74ACT257MTR;74ACT257TTR;中文规格书,Datasheet资料

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SN74HC257NSR,SN74HC257D,SN74HC257PWR,SN74HC257DR,规格书,Datasheet 资料

Addendum-Page 1PACKAGING INFORMATIONOrderable DeviceStatus(1)Package Type PackageDrawingPins Package QtyEco Plan(2)Lead/Ball Finish MSL Peak Temp (3)Samples (Requires Login)85124012A ACTIVE LCCC FK 201TBD Call TI Call TI 8512401EA ACTIVE CDIP J 161TBD Call TI Call TISN54HC257J ACTIVE CDIP J 161TBDA42N / A for Pkg TypeSN74HC257D ACTIVE SOIC D 1640Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC257DE4ACTIVE SOIC D 1640Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC257DG4ACTIVE SOIC D 1640Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC257DR ACTIVE SOIC D 162500Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC257DRE4ACTIVE SOIC D 162500Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC257DRG4ACTIVE SOIC D 162500Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC257DT ACTIVE SOIC D 16250Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC257DTE4ACTIVE SOIC D 16250Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC257DTG4ACTIVE SOIC D 16250Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC257N ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type SN74HC257NE4ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type SN74HC257NSR ACTIVE SO NS 162000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC257NSRE4ACTIVE SO NS 162000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC257NSRG4ACTIVE SO NS 162000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC257PW ACTIVE TSSOP PW 1690Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC257PWE4ACTIVETSSOPPW1690Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM芯天下--/Addendum-Page 2Orderable Device Status(1)Package Type PackageDrawingPins Package QtyEco Plan(2)Lead/Ball FinishMSL Peak Temp(3)Samples (Requires Login)SN74HC257PWG4ACTIVE TSSOP PW 1690Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC257PWLE OBSOLETE TSSOP PW 16TBD Call TICall TISN74HC257PWR ACTIVE TSSOP PW 162000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC257PWRE4ACTIVE TSSOP PW 162000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC257PWRG4ACTIVE TSSOP PW 162000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC257PWT ACTIVE TSSOP PW 16250Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC257PWTE4ACTIVE TSSOP PW 16250Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC257PWTG4ACTIVE TSSOP PW 16250Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC258D ACTIVE SOIC D 1640Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC258DE4ACTIVE SOIC D 1640Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC258DG4ACTIVE SOIC D 1640Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC258DR ACTIVE SOIC D 162500Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC258DRE4ACTIVE SOIC D 162500Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC258DRG4ACTIVE SOIC D 162500Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC258DT ACTIVE SOIC D 16250Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC258DTE4ACTIVE SOIC D 16250Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC258DTG4ACTIVE SOIC D 16250Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC258N ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type SN74HC258NE4ACTIVEPDIPN1625Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type芯天下--/Addendum-Page 3Orderable Device Status(1)Package Type PackageDrawingPins Package QtyEco Plan(2)Lead/Ball FinishMSL Peak Temp(3)Samples (Requires Login)SN74HC258NSR ACTIVE SO NS 162000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC258NSRE4ACTIVE SO NS 162000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC258NSRG4ACTIVE SO NS 162000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC258PW ACTIVE TSSOP PW 1690Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC258PWE4ACTIVE TSSOP PW 1690Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC258PWG4ACTIVE TSSOP PW 1690Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC258PWR ACTIVE TSSOP PW 162000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC258PWRE4ACTIVE TSSOP PW 162000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC258PWRG4ACTIVE TSSOP PW 162000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC258PWT ACTIVE TSSOP PW 16250Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC258PWTE4ACTIVE TSSOP PW 16250Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74HC258PWTG4ACTIVE TSSOP PW 16250Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SNJ54HC257FK ACTIVE LCCC FK 201TBD POST-PLATE N / A for Pkg TypeSNJ54HC257JACTIVECDIPJ161TBDA42N / A for Pkg Type(1)The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.(2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check /productcontent for the latest availability information and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.芯天下--/PACKAGE OPTION ADDENDUM5-Sep-2011Addendum-Page 4Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)(3)MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.OTHER QUALIFIED VERSIONS OF SN54HC257, SN74HC257 :•Catalog: SN74HC257•Military: SN54HC257NOTE: Qualified Version Definitions:•Catalog - TI's standard catalog product•Military - QML certified for Military and Defense Applications芯天下--/TAPE AND REELINFORMATION*All dimensionsare nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74HC257DR SOIC D 162500330.016.4 6.510.3 2.18.016.0Q1SN74HC257NSR SO NS 162000330.016.48.210.5 2.512.016.0Q1SN74HC257PWR TSSOP PW 162000330.012.4 6.9 5.6 1.68.012.0Q1SN74HC257PWT TSSOP PW 16250330.012.4 6.9 5.6 1.68.012.0Q1SN74HC258DR SOIC D 162500330.016.4 6.510.3 2.18.016.0Q1SN74HC258NSR SO NS 162000330.016.48.210.5 2.512.016.0Q1SN74HC258PWR TSSOP PW 162000330.012.4 6.9 5.6 1.68.012.0Q1SN74HC258PWTTSSOPPW16250330.012.46.95.61.68.012.0Q114-Jul-2012*All dimensionsare nominalDevice Package TypePackage DrawingPins SPQ Length (mm)Width (mm)Height (mm)SN74HC257DR SOIC D 162500333.2345.928.6SN74HC257NSR SO NS 162000367.0367.038.0SN74HC257PWR TSSOP PW 162000367.0367.035.0SN74HC257PWT TSSOP PW 16250367.0367.035.0SN74HC258DR SOIC D 162500333.2345.928.6SN74HC258NSR SO NS 162000367.0367.038.0SN74HC258PWR TSSOP PW 162000367.0367.035.0SN74HC258PWTTSSOPPW16250367.0367.035.014-Jul-2012IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,enhancements,improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B.Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All semiconductor products(also referred to herein as“components”)are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale,in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by applicable law,testing of all parameters of each component is not necessarily performed.TI assumes no liability for applications assistance or the design of Buyers’products.Buyers are responsible for their products and applications using TI components.To minimize the risks associated with Buyers’products and applications,Buyers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any patent right,copyright,mask work right,or other intellectual property right relating to any combination,machine,or process in which TI components or services are rmation published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal,regulatory and safety-related requirements concerning its products,and any use of TI components in its applications,notwithstanding any applications-related information or support that may be provided by TI.Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures,monitor failures and their consequences,lessen the likelihood of failures that might cause harm and take appropriate remedial actions.Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.In some cases,TI components may be promoted specifically to facilitate safety-related applications.With such components,TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements.Nonetheless,such components are subject to these terms.No TI components are authorized for use in FDA Class III(or similar life-critical medical equipment)unless authorized officers of the parties have executed a special agreement specifically governing such use.Only those TI components which TI has specifically designated as military grade or“enhanced plastic”are designed and intended for use in military/aerospace applications or environments.Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk,and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI has specifically designated certain components which meet ISO/TS16949requirements,mainly for automotive ponents which have not been so designated are neither designed nor intended for automotive use;and TI will not be responsible for any failure of such components to meet such requirements.Products ApplicationsAudio /audio Automotive and Transportation /automotiveAmplifiers Communications and Telecom /communicationsData Converters Computers and Peripherals /computersDLP®Products Consumer Electronics /consumer-appsDSP Energy and Lighting /energyClocks and Timers /clocks Industrial /industrialInterface Medical /medicalLogic Security /securityPower Mgmt Space,Avionics and Defense /space-avionics-defense Microcontrollers Video and Imaging /videoRFID OMAP Mobile Processors /omap TI E2E Community Wireless Connectivity /wirelessconnectivityMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2012,Texas Instruments Incorporated。

74ACT257MTR资料

1/11April 2001s HIGH SPEED: t PD = 5 ns (TYP.) at V CC = 5V sLOW POWER DISSIPATION:I CC = 4 µA(MAX.) at T A =25°CsCOMPATIBLE WITH TTL OUTPUTS V IH = 2V (MIN.), V IL = 0.8V (MAX.)s50Ω TRANSMISSION LINE DRIVING CAPABILITYsSYMMETRICAL OUTPUT IMPEDANCE:|I OH | = I OL = 24mA (MIN)sBALANCED PROPAGATION DELAYS:t PLH ≅ t PHLsOPERATING VOLTAGE RANGE:V CC (OPR) = 4.5V to 5.5VsPIN AND FUNCTION COMPATIBLE WITH 74 SERIES 257sIMPROVED LATCH-UP IMMUNITYDESCRIPTIONThe 74ACT257 is an advanced high-speed CMOS QUAD 2-CHANNEL MULTIPLEXER (3-STATE)fabricated with sub-micron silicon gate and double-layer metal wiring C 2MOS tecnology.It is composed of an independent 2-channel multiplexer with common SELECT and ENABLE (OE)inputs. It is a non-inverting multiplexer. When the ENABLE input is held HIGH, the outputs are forced to a high impedance state. When theSELECT input is held LOW, "A" data is selected;when SELECT input is held HIGH, "B" data is selected.The device is designed to interface directly High Speed CMOS systems with TTL, NMOS and CMOS output voltage levels.All inputs and outputs are equipped with protection circuits against static discharge, giving them 2KV ESD immunity and transient excess voltage.74ACT257QUAD 2 CHANNEL MULTIPLEXER (3-STATE)PIN CONNECTION AND IEC LOGIC SYMBOLSORDER CODESPACKAGE TUBE T & R DIP 74ACT257B SOP 74ACT257M74ACT257MTR TSSOP74ACT257TTR74ACT2572/11INPUT AND OUTPUT EQUIVALENT CIRCUITPIN DESCRIPTIONTRUTH TABLEX : Don’t CareZ : High ImpedanceLOGIC DIAGRAMPIN No SYMBOL NAME AND FUNCTION 1SELECT Common Data Select Inputs2, 5, 11, 141A to 4A Data Inputs From Source A3, 6, 10, 131B to 4B Data Inputs From Source B4, 7, 9, 121Y to 4Y Multiplexer Outputs 15OE 3 State Output Enable Inputs (Active LOW)8GND Ground (0V)16V CCPositive Supply VoltageINPUTSOUTPUTOE SELECTA B Y H X X X Z L L L X L L L H X H L H X L L LHXHH74ACT2573/11ABSOLUTE MAXIMUM RATINGSAbsolute Maximum Ratings are those values beyond which damage to the device may occur. Functional operation under these conditions is not implied.RECOMMENDED OPERATING CONDITIONS1) V IN from 0.8V to 2.0VSymbol ParameterValue Unit V CC Supply Voltage -0.5 to +7V V I DC Input Voltage -0.5 to V CC + 0.5V V O DC Output Voltage -0.5 to V CC + 0.5V I IK DC Input Diode Current ± 20mA I OK DC Output Diode Current ± 20mA I O DC Output Current ± 50mA I CC or I GND DC V CC or Ground Current± 200mA T stg Storage Temperature -65 to +150°C T LLead Temperature (10 sec)300°CSymbol ParameterValue Unit V CC Supply Voltage 4.5 to 5.5V V I Input Voltage 0 to V CC V V O Output Voltage 0 to V CC V T op Operating Temperature-55 to 125°C dt/dvInput Rise and Fall Time V CC = 4.5 to 5.5V (note 1)8ns/V74ACT2574/11DC SPECIFICATIONS1) Maximum test duration 2ms, one output loaded at time2) Incident wave switching is guaranteed on trasmission lines with impedances as low as 50ΩAC ELECTRICAL CHARACTERISTICS (C L = 50 pF, R L = 500 Ω, Input t r = t f = 3ns)(*) Voltage range is 5.0V ± 0.5VSymbolParameterTest ConditionValue UnitV CC (V)T A = 25°C -40 to 85°C -55 to 125°C Min.Typ.Max.Min.Max.Min.Max.V IH High Level Input Voltage4.5V O = 0.1 V or V CC -0.1V 2.0 1.5 2.0 2.0V5.5 2.01.52.02.0V IL Low Level Input Voltage4.5V O = 0.1 V or V CC -0.1V 1.50.80.80.85.5 1.50.80.80.8VV OHHigh Level Output Voltage4.5I O =-50 µA 4.4 4.49 4.4 4.45.5I O =-50 µA 5.4 5.495.4 5.44.5I O =-24 mA 3.86 3.76 3.7V5.5I O =-24 mA 4.864.764.7V OLLow Level Output Voltage4.5I O =50 µA 0.0010.10.10.15.5I O =50 µA 0.0010.10.10.14.5I O =24 mA 0.360.440.55.5I O =24 mA 0.360.440.5I I Input Leakage Cur-rent5.5V I = V CC or GND ± 0.1± 1± 1µA I OZ High Impedance Output Leakege Current5.5V I = V IH or V IL V O = V CC or GND ± 0.5± 5± 5mA I CCT Max I CC /Input 5.5V I = V CC - 2.1V 0.61.5 1.6mA I CC Quiescent Supply Current5.5V I = V CC or GND 44080µA I OLD Dynamic Output Current (note 1, 2)5.5V OLD = 1.65 V max 7550mA I OHDV OHD = 3.85 V min-75-50mA SymbolParameterTest ConditionValue UnitV CC (V)T A = 25°C -40 to 85°C -55 to 125°C Min.Typ.Max.Min.Max.Min.Max.t PLH t PHL Propagation DelayTime A, B to Y5.0(*) 5.08.09.09.0ns t PLH t PHL Propagation DelayTime SELECT to Y5.0(*)6.09.010.010.0ns t PZL t PZH Output EnableTime5.0(*) 5.08.09.09.0ns t PLZ t PHZ Output DisableTime5.0(*)6.09.010.010.0ns74ACT2575/11CAPACITIVE CHARACTERISTICSPD load. (Refer to Test Circuit). Average operating current can be obtained by the following equation. I CC(opr) = C PD x V CC x f IN + I CC /n (per circuit)TEST CIRCUITC L = 50pF or equivalent (includes jig and probe capacitance)R L = R 1 = 500Ω or equivalentR T = Z OUT of pulse generator (typically 50Ω)SymbolParameterTest ConditionValue UnitV CC (V)T A = 25°C -40 to 85°C -55 to 125°C Min.Typ.Max.Min.Max.Min.Max.C IN Input Capacitance 5.05pF C OUT OutputCapacitance5.08pF C PDPower Dissipation Capacitance (note 1)5.0f IN = 10MHz25pF TESTSWITCHt PLH , t PHLOpen t PZL , t PLZ 2V CC t PZH , t PHZOpen74ACT257WAVEFORM 1: PROPAGATION DELAYS FOR INVERTING CONDITIONS (f=1MHz; 50% duty cycle)WAVEFORM 2: PROPAGATION DELAYS FOR NON-INVERTING CONDITIONS (f=1MHz; 50% duty cycle)6/1174ACT2577/11WAVEFORM 3: OUTPUT ENABLE AND DISABLE TIME(f=1MHz; 50% duty cycle)元器件交易网74ACT257 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for theconsequences of use of such information nor for any infringement of patents or other rights of third parties which may result fromits use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specificationsmentioned in this publication are subject to change without notice. This publication supersedes and replaces all informationpreviously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices orsystems without express written approval of STMicroelectronics.© The ST logo is a registered trademark of STMicroelectronics© 2001 STMicroelectronics - Printed in Italy - All Rights ReservedSTMicroelectronics GROUP OF COMPANIESAustralia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia - Malta - MoroccoSingapore - Spain - Sweden - Switzerland - United Kingdom© 11/11。

IDT74FCT257TSO中文资料

The FCT157T, FCT257T/FCT2257T are high-speed quad 2-input multiplexers built using an advanced dual metal CMOS technology. Four bits of data from two sources can be selected using the common select input. The four buffered outputs present the selected data in the true (non-inverting)form.The FCT157T has a common, active-LOW, enable input.When the enable input is not active, all four outputs are held LOW. A common application of ‘FCT157T is to move data from two different groups of registers to a common bus.Another application is as a function generator. The ‘FCT157T can generate any four of the 16 different functions of two variables with one variable common.The FCT257T/FCT2257T have a common Output Enable (OE ) input. When OE is HIGH, all outputs are switched to a high-impedance state allowing the outputs to interface directly with bus-oriented systems.The FCT2257T has balanced output drive with current limiting resistors. This offers low ground bounce, minimal undershoot and controlled output fall times-reducing the need for external series terminating resistors. FCT2xxxT parts are plug-in replacements for FCTxxxT parts.MILITARY AND COMMERCIAL TEMPERATURE RANGESJUNE 19961©1996 Integrated Device Technology, Inc.6.62537/6The IDT logo is a registered trademark of Integrated Device Technology, Inc.•Common features:–Low input and output leakage ≤1µA (max.)–CMOS power levels–True TTL input and output compatibility – V OH = 3.3V (typ.)– V OL = 0.3V (typ.)–Meets or exceeds JEDEC standard 18 specifications –Product available in Radiation Tolerant and Radiation Enhanced versions–Military product compliant to MIL-STD-883, Class B and DESC listed (dual marked)–Available in DIP, SOIC, SSOP, QSOP, CERPACK and LCC packages•Features for FCT157T/257T:–Std., A, C and D speed grades–High drive outputs (-15mA I OH , 48mA I OL )•Features for FCT2257T:–Std., A, and C speed grades–Resistor outputs (-15mA I OH , 12mA I OL Com.)(-12mA I OH , 12mA I OL Mil.)–Reduced system switching noise157 Only257 OnlyAZ B –Z DI 1B –I I 0B –I I I 2537 drw 022537 drw 03FUNCTIONAL BLOCK DIAGRAMPIN CONFIGURATIONSLCC TOP VIEWG NN c o r O E *NC I I I Z BZ I 1I 0C I 1C Z C I 0DDIP/SOIC/QSOP/CERPACKTOP VIEWS I 0A VccI 1A Z A I 0B I 1B GNDZ E or OE*I 0C I 1C Z C I 0D I Z DB 1D * E for FCT157, OE for FCT257/FCT2257.6.62FAST CMOS QUAD 2-INPUT MULTIPLEXERMILITARY AND COMMERCIAL TEMPERATURE RANGES2537 tbl 01(1)NOTE:2537 tbl 021.H = HIGH Voltage LevelL = LOW Voltage Level X = Don’t CareZ = High Impedance(1)1.Stresses greater than those listed under ABSOLUTE MAXIMUM RAT-INGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. No terminal voltage may exceed V CC by +0.5V unless otherwise noted.2.Input and V CC terminals only.3.Outputs and I/O terminals only.1. This parameter is measured at characterization but not tested.DC ELECTRICAL CHARACTERISTICS OVER OPERATING RANGEFollowing Conditions Apply Unless Otherwise Specified:Commercial: T A = 0°C to +70°C, V CC = 5.0V ± 5%; Military: T A = –55°C to +125°C, V CC = 5.0V ± 10%2537 lnk 05NOTES:1.For conditions shown as Max. or Min., use appropriate value specified under Electrical Characteristics for the applicable device type.2.Typical values are at Vcc = 5.0V, +25°C ambient.3.Not more than one output should be shorted at one time. Duration of the short circuit test should not exceed one second.4.The test limit for this parameter is ±5µA at T A = –55°C.5.This parameter is guaranteed but not tested.6.63POWER SUPPLY CHARACTERISTICSNOTES:1.For conditions shown as Max. or Min., use appropriate value specified under Electrical Characteristics for the applicable device type.2.Typical values are at V CC = 5.0V, +25°C ambient.3.Per TTL driven input (V IN = 3.4V); all other inputs at V CC or GND.4.This parameter is not directly testable, but is derived for use in Total Power Supply calculations.5.Values for these conditions are examples of the I CC formula. These limits are guaranteed but not tested.6.I C = I QUIESCENT + I INPUTS + I DYNAMICI C = I CC + ∆I CC D H N T + I CCD (f o N o)I CC = Quiescent Current∆I CC = Power Supply Current for a TTL High Input (V IN = 3.4V)D H = Duty Cycle for TTL Inputs HighN T = Number of TTL Inputs at D HI CCD = Dynamic Current Caused by an Output Transition Pair (HLH or LHL)f o = Output FrequencyN o = Number of Outputs at f oAll currents are in milliamps and all frequencies are in megahertz.6.642537 tbl 092537 tbl 101.See test circuits and waveforms.2.Minimum limits are guaranteed but not tested on Propagation Delay.6.656.66TEST CIRCUITS AND WAVEFORMS TEST CIRCUITS FOR ALL OUTPUTSENABLE AND DISABLE TIMESPROPAGATION DELAYSET-UP, HOLD AND RELEASE TIMES PULSE WIDTH7.0V3V 1.5V 0V3V 1.5V 0V 3V 1.5V 0V 3V 1.5V 0V DATA INPUTPRESET CLEAR ETC.1.5V1.5VSAME PHASE INPUT TRANSITION3V 1.5V 0V 1.5V V OH OUTPUTOPPOSITE PHASE INPUT TRANSITION3V 1.5V 0VV OL 3V 1.5V 0V 3.5V0VV OLENABLEDISABLEV OH PRESET CLEARCLOCK ENABLEETC.C L =Load capacitance: includes jig and probe capacitance.R T =Termination resistance: should be equal to Z OUT of the PulseGenerator.2537 drw 042537 drw 052537 drw 062537 drw 07NOTES:1.Diagram shown for input Control Enable-LOW and input Control Disable-HIGH2.Pulse Generator for All Pulses: Rate ≤ 1.0MHz; t F ≤ 2.5ns; t R ≤ 2.5ns2537 drw 086.67ORDERING INFORMATION2537 drw 09X PackageX ProcessBlank B CommercialMIL-STD-883, Class BP D SO L E QPlastic DIP CERDIPSmall Outline ICLeadless Chip Carrier CERPACKQuarter-size Small Outline Package157T257T157AT 257AT 157CT 257CT 157DT 257DT Quad 2-Input Multiplexer Quad 2-Input Multiplexer (3-state)XXXX Device–55°C to +125°C 0°C to +70°C5474XXTemperature FCTIDTHigh DriveBalanced Drive Blank 2X Family。

SN74AVC16827资料

FEATURESDESCRIPTIONI OL - Output Current - mA-OutputVoltage-VOLVI OH - Output Current - mA-OutputVoltage-VOHVSN74AVC1682720-BIT BUFFER/DRIVERWITH3-STATE OUTPUTSSCES176I–DECEMBER1998–REVISED JUNE2005•Dynamic Drive Capability Is Equivalent toStandard Outputs With I OH and I OL of±24mA •Member of the Texas Instruments Widebus™at2.5-V V CCFamily•Overvoltage-Tolerant Inputs/Outputs Allow •EPIC™(Enhanced-Performance ImplantedMixed-Voltage-Mode Data Communications CMOS)Submicron Process•I off Supports Partial-Power-Down Mode •DOC™(Dynamic Output Control)CircuitOperationDynamically Changes Output Impedance,Resulting in Noise Reduction Without Speed•Latch-Up Performance Exceeds100mA PerDegradation JESD78,Class II•Less Than2-ns Maximum Propagation Delay•Package Options Include Plastic Thin Shrink at2.5-V and3.3-V V CC Small-Outline(DGG)and Thin VerySmall-Outline(DGV)PackagesA Dynamic Output Control(DOC™)circuit is implemented,which,during the transition,initially lowers the outputimpedance to effectively drive the load and,subsequently,raises the impedance to reduce noise.Figure1shows typical V OL vs I OL and V OH vs I OH curves to illustrate the output impedance and drive capability of the circuit.At the beginning of the signal transition,the DOC circuit provides a maximum dynamic drive that is equivalent to a high-drive standard-output device.For more information,refer to the TI application reports,AVC Logic Family Technology and Applications,literature number SCEA006,and Dynamic Output Control(DOC™)Circuitry Technology and Applications,literature number SCEA009.Figure1.Output Voltage vs Output CurrentThis20-bit noninverting buffer/driver is operational at1.2-V to3.6-V V CC,but is designed specifically for1.65-V to3.6-V V CC operation.The SN74AVC16827is composed of two10-bit sections with separate output-enable signals.For either10-bit buffer section,the two output-enable(1OE1and1OE2or2OE1and2OE2)inputs must both be low for the corresponding Y outputs to be active.If either output-enable input is high,the outputs of that10-bit buffer section are in the high-impedance state.To ensure the high-impedance state during power up or power down,OE should be tied to V CC through a pullup resistor;the minimum value of the resistor is determined by the current-sinking capability of the driver.This device is fully specified for partial-power-down applications using I off.The I off circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.The SN74AVC16827is characterized for operation from–40°C to85°C.Please be aware that an important notice concerning availability,standard warranty,and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.Widebus,EPIC,DOC are trademarks of Texas Instruments.PRODUCTION DATA information is current as of publication date.Copyright©1998–2005,Texas Instruments Incorporated Products conform to specifications per the terms of the TexasInstruments standard warranty.Production processing does notnecessarily include testing of all parameters.元器件交易网 TERMINAL ASSIGNMENTSDGG OR DGV PACKAGE(TOP VIEW)1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 2856 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 291OE1 1Y1 1Y2 GND 1Y3 1Y4 V CC 1Y5 1Y6 1Y7 GND 1Y8 1Y9 1Y10 2Y1 2Y2 2Y3 GND 2Y4 2Y5 2Y6 V CC 2Y7 2Y8 GND 2Y9 2Y10 2OE11OE2 1A1 1A2 GND 1A3 1A4 V CC 1A5 1A6 1A7 GND 1A8 1A9 1A10 2A1 2A2 2A3 GND 2A4 2A5 2A6 V CC 2A7 2A8 GND 2A9 2A10 2OE2SN74AVC1682720-BIT BUFFER/DRIVERWITH3-STATE OUTPUTSSCES176I–DECEMBER1998–REVISED JUNE2005FUNCTION TABLE(EACH10-BIT BUFFER/DRIVER)INPUTS OUTPUTYOE1OE2AL L L LL L H HH X X ZX H X Z 2元器件交易网2OE22OE11OE21OE11A11A21A31A41A51Y11Y21Y31Y41Y51A61A71A81A91A101Y61Y71Y81Y91Y102A12A22A32A42A52Y12Y22Y32Y42Y52A62A72A82A92A102Y62Y72Y82Y92Y10(1) This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.1Y12A12Y12OE12OE2To Nine Other Channels To Nine Other ChannelsSN74AVC1682720-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTSSCES176I–DECEMBER 1998–REVISED JUNE 2005LOGIC SYMBOL (1)LOGIC DIAGRAM (POSITIVE LOGIC)3元器件交易网Absolute Maximum Ratings (1)Recommended Operating ConditionsSN74AVC1682720-BIT BUFFER/DRIVERWITH 3-STATE OUTPUTSSCES176I–DECEMBER 1998–REVISED JUNE 2005over operating free-air temperature range (unless otherwise noted)MINMAX UNIT V CC Supply voltage range –0.5 4.6V V I Input voltage range (2)–0.5 4.6V V O Voltage range applied to any output in the high-impedance or power-off state (2)–0.5 4.6V V O Voltage range applied to any output in the high or low state (2)(3)–0.5V CC +0.5V I IK Input clamp current V I <0–50mA I OK Output clamp current V O <0–50mA I OContinuous output current±50mA Continuous current through each V CC or GND±100mA DGG package 64θJA Package thermal impedance (4)°C/W DGV package48T stg Storage temperature range–65150°C(1)Stresses beyond those listed under "absolute maximum ratings"may cause permanent damage to the device.These are stress ratings only,and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions"is not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2)The input negative-voltage and output ratings may be exceeded if the input and output current ratings are observed.(3)This value is limited to 4.6V maximum.(4)The package thermal impedance is calculated in accordance with JESD 51.MINMAX UNIT V CCSupply voltage1.2 3.6VV CC =1.2V V CCV CC =1.4V to 1.6V0.65×V CC V IHHigh-level input voltageV CC =1.65V to 1.95V 0.65×V CCVV CC =2.3V to 2.7V 1.7V CC =3V to 3.6V 2V CC =1.2V GND V CC =1.4V to 1.6V0.35×V CC V ILLow-level input voltageV CC =1.65V to 1.95V 0.35×V CCV V CC =2.3V to 2.7V 0.7V CC =3V to 3.6V0.8V I Input voltage 0 3.6V Active state 0V CC V OOutput voltageV 3-state0 3.6V CC =1.4V to 1.6V–2V CC =1.65V to 1.95V –4I OHSStatic high-level output current (1)mA V CC =2.3V to 2.7V –8V CC =3V to 3.6V –12V CC =1.4V to 1.6V2V CC =1.65V to 1.95V 4I OLSStatic low-level output current (1)mA V CC =2.3V to 2.7V 8V CC =3V to 3.6V12∆t/∆v Input transition rise or fall rate V CC =1.4V to 3.6V5ns/V T A Operating free-air temperature–4085°C (1)Dynamic drive capability is equivalent to standard outputs with I OH and I OL of ±24mA at 3.3-V V CC .See Figure 1for V OL vs I OL and V OH vs I OH characteristics.Refer to the TI application reports,AVC Logic Family Technology and Applications ,literature number SCEA006,and Dynamic Output Control (DOC™)Circuitry Technology and Applications ,literature number SCEA009.4元器件交易网Electrical CharacteristicsSwitching Characteristics Switching Characteristics(1) Operating CharacteristicsSN74AVC1682720-BIT BUFFER/DRIVERWITH3-STATE OUTPUTS SCES176I–DECEMBER1998–REVISED JUNE2005over recommended operating free-air temperature range(unless otherwise noted)PARAMETER TEST CONDITIONS V CC MIN TYP(1)MAX UNITI OHS=–100µA,V IH=V CC 1.4V to3.6V V CC–0.2I OHS=–2mA,V IH=0.91V 1.4V 1.05V OH I OHS=–4mA,V IH=1.07V 1.65V 1.2VI OHS=–8mA,V IH=1.7V 2.3V 1.75I OHS=–12mA,V IH=2V3V 2.3I OLS=100µA 1.4V to3.6V0.2I OLS=2mA,V IL=0.49V 1.4V0.4V OL I OLS=4mA,V IL=0.57V 1.65V0.45VI OLS=8mA,V IL=0.7V 2.3V0.55I OLS=12mA,V IL=0.8V3V0.7I I V I=V CC or GND 3.6V±2.5µA I off V I or V O=3.6V0±10µA I OZ V O=V CC or GND,V IH=V CC 3.6V±12.5µAI CC V I=V CC or GND,I O=0 3.6V40µA2.5V4Control inputs V I=V CC or GND3.3V4C i pF2.5V 2.5Data inputs V I=V CC or GND3.3V 2.52.5V 6.5C o Outputs V O=V CC or GND pF3.3V 6.5(1)Typical values are measured at T A=25°C.over recommended operating free-air temperature range(unless otherwise noted)(see Figure2through Figure5)V CC=1.5V V CC=1.8V V CC=2.5V V CC=3.3VV CC=1.2VFROM TO±0.1V±0.15V±0.2V±0.3V PARAMETER UNIT (INPUT)(OUTPUT)TYP MIN MAX MIN MAX MIN MAX MIN MAX t pd A Y30.4 3.20.9 2.90.8 1.90.5 1.7ns t en OE Y8.7 2.39.1 2.18 1.4 5.6 1.2 5.1ns t dis OE Y7.5 2.78.3 2.57.30.9 4.91 4.7nsT A =0°C to85°C,CL=0pFV CC=3.3VFROM TO±0.15V PARAMETER UNIT(INPUT)(OUTPUT)MIN MAX t pd A Y0.090.67ns(1)Texas Instruments SPICE simulation dataTA=25°CV CC=1.8V V CC=2.5V V CC=3.3VPARAMETER TEST CONDITIONS UNITTYP TYP TYPOutputs enabled313540 Power dissipationC pd C L=0,f=10MHz pFcapacitance Outputs disabled6665元器件交易网PARAMETER MEASUREMENT INFORMATIONV OH V OLFrom Output Under TestC L LOAD CIRCUITOpen Output Control (low-level enabling)Output Waveform 1S1 at 2 × V CC (see Note B)Output Waveform 2S1 at GND (see Note B)0 V0 VV CC 0 V0 VV CCV CCVOLTAGE WAVEFORMS SETUP AND HOLD TIMESVOLTAGE WAVEFORMS PULSE DURATIONVOLTAGE WAVEFORMS ENABLE AND DISABLE TIMESTiming InputData InputInputt pd t PLZ /t PZL t PHZ /t PZHOpen 2 × V CC GNDTEST S1NOTES: A.C L includes probe and jig capacitance.B.Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.C.All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z O = 50 Ω, t r ≤ 2 ns, t f ≤ 2 ns.D.The outputs are measured one at a time, with one transition per measurement.E.t PLZ and t PHZ are the same as t dis .F.t PZL and t PZH are the same as t en .G.t PLH and t PHL are the same as t pd .0 VV CCInputOutputVOLTAGE WAVEFORMS PROPAGATION DELAY TIMES× V CCV CCSN74AVC1682720-BIT BUFFER/DRIVERWITH 3-STATE OUTPUTSSCES176I–DECEMBER 1998–REVISED JUNE 2005V CC =1.2V AND 1.5V ±0.1VFigure 2.Load Circuit and Voltage Waveforms6元器件交易网PARAMETER MEASUREMENT INFORMATIONV OHV OL C L LOAD CIRCUITOpen Output Control (low-level enabling)Output Waveform 1S1 at 2 × V CC (see Note B)Output Waveform 2S1 at GND (see Note B)0 V0 VV CC 0 V0 VV CCV CCVOLTAGE WAVEFORMS SETUP AND HOLD TIMESVOLTAGE WAVEFORMS PULSE DURATIONVOLTAGE WAVEFORMS ENABLE AND DISABLE TIMESTiming InputData InputInputt pd t PLZ /t PZL t PHZ /t PZHOpen 2 × V CC GNDTEST S1NOTES: A.C L includes probe and jig capacitance.B.Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.C.All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z O = 50 Ω, t r ≤ 2 ns, t f ≤ 2 ns.D.The outputs are measured one at a time, with one transition per measurement.E.t PLZ and t PHZ are the same as t dis .F.t PZL and t PZH are the same as t en .G.t PLH and t PHL are the same as t pd .0 VV CCInputOutputVOLTAGE WAVEFORMS PROPAGATION DELAY TIMES× V CC V CCSN74AVC1682720-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTSSCES176I–DECEMBER 1998–REVISED JUNE 2005V CC =1.8V ±0.15VFigure 3.Load Circuit and Voltage Waveforms7元器件交易网PARAMETER MEASUREMENT INFORMATIONV OHV OL C L LOAD CIRCUITOpen Output Control (low-level enabling)Output Waveform 1S1 at 2 × V CC (see Note B)Output Waveform 2S1 at GND (see Note B)0 V0 VV CC 0 V0 VV CCV CCVOLTAGE WAVEFORMS SETUP AND HOLD TIMESVOLTAGE WAVEFORMS PULSE DURATIONVOLTAGE WAVEFORMS ENABLE AND DISABLE TIMESTiming InputData InputInputt pd t PLZ /t PZL t PHZ /t PZHOpen 2 × V CC GNDTEST S1NOTES: A.C L includes probe and jig capacitance.B.Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.C.All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z O = 50 Ω, t r ≤ 2 ns, t f ≤ 2 ns.D.The outputs are measured one at a time, with one transition per measurement.E.t PLZ and t PHZ are the same as t dis .F.t PZL and t PZH are the same as t en .G.t PLH and t PHL are the same as t pd .0 VV CCInputOutputVOLTAGE WAVEFORMS PROPAGATION DELAY TIMES× V CCV CCSN74AVC1682720-BIT BUFFER/DRIVERWITH 3-STATE OUTPUTSSCES176I–DECEMBER 1998–REVISED JUNE 2005V CC =2.5V ±0.2VFigure 4.Load Circuit and Voltage Waveforms8元器件交易网PARAMETER MEASUREMENT INFORMATIONV OH V OLC L LOAD CIRCUIT × V CCOpen Output Control (low-level enabling)Output Waveform 1S1 at 2 × V CC (see Note B)Output Waveform 2S1 at GND (see Note B)0 V0 VV CC0 V0 VV CC0 VV CCV CCV CCVOLTAGE WAVEFORMS SETUP AND HOLD TIMESVOLTAGE WAVEFORMS PROPAGATION DELAY TIMESVOLTAGE WAVEFORMS PULSE DURATIONVOLTAGE WAVEFORMS ENABLE AND DISABLE TIMESTiming InputData InputInputt pd t PLZ /t PZL t PHZ /t PZHOpen 2 × V CC GNDTEST S1NOTES: A.C L includes probe and jig capacitance.B.Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.C.All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z O = 50 Ω, t r ≤ 2 ns, t f ≤ 2 ns.D.The outputs are measured one at a time, with one transition per measurement.E.t PLZ and t PHZ are the same as t dis .F.t PZL and t PZH are the same as t en .G.t PLH and t PHL are the same as t pd .SN74AVC1682720-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTSSCES176I–DECEMBER 1998–REVISED JUNE 2005V CC =3.3V ±0.3VFigure 5.Load Circuit and Voltage Waveforms9元器件交易网PACKAGING INFORMATIONOrderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)74AVC16827DGGRE4ACTIVE TSSOP DGG 562000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM 74AVC16827DGVRE4ACTIVE TVSOP DGV 562000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AVC16827DGGR ACTIVE TSSOP DGG 562000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AVC16827DGVRACTIVETVSOPDGV562000Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS)or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge andbelief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.PACKAGE OPTION ADDENDUM5-Sep-2005Addendum-Page 1元器件交易网元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. 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CD74ACT257M96G4;CD74ACT258M96G4;CD74ACT257MG4;CD74ACT258MG4;中文规格书,Datasheet资料

Data sheet acquired from Harris SemiconductorSCHS248AFeatures•’AC257, ’ACT257. . . . . . . . . . . . .Non-Inverting Outputs •CD74ACT258 . . . . . . . . . . . . . . . . . . .Inverting Outputs •Buffered Inputs•Typical Propagation Delay- 4.4ns at V CC = 5V , T A = 25o C, C L = 50pF•Exceeds 2kV ESD Protection MIL-STD-883, Method 3015•SCR-Latchup-Resistant CMOS Process and Circuit Design •Speed of Bipolar FAST™/AS/S with Signiﬁcantly Reduced Power Consumption •Balanced Propagation Delays•AC Types Feature 1.5V to 5.5V Operation and Balanced Noise Immunity at 30% of the Supply •±24mA Output Drive Current -Fanout to 15 FAST™ ICs Drives 50Ω Transmission LinesPinoutCD54AC257, CD54ACT257(CERDIP)CD74AC257, CD74ACT257, CD74ACT258(PDIP , SOIC)TOP VIEWDescriptionThe ’AC257,’ACT257and CD74ACT258are quad 2-input multiplexers with three-state outputs that utilize Advanced CMOS Logic technology.Each of these devices selects four bits of data from two sources under the control of a common Select input (S).The Output Enable (OE)is active LOW.When OE is HIGH,all of the outputs (Y or Y)are in the high-impedance state regardless of all other input conditions.Moving data from two groups of registers to four common output buses is a common use of the ’AC257,’ACT257,and CD74ACT258.The state of the Select input determines the particular register from which the data comes.The ’AC257,’ACT257and CD74ACT258can also be used as function generators.14151691312111012345768S 1I 01I 11Y 2I 02I 1GND 2Y V CC 4I 04I 14Y 3I 03I 13YOE AC/ACT257ACT258ACT258AC/ACT257V CC 4I 04I 14Y 3I 03I 13YOE S1I 01I 11Y 2I 02I 1GND2Y Ordering InformationPART NUMBER TEMP.RANGE (o C)PACKAGE CD54AC257F3A -55 to 12516 Ld CERDIPCD74AC257E 0 to 70o C, -40 to 85,-55 to 12516 Ld PDIPCD74AC257M0 to 70o C, -40 to 85,-55 to 12516 Ld SOICCD54ACT257F3A -55 to 12516 Ld CERDIPCD74ACT257E 0 to 70o C, -40 to 85,-55 to 12516 Ld PDIPCD74ACT257M 0 to 70o C, -40 to 85,-55 to 12516 Ld SOICCD74ACT258E 0 to 70o C, -40 to 85,-55 to 12516 Ld PDIPCD74ACT258M 0 to 70o C, -40 to 85,-55 to 12516 Ld SOICNOTES:1.When ordering,use the entire part number.Add the suffix 96to obtain the variant in the tape and reel.2.Wafer and die for this part number is available which meets allelectrical specifications.Please contact your local TI sales office or customer service for ordering information.August 1998 - Revised May 2000CD54/74AC257, CD54/74ACT257,CD74ACT258Quad 2-Input Multiplexer with Three-State OutputsFunctional DiagramTRUTH TABLEOUTPUTENABLE SELECT INPUTDATA INPUTS 257OUTPUTS258OUTPUTSOE S I 0I 1Y Y H X X X Z Z L L L X L H L L H X H L L H X L L H LHXHHLH = High level voltage, L = Low level voltage, Z = High impedance (off) state, X = Don’t Care251114613103471294Y3Y2Y1Y1Y4Y3Y2YAC/ACT 257AC/ACT 2581I 02I 03I 04I 01I 12I 13I 14I 1S OE115Absolute Maximum Ratings Thermal InformationDC Supply Voltage, V CC. . . . . . . . . . . . . . . . . . . . . . . .-0.5V to 6V DC Input Diode Current, I IKFor V I < -0.5V or V I > V CC + 0.5V. . . . . . . . . . . . . . . . . . . . . .±20mA DC Output Diode Current, I OKFor V O < -0.5V or V O > V CC + 0.5V . . . . . . . . . . . . . . . . . . . .±50mA DC Output Source or Sink Current per Output Pin, I OFor V O > -0.5V or V O < V CC + 0.5V . . . . . . . . . . . . . . . . . . . .±50mA DC V CC or Ground Current, I CC or I GND (Note 3) . . . . . . . . .±100mA Operating ConditionsTemperature Range, T A . . . . . . . . . . . . . . . . . . . . . .-55o C to 125o C Supply Voltage Range, V CC (Note 4)AC T ypes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.5V to 5.5V ACT T ypes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V DC Input or Output Voltage, V I, V O . . . . . . . . . . . . . . . . .0V to V CC Input Rise and Fall Slew Rate, dt/dvAC T ypes, 1.5V to 3V . . . . . . . . . . . . . . . . . . . . . . . . .50ns (Max) AC T ypes, 3.6V to 5.5V. . . . . . . . . . . . . . . . . . . . . . . .20ns (Max) ACT T ypes, 4.5V to 5.5V. . . . . . . . . . . . . . . . . . . . . . .10ns (Max)Thermal Resistance (T ypical, Note 5)θJA (o C/W) PDIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . .___ SOIC Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . .___ Maximum Junction T emperature (Plastic Package) . . . . . . . . . .150o C Maximum Storage Temperature Range . . . . . . . . . .-65o C to 150o C Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . .300o CCAUTION:Stresses above those listed in“Absolute Maximum Ratings”may cause permanent damage to the device.This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this speciﬁcation is not implied.NOTES:3.For up to 4 outputs per device, add±25mA for each additional output.4.Unless otherwise specified, all voltages are referenced to ground.5.θJA is measured with the component mounted on an evaluation PC board in free air.DC Electrical SpeciﬁcationsPARAMETER SYMBOLTESTCONDITIONSV CC(V)25o C-40o C TO85o C-55o C TO125o CUNITS V I(V)I O(mA)MIN MAX MIN MAX MIN MAXAC TYPESHigh Level Input Voltage V IH-- 1.5 1.2- 1.2- 1.2-V3 2.1- 2.1- 2.1-V5.5 3.85- 3.85- 3.85-V Low Level Input Voltage V IL-- 1.5-0.3-0.3-0.3V3-0.9-0.9-0.9V5.5- 1.65- 1.65- 1.65V High Level Output Voltage V OH V IH or V IL-0.05 1.5 1.4- 1.4- 1.4-V-0.053 2.9- 2.9- 2.9-V-0.05 4.5 4.4- 4.4- 4.4-V-43 2.58- 2.48- 2.4-V-24 4.5 3.94- 3.8- 3.7-V-75(Note 6, 7)5.5-- 3.85---V-50(Note 6, 7)5.5---- 3.85-VLow Level Output VoltageV OLV IH or V IL0.05 1.5-0.1-0.1-0.1V 0.053-0.1-0.1-0.1V 0.05 4.5-0.1-0.1-0.1V 123-0.36-0.44-0.5V 24 4.5-0.36-0.44-0.5V 75(Note 6, 7) 5.5--- 1.65--V 50(Note 6, 7)5.5----- 1.65V Input Leakage Current I I V CC or GND - 5.5-±0.1-±1-±1µA Three-State Leakage CurrentI OZV IH or V IL V O =V CC or GND - 5.5-±0.5-±5-±10µAQuiescent Supply Current MSI I CCV CC or GND0 5.5-8-80-160µAACT TYPESHigh Level Input Voltage V IH -- 4.5 to 5.52-2-2-V Low Level Input Voltage V IL -- 4.5 to 5.5-0.8-0.8-0.8V High Level Output VoltageV OHV IH or V IL-0.05 4.5 4.4- 4.4- 4.4-V -24 4.5 3.94- 3.8- 3.7-V -75(Note 6, 7) 5.5-- 3.85---V -50(Note 6, 7)5.5---- 3.85-V Low Level Output VoltageV OLV IH or V IL0.05 4.5-0.1-0.1-0.1V 24 4.5-0.36-0.44-0.5V 75(Note 6, 7) 5.5--- 1.65--V 50(Note 6, 7)5.5----- 1.65V Input Leakage Current I I V CC or GND - 5.5-±0.1-±1-±1µA Three-State or Leakage CurrentI OZV IH or V IL V O =V CC or GND - 5.5-±0.5-±5-±10µAQuiescent Supply Current MSII CC V CC or GND 0 5.5-8-80-160µA Additional Supply Current per Input Pin TTL Inputs High 1 Unit Load ∆I CCV CC -2.1-4.5 to5.5-2.4-2.8-3mANOTES:6.Test one output at a time for a 1-second maximum duration.Measurement is made by forcing current and measuring voltage to minimize power dissipation.7.Test verifies a minimum 50Ω transmission-line-drive capability at 85o C, 75Ω at 125o C.DC Electrical Speciﬁcations(Continued)PARAMETERSYMBOL TEST CONDITIONSV CC (V)25o C -40o C TO 85o C -55o C TO 125o C UNITS V I (V)I O (mA)MIN MAX MIN MAX MIN MAXACT Input Load TableINPUT UNIT LOADData0.83S 1.27OE 1.27NOTE:Unit load is∆I CC limit specified in DC Electrical SpecificationsT able, e.g., 2.4mA max at 25o C.Switching Speciﬁcations Input t r, t f = 3ns, C L= 50pF (Worst Case)PARAMETER SYMBOL V CC (V)-40o C TO 85o C-55o C TO 125o CUNITS MIN TYP MAX MIN TYP MAXAC TYPESPropagation Delay, In to YAC/ACT257t PLH, t PHL 1.5--106--117ns3.3(Note 9)3.3-11.8 3.3-13ns5(Note 10)2.4-8.5 2.3-9.3nsPropagation Delay, S to YAC/ACT257t PLH, t PHL 1.5--153--168ns3.34.8-17.1 4.7-18.8ns5 3.5-12.2 3.4-13.4nsPropagation Delay, OE to YAC/ACT257t PLZ, t PHZ,t PZL, t PZH1.5--167--184ns3.3 5.3-18.7 5.2-20.6ns5 3.8-13.4 3.7-14.7nsPropagation Delay, In to Y’AC/CD74ACT258t PLH, t PHL 1.5--91--100ns3.3 2.9-10.2 2.8-11.2ns5 2.1-7.32-8nsPropagation Delay, S to Y’AC/CD74ACT258t PLH, t PHL 1.5--153--168ns3.34.8-17.1 4.7-18.8ns5 3.5-12.2 3.4-13.4nsPropagation Delay, OE to Y’AC/CD74ACT258t PLZ, t PHZ,t PZL, t PZH1.5--167--184ns3.3 5.3-18.7 5.2-20.6ns5 3.8-13.4 3.7-14.7nsThree-State OutputCapacitanceC O---15--15pF Input Capacitance C I---10--10pFPower Dissipation Capacitance C PD(Note 11)--130--130-pF ACT TYPESPropagation Delay, In to YAC/ACT257t PLH, t PHL5(Note 10)2.8-9.7 2.7-10.7nsPropagation Delay,S to YAC/ACT257t PLH, t PHL54-14 3.9-15.4nsPropagation Delay,OE to Y AC/ACT257t PLZ , t PHZ ,t PZL , t PZH 54.1-14.64-16.1nsPropagation Delay,In to Y’AC/CD74ACT258t PLH , t PHL5 2.4-8.5 2.3-9.3nsPropagation Delay,S to Y’AC/CD74ACT258t PLH , t PHL54-14 3.9-15.4nsPropagation Delay,OE to Y’AC/CD74ACT258t PLZ , t PHZ ,t PZL , t PZH5 4.1-14.64-16.1nsThree-State Output Capacitance C O ---15--15pF Input CapacitanceC I ---10--10pF Power Dissipation Capacitance C PD (Note 11)--130--130-pFNOTES:8.Limits tested 100%.9.3.3V Min is at 3.6V, Max is at 3V.10.5V Min is at 5.5V, Max is at 4.5V.11.C PD is used to determine the dynamic power consumption per multiplexer.AC: P D = C PD V CC 2 f i +∑ (C L V CC 2 f o )ACT:P D =C PD V CC 2f i +∑(C L V CC 2f o )+V CC ∆I CC where f i =input frequency,f o =output frequency,C L =output load capacitance,V CC = supply voltage.FIGURE 1.THREE-STATE PROPAGATION DELAY TIMES AND TEST CIRCUITSwitching Speciﬁcations Input t r , t f = 3ns, C L = 50pF (Worst Case)(Continued)PARAMETERSYMBOL V CC (V)-40o C TO 85o C-55o C TO 125o CUNITS MIN TYP MAX MIN TYP MAX DUT WITH THREE-STATE OUTPUTINPUT LEVEL90%V S 10%GNDt f = 3nst PZLt PZHt PLZt PHZOUTPUTS ENABLEDOUTPUTS DISABLEDOUTPUT:LOW TO OFF TO LOWOUTPUT:HIGH TO OFF TO HIGHOTHER INPUTS (TIED HIGH OR LOW)OUTPUT DISABLEC L 50pF500Ω†R L 500Ω†R LOUT V S0.2V CCV OL (≠GND)V OH (≠V CC )0.8 V CC V SGND (t PHZ,t PZH )OUTPUTS ENABLEDOPEN (t PHL,t PLH )2 V CC (t PLZ,t PZL )(OPEN DRAIN)t r = 3ns OUTPUT DISABLE†FOR AC SERIES ONL Y: WHEN V CC = 1.5V , R L = 1k ΩFIGURE 2.INPUTS OR SELECT TO OUTPUT PROPAGATIONDELAYS (AC/ACT257)FIGURE 3.SELECT TO OUTPUT PROPAGATION DELAYS(CD74ACT258)90%10%t f = 3nst r = 3ns nI 0, nI 1, St PLHt PHLV SYINPUT LEVELGNDV S INPUT LEVEL V SSt PLHt PHLV SYDUT OUTPUTR L (NOTE)OUTPUT LOAD500ΩC L 50pFNOTE:For AC Series Only: When V CC = 1.5V , R L = 1k Ω.FIGURE 4.PROPAGATION DELAY TIMESACACT Input LevelV CC 3V Input Switching Voltage, V S 0.5 V CC 1.5V Output Switching Voltage, V S0.5 V CC0.5 V CCIMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI)reserve the right to make corrections,modifications,enhancements,improvements,and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems 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Incorporatedht t p ://oPACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)CD54AC257F3A ACTIVE CDIP J161TBD A42N/A for Pkg Type CD54ACT257F3A ACTIVE CDIP J161TBD A42N/A for Pkg Type CD74AC257E ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeCD74AC257EE4ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeCD74AC257M ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD74AC257M96ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD74AC257M96E4ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD74AC257M96G4ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD74AC257ME4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD74AC257MG4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD74ACT257E ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeCD74ACT257EE4ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeCD74ACT257M ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD74ACT257M96ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD74ACT257M96E4ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD74ACT257M96G4ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD74ACT257ME4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD74ACT257MG4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMCD74ACT258M ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARCD74ACT258M96ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARCD74ACT258M96E4ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARCD74ACT258M96G4ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARCD74ACT258ME4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEARCD74ACT258MG4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-2-260C-1YEAR(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.分销商库存信息:TICD74ACT257M96G4CD74ACT258M96G4CD74ACT257MG4 CD74ACT258MG4。

74ACTQ00MTC中文资料

© 2005 Fairchild Semiconductor Corporation DS010888August 1990Revised February 200574ACTQ00 Quiet Series ¥ Quad 2-Input NAND Gate74ACTQ00Quiet Series ¥ Quad 2-Input NAND GateGeneral DescriptionThe ACTQ00 contains four 2-input NAND gates and uti-lizes Fairchild FACT Quiet Series ¥ technology to guaran-tee quiet output switching and improve dynamic threshold performance FACT Quiet Series features GTO ¥ output control and undershoot corrector in addition to a split ground bus for superior ACMOS performance.Featuress I CC reduced by 50%s Guaranteed simultaneous switching noise level and dynamic threshold performance s Improved latch-up immunity s Outputs source/sink 24 mA s Has TTL-compatible inputsOrdering Code:Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.Logic SymbolIEEE/IECConnection DiagramPin DescriptionsFACT ¥, Quiet Series ¥, FACT Quiet Series ¥, and GTO ¥ are trademarks of Fairchild Semiconductor Corporation.Order Number Package NumberPackage Description74ACTQ00SC M14A 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow 74ACTQ00MTC MTC1414-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide 74ACTQ00PCN14A14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" WidePin Names Description A n , B n Inputs O nOutputs 274A C T Q 00Absolute Maximum Ratings (Note 1)Recommended Operating ConditionsNote 1: Absolute maximum ratings are those values beyond which damage to the device may occur. The databook specifications should be met, with-out exception, to ensure that the system design is reliable over its power supply, temperature, and output/input loading variables. Fairchild does not recommend operation outside databook specifications.DC Electrical CharacteristicsNote 2: All outputs loaded; thresholds on input associated with output under test.Note 3: Maximum test duration 2.0 ms, one output loaded at a time.Note 4: DIP package.Note 5: Max number of outputs defined as (n). Data inputs are 0V to 3V. One output @ GND.Note 6: Max number of data inputs (n) switching. (n 1) inputs switching 0V to 3V. Input-under-test switching: 3V to threshold (V ILD ),0V to threshold (V IHD ), f 1 MHz.Supply Voltage (V CC ) 0.5V to 7.0VDC Input Diode Current (I IK )V I 0.5V 20 mA V I V CC 0.5V 20 mADC Input Voltage (V I )0.5V to V CC 0.5VDC Output Diode Current (I OK )V O 0.5V 20 mA V O V CC 0.5V 20 mADC Output Voltage (V O ) 0.5V to V CC 0.5VDC Output Source or Sink Current (I O )r 50 mA DC V CC or Ground Current per Output Pin (I CC or I GND )r 50 mAStorage Temperature (T STG ) 65q C to 150q CDC Latch-up Sourceor Sink Current r 300 mA Junction Temperature (T J )PDIP140q CSupply Voltage (V CC ) 4.5V to 5.5V Input Voltage (V I )0V to V CC Output Voltage (V O )0V to V CCOperating Temperature (T A ) 40q C to 85q CMinimum Input Edge Rate ('V/'t)V IN from 0.8V to 2.0V 125 mV/nsV CC @ 4.5V, 5.5VSymbol ParameterV CC T A 25q C T A 40q C to 85q C Units Conditions (V)Typ Guaranteed LimitsV IH Minimum HIGH Level 4.5 1.5 2.0 2.0V V OUT 0.1V Input Voltage 5.5 1.5 2.0 2.0or V CC 0.1V V IL Maximum LOW Level 4.5 1.50.80.8V V OUT 0.1V Input Voltage 5.5 1.50.80.8or V CC 0.1V V OHMinimum HIGH Level 4.5 4.49 4.4 4.4VI OUT 50 P A Output Voltage5.5 5.495.4 5.4V IN V IL or V IH4.5 3.86 3.76VI OH 24 mA 5.54.864.76I OH 24 mA (Note 2)V OLMaximum LOW Level 4.50.0010.10.1VI OUT 50 P A Output Voltage5.50.0010.10.1V IN V IL or V IH4.50.360.44V I OL 24 mA5.50.360.44I OL 24 mA (Note 2)I IN Maximum Input Leakage Current 5.5r 0.1r 1.0P A V I V CC , GND I CCT Maximum I CC /Input 5.50.61.5mA V I V CC2.1V I OLD Minimum Dynamic 5.575mA V OLD 1.65V Max I OHD Output Current (Note 3)5.5 75mA V OHD 3.85V Min I CC Maximum Quiescent Supply Current 5.5 2.020.0P A V IN V CC or GND V OLP Quiet Output Maximum Dynamic 5.01.11.5VFigure 1, Figure 2V OL(Note 4)(Note 5)V OLV Quiet Output Minimum Dynamic 5.0 0.6 1.2V Figure 1, Figure 2V OL(Note 4)(Note 5)V IHD Minimum HIGH Level 5.0 1.9 2.2V (Note 4)(Note 6)Dynamic Input Voltage V ILDMaximum LOW Level 5.01.20.8V(Note 4)(Note 6)Dynamic Input Voltage74ACTQ00AC Electrical CharacteristicsNote 7: Voltage Range 5.0 is 5.0V r 0.5V.Note 8: Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH-to-LOW (t OSHL ) or LOW-to-HIGH (t OSLH ). Parameter guaranteed by design.CapacitanceV CCT A 25q C T A 40q C to 85q CSymbol Parameter(V)C L 50 pFC L 50 pF Units(Note 7)Min TypMax Min Max t PLH Propagation Delay 5.0 2.07.5 2.08.0ns Data to Output t PHL Propagation Delay 5.0 2.07.5 2.08.0ns Data to Output t OSHL Output to Output 5.00.5 1.01.0ns t OSLHSkew (Note 8)Symbol ParameterTyp Units ConditionsC IN Input Capacitance4.5pF V CC OPEN C PDPower Dissipation Capacitance74pFV CC 5.0V 474A C T Q 00FACT ¥Noise CharacteristicsThe setup of a noise characteristics measurement is critical to the accuracy and repeatability of the tests. The following is a brief description of the setup used to measure the noise characteristics of FACT.Equipment:Hewlett Packard Model 8180A Word Generator PC-163A Test FixtureTektronics Model 7854 OscilloscopeProcedure:1.Verify Test Fixture Loading: Standard Load 50 pF,500:.2.Deskew the HFS generator so that no two channelshave greater than 150 ps skew between them. This requires that the oscilloscope be deskewed first. It is important to deskew the word generator channels before testing. This will ensure that the outputs switch simultaneously.3.Terminate all inputs and outputs to ensure proper load-ing of the outputs and that the input levels are at the correct voltage.4.Set the HFS generator to toggle all but one output at afrequency of 1 MHz. Greater frequencies will increase DUT heating and effect the results of the measure-ment.5.Set the HFS generator input levels at 0V LOW and 3VHIGH for ACT devices and 0V LOW and 5V HIGH for AC devices. Verify levels with an oscilloscopeNote 9: V OHV and V OLP are measured with respect to ground reference.Note 10: Input pulses have the following characteristics: f 1 MHz, t r 3ns,t f 3 ns, skew 150 ps.FIGURE 1. Quiet Output Noise Voltage WaveformsV OLP /V OLV and V OHP /V OHV :•Determine the quiet output pin that demonstrates the greatest noise levels. The worst case pin will usually be the furthest from the ground pin. Monitor the output volt-ages using a 50: coaxial cable plugged into a standard SMB type connector on the test fixture. Do not use an active FET probe.•Measure V OLP and V OLV on the quiet output during the worst case transition for active and enable. Measure V OHP and V OHV on the quiet output during the worst case active and enable transition.•Verify that the GND reference recorded on the oscillo-scope has not drifted to ensure the accuracy and repeat-ability of the measurements.V ILD and V IHD :•Monitor one of the switching outputs using a 50: coaxial cable plugged into a standard SMB type connector on the test fixture. Do not use an active FET probe.•First increase the input LOW voltage level, V IL , until the output begins to oscillate or steps out a min of 2 ns.Oscillation is defined as noise on the output LOW level that exceeds V IL limits, or on output HIGH levels that exceed V IH limits. The input LOW voltage level at which oscillation occurs is defined as V ILD .•Next decrease the input HIGH voltage level.V IH until the output begins to oscillate or steps out a mine of 2 ns.Oscillation is defined as noise on the output LOW level that exceeds V IL limits, or on output HIGH levels that exceed V IH limits. The input HIGH voltage level at which oscillation occurs is defined as V IHD .•Verify that the GND reference recorded on the oscillo-scope has not drifted to ensure the accuracy and repeat-ability of the measurements.FIGURE 2. Simultaneous Switching Test Circuit 74ACTQ00Physical Dimensions inches (millimeters) unless otherwise noted14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" NarrowPackage Number M14A 674A C T Q 00Physical Dimensionsinches (millimeters) unless otherwise noted (Continued)14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm WidePackage Number MTC14774ACTQ00 Quiet Series ¥ Quad 2-Input NAND GatePhysical Dimensions inches (millimeters) unless otherwise noted (Continued)14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" WidePackage Number N14AFairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.LIFE SUPPORT POLICYFAIRCHILD ’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:1.Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be rea-sonably expected to result in a significant injury to the user.2. A critical component in any component of a life support device or system whose failure to perform can be rea-sonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.。

宇泰UT-2577 2578说明书

三、连接器和信号：接线端子引脚分配6RS-232RS-485/422SC SC/FC 7RS-232RS-232-15KV ESD 115.2Kbps 8DC9-48V 200mA9RS-485/42215KV ESD 32、电气接口：采用接线柱连接器采用接线柱连接器光纤接口：型接口（可选接口）、接口特性：标准三线接口±（防静电）保护支持速率最高、输入电压：、接口特性：±（防静电）保护支持多达点轮询环境每线的浪涌保护，600W UT-2577/25781310nm()1310nm()SC :MODEM使用一个组合的光发射器和光接收器，光的波长为多模，单模，发射和接收采用标准的接口。

几乎所有尺寸的多模光纤电缆都可以使用，包括：或单模或在点对点状态下，两个光纤只要用单根光纤就可以通信。

8.3/125,8.7/125,9/12510/125m μ50/125,62.5/125,100/140m;μ四、光纤的连接接线端子(PIN)12345678910T/R+T/R-RXD+RXD-TXD RXD GND VCC GND ETH信号定义发发(A+)(B-)收收发送）接收）地线）电源输入（）地线大地(A+)(B-)RS-232(RS-232(RS-232(DC9-48V RS-422全双工接线RS-485半双工接线RS-485(A+)RS-485(B-)空空五、信号及电源指示灯TXD RXD PWR ：光纤接口数据发送指示：光纤接口数据接收指示：电源指示六、应用及连接示意图1、点对点半双工方式RS-232RS-485UT-2577/2578UT-2577/2578RS-485设备2、点对点全双工方式RS-232OR RS-422UT-2577/2578UT-2577/2578RS-422设备TxRx12341234TxRx 12341234Tx RxTxRx 123Hihg-Speed RS-232/RS-485/RS-422Fiber Optic Modem UT-2577/2578使用说明书UT-2577/2578RS-232RS-485RS -422MODEM RTU HOST SCADA RS-232RS-485RS-422RS-232RS-485RS-4222()RS-4854()RS-422UT-2577/2578RS-485TXD SD MODEM 420RS-232115.2KBPS RS-485/RS-422460KBPS RS-232RS-485/RS-422RS-232RS-485/422EMI/RFT UT-2577/2578RS-485/RS-422SC 是多功能的支持异步，，通信接口的光纤，是连接远程终端单元（）到主机（）或分布式数据采集系统（）控制器的最佳选择。

TL2575_0701中文资料

FEATURESAPPLICATIONSNCNCOUTPUTNCGNDNCFEEDBACKNCN (PDIP) PACKAGE(TOP VIEW)KTT (TO-263) PACKAGE(TOP VIEW)12345GNDON/OFFFEEDBACKGNDOUTPUTV INFEEDBACKKV (TO-220 STAGGERED LEADS) PACKAGE(TOP VIEW)(SIDE VIEW)Pins 1, 3, 5Pins 2, 4 DESCRIPTION/ORDERING INFORMATION1-A SIMPLE STEP-DOWN SWITCHING VOLTAGE REGULATORSSLVS638B–MAY2006–REVISED JANUARY2007•Fixed3.3-V,5-V,12-V,and15-V Options With±5%Regulation(Max)Over Line,Load,andTemperature Conditions•Adjustable Option With a Range of1.23V to37V(57V for HV Version)and±4%Regulation(Max)Over Line,Load,andTemperature Conditions•Specified1-A Output Current•Wide Input Voltage Range…4.75V to40V(60V for HV Version)•Require Only Four External Components(Fixed Versions)and Use Readily AvailableStandard Inductors•52-kHz(Typ)Fixed-Frequency InternalOscillator•TTL Shutdown Capability With50-µA(Typ)Standby Current•High Efficiency…as High as88%(Typ)•Thermal Shutdown and Current-LimitProtection With Cycle-by-Cycle CurrentLimiting•Simple High-Efficiency Step-Down(Buck)Regulators•Pre-Regulators for Linear Regulators•On-Card Switching Regulators•Positive-to-Negative Converters(Buck-Boost)The TL2575and TL2575HV greatly simplify the design of switching power supplies by conveniently providing all the active functions needed for a step-down(buck)switching regulator in an integrated circuit.Accepting a wide input voltage range of up to60V(HV version)and available in fixed output voltages of3.3V,5V,12V,15V,or an adjustable-output version,the TL2575and TL2575HV have an integrated switch capable of delivering1A of load current,with excellent line and load regulation.The device also offers internal frequency compensation,a fixed-frequency oscillator,cycle-by-cycle current limiting,and thermal shutdown.In addition,a manual shutdown is available via an external ON/OFF pin.The TL2575and TL2575HV represent superior alternatives to popular three-terminal linear regulators.Due to their high efficiency,the devices significantly reduce the size of the heatsink and,in many cases,no heatsink is required.Optimized for use with standard series of inductors available from several different manufacturers,the TL2575and TL2575HV greatly simplify the design of switch-mode power supplies by requiring a minimal addition of only four to six external components for operation.The TL2575and TL2575HV are characterized for operation over the virtual junction temperature range of–40°C to125°C.Please be aware that an important notice concerning availability,standard warranty,and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.PowerPAD,PowerFLEX are trademarks of Texas Instruments.PRODUCTION DATA information is current as of publication date.Copyright©2006–2007,Texas Instruments Incorporated Products conform to specifications per the terms of the TexasInstruments standard warranty.Production processing does notnecessarily include testing of all parameters.1-A SIMPLE STEP-DOWN SWITCHING VOLTAGE REGULATORSSLVS638B–MAY 2006–REVISED JANUARY 2007ORDERING INFORMATION (1)TL2575(V IN(MAX)=40V)V O T JPACKAGE (2)ORDERABLE PART NUMBER TOP-SIDE MARKING (NOM)PDIP –NTube of 25TL2575-33IN TL2575-33IN 3.3VTO-263–KTT Reel of 500TL2575-33IKTTR TL2575-33I TO-220–KV Tube of 50TL2575-33IKV TL2575-33I PDIP –NTube of 25TL2575-05IN TL2575-05IN 5VTO-263–KTT Reel of 500TL2575-05IKTTR TL2575-05I TO-220–KV Tube of 50TL2575-05IKV TL2575-05I PDIP –NTube of 25TL2575-12IN TL2575-12IN –40°C to 125°C12VTO-263–KTT Reel of 500TL2575-12IKTTR TL2575-12I TO-220–KV Tube of 50TL2575-12IKV TL2575-12I PDIP –NTube of 25TL2575-15IN TL2575-15IN 15VTO-263–KTT Reel of 500TL2575-15IKTTR TL2575-15I TO-220–KV Tube of 50TL2575-15IKV TL2575-15I PDIP –NTube of 25TL2575-ADJIN TL2575-ADJIN ADJTO-263–KTT Reel of 500TL2575-ADJIKTTR TL2575ADJI TO-220–KVTube of 50TL2575-ADJIKVTL2575ADJI(1)For the most current package and ordering information,see the Package Option Addendum at the end of this document,or see the TI web site at .(2)Package drawings,standard packing quantities,thermal data,symbolization,and PCB design guidelines are available at /sc/package.ORDERING INFORMATION (1)TL2575HV (V IN(MAX)=60V)V O T JPACKAGE (2)ORDERABLE PART NUMBER TOP-SIDE MARKING (NOM)PDIP –NTube of 25TL2575HV-33IN TL2575HV-33IN 3.3VTO-263–KTT Reel of 500TL2575HV-33IKTTR 2BHV-33I TO-220–KV Tube of 50TL2575HV-33IKV TL2575HV-33I PDIP –NTube of 25TL2575HV-05IN TL2575HV-05IN 5VTO-263–KTT Reel of 500TL2575HV-05IKTTR 2BHV-05I TO-220–KV Tube of 50TL2575HV-05IKV TL2575HV-05I PDIP –NTube of 25TL2575HV-12IN TL2575HV-12IN –40°C to 125°C12VTO-263–KTT Reel of 500TL2575HV-12IKTTR 2BHV-12I TO-220–KV Tube of 50TL2575HV-12IKV TL2575HV-12I PDIP –NTube of 25TL2575HV-15IN TL2575HV-15IN 15VTO-263–KTT Reel of 500TL2575HV-15IKTTR 2BHV-15I TO-220–KV Tube of 50TL2575HV-15IKV TL2575HV-15I PDIP –NTube of 25TL2575HV-ADJIN TL2575HV-ADJIN ADJTO-263–KTT Reel of 500TL2575HV-ADJIKTTR 2BHV-ADJI TO-220–KVTube of 50TL2575HV-ADJIKVTL2575HVADJI(1)For the most current package and ordering information,see the Package Option Addendum at the end of this document,or see the TI web site at .(2)Package drawings,standard packing quantities,thermal data,symbolization,and PCB design guidelines are available at /sc/package.2Submit Documentation FeedbackUnregulatedDC Input5 V: R2 = 3.1 k W 12 V: R2 = 8.84 k W 15 V: R2 = 11.3 k WADJ: R1 = Open, R2 = 0 Ω7-V to 40-V UnregulatedDC Input5-VRegulated Output 1-A Load1-A SIMPLE STEP-DOWN SWITCHING VOLTAGE REGULATORSSLVS638B–MAY 2006–REVISED JANUARY 2007FUNCTIONAL BLOCK DIAGRAMA.Pin numbers are for the KTT (TO-263)package.A.Pin numbers are for the KTT (TO-263)package.Figure 1.Typical Application Circuit (Fixed Version)3Submit Documentation FeedbackAbsolute Maximum Ratings (1)Package Thermal Data (1)Recommended Operating Conditions1-A SIMPLE STEP-DOWN SWITCHING VOLTAGE REGULATORSSLVS638B–MAY 2006–REVISED JANUARY 2007over operating free-air temperature range (unless otherwise noted)MINMAX UNIT TL2575HV 60V INSupply voltageV TL257542ON/OFF input voltage range –0.3V IN V Output voltage to GND (steady state)–1V T J Maximum junction temperature 150°C T stg Storage temperature range–65150°C(1)Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device.These are stress ratings only,and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.PACKAGE BOARD θJA θJC θJP (2)PDIP (N)High K,JESD 51-767°C/W 57°C/W TO-263(KTT)High K,JESD 51-526.5°C/W 31.8°C/W 0.38°C/W TO-220(KV)High K,JESD 51-526.5°C/W31.8°C/W0.38°C/W (1)Maximum power dissipation is a function of T J (max),θJA ,and T A .The maximum allowable power dissipation at any allowable ambient temperature is P D =(T J (max)–T A )/θJA .Operating at the absolute maximum T J of 150°C can affect reliability.(2)For packages with exposed thermal pads,such as QFN,PowerPAD™,or PowerFLEX™,θJP is defined as the thermal resistance between the die junction and the bottom of the exposed pad.MINMAX UNIT TL2575HV 4.7560V IN Supply voltageV TL25754.7540T JOperating virtual junction temperature–40125°C4Submit Documentation FeedbackTL2575Electrical Characteristics1-A SIMPLE STEP-DOWN SWITCHING VOLTAGE REGULATORSSLVS638B–MAY 2006–REVISED JANUARY 2007I LOAD =200mA,V IN =12V for 3.3-V,5-V,and adjustable versions,V IN =25V for 12-V version,V IN =30V for 15-V version (unless otherwise noted)(see Figure 2)TL2575PARAMETERTEST CONDITIONST J UNITMIN TYP MAX V IN =12V,I LOAD =0.2A25°C 3.234 3.3 3.366TL2575-3325°C 3.168 3.33.4324.75V ≤V IN ≤40V,0.2A ≤I LOAD ≤1A Full range 3.135 3.465V IN =12V,I LOAD =0.2A25°C 4.95 5.1TL2575-0525°C 4.85 5.28V ≤V IN ≤40V,0.2A ≤I LOAD ≤1A Full range 4.75 5.25V OUTOutput voltageV V IN =25V,I LOAD =0.2A 25°C 11.761212.24TL2575-1225°C 11.521212.4815V ≤V IN ≤40V,0.2A ≤I LOAD ≤1A Full range 11.412.6V IN =30V,I LOAD =0.2A25°C 14.71515.3TL2575-1525°C 14.41515.618V ≤V IN ≤40V,0.2A ≤I LOAD ≤1A Full range 14.251515.75V IN =12V,V OUT =5V,25°C 1.217 1.23 1.243I LOAD =0.2AFeedback voltage TL2575-ADJV 25°C 1.193 1.23 1.2678V ≤V IN ≤40V,V OUT =5V,0.2A ≤I LOAD ≤1A Full range1.181.28TL2575-33V IN =12V,I LOAD =1A 75TL2575-05V IN =12V,I LOAD =1A 77TL2575-12V IN =15V,I LOAD =1A 88ηEfficiency25°C %TL2575-15V IN =18V,I LOAD =1A 88V IN =12V,V OUT =5V,TL2575-ADJ77I LOAD =1A25°C 50100I IB Feedback bias current V OUT =5V (ADJ version only)nA Full range 50025°C 475258f o Oscillator frequency (1)kHz Full range426325°C 0.9 1.2V SATSaturation voltage I OUT =1A (2)V Full range 1.4Maximum duty cycle (3)25°C 9398%25°C 1.7 2.83.6I CL Switch peak current (1)(2)A Full range1.34V IN =40(4),Output =0V 2I L Output leakage current 25°C mA V IN =40(4),Output =–1V 7.530I Q Quiescent current (4)25°C 510mA I STBY Standby quiescent currentOFF (ON/OFF =5V)25°C50200µA (1)In the event of an output short or an overload condition,self-protection features lower the oscillator frequency to ∼18kHz and the minimum duty cycle from 5%to ∼2%.The resulting output voltage drops to ∼40%of its nominal value,causing the average power dissipated by the IC to lower.(2)Output is not connected to diode,inductor,or capacitor.Output is sourcing current.(3)FEEDBACK is disconnected from output and connected to 0V.(4)To force the output transistor off,FEEDBACK is disconnected from output and connected to 12V for the adjustable,3.3-V,and 5-V versions and to 25V for the 12-V and 15-V versions.5Submit Documentation Feedback1-A SIMPLE STEP-DOWN SWITCHING VOLTAGE REGULATORSSLVS638B–MAY 2006–REVISED JANUARY 2007TL2575Electrical Characteristics (continued)I LOAD =200mA,V IN =12V for 3.3-V,5-V,and adjustable versions,V IN =25V for 12-V version,V IN =30V for 15-V version (unless otherwise noted)(see Figure 2)TL2575PARAMETERTEST CONDITIONST J UNIT MIN TYP MAX25°C 2.2 1.4ON/OFF high-level logic V IH OFF (V OUT =0V)V input voltageFull range 2.425°C 1.21ON/OFF low-level logic V IL ON (V OUT =nominal voltage)V input voltageFull range 0.8I IH ON/OFF high-level input current OFF (ON/OFF =5V)25°C 1230µA I ILON/OFF low-level input currentON (ON/OFF =0V)25°C10µA6Submit Documentation FeedbackTL2575HV Electrical Characteristics1-A SIMPLE STEP-DOWN SWITCHING VOLTAGE REGULATORSSLVS638B–MAY 2006–REVISED JANUARY 2007I LOAD =200mA,V IN =12V for 3.3-V,5-V,and adjustable versions,V IN =25V for 12-V version,V IN =30V for 15-V version (unless otherwise noted)(see Figure 2)TL2575HV PARAMETERTEST CONDITIONS T J UNITMIN TYP MAX V IN =12V,I LOAD =0.2A25°C 3.234 3.3 3.366TL2575HV-3325°C 3.168 3.33.4504.75V ≤V IN ≤60V,0.2A ≤I LOAD ≤1A Full range 3.135 3.482V IN =12V,I LOAD =0.2A25°C 4.95 5.1TL2575HV-0525°C 4.85 5.2258V ≤V IN ≤60V,0.2A ≤I LOAD ≤1A Full range 4.75 5.275V OUTOutput voltageV V IN =25V,I LOAD =0.2A 25°C 11.761212.24TL2575HV-1225°C 11.521212.5415V ≤V IN ≤60V,0.2A ≤I LOAD ≤1A Full range 11.412.66V IN =30V,I LOAD =0.2A25°C 14.71515.3TL2575HV-1525°C 14.41515.6818V ≤V IN ≤60V,0.2A ≤I LOAD ≤1A Full range 14.251515.83V IN =12V,V OUT =5V,25°C 1.217 1.23 1.243I LOAD =0.2AFeedback voltage TL2575HV-ADJV 25°C 1.193 1.23 1.2738V ≤V IN ≤60V,V OUT =5V,0.2A ≤I LOAD ≤1A Full range1.1801.286TL2575HV-33V IN =12V,I LOAD =1A 75TL2575HV-05V IN =12V,I LOAD =1A 77TL2575HV-12V IN =15V,I LOAD =1A 88ηEfficiency25°C %TL2575HV-15V IN =18V,I LOAD =1A 88V IN =12V,V OUT =5V,TL2575HV-ADJ77I LOAD =1A25°C 50100I IB Feedback bias current V OUT =5V (ADJ version only)nA Full range 50025°C 475258f o Oscillator frequency (1)kHz Full range426325°C 0.9 1.2V SATSaturation voltage I OUT =1A (2)V Full range 1.4Maximum duty cycle (3)25°C 9398%25°C 1.7 2.83.6I CL Switch peak current (1)(2)A Full range1.34V IN =60(4),Output =0V 2I L Output leakage current 25°C mA V IN =60(4),Output =–1V 7.530I Q Quiescent current (4)25°C 510mA I STBY Standby quiescent currentOFF (ON/OFF =5V)25°C50200µA (1)In the event of an output short or an overload condition,self-protection features lower the oscillator frequency to ∼18kHz and the minimum duty cycle from 5%to ∼2%.The resulting output voltage drops to ∼40%of its nominal value,causing the average power dissipated by the IC to lower.(2)Output is not connected to diode,inductor,or capacitor.Output is sourcing current.(3)FEEDBACK is disconnected from output and connected to 0V.(4)To force the output transistor off,FEEDBACK is disconnected from output and connected to 12V for the adjustable,3.3-V,and 5-V versions and to 25V for the 12-V and 15-V versions.7Submit Documentation Feedback1-A SIMPLE STEP-DOWN SWITCHING VOLTAGE REGULATORSSLVS638B–MAY 2006–REVISED JANUARY 2007TL2575HV Electrical Characteristics (continued)I LOAD =200mA,V IN =12V for 3.3-V,5-V,and adjustable versions,V IN =25V for 12-V version,V IN =30V for 15-V version (unless otherwise noted)(see Figure 2)TL2575HV PARAMETERTEST CONDITIONS T J UNIT MIN TYP MAX25°C 2.2 1.4ON/OFF high-level logic V IH OFF (V OUT =0V)V input voltageFull range 2.425°C 1.21V IL ON/OFF low-level logic input voltage ON (V OUT =nominal voltage)V Full range 0.8I IH ON/OFF high-level input current OFF (ON/OFF =5V)1230µA 25°CI ILON/OFF low-level input currentON (ON/OFF =0V)10µA8Submit Documentation FeedbackTEST CIRCUITSC IN = 100 µF , Aluminum Electrolytic C OUT = 330 µF , Aluminum Electrolytic D1 = SchottkyL1 = 330 µH (for 5-V V IN with 3.3-V V OUT , use 100 m H)Fixed-Output VoltageAdjustable-Output VoltageV OUT = V REF (1 + R2/R1) = 5 V V REF = 1.23 V R1 = 2 k W R2 = 6.12 k W1-A SIMPLE STEP-DOWN SWITCHING VOLTAGE REGULATORSSLVS638B–MAY 2006–REVISED JANUARY 2007A.Pin numbers are for the KTT (TO-263)package.Figure 2.Test Circuits and Layout Guidelines9Submit Documentation FeedbackTYPICAL CHARACTERISTICS-0.6-0.4-0.200.20.40.60.811.21.40102030405060V IN –Input Voltage –VO u t p u t V o l t a g e C h a n g e –%-1-0.8-0.6-0.4-0.200.20.40.60.81-50-250255075100125150T A –Temperature –°CO u t p u t V o l t a g e C h a n g e –%0.250.50.7511.251.51.752-40-25-105203550658095110125T J –Junction Temperature –°CI n p u t -O u t p u t D i f f e r e n t i a l –V00.511.522.53-50-250255075100125150T J –Junction Temperature –°CI O –O u t p u t C u r r e n t –A1-A SIMPLE STEP-DOWN SWITCHING VOLTAGE REGULATORSSLVS638B–MAY 2006–REVISED JANUARY 2007Figure 3.Normalized Output Voltage Figure 4.Line RegulationFigure 5.Dropout Voltage Figure 6.Current Limit10Submit Documentation Feedback02468101214161820102030405060V IN –Input Voltage –VI Q –Q u i e s c e n t C u r r e n t –m A050100150200250300350400450500-50-250255075100125150T J –Junction Temperature –°CI S T B Y –S t a n d b y Q u i e s c e n t C u r r e n t–µA-10-8-6-4-20246810-50-250255075100125150T J –Junction Temperature –°Cf N O R M –N o r m a l i z e d F r eq u e n c y –%0.40.50.60.70.80.911.11.200.20.40.60.81I SW –Switch Current –AV S A T –S a t u r a t i on V o l t a g e –VTL2575,TL2575HV1-A SIMPLE STEP-DOWN SWITCHING VOLTAGE REGULATORSSLVS638B–MAY 2006–REVISED JANUARY 2007TYPICAL CHARACTERISTICS (continued)Figure 7.Quiescent Current Figure 8.Standby Quiescent CurrentFigure 9.Oscillator Frequency Figure 10.Switch Saturation Voltage元器件交易网-50-250255075100125150T J –Junction Temperature –°C -50-25255075100125150T J –Junction Temperature –°CDB{0 AC0 A{A0V{V = 5VOUT 4 µs/DivFigure 11.Minimum Operating VoltageFigure 12.FEEDBACK CurrentA.Output pin voltage,10V/DivB.Output pin current,1A/DivC.Inductor current,0.5A/DivD.Ouput ripple voltage,20mV/DivFigure 13.Switching Waveforms00.20.40.60.811.21.41.6-0.100.10.20.30.40.50.60.70.80.9t –Time –msI L O A D –L o a d C u r r e n t –ATL2575,TL2575HV1-A SIMPLE STEP-DOWN SWITCHING VOLTAGE REGULATORSSLVS638B–MAY 2006–REVISED JANUARY 2007TYPICAL CHARACTERISTICS (continued)Figure 14.Load Transient ResponseAPPLICATION INFORMATIONInput Capacitor (C IN )Output Capacitor (C OUT )Catch DiodeTL2575,TL2575HV1-A SIMPLE STEP-DOWN SWITCHING VOLTAGE REGULATORSSLVS638B–MAY 2006–REVISED JANUARY 2007For stability concerns,an input bypass capacitor (electrolytic,C IN ≥47µF)needs to be located as close as possible to the regulator.For operating temperatures below –25°C,C IN may need to be larger in value.In addition,since most electrolytic capacitors have decreasing capacitances and increasing ESR as temperature drops,adding a ceramic or solid tantalum capacitor in parallel increases the stability in cold temperatures.To extend the capacitor operating lifetime,the capacitor RMS ripple current rating should be:I C,RMS > 1.2(t on /T)I LOAD wheret on /T =V OUT /V IN {buck regulator}andt on /T =|V OUT |/(|V OUT |+V IN ){buck-boost regulator}For both loop stability and filtering of ripple voltage,an output capacitor also is required,again in close proximity to the regulator.For best performance,low-ESR aluminum electrolytics are recommended,although standard aluminum electrolytics may be adequate for some applications.Based on the following equation:Output ripple voltage =(ESR of C OUT )×(inductor ripple current)Output ripple of 50mV to 150mV typically can be achieved with capacitor values of 220µF to 680µrger C OUT can reduce the ripple 20mV to 50mV peak to peak.To improve further on output ripple,paralleling of standard electrolytic capacitors may be used.Alternatively,higher-grade capacitors such as high frequency,low inductance,or low ESR can be used.The following should be taken into account when selecting C OUT :•At cold temperatures,the ESR of the electrolytic capacitors can rise dramatically (typically 3×nominal value at –25°C).Because solid tantalum capacitors have significantly better ESR specifications at cold temperatures,they should be used at operating temperature lower than –25°C.As an alternative,tantalums also can be paralleled to aluminum electrolytics and should contribute 10%to 20%to the total capacitance.•Low ESR for C OUT is desirable for low output ripple.However,the ESR should be greater than 0.05Ωto avoid the possibility of regulator instability.Hence,a sole tantalum capacitor used for C OUT is most susceptible to this occurrence.•The capacitor’s ripple current rating of 52kHz should be at least 50%higher than the peak-to-peak inductor ripple current.As with other external components,the catch diode should be placed close to the output to minimize unwanted noise.Schottky diodes have fast switching speeds and low forward voltage drops and,thus,offer the best performance,especially for switching regulators with low output voltages (V OUT <5V).If a high-efficiency,fast-recovery,or ultra-fast-recovery diode is used in place of a Schottky,it should have a soft recovery (versus abrupt turn-off characteristics)to avoid the chance of causing instability and EMI.Standard 50-/60-Hz diodes,such as the 1N4001or 1N5400series,are not suitable.InductorOutput Voltage Ripple and TransientsFeedback ConnectionON/OFF Input TL2575,TL2575HV1-A SIMPLE STEP-DOWN SWITCHING VOLTAGE REGULATORSSLVS638B–MAY2006–REVISED JANUARY2007APPLICATION INFORMATION(continued)Proper inductor selection is key to the performance-switching power-supply designs.One important factor to consider is whether the regulator is used in continuous mode(inductor current flows continuously and never drops to zero)or in discontinuous mode(inductor current goes to zero during the normal switching cycle).Each mode has distinctively different operating characteristics and,therefore,can affect the regulator performance and requirements.In many applications,the continuous mode is the preferred mode of operation,since it offers greater output power with lower peak currents,and also can result in lower output ripple voltage.The advantages of continuous mode of operation come at the expense of a larger inductor required to keep inductor current continuous,especially at low output currents and/or high input voltages.The TL2575and TL2575HV can operate in either continuous or discontinuous mode.With heavy load currents, the inductor current flows continuously and the regulator operates in continuous mode.Under light load,the inductor fully discharges and the regulator is forced into the discontinuous mode of operation.For light loads (approximately200mA or less),this discontinuous mode of operation is perfectly acceptable and may be desirable solely to keep the inductor value and size small.Any buck regulator eventually operates in discontinuous mode when the load current is light enough.The type of inductor chosen can have advantages and disadvantages.If high performance/quality is a concern, then more-expensive toroid core inductors are the best choice,as the magnetic flux is contained completely within the core,resulting in less EMI and noise in nearby sensitive circuits.Inexpensive bobbin core inductors, however,generate more EMI as the open core does not confine the flux within the core.Multiple switching regulators located in proximity to each other are particularly susceptible to mutual coupling of magnetic fluxes from each other’s open cores.In these situations,closed magnetic structures(such as a toroid,pot core,or E-core)are more appropriate.Regardless of the type and value of inductor used,the inductor never should carry more than its rated current. Doing so may cause the inductor to saturate,in which case the inductance quickly drops,and the inductor looks like a low-value resistor(from the dc resistance of the windings).As a result,switching current rises dramatically (until limited by the current-by-current limiting feature of the TL2575and TL2575HV)and can result in overheating of the inductor and the IC itself.Note that different types of inductors have different saturation characteristics.As with any switching power supply,the output of the TL2575and TL2575HV have a sawtooth ripple voltage at the switching frequency.Typically about1%of the output voltage,this ripple is due mainly to the inductor sawtooth ripple current and the ESR of the output capacitor(see note on C OUT).Furthermore,the output also may contain small voltage spikes at the peaks of the sawtooth waveform.This is due to the fast switching of the output switch and the parasitic inductance of C OUT.These voltage spikes can be minimized through the use of low-inductance capacitors.There are several ways to reduce the output ripple voltage:a larger inductor,a larger C OUT,or both.Another method is to use a small LC filter(20µH and100µF)at the output.This filter can reduce the output ripple voltage by a factor of10(see Figure2).For fixed-voltage options,FEEDBACK must be wired to V OUT.For the adjustable version,FEEDBACK must be connected between the two programming resistors.Again,both of these resistors should be in close proximity to the regulator,and each should be less than100kΩto minimize noise pickup.ON/OFF should be grounded or be a low-level TTL voltage(typically<1.6V)for normal operation.To shut down the TL2575or TL2575HV and put it in standby mode,a high-level TTL or CMOS voltage should be supplied to this pin.ON/OFF should not be left open and safely can be pulled up to V IN with or without a pullup resistor.GroundingLayout GuidelinesTL2575,TL2575HV1-A SIMPLE STEP-DOWN SWITCHING VOLTAGE REGULATORSSLVS638B–MAY 2006–REVISED JANUARY 2007APPLICATION INFORMATION (continued)The power and ground connections of the TL2575and TL2575HV must be low impedance to help maintain output stability.For the 5-pin packages,both pin 3and tab are ground,and either connection can be used as they are both part of the same lead frame.With the 16-pin package,all the ground pins (including signal and power grounds)should be soldered directly to wide PCB copper traces to ensure low-inductance connections and good thermal dissipation.With any switching regulator,circuit layout plays an important role in circuit performance.Wiring and parasitic inductances,as well as stray capacitances,are subjected to rapidly switching currents,which can result in unwanted voltage transients.To minimize inductance and ground loops,the length of the leads indicated by heavy lines should be minimized.Optimal results can be achieved by single-point grounding (see Figure 2)or by ground-plane construction.For the same reasons,the two programming resistors used in the adjustable version should be located as close as possible to the regulator to keep the sensitive feedback wiring short.BUCK REGULATOR DESIGN PROCEDURE TL2575,TL2575HV1-A SIMPLE STEP-DOWN SWITCHING VOLTAGE REGULATORSSLVS638B–MAY2006–REVISED JANUARY2007PROCEDURE(Fixed Output)EXAMPLE(Fixed Output)Known:Known:V OUT=3.3V,5V,12V,or15V V OUT=5VV IN(Max)=Maximum input voltage V IN(Max)=20VI LOAD(Max)=Maximum load current I LOAD(Max)=1A1.Inductor Selection(L1) 1.Inductor Selection(L1)A.From Figure15through Figure18,select the appropriate inductor A.From Figure16(TL2575-05),the intersection of20-V line and code based on the intersection of V IN(Max)and I LOAD(Max).1-A line gives an inductor code of L330.B.From Table2,choose the appropriate inductor based on the B.L330→L1=330µHinductor code.Parts from three well-known inductor manufacturers Choose from:are given.The inductor chosen should be rated for operation at34042(Schott)52-kHz and have a current rating of at least1.15×I LOAD(Max)toPE-52627(Pulse Engineering)allow for the ripple current.The actual peak current in L1(in normaloperation)can be calculated as follows:RL1952(Renco)I L1(pk)=I LOAD(Max)+(V IN–V OUT)×t on/2L1Where t on=V OUT/V IN×(1/f osc)2.Output Capacitor Selection(C OUT) 2.Output Capacitor Selection(C OUT)A.The TL2575control loop has a two-pole two-zero frequency A.C OUT=100-µF to470-µF,standard aluminum electrolytic response.The dominant pole-zero pair is established by C OUT andL1.To meet stability requirements while maintaining an acceptableoutput ripple voltage(V ripple≈0.01×V OUT),the recommended rangefor a standard aluminum electrolytic C OUT is between100µF and470µF.B.C OUT should have a voltage rating of at least1.5×V OUT.But if a B.Although a C OUT rated at8V is sufficient for V OUT=5V,alow output ripple voltage is desired,choose capacitors with a higher-voltage capacitor is chosen for its typically lower ESR(and higher-voltage ratings than the minimum required,due to their hence lower output ripple voltage)→Capacitor voltagetypically lower ESRs.rating=20V.3.Catch Diode Selection(D1)(see Table1) 3.Catch Diode Selection(D1)(see Table1)A.In normal operation,the catch diode requires a current rating of A.Pick a diode with3-A rating.at least1.2×I LOAD(Max).For the most robust design,D1should berated to handle a current equal to the TL2575maximum switch peakcurrent;this represents the worst-case scenario of a continuousshort at V OUT.B.The diode requires a reverse voltage rating of at least B.Pick30-V rated Schottky diode(1N5821,MBR330,31QD03,or1.25×V IN(Max).SR303)or100-V rated Fast Recovery diode(31DF1,MURD310,orHER302).4.Input Capacitor(C IN) 4.Input Capacitor(C IN)An aluminum electrolytic or tantalum capacitor is needed for input C IN=100µF,25V,aluminum electrolyticbypassing.Locate C IN as close to the V IN and GND pins aspossible.。

TC74ACT257FN资料

TOSHIBA CMOS Digital Integrated Circuit Silicon MonolithicTC74ACT257P,TC74ACT257F,TC74ACT257FN2-Channel Multiplexer (3-state)The TC74ACT257 is an advanced high speed CMOSMULTIPLEXER fabricated with silicon gate and double-layer metal wiring C 2MOS technology.It achieve the high speed operation similar to equivalent Bipolar Schottky TTL while maintaining the CMOS low power dissipation.This device may be used as a level converter for interfacing TTL or NMOS to High Speed CMOS. The inputs are compatible with TTL or NMOS and CMOS output voltage levels.Each is composed of four independent 2-channel multiplexers with common SELECT and ENABLE OUTPUT (OE ).If OE is set low, the outputs are held in a high-impedance state. When SELECT is set low, “A” data inputs are enabled. Conversely, when SELECT is high, “B” data inputs are enabled.All inputs are equipped with protection circuits against static discharge or transient excess voltage.Features• High speed: t pd = 5.8 ns (typ.) at V CC = 5 V• Low power dissipation: I CC = 8 μA (max) at Ta = 25°C • Compatible with TTL outputs: V IL = 0.8 V (max) V IH = 2.0 V (min)• Symmetrical output impedance: |I OH | = I OL= 24 mA (min) Capability of driving 50 Ωtransmission lines. •Balanced propagation delays: tpLH ∼ − t pHL • Pin and function compatible with 74F257Pin AssignmentNote: xxxFN (JEDEC SOP) is not available inJapan. TC74ACT257PTC74ACT257FTC74ACT257FNWeightDIP16-P-300-2.54A : 1.00 g (typ.) SOP16-P-300-1.27A : 0.18 g (typ.) SOL16-P-150-1.27: 0.13 g (typ.)IEC Logic SymbolTruth TableX: Don’t careZ: High impedance System DiagramAbsolute Maximum Ratings (Note 1)Characteristics Symbol Rating Unit Supply voltage range V CC−0.5 to 7.0 VDC input voltage V IN−0.5 to V CC+ 0.5 VDC output voltage V OUT−0.5 to V CC+ 0.5 VInput diode current I IK±20 mA Output diode current I OK±50 mA DC output current I OUT±50 mA DC V CC/ground current I CC±100 mA Power dissipation P D500 (DIP) (Note 2)/180 (SOP) mWStorage temperature T stg−65 to 150 °CNote 1: Exceeding any of the absolute maximum ratings, even briefly, lead to deterioration in IC performance or even destruction.Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and thesignificant change in temperature, etc.) may cause this product to decrease in the reliability significantlyeven if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolutemaximum ratings and the operating ranges.Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability testreport and estimated failure rate, etc).Note 2: 500 mW in the range of Ta =−40 to 65°C. From Ta = 65 to 85°C a derating factor of −10 mW/°C should be applied up to 300 mW.Operating Ranges (Note)Characteristics Symbol Rating Unit Supply voltage V CC 4.5 to 5.5 VInput voltage V IN0 to V CC VOutput voltage V OUT0 to V CC VOperating temperature T opr−40 to 85 °CInput rise and fall time dt/dV 0 to 10 ns/VNote: The operating ranges must be maintained to ensure the normal operation of the device.Unused inputs must be tied to either VCC or GND.Electrical Characteristics DC CharacteristicsTest Condition Ta = 25°C Ta =−40 to85°CCharacteristics SymbolV CC (V)Min Typ.Max Min MaxUnitHigh-level input voltage V IH⎯4.5 to5.52.0 ⎯⎯ 2.0 ⎯ VLow-level input voltage V IL⎯4.5 to5.5⎯⎯ 0.8 ⎯ 0.8 VHigh-level output voltage V OHV IN= V IH orV ILI OH=−50 μAI OH=−24 mAI OH=−75 mA (Note)4.54.55.54.43.94⎯4.5⎯⎯⎯⎯⎯4.43.803.85⎯⎯⎯VLow-level output voltage V OLV IN= V IH orV ILI OL= 50 μAI OL= 24 mAI OL= 75 mA (Note)4.54.55.5⎯⎯⎯0.0⎯⎯0.10.36⎯⎯⎯⎯0.10.441.65V3-state output off-state current I OZV IN= V IH or V ILV OUT= V CC or GND5.5⎯⎯±0.5 ⎯±5.0μAInput leakagecurrentI IN V IN= V CC or GND 5.5⎯⎯±0.1 ⎯±1.0μAI CC V IN= V CC or GND 5.5⎯⎯ 8.0 ⎯ 80.0μAQuiescent supplycurrent IC Per input: V IN= 3.4 VOther input: V CC or GND5.5⎯⎯ 1.35 ⎯ 1.5 mANote: This spec indicates the capability of driving 50 Ω transmission lines.One output should be tested at a time for a 10 ms maximum duration. AC Characteristics (C L= 50 pF, R L= 500 Ω, input: t r= t f= 3 ns)Test Condition Ta = 25°C Ta =−40 to85°CCharacteristics SymbolV CC (V)Min Typ.Max Min MaxUnitPropagation delay time(A, B-Y) t pLHt pHL⎯ 5.0± 0.5⎯ 6.5 9.6 1.0 11.0nsPropagation delay time(SELECT-Y) t pLHt pHL⎯ 5.0± 0.5⎯7.8 11.4 1.0 13.0nsOutput enable time t pZLt pZH⎯ 5.0 ± 0.5⎯ 6.3 9.6 1.0 11.0nsOutput disable time t pLZt pHZ⎯ 5.0± 0.5⎯ 6.3 8.8 1.0 10.0nsInput capacitance C IN⎯⎯ 5 10 ⎯ 10 pF Output capacitance C OUT⎯⎯ 10 ⎯⎯⎯ pFPower dissipation capacitance C PD(Note)⎯⎯ 57 ⎯⎯⎯ pFNote: C PD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.Average operating current can be obtained by the equation:I CC (opr) = C PD･V CC･f IN+ I CC/4 (per bit)Weight: 1.00 g (typ.)Weight: 0.18 g (typ.)Package Dimensions (Note)Note: This package is not available in Japan. Weight: 0.13 g (typ.)RESTRICTIONS ON PRODUCT USE20070701-EN GENERAL •The information contained herein is subject to change without notice.•TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property.In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.• The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk.•The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations.• The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties.• Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations.。

MC74LCX257DR2G资料

MC74LCX257Low−Voltage CMOS Quad 2−Input MultiplexerWith 5.0 V−Tolerant Inputs and Outputs (3−State, Non−Inverting)The MC74LCX257 is a high performance, quad 2−input multiplexer with 3−state outputs operating from a 2.3 to 3.6 V supply. High impedance TTL compatible inputs significantly reduce current loading to input drivers while TTL compatible outputs offer improved switching noise performance. A V I specification of 5.5 V allows MC74LCX257 inputs to be safely driven from 5.0 V devices.Four bits of data from two sources can be selected using the Select input. The four outputs present the selected data in the true (non−inverted) form. The outputs may be switched to a high impedance state by placing a logic HIGH on the Output Enable (OE) input. Current drive capability is 24 mA at the outputs.Features•Designed for 2.3 to 3.6 V V CC Operation•5.0 V Tolerant − Interface Capability with 5.0 V TTL Logic •Supports Live Insertion and Withdrawal•I OFF Specification Guarantees High Impedance When V CC = 0 V •LVTTL Compatible•LVCMOS Compatible•24 mA Balanced Output Sink and Source Capability•Near Zero Static Supply Current in All Three Logic States (10 m A) Substantially Reduces System Power Requirements •Latchup Performance Exceeds 500 mA•ESD Performance:Human Body Model >2000 VMachine Model >200 V•Pb−Free Packages are Available**For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.See detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet.ORDERING INFORMATIONFigure 1. Pinout: 16−Lead Plastic Package(Top View)Figure 2. Logic Diagram151614131211102134567V CC 98OE I0c I1c Zc I0d I1d Zd SI0aI1aZaI0bI1bZbGNDZaI0aSI1a ZbI0b I1bZcI0c I1c ZdI0dI1dOEPIN NAMESTRUTH TABLEH =High Voltage Level L =Low Voltage LevelX =High or Low Voltage Level and Transitions are Acceptable Z =High Impedance StateFor ICC reasons, DO NOT FLOAT Inputsvalues (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.1.I O absolute maximum rating must be observed.RECOMMENDED OPERATING CONDITIONSSpecifications Brochure, BRD8011/D.*This package is inherently Pb−Free.DC ELECTRICAL CHARACTERISTICSIAC CHARACTERISTICS t = t = 2.5 ns; R = 500 WThe specification applies to any outputs switching in the same direction, either HIGH−to−LOW (t OSHL) or LOW−to−HIGH (t OSLH); parameter guaranteed by design.DYNAMIC SWITCHING CHARACTERISTICSmeasured in the LOW state.CAPACITIVE CHARACTERISTICSWAVEFORM 1 − NON−INVERTING PROPAGATION DELAYSt R = t F = 2.5 ns, 10% to 90%; f = 1.0 MHz; tW = 500 nsV CC0 VV OHV OLZnt WAVEFORM 3 − OUTPUT ENABLE AND DISABLE TIMES t R = t F = 2.5 ns, 10% to 90%; f = 1.0 MHz; t W = 500 nsV CC0 V≈ 0 VOEZn3.0V ZnV CCV OH − 0.3V V OL + 0.3 V GNDWAVEFORM 2 − INVERTING PROPAGATION DELAYS t R = t F = 2.5 ns, 10% to 90%; f = 1.0 MHz; t W = 500 nsV CC0 V V OHV OLSZnFigure 3. AC WaveformsPACKAGE DIMENSIONSSOIC−16D SUFFIX CASE 751B−05ISSUE JNOTES:1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.2.CONTROLLING DIMENSION: MILLIMETER.3.DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.4.MAXIMUM MOLD PROTRUSION 0.15 (0.006)PER SIDE.5.DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBARPROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.SBM0.25 (0.010)AST DIM MIN MAX MIN MAX INCHESMILLIMETERS A 9.8010.000.3860.393B 3.80 4.000.1500.157C 1.35 1.750.0540.068D 0.350.490.0140.019F 0.40 1.250.0160.049G 1.27 BSC 0.050 BSC J 0.190.250.0080.009K 0.100.250.0040.009M 0 7 0 7 P 5.80 6.200.2290.244R0.250.500.0100.019____TSSOP−16DT SUFFIX CASE 948F−01ISSUE ODIM MIN MAX MIN MAX INCHESMILLIMETERS A 4.90 5.100.1930.200B 4.30 4.500.1690.177C −−− 1.20−−−0.047D 0.050.150.0020.006F 0.500.750.0200.030G 0.65 BSC 0.026 BSC H 0.180.280.0070.011J 0.090.200.0040.008J10.090.160.0040.006K 0.190.300.0070.012K10.190.250.0070.010L 6.40 BSC 0.252 BSC M0 8 0 8 NOTES:1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.2.CONTROLLING DIMENSION: MILLIMETER.3.DIMENSION A DOES NOT INCLUDE MOLD FLASH.PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15(0.006) PER SIDE.4.DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.5.DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBARPROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION.6.TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY.7.DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−.____16X REFPACKAGE DIMENSIONSSOEIAJ−16M SUFFIXCASE 966−01ISSUE OON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.PUBLICATION ORDERING INFORMATION。

CD74ACT257资料

Data sheet acquired from Harris SemiconductorSCHS248Features•CD74AC257, CD74ACT257 . . . .Non-Inverting Outputs •CD74ACT258 . . . . . . . . . . . . . . . . . . .Inverting Outputs •Buffered Inputs•Typical Propagation Delay- 4.4ns at V CC = 5V , T A = 25o C, C L = 50pF•Exceeds 2kV ESD Protection MIL-STD-883, Method 3015•SCR-Latchup-Resistant CMOS Process and Circuit Design •Speed of Bipolar FAST™/AS/S with Signiﬁcantly Reduced Power Consumption •Balanced Propagation Delays•AC Types Feature 1.5V to 5.5V Operation and Balanced Noise Immunity at 30% of the Supply •±24mA Output Drive Current -Fanout to 15 FAST™ ICs Drives 50Ω Transmission LinesPinoutCD74AC257, CD74ACT257, CD74ACT258(PDIP , SOIC)TOP VIEWDescriptionThe CD74AC257,CD74ACT257and CD74ACT258are quad 2-input multiplexers with three-state outputs that utilize the Harris Advanced CMOS Logic technology.Each of these devices selects four bits of data from two sources under the control of a common Select input (S).The Output Enable (OE)is active LOW.When OE is HIGH,all of the outputs (Y or Y)are in the high-impedance state regardless of all other input conditions.Moving data from two groups of registers to four common output buses is a common use of the CD74AC257,CD74ACT257and CD74ACT258.The state of the Select input determines the particular register from which the data comes.The CD74AC257,CD74ACT257and CD74ACT258can also be used as function generators.14151691312111012345768S 1I 01I 11Y 2I 02I 1GND 2Y V CC 4I 04I 14Y 3I 03I 13YOE AC/ACT257ACT258ACT258AC/ACT257V CC 4I 04I 14Y 3I 03I 13YOE S1I 01I 11Y 2I 02I 1GND2Y Ordering InformationPART NUMBER TEMP.RANGE (o C)PACKAGEPKG.NO.CD74AC257E 0 to 70o C, -40 to 85,-55 to 12516 Ld PDIPE16.3CD74ACT257E0 to 70o C, -40 to 85,-55 to 12516 Ld PDIPE16.3CD74ACT258E 0 to 70o C, -40 to 85,-55 to 12516 Ld PDIPE16.3CD74AC257M 0 to 70o C, -40 to 85,-55 to 12516 Ld SOICM16.15CD74ACT257M0 to 70o C, -40 to 85,-55 to 12516 Ld SOICM16.15CD74ACT258M 0 to 70o C, -40 to 85,-55 to 12516 Ld SOICM16.15NOTES:1.When ordering,use the entire part number.Add the suffix 96to obtain the variant in the tape and reel.2.Wafer and die for this part number is available which meets all elec-trical specifications.Please contact your local sales office or Harris customer service for ordering information.August 1998CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.CD74AC257, CD74ACT257,CD74ACT258Quad 2-Input Multiplexer with Three-State OutputsFile Number1955.1Functional DiagramTRUTH TABLEOUTPUTENABLE SELECT INPUTDATA INPUTS 257OUTPUTS258OUTPUTSOE S I 0I 1Y Y H X X X Z Z L L L X L H L L H X H L L H X L L H LHXHHLH = High level voltage, L = Low level voltage, Z = High impedance (off) state, X = Don’t Care251114613103471294Y3Y2Y1Y1Y4Y3Y2YAC/ACT 257AC/ACT 2581I 02I 03I 04I 01I 12I 13I 14I 1S OE115Absolute Maximum Ratings Thermal InformationDC Supply Voltage, V CC. . . . . . . . . . . . . . . . . . . . . . . .-0.5V to 6V DC Input Diode Current, I IKFor V I < -0.5V or V I > V CC + 0.5V. . . . . . . . . . . . . . . . . . . . . .±20mA DC Output Diode Current, I OKFor V O < -0.5V or V O > V CC + 0.5V . . . . . . . . . . . . . . . . . . . .±50mA DC Output Source or Sink Current per Output Pin, I OFor V O > -0.5V or V O < V CC + 0.5V . . . . . . . . . . . . . . . . . . . .±50mA DC V CC or Ground Current, I CC or I GND (Note 3) . . . . . . . . .±100mA Operating ConditionsTemperature Range, T A . . . . . . . . . . . . . . . . . . . . . .-55o C to 125o C Supply Voltage Range, V CC (Note 4)AC T ypes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.5V to 5.5V ACT T ypes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V DC Input or Output Voltage, V I, V O . . . . . . . . . . . . . . . . .0V to V CC Input Rise and Fall Slew Rate, dt/dvAC T ypes, 1.5V to 3V . . . . . . . . . . . . . . . . . . . . . . . . .50ns (Max) AC T ypes, 3.6V to 5.5V. . . . . . . . . . . . . . . . . . . . . . . .20ns (Max) ACT T ypes, 4.5V to 5.5V. . . . . . . . . . . . . . . . . . . . . . .10ns (Max)Thermal Resistance (T ypical, Note 5)θJA (o C/W) PDIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . .___ SOIC Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . .___ Maximum Junction T emperature (Plastic Package) . . . . . . . . . .150o C Maximum Storage Temperature Range . . . . . . . . . .-65o C to 150o C Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . .300o CCAUTION:Stresses above those listed in“Absolute Maximum Ratings”may cause permanent damage to the device.This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this speciﬁcation is not implied.NOTES:3.For up to 4 outputs per device, add±25mA for each additional output.4.Unless otherwise specified, all voltages are referenced to ground.5.θJA is measured with the component mounted on an evaluation PC board in free air.DC Electrical SpeciﬁcationsPARAMETER SYMBOLTESTCONDITIONSV CC(V)25o C-40o C TO85o C-55o C TO125o CUNITS V I(V)I O(mA)MIN MAX MIN MAX MIN MAXAC TYPESHigh Level Input Voltage V IH-- 1.5 1.2- 1.2- 1.2-V3 2.1- 2.1- 2.1-V5.5 3.85- 3.85- 3.85-V Low Level Input Voltage V IL-- 1.5-0.3-0.3-0.3V3-0.9-0.9-0.9V5.5- 1.65- 1.65- 1.65V High Level Output Voltage V OH V IH or V IL-0.05 1.5 1.4- 1.4- 1.4-V-0.053 2.9- 2.9- 2.9-V-0.05 4.5 4.4- 4.4- 4.4-V-43 2.58- 2.48- 2.4-V-24 4.5 3.94- 3.8- 3.7-V-75(Note 6, 7)5.5-- 3.85---V-50(Note 6, 7)5.5---- 3.85-VLow Level Output VoltageV OLV IH or V IL0.05 1.5-0.1-0.1-0.1V 0.053-0.1-0.1-0.1V 0.05 4.5-0.1-0.1-0.1V 123-0.36-0.44-0.5V 24 4.5-0.36-0.44-0.5V 75(Note 6, 7) 5.5--- 1.65--V 50(Note 6, 7)5.5----- 1.65V Input Leakage Current I I V CC or GND - 5.5-±0.1-±1-±1µA Three-State Leakage CurrentI OZV IH or V IL V O =V CC or GND - 5.5-±0.5-±5-±10µAQuiescent Supply Current MSI I CCV CC or GND0 5.5-8-80-160µAACT TYPESHigh Level Input Voltage V IH -- 4.5 to 5.52-2-2-V Low Level Input Voltage V IL -- 4.5 to 5.5-0.8-0.8-0.8V High Level Output VoltageV OHV IH or V IL-0.05 4.5 4.4- 4.4- 4.4-V -24 4.5 3.94- 3.8- 3.7-V -75(Note 6, 7) 5.5-- 3.85---V -50(Note 6, 7)5.5---- 3.85-V Low Level Output VoltageV OLV IH or V IL0.05 4.5-0.1-0.1-0.1V 24 4.5-0.36-0.44-0.5V 75(Note 6, 7) 5.5--- 1.65--V 50(Note 6, 7)5.5----- 1.65V Input Leakage Current I I V CC or GND - 5.5-±0.1-±1-±1µA Three-State or Leakage CurrentI OZV IH or V IL V O =V CC or GND - 5.5-±0.5-±5-±10µAQuiescent Supply Current MSII CC V CC or GND 0 5.5-8-80-160µA Additional Supply Current per Input Pin TTL Inputs High 1 Unit Load ∆I CCV CC -2.1-4.5 to5.5-2.4-2.8-3mANOTES:6.Test one output at a time for a 1-second maximum duration.Measurement is made by forcing current and measuring voltage to minimize power dissipation.7.Test verifies a minimum 50Ω transmission-line-drive capability at 85o C, 75Ω at 125o C.DC Electrical Speciﬁcations(Continued)PARAMETERSYMBOL TEST CONDITIONSV CC (V)25o C -40o C TO 85o C -55o C TO 125o C UNITS V I (V)I O (mA)MIN MAX MIN MAX MIN MAXACT Input Load TableINPUT UNIT LOADData0.83S 1.27OE 1.27NOTE:Unit load is∆I CC limit specified in DC Electrical SpecificationsT able, e.g., 2.4mA max at 25o C.Switching Speciﬁcations Input t r, t f = 3ns, C L= 50pF (Worst Case)PARAMETER SYMBOL V CC (V)-40o C TO 85o C-55o C TO 125o CUNITS MIN TYP MAX MIN TYP MAXAC TYPESPropagation Delay, In to YCD74AC/ACT257t PLH, t PHL 1.5--106--117ns3.3(Note 9)3.3-11.8 3.3-13ns5(Note 10)2.4-8.5 2.3-9.3nsPropagation Delay, S to YCD74AC/ACT257t PLH, t PHL 1.5--153--168ns3.34.8-17.1 4.7-18.8ns5 3.5-12.2 3.4-13.4nsPropagation Delay, OE to YCD74AC/ACT257t PLZ, t PHZ,t PZL, t PZH1.5--167--184ns3.3 5.3-18.7 5.2-20.6ns5 3.8-13.4 3.7-14.7nsPropagation Delay, In to YCD74AC/ACT258t PLH, t PHL 1.5--91--100ns3.3 2.9-10.2 2.8-11.2ns5 2.1-7.32-8nsPropagation Delay, S to YCD74AC/ACT258t PLH, t PHL 1.5--153--168ns3.34.8-17.1 4.7-18.8ns5 3.5-12.2 3.4-13.4nsPropagation Delay, OE to YCD74AC/ACT258t PLZ, t PHZ,t PZL, t PZH1.5--167--184ns3.3 5.3-18.7 5.2-20.6ns5 3.8-13.4 3.7-14.7nsThree-State OutputCapacitanceC O---15--15pF Input Capacitance C I---10--10pFPower Dissipation Capacitance C PD(Note 11)--130--130-pF ACT TYPESPropagation Delay, In to YCD74AC/ACT257t PLH, t PHL5(Note 10)2.8-9.7 2.7-10.7nsPropagation Delay,S to YCD74AC/ACT257t PLH, t PHL54-14 3.9-15.4nsPropagation Delay,OE to YCD74AC/ACT257t PLZ , t PHZ ,t PZL , t PZH 54.1-14.64-16.1nsPropagation Delay,In to YCD74AC/ACT258t PLH , t PHL5 2.4-8.5 2.3-9.3nsPropagation Delay,S to YCD74AC/ACT258t PLH , t PHL54-14 3.9-15.4nsPropagation Delay,OE to YCD74AC/ACT258t PLZ , t PHZ ,t PZL , t PZH5 4.1-14.64-16.1nsThree-State Output Capacitance C O ---15--15pF Input CapacitanceC I ---10--10pF Power Dissipation Capacitance C PD (Note 11)--130--130-pFNOTES:8.Limits tested 100%.9.3.3V Min is at 3.6V, Max is at 3V.10.5V Min is at 5.5V, Max is at 4.5V.11.C PD is used to determine the dynamic power consumption per multiplexer.AC: P D = C PD V CC 2 f i +∑ (C L V CC 2 f o )ACT:P D =C PD V CC 2f i +∑(C L V CC 2f o )+V CC ∆I CC where f i =input frequency,f o =output frequency,C L =output load capacitance,V CC = supply voltage.FIGURE 1.THREE-STATE PROPAGATION DELAY TIMES AND TEST CIRCUITSwitching Speciﬁcations Input t r , t f = 3ns, C L = 50pF (Worst Case)(Continued)PARAMETERSYMBOL V CC (V)-40o C TO 85o C-55o C TO 125o CUNITS MIN TYP MAX MIN TYP MAX DUT WITH THREE-STATE OUTPUTINPUT LEVEL90%V S 10%GNDt f = 3nst PZLt PZHt PLZt PHZOUTPUTS ENABLEDOUTPUTS DISABLEDOUTPUT:LOW TO OFF TO LOWOUTPUT:HIGH TO OFF TO HIGHOTHER INPUTS (TIED HIGH OR LOW)OUTPUT DISABLEC L 50pF500Ω†R L 500Ω†R LOUT V S0.2V CCV OL (≠GND)V OH (≠V CC )0.8 V CC V SGND (t PHZ,t PZH )OUTPUTS ENABLEDOPEN (t PHL,t PLH )2 V CC (t PLZ,t PZL )(OPEN DRAIN)t r = 3ns OUTPUT DISABLE†FOR AC SERIES ONL Y: WHEN V CC = 1.5V , R L = 1k ΩFIGURE 2.INPUTS OR SELECT TO OUTPUT PROPAGATIONDELAYS (AC/ACT257)FIGURE 3.SELECT TO OUTPUT PROPAGATION DELAYS(ACT258)90%10%t f = 3nst r = 3ns nI 0, nI 1, St PLHt PHLV SYINPUT LEVELGNDV S INPUT LEVEL V SSt PLHt PHLV SYDUT OUTPUTR L (NOTE)OUTPUT LOAD500ΩC L 50pFNOTE:For AC Series Only: When V CC = 1.5V , R L = 1k Ω.FIGURE 4.PROPAGATION DELAY TIMESCD74ACCD74ACTInput LevelV CC 3V Input Switching Voltage, V S 0.5 V CC 1.5V Output Switching Voltage, V S0.5 V CC0.5 V CCIMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1999, Texas Instruments Incorporated。

MAX774ISDN铃声电源供应器评估套件（EV套件）使用说明书

For free samples & the latest literature: , or phone 1-800-998-8800.For small orders, phone 408-737-7600 ext. 3468._______________General DescriptionThe MAX774 ISDN ring-tone power-supply (IRG) evalua-tion kit (EV kit) provides the high voltages required for implementing a plain old telephone system (POTS) inter-face on ISDN modems and line cards. It is a fully assem-bled and tested board that provides a tightly regulated, -24V output for powering off-hook voice communication and a -70V output for on-hook, ring-tone generation.The EV kit is designed for applications that implement the telephone interface using subscriber line interface circuit (SLIC) ICs, such as the AM79R79 from AMD and comparable products from Lucent, Harris, and other vendors. Its design feeds back the -24V output, achiev-ing tight regulation for clean voice-signal transmission.An economical, off-the-shelf, surface-mount transformer reduces system cost and size. Compact design con-serves board area. High efficiency and reduced quies-cent current make this design the optimal solution for green PC and portable designs.The MAX774 IRG EV kit can also be used to evaluate the MAX775/MAX776. It has a layout that allows modifi-cation for -48V output operation as well as adaptation____________________________Featureso +3V to +16.5V Operating Rangeo Tightly Regulated, -24V Output for Off-Hook Voice Communication o -70V Output Supports a Five-Ringer-Equivalent Load (V IN > 10.5V)o Compact Construction o Proven PC Board Design o Uses Off-the-Shelf Components o Up to 84% Efficiency o 5µA Shutdown Current o Fully Assembled and TestedEvaluates: MAX774/MAX775/MAX776MAX774 ISDN, Ring-Tone, Power-Supply Evaluation Kit________________________________________________________________Maxim Integrated Products119-1287; Rev 0; 9/97______________Ordering InformationE v a l u a t e s : M A X 774/M A X 775/M A X 776MAX774 ISDN, Ring-Tone,Power-Supply Evaluation Kit 2____________________________________________________________________________________________________________________________Quick Start The MAX774 IRG evaluation kit (EV kit) is fully assem-bled and tested. Follow these steps to verify board operation. Do not turn on the power supply until all connections are completed.1)Connect a 12V, 2A power-supply ground terminal to a GND pad on the MAX774 IRG EV kit. 2)Monitor the input current by connecting the power supply's positive terminal to the EV kit’s VIN input through a current meter. 3)Attach a voltmeter across the EV kit’s VIN and GND inputs to monitor input voltage.4)Connect voltmeters to each of the EV kit’s outputs labeled -70V and -24V.5)Connect the SHDN pad to GND.6)Turn on the power supply and slowly increase the voltage to 12V. 7)Monitor the outputs for correct voltage and check the input for typical supply current (20mA at 12V)._______________Detailed DescriptionThe MAX774 IRG EV kit provides the high voltages required for implementing a plain old telephone system (POTS) interface on ISDN modems and other telephone line cards. These boards typically employ ICs such as the AM79R79 Ringing Subscriber Line Interface Circuit (SLIC) from AMD. These ICs generate an analog tele-phone interface by providing both off-hook and on-hook signal transmission, ring-tone generation, and ring-trip detection. Ringing SLIC ICs typically require two high-voltage power-supply inputs. The first is atightly regulated voltage around -24V or -48V for off-hook signal transmission. The second is a loosely regu-lated -70V for ring-tone generation. Servicing a typical five-ringer equivalent load requires a current around 100mA or more from the -70V supply, depending on the SLIC IC and the ring-generation scheme.The MAX774 IRG EV kit can service a SLIC with a five-phone ringer equivalent load (approximately 9W) from a 12V ±10% input. It operates down to 3V, and pro-vides 2.4W from 3.3V and 3.9W from 5V. Use of an inexpensive off-the-shelf transformer, such as the Versa-Pac™ model VP2-0216, provides both high-volt-age outputs from a single inverting DC-DC controller,reducing board area and component costs. Selection of a transformer with multifilar winding enhances cross regulation by improving voltage coupling between the outputs and reducing spiking from leakage inductance.The two outputs are implemented by connecting three pairs of transformer windings in series. The -24V output is obtained by connecting a diode (D1) and output filter capacitor (C9) to the first pair of windings. Feeding back this output achieves tight regulation. The -70V output is derived from the third pair of windings. Loose regulation of this output is obtained by the turns ratio with the -24V output.Circuit OperationThe EV kit schematic (Figure 1) and the MAX774 block diagram in the MAX774/MAX775/MAX776 data sheet show how the circuit works. When the -24V output drops out of regulation, the error comparator in the MAX774 initiates a switching cycle. The P-channel MOSFET (P1) turns on, allowing current to ramp up through the transformer’s lower windings (between the 1/3 tap and ground) and store energy in a magnetic field. When the current through the sense resistor crosses the trip threshold (210mV / 68m Ω= 3.09A), the MOSFET turns off and interrupts the current flow, caus-ing the magnetic field in the transformer to collapse.The transformer forces current through the output diodes, transferring the stored energy to the output fil-ter capacitors. The output filter capacitors smooth the power and voltage delivered to the load. The MAX774waits until it senses the output dropping below the reg-ulation trip point before initiating another cycle. The -24V output is precisely regulated by connecting a volt-age divider, R1 and R2, as shown in Figure 1. The MAX774 regulates the FB pin, keeping it at 0V. The -70V output is regulated using the turns ratios between the -24V and -70V output.Versa-Pac is a trademark of Coiltronics Corp.Output Filter CapacitorsThe positive pin of the filter capacitor for the -70V out-put is connected to the -24V output rather than ground to simplify board layout, enhance stability, allow the use of a lower-cost lower-voltage capacitor, and improve cross-regulation. Ripple on the -24V output is about 200mV and can be reduced further using a capacitor with lower ESR. The Sanyo MV-GX series is recom-mended.__________Applications InformationThis section is intended to aid in transferring the EV kit design to a finished product.Transformer SelectionChoose a transformer with an inductance around 10µH to 15µH per winding, with a saturation-current rating greater than 3A. The MAX774 IRG EV kit uses Coiltronics’ Versa-Pac model VP2-0216. This economi-cal, off-the-shelf transformer uses two trifilar windings for superior coupling and improved regulation of the-70V output. Dale’s LPE6855-100MB and LPE6562-100MB also work, but have different footprints and pinouts and require almost double preloading.If lower output power is desired, increase the current-sense-resistor value and transformer inductance propor-tionally. For example, when reducing power capability to one-half of the current design, double the current-sense resistor to around 130m Ωand the transformer induc-tance per winding to around 20µH to 33µH.Cross RegulationThe -70V output is derived from the -24V output by stacking pairs of windings in an autotransformer config-uration. Cross regulation between the two outputs, how-ever, has limitations. In the on-hook and ringing case,when the -24V output is lightly loaded with the -70V out-put heavily loaded, the -70V output droops. In the off-hook case with the -24V output heavily loaded and the -70V output lightly loaded, the -70V output rises. These effects occur in all transformer-based flyback solutions when the outputs are dissimilarly loaded.Evaluates: MAX774/MAX775/MAX776MAX774 ISDN, Ring-Tone, Power-Supply Evaluation Kit_______________________________________________________________________________________3Figure 1. MAX774 IRG EV Kit SchematicE v a l u a t e s : M A X 774/M A X 775/M A X 776PreloadingUse preloading at the outputs to keep the -70V output in regulation. For designs servicing a five-ringer equiva-lent load, use the following preloads. For the off-hook case, only a couple hundred microamperes are neces-sary to hold down the -70V output. This can be achieved using either a 330k Ωresistor (R4, Figure 1) or zener diode (Figure 2b). For the on-hook case, draw approximately 5.5mA from the -24V output to hold up the -70V output. This 5.5mA can be drawn continuously using two 8.2k Ωresistors (R5 and R6), or intermittently using a transistor to gate the preload while the phone is ringing (Figure 2c). The transistor can be controlled using a microcontroller input/output line, or it can be decoded from the control signals of the AM79R79.To optimize performance or efficiency in applications servicing a different ringer-equivalent load, use the pre-loading curves for guidance (Figure 3 and 4). UseFigure 3 to determine the minimum preloading needed on the -24V output for adequate regulation of the -70V output while the SLIC IC is ringing phones (on-hook case). For example, approximately 50mA is required for a two-phone load. First, follow the vertical line from the -70V output axis up to curve A or B. Next, follow the hor-izontal lines to the corresponding point on the -24V Output Minimum Load axis, in this case 2.5mA using curve A. Preload the -24V output with this current using a resistor R = V / I or 24V / 2.5mA = 9.6k Ω. Round down to the nearest standard value (9.1k Ω). The power rating of the resistor must exceed V 2 / R = 24V 2 / 9.1k Ω=63mW.Use Figure 4 to determine the preloading needed to hold down the -70V output when the -24V output is heavily loaded during off-hook communication. This preloading is intended to protect the AM79R79. The VBAT1 pin of this SLIC IC has a -75V operational range and a -80V absolute maximum rating. If a zener diode is used for preloading, set the zener voltage rating suf-ficiently above the regulation set point to prevent unnecessary current draw.Efficiency, Quiescent Current,and PreloadingThe MAX774 is a pulse-frequency-modulation (PFM)controller designed primarily for use in portable appli-cations. It improves efficiency and reduces quiescent current by switching only as needed to service the load. Prior to preloading, this circuit’s efficiency can be up to 84%, and quiescent current is around 170µA.Resistor preloading reduces efficiency and increasesMAX774 ISDN, Ring-Tone,Power-Supply Evaluation Kit 4_______________________________________________________________________________________Figure 2. Fixed and Switchable Preloading SchemesFigure 3. Cross Regulation for -24V Output Preload Selection (on-hook case)quiescent current. Switchable preloading on the -24V output (Figure 2c), combined with zener clamping of the -70V output (Figure 2b) can be used to reduce cir-cuit current consumption.Current Limiting and Overload ProtectionNeither this EV kit nor competing solutions have a prac-tical level of current protection at the outputs. Use the current-limiting features built into the AM79R79 SLIC IC as described in the data sheet for that product. Using PolySwitch™ resettable fuses at the outputs adds pro-tection to the system at little expense (Figure 5). With a PolySwitch, use faster models such as the surface-mount SMD series.The MAX774 uses an internal current-sense compara-tor that provides pulse-by-pulse input current limiting.However, like competing flyback solutions, this trans-lates to power (and not current) limiting at the output.As the output voltage pulls down during overload, the output current can become high (essentially P IN(MAX)/V OUT ) until inefficiency and parasitic resistance in the circuit dominate. Since the circuit is designed for 9W (min) output to service a five-phone load, short-circuit currents can reach several amperes.Stability and Feedback CompensationThe MAX774 IRG EV kit has been compensated and tested for a full range of loads. When implementing the circuit, ensure stability by following the EV kit board and component list (see PC Board Layout section). Use NPO or COG ceramic capacitors for C1 and C2.Connect the ground terminal of the -70V filter capacitor to the -24V output rather than to ground. (This also improves transient response and simplifies layout.)The MAX774 uses a PFM control scheme that adjusts the pulse rate to regulate power and voltage to the load. Pulse spacing decreases with increasing load. As the pulses begin touching each other, the circuit transi-tions into continuous-conduction mode. Stable transi-tion into continuous conduction occurs through pulse grouping, with gaps less than two cycles wide between groups, and output ripple no larger than the single-cycle voltage ripple at light loads (Figure 6).Poor PC board layout or improper compensation can cause instability by corrupting the feedback signals.Instability is identified by either grouped pulses, large gaps between groups, or output ripple larger than the single-cycle voltage ripple (Figure 7). It can cause increased audio interference. Test for instability with aEvaluates: MAX774/MAX775/MAX776MAX774 ISDN, Ring-Tone, Power-Supply Evaluation Kit_______________________________________________________________________________________5Figure 4. Cross Regulation for -70V Output Preload Selection (off-hook case)Figure 5. Overload Protection Using Raychem PolySwitch Resettable FusesPolySwitch is a trademark of Raychem Corp.M A X 774I R G E V F I G 065µs/divV OUT1 = -23.6V, V OUT2 = -70V, I OUT2 = -30mA, V IN = 9VA: MOSFET DRAIN, 20V/divB: V OUT1, 100mV/div, AC COUPLED C: TRANSFORMER CURRENT, 1A/divFigure 6. Normal Light-Load Switching WaveformsE v a l u a t e s : M A X 774/M A X 775/M A X 7769V input by applying a 5mA to 10mA load on the -24V output and then sweeping the -70V output to full-load. If instability occurs due to errors in the design if a pro-duction board, try removing C7 and C8.If the feedback resistors are changed, adjust the com-pensation capacitors. In general, M x C1 x R1 = C2 x R2with C2 around 1nF provides the best results, where M ranges from 0.5 to 1.PC Board LayoutUse of the tested PC board design is strongly recom-mended. Components can be placed closer together to conserve space. Observe the following guidelines in PC board design:1)Place the current-sense resistor (R3) within 0.2in.(5mm) of the MAX774, directly between the V+ and CS pins. The V+ and reference-bypass capacitors (C3 and C4) must be placed as close as possible to their respective pins. Figure 8 shows the recom-mended layout and routing for these components. 2)Place the voltage-feedback resistors (R1 and R2)and compensation capacitors (C1 and C2) within 0.2in. (5mm) of the MAX774’s FB pin. Keep high-current traces and noisy signals, such as EXT, away from FB. On multilayer boards, if inner ground or power planes are thinly separated from the top-side copper, use small cutouts in the ground plane under the FB node to reduce stray capacitance and capacitive coupling. 3)Make high-power traces, highlighted in the EV kit schematic (Figure 1), as short and as wide as possi-ble. Make the supply-current loop (formed by C5,C6, R3, P1, and L1) and output current loops (L1,D1, and C9 for the -24V output; L1, D2, C9, and C10for the -70V output) as tight as possible to reduce radiated noise. 4)Route transformer L1’s ground pins (C5, C6, and C10) to a common ground point in a star ground configuration using top-side copper fill as a pseudo-ground plane. On multilayer boards, use the star ground as described, and connect it to the inner ground plane using vias. Build up separate star grounds for the power components and controller IC (Figure 9), and then couple them together through the back side of the board using several vias.5)For reduced noise and improved heat dissipation,keep the extra copper on the PC board’s compo-nent and solder sides, rather than etching it away,and connect it to ground for use as a pseudo-ground plane.DC-DC Converter Placementand Audio InterferencePrevent interference through careful board and system design. Place the DC-DC converter and high-speed CMOS logic on a corner of the PC board, away from sensitive analog circuitry such as audio-signal pream-plifier stages (Figure 10). In very compact designs, use localized shielding around sensitive analog stages. Use a separate ground plane for analog circuitry. Where necessary, reduce supply ripple to sensitive analog stages by using LC Pi filters or specialized, low-dropout linear regulators. Tiny, inexpensive linear regulators,such as the SOT23 MAX8863 and µMAX MAX8865, are designed specifically for this purpose. These solutions are commonly used in cellular phones and other portable communications devices.MAX774 ISDN, Ring-Tone,Power-Supply Evaluation Kit 6_______________________________________________________________________________________M A X 774I R G E V F I G 07250µs/divV OUT1 = -23.6V, V OUT2 = -70V, I OUT2 = -30mA, V IN = 9V A: MOSFET DRAIN, 20V/divB: V OUT1, 100mV/div, AC COUPLED C: TRANSFORMER CURRENT, 1A/divC2 REMOVEDFigure 7. Unstable Switching Waveforms from Improper Compensation or Board DesignFigure 8. Recommended Placement and Routing of R3, C3,and C4Modification for -48V and -70V OutputsThe MAX774 IRG EV kit board design allows leeway for adapting the circuit for -48V and -70V outputs. Perform the following steps for implementation:1)Cut the trace from the transformer’s 1/3 tap to theoutput diode, and then solder a wire jumper from the transformer’s 2/3 tap to the diode (D2) (Figure 11).2)Swap output filter capacitors C9 with C10. Be sure toconnect them with the correct polarity. This exchange ensures that the output filter capacitors have voltage ratings exceeding their respective outputs.3)Replace voltage-feedback resistor R2 with a 31.6k Ωresistor.4)Replace compensation capacitor C1 with a 330pFceramic capacitor.5)Change R5 and R6 to 16k Ωresistors.Evaluates: MAX774/MAX775/MAX776MAX774 ISDN, Ring-Tone, Power-Supply Evaluation Kit_______________________________________________________________________________________7SWITCHING DC-DCCONVERTERSSHIELDING (IF NEEDED)DIGITAL LOGIC= LC Pi FILTERS OR LDO LINEAR REGULATORFigure 10. Place the DC-DC converter and CMOS logic away from sensitive analog circuitry.PLACE POWER COMPONENTS CLOSE TOGETHER;MAKE POWER TRACES SHORT AND WIDE.LEAVE THE EXTRA FRONT- AND BACK-SIDE COPPER ON THE BOARD AS A PSEUDO-GROUND PLANE.PLACE GROUND PINS OF POWER COMPONENTS CLOSE TOGETHER AND ORIENT TO CONVERGE, FORMING A STAR GROUND.PLACE VOLTAGE-FEEDBACK COMPONENTS AS CLOSE TO THE FB PIN AS POSSIBLE.PLACE BYPASS CAPACITORS CLOSE TO THE REF AND V+ PINS; ORIENT AS SHOWN.TIE THE IC GROUND AND POWER STAR GROUND TOGETHER USING VIAS AND A WIDE BACK-SIDE GROUND TRACE. ON MULTILAYER BOARDS, TIE INTERIOR GROUND PLANES TO THE POWER STAR GROUND.PLACE CURRENT-SENSE RESISTOR R3 WITHIN 0.2IN. OF CS AND V+ PINS.Figure 9. Key Layout FeaturesE v a l u a t e s : M A X 774/M A X 775/M A X 776MAX774 ISDN, Ring-Tone, Power-Supply Evaluation Kit Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.8_____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600©1997 Maxim Integrated ProductsPrinted USAis a registered trademark of Maxim Integrated Products.Modification for European ApplicationsApplications targeted for Europe may require a lower voltage on the -70V output to meet European safety regulations. In such cases, modify the circuit for -48V and -70V outputs as described previously, then change the feedback resistor R2 to reduce output voltages to -43V and -65V. Add a clamping zener to preload the high-voltage output. Since the MAX774 regulates the FB pin to 0V, R2 will be:R2 = (V REF / V OUT ) x R1where V REF = 1.5V.Adjust C1 so that R1C1 = R2C2. Verify correct com-pensation by examining stability over all loading combi-nations, especially with the -43V output lightly loaded and the -65V output moderately and heavily loaded.Suggested values are R1 = 1M Ω, C1 = 330pF, R2 =34.8k Ω, C2 = 1000pF.RECONNECT TRACE HERECUT TRACE HEREFigure 11. PC Board Changes for -48V and -70V OperationFigure 12. MAX774 IRG EV Kit Component Placement Guide (Top Silkscreen)Figure 13. MAX774 IRG EV Kit PC Board Layout—Component SideFigure 14. MAX774 IRG EV Kit PC Board Layout—Solder Side1.0"1.0" 1.0"。

MC74ACT257D中文资料

VIL
Guaranteed Limits 2.1 3.15 3.85 0.9 1.35 1.65 2.9 4.4 5.4 2.56 3.86 4.86 0.1 0.1 0.1 0.36 0.36 0.36 ±0.1 2.1 3.15 3.85 0.9 1.35 1.65 2.9 4.4 5.4 2.46 3.76 4.76 0.1 0.1 0.1 0.44 0.44 0.44 ±1.0 V VOUT = 0.1 V or VCC – 0.1 V VOUT = 0.1 V or VCC – 0.1 V IOUT = –50 µA V *VIN = VIL or VIH –12 mA IOH –24 mA –24 mA IOUT = 50 µA V *VIN = VIL or VIH 12 mA IOL 24 mA 24 mA VI = VCC, GND VI (OE) = VIL, VIH VI = VCC, GND VO = VCC, GND VOLD = 1.65 V Max VOHD = 3.85 V Min VIN = VCC or GND
FACT DATA 5-2
元器件交易网
MC74AC257 MC74ACT257
MAXIMUM RATINGS*
Symbol VCC Vin Vout Iin Iout ICC Tstg Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage (Referenced to GND) DC Output Voltage (Referenced to GND) DC Input Current, per Pin DC Output Sink/Source Current, per Pin DC VCC or GND Current per Output Pin Storage Temperature Value –0.5 to +7.0 –0.5 to VCC +0.5 –0.5 to VCC +0.5 ±20 ±50 ±50 –65 to +150 Unit V V V mA mA mA °C

TL2575-05I中文资料

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at .
元器件交易网

TL2575, TL2575HV 1-A SIMPLE STEP-DOWN SWITCHING VOLTAGE REGULATORS
SLVS638B – MAY 2006 – REVISED JANUARY 2007
FEATURES
• Fixed 3.3-V, 5-V, 12-V, and 15-V Options With ±5% Regulation (Max) Over Line, Load, and Temperature Conditions
Copyright © 2006–2007, Texas Instruments Incorporated
元器件交易网
TL2575, TL2575HV 1-A SIMPLE STEP-DOWN SWITCHING VOLTAGE REGULATORS
SLVS638B – MAY 2006 – REVISED JANUARY 2007
• Adjustable Option With a Range of 1.23 V to 37 V (57 V for HV Version) and ±4% Regulation (Max) Over Line, Load, and Temperature Conditions
• Specified 1-A Output Current • Wide Input Voltage Range…4.75 V to 40 V

电源转换器产品说明书

Ratings• UL ா 1008 Listed•CSA ா C22.2 No. 178 CertifiedIndustrial design highlights•Double-throw, mechanically interlocked transfer mechanism • Front accessible •Top, bottom and side cable entry•Internal cable gutter space•Seismic Zone 4 qualified (CBC and IBC)• OSHPD certification •Field-selectable, multi-tap transformer permits wide range of system voltages •Manual operation under load with permanently affixed handle• Internal deadfront cover • Padlock provision •Self-protecting switching contacts•Mechanical lug terminationStandard and optional controller featuresDescriptionAutomatic ControllerATC-100ATC-300+ATC-900Basic transfer control, plant exerciser, timedelays, self diagnostics and system settings Standard Standard Standard Source mimic diagram with LED indication Standard Standard Standard Engine test and start contact Standard Standard Standard Dual source control power input StandardStandard Standard Liquid crystal display (LCD)Standard Standard Programmable set points and plant exerciser Standard Standard Password protectionStandard Standard Time-stamped history and event log Standard Standard Time delay bypassStandard Standard Go to source 2 control input Standard Standard Pre-transfer and general alarm control outputsStandard Standard Lockout and monitor modesStandard Standard Source status output relay contacts Standard Standard Modbus ா RTU communication Standard Standard Manual retransfer control input Optional Standard Source 2 inhibit / load shed inputOptionalStandard USB port—profile and data management Standard Preferred source selection Standard Dual generator capabilityStandard User configurable inputs/outputsStandard Advanced diagnostics and troubleshooting with pre-/post-event data capture Standard Integrated load meteringOptional Load management with selective load shed Optional DC voltage control power inputOptional Three-source ATS—master/slave control Optional Modbus TCP/IP communication AOptionalOptionalA Modbus TCP/IP option requires use of Modbus RTU port.Unmatched performance, reliability and versatilityEaton’s molded-case switch/circuit breaker (MCS/MCCB) type automatic transfer switch (ATS) is designed toprovide unmatched performance, reliability and versatility for critical standby power applications requiring open transition with time delay. Configurable features include integral overcurrent protection and service entrance rated equipment.Product confi gurations• 30–1000 A, 100% rated • Two-, three- and four-pole • Single- and three-phase • 120–600 Vac, 50/60 Hz •NEMA ா 1, 3R, 12, 4X enclosure types• Open frame•Open transition with time delay•ATC-100, ATC-300+, ATC-900 controller • Service entrance rated •Integrated meteringEaton is a registered trademark.All other trademarks are property of their respective owners.Eaton1000 Eaton Boulevard Cleveland, OH 44122United States © 2014 EatonAll Rights Reserved Printed in USAPublication No. PA140005EN / Z15340July 2014Catalog numbering systemotee:N The catalog numbering system for molded-case switch/breaker ATS offers a wide variety of standard configurations to meet your application needs. Please be advised that some catalog number combinations are not available. Please contact your local Eaton sales representative with any quotation-related questions.Service entrance equipmentEaton’s MCS/MCCB type transfer switch can easily be configured to be suitable for use as service equipment in the standard enclosure size.Service equipment rated transfer switches may be installed at the point of service entrance without the need for separate upstream disconnect devices and additional power connections.All service equipment is UL 1008 Listed and includes integral overcurrent protection, keyed service disconnect switch and fused disconnect of control power.UL 1008 short-circuit withstand/close-on ratings (kA)Switch Ampere UL 1008 Short-Circuit “Any Breaker” RatingUL 1008 Rating When Used With Upstream Fuse Maximum Fuse Fuse A Four-pole configuration is 35 kA.Optional accessories• Overcurrent protection with thermal-magnetic trip • Integrated distribution circuit breaker panel• Automatic controller protective cover with padlock provision • Surge protection device (UL 1449 3rd Edition)•Remote annunciator controller—monitor and control single or multiple automatic transfer switches •Ethernet gateway with Web server (Modbus TCP/IP , SNMP , BACnet)•Space heater with thermostatEnclosure dimensions and approximate shipping weightMCS/MCCB Frame Transfer Switch Ampere Enclosure Dimensions (Inches) A Approx.Shipping Weight lbs (kg) ATC-300+ATC-900A NEMA 1 and 3R type.B Standard three-pole configuration.C Applies to single-phase, 120/240 Vac or 120/208 Vac, three-wire and three-phase, 208/120 Vac,four-wire standard configurations without multi-tap transformer.D All other three-phase, standard configurations that include multi-tap transformer.Standard cable terminal connectionsSwitchAmpere MCS/MCCB Standard Cu/Al Terminal Lugs (kcmil)Normal and Emergency A Applies to standard two- and three-pole configurations with solid neutral.CUSTOM ORDER ENGINEERINGIn many cases, standard product can be custom- order engineered to meet your application needs. For additional information, please contact your local Eaton sales representative.。

PI74FCT257AT中文资料

The PI74FCT157T/257T and PI74FCT2157T/2257T are highspeed quad 2-input multiplexers. The common select input can be used to select four bits of data from two sources. The four buffered outputs present the selected data in the true (non-inverting) form.
S
157 ONLY
E
I1B-I1D
I0B-I0D
3 OTHER MULTIPLEXERS
ZB-ZD
I1A
I0A
257 ONLY
OE
1
ZA
PS2010A 03/09/96
元器件交易网
PI74FCT157T/257T (25Ω Series)PI74FCT2157T/2257T 123456789012345678901234567890121234567890123456789012345678901212345678901234567890123456789Q012U12A34D567289-0I1N23P45U678T90M123U456L78T90I1P21L23E45X67E89R012
Maximum Ratings
(Above which the useful life may be impaired. For user guidelines, not tested.)
Storage Temperature ................................................................. –65°C to +150°C Ambient Temperature with Power Applied ................................. -40°C to +85°C Supply Voltage to Ground Potential (Inputs & Vcc Only) .......... –0.5V to +7.0V Supply Voltage to Ground Potential (Outputs & D/O Only) ....... –0.5V to +7.0V DC Input Voltage ......................................................................... –0.5V to +7.0V DC Output Current ................................................................................... 120 mA Power Dissipation ......................................................................................... 0.5W

7427155;中文规格书,Datasheet资料

6.1 6.0 5.02012-06-272012-04-302007-01-25SStSStSMuSStSMu-Würth Elektronik eiSos GmbH & Co. KGEMC & Inductive SolutionsMax-Eyth-Str. 174638 WaldenburgGermanyTel. +49 (0) 79 42 945 - 0A Dimensions: [mm]Additional FeaturesSafety key to lock/ unkock74271D2 General Properties:Ferrite core Ferrite core Ferrite core Plastic housing Plastic housing Test cable Test cablePropertiesMaterial Initial permeability Curie temperatureColourFlammability ClassificationApplicable cable Applicable cable lengthµi T CValue 4 W 620620150Grey UL94-V0AWG26120Unit°Cmm Tol.typ.typ.F Typical Impedance Characteristics:I Cautions and Warnings:The following conditions apply to all goods within the product series of WE-STAR RINGof Würth Elektronik eiSos GmbH & Co. KG:General:All recommendations according to the general technical specifications of the data sheet have to be complied with.The disposal and operation of the product within ambient conditions which probably alloy or harm the component surface has to be avoided.The packaging of the product is to encase the needed humidity of the plastic housing. To ensure the humidity level, the products have to be stored in this delivered packaging. If not, the products are losing their humidity. In this case you can re-condition the components according to the internal standard WE1883 to ensure the necessary humidity in the plastic.To ensure the operating mode of the product, the ambient temperature at processing (when the part will be mounted on the cable) has to be in the range of 15 to 25 °C.Before mounting, the part should be stored for one hour in this condition.The responsibility for the applicability of customer specific products and the use in a particular customer design is always within the authority of the customer. All technical specifications for standard products do also apply for customer specific products.Direct mechanical impact to the product and the forcible closing of this shall be prevented as the ferrite material of the ferrite body or the pla-stic housing could flake or in the worst case it could break.Product specific:Follow all instructions mentioned in the datasheet, especially:•The cable diameter must be pointed out, otherwise no warranty will be sustained.•Violation of the technical product specifications such as exceeding the nominal rated current will result in the loss of warranty.1. General Customer ResponsibilitySome goods within the product range of Würth Elektronik eiSos GmbH & Co. KG contain statements regarding general suitability for certain application areas. These statements about suitability are based on our knowledge and experience of typical requirements concerning the are-as, serve as general guidance and cannot be estimated as binding statements about the suitability for a customer application. The responsibi-lity for the applicability and use in a particular customer design is always solely within the authority of the customer. Due to this fact it is up to the customer to evaluate, where appropriate to investigate and decide whether the device with the specific product characteristics described in the product specification is valid and suitable for the respective customer application or not.2. Customer Responsibility related to Specific, in particular Safety-Relevant ApplicationsIt has to be clearly pointed out that the possibility of a malfunction of electronic components or failure before the end of the usual lifetime can-not be completely eliminated in the current state of the art, even if the products are operated within the range of the specifications.In certain customer applications requiring a very high level of safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health it must be ensured by most advanced technological aid of suitable design of the customer application that no injury or damage is caused to third parties in the event of malfunction or failure of an electronic component.3. Best Care and AttentionAny product-specific notes, warnings and cautions must be strictly observed.4. Customer Support for Product SpecificationsSome products within the product range may contain substances which are subject to restrictions in certain jurisdictions in order to serve spe-cific technical requirements. Necessary information is available on request. In this case the field sales engineer or the internal sales person in charge should be contacted who will be happy to support in this matter.5. Product R&DDue to constant product improvement product specifications may change from time to time. As a standard reporting procedure of the Product Change Notification (PCN) according to the JEDEC-Standard inform about minor and major changes. In case of further queries regarding the PCN, the field sales engineer or the internal sales person in charge should be contacted. The basic responsibility of the customer as per Secti-on 1 and 2 remains unaffected.6. Product Life CycleDue to technical progress and economical evaluation we also reserve the right to discontinue production and delivery of products. As a stan-dard reporting procedure of the Product Termination Notification (PTN) according to the JEDEC-Standard we will inform at an early stage about inevitable product discontinuance. According to this we cannot guarantee that all products within our product range will always be available. Therefore it needs to be verified with the field sales engineer or the internal sales person in charge about the current product availability ex-pectancy before or when the product for application design-in disposal is considered.The approach named above does not apply in the case of individual agreements deviating from the foregoing for customer-specific products.7. Property RightsAll the rights for contractual products produced by Würth Elektronik eiSos GmbH & Co. KG on the basis of ideas, development contracts as well as models or templates that are subject to copyright, patent or commercial protection supplied to the customer will remain with Würth Elektronik eiSos GmbH & Co. KG.8. General Terms and ConditionsUnless otherwise agreed in individual contracts, all orders are subject to the current version of the “General Terms and Conditions of Würth Elektronik eiSos Group”, last version available at .J Important Notes:The following conditions apply to all goods within the product range of Würth Elektronik eiSos GmbH & Co. KG:分销商库存信息: WURTH-ELECTRONICS 7427155。

DTC114TKA-TP;中文规格书,Datasheet资料

Micro Commercial Components
TM

/
Revision: 1
2005/06/29
分销商库存信息:
MICRO-COMMERICAL-CO DTC114TKA-TP
Suggested Solder Pad Layout
.031 .800 .035 .900 .087 2.200 inches mm
.037 .950 .037 .950

/
Revision: 1
2005/06/29
DTC114TKA
MCC
NPN Digital Transistor
SOT-23-3L
A D 3 1 2
1. Base 2. Emitter 3. Collector
Absolute Maximum Ratings
Parameter
Collector-Base Voltage Collector-Emitter Voltage Emitter-Base voltage Collector Current-Continuous Collector Dissipation Junction Temperature Storage Temperature Range
MCC
Micro Commercial Components
TM

omponents 20736 Marilla Street Chatsworth !"# $
% !"#
DTC114TKA
Min
50 50 5 ----100 --7 ---
Typ
----------300 --10 250
Max

74ACT244MTC中文资料

© 2005 Fairchild Semiconductor Corporation DS009943November 1988Revised March 200574AC244 • 74ACT244 Octal Buffer/Line Driver with 3-STATE Outputs74AC244 • 74ACT244Octal Buffer/Line Driver with 3-STATE OutputsGeneral DescriptionThe AC/ACT244 is an octal buffer and line driver designed to be employed as a memory address driver, clock driver and bus-oriented transmitter/receiver which provides improved PC board density.Featuress I CC and I OZ reduced by 50%s 3-STATE outputs drive bus lines or buffer memory address registers s Outputs source/sink 24 mA s ACT244 has TTL-compatible inputsOrdering Code:Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.Pb-Free package per JEDEC J-STD-020B.Note 1: “_NL” indicates Pb-Free package (per JEDEC J-STD-020B). Please use order number as indicated.FACT ¥ is a trademark of Fairchild Semiconductor Corporation.Order Number Package Package DescriptionNumber 74AC244SC M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide 74AC244SCX_NL (Note 1)M20B Pb-Free 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide 74AC244SJ M20D Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide74AC244MTC MTC2020-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide 74AC244MTCX_NL (Note 1)MTC20Pb-Free 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide74AC244PC N20A 20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide 74ACT244SC M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide 74ACT244SCX_NL (Note 1)M20B Pb-Free 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide 74ACT244SJ M20D Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 74ACT244MSA MSA2020-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide 74ACT244MTC MTC2020-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide 74ACT244MTCX_NL (Note 1)MTC20Pb-Free 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide74ACT244PCN20A20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide 274A C 244 • 74A C T 244Logic SymbolIEEE/IECConnection DiagramPin DescriptionsTruth TablesX ImmaterialZ High ImpedancePin Names DescriptionOE 1, OE 23-STATE Output Enable InputsI 0–I 7Inputs O 0–O 7OutputsInputs OutputsOE 1I n (Pins 12, 14, 16, 18)L L L L H H HXZ Inputs OutputsOE 2I n (Pins 3, 5, 7, 9)L L L L H H HXZ74AC244 • 74ACT244Absolute Maximum Ratings (Note 2)Recommended Operating ConditionsNote 2: Absolute maximum ratings are those values beyond which damage to the device may occur. The databook specifications should be met, with-out exception, to ensure that the system design is reliable over its power supply, temperature, and output/input loading variables. Fairchild does not recommend operation of FACT ¥ circuits outside databook specifications.DC Electrical Characteristics for ACNote 3: All outputs loaded; thresholds on input associated with output under test.Note 4: Maximum test duration 2.0 ms, one output loaded at a time.Note 5: I IN and I CC @ 3.0V are guaranteed to be less than or equal to the respective limit @ 5.5V V CC .Supply Voltage (V CC ) 0.5V to 7.0VDC Input Diode Current (I IK )V I 0.5V 20 mA V I V CC 0.5V 20 mADC Input Voltage (V I )0.5V to V CC 0.5VDC Output Diode Current (I OK )V O 0.5V 20 mA V O V CC 0.5V 20 mADC Output Voltage (V O ) 0.5V to V CC 0.5VDC Output Source or Sink Current (I O )r 50 mA DC V CC or Ground Current per Output Pin (I CC or I GND )r 50 mAStorage Temperature (T STG ) 65q C to 150q CJunction Temperature (T J )PDIP140q CSupply Voltage (V CC )AC 2.0V to 6.0V ACT4.5V to5.5V Input Voltage (V I )0V toV CC Output Voltage (V O )0V to V CCOperating Temperature (T A ) 40q C to 85q CMinimum Input Edge Rate ('V/'t)AC DevicesV IN from 30% to 70% of V CC V CC @ 3.3V, 4.5V, 5.5V 125 mV/nsMinimum Input Edge Rate ('V/'t)ACT Devices V IN from 0.8V to 2.0V V CC @ 4.5V, 5.5V125 mV/nsSymbol Parameter V CC T A 25q C T A 55q C to 125q C T A 40q C to 85q CUnitsConditions (V)Typ Guaranteed Limits V IHMinimum HIGH Level 3.0 1.5 2.1 2.1 2.1V OUT 0.1V Input Voltage4.5 2.25 3.15 3.15 3.15V or V CC 0.1V5.5 2.75 3.85 3.85 3.85V ILMaximum LOW Level 3.0 1.50.90.90.9V OUT 0.1VInput Voltage4.5 2.25 1.35 1.35 1.35Vor V CC 0.1V5.5 2.75 1.65 1.65 1.65V OHMinimum HIGH Level 3.0 2.99 2.9 2.9 2.9Output Voltage4.5 4.49 4.4 4.4 4.4V I OUT 50 P A5.5 5.495.4 5.4 5.43.0 2.56 2.4 2.46I OH 12 mA 4.5 3.86 3.7 3.76VI OH 24 mA 5.54.86 4.7 4.76I OH 24 mA (Note 3)V OLMaximum LOW Level 3.00.0020.10.10.1Output Voltage4.50.0010.10.10.1VI OUT 50 P A 5.50.0010.10.10.13.00.360.500.44I OL 12 mA 4.50.360.500.44VI OL 24 mA 5.50.360.500.44I OL 24 mA (Note 3)I IN Maximum Input 5.5r 0.1r 1.0r 1.0P A V I V CC , GND(Note 5)Leakage Current I OZMaximum V I (OE) V IL , V IH 3-STATE 5.5r 0.25r 5.0r 2.5P AV I V CC , V GND CurrentV O V CC , GND I OLD Minimum Dynamic 5.55075mA V OLD 1.65V Max I OHD Output Current (Note 4) 5.5 50 75mA V OHD 3.85V Min I CC Maximum Quiescent 5.54.080.040.0P AV IN V CC (Note 5)Supply Currentor GND 474A C 244 • 74A C T 244DC Electrical Characteristics for ACTNote 6: All outputs loaded; thresholds on input associated with output under test.Note 7: Maximum test duration 2.0 ms, one output loaded at a time.Symbol ParameterV CC T A 25q C T A 55q C to 125q C T A 40q C to 85q CUnits Conditions (V)Typ Guaranteed Limits V IH Minimum HIGH Level 4.5 1.5 2.0 2.0 2.0V V OUT 0.1V Input Voltage 5.5 1.5 2.0 2.0 2.0or V CC 0.1V V IL Maximum LOW Level 4.5 1.50.80.80.8V V OUT 0.1V Input Voltage 5.5 1.50.80.80.8or V CC 0.1V V OHMinimum HIGH Level 4.5 4.49 4.4 4.4 4.4VI OUT 50 P A Output Voltage5.5 5.495.4 5.4 5.4I OH 124.5 3.86 3.70 3.76VI OH 24 mA 5.54.864.70 4.76I OH 24 mA (Note 6)V OLMaximum LOW Level 4.50.0010.10.10.1VI OUT 50 P A Output Voltage5.50.0010.10.10.1I OL 12 mA4.50.360.500.44V I OL 24 mA5.50.360.500.44I OL 24 mA (Note 6)I IN Maximum Input 5.5r 0.1r 1.0r 1.0P A V I V CC , GND Leakage Current I OZ Maximum 3-STATE 5.5r 0.25r 5.0r 2.5P A V I V IL , V IH Current V O V CC , GND I CCT Maximum 5.50.61.6 1.5mA V I V CC2.1V I CC /InputI OLD Minimum Dynamic 5.55075mA V OLD 1.65V Max I OHD Output Current (Note 7) 5.5 5075mA V OHD 3.85V Min I CCMaximum Quiescent 5.54.080.040.0P AV IN V CC Supply Currentor GND74AC244 • 74ACT244AC Electrical Characteristics for ACNote 8: Voltage Range 3.3 is 3.3V r 0.3VVoltage Range 5.0 is 5.0V r 0.5VAC Electrical Characteristics for ACTNote 9: Voltage Range 5.0 is 5.0V r 0.5VCapacitanceSymbol ParameterV CCT A 25q C T A 55q C to 125q C T A 40q C to 85q CUnits(V)C L 50 pFC L 50 pF C L 50 pF (Note 8)Min Typ Max Min Max Min Max t PLH Propagation Delay 3.3 2.0 6.59.0 1.012.5 1.510.0ns Data to Output 5.0 1.5 5.07.0 1.09.5 1.07.5t PHL Propagation Delay 3.3 2.0 6.59.0 1.012.0 2.010.0ns Data to Output 5.0 1.5 5.07.0 1.09.0 1.07.5t PZH Output Enable Time 3.3 2.0 6.010.5 1.011.5 1.511.0ns 5.0 1.5 5.07.0 1.09.0 1.58.0t PZL Output Enable Time 3.3 2.57.510.0 1.013.0 2.011.0ns 5.0 1.5 5.58.0 1.010.5 1.58.5t PHZ Output Disable Time 3.3 3.07.010.0 1.012.5 1.510.5ns 5.0 2.5 6.59.0 1.010.5 1.09.5t PLZOutput Disable Time3.3 2.57.510.5 1.013.0 2.511.5ns 5.02.06.59.01.011.02.09.5Symbol ParameterV CCT A 25q C T A 55q C to 125q C T A 40q C to 85q CUnits(V)C L 50 pFC L 50 pF C L 50 pF (Note 9)Min Typ Max Min Max Min Max t PLH Propagation Delay 5.02.06.59.01.010.01.510.0ns Data to Output t PHL Propagation Delay 5.02.07.09.01.010.01.510.0nsData to Output t PZH Output Enable Time 5.0 1.5 6.08.5 1.09.5 1.09.5ns t PZL Output Enable Time 5.0 2.07.09.5 1.011.0 1.510.5ns t PHZ Output Disable Time 5.0 2.07.09.5 1.011.0 1.510.5ns t PLZOutput Disable Time5.02.57.510.01.011.52.010.5nsSymbol ParameterTyp Units ConditionsC IN Input Capacitance4.5pF V CC OPEN C PDPower Dissipation Capacitance45.0pFV CC 5.0V 674A C 244 • 74A C T 244Physical Dimensions inches (millimeters) unless otherwise noted20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" WidePackage Number M20B74AC244 • 74ACT244Physical Dimensionsinches (millimeters) unless otherwise noted (Continued)Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm WidePackage Number M20D 874A C 244 • 74A C T 244Physical Dimensions inches (millimeters) unless otherwise noted (Continued)20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm WidePackage Number MSA2074AC244 • 74ACT244Physical Dimensionsinches (millimeters) unless otherwise noted (Continued)20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm WidePackage Number MTC201074A C 244 • 74A C T 244 O c t a l B u f f e r /L i n e D r i v e r w i t h 3-S T A T E O u t p u t sPhysical Dimensions inches (millimeters) unless otherwise noted (Continued)20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" WidePackage Number N20AFairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.LIFE SUPPORT POLICYFAIRCHILD ’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:1.Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be rea-sonably expected to result in a significant injury to the user. 2. A critical component in any component of a life support device or system whose failure to perform can be rea-sonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.。