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modern system-on-chip design on arm 笔记

modern system-on-chip design on arm 笔记Modern system-on-chip (SoC) design on ARM involves the integration of multiple components onto a single chip, enabling high-performance computing in a compact and power-efficient package. In this note, we will explore some key aspects of SoC design on ARM.1. Architecture: ARM provides a range of processor architectures, such as ARM Cortex-A, Cortex-R, and Cortex-M, each catering to different application requirements. SoC designers need to select the appropriate architecture based on factors like performance, power consumption, and real-time processing capabilities.2. Integration of Components: SoC design involves integrating various components like the processor core, memory subsystem, peripherals, and interfaces onto a single chip. This integration enables efficient communication between different components, reducing latency and power consumption.3. Power Management: Power management is a critical aspect of SoC design, as modern devices demand high performance while maintaining long battery life. SoC designers use techniques like power gating, clock gating, and voltage-frequency scaling to optimize power consumption in different operating modes.4. Security: With the increasing connectivity of devices, SoC design needs to prioritize security. ARM provides TrustZone technology, enabling the isolation of secure and non-secure software and protecting sensitive data from unauthorized access. SoC designers need to incorporate security features and developrobust encryption and authentication mechanisms.5. Verification and Validation: SoC designers undertake rigorous verification and validation processes to ensure the correct functioning of the integrated components. This involves testing the system for diverse scenarios, corner cases, and performance benchmarks. Advanced verification techniques like simulation, formal verification, and emulation are utilized to detect and fix design flaws.6. Software Development: SoC designers work closely with software developers to optimize software architecture for the specific SoC design. This collaboration involves developing device drivers, firmware, and operating systems that leverage the hardware capabilities effectively.7. Packaging and Manufacturing: Once the SoC design is finalized, it needs to be packaged and manufactured. The packaging involves integrating the chip into a package with appropriate interconnects and thermal management. The manufacturing process includes wafer fabrication, die testing, and final assembly.In conclusion, modern SoC design on ARM involves selecting the right processor architecture, integrating components, optimizing power consumption, ensuring security, thorough verification and validation, software development, and packaging/manufacturing. All these aspects collectively contribute to the successful deployment of efficient and high-performance ARM-based SoCs.。

A3150光耦DataSheet

U E D P R O D U C T E F E R E N C E O N L Y .U250 f o r n e w d e s i g n Data Sheet 27621.40The A3150JLT and A3150JUA programmable switches provide tooth/valley recognition in large gear-tooth sensing applications. Each sensor consists of a single element, chopper-stabilized Hall-effect IC that can be programmed to the desired magnetic switch point, opti-mizing sensor airgap and timing accuracy performance after final packaging. The small package can be easily assembled and used in conjunction with a wide variety of gear/target shapes and sizes. The two devices differ only in package style.The sensing technology used for this sensor is Hall-effect based.The sensor incorporates a single-element Hall IC that switches inresponse to magnetic signals created by a ferrous target. The program-mability of the circuit eliminates magnet and system offsets such as those caused by tilt yet provides zero-speed detection capabilities without the associated running jitter inherent in classical digital solu-tions.A proprietary dynamic offset cancelation technique, with an internal high-frequency clock, reduces the residual offset voltage,which is normally caused by device overmolding, temperaturedependancies, and thermal stress. This technique produces devices that have an extremely stable quiescent output voltage, are immune to mechanical stress, and have precise recoverability after temperature cycling. Many problems normally associated with low-level analog signals are minimized by having the Hall element and amplifier in a single chip. Output precision is obtained by internal gain adjustments during the manufacturing process and operate-point programming in the user’s application.This sensor system is ideal for use in gathering speed, position, and timing information using gear-tooth-based configurations. TheA3150JLT/JUA are particularly suited to those applications that require accurate duty cycle control or accurate edge detection. The lower vibration sensitivity also makes these devices extremely useful for transmission speed sensing.3150Always order by complete part number: the prefix 'A' + the basic four-digit part number + a suffix to indicate operating temperature range +a suffix to indicate package style, e.g., A3150JLT .PROGRAMMABLE, CHOPPER-STABILIZED, HALL-EFFECT SWITCHContinued next page115 Northeast Cutoff, Box 15036Worcester, Massachusetts 01615-0036 (508) 853-********PROGRAMMABLE, CHOPPER-STABILIZED, PRECISION,HALL-EFFECT SWITCHCopyright © 2000, Allegro MicroSystems, Inc.Two package styles provide a magnetically opti-mized package for most applications. Suffix ‘–LT’ is a miniature SOT-89/TO-243AA transistor package for surface-mount applications; while suffix ‘–UA’ is a three-lead ultra-mini-SIP for through-hole mounting.FEATURES AND BENEFITSs Chopper Stabilized forExtremely Low Switch-Point Drift and Immunity to Mechanical Stresss Externally Programmed Switch Point s On-Chip Supply-Transient Protection s Output Short-Circuit Protections Single-Chip Sensing IC for High Reliability s Small Mechanical Size s <50µs Power-On Times Wide Operating Voltage Range s Defined Power-On State3150PROGRAMMABLE, CHOPPER-STABILIZED, PRECISION,HALL-EFFECT SWITCHLimitsCharacteristic Symbol Test ConditionsMin.Typ.Max.Units Operate PointB OPProgrammable offset range 500670850G Initial (before programming)02040G Resolution8.01114G ∆B OPV CC = 14 V, after programming, B OP ≈ 500 G-358.0+35G HysteresisB hys5.02035GNOTE: Typical data is at V CC = 5 V and T A = +25°C and is for design information only.ELECTRICAL CHARACTERISTICS over operating voltage and temperature range (unless otherwise noted).LimitsCharacteristic Symbol Test Conditions Min.Typ.Max.Units Supply Voltage V CC Operating, T J < 165°C4.25–26V Power-On State POS After programming, V CC = 0 ¡ 5 V HIGH HIGH HIGH –Low Output Voltage V OUT(SAT)I OUT = 20 mA –175400mV Output Current Limit I OUTM V OUT = 12 V 658095mA Output Leakage Current I OFF V OUT = 24 V–0.210µA Supply CurrentI CCBefore programming, output OFF – 4.07.0mA Before programming, output ON– 5.08.0mA Reverse Supply Current I RCC V RCC = -30 V ––-5.0mA Power-On Delay t on V CC > 5 V–2050µs Output Rise Time t r R L = 820 Ω, C L = 20 pF –200–ns Output Fall Time t f R L = 820 Ω, C L = 20 pF–100–ns Clock Frequency f C –340–kHz Zener Voltage V Z I ZT = 100 µA, T A = 25°C 2732–V Zener Impedancez zI ZT = 10 mA, T A = 25°C –50100ΩNOTE: Typical data is at V CC = 5 V and T A = +25°C and is for design information only.MAGNETIC CHARACTERISTICS over operating supply voltage and temperature ranges.115 Northeast Cutoff, Box 15036Worcester, Massachusetts 01615-0036 (508) 853-50003150PROGRAMMABLE, CHOPPER-STABILIZED, PRECISION,HALL-EFFECT SWITCHTYPICAL ELECTRICAL CHARACTERISTICS255075100AMBIENT TEMPERATURE IN °C-50Dwg. GH-053-2125-25S U P P L Y C U R R E N T I N m A5.04.03.02.01.015010152025SUPPLY VOLTAGE IN VOLTSDwg. GH-041-25S U P P L Y C U R R E N T I N m A10300AMBIENT TEMPERATURE IN °C200Dwg. GH-040-4S A T U R A T I O N V O L T A G E I N m V3150PROGRAMMABLE, CHOPPER-STABILIZED, PRECISION,HALL-EFFECT SWITCHFUNCTIONAL DESCRIPTIONChopper-Stabilized Technique. These devices use a proprietary dynamic offset cancellation technique, with an internal high-frequency clock to reduce the residual offset voltage of the Hall element that is normally caused by device overmolding, temperature dependencies, and thermal stress.This technique produces devices that have an extremely stable quiescent Hall output voltage, are immune to thermal stress, and have precise recoverability after temperature cycling. Thistechnique will also slightly degrade the device output repeatabil-ity.The Hall element can be considered as a resistor arraysimilar to a Wheatstone bridge. A large portion of the offset is a result of the mismatching of these resistors. The chopper-stabilizing technique cancels the mismatching of the resistors by changing the direction of the current flowing through the Hall plate and Hall voltage measurement taps, while maintaining the Hall-voltage signal that is induced by the external magnetic flux.The signal is, then, captured by a sample-and-hold circuit.Operation. The output of these devices switches low (turns ON) when a magnetic field (south pole) perpendicular to the Hall sensor exceeds the operate point threshold (B OP ). After turn-ON, the output is capable of sinking 25 mA and the output voltage is V OUT(SAT). When the magnetic field is reduced below the release point (B RP ), the device output goes high (turns OFF).The difference in the magnetic operate and release points is the hysteresis (B hys ) of the device. This built-in hysteresis allows clean switching of the output even in the presence of external mechanical vibration and electrical noise.Applications. It is strongly recommended that an external bypass capacitor be connected (in close proximity to the Hall sensor) between the supply and ground of the device to reduce both external noise and noise generated by the chopper-stabiliza-tion technique.The simplest form of magnet that will operate these devices is a bar magnet with the south-seeking pole towards the branded surface of the device. Many other methods of operation are possible. Extensive applications information on magnets and Hall-effect sensors is also available in the Allegro Electronic Data Book AMS-702 or Application Note 27701, orO U T P U T V O L T A G EFLUX DENSITYDwg. GH-007-2115 Northeast Cutoff, Box 15036Worcester, Massachusetts 01615-0036 (508) 853-50003150PROGRAMMABLE, CHOPPER-STABILIZED, PRECISION,HALL-EFFECT SWITCHPROGRAMMING PROTOCOLThe A3150JLT and A3150JUA operate points are pro-grammed by serially addressing the device through the supply terminal (pin1). After the correct operate point is determined, the device programming bits are selected and then a “lock” set to prevent any further (accidental)programming.Program Enable. To program the device, a sequence of pulses is used to activate/enable the addressing mode as shown in figure 1. This sequence of a V PP pulse, at least seven V PH pulses, and a V PP pulse with no supply interrup-tions, is designed to prevent the device from being pro-grammed accidentally (for example, as a result of noise on the supply line).VV V Dwg. WH-013Figure 1 — Program enablePROGRAMMING PROTOCOL over operating temperature range.LimitsCharacteristic Symbol DescriptionMin.Typ.Max.Units Programming VoltageV PL Minimum voltage during programming4.55.0 5.5V V PH 9.01011V V PP202325V Programming Current I PP Max. supply current during programming –250–mA Pulse Widtht d(0)OFF time between bits20––µs t d(1)Enable, address, program, or lock bit ON time 20––µs t dPProgram pulse ON time 100300–µs Pulse Rise Time t r V PL to V PH or V PP 11––µs Pulse Fall Timet fV PH or V PP to V PL 5.0––µsNOTE: Typical data is at T A = +25°C and is for design information only.3150PROGRAMMABLE, CHOPPER-STABILIZED, PRECISION,HALL-EFFECT SWITCH* In application, the terms “gear” and “target” are often interchanged. However, “gear” is preferred when motion is transferred.Address Determination. The operate point is adjust-able in 64 increments. With the appropriate target or gear*in position, the 64 switch points are sequentially selected (figure 2) until the required operate point is reached. Note that the difference between the operate point and the release point (hysteresis) is a constant for all addresses.Set-Point Programming. After the desired set-point address is determined (0 through 63), each bit of theequivalent binary address is programmed individually. For example, as illustrated in figure 3, to program address code 5 (binary 000101), bits 1 and 3 need to be programmed.Each bit is programmed during the wide V PP pulse and is not reversible.Lock Programming. After the desired set point is programmed, the program lock is then activated (figure 4)to prevent further programming of the device.V PV 0Dwg. WH-014A D D R E S S 0A D D R E S S 1A D D R E S S 2A D D R E S S N (UP T O 63)A D D R E S S N -1A D D R E S S N -2Figure 2 — Address determinationFigure 4 — Lock programmingV V VDwg. WH-016Figure 3 — Set-point programmingV V V Dwg. WH-015A115 Northeast Cutoff, Box 15036Worcester, Massachusetts 01615-0036 (508) 853-50003150PROGRAMMABLE, CHOPPER-STABILIZED, PRECISION,HALL-EFFECT SWITCHAll Allegro sensors are subjected to stringent qualification requirements prior to being released to production.To become qualified, except for the destructive ESD tests, no failures are permitted.CRITERIA FOR DEVICE QUALIFICATIONQualification Test Test Method and Test Conditions Test Length SamplesComments Biased Humidity (HAST)T A = 130°C, RH = 85%50 hrs 77V CC = V OUT = 5 V High-Temperature JESD22-A108,408 hrs77V CC = 24 V,Operating Life (HTOL)T A = 150°C, T J = 165°C V OUT = 20 V Accelerated HTOLJESD22-A108,504 hrs 77V CC = 24 V,T A = 175°C, T J = 190°C V OUT = 20 VAutoclave, Unbiased JESD22-A102, Condition C,96 hrs 77T A = 121°C, 15 psig High-Temperature MIL-STD-883, Method 1008,1000 hrs 77(Bake) Storage Life T A = 170°CTemperature CycleMIL-STD-883, Method 1010,500 cycles 77-65°C to +150°C Latch-Up—Pre/Post 6Reading Electro-Thermally—Pre/Post 6Induced Gate Leakage Reading ESD,CDF-AEC-Q100-002Pre/Post x per Test to failure,Human Body Model Reading test All leads > TBDElectrical DistributionsPer Specification—303150PROGRAMMABLE, CHOPPER-STABILIZED, PRECISION,HALL-EFFECT SWITCHSENSOR LOCATIONS(±0.005” [0.13 mm] die placement)Package Designators “UA” and "UA-TL"Although sensor location is accurate to three sigma for a particular design, product improvements may result in small changes to sensor location.Dwg. MH-008-80.030"0.76 mm NOMDwg. MH-011-9APackage Designator “LT”115 Northeast Cutoff, Box 15036Worcester, Massachusetts 01615-0036 (508) 853-50003150PROGRAMMABLE, CHOPPER-STABILIZED, PRECISION,HALL-EFFECT SWITCH0.440.35PACKAGE DESIGNATOR 'LT'(SOT-89/TO-243AA)Dimensions in Inches (for reference only)Dimensions in Millimeters (controlling dimensions)Dwg. MA-012-3 mmPads 1, 2, 3, and B — Low-Stress VersionPads 1, 2, and 3 only — Lowest Stress, But Not Self AligningNOTE: Exact body and lead configuration at vendor’s option within limits shown.Dwg. MA-012-3 inads 1, 2, 3, and B — Low-Stress Versionads 1, 2, and 3 only — Lowest Stress, But Not Self Aligning3150 PROGRAMMABLE, CHOPPER-STABILIZED, PRECISION,HALL-EFFECT SWITCH Surface-Mount Lead Form (Suffix '-TL')Dimensions in Inches (controlling dimensions)Dimensions in Millimeters (for reference only)PACKAGE DESIGNATOR 'UA'Dwg. MH-014E mm1.27BSC°Dwg. MH-014E inBSC°NOTES: 1.Tolerances on package height and width represent allowable mold offsets. Dimensions given are measured at the widest point (parting line).2.Exact body and lead configuration at vendor’s option within limits shown.3.Height does not include mold gate flash.4.Recommended minimum PWB hole diameter to clear transition area is 0.035” (0.89 mm).5.Where no tolerance is specified, dimension is nominal.115 Northeast Cutoff, Box 15036Worcester, Massachusetts 01615-0036 (508) 853-50003150PROGRAMMABLE, CHOPPER-STABILIZED, PRECISION,HALL-EFFECT SWITCHThe products described herein are manufactured under one or more of the following U.S. patents: 5,045,920; 5,264,783; 5,442,283;5,389,889; 5,581,179; 5,517,112; 5,619,137; 5,621,319; 5,650,719;5,686,894; 5,694,038; 5,729,130; 5,917,320; and other patents pending.Allegro MicroSystems, Inc. reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, ormanufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current.Allegro products are not authorized for use as critical components in life-support appliances, devices, or systems without express written approval.The information included herein is believed to be accurate andreliable. However, Allegro MicroSystems, Inc. assumes no responsibil-ity for its use; nor for any infringements of patents or other rights of third parties that may result from its use.。

华宏光电子(深圳)有限公司 3528单晶蓝光贴片产品说明书

产品规格书Specification3528单晶蓝光贴片3528 Single Chip Blue Color Top LED产品型号/ Part No : WW-BNA30TS-Q1批准审核制定牛焕东陶源杨成琼华宏光电子（深圳）有限公司WAH WANG OPTOELECTRONIC (SHENZHEN)COMPANY LIMITED地址:深圳市宝安区大浪街道华荣路联建科技工业园第五栋Address：Floor Block 5, Lianjian Science ＆Technology lndustrial Park,Crossing of HuaRong Road,Dalang Sub-District, Bao`an, ShenZhen电话：*************Tel**************传真：*************Fax**************S.D.N. / D.N. No. 送货单编号Customer Name客户名称Sample Approval Signature戶客确认签署Date日期■ 产品特性■ Features：PLCC LED dimensions: 3.5(L) x 2.8(W) x 1.9(H) mm　发散视角120°Wide view angle 120　环保防静电胶带包装Available on tape and reel with Anti-electrostatic bag　产品性能稳定可靠Compatible for all SMT Assembly and Lead-Free SolderingRoHS Compliant■ 应用■ Applications：　背光液晶开关和显示Backlight for LCD Switch and Display　装饰照明Decorative Lighting　一般照明General Lighting　汽车内部照明Automotive Interior Lighting　常规使用General Use■ 产品尺寸图■ Package Dimensions：2建议焊盘尺寸■ 注释■ Notes ：1、上图所有尺寸的单位为毫米All dimension units are in millimeters.2、所有外形尺寸公差为 ± 0.25毫米，除非另有说明All dimension tolerances are ± 0.25mm unless otherwise noted.■ 最大绝对额定值■ Absolute Maximum Ratings ：参数Parameter 符号 Symbol 数值 Value单位 Unit 功耗Power dissipation P d 60 mW 连续正向电流I F 20 mA 峰值正向电流 Peak Forward CurrentI FP 50 mA 反向电压 Reverse Voltage V R5V静电放电(HBM)ESD 1000 V 工作温度范围T opr -25 to +85 ℃ 存储温度范围T stg -40 to +100 ℃ 无铅焊接温度T sol260( for 5 sec)℃Recommended Soldering Pads Dimensions Recommended Soldering Pads Dimensions光电参数规格：Electrical Optical Characteristics:WW-BNA30TS-Q1注释Notes:1、发光强度、功耗和光通量的误差为 ± 10％WW maintains a tolerance of ±10% on flux and power measurements.2、波长的误差为 ±1nm;d ±1nm.3、电压的误差为 ± 0.1VA tolerance of ±0.1V on forward voltage measurements参数 Parameter 符号 Symbol最小值 Min.平均值Typ.最大值 Max.单位 Unit测试条件 Test Conditions发光强度I v 400 --- 600 mcd波长 Spectral λd465 --- 475 nm参考光通量 Φv ------- --- lm 正向电压 V F 2.7 --- 3.3 V 视角Viewing Angle 2θ1/2 ---120 --- Deg I F =20mA反向电流 I R --- --- 5 µA V R = 5V■光电特性Typical Optical Characteristics CurvesAmbient Temperature TA(°C)环境温度(℃)R e l a t i v e L u m i n o u s I n t e n s i t y (%)发光强度(%)Forward Current Derating Curve 环境温度与电流的关系曲线图Radiation Diagram发光角度图Spectral Distribution波长曲线图Luminous Intensity vs AmbientTemperature发光强度与温度的关系曲线图F o r w a r d C u r r e n t (m A )电流(m A )Ambient Temperature TA(°C)R e l a t i v e L u m i n o u s I n t e n s i t y (%)光通量（%）Forward Current (mA)电流(mA)Forward Voltage (V)电压(V)F o r w a r d C u r r e n t (m A ) 电流(m A )Forward Current vs Forward Voltage伏安特性曲线Forward Current vs Relative Luminous Intensity电流和光通量的关系■ 产品可靠性检测项目：序號No.实验项目Test Item标准测试方法Standard TestMethod测试条件Test Conditions检测时间和周期Duration不良数/测试数Failure RateIf=20mA1正常工作寿命Steady StateOperating LifeJEITA ED-4701100 103 Ta=25℃1000hrs 0/22 JEITA ED-47012低温贮藏Low TemperatureStorage 200 202Ta=-40℃ 1000hrs 0/22JEITA ED-47013高温贮存High TemperatureStorage 200 201Ta=100℃ 1000hrs 0/22JEITA ED-4701 Ta=60℃4高温高湿贮藏TemperatureHumidity Storage 100 103 RH=90%1000hrs 0/22JEITA ED-4701 0℃ ~ +100℃5 冷热冲击Thermal Shock 300 307 5min~ 15sec ~5min10 cycles 0/22H：+100℃ 30min.高低温循环Temperature Cycle ∫ : +25℃ 5min.6 JEITA ED-4701100 105L：－40℃ 30min100cycles0/22 JEITA ED-47017 烫锡Solder Heat 300 301 Tsld=260℃, 10sec(Max.)2 times 0/22■ 失效产品判定标准：项目Item符号Symbol测试条件Test Condition最小值Min.最大值Max.正向电压Forward VoltageV F I F = 20mA -- *U.S.L×1.1 反向电流Reverse CurrentI R V R = 5V -- *U.S.L×2.0发光强度Luminous IntensityI V I F = 20mA **L.S.L×0.7 --*U.S.L.:超出标准最大值*U.S.L.: Upper Standard Level** L.S.L.:低于标准最低值** L.S.L.: Lower Standard Level■ .■■■ Dimensions of the reel：■ .包装■ Packing：防潮、防静电真空密封包装■ Moisture, anti-static vacuum sealed packages■ 注释■ Note：上图所有尺寸的单位为毫米，公差为 ± 2.0毫米，除非另有说明All dimensions are in mm, tolerance is ± 2.0mm unless otherwise noted.■注意事项：PRECAUTION IN USE1.存储要求:1.1推荐储存环境温度：5℃30℃的（41oF86oF）湿度：相对湿度60％以下1.2防潮袋密封包装储存时间3个月，起始时间以包装标签日期为准，需在包装袋封口良好并无漏气现象，且湿度卡未变为粉红色前提下使用，如超过3个月的LED需按2. 2要求除潮烘烤后才能正常使用。

SiLabs CP2101单芯片USB到UART桥数据手册说明书

Single-Chip USB to UART BridgeCP2101Single-Chip USB to UART Data Transfer-Integrated USB Transceiver; No External Resistors Required-Integrated Clock; No External Crystal Required -Integrated 512-Byte EEPROM for Vendor ID, Product ID, Serial Number, Power Descriptor, Release Number and Product Description Strings -On-Chip Power-On Reset Circuit-On-Chip Voltage Regulator: 3.3 V OutputUSB Function Controller-USB Specification 2.0 Compliant; Full Speed (12 Mbps)-USB suspend states supported via SUSPEND pinsAsynchronous Serial Data BUS (UART)-All Handshaking and Modem Interface Signals -Data Formats Supported:•Data Bits: 8•Stop Bits: 1•Parity: Odd, Even, No Parity -Baud Rates: 300 bps to 921.6 kbps-512 Byte Receive Buffer; 512 Byte Transmit Buffer -Hardware or X-On / X-Off Handshaking Supported -Event Character SupportVirtual COM Port Device Drivers-Works with Existing COM Port PC Applications -Royalty-Free Distribution License -Windows 98/2000/XP -MAC OS-9-MAC OS-X -Windows CE*-Linux 2.40 and greater* (Contact factory for availability)Example Applications-Upgrade of RS-232 Legacy Devices to USB -Cellular Phone USB Interface Cable -PDA USB Interface Cable -USB to RS-232 Serial Adapter Supply Voltage-Self-powered: 3.0 to 3.6 V-USB Bus Powered: 4.0 to 5.25 V Package-28-pin MLP (5 x 5 mm)Temperature Range: -40 to +85 °CCP2101Table of Contents1.System Overview (4)2.Absolute Maximum Ratings (4)Table 2.1. Absolute Maximum Ratings (4)3.Global DC Electrical Characteristics (5)Table 3.1. Global DC Electrical Characteristics (5)Table 3.2. UART and Suspend I/O DC Electrical Characteristics (5)4.Pinout and Package Definitions (6)Table 4.1. Pin Definitions for the CP2101 (6)Figure 4.1. MLP-28 Pinout Diagram (Top View) (7)Figure 4.2. MLP-28 Package Drawing (8)Table 4.2. MLP-28 Package Dimensions (8)Figure 4.3. Typical MLP-28 Landing Diagram (9)Figure 4.4. Typical MLP-28 Solder Mask (10)B Function Controller and Transceiver (11)Figure 5.1. Typical Connection Diagram (11)6.Asynchronous Serial Data Bus (UART) Interface (12)Table 6.1. Data Formats and Baud Rates (12)7.Internal EEPROM (12)Table 7.1. Default USB Configuration Data (12)8.Virtual Com Port Device Drivers (13)9.Voltage Regulator (14)Table 9.1. Voltage Regulator Electrical Specifications (14)Figure 9.1. Configuration 1: USB Bus-Powered (14)Figure 9.2. Configuration 2: USB Self-Powered (15)Figure 9.3. Configuration 3: USB Self-Powered, Regulator Bypassed (15)1.System OverviewThe CP2101 is a highly-integrated USB-to-UART Bridge Controller providing a simple solution for updating RS-232 designs to USB using a minimum of components and PCB space. The CP2101 includes a USB 2.0 full-speed function controller, USB transceiver, oscillator, EEPROM and asynchronous serial data bus (UART) with full modem control signals in a compact 5 x 5 mm MLP-28 package. No other external USB components are required.The on-chip EEPROM may be used to customize the USB Vendor ID, Product ID, Product Description String, Power Descriptor, Device Release Number and Device Serial Number as desired for OEM applications. The EEPROM is programmed on-board via the USB allowing the programming step to be easily integrated into the product manufacturing and testing process.Royalty-free Virtual COM Port (VCP) device drivers provided by Silicon Laboratories allow a CP2101-based product to appear as a COM port to PC applications. The CP2101 UART interface implements all RS-232 signals, including control and handshaking signals, so existing system firmware does not need to be modified. In many existing RS-232 designs, all that is required to update the design from RS-232 to USB is to replace the RS-232 level-translator with the CP2101.An evaluation kit for the CP2101 (Part Number: CP2101EK) is available. It includes a CP2101-based USB-to-UART/RS-232 evaluation board, a complete set of VCP device drivers, USB and RS-232 cables, and full documentation. Contact a Silicon Labs’ sales representatives or go to to order the CP2101 Evaluation Kit.2.Absolute Maximum RatingsTable 2.1. Absolute Maximum RatingsParameter Conditions Min Typ Max Units Ambient temperature under bias–55—125°C Storage Temperature–65—150°C Voltage on any I/O Pin or RST with respect to–0.3— 5.8V GNDVoltage on V DD with respect to GND–0.3— 4.2V Maximum Total current through V DD and GND——500mA——100mA Maximum output current sunk by RST or anyI/O pinNote: stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the devices at those or any other condi-tions above those indicated in the operation listings of this specification is not implied. Exposure to maxi-mum rating conditions for extended periods may affect device reliability.CP21013.Global DC Electrical CharacteristicsTable 3.1. Global DC Electrical CharacteristicsV DD = 2.7 to 3.6 V, –40 to +85 °C unless otherwise specifiedParameter Conditions Min Typ Max Units Supply Voltage 3.0 3.3 3.6V Supply Current V DD = 3.3 V—25—mA Supply Current in Suspend V DD = 3.3 V—325—µA Specified Operating Temperature Range–40—+85°CTable 3.2. UART and Suspend I/O DC Electrical CharacteristicsV DD = 2.7 to 3.6 V, -40 to +85 °C unless otherwise specifiedParameters Conditions Min Typ Max UNITSOutput High Voltage I OH = -3mAI OH = -10µAI OH = -10mAVDD-0.7VDD-0.1VDD-0.8VOutput Low Voltage I OL = 8.5mAI OL = 10µAI OL = 25mA 1.00.60.1VInput High Voltage 2.0V Input Low Voltage0.8V Input Leakage Current2550µACP21014.Pinout and Package DefinitionsTable 4.1. Pin Definitions for the CP2101Name Pin #Type DescriptionV DD6Power InPowerOut3.0–3.6 V Power Supply Voltage Input.3.3 V Voltage Regulator Output. See Section 9.GND3GroundRST9 D I/O Device Reset. Open-drain output of internal POR or V DD monitor. An external source can initiate a system reset by driving this pin low for at least 15 µs.REGIN7Power In 5 V Regulator Input. This pin is the input to the on-chip voltage regu-lator.VBUS8 D In VBUS Sense Input. This pin should be connected to the VBUS signal of a USB network. A 5 V signal on this pin indicates a USB network connection.D+4 D I/O USB D+D–5 D I/O USB D–TXD26 D Out Asynchronous data output (UART Transmit) RXD25 D In Asynchronous data input (UART Receive) CTS23* D In Clear To Send control input (active low)RTS24* D Out Ready to Send control output (active low)DSR27* D in Data Set Ready control input (active low)DTR28* D Out Data Terminal Ready control output (active low) DCD1* D In Data Carrier Detect control input (active low)RI2* D In Ring Indicator control input (active low)SUSPEND12* D Out This pin is driven high when the CP2101 enters the USB suspend state.SUSPEND11* D Out This pin is driven low when the CP2101 enters the USB suspend state.NC10, 13–22These pins should be left unconnected or tied to V DD. *Note: Pins can be left unconnected when not used.CP2101Figure 4.1. MLP-28 Pinout Diagram (Top View)CP2101Figure 4.2. MLP-28 Package DrawingTable 0.1. MLP-28 Package DimensionsMM MIN TYP MAX A 0.800.90 1.00A100.020.05A200.65 1.00A3—0.25—b 0.180.230.30D — 5.00—D2 2.90 3.15 3.35E — 5.00—E2 2.90 3.15 3.35e —0.5—L 0.450.550.65N —28—ND —7—NE —7—R 0.09——AA —0.435—BB —0.435—CC —0.18—DD—0.18—CP2101Figure 4.3. Typical MLP-28 Landing DiagramCP2101Figure 4.4. Typical MLP-28 Solder Mask11Rev. 1.5B Function Controller and TransceiverThe Universal Serial Bus function controller in the CP2101 is a USB 2.0 compliant full-speed device with integrated transceiver and on-chip matching and pull-up resistors. The USB function controller manages all data transfers between the USB and the UART as well as command requests generated by the USB host controller and commands for controlling the function of the UART.The USB Suspend and Resume signals are supported for power management of both the CP2101 device as well as external circuitry. The CP2101 will enter Suspend mode when Suspend signaling is detected on the bus. On entering Suspend mode, the CP2101 asserts the SUSPEND and SUSPEND signals. SUSPEND and SUSPEND are also asserted after a CP2101 reset until device configuration during USB Enumeration is completeThe CP2101 exits the Suspend mode when any of the following occur: (1) Resume signaling is detected or generated, (2) a USB Reset signal is detected, or (3) a device reset occurs. On exit of Suspend mode, the SUSPEND and SUSPEND signals are de-asserted.Both SUSPEND and SUSPEND temporarily float high during a CP2101 reset. If this behavior is undesirable, a strong pulldown (10 kΩ) can be used to ensure SUSPEND remains low during reset. See Figure 5.1 for other recommended options.Figure 5.1. Typical Connection DiagramRev. 1.5126.Asynchronous Serial Data Bus (UART) InterfaceThe CP2101 UART interface consists of the TX (transmit) and RX (receive) data signals as well as the RTS, CTS, DSR, DTR, DCD and RI control signals. The UART supports RTS/CTS, DSR/DTR and X-On/X-Off handshaking.The UART is programmable to support a variety of data formats and baud rates. The data format and baud rate programmed into the UART is set during COM port configuration on the PC. The data formats and baud rates available are listed in Table 6.1.7.Internal EEPROMThe CP2101 includes an internal EEPROM that may be used to customize the USB Vendor ID, Product ID, Product Description String, Power Descriptor, Device Release Number and Device Serial Number as desired for OEM applications. Customization of the USB configuration data is optional. If the EEPROM is not programmed with OEM data, the default configuration data shown in Table 7.1 is used. However, a unique serial number is required for OEM applications in which it is possible for multiple CP2101-based devices to be connected to the same PC.The internal EEPROM is programmed via the USB. This allows the OEM's USB configuration data and serial number to be written to the CP2101 on-board during the manufacturing and testing process. A stand-alone utility for programming the internal EEPROM is available from Silicon Laboratories. A library of routines provided in the form of a Windows ® DLL is also available. This library can be used to integrate the EEPROM programming step into custom software used by the OEM to streamline testing and serial number management during manufacturing. The EEPROM has a typical endurance of 100,000 write cycles with a data retention of 100 years.Table 6.1. Data Formats and Baud RatesData Bits 8Stop Bits 1Parity Type None, Even, OddBaud Rates300, 600, 1200, 1800, 2400, 4800, 7200, 9600, 14400, 19200, 28800, 38400, 56000, 57600, 115200, 128000, 230400, 460800, 921600Table 7.1. Default USB Configuration DataName Value Vendor ID 10C4h Product IDEA60h Power Descriptor (Attributes)80hPower Descriptor (Max. Power)32h Release Number 0100hSerial Number0001 (63 characters maximum)Product Description String“CP2101 USB to UART Bridge Controller” (126 characters maximum)13Rev. 1.58.Virtual Com Port Device DriversThe CP2101 Virtual COM Port (VCP) device drivers allow a CP2101-based device to appear to the PC's application software as an additional COM port (in addition to any existing hardware COM ports). Application software running on the PC accesses the CP2101-based device as it would access a standard hardware COM port. However, actual data transfer between the PC and the CP2101 device is performed over the USB. Therefore, existing COM port applications may be used to transfer data via the USB to the CP2101-based device without modifying the application. Contact Silicon Laboratories for the latest list of supported operating systems.Note:The Silicon Laboratories VCP device drivers are required for device operation and are only distributed as part of the CP2101 Evaluation Kit (Part Number: CP2101EK). Contact any of Silicon Lab’s sales representatives or go to to order the CP2101 Evaluation Kit. The CP2101 drivers and programming utilities are subject to change without notice. Subscription to the website "Auto Email Alert" system for automatic notification of updates and the use of the "Product Update Registration" service is recommended.Rev. 1.5149.Voltage RegulatorThe CP2101 includes an on-chip 5-to-3 V voltage regulator. This allows the CP2101 to be configured as either a USB bus-powered device or a USB self-powered device. These configurations are shown in Figure 9.1 and Figure 9.2. When enabled, the 3 V voltage regulator output appears on the V DD pin and can be used to power external 3V devices. See Table 9.1 for the voltage regulator electrical characteristics.Alternatively, if 3 V power is supplied to the V DD pin, the CP2101 can function as a USB self-powered device with the voltage regulator disabled. For this configuration, it is recommended that the REGIN input be tied to the 3 V net to disable the voltage regulator. This configuration is shown in Figure 9.3.The USB max power and power attributes descriptor must match the device power usage and configuration. See application note “AN144: CP2101 Customization Guide” for information on how to customize USB descriptors for the CP2101.Note:It is recommended that additional decoupling capacitance (e.g., 0.1 µF in parallel with 1.0 µF) be provided on the REGIN input.Figure 9.1. Configuration 1: USB Bus-PoweredTable 9.1. Voltage Regulator Electrical Specifications–40 to +85 °C unless otherwise specifiedParameterConditionsMin Typ Max Units Input Voltage Range 4.0— 5.25V Output VoltageOutput Current = 1 to 100 mA*3.0 3.3 3.6V VBUS Detection Input Threshold 1.0 1.84.0V Bias Current—90TBDµA* The maximum regulator supply current is 100 mA.15Rev. 1.5Figure 9.2. Configuration 2: USB Self-PoweredFigure 9.3. Configuration 3: USB Self-Powered, Regulator BypassedRev. 1.516Document Change ListRevision 1.4 to Revision 1.5Updated Example System Diagram on page 1.Updated Table 3.1, “Global DC Electrical Characteristics,” on page 5.Added Table 3.2, “UART and Suspend I/O DC Electrical Characteristics,” on page 5 Added Table note to Table 4.1, “Pin Definitions for the CP2101,” on page 6 Added Figure 5.1. , "Typical Connection Diagram" on page 11Removed asterisk from the “Linux 2.40 and greater” bullet on page 117Rev. 1.5NotesRev. 1.518Contact InformationSilicon Laboratories Inc.4635 Boston Lane Austin, TX 78735Tel: 1+(512) 416-8500 Fax: 1+(512) 416-9669 Toll Free: 1+(877) 444-3032Email:********************** Internet: Silicon Laboratories and Silicon Labs are trademarks of Silicon Laboratories Inc.Other products or brandnames mentioned herein are trademarks or registered trademarks of their respective holdersThe information in this document is believed to be accurate in all respects at the time of publication but is subject to change without notice. Silicon Laboratories assumes no responsibility for errors and omissions, and disclaims responsibility for any consequences resulting from the use of information included herein. Additionally, Silicon Laboratories assumes no responsibility for the function-ing of undescribed features or parameters. Silicon Laboratories reserves the right to make changes without further notice. Silicon Laboratories makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Silicon Laboratories assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. Silicon Laboratories products are not designed, intended, or authorized for use in applications intended to support or sustain life, or for any other application in which the failure of the Silicon Laboratories product could create a situation where personal injury or death may occur. Should Buyer purchase or use Silicon Laboratories products for any such unintended or unauthorized application, Buyer shall indemnify and hold Silicon Laboratories harmless against all claims and damages.。

温控仪中英文对照

干式变压器温度控制仪Temperature Controller for Dry-type Transformer安装使用说明书Installation Operation Instruction辽宁金立电力电器有限公司LIAO NING JIN LI ELECTRIC POWER EQUIPMENT CO.,LTDNO.1在使用您所购置的温控仪之前，请务必仔细阅读我公司的使用说明书。

并妥善保管，以备使用中查阅。

By all means please carefully read the operation instruction of our company before using the temperature controller. And please keep it safely for reference.注意事项 Note☆ 本说明书由最终使用者保留！☆ The manual should be kept by the end users!☆ 安装操作前，请认真阅读本手册！☆ Please carefully read the manual before installation and operation!☆ ※在进行变压器耐压试验前应先将传感电缆插头与温控仪分离，以免损坏温控仪！！！☆ ※Separate the sensor cable plug and temperature controller before havingwithstand voltage test of transformer in order to avoid damage☆ 为让温控仪能够长时间稳定运行，在搬运、安装时尽可能小心轻放。

☆ Please be careful as much as possible when handling and installing in order that the temperature controller can have a long and stable operation.☆ 请勿将温控仪安装在高温、强腐蚀性、高场强的环境当中。

SA2532K资料

AN1500A
PDS038-SA2532K-001
Rev. C
21-03-00
元器件交易网
AN1500A
TABLE OF CONTENTS
1 2 3 4 5 6 7
SCOPE................................................................................................................................................................. 1 KEY FEATURES ................................................................................................................................................. 1 OTHER APPLICABLE DOCUMENTS AND PAPERS ........................................................................................ 4 REVISION STATUS............................................................................................................................................. 4 SA2532K PIN LAYOUT . ..................................................................................................................................... 4 GENERAL DESCRIPTION .................................................................................................................................. 5 DEMO BOARD CONFIGURATION..................................................................................................................... 5

广州唯创电子有限公司 WTN4 系列语音芯片说明书

广州唯创电子有限公司MP3录音模块WTN4系列语音芯片说明书3I/O Single-Chip Speech SynthesizerV1.052017-01-17Note：WAYTRONIC ELECTRONIC CO.,LTD.reserves the right to change this document without prior rmation provided by WAYTRONIC is believed to be accurate and reliable.However,WAYTRONIC makes no warranty for any errors which may appear in this document.Contact WAYTRONIC to obtain the latest version of device specifications before placing your orders.No responsibility is assumed by WAYTRONIC for any infringement of patent or other rights of third parties which may result from its use.In addition,WAYTRONIC products are not authorized for use as critical components in life support devices/systems or aviation devices/systems,where a malfunction or failure of the product may reasonably be expected to result in significant injury to the user, without the express written approval of WAYTRONIC.目录1、概述： (3)2、功能简述： (3)3、管脚描述： (4)3.1、WTN4045/WTN4065/WTN4105-8S管脚介绍 (4)3.2、WTN4165-8S管脚介绍 (4)3.3、极限参数： (5)3.4、直流特性： (5)4、一线串口通讯： (6)4.1、管脚分配: (6)4.2、一线语音地址对应关系: (6)4.3、一线语音及命令码对应表: (7)4.4、一线串口时序图: (7)4.5、一线串口程序范例： (8)5、两线串口通讯： (9)5.1、管脚分配： (9)5.2、语音地址对应关系： (9)5.3、语音及命令码对应表： (9)5.4、两线串口时序图： (10)5.5、两线串口程序范例： (10)6、数脉冲控制方式： (11)6.1、管脚分配： (11)6.2、语音地址对应关系： (11)6.3、数脉冲控制时序： (12)6.4、数脉冲程序范例： (12)7、应用电路： (13)7.1、WTN4045/065/105-8S一线串口控制应用电路 (13)7.2、WTN4045/065/105-8S两线串口控制应用电路 (14)7.3、WTN4045/065/105-8S数脉冲控制应用电路 (14)7.4、WTN4165-8S一线串口控制应用电路 (15)7.5、WTN4165-8S两线串口控制应用电路 (15)7.6、WTN4165-8S数脉冲控制应用电路 (16)8、管脚封装图： (16)9、版本记录 (17)1、概述WTN4系列语音芯片是广州唯创电子有限公司推出的一系列语音芯片，其性能优越，价格实惠。

外文翻译--基于51单片机温度报警器的设计(适用于毕业论文外文翻译+中英文对照)

外文翻译--基于51单片机温度报警器的设计(适用于毕业论文外文翻译+中英文对照)XXX: Design of a Temperature Alarm Based on 51 MCUDepartment: n EngineeringMajor: Measurement and Control Technology and nClass:Student ID:Name:Supervisor:Date:A microcontroller。

also known as a single-chip computer system。

XXX its ns being integrated on a small chip。

it has most of the components needed for a complete computer system。

such as CPU。

memory。

internal and external bus systems。

and mostof them also have external storage。

At the same time。

it integrates XXX interfaces。

timers。

real-time clocks。

etc。

The most XXX integrate sound。

image。

ork。

and complex input-output systems on a single chip.XXX used in the industrial control field。

Microcontrollers XXX CPUs inside the chip。

The original design concept was to integrate a large number of peripheral devices and CPUs on a chip to make the computer system XXX's Z80 was the first processor designed according to this concept。

外文文献翻译

本科毕业生外文文献翻译中国·大庆2014 年 5 月DS1302 trickle charge timekeeping chip Abstract: Introduces the United States with DALLAS trickle charge current capacity of small low-power real time clock DS1302 circuit structure, working principle and its application in real-time display of application time. It can be years, months, days, weekdays, hours, minutes, seconds for time, and has multiple functions, such as a leap year compensation. DS1302 are given in the C51 to read and write procedures and flow chart, as well as in the process of debugging note.Keywords: clock circuit; real-time clock; singlechip; Application1 IntroductionNow popular in many of the serial clock circuit, such as the DS1302, DS1307, PCF8485, etc.. These circuits interface is simple, inexpensive and easy to use, has been widely used. This paper introduces the DS1302 real time clock circuit is DALLAS's a small trickle charge current of the circuit capacity, the main feature is the use of serial data transmission, can provide programmable power-down protection functions of charge and can be shut down charging functions . 32.768kHz crystal ordinary.2 DS1302's structure and working principleDALLAS companies DS1302 is the United States launched a high-performance, low power consumption, with real-time clock circuit of the RAM, it can be years, months, days, weekdays, hours, minutes, seconds for time, with leap year compensation, the working voltage to 2.5V ~ 5.5V. The use of three-wire interface for synchronous communication with the CPU, and the use of unexpected ways to send more than one byte of data clock signal, or RAM. DS1302 within a 31 × 8 for the temporary storage of the RAM data register. DS1302 is the DS1202 to upgrade products, compatible with the DS1202, but the increase of the main power supply / back-pin dual power supply, while providing the power back to the small trickle charge current capacity.FEATURES● 1 Real-Time Clock Counts Seconds, Minutes, Hours, Date of the Month, Month,Day of the Week, and Year with Leap-Year Compensation Valid Up to 2100● 2 31 x 8 Battery-Backed General-Purpose RAM● 3 Serial I/O for Minimum Pin Count● 3 2.0V to 5.5V Full Operation● 4 Uses Less than 300nA at 2.0V● 5 Single-Byte or Multiple-Byte (Burst Mode) Data Transfer for Read or Write ofClock or RAM Data● 6 8-Pin DIP or Optional 8-Pin SO for Surface Mount●7 Simple 3-Wire Interface●8 TTL-Compatible (VCC = 5V)●9 Optional Industrial Temperature Range: -40°C to +85°C2.1 Pin function and structurePIN DESCRIPTION1)X1, X2 – 32.768 kHz Crystal Pins2)GND – Ground3)RST – Reset4)I/O – Data Input/Output5)SCLK – Serial Clock6)V CC1, V CC2 – Power Supply PinsFigure 1 showing a pin of the DS1302, which Vcc1 for back-up power supply, VCC2-based power. In the main power off, the clock is also able to maintain continuous operation. Vcc2 by the DS1302 or whichever Vcc1 the greater power. When Vcc2 than Vcc1 +0.2 V when, Vcc2 power supply to the DS1302. When Vcc1 less than Vcc2 when, DS1302 powered by Vcc1. X1 and X2 is the source of oscillation, an external 32.768kHz crystal. RST is the reset / chip select lines, through the RST input high drive home to start all of the data transfer. RST input has two functions: First, RST access control logic, allowing the address / command sequence into the shift register; Secondly, RST to terminate the provision of single-byte or multi-byte data transmission. When RST is high, all data are initialized to allow the DS1302 to operate on. If in the course ofRST sent home for the low, it will terminate the data transfer, I / O pin into high impedance state. Run-time power, Vcc ≥ 2.5V in before, RST must remain low. SCLK low only when the RST can be set to high. I / O for serial data input and output side (two-way), followed by a detailed description. Is always the SCLK input.2.2 DS1302 control byteDS1302 control word as shown in Figure 2. Control byte MSB (bit 7) must be logic 1, if it is 0, are not able to write data in the DS1302, bit 6 if 0, then the calendar clock and data access, that access to RAM to 1 data; bit 5 to bit 1 of the address unit instructions; least significant bit (bit 0) in the case of 0 to write to, read to 1, said operation, the control byte is always the beginning of the output from the lowest bit.2.3 Data input and output (I / O)Instruction word in the control input of the next clock rising edge of SCLK, the data is written into the DS1302, data input from the low enthronement 0. Similarly, in the following 8-bit instruction word control after the next falling edge of SCLK pulse to read out the DS1302 data,read the data from 0 to 7 .2.4 DS1302 registerDS1302 there are 12 registers, which register with the seven calendar, clock related data stored in digital form as a BCD code, the calendar and time registers and control words in Table 1.In addition, DS1302 year also register, control register, the charge register, the clock register and emergency-related registers, such as RAM. Clock burst read and write registers in addition to the order of one-time charge outside the register contents of all registers. DS1302 registers associated with the RAM is divided into two types: one is a single RAM unit, a total of 31, each module configuration for an 8-bit bytes, the command control words C0H ~ FDH, in which odd-numbered for the read operation, even for the write operation; the other for the sudden manner of RAM registers, this approach can be a one-time read and write all 31 bytes of RAM, a command control word for the FEH (write), FFH (Reading).3 DS1302 real-time display of time hardware and softwareDS1302 connection with the CPU needs three lines, namely, SCLK (7), I / O (6), RST (5).3.1 DS1302 connection with the CPUIn fact, in the debugger when the capacitor can not only add to a 32.768kHz crystal. Only when the choice of crystal, different crystal, error as well. In addition, the circuitcan be added to the above DS18B20, at the same time show the real-time temperature. CPU as long as the occupation of a line I can. LCD can be replaced with LED, can also use the letter Wei Jie Beijing Science and Technology Development Co., Ltd. produced 10 multi-purpose 8 LCD Module LCM101, containing watchdog (WDT) / clock generator and the two frequency beep driver circuit and a built-display RAM, any field can be displayed strokes, with a 3-4 line serial interface of any single-chip, IC interface. Low power consumption when the current show 2μA (typical value), power-saving mode is less than 1μA, working voltage is 2.4V ~ 3.3V, show clear.3.2 DS1302 real-time flow of timeSingle-byte read and single-byte writeDS1302 data exchange with the microprocessor, the first microprocessor to the circuit by sending the command byte, command byte highest MSB (D7) must be a logic 1, if D7 = 0, then the prohibition of writing DS1302, that is write-protected; D6 = 0, the designated clock and data, D6 = 1, designated RAM data; D5 ~ D1 designated a specific input or output register; lowest LSB (D0) to logic 0, the specified write operation (input), D0 = 1, the designated time operations (output).Calendar clock in the DS1302 or RAM for data transmission, DS1302 must first send a command byte. If a single byte transmission, 8-bit command byte sent after the end of the next two cycles of rising edge of SCLK input data byte, or 8 the next falling edge of SCLK cycle, the output data bytes.DS1302 registers associated with the RAM is divided into two types: one is a single RAM unit, a total of 31, each module configuration for an 8-bit bytes, the command control words C0H ~ FDH, in which odd-numbered for the read operation, even for the write operation; and then a class for the sudden manner of RAM register in this mannercan be a one-time reading, writing all 31 bytes of RAM.Special note is the back-up power supply B1, can use batteries or super capacitors (0.1F and above). Although the DS1302 in the main power after the power down very small, but if the clock to ensure the normal time, the best selection of small rechargeable batteries. Can be used on the old computer motherboard 3.6V rechargeable batteries. If a shorter time off (hours or days), the leakage can be used on a smaller electrolytic capacitors instead of the ordinary. 100 μF to 1 hour to ensure the normal travel time. DS1302 power in the first, you must initialize operation. After initialization method can be adjusted in accordance with the normal time.4 ConclusionThe existence of DS1302 clock accuracy is not high, the vulnerability of the environmental impact of the shortcomings of the chaos emerged clock. DS1302 can be used for data recording, in particular, is of special significance for some of the data points of the record data and time to which the data recorded at the same time. This record of long-term results of continuous monitoring and control system analysis and data on the causes abnormal finding of great significance. Traditional data record is separated from time to time when the sample or samples, there is no record of a specific time, therefore, can not only keep data accurate records of their time there; if the use of single-chip timing, on the one hand, require the use of counters, occupied by the hardware resources On the other hand, the need for interruption, and other inquiries, the same cost single-chip resources, and may not allow some monitoring and control system. However, if used in the system clock chip DS1302, can well solve the problem.DS1302涓流充电计时芯片摘要：介绍美国DALLAS公司推出的具有涓细电流充电能力的低功耗实时时钟电路DS1302的结构、工作原理及其在实时显示时间中的应用。

电线电缆常用英文

Color
顏色
Dozen
打
Green
綠色
Time
時間
Golden
金黃色
Hour
小時
Orange
橙色
Minute
分鐘
Black
黑色
Second
秒
Red
紅色
Quarter
刻,十五分鐘
Violet
紫羅蘭色
A’m
上午
Blue
藍色
Noon
中午
Purple
紫色
P’m
下午
Yellow
黃色
Times
次,倍
Grey
灰色
Sampling
抽樣
Vender
供應商
PE-bag
PE袋
Customer
客戶
Foam PE
發泡PE
Symbol
符號,圖形
PE-film
PE膜
Description
描述,說明
Cottonyarn
棉紗
Over mold
外模
Nylon cord
尼龍繩
Pre mold
內模
Oval minitie
橢圓迷你帶
Main
沸點
Press
壓傷
Freezing
冰點,零點
Matte
不亮面
Absolute zero
絕對零度
Dull
霧的
Indicating lamp
指示燈
Black gloss surface
黑色亮面
Electrical test
電气測試
Black matte surface

TNT4882手册

TNT4882Single-Chip IEEE 488.2 Talker/Listener ASIC National InstrumentsPhone: (512) 794-0100 • Fax: (512) 683-9300 • info@ • 3D I O 6N G N DL A D C S D I O 8NG N D I F C N D I O 5NS R Q N G N D D I O 7N A T N NR E N NG N D R E S E T NG N D DATA5DATA4GND GND VDD GND DATA0INTR DACKN DRQ BURST_RDN DAVNGNDVDDGNDDIO2NDIO3NVDDXTAL1EOINW R N G N D V D DT R I G C P U A C C T A D C S A B U S _O E N A D D R 4A D D R 3A D D R 2A D D R 1A D D R 0A B U S N P A G E D G N D R E M S W A P N F I F O _R D Y GNDXTAL0GNDKEYDQKEYRSTN DATA3DATA2DATA1GND VDD RDY1V D D D A T A 10G N D D A T A 11D A T A 12D A T A 13G N D D A T A 14D A T A 15B B U S _O E N D A T A 9D A T A 8V D D G N D GND DATA6DATA7R D N B B U S N G N D V D D G N D V D D G N D G N D C S N G N D M O D E N C D C A SGNDNRFDNNDACNGeneric Pin ConﬁgurationFigure 3. TNT4882 Generic Pin ConﬁgurationTable continued on page 4Generic Pin DescriptionAll pins with names that end in ‘N’ are active low; all others are active high. All input (I) and bidirectional (I/O) pins have an internal pull-up resistor between 50 k Ωand 150 k Ω.Note: You can also see the “Hardware Considerations” chapter of the “TNT Programmer Reference Manual” (P/N 320724-01) for more information.TNT4882Single-Chip IEEE 488.2 Talker/Listener ASIC National InstrumentsPhone: (512) 794-0100 • Fax: (512) 683-9300 • info@ • 4Pin No.(s)Name(s)Type Description 51DCAS O Asserts when the device clear state machine is in DCAS 52NC O Leave this pin unconnected 53MODE I Determines whether the TNT4882 powers up in 7210 or 9914 emulation mode – High = 7210 mode, Low = 9914 mode 55CSN I Chip Select enables I/O transfers between the CPU and the TNT488262BBUSN I Enables register accesses through the B bus (DATA7-0)63RDN I Enables the contents of the registers selected by ADDR 4:0 and CSN or the FIFOs to appear on the data bus selected by ABUSN and BBUSN 64WRN I Latches data on the bus selected by ABUSN and BBUSN into an internal TNT4882 register on the trailing (rising) edge of WRN 66LADCS O Asserts when the TNT4882 is addressed as a Listener 67RESETN I Holds the TNT4882 in its idle state 71,74,77,80,88,DIO8-1N I/O 8-bit bidirectional IEEE 488 data bus 89,91,9270,73,76,79,RENN, ATNN, SRQN, I/O IEEE 488 control signals 81,82,84,85IFCN, NDACN, NRFDN, DAVN, EOIN 95XTAL0O Output of crystal circuit – use only for driving a quartz crystal 96XTAL1I Crystal oscillator input – drive with a 40 MHz CMOS input level clock signal 98KEYCLKN O Strobes data to or from a DS1204 electronic key 99KEYDQ I/O Transmits serial data between the TNT4882 and a DS1204 key 100KEYRSTN O Resets a DS1204 key 4,8,13,25,27,35,37GND _Ground pins – 0 V 41,45,48,54,56,57,59,61,65,68,72,75,78,83,86,90,93,9712,24,36,40,58,VDD _Power pins – +5 V (±5%)60,69,87,94D I O 6N G N D I O C S 16N D I O 8NG N D I F C N D I O 5NS R Q NG N D D I O 7N A T N N R E N NG N D R E S E T G N D DATA5DATA4GND AEN_N VDD GND DATA0INTR DACKN DRQ ADDR9DAVNGNDVDDGNDDIO2NDIO3NVDDXTAL1EOINI O W N G N D V D D S W 7S W 6N C D 15_8_O E N A D D R 4A D D R 3A D D R 2A D D R 1A D D R 0B H E N _N A D D R 5G N D A D D R 6A D D R 7A D D R 8GNDXTAL0GNDKEYDQKEYRSTN DATA3DATA2DATA1GND VDD IOCHRDY V D D D A T A 10G N D D A T A 11D A T A 12D A T A 13G N D D A T A 14D A T A 15D 7_0_O E N D A T A 9D A T A 8V D D G N D GND DATA6DATA7I O R N S E N S E _8_16N G N D V D D V D D V D D G N D V D D S W 5N C M O D E S W 9S W 8GNDNRFDNNDACNISA Pin Conﬁguration Figure 4. TNT4882 ISA Pin ConﬁgurationTable continued from page 3TNT4882 Single-Chip IEEE 488.2 Talker/Listener ASICNational Instruments Phone: (512) 794-0100 • Fax: (512) 683-9300 • info@ • 5ISA Pin DescriptionAll input (I) and bidirectional (I/O) pins have an internal pull-up resistor between 50 kΩand 150 kΩ. Pins with names that end in “N” are active low signals – all others are active high. Open-collector outputs are type “OC.”Note: You can also see the “Hardware Considerations” chapter of the “TNT Programmer Reference Manual” (P/N 320724-01) for more information.Pin No.(s)Name(s)Type Description1D7_0_OEN O Asserts when DATA7-0 bus is enabled for output – may be left unconnected2,3,5,6,7,9,10,11DATA15-8I/O Upper eight bits of bidirectional three-state data bus for transfer of commands,data, and status between TNT4882 and CPU – can connect directly to the AT bus –DATA15 is the most signiﬁcant bit14BHEN_N I Enables access to upper eight bits of data bus when asserted19-15ADDR4-0I Determines which register will be accessed during an I/O access31,30,29,28,26ADDR9-5I Determines if an I/O address is within the range occupied by the TNT4882 –the chip is selected and an I/O access occurs when ADDR9-5 match SW9-5 andAEN_N is asserted20D15_8_OEN O Asserts when DATA15:8 bus is enabled for output – may be left unconnected21,54NC O Leave unconnected52,51,23,22,55SW9-5I Determines the base address of the TNT488232DRQ O Asserts to request a DMA transfer cycle33DACKN I Enables FIFO accesses during a DMA transfer cycle34INTR O Asserts when one or more of the unmasked interrupt conditions becomes true37AEN_N I Enables I/O accesses to the TNT488238IOCHRDY OC When the TNT4882 is not accessed, this open-collector signal is not driven, and apull-up resistor on the system board keeps it pulled high – at the start of someTNT4882 accesses, the TNT4882 may drive it low, then pull it high again during thecycle to indicate that the TNT4882 is ready for the CPU to end that cycle50,49,47,46,44,DATA7-0I/O Lower eight bits of bidirectional three-state data bus for transfer of commands, data, 43,42,39and status between TNT4882 and CPU – can connect directly to the AT bus – DATA7is the most signiﬁcant bit53MODE I Forces the TNT4882 to 7210 (high) or 9914 (low) emulation mode on a hardwarereset – may be left unconnected62SENSE_8_16N I Pull this pin low to tell the TNT4882 that it is connected to a 16-bit bus – leave itunconnected if the TNT4882 is connected to an 8-bit bus63IORN I Drives the contents of the register selected by ADDR4-0 on the data bus when theTNT4882 is selected64IOWN I The value on the data bus is latched into the register selected by ADDR4-0 on therising edge of IOWN when you select the TNT488266IOCS16N OC Driven low during an access to the upper data bus67RESET I Causes a hardware reset and holds the TNT4882 in its idle state while asserted 71,74,77,80,88,DIO8-1N I/O8-bit bidirectional IEEE 488 data bus89,91,9270,73,76,79,81,RENN, ATNN, SRQN,I/O IEEE 488 control signals82,84,85IFCN, NDACN, NRFDN,DAVN, EOIN95XTAL0O Output of crystal circuit – use only for driving a quartz crystal96XTAL1I Crystal oscillator input – drive with a 40 MHz CMOS input level clock signal98KEYCLKN O Strobes data to or from the DS1204 electronic key99KEYDQ I/O Transmits serial data between the TNT4882 and a DS1204 key100KEYRSTN O Resets a DS1204 key4,8,13,25,27,35,41,GND–Ground pins – 0 V45,48,57,61,65,68,72,75,78,83,86,90,93,9712,24,36,40,56,58,VDD–Power pins – +5 V (±5%)59,60,69,87,94TNT4882Single-Chip IEEE 488.2 Talker/Listener ASIC National InstrumentsPhone: (512) 794-0100 • Fax: (512) 683-9300 • info@ • 6TNT4882 Register MapNotes on Register Map1. For complete register descriptions, see the “TNT4882Programmer Reference Manual” (320724-01)2. Some of the 7210 mode registers, such as the ISR1, havethe same names as some of the 9914 mode registers. The7210 mode registers are NOT the same as their 9914 modecounterparts. Be sure to refer to the appropriate bit map forthe chip emulation mode you are using when programmingthese registers.3. The shaded registers are “paged-in registers.” Paged-inregisters only exist in 9914 mode. Writing to the address of the9914 mode ADSR normally does not access any registers.Writing one of four page-in commands to the AUXCR changesall subsequent writes to that address to that of the corresponding paged-in register . The two readable paged-in registers, the 9914 mode SPSR and ISR2, are both paged in whenever any one of the four writable paged-in registers is paged in. When you write the clear page-in command to the AUXCR, all paged-in registers are paged out again and are no longer accessible.4.There are several unused bytes in the address space of the TNT4882. These addresses are reserved for adding new features to the chip. You should not map any external hardware into these addresses or access them at any time, as this may cause compatibility problems with future versions of the TNT4882.TNT4882 Single-Chip IEEE 488.2 Talker/Listener ASICNational Instruments Phone: (512) 794-0100 • Fax: (512) 683-9300 • info@ • 7zero; leaving them unconnectedcauses those address lines to becompared to one. (Base I/Oaddress 2C0 hex shown.)to be compared to zero;leaving them u nconnectedcauses those address linesto be compared to one. (BaseI/O address 2C0 hex shown.) Figure 5. PC/XT and AT (ISA) Bus to ISA Mode TNT4882Hardware Interfacing – ISA Mode TNT4882TNT4882Single-Chip IEEE 488.2 Talker/Listener ASIC National InstrumentsPhone: (512) 794-0100 • Fax: (512) 683-9300 • info@ • 8SENSE_8_16N BHEN_N ADDR4-0IORN IOWN DATA15-8DATA7-001100001FIFOA FIFOB 001100010FIFOA FIFOB 00XXXX101Read Not Driven 00XXXX110Written Ignored 01XXXX001Not Driven Read 01XXXX010Ignored Written 11XXXX001Not Driven Read 11XXXX010Ignored Written 11XXXX101Not Driven Read 11XXXX110Ignored WrittenISA Pin Conﬁguration Byte Lane TableThis table shows which byte lane accesses the TNT4882 internalregisters during an I/O access when you use the ISA pinconfiguration. All combinations of ADDR4-1, SENSE_8_16N,and BHEN_N not shown in this table are illegal. You should notapply these combinations to the TNT4882 while the chip isselected. The accessed register is determined only by ADDR4-0,not SENSE_8_16N or BHEN_N.TNT4882Single-Chip IEEE 488.2 Talker/Listener ASIC National InstrumentsPhone: (512) 794-0100 • Fax: (512) 683-9300 • info@ • 9Generic Pin Conﬁguration Byte Lane TableThis table shows which byte lanes will access TNT4882 registersduring I/O accesses.Figure 6. Intel CPU to Generic Mode TNT4882Hardware Interfacing – Generic Mode TNT4882ABUSN BBUSN ADDR4-0D15-8D7-00111000FIFOB unused1011000unused FIFOB0011000FIFOA FIFOB01XXXXX*used unused10XXXXX*unused used*Any address except 11000TNT4882Single-Chip IEEE 488.2 Talker/Listener ASIC National InstrumentsPhone: (512) 794-0100 • Fax: (512) 683-9300 • info@ • 10Generic Mode DC CharacteristicsParameterSymbol Min Max Unit Notes Supply voltageV DD 4.75 5.25V Voltage input lowV IL -0.5 0.8V Voltage input highV IH 2.0V CC V Voltage output lowV OL 0.00.4V Voltage output highV OH 2.4V DD V Supply currentI DD 90mA 50 mA, typical Output current lowI OL 24mA V OL = 0.4 V DATA15-0, LADCS, DRQ, INTR, RDY1Output current lowI OL 8mA V OL = 0.4 V BBUS_OEN, ABUS_OEN, TADCS,CPUACC, REM, TRIG, DCAS, CICFIFO_RDYI OL 4mA V OL = 0.4 V Output current lowI OL 2mA V OL = 0.4 V KEYDQ, KEYRSTN, KEYCLKNDIO8-1N, IFCN, SRQN, EOIN, ATNN,I OL 48mA V OL = 0.4 V RENN, DAVN, NRFDN, NDACNOutput current highI OH -12mA V OH =V DD -0.5 V DATA15-0, LADCS, DRQ, INTR, RDY1-24mA V OH = 2.4 V Output current highI OH -4mA V OH = V DD -0.5 V BBUS_OEN, ABUS_OEN, TADCS,CPUACC, REM, TRIG, DCAS-8mA V OH = 2.4 V FIFO_RDYI OH -2mA V OH = V DD -0.5 V -4V OH = 2.4 V Output current highI OH -1mA V OH = V DD -0.5 V KEYDQ, KEYRSTN, KEYCLKN-2mA V OH = 2.4 V DIO8-1N, IFCN, SRQN, EOIN, ATNN,I OH 16mA V OH = 2.4 V RENN, DAVN, NRFDN, NDACNInput leakage current – all pinsI IH±10µA V DD = 5.5 VOutput leakage current – all pins I OZ±10µA V DD = 5.5 V Generic Mode CapacitanceParameterSymbol Min Typ Max Unit Notes Pin capacitanceC 50pF DIO8-1N, RENN, ATNN, IFCN, SRQN, DAVN, EOIN, NDACN, NRFDNPin capacitance all other pins C 3.6pF Generic Mode AC CharacteristicsCommercial Industrial ParameterSymbol Min Max Min Max Unit Address setup to RDN = 0, WRN = 0t AS 2427ns Data delay from RDN = 0, CSN = 0 (one-chip mode access)t RD 7178ns Data ﬂoat from RDN = 1t DF 4044ns RDN pulsewidth (I/0 access)t RW 7178ns RDN recovery widtht RR 4044ns Address hold from RDN = 1, WRN = 1t AH 00ns DRQ unassertiont DU 7886ns Data delay from RDN = 0, DACKN = 0t DR 4044ns Data setup to WRN = 1t WS 1416ns Data hold from WRN = 1t WH 00ns CSN setup to RDN or WRNt CS 00ns CSN hold from RDN or WRNt CH 00ns DACKN setup to RDN or WRNt DS 00ns DACKN hold from RDN or WRNt DH 00ns RDN or WRN to CPUACC (two-chip mode NAT4882 access only)t CPU 2629ns RDN or WRN to RDY1 assertt ARDY Two-chip mode NAT4882 access1010clock periods Other accesses2528ns RDN or WRN to RDY1 unassertt URDY 2225ns WRN pulse width (DMA access)t WP4044ns RDN pulse width (DMA access)t RP4044nsNational InstrumentsPhone: (512) 794-0100 • Fax: (512) 683-9300 • info@ • 11Figure 8. DMA ReadFigure 7. CPU ReadFigure 9. CPU WriteGeneric Mode AC Characteristics WaveformsWaveforms continued on page 12DATAWRNCSNABUSN,BBUSN, ADDR4-0RDY1CPUACC †††† CPUACC asserts during two-chip modeNAT4882 accesses onlyDRQ DACKNRDN DATA15-0RDY1ABUSN, BBUSN,ADDR4-0CSNRDNDATARDY1CPUACC ††††NAT4882 accesses onlyNational InstrumentsPhone: (512) 794-0100 • Fax: (512) 683-9300 • info@ • 12WRNDRQ DACKN DATA15-0Figure 10. DMA WriteWaveforms continued from page 11ISA Mode DC CharacteristicsParameterSymbolMin Max UnitNotesSupply voltage V DD 4.75 5.25V Voltage input low V IL -0.5 0.8V Voltage input high V IH 2.0V CC V Voltage output low V OL 0.00.4V Voltage output high V OH 2.4V DD V Supply current I DD 90mA 50 mA, typical Output current low I OL24mAV OL = 0.4 VDATA15-0DRQ, INTR, IOCS16, IOCHRDY Output current low I OL 16mA V OL = 0.4 V D7_0_OENOutput current lowI OL 8mA V OL = 0.4 V D15_8_OEN, TP_INTWTN Output current lowI OL2mAV OL = 0.4 VKEYDQ, KEYRSTN, KEYCLKN Output current lowDIO8-1N, RENN, ATNN, IFCN, SRQN,I OL 48mA V OL = 0.4 V DAVN, EOIN, NDACN, NRFDN Output current high I OH-12mA V OH = V DD -0.5 V DATA15-0DRQ, INTR-24mA V OH = 2.4 V Output current high I OH-8mA V OH = V DD -0.5 V D7_0_OEN-16mA V OH = 2.4 V Output current high I OH-4mA V OH = V DD -0.5 V D15_8_OEN,TP_INTWTN-8mA V OH = 2.4 V Output current high I OH-1mA V OH = V DD -0.5 V KEYDQ, KEYRSTN,KEYCLKN-2mA V OH = 2.4 V Output current highDIO8-1N, RENN, ATNN, IFCN, SRQN,I OH -16mA V OH = 2.4 V DAVN, EOIN, NDACN, NRFDN Input leakage current – all pins I IH ±10mA V DD = 5.5 V Output leakage current – all pinsI OZ±10mAV DD = 5.5 VNational InstrumentsPhone: (512) 794-0100 • Fax: (512) 683-9300 • info@ • 13Figure 11. I/O Read Access Waveforms continued on page 14ISA Mode CapacitanceParameterSymbolMin TypMax UnitNotesPin capacitanceC3.6pFDATA15-0, DRQ, INTR, IOCS16N, IOCHRDY, ADDR6Pin capacitanceC 3.0pFD7_0_OEN, D15_8_OEN, TP_INTWTN,KEYDQ, KEYRSTN, KEYCLKN, ADDR4, ADDR8, ADDR9Pin capacitanceC 3.5pFBHEN_N, ADDR3-0, ADDR5, ADDR7, DACKN, AEN_N, MODE, TESTMODE,PWBSEL2-0, SW9, SENSE_8_16N,IORN, IOWN, RESET Pin capacitanceC 50pFDIO8-1N, RENN, ATNN, IFCN, SRQN,DAVN, EOIN, NDACN, NRFDNParameterSymbol Min MaxUnit NotesADDR9-0 setup to IORN, IOWN t AS30ns ADDR9-0 hold from IORN, IOWN t AH 0ns DACKN setup to IORN, IOWN t DS 0ns DACKN hold from IORN, IOWN t DH 20ns Data setup time to IOWN rising t SU 22ns Data hold time from IOWN rising t WH 0ns IORN low pulse width t RPWL 100ns IORN high pulse width t RPWH 42ns IOWN low pulse width t WPWL 100ns IOWN high pulse widtht WPWH 100ns IORN or IOWN held from IOCHRDY t TD 20ns DRQ unassertion time t DU 73ns Due to FIFO full/empty DRQ unassertion timet DU 48ns Due to byte count reachedData access time from IORN falling, DMA t DACC 80ns Data access time from IORN falling, I/O t ACC 80ns Data hold time from IORN rising t RH 0ns Data ﬂoat time from IORN rising t DF 30ns IOCS16N assertion after valid address t DEC 30ns IOCS16N negation after invalid address t DECN 20ns IOCHRDY negation from IORN or IOWN t RDYN 40ns IOCHRDY release after IORN or IOWNt RDY350nsISA Mode AC CharacteristicsADDR9-0, AEN_NIORN DATA15-0IOCS16N IOCHRDYNational InstrumentsPhone: (512) 794-0100 • Fax: (512) 683-9300 • info@ • 14Waveforms continued from page 13Figure 13. DMA Read AccessFigure 14. DMA Write AccessFigure 12. I/O Write AccessADDR9-0, AEN_NIOWN DATA15-0IOCS16N IOCHRDYIORN DRQDACKNDATA15-0IOWN DRQ DACKNDATA15-0National InstrumentsPhone: (512) 794-0100 • Fax: (512) 683-9300 • info@ • 15Figure 16. Mechanical DataFigure 17. Recommended Land Pattern (not to scale)Absolute Maximum RatingsProperty RangeUnitsSupply voltage, V DD - 0.5 to + 7.0 V Input voltage, V IN- 0.5 to V CC + 0.5V Output voltage, V OUT- 0.5 to V CC + 0.5V Storage temperature, T STG- 55 to 150˚ CFRONT VIEW SIDE VIEWPIN 1PIN 300.650.22 (MIN)0.38 (MAX)17.90 ± 3.40 (MAX.)2.80 ±0.250.23 ±0.13SEE DETAIL A0°0.80 ±0.15NOTES:1. All dimensions are shown in millimeters.2. Unless otherwise specified, all dimensions are nominal.3. When converting from millimeters to inches, four significant digits to the right of the decimal point are necessary.Technical SupportNational Instruments strives to provide you with quality technical assistance worldwide. We currently offer electronic technical support along with our technical support centers staffed by Applications Engineers.Access information from our Web site at Our FTP site is dedicated to 24-hour support, with a collection of ﬁles and documents to answer your questions. Log on to our Internet host at You can fax questions to our Applications Engineers anytime at (800) 328-2203 or (512) 683-5678. Or , you can call from 8:00 a.m. to 6:00 p.m. (central time) at (512) 795-8248.Internationally, contact your local ofﬁce. National Instruments sponsors a wide variety of group activities, such as user group meetings at trade shows and at large industrial sites. Our users also receive our quarterly Instrumentation Newsletter with the latest information on new products, product updates, application tips,and current events. In addition, sign up for NI News , our electronic news service at /newsWarrantyAll National Instruments data acquisition, computer-based instrument, VXIbus, and MXIbus products are covered by a one-year warranty. GPIB hardware products are covered by a two-year warranty from the date of shipment. The warranty covers board failures, components, cables, connectors, and switches, but does not cover faults caused by misuse. The owner may return a failed assembly to National Instruments for repair during the warranty period. Extended warranties are available at an additional charge.Information furnished by National Instruments is believed to be accurate and reliable. National Instruments reserves the right to change product speciﬁcations without notice.Seminars/TrainingFree and fee-paid seminars are presented several times a year in cities around the world. Comprehensive, fee-paid training courses are available at National Instruments offices or at customer sites. Call for training schedules.For More InformationContact National Instruments for Application Notes such as:”Using the TNT4882 in a MC68340 System“”Factors to Consider When Clocking the TNT4882 at Frequencies Less than 40 MHz“”Porting a 9914 GPIB Design to Use the TNT4882“Ordering InformationTNT4882-BQTNT4882 Developer Kit..........................................776866-01Includes 2 TNT4882 ASICs, PC AT evaluation board, ESP-488TL source code software, and documentation.TNT4882 Programmer Reference Manual..............320724-01Part Number Legenda.Family name TNT = Single-chip, high-speed, GPIB Talker/Listener interfaceb.Device-number 4882 = IEEE 488.2 compatiblec.Reservedd.Revisione.Package type Q = Quad ﬂat packU.S. Corporate Headquarters Fax (512) 683-9300 • info@Branch Ofﬁces: Australia 03 9879 5166 • Austria 0662 45 79 90 0 • Belgium 02 757 00 20 • Brazil 000 811 781 0559• Canada 905 785 0085China 86 21 6555 7838 • Denmark 45 76 26 00 • Finland 09 725 725 11 • France 01 48 14 24 24 • Germany 089 741 31 30 • Hong Kong 2645 3186India 91805275406• Israel 03 6120092 • Italy 02 413091 • Japan 03 5472 2970 • Korea 02 596 7456 • Mexico 001 800 010 0793Netherlands 0348 433466 • New Zealand 09 914 0488• Norway 32 27 73 00 • Singapore 2265886 • Spain 91 640 0085 • Sweden 08 587 895 00Switzerland 056 200 51 51 • Taiwan 02 2377 1200 • U.K . 01635 523545© Copyright 1999 National Instruments Corporation. All rights reserved. Product and company names listed are trademarks or trade names of their respective companies.0305599(512) 794-0100*000000A-01*340570D-01。

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印刷专业英语(常用词语中英文对照表)2 wire stitching 骑马钉 board book dinding 板纸书(合板)3 edges golden gilt 三面烫金边 book block 毛书Accordion 风琴式折页 both(2/s)side art paper 双粉纸acid-free and lignin free paper 无酸及不变色纸both side 双面acid-free paper 无酸纸 both side art card 双粉咭(C2S) adhesive binding 胶装/无线胶装both side art paper 双粉纸(C2S)adhesive tape double 双面胶纸bound volume/bound edition 合订书/合订本adhesive tape single 单面胶纸 box 盒advance copies 新书样本/船头版 Brazil 巴西after-press 印后 Brochure/booklet/pamphlet/handbook 小册子air freinght/airlift/air-express/air-ferry 空运 brown wrapping/kraft/vellum 牛皮纸Album 相簿 building in 压线/压衬Arlin 布纹纸/书皮纸 bulk 大货/厚度arlin paper 书皮纸 bunting 旗布art board 粉咭 calendering 磨光art paper 粉纸 calender varnishing 磨光Artwork 书稿 carbonless paper 兔炭纸Assembly 执件 card 咭Austria 奥地利 card board 咭纸Austrian 奥地利的 card box 咭盒auto-lock 自动扣底 carton 纸箱/坑箱/卡通纸back board(card) 背板(咭) cartridge paper 图画纸Backbone 书脊 case bound/edition binding 精装bamboo spine 竹节脊case bound book/hardpaper/hardcover 精装书Bellyband 腰带B-flute 坑纸/粗坑纸 case making 做皮壳1 ply B9 corrugated board B9单层坑纸Binding 装订 case(PLC) 硬皮壳binding board 灰板/板纸 casing in 上皮壳Black 黑色 cassette tape 录音带blind blocking 击凹 cast coated card 玻璃粉咭Blister 吸塑 cast coated paper 玻璃粉纸blister card 吸塑咭/商品吊售卡 catalog 目录册blister pack 吸塑罩 center sewn 车中线blister varnishing 吸塑油center sewn in two section 车中线手反两贴Block 书芯 chipboard 粗纸板blocking 烫金﹑烫色﹑模压 chrome coated board 玻璃纸bluelies 蓝粉/蓝纸 CIF 到岸价blueprints 蓝粉/蓝纸 clamshell blister 贝壳胶盒,像贝壳一样可以对扣的胶盒Blues 蓝粉/蓝纸 clay coated news back 粉灰咭(CCNB) Board 咭纸 clay coated white back 灰心白底(CCWB) Board book 板纸书 clear 透明Client 客户 die-cutting 模切/啤Cloth 布 direct mailing 邮递直销display box 展示盒/陈列盒coated art kraft board 粉面牛咭 document 文件coated duplex board 粉灰咭 double wall carton 双坑箱double-side tap 双面胶coated one side 单粉(C1S) doulbling 双钩coated paper 铜版纸 drawn on cover 反封面coated two side 双粉(C2S) drill hole/bore 钻孔collate 排 dummy 白样(生产前的样本)collate card 执咭 duotone 双色调collating 执张/配页 duplex board 粉灰咭colour filter 滤色片 E-flute E-坑纸colour proof 色稿 elastic band(round/flat) 橡根带colour separation 电子分色(分色/电分) Electro-static Printing 静电印刷colour woodfree 色书纸electro-static vinyl paper 静电纸components 黏配件 embossing 击凹凸/压纹concealed wire-o 隐藏式wire-o embossing die 击凹凸模concertina fold 风琴式折页 endpaper 衬纸concertina bound 风琴折装钉﹐如果用于板纸书指内文对裱conference room 会议室 end-papering 贴衬纸confirmed sample 已签署的样本endpaper pasted down on cover 封面裱衬纸(扫衬)conqueror paper 刚古纸endpaper paste on 贴衬content 内容/目录/内文 ends 前后衬纸/封里纸copy/copies 本 envelope 信封corner gluing(4 corners) 粘角(四角) envelope making 做信封correst grain 跟纹/顺纹 export 出口corrugated E-flute box 坑盒 exported carton 出口纸箱corrugated paper 瓦楞纸/坑纸 eyelet 鸡眼courier 速递 fancy paper 花纹纸cover 封面 feather 毛绒cover drawn on 反封面 Figure/iconograph/illustration 图表/插图covering 反封面/上封面 film 菲林creasing 啤折线/压折痕 Finland 芬兰Cross grain 不顺纹 Finnish 芬兰的fix(affix)accessories 黏配件customer service deparment 客户服务部 flap 旗/翼仔cut flush 切正三边(封面及内文的三边一起切齐) flat 平的cutting 切纸 flexible binding 假精装Cyan 青蓝 flexible magnetic rubber 胶磁debossing 击凹 flock paper 植毛(纸)delivery note 送货单 flow chart 流程图Diary/daybook 日记簿 fluorescent 荧光墨/发荧光的die cut 啤 flyeaf 衬纸/封里纸die-cut mould 啤板 Foam/sponge 海绵die-cutter 啤机/模切机 FOB 离岸价dividers 烟的士foil stamping 烫色 hickey 墨屎folded and gathered 已折和已排但未装订的书(F&G) high bulk paper 高容积纸/特厚纸folder 档案夹 high closs varnish 特光folding 折/折书/折页 hinge 书链folding box 折盒 Holland 荷兰Folio 页码 hologram paper(card) 激光纸(咭)fore edge 书口/前切线 hologram stamping 激光烫format 格式 horizontal 横度freight 运费 hot melt 热溶胶french fold jacket/ slipcase 法式书套 hot seal 热压/热封口Fur 皮革 hot stamping 热烫/烫色gate fold 拉页H/T band(head and rail bands/headband) 笃(绳)头布(H.T)gatering 排书/配页 illustrations 插图gathering 排书/配书 image 影像ghosting 鬼影 imitation gold 仿金gift box 礼盒 imposition 拼版glassine paper 白腊纸 Impression 印数/印张/压印Gloss(y) art(paper) 光粉纸(G/A) imprint 版权页Glue/gluewater/gumwater 胶水 indent 订货gluing 涂胶 index 索引gold blocking 烫金 indexing 索引裁切/打烟的士gold paper(card) 金纸(咭) Indonesia 印尼gold stamping 金烫/烫金 Indonesian 印尼的Grain direction 丝缕方向/纸纹方向 information 讯息grams per square metre 克/平方米(GSM) Insert / inset /foldout 插页gravure Printing 滚筒式印刷/凹版印刷 inset 套贴Green 绿色 interleaves 内隔页greyboard 双灰international standard book number 国际标准书籍号码(ISBN)grey board 版纸 ivory board 通咭gripper 牙口 ivory card 白通纸grommet 鸡眼 jacket 书套/护封/封套/书衣Gross weight 毛重 jacketting 上书套/上护封guillotine 切纸机 Japan 日本half title page 半书名页或/部首专页 Japanese 日本的half-tone 半色调 job number 工程编号hollow back 通脊 joint 书脊槽hardback 精装 kiss cut 啤半穿hard back 精装书 Korean 韩国的hard bound 精装/精装书 kraft card 牛皮咭hard cover 精装Head margin 书的天头 kraft wrap 包头heat-seal calender varnish 磨光吸塑 label 标签heat-sealed coating 吸塑油laminated indexing(index lamination) 透明胶索引height 高 laminating 过胶/压塑料膜lamination 过胶(PP胶) mechanical matt 充哑粉纸landscape 横度书/横式书页/横度 mechanical paper 充粉纸Leaf 张页(2PP) mechanical printing paper 充书纸leaflet 小折张/单张/折页 memo pad /blotter 记事簿leaves 对页 metal color 金属墨length 长 metallic 金属的lettershop 人封邮寄服务/人信 metal plate 铁片Lid 盒盖 millboard 版纸library bound 图书式装订(一般指分衬加白杨布﹑车侧线后上壳的装订) mirror 镜missing 缺页lid and base box 天地盒 misting 溅墨light weight coated paper 轻粉纸/充粉纸(LWC) mix grain 内文中用混合纸纹limited edition 珍藏本/有限印本 mould 模Limp bound 平装/串线胶装 mounting 对裱line copy 线条稿(无半色调) mount(pasted) 裱纸line drawing 线书稿(无半色调) moveable 可移line per inch 每英寸线数(LPI) muli-joints gluing 驳盒lining 裱纸/裱背/皮壳贴被纸 multi-colour 多色Lithography /offset 平版印刷朮 NCR paper 药水纸Lock 锁 negative 负片/阴片lock-bottom 扣底 net weight /suttle 净重Logo 商标 newspaper 报纸Long 长纹(L) newsprint 新闻纸/白报纸Long grain 纸长纹 nipping 压印线/书贴压紧Loop 环圈 non-moveable 不可移machine 机器 notch binding 胶装machine finish 加光(M.F.) notch bound 通气胶装(NB) machine varnishing 机过油(光/哑) oblong 横度书/长开本magazine /journul 杂志 odd size 怪度/不平常尺寸magenta 品红/洋红 Offset Printing 柯式印刷magnet 磁石 one side 单面Mail card 邮寄咭 one side art card 单粉咭(C1S) mailing carton 邮寄盒one side greyboard white back 灰芯单粉咭maissing leaf 缺页on-line press varnishing 印油(glossy/matt)(光/哑)makeready sheet 校版纸 opacity 不透明度Open Wire-O 开放式YO书﹐即没有脊位make-up(montage) 拼版/整版 orange 橙色Manual/enchiridion 手册 order form 订购表manual gluing 手粘盒 original 原稿margin 书边白位 origination 印前match box(2) 火柴盒 others 其它Matt art card 哑粉咭 out of register 套印不准Matt art paper 哑粉纸(M/A) overlap cover(gate fold cover) 翼仔封面maximum 最大 over print 加印在其上/迭印mechanical art paper 充粉纸 ozalid 蓝纸/蓝粉packaging 包装 punch 冲packging box 包装盒/彩盒 punch board 打孔padded foam board 海绵板纸 punch to shape 冲型状Page 页数 PVC box PVC 胶盒Page number 页码 PVC window 透明胶片窗口pages(page to view) 页数 quarter bound 双封面pallet 卡板 raw material 原材料Pane l版屏/办/栏 ream 令paper back 平装书 reception 大堂(写字楼正门口) parchment 羊皮纸 recto 右边的书页(一般页码是单数) pasting end 扫衬 recycle paper 再造纸perfect binding 罗/刨/磨脊胶装/无线装订 register 套准/定位/规位perfect bound 平装/胶装﹐特指磨脊胶装register mark 十字位perforation 针线/打排孔 registration 套准/定位/规位photo bag 相袋 registration mark 套准记号/十字位photocopy 影印 reprint 重印PH value 酸缄度 revise 校订/修正PIX 图案 ribbon marker/ riband 丝带plastic 塑料 right reading 正读plastic comb binding 塑料夹活页装订 rigid box 浆糊盒plastic magnet 胶磁 ring binder 铁环(圈)/活页册plastic mirror 胶镜 ring binding 铁环装plastic spiral 胶线圈 rivet 窝锭Plate 印板 roll 卷Plate making 制版 round and backing 圆脊playing card varnishing 啤牌油 round back 圆脊PMS color(pantone)PMS 专色 round corner 圆角pocket 袋 rounding and backing 圆脊polybag 胶袋polybag self-adhesive 自贴胶袋 running sheet 印张polybag zip lock 密实胶袋 saddle stitching 骑马钉pop-ups 立体 sales department 营业部pop-ups book 立体书 same size 同尺寸(S/S)portrait 正度书/直度 Sample/swatch 样本poster 海报/单张广告 sample room 样办室/展览室pre-press 印前 sand paper 沙纸press 印刷﹑印刷机press varnishing 印油(glossy/matt)(光/哑) schedule 工艺流程printed ink 油墨 scoring 啤线/压线/啤折线/压折痕printed sheet 印张 scratching 刮花/拖花printing press/imprinter 印刷机 screen 网屏process 四色墨 screws 螺丝process colour 四原色 scuffing 擦痕(印件)pull and push 推拉书 scumming 弄脏/糊版(印件) section 组数/贴 special colours 专色section sewn 穿线 specimen 样本self-cover 自封 spine 书脊self ends 自衬 spiral 铁线圈Semi-gloss 半光亮 speral binding 螺旋装订set off 过底/背面粘脏 spitting 溅墨sewing 串线/缝线/线钉 split ends 分衬shade 色辉/色泽 spoilage 损坏/废品sharp 清晰的 sponge 海綿sheet 一张纸 spot varnish(gloss/matt) 印油(光/哑) sheet-fed 平张印刷/平张给纸 spreads 对页sheet fed press 平张印刷机 special color 专色sheet per hour 每小时印张数(S.P.H.) spiral binding 螺旋装订sheetwise(sheetwork) 正反 spiral bound 螺旋装(蛇装) short 短纹(S) spitting 溅墨shrink wrapped(individual/assort per pack) 收缩包装(独立/每包) spot UV varnishing(glossy/matt) 局部UV油(光/哑)side saddle stitching 侧钉spot varnish(glossy/matt) 印油(光/哑)side sewn 车侧线 spot varnishing(glossy/matt) 局部印油side stitching 平钉 square back 方脊/平脊signature 组数/贴 stamping 烫signaturing 齐贴 staples 装订用铁丝钉silk-screen 丝网 stapling 钉盒/铁线平订Silk-screen Printing 丝网印刷 step indexing 打索引/打梯级silk screening 丝印 sticker 胶贴纸/贴纸silk screen pvc sheet 丝印PVC胶片 stiffener 加固板(E-flute)silver paper(card) 银纸(咭) Stock 仓存silver stamping 银烫/烫银 String 绳singer sewn 车中线 stripping 拼版single-coated paper 单面粉纸 substance 克重/基重Size 尺寸 Sweden 瑞典sketch 草图/简图 Swedish 瑞典的slip case 书套盒/书盒 synthetic(yupo)paper 合成纸Slur 重影 tacky 发粘的/粘性的smashing 压书/书贴压紧 tab 检索(咭)smear 油渍/背面弄脏 tacky 发粘的/粘性的smoothness 平滑度 tail edge 地脚smudge 粘脏/污点 text 内文smyth sewn 穿线 The Netherlands 荷兰Soft cover 平装 thickness 厚度Soft PVC 软胶 thread sewn 穿线solid 实地/满地 three-knife trimmer 三面刀trim width portrait 直度solid bleached sulphate 单粉咭(C1S)(SBS) thumb edge 书口South Korea 韩国 thumb index 指按式索引spacer 隔纸 tight(fixed) back 死脊Tint 淡调 wafer seal 透明胶贴纸tints 平网 wastage 损耗tipping 贴 water-based varnishing 过水油(过水溶性光油)tipping in 粘单张/套粘 water-base varnishing 水油tone 色调 waterproof(gloss/matt) 防水(光/哑)top edge 天头 wax paper 腊油纸tracing paper 牛油纸 web-fed 卷筒给纸trade mark 商标 web press 轮转印刷机transparency 透明原稿 web print 滚筒Tray box 地盒 white 白Trim 切正/切齐 whiteness 白度trimming 裁切 width 宽triple wall carton 三坑箱 windowing 粘窗/贴窗Turn around 一周 wire-o 双线圈typesetting 排字 wire-o binding 双线圈钉装/WIRE-O 钉装U.K. 英国 wire-o bound 双线圈装uncut pages 未切之页 wire-stitching 铁线平订underrun 印数不足 with the grain 跟纹/顺纹unprinted page 白页 work and tumble 牙口反/天地轮转unprinted leaf 白页 workshop 工场upright 正度书/直式 work&turn 自反/左右轮转U.S.A 美国 woodfree 道林纸/书纸(W/F)UV varnishing 过UV油/紫外光固化油 wrap 包页vacuum packing 真空包装 wrinkles 印张的皱纹Varninshing 上光油 writing pad 写字簿Velcro 魔朮贴 yellow 黄色Vender 供货商 yupo paper 合成纸Verso 左边的书页(一般页码是双数) yuppo paper 胶底纸video tape 录像带 zine 锌Volume 册 zine plate 锌版v-shape die-cutting 啤V位 zip lock bag 密实胶袋Colour Density 颜色密度raster 光柵Fitting 试箱Paperback 平装书Hardback精装书Adjunct 辅料﹐配件﹐附属物Bead 小珠子,珠子Bow or bowknot 蝴蝶結。

高亮度三色PLCC6黑底LED数据表说明书

ASMT-YTC2-0AA02High Brightness Tricolor PLCC6 Black Body LEDData SheetDescriptionThe high brightness black top surface tri-color PLCC-6 family of SMT LEDs has a separate heat path for each LED dice, enabling the LED to be driven at higher current. These SMT LEDs are in the high brightness category, are high reliability devices, are high performance and are designed for a wide range of environmental condi-tions. By integrating the black top surface Avago devices deliver better contrast enhancement for your applica-tion. They also provide super wide viewing angle at 120° with the built in reflector pushing up the intensity of the light output. The high reliability characteristics and other features make the black top surface tri-color PLCC-6 family ideally suitable for exterior and interior full color signs ap-plication conditions.For easy pick & place, the LEDs are shipped in EIA-com-pliant tape and reel. Every reel is shipped from a single intensity and color bin; except red color providing betteruniformity. These tri-color LEDs are compatible with reflow soldering process.Featuresx Industry Standard PLCC-6 package (Plastic Leaded Chip Carrier) with individual addressable pin-out for higher flexibility of driving configuration x High reliability LED package with silicone encapsulation x High brightness using AlInGaP and InGaN dice technologies x Wide viewing angle at 120qx Compatible with reflow soldering process x JEDEC MSL 2ax Water-Resistance (IPX6*) per IEC 60529:2001* The test is conducted on component level by mounting the components on PCB with proper potting to protect the leads. It is strongly recommended that customers perform necessary tests on the components for their final application.Applications x Indoor full color display CAUTION: LEDs are Class 1C ESD sensitive. Please observe appropriate precautions during han-dling and processing. Please refer to Avago Application Note AN-1142 for additional details.Table 1. Device Selection GuidePart NumberColor 1 - AlInGaP Red Color 2 - InGaN Green Color 3 - InGaN Blue Min. Iv @20mATyp. Iv @ 20mA Max Iv @ 20mA Min. Iv @ 20mA Typ. Iv @ 20mA Max Iv @ 20mA Min. Iv @ 20mA Typ. Iv @ 20mA Max Iv @ 20mA Bin ID (mcd)(mcd)(mcd)Bin ID (mcd)(mcd)(mcd)Bin ID (mcd)(mcd)(mcd)ASMT-YTC2-0AA02T2355450715U1450560900R2140180285Notes:1. The luminous intensity I V , is measured at the mechanical axis of the LED package and it is tested in pulsing condition. The actual peak of the spatial radiation pattern may not be aligned with this axis.2. Tolerance = ± 12%Part Numbering SystemPackaging Option Color Bin Selection Intensity Bin Limit Intensity Bin SelectionDevice Specification Configuration Package Type C: Black Body Tricolor ColorT: TricolorProduce FamilyY: Silicone Based PLCC6Notes:1. All Dimensions are in millimeters2. Tolerance = ±0.2 mm unless otherwise specified3. Terminal Finish: Ag plating4. Encapsulantion material: silicone resin (Full Black Body)Lead Configuration1Cathode Blue 2Cathode Green 3Cathode Red 4Anode Red 5Anode Green 6AnodeBluePackage Dimensions10.534256Table 2. Absolute Maximum Ratings (T A = 25°C)Parameter Red Green & Blue Unit DC forward current [1] 5030mA Peak forward current [2]100100mA Power dissipation125114mW Reverse voltage4V[3]V Maximum junction temperature T j max125°C Operating temperature range -40 to + 110[4]°C Storage temperature range-40 to + 120°C Notes:1. Derate linearly as shown in Figure 4a & 4b.2. Duty Factor = 10% Frequency = 1KHz3. Driving the LED in reverse bias condition is suitable for short term only4. Refer to Figure 4a and figure 4b for more informationTable 3. Optical Characteristics (T A = 25°C)ColorDominant Wavelength,O d (nm) [1]Peak Wavelength,O p (nm)Viewing Angle2T½[2] (Degrees)Luminous EfficacyK V[3] (lm/W)Luminous EfficiencyK e (lm/W) Min Typ.Max Typ.Typ.Typ.Typ.Red61862262862912021022Green525530 53752112053525Blue465470477464120845Notes:1. The dominant wavelength is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.2. T½ is the off axis angle where the luminous intensity is ½ the peak intensity3. Radiant intensity, Ie in watts / steradian, may be calculated from the equation Ie = I V / K V, where I V is the luminous intensity in candelas and K V isthe luminous efficacy in lumens / watt.4. )V is the total luminous flux output as measured with an integrating sphere at mono pulse condition.Table 4. Electrical Characteristics (T A = 25°C)ColorForward Voltage,V F (V) [1]Reverse VoltageV R @ 100P AReverse VoltageV R @ 10P AThermal ResistanceR T J-P (°C/W) [2] Min Typ.Max.Min.Min.TypRed 1.80 2.10 2.504–280 Green2.80 3.20 3.80–4180 Blue 2.80 3.20 3.80–4180 Notes:1. Tolerance ± 0.1V.2. One chip on thermal resistanceFigure 1. Relative Intensity vs Wavelength Figure 2. Forward Current-mA vs Forward Voltage-VFigure 3. Relative Intensity vs Forward CurrentFigure 4a. Maximum forward current vs. ambient temperature. Derated based on T JMAX = 125°C. (3 chips)Figure 4b. Maximum forward current vs. ambient temperature. Derated based on T JMAX = 125°C. (single chip)0.00.20.40.60.81.0WAVELENGTH - nmR E L A T I V E I N T E N S I T Y 020406080100FORWARD VOLTAGE-VF O R W A R D C U R R E N T -m A0.00.51.01.52.02.53.03.54.04.55.0DC FORWARD CURRENT-mAR E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D A T 20m A )010203040506020406080100120AMBIENT TEMPERATURE (°C)M A X A L L O W A B L E C U R R E N T -m A AlInGaPInGaN 0102030405060020406080100120AMBIENT TEMPERATURE (°C)M A X A L L O W A B L E C U R R E N T - m AAlInGaPInGaNFigure 5a. Radiation Pattern for X axisFigure 5b. Radiation Pattern for Y axisFigure 5c. Component Axis for Radiation PatternsFigure 6. Relative Intensity vs Junction Temperature Figure 7. Forward Voltage vs Junction TemperatureXX YYN O R M A L I Z E D L O P a t T J =25°C0.1110----0.0.F O R W A R D V O L T A G E S H I F T - VT J - J UNC TI ON TE MP E RA T UR E &T J - J UNC TI ON TE MP E RA T UR E &0.00.20.40.60.81.0-90-60-300306090ANGU L AR D I SP L AC E M E N T - D E GR EEN O R M A L I Z E D I N T E N S I T Y00.20.40.60.81ANGU L AR D I SP L AC E M E N T - D E GR EEN O R M A L I Z E D I N T E N S I T YFigure 8b. LED Configuration on land patternFigure 9. Recommended Pick and Place Nozzle TipTI METI MET E M P E R A T U R EFigure 10. Recommended leaded reflow soldering profile.Figure 11. Recommended Pb-free reflow soldering profile.Note: For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN 1060 Surface Mounting SMTLED Indicator ComponentsFigure 8a. Recommended soldering land pattern.I DI D = 1.7mm OD = 3.5mme fl o w l der ing i re cti o nFigure 12. Carrier tape DimensionFigure 13. Reel DimensionWITH DEPRESSION (0.25 mm)4.00P a ck a g e 10+–0.11101Figure 14. Reeling OrientationPackaging Label:(i) Avago Mother Label (Available on MBB bags)(ii) Avago Baby Label (Available on reel)Intensity Bin LimitBin IDMin (mcd)Max (mcd)R2140.0180.0S1180.0224.0S2224.0285.0T1285.0355.0T2355.0450.0U1450.0560.0U2560.0715.0V1715.0900.0Tolerance for each bin limits is ±12%Intensity Bin Selection (X 2, X 3)Individual reel will contain parts from 1 half bin onlyX 2Min Iv Bin (Minimum Intensity Bin)RedGreenBlueAT2U1R2X 3Number of Half Bin from X 2RedGreenBlueA333Color Bin Selection (X 4)Individual reel will contain parts from 1 full bin onlyX 4Color Bin CombinationsRedGreenBlueFulldistributionA,B,CA,B,C,D,EExample indicates color bin information for Green and Blue from label:Note: There will be no red color bin information appear on label as it is not binned and support with full distribution range.B I NC o l or B in f or B lu e C o l or B in f or Gree nCA Int e nsity f or B lu e Int e nsity f or Gree n Int e nsity f or R edExample indicates luminous Intensity information for Red, Green and Blue respectively from label:Packaging Option (X 5)OptionTest CurrentReel Size220mA7 inchColor Bin Limits Red Color Bin TableBin IDMin DomMax DomFullDistribution618628x 0.68730.66960.68660.7052y0.31260.31360.29670.2948Tolerance of each bin limit is ± 1 nmGreen Color Bin TableBin IDMin DomMax DomA 525.0531.0x 0.11420.17990.21380.1625y 0.82620.67830.66090.8012B 528.0534.0x 0.13870.19710.22980.1854y 0.81480.67030.65070.7867C531.0537.0x 0.16250.21380.24540.2077y0.80120.66090.63970.7711Tolerance of each bin limit is ± 1 nmBlue Color Bin TableBin IDMin DomMax DomCorner Point1234A 465.0469.0x 0.13550.17510.1680.127y 0.03990.09860.10940.053B 467.0471.0x 0.13140.17180.16380.122y 0.04590.10340.11670.063C 469.0473.0x 0.12670.1680.15930.116y 0.05340.10940.12550.074D 471.0475.0x 0.12150.16380.15430.1096y 0.06260.11670.13610.0868E473.0477.0x 0.11580.15930.14890.1028y0.07360.12550.14900.1029Tolerance of each bin limit is ± 1 nmFor product information and a complete list of distributors, please go to our web site: Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.Data subject to change. Copyright © 2005-2011 Avago Technologies. All rights reserved. AV02-2589EN - April 13, 2011DISCLAIMER: Avago’s pro ducts and so ftware are no t specifically designed, manufactured o r autho rized fo r sale as parts, co mpo nents o r assemblies fo r the planning, co nstructio n, maintenenace o r direct o peratio n o f a nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use.Handling PrecautionThe encapsulation material of the LED is made of silicone for better product reliability. Since silicone is a soft material, avoid pressing on the silicon or poking the silicon with a sharp object as the product could be damaged and cause premature failure. During assembly handling, the unit should be held by the body only. Please refer to Avago Application Note AN 5288 for additional handling infor-mation and proper procedures.Moisture SensitivityThis product has a Moisture Sensitive Level 2a rating perJEDEC J-STD-020. Refer to Avago Application Note AN5305, Handling o f Mo isture Sensitive Surface Mo unt Devices, for additional details and a review of proper handling procedures.A. Storage before use– An Unopened moisture barrier bag (MBB) can be storedat <40°C/90%RH for 12 months. If the actual shelf life has exceeded 12 months and the humidity Indicator Card (HIC) indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating.– It is recommended that the MBB not be opened prior to assembly (e.g. for IQC).B. Control after opening the MBB– The humidity indicator card (HIC) shall be read immedi-ately upon opening of MBB.– The LEDs must be kept at <30°C/60%RH at all times and all high temperature related processes including soldering, curing or rework need to be completed within 672 hours.C. Control for unfinished reel– Unused LEDs must be stored in a sealed MBB with desiccant or desiccator at <5%RH.D. Control of assembled boards – If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB need to be stored in sealed MBB with desiccant or desiccator at<5%RH to ensure that all LEDs have not exceeded theirfloor life of 672 hours.E. Baking is required if:– The HIC indicator is not BROWN at 10% and is AZURE at 5%.– The LEDs are exposed to condition of >30°C/60% RH atany time.– The Led floor life exceeded 672hrs.The recommended baking condition is: 60±5°C for 20hrs。

4250资料

Regarding the change of names mentioned in the document, such as Mitsubishi Electric and Mitsubishi XX, to Renesas Technology Corp.The semiconductor operations of Hitachi and Mitsubishi Electric were transferred to Renesas Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.) Accordingly, although Mitsubishi Electric, Mitsubishi Electric Corporation, Mitsubishi Semiconductors, and other Mitsubishi brand names are mentioned in the document, these names have in fact all been changed to Renesas Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and corporate statement, no changes whatsoever have been made to the contents of the document, and these changes do not constitute any alteration to the contents of the document itself.Note : Mitsubishi Electric will continue the business operations of high frequency & optical devices and power devices.Renesas Technology Corp.Customer Support Dept.April 1, 2003To all our customers元器件交易网SINGLE-CHIP 4-BIT CMOS MICROCOMPUTERPackage 20P2N-A 20P2N-ARAM size (✕ 4 bits)64 words 64 words*: Shipped after writing (shipped in blank: M34250E2FP)PIN CONFIGURATION (TOP VIEW)ROM (PROM) size(✕ 9 bits)2048 words 2048 wordsV D D 234561191817161520S 0S 1D 3/K D 2/C D 1D 0V SS RESETX IN X OUT CNV SS M34250M2-XXXFPDESCRIPTIONThe 4250 Group is a 4-bit single-chip microcomputer designed with CMOS technology. Its CPU is that of the 720 series using a simple instruction set. The computer is equipped with one 8-bit timer which has a reload register and the interrupt function.The various microcomputers in the 4250 Group include variations of the built-in memory type as shown in the table below.FEATURES•Minimum instruction execution time.............................1.0 µs (at 4.0 MHz system clock frequency, V DD =4.5 V to 5.5 V)•Supply voltage4.5 V to5.5 V (at 4.0 MHz system clock frequency)2.5 V to 5.5 V (at 1.0 MHz system clock frequency)2.2 V to 5.5 V (at 1.0 MHz system clock frequency:only for Mask ROM version)•TimerTimer 1................................8-bit timer with a reload register •Interrupt...................................................................2 sources •CR oscillation circuit (Capacitor and Resistor connected externally)•Logic operation instruction •RAM back-up function•Key-on wakeup function (ports G and S, INT pin)APPLICATIONElectric household appliances, consumer electronics products (mouse, etc.)MITSUBISHI MICROCOMPUTERS4250 Group元器件交易网2R A (64 w o r d s R O (2048 w o r d 720 s e r i e s C P U c o r eM e m e r i p h e r a l f u n c t i o n st s )S y s t e m c l o c k g e n X I N -X R e g i s t e r B (4 b i t s )R e g i s t e r A (4 b i t s )R e g i s t e r D (3 b i t s )R e g i s t e r E (8 b i t s )S t a c k r e g i s t e r (S K ) (4 l e v e l s )I n t e r r u p t s t a c k r e g i s t e r (S D P ) (1 l e v e l )A L U (4 b i t s )3PERFORMANCE OVERVIEWFunction701.0 µs (at 4.0 MHz system clock frequency) (Refer to the electrical characteristics becausethe minimum instruction execution time depends on the supply voltage.)2048 words ! 9 bits 64 words ! 4 bitsFour independent I/O ports; ports D 2 and D 3 are also used as ports C and K, respectively.4-bit I/O port1-bit I/O port; port C is also used as port D 2.1-bit I/O port; port K is also used as port D 3.2-bit I/O port4-bit I/O port; ports G 0 and G 1 are also used as pins INT and T OUT .Interrupt input; INT pin is also used as port G 0.Timer output; T OUT pin is also used as port G 1.8-bit timer with a reload register2 (one for external and one for timer)1 levelCR oscillation circuit (a capacitor and a resistor connected externally)Frequency error: ±17 %(V DD = 5 V ± 10 %, V DD = 3 V ± 10 %, the error of the external capacitor and resistor excluded)4 levelsCMOS silicon gate20-pin plastic molded SOP (20P2N-A)–20 °C to 85 °C2.2 V to 5.5 V (Refer to the electrical characteristics because the supply voltage depends on the system clock frequency.)1.5 mA(at 4.0 MHz system clock frequency, V DD = 5 V, output transistors in the cut-off state)0.1 µA (at room temperature, V DD = 5 V, output transistors in the cut-off state)ParameterNumber of basic instructionsMinimum instruction execution time Memory sizes Input/OutputportsTimer InterruptOscillation circuitSubroutine nesting Device structure PackageOperating temperature range Supply voltage Powerdissipation(typical value)ROMRAMD 0–D 3S 0–S 3C K F 0, F 1G 0–G 3INT T OUTTimer 1Sources NestingActive modeRAM back-up mode M34250M2/E2I/O I/O I/O I/O I/O I/O Input OutputPIN DESCRIPTIONName Power supply GroundCNV SSReset input System clock input System clock output I/O port FI/O port GI/O port SI/O port DI/O port CI/O port KTimer outputInterrupt input Input/Output———InputInputOutputI/OI/OI/OI/OI/OI/OOutputInputFunctionConnected to a plus power supply.Connected to a 0 V power supply.Connect CNV SS to V SS and apply “L” (0V) to CNV SS certainly.Reset pulse input pinI/O pins of the system clock generating circuit. Connect pins X IN and X OUT directly.Then, pull up X IN pin through a resistor and pull down X OUT pin through a capacitor.2-bit I/O port; for input use, set the latch of the specified bit to “1.” The outputstructure is N-channel open-drain.4-bit I/O port. For input use, set the latch of the specified bit to “1.” The outputstructure is N-channel open-drain. Every pin of the ports has a key-on wakeupfunction and a pull-up function. Both functions can be switched by software.Ports G0 and G1 are also used as pins INT and T OUT, respectively.4-bit I/O port. For input use, set the latch of the specified bit to “1.” The outputstructure is N-channel open-drain. Every pin of the ports has a key-on wakeupfunction which can be switched by software. Also, it is used to perform the logicoperation using register A.Each pin of port D has an independent 1-bit wide I/O function. For input use, setthe latch of the specified bit to “1.” The output structure is N-channel open-drain.Ports D2 and D3 are also used as ports C and K, respectively.1-bit I/O port. For input use, set the latch of the specified bit to “1.” The outputstructure is N-channel open-drain. Port C has a pull-up function which can beswitched by software. It is also used as port D2.1-bit I/O port. For input use, set the latch of the specified bit to “1.” The outputstructure is N-channel open-drain. Port K has a pull-up function which can beswitched by software. It is also used as port D3.T OUT pin has the function to output the timer 1 underflow signal divided by 2. It isalso used as port G1.INT pin accepts an external interrupt. It also accepts the input signal to return thesystem from the RAM back-up state. It is also used as port G0.Pin V DDV SS CNV SS RESET X INX OUTF0, F1 G0–G3S0–S3D0–D3 CKT OUT INT4MULTIFUNCTIONPin G0G1D2D3MultifunctionINTT OUTCKMultifunctionG0G1D2D3PinINT (Note 2)T OUT (Note 2)C (Note 2)K (Note 2)Notes 1: Pins except above have just single function.2: The I/O of ports D2, D3 and G0, and the input of port G1 can be used even when ports C and K and pins INT and T OUT are selected.CONNECTIONS OF UNUSED PINSPinF0, F1G0/INT, G1/T OUT G2, G3S0–S3ConnectionConnect to V SS pin.Open or connect to V SS pin. (Note 3)PinD0, D1D2/C, D3/KConnectionConnect to V SS pin.Open or connect to V SS pin. (Note 1)Connect to V SS pin. (Note 2)Notes 1: When pins G0/INT, G1/T OUT, G2 and G3 are connected to V SS pin, turn off their pull-up transistors (Pull-up control register PU0=“!02”) and also invalidate the key-on wakeup functions of pins G1/T OUT, G2 and G3 (Key-on wakeup contorl register K0=“!!0!2”) by software. When the POF instruction is executed while these pins are connected to V SS and the key-on wakeup functions are left valid, the system returns from RAM back-up state by recognizing the return condition immediately after going into the RAM back-up state. When these pins are open, turn on their pull-up transistors (Pull-up control register PU0=“!12”) by software.2: When ports S0–S3 are connected to V SS pin, invalidate the key-on wakeup functions (Key-on wakeup contorl register K0=“!!!02”) by software. When the POF instruction is executed while these pins are connected to V SS and the key-on wakeup functions are left valid, the system returns from RAM back-up state by recognizing the return condition immediately after going into the RAM back-up state.3: When ports D2/C and D3/K are connected to V SS pin, turn off their pull-up transistors (register PU0=“0!2”) by software.When these pins are open, turn on their pull-up transistors (register PU0=“1!2”) by software.(Note when connecting to V SS and V DD)•Connect the unused pins to V SS or V DD at the shortest distance and use the thick wire against noise.56PORT FUNCTIONControl bits 1442Control instructions SD RD SZD CLD SCP RCP SNZCP OKAIAK OSA IAS LGOPOGA IAGOFA IAFControl registers PU0K0LOPU0, K0PU0, K0V1PU0, K0Output structure N-channel open-drainN-channel open-drainN-channel open-drainN-channel open-drainInput/Output I/O (4)I/O (4)I/O (4)I/O (2)RemarkPull-up function (programmable)Logic operation function (programmable)Key-on wakeup functions (programmable)Pull-up functionsKey-on wakeup functions (o n l y p u l l -u p f u n c t i o n i sprogrammable)Pull-up functions (programmable)Key-on wakeup functions (programmable)PinD 0, D 1D 2/C D 3/KS 0–S 3G 0/INTG 1/T OUT G 2, G 3F 0, F 1Port Port DPort SPort GPort FDEFINITION OF CLOCK AND CYCLE•System clockThis is the source clock input to the X IN pin. Connect pins X IN and X OUT directly. Then, pull up X IN pin through a resistor and pull down X OUT pin through a capacitor.•Instruction clockThe instruction clock is a signal derived by dividing the system clock by 4, and is the basic clock for controlling this product.•Machine cycleOne machine cycle is the time required to execute the minimum instruction (one-cycle instruction). The machine cycle is equivalent to the instruction clock cycle.7(3) Port K1-bit I/O port.For input use, set the latch of the specified bit to “1.” The output structure is the N-channel open-drain. The pull-up transistor of port K is turned on when the bit 1 of register PU0is set to “1” by software. Port K is also used as port D 3.Accordingly, when port D 3/K is used as port K, set the port D 3output latch to “1.”(4) Port G (G 0–G 3)4-bit I/O port.For input use, set the latch of the specified bit to “1.” The output structure is the N-channel open-drain. The pull-up transistor of port G is turned on when the bit 0 of register PU0is set to “1” by software. Ports G 0 and G 1 are also used as INT pin and T OUT pin, respectively.Note: “W” represents write enabled.Pull-up control registerPU01PU00Pull-up transistor OFF Pull-up transistor ON Pull-up transistor OFF Pull-up transistor ONPorts C and Kpull-up transistor control bit Ports G 0–G 3pull-up transistor control bitPull-up control register PU0at reset : 002at RAM back-up : state retained 0101WI/O PORT(1) Port D (D 0–D 3)Each pin of port D has an independent 1-bit wide I/O function.Each pin has an output latch. For input/output of ports D 0–D 3,select one of port D with the register Y of data pointer first. For input use, set the latch of the specified bit to “1.” All port D output latches can be set to “1” with the CLD instruction. The output structure is the N-channel open-drain. Ports D 2 and D 3are also used as ports C and K, respectively. Accordingly,when port D 2/C is used as port D 2, set the port C output latch to “1.” When port D 3/K is used as port D 3, set the port K output latch to “1.”(2) Port C1-bit I/O port.Port C output latch can be set to “1” with the SCP instruction.Port C output latch can be cleared to “0” with the RCP instruction. Port C input level can be examined by executing the skip (SNZCP) instruction. For input use, set the latch of the specified bit to “1.” The output structure is the N-channel open-drain. The pull-up transistor of port C is turned on when the bit 1 of register PU0 is set to “1” by software. Port C is also used as port D 2. Accordingly, when port D 2/C is used as port C, set the port D 2 output latch to “1.”8FunctionsXOR operation OR operation AND operation Not availableLogic operation function selection bitsLogic operation selection register LO at reset : 002at RAM back-up : 002LO 10011WLO 00101LO 1LO 0Note: “W” represents write enabled.Logic operation selection register(5) Port F (F 0, F 1)2-bit I/O port.For input use, set the latch of the specified bit to “1.” The output structure is the N-channel open-drain.(6) Port S (S 0–S 3)4-bit I/O port.Port S has the logic operation (LGOP) function. For input (logic operation included) use, set the latch of the specified bit to “1.” The output structure is the N-channel open-drain. When performing the logic operation, select the logic operation function with the logic operation selection register LO. Set the contents of register LO through register A with the TLOA instruction.When the LGOP instruction is executed, the logic operation selected with the register LO is performed between the contents of register A and the contents of port S, and its result is stored in register A.9D TQRegister AAjOFAinstruction Register AAiOSA instructionKey-on wakeup inputIAS instructionLGOP instructionLO RegisterSCP instruction RCP instructionS R Q S R QSkip decision (SZD instruction)D 2/CSkip decision(SNZCP instruction)PU01Pull-up transistorDecoder (Note 1)(Note 3)(Note 2)Pull-up transistorPU01Decoder (Note 1)instructionLogic operator104250 GroupSINGLE-CHIP 4-BIT CMOS MICROCOMPUTER(Note 1)OGA instructionTOGA instructionD TQ IAG instructionRegister AA 1Key-on wakeup PU00G 1/T OUTTimer 1 underflow signal output10V13K011/2Key-on wakeup PU00K01(Note 1)Pull-up transistorPull-up transistor11CY A 3A 0CY SC instruction RC instructionB 3B 2B 1B 0E 7E 6E 5E 4B 3B 2B 1B 0TAB instructionTEAB instructionTABE instructionTBA instruction Register BRegister BRegister E FUNCTION BLOCK OPERATIONS CPU(1) Arithmetic logic unit (ALU)The arithmetic logic unit ALU performs 4-bit arithmetic such as 4-bit data addition, comparison, and bit manipulation.(2) Register A and carry flagRegister A is a 4-bit register used for arithmetic, transfer,exchange, and I/O operation.Carry flag CY is a 1-bit flag that is set to “1” when there is a carry with the AMC instruction (Figure 1).It is unchanged with both A n instruction and AM instruction.The value of A 0 is stored in carry flag CY with the RAR instruction (Figure 2).Carry flag CY can be set to “1” with the SC instruction and cleared to “0” with the RC instruction.(3) Registers B and ERegister B is a 4-bit register used for temporary storage of 4-bit data, and for 8-bit data transfer together with register A.Register E is an 8-bit register. It can be used for 8-bit data transfer with register B used as the high-order 4 bits and register A as the low-order 4 bits (Figure 3).(4) Register DRegister D is a 3-bit register.It is used to store a 7-bit ROM address together with register A and is used as a pointer within the specified page when the TABP p, BLA p, or BMLA p instruction is executed (Figure 4).12by executing the first BM instruction, and the contents of program counter is stored in SK When the BM instruction is executed after four stack registers are used ((SP) = 3), (SP) = 0 and the contents of SK 0 is destroyed.(SP) (SK 0) (PC) Main program 000216 NOPAddress 000016 NOP 000116 BM SUB1(PC) (SP) 3(5) Stack registers (SK s ) and stack pointer (SP)Stack registers (SKs) are used to temporarily store the contents of program counter (PC) just before branching until returning to the original routine when;• branching to an interrupt service routine (referred to as an interrupt service routine),• performing a subroutine call, or• executing the table reference instruction (TABP p).Stack registers (SKs) are four identical registers, so that subroutines can be nested up to 4 levels. However, one of stack registers is used respectively when using an interrupt service routine and when executing a table reference instruction. Accordingly, be careful not to over the stack when performing these operations together. The contents of registers SKs are destroyed when 4 levels are exceeded.The register SK nesting level is pointed automatically by 2-bit stack pointer (SP).Figure 5 shows the stack registers (SKs) structure.Figure 6 shows the example of operation at subroutine call.(6) Interrupt stack register (SDP)Interrupt stack register (SDP) is a 1-stage register. When an interrupt occurs, this register (SDP) is used to temporarily store the contents of data pointer, carry flag and skip flag just before an interrupt until returning to the original routine.Unlike the stack registers (SKs), this register (SDP) is not used when executing the subroutine call instruction and the table reference instruction.(7) Skip flagSkip flag controls skip decision for the conditional skip instructions and continuous described skip instructions. When an interrupt occurs, the contents of skip flag is stored automatically in the interrupt stack register (SDP) and the skip condition is retained.13X 1X 0Y 3Y 2Y 1Data pointer (DP)Register X (2)Register Y (4)Specifying RAM file010Specifying bit positionRegister Y (4)(8) Program counter (PC)Program counter (PC) is used to specify a ROM address (page and address). It determines a sequence in which instructions stored in ROM are read. It is a binary counter that increments the number of instruction bytes each time an instruction is executed. However, the value changes to a specified address when branch instructions, subroutine call instructions, return instructions, or the table reference instruction (TABP p) is executed.Program counter consists of PC H (most significant bit to bit 7)which specifies to a ROM page and PC L (bits 6 to 0) which specifies an address within a page. After it reaches the last address (address 127) of a page, it specifies address 0 of the next page (Figure 7).Make sure that the PC H does not exceed after the last page of the built-in ROM.(9) Data pointer (DP)Data pointer (DP) is used to specify a RAM address and consists of registers X and Y. Register X specifies a file and register Y specifies a RAM digit (Figure 8).Register Y is also used to specify the port D bit position.When using port D, set the port D bit position to register Y certainly and execute the SD, RD, or SZD instruction (Figure 9).141616A part of page 1 (addresses 008016 to 00FF 16) is reserved for interrupt addresses (Figure 11). When an interrupt occurs, the address (interrupt address) corresponding to each interrupt is set in the program counter, and the instruction at the interrupt address is executed. When using an interrupt service routine,write the instruction generating the branch to that routine at an interrupt address.Page 2 (addresses 010016 to 017F 16) is the special page for subroutine calls. Subroutines written in this page can be called from any page with the 1-word instruction (BM). Subroutines extending from page 2 to another page can also be called with the BM instruction when it starts on page 2.ROM pattern (bits 7 to 0) of all addresses can be used as data areas with the TABP p instruction.DATA MEMORY (RAM)1 word of RAM is composed of 4 bits, but 1-bit manipulation (with the SB j, RB j, and SZB j instructions) is enabled for the entire memory area. A RAM address is specified by a data pointer. The data pointer consists of registers X and Y. Set a value to the data pointer certainly when executing an instruction to access RAM.Table 2 shows the RAM size. Figure 12 shows the RAM map.Table 2 RAM sizeProductM34250M2M34250E2RAM size64 words ! 4 bits (256 bits)07FF 168765External interrupt address Timer 1 interrupt address00801600821600FF 16Register X 012340RAM 64 words ! 4 bits (256 bits)PROGRAM MEMORY (ROM)The program memory is a mask ROM. 1 word of ROM is composed of 9 bits. ROM is separated every 128 words by the unit of page (addresses 0 to 127). Table 1 shows the ROM size and pages. Figure 10 shows the ROM map of M34250M2.Table 1 ROM size and pages Product M34250M2M34250E2ROM size (! 9 bits)2048 wordsPages 16 (0 to 15)15Table 4 Interrupt request flag, interrupt enable bit andskip instructionRequest flag EXF0T1FInterrupt name External interrupt Timer 1 interruptEnable bit V10V11Skip instructionSNZ0SNZ1Table 5 Interrupt enable bit function Occurrence ofinterrupt requestEnabled DisabledSkip instructionInvalidValidInterrupt enable bit1INTERRUPT FUNCTIONThe interrupt type is a vectored interrupt branching to an individual address (interrupt address) according to each in-terrupt source. An interrupt occurs when the following 3conditions are satisfied.•An interrupt activated condition is satisfied (request flag = “1”)•Interrupt enable bit = “1”(interrupt request occurrence enabled)•Interrupt enable flag (INTE) = “1” (interrupt enabled)Table 3 shows interrupt sources. (Refer to each interrupt request flag for details of activated conditions.)(1) Interrupt enable flag (INTE)The interrupt enable flag (INTE) controls whether the every interrupt enable/disable. Interrupts are enabled when INTE flag is set to “1” with the EI instruction and disabled when INTE flag is cleared to “0” with the DI instruction. When any interrupt occurs, the INTE flag is automatically cleared to “0,” so that other interrupts are disabled until the EI instruction is executed.(2) Interrupt enable bit (V10, V11)Use an interrupt enable bit of interrupt control register V1 to select the corresponding interrupt or skip instruc-tion.Table 4 shows the interrupt request flag, interrupt en-able bit and skip instruction.Table 5 shows the interrupt enable bit function.(3) Interrupt request flagWhen the activated condition for each interrupt is sat-isfied, the corresponding interrupt request flag is set to “1.” Each interrupt request flag is cleared to “0” when either;•an interrupt occurs, or•the next instruction is skipped with a skip instruc-tion.Each interrupt request flag is set when the activated condition is satisfied even if the interrupt is disabled by the INTE flag or its interrupt enable bit. Once set,the interrupt request flag retains set until a clear con-dition is satisfied.Accordingly, an interrupt occurs when the interrupt dis-able state is released while the interrupt request flag is set.If more than one interrupt request flag is set when the interrupt disable state is released, the interrupt priority level is as follows shown in Table 3.Table 3 Interrupt sources Prioritylevel12Interrupt nameExternal interrupt Timer 1 interrupt Interrupt addressAddress 0in page 1Address 2in page 1Activated condition Level change of INT pinTimer 1 underflow16T1F V11EXF0V10Request flag (state retained)Enable bitActivated conditionINT pin (L →H or H →L input)Timer 1 underflowInterrupt service routine(4) Internal state during an interruptThe internal state of the microcomputer during an in-terrupt is as follows (Figure 14).•Program counter (PC)An interrupt address is set in program counter. The address to be executed when returning to the main routine is automatically stored in the stack register (SK).•Interrupt enable flag (INTE)INTE flag is cleared to “0” so that interrupts are disa-bled.•Interrupt request flagOnly the request flag for the current interrupt source is cleared to “0.”•Data pointer, carry flag and skip flagThe contents of these pointer and flags are stored automatically in the interrupt stack register (SDP).(5) Interrupt processingWhen an interrupt occurs, a program at an interrupt address is executed after branching a data store se-quence to stack register. Write the branch instruction to an interrupt service routine at an interrupt e the RTI instruction to return to main routine.Interrupt enabled by executing the EI instruction is per-formed after executing 1 instruction (just after the next instruction is executed). Accordingly, when the EI in-struction is executed just before the RTI instruction,interrupts are enabled after returning the main routine.(Refer to Figure 13)17(6) Control register related to interrupt •Timer control register V1Interrupt enable bits of external and timer 1 are assigned to register V1. Set the contents of this register through register A with the TV1A instruction. The TAV1 instruction can be used to transfer the contents of register V1 to register A.(7) Interrupt sequenceInterrupts occur only when the respective INTE flag, interrupt enable bits (V10, V11), and interrupt request flags (EXF0, T1F)are “1.” The interrupt actually occurs 2 to 3 machine cycles after the cycle in which all three conditions are satisfied. Theinterrupt occurs after 3 machine cycles only when the three interrupt conditions are satisfied on execution of other than one-cycle instructions (Refer to Figure 16).Table 6 Control register related to interruptV13V12V11V10Timer control register V1G 1/T OUT pin function selection bit Prescaler/timer 1 operation start bit Timer 1 interrupt enable bit External interrupt enable bitPort G 1 (I/O)T OUT pin (output)/port G 1(input)Prescaler stop (initial state) / timer 1 stop (state retained)Prescaler / timer 1 operationInterrupt disabled (SNZ1 instruction is valid)Interrupt enabled (SNZ1 instruction is invalid)Interrupt disabled (SNZ0 instruction is valid)Interrupt enabled (SNZ0 instruction is invalid)01010101Note: “R” represents read enabled, and “W” represents write enabled.at reset : 00002R/Wat RAM back-up : 00002T 1T 2T 3T 4T 1T 2T 3T 4T 1T 2T 3T 4T 1T 2T 3T 4Interrupt enabled state.When an interrupt request flag is set after its interrupt is enabledf (X IN )EI instruction execution cycleInterrupt enableflag (INTE)Interrupt disabled state.1 machine cycle18EXTERNAL INTERRUPTSThe 4250 Group has an external interrupt. An external interrupt request occurs when a valid waveform is input to an interrupt input pin (edge detection).The external interrupt can be controlled with the key-on wakeup control register K0.Table 7 External interrupt activated conditionNameExternal interruptInput pin G 0/INTValid waveformFalling waveform (“H”→“L”)Rising waveform (“L”→“H”)Valid waveform selection bit(K02)10Fig. 17 External interrupt circuit structureinstructionD TQ IAG instructionRegister AA 0PU00Pull-up transistorEXF0K0201FallingRising(Note)This symbol represents a parasitic diode.Note:Applied potential to port G or less.One-sided edge detectioncircuit。

人着床前胚胎的单细胞和单胚胎基因表达研究

基因组学与应用生物学，2020年，第39卷，第12期，第5809-5815页研究报告Research Report人着床前胚胎的单细胞和单胚胎基因表达研究郭瑞峰孙博文^上海健康医学院，上海，201318* 通信作者，***************.cn摘要在小鼠胚胎发育过程中，有报道显示F G F信号通路在着床前胚胎的细胞分化中起关键作用。

然而，人着床前胚胎的细胞分化分子机制尚未明确。

本研究利用体外发育第7天和第3天的人着床前胚胎，通过单细胞微流控芯片技术和单胚胎的全基因组表达谱技术，确定了在不同发育阶段中出现的差异表达基因和信号通路变化，发现了 F G F/PI3K通路在人内细胞团分化中起到重要作用，同时还锁定该通路中的两个基因 /7W和4/0^，是关键的细胞分化基因。

因此，与F G F通路相关的细胞分化关键基因可能在胚胎发育、辅助生殖、人类干细胞研究中有重要作用。

本研究使用了独特的差异基因分析技术，在寻找发育相关基因中有重要的应用价值。

关键词单细胞微流控芯片，全基因组表达谱芯片，人着床前胚胎,分化，F G F信号通路Single-cell and Single-embryo Gene Expression Profiling of Human Preimplantation EmbryosG u o R ui f e n g S u n B o w e n*Shanghai University of Medicine and Health Sciences, Shanghai, 201318*Corresponsingauthor,***************.cnDOI: 10.13417/j.gab.039.005809Abstract I t w a s reported that F G F signaling p a t h w a y plays k e y role in cell differentiation o f m o u s e p r ei mp la ntation d e v e l o p m e n t.H o w e v e r,i t is still unclear w h i c h m o l ecular m e c h a n i s m s control cell differentiation during d ev e l o p m e n t o f h u m a n preimplantation e m b r y o s.B y using single-cell microfluidic chip tec h n o l o g y a n d g e n e chip technol og y,w e identified differentially expressed g e n e s a n d signaling p a t h w a y c h a n g e s at distinct d e v-el o pm e n t a l stages in d a y7 a n d d a y3 h u m a n preimplantation e m b r y o s.It s h o w e d that F G F/PI3K p a t h w a y w a s k e y to the differentiation o f h u m a n inner cell m a s s,a n d t w o genes in this p a t h w a y,n a m e l y FN1a n d AKT3,m i g h t be the m o s t i mportant g enes in cell differentiation.T h erefore,the k e y genes o f cell differentiation related to F G F p a t h w a y m a y play an important role in e m b r y o n i c d e v e l o p m e n t,assisted reproduction a n d h u m a n s t e m cell r es e a r c h.U n i q u e differential g e n e analysis technique w a s applied in this study,a n d i t is an important m e t h o d in the search o f g e nes during d e v e l o p m e n t.Keywords Single-cell microfluidic chip,H u m a n g e n o m e g e n e c h i p,H u m a n preimplantation e m b r y o,Differentiation,F G F signaling p a t h w a y在哺乳动物胚胎早期发育过程中，基因表达水细胞分化事件，而（：办2和O c M是决定小鼠胚胎滋平的变化是决定细胞分化的关键机制之一。

半导体FAB常用单词

半导体FAB常用单词◎ A开头的单字◎1. Abort 取消操作2. Abnormal 异常3. Acetic Acid（CH3COOH）醋酸4. Acetone（CH3COCH3）丙酮5. Acid 酸6. Add 增加7. Adjust 调整8. Air Shower 洁净走道9. Alignment 对准10. Alloy 合金11. Aluminum（Al）铝12. Ammonia（NH4OH）氢氧化胺（俗称:氨水）13. Analysis 分析 m~H14. AR 氩气15. Automation 自动化◎ B开头的单字◎1. Bake 烘烤2. Bank 暂存3. Barcode 条形码4. Batch 整批5. BHLD 被工程师或客户Bank Hold短时间内不会Run的货6. Blue Tape 蓝膜7. Boat 石英晶舟8. Bottom 底部9. Breakdown Voltage 击穿电压10. Broken 破片；损坏11. Buffer 生产暂存区12. Buffer Chemical 缓冲液◎ C开头的单字◎1. Calibration 校正；调整2. Camera 照相机；摄影机3. Cancel 清除4. Candela（cd）烛光5. Cart 手推车6. Cassette 晶舟7. Certify 技能认证8. Chamber 反应室9. Charge 电荷10. Chipping 崩裂11. Chip Suction Pen 真空吸笔12. Chip Transfer - m(Machine) 翻转机13. Clean Bench 清洗台14. Clean Room 洁净室15. Cleaning 清洗 IF16. Cleaning Sequence 清洗程序17. Clear 清除18. Coat 涂布19. Coater 上光阻机台20. Coating 上光阻；涂布上整个表面21. Completed 结束；完成22. Confirm 确认23. Contact 接触24. Contamination 污染25. Control Wafer（C/W）控片26. Controller 控制器27. Cooling Water 冷却水28. Crucible，Pot 坩埚29. Curing 烘烤30. Customer 客户31. CVD(Chemical Vapor Deposition) 化学汽相沉积32. Cycle Time 生产周期◎ D开头的单字◎1. Daily Monitor 每日检测2. Data 资料；数据3. Date 日期4. Defect 缺点；缺陷5. Defocus 散焦；无法聚焦6. Del(Delete) 清除；删除7. Delay 延迟8. Department 部门9. Deposition（DEP）沉积10. Develop 显影11. Developer 显影器；显影液12. Die，Chip 晶粒（台）；芯片（陆）13. DI Water 去离子水14. Dicing 切割15. Down 当机16. Drain 泄出17. Dry Etching 干蚀刻18. Dry Pump 干式(无油封)的真空泵19. Dummy Wafer（D/W）挡片◎ E开头的单字◎1. E/R(Etching Rate) 蚀刻率2. Emergency Stop 紧急停止3. EMO 紧急停止按钮4. Endpoint 终点值5. Engineer 工程师6. Epi –wafer 磊晶片（台）；外延片（陆）7. Equipment 机台；设备8. Error Message 错误讯息9. Etching 蚀刻10. Evaporation 蒸镀11. Exhaust 抽出；抽风管；排(废)气12. Expanding Machine 扩张机13. Exposure 曝光；曝光量◎ F开头的单字◎1. FAC 厂务2. Facility 厂务水电气系统3. Film 薄膜4. Focus 聚焦；焦距5. Forward Current 顺向电流6. Forward Voltage（Vf）顺向电压7. FQC 最终检验员8. Furnace 炉管◎ G开头的单字◎1. Gallium（Ga）镓2. GOR(General Operation Rule) 厂区操作规则3. Group 群组◎ H开头的单字◎1. Handle 处理2. High Current 高电流3. Highlight 强调4. High Vacuum 高真空5. High Voltage 高电压6. History 歴史7. HMDS 界面活性剂8. Hold 扣留；暂停9. Hold Date 留置日期10. Hold Reason 留置原因11. Hold User 留置者12. Hot Run 很急件13. Hydrochloric Acid（HCL）盐酸14. Hydrofluoric Acid（HF）氢氟酸15. Hydrogen Peroxide（H2O2）双氧水◎ I开头的单字◎1. Idle 休息2. Initial 初始状态3. Inspection 检验4. IPA(Isopropyl Acetone) 异丙醇5. IPQC 制程检验员6. IQC 进料检验员7. Item 项目8. Iv Test Iv测试◎ J开头的单字◎1. Job 工作2. Job – Name 程序名称代号◎ K开头的单字◎1. Key Lock 功能键；指令键2. Keyboard 键盘◎ L开头的单字◎1. Leak 泄漏2. LHLD 被Hold住的货(Hold在上一站)3. Light Emitting Diode（LED）发光二极体4. Link 连结；线5. Lithography 微影6. Log 记录7. Lost 机台是清空的，无人操作机台或机台没在Run货8. Lot 批货9. Lot History Information 批货历史资料10. Lot -ID 批货编号11. Lot Information 批货信息12. Lot Note 批货批注13. Lot Note Information 批货批注信息14. Lot Owner 货主15. Lot Position 批货位置16. Lot Process Status 批货生产状态17. Lot Status 批货状态18. LPHL 被工程师Hold在当站，请依Lot Note Call工程师或执行Run Card19. Luminous Intensity（Iv）光的强度（单位:cd，mcd）◎ M开头的单字◎1. Maintain 维护2. Maintenance 维修；保护3. Manufacture 制造4. Mark 记号5. Mask 光罩6. Merge 合并7. Metal 金属8. Microscope 显微镜；实体显微镜9. Misalign 对偏10. Missing Lot 失踪批货11. Miss operation（MO）错误操作12. Multi 多重的◎ N开头的单字◎1. Native Oxide Layer 自然氧化层2. NHLD 因下一站机台正在Run货或无法Run货而设的Hold(Hold在下一站)3. Nitric Acid（NHO3）硝酸4. Nitride 氮化物5. Nitrogen（N）氮6. Normal Lot 普通货7. Notavailable 不可用的；无效的8. Notch 缺角9. Nozzle 喷嘴◎ O开头的单字◎1. OCAP (Out Of Control Action 异常状况处理计划Plan)2. Off-line 不与计算机联机；间接参与生产的人员3. OI(Operation Instruction) 操作准则4. On-line 与计算机联机；直接参与生产的人员5. Operation 操作6. Operation Cancel 操作中止；取消操作7. Operation Complete 操作完成8. Operation Number（OP.NO.）操作步骤编号9. Operation Procedure 操作流程10. Operation Start 操作开始11. Operation Start Cancel 取消＂操作开始＂12. OPI(Operator Interface) 操作接口13. Optical Aligner 光对准曝光机14. OQC 出货检验员15. Out Of Control（OOC）超出控制规格16. Out Of Spec（OOS）超出规格17. Outgassing 指附着于固体表面的气体因压力降低或热量而升华18. Oven 烤箱；炉子19. Over Etching 过度蚀刻20. Over Q-Time 超过限制时间21. Owner 负责人22. Oxide 氧化物◎ P开头的单字◎1. Parameter 参数2. Part Number 型号3. Particle 微粒子4. Passivation 护层5. Password 密码6. Pattern 图案7. Pattern Shift 图案偏移8. Peeling 剥皮；剥离9. Phosphorus（P）磷10. Phosphorus Acid（H3PO4）磷酸11. Photo 黄光12. Photolithographic Patterning 微影图案13. Photo Resist（PR）光阻；光阻液14. Photo Resist Stripper 去光阻液15. Physical Vapor Deposition(PVD) 物理汽相沉积16. Piece 片数；张数17. Plasma 电浆18. PM(Preventive Maintenance) 机台定期例行保养19. PN(Production Notice) 制造通报20. PN Junction PN结21. Post Exposure Bake 曝光后烘烤22. POD 晶片专用盒(Run货専用)23. Port 港口；舱门24. Press 压；按下25. Pressure 压力26. Priority 优先次序27. Probe 探针28. Probe Area 探索区29. Probe Card 探针卡30. Process 制程31. Product 产品32. Program 程序33. Pump Down 抽真空34. Pure Water 纯水35. Purge 清除36. Push 推动◎ Q开头的单字◎1. Q-Time 限制的时数2. Quality 品质3. Quaternary Compound 四元化合物；季化合物◎ R开头的单字◎1. Range 范围2. Rapid Thermal Processing(RTP) 快速高温处理3. Rate 速率4. Recipe 处方；程序5. Recipe ID 程序名称6. Reclaim 回收改造；外送研磨7. Record 记录8. Recover 排除；复原9. Recover Runcard 异常流程卡10. Recover Wafers 回收晶片11. Recycle 循环；再制造12. Reject 拒绝13. Release 释放；放行14. Reset 重新启动；重设15. Resistance 电阻16. Reticle 光罩17. Reverse Current（Ir）逆向电流18. Rework 重做；重工19. RHLD 机台Alarm造成货被Hold住20. Robot 机械手臂21. Rough Vacuuming 粗抽22. Route 路径；途程23. Route ID 程序编号24. RS 表面电阻25. RTA 快速热处理26. Rule 规则27. Run 执行28. Runcard（R/C）流程卡29. Rush 急件◎ S开头的单字◎1. Sapphire 蓝宝石2. Scan 扫描3. Scan Fail 扫描失效4. Scan Speed 扫描速度5. Scattering 散射6. Scrap 报废7. Scratch 刮伤8. Scrubber 刷洗器；清扫夫9. Search 搜寻10. SEMI 半自动11. Sensor 感应器12. Sequence 顺序13. Service 服务14. Set 设定15. Shift 位移；班别16. Shut Down 停机17. Sign 签名18. Signal 讯号19. Signal Tower 讯号灯20. Silicon（Si）矽(硅)21. Single 单一22. Size 尺寸；型23. Skill 技能24. Skip 跳过；跳站25. Slot ID 晶片摆放位置26. Slurry 研磨液27. Sodium Hydroxide（NaOH）氢氧化钠28. SOLID/Solid 固体29. Solvent 溶剂；缓和剂30. Sort 分类31. Sorter 排序机台32. SPC(Statistical Process Control) 统计制程管制33. Spec(Specification) 规格34. Spin Dryer 旋干机35. Split 分开；部份；分批36. Stage 站别；层次37. Status 状态38. Step 步骤39. Stress 应力40. Strip 去除41. Substrate 基板42. Sulferic Acid（H2SO4）硫酸43. Summary 摘要44. Super Hot Run（SH）超级急件45. Supervisor 督导者(课长)46. Supplier 供货商47. Supply 供给48. Support 支援49. Surface Contamination 表面污染50. Switch 按钮；开关51. System 系统◎ T开头的单字◎1. Tag 显示器2. Tank 槽3. Tape 胶带4. Target 目标5. TC(Thermal Couple) 热电偶(用以量测物体温度)6. TE(Technician) 技术员7. Technology 技术8. TECN(Temporary Engineer) 临时工程变更通知单(Change Notice)9. Telephone 电话10. Temp(Temperature) 温度11. Terminal 终端机12. Terminate 终止13. Ternary Compound 三元化合物14. Testing 测试部门15. Thallium（Tl）鉈16. Thermionic Filament 热电子灯丝17. Thin Film（T/F）薄膜18. Thin Film Deposition 薄膜沉积19. Thickness（THK）厚度20. Thickness Uniformity 厚度的均匀度21. Throttle 节流阀22. Throughput 生产速度23. Tilt 倾斜24. Timeout 时限已到25. Title 标题26. Tool ID 机台编号27. Tool Name 机台名称28. Tools 工具29. Track in/out 入/出帐30. Training 训练31. Transfer 晶片传送；翻转32. Transport 输送33. Tray 指High Current上放Cassette的基座(有三个)34. Trend 趋势35. Trolley 推车36. Trouble 麻烦；异常；问题37. Trouble Over 故障结束38. Tune 调机39. Tuning 调机中40. Turbo Pump 分子涡轮真空泵41. Turn Rate（T/R）晶片周转率42. Twist 晶片旋转角度43. Type 类型；型态◎ U开头的单字◎1. Ultrasonic Cleaner (Supersonic超音波清洗机cleaner)2. Underdeveloped 显影不良3. Under – Etching 蚀刻不足4. Uniformity（U%）均匀度5. Unit 单位6. Unload 收货7. Unlock 开关放松8. Update 更改9. Use 使用10. User ID 使用者编号11. User Name 使用者名称◎ V开头的单字◎1. Vacuum（VAC.）真空2. Vacuum Evaporator 真空蒸镀机3. Vacuum Gauge 真空压力计4. Vacuum Pump 真空泵5. Valve 阀6. Vapor 蒸气7. Vender(Vendor) 厂商8. Vent 泄漏9. Venting 破真空10. Verify 确认11. Vf Test Vf测试12. Vf Tester Vf测试机13. View Angle 视角；发光角度（单位:deg)14. Voltage（V）电压◎ W开头的单字◎1. Wafer 晶片（台）；外延片（陆）2. Wafer Actual Output 实际晶片产3. Wafer ID(#) 刻号(#)4. Wafer Out 晶片产出量5. Wafer Pcs(Pieces) 晶片片数6. Wafer Stage 晶片承载台7. Waste Chemicals Collection 废液回收箱8. WAT(Wafer Accept Test) 晶片接收侦测9. Water Mark 水痕10. Wet Etching 湿蚀刻11. Wet Etching System 湿蚀刻系统12. Wheel High Current上固定晶片旋转植入的轮盘13. White Tape 白膜14. Whole Dicing 全切15. Width 宽度16. WIP Lot List 在制品的批货清单◎ X开头的单字◎1. X-ray X射线◎ Y开头的单字◎1.Yield 良率◎ Z开头的单字◎1. Zero 零层2. Zoom(Zoom In/Zoom Out) 调整自由焦距镜头。

labchip高灵敏度芯片说明书

1
Contents
Specifications ......................................................................................................... 2 Assay Specifications .......................................................................................... 2 Sample Conditions ............................................................................................. 3 Kit Contents ....................................................................................................... 4 Safety Warnings and Precautions.......................................................................... 5 Preparation Procedures ......................................................................................... 6 Additional Items Required .................................................................................. 6 Preparing the Gel-Dye Solution .......................................................................... 6 Preparing the DNA Samples, DNA Ladder and the Buffer Tube .......................... 7 Preparing the Chip ............................................................................................. 9 Inserting a Chip into the LabChip GX/GXII Touch Instrument ........................... 11 Running the Assay ........................................................................................... 13 Storing the Chip ............................................................................................... 16 Chip Cartridge Cleaning ................................................................................... 17 Results .................................................................................................................. 18 HT DNA High Sensitivity Ladder Result ............................................................ 18 Troubleshooting ................................................................................................... 19 Frequently Asked Questions ................................................................................ 25 LabChip Kit Essential Practices........................................................................... 26 General ............................................................................................................ 26 Reagents .......................................................................................................... 27 Chips ................................................................................................................ 27 Samples ........................................................................................................... 30 Chip Well Aspiration Using a Vacuum ................................................................. 31 Customer Technical Support ............................................................................... 32 Licenses and Rights of Use ................................................................................. 33

AT键盘接口资料

IBM Keyboards. Not really an interesting topic, one would expect. So why would you want to interface the Keyboard? The IBM keyboard can be a cheap alternative to a keyboard on aMicroprocessor development system. Or maybe you want a remote terminal, just couple it with a LCD Module.Maybe you have a RS-232 Barcode Scanner or other input devices, which you want to use with existing software which only allows you to key in numbers or letters. You could design yourself a little box to convert RS-232 into a Keyboard Transmission, making it transparent to the software.An interfacing example is given showing the keyboard's protocols in action. This interfacingexample uses a 68HC705J1A MCU to decode an IBM AT keyboard and output the ASCIIequivalent of the key pressed at 9600 BPS.Note that this page only deals with AT Keyboards. If you have any XT keyboards, you wish to interface, consider placing them in a museum. We will not deal with this type of keyboard in this document. XT Keyboards use a different protocol compared to the AT, thus code contained on this page will be incompatible.The IBM keyboard you most probably have sitting in front of you, sends scan codes to yourcomputer. The scan codes tell your Keyboard Bios, what keys you have pressed or released.Take for example the 'A' Key. The 'A' key has a scan code of 1C (hex). When you press the 'A' key, your keyboard will send 1C down it's serial line. If you are still holding it down, for longer than it's typematic delay, another 1C will be sent. This keeps occurring until another key has been pressed, or if the 'A' key has been released.However your keyboard will also send another code when the key has been released. Take the example of the 'A' key again, when released, the keyboard will send F0 (hex) to tell you that the key with the proceeding scan code has been released. It will then send 1C, so you know which key has been released.Your keyboard only has one code for each key. It doesn't care it the shift key has been pressed. It will still send you the same code. It's up to your keyboard BIOS to determine this and take the appropriate action. Your keyboard doesn't even process the Num Lock, Caps Lock and Scroll Lock. When you press the Caps Lock for example, the keyboard will send the scan code for the cap locks. It is then up to your keyboard BIOS to send a code to the keyboard to turn on the Caps lock LED.Now there's 101 keys and 8 bits make 256 different combinations, thus you only need to send one byte per key, right?Nop. Unfortunately a handful of the keys found on your keyboard are extended keys, and thus require two scan code. These keys are preceded by a E0 (hex). But it doesn't stop at two scan codes either. How about E1,14,77,E1,F0,14,F0,77! Now that can't be a valid scan code? Wrong again. It's happens to be sent when you press the Pause/break key. Don't ask me why they have to make it so long! Maybe they were having a bad day or something?When an extended key has been released, it would be expect that F0 would be sent to tell you that a key has been released. Then you would expect E0, telling you it was an extended key followed by the scan code for the key pressed. However this is not the case. E0 is sent first, followed by F0, when an extended key has been released.Besides Scan codes, commands can also be sent to and from the keyboard. The following section details the function of these commands. By no means is this a complete list. These are only some of the more common commands.These commands are sent by the Host to the Keyboard. The most common commandwould be the setting/resetting of the Status Indicators (i.e. the Num lock, Caps Lock &Scroll Lock LEDs). The more common and useful commands are shown below.ED Set Status LED's - This command can be used to turn on and off theNum Lock, Caps Lock & Scroll Lock LED's. After Sending ED, keyboardwill reply with ACK (FA) and wait for another byte which determines theirStatus. Bit 0 controls the Scroll Lock, Bit 1 the Num Lock and Bit 2 theCaps lock. Bits 3 to 7 are ignored.EE Echo - Upon sending a Echo command to the Keyboard, the keyboardshould reply with a Echo (EE)F0Set Scan Code Set. Upon Sending F0, keyboard will reply with ACK(FA) and wait for another byte, 01-03 which determines the Scan CodeUsed. Sending 00 as the second byte will return the Scan Code Setcurrently in UseF3Set Typematic Repeat Rate. Keyboard will Acknowledge command withFA and wait for second byte, which determines the Typematic RepeatRate.F4Keyboard Enable - Clears the keyboards output buffer, enablesKeyboard Scanning and returns an Acknowledgment.F5Keyboard Disable - Resets the keyboard, disables Keyboard Scanningand returns an Acknowledgment.FE Resend - Upon receipt of the resend command the keyboard will re-transmit the last byte sent.FF Reset - Resets the Keyboard.Now if the Host Commands are send from the host to the keyboard, then the keyboardcommands must be sent from the keyboard to host. If you think this way, you must becorrect. Below details some of the commands which the keyboard can send.FA AcknowledgeAA Power On Self Test Passed (BAT Completed)EE See Echo Command (Host Commands)FE Resend - Upon receipt of the resend command the Host should re-transmit the last byte sent.00Error or Buffer OverflowFF Error or Buffer OverflowThe diagram below shows the Scan Code assigned to the individual keys. The Scan code is shown on the bottom of the key. E.g. The Scan Code for ESC is 76. All the scan codes are shown in Hex.As you can see, the scan code assignments are quite random. In many cases the easiest way to convert the scan code to ASCII would be to use a look up table. Below is the scan codes for the extended keyboard & Numeric keypad.The PC's AT Keyboard is connected to external equipment using four wires. These wires are shown below for the Male Plug.The Host to Keyboard Protocol is initiated by taking the KBD data line low. However to prevent the keyboard from sending data at the same time that you attempt to send the keyboard data, it is common to take the KBD Clock line low for more than 60us. This is more than one bit length.Then the KBD data line is taken low, while the KBD clock line is released.The keyboard will start generating a clock signal on it's KBD clock line. This process can take up to 10mS. After the first falling edge has been detected, you can load the first data bit on the KBD Data line. This bit will be read into the keyboard on the next falling edge, after which you can place the next bit of data. This process is repeated for the 8 data bits. After the data bits come an Odd Parity Bit.Once the Parity Bit has been sent and the KBD Data Line is in a idle (High) state for the next clock cycle, the keyboard will acknowledge the reception of the new data. The keyboard does this by taking the KBD Data line low for the next clock transition. If the KBD Data line is not idle after the 10th bit (Start, 8 Data bits + Parity), the keyboard will continue to send a KBD Clock signal until the KBD Data line becomes idle.Normally in this series of web pages, we connect something to the PC, to demonstrate theprotocols at work. However this poses a problem with the keyboard. What could be possibly want to send to the computer via the keyboard interface?Straight away any devious minds would be going, why not a little box, which generatespasswords!. It could keep sending characters to the computer until it finds the right sequence.Well I'm not going to encourage what could possibly be illegal practices.In fact a reasonably useful example will be given using a 68HC705J1A single chip microcontroller.We will get it to read the data from the keyboard, convert the scan codes into ASCII and send it out in RS-232 format at 9600 BPS. However we won't stop here, you will want to see the bi-directional use of the KBD Clock & Data lines, thus we will use the keyboards status LEDS, Num Lock, Caps Lock and Scroll Lock.This can be used for quite a wide range of things. Teamed up with a reasonably sized 4 line x 40 character LCD panel, you could have yourself a little portable terminal. Or you could use it with a microcontroller development system. The 68HC705J1A in a One Time Programmable (OTP) is only a fraction of the cost of a 74C922 keyboard decoder chip, which only decodes a 4 x 4 matrix keypad to binary.The keyboard doesn't need to be expensive either. Most people have many old keyboards floating around the place. If it's an AT Keyboard, then use it (XT keyboards will not work with thisprogram.) If we ever see the introduction of USB keyboards, then there could be many redundant AT keyboards just waiting for you to hook them up.! "Before we start with the technical aspects of the project, the salesman in me wants to tell you about the features packed into the 998 bytes of code.Use of the keyboard's bi-directional protocol allowing the status of the Num Lock, Caps Lock and Scroll Lock to be displayed on the Keyboards LEDs.External Reset Line activated by ALT-CTRL-DEL. If you are using it with a Microcontroler development system, you can reset the MCU with the keyboard. I'vealways wanted to be able to use the three fingered solute on the HC11!Scroll Lock and Num Lock toggles two Parallel Port Pins on the HC705. This can be used to turn things on or off, Select Memory Pages, Operating Systems etc "ALTDEC" or what I call the Direct Decimal Enter Routine. Just like using a PC, when you enter a decimal number when holding down one of the ALT keys the number issent as binary to the target system. E.g. If you press and hold down ALT, then type in255 and release ALT, the value FF (Hex) will be sent to the system. Note. Unlike thePC, you can use both the numeric keypad or the numbers along the top of thekeyboard."CTRLHEX" or you guessed it, Direct Hexadecimal Enter Routine. This function is not found with the PC. If you hold CTRL down, you can enter a Hexadecimal number. Justthe thing for Development Systems or even debugging RS-232 Comms?Output is in ASCII using a RS-232 format at 9600 BPS. If using it with a development System, you can tap it in after the RS-232 Line Transceivers to save you a few dollarson RS-232 Level Converters.# $The schematic below, shows the general connections of the keyboard to the HC705. The O.C.on the inverters denotes Open Collector outputs. I've used 74LS05 for the Open Collector Inverters, but it is up to you how you want to implement it. You can also use transistors with a suitable current limiting resistor, if you see fit.The TXD pin, while it transmits in RS-232 format, is not at RS-232 Voltage Levels. If you want to connect it to RS-232 Devices then you will need to attach a RS-232 Level Converter of some kind. If you are using it with a development system, you can bypass both RS-232 Level Converters and connect it directly to the RXD pin of the MCU. However the keyboard can't be a direct replacement for a terminal on a development system, unless you want to type in your code each time! You may want to place a jumper or switch inline to switch between your RS-232 Port and the keyboard.The circuit is designed to run on a 4Mhz crystal (2Mhz Bus Speed). The timing for the RS-232 transmission is based on the bus speed, thus this crystal has to be 4 Mhz. If you are lucky enough to have a 4 Mhz E Clock on your development system you can use it. I might at a later date try to create a 2 Mhz version which will run happily off a HC11 with a 8 Meg Crystal. This will reduce the cost of the project even further.The power supply can also create a slight problem. A standard keyboard can drain about300mA max, thus it would be recommended to use it's own regulator rather than taking a supply from elsewhere. Filter Capacitors are not shown on the general schematic but are implied for reliable operation. Consult your MC68HC705J1A Technical Data Manual for more information.% & 'Now it is time to look at the code. I cannot include a description of all the code in this web page. The list file is just on 16 pages. Most of it (hopefully) is easy to follow. Just like other code, count the number of spelling errors, while you are at it.Receive ldx #08 ;Number of Bitsclra ;Clear Parity Registerbclr clkout,PORTB ;Clear to Sendbrset clkin,PORTB,* ;wait for idle Clockbrset datain,PORTB,Receive ;False Start Bit, RestartRemember the KBD Clock line? If you take it low, the keyboard will buffer any keys pressed. The Keyboard will only attempt to send when both the Data and Clock lines are idle (high). As it can take considerable time to decode the keys pressed, we must stop the keyboard from sending data. If not, some of the data may be lost or corrupted.The program, will keep the KBD Clock line low, unless it is ready to accept data. We will use a loop to retrieve the data bits from the keyboard, thus we will load index register X with the number of bits be want to receive. The Accumulator will be used to verify the parity bit. We must clear this first.We then place the KBD Clock line in the idle state so that the keyboard will start transmitting data if a key has been pressed. The program then loops while the Clock Line is Idle. One the KBD clock goes low, the loop is broken and the KBD Data Line is read. This should be the start bit which should be low. If not we branch to the start of the receive routine.Recdata ror bytejsr highlow ;Wait for high to low Transitionbrset datain,PORTB,Recsetbclr 7,bytejmp RecnextRecset bset 7,byteincaRecnext decxbne Recdata ;Loop until 8 bits been receivedOnce the Start bit has been detected, the 8 data bits must follow. The data is only valid on the falling edge of the clock. The subroutine highlow shown below will wait for the falling edge of the clock.highlow brclr clkin,PORTB,* ;Loop until Clk Highbrset clkin,PORTB,* ;Loop until Clk LowrtsAfter the falling edge we read the level of the KBD Data line. If it is high we set the MSB of byte or if it is clear, we clear it. You will notice if the bit is set, we also increment the accumulator. This keeps track of the number of 1's in the byte and thus can be used to verify the Parity Bit. Index register X is decremented as we have read a byte. It then repeats the above process, until the entire 8 bits have been read.jsr highloweor PORTB ;Parity Bit Detectionand #$01beq r_errorAfter the 8 data bits, comes the dreaded Parity Bit. We could ignore it if we wanted to, but we may as well do something about it. We have been keeping a tally of the number of 1's in the Accumulator. The keyboard uses Odd parity, thus the parity bit should be the complement of the LSBit in the Accumulator. By exclusive OR-ing the Accumulator with the Parity Bit, we get a 1 if both the bits are different. I.e a '1' if the parity bit checks out.As we are only interested in the LSB we can quite happy XOR the accumulator with PORTB. However this means the KBD datain must be connected to PB0. This can be a slight catch if you alter the equates. Then we single out the LSB using the AND function. If the resultant is zero, then a parity error has occurred and the program branches to r_error.jsr highlowbrclr datain,PORTB,r_error ;Stop Bit Detectionbset clkout,PORTB ;Prevent Keyboard from sending data;(Clear to Send)rtsAfter the Parity Bits comes the Stop Bit. Once again we can ignore it if we desire. However we have chosen to branch to an error routine if this occurs. The Stop bits should be set, thus an error occurs when it is clear.r_error lda #$FE ;Resendsta bytejsr Transmitjmp Receive ;Try againWhat you do as error handling is up to you. In most cases it will never be executed. In fact I don't yet know if the above error handling routine works. I need to program another HC705 to send a false parity bit. I've tried it out in close proximity to the Washing Machine, but I really need a controlled source!When an error occurs in the Parity or Stop Bit we should assume that the rest of the byte could have errors as well. We could ignore the error and process the received byte, but it could have unexpected results. Instead the keyboard has a resend command. If we issue a resend (FE) to the keyboard, the keyboard should send the byte back again. This is what occurs here.You may notice that we branch to the error routine which transmits a resend command straightaway, without waiting for the corrupt transmission to finish. This is not a problem, as the keyboard considers any transmission to be successful, if the 10th bit is sent, i.e. the parity bit. If we interrupt the transmission before the parity bit is sent, the keyboard will place the current byte in it's buffer for later transmission.You may of noticed that reading a byte doesn't really require bi-directional data and clock lines. If you can process the byte fast enough then no handshaking (RTS) is required. This means you no longer need the Open Collector inverters and the 2 Parallel Port lines. I have successfully done this with the HC705, outputting only scan codes on a Parallel Bus. But as you can imagine, you must be quick in order to catch the next transmission.( & 'Writing commands to the keyboard involves the use of the Open Collector inverters. If we require an idle line (+5v), then we must transmit a 0 (zero) to achieve this. Everything which is sent via the dataout and clockout lines must be inverted.transmit ldx #$08 ;8 Data Bitsbset clkout,PORTB ;Set Clock Lowlda #$13 ;Delay 64uSjsr delayclra ;Clear Parity Registerbset dataout,PORTB ;Set Data Lowbclr clkout,PORTB ;Release Clock Linejsr highlowThe routine given here is a generic one which can be used for your own purposes. During normal execution of this program the KBD clock line should be low, to prevent data being sent when the MCU isn't ready for it. However in this example, we take low the KBD clock line and wait for the 64uS which is pointless as the line is already low and has been like this for quite some time, since the end of the last Transmission or Reception.The program then initiates the Host to Keyboard transmission by taking the KBD data line low and releasing the KBD clock line. We must then wait for a high to low transition on the KBD clock, before we load the first bit on the KBD data line. - Something which is not clear in other FAQ's on the net.loop ror bytebcs markspace bset dataout,PORTB ; Clear Bitjmp nextmark bclr dataout,PORTB ; Clear Bitinca ; Parity Calculationnext jsr highlow ; Wait for high to low transitiondecxbne loopThe loading of the individual bits on the KBD data line is done in very similar fashion to the read cycle. However note that the bits are inverted. Also like the read cycle, we increment the accumulator so we can calculate the parity bit later on.and #$01bne clr_parset_par bclr dataout,PORTBjmp tr_acknclr_par bset dataout,PORTBtr_ackn jsr highlowAfter the data bits have been sent, it is now time to send the parity bit. Unlike the read cycle, we can't ignore the parity bit. If we do the keyboard will issue a resend (FE) command if the parity bit is incorrect.bclr dataout,PORTB ;Release Data Linejsr highlowbrset datain,PORTB,error ;Check for Ackbrclr clkin,PORTB,* ;Wait for idle linebset clkout,PORTB ;Prevent Keyboard from sending data;(Clear to Send)rtsOnce the Parity bit has been set and the falling edge of the KBD clock detected, we must release the KBD data line, wait for another falling edge of the KBD clock to see if the Keyboard has acknowledged the byte. The keyboard does this by pulling the KBD data line low. If it is not low, then the program branches to an error handler. If all has been successful, the MCU pulls down the KBD clock, to prevent it from transmitting.error lda #$FF ;Resetsta bytejsr transmitrtsWe have taken a harsher approach to handing any transmit errors. Ideally we should wait for the keyboard to send a resend command and then retransmit the byte. However what we have done is to issue a reset of the keyboard. So far I've never had an error, however if this starts to become a problem, then a better error handler will be written."KEYBRD05.ASM Assembled with CASM 02/15/1998 22:12 PAGE 11 *****************************************************2 * *3 * 101 Key, IBM Keyboard Decoder for 68HC705J1A. *4 * *5 * Copyright 1997 / 1998 - Craig Peacock *6 * 15th February 1998 *7 * *8 * Includes ALTDEC & CTRLHEX Routines *9 * *10 *****************************************************110300 12 datain equ 0 ; Must be LSB - See Parity Calculations 0300 13 clkin equ 10300 14 dataout equ 20300 15 clkout equ 30300 16 nreset equ 4 ; Reset Output0300 17 TXD equ 5 ; Transmit Pin on Port B1819 ; Equates for LED Byte200300 21 pscrlck equ 7 ; If true, Scroll Lock Pressed0300 22 pnumlck equ 6 ; If true, Num Lock Pressed230300 24 caplock equ 2 ; If true, Caps Lock is On (Active)0300 25 numlock equ 1 ; If true, Num Lock is On (Active)0300 26 scrlock equ 0 ; If true, Scroll Lock is On (Active)2728 ; Equates for Status Flag, Byte290300 30 rctrl equ 7 ; If true, Right Ctrl Pressed0300 31 lctrl equ 6 ; If true, Left Ctrl Pressed0300 32 ralt equ 5 ; If true, Right Alt Pressed0300 33 lalt equ 4 ; If true, Left Alt Pressed340300 35 caploc equ 2 ; If true, Caps Lock Pressed0300 36 rshift equ 1 ; If true, Right Shift Key Pressed0300 37 lshift equ 0 ; If true, Left Shift Key Pressed3800C0 39 org ram4000C0 41 byte rmb 1 ; Used to hold byte, during Trans & Rec 00C1 42 status rmb 1 ; Status Flags00C2 43 LED rmb 1 ; LED Flags00C3 44 asc rmb 3 ; Used for altdec & ctrlhex4507F8 46 org $7F84707F8 0300 48 dw start ; Timer Interrupt Vector07FA 0300 49 dw start ; IRQ Vector07FC 0300 50 dw start ; Software Interrupt Vector07FE 0300 51 dw start ; Reset Vector520300 53 org rom540300 A6FF 55 start lda #%11111111 ;PORTA0302 B704 56 sta ddra ;Set Data Direction Register0304 B710 57 sta pdra ;Enable Pull Downs580306 A6FC 59 lda #%11111100 ;PORTB0308 B705 60 sta ddrb ;Set Data Direction Register030A B711 61 sta pdrb ;Enable Pull Downs62030C 1A01 63 bset TXD,PORTB ;Transmit Line Idle030E 1501 64 bclr dataout,PORTB ;KBD Data Idle0310 1701 65 bclr clkout,PORTB ;KBD Clock Idle0312 1901 66 bclr nreset,PORTB ;Reset Line Idle670314 CC031E 68 jmp rstflag ;No Attempt to Reset Keyboard made69 ;as keyboard would still be in POST70 ;or BAT Tests, if power applied at71 ;the same time than the HC705.7273 *****************************************************74 * *75 * reset - Sends a Reset Command to the Keyboard. *76 * Not a very good effort to reset keyboard, *77 * as it doesn't check for ACK or BAT *78 * Completion Code. I.e. Reset may not of *79 * even Worked! *80 * *81 *****************************************************820317 A6FF 83 reset lda #$FF ;Reset Keyboard0319 B7C0 84 sta byte031B CD0497 85 jsr transmit8687 *****************************************************88 * *89 * rstflag - Resets Status and LED Flags. Used when *90 * a successful Bat Completion code is *91 * sent to sync keyboard's LED's to 705's *92 * status register *93 * *94 *****************************************************95031E 3FC1 96 rstflag clr status0320 3FC2 97 clr LED9899 *****************************************************100 * *101 * main - Main Keyboard Decoding Routine. Once key *102 * been decoded, program should return here *103 * *104 *****************************************************1050322 CD04E2 106 main jsr Receive ;Get's a Single Byte from the Keyboard.0325 B6C0 107 lda byte1080327 A1F0 109 cmp #$F0 ;A Key has been Released0329 2603 110 bne main1032B CC0429 111 jmp release112032E A1AA 113 main1 cmp #$AA ;Successful Completion of BAT0330 2603 114 bne main20332 CC031E 115 jmp rstflag1160335 A1E0 117 main2 cmp #$E0 ;Extended Keys0337 2603 118 bne main30339 CC03D6 119 jmp extend120033C A112 121 main3 cmp #$12 ;Left Shift Key Pressed033E 2602 122 bne main40340 10C1 123 bset lshift,status1240342 A159 125 main4 cmp #$59 ;Right Shift Key Pressed0344 2602 126 bne main50346 12C1 127 bset rshift,status1280348 A114 129 main5 cmp #$14 ;Left Ctrl034A 2605 130 bne main6034C 1CC1 131 bset lctrl,status034E CC0588 132 jmp clrasc1330351 A111 134 main6 cmp #$11 ;Left Alt0353 2605 135 bne main70355 18C1 136 bset lalt,status0357 CC0588 137 jmp clrasc138035A A158 139 main7 cmp #$58 ;Caps Lock Pressed035C 2605 140 bne main8035E 05C154 141 brclr caploc,status,caps0361 14C1 142 bset caploc,status1430363 A17E 144 main8 cmp #$7E ;Scroll Lock Pressed0365 2605 145 bne main90367 0FC161 146 brclr pscrlck,status,scrl036A 1EC1 147 bset pscrlck,status148036C A177 149 main9 cmp #$77 ;Num Lock Pressed036E 2605 150 bne main100370 0DC14D 151 brclr pnumlck,status,nums0373 1CC1 152 bset pnumlck,status1530375 A18F 154 main10 cmp #$8F ;Last Value in Look-Up Table0377 2503 155 blo main110379 CC0322 156 jmp main ;Out of Bounds157037C 97 158 main11 tax037D 04C20C 159 brset caplock,LED,caps_on0380 02C10F 160 brset rshift,status,shifton0383 00C10C 161 brset lshift,status,shifton1620386 D605C6 163 cancel lda noshift,x ;Load Lower Case Values0389 CC0395 164 jmp main12165038C 02C1F7 166 caps_on brset rshift,status,cancel ;If ShiftLock & Shift, Cancel038F 00C1F4 167 brset lshift,status,cancel1680392 D60656 169 shifton lda shift,x ;Load Upper Case Values1700395 271B 171 main12 beq return ;Scan Code not in Lookup Table. 1720397 97 173 tax0398 B6C1 174 lda status039A A430 175 and #$30 ;Either Alt Key Pressed039C 2704 176 beq main13039E 9F 177 txa039F CC053D 178 jmp altdec17903A2 B6C1 180 main13 lda status03A4 A4C0 181 and #$C0 ;Either CTRL Key Pressed03A6 2704 182 beq main1403A8 9F 183 txa03A9 CC0523 184 jmp ctrlhex18503AC 9F 186 main14 txa03AD B7C0 187 sta byte03AF CD0591 188 jsr RS232T ;Send to RS23218903B2 CC0322 190 return jmp main191192 *****************************************************193 * *194 * caps - Toggle Status of Caps lock and Echo to *195 * Keyboard *196 * *197 *****************************************************19803B5 14C1 199 caps bset caploc,status ; Set caploc flag to prevent routine being 200 ; called again03B7 B6C2 201 lda LED03B9 A804 202 eor #$04 ; Toggle Shift Lock Flag03BB B7C2 203 sta LED03BD CC047B 204 jmp LEDshow205206 *****************************************************207 * *208 * nums - Toggle Status of Nums lock and Echo to *209 * Keyboard *210 * *211 *****************************************************21203C0 1CC1 213 nums bset pnumlck,status21403C2 B6C2 215 lda LED03C4 A802 216 eor #$0203C6 B7C2 217 sta LED03C8 CC047B 218 jmp LEDshow219220 *****************************************************221 * *222 * scrl - Toggle Status of Scroll lock and Echo to *223 * Keyboard *224 * *225 *****************************************************22603CB 1EC1 227 scrl bset pscrlck,status22803CD B6C2 229 lda LED03CF A801 230 eor #$0103D1 B7C2 231 sta LED03D3 CC047B 232 jmp LEDshow。

数字时钟外文翻译

数字时钟外文翻译LED displays using digital tubes offer high brightness and intuitive intelligence。

___ design for a n electronic clock。

using a single-chip puter as the core and a total of seven anode high-brightness LEDs as a display to show week。

hour。

minute。

and second。

The clock can also switch to year。

month。

and day display。

and includes a whole point of music and alarm n。

nally。

it can be used as an electronic watch.The clock circuit is the heart of the computer。

controlling the rhythm of its ___.The design of this nal digital clock system is based on the principle of single-chip technology。

using the AT89C52 single-chip puter as the core controller。

Through the n of hardware and are res。

the clock system has been designed to include a clock module。

alarm module。

ambient temperature n module。

liquid crystal display module。

基于STC89C52单片机最小系统的设计

基于STC89C52单片机最小系统的设计Design of STC89C52 Minimum System1.Design Content and RequirementsDesign XXX: Design and n of STC89C52 Minimum System based on Single-chip puter.Design Requirements: The input signal can be in the form of sensors。

voltage。

current。

switches。

etc。

The single-chip model can be chosen by yourself (51.128.430.etc.)。

The output control signal can be analog voltage or digital signal。

and the control object can be motor (DC motor。

XXX)。

switch。

display。

etc。

(Note: Single-chip puter。

sensor circuit module and integrated circuit chip can be used for n.)Equipment used: Photographic plate and common PCB n equipment。

common electronic assembly tools。

multimeter。

oscilloscope and electronic components (see appendix for details).2.STC89C52 Single-chip puter2.1 n to STC89C52 Single-chip puterA single-chip puter。