IC PACKAGE WITH TOP-SIDE MEMORY MODULE
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专利名称：IC PACKAGE WITH TOP-SIDE MEMORY MODULE
发明人：AZEROUAL, Dan,BEN ARTSI, Liav
申请号：IB2020/055471
申请日：20200610
公开号：WO2020/250162A1
公开日：
20201217
专利内容由知识产权出版社提供
专利附图：
摘要：A printed circuit board (PCB) system includes a first printed circuit board (PCB), an integrated circuit (IC) package, and a memory module. The IC package includes i) a package substrate, ii) a main IC chip that is electrically coupled to a top surface of the
package substrate, iii) first contact structures that are disposed on a bottom surface of the package substrate and that are electrically coupled to the first PCB, and iv) second contact structures that are disposed on a top surface of the package substrate. The memory module includes i) a second PCB, ii) one or more memory IC chips that are disposed on the second PCB, and iii) third contact structures that are disposed on a bottom surface of the second PCB. An interposer electrically couples the second contact structures of the IC package with the third contact structures of the memory module.
申请人：MARVELL ISRAEL (M.I.S.L) LTD.
地址：6 Hamada Street Mordot, HaCarmel Industrial Park 20692 Yokneam IL
国籍：IL
代理人：KLIGLER & ASSOCIATES PATENT ATTORNEYS LTD.
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