YAGEO电容规格书

Y5V ∆C/C ≤ 20% -10% ≤ ∆C/C ≤ 20%
∆C/C: ≤ 20%
-40% ≤ ∆C/C ≤ 30% Tanδ: ≤ 7%, 12.5%, 15% IR: 1000MΩ or RxC ≥ 25s Whichever is less
-40% ≤ ∆C/C ≤ 30% Tan δ: ≤ 7%, 12.5%, 15% IR: 2000MΩ or RxC ≥ 50s Whichever is less
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YAGEO CORPORATION
Aging Rate
Aging Curve ∆C/C (%) 10
0
-10
NPO X7R Y5V
-20
-30 1 10 100 1000 Hours
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YAGEO CORPORATION
Reflow Profile
Temp
℃
245 225 235±10
183 150
Rins > 10GΩ or RinsxC≥500s, whichever is less. No breakdown
Rins > 10GΩ or RinsxC≥500s, Whichever is less.
Rins > 10GΩ or RinsxC≥100s, whichever is less.
Code 7 Capacitance tolerance A = ±0.05pF G = ±2% B = ±0.1pF J = ±5% C = ±0.25pF K = ±10% D = ±0.5pF M = ±20% F = ±1% Z= -20%+80% Code 8 Packing style R = Paper tape reel ϕ 7 inch P = Paper tape reel ϕ 13 inch K = Embossed plastic tape reel ϕ 7 inch. F = Embossed plastic tape reel ϕ 13 inch. B = Bulk Bag C = Bulk Cassette Code 9~11 Material
Dissipation factor (Tan δ)
Tanδ≤ 9% or ≤12.5%, Tan δ ≤ 9%, 16V 16V depending on capacitance value Tan δ ≤ 12.5%, 10V
Insulation resistance(IR)
At Ur(rated voltage) for 1 minute Ur>500V,at 500V(DC) for 1minute
Dielectric withstanding Voltage
At 2.5Ur (for Ur ≤ 100V) 1.5Ur + 100V (for Ur > 100V) 1.5Ur,Ur=1000V 1.2Ur,Ur>1000V for 5Second
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YAGEO CORPORATION
4. DIMENSION (mm)
T MAX. 0.55 0.90 1.35 1.35 1.80 1.80 1.80
L1；L2 MIN. MAX. 0.15 0.30 0.20 0.60 0.25 0.75 0.25 0.75 0.25 0.75 0.25 0.75 0.25 0.75
L3 Min. 0.40 0.40 0.55 1.40 1.40 2.20 2.20
PCB Layout for Reliability test:
Solder resist
YAGEO CORPORATION
1. SUBJECT: This specification applies on the chip capacitor made by Yageo Corporation. 2. PART NUMBER: Part number of the chip capacitor is identified by the size, tolerance, packing, material and capacitor value. Example:
(1005) (1608) (2012) (3216) (3225) (4520) (4532) (5750)
Code 15~17 Capacitance Value (2 significant digits + No. of Zeros) The 3rd digit: 3 = × 103 0=×1 1 = × 10 4 = × 104 2 5 = × 105 2 = × 10 6 = × 106 Letter R is decimal point Code 14 Series N = Non BME B = BME
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YAGEO CORPORATION
5. TESTS AND REQUIREMENTS
IEC 384-10 4.9 4.10 4.11 4.12
4.14
4.15
Requirements NPO X7R ∆C/C ≤ 10% Bending Bending rate 1mm/s, jig. Radius ∆C/C ≤ 1% 340mm Resistance to 260±5°C for 10±0.5s in static ∆C/C ≤ 0.5% or 0.5pF, -5% ≤ ∆C/C ≤ 10% soldering heat solder bath whichever is greater 235±5°C for 2±0.5 s in a static 75% minimum coverage of metallic area Solderability solder bath ∆C/C: ≤ 15% Rapid change NPO/X7R:-55°C to +125°C, ∆C/C ≤ 1% or 1pF, of temperature 5 cycles whichever is greater Y5V: -25°C to +85°C, 5 cycles Damp heat, At 40°C, 90 to 95% RH and Ur ∆C/C:2% or 1pF ∆C/C: ≤ 15% steady state applied (max. 500V, for 56 days whichever is greater (500 hours for Y5V) Tan δ: ≤ 7% Class 2 only 56 days at 40°C, Tan δ: ≤ 2xspecified 90 to 95% RH, No voltage(for IR: 1000MΩ or Value Ur ≥1kV) RxC ≥ 25s Precondition for Class 2 Ur ≤ Whichever is less IR: 2500MΩ or 16V RxC ≥ 25s whichever is less Endurance At upper category temperature, ∆C/C:2% or 1pF ∆C/C: ≤ 20% 2xUr applied (1.5Ur for whichever is greater Ur>50V,1.2Ur for Ur ≥ 1KV) for Tan δ: ≤ 7% 1000hours Tan δ: ≤ 2xspecified Class 2 only 1000 hours, At Value IR: 2000MΩ or upper category temperature, No RxC ≥ 50s voltage (for Ur ≥ 1KV) IR: 4000MΩ or Whichever is less Precondition for Class 2 Ur ≤ RxC ≥ 40s 16V whichever is less Test items Conditions
W T L1 L3
L
L2
Style CC0402 CC0603 CC0805 CC1206 CC1210 CC1812 CC2220 Unit: mm
L 1.0±0.05 1.6±0.10 2.0±0.10 3.2±0.15 3.2±0.20 4.5±0.20 5.7±0.20
W 0.5±0.05 0.8±0.10 1.25±0.10 1.6±0.15 2.5±0.20 3.2±0.20 5.0±0.20 MIN. 0.45 0.70 0.50 0.50 0.50 0.50 0.50
yageo电容规格书 yageocorporati specificationapplies chipcapacitor made yageocorporation. partnumber: part number chipcapacitor size,tolerance, packing, material capacitorvalue. example: cc 0805 104code seriesname cc multi-layer chip cap. ca cap.array cl=low. inductance code sizecode nches(mm) 0402 (1005) 0603 (1608) 0805 (2012) 1206 (3216) 1210 (3225) 1808 (4520) 1812 (4532) 2220 (5750) code capacitancetol erance -20%+80%code packing styl papertape reel papertape reel 13inch embossedplastic tape reel embossedplastic tape reel 13inch. bulkbag bulkcassette code 9~11 materi al npo x7r z5u y5v code 12 rated voltage 63vcode 13 termi nation ni-barri er pdagcode 15~17 capaci tance value significant di gits 3rddi git: decimalpoint code 14 series nonbme bmeyageo corporati electricalcharacteristics requirement class classii characteristics test conditions npo x7r y5v z5u operation temperature range -55c 125c-55c 125c-25c 85c+10c +85ctemperature characteristic/coefficient (tc) 20c(25c, y5v,z5u)within operation temperature ra
CC 0805 K K X7R 9 B N 104
Code 1~2 Series Name CC = Multi-layer chip cap. CA = Cap. Array CL=Low. Inductance Code 3~6 Size Code inches (mm)
0402 0603 0805 1206 1210 1808 1812 2220
120-180 Sec.
60-100 Sec.
Time (seconds)
Profile Parameters 參數
1-2℃/Sec ramp 溫昇 ℃ Preheat 150-183℃： ℃：2-3 minutes ℃： Time above 183℃： ℃：60-100 seconds ℃： Peak Temperature：230±10℃ ： ± ℃ Module should only be in oven for 5.5-6 minute
NPO X7R Z5U Y5V
Code 13 Termination B = Ni-barrier A =ltage 5 = 6.3V 6 = 10V 7 = 16V 8 = 25V 9 = 50V 0 = 100V A= 200V B = 500V C= 1000V D= 2000V E= 3000V Y= 250V Z= 63V
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YAGEO CORPORATION
3. ELECTRICAL CHARACTERISTICS
Requirement Characteristics Operation temperature range Temperature characteristic/coefficient (TC) Capacitance tolerance With respect to 20°C (25°C, for Y5V、Z5U) within operation temperature range With respect to 20°C (25°C, for Y5V、Z5U) NPO: C ≤ 1000pF 1Vrms/1MHz C > 1000pF 1Vrms/1KHz X7R/Y5V: 1Vrms/1KHz Z5U: 0.5Vrms/1KHz C < 5pF; ±0.25pF C ≥ 5pF; ±0.5pF C ≥10pF; ±5%, ±10% Tan δ ≤ 2.5%, 50V C < 10pF: Tan δ≤10(3/C+0.7)x10-4 or 30 x10-4 whichever Tan δ ≤ 2.5%, 25V is less. Tan δ ≤ 3.5%, 16V C ≥ 10pF Tan δ ≤ 10 x 10-4 Tan δ ≤ 5%, 10V Tanδ≤ 5% or ≤ 7%, 25V/50V depending on capacitance value Tan δ ≤ 4%, 50V Tan δ ≤ 6%, 25V ±10%, ±20% ±20%, -20%~+80% ±20%, -20%~+80% NPO 16V, 0±60ppm/K NPO >16V, 0±30ppm/K ±15% +30% to –80% +22% to –56% Test conditions Class I NPO -55°C to 125°C X7R -55°C to 125°C Class II Y5V -25°C to 85°C Z5U +10°C to +85°C