Laser processing method
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专利名称：Laser processing method 发明人：坂本 剛志,村松 憲一
申请号：JP2005235037
申请日：20050812
公开号：JP4749799B2
公开日：
20110817
专利内容由知识产权出版社提供
摘要：A laser processing method for preventing particles from occurring from cut sections of chips obtained by cutting a silicon wafer is provided. An irradiation condition of laser light L for forming modified regions 7 7 to 7 12 is made different from an irradiation condition of laser light L for forming the modified regions 7 13 to 7 19 such as to correct the spherical aberration of laser light L in areas where the depth from the front face 3 of a silicon wafer 11 is 335 µm to 525 µm. Therefore, even when the silicon wafer 11 and a functional device layer 16 are cut into semiconductor chips from modified regions 7 1 to 7 19 acting as a cutting start point, twist hackles do not appear remarkably in the areas where the depth is 335 µm to 525 µm, whereby particles are hard to occur.
申请人：浜松ホトニクス株式会社
地址：静岡県浜松市東区市野町１１２６番地の１
国籍：JP
代理人：長谷川 芳樹,寺崎 史朗,石田 悟
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