PCB工程资料中常见的英文缩写汇总

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pcb英文缩写及术语

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Supplier:供應商
Customer:客戶
Performance:成績,績效
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pcb英文缩写及术语
一.企業常用縮寫部分
FCST:預估(Forecast) PO/SO:訂單(Purchase Order/Sales Order) BP:營運計劃(Business Plan) MRP:物料需求規劃 (Material Requirement Planning) PR:採購申請Purchase Request BOM:物料清單 (Bill Of Material) IQC:進料品質管制 (Incoming Quality Control) IPQC:製程品質管制 (In-Process Quality Control) FQC:成品品質管制 (Finish or Final Quality Control) OQC:出貨品質管制 (Out-going Quality Control) QA:品質保證(Quality Assurance) QC:品質管制(Quality Control) QCC:品管圈 (Quality Control Circle)
N. 雷射鑽孔(Laser Drilling) n-1 雷射鑽Tooling孔 (Laser ablation Tooling Hole) n-2 雷射曝光對位孔(Laser Ablation Registration Hole) n-3 雷射Mask製作(Laser Mask) n-4 雷射鑽孔(Laser Ablation) n-5 AOI 檢查及VRS ( AOI Inspection & Verified & Repaired) n-6 Blaser AOI (after Desmear and Microetching) n-7 除膠渣 (Desmear) n-8 微蝕 (Microetching )

PCB专业术语大汇集

PCB专业术语大汇集PCB专业术语大汇集PCB是Printed Circuit Board的缩写，即印制电路板。

作为现代电子制造中不可或缺的一个组成部分，PCB技术已经成为电子制造的核心技术之一。

如果你在PCB制造领域工作或学习，那么理解并熟练掌握一些常见的PCB专业术语是非常重要的。

在这篇文章中，我们将罗列一些重要的PCB专业术语和技术名词，以帮助大家更好地理解PCB的制造和设计。

一、PCB制造基础1. PAD:焊盘，指印制电路板上用于焊接元器件的金属区域。

2. VIA:通孔，指在印制电路板上打开的金属通孔，连接不同层之间的电路。

3. Solder mask:焊膜，是一种覆盖在PCB表面的保护层，用于防止无意中的短路和腐蚀。

4. Silk screen:丝印，是印刷在印制电路板上的文字和图像，用于标记焊点、元器件和引脚等信息。

5. Cooper:铜箔，是一种用于制造PCB的材料。

6. Substrate:衬底，指PCB中负责固定和支撑电路的材料。

7. Copper weight:铜厚度，指PCB上铜箔的厚度，单位是oz。

8. Panel:板子，指PCB制造中一组连续的PCB，通常需要在单个板子上打印多个电路。

9. Plating:镀，指将金属材料沉积在印制电路板表面或内部的过程。

10. Tolerance:公差，指PCB制造和设计中可以接受的误差范围。

二、PCB设计技术1. Trace:走线，指印制电路板上的导线，用于连接不同的元器件和电路板上的不同部分。

2. Clearance:间隙，指PCB上不同元器件或电路之间的距离。

3. Net:网络，指一个电路的连接点集合，通常用来描述PCB上的一组连通电路。

4. Gerber:杰伯，是一种文件格式，通常用于将PCB设计转化为PCB生产所需的制造文件。

5. Footprint:插件，指印制电路板上元器件焊盘的设计，用于确保元器件和焊盘正确对齐和正确连接。

pcb专业术语英文及翻译

pcb专业术语英文及翻译摘要：本文介绍了PCB（Printed Circuit Board，印刷电路板）专业术语的英文表达和翻译，根据内容实际需求分为三大类：PCB制造术语、PCB组装术语和PCB测试术语。

在每个类别下，将列举相关术语及其英文表达和翻译，从而帮助读者更好地理解和运用PCB专业术语。

正文：I. PCB制造术语1. 单、双面板 (Single-sided, Double-sided board)单面板：一种仅在板的一侧进行布线和元件安装的印刷电路板。

双面板：一种在两侧布线和元件安装的印刷电路板。

2. 环氧树脂 (Epoxy Resin)环氧树脂是一种常用的PCB基材，具有良好的绝缘性和耐热性。

3. 铜盖膜 (Copper Foil)铜盖膜是覆盖在印刷电路板表面的一层铜箔，用于电气连接。

4. 阻焊层 (Solder Mask Layer)阻焊层是一种覆盖在印刷电路板表面的保护层，用于防止元件的误焊。

5. 玻璃纤维布 (Glass Fiber Cloth)玻璃纤维布是PCB制造中一种常用的增强材料，用于提高印刷电路板的强度和耐磨性。

6. 焊盘 (Pad)焊盘是印刷电路板上用于连接元件引脚的焊接区域。

7. 过孔 (Through-hole)过孔是印刷电路板上贯穿两侧的孔洞，用于连接不同电子元器件。

8. 排针 (Pin Header)排针是一种插针式连接器，常用于将PCB与其他设备连接。

9. 焊接 (Soldering)焊接是将电子元件与印刷电路板焊接在一起的一种连接方法。

II. PCB组装术语1. 表面贴装技术 (Surface Mount Technology, SMT)表面贴装技术是一种将电子元件直接焊接在印刷电路板表面的组装方法。

2. 波峰焊接 (Wave Soldering)波峰焊接是一种通过将印刷电路板浸入焊锡浪涌中来实现电子元件的连接。

3. 焊接膏 (Solder Paste)焊接膏是表面贴装技术中使用的一种黏性材料，用于在印刷电路板上确定元件的位置并进行焊接。

pcb工厂常用单词

pcb工厂常用单词
在PCB工厂中，一些常用的英文单词包括：
1.circuit board：电路板
2.printed circuit board：印刷电路板
3.PCBA：PCBA，是Printed Circuit Board Assembly的缩写，意思是印
刷电路板组装件
4.trace：迹线，表示电路板上的线路
5.trace width：迹线宽度，表示电路板上线条的粗细
6.trace spacing：迹线间距，表示电路板上两条线路之间的距离
yer：层，表示电路板上的不同导体层
8.dielectric：介质，表示电路板上的绝缘材料
9.via：导通孔，表示电路板上连接不同层导体的孔洞
10.drill hole：钻孔，表示电路板上用于安装元器件的孔洞
ponent：元器件，表示电路板上所安装的电子元件
12.resistor：电阻器
13.capacitor：电容器
14.inductor：电感器
15.transistor：晶体管
16.diode：二极管
17.LED：发光二极管
18.connector：连接器，表示电路板上连接不同部分之间的插座或插
头
19.jumper：跳线，表示用于连接不同部分的短导线
20.tooling hole：工具孔，表示电路板上用于安装治具的孔洞
21.mounting hole：安装孔，表示电路板上用于安装元器件的孔洞
以上仅是部分常用词汇，实际工作中还会涉及到更多专业术语和词汇。

PCB专业英译术语

PCB专业英译术语PCB（Printed Circuit Board，印刷电路板）是现代电子产品中最常用的一种重要的电路载体，其设计、生产和维修需要大量的技术术语支持。

本文将重点介绍PCB专业英译术语。

一、PCB基础术语1. PCB（Printed Circuit Board）：印刷电路板2. SMT（Surface Mount Technology）：表面贴装技术3. Through-hole Technology：通孔技术4. PTH（Plated Through Hole）：贯穿电解孔5. FR4：一种常用的印刷电路板基材材料，即玻璃纤维材料，通常由环氧树脂和玻璃纤维材料构成6. Pad：焊盘7. Trace：线路8. Via：垂直插孔9. Gerber file：Gerber文件格式，一种电路板设计文件格式10. BOM（Bill of Materials）：物料清单11. NC（Numerical Control）：数控12. DFM（Design for Manufacturability）：可制造性设计二、PCB制造过程相关术语1. CAM（Computer Aided Manufacturing）：计算机辅助制造2. Etch：蚀刻3. Silkscreen：丝网印刷4. Solder mask：焊盘油墨5. Plating：电镀6. HASL（Hot Air Solder Leveling）：热风焊盘处理7. OSP（Organic Solderability Preservatives）：有机可焊保护剂8. Gold Fingers：金手指，指电子产品中可进行插拔操作的特殊金属触点9. DIP（Dual In-line Package）：双列直插封装10. SOP（Small Outline Package）：小封装11. QFN（Quad Flat Package）：四角平封12. BGA（Ball Grid Array）：球网阵列13. PCBA（Printed Circuit Board Assembly）：印刷电路板装配三、PCB测试和维修相关术语1. AOI（Automated Optical Inspection）：自动光学检测2. X-ray Inspection：X光检测3. ICT（In-Circuit Test）：在线测试4. FCT（Functional Circuit Test）：功能测试5. Test point：测试点6. Defect：缺陷7. Repair：修复8. Rework：返工9. Troubleshooting：故障排除四、PCB设计相关术语1. EDA（Electronic Design Automation）：电子设计自动化2. Netlist：网表3. DRC（Design Rule Check）：设计规则检查4. DFM（Design for Manufacturing）：可制造性设计5. Gerber data：Gerber数据6. Simulation：仿真7. Library：元件库8. Footprint：封装9. Copper pour：铜质填充10. Via tenting：垂直插孔塞堵11. Blind vias：盲孔12. Buried vias：穿过孔五、总结本文介绍了PCB专业英译术语中的基础术语、PCB制造过程相关术语、PCB测试和维修相关术语以及PCB设计相关术语。

PCB行业最常用术语之中英文对照(按字母检索)

PCB行业最常用术语之中英文对照(按字母检索)A/W(artwork)底片Ablation烧溶(laser),切除abrade粗化abrasion resistance耐磨性absorption吸收ACC(accept)允收accelerated corrosion test加速腐蚀accelerated test加速试验acceleration速化反应accelerator加速剂acceptable允收activator活化液active work in process实际在制品adhesion附着力adhesive method黏着法air inclusion气泡air knife风刀amorphous change不定形的改变amount总量amylnitrite硝基戊烷analyzer分析仪anneal回火annular ring环状垫圈;孔环anode slime(sludge)阳极泥anodizing阳极处理AOI(automatic optical inspection)自动:光学检测applicable documents引用之文件AQL sampling允收水准抽样aqueous photoresist液态光阻aspect ratio纵横比(厚宽比)As received到货时back lighting背光back-up垫板banked work in process预留在制品base material基材baseline performance基准绩效batch批beta backscattering贝他射线照射法beveling切斜边;斜边biaxial deformation二方向之变形black-oxide黑化blank controller空白对照组blank panel空板blanking挖空blip弹开blister气泡;起泡blistering气泡blow hole吹孔board-thickness error板厚错误bonding plies黏结层bow;bowing板弯break out从平环内破出bridging搭桥;桥接BTO(Build To Order)接单生产burning烧焦burr毛边(毛头)camcorder一体型摄录放机carbide碳化物carlson pin定位梢carrier载运剂catalyzing催化catholic sputtering阴极溅射法caul plate隔板;钢板calibration system requirements校验系统之各种要求center beam method中心光束法central projection集中式投射线certification认证chamfer倒角(金手指)chamfering切斜边;倒角characteristic impedance特性阻抗charge transfer overpotential电量传递过电压chase网框checkboard棋盘chelator蟹和剂chemical bond化学键chemical vapor deposition化学蒸着镀circumferential void圆周性之孔破clad metal包夹金属clean room无尘室clearance间隙coat镀外表coating error防焊覆盖错误coefficient of thermal expansion(CTE)热澎胀系数cold solder joint冷焊点cold-weld金属粉末冷焊color颜色color error颜色错误compensation补偿competitive performance竞争力绩效complex salt错化物complexor错化物component hole零件孔component side零件面concentric同心conformance密贴性consumer products消费性产品contact resistance接触电阻continuous performance连续发挥效能contract service协力厂controlled split均裂式conventional flow乱流方式conventional tensile test传统张力测试法conversion coating转化层convex突出coordinate list数据清单copper claded laminates(CCL)铜箔基板copper exposure线路露铜copper mirror镜铜copper pad铜箔圆配copper residue(copper splash)铜渣corrosion rate numbering腐蚀速率计数系统corrosion resistance抗蚀性coulombs law库伦定律countersink喇叭孔coupon试样coupon location试样点covering power遮盖力CPU中央处理器crack破裂;裂痕crazing裂痕;白斑cross linking交联聚合cross talk呼应作用crosslinking交联crystal collection结晶收集curing聚合体current efficiency电流效率cut-outs挖空cutting裁板cyanide氰化物cycles of learning学习循环cycle-time reduction交期缩短date code周期deburring去毛头dedicated专用型degradation退变delamination分层dent/pin hole凹陷/针孔department of defense国防部designation字码简示法de-smear除胶渣developing显影dewetting缩锡dewetting time缩锡时间dimension error外形尺寸错误dielectric constant介质常数difficulty困难度difunctional双功能dimension尺寸dimension stability尺寸安定性dimensional stability尺度安定性dimension and tolerance尺寸与公差dirty hole孔内异物discolor hole孔黑;孔灰;氧化discoloration变色disposable eyelet method消耗性铆钉法distortion factor尺寸变形函数double side双面板downtime停机时间drill钻孔drill bit钻头drill facet钻尖切萷面drill pointer钻尖重(研)磨机drilled blank board已钻孔之裸板drilling钻孔dry film干膜ductility延展性economy of scale经济规模edge spacing板边空地edge-board contact(gold finger)金手指efficiency能量效率electric test电测electrical testing电测;测试electrochemical machine ECM电化学加工法electrochemical reactor电化学反应器electroforming电铸electroless plate化学铜electroless-deposition无电镀electropolishing电解拋光electrorefining电解精炼electrowinning电解萃取elliptical set椭圆形embrittlement脆性entitlement performance可达成绩效entrapment电镀夹杂物epoxy环氧树酯equipotential电位线error data file异常情形etch rate蚀铜速率etchants蚀刻液etchback回蚀evaluation program评估用程序exposure曝光external pin method外部插梢法eyelet hole铆钉孔Eyeletting铆眼fabric网布failure故障fast response快速响应fault瑕庛;缺陷fiber exposure纤维显露fiber protrusion纤维突出fiducial mark光学点,基准记号filler填充料film底片filtration过滤finished board成品fixing固着fixture电测夹具(治具)flaking off粹离flammability rating燃性等级flare喇叭形孔flat cable并排电缆feedback loop回馈循环first-in-first-out(FIFO)先进先出flexible manufacturing system(FMS)弹性制造系统flux助焊剂foil distortion铜层变形fold空泡foreign include异物foreign material基材内异物free radical chain polymerization自由基连锁聚合fully additive加成法fully annealed type彻底回火轫化之类形function函数fundamental and basic基本fungus resistance抗霉性funnel flange喇叭形折翼galvanized加法尼化制程gap钻尖分开gauge length有效长度gel time胶化时间general resist ink一般阻剂油墨general通论general industrial一般性(电子)工业级geometrical levelling几何平整glass transition temperature(Tg)玻璃态转换温度Gold金gold finger金手指gold plating镀金golden board标准板gouges刷磨凹沟gouging挖破grain boundary金属晶体之四边green绿色grip夹头ground plane接地层ground plane clearance接地空环hackers骇客HAL(hot air leveling)喷锡haloing白边;白圈hardener硬化剂hardness硬度hepa filter空气滤清器high performance industrial高性能(电子)工业级high reliability高可靠度high resolution高分辨率high temperature elongation(HTE)高温延展性铜箔high temperature epoxy(HTE)高温树酯hit击hole counter数孔机hole diameter孔径hole diameter error孔径错误hole location孔位hole number孔数hole wall quality孔壁品质hook外弧hot dip热浸法hull cell哈氏槽hybrid混成集成电路hydrogen bonding氢键hydrolysis水解hydrometallurgy湿法冶金法image analysis system影像分析系统image transfer影像转移immersion gold浸金(化镍金) immersion plating浸镀法impedance阻抗infrared reflow红外线重熔inhibitor热聚合抑制剂injection mold射模ink油墨innerlayer&outlayer内外层insulation resistance绝缘电阻intended position应该在的位置intensifier增强器intensity强度inter molecular exchange交互改变interconnection互相连通ionic contaminants离子性污染物ionic contamination testing离子污染试验IPA异丙醇5I:inspiration(启蒙)identification确认计划目标implementation改善方案information数据internalization制度化invisible inventory无形的库存knife edges刀缘Knoop努普(硬度单位)kraft paper牛皮纸返回顶部laminar flow层流laminate基层板laminating压合lamination压合laminator压膜机land焊垫lay back刃角磨损lay up组合叠板layout布线;布局lead screw牵引螺丝leakage漏电learning curve学习曲线legend文字标记leveling平整levelling additive平整剂levelling power平整力life support维系生命limiting current极限电流line space线距line width线宽linear variable differential transformer(LVDL)线性可变差动:转换器liquid液状(态)liquid crystal resins液晶树脂liquid photoimageable solder resist ink液态感光防焊油墨liquid photoresist ink液态光阻剂油墨lot size批量lower carrier底部承载板mechanical plating机祴镀法machine scrub刷磨清洁法macrothrowing power巨分布力margin钻头刃带market share市场占有率marking error文字错误masked leveling儰装平整mass lamination大型压板mass transfer质量传送效应mass transfer overpotential质量传递过电压mass transportation质传master drawing主图;蓝图material use factor材料使用率mealing泡点;白点memory记忆装置meniscograph solderability measurement新月型焊锡效果microetch微蚀microetching微蚀microfocus微焦距microfocus system微焦距系统microprofile微表面microsectioning微切片法microthrowing power微分布力migration迁移mini-tensile tester迷你拉力测试仪mis hole location孔位错误misregistration焊锡面与零件面对位偏差misregsitration对不准moisture and insulation resistance test湿气与绝缘电阻试验molded circuit board(MCB)模制电路板monoethanal amine单乙醇氨monohydrate state水化物monomer单分子膜;单体mouse bite锯齿;蚀刻缺口msec毫秒muffle furnace高温焚火炉multichip超大IC型(多芯片模块)mylar保护膜nail head钉头NC drill数字钻孔机negative etchback反回蚀negative film负片negative rake angle负抠耙角network回路;网络neutralization中和nick缺口nickel镍nodule铜瘤;瘤粒no flow resin不流树脂noise噪声nominal标示nominal dimension标定长度nominal gel time标示胶性时间nominal resin content标示胶含量nominal resin flow标示胶流量nominal scaled flow thickness标示比例流量厚度OA equip办公室自动:化设备obsolescence factor报废因素OEM原设备制造商offset-list补偿数据清单ohmmeter欧姆计open断路open circuits断路open short testing断短路测试opening开口original art work(A/W)原稿底片Others其它outgrowth增出over design牛刀杀鸡overlap钻尖重叠overlay entry盖板overpotential过电压oxidation氧化oxide treatment黑化处理oxided cytochrome氧化性之细包色素oxygen evolution氧气发生反应packed bed充填床式pad锡垫;圆配pad copper exposure pad露铜panel小型板面;母板panel plating一次铜电镀parasitic寄生的part no.料号pattern plating二次铜电镀PCB(print circuit board)印刷电路板pcs片peel strength抗撕强度peeling off剥离(剥落)performance specification性能规范permittivity透电率perspectives on experience经验透视PET聚酯photodiode detector发光二极管侦测器photo initiator感光启始剂photoresist光阻phototool光具(指工作底片)piece子板面pinceton applied research腐蚀测定仪pink ring粉红圈pit凹点pitch脚距planar平面plating电镀plating exposure下镀层露出plug gauge插规plug hole孔塞PNL(panel)排板polar-polar interaction极性之间的吸力polyester聚酯类polyglycols聚乙二醇polyimide聚亚醯氨poor bevelling磨边加工引起突起,剥离poor drill孔形不良poor HAL喷锡不良poor marking字体不良poor pad锡垫不良poor printed印刷偏差poor solderability焊锡性不良poor touch-up补线不良position control system位置控制系统positive rake angle正抠耙角power curve model幕次曲线模式practice工艺惯例preferred良好premature tearing提前撕裂prepolymer预聚合物prepreg胶片pre-process(front-end)制前press压床press cycle压合周期primary current distribution一次电流分布primary主要product lifetimes生命周期product process制程promoter促进剂protocal初步资料prussic acid普鲁士酸PTF-based process厚膜糊法PTH(plating though hole)导通孔pull away拉开pumice浮石粉pumice scrub喷砂清洁法pyrometallurgy火烧法冶炼QC(quality control)品管QFP(quad flat pack)扁方型封装体qualification inspection资格审查检验qualification testing资格检定quality classification品质等级quantitative计量式测试rack挂架radiometer能量剂rake angle抠耙角RAM[Random Access Memory随机存取内存real time关键时刻recessed trace process凹槽线路法recovery tank回收槽reduction还原re-eninforcement强化refraction折光率reinforcement style补强材料的型式register mark对位用标记registration hole对位孔registration pattern长方形铜地REJ(reject)退货;拒收rejectable拒收release agent脱模剂relief angle浮离角remark备注repair修理resin content树脂含量(胶含量)resin flow胶流量resin flow percentage树脂流量之百分率resin recession树脂下陷resin smear胶渣resist strippers剥干膜剂resistor network排列电阻resolution解像度return on assets资产报酬率reversibility可逆性rework重工rosin天然松香rotating cylinder旋转圆柱形roughtness孔壁粗糙;粗慥routing切外形,成型routing bit铣刀runout偏转S/L on hole孔内沾文字S/M(solder mask),S/L防焊文字S/M(solder mask)防焊S/M error防焊种类错误S/M on hole孔内绿漆salt spray test盐水喷雾试验sampling size抽样数scope范围scored刻痕scoring枢槽;刮线scrap废框scratches刮伤screen printing网版印刷scum透明残膜sealing封孔处理secondary次要semi-additive半加成法sensitize敏化sensitizer敏化液separator钢隔板sequential lamination渐成式压法serrated edges毛边shatter破碎short短路shunt分路silane treatment硅烷处理silicone coupling agent硅烷偶合剂silk screen文字印刷simulator仿真器single axis单轴sizing底片之伸缩补偿skip漏印skip printing跳印;漏印sliver丝条slot开槽slotting开槽SMD(surface mount device)表面黏着组件smear胶渣SMT(surface mount technology)表面黏着技术sodium carbonate monohydrate结晶水碳酸钠soft tooling软性工具solder焊锡;锡铅solder bridge锡桥solder bump锡突solder float漂锡solder mask adhesion绿漆附着力solder on G/F金手指沾锡solder on trace线路沾锡solder plug锡塞solder side焊锡面solderability焊锡性solid carbide实质碳化物spacing间距spacing nonenough间距不足SPC(Statistical Process Control)统计生管specification规范special considerations特别考虑spin coating旋转涂布spindle钻轴spiral contractometer螺旋收缩仪spot face铣靶spray coating喷涂Squeegee刮刀stacking structure叠板结构stamping冲压standard hydraulic lamination标准液压法standardizing标准化starvation缺胶step tablet格片数stock option认股选择权strain应度strength强度stressmeter应力计subtractive减除法surface convex表面突起surface examination表面检查surface insulation resistance(SIR)表面绝缘电阻surface mount表面黏着方式surface roughness表面粗慥度surges突波switch circuit开关线路tab金手指tack free不黏taped hole gauge锥形孔规target hole靶孔task force任务编组tensile strength抗拉强度tensile stress张性应力tent浮盖terms and definitions术语与定义termination load抗匹配负载test circuit测试线路test method试验方法test point测试点thermal shock热震荡试验thermal stress热应力试验thermistor热电感应式thermo cycling热循环试验theoretical cycle time理论性周期时间thickness厚度time to market上市时机thickness distribution厚度分布thief补助阴极thin core薄基板;内层板throwing power分布力tolerance公差;容差tooling hole工具孔torque load扭力拒之负载total quality program全面的品质计划toughness坚度trace error线路错误trace nick&pin hole线路缺口及针孔trace peeling线路剥离trace pin-hole线路针孔trace surface roughness线路表面粗糙tarnish and oxide resist抗污抗氧化剂transmittance透光度trim line裁切线true levelling真平整true position真正位置的孔;真位twist板翘type种类umbra本影undercut侧蚀uneven coating喷锡厚镀不平整universal万用型universal tensile tester万用拉力试验机universal tester泛用型测试机upper carrier顶部承载钢uptime稼动:时间vacuum deposition真空蒸镀法vacuum hydraulic lamination真空液压法vaporizer气化室V-cut V形槽vertical microsection垂直微切片via hole导通孔visible inventory有形的库存vision inspection目视检查Void孔破void in hole孔壁上的破洞void in PTH hole孔破walkman随身听warehouse仓库warp板弯warp,warpage板弯water absorption吸水性wear resistance耐磨度weave exposure纤纹显露weave texture织纹隐现wedge angle契尖角week周wet chemistry湿式化学制程wet film湿膜wet lamination湿膜压膜法wet process湿制程wetting沾锡wetting balance沾锡平衡法wicking渗铜;渗入;灯蕊效应width宽度width reduce线细width-to-thickness ratio宽度与厚度的比值window操作范围work-in-process在制品work order工单working film工作片working master工作母片year年yellow金黄色yield良率（资料整理PCB技术之家）。

PCB英文术语整理

b/電路板朮語總整理*****A*****Abietic Acid松脂酸.Abrasion Resistance耐磨性.Abrasives磨料,刷材.ABS樹脂.Absorption吸收(入).Ac Impedance交流阻抗. Accelerated Test(Aging)加速老化(試驗). Acceleration速化反應. Accelerator 加速劑,速化劑. Acceptability,Acceptance 允收性,允收.Access Hole露出孔,穿露孔. Accuracy准確度.Acid Number (Acid Value)酸值.Acoustic Microscope (AM)感音成像顯微鏡. Acrylic壓克力(聚丙烯酸樹脂). Actinic Light (or Intensity, or Ra有效光.Activation活化.Activator活化劑.Active Carbon活性炭.Active Parts(Devices)主動零件.Acutance解像銳利度.Addition Agent添加劑.Additive Process加成法.Adhesion附著力.Adhesion Promotor附著力促進劑. Adhesive膠類或接著劑.Admittance導納(阻抗的倒數). Aerosol噴霧劑,氣熔膠,氣懸體. Aging老化.Air Inclusion氣泡夾雜.Air Knife風刀.Algorithm演算法.Aliphatic Solvent脂肪族溶劑. Aluminium Nitride(AlN)氮化鋁.Ambient Tamp環境溫度. Amorphous無定形,非晶形.Amp-Hour安培小時.Analog Circuit/Analog Signal類比電路/類比訊號. Anchoring Spurs著力爪.Angle of Contack接觸角.Angle of Attack攻角.Anion陰離子.Anisotropic異向性,單向的. Anneal 韌化(退火).Annular Ring孔環.Anode陽極.Anode Sludge陽極泥.Anodizing陽極化.ANSI美國標準協會.Anti-Foaming Agent消泡劑.Anti-pit Agent抗凹劑.AOI自動光學檢驗. Apertures開口,鋼版開口.AQL品質允收水準.AQL(Acceptable Quality Level)允收品質水準. Aramid Fiber聚醯胺纖維.Arc Resistance耐電弧性.Array排列.Artwork底片.ASIC特定用途勣體電路器. Aspect Ratio縱橫比.Assembly組裝裝配.A-stage A階段.ATE自動電測設備. Attenuation訊號衰減.Autoclave壓力鍋.Axial-lead軸心引腳. Azeotrope共沸混合液.*****B*****Back Light (Back Lighting)背光法.Back Taper反錐斜角. Backpanels, Backplanes支撐板.Back-up 墊板.Balanced Transmission Lines平衡式傳輸線.Ball Grid Array球腳陣列(封裝). Bandability彎曲性.Banking Agent護岸劑.Bare Chip Assembly裸體晶片組裝. Barrel孔壁,滾鍍.Base Material基材.Basic Grid基本方格.Batch批.Baume波美度(凡液體比重比水重則 Be=145-(1凡液體比重比水輕則 Be=140÷(Sp.Gr-13*Sp.Gr 為比重即同體勣物質對"純水"1g/ Beam lead光芒式的平行密集引腳.Bed-of-Nail Testing針床測試.Bellows Conact彈片式接觸.Beta Ray Backscatter貝他射線反彈散射.Bevelling切斜邊.Bias斜張綱布,斜纖法.Bi-Level Stencil]雙階式鋼板.Binder粘結劑.Bits頭(Drill Bits).Black Oxide黑氧化層.Blanking沖空斷開.Bleack 漂洗.Bleeding溢流.Blind Via Hole肓通孔.Blister局部性分層或起泡.Block Diagram電路系統塊圖 .Blockout封綱.Blotting干印.Blotting Paper吸水紙.Blow Hole吹孔.Blue Plaque藍紋(錫面鈍化層).Blur Edge (Circle)模糊邊帶(圈).Bomb Sight彈標.Bond Strength結合強度.Bondability結合性.Bonding Layer結合層接著層.Bonding Sheet(Layer)接合片.Bonding Wire結合線.Bow, Bowing板彎.Braid編線.Brazing硬焊(用含銀的銅鋅合金焊條).在425℃~870℃下進行熔接的方式). Break Point顯像點.Break-away Panel可斷開板.Breakdown Voltage崩潰電壓.Break-out破出.Bridging搭橋.Bright Dip光澤浸漬處理.Brightener光澤劑.Brown Oxide棕氧化.Brush Plating刷鍍.B-stage B階段.Build Up Process增層法制程.Build-up堆積.Bulge鼓起.Bump 突塊.Bumping Process击塊制程.Buoyancy浮力.Buried Via Hole埋導孔.Burn-in高溫加速老化試驗.Burning燒焦.Burr毛頭.Bus Bar勤電杆.Butter Coat 外表樹脂層.*****C*****C4 Chip Joint C4晶片焊接. Cable電纜.CAD電腦輔助設計. Calendered Fabric軋平式綱布.Cap Lamination帽式壓合法. Capacitance電容.Capacitive Coupling電容耦合. Capillary Action毛細作用. Carbide碳化物.Carbon Arc Lamp碳弧燈.Carbon Treatment, Active活化炭處理. Card卡板.Card Cages/Card Racks電路板搆裝箱. Carlson Pin卡氏定位稍. Carrier載體.Cartridge濾心. Castallation堡型勣體電路器. Catalyzed Board, Catalyzed Subs催化板材. Catalyzing催化.Cathode陰極.Cation陰向離子, 陽离子. Caul Plate隔板.Cavitation空泡化半真空. Center-to-Center Spacing中心間距. Ceramics陶瓷.Cermet陶金粉.Certificate証明書.CFC氟氫碳化物. Chamfer倒角. Characteristic Impedance特性阻抗.Chase綱框.Check List檢查清單.Chelate螯合.Chemical Milling化學研磨. Chemical Resistance抗化性. Chemisorption化學吸附.Chip晶片(粒).Chip Interconnection晶片互連.Chip on Board晶片粘著板.Chip On Glass晶玻接裝(COG). Chisel鑽針的尖部. Chlorinated Solvent含氯溶劑,氯化溶劑. Circumferential Separation環狀斷孔.Clad/Cladding披覆.Clean Room無塵室. Cleanliness清潔度.Clearance余地,余環. Clinched Lead Terminal緊箝式引腳. Clinched-wire Through Connecti通孔彎線連接法 . Clip Terminal繞線端接.Coat, Coating皮膜表層.Coaxial Cable同軸纜線. Coefficient of Thermal Expansion熱膨脹系數.Co-Firing共繞.Cold Flow冷流.Cold Solder Joint冷焊點.Collimated Light平行光.Colloid膠體.Columnar Structure柱狀組織.Comb Pattern梳型電路.Complex Ion錯離子.Component Hole零件孔.Component Orientation零件方向.Component Side組件面.Composites,(CEM-1,CEM-3)復合板材. Condensation Soldering凝熱焊接,液化放熱焊接. Conditioning整孔.Conductance導電.Conductive Salt導電鹽.Conductivity導電度.Conductor Spacing導體間距.Conformal Coating貼護層.Conformity吻合性, 服貼性. Connector連接器.Contact Angle接觸角.Contact Area接觸區.Contact Resistance接觸電阻.Continuity連通性.Contract Service協力廠,分包廠. Controlled Depth Drilling定深鑽孔.Conversion Coating 轉化皮膜.Coplanarity共面性.Copolymer共聚物. Copper Foil銅皮.Copper Mirror Test銅鏡試驗. Copper Paste銅膏.Copper-Invar-Copper (CIC)綜合夾心板. Core Material內層板材,核材. Corner Crack 通孔斷角. Corner Mark板角標記. Counterboring方型擴孔. Countersinking錐型擴孔. Coupling Agent 偶合劑. Coupon, Test Coupon板邊試樣. Coverlay/Covercoat表護層.Crack裂痕.Crazing白斑.Crease皺折.Creep潛變. Crossection Area截面積. Crosshatch Testing十字割痕試驗. Crosshatching十字交叉區. Crosslinking, Crosslinkage交聯,架橋. Crossover越交,搭交. Crosstalk雜訊, 串訊. Crystalline Melting Point晶體熔點.C-Stage C階段.Cure硬化,熟化. Current Density電流密度. Current-Carrying Capability載流能力.Curtain Coating濂塗法.*****D*****Daisy Chained Design菊瓣設計.Datum Reference基准參考.Daughter Board子板.Debris碎屑,殘材.Deburring去毛頭.Declination Angle斜射角.Definition邊緣逼真度.Degradation 劣化.Degrasing脫脂.Deionized Water去離子水.Delamination分離.Dendritic Growth 枝狀生長.Denier丹尼爾(是編織紡織所用各種紗類直徑單定義9000米紗束所具有的重量(以克米計Densitomer透光度計.Dent凹陷.Deposition 皮膜處理.Desiccator干燥器.Desmearing去膠渣.Desoldering解焊.Developer顯像液,顯像機.Developing顯像 .Deviation偏差.Device電子元件.Dewetting縮錫.D-glass D玻璃.Diaze Film偶氮棕片. Dichromate重鉻酸鹽.Dicing晶片分割. Dicyandiamide(Dicy)雙氰胺.Die 沖模.Die Attach晶粒安裝.Die Bonding晶粒接著.Die Stamping沖壓.Dielectric 介質.Dielectric Breakdown Voltage介質崩潰電壓. Dielectric Constant介質常數.Dielectric Strength介質強度.微差掃瞄熱卡分析法. Differential Scanning CalorimetryDiffusion Layer擴散層.Digitizing數位化.Dihedral Angle雙反斜角. Dimensional Stability尺度安定性.Diode二極體.Dip Coating浸塗法.Dip Soldering浸焊法.DIP(Dual Inline Package)雙排腳封裝體. Dipole偶極,雙極.Direct / Indirect Stencil直接/間接版膜. Direct Emulsion直接乳膠.Direct Plating直接電鍍.Discrete Compenent散裝零件.Discrete Wiring Board散線電路板,復線板. Dish Down碟型下陷.Dispersant分散劑. Dissipation Factor散失因素. Disspation Factor散逸因子. Disturbed Joint受擾焊點. Doctor Blade修平刀,刮平刀. Dog Ear狗耳.Doping摻雜.Double Layer雙電層.Double Treated Foil雙面處理銅箔. Drag In / Drag Out帶[進/帶出. Drag Soldering拖焊. Drawbridging吊橋效應.Drift漂移.Drill Facet鑽尖切削面. Drill Pointer鑽針重磨機. Drilled Blank已鑽孔的裸板. Dross浮渣.Drum Side銅箔光面.Dry Film干膜.Dual Wave Soldering 雙波焊接. Ductility展性.Dummy Land假焊墊. Dummy, Dummying假鍍(片). Durometer橡膠硬度計. DYCOstrate電漿蝕孔增層法. Dynamic Flex(FPC)動態軟板.*****E*****E-Beam (Electron Beam)電子束.Eddy Current渦電流.Edge Spacing板邊空地.Edge-Board Connector板邊(金手指)承接器. Edge-Board Contact板邊金手指.Edge-Dip Solderability Test板邊焊錫性測試. EDTA乙二胺四乙酸. Effluent排放物.E-glass電子級玻璃. Elastomer彈性體.Electric Strength(耐)電性強度. Electrodeposition電鍍.Electro-deposition Photoresist電著光阻, 電泳光阻. Electroforming電鑄.Electroless-Deposition無電鍍.Electrolytic Tough Pitch電解銅.. Electrolytic-Cleaning電解清洗.Electro-migration電遷移.Electro-phoresis電泳動, 電滲. Electro-tinning鍍錫.Electro-Winning電解冶煉. Elongation 延伸性, 延伸率. Embossing击出性壓花.EMF(Electromotive Force)電動勢.EMI(Electromagnetic Interferenc電磁干擾. Emulsion乳化.Emulsion Side藥膜面. Encapsulating膠囊. Encroachment沾污,侵犯.End Tap封頭.Entek有機護銅處理. Entrapment夾雜物.Entry Material蓋板.Epoxy Resin環氧樹脂.Etch Factor蝕刻因子.Etchant蝕刻劑(液). Etchback回蝕.Etching Indicator蝕刻指標.Etching Resist蝕刻阻劑.Eutetic Composition共融組成. Exotherm放熱(曲線). Exposure曝光.Eyelet鉚眼.*****F*****Fabric綱布.Face Bonding反面朝下結合. Failure故障.Fan Out Wiring/Fan In Wiring扇出布線/扇入布線. Farad 法拉.Farady法拉第.Fatigue Strength抗疲勞強度.Fault缺陷.Fault Plane斷層面.Feed Through Hole導通孔.Feeder 進料器.Fiber Exposure玻纖顯露.Fiducial Mark基准記號.Filament纖絲.Fill緯向.Filler填充料.Fillet內圓填角.Film底片.Film Adhesive接著膜,粘合膜.Filter過濾器.Fine Line細線.Fine Pitch密腳距,密線距,密墊距. Fineness粒度, 純度.Finger手指.Finishing終修(飾).Finite Element Method有限要素分析法.First Article首產品.First Pass-Yield初檢良品率.Fixture夾具.Flair刃角變形.Flame Point自燃點.Flame Resistant耐燃性.Flammability Rate燃性等級.Flare扇形崩口.Flash Plating閃鍍.Flashover閃絡.Flat Cable扁平排線.Flat Pack扁平封裝(之零件). Flatness平坦度.Flexible Printed Circuit (FPC)軟板.Flexural Failure撓曲損壞.Flexural Module彎曲模數, 抗撓性模數 . Flexural Strength抗撓強度.Flip Chip覆晶,扣晶.Flocculation絮凝.Flood Stroke Print覆墨沖程印刷.Flow Soldering (Wave Soldering流焊.Fluorescence熒光.Flurocarbon Resin碳氟樹脂.Flush Conductor嵌入式線路 , 貼平式導體. Flush Point閃火點.Flute退屑槽.Flux助焊劑.Foil Burr銅箔毛邊.Foil Lamination銅箔壓板法.Foot殘足(干膜殘余物).Foot Print (Land Pattern)腳墊.Foreign Material 外來物,異物.Form-to-List布線說明清單.Four Point Twisting四點扭曲法.Free Radical自由基.Freeboard干舷.Frequency頻率.Frit 玻璃熔料.Fully-Additive Process全加成法.Fungus Resistance抗霉性.Fused Coating熔錫層.Fusing熔合.Fusing Fluid助熔液.*****G*****G-10由連續玻纖所織成的玻纖布與環氧樹脂粘結劑所復合成的材料. Gage, Gauge量規.Gallium Arsenide (GaAs)砷化鎵.Galvanic Corrosion賈凡尼式腐蝕(電解式腐蝕).Galvanic Series賈凡尼次序(電動次序).Galvanizing鍍鋅.GAP第一面分離,長刃斷開.Gate Array閘列,閘極陣列.Gel Time膠化時間.Gelation Particle膠凝點.Gerber Data ,Gerber File格博檔案(是美商Gerber公司專為PCB面線圖形與孔位,所發展一系列完整的軟體檔Ghost Image陰影.Gilding鍍金 (現為:Glod Plating).Glass Fiber玻纖.Glass Fiber Protrusion/Gouging, 玻纖突出/挖破.Glass Transition Temperature, Tg玻璃態轉化溫度.Glaze釉面,釉料.Glob Top圓頂封裝體.Glouble Test球狀測試法.Glycol (Ethylene Glycol)乙二醇.Golden Board測試用標準板.Grain Size結晶粒度.Grass Leak 大漏.Grid標准格.Ground Plane /Earth Plane接地層.Ground Plane Clearance接地空環.Guide Pin導針.Gull /Wing Lead鷗翼引腳.*****H*****Halation環暈.Half Angle半角.Halide鹵化物.Haloing白圈,白邊.Halon海龍,是CFC"氟碳化物"的一種商品名. Hard Anodizing硬陽極化.Hard Chrome Plating鍍硬鉻.Hard Soldering硬焊.Hardener (Curing Agent)硬化劑(或Curing Agent).Hardness硬度.Haring-Blum Cell海固槽.Harness電纜組合.Hay Wire跳線.Heat Cleaning燒潔.Heat Dissipation散熱.Heat Distortion Point (Temp)熱變形點(溫度).Heat Sealing熱封.Heat Sink Plane散熱層.Heat Transfer Paste導熱膏.Heatsink Tool散熱工具.Hertz(Hz)赫.High Efficiency Particulate Air F高效空氣塵粒過瀘機.Hipot Test 高壓電測.Hi-Rel高度靠度.Hit 擊(鑽孔時鑽針每一次"刺下"的動作). Holding Time停置時間.Hole Breakout孔位破出.Hole Counter數孔機.Hole Density孔數密度.Hole Preparation通孔准備.Hole Pull Strength孔壁強度.Hole Void破洞.Hook 切削刀緣外击.Hot Air Levelling噴錫.Hot Bar Soldering熱把焊接.Hot Gas Soldering熱風手焊.HTE(High Temperature Elongati高溫延伸性.Hull Cell哈氏槽.Hybrid Integrated Circuit混成電路.Hydraulic Bulge Test液壓鼓起試驗.H ydrogen Embrittlement氫脆.Hydrogen Overvoltage氫過(超)電壓.Hydrolysis水解.Hydrophilic親水性.Hygroscopic吸溼性.Hypersorption超吸咐.*****I*****I.C. Socket勣體電路器插座.Icicle錫尖.Illuminance照度.Image Transfer影像轉移.Immersion Plating浸鍍.Impedance阻抗.Impedance Match阻抗匹配.Impregnate含浸.In-Circuit Testing組裝板電測.Inclusion異物,夾雜物.Indexing Hole基准孔.Inductance(L)電感.Infrared(IR)紅外線.Input/Output輸入/輸出.Insert, Insertion插接.Inspection Overlay套檢底片.Insulation Resistance絕緣電阻.Integrated Circuit(IC)勣體電路器.InterFace介面.Interconnection互連.Intermetallic Compound (IMC)介面共化物.Internal Stress內應力.Interposer互邊導電物.Interstitial Via-Hole(IVH)局部層間導通孔.Invar殷鋼(63.8%Fe,36%Ni,0.2%C).Ion Cleanliness離子清潔度.Ion Exchange Resins離子交換樹脂.Ion Migration離子遷移.Ionizable (Ionic) Contaimination離子性污染.Ionization游離,電離.Ionization Voltage (Corona Leve電離化電壓(電纜內部狹縫空氣中,引起電離所施加之最小電壓).IPC美國印刷電路板協會.Isolation隔離性,隔絕性.*****J*****JEDEC(Joint Electronic Device 聯合電子元件工程委員會. Engineering Council)J-Lead J型接腳.Job Shop專業工廠.Joule焦耳.Jumper Wire跳線.Junction接(合)面,接頭.Just-In-Time(JIT)適時供應,及時出現.*****K*****Kapton聚亞醯胺軟板.Karat克拉 (1克拉(鑽石)=0.2g 純金則24k金100%的鈍金.Kauri-Butanol Value考立丁醇值(簡稱K.B.值).Kerf.切形,裁剪.Kevlar聚醯胺纖維.Key電鍵Key Board鍵盤.Kiss Pressure吻壓, 低壓.Knoop Hardness努普硬度.Known Good Die(KGD)已知之良好晶片.Kovar科伐合金(Fe53%,Ni29%,Co17%).Kraft Paper牛皮紙.*****L*****Lamda Wave延伸平波.Laminar Flow平流.Laminar Structure片狀結搆.Laminate Void板材空洞. Laminate(s)基板.Lamination Void壓合空洞. Laminator壓膜機.Land孔環焊墊,表面焊墊. Landless Hole無環通孔.Laser Direct Imaging (LDI)雷射直接成像. Laser Maching雷射加工法.雷射曝光機.Laser Photogenerator(LPG), LaseLaser Soldering雷射焊接法.Lay Back 刃角磨損.Lay Out布線,布局.Lay Up 疊合.Layer to Layer Spacing層間距離Leaching焊散漂出,熔出. Lead 引腳.Lead Frame腳架.Lead Pitch腳距.Leakage Current漏電電流.Legend文字標記.Leveling整平.Lifted Land孔環(焊墊)浮起. Ligand錯離子附屬體. Light Emitting Diodes (LED)發光二極體.Light Integrator光能累積器.Light Intensity光強度.Limiting Current Density極限電流密度. Liquid Crystal Display (LCD)液晶顯示器.Liquid Dielectrics液態介質.液態感光防焊綠漆.Liquid Photoimagible Solder MasLocal Area Network區域性網路.Logic 邏輯.Logic Circuit 邏輯電路.Loss Factor損失因素.Loss Tangent (TanδDK)損失正切.Lot Size批量.Luminance發光強度.Lyophilic親水性膠體.*****M*****Macro-Throwing Power巨觀分布力.Major Defect主要(嚴重)缺點.Major Weave Direction主要織向.Margin刃帶(鑽頭尖部).Marking標記.Mask阻劑.Mass Finishing大量整面(拋光).Mass Lamination大型壓板.Mass Transport質量輸送.Master Drawing主圖.Mat蓆(用于CEM-3(Composite Epoxy Material)復合材料.)Matte Side毛面(電鍍銅皮(ED Foil)之粗糙面). Mealing泡點.Mean Time To Failure (MTTF)故障前可用之平均時數.Measling白點.Mechanical Stretcher機械式張網機.Mechanical Warp機械式纏繞. Mechanism機理.Membrane Switch薄膜開關. Meniscograph Test弧面狀沾錫試驗. Meniscus彎月面.Mercury Vaper Lamp汞氣燈.Mesh Count綱目數.Metal Halide Lamp 金屬鹵素燈. Metallization金屬化.Metallized Fabric金屬化綱布.Micelle微胞.Micro Wire Board微封線板.Micro-electronios微電子. Microetching微蝕. Microsectioning微切片法.Microstrip 微條.Microstrip Line微條線,微帶線. Microthrowing Power微分布力. Microwave微波.Migration遷移.Migration Rate遷移率.Mil英絲.Minimum Annular Ring孔環下限.Minimum Electrical Spacing電性間距下限.Minor Weave Direction次要織向. Misregistration 對不准度.Mixed Componmt Mounting Tec混合零件之組裝技術. Modem調變及解調器.Modification修改.Module模組.Modulus of Elasticity彈性系數.溼氣與絕緣電阻試驗.Moisture and Insulation ResistancMold Release 脫模劑,離型劑.Mole摩爾.Monofilament單絲.Mother Board主機板,母板.Moulded Circuit模造立體電路機.Mounting Hole安裝孔.Mounting Hole組裝孔,機裝孔.Mouse Bite鼠齒(蝕刻后線路邊緣出現不規則缺口). Multi-Chip-Module(MCM)多晶片芯片模組.復線板.Multiwiring Board (or Discrete W*****N*****N.C.數值控制.Nail Head釘頭.Near IR近紅外線.Negative負片,鑽尖的第一面外緣變窄. Negative Etch-back反回蝕.Negative Stencil負性感光膜.Negative-Acting Resist負性作用之阻劑.Network綱狀元件.Newton牛頓.Newton Ring 牛頓環.Newtonian Liquid牛頓流體.Nick缺口.N-Methyl Pyrrolidine (NMP)N-甲基四氫嗶咯.Noble Metal Paste貴金屬印膏.Node節點.Nodule節瘤. Nomencleature標示文字符號. Nominal Cured Thickness標示厚度.Non-Circular Land非圓形孔環焊墊. Non-flammable非燃性.Non-wetting不沾錫.標準濃度,當量濃度. Normal Concentration (Strength)Normal Distribution常態分布.Novolac酯醛樹脂. Nucleation , Nucleating核化.Numerical Control數值控制.Nylon尼龍.*****O*****Occlusion吸藏.Off-Contact架空.Offset第一面大小不均. OFHC(Oxyen Free High Conduc無氧高導電銅. Ohm歐姆.Oilcanning蓋板彈動.OLB(Outer Lead Bond)外引腳結合. Oligomer寡聚物.Omega Meter離子污染檢測儀. Omega Wave振盪波.On-Contact Printing密貼式印刷. Opaquer不透明劑,遮光劑. Open Circuits斷線.Optical Comparater光學對比器(光學放大器.) Optical Density光密度.Optical Inspection光學檢驗.Optical Instrument光學儀器.Organic Solderability Preservativ有機保焊劑.Osmosis滲透.Outgassing出氣,吹氣.Outgrowth懸出,橫出,側出.Output產出,輸出.Overflow溢流.Overhang總懸空.Overlap 鑽尖點分離. Overpotantial(Over voltage)過電位,過電壓. Oxidation氧化.Oxygen Inhibitor氧化抑制劑.Ozone Depletion臭氧層耗損.*****P*****Packaging封裝,搆裝.Pad焊墊,圓墊.Pad Master圓墊底片.Pads Only Board唯墊板.Palladium鈀.Panel制程板.Panel Plating全板鍍銅.Panel Process全板電鍍法.Paper Phenolic紙質酚醛樹脂(板材). Parting Agent脫膜劑.Passivation鈍化 ,鈍化外理.Passive Device (Component)被動元件(零件)Paste膏,糊.Pattern板面圖形.Pattern Plating線路電鍍.Pattern Process線路電鍍法.Peak Voltage峰值電壓.Peel Strength抗撕強度.Periodic Reverse (PR) Current周期性反電流. Peripheral周邊附屬設備. Permeability透氣性,導磁率. Permittivity誘電率,透電率.pH Value酸堿值.Phase相.Phase Diagram相圖.Phenolic酚醛樹脂. Photofugitive感光褪色. Photographic film感光成像之底片. Photoinitiator感光啟始劑. Photomask光罩.Photoplotter, Plotter光學繪圖機. Photoresist光阻.光阻式化學(銑刻)加工. Photoresist Chemical MachinningPhototool底片.Pick and Place拾取與放置. Piezoelectric壓電性.Pin 插腳,插梢,插針.Pin Grid Array (PGA)矩陣式針腳對裝. Pinhole針孔.Pink Ring粉紅圈.Pitch跨距,腳距,墊距,線距.Pits凹點.Plain Weave平織.Plasma電漿.Plasticizers可塑劑,增塑劑.Plated Through Hole鍍通孔.Platen熱盤.Plating鍍.Plotting標繪.Plowing犁溝.Plug插腳,塞柱.Ply層,股.Pneumatic Stretcher氣動拉伸器.Pogo Pin伸縮探針.Point 鑽尖.Point Angle鑽尖面.Point Source Light點狀光源.Poise泊."粘滯度"單位=1dyne*sec/cm2. Polar Solvent極性溶劑.Polarity電極性.Polarization分極,極化.Polarizing Slot偏槽.Polyester Films聚酯類薄片.Polymer Thick Film (PTF)厚膜糊.Polymerization聚合.Polymide(PI)聚亞醯胺.Popcorn Effect爆米花效應.Porcelain瓷材,瓷面.Porosity Test疏孔度試驗.Positive Acting Resist正性光阻劑.Post Cure后續硬化,后烤.Post Separation后期分離,事后公離.Pot Life運用期,鍋中壽命.Potting鑄封,模封.Power Supply電源供應器.Preform 預制品.Preheat預熱.Prepreg膠片,樹脂片.Press Plate鋼板.Press-Fit Contact擠入式接觸.Pressure Foot 壓力腳.Pre-tinning預先沾錫.Primary Image線路成像.Print Through壓透,過度擠壓..Probe探針.Process Camera制程用照像機.Process Window操作范圍.Production Master生產底片.Profile輪廓,部面圖,升溫曲線圖稜線. Propagation傳播.Propagation Delay傳播延遲.Puddle Effect水坑效應.Pull Away拉離.Pulse Plating脈沖電鍍法.Pumice Powder 浮石粉.Punch沖切.Purge, Purging淨空,淨洗.Purple Plague紫疫(金與鋁的共化物層). Pyrolysis熱裂解,高溫分解.*****Q*****Quad Flat Pack (QFP)方扁形封裝體. Qualification Agency資格認証機搆. Qualification Inspection資格檢驗.Qualified Products List合格產品(供應者)名單. Qualitative Analysis定性分析.品質符合之試驗線路(樣板). Quality Conformance Test CircuiQuantitative Analysis定量分析.Quench 淬火,驟冷.Quick Disconnect快速接頭.Quill緯紗繞軸.*****R*****Rack 挂架.Radial Lead放射狀引腳.Radio Frequency Interference (RF射頻干擾.Rake Angle摳角,耙角.Rated Temperature, Voltage額定溫度,額定電壓. Reactance電抗.Real Estate底材面,基板面.Real Time System 即時系統.Reclaiming再生,再制.Rediometer輻射計,光度計.Reel to Reel卷輪(盤)式操作. Reference Dimension參考尺度.Reference Edge參考邊緣. Reflection反射.Reflow Soldering重熔焊接,熔焊. Refraction折射.Refractive Index折射率.Register Mark對准用標記. Registration對准度. Reinforcement補強物.Rejection剔退,拒收. Relamination(Re-Lam)多層板壓合. Relaxation松弛.緩和.Relay繼電器.Release Agent, Release Sheets脫模劑,離模劑. Reliability可靠度,可信度. Relief Angle浮角.Repair修理.Resin Coated Copper Foil背膠銅箔.Resin Content膠含量,樹脂含量. Resin Flow膠流量,樹脂流量. Resin Recession樹脂下陷.Resin Rich Area 多膠區,樹脂丰富區. Resin Smear膠(糊)渣.Resin Starve Area缺膠區,樹脂缺乏區. Resist阻膜,阻劑. Resistivity電阻系數,電阻率. Resistor電阻器,電阻. Resistor Drift電阻漂移.Resistor Paste電阻印膏.Resolution解像,解像度,解析度.Resolving Power解析(像)力,分辨力.Reverse Current Cleaning反電流(電解)清洗.Reverse Etchback反回蝕.Reverse Image負片影像(阻劑).Reverse Osmosis (RO)反(逆滲透).Reversion反轉,還原.Revision修正版.改訂版.Rework(ing)重工,再加工.Rhology流變學,流變性質.Ribbon Cable圓線纜帶.Rigid-Flex Printed Board硬軟合板.Ring 套環.Rinsing水洗,沖洗.Ripple紋波(指整流器所輸出電流中不穩定成分Rise Time上升時間.Roadmap 線路與零件之布局圖.Robber輔助陰極.Roller Coating輥輪塗布.Roller Coating滾動塗布法.Roller Cutter輥切機.Roller Tinning輥錫法,滾錫法.Rosin松香.Rotary Dip Test擺動沾錫試驗.Routing切外型.Runout偏轉,累勣距差.Rupture迸裂.*****S*****Sacrificial Protection犧牲性保護層. Salt Spray Test鹽霧試驗. Sand Blast噴砂. Saponification皂化作用. Saponifier皂化劑.Satin Finish緞面處理. Scaled Flow Test比例流量實驗. Schemetic Diagram電路概略圖. Scoring V型刻槽. Scratch刮痕.Screen Printing綱版印刷. Screenability綱印能力. Scrubber磨刷機,磨刷器. Scum透明殘膜. Sealing封孔. Secondary Side第二面 . Seeding下種. Selective Plating選擇性電鍍. Self-Extinguishing自熄性. Selvage布邊.Semi-Additive Process半加成制程. Semi-Conductor半導體. Sensitizing敏化. Separable Component Part可分離式零件. Separator Plate隔板, 鋼板. Sequential Lamination接續性壓合法. Sequestering Agent螯合劑. Shadowing陰影,回蝕死角.Shank鑽針柄部.Shear Strength 抗剪強度.Shelf Life儲齡.Shield遮蔽.Shore Hardness蕭氏硬度.Short短路.Shoulder Angle肩斜角.Shunt分路.Side Wall側壁.Siemens電阻值.Sigma (Standard Deviation)標准差.Signal訊號.Silane硅烷.Silica Gel硅膠砂.Silicon硅.Silicone硅銅.Silk Screen綱版印刷,絲綱印刷.Silver Migration銀遷移.Silver Paste 銀膏.Single-In-Line Package(SIP)單邊插腳封裝體.Sintering燒結.Sizing上膠,上漿.Sizing上漿處理.Skin Effect集膚效應 (高頻下,電流在傳遞時多集中表面,使得道線內部通過電流甚少, 造成浪費,并也使得表面導體部分電阻升高. Skip Printing, Skip Plating漏印,漏鍍.Skip Solder 缺錫, 漏焊.Slashing漿經.Sleeve Jint套接.Sliver邊絲,邊余.Slot, Slotting槽口.Sludge於泥.Slump塌散.Slurry稠漿,懸浮漿. Small Hole小孔.Smear膠渣.Smudging錫點沾污.Snap-off彈回高度.Socket插座.Soft Contact輕觸.Soft Glass 軟質玻璃(鉛玻璃). Solder焊錫.Solder Ball錫球.Solder Bridging錫橋.Solder Bump 焊錫击塊.Solder Column Package錫柱腳封裝法. Solder Connection焊接.Solder Cost焊錫著層.Solder Dam錫堤.Solder Fillet填錫.Solder Levelling噴錫,熱風整平. Solder Masking(S/M)防焊膜綠漆. Solder Paste錫膏.Solder Plug錫塞(柱).Solder Preforms預焊料.Solder Projection焊錫突點.Solder Sag 焊錫垂流物.Solder Side焊錫面.Solder Spatter濺錫.Solder Splash賤錫.Solder Spread Test散錫試驗.Solder Webbing錫綱.Solder Webbing錫綱.Solder Wicking滲錫,焊錫之燈芯效應. Solderability可焊性.Soldering軟焊,焊接.Soldering Fluid, Soldering Oil助焊液,護焊油.Solid Content固體含量,固形分. Solidus Line固相線.Spacing間距.Span跨距.Spark Over閃絡.Specific Heat 比熱.Specification (Spec)規范,規格. Specimen樣品,試樣. Spectrophotometry分光光度計檢測法. Spindle主軸,鑽軸.Spinning Coating自轉塗布.Splay斜鑽孔.Spray Coating噴著塗裝.Spur底片圖形邊緣突出. Sputtering濺射.Squeege刮刀.Stagger Grid蹣跚格點.Stalagometer滴管式表面張力計.Stand-off Terminals直立型端子.Starvation缺膠.Static Eliminator靜電消除器.Steel Rule Die(鋼)刀模.Stencil版膜.Step and Repeat逐次重覆曝光.Step Plating梯階式鍍層.Step Tablet階段式曝光表.Stiffener補強條(板).Stop Off防鍍膜, 阻劑.Strain變形,應變.Strand絞(指由許多股單絲集束并旋扭而成的絲Stray Current迷走電流, 散雜電流(在電鍍槽系統中,其由整流器所提供,應在陽極板與被鍍件之電杆與槽體液體中流通,但有時少部分電從槽體本身或加熱器上迷走,漏失). Stress Corrosion應力腐蝕.Stress Relief消除應力.Strike預鍍.Stringing拖尾.Stripline條線.Stripper剝除液(器).Substractive Process減成法.Substrate底材.Supper Solder超級焊錫.Supported Hole(金屬)支助通孔.Surface Energy表面能.Surface Insulation Resistance表面絕緣電阻. Surface Mount Device 表面粘裝元件. Surface Mounting Technology (S表面粘裝技術. Surface Resistivity表面電阻率. Surface Speed鑽針表面速度. Surface Tension表面張力. Surfactant表面潤溼劑.Surge突流,突壓. Swaged Lead壓扁式引腳. Swelling Agents, Sweller膨松劑. Swimming 線路滑離. Synthetic Resin合成樹脂.*****T*****Tab接點,金手指. Taber Abraser泰伯磨試器. Tackiness粘著性, 粘手性. Tape Automatic Bonding (TAB)卷帶自動結合. Tape Casting 帶狀鑄材.Tape Test撕膠帶試驗.Tape Up Master原始手貼片. Taped Components卷帶式連載元件. Taper Pin Gauge錐狀孔規.Tarnish污化.Tarnish 污化, 污著.Teflon鐵氟龍(聚4氟乙烯). Telegraphing浮印,隱印. Temperature Profile溫度曲線.Template模板.Tensile Strength抗拉強度. Tensiomenter張力計.Tenting蓋孔法. Terminal端子.Terminal Clearance端子空環.Tetra-Etch氟樹脂蝕粗劑. Tetrafunctional Resin四功能樹脂. Thermal Coefficient of Expansion熱膨脹系數. Thermal Conductivity導熱率. Thermal Cycling熱循環,熱震盪. Thermal Mismstch感熱失諧. Thermal Relief散熱式鏤空. Thermal Via導熱孔. Thermal Zone感熱區. Thermocompression Bonding熱壓結合. Thermocouple熱電偶. Thermode發熱體. Thermode Soldering熱模焊接法.熱重分析法. Thermogravimetric Analysis, (TG熱機分析法. Thermomechanical Analysis (TM Thermoplastic熱塑性. Thermosetting熱固性. Thermosonic Bonding熱超音波結合. Thermount聚醯胺短纖蓆材. Thermo-Via導熱孔.Thick Film Circuit厚膜電路.Thief輔助陽極.Thin Copper Foil薄銅箔.Thin Core薄基板.Thin Film Technology薄膜技術.Thin Small Outline Package(TSO薄小型勣體電路器.Thinner調薄劑.Thixotropy抗垂流性,搖變性.Three Point Bending三點壓彎試驗.Three-Layer Carrier三層式載體.Threshold Limit Value (TLV)極限值.Through Hole Mounting通孔插裝.Through Put物流量,物料通過量.Throwing Power分布力.Tie Bar分流條.Tin Drift錫量漂飄失.Tin Immersion浸鍍錫.Tin Pest錫疫(常見白色金屬錫為"β錫",當溫度低時則β錫將逐漸轉變成粉末狀灰色"α錫Tin Whishers錫須.Tinning熱沾焊錫.Tolerance公差.Tombstoning墓碑效應.Tooling Feature工具標示物.Topography表面地形.Torsion Strength抗扭強度.Touch Up觸修,簡修.Trace 線路,導線.Traceability追溯性,可溯性.Transducer轉能器.Transfer Bump移用式突塊. Transfer Laminatied Circuit轉壓式線路. Transfer Soldering移焊法. Transistor電晶體. Translucency半透性. Transmission Line傳輸線. Transmittance透光率. Treament, Treating含浸處理.Treeing枝狀鍍物,鍍須. Trim修整, 精修.Trim Line裁切線.Trimming修整,修邊.True Position真位.Tungsten鎢Tungsten Carbide碳化鎢.Turnkey System包辦式系統. Turret Solder Terminal塔立式焊接端子. Twill Weave斜織法.Twist板扭.Two Layer Carrier兩層式載体.*****U*****保儉業試驗所標志. UL Symbol(UL.為Under-Writers Laboratories,INC)Ultimate Tensile Strength (UTS)極限抗拉強度. Ultra High Frequency (UHF)超高頻率.Ultra Violet Curing (UV Curing)紫外線硬化. Ultrasonic Bonding超音波結合. Ultrasonic Cleaning超音波清洗.Ultrasonic Soldering超音波焊接.Unbalanced Transmission Line非平衡式傳輸線.Undercut, Undercutting側蝕.Underplate底鍍層.Universal Tester汛用型電測機.Unsupported Hole非鍍通孔.Urea尿素.Urethane胺基甲酸乙脂.*****V*****Vacuoles焊洞.Vacuum Evaporation(or Depositi真空蒸鍍法.Vacuum Lamination真空壓合.Van Der Waals Force凡得華力.Vapor Blasting蒸汽噴砂.Vapor Degreasing蒸汽除油法.Vapor Phase Soldering氣相焊接.Varnish凡力水,清漆(樹脂之液態單體). V-cut V型切槽.Very Large-Scale Integration(VL極大勣體電路器.Via Hole 導通孔.Vickers Hardness維氏硬度.Viscosity粘滯度,粘度.Vision Systems視覺系統.Visual Examination目視檢驗.Void 破洞,空洞.Volatile Content揮發份含量.Voltage電壓.Voltage Breakdown崩潰電壓.Voltage Drop 電壓降落.Voltage Efficiency電壓效率.Voltage Plane電壓層.Voltage Plane Clearance電壓層的空環. Volume Resistivity體勣電阻率. Volume Resistivity體勣電阻率. Volumetric Analysis容量分析法. Vulcanization交聯,硫化.*****W*****Wafer晶圓.Waive暫准過關,暫不檢查. Warp Size 漿經處理.Warp, Warpage板彎.Washer墊圈.Waste Treatment廢棄處理.Water Absorption吸水性.Water Break水膜破散,水破. Water Mark水印.Watt瓦特.Watts Bath瓦玆鍍鎳液.Wave Guide導波管.Wave Soldering波焊.Waviness 波紋,波度.Wear Resistance耐磨性,耐磨度. Weatherability耐候性.Weave Eposure織紋顯露.Weave Texture織紋隱現.Web蹼部.Wedge Bond 楔形結合點.Wedge Void楔形缺口(破口).Weft Yarn緯紗.Welding熔接.Wet Blasting溼噴砂.Wet Lamination溼壓膜法.Wet Process溼式制程.Wetting Agent潤溼劑.Wetting Balance沾錫天平.Wetting Balance沾錫,沾溼.Whirl Brush旋渦式磨刷法.Whirl Coating旋渦塗布法.Whisker晶須.White Residue白色殘渣.White Spot白點.Wicking燈蕊效應.Window操作范圍,傳動齒孔. Wiping Action 滑動接觸(導電).Wire Bonding打線結合.Wire Gauge線規.Wire Lead金屬線腳.Wire Pattern布線圖形.Wire Wrap繞線互連.Working Master工作母片.Working Time (Life)堪用時間. Workmanship 手藝,工藝水平,制作水準. Woven Cable扁平編線.Wrinkle皺折, 皺紋.Wrought Foil鍛碾金屬箔.*****X*****X Axis X軸.X-Ray X光.X-Ray Fluorescence X螢光.*****Y*****Yarn紗線.Y-Axis Y軸.Yield良品率,良率,產率. Yield Point屈服點.*****Z*****Z-Axis Z軸.Zero Centering中心不變(疊合法). Zig-Zag In-Line Package (ZIP)鍊齒狀雙排腳封裝件.145-(145÷Sp.Gr)÷(Sp.Gr-130)水"1g/cm的比值).。

常用PCB英语缩写

Popular Professional languageFQC final quality control 終點品質管制IPQC inprocess quality control 制程中的品質管制IQC incoming quality control 進料品質管制FQA final quality assurance 出貨質量保証OQC output quality control 最終出貨品質管制PQC process quality control 制程检查管制SQM Supplier Quality Management 供应商品质管理CSC Customer Service Center 客服中心QA quality assurance 質量保証QC quality control 品質管理JQE Joint Quality Engineer 客服工程师QE quality engineering 品質工程TQC / Mtotal quality control全面質量管理3B 3B 模具正式投產前確認8D 8 disciplines8項回復內容CARcorrective action report改正行動報告CP capability index 准确度CPK capability index of process 模具制程能力參數FAI First article inspection 新品首件檢查CQA Customer Quality Assurance 客戶品質保証FMEA failure model effectiveness analysis 失效模式分析OBA out of box audit開箱檢查QFD quality function deployment 品質機能展開CSA Customer Simulate Analysis客戶模擬分析SQMS Supplier Quality Management System 供应商品质管理系统QIP Quality Improvement Plan品质改善计划CIP Continual Improvement Plan 持续改善计划TVR tool verification report模具確認報告CRA corrective action report 改正行動報告(改善報告)ACCAccept允收AOQ Average Output Quality 平均出貨品質AOQL Average Output Quality Level 平均出货品質水平AQL Acceptable Quality Level 運作類允收品質水準FPIR First Piece Inspection Report 首件檢查報告ID identification 識別,鑒別,証明L/NLot Number 批號MIL-STD Military-Standard 軍用標準CR Critical極嚴重的MAJ Major 主要的MIN Minor 輕微的P/N Part Number料號Q/R/SQuality/Reliability/Service品質/可靠度/服務w ww .P CB Te ch .n etREJ Reject 拒收ACC Accept允收CON Concession / Waive 特采S/S Sample size 抽樣檢驗樣本大小SI-SIVSpecial I-Special IV特殊抽樣水準等級制程統計品管專類AR Averary Range 全距平均值DIA Diameter 直徑DIM Dimension 尺寸FREQ Frequency頻率GRR Gauge Reproducibility & Repeatability 量具之再制性及重測性判斷量測可靠與否MAX Maximum 最大值MIN Minimum 最小值N Number 樣品數R Range全距SPC Statistical Process Control 統計制程管制SQC Statistical Quality Control 統計品質管制LCL Lower Control Limit 管制下限UCLUpper Control Limit管制上限7QCTools Seven Quality Controll Tools 品管七大手法Stratification 層別法Histogram 直方圖Plato Diagram 柏拉圖Check Sheet查檢表Characteristic Diagram 特性要因圖Scatter Diagram 散布圖Control Chart管制圖PPAP Production Parts Approval Procedure生產件批準程序APQP Advanced Production Quality Plan 產品質量先期計劃QSA Quality System Audit品質系統審核MSA Measurement System Analysis 量測系統分析SPCStatistical Process Control統計制程管制FMEA Failure Model Effect Analysis失效模式影響分析ADM Absolute Dimension Measuremat 全尺寸測量LQLLimiting Quality Level最低品質水準MRB Material Reject Bill 退貨單PDCA Plan Do Check Action 計劃執行檢查總結QAN Quality Ameliorate Notice 品質改善活動QCC Quality Control Circle 品質圖QI Quality Improvement 品質改善QIT Quality Improvement Team 品質改善小組QP Quality Policy 目標方針QT Quality Target品質目標RMAReturn Material Authorization/Authority退料認可w ww .P CB Te c h .n etZD Zero Defect 零缺點BOM Bill Of Material 物料清單DWG Drawing圖面ECN Engineering Change Notice 工程變更通知(供應商)ECO Engineering Change Order 工程改動要求(客戶)IS Inspection Specification 成品檢驗規范II Inspection Instruction 檢驗指導書PCN Process Change Notice 工序變更通知PMP Product Management Plan 生產管制計劃PS Package Specification包裝規范SIP Specification Inspection Process 制程檢驗規格SOP Standard Operation Procedure 制造作業規范MTBF Mean Time Between Failure 平均故障間隔FTA Fault Tree Analysis 故障樹分析ES Engineering Standardization 工程標準GS General Specification一般規格ISO International Organization for Standardization 國際標準化組織IWS International Workman Standard 工藝標準QS Quality System品質系統部門類ADM Administration Department 行政部EXT Export Division 出口部PUR Purchaing Dept 採購部GAD General Affairs Dept 總務部HSD Human Source Dept 人力資源部P/A Personal & Administration 人事行政部MFG Manufacturing Dept制造部A/D Accountant /Finance Dept 會計部DC Document Center資料中心IE Industrial Engineering工業工程LAB Laboratory實驗室ME Manufacture Engineering制造工程部PD Product Department生產部PEProject Engineering or product engineering項目工程部 ─ 產品工程部PMC Production&Material Control 生產和物料控制PC Production Control 生產計劃控制MC Material Control物料控制QRA Quality Reliability Assurance 品質保証(處)QC Quality Control 品質管制(課)QEQuality Engineering品質工程(部)R&D Research & Design Dept /Investigation & Development設計開發部生產類Carton 卡通箱D/CDate Code生產日期碼w ww .P CB Te c h .n etID/C Identification Code (供應商)識別碼MO Manafacture Order 生產單PAL Pallet (skid)棧板PCS Piece個(根.塊等)PO Purchasing Order 採購訂單PRS Pairs雙(對等)SWR Special Work Request特殊工作需求其它3C Computer ,Communication , Consumer electronic 消費性電子4MIE Man,Material,Machine,Method,Environment 人力,物力,財務,技術,時間(資源)5M Man , Machine , Material , Method , Measurement 人,機器,材料,方法,測量5S 希臘語整理.整頓,清掃,清潔,教養5W1HWhen , Where , Who , What , Why , How 7M1I Manpower , Machine , Material , Method 人力，機器，材料，方法7M1I Market , Management , Money , Information 市場，管理，資金，資訊A.S.A.P As Soon As Possible書可能快的ABIOS Advanced Basic input/output system 先進的基本輸入/輸出系統ASS'Y Assembly 裝配,組裝ATIN Attention 知會BSBrain storming 腦力激盪Cycle Time制程周期CAD Computer Aid Design 計算機輔助設計CAV Cavity 模穴CC Carbon Copy 副本復印相關人員CD Compact Disk光碟CD-ROM Compact Disk Read-Only Memory隻讀光碟CMOS Complementary Metol Oxide Semiconductor互補金屬氧化物半導體CONN Connector連接器CPU Central Processing Unit中央處理器DIMM Dual in-line Memory Module 雙項導通匯流組件DQA Desigh Quality Assurance 設計品質保証DT Desk Top臥式(機箱)EISAExtended Industry Standard Architecture 擴充的工業標準結構E-MAIL Electrical-Mail電子郵件EMIElectro Magnetic Interference 電磁幹擾EMC Electro Magnetic Compatibility電磁兼容ESD Electro Static Discharge 靜電排放F/C Flat Cable排線FMI Frequency Modulation Inspect 高頻測試DVD Digital Visual Disk 數字化視頻光盤FDD Floppy Disk Drive 軟碟機HDDHard Disk Drive硬碟機ADSL Asymmetrical Digital Subscriber Loop 非對稱數字用戶環線或用戶系統I/O Input/Output 輸入/輸出ICIntegrated Circuit集成電路w ww .P CB Te c h .n etISA Industry Standard Architecture 工業標準體制結構JIT Just In Time 零庫存 (or 交貨準時）L/T Lead Time前置時間(生產前準備時間)LED Light-Emitting Dilde 發光二級管LRR Lot Rejeet Rate 批退率MAT'S Material材料MCA Microchannel Architecture 微通道結構MQA Manufacture Quality Assurance 制造品質保証MRP Material Requirement Planning 物料需求計劃MRB Material Review Board 物料評審委員會MT Mini-Tower 立式(機箱)N/A Not Applicable 不適用NG Not Good 不行,不合格NHK North of Hongkong 中國大陸OC Operation System作業系統OEM Original Equipment Manufacture 原設備制造P/MProduct Market產品市場PC Personal Computer 個人電腦PCB Printed Circuit Board 印刷電路板PCE Personal Computer Enclosure 個人電腦外設PDA Personal Digital Assistant 個人數字助理PBC Personal Business Commitments 個人業績承諾CDT Commercial Desk Top 商用電腦PPM Parts Per Million百萬分之一PRC People's Republic of China中國大陸RYI / R For Your Information / Reference 僅供參考REV Revision版本S/T Standard Time 標準時間SPEC Specification規格SMPS Switch Mode Power Supply 電腦開關電源供應器SQA Strategy Quality Assurance策略品質保証SSQA Sales and service Quality Assurance 銷售及服務品質保証T/PTrue Position真位度TBATo Be Decide待定,定缺TPM Total Production Maintenance 全面生產保養TYPType類型U.S.A the United States of America 美國WDR Weekly Delivery Requirement 周出貨需求QCP Quality Control Procedures品管程序ILACInternational laboratory Accreditation Conference 國際實驗室認証會議ESD Wrist Strap靜電環SMD Surface Mount Device 表面粘貼裝置SMT Surface Mount Technology 表面粘貼技術IQ Intelligence Quotient 智商EQEmotional Quotient情商w ww .P CB Te ch .n etAC Alternating Current 交流電DC Direct Current直流電IT Information Technology 信息技術，資訊科學CEO Chief Executive Officer 執行總裁COO Chief Operaring Officer首席業務總裁SWOTStrength,Weakness,Opportunity,Threat 優勢﹐弱點﹐機會﹐威脅Competence專業能力3C 人之3C Communication 有效溝通Cooperation 統御融合Management Courses 行政管理Vibration Testing 振動測試Thermal Testing 熱流測試Time To Market 快速開發Time To Volume 快速投入批量生產Time To Money快速收回銷貨款TFT Thin Film Transistor 液晶顯示器ICT Initial Circuit Testing ICT 靜態測試ATE Automatic Test Equipment 自動測試設備IDP Individual Development Plan 個人發展計劃ERP Enterprise Resource Planning企業資源規劃ISOInternational Organization for Standardization國際標準化組織5S 的八大功能：零浪費，無故障，無傷害，無不良，無換模，無交期延遲，無抱怨，無赤字七大浪費：生產過量，等候時間浪費，運送浪費，制程不良，存貨浪費，動作浪費，不良品浪費品質：在合理的成本下，滿足客戶的要求。

PCB行业常用语的英文缩写

英文简称英文中文QA Quality Assurance品质保证QC Quality Control品质控制FQA Final Quality Audit最终品质抽检FQC Final Quality Check最终品质检查MRB Material Review Board物料重审小组IQC Incoming Quality Control来料品质控制IPQC In-process Check流程品质检查IPQA In-process Quality Audit流程品质抽查IPA In-process Audit流程稽查b Physical Laboratory物理实验室DEAM Desmear除胶渣PTH Plating Through Hole沉铜P/P Panel Plate整板电镀D/F Dry Film干菲林PP Pattern Plate图形电镀ETCH Etching蚀板DFS Dry Film Stripping退膜TLS Tin Lead Stripping退锡铅W/F Wet Film Solder Mask绿油/阻焊S/M Solder Mask绿油/阻焊PLUG Solder Mask Plug Hole塞孔b Chemistry Laboratory 化学实验室P&A Personnel&Administration Department人事行政部PE Production Engineering产品工程部ME Manufacturing Engineering制作工程部PMC Production Material Control物控部EM Equipment Maintenance维修部PPC Production Plan Control生产计划部PROD Production Department生产部MKT Market Department市场部Purch Purchase Department采购部BC Board Cut开料IDF Inner Dry Film内层干菲林IE Inner Etching内层蚀板BO Black Oxidation黑氧化（棕化）Press Pressing压板DR Drilling钻孔DEBUR Deburring磨板C/M Componment Mark白字G/F Gold Finger Plating电镀金手指HAL Hot Air Levelling喷锡C/NK Carbon Ink Printing印碳油2 DRI2nd Drill二次钻孔PUN Punching啤板CLE Clearing洗板ROUT Routing锣板V-CUT V-Cutting V-cut SLOT Key Slotting锣坑PSM Peelable Solder Mask印蓝胶E-T E-Test电测试PACK Packing包装。

pcb封装常用标注符号及缩写表格

PCB封装常用标注符号及缩写随着电子技术的发展，PCB（Printed circuit board）在电子产品中的应用越来越广泛。

在PCB设计中，封装是一个重要的环节，它决定了电子元器件在PCB上的布局和连接方式。

为了方便工程师们在PCB设计时进行标注和识别，常用的标注符号和缩写是必不可少的。

本文将介绍PCB封装常用标注符号及缩写，帮助工程师们更好地理解和应用。

1.标注符号在PCB设计中，常用的标注符号包括芯片封装、晶振封装、电解电容封装、电感封装等。

下面是常用的标注符号及其含义：（1）芯片封装QFN：Quad flat no-leadQFP：Quad flat packageBGA：Ball grid arraySOP：Small outline packageLGA：Land grid array（2）晶振封装U2/U3：晶振SMDHC/HC-49S：晶振贴片封装（3）电解电容封装C1/C2：电解电容SMD/ElecCap：贴片电解电容（4）电感封装L1/L2：电感SMD/Inductor：贴片电感以上标注符号可以在PCB设计图纸中使用，帮助工程师们清晰地识别不同封装的元件，从而更好地进行布局和连接。

2.缩写除了标注符号外，在PCB设计中常用的缩写也是必不可少的。

下面是一些常见的缩写及其含义：（1）元器件名称R：电阻C：电容L：电感U：集成电路D：二极管Q：晶体管（2）封装类型SMD：表面贴装封装THD：插件式封装THT：穿孔式封装（3）封装形式DIP：双列直插式封装SOP：小尺寸带引脚封装SSOP：窄小尺寸带引脚封装QSOP：超窄小尺寸带引脚封装这些缩写可以缩短元器件名称和封装类型，在PCB设计中起到简化标注的作用，提高工程师们的工作效率。

3.总结在PCB设计中，标注符号和缩写是必不可少的一部分，它们可以帮助工程师们清晰地识别和理解不同元器件的封装类型和特性。

本文介绍了常用的标注符号和缩写，希望能够为工程师们在PCB设计中提供一些参考。

pcb英文术语

pcb英文术语
以下是一些PCB（Printed Circuit Board，印刷电路板）的英文术语：
1. PCB：Printed Circuit Board，印刷电路板
2. SMD：Surface Mount Device，表面贴装器件
3. BGA：Ball Grid Array，球栅阵列
4. FPGA：Field Programmable Gate Array，现场可编程门阵列
5. DIP：Dual In-line Package，双列直插封装
6. PTH：Plated Through Hole，贯穿孔
7. VIA：Vertical Interconnect Access，垂直互连通孔
8. NC：No Connection，未连接
9. Pads：焊盘
10. Gerber File：Gerber文件，包含PCB设计图层信息的文件格式
11. Silk Screen：丝网印刷，用于标记元件位置或文字的印刷层
12. Copper Trace：铜线追踪，指PCB上的导线路径
13. Solder Mask：焊盘阻焊层，用于保护焊盘和其他不需要焊接的区域
14. Component Footprint：元件封装，描述组件在PCB上的安装尺寸和引脚布局
15. ESD：Electrostatic Discharge，静电放电
希望这些术语能对您有所帮助！如果您有其他问题，请随时提问。

PCB英文术语及释义

一．MATERIAL TERM1.A-stage A 階段—指膠片(prepreg)製造過程中,其補強材料的玻織布或棉紙,在通過膠水槽進行含浸工程時,該樹脂之膠水(Varnish,也譯為清漆水),尚處於單體且被溶劑稀釋的狀態,稱為A-stage,相對的當玻織布或棉紙吸入膠水,又經熱風及紅外線乾燥後,將使樹脂分子量增大為複體或寡聚物(Oligomer),再集附於補強材上形成膠片.此時的樹脂狀態稱為B-Stage.當再繼續加熱軟化,並進一步聚合成為最後高分子樹脂時,則稱為C-Stage.2.B-Stage,B階段—指熱固型樹脂的聚合半硬化狀態,如經A-Stage的環氧樹脂含浸工程後,在膠片玻織布上所附著的樹脂,尚可再加溫而軟化者即屬此類.3.Basematerial基材—指板材的樹脂及補強材料部份,可當做為銅線路與導體的載體及絕緣材料.4.CEM-1,CEM-3(composited epoxy material)环氧树脂複合板材指基板底材是由玻織布及玻織席(零散短織)所共同組成的,所用的樹脂仍為環氧樹脂,此種板材的兩面外層,仍使用玻織布所含浸的膠片(Prepreg)與銅箔壓合,內部則用短織席材含浸樹脂而成WEB(網片),若其”席材”纖維仍為玻纖時,其板材稱為CEM-3(Composite Epoxy Material)L;若席材為紙纖時,則稱之為CEM-1.此為美國NEMA規範LI 1-1989中所記載.5.COPPER FOIL 銅箔,銅皮—是CCL銅箔基板外表所壓複的金屬銅層.PCB工業所需的銅箔可由電鍍方式(Electrodeposited),或以輾壓方式(Rolled)所取得,前者可用在一般硬質電路板,後者則可用於軟板上.6.Dry Film幹膜—是一種做為電路板影像轉移用的幹性感光薄膜阻劑,另有PE及PET兩層皮膜將之夾心保護,現聲施工時可將PE的隔離層撕掉,讓中間的感光阻劑膜壓貼在板子的銅面上.在經過底片感光後即可再撕掉PET的表護膜,進行沖洗顯像而形成線路圖形的局部阻劑.進而可再執行蝕刻(內層)或電鍍(外層)制程,最後在蝕銅及剝膜後,即得到有裸線路的板面.7.Epoxy Resin環氧樹脂—是一種用途極廣的熱固型(Thermosetting)高分子聚合物,一般可做為成型,封裝,塗裝,粘著等用途.在電路板業中,更是耗量最大的絕緣及粘結用途的樹脂,可與玻纖布,玻纖席,及白牛皮紙等複合成為板材.且可容納各種添加助劑,以達到難燃及高功能的目的,做為各級電路板材的基料.8.Film 底片—指已有線路圖形的膠捲而言,通常厚度有7MIL及4mil兩種,其感光的藥膜有黑,白的鹵化銀,及棕色或其他顏色的偶氮化合物.此詞亦稱為Artwork.9.Flame Resistant耐燃性—指電路板在其絕緣性板材的樹脂中,為了要达到某種燃性等級(在UL94中共分HB.VO,V1及V2等四級),必須在樹脂中刻意加入某些化學品,如溴,矽,氧化鋁等(如FR-4中即加入20%以上的溴),使板材之性能可達到一定的耐燃性.10.Flammability Rate燃性等級—指電路板板材之耐燃性或難燃性的程度.在按即定的試驗步驟(如UL-94或NEMA的LE1-1988中的7.11所明定者)執行樣板試驗之後,其板材所能達到的何種規定等級而言.11.Flexible Printed Circuit,FPC軟板—是一種特殊的電路板,在下游組裝時可做三度空間的外形變化,其底材為可撓性的聚亞醯胺(PI)或聚酯類(PE).這種軟板也像硬板一樣,可製作鍍通孔或表面焊墊.以進行通孔插裝或表面粘裝.板面還可貼附軟性具保護及防焊用途的保護層(COVER LAYER),或加印軟性的防焊綠漆.12.Flurocarbon Resin碳氟樹脂—是一系列有機含氟的熱塑型高分子聚合物,可用於電子工業的主要產品有FEP(Fluorinated Ethylene Propylend,氟化乙烯丙烯)及PTFE(Polytetrafluoroethylene,聚四氟乙烯)等兩種塑膠材料.13.Flux助焊劑—是一種在高溫下,具有活性的化學品,能將板子表面的氧化物或汙化物予以清除,使熔融的焊錫能與潔淨的底金屬結合而完成焊接.Flux原來的希腊文是Flow(流動)意思.早期是在礦石進行冶金當成”助焊劑”,促使熔點降低而達到容易流動的目的.14.Glass Transition Temperature, Tg玻璃態轉化溫度—聚合物會因溫度的升高而造成其物性的變化.當其在常溫時是一種結晶無定形態(Amorphous)脆硬的玻璃狀物質.到達高溫時將轉變成為一種如同橡皮狀的彈性體(Elastomer),這種由”玻璃態”明顯轉變成”橡皮態”的狹窄溫度區域稱為”玻璃态轉化溫度”,簡稱為Tg但應讀成”Ts OF g”,以示其轉變的溫度並非只在某一溫度點上.15.Photograhpic Film 感光成像之底片---是指電路板上線路圖案的原始載體,也就是俗稱的底片”(Art Work).常用的有Mylar 式膠捲及玻璃板之硬片。

PCB印制线路板术语中英对照简表

格式档案标准格接地层
Grand Plane Clearance
接地层的空环
Haloing Hay wire 也称Jumper Wire. Heat Sink Plane Hipot Test即High Postential Test H Hook Hole breakout Hole location Hole pull Strength
锡球锡桥
焊锡面主轴
底材减成法
表面装配技术接点
Tenting Tetrafuctional Resin
盖孔法
Thermo-Via Thief Thin Copper Foil Thin Core Through Hole Mounting Tie Bar Touch Up Trace Twist W X Y Wicking X-Ray Yield
A
Back Light
背光法
B
Base Material Base Material thickness Bland Via Blister Board thickness Bonding Layer C-Staged Resin Chamfer (drill) Characteristic Impendence C-Staged Resin Chamfer (drill)
导热孔辅助阴极基材
分流条
板翘灯芯效应
良品率
注解使用人工的方法，加速正常的老化过程。一批产品中最大可以接受的缺陷数目，通常用于抽样计划。用来测定产品可以接受的试验，由客户与供应商之间决定。在多层线路板连续层上的一系列孔，这些孔的中心在同一个位置，而且通到线路板的一个表面。是指孔周围的导体部分。用于生产 “Artwork Master”“production Master”,有精确比例的菲林。通常是有精确比例的菲林，其按1：1的图案用于生产 “Production Master”。是一种检查通孔铜壁完好与否得放大目检方法，其做法是将孔壁外的基材自某一方向上小心的予以磨薄，再利用树脂半透明的原理，从背后射入光线。假如化学铜孔壁品质完好而无任何破洞或针孔时，则该铜层必能阻绝光线而在显微中呈现黑暗，一旦铜壁有破洞时，则必有光点出现而被观察到，并可放大摄影存证，称为背光法，但只能看到半个孔。绝缘材料，线路在上面形成。（可以是刚性或柔性，或两者综合。它可以是不导电的或绝缘的金属板。）。不包括铜箔层或镀层的基材的厚度。导通孔仅延伸到线路板的一个表面。离层的一种形式，它是在基材的两层之间或基材与铜箔之间或保护层之间局部的隆起。指包括基材和所有在上面形成导电层在内的总厚度。结合层，指多层板之胶片层。处于固化最后状态的树脂。钻咀柄尾部的角。特性阻抗，平行导线结构对交流电流的阻力，通常出现在高速电流上，而且通常由在一定频率宽度范围的常量组成。处于固化最后状态的树脂。钻咀柄尾部的角。特性阻抗，平行导线结构对交流电流的阻力，通常出现在高速电流上，而且通常由在一定频率宽度范围的常量组成。能够完成需要的电功能的一定数量的电元素和电设备。见“Printed Board”。线路板中，含有导线包括接地面，电压面的层。电镀孔沿镀层的整个圆周的裂缝或空隙。在线路板中常指铜箔或通孔之镀层，在遭遇热应力的考验时，常出现各层次的部分或全部断裂。在多层板中常在铜皮处理不当时所发生的皱褶。用来表明产品生产的时间。基材中层间的分离，基材与铜箔之间的分离，或线路板中所有的平面之间的分离。为了方便下工序装配和测试的方便，在一块板上按一定的方式排列一个或多个线路板。导电铜箔的表面凹陷，它不会明显的影响到导铜箔的厚度。线路之间的描绘距离，或者在客户图纸上定义的线路之间的距离。从孔壁上将被钻孔摩擦融化的树脂和钻孔的碎片移走。在融化的锡在导体表面时，由于表面的张力，导致锡面的不平整，有的地方厚，有的地方薄，但是不会导致铜面露出。指线路板上的一些孔，其位置已经由其使用尺寸确定，不用和栅格尺寸一致。

PCB工程资料中常见的英文缩写汇总

PCB⼯程资料中常见的英⽂缩写汇总⼯程圖檔資料中常⾒的英⽂縮寫匯總AOI : Automatic Optical Inspection ⾃動光學檢測SMD : Surface Mount Devices 表⾯安裝設備SMB : Surface Mount Board 表⾯安裝板SMT : Surface Mount Technology 表⾯安裝技術MIL : Military Standard 美國軍⽤標准LPI : Liquid Photo Imageable Solder Mask 液態感光阻焊油SMOBC : Solder Mask On Bare Copper 裸銅覆蓋阻焊⼯藝OSP : Organic Solderability Preservative 焊錫性有機保護劑PTI : Proof Tracking Index 耐電壓起痕指數CTI : Comparative Tracking Index 相對漏電起痕指數HASL : Hot Air Solder Leveling 噴錫HAL : Hot Air Leveling 噴錫?PCB : Printed Circuit Board 印制電路板PWB : Printed Wiring Board 印制線路板CCL : Copper-clud laminat 覆銅箔層壓板FPC： Flexible printed board 柔性线路板简称，⼜称软板CAD : Computer Aided Design 計算機輔助設計CAM : Computer Aided Manufacturing 計算機輔助制造CAT : Computer Aided Testing 計算機輔助測試PTH : Plated Through Hole 鍍通孔IC : Integrated Circuit 集成線路UL : Under Writers Laboratories 美國保險商實驗室CNS : Chinese National Standards 中國國家標准BGA : Ball Grid Array 球柵陣列BUM : Build-up Multilayer 積層法多層板CFR : Code of Federal Regularations 聯邦法規全書AQL : Acceptable Quality Level 允收品質⽔准LDI : Laser Direct Imaging 鐳射直接成像HDI : High Density Interconnection –-Build-up Multilayer ⾼密度互連積層多層板1.依照標准(in according with related standards)：IPC : The Institute for International and Packaging Electronic Circuit美國電路互連與安裝學NEMA : National Electronic Manufacturing Association 國家電⼦制造協會/美國電氣制造協會2.基本材料 ( base material)：natural color ⾃然⾊ external copper weight 外層銅厚copper clad覆銅箔prepreg 預浸材料（指半固化膠⽚）Tg rating 玻璃化溫度laminate 基板cross-section切⽚cutout 切⼝Metal core ⾦屬芯type of board 板類 (single sided 單⾯ double sided 雙⾯ multilayer 多層)epoxy glass fiber 環氧玻璃纖維flammability rating/class 防⽕等級dielectric material 介質材料temperature 溫度Resin Content 膠含量Glass Transition Temperature (由”玻璃态”转化为”橡⽪态”简称为TG!)base copper (基銅)3.偏差及公差(deviation & tolerance) :registration 對位(重合度) dimension (⾧/寬/⾼)尺⼨⼤⼩ radius &diameter半徑/直徑hole size/aperture孔徑 width 寬度length ⾧度 depth深度height ⾼度thickness 厚度spacing間距axis軸coordinate坐標parameter參數copper foil 銅箔board outline/contour 板輪廓圖 edge to edge 邊到邊heat sink plane 散熱層stack up 疊層 $ 疊放 finish(ed) thickness 完成厚度trace = track = line = pattern = conductor ＝rail = circuit 線路top layer 上層& bottom layer 下層 layer to layer registration 層與層對位inter layer & external layer 內層&外層clearance 空隙、間空、間隔 & gap 間隙guide hole = pilot hole導引孔tangency 切線、相接觸＆diagonal對⾓線、對頂線signal plane 信號層voltage plane電源層 ground plane 接地層C/S＝component side 元件⾯ S/S=solder side 焊接⾯Primary side 主層secondary side 輔層 supporting plane ⽀撐⾯Film 底⽚/菲林master film 主稿⽚artwork 底稿⽚master drawing布設總圖4. ⼯藝（process）:surface finishing = surface treatment = finish 表⾯處理hard gold 重⾦Entek / Flux 防氧化Immersion Ag 化银gold plating 鍍⾦immersion gold 沉⾦flash gold 閃⾦tin / lead plating 鍍鉛錫electroless gold (plating)（無電）鍍⾦nickel /gold plating 鍍鎳⾦HASL : Hot Air Solder Leveling 噴錫 HAL : Hot Air Leveling 噴錫NPTH : Not Plated Through Hole ⾮鍍通孔（⾮電鍍孔）Flat package type平裝型SMOBC : Solder Mask On Bare Copper 裸銅覆阻焊⼯藝 plug through hole 塞孔Void 空洞slot 開槽 / 槽孔tented vias掩孔 / 導通孔 annular ring 孔環mounting hole安裝孔 tooling hole 管位孔（定位孔）wet solder mask濕膜dry film /dry solder mask⼲膜preflux & postflux 預塗助焊劑&後塗助焊劑carbon ink 碳油silkscreen legend 絲印字符 non-conductive ⾮導電的Permanent 耐久的Solder resist阻焊劑 & solder mask 阻焊油（膜）Flow soldering 流焊Reflow soldering 再流焊 Wave soldering 波焊Dip soldering 浸焊Drag soldering 曳焊Float soldering 浮焊withdrawal lacquer = peelable solder mask 藍膠2. 25mm window around fiducial without solder resistOverall diameter of solder resist free area = 6.0mm5. 標識(marking ):vender’s identification (賣主⾝份) = manufacture’s identification (制造商名)= company name (公司名稱)date code ⽣產周期 UL logo (denotation) UL標識trademark 商標type designation 型號標志 revision letter 版本字母dustbin symbol 垃圾箱標志stamp 蓋印、壓印short /open test 短/斷路測試 liable to read易於辯认6．彎曲與扭曲 (bow and twist or twist and warp )：not exceed 不超過7. 外形（profiling）:mechnical outline 外形圖 countersink 鑽孔route bit 鑼鑽頭score 劃痕、刻痕、劃線 score line分割線 slot 開槽 / 槽孔& cutouts 切⼝panelization detail 拼板圖cosmetic =appearance外觀keepout area 保留區域breakaway rails 沖破導線array size 拼板尺⼨punch 沖床drill 鑽孔route 鑼板V-cut 切割、分割8. 清潔度（clealiness）:Finished circuit board shall be free of dirt ，oil ，ionic contaminates or other foreign matter which could affect solderability circuit performance ，lift or appearance 。

PCB专业术语中英文汇总

碱性蚀刻：SES
中文
代码
英文名称
图形电镀去膜
SAP
Stripping after Pattern Plating
退锡
TSR
Tin Stripping
蚀刻/退锡
ETS
Etching, Tin Stripping
去膜/蚀刻/退锡
SES
DF Stripping, Etching, Tin Stripping
AOI：AOI
中文
代码
英文名称
外层离线AOI
OOA
Outer Offline AOI
外层AOI
OAO
Outer AOI
层间对准度测试1
QRE1
IPQC for Registration 1
外层VRS
OVR
Outer VRS
MASKAOI
MAO
Mask AOI
填孔AOI
SAO
Solid Via Filling Plating AOI
减铜干膜曝光
DER
D/F Exposuring before Copper Reduction
减铜干膜显影
DDR
D/F Development before Copper Reduction
减铜干膜LDI
DDC
D/F Laser Direct Image before Copper Reduction
脉冲全板电镀
PPP
Pulse Panel Plating
POFV沉铜
PBP
PTH before POFV
POFV电镀
POFV
Plate over Filling Via
全板电镀

PCB专业术语

缩写全称中文CAL Calibration仪教CL ChemicalLaboratory化验室FV FinalVisualInspection最后目视查验CQE CustomerQualityEngineer客服工程师IPQC InProcessQualityControl制程质量管控IQC IncomingQualityControl进料质量管控OQC OutgoingQualityControl出货物质管控OQA OutgoingQualityAssurance出货物质保证QA QualityAssurance质量保证部RELLAB ReliabilityLaboratory信任性实验室QMS QualityManagementSystem质量管理系统VQA VendorQualityAssurance供给商质量保证SQE SupplierQualityEngineer供给商质量工程师MIS ManagementInformationSystem管理信息系统DCC Document Control Center文管中心HR HumanResources人力资源部FI Finance财务部MKT Marketing市场营销部PUR Purchasing采买部MAIN Maintenance保护部GM GeneralManager总经理GM GeneralMotors通用汽车VP VicePresident副总CEO ChiefExecutionOffice履行总裁 / 首席履行官CFO ChiefFinancialOfficer财务总监WT WasteTreatment废水办理部PPE Pre-productionEngineering试生产部TD TechnologyDevelopment技术开发部缩写全称中文R&D Research&Development研发部PE ProcessEngineering工程部PC ProductionControl生管部TS Traffic&Shipping海关货运部ET ElectricalTest电性测试ENIG ElectrolessNickelandImmersionGold化学镍金AOI AutomatedOpticalInspection自动光学检测B/O BlackOxide黑氧化HASL HotAirSolderingLevel热风整平 / 喷锡PTH PlatedThroughHole镀通孔DF DryFilm干膜DES Develop,Etch&Stripping显影, 蚀刻, 除胶EHS EnvironmentHealth&Safety环境保护部DP DirectPlating直接电镀B/F BondFilm/BrownOxide棕化I/L InnerLayer内层线路O/L OuterLayer外层线路S/M SolderMask防焊P/P PatternPlating图形电镀LCD LiquidCrystalDisplay液晶显视器2nd E SecondExposure二次曝光NC NumericallyControlled数控钻孔二. 其余缩略语缩写全称中文QC QualityControl质量管控QM QualityManual质量手册CIP ContinuousImprovementProject连续改良项目CP ControlPlan控制计划缩写全称中文ICD InterconnectionDefect内连缺点问题RPN RiskPriorityNumber风险优先次序APQP AdvancedProductQualityPlan先期产品质量计划PPAP ProductionPartApprovalProcedure生产零零件批准程序AQL AcceptableQualityLevel质量允收水平AVL ApprovedVendorList合格供给商清单CPK ProcessCapabilityIndex制程能力指数FMEA FailureModeAndEffectAnalysis无效模式与效应剖析IPC TheInstituteForInterconnection&美国电子电路互连及PackagingElectronicCircuits封装协会ISO InternationalOrganizationfor国际标准化组织Standardization/InternationalStandardOrganizationJIT JustInTime实时MPI ManufacturingProcessInstruction制程作业说明书SOP StandardOperationProcedure标准操作规范SPC StatisticalProcessControl统计制程管束6ó6Sigma 6 个标准差CPCA ChinaPrintedCircuitAssociation中国印刷电路板协会TPCA TaiwanPrintedCircuitAssociation台湾印刷电路板协会JPCA JapanPrintedCircuitAssociation日本印刷电路板协会R&R Repeatability&Re-productivity重复性 &再现性A/W Artwork底片OP OperationInstruction操作说明IPA IsopropylAlcohol异丙醇IC IonicContamination离子污染度IC IntegratedCircuit集成电路BGA BallGridArray球形栅格阵列缩写全称中文AA AtomicAbsorptionSpectrophotometer原子汲取光谱仪CVS CyclicVoltametricStripping循环伏安剥离剖析仪IC IonChromatography离子液相色谱OGP OpticalGaugingProducts光学计量器 / 三次元OTD OnTimeDelivery准时交货QP QualityProcedure质量程序言件R.C ResinContent胶含量R.F ResinFlow胶流量SEM ScanningElectronicMicroscope扫描电子显微镜PP Prepreg预浸资料 / 半固化片ACC Accept接受REJ Reject拒收CAR CorrectiveActionRequest改良举措报告R/W Rework重工MRB MaterialReviewBoard需确认之问题板SPEC Specification规格A/R ActionRequired待做事项SMD SurfaceMount Device表面贴装装置WIP WorkInProcess在制品HDI HighDensityInterconnecting高密度互连UV UltravioletSpectrophotometer紫外光分光光度计CDA CompressedandDriedAir压缩气CT CoolingTower冷却塔CTWater CityWater市水 / 自来水DB DistributionBoard配电屏DIWater De-ionizedWater去离子水FW FilteredWater过滤水M/C Machine机台缩写全称中文PCB PrintedCircuitBoard//ProfitComeBack印刷线路板 // 收益到来SSB Single-sidedPrintedBoard单面印制板DSB Double-sidedPrintedBoard双面印制板MLB MultilayerPrintedCircuitBoard多层线路印制板ROWater ReverseOsmosisWater反浸透水ROF ReverseOsmosisFilter反浸透过滤器SW SoftWater软水TEMP Temperature温度TPM TotalPreventiveMaintenance整体预防性保护A/R AccountReceivable应收款项A/P AccountPayable对付款项CAR CapitalAcquisitionRequest资本获取申请DM DirectMaterial直接物料IDM IndirectMaterial间接物料FI FinanceModule财务模块P&L Profit&Loss盈亏PBT ProfitBeforeTax税前收益CO CostingModule(SAP)成本模块OS Outstanding优异ER ExceedImprovement优异MR MeetRequirement优异NI NeedImprovement待改良UA Unacceptable不行接受ASAP AsSoonAsPossible尽可能快地D/C DateCode周期DOE DesignofExperiment实验设计ERP EnterpriseResourcePlanning公司资源规划KPI KeyPerformanceIndex主要绩效指标缩写全称中文MCS ManagementControlSystem管理控制系统MR MaterialRequest物料申请PCBA PrintedCircuitBoardAssembly电路板组装P/N PartNumber板号/ 料号PO PurchaseOrder采买单P&P Pick&Place贴片机PR PurchaseRequisition采买申请SMT SurfaceMount Technology表面贴装技术S/O SalesOrder业务单 / 销售单V/O VariationOrder变异单F/O FacilityOrder工厂号NPTH Non-platedThroughHole非导通孔EDS EngineeringDateSheet工程数据单ECN EngineeringChangeNotice工程更改单PCB/PWB PrintedCircuitBoard/PintedWiringBoard印刷电路板MCP MetallizationContinuousPlating垂直连续电镀D/S DoubleSide双面板D/O DeliveryOrder送货单RCC ResinCoatedCopper背胶铜箔QFP QuarterFlatPad四方形焊盘MSA MeasurementSystemAnalysis量测系统剖析MLB MultilayerPrintedBoard多层印制板CCL Copper-cladLaminate覆铜板PTFE Polytetrafluoethylene聚四氟乙稀BCS ButylCellosolveSolvent防白水KLM KeyLineManager主要负责人BUM Build-upMultilayer积层法多层板DSC DifferentialScanningCalorimetry微差扫描热卡剖析法缩写全称中文DMA DynamicMechanicalAnalysis动向力剖析法IA InformationAppliance信息家电LPSM LiquidPhotoimagibleSolderMask液态感光油墨PGA PinGridArray针栅阵列PBGA Plastic-BGA塑料球栅阵列STH SilerThroughHole银胶贯孔TGA ThermoGravimetricAnalysis热重量剖析法RH RelativeHumidity相对湿度三.PCB 一般用语英文中文Marking标志Void空洞FiducialPad基准焊垫Package包装Shipping货运Warpage/BowandTwist板弯板翘ViaHole导通孔 ( 小于 20mil) PlugHole堵孔AnnularRing孔环Slothole槽孔Traveler流程单BuyOff抽检Develop显影Legend文字GoldPotassiumCyanide金盐Routing铣切Silver银英文中文GoldOSP(OrganicSolderabilityPreservative) LineWidthLineSpaceBoardThicknessHoleSizeTraceDrillingImpedanceBarCodeAcidCleanDe-warpageMasterDrawingDefectHotAirRepaidDryingOvenCartonBlindViaCopperFoilToleranceX-OutCustomerPinGaugeSolderingIronSolderabilityTestFinalFinishWarehouseWickingLaserHole 金有机保护膜线宽线间距板厚孔径线路钻孔阻抗条形码酸洗板弯翘反直 / 改正宏图缺点迅速烘箱箱子盲孔铜箔公差打叉客户量规/ 针规/ 塞规电烙铁焊锡性实验表面办理库房渗镀 / 灯芯效应镭射孔英文中文ShippingBuy-off FilmAdhesive Warehouse 出货抽检粘结膜库房AuSeepage LaserHole VerticalDesmear ShippingBuy-off ScrappedBoard AuditStampingC=0SamplingPlan Layup&Press Touchup/Repair SmearResidue ImmersionSilver 10XEyeLupe 金渗镀镭射孔垂直除胶渣出货抽检报废板稽核冲压零缺点抽样计划叠合 &压合修理胶渣残留沉银10X 放大镜TapeTest ConditionalAccept Quarantine StopShipping OnHoldStamp ToolingHole ComponentHole MountingHole Production TestBoard Conductor胶带试验有条件允收隔绝停止出货暂扣印章定位孔元件孔安装孔产品测试板导线英文中文X-Section/Microsectioning FisrstArticleInspection FinalCure RigidPrintedBoardBuild-upMultiplayerPrintedBoard FlexiblePrintedBoard MotherBoard/MouseBite DaughterBoard 切片首件 / 初片检查最后烘烤刚性印制板积层多层印制板挠性印制一路板母板子板BackPlaneBoard BareBoardCable Interconnection TransmissionLine Substrate ConductivePattern Non-conductivePattern BaseMaterial Laminate CompositeLaminate ThinLaminate BondingSheet StiffenerMaterial EpoxyResin RoundPad GlassFiberYarnFilamentWeftYarn背板裸板电缆互连传输线基底导电图形非导电图形基板层压板复合层压板薄层压板粘结片加强板材环氧树脂圆形盘玻璃布纱线单丝纬纱英文中文WarpYarnWasp-wiseSplit ReworkSimulation SquarePad DiamondPad OblongPad SupportdHole BuriedViaHole Buried/BlindVia CheckList HoleLocation HoleDensity 经纱经向裂痕模拟重工方形盘棱形盘长方形焊盘支撑孔埋孔埋/ 盲孔点检表孔位孔密度HolePattern DatumReferenceAccelerationIntegrityAccuracyAcrylicBlowHole BareChipAssembly BondStrengthBondabilityBondingWire BreakawayPanel BreakdownVoltageBurrChemicalResistance英文孔图参照基准速化反响完好性正确度亚克力吹孔赤身芯片组装联合强度联合性联合线可断拼板崩溃电压 / 击穿电压毛头/ 毛刺抗化学性中文ChipAlcohol MoistureAndInsulationResistance CoreBoardDeburingDentDepositionDesmear DielectricBreakdown DielectricConstant DimensionalStabilityDrillFacetEdge-BoardConnectorEdge-BoardContace NegativeEtchback ElectrolessDepositionEtchbackEtchFactor 芯片酒精湿气与绝缘电阻芯片 / 中心核去毛刺凹陷堆积/ 积蓄除胶渣介质崩溃介质常数尺寸稳固性钻尖切削面板边连结器板边插头反回蚀化学镀 / 无电镀回蚀蚀刻因子EtchingResist GelTime GelationParticle HoldingTime HoleWallBreakout HoleDensity HoleVoid HullCellImagingLogo抗蚀刻凝胶时间凝胶点逗留时间孔偏破孔密度孔壁空洞哈氏槽成像表记英文中文LeakageCurrent LiftedLandMeasling MinimumAnnularRing LaserAblation GeneralRequirement NoduleNon-wettingNylonOutgassingOutgrowth OverPotential PanelPlating PeelStrength Permittivity PorosityTest PatternPlating QualityConformanceTest RegistrationResistResolution ReverseImageRing 漏电流焊垫浮起白点/ 白斑最小环宽镭射烧孔概括性要求节瘤不沾银尼龙出气侧出过电位全板电镀剥离强度介电常数孔隙度试验图形电镀质量切合试验瞄准度阻剂解像片影像套环ScratchShadowingSolderConnection SolderPasteResinRecession英文刮伤暗影焊点锡膏树脂内缩中文SolidContent SprayCoating Stripper ThermalConductivity ThermalShockTest TinIndicatedV-Cut 固体含量发射涂装玻璃液导热率热冲击试验浸锡V 型切槽VacuumEvaration(orDeposition) VarnishVoltageBreakdown WeaveExposure WeaveTextureWedgeVoidWetting//Non-wettingWicking 真空镀膜法树脂漆击穿电压织纹显现织纹隐现楔形空洞沾锡 / 不沾锡灯芯效应 / 渗镀四.常有PCB不良用语LayertoLayerShift LineWidthOverSize LineWidthUnderSize Open/Short CoretoCoreShiftNickPinHoleOverEtchUnderEtch PadUnderSize IonicContaminationFail AcidTestFail 层间移位线条过宽线条过窄断/ 短路片与片移位缺口针孔蚀刻过分蚀刻不足焊盘尺寸小于标准离子污染度不合格酸洗测试不合格B-StageOverSpec 英文中文B-Stage 过厚Delamination RoughEdge Wrinkle WrongLayUp FingerPrint ShiftHole BlockedHole HoleUnder/OverSize MissingHole TapeResidue RoughHole NotThroughHole HoleBreakout LaserShift ExtraHole OxidationPittingVoidInHole VoidOnPad 分层/ 爆板板边粗拙折皱内层放反手指印孔偏移孔堵孔尺寸过大漏钻孔残胶孔粗拙孔未钻透孔破镭射孔偏移多孔氧化针点孔内空洞PAD空洞/ 过小FilmBreakdown UnderDevelop ExposeCopper/Nickel PoorVacuum EpoxySmear NailHeadingCrack PostSeparation膜破显影未尽露铜/ 镍抽真空不良去毛刺未净钉头龟裂内层断开英文中文DamagedHole SmearResidue BurntPlating PinkRingS/MOnPad 孔破坏胶渣残留电镀烧焦粉红圈油墨上 PADS/MShiftS/MVacuumS/MSkipS/MLumpS/MInHoleS/MBubbleStainPoorReworkOverBakingForeignMaterial/Inclusions PeelableInkOnPad LegendShiftIllegibleLegend LegendOnSurface ExcessLegend CarbonExposeCu CarbonShort/Open/Smear/Skip UnderPlugHole PlugholeCrackMissingSolderSolderLumpRoughSolderT/LOnTrace英文T/LInTraceT/LInViaHoleBlockHolePoorSolderabilityDiscolorAuSeepageAuPeelingTarnishScratchRoughEdgeBurr 油墨偏移抽真空不良油墨未印下积墨孔内油墨油墨气泡肮脏重工不良烘烤过分外来杂物可剥胶上 PAD文字偏移文字不清板面沾白漆剩余的文字碳油墨露铜碳油墨短 / 断路 /堵孔不足堵孔裂开漏镀锡焊锡短路焊锡隆起锡面粗拙中文焊锡上线条孔内沾锡堵孔焊锡性不良变色金渗镀金零落金面发黄刮伤板边粗拙毛刺散开/遗漏Pit/Dent Oxidation MaterialDamage LiftedFeature ForeignMaterial PadUndersized 凹点/ 凹陷氧化资料破坏导体翘起杂质PAD尺寸不够PadMissing PAD丢掉PadDamaged PAD损坏PTHVoid NoPunchOutsAllowed Dewetting SolderDull SkipPlate GoldonFeature GoldBlush NickelExposed NickelAdhesion 镀通孔空洞冲型不良拒锡锡面发白跳镀板面沾金金面发红露镍镍零落GoldScratch Feathering IncompleteSolderStrip PlatingDouble PlatingCrack PlatingNodule TentBroken IncompleteResistStrip ETStampWrong ETStampMissing 英文中文金面刮伤导体桥接剥锡不净重镀龟裂电镀颗粒二次孔膜破剥膜不净ET章错误漏 ET章ETStampIllegible ET章模糊ILRegistration ILcopperExposed CopperExposed Delamination LegendMissing ReducedAperture 内层偏位内层露铜露铜分层文字漏印防焊圈减小HoleBreakoutHoleExtraS/MonPADDateCodeWrong DateCodeMissingSlotMissingResinStarvation LaminateVoidResinFlowFoilWrinkleCoreWrong英文孔破多孔油墨上 PAD 周期错误缺乏周期漏开槽缺胶压合空洞胶流量铜箔皱折叠构错误中文PinkRingSoltShape HolePlugged HolePartial WrongSurfaceFinish ArrowLeft SolderabilityTest LaminateDiscolored Measling PeelableNotRemoved FlexCopperWrinkle FlexCoresStuckTogether InterconnectionDefect OSPIncompleteCoverage 粉红圈槽孔变形孔塞孔未钻透表面办理错误标签残留焊锡性测试压合异色白点可剥胶残留软铜箔缩短软基材粘结内连缺点有机保护膜不完好五．其余英文TensileStrength UltraVioletCuring SurfaceMountingTechnology GlassFiberGlassFabricSplit ElectrodepositedCopperFoil中文抗拉强度紫外线硬度表面贴装技术玻璃纤维玻璃布裂痕电解铜箔RolledCopperFoilComputer-AidedDesign.Computer-AidedManufacturing ComputerControlledDisplay DesignOrigin英文LogicCircuitEngineeringDrawingSeparatedLayerSolderConnectionRigid-FlexPrintedBoard WaveSolderingSolderPasteHoleLocationBondStrengthFiducialMark GlassTransitionTemperature PeelingStrengthTest TensileStrengthTestElongationTestSaltSprayTestWhiskerTestROHSWEEEHumiditystorageTest IonizableDetectionOfSurfaceContaminants WaterAbsorption.E-CorrosionTesting DielectricWithstandingVoltage HotStorageTestThermalshocktestMoisture&InsulationTest ReworkSimulation 压延铜箔计算机协助设计计算机协助制造计算机控制设计设计原点中文逻辑电路工程图分层焊接点软硬联合板波峰焊锡膏孔位粘合强度基准点玻璃态变换温度剥离强度实验抗张强度实验延展性实验盐雾实验锡须测试限制有害物质使用废旧电子电气设施回收利用湿度积蓄测试表面离子测试吸水性电腐化测试耐电压测试高温积蓄测试热冲击测试湿度缘测式模拟重工测式。

PCB常用名词缩略词(全)

PCB常用名词缩略词(全)英文译文A/D [军] Analog.Digital, 模拟/数字AC Magnitude 交流幅度AC Phase 交流相位Accuracy 精度"Activity ModelActivity Model" 活动模型Additive Process 加成工艺Adhesion 附着力Aggressor 干扰源Analog Source 模拟源AOI,Automated Optical Inspection 自动光学检查Assembly Variant 不同的装配版本输出Attributes 属性AXI,Automated X-ray Inspection 自动X光检查BIST,Built-in Self Test 内建的自测试Bus Route 总线布线Circuit 电路基准circuit diagram 电路图Clementine 专用共形开线设计Cluster Placement 簇布局CM 合约制造商Common Impedance 共模阻抗Concurrent 并行设计Constant Source 恒压源Cooper Pour 智能覆铜Crosstalk 串扰CVT,Component Verification and Tracking 元件确认与跟踪DC Magnitude 直流幅度Delay 延时Delays 延时Design for Testing 可测试性设计Designator 标识DFC,Design for Cost 面向成本的设计DFM,Design for Manufacturing 面向制造过程的设计DFR,Design for Reliability 面向可靠性的设计DFT,Design for Test 面向测试的设计DFX,Design for X 面向产品的整个生命周期或某个环节的设计DSM,Dynamic Setup Management 动态设定管理Dynamic Route 动态布线EDIF,The Electronic Design Interchange Format 电子设计交互格式EIA,Electronic Industries Association 电子工业协会Electro Dynamic Check 动态电性能分析Electromagnetic Disturbance 电磁干扰Electromagnetic Noise 电磁噪声EMC,Elctromagnetic Compatibilt 电磁兼容EMI,Electromagnetic Interference 电磁干扰Emulation 硬件仿真Engineering Change Order 原理图与PCB版图的自动对应修改Ensemble 多层平面电磁场仿真ESD 静电释放Fall Time 下降时间False Clocking 假时钟FEP 氟化乙丙烯FFT,Fast Fourier Transform 快速傅里叶变换Float License 网络浮动Frequency Domain 频域Gaussian Distribution 高斯分布Global flducial 板基准Ground Bounce 地弹反射GUI,Graphical User Interface 图形用户界面Harmonica 射频微波电路仿真HFSS 三维高频结构电磁场仿真IBIS,Input/Output Buffer Information Specification 模型ICAM,Integrated Computer Aided Manufacturing 在ECCE项目里就是指制作PCB IEEE,The Institute of Electrical and Electronic Engineers 国际电气和电子工程师协会IGES,Initial Graphics Exchange Specification 三维立体几何模型和工程描述的标准Image Fiducial 电路基准Impedance 阻抗In-Circuit-Test 在线测试Initial Voltage 初始电压Input Rise Time 输入跃升时间IPC,The Institute for Packaging and Interconnect 封装与互连协会IPO,Interactive Process Optimizaton 交互过程优化ISO,The International Standards Organization 国际标准化组织Jumper 跳线Linear Design Suit 线性设计软件包Local Fiducial 个别基准manufacturing 制造业MCMs,Multi-Chip Modules 多芯片组件MDE,Maxwell Design EnvironmentNonlinear Design Suit 非线性设计软件包ODB++ Open Data Base 公开数据库OEM 原设备制造商OLE Automation 目标连接与嵌入On-line DRC 在线设计规则检查Optimetrics 优化和参数扫描Overshoot 过冲Panel fiducial 板基准PCB PC Board Layout Tools 电路板布局布线PCB,Printed Circuit Board 印制电路板Period 周期Periodic Pulse Source 周期脉冲源Physical Design Reuse 物理设计可重复PI,Power Integrity 电源完整性Piece-Wise-linear Source 分段线性源Preview 输出预览Pulse Width 脉冲宽度Pulsed Voltage 脉冲电压Quiescent Line 静态线Radial Array Placement 极坐标方式的元件布局Reflection 反射Reuse 实现设计重用Rise Time 上升时间Rnging 振荡,信号的振铃Rounding 环绕振荡Rules Driven 规则驱动设计Sax Basic Engine 设计系统中嵌入SDE,Serenade Design EnvironmentSDT,Schematic Design Tools 电路原理设计工具Setting 设置Settling Time 建立时间Shape Base 以外形为基础的无网格布线Shove 元器件的推挤布局SI,Signal Integrity 信号完整性Simulation 软件仿真Sketch 草图法布线Skew 偏移Slew Rate 斜率SPC,Statictical Process Control 统计过程控制SPI,Signal-Power Integrity 将信号完整性和电源完整性集成于一体的分析工具SPICE,Simulation Program with Integrated Circuit Emphasis 集成电路模拟的仿真程序Split/Mixed Layer 多电源/地线的自动分隔SSO 同步交换STEP,Standard for the Exchange of Product Model DataSymphony 系统仿真Time domain 时域Timestep Setting 步进时间设置UHDL,VHSIC Hardware Description Language 硬件描述语言Undershoot 下冲Uniform Distribution 均匀分布Variant 派生VIA-Vendor Integration Alliance 程序框架联盟Victim 被干扰对象Virtual System Prototype 虚拟系统原型VST,Verfication and Simulation Tools 验证和仿真工具Wizard 智能建库工具,向导。

pcb最常用术语知识讲解

pcb最常用术语知识讲解p c b最常用术语A/W (artwork) 底片Ablation 烧溶(laser),切除abrade 粗化abrasion resistance 耐磨性absorption 吸收ACC ( accept ) 允收accelerated corrosion test 加速腐蚀accelerated test 加速试验acceleration 速化反应accelerator 加速剂acceptable 允收activator 活化液active work in process 实际在制品adhesion 附着力adhesive method 黏着法air inclusion 气泡air knife 风刀amorphous change 不定形的改变amount 总量amylnitrite 硝基戊烷analyzer 分析仪annular ring 环状垫圈;孔环anode slime (sludge) 阳极泥anodizing 阳极处理AOI ( automatic optical inspection ) 自动:光学检测applicable documents 引用之文件AQL sampling 允收水准抽样aqueous photoresist 液态光阻aspect ratio 纵横比(厚宽比)As received 到货时back lighting 背光back-up 垫板banked work in process 预留在制品base material 基材baseline performance 基准绩效batch 批beta backscattering 贝他射线照射法beveling 切斜边;斜边biaxial deformation 二方向之变形black-oxide 黑化blank controller 空白对照组blank panel 空板blanking 挖空blip 弹开blister 气泡;起泡blistering 气泡blow hole 吹孔board-thickness error 板厚错误bonding plies 黏结层bow ; bowing 板弯break out 从平环内破出bridging 搭桥;桥接BTO (Build T o Order) 接单生产burning 烧焦burr 毛边(毛头)camcorder 一体型摄录放机carbide 碳化物carlson pin 定位梢carrier 载运剂catalyzing 催化catholic sputtering 阴极溅射法caul plate 隔板;钢板calibration system requirements 校验系统之各种要求center beam method 中心光束法central projection 集中式投射线certification 认证chamfer 倒角(金手指)chamfering 切斜边;倒角characteristic impedance 特性阻抗charge transfer overpotential 电量传递过电压chase 网框checkboard 棋盘chelator 蟹和剂chemical bond 化学键chemical vapor deposition 化学蒸着镀circumferential void 圆周性之孔破clad metal 包夹金属clean room 无尘室clearance 间隙coat 镀外表coating error 防焊覆盖错误coefficient of thermal expansion (CTE) 热澎胀系数cold solder joint 冷焊点cold-weld 金属粉末冷焊color 颜色color error 颜色错误compensation 补偿competitive performance 竞争力绩效complex salt 错化物complexor 错化物component hole 零件孔component side 零件面concentric 同心conformance 密贴性consumer products 消费性产品contact resistance 接触电阻continuous performance 连续发挥效能contract service 协力厂controlled split 均裂式conventional flow 乱流方式conventional tensile test 传统张力测试法conversion coating 转化层convex 突出coordinate list 数据清单copper claded laminates (CCL) 铜箔基板copper exposure 线路露铜copper mirror 镜铜copper pad 铜箔圆配copper residue (copper splash) 铜渣corrosion rate numbering 腐蚀速率计数系统corrosion resistance 抗蚀性coulombs law 库伦定律countersink 喇叭孔coupon 试样coupon location 试样点covering power 遮盖力CPU 中央处理器crack 破裂;裂痕crazing 裂痕;白斑cross linking 交联聚合cross talk 呼应作用crosslinking 交联crystal collection 结晶收集curing 聚合体current efficiency 电流效率cut-outs 挖空cutting 裁板cyanide 氰化物cycles of learning 学习循环cycle-time reduction 交期缩短date code 周期deburring 去毛头dedicated 专用型degradation 退变delamination 分层dent / pin hole 凹陷/ 针孔department of defense 国防部designation 字码简示法de-smear 除胶渣developing 显影dewetting 缩锡dewetting time 缩锡时间dimension error 外形尺寸错误dielectric constant 介质常数difficulty 困难度difunctional 双功能dimension 尺寸dimension stability 尺寸安定性dimensional stability 尺度安定性dimension and tolerance 尺寸与公差dirty hole 孔内异物discolor hole 孔黑;孔灰;氧化discoloration 变色disposable eyelet method 消耗性铆钉法distortion factor 尺寸变形函数double side 双面板downtime 停机时间drill 钻孔drill bit 钻头drill facet 钻尖切萷面drill pointer 钻尖重(研)磨机drilled blank board 已钻孔之裸板drilling 钻孔dry film 干膜ductility 延展性economy of scale 经济规模edge spacing 板边空地edge-board contact ( gold finger ) 金手指efficiency 能量效率electric test 电测electrical testing 电测;测试electrochemical machine ECM 电化学加工法electrochemical reactor 电化学反应器electroforming 电铸electroless plate 化学铜electroless-deposition 无电镀electropolishing 电解拋光electrorefining 电解精炼electrowinning 电解萃取elliptical set 椭圆形embrittlement 脆性entitlement performance 可达成绩效entrapment 电镀夹杂物epoxy 环氧树酯equipotential 电位线error data file 异常情形etch rate 蚀铜速率etchants 蚀刻液etchback 回蚀evaluation program 评估用程序exposure 曝光external pin method 外部插梢法eyelet hole 铆钉孔Eyeletting 铆眼fabric 网布failure 故障fast response 快速响应fault 瑕庛;缺陷fiber exposure 纤维显露fiber protrusion 纤维突出fiducial mark 光学点,基准记号filler 填充料film 底片filtration 过滤finished board 成品fixing 固着fixture 电测夹具(治具)flaking off 粹离flammability rating 燃性等级flare 喇叭形孔flat cable 并排电缆feedback loop 回馈循环first-in-first-out (FIFO) 先进先出flexible manufacturing system (FMS) 弹性制造系统flux 助焊剂foil distortion 铜层变形fold 空泡foreign include 异物foreign material 基材内异物free radical chain polymerization 自由基连锁聚合fully additive 加成法fully annealed type 彻底回火轫化之类形function 函数fundamental and basic 基本fungus resistance 抗霉性funnel flange 喇叭形折翼galvanized 加法尼化制程gap 钻尖分开gauge length 有效长度gel time 胶化时间general resist ink 一般阻剂油墨general 通论general industrial 一般性(电子)工业级geometrical levelling 几何平整glass transition temperature (Tg) 玻璃态转换温度Gold 金gold finger 金手指gold plating 镀金golden board 标准板gouges 刷磨凹沟gouging 挖破grain boundary 金属晶体之四边green 绿色grip 夹头ground plane 接地层ground plane clearance 接地空环hackers 骇客HAL ( hot air leveling ) 喷锡haloing 白边;白圈hardener 硬化剂hardness 硬度hepa filter 空气滤清器high performance industrial 高性能(电子)工业级high reliability 高可靠度high resolution 高分辨率high temperature elongation (HTE) 高温延展性铜箔high temperature epoxy (HTE) 高温树酯hit 击hole counter 数孔机hole diameter 孔径hole diameter error 孔径错误hole location 孔位hole number 孔数hole wall quality 孔壁品质hook 外弧hot dip 热浸法hull cell 哈氏槽hybrid 混成集成电路hydrogen bonding 氢键hydrolysis 水解hydrometallurgy 湿法冶金法image analysis system 影像分析系统image transfer 影像转移immersion gold 浸金(化镍金)immersion plating 浸镀法impedance 阻抗infrared reflow 红外线重熔inhibitor 热聚合抑制剂injection mold 射模ink 油墨innerlayer & outlayer 内外层insulation resistance 绝缘电阻intended position 应该在的位置intensifier 增强器intensity 强度inter molecular exchange 交互改变interconnection 互相连通ionic contaminants 离子性污染物ionic contamination testing 离子污染试验IPA 异丙醇5I : inspiration (启蒙)identification 确认计划目标implementation 改善方案information 数据internalization 制度化invisible inventory 无形的库存knife edges 刀缘Knoop 努普(硬度单位)kraft paper 牛皮纸返回顶部laminar flow 层流laminate 基层板laminating 压合lamination 压合laminator 压膜机land 焊垫lay back 刃角磨损lay up 组合叠板layout 布线;布局lead screw 牵引螺丝leakage 漏电learning curve 学习曲线legend 文字标记leveling 平整levelling additive 平整剂levelling power 平整力life support 维系生命limiting current 极限电流line space 线距line width 线宽linear variable differential transformer(LVDL) 线性可变差动:转换器liquid 液状(态)liquid crystal resins 液晶树脂liquid photoimageable solder resist ink 液态感光防焊油墨liquid photoresist ink 液态光阻剂油墨lot size 批量lower carrier 底部承载板mechanical plating 机祴镀法machine scrub 刷磨清洁法macrothrowing power 巨分布力margin 钻头刃带market share 市场占有率marking error 文字错误masked leveling 儰装平整mass lamination 大型压板mass transfer 质量传送效应mass transfer overpotential 质量传递过电压mass transportation 质传master drawing 主图;蓝图material use factor 材料使用率mealing 泡点;白点memory 记忆装置meniscograph solderability measurement 新月型焊锡效果microetch 微蚀microetching 微蚀microfocus 微焦距microfocus system 微焦距系统microprofile 微表面microsectioning 微切片法microthrowing power 微分布力migration 迁移mini-tensile tester 迷你拉力测试仪mis hole location 孔位错误misregistration 焊锡面与零件面对位偏差misregsitration 对不准moisture and insulation resistance test 湿气与绝缘电阻试验molded circuit board (MCB) 模制电路板monoethanal amine 单乙醇氨monohydrate state 水化物monomer 单分子膜;单体mouse bite 锯齿;蚀刻缺口msec 毫秒muffle furnace 高温焚火炉multichip 超大IC型(多芯片模块) mylar 保护膜nail head 钉头NC drill 数字钻孔机negative etchback 反回蚀negative film 负片negative rake angle 负抠耙角network 回路;网络neutralization 中和nick 缺口nickel 镍nodule 铜瘤;瘤粒no flow resin 不流树脂noise 噪声nominal 标示nominal dimension 标定长度nominal gel time 标示胶性时间nominal resin content 标示胶含量。

PCB常见英文缩写

PCB常见英文缩写CAD：(Computer Aided Design)计算机辅助设计。

CAM：(Computer Aided Manufacturing)计算机辅助制造。

CAT：(Computer Aided T esting)计算机辅助测试。

FPC：(Flexible Printed Circuit)柔性印制电路。

PCB：(Printed Circuit Board)印制电路板。

PWB：(Printed Wiring Board)印制线路板。

FTH：(Plated Through Hole)通孔镀。

SMT：(Surface Mount Technology)表面安装技术。

SMB：(Surface Mount Board)表面安装板。

SMD：(Surface Mount Devices)表面安装器件。

ISO：(International Organization for Standardization)国际标准化组织。

IEC：(International Electrotechnical Commision)国际电工技术委员会组织。

IPC：(The Institute for International and Packaging Electronic Circuits)美国电路互连与封装学会(标准)。

MIL：(Military Standard)美国军用标准。

IC：(Integrated Circuit)集成电路。

LSI：(Large Scale Integrated Circuit)大规模集成电路。

JPC：(Japan Printed Circuit Association)日本印制电路学会。

UL：(Under writers Laboratories INC)美国保险商试验室。

SMOBC：(Solder Mask on Bare Copper)裸铜线路丝印阻焊油墨。

AOI：(Automated Optical Inspection)自动光学检测。