TC9309F-059中文资料

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9309中文资料

9309中文资料

TL F 66029309 DM9309 Dual 4-Bit Data Selectors MultiplexersJune19899309 DM9309Dual4-Bit Data Selectors Multiplexers General DescriptionThese data selectors multiplexers contain inverter driversto supply full complementary on-chip binary decoded dataselectionThe9309 DM9309contains two separate4-bit multiplexerswith complementary Y and Y outputs however the two sec-tions have common address select inputsFeaturesY Complementary outputsY Dual one-of-four data selectorsConnection DiagramDual-In-Line PackageTL F 6602–1Order Number9309DMQB 9309FMQB or DM9309NSee NS Package Number J16A N16E or W16AFunction TableInputs OutputsSelect DataY YB A C0C1C2C3L L L X X X L HL L H X X X H LL H X L X X L HL H X H X X H LH L X X L X L HH L X X H X H LH H X X X L L HH H X X X H H LSelect inputs A and B are common to both sectionsH e High Level L e Low Level X e Don’t CareC1995National Semiconductor Corporation RRD-B30M105 Printed in U S AAbsolute Maximum Ratings(Note)If Military Aerospace specified devices are required please contact the National Semiconductor Sales Office Distributors for availability and specifications Supply Voltage7V Input Voltage5 5V Operating Free Air Temperature RangeMilitary b55 C to a125 C Commercial0 C to a70 C Storage Temperature Range b65 C to a150 C Note The‘‘Absolute Maximum Ratings’’are those values beyond which the safety of the device cannot be guaran-teed The device should not be operated at these limits The parametric values defined in the‘‘Electrical Characteristics’’table are not guaranteed at the absolute maximum ratings The‘‘Recommended Operating Conditions’’table will define the conditions for actual device operationRecommended Operating ConditionsSymbol ParameterMilitary CommercialUnits Min Nom Max Min Nom MaxV CC Supply Voltage4 555 54 7555 25V V IH High Level Input Voltage22V V IL Low Level Input Voltage0 80 8V I OH High Level Output Current b0 8b0 8mA I OL Low Level Output Current1616mA T A Free Air Operating Temperature b55125070 C Electrical Characteristics over recommended operating free air temperature range(unless otherwise noted)Symbol Parameter Conditions MinTypMax Units (Note1)V I Input Clamp Voltage V CC e Min I I e b12mA b1 5VV OH High Level Output V CC e Min I OH e Max2 43 4VVoltage V IL e Max V IH e MinV OL Low Level Output V CC e Min I OL e Max0 20 4VVoltage V IH e Min V IL e MaxI I Input Current Max V CC e Max V I e5 5V1mA Input VoltageI IH High Level Input V CC e Max V I e2 4V40m A CurrentI IL Low Level Input V CC e Max V I e0 4Vb1 6mA CurrentI OS Short Circuit V CC e Max MIL b20b70mA Output Current(Note2)COM b30b85I CC Supply Current V CC e Max(Note3)2744mA Note1 All typicals are at V CC e5V T A e25 CNote2 Not more than one output should be shorted at a timeNote3 I CC is measured with the outputs open and all inputs at4 5V2Switching Characteristics at V CC e5V and T A e25 C(See Section1for Test Waveforms and Output Load)Military CommercialFrom(Input)Symbol Parameter To(Output)R L e400X C L e15pF UnitsMin Max Min Maxt PLH Propagation Delay Time Select2940ns Low to High Level Output to Yt PHL Propagation Delay Time Select2736ns High to Low Level Output to Yt PLH Propagation Delay Time Select2124ns Low to High Level Output to Yt PHL Propagation Delay Time Select2129ns High to Low Level Output to Yt PLH Propagation Delay Time Data2027ns Low to High Level Output to Yt PHL Propagation Delay Time Data2134ns High to Low Level Output to Yt PLH Propagation Delay Time Data1221ns Low to High Level Output to Yt PHL Propagation Delay Time Data1313ns High to Low Level Output to YLogic Diagram9309TL F 6602–234Physical Dimensions inches(millimeters)16-Lead Ceramic Dual-In-Line Package(J)Order Number9309DMQBNS Package Number J16A16-Lead Molded Dual-In-Line Package(N)Order Number DM9309NNS Package Number N16E59309 D M 9309D u a l 4-B i t D a t a S e l e c t o r s M u l t i p l e x e r sPhysical Dimensions inches (millimeters)(Continued)16-Lead Ceramic Flat Package (W)Order Number 9309FMQB NS Package Number W16ALIFE SUPPORT POLICYNATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION As used herein 1 Life support devices or systems are devices or 2 A critical component is any component of a life systems which (a)are intended for surgical implant support device or system whose failure to perform can into the body or (b)support or sustain life and whose be reasonably expected to cause the failure of the life failure to perform when properly used in accordance support device or system or to affect its safety or with instructions for use provided in the labeling can effectivenessbe reasonably expected to result in a significant injury to the userNational Semiconductor National Semiconductor National Semiconductor National Semiconductor CorporationEuropeHong Kong LtdJapan Ltd1111West Bardin RoadFax (a 49)0-180-530858613th Floor Straight Block Tel 81-043-299-2309。

C8051F930 产品简介C8051F930_short

C8051F930 产品简介C8051F930_short

Low-Voltage/Low-Power Copyright © 2008 by Silicon Laboratories11.11.2008Supply Voltage: 0.9 to 3.6 V-One-cell mode supports 0.9–1.8 V operation -Two-cell mode supports 1.8–3.6 V operation-Built-in dc-dc converter with 1.8 –3.3 V output (65 mW max) foruse in one-cell mode; can supply external devices-Typical sleep mode current < 0.1 µA; retains state and RAM-contents over full supply range; fast wakeup- 2 built-in brown-out detectors cover sleep and active modes 10-Bit Analog to Digital Converter -Up to 300 ksps-Up to 23 external inputs-External pin or internal VREF (no external capacitor required)-Built-in temperature sensor-External conversion start input option-Autonomous Burst Mode with 16-bit automatic averagingaccumulatorTwo Comparators-Programmable hysteresis and response time -Configurable as interrupt or reset source -Low current (< 0.5 µA)-Up to 23 Capacitive Touch Sense inputsMemoryHigh-Speed 8051 µC Core-Pipe-lined instruction architecture; executes 70% of instructionsin 1 or 2 system clocks-25 MIPS peak throughput with 25 MHz clock -Expanded interrupt handlerDigital Peripherals-24 port I/O; All 5 V tolerant with programmable drive strength -Hardware enhanced UART, SPI and SMBus™ serial portsavailable concurrently-Low power 32-bit smaRTClock (0.5 uA) operates down to 0.9V -Four general purpose 16-bit counter/timers-16-bit programmable counter array (PCA) with six capture/com-pare modules and watchdog timer:•8, 9, 10, 11, or 16-bit PWM •Rising/falling edge capture •Frequency output •Software timer Clock Sources-Precision internal oscillators: 24.5 MHz with ±2% accuracy sup-ports UART operation; spread-spectrum mode for reduced EMI-Low power internal oscillator: 20 MHz-External oscillator: Crystal, RC, C, CMOS clock-smaRTClock oscillator: 32.768 kHz crystal or self-oscillateLow-Voltage/Low-Power Copyright © 2008 by Silicon Laboratories 11.11.2008Silicon Laboratories and Silicon Labs are trademarks of Silicon Laboratories Inc.Other products or brandnames mentioned herein are trademarks or registered trademarks of their respective holdersSelected Electrical Specifications(At 25 C°)ParameterConditionsMin Typ Max Units Supply Input Voltagetwo-cell mode one-cell modeDC-DC converter disabled 1.8— 3.6V DC-DC converter enabled 0.9— 1.8V DC-DC Boost Converter Output Power (V OUT = 1.8–3.3 V)Includes on and off-chip current ——65mW Supply Current with CPU Active VDD = 1.8–3.6 V Clock = 24.5 MHz(±2% internal precision oscillator)— 4.1—mA Supply Current (shutdown) (V BAT = 1.8 V)Sleep mode; smaRTClock off —50—nA Sleep mode; smaRTClock running—0.6—µA Clock Frequency Range DC —25MHz Wakeup Timetwo-cell mode —2—µs one-cell mode—10—µs Internal OscillatorFrequency Precision oscillator 2424.525MHz Low power oscillator182022MHz A/D ConverterResolution10bits Throughput Rate——300kspsPackage Information: 32-Pin QFNMM MIN TYP MAX A 0.800.9 1.00A10.000.020.05A200.65 1.00A3—0.25—b 0.180.250.30D — 5.00—D2 1.25 2.70 3.25E — 5.00—E2 1.25 2.70 3.25e —0.50—L 0.300.400.50N —32—ND —8—NE —8—R0.09——Package Information: 32-Pin LQFPMMMIN TYP MAX MINTYP MAXA —— 1.60E 9.00 BSC A10.05—0.15E17.00 BSC A2 1.35 1.40 1.45L 0.450.600.75b 0.300.370.45aaa 0.20c 0.09—0.20bbb 0.20D 9.00 BSC ccc 0.10D17.00 BSC ddd 0.20e0.80BSCθ0° 3.5°7°。

W39V080APZ资料

W39V080APZ资料

W39V080A Data Sheet1M × 8 CMOS FLASH MEMORYWITH LPC INTERFACE Table of Contents-1.GENERAL DESCRIPTION (3)2.FEATURES (3)3.PIN CONFIGURATIONS (4)4.BLOCK DIAGRAM (4)5.PIN DESCRIPTION (4)6.FUNCTIONAL DESCRIPTION (5)6.1Interface Mode Selection and Description (5)6.2Read (Write) Mode (5)6.3Reset Operation (5)6.4Boot Block Operation and Hardware Protection at Initial- #TBL & #WP (5)6.5Sector Erase Command (6)6.6Program Operation (6)6.7Dual BIOS (6)6.8Hardware Data Protection (6)6.9Write Operation Status (7)7.TABLE OF OPERATING MODES (10)7.1Operating Mode Selection - Programmer Mode (10)7.2Operating Mode Selection - LPC Mode (10)7.3Standard LPC Memory Cycle Definition (10)8.TABLE OF COMMAND DEFINITION (11)8.1Embedded Programming Algorithm (12)8.2Embedded Erase Algorithm (13)8.3Embedded #Data Polling Algorithm (14)8.4Embedded Toggle Bit Algorithm (15)8.5Software Product Identification and Boot Block Lockout Detection Acquisition Flow..169.DC CHARACTERISTICS (17)9.1Absolute Maximum Ratings (17)9.2Programmer interface Mode DC Operating Characteristics (17)9.3LPC interface Mode DC Operating Characteristics (18)9.4Power-up Timing (18)10.CAPACITANCE (18)11.PROGRAMMER INTERFACE MODE AC CHARACTERISTICS (19)Publication Release Date: Dec. 28, 2005W39V080A11.1AC Test Conditions (19)11.2AC Test Load and Waveform (19)11.3Read Cycle Timing Parameters (20)11.4Write Cycle Timing Parameters (20)11.5Data Polling and Toggle Bit Timing Parameters (20)12.TIMING WAVEFORMS FOR PROGRAMMER INTERFACE MODE (21)12.1Read Cycle Timing Diagram (21)12.2Write Cycle Timing Diagram (21)12.3Program Cycle Timing Diagram (22)12.4#DATA Polling Timing Diagram (22)12.5Toggle Bit Timing Diagram (23)12.6Sector Erase Timing Diagram (23)13.LPC INTERFACE MODE AC CHARACTERISTICS (24)13.1AC Test Conditions (24)13.2Read/Write Cycle Timing Parameters (24)13.3Reset Timing Parameters (24)14.TIMING WAVEFORMS FOR LPC INTERFACE MODE (25)14.1Read Cycle Timing Diagram (25)14.2Write Cycle Timing Diagram (25)14.3Program Cycle Timing Diagram (26)14.4#DATA Polling Timing Diagram (27)14.5Toggle Bit Timing Diagram (28)14.6Sector Erase Timing Diagram (29)14.7GPI Register/Product ID Readout Timing Diagram (30)14.8Reset Timing Diagram (30)15.ORDERING INFORMATION (31)16.HOW TO READ THE TOP MARKING (31)17.PACKAGE DIMENSIONS (32)17.132L PLCC (32)17.232L STSOP (8x14mm) (32)17.340L TSOP (10 mm x 20 mm) (33)18.VERSION HISTORY (34)W39V080APublication Release Date: Dec. 28, 20051. GENERAL DESCRIPTIONThe W39V080A is an 8-megabit, 3.3-volt only CMOS flash memory organized as 1M × 8 bits. For flexible erase capability, the 8Mbits of data are divided into 16 uniform sectors of 64 Kbytes. The device can be programmed and erased in-system with a standard 3.3V power supply. A 12-volt VPP is required for accelerated program. The unique cell architecture of the W39V080A results in fast program/erase operations with extremely low current consumption. This device can operate at two modes, Programmer bus interface mode and LPC bus interface mode. As in the Programmer interface mode, it acts like the traditional flash but with a multiplexed address inputs. But in the LPC interface mode, this device complies with the Intel LPC specification. The device can also be programmed and erased using standard EPROM programmers.2. FEATURESy Single 3.3-volt operations: − 3.3-volt Read − 3.3-volt Erase − 3.3-volt Programy Fast Program operation:− VPP = 12V− Byte-by-Byte programming: 9 μS (typ.)y Fast Erase operation:− Sector erase 0.9 Sec. (tpy.) y Fast Read access time: Tkq 11 nS y Endurance: 30K cycles (typ.) y Twenty-year data retention y 16 Even sectors with 64K bytes y Any individual sector can be erased y Dual BIOS function− Full-chip Partition with 8M-bit or Dual-block Partition with 4M-bit y Hardware protection:− #TBL supports 64-Kbyte Boot Blockhardware protection− #WP supports the whole chip except Boot Block hardware protectiony Ready/#Busy output (RY/#BY)− Detect program or erase cycle completion y Hardware reset pin (#RESET)− Reset the internal state machine to the read mode y VPP input pin− Acceleration (ACC) function accelerates program timingy Low power consumption− Read Active current: 15 mA (typ. for LPC mode)y Automatic program and erase timing withinternal V PP generation y End of program or erase detection − Toggle bit − Data pollingy Latched address and data y TTL compatible I/Oy Available packages: 32L PLCC, 32L STSOP,40L TSOP(10 x 20 mm), 32L PLCC Lead free, 32L STSOP Lead free and 40L TSOP (10 x 20 mm) Lead freeW39V080A3. PIN CONFIGURATIONS4. BLOCK DIAGRAM5. PIN DESCRIPTIONINTERFACESYM.PGM LPCPIN NAMEMODE * *Interface Mode Selection #RESET * *Reset #INIT *Initialize#TBL *Top Boot Block Lock #WP *Write Protect CLK *CLK InputGPI[4:0] *General Purpose Inputs ID[3:0] *Identification InputsPull Down with Internal ResistorsLAD[3:0] *Address/Data Inputs #LFRAME *LPC Cycle InitialD/#F *Dual Bios/Full ChipPull Down with Internal Resistors U/#L *Upper 4M/Lower 4MPull Down with Internal ResistorsR/#C * Row/Column Select A[10:0]* Address Inputs DQ[7:0]* Data Inputs/Outputs #OE * Output Enable #WE * Write Enable RY/#BY * Ready/Busy VDD * *Power Supply VSS * *Ground RSV * *Reserve Pins NC * *No ConnectionW39V080A6. FUNCTIONAL DESCRIPTION6.1 Interface Mode Selection and DescriptionThis device can be operated in two interface modes, one is Programmer interface mode, and the other is LPC interface mode. The MODE pin of the device provides the control between these two interface modes. These interface modes need to be configured before power up or return from #RESET. When MODE pin is set to high position, the device is in the Programmer mode; while the MODE pin is set to low position, it is in the LPC mode. In Programmer mode, this device just behaves like traditional flash parts with 8 data lines. But the row and column address inputs are multiplexed. The row address is mapped to the higher internal address A[19:11]. And the column address is mapped to the lower internal address A[10:0]. For LPC mode, It complies with the LPC Interface Specification Revision 1.1 Through the LAD[3:0] and #LFRAME to communicate with the system chipset .6.2 Read (Write) ModeIn Programmer interface mode, the read(write) operation of the W39V080A is controlled by #OE (#WE). The #OE (#WE) is held low for the host to obtain (write) data from(to) the outputs(inputs). #OE is the output control and is used to gate data from the output pins. The data bus is in high impedance state when #OE is high. As in the LPC interface the “bit 1 of CYCLE TYPE+DIR” determines mode, the read or write. Refer to the timing waveforms for further details.6.3 Reset OperationThe #RESET input pin can be used in some application. When #RESET pin is at high state, the device is in normal operation mode. When #RESET pin is at low state, it will halt the device and all outputs will be at high impedance state. As the high state re-asserted to the #RESET pin, the device will return to read or standby mode, it depends on the control signals.6.4 Boot Block Operation and Hardware Protection at Initial- #TBL & #WPThere is a hardware method to protect the top boot block and other sectors. Before power on programmer, tie the #TBL pin to low state and then the top boot block will not be programmed/erased. If #WP pin is tied to low state before power on, the other sectors will not be programmed/erased.In order to detect whether the boot block feature is set on or not, users can perform software command sequence: enter the product identification mode (see Command Codes for Identification/Boot Block Lockout Detection for specific code), and then read from address FFFF2(hex). You can check the DQ2/DQ3 at the address FFFF2 to see whether the #TBL/#WP pin is in low or high state. If the DQ2 is “0”, it means the #TBL pin is tied to high state. In such condition, whether boot block can be programmed/erased or not will depend on software setting. On the other hand, if the DQ2 is “1”, it means the #TBL pin is tied to low state, then boot block is locked no matter how the software is set. Like the DQ2, the DQ3 inversely mirrors the #WP state. If the DQ3 is “0”, it means the #WP pin is in high state, then all the sectors except the boot block can be programmed/erased. On the other hand, if the DQ3 is “1”, then all the sectors except the boot block are programmed/erased inhibited.To return to normal operation, perform a three-byte command sequence (or an alternate single-byte command) to exit the identification mode. For the specific code, see Command Codes for Identification/Boot Block Lockout Detection.Publication Release Date: Dec. 28, 2005W39V080A6.5 Sector Erase CommandSector erase is a six-bus cycles operation. There are two "unlock" write cycles, followed by writing the "set-up" command. Two more "unlock" write cycles then follows by the Sector erase command. The Sector address (any address location within the desired Sector) is latched on the rising edge of R/#C in programmer mode, while the command (30H) is latched on the rising edge of #WE.Sector erase does not require the user to program the device prior to erase. When erasing a Sector, the remaining unselected sectors are not affected. The system is not required to provide any controls or timings during these operations.The automatic Sector erase begins after the erase command is completed, right from the rising edge of the #WE pulse for the last Sector erase command pulse and terminates when the data on DQ7, Data Polling, is "1" at which time the device returns to the read mode. Data Polling must be performed at an address within any of the sectors being erased.Refer to the Erase Command flow Chart using typical command strings and bus operations.6.6 Program OperationThe W39V080A is programmed on a byte-by-byte basis. Program operation can only change logical data "1" to logical data "0." The erase operation, which changed entire data in main memory and/or boot block from "0" to "1", is needed before programming.The program operation is initiated by a 4-byte command cycle (see Command Codes for Byte Programming). The device will internally enter the program operation immediately after the byte-program command is entered. The internal program timer will automatically time-out (9μS typ. - T BP) once it is completed and then return to normal read mode. Data polling and/or Toggle Bits can be used to detect end of program cycle.6.7 Dual BIOSThe W39V080A provides a solution for Dual-BIOS application. In LPC mode, when D/#F is low, the device functions as a full-chip partition of 8M-bit which address ranges from FFFFFh to 00000h with A[19:0]. If D/#F is driven high, the device functions as a dual-block partition that each block consists of 4M-bit. For dual-block partition, there is only one 4M-bit block, either upper or lower, can be accessed. The U/#L pin selects either upper or lower 4M-bit block and its address ranges from 7FFFFh to 00000h with A[19:0]. When U/#L is low, the lower 4M-bit block will be selected; while, U/#L is high, the upper 4M-bit block will be selected.6.8 Hardware Data ProtectionThe integrity of the data stored in the W39V080A is also hardware protected in the following ways:(1) Noise/Glitch Protection: A #WE pulse of less than 15 nS in duration will not initiate a write cycle.(2) V DD Power Up/Down Detection: The programming and read operation are inhibited when V DD isless than 2.0V typical.(3) Write Inhibit Mode: Forcing #OE low or #WE high will inhibit the write operation. This preventsinadvertent writes during power-up or power-down periods.W39V080APublication Release Date: Dec. 28, 20056.9 Write Operation StatusThe device provides several bits to determine the status of a program or erase operation: DQ5, DQ6, and DQ7. Each of DQ7 and DQ6 provides a method for determining whether a program or erase operation is complete or in progress. The device also offers a hardware-based output signal, RY/#BY in programmer mode, to determine whether an Embedded Program or Erase operation is in progress or has been completed.DQ7: #Data PollingThe #Data Polling bit, DQ7, indicates whether an Embedded Program or Erase algorithm is in progress or completed. Data Polling is valid after the rising edge of the final #WE pulse in the command sequence.During the Embedded Program algorithm, the device outputs on DQ7 and the complement of the data programmed to DQ7. Once the Embedded Program algorithm has completed, the device outputs the data programmed to DQ7. The system must provide the program address to read valid status information on DQ7. If a program address falls within a protected sector, #Data Polling on DQ7 is active for about 1 S, and then the device returns to the read mode. During the Embedded Erase algorithm, #Data Polling produces “0” on DQ7. Once the Embedded Erase algorithm has completed, #Data Polling produces “1” on DQ7. An address within any of the sectors selected for erasure must be provided to read valid status information on DQ7.After an erase command sequence is written, if all sectors selected for erasing are protected, #Data Polling on DQ7 is active for about 100S, and then the device returns to the read mode. I f not all selected sectors are protected, the Embedded Erase algorithm erases the unprotected sectors, and ignores the selected sectors that are protected. However, if the system reads DQ7 at an address within a protected sector, the status may not be valid.Just before the completion of an Embedded Program or Erase operation, DQ7 may change asynchronously with DQ0-DQ6 while Output Enable (#OE) is set to low. That is, the device may change from providing status information to valid data on DQ7. Depending on when it samples the DQ7 output, the system may read the status or valid data. Even if the device has completed the program or erase operation and DQ7 has valid data, the data outputs on DQ0-DQ6 may be still invalid. Valid data on DQ7-DQ0 will appear on successive read cycles.RY/#BY: Ready/#BusyThe RY/#BY is a dedicated, open-drain output pin which indicates whether an Embedded Algorithm is in progress or complete. The RY/#BY status is valid after the rising edge of the final #WE pulse in the command sequence. Since RY/#BY is an open-drain output, several RY/#BY pins can be tied together in parallel with a pull-up resistor to VDD.When the output is low (Busy), the device is actively erasing or programming. When the output is high (Ready), the device is in the read mode or standby mode.DQ6: Toggle Bit IToggle Bit I on DQ6 indicates whether an Embedded Program or Erase algorithm is in progress or complete. Toggle Bit I may be read at any address, and is valid after the rising edge of the final #WE pulse in the command sequence (before the program or erase operation), and during the sector erase time-out.During an Embedded Program or Erase algorithm operation, successive read cycles to any address cause DQ6 to toggle. The system may use either #OE to control the read cycles. Once the operation has completed, DQ6 stops toggling.W39V080A After an erase command sequence is written, if all sectors selected for erasing are protected, DQ6 toggles for about 100 S, and then returns to reading array data. If not all selected sectors are protected, the Embedded Erase algorithm erases the unprotected sectors, and ignores the selected sectors which are protected.The system can use DQ6 to determine whether a sector is actively erasing. If the device is actively erasing (i.e., the Embedded Erase algorithm is in progress), DQ6 toggles. If a program address falls within a protected sector, DQ6 toggles for about 1 μS after the program command sequence is written, and then returns to reading array data.Reading Toggle Bits DQ6Whenever the system initially starts to read toggle bit status, it must read DQ7-DQ0 at least twice in a row to determine whether a toggle bit is toggling or not. Typically, the system would note and store the value of the toggle bit after the first read. While after the second read, the system would compare the new value of the toggle bit with the first one. If the toggle bit is not toggling, the device has completed the program or erase operation. The system can read array data on DQ7-DQ0 on the following read cycle.However, if after the initial two read cycles, the system finds that the toggle bit is still toggling, the system also should note whether the value of DQ5 is high or not(see the section on DQ5). If DQ5 is high, the system should then determine again whether the toggle bit is toggling or not, since the toggle bit may have stopped toggling just as DQ5 went high. If the toggle bit is no longer toggling, the device has successfully completed the program or erase operation. If it is still toggling, the device did not completed the operation, and the system must write the reset command to return to reading array data.Then the system initially determines that the toggle bit is toggling and DQ5 has not gone high. The system may continue to monitor the toggle bit and DQ5 through successive read cycles, and determines the status as described in the previous paragraph. Alternatively, the system may choose to perform other system tasks. In this case, the system must start at the beginning of the algorithm while it returns to determine the status of the operation.DQ5: Exceeded Timing LimitsDQ5 indicates whether the program or erase time has exceeded a specified internal pulse count limit. DQ5 produces “1” under these conditions which indicates that the program or erase cycle was not successfully completed.The device may output “1” on DQ5 if the system tries to program “1” to a location that was previously programmed to “0.” Only the erase operation can change “0” back to “1.” Under this condition, the device stops the operation, and while the timing limit has been exceeded, DQ5 produces “1.”Under both these conditions, the system must hardware reset to return to the read mode. REGISTERThere are two kinds of registers on this device, the General Purpose Input Registers and Product Identification Registers. Users can access these registers through respective address in the 4Gbytes memory map. There are detail descriptions in the sections below.General Purpose Inputs RegisterThis register reads the GPI[4:0] pins on the W39V080A.This is a pass-through register which can read via memory address FFBC0100(hex), or FFBxE100(hex). Since it is pass-through register, there is no default value.W39V080APublication Release Date: Dec. 28, 2005GPI Register TableBIT FUNCTION7 − 5 Reserved4 Read GPI4 pin status 3 Read GPI3 pin status 2 Read GPI2 pin status 1 Read GPI1 pin status 0Read GPI0 pin statusProduct Identification RegistersThere is a software method to read out the Product Identification in both the Programmer interface mode and the LPC interface mode. Thus, the programming equipment can automatically matches the device with its proper erase and programming algorithms.In the full-chip(8Mb) LPC interface mode, a read from FFBC, 0000(hex) can output the manufacturer code, DA(hex). A read from FFBC, 0001(hex) can output the device code D0(hex).For dual-BIOS(4Mbx2) LPC mode , a read from FFBC, 0000(hex) can output the manufacturer code, DA(hex). A read from FFBC,0001(hex) can output the device code 90(hex).In the software access mode, a JEDEC 3-byte command sequence can be used to access the product ID for programmer interface mode. A read from address 0000(hex) outputs the manufacturer code, DA(hex). A read from address 0001(hex) outputs sequence or an alternate one-byte command sequence (see Command Definition table for detail).the device code, D0(hex).” The product ID operation can be terminated by a three-byte command.Identification Input Pins ID[3:0]These pins are part of mechanism that allows multiple parts to be used on the same bus. The boot device should be 0000b. And all the subsequent parts should use the up-count strapping. Memory Address MapThere are 8M bytes space reserved for BIOS Addressing. The 8M bytes are mapped into a single 4M system address by dividing the ROMs into two 4M byte pages. For accessing the 4M byte BIOS storage space, the ID[2:1] pins are inverted in the ROM and are compared to address lines [21:20]. ID[3] can be used as like active low chip-select pin. The 32Mbit address space is as below:BLOCK LOCK ADDRESS RANGE4M Byte BIOS ROM None FFFF, FFFFh: FFC0, 0000hThe ROM responds to top 1M byte pages based on the ID pins strapping according to the followingtable:ID[2:1] PINSROM BASED ADDRESS RANGE00x FFFF, FFFFh: FFF0, 0000h 01x FFEF, FFFFh: FEF0, 0000h 10x FFDF, FFFFh: FFD0, 0000h 11xFFCF, FFFFh: FFC0, 0000hW39V080A7. TABLE OF OPERATING MODES7.1 Operating Mode Selection - Programmer ModeMODE PINS#OE#WE#RESETADDRESSDQ.Read V IL V IH V IH AIN Dout Write V IH V ILV IHAIN DinStandby X X V IL XHigh ZWrite Inhibit V IL X V IH X High Z/DOUT X V IH V IH X High Z/DOUTOutput DisableV IH X V IH XHigh Z7.2 Operating Mode Selection - LPC ModeOperation modes in LPC interface mode are determined by "cycle type" when it is selected. When itis not selected, its outputs (LAD[3:0]) will be disable. Please reference to the "Standard LPC Memory Cycle Definition".7.3 Standard LPC Memory Cycle DefinitionFIELDNO. OF CLOCKSDESCRIPTIONStart 1 "0000b" appears on LPC bus to indicate the initialCycle Type & Dir 1 "010Xb" indicates memory read cycle; while "011xb" indicates memory write cycle. "X" mean don't have to care. TAR2Turned Around TimeAddr. 8Address Phase for Memory Cycle. LPC supports the 32 bits address protocol. The addresses transfer most significant nibble first and leastsignificant nibble last. (i.e. Address[31:28] on LAD[3:0] first , and Address[3:0] on LAD[3:0] last.) Sync. N Synchronous to add wait state. "0000b" means Ready, "0101b" meansShort Wait, "0110b" means Long Wait, "1001b" for DMA only, "1010b"means error, other values are reserved. Data 2 Data Phase for Memory Cycle. The data transfer least significant nibblefirst and most significant nibble last. (i.e. DQ[3:0] on LAD[3:0] first ,then DQ[7:4] on LAD[3:0] last.)W39V080APublication Release Date: Dec. 28, 20058. TABLE OF COMMAND DEFINITIONCOMMAND NO. OF 1ST CYCLE 2ND CYCLE 3RD CYCLE 4TH CYCLE 5TH CYCLE 6TH CYCLE DESCRIPTION Cycles (1) Addr. Data Addr. DataAddr. DataAddr. DataAddr. DataAddr. DataRead 1 A IN D OUT Sector Erase 6 5555 AA 2AAA 555555 80 5555 AA 2AAA 55SA (5) 30Byte Program 4 5555 AA 2AAA 555555 A0 A IN D INProduct ID Entry 3 5555 AA 2AAA 555555 90 Product ID Exit (4) 3 5555 AA 2AAA 555555 F0Product ID Exit (4)1XXXX F0Notes: 1. The cycle means the write command cycle not the LPC clock cycle. 2. The Column Address / Row Address are mapped to the Low / High order Internal Address. i.e. Column Address A[10:0] are mapped to the internal A[10:0], Row Address A[7:0] are mapped to the internal A[19:11] 3. Address Format: A14−A0 (Hex); Data Format: DQ7-DQ0 (Hex) 4. Either one of the two Product ID Exit commands can be used. 5. SA: Sector AddressSA = FXXXXh for Unique Sector15 (Boot Sector) SA = 7XXXXh for Unique Sector7 SA = EXXXXh for Unique Sector14 SA = 6XXXXh for Unique Sector6 SA = DXXXXh for Unique Sector13 SA = 5XXXXh for Unique Sector5 SA = CXXXXh for Unique Sector12 SA = 4XXXXh for Unique Sector4 SA = BXXXXh for Unique Sector11 SA = 3XXXXh for Unique Sector3 SA = AXXXXh for Unique Sector10 SA = 2XXXXh for Unique Sector2 SA = 9XXXXh for Unique Sector9 SA = 1XXXXh for Unique Sector1 SA = 8XXXXh for Unique Sector8SA = 0XXXXh for Unique Sector0W39V080A 8.1 Embedded Programming AlgorithmW39V080A 8.2 Embedded Erase AlgorithmPublication Release Date: Dec. 28, 2005W39V080A 8.3 Embedded #Data Polling AlgorithmW39V080A 8.4 Embedded Toggle Bit AlgorithmPublication Release Date: Dec. 28, 2005W39V080A 8.5 Software Product Identification and Boot Block Lockout DetectionAcquisition FlowNotes for software product identification/boot block lockout detection:(1) Data Format: DQ7−DQ0 (Hex); Address Format: A14−A0 (Hex)(2) A1−A19 = V IL; manufacture code is read for A0 = V IL; device code is read for A0 = V IH.(3) The device does not remain in identification and boot block lockout detection mode if power down.(4) The DQ[3:2] to indicate the sectors protect status as below:DQ2 DQ30 64Kbytes Boot Block Unlocked by #TBL hardwaretrapping Whole Chip Unlocked by #WP hardware trapping Except Boot Block1 64Kbytes Boot Block Locked by #TBL hardwaretrapping Whole Chip Locked by #WP hardware trapping Except Boot Block(5) The device returns to standard operation mode.(6) Optional 1-write cycle (write F0 (hex.) at XXXX address) can be used to exit the product identification/boot block lockoutdetection.W39V080APublication Release Date: Dec. 28, 20059. DC CHARACTERISTICS9.1 Absolute Maximum RatingsPARAMETER RATING UNITPower Supply Voltage to V SS Potential -0.5 to +4.0 V Operating Temperature 0 to +70 °C Storage Temperature-65 to +150 °C D.C. Voltage on Any Pin to Ground Potential -0.5 to V DD +0.5 V V PP Voltage-0.5 to +13 V Transient Voltage (<20 nS) on Any Pin to Ground Potential-1.0 to V DD +0.5VNote: Exposure to conditions beyond those listed under Absolute Maximum Ratings May adversely affect the life and reliabilityof the device.9.2 Programmer interface Mode DC Operating Characteristics(V DD = 3.3V ± 0.3V, V SS = 0V, T A = 0 to 70° C)LIMITSPARAMETER SYM. TEST CONDITIONSMIN.TYP. MAX.UNITPower Supply Current (read)ICC1 In Read or Write mode, all DQs openAddress inputs = 3.0V/0V, at f = 3MHz- 15 20 mAPower Supply Current (erase/ write)ICC2 In Read or Write mode, all DQs openAddress inputs = 3.0V/0V, at f = 3MHz - 35 45mA Input Leakage Current ILIVIN = VSS to VDD- - 90 μA Output Leakage CurrentILO VOUT = VSS to VDD - - 90 μA Input Low Voltage VIL - -0.5- 0.8 V Input High Voltage VIH-2.0 - VDD +0.5 V Output Low Voltage VOL IOL = 2.1 mA - - 0.45 V Output High VoltageVOH IOH = -0.1mA2.4--VW39V080A9.3 LPC interface Mode DC Operating Characteristics(V DD = 3.3V ± 0.3V, V SS= 0V, T A = 0 to 70° C)LIMITS PARAMETER SYM. TESTCONDITIONSMIN. TYP. MAX.UNITPower Supply Current (read) I CC1All I out = 0A, CLK = 33 MHz,in LPC mode operation.- 15 20mAPower Supply Current (erase/write) I CC2All I out = 0A, CLK = 33 MHz,in LPC mode operation.- 35 45 mAStandby Current 1 Isb1 #LFRAME = 0.9 V DD, CLK = 33MHz,all inputs = 0.9 V DD / 0.1 V DDno internal operation- 20 50uAStandby Current 2 Isb2 #LFRAME = 0.1 V DD, CLK = 33MHz,all inputs = 0.9 V DD /0.1 V DDno internal operation.- 3 10mAInput Low Voltage V IL - -0.5-0.3V DD VInput Low Voltage of #INIT V ILI - -0.5-0.2V DD VInput High Voltage V IH - 0.5V DD- V DD +0.5VInput High Voltage of #INIT Pin V IHI - 1.35V-V DD +0.5VOutput Low Voltage V OL I OL = 1.5 mA - - 0.1 V DD VOutput High Voltage V OH I OH = -0.5 mA 0.9 V DD- - V9.4 Power-up TimingPARAMETER SYMBOLTYPICALUNIT Power-up to Read Operation T PU. READ 100 μSPower-up to Write Operation T PU. WRITE 5 mS10. CAPACITANCE(V DD = 3.3V, T A = 25° C, f = 1 MHz)PARAMETER SYMBOLCONDITIONS MAX. UNITI/O Pin Capacitance C I/O V I/O = 0V 12 pfInput Capacitance C IN V IN = 0V 6 pf。

K9F2808U0B-YIB0中文资料

K9F2808U0B-YIB0中文资料

GENERAL DESCRIPTION
The K9F2808X0B is a 16M(16,777,216)x8bit NAND Flash Memory with a spare 512K(524,288)x8bit. The device is offered in 1.8V or 3.3V Vcc. Its NAND cell provides the most cost-effective solution for the solid state mass storage market. A program operation programs the 528-byte page in typical 200µs and an erase operation can be performed in typical 2ms on a 16K-byte block. Data in a page can be read out at 70ns/50ns(K9F2808Q0B:70ns, K9F2808U0B:50ns) cycle time per byte. The I/O pins serve as the ports for address and data input/output as well as command input. The on-chip write control automates all program and erase functions including pulse repetition, where required, and internal verification and margining of data. Even write-intensive systems can take advantage of the K9F2808X0B’ extended reliability of 100K program/erase cycles by providing ECC(Error Correcting Code) with s real time mapping-out algorithm. The K9F2808X0B is suitable for use in data memory of mobile communication system to reduce not only mount area but also power consumption.

各厂家中九接收机芯片IC资料大全(目前最完整的)部分附针脚定义

各厂家中九接收机芯片IC资料大全(目前最完整的)部分附针脚定义

各厂家中九接收机芯片IC资料大全(目前最完整的)部分附针脚定义最新刷机资料点下面的链接最新刷机资料1最新刷机资料24月3日BIN教程工具集中帖刷机教程大全刷机工具大全2.10-3.2刷机bin大全3月3日后刷机bin大全各厂家中九接收机顶盒芯片IC资料大全(目前最完整的),部分附针脚定义。

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品牌产品型号芯片配置海尔2晶10芯IC:HI2023E+1108+5812海尔高清OST-666 2晶6芯IC:M88VS2000+241674K.1+M88TS2020海尔高清OST-666 3晶12芯IC:High032E+His121+M88TS2020海尔3晶10芯(9针接口)IC:HI2023E+1108+5812+ESMTM12L64164A-GNR1T80AB 海尔高清OST-666 2晶6芯IC:Hi2023E+3160+TS2020欧视达ABS-209B 3晶10芯IC:GX3001+GX1121+LW37 欧视达ABS-209B 3晶11芯IC:GX3001+5037+8211欧视达ABS-309B 3晶11芯IC:GX3001+GX1121+MGCE5037欧视达AS-900S 1晶11芯IC:GX6121+25L80+LW37城市之宝BEX868 Y32S-93AT 2晶10芯IC:HTV903F+A VL1108+TS2020通达Y35S-8BAT/Y35S-8CAT 2晶10芯IC:HTV903+A VL1108+5812通达Y30S-01BT 2晶12芯IC:HTV903+A VL1108+2020 皇朝HSR-268 10芯IC:Hi2023+A VL1108+5812小霸王TDX-668E ABS-S1 1晶6芯IC:Hi2023+Hi3102+FT8211+HT1117天地星小霸王TDX-328B 1晶10芯IC:ALi M3328F+5810天地星小霸王TDX-668A (9针接口)IC:HI2023+1108+夏普头天地星小霸王TDX-668B 2晶振IC:HTV903+A VL1108EGA+RDA5812+25L8005天地星小霸王(三星数码王)TDX-668B 单晶6芯.针脚定义①-TXD ②-RXD ③VCC ④-GND ⑤-BL IC:Hi2023E+RDA5812+A VL1108E+MXT8211a+25L8005天地星(原大盒中星九号)3晶IC:Hi2023+1108+5037天地星TDX-668B 2晶10芯IC:Hi2023+A VL1108+5812天地星小霸王TDX-668C 2晶6芯IC:HTV903+A VL1108EGA+RDK5812+25F80小霸王TDX-328B 1晶10芯IC:ALi M3328F+5810小霸王TDX-668B 6芯IC:Hi2023+RDA5812+A VL1108E 小霸王TDX-668B 2晶6芯IC:HTV903+1108+5812小霸王TDX-668E 1晶6芯IC:Hi2023EC+Hi3121+5812 小霸王TDX-668E 2晶6芯IC:HTV903+1108+5812小霰王XC-B298 1晶12芯IC:HTV903-RDA5812-A VL1108 小霸王ABS-1388 2晶10芯针脚定义①-GND ②-RXD ③-TXD ④VCC小霸王ABS-1688 2晶10芯针脚定义①-GND ②-RXD ③-TXD ④VCC IC:Hi2023EC+Hi3122E+5812小霸王GF902 IC:A VL1118a+A V2020+EN25F80索尼高清ABS-S 258 2晶10芯针脚定义①-GND ②-RXD ③-TXD ④VCC IC:Hi2023EC+Hi3122E+5812索尼高清ABS-S 258 2晶10芯针脚定义①-GND ②-RXD ③-TXD ④VCC IC:Hi3102E+Hi2023EC+A V2020太阳红TYH-279ABS/289ABS/299ABS 2晶10芯针脚定义①-GND ②-RXD ③-TXD ④VCC松下科技星TDX-668B1/松下科技星-668EIC:Hi3102E+Hi2023EC+5812松下科技星TDX-668B 2晶6芯IC:HTV903FH42+A VL1108EGA+RGK5812松下科技星668B 2晶6芯Hi2023(E0908)+EVl1108EG2+5812松下科技星-668C 2晶6芯针脚定义①-RX .②-TX .③-GND .④VCC. ⑤-BLIC:A VL1108EG+HTV903F+5812松下科技星668E 2晶6芯IC:HV903+A VL1108E+5812松下科技星/海尔数码/海信数码单双晶6芯IC:Hi2023E+Hi3102(Hi3121)+5812松下科技星TDX-668B 2晶6芯针脚定义①-RXD .②-TXD .③-GND .④VCC. ⑤-BLIC:Hi2023+A VL1108+5812+25L8005松下高清SX168 3晶6芯IC:HTV903F+A VL1108+A V2020 松下数码王P-269A 2晶6芯IC:Hi2023E+Hi3122+A V2020 松下高清OST168 2晶10芯IC:Hi2023E+Hi3121+A V2020 松下科技PS-228 11芯IC:Hi2023+Hi3122+5812松下科技PS-228 2晶6芯IC:M88VS2000+M88TS2020+ES261474K松下科技PS-228 1晶12芯N88VS2000+ES261344K+M88TS2020高频头+T25P80+S163816STS松下科技PS-228 2晶IC:HTV903+1108+2020松下科技PS-228 2晶10芯IC:GX3001+GX1211+5812松下数码王OST-266 10芯(4针)针脚定义①-GND ②-RXD ③-TXD ④VCCIC:Hi2023E+Hi3106+2020松下数码王OST-266 2晶6芯IC:M88VS2000+M88TS2020+261414k+25F80松下数码王OST-266 2晶6芯IC:Hi2023E+Hi3102E+M88TS2020+MXT8211松下高清OST-466 2晶10芯IC:Hi2023e+Hi3121+MBBTS2020+MBDA80CG松下科技星3晶6芯IC:Hi2023+A VL1108+WGCE5037松下科技星.海尔数码.海信数码单双晶+6芯IC:Hi2023E+Hi3102(3121)+5812中星科技单晶14芯IC:Hi2023E+1108+5812+25L8单晶14芯中星科技ZG-N02 12芯IC:GX3001+A V2020中星科技2晶10芯针脚定义①-GND ②-RXD ③-TXD ④VCCIC:Hi2023EC+Hi3102E+5812+M12L64164A中兴科技ABS-S323 2晶10芯IC:Hi2023EC+HI3102E+5812+M12L64164A村村通ABS-S323- 2晶10芯针脚定义①-GND ②-RXD ③-TXD ④VCCIC:Hi2023EC+Hi3122E+5812村村通2晶6芯IC:HN4+0001+5812村村通ZL5188 1晶13芯IC:HTV903+1108+SHARP高频头村村通ZL-5188A 2晶11芯IC:HTV903+A VL1108+RDK5812村村通ZL-5188B 2晶13芯IC:HTV903+A VL1108+RDK5812 村村通ZL-5188B 2晶10芯IC:HTV903+A VL1108EGA+5812村村通ZL5188B 1晶13芯IC:HTV903+A V1108+SHARP6306村村通ZJ-11 IC:HTV903+1108+夏普头S7ZH6306村村通wx-666 3晶10芯IC:GX3001+GX1121+RDK5812村村通ZL-6188 2晶10芯IC:HTV903+A VL1108EGA+5812村村通ZL-6188C 10芯IC:GX3001+GX1121+RDK5812村村通DTH(铁壳) 3晶12芯IC:A VL1108EG+HTV903F+A V2020村村通001 3晶10芯IC:GX3001+GX1121+RDK5812村村通ABS-S GD-1008 3晶10芯IC:Hi2023E+A VL1108E+ZL10037+F16-100HIP村村通ABS-S888AIC:Hi2023EC+Hi3121+ET8211+RDA5812+25X80视美人ABS-S PS-1288 2晶10芯IC:Hi3102E+Hi2023EC+A V2020视美人PS-1288 ICM88VS2000+ES256454K+M88TS2020 视美人2晶10芯IC:Hi2023+3106+A V2020太平鸟HJ321 3晶10芯针脚定义①-GND .②-RXD .③-TXD .④VCCIC:GX3001+GX1121+TS2020太平鸟HJ321 3晶11芯IC:GX3001+GX1121+5812焦点yj5888 2晶10芯IC:HTV903+A VL1108+RDA5812幸运之星YJ5988 2晶10芯IC:HTV903F+A VL1108EGa+A V2020克莱尔HT701 1晶10芯IC:A VL1108EG+HTV903F+M88TS2000中电电子J-6288 ABS-S 3晶12芯IC:GX3001+GX1121+5812小福星3晶11芯针脚定义①-GND .②-(空) .③-RXD .④-TXD ()IC:GX3001+GX1121+5812东仕DIS-2000K 单晶10芯IC:HTV903F+A VL1108E+A V2020Souy Ericsson英文机2晶10芯IC:GX3001+GX1121+A V2020高斯贝尔/歌德威尔ABS-208F 3晶14芯针脚定义①-GND .②-TXD .③-RXD .④VCC .⑤-BL IC:A VL1108EG+Hi2023+5812高斯贝尔ABS-208 1晶14芯(5针).针脚定义①-GND .②-TXD .③-RXD .④VCC .⑤-BL IC:A VL1108EG+Hi2023+5812歌德威尔ABS-208H/高斯贝尔208P 3晶14芯针脚定义①-GND .②-TXD .③-RXD .④VCCIC:M3330E+A VL1108EG+A V2020+M12L64164高斯贝尔ABS-208P/歌德威尔208H 1晶14芯针脚定义①-GND .②-TXD .③-RXD .④VCC .⑤-BL IC:A VL1108EGi+Hi2023+5812高斯贝尔ABS-208P/歌德威尔208H 1晶14芯针脚定义①-GND .②-TXD .③-RXD .④VCCIC:M3330E+A VL1108EG+A V2020+M12L64164A高斯贝尔ABS—208F IC:Hi2023+A VL1108EGA+M88TS2020高斯贝尔ABS—208 2晶14芯IC:HTV903+1108+5812吉祥ABS-208C IC:Hi2023+A VL1108EGa+GST GAIM-18R ABS-STUNER吉祥ABS-2009B 3晶14芯IC:GX3001+GX1121+RDK5812吉祥ABS-2009大铁壳2晶IC:GX3001+GX1121+夏普高频头ABS-2009 2晶12芯IC:HTV903+1108+GAIM-18R歌德威尔ABS-208 3晶6芯IC:D61216GJ+1108+5812歌德威尔ABS-208 3晶14芯(9针接口)IC:M3330+1108+5812高斯贝尔ABS-208 3晶(9针母串口)IC:A VL1108+Hi2023+GAIM-18RIC:D61216GJ100+A VL1108EG+S29AL016D70TF102+ISSI高斯贝尔ABS-208N 铁壳(9针母串口) IC42s16400F高斯贝尔ABS-208 IC:D61216GJ+A V1108+29AL016D+5812高斯贝尔ABS-208S 1晶IC:NECD61216GJ+A VL1108EGa+高频头高斯贝尔ABS-208Q 1晶14芯IC:A VL1108EGA+M3330E+M12L64164A+A V2020ABS-S LX-3688A 1晶12芯IC:GX3001+GX1121+5812现代V4、V5 3晶9芯IC:GX3001+GX1121+5812+EN25D80+HY57V641620ETP-6 集信科技V6铁壳(海尔机芯) 3晶9芯针脚定义①VCC .②-TXD .③-RXD .④-GNDIC:1108EG(Hi3121)+Hi2023+5812.集信科技V4.V6(铁壳) 2晶9芯( B型)针脚定义①VCC .②-RXD .③-TXD .④-GNDIC:0001(GX3001)+HN4F74+5812集信科技V4 .V6(铁壳) 2晶10芯针脚定义①VCC. ②-RXD .③-TXD .④-GNDIC:00001(GX3001)+HN4LSW+S6416AHTA+5812集信科技V4.V6(铁壳)IC:HN4LSW+S6416AHTA-6BZH+EN25F80-1000CP+5812集信科技V4.V6(铁壳)IC:0002P1M43700ta06+5812+EN25F80+TM8211+POL4558 集信科技V4.V5 1晶10芯(A型)针脚定义①VCC .②-RXD .③-TXD .④-GNDIC:0002(GX6121)+5812+M12L64164A艾雷特2晶10芯IC:M88VS2000+ES256454K+M88TS2020艾雷特V5IC:HN4F910931M2EE+0001G1K729-1TA060932+5812艾雷特ALT5812 IC:GX3001+GX1121+5812艾雷特ALT600A 2晶11芯IC:M3330E+A VL108的+夏普高频头艾雷特ALT600A/吉祥ABS-2009 2晶IC:GX3001+GX1121-ES29L160FB+SHARP高频头艾雷特ALT600GIC:HTV903+A VL1108+25L160+ST2020(Y32S-8BAT 081113)艾雷特ALT6812 1晶10芯IC:GX6121+RDA5812+ZB-1A艾雷特ALT6815 1晶10芯IC:GX6121-RDA5812-2B-1A艾雷特ALT7815 3晶10芯IC:GX3001+1121+TS2020艾雷特1000 黑珍珠V4.V5 1晶10芯IC:0002(GX6121)+EEPLDA+5812+M12L64164A艾雷特alt 7812 3晶10芯IC:GX3001+GX1121+5812艾雷特ALT7812 3晶11芯针脚定义①VCC .②-RXD .③-TXD .④-GNDIC:GX3001+GX1121+5812艾雷特ALT600c 2晶10芯IC:GX3001+GX1121+5812艾雷特ALT600c 2晶11芯IC:GX3001+GX1121+5812艾雷特ALT600c 1晶11芯IC:CH216H+A VL1108+C6XS-8CA深圳亿通DVB-V5 10芯IC:HN4N46+EN25F80+G1N540-1TA06+IS42S16400-7T+581亿通电子WS-3688ZL 1晶10芯IC:Hi2023EC+Hi3102E+A V2020中大WS-3688ZJ (铁壳) 1晶10芯针脚定义①-GND .②-RXD .③-TXD .④VCCIC:Hi2023EC+Hi3102E+A V2020中大WS-3688ZJ (铁壳) 2晶10芯IC:Hi2023+A VL1108EG+夏普高频头皇视HSR-208A 2晶10芯IC:Hi2023E+A VL1108EG+A V2020皇视HSR-208B 2晶10芯IC:Hi2023+1108+2020皇视HSR-208B 单晶10芯IC:3330+1108+2020皇视HSR-208B 单晶10芯针脚定义①-GND ②-TXD ③-RXD ④-VCCIC:Hi2023EC+Hi3102+A V2020皇视HSR-2090 2晶11芯IC:Hi2023+1108EGa+夏普头++EN29LV160皇视HSR-210A 单晶6芯IC:Hi2023ec+Hi3122e+A V2020 皇视HSR-260A 铁盒2晶10芯IC:Hi+1108+SHARP夏普头皇视HRS-268 3晶10芯IC:Hi2023EC+Hi3102E+A V2020 皇视HRS-268 2晶10芯IC:Hi2023EC+Hi3121+5812皇视HSR-268 单晶10线IC:HTV903+A VL1108+5812皇视HSR-268 单晶10线IC:Hi2023+Hi3121+A V2020皇视HRS-268 3晶10芯IC:Hi2023EC+A VL1108+5812皇视HSR-260B 3晶10芯IC:Hi2023+1108+2020皇视HSR-260B/索尼高清258 1晶10芯IC:2023E+3121+A V2020皇视HSR-260B 3晶10芯IC:HI2023+1108+5812皇朝HSR-268 10芯IC:Hi2023+A VL1108+5812凯恩斯KES-2066S 6芯针脚定义①-TXD .②-RXD .③VCC .④-GND .⑤-BL IC:Hi3122E+Hi2023ECE+N25F80凯恩斯KES-2077Z 1晶6芯针脚定义①-TXD .②-RXD .③VCC .④-GND .⑤-BL IC:Hi2023EC+3122E+5812凯恩斯2077ABS 2晶10芯IC:M3330+A VL1108+5812凯恩斯2077ABS 2晶10芯IC:Hi2023+1108E+5812+25L800凯恩斯KES-2088S 2晶6芯IC:Hi2023EC+HI3102E+RDA5812凯恩斯KES-2088S 2晶10芯IC:Hi2023EC+HI3102E+RDA5812凯恩斯KES-2088S 2晶6芯针脚定义①-TXD .②-RXD .③VCC .④-GND .⑤-BL IC:Hi2023EC+HI3122E+RDA5812凯恩斯KES-2088Z (5针).针脚定义①-TXD .②-RXD .③VCC .④-GND .⑤-BL IC:Hi2023EC+HI3102E+RDA5812凯恩斯KES-2099S 2晶6芯IC:Hi2023EC+Hi3102E+5812+25L80凯恩斯KES-2188T 3晶10芯IC:Hi2023+1108+5812凯恩斯KES-2188T 3晶12芯IC:Hi2023+1108E+5037凯恩斯KES-2288S 3晶10芯IC:M3330E+A VL1108+RDA5812+M12L64164A凯恩斯KES-2688b 2晶10芯IC:Hi2023e+1108e+5812 凯恩斯KES-2688S 2晶10芯IC:Hi2023e+1108e+5812凯恩斯KES-2788S 3晶10芯IC:Hi2023E+A VL1108EGa+5812凯恩斯KES-2788S 2晶6芯IC:Hi2023EC+Hi3122E+5812凯恩斯KES-5188 11芯IC:HTV903+A VL1108EGA+A V2020凯恩斯KES-5188A铁盒2晶10芯IC:HTV903F+A VL1108+RDK5812+F80+PT8211凯恩斯KES-5188B 2晶13芯IC:HTV903+RDA5812+A VL1108+8211+F80美路3晶13芯IC:Hi2023E+1108+2119美路2晶12芯IC:GX3003+GX1121+5812美路MR-1809 IC:Hi2023E+A VL1108E+高频头MAX2119C 美路MR-5598铁壳3晶12芯IC:GX3003+GX1121+5812 美路MR-5598 3晶12芯针脚定义①VCC. ②-RXD .③-TXD .④-GNDIC:Hi2023E+1108+2119C美路-5798 IC:Hi2023E+1108+2119C美路-5598 IC:Hi2023+1108+GAIM-18R+29lv160ZY 5518A 2晶10芯IC:Hi2023E+3102E+5812万利达ZY-5518A 1晶6芯((5针))IC:Hi2023E+Hi3102E+5812万利达ZY-5518A 2晶10芯IC:CX3001+GX1121+5812万利达ZY-5518A 3晶10芯(9针接口)IC:Hi2023+1108+5812长虹新一代3晶10芯IC:HI2023E+1108E+FL016ALF长虹新一代,海尔数码、海信数码单双晶体6芯IC:HI2023E+3102(3121)+5812长虹数码CH930 3晶12芯IC:HTV903F+1108+A V2020+M80长虹精品TC-6688ABS 2晶10芯IC:HTV903+A VL1108EG+5812长虹精工YJ5978 1晶10芯IC:HTV903F+1108EGa+2000+F80-100+8211长虹KES-2099S 2晶5芯IC:Hi2023+Hi3102E+5812长虹KES 2晶6芯IC:Hi2023+Hi3102+5812长虹CH920 3晶6芯IC:HTV903F+1108EGa+A V2020+25L80航天天信WTD198J 2晶12芯(9针接口)IC:GX3001+GX1121+5812+ES29LV160FB-70TG航天珠江WTD-198J 2晶12芯IC:GX3001+GX1121+5812 航天珠江ABS-209B IC:GX3001+GX1121++WGSE5037航天数码ABS-3809 2晶12芯IC:GX3001+GX1121+5812航天直播HT-168 3晶12芯IC:Hi2023+1108+夏普头航天高清王-HS-166 2晶12芯IC:Hi2023EC+Hi3102E+RDA5812航天高清王HS-169 2晶12芯针脚定义①-GND .②-TX .③-RX .④-VCCIC:Hi2023EC+3122+5812天诚TCD-219ABS 2晶10芯IC:M3330E+A VL1108EGA+5812天诚TCD-299Z 2晶10芯IC:Hi2023+3206+5812天诚TD-299Z 2晶5芯IC:Hi2023+3206+5812天诚TD-2992 2晶6芯IC:Hi3122E+Hi2023E+5812+F80+MXT8211天诚539 2晶10芯IC:HTV903+A V1108+5812天诚519型2晶10芯IC:HTV903+1108E+5812天诚TCD-239ABS 3晶10芯IC:M3330+1108+5812 天诚TCD-239ABS 2晶10芯IC:Hi2023+1108E+5812 天诚TCD-239 2晶10芯IC:M3330E+1108E+5812天诚TCD-299ABS 2晶10芯IC:Hi2023EC+Hi3121+5812天诚TCD-319ABS 3晶10芯IC:Hi2023E0914+A VL1108EGa+RDA5812天诚TCD-319ABS 3晶12芯IC:Hi2302+A VL1108+5037 天诚TCD-369ABS 3晶10芯IC:Hi2023+1108+5812天诚TCD-369ABS 3晶10芯IC:M3330E+1108+5812天诚TCD-369ABS 3晶5芯IC:Hi2023+1108+WCGE5037天诚TCD-509ABS 3晶10芯IC:M3330E-A VL1108EGa-5812天诚TCD-509ABS 10芯(5针)IC:Hi2023+A VL1108+5812+M12L6416A天诚TCD-539ABS 2晶10芯(5针)针脚定义①-RX .②-TX .③VCC .④-GND .⑤-BLIC:M3330E+A VL1108+25L80+5812天诚TCD-579ABS 2晶10芯IC:Hi2023+Hi1108+5812天诚TCD-579ABS 3晶10芯IC:HiM3330+A VL1108EGa+RDA5812天诚TCD-589ABS 3晶10芯IC:Hi2023+1108+5812天诚TCD-689ABS铁壳机2晶12芯(9针接口)IC:Hi2023+A VL1108+夏普头天诚TC-ABS1108A 11芯IC:Hi2023EC+A VL1108+5812 TCD--239ABS 2晶10芯IC:M3330E+A VL1108E+5812 TCD-339ABS 3晶10芯(9针接口) IC:Hi2023+1108+5812TCD-509ABS 3晶10芯IC:Hi2023E0915+A VL1108EGa+RDA5812TCD-509ABS 2晶10芯(5针) IC:Hi2023EC+HI3121+5812TCD-519ABS 2晶10芯IC:Hi2023+A VL1108+5812TCD-599 2晶10芯IC:M3330+A VL1008+5812TCD-219ABS 2晶振10芯针脚定义①-TXD .②-RXD .③-VCC .④-GND .⑤-BLIC:Hi2023EC+Hi3121+5812爱普思DVB-2568 3晶10芯IC:HTV903+1121+2020卓异5518A 3晶10芯IC:Hi2023E+1108+5812卓异5518A(铁壳)3晶11芯IC:Hi2023E+1108+5812卓异5518A(铁壳)2晶11芯(9针接口) IC:Hi2023+1108+夏普独立高频头卓异5518A G 1晶10芯爱百信针脚定义①-GND .②-TXD .③-RXD .④VCCIC:HTV903+A VL1108+5812卓异ZY-5518A G 驰骋天下针脚定义①-GND .②-RXD .③-TXD .④VCCIC:HTV903+A VL1108+5812+F80卓异5518AG 2晶11芯针脚定义①-GND .②-RXD .③-TXD .④VCC ⑤-BL IC:Hi2023E+1108+5812卓异ZY-5518A H 春1晶6芯针脚定义①-GND .②-TXD .③-RXD .④VCCIC:GX3001+5812+25L8005卓异ZY-5518A H 春2晶10芯针脚定义①-GND .②-TXD .③-RXD .④VCC .⑤-BLIC:Hi2023E+HI3121+5812+F25L008A卓异ZY-5518A H 秋针脚定义①-GND .②-RXD .③-TXD .④VCC 升级接口在内部PCB上IC:GX6121+5812+F80卓异ZY-5518A H 秋1晶10芯针脚定义①-GND .②-RXD .③-TXD .④VCC ⑤-BLIC:Hi2023EC+Hi3102E+5812+F80-100卓异ZY-5518A H至尊王牌2晶10芯针脚定义①-GND .②-TXD .③-RXD .④VCCIC:GX3001+GX1121+5812+25L8005卓异ZY-5518A H 财富2晶6 芯针脚定义①-GND .②-TXD .③-RXD .④VCC .⑤-BLIC:芯片掩磨+5812+80L100绿达PS-1288 3晶12芯IC:Hi2023E+ABS090520+M88TS2020绿达PS-1288 2晶12芯IC:Hi2023+Hi3021+A V2020绿达视美人\卓异1晶10芯IC:Hi2023EC+Hi3121+2020 绿达金统帅3晶10芯IC:M3330+1108+5812三星DQ88/DQ66 IC:HTV903F+A VL1108+A V2020三星高清王2晶12芯IC:GX3001+GX1121+5812三星高清DQ88 3晶12芯IC:HTV903F+A VL1108+A V2020 三星数码王TDX668B 2晶6芯针脚定义①-RXD .②-TXD .③-GND .④VCC. ⑤-BLIC:Hi2023+1108+5812三星数码王TDX668B 2晶6芯IC:HTV903F+A VL1108E+5812三星数码王668C 2晶6芯IC:HTV903F+A VL1108E+5812三星数码王TDX668E 1晶6芯IC:Hi2023EC+3102C+5812三星HSR-208C 1晶10芯IC:Hi2023E+Hi3102+MXT8211+A V2020+F25L08pA三星小霸王ABS-S 2009 2晶10芯IC:CX3001+CX1121+5812三星小霸王2900 (9针接口)IC:Hi2023E+A VL1108+MAX2119三星王国-KL6350 1晶11芯IC:HTV903+A VL1108EGa+EDA5812开门红KSP638 2晶10芯IC:HTV903F+A VL1108E+A V2020开门红KSP638 1晶10芯IC:CT216H+A VL1108EGa+A V2020日立创新TDX-668B 2晶6芯针脚定义①-RXD .②-TXD .③-GND .④VCC. ⑤-BLIC:Hi2023+A VL1108+5812志高之星HS166 2晶12芯IC:Hi3102+Hi2023+5812志高之星HS169 2晶12芯IC:Hi2023EC+Hi3012E+RDA5812A+EM638165TS-6G金牛ABS-1108 3晶10芯IC:Hi2023+1108+5812小灵通2晶6线IC:Hi2023+1108+5812福临门ABS-S 3晶9线IC:GX1121+GX3001+5812C60S-93AT 单晶10芯IC:CT216H+A VL1108EGa+A V2020 ABS-2301 单晶10芯针脚定义①-GND.②-TXD.③-RX .④VCCIC:Hi2023EC+Hi3211E+5812+25L8005其乐达CT216 2晶10芯IC:CT216+1108+A V2020科海6228 1晶11芯IC:HTV903+A VL1108EGa+RDa5812+25X16A VSIG科海6228-CT216H 1晶11芯IC:CT216H+1108EGa+M88TS2020科海C623S-91AT 单晶10芯IC:CT210H+A VL1108+2020 科海炫彩6888 IC:HTV903+A VL1108EGa+RDa5812科海2888(小天使)2晶10芯IC:HTV903+A VL1108EGa+RDa5812大旗920 3晶12芯IC:HTV903+A VL1108+A V2020大旗DQ920 3晶12芯IC:GX3001+GX1121+5812+25X16 大旗930 3晶12芯IC:HTV903+A VL1108+A V2020众昌电子ABS--2088 2晶10芯IC:Hi2023+A VL1108+5812众昌电子ABS-2087 2晶10芯IC:M3330+A VL1108+5812 创维S600 3晶IC:M3330E+A VL1108E+5812创维新一代3晶10芯IC:Hi2023E+1108+5037+FL016A 中广通XC-B188 3晶12芯IC:GX3001+GX1121+5812深圳知音ABSTAR KT-2309 3晶10芯IC:Hi2023+A VL1108E+5812知音科技ABSTAR KT1028H 2晶振10芯IC:Hi2023+A VL1108+GST GAIM-18R铁壳ABS-2009 2晶11芯IC:Hi2023+1108+夏普头王牌数码OST-366 2晶6芯针脚定义①-GND ②-RXD .③-TXD .④VCCIC:Hi3102+Hi2023EC+A V2020王牌数码王GM-ABS1108A 2晶10芯针脚定义①-GND .②-TXD .③-RXD .④VCCIC:GX3001+GX1121+5812+25L8005王牌数码王GM-ABS1108A 10芯IC:Hi2023+A VL1108+5812JIXIANG ABS-208 2晶14芯(9针接口)IC:Hi2023+1108+GST GAIM-18R ABS TUNER 夏普头JIXIANG-ABS208 2晶IC:D6121+1108+GST高频头East Star 2晶10芯IC:M3330-1108-GST GAIM-18R高频头小福星abs 2008 3晶12芯IC:GX3001+GX1211+5812通达C60S-93AT/C62S-91AT 1晶10芯IC:CT216H+A VL1108E+2020威特斯ZL-5188A 2晶13芯IC:HTV903+A VL1108+RDK5812威特斯ZL-5188B 2晶11芯IC:GX3001+GX1121+5812迷你星3晶13芯IC:GX3001+GX1121+5812+F16-100HIP高星HS-312 3晶12芯IC:GX3001+GX1121+5812北大高科3晶9芯IC:GX3001+GX1211+5812思达科ABS-S 801型2晶10芯IC:GX3001+GX1121+5810思达科ABS-S 802G 2晶10芯IC:GX3001+GX1211+5812思达科ABS-S 803A 1晶10芯IC:A VL1118+A V2020+25D80V思达科ABS-S 803G IC:GX3001+GX1211+5812思达科ABS-S 806H IC:GX3001+GX1211+5812思达科ABS-S 806H IC:A VL1118+A V2020+DSD4M16G思达科ABS-S 806H IC:HN4J7G+G2A954+5812+25X80思达科ABS-S807 1晶5芯IC:A VL1118a+A V2020+806H金霸王JBW-6688 2晶11芯IC:HTV903F+A VL1108EGa+A V2020+8211金霸王JBW-6688 IC:GX3001+GX1211+5812阿德尔ADE-168 IC:HY903+A VL1108EG+A V2020阿德尔ADE131金刚IC:HTV903F+A VL1108E+M88TS2020 海西小霸王TD299Z 2晶6芯IC:Hi2023E+Hi3122+5812 同洲CY-668S 1晶12芯IC:HM1512+1108+5812喜旺ABS5398 IC:Hi2023+1108E+MAX2119C喜旺ABS-5798 12芯IC:GX3001+GX1211+5812喜旺ABS-3809 2晶12芯IC:GX3001+GX1121+RDA5812希旺598 2晶12芯(9针接口) IC:Hi2023+1108+SHRP 高频头彩虹视霸CY84 1晶10芯IC:HTV903F+A VL1108+M88TS2020彩虹视霸A10S-9AAT 1晶10芯IC:A VL1118+SM42S16400B1-7+F80九洲村村通DVS-398F IC:CT216H+ALV1108+SHRP高频头金星ABS-208 1晶14芯IC:Hi2023+A VL1108+铁壳高频头威克2晶6芯(5针) IC:HTV903+1108+5812华尔HR731A1 3晶12芯IC:CX3001+CX1121+SHARP高频头爱普斯3晶9芯IC:HTV903+A V2020+A VL1108EG爱普斯2568 3晶10芯IC:HTV903+A V2020+A VL1108EG 爱普斯IC:GX3001+GX1211+A V2020+2J10X未来视佳ADEI88 3晶9芯IC:HTV903F+A V2020+A VL1108EG黑金刚TRT006 1晶10芯IC:A VL1118+A V2020+4558+F80-100DX-668 2晶10芯针脚定义①-RXD .②-TXD .③VCC .④-GND .⑤-BLIC:Hi2023EC_Hi3102E+5812+F80-100傲天海-吉祥2晶12芯针脚定义①-GND ②-RXD ③-TXD ④VCCIC:GX3001+GX1121+RDA5812高频头+P8075火星漫步LJ6008 1晶10芯IC:HTV903F+A VL1108+M88TS2020+F80-100王牌新一代TD-299Z针脚定义①- . ②-TXD .③-RXD .④-GND ⑤-IC:Hi2023E+Hi3122+5812王牌HJ360 3晶10芯IC:GX1120+GX3001+TS2020TVWALKER ABS-2008 1晶6芯IC:D61216GJ+1108E+SHARP头吉祥988 (ZJ-111) 1晶11芯IC:HTV903 +1108+高频头北京北电科林3晶12芯IC:Hi2023+A VL1108EGa+SHARP高频头家家福BEX811 1晶10芯IC:24645K2+M88VS2000+M88TS2020家家福ADE158 IC:HTV903+A VL1108+M88TS2020华星科技2晶IC:Hi2023+A VL1108+5812亚视达ABR-S(H11) 2晶10芯IC:HTV903+1108E+A V2020HSTAR 3晶10芯IC:Hi2023+A VL1108EGa+M88IS2020长江电讯ABS-2008型铁壳(9针接口)IC:D61216GJ+A VL1108EG+夏普头全家福3晶IC:Hi2023E+A VL1108EG+M88TS2020 畅想BEX818 1晶10芯IC:HTV903+A VL1108+A V2020 必佳GF-901 2晶10芯针脚定义①-GND .②-RXD .③-TXD .④VCCIC:HTV903+1108+A V2020KSP600G 飓风(华亚) 2晶10芯针脚定义①-GND ②-TXD ③-RXD ④VCCIC:HTV903+1108+M88TS2020+25D80万家乐TB002 (5针)IC:Hi2023EC+Hi3102E+M88TS2020+25X80A V万家乐2晶6芯IC:M3330+ALi1108+5812+F80-75奥伟科技ABS-800 3晶(9针接口)IC:GX3001+GX1121+5812奥伟科技ABS-900E 2晶12芯IC:CT216+A VL1108+独立高频头GAIR-08R天眼HSTER3晶10芯IC:Hi2023E+A VL1108+5812飞翔ADE351 2晶10芯IC:HTV903F+A VL1108EG+M88TS2000星视通XC-B268 1晶10芯IC:HTV903+A VL1108+5812星视通XC-C268 1晶11芯IC:HTV903 A VL1108 5812奥维科技ABS-600 3晶12芯IC:GX3001+GX1121+A V2020 超的个人论坛转载分享本资源。

合康变频中低压选型样本

合康变频中低压选型样本
应用领域
风机、水泵/水泥、陶瓷、玻璃生产线全线;
中央空调节能改造/空压机节能改造;
市政锅炉、污水处理;
部分拉丝机牵引;
矿井中的带式输送机、刮板运输机、给煤机、机油泵、油田的潜油电泵等;
......
叠层母排
HICONICS DRIVE TECHNOLOGY (WUHAN) CO.,LTD. 3.
绿色科技 造福人类
HICONICS DRIVE TECHNOLOGY (WUHAN) CO.,LTD.
卓尔不凡 超越无止境
该样本已经过认真的校对,但是仍然不能保证存在错漏之处,用户一旦发现请立即与合康变频科技(武汉)有限公司联系; 2wwHIwC.OhiNcIoC合nSic康Ds变.RcIo频VmE科T技E(CH武N汉OL)O有G限Y 公(W司U的HA目N标) C是O不.,L断TD追. 求科技进步,公司保留对该样本的修改权利,因此,样本中的部分内容可能会与实际产品稍有不同;
公司主导产品合康 HID 系列中、低压变频器均拥有自主 知识产权,已获得多项发明专利和实用新型专利。公司在能 量回馈 / 矢量控制技术、同步变频技术和大功率变频技术等方 面在国内居领先地位。产品广泛应用于火力发电、冶金、钢铁、 采油、矿山、建材、制药、纺织、化工、造纸、塑胶、机床、 起重、拉丝机、城市供水等行业和领域,主要对各类负载进 行调速、软启动和智能控制,不仅能提升工况效率,更具有 显著的节能效果,其不但能够极大提高客户产品的性能、工艺、 效率,更能为客户降低成本,有效提升客户核心价值。
6个数字输入端子,可扩展至10路,多达40种自定义功能,可兼容有源PNP输入或NPN输入;其中一路可 做高频脉冲输入(0~50kHz);2个模拟输入端子,可接收电压信号(0~10V)或电流信号(0~20mA); 可扩展至3路 0.4~1.5kW机型无扩展功能

at89c1051中文资料

at89c1051中文资料
电子器件采购平台: IC资料查询网站: 电子工程技术论坛:/bbs










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SWIT Electronics Co., Ltd. S-1093H 9英寸全高清广播液晶显示器用户

SWIT Electronics Co., Ltd. S-1093H 9英寸全高清广播液晶显示器用户

Model: S-1093H9” Full HD Broadcast LCD MonitorUser ManualVer :A.2SWIT Electronics Co., Ltd.Please read this User Manual throughout before using.Preface1. All internal technologies of this product are protected, including device, software and trademark.Reproduction in whole or in part without written permission is prohibited.2. All brands and trademarks of SWIT Electronics Co., Ltd. are protected and other relativetrademarks in this user manual are the property of their respective owners.3. Due to constant effort of product development, SWIT reserves the right to make changes andimprovements to the product described in this manual without prior notice.4. The warranty period of this product is 2 years, and does not cover the following:(1) Physical damage to the surface of the products, including scratches, cracks or other damage tothe LCD screen or other externally exposed parts;(2) The LCD dot defects are not over three;(3) Any damage caused by using third-party power adaptors;(4) Any damage or breakdown caused by use, maintenance or storage not according to the usermanual.(5) The product is disassembled by anyone other than an authorized service center.(6) Any damage or breakdown not caused by the product design, workmanship, or manufacturingquality, etc.*Any sales personnel have no rights to provide additional warranty.5. For any suggestions and requirements on this product, please contact us through phone, fax,Email, etc.SWIT Electronics Co., Ltd.Address: 10 Hengtong Road, Nanjing Economic and Technological Development Zone,Nanjing 210038, P.R.ChinaPhone: +86-25-85805753Fax: +86-25-85805296Email:***************MaintenanceWarning1. In order to reduce the risk of fire and electrical shock, do not lay this product in rain ordamp places.2. Please keep away from the strong magnetic field; it may cause the noise of the videoand audio signals.The power1. Please use the power adapter provided or recommended by the manufacturer in order toavoid damage.2. For a third party power adapter, please make sure the voltage range, supplied power,and polarity of power lead are fit.3. Please disconnect the power cable under the following situations:(A). If you do not operate this monitor for a period of time;(B). If the power cable or power adaptor is damaged;(C). If the monitor housing is broken.The monitor1. Please don't touch the screen with your fingers, which would probably deface the screen.2. Please don't press the screen; the LCD is extremely exquisite and flimsy.3. Please don't lay this product on unstable place.Cleaning1. Please clean the screen with dry and downy cloth or special LCD cleanser.2. Please do not press hard when cleaning the screen.3. Please do not use water or other chemical cleanser to clean the screen.The chemical may damage the LCD.ContentsPreface ................................................................................................................................................................... 2 Maintenance ......................................................................................................................................................... 3 Contents ................................................................................................................................................................ 4 Installation Dimension ......................................................................................................................................... 5 Operation Instructions .. (6).Front Panel .................................................................................................................................................. 6 .OSD .............................................................................................................................................................. 7 .Back Panel ................................................................................................................................................... 9 Main Menu ........................................................................................................................................................... 10 Optional Battery Plate ..................................................................................................................................... 16 Specification ........................................................................................................................................................ 18 Trouble-shooting . (19)Packing listIntroductionS-1093H adopts IPS LCD panel, with resolution 1920×1200 and wide viewing angle H170°⁄ V170°. It supports 2 x 3GSDI (Level A/B ), 1 x HDMI, 1 x CVBS and 1 x analog audio input. It also supports 2 x 3GSDI, 1 x HDMI, 1 x CVBS and 1 x analog audio loop through output.Features:⏹ Support multiple Aspect Ratio and scan modes ⏹ Support multiple Marker selection (Marker, Safety Area)⏹ Support multiple functions user-defined (Source ID, function keys, GPI) ⏹ Multiple power supply methods to meet different requirements ⏹ TSL UMD (RS485)Tally, GPI control ⏹ USB firmware upgrade ⏹ Support 2KInstallation DimensionThe main body (in mm)Operation Instructions·Front Panel⑴Speaker: For SDI/HDMI embedded audio and analog audio monitoring. (Will not work if earphone is plugged in)⑵ ButtonSOURCE: Press “SOURCE” to select SDI1, SDI2, HDMI, and CVBS signal input.F1~F5: User definable function keys. Please see details in “4. Function key” under “Main Menu”.AUDIOBAR: Press “AUDIOBAR” to switch on/off audio bar.DISPLAY: Press “DISPLAY” to turn on or turn off relevant status information, audio and video waveform. When main menu is activated, press “DISPLAY” to quit menu.⑶ Rotary KnobMENU/ENTER: When the menu is inactivated, presses “MENU/ENTE” to turn on the main menu; Revolve “MENU/ENTER” to adjust settings or parameters, and press to apply;When the menu is inactivated, revolve “MENU/ENTER” to adjust sound volume. BRIGHT: 0-100 value adjustment and the default value is 50.CONTRAST: 0-100 value adjustment and the default value is 50SATURATION: 0-100 value adjustment and the default value is 50⑷ POWER: Power on/off⑸TALLY Light: Red, Green and Yellow 3-color TALLY indicator·OSD⑴ Time code(SDI)Under SDI input, it can display Time code. If no Time code information is detected, it will be displayed as “TC: UNLOCKED”.User can set function keys F1~F5 or GPI pins as “Time code” to turn on or off this function.⑵ UMDSet up the UMD under ‘UMD” submenu.⑶ AFD (SDI)User can set function keys F1~F5 or GPI pins as “AFD” to turn on or off this function. If no relevant information is detected, it will be displayed as “AFD: UNLOCKED”.⑷ Audio BarMonitor the audio information. User can set function keys F1~F5 or GPI pins as “Audio” to turn on or off this function.The relevant parameters like position, audio channels and blending, etc can be changed under “Audio” submenu.Introduction of audio and video functions◆2-ch embedded audio metersUnder 3G/HD/SD SDI, HDMI and CVBS, it displays 2 channels embedded audio meters. The audio meter is green, and will turn yellow when audio exceeds -20dB, and turn red when audio exceeds -9dB.◆Audio alarmIf the embedded audio value is too low or no embedded audio, it will display “MUTE” or “UNLOCKED” in the audio bar.◆Time code (SDI)Under SDI input, it can display the SMPTE time code (VITC1, VITC2 or LTC) on the top of the screen, which is used extensively for synchronization, and for logging and identifying material in recorded media. If no Time code information is detected, it will be displayed as “UNLOCKED”.◆Internal Color BarUnder SDI and HDMI input, it has 100% internal color bar which helps to analyze the monitor color and adjust the display parameter.User can set function Keys F1~F5 or GPI pins as “color bar” to turn on or off this function.◆Peaking focus assist (red/blue switch)The Peaking focus assist function is to mark the sharpest edges of the image with red or blue color under SDI and HDMI input, for users to check if the subjects are focused.User can set function Keys F1~F5 or GPI pins as “Focus Assist” to turn on or off this function.◆Zebra stripesZebra Stripes are used to check if the image is over exposed or not by showing black and white lines on the monitor. It is considered over exposed when luminance value exceeds 90%.User can set function Keys F1~F5 or GPI pins as “Zebra” to turn on or off this function.◆Freeze FrameThe freeze frame is to capture and display the current broadcast frame.User can set function Keys F1~F5 or GPI pins as “Freeze Frame” to turn on or off this function.◆R/G/B/MonoR/G/B/Mono is to display only the blue/red/green primary signal or the luminance signal only so as to monitor the image noise.User can set function Keys F1~F5 or GPI pins as “R/G/B/Mono” to turn on or off this function.◆False ColorThe false color is used to aid in the setting of camera exposure. Under false color mode, there’s a color chart on the bottom of screen for reference. The color from the dark to the bright will be displayed as blue, cyan, green, yellow, orange and red in a consecutive way. User can set function Keys F1~F5 or GPI pins as “False color” to turn on or off this function.◆AFD (SDI)It is the abbreviation of active format description. AFD is to display the SDI embedded AFD information graphically on the screen.◆H/V Delay (SDI)Under SDI input, H/V Delay can be used to display line/field blanking signal, and to observe the horizontal and vertical synchronous signal.◆UMDWhen using external control unit, it can display the video source ID and tally information on the screen.◆Image FlipHorizontal, vertical, horizontal and vertical two-way image flip function.·Back Panel⑴TALLY Light: Red, Green and Yellow 3-color TALLY indicator⑵DC 12V IN: Connect with DC12V 4-pin XLR power adapter, support 6.5V-24V voltage input(Pin 1: Negative, Pin 4: Positive)⑶Battery mount connectorConnect with SWIT S-7004 series quick release battery plate, and then mount corresponding V-mount or DV batteries. See details in “Optional Battery Plate”.⑷ Audio SocketAUDIO IN: 3.5mm analog audio input (CVBS)AUDIO OUT: 3.5mm audio output, to monitor SDI embedded audio, HDMI and analog audio output ⑸ Multi-function SocketGPI: TSL UMD&GPI control socketUSB Socket⑹Video Signal InterfaceSDI-IN1: SDI input (BNC connector)SDI-LOOP1: SDI loop through output from SDI-IN1 (BNC connector)SDI-IN2: SDI input (BNC connector)SDI-LOOP2: SDI loop through output from SDI-IN2 (BNC connector)CVBS-IN: CVBS input (BNC connector)CVBS-OUT: CVBS output (BNC connector)HDMI-IN: HDMI input (HDMI-A connector)HDMI-OUT: HDMI loop through output from HDMI-IN (HDMI-A connector)Main MenuS-1093H has OSD to adjust the parameters and settings, for example: Picture, color temp., function keys, etc.1. Press “MENU/ENTER” button, the main menu will popup from the left top of the screen. Theselected main menu highlights in yellow.2. Revolve “MENU/ENTER” to select submenu, the selected submenu highlights in yellow, press“MENU/ENTER” to apply and enter into the selected submenu’s items.3. Revolve “MENU/ENTER” to select the item which needed to adjust, press “MENU/ENTER”, the selected item and its parameters will be highlighted in yellow.4. Revolve “MENU/ENTER” to change the selected item’s parameter, press “MENU/ENTER” to apply and save the settings.5. Revolve “MENU/ENTER” to select “Exit”, press “MENU/ENTER” to quit submenu. Select “Exit & Status” under the Main Menu and press to quit Main Menu.Notice:*The items in gray can not be set up.*If there is no operation under the setted time, the menu will automatically save settings and quit.*If the key inhabit function is turned on, except key inhibit function, all other items are in grey. Please turn off the key inhibit function to adjust the items.Submenu introduction(the default values are marked with underline )1. Exit & StatusDisplays the current status, the details are as down below:*1 Display the current video signal and format*2 Display the current function keys setup2. PictureTo adjust picture parameters.3. Color TempTo select different color temperature or setup user-defined color parameters.* Only “Color Temp” is set to “User”, the Red/Blue/Green Gain or Red/Blue/Green Bias can be adjusted.4. Function keyTo define the F1~F5 function keys.*1 Function keys F1-F5 can be setted as the down below functions:Time code, Zebra, Audio Bar, false Color, AFD, H/V Delay, R/G/B/Mono, Marker , Color Bar, UMD, Audio Alarm, Focus Assist , Aspect Ratio, Scan Mode, Zoom Mode, Mute, Freeze Frame, Image Flip, CVBS,HDMI, SDI1,SDI2, color temp.For example: Set F3 to “R/G/B/Mono” under “Function key” submenu. User can press F3 on the front panel to adjust the parameters of “R/G/B/Mono”, and the “R/G/B/Mono” will change and follow the sequence: Blue Only →Red Only →Green Only →Mono →Off.5. GPIUser can set GPI pins1~4 to relevant functions to turn on or off this function.*1 When “GPI control” is set to “On”, the monitor can be operated through external GPI control unit.*2 The GPI pins can be setted to the down below functions:Red Tally, Green Tally, Yellow Tally, Aspect Ratio, Scan Mode, Zoom Mode, Mute, Freeze Frame, Image Flip, Color Temp, Time Code, Zebra, Audio Bar, False Color, AFD, H/V Delay, R/G/B/Mono, Marker, Color Bar, UMD, Audio Alarm, Focus Assist.When connecting the GPI pin with ground, the setted function will be turned on, and goes out when disconnecting.Example 1: Under “GPI ” submenu, set “GPI control” to “On”, set “2 Pin” to “Red Tally”, when the pin 2 of the extenal GPI control unit is connected with ground, the Tally light on the front panel will turn red. When disconnected, the tally light will turn off.Example 2: Under “GPI ” submenu, set “GPI control” to “On”, set “3 Pin” to “Scan Mode”, when the pin 6 of the extenal GPI control unit is connected with ground, the Scan mode will change and follow the sequence: “Normal” →”Overscan”→”Native” .6. UMDSupport “TSL UMD Protocol-V4.0” provided by Television System LTDSetup Source ID:Select “Source ID”, revolve “MENU/ENTER” to select the letters and press “MENU/ENTER" toinput. Max 8 letters are supported. Select “Exit” to quit and savesettings, the source ID will be displayed on top or bottom of thescreen.UMD setup:⑴Connect the external control equipment with S-1093H;⑵Set “Display Type” to “UMD” under UMD submenu;⑶Make sure the “address”, “Baud Rate”, “Parity” the same;⑷Adjust the external control equipment and send UMDcommand, the UMD information will be display as theright photo.User can set the character and color of the UMD and the color of Tally1 and Tally2.Please see “5. GPI” to check the”RS485 pin sequence and definition.7. Marker*1 When “Fit Marker” is “Off”, the size of safety area is benchmarked against the actual display screen, accounting for 80% ~ 95% of actual display screen. When “Fit Marker” is “On”, the size of safety area is benchmarked against the area inside the scales marker, accounting for 80% ~ 95% of the area inside the scales marker.Example:Aspect ratio: 4:3 Aspect ratio: 4:3Safety Area: 85% Safety Area: 85%Center Marker: On Center Marker: OffFit Marker: Off Fit Marker: On8. Audio*1 When “Bar Frame” is set to “Off”, only the audio meter will be displayed.When “Bar Frame” is set to “On”, frame and real-time audio value will be displayed.*2 When “Audio Alarm” is set to “On”, if no embedded audio is detected, the audio bar will display “UNLOCKED”. If the audio value is too low, the audio bar will display “MUTE”.*3 Only under SDI I signal, channel1-2 can be selected.In audio bar, the left channel audio value is marked with green and right channel audio value is marked with red.9. Display10. System*1 Source ScanWhen set to “ON”, after turn on the monitor, the signal will be inspected and follow the sequence of “SDI1→SDI2→HDMI→CVBS”.For example: if channel is selected to SDI2, SDI-IN2 has no input, and CVBS has input. When turn on the monitor, after automatic inspection, SDI2 has no recognized signal, and CVBS has recognized signal, then the input signal will be CVBS.When set to “Off”, source scan will not be supported.*2 LogoWhen powered on, the screen will display SWIT logo.*3、*4 Update Driver/ Kernel⑴Power the monitor, insert the USB equipment with update software into the USB socket.⑵Press “MENU” to open the main menu, and revolve to “system” submenu,⑶ Set “Update Driver” and “Update Kernel” to “Yes” under “System” Submenu, press“MENU/ENTER” to apply.⑷During the update procedure, please do not power off to make sure the software writing hasbeen successfully completed.⑸After upgrading, the monitor will auto restart.11.OSD12. Key InhibitIf the “Key Inhibit” is “On”, there is no response when all the buttons expert ” MENU/ENTER” are pressed, the sreen will be displayed as ” Key Inhibit”.User can set “Key Inhibit” under “key Inhibit” submenu to “Off” to recover the functions of all buttons.Optional Battery Plate1. Battery Mount choiceS-1093H monitor can use V-mount, Gold mount and various DV batteries by connecting with SWIT S-7004 series battery plates. There’re following types of S-7004 for choice:Model Compatible battery type Recommended SWIT batteryS-7004F SONY L series NP-F770/970S-8972, S-8970, S-8770S-7004U SONY BP-U series U60/30S-8U63S-8D62, S-8D58S-7004D Panasonic CGA-D54/D28 andVW-VBD58S-7004B Panasonic VW-VBG6S-8BG6S-7004J JVCBN-V428U S-8428BN-VF823 S-8823S-7004V JVCSSL-JVC50 S-8I50S-7004I JVCS-7004C Canon BP series BP-930/945/970G S-8945, S-8845S-7004E Canon DSLR, LP-E6S-8PE6S-7004S SONY V-mount batteries S-8080S, S-8110S, S-8160S.etcS-7004A Anton Bauer Gold mount batteries S-8080A, S-8110A, S-8160A.etc2. Installation of S-7004F/D/J/C/U/E/B/V/I snap-on type DV battery plate:S-7004F/D/J/C/U/E/B/V/I DV plate is snap-on type, quick release and interchangeable. Please follow the instructions to install:(1) Please make sure the power terminals are clean and in well condition before use.(2) Align the S-7004 DV plates slots to the bolts of the monitor rear panel, and press tightly in.(3) Fix the S-7004 DV plates by provided screws on the top side.(4) Mount the corresponding battery to S-7004 DV plate to power the monitor.(5) To release the battery, press the battery release button to take out the battery ··Installation of S-7004A/S Gold mount / V-mount battery plateTo use Gold mount or V-mount battery, please install the S-7004A/S plate as followinginstructions:(1) Please make sure the power terminals are clean and in well condition before use.(2) Connect the wire of S-7004A/S to the 2-pin DC socket.(3) Align the S-7004A/S screw holes to the bolts of the monitor rear panel.(S-7004A Gold mount plate need a spare bedding between the monitor and plate)(4) Fix the S-7004A/S mount by provided screws.(5) Mount Gold mount / V-mount battery to S-7004A/S to power the monitor.(6) Press the battery release to take down the batterySpecificationLCD PerformanceSize 9inch Display area 191.5×119.7 mmResolution 1920×RGB×1200Color 8bit Aspect ratio 16:9∕4:3Brightness 450cd∕㎡Contrast 1000:1 Viewing Angle Horizontal: 170°Vertical: 170° Input/outputInpu t BNC×2 3G/HD/SD-SDI×2 BNC×1 CVBSinput HDMI×1 HDMIinputGPI×1 UMD,GPI×1USB×13.5mm×1 analog audio inputOut put BNC×23G/HD/SD-SDI loop through output BNC×1 CVBS loop through outputHDMI×1HDMI loop through output3.5mm×1SDI/HDMI/analog audio outputVideo FormatCVBS NTSC/PALHDMI 480i/576i/480p/576p1080i(60/59.94/50)720p(60/59.94/50)1080p(60/59.94/50/30/29.97/25/24/23.98)1080psf(30/29.97/25/24/23.98)SDI SMPTE-425M-A/B 1080p(60/59.94/50)SMPTE-274M1080i(60/59.94/50)1080p(30/29.97/25/24/23.98)SMPTE-RP211 1080psf(30/29.97/25/24/23.98)SMPTE-296M 720p(60/59.94/50)SMPTE-125M 480i(59.94)ITU-R BT.656 576i(50)SMPTE-2048-22048×1080p(23.98/24/25/29.97/30/50/59.94/60)2048×1080i(50/59.94/60)GeneralInput voltage DC 6.5V-24V Power consumption 18WWorking temperature 0℃~+40℃Working humidity 10%~90% Storage temperature ﹣15℃~﹢60℃Storage humidity 10%~90% Dimensions 241×178×50mm Net weight (main body)960gTrouble-shootingSymptom Possible Causes SolutionNo display The power is not turned onPlease check if the power isconnected, and thenpress ”POWER” button to turn onthe monitorUnstable power voltage Reconnect to power supply BNC or HDMI cable loosecontact or not correctlyconnectedCheck and correctly connect theBNC or HDMI cableThe attached battery is nopowerChange batteryUsing DIY power supply butthe polarity is reversedRefer to the provided power supply,reconnect the power.Image or color abnormalBad contact of BNC or HDMIcableChange cableVideo signal has Interference Remove the interference source(s) Improper adjustment of thecolor parametersAdjust the “Recall profile” to“Default” under “System” submenu Distortion of the image Reset the Aspect ratioSet to Red/Green/Blue only orMonoTurn the Blue only/ Red Only/Green Only/Mono off underR/G/B/Mono submenuTurn on the “Focus Assist”functionTurn off the “Focus Assist” function Turn on the “False Color”functionTurn off the “False Color” functionNo audio outputSet to MuteTurn off MUTE or revolve“MENU/ENTER” to adjust thevolumeBad contact of signal cable Change signal cableWrong connection or badcontact of Audio cableConnect to the correct input socket.。

X9C503中文资料

X9C503中文资料

1©Xicor, Inc. 1994, 1995 Patents Pending Characteristics subject to change without notice3863-2.4 9/18/96 T2/C0/D0 SHDESCRIPTIONThe Xicor X9C102/103/104/503 is a solid state nonvola-tile potentiometer and is ideal for digitally controlledresistance trimming.The X9C102/103/104/503 is a resistor array composed of 99 resistive elements. Between each element and at either end are tap points accessible to the wiper element.The position of the wiper element is controlled by the CS ,U/D , and INC inputs. The position of the wiper can be stored in nonvolatile memory and then be recalled upon a subsequent power-up operation.The resolution of the X9C102/103/104/503 is equal to the maximum resistance value divided by 99. As an example, for the X9C503 (50K Ω) each tap point repre-sents 505Ω.All Xicor nonvolatile memories are designed and tested for applications requiring extended endurance and data retention.FEATURES•Compatible with X9102/103/104/503•Low Power CMOS —V CC = 5V—Active Current, 3mA Max —Standby Current, 500µA Max •99 Resistive Elements—Temperature Compensated—± 20% End to End Resistance Range •100 Wiper Tap Points—Wiper Positioned via Three-Wire Interface —Similar to TTL Up/Down Counter —Wiper Position Stored in Nonvolatile Memory and Recalled on Power-Up•100 Year Wiper Position Data Retention •X9C102 = 1K Ω•X9C103 = 10K Ω•X9C503 = 50K Ω•X9C104 = 100K ΩE 2POT ™ Nonvolatile Digital PotentiometerX9C102/103/104/503E 2POT ™ is a trademark of Xicor, Inc.3863 FHD F01FUNCTIONAL DIAGRAML WHVX9C102/103/104/5032PIN DESCRIPTIONS V H and V LThe high (V H ) and low (V L ) terminals of the X9C102/103/104/503 are equivalent to the fixed terminals of a mechanical potentiometer. The minimum voltage is –5V and the maximum is +5V. It should be noted that the terminology of V L and V H references the relative position of the terminal in relation to wiper movement direction selected by the U/D input and not the voltage potential on the terminal.V WV W is the wiper terminal, equivalent to the movable terminal of a mechanical potentiometer. The position of the wiper within the array is determined by the control inputs. The wiper terminal series resistance is typically 40Ω.Up/Down (U/D )The U/D input controls the direction of the wiper movement and whether the counter is incremented or decremented.Increment (INC )The INC input is negative-edge triggered. Toggling INC will move the wiper and either increment or decrement the counter in the direction indicated by the logic level on the U/D input.Chip Select (CS )The device is selected when the CS input is LOW. The current counter value is stored in nonvolatile memory when CS is returned HIGH while the INC input is also HIGH. After the store operation is complete the X9C102/103/104/503 will be placed in the low power standby mode until the device is selected once again.PIN CONFIGURATIONPIN NAMESSymbol Description V HHigh Terminal V W Wiper Terminal V L Low Terminal V SS GroundV CC Supply Voltage U/D Up/Down Input INC Increment Input CS Chip Select Input NCNo Connect3863 PGM T01V CC CS V L V W3863 FHD F02.2INC U/D V H V SS12348765X9C102/103/104/503DIP/SOICX9C102/103/104/5033DEVICE OPERATIONThere are three sections of the X9C102/103/104/503:the input control, counter and decode section; the non-volatile memory; and the resistor array. The input control section operates just like an up/down counter. The output of this counter is decoded to turn on a single electronic switch connecting a point on the resistor array to the wiper output. Under the proper conditions the contents of the counter can be stored in nonvolatile memory and retained for future use. The resistor array is comprised of 99 individual resistors connected in series. At either end of the array and between each resistor is an electronic switch that transfers the potential at that point to the wiper.The INC , U/D and CS inputs control the movement of the wiper along the resistor array. With CS set LOW the X9C102/103/104/503 is selected and enabled to respond to the U/D and INC inputs. HIGH to LOW transitions on INC will increment or decrement (depending on the state of the U/D input) a seven-bit counter. The output of this counter is decoded to select one of one-hundred wiper positions along the resistive array.The wiper, when at either fixed terminal, acts like its mechanical equivalent and does not move beyond the last position. That is, the counter does not wrap around when clocked to either extreme.The value of the counter is stored in nonvolatile memory whenever CS transistions HIGH while the INC input is also HIGH.When the X9C102/103/104/503 is powered-down, the last counter position stored will be maintained in the nonvolatile memory. When power is restored, the con-tents of the memory are recalled and the counter is reset to the value last stored.OPERATION NOTESThe system may select the X9C102/103/104/503, move the wiper, and deselect the device without having to store the latest wiper, position in nonvolatile memory.The wiper movement is performed as described above;once the new position is reached, the system would the keep INC LOW while taking CS HIGH. The new wiper position would be maintained until changed by the system or until a power-down/up cycle recalled the previously stored data.This would allow the system to always power-up to a preset value stored in nonvolatile memory; then during system operation minor adjustments could be made.The adjustments might be based on user preference:system parameter changes due to temperature drift,etc...The state of U/D may be changed while CS remains LOW. This allows the host system to enable the X9C102/103/104/503 and then move the wiper up and down until the proper trim is attained.T IW /R TOTALThe electronic switches on the X9C102/103/104/503operate in a “make before break” mode when the wiper changes tap positions. If the wiper is moved several positions, multiple taps are connected to the wiper for t IW (INC to V W change). The R TOTAL value for the device can temporarily be reduced by a significant amount if the wiper is moved several positions.R TOTAL with V CC RemovedThe end to end resistance of the array will fluctuate once V CC is removed.SYMBOL TABLEX9C102/103/104/5034ABSOLUTE MAXIMUM RATINGS*Temperature under Bias ..................–65°C to +135°C Storage Temperature.......................–65°C to +150°C Voltage on CS , INC , U/D and V CCwith Respect to V SS ...............................–1V to +7V Voltage on V H and V LReferenced to V SS .................................–8V to +8V ∆V = |V H –V L |X9C102.............................................................4V X9C103, X9C503, and X9C104......................10V Lead Temperature (Soldering, 10 seconds)....+300°C Wiper Current.....................................................±1mA *COMMENTStresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.This is a stress rating only and the functional operation of the device at these or any other conditions above those listed in the operational sections of this specifica-tion is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.ANALOG CHARACTERISTICS Electrical CharacteristicsEnd-to-End Resistance Tolerance .....................±20%Power Rating at 25°CX9C102.......................................................16mW X9C103, X9C503, and X9C104..................10mW Wiper Current............................................±1mA Max.Typical Wiper Resistance.........................40Ω at 1mA Typical Noise..........................< –120dB/Hz Ref: 1V ResolutionResistance .............................................................1%LinearityAbsolute Linearity (1)........................................±1.0 Ml (2)Relative Linearity (3).....................................±0.2 Ml (2)Temperature Coefficient(–40°C to +85°C)X9C102......................................+600 ppm/°C Typical X9C103, X9C503, X9C104........+300 ppm/°C Typical Ratiometric Temperature Coefficient ............±20 ppm Wiper AdjustabilityUnlimited Wiper Adjustment (Non-Store operation) Wiper Position Store Operations...................10,000 Data Changes Physical Characteristics Marking IncludesManufacturer‘s Trademark Resistance Value or Code Date Code Test Circuit #1Test Circuit #2Notes:(1)Absolute Linearity is utilized to determine actual wiper voltage versus expected voltage= (V w(n)(actual) – V w(n)(expected)) = ±1 Ml Maximum.(2) 1 Ml = Minimum Increment = R TOT /99.(3)Relative Linearity is a measure of the error in step size between taps = V W(n+1) – [V w(n) + Ml] = +0.2 Ml.X9C102/103/104/5035RECOMMENDED OPERATING CONDITIONSTemperature mercial 0°C +70°C Industrial –40°C +85°C Military–55°C+125°C3863 PGM T03.1Supply Voltage Limits X9C102/103/104/5035V ±10%D.C. OPERATING CHARACTERISTICS (Over recommended operating conditions unless otherwise specified.)LimitsSymbol Parameter Min.Typ.(4)Max.Units Test ConditionsI CC V CC Active Current 13mA CS = V IL , U/D = V IL or V IH and INC = 0.4V to 2.4V @ max. t CYC I SB Standby Supply Current 200500µA CS = V CC – 0.3V, U/D and INC =V SS or V CC – 0.3V I LI CS , INC , U/D Input ±10µA V IN = V SS to V CCLeakage Current V IH CS , INC , U/D Input 2V CC + 1V HIGH VoltageV IL CS , INC , U/D Input –10.8V LOW Voltage R W Wiper Resistence 40100ΩMax. Wiper Current ±1mAV H VH Terminal Voltage –5+5V V L VL Terminal Voltage –5+5V C IN (5)CS , INC , U/D Input 10pFV CC = 5V, V IN = V SS ,CapacitanceT A = 25°C, f = 1MHz3863 PGM T05.3STANDARD PARTSPart Number Maximum ResistanceWiper IncrementsMinimum ResistanceX9C1021K Ω10.1Ω40ΩX9C10310K Ω101Ω40ΩX9C50350K Ω505Ω40ΩX9C104100K Ω1010Ω40Ω3863 PGM T08.1Notes:(4)Typical values are for T A = 25°C and nominal supply voltage.(5)This parameter is periodically sampled and not 100% tested.3863 PGM T04.2X9C102/103/104/5036A.C. CONDITIONS OF TESTMODE SELECTIONNotes:(6)Typical values are for T A = 25°C and nominal supply voltage.(7)This parameter is periodically sampled and not 100% tested.(8)MI in the A.C. timing diagram refers to the minimum incremental change in the V W output due to a change in the wiper position.X9C102/103/104/5037Typical Frequency Response for X9C102TEST CONDITIONS V CC = 5VTemp. = 25°C Wiper @ Tap 50V H = 0.5V RMSNormalized (0dB @ 1KHz)Test Circuit #1TEST CONDITIONS V CC = 5VTemp. = 25°C Wiper @ Tap 50V H = 2V RMS Test Circuit #1Typical Total Harmonic Distortion for X9C102N O R M A L I Z E D G A I N (d B )9630–3–6–9–12–15–18–210.010.101.0010.00100.001000.0010000.00FREQUENCY IN KHzT H D (%)2.01.81.61.41.21.00.80.60.40.20.00.010.101.0010.00100.001000.0010000.00FREQUENCY IN KHz3863 FHD F063863 FHD F07X9C102/103/104/5038Typical Linearity for X9C102Typical Frequency Response for X9C103TEST CONDITIONS V CC = 5VTemp. = 25°C Wiper @ Tap 50V H = 0.5V RMSNormalized (0dB @ 1KHz)Test Circuit #1N O R M A L I Z E D G A I N (d B )9630–3–6–9–12–15–18–210.010.101.0010.00100.001000.00FREQUENCY IN KHz3863 FHD F09X9C102/103/104/5039Typical Total Harmonic Distortion for X9C103Typical Linearity for X9C103TEST CONDITIONS V CC = 5VTemp. = 25°C Wiper @ Tap 50V H = 2V RMS Test Circuit #1T H D (%)2.01.81.61.41.21.00.80.60.40.20.00.010.101.0010.00100.001000.00FREQUENCY IN KHz3863 FHD F10X9C102/103/104/50310Typical Frequency Response for X9C503Typical Total Harmonic Distortion for X9C503TEST CONDITIONS V CC = 5VTemp. = 25°C Wiper @ Tap 50V H = 2V RMS Test Circuit #1TEST CONDITIONS V CC = 5VTemp. = 25°C Wiper @ Tap 50V H = 0.5V RMSNormalized (0dB @ 1 KHz)Test Circuit #19630-3-6-9-12-15-18-210.010.101.0010.00100.00FREQUENCY IN KHzN O R M A L I Z E D G A I N (d B )1000.0091.81.61.41.21.00.80.60.40.20.00.010.101.0010.00100.00FREQUENCY IN KHzT H D (%)1000.003863 FHD F123863 FHD F13Typical Linearity for X9C503Typical Frequency Response for X9C104TEST CONDITIONS V CC = 5VTemp. = 25°C Wiper @ Tap 50V H = 0.5V RMSNormalized (0dB @ 1 KHz)Test Circuit #19630-3-6-9-12-15-18-210.010.101.0010.00100.001000.00FREQUENCY IN KHzN O R M A L I Z E D G A I N (d B )3863 FHD F15Typical Total Harmonic Distortion for X9C104Typical Linearity for X9C104TEST CONDITIONS V CC = 5VTemp. = 25°C Wiper @ Tap 50V H = 2V RMS Test Circuit #12.01.81.61.41.21.00.80.60.40.20.00.010.101.0010.00100.0010000.00FREQUENCY IN KHzT H D (%)1000.003863 FHD F163926 FHD F01TYP NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)MAX.PACKAGING INFORMATION8-LEAD PLASTIC DUAL IN-LINE PACKAGE TYPE PNOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)PACKAGING INFORMATION8-LEAD PLASTIC SMALL OUTLINE GULL WING PACKAGE TYPE SNOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESIS IN MILLIMETERS)3926 FHD F22ORDERING INFORMATIONX9CXXX X XTemperature RangeBlank = Commercial = 0°C to +70°CI = Industrial = –40°C to +85°CM = Military = –55°C to +125°CPackageP = 8-Lead Plastic DIPS = 8-Lead SOICEnd to End Resistance102 = 1KΩ103 = 10KΩ503 = 50KΩ104 = 100KΩLIMITED WARRANTYDevices sold by Xicor, Inc. are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. Xicor, Inc. makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. Xicor, Inc. makes no warranty of merchantability or fitness for any purpose. Xicor, Inc. reserves the right to discontinue production and change specifications and prices at any time and without notice.Xicor, Inc. assumes no responsibility for the use of any circuitry other than circuitry embodied in a Xicor, Inc. product. No other circuits, patents, licenses are implied.U.S. PATENTSXicor products are covered by one or more of the following U.S. Patents: 4,263,664; 4,274,012; 4,300,212; 4,314,265; 4,326,134; 4,393,481; 4,404,475;4,450,402; 4,486,769; 4,488,060; 4,520,461; 4,533,846; 4,599,706; 4,617,652; 4,668,932; 4,752,912; 4,829, 482; 4,874, 967; 4,883, 976. Foreign patents and additional patents pending.LIFE RELATED POLICYIn situations where semiconductor component failure may endanger life, system designers using this product should design the system with appropriate error detection and correction, redundancy and back-up features to prevent such an occurence.Xicor's products are not authorized for use in critical components in life support devices or systems.1.Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whosefailure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user.2.A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the lifesupport device or system, or to affect its safety or effectiveness.。

常用开关电源芯片大全之欧阳育创编

常用开关电源芯片大全之欧阳育创编

常用开关电源芯片大全第1章DC-DC电源转换器/基准电压源1.1 DC-DC电源转换器1.低噪声电荷泵DC-DC电源转换器AAT3113/AAT31142.低功耗开关型DC-DC电源转换器ADP30003.高效3A开关稳压器AP15014.高效率无电感DC-DC电源转换器FAN56605.小功率极性反转电源转换器ICL76606.高效率DC-DC电源转换控制器IRU30377.高性能降压式DC-DC电源转换器ISL64208.单片降压式开关稳压器L49609.大功率开关稳压器L4970A10.1.5A降压式开关稳压器L497111.2A高效率单片开关稳压器L497812.1A高效率升压/降压式DC-DC电源转换器L597013.1.5A降压式DC-DC电源转换器LM157214.高效率1A降压单片开关稳压器LM1575/LM2575/LM2575HV15.3A降压单片开关稳压器LM2576/LM2576HV16.可调升压开关稳压器LM257717.3A降压开关稳压器LM259618.高效率5A开关稳压器LM267819.升压式DC-DC电源转换器LM2703/LM270420.电流模式升压式电源转换器LM273321.低噪声升压式电源转换器LM275022.小型75V降压式稳压器LM500723.低功耗升/降压式DC-DC电源转换器LT107324.升压式DC-DC电源转换器LT161525.隔离式开关稳压器LT172526.低功耗升压电荷泵LT175127.大电流高频降压式DC-DC电源转换器LT176528.大电流升压转换器LT193529.高效升压式电荷泵LT193730.高压输入降压式电源转换器LT195631.1.5A升压式电源转换器LT196132.高压升/降压式电源转换器LT343333.单片3A升压式DC-DC电源转换器LT343634.通用升压式DC-DC电源转换器LT346035.高效率低功耗升压式电源转换器LT346436.1.1A升压式DC-DC电源转换器LT346737.大电流高效率升压式DC-DC电源转换器LT378238.微型低功耗电源转换器LTC175439.1.5A单片同步降压式稳压器LTC187540.低噪声高效率降压式电荷泵LTC191141.低噪声电荷泵LTC3200/LTC3200-542.无电感的降压式DC-DC电源转换器LTC325143.双输出/低噪声/降压式电荷泵LTC325244.同步整流/升压式DC-DC电源转换器LTC340145.低功耗同步整流升压式DC-DC电源转换器LTC340246.同步整流降压式DC-DC电源转换器LTC340547.双路同步降压式DC-DC电源转换器LTC340748.高效率同步降压式DC-DC电源转换器LTC341649.微型2A升压式DC-DC电源转换器LTC342650.2A两相电流升压式DC-DC电源转换器LTC342851.单电感升/降压式DC-DC电源转换器LTC344052.大电流升/降压式DC-DC电源转换器LTC344253.1.4A同步升压式DC-DC电源转换器LTC345854.直流同步降压式DC-DC电源转换器LTC370355.双输出降压式同步DC-DC电源转换控制器LTC373656.降压式同步DC-DC电源转换控制器LTC377057.双2相DC-DC电源同步控制器LTC380258.高性能升压式DC-DC电源转换器MAX1513/MAX151459.精简型升压式DC-DC电源转换器MAX1522/MAX1523/MAX152460.高效率40V升压式DC-DC电源转换器MAX1553/MAX155461.高效率升压式LED电压调节器MAX1561/MAX159962.高效率5路输出DC-DC电源转换器MAX156563.双输出升压式DC-DC电源转换器MAX1582/MAX1582Y64.驱动白光LED的升压式DC-DC电源转换器MAX158365.高效率升压式DC-DC电源转换器MAX1642/MAX164366.2A降压式开关稳压器MAX164467.高效率升压式DC-DC电源转换器MAX1674/MAX1675/MAX167668.高效率双输出DC-DC电源转换器MAX167769.低噪声1A降压式DC-DC电源转换器MAX1684/MAX168570.高效率升压式DC-DC电源转换器MAX169871.高效率双输出降压式DC-DC电源转换器MAX171572.小体积升压式DC-DC电源转换器MAX1722/MAX1723/MAX172473.输出电流为50mA的降压式电荷泵MAX173074.升/降压式电荷泵MAX175975.高效率多路输出DC-DC电源转换器MAX180076.3A同步整流降压式稳压型MAX1830/MAX183177.双输出开关式LCD电源控制器MAX187878.电流模式升压式DC-DC电源转换器MAX189679.具有复位功能的升压式DC-DC电源转换器MAX194780.高效率PWM降压式稳压器MAX1992/MAX199381.大电流输出升压式DC-DC电源转换器MAX61882.低功耗升压或降压式DC-DC电源转换器MAX62983.PWM升压式DC-DC电源转换器MAX668/MAX66984.大电流PWM降压式开关稳压器MAX724/MAX72685.高效率升压式DC-DC电源转换器MAX756/MAX75786.高效率大电流DC-DC电源转换器MAX761/MAX76287.隔离式DC-DC电源转换器MAX8515/MAX8515A88.高性能24V升压式DC-DC电源转换器MAX872789.升/降压式DC-DC电源转换器MC33063A/MC34063A90.5A升压/降压/反向DC-DC电源转换器MC33167/MC3416791.低噪声无电感电荷泵MCP1252/MCP125392.高频脉宽调制降压稳压器MIC220393.大功率DC-DC升压电源转换器MIC229594.单片微型高压开关稳压器NCP1030/NCP103195.低功耗升压式DC-DC电源转换器NCP1400A96.高压DC-DC电源转换器NCP140397.单片微功率高频升压式DC-DC电源转换器NCP141098.同步整流PFM步进式DC-DC电源转换器NCP142199.高效率大电流开关电压调整器NCP1442/NCP1443/NCP1444/NCP1445100.新型双模式开关稳压器NCP1501101.高效率大电流输出DC-DC电源转换器NCP1550102.同步降压式DC-DC电源转换器NCP1570103.高效率升压式DC-DC电源转换器NCP5008/NCP5009 104.大电流高速稳压器RT9173/RT9173A105.高效率升压式DC-DC电源转换器RT9262/RT9262A106.升压式DC-DC电源转换器SP6644/SP6645107.低功耗升压式DC-DC电源转换器SP6691108.新型高效率DC-DC电源转换器TPS54350109.无电感降压式电荷泵TPS6050x110.高效率升压式电源转换器TPS6101x111.28V恒流白色LED驱动器TPS61042112.具有LDO输出的升压式DC-DC电源转换器TPS6112x 113.低噪声同步降压式DC-DC电源转换器TPS6200x114.三路高效率大功率DC-DC电源转换器TPS75003115.高效率DC-DC电源转换器UCC39421/UCC39422116.PWM控制升压式DC-DC电源转换器XC6371117.白光LED驱动专用DC-DC电源转换器XC9116118.500mA同步整流降压式DC-DC电源转换器XC9215/XC9216/XC9217119.稳压输出电荷泵XC9801/XC9802120.高效率升压式电源转换器ZXLB16001.2 线性/低压差稳压器121.具有可关断功能的多端稳压器BAXXX122.高压线性稳压器HIP5600123.多路输出稳压器KA7630/KA7631124.三端低压差稳压器LM2937125.可调输出低压差稳压器LM2991126.三端可调稳压器LM117/LM317127.低压降CMOS500mA线性稳压器LP38691/LP38693128.输入电压从12V到450V的可调线性稳压器LR8129.300mA非常低压降稳压器(VLDO)LTC3025130.大电流低压差线性稳压器LX8610131.200mA负输出低压差线性稳压器MAX1735132.150mA低压差线性稳压器MAX8875133.带开关控制的低压差稳压器MC33375134.带有线性调节器的稳压器MC33998135.1.0A低压差固定及可调正稳压器NCP1117136.低静态电流低压差稳压器NCP562/NCP563137.具有使能控制功能的多端稳压器PQxx138.五端可调稳压器SI-3025B/SI-3157B139.400mA低压差线性稳压器SPX2975140.五端线性稳压器STR20xx141.五端线性稳压器STR90xx142.具有复位信号输出的双路输出稳压器TDA8133143.具有复位信号输出的双路输出稳压器TDA8138/TDA8138A144.带线性稳压器的升压式电源转换器TPS6110x145.低功耗50mA低压降线性稳压器TPS760xx146.高输入电压低压差线性稳压器XC6202147.高速低压差线性稳压器XC6204148.高速低压差线性稳压器XC6209F149.双路高速低压差线性稳压器XC64011.3 基准电压源150.新型XFET基准电压源ADR290/ADR291/ADR292/ADR293151.低功耗低压差大输出电流基准电压源MAX610x152.低功耗1.2V基准电压源MAX6120153.2.5V精密基准电压源MC1403154.2.5V/4.096V基准电压源MCP1525/MCP1541155.低功耗精密低压降基准电压源REF30xx/REF31xx156.精密基准电压源TL431/KA431/TLV431A第2章AC-DC转换器及控制器1.厚膜开关电源控制器DP104C2.厚膜开关电源控制器DP308P3.DPA-Switch系列高电压功率转换控制器DPA423/DPA424/DPA425/DPA4264.电流型开关电源控制器FA13842/FA13843/FA13844/FA138455.开关电源控制器FA5310/FA53116.PWM开关电源控制器FAN75567.绿色环保的PWM开关电源控制器FAN76018.FPS型开关电源控制器FS6M07652R9.开关电源功率转换器FS6Sxx10.降压型单片AC-DC转换器HV-2405E11.新型反激准谐振变换控制器ICE1QS0112.PWM电源功率转换器KA1M088013.开关电源功率转换器KA2S0680/KA2S088014.电流型开关电源控制器KA38xx15.FPS型开关电源功率转换器KA5H0165R16.FPS型开关电源功率转换器KA5Qxx17.FPS型开关电源功率转换器KA5Sxx18.电流型高速PWM控制器L499019.具有待机功能的PWM初级控制器L599120.低功耗离线式开关电源控制器L659021.LINK SWITCH TN系列电源功率转换器LNK304/LNK305/LNK30622.LINK SWITCH系列电源功率转换器LNK500/LNK501/LNK52023.离线式开关电源控制器M51995A24.PWM电源控制器M62281P/M62281FP25.高频率电流模式PWM控制器MAX5021/MAX502226.新型PWM开关电源控制器MC4460427.电流模式开关电源控制器MC4460528.低功耗开关电源控制器MC4460829.具有PFC功能的PWM电源控制器ML482430.液晶显示器背光灯电源控制器ML487631.离线式电流模式控制器NCP120032.电流模式脉宽调制控制器NCP120533.准谐振式PWM控制器NCP120734.低成本离线式开关电源控制电路NCP121535.低待机能耗开关电源PWM控制器NCP123036.STR系列自动电压切换控制开关STR8xxxx37.大功率厚膜开关电源功率转换器STR-F665438.大功率厚膜开关电源功率转换器STR-G865639.开关电源功率转换器STR-M6511/STR-M652940.离线式开关电源功率转换器STR-S5703/STR-S5707/STR-S570841.离线式开关电源功率转换器STR-S6401/STR-S6401F/STR-S6411/STR-S6411F 442.开关电源功率转换器STR-S651343.离线式开关电源功率转换器TC33369~TC3337444.高性能PFC与PWM组合控制集成电路TDA16846/TDA1684745.新型开关电源控制器TDA1685046.“绿色”电源控制器TEA150447.第二代“绿色”电源控制器TEA150748.新型低功耗“绿色”电源控制器TEA153349.开关电源控制器TL494/KA7500/MB375950.Tiny SwitchⅠ系列功率转换器TNY253、TNY254、TNY25551.Tiny SwitchⅡ系列功率转换器TNY264P~TNY268G52.TOP Switch(Ⅱ)系列离线式功率转换器TOP209~TOP22753.TOP Switch-FX系列功率转换器TOP232/TOP233/TOP23454.TOP Switch-GX系列功率转换器TOP242~TOP25055.开关电源控制器UCX84X56.离线式开关电源功率转换器VIPer12AS/VIPer12ADIP57.新一代高度集成离线式开关电源功率转换器VIPer53第3章功率因数校正控制/节能灯电源控制器1.电子镇流器专用驱动电路BL83012.零电压开关功率因数控制器FAN48223.功率因数校正控制器FAN75274.高电压型EL背光驱动器HV8265.EL场致发光背光驱动器IMP525/IMP5606.高电压型EL背光驱动器/反相器IMP8037.电子镇流器自振荡半桥驱动器IR21568.单片荧光灯镇流器IR21579.调光电子镇流器自振荡半桥驱动器IR215910.卤素灯电子变压器智能控制电路IR216111.具有功率因数校正电路的镇流器电路IR216612.单片荧光灯镇流器IR216713.自适应电子镇流器控制器IR252014.电子镇流器专用控制器KA754115.功率因数校正控制器L656116.过渡模式功率因数校正控制器L656217.集成背景光控制器MAX8709/MAX8709A18.功率因数校正控制器MC33262/MC3426219.固定频率电流模式功率因数校正控制器NCP165320.EL场致发光灯高压驱动器SP440321.功率因数校正控制器TDA4862/TDA486322.有源功率因数校正控制器UC385423.高频自振荡节能灯驱动器电路VK05CFL24.大功率高频自振荡节能灯驱动器电路VK06TL第4章充电控制器1.多功能锂电池线性充电控制器AAT36802.可编程快速电池充电控制器BQ20003.可进行充电速率补偿的锂电池充电管理器BQ20574.锂电池充电管理电路BQ2400x5.单片锂电池线性充电控制器BQ2401xB接口单节锂电池充电控制器BQ2402x7.2A同步开关模式锂电池充电控制器BQ241008.集成PWM开关控制器的快速充电管理器BQ29549.具有电池电量计量功能的充电控制器DS277010.锂电池充电控制器FAN7563/FAN756411.2A线性锂/锂聚合物电池充电控制器ISL629212.锂电池充电控制器LA5621M/LA5621V13.1.5A通用充电控制器LT157114.2A恒流/恒压电池充电控制器LT176915.线性锂电池充电控制器LTC173216.带热调节功能的1A线性锂电池充电控制器LTC173317.线性锂电池充电控制器LTC173418.新型开关电源充电控制器LTC198019.开关模式锂电池充电控制器LTC400220.4A锂电池充电器LTC400621.多用途恒压/恒流充电控制器LTC400822.4.2V锂离子/锂聚合物电池充电控制器LTC405223.可由USB端口供电的锂电池充电控制器LTC405324.小型150mA锂电池充电控制器LTC405425.线性锂电池充电控制器LTC405826.单节锂电池线性充电控制器LTC405927.独立线性锂电池充电控制器LTC406128.镍镉/镍氢电池充电控制器M62256FP29.大电流锂/镍镉/镍氢电池充电控制器MAX150130.锂电池线性充电控制器MAX150731.双输入单节锂电池充电控制器MAX1551/MAX155532.单节锂电池充电控制器MAX167933.小体积锂电池充电控制器MAX1736B接口单节锂电池充电控制器MAX181135.多节锂电池充电控制器MAX187336.双路输入锂电池充电控制器MAX187437.单节锂电池线性充电控制器MAX189838.低成本/多种电池充电控制器MAX190839.开关模式单节锂电池充电控制器MAX1925/MAX192640.快速镍镉/镍氢充电控制器MAX2003A/MAX200341.可编程快速充电控制器MAX712/MAX71342.开关式锂电池充电控制器MAX74543.多功能低成本充电控制器MAX846A44.具有温度调节功能的单节锂电池充电控制器MAX8600/MAX860145.锂电池充电控制器MCP73826/MCP73827/MCP7382846.高精度恒压/恒流充电器控制器MCP73841/MCP73842/MCP73843/MCP73844 647.锂电池充电控制器MCP73861/MCP7386248.单节锂电池充电控制器MIC7905049.单节锂电池充电控制器NCP180050.高精度线性锂电池充电控制器VM7205。

银灿主控芯片规格书

银灿主控芯片规格书

IS916ENUSB3.0 Flash Disk ControllerDatasheetVersion. 0.1Copyright © 2012 Innostor Technology Corporation.All rights reserved.Innostor Technology Corporation© Copyright Innostor Technology CorporationAll Rights Reserved.No part of this document may be reproduced or transmitted in any form or by any means. All information contained in this document is subject to change without notice. The products described in this document are not intended for use implantation or other life supports application where malfunction may result in injury or death to persons. The information contained in this document does not affect or change Innostor Technology Corporation product specification or warranties. Nothing in this document shall operate as an express or implied license or environments, and is presented as an illustration. The results obtained in other operating environments may vary.THE INFORMATION CONTAINED IN THIS DOCUMENT IS PROVIDED ON AN “AS IS” BASE. In no event will Innostor be liable for damages arising directly or indirectly from any use of the information contained in this document.Innostor Technology Corporation2F, No.8, Lane 32, Xianzheng 5th St.,Jhubei City, Hsinchu County 302, TaiwanInnostor Technology CorporationTable of Contents :1.DESCRIPTION (5)2.FEATURES (5)3.PIN ASSIGNMENT (6)3.1QFN-48 Pin Assignment (6)3.2 Pin Descriptions (7)4.SYSTEM APPLICATION CONFIGURATIONS (9)4.1 QFN-48 configuration examples (9)5.ELECTRICAL CHARACTERISTICS (10)5.1Absolute Maximum Ratings (10)5.2Operating Conditions (10)5.3Reference Clock Source and Crystal Specification (10)5.4DC Characteristics (11)5.5DC Characteristics of 3.3V IO (11)6. PACKAGE INFORMATION (12)6.1QFN-48 package outline dimension (12)Innostor Technology CorporationRevision HistoryNo Date History V.0.10 2012/04/20 Initial versionInnostor Technology Corporation1. DescriptionIS916EN is the latest USB-3.0 interface Nand Flash Controller. With flexible firmware codesupporting, IS916EN can support various flash technology including 4k / 8k / 16k page TLC / MLC / SLC by different 2xnm / 2ynm / 1xnm process for major flash vendors.2. FeaturesOne Channel data bus by small footprint packageUp to 4 CEs supportedECC protect up to 70 bit ( configurable ) by 1K bytes2xnm, 2ynm, 1xnm : SLC / MLC / TLC types NAND Flash supportedEF-NAND Flash supportedONFI 2.1 spec. interface supportedToggle DDR interface supportedCompliant with USB 3.0 spec. version 1.0Compliant with USB 2.0 spec. backward compatible with USB1.1Compliant with USB Mass Storage Class spec. version 1.0High performance 1T 8051 with hardware acceleration DMAF/W off-load engine embedded1.2V low power consumption designLED indicator to show link status and r/w trafficCustomized VID/ PID with serial numberBuilt-in LDO regulator30Mhz CrystalInnostor Technology CorporationInnostor Technology Corporation 3. Pin Assignment3.1 QFN-48 Pin Assignment3.2 Pin DescriptionsPin Name Pin #Pullup/DownAttribute DescriptionRE# 1 O Flash Channel RE#DAT[7] 2 Down I/O Flash data bit [7]DAT[6] 3 Down I/O Flash data bit [6]DAT[5] 4 Down I/O Flash data bit [5]DAT[4] 5 Down GND Flash data bit [4]DVDD33 6 PWR 3.3V IO Power SupplyDQS 7 Down I/O Flash DQSDAT[3] 8 Down I/O Flash data bit [3]DAT[2] 9 Down I/O Flash data bit [2]DAT[1] 10 Down I/O Flash data bit [1]DAT[0] 11 Down GND Flash data bit [0]V5IN 12 I Regulator 5.0V inputV33O 13 O Regulator 3.3V outputGND 14 GND GNDV33I 15 I Regulator 3.3V inputV12O 16 O Regulator 1.2V outputGPIO[5] 17 I/O General Purpose I/ODVDD12 18 PWR 1.2V Core power supplyCLE 19 O Flash Channel Command latch ALE 20 O Flash Channel Address latch DVDD33 21 PWR 3.3V IO power supplyWE# 22 O Flash Channel WE#WP# 23 O Flash write protectionRST_N 24 Up I Chip reset, low activeXSCO 25 O Crystal 30Mhz outputXSCI 26 I Crystal 30Mhz inputInnostor Technology CorporationPin Name Pin #PullUp/DownAttribute DescriptionGND 27 GND GNDDP 28 I/O USB 2.0 differential pin plusDM 29 I/O USB 2.0 differential pin minusVCC33A 30 PWR 3.3V analog power supplySS_TXM 31 O USB 3.0 differential transmit pin negative SS_TXP 32 O USB 3.0 differential transmit pin positive VCC12A 33 PWR 1.2V analog power supplySS_RXM 34 I USB 3.0 differential receive pin negative SS_RXP 35 I USB 3.0 differential receive pin positive GND 36 GND GNDMODE[2] 37 Down I Test mode pin, tie to GNDMODE[1] 38 Down I Test mode pin, tie to GNDMODE[0] 39 Down I Test mode pin, tie to GNDLED_U3 40 O LED to show link at U3 modeLED_RW 41 O LED to show link status and r/w traffic DVDD12 42 PWR 1.2V Core power supplyCE_3 43 O Flash chip enable 3CE_2 44 O Flash chip enable 2DVDD33 45 PWR 3.3V IO power supplyCE_1 46 O Flash chip enable 1CE_0 47 O Flash chip enable 0RB# 48 O Flash Ready / Busy StatusInnostor Technology CorporationInnostor Technology Corporation 4. System Application Configurations4.1 QFN-48 configuration examplesTSOP Flash Package5. Electrical Characteristics5.1 Absolute Maximum RatingsParameter Symbol Min. Max. Unit Storage Temperature T storage-40 150 C5.0V supply power V in50-0.3 5.5 V3.3V supply power V in33-0.3 3.63 V1.2V supply power V in12-0.3 1.32 V5.2 Operating ConditionsParameter Symbol Min. Max. Unit Operating Temperature T operating0 70 C USB VBUS VBUS 4.5 5.5 VRegulator 5V IN V5IN 4.5 5.5 VRegulator 3.3V IN V33I 3.0 3.6 VAnalog 3.3V power VCC33A 3.15 3.45 VAnalog 1.2V power VCC12A 1.14 1.26 VDigital 3.3V power DVDD33 2.97 3.63 VDigital 1.2V power DVDD12 1.08 1.32 V5.3 Reference Clock Source and Crystal SpecificationParameter Symbol Min. Typ. Max. Unit Reference clock XSCI 30 Mhz Crystal freq. tolerance -50 +50 ppmInnostor Technology Corporation5.4 DC CharacteristicsParameter Symbol Min. Typ. Max. Unit USB bus power VBUS_cur 310 mA Analog 3.3V power U3 V33A_cur_u3 18 mAAnalog 1.2V power U3 V12A_cur_u3 103 mAAnalog 3.3V power U2 V33A_cur_u3 32 mAAnalog 1.2V power U2 V12A_cur_u3 3 mAAnalog 3.3V Suspend V33A_cur_sus 0.3 mAAnalog 1.2V Suspend V12A_cur_sus 0.6 mADigital 3.3V power DVDD33_cur TBD mADigital 1.2V power DVDD12_cur TBD mA5.5 DC Characteristics of 3.3V IOParameter Symbol Min. Typ. Max. Unit Digital 3.3V power DVDD33 2.97 3.3 3.63 VInput low voltage Vil 0.8 VInput high voltage Vih 2.0 VOutput low voltage Vol 0.4 VOutput high voltage Voh 2.4 VPull-up resistance Rpu 40 75 190 KΩPull-down resistance Rpd 30 75 190 KΩInnostor Technology CorporationInnostor Technology Corporation 6. Package Information6.1 QFN-48 package outline dimension。

MC9S08QD4数据手册(中文)

MC9S08QD4数据手册(中文)
加两个断点) z 支持高达 32 个中断/复位源
存储器选项
z 闪存读/写/擦除全部操作电压和温度 z 闪存容量
—MC9S08QD4/S9S08QD4:4096 字节 —MC9S08QD2/S9S08QD2:2048 字节
RAM 容量
—MC9S08QD4/S9S08QD4:256 字节 —MC9S08QD2/S9S08QD2:128 字节
第四章 内存映像和寄存器定义.........................................................................................................21 4.1 MC9S08QD4 系列内存映像 .................................................................................................21 4.2 复位和中断向量分配.............................................................................................................22 4.3 寄存器地址和位分配.............................................................................................................22 4.4 RAM .......................................................................................................................................26 4.5Flash ......................................................................................................................................... 27 4.5.1 特征 .............................................................................................................................27 4.5.2 写入和擦除时间..........................................................................................................27 4.5.3 擦除和写入命令执行..................................................................................................28 4.5.4 突发写入时间..............................................................................................................29 4.5.5 访问错误......................................................................................................................31 4.5.6 FLASH 块保护............................................................................................................31 4.5.7 向量重定向..................................................................................................................32 4.6 安全性 ....................................................................................................................................32 4.7 FLASH 寄存器和控制位 .......................................................................................................33 4.7.1 FLASH 时钟分频寄存器(FCDIV) .............................................................................33

C8051F005DK中文资料

C8051F005DK中文资料

Precision Mixed Signal Copyright © 2004 by Silicon Laboratories6.15.2004C8051F00525 MIPS, 32 kB Flash, 12-Bit ADC, 64-Pin Mixed-Signal MCUAnalog Peripherals12-Bit ADC-±1 LSB INL; no missing codes-Programmable throughput up to 100 ksps-8 external inputs; programmable as single-ended or differential -Programmable amplifier gain: 16, 8, 4, 2, 1, 0.5-Data-dependent windowed interrupt generator -Built-in temperature sensor (±3 °C)Two 12-Bit DACs-Voltage output-10 µsec settling timeTwo Comparators-16 programmable hysteresis values-Configurable to generate interrupts or resetInternal Voltage ReferenceV DD Monitor/Brown-out DetectorOn-Chip JTAG Debug-On-chip emulation circuitry facilitates full-speed, non-intrusive, in-circuit emulation-Supports breakpoints, single stepping, watchpoints, inspect/modify memory, and registers-Superior performance to emulation systems using ICE-chips, target pods, and sockets-Fully compliant with IEEE 1149.1 specificationHigh-Speed 8051 µC Core-Pipelined instruction architecture; executes 70% of Instructions in 1 or 2 system clocks-Up to 25 MIPS throughput with 25 MHz clock-Expanded interrupt handler; up to 21 interrupt sourcesMemory-2304 bytes data RAM-32 kB Flash; in-system programmable in 512-byte sectors (512 bytes are reserved)Digital Peripherals-32 port I/O; all are 5 V tolerant-Hardware SMBus™ (I2C™ compatible), SPI™, and UART serial ports available concurrently-Programmable 16-bit counter/timer array with five capture/compare modules- 4 general-purpose 16-bit counter/timers-Dedicated watchdog timer; bidirectional reset Clock Sources-Internal programmable oscillator: 2–16 MHz -External oscillator: Crystal, RC, C, or Clock -Can switch between clock sources on-the-fly Supply Voltage: 2.7 to 3.6 V-Typical operating current: 12.5 mA at 25 MHz -Multiple power saving sleep and shutdown modes64-Pin TQFPTemperature Range: –40 to +85 °C元器件交易网Precision Mixed Signal Copyright © 2004 by Silicon Laboratories 6.15.2004Silicon Laboratories and Silicon Labs are trademarks of Silicon Laboratories Inc.Other products or brandnames mentioned herein are trademarks or registered trademarks of their respective holders25 MIPS, 32 kB Flash, 12-Bit ADC, 64-Pin Mixed-Signal MCUSelected Electrical Specifications(T A = –40 to +85 C°, V DD = 2.7 V unless otherwise specified)Package InformationC8051F005DK Development Kit元器件交易网。

LT8920C数据手册1.0

LT8920C数据手册1.0

LT8920C2.4G 可变数据率射频芯片芯片特点●包括射频前端和数字基带的单芯片解决方案。

●支持跳频●支持SPI 和I2C 接口●内置auto_ack 功能●数据率1Mbps ,250Kbps ,125Kbps ,62.5Kbps ●1Mbps 时同步位为64bits ,48bits ,32bits ,16bits ;250Kbps ,125Kbps ,62.5Kbps 时同步位为32bits ,16bits 。

推荐使用32bits ,容错1bits 。

●极低功耗●支持信号能量检测●单芯片传输距离200米Page 22017年5月2.极限值.............................................................................................................................................................53.电气特性.........................................................................................................................................................64.典型应用.........................................................................................................................................................95.管脚描述.......................................................................................................................................................106.SPI 接口.......................................................................................................................................................116.1.SPI 默认格式...........................................................................................................................................116.2.SPI Optional Format .. (11)6.3.SPI 时序要求...........................................................................................................................................127.IIC 接口.......................................................................................................................................................137.1.I2C 命令格式...........................................................................................................................................137.2.I2C 特性...................................................................................................................................................137.3.I2C 器件地址...........................................................................................................................................148.状态机框图...................................................................................................................................................159.寄存器信息...................................................................................................................................................169.1.Register 3–Read only .....................................................................................................................169.2.Register 6–Read only .....................................................................................................................169.3.Register 7...............................................................................................................................................169.4.Register 9...............................................................................................................................................179.5.Register 10.............................................................................................................................................179.6.Register 11.............................................................................................................................................179.7.Register 23.............................................................................................................................................179.8.Register 27.............................................................................................................................................189.9.Register 29–Read only ...................................................................................................................189.10.Register 30–Read only ...............................................................................................................189.11.Register 31–Read only ...............................................................................................................189.12.Register 32.........................................................................................................................................199.13.Register 33.........................................................................................................................................219.14.Register 34.........................................................................................................................................219.15.Register 35.........................................................................................................................................219.16.Register 36.........................................................................................................................................229.17.Register 37.........................................................................................................................................229.18.Register 38.........................................................................................................................................239.19.Register 39.........................................................................................................................................239.20.Register 40.........................................................................................................................................239.21.Register 41.........................................................................................................................................Page 32017年5月9.23.Register 43.........................................................................................................................................249.24.Register 48–Read only ...............................................................................................................259.25.Register 50 (25)9.26.Register 52.........................................................................................................................................2610.寄存器推荐值...............................................................................................................................................2711.注意事项.......................................................................................................................................................2811.1.上电和寄存器初始化数据...................................................................................................................2811.2.进入sleep mode 和唤醒.....................................................................................................................2911.3.数据包格式...........................................................................................................................................2911.4.清空FIFO 指针.....................................................................................................................................2911.5.Packet Payload Length (29)11.6.状态机决定包长度...............................................................................................................................3111.6.1.发射时序........................................................................................................................................3111.7.接收时序 (33)11.8.MCU/应用决定包长度...........................................................................................................................3411.8.1.FW_TERM_TX=1..............................................................................................................................3511.8.2.FW_TERM_TX=0(发射状态).......................................................................................................3711.8.3.FW_TERM_TX=0(RX)....................................................................................................................3911.9.晶体振荡器...........................................................................................................................................4111.9.1.Quartz crystal application ...................................................................................................4111.9.2.外部时钟输入................................................................................................................................4111.9.3.减小管脚数....................................................................................................................................4212.封装形式.......................................................................................................................................................43....................................................................................................................................................错误!未定义书签。

E39-F10中文资料

E39-F10中文资料

Various Accessories Expand theUsefulness of the Fiber-Optic CablesLenses extend sensing distances Side-view attachments provide spacesavingsFlexible stainless steel tubes protectplastic fibers from mechanical damageThin fiber adapters as replacement Splices for 2.2 mm fiber can be used to repair cut fiberOrdering InformationFiber-Optic AccessoriesE39DescriptionPart number Focusing lens pair (use with E32-TC50/200/500/1000, E32-T11(L), E32-TC200C, E32-T61)E39-F1Side-view reflector pairE39-F2Convergent beam conversion kit (to fit fibers that accept E39-F1 lenses)E39-F3Pinpoint focusing lens (for E32-D32)E39-F3A Side-view diffuse reflective conversion kit (for through-beam fibers)E39-F5ATTACHMENTSDescriptionAppearance Length (L)Part number E32-DC200E, E32-DC200F(4), E32-D21, E32-D21L0.5 m E39-F32A51 m E39-F32A E32-DC200, E32-DC200B(4), E32-CC200, E32-D110.5 m E39-F32D5E32-D11L, E32-D511 m E39-F32D E32-TC200E, E32-TC200F(4), E32-T21, E32-T12L 0.5 mE39-F32B51 mE39-F32B E32-TC200, E32-TC200B(4), E32-T11, E32-T11L,0.5 m E39-F32C5E32-T51L1 mE39-F32CPROTECTIVE STAINLESS STEEL FLEXIBLE TUBES FOR PLASTIC FIBERSSingle tubesPairsDescriptionPart number Thin fiber adapter (1.0 mm to 2.2 mm dia.)E39-F9Splice for 2.2 mm dia. fiber (except E32-T51/E32-D51)E39-F10Fiber cutting tool (supplied with each trimmable plastic fiber optic cable)E39-F4Fiber probe bending toolE39-F11Mounting bracket replacement for E32-T16 (order two)E39-L4ADAPTERS/REPAIR PARTSE39E392DimensionsUnit: mm (inch)E39-F1Lens kit (pair)ATTACHMENTSE39-F2Side-view attachment (pair)Note: One set includes two units.Note: One set includes two units.E39-F3Convergent beam conversion kitTwo, 4 dia.M3 toothed washers1833.68.5Two, M3 x 3 Slotted head machine screws6.420.76.46.58 0.2M3 x 6 Anglefixing screw12Two, 3.2 +0.2 dia.0E39-F5Side-view diffuse reflective conversion kit E39-F3AReflective unit lens (Allen wrench included)E39-F32A, E39-F32A5E39-F32B, E39-F32B5PROTECTIVE STAINLESS STEEL TUBESNote: 1. L is as follows:E39-F32A and E39-F32B: 1,000E39-F32A5, E39-F32B5: 5002. These are sold as pairs.E39E393E39-F32C, E39-F32C5Note: 1. L is as follows:E39-F32C: 1,000E39-F32C5: 5002. These are sold as single pairs.Unit: mm (inch)E39-F32D, E39-F32D5Note: 1. L is as follows:E39-F32D: 1,000E39-F32D5: 5002. These are sold as single tubes.E39-F4Fiber cutterADAPTERS/REPAIR PARTSE39-F11Bending toolE39-F9Attachment for thin fiberE39-F10Fiber connectorE39E394E39-F1 Lens KitINSTALLING ACCESSORIESThis pair of lenses increases the sensing distance of selected fiber-optic cables. To install, screw each lens onto the threadedtip of each sensing head.InstallationAmplifer Sensing distance with fiber-optic cables Part Fiber-optic E32-T11E32-T11L E32-T11R E32-TC50E32-TC200E32-E32-TC500E32-E32-T61number cable TC200C TC1000E3X-Aw/ lens 1 m 1 m 1 m 1.5 m 1.5 m 800 mm 1.5 m 1 m 1.5 m (3.3 ft)(3.3 ft)(3.3 ft)(4.9 ft)(4.9 ft)(31.5 in)(4.9 ft)(3.3 ft)(4.9 ft)w/o lens180 mm 350 mm 140 mm 200 mm 200 mm 150 mm 200 mm 500 mm 150 mm (7.1 in)(13.8 in)(5.5 in)(7.9 in)(7.9 in)(5.9 in)(7.9 in)(19.7 in)(5.9 in)E3X-DAw/ lens 4 m 4 m 4 m Contact 4 m Contact Contact Contact 4 m (13.1 ft)(13.1 ft)(13.1 ft)Omron (13.1 ft)Omron Omron Omron (13.1 ft)w/o lens850 mm 1.66 m 670 mm Contact 950 mm Contact Contact Contact 570 mm (33.5 in)(5.5 ft)(26.4 in)Omron (37.4 in)Omron Omron Omron (22.4 in)E3X-Fw/ lens 400 mm 550 mm Contact —670 mm 350 mm — 1 m 450 mm (15.8 in)(21.7 in)Omron (26.4 in)(13.8 in)(3.3 ft)(17.7 in)w/o lens80 mm 150 mm Contact —80 mm 60 mm —500 mm 60 mm (3.2 in)(5.9 in)Omron (3.1 in)(2.4 in)(19.7 in)(2.4 in)E3X-Hw/ lens 2 m 2 m 2.1 m 3 m 3 m 1.6 m 3 m 1 m 3 m (6.6 ft)(6.6 ft)(6.9 ft)(9.8 ft)(9.8 ft)(5.2 ft)(9.8 ft)(3.3 ft)(9.8 ft)w/o lens360 mm 700 mm 280 mm 400 mm 400 mm 300 mm 400 mm 500 mm 300 mm (14.2 in)(27.6 in)(11.0 in)(15.7 in)(15.7 in)(11.8 in)(15.7 in)(19.7 in)(11.8 in)E3X-NHw/ lens 2 m 2 m 2.1 m Contact 3 m 3.6 m Contact Contact 3 m (6.6 ft)(6.6 ft)(6.9 ft)Omron (9.8 ft)(11.8 ft)Omron Omron (9.8 ft)w/o lens360 mm 700 mm 280 mm Contact 400 mm 300 mm Contact Contact 300 mm (14.2 in)(27.6 in)(11.0 in)Omron (15.7 in)(11.8 in)Omron Omron (11.8 in)E3X-NHB w/ lens250 mm 250 mm Contact Contact 420 mm Contact Contact Contact Contact (9.8 in)(9.8 in)Omron Omron (16.5 in)Omron Omron Omron Omron w/o lens90 mm 90 mm Contact Contact 55 mm Contact Contact Contact Contact (3.5 in)(3.5 in)Omron Omron (2.2 in)Omron Omron Omron Omron E3X-NMw/ lens 1.3 m 1.2 m 1.3 m Contact 2 m 800 mm Contact Contact 2 m (4.3 ft)(3.9 ft)(4.3 ft)Omron (6.6 ft)(31.5 in)Omron Omron (6.6 ft)w/o lens240 mm 500 mm 180 mm Contact 270 mm 200 mm Contact Contact 180 mm (9.4 in)(19.7 in)(7.1 in)Omron (10.6 in)(7.9 in)Omron Omron (7.1 in)E3X-NTw/ lens 1.4 m 1.28 m 1.4 m Contact 2.1 m 850 mm Contact Contact 2.1 m (4.6 ft)(4.2 ft)(4.6 ft)Omron (6.9 ft)(33.5 in)Omron Omron (6.9 ft)w/o lens260 mm 540 mm 200 mm Contact 290 mm 210 mm Contact Contact 190 mm (10.2 in)(21.3 in)(7.9 in)Omron (11.4 in)(8.3 in)Omron Omron (7.5 in)E3X-NVw/ lens 1.4 m 1.28 m 1.4 m Contact 2.1 m 850 mm Contact Contact 2.1 m (4.6 ft)(4.2 ft)(4.6 ft)Omron (6.9 ft)(33.5 in)Omron Omron (6.9 ft)w/o lens260 mm 540 mm 200 mm Contact 290 mm 210 mm Contact Contact 190 mm (10.2 in)(21.3 in)(7.9 in)Omron (11.4 in)(8.3 in)Omron Omron (7.5 in)E3X-NVG w/ lens120 mm 120 mm Contact Contact 190 mm 100 mm Contact Contact 130 mm (4.7 in)(4.7 in)Omron Omron (7.5 in)(3.9 in)Omron Omron (5.1 in)w/o lens10 mm 40 mm Contact Contact 28 mm 18 mm Contact Contact 18 mm (0.4 in)(1.6 in)Omron Omron (1.1 in)(0.7 in)Omron Omron (0.7 in)E3X-VGw/ lens 120 mm 120 mm Contact 190 mm 190 mm 100 mm — 1 m 130 mm (4.7 in)(4.7 in)Omron (7.5 in)(7.5 in)(3.9 in)(3.3 ft)(5.1 in)w/o lens10 mm 40 mm Contact 28 mm 28 mm 18 mm —500 mm 18 mm (0.4 in)(1.6 in)Omron(1.1 in)(1.1 in)(0.7 in)(19.7 in)(0.7 in)E39E395E39-F2 Side View AttachmentThese attachments provide 90 angle viewing for through-beam cables. Usethen with E32-TC50, E32-TC200 and E32-TC200C plastic filament cables and E32-T61 glass filament cables. Screw each piece onto the threaded tip of each sensing head.Note: This attachment does not increase sensing distance.E39-F3 Diffuse Reflective Conversion BracketThis bracket converts through-beam fiber cables for diffuse reflective sensing. Use it with E32-TC50, E32-TC200 and E32-TC200C plastic filament cables. A set of E39-F1 lenses are supplied with thisconversion bracket. To install, first remove the mounting nuts from the fiber-optic sensing heads. Then loosen the two set screws on the bracket. Insert the sensingends through the bracket, then attach the lenses. Tighten the two set screws to hold the sensing heads in place. Mount the bracket at the detection site, then loosen the large center screw to adjust the angle.When the angle that produces reliable detection has been found, tighten the screw to retain that angle.E39-F3A Reflective Unit Lens (for E32-D32 Fiber)This reflective side view block may be used with E32-TC200A plastic filament fiber-optic cable only. It provides a 2 cm (0.79 in) sensing distance. To install, first remove mounting nuts and washers from fiber-optic sensing head. Then, screw the threaded heads as far as they will go onto the mounting holes on the narrow side of the block.E39E396Protective Stainless Steel TubesInsert the fiber into the protective armor tube from the head connector side (threaded) of the tube.Push the fiber into the armor tube. The tube should be straight so that the fiber is not twisted when inserted. Then turn the end cap of the tube.Secure the tube on a suitable place with the attached nut.Use the attached saddle to secure the end cap of the tube. To secure the tube at aposition other than at the end cap, apply tape to the tube so that the portionbecomes thicker in diameterOMRON ELECTRONICS, INC.OMRON CANADA, INC.One East Commerce Drive 885 Milner AvenueSchaumburg, IL 60173Scarborough, Ontario M1B 5V81-800-55-OMRON416-286-6465Cat. No. CEDSAX310/99Specifications subject to change without notice.Printed in the U.S.A.NOTE: DIMENSIONS ARE SHOWN IN MILLIMETERS. To convert millimeters to inches divide by 25.4.。

EFKA控制箱参数项中文简单翻译

EFKA控制箱参数项中文简单翻译
缝纫机速度选择 0=普通缝纫机 F-225 1=中料缝纫机 2=厚料缝纫机 3=4180&4280系列 F-231 通电以后的第一针就实行定位速度缝纫 F-241 机头翻起感应功能(默认参数08或者09) F-242 提针键定义 F-244 倒回针按键定义 F-245 “B”键定义 F-247 速度限制按键定义 F-248 中分器按键定义 F-249 倒回针取消/重叫按键定义 F-250 大小针码切换键定义 F-255 辅助夹线器按键定义 在缝纫中压脚抬起和中分器或者滚轮抬起动作,必须等它们落下以后才开始计算针数(FF-260 250=5或者F-255=5 中分器和压脚以及倒回针联动方式 0=上升中分器 F-261 1=抬压脚或者倒回针时候上升中分器 2=抬压脚时候上升中分器 3=倒回针时候上升中分器 中分器和高抬压脚联动模式 F-262 0=启动HP功能以后,中分器不上升 1=启动HP功能以后,中分器上升 F-263 按键按下以后,手轮运动加量程度
EFKA控制箱参数项中文简单翻译 \ 3112、1907、5913
参数 号
描述
F-000 第一组始缝倒回针向前针数
F-001 第一组始缝倒回针向后针数
F-002 第一组终缝倒回针向前针数
F-003 第一组终缝倒回针向后针数
F-004 光电感应器的补偿针数(仅限长针码使用)
F-005 针织布料光电感应器针数设定
F-131 OFF=遮蔽 ON=没有遮蔽 光电感应器工作方式
F-132 OFF=关闭 ON=启动 工作方式由F-131参数来决定
F-133 当电眼感应到缝纫终止后,开始自动剪线 F-134 慢针起缝开关 F-135 装饰线倒回针开关 F-136 加缝最后一针,参数: 0、2、3、4最后一针向前;1 最后一针向后 F-137 始(终)缝倒针小针码,中间正常

台湾泛达温控仪表

台湾泛达温控仪表

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16
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TC9400

TC9400

TC9400/9401/9402Features:VOLTAGE-TO-FREQUENCY•Choice of Linearity:-TC9401: 0.01%-TC9400: 0.05%-TC9402: 0.25%•DC to 100 kHz (F/V) or 1 Hz to 100 kHz (V/F)•Low Power Dissipation: 27 mW (Typ.)•Single/Dual Supply Operation:-+8V to +15V or ±4V to ±7.5V•Gain Temperature Stability: ±25 ppm/°C (Typ.)•Programmable Scale FactorFREQUENCY-TO-VOLTAGE •Operation: DC to 100 kHz•Choice of Linearity:-TC9401: 0.02%-TC9400: 0.05%-TC9402: 0.25%•Programmable Scale Factor Applications:•μP Data Acquisition•13-bit Analog-to-Digital Converters•Analog Data Transmission and Recording •Phase Locked Loops•Frequency Meters/Tachometer•Motor Control•FM DemodulationDevice Selection Table General Description:The TC9400/TC9401/TC9402 are low-cost Voltage-to-Frequency (V/F) converters, utilizing low-power CMOS technology. The converters accept a variable analog input signal and generate an output pulse train, whose frequency is linearly proportional to the input voltage. The devices can also be used as highly accurate Fre-quency-to-Voltage (F/V) converters, accepting virtually any input frequency waveform and providing a linearly proportional voltage output.A complete V/F or F/V system only requires the addi-tion of two capacitors, three resistors, and reference voltage.Part Number Linearity(V/F)PackageTemperatureRangeTC9400COD0.05%14-Pin SOIC(Narrow)0°C to +70°CTC9400CPD0.05%14-Pin PDIP0°C to +70°CTC9400EJD0.05%14-Pin CerDIP-40°C to +85°CTC9401CPD0.01%14-Pin PDIP0°C to +70°CTC9401EJD0.01%14-Pin CerDIP-40°C to +85°CTC9402CPD0.25%14-Pin PDIP0°C to +70°CTC9402EJD0.25%14-Pin CerDIP°C to +85°CVoltage-to-Frequency/Frequency-to-Voltage Converters© 2006 Microchip Technology Inc.DS21483C-page 1TC9400/9401/9402DS21483C-page 2© 2006 Microchip Technology Inc.TC9400/9401/94021.0ELECTRICALCHARACTERISTICSAbsolute Maximum Ratings*V DD – V SS ...........................................................+18V I IN.......................................................................10 mA V OUTMAX– V OUT Common (23V)V REF – V SS ..........................................................-1.5V Storage Temperature Range..............-65°C to +150°C Operating Temperature Range:C Device...........................................0°C to +70°C E Device.........................................-40°C to +85°C Package Dissipation (T A≤ 70°C):8-Pin CerDIP.............................................800 mW 8-Pin Plastic DIP.......................................730 mW 8-Pin SOIC................................................470 mW *Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.TABLE 1-1:TC940X ELECTRICAL SPECIFICATIONSElectrical Characteristics: V DD = +5V, V SS = -5V, V GND = 0V, V REF = -5V, R BIAS = 100 kΩ, Full Scale= 10 kHz, unless otherwise specified. T A = +25°C, unless temperature range is specified (-40°C to +85°C for E device, 0°C to +70°C for C device).Parameter Min Typ Max Min Typ Max Min Typ Max Units Test Conditions Voltage-to-FrequencyAccuracy TC9400TC9401TC9402Linearity 10 kHz—0.01 0.05—0.0040.01—0.05 0.25%Full Scale Output Deviation from Straight Line Between Normalized Zero and Full Scale InputLinearity 100 kHz—0.1 0.25—0.040.08—0.25 0.5%Full Scale Output Deviation from Straight Line Between Normalized Zero Read-ing and Full Scale InputGain Temperature Drift (Note 1)—±25 ±40—±25±40— ±50±100 ppm/°CFull ScaleVariation in Gain A dueto Temperature ChangeGain Variance—±10——±10—— ±10—% ofNominal Variation from Ideal AccuracyZero Offset (Note 2)—±10 ±50—±10±50— ±20±100mV Correction at ZeroAdjust for Zero Outputwhen Input is ZeroZero Temperature Drift (Note 1)—±25±50—±25±50— ±50±100μV/°C Variation in Zero OffsetDue to TemperatureChangeNote1:Full temperature range; not tested.2: I IN = 0.3:Full temperature range, I OUT = 10 mA.4:I OUT = 10 μA.5:Threshold Detect = 5V, Amp Out = 0V, full temperature range.6:10 Hz to 100 kHz; not tested.7:5μsec minimum positive pulse width and 0.5μsec minimum negative pulse width.8:t R = t F = 20nsec.9:R L≥ 2 kΩ, tested @ 10 kΩ.10:Full temperature range, V IN = -0.1V.© 2006 Microchip Technology Inc.DS21483C-page 3TC9400/9401/9402DS21483C-page 4© 2006 Microchip Technology Inc.Analog Input I IN Full Scale—10——10——10—μAFull Scale Analog Input Current to achieve Specified Accuracy I IN Over Range ——50——50— —50μA Over Range Current Response Time —2——2——2—CycleSettling Time to 0.1% Full ScaleDigital Section TC9400TC9401TC9402V SAT @ I OL = 10mA —0.20.4—0.20.4—0.20.4V Logic “0” Output Voltage (Note 3)V OUT MAX – V OUT Common (Note 4)——18——18——18VVoltage RangeBetween Output and CommonPulse Frequency Output Width—3——3——3—μsecFrequency-to-VoltageSupply Current I DD Quiescent (Note 5)—1.56—1.56—310mACurrent Required from Positive Supply during OperationI SS Quiescent (Note 5) —-1.5-6—-1.5-6—-3-10mACurrent Required from Negative Supply during OperationV DD Supply 4—7.54—7.54—7.5V Operating Range of Positive Supply V SS Supply -4—-7.5-4—-7.5-4—-7.5VOperating Range of Negative SupplyReference Voltage V REF – V SS -2.5——-2.5——-2.5——VRange of Voltage Reference InputAccuracy Non-Linearity (Note 10)—0.020.05—0.010.02—0.050.25% Full Scale Deviation from ideal Transfer Function as aPercentage Full Scale VoltageInput Frequency Range(Notes 7 and 8)10—100k 10—100k 10—100kHzFrequency Range for Specified Non-LinearityFrequency Input TABLE 1-1:TC940X ELECTRICAL SPECIFICATIONS (CONTINUED)Electrical Characteristics: V DD = +5V, V SS = -5V, V GND = 0V, V REF = -5V, R BIAS = 100 k Ω, Full Scale = 10 kHz, unless otherwise specified. T A = +25°C, unless temperature range is specified (-40°C to +85°C for E device, 0°C to +70°C for C device).Parameter MinTypMaxMinTypMaxMinTypMaxUnitsTest ConditionsNote 1:Full temperature range; not tested.2: I IN = 0.3:Full temperature range, I OUT = 10 mA.4:I OUT = 10 μA.5:Threshold Detect = 5V, Amp Out = 0V, full temperature range.6:10 Hz to 100 kHz; not tested.7:5μsec minimum positive pulse width and 0.5μsec minimum negative pulse width.8:t R = t F = 20nsec.9:R L ≥ 2 k Ω, tested @ 10 k Ω.10:Full temperature range, V IN = -0.1V.© 2006 Microchip Technology Inc.DS21483C-page 5TC9400/9401/9402Positive Excursion0.4—V DD0.4—V DD0.4—V DDVVoltage Required to Turn Threshold Detector On Negative Excursion -0.4-2-0.4—-2-0.4—-2VVoltage Required to Turn Threshold Detector Off Minimum Positive Pulse Width (Note 8)—5——5——5—μsecTime betweenThreshold Crossings Minimum Negative Pulse Width (Note 8)—0.5——0.5——0.5—μsecTime BetweenThreshold CrossingsInput Impedance —10——10——10M ΩAnalog Outputs TC9400TC9401TC9402Output Voltage (Note 9)—V DD – 1——V DD – 1——V DD – 1—VVoltage Range of Op Amp Output for Speci-fied Non-Linearity Output Loading 2——2——2——k ΩResistive Loading at Output of Op AmpSupply Current TC9400TC9401TC9402I DD Quiescent (Note 10)— 1.56— 1.56—310mACurrent Required from Positive Supply During OperationI SS Quiescent (Note 10)—-1.5-6-1.5-6—-3-10mACurrent Required from Negative Supply During Operation V DD Supply 4—7.54—7.54—7.5V Operating Range of Positive Supply V SS Supply -4—-7.5-4—-7.5-4—-7.5VOperating Range of Negative SupplyReference Voltage V REF – V SS -2.5——-2.5——-2.5——VRange of Voltage Reference InputTABLE 1-1:TC940X ELECTRICAL SPECIFICATIONS (CONTINUED)Electrical Characteristics: V DD = +5V, V SS = -5V, V GND = 0V, V REF = -5V, R BIAS = 100 k Ω, Full Scale = 10 kHz, unless otherwise specified. T A = +25°C, unless temperature range is specified (-40°C to +85°C for E device, 0°C to +70°C for C device).Parameter Min Typ Max Min Typ Max Min Typ Max Units Test Conditions Note 1:Full temperature range; not tested.2: I IN = 0.3:Full temperature range, I OUT = 10 mA.4:I OUT = 10 μA.5:Threshold Detect = 5V, Amp Out = 0V, full temperature range.6:10 Hz to 100 kHz; not tested.7:5μsec minimum positive pulse width and 0.5μsec minimum negative pulse width.8:t R = t F = 20nsec.9:R L ≥ 2 k Ω, tested @ 10 k Ω.10:Full temperature range, V IN = -0.1V.TC9400/9401/9402DS21483C-page 6© 2006 Microchip Technology Inc.2.0PIN DESCRIPTIONSThe descriptions of the pins are listed in Table 2-1.TABLE 2-1:PIN FUNCTION TABLEPin No.14-Pin PDIP/CERDIP 14-Pin SOIC (Narrow)Symbol Description1I BIAS This pin sets bias current in the TC9400. Connect to V SS through a 100 k Ω resistor. 2 ZERO ADJLow frequency adjustment input.3I IN Input current connection for the V/F converter.4V SS Negative power supply voltage connection, typically -5V.5V REF OUT Reference capacitor connection.6GND Analog ground.7V REF Voltage reference input, typically -5V.8PULSE FREQOUT Frequency output. This open drain output will pulse LOW each time the Freq. Threshold Detector limit is reached. The pulse rate is proportional to input voltage.9OUTPUT COMMON Source connection for the open drain output FETs.10FREQ/2 OUT This open drain output is a square wave at one-half the frequency of the pulse output (Pin 8). Output transitions of this pin occur on the rising edge of Pin 8.11THRESHOLD DETECTORInput to the Threshold Detector. This pin is the frequency input during F/V operation.12AMPLIFIER OUT Output of the integrator amplifier.13NC No internal connection.14V DDPositive power supply connection, typically +5V.TC9400/9401/94023.0DETAILED DESCRIPTION3.1Voltage-to-Frequency (V/F) CircuitDescriptionThe TC9400 V/F converter operates on the principal of charge balancing. The operation of the TC9400 is eas-ily understood by referring to Figure3-1. The input volt-age (V IN) is converted to a current (I IN) by the input resistor. This current is then converted to a charge on the integrating capacitor and shows up as a linearly decreasing voltage at the output of the op amp. The lower limit of the output swing is set by the threshold detector, which causes the reference voltage to be applied to the reference capacitor for a time period long enough to charge the capacitor to the reference volt-age. This action reduces the charge on the integrating capacitor by a fixed amount (q = C REF x V REF), causing the op amp output to step up a finite amount.At the end of the charging period, C REF is shorted out. This dissipates the charge stored on the reference capacitor, so that when the output again crosses zero, the system is ready to recycle. In this manner, the con-tinued discharging of the integrating capacitor by the input is balanced out by fixed charges from the refer-ence voltage. As the input voltage is increased, the number of reference pulses required to maintain balance increases, which causes the output frequency to also increase. Since each charge increment is fixed, the increase in frequency with voltage is linear. In addi-tion, the accuracy of the output pulse width does not directly affect the linearity of the V/F. The pulse must simply be long enough for full charge transfer to take place.The TC9400 contains a “self-start” circuit to ensure the V/F converter always operates properly when power is first applied. In the event that, during power-on, the op amp output is below the threshold and C REF is already charged, a positive voltage step will not occur. The op amp output will continue to decrease until it crosses the -3.0V threshold of the “self-start” comparator. When this happens, an internal resistor is connected to the op amp input, which forces the output to go positive until the TC9400 is in its normal Operating mode.The TC9400 utilizes low-power CMOS processing for low input bias and offset currents, with very low power dissipation. The open drain N-channel output FETs provide high voltage and high current sink capability.© 2006 Microchip Technology Inc.DS21483C-page 7TC9400/9401/94023.2Voltage-to-Time MeasurementsThe TC9400 output can be measured in the timedomain as well as the frequency domain. Some micro-computers, for example, have extensive timing capabil-ity, but limited counter capability. Also, the responsetime of a time domain measurement is only the periodbetween two output pulses, while the frequency mea-surement must accumulate pulses during the entirecounter time-base period.Time measurements can be made from either theTC9400’s PULSE FREQ OUT output, or from theFREQ/2 OUT output. The FREQ/2 OUT outputchanges state on the rising edge of PULSE FREQOUT, so FREQ/2 OUT is a symmetrical square wave atone-half the pulse output frequency. Timing measure-ments can, therefore, be made between successivePULSE FREQ OUT pulses, or while FREQ/2 OUT ishigh (or low).DS21483C-page 8© 2006 Microchip Technology Inc.TC9400/9401/94024.0PIN FUNCTIONS4.1Threshold Detector InputIn the V/F mode, this input is connected to the AMPLI-FIER OUT output (Pin 12) and triggers a 3μsec pulse when the input voltage passes through its threshold. In the F/V mode, the input frequency is applied to this input.The nominal threshold of the detector is half way between the power supplies, or (V DD + V SS)/2 ±400 mV. The TC9400’s charge balancing V/F technique is not dependent on a precision comparator threshold, because the threshold only sets the lower limit of the op amp output. The op amp’s peak-to-peak output swing, which determines the frequency, is only influenced by external capacitors and by V REF.4.2Pulse Freq OutThis output is an open drain N-channel FET, which provides a pulse waveform whose frequency is propor-tional to the input voltage. This output requires a pull-up resistor and interfaces directly with MOS, CMOS, and TTL logic (see Figure4-1).4.3Freq/2 OutThis output is an open drain N-channel FET, which pro-vides a square wave one-half the frequency of the pulse frequency output. The FREQ/2 OUT output will change state on the rising edge of PULSE FREQ OUT. This output requires a pull-up resistor and interfaces directly with MOS, CMOS, and TTL logic.4.4Output CommonThe sources of both the FREQ/2 OUT and the PULSE FREQ OUT are connected to this pin. An output level swing from the drain voltage to ground, or to the V SS supply, may be obtained by connecting this pin to the appropriate point.4.5R BIASAn external resistor, connected to V SS, sets the bias point for the TC9400. Specifications for the TC9400 are based on R BIAS = 100 kΩ ±10%, unless otherwise noted.Increasing the maximum frequency of the TC9400 beyond 100 kHz is limited by the pulse width of the pulse output (typically 3μsec). Reducing R BIAS will decrease the pulse width and increase the maximum operating frequency, but linearity errors will also increase. R BIAS can be reduced to 20 kΩ, which will typically produce a maximum full scale frequency of 500 kHz. 4.6Amplifier OutThis pin is the output stage of the operational amplifier. During V/F operation, a negative going ramp signal is available at this pin. In the F/V mode, a voltage proportional to the frequency input is generated.4.7Zero AdjustThis pin is the non-inverting input of the operational amplifier. The low frequency set point is determined by adjusting the voltage at this pin.4.8I INThe inverting input of the operational amplifier and the summing junction when connected in the V/F mode. An input current of 10 μA is specified, but an over range current up to 50 μA can be used without detrimental effect to the circuit operation. I IN connects the summing junction of an operational amplifier. Voltage sources cannot be attached directly, but must be buffered by external resistors.© 2006 Microchip Technology Inc.DS21483C-page 9TC9400/9401/9402DS21483C-page 10© 2006 Microchip Technology Inc.4.9V REFA reference voltage from either a precision source, or the V SS supply is applied to this pin. Accuracy of the TC9400 is dependent on the voltage regulation and temperature characteristics of the reference circuitry.Since the TC9400 is a charge balancing V/F converter,the reference current will be equal to the input current.For this reason, the DC impedance of the reference voltage source must be kept low enough to prevent lin-earity errors. For linearity of 0.01%, a reference imped-ance of 200W or less is recommended. A 0.1 μF bypass capacitor should be connected from V REF to ground.4.10V REF OutThe charging current for C REF is supplied through thispin. When the op amp output reaches the threshold level, this pin is internally connected to the reference voltage and a charge, equal to V REF x C REF , is removed from the integrator capacitor. After about 3μsec, this pin is internally connected to the summing junction of the op amp to discharge C REF . Break-before-make switch-ing ensures that the reference voltage is not directly applied to the summing junction.5.0VOLTAGE-TO-FREQUENCY (V/F) CONVERTER DESIGN INFORMATION5.1Input/Output RelationshipsThe output frequency (F OUT ) is related to the analog input voltage (V IN ) by the transfer equation:EQUATION 5-1:5.2External Component Selection5.2.1R INThe value of this component is chosen to give a full scale input current of approximately 10 μA:EQUATION 5-2:EQUATION 5-3:Note that the value is an approximation and the exact relationship is defined by the transfer equation. In prac-tice, the value of R IN typically would be trimmed to obtain full scale frequency at V IN full scale (see Section 5.3 “Adjustment Procedure”, Adjustment Procedure). Metal film resistors with 1% tolerance or better are recommended for high accuracy applications because of their thermal stability and low noise gener-ation.5.2.2C INTThe exact value is not critical but is related to C REF by the relationship:3C REF ≤ C INT ≤ 10C REFImproved stability and linearity are obtained when C INT ≤4C REF . Low leakage types are recommended,although mica and ceramic devices can be used in applications where their temperature limits are not exceeded. Locate as close as possible to Pins 12and 13.Frequency Out =V IN R IN, x1(V REF )(V REF )V IN FULLSCALE10 μAR IN ≅10V10 μAR IN ≅= 1 M Ω5.2.3C REFThe exact value is not critical and may be used to trim the full scale frequency (see Section7.1 “Input/Out-put Relationships”, Input/Output Relationships). Glass film or air trimmer capacitors are recommended because of their stability and low leakage. Locate as close as possible to Pins 5 and 3 (see Figure).FIGURE 5-1:Recommended CREF vs.VREF5.2.4V DD, V SSPower supplies of ±5V are recommended. For high accuracy requirements, 0.05% line and load regulation and 0.1 μF disc decoupling capacitors, located near the pins, are recommended.5.3Adjustment ProcedureFigure3-1 shows a circuit for trimming the zero loca-tion. Full scale may be trimmed by adjusting R IN, V REF, or C REF. Recommended procedure for a 10 kHz full scale frequency is as follows:1.Set V IN to 10 mV and trim the zero adjust circuitto obtain a 10 Hz output frequency.2.Set V IN to 10V and trim either R IN, V REF, or C REFto obtain a 10 kHz output frequency.If adjustments are performed in this order, there should be no interaction and they should not have to be repeated.5.4Improved Single Supply V/FConverter OperationA TC9400, which operates from a single 12 to 15V vari-able power source, is shown in Figure5-2. This circuit uses two Zener diodes to set stable biasing levels for the TC9400. The Zener diodes also provide the refer-ence voltage, so the output impedance and tempera-ture coefficient of the Zeners will directly affect power supply rejection and temperature performance. Full scale adjustment is accomplished by trimming the input current.Trimming the reference voltage is not recommended for high accuracy applications unless an op amp is used as a buffer, because the TC9400 requires a low-impedance reference (see Section4.9 “VREF”, V REF pin description, for more information).The circuit of Figure5-2 will directly interface with CMOS logic operating at 12V to 15V. TTL or 5V CMOS logic can be accommodated by connecting the output pull-up resistors to the +5V supply. An optoisolator can also be used if an isolated output is required; also, see Figure5-3.FIGURE 5-2:Voltage-to-FrequencyFIGURE 5-3:Fixed Voltage – Single Supply Operation6.0FREQUENCY-TO-VOLTAGE(F/V) CIRCUIT DESCRIPTION When used as an F/V converter, the TC9400 generates an output voltage linearly proportional to the input frequency waveform.Each zero crossing at the threshold detector’s input causes a precise amount of charge (q = C REF∞ V REF) to be dispensed into the op amp’s summing junction. This charge, in turn, flows through the feedback resis-tor, generating voltage pulses at the output of the op amp. A capacitor (C INT) across R INT averages these pulses into a DC voltage, which is linearly proportional to the input frequency.7.0F/V CONVERTER DESIGN INFORMATION7.1Input/Output RelationshipsThe output voltage is related to the input frequency (F IN ) by the transfer equation:EQUATION 7-1:The response time to a change in F IN is equal to (R INT C INT ). The amount of ripple on V OUT is inversely proportional to C INT and the input frequency.C INT can be increased to lower the ripple. Values of 1 μF to 100 μF are perfectly acceptable for low frequencies.When the TC9400 is used in the Single Supply mode,V REF is defined as the voltage difference between Pin 7and Pin 2.7.2Input Voltage LevelsThe input frequency is applied to the Threshold Detec-tor input (Pin 11). As discussed in the V/F circuit section of this data sheet, the threshold of Pin 11 is approxi-mately (V DD + V SS )/2 ±400 mV. Pin 11’s input voltage range extends from V DD to about 2.5V below the thresh-old. If the voltage on Pin 11 goes more than 2.5 volts below the threshold, the V/F mode start-up comparator will turn on and corrupt the output voltage. The Thresh-old Detector input has about 200 mV of hysteresis.In ±5V applications, the input voltage levels for the TC9400 are ±400 mV, minimum. If the frequency source being measured is unipolar, such as TTL or CMOS operating from a +5V source, then an AC coupled level shifter should be used. One such circuit is shown in Figure 7-1(a).The level shifter circuit in Figure 7-1(b) can be used in single supply F/V applications. The resistor divider ensures that the input threshold will track the supply voltages. The diode clamp prevents the input from going far enough in the negative direction to turn on the start-up comparator. The diode’s forward voltage decreases by 2.1mV/°C, so for high ambient tempera-ture operation, two diodes in series are recommended;also, see Figure .FIGURE 7-1:Frequency Input Level ShifterV OUT = [V REF C REF R INT ] F INFIGURE 7-2:F/V Single Supply F/V Converter7.3Input BufferF OUT and F OUT /2 are not used in the F/V mode. How-ever, these outputs may be useful for some applica-tions, such as a buffer to feed additional circuitry. Then,F OUT will follow the input frequency waveform, except that F OUT will go high 3μsec after F IN goes high;F OUT /2 will be square wave with a frequency of one-half F OUT .If these outputs are not used, Pins 8, 9 and 10 should be connected to ground (see Figure 7-3 and Figure 7-4).FIGURE 7-3:F/V Digital OutputsFIGURE 7-4:DC – 10 kHz Converter7.4Output Filtering The output of the TC9400 has a sawtooth ripple super-imposed on a DC level. The ripple will be rejected if the TC9400 output is converted to a digital value by an inte-grating Analog-to-Digital Converter, such as the TC7107 or TC7109. The ripple can also be reduced by increasing the value of the integrating capacitor,although this will reduce the response time of the F/V converter.The sawtooth ripple on the output of an F/V can be eliminated without affecting the F/V’s response time by using the circuit in Figure 7-1. The circuit is a capaci-tance multiplier, where the output coupling capacitor is multiplied by the AC gain of the op amp. A moderately fast op amp, such as the TL071, should be used.FIGURE 7-5:Ripple Filter8.0F/V POWER-ON RESETIn F/V mode, the TC9400 output voltage will occasion-ally be at its maximum value when power is first applied. This condition remains until the first pulse is applied to F IN. In most frequency measurement appli-cations, this is not a problem because proper operation begins as soon as the frequency input is applied.In some cases, however, the TC9400 output must be zero at power-on without a frequency input. In such cases, a capacitor connected from Pin 11 to V DD will usually be sufficient to pulse the TC9400 and provide a Power-on Reset (see Figure8-1 (a) and (b)). Where predictable power-on operation is critical, a more complicated circuit, such as Figure8-1 (b), may be required.FIGURE 8-1:Power-On Operation/Reset9.0PACKAGE INFORMATION 9.1Package Marking Information Package marking data is not available at this time.TC9400/9401/9402THE MICROCHIP WEB SITEMicrochip provides online support via our WWW site at . This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information:•Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software•General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing•Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representativesCUSTOMER CHANGE NOTIFICATION SERVICEMicrochip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at , click on Customer Change Notification and follow the registration instructions.CUSTOMER SUPPORTUsers of Microchip products can receive assistance through several channels:•Distributor or Representative•Local Sales Office•Field Application Engineer (FAE)•Technical Support•Development Systems Information Line Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document.Technical support is available through the web site at: © 2006 Microchip Technology Inc.DS21483C-page 21。

T50F-C0,T100F-C,T75F-C0,T100F-C0, 规格书,Datasheet 资料

T50F-C0,T100F-C,T75F-C0,T100F-C0, 规格书,Datasheet 资料

Material Polyethylene
Weather Resistant Polyethylene
Color Natural Natural Natural Natural Brown White Pink Red Orange Yellow Green Blue Purple Gray Natural Natural Natural Brown White Pink Red Orange Yellow Green Blue Purple Gray Natural Natural Natural Black Black Black Black Black Black Black Black Black Black
Length 100' (30.5M) 100' (30.5M) 10' (3.0M) 100' (30.5M) 100' (30.5M) 100' (30.5M) 100' (30.5M) 100' (30.5M) 100' (30.5M) 100' (30.5M) 100' (30.5M) 100' (30.5M) 100' (30.5M) 100' (30.5M) 100' (30.5M) 10' (3.0M) 100' (30.5M) 100' (30.5M) 100' (30.5M) 100' (30.5M) 100' (30.5M) 100' (30.5M) 100' (30.5M) 100' (30.5M) 100' (30.5M) 100' (30.5M) 100' (30.5M) 100' (30.5M) 100' (30.5M) 100' (30.5M) 100' (30.5M) 10' (3.0M) 10' (3.0M) 100'(30.5M) 100' (30.5M) 10' (3.0M) 100' (30.5M) 100' (30.5M) 100' (30.5M) 100' (30.5M)
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