ICMF112P900MFR-Data sheet(100511)共模电感

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Chip Common Mode Filter
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ICMF112P900MFR
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Data Sheet
- ITEM - PART NO : COMMON MODE FILTER : ICMF112P900MFR
- CONDITION : 1. 2. 3. 4.


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Chip Common Mode Filter
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ICMF112P900MFR
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1. GENERALS
• This specification covers the engineering requirements for the ICMF112P900M (Common Mode Filter)
2. FEATURES
• Effective for suppressing common mode noise and almost no effect for high speed differential data line Ultra low profile (1.2ⅹ1.0ⅹ0.6mm) Ceramic multilayer type SMD component Non-polarized product It is a product conforming to RoHS directive.
• • • •
3. APPLICATIONS
• • • LVDS lines in notebook computers USB2.0, IEEE1394, DVI, HDMI lines in PDP, LCD TV, DVD Player, PC, Audio player, DSC MDDI, MIPI in mobile phone
4. PRODUCT SPECIFICATIONS
4. 1 PART NUMBER CODE ICMF ① 11 ② 2P 900 ③ ④ M ⑤
① Series name of ICT’s Common Mode Filter ② Dimensions, 1.25mm (L) ⅹ 1.0mm (W) ③ The Number of lines, 2P = 2 lines ④ Common Mode Impedance (at 100MHz), 900= 90Ω ⑤Tolerance of common mode impedance, M= ±25%


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Chip Common Mode Filter
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ICMF112P900MFR
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4. 2 SPECIFICATION OF ELECTRICAL CHARACTERISTICS
Characteristics
symbol Units Test Condition Value Common Mode Impedance
CTF
Resistance
Rated Current
IR mA (Max) 2V 100
Insulation Resistance (Max)
IRCR
Rated Voltage
VC Volt (typ) 25℃±2℃ 10
ZCM Ω
RDC Ω
Ω
@100MHz 90(±25%)
25℃±2℃ 1.0 ~ 4.0
10V ≥10M
- Impedance Curves
1000
Common Mode
Impedance(Ω)
100
10
Differential Mode
1 1M
10M
100M
1G
Frequency(Hz)
- Transmission characteristics (S-parameter)
0
-5
Differential Mode
Insertion loss(dB)
-10
-15
Common Mode
-20
-25
-30 1M
10M
100M
1G
Frequency(Hz)


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Chip Common Mode Filter
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ICMF112P900MFR
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4. 3 OPERATING TEMPERATURE
DESCRIPTION Operating Temperature REQUIREMENTS -40℃ ∼ + 85℃
5. EQUIVALENT CIRCUIT
① ② PIN NUMBER ①~④ DESCRIPTION DATA LINE
③
④
6. MECHANICAL PROPERTY
6. 1 Appearance and Dimension
<top>
<side>
Unit : mm


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Chip Common Mode Filter
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ICMF112P900MFR
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6. 2 Structure of Product
6. 3 List of Raw Material
NO 1 2 3 4 5 6 Material Ferrite powder LTCC glass powder Ag(Inner) paste Ag(Terminal) paste Ni plating solution Sn plating solution Supplier Restricted Restricted Restricted Restricted Restricted Restricted


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Chip Common Mode Filter
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ICMF112P900MFR
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7. TEST METHOD OF ELECTRICAL PROPERTY
- PIN INDEX
ITEM Rdc CM Impedance
DESCRIPTION Pin 1 to 3, 2 to 4 Pin 1-2(Short) to Pin 3-4(Short)
SOURCE 10mA DC Source
EQUIPMENT Source Meter LCR Meter (3GHz)
7. 1 Rdc (Model: KEITHLEY 2400)
- Off power and On power. - Press button ‘Ω’ of MEAS. - Measure Rdc value using test fixture.
Terminal
Terminal
7. 2 Common Mode Impedance (Model: Agilent 4287A)
- Calibrate equipment - Measure CM Impedance (at 100MHz) using test fixture.
Terminal
Terminal


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Chip Common Mode Filter
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ICMF112P900MFR
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8. REFLOW CONDITION 8. 1 RECOMMENDED SOLDERING PROFILE (Lead-free condition)
(℃) 250℃ 220℃ ℃ 185℃ ℃ 160℃
Dwell: max 260℃-10sec
ΔT ≤130℃
30~50 sec 30~50 sec
130 ℃
Δ T≤
Soldering Soldering Preheating
110 ±10 sec
Gradual Cooling
25℃ 60 sec Time (sec)
8. 2 RECOMMENDED FOOT PRINT
Stencil Mask T : 0.10mm
Foot print
Stencil Mask
Unit : mm
8. 3 RECOMMENDED LEAD-FREE SOLDER PASTE
- Supplier : Tamura Donghwa - Main composition : Sn-Ag-Cu - Ratio of composition : 96.5%-3.0%-0.5%
8. 4 RECOMMENDED HAND SOLDER
- Max Temperature: Max 380 ℃(Max 5sec)


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Chip Common Mode Filter
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ICMF112P900MFR
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9. RELIABILITY TEST AND SPECIFICATION - METHOD OF RELIABILITY TEST
No ITEM REQUIREMENT TEST CONDITION : 160 ~ 185℃ : 110 ±10 sec : 220℃ 이상 : 40 ±10 sec : max 260℃ : max 10sec.
1.0 mm
1
Reflow soldering
-Pre-heating temperature time No mechanical damage. -Soldering More than 50% of the terminal temperature Electrode shall be covered with time new solder. -Peak temperature time
2
Bending Strength test
No mechanical damage. impedance change: within ±30%
45mm 45mm
Adhesive strength 3 of Terminal electrode
Adhesion strength should be over 1kgf
PCB Chip
Thermal shock 4 (Temperature cycle)
No mechanical damage. impedance change: within ±30%
Step 1: -40 ±2℃ 30 ±3min. Step 2: 85 ±2℃ 30 ±3min. Number of cycle : 100 times Then measured after exposure in the room condition for 24±2hrs Temperature : 85 ±2℃ Applied Current : Rated Current Time: 1000hrs Then measured after exposure in the room condition for 24±2hrs Temperature : 40 ±2℃ Humidity : 90 ~ 95%RH Applied Current : Rated Current Time: 500hrs Then measured after exposure in the room condition for 24±2hrs
Heat 5 Load resistance
No mechanical damage. impedance change: within ±30%
Humidity 6 load resistance
No mechanical damage. impedance change: within ±30%


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10. PACKING SPECIFICATION 10. 1 TAPING FIGURE
10. 2 CARRIER TAPE DIMENSIONS
Unit : mm
SYMBOL A 1.2 ±0.2 B 1.5 ±0.2 W 8.0 ±0.3 F 3.5 ±0.05 E 1.75 ±0.1 P1 4.0 ±0.1 P2 2.0 ±0.05 P0 4.0 ±0.1 D 1.5 ±0.01 t 0.75 below
DIMENSION
11


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Chip Common Mode Filter
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ICMF112P900MFR
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10. 3 REEL DIMENSIONS
(1) Reel Materials: Polystyrene (2) Label (3) Taping - Standard Packing Quantity per Reel (φ178) - Paper Tape: 4,000pcs
Unit : mm
CODE DIMENSION
A φ178±2
B
C
D
E 2.0±0.5
W 10±1.5
t 0.8±0.2
R 1.0
Min. φ50 φ13±0.5 φ21±0.8
10. 4 LABEL CODE
INNOCHIPS TECHNOLOGY
P/N : ICMF112P900MR L/N : K0130CIA DATE:090305 C/N:OIAMT073001 Q’TY : 4,000 SPEC : 1210,2P, 90 ohm
MADE IN KOREA
- P/N : Part Number - L/N : Lot Number - C/N : Customer Number - SPEC : Size, The number of lines & CM Impedance - DATE : Date code - Q’TY : Quantity

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