FPGA可编程逻辑器件芯片EP2SGX90EF1508I4中文规格书
FPGA可编程逻辑器件芯片EP2AGX125EF35C4中文规格书
Descriptor Set Address Alignment All descriptor set addresses and descriptors within a descriptor set must be aligned to a 32-bit address. The memory size of the DMA channel’s configuration is ignored for descriptor set fetches, which avoids the need to align descriptor sets based on the previous descriptor set’s memory width configuration.For descriptor sets containing only a single descriptor the transfer takes place as a single 32-bit transfer. For descriptor sets containing multiple descriptors, each 32-bit descriptor is fetched individually and treated as multiple 32-bit transfers.DMA Channel Peripheral DMA BusThe peripheral DMA bus connects the DMA channel to a peripheral or another DMA channel.The DMA channel connects to peripherals or other DMA channels via the peripheral DMA bus. This is a dedicated point-to-point interface supporting data bus widths of 8, 16, 32 or 64 bits. The data bus widths for a given DMA channel on a particular processor may vary and are not configurable. The assigned bus width can be determined by reading the DMA_STAT.PBWID field.The DMA channel operates at SCLK frequency as does the peripheral DMA bus. The following table provides descriptions of the peripheral DMA bus signals.Table 13-8:DMA Channel Address Alignment Requirements Configured Memory SizeAddress Restriction 1 ByteNo restriction 2 BytesADDR[0] == 0 4 BytesADDR[1:0] == 0 8 Bytes ADDR[2:0] == 0 16 BytesADDR[3:0] == 0 32 BytesADDR[4:0] == 0Table 13-9:Peripheral DMA Bus Signals Signal Width (bits)DescriptionPDMA_WRITE_DATA8/16/32/64 Data bus used for write operations. The width of the bus can be determined from DMA_STAT.PBWID PDMA_READ_DATA8/16/32/64 Data bus used for read operations. The width of the bus can be determined from DMA_STAT.PBWID PDMA_DMA_GRANT Control signals to indicate that data is valid for DMAchannel read operations (peripheral transmit) and that theDMA channel is ready to receive data for write operations(peripheral receive)DMA DefinitionsTo make the best use of the DMA channel, it is useful to understand the following terms.D IRECT M EMORY A CCESS (DMA)DMA C HANNEL F UNCTIONAL D ESCRIPTIONSCB Interface SignalsThe DMA channel operates at SCLK frequency as does the SCB interface. The SCB crossbar handles the internal arbitration of the transfer requests of all the masters interfaced to the SCB crossbar instance (see the following table.DMA Channel Peripheral DMA BusThe peripheral DMA bus connects the DMA channel to a peripheral or another DMA channel.The DMA channel connects to peripherals or other DMA channels via the peripheral DMA bus. This is a dedicated point-to-point interface supporting data bus widths of 8, 16, 32 or 64 bits. The data bus widths for a given DMA channel on a particular processor may vary and are not configurable. The assigned bus width can be determined by reading the DMA_STAT.PBWID field.The DMA channel operates at SCLK frequency as does the peripheral DMA bus. The following table provides descriptions of the peripheral DMA bus signals.Table 13-2:SCB Interface Signals Signal Width (bits)DescriptionSCB_WRITE_DATA 16/32/64/128 Data bus used for write operations. The widthof the bus can be determined from DMA_STAT.MBWIDSCB_WRITE_A DDRESS32Write address bus. Provides the address of the first transfer in a burst transaction SCB_READ_DATA 16/32/64/128 Data bus used for read operations. The widthof the bus can be determined from DMA_STAT.MBWIDSCB_READ_ADDRESS 32 Read address bus. Provides the address of thefirst transfer in a burst transactionTable 13-3:Peripheral DMA Bus Signals Signal Width (bits)DescriptionPDMA_WRITE_DATA8/16/32/64 Data bus used for write operations. The width of the bus can be determined from DMA_STAT.PBWID PDMA_READ_DATA8/16/32/64 Data bus used for read operations. The width of the bus can be determined from DMA_STAT.PBWID PDMA_DMA_GRANT Control signals to indicate that data is valid for DMAchannel read operations (peripheral transmit) and that theDMA channel is ready to receive data for write operations(peripheral receive)。
FPGA可编程逻辑器件芯片EPF10K10TI144-4中文规格书
Referenced DocumentsFigure2–91.Fast PLL and Channel Layout in the EP2SGX60E to EP2SGX130 Devices Note(1) Note to Figure2–91:(1)See Tables2–39 through Tables2–41 for the number of channels each device supports.Referenced Documents This chapter references the following documents:■DC & Switching Characteristics chapter in volume 1 of the Stratix II GX Handbook■DSP Blocks in Stratix II GX Devices chapter in Volume 2 of the Stratix II GX Device Handbook■External Memory Interfaces in Stratix II & Stratix II GX Devices chapter in volume 2 of the Stratix II GX Device Handbook■High-Speed Differential I/O Interfaces with DP A in Stratix II & Stratix II GX Devices chapter in volume 2 of the Stratix II GX Handbook■PLLs in Stratix II & Stratix II GX Devices chapter in volume 2 of the Stratix II GX Device Handbook■Selectable I/O Standards in Stratix II & Stratix II GX Devices chapter in volume 2 of the Stratix II GX Handbook■Stratix II GX Device Handbook, volume 2■Stratix II GX Transceiver Architecture Overview chapter in volume 2 of the Stratix II GX HandbookOperating ConditionsFigure4–4.Transmitter Output WaveformFigure4–5.Maximum Receiver Input Pin VoltageNote to Figure4–5:(1)The absolute V MAX that the receiver input pins can tolerate is 2V.Tables4–7 through 4–12 show the typical V OD for data rates from600Mbps to 6.375Gbps. The specification is for measurement at thepackage ball.Table4–7.Typical V OD Setting, TX Term = 100 ΩNote(1)V C C H TX = 1.5V V OD Setting (mV)200400600800100012001400 V OD Typical (mV)220430625830102012001350 Note to Table4–7:(1)Applicable to data rates from 600 Mbps to 6.375Gbps. Specification is for measurement at the package ball.Configuration & TestingTable 3–5 shows the specifications for bias voltage and current of the Stratix II GX temperature sensing diode.The temperature-sensing diode works for the entire operating range shown in Figure 3–2.Figure 3–2.Temperature Versus Temperature-Sensing Diode Voltage Table 3–5.Temperature-Sensing Diode Electrical Characteristics ParameterMinimum Typical Maximum Unit IBIAS high80100120 μA IBIAS low81012 μA VBP - VBN0.30.9V VBN0.7V Series resistance 3Ω。
FPGA可编程逻辑器件芯片EP4CE115F29I8N中文规格书
P IPELINED V ISION P ROCESSOR (PVP)P ROGRAMMING M ODEL•If the PVP_THCn_CFG.STATWCNT field =18, the PVP_THCn_HFCNT_STAT and PVP_THCn_HCNT0_STAT to PVP_THCn_HCNT15_STAT, and PVP_THCn_RREP_STAT registers are sent.The STATWCNT field of all processing blocks other than IPFs and THCs are reserved and must be initialized with zero values.Status reports only output status registers. There is no programmable offset as in the case of block config-uration.Block Status StructureWhen a processing block contributes to a status report, its data words are headed by a block status header (BSH). The BSH is similar to the block configuration header (BCH). It consists of the block ID value and also has a word count field. The latter mirrors the STATWCNT value as specified in the block configuration register. Unlike BCHs the BSHs do not have an offset field. The entity of Block Status Header and respec-tive status words is called Block Status Structure (BSS). A BSS always consists of STATWCNT+1 32-bit words.A status report consists of a list of block status structures. Such a list is referred to as block status list (BSL).An example is shown in the BSL example figure. This example assumes that both threshold blocks are configured in camera pipe mode. IPF0 and THC0 blocks are configured to send status to the report. The THC1 block is not configured to send status, so its PVP_THCn_CFG.STATWCNT field =0.Figure 30-70:BSL ExampleThe input formatters make always the first entries in the block status list. If both threshold blocks are enabled in the same pipe, the one that comes first is closer to the IPFn in the pipe arrangement. In case the pipe configuration is not known, the block ID in the BSHs can be consulted.Although it is not a hardware requirement, it is recommended that the work unit transfer count of the DMA associated with the status output matches the number of 32-bit words in the BSL.ADSP-BF60X B LACKFIN P ROCESSOR H ARDWARE R EFERENCEP IPELINED V ISION P ROCESSOR (PVP)ADSP-BF60X PVP R EGISTER D ESCRIPTIONSTable 30-49:ADSP-BF60x PVP Register List (Continued)Name DescriptionPVP_ACU_CFG ACU ConfigurationPVP_ACU_CTL ACU ControlPVP_ACU_OFFSET ACU SUM ConstantPVP_ACU_FACTOR ACU PROD ConstantPVP_ACU_SHIFT ACU Shift ConstantPVP_ACU_MIN ACU Lower Sat Threshold MinPVP_ACU_MAX ACU Upper Sat Threshold MaxPVP_UDS_CFG UDS ConfigurationPVP_UDS_CTL UDS ControlPVP_UDS_OHCNT UDS Output HCNTPVP_UDS_OVCNT UDS Output VCNTPVP_UDS_HAVG UDS HAVGPVP_UDS_VAVG UDS V AVGPVP_IPF0_CFG IPF0 (Camera Pipe) ConfigurationPVP_IPFn_PIPECTL IPFn (Camera/Memory Pipe) Pipe ControlPVP_IPFn_CTL IPFn (Camera/Memory Pipe) ControlPVP_IPFn_TAG IPFn (Camera/Memory Pipe) TAG ValuePVP_IPFn_FCNT IPFn (Camera/Memory Pipe) Frame CountPVP_IPFn_HCNT IPFn (Camera/Memory Pipe) Horizontal CountPVP_IPFn_VCNT IPFn (Camera/Memory Pipe) Vertical CountPVP_IPF0_HPOS IPF0 (Camera Pipe) Horizontal PositionPVP_IPF0_VPOS IPF0 (Camera Pipe) Vertical PositionADSP-BF60X B LACKFIN P ROCESSOR H ARDWARE R EFERENCEP IPELINED V ISION P ROCESSOR (PVP)ADSP-BF60X PVP R EGISTER D ESCRIPTIONSTable 30-49:ADSP-BF60x PVP Register List (Continued)Name DescriptionPVP_THCn_HFCNT THCn Histogram Frame CountPVP_THCn_RMAXREP THCn Max RLE ReportsPVP_THCn_CMINVAL THCn Min Clip ValuePVP_THCn_CMINTH THCn Clip Min ThresholdPVP_THCn_CMAXTH THCn Clip Max ThresholdPVP_THCn_CMAXVAL THCn Max Clip ValuePVP_THCn_TH0THCn Threshold Value 0PVP_THCn_TH1THCn Threshold Value 1PVP_THCn_TH2THCn Threshold Value 2PVP_THCn_TH3THCn Threshold Value 3PVP_THCn_TH4THCn Threshold Value 4PVP_THCn_TH5THCn Threshold Value 5PVP_THCn_TH6THCn Threshold Value 6PVP_THCn_TH7THCn Threshold Value 7PVP_THCn_TH8THCn Threshold Value 8PVP_THCn_TH9THCn Threshold Value 9PVP_THCn_TH10THCn Threshold Value 10PVP_THCn_TH11THCn Threshold Value 11PVP_THCn_TH12THCn Threshold Value 12PVP_THCn_TH13THCn Threshold Value 13PVP_THCn_TH14THCn Threshold Value 14PVP_THCn_TH15THCn Threshold Value 15ADSP-BF60X B LACKFIN P ROCESSOR H ARDWARE R EFERENCE。
FPGA可编程逻辑器件芯片EP4CE55F29I7中文规格书
Functional OperationLow Power FeaturesThe Blackfin processor provides a low power hibernate state, and the CAN module includes built-in sleep and suspend modes to save power. The behavior of the CAN module in these three modes is described in the following sections. 110001Normal transmission on CAN bus line.Read back.No external acknowledge required.Transmit message and acknowledge are transmitted on CAN busline.CANxRX input and internal loop are enabled (internal OR ofTX and RX).110011Normal transmission on CAN bus line.Read back.No external acknowledge required.Transmit message and acknowledge are transmitted on CAN busline.CANxRX input is ignored.Internal loop is enabled110111No transmission on CAN bus line.Read back.No external acknowledge required.Neither transmit message nor acknowledge are transmitted onCANxTX.CANxRX input is ignored.Internal loop is enabled.Table 31-4. CAN Test Modes (Cont’d)MR B MA A DI L DTODR I CD E Functional DescriptionCAN RegistersTable 31-5. CAN Global RegistersRegister Name Description NotesCANx_CONTRO L “Master Control (CANx_CONTROL) Regis-ters” on page31-45Reserved bits 15:8 and 3must always be written as ‘0’CANx_STATUS“Global CAN Status (CANx_STATUS) Reg-isters” on page31-46Write accesses have no effectCANx_DEBUG“CAN Debug (CANx_DEBUG) Registers”on page31-47Use of these modes is not CAN-compliantCANx_CLOCK“CAN Clock (CANx_CLOCK) Registers” onpage31-47Accessible only in configuration modeCANx_TIMING“CAN Timing (CANx_TIMING) Registers”on page31-48Accessible only in configuration modeCANx_INTR“CAN Interrupt (CANx_INTR) Registers” onpage31-48Reserved bits 15:8 and 5:4 must always be written as ‘0’CANx_GIM“Global CAN Interrupt Mask (CANx_GIM)Registers” on page31-49Bits 15:11 and 9 are reservedCANx_GIS“Global CAN Interrupt Status (CANx_GIS)Registers” on page31-49Bits 15:11 and 9 are reservedCANx_GIF“Global CAN Interrupt Flag (CANx_GIF)Registers” on page31-50Bits 15:11 and 9 are reservedTable 31-6. CAN Mailbox/Mask RegistersRegister Name Description NotesCANx_AMxxH CANx_AMxxL “Acceptance Mask(CANx_AMxx) Registers” onpage31-50Do not write when mailboxMBxx is enabledCANx_MBxx_ID1 CANx_MBxx_ID0“Mailbox Word 7(CANx_MBxx_ID1) Registers”on page31-54Do not write when mailboxMBxx is enabledCANx_MBxx_TIMESTAM P “Mailbox Word 5(CANx_MBxx_TIMESTAMP)Registers” on page31-58Holds timestamp informationwhen timestamp mode is active。
FPGA可编程逻辑器件芯片EP2S60F484I4中文规格书
Tables 5–77 through 5–79 show the I/O toggle rates for Stratix II devices.
Table 5–77. Maximum Input Toggle Rate on Stratix II Devices (Part 1 of 2)
Parameter
tP I tP C O U T tP I tP C O U T tP I tP C O U T tP I tP C O U T tP I tP C O U T
Minimum Timing Industrial Commercial
-3 Speed Grade (1)
-3 Speed Grade (2)
-4 Speed Grade
-5 Speed Grade
Column I/O Pins (MHz) Row I/O Pins (MHz)
-3 -4
-5
-3 -4
-5
500 500 450 500 500 450
500 500 450 500 500 450
500 500 450 500 500 450
500 500 450 500 500 450
500 500 450 500 500 450
Input I/O Standard
LVTTL 2.5-V LVTTL/CMOS 1.8-V LVTTL/CMOS 1.5-V LVTTL/CMOS LVCMOS SSTL-2 Class I SSTL-2 Class II SSTL-18 Class I SSTL-18 Class II 1.5-V HSTL Class I 1.5-V HSTL Class II 1.8-V HSTL Class I
FPGA可编程逻辑器件芯片EP2S180F1508I4N中文规格书
206 212 212 206 212 212 178 212 212
141 145 145
-
-
-
115 145 145
108 111 111
-
-
-
86 111 111
83
88
88
-
-
-
79 88
88
65
72
72
-
-
-
74 72
72
387 427 427 387 427 427 391 427 427
652 963 963 652 963 963 618 963 963
333 347 347 333 347 347 270 347 347
182 247 247
-
-
-
198 247 247
135 194 194
-
-
-
155 194 194
364 680 680 364 680 680 350 680 680
405 516 516 405 516 516 393 516 516
261 325 325 261 325 325 253 325 325
223 274 274 223 274 274 224 274 274
194 236 236
-
-
-
199 236 236
174 209 209
-
-
-
180 209 209
120
ps
1.5-V LVCMOS
255
370
140
140
105
ps
SSTL-2 Class I
175
295
65
FPGA可编程逻辑器件芯片EP4CE40F29I8L中文规格书
Chapter 5:Clock Networks and PLLs in Arria II DevicesPLLs in Arria II Devices Arria II Device Handbook Volume 1: Device Interfaces and IntegrationThe VCO frequency reported by the Quartus II software is the value after thepost-scale counter divider (K ).Each PLL has one pre-scale counter (N ) and one multiply counter (M ) with a range of 1to 512 for both M and N . The n counter does not use duty-cycle control because the only purpose of this counter is to calculate frequency division. There are seven generic post-scale counters in each PLL that can feed GCLKs, RCLKs, or external clockoutputs. These post-scale counters range from 1to 512 with a 50% duty cycle setting. The high- and low-count values for each counter ranges from 1 to 256. The sum of the high- and low-count values chosen for a design selects the divide value for a given counter.The Quartus II software automatically chooses the appropriate scaling factorsaccording to the input frequency, multiplication, and division values entered into the ALTPLL megafunction.Post-Scale Counter CascadingArria II PLLs support post-scale counter cascading to create counters larger than 512. This is automatically implemented in the Quartus II software by feeding the output of one C counter into the input of the next C counter, as shown in Figure 5–32.When cascading post-scale counters to implement a larger division of thehigh-frequency VCO clock, the cascaded counters behave as one counter with the product of the individual counter settings. For example, if C0=40 and C1 = 20, the cascaded value is C0 C1 = 800.1Post-scale counter cascading is set in the configuration file. You cannot accomplishpost-scale counter cascading with PLL reconfiguration.Figure 5–32.Counter Cascading for Arria II DevicesNote to Figure 5–32:(1)For Arria II GX devices, n = 6. For Arria II GZ devices, n =6 or 9.V CO O u tp u t V CO O u tp u t V CO O u tp u t V CO O u tp u t V CO O u tp u tV CO O u tp u t om p r ecedi n gs t-s cale cou n te rChapter 5:Clock Networks and PLLs in Arria II DevicesClock Networks in Arria II Devices Arria II Device Handbook Volume 1: Device Interfaces and IntegrationIn Arria II devices, the clkena signals are supported at the clock network level instead of at the PLL output counter level. This allows you to gate off the clock even when a PLL is not used. You can also use the clkena signals to control the dedicated external clocks from the PLLs. Arria II devices also have an additional metastability register that aids in asynchronous enable or disable of the GCLK and RCLK networks. You can optionally bypass this register in the Quartus II software.Figure 5–17 shows a waveform example for the clock output enable. The clkena signal is synchronous to the falling edge of the clock output.The PLL can remain locked independent of the clkena signals because theloop-related counters are not affected. This feature is useful for applications that require a low power or sleep mode. The clkena signal can also disable clock outputs if the system is not tolerant of frequency over-shoot during resynchronization.Clock Source Control for PLLsThe clock input to Arria II PLLs comes from clock input multiplexers. The clock multiplexer inputs come from dedicated clock input pins, PLLs through the GCLK and RCLK networks, or from dedicated connections between adjacent corner and center PLLs (Arria II GX devices) or from dedicated connections between adjacent top/bottom and left/right PLLs (Arria II GZ devices). For Arria II GX devices, the clock input sources to corner (PLL _1, PLL _2, PLL _3, PLL _4) and center PLLs (PLL _5 and PLL _6) are shown in Figure 5–18. For Arria II GZ devices, the clock input sources to top/bottom and left/right PLLs (L2, L3, T1, T2, B1, B2, R2, and R3) are shown in Figure 5–19.The multiplexer select lines are set in the configuration file only. When configured, you cannot change this block without loading a new .sof or .pof . The Quartus II software automatically sets the multiplexer select signals depending on the clock sources selected in your design.Figure 5–17.clkena Signals for Arria II DevicesNote to Figure 5–17:(1)You can use the clkena signals to enable or disable the GCLK and RCLK networks or the PLL<#>_CLKOUT pins.clkenao u tp u t of A N Dgate w ith R2 bypassedo u tp u t ofclockselect m ultiplexero u tp u t of A N Dgate w ith R2 not b ypassedChapter 5:Clock Networks and PLLs in Arria II DevicesClock Networks in Arria II Devices Arria II Device Handbook Volume 1: Device Interfaces and Integration Global Clock NetworksArria II devices provide up to 16 GCLKs that can drive throughout the device, serving as low-skew clock sources for functional blocks such as adaptive logic modules(ALMs), digital signal processing (DSP) blocks, embedded memory blocks, and PLLs. Arria II I/O elements (IOEs) and internal logic can drive GCLKs to create internally generated GCLKs and other high fan-out control signals; for example, synchronous or asynchronous clears and clock enables. Figure 5–1 and Figure 5–2 show CLK pins and PLLs that can drive GCLK networks in Arria II devices.Figure 5–1.GCLK Networks in Arria II GX DevicesNotes to Figure 5–1:(1)PLL_5 and PLL_6 are only available in EP2AGX95, EP2AGX125, EP2AGX190, and EP2AGX260 devices.(2)Because there are no dedicated clock pins on the left side of an Arria II GX device, GCLK[0..3]are not driven by any clock pins.CLK[4..7]CLK[8..11]CLK[12..15]Center PLLs Top Right PLLTop Left PLLBottom Left PLL Bottom Right PLL(1)(1)。
FPGA可编程逻辑器件芯片EP2SGX30DF780I4中文规格书
Logic Array BlocksApplications and Protocols Supported with Stratix II GX DevicesEach Stratix II GX transceiver block is designed to operate at any serial bitrate from 600 Mbps to 6.375 Gbps per channel. The wide data rate rangeallows Stratix II GX transceivers to support a wide variety of standardsand protocols, such as PCI Express, GIGE, SONET/SDH, SDI, OIF-CEI,and XAUI. Stratix II GX devices are ideal for many high-speedcommunication applications, such as high-speed backplanes,chip-to-chip bridges, and high-speed serial communications links.Example Applications Support for Stratix II GXStratix II GX devices can be used for many applications, including:■Traffic management with various levels of quality of service (QoS)and integrated serial backplane interconnect■Multi-port single-protocol switching (for example, PCI Express,GIGE, XAUI switch, or SONET/SDH)Logic Array Blocks Each logic array block (LAB) consists of eight adaptive logic modules (ALMs), carry chains, shared arithmetic chains, LAB control signals, local interconnects, and register chain connection lines. The local interconnect transfers signals between ALMs in the same LAB. Register chain connections transfer the output of an ALM register to the adjacent ALM register in a LAB. The Quartus II Compiler places associated logic in a LAB or adjacent LABs, allowing the use of local, shared arithmetic chain, and register chain connections for performance and area efficiency. Table2–17 shows Stratix II GX device resources. Figure2–32 shows the Stratix II GX LAB structure.Table2–17.Stratix II GX Device ResourcesDeviceM512 RAMColumns/BlocksM4K RAMColumns/BlocksM-RAMBlocksDSP BlockColumns/BlocksLABColumnsLAB RowsEP2SGX306/2024/14412/164936 EP2SGX607/3295/25523/366251 EP2SGX908/4886/40843/487168 EP2SGX1309/6997/60963/638187Adaptive Logic ModulesFigure2–41.ALM in Arithmetic ModeWhile operating in arithmetic mode, the ALM can support simultaneoususe of the adder’s carry output along with combinational logic outputs.In this operation, the adder output is ignored. This usage of the adderwith the combinational logic output provides resource savings of up to50% for functions that can use this ability. An example of suchfunctionality is a conditional operation, such as the one shown inFigure2–42. The equation for this example is:R = (X < Y) ? Y : XTo implement this function, the adder is used to subtract ‘Y’ from ‘X’. If‘X’ is less than ‘Y’, the carry_out signal will be ‘1’. The carry_outsignal is fed to an adder where it drives out to the LAB local interconnect.It then feeds to the LAB-wide syncload signal. When asserted,syncload selects the syncdata input. In this case, the data ‘Y’ drivesthe syncdata inputs to the registers. If ‘X’ is greater than or equal to ‘Y’,the syncload signal is de-asserted and ‘X’ drives the data port of theregisters.Figure2–42.Conditional Operation ExampleThe arithmetic mode also offers clock enable, counter enable, synchronous up and down control, add and subtract control, synchronous clear, synchronous load. The LAB local interconnect data inputs generate the clock enable, counter enable, synchronous up and down and add and subtract control signals. These control signals may be used for the inputs that are shared between the four LUTs in the ALM. The synchronous clear and synchronous load options are LAB-wide signals that affect all registers in the LAB. The Quartus II software automatically places any registers that are not used by the counter into other LABs.。
FPGA可编程逻辑器件芯片EP2S90F1508I4中文规格书
VCCIO (V)
3 2.5 1.8 1.5 1.2
Commercial Typical
0.029 0.036 0.065 0.104 0.177
Unit
%/mV %/mV %/mV %/mV %/mV
Stratix III Device Handbook, Volume 2
Chapter 1: Stratix III Device Data Sheet: DC and Switching Characteristics Switching Characteristics
±30 ±50 ±50 %
±35 ±60 ±60 %
±30 ±40 ±40 %
±30 ±50 ±50 %
±35 ±60 ±60 %
Table 1–9 lists OCT variation with temperature and voltage after power-up calibration. Use Table 1–9 and Equation 1–1 to determine OCT variation without recalibration.
Clock period jitter
Regional tJIT(per) –70 70 –85 85 –100 100 –100 100 –120 120 ps
Cycle-to-cycle period jitter Regional tJIT(cc) –150 150 –170 170 –190 190 –190 190 –230 230 ps
(1) DCD specification applies to clock outputs from PLLs, global clock tree, and IOE driving dedicated and general purpose I/O pins.
FPGA可编程逻辑器件芯片EP2S90F780I3N中文规格书
Modes of OperationThe adder, subtractor, and accumulate functions of a DSP block have four modes of operation:■Simple multiplier ■Multiply-accumulator ■Two-multipliers adder ■Four-multipliers adderTable 2–22 shows the different number of multipliers possible in each DSP block mode according to size. These modes allow the DSP blocks to implement numerous applications for DSP including FFTs, complex FIR, FIR, 2D FIR filters, equalizers, IIR, correlators, matrix multiplication, and many other functions. The DSP blocks also support mixed modes and mixed multiplier sizes in the same block. For example, half of one DSP block can implement one 18 × 18-bit multiplier in multiply-accumulator mode, while the other half of the DSP block implements four 9 × 9-bit multipliers in simple multiplier mode.DSP Block InterfaceThe Stratix II GX device DSP block input registers can generate a shift register that can cascade down in the same DSP block column. Dedicated connections between DSP blocks provide fast connections between the shift register inputs to cascade the shift register chains. You can cascade registers within multiple DSP blocks for 9 × 9- or 18 × 18-bit FIR filters larger than four taps, with additional adder stages implemented inALMs. If the DSP block is configured as 36 × 36 bits, the adder, subtractor, or accumulator stages are implemented in ALMs. Each DSP block can route the shift register chain out of the block to cascade multiple columns of DSP blocks.Table 2–22.Multiplier Size and Configurations per DSP BlockDSP Block Mode9 × 918 × 1836 × 36MultiplierEight multipliers with eight product outputs Four multipliers with four product outputs One multiplier with one product output Multiply-accumulator—T wo 52-bit multiply-accumulate blocks —T wo-multipliers adder Four two-multiplier adder (two 9 × 9 complex multiply)Two two-multiplier adder(one 18×18 complexmultiply)—Four-multipliers adder Two four-multiplier adder One four-multiplier adder —IOE clocks have row and column block regions that are clocked by 8 I/Oclock signals chosen from the 24 quadrant clock resources. Figures2–65and 2–66 show the quadrant relationship to the I/O clock regions. Figure2–65.EP2SGX30 Device I/O Clock GroupsPLLs and Clock NetworksStratix II GX ArchitectureI/O StructureA path in which a pin directly drives a register can require the delay toensure zero hold time, whereas a path in which a pin drives a registerthrough combinational logic may not require the delay. Programmabledelays exist for decreasing input-pin-to-logic-array and IOE inputregister delays. The Quartus II Compiler can program these delays toautomatically minimize setup time while providing a zero hold time.Programmable delays can increase the register-to-pin delays for outputand/or output enable registers. Programmable delays are no longerrequired to ensure zero hold times for logic array register-to-IOE registertransfers. The Quartus II Compiler can create the zero hold time for thesetransfers. Table2–30 shows the programmable delays for Stratix II GXdevices.Table2–30.Stratix II GX Programmable Delay ChainProgrammable Delays Quartus II Logic OptionInput pin to logic array delay Input delay from pin to internal cellsInput pin to input register delay Input delay from pin to input registerOutput pin delay Delay from output register to output pinOutput enable register t CO delay Delay to output enable pinThe IOE registers in Stratix II GX devices share the same source for clearor preset. You can program preset or clear for each individual IOE. Youcan also program the registers to power up high or low afterconfiguration is complete. If programmed to power up low, anasynchronous clear can control the registers. If programmed to power uphigh, an asynchronous preset can control the registers. This featureprevents the inadvertent activation of another device’s active-low inputupon power-up. If one register in an IOE uses a preset or clear signal, allregisters in the IOE must use that same signal if they require preset orclear. Additionally, a synchronous reset signal is available for the IOEregisters.Double Data Rate I/O PinsStratix II GX devices have six registers in the IOE, which support DDRinterfacing by clocking data on both positive and negative clock edges.The IOEs in Stratix II GX devices support DDR inputs, DDR outputs, andbidirectional DDR modes. When using the IOE for DDR inputs, the twoinput registers clock double rate input data on alternating edges. Aninput latch is also used in the IOE for DDR input acquisition. The latchholds the data that is present during the clock high times, allowing bothbits of data to be synchronous with the same clock edge (either rising orfalling). Figure2–82 shows an IOE configured for DDR input. Figure2–83shows the DDR input timing diagram.。
FPGA可编程逻辑器件芯片EP2SGX90EF1152C4N中文规格书
Carry ChainThe carry chain provides a fast carry function between the dedicated adders in arithmetic or shared arithmetic mode. Carry chains can begin in either the first ALM or the fifth ALM in a LAB. The final carry-out signal is routed to an ALM, where it is fed to local, row, or column interconnects. The Quartus II Compiler automatically creates carry chain logic during compilation, or you can create it manually during design entry. Parameterized functions, such as LPM functions, automatically take advantage of carry chains for the appropriate functions. The Quartus II Compiler creates carry chains longer than 16 (8 ALMs in arithmetic or shared arithmetic mode) by linking LABs together automatically. For enhanced fitting, a long carry chain runs vertically, allowing fast horizontal connections to TriMatrix memory and DSP blocks. A carry chain can continue as far as a full column. To avoid routing congestion in one small area of the device when a high fan-in arithmetic function is implemented, the LAB can support carry chains that only utilize either the top half or the bottom half of the LAB before connecting to the next LAB. The other half of the ALMs in the LAB is available for implementing narrower fan-in functions in normal mode. Carry chains that use the top four ALMs in the first LAB will carry into the top half of the ALMs in the next LAB within the column. Carry chains that use the bottom four ALMs in the first LAB will carry into the bottom half of the ALMs in the next LAB within the column. Every other column of the LABs are top-half bypassable, while the other LAB columns are bottom-half bypassable. Refer to “MultiTrack Interconnect” on page2–63 for more information on carry chain interconnect.Shared Arithmetic ModeIn shared arithmetic mode, the ALM can implement a three-input add. In this mode, the ALM is configured with four 4-input LUTs. Each LUT either computes the sum of three inputs or the carry of three inputs. The output of the carry computation is fed to the next adder (either to adder1 in the same ALM or to adder0 of the next ALM in the LAB) using a dedicated connection called the shared arithmetic chain. This shared arithmetic chain can significantly improve the performance of an adder tree by reducing the number of summation stages required to implement an adder tree. Figure2–43 shows the ALM in shared arithmetic mode.Stratix II GX ArchitectureAdaptive Logic ModulesFigure2–44.Example of a 3-Bit Add Utilizing Shared Arithmetic ModeShared Arithmetic ChainIn addition to the dedicated carry chain routing, the shared arithmeticchain available in shared arithmetic mode allows the ALM to implementa three-input add, which significantly reduces the resources necessary toimplement large adder trees or correlator functions. The sharedarithmetic chains can begin in either the first or fifth ALM in a LAB. TheQuartus II Compiler automatically links LABs to create shared arithmeticchains longer than 16 (8ALMs in arithmetic or shared arithmetic mode).For enhanced fitting, a long shared arithmetic chain runs verticallyStratix II GX ArchitectureAdaptive Logic ModulesFigure2–45.Register Chain within a LAB Note(1)Note to Figure2–45:(1)The combinational or adder logic can be utilized to implement an unrelated, un-registered function.。
FPGA可编程逻辑器件芯片EP2S90F1508C5中文规格书
Passive Serial ConfigurationIf the Auto-restart configuration after error option is turned on, the devices releasetheir nSTATUS pins after a reset time-out period (maximum of 100μs). After allnSTATUS pins are released and pulled high, the MAX II device can attempt toreconfigure the chain without needing to pulse nCONFIG low. If this option is turnedoff, the MAX II device must generate a low-to-high transition (with a low pulse of atleast 2μs) on nCONFIG to restart the configuration process.1If you have enabled the Auto-restart configuration after error option, the nSTATUS pin transitions from high to low and back again to high when a configuration error isdetected. This appears as a low pulse at the nSTATUS pin with a minimum pulse widthof 10μs to a maximum pulse width of 500μs, as defined in the t STATUS specification.In your system, you can have multiple devices that contain the same configurationdata. To support this configuration scheme, all device nCE inputs are tied to GND,while nCEO pins are left floating. All other configuration pins (nCONFIG, nSTATUS,DCLK, DATA0, and CONF_DONE) are connected to every device in the chain.Configuration signals can require buffering to ensure signal integrity and preventclock skew problems. Ensure that the DCLK and DATA lines are buffered for everyfourth device. Devices must be the same density and package. All devices will startand complete configuration at the same time. Figure11–15 shows multi-device PSconfiguration when both Stratix III devices are receiving the same configuration data. Figure11–15.Multiple-Device PS Configuration When Both Devices Receive the Same DataNotes to Figure11–15:(1)Connect the resistor to a supply that provides an acceptable input signal for all Stratix III devices on the chain. V CCPGM must be high enough tomeet the V IH specification of the I/O on the external host. It is recommended to power up all configuration systems’ I/O with V CCPGM.(2)The nCEO pins of both devices are left unconnected when configuring the same configuration data into multiple devices.You can use a single configuration chain to configure Stratix III devices with otherAltera devices. To ensure that all devices in the chain complete configuration at thesame time, or that an error flagged by one device initiates reconfiguration in alldevices, all of the device CONF_DONE and nSTATUS pins must be tied together.f For more information about configuring multiple Altera devices in the sameconfiguration chain, refer to the Configuring Mixed Altera FPGA Chains chapter in theConfiguration Handbook.JTAG ConfigurationJTAG ConfigurationFigure 11–19 shows JTAG configuration of a single Stratix III device.To configure a single device in a JTAG chain, the programming software places all other devices in bypass mode. In bypass mode, devices pass programming data from the TDI pin to the TDO pin through a single bypass register without being affected internally. This scheme enables the programming software to program or verify the target device. Configuration data driven into the device appears on the TDO pin one clock cycle later.The Quartus II software verifies successful JTAG configuration upon completion. At the end of configuration, the software checks the state of CONF _DONE through the JTAG port. When Quartus II generates a JAM file (.jam) for a multi-device chain, it contains instructions so that all the devices in the chain will be initialized at the same time. If CONF _DONE is not high, the Quartus II software indicates that configuration has failed. If CONF _DONE is high, the software indicates that configuration wassuccessful. After the configuration bitstream is transmitted serially through the JTAG TDI port, the TCK port is clocked an additional 1,094 cycles to perform device initialization.Figure 11–19.JTAG Configuration of a Single Device Using a Download CableNotes to Figure 11–19:(1)You should connect the pull-up resistor to the same supply voltage as the USB-Blaster, MasterBlaster (VIO pin), ByteBlaster II, ByteBlasterMV,or EthernetBlaster cables. The voltage supply can be connected to the V CCPD of the device.(2)You should connect the nCONFIG and MSEL[2..0] pins to support a non-JTAG configuration scheme. If you only use the JTAG configuration,connec t nCONFIG to V CCPGM , and MSEL[2..0] to ground. Pull DCLK either high or low, whichever is convenient on your board.(3)Pin 6 of the header is a V IO reference voltage for the MasterBlaster output driver. V IO should match the device's V CCPD . Refer to the MasterBlasterSerial/USB Communications Cable Data Sheet for this value. In the USB-Blaster, ByteBlaster II, ByteBlasterMV, and EthernetBlaster, this pin is a no connect.(4)You must connect nCE to GND or drive it low for successful JTAG configuration.(5)Pull-up resistor values can vary from 1 k Ω to 10 k Ω.VJTAG Configuration Stratix III devices have dedicated JTAG pins that always function as JTAG pins. Notonly can you perform JTAG testing on Stratix III devices before and after, but alsoduring configuration. While other device families do not support JTAG testing duringconfiguration, Stratix III devices support the bypass, id code, and sample instructionsduring configuration without interrupting configuration. All other JTAG instructionsmay only be issued by first interrupting configuration and reprogramming I/O pinsusing the CONFIG_IO instruction.The CONFIG_IO instruction allows I/O buffers to be configured by using the JTAGport and when issued, interrupts configuration. This instruction allows you toperform board-level testing prior to configuring the Stratix III device or waiting for aconfiguration device to complete configuration. When configuration has beeninterrupted and JTAG testing is complete, you must reconfigure the part by usingJTAG (PULSE_CONFIG instruction) or by pulsing nCONFIG low.The chip-wide reset (DEV_CLRn) and chip-wide output enable (DEV_OE) pins onStratix III devices do not affect JTAG boundary-scan or programming operations.Toggling these pins does not affect JTAG operations (other than the usualboundary-scan operation).When designing a board for JTAG configuration of Stratix III devices, consider thededicated configuration pins. Table11–12 lists how these pins should be connectedduring JTAG configuration.Table11–12.Dedicated Configuration Pin Connections During JTAG ConfigurationWhen programming a JTAG device chain, one JTAG-compatible header is connectedto several devices. The number of devices in the JTAG chain is limited only by thedrive capability of the download cable. When four or more devices are connected in aJTAG chain, Altera recommends buffering the TCK, TDI, and TMS pins with anon-board buffer.JTAG-chain device programming is ideal when the system contains multiple devices,or when testing your system using JTAG BST circuitry. Figure11–20 showsmulti-device JTAG configuration.Device Configuration PinsTable11–14.Dedicated Configuration Pins on the Stratix III Device (Part 4 of 5)Device Configuration Pins。
FPGA可编程逻辑器件芯片EP3CLS150F484I7中文规格书
Configuration & Testing 1An encryption configuration file is the same size as a non-encryption configuration file. When using a serial configurationscheme such as passive serial (PS) or active serial (AS),configuration time is the same whether or not the designsecurity feature is enabled. If the fast passive parallel (FPP)scheme us used with the design security or decompressionfeature, a 4× DCLK is required. This results in a slowerconfiguration time when compared to the configuration time ofan FPGA that has neither the design security, nordecompression feature enabled. For more information aboutthis feature, refer to AN 341: Using the Design Security Feature inStratix II Devices. Contact your local Altera sales representativeto request this document.Device Configuration Data DecompressionStratix II FPGAs support decompression of configuration data, which saves configuration memory space and time. This feature allows you to store compressed configuration data in configuration devices or other memory, and transmit this compressed bit stream to Stratix II FPGAs. During configuration, the Stratix II FPGA decompresses the bit stream in real time and programs its SRAM cells.Stratix II FPGAs support decompression in the FPP (when using a MAX II device/microprocessor and flash memory), AS and PS configuration schemes. Decompression is not supported in the PPA configuration scheme nor in JTAG-based configuration.Remote System UpgradesShortened design cycles, evolving standards, and system deployments in remote locations are difficult challenges faced by modern system designers. Stratix II devices can help effectively deal with these challenges with their inherent re-programmability and dedicated circuitry to perform remote system updates. Remote system updates help deliver feature enhancements and bug fixes without costly recalls, reduce time to market, and extend product life.Stratix II FPGAs feature dedicated remote system upgrade circuitry to facilitate remote system updates. Soft logic (Nios® processor or user logic) implemented in the Stratix II device can download a new configuration image from a remote location, store it in configuration memory, and direct the dedicated remote system upgrade circuitry to initiate a reconfiguration cycle. The dedicated circuitry performs error detection during and after the configuration process, recovers from any error condition by reverting back to a safe configuration image, and providesConfigurationerror status information. This dedicated remote system upgrade circuitryavoids system downtime and is the critical component for successfulremote system upgrades.RSC is supported in the following Stratix II configuration schemes: FPP,AS, PS, and PPA. RSC can also be implemented in conjunction withadvanced Stratix II features such as real-time decompression ofconfiguration data and design security using AES for secure and efficientfield upgrades.f See the Remote System Upgrades With Stratix II & Stratix II GX Deviceschapter in volume 2 of the Stratix II Device Handbook or the Stratix II GXDevice Handbook for more information about remote configuration inStratix II devices.Configuring Stratix II FPGAs with JRunnerJRunner is a software driver that configures Altera FPGAs, includingStratix II FPGAs, through the ByteBlaster II or ByteBlasterMV cables inJTAG mode. The programming input file supported is in Raw Binary File(.rbf) format. JRunner also requires a Chain Description File (.cdf)generated by the Quartus II software. JRunner is targeted for embeddedJTAG configuration. The source code is developed for the Windows NToperating system (OS), but can be customized to run on other platforms.f For more information on the JRunner software driver, see the JRunnerSoftware Driver: An Embedded Solution to the JTAG Configuration WhitePaper and the source files on the Altera web site .Programming Serial Configuration Devices with SRunnerA serial configuration device can be programmed in-system by anexternal microprocessor using SRunner. SRunner is a software driverdeveloped for embedded serial configuration device programming thatcan be easily customized to fit in different embedded systems. SRunner isable to read a .rpd file (Raw Programming Data) and write to the serialconfiguration devices. The serial configuration device programming timeusing SRunner is comparable to the programming time when using theQuartus II software.f For more information about SRunner, see the SRunner: An EmbeddedSolution for EPCS Programming White Paper and the source code on theAltera web site at .f For more information on programming serial configuration devices, seethe Serial Configuration Devices (EPCS1 & EPCS4) Data Sheet in theConfiguration Handbook.Document Revision HistoryStratix II Hot-Socketing SpecificationsDevices Can Be Driven Before Power-UpYou can drive signals into the I/O pins, dedicated input pins anddedicated clock pins of Stratix II devices before or during power-up orpower-down without damaging the device. Stratix II devices support anypower-up or power-down sequence (V CCIO, V CCINT, and V CCPD) in orderto simplify system level design.I/O Pins Remain Tri-Stated During Power-UpA device that does not support hot-socketing may interrupt systemoperation or cause contention by driving out before or during power-up.In a hot socketing situation, Stratix II device's output buffers are turnedoff during system power-up or power-down. Stratix II device also doesnot drive out until the device is configured and has attained properoperating conditions.Signal Pins Do Not Drive the V CCIO, V CCINT or V CCPD PowerSuppliesDevices that do not support hot-socketing can short power suppliestogether when powered-up through the device signal pins. This irregularpower-up can damage both the driving and driven devices and candisrupt card power-up.Stratix II devices do not have a current path from I/O pins, dedicatedinput pins, or dedicated clock pins to the V CCIO, V CCINT, or V CCPD pinsbefore or during power-up. A Stratix II device may be inserted into (orremoved from) a powered-up system board without damaging orinterfering with system-board operation. When hot-socketing, Stratix IIdevices may have a minimal effect on the signal integrity of thebackplane.1You can power up or power down the V CCIO, V CCINT, and V CCPDpins in any sequence. The power supply ramp rates can rangefrom 100 μs to 100 ms. All V CC supplies must power downwithin 100 ms of each other to prevent I/O pins from drivingout. During hot socketing, the I/O pin capacitance is less than 15pF and the clock pin capacitance is less than 20 pF. Stratix IIdevices meet the following hot socketing specification.■The hot socketing DC specification is: | I IOPIN | < 300 μA.■The hot socketing AC specification is: |I IOPIN|< 8mA for 10ns orless.Clock ManagementStratix II Device Handbook, Volume 2Section I–2。
FPGA可编程逻辑器件芯片EP2S90F1508C3N中文规格书
Fast PLLsExternal Clock OutputsEach fast PLL supports differential or single-ended outputs forsource-synchronous transmitters or for general-purpose external clocks.There are no dedicated external clock output pins. The fast PLL global orregional outputs can drive any I/O pin as an external clock output pin.The I/O standards supported by any particular bank determines whatstandards are possible for an external clock output driven by the fast PLLin that bank.f For more information, see the Selectable I/O Standards in Stratix II andStratix II GX Devices chapter in volume 2 of the Stratix II GX DeviceHandbook (or the Stratix II Device Handbook).Fast PLL Software OverviewStratix II and Stratix II GX fast PLLs are enabled in the Quartus IIsoftware by using the altpll megafunction. Figure1–8 shows theavailable ports (as they are named in the Quartus II altpllmegafunction)of the Stratix II or Stratix II GX fast PLL.Figure1–8.Stratix II and Stratix II GX Fast PLL Ports and Physical DestinationsNotes to Figure1–8:(1)This input pin is either single-ended or differential.(2)This input pin is shared by all enhanced and fast PLLs.Tables1–8 and 1–9 show the description of all fast PLL ports.Table1–8.Fast PLL Input Signals(Part 1 of2)Name Description Source Destinationinclk0 Primary clock input to the fast PLL.Pin or another PLL n counterinclk1Secondary clock input to the fast PLL.Pin or another PLL n counterHardware FeaturesClock Multiplication and DivisionEach Stratix II PLL provides clock synthesis for PLL output ports usingm /(n × post-scale counter) scaling factors. The input clock is divided by apre-scale factor, n , and is then multiplied by the m feedback factor. Thecontrol loop drives the VCO to match f IN (m /n ). Each output port has aunique post-scale counter that divides down the high-frequency VCO.For multiple PLL outputs with different frequencies, the VCO is set to theleast common multiple of the output frequencies that meets its frequencyspecifications. For example, if output frequencies required from one PLLare 33 and 66 MHz, then the Quartus II software sets the VCO to 660 MHz(the least common multiple of 33 and 66 MHz within the VCO range).Then, the post-scale counters scale down the VCO frequency for eachoutput port.There is one pre-scale counter, n , and one multiply counter, m , per PLL,with a range of 1 to 512 for both m and n in enhanced PLLs. For fast PLLs,m ranges from 1 to 32 while n ranges from 1 to 4. There are six genericpost-scale counters in enhanced PLLs that can feed regional clocks, globalclocks, or external clock outputs, all ranging from 1 to 512 with a 50%duty cycle setting for each PLL. The post-scale counters range from 1 to256 with any non-50% duty cycle setting. In fast PLLs, there are fourpost-scale counters (C0, C1, C2, C3) for the regional and global clockoutput ports. All post-scale counters range from 1 to 32 with a 50% dutycycle setting. For non-50% duty cycle clock outputs, the post-scalecounters range from 1 to 16. If the design uses a high-speed I/O interface,you can connect the dedicated dffioclk clock output port to allow thehigh-speed VCO frequency to drive the serializer/deserializer (SERDES).Phase shiftDown to 125-ps increments (3)Down to 125-ps increments (3)Programmable duty cycleY es Y esNotes to Table 1–13:(1)Post-scale counters range from 1 through 512 if the output clock uses a 50% duty cycle. For any output clocks using a non-50% duty cycle, the post-scale counters range from 1 through 256.(2)Post-scale counters range from 1 through 32 if the output clock uses a 50% duty cycle. For any output clocks using a non-50% duty cycle, the post-scale counters range from 1 through 16. (3)The smallest phase shift is determined by the VCO period divided by 8. For degree increments, the Stratix II devicecan shift all output frequencies in increments of at least 45 . Smaller degree increments are possible depending on the frequency and divide parameters.Table 1–13.Stratix II and Stratix II GX PLL Hardware Features (Part 2 of 2)Hardware FeaturesAvailability Enhanced PLL Fast PLLBoard LayoutSince spread spectrum affects the m counter values, all spread-spectrumPLL outputs are effected. Therefore, if only one spread-spectrum signal isneeded, the clock signal should use a separate PLL without other outputsfrom that PLL.No special considerations are needed when using spread spectrum withthe clock switchover feature. This is because the clock switchover featuredoes not affect the m and n counter values, which are the counter valuesswitching when using spread spectrum.Board Layout The enhanced and fast PLL circuits in Stratix II and Stratix II GX devicescontain analog components embedded in a digital device. These analogcomponents have separate power and ground pins to minimize noisegenerated by the digital components. Stratix II and Stratix II GXenhanced and fast PLLs use separate V CC and ground pins to isolatecircuitry and improve noise resistance.V CCA and GNDAEach enhanced and fast PLL uses separate V CC and ground pin pairs fortheir analog circuitry. The analog circuit power and ground pin for eachPLL is called VCCA_PLL<PLL number> and GNDA_PLL<PLL number>.Connect the V CCA power pin to a 1.2-V power supply, even if you do notuse the PLL. Isolate the power connected to V CCA from the power to therest of the Stratix II or Stratix II GX device or any other digital device onthe board. You can use one of three different methods of isolating theV CCA pin: separate V CCA power planes, a partitioned V CCA island withinthe V CCINT plane, and thick V CCA traces.Separate V CCA Power PlaneA mixed signal system is already partitioned into analog and digitalsections, each with its own power planes on the board. To isolate the V CCApin using a separate V CCA power plane, connect the V CCA pin to theanalog 1.2-V power plane.Partitioned V CCA Island Within V CCINT PlaneFully digital systems do not have a separate analog power plane on theboard. Since it is expensive to add new planes to the board, you can createislands for VCCA_PLL. Figure1–35 shows an example board layout withan analog power island. The dielectric boundary that creates the islandshould be 25 mils thick. Figure1–36 shows a partitioned plane withinV CCINT for V CCA.。
FPGA可编程逻辑器件芯片EP2S15F484I5中文规格书
PLLs & Clock NetworksPLLs & Clock Networks Stratix II devices provide a hierarchical clock structure and multiple PLLs with advanced features. The large number of clocking resources in combination with the clock synthesis precision provided by enhanced and fast PLLs provides a complete clock management solution. Global & Hierarchical ClockingStratix II devices provide 16 dedicated global clock networks and32regional clock networks (eight per device quadrant). These clocks are organized into a hierarchical clock structure that allows for up to24clocks per device region with low skew and delay. This hierarchical clocking scheme provides up to 48 unique clock domains in Stratix II devices.There are 16 dedicated clock pins (CLK[15..0]) to drive either the global or regional clock networks. Four clock pins drive each side of the device, as shown in Figures2–31 and 2–32. Internal logic and enhanced and fast PLL outputs can also drive the global and regional clock networks. Each global and regional clock has a clock control block, which controls the selection of the clock source and dynamically enables/disables the clock to reduce power consumption. Table2–8 shows global and regional clock features.Global Clock NetworkThese clocks drive throughout the entire device, feeding all device quadrants. The global clock networks can be used as clock sources for all resources in the device-IOEs, ALMs, DSP blocks, and all memory blocks. These resources can also be used for control signals, such as clock enables and synchronous or asynchronous clears fed from the external pin. The Table2–8.Global & Regional Clock FeaturesFeature Global Clocks Regional Clocks Number per device1632Number available perquadrant168Sources CLK pins, PLL outputs,or internal logicCLK pins, PLL outputs,or internal logic Dynamic clock sourceselectionv (1)Dynamic enable/disable v vNote to Table2–8:(1)Dynamic source clock selection is supported for selecting between CLKp pins andPLL outputs only.global clock networks can also be driven by internal logic for internally generated global clocks and asynchronous clears, clock enables, or other control signals with large fanout. Figure2–31 shows the 16 dedicated CLK pins driving global clock networks.Figure2–31.Global ClockingRegional Clock NetworkThere are eight regional clock networks RCLK[7..0] in each quadrant of the Stratix II device that are driven by the dedicated CLK[15..0] input pins, by PLL outputs, or by internal logic. The regional clock networks provide the lowest clock delay and skew for logic contained in a single quadrant. The CLK clock pins symmetrically drive the RCLK networks in a particular quadrant, as shown in Figure2–32.I/O StructureStratix II Architecture Figure2–56.DQS Phase-Shift Circuitry Notes(1), (2), (3), (4)Notes to Figure2–56:(1)There are up to 18 pairs of DQS and DQSn pins available on the top or the bottom of the Stratix II device. There areup to 10 pairs on the right side and 8 pairs on the left side of the DQS phase-shift circuitry.(2)The Δt module represents the DQS logic block.(3)Clock pins CLK[15..12]p feed the phase-shift circuitry on the top of the device and clock pins CLK[7..4]p feedthe phase circuitry on the bottom of the device. You can also use a PLL clock output as a reference clock to the phase-shift circuitry.(4)You can only use PLL 5 to feed the DQS phase-shift circuitry on the top of the device and PLL 6 to feed the DQSphase-shift circuitry on the bottom of the device.These dedicated circuits combined with enhanced PLL clocking andphase-shift ability provide a complete hardware solution for interfacingto high-speed memory.f For more information on external memory interfaces, refer to theExternal Memory Interfaces in Stratix II & Stratix II GX Devices chapter involume 2 of the Stratix II Device Handbook or the Stratix II GX DeviceHandbook.Programmable Drive StrengthThe output buffer for each Stratix II device I/O pin has a programmabledrive strength control for certain I/O standards. The LVTTL, LVCMOS,SSTL, and HSTL standards have several levels of drive strength that theuser can control. The default setting used in the Quartus II software is themaximum current strength setting that is used to achieve maximum I/Operformance. For all I/O standards, the minimum setting is the lowestdrive strength that guarantees the I OH/I OL of the standard. Usingminimum settings provides signal slew rate control to reduce systemnoise and signal overshoot.。
FPGA可编程逻辑器件芯片EP2S130F1508C3NN中文规格书
Chapter 6:Clock Networks and PLLs in Stratix III Devices PLLs in Stratix III DevicesStratix III Device Handbook, Volume 1Bypassing PLLBypassing a PLL counter results in a multiply (m counter) or a divide (n and C0 to C9 counters) factor of one.Table 6–20 lists the settings for bypassing the counters in Stratix III PLLs.1To bypass any of the PLL counters, set the bypass bit to 1. The values on the other bits are ignored. To bypass the VCO post-scale counter (K ), set the corresponding bit to 1.Dynamic Phase-ShiftingThe dynamic phase-shifting feature allows the output phases of individual PLL outputs to be dynamically adjusted relative to each other and to the reference clock without the need to send serial data through the scan chain of the corresponding PLL. This feature simplifies the interface and allows you to quickly adjust clock-to-out (t CO ) delays by changing the output clock phase-shift in real time. This adjustment isachieved by incrementing or decrementing the VCO phase-tap selection to a given C counter or to the M counter. The phase is shifted by 1/8 of the VCO frequency at a time. The output clocks are active during this phase-reconfiguration process.Table 6–21 lists the control signals that are used for dynamic phase-shifting.Table 6–20.PLL Counter SettingsNotes to Table 6–20:(1)Most significant bit (MSB).(2)Least significant bit (LSB).(3)Counter-bypass bit.Table 6–21.Dynamic Phase-Shifting Control Signals (Part 1 of 2)Chapter 6:Clock Networks and PLLs in Stratix III DevicesPLLs in Stratix III DevicesStratix III Device Handbook, Volume 1Table 6–22 lists the PLL counter selection based on the corresponding PHASECOUNTERSELECT setting.The procedure to perform one dynamic phase-shift step is as follows:1.Set phaseupdown and phasecounterselect as required.2.Assert phasestep for at least two scanclk cycles. Each phasestep pulseenables one phase shift.3.De-assert phasestep.4.Wait for phasedone to go high.5.Repeat steps 1 through 4 as many times as required to perform multiple phase-shifts.All signals are synchronous to scanclk. They are latched on scanclk edges and must meet t su /t h requirements with respect to scanclk edges.Table 6–21.Dynamic Phase-Shifting Control Signals (Part 2 of 2)Table 6–22.Phase Counter Select MappingSection II.I/O InterfacesStratix III Device Handbook, Volume 1II–2Section II: I/O InterfacesRevision HistoryStratix III Device Handbook, Volume 1Chapter 7:Stratix III Device I/O FeaturesTermination Schemes for I/O StandardsFigure7–22.Differential SSTL I/O Standard Termination for Stratix III DevicesFigure7–23.Differential HSTL I/O Standard Termination for Stratix III DevicesStratix III Device Handbook, Volume 1。
FPGA可编程逻辑器件芯片EP2AGX125EF29C4中文规格书
UART Architectural Concepts Often, the processor uses autobaud detection for initial bit rate negotiations where it is most likely a slave device waiting for the host to send a predefined autobaud character. This situation is common for UART booting. Do not enable the UART_CTL.EN bit while autobaud detection is in-process, to prevent the UART from starting a receive operation with incorrect bit rate matching. Alternatively, set the UART_CTL.LOOP_EN bit to disconnect the UART from its UART_RX pin.A software routine can detect the pulse widths of serial stream bit cells. The sample base of the timer is synchronous with the UART operation (all derived from the same SCLK0). The UART uses pulse widths to calculate the bit rate divider as follows:Divisor = TIMER_TMR[n]_WID/16(1–EDBO) × Number of captured UART bitsTo increase the number of timer counts and the resolution of the captured signal, do not measure just the pulse width of a single bit. Instead, enlarge the pulse of interest over more bits. T raditionally, a NULL character (ASCII0x00) is used in autobaud detection, as shown in the Autobaud Detection figure.Figure 25-3: Autobaud DetectionBecause the example frame encloses 8 data bits and 1 start bit, apply the following formula.Divisor = TIMER_TMR[n]_WID/16(1–EDBO) × 9NOTE:For processor-specific mapping of timer alternate capture inputs to the UARTs of the processor, see "Width Capture (WIDCAP) Mode" in the "General-Purpose Timer (TIMER)" chapter.Real receive signals often have asymmetrical falling and rising edges, and the sampling logic level is not exactly in the middle of the signal voltage range. At higher bit rates, such pulse-width-based autobaud detection do not always return adequate results without extra conditioning of the analog signal. Measure signal periods to work around this issue.For example, predefine ASCII character “@” (0x40) as the autobaud detection character and measure the period between two subsequent falling edges. As shown in the Autobaud Detection Character 0x40 figure, measure the pe-riod between the falling edge of the start bit and the falling edge after bit 6. Since this period encloses 8 bits, apply the following formula.Divisor = TIMER_TMR[n]_PER/16(1–EDBO) × 8or:•Divisor = TIMER_TMR[n]_PER>> 7, if UART_CLK.EDBO=0•Divisor = TIMER_TMR[n]_PER>> 3, if UART_CLK.EDBO=1The Autobaud Detection Character 0x40 figure shows the ASCII “@” (0x40) detection character.ADSP-BF70x Blackfin+ Processor Hardware ReferenceADSP-BF70x CNT Register DescriptionsADSP-BF70x Blackfin+ Processor Hardware ReferenceUART Functional Description options. A set of registers governs UART operations. For more information on UART functionality, see the UART register descriptions.ADSP-BF70x UART Interrupt ListADSP-BF70x UART DMA Channel ListADSP-BF70x Blackfin+ Processor Hardware Reference。
FPGA可编程逻辑器件芯片EP2S130F1508C3中文规格书
4.Hot Socketing &Power-On Reset Stratix® II devices offer hot socketing, which is also known as hot plug-in or hot swap, and power sequencing support without the use of any external devices. You can insert or remove a Stratix II board in a system during system operation without causing undesirable effects to the running system bus or the board that was inserted into the system.The hot socketing feature also removes some of the difficulty when you use Stratix II devices on printed circuit boards (PCBs) that also contain a mixture of 5.0-, 3.3-, 2.5-, 1.8-, 1.5- and 1.2-V devices. With the Stratix II hot socketing feature, you no longer need to ensure a proper power-up sequence for each device on the board.The Stratix II hot socketing feature provides:■Board or device insertion and removal without external components or board manipulation■Support for any power-up sequence■Non-intrusive I/O buffers to system buses during hot insertion This chapter also discusses the power-on reset (POR) circuitry in Stratix II devices. The POR circuitry keeps the devices in the reset state until the V CC is within operating range.Stratix IIHot-Socketing Specifications Stratix II devices offer hot socketing capability with all three features listed above without any external components or special design requirements. The hot socketing feature in Stratix II devices allows:■The device can be driven before power-up without any damage to the device itself.■I/O pins remain tri-stated during power-up. The device does not drive out before or during power-up, thereby affecting other buses in operation.■Signal pins do not drive the V CCIO, V CCPD, or V CCINT power supplies.External input signals to I/O pins of the device do not internallypower the V CCIO or V CCINT power supplies of the device via internal paths within the device.Operating ConditionsTable5–10.2.5-V LVDS I/O SpecificationsSymbol Parameter Conditions Minimum Typical Maximum Unit2.375 2.500 2.625V V CCIO I/O supply voltage for left andright I/O banks (1, 2, 5, and6)V ID Input differential voltage100350900mV swing (single-ended)V ICM Input common mode voltage2001,2501,800mVR L = 100 Ω250450mV V OD Output differential voltage(single-ended)R L = 100 Ω 1.125 1.375V V OCM Output common modevoltageR L Receiver differential input90100110Ωdiscrete resistor (external toStratix II devices)Table5–11.3.3-V LVDS I/O SpecificationsSymbol Parameter Conditions Minimum Typical Maximum Unit V CCIO (1)I/O supply voltage for top3.135 3.300 3.465Vand bottom PLL banks (9,10, 11, and 12)100350900mV V ID Input differential voltageswing (single-ended)V ICM Input common mode voltage2001,2501,800mV V OD Output differential voltageR L = 100 Ω250710mV (single-ended)R L = 100 Ω8401,570mV V OCM Output common modevoltage90100110ΩR L Receiver differential inputdiscrete resistor (external toStratix II devices)Note to Table5–11:(1)The top and bottom clock input differential buffers in I/O banks 3, 4, 7, and 8 are powered by V CCINT, not V CCIO.The PLL clock output/feedback differential buffers are powered by VCC_PLL_OUT. For differential clockoutput/feedback operation, VCC_PLL_OUT should be connected to 3.3 V.Preliminary status means the timing model is subject to change. Initially, timing numbers are created using simulation results, process data, and other known parameters. These tests are used to make the preliminary numbers as close to the actual timing parameters as possible.Final timing numbers are based on actual device operation and testing. These numbers reflect the actual performance of the device under worst-case voltage and junction temperature conditions.Table5–33.Stratix II Device Timing Model StatusDevice Preliminary FinalEP2S15vEP2S30vEP2S60vEP2S90vEP2S130vEP2S180vI/O Timing Measurement MethodologyAltera characterizes timing delays at the worst-case process, minimum voltage, and maximum temperature for input register setup time (t SU) and hold time (t H). The Quartus II software uses the following equations to calculate t SU and t H timing for Stratix II devices input signals.t SU = + data delay from input pin to input register+micro setup time of the input register–clock delay from input pin to input registert H = – data delay from input pin to input register+micro hold time of the input register+clock delay from input pin to input registerFigure5–3 shows the setup and hold timing diagram for input registers.Document Revision History。
FPGA可编程逻辑器件芯片EP2S180F1508C3中文规格书
shown in the Stratix II Architecture chapter in volume 1 of the Stratix II Device Handbook.
JESD8-B. (2) This specification is supported across all the programmable drive strength settings available for this I/O standard
as shown in the Stratix II Architecture chapter in volume 1 of the Stratix II Device Handbook.
Output supply voltage High-level input voltage Low-level input voltage High-level output voltage Low-level output voltage
IOH = –2 mA (2) IOL = 2 mA (2)
EIA/JEDEC standard. (2) This specification is supported across all the programmable drive settings available for this I/O standard as shown
in the Stratix II Architecture chapter in volume 1 of the Stratix II Device Handbook.
FPGA可编程逻辑器件芯片EP4S100G2F40I1N中文规格书
PLLs & Clock NetworksThe Quartus II software enables the PLLs and their features withoutrequiring any external devices. Table2–9 shows the PLLs available foreach Stratix II device and their type.Table2–9.Stratix II Device PLL AvailabilityDeviceFast PLLs Enhanced PLLs 123478910561112EP2S15v v v v v vEP2S30v v v v v vEP2S60(1)v v v v v v v v v v v v EP2S90(2)v v v v v v v v v v v v EP2S130(3)v v v v v v v v v v v v EP2S180v v v v v v v v v v v v Notes to Table2–9:(1)EP2S60 devices in the 1020-pin package contain 12 PLLs. EP2S60 devices in the 484-pin and 672-pin packagescontain fast PLLs 1–4 and enhanced PLLs 5 and 6.(2)EP2S90 devices in the 1020-pin and 1508-pin packages contain 12 PLLs. EP2S90 devices in the 484-pin and 780-pinpackages contain fast PLLS 1–4 and enhanced PLLs 5 and 6.(3)EP2S130 devices in the 1020-pin and 1508-pin packages contain 12PLLs. The EP2S130 device in the 780-pin packagecontains fast PLLs 1–4 and enhanced PLLs 5 and 6.I/O StructureThere are 32 control and data signals that feed each row or column I/Oblock. These control and data signals are driven from the logic array. Therow or column IOE clocks, io_clk[7..0], provide a dedicated routingresource for low-skew, high-speed clocks. I/O clocks are generated fromglobal or regional clocks (see the “PLLs & Clock Networks” section).Figure2–49 illustrates the signal paths through the I/O block.Figure2–49.Signal Path through the I/O BlockEach IOE contains its own control signal selection for the followingcontrol signals: oe, ce_in, ce_out, aclr/apreset, sclr/spreset,clk_in, and clk_out. Figure2–50 illustrates the control signalselection.I/O StructureTable2–17 shows the Stratix II on-chip termination support per I/O bank.Table2–17.On-Chip Termination Support by I/O Banks(Part 1 of2)On-Chip Termination Support I/O Standard Support Top & Bottom Banks Left & Right BanksSeries termination without calibration 3.3-V LVTTL v v 3.3-V LVCMOS v v 2.5-V LVTTL v v 2.5-V LVCMOS v v 1.8-V LVTTL v v 1.8-V LVCMOS v v 1.5-V LVTTL v v 1.5-V LVCMOS v v SSTL-2 Class I and II v v SSTL-18 Class I v v SSTL-18 Class II v1.8-V HSTL Class I v v 1.8-V HSTL Class II v1.5-V HSTL Class I v v 1.2-V HSTL v。
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Memory Clock PinsIn addition to DQS (and CQn) signals to capture data, DDR3, DDR2, DDR SDRAM, and RLDRAM II use an extra pair of clocks, called CK and CK# signals, to capture the address and control/command signals. The CK/CK# signals must be generated to mimic the write data-strobe using Stratix III DDR I/O registers (DDIOs) to ensure that timing relationships between the CK/CK# and DQS signals (t DQSS in DDR3, DDR2, and DDR SDRAM or t CKDK in RLDRAM II) are met. QDR II+ and QDR II SRAM devices use the same clock (K/K#) to capture data, address, and control/command signals. Memory clock pins in Stratix III devices are generated with a DDIO register going to differential output pins, marked in the pin table with DIFFOUT , DIFFIO_TX , and DIFFIO_RX prefixes.fFor more information about which pins to use for memory clock pins, refer to the Section I. Device and Pin Planning chapter in volume 2 of the External Memory Interface Handbook .Figure 8–9 shows the memory clock generation block diagram for Stratix III devices.Stratix III External Memory Interface FeaturesStratix III devices are rich with features that allow robust high-performance external memory interfacing. The ALTMEMPHY megafunction allows you to set theseexternal memory interface features and helps set up the physical interface (PHY) best suited for your system. This section describes each Stratix III device feature that is used in external memory interfaces from the DQS phase-shift circuitry, DQS logic block, leveling multiplexers, dynamic OCT control block, IOE registers, IOE features, and PLLs.Figure 8–9.Memory Clock Generation Block Diagram (Note 1)Notes to Figure 8–9:(1)For more information about pin location requirements for these pins, refer Section I. Device and Pin Planning chapter in volume 2 of the ExternalMemory Interface Handbook .(2)The mem_clk[0] and mem_clk_n[0] pins for DDR3, DDR2, and DDR SDRAM interfaces use the I/O input buffer for feedback; therefore,bi-directional I/O buffers are used for these pins. For memory interfaces using a differential DQS input, the input feedback buffer is configured as differential input; for memory interfaces using a single-ended DQS input, the input buffer is configured as a single-ended input. Using a single-ended input feedback buffer requires that I/O standard’s V REF voltage is provided to that I/O bank’s VREF pins .(2)(2)Figure8–12.Simplified Diagram of the DQS Phase Shift Circuitry(Note1)Notes to Figure8–12:(1)All features of the DQS phase-shift circuitry are accessible from the ALTMEMPHY megafunction in the Quartus II software.(2)The input reference clock for the DQS phase-shift circuitry can come from a PLL output clock or an input clock pin. For the exact PLL and inputclock pin location, refer to T able8–6 through Table8–9.(3)Phase offset settings can only go to the DQS logic blocks.(4)DQS delay settings can go to the logic array, the DQS logic block, and the leveling circuitry.1The phase offset control block ‘A’ is designated asDLLOFFSETCTRL_<coordinate x>_<coordinate y>_N1 and phase offsetcontrol block ‘B’ is designated asDLLOFFSETCTRL_<coordinate x>_<coordinate y>_N2 in the Quartus IIassignment.You can reset the DLL from either the logic array or a user I/O pin. Each time the DLLis reset, you must wait for 1280 clock cycles before you can capture the data properly.Depending on the DLL frequency mode, the DLL can shift the incoming DQS signalsby 0°, 22.5°, 30°, 36°, 45°, 60°, 67.5°, 72°, 90°, 108°, 120°, 135°, 144°, or 180°. The shiftedDQS signal is then used as the clock for the DQ IOE input registers.All DQS and CQn pins referenced to the same DLL can have their input signal phaseshifted by a different degree amount but all must be referenced at one particularfrequency. For example, you can have a 90° phase shift on DQS1T and a 60° phase shifton DQS2T referenced from a 200-MHz clock. Not all phase-shift combinations aresupported, however. The phase shifts on the DQS pins referenced by the same DLLmust all be a multiple of 22.5° (up to 90°), a multiple of 30° (up to 120°), a multipleof36° (up to 144°), or a multiple of 45° (up to 180°).There are seven different frequency modes for the Stratix III DLL, as listed inTable8–10. Each frequency mode provides different phase shift selections. Infrequency modes 0, 1, 2, and 3, the 6-bit DQS delay settings vary with PVT toimplement the phase-shift delay. In frequency modes 4, 5, 6, and 7, only 5 bits of theDQS delay settings vary with PVT to implement a phase-shift delay; the mostsignificant bit of the DQS delay setting is set to 0.Chapter 8:External Memory Interfaces in Stratix III DevicesStratix III External Memory Interface FeaturesDQS Logic BlockEach DQS and CQn pin is connected to a separate DQS logic block, which consists ofthe DQS delay chains, update enable circuitry, and DQS postamble circuitry, as shownin Figure8–13.Figure8–13.Stratix III DQS Logic BlockNotes to Figure8–13:(1)The input reference clock for the DQS phase-shift circuitry can come from a PLL output clock or an input clock pin. For the exact PLL and inputclock pin location, refer to T able8–6 through Table8–9.(2)The dqsenable signal can also come from the Stratix III FPGA fabric.DQS Delay ChainThe DQS delay chains consist of a set of variable delay elements to allow the inputDQS/CQ and CQn signals to be shifted by the amount specified by the DQSphase-shift circuitry or the logic array. There are four delay elements in the DQS delaychain; the first delay chain closest to the DQS/CQ pin can either be shifted by theDQS delay settings or by the sum of the DQS delay setting and the phase-offsetsetting. The number of delay chains required is transparent because theALTMEMPHY megafunction automatically sets it when you choose the operatingfrequency. The DQS delay settings can come from the DQS phase-shift circuitry oneither end of the I/O banks or from the logic array.Delay elements in the DQS logic block have the same characteristics as the delayelements in the DLL. When the DLL is not used to control the DQS delay chains, youcan input your own Gray-coded 6-bit or 5-bit settings using thedqs_delayctrlin[5..0]signals available in the ALTMEMPHY megafunction.These settings control 1, 2, 3, or all 4 delay elements in the DQS delay chains. TheALTMEMPHY megafunction can also dynamically choose the number of DQS delaychains required for the system. The amount of delay is equal to the sum of the delayelement’s intrinsic delay and the product of the number of delay steps and the valueof the delay steps.Chapter 8:External Memory Interfaces in Stratix III DevicesStratix III External Memory Interface FeaturesChapter 8:External Memory Interfaces in Stratix III Devices Stratix III External Memory Interface Features。