A Multi-Core System-on-Chip Architecture for Multimedia Signal

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有关芯片英语作文

有关芯片英语作文

有关芯片英语作文In the heart of every modern electronic device lies a tiny yet incredibly powerful component - the microchip. This English composition aims to explore the evolution of microchips, their technological advancements, and their profound impact on contemporary society.The journey of the microchip began in the late 1950s with the invention of the integrated circuit by Jack Kilby and Robert Noyce. This breakthrough allowed multiple electronic components to be etched onto a single silicon chip, paving the way for the miniaturization of electronics and the birth of the digital age.Over the decades, the microchip has undergone a remarkable transformation. The advent of Very-Large-Scale Integration (VLSI) technology enabled the placement of thousands of transistors on a single chip, which has since grown tobillions with the rise of Ultra-Large-Scale Integration (ULSI). This exponential growth in processing power has been encapsulated by Moore's Law, which predicts the doubling of transistors on a microchip every two years, leading to increased performance and reduced costs.The impact of microchips on society is ubiquitous and profound. They are the brains behind computers, smartphones, and the internet, which have revolutionized communication, business, and education. In the realm of entertainment,microchips have transformed gaming, music, and film,providing high-definition experiences that were once unimaginable.Moreover, microchips are the driving force behind advancements in artificial intelligence, machine learning,and robotics. They enable smart devices to learn from their environments, making our lives more convenient and efficient. In healthcare, microchips are used in medical equipment and wearable devices, providing real-time health monitoring and improving patient outcomes.However, the widespread use of microchips also presents challenges. Cybersecurity becomes a critical concern as more devices become interconnected. The potential for databreaches and hacking incidents is a constant threat that must be addressed through robust encryption and security protocols.In conclusion, microchips are the unsung heroes of modern technology. Their evolution has been a testament to human ingenuity and the relentless pursuit of innovation. As we continue to rely on these tiny powerhouses, it is imperativeto navigate the complex ethical and security landscapes they present. The future of microchips holds the promise of even greater capabilities, and with responsible stewardship, they can continue to enrich our lives in unimaginable ways.。

基于IA架构的嵌入式微处理器

基于IA架构的嵌入式微处理器

DDR2 400/533
PCI-E
Max Display Resolution: LVDS: 1366x768 (24bit color)
USB 2.0 Controller
IDE ATA 100
SDVO: 1280x1024/
LPC HD Audio SDIO
HDTV 720P/1080i
8 USB 2.0 Host Ports
Legacy IO
PCI Express
Tolapai结构
Classic IA Partitioning 2004
CPU
MCH
Memory
ICH
I/O
I/O
Device Device
Communications Processor 2007
Integrated SoC with IA CPU Optimized power / performance
Graphics Video Decode
Acceleration PCI-E
PCI USB 2.0 USB Client
SDIO Display Ports Avg . Power1,2 Thermal Design
Power1,3 3DMark 03 3Dmark 05
Little River +ICH7U 22x22x2.4 + 15x15X1.4
Includes 1 USB 2.0 Client Port
BIOS SIO
Codec
USB 2.0 and PCI-E Ports For expansion
HD Audio
1 Power under BAPCO* Mobile Mark 2005 Office Productivity Work Load 2 Dependent on the SKU 3 USB OTG Not Supported

多核处理器核间的通信研究与实现免费范文

多核处理器核间的通信研究与实现免费范文

多核处理器核间的通信研究与实现摘要:针对多核处理器的特点提出一种新型的异构多核DSP处理器结构。

主处理器为通用处理器,作为控制密集型处理器核用于系统管理和控制;8个DSP作为计算密集型处理器核,用于大信息量融合计算。

详细设计8个DSP 之间的NoC互连结构。

首先采用2×4 2D Turos结构进行单个路由节点结构的设计,包括数据包格式、路由和仲裁设计;其次对路由节点进行编码、路由算法设计和确定节点路由方向。

该结构具有总线局部通信带宽高的优点,采用NoC 的易扩展性和NoC在各DSP之间通信的并行性使系统规模易于扩展并满足大批量数据传输要求。

最后通过仿真实验,验证了该设计的有效性,为后续多核处理器的设计与实现打下坚实的技术基础。

关键词:多核处理器;片上网络;拓扑结构;数据传输中图分类号: TN911?34; TP391 文献标识码: A 文章编号: 1004?373X (2016)16?0083?05Abstract: Aiming at the characteristics of multi?core processor, a new heterogeneous structure of multi?core DSP is put forward. The main processor is a common processor used for system management and control to control the intensive processor cores. Eight DSPs as the computation intensive processor cores are used to fuse and calculate the large amount of information. The structure of NoC interconnection among 8 DSPs was designed detailedly. The 2×4 2D Turos structure is used to design the single routing node structure, including data packet format design, routing design and arbitration design. And then the items of routing nodes coding, routing algorithm design and node routing direction determining were performed. This structure has the advantage of high bus local communication bandwidth. The extensibility of NoC and parallelism of NoC communication among DSPs are used to extend the system scale easily and satisfy the requirement of massive data transmission. The validity of the design was verified with simulation experiment, and it lays a solid technical foundation for follow?up design and implementation of multi?core processors.Keywords: multi?core processor; Network on Chip; topology structure;data transmission0 引言多核处理器是在一个芯片上集成多个处理器核,通过多核并行执行的方式来提高性能,对计算机体系结构的发展有着深远的影响[1?2]。

arm常用的名词解释

arm常用的名词解释

arm常用的名词解释ARM(Advanced RISC Machine)是一种常用的计算机架构,被广泛应用于移动设备、嵌入式系统和单片机等领域。

本文将对ARM常用的一些名词进行解释,以帮助读者更好地了解ARM架构。

1. RISC(Reduced Instruction Set Computer):精简指令集计算机。

相对于复杂指令集计算机(CISC),RISC采用简化指令集,每条指令都非常简单,执行速度快,并且易于设计和优化硬件。

2. 架构:计算机系统的基本设计和组织原则。

ARM架构设计了一套标准的指令集和寄存器组织,以及与之兼容的处理器核心,为ARM生态系统提供了一致的编程接口。

3. 处理器核心(Processor Core):ARM的核心部分,负责执行指令和进行算术逻辑运算。

常见的ARM处理器核心包括Cortex-A系列(用于应用处理器)、Cortex-M系列(用于嵌入式系统和微控制器)和Cortex-R系列(用于实时应用和嵌入式处理器)。

4. 指令集架构(Instruction Set Architecture):定义了一套计算机指令的规范和编码方式。

ARM指令集架构包括ARMv8-A、ARMv7-A、ARMv6-M等不同的版本,不同版本支持不同的指令集和功能。

5. 寄存器:位于处理器核心内部的高速存储器,用于存储指令执行过程中需要操作的数据。

ARM体系结构中,常见的寄存器包括通用寄存器、程序计数器、状态寄存器等。

6. 多核处理器(Multi-core Processor):使用多个处理器核心的处理器。

ARM 架构支持多核处理器的设计,使得多个核心可以同时进行计算任务,提高处理能力和并行性能。

7. SoC(System on a Chip):一种集成了多个功能组件的芯片,包括处理器核心、内存控制器、I/O接口等。

ARM架构广泛应用于SoC的设计,提供了高度集成的解决方案,节省了系统板块的空间和功耗。

中文翻译

中文翻译

QAM is a widely used multilevel modulation technique,with a variety of applications in data radio communication systems.Most existing implementations of QAM-based systems use high levels of modulation in order to meet the high data rate constraints of emerging applications.This work presents the architecture of a highly parallel QAM modulator,using MPSoC-based design flow and design methodology,which offers multirate modulation.The proposed MPSoC architecture is modular and provides dynamic reconfiguration of the QAM utilizing on-chip interconnection networks,offering high data rates(more than1 Gbps),even at low modulation levels(16-QAM).Furthermore,the proposed QAM implementation integrates a hardware-based resource allocation algorithm that can provide better throughput and fault tolerance,depending on the on-chip interconnection network congestion and run-time faults.Preliminary results from this work have been published in the Proceedings of the18th IEEE/IFIP International Conference on VLSI and System-on-Chip(VLSI-SoC2010).The current version of the work includes a detailed description of the proposed system architecture,extends the results significantly using more test cases,and investigates the impact of various design parameters.Furthermore,this work investigates the use of the hardware resource allocation algorithm as a graceful degradation mechanism,providing simulation results about the performance of the QAM in the presence of faulty components.Quadrature Amplitude Modulation(QAM)is a popular modulation scheme,widely used in various communication protocols such as Wi-Fi and Digital Video Broadcasting(DVB).The architecture of a digital QAM modulator/demodulator is typically constrained by several, often conflicting,requirements.Such requirements may include demanding throughput, high immunity to noise,flexibility for various communication standards,and low on-chip power.The majority of existing QAM implementations follow a sequential implementation approach and rely on high modulation levels in order to meet the emerging high data rate constraints.These techniques,however,are vulnerable to noise at a given transmission power,which reduces the reliable communication distance.The problem is addressed by increasing the number of modulators in a system,through emerging Software-Defined Radio (SDR)systems,which are mapped on MPSoCs in an effort to boost parallelism.These works, however,treat the QAM modulator as an individual system task,whereas it is a task that can further be optimized and designed with further parallelism in order to achieve high data rates,even at low modulation levels.Designing the QAM modulator in a parallel manner can be beneficial in many ways.Firstly, the resulting parallel streams(modulated)can be combined at the output,resulting in a system whose majority of logic runs at lower clock frequencies,while allowing for high throughput even at low modulation levels.This is particularly important as lower modulation levels are less susceptible to multipath distortion,provide power-efficiency and achieve low bit error rate(BER).Furthermore,a parallel modulation architecture can benefit multiple-input multiple-output(MIMO)communication systems,where information is sent and received over two or more antennas often shared among many ing multiple antennas at both transmitter and receiver offers significant capacity enhancement on many modern applications,including IEEE802.11n,3GPP LTE,and mobile WiMAX systems, providing increased throughput at the same channel bandwidth and transmit power.Inorder to achieve the benefit of MIMO systems,appropriate design aspects on the modulation and demodulation architectures have to be taken into consideration.It is obvious that transmitter architectures with multiple output ports,and the more complicated receiver architectures with multiple input ports,are mainly required.However,the demodulation architecture is beyond the scope of this work and is part of future work.This work presents an MPSoC implementation of the QAM modulator that can provide a modular and reconfigurable architecture to facilitate integration of the different processing units involved in QAM modulation.The work attempts to investigate how the performance of a sequential QAM modulator can be improved,by exploiting parallelism in two forms:first by developing a simple,pipelined version of the conventional QAM modulator,and second, by using design methodologies employed in present-day MPSoCs in order to map multiple QAM modulators on an underlying MPSoC interconnected via packet-based network-on-chip (NoC).Furthermore,this work presents a hardware-based resource allocation algorithm, enabling the system to further gain performance through dynamic load balancing.The resource allocation algorithm can also act as a graceful degradation mechanism,limiting the influence of run-time faults on the average system throughput.Additionally,the proposed MPSoC-based system can adopt variable data rates and protocols simultaneously,taking advantage of resource sharing mechanisms.The proposed system architecture was simulated using a high-level simulator and implemented/evaluated on an FPGA platform.Moreover, although this work currently targets QAM-based modulation scenarios,the methodology and reconfiguration mechanisms can target QAM-based demodulation scenarios as well. However,the design and implementation of an MPSoC-based demodulator was left as future work.While an MPSoC implementation of the QAM modulator is beneficial in terms of throughput, there are overheads associated with the on-chip network.As such,the MPSoC-based modulator was compared to a straightforward implementation featuring multiple QAM modulators,in an effort to identify the conditions that favor the MPSoC implementation. Comparison was carried out under variable incoming rates,system configurations and fault conditions,and simulation results showed on average double throughput rates during normal operation and~25%less throughput degradation at the presence of faulty components,at the cost of approximately35%more area,obtained from an FPGA implementation and synthesis results.The hardware overheads,which stem from the NoC and the resource allocation algorithm,are well within the typical values for NoC-based systems and are adequately balanced by the high throughput rates obtained.Most of the existing hardware implementations involving QAM modulation/demodulation follow a sequential approach and simply consider the QAM as an individual module.There has been limited design exploration,and most works allow limited reconfiguration,offering inadequate data rates when using low modulation levels.The latter has been addressed through emerging SDR implementations mapped on MPSoCs,that also treat the QAM modulation as an individual system task,integrated as part of the system,rather than focusing on optimizing the performance of the modulator.Works inuse a specific modulation type;they can,however,be extended to use higher modulation levels in order toincrease the resulting data rate.Higher modulation levels,though,involve more divisions of both amplitude and phase and can potentially introduce decoding errors at the receiver,as the symbols are very close together(for a given transmission power level)and one level of amplitude may be confused(due to the effect of noise)with a higher level,thus,distorting the received signal.In order to avoid this,it is necessary to allow for wide margins,and this can be done by increasing the available amplitude range through power amplification of the RF signal at the transmitter(to effectively spread the symbols out more);otherwise,data bits may be decoded incorrectly at the receiver,resulting in increased bit error rate(BER). However,increasing the amplitude range will operate the RF amplifiers well within their nonlinear(compression)region causing distortion.Alternative QAM implementations try to avoid the use of multipliers and sine/cosine memories,by using the CORDIC algorithm, however,still follow a sequential approach.Software-based solutions lie in designing SDR systems mapped on general purpose processors and/or digital signal processors(DSPs),and the QAM modulator is usually considered as a system task,to be scheduled on an available processing unit.Works inutilize the MPSoC design methodology to implement SDR systems,treating the modulator as an individual system task.Results in show that the problem with this approach is that several competing tasks running in parallel with QAM may hurt the performance of the modulation, making this approach inadequate for demanding wireless communications in terms of throughput and energy efficiency.Another particular issue,raised in,is the efficiency of the allocation algorithm.The allocation algorithm is implemented on a processor,which makes allocation slow.Moreover,the policies used to allocate tasks(random allocation and distance-based allocation)to processors may lead to on-chip contention and unbalanced loads at each processor,since the utilization of each processor is not taken into account.In,a hardware unit called CoreManager for run-time scheduling of tasks is used,which aims in speeding up the allocation algorithm.The conclusions stemming from motivate the use of exporting more tasks such as reconfiguration and resource allocation in hardware rather than using software running on dedicated CPUs,in an effort to reduce power consumption and improve the flexibility of the system.This work presents a reconfigurable QAM modulator using MPSoC design methodologies and an on-chip network,with an integrated hardware resource allocation mechanism for dynamic reconfiguration.The allocation algorithm takes into consideration not only the distance between partitioned blocks(hop count)but also the utilization of each block,in attempt to make the proposed MPSoC-based QAM modulator able to achieve robust performance under different incoming rates of data streams and different modulation levels. Moreover,the allocation algorithm inherently acts as a graceful degradation mechanism, limiting the influence of run-time faults on the average system throughput.we used MPSoC design methodologies to map the QAM modulator onto an MPSoC architecture,which uses an on-chip,packet-based NoC.This allows a modular, "plug-and-play"approach that permits the integration of heterogeneous processing elements, in an attempt to create a reconfigurable QAM modulator.By partitioning the QAM modulator into different stand-alone tasks mapped on Processing Elements(PEs),weown SURF.This would require a context-addressable memory search and would expand the hardware logic of each sender PE's NIRA.Since one of our objectives is scalability,we integrated the hop count inside each destination PE's packet.The source PE polls its host NI for incoming control packets,which are stored in an internal FIFO queue.During each interval T,when the source PE receives the first control packet,a second timer is activatedfor a specified number of clock cycles,W.When this timer expires,the polling is halted and a heuristic algorithm based on the received conditions is run,in order to decide the next destination PE.In the case where a control packet is not received from a source PE in the specified time interval W,this PE is not included in the algorithm.This is a key feature of the proposed MPSoC-based QAM modulator;at extremely loaded conditions,it attempts to maintain a stable data rate by finding alternative PEs which are less busy.QAM是一种广泛应用的多级调制技术,在数据无线电通信系统中应用广泛。

华为突破技术封锁自主研发芯片英语作文

华为突破技术封锁自主研发芯片英语作文

Huawei's Breakthrough in Self-Developed Chips: Overcoming Technological BlockadesHuawei has emerged as a global leader in the technology sector, particularly in telecommunications and consumer electronics. However, the company has faced significant challenges due to geopolitical tensions and subsequent technological blockades imposed by various countries. In response to these hurdles, Huawei has made remarkable strides in self-developing its own chips, showcasing its resilience and innovation. This essay explores the significance of Huawei's breakthrough in chip development and its implications for the global tech industry.The imposition of technological blockades on Huawei, particularly by the United States, has created substantial obstacles for the company. These restrictions have limited Huawei's access to critical components and technologies, especially those involving semiconductors and advanced chipsets. As a result, Huawei faced the daunting task of maintaining its competitive edge and ensuring the continuity of its product lines without relying on foreign suppliers.In response to these challenges, Huawei embarked on an ambitious journey towards self-reliance. The company invested heavily in research and development, allocating significant resources to its semiconductor subsidiary, HiSilicon. This strategic move aimed to reduce Huawei's dependence on external suppliers and establish a robust in-house capability for chip design and manufacturing.The breakthrough came with the development of Huawei's Kirin series of processors, which are used in the company’s smartphones and other devices. These chips, designed by HiSilicon, demonstrated competitive performance and efficiency, positioning Huawei as a formidable player in the semiconductor industry. The latest iterations of Kirin chips have showcased advanced features, including artificial intelligence capabilities and 5G compatibility, further cementing Huawei's technological prowess.Huawei's successful development of its own chips has significant implications for the global tech industry. Firstly, it highlights the potential for companies to innovate and overcome external pressures through substantial investment in research and development. Huawei's achievements can serve as an inspiration for other firms facing similar challenges, encouraging them to pursue self-reliance and innovation.Secondly, Huawei's breakthrough underscores the shifting dynamics of the global semiconductor market. Traditionally dominated by a few key players,the market is now witnessing the rise of new contenders from diverse regions. This increased competition can drive further innovation and potentially lead to more affordable and advanced technologies for consumers worldwide.Furthermore, Huawei's advancements in chip technology can contribute to the development of a more resilient global supply chain. By diversifying sources of critical components, the tech industry can reduce vulnerabilities and mitigate the risks associated with geopolitical tensions and trade restrictions.In conclusion, Huawei's breakthrough in self-developing chips represents a significant milestone in the face of technological blockades. Through substantial investment in research and development, the company has demonstrated its resilience and capability to innovate independently. This achievement not only strengthens Huawei's position in the global tech industry but also has broader implications for innovation, competition, and supply chain resilience. As Huawei continues to push the boundaries of technology, it serves as a powerful example of how challenges can be transformed into opportunities for growth and advancement.。

Thermo Scientific MK.4 ESD和Latch-Up测试系统中文名说明书

Thermo Scientific MK.4 ESD和Latch-Up测试系统中文名说明书

The Thermo Scientific MK.4 ESD and Latch-Up Test System is a complete,robust and feature-filled turn-key instrumentation test package, which performs automatic and manual HBM, MM, and Latch-Up tests on devices with pin counts up to 2304. It features the highest speed of test execution, lowest zap interval, and extensive parallelism that enables concurrent zapping with interleaved trace test capability to global and company driven quality standards.• Rapid-relay-based operations—up to 2304 channels• Solid state matrix topology for rapid, easy-to-use testing operations • Latch-Up stimulus and device biasing • High voltage power source chassis with patented HV isolation enables excellent pulse source performance • Advanced device preconditioning with six separate vector drive levels • Massive parallelism drives remarkable test and throughput speeds• Addresses global testing demands for devices that are smaller, faster and smarterThermo ScientificMK.4 ESD and Latch-up Test SystemIndustry standard, ESD and Latch-Up test system for producers ofmultifunction high pin-count devices Thirty years in the making! IC structure designers and QA program managers in manufacturing and test house facilities worldwide have embraced the Thermo Scientific™ MK.4, a versatile, powerful, and flexible, high yield test system. Easily upgradeable, the MK.4 ESD and Latch-Up Test System is fully capable of taking your test operations through ever-evolving regulatory and quality standards.Solid-State Matrix TopologyThe advanced rapid relay-based (modular matrix) hardware of the MK.4 system is at least ten times faster than mechanically driven ESD testers. The switching matrix, while providing consistent ESD paths, also allows any pin to be grounded, floated,vectored or connected to any of the installedV/I supplies. Furthermore, advancedalgorithms ensure accurate switching of HV, in support of pulse source technology, per recent JEDEC/ESDA trailing pulse standards.Advanced Controller and CommunicationsA powerful, extraordinarily fast embedded VME controller drives the highest Speed- of-Test execution available. Data transfer between the embedded controller and the tester’s PC server, is handled through TCP/IP communication protocols, minimizing data transfer time. The tester’s PC server can be accessed through internal networks, as well as through the internet allowing remote access to the system to determine the systems status or to gather result information.Product SpecificationsLatch-Up Stimulus and Device Biasing The MK.4 can be equipped with up to eight 100 V four-quadrant Voltage and Current (V/I) power supplies. Each V/I supply has a wide dynamic range enabling it to force and measure very low voltage at high current levels from 100 mV/10 A to 100 V/1 A. The system’s power supply matrix can deliver up to a total of 18A of current, which is distributed between the installed supplies. These supplies are able to provide a fast and versatile means of making DC parametric and leakage measurements as well as providing latch-up pulses, while offering total control and protection of the DUT.Advanced Device PreconditioningThe MK.4 system provides the most advanced device preconditioning capability available. The DUT can be vectored with complex vector patterns, providing excellent control over the device. Each pin can be driven using one of the 6 different vector supplies. The patterns can be up to 256k deep, running at clock speeds of up to 10 MHz. Device conditioning is easily verified, using the read back compare capability available on every pin.Thermo Scientific MK.4 Scimitar™Software Makes Programming Easy, while Providing Unsurpassed Programming FlexibilityThe MK.4 Windows®-based Scimitar operating software empowers users with the flexibility to easily set-up tests based on industry standards or company driven requirements.Device test plans can be created by importing existing text based device files, on the testers PC server or off-line from a satellite PC containing the application. The software also provides the capabilities to import test plans and device files from previous Thermo Scientific test systems.Test vectors from your functional testers can also be imported into the application. And of course, the vector application allows manual creation and debug of vector files.Device test plans and results are stored in an XML data base, providing unsurpassed results handling, sorting and data mining capabilities.Parallelism Drives Remarkable Test Throughput SpeedsThe MK.4 software enables ESD testing of up to twelve devices at one time using the multisite pulse source design.Embedded VME power supplies eliminate any communication delays that would be seen by using stand alone supplies. The embedded parametric (curve tracing) supply also provides fast, accurate curve tracing data to help you analyze your devices performance.The systems curve tracer can also be used as a failure analysis tool by allowing the comparison of stored, known good results, versus results from a new test sample or samples.Ready for Today’s Component Reliability Demands and Anticipating Those to Come ESD and Latch-Up testing of electronic and electrical goods can be very expensive aspects of the design and manufacturing process. This is especially true as market demands for products that are smaller, faster and smarter become the standard rather than the exception. The Thermo Scientific MK.4 leverages the technology and know- how gained over three decades of test system experience, as well as our in-depth participation and contributions to global regulatory bodies governing these changes, enabling today’s products to meet both global and industry-driven quality standards.The real key to our customers’ success is in anticipating what’s next. And to ensure that our customers possess the ability to evolve quickly to meet all change factors with efficiency and cost effectiveness.As such, the strategically-designed, field upgradeable architecture of the MK.4 system ensures a substantial return on investment over a very considerable test system lifecycle, as well as better short- and long-term qualityand ESD and Latch-Up test economies.Custom fixtures include universal package adaptors to enable the industry’s lowest cost-in-service high pin count device fixturing yetdevised. (2304-pin, Universal 1-mm pitch BGA package adaptor shown.)100W V/I Performance Thermo Scientific MK.4: eight-V/I configuration. Powerful V/Is can deliver a total of 800 W to the DUT, enabling complex testing of all advanced high power processors on your product roadmap.Solid state matrix topology for rapid, easy-to-use testing operations. Design ensures waveform integrity and reproducibility.General SpecificationsHuman Body Model (HBM) per ESDA/JEDEC JS-001-2014, MIL-STD 883E, and AEC Q100-002 25 V to 8 kV in steps of 1 V Test to multiple industry standards in one integrated system; no changing or alignment of pulse sources.Wizard-like prompts on multi-step user actions MachineModel (MM) per ESDA STM5.2, JEDEC/JESD22-A115, andAEC Q100-003, 25 V to 1.5 kV in steps of 1 VIntegrated pulse sources allow fast multi-site test execution.Latch-up testing per JEDEC/JESD 78 test pin and AECQ100-004Includes preconditioning, state read-back and full control of each.Rapid Relay-based operations at least 10 times faster thanrobotic-driven testersSuper fast test speeds.Test devices up to 2304 pins Systems available configured as 1152, 1728 or 2304 pins.Waveform network: Two, 12 site HBM (100 pF/1500Ω)and MM (200 pF/0Ω) pulse sources address up to 12devices simultaneouslyPatented design ensures waveform compliance for generations to come.Multiple device selection When multiple devices are present; graphical display indicates the devices selectedfor test; progress indicator displays the current device under test (DUT), along withtest status information.Unsurpassed software architecture Flexible programming, easy to use automated test setups, TCP/IP communication. Enables use of device set-up information Increased efficiency and accuracy from other test equipment, as well as deviceinformation import.Event trigger output Manages setup analysis with customized scope trigger capabilities.High voltage power supply chassis Modular chassis with patented HV isolation enables excellent pulse sourceperformance.Power supply sequencing Provides additional flexibility to meet more demanding test needs of integratedsystem-on-chip (SOC) flexibility.Manages ancillary test equipment through Plug-n feature allows the user to control external devices, such as scopes or heatstreams or other devices the Scimitar Plug-ins feature as required for automatedtesting.Pin drivers for use during Latch-Up testing Vector input/export capability from standard tester platforms and parametricmeasurements.256k vectors per pin with read-back Full real-time bandwidth behind each of the matrix pins.Six independent vector voltage levels Test complex I/O and Multi-Core products with ease.Up to 10MHz vector rate (programmable) Quickly and accurately set the device into the desired state for testing from an internalclock.Comprehensive engineering vector debug. Debug difficult part vectoring setups with flexibility.Up to eight separate V/I supplies (1 stimulus and 7 bias supplies) capability through the V/I matrix High accuracy DUT power, curve tracing, and Latch-up stimulus available; design also provides high current.Low resolution/high accuracy parametric measurements, using an embedded Keithley PSU With the optional Keithley PSU feature (replaces one V/I, nA measurements are achievable, allowing supply bus resistance measurement analysis to be performed.Multiple self-test diagnostic routines Ensures system integrity throughout the entire relay matrix, right up to the test socket Test reports: pre-stress, pre-fail (ESD) and post-fail data,as well as full curve trace and specific data pointmeasurementsData can be exported for statistical evaluation & presentation.Individual pin parametrics Allows the user to define V/I levels, compliance ranges, and curve trace parametersfor each pin individually.Enhanced data set features Report all data gathered for off-line reduction and analysis; core test data is readilyavailable; all data is stored in an easy-to-manipulate standard XML file structure. Interlocked safety cover Ensures no user access during test. All potentially lethal voltages are automaticallyterminated when cover is opened. Safety cover window can be easily modified toaccept 3rd party thermal heads.Dimensions60 cm (23.5 in) W x 99 cm (39 in) D x 127 cm (50 in) H© 2016 Thermo Fisher Scientific Inc. All rights reserved. Windows is a registered trademark of Microsoft Corporation in the United States and/or other countries. All other trademarks are the property of Thermo Fisher Scientific and its subsidiaries. Results may vary under different operating conditions. Specifications, terms and pricing are subject to change. Not all products are available in all countries. Please consult your local sales representative for details.Africa-Other +27 11 570 1840 Australia +61 2 8844 9500 Austria +43 1 333 50 34 0 Belgium +32 53 73 42 41 Canada +1 800 530 8447 China +86 10 8419 3588 Denmark +45 70 23 62 60 Europe-Other +43 1 333 50 34 0Finland /Norway/Sweden+46 8 556 468 00France +33 1 60 92 48 00Germany +49 6103 408 1014India +91 22 6742 9434Italy +39 02 950 591Japan +81 45 453 9100Latin America +1 608 276 5659Middle East +43 1 333 50 34 0Netherlands +31 76 579 55 55South Africa +27 11 570 1840Spain +34 914 845 965Switzerland +41 61 716 77 00UK +44 1442 233555USA +1 800 532 4752Thermo Fisher Scientific,San Jose, CA USA is ISO Certified. CTS.05102016Product SpecificationsScimitar Software FeaturesSummary Panel with easy navigation among device componentsWizard-like prompts on multi-step user actionsControl of external devices through the use of Scimitar’s user programmable Plug-in capabilities, in addition to the Event Trigger Outputs, which provide TTL control signals for external devices, such as power supplies or for triggering oscilloscopesFlexible parametric tests that are defined and placed at an arbitrary position within the executable test plan.Comprehensive results viewer that provides:• ESD and Static Latch-up data viewing capabilities• Curves viewer with zooming capabilities and the ability to add user comments• Data filtering on the following criteria – failed pins, failed results, final stress levels• A complete set or subset of results using user defined parameters• Sorting in ascending or descending order by various column criteriaTree-like logical view of the tests and test plans.Flexible data storage that provides the ability for the end-user to query the dataSeamless support of existing ZapMaster, MK.2, MK.4, and Paragon test plansCurve tracing with curve-to-curve and relative spot-to-spot comparisonOff-line curve analyzing, including third-party generated waveformsCanned JESD78A test (static latch-up only) that can be defined automaticallyPause/Resume test capabilitiesIntermediate results viewingAutomated waveform capture capability and analysis using the embedded EvaluWave software feature。

SoC架构

SoC架构
令可以访问存储器,以提高指令的执行效率。 – 编译复杂 – ARM、MIPS、PowerPC
精选ppt课件
24
处理器位宽
• 当前高性能嵌入式系统SoC的处理器多为32位处理器。所谓32位处理 器,即处理器内部的寄存器(包括地址寄存器与数据寄存器)位宽最 大为32位。低性能的嵌入式系统SoC一般多采用16位微控制器( micro-controllers),然而,随着工作负载的增加,此类系统逐渐开 始使用32位处理器。可以预见,在不久的将来,伴随高性能及超大存 储空间的需求,64位处理器将逐渐成为主流。
• 多个不同任务同时 操作,使用不同资 源
• 潜在加速比=流水 线级数
• 流水线的速率受限 于最慢的流水段
• 流水段的执行时间 如果不均衡,那么 加速比就会降低
• 开始填充流水线的 时间和最后排放流 水线的时间降低加 速比
• 相关将导致流水线
暂停
27
CPU基本概念
• CISC与RISC • 流水线技术 • 分支预测技术 • 乱序执行技术 • 标量与超标量处理器 • SIMD、MIMD和向量处理器 • VLIW处理器
DDR2 NAND
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12
SEP0718结构图
LCDC
I2S
HDMI PHY
AUDIO CODEC
GPS CTRL
UART (4)
I2S
BUS5 - APB32
AUDIO
SPI
CODEC
(3)
I2C
BUS3 - AHB32
DOWN SIZER
DMAC2
GPU
PHY
USB OTG
USB DMA
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28

Low power methodology manual for system-on-chip de

Low power methodology manual for system-on-chip de
Low power methodology manual for system-on-chip design pdf
这本ARM和Synopsys合作的《Low Power Methodology Manual》算是Low Power领域的Bible了。既然Synopsys参与了,那里面自然少不了UPF。从作者的背景来看,这本书是偏重实战的,事实的确如此。如果想偏重理论的话,建议看Jan Rabaey的《Low Power Design Essentials》,这本书以后再评。这本《Low Power Methodology Manual》的受众可以涵盖IC架构师、数字前端设 计、后端设计、Custom Design等等。虽然说低功耗技术最有用的还是从算法、架构(包括软件)等high level的方面去考虑更有效,但考虑到每款芯片的服务领域并不相同,抽出共性的难度较大,而从low level一点的电路设计来考虑,就有很多共性了,这也是这本书的着重点:low power的电路的设计与物理级实现。前面我们提过,这本书偏重实战,但也是普通SOC芯片flow里的实战。之所以说“普 通”,还有一些不普通的低功耗设计技术,比如大名鼎鼎的比特币挖矿芯片,它就不适合用普通的flow去做,否则power上必定是没有什么竞争力的。这本书的重点就是power gating、level shifter和retention这些和power gating及多电压域相关的知识。其实这是其中一个维度,还有一个维度是IR drop、in rush current等问题的解决。学习这本书的时候我们可以把这两个维度结合起来,相信会加深 理解。其实我们提到普通低功耗手段,最重要的是clock gating,power gating和voltage sacaling,clock gating解决动态功耗,power gating

关于华为突破美国芯片封锁英语作文

关于华为突破美国芯片封锁英语作文

关于华为突破美国芯片封锁英语作文The global technology landscape has been shaped by a complex geopolitical landscape in recent years. At the forefront of this dynamic is the ongoing tension between the United States and China, particularly in the realm of technology and trade. One of the key players embroiled in this conflict is the Chinese tech giant Huawei, which has found itself at the center of a high-stakes battle over the control of critical technologies.Huawei's rise to prominence in the global technology industry has been nothing short of remarkable. The company has established itself as a leading provider of telecommunications equipment, smartphones, and a wide range of other digital products and services. Its success, however, has not come without challenges, as the US government has taken a hardline stance against the company, citing national security concerns.The US-Huawei conflict began in 2018 when the Trump administration placed Huawei on the Entity List, effectively banning American companies from doing business with the Chinese firm. Thismove was a significant blow to Huawei, as it cut off the company's access to critical technologies, including the Android operating system and the chipsets that power its devices.Undeterred by these setbacks, Huawei has embarked on a determined effort to overcome the US-imposed restrictions. The company has invested heavily in research and development, focusing on the development of its own proprietary technologies and solutions. This includes the creation of its own operating system, HarmonyOS, as well as the development of its own line of Kirin chipsets, which are designed to power its smartphones and other devices.One of Huawei's most significant breakthroughs in this regard has been the development of its Kirin 9000 chipset, which was unveiled in 2020. This chip is a testament to Huawei's technological prowess, as it is designed to rival the best offerings from industry giants like Qualcomm and Apple. The Kirin 9000 is a powerful and energy-efficient processor that is capable of supporting advanced features such as 5G connectivity, high-performance computing, and cutting-edge AI-powered applications.The development of the Kirin 9000 chipset is particularly noteworthy because it represents Huawei's ability to overcome the US chip blockade. Prior to the US sanctions, Huawei had relied on chipsetsfrom American companies like Qualcomm and Intel to power its devices. However, with the imposition of the Entity List restrictions, Huawei was forced to find alternative solutions.The company's response has been to invest heavily in its own semiconductor research and development capabilities. This has involved the establishment of state-of-the-art chip design facilities, the recruitment of top-tier engineering talent, and the implementation of advanced manufacturing processes. The result is the Kirin 9000, a chip that not only matches the performance of its American counterparts but also offers unique features and capabilities that set it apart.The significance of Huawei's achievement with the Kirin 9000 chipset cannot be overstated. It represents a major milestone in the company's efforts to become self-sufficient and reduce its reliance on American technology. It also serves as a testament to Huawei's resilience and determination in the face of adversity.Moreover, the success of the Kirin 9000 has broader implications for the global technology landscape. It demonstrates that China is capable of developing advanced semiconductor technologies that can compete with the best in the world. This has the potential to disrupt the existing power dynamics in the tech industry, as Huawei and other Chinese companies seek to challenge the dominance ofAmerican and European tech giants.However, the US-Huawei conflict is far from over. The Biden administration has continued to maintain the sanctions against Huawei, and the company continues to face significant challenges in accessing critical technologies and components. Despite these obstacles, Huawei remains committed to its vision of becoming a global technology leader, and it is poised to continue its efforts to overcome the US chip blockade.In conclusion, Huawei's breakthrough with the Kirin 9000 chipset is a significant achievement that underscores the company's technological capabilities and its determination to overcome the US-imposed restrictions. This development has far-reaching implications for the global technology landscape, as it signals China's growing technological prowess and its ability to challenge the dominance of American tech companies. As the US-Huawei conflict continues to unfold, the world will be watching to see how this high-stakes battle plays out and what it means for the future of the global technology industry.。

如何用英语介绍华为芯片的作文

如何用英语介绍华为芯片的作文

文章标题Introducing Huawei's Chipset InnovationsHuawei, a global technology leader, has madesignificant strides in the realm of chipset development, revolutionizing the telecommunications and computing landscapes. At the heart of Huawei's technological prowess lies its cutting-edge chipsets, which power a range of devices from smartphones to networking equipment. Thisessay aims to delve into the remarkable advancements and features of Huawei's chipsets, highlighting their significance in the global technology ecosystem.Firstly, it's imperative to understand the fundamental role chipsets play in modern technology. A chipset is a set of integrated circuits designed to perform specific functions, often serving as the brain of electronic devices. Huawei's chipsets are renowned for their superior performance, efficiency, and innovation. The company's research and development teams have invested heavily in chipset technology, resulting in groundbreaking advancements.One of the most notable achievements is Huawei's HiSilicon chipset family. These chipsets are designed and manufactured in-house, allowing Huawei to have greater control over their devices' hardware and software integration. The HiSilicon chipsets are known for their high processing speeds, low power consumption, and advanced features like AI capabilities.Furthermore, Huawei's chipsets are not just limited to smartphones. The company has also made significant contributions to the networking industry with its chipset innovations. Huawei's networking chipsets are designed to provide robust and scalable solutions for data centers, enterprise networks, and telecommunications systems. These chipsets enable high-speed data transmission, improved security, and efficient resource utilization.Another noteworthy aspect of Huawei's chipsets is their adaptability and scalability. The company's chipset designs are flexible enough to be tailored to meet the specific needs of different devices and applications. Whether it's a high-end smartphone or a large-scale networking system,Huawei's chipsets can be optimized to deliver optimal performance.Moreover, Huawei's commitment to sustainability is reflected in its chipset designs. The company strives to use energy-efficient technologies and materials in its chipsets, reducing the overall carbon footprint of its devices. This commitment to environmental responsibility aligns with Huawei's broader vision of building a sustainable digital future.In conclusion, Huawei's chipsets are a testament to the company's technological prowess and innovation. They are not just powerful components that drive Huawei's devices; they are also key enablers of the global technology ecosystem. From smartphones to networking equipment, Huawei's chipsets are shaping the future of telecommunications and computing. As the company continues to invest in research and development, we can expect to see even more remarkable advancements in chipset technology from Huawei in the future.**介绍华为芯片创新**华为作为全球技术领导者,在芯片开发领域取得了重大进展,推动了电信和计算领域的革命性变革。

TI公司DSP系列概述

TI公司DSP系列概述
Automotive - EPS Battery operated precision for steering
Printer Print head control Paper path motor control
Digital Power Supply Provides control, sensing, PFC, and other functions
DSL modems Pooled modems Base station transceivers Wireless LAN Enterprise PBX Speech recognition Multimedia gateway Professional audio Networked camera Machine vision Security identification Industrial scanner High speed printer Advanced encryption
12-Bit ADC
Watchdog
GPIO
Peripheral Bus
McBSP
CAN 2.0B
SCI-A
SCI-B
SPI
Event Managers Ultra-Fast 12-bit ADC 16.7 MSPS Conversion Speed Dual s/h enable simultaneous sampling Auto Sequencer, up to 16 conversions w/o CPU
第二部分:TI DSP概述
DSP芯片产品简介
TI公司的DSP芯片概况 其它公司的DSP芯片概况 TMS320C2000概况
TI公司的DSP芯片概况
经典产品 TMS320C1X、TMS320C25、TMS320C3X/4X、TMS320C5 X、TMS320C8X 目前主流系列 TMS320C2000,用于数字化控制领域 TMS320C5000,用于通信、便携式应用领域 TMS320C6000,音视频技术、通信基站

关于芯片技术的英语作文

关于芯片技术的英语作文

关于芯片技术的英语作文英文:As a technology enthusiast, I have always been fascinated by the advancements in chip technology. Chips, also known as integrated circuits, are at the core of almost every electronic device we use today. From smartphones and laptops to cars and home appliances, chips play a crucial role in powering these devices and enabling them to perform various functions.One of the most interesting aspects of chip technology is its constant evolution. Over the years, we have witnessed the incredible shrinking of transistors and the increasing complexity of chip designs. This has led to significant improvements in performance, power efficiency, and cost reduction. For example, the transition from 14nm to 7nm process technology has allowed for smaller, more power-efficient chips that can deliver higher processing speeds.Another fascinating aspect of chip technology is its application in different industries. For instance, in the healthcare sector, chips are used in medical devices for monitoring and treatment purposes. In the automotive industry, chips are essential for powering advanced driver-assistance systems and autonomous vehicles. In the field of artificial intelligence, specialized chips called GPUs (Graphics Processing Units) are used for accelerating machine learning and deep learning algorithms.Furthermore, the impact of chip technology goes beyond just hardware. It also plays a crucial role in software development and innovation. For example, the development of more powerful chips has enabled the creation of sophisticated mobile apps, video games, and virtual reality experiences. Additionally, the integration of AI chips in smartphones has paved the way for intelligent voice assistants and image recognition capabilities.In conclusion, chip technology continues to be adriving force behind the advancement of modern society. Itsimpact can be seen in almost every aspect of our daily lives, from communication and entertainment to healthcare and transportation. As technology continues to progress, I am excited to see how chip technology will further revolutionize the world around us.中文:作为一名科技爱好者,我一直对芯片技术的进步充满着兴趣。

英语作文-集成电路设计行业的智能芯片与系统解决方案

英语作文-集成电路设计行业的智能芯片与系统解决方案

英语作文-集成电路设计行业的智能芯片与系统解决方案The semiconductor industry, particularly in the realm of integrated circuit (IC) design, has witnessed a remarkable evolution over the years. Among the forefront advancements lies the domain of smart chips and system solutions. In this article, we delve into the intricacies and innovations within the domain of intelligent chip design and its broader implications for the industry.Intelligent chips, often referred to as system-on-chips (SoCs), represent a fusion of hardware and software expertise aimed at delivering enhanced functionalities and performance. These chips integrate various components, including processors, memory, sensors, and interfaces, onto a single substrate, thus offering compactness and efficiency.One of the defining features of intelligent chips is their adaptability and programmability. Through sophisticated algorithms and firmware, these chips can dynamically adjust their behavior based on environmental conditions, user inputs, and other stimuli. This adaptability is particularly crucial in applications such as IoT devices, automotive electronics, and consumer electronics, where flexibility and responsiveness are paramount.Moreover, intelligent chips boast advanced security features to safeguard sensitive data and thwart malicious attacks. Encryption, authentication mechanisms, and secure boot protocols are integrated into the chip architecture to provide robust protection against cybersecurity threats. As data privacy concerns continue to escalate, the incorporation of stringent security measures has become indispensable across various industry sectors.Furthermore, the emergence of artificial intelligence (AI) and machine learning (ML) has propelled the capabilities of intelligent chips to unprecedented heights. By embedding neural network accelerators and dedicated hardware for AI inference tasks, these chips can perform complex computations with unparalleled speed and efficiency. This pavesthe way for innovative applications such as image recognition, natural language processing, and autonomous decision-making.In addition to standalone intelligent chips, there is a growing trend towards system-level integration and co-design. This entails the seamless integration of multiple chips and subsystems to form cohesive, synergistic systems. By optimizing the interaction between different components, designers can achieve higher performance, lower power consumption, and reduced latency, thereby unlocking new possibilities in terms of functionality and user experience.The design process for intelligent chips involves a multidisciplinary approach, encompassing aspects of electrical engineering, computer science, and materials science. Designers leverage advanced tools and methodologies, including electronic design automation (EDA) software, hardware description languages (HDLs), and simulation techniques, to model, simulate, and verify the chip's functionality prior to fabrication.Furthermore, the relentless pursuit of miniaturization and energy efficiency has led to innovations in semiconductor manufacturing technologies. From FinFET transistors to advanced packaging techniques such as 3D integration and wafer-level packaging, manufacturers are continually pushing the boundaries of what is technologically feasible. These advancements not only enable higher transistor densities and faster switching speeds but also contribute to reducing the overall cost per function, thus driving widespread adoption of intelligent chips across diverse market segments.Looking ahead, the trajectory of intelligent chip design is poised to intersect with other transformative technologies such as quantum computing, neuromorphic computing, and edge computing. As the demand for compute-intensive applications continues to escalate, the role of intelligent chips as the cornerstone of next-generation electronics becomes increasingly pronounced.In conclusion, the field of intelligent chip design represents a convergence of innovation, ingenuity, and interdisciplinary collaboration. From powering the devices we use daily to driving the next wave of technological breakthroughs, these chips serve as the bedrock upon which the digital future is built. As we navigate the complexities of aninterconnected world, the quest for ever-smarter, more efficient chips will undoubtedly remain at the forefront of technological progress.。

芯片创新重要性英语作文

芯片创新重要性英语作文

芯片创新重要性英语作文The Importance of Chip Innovation。

In recent years, the development of the chip industry has been accelerating, and the importance of chipinnovation has become increasingly prominent. Chipinnovation has a significant impact on the development of various industries, such as electronics, telecommunications, and artificial intelligence. In this essay, I will discuss the importance of chip innovation and its impact on the economy, society, and people's lives.Firstly, chip innovation is the key to technological progress. The development of new chip technology has led to the emergence of new products and services, such as smartphones, tablets, and smart homes. These products have changed people's lifestyles and improved their quality of life. For example, smartphones have become an indispensable tool for people's daily life, allowing them to communicate, work, and entertain themselves anytime and anywhere.Without the innovation of chips, these products would not exist, and people's lives would not be as convenient and comfortable as they are now.Secondly, chip innovation is a driving force for economic growth. The chip industry is a high-tech industry with a high degree of innovation and a strong driving force for economic development. The development of the chip industry can drive the upgrading of traditional industries and promote the development of emerging industries. For example, the development of the semiconductor industry in China has promoted the development of related industries, such as electronic information, new materials, and energy-saving and environmental protection industries, and has become an important pillar of the national economy.Thirdly, chip innovation is a strategic resource for national security. The chip industry is not only a high-tech industry but also a strategic industry related to national security. The development of chip technology has a direct impact on the security of a country's information, communication, and defense systems. Therefore, countriesall over the world attach great importance to the development of the chip industry and invest heavily in it. For example, the United States has launched the "National Strategy for Semiconductor Technology" to strengthen the country's competitiveness in the chip industry and maintain its technological leadership.In conclusion, chip innovation plays a vital role in promoting technological progress, driving economic growth, and ensuring national security. The development of the chip industry should be given more attention and support from governments, enterprises, and research institutions. Only by continuously innovating and advancing the chip technology can we create a better future for ourselves and our society.。

AMDEmbeddedG-Series

AMDEmbeddedG-Series

Product BriefAMD Embedded G-Series System-on-Chip (SOC)The embedded evolution continues with x86 CPU, integrated discrete-class GPU and i/o controller on the same dieProduct Overview.The AMD Embedded G-Series SOC platform is a high-performance, low-power System-on-Chip (SOC) design, featured with enterprise-class error-correction code (ECC) memory support, dual and quad-core variants, integrated discrete-class GPU and I/O controller on the same die.The AMD G-Series SOC achieves superior performance per watt in the low-power x86 microprocessor class of products when running multiple industry standard benchmarks.1 This helps enable the delivery of an exceptional HD multimedia experience and provides a heterogeneous computing platform for parallel processing. The small-footprint, ECC-capable SOC sets the new foundation for a power-efficient platform for content-rich multimedia processing and workload processing that is well-suited for a broad variety of embedded applications.Superior Performance Per Watt.The AMD Embedded G-Series SOC platform delivers an exceptionally high-definition visual experience and the ability to take advantage of heterogeneous computing while maintaining a low-power design.• A MD G-Series SOC’s next-generation “Jaguar” based CPUoffers 113% improved CPU performance vs. AMD G-Series APU and greater than a 2x (125%) advantage vs. Intel Atom when running multiple industry-standard compute- intensive benchmarks.2• A MD G-Series SOC’s advanced GPU, supporting DirectX ® 11.1, OpenGL 4.2 and OpenCL ™ 1.23, enables parallel processing and high-performance graphics processing that provides up to 20% improvement vs. AMD G-Series APU and a 5x (430%) advantage vs. Intel Atom when running multiple industry-standard graphics-intensive benchmarks.4• E xcellent compute and graphics performance with enhanced hardware acceleration delivers up to 70% overall improvement vs. AMD G-Series APU and over 3x (218%) the overall performance advantage vs. Intel Atom in embedded applications when running multiple industry-standard compute- and graphics-intensive benchmarks.5Enabling Low-Power, Innovative Small Form Factor Designs.The AMD G-Series SOC is a small footprint and low-power solution that reduces overall system costs.• T he SOC design offers 33% footprint reduction compared to AMD G-Series APU two-chip platform 6, simplifying design with fewer board layers and simplified power supply.• A MD G-Series SOC enables fan-less design that further helps drive down system cost and enhance system reliability by eliminating moving parts.• W ith an array of performance options and universal pincompatibility across the AMD G-Series SOC portfolio, the AMD G-Series SOC platform allows OEMs to utilize a single board design to enable solutions from entry-level to high-end.• T he SOC design enables new levels of performance in small SBC (single board computer) and COMs (computer-on-modules) form factors.• A MD G-Series SOCs support Thermal Design Profiles (TDPs) from 5W to 25W, and offer dynamically configurable TDP capabilities.Optimizing Business Value.The AMD Embedded G-Series SOC platform brings performance and efficiency with desirable features, delivering lower TCO and higher ROI.• S upporting ECC memory and providing a dedicated Platform Security Processor (PSP) compatible with ARM® TrustZone, AMD G-Series SOC platforms will help to penetrate marketspreviously inaccessible to x86 products in these power envelopes, at this price point.• T he AMD G-Series SOC helps achieve higher system quality, reliability, and energy efficiency, which contribute to overall lower TCO.• M ultiple performance levels offer upgrade paths to protectsoftware and hardware ecosystem costs.• A MD’s commitment to long-term availability and support(5-10 years) maximizes ROI.7• T he AMD G-Series SOC platform is well-suited for low-power and high-performance designs in a broad range of markets including Industrial Control & Automation, Digital Signage, Thin Client, and Electronic Gaming Machines.• N ew AMD G-Series CPUs (no onboard GPU) provide a robust feature set including ECC and PSP, and deliver superior single threaded performance – 33% more performance per dollar than competing Intel solutions – for cost optimized storage controllers and Network Attached Storage systems.8/embedded1 T helow-powerx86microprocessorclassincludes:GX-420CA@25WTDP(scored19);GX-415GA@15W(25),GX-217GA@15W(17),GX-210HA@9W(20),G-T56N@18W(12),G-T52R@18W(7),G-T40N@9W(14),***********(19),******************(20),IntelAtomD525@13W(9),Intel Atom D2700 @ 10W (12) & Intel Celeron G440 @ 35W (5). Performance score based on an average of scores from the following benchmarks: Sandra Engineering 2011 Dhrystone ALU, Sandra Engineering 2011 Whetstone iSSE3, 3DMark® 06 (1280 x 1024), PassMark Performance Test 7.0 2D Graphics Mark, and EEMBC CoreMark Multi-thread. All systems running Windows® 7 Ultimate for Sandra Engineering, 3DMark® 06 and PassMark. All systems running Ubuntu version 11.10 for EEMBC CoreMark. All configurations used DirectX 11.0. AMD G-Series APU system configurations used iBase MI958 motherboards with 4GB DDR3 and integrated graphics. All AMD G-Series SOC systems used AMD "Larne" Reference Design Board with 4GB DDR3 and integrated graphics. Intel Atom D2700 was tested with Jetway NC9KDL-2700 motherboard, 4GB DDR3 and integrated graphics. Intel Celeron system configuration used MSI H61M-P23 motherboard with 4GB DDR3 and integrated graphics. Intel Atom N270 system configuration used MSI MS-9830 motherboard with maximum supported configuration of 1GB DDR2 (per /design/intarch/manuals/320436.pdf,) and Intel GM945 Intel Atom D525 used MSI MS-A923 motherboard with platform integrated 1GB DDR3 and integrated graphics.2 A MD GX-415GA scored 209, AMD G-T56N scored 98, and Intel Atom D525 scored 93, based on an average of Sandra Engineering 2011 Dhyrstone, Sandra Engineering 2011 Whetstone and EEMBC CoreMark Multi-thread benchmark results. AMD G-T56N system configuration used iBase MI958 motherboard with 4GB DDR3 and integrated graphics. AMD GX-415GA system configuration used AMD "Larne" Reference Design Board with 4GB DDR3 and integrated graphics. Intel Atom D525 system configuration used MSI MS-A923 motherboard with platform integrated 1GB DDR3 and integrated graphics. All systems running Windows® 7 Ultimate for Sandra Engineering and Ubuntu version 11.10 for EEMBC CoreMark.3 OpenCL 1.2 currently supported in the following operating systems: Microsoft Windows 7; Microsoft Windows Embedded Standard 7; Microsoft Windows 8; Microsoft Windows Embedded Standard 8; Linux(Catalyst drivers). OpenGL 4.2 currently supported in the following operating systems: Microsoft Windows 7; Microsoft Windows Embedded Standard 7; Microsoft Windows 8; Microsoft Windows Embedded Standard 8; Linux(Catalyst drivers). Ongoing support options TBA.4 A MD GX-415GA scored 864, AMD G-T56N scored 724, and Intel Atom D525 scored 162, based on an average of 3DMark® 06 1280x1024 and PassMark Performance Test 7.0 2D Graphics Suite benchmark results. AMD G-T56N system configuration used iBase MI958 motherboard with 4GB DDR3 and integrated graphics. AMD GX-415GA system configuration used AMD "Larne" Reference Design Board with 4GB DDR3 and integrated graphics. Intel Atom D525 system configuration used MSI MS-A923 motherboard with platform integrated 1GB DDR3 and integrated graphics. All systems running Windows®7 Ultimate with DirectX 11.0.5 A MD GX-415GA scored 369, AMD G-T56N scored 218, and Intel Atom D525 scored 116, based on an average of Sandra Engineering 2011 Dhrystone ALU, Sandra Engineering 2011 Whetstone iSSE3, 3DMark® 06 (1280 x 1024), PassMark Performance Test 7.0 2D Graphics Mark, and EEMBC CoreMark Multi-thread. AMD G-T56N system configuration used iBase MI958 motherboard with 4GB DDR3 and integrated graphics. AMD GX-415GA system configuration used AMD "Larne" Reference Design Board with 4GB DDR3 and integrated graphics. Intel Atom D525 system configuration used MSI MS-A923 motherboard with platform integrated 1GB DDR3 and integrated graphics. All systems running Windows®7 Ultimate for Sandra Engineering, 3DMark® 06 and PassMark. All systems running Ubuntu version 11.10 for EEMBC CoreMark. All configurations used DirectX 11.0.6 A MD G-Series SOC FT3 BGA package dimension 24.5mm x 24.5mm = 600.25 mm2 SOC; AMD G-Series APU FT1 and Controller Hub two-chip platform: 19mm x 19mm + 23mm x 23mm = 890 mm2; 33% improvement 7 5-year, 7-year and 10-year support offered, depending upon the AMD product. Please contact your AMD representative for more details.8 P erformance comparison is based on the EEMBC CoreMark v1.0 benchmark. The kit price of GX-416RA is $25 and the kit price of Celeron 1037U is $25. The performance delta of 34% was calculated based on GX-416RA’s CoreMark score of 24699 and Celeron 1037U’s CoreMark score of 18461. The performance-per-$ delta of 34% was calculated based on the GX-416RA’s performance-per-$ ratio of 987.96 and 1037U’s performance-per-$ ratio of 738.44. The AMD Steppe Eagle GX-416RA used an AMD Larne development board with 4GB DDR3-1600 memory and 80GB Hitachi HDD. The Intel Celeron 1037U used a Toshiba Satellite C55-A5220 motherboard with 8GB DDR3-1600 memory and 256GB Sandisk HDD. Both systems ran Ubuntu Linux 11.1. EMB-105©2014 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD arrow logo, Radeon, and combinations thereof are trademarks of Advanced Micro Devices, Inc. DirectX and Windows are registered trademarks of Microsoft Corporation in the U.S. and/or other jurisdictions. HDMI is a trademark of HDMI Licensing, LLC. OpenCL is a trademark of Apple Inc. used by permission by Khronos. PCIe and PCI Express are registered trademarks of PCI-SIG. 3DMark is a trademark of Futuremark Corporation. All other names used in this publication are for informational purposes only and may be trademarks of their respective owners. PID: 53377C1st generation APU SOC design• I ntegrates Controller Hub functional block as well as CPU+GPU+NB • 28nm process technology, FT3 and FT3b BGA packages, 24.5mm x 24.5mm • D ual- or Quad-“Jaguar” or “Jaguar+” CPU cores with 2MB shared L2 cacheNext generation graphics core• C ompute performance (GFLOP) improvement • D irectX® 11.1 graphics supportMemory support: Single-channel DDR3• U p to 2 UDIMMs or 2 SO-DIMM DDR3-1600 @ 1.35V & 1.25V • S upport for ECC DIMMsImproved power saving features• P ower gating added to Multimedia Engine, Display Controller & NB• DDR P-states for reduced power consumptionIntegrated display outputs• S upports two simultaneous displays • S upports 4-lane DisplayPort 1.2, DVI, HDMI ™ 1.4a, Integrated VGA and Integrated eDP or 18bpp single channel LVDSUpdated I/O• F our x1 links of PCIe® Gen 2 for GPPs • O ne x4 link of PCIe Gen 2 for discrete GPU (not on lower TDPs) • 8 USB 2.0 + 2 USB 3.0• 2 SATA 2.x/3.x (up to 6Gb/s)• SD Card Reader v3.0 or SDIO controllerHIGH PERFORMANCE BOX PC WITH AMD G-SERIES SOC。

多核微处理器体系结构级功耗模型分析

多核微处理器体系结构级功耗模型分析

第50卷第7期2019年7月中南大学学报(自然科学版)Journal of Central South University(Science and Technology)V ol.50No.7Jul.2019多核微处理器体系结构级功耗模型分析陈卓1,刘畅2,侯申3,郭阳4(1.陆军研究院作战保障研究所,无锡江苏,214000;2.湖南大学信息科学与工程学院,湖南长沙,410083;3.信息工程大学基础系,河南洛阳,471003;4.国防科技大学计算机学院,湖南长沙,410083)摘要:利用FT-SHSim模拟工具平台,对主流的微处理器核心模型SMT(同步多线程,simultaneous multithreading)和MSS(适度超标量,moderate superscalar)进行建模。

采用先进CMOS工艺,在体系结构级进行功耗评估的模拟实验,得到不同微处理器结构的工艺需求和不同工艺下同微处理器结构可以实现的性能及所需的规模,为微处理器设计的早期阶段提供工艺需求与实现方法的参考价值,从而实现提高设计质量、缩短设计周期、加快设计收敛的目的。

研究结果表明:在最小线宽为22nm的工艺下,128核SMT处理器模型峰值功耗为116W,64核MSS处理器峰值功耗为161W。

关键词:多核处理器;体系结构级;峰值功耗;工艺模拟器中图分类号:TP332文献标识码:A文章编号:1672-7207(2019)07-1611-08Analysis of power model of multi-core microprocessor architectureCHEN Zhuo1,LIU Chang2,HOU Shen3,GUO Yang4(1.Institute of Combat Support,Army Academe,Wuxi214000,China;2.College of Computer Science and Electronic Engineering,Hunan University,Changsha410083,China;3.Department of Basic Courses,Information Engineering University,Luoyang471003,China;4.School of Computer,National University of Defense Technology,Changsha410083,China)Abstract:The FT-SHSim simulation tool platform was used to model the mainstream microprocessor core models SMT and ing advanced CMOS technology,the simulation experiment of power consumption evaluation at the architecture level obtained the process requirements of different microprocessor structures and the performance and scale required by the same microprocessor structure during different processes.This provided a reference value for process requirements and implementation methods for the early stages of design,improving quality,shortening cycles,and accelerating design convergence.The results show that in the22nm process of the minimum line width,the128-core SMT processor model has a peak power of116W and64-core MSS processor model has a peak power of161W.Key words:multi-core processor;architecture level;peak power consumption;process simulator随着集成电路发展到深亚微米及纳米工艺后,单片芯片上集成的晶体管数目可达几十亿个,使得高性能微处理器进入超大存储容量、众多高速IO接口的多核心时代,新型体系结构不断出现,处理能力大大提升[1−3]。

国产光刻机小作文白头翁

国产光刻机小作文白头翁

国产光刻机小作文白头翁英文回答:The domestic lithography machine is an advanced technology used in the semiconductor industry for manufacturing integrated circuits. It plays a crucial rolein the production of electronic devices such as smartphones, computers, and other high-tech gadgets. This machine uses light to transfer circuit patterns onto silicon wafers, which are then processed to create the intricate circuitry needed for electronic components.The domestic lithography machine has several advantages. Firstly, it offers high precision and accuracy in pattern transfer, ensuring that the circuit patterns are reproduced with utmost fidelity. This is essential for the successful fabrication of integrated circuits, as even the smallest deviation can lead to device failure. Secondly, it has a high throughput, allowing for the rapid production of large quantities of chips. This is particularly important in thefast-paced semiconductor industry, where time-to-market is crucial. Lastly, the domestic lithography machine is cost-effective compared to its international counterparts. This affordability makes it accessible to a wider range of manufacturers, promoting the growth of the domestic semiconductor industry.Despite its advantages, the domestic lithography machine also faces some challenges. One of the main challenges is the need for continuous innovation and improvement to keep up with the ever-evolving semiconductor industry. As technology advances and the demand for smaller and more powerful chips increases, the lithography machine must adapt to meet these requirements. This requires substantial investments in research and development, as well as collaboration with other industry players. Another challenge is the competition from international manufacturers who have established a strong foothold in the market. These manufacturers have a long history of expertise and resources, making it difficult for domestic manufacturers to compete on a global scale.To overcome these challenges, domestic lithography machine manufacturers need to focus on research and development, innovation, and collaboration. By investing in cutting-edge technologies and continuously improving their machines, they can stay ahead of the competition and meet the demands of the semiconductor industry. Collaboration with other industry players, such as semiconductor design companies and chip manufacturers, can also help in creating a synergistic ecosystem that fosters growth and innovation.In conclusion, the domestic lithography machine is a critical technology in the semiconductor industry, enabling the production of integrated circuits used in electronic devices. It offers high precision, high throughput, and cost-effectiveness. However, it also faces challenges such as the need for continuous innovation and competition from international manufacturers. By focusing on research and development, innovation, and collaboration, domestic manufacturers can overcome these challenges and thrive in the global semiconductor market.中文回答:国产光刻机是半导体行业中使用的先进技术,用于制造集成电路。

核心技术攻关英语作文

核心技术攻关英语作文

核心技术攻关英语作文下载温馨提示:该文档是我店铺精心编制而成,希望大家下载以后,能够帮助大家解决实际的问题。

文档下载后可定制随意修改,请根据实际需要进行相应的调整和使用,谢谢!并且,本店铺为大家提供各种各样类型的实用资料,如教育随笔、日记赏析、句子摘抄、古诗大全、经典美文、话题作文、工作总结、词语解析、文案摘录、其他资料等等,如想了解不同资料格式和写法,敬请关注!Download tips: This document is carefully compiled by theeditor. I hope that after you download them,they can help yousolve practical problems. The document can be customized andmodified after downloading,please adjust and use it according toactual needs, thank you!In addition, our shop provides you with various types ofpractical materials,such as educational essays, diaryappreciation,sentence excerpts,ancient poems,classic articles,topic composition,work summary,word parsing,copyexcerpts,other materials and so on,want to know different data formats andwriting methods,please pay attention!In today's rapidly evolving world, technological advancements play a crucial role in shaping our lives. Oneof the key areas where these advancements are being focused on is core technology research and development. This field encompasses various aspects such as artificial intelligence, big data analytics, and quantum computing, to name a few. The importance of core technology research cannot be overstated as it drives innovation, improves efficiency,and enables breakthroughs in various industries.Artificial intelligence, or AI, has emerged as a game-changer in recent years. It involves the development of intelligent machines that can perform tasks that typically require human intelligence. AI has the potential to revolutionize industries such as healthcare, finance, and transportation. For example, AI-powered robots can assistin surgeries, AI algorithms can analyze financial data to predict market trends, and self-driving cars can navigate roads using AI technology. The possibilities are endless,and core technology research is vital in unlocking the full potential of AI.Another area of focus in core technology research is big data analytics. With the exponential growth of data in today's digital world, the ability to extract meaningful insights from vast amounts of data has become crucial. Big data analytics involves the use of advanced algorithms and tools to analyze, interpret, and visualize large datasets. This technology has transformed industries such as marketing, healthcare, and cybersecurity. For instance, companies can use big data analytics to understand consumer behavior and tailor their marketing strategies accordingly. In healthcare, big data analytics can help identify patterns and trends to improve patient outcomes. Core technology research in this field is essential in developing more efficient and accurate data analysis techniques.Quantum computing is another area that holds immense potential for the future. Unlike classical computers that use bits to store and process information, quantumcomputers use quantum bits, or qubits, which can exist in multiple states simultaneously. This enables quantum computers to perform complex calculations at a much faster rate than classical computers. Quantum computing has the potential to revolutionize fields such as cryptography, optimization, and drug discovery. For example, quantum computers can break complex encryption codes, optimize supply chain logistics, and accelerate the discovery of new drugs. Core technology research is crucial in advancing the capabilities of quantum computing and making it more accessible to industries.In conclusion, core technology research plays a pivotal role in driving innovation and enabling breakthroughs in various industries. Whether it is artificial intelligence, big data analytics, or quantum computing, these advancements have the potential to transform the way welive and work. It is through continuous research and development in these fields that we can unlock the full potential of technology and shape a better future.。

一种多核远程重构控制器的设计与实现

一种多核远程重构控制器的设计与实现

一种多核远程重构控制器的设计与实现朱丹;王家宁;朱玙骅【摘要】利用可编程片上系统构建多任务远程可重构控制器.控制器运用非对称多核架构、片上双RAM通信区、多任务相互监控、扩展TFTP服务器等方法,保证控制任务的实时性,实现硬软件的远程重构和故障的自主恢复.基于NIOS Ⅱ,论述系统设计的总体思路和实现方法,在实际的控制系统中进行验证,取得了良好的结果.%This paper constitutes a multi-task remote reconfigurable field controller based on SOPC technology.By using the methods of asymmetric multi-core architecture, on-chip dual RAM communications areas, mutual monitor between multi-tasks and extended TFTP server, the controller ensures the operation of real-time tasks.The controller also achieves remote reconfiguration of hardware and software and failure self-recovery.It describes the overall design and implementaOon method of this multi-core reconfigurable controller based on NIOS II.It has been verified in the actual control system and very good results are obtained.【期刊名称】《计算机工程》【年(卷),期】2011(037)009【总页数】3页(P254-256)【关键词】可编程片上系统;NIOSⅡ软核;多核控制器;故障恢复【作者】朱丹;王家宁;朱玙骅【作者单位】南京邮电大学计算机学院,南京,210003;中国科学院国家天文台南京天文光学技术研究所,南京,210042;南京邮电大学通信与信息工程学院,南京,210003【正文语种】中文【中图分类】TP3911 概述在控制点多、分布范围广的大型控制系统中,主控计算机加现场控制器的分布式控制方案已被广泛应用。

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HiBRID-SoC:A Multi-Core System-on-Chip Architecture for Multimedia SignalProcessing ApplicationsHans-Joachim Stolberg,Mladen Berekovic,Lars Friebe,S¨o ren Moch,Sebastian Fl¨u gel, Xun Mao,Mark B.Kulaczewski,Heiko Klußmann,and Peter PirschInstitut f¨u r Mikroelektronische Systeme,Universit¨a t HannoverAppelstr.4,30167Hannover,Germanystolberg@ims.uni-hannover.deAbstractThe HiBRID-SoC multi-core system-on-chip targets a wide range of applicationfields with particularly high processing demands,including general signal processing applications,video and audio de-/encoding,and a combi-nation of these tasks.For this purpose,the HiBRID-SoC integrates three fully programmable processors cores and various interfaces onto a single chip,all tied to a64-Bit AMBA AHB bus.The processor cores are individually opti-mized to the particular computational characteristics of dif-ferent applicationfields,complementing each other to de-liver high performance levels with highflexibility at reduced system cost.The HiBRID-SoC is fabricated in a0.18µm 6LM standard-cell technology,occupies about82mm2,and operates at145MHz.1.IntroductionThe tremendous progress in VLSI technology allows the integration of an ever-increasing number of transistors on a single chip.Likewise,continuous improvements in al-gorithm research enable increasingly sophisticated multi-media applications,demanding a steadily rising amount of processing power.Due to the high innovation rate in this field,the development and standardisation process of multi-media applications is characterized by rapid changes in the algorithms and tools used.One example is the MPEG-4 video coding standard[1]of the Moving Picture Experts Group(MPEG),which has been introduced in1999with the Simple Profile,followed by—among others—the Ad-vanced Simple Profile(ASP)in2001,and its successor, MPEG-4part10or Advanced Video Coding(A VC),sched-uled for2003.In total,more than10video profiles have been defined since1999within MPEG-4for various appli-cation targets employing numerous algorithm options[2].While the technological progress generally offers the po-tential to keep pace with the growing processing demands, the suitability of an implementation for advanced multime-dia processing is determined by the architectural concept employed,i.e.,how the transistors are actually spent on the chip.In the era of system-on-chip(SoC),multiple process-ing units can be integrated together with an extensive choice of interface modules on a single chip.In order to meet the demands of multimedia signal processing applications, however,an SoC must provide,in addition to a high level of arithmetic processing power,a sufficient degree offlexibil-ity,integrate a powerful on-chip communication structure, and employ a well-balanced memory system to account for the growing amount of data to be handled when targeting higher-quality applications,e.g.,in the area of video.Existing approaches are either narrowly focused on a specific set of algorithm options,such as dedicated chips for the MPEG-4Simple Profile[3],or consists of a very general processing core[4]without specialization towards particular properties of the targeted algorithm class,poten-tially lacking processing performance for schemes with spe-cial processing demands.An extension of a programmable core with dedicated modules,as,e.g.,in the Trimedia[5], does not help when the functions that have been hard-wired change in a new version of a multimedia standard.The HiBRID-SoC multi-core system-on-chip architec-ture,developed at the University of Hannover,combines high processing power for multimedia schemes with high flexibility due to full software programmability.With three specifically adapted programmable cores on a single chip, various on-chip memory modules,and a64-Bit AMBA AHB system bus,the HiBRID-SoC provides a versatile so-lution for stationary or mobile multimedia applications such as MPEG-4video up to full TV resolution,surveillance ap-plications including object recognition and coding,or on-board data processing for reconnaissance applications.For future developments,the HiBRID-SoC serves as an exten-sible platform where components may easily be exchanged for customization towards particular applicationfields.In the following section,the architecture of the program-mable multi-core SoC is presented in more detail,includ-ing an overview of the three programmable cores and their software development environment.Section3describes the design and test methodology employed.Implementation re-sults of the chip and performance results for typical appli-cations are presented in Section4,and Section5concludes the paper.2.HiBRID-SoC Architecture OverviewThe main components of the HiBRID-SoC,the three programmable cores,are each adapted towards a specific class of algorithms.The combination of the cores in an SoC design methodology has placed particular demands on the architectural concept of the chip as well as on the software development environment.2.1.Multi-Core SoC ArchitectureWith the rapid development cycles in today’s multimedia algorithm research,programmability is a key requirement for a versatile platform designed to follow new generations of multimedia applications and standards.With program-mable cores,several different algorithms can be executed on the same hardware,and the functionality of a specific system can be easily upgraded by a change in software.Multi-core SoCs are attractive candidate architectures for multimedia processing as multimedia schemes in gen-eral can be partitioned in stream oriented,block oriented, and DSP oriented functions,which can all be processed in parallel on different cores.Each core can be adapted to-wards a specific class of algorithms,and individual tasks can be mapped efficiently to the most suitable core.In general,different approaches exists to accelerate exe-cution on programmable processors.In most cases,some kind of parallelization technique is employed on instruc-tion level(e.g.,very long instruction word,VLIW),data level(e.g.,single instruction multiple data,SIMD),or on task level(e.g.,simultaneous multithreading).Another very powerful means to accelerate multimedia processing is to adapt programmable processors to specific algorithms by introducing specialized instructions for frequently occur-ring operations of higher complexity[6].The HiBRID-SoC multi-core architecture,shown in Fig-ure1,comprises three programmable cores that have each been specifically optimized towards a particular class of algorithms by employing different architectural strategies. The HiPAR-DSP is a16-datapath SIMD processor core controlled by a four-issue VLIW and is particularly opti-mized towards high-throughput two-dimensional DSP-style processing,such as FFT-intensive applications orfiltering. The second core,the Stream Processor(SP),consists of a scalar32-Bit RISC architecture that is more optimized to-wards control-dominated tasks such as bitstream processing or global system control with a particular focus on high-level language programmability.The Macroblock Proces-sor(MP),finally,has been designed specifically for the effi-cient processing of data blocks or macroblocks that are typ-ical for many video coding schemes.It has a heterogeneous data path structure consisting of a scalar and a vector unit controlled by a dual-issue VLIW,offersflexible subword parallelism,and contains instruction set extensions for typ-ical video processing computation steps.Figure1.HiBRID-SoC multi-core architecture.A64-bit AMBA AHB system bus[7]connects all cores to off-chip SDRAM memory via a64-Bit SDRAM inter-face,to two versatile32-Bit host interfaces for access,e.g., to a host PC via PCI,and to serialflash memory for stand-alone applications.While the system bus operates at full in-ternal clock frequency,the SDRAM and host interfaces sup-port a programmable internal-to-external clock ratio in or-der to facilitate adaptation to various system environments. The direct exchange of data and control information be-tween the programmable cores without placing a burden on the system bus is supported by three dual-port shared mem-ories.Based on the standardized AMBA system bus,the ar-chitectural concept of the HiBRID-SoC follows a platform approach where individual cores may be exchanged for cus-tomization;another core may be added for additional func-tionality,or a core may be removed if not required for in-creased silicon efficiency.2.2.HiPAR-DSPThe HiPAR-DSP is a highly parallel DSP core with a VLIW-controlled SIMD architecture,which has been previ-ously developed at our institute[8].Figure2shows a block diagram of the HiPAR-DSP.The core consists of16identi-cal16-Bit data paths(DP0–DP15),each of which contains a local registerfile,an ALU,a shift/round unit and a16/36-Bit multiply/accumulate unit.A data path can process two 32-Bit instructions in parallel.Depending on local status flags,a data path can also ignore the current instruction(Au-tonomous SIMD).Each data path has its own local cache memory(LC)for autonomous random access of local data.2P2PFigure2.HiPAR-DSP architecture.A shared on-chip memory,called Matrix Memory,al-lows concurrent accesses of all data paths in matrix-shaped access patterns.This memory concept provides an easy data exchange between the data paths,which is required for manyfilter and image processing algorithms.The HiPAR-DSP is controlled by a global control unit, which has its own local registerfile and ALU.It is used for global control operations like address calculation,loops,or branches.Furthermore,the controller fetches the128-Bit VLIW from the instruction cache and broadcasts the arith-metic instructions to all data paths.An autonomously operating DMA unit serves all cache misses and performs data prefetch transfers to the ma-trix memory.The DMA unit is connected directly to the AMBA AHB bus and the dual-port memories connecting the HiPAR-DSP with the MP and the SP.At the targeted clock frequency of145MHz,the HiPAR-DSP achieves a performance of2.3GMACs,making it a versatile processor for all kind of applications with high nu-merical processing demands.2.3.Stream Processor(SP)The SP has been optimized for high-level programmabil-ity and efficient processing of control-driven applications.It has a Harvard architecture with a32-Bit data path consisting of5pipeline stages and controlled by32-Bit RISC instruc-tions.The SP supports conditional execution,forwarding, interlocks,and provides full interrupt capability.Independent caches are used for instructions and data, each4kByte large with4-way set associativity.They con-vert the64-Bit AMBA bus width to the32-Bit internal width.Both caches share a memory protection unit which can distinguish up to eight regions in the address space.The data cache also performs the memory mapping for the ac-cess of the inter-core dual-port memories.2.4.Macroblock Processor(MP)The MP has a heterogeneous data path structure consist-ing of a scalar and a vector data path,as shown in Fig-ure3.The scalar data path operates on32-Bit data words in a32-entry registerfile and provides control instructions such as jump,branch,and loop.The vector data path is equipped with a64-entry registerfile of64-Bit width.Spe-cial function units(SFU)provide instruction set extensions for common video and multimedia core algorithms.The 64-Bit-wide arithmetic execution units in the vector path, e.g.,MUL/MAC or ALU,incorporate SIMD-style subword parallelism by processing either two32-Bit,four16-Bit,or eight8-Bit data entities in parallel within a64-Bit register operand.The MUL/MAC unit even delivers a128-Bit result by writing back two64-Bit registers,thus preserving the full precision of the computed result.This way four16-Bit mul-tiplications with32-Bit accumulation can be performed in parallel.Originally,SIMD-style processing of data types packed into a single word assumes the same operation to be ap-plied uniformly to all data items.Whenever subword data items are to be treated differently,program execution has to be serialized,resulting in a loss of performance.This lim-itation was removed by the introduction offield-wise con-ditional execution in the MP which allows to sustain the SIMD scheme even for data-dependent processing.With its powerful andflexible support for subword parallelism,the vector data path is particularly suited to process the repet-itive operations of typical macroblock algorithms at high throughput.The MP’s parallel data paths are controlled by a dual-issue64-Bit VLIW.By default,thefirst slot’s instruction is issued to the vector path,and the second one is issued to the scalar path,enforcing parallel execution.However,also two vector or two scalar instructions can be paired within a VLIW.With four read and two write ports on the vec-tor registerfile,even two vector instructions can execute in parallel provided they do not belong to the same instruction group(i.e.,are not executed on the same hardware unit).If parallelization is not possible,the instruction decoder au-Scalar Data Path Vector Data PathFigure3.Macroblock processor data paths. tonomously serializes the execution of instructions.The flexible utilization of the VLIW minimizes the number of void instruction slots and promotes code density.Instructions and data are supplied to the MP via local memories,which are accessible within a single clock cycle. Transfers between external memory and local memories are performed in the background by the AMBA bus controller through programmed DMA as the program execution con-tinues.For the core algorithms,scalar and vector path can operate in concert to exchange blocks of video data between the local data memory and the vector registerfile without stall cycles by performing stores and loads concurrently. 2.5.Software Development EnvironmentThe processor cores provide various special architectural features.Especially the HiPAR and the MP use data paral-lelism via SIMD and splittable ALU,instruction parallelism via VLIW,and special instructions optimized for certain video and image processing algorithms.For each core,opti-mizing assemblers are available that support these features and perform code reordering,instruction scheduling,and VLIW parallelization.Based on the assemblers,C and C++ compilers have been developed for each core.The com-piler for the MP is mainly used for application controlling, whereas the most computation-intensive core algorithms are typically written in assembly language for full exploitation of all data path features.The HiPAR-DSP compiler has been extended to support matrix data types for SIMD and Matrix Memory access programming.The compiler for the SP supports the full set of features provided by the architec-ture.During the architecture definition phase of the proces-sor cores,cycle-accurate simulators have already been de-veloped and utilized for the optimization of architectural features and instruction sets.These simulators continue to be used for application development.While at the current stage the application software for each core is developed and simulated separately,integration of all simulators into a unified SoC simulator is under way.The unified simula-tion and development environment will then allow a precise simulation and profiling of AMBA bus traffic and inter-core data exchange in addition to the cycle-accurate simulation of each core.3.Design and Test Methodology3.1.Design and Verification FlowThe HiBRID-SoC features an IP-core-based design ap-proach.Modularity and reusability have been major as-pects throughout the development process.The design has a single clock domain and is fully synchronous,includ-ing all on-chip memories.All IP blocks,i.e.,all proces-sor cores,I/O interfaces,AMBA arbiter,and BIST logic were described in VHDL.For simulation,Model Technol-ogy’s ModelSim was used.The design was synthesized us-ing Synopsys’Design Compiler.A hierarchical approach without top-level optimization achieved the best results.The HiPAR-DSP core is a modified version of the HiPAR-DSP16,which has been implemented in silicon be-fore[8].It has been adapted to support the required modu-larity,e.g.,by extending the capabilities of the DMA con-troller to access the AMBA bus and the dual-port memo-ries.The MP core is the successor of a previous design[9], augmented also by an AMBA bus interface.All remaining components were new developments.For verification purposes,key software components had already been developed using the available cycle-true sim-ulators.Various applications like,e.g.,MPEG-4video de-coding on the MP and SP core,FFT and motion estima-tion on the HiPAR-DSP,and a multi-tasking operating sys-tem for the SP were simulated with the VHDL implemen-tation,and the results were compared with simulator out-puts,with previous results(for the HiPAR-DSP),or visu-ally inspected(for the MPEG-4decoder).For the verifi-cation of the AMBA AHB bus,behavioral bus master and slave models with an extensive set of properties were em-ployed.Behavioral models for externalflash memory and SDRAM served as communication partners for the corre-sponding I/O interfaces.The host interfaces were imple-mented as C models and simulated using ModelSim’s for-eign language interface(FLI).This way,the HiBRID-SoC has been successfully verified in a complete system environ-ment.In addition,a Quickturn Mercury emulation system was employed for the verification of the SP and MP cores, which enabled to run larger applications and to achieve a higher verification coverage.3.2.Memory BIST and Scan TestThe HiBRID-SoC design contains10memory wrappers with a total number of57memory modules in single-,dual-, and quad-port configurations.Built-In Self Test(BIST)logic for the memories is provided within the wrapper mod-ules.Each RAM wrapper consists of a BIST controller,one or more memory block(s),memory bypass logic,a com-parator and several multiplexers(see Figure4).Figure4.Memory wrapper with BIST.In BIST mode(bist=1)the BIST controller provides memory addresses,write data,memory control signals and reference data for the comparator.Even if several mem-ory modules are grouped together in one wrapper,only one BIST controller is used.Multiplexers in front of the memories select system mode or BIST mode input signals according to the exter-nal bist control signal.Multiplexers behind the memories prevent the propagation of uninitialized memory content in scan mode.Instead,memory bypass logic(xor gates and flipflops)is used to observe the memory input signals and to provide test patterns at the read data output in scan mode. In BIST or system mode(scan=0)the memory module output data are transferred to the read data output bus and the comparator logic.In BIST mode,the comparator asserts a fail signal if wrong data come from the memory.A special wrapper module is used for negative edge clocked RAM blocks.The multiplexers behind the mem-ories are substituted by enableflipflops,which are disabled in scan mode.Additional observationflipflops are used in-stead of the bypass logic to avoid memory shadow effects.Each BIST controller performs a March C–test,modi-fied for word-oriented memories and read disturb fault de-tection(see Table1and also[10],[11]).To test a quad-port(r/r/w/w)registerfile,the BIST con-troller state machine for dual-port(rw/rw)memories is em-ployed and a read and write port pair of the memory is used as a virtual read/write port.In thefirst step,read port A/ write port A and read port B/write port B are paired,and in the second step,read port A/write port B and read port B/write port A are used as a virtual read/write port.All tests are performed with different data background patterns in order to detect intra-word coupling faults[12]. For a16-Bit wide memory,the following patterns are used: X”0000”,X”5555”,X”3333”,X”0F0F”,X”00FF”.The full march test operation sequence is applied for all data patterns.Test time is therefore not optimized,but theTable1.March Test Operation Sequences:for1-Port Memories for2-Port(rw/rw)Memories⇓(w0:n);⇑(r0:r0,w1:r0[a+1]);⇓(w0);⇑(r1:r1,r1:r1,w0:r1[a+1]);⇑(r0,w1);⇓(r0:r0,r0:r0,w1:r0[a-1]);⇑(r1,r1,w0);⇓(r1:r1,w0:r1[a-1]);⇓(r0,r0,w1);⇑(r0:r0,r0[a+1]:w1);⇓(r1,w0);⇑(r1:r1,r1[a+1]:w0);⇑(r0)⇓(r0:r0,r0[a-1]:w1);⇓(r1:r1,r1[a-1]:w0);⇑(r0:r0)memory BIST is designed to run at full internal clock fre-quency;one complete iteration takes less than2ms.A full scan test is implemented for the BIST logic as well as for the rest of the standard-cell logic within the chip. With32scan chains and1920automatically generated test vectors,a fault coverage of more than99%is achieved.4.Implementation ResultsThe HiBRID-SoC has been implemented in a0.18µm 6LM standard-cell CMOS technology and integrates about 14million transistors on chip.The layout of the HiBRID-SoC is shown in Figure5.In total,the HiBRID-SoC oc-cupies about82mm2,with more than half of the area con-sumed by the HiPAR-DSP and its memories.MP and SP core including memories account together for about30% of the area,and the rest is occupied by the dual-port mem-ories and interfaces.The chip operates at a frequency of 145MHz with an estimated power consumption of3.5W.First performance results on selected multimedia appli-cations are already available from existing software imple-mentations,due to the early availability of cycle-accurate simulators and—for the HiPAR-DSP—proven silicon of a previous version.On the MP/SP combination,an MPEG-4ASP decoder for full TV resolution(720×576,25Hz)at bit rates of1.5–3Mbit/s has been implemented.The per-formance requirements of the relevant decoder subtasks on the MP are given in Table2.In total,around120MHz are required on the MP to perform real-time MPEG-4ASP de-coding.This application scenario is well complemented by the HiPAR-DSP,which in addition offers the opportunity to implement sophisticated motion estimation algorithms for high-compression video encoding,segmentation algorithms for object detection and tracking,or complexfiltering oper-ations for custom pre-or postprocessing steps,making the HiBRID-SoC aflexible implementation platform for a wideFigure5.Chip layout of the HiBRID-SoC.Table2.MPEG-4ASP decoder performanceon MP and SP,720×576@25Hz,1.5–3Mbit/s:Motion Compensation100.4Reconstruction 5.3Other 4.0Overall119.7range of multimedia applications.5.ConclusionsThe HiBRID-SoC provides a powerful and versatile system-on-chip solution for various kinds of multimedia signal processing applications.With its three program-mable cores adapted to different classes of algorithms,dif-ferent applications can efficiently be mapped onto this ar-chitecture.The full software programmability of all three cores facilitates to keep pace with the rapid algorithm de-velopments in thisfield.The extensible platform approach of the HiBRID-Soc allows to exchange or add additional IP cores for further customization towards specific system environments.6.AcknowledgmentsThis work was funded by the Fraunhofer Gesellschaft under contract T/F31D/1A232/P1307.The authors would like to thank Micronas GmbH for tape-out assistance. 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