 4.9 - mAV DD**HXT HIRCAll DigitalModules5.5V X V VI IDLE6- 2.6 - mA 5.5V X V X I IDLE7- 4.9 - mA 3V X V V I IDLE8- 2.6 - mA 3V X V XI IDLE1Operating CurrentIdle ModeHCLK = 24 MHz - 2.8 - mAV DD**HXT HIRCAll DigitalModules5.5V 24 MHz X VI IDLE2- 1.9 - mA 5.5V 24 MHz X XI IDLE3- 2.8 - mA 3V 24 MHz X VI IDLE4- 1.9 - mA 3V 24 MHz X XNM1817 SERIES DATASHEETI IDLE9Operating CurrentIdle ModeHCLK = 16 MHz - 2.0 - mAV DD**HXT HIRCAll DigitalModules5.5V V X VI IDLE10- 1.3 - mA 5.5V V X X I IDLE11- 2.0 - mA 3V V X V I IDLE12- 1.4 - mA 3V V X XI IDLE9Operating CurrentIdle ModeHCLK = 12 MHz - 1.5 - mAV DD**HXT HIRCAll DigitalModules5.5V V X VI IDLE10- 1.0 - mA 5.5V V X X I IDLE11- 1.5 - mA 3V V X V I IDLE12- 1.0 - mA 3V V X XI IDLE13Operating CurrentIdle ModeHCLK = 4 MHz - 0.8 - mAV DD**HXT HIRCAll DigitalModules5.5V V X VI IDLE14- 0.6 - mA 5.5V V X X I IDLE15- 0.7 - mA 3V V X V I IDLE16- 0.6 - mA 3V V X XI DD17Operating CurrentIdle ModeHCLK = 32 kHz - 274.3 - μAV DD**HXT LIRCAll DigitalModules5.5V X V V[1]I DD18- 273.0 - μA 5.5V X V X I DD19- 265.0 - μA3V X V V[1] I DD20- 263.9 - μA3V X V XI DD17Operating CurrentIdle ModeHCLK = 10 kHz - 232.6 - μAV DD**HXT LIRCAll DigitalModules5.5V X V V[2]I DD18- 232.2 - μA 5.5V X V XI DD19- 222.5 - μA3V X V V[2]I DD20- 222.1 - μA3V X V XNM1817 SERIES DATASHEETI PWD1Standby CurrentPower-down Mode(Deep Sleep Mode) - 1.9 - μAV DD = 5.5V, All oscillators and analogblocks turned off.I PWD2- 1.7 - μA V DD= 3V, All oscillators and analog blocks turned off.I LK Input LeakageCurrentPA/PB/PC/PD-1 - +1 μAV DD = 5.5V, 0 < V IN< V DDOpen-drain or input only modeV IL1Input Low VoltagePA/PB/PC/PD (TTLInput)-0.3 1.33VV DD = 5.5 V-0.3 1 V DD = 3.3 VV IH1Input High VoltagePA/PB/PC/PD (TTLInput)1.47V DD +0.3VV DD = 5.5 V1.08V DD +0.3V DD = 3.3 VV ILS Negative-goingThreshold(Schmitt Input),nRESET- - 0.3V DD V -V IHS Positive-goingThreshold(Schmitt Input),nRESET0.7V DD- - V -R RST Internal nRESETPin Pull-up Resistor48 148 kΩV DD = 2.1 V ~ 5.5VV ILS Negative-goingThreshold(Schmitt input),PA/PB/PC/PD- - 0.3V DD V -V IHS Positive-goingThreshold(Schmitt input),PA/PB/PC/PD0.7V DD- - V -I IL Logic 0 InputCurrentPA/PB/PC/PD(Quasi-bidirectionalMode)- -63.65 μA V DD = 5.5 V, V IN = 0VI TL Logic 1 to 0Transition CurrentPA/PB/PC/PD- -566.7 - μA V DD = 5.5 VI SR11Source CurrentPA/PB/PC/PD(Quasi-bidirectionalMode) - -372 - μA V DD = 4.5 V, V IN = 2.4 VI SR12- -76.8 - μA V DD = 2.7 V, V IN = 2.2 V I SR13- -37.3 - μA V DD = 2.1 V, V IN = 1.8 VI SR21Source CurrentPA/PB/PC/PD - -19.2 - mA V DD = 4.5 V, V IN = 2.4 VI SR22- -4 - mA V DD = 2.7 V, V IN = 2.2 VNM1817 SERIES DATASHEETNM1817 SERIES DATASHEET I SR23 (Push-pull Mode) - -2 - mA V DD = 2.1 V, V IN = 1.8 V I SK11 Sink Current PA/PB/PC/PD(Quasi-bidirectional,Open-Drain andPush-pull Mode) - 12.8 - mA V DD = 4.5 V, V IN = 0.4 V I SK12 - 8.1 - mA V DD = 2.7 V, V IN = 0.4 VI SK13 - 6 - mA V DD = 2.1 V, V IN = 0.4 V Notes:1. Only enable modules which support 32kHz LIRC clock source2. Only enable modules which support 10kHz LIRC clock source3. Guaranteed by design, not test in production.** : The function has been reserved in NM1817.5.3 NM1120 AC Electrical Characteristics5.3.1 **External Input Clock (function has been reserved in NM1817)Symbol Parameter Min Typ Max Unit Test Conditions t CHCX Clock High Time 10 - - ns - t CLCX Clock Low Time 10 - - ns - t CLCH Clock Rise Time 2 - 15 ns - t CHCL Clock Fall Time 2 - 15 ns -t CHCX90%10%t CLCHt CHCL t CLCXt CLCL0.3 V DD0.7 V DDNM1817 SERIES DATASHEET5.3.2 **External 4~24MHz High Speed Crystal (HXT)(function has been reserved in NM1817) Symbol Parameter Min. Typ. Max Unit Test Conditions V HXT Operation Voltage 2.1 - 5.5 V -T A Temperature -40 - 105 ℃ -I HXT Operating Current - 414 - uA 12MHz, V DD = 5.5V f HXT Clock Frequency 4 - 24 MHz -5.3.3 **Typical Crystal Application Circuits (function has been reserved in NM1817) Crystal C1 C24MHz ~ 24MHz 10~20 pF 10~20pFFigure 5-1 NM1120 Typical Crystal Application Circuit5.3.4 48MHz Internal High Speed RC Oscillator (HIRC)Symbol Parameter Min Typ Max Unit Test Conditions V HRC Supply Voltage - 1.5 - V -f HRC Center Frequency - 48 - MHz -Calibrated Internal Oscillator Frequency -1 - +1 % T A = 25 ℃V DD = 5.5 V2% % T A = -40℃~105℃V DD =2.5 V~ 5.5 VI HRC Operating Current - 1090 - μA T A = 25 ℃,V DD = 5 V5.3.5 10kHz Internal Low Speed RC Oscillator (LIRC)Symbol Parameter Min Typ Max Unit Test ConditionsXTAL1C1C2XTAL24~24 MHzCrystal Vss VssNM1817 SERIES DATASHEET V LRC Supply Voltage - 1.5V - V -f LRCCenter Frequency - 10 - kHz -Oscillator Frequency -50[1] - +50[1] % V DD = 2.1 V ~ 5.5 VT A = -40℃ ~ +105℃I LRC Operating Current - 0.4 - μA T A = 25 ℃,V DD = 5 V5.4 NM1120 Analog Characteristics5.4.1 12-bit SAR ADC Symbol Parameter Min Typ Max Unit Test Condition - Resolution - - 12 Bit -DNL Differential Nonlinearity Error - ±2 - LSB VDD = 5.5V INL Integral Nonlinearity Error - ±1 - LSB VDD = 5.5V E O Offset Error - -0.33 - LSB VDD = 5.5V E G Gain Error (Transfer Gain) - 0.33 - LSB VDD = 5.5V E A Absolute Error - -2.62 - LSB VDD = 5.5V - Monotonic Guaranteed - -F ADC ADC Clock Frequency 12 16 MHz V DD = 3.0 ~5.5 VT ACQ Acquisition Time (Sample Stage) N+11/F ADC V DD = 3.0 ~5.5 VN is sampling counter, N=1~1024200 ns V DD = 3.0~5.5 VT CONV Conversion Time 3 1000 1050 ns V DD = 3.0~5.5 V V DD Supply Voltage 3.0 - 5.5 V -I DDA Supply Current (Avg.) - 1 - mA V DD = 5.5 V V IN Analog Input Voltage 0 - AV DD V -C IN Input Capacitance 2 - 1.6 - pF -R IN Input Load 2 - 2.5 - kΩ -1. ADC voltage reference is the same with V DD .2. It’s for sample and hold. The maximum value depends on process variation. Basically, the variation of CIN is less than about 10% of typical value and the variation of RIN is less about 20% of typical value.3. Guaranteed by design, not test in production.The conversion time is up to auto-completion of analog comparison in ADC IP and the typical value is about 1000ns at V DD = 5V.。

DMN2004DWK-7;中文规格书,Datasheet资料

Features• Dual N-Channel MOSFET • Low On-Resistance • Low Gate Threshold Voltage • Low Input Capacitance • Fast Switching Speed • Low Input/Output Leakage • Ultra-Small Surface Mount Package • Lead Free By Design/RoHS Compliant (Note 1) • ESD Protected up to 2KV • "Green" Device (Note 2) • Qualified to AEC-Q101 standards for High ReliabilityMechanical Data• Case: SOT363 • Case Material: Molded Plastic, “Green” MoldingCompound. UL Flammability Classification Rating 94V-0 • Moisture Sensitivity: Level 1 per J-STD-020 • Terminal Connections: See Diagram • Terminals: Finish - Matte Tin annealed over Alloy 42leadframe. Solderable per MIL-STD-202, Method 208 • Weight: 0.006 grams (approximate)Ordering Information (Note 3)Part Number Case Packaging DMN2004DWK-7SOT363 3000/Tape & ReelNotes: 1. No purposefully added lead.2. Diodes Inc.’s “Green” policy can be found on our website at .3. For packaging details, go to our website at .Marking InformationDate Code KeyYear 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017 Code T U V W X Y Z A B C D EMonth Jan Feb Mar Apr MayJun Jul Aug Sep Oct Nov Dec Code 1 2 3 4 5 6 7 8 9 O NDSOT363Top ViewTop ViewInternal SchematicNAB = Marking Code YM = Date Code Marking Y = Year (ex: T = 2006) M = Month (ex: 9 = September) ESD PROTECTED TO 2kVNAB YM N A B Y MMaximum Ratings @T A = 25°C unless otherwise specifiedCharacteristic Symbol Value UnitsDrain-Source Voltage V DSS20 V Gate-Source VoltageV GSS±8 V Drain Current (Note 4)SteadyStateT A = 25°C T A = 85°CI D 540 390mAPulsed Drain Current (Note 5) I DM1.5 AThermal Characteristics @T A = 25°C unless otherwise specifiedCharacteristic Symbol Value UnitsTotal Power Dissipation (Note 4) P D 200 mW Thermal Resistance, Junction to Ambient R θJA 625 °C/W Operating and Storage Temperature Range T J, T STG -65 to +150 °CElectrical Characteristics @T A = 25°C unless otherwise specifiedCharacteristic Symbol Min Typ Max Unit Test ConditionOFF CHARACTERISTICS (Note 6) Drain-Source Breakdown Voltage BV DSS 20 ⎯ ⎯ V V GS = 0V, I D = 10μA Zero Gate Voltage Drain Current I DSS ⎯ ⎯ 1 μA V DS = 16V, V GS= 0V Gate-Source Leakage I GSS ⎯ ⎯ ±1 μA V GS = ±4.5V, V DS = 0V ON CHARACTERISTICS (Note 6)Gate Threshold Voltage V GS(th)0.5 ⎯ 1.0 V V DS = V GS , I D = 250μA Static Drain-Source On-Resistance R DS (ON)⎯ 0.4 0.5 0.7 0.550.70 0.9 Ω V GS = 4.5V, I D = 540mA VGS = 2.5V, I D = 500mA V GS = 1.8V, I D = 350mAForward Transfer Admittance |Y fs |200 ⎯ ⎯ ms V DS =10V, I D = 0.2A Diode Forward Voltage (Note 6) V SD0.5 ⎯ 1.4 V V GS = 0V, I S = 115mA DYNAMIC CHARACTERISTICSInput Capacitance C iss⎯ ⎯ 150 pF V DS = 16V, V GS = 0Vf = 1.0MHzOutput Capacitance C oss⎯ ⎯ 25 pF Reverse Transfer Capacitance C rss⎯ ⎯ 20 pF Notes:4. Device mounted on FR-4 PCB.5. Pulse width ≤10μS, Duty Cycle ≤1%.6. Short duration pulse test used to minimize self-heating effect.V , DRAIN-SOURCE VOLTAGE (V)Fig. 1 Typical Output CharacteristicsDS I , D R A I N C U R R E N T (A )D V , GATE-SOURCE VOLTAGE (V)Fig. 2 GS Reverse Drain Current vs. Source-Drain VoltageT , CHANNEL TEMPERATURE (°C)Fig. 3 Gate Threshold Voltage vs. Channel Temperaturech 0.1I DRAIN CURRENT (A)Fig. 4 Static Drain-Source On-Resistance Vs. Drain Current D ,1R , S T A T I C D R A I N -S O U R C E O N -R E S I S T A N C E ()D S (o n )ΩI , DRAIN CURRENT (A)Fig. 5 Static Drain-Source On-Resistance vs. Drain CurrentD R , S T A T I C D R A I N -S O U R CE O N -R E S I S T A N C E ()D S (o n )ΩI , DRAIN CURRENT (A)Fig. 7DOn-Resistance vs. Drain Current and Gate Voltage T , JUNCTION TEMPERATURE (C)Fig. 8 j °Static Drain-Source, On-Resistance vs. TemperatureI , D R A I N -S O U R C E L E A K A G E C U R R E N T (n A )D SS I , R E V E R S E D R A I N C U R R E N T (A )DR 1000I , DRAIN CURRENT (mA)DFig. 11 Forward Transfer Admittance vs. Drain Current|Y |, F O R W A R D T R A N S F E R A D M I T T A N C E(S )fs V , DRAIN SOURCE VOLTAGE (V)DS Fig. 12 Capacitance VariationPackage Outline DimensionsSOT363Dim Min Max A 0.10 0.30 B 1.15 1.35 C 2.00 2.20 D 0.65 Typ F 0.40 0.45 H 1.80 2.20 J 0 0.10 K 0.901.00 L 0.25 0.40 M 0.10 0.22α0° 8° All Dimensions in mmSuggested Pad LayoutIMPORTANT NOTICEDIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages.Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks.LIFE SUPPORTDiodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in thelabeling can be reasonably expected to result in significant injury to the user.B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness.Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.Copyright © 2011, Diodes IncorporatedDimensions Value (in mm)Z 2.5 G 1.3 X 0.42 Y 0.6 C1 1.9 C2 0.65XZYC1C2C2G分销商库存信息: DIODESDMN2004DWK-7。

天微产品选型表

固定花样三色灯驱动IC 6路LED恒流驱动IC LED照明及装饰驱动IC 9路LED恒流驱动IC LED照明及装饰驱动IC LED照明及装饰驱动IC LED照明及装饰驱动IC LED照明及装饰驱动IC LED照明及装饰驱动IC LED照明及装饰驱动IC LED照明及装饰驱动IC LED照明及装饰驱动IC
产品型号 TC1011 TC1006 TC1005 TC1003 TM1108 TM1107 TM1106 TM1105 TM1102 TM1103 TM1101 TM-SX670 TC1002
产品类型电机控制专用IC 电机控制专用IC 电机控制专用IC 电机控制专用IC 仪器仪表专用IC 仪器仪表专用IC 仪器仪表专用IC 仪器仪表专用IC 仪器仪表专用IC 仪器仪表专用IC 仪器仪表专用IC 系统控制专用IC 电机控制专用IC
电力电子专用控制IC 电源管理IC
场效应管（MOSFET）
M1N60A M1N60B M1N60C M1N65 M1N65A M1N65B M2N60 M2N60B M2N65 M3N60 M3N65 M4N60 M4N65 M5N60 M5N65 M6N65 M7N65 M8N60 M8N65 M9N60
产品型号 TM1621 721 TM1722 TM1723 TM1726 TM1727 TM1728 TM1729 TM1730 TM75823
产品类型 LCD面板显示驱动IC LCD面板显示驱动IC LCD面板显示驱动IC LCD面板显示驱动IC LCD面板显示驱动IC LCD面板显示驱动IC LCD面板显示驱动IC LCD面板显示驱动IC LCD面板显示驱动IC LCD面板显示驱动IC
LED照明及装饰驱动IC
特性描述 1路恒流驱动,15~45mA电流,端口耐压24V 输入电压1.5V,升压驱动,80~200mA电流 3路恒流驱动,单线级联,灰度256级可调 3路恒流驱动,单线级联,灰度2568级可调,工作电压6～24V

LMV791, LMV792 低噪声 CMOS 输入运算放大器说明书

11010010k100kFREQUENCY (Hz)1101001kV O L T A G E N O I S E (n V H z )CFV OUTI IN- R F =Product Folder Order Now Technical Documents Tools &SoftwareSupport &CommunityLMV791,LMV792ZHCSIB7G –SEPTEMBER 2005–REVISED OCTOBER 2015具有关断功能的LMV79x 17MHz 低噪声CMOS 输入1.8V 运算放大器1特性5V 的典型电源值（除非另有说明）•输入基准电压噪声5.8nV/√Hz •内部偏置电流100fA •单位增益带宽17MHz•每通道电源电流（启用模式下）–LMV7911.15mA –LMV7921.30mA•关断模式下的每通道电源电流为0.02µA •轨至轨输出摆幅–在10k Ω负载条件下，距离电源轨25mV –在2k Ω负载条件下，距离电源轨45mV • 2.5V 和5V 下的性能可靠无虞•1kHz 、600Ω时的总谐波失真为0.01%•温度范围-40°C 至125°C2应用•光电二极管放大器•有源滤波器和缓冲器•低噪声信号处理•医疗仪器•传感器接口应用3说明LMV791（单通道）和LMV792（双通道）低噪声CMOS 输入运算放大器可提供5.8nV/√Hz 的低输入电压噪声密度，且静态电流仅有1.15mA (LMV791)。

LMV791和LMV792是单位增益型稳定运算放大器，具有17MHz 的增益带宽。

LMV79x 拥有1.8V 至5.5V 的电源电压范围，且可在单一电源下运行。

LMV79x 均具有轨至轨输出级，能够驱动600Ω负载且拉电流高达60mA 。

LMV79x 系列可在低压和低噪声系统中提供出色的性能。

CMOS 输入级的典型输入偏置电流仅有数飞安，且输入共模电压范围中包括接地，因此LMV791和LMV792非常适合低功耗传感器应用。

NI PXIe-1078

21.6 cm 8.1 cm 13 cm 5 °C 50 °C 0 °C , 55 °C 2000 m
NI PXIe-4353
32通道, 24位, 热电偶输入模块
• 32路热电偶输入通道; 8路内置冷端温度补偿通道; 0.3 °C精度 • 90 S/s/通道的采样率 (高速模式); 1 S/s/通道的采样率 (高分辨率模式) • 300 Vrms CAT II通道-地面接地安全隔离 • 自动调零通道用于偏移误差补偿; 热电偶开路检测 • 借由PXI Express, 实现多设备触发和同步 • NI-DAQmx驱动软件和NI LabVIEW SignalExpress LE交互式数据记录软件
NI PXIe-1078
配有交流的9槽3U PXI Express机箱 - 高达1 GB/s
• 5个混合插槽, 3个PXI Express插槽 • 0 °C到50 °C的温度下, 总功率达300 W • 中等性能 – 每插槽高达250 MB/s的带宽和1 GB/s的系统带宽 • 8.43英寸 (214.2 mm) 低深度机箱 - 适用于机架以及台式应用 • 与PXI、PXI Express、CompactPCI和CompactPCI Express模块兼容
双核处理器有两个核心或称计算引擎，配置于同一个处理器中。双核处理器可同时执行两个计算任务，该优势可在多任务环境下得到体现，例如：允许多个应用程序同时运行的Windows XP。两个应用程序可以同时分别进入处理器的两个核心，从而提高系统整体性能。此外，双核处理器是NI LabVIEW软件等多线程应用程序的理想选择，应用程序能够将各个任务分为多个线程执行。一个双核处理器可同时执行众多线程中的两条。如需配置一个基于NI PXIe-8108的完整PXI Express系统，请访问/pxiadvisor。

DMN2005LP4K-7;中文规格书,Datasheet资料

N-CHANNEL ENHANCEMENT MODE MOSFETFeatures• Low On-Resistance • Very Low Gate Threshold Voltage, 0.9V Max. • Fast Switching Speed • Low Input/Output Leakage • Ultra-Small Surface Mount Package • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Note 3) • ESD Protected Gate • Ultra Low Profile Package • Qualified to AEC-Q101 Standards for High ReliabilityMechanical Data• Case: X2-DFN1006-3 • Case Material: Molded Plastic, “Green” Molding Compound. ULFlammability Classification Rating 94V-0 • Moisture Sensitivity: Level 1 per J-STD-020 • Terminal Connections: See Diagram • Terminals: Finish ⎯NiPdAu over Copper leadframe. Solderableper MIL-STD-202, Method 208 • Weight: 0.001 gramsOrdering Information (Note 4)Part Number Marking Reel size (inches) Tape width (mm) Quantity per reelDMN2005LP4K-7 DN 7 8 3000 DMN2005LP4K-7B DN 7 8 10,000Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.2. See for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.4. For packaging details, go to our website at .Marking Informatione4X2-DFN1006-3Bottom ViewEquivalent CircuitTop View Pin-OutBody DiodeDSGESD PROTECTEDDN = Product Type Marking CodeDNDMN2005LP4K-7DMN2005LP4K-7BTop View Bar Denotes Gate and Source SideTop View Dot Denotes Drain SideMaximum Ratings (@T A = 25°C unless otherwise specified.)Characteristic Symbol Value UnitDrain-Source VoltageV DSS20 V Gate-Source VoltageV GSS ±10 V Drain Current per element (Note 5) Continuous Pulsed (Note 6) I D300 350mAThermal CharacteristicsCharacteristic Symbol Value UnitTotal Power Dissipation (Note 5) P D 400 mW Thermal Resistance, Junction to Ambient R θJA 280 °C/WOperating and Storage Temperature Range T J , T STG-65 to +150°CElectrical Characteristics (@T A = 25°C unless otherwise specified.)Characteristic Symbol Min Typ Max Unit Test ConditionOFF CHARACTERISTICS (per element) (Note 7)Drain-Source Breakdown Voltage BV DSS20 ⎯ ⎯ V V GS = 0V, I D = 100µA Zero Gate Voltage Drain Current I DSS ⎯ ⎯ 10 µA V DS = 17V, V GS = 0V Gate-Source LeakageI GSS ⎯ ⎯ ±5µAV GS = ±8V, V DS = 0VON CHARACTERISTICS (per element) (Note 7) Gate Threshold VoltageV GS(th)0.53 ⎯ 0.9 V V DS = V GS , I D = 100µA Static Drain-Source On-ResistanceR DS (ON) ⎯ ⎯ ⎯ ⎯ ⎯ 0.350.4 0.450.550.65 1.5 1.7 1.7 3.5 3.5 ΩV GS = 4V, I D = 10mA V GS = 2.7V, I D = 200mA V GS = 2.5V, I D = 10mA V GS = 1.8V, I D = 200mA V GS = 1.5V, I D = 1mA Forward Transfer Admittance ⏐Y fs ⏐ 40 ⎯ ⎯ mS V DS = 3V, I D = 10mADYNAMIC CHARACTERISTICS Input Capacitance C iss ⎯ 37.1 ⎯ pF V DS = 10V, V GS = 0V f = 1.0MHzOutput CapacitanceC oss ⎯ 6.5 ⎯ pF Reverse Transfer Capacitance C rss⎯ 4.8 ⎯ pF Switching TimeTurn-on Time t on ⎯ 4.06 ⎯ nSV DD = 10V, R l = 47Ω, V GEN = 4.5V, R GEN = 10Ω.Turn-off Timet off⎯13.7⎯Notes: 5. Device mounted on FR-4 PCB.6. Pulse width ≤10μS, Duty Cycle ≤1%.7. Short duration pulse test used to minimize self-heating effect.0.51.01.52.0Fig. 1 Typical Output CharacteristicsV , DRAIN-SOURCE VOLTAGE (V)DS I , D R A I N C U R R E N T (A )D 00.51.01.5I , D R A I N C U R R E N T (A )D Fig. 2 Typical Transfer CharacteristicsV , GATE SOURCE VOLTAGE (V)GS 00.200.40.8 1.2 1.62Fig. 3 Typical On-Resistance vs. Drain Current and Gate VoltageI , DRAIN-SOURCE CURRENT (A)D R , D R A I N -S O U R CE O N -R E S I S T A N C E ()D S (O N )Ω0.80.60.4I , DRAIN CURRENT (A)Fig. 4 Typical Drain-Source On-Resistancevs. Drain Current and Temperature D R , D R A I N -S O U R C E O N -R E S I S T A N C E ()D S (O N )ΩFig. 5 On-Resistance Variation with TemperatureT , JUNCTION TEMPERATURE (°C)J R , D R A I N -S O U R C EO N -R E S I S T A N C E (N O R M A L I Z E D )D S (O N )R , D R A I N -S O U R C E O N -R E S I S T A N C E ()D S (O N )ΩFig. 6 On-Resistance Variation with TemperatureT , JUNCTION TEMPERATURE (°C)JFig. 7 Gate Threshold Variation vs. Ambient T emperature T , AMBIENT TEMPERATURE (°C)A V , G A T E T H R E S H O L D V O L T A G E (V )G S (T H )V , SOURCE-DRAIN VOLTAGE (V)SD Fig. 8 Diode Forward Voltage vs. CurrentI , S O U R C E C U R R E N T (A )SFig. 9 Typical CapacitanceV , DRAIN-SOURCE VOLTAGE (V)DS C , C A P A C I T A N C E (p F )Package Outline DimensionsSuggested Pad LayoutX2-DFN1006-3Dim Min Max Typ A ⎯0.40 ⎯ A1 0 0.05 0.03 b1 0.10 0.20 0.15 b2 0.45 0.55 0.50 D 0.95 1.05 1.00 E 0.55 0.65 0.60 e ⎯ ⎯0.35 L1 0.20 0.30 0.25 L2 0.20 0.30 0.25 L3 ⎯ ⎯0.40All Dimensions in mmDimensionsValue (in mm)Z 1.1 G1 0.3 G2 0.2 X 0.7 X1 0.25 Y 0.4 C 0.7YCG 1G 2XX 1ZIMPORTANT NOTICEDIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages.Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks.LIFE SUPPORTDiodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:A. Life support devices or systems are devices or systems which:1. are intended to implant into the body, or2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in thelabeling can be reasonably expected to result in significant injury to the user.B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause thefailure of the life support device or to affect its safety or effectiveness.Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.Copyright © 2012, Diodes Incorporated分销商库存信息: DIODESDMN2005LP4K-7。

in4007中文资料_数据手册_参数

, PEAK FORWARD SURGE (A)
version:02
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1N 4 ant Notice and Disclaimer
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1N 4006G
1N 4007G
Unit
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VRMS
35
70
140 280 420 560 700 V
VDC
50 100 200 400 600 800 1000 V
•The products shown herein are not designed and authorized for equipments requiring high level of reliability or relating to human life and for any applications concerning life-saving or life-sustaining, such as medical instruments, transportation equipment, aerospace machinery et cetera. Customers using or selling these products for use in such applications do so at their own ris k andagree to fully indemnify DIYI for any damages resulting from such improper use or sale.

1-2577 TDS规格书

DOWSIL™ 1-2577 Conformal CoatingOne-part, translucent medium viscosity conformal coating with firm, abrasion resistant surface after cureFeatures & Benefits ∙Cures to a tough, elastoplastic, resilient, abrasion resistant surface∙Solvent-borne resin coating∙Room temperature cure, no ovens required∙Optional mild heat acceleration (after solvent flash-off) can speed in-line processing ∙UV indicator allows for automated inspection∙UL 94 V-0 flammability rating∙UL 746E Recognized∙IPC-CC-830, Amendment 1 Approved∙Mil-I-46058C, Amendment 7 Approved∙Good adhesion allows use with many low-solids (no clean) and no-lead soldersComposition ∙One part silicone resin solutionApplications ∙DOWSIL™ 1-2577 Conformal Coating is suitable for protective coating for rigid andflexible circuit boards and for PCB system Printed Wiring Board (PWB) applications,particularly those requiring toughness and abrasion resistance.Typical PropertiesSpecification Writers: These values are not intended for use in preparing specifications.Property Unit ResultOne or Two-Part OneColor (Cured) Translucent (Clear)Viscosity cPmPa-secPa-sec 950 950 1Specific Gravity (Uncured) 1.04 Specific Gravity (Cured) 1.11 Tack-Free Time at 25°C minutes 7 Tack-Free Time at 60°C/15% RH minutes 1.3 Durometer Shore A 80Typical Properties (Cont.)Property Unit ResultDielectric Strength volts/milkV/mm 400 16Volume Resistivity ohm*cm 5E+13Dielectric Constant at 100 Hz 2.74Dielectric Constant at 100 kHz 2.74Dissipation Factor at 100 Hz 0.0042Dissipation Factor at 100 kHz < 0.0002Agency Listing IPC-CC-830, Amend. 1 UL746E UL Flammability Classification NA 94 V-0Mil Specification NA MIL-I-46058C, Amend. 7NVC - Forced Draft Volatility % 72.3Description RTV conformal coatings have firm, dry surfaces for better handling and abrasion resistanceafter cure. Various viscosity versions facilitate different application methods. They requireatmospheric moisture to cure (no ovens) and their cure rates can be accelerated by mildheat. They are supplied in solvent, with low-VOC versions available and have Mil spec,IPC-CC-830 and UL recognition. Conformal coatings are materials applied in thin layersonto printed circuits or other PCB system assembly substrates.Application Methods ∙Spray∙Brush∙Flow∙Dip∙Automated pattern coatingProcessing/CuringPot Life And Cure RateAdhesion The time required to reach a tack-free state can be reduced with heat. When using heat for this purpose, allow adequate time for the solvent to evaporate prior to exposing to elevated temperatures in an air circulating oven. A typical cure schedule for 3 mil (75 micron) coatings is 10 minutes at room temperature, followed by 10 minutes at 60°C. If the coating blisters or contains bubbles, allow additional time at room temperature for the solvent to flash off prior to oven cure.The pot life of RTV conformal coatings is dependent on the application method chosen. To extend pot life, minimize exposure to moisture by using dry air or dry nitrogen blanketing whenever possible.With RTV cure coatings, adhesion typically lags behind cure and may take up to 72 hours to build in some coatings. RTV conformal coatings are formulated to provide adhesion to most common PCB system assembly substrates and materials. It is recommended that the coatings be applied to clean and dry substrates prior to application. On certain difficult, low-surface energy surfaces, adhesion may be improved by priming or by special surface treatment such as chemical or plasma etching.Handling PrecautionsUsable Life and StorageUseful Temperature RangesRepairability PRODUCT SAFETY INFORMATION REQUIRED FOR SAFE USE IS NOT INCLUDED IN THIS DOCUMENT. BEFORE HANDLING, READ PRODUCT AND SAFETY DATA SHEETS AND CONTAINER LABELS FOR SAFE USE, PHYSICAL AND HEALTH HAZARD INFORMATION. THE SAFETY DATA SHEET IS AVAILABLE ON THE WEBSITE AT OR FROM YOUR SALES APPLICATION ENGINEER, OR DISTRIBUTOR, OR BY CALLING CUSTOMER SERVICE.Special precautions must be taken to prevent moisture from contacting RTV conformal coatings. Containers should be kept tightly closed and head or air space minimized. Partially filled containers should be purged with dry air or other gases, such as nitrogen. The product should be stored in its original packaging with the cover tightly attached to avoid any contamination. Store in accordance with any special instructions listed on the product label. The product should be used by its “Use Before” date as indicated on the product label.In some cases depending on storage, there may be a hazy appearance noticed in the containers when first opened, even though they are considered clear conformal coatings. It is normal for this to occur especially if the container has been sitting stagnant for several days or weeks. This is due to the solubility of the phenyl resin in the solvent and how long the container has been sitting in storage. The coating should cure to a clear consistency regardless of this initial appearance. Mild agitation can reconstitute the material so it is consistent in appearance and viscosity. Care should be taken if the Low VOC versions are in bladder bags. A gentle rolling of the pail should correct the problem and redistribute the solvent. This should be performed 24 hours before use, so any induced bubbles from the manual agitation or rolling process have a chance to dissipate.For most uses, silicone adhesives should be operational over a temperature range of -45 to 200°C (-49 to 392°F) for long periods of time. However, at both the low and high temperature ends of the spectrum, behavior of the materials and performance in particular applications can become more complex and require additional considerations. For low-temperature performance, thermal cycling to conditions such as -55°C (-67°F) may be possible but performance should be verified for your parts or assemblies. Factors that may influence performance are configuration and stress sensitivity of components, cooling rates and hold times, and prior temperature history. At the high-temperature end, the durability of the cured silicone elastomer is time and temperature dependent. As expected, the higher the temperature, the shorter the time the material will remain useable.In the manufacture of PCB system assemblies, it is often desirable to salvage or reclaim damaged or defective units. RTV conformal coatings offer excellent reparability because they can be removed from substrates and circuitry by scraping or cutting, or by using solvents or stripping agents. If only one circuit component is to be replaced, a soldering iron may be applied directly through the coating to remove the component. Proper ventilation of any fume should be employed. After the circuit board has been repaired, the area should be cleaned by brushing or by using solvent, then dried and recoated. Heat cure coatings can be repaired with RTV coatings, but heat cure coatings may not work well when used to repair RTV coatings.Packaging InformationLimitationsHealth And Environmental InformationHow Can We Help You Today? Multiple packaging sizes are available for this product. Please contact your local distributor or representative for information on packaging size and availability.This product is neither tested nor represented as suitable for medical or pharmaceutical uses.To support customers in their product safety needs, has an extensive Product Stewardship organization and a team of product safety and regulatory compliance specialists available in each area.For further information, please see our website, or consult your local epresentative.Tell us about your performance, design, and manufacturing challenges. Let us put our silicon-based materials expertise, application knowledge, and processing experience to work for you.For more information about our materials and capabilities, visitTo discuss how we could work together to meet your specific needs, go to for a contact close to your location. has customer service teams, science and technology centers, application support teams, sales offices, and manufacturing sites around the globe. LIMITED WARRANTY INFORMATION – PLEASE READ CAREFULLYThe information contained herein is offered in good faith and is believed to be accurate. However, because conditions and methods of use of our products are beyond our control, this information should n ot be used in substitution for customer’s tests to ensure that our products are safe, effective, and fully satisfactory for the intended end use. Suggestions of use shall not be taken as inducements to infringe any patent.Dow’s sole warranty is that our products will meet the sales specifications in effect at the time of shipment.Your exclusive remedy for breach of such warranty is limited to refund of purchase price or replacement of any product shown to be other than as warranted.TO THE FULLEST EXTENT PERMITTED BY APPLICABLE LAW, SPECIFICALLY DISCLAIMS ANY OTHER EXPRESS OR IMPLIED WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE OR MERCHANTABILITY.DISCLAIMS LIABILITY FOR ANY INCIDENTAL OR CONSEQUENTIAL DAMAGES.。

57bm

南京拓微集成电路有限公司TP4057特点·锂电池正负极反接保护；·高达500mA的可编程充电电流；·无需MOSFET、检测电阻器或隔离二极管；·用于单节锂离子电池·恒定电流/恒定电压操作，并具有可在无过热危险的情况下实现充电速率最大化的热调节功能；·可直接从USB端口给单节锂离子电池充电；·精度达到±1%的4.2V预设充电电压；·最高输入可达9V；·自动再充电；·2个充电状态开漏输出引脚；·C/10充电终止；·待机模式下的供电电流为40uA；·2.9V涓流充电器件版本；·软启动限制了浪涌电流；·采用6引脚SOT-23封装。

应用·充电座·蜂窝电话、PDA、MP3播放器·蓝牙应用典型应用500mA单节锂离子电池充电器绝对最大额定值·输入电源电压（V CC）：-0.3V～9V ·PROG：-0.3V～V CC+0.3V·BA T：-4.2V～7V·CHRG：-0.3V～10V·BA T短路持续时间：连续·BA T引脚电流：500mA·PROG引脚电流：800uA·最大结温：145℃·工作环境温度范围：-40℃～85℃·贮存温度范围：-65℃～125℃·引脚温度（焊接时间10秒）：260℃400mA电流完整的充电循环（600mAh）描述TP4057一款完整的单节锂离子电池充电器，带电池正负极反接保护，采用恒定电流/恒定电压线性控制。

其SOT封装与较少的外部元件数目使得TP4057便携式应用的理想选择。

TP4057可以适合USB电源和适配器电源工作。

由于采用了内部PMOSFET架构，加上防倒充电路，所以不需要外部检测电阻器和隔离二极管。

m1ma141kt1g, m1ma142kt1g 单片硅开关二极管数据表说明书

M1MA141KT1G,M1MA142KT1GSingle Silicon Switching DiodeThis Silicon Epitaxial Planar Diode is designed for use in ultra high speed switching applications.This device is housed in the SC--70 package which is designed for low power surface mount applications. Features∙Fast t rr,<3.0ns∙Low C D,<2.0pF∙These Devices are Pb--Free,Halogen Free/BFR Free and are RoHS CompliantMAXIMUM RATINGS(T A=25︒C)Rating Symbol Value UnitReverse VoltageM1MA141KT1M1MA142KT1V R4080VdcPeak Reverse VoltageM1MA141KT1M1MA142KT1V RM4080VdcForward Current I F100mAdc Peak Forward Current I FM225mAdcPeak Forward Surge Current I FSM(Note1)500mAdcTHERMAL CHARACTERISTICSRating Symbol Max Unit Power Dissipation P D150mW Junction Temperature T J150︒C StorageTemperature T stg--55~+150︒C Stresses exceeding Maximum Ratings may damage the device.MaximumRatings are stress ratings only.Functional operation above the Recommended Operating Conditions is not implied.Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.1.t=1secSC--70(SOT--323)CASE419STYLE2MARKING DIAGRAMMx=Device Codex=H for141I for142M=Date Code*G=Pb--Free PackageDevice Package Shipping†ORDERING INFORMATION†For information on tape and reel specifications, including part orientation and tape sizes,please refer to our Tape and Reel Packaging Specifications Brochure,BRD8011/D.Mx M GGM1MA142KT1G SC--70(Pb--Free)3000/Tape&Reel M1MA141KT1G SC--70(Pb--Free)3000/Tape&Reel (Note:Microdot may be in either location)*Date Code orientation may vary depending upon manufacturing location.CATHODE12ELECTRICAL CHARACTERISTICS(T A=25 C)Characteristic Condition Symbol Min Max Unit Reverse Voltage Leakage CurrentM1MA141KT1 M1MA142KT1V R=35VV R=75VI R--0.1m AdcForward Voltage I F=100mA V F-- 1.2VdcReverse Breakdown VoltageM1MA141KT1M1MA142KT1I R=100m A V R4080--VdcDiode Capacitance V R=0,f=1.0MHz C D-- 2.0pFReverse Recovery Time(Figure1)I F=10mA,V R=6.0V,R L=100Ω,I rr=0.1I Rt rr(Note2)-- 3.0ns2.t rr Test CircuitRt p =2m s t r =0.35nsrr RI F =10mA V R =6V R L =100ΩRECOVERY TIME EQUIVALENT TEST CIRCUITINPUT PULSEOUTPUT PULSEFigure 1.Recovery Time Equivalent Test Circuit100V F ,FORWARD VOLTAGE (VOLTS)101.00.110V R ,REVERSE VOLTAGE (VOLTS)1.00.10.010.0010.680V R ,REVERSE VOLTAGE (VOLTS)0.640.60.560.52C D ,D I O D E C A P A C I T A N C E (p F )2468I F ,F O R W A R D C U R R E N T (m A )Figure 2.Forward Voltage Figure 3.Reverse CurrentFigure 4.Diode CapacitanceI R ,R E V E R S E C U R R E N T (μA )SC −70 (SOT −323)CASE 419ISSUE PDATE 07 OCT 2021SCALE 4:1STYLE 3:PIN 1.BASE2.EMITTER3.COLLECTOR STYLE 4:PIN 1.CATHODE2.CATHODE3.ANODE STYLE 2:PIN 1.ANODE2.N.C.3.CATHODE STYLE 1:CANCELLEDSTYLE 5:PIN 1.ANODE 2.ANODE 3.CATHODE STYLE 6:PIN 1.EMITTER 2.BASE3.COLLECTORSTYLE 7:PIN 1.BASE 2.EMITTER 3.COLLECTORSTYLE 8:PIN 1.GATE 2.SOURCE 3.DRAINSTYLE 9:PIN 1.ANODE 2.CATHODE3.CATHODE-ANODESTYLE 10:PIN 1.CATHODE 2.ANODE3.ANODE-CATHODEXX M G G XX = Specific Device Code M = Date CodeG= Pb −Free PackageGENERICMARKING DIAGRAM1STYLE 11:PIN 1.CATHODE2.CATHODE3.CATHODE*This information is generic. Please refer to device data sheet for actual part marking.Pb −Free indicator, “G” or microdot “G ”, may or may not be present. Some products maynot follow the Generic Marking.MECHANICAL CASE OUTLINEPACKAGE DIMENSIONSPUBLICATION ORDERING INFORMATIONTECHNICAL SUPPORTNorth American Technical Support:Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910LITERATURE FULFILLMENT :Email Requests to:*******************onsemi Website: Europe, Middle East and Africa Technical Support:Phone: 00421 33 790 2910For additional information, please contact your local Sales Representative。

安森美 MMSZ4678T1 齐纳电压调节器 datasheet

MMSZ4678T1 SeriesPreferred DeviceZener Voltage Regulators 500 mW SOD−123 Surface MountThree complete series of Zener diodes are offered in the convenient, surface mount plastic SOD−123 package. These devices provide a convenient alternative to the leadless 34−package style.Features•500 mW Rating on FR−4 or FR−5 Board•Wide Zener Reverse V oltage Range − 1.8 V to 43 V •Package Designed for Optimal Automated Board Assembly •Small Package Size for High Density Applications•ESD Rating of Class 3 (>16 kV) per Human Body Model •Pb−Free Packages are AvailableMechanical Characteristics:CASE:V oid-free, transfer-molded, thermosetting plastic case FINISH:Corrosion resistant finish, easily solderableMAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 SecondsPOLARITY:Cathode indicated by polarity band FLAMMABILITY RATING:UL 94 V−0MAXIMUM RATINGSRating Symbol Max UnitTotal Power Dissipation on FR−5 Board, (Note 1) @ T L = 75°CDerated above 75°C P D5006.7mWmW/°CThermal Resistance, (Note 2)Junction−to−AmbientR q JA340°C/WThermal Resistance, (Note 2)Junction−to−LeadR q JL150°C/WJunction and Storage Temperature Range T J, T stg−55 to+150°CMaximum ratings are those values beyond which device damage can occur.Maximum ratings applied to the device are individual stress limit values (notnormal operating conditions) and are not valid simultaneously. If these limits areexceeded, device functional operation is not implied, damage may occur andreliability may be affected.1.FR−5 = 3.5 X 1.5 inches, using the minimum recommended footprint.2.Thermal Resistance measurement obtained via infrared Scan Method.Devices listed in bold, italic are ON SemiconductorPreferred devices. Preferred devices are recommendedchoices for future use and best overall value.ELECTRICAL CHARACTERISTICS (T A = 25°C unless otherwise noted, V F = 0.95 V Max. @ I F = 10 mA)Symbol ParameterV Z Reverse Zener Voltage @ I ZTI ZTReverse CurrentI R Reverse Leakage Current @ V R V R Reverse VoltageI F Forward CurrentV F Forward Voltage @ I FELECTRICAL CHARACTERISTICS (T A = 25°C unless otherwise noted, V F = 0.9 V Max. @ I F = 10 mA)Device*DeviceMarkingZener Voltage (Note 3)Leakage CurrentV Z (Volts)@ I ZT I R @ V RMin Nom Max m A m A VoltsMMSZ4678T1, G CC 1.71 1.8 1.89507.51 MMSZ4679T1, G CD 1.90 2.0 2.105051 MMSZ4680T1, G CE 2.09 2.2 2.315041 MMSZ4681T1, G CF 2.28 2.4 2.525021 MMSZ4682T1, G CH 2.565 2.7 2.8355011 MMSZ4683T1, G CJ 2.85 3.0 3.15500.81 MMSZ4684T1, G CK 3.13 3.3 3.47507.5 1.5 MMSZ4685T1, G CM 3.42 3.6 3.78507.52 MMSZ4686T1, G CN 3.70 3.9 4.105052 MMSZ4687T1, G CP 4.09 4.3 4.525042 MMSZ4688T1, G CT 4.47 4.7 4.9450103 MMSZ4689T1, G CU 4.85 5.1 5.3650103 MMSZ4690T1, G CV 5.32 5.6 5.8850104 MMSZ4691T1, G CA 5.89 6.2 6.5150105 MMSZ4692T1, G CX 6.46 6.87.145010 5.1 MMSZ4693T1, G CY7.137.57.885010 5.7 MMSZ4694T1, G CZ7.798.28.61501 6.2 MMSZ4695T1, G DC8.278.79.14501 6.6 MMSZ4696T1, G DD8.659.19.56501 6.9 MMSZ4697T1, G DE9.501010.505017.6 MMSZ4698T1, G DF10.451111.55500.058.4 MMSZ4699T1, G DH11.401212.60500.059.1 MMSZ4700T1, G DJ12.351313.65500.059.8 MMSZ4701T1, G DK13.301414.70500.0510.6 MMSZ4702T1, G DM14.251515.75500.0511.4 MMSZ4703T1, G†DN15.201616.80500.0512.1 MMSZ4704T1, G DP16.151717.85500.0512.9 MMSZ4705T1, G DT17.101818.90500.0513.6 MMSZ4706T1, G DU18.051919.95500.0514.4 MMSZ4707T1, G DV19.002021.00500.0115.2 MMSZ4708T1, G DA20.902223.10500.0116.7 MMSZ4709T1, G DX22.802425.20500.0118.2 MMSZ4710T1, G DY23.752526.25500.0119.0 MMSZ4711T1, G†EA25.652728.35500.0120.4 MMSZ4712T1EC26.602829.40500.0121.2 MMSZ4713T1, G ED28.503031.50500.0122.8 MMSZ4714T1, G EE31.353334.65500.0125.0 MMSZ4715T1, G EF34.203637.80500.0127.3 MMSZ4716T1, G EH37.053940.95500.0129.6 MMSZ4717T1, G EJ40.854345.15500.0132.6 3.Nominal Zener voltage is measured with the device junction in thermal equilibrium at T L = 30°C ±1°C.*The “G’’ suffix indicates Pb−Free package available.†MMSZ4703 and MMSZ4711 Not Available in 10,000/Tape & ReelV Z , T E M P E R A T U R E C O E F F I C I E N T (m V /C )°θV Z , NOMINAL ZENER VOLTAGE (V)− 3− 2−1012345678Figure 1. Temperature Coefficients (Temperature Range −55°C to +150°C)V Z , T E M P E R A T U R E C O E F F I C I E N T (m V /C )°θ100101V Z , NOMINAL ZENER VOLTAGE (V)Figure 2. Temperature Coefficients (Temperature Range −55°C to +150°C)1.21.00.80.60.40.20T, TEMPERATURE (5C)Figure 3. Steady State Power Derating P p k , P E A K S U R G E P O W E R (W A T T S )PW, PULSE WIDTH (ms)Figure 4. Maximum Nonrepetitive Surge Power1000100101V Z , NOMINAL ZENER VOLTAGEFigure 5. Effect of Zener Voltage onZener ImpedanceZ Z T , D Y N A M I C I M P E D A N C E ()Ω1000100101V F , FORWARD VOLTAGE (V)Figure 6. Typical Forward VoltageP D , P O W E R D I S S I P A T I O N (W A T T S )C , C A P A C I T A N C E (p F )1000100101V Z , ZENER VOLTAGE (V)1001010.10.01I Z , Z E N E R C U R R E N T (m A )V Z , ZENER VOLTAGE (V)1001010.10.01I R , L E A K A G E C U R R E N T (A )μV Z , NOMINAL ZENER VOLTAGE (V)Figure 8. Typical Leakage Current10001001010.10.010.0010.00010.00001I Z , Z E N E R C U R R E N T (m A )Figure 9. Zener Voltage versus Zener Current(V Z Up to 12 V)Figure 10. Zener Voltage versus Zener Current(12 V to 91 V)PACKAGE DIMENSIONSSOD−123CASE 425−04ISSUE Eǒmm inchesǓSCALE 10:1*For additional information on our Pb−Free strategy and solderingdetails, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.SOLDERING FOOTPRINT*ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.PUBLICATION ORDERING INFORMATION。

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